WO2021022883A1 - 一种超材料、除冰装置及飞行器 - Google Patents

一种超材料、除冰装置及飞行器 Download PDF

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Publication number
WO2021022883A1
WO2021022883A1 PCT/CN2020/093973 CN2020093973W WO2021022883A1 WO 2021022883 A1 WO2021022883 A1 WO 2021022883A1 CN 2020093973 W CN2020093973 W CN 2020093973W WO 2021022883 A1 WO2021022883 A1 WO 2021022883A1
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Prior art keywords
metal
layer
metamaterial
prepreg
electromagnetic
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PCT/CN2020/093973
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English (en)
French (fr)
Inventor
刘若鹏
赵治亚
田华
安迪
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深圳光启高端装备技术研发有限公司
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Priority claimed from CN201921251254.5U external-priority patent/CN214084793U/zh
Priority claimed from CN201910716098.3A external-priority patent/CN110481794A/zh
Application filed by 深圳光启高端装备技术研发有限公司 filed Critical 深圳光启高端装备技术研发有限公司
Publication of WO2021022883A1 publication Critical patent/WO2021022883A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D15/00—De-icing or preventing icing on exterior surfaces of aircraft
    • B64D15/12—De-icing or preventing icing on exterior surfaces of aircraft by electric heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices

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  • the present invention relates to the field of materials, and more specifically, to a metamaterial, a deicing device and an aircraft.
  • the freezing of air vehicles during flight is a widespread physical phenomenon and one of the major hidden dangers that cause flight safety accidents.
  • the supercooled water droplets in the atmosphere hit the surface of the aircraft and are prone to protruding parts of the fuselage, such as the leading edge of the wing, the leading edge of the rotor, the leading edge of the tail rotor, and the engine intake , Airspeed tube, aircraft windshield glass and radome and other components surface sublimation to form ice.
  • the icing of the aircraft will not only increase the weight, but also destroy the aerodynamic shape of the aircraft, change the flow field around it, destroy the aerodynamic performance, cause the maximum lift of the aircraft to decrease, increase the flight resistance, and reduce the flight performance.
  • the existing deicing methods mainly include: hot gas deicing, mechanical deicing, microwave deicing, and electric deicing.
  • the hot air deicing method using engine bleed air requires the design of a complicated air supply pipeline to distribute the hot air drawn from the engine compressor to the parts that need to be deiced, and will affect the power and work efficiency of the engine; use airbags and expansion tubes to shrink
  • the mechanical deicing method that breaks the ice with expansion will destroy the aerodynamic shape of the aircraft, and the deicing will not be complete
  • microwave deicing is easy to be captured by radar;
  • traditional electric deicing generally uses metal foil, metal wire, and conductive metal film , Resistance wires, etc. are used as electric heating units, which are not suitable for parts that require electromagnetic transmission.
  • the present invention provides a metamaterial, wherein the metamaterial includes a base material layer and a metal microstructure layer superimposed on the base material layer, and the metal microstructure layer has periodic arrangement A closed-loop communication structure, wherein the base material layer and the metal microstructure layer together form a first metal soft plate, and the end of the first metal soft plate is connected to a connecting terminal, and is connected to an external power source through the connecting terminal It is connected to form a conductive path, and electric heating is carried out by using the characteristics of metal electric heating.
  • the metamaterial further includes a first prepreg layer, and the first prepreg layer is bonded to the metal microstructure layer through a layer of adhesive.
  • the metamaterial further includes a second prepreg layer, and the second prepreg layer is bonded to the base material layer through a layer of adhesive.
  • the metamaterial further includes a sandwich layer, and the sandwich layer is bonded to the second prepreg layer through a layer of glue film.
  • the metamaterial further includes a third prepreg layer, and the third prepreg layer is bonded to the sandwich layer through a layer of glue film.
  • a second metal soft plate is embedded in the sandwich layer or the third prepreg layer.
  • the shape and size of the metal microstructure on the second metal flexible board are the same as the shape and size of the metal microstructure on the first metal flexible board.
  • the shape and size of the metal microstructure on the second metal flexible board are different from the shape and size of the metal microstructure on the first metal flexible board.
  • each periodic unit is a closed-loop closed structure.
  • the metal microstructure layer there is at least one metal connecting line in the plurality of periodic units periodically arranged between the connection terminals.
  • the present invention also provides a deicing device, wherein the deicing device includes any of the above metamaterials.
  • the present invention also provides an aircraft, wherein the aircraft includes any of the above metamaterials.
  • the technical solution provided by the present invention solves the problem that the existing electrothermal deicing method cannot realize the electromagnetic signal transmission due to the shielding of the electromagnetic signal by the metal layer through the design of the conductive metal path and the specific design of the metal path, and can suppress the internal electromagnetic
  • the interference of external electromagnetic signals outside the working frequency band of the transceiver makes it possible to arrange electromagnetic transceivers such as microwave and millimeter wave antennas in places with a good electromagnetic transmission field of view.
  • electromagnetic transceivers such as microwave and millimeter wave antennas
  • FIG. 1 is a schematic cross-sectional view of a multi-layered structure included in the metamaterial in the first embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional view of another multi-layer structure included in the metamaterial in the second embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a two-dimensional cross-sectional view of another multi-layer stack included in the metamaterial in the second embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention
  • FIG. 5 is a schematic diagram of another periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention.
  • FIG. 6 is a schematic diagram of the S21 curve of the metamaterial in the second embodiment of the present invention under TE polarization as a function of the incident angle theta;
  • FIG. 7 is a schematic diagram of the S21 curve of the metamaterial in the second embodiment of the present invention under TM polarization as a function of the incident angle theta;
  • FIG. 8 is a schematic diagram of the periodic arrangement of the metal microstructures on the metal microstructure layer 2 included in the metamaterial in the third embodiment of the present invention.
  • Fig. 11 is a schematic diagram of the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial in the fourth embodiment of the present invention.
  • FIG. 14 is a schematic diagram of the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial in the fifth embodiment of the present invention.
  • 17 is a schematic diagram of the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial in the sixth embodiment of the present invention.
  • 20 is a schematic diagram of a two-dimensional cross-sectional view of another multi-layer stack included in the metamaterial in the seventh embodiment of the present invention.
  • 21 is a schematic diagram of the periodic arrangement of respective metal microstructures on the double-layer modulation structure included in the metamaterial in the seventh embodiment of the present invention.
  • 23 is a schematic diagram of the periodic arrangement of respective metal microstructures on the double-layer modulation structure included in the metamaterial in the seventh embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view of a multi-layer structure included in a metamaterial in an embodiment of the present invention.
  • the metamaterial of the present invention adopts a multi-layer structure design.
  • the metamaterial includes a base material layer 1 and a metal microstructure layer 2 superimposed on the base material layer 1.
  • the metal microstructure layer 2 has periodicity A closed-loop communication structure with a sexual arrangement, wherein the base material layer 1 and the metal microstructure layer 2 together form a first metal soft plate, and the ends of the first metal soft plate are respectively connected to the terminal 3, and are connected to the outside through the terminal 3
  • the power is turned on to form a conductive path to use the metal's electric heating characteristics for electric heating.
  • the base material layer 1 can be either a flexible base material layer or a rigid base material layer. The specific requirements depend on actual application scenarios.
  • the base material layer 1 has the characteristics of excellent insulation performance, high and low temperature resistance, and good mechanical properties such as stretching.
  • the base material layer 1 and the metal microstructure layer 2 together form the first metal soft plate, and the first metal soft plate is The end is connected to the terminal 3, and the terminal 3 can be connected to the metal on the metal microstructure layer 2 by welding, or other connection methods, as long as the electrical connection between the terminal 3 and the metal on the metal microstructure layer 2 is satisfied,
  • the connection terminals 3 are respectively connected to the positive and negative poles of the external power supply through the power line, so that the metal on the metal microstructure layer 2, the connection terminal 3, the power supply line, and the external power supply form a conductive path structure.
  • the external power supply passes through this electrical path structure. Electric heating is used to deicing the parts prone to freezing.
  • the metal on the base material layer 1 is etched through an etching process, and then processed into various metal microstructure patterns actually required.
  • the metal microstructure layer 2 The area that has not been etched away retains the metal.
  • the remaining metal in the metal microstructure layer 2 forms a connected structure.
  • the connected structure is a closed-loop connected structure with periodic arrangement.
  • the closed-loop connected structure can be triangular, quadrilateral, Polygonal closed-loop connected structures such as pentagons and hexagons can also be closed-loop connected structures of curved shapes such as circles and rings.
  • the metal microstructure layer 2 there is an intersection between two adjacent periodic units, such as sharing a metal edge, and each periodic unit is a closed-loop closed structure.
  • the closed-loop connected structure is a triangle, or a quadrilateral, or A closed-loop connected structure of polygonal shapes such as a pentagon or a hexagon
  • the periodically arranged closed-loop connected structure of the metal microstructure layer 2 is a closed-loop connected structure composed of a plurality of periodically arranged triangles and adjacent Two triangles share a metal edge, or a closed-loop connected structure formed by a plurality of quadrilaterals arranged periodically, and a metal edge is shared between two adjacent quadrilaterals, or a plurality of pentagons arranged periodically
  • a closed-loop connected structure formed by two adjacent pentagons and a metal edge is shared between two adjacent pentagons, or a closed-loop connected structure formed by a plurality of hexagons arranged periodically and between two adjacent hexagons Share a metal edge
  • the metal microstructure layer 2 there is at least one metal connection line in the multiple periodic units periodically arranged between the two connection terminals 3, which can ensure that the connection terminal 3 at the end of the first metal soft plate is energized.
  • the conductive path is formed as a heating unit, so that the metamaterial structure has the function of electric heating and deicing.
  • the metamaterial also includes a first prepreg layer 4 and a second prepreg layer 5, which are respectively bonded to the front and back surfaces of the first metal soft plate by two layers of adhesives 6.
  • the first prepreg layer 4 is bonded to the front surface of the metal microstructure layer 2 through a layer of adhesive 6; the back surface of the metal microstructure layer 2 is superimposed on the front surface of the base material layer 1, and the second prepreg layer 5 Adhere to the opposite side of the base material layer 1 through another layer of adhesive 6.
  • the respective prepregs in the first prepreg layer 4 and the second prepreg layer 5 are fiber prepregs such as glass or quartz, which play the role of insulation and strength support.
  • the two layers of adhesive 6 The function is to better bond the first prepreg layer 4 and the second prepreg layer 5 on the front and back surfaces of the first metal soft board.
  • the metal microstructure layer 2 has a periodically arranged closed-loop connected structure.
  • the periodically arranged closed-loop connected structure is prepared by removing the base material layer 1 in the first metal soft plate through an etching process.
  • the metal on the upper surface is etched, and then processed into various metal microstructure patterns that are actually required. All metal microstructure patterns are connected together.
  • this connected metal structure pattern can be regarded as a gap metal structure.
  • Graphics, in terms of external physical characteristics, the gap-type metal structure can be seen as a gap where some metal units are etched in a certain arrangement on the surface of a complete metal layer.
  • the electrons generated by this type of slot metal structure pattern can flow unrestricted under the irradiation of electromagnetic waves. From the perspective of frequency response characteristics, the slot type metal structure pattern has a band-pass electromagnetic modulation effect. Specifically, this band-pass type The mechanism of electromagnetic modulation is shown in:
  • the electromagnetic field is radiated in the reflection direction, and because the high-frequency electromagnetic wave electric field changes period restricts the electron movement, the radiation energy is limited, so when the high-frequency electromagnetic wave is incident, the transmission coefficient decreases Smaller, the reflection coefficient increases.
  • the surface of the slot-type metal structure pattern can also be freely combined with slot-type metal surface micro-elements and patch-type metal surface micro-elements to achieve the required electromagnetic modulation characteristics.
  • the invention combines the electromagnetic response characteristics, structure and strength requirements of the electromagnetic transceiver device, selects materials for the composite layer containing electric heating and electromagnetic modulation functions, and performs integrated design of thickness, metal structure pattern, etc., to achieve structure, strength and composite electric heating Integrated part with electromagnetic modulation function.
  • the metamaterial can further add a new composite dielectric layer, as shown in FIG. 2.
  • FIG. 2 is a schematic cross-sectional view of another multi-layer structure included in the metamaterial in an embodiment of the present invention.
  • the dashed frame A represents the metamaterial in Fig. 1
  • the dashed frame B represents the newly added composite dielectric layer.
  • the metamaterial in FIG. 2 also includes a core layer 7 and a third prepreg layer 8, wherein one side of the core layer 7 passes through a layer of adhesive film 9 and the first The two prepreg layers 5 are bonded, and the third prepreg layer 8 is bonded to the other side of the sandwich layer 7 through another adhesive film 9.
  • FIG. 3 is a schematic diagram of a two-dimensional cross-sectional view of another multi-layer stack included in the metamaterial in the second embodiment of the present invention.
  • the structure diagram shown in Figure 3 is a two-dimensional cross-sectional schematic diagram of pressing the multi-layered structure in Figure 2 together to form a multi-layered metamaterial.
  • the metamaterial structure shown in Figure 3 is a kind of integrated deicing ,
  • the thickness of the first metal soft board (including the base material layer 1 and the metal microstructure layer 2) is d 3
  • the thickness of the other layer of adhesive 6 is d 4
  • the thickness of the second prepreg layer 5 is d 5
  • the thickness of one layer of adhesive film 9 is d 6
  • the thickness of the sandwich layer 7 is d 7
  • the thickness of the other layer of adhesive film 9 is d 8
  • the thickness of the third prepreg layer 8 is d 9 .
  • the prepregs of the first prepreg layer 4, the second prepreg layer 5, and the third prepreg layer 8 are all low-dielectric, low-loss quartz fiber cyanate ester prepregs. High permeability and bearing effect.
  • the first prepreg layer 4, the second prepreg layer 5, and the third prepreg layer 8 are all a good skin material.
  • the first prepreg layer 4, The second prepreg layer 5 can be used as the outer skin material, and the third prepreg layer 8 can be used as the inner skin material. Both layers of adhesive 6 can be bonded with glue films.
  • the electric heating layer is mainly composed of heating materials and insulating materials.
  • the metal microstructure layer 2 in the present invention is the heating material, which is made of metal copper with high resistivity and high conductivity.
  • the base material layer 1 in the present invention is The insulating material is mainly a polyimide (PI) film with excellent comprehensive performance, and the sandwich layer 7 is used as a honeycomb layer to achieve electromagnetic performance optimization and bearing functions.
  • PI polyimide
  • the thickness of the metal layer in the metal microstructure layer 2 is determined according to the actual required resistance. The thicker the metal layer, the smaller the resistance, while the thinner the metal layer, the larger the resistance. In this embodiment, the thickness of the metal layer in the metal microstructure layer 2 is 18 ⁇ m, and the thickness of the base material layer 1 is 25 ⁇ m. Therefore, the first metal soft plate composed of the two in the present invention is flexible as the electric heating layer. Easy to paste on curved parts. Moreover, the metal copper can be designed into hollow patterns of different topological structures to realize the electromagnetic modulation function of frequency selection.
  • the metal microstructure layer 2 is a connected structure, which ensures that the metal in the metal microstructure layer 2 can form a passage after power is applied to realize the function of energized heating and deicing.
  • the metal microstructure layer 2 also needs to have a closed loop structure arranged periodically.
  • the adhesive film is used to achieve adhesion between the layers of the present invention.
  • the dielectric constant of the skin material is 3.15
  • the loss tangent value is 0.006
  • the dielectric constant of the film material is 2.7
  • the loss tangent value is 0.0065
  • the dielectric constant of the PI film material is 3.2
  • the loss tangent value is 0.002
  • the dielectric constant of the honeycomb material is 1.11
  • the loss tangent value is 0.006.
  • FIG. 4 is a schematic diagram of the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention.
  • the basic unit of the metal microstructure on the metal microstructure layer 2 is a regular hexagon, and the metal inside the regular hexagon is etched away, leaving only the metal lines on the six sides of the regular hexagon to form a regular hexagon Hexagonal metal ring, the length of the metal lines on the six sides of the regular hexagonal metal microstructure are all p, the width of the metal lines are all ww, and the periodic arrangement is between two adjacent regular hexagonal metal microstructures There are intersections, such as sharing a metal edge.
  • any edge of a regular hexagonal metal ring can be bent or transformed into an arbitrary polygonal periodic boundary.
  • each edge of the aforementioned hexagonal ring is bent. This deformation can increase the perimeter of the metal wire in the unit and shift the transmission frequency band to low frequencies.
  • its bending form, period, line width, line spacing, and bending length can be specifically designed.
  • the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 4 is applied to the laminated structure shown in FIG. 3, and the main structure dimensions are shown in Table 1 below.
  • the metamaterial in the present invention realizes the frequency selection function of high-frequency wave transmission and low-frequency cutoff.
  • the electromagnetic modulation function can be combined with frequency selection on the basis of electric heating and deicing.
  • the periodic arrangement of the hexagonal metal microstructures can realize the function of electric heating and deicing
  • the conditions of intersection (such as common edges, common points, common line segments, etc.) can form a closed-loop connected structure to achieve electrical pathways, and then can achieve the deicing function when the electric heating layer is energized, and through the design of the main laminate structure
  • the size of the structure makes it have a specific electromagnetic modulation function.
  • FIG. 8 is a schematic diagram of the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial in the third embodiment of the present invention.
  • the basic unit structure of the metal microstructure on the metal microstructure layer 2 is a regular triangle, and the metal inside the regular triangle is etched away, leaving only the metal lines on the three sides of the regular triangle to form Regular triangle metal ring, the length of the metal wires on the three sides of the regular triangle metal microstructure are all p 1 , and the width of the metal wires are all ww 1 , and the periodic arrangement is two adjacent regular triangle metal microstructures. There are intersections between the structures, such as sharing a metal edge. This arrangement can realize that the metal layer is in the path when power is applied. In addition, any side of the regular trilateral metal ring can also be bent or transformed into an arbitrary polygonal periodic boundary.
  • each side can be bent in a bending manner as shown in Figure 5. This deformation can increase the unit
  • the perimeter of the metal wire makes the transmission frequency band drift towards low frequency.
  • its bending form, period, line width, line spacing, and bending length can be specifically designed.
  • the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 8 is applied to the laminated structure shown in FIG. 3, and the main structure dimensions are shown in Table 2 below.
  • the metamaterial in the present invention realizes the electromagnetic modulation function of high-frequency wave transmission and low-frequency cut-off.
  • those with similar connected metal layer topology can realize electrical
  • the heating and deicing is based on the compound electromagnetic modulation function.
  • FIG. 11 is a schematic diagram of the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial in the fourth embodiment of the present invention.
  • the basic unit structure of the metal microstructure on the metal microstructure layer 2 is a regular quadrilateral, and the metal inside the regular quadrilateral is etched away, leaving only the metal lines on the four sides of the regular quadrilateral to form a regular quadrilateral metal Ring, the metal lines on the four sides of the quadrilateral metal microstructure are all p 2 , and the metal line widths are all ww 2.
  • the periodic arrangement is that there is an intersection between two adjacent regular quadrilateral metal microstructures. For example, sharing a metal edge, this arrangement can realize that the metal layer is in the via when power is applied.
  • any side of the regular quadrilateral metal ring can be bent or transformed into an arbitrary polygonal periodic boundary.
  • each side can be bent in a bending manner as shown in Figure 5. This deformation can increase the metal in the unit
  • the perimeter of the line makes the transmission frequency band drift towards low frequency.
  • its bending form, period, line width, line spacing, and bending length can be specifically designed.
  • the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 11 is applied to the laminated structure shown in FIG. 3, and the main structure dimensions are shown in Table 3 below.
  • the metamaterial in the present invention realizes the electromagnetic modulation function of high-frequency wave transmission and low-frequency cut-off.
  • it has the similar connected metal layer topology.
  • the heating and deicing is based on the compound electromagnetic modulation function.
  • FIG. 14 is a schematic diagram of the periodic arrangement of the metal microstructures on the metal microstructure layer 2 included in the metamaterial in the fifth embodiment of the present invention.
  • the basic unit structure of the metal microstructure on the metal microstructure layer 2 is a circular ring, the inner diameter of the circular ring is p 3 , and the line width of the circular ring is both ww 3 , and it is arranged periodically. In order to connect two adjacent circular rings to each other, this arrangement can realize that the metal layer is in the path when the power is applied.
  • the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 14 is applied to the laminated structure shown in FIG. 3, and the main structure dimensions are shown in Table 4 below.
  • the metamaterial in the present invention achieves the function of high-frequency wave transmission.
  • those with similar connected metal layer topology can be based on the realization of electric heating and deicing. Compound electromagnetic modulation function.
  • the linear closed-loop metal connecting structure and the curvilinear closed-loop metal connecting structure can realize the function of electric heating and deicing under the periodic arrangement
  • the porous closed-loop metal connecting structure can also be arranged under the periodic arrangement. Realize the function of electric heating and deicing.
  • the hole-shaped closed-loop metal connection structure as a unit structure, as long as the interconnection conditions between the unit structures are met, an electric path of the hole-shaped closed-loop metal connection structure can be formed, and then the electric heating layer is energized
  • the deicing function can be realized at the time, and the main structure size in the laminated structure can also be designed to have the electromagnetic modulation function.
  • FIG. 17 is a schematic diagram of the periodic arrangement of the metal microstructures on the metal microstructure layer 2 included in the metamaterial in the sixth embodiment of the present invention.
  • the basic unit structure of the metal microstructure on the metal microstructure layer 2 is a circular through hole hollowed out in the middle of the regular hexagonal metal sheet to form a hole-like closed-loop metal connection structure.
  • the side length of the shaped metal sheet is p 4
  • the radius of the circular through hole is r 4
  • the periodic arrangement is that two adjacent regular hexagonal metal sheets have an intersection, such as sharing one side to form a phase
  • the condition of the interconnection between two adjacent unit structures is used to realize a two-dimensional connected arrangement, which can realize that the metal layer is in the passage when the electricity is applied.
  • the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 17 is applied to the laminated structure shown in FIG. 3, and the main structure size design is shown in Table 5 below. .
  • the metamaterial in the present invention realizes the electromagnetic modulation function of high-frequency wave transmission.
  • those with similar connected metal layer topology can realize electric heating and deicing. Based on the composite electromagnetic modulation function.
  • the linear closed-loop metal connection structure, the curvilinear closed-loop metal connection structure, and the hole-shaped closed-loop metal connection structure as the basic unit structure can realize the electric heating deicing function under the periodic arrangement, and As long as the intersection conditions between the unit structures (such as coedges, common points, collinear segments, etc.) are met, a hole-like closed-loop metal interconnection structure can be formed, and the deicing function can be achieved when the electric heating layer is energized And by designing the main structure size in the laminated structure, it can also make it have electromagnetic modulation function.
  • the electric heating layer (ie the first metal soft board) that realizes the deicing function not only ensures that the metal layer is a connected structure, but also needs to connect the metal on the electric heating layer to the power line through solder joints to form a terminal.
  • the terminal uses The power cord is connected to the onboard power supply on the aircraft. The heat generated by the electric heating layer melts into a thin layer between the ice layer and the outer skin, reducing the adhesion between the ice layer and the outer skin, and thus the aerodynamic force Or the ice layer is easily blown off under the action of centrifugal force.
  • the present invention can also be embedded in the sandwich layer 7 or the third prepreg layer 8 separately as shown in FIG.
  • the metal soft board such as the second metal soft board.
  • the second metal soft board is the same as the first metal soft board, but also includes the base material layer and the metal microstructure layer.
  • the second metal soft board is the same as the first metal soft board, and also serves as The electromagnetic modulation layer, but the difference is that the second metal soft plate as the electromagnetic modulation layer can achieve better overall electromagnetic modulation performance.
  • FIG. 20 is a schematic diagram of a two-dimensional cross-section of another multi-layer stack included in the metamaterial in the seventh embodiment of the present invention.
  • the metamaterial structure shown in Figure 20 is a sandwich structure that integrates the functions of deicing and electromagnetic modulation with the structural load-bearing function. It includes a total of 13 layers. On the basis of Figure 3, d10, d11, and d12 are added.
  • d1-d9 are the same as shown in Figure 3, that is, the thickness of the first prepreg layer 4 is d 1 , the thickness of a layer of adhesive 6 is d 2 , and the thickness of the first metal soft plate Is d 3 , the thickness of the other layer of adhesive 6 is d 4 , the thickness of the second prepreg layer 5 is d 5 , the thickness of one layer of adhesive film 9 is d 6 , and the thickness of the sandwich layer 7 is d 7 , The thickness of the other layer of adhesive film 9 is d 8 , and the thickness of the third prepreg layer 8 is d 9; d11 is the second soft metal plate, d10 and d12 are respectively covering the upper and lower two of the second metal soft plate The two layers of adhesive on the surface , d9 and d13, together form d9 in FIG.
  • the metamaterial shown in Figure 20 has a double-layer modulation structure, that is, the first metal soft plate is used as an electric heating layer to achieve electric heating and electromagnetic modulation functions, and the second metal soft plate as an electromagnetic modulation layer can achieve overall better electromagnetic Modulation performance.
  • 21 is a schematic diagram of the periodic arrangement of respective metal microstructures on the double-layer modulation structure included in the metamaterial in the seventh embodiment of the present invention.
  • the basic unit structure of the metal microstructure on the metal microstructure layer of the first metal soft plate is a circular ring shape, and the metal inside the circular metal sheet is etched away, leaving only the peripheral
  • the curved metal lines form a circular ring, the inner diameter of the circular ring is p 1 , the metal line width of the circular ring is both ww 1 , and the periodic arrangement is that there is between two adjacent circular metal microstructures Intersection, for example, two circular rings are tangent, this arrangement can realize that the metal layer is in the path when power is applied.
  • the basic unit structure of the metal microstructure on the metal microstructure layer of the second metal soft plate is a circular ring, and the metal inside the circular metal sheet is etched away, leaving only the peripheral
  • the curved metal lines form a circular ring, the inner diameter of the circular ring is p 2 , the metal line width of the circular ring is all ww 2 , and the periodic arrangement is that there is between two adjacent circular metal microstructures Intersection, for example, two circular rings are tangent, this arrangement can realize that the metal layer is in the path when power is applied.
  • the periodic arrangement of the respective metal microstructures on the double-layer modulation structure shown in FIG. 21 is applied to the laminated structure shown in FIG. 20, and the main structure dimensions are shown in Table 6 below.
  • the low-frequency cut-off bandwidth of the double-layer modulation structure (that is, both the first metal soft plate and the second metal soft plate) is significantly larger than that of the single-layer modulation structure (that is, it only includes The first metal soft board), indicating that adding a metal soft board as an electromagnetic modulation layer is beneficial to broaden the cut-off bandwidth, and high-frequency transmission is not affected, so that overall better electromagnetic modulation performance can be achieved.
  • the above several embodiments illustrate that regardless of the linear closed-loop metal interconnection structure, the curvilinear closed-loop metal interconnection structure, or the hole-like closed-loop metal interconnection structure as the basic unit structure, the periodic arrangement on the metal soft board can be performed.
  • the metal soft plate such as the second metal soft plate shown in Figure 1 is separately embedded in the third prepreg layer 9, and the metal on the second metal soft plate is micro
  • the shape and size of the structure are designed to be the same as the shape and size of the metal microstructure on the first metal soft board, which can achieve better overall electromagnetic modulation performance.
  • the shape of the metal microstructure on the second metal flexible board is designed to be the same as the metal microstructure on the first metal flexible board but different in size, or the shape and size are not the same, the overall better electromagnetic structure can also be achieved. Modulation performance.
  • FIG. 23 is a schematic diagram of the periodic arrangement of respective metal microstructures on the double-layer modulation structure included in the metamaterial in the seventh embodiment of the present invention.
  • the basic unit structure of the metal microstructure on the metal microstructure layer of the first metal soft plate is a regular hexagon, and the metal inside the regular hexagon is etched away, leaving only the regular hexagon
  • the metal lines on the six sides form a regular hexagonal metal ring.
  • the length of the metal lines on the six sides of the regular hexagonal metal microstructure are all p 1 and the width of the metal lines are all ww 1.
  • the periodic arrangement is adjacent There is an intersection between the two regular hexagonal metal microstructures, such as sharing a metal edge. This arrangement can realize that the metal layer is in the path when the electricity is turned on.
  • the basic unit structure of the metal microstructure on the metal microstructure layer of the second metal soft plate is also a regular hexagon, and the metal inside the regular hexagon is etched away, leaving only the regular hexagon
  • the metal lines on the six sides of the six sides form a regular hexagonal metal ring.
  • the lengths of the metal lines on the six sides of the regular hexagonal metal microstructure are all p 2
  • the metal line widths are all ww 2
  • the periodic arrangement is phase
  • any side of the regular hexagonal metal ring can also be bent or transformed into an arbitrary polygonal periodic boundary.
  • each side can be bent in a bending manner as shown in Figure 5. This deformation can increase the unit
  • the perimeter of the metal wire makes the transmission frequency band drift towards low frequency.
  • its bending form, period, line width, line spacing, and bending length can be specifically designed.
  • the periodic arrangement of the respective metal microstructures on the double-layer modulation structure shown in FIG. 23 is applied to the laminated structure shown in FIG. 20, and the main structure dimensions are shown in Table 7 below.
  • the present invention also provides a deicing device, wherein the deicing device includes any of the above metamaterials.
  • the present invention also provides an aircraft, wherein the aircraft includes any of the above metamaterials.
  • the technical solution provided by the present invention combines the electromagnetic modulation function on the basis of satisfying the deicing function.
  • the existing deicing method can not be guaranteed due to the shielding of electromagnetic signals by the metal layer
  • the problem of electromagnetic signal transmission can also suppress the interference of external electromagnetic signals outside the working frequency band of the electromagnetic transceiver device inside the component, so that it is possible to arrange electromagnetic transceiver devices, such as microwaves, millimeter wave antennas, etc., in places with good electromagnetic transmission vision.
  • electromagnetic transceiver devices such as microwaves, millimeter wave antennas, etc.

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Abstract

一种超材料，包括基底材料层（1）以及叠加在基底材料层（1）上的金属微结构层（2），金属微结构层（2）具有周期性排布的闭环连通结构，其中，基底材料层（1）与金属微结构层（2）共同形成第一金属软板，且第一金属软板的端部连接有接线端子（3），并通过接线端子（3）与外部电源接通，形成导电通路，以利用金属通电加热的特性进行电加热。还提供一种除冰装置和飞行器。通过将金属微结构层（2）进行特定结构设计，使其既作为电加热单元，具备电加热除冰功能，又作为电磁调制结构，允许电磁收发器件工作频段范围内的电磁信号传输，屏蔽工作频段范围外的电磁波，抑制了杂波信号的干扰。

Description

一种超材料、除冰装置及飞行器 技术领域
本发明涉及材料领域，更具体地，涉及一种超材料、除冰装置及飞行器。
背景技术
航空飞行器在飞行过程中结冰是广泛存在的一种物理现象，是造成飞行安全事故的重大隐患之一。当飞行器在在低于结冰气象条件下飞行时，大气中的过冷水滴撞击到飞行器表面，容易在机身的突出部位，如机翼前缘、旋翼、尾桨前缘、发动机进气口、空速管、飞机风挡玻璃以及天线罩等部件表面凝华形成结冰。飞行器结冰不仅会增加重量，而且会破坏飞行器外表的气动外形，改变绕流流场，破坏气动性能，造成飞行器最大升力下降，飞行阻力增加，飞行性能降低，严重情况下，会对飞行安全造成致命威胁。此外，对于军用飞机来说，如无人机、运输机等，结冰将直接限制其飞行区域，极大的影响其作战能力。因此对于易结冰的关键部位必须进行除冰防护。
现有的除冰方法主要包括：热气除冰、机械除冰、微波除冰、电热除冰。但是，采用发动机引气的热气除冰方法需设计复杂的供气管路，将发动机压气机引出的热气分配到需要除冰的部位，且会影响发动机的功率及工作效率；采用气囊、膨胀管收缩与膨胀使冰层破碎的机械除冰方法会破坏飞行器气动外形，除冰也不彻底；微波除冰又易被雷达捕获；另外，传统的电热除冰一般采用金属箔、金属丝、导电金属膜、电阻丝等作为电加热单元，其不适用于需电磁传输功能的部件。
因此，在航空飞行器上如何实现既能除冰，又能具备电磁调制功能，保障电磁信号的传输，已成为业界亟需解决的痛点问题。
发明内容
针对以上问题，本发明提供了一种超材料，其中，所述超材料包括基底材料层以及叠加在所述基底材料层上的金属微结构层，所述金属微结构层具有周期性排布的闭环连通结构，其中，所述基底材料层与所述金属微结构层共同形成第一金属软板，且所述第一金属软板的端部连接接线端子，并通过所述接线端子与外部电源接通形成导电通路，利用金属通电加热的特性进行电加热。
优选的，所述超材料还包括第一预浸料层，所述第一预浸料层通过一层粘接剂与所述金属微结构层进行粘接。
优选的，所述超材料还包括第二预浸料层，所述第二预浸料层通过一层粘接剂与所述基底材料层进行粘接。
优选的，所述超材料还包括夹芯层，所述夹芯层通过一层胶膜与所述第二预浸料层进行粘接。
优选的，所述超材料还包括第三预浸料层，所述第三预浸料层通过一层胶膜与所述夹芯层进行粘接。
优选的，在所述夹芯层或者所述第三预浸料层中嵌入第二金属软板。
优选的，所述第二金属软板上的金属微结构的形状、尺寸与所述第一金属软板上的金属微结构的形状、尺寸都相同。
优选的，所述第二金属软板上的金属微结构的形状、尺寸与所述第一金属软板上的金属微结构的形状、尺寸都不相同。
优选的，在所述金属微结构层中，相邻的两个周期单元之间存在交集，且每一个周期单元呈闭环的封闭结构。
优选的，在所述金属微结构层中，所述接线端子之间周期性排布的多个周期单元中至少存在一条金属连通线路。
另外，本发明还提供了一种除冰装置，其中，所述除冰装置包括以上任一项所述的超材料。
此外，本发明还提供了一种飞行器，其中，所述飞行器包括以上任一项所述的超材料。
本发明提供的技术方案通过设计导通的金属通路以及对金属通路的特 定设计，解决现有电热除冰方式因金属层对电磁信号屏蔽而无法实现电磁信号传输的难题，同时可抑制部件内部电磁收发器件工作频段之外的外来电磁信号的干扰，从而使得在具备良好电磁传输视野的部位布局电磁收发器件如微波毫米波天线等成为可能，同时为飞机朝多传感集成、全空域感知等趋势发展奠定基础，这也将更进一步提升高端航空装备的全信息链贯通。
附图说明
图1为本发明第一实施例中超材料所包括一种多叠层结构的截面示意图；
图2为本发明第二实施例中超材料所包括另一种多叠层结构的截面示意图；
图3为本发明第二实施例中超材料所包括另一种多叠层的二维剖面示意图；
图4为本发明第二实施例中超材料所包括的金属微结构层2上的金属微结构的周期性排布示意图；
图5为本发明第二实施例中超材料所包括的金属微结构层2上的金属微结构的另一种周期性排布示意图；
图6为本发明第二实施例中的超材料在TE极化下的S21曲线随入射角度theta的变化示意图；
图7为本发明第二实施例中的超材料在TM极化下的S21曲线随入射角度theta的变化示意图；
图8为本发明第三实施例中超材料所包括的金属微结构层2上的金属微结构的周期性排布示意图；
图9为本发明第三实施例中的超材料在入射角度theta＝0度时TE极化下的S21曲线示意图；
图10为本发明第三实施例中的超材料在入射角度theta＝0度时TM极化下的S21曲线示意图；
图11为本发明第四实施例中超材料所包括的金属微结构层2上的金属 微结构的周期性排布示意图；
图12为本发明第四实施例中的超材料在入射角度theta＝0度时TE极化下的S21曲线示意图；
图13为本发明第四实施例中的超材料在入射角度theta＝0度时TM极化下的S21曲线示意图；
图14为本发明第五实施例中超材料所包括的金属微结构层2上的金属微结构的周期性排布示意图；
图15为本发明第五实施例中的超材料在入射角度theta＝0度时TE极化下的S21曲线示意图；
图16为本发明第五实施例中的超材料在入射角度theta＝0度时TM极化下的S21曲线示意图；
图17为本发明第六实施例中超材料所包括的金属微结构层2上的金属微结构的周期性排布示意图；
图18为本发明第六实施例中的超材料在入射角度theta＝0度时TE极化下的S21曲线示意图；
图19为本发明第六实施例中的超材料在入射角度theta＝0度时TM极化下的S21曲线示意图；
图20为本发明第七实施例中超材料所包括另一种多叠层的二维剖面示意图；
图21为本发明第七实施例中超材料所包括的双层调制结构上各自金属微结构的周期性排布示意图；
图22为本发明第七实施例中的超材料在入射角度theta＝0度时TE极化、TM极化下的S21曲线示意图；
图23为本发明第七实施例中超材料所包括的双层调制结构上各自金属微结构的周期性排布示意图；
图24为本发明第七实施例中的超材料在入射角度theta＝0～60°度时TE极化、TM极化下的S21曲线示意图。
具体实施方式
下面的实施例可以使本领域技术人员更全面地理解本发明，但不以任何方式限制本发明。
图1为本发明实施例中超材料所包括多叠层结构的截面示意图。
如图1所示，本发明的超材料采用多叠层结构设计，具体的，超材料包括基底材料层1以及叠加在基底材料层1上的金属微结构层2，金属微结构层2具有周期性排布的闭环连通结构，其中，基底材料层1与金属微结构层2共同形成第一金属软板，且第一金属软板的端部分别连接接线端子3，并通过接线端子3与外部电源接通，形成导电通路，以利用金属通电加热的特性进行电加热。其中，基底材料层1既可以是柔性基底材料层，也可以是硬性基底材料层，具体需要根据实际的应用场景而定，例如如果是将该超材料应用到曲面则需要柔性基底材料层，应用到平面的话可以选择硬性基底材料层也可以选择柔性基底材料层。其中，基底材料层1具有绝缘性能优异、耐高低温、拉伸等机械性能良好的特性，将基底材料层1与金属微结构层2共同形成第一金属软板，且第一金属软板在端部连接接线端子3，接线端子3可以通过焊接方式与金属微结构层2上的金属连接，或者其它的连接方式，只要满足接线端子3与金属微结构层2上的金属电连接均可，接线端子3分别通过电源线连接外部电源的正负两极，使金属微结构层2上的金属、接线端子3、电源线、外部电源之间形成导电通路结构，外部电源通过这个电通路结构，对易结冰部位进行电加热除冰。
如图1所示，在第一金属软板中，通过刻蚀工艺将基底材料层1上的金属进行刻蚀，进而加工成实际所需要的各种金属微结构图形，金属微结构层2中没有被蚀刻掉的区域就保留金属，金属微结构层2中被保留下来的金属形成一个连通结构，该连通结构为具有周期性排布的闭环连通结构，例如闭环连通结构可以是三角形、四边形、五边形、六边形等多边形的闭环连通结构，也可以是圆形、圆环形等曲线形的闭环连通结构。
其中，在金属微结构层2中，相邻的两个周期单元之间存在交集，例如共用一条金属边，且每一个周期单元呈闭环的封闭结构，如果闭环连通结构是三角形、或者四边形、或者五边形、或者六边形等多边形的闭环连通结构，那么金属微结构层2所具有的周期性排布的闭环连通结构就是周 期性排布的多个三角形所构成的闭环连通结构且相邻两个三角形之间共用一条金属边，或者是周期性排布的多个四边形所构成的闭环连通结构且相邻两个四边形之间共用一条金属边，或者是周期性排布的多个五边形所构成的闭环连通结构且相邻两个五边形之间共用一条金属边，亦或是周期性排布的多个六边形所构成的闭环连通结构且相邻两个六边形之间共用一条金属边，等等；如果闭环连通结构是圆形、圆环形等曲线形的闭环连通结构，那么金属微结构层2所具有的周期性排布的闭环连通结构就是周期性排布的多个圆形所构成的闭环连通结构且相邻两个圆形之间存在交集，例如共用一个或者多个金属点，或者是周期性排布的多个圆环形所构成的闭环连通结构且相邻两个圆环形之间存在交集，例如共用一个或者多个金属点。其中，在金属微结构层2中，两个接线端子3之间周期性排布的多个周期单元中至少存在一条金属连通线路，这样可以保证第一金属软板端部的接线端子3通电后形成导通通路，而作为加热单元，使得该超材料结构具备电加热除冰功能。
如图1所示，超材料还包括第一预浸料层4和第二预浸料层5，分别通过两层粘接剂6粘接在第一金属软板的正反两个表面，具体的，第一预浸料层4通过一层粘接剂6与金属微结构层2的正面进行粘接，金属微结构层2的反面与基底材料层1的正面叠加，第二预浸料层5通过另一层粘接剂6与所述基底材料层1的反面进行粘接。其中，第一预浸料层4和第二预浸料层5中各自的预浸料均为玻璃或石英等纤维预浸料，起到绝缘、强度支撑等作用，两层粘接剂6的作用是用于将第一预浸料层4和第二预浸料层5更好的粘接在第一金属软板的正反两个表面。
在本实施方式中，金属微结构层2具有周期性排布的闭环连通结构，这种周期性排布的闭环连通结构的制备是在第一金属软板中通过刻蚀工艺将基底材料层1上的金属进行刻蚀，进而加工成实际所需要的各种金属微结构图形，所有的金属微结构图形在一起是连通的，具体的，这种连通型金属结构图形可视为缝隙型金属结构图形，从外部物理特征而言，缝隙型金属结构图形可看做在一块完整的金属层表面上按照一定的排布形式刻蚀一些金属单元的缝隙。这种缝隙型金属结构图形在电磁波照射下产生的电 子可不受限制地流动，从频率响应特性上看，缝隙型金属结构图形具备带通型的电磁调制作用，具体的，这种带通型的电磁调制作用的机理表现在：
a)当低频电磁波照射在这种缝隙型金属结构图形的表面时，将激发大范围的电子移动，使得电子吸收大部分能量，而沿缝隙周围的感应电流很小，导致透射系数比较小；
b)随着入射电磁波频率的不断升高，电子移动的范围将逐渐减小，沿缝隙周围流动的电流不断增加，透射系数得到改善；
c)当入射电磁波的频率达到一定值时，缝隙周围的电子刚好在入射电磁波的电场矢量的驱动下来回移动，在缝隙周围形成较强的感应电流，由于电子吸收大量入射电磁波的能量，同时向外辐射能量，运动的电子透过单元缝隙向透射方向辐射电场，此时的缝隙单元阵列透射系数高；
d)当入射电磁波频率继续升高，导致电子的运动范围减小，在缝隙周围的电流将分成若干段，电子透过缝隙辐射出去的电磁波减小，透射系数降低；
e)对于在远离缝隙的金属表面上所产生的感应电流，则向反射方向辐射电磁场，且由于高频电磁波电场变化周期限制电子运动，辐射能量有限，故当高频电磁波入射时，透射系数减小，反射系数增大。
在本实施方式中，这种缝隙型金属结构图形的表面还可自由组合缝隙型金属表面微元、贴片型金属表面微元，进而实现需要的电磁调制特性。本发明结合电磁收发器件的电磁响应特性和结构、强度要求，对含电加热及电磁调制功能的复合层进行选材，并进行厚度、金属结构图案等一体化设计，实现结构、强度与复合电加热与电磁调制功能的一体化部件。
在本实施方式中，根据结构、强度、电磁调控性能等需要，该超材料可进一步增加新的组合介质层，如图2所示。
图2为本发明实施例中超材料所包括另一种多叠层结构的截面示意图。
如图2所示，虚线框A所表示的是图1中的超材料，虚线框B所表示的是新增的组合介质层。在图1所示的超材料结构的基础上，图2中的超材料还包括夹芯层7和第三预浸料层8，其中，夹芯层7的一面通过一层胶膜9与第二预浸料层5进行粘接，第三预浸料层8通过另一层胶膜9与 夹芯层7的另一面进行粘接。
图3为本发明第二实施例中超材料所包括另一种多叠层的二维剖面示意图。
图3所示的结构图即为将图2中的多叠层结构压合在一起形成一个多叠层的超材料的二维剖面示意图，图3所示的超材料结构是一种集除冰、电磁调制的功能与结构承载功能于一体的夹层结构，一共包括9层，具体的，从上到下，第一预浸料层4的厚度为d 1，一层粘接剂6的厚度为d 2，第一金属软板(包括基底材料层1和金属微结构层2)的厚度为d 3，另一层粘接剂6的厚度为d 4，第二预浸料层5的厚度为d 5，一层胶膜9的厚度为d 6，夹芯层7的厚度为d 7，另一层胶膜9的厚度为d 8，第三预浸料层8的厚度为d 9。
其中，第一预浸料层4、第二预浸料层5、第三预浸料层8中各自的预浸料均是低介电、低损耗的石英纤维氰酸酯预浸料，具备高透波及承载作用，同时，第一预浸料层4、第二预浸料层5、第三预浸料层8都是一种很好的蒙皮材料，第一预浸料层4、第二预浸料层5可以用作外蒙皮材料，第三预浸料层8可以用作内蒙皮材料，两层粘接剂6均可以用胶膜来实现粘接，第一金属软板作为电加热层主要由加热材料与绝缘材料组成，本发明中的金属微结构层2就是加热材料，其采用电阻率高、导电率高的金属铜来制作，本发明中的基底材料层1就是绝缘材料，其主要为综合性能优异的聚酰亚胺(PI)薄膜，夹芯层7作为蜂窝层来实现电磁性能优化及承载功能。
其中，金属微结构层2中的金属层厚度根据实际需要电阻大小来确定，金属层越厚产生的电阻越小，而薄的金属层则产生的电阻大。在本实施方式中，金属微结构层2中的金属层厚度为18μm，基底材料层1的厚度为25μm，因此本发明中的二者组成的第一金属软板作为电加热层是柔性的，易于在曲面件贴覆，。而且金属铜可被设计成不同拓扑结构镂空图案，实现频选的电磁调制功能。同时，金属微结构层2是连通结构，保证金属微结构层2中的金属在加电后可以形成通路，实现通电加热除冰功能。为实现不同极化和频段的频选功能，金属微结构层2还需要具有周期性排布的 闭环结构。本发明的各层之间通过用胶膜来实现粘接。以上使用的材料中，作为蒙皮材料的介电常数为3.15、损耗角正切值为0.006，胶膜材料的介电常数为2.7、损耗角正切值为0.0065，PI薄膜材料的介电常数为3.2、损耗角正切值为0.002，蜂窝材料的介电常数为1.11、损耗角正切值为0.006。
图4为本发明第二实施例中超材料所包括的金属微结构层2上的金属微结构的周期性排布示意图。
如图4所示，金属微结构层2上的金属微结构的基本单元为正六边形，正六边形内部的金属被刻蚀掉，只保留正六边形的六条边上的金属线条以形成正六边形金属环，正六边形金属微结构的六条边上的金属线长均为p，金属线宽均为ww，周期性排布的方式为相邻的两个正六边形金属微结构之间存在交集，例如共用一条金属边，此外正六边形金属环的任意边可弯折处理或变换为任意多边形周期边界，如图5所示将上述六边形环的每条边边进行弯折，这一变形可增加单元内金属线的周长，使透波频带向低频漂移，此外其弯折形式、周期、线宽、线距、弯折长度均可进行特定设计。
在本实施方式中，将图4所示金属微结构层2上的金属微结构的周期性排布应用到图3所示的叠层结构中，其中主要的结构尺寸如下表1所示。
表1 叠层结构中的主要结构尺寸
参数 数值(mm)
d 1 0.3
d 2 0.1
d 3 0.043
d 4 0.1
d 5 0.3
d 6 0.2
d 7 5.6
d 8 0.2
d 9 0.3
ww 0.04
p 5
然后根据上述表格中的尺寸对图3中的超材料进行仿真，结果如图6和图7所示。
从图6中可以看出在入射角度theta＝0～60°时，TE极化在8-15GHz 表现出高通特性，透波大于-1.4dB；在入射角度theta＝0～60°时，TE极化在0-1.5GHz表现出截止特性，透波均小于-10dB。
从图7中可以看出在入射角度theta＝0～70°时，TM极化在8-20GHz表现出高通特性，透波大于-1dB；在入射角度theta＝0～60°时，TM极化在0-1GHz表现出截止特性，透波均小于-9.4dB。
因此，从图6和图7的仿真结果来看，本发明中的超材料实现了高频透波、低频截止的频选功能。此外，具有这种类似连通金属层拓扑结构的均可在电加热除冰的基础上复合频选的电磁调制功能。
此外，本发明中不仅仅六边形的金属微结构的周期性排布能实现电加热除冰功能，其它任意多边形(如三边形、四边形、五边形等)单元结构之间只要满足存在交集的条件(如共边、共点、共线段等)，均可形成闭环连通结构以实现电通路，进而在作为电加热层通电时能够实现除冰功能，而且通过设计叠层结构中的主要结构尺寸，使其具备特定的电磁调制功能。
图8为本发明第三实施例中超材料所包括的金属微结构层2上的金属微结构的周期性排布示意图。
如图8所示，金属微结构层2上的金属微结构的基本单元结构为正三边形，正三边形内部的金属被刻蚀掉，只保留正三边形的三条边上的金属线条以形成正三边形金属环，正三边形金属微结构的三条边上的金属线长均为p 1，金属线宽均为ww 1，周期性排布的方式为相邻的两个正三边形金属微结构之间存在交集，例如共用一条金属边，这种排布可以实现通电时金属层处于通路。此外正三边形金属环的任意边亦可弯折处理或变换为任意多边形周期边界，例如可以如图5所示的弯折方式进行对每条边做弯折处理，这一变形可增加单元内金属线的周长，使透波频带向低频漂移，此外其弯折形式、周期、线宽、线距、弯折长度均可进行特定设计。
在本实施方式中，将图8所示的金属微结构层2上的金属微结构的周期性排布应用到图3所示的叠层结构中，其中主要的结构尺寸如下表2所示。
表2 叠层结构中的主要结构尺寸
参数 数值(mm)
d 1 0.3
d 2 0.1
d 3 0.043
d 4 0.1
d 5 0.3
d 6 0.2
d 7 5.6
d 8 0.2
d 9 0.3
ww 1 0.2
P 1 6
然后根据上述表格中的尺寸对图3中的超材料进行仿真，结果如图9和图10所示。
图9为本发明第三实施例中的超材料在入射角度theta＝0度时TE极化下的S21曲线示意图。从图9中可以看出在入射角度theta＝0°时，TE极化在10-20GHz表现出高通特性，透波大于-2.5dB。
图10为本发明第三实施例中的超材料在入射角度theta＝0度时TM极化下的S21曲线示意图。从图10中可以看出在入射角度theta＝0°时，TE极化在10-20GHz表现出高通特性，透波大于-2.5dB。
因此，从图9和图10的仿真结果来看，本发明中的超材料实现了高频透波、低频截止的电磁调制功能，此外具有这种类似连通金属层拓扑结构的均可在实现电加热除冰的基础上复合电磁调制功能。
图11为本发明第四实施例中超材料所包括的金属微结构层2上的金属微结构的周期性排布示意图。
如图11所示，金属微结构层2上的金属微结构的基本单元结构为正四边形，正四边形内部的金属被刻蚀掉，只保留正四边形的四条边上的金属线条以形成正四边形金属环，正四边形金属微结构的四条边上的金属线长均为p 2，金属线宽均为ww 2，周期性排布的方式为相邻的两个正四边形金属微结构之间存在交集，例如共用一条金属边，这种排布可以实现通电时金属层处于通路。此外正四边形金属环的任意边亦可弯折处理或变换为任意多边形周期边界，例如可以如图5所示的弯折方式进行对每条边做弯折处理，这一变形可增加单元内金属线的周长，使透波频带向低频漂移，此外其弯折形式、周期、线宽、线距、弯折长度均可进行特定设计。
在本实施方式中，将图11所示的金属微结构层2上的金属微结构的周期性排布应用到图3所示的叠层结构中，其中主要的结构尺寸如下表3所示。
表3 叠层结构中的主要结构尺寸
参数 数值(mm)
d 1 0.3
d 2 0.1
d 3 0.043
d 4 0.1
d 5 0.3
d 6 0.2
d 7 5.6
d 8 0.2
d 9 0.3
ww 2 0.3
P 2 6
然后根据上述表格中的尺寸对图3中的超材料进行仿真，结果如图12和图13所示。
图12为本发明第四实施例中的超材料在入射角度theta＝0度时TE极化下的S21曲线示意图。从图12中可以看出在入射角度theta＝0°时，TE极化在12-20GHz表现出高通特性，透波大于-2.5dB。
图13为本发明第四实施例中的超材料在入射角度theta＝0度时TM极化下的S21曲线示意图。从图13中可以看出在入射角度theta＝0°时，TE极化在12-20GHz表现出高通特性，透波大于-2.5dB。
因此，从图12和图13的仿真结果来看，本发明中的超材料实现了高频透波、低频截止的电磁调制功能，此外具有这种类似连通金属层拓扑结构的均可在实现电加热除冰的基础上复合电磁调制功能。
另外，本发明中不仅仅多边形这类直线型的闭环金属连通结构的周期性排布能实现电加热除冰功能，而且其它任意闭环曲线(如圆形、圆环等)单元结构之间只要满足存在交集的条件(如共边、共点、共线段等)，均可形成曲线型的闭环金属连通结构以实现电通路，进而在作为电加热层通电时能够实现除冰功能，而且通过设计叠层结构中的主要结构尺寸还能使 其具备电磁调制功能。
图14为本发明第五实施例中超材料所包括的金属微结构层2上的金属微结构的周期性排布示意图。
如图14所示，金属微结构层2上的金属微结构的基本单元结构为圆环形，圆环形的内径为p 3，圆环的线宽均为ww 3，周期性排布的方式为相邻的两个圆环形相互连接，这种排布可以实现通电时金属层处于通路。
在本实施方式中，将图14所示的金属微结构层2上的金属微结构的周期性排布应用到图3所示的叠层结构中，其中主要的结构尺寸如下表4所示。
表4 叠层结构中的主要结构尺寸
参数 量值(mm)
d 1 0.3
d 2 0.1
d 3 0.043
d 4 0.1
d 5 0.3
d 6 0.2
d 7 5.6
d 8 0.2
d 9 0.3
ww 3 0.6
P 3 6
然后根据上述表格中的尺寸对图3中的超材料进行仿真，结果如图15和图16所示。
图15为本发明第五实施例中的超材料在入射角度theta＝0度时TE极化下的S21曲线示意图。从图15中可以看出在入射角度theta＝0°时，TE极化在14-20GHz表现出高通特性，透波大于-2.5dB。
图16为本发明第五实施例中的超材料在入射角度theta＝0度时TM极化下的S21曲线示意图。从图16中可以看出在入射角度theta＝0°时，TE极化在14-20GHz表现出高通特性，透波大于-2.5dB。
因此，从图15和图16的仿真结果来看，本发明中的超材料实现了高频透波功能，此外具有这种类似连通金属层拓扑结构的均可在实现电加热 除冰的基础上复合电磁调制功能。
另外，本发明中不仅仅直线型的闭环金属连通结构、曲线型的闭环金属连通结构在周期性排布下能实现电加热除冰功能，而且孔状的闭环金属连通结构在周期性排布下也能实现电加热除冰功能，针对孔状的闭环金属连通结构作为单元结构，只要满足单元结构之间相互连接条件，均可形成孔状的闭环金属连通结构的电通路，进而在作为电加热层通电时能够实现除冰功能，而且通过设计叠层结构中的主要结构尺寸还能使其具备电磁调制功能。
图17为本发明第六实施例中超材料所包括的金属微结构层2上的金属微结构的周期性排布示意图。
如图17所示，金属微结构层2上的金属微结构的基本单元结构为在正六边形的金属片的中间位置镂空一个圆形通孔，以形成孔状的闭环金属连通结构，正六边形的金属片的边长为p 4，圆形通孔的半径为r 4，周期性排布的方式为相邻的两个正六边形的金属片存在交集，例如共用一条边，以形成相邻的两个单元结构之间相互连接的条件，用于实现二维连通型排布，这种排布可以实现通电时金属层处于通路。
在本实施方式中，将图17所示的金属微结构层2上的金属微结构的周期性排布应用到图3所示的叠层结构中，其中主要的结构尺寸设计如下表5所示。
表5 叠层结构中的主要结构尺寸
参数 数值(mm)
d 1 0.3
d 2 0.1
d 3 0.043
d 4 0.1
d 5 0.3
d 6 0.2
d 7 5.6
d 8 0.2
d 9 0.3
r 4 4.2
P 4 6
然后根据上述表格中的尺寸对图3中的超材料进行仿真，结果如图18和图19所示。
图18为本发明第六实施例中的超材料在入射角度theta＝0度时TE极化下的S21曲线示意图。从图18中可以看出在入射角度theta＝0°时，TE极化在18-20GHz表现出高通特性，透波大于-2.5dB。
图19为本发明第六实施例中的超材料在入射角度theta＝0度时TM极化下的S21曲线示意图。从图19中可以看出在入射角度theta＝0°时，TE极化在18-20GHz表现出高通特性，透波大于-2.5dB。
因此，从图18和图19的仿真结果来看，本发明中的超材料实现了高频透波的电磁调制功能，此外具有这种类似连通金属层拓扑结构的均可在实现电加热除冰的基础上复合电磁调制功能。
由此可知，本发明中将直线型的闭环金属连通结构、曲线型的闭环金属连通结构、孔状的闭环金属连通结构作为基本单元结构在周期性排布下均能实现电加热除冰功能，而且只要满足单元结构之间存在交集的条件(如共边、共点、共线段等)，均可形成孔状的闭环金属连通结构的电通路，进而在作为电加热层通电时能够实现除冰功能，而且通过设计叠层结构中的主要结构尺寸还能使其具备电磁调制功能。实现除冰功能的电加热层(即第一金属软板)除了保证金属层为连通结构以外，还需要将电加热层上的金属通过焊点与电源线相连接以形成接线端子，接线端子利用电源线连接至飞行器上的机载电源上，电加热层产生的热量在冰层和外蒙皮之间溶化出一个薄层，降低冰层和外蒙皮之间的附着力，这样在气动力或离心力的作用下冰层很容易被吹落。
在本实施方式中，对于新增的组合介质层来说，为了实现更优异的电磁调制性能，本发明还可以在夹芯层7或第三预浸料层8中单独嵌入图1所示的金属软板，例如第二金属软板，第二金属软板与第一金属软板一样，也包括基底材料层与金属微结构层，第二金属软板与第一金属软板一样，也是作为电磁调制层，但不同的是，第二金属软板作为电磁调制层可以实现整体更优异的电磁调制性能。
图20为本发明第七实施例中超材料所包括另一种多叠层的二维剖面 示意图。图20所示的超材料结构是一种集除冰、电磁调制的功能与结构承载功能于一体的夹层结构，一共包括13层，在图3的基础上增加了d10、d11、d12，具体的，从上到下，d1-d9与图3所示的相同，即第一预浸料层4的厚度为d 1，一层粘接剂6的厚度为d 2，第一金属软板的厚度为d 3，另一层粘接剂6的厚度为d 4，第二预浸料层5的厚度为d 5，一层胶膜9的厚度为d 6，夹芯层7的厚度为d 7，另一层胶膜9的厚度为d 8，第三预浸料层8的厚度为d 9；d11为第二金属软板，d10、d12为分别覆盖在第二金属软板的上下两个表面上的两层粘接剂 ，d9和d13一起组成图3中的d9，区别在于厚度不同，即组合在一起的厚度与图3中的d9的厚度不同。因此，图20所示的超材料呈双层调制结构，即第一金属软板作为电加热层实现电加热功能和电磁调制功能，第二金属软板作为电磁调制层可以实现整体更优异的电磁调制性能。
图21为本发明第七实施例中超材料所包括的双层调制结构上各自金属微结构的周期性排布示意图。
如图21(a)所示，第一金属软板的金属微结构层上的金属微结构的基本单元结构为圆环形，将圆形金属片的内部的金属刻蚀掉，只保留***的曲线金属线条以形成圆环形，圆环形的内径为p 1，圆环的金属线宽均为ww 1，周期性排布的方式为相邻的两个圆环形金属微结构之间存在交集，例如两个圆环形相切，这种排布可以实现通电时金属层处于通路。如图21(b)所示，第二金属软板的金属微结构层上的金属微结构的基本单元结构为圆环形，将圆形金属片的内部的金属刻蚀掉，只保留***的曲线金属线条以形成圆环形，圆环形的内径为p 2，圆环的金属线宽均为ww 2，周期性排布的方式为相邻的两个圆环形金属微结构之间存在交集，例如两个圆环形相切，这种排布可以实现通电时金属层处于通路。
在本实施方式中，将图21所示双层调制结构上各自金属微结构的周期性排布应用到图20所示的叠层结构中，其中主要的结构尺寸如下表6所示。
表6 叠层结构中的主要结构尺寸
参数 数值(mm)
d 1 0.3
d 2 0.1
d 3 0.043
d 4 0.2
d 5 0.3
d 6 0.2
d 7 5.6
d 8 0.2
d 9 0.3
d 10 0.1
d 11 0.043
d 12 0.1
d 13 0.3
ww 1 0.6
ww 2 0.6
p 1 6
p 2 6
然后根据上述表格中的尺寸对图20中的超材料进行仿真，结果如图22所示。
从图22中可以看出在入射角度theta＝0°时，双层调制结构(即同时包括第一金属软板和第二金属软板)的低频截止带宽明显大于单层调制结构(即仅仅包括第一金属软板)，表明增加金属软板作为电磁调制层有利于扩宽截止带宽，且高频透波未受到影响，从而可以实现整体更优异的电磁调制性能。
因此，以上几个实施例说明了，不论直线型的闭环金属连通结构、曲线型的闭环金属连通结构、孔状的闭环金属连通结构作为基本单元结构在金属软板上进行周期性排布均能实现电加热除冰功能和电磁调制功能，而且在第三预浸料层9中单独嵌入图1所示的金属软板(例如第二金属软板)，将第二金属软板上的金属微结构形状和尺寸设计成与第一金属软板上的金属微结构形状和尺寸都相同，可以实现整体更优异的电磁调制性能。但是，如果将第二金属软板上的金属微结构形状设计成与第一金属软板上的金属微结构形状相同但尺寸不同，或者形状和尺寸均不相同，同样可以实现整体更优异的电磁调制性能。
图23为本发明第七实施例中超材料所包括的双层调制结构上各自金属微结构的周期性排布示意图。
如图23(a)所示，第一金属软板的金属微结构层上的金属微结构的基本单元结构为正六边形，正六边形内部的金属被刻蚀掉，只保留正六边形的六条边上的金属线条以形成正六边形金属环，正六边形金属微结构的六条边上的金属线长均为p 1，金属线宽均为ww 1，周期性排布的方式为相邻的两个正六边形金属微结构之间存在交集，例如共用一条金属边，这种排布可以实现通电时金属层处于通路。如图23(b)所示，第二金属软板的金属微结构层上的金属微结构的基本单元结构也为正六边形，正六边形内部的金属被刻蚀掉，只保留正六边形的六条边上的金属线条以形成正六边形金属环，正六边形金属微结构的六条边上的金属线长均为p 2，金属线宽均为ww 2，周期性排布的方式为相邻的两个正六边形金属微结构之间存在交集，例如共用一条金属边，这种排布可以实现通电时金属层处于通路。此外正六边形金属环的任意边亦可弯折处理或变换为任意多边形周期边界，例如可以如图5所示的弯折方式进行对每条边做弯折处理，这一变形可增加单元内金属线的周长，使透波频带向低频漂移，此外其弯折形式、周期、线宽、线距、弯折长度均可进行特定设计。
在本实施方式中，将图23所示双层调制结构上各自金属微结构的周期性排布应用到图20所示的叠层结构中，其中主要的结构尺寸如下表7所示。
表7 叠层结构中的主要结构尺寸
参数 数值(mm)
d 1 0.3
d 2 0.1
d 3 0.043
d 4 0.1
d 5 0.3
d 6 0.2
d 7 5.6
d 8 0.2
d 9 0.3
d 10 0.1
d 11 0.043
d 12 0.1
d 13 0.3
ww 1 0.04
ww 2 0.8
p 1 5
p 2 5
然后根据上述表格中的尺寸对图23中的超材料进行仿真，结果如图24所示。
从图24中可以看出在入射角度theta＝0°时，双层调制结构(即同时包括第一金属软板和第二金属软板)的低频截止带宽明显大于单层调制结构(即仅仅包括第一金属软板)，7-15GHz的透波均大于-1dB，与单层调制结构的表面透波基本相同，表明增加金属软板作为电磁调制层有利于扩宽截止带宽，且高频透波未受到影响，从而可以实现整体更优异的电磁调制性能。
另外，本发明还提供了一种除冰装置，其中，所述除冰装置包括以上任一项所述的超材料。
此外，本发明还提供了一种飞行器，其中，所述飞行器包括以上任一项所述的超材料。
本发明提供的技术方案在满足除冰功能的基础上复合电磁调制功能，通过设计导通的金属通路以及对金属通路的特定设计，解决现有除冰方式因金属层对电磁信号屏蔽而无法保证电磁信号传输的难题，同时可抑制部件内部电磁收发器件工作频段之外的外来电磁信号的干扰，从而使得在具备良好电磁传输视野的部位布局电磁收发器件，如微波、毫米波天线等成为可能，同时为飞机朝多传感集成、全空域感知等趋势发展奠定基础，这也将更进一步提升高端航空装备的全信息链贯通。
本领域技术人员应理解，以上实施例仅是示例性实施例，在不背离本发明的精神和范围的情况下，可以进行多种变化、替换以及改变。

Claims (10)

  1. 一种超材料，其特征在于，所述超材料包括基底材料层以及叠加在所述基底材料层上的金属微结构层，所述金属微结构层具有周期性排布的闭环连通结构，其中，所述基底材料层与所述金属微结构层共同形成第一金属软板，且所述第一金属软板的端部连接有接线端子，并通过所述接线端子与外部电源接通，形成导电通路，以利用金属通电加热的特性进行电加热。
  2. 根据权利要求1所述的超材料，其特征在于，所述超材料还包括第一预浸料层，所述第一预浸料层通过一层粘接剂与所述金属微结构层进行粘接。
  3. 根据权利要求2所述的超材料，其特征在于，所述超材料还包括第二预浸料层，所述第二预浸料层通过一层粘接剂与所述基底材料层进行粘接。
  4. 根据权利要求3所述的超材料，其特征在于，所述超材料还包括夹芯层，所述夹芯层通过一层胶膜与所述第二预浸料层进行粘接。
  5. 根据权利要求4所述的超材料，其特征在于，所述超材料还包括第三预浸料层，所述第三预浸料层通过一层胶膜与所述夹芯层进行粘接。
  6. 根据权利要求4或5所述的超材料，其特征在于，在所述夹芯层或者所述第三预浸料层中嵌入第二金属软板。
  7. 根据权利要求1所述的超材料，其特征在于，在所述金属微结构层中，相邻的两个周期单元之间存在交集，且每一个周期单元呈闭环的封闭结构。
  8. 根据权利要求7所述的超材料，其特征在于，在所述金属微结构层中，所述接线端子之间周期性排布的多个周期单元中至少存在一条金属连通线路。
  9. 一种除冰装置，其特征在于，所述除冰装置包括权利要求1-8任一项所述的超材料。
  10. 一种飞行器，其特征在于，所述飞行器包括权利要求1-8任一项所述的超材料。
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