WO2021057525A1 - Resonance circuit, frequency offset control method, communication device and storage medium - Google Patents

Resonance circuit, frequency offset control method, communication device and storage medium Download PDF

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Publication number
WO2021057525A1
WO2021057525A1 PCT/CN2020/115060 CN2020115060W WO2021057525A1 WO 2021057525 A1 WO2021057525 A1 WO 2021057525A1 CN 2020115060 W CN2020115060 W CN 2020115060W WO 2021057525 A1 WO2021057525 A1 WO 2021057525A1
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value
frequency offset
resonator
target
capacitance value
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PCT/CN2020/115060
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French (fr)
Chinese (zh)
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柳凯
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中兴通讯股份有限公司
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Publication of WO2021057525A1 publication Critical patent/WO2021057525A1/en

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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/02Details
    • H03B5/04Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature

Definitions

  • This application relates to the field of communications, and in particular to a resonance circuit, a frequency deviation control method, a communication device, and a storage medium.
  • the network has become an indispensable virtual substance in every family.
  • the wireless network is used to satisfy the daily Internet access to obtain some important information.
  • Wireless performance The good or bad determines the speed and quality of the Internet.
  • a wireless device with excellent performance can greatly improve the efficiency of life and work. No matter what kind of wireless communication equipment is inseparable from the reference clock, the stability of the reference clock determines the demodulation quality of the wireless signal.
  • the resonant circuit, frequency deviation control method, communication device, and storage medium provided by the embodiments of the present application.
  • An embodiment of the present application provides a resonant circuit, including: a resonator, a load capacitor circuit with a variable capacitance value connected to the resonator, a control module connected to the load capacitor circuit, and a control module connected to the load capacitor circuit.
  • the temperature collection module connected to the module; the temperature collection module is used to collect the ambient temperature value of the environment where the resonator is located; the control module is used to determine the location of the ambient temperature value according to the corresponding relationship between the temperature value and the frequency offset
  • the corresponding target frequency offset value is used as the current frequency offset value to be eliminated, and according to the corresponding relationship between the capacitance value and the frequency offset, the target capacitance value corresponding to the offset value of the target frequency offset is determined, and the load capacitance circuit is controlled
  • the capacitance value is the target capacitance value.
  • the embodiment of the present application also provides a frequency deviation control method, which is applied to the resonant circuit as described above, and the frequency deviation control method includes: collecting the environmental temperature value of the environment in which the resonator is located; and according to the temperature value and the frequency deviation Correspondence, determine the target frequency offset value corresponding to the environmental temperature value as the current frequency offset value to be eliminated, and determine the target corresponding to the target frequency offset value to cancel the target frequency offset value according to the corresponding relationship between the capacitance value and the frequency offset And control the capacitance value of the load capacitance circuit to the target capacitance value.
  • An embodiment of the present application also provides a communication device, including the resonant circuit described above.
  • the embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium stores a computer program, and the computer program can be executed by a processor to implement the steps of the frequency offset control method as described above.
  • Figure 1 is a schematic diagram of a crystal circuit in the related art
  • FIG. 2 is a schematic diagram 1 of the structure of the resonant circuit in the first embodiment of the application;
  • FIG. 3 is a schematic diagram of the second embodiment of the resonant circuit structure of the application.
  • FIG. 4 is a schematic diagram of the third embodiment of the resonant circuit structure of the first embodiment of the application.
  • FIG. 5 is a schematic diagram of the fourth embodiment of the resonant circuit structure of the first embodiment of the application.
  • FIG. 6 is a schematic flowchart of a frequency offset control method according to Embodiment 2 of this application.
  • FIG. 7 is a schematic diagram 1 of the structure of the resonant circuit according to the second embodiment of the application.
  • FIG. 8 is a schematic diagram of the second embodiment of the resonant circuit structure of the second embodiment of the application.
  • FIG. 9 is a schematic diagram of the structure of a communication device according to the third embodiment of the application.
  • the load capacitance value of the resonator can be adjusted to achieve the target frequency deviation.
  • the frequency offset value is offset, thereby eliminating the target frequency offset value generated by the resonator affected by temperature changes, avoiding the degradation of signal quality during the demodulation process, ensuring the stability and reliability of communication quality, and improving user experience satisfaction .
  • the resonant circuit in this example includes: a resonator 11, a load capacitor circuit 12 connected to the resonator 11 and a variable capacitance value, a control module 13 connected to the load capacitor circuit 12, and The temperature acquisition module 14 connected to the control module 13.
  • the temperature collection module 14 is used to collect the environmental temperature value of the environment where the resonator 11 is located.
  • the control module 13 is used to determine the target frequency offset value corresponding to the ambient temperature value as the current frequency offset value to be eliminated according to the preset corresponding relationship between the temperature value and the frequency offset, and determine the corresponding relationship between the capacitance value and the frequency offset Generate the target capacitance value corresponding to the offset target frequency offset value, and control the capacitance value of the load capacitor circuit 12 to the target capacitance value, so as to eliminate the target frequency offset value generated by the temperature change of the resonator, and prevent the signal from being demodulated
  • the degradation of quality in the process ensures the stability and reliability of communication quality, thereby enhancing user experience satisfaction.
  • the corresponding relationship between the temperature value and the frequency offset is the corresponding relationship between the temperature value of the resonator 11 and the frequency offset.
  • the frequency offset value corresponding to the resonator 11 at different temperatures can be obtained first by testing or by other means, and then the temperature value and the frequency offset value can be obtained.
  • the corresponding relationship between, and a set of first fitting curves of the corresponding relationship between temperature values and frequency deviations can be formed, and the first fitting curve can complete the frequency deviation of the corresponding resonators at different temperatures.
  • the correspondence between the capacitance value and the frequency offset is the correspondence between the load capacitance value of the resonator 11 and the frequency offset.
  • the frequency offset value of the resonator 11 corresponding to the resonator 11 under different pairs of load capacitance values can also be obtained through testing or other methods, and then the capacitance value and the frequency offset value can be obtained.
  • Correspondence and can form a second fitting curve corresponding to the capacitance value and the frequency deviation, and the second fitting curve can complete the frequency deviation of the corresponding resonator under different capacitance values.
  • the target frequency offset value generated by the resonator 11 at the current ambient temperature (also referred to as the operating temperature) of the resonator 11 can be determined; and the target frequency offset value obtained can be determined according to the obtained target frequency offset value.
  • the above-mentioned second fitting curve determines the target capacitance value of the load capacitance circuit 12, and then controls the capacitance value of the load capacitance circuit 12 to be set to the target capacitance value, thereby causing the resonator 11 to have a frequency deviation from the target due to temperature changes. Value offset to ensure the stability and reliability of communication quality.
  • control module 13 when the above-mentioned resonant circuit is provided in a communication device with a processor, the control module 13 can be implemented by, but not limited to, the processor of the communication device, and no additional chip or circuit is required. It can improve product integration, reduce costs and simplify the implementation of solutions.
  • the temperature collection module 14 can be implemented by, but not limited to, various temperature sensors. And in some examples, when a temperature sensor is integrated on the processor chip, the temperature acquisition module 14 can be implemented by, but not limited to, the temperature sensor on the processor chip. Of course, in some application scenarios, an additional temperature sensor can also be provided, and in order to ensure the accuracy of the control, the temperature sensor can be set as close as possible to the resonator 11 in physical space, so as to maximize the ambient temperature collected by the temperature sensor. The operating temperature of the resonator 11 can be characterized as accurately as possible.
  • the resonator 11 may be, but is not limited to, a quartz crystal resonator or a ceramic resonator. Quartz crystal resonators or ceramic resonators have the characteristics of stability and good anti-interference performance. Moreover, in some examples of this embodiment, the resonator 11 may be a direct plug-in resonator or a patch resonator according to specific application scenarios.
  • the structure of the load capacitor circuit 12 in this embodiment only needs to meet the following conditions: the load capacitor circuit 12 can be controlled by the control module 13 to change its capacitance value, and then change the load capacitance value of the resonator 11 to make The resonator 11 generates a frequency deviation value whose direction is opposite to the direction of the frequency deviation value generated by the influence of temperature, thereby canceling the target frequency deviation value generated by the temperature change of the resonator 11.
  • this embodiment will be described below with reference to two example implementation structures of the load capacitance circuit 12 as examples.
  • the load capacitor circuit 12 includes a variable capacitor 120 connected to the resonator 11, and an analog voltage output module 121 connected to the variable capacitor 120 and the control module 13 respectively and has a variable output voltage.
  • the capacitance value of the variable capacitor 120 changes with the change of the input voltage.
  • control module 13 is used to determine the corresponding target voltage value when the variable capacitor 120 is the target capacitance value according to the corresponding relationship between the voltage of the variable capacitor 120 and the capacitance value, and to control the output voltage of the analog voltage output module 121 The value is the target voltage value.
  • the corresponding relationship between the voltage and the capacitance value can also be obtained through testing or other methods to obtain the capacitance value corresponding to the variable capacitor 120 at different voltages, and then a third fitting of the voltage and the capacitance value can be formed. Curve, the third fitting curve can complete the corresponding capacitance values under different voltages.
  • the voltage value that the analog voltage output module 121 needs to output can be determined according to the temperature change of the environment where the resonator 11 is located to control the capacitance value of the variable capacitor 120 , Thereby completing the frequency offset compensation.
  • the analog voltage output module 121 with corresponding accuracy can be selected according to specific adjustment accuracy requirements to ensure the fineness of the output voltage to fine-tune the load capacitance.
  • the analog voltage output module 121 in this example may adopt any circuit that can output an analog voltage value to control the capacitance value of the variable capacitor 120.
  • the analog voltage output module 121 includes: a digital to analog converter (DAC) 1210 connected to the variable capacitor 120 and the control module 13 respectively, and the digital The reference voltage module 1211 to which the analog converter 1210 is connected.
  • the control module 13 may output a corresponding digital control signal to the digital-to-analog converter 1210 to control the digital-to-analog converter 1210 to output a corresponding voltage value to the variable capacitor 120, thereby accurately controlling the capacitance value of the variable capacitor 120.
  • DAC digital to analog converter
  • the load capacitor circuit 12 includes a multi-level capacitor circuit connected to the resonator 11; wherein, the multi-level capacitor circuit includes at least two parallel capacitor branches 122, and each capacitor branch 122 is provided with The control switch for connecting and disconnecting the branch is controlled; the control module 13 is used to control the control switch on the corresponding capacitor branch 122 in the multi-level capacitor circuit, so that the capacitance value of the multi-level capacitor circuit is the target capacitance value.
  • the specific number of capacitor branches 122 included in the multi-level capacitor circuit in this embodiment can be flexibly set according to specific requirements, and the capacitance value on each capacitor branch 122 can be the same, or according to requirements. Set to different.
  • different load capacitances can be switched by controlling a switch (for example, an analog switch) at different temperatures to meet the frequency offset compensation.
  • a switch for example, an analog switch
  • the control module 13 can output GPIO to control the switch position of the analog switch, thereby reducing the frequency deviation of the resonator 11 at different temperatures and ensuring the stability of the overall circuit.
  • the resonant circuit provided in this embodiment adds the function of adaptively adjusting the frequency offset to improve the overall signal transmission quality of the wireless communication device and the stability of the whole machine.
  • the core of the whole circuit of the wireless communication device is actually the stability of the resonator. If it does not vibrate, the entire circuit will not work. It can be seen that stability is very important for the resonator.
  • the frequency deviation requirements of the resonator for wireless communication equipment are not too high, but with the overall performance
  • the increase in the temperature of the main board and the change of the external temperature have high requirements on the frequency shift of the resonator.
  • the excessive drift of the resonator greatly affects the quality of the modulation signal. Excessive drift will directly lead to the signal.
  • the demodulation distortion directly affects the user’s performance.
  • the adaptive frequency compensation provided by this embodiment can automatically perform accurate frequency compensation according to temperature changes in real time, so that the adjustment can be guaranteed regardless of the environment. The reliable operation of the machine improves the satisfaction of users.
  • This embodiment provides a frequency offset control method, which can be applied to the above-mentioned resonant circuit.
  • the frequency offset control method is shown in FIG. 6, and includes:
  • S601 Collect the ambient temperature value of the environment where the resonator is located.
  • S602 According to the corresponding relationship between the temperature value and the frequency offset, determine the target frequency offset value corresponding to the ambient temperature value as the current frequency offset value to be eliminated, and according to the corresponding relationship between the capacitance value and the frequency offset, determine that the target frequency offset is generated.
  • the target capacitance value corresponding to the bias value According to the corresponding relationship between the temperature value and the frequency offset, determine the target frequency offset value corresponding to the ambient temperature value as the current frequency offset value to be eliminated, and according to the corresponding relationship between the capacitance value and the frequency offset, determine that the target frequency offset is generated.
  • the target capacitance value corresponding to the bias value According to the corresponding relationship between the temperature value and the frequency offset, determine the target frequency offset value corresponding to the ambient temperature value as the current frequency offset value to be eliminated, and according to the corresponding relationship between the capacitance value and the frequency offset, determine that the target frequency offset is generated.
  • the target capacitance value corresponding to the bias value According to the corresponding relationship between the temperature value and the frequency offset
  • S603 controls the capacitance value of the load capacitance circuit to the target capacitance value, thereby eliminating the target frequency deviation caused by the temperature change of the resonator, avoiding the degradation of the signal quality during the demodulation process, and ensuring the stability and reliability of the communication quality And improve user experience satisfaction.
  • the resonant circuit in this embodiment includes a crystal 71, a variable capacitor 72, a digital-to-analog converter DAC7210, a reference voltage chip 7211, a processor CPU73, and an integrated set in the processing
  • the temperature sensor 74 on the device 73 includes a crystal 71, a variable capacitor 72, a digital-to-analog converter DAC7210, a reference voltage chip 7211, a processor CPU73, and an integrated set in the processing
  • the temperature sensor 74 on the device 73.
  • the first fitting curve can be obtained by calculating the relationship between the temperature of the crystal 71 and the frequency offset Calculate the relationship between the frequency deviation of the crystal 71 and the temperature according to the first fitting curve, and then adjust the voltage output of the DAC7210 to compensate the relationship with the variable capacitor 72.
  • the three sets of fitting Curve the first fitting curve corresponds to the corresponding relationship between the temperature and frequency deviation of the crystal 71
  • the third fitting curve corresponds to the corresponding relationship between the output of the DAC7210 voltage and the capacitance of the variable capacitor
  • the second fitting curve corresponds to the crystal 71
  • the resonant circuit in this embodiment includes a crystal 81, a multi-stage capacitor circuit 82, a processor CPU 83, and a temperature sensor 84 integrated on the processor 83.
  • data fitting of the temperature and frequency offset of the crystal 81 may be completed to obtain the first fitting curve, and then the load capacitance and frequency offset of the crystal 81 may be fitted to obtain the second fitting curve.
  • the load capacitance that needs to be adjusted can be determined according to the temperature change of the crystal 81; specifically, the GPIO that needs to be turned on can be determined according to the temperature change to complete the load switching.
  • the frequency may be changed during the switching process.
  • This embodiment also provides a communication device. As shown in FIG. 9, it includes a processor 901, a memory 902, and a communication bus 903;
  • the communication bus 903 is used to implement a communication connection between the processor 901 and the memory 902;
  • the processor 901 may be used to execute a computer program stored in the memory 902 to implement the steps of the task data saving method in the above embodiments.
  • the communication device in this embodiment may be, but is not limited to, a set-top box, a router, or a mobile communication terminal.
  • the mobile communication terminal may be, but is not limited to, various wireless communication terminals such as computers and mobile phones.
  • This embodiment also provides a computer-readable storage medium, which is included in any method or technology for storing information (such as computer-readable instructions, data structures, computer program modules, or other data). Volatile or non-volatile, removable or non-removable media.
  • Computer-readable storage media include but are not limited to RAM (Random Access Memory), ROM (Read-Only Memory, read-only memory), EEPROM (Electrically Erasable Programmable read only memory, charged Erasable Programmable Read-Only Memory) ), flash memory or other memory technology, CD-ROM (Compact Disc Read-Only Memory), digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, Or any other medium that can be used to store desired information and that can be accessed by a computer.
  • the computer-readable storage medium in this embodiment can be used to store a computer program, and the computer program can be executed by a processor to implement the steps of the frequency offset control method of the task in the above embodiments.
  • This embodiment also provides a computer program (or computer software).
  • the computer program can be distributed on a computer-readable medium and executed by a computable device to implement the frequency offset control method in the above embodiments. At least one step; and in some cases, at least one step shown or described can be performed in a different order than described in the above-mentioned embodiments.
  • This embodiment also provides a computer program product, including a computer readable device, and any computer program as shown above is stored on the computer readable device.
  • the computer-readable device in this embodiment may include the computer-readable storage medium as shown above.
  • the resonant circuit includes a resonator, a load capacitor circuit connected with the resonator and a variable capacitance value, and a control connected with the load capacitor circuit Module, and the temperature acquisition module connected to the control module; the temperature acquisition module collects the ambient temperature value of the environment where the resonator is located; the control module determines the target frequency offset value corresponding to the ambient temperature value according to the corresponding relationship between the temperature value and the frequency offset The current frequency offset value to be eliminated, and according to the corresponding relationship between the capacitance value and the frequency offset, the target capacitance value corresponding to the offset target frequency offset value is determined, and the capacitance value of the load capacitor circuit is controlled to the target capacitance value, thereby reducing the resonator
  • the target frequency offset value generated by the influence of temperature changes is eliminated to avoid the degradation of signal quality during the demodulation process, to ensure the stability and reliability of communication quality, and to
  • the functional modules/units in the system, and the device can be implemented as software (which can be implemented by computer program code executable by a computing device. ), firmware, hardware and their appropriate combination.
  • the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may consist of several physical components. The components are executed cooperatively.
  • Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit .
  • communication media usually contain computer-readable instructions, data structures, computer program modules, or other data in a modulated data signal such as carrier waves or other transmission mechanisms, and may include any information delivery medium. Therefore, this application is not limited to any specific combination of hardware and software.

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Abstract

Provided are a resonance circuit, a frequency offset control method, a communication device and a storage medium. The resonance circuit comprises a resonator, a load capacitance circuit connected to the resonator and having a variable capacitance value, a control module connected to the load capacitance circuit, and a temperature collection module connected to the control module, wherein the temperature collection module collects an environment temperature value of the environment in which the resonator is located; and the control module determines, according to a correlation between the temperature value and frequency offset, a target frequency offset value corresponding to the environment temperature value to be the current frequency offset value to be eliminated, determines, according to a correlation between a capacitance value and the frequency offset, a corresponding target capacitance value generated for cancelling the target frequency offset value, and controls the capacitance value of the load capacitance circuit to be the target capacitance value.

Description

谐振电路、频偏控制方法、通信设备及存储介质Resonant circuit, frequency deviation control method, communication equipment and storage medium
相关申请的交叉引用Cross-references to related applications
本申请基于申请号为201910901284.4、申请日为2019年9月23日的中国专利申请提出,并要求该中国专利申请的优先权,该中国专利申请的全部内容在此以引入方式并入本申请。This application is filed based on a Chinese patent application with an application number of 201910901284.4 and an application date of September 23, 2019, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated into this application by way of introduction.
技术领域Technical field
本申请涉及通信领域,尤其涉及一种谐振电路、频偏控制方法、通信设备及存储介质。This application relates to the field of communications, and in particular to a resonance circuit, a frequency deviation control method, a communication device, and a storage medium.
背景技术Background technique
现在几乎每个家庭都拥有无线路由器、机顶盒、手机等众多的电子设备,网络成为每个家庭不可或缺的一种虚拟物质,通过无线网络来满足日常的上网来获取一些重要的资料,无线性能的好与坏决定上网速度与质量,一款性能优秀的无线设备能够大大的提高的生活与工作的效率。无论哪种无线通讯设备都离不开参考时钟,参考时钟的稳定度决定无线信号的解调质量。Now almost every family has many electronic devices such as wireless routers, set-top boxes, mobile phones and so on. The network has become an indispensable virtual substance in every family. The wireless network is used to satisfy the daily Internet access to obtain some important information. Wireless performance The good or bad determines the speed and quality of the Internet. A wireless device with excellent performance can greatly improve the efficiency of life and work. No matter what kind of wireless communication equipment is inseparable from the reference clock, the stability of the reference clock determines the demodulation quality of the wireless signal.
目前的家庭无线路由器、机顶盒等产品直接使用晶体,请参见图1中10所示的晶体,在负载位放一个电容值固定的负载电容,通过产品在出厂的时候通过常温校准将频偏补偿进去。这些产品在常温下使用时能基本满足需求,但是对于高温或者低温的工作环境下,晶体就会产生频偏,导致信号在解调过程中质量的下降,严重者无法进行解调,所表现出来的现象就是有信号却无法上网,进而直接影响上网的质量与工作的效率,导致用户体验的满意度差。Current home wireless routers, set-top boxes and other products directly use crystals. Please refer to the crystal shown in Figure 1 at 10. Place a load capacitor with a fixed capacitance at the load position. The frequency offset will be compensated through normal temperature calibration when the product leaves the factory. . These products can basically meet the demand when used at room temperature, but for high temperature or low temperature working environment, the crystal will produce frequency deviation, resulting in the degradation of the signal quality in the demodulation process. In severe cases, the demodulation cannot be performed. The phenomenon is that there is a signal but cannot access the Internet, which directly affects the quality of the Internet and the efficiency of work, resulting in poor user experience satisfaction.
发明内容Summary of the invention
本申请实施例提供的谐振电路、频偏控制方法、通信设备及存储介质。The resonant circuit, frequency deviation control method, communication device, and storage medium provided by the embodiments of the present application.
本申请实施例提供了一种谐振电路,包括:谐振器,与所述谐振器连接的、且电容值可变的负载电容电路,与所述负载电容电路连接的控制模块,以及与所述控制模块连接的温度采集模块;所述温度采集模块用于采集所述谐振器所处环境的环境温度值;所述控制模块用于根据温度值与频偏对应关系,确定出所述环境温度值所对应的目标频偏值作为当前待消除的频偏值,以及根据电容值与频偏对应关系,确定出产生抵消所述目标频偏值所对应的目标电容值,并控制所述负载电容电路的电容值为所述目标电容值。An embodiment of the present application provides a resonant circuit, including: a resonator, a load capacitor circuit with a variable capacitance value connected to the resonator, a control module connected to the load capacitor circuit, and a control module connected to the load capacitor circuit. The temperature collection module connected to the module; the temperature collection module is used to collect the ambient temperature value of the environment where the resonator is located; the control module is used to determine the location of the ambient temperature value according to the corresponding relationship between the temperature value and the frequency offset The corresponding target frequency offset value is used as the current frequency offset value to be eliminated, and according to the corresponding relationship between the capacitance value and the frequency offset, the target capacitance value corresponding to the offset value of the target frequency offset is determined, and the load capacitance circuit is controlled The capacitance value is the target capacitance value.
本申请实施例还提供了一种频偏控制方法,应用于如上所述的谐振电路,所述频偏控制方法包括:采集所述谐振器所处环境的环境温度值;根据温度值与频偏对应关系,确定出所述环境温度值所对应的目标频偏值作为当前待消除的频偏值,以及根据电容值与频偏对应关系,确定出产生抵消所述目标频偏值所对应的目标电容值,并控制所述负载电容电路的电容值为所述目标电容值。The embodiment of the present application also provides a frequency deviation control method, which is applied to the resonant circuit as described above, and the frequency deviation control method includes: collecting the environmental temperature value of the environment in which the resonator is located; and according to the temperature value and the frequency deviation Correspondence, determine the target frequency offset value corresponding to the environmental temperature value as the current frequency offset value to be eliminated, and determine the target corresponding to the target frequency offset value to cancel the target frequency offset value according to the corresponding relationship between the capacitance value and the frequency offset And control the capacitance value of the load capacitance circuit to the target capacitance value.
本申请实施例还提供了一种通信设备,包括如上所述的谐振电路。An embodiment of the present application also provides a communication device, including the resonant circuit described above.
本申请实施例还提供了一种计算机可读存储介质,所述计算机可读存储介质存储有计算机程序,所述计算机程序可被处理器执行,以实现如上所述的频偏控制方法的步骤。The embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium stores a computer program, and the computer program can be executed by a processor to implement the steps of the frequency offset control method as described above.
本申请其他特征和相应的有益效果在说明书的后面部分进行阐述说明,且应当理解,至少部分有益效果从本申请说明书中的记载变的显而易见。Other features of this application and corresponding beneficial effects are described in the latter part of the specification, and it should be understood that at least part of the beneficial effects will become apparent from the description in the specification of this application.
附图说明Description of the drawings
图1为相关技术中的晶体电路示意图;Figure 1 is a schematic diagram of a crystal circuit in the related art;
图2为本申请实施例一的谐振电路结构示意图一;2 is a schematic diagram 1 of the structure of the resonant circuit in the first embodiment of the application;
图3为本申请实施例一的谐振电路结构示意图二;3 is a schematic diagram of the second embodiment of the resonant circuit structure of the application;
图4为本申请实施例一的谐振电路结构示意图三;4 is a schematic diagram of the third embodiment of the resonant circuit structure of the first embodiment of the application;
图5为本申请实施例一的谐振电路结构示意图四;FIG. 5 is a schematic diagram of the fourth embodiment of the resonant circuit structure of the first embodiment of the application;
图6为本申请实施例二的频偏控制方法流程示意图;6 is a schematic flowchart of a frequency offset control method according to Embodiment 2 of this application;
图7为本申请实施例二的谐振电路结构示意图一;FIG. 7 is a schematic diagram 1 of the structure of the resonant circuit according to the second embodiment of the application;
图8为本申请实施例二的谐振电路结构示意图二;8 is a schematic diagram of the second embodiment of the resonant circuit structure of the second embodiment of the application;
图9为本申请实施例三的通信设备结构示意图。FIG. 9 is a schematic diagram of the structure of a communication device according to the third embodiment of the application.
具体实施方式detailed description
为了使本申请的目的、技术方案及优点更加清楚明白,下面通过具体实施方式结合附图对本申请实施例作进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本申请,并不用于限定本申请。In order to make the objectives, technical solutions, and advantages of the present application clearer, the following further describes the embodiments of the present application in detail through specific implementations in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the application, and not used to limit the application.
实施例一:Example one:
针对相关技术中晶体受温度影响所产生的频偏不能被消除的问题,本申请实施例在谐振器受温度变化影响产生目标频偏值时,可通过调整谐振器的负载电容值以将该目标频偏值进行抵消,从而将谐振器受温度变化影响所产生的目标频偏值消除,避免信号在解调过程中质量的下降,保证通信质量的稳定性和可靠性,进而提升用户体验满意度。In view of the problem that the frequency deviation caused by the temperature of the crystal in the related art cannot be eliminated, when the resonator is affected by the temperature change to produce the target frequency deviation value, the load capacitance value of the resonator can be adjusted to achieve the target frequency deviation. The frequency offset value is offset, thereby eliminating the target frequency offset value generated by the resonator affected by temperature changes, avoiding the degradation of signal quality during the demodulation process, ensuring the stability and reliability of communication quality, and improving user experience satisfaction .
为了便于理解,本实施例下面结合一种示例的谐振电路进行便于理解性的说明。请参见图2所示,该示例中的谐振电路包括:谐振器11,与谐振器11连接的、且电容值可变的负载电容电路12,与负载电容电路12连接的控制模块13,以及与控制模块13连接的温度采集模块14。温度采集模块14用于采集谐振器11所处环境的环境温度值。控制模块13用于根据预设的温度值与频偏对应关系,确定出环境温度值所对应的目标频偏值作为当前待消除的频偏值,以及根据电容值与频偏对应关系,确定出产生抵消目标频偏值所对应的目标电容 值,并控制负载电容电路12的电容值为目标电容值,从而可将谐振器受温度变化影响所产生的目标频偏值消除,避免信号在解调过程中质量的下降,保证通信质量的稳定性和可靠性,进而提升用户体验满意度。In order to facilitate understanding, the following description of the present embodiment is made for ease of understanding in conjunction with an exemplary resonant circuit. Please refer to Figure 2, the resonant circuit in this example includes: a resonator 11, a load capacitor circuit 12 connected to the resonator 11 and a variable capacitance value, a control module 13 connected to the load capacitor circuit 12, and The temperature acquisition module 14 connected to the control module 13. The temperature collection module 14 is used to collect the environmental temperature value of the environment where the resonator 11 is located. The control module 13 is used to determine the target frequency offset value corresponding to the ambient temperature value as the current frequency offset value to be eliminated according to the preset corresponding relationship between the temperature value and the frequency offset, and determine the corresponding relationship between the capacitance value and the frequency offset Generate the target capacitance value corresponding to the offset target frequency offset value, and control the capacitance value of the load capacitor circuit 12 to the target capacitance value, so as to eliminate the target frequency offset value generated by the temperature change of the resonator, and prevent the signal from being demodulated The degradation of quality in the process ensures the stability and reliability of communication quality, thereby enhancing user experience satisfaction.
本实施例中,温度值与频偏对应关系为谐振器11的温度值与频偏对应关系。在本实施例的一些示例中,针对待控制的谐振器11,可以先通过测试或通过其他方式获取到相应不同温度下,谐振器11所对应的频偏值,进而得到温度值与频偏值的对应关系,且可形成一组温度值与频偏对应关系的第一拟合曲线,该第一拟合曲线可以完成不同的温度下对应谐振器的频率偏移。In this embodiment, the corresponding relationship between the temperature value and the frequency offset is the corresponding relationship between the temperature value of the resonator 11 and the frequency offset. In some examples of this embodiment, for the resonator 11 to be controlled, the frequency offset value corresponding to the resonator 11 at different temperatures can be obtained first by testing or by other means, and then the temperature value and the frequency offset value can be obtained. The corresponding relationship between, and a set of first fitting curves of the corresponding relationship between temperature values and frequency deviations can be formed, and the first fitting curve can complete the frequency deviation of the corresponding resonators at different temperatures.
本实施例中,电容值与频偏对应关系为谐振器11的负载电容值与频偏的对应关系。针对待控制的谐振器11,也可以先通过测试或通过其他方式获取到该谐振器11在不同对负载电容值下,谐振器11所对应的频偏值,进而得到电容值与频偏值的对应关系,且可形成一电容值与频偏对应关系的第二拟合曲线,该第二拟合曲线可以完成不同的电容值下对应谐振器的频率偏移。In this embodiment, the correspondence between the capacitance value and the frequency offset is the correspondence between the load capacitance value of the resonator 11 and the frequency offset. For the resonator 11 to be controlled, the frequency offset value of the resonator 11 corresponding to the resonator 11 under different pairs of load capacitance values can also be obtained through testing or other methods, and then the capacitance value and the frequency offset value can be obtained. Correspondence, and can form a second fitting curve corresponding to the capacitance value and the frequency deviation, and the second fitting curve can complete the frequency deviation of the corresponding resonator under different capacitance values.
根据上述第一拟合曲线就可确定出谐振器11当前所处环境温度(也可称之为工作温度)下,谐振器11所产生对目标频偏值;并可根据得到的目标频偏值以及上述第二拟合曲线,确定出负载电容电路12的目标电容值,进而将负载电容电路12的电容值控制设置为该目标电容值,从而将谐振器11因温度变化而产生对目标频偏值抵消,保证通信质量的稳定性和可靠性。According to the above-mentioned first fitting curve, the target frequency offset value generated by the resonator 11 at the current ambient temperature (also referred to as the operating temperature) of the resonator 11 can be determined; and the target frequency offset value obtained can be determined according to the obtained target frequency offset value. And the above-mentioned second fitting curve determines the target capacitance value of the load capacitance circuit 12, and then controls the capacitance value of the load capacitance circuit 12 to be set to the target capacitance value, thereby causing the resonator 11 to have a frequency deviation from the target due to temperature changes. Value offset to ensure the stability and reliability of communication quality.
在本实施例的一些示例中,当上述谐振电路设置于具有处理器的通信设备中时,控制模块13可以通过但不限于该通信设备的处理器实现,而不需要额外设置芯片或电路,既能提升产品集成度,又能降低成本和简化方案的实现。In some examples of this embodiment, when the above-mentioned resonant circuit is provided in a communication device with a processor, the control module 13 can be implemented by, but not limited to, the processor of the communication device, and no additional chip or circuit is required. It can improve product integration, reduce costs and simplify the implementation of solutions.
在本实施例的一些示例中,温度采集模块14可通过但不限于各种温度传感器实现。且在一些示例中,当处理器芯片上集成设置有温度传感器时,温度采 集模块14可通过但不限于处理器芯片上的该温度传感器实现。当然,在一些应用场景中,也可额外设置温度传感器,且为了保证控制的精度,设置的温度传感器在物理空间上可尽可能靠近谐振器11,从而尽可能使得温度传感器所采集到的环境温度能尽可能准确的表征该谐振器11的工作温度。In some examples of this embodiment, the temperature collection module 14 can be implemented by, but not limited to, various temperature sensors. And in some examples, when a temperature sensor is integrated on the processor chip, the temperature acquisition module 14 can be implemented by, but not limited to, the temperature sensor on the processor chip. Of course, in some application scenarios, an additional temperature sensor can also be provided, and in order to ensure the accuracy of the control, the temperature sensor can be set as close as possible to the resonator 11 in physical space, so as to maximize the ambient temperature collected by the temperature sensor. The operating temperature of the resonator 11 can be characterized as accurately as possible.
在本实施例的一些示例中,谐振器11可为但不限于石英晶体谐振器或陶瓷谐振器。石英晶体谐振器或陶瓷谐振器具有稳定,抗干扰性能良好的特点。且在本实施例的一些示例中,可以根据具体应用场景,谐振器11可采用直插式谐振器或贴片式谐振器。In some examples of this embodiment, the resonator 11 may be, but is not limited to, a quartz crystal resonator or a ceramic resonator. Quartz crystal resonators or ceramic resonators have the characteristics of stability and good anti-interference performance. Moreover, in some examples of this embodiment, the resonator 11 may be a direct plug-in resonator or a patch resonator according to specific application scenarios.
应当理解的是,本实施例中的负载电容电路12的结构只要满足以下条件即可:负载电容电路12能被控制模块13控制而改变其电容值,进而改变谐振器11的负载电容值,使谐振器11产生方向与受温度影响而产生的频偏值方向相反的频偏值,进而将谐振器11受温度变化而产生的目标频偏值抵消。为了便于理解,本实施例下面结合负载电容电路12的两种示例实现结构为示例进行说明。It should be understood that the structure of the load capacitor circuit 12 in this embodiment only needs to meet the following conditions: the load capacitor circuit 12 can be controlled by the control module 13 to change its capacitance value, and then change the load capacitance value of the resonator 11 to make The resonator 11 generates a frequency deviation value whose direction is opposite to the direction of the frequency deviation value generated by the influence of temperature, thereby canceling the target frequency deviation value generated by the temperature change of the resonator 11. For ease of understanding, this embodiment will be described below with reference to two example implementation structures of the load capacitance circuit 12 as examples.
示例一:Example 1:
请参见图3所示,负载电容电路12包括与谐振器11连接的可变电容120,分别与可变电容120和控制模块13连接的、且输出电压值可变的模拟电压输出模块121。可变电容120的电容值随输入电压的变化而变化。As shown in FIG. 3, the load capacitor circuit 12 includes a variable capacitor 120 connected to the resonator 11, and an analog voltage output module 121 connected to the variable capacitor 120 and the control module 13 respectively and has a variable output voltage. The capacitance value of the variable capacitor 120 changes with the change of the input voltage.
在本示例中,控制模块13用于根据可变电容120的电压与电容值对应关系,确定出可变电容120为目标电容值时对应的目标电压值,并控制模拟电压输出模块121的输出电压值为目标电压值。In this example, the control module 13 is used to determine the corresponding target voltage value when the variable capacitor 120 is the target capacitance value according to the corresponding relationship between the voltage of the variable capacitor 120 and the capacitance value, and to control the output voltage of the analog voltage output module 121 The value is the target voltage value.
本实施例中,电压与电容值对应关系,也可以先通过测试或通过其他方式获取到该可变电容120在不同电压下对应的电容值,进而可形成一电压与电容值的第三拟合曲线,该第三拟合曲线可以完成不同的电压下对应的电容值。In this embodiment, the corresponding relationship between the voltage and the capacitance value can also be obtained through testing or other methods to obtain the capacitance value corresponding to the variable capacitor 120 at different voltages, and then a third fitting of the voltage and the capacitance value can be formed. Curve, the third fitting curve can complete the corresponding capacitance values under different voltages.
在本示例中,上述三条拟合曲线完成拟合后,就可以根据谐振器11所处环境的温度的变化来确定模拟电压输出模块121需要输出的电压值来控制可变电容120的电容值大小,从而完成频偏的补偿。且应当理解的是,可根据具体的调整精度要求,选择相应精度的模拟电压输出模块121以确保输出电压的精细化来微调负载电容。In this example, after the above three fitting curves are fitted, the voltage value that the analog voltage output module 121 needs to output can be determined according to the temperature change of the environment where the resonator 11 is located to control the capacitance value of the variable capacitor 120 , Thereby completing the frequency offset compensation. And it should be understood that the analog voltage output module 121 with corresponding accuracy can be selected according to specific adjustment accuracy requirements to ensure the fineness of the output voltage to fine-tune the load capacitance.
另外,应当理解的是,本示例中的模拟电压输出模块121可以采用任意能输出模拟电压值以对可变电容120的电容值进行控制的各种电路。例如,一种示例中,请参见图4所示,模拟电压输出模块121包括:分别与可变电容120和控制模块13连接的数字模拟转换器(Digital to analog converter,DAC)1210,以及与数字模拟转换器1210连接的基准电压模块1211。控制模块13可向数字模拟转换器1210输出相应的数字控制信号,以控制数字模拟转换器1210向可变电容120输出相应的电压值,从而精确的控制可变电容120的电容值。In addition, it should be understood that the analog voltage output module 121 in this example may adopt any circuit that can output an analog voltage value to control the capacitance value of the variable capacitor 120. For example, in an example, please refer to FIG. 4, the analog voltage output module 121 includes: a digital to analog converter (DAC) 1210 connected to the variable capacitor 120 and the control module 13 respectively, and the digital The reference voltage module 1211 to which the analog converter 1210 is connected. The control module 13 may output a corresponding digital control signal to the digital-to-analog converter 1210 to control the digital-to-analog converter 1210 to output a corresponding voltage value to the variable capacitor 120, thereby accurately controlling the capacitance value of the variable capacitor 120.
示例二:Example two:
请参见图5所示,负载电容电路12包括与谐振器11连接的多级电容电路;其中,多级电容电路包括至少两路并联的电容支路122,每一路电容支路122上设有用于控制该支路连通与断块对控制开关;控制模块13则用于控制多级电容电路中相应电容支路122上的控制开关,使得多级电容电路的电容值为目标电容值。且应当理解的是,本实施例中多级电容电路所包括的电容支路122的具体数量可以根据具体需求灵活设定,且各电容支路122上的电容值大小可以相同,也可根据需求设置为不同。As shown in FIG. 5, the load capacitor circuit 12 includes a multi-level capacitor circuit connected to the resonator 11; wherein, the multi-level capacitor circuit includes at least two parallel capacitor branches 122, and each capacitor branch 122 is provided with The control switch for connecting and disconnecting the branch is controlled; the control module 13 is used to control the control switch on the corresponding capacitor branch 122 in the multi-level capacitor circuit, so that the capacitance value of the multi-level capacitor circuit is the target capacitance value. And it should be understood that the specific number of capacitor branches 122 included in the multi-level capacitor circuit in this embodiment can be flexibly set according to specific requirements, and the capacitance value on each capacitor branch 122 can be the same, or according to requirements. Set to different.
在本示例中,可根据温度对于谐振器11的频率的影响来完成在不同温度下来通过控制开关(例如可以为模拟开关)来切换不同的负载电容来满足频偏的补偿,精度越高,电容支路122,开关的档位越多。且在一种示例中,控制模块13可输出GPIO控制模拟开关的开关位置,从而减小谐振器11在不同温度下的 频偏,保证整体电路的稳定性。In this example, according to the influence of temperature on the frequency of the resonator 11, different load capacitances can be switched by controlling a switch (for example, an analog switch) at different temperatures to meet the frequency offset compensation. The higher the accuracy, the higher the capacitance. The branch 122, the more the gears of the switch. And in an example, the control module 13 can output GPIO to control the switch position of the analog switch, thereby reducing the frequency deviation of the resonator 11 at different temperatures and ensuring the stability of the overall circuit.
本实施例提供的谐振电路,增加了自适应调整频偏的功能来提升无线通信设备的整体信号发射质量和整机的稳定性,无线通信设备整个电路的核心其实就是谐振器的稳定,谐振器如果不起振,整个电路都会工作不起来,可见对于谐振器而言,稳定性是很重要的,相关技术中对于无线通信设备对谐振器的频偏要求不是太高,但是随着整机性能的提升以及主板的温度和外界温度的变化对谐振器的频移要求很高,尤其在一些比较特殊的环境下,谐振器的过度漂移,非常影响调制信号的质量,过度的漂移直接会导致信号解调失真,从而直接影响用户的使用性能,通过本实施例提供的自适应频率补偿可以实时的根据温度的变化而自动的进行精确地频率补偿,从而无论在哪种环境下,都能保证整机的可靠运行,提升用户体现的满意度。The resonant circuit provided in this embodiment adds the function of adaptively adjusting the frequency offset to improve the overall signal transmission quality of the wireless communication device and the stability of the whole machine. The core of the whole circuit of the wireless communication device is actually the stability of the resonator. If it does not vibrate, the entire circuit will not work. It can be seen that stability is very important for the resonator. In related technologies, the frequency deviation requirements of the resonator for wireless communication equipment are not too high, but with the overall performance The increase in the temperature of the main board and the change of the external temperature have high requirements on the frequency shift of the resonator. Especially in some special environments, the excessive drift of the resonator greatly affects the quality of the modulation signal. Excessive drift will directly lead to the signal. The demodulation distortion directly affects the user’s performance. The adaptive frequency compensation provided by this embodiment can automatically perform accurate frequency compensation according to temperature changes in real time, so that the adjustment can be guaranteed regardless of the environment. The reliable operation of the machine improves the satisfaction of users.
实施例二:Embodiment two:
本实施例提供了一种频偏控制方法,该方法可应用于如上所述的谐振电路,该频偏控制方法请参见图6所示,包括:This embodiment provides a frequency offset control method, which can be applied to the above-mentioned resonant circuit. The frequency offset control method is shown in FIG. 6, and includes:
S601:采集谐振器所处环境的环境温度值。S601: Collect the ambient temperature value of the environment where the resonator is located.
S602:根据温度值与频偏对应关系,确定出环境温度值所对应的目标频偏值作为当前待消除的频偏值,以及根据电容值与频偏对应关系,确定出产生抵消所述目标频偏值所对应的目标电容值。S602: According to the corresponding relationship between the temperature value and the frequency offset, determine the target frequency offset value corresponding to the ambient temperature value as the current frequency offset value to be eliminated, and according to the corresponding relationship between the capacitance value and the frequency offset, determine that the target frequency offset is generated. The target capacitance value corresponding to the bias value.
S603控制负载电容电路的电容值为目标电容值,从而可将谐振器受温度变化影响所产生的目标频偏值消除,避免信号在解调过程中质量的下降,保证通信质量的稳定性和可靠性,进而提升用户体验满意度。S603 controls the capacitance value of the load capacitance circuit to the target capacitance value, thereby eliminating the target frequency deviation caused by the temperature change of the resonator, avoiding the degradation of the signal quality during the demodulation process, and ensuring the stability and reliability of the communication quality And improve user experience satisfaction.
为了便于理解,本实施例下面结合上述方法,以两种示例的具体的谐振电路为示例进行说明。In order to facilitate understanding, this embodiment will be described with two specific resonant circuits as examples in combination with the above-mentioned methods.
一种谐振电路的实现示例请参见图7所示,本实施例中的谐振电路包括晶体71,可变电容72,数字模拟转换器DAC7210,基准电压芯片7211,处理器CPU73以及集成设置在该处理器73上的温度传感器74。在本示例中,通过增 加一个DAC7210,一个可变电容72和一个基准电压芯片7211,利用CPU73中已经存在温度传感器74,可通过计算晶体71的温度与频偏的关系得出第一拟合曲线,根据第一拟合曲线来计算出晶体71的频偏与温度的关系,然后再通过调谐DAC7210的电压输出来与可变电容72的关系进行频率的补偿,本示例中通过拟合的三组曲线,第一拟合曲线对应于晶体71的温度和频偏的对应关系,第三拟合曲线对应于DAC7210电压的输出与可变电容的容值对应关系,第二拟合曲线对应于晶体71的频率的变化与负载可变电容的容值对应关系,通过三组曲线的拟合可以非常精确地将每个温度下的频率偏移做到最小,保证谐振电路在任何温度下输出的频率稳定性。An implementation example of a resonant circuit is shown in FIG. 7. The resonant circuit in this embodiment includes a crystal 71, a variable capacitor 72, a digital-to-analog converter DAC7210, a reference voltage chip 7211, a processor CPU73, and an integrated set in the processing The temperature sensor 74 on the device 73. In this example, by adding a DAC7210, a variable capacitor 72 and a reference voltage chip 7211, using the temperature sensor 74 already in the CPU 73, the first fitting curve can be obtained by calculating the relationship between the temperature of the crystal 71 and the frequency offset Calculate the relationship between the frequency deviation of the crystal 71 and the temperature according to the first fitting curve, and then adjust the voltage output of the DAC7210 to compensate the relationship with the variable capacitor 72. In this example, the three sets of fitting Curve, the first fitting curve corresponds to the corresponding relationship between the temperature and frequency deviation of the crystal 71, the third fitting curve corresponds to the corresponding relationship between the output of the DAC7210 voltage and the capacitance of the variable capacitor, and the second fitting curve corresponds to the crystal 71 The corresponding relationship between the change of the frequency and the capacitance of the load variable capacitor, through the fitting of the three sets of curves, the frequency deviation at each temperature can be very accurately minimized, and the output frequency of the resonant circuit can be stable at any temperature. Sex.
另一种谐振电路的实现示例请参见图8所示,本实施例中的谐振电路包括晶体81,多级电容电路82,处理器CPU83以及集成设置在该处理器83上的温度传感器84。在本示例中,可先完成晶体81的温度与频偏的数据拟合得到上述第一拟合曲线,然后再进行晶体81的负载电容和频偏的拟合得到上述第二拟合曲线。完成两组曲线的拟合后,可根据晶体81的温度的变化来确定需要调整的负载电容;具体可通过根据温度的变化来确定需要打开的GPIO来完成负载的切换,切换过程中频率可能会有短时间的震荡,但是只要变化不大就不会影响***整体的频率稳定度;在一些应用场景中,如果需要细分频率补偿,则可设置较多的负载电容和对应的模拟开关,每个档位之间的负载电容尽量连续,以保证在切换过程中不会出现过大的频率变化,保证***的稳定性。Refer to FIG. 8 for an implementation example of another resonant circuit. The resonant circuit in this embodiment includes a crystal 81, a multi-stage capacitor circuit 82, a processor CPU 83, and a temperature sensor 84 integrated on the processor 83. In this example, data fitting of the temperature and frequency offset of the crystal 81 may be completed to obtain the first fitting curve, and then the load capacitance and frequency offset of the crystal 81 may be fitted to obtain the second fitting curve. After the two sets of curves are fitted, the load capacitance that needs to be adjusted can be determined according to the temperature change of the crystal 81; specifically, the GPIO that needs to be turned on can be determined according to the temperature change to complete the load switching. The frequency may be changed during the switching process. There is a short-term oscillation, but as long as the change is small, the overall frequency stability of the system will not be affected; in some application scenarios, if you need to subdivide frequency compensation, you can set more load capacitors and corresponding analog switches. The load capacitance between the two gears is as continuous as possible to ensure that there will be no excessive frequency changes during the switching process and to ensure the stability of the system.
实施例三:Example three:
本实施例还提供了一种通信设备,参见图9所示,其包括处理器901、存储器902以及通信总线903;This embodiment also provides a communication device. As shown in FIG. 9, it includes a processor 901, a memory 902, and a communication bus 903;
通信总线903用于实现处理器901与存储器902之间的通信连接;The communication bus 903 is used to implement a communication connection between the processor 901 and the memory 902;
一种示例中,处理器901可用于执行存储器902中存储的算机程序,以实现如上各实施例中的任务的数据保存方法的步骤。本实施例中的通信设备可以 为但不限于机顶盒、路由器或移动通信终端,该移动通信终端可为但不限于各种电脑、手机等无线通信终端。In an example, the processor 901 may be used to execute a computer program stored in the memory 902 to implement the steps of the task data saving method in the above embodiments. The communication device in this embodiment may be, but is not limited to, a set-top box, a router, or a mobile communication terminal. The mobile communication terminal may be, but is not limited to, various wireless communication terminals such as computers and mobile phones.
本实施例还提供了一种计算机可读存储介质,该计算机可读存储介质包括在用于存储信息(诸如计算机可读指令、数据结构、计算机程序模块或其他数据)的任何方法或技术中实施的易失性或非易失性、可移除或不可移除的介质。计算机可读存储介质包括但不限于RAM(Random Access Memory,随机存取存储器),ROM(Read-Only Memory,只读存储器),EEPROM(Electrically Erasable Programmable read only memory,带电可擦可编程只读存储器)、闪存或其他存储器技术、CD-ROM(Compact Disc Read-Only Memory,光盘只读存储器),数字多功能盘(DVD)或其他光盘存储、磁盒、磁带、磁盘存储或其他磁存储装置、或者可以用于存储期望的信息并且可以被计算机访问的任何其他的介质。This embodiment also provides a computer-readable storage medium, which is included in any method or technology for storing information (such as computer-readable instructions, data structures, computer program modules, or other data). Volatile or non-volatile, removable or non-removable media. Computer-readable storage media include but are not limited to RAM (Random Access Memory), ROM (Read-Only Memory, read-only memory), EEPROM (Electrically Erasable Programmable read only memory, charged Erasable Programmable Read-Only Memory) ), flash memory or other memory technology, CD-ROM (Compact Disc Read-Only Memory), digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, Or any other medium that can be used to store desired information and that can be accessed by a computer.
在一种示例中,本实施例中的计算机可读存储介质可用于存储计算机程序,该计算机程序可被处理器执行,以实现如上各实施例中的任务的频偏控制方法的步骤。In an example, the computer-readable storage medium in this embodiment can be used to store a computer program, and the computer program can be executed by a processor to implement the steps of the frequency offset control method of the task in the above embodiments.
本实施例还提供了一种计算机程序(或称计算机软件),该计算机程序可以分布在计算机可读介质上,由可计算装置来执行,以实现如上各实施例中的频偏控制方法中的至少一个步骤;并且在某些情况下,可以采用不同于上述实施例所描述的顺序执行所示出或描述的至少一个步骤。This embodiment also provides a computer program (or computer software). The computer program can be distributed on a computer-readable medium and executed by a computable device to implement the frequency offset control method in the above embodiments. At least one step; and in some cases, at least one step shown or described can be performed in a different order than described in the above-mentioned embodiments.
本实施例还提供了一种计算机程序产品,包括计算机可读装置,该计算机可读装置上存储有如上所示的任一计算机程序。本实施例中该计算机可读装置可包括如上所示的计算机可读存储介质。This embodiment also provides a computer program product, including a computer readable device, and any computer program as shown above is stored on the computer readable device. The computer-readable device in this embodiment may include the computer-readable storage medium as shown above.
根据本申请实施例提供的谐振电路、频偏控制方法、通信设备及存储介质,谐振电路包括谐振器,与谐振器连接的、且电容值可变的负载电容电路,与负载电容电路连接的控制模块,以及与控制模块连接的温度采集模块;温度采集 模块采集谐振器所处环境的环境温度值;控制模块根据温度值与频偏对应关系,确定出环境温度值所对应的目标频偏值作为当前待消除的频偏值,以及根据电容值与频偏对应关系,确定出产生抵消目标频偏值所对应的目标电容值,并控制负载电容电路的电容值为目标电容值,从而将谐振器受温度变化影响所产生的目标频偏值消除,避免信号在解调过程中质量的下降,保证通信质量的稳定性和可靠性,进而提升用户体验满意度。According to the resonant circuit, frequency deviation control method, communication device and storage medium provided by the embodiments of the present application, the resonant circuit includes a resonator, a load capacitor circuit connected with the resonator and a variable capacitance value, and a control connected with the load capacitor circuit Module, and the temperature acquisition module connected to the control module; the temperature acquisition module collects the ambient temperature value of the environment where the resonator is located; the control module determines the target frequency offset value corresponding to the ambient temperature value according to the corresponding relationship between the temperature value and the frequency offset The current frequency offset value to be eliminated, and according to the corresponding relationship between the capacitance value and the frequency offset, the target capacitance value corresponding to the offset target frequency offset value is determined, and the capacitance value of the load capacitor circuit is controlled to the target capacitance value, thereby reducing the resonator The target frequency offset value generated by the influence of temperature changes is eliminated to avoid the degradation of signal quality during the demodulation process, to ensure the stability and reliability of communication quality, and to improve user experience satisfaction.
可见,本领域的技术人员应该明白,上文中所公开方法中的全部或某些步骤、***、装置中的功能模块/单元可以被实施为软件(可以用计算装置可执行的计算机程序代码来实现)、固件、硬件及其适当的组合。在硬件实施方式中,在以上描述中提及的功能模块/单元之间的划分不一定对应于物理组件的划分;例如,一个物理组件可以具有多个功能,或者一个功能或步骤可以由若干物理组件合作执行。某些物理组件或所有物理组件可以被实施为由处理器,如中央处理器、数字信号处理器或微处理器执行的软件,或者被实施为硬件,或者被实施为集成电路,如专用集成电路。It can be seen that those skilled in the art should understand that all or some of the steps in the methods disclosed above, the functional modules/units in the system, and the device can be implemented as software (which can be implemented by computer program code executable by a computing device. ), firmware, hardware and their appropriate combination. In the hardware implementation, the division between functional modules/units mentioned in the above description does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may consist of several physical components. The components are executed cooperatively. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit .
此外,本领域普通技术人员公知的是,通信介质通常包含计算机可读指令、数据结构、计算机程序模块或者诸如载波或其他传输机制之类的调制数据信号中的其他数据,并且可包括任何信息递送介质。所以,本申请不限制于任何特定的硬件和软件结合。In addition, as is well known to those of ordinary skill in the art, communication media usually contain computer-readable instructions, data structures, computer program modules, or other data in a modulated data signal such as carrier waves or other transmission mechanisms, and may include any information delivery medium. Therefore, this application is not limited to any specific combination of hardware and software.
以上内容是结合具体的实施方式对本申请实施例所作的进一步详细说明,不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说,在不脱离本申请构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本申请的保护范围。The above content is a further detailed description of the embodiments of the application in combination with specific implementations, and it cannot be considered that the specific implementations of the application are limited to these descriptions. For those of ordinary skill in the technical field to which this application belongs, a number of simple deductions or substitutions can be made without departing from the concept of this application, which should be regarded as falling within the protection scope of this application.

Claims (10)

  1. 一种谐振电路,包括:谐振器,与所述谐振器连接的、且电容值可变的负载电容电路,与所述负载电容电路连接的控制模块,以及与所述控制模块连接的温度采集模块;A resonant circuit includes: a resonator, a load capacitor circuit with a variable capacitance value connected to the resonator, a control module connected to the load capacitor circuit, and a temperature acquisition module connected to the control module ;
    所述温度采集模块用于采集所述谐振器所处环境的环境温度值;The temperature collection module is used to collect the environmental temperature value of the environment where the resonator is located;
    所述控制模块用于根据温度值与频偏对应关系,确定出所述环境温度值所对应的目标频偏值作为当前待消除的频偏值,以及根据电容值与频偏对应关系,确定出产生抵消所述目标频偏值所对应的目标电容值,并控制所述负载电容电路的电容值为所述目标电容值。The control module is used to determine the target frequency offset value corresponding to the ambient temperature value as the current frequency offset value to be eliminated according to the corresponding relationship between the temperature value and the frequency offset, and determine according to the corresponding relationship between the capacitance value and the frequency offset A target capacitance value corresponding to the target frequency offset value is generated, and the capacitance value of the load capacitance circuit is controlled to the target capacitance value.
  2. 如权利要求1所述的谐振电路,其中,所述控制模块为处理器,所述温度采集模块为集成在所述处理器上的温度传感器。5. The resonance circuit of claim 1, wherein the control module is a processor, and the temperature acquisition module is a temperature sensor integrated on the processor.
  3. 如权利要求1所述的谐振电路,其中,所述谐振器为石英晶体谐振器或陶瓷谐振器。The resonance circuit according to claim 1, wherein the resonator is a quartz crystal resonator or a ceramic resonator.
  4. 如权利要求1-3任一项所述的谐振电路,其中,所述负载电容电路包括与所述谐振器连接的可变电容,分别与所述可变电容和控制模块连接的、且输出电压值可变的模拟电压输出模块,所述可变电容的电容值随输入电压的变化而变化;The resonant circuit according to any one of claims 1 to 3, wherein the load capacitor circuit includes a variable capacitor connected to the resonator, which is connected to the variable capacitor and the control module respectively, and outputs a voltage A variable value analog voltage output module, the capacitance value of the variable capacitor changes with the change of the input voltage;
    所述控制模块用于根据所述可变电容的电压与电容值对应关系,确定出所述可变电容为所述目标电容值时对应的目标电压值,并控制所述模拟电压输出模块的输出电压值为所述目标电压值。The control module is configured to determine the corresponding target voltage value when the variable capacitor is the target capacitance value according to the corresponding relationship between the voltage of the variable capacitor and the capacitance value, and control the output of the analog voltage output module The voltage value is the target voltage value.
  5. 如权利要求4所述的谐振电路,其中,所述模拟电压输出模块包括:分别与所述可变电容和控制模块连接的数字模拟转换器,以及与所述数字模拟转换器连接的基准电压模块。The resonance circuit of claim 4, wherein the analog voltage output module comprises: a digital-to-analog converter connected to the variable capacitor and the control module, and a reference voltage module connected to the digital-to-analog converter .
  6. 如权利要求1-3任一项所述的谐振电路,其中,所述负载电容电路包括与所述谐振器连接的多级电容电路;3. The resonant circuit according to any one of claims 1 to 3, wherein the load capacitor circuit comprises a multi-stage capacitor circuit connected to the resonator;
    所述多级电容电路包括至少两路并联的电容支路,每一路电容支路上设有 用于控制该支路连通与断块对控制开关;The multi-level capacitor circuit includes at least two parallel capacitor branches, and each capacitor branch is provided with a control switch for controlling the connection and disconnection of the branch;
    所述控制模块用于控制所述多级电容电路中相应电容支路上的控制开关,使得所述多级电容电路的电容值为所述目标电容值。The control module is used to control the control switch on the corresponding capacitor branch in the multi-level capacitor circuit, so that the capacitance value of the multi-level capacitor circuit is the target capacitance value.
  7. 一种频偏控制方法,应用于如权利要求1-6任一项所述的谐振电路,所述频偏控制方法包括:A frequency deviation control method, applied to the resonant circuit according to any one of claims 1-6, the frequency deviation control method comprising:
    采集所述谐振器所处环境的环境温度值;Collecting the environmental temperature value of the environment where the resonator is located;
    根据温度值与频偏对应关系,确定出所述环境温度值所对应的目标频偏值作为当前待消除的频偏值,以及根据电容值与频偏对应关系,确定出产生抵消所述目标频偏值所对应的目标电容值,并控制所述负载电容电路的电容值为所述目标电容值。According to the corresponding relationship between the temperature value and the frequency offset, the target frequency offset value corresponding to the ambient temperature value is determined as the current frequency offset value to be eliminated, and according to the corresponding relationship between the capacitance value and the frequency offset, it is determined that the target frequency offset is generated. The target capacitance value corresponding to the bias value, and controlling the capacitance value of the load capacitance circuit to the target capacitance value.
  8. 一种通信设备,包括如权利要求1-6任一项所述的谐振电路。A communication device, comprising the resonance circuit according to any one of claims 1-6.
  9. 如权利要求8所述的通信设备,其中,所述通信设备为机顶盒、路由器或移动通信终端。8. The communication device according to claim 8, wherein the communication device is a set-top box, a router, or a mobile communication terminal.
  10. 一种计算机可读存储介质,其中,所述计算机可读存储介质存储有计算机程序,所述计算机程序可被处理器执行,以实现如权利要求7所述的频偏控制方法的步骤。A computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program can be executed by a processor to implement the steps of the frequency deviation control method according to claim 7.
PCT/CN2020/115060 2019-09-23 2020-09-14 Resonance circuit, frequency offset control method, communication device and storage medium WO2021057525A1 (en)

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