WO2021047117A1 - Assembly method for ultrasonic fingerprint sensing module and assembly structure thereof - Google Patents

Assembly method for ultrasonic fingerprint sensing module and assembly structure thereof Download PDF

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Publication number
WO2021047117A1
WO2021047117A1 PCT/CN2019/129866 CN2019129866W WO2021047117A1 WO 2021047117 A1 WO2021047117 A1 WO 2021047117A1 CN 2019129866 W CN2019129866 W CN 2019129866W WO 2021047117 A1 WO2021047117 A1 WO 2021047117A1
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Prior art keywords
ultrasonic fingerprint
sensor module
base
fingerprint sensor
display
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PCT/CN2019/129866
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French (fr)
Chinese (zh)
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王地宝
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神盾股份有限公司
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Publication of WO2021047117A1 publication Critical patent/WO2021047117A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing

Definitions

  • the present disclosure relates to an assembling method and an assembling structure, and in particular to an assembling method and an assembling structure of an ultrasonic fingerprint sensing module.
  • fingerprint identification technology Due to the high degree of uniqueness of fingerprint patterns that vary from person to person, fingerprint identification technology is currently the most widely used biometric identification technology.
  • the principle of fingerprint recognition is to extract unique characteristic information of different fingerprints through fingerprint sensing modules and fingerprint recognition software, and finally obtain the recognition results through a comparison algorithm to determine the identity of the fingerprint owner.
  • the fingerprint sensor module is placed under the display is the future design trend, which is the so-called embedded fingerprint recognition (Fingerprint On Display, FOD).
  • FOD Fingerprint On Display
  • the ultrasonic fingerprint sensor module has the advantages of not requiring a display light source, and strong ultrasonic penetration, not affected by light, and high anti-stain ability. It can recognize wet and dirty fingers, and can also recognize duplicate fingerprints. , The security is also higher.
  • the technical concept is to add a sensing module behind the display panel, and fingerprint images can be captured at any position on the display panel. Therefore, the performance and recognition are higher than other solutions.
  • FIG 1 is a schematic diagram of an existing ultrasonic fingerprint sensor module integrated into a smart phone.
  • the smart phone 1 can be simply divided into two parts: the back cover 10 and the display 11.
  • the ultrasonic fingerprint sensor module 12 In order to ensure the ultrasonic transmission efficiency, the ultrasonic fingerprint sensor module 12 must be closely attached to the back of the display 11, usually with adhesive 13 to complete the attachment between the two, but this attachment method hardly allows heavy work. Because heavy labor destroys the sensing structure on the top of the ultrasonic fingerprint sensing module 12, once the bonding fails, even the display 11 will be scrapped together.
  • the main purpose of the present disclosure is to provide an assembling method and an assembling structure of an ultrasonic fingerprint sensor module, so as to solve the above-mentioned shortcomings in the use of the prior art.
  • an assembling method of an ultrasonic fingerprint sensor module which includes: joining a base to a surface of an ultrasonic fingerprint sensor module, the base having a compressive elastic restoring force; and The ultrasonic fingerprint sensor module and the base are fixed with a display and a back cover, wherein the display is used to press against the surface of the ultrasonic fingerprint sensor module, so that the elasticity of the base presses against the rear On the surface of the cover, a close fit between the base and the surface of the back cover is thereby completed to complete the position fixation.
  • an assembly structure of an ultrasonic fingerprint sensor module which includes: an ultrasonic fingerprint sensor module; a base joined to a surface of the ultrasonic fingerprint sensor module, the base having compression Elastic restoring force; and a display and a back cover for fixing the ultrasonic fingerprint sensor module and the base, wherein the display is pressed against the surface of the ultrasonic fingerprint sensor module to make the base elastic Abutting on the surface of the back cover, so as to complete the close fit of the base and the surface of the back cover to complete the fixation of the position.
  • the effect of the invention of the present disclosure can overcome the yield problem when the ultrasonic fingerprint sensor module is assembled with the display in conventional methods, and therefore, the main purpose of developing the present disclosure can be effectively achieved.
  • Figure 1 It is a schematic diagram of an existing ultrasonic fingerprint sensor module integrated into a smart phone.
  • Fig. 2 is a schematic flow chart of an assembling method of an ultrasonic fingerprint sensor module according to an embodiment of the present disclosure.
  • Fig. 3 is an exploded schematic diagram of the assembly of the ultrasonic fingerprint sensor module and the display according to an embodiment of the present disclosure.
  • Fig. 4 is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to an embodiment of the disclosure.
  • Fig. 5 This is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to another embodiment of the present disclosure.
  • Fig. 6 is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to another embodiment of the present disclosure.
  • FIG. 2, FIG. 3 and FIG. 4 are respectively an exploded schematic diagram of an assembling method and structure of an ultrasonic fingerprint sensor module according to an embodiment of the present disclosure.
  • the following steps may be included: covering the upper surface 221 of the ultrasonic fingerprint sensing module 22 with a protective structure layer 220 (step 21).
  • the upper surface 221 is a side close to the display 23, and the protective structure layer 220 may be composed of at least one thin polymer layer (POLYMER), the thickness of which is about 2-20 microns, and the protective structure
  • POLYMER thin polymer layer
  • the material of the layer 220 can be a polyfluorocarbon (CxFy) polymer or other polymers (for example, poly(methyl methacrylate), PMMA for short), SU-8 photoresist or polydimethyl methacrylate. Polydimethylsiloxane (PDMS for short) and other polymers such as one or any combination thereof, the present disclosure is not limited thereto.
  • the function of the protective structure layer 220 also needs to consider the function of sound wave transmission.
  • the ultrasonic fingerprint sensing module 22 can transmit and receive ultrasonic waves, and detect fingerprints placed above the display 23 (not shown).
  • the ultrasonic fingerprint sensor module 22 is in contact with the display 23 through the protective structure layer 220, in the selection of the contact position, the better sound wave transmission path in the display 23 structure and the better sound wave transmission in the display 23 structure can be selected. Material.
  • the material of the base 21 can be silicone, rubber, etc., with compressive elastic restoring force. Of course, there can also be other materials, such as other various compound elastomers containing carbon, hydrogen, oxygen and silicon. Since the lower surface 222 of the ultrasonic fingerprint sensor module 22 does not have important components such as ultrasonic transmitters and receivers, the upper surface 211 of the base 21 and the lower surface 222 of the ultrasonic fingerprint sensor module 22 can be completed by adhesives. fit.
  • the ultrasonic fingerprint sensor module 22 attached to the base 21 can be fixed at a preset position of the back cover 20 by a lower strength method (for example, the cooperation of release agents and adhesives). On, ready for the next step of assembly.
  • a lower strength method for example, the cooperation of release agents and adhesives.
  • the base 21 and the back cover 20 can also be attached without glue, but directly placed in a preset position to wait for the next step of assembly.
  • the base 21 can also be specially selected from materials with sound absorption capabilities in this frequency range (for example, polymers can be doped with inorganic fine particles: metal materials, Tungsten carbide (WC), tungsten boride (WB), tungsten nitride (WN), ferrite, diamond, graphite, silicon carbide (SIC), aluminum nitride (A1N), boron nitride (BN) and alumina (Al2O3), etc., and the metal material contains tungsten (W) to complete, or is additionally coated with sound-absorbing paint.
  • the structure can also be an irregular surface that is less likely to reflect sound waves or other conducive Sound-absorbing three-dimensional structure (for example, a phononic crystal with a periodic structure in the thickness direction).
  • step 23 to tightly assemble and fix the display 23 and the back cover 20, for example, using fixing elements such as screws to complete the joining, so that the elasticity of the base 21 can be used.
  • the lower surface 212 of the base 21 is pressed against the circuit element 200 of the back cover 20 to complete the close fit between the base 21 and the circuit element 200 to complete the strengthening and fixing of the position. Because of the softness and elasticity of the base 21, the lower surface of the base 21 can adapt to the uneven surface of the circuit element 200. Moreover, the compression restoring force F of the base 21 (shown in FIG.
  • the method of the present disclosure does not need to fix the ultrasonic fingerprint sensor module 22 to the display 23 by bonding, and the low-strength bonding between the base 21 and the back cover 20 (for example, the cooperation of the release agent and the adhesive) and the ultrasonic fingerprint
  • the non-fitting between the sensing module 22 and the display 23 can allow multiple position adjustments during assembly, which not only increases assembly accuracy but also avoids losses caused by lower yield.
  • the material of the protective structure layer 220 may be a material with favorable sound conduction characteristics, such as sound A material whose impedance can be matched with the upper and lower layers of materials. More specifically, in one embodiment, the acoustic impedance of the protective structure layer 220 and the acoustic impedance of the lower surface of the display 23 may have a specific proportional relationship. For example, the acoustic impedance of the protective structure layer 220 is between the ultrasonic fingerprint Between the sound impedance value of the sensing module 22 itself and the sound impedance value of the lower surface of the display 23.
  • FIG. 4 The schematic diagram of the structure after the assembly is as shown in FIG. 4.
  • the reference numbers are the same as those in FIG. 3, and only the position and appearance of the fixing element 40 for tightly fitting the display 23 and the back cover 20 are drawn.
  • the screws can be arranged at the four corners and sides. The force generated by fixing with the screw hole completes the assembly between the display 23 and the back cover 20.
  • FIG. 5 is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to another embodiment of the present disclosure.
  • the support structure 50 fixed under the ultrasonic fingerprint sensor module 22 has stronger resistance to deformation, and the support structure 50 uses fixing elements (such as screws) 51 to complete the position with the back cover 20
  • the base 52 with elasticity can produce a pressing force in response to the deformation of the circuit element 200 on the back cover 20, and the ultrasonic fingerprint sensor module 22 can be tightly joined to the display 23 in the vertical direction.
  • the fixing element 51 also needs to consider the elimination of resonance to improve the purity of the overall ultrasonic signal transmission.
  • the support structure 50 can also specially select materials with sound absorption capacity in this frequency range.
  • the structure can also be an irregular surface that is less likely to reflect sound waves or other three-dimensional structures (for example, with Phononic crystal with periodic structure in the thickness direction).
  • FIG. 6 is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to another embodiment of the disclosure.
  • a vibration-absorbing material layer 60 is provided between the supporting structure 50 and the ultrasonic fingerprint sensing module 22.
  • the support structure 50 under the ultrasonic fingerprint sensor module 22 has a strong resistance to deformation, and the vibration-absorbing material layer 60 is used to reduce the interference caused by the reflection of ultrasonic waves, and the sound with this frequency band can be specially selected.
  • Absorbent materials for example, polymers doped with inorganic fine particles: metal materials, tungsten carbide (WC), tungsten boride (WB), tungsten nitride (WN), ferrite, diamond, graphite, carbide Vibration absorbing materials made of silicon (SIC), aluminum nitride (A1N), boron nitride (BN) and aluminum oxide (Al2O3), and the metal material contains tungsten (W) to complete, the structure can also be less easy Irregular surfaces reflecting sound waves or other three-dimensional structures (for example, phononic crystals with periodic structures in the thickness direction).
  • metal materials for example, polymers doped with inorganic fine particles: metal materials, tungsten carbide (WC), tungsten boride (WB), tungsten nitride (WN), ferrite, diamond, graphite, carbide Vibration absorbing materials made of silicon (SIC), aluminum nitride (A1N), boron nitride (BN
  • the present disclosure develops an ultrasonic fingerprint sensor module assembly method and assembly structure, which can effectively improve the prior art that does not allow heavy work or damages the ultrasonic fingerprint sensor module sensing structure due to heavy work.
  • the defect can greatly improve the yield problem when the ultrasonic fingerprint sensor module is assembled with the display, and achieve the main purpose of cost open development.

Abstract

Provided by the present disclosure is an assembly method for an ultrasonic fingerprint sensing module and an assembly structure thereof, the assembly method comprising: joining a base to the surface of an ultrasonic fingerprint sensing module, the base having a compression elastic recovery force; and using a display and a rear cover to fix the ultrasonic fingerprint sensing module and the base. Using the display to abut on the surface of the ultrasonic fingerprint sensing module enables the elasticity of the base to then abut on the surface of the rear cover so as to complete the close fitting of the base onto the surface of the rear cover and complete the fixing of the positions.

Description

超音波指纹感测模块的组装方法及其组装结构Assembly method and assembly structure of ultrasonic fingerprint sensing module 技术领域Technical field
本公开涉及一种组装方法及其组装结构，尤指涉及超音波指纹感测模块的组装方法及其组装结构。The present disclosure relates to an assembling method and an assembling structure, and in particular to an assembling method and an assembling structure of an ultrasonic fingerprint sensing module.
背景技术Background technique
由于指纹图案因人而异的高度独特性，使得指纹辨识技术是目前应用最广的生物辨识技术。指纹辨识原理是通过指纹感测模块及指纹辨识软体提取出不同指纹所独有的特征信息，最后经过比对演算法得到辨识结果，以确定指纹所有人的身份。为能节省面积，将指纹感测模块设置于显示器的下方是未来的设计走向，也就是所谓显示器嵌入式指纹辨识(Fingerprint On Display，FOD)。而现今指纹感测方式大致分有三种：电容式、光学式以及超音波。Due to the high degree of uniqueness of fingerprint patterns that vary from person to person, fingerprint identification technology is currently the most widely used biometric identification technology. The principle of fingerprint recognition is to extract unique characteristic information of different fingerprints through fingerprint sensing modules and fingerprint recognition software, and finally obtain the recognition results through a comparison algorithm to determine the identity of the fingerprint owner. In order to save area, the fingerprint sensor module is placed under the display is the future design trend, which is the so-called embedded fingerprint recognition (Fingerprint On Display, FOD). Nowadays, there are roughly three types of fingerprint sensing methods: capacitive, optical, and ultrasonic.
超音波指纹感测模块，其优点在于无需显示器的光源，而且超声波穿透能力强，不受光线影响，抗污渍的能力也高，手指湿了、脏了都能识别，还可以识别出复制指纹，安全性也较高。技术概念是在显示器面板后加入感测模块，在显示器面板上的任何位置皆可捕捉指纹图像。因此效能与辨识度皆高于其他方案。The ultrasonic fingerprint sensor module has the advantages of not requiring a display light source, and strong ultrasonic penetration, not affected by light, and high anti-stain ability. It can recognize wet and dirty fingers, and can also recognize duplicate fingerprints. , The security is also higher. The technical concept is to add a sensing module behind the display panel, and fingerprint images can be captured at any position on the display panel. Therefore, the performance and recognition are higher than other solutions.
请参见图1，其为现有超音波指纹感测模块整合到智慧手机的示意图。其中智慧手机1可以被简单区分成两个部份：后盖10与显示器11。为了保证超音波的传递效率，超音波指纹感测模块12必须要跟显示器11背面紧密贴合，通常多以黏胶13来完成两者间的贴合，但此贴合工法几乎不允许重工。因为重工会破坏超音波指纹感测模块12顶部的感测结构，一旦贴合失败，连带显示器11都将一起报废。Please refer to Figure 1, which is a schematic diagram of an existing ultrasonic fingerprint sensor module integrated into a smart phone. The smart phone 1 can be simply divided into two parts: the back cover 10 and the display 11. In order to ensure the ultrasonic transmission efficiency, the ultrasonic fingerprint sensor module 12 must be closely attached to the back of the display 11, usually with adhesive 13 to complete the attachment between the two, but this attachment method hardly allows heavy work. Because heavy labor destroys the sensing structure on the top of the ultrasonic fingerprint sensing module 12, once the bonding fails, even the display 11 will be scrapped together.
公开内容Public content
本公开的主要目的在于提供一种超音波指纹感测模块的组装方法及其组装结构，以祈解决前述现有技术于使用上所产生的缺失。The main purpose of the present disclosure is to provide an assembling method and an assembling structure of an ultrasonic fingerprint sensor module, so as to solve the above-mentioned shortcomings in the use of the prior art.
为能改善此一缺失，本公开发展出一种超音波指纹感测模块的组装方法，包含：将一底座接合于一超音波指纹感测模块的一表面，该底座具有压缩弹性恢复力；以及以一显示器与一后盖对该超音波指纹感测模块与该底座进行固定，其中利用该显示器顶抵在该超音波指纹感测模块的表面上，使该底座的弹性而顶抵在该后盖的表面上， 借以完成该底座与该后盖的表面上的紧密配合而完成位置的固定。In order to improve this deficiency, the present disclosure has developed an assembling method of an ultrasonic fingerprint sensor module, which includes: joining a base to a surface of an ultrasonic fingerprint sensor module, the base having a compressive elastic restoring force; and The ultrasonic fingerprint sensor module and the base are fixed with a display and a back cover, wherein the display is used to press against the surface of the ultrasonic fingerprint sensor module, so that the elasticity of the base presses against the rear On the surface of the cover, a close fit between the base and the surface of the back cover is thereby completed to complete the position fixation.
本公开的另一方面为一种超音波指纹感测模块的组装结构，其包含：一超音波指纹感测模块；一底座，接合于该超音波指纹感测模块的一表面，该底座具有压缩弹性恢复力；以及一显示器与一后盖，与该超音波指纹感测模块与该底座进行固定，其中利用该显示器顶抵在该超音波指纹感测模块的表面上，使该底座的弹性而顶抵在该后盖的表面上，借以完成该底座与该后盖的表面上的紧密配合而完成位置的固定。Another aspect of the present disclosure is an assembly structure of an ultrasonic fingerprint sensor module, which includes: an ultrasonic fingerprint sensor module; a base joined to a surface of the ultrasonic fingerprint sensor module, the base having compression Elastic restoring force; and a display and a back cover for fixing the ultrasonic fingerprint sensor module and the base, wherein the display is pressed against the surface of the ultrasonic fingerprint sensor module to make the base elastic Abutting on the surface of the back cover, so as to complete the close fit of the base and the surface of the back cover to complete the fixation of the position.
本公开的发明效果将可以克服惯用手段中超音波指纹感测模块与显示器接合组装时的良率问题，因此有效地达成发展本公开的主要目的。The effect of the invention of the present disclosure can overcome the yield problem when the ultrasonic fingerprint sensor module is assembled with the display in conventional methods, and therefore, the main purpose of developing the present disclosure can be effectively achieved.
附图说明Description of the drawings
图1：其为现有超音波指纹感测模块整合到智慧手机的示意图。Figure 1: It is a schematic diagram of an existing ultrasonic fingerprint sensor module integrated into a smart phone.
图2：其为本公开一实施例的超音波指纹感测模块的组装方法流程示意图。Fig. 2 is a schematic flow chart of an assembling method of an ultrasonic fingerprint sensor module according to an embodiment of the present disclosure.
图3：其为本公开一实施例的超音波指纹感测模块与显示器组装的分解示意图。Fig. 3 is an exploded schematic diagram of the assembly of the ultrasonic fingerprint sensor module and the display according to an embodiment of the present disclosure.
图4：其为本公开一实施例的超音波指纹感测模块与显示器组装后的示意图。Fig. 4 is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to an embodiment of the disclosure.
图5：其为本公开另一实施例的超音波指纹感测模块与显示器组装后的示意图。Fig. 5: This is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to another embodiment of the present disclosure.
图6：其为本公开又一实施例的超音波指纹感测模块与显示器组装后的示意图。Fig. 6 is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to another embodiment of the present disclosure.
具体实施方式detailed description
以下提出实施例进行详细说明，实施例仅用以作为范例说明，并不会限缩本公开欲保护的范围。此外，实施例中的附图省略不必要或以通常技术即可完成的元件，以清楚显示本公开的技术特点。The following embodiments are provided for detailed description. The embodiments are only used as examples for description, and do not limit the scope of the present disclosure to be protected. In addition, the drawings in the embodiments omit elements that are not necessary or can be completed by common techniques, so as to clearly show the technical features of the present disclosure.
请同时参阅图2、图3及图4，其分别为根据本公开一实施例的超音波指纹感测模块的组装方法流程及其结构的分解示意图。在一实施例中，可包含下列步骤：在超音波指纹感测模块22的上表面221覆盖一保护结构层220(步骤21)。在一实施例中，上表面221为靠近显示器23的一面，保护结构层220可以是由至少一层的薄聚合物层(POLYMER)构成，其厚度约在2-20微米之间，而保护结构层220的材料可以是多氟化碳(CxFy)聚合物或是其他聚合物(例如聚甲基丙烯酸甲酯(poly(methyl methacrylate)，简称PMMA)、SU-8光刻胶或聚二甲基硅氧烷(Polydimethylsiloxane，简称PDMS))等多种聚合物之一或其任意组合，本公开并不以此为限。Please refer to FIG. 2, FIG. 3 and FIG. 4 at the same time, which are respectively an exploded schematic diagram of an assembling method and structure of an ultrasonic fingerprint sensor module according to an embodiment of the present disclosure. In one embodiment, the following steps may be included: covering the upper surface 221 of the ultrasonic fingerprint sensing module 22 with a protective structure layer 220 (step 21). In one embodiment, the upper surface 221 is a side close to the display 23, and the protective structure layer 220 may be composed of at least one thin polymer layer (POLYMER), the thickness of which is about 2-20 microns, and the protective structure The material of the layer 220 can be a polyfluorocarbon (CxFy) polymer or other polymers (for example, poly(methyl methacrylate), PMMA for short), SU-8 photoresist or polydimethyl methacrylate. Polydimethylsiloxane (PDMS for short) and other polymers such as one or any combination thereof, the present disclosure is not limited thereto.
保护结构层220的功能除了要防止超音波指纹感测模块22被外物磨损破坏外，还需要考虑声波传递的功能。通过保护结构层220与显示器23的接触，超音波指纹 感测模块22可发射与接收超音波，检测置放在显示器23上方的指纹(图未示出)。而超音波指纹感测模块22通过保护结构层220与显示器23接触时，在其接触位置的选择上，可以选用显示器23结构中较佳的声波传递路径上以及显示器23结构中声波传递较佳的材料上。In addition to preventing the ultrasonic fingerprint sensing module 22 from being damaged by foreign objects, the function of the protective structure layer 220 also needs to consider the function of sound wave transmission. Through the contact between the protective structure layer 220 and the display 23, the ultrasonic fingerprint sensing module 22 can transmit and receive ultrasonic waves, and detect fingerprints placed above the display 23 (not shown). When the ultrasonic fingerprint sensor module 22 is in contact with the display 23 through the protective structure layer 220, in the selection of the contact position, the better sound wave transmission path in the display 23 structure and the better sound wave transmission in the display 23 structure can be selected. Material.
接着，将一个带有压缩弹性恢复力的底座21的上表面211黏合至超音波指纹感测模块22的下表面222(步骤S22)，底座21的材质可以是硅胶、橡胶等具有压缩弹性恢复力的的材料，当然还可以有其他材料，例如是其他含有碳、氢、氧与硅的各种化合物弹性体。由于超音波指纹感测模块22的下表面222不具有超音波发射器与接收器等重要元件，因此底座21的上表面211与超音波指纹感测模块22的下表面222可以利用黏合胶来完成贴合。而贴合有底座21的超音波指纹感测模块22则可以用强度较低的方式(例如离型剂(release agents)与黏着剂(adhesive)的配合)固定在后盖20的一预设位置上，准备进行下一步的组装。当然，底座21与后盖20间也可以不用粘胶贴合，而是先直接置放在预设位置上来等待下一步的组装。Next, glue the upper surface 211 of the base 21 with compression elastic restoring force to the lower surface 222 of the ultrasonic fingerprint sensor module 22 (step S22). The material of the base 21 can be silicone, rubber, etc., with compressive elastic restoring force. Of course, there can also be other materials, such as other various compound elastomers containing carbon, hydrogen, oxygen and silicon. Since the lower surface 222 of the ultrasonic fingerprint sensor module 22 does not have important components such as ultrasonic transmitters and receivers, the upper surface 211 of the base 21 and the lower surface 222 of the ultrasonic fingerprint sensor module 22 can be completed by adhesives. fit. The ultrasonic fingerprint sensor module 22 attached to the base 21 can be fixed at a preset position of the back cover 20 by a lower strength method (for example, the cooperation of release agents and adhesives). On, ready for the next step of assembly. Of course, the base 21 and the back cover 20 can also be attached without glue, but directly placed in a preset position to wait for the next step of assembly.
另外，为能降低超音波的反射所造成的干扰，底座21除具弹性外，还可以特别选用具有此频段声音吸收能力的材料(例如可以是聚合物掺杂如下的无机微细粒子：金属材料、碳化钨(WC)、硼化钨(WB)、氮化钨(WN)、铁氧体、金刚石、石墨、碳化硅(SIC)、氮化铝(A1N)、氮化硼(BN)和氧化铝(Al2O3)等所完成的吸振材料，而所述金属材料包含钨(W)来完成，或是额外涂布吸音涂料。当然，结构也可以是较不易反射声波的不规则面或是其他有利于吸音的立体结构(例如具有厚度方向周期性结构的声子晶体)。In addition, in order to reduce the interference caused by the reflection of ultrasonic waves, in addition to being elastic, the base 21 can also be specially selected from materials with sound absorption capabilities in this frequency range (for example, polymers can be doped with inorganic fine particles: metal materials, Tungsten carbide (WC), tungsten boride (WB), tungsten nitride (WN), ferrite, diamond, graphite, silicon carbide (SIC), aluminum nitride (A1N), boron nitride (BN) and alumina (Al2O3), etc., and the metal material contains tungsten (W) to complete, or is additionally coated with sound-absorbing paint. Of course, the structure can also be an irregular surface that is less likely to reflect sound waves or other conducive Sound-absorbing three-dimensional structure (for example, a phononic crystal with a periodic structure in the thickness direction).
上述超音波指纹感测模块的组装方法可以再接着进行步骤23，用以将显示器23与后盖20进行紧配组装固定，例如利用螺丝等固定元件来完成接合，便可利用底座21的弹性而以底座21的下表面212来顶抵在后盖20的电路元件200上，借以完成底座21与电路元件200两者间的紧密配合而完成位置的加强固定。因为底座21的柔软弹性，其下表面得以适应电路元件200的不平整表面。而且底座21的压缩恢复力F(图4示出)会使超音波指纹感测模块22顶住显示器23，使其上表面可平整地贴合至显示器23的底部，借此维持有超音波的良好传递特性。本公开的作法不需通过黏合方式将超音波指纹感测模块22固定至显示器23，而且底座21与后盖20间的低强度贴合(例如离型剂与黏着剂的配合)以及超音波指纹感测模块22与显示器23间的不贴合，都可以容许组装时进行多次位置调整，不但增加组装精度更可避免良率降低所造成的损 失。The method for assembling the ultrasonic fingerprint sensor module described above can be followed by step 23 to tightly assemble and fix the display 23 and the back cover 20, for example, using fixing elements such as screws to complete the joining, so that the elasticity of the base 21 can be used. The lower surface 212 of the base 21 is pressed against the circuit element 200 of the back cover 20 to complete the close fit between the base 21 and the circuit element 200 to complete the strengthening and fixing of the position. Because of the softness and elasticity of the base 21, the lower surface of the base 21 can adapt to the uneven surface of the circuit element 200. Moreover, the compression restoring force F of the base 21 (shown in FIG. 4) will cause the ultrasonic fingerprint sensor module 22 to bear against the display 23, so that its upper surface can be flatly attached to the bottom of the display 23, thereby maintaining the ultrasonic wave Good transfer characteristics. The method of the present disclosure does not need to fix the ultrasonic fingerprint sensor module 22 to the display 23 by bonding, and the low-strength bonding between the base 21 and the back cover 20 (for example, the cooperation of the release agent and the adhesive) and the ultrasonic fingerprint The non-fitting between the sensing module 22 and the display 23 can allow multiple position adjustments during assembly, which not only increases assembly accuracy but also avoids losses caused by lower yield.
由于超音波指纹感测模块22的上表面221具有超音波发射器与接收器等重要元件，因此在一实施例中，保护结构层220的材料可选用具有有利于声音传导特性的材质，例如声音阻抗与上下两层材料可以匹配的材质。更具体而言，在一实施例中，保护结构层220的声音阻抗与显示器23下表面的声音阻抗间可具有一特定的比例关系，例如，保护结构层220的声音阻抗值介于超音波指纹感测模块22本身的声音阻抗值与显示器23下表面的声音阻抗值之间。Since the upper surface 221 of the ultrasonic fingerprint sensor module 22 has important components such as an ultrasonic transmitter and receiver, in one embodiment, the material of the protective structure layer 220 may be a material with favorable sound conduction characteristics, such as sound A material whose impedance can be matched with the upper and lower layers of materials. More specifically, in one embodiment, the acoustic impedance of the protective structure layer 220 and the acoustic impedance of the lower surface of the display 23 may have a specific proportional relationship. For example, the acoustic impedance of the protective structure layer 220 is between the ultrasonic fingerprint Between the sound impedance value of the sensing module 22 itself and the sound impedance value of the lower surface of the display 23.
而完成组装后的结构示意图则如图4的所示。其中标号皆与图3相同，仅多绘制出用以紧配组装显示器23与后盖20两者的固定元件40的位置与外观的示意，其可利用例如设置于四个角落与侧边的螺丝与螺孔固定所产生的力量来完成显示器23与后盖20两者间的组装。The schematic diagram of the structure after the assembly is as shown in FIG. 4. The reference numbers are the same as those in FIG. 3, and only the position and appearance of the fixing element 40 for tightly fitting the display 23 and the back cover 20 are drawn. For example, the screws can be arranged at the four corners and sides. The force generated by fixing with the screw hole completes the assembly between the display 23 and the back cover 20.
再请参见图5，其为本公开另一实施例的超音波指纹感测模块与显示器组装后的示意图。在此实施例中，超音波指纹感测模块22与底座52之间具有一支撑结构50。相较于具有弹性的底座52，固接在超音波指纹感测模块22下方的支撑结构50具有较强的抗形变能力，支撑结构50利用固定元件(例如螺丝)51来与后盖20完成位置上的固定，而具有弹性的底座52则可以因应后盖20上电路元件200的高低起伏产生形变而产生顶抵力，将超音波指纹感测模块22在垂直方向上与显示器23完成紧配接合。而由于固定元件51与超音波指纹感测模块22间的距离较小，因此固定组件51也需考虑共振的消弭，用以提升整体超音波信号传送的纯净度。Please refer to FIG. 5 again, which is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to another embodiment of the present disclosure. In this embodiment, there is a supporting structure 50 between the ultrasonic fingerprint sensor module 22 and the base 52. Compared with the flexible base 52, the support structure 50 fixed under the ultrasonic fingerprint sensor module 22 has stronger resistance to deformation, and the support structure 50 uses fixing elements (such as screws) 51 to complete the position with the back cover 20 The base 52 with elasticity can produce a pressing force in response to the deformation of the circuit element 200 on the back cover 20, and the ultrasonic fingerprint sensor module 22 can be tightly joined to the display 23 in the vertical direction. . Since the distance between the fixing element 51 and the ultrasonic fingerprint sensing module 22 is relatively small, the fixing element 51 also needs to consider the elimination of resonance to improve the purity of the overall ultrasonic signal transmission.
当然，为能降低超音波的反射所造成的干扰，支撑结构50也可以特别选用具有此频段声音吸收能力的材料，结构也可以是较不易反射声波的不规则面或是其他立体结构(例如具有厚度方向周期性结构的声子晶体)。Of course, in order to reduce the interference caused by the reflection of ultrasonic waves, the support structure 50 can also specially select materials with sound absorption capacity in this frequency range. The structure can also be an irregular surface that is less likely to reflect sound waves or other three-dimensional structures (for example, with Phononic crystal with periodic structure in the thickness direction).
图6为本公开又一实施例的超音波指纹感测模块与显示器组装后的示意图。在此实施例中，支撑结构50与超音波指纹感测模块22之间设置有一吸振材料层60。如上所述，超音波指纹感测模块22下方的支撑结构50具有较强的抗形变能力，而吸振材料层60则是用以降低超音波的反射所造成的干扰，可以特别选用具有此频段声音吸收能力的材料(例如可以是聚合物掺杂如下的无机微细粒子：金属材料、碳化钨(WC)、硼化钨(WB)、氮化钨(WN)、铁氧体、金刚石、石墨、碳化硅(SIC)、氮化铝(A1N)、氮化硼(BN)和氧化铝(Al2O3)等所完成的吸振材料，而所述金属材料包含钨(W)来完成，结构也可以是较不易反射声波的不规则面或是其他立体结构(例如具有厚度方 向周期性结构的声子晶体)。以上所述仅为本公开的较佳实施例，并非用以限定本公开，因此凡其他未脱离本公开所揭示的精神下所完成的等效改变或修饰，均应包含于本公开的公开概念中。FIG. 6 is a schematic diagram of an ultrasonic fingerprint sensor module and a display assembled according to another embodiment of the disclosure. In this embodiment, a vibration-absorbing material layer 60 is provided between the supporting structure 50 and the ultrasonic fingerprint sensing module 22. As mentioned above, the support structure 50 under the ultrasonic fingerprint sensor module 22 has a strong resistance to deformation, and the vibration-absorbing material layer 60 is used to reduce the interference caused by the reflection of ultrasonic waves, and the sound with this frequency band can be specially selected. Absorbent materials (for example, polymers doped with inorganic fine particles: metal materials, tungsten carbide (WC), tungsten boride (WB), tungsten nitride (WN), ferrite, diamond, graphite, carbide Vibration absorbing materials made of silicon (SIC), aluminum nitride (A1N), boron nitride (BN) and aluminum oxide (Al2O3), and the metal material contains tungsten (W) to complete, the structure can also be less easy Irregular surfaces reflecting sound waves or other three-dimensional structures (for example, phononic crystals with periodic structures in the thickness direction). The above are only preferred embodiments of the present disclosure, and are not intended to limit the present disclosure. Therefore, everything else is not deviated from Equivalent changes or modifications completed under the spirit disclosed in the present disclosure should all be included in the disclosed concept of the present disclosure.
综上所述，本公开是发展出一超音波指纹感测模块的组装方法及其组装结构，可以有效改善现有技术中不允许重工或因为重工而破坏超音波指纹感测模块感测结构的缺失，可以大幅改善超音波指纹感测模块与显示器接合组装时的良率问题，达成本公开发展的主要目的。In summary, the present disclosure develops an ultrasonic fingerprint sensor module assembly method and assembly structure, which can effectively improve the prior art that does not allow heavy work or damages the ultrasonic fingerprint sensor module sensing structure due to heavy work. The defect can greatly improve the yield problem when the ultrasonic fingerprint sensor module is assembled with the display, and achieve the main purpose of cost open development.
虽然本公开已以实施例公开如上，然其并非用以限定本公开，任何所属技术领域中技术人员，在不脱离本公开的精神和范围内，当可作些许的更动与润饰，故本公开的保护范围当视后附的权利要求所界定者为准。Although the present disclosure has been disclosed as above in terms of embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art, without departing from the spirit and scope of the present disclosure, can make some changes and modifications, so this The scope of protection disclosed shall be subject to those defined by the appended claims.

Claims (27)

  1. 一种超音波指纹感测模块的组装方法，包含：A method for assembling an ultrasonic fingerprint sensing module, including:
    将一底座接合于一超音波指纹感测模块的一表面，该底座具有压缩弹性恢复力；以及Joining a base to a surface of an ultrasonic fingerprint sensor module, the base having a compressive elastic restoring force; and
    以一显示器与一后盖对该超音波指纹感测模块与该底座进行固定，其中利用该显示器顶抵在该超音波指纹感测模块的表面上，使该底座的弹性而顶抵在该后盖的表面上，借以完成该底座与该后盖的表面上的紧密配合而完成位置的固定。The ultrasonic fingerprint sensor module and the base are fixed with a display and a back cover, wherein the display is used to press against the surface of the ultrasonic fingerprint sensor module, so that the elasticity of the base presses against the rear On the surface of the cover, a close fit between the base and the surface of the back cover is thereby completed to complete the fixation of the position.
  2. 根据权利要求1所述的超音波指纹感测模块的组装方法，进一步包含：在该超音波指纹感测模块的一上表面上覆盖一保护结构层，该保护结构层由至少一层的聚合物层来构成，其厚度在2-20微米之间，其中该上表面为靠近该显示器的一面。The assembling method of the ultrasonic fingerprint sensing module according to claim 1, further comprising: covering an upper surface of the ultrasonic fingerprint sensing module with a protective structure layer, the protective structure layer being made of at least one layer of polymer The thickness is between 2-20 microns, and the upper surface is the side close to the display.
  3. 根据权利要求1所述的超音波指纹感测模块的组装方法，进一步包含：在该超音波指纹感测模块的一上表面上覆盖一保护结构层，该保护结构层由至少一层的聚合物层来构成，其中该上表面为靠近该显示器的一面。The assembling method of the ultrasonic fingerprint sensing module according to claim 1, further comprising: covering an upper surface of the ultrasonic fingerprint sensing module with a protective structure layer, the protective structure layer being made of at least one layer of polymer The upper surface is the side close to the display.
  4. 根据权利要求3所述的超音波指纹感测模块的组装方法，其中该保护结构层的材料是多氟化碳、聚甲基丙烯酸甲酯、SU-8光刻胶与聚二甲基硅氧烷中之一或任意组合。The method for assembling an ultrasonic fingerprint sensor module according to claim 3, wherein the material of the protective structure layer is polyfluorocarbon, polymethyl methacrylate, SU-8 photoresist and polydimethylsiloxane One or any combination of alkanes.
  5. 根据权利要求3所述的超音波指纹感测模块的组装方法，其中该保护结构层接触至该显示器，使该超音波发射器与接收器可发射与接收超音波，用以检测置放在该显示器上方的指纹显示器。4. The method for assembling an ultrasonic fingerprint sensor module according to claim 3, wherein the protective structure layer is in contact with the display, so that the ultrasonic transmitter and receiver can transmit and receive ultrasonic waves to detect when placed in the The fingerprint display above the display.
  6. 根据权利要求3所述的超音波指纹感测模块的组装方法，其中该保护结构层的声音阻抗值介于该超音波指纹感测模块的声音阻抗值与该显示器下表面的声音阻抗值之间。4. The method for assembling an ultrasonic fingerprint sensor module according to claim 3, wherein the acoustic impedance value of the protective structure layer is between the acoustic impedance value of the ultrasonic fingerprint sensor module and the acoustic impedance value of the lower surface of the display .
  7. 根据权利要求1所述的超音波指纹感测模块的组装方法，其中进一步包括：利用黏合胶来将该底座的一上表面与该超音波指纹感测模块的一下表面完成贴合。4. The method for assembling an ultrasonic fingerprint sensor module according to claim 1, further comprising: using an adhesive to complete bonding of an upper surface of the base and a lower surface of the ultrasonic fingerprint sensor module.
  8. 根据权利要求1所述的超音波指纹感测模块的组装方法，其中该底座的材质为硅胶、橡胶或是含有碳、氢、氧与硅的化合物弹性体。The method for assembling an ultrasonic fingerprint sensor module according to claim 1, wherein the base is made of silica gel, rubber, or a compound elastomer containing carbon, hydrogen, oxygen, and silicon.
  9. 根据权利要求1所述的超音波指纹感测模块的组装方法，其中该底座额外涂布吸音涂料。4. The method for assembling an ultrasonic fingerprint sensor module according to claim 1, wherein the base is additionally coated with sound-absorbing paint.
  10. 根据权利要求1所述的超音波指纹感测模块的组装方法，其中该底座具有不易 反射声波的不规则面。The method for assembling an ultrasonic fingerprint sensor module according to claim 1, wherein the base has an irregular surface that does not easily reflect sound waves.
  11. 根据权利要求1所述的超音波指纹感测模块的组装方法，其中该底座具有厚度方向周期性结构的声子晶体。The method for assembling an ultrasonic fingerprint sensor module according to claim 1, wherein the base has a phononic crystal with a periodic structure in the thickness direction.
  12. 根据权利要求1所述的超音波指纹感测模块的组装方法，其中该显示器顶抵在该超音波指纹感测模块的表面上，利用该底座的弹性而以其下表面来顶抵在该后盖表面上的电路元件上。The method for assembling an ultrasonic fingerprint sensor module according to claim 1, wherein the display is pressed against the surface of the ultrasonic fingerprint sensor module, and the bottom surface of the base is used to press against the rear surface by the elasticity of the base. On the circuit components on the surface of the cover.
  13. 一种超音波指纹感测模块的组装结构，其包含：An assembly structure of an ultrasonic fingerprint sensing module, which includes:
    一超音波指纹感测模块；An ultrasonic fingerprint sensor module;
    一底座，接合于该超音波指纹感测模块的一表面，该底座具有压缩弹性恢复力；以及A base joined to a surface of the ultrasonic fingerprint sensor module, the base having a compressive elastic restoring force; and
    一显示器与一后盖，与该超音波指纹感测模块与该底座进行固定，其中利用该显示器顶抵在该超音波指纹感测模块的表面上，使该底座的弹性而顶抵在该后盖的表面上，借以完成该底座与该后盖的表面上的紧密配合而完成位置的固定。A display and a back cover are fixed to the ultrasonic fingerprint sensor module and the base, wherein the display is pressed against the surface of the ultrasonic fingerprint sensor module, so that the elasticity of the base presses against the back On the surface of the cover, a close fit between the base and the surface of the back cover is thereby completed to complete the fixation of the position.
  14. 根据权利要求13所述的超音波指纹感测模块的组装结构，其中该超音波指纹感测模块的一上表面上覆盖有一保护结构层，该保护结构层由至少一层的聚合物层来构成，其厚度在2-20微米之间，其中该上表面为靠近该显示器的一面。The assembly structure of the ultrasonic fingerprint sensing module according to claim 13, wherein an upper surface of the ultrasonic fingerprint sensing module is covered with a protective structure layer, and the protective structure layer is composed of at least one polymer layer , The thickness is between 2-20 microns, and the upper surface is the side close to the display.
  15. 根据权利要求13所述的超音波指纹感测模块的组装结构，其中该超音波指纹感测模块的一上表面上覆盖有一保护结构层，该保护结构层由至少一层的聚合物层来构成，其中该上表面为靠近该显示器的一面。The assembly structure of the ultrasonic fingerprint sensing module according to claim 13, wherein an upper surface of the ultrasonic fingerprint sensing module is covered with a protective structure layer, and the protective structure layer is composed of at least one polymer layer , Wherein the upper surface is a side close to the display.
  16. 根据权利要求15所述的超音波指纹感测模块的组装结构，其中该保护结构层的材料是多氟化碳、聚甲基丙烯酸甲酯、SU-8光刻胶与聚二甲基硅氧烷中之一或任意组合。The assembly structure of the ultrasonic fingerprint sensing module according to claim 15, wherein the material of the protective structure layer is polyfluorocarbon, polymethylmethacrylate, SU-8 photoresist and polydimethylsiloxane One or any combination of alkanes.
  17. 根据权利要求15所述的超音波指纹感测模块的组装结构，其中该保护结构层接触至该显示器，使该超音波发射器与接收器可发射与接收超音波，用以检测置放在该显示器上方的指纹。The assembly structure of the ultrasonic fingerprint sensor module according to claim 15, wherein the protective structure layer is in contact with the display, so that the ultrasonic transmitter and receiver can transmit and receive ultrasonic waves to detect when placed in the Fingerprints on the top of the display.
  18. 根据权利要求15所述的超音波指纹感测模块的组装结构，其中该保护结构层的声音阻抗值介于该超音波指纹感测模块的声音阻抗值与该显示器下表面的声音阻抗值之间。The assembly structure of the ultrasonic fingerprint sensor module according to claim 15, wherein the acoustic impedance value of the protective structure layer is between the acoustic impedance value of the ultrasonic fingerprint sensor module and the acoustic impedance value of the lower surface of the display .
  19. 根据权利要求13所述的超音波指纹感测模块的组装结构，其中利用黏合胶来将该底座的一上表面与该超音波指纹感测模块的一下表面完成贴合。13. The assembly structure of the ultrasonic fingerprint sensor module according to claim 13, wherein an upper surface of the base and a lower surface of the ultrasonic fingerprint sensor module are bonded together with adhesive glue.
  20. 根据权利要求13所述的超音波指纹感测模块的组装结构，其中该底座的材质为硅胶、橡胶或是含有碳、氢、氧与硅的化合物弹性体。13. The assembly structure of the ultrasonic fingerprint sensor module of claim 13, wherein the base is made of silica gel, rubber, or a compound elastomer containing carbon, hydrogen, oxygen, and silicon.
  21. 根据权利要求13所述的超音波指纹感测模块的组装结构，其中该底座额外涂布吸音涂料。The assembly structure of the ultrasonic fingerprint sensing module according to claim 13, wherein the base is additionally coated with sound-absorbing paint.
  22. 根据权利要求13所述的超音波指纹感测模块的组装结构，其中该底座具有不易反射声波的不规则面。The assembly structure of the ultrasonic fingerprint sensing module according to claim 13, wherein the base has an irregular surface that does not easily reflect sound waves.
  23. 根据权利要求13所述的超音波指纹感测模块的组装结构，其中该底座具有厚度方向周期性结构的声子晶体。The assembly structure of the ultrasonic fingerprint sensor module according to claim 13, wherein the base has a phononic crystal with a periodic structure in the thickness direction.
  24. 根据权利要求13所述的超音波指纹感测模块的组装结构，其中利用该显示器顶抵在该超音波指纹感测模块的表面上，利用该底座的弹性而以其下表面来顶抵在该后盖表面上的电路元件上，借以完成位置的固定。The assembly structure of the ultrasonic fingerprint sensor module according to claim 13, wherein the display is used to press against the surface of the ultrasonic fingerprint sensor module, and the elasticity of the base is used to press against the bottom surface of the ultrasonic fingerprint sensor module. On the circuit components on the surface of the back cover, the position is fixed.
  25. 根据权利要求13所述的超音波指纹感测模块的组装结构，其中还设置了一个支撑结构，该支撑结构设于该超音波指纹感测模块与该底座之间，该支撑结构比该底座具有较强的抗形变能力，该支撑结构利用固定元件来与后盖完成水平位置上的固定。The assembling structure of the ultrasonic fingerprint sensing module according to claim 13, wherein a support structure is further provided, the support structure is arranged between the ultrasonic fingerprint sensing module and the base, and the support structure has a larger structure than the base Strong resistance to deformation, the support structure uses fixing elements to complete the horizontal fixation with the back cover.
  26. 根据权利要求25所述的超音波指纹感测模块的组装结构，其中该支撑结构为具有超音波频段声音吸收能力的材料。26. The assembly structure of the ultrasonic fingerprint sensing module according to claim 25, wherein the supporting structure is made of a material with ultrasonic frequency band sound absorption capability.
  27. 根据权利要求25所述的超音波指纹感测模块的组装结构，其中在该支撑结构与该超音波指纹感测模块之间还设置一吸振材料层，该吸振材料层具有超音波声音吸收能力的材料，该吸振材料层的材料为聚合物掺杂无机微细粒子，无机微细粒子包含有金属材料、碳化钨、硼化钨、氮化钨、铁氧体、金刚石、石墨、碳化硅、氮化铝、氮化硼和氧化铝等所完成的吸振材料。25. The assembly structure of the ultrasonic fingerprint sensing module according to claim 25, wherein a vibration-absorbing material layer is further provided between the supporting structure and the ultrasonic fingerprint sensing module, and the vibration-absorbing material layer is capable of absorbing ultrasonic sound. Material, the material of the vibration absorbing material layer is polymer-doped inorganic fine particles, and the inorganic fine particles include metal materials, tungsten carbide, tungsten boride, tungsten nitride, ferrite, diamond, graphite, silicon carbide, aluminum nitride Vibration-absorbing materials such as, boron nitride and alumina.
PCT/CN2019/129866 2019-09-10 2019-12-30 Assembly method for ultrasonic fingerprint sensing module and assembly structure thereof WO2021047117A1 (en)

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