WO2021043051A1 - Matériau d'interface thermoconducteur à haute performance et son utilisation - Google Patents

Matériau d'interface thermoconducteur à haute performance et son utilisation Download PDF

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WO2021043051A1
WO2021043051A1 PCT/CN2020/111612 CN2020111612W WO2021043051A1 WO 2021043051 A1 WO2021043051 A1 WO 2021043051A1 CN 2020111612 W CN2020111612 W CN 2020111612W WO 2021043051 A1 WO2021043051 A1 WO 2021043051A1
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powder
parts
interface material
thermally conductive
microns
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PCT/CN2020/111612
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English (en)
Chinese (zh)
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范勇
程亚东
唐正华
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上海阿莱德实业股份有限公司
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Publication of WO2021043051A1 publication Critical patent/WO2021043051A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

Definitions

  • the invention belongs to the technical field of thermally conductive materials, and specifically relates to a high-performance thermally conductive interface material and its application.
  • thermal conductive materials with light weight, good mechanical properties, strong electrical insulation, and low price have become the trend of future development.
  • Electronic industry products such as LEDs, microelectronic packaging materials and semiconductor devices continue to develop in the direction of miniaturization, lightness and thinness, and intelligence. Therefore, people have put forward higher requirements for the thermal conductivity of the materials.
  • Thermally conductive materials used in electronic devices such as high heat dissipation materials, electronic packaging materials, etc., often need to have excellent electrical insulation and high breakdown voltage properties to meet the requirements of use.
  • the heat generated by the product has also increased significantly.
  • the continuous rise of operating temperature will reduce the stability and reliability of electronic equipment, and shorten the service life of the product.
  • the first aspect of the present invention provides a high-performance thermal interface material, which is characterized in that, in parts by weight, the preparation raw materials include: 13-20 parts of liquid silica gel, 27-35 parts of metal powder , 7-13 parts of metal oxides, 20-30 parts of carbon materials, 0.1-0.5 parts of alkenyl-containing siloxane;
  • the metal powder includes at least one of copper powder, aluminum powder, silver powder, iron powder, zinc powder, nickel powder, and tin powder.
  • the metal powder is composed of metal powder with an average particle size of 1-10 microns and metal powder with an average particle size of 30-50 microns.
  • the weight ratio of the 1-10 micron metal powder to the 30-50 micron metal powder is (0.8-1.2):1.
  • the molecular formula of the metal oxide is M x O y , where M is selected from one of Zn, Cu, Al, Ag, Ni, Fe, and Mg, x is 1-2, y For 1-3.
  • the average particle size of the metal oxide is 400-800 nm.
  • the carbon material is selected from at least one of carbon fibers, carbon nanotubes, carbon nanowires, graphene, and graphene oxide.
  • the average length of the carbon fiber is 50-200 microns.
  • the average length of the carbon fiber is 150 microns.
  • the thermally conductive interface material further includes 11-20 parts of ceramic materials.
  • the second aspect of the present invention provides an application of the thermally conductive interface material, which is used for heat dissipation of electronic products.
  • the thermally conductive interface material of the present invention has superior thermal conductivity, suitable hardness, and can be well applied to heat dissipation in the field of electronic products.
  • the above-mentioned range is regarded as continuous, and includes the minimum and maximum values of the range, and every value between such minimum and maximum values. Further, when the range refers to an integer, it includes every integer between the minimum value and the maximum value of the range.
  • the ranges can be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all sub-ranges subsumed therein. For example, a specified range from "1 to 10" should be regarded as including any and all sub-ranges between the minimum value of 1 and the maximum value of 10. Exemplary sub-ranges of the range 1 to 10 include, but are not limited to, 1 to 6.1, 3.5 to 7.8, 5.5 to 10, and the like.
  • the present invention provides a high-performance thermally conductive interface material.
  • the preparation raw materials include: 13-20 parts of liquid silica gel, 27-35 parts of metal powder, 7-13 parts of metal oxide, and carbon 20-30 parts of materials, 0.1-0.5 parts of alkenyl-containing siloxane.
  • the thermal interface material prepares raw materials including: 15.92 parts of liquid silica gel, 31.45 parts of metal powder, 10.36 parts of metal oxides, 26.64 parts of carbon materials, and alkenyl-containing silica 0.32 parts of alkane.
  • the liquid silica gel mentioned in this application includes two types: one type is liquid silica gel with functional groups at both ends of the molecular structure; the other type is liquid silica gel with active functional groups randomly distributed in the main chain.
  • the liquid silica gel has fast flow, The advantages of mild curing conditions, safety and environmental protection.
  • the liquid silica gel includes hydroxyl-modified polydimethylsiloxane-type silica gel, carboxyl-modified polydimethylsiloxane-type silica gel, and silicon-hydrogen bond-containing polydimethylsiloxane-type silica gel. At least one of them.
  • the viscosity of the liquid silica gel is 500-1000 mPa ⁇ s.
  • the viscosity test of the liquid silica gel refers to the standard ISO3219, and the temperature is 25 degrees Celsius.
  • the model of the liquid silica gel is Waker-9212 A/B, which was purchased from Wacker, Germany.
  • the thermal conductivity of aluminum is 190k/W ⁇ (m ⁇ K) -1
  • the thermal conductivity of zinc is 121k/W ⁇ (m ⁇ K) -1
  • the thermal conductivity of copper is 398k/W ⁇ (m ⁇ K) -1
  • the thermal conductivity of silver is 471k/W ⁇ (m ⁇ K) -1 .
  • the metal powder includes at least one of copper powder, aluminum powder, silver powder, iron powder, zinc powder, nickel powder, and tin powder.
  • the metal powder is aluminum powder.
  • the metal powder is a spherical structure powder.
  • the shape and size of the metal particles affect their distribution in the polymer and the way they are stacked between the particles, thereby affecting the ability to build a heat conduction channel inside the polymer, and affecting its thermal conductivity and other properties.
  • the average particle size of the metal powder is 1-70 microns; preferably, the average particle size of the metal powder is 5-40 microns;
  • the metal powder is composed of metal powder with an average particle size of 1-10 microns and metal powder with an average particle size of 30-50 microns;
  • the weight ratio of the 1-10 micron metal powder to the 30-50 micron metal powder is (0.8-1.2):1.
  • the weight ratio of the 5 micron metal powder to the 40 micron metal powder is (0.8-1.2):1.
  • the weight ratio of the 5 micron metal powder to the 40 micron metal powder is 1:1.
  • the metal powder described in the present application forms a thermally conductive network structure in the liquid silica gel, and improves the thermal conductivity of the silica gel with the help of free electron and phonon vibration.
  • the thermal conductivity of the metal oxide described in this application is lower than that of metal powder, but it has good electrical insulation, good wear resistance, and high hardness.
  • the molecular formula of the metal oxide is M x O y , where M is selected from one of Zn, Cu, Al, Ag, Ni, Fe, and Mg, x is 1-2, and y is 1. -3.
  • the molecular formula of the metal oxide is M x O y , where M is Zn, x is 1, and y is 1.
  • the metal oxide is a powder with a spherical structure.
  • the average particle size of the metal oxide is 400-800 nm.
  • the average particle size of the metal oxide is 600 nm.
  • the carbon material is selected from at least one of carbon fibers, carbon nanotubes, carbon nanowires, graphene, and graphene oxide.
  • the carbon material is carbon fiber.
  • the average length of the carbon fiber is 50-200 microns.
  • the average length of the carbon fiber is 150 microns.
  • the carbon fiber described in this application has ultra-high thermal conductivity and mechanical strength, and the thermal conductivity can reach 700W/(m ⁇ K).
  • the special microcrystalline graphite structure of the carbon fiber makes it play a huge heat dissipation advantage in the heat conduction process.
  • the metal powder, metal oxide, carbon material, etc. have high thermal conductivity, but due to the lack of active groups, the surface energy is low, and the compatibility with liquid silica gel is poor, which will affect the thermal conductivity of the material. Its thermal conductivity, hardness and other properties.
  • the surface treatment of metal powders, metal oxides, and carbon materials is performed by adding alkenyl-containing siloxane to increase the compatibility between each other and improve the interfacial adhesion.
  • the alkenyl-containing siloxane is selected from 1-vinyl-1,1,3,3,3-pentamethyldisiloxane, 1,3,5-trivinyl -1,1,3,5,5-pentamethyltrisiloxane, vinyltris(dimethylsiloxane)silane, 1,3-divinyltetraethoxydisiloxane, methyl At least one of acryloyloxypentamethyldisiloxane, vinyltris(trimethylsiloxy)silane, and vinyltrimethoxysilane.
  • the alkenyl-containing siloxane is vinyltrimethoxysilane.
  • model number of the alkenyl-containing siloxane is KH171.
  • the thermally conductive interface material further includes 11-20 parts of ceramic materials.
  • the thermally conductive interface material further includes 15.31 parts of ceramic materials.
  • the ceramic material described in this application has an atomic crystal form and a dense structure, mainly conducts heat conduction by phonons, and has a high thermal conductivity.
  • the ceramic material is selected from one or more of silicon carbide, aluminum nitride, silicon nitride, aluminum silicate, and zirconium oxide.
  • the ceramic material is aluminum nitride.
  • the aluminum nitride is a covalent bond compound with a hexagonal wurtzite structure, white or off-white, and Al atoms and adjacent N atoms form a dismutated (AIN 4 ) tetrahedron.
  • AIN has a theoretical density of 3.269, a Mohs hardness of 7-8, and decomposes at 2200-22500 degrees Celsius. It has good stability and thermal shock resistance in a high-temperature non-oxidizing atmosphere within 2000 degrees Celsius.
  • the aluminum nitride has the characteristics of not being corroded by aluminum and other molten metals and gallium arsenide, and aluminum nitride also has excellent electrical insulation and dielectric properties.
  • the aluminum nitride is a powder with a spherical structure.
  • the average particle size of the aluminum nitride is 0.5-5 microns
  • the aluminum nitride is composed of aluminum nitride with an average particle size of 0.5-2 microns and aluminum nitride with an average particle size of 4-6 microns;
  • the weight ratio of the 0.5-2 micron aluminum nitride to the 4-6 micron aluminum nitride is (0.9-1.3):1.
  • the weight ratio of the 1 micron aluminum nitride to the 5 micron aluminum nitride is (0.9-1.3):1.
  • the weight ratio of the 1 micron aluminum nitride to the 5 micron aluminum nitride is 1.1:1.
  • the applicant has found through painstaking research that when metal powders, metal oxides, ceramics When the weight ratio of the material is: (2-4):1:(1-2), and the metal powder is composed of metal powder with an average particle size of 1-10 microns and an average particle size of 30-50 microns When the aluminum nitride is composed of aluminum nitride with an average particle size of 0.5-2 microns and aluminum nitride with an average particle size of 4-6 microns, the performance of the material is optimized.
  • the particle size of the metal powder, metal oxide or ceramic material is small, the specific surface area is larger; when the particle size of the metal powder, metal oxide or ceramic material is large, the thermal conductivity is better, and the particle size is different
  • the filler is distributed in the silica gel, it is limited by the particle size and kinetic energy of the filler.
  • Fillers with different particle sizes and different thermal conductivity contact each other to form a thermal conductive chain.
  • the thermal conductive material system is equivalent to forming multiple "parallel circuits”. Heat flow passes through multiple "parallel circuits" to improve thermal conductivity.
  • the solution properties of liquid silicone rubber, the incompatibility of filler surface energy, and the large viscosity of the mixture are improved.
  • the hardness of the interface material obtained is in the range of 30-50 ShoreOO, which has a good performance.
  • the processing performance is very suitable for heat dissipation in various electronic product fields.
  • the preparation method of the thermally conductive interface material includes the following steps:
  • step S2 Add metal powder, metal oxides, and ceramic materials to the mixture obtained in step S1, and the planetary vacuum is stirred for 5-20 minutes;
  • step S3 Add half of the carbon material to the mixture obtained in step S2, and stir the planetary vacuum for 1-30 min;
  • step S4 Add the remaining carbon material to the mixture obtained in step S3, and stir the planetary vacuum for 1-30 min;
  • step (1) Put the mixed material obtained in step (1) into the hydraulic injection extruder, spit it out through the needle nozzle, and arrange it neatly in a rectangular parallelepiped container. After it is stacked to a height of 1/2-1/4, the material is mixed in a vibrating compactor Vibrate, a total of 2-4 times.
  • step (2) Put the rectangular parallelepiped container in step (2) in a vacuum drying oven to evacuate to ⁇ -0.098MPa, 1-5 minutes later, release the vacuum, tap the material in a vibrating compactor, repeat at least once; then place the weights together Vacuum in the vacuum drying box to ⁇ -0.098MPa, release the vacuum after 1-5 minutes, repeat at least once;
  • the force applied by the weight to the container in step (3) and step (4) is 100-500 kgf.
  • the force applied by the weight to the container in step (3) and step (4) is 300 kgf.
  • the preparation method of the thermally conductive interface material includes the following steps:
  • step S2 Add metal powder, metal oxides, and ceramic materials to the mixture obtained in step S1, vacuum and stir for 5-20 minutes on the planet, then shovel the paddle and the material on the pot wall and continue to vacuum and stir for 1-10 minutes, and then add the paddle Shovel the material on the pot wall and continue to vacuum and stir for 1-10min;
  • step S3 Add half of the carbon material to the mixture obtained in step S2, vacuum the planetary for 1-10min, then shovel the material on the paddle and the pot wall and continue to vacuum and stir for 1-10min, and then put the paddle and the pot wall on Continue to vacuum and stir for 1-10min under the shovel;
  • step S4 Add the remaining carbon material to the mixture obtained in step S3, vacuum and stir for 1-10min on the planet, then shovel the material on the paddle and pot wall and continue to vacuum and stir for 1-10min, and then shovel the material on the paddle and pot wall Continue to vacuum and stir for 1-10min, then shovel the paddle and the material on the pot wall and continue to vacuum and stir for 1-10min
  • step (1) Put the mixed material obtained in step (1) into a hydraulic injection extruder and spit it out through a needle nozzle.
  • the diameter of the needle nozzle is 2.5mm. They are arranged neatly in a rectangular parallelepiped container and stacked to 1/2-1/4 height. , The material is vibrated in the vibrating compaction machine for a total of 2-4 times.
  • step (2) Put the rectangular parallelepiped container in step (2) in a vacuum drying oven to evacuate to ⁇ -0.098MPa, 1-5 minutes later, vacuum, and vibrate the material with a vibrating compactor; then put it in a vacuum drying oven to evacuate to ⁇ -0.098 MPa, 1-5 minutes later, vacuum, vibrating compactor to compact the material; after pressing the heavy objects, put them in a vacuum drying oven and vacuum to ⁇ -0.098MPa, 1-5 minutes after the vacuum, after pressing the heavy objects Then put it in a vacuum drying oven to evacuate to ⁇ -0.098MPa, and then release the vacuum after 1-5 minutes.
  • (2) in the orientation process put the mixed material obtained in step (1) into a hydraulic injection extruder, and spit it out through a needle nozzle with a diameter of 2.5mm, which is arranged neatly in a rectangular parallelepiped container and stacked After reaching 1/3 height, vibrate the material in a vibrating compactor for a total of 3 times.
  • the dimensions of the length, width, and height of the container are 250 mm, 150 mm, and 150 mm, respectively.
  • the specific operation is: put the mixed material obtained in step S1 into a hydraulic injection extruder and spit it out through a needle nozzle.
  • the diameter of the needle nozzle is 2.5mm.
  • the material is compacted by the compactor.
  • the compaction time is 40 minutes, the vibration frequency is 5Hz, and the amplitude is 5mm; after continuing to stack to 2/3 height, the material is compacted by the vibrating compactor.
  • the compaction time is 40 minutes, and the vibration frequency It is 5Hz and the amplitude is 5mm; after continuing to pile up to the height of 3/3, the material is tapped by a vibrating compactor, the tapping time is 40 minutes, the vibration frequency is 5Hz, and the amplitude is 5mm.
  • the second aspect of the present invention provides an application of the thermally conductive interface material, which is used for heat dissipation of electronic products.
  • the electronic products can be listed as watches, smart phones, telephones, televisions, video disc players (VCD, SVCD, DVD), video recorders, camcorders, radios, radio cassette recorders, combined speakers, compact disc players (CD), computers, games Machine waiting.
  • VCD video disc players
  • SVCD SVCD
  • DVD video recorders
  • camcorders radios
  • radio cassette recorders combined speakers
  • compact disc players (CD) computers, games Machine waiting.
  • a thermal interface material, by weight, the preparation raw materials include: 15.92 parts of liquid silica gel, 31.45 parts of metal powder, 10.36 parts of metal oxides, 26.64 parts of carbon materials, 0.32 parts of alkenyl-containing siloxane, and 15.31 parts of ceramic materials .
  • the liquid silica gel model is Waker-9212 A/B, purchased from Wacker, Germany.
  • the metal powder is composed of aluminum powder with an average particle size of 5 microns and aluminum powder with an average particle size of 40 microns; the weight ratio of the 5 microns aluminum powder to the 40 microns aluminum powder is 1:1.
  • the molecular formula of the metal oxide is M x O y , where M is Zn, x is 1, and y is 1; the average particle size of the metal oxide is 600 nm.
  • the carbon material is carbon fiber, and the average length of the carbon fiber is 150 microns.
  • the model number of the alkenyl-containing siloxane is KH171.
  • the ceramic material is composed of aluminum nitride with an average particle size of 1 micron and aluminum nitride with an average particle size of 5 microns, and the weight ratio of the 1 micron aluminum nitride to the 5 micron aluminum nitride is 1.1:1.
  • the preparation method of the thermally conductive interface material includes the following steps:
  • step S2 Add metal powder, metal oxides, and ceramic materials to the mixture obtained in step S1, vacuum and stir for 10 minutes on the planet, then shovel the material on the paddle and pot wall and continue to vacuum and stir for 5 minutes, and then put the paddle and pot wall on Continue to vacuum and stir for 5 minutes under the shovel;
  • step S3 Add half of the carbon material to the mixture obtained in step S2, vacuum and stir for 5 minutes on the planet, then shovel the material on the paddle and pot wall and continue to vacuum and stir for 5 minutes, and then shovel the material on the paddle and pot wall to continue Vacuum and stir for 5 minutes;
  • step S4 Add the remaining carbon material to the mixture obtained in step S3, vacuum and stir for 5 minutes on the planet, then shovel the material on the paddle and pot wall and continue to vacuum and stir for 5 minutes, then shovel the material on the paddle and pot wall to continue vacuuming Stir for 5 minutes, then shovel the material on the paddle and pot wall and continue to vacuum and stir for 5 minutes;
  • step S1 Put the mixed material obtained in step S1 into a hydraulic injection extruder and spit it out through a needle nozzle.
  • the diameter of the needle nozzle is 2.5mm.
  • the material is arranged neatly in the container and stacked to 1/3 of the height. Then the material is removed in a vibrating compactor.
  • Tap the tap time is 40 minutes, the vibration frequency is 5 Hz, and the amplitude is 5 mm; after continuing to pile up to 2/3 height, the material is tapped by a vibrating compactor.
  • the tap time is 40 minutes, the vibration frequency is 5 Hz, and the amplitude It is 5mm; after continuing to pile up to a height of 3/3, the material is tapped in a vibrating compactor.
  • the tapping time is 40 minutes, the vibration frequency is 5Hz, and the amplitude is 5mm.
  • the dimensions of the length, width, and height of the container are 250 mm, 150 mm, and 150 mm, respectively.
  • step (2) Put the rectangular parallelepiped container in step (2) in a vacuum drying box to evacuate to ⁇ -0.098MPa, then release the vacuum after 2 minutes, and tap the material with a vibrating compactor; then put it in the vacuum drying box to evacuate to ⁇ -0.098MPa, After 2 minutes, put the vacuum on, and the material will be compacted in the vibrating compactor; after pressing the heavy objects, put them in a vacuum drying oven to vacuum to ⁇ -0.098MPa, and put the vacuum after 2 minutes, then put the heavy objects in the vacuum drying box together Evacuate the vacuum to ⁇ -0.098MPa, and release the vacuum after 2 minutes.
  • the force applied by the weight to the container in step (3) and step (4) is 300 kgf.
  • a thermal interface material, by weight, the preparation raw materials include: 13 parts of liquid silica gel, 27 parts of metal powder, 7 parts of metal oxide, 20 parts of carbon material, 0.1 part of alkenyl-containing siloxane, and 11 parts of ceramic material .
  • the liquid silica gel model is Waker-9212 A/B, purchased from Wacker, Germany.
  • the metal powder is composed of aluminum powder with an average particle size of 5 microns and aluminum powder with an average particle size of 40 microns; the weight ratio of the 5 microns aluminum powder to the 40 microns aluminum powder is 0.8:1.
  • the molecular formula of the metal oxide is M x O y , where M is Zn, x is 1, and y is 1; the average particle size of the metal oxide is 600 nm.
  • the carbon material is carbon fiber, and the average length of the carbon fiber is 150 microns.
  • the model number of the alkenyl-containing siloxane is KH171.
  • the ceramic material is composed of aluminum nitride with an average particle size of 1 micron and aluminum nitride with an average particle size of 5 microns, and the weight ratio of the 1 micron aluminum nitride to the 5 micron aluminum nitride is 1.3:1.
  • a thermal interface material based on parts by weight, the preparation raw materials include: 20 parts of liquid silica gel, 35 parts of metal powder, 13 parts of metal oxides, 30 parts of carbon materials, 0.5 parts of alkenyl-containing siloxane, and 20 parts of ceramic materials. .
  • the liquid silica gel model is Waker-9212 A/B, purchased from Wacker, Germany.
  • the metal powder is composed of aluminum powder with an average particle size of 5 microns and aluminum powder with an average particle size of 40 microns; the weight ratio of the 5 microns aluminum powder to the 40 microns aluminum powder is 1.2:1.
  • the molecular formula of the metal oxide is M x O y , where M is Zn, x is 1, and y is 1; the average particle size of the metal oxide is 600 nm.
  • the carbon material is carbon fiber, and the average length of the carbon fiber is 150 microns.
  • the model number of the alkenyl-containing siloxane is KH171.
  • the ceramic material is composed of aluminum nitride with an average particle size of 1 micron and aluminum nitride with an average particle size of 5 microns, and the weight ratio of the 1 micron aluminum nitride to the 5 micron aluminum nitride is 0.9:1.
  • a thermal interface material based on parts by weight, the preparation raw materials include: 15.92 parts of liquid silica gel, 31.45 parts of metal powder, 10.36 parts of metal oxides, 26.64 parts of carbon materials, 0.32 parts of alkenyl-containing siloxane, and 15.31 parts of ceramic materials .
  • the liquid silica gel model is Waker-9212 A/B, purchased from Wacker, Germany.
  • the metal powder is composed of aluminum powder with an average particle size of 5 microns and aluminum powder with an average particle size of 40 microns; the weight ratio of the 5 microns aluminum powder to the 40 microns aluminum powder is 0.4:1.
  • the molecular formula of the metal oxide is M x O y , where M is Zn, x is 1, and y is 1; the average particle size of the metal oxide is 600 nm.
  • the carbon material is carbon fiber, and the average length of the carbon fiber is 150 microns.
  • the model number of the alkenyl-containing siloxane is KH171.
  • the ceramic material is composed of aluminum nitride with an average particle size of 1 micron and aluminum nitride with an average particle size of 5 microns, and the weight ratio of the 1 micron aluminum nitride to the 5 micron aluminum nitride is 1.1:1.
  • a thermal interface material based on parts by weight, the preparation raw materials include: 15.92 parts of liquid silica gel, 31.45 parts of metal powder, 10.36 parts of metal oxides, 26.64 parts of carbon materials, 0.32 parts of alkenyl-containing siloxane, and 15.31 parts of ceramic materials .
  • the liquid silica gel model is Waker-9212 A/B, purchased from Wacker, Germany.
  • the metal powder is composed of aluminum powder with an average particle size of 5 microns and aluminum powder with an average particle size of 40 microns; the weight ratio of the 5 microns aluminum powder to the 40 microns aluminum powder is 3:1.
  • the molecular formula of the metal oxide is M x O y , where M is Zn, x is 1, and y is 1; the average particle size of the metal oxide is 600 nm.
  • the carbon material is carbon fiber, and the average length of the carbon fiber is 150 microns.
  • the model number of the alkenyl-containing siloxane is KH171.
  • the ceramic material is composed of aluminum nitride with an average particle size of 1 micron and aluminum nitride with an average particle size of 5 microns, and the weight ratio of the 1 micron aluminum nitride to the 5 micron aluminum nitride is 1.1:1.
  • a thermally conductive interface material The specific composition is the same as that of Example 1. The difference is that the ceramic material is composed of aluminum nitride with an average particle size of 1 micron and aluminum nitride with an average particle size of 5 microns. The weight ratio of aluminum nitride to 5 micron aluminum nitride is 0.5:1.
  • a thermally conductive interface material The specific composition is the same as that of Example 1. The difference is that the ceramic material is composed of aluminum nitride with an average particle size of 1 micron and aluminum nitride with an average particle size of 5 microns. The weight ratio of aluminum nitride to 5 micron aluminum nitride is 3:1.
  • thermally conductive interface material the specific components are the same as in Example 1, except that the model number of the alkenyl-containing siloxane is KH560.
  • a thermal interface material the specific composition is the same as that of Example 1, the difference is that the molecular formula of the metal oxide is M x O y , where M is Al, x is 2, and y is 3; The average particle size is 600nm.
  • a thermal interface material the specific composition is the same as that of Example 1, the difference is that the metal powder is composed of aluminum powder with an average particle size of 10 microns and aluminum powder with an average particle size of 40 microns; The weight ratio of powder to 40 micron aluminum powder is 1:1.
  • a thermally conductive interface material The specific composition is the same as that of Example 1. The difference is that the ceramic material is composed of aluminum nitride with an average particle size of 3 microns and aluminum nitride with an average particle size of 5 microns. The weight ratio of aluminum nitride to 5 micron aluminum nitride is 1.1:1.
  • the test method refers to the standard ASTM D5470 to test the thermal conductivity of the thermally conductive material along the fiber orientation direction, unit: W/(m ⁇ K)
  • Hardness Test with a Shore OO hardness tester, put the thermal interface material under the needle insertion device of the hardness tester, wait for the device to make a beep 3 seconds later, and the data is stable, and record the data (the average value of five different positions) ), Unit: Shore OO. See Table 1 for details.
  • Example Thermal Conductivity hardness Example 1 50 49 Example 2 46 47 Example 3 48 49 Example 4 31 48 Example 5 25 38 Example 6 34 48
  • Example 7 28 35 Example 8 36 31 Example 9 33 49 Example 10 35 34 Example 11 37 32

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Abstract

L'invention concerne un matériau d'interface thermoconducteur à haute performance et une utilisation de celui-ci, les matières premières pour la préparation de ce matériau comprenant, en proportions pondérales : 13 à 20 parties de gel de silice liquide, 27 à 35 parties de poudre métallique, 7 à 13 parties d'oxyde métallique, 20 à 30 parties de matériau carboné et 0,1 à 0,5 partie de siloxane contenant un alcanyle ; la poudre métallique comprend de la poudre de cuivre, de la poudre d'aluminium, de la poudre d'argent, de la poudre de fer, de la poudre de zinc, de la poudre de nickel et/ou de la poudre d'étain.
PCT/CN2020/111612 2019-09-05 2020-08-27 Matériau d'interface thermoconducteur à haute performance et son utilisation WO2021043051A1 (fr)

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