WO2021031498A1 - Vibration sensing apparatus - Google Patents
Vibration sensing apparatus Download PDFInfo
- Publication number
- WO2021031498A1 WO2021031498A1 PCT/CN2019/129221 CN2019129221W WO2021031498A1 WO 2021031498 A1 WO2021031498 A1 WO 2021031498A1 CN 2019129221 W CN2019129221 W CN 2019129221W WO 2021031498 A1 WO2021031498 A1 WO 2021031498A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cavity
- sensing device
- housing
- substrate
- vibration
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
Definitions
- the present invention relates to the technical field of vibration sensing, and more specifically, the present invention relates to a vibration sensing device.
- the existing vibration sensing device usually includes a housing and a mass arranged in the housing.
- the mass block is suspended inside the shell through the diaphragm.
- the housing has an open end.
- the substrate of the vibration sensor is hermetically connected to the open end.
- a MEMS chip and an ASIC chip are arranged on the side of the substrate opposite to the housing, and also a shell arranged outside the MEMS chip and the ASIC chip.
- the substrate has communication holes.
- the MEMS chip communicates with the inner cavity of the housing through the communication hole.
- the vibration sensing device is fixed on the equipment to be measured.
- the vibration is transmitted to the shell, which drives the shell to sound and vibrate.
- the mass Since the mass has a set mass and the diaphragm has elasticity, the mass will vibrate relative to the shell.
- the vibration of the mass causes the volume of the chambers on both sides of the diaphragm to change. Since the inner cavity is airtight, the volume in the cavity will change, and the pressure in the cavity will change accordingly.
- the MEMS chip senses the pressure change, it generates a corresponding electrical signal.
- the electrical signal is amplified by the ASIC chip and then transmitted to the external circuit.
- the external circuit collects the electrical signal.
- the existing vibration sensing device can usually only sense the pressure change of one chamber, and the sensing sensitivity is relatively low.
- An object of the present invention is to provide a new technical solution for a vibration sensing device.
- a vibration sensing device including:
- a housing a cavity is formed inside the housing, a vent is provided on the housing, and the vent is configured to be in an open state when the vibration sensing device is assembled. The device is closed after assembly;
- An elastic element, the elastic element is arranged in the cavity
- a mass element the mass element is suspended in the cavity by the elastic element, and can move in the cavity together with the elastic element to change the pressure in the cavity;
- a vibration sensor the vibration sensor is in communication with the cavity, and the vibration sensor is configured to sense the pressure in the cavity or the pressure difference of different regions in the cavity.
- the vent is sealed by a glue.
- a plastic seal is used to form a plastic seal at the position of the air vent.
- the plastic sealing layer also covers the outer side of the housing and the vibration sensor.
- the vibration sensor includes a packaging structure with a containing cavity formed by a substrate and a housing, and a MEMS chip and an ASIC chip housed in the containing cavity and fixedly arranged on the substrate;
- the housing has an open end, the substrate is hermetically connected to the open end of the housing, the substrate is provided with a through hole that communicates the back cavity of the MEMS chip with the cavity, and the MEMS chip Connect with the ASIC chip.
- the housing includes a side wall arranged around the MEMS chip and the ASIC chip, and a bottom plate opposite to the substrate;
- a metalized through hole is provided in the sidewall, and a pad is provided on the bottom plate, and the pad and the ASIC chip are electrically connected through the metalized through hole.
- the MEMS chip includes a substrate and a sensing film, and the substrate is a hollow structure;
- the sensing film is disposed at one end of the substrate and covers the hollow structure, the hollow structure forms the back cavity, and the other end of the substrate is fixedly connected to the substrate;
- the sensing film is provided with first air-permeable micropores.
- the mass element is attached to the surface of the elastic element, and second air-permeable micropores are jointly provided on the mass element and the elastic element.
- the elastic element is an elastic diaphragm.
- a vent is provided on the housing.
- the internal and external air pressure can be effectively balanced during the assembly phase, and the product can also be isolated during the use phase.
- the inner cavity and the external environment prevent foreign matter from entering the inner cavity, which helps to improve the performance of the product and prolong the service life of the product.
- the vibration sensor also has the characteristics of high sensitivity for sensing vibration.
- Fig. 1 is a schematic structural diagram of a vibration sensing device according to an embodiment of the present disclosure.
- Fig. 2 is a schematic structural diagram of another vibration sensing device according to an embodiment of the present disclosure.
- a vibration sensing device may be a bone voiceprint sensing device, an environment sensing device, or the like. As shown in Figs. 1 and 2, the vibration sensing device includes: a housing 6, an elastic element 7, a mass element 8, and a vibration sensor.
- the housing 6 has an open end. A cavity is formed inside the housing 6.
- the material of the housing 6 is metal, plastic or PCB board.
- the shape of the housing 6 is a cylindrical shape, a rectangular parallelepiped, or the like. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.
- a vent 603 is provided in the housing 6.
- the vent 603 has a ring structure, for example.
- the housing 6 is provided with a vent 603.
- the vent 603 should be in an open state. The reason is that in the process of assembling the vibration sensing device, the welding process is usually involved, and the gas inside the cavity will change in pressure during welding. At this time, if there is no open air vent 603, it will cause The phenomenon of uneven pressure inside the cavity. That is, opening the air vent 603 can maintain uniform pressure inside and outside the cavity during welding, which can prevent damage to the product and affect the quality of the product.
- the vent 603 After the vibration sensing device is assembled, especially when the vibration sensing device is used, it is necessary to close the vent 603 to prevent external dust, dust and other particles, or water, oil, etc. from entering the cavity Inside the body, thus affecting the performance and service life of the product.
- the pressure in the cavity can be controlled at 0.01-10 atmospheres.
- the elastic element 7 is arranged in the cavity.
- the elastic element 7 is used to provide elastic restoring force for the mass element 8.
- the elastic element 7 may be an elastic diaphragm, for example.
- the elastic element 7 can also be other elastic elements known to those skilled in the art, and the present invention does not limit this.
- the elastic element 7 includes an elastic part located in the middle part and an edge part arranged around the elastic part.
- the elastic part can be elastically deformed to provide elastic restoring force.
- the edge portion is used to connect with the inner wall of the housing 6.
- the entire elastic element 7 can be fixedly arranged in the cavity.
- the mass element 8 is suspended in the cavity by the elastic element 7 and can move in the cavity together with the elastic element 7 to change the pressure in the cavity.
- the mass element 8 and the elastic part of the elastic element 7 are connected by an adhesive, so that the mass element 8 is firmly attached to the surface of the elastic element 7.
- the mass element 8 and the elastic element 7 can also be combined together in other ways known to those skilled in the art, which is not limited.
- the mass element 8 is a mass of a predetermined weight, and those skilled in the art can flexibly adjust the weight of the mass as required, and there is no limitation on this.
- the cavity in the housing 6 can be divided into a first chamber 601 and a second chamber 602.
- the first chamber 601 and the second chamber 602 both have a set volume. Seal the gas with a predetermined pressure in the two chambers.
- the gas can be, for example, air, nitrogen, inert gas, etc., and those skilled in the art can flexibly choose according to needs, and there is no restriction on this.
- the mass element 8 and the elastic element 7 are jointly provided with second air-permeable micropores 9.
- the size of the second air-permeable micropores 9 is very small, belonging to the micron level.
- the second air-permeable micropores 9 can allow air to flow through, so that the air can pass through and then be discharged through the vent 603, which helps to balance the air pressure inside and outside the cavity.
- Those skilled in the art can appropriately adjust the number and position of the second air-permeable micro-holes 9 as needed, and there is no limitation on this.
- the vibration sensor communicates with the cavity formed in the housing 6.
- the vibration sensor is configured to sense the pressure in the cavity or the pressure difference in different areas in the cavity.
- a vibration sensor can be used to sense the pressure difference between the first chamber 601 and the second chamber 602.
- the vibration sensor can be, for example, an electric sensor, a piezoelectric sensor, an eddy current sensor, an inductive sensor, a capacitive sensor, etc.
- the vibration sensor can be, for example, an electric sensor, a piezoelectric sensor, an eddy current sensor, an inductive sensor, a capacitive sensor, etc.
- the vibration sensing device provided by the embodiment of the present invention can obtain the pressure difference between the first chamber 601 and the second chamber 602 through the vibration sensor; and calculate the vibration state at the location of the vibration sensor through the pressure difference.
- the vibration sensing device is installed on the object to be detected, for example, a human joint, a robot joint, etc.
- the vibration of the object to be detected will drive the housing 6 to vibrate. Due to the combined action of the inertia of the mass element 8 and the elastic restoring force of the elastic element 7, the mass element 8 will vibrate relative to the housing 6.
- the vibration of the mass element 8 and the elastic element 7 causes the volume of the first chamber 601 and the second chamber 602 to change. Since both chambers are closed chambers, the first chamber 601 and the second chamber 602 The pressure of the gas inside will change.
- the vibration sensor senses the pressure difference between the first chamber 601 and the second chamber 602, and converts the pressure difference into an electrical signal, such as a voltage signal, a current signal, or a capacitance signal.
- the electrical signal is calculated to obtain the vibration state of the object to be detected. For example, amplitude, vibration frequency, etc.
- the housing 6 is provided with a vent 603.
- the internal and external air pressure can be effectively balanced during the assembly stage, and it can also be used Separate the inner cavity of the product from the external environment in stages to prevent foreign matter from entering the inner cavity, which helps to improve the performance of the product and prolong the service life of the product.
- the vibration sensor is usually only provided in the first chamber 601 or the second chamber 603, and at this time, only the pressure change of one chamber is sensed to detect the to-be-detected The vibration state of the object.
- the vibration sensor can sense the pressure difference between the first chamber 601 and the second chamber 602, and has the feature of high sensitivity for sensing vibration.
- a plastic sealing method can be used. Specifically, the plastic sealing layer 10 is formed at the position of the air vent 603 by plastic sealing. At this time, the plastic sealing layer 11 directly covers the vent 603 to completely seal the vent 603. This design can play the role of dustproof, waterproof and oil-proof.
- the vent 603 can be covered by plastic sealing, or the vibration sensing device can be plastic-encapsulated as a whole.
- the vibration sensing device is plastic-encapsulated as a whole
- the formed plastic sealing layer 10 covers the outer side of the housing 6 and the vibration sensor, and the plastic sealing layer 10 can protect the whole vibration sensing device from dust, water and oil.
- the air vent 603 when sealing the air vent 603 on the housing 6, the air vent 603 can also be blocked by the glue 11. That is, the leak hole 603 is closed with the glue 11 in a way of blocking the hole.
- the glue 11 can use glue materials well known in the art.
- the blocked air vent 603 can isolate the inner cavity of the housing 6 from the external environment, so that it can prevent dust, water, and oil.
- the vibration sensing device can be applied to various atmospheric environments with a wide range of applications.
- the vibration sensor and the housing 6 are connected together.
- the shell 6 has a dish-shaped structure, one end of which is an open end, and the vibration sensor is connected to the open end of the shell 6 to close the open end of the shell 6.
- the vibration sensor of the present invention includes a packaging structure with a housing cavity 203 formed by a substrate 1 and a housing 2, and a MEMS housed in the housing cavity 203 and fixedly arranged on the substrate 1.
- the substrate 1 is, for example, a PCB board.
- the substrate 1 is hermetically connected to the open end of the housing 6.
- a through hole 101 is provided on the substrate 1, and the through hole 101 is used to communicate the cavity in the housing 6 with the back cavity 303 in the MEMS chip 3.
- the through hole 101 is a round hole, a square hole, etc., and those skilled in the art can flexibly adjust according to specific needs, and there is no limitation on this.
- the difficulty of opening the through hole 101 on the substrate 1 is small and the processing is easy.
- the MEMS chip 3 includes a substrate 304 and a sensing film 301.
- the substrate 304 is a hollow structure.
- the sensing film 301 is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like.
- the sensing film 301 is disposed at one end of the substrate 304 and covers the hollow structure.
- the hollow structure forms a back cavity 303.
- the other end of the substrate 304 is fixedly connected to the substrate 1.
- the sensing film 301 is provided with first air-permeable micro holes 302.
- a welding process is inevitably involved, for example, welding the housing 6 and the substrate 1 or welding the housing 2 and the substrate 1.
- the air flow generated during the welding process will remain in the cavity and the containing cavity 203.
- a first vent 302 is provided on the sensing membrane 301, and the second vent 9 on the elastic element 7 and the mass element 8 can make the receiving cavity 203
- the middle air flow smoothly flows into the cavity, and finally is smoothly discharged from the air vent 603.
- the size of the first air-permeable micro-holes 302 is also very small, which also belongs to the micron level.
- the number of first air-permeable micro-holes 302 can be set as one or multiple as required, and there is no limitation on this.
- the size of the first air-permeable micropores 302 can be the same as or different from the second air-permeable micropores 9.
- the ASIC chip 4 is integrated on the substrate 1.
- the MEMS chip 3 is connected to the ASIC chip 4 through metal wires.
- the ASIC chip 4 is connected to the substrate 1 through metal wires.
- the ASIC chip 4 can be used to amplify the signal collected by the MEMS chip 3. Among them, the ASIC chip 4 can also be replaced by other signal amplifiers well known to those skilled in the art, and those skilled in the art can choose flexibly according to needs.
- the housing 2 and the substrate 1 are fixedly connected.
- the housing 2 and the substrate 1 may enclose a receiving cavity 203, and the receiving cavity 203 may be used to house the MEMS chip 3 and the ASIC chip 4.
- the structure of the housing 2 includes a side wall 202 arranged around the MEMS chip 3 and the ASIC chip 4, and a bottom plate 201 opposite to the substrate 1.
- a plurality of pads 5 are provided on the outside of the bottom plate 201.
- the number of pads 5 can be set to three, four or more as needed.
- the bottom plate 201 is, for example, a circuit board or a metal plate, which is not limited.
- a metalized through hole is provided in the sidewall 202, and a pad 5 is provided on the bottom plate 201, and the pad 5 and the ASIC chip 4 are electrically connected through the metalized through hole. When in use, solder the pad 5 directly to the external circuit.
- the housing 2 and the substrate 1 can be fixed together by glue bonding or solder paste welding.
- the substrate 1 and the housing 6 can also be fixed together by glue bonding or solder paste welding.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
A vibration sensing apparatus, comprising a housing (6), an elastic element (7), a mass element (8), and a vibrations sensor. A cavity is formed in the housing (6); an air vent (603) is provided on the housing (6); the air vent (603) is configured to be in an opened state when assembling is performed on the vibration sensing apparatus, and to be in a closed state after the assembling of the vibration sensing apparatus is completed; the elastic element (7) is provided in the cavity; the mass element (8) is suspended in the cavity by means of the elastic element (7), and can move along with the elastic element (7) in the cavity so as to change pressure in the cavity; the vibration sensor is communicated with the cavity; the vibration sensor is configured to measure the pressure in the cavity or a pressure difference between different regions in the cavity. The vibration sensing apparatus facilitates improving the performance of a product and prolonging the service life of the product.
Description
本发明涉及振动感测技术领域,更具体地,本发明涉及一种振动感测装置。The present invention relates to the technical field of vibration sensing, and more specifically, the present invention relates to a vibration sensing device.
现有的振动感测装置通常包括壳体以及设置在壳体内的质量块。质量块通过振膜悬置在壳体的内部。壳体具有敞开端。振动传感器的基板密封连接在敞开端。在基板的与壳体相对的一侧设置有MEMS芯片、ASIC芯片,还包括设置在MEMS芯片和ASIC芯片外的外壳。基板上具有连通孔。MEMS芯片通过连通孔与壳体的内腔连通。The existing vibration sensing device usually includes a housing and a mass arranged in the housing. The mass block is suspended inside the shell through the diaphragm. The housing has an open end. The substrate of the vibration sensor is hermetically connected to the open end. A MEMS chip and an ASIC chip are arranged on the side of the substrate opposite to the housing, and also a shell arranged outside the MEMS chip and the ASIC chip. The substrate has communication holes. The MEMS chip communicates with the inner cavity of the housing through the communication hole.
在工作时,振动感测装置被固定在待测量设备上。在该设备工作时,振动传递到壳体上,带动壳体发声振动。由于质量块具有设定的质量,并且振膜具有弹性,故质量块会相对于壳体发生振动。该质量块的振动使得振膜两侧的腔室的容积发生变化。由于内腔是密闭的,故会导致腔室内的容积发生变化,腔室内的压强随之发生变化。当MEMS芯片感测到压强的变化会产生相应的电信号。该电信号经ASIC芯片放大后传输至外部电路。外部电路采集该电信号。然而,现有的振动感测装置通常仅能感测一个腔室的压强变化,感测灵敏度是比较低的。During work, the vibration sensing device is fixed on the equipment to be measured. When the device is working, the vibration is transmitted to the shell, which drives the shell to sound and vibrate. Since the mass has a set mass and the diaphragm has elasticity, the mass will vibrate relative to the shell. The vibration of the mass causes the volume of the chambers on both sides of the diaphragm to change. Since the inner cavity is airtight, the volume in the cavity will change, and the pressure in the cavity will change accordingly. When the MEMS chip senses the pressure change, it generates a corresponding electrical signal. The electrical signal is amplified by the ASIC chip and then transmitted to the external circuit. The external circuit collects the electrical signal. However, the existing vibration sensing device can usually only sense the pressure change of one chamber, and the sensing sensitivity is relatively low.
并且,现有的振动感测装置在进行组装的过程中,很有必要在壳体上开设泄气口,可以在回流焊接时保持内外压力平衡,从而避免产品受到损伤。而在组装完成后,壳体上的泄气口若依然存,就会给产品带来一定的问题,例如,非常容易造成外界的灰尘、粉尘、水、油污等经泄气口进入到壳体的内部,这样会对产品的性能造成很大的影响,还会降低产品的使用寿命。特别是在真空度较低时,会导致产品的性能大幅度下降。In addition, during the assembly process of the existing vibration sensing device, it is necessary to open a vent on the housing, which can maintain the internal and external pressure balance during reflow soldering, thereby avoiding product damage. After the assembly is completed, if the vent on the shell still exists, it will cause certain problems to the product, for example, it is very easy to cause external dust, dust, water, oil, etc. to enter the interior of the shell through the vent , This will have a great impact on the performance of the product and also reduce the service life of the product. Especially when the vacuum degree is low, the performance of the product will be greatly reduced.
因此,需要提供一种新的技术方案,以解决上述技术问题。Therefore, it is necessary to provide a new technical solution to solve the above technical problems.
发明内容Summary of the invention
本发明的一个目的是提供一种振动感测装置的新技术方案。An object of the present invention is to provide a new technical solution for a vibration sensing device.
根据本发明的一个方面,提供一种振动感测装置,包括:According to one aspect of the present invention, there is provided a vibration sensing device, including:
壳体,在所述壳体的内部形成腔体,在所述壳体上设置有泄气口,所述泄气口被构造为:在对振动感测装置进行组装时为敞开状态,在振动感测装置组装结束后为封闭状态;A housing, a cavity is formed inside the housing, a vent is provided on the housing, and the vent is configured to be in an open state when the vibration sensing device is assembled. The device is closed after assembly;
弹性元件,所述弹性元件设置在所述腔体内;An elastic element, the elastic element is arranged in the cavity;
质量元件,所述质量元件通过所述弹性元件悬置在所述腔体内,并能随所述弹性元件一起在所述腔体内移动,以改变所述腔体内的压强;以及A mass element, the mass element is suspended in the cavity by the elastic element, and can move in the cavity together with the elastic element to change the pressure in the cavity; and
振动传感器,所述振动传感器与所述腔体连通,所述振动传感器被构造为:用于感测所述腔体内的压强或者所述腔体内不同区域的压强差。A vibration sensor, the vibration sensor is in communication with the cavity, and the vibration sensor is configured to sense the pressure in the cavity or the pressure difference of different regions in the cavity.
可选地,所述在振动感测装置组装结束后,采用胶体将所述泄气口进行封堵。Optionally, after the assembling of the vibration sensing device is completed, the vent is sealed by a glue.
可选地,所述在振动感测装置组装结束后,采用塑封的方式在所述泄气口的位置形成塑封层。Optionally, after the assembling of the vibration sensing device is completed, a plastic seal is used to form a plastic seal at the position of the air vent.
可选地,所述塑封层还覆盖在所述壳体和所述振动传感器的外侧。Optionally, the plastic sealing layer also covers the outer side of the housing and the vibration sensor.
可选地,所述振动传感器包括由基板和外壳形成的具有容纳腔的封装结构,以及收容在所述容纳腔内且固定设置在所述基板上的MEMS芯片和ASIC芯片;Optionally, the vibration sensor includes a packaging structure with a containing cavity formed by a substrate and a housing, and a MEMS chip and an ASIC chip housed in the containing cavity and fixedly arranged on the substrate;
所述壳体具有敞开端,所述基板密封连接在所述壳体的敞开端,所述基板上设置有将所述MEMS芯片的背腔与所述腔体连通的通孔,所述MEMS芯片和所述ASIC芯片连接。The housing has an open end, the substrate is hermetically connected to the open end of the housing, the substrate is provided with a through hole that communicates the back cavity of the MEMS chip with the cavity, and the MEMS chip Connect with the ASIC chip.
可选地,所述外壳包括围绕所述MEMS芯片和所述ASIC芯片设置的侧壁,以及与所述基板相对的底板;Optionally, the housing includes a side wall arranged around the MEMS chip and the ASIC chip, and a bottom plate opposite to the substrate;
在所述侧壁内设置有金属化通孔,在所述底板上设置有焊盘,所述焊盘与所述ASIC芯片通过所述金属化通孔电连接。A metalized through hole is provided in the sidewall, and a pad is provided on the bottom plate, and the pad and the ASIC chip are electrically connected through the metalized through hole.
可选地,所述焊盘为多个。Optionally, there are multiple pads.
可选地,所述MEMS芯片包括衬底和感应膜,所述衬底为中空结构;Optionally, the MEMS chip includes a substrate and a sensing film, and the substrate is a hollow structure;
所述感应膜设置在所述衬底的一端并覆盖所述中空结构,所述中空结构形成所述背腔,所述衬底的另一端与所述基板固定连接;The sensing film is disposed at one end of the substrate and covers the hollow structure, the hollow structure forms the back cavity, and the other end of the substrate is fixedly connected to the substrate;
在所述感应膜上设置有第一透气微孔。The sensing film is provided with first air-permeable micropores.
可选地,所述质量元件贴合在所述弹性元件的表面上,在所述质量元件和所述弹性元件上共同设置有第二透气微孔。Optionally, the mass element is attached to the surface of the elastic element, and second air-permeable micropores are jointly provided on the mass element and the elastic element.
可选地,所述弹性元件为弹性膜片。Optionally, the elastic element is an elastic diaphragm.
本发明实施例提供的振动感测装置,在壳体上开设有泄气口,通过对泄气口的敞开和封闭的合理设置,既可以在组装阶段有效地平衡内外气压,也可以在使用阶段隔离产品内腔和外界环境,防止异物进入内腔,有助于提高产品的性能和延长产品的使用寿命。并且,该振动传感器还具有感测振动的灵敏度高的特点。In the vibration sensing device provided by the embodiment of the present invention, a vent is provided on the housing. By properly setting the opening and closing of the vent, the internal and external air pressure can be effectively balanced during the assembly phase, and the product can also be isolated during the use phase. The inner cavity and the external environment prevent foreign matter from entering the inner cavity, which helps to improve the performance of the product and prolong the service life of the product. In addition, the vibration sensor also has the characteristics of high sensitivity for sensing vibration.
通过以下参照附图对本发明的示例性实施例的详细描述,本发明的其它特征及其优点将会变得清楚。Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.
构成说明书的一部分的附图描述了本发明的实施例,并且连同说明书一起用于解释本发明的原理。The drawings constituting a part of the specification describe the embodiments of the present invention, and together with the specification are used to explain the principle of the present invention.
图1是根据本公开的一个实施例的振动感测装置的结构示意图。Fig. 1 is a schematic structural diagram of a vibration sensing device according to an embodiment of the present disclosure.
图2是根据本公开的一个实施例的另一种振动感测装置的结构示意图。Fig. 2 is a schematic structural diagram of another vibration sensing device according to an embodiment of the present disclosure.
附图标记说明:Description of reference signs:
1:基板;101:通孔;2:外壳;201:底板;202:侧壁;203:容纳腔;3:MEMS芯片;301:感应膜;302:第一透气微孔;303:背腔;304:衬底;4:ASIC芯片;5:焊盘;6:壳体;601:第一腔室;602:第二腔室;603:泄气口;7:弹性元件;8:质量元件;9:第二透气微孔;10:塑封层;11:胶体。1: substrate; 101: through hole; 2: housing; 201: bottom plate; 202: side wall; 203: containing cavity; 3: MEMS chip; 301: sensing membrane; 302: first air-permeable micropore; 303: back cavity; 304: substrate; 4: ASIC chip; 5: pad; 6: housing; 601: first chamber; 602: second chamber; 603: vent; 7: elastic element; 8: mass element; 9 : The second air-permeable micropore; 10: the plastic sealing layer; 11: the colloid.
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、 数字表达式和数值不限制本发明的范围。Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.
以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本发明及其应用或使用的任何限制。The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论,但在适当情况下,所述技术和设备应当被视为说明书的一部分。The technology and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technology and equipment should be regarded as part of the specification.
在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。In all the examples shown and discussed herein, any specific value should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiment may have different values.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。It should be noted that similar reference numerals and letters indicate similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
根据本发明的一个实施例,提供了一种振动感测装置。该振动感测装置可以为骨声纹传感装置、环境感测装置等。如图1和图2所示,该振动感测装置包括:壳体6、弹性元件7、质量元件8以及振动传感器。According to an embodiment of the present invention, a vibration sensing device is provided. The vibration sensing device may be a bone voiceprint sensing device, an environment sensing device, or the like. As shown in Figs. 1 and 2, the vibration sensing device includes: a housing 6, an elastic element 7, a mass element 8, and a vibration sensor.
壳体6具有敞开端。在壳体6的内部形成腔体。例如,壳体6的材质为金属、塑料或者PCB板等。壳体6的形状为圆柱状、长方体等。本领域技术人员可以根据实际需要灵活调整,对此不作限制。The housing 6 has an open end. A cavity is formed inside the housing 6. For example, the material of the housing 6 is metal, plastic or PCB board. The shape of the housing 6 is a cylindrical shape, a rectangular parallelepiped, or the like. Those skilled in the art can flexibly adjust according to actual needs, and there is no limitation on this.
并且,在壳体6上设置有泄气口603。该泄气口603例如呈环状结构。在振动感测装置的生产中,特别是在对振动感测装置进行组装的过程中,在壳体6上开设有泄气口603,此时,泄气口603应当处于敞开状态。究其原因在于:在对振动感测装置进行组装的过程中,通常需要涉及焊接工艺,而在焊接时腔体内部的气体会有压力的变化,此时若没有敞开的泄气口603就会造成腔体内部的压力不均匀的现象。即,将泄气口603敞开可以在焊接时保持腔体内外压力均匀,这样可以避免产品受到损伤,影响产品的品质。当对振动感测装置组装完毕后,特别是在使用该振动感测装置时,很有必要将该泄气口603封闭起来,以防止外界的灰尘、粉尘等颗粒物,或者水、油等进入到腔体内部,从而影响到产品的性能和使用寿命。但是,需要说明的是,将泄气口603封闭起来时,需要避免出现腔体内外气压相差过大的情况。例如,可以将腔体内的压强控制在0.01-10个大气 压。In addition, a vent 603 is provided in the housing 6. The vent 603 has a ring structure, for example. In the production of the vibration sensing device, especially in the process of assembling the vibration sensing device, the housing 6 is provided with a vent 603. At this time, the vent 603 should be in an open state. The reason is that in the process of assembling the vibration sensing device, the welding process is usually involved, and the gas inside the cavity will change in pressure during welding. At this time, if there is no open air vent 603, it will cause The phenomenon of uneven pressure inside the cavity. That is, opening the air vent 603 can maintain uniform pressure inside and outside the cavity during welding, which can prevent damage to the product and affect the quality of the product. After the vibration sensing device is assembled, especially when the vibration sensing device is used, it is necessary to close the vent 603 to prevent external dust, dust and other particles, or water, oil, etc. from entering the cavity Inside the body, thus affecting the performance and service life of the product. However, it should be noted that when closing the vent 603, it is necessary to avoid a situation where the air pressure inside and outside the cavity is too different. For example, the pressure in the cavity can be controlled at 0.01-10 atmospheres.
弹性元件7设置在腔体内。弹性元件7用于为质量元件8提供弹性回复力。弹性元件7例如可以为弹性膜片。当然,弹性元件7也可以为本领域技术人员熟知的其它弹性件,本发明对此不作限制。The elastic element 7 is arranged in the cavity. The elastic element 7 is used to provide elastic restoring force for the mass element 8. The elastic element 7 may be an elastic diaphragm, for example. Of course, the elastic element 7 can also be other elastic elements known to those skilled in the art, and the present invention does not limit this.
在一个例子中,弹性元件7包括位于中部的弹性部以及围绕该弹性部设置的边缘部。弹性部能够发生弹性形变,从而提供弹性回复力。边缘部用于与壳体6的内壁连接。从而能将整个弹性元件7固定设置在腔体内。In an example, the elastic element 7 includes an elastic part located in the middle part and an edge part arranged around the elastic part. The elastic part can be elastically deformed to provide elastic restoring force. The edge portion is used to connect with the inner wall of the housing 6. Thus, the entire elastic element 7 can be fixedly arranged in the cavity.
质量元件8通过弹性元件7悬置在腔体内,并能够随弹性元件7一起在腔体内移动,以改变腔体内的压强。在一个例子中,质量元件8与弹性元件7的弹性部之间通过粘合剂连接,以使质量元件8牢固的贴合在弹性元件7的表面上。当然,质量元件8与弹性元件7之间也可以采用本领域技术人员熟知的其它方式结合在一起,对此不作限制。此外,质量元件8为预定重量的质量块,对于质量块的重量本领域技术人员可以根据需要灵活调整,对此不作限制。The mass element 8 is suspended in the cavity by the elastic element 7 and can move in the cavity together with the elastic element 7 to change the pressure in the cavity. In an example, the mass element 8 and the elastic part of the elastic element 7 are connected by an adhesive, so that the mass element 8 is firmly attached to the surface of the elastic element 7. Of course, the mass element 8 and the elastic element 7 can also be combined together in other ways known to those skilled in the art, which is not limited. In addition, the mass element 8 is a mass of a predetermined weight, and those skilled in the art can flexibly adjust the weight of the mass as required, and there is no limitation on this.
如图1和2所示,质量元件8和弹性元件7连接在一起后,可以将壳体6内的腔体分隔为第一腔室601和第二腔室602两部分。其中,第一腔室601和第二腔室602均具有设定的容积。在两个腔室内密封预定压力的气体。气体例如可以为空气、氮气、惰性气体等,本领域技术人员可以根据需要灵活选择,对此不作限制。As shown in FIGS. 1 and 2, after the mass element 8 and the elastic element 7 are connected together, the cavity in the housing 6 can be divided into a first chamber 601 and a second chamber 602. Wherein, the first chamber 601 and the second chamber 602 both have a set volume. Seal the gas with a predetermined pressure in the two chambers. The gas can be, for example, air, nitrogen, inert gas, etc., and those skilled in the art can flexibly choose according to needs, and there is no restriction on this.
在质量元件8和弹性元件7上共同设置有第二透气微孔9。第二透气微孔9的尺寸非常小,属于微米级。第二透气微孔9可供气流流过,使气流能穿过后经泄气口603排出,有助于平衡腔体内外气压。本领域技术人员可以根据需要对第二透气微孔9的设置数量和位置进行适当的调整,对此不作限制。The mass element 8 and the elastic element 7 are jointly provided with second air-permeable micropores 9. The size of the second air-permeable micropores 9 is very small, belonging to the micron level. The second air-permeable micropores 9 can allow air to flow through, so that the air can pass through and then be discharged through the vent 603, which helps to balance the air pressure inside and outside the cavity. Those skilled in the art can appropriately adjust the number and position of the second air-permeable micro-holes 9 as needed, and there is no limitation on this.
本发明中,振动传感器与壳体6内形成的腔体连通。振动传感器被构造为:用于感测腔体内的压强或者腔体内不同区域的压强差。例如,振动传感器能用于感测第一腔室601和第二腔室602的压强差。其中,振动传感器例如可以为电动式传感器、压电式传感器、涡流式传感器、电感式传感器、电容式传感器等,本领域技术人员可以根据需要灵活选择,对此不 作限制。In the present invention, the vibration sensor communicates with the cavity formed in the housing 6. The vibration sensor is configured to sense the pressure in the cavity or the pressure difference in different areas in the cavity. For example, a vibration sensor can be used to sense the pressure difference between the first chamber 601 and the second chamber 602. Among them, the vibration sensor can be, for example, an electric sensor, a piezoelectric sensor, an eddy current sensor, an inductive sensor, a capacitive sensor, etc. Those skilled in the art can choose flexibly according to needs, and there is no limitation on this.
本发明实施例提供的振动感测装置,能通过振动传感器获取第一腔室601和第二腔室602之间的压强差;以及通过压强差计算振动传感器所在位置的振动状态。The vibration sensing device provided by the embodiment of the present invention can obtain the pressure difference between the first chamber 601 and the second chamber 602 through the vibration sensor; and calculate the vibration state at the location of the vibration sensor through the pressure difference.
在使用时,该振动感测装置被安装在待检测物体上,例如,人的关节、机器人的关节等位置。待检测物体的振动会带动壳体6产生振动,由于质量元件8的惯性以及弹性元件7的弹性回复力的共同作用,故质量元件8会相对壳体6发生振动。质量元件8和弹性元件7的振动使得第一腔室601和第二腔室602的体积发生变化,由于两个腔室都是密闭的腔室,故第一腔室601和第二腔室602内的气体的压强会发生变化。In use, the vibration sensing device is installed on the object to be detected, for example, a human joint, a robot joint, etc. The vibration of the object to be detected will drive the housing 6 to vibrate. Due to the combined action of the inertia of the mass element 8 and the elastic restoring force of the elastic element 7, the mass element 8 will vibrate relative to the housing 6. The vibration of the mass element 8 and the elastic element 7 causes the volume of the first chamber 601 and the second chamber 602 to change. Since both chambers are closed chambers, the first chamber 601 and the second chamber 602 The pressure of the gas inside will change.
在该例子中,振动传感器感测第一腔室601和第二腔室602的压强差,并将压强差转换为电信号,例如电压信号、电流信号或者电容信号等。电信号经过计算从而得到待检测物体的振动状态。例如,振幅大小、振动频率等。In this example, the vibration sensor senses the pressure difference between the first chamber 601 and the second chamber 602, and converts the pressure difference into an electrical signal, such as a voltage signal, a current signal, or a capacitance signal. The electrical signal is calculated to obtain the vibration state of the object to be detected. For example, amplitude, vibration frequency, etc.
本发明实施例提供的振动感测装置,在壳体6上开设有泄气口603,通过对泄气口603的敞开和封闭的合理设置,既可以在组装阶段有效地平衡内外气压,也可以在使用阶段隔离产品内腔和外界环境,防止异物进入内腔,有助于提高产品的性能和延长产品的使用寿命。并且,本发明的发明人发现,在现有技术中,通常是仅在第一腔室601或者第二腔室603内设置振动传感器,此时仅感测一个腔室的压强变化来检测待检测物体的振动状态。而在本发明的实施例中,振动传感器可以对第一腔室601和第二腔室602的压强差进行感测,具有感测振动的灵敏度高的特点。In the vibration sensing device provided by the embodiment of the present invention, the housing 6 is provided with a vent 603. By reasonably setting the opening and closing of the vent 603, the internal and external air pressure can be effectively balanced during the assembly stage, and it can also be used Separate the inner cavity of the product from the external environment in stages to prevent foreign matter from entering the inner cavity, which helps to improve the performance of the product and prolong the service life of the product. Moreover, the inventor of the present invention found that in the prior art, the vibration sensor is usually only provided in the first chamber 601 or the second chamber 603, and at this time, only the pressure change of one chamber is sensed to detect the to-be-detected The vibration state of the object. In the embodiment of the present invention, the vibration sensor can sense the pressure difference between the first chamber 601 and the second chamber 602, and has the feature of high sensitivity for sensing vibration.
在一个例子中,如图1所示,在对壳体6上的泄气口603进行封闭时,可以采用塑封的方式。具体来说,采用塑封的方式在泄气口603的位置形成塑封层10。此时,该塑封层11直接覆盖在泄气口603上,用以将泄气口603完全封闭住。该设计可以起到防尘、防水、防油污的作用。In an example, as shown in FIG. 1, when the air vent 603 on the housing 6 is closed, a plastic sealing method can be used. Specifically, the plastic sealing layer 10 is formed at the position of the air vent 603 by plastic sealing. At this time, the plastic sealing layer 11 directly covers the vent 603 to completely seal the vent 603. This design can play the role of dustproof, waterproof and oil-proof.
此外,需要说明的是,在本实施例中,可以只将泄气口603通过塑封的方式覆盖住,也可以将振动感测装置整体塑封。当对振动感测装置整体塑封时,形成的塑封层10覆盖在壳体6和振动传感器的外侧,塑封层10 可以对振动感测装置整体进行防尘、防水以及防油污的保护。In addition, it should be noted that in this embodiment, only the vent 603 can be covered by plastic sealing, or the vibration sensing device can be plastic-encapsulated as a whole. When the vibration sensing device is plastic-encapsulated as a whole, the formed plastic sealing layer 10 covers the outer side of the housing 6 and the vibration sensor, and the plastic sealing layer 10 can protect the whole vibration sensing device from dust, water and oil.
在一个例子中,如图2所示,在对壳体6上的泄气口603进行封闭时,还可以采用胶体11将泄气口603进行封堵。即,采用堵孔的方式将泄气口603用胶体11封闭起来。其中,胶体11可以采用本领域熟知的胶材料。封堵住的泄气口603可以隔离壳体6的内腔与外界环境,从而能起到防尘、防水以及防油污的作用。In an example, as shown in FIG. 2, when sealing the air vent 603 on the housing 6, the air vent 603 can also be blocked by the glue 11. That is, the leak hole 603 is closed with the glue 11 in a way of blocking the hole. Among them, the glue 11 can use glue materials well known in the art. The blocked air vent 603 can isolate the inner cavity of the housing 6 from the external environment, so that it can prevent dust, water, and oil.
当泄气口603被封闭起来后,可以使振动感测装置能适用于各种大气环境中,适用范围较广。When the vent 603 is closed, the vibration sensing device can be applied to various atmospheric environments with a wide range of applications.
本发明中,振动传感器与壳体6连接在一起。其中,壳体6呈皿状结构,其一端为敞开端,振动传感器连接在壳体6的敞开端,以将壳体6的敞开端封闭起来。In the present invention, the vibration sensor and the housing 6 are connected together. Wherein, the shell 6 has a dish-shaped structure, one end of which is an open end, and the vibration sensor is connected to the open end of the shell 6 to close the open end of the shell 6.
本发明的振动传感器,如图1和图2所示,其包括由基板1和外壳2形成的具有容纳腔203的封装结构,以及收容在该容纳腔203内且固定设置在基板1上的MEMS芯片3和ASIC芯片4。其中,基板1例如为PCB板。基板1密封连接在壳体6的敞开端。并且,在基板1上设置有通孔101,该通孔101用于将壳体6内的腔体与MEMS芯片3内的背腔303连通。在本实施例中,通孔101为圆孔、方孔等,本领域技术人员可以根据具体需要灵活调整,对此不作限制。在基板1上开设通孔101的难度小,易于加工。The vibration sensor of the present invention, as shown in FIG. 1 and FIG. 2, includes a packaging structure with a housing cavity 203 formed by a substrate 1 and a housing 2, and a MEMS housed in the housing cavity 203 and fixedly arranged on the substrate 1. Chip 3 and ASIC chip 4. Among them, the substrate 1 is, for example, a PCB board. The substrate 1 is hermetically connected to the open end of the housing 6. In addition, a through hole 101 is provided on the substrate 1, and the through hole 101 is used to communicate the cavity in the housing 6 with the back cavity 303 in the MEMS chip 3. In this embodiment, the through hole 101 is a round hole, a square hole, etc., and those skilled in the art can flexibly adjust according to specific needs, and there is no limitation on this. The difficulty of opening the through hole 101 on the substrate 1 is small and the processing is easy.
MEMS芯片3包括衬底304以及感应膜301。衬底304为中空结构。感应膜301例如为压电元件、电容元件、压阻元件等。感应膜301设置在衬底304的一端,并覆盖中空结构。该中空结构形成背腔303。衬底304的另一端与基板1固定连接。感应膜301上设置有第一透气微孔302。The MEMS chip 3 includes a substrate 304 and a sensing film 301. The substrate 304 is a hollow structure. The sensing film 301 is, for example, a piezoelectric element, a capacitive element, a piezoresistive element, or the like. The sensing film 301 is disposed at one end of the substrate 304 and covers the hollow structure. The hollow structure forms a back cavity 303. The other end of the substrate 304 is fixedly connected to the substrate 1. The sensing film 301 is provided with first air-permeable micro holes 302.
在对整个振动感测装置进行组装或者封装的过程中不可避免的要涉及焊接工艺,例如,将壳体6与基板1焊接,或者是,将外壳2与基板1焊接。而焊接过程中产生的气流会留存在腔体和容纳腔203内。为了便于这些气流从泄气口603排出,本实施例中在感应膜301上设置了第一透气微孔302,配合弹性元件7和质量元件8上的第二透气微孔9,可以使容纳腔203中气流顺利的流入到腔体内,最后由泄气口603顺利排出。In the process of assembling or packaging the entire vibration sensing device, a welding process is inevitably involved, for example, welding the housing 6 and the substrate 1 or welding the housing 2 and the substrate 1. The air flow generated during the welding process will remain in the cavity and the containing cavity 203. In order to facilitate the discharge of these air flows from the air vent 603, in this embodiment, a first vent 302 is provided on the sensing membrane 301, and the second vent 9 on the elastic element 7 and the mass element 8 can make the receiving cavity 203 The middle air flow smoothly flows into the cavity, and finally is smoothly discharged from the air vent 603.
需要说明的是,第一透气微孔302的尺寸也非常小,也属于微米级。 其中,第一透气微孔302可以根据需要设置为一个,也可以设置为多个,对此不作限制。此外,第一透气微孔302的尺寸可以与第二透气微孔9相同,也可以不同。It should be noted that the size of the first air-permeable micro-holes 302 is also very small, which also belongs to the micron level. Wherein, the number of first air-permeable micro-holes 302 can be set as one or multiple as required, and there is no limitation on this. In addition, the size of the first air-permeable micropores 302 can be the same as or different from the second air-permeable micropores 9.
ASIC芯片4集成在基板1上。MEMS芯片3通过金属线与ASIC芯片4连接。ASIC芯片4通过金属线与基板1连接。ASIC芯片4可用于将MEMS芯片3采集到的信号进行放大处理。其中,ASIC芯片4还可以采用本领域技术人员熟知的其它信号放大器代替,本领域技术人员可以根据需要灵活选择。The ASIC chip 4 is integrated on the substrate 1. The MEMS chip 3 is connected to the ASIC chip 4 through metal wires. The ASIC chip 4 is connected to the substrate 1 through metal wires. The ASIC chip 4 can be used to amplify the signal collected by the MEMS chip 3. Among them, the ASIC chip 4 can also be replaced by other signal amplifiers well known to those skilled in the art, and those skilled in the art can choose flexibly according to needs.
外壳2与基板1固定连接,外壳2与基板1可以围成容纳腔203,容纳腔203可用于收容MEMS芯片3和ASIC芯片4。The housing 2 and the substrate 1 are fixedly connected. The housing 2 and the substrate 1 may enclose a receiving cavity 203, and the receiving cavity 203 may be used to house the MEMS chip 3 and the ASIC chip 4.
在一个例子中,如图1和图2所示,外壳2的结构为:包括围绕MEMS芯片3和ASIC芯片4设置的侧壁202,以及与基板1相对的底板201。并且,在底板201的外侧设置有多个焊盘5。例如,焊盘5可以根据需要设置为三个,四个或者更多个。In an example, as shown in FIG. 1 and FIG. 2, the structure of the housing 2 includes a side wall 202 arranged around the MEMS chip 3 and the ASIC chip 4, and a bottom plate 201 opposite to the substrate 1. In addition, a plurality of pads 5 are provided on the outside of the bottom plate 201. For example, the number of pads 5 can be set to three, four or more as needed.
底板201例如为电路板或者金属板等,对此不作限制。The bottom plate 201 is, for example, a circuit board or a metal plate, which is not limited.
在侧壁202内设置有金属化通孔,在底板201上设置有焊盘5,焊盘5与ASIC芯片4通过金属化通孔电连接。在使用时,直接将焊盘5与外部电路焊接即可。A metalized through hole is provided in the sidewall 202, and a pad 5 is provided on the bottom plate 201, and the pad 5 and the ASIC chip 4 are electrically connected through the metalized through hole. When in use, solder the pad 5 directly to the external circuit.
此外,外壳2与基板1之间可以通过胶体粘接或者锡膏焊接结合固定在一起。同样地,基板1与壳体6之间也可以通过胶体粘接或者锡膏焊接结合固定在一起。本领域技术人员可以根据需要灵活选择,对此不作限制。In addition, the housing 2 and the substrate 1 can be fixed together by glue bonding or solder paste welding. Similarly, the substrate 1 and the housing 6 can also be fixed together by glue bonding or solder paste welding. Those skilled in the art can flexibly choose according to their needs, and there is no restriction on this.
虽然已经通过示例对本发明的一些特定实施例进行了详细说明,但是本领域的技术人员应该理解,以上示例仅是为了进行说明,而不是为了限制本发明的范围。本领域的技术人员应该理解,可在不脱离本发明的范围和精神的情况下,对以上实施例进行修改。本发明的范围由所附权利要求来限定。Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.
Claims (10)
- 一种振动感测装置,其特征在于:包括:A vibration sensing device, characterized in that it comprises:壳体,在所述壳体的内部形成腔体,在所述壳体上设置有泄气口,所述泄气口被构造为:在对振动感测装置进行组装时为敞开状态,在振动感测装置组装结束后为封闭状态;A housing, a cavity is formed inside the housing, a vent is provided on the housing, and the vent is configured to be in an open state when the vibration sensing device is assembled. The device is closed after assembly;弹性元件,所述弹性元件设置在所述腔体内;An elastic element, the elastic element is arranged in the cavity;质量元件,所述质量元件通过所述弹性元件悬置在所述腔体内,并能随所述弹性元件一起在所述腔体内移动,以改变所述腔体内的压强;以及A mass element, the mass element is suspended in the cavity by the elastic element, and can move in the cavity together with the elastic element to change the pressure in the cavity; and振动传感器,所述振动传感器与所述腔体连通,所述振动传感器被构造为:用于感测所述腔体内的压强或者所述腔体内不同区域的压强差。A vibration sensor, the vibration sensor is in communication with the cavity, and the vibration sensor is configured to sense the pressure in the cavity or the pressure difference of different regions in the cavity.
- 根据权利要求1所述的振动感测装置,其特征在于:所述在振动感测装置组装结束后,采用胶体将所述泄气口进行封堵。The vibration sensing device according to claim 1, wherein after the assembly of the vibration sensing device is completed, the vent is sealed by a glue.
- 根据权利要求1所述的振动感测装置,其特征在于:所述在振动感测装置组装结束后,采用塑封的方式在所述泄气口的位置形成塑封层。The vibration sensing device according to claim 1, wherein after the assembly of the vibration sensing device is completed, a plastic sealing method is used to form a plastic sealing layer at the position of the air vent.
- 根据权利要求3所述的振动感测装置,其特征在于:所述塑封层还覆盖在所述壳体和所述振动传感器的外侧。4. The vibration sensing device of claim 3, wherein the plastic encapsulation layer further covers the outer side of the housing and the vibration sensor.
- 根据权利要求1所述的振动感测装置,其特征在于:所述振动传感器包括由基板和外壳形成的具有容纳腔的封装结构,以及收容在所述容纳腔内且固定设置在所述基板上的MEMS芯片和ASIC芯片;The vibration sensing device according to claim 1, wherein the vibration sensor comprises a packaging structure with a containing cavity formed by a substrate and a housing, and a packaging structure that is housed in the containing cavity and fixedly arranged on the substrate MEMS chips and ASIC chips;所述壳体具有敞开端,所述基板密封连接在所述壳体的敞开端,所述基板上设置有将所述MEMS芯片的背腔与所述腔体连通的通孔,所述MEMS芯片和所述ASIC芯片连接。The housing has an open end, the substrate is hermetically connected to the open end of the housing, the substrate is provided with a through hole that communicates the back cavity of the MEMS chip with the cavity, and the MEMS chip Connect with the ASIC chip.
- 根据权利要求5所述的振动感测装置,其特征在于:所述外壳包 括围绕所述MEMS芯片和所述ASIC芯片设置的侧壁,以及与所述基板相对的底板;The vibration sensing device according to claim 5, wherein the housing comprises a side wall arranged around the MEMS chip and the ASIC chip, and a bottom plate opposite to the substrate;在所述侧壁内设置有金属化通孔,在所述底板上设置有焊盘,所述焊盘与所述ASIC芯片通过所述金属化通孔电连接。A metalized through hole is provided in the sidewall, and a pad is provided on the bottom plate, and the pad and the ASIC chip are electrically connected through the metalized through hole.
- 根据权利要求6所述的振动感测装置,其特征在于:所述焊盘为多个。7. The vibration sensing device of claim 6, wherein there are a plurality of the pads.
- 根据权利要求5所述的振动感测装置,其特征在于:所述MEMS芯片包括衬底和感应膜,所述衬底为中空结构;The vibration sensing device of claim 5, wherein the MEMS chip comprises a substrate and a sensing film, and the substrate is a hollow structure;所述感应膜设置在所述衬底的一端并覆盖所述中空结构,所述中空结构形成所述背腔,所述衬底的另一端与所述基板固定连接;The sensing film is disposed at one end of the substrate and covers the hollow structure, the hollow structure forms the back cavity, and the other end of the substrate is fixedly connected to the substrate;在所述感应膜上设置有第一透气微孔。The sensing film is provided with first air-permeable micropores.
- 根据权利要求1所述的振动感测装置,其特征在于:所述质量元件贴合在所述弹性元件的表面上,在所述质量元件和所述弹性元件上共同设置有第二透气微孔。The vibration sensing device according to claim 1, wherein the mass element is attached to the surface of the elastic element, and second air-permeable micropores are jointly provided on the mass element and the elastic element .
- 根据权利要求1所述的振动感测装置,其特征在于:所述弹性元件为弹性膜片。The vibration sensing device according to claim 1, wherein the elastic element is an elastic diaphragm.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921377205.6U CN210513400U (en) | 2019-08-22 | 2019-08-22 | Vibration sensing device |
CN201921377205.6 | 2019-08-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021031498A1 true WO2021031498A1 (en) | 2021-02-25 |
Family
ID=70591141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2019/129221 WO2021031498A1 (en) | 2019-08-22 | 2019-12-27 | Vibration sensing apparatus |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN210513400U (en) |
WO (1) | WO2021031498A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210302227A1 (en) * | 2020-03-25 | 2021-09-30 | Merry Electronics Co., Ltd. | Vibration sensor |
US20230124360A1 (en) * | 2021-10-20 | 2023-04-20 | Merry Electronics(Shenzhen) Co., Ltd. | Electronic device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11619544B2 (en) * | 2020-03-25 | 2023-04-04 | Merry Electronics Co., Ltd. | Vibration sensor having vent for pressure enhancing member |
CN116918354A (en) * | 2021-11-26 | 2023-10-20 | 深圳市韶音科技有限公司 | Vibration assembly and sound transmission device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007178133A (en) * | 2005-12-27 | 2007-07-12 | Yamaha Corp | Pressure sensor module, its manufacturing method, and semiconductor device |
CN104125531A (en) * | 2013-04-24 | 2014-10-29 | 美商楼氏电子有限公司 | MEMS microphone with out-gassing openings and method of manufacturing the same |
CN204442602U (en) * | 2015-02-15 | 2015-07-01 | 歌尔声学股份有限公司 | A kind of MEMS sensor |
US20160221821A1 (en) * | 2015-01-29 | 2016-08-04 | Unisem (M) Berhad | Method for Improving Manufacturability of Cavity Packages for Direct Top Port MEMS Microphone |
CN106412781A (en) * | 2015-02-17 | 2017-02-15 | 美商楼氏电子有限公司 | Use microphone subassembly of boundary belt |
CN208434106U (en) * | 2018-08-01 | 2019-01-25 | 歌尔科技有限公司 | A kind of vibration component and vibrating sensor for vibrating sensor |
CN208568074U (en) * | 2018-08-03 | 2019-03-01 | 中石化江钻石油机械有限公司 | A kind of memory-type underground vibrating monitoring device |
CN109916502A (en) * | 2018-04-30 | 2019-06-21 | 索尼昂荷兰有限公司 | Vibrating sensor |
-
2019
- 2019-08-22 CN CN201921377205.6U patent/CN210513400U/en active Active
- 2019-12-27 WO PCT/CN2019/129221 patent/WO2021031498A1/en active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007178133A (en) * | 2005-12-27 | 2007-07-12 | Yamaha Corp | Pressure sensor module, its manufacturing method, and semiconductor device |
CN104125531A (en) * | 2013-04-24 | 2014-10-29 | 美商楼氏电子有限公司 | MEMS microphone with out-gassing openings and method of manufacturing the same |
US20160221821A1 (en) * | 2015-01-29 | 2016-08-04 | Unisem (M) Berhad | Method for Improving Manufacturability of Cavity Packages for Direct Top Port MEMS Microphone |
CN204442602U (en) * | 2015-02-15 | 2015-07-01 | 歌尔声学股份有限公司 | A kind of MEMS sensor |
CN106412781A (en) * | 2015-02-17 | 2017-02-15 | 美商楼氏电子有限公司 | Use microphone subassembly of boundary belt |
CN109916502A (en) * | 2018-04-30 | 2019-06-21 | 索尼昂荷兰有限公司 | Vibrating sensor |
CN208434106U (en) * | 2018-08-01 | 2019-01-25 | 歌尔科技有限公司 | A kind of vibration component and vibrating sensor for vibrating sensor |
CN208568074U (en) * | 2018-08-03 | 2019-03-01 | 中石化江钻石油机械有限公司 | A kind of memory-type underground vibrating monitoring device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210302227A1 (en) * | 2020-03-25 | 2021-09-30 | Merry Electronics Co., Ltd. | Vibration sensor |
US11781901B2 (en) * | 2020-03-25 | 2023-10-10 | Merry Electronics Co., Ltd. | Vibration sensor with pressure enhancement |
US20230124360A1 (en) * | 2021-10-20 | 2023-04-20 | Merry Electronics(Shenzhen) Co., Ltd. | Electronic device |
US11952264B2 (en) * | 2021-10-20 | 2024-04-09 | Merry Electronics (Shenzhen) Co., Ltd. | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
CN210513400U (en) | 2020-05-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2021031498A1 (en) | Vibration sensing apparatus | |
CN110972045B (en) | Vibration sensing device and electronic equipment | |
US10343897B2 (en) | Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same | |
WO2021031497A1 (en) | Vibration sensing device | |
CN211085470U (en) | Vibration mechanism for vibration sensing device and vibration sensing device | |
KR101096544B1 (en) | Mems microphone package and packaging method | |
EP1219136B1 (en) | A pressure transducer | |
CN210641073U (en) | Bone voiceprint sensor and electronic equipment | |
CN210641062U (en) | Vibration sensing device and electronic equipment | |
WO2016192358A1 (en) | Differential-capacitance type mems microphone | |
JP2009071813A (en) | Vibration transducer | |
US20130028459A1 (en) | Monolithic Silicon Microphone | |
EP2094028B1 (en) | Miniature microphone assembly with solder sealing ring | |
CN104249990A (en) | MEMS device incorporating fluidic path, and manufacturing process thereof | |
KR101554364B1 (en) | MEMS microphone package using lead frame | |
WO2021114427A1 (en) | Microphone structure and electronic device | |
WO2018035669A1 (en) | Capacitive mems microphone and electronic apparatus | |
US20160305837A1 (en) | System and Method for a Packaged MEMS Device | |
CN110907029B (en) | Calibration method of vibration sensing device | |
WO2021031299A1 (en) | Method for sensing vibration by vibration sensing device and vibration sensing device | |
CN114501253A (en) | Vibration sensor and electronic device | |
CN207475875U (en) | A kind of encapsulating structure of microphone, environmental sensor | |
CN101734607B (en) | Packaging structure of micro-electromechanical system | |
US20230254635A1 (en) | Mems microphone with multiple sound ports | |
CN110602615A (en) | Vibration assembly for vibration sensing device and vibration sensing device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19942469 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 19942469 Country of ref document: EP Kind code of ref document: A1 |