WO2021017117A1 - 软性印刷电路板及显示设备 - Google Patents

软性印刷电路板及显示设备 Download PDF

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Publication number
WO2021017117A1
WO2021017117A1 PCT/CN2019/106016 CN2019106016W WO2021017117A1 WO 2021017117 A1 WO2021017117 A1 WO 2021017117A1 CN 2019106016 W CN2019106016 W CN 2019106016W WO 2021017117 A1 WO2021017117 A1 WO 2021017117A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
substrate
flexible printed
flexible
Prior art date
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PCT/CN2019/106016
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English (en)
French (fr)
Inventor
肖晶晶
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武汉华星光电技术有限公司
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Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/613,427 priority Critical patent/US20210037646A1/en
Publication of WO2021017117A1 publication Critical patent/WO2021017117A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present invention relates to a flexible printed circuit board, in particular to a flexible printed circuit board with through holes.
  • the display device 100 includes a backlight module 101, a first substrate 102, a thin film transistor array substrate 103, a color filter 104, a second substrate 105, a control circuit board 106 and a flexible printed circuit board 107.
  • the first substrate 102 is arranged on the backlight module 101
  • the flexible printed circuit board 107 is arranged on the thin film transistor array substrate 103
  • the thin film transistor array substrate 103 is arranged on the first substrate 101
  • the second substrate 105 is arranged on the color filter 104
  • the control circuit board 106 and the color filter 104 are arranged on the thin film transistor array substrate 103
  • the flexible printed circuit board 107 is arranged on the thin film transistor array substrate 103.
  • the flexible printed circuit board 107 includes a flexible substrate 108, pins 109 and metal traces 110.
  • the length of the pin 109 will extend beyond the length of the thin film transistor array substrate 103, and the length of the pin 109 will exceed the length of the thin film transistor array substrate by about 0.15 mm to 0.2 mm, so the gel 111 is required to protect the pins that extend beyond the thin film transistor array substrate 103 109.
  • a display device includes a flexible printed circuit board, and the flexible printed circuit board includes a flexible substrate, pins, and metal traces.
  • the flexible printed circuit board When the flexible printed circuit board is connected to the thin film transistor array substrate in the display device, it is necessary to reserve pins at the joint.
  • the pins are electrically connected to the flexible printed circuit board through metal traces.
  • the length of the pins will vary. It extends beyond the length of the thin film transistor array substrate in the display device, and therefore requires gel to protect the pins with the excess length.
  • a protective layer is needed to protect the edges of the pins, so that the flexible printed circuit board cannot be bent further inward, making the display device unable to have a high screen-to-body ratio screen.
  • the flexible printed circuit board of the embodiment of the present invention extends the metal traces to the two ends of the flexible substrate through the through holes and electrically connects the pins to compress the bending space inside the flexible printed circuit board, so that it has this flexibility.
  • the display device of the printed circuit board has a high screen-to-body ratio screen to solve the problems existing in the prior art.
  • a flexible printed circuit board includes a flexible substrate, through holes, pins, and metal traces.
  • the through hole penetrates the flexible substrate.
  • the metal traces extend through the through holes to electrically connect the pins at both ends of the flexible substrate.
  • the flexible printed circuit board further includes a protective layer, which covers the metal traces extending from the through holes to the two ends of the flexible substrate.
  • the flexible printed circuit board further includes an anisotropic conductive film.
  • the anisotropic conductive film covers the pins.
  • the inside of the through hole is plated with a metal layer.
  • the through holes penetrating the flexible substrate are arranged offset from each other.
  • the aperture of the through hole is less than 0.1 mm.
  • a display device in another embodiment, includes a backlight module, a first substrate, a thin film transistor array substrate, a color filter, a second substrate, a control circuit board, and a flexible printed circuit board.
  • the first substrate is disposed on the backlight module.
  • the thin film transistor array substrate is arranged on the first substrate.
  • the second substrate is disposed on the color filter.
  • the control circuit board and the color filter are arranged on the thin film transistor array substrate.
  • the flexible printed circuit board is arranged on the thin film transistor array substrate.
  • the flexible printed circuit board includes a flexible substrate, through holes, pins and metal traces, and the through holes penetrate the flexible substrate.
  • the metal traces extend through the through holes to electrically connect the pins at both ends of the flexible substrate.
  • the pins are electrically connected to the controlled circuit board through metal traces.
  • a flexible printed circuit board in another embodiment, includes a flexible substrate, through holes, pins, metal traces, and a protective layer.
  • the through hole penetrates the flexible substrate, and the inside of the through hole is plated with a metal layer.
  • the metal traces extend through the through holes to electrically connect the pins at both ends of the flexible substrate.
  • the protective layer covers the metal traces extending from the through holes to the two ends of the flexible substrate.
  • the flexible printed circuit board further includes an anisotropic conductive film.
  • the anisotropic conductive film covers the pins.
  • the through holes penetrating the flexible substrate are arranged offset from each other.
  • the aperture of the through hole is less than 0.1 mm.
  • a flexible printed circuit board in a display device extends metal traces to both ends of the flexible substrate through through holes and electrically connects the pins to compress the bending space inside the flexible printed circuit board , So that the display device has a high screen-to-body ratio screen.
  • Figure 1 is a schematic diagram of a display device
  • Figure 2 is a schematic diagram of a display device according to an embodiment of the present invention.
  • Figure 3 is a schematic diagram of a flexible substrate of an embodiment of the present invention.
  • Fig. 4 is a schematic diagram of a flexible substrate according to another embodiment of the present invention.
  • a flexible printed circuit board in a display device extends metal traces to both ends of the flexible substrate through through holes and electrically connects the pins to compress the bending space inside the flexible printed circuit board , So that the display device has a high screen-to-body ratio screen.
  • a display device 200 includes a backlight module 201, a first substrate 202, a thin film transistor array substrate 203, a color filter 204, a second substrate 205, a control circuit board 206 and a flexible printed circuit board 207.
  • the display device 200 is a liquid crystal display.
  • the first substrate 202 is arranged on the backlight module 201
  • the thin film transistor array substrate 203 is arranged on the first substrate 201
  • the second substrate 205 is arranged on the color filter 204
  • the control circuit board 206 and the color filter 204 is arranged on the thin film transistor array substrate 203
  • the flexible printed circuit board 207 is arranged on the thin film transistor array substrate 203, wherein the first substrate 202 and the second substrate 205 are glass substrates
  • the flexible printed circuit board 207 includes a flexible substrate 208, through holes 209, pins 210 and metal traces 211.
  • There is a gap between the color filter 204 and the control circuit board 206 and there is also a gap between the control circuit board 206 and the flexible printed circuit board 207.
  • the display device 200 further includes an anisotropic conductive film 212, which covers the bottom and sides of the pin 210, and the pin 210 is provided on the inner bottom of the flexible substrate 208. Therefore, there is no longer a need for gel to protect the sides of the pins 210, and there is no need to provide a protective layer on the inner side of the flexible substrate 208.
  • the through holes 209 penetrate through the flexible substrate 208, and the through holes 209 through the flexible substrate 208 are arranged in a staggered manner.
  • the metal trace 211 extends to the outer ends of the flexible substrate 208 through the through hole and is electrically connected to the pin 210 so that the pin 210 can be electrically connected to the control circuit board 206 through the metal trace 211.
  • the inner side of the through hole 209 is plated with a metal layer.
  • the inner side of the through hole 209 is plated with a copper layer.
  • the aperture of the through hole 209 is less than 0.1 mm.
  • the display device 200 further includes a protective layer 213 that completely covers the metal traces 211 extending from the through hole 209 to both ends of the flexible substrate 208, and the protective layer 213 also completely covers the outside of the flexible substrate 208.
  • the flexible printed circuit of FIG. 2 can be further bent inward, thereby compressing the bending space inside the flexible printed circuit board.
  • the flexible substrate 208 is provided with through holes 209 penetrating the flexible substrate 208, and the through holes 209 are arranged in an offset arrangement.
  • the shape of the flexible substrate 208 may be polygonal, and the flexible substrates 208 are also arranged in an offset arrangement.
  • FIG. 4 another implementation is provided on the flexible substrate 308 with through holes 309 penetrating the flexible substrate 308, and the through holes 309 are arranged offset from each other.
  • the difference between Figure 4 and Figure 3 lies in the shape of the flexible substrate.
  • the flexible printed circuit board of the embodiment of the present invention does not need to be additionally coated with gel to protect the sides of the pins, and there is no need to provide a protective layer on the inner side of the flexible substrate, and the metal traces can be extended to the soft through the through holes. Both ends of the flexible substrate are electrically connected to the pins, so the bending space inside the flexible printed circuit board can be further compressed, so that the display device has a high screen-to-body ratio screen.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种软性印刷电路板包括软性基板、通孔、引脚及金属走线。通孔贯穿软性基板，以及金属走线通过通孔延伸至软性基板的两端且电性连接引脚，以压缩软性印刷电路板内侧的弯折空间，使得具有此软性印刷电路板的显示设备具有高屏占比屏幕。

Description

软性印刷电路板及显示设备 技术领域
本发明是有关于一种软性印刷电路板，特别是有关于一种具有通孔的软性印刷电路板。
 背景技术
根据图1，显示设备100包括背光模块101、第一基板102、薄膜晶体管阵列基板103、彩色滤光片104、第二基板105、控制电路板106及软性印刷电路板107。第一基板102设置在背光模块101上，软性印刷电路板107设置在薄膜晶体管阵列基板103上，薄膜晶体管阵列基板103设置在第一基板101上，第二基板105设置在彩色滤光片104上，控制电路板106和彩色滤光片104设置在薄膜晶体管阵列基板103上，软性印刷电路板107设置在薄膜晶体管阵列基板103上。另外，彩色滤光片104和控制电路板106之间具有间隙，以及控制电路板106和软性印刷电路板107也具有间隙。具体而言，软性印刷电路板107包括软性基板108、引脚109及金属走线110。引脚109的长度会延伸超出薄膜晶体管阵列基板103的长度，引脚109的长度超出薄膜晶体管阵列基板约0.15毫米至0.2毫米，因此需要凝胶111保护超出延伸超出薄膜晶体管阵列基板103的引脚109。另外，还需要设置保护层112保护部分软性基板108的外侧，以及设置长度0.35毫米以上的保护层112保护引脚109的边缘，因此导致软性印刷电路板107无法进一步向内侧弯折。
 技术问题
一般而言，显示设备包括的软性印刷电路板，软性印刷电路板包括软性基板、引脚及金属走线。当软性印装电路板与显示设备中的薄膜晶体管阵列基板进行接合时，需要在接合处预留引脚，引脚通过金属走线电性连接软性印刷电路板，然而引脚的长度会延伸超出显示设备中的薄膜晶体管阵列基板的长度，因此需要凝胶保护长度超出的引脚。另外，还需要一层保护层保护引脚的边缘，因此导致软性印刷电路板无法进一步向内侧弯折，使得显示设备无法具有高屏占比屏幕。
 技术解决方案
本发明实施例的软性印刷电路板通过通孔将金属走线延伸至软性基板的两端且电性连接引脚，以压缩软性印刷电路板内侧的弯折空间，使得具有此软性印刷电路板的显示设备具有高屏占比屏幕，以解决现有技术所存在的问题。
本发明实施例的一种软性印刷电路板包括软性基板、通孔、引脚及金属走线。通孔贯穿软性基板。金属走线通过通孔延伸至软性基板的两端电性连接引脚。
在本发明的一实施例中，软性印刷电路板还包括保护层，保护层覆盖从通孔延伸至软性基板的两端的金属走线。
在本发明的一实施例中，软性印刷电路板还包括异向性导电膜。
在本发明的一实施例中，异向性导电膜包覆引脚。
在本发明的一实施例中，通孔的内部镀有金属层。
在本发明的一实施例中，贯穿软性基板的通孔是彼此错位排列。
在本发明的一实施例中，通孔的孔径小于0.1毫米。
在本发明的另一实施例中，一种显示设备包括背光模块、第一基板、薄膜晶体管阵列基板、彩色滤光片、第二基板、控制电路板及软性印刷电路板。第一基板设置在背光模块上。薄膜晶体管阵列基板设置在第一基板上。第二基板设置在彩色滤光片上。控制电路板和彩色滤光片设置在薄膜晶体管阵列基板上。软性印刷电路板设置在薄膜晶体管阵列基板上。软性印刷电路板包括软性基板、通孔、引脚和金属走线，且通孔贯穿软性基板。
在本发明的一实施例中，金属走线通过通孔延伸至软性基板的两端电性连接引脚。
在本发明的一实施例中，引脚通金属走线与所控制电路板电性连接。
在本发明另一实施例中，一种软性印刷电路板包括软性基板、通孔、引脚、金属走线及保护层。通孔贯穿软性基板，且通孔的内部镀有金属层。金属走线通过通孔延伸至软性基板的两端电性连接引脚。保护层覆盖从通孔延伸至软性基板的两端的金属走线。
在本发明的一实施例中，软性印刷电路板还包括异向性导电膜。
在本发明的一实施例中，异向性导电膜包覆引脚。
在本发明的一实施例中，贯穿软性基板的通孔是彼此错位排列。
在本发明的一实施例中，通孔的孔径小于0.1毫米。
 有益效果
本发明实施例的一种显示设备中的软性印刷电路板通过通孔将金属走线延伸至软性基板的两端且电性连接引脚，以压缩软性印刷电路板内侧的弯折空间，使得显示设备具有高屏占比屏幕。
 附图说明
图1是显示设备示意图；
图2是本发明实施例的显示设备示意图；
图3是本发明实施例的软性基板示意图；以及
图4是本发明另一实施例的软性基板示意图。
 本发明的实施方式
本发明实施例的一种显示设备中的软性印刷电路板通过通孔将金属走线延伸至软性基板的两端且电性连接引脚，以压缩软性印刷电路板内侧的弯折空间，使得显示设备具有高屏占比屏幕。
根据图2，一种显示设备200包括背光模块201、第一基板202、薄膜晶体管阵列基板203、彩色滤光片204、第二基板205、控制电路板206及软性印刷电路板207。优选地，显示设备200是液晶显示器。具体而言，第一基板202设置在背光模块201上，薄膜晶体管阵列基板203设置在第一基板201上，第二基板205设置在彩色滤光片204上，控制电路板206和彩色滤光片204设置在薄膜晶体管阵列基板203上，软性印刷电路板207设置在薄膜晶体管阵列基板203上，其中第一基板202和第二基板205是玻璃基板，以及软性印刷电路板207包括软性基板208、通孔209、引脚210和金属走线211。彩色滤光片204和控制电路板206之间具有间隙，以及控制电路板206和软性印刷电路板207之间也具有间隙。另外，显示设备200还包括异向性导电膜212，异向性导电膜212包覆引脚210的底部及侧边，且引脚210设置软性基板208的内侧底部。因此，不再需要凝胶保护引脚210的侧边，也不需要在软性基板208的内侧设置保护层。再者，通孔209贯穿软性基板208，且贯穿软性基板208的通孔209是彼此错位排列。金属走线211通过通孔延伸至软性基板208的外侧两端且电性连接引脚210，使得引脚210能够通过金属走线211与控制电路板206电性连接。通孔209的内侧镀上金属层，优选地，通孔209的内侧镀上铜层，更优选地，通孔209的孔径小于0.1毫米。进一步而言，显示设备200还包括保护层213，保护层213完全覆盖从通孔209延伸至软性基板208的两端的金属走线211，以及保护层213还完全覆盖软性基板208的外侧。相较于图1，图2的软性印刷电路还能进一步向内侧弯折，进而压缩软性印刷电路板内侧的弯折空间。
根据图3，由于是直接在软性基板208上制作通孔209，而部分通孔209会彼此重叠而无法形成有效压贴，从而影响压贴效果问题。因此在软性基板208上设置贯穿软性基板208的通孔209，通孔209是彼此错位排列。另外，软性基板208的形状可以是多边形，且软性基板208也是彼此错位排列。
根据图4是另一实施在软性基板308上设置贯穿软性基板308的通孔309，通孔309是彼此错位排列。图4与图3的差别在于软性基板的形状不同。
本发明实施例的软性印刷电路板不再需要额外涂上凝胶保护引脚的侧边，也不需要在软性基板的内侧设置保护层，还能通过通孔将金属走线延伸至软性基板的两端且电性连接引脚，因此能进一步压缩软性印刷电路板内侧的弯折空间，使得显示设备具有高屏占比屏幕。
虽然本发明结合其具体实施例而被描述，应该理解的是，许多替代、修改及变化对于那些本领域的技术人员将是显而易见的。因此，其意在包含落入所附权利要求书的范围内的所有替代、修改及变化。

Claims (15)

  1. 一种软性印刷电路板，包括：
    软性基板；
    通孔，所述通孔贯穿所述软性基板；
    引脚；以及
    金属走线，其中所述金属走线通过所述通孔延伸至所述软性基板的两端电性连接所述引脚。
  2. 如权利要求1所述的软性印刷电路板，还包括保护层，所述保护层覆盖从所述通孔延伸至所述软性基板的两端的所述金属走线。
  3. 如权利要求1所述的软性印刷电路板，还包括异向性导电膜。
  4. 如权利要求3所述的软性印刷电路板，其中，所述异向性导电膜包覆所述引脚。
  5. 如权利要求1所述的软性印刷电路板，其中，所述通孔的内部镀有金属层。
  6. 如权利要求1所述的软性印刷电路板，其中，贯穿所述软性基板的所述通孔是彼此错位排列。
  7. 如权利要求1所述的软性印刷电路板，其中，所述通孔的孔径小于0.1毫米。
  8. 一种显示设备，包括：
    背光模块；
    第一基板，所述第一基板设置在所述背光模块上；
    薄膜晶体管阵列基板，所述薄膜晶体管阵列基板设置在所述第一基板上；
    彩色滤光片；
    第二基板，所述第二基板设置在所述彩色滤光片上；
    控制电路板，所述控制电路板和所述彩色滤光片设置在所述薄膜晶体管阵列基板上；以及
    软性印刷电路板，所述软性印刷电路板设置在所述薄膜晶体管阵列基板上，其中所述软性印刷电路板包括软性基板、通孔、引脚及金属走线，其中所述通孔贯穿所述软性基板。
  9. 如权利要求8所述的显示设备，其中，所述金属走线通过所述通孔延伸至所述软性基板的两端且电性连接所述引脚。
  10. 如权利要求9所述的显示设备，其中，所述引脚通所述金属走线与所述控制电路板电性连接。
  11. 一种软性印刷电路板，包括：
    软性基板；
    通孔，所述通孔贯穿所述软性基板，且所述通孔的内部镀有金属层；
    引脚；
    金属走线，所述金属走线通过所述通孔延伸至所述软性基板的两端电性连接所述引脚；以及
    保护层，所述保护层覆盖从所述通孔延伸至所述软性基板的两端的所述金属走线。
  12. 如权利要求11所述的软性印刷电路板，还包括异向性导电膜。
  13. 如权利要求12所述的软性印刷电路板，其中，所述异向性导电膜包覆所述引脚。
  14. 如权利要求11所述的软性印刷电路板，其中，贯穿所述软性基板的所述通孔是彼此错位排列。
  15. 如权利要求11所述的软性印刷电路板，其中，所述通孔的孔径小于0.1毫米。
PCT/CN2019/106016 2019-07-30 2019-09-16 软性印刷电路板及显示设备 WO2021017117A1 (zh)

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