WO2021049714A1 - Plasma air cleaning device and system - Google Patents

Plasma air cleaning device and system Download PDF

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Publication number
WO2021049714A1
WO2021049714A1 PCT/KR2019/016247 KR2019016247W WO2021049714A1 WO 2021049714 A1 WO2021049714 A1 WO 2021049714A1 KR 2019016247 W KR2019016247 W KR 2019016247W WO 2021049714 A1 WO2021049714 A1 WO 2021049714A1
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WO
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Prior art keywords
plasma
air
air cleaning
fan
casing
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Application number
PCT/KR2019/016247
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French (fr)
Korean (ko)
Inventor
이수연
이광호
Original Assignee
주식회사 정록
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Publication of WO2021049714A1 publication Critical patent/WO2021049714A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
    • F24F8/10—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering
    • F24F8/192—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering by electrical means, e.g. by applying electrostatic fields or high voltages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/20—Casings or covers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
    • F24F8/10—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering
    • F24F8/108—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering using dry filter elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/20—Casings or covers
    • F24F2013/205—Mounting a ventilator fan therein
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F2221/00—Details or features not otherwise provided for
    • F24F2221/38—Personalised air distribution

Definitions

  • the present invention relates to a plasma air cleaning device, and more particularly, to a plasma air cleaning device that removes fine dust or harmful particles by generating plasma on an electrode such as a flexible electrode or a carbon electrode.
  • the dielectric acts as a conductor. This phenomenon is called insulation breakdown, and the current flows because the insulation property is lost due to this insulation breakdown, and this is called discharge.
  • the insulating material is a gas
  • plasma is generated by the discharge of a gas that becomes insulation breakdown, and atmospheric pressure plasma can be classified into several types according to its discharge characteristics. Among them, corona discharge, dielectric barrier discharges, and atmospheric pressure glow discharge are closely related to plasma jets.
  • an air cleaning device can be configured. Unlike the method of removing physically collected fine dust, the plasma air cleaning device is a method of chemically removing fine dust using OH groups generated by forming a plasma region, and only inorganic substances such as water or oxygen are generated even after removing the fine dust. Therefore, there is no concern about environmental pollution. Ozone is generated during the process of removing particles using plasma, but there is a widespread misconception that “ozone is harmful”, and ozone generated by plasma does not harm the human body/environment.
  • Air purifiers have a range of sizes and flow rates from low flow rates to large flow rates depending on the size of the space to be purified.
  • the contact time between the air and the plasma filter is very high.
  • the effect of the plasma filter did not appear properly due to the shortening. Due to this problem, the existing device has a plasma filter device formally and is used for advertising effect that it has a plasma filter function (the actual particle removal rate through plasma is very low, so there is no significant difference from the case without a plasma filter), and some flow rates In most cases, it is used in such a slow low flow condition, or in a large-sized device that increases the size/surface area of the plasma filter itself.
  • the problem to be solved by the present invention is to provide a plasma air cleaning device having a high particle removal rate regardless of a flow rate/flow rate in order to solve the problems of the conventional plasma air cleaning device as described above.
  • the present invention includes a casing 1 in which a predetermined internal space and an air flow path are formed; A fan (2) coupled to the inner side of the casing (1) to flow air; A control unit 3 for controlling the fan 2; And a plasma generator (4) that receives power from the control unit (3) to generate plasma and removes predetermined particles from the air flow path; A reflux space (R) is formed within a predetermined range from the plasma generator (4); A plasma air cleaning apparatus is provided, which is configured to allow contact between the plasma generating unit 4 and the air in the reflux space R a plurality of times.
  • the plasma generation unit 4 is connected to an electrode unit 31 formed to protrude from the control unit 3 by a predetermined length on one side of the control unit 3, and the plasma generation unit 4 and the control unit ( 3) A predetermined space may be formed between them.
  • the plasma generating unit 4 may be formed in the form of a plasma electrode printed in a predetermined pattern on one side of the control unit 3.
  • the fan 2 is provided with at least two intake ports for inhaling air, and at least one exhaust port 22 for discharging air, so that the air (I) from the outside of the casing 1 is provided with the fan ( 2) is sucked into the first intake port 211 and moves to the plasma generating unit 4 through the exhaust port 22, but some of the air that has moved to the plasma generating unit 4 (F) is It may be configured to be sucked back into the second intake port 212.
  • the casing (1) the inlet portion 11 through which air is introduced by the fan (2);
  • a pan casing portion 12 surrounding the outer circumferential surface of the fan 2 and configured to fix surfaces other than the intake ports 211 and 212 and the exhaust port 22 of the fan 2;
  • the pan casing portion 12 is provided with a predetermined jaw 120, and the pan casing portion 12 and the control portion 3 are coupled with the pan casing portion 12 so that the control portion 3 contacts the jaw 120.
  • An air passage 123 may be formed therebetween.
  • a primary filter 5 is provided between the inlet 11 and the fan 2;
  • the air (I) introduced from the inlet portion 11 may be configured to be introduced into the fan 2 in a filtered state.
  • control unit 3 is provided with a piezo device 32; Power input through the control unit 3 may be converted through the piezo device 32 to be output to the plasma generator 4 at a voltage of 2000V to 2500V.
  • the casing 1 may be formed to a thickness between 20mm and 50mm.
  • a plurality of plasma air cleaning devices as described above are provided; At least one side surface of the casing 1 is provided with a module connector 33 for connecting a plurality of plasma air cleaning devices to share power with each other; An external fan 7 is connected to one side of the plasma air cleaning assembly 1 ′ to which a plurality of plasma air cleaning devices are coupled through the module connection 33; A plasma air cleaning system is provided.
  • a casing 1 in which a predetermined internal space and an air flow path are formed;
  • a control unit 3 provided inside the casing 1 and connected to a power source for generating plasma;
  • a plasma air cleaning module including a plasma generating unit 4 that receives power from the control unit 3 and generates plasma to remove predetermined particles that have entered through the air flow path;
  • At least one side surface of the casing 1 is provided with a module connector 33 for connecting a plurality of plasma air cleaning modules to share power with each other;
  • An external fan 7 is connected to one side of the plasma air cleaning assembly 1'to which a plurality of plasma air cleaning modules are combined through the module connection part 33;
  • a plasma air cleaning device is provided.
  • an air cleaning device having a high pollutant filter rate is constructed even in a system with a large flow rate or a small size by generating a reflux (vortex) around the plasma generating unit to increase the number of contact between the pollutant and the plasma filter. can do.
  • some of the filtered air may be re-inspired and introduced into the plasma generating unit again, thereby filtering the once inhaled air several times to increase filtering efficiency.
  • the air cleaning device is configured to be modularized, the same module can be used universally from a personal portable air cleaning device to an industrial air cleaning device, so that mass productivity can be improved.
  • the load applied to the plasma filter is reduced, and the resorption rate and the number of recirculation are increased by appropriately controlling the flow rate/flow rate through the HEPA filter. It can improve the pollutant removal rate.
  • control unit including a piezo device
  • heat generated by continuous use of the plasma device is cooled with inhaled air, thereby improving the sustained use time and durability of the device.
  • FIG. 1 is an exploded perspective view of a plasma air cleaning apparatus according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of a plasma air cleaning apparatus according to an embodiment of the present invention.
  • FIG 3 is a view showing in detail a control unit of the plasma air cleaning apparatus according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a plasma air cleaning system according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a cross-section A-A of FIG. 2.
  • FIG. 6 is a view comparing the air flow path of the plasma air cleaning device (b) according to an embodiment of the present invention and the conventional plasma air cleaning device (a).
  • FIG. 7 is a view comparing the amount of pollutant filtering between the plasma air cleaning device (b) according to an embodiment of the present invention and the conventional plasma air cleaning device (a).
  • FIG. 8 is a rear view of a control unit of a plasma air cleaning apparatus according to another embodiment of the present invention.
  • expressions such as “A or B,” “at least one of A or/and B,” or “one or more of A or/and B” may include all possible combinations of the items listed together.
  • “A or B,” “at least one of A and B,” or “at least one of A or B” includes (1) at least one A, (2) at least one B, Or (3) it may refer to all cases including both at least one A and at least one B.
  • first,” “second,” “first,” or “second,” used in this document can modify various elements regardless of their order and/or importance, and It is used to distinguish it from other components and does not limit the components.
  • a first user device and a second user device may represent different user devices regardless of order or importance.
  • a first component may be referred to as a second component, and similarly, a second component may be renamed to a first component.
  • Some component eg, the first component
  • another component eg, the second component
  • connected it should be understood that the certain component may be directly connected to the other component or may be connected through another component (eg, a third component).
  • a component eg, a first component
  • the component and the It may be understood that no other component eg, a third component exists between the different components.
  • a processor configured (or configured) to perform A, B, and C means a dedicated processor (eg, an embedded processor) for performing the operation, or by executing one or more software programs stored in a memory device.
  • a generic-purpose processor eg, a CPU or an application processor
  • a casing in which a predetermined internal space and an air flow path are formed;
  • a fan coupled to the inner side of the casing to flow air;
  • a control unit for controlling the fan;
  • a plasma generator configured to generate plasma by receiving power from the control unit to remove predetermined particles entering through an air flow path;
  • a reflux space is formed within a predetermined range from the plasma generating unit; It provides a plasma air cleaning apparatus configured to allow a plurality of contact between the plasma generating unit and the air in the reflux space.
  • the reflux may refer to a flow of air that contacts the plasma generating unit to re-contact the air from which contaminants have been removed once with the plasma generating unit.
  • Examples of reflux are vortex, eddy current, turbulence, turbulence, or turbulence generated within a predetermined range, or re-intake (F) air with a fan to return to the plasma generating unit together with the intake air (I).
  • F re-intake
  • the reflux space may be formed with a vortex generating member that disturbs air flow, such as a spiral blade, inside the casing.
  • the contact between the air and the plasma generating unit may occur multiple times in a form (protrusion formed in a predetermined pattern inside the casing) such as causing the air to flow back or collide with the vortex generating member near the outlet of the air.
  • the plasma generation unit may be connected to an electrode unit formed to protrude from the control unit by a predetermined length on one side of the control unit, so that a predetermined space may be formed between the plasma generation unit and the control unit.
  • the plasma generating unit and the control unit may be included in the reflux space, and vortex/turbulence may be formed while the re-inhaled air collides with the plasma generating unit and the control unit.
  • a plurality of circulation holes 40 are perforated in the plasma generation unit, and re-intake of air and generation of eddy currents may be promoted through the circulation holes.
  • re-intake of air and generation of eddy currents may be promoted through the circulation holes.
  • by increasing the surface area of the plasma generating unit through the circulation hole it is possible to increase the pollutant removal rate when contacting air once.
  • a flexible electrode can be applied to the plasma generator.
  • the surface area in contact with the air can be greatly increased.
  • a "c(C, U)" form in which a flexible electrode is bent once, a " ⁇ ( ⁇ , S)” form in which a flexible electrode is bent twice, etc. are possible, and other forms of the flexible electrode are Those skilled in the art will be able to make changes with reference to the specification of the present invention.
  • the flexible electrode includes: a first electrode and a second electrode formed to be spaced apart from each other; A dielectric material provided between the first electrode and the second electrode to insulate the first electrode and the second electrode;
  • the first electrode may have a circular cylinder shape in which a through hole is formed, and the second electrode may include a plasma electrode module composed of a circular plate.
  • the plasma electrode module may be flexibly deformed like a thread, and a plasma generator may be configured by combining a plurality of plasma electrode modules in a mesh form. According to an embodiment of the present invention, as shown in FIG. 1, it may be configured as a rectangular mesh, but may be configured to include a plurality of circulation holes inside.
  • the plasma generating unit may be formed in the form of a plasma electrode printed in a predetermined pattern on one side of the control unit.
  • the frequency (Hz) of the input power or output plasma, the capacitive value, the spacing between electrodes, etc. are variables, and a person skilled in the art will be able to freely print the pattern with reference to the description and drawings of the present invention. .
  • the plasma generating unit or control unit
  • 8 shows an embodiment of plasma electrode pattern printing. 8 is a rear view of the control unit, and other configurations (piezo cooling holes, etc.) other than the pattern are omitted.
  • the fan is provided with at least two intake ports for inhaling air, and at least one exhaust port for discharging air, so that the air from the outside of the casing is sucked into the first intake port of the fan and passes through the exhaust port to the plasma generating unit. While moving, some of the air that has moved to the plasma generating unit may be configured to be sucked back through the second intake port of the fan.
  • two intake ports and one exhaust port are provided.
  • the technical idea of the present invention is not limited to the number of intake ports and exhaust ports above, and a configuration in which some of the air in contact with the plasma generation unit is re-inhaled to contact the plasma generation unit again is in accordance with the technical idea of the present invention. Can be included.
  • the above configuration may be configured using a centrifugal fan ( ⁇ -). Air can be sucked in from both directions of the motor shaft and discharged in the circumferential direction by centrifugal force.
  • ⁇ - centrifugal fan
  • the casing may include an inlet through which air is introduced by the fan;
  • a pan casing part surrounding the outer circumferential surface of the fan and configured to fix surfaces other than the intake and exhaust ports of the fan;
  • the pan casing portion is provided with a predetermined jaw, and is coupled to the pan casing portion so that the control portion contacts the jaw to form an air passage between the pan casing portion and the control portion.
  • a passage (air passage 123 ⁇ air feedback passage 122 ⁇ second intake port) through which air in contact with the plasma generating portion is re-inhaled back into the fan may be formed.
  • An air discharge passage 121 may be formed on one or more sides of the casing part. Accordingly, an air discharge passage (exhaust 22 ⁇ air discharge passage 121 ⁇ air passage 123) may be formed.
  • Some of the air may be configured to pass through the inside of the controller through the piezo cooling hole 320, in which case the piezo device may be cooled by air.
  • a cooling fin is formed in the piezo device to increase the contact area with air, thereby maximizing the amount of heat dissipation.
  • a fan cover 13 may be provided outside the pan casing to form a structure that seals the inside and the outside of the air purifier.
  • a fan, a pan casing part, a control part, and a plasma generating part may be accommodated inside the fan cover, and some coupling parts of the inlet part 11 and the outlet part 14 may be accommodated.
  • Air introduced from the inlet may be configured to be introduced into the fan in a filtered state.
  • a HEPA filter may be applied as the first filter.
  • a phenomenon in which the intake flow rate of air is partially decreased by the HEPA filter may occur, and this decrease in the flow rate may increase the number of reflux in the plasma generating unit, the filtering rate per contact, and the reintake rate.
  • the total amount of foreign substances to be removed from the plasma generating unit can be reduced, thereby reducing the load applied to the plasma generating unit.
  • control unit is provided with a piezo device;
  • the power input through the control unit may be converted through a piezo device and may be configured to be output to the plasma generator at a voltage of 2000V to 2500V.
  • the piezo device may be composed of a ceramic cell, and the size of the control unit may be minimized through the piezo device.
  • the voltage of the plasma generator is higher than 2000V, but the current flowing from the plasma generator is very small (about 10 ⁇ 14W of power), so it is not harmful even if a person touches the plasma generator with their hands. .
  • a current of 5 mA or less is expressed as "sensing current” rather than “electric shock”, to the extent that it is felt as “stimulation”.
  • the casing may be formed to a thickness of between 20mm to 50mm.
  • a portable air cleaner having a size similar to that of a matchbox can be configured.
  • the small-sized plasma air purifier as described above can be used as a portable air purifier such as a necklace by hanging a ring on the casing. It is also possible to apply the above configuration to the smartphone case.
  • a plurality of plasma air cleaning devices as described above are provided; On one or more side surfaces of the casing, a module connection part for connecting a plurality of plasma air cleaning devices to share power with each other is provided; An external fan is connected to one side of the plasma air cleaning assembly to which a plurality of plasma air cleaning devices are coupled through the module connection portion; A plasma air cleaning system is provided.
  • the plasma air cleaning system as described above can be used as a domestic or industrial air purifier.
  • an air cleaning device having a flow rate suitable for the size of the space can be configured.
  • the individual air purifier can be configured to have a very small size compared to the conventional air purifier, it can be installed regardless of the size or shape of the place.
  • Plasma air cleaning assembly may be provided in multiple stages to maximize the removal rate of pollutants.
  • the module connection portion may be accommodated inside the casing, and a hole may be formed on the outside of the casing to expose the module connection portion to the outside.
  • a connector 6 can be coupled between the module connections to connect each air cleaning device.
  • a casing in which a predetermined internal space and an air flow path are formed;
  • a control unit provided inside the casing and connected to a power source for generating plasma;
  • a plasma air cleaning module including a plasma generating unit configured to generate plasma by receiving power from the control unit to remove predetermined particles entering through an air flow path;
  • At least one side surface of the casing is provided with a module connector for connecting a plurality of plasma air cleaning modules to share power with each other;
  • An external fan is connected to one side of the plasma air cleaning assembly to which a plurality of plasma air cleaning modules are coupled through the module connection portion;
  • a plasma air cleaning device is provided.
  • FIG. 7 a conventional air cleaning device and an embodiment of the present invention are compared.
  • the amount of filtering due to the first order filter is excluded and compared for simplicity.
  • Q is the flow rate of air passing through the air purifier (LPS, Liter Per Seconds; unit volume per unit time)
  • a is the mass of pollutants injected into the air purifier (g/s, gram per seconds; unit mass per unit time)
  • r is the reintake rate (%) representing the rate at which the air in contact with the plasma generating unit is re-inhaled by the fan
  • f is the proportion of contaminants removed when the plasma generating unit and air are in contact with one time (%)
  • e May mean the number of times the air and the plasma generator contact the air due to eddy flow/turbulence in the reflux space.
  • the suction flow rate is discharged to the outside as it is, and since the contact between the air and the plasma generator occurs once, the amount of pollutants at the output terminal can be expressed as (1-f)a.
  • some of the suctioned flow rate (rQ) is re-sucked into the fan and discharged ((1+r)Q) back to the plasma generation unit through the air passage, and vortex/turbulence in the reflux space Depending on the degree of, (e) contact occurs multiple times between the air-plasma generator.
  • the amount of pollutants contained in the re-inhaled air is expressed as r(1-ef)a, and the amount of pollutants in the output terminal may be expressed as (1-ef)(1-r)a.
  • Table 1 below shows the pollutant removal rate (f) 20% per contact and the number of times of reflux (e) to change the reintake rate (r), and the amount of pollutants discharged by the existing air cleaning device [(1-f ), the amount of pollutants discharged according to an embodiment of the present invention compared to the mass of the pollutants injected into the air cleaning device [(1-ef)(1-r), compared to the mass of the pollutants injected into the air cleaning device, %] ].
  • Table 2 shows a change in the pollutant removal rate (f) per contact when the reintake rate (r) is 50% and the number of reflux times (e) is once, and the amount of pollutants discharged by the existing air cleaning device [(1-f ), the amount of pollutants discharged according to the embodiment of the present invention compared to the mass of the pollutants injected into the air cleaning device, %] [(1-ef)(1-r), compared to the mass of the pollutants injected into the air cleaning device,% ].
  • Table 3 shows the number of reflux times (e) when the re-intake rate (r) is 50% and the pollutant removal rate per contact (f) 40%, the amount of pollutants discharged by the existing air cleaning device [(1-f) , Amount of pollutants discharged according to an embodiment of the present invention compared to the mass of pollutants injected into the air cleaning device, %] [(1-ef)(1-r), compared to the mass of pollutants injected into the air cleaning device, %] Is a comparison.
  • the number of reflux exceeds 2.4, it can be confirmed that 100% of contaminants are theoretically removed. It can be seen that every 0.2 times the number of reflux increases, the improvement rate increases by about 6%. Although it is difficult to directly measure the number of reflux or reintake rate in an actual device, it is possible to indirectly estimate the number of reflux and reintake rate by measuring the pollutant removal rate between devices according to an embodiment of the present invention compared to the existing device.
  • the number of reflux may mean the average number of reflux of each air component particle. Since it is an average value, it is possible to design by assuming the number of decimal points as described above, even though it is a number of times.
  • the pollutant removal rate of the conventional apparatus it is possible to confirm the remarkable effect of the formation of the reflux space.
  • the size of the device can be configured to be smaller than that of the existing one, but the pollutant removal rate is improved.
  • the "reintake rate (r) is 10% from 20% to 60%
  • the pollutant removal rate (f) per contact is 10% from 20% to 50%
  • the number of reflux (e) is from 1.2 to 2
  • the range of "up to times" may be a range that a person skilled in the art can easily implement with reference to the specification of the present invention.
  • control unit 31 electrode unit

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
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  • General Engineering & Computer Science (AREA)
  • Disinfection, Sterilisation Or Deodorisation Of Air (AREA)

Abstract

The present invention relates to a plasma air cleaning device and, more particularly, to a plasma air cleaning device that removes fine dust or harmful particles by generating plasma on an electrode such as a flexible electrode or a carbon electrode. According to an embodiment of the present invention, provided is a plasma air cleaning device, comprising: a casing in which a predetermined internal space and an air flow passage are formed; a fan coupled to the inside of the casing so as to allow air to flow; a control unit that controls the fan; and a plasma generating unit that generates plasma by receiving power from the control unit so as to remove predetermined particles entering through the air flow passage, wherein a return space is formed within a predetermined range from the plasma generating unit so as to allow contact between the plasma generating unit and the air in the return space a plurality of times.

Description

플라즈마 공기 청정 장치 및 시스템Plasma air cleaning device and system
본 발명은 플라즈마 공기 청정 장치에 관한 것으로, 더 상세하게는 유연전극, 탄소전극 등 전극에 플라즈마를 발생시켜 미세먼지나 유해 입자를 제거하는 플라즈마 공기 청정 장치에 관한 것이다.The present invention relates to a plasma air cleaning device, and more particularly, to a plasma air cleaning device that removes fine dust or harmful particles by generating plasma on an electrode such as a flexible electrode or a carbon electrode.
절연물에 일정 이상의 전압이 흐르면 유전체는 도체의 역할을 하게 되는데 이러한 현상을 절연파괴라 일컬으며, 이 절연파괴로 인해 절연성질을 잃어버리기에 전류가 흐르게 되고 이러한 것을 방전 (discharge)이라고 한다.When a certain voltage is applied to the insulator, the dielectric acts as a conductor. This phenomenon is called insulation breakdown, and the current flows because the insulation property is lost due to this insulation breakdown, and this is called discharge.
플라즈마는 절연물이 기체일 때, 절연파괴가 되는 기체의 방전에 의해 발생하게 되며, 대기압 플라즈마는 그 방전특성에 따라 여러 종류로 나눌 수 있다. 그 중 플라즈마 젯과 밀접하게 관련이 있는 것이 코로나 방전 (corona discharge), 유전체 장벽 방전 (dielectric barrier discharges), 대기압 글로우 방전 (atmospheric pressure glow discharge)이다.When the insulating material is a gas, plasma is generated by the discharge of a gas that becomes insulation breakdown, and atmospheric pressure plasma can be classified into several types according to its discharge characteristics. Among them, corona discharge, dielectric barrier discharges, and atmospheric pressure glow discharge are closely related to plasma jets.
상기와 같은 플라즈마를 이용하여, 공기 청정 장치를 구성할 수 있다. 플라즈마 공기 청정 장치는 물리적으로 집진된 미세먼지를 제거하는 방식과는 다르게 플라즈마 영역을 형성하여 발생하는 OH기를 이용한 미세먼지의 화학적 제거방식이며, 미세먼지 등을 제거한 뒤에도 물이나 산소와 같은 무기물만 발생하여 환경오염에 대한 우려는 없다. 플라즈마를 이용한 입자 제거 과정 중 오존이 발생하나, "오존은 위해하다"는 잘못된 인식이 널리 퍼져있을 뿐, 플라즈마로 인해 발생되는 정도의 오존이 인체/환경에 위해를 끼치지는 않는다.Using the plasma as described above, an air cleaning device can be configured. Unlike the method of removing physically collected fine dust, the plasma air cleaning device is a method of chemically removing fine dust using OH groups generated by forming a plasma region, and only inorganic substances such as water or oxygen are generated even after removing the fine dust. Therefore, there is no concern about environmental pollution. Ozone is generated during the process of removing particles using plasma, but there is a widespread misconception that “ozone is harmful”, and ozone generated by plasma does not harm the human body/environment.
한국등록특허공보 제10-0487544호에는, "대기압 플라즈마 방전을 이용한 공기정화 장치에 있어서, 오염된 공기가 1차 여과되는 프리필터부; 상기 프리필터부에서 1차적으로 여과된 공기를 흡입하여 플라즈마 필터부로 보내는 송풍부; 상기 송풍부를 통해 나오는 공기를 대기압 플라즈마 방전에 의해 2차적으로 정화시키는 플라즈마 셀이 입체적으로 배열된 플라즈마 필터부; 및 상기 플라즈마 필터부와 연결된 플라즈마 전원 공급장치를 포함하여 이루어짐을 특징으로 하는 입체형 셀 구조의 플라즈마 필터를 이용한 공기정화 장치"가 개시되어 있다.In Korean Patent Publication No. 10-0487544, "In an air purifying apparatus using atmospheric pressure plasma discharge, a pre-filter unit in which contaminated air is first filtered; Plasma by inhaling the air firstly filtered by the pre-filter unit. A plasma filter unit in which plasma cells that secondaryly purify the air emitted through the air blower through atmospheric pressure plasma discharge are three-dimensionally arranged, and a plasma power supply device connected to the plasma filter unit. An air purification apparatus using a plasma filter having a three-dimensional cell structure, which is characterized by, is disclosed.
상기 특허문헌의 공기 청정 장치와 유사한 구성의 장치들이 플라즈마를 이용한 공기 청정 장치에 널리 사용되고 있다.Devices having a configuration similar to that of the air cleaning device of the patent document are widely used in air cleaning devices using plasma.
공기 청정 장치는 정화의 대상이 되는 공간의 크기에 따라 저유량부터 대유량까지 다양한 크기 및 유량을 가지는 제품군이 존재하나, 상기와 같은 종래 기술에서는 유속이 빠른 경우 공기와 플라즈마 필터 간 접촉시간이 매우 짧아져 플라즈마 필터의 효과가 제대로 나타나지 않는 한계가 있었다. 이러한 문제점으로 인해 기존 장치에서는 플라즈마 필터 장치를 형식적으로 구비하면서 플라즈마 필터 기능이 있다는 광고 효과를 위해 사용되거나(실제 플라즈마를 통한 입자 제거율은 매우 낮아 플라즈마 필터가 없는 경우와 큰 차이가 없음), 일부 유속이 느린 저유량 조건에서 사용되거나, 플라즈마 필터의 크기/표면적 자체를 크게 하는 대형 장치에 사용되는 경우가 대부분이었다.Air purifiers have a range of sizes and flow rates from low flow rates to large flow rates depending on the size of the space to be purified. However, in the prior art as described above, when the flow rate is fast, the contact time between the air and the plasma filter is very high. There was a limitation in that the effect of the plasma filter did not appear properly due to the shortening. Due to this problem, the existing device has a plasma filter device formally and is used for advertising effect that it has a plasma filter function (the actual particle removal rate through plasma is very low, so there is no significant difference from the case without a plasma filter), and some flow rates In most cases, it is used in such a slow low flow condition, or in a large-sized device that increases the size/surface area of the plasma filter itself.
본 발명이 해결하고자 하는 과제는, 전술한 바와 같은 종래 플라즈마 공기 청정 장치의 문제점을 해결하기 위하여, 유량/유속과 무관하게 입자 제거율이 높은 플라즈마 공기 청정 장치를 제공하는 것이다.The problem to be solved by the present invention is to provide a plasma air cleaning device having a high particle removal rate regardless of a flow rate/flow rate in order to solve the problems of the conventional plasma air cleaning device as described above.
본 발명은 종래 플라즈마 공기 청정 장치의 문제점을 해결하기 위해, 소정의 내부공간 및 공기유로가 형성되는 케이싱(1); 상기 케이싱(1)의 내측에 결합되어 공기를 유동시키는 팬(2); 상기 팬(2)을 제어하는 제어부(3); 상기 제어부(3)로부터 전원을 공급받아 플라즈마를 발생시켜, 공기유로를 통해 들어온 소정의 입자를 제거하는 플라즈마 발생부(4)를 포함하고; 상기 플라즈마 발생부(4)로부터 소정의 범위 내에 환류공간(R)이 형성되어; 상기 환류공간(R)에서 플라즈마 발생부(4) 및 공기 사이에 복수회 접촉이 가능하도록 구성되는, 플라즈마 공기 청정 장치를 제공한다.In order to solve the problems of the conventional plasma air cleaning apparatus, the present invention includes a casing 1 in which a predetermined internal space and an air flow path are formed; A fan (2) coupled to the inner side of the casing (1) to flow air; A control unit 3 for controlling the fan 2; And a plasma generator (4) that receives power from the control unit (3) to generate plasma and removes predetermined particles from the air flow path; A reflux space (R) is formed within a predetermined range from the plasma generator (4); A plasma air cleaning apparatus is provided, which is configured to allow contact between the plasma generating unit 4 and the air in the reflux space R a plurality of times.
또한, 상기 플라즈마 발생부(4)는, 상기 제어부(3)의 일측에 제어부(3)로부터 소정의 길이만큼 돌출되도록 형성되는 전극부(31)와 연결되어, 플라즈마 발생부(4) 및 제어부(3) 사이에 소정의 공간이 형성될 수 있다.In addition, the plasma generation unit 4 is connected to an electrode unit 31 formed to protrude from the control unit 3 by a predetermined length on one side of the control unit 3, and the plasma generation unit 4 and the control unit ( 3) A predetermined space may be formed between them.
그리고, 상기 플라즈마 발생부(4)는, 상기 제어부(3)의 일측에 소정의 패턴으로 프린팅된 플라즈마 전극 형태로 형성될 수 있다.In addition, the plasma generating unit 4 may be formed in the form of a plasma electrode printed in a predetermined pattern on one side of the control unit 3.
아울러, 상기 팬(2)은, 공기를 흡입하는 흡기구가 둘 이상 구비되고, 공기를 배출하는 배기구(22)가 하나 이상 구비되어, 상기 케이싱(1)의 외부로부터 들어온 공기(I)가 팬(2)의 제1흡기구(211)로 흡입되어 배기구(22)를 거쳐 플라즈마 발생부(4)로 이동하되, 상기 플라즈마 발생부(4)로 이동한 공기 중 일부(F)는 팬(2)의 제2흡기구(212)로 다시 흡입되도록 구성될 수 있다.In addition, the fan 2 is provided with at least two intake ports for inhaling air, and at least one exhaust port 22 for discharging air, so that the air (I) from the outside of the casing 1 is provided with the fan ( 2) is sucked into the first intake port 211 and moves to the plasma generating unit 4 through the exhaust port 22, but some of the air that has moved to the plasma generating unit 4 (F) is It may be configured to be sucked back into the second intake port 212.
또한, 상기 케이싱(1)은, 상기 팬(2)에 의해 공기가 유입되는 입구부(11); 상기 팬(2)의 외주면을 둘러싸며, 팬(2)의 흡기구(211, 212) 및 배기구(22) 이외의 면을 고정하도록 형성되는 팬케이싱부(12); 상기 팬케이싱부(12)에는 소정의 턱(120)이 구비되어, 제어부(3)가 턱(120)에 접촉하도록 팬케이싱부(12)와 결합되어 팬케이싱부(12) 및 제어부(3) 사이에 공기 통로(123)가 형성될 수 있다.In addition, the casing (1), the inlet portion 11 through which air is introduced by the fan (2); A pan casing portion 12 surrounding the outer circumferential surface of the fan 2 and configured to fix surfaces other than the intake ports 211 and 212 and the exhaust port 22 of the fan 2; The pan casing portion 12 is provided with a predetermined jaw 120, and the pan casing portion 12 and the control portion 3 are coupled with the pan casing portion 12 so that the control portion 3 contacts the jaw 120. An air passage 123 may be formed therebetween.
그리고, 상기 입구부(11) 및 팬(2) 사이에는 1차 필터(5)가 구비되어; 상기 입구부(11)로부터 유입된 공기(I)가 필터링된 상태로 팬(2)에 유입되도록 구성될 수 있다.In addition, a primary filter 5 is provided between the inlet 11 and the fan 2; The air (I) introduced from the inlet portion 11 may be configured to be introduced into the fan 2 in a filtered state.
아울러, 상기 제어부(3)에는 피에조 장치(32)가 구비되어; 상기 제어부(3)를 통해 입력되는 전원이 피에조 장치(32)를 통해 변환되어 플라즈마 발생부(4)에 2000V 내지 2500V의 전압으로 출력되도록 구성될 수 있다.In addition, the control unit 3 is provided with a piezo device 32; Power input through the control unit 3 may be converted through the piezo device 32 to be output to the plasma generator 4 at a voltage of 2000V to 2500V.
또한, 상기 케이싱(1)은, 20mm 내지 50mm 사이의 두께로 형성될 수 있다.In addition, the casing 1 may be formed to a thickness between 20mm and 50mm.
그리고, 상기와 같은 플라즈마 공기 청정 장치를 복수개 구비하고; 상기 케이싱(1)의 하나 이상의 측면에는, 복수개의 플라즈마 공기 청정 장치가 서로 전원을 공유하도록 연결시키는 모듈연결부(33)가 구비되고; 상기 모듈연결부(33)를 통해 플라즈마 공기 청정 장치 복수개가 결합된 플라즈마 공기 청정 결합체(1')의 일측에 외부 팬(7)이 연결되는; 플라즈마 공기 청정 시스템이 제공된다.In addition, a plurality of plasma air cleaning devices as described above are provided; At least one side surface of the casing 1 is provided with a module connector 33 for connecting a plurality of plasma air cleaning devices to share power with each other; An external fan 7 is connected to one side of the plasma air cleaning assembly 1 ′ to which a plurality of plasma air cleaning devices are coupled through the module connection 33; A plasma air cleaning system is provided.
다른 실시 예에 있어서, 소정의 내부공간 및 공기유로가 형성되는 케이싱(1); 상기 케이싱(1) 내부에 구비되며, 플라즈마 발생을 위한 전원과 연결되는 제어부(3); 상기 제어부(3)로부터 전원을 공급받아 플라즈마를 발생시켜, 공기유로를 통해 들어온 소정의 입자를 제거하는 플라즈마 발생부(4)를 포함하는 플라즈마 공기 청정 모듈; 상기 케이싱(1)의 하나 이상의 측면에는, 복수개의 플라즈마 공기 청정 모듈이 서로 전원을 공유하도록 연결시키는 모듈연결부(33)가 구비되고; 상기 모듈연결부(33)를 통해 플라즈마 공기 청정 모듈 복수개가 결합된 플라즈마 공기 청정 결합체(1')의 일측에 외부 팬(7)이 연결되는; 플라즈마 공기 청정 장치가 제공된다.In another embodiment, a casing 1 in which a predetermined internal space and an air flow path are formed; A control unit 3 provided inside the casing 1 and connected to a power source for generating plasma; A plasma air cleaning module including a plasma generating unit 4 that receives power from the control unit 3 and generates plasma to remove predetermined particles that have entered through the air flow path; At least one side surface of the casing 1 is provided with a module connector 33 for connecting a plurality of plasma air cleaning modules to share power with each other; An external fan 7 is connected to one side of the plasma air cleaning assembly 1'to which a plurality of plasma air cleaning modules are combined through the module connection part 33; A plasma air cleaning device is provided.
본 발명의 실시 예에 따르면, 플라즈마 발생부 주변에서 환류(와류)를 발생시켜 오염물질과 플라즈마 필터 간 접촉횟수를 증가시킴으로써 대유량이나 크기가 작은 시스템에서도 오염물질 필터율이 높은 공기 청정 장치를 구성할 수 있다.According to an embodiment of the present invention, an air cleaning device having a high pollutant filter rate is constructed even in a system with a large flow rate or a small size by generating a reflux (vortex) around the plasma generating unit to increase the number of contact between the pollutant and the plasma filter. can do.
또한, 필터링 된 공기 중 일부를 재흡기하여 다시 플라즈마 발생부에 투입시킴으로써 한 번 흡입된 공기를 여러번 필터링하여 필터링 효율을 높일 수 있다.In addition, some of the filtered air may be re-inspired and introduced into the plasma generating unit again, thereby filtering the once inhaled air several times to increase filtering efficiency.
그리고, 피에조 장치를 이용하여 플라즈마를 발생시킴으로써, 저전력 및 소형 시스템을 구성할 수 있다.And, by generating plasma using a piezo device, it is possible to configure a low power and compact system.
아울러, 공기 청정 장치의 모듈화를 가능하도록 구성하여, 동일한 모듈을 개인 휴대용 공기 청정 장치로부터 산업용 공기 청정 장치까지 범용적으로 사용할 수 있으므로 양산성을 개선할 수 있다.In addition, since the air cleaning device is configured to be modularized, the same module can be used universally from a personal portable air cleaning device to an industrial air cleaning device, so that mass productivity can be improved.
또한, 플라즈마를 사용함으로써, 가스형태의 오염물질, 미세먼지, SOx, NOx, 담배연기, 악취 성분 등을 포함한 거의 모든 오염물질의 제거가 가능하다.In addition, by using plasma, almost all contaminants including gaseous contaminants, fine dust, SOx, NOx, cigarette smoke, and odor components can be removed.
그리고, 플라즈마 필터 및 1차 필터(헤파필터)를 병행사용함으로써 플라즈마 필터에 가해지는 부하를 줄이고, 헤파필터를 통해 유량/유속을 적절히 조절함으로써 재흡기율 및 환류횟수를 증가시켜 플라즈마 발생부에서의 오염물질 제거율을 향상시킬 수 있다.In addition, by using the plasma filter and the primary filter (HEPA filter) in parallel, the load applied to the plasma filter is reduced, and the resorption rate and the number of recirculation are increased by appropriately controlling the flow rate/flow rate through the HEPA filter. It can improve the pollutant removal rate.
아울러, 공기유로 상에 피에조 장치를 포함한 제어부를 위치시켜, 플라즈마 장치의 지속적인 사용으로 발생한 열을 흡입한 공기로 냉각함으로써 장치의 지속 사용 시간과 내구성을 향상시킬 수 있다.In addition, by placing a control unit including a piezo device on the air flow path, heat generated by continuous use of the plasma device is cooled with inhaled air, thereby improving the sustained use time and durability of the device.
도 1 은 본 발명의 실시 예에 의한 플라즈마 공기 청정 장치의 분해사시도이다.1 is an exploded perspective view of a plasma air cleaning apparatus according to an embodiment of the present invention.
도 2 는 본 발명의 실시 예에 의한 플라즈마 공기 청정 장치의 사시도이다.2 is a perspective view of a plasma air cleaning apparatus according to an embodiment of the present invention.
도 3 는 본 발명의 실시 예에 의한 플라즈마 공기 청정 장치의 제어부를 상세하게 도시한 도면이다.3 is a view showing in detail a control unit of the plasma air cleaning apparatus according to an embodiment of the present invention.
도 4 는 본 발명의 실시 예에 의한 플라즈마 공기 청정 시스템의 개략도이다.4 is a schematic diagram of a plasma air cleaning system according to an embodiment of the present invention.
도 5 는 도 2 의 A-A 단면을 도시한 단면도이다.5 is a cross-sectional view showing a cross-section A-A of FIG. 2.
도 6 은 본 발명의 실시 예에 의한 플라즈마 공기 청정 장치(b)와 종래 플라즈마 공기 청정 장치(a)의 공기 유로를 비교한 도면이다.6 is a view comparing the air flow path of the plasma air cleaning device (b) according to an embodiment of the present invention and the conventional plasma air cleaning device (a).
도 7 은 본 발명의 실시 예에 의한 플라즈마 공기 청정 장치(b)와 종래 플라즈마 공기 청정 장치(a)의 오염물질 필터링 양을 비교한 도면이다.7 is a view comparing the amount of pollutant filtering between the plasma air cleaning device (b) according to an embodiment of the present invention and the conventional plasma air cleaning device (a).
도 8 은 본 발명의 다른 실시 예에 의한 플라즈마 공기 청정 장치의 제어부 배면도이다.8 is a rear view of a control unit of a plasma air cleaning apparatus according to another embodiment of the present invention.
이하, 본 문서의 다양한 실시예가 첨부된 도면을 참조하여 기재된다. 그러나, 이는 본 문서에 기재된 기술을 특정한 실시 형태에 대해 한정하려는 것이 아니며, 본 문서의 실시예의 다양한 변경(modifications), 균등물 (equivalents), 및/또는 대체물(alternatives)을 포함하는 것으로 이해되어야 한다. 도면의 설명과 관련하여, 유사한 구성요소에 대해서는 유사한 참조 부호가 사용될 수 있다.Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings. However, this is not intended to limit the techniques described in this document to specific embodiments, and should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of this document. . In connection with the description of the drawings, similar reference numerals may be used for similar elements.
본 문서에서, "가진다," "가질 수 있다," "포함한다," 또는 "포함할 수 있다" 등의 표현은 해당 특징(예: 수치, 기능, 동작, 또는 부품 등의 구성요소)의 존재를 가리키며, 추가적인 특징의 존재를 배제하지 않는다.In this document, expressions such as "have," "may have," "include," or "may contain" are the presence of corresponding features (eg, elements such as numbers, functions, actions, or parts). And does not exclude the presence of additional features.
본 문서에서, "A 또는 B," "A 또는/및 B 중 적어도 하나," 또는 "A 또는/및 B 중 하나 또는 그 이상"등의 표현은 함께 나열된 항목들의 모든 가능한 조합을 포함할 수 있다. 예를 들면, "A 또는 B," "A 및 B 중 적어도 하나," 또는 "A 또는 B 중 적어도 하나"는, (1) 적어도 하나의 A를 포함, (2) 적어도 하나의 B를 포함, 또는 (3) 적어도 하나의 A 및 적어도 하나의 B 모두를 포함하는 경우를 모두 지칭할 수 있다.In this document, expressions such as "A or B," "at least one of A or/and B," or "one or more of A or/and B" may include all possible combinations of the items listed together. . For example, "A or B," "at least one of A and B," or "at least one of A or B" includes (1) at least one A, (2) at least one B, Or (3) it may refer to all cases including both at least one A and at least one B.
본 문서에서 사용된 "제 1," "제 2," "첫째," 또는 "둘째,"등의 표현들은 다양한 구성요소들을, 순서 및/또는 중요도에 상관없이 수식할 수 있고, 한 구성요소를 다른 구성요소와 구분하기 위해 사용될 뿐 해당 구성요소들을 한정하지 않는다. 예를 들면, 제 1 사용자 기기와 제 2 사용자 기기는, 순서 또는 중요도와 무관하게, 서로 다른 사용자 기기를 나타낼 수 있다. 예를 들면, 본 문서에 기재된 권리 범위를 벗어나지 않으면서 제 1 구성요소는 제 2 구성요소로 명명될 수 있고, 유사하게 제 2 구성요소도 제 1 구성요소로 바꾸어 명명될 수 있다.Expressions such as "first," "second," "first," or "second," used in this document can modify various elements regardless of their order and/or importance, and It is used to distinguish it from other components and does not limit the components. For example, a first user device and a second user device may represent different user devices regardless of order or importance. For example, without departing from the scope of the rights described in this document, a first component may be referred to as a second component, and similarly, a second component may be renamed to a first component.
어떤 구성요소(예: 제 1 구성요소)가 다른 구성요소(예: 제 2 구성요소)에 "(기능적으로 또는 통신적으로) 연결되어(operatively or communicatively) coupled with/to)" 있다거나 "접속되어(connected to)" 있다고 언급된 때에는, 상기 어떤 구성요소가 상기 다른 구성요소에 직접적으로 연결되거나, 다른 구성요소(예: 제 3 구성요소)를 통하여 연결될 수 있다고 이해되어야 할 것이다. 반면에, 어떤 구성요소(예: 제 1 구성요소)가 다른 구성요소(예: 제 2 구성요소)에 "직접 연결되어" 있다거나 "직접 접속되어" 있다고 언급된 때에는, 상기 어떤 구성요소와 상기 다른 구성요소 사이에 다른 구성요소(예: 제 3 구성요소)가 존재하지 않는 것으로 이해될수 있다.Some component (eg, the first component) is “(functionally or communicatively) coupled with/to” to another component (eg, the second component) or “connected” When referred to as "connected to", it should be understood that the certain component may be directly connected to the other component or may be connected through another component (eg, a third component). On the other hand, when a component (eg, a first component) is referred to as being “directly connected” or “directly connected” to another component (eg, a second component), the component and the It may be understood that no other component (eg, a third component) exists between the different components.
본 문서에서 사용된 표현 "~하도록 구성된(또는 설정된)(configured to)"은 상황에 따라, 예를 들면, "~에 적합한(suitable for)," "~하는 능력을 가지는(having the capacity to)," "~하도록 설계된(designed to)," "~하도록 변경된(adapted to)," "~하도록 만들어진(made to)," 또는 "~를 할 수 있는(capable of)"과 바꾸어 사용될 수 있다. 용어 "~하도록 구성된(또는 설정된)"은 하드웨어적으로 "특별히 설계된(specifically designed to)" 것만을 반드시 의미하지 않을 수 있다. 대신, 어떤 상황에서는, "~하도록 구성된 장치"라는 표현은, 그 장치가 다른 장치 또는 부품들과 함께 "~할 수 있는" 것을 의미할 수 있다. 예를 들면, 문구 "A, B, 및 C를 수행하도록 구성된(또는 설정된) 프로세서"는 해당 동작을 수행하기 위한 전용 프로세서(예: 임베디드 프로세서), 또는 메모리 장치에 저장된 하나 이상의 소프트웨어 프로그램들을 실행함으로써, 해당 동작들을 수행할 수 있는 범용 프로세서(generic-purpose processor)(예: CPU 또는 application processor)를 의미할 수 있다.The expression "configured to" as used in this document is, for example, "suitable for," "having the capacity to" depending on the situation. ," "designed to," "adapted to," "made to," or "capable of." The term "configured to (or set)" may not necessarily mean only "specifically designed to" in hardware. Instead, in some situations, the expression "a device configured to" may mean that the device "can" along with other devices or parts. For example, the phrase “a processor configured (or configured) to perform A, B, and C” means a dedicated processor (eg, an embedded processor) for performing the operation, or by executing one or more software programs stored in a memory device. , May mean a generic-purpose processor (eg, a CPU or an application processor) capable of performing corresponding operations.
본 문서에서 사용된 용어들은 단지 특정한 실시 예를 설명하기 위해 사용된 것으로, 다른 실시 예의 범위를 한정하려는 의도가 아닐 수 있다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함할 수 있다. 기술적이거나 과학적인 용어를 포함해서 여기서 사용되는 용어들은 본 문서에 기재된 기술 분야에서 통상의 지식을 가진 자에 의해 일반적으로 이해되는 것과 동일한 의미를 가질 수 있다. 본 문서에 사용된 용어들 중 일반적인 사전에 정의된 용어들은, 관련 기술의 문맥상 가지는 의미와 동일 또는 유사한 의미로 해석될 수 있으며, 본 문서에서 명백하게 정의되지 않는 한, 이상적이거나 과도하게 형식적인 의미로 해석되지 않는다. 경우에 따라서, 본 문서에서 정의된 용어일지라도 본 문서의 실시 예들을 배제하도록 해석될 수 없다.Terms used in this document are only used to describe a specific embodiment, and may not be intended to limit the scope of other embodiments. Singular expressions may include plural expressions unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by a person of ordinary skill in the technical field described in this document. Among terms used in this document, terms defined in a general dictionary may be interpreted as having the same or similar meanings as those in the context of the related technology, and unless explicitly defined in this document, they have ideal or excessively formal meanings. Is not interpreted as. In some cases, even terms defined in this document cannot be interpreted to exclude embodiments of this document.
본 발명의 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진자에 의해 다양한 변형실시가 가능한 것은 물론이고, 이러한 변형실시들은 본 발명의 기술적 사상이나 전망으로부터 개별적으로 이해되어져서는 안될 것이다.Various modifications can be made by those of ordinary skill in the technical field to which the present invention belongs without departing from the gist of the present invention claimed in the claims of the present invention, and these modifications are the technical spirit of the present invention. It should not be understood individually from the perspective.
본 발명의 실시 예에 따르면, 소정의 내부공간 및 공기유로가 형성되는 케이싱; 상기 케이싱의 내측에 결합되어 공기를 유동시키는 팬; 상기 팬을 제어하는 제어부; 상기 제어부로부터 전원을 공급받아 플라즈마를 발생시켜, 공기유로를 통해 들어온 소정의 입자를 제거하는 플라즈마 발생부를 포함하고; 상기 플라즈마 발생부로부터 소정의 범위 내에 환류공간이 형성되어; 상기 환류공간에서 플라즈마 발생부 및 공기 사이에 복수회 접촉이 가능하도록 구성되는, 플라즈마 공기 청정 장치를 제공한다.According to an embodiment of the present invention, a casing in which a predetermined internal space and an air flow path are formed; A fan coupled to the inner side of the casing to flow air; A control unit for controlling the fan; And a plasma generator configured to generate plasma by receiving power from the control unit to remove predetermined particles entering through an air flow path; A reflux space is formed within a predetermined range from the plasma generating unit; It provides a plasma air cleaning apparatus configured to allow a plurality of contact between the plasma generating unit and the air in the reflux space.
상기 환류(Reflux, Feed-back)란, 플라즈마 발생부와 접촉되어 오염물질이 1회 제거된 공기를 플라즈마 발생부와 재접촉 시키는 공기의 흐름을 의미할 수 있다. 환류의 실시 예로는, 소정의 범위 내에서 발생되는 와류(vortex, eddy current, turbulence, 渦流; 또는 난류)나, 공기를 팬으로 재흡기(F)시켜 흡입공기(I)와 함께 다시 플라즈마 발생부로 토출시키는 구성 등이 가능하다.The reflux (feed-back) may refer to a flow of air that contacts the plasma generating unit to re-contact the air from which contaminants have been removed once with the plasma generating unit. Examples of reflux are vortex, eddy current, turbulence, turbulence, or turbulence generated within a predetermined range, or re-intake (F) air with a fan to return to the plasma generating unit together with the intake air (I). A configuration to discharge, etc. is possible.
상기와 같은 환류공간을 통해, 대류량/고유속 조건에서의 낮은 오염물질 제거율과, 플라즈마 발생부(전극)와 공기 사이의 접촉 표면적을 극대화로 인한 장치의 대형화 등의 기존 플라즈마 필터 장치의 한계점을 해결할 수 있다.Through the reflux space as described above, the limitations of conventional plasma filter devices, such as a low pollutant removal rate under convection/high flow conditions, and an enlargement of the device by maximizing the contact surface area between the plasma generating unit (electrode) and air. Can be solved.
상기 환류공간은, 케이싱 내부에 나선형 블레이드 등 공기 흐름을 흐트러뜨리는 와류발생부재를 구비하여 형성될 수도 있다. 공기의 출구부 부근에서 공기를 역류시키거나 와류발생부재와 충돌시키는 등의 형태(케이싱 내부에 소정의 패턴으로 형성된 돌기)로 공기 및 플라즈마 발생부 사이의 복수회 접촉을 발생시킬 수 있다.The reflux space may be formed with a vortex generating member that disturbs air flow, such as a spiral blade, inside the casing. The contact between the air and the plasma generating unit may occur multiple times in a form (protrusion formed in a predetermined pattern inside the casing) such as causing the air to flow back or collide with the vortex generating member near the outlet of the air.
또한, 상기 플라즈마 발생부는, 상기 제어부의 일측에 제어부로부터 소정의 길이만큼 돌출되도록 형성되는 전극부와 연결되어, 플라즈마 발생부 및 제어부 사이에 소정의 공간이 형성될 수 있다.In addition, the plasma generation unit may be connected to an electrode unit formed to protrude from the control unit by a predetermined length on one side of the control unit, so that a predetermined space may be formed between the plasma generation unit and the control unit.
상기와 같은 플라즈마 발생부의 구성에서, 플라즈마 발생부 및 제어부는 환류공간에 포함될 수 있으며, 재흡입 되는 공기가 플라즈마 발생부 및 제어부와 충돌하면서 와류/난류가 형성될 수 있다.In the configuration of the plasma generating unit as described above, the plasma generating unit and the control unit may be included in the reflux space, and vortex/turbulence may be formed while the re-inhaled air collides with the plasma generating unit and the control unit.
도 1을 참조하면, 플라즈마 발생부에는 유통 홀(40)이 복수개 타공되어 있으며, 유통 홀을 통해 공기의 재흡입 및 와류 발생을 촉진시킬 수 있다. 또한, 유통 홀을 통해 플라즈마 발생부의 표면적을 증가시킴으로써 공기와 1회 접촉 시 오염물질 제거율도 증가시킬 수 있다.Referring to FIG. 1, a plurality of circulation holes 40 are perforated in the plasma generation unit, and re-intake of air and generation of eddy currents may be promoted through the circulation holes. In addition, by increasing the surface area of the plasma generating unit through the circulation hole, it is possible to increase the pollutant removal rate when contacting air once.
상기와 같은 형태에서, 플라즈마 발생부에 유연 전극을 적용할 수 있다. 이 경우, 유연 전극을 벤딩하여 공기와 접촉하는 표면적을 크게 증가시킬 수 있다. 구체적인 형상의 예로는, 유연 전극을 1회 벤딩한 "ㄷ(C, U)" 형태, 유연 전극을 2회 벤딩한 "ㄹ(乙, S)" 형태 등이 가능하며, 기타 유연 전극의 형태는 통상의 기술자가 본 발명의 명세서를 참조하여 변경할 수 있을 것이다.In the form as described above, a flexible electrode can be applied to the plasma generator. In this case, by bending the flexible electrode, the surface area in contact with the air can be greatly increased. As an example of a specific shape, a "c(C, U)" form in which a flexible electrode is bent once, a "ㄹ (乙, S)" form in which a flexible electrode is bent twice, etc. are possible, and other forms of the flexible electrode are Those skilled in the art will be able to make changes with reference to the specification of the present invention.
유연 전극은, 서로 이격 형성되는 제1전극 및 제2전극; 상기 제1전극 및 제2전극 사이에 구비되어 제1전극 및 제2전극을 절연시키는 유전체를 포함하고; 상기 제1전극은 관통홀이 형성된 원형의 실린더 형상이고, 제2전극은 원형의 플레이트로 구성된 플라즈마 전극 모듈을 포함하여 구성될 수 있다. 상기 플라즈마 전극 모듈은 실처럼 플렉서블하게 변형될 수 있으며, 복수의 플라즈마 전극 모듈을 메시(Mesh)형태로 결합하여 플라즈마 발생부를 구성할 수도 있다. 본 발명의 일 실시 예에 따르면, 도 1에 도시된 바와 같이 사각형 형태의 메시로 구성되되 내측에 복수개의 유통 홀이 포함되도록 구성될 수 있다.The flexible electrode includes: a first electrode and a second electrode formed to be spaced apart from each other; A dielectric material provided between the first electrode and the second electrode to insulate the first electrode and the second electrode; The first electrode may have a circular cylinder shape in which a through hole is formed, and the second electrode may include a plasma electrode module composed of a circular plate. The plasma electrode module may be flexibly deformed like a thread, and a plasma generator may be configured by combining a plurality of plasma electrode modules in a mesh form. According to an embodiment of the present invention, as shown in FIG. 1, it may be configured as a rectangular mesh, but may be configured to include a plurality of circulation holes inside.
그리고, 상기 플라즈마 발생부는, 상기 제어부의 일측에 소정의 패턴으로 프린팅된 플라즈마 전극 형태로 형성될 수 있다.In addition, the plasma generating unit may be formed in the form of a plasma electrode printed in a predetermined pattern on one side of the control unit.
상기 패턴의 프린팅은 입력 전원 또는 출력 플라즈마의 주파수(Hz), 용량성 값, 전극 사이 간격 등을 변수로 하며, 통상의 기술자는 본 발명의 설명 및 도면을 참조하여 패턴을 자유롭게 프린팅할 수 있을 것이다. 예를 들어, 전극 사이 간격이 너무 가깝게 형성되는 경우에는 방전이 발생하여 플라즈마 발생부(또는 제어부)가 정상적으로 동작하지 않을 수 있다.In the printing of the pattern, the frequency (Hz) of the input power or output plasma, the capacitive value, the spacing between electrodes, etc., are variables, and a person skilled in the art will be able to freely print the pattern with reference to the description and drawings of the present invention. . For example, if the gap between the electrodes is formed too close, discharge may occur and the plasma generating unit (or control unit) may not operate normally.
도 8에 플라즈마 전극 패턴 프린팅의 일 실시 예가 도시되어 있다. 도 8은 제어부의 배면도이며, 패턴 이외의 다른 구성(피에조 냉각홀 등)은 생략하였다.8 shows an embodiment of plasma electrode pattern printing. 8 is a rear view of the control unit, and other configurations (piezo cooling holes, etc.) other than the pattern are omitted.
아울러, 상기 팬은, 공기를 흡입하는 흡기구가 둘 이상 구비되고, 공기를 배출하는 배기구가 하나 이상 구비되어, 상기 케이싱의 외부로부터 들어온 공기가 팬의 제1흡기구로 흡입되어 배기구를 거쳐 플라즈마 발생부로 이동하되, 상기 플라즈마 발생부로 이동한 공기 중 일부는 팬의 제2흡기구로 다시 흡입되도록 구성될 수 있다.In addition, the fan is provided with at least two intake ports for inhaling air, and at least one exhaust port for discharging air, so that the air from the outside of the casing is sucked into the first intake port of the fan and passes through the exhaust port to the plasma generating unit. While moving, some of the air that has moved to the plasma generating unit may be configured to be sucked back through the second intake port of the fan.
도면을 참조하면, 본 발명의 실시 예에서는 두 개의 흡기구 및 하나의 배기구를 구비하고 있다. 다만, 본 발명의 기술적 사상이 위 흡기구 및 배기구의 개수에 한정되는 것은 아니며, 플라즈마 발생부와 접촉한 공기 중 일부를 재흡입하여 다시 플라즈마 발생부와 접촉시키도록 하는 구성이면 본 발명의 기술적 사상에 포함될 수 있다.Referring to the drawings, in an embodiment of the present invention, two intake ports and one exhaust port are provided. However, the technical idea of the present invention is not limited to the number of intake ports and exhaust ports above, and a configuration in which some of the air in contact with the plasma generation unit is re-inhaled to contact the plasma generation unit again is in accordance with the technical idea of the present invention. Can be included.
상기와 같은 구성은, 원심구동팬(centrifugal fan, 遠心-)을 사용하여 구성될 수 있다. 모터 회전축의 양 방향으로부터 공기를 흡입하여 원심력에 의해 원주 방향으로 배출시킬 수 있다.The above configuration may be configured using a centrifugal fan (遠心-). Air can be sucked in from both directions of the motor shaft and discharged in the circumferential direction by centrifugal force.
또한, 상기 케이싱은, 상기 팬에 의해 공기가 유입되는 입구부; 상기 팬의 외주면을 둘러싸며, 팬의 흡기구 및 배기구 이외의 면을 고정하도록 형성되는 팬케이싱부; 상기 팬케이싱부에는 소정의 턱이 구비되어, 제어부가 턱에 접촉하도록 팬케이싱부와 결합되어 팬케이싱부 및 제어부 사이에 공기 통로가 형성될 수 있다.In addition, the casing may include an inlet through which air is introduced by the fan; A pan casing part surrounding the outer circumferential surface of the fan and configured to fix surfaces other than the intake and exhaust ports of the fan; The pan casing portion is provided with a predetermined jaw, and is coupled to the pan casing portion so that the control portion contacts the jaw to form an air passage between the pan casing portion and the control portion.
상기와 같은 공기 통로(123)를 형성시킴으로써, 플라즈마 발생부와 접촉했던 공기가 다시 팬으로 재흡입되는 유로(공기 통로 123→공기 피드백 통로 122→제2흡기구)가 형성될 수 있다.By forming the air passage 123 as described above, a passage (air passage 123 → air feedback passage 122 → second intake port) through which air in contact with the plasma generating portion is re-inhaled back into the fan may be formed.
상기 케이싱부의 일측 이상에 공기 토출 통로(121)가 형성될 수 있다. 이를 따라 공기 배출 유로(배기구 22→공기 토출 통로 121→공기 통로 123)가 형성될 수 있다.An air discharge passage 121 may be formed on one or more sides of the casing part. Accordingly, an air discharge passage (exhaust 22 → air discharge passage 121 → air passage 123) may be formed.
공기 중 일부는 피에조 냉각홀(320)을 통해 제어부 내측을 통과하도록 구성될 수 있으며, 이 경우 공기에 의해 피에조 장치가 냉각될 수 있다. 피에조 장치에는 냉각핀이 형성되어 공기와 접촉 면적을 증가시킴으로써 방열량을 최대화할 수 있다.Some of the air may be configured to pass through the inside of the controller through the piezo cooling hole 320, in which case the piezo device may be cooled by air. A cooling fin is formed in the piezo device to increase the contact area with air, thereby maximizing the amount of heat dissipation.
팬케이싱부 외측에는 팬커버(13)가 구비되어, 공기 청정 장치 내부와 외부를 밀폐시키는 구조가 형성될 수 있다. 팬커버의 내측에는 팬, 팬케이싱부, 제어부, 플라즈마 발생부가 수용될 수 있으며, 입구부(11) 및 출구부(14)의 일부 결합부위가 수용될 수 있다.A fan cover 13 may be provided outside the pan casing to form a structure that seals the inside and the outside of the air purifier. A fan, a pan casing part, a control part, and a plasma generating part may be accommodated inside the fan cover, and some coupling parts of the inlet part 11 and the outlet part 14 may be accommodated.
그리고, 상기 입구부 및 팬 사이에는 1차 필터가 구비되어; 상기 입구부로부터 유입된 공기가 필터링된 상태로 팬에 유입되도록 구성될 수 있다.And, a primary filter is provided between the inlet and the fan; Air introduced from the inlet may be configured to be introduced into the fan in a filtered state.
상기 1차 필터는 헤파필터가 적용될 수 있다. 헤파필터에 의해 공기의 흡입 유량이 일부 줄어드는 현상이 발생할 수 있으며, 이러한 유량 감소는 플라즈마 발생부에서의 환류횟수, 1회접촉당 필터링율 및 재흡기율을 증가시킬 수 있다. 또한 헤파필터를 통해 팬에 유입되는 공기에 포함되어있던 이물질을 미리 제거함으로써, 플라즈마 발생부에서 제거해야 하는 이물질의 총량을 줄여 플라즈마 발생부에 가해지는 부하를 줄일 수 있다.A HEPA filter may be applied as the first filter. A phenomenon in which the intake flow rate of air is partially decreased by the HEPA filter may occur, and this decrease in the flow rate may increase the number of reflux in the plasma generating unit, the filtering rate per contact, and the reintake rate. In addition, by removing foreign substances included in the air flowing into the fan through the HEPA filter in advance, the total amount of foreign substances to be removed from the plasma generating unit can be reduced, thereby reducing the load applied to the plasma generating unit.
아울러, 상기 제어부에는 피에조 장치가 구비되어; 상기 제어부를 통해 입력되는 전원이 피에조 장치를 통해 변환되어 플라즈마 발생부에 2000V 내지 2500V의 전압으로 출력되도록 구성될 수 있다.In addition, the control unit is provided with a piezo device; The power input through the control unit may be converted through a piezo device and may be configured to be output to the plasma generator at a voltage of 2000V to 2500V.
상기 피에조 장치는 세라믹 셀로 구성될 수 있으며, 피에조 장치를 통해 제어부의 크기를 최소화할 수 있다. 플라즈마 발생부의 전압은 2000V 이상으로 높은 편이나, 플라즈마 발생부에서 흐르는 전류는 0.015A(15mA) 이하의 매우 작은 크기이므로(전력 10~14W 가량), 사람이 손으로 플라즈마 발생부를 만지더라도 위해하지 않다. 통상적으로 5mA 이하의 전류는 "자극"으로 느껴지는 정도로, "감전"이 아닌 "감지전류"로 표현되고 있다.The piezo device may be composed of a ceramic cell, and the size of the control unit may be minimized through the piezo device. The voltage of the plasma generator is higher than 2000V, but the current flowing from the plasma generator is very small (about 10~14W of power), so it is not harmful even if a person touches the plasma generator with their hands. . Typically, a current of 5 mA or less is expressed as "sensing current" rather than "electric shock", to the extent that it is felt as "stimulation".
또한, 상기 케이싱은, 20mm 내지 50mm 사이의 두께로 형성될 수 있다.In addition, the casing may be formed to a thickness of between 20mm to 50mm.
상기와 같은 구성을 통해, 플라즈마 공기 청정 장치를 소형화시킬 수 있다. 본 발명의 실시 예에 의하면, 성냥갑과 유사한 크기의 휴대용 공기 청정 장치를 구성할 수 있다. 도 2에 도시된 플라즈마 공기 청정 장치는, W*D*H=40*20*40 (mm)로 구성된 실시 예이다. 상기와 같은 소형 플라즈마 공기 청정 장치는, 케이싱에 고리를 걸어 목걸이 형태 등 휴대용 공기 청정기로 사용할 수 있다. 스마트폰 케이스에 상기와 같은 구성을 적용하는 것도 가능하다.Through the above configuration, it is possible to reduce the size of the plasma air cleaning device. According to an embodiment of the present invention, a portable air cleaner having a size similar to that of a matchbox can be configured. The plasma air cleaning apparatus shown in FIG. 2 is an embodiment of W*D*H=40*20*40 (mm). The small-sized plasma air purifier as described above can be used as a portable air purifier such as a necklace by hanging a ring on the casing. It is also possible to apply the above configuration to the smartphone case.
그리고, 상기와 같은 플라즈마 공기 청정 장치를 복수개 구비하고; 상기 케이싱의 하나 이상의 측면에는, 복수개의 플라즈마 공기 청정 장치가 서로 전원을 공유하도록 연결시키는 모듈연결부가 구비되고; 상기 모듈연결부를 통해 플라즈마 공기 청정 장치 복수개가 결합된 플라즈마 공기 청정 결합체의 일측에 외부 팬이 연결되는; 플라즈마 공기 청정 시스템이 제공된다.In addition, a plurality of plasma air cleaning devices as described above are provided; On one or more side surfaces of the casing, a module connection part for connecting a plurality of plasma air cleaning devices to share power with each other is provided; An external fan is connected to one side of the plasma air cleaning assembly to which a plurality of plasma air cleaning devices are coupled through the module connection portion; A plasma air cleaning system is provided.
상기와 같은 플라즈마 공기 청정 시스템은, 가정용 내지 산업용 공기청정기로 사용될 수 있다.The plasma air cleaning system as described above can be used as a domestic or industrial air purifier.
종래 가정용 공기청정기는 크기(유량)나 기능 등에 따라 다양한 제품군이 상용화되어 판매중이며, 실내 공간의 크기에 맞지 않는(작은) 공기청정기를 사용하는 경우에는 공기청정기를 사용하는 의미가 없을 정도로 효과가 미약해진다.Conventional household air purifiers are commercialized and sold in a variety of product lines depending on their size (flow rate) or function, and when using a (small) air purifier that does not fit the size of the indoor space, the effect is weak enough to make no sense to use an air purifier. It becomes.
본 발명의 실시 예에서는, 공간의 크기에 따라 공기 청정 장치(공기 청정 모듈)을 직렬-병렬로 복수개 연결한 상태로 사용할 수 있으므로, 공간의 크기에 적합한 유량의 공기 청정 장치를 구성할 수 있다. 개별 공기 청정 장치가 종래 공기청정기에 비해 아주 작은 크기로 구성될 수 있으므로, 장소의 크기나 형상에 구애받지 않고 설치할 수 있다. 플라즈마 공기 청정 결합체를 다단으로 구비하여 오염물질 제거율을 극대화할 수도 있다. 개별 플라즈마 공기 청정 장치의 팬 출력이 공간 크기에 비해 작은 경우에는, 출력이 큰 외부 팬을 사용함으로써 시스템 전체의 유량을 적절하게 조절할 수 있다. 외부 팬을 사용하게 되면, 전체 시스템의 유량은 증가하면서도 개별 공기 청정 장치에서 환류공간이 형성되므로, 공기 흡입구/토출구 공간을 균일하게 필터링할 수 있다.In an embodiment of the present invention, since a plurality of air cleaning devices (air cleaning modules) may be connected in series-parallel according to the size of the space, an air cleaning device having a flow rate suitable for the size of the space can be configured. Since the individual air purifier can be configured to have a very small size compared to the conventional air purifier, it can be installed regardless of the size or shape of the place. Plasma air cleaning assembly may be provided in multiple stages to maximize the removal rate of pollutants. When the fan output of the individual plasma air purifier is small compared to the space size, the flow rate of the entire system can be appropriately adjusted by using an external fan with a large output. When an external fan is used, the flow rate of the entire system is increased, and a reflux space is formed in an individual air cleaning device, so that the air inlet/outlet spaces can be uniformly filtered.
각 공기 청정 장치 간 형합성을 맞추기 위하여, 모듈연결부는 케이싱 내측에 수용되고 케이싱의 외부에 모듈연결부를 외부로 노출시키는 구멍이 형성될 수 있다. 이러한 구성에서, 각 공기 청정 장치를 연결하도록 모듈연결부 사이에 커넥터(6)가 결합될 수 있다.In order to match the compatibility between the air cleaning devices, the module connection portion may be accommodated inside the casing, and a hole may be formed on the outside of the casing to expose the module connection portion to the outside. In this configuration, a connector 6 can be coupled between the module connections to connect each air cleaning device.
다른 실시 예에 있어서, 소정의 내부공간 및 공기유로가 형성되는 케이싱; 상기 케이싱 내부에 구비되며, 플라즈마 발생을 위한 전원과 연결되는 제어부; 상기 제어부로부터 전원을 공급받아 플라즈마를 발생시켜, 공기유로를 통해 들어온 소정의 입자를 제거하는 플라즈마 발생부를 포함하는 플라즈마 공기 청정 모듈; 상기 케이싱의 하나 이상의 측면에는, 복수개의 플라즈마 공기 청정 모듈이 서로 전원을 공유하도록 연결시키는 모듈연결부가 구비되고; 상기 모듈연결부를 통해 플라즈마 공기 청정 모듈 복수개가 결합된 플라즈마 공기 청정 결합체의 일측에 외부 팬이 연결되는; 플라즈마 공기 청정 장치가 제공된다.In another embodiment, a casing in which a predetermined internal space and an air flow path are formed; A control unit provided inside the casing and connected to a power source for generating plasma; A plasma air cleaning module including a plasma generating unit configured to generate plasma by receiving power from the control unit to remove predetermined particles entering through an air flow path; At least one side surface of the casing is provided with a module connector for connecting a plurality of plasma air cleaning modules to share power with each other; An external fan is connected to one side of the plasma air cleaning assembly to which a plurality of plasma air cleaning modules are coupled through the module connection portion; A plasma air cleaning device is provided.
이하, 도 7을 참조하여 종래 공기 청정 장치와 본 발명의 실시 예를 비교한다. 1차 필터로 인한 필터링 양은 간략화를 위하여 제외하고 비교한다.Hereinafter, referring to FIG. 7, a conventional air cleaning device and an embodiment of the present invention are compared. The amount of filtering due to the first order filter is excluded and compared for simplicity.
Q는 공기 청정 장치를 통과하는 공기의 유량(LPS, Liter Per Seconds; 단위시간당 단위부피), a는 공기 청정 장치에 투입되는 오염 물질의 질량(g/s, gram per seconds; 단위시간당 단위질량), r은 플라즈마 발생부와 접촉했던 공기가 다시 팬으로 재흡기되는 비율을 나타내는 재흡기율(%), f는 플라즈마 발생부와 공기의 1회 접촉 시 제거되는 오염물질의 비율(%), e는 환류공간에서 와류/난류 등으로 인해 공기와 플라즈마 발생부가 접촉하는 횟수를 의미할 수 있다.Q is the flow rate of air passing through the air purifier (LPS, Liter Per Seconds; unit volume per unit time), a is the mass of pollutants injected into the air purifier (g/s, gram per seconds; unit mass per unit time) , r is the reintake rate (%) representing the rate at which the air in contact with the plasma generating unit is re-inhaled by the fan, f is the proportion of contaminants removed when the plasma generating unit and air are in contact with one time (%), e May mean the number of times the air and the plasma generator contact the air due to eddy flow/turbulence in the reflux space.
종래 공기 청정 장치에서는 흡입되는 유량이 그대로 외부로 토출되며, 공기 및 플라즈마 발생부의 접촉이 1회 발생하므로 출력단에서의 오염물질 양이 (1-f)a로 표현될 수 있다.In the conventional air cleaning apparatus, the suction flow rate is discharged to the outside as it is, and since the contact between the air and the plasma generator occurs once, the amount of pollutants at the output terminal can be expressed as (1-f)a.
본 발명의 실시 예에 따른 공기 청정 장치에서는 흡입되는 유량 중 일부(rQ)가 팬으로 재흡입되어 공기 통로를 통해 다시 플라즈마 발생부로 토출((1+r)Q)되며, 환류공간에서 와류/난류의 정도에 따라 공기-플라즈마 발생부 간 복수회(e) 접촉이 발생한다. 재흡입되는 공기에 포함되는 오염물질의 양은 r(1-ef)a로 표현되며, 출력단에서의 오염물질 양은 (1-ef)(1-r)a로 표현될 수 있다.In the air cleaning device according to the embodiment of the present invention, some of the suctioned flow rate (rQ) is re-sucked into the fan and discharged ((1+r)Q) back to the plasma generation unit through the air passage, and vortex/turbulence in the reflux space Depending on the degree of, (e) contact occurs multiple times between the air-plasma generator. The amount of pollutants contained in the re-inhaled air is expressed as r(1-ef)a, and the amount of pollutants in the output terminal may be expressed as (1-ef)(1-r)a.
아래 표 1은, 1회 접촉당 오염물질 제거율(f) 20%, 환류 횟수(e) 1회일 때, 재흡기율(r)을 변화시키며 기존 공기 청정 장치에 의한 토출 오염물질량[(1-f), 공기 청정 장치에 투입된 오염 물질의 질량 대비, %] 대비 본 발명의 실시 예에 의한 토출 오염물질량[(1-ef)(1-r), 공기 청정 장치에 투입된 오염 물질의 질량 대비, %]을 비교한 것이다.Table 1 below shows the pollutant removal rate (f) 20% per contact and the number of times of reflux (e) to change the reintake rate (r), and the amount of pollutants discharged by the existing air cleaning device [(1-f ), the amount of pollutants discharged according to an embodiment of the present invention compared to the mass of the pollutants injected into the air cleaning device [(1-ef)(1-r), compared to the mass of the pollutants injected into the air cleaning device, %] ].
rr ff ee 1-f1-f (1-ef)(1-r)(1-ef)(1-r) 개선율Improvement rate
0.10.1 0.20.2 1One 0.80.8 0.720.72 0.10.1
0.20.2 0.20.2 1One 0.80.8 0.640.64 0.20.2
0.30.3 0.20.2 1One 0.80.8 0.560.56 0.30.3
0.40.4 0.20.2 1One 0.80.8 0.480.48 0.40.4
0.50.5 0.20.2 1One 0.80.8 0.40.4 0.50.5
0.60.6 0.20.2 1One 0.80.8 0.320.32 0.60.6
0.70.7 0.20.2 1One 0.80.8 0.240.24 0.70.7
0.80.8 0.20.2 1One 0.80.8 0.160.16 0.80.8
0.90.9 0.20.2 1One 0.80.8 0.080.08 0.90.9
아래 표 2는, 재흡기율(r) 50%, 환류 횟수(e) 1회일 때, 1회 접촉당 오염물질 제거율(f)을 변화시키며 기존 공기 청정 장치에 의한 토출 오염물질량[(1-f), 공기 청정 장치에 투입된 오염 물질의 질량 대비, %] 대비 본 발명의 실시 예에 의한 토출 오염물질량[(1-ef)(1-r), 공기 청정 장치에 투입된 오염 물질의 질량 대비, %]을 비교한 것이다.Table 2 below shows a change in the pollutant removal rate (f) per contact when the reintake rate (r) is 50% and the number of reflux times (e) is once, and the amount of pollutants discharged by the existing air cleaning device [(1-f ), the amount of pollutants discharged according to the embodiment of the present invention compared to the mass of the pollutants injected into the air cleaning device, %] [(1-ef)(1-r), compared to the mass of the pollutants injected into the air cleaning device,% ].
재흡기율에 비례하여 개선율[(기존 제거율-본 발명 제거율)/기존 제거율]이 증가함을 확인할 수 있다.It can be seen that the improvement rate [(existing removal rate-present invention removal rate)/existing removal rate] increases in proportion to the re-absorption rate.
rr ff ee 1-f1-f (1-ef)(1-r)(1-ef)(1-r) 개선율Improvement rate
0.50.5 0.10.1 1One 0.90.9 0.450.45 0.50.5
0.50.5 0.20.2 1One 0.80.8 0.40.4 0.50.5
0.50.5 0.30.3 1One 0.70.7 0.350.35 0.50.5
0.50.5 0.40.4 1One 0.60.6 0.30.3 0.50.5
0.50.5 0.50.5 1One 0.50.5 0.250.25 0.50.5
0.50.5 0.60.6 1One 0.40.4 0.20.2 0.50.5
0.50.5 0.70.7 1One 0.30.3 0.150.15 0.50.5
0.50.5 0.80.8 1One 0.20.2 0.10.1 0.50.5
0.50.5 0.90.9 1One 0.10.1 0.050.05 0.50.5
아래 표 3은, 재흡기율(r) 50%, 1회 접촉당 오염물질 제거율(f) 40%일 때, 환류 횟수(e)를 기존 공기 청정 장치에 의한 토출 오염물질량[(1-f), 공기 청정 장치에 투입된 오염 물질의 질량 대비, %] 대비 본 발명의 실시 예에 의한 토출 오염물질량[(1-ef)(1-r), 공기 청정 장치에 투입된 오염 물질의 질량 대비, %]을 비교한 것이다.Table 3 below shows the number of reflux times (e) when the re-intake rate (r) is 50% and the pollutant removal rate per contact (f) 40%, the amount of pollutants discharged by the existing air cleaning device [(1-f) , Amount of pollutants discharged according to an embodiment of the present invention compared to the mass of pollutants injected into the air cleaning device, %] [(1-ef)(1-r), compared to the mass of pollutants injected into the air cleaning device, %] Is a comparison.
1회 접촉당 오염물질 제거율은 개선율과 독립적임을 확인할 수 있다. 오염물질 제거율이 더 개선된 플라즈마 발생부를 사용할수록 더 좋은 효과를 얻을 수 있을 것이다.It can be seen that the pollutant removal rate per contact is independent of the improvement rate. The more the plasma generator with improved pollutant removal rate is used, the better the effect will be obtained.
rr ff ee 1-f1-f (1-ef)(1-r)(1-ef)(1-r) 개선율Improvement rate
0.50.5 0.40.4 1One 0.60.6 0.30.3 0.50.5
0.50.5 0.40.4 1.21.2 0.60.6 0.260.26 0.5666670.566667
0.50.5 0.40.4 1.41.4 0.60.6 0.220.22 0.6333330.633333
0.50.5 0.40.4 1.61.6 0.60.6 0.180.18 0.70.7
0.50.5 0.40.4 1.81.8 0.60.6 0.140.14 0.7666670.766667
0.50.5 0.40.4 22 0.60.6 0.10.1 0.8333330.833333
0.50.5 0.40.4 2.22.2 0.60.6 0.060.06 0.90.9
0.50.5 0.40.4 2.42.4 0.60.6 0.020.02 0.9666670.966667
0.50.5 0.40.4 2.62.6 0.60.6 -0.02-0.02 1.0333331.033333
환류 횟수가 2.4회를 초과하는 경우에는 오염물질이 이론상 100% 제거됨을 확인할 수 있다. 환류 횟수가 0.2회 증가할 때마다 개선율이 6% 가량 증가하는 것을 확인할 수 있다. 실제 장치에서 환류 횟수나 재흡기율 등을 직접 측정하는 것은 어려우나, 기존 장치 대비 본 발명의 실시 예에 의한 장치 간 오염물질 제거율을 측정하여 간접적으로 환류 횟수 및 재흡기율을 추정할 수 있다.If the number of reflux exceeds 2.4, it can be confirmed that 100% of contaminants are theoretically removed. It can be seen that every 0.2 times the number of reflux increases, the improvement rate increases by about 6%. Although it is difficult to directly measure the number of reflux or reintake rate in an actual device, it is possible to indirectly estimate the number of reflux and reintake rate by measuring the pollutant removal rate between devices according to an embodiment of the present invention compared to the existing device.
환류 횟수는 각 공기 성분 입자들의 평균 환류 횟수를 의미할 수 있다. 평균값이기 때문에 횟수임에도 상기와 같이 소수점의 횟수로 가정하여 설계하는 것이 가능하다.The number of reflux may mean the average number of reflux of each air component particle. Since it is an average value, it is possible to design by assuming the number of decimal points as described above, even though it is a number of times.
종래 장치의 오염물질 제거율을 감안하면, 환류공간의 형성에 따른 현저한 효과를 확인할 수 있다. 장치의 크기는 기존 대비 작게 구성할 수 있으면서도 오염물질 제거율은 향상시켰다는 점에서 종래 기술과 현저한 차이가 있다.Considering the pollutant removal rate of the conventional apparatus, it is possible to confirm the remarkable effect of the formation of the reflux space. There is a remarkable difference from the prior art in that the size of the device can be configured to be smaller than that of the existing one, but the pollutant removal rate is improved.
아래 표 4는, 재흡기율(r)을 20%부터 60%까지 10%씩, 1회 접촉당 오염물질 제거율(f)을 20%부터 50%까지 10%씩, 환류 횟수(e)를 1.2회부터 2회까지 0.2회씩 변화시키며 기존 공기 청정 장치에 의한 토출 오염물질량[(1-f), 공기 청정 장치에 투입된 오염 물질의 질량 대비, %] 대비 본 발명의 실시 예에 의한 토출 오염물질량[(1-ef)(1-r), 공기 청정 장치에 투입된 오염 물질의 질량 대비, %]을 비교하고, 그 중 토출 오염물질량이 20% 이하인 경우를 선별적으로 나타낸 것이다.Table 4 below shows that the reintake rate (r) is 10% from 20% to 60%, the pollutant removal rate (f) per contact is 10% from 20% to 50%, and the number of reflux (e) is 1.2. The amount of pollutants discharged by the existing air cleaning device [(1-f), compared to the mass of the pollutant injected into the air cleaning device, %] is changed by 0.2 times from times to twice. (1-ef)(1-r), compared to the mass of pollutants injected into the air cleaning device, %], and selectively shows the case where the discharged pollutant amount is 20% or less.
상기 "재흡기율(r)을 20%부터 60%까지 10%씩, 1회 접촉당 오염물질 제거율(f)을 20%부터 50%까지 10%씩, 환류 횟수(e)를 1.2회부터 2회까지"의 범위는 통상의 기술자가 본 발명의 명세서를 참조하여 용이하게 실시할 수 있는 범위일 수 있다.The "reintake rate (r) is 10% from 20% to 60%, the pollutant removal rate (f) per contact is 10% from 20% to 50%, and the number of reflux (e) is from 1.2 to 2 The range of "up to times" may be a range that a person skilled in the art can easily implement with reference to the specification of the present invention.
rr ff ee 1-f1-f (1-ef)(1-r)(1-ef)(1-r) 개선율Improvement rate
0.20.2 0.50.5 1.61.6 0.50.5 0.160.16 0.680.68
0.20.2 0.50.5 1.81.8 0.50.5 0.080.08 0.840.84
0.20.2 0.40.4 22 0.60.6 0.160.16 0.7333330.733333
0.20.2 0.50.5 22 0.50.5 00 1One
0.30.3 0.50.5 1.61.6 0.50.5 0.140.14 0.720.72
0.30.3 0.40.4 1.81.8 0.60.6 0.1960.196 0.6733330.673333
0.30.3 0.50.5 1.81.8 0.50.5 0.070.07 0.860.86
0.30.3 0.40.4 22 0.60.6 0.140.14 0.7666670.766667
0.30.3 0.50.5 22 0.50.5 00 1One
0.40.4 0.50.5 1.41.4 0.50.5 0.180.18 0.640.64
0.40.4 0.50.5 1.61.6 0.50.5 0.120.12 0.760.76
0.40.4 0.40.4 1.81.8 0.60.6 0.1680.168 0.720.72
0.40.4 0.50.5 1.81.8 0.50.5 0.060.06 0.880.88
0.40.4 0.40.4 22 0.60.6 0.120.12 0.80.8
0.40.4 0.50.5 22 0.50.5 00 1One
0.50.5 0.50.5 1.21.2 0.50.5 0.20.2 0.60.6
0.50.5 0.50.5 1.41.4 0.50.5 0.150.15 0.70.7
0.50.5 0.40.4 1.61.6 0.60.6 0.180.18 0.70.7
0.50.5 0.50.5 1.61.6 0.50.5 0.10.1 0.80.8
0.50.5 0.40.4 1.81.8 0.60.6 0.140.14 0.7666670.766667
0.50.5 0.50.5 1.81.8 0.50.5 0.050.05 0.90.9
0.50.5 0.30.3 22 0.70.7 0.20.2 0.7142860.714286
0.50.5 0.40.4 22 0.60.6 0.10.1 0.8333330.833333
0.50.5 0.50.5 22 0.50.5 00 1One
0.60.6 0.50.5 1.21.2 0.50.5 0.160.16 0.680.68
0.60.6 0.40.4 1.41.4 0.60.6 0.1760.176 0.7066670.706667
0.60.6 0.50.5 1.41.4 0.50.5 0.120.12 0.760.76
0.60.6 0.40.4 1.61.6 0.60.6 0.1440.144 0.760.76
0.60.6 0.50.5 1.61.6 0.50.5 0.080.08 0.840.84
0.60.6 0.30.3 1.81.8 0.70.7 0.1840.184 0.7371430.737143
0.60.6 0.40.4 1.81.8 0.60.6 0.1120.112 0.8133330.813333
0.60.6 0.50.5 1.81.8 0.50.5 0.040.04 0.920.92
0.60.6 0.30.3 22 0.70.7 0.160.16 0.7714290.771429
0.60.6 0.40.4 22 0.60.6 0.080.08 0.8666670.866667
0.60.6 0.50.5 22 0.50.5 00 1One
상기 표 4에서는, 재흡기율(r)이 작은 경우(20%)에도 환류 횟수를 1.6회 이상으로 형성시키면 오염물질을 80% 이상 제거할 수 있음을 확인할 수 있다. 또한, 재흡기율(r)이 높다면(60%) 플라즈마 발생부의 성능이 떨어지더라도(30%) 오염물질을 80% 이상 제거하도록 구성할 수 있다.In Table 4, it can be seen that even when the re-absorption rate r is small (20%), if the number of reflux is formed to be 1.6 or more, contaminants can be removed by 80% or more. In addition, if the re-absorption rate r is high (60%), even if the performance of the plasma generating unit is degraded (30%), it may be configured to remove more than 80% of contaminants.
* 부호의 설명* Explanation of the sign
1 : 케이싱, 플라즈마 공기 청정 모듈, 플라즈마 공기 청정 장치1: casing, plasma air cleaning module, plasma air cleaning device
1' : 플라즈마 공기 청정 결합체1': Plasma air cleaning assembly
11 : 입구부 12 : 팬케이싱부11: inlet part 12: pan casing part
120 : 턱 121 : 공기 토출 통로120: jaw 121: air discharge passage
122 : 공기 피드백 통로122: air feedback passage
123 : 공기 통로(제어부-팬케이싱 사이 간격)123: air passage (the gap between the control unit and the pan casing)
13 : 팬커버 14 : 출구부13: fan cover 14: outlet
2 : 팬 211 : 제1흡기구2: fan 211: first intake port
212 : 제2흡기구 22 : 배기구212: second intake port 22: exhaust port
3 : 제어부 31 : 전극부3: control unit 31: electrode unit
32 : 피에조 장치 33 : 모듈연결부32: piezo device 33: module connection
320 : 피에조 냉각홀 34 : 패턴320: piezo cooling hole 34: pattern
4 : 플라즈마 발생부 40 : 유통 홀4: plasma generation unit 40: distribution hole
5 : 1차 필터5: 1st filter
6 : 커넥터 7 : 외부 팬6: connector 7: external fan
I : 외부로부터 들어온 공기I: Air from outside
F : 피드백 공기(플라즈마 발생부로부터 환류된 공기)F: Feedback air (air refluxed from the plasma generator)
R : 환류공간 O : 토출되는 공기R: Reflux space O: Discharged air

Claims (12)

  1. 소정의 내부공간 및 공기유로가 형성되는 케이싱;A casing in which a predetermined internal space and an air flow path are formed;
    상기 케이싱의 내측에 결합되어 공기를 유동시키는 팬;A fan coupled to the inner side of the casing to flow air;
    상기 팬을 제어하는 제어부;A control unit for controlling the fan;
    상기 제어부로부터 전원을 공급받아 플라즈마를 발생시켜, 공기유로를 통해 들어온 소정의 입자를 제거하는 플라즈마 발생부를 포함하고;And a plasma generator configured to generate plasma by receiving power from the control unit to remove predetermined particles entering through an air flow path;
    상기 플라즈마 발생부로부터 소정의 범위 내에 환류공간이 형성되어;A reflux space is formed within a predetermined range from the plasma generating unit;
    상기 환류공간에서 플라즈마 발생부 및 공기 사이에 복수회 접촉이 가능하도록 구성되는, 플라즈마 공기 청정 장치Plasma air cleaning apparatus configured to allow contact between the plasma generator and air in the reflux space multiple times
  2. 청구항 1항에 있어서,The method of claim 1,
    상기 플라즈마 발생부는,The plasma generation unit,
    상기 제어부의 일측에 제어부로부터 소정의 길이만큼 돌출되도록 형성되는 전극부와 연결되어, 플라즈마 발생부 및 제어부 사이에 소정의 공간이 형성되는, 플라즈마 공기 청정 장치The plasma air cleaning apparatus is connected to an electrode portion formed to protrude from the control unit by a predetermined length on one side of the control unit, and a predetermined space is formed between the plasma generating unit and the control unit
  3. 청구항 1항에 있어서,The method of claim 1,
    상기 플라즈마 발생부는,The plasma generation unit,
    상기 제어부의 일측에 소정의 패턴으로 프린팅된 플라즈마 전극 형태로 형성되는, 플라즈마 공기 청정 장치Plasma air cleaning apparatus formed in the form of a plasma electrode printed in a predetermined pattern on one side of the control unit
  4. 청구항 1항에 있어서,The method of claim 1,
    상기 팬은,The fan,
    공기를 흡입하는 흡기구가 둘 이상 구비되고,Two or more intake ports for inhaling air are provided,
    공기를 배출하는 배기구가 하나 이상 구비되어,At least one exhaust port for discharging air is provided,
    상기 케이싱의 외부로부터 들어온 공기가 팬의 제1흡기구로 흡입되어 배기구를 거쳐 플라즈마 발생부로 이동하되,Air entering from the outside of the casing is sucked into the first intake port of the fan and moves to the plasma generating unit through the exhaust port,
    상기 플라즈마 발생부로 이동한 공기 중 일부는 팬의 제2흡기구로 다시 흡입되는; 플라즈마 공기 청정 장치Some of the air that has moved to the plasma generating unit is sucked back through the second intake port of the fan; Plasma air cleaner
  5. 청구항 1항에 있어서,The method of claim 1,
    상기 케이싱은,The casing,
    상기 팬에 의해 공기가 유입되는 입구부;An inlet through which air is introduced by the fan;
    상기 팬의 외주면을 둘러싸며, 팬의 흡기구 및 배기구 이외의 면을 고정하도록 형성되는 팬케이싱부;A pan casing part surrounding the outer circumferential surface of the fan and configured to fix surfaces other than the intake and exhaust ports of the fan;
    상기 팬케이싱부에는 소정의 턱이 구비되어, 제어부가 턱에 접촉하도록 팬케이싱부와 결합되어 팬케이싱부 및 제어부 사이에 공기 통로가 형성되는, 플라즈마 공기 청정 장치The pan casing portion is provided with a predetermined jaw, the control unit is coupled to the pan casing portion to contact the jaw to form an air passage between the pan casing portion and the control unit, plasma air cleaning apparatus
  6. 청구항 5항에 있어서,The method of claim 5,
    상기 입구부 및 팬 사이에는 1차 필터가 구비되어;A primary filter is provided between the inlet and the fan;
    상기 입구부로부터 유입된 공기가 필터링된 상태로 팬에 유입되는, 플라즈마 공기 청정 장치Plasma air cleaning device in which air introduced from the inlet is filtered and introduced into a fan
  7. 청구항 1항에 있어서,The method of claim 1,
    상기 제어부에는 피에조 장치가 구비되어;The control unit is provided with a piezo device;
    상기 제어부를 통해 입력되는 전원이 피에조 장치를 통해 변환되어 플라즈마 발생부에 2000V 내지 2500V의 전압으로 출력되는, 플라즈마 공기 청정 장치A plasma air cleaning device in which power input through the control unit is converted through a piezo device and output to a plasma generator at a voltage of 2000V to 2500V.
  8. 청구항 1항에 있어서,The method of claim 1,
    상기 케이싱은, 20mm 내지 50mm 사이의 두께로 형성되는, 플라즈마 공기 청정 장치The casing is formed to a thickness between 20mm to 50mm, plasma air cleaning device
  9. 소정의 내부공간 및 공기유로가 형성되는 케이싱;A casing in which a predetermined internal space and an air flow path are formed;
    상기 케이싱 내부에 구비되며, 플라즈마 발생을 위한 전원과 연결되는 제어부;A control unit provided inside the casing and connected to a power source for generating plasma;
    상기 제어부로부터 전원을 공급받아 플라즈마를 발생시켜, 공기유로를 통해 들어온 소정의 입자를 제거하는 플라즈마 발생부를 포함하는 플라즈마 공기 청정 모듈;A plasma air cleaning module including a plasma generating unit configured to generate plasma by receiving power from the control unit to remove predetermined particles entering through an air flow path;
    상기 케이싱의 하나 이상의 측면에는, 복수개의 플라즈마 공기 청정 모듈이 서로 전원을 공유하도록 연결시키는 모듈연결부가 구비되고;At least one side surface of the casing is provided with a module connector for connecting a plurality of plasma air cleaning modules to share power with each other;
    상기 모듈연결부를 통해 플라즈마 공기 청정 모듈 복수개가 결합된 플라즈마 공기 청정 결합체의 일측에 외부 팬이 연결되는; 플라즈마 공기 청정 장치An external fan is connected to one side of the plasma air cleaning assembly to which a plurality of plasma air cleaning modules are coupled through the module connection portion; Plasma air cleaner
  10. 청구항 1항 내지 8항 중 어느 한 항의 플라즈마 공기 청정 장치를 복수개 구비하고;Comprising a plurality of plasma air cleaning devices according to any one of claims 1 to 8;
    상기 케이싱의 하나 이상의 측면에는, 복수개의 플라즈마 공기 청정 장치가 서로 전원을 공유하도록 연결시키는 모듈연결부가 구비되고;On one or more side surfaces of the casing, a module connection part for connecting a plurality of plasma air cleaning devices to share power with each other is provided;
    상기 모듈연결부를 통해 플라즈마 공기 청정 장치 복수개가 결합된 플라즈마 공기 청정 결합체의 일측에 외부 팬이 연결되는; 플라즈마 공기 청정 시스템An external fan is connected to one side of the plasma air cleaning assembly to which a plurality of plasma air cleaning devices are coupled through the module connection portion; Plasma air cleaning system
  11. 청구항 1항 내지 8항 중 어느 한 항의 플라즈마 공기 청정 장치를 포함하는, 휴대용 공기 청정 장치A portable air cleaning device comprising the plasma air cleaning device of any one of claims 1 to 8
  12. 청구항 1항 내지 8항 중 어느 한 항의 플라즈마 공기 청정 장치를 포함하는, 목걸이형 공기 청정 장치A necklace-type air cleaning device comprising the plasma air cleaning device of any one of claims 1 to 8
PCT/KR2019/016247 2019-09-11 2019-11-25 Plasma air cleaning device and system WO2021049714A1 (en)

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