WO2021007955A1 - 电容检测装置及电子设备 - Google Patents

电容检测装置及电子设备 Download PDF

Info

Publication number
WO2021007955A1
WO2021007955A1 PCT/CN2019/108636 CN2019108636W WO2021007955A1 WO 2021007955 A1 WO2021007955 A1 WO 2021007955A1 CN 2019108636 W CN2019108636 W CN 2019108636W WO 2021007955 A1 WO2021007955 A1 WO 2021007955A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensing unit
sensing
switch
circuit
detection device
Prior art date
Application number
PCT/CN2019/108636
Other languages
English (en)
French (fr)
Inventor
杨明
程树青
陈淡生
郭子成
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to EP19931508.6A priority Critical patent/EP3792737B1/en
Priority to KR1020207035730A priority patent/KR102475549B1/ko
Priority to US17/033,258 priority patent/US11953350B2/en
Publication of WO2021007955A1 publication Critical patent/WO2021007955A1/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/64—Testing of capacitors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
    • G01D5/2417—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying separation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/32—Compensating for temperature change
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2605—Measuring capacitance
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/945—Proximity switches
    • H03K17/955—Proximity switches using a capacitive detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
    • H03K2017/9604—Touch switches characterised by the type or shape of the sensing electrodes characterised by the number of electrodes
    • H03K2017/9613—Touch switches characterised by the type or shape of the sensing electrodes characterised by the number of electrodes using two electrodes per touch switch
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/96071—Capacitive touch switches characterised by the detection principle
    • H03K2217/960725—Charge-transfer
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960735—Capacitive touch switches characterised by circuit details
    • H03K2217/960745—Capacitive differential; e.g. comparison with reference capacitance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/96—Touch switches
    • H03K2217/9607—Capacitive touch switches
    • H03K2217/960755—Constructional details of capacitive touch and proximity switches
    • H03K2217/960765—Details of shielding arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones

Definitions

  • the embodiments of the present application relate to the field of sensor technology, and in particular, to a capacitance detection device and electronic equipment.
  • human-computer interaction methods are more intelligent. For example, touch operation, intelligent detection, etc., all realize human-computer interaction by detecting the contact between the human body and the device.
  • the capacitive sensor is more widely used because of its easy installation and low cost.
  • the capacitive sensor is affected by temperature when detecting human contact, the detection result of the capacitive sensor is inaccurate.
  • one of the technical problems solved by the embodiments of the present application is to provide a capacitance detection device and electronic equipment to overcome the inaccurate detection results of the capacitance sensor due to the influence of temperature in the prior art. Defects.
  • An embodiment of the present application provides a capacitance detection device, which includes: a sensing module, a connection circuit, and a differential detection circuit for detecting changes in capacitance of the sensing module;
  • the sensing module includes: a substrate, a first sensing layer and a second sensing layer respectively located on two sides of the substrate,
  • the first sensing unit on the first sensing layer is opposite to the second sensing unit on the second sensing layer, and the first sensing unit covers the second sensing unit;
  • the first sensing unit and the second sensing unit are respectively electrically connected with the differential detection circuit through the connecting circuit.
  • the first sensing unit includes a first pattern
  • the second sensing unit includes a second pattern
  • the first pattern and the second pattern have the same shape
  • the first pattern and the second pattern are both grid patterns, and the grid size of the first pattern and the second pattern are the same, or the grid of the second pattern is larger than that of the first pattern.
  • the patterned grid is sparse.
  • both the first sensing unit and the second sensing unit are copper foil layers.
  • the connecting circuit is provided on one or both sides of the substrate.
  • a first ground pattern is provided on the first sensing layer, and/or a second ground pattern is provided on the second sensing layer.
  • connection circuit includes a connector, and the connector includes a first connection point, a second connection point, and a ground point;
  • the first sensing unit and the second sensing unit are electrically connected to the differential detection circuit through a first connection point and a second connection point, respectively;
  • the first ground pattern is electrically connected to the ground point, and/or the second ground pattern is electrically connected to the ground point.
  • the first sensing layer further includes a first protection element
  • the second sensing layer further includes a second protection element, and both the first protection element and the second protection element are conductive media
  • the first protection element does not contact the first sensing unit, and the second protection element does not contact the second sensing unit.
  • the first protection element is arranged on the first sensing layer around the first sensing unit
  • the second protection element is arranged on the second sensing layer around the second sensing unit.
  • the first protection element and the second protection element are opposite in position, have the same size, and have the same shape.
  • the capacitance detection device further includes a cover plate, and the cover plate is fixed on the first sensing layer by glue.
  • the capacitance detection device further includes a third protection element, the cross section of the first sensing layer, the second sensing layer and the third protection element are ring-shaped, and the third protection element is fixed Inside the second sensing layer.
  • the capacitance detection device further includes a ground layer
  • the cross section of the base material is spiral, the inner part of the base material is located between the third protective element and the ground layer, and the outer part of the base material is located between the first sensing layer and the second sensing layer.
  • the capacitance detection device further includes an excitation circuit
  • the first induction unit and the second induction unit are respectively electrically connected to the excitation circuit through the connection circuit, and the excitation circuit is used for transmitting electrical signals to the first induction unit and the second induction unit.
  • the capacitance detection device further includes a control logic circuit and a switch module
  • the first sensing unit and the second sensing unit are respectively electrically connected to the switch module through the connection circuit, and the switch module is respectively electrically connected to the excitation circuit and the differential detection circuit;
  • the control logic circuit is electrically connected with the switch module, and the control logic circuit is used to control the connection or disconnection of the switch module.
  • the switch module includes a first switch and a second switch
  • the first switch is connected between the first sensing unit and the differential detection circuit, and the control logic circuit controls the first sensing unit to communicate with the excitation circuit through the first switch, or controls the first sensing unit to communicate with the differential detection circuit;
  • the second switch is connected between the second sensing unit and the differential detection circuit, and the control logic circuit controls the second sensing unit to communicate with the excitation circuit through the second switch, or controls the second sensing unit to communicate with the differential detection circuit.
  • the differential detection circuit includes a first operational amplifier, a first analog-to-digital converter, a first capacitor, and a second capacitor;
  • the positive input terminal of the first operational amplifier is electrically connected with the first switch, and the negative input terminal of the first operational amplifier is electrically connected with the second switch;
  • the first capacitor is connected between the positive input terminal of the first operational amplifier and the output terminal of the first operational amplifier, and the second capacitor is connected between the negative input terminal of the first operational amplifier and the output terminal of the first operational amplifier.
  • the output terminal of the operational amplifier is electrically connected to the first analog-to-digital converter.
  • the switch module includes a third switch, a fourth switch, and a fifth switch;
  • the third switch is connected between the first sensing unit and the first connecting terminal, and the control logic circuit controls the first sensing unit to communicate with the first connecting terminal through the third switch, or controls the first sensing unit to be grounded;
  • the fourth switch is connected between the second sensing unit and the first connecting terminal, and the control logic circuit controls the second sensing unit to communicate with the first connecting terminal through the third switch, or controls the second sensing unit to be grounded;
  • the fifth switch is connected between the first connection terminal and the differential detection circuit, and the control logic circuit controls the first connection terminal to communicate with the excitation circuit through the fifth switch, or controls the first connection terminal to communicate with the differential detection circuit.
  • the differential detection circuit includes a second operational amplifier, a second analog-to-digital converter, and a third capacitor;
  • the positive input terminal of the second operational amplifier is connected to the reference voltage, and the negative input terminal of the second operational amplifier is electrically connected with the fifth switch;
  • the third capacitor is connected between the negative input terminal of the second operational amplifier and the output terminal of the second operational amplifier, and the output terminal of the second operational amplifier is electrically connected with the second analog-to-digital converter.
  • An embodiment of the present application provides an electronic device, which includes the capacitance detection device as described in any embodiment of the present application.
  • the electronic device is a headset
  • the sensing module of the capacitance detection device is arranged around the speaker of the headset.
  • the first sensing layer of the sensing module is arranged on the side close to the user, and the second sensing layer of the sensing module is arranged on the side facing away from the user.
  • the base material forms a laminated structure by surrounding two circles on the speaker.
  • the length of the first sensing unit in the first sensing layer and the length of the second sensing unit in the second sensing layer are less than or equal to the circumference of the speaker.
  • the third protection element of the capacitance detection device is located outside the ground layer of the capacitance detection device, and the length surrounded by the third protection element and the ground layer is the circumference of the speaker.
  • the first sensing unit is provided on the first sensing layer of the capacitance detection device
  • the second sensing unit is provided on the second sensing layer of the capacitance detection device.
  • the detection object approaches the capacitance detection
  • the capacitance of the first sensing unit is affected by temperature and the detection object
  • the capacitance of the second sensing unit is only affected by temperature.
  • the capacitance of the first sensing unit and the second sensing unit can eliminate the influence of temperature.
  • the capacitance change caused by the detection object improves the detection accuracy of the capacitance detection device.
  • FIG. 1 is a schematic structural diagram of a capacitance detection device provided by an embodiment of the present application
  • FIG. 2 is a schematic diagram of the position of a connection circuit provided by an application embodiment
  • FIG. 3a is a schematic structural diagram of a first sensing layer provided by an embodiment of the present application.
  • FIG. 3b is a schematic structural diagram of a first sensing layer provided by an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a capacitance detection device provided by an embodiment of the present application.
  • FIG. 5 is a schematic cross-sectional view of a differential detection circuit provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a capacitance detection device provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a capacitance detection device provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a capacitance detection device provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a differential detection circuit provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a capacitance detection device provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a differential detection circuit provided by an embodiment of the present application.
  • FIG. 12 is a schematic cross-sectional view of an electronic device provided by an embodiment of the present application.
  • Embodiment 1 of the present application provides a capacitance detection device 10, as shown in FIG. 1, which is a schematic structural diagram of a capacitance detection device 10 provided in an embodiment of the present application, and the capacitance detection device 10 includes:
  • the sensing module 11 includes: a substrate 111, a first sensing layer 112 and a second sensing layer 113 respectively located on two sides of the substrate 111,
  • the first sensing unit 1121 on the first sensing layer 112 is opposite to the second sensing unit 1131 on the second sensing layer 113, and the first sensing unit 1121 covers the second sensing unit 1131;
  • the first sensing unit 1121 and the second sensing unit 1131 are electrically connected to the differential detection circuit 13 through the connecting circuit 12 respectively.
  • first sensing unit 1121 and the second sensing unit 1131 are respectively located on both sides of the substrate 111, the side where the first sensing unit 1121 is located may be the side facing the human body, and the side where the second sensing unit 1131 is located may be It is the side facing away from the human body.
  • the position of the first sensing unit 1121 on the first surface of the substrate 111 is the same as the position of the second sensing unit 1131 on the second surface of the substrate 111.
  • the first sensing unit 1121 covers the second sensing unit 1131 It means that when looking from the side where the first sensing unit 1121 of the substrate 111 is located to the side where the second sensing unit 1131 is located, the second sensing unit 1131 is hidden under the first sensing unit 1121. 1121 covers the second sensing unit 1131.
  • the substrate 111 may be PCB (English: Printed Circuit Board) or FPC (English: Flexible Printed Circuit), and the first sensing unit 1121 and the second sensing unit 1131 may be etched on the PCB or
  • the copper foil pattern on the FPC, PCB or FPC can be at least two layers. When the PCB or FPC is greater than two layers, select two of the etching patterns, and the remaining layers can be used for wiring or other purposes.
  • the capacitance detection device 10 provided by the embodiment of the present application can detect whether a detection object approaches.
  • the capacitance of the first sensing unit 1121 is affected by the detection object.
  • the capacitance value of a sensing unit 1121 to ground includes the base capacitance of the first sensing unit 1121, the temperature drift of the base capacitance of the first sensing unit 1121 caused by temperature, and the sensing capacitance caused by the detection object.
  • the second sensing unit 1131 is far away from the detection object. Therefore, the sensing capacitor is not included.
  • the capacitance value of the second sensing unit 1131 to ground includes the base capacitance of the second sensing unit 1131 and the temperature drift of the base capacitance of the second sensing unit 1131 caused by the temperature.
  • the first sensing unit 1121 is used to ground
  • the capacitance value of the second sensing unit 1131 to the ground can be subtracted to obtain the size of the sensing capacitor.
  • the capacitance of the first sensing unit 1121 affected by the detection object changes, it transmits the first detection electrical signal to the differential detection circuit 13, and the second sensing unit 1131 also transmits the second detection electrical signal to the differential detection circuit 13.
  • the detection circuit 13 can detect the current or voltage of the two detection electrical signals, and calculate the capacitance value according to the current value or the voltage value.
  • the detection electrical signal is used to indicate that the electrical signal is used to detect the capacitance of the first sensing unit 1121 and the second sensing unit 1131, and the first and second are used to distinguish two different electrical signals, and do not have any limiting effect.
  • the detection object includes an object that can cause the capacitance of the first sensing unit 1121 to change.
  • the detection object may be a human body.
  • the first sensing unit 1121 includes a first pattern
  • the second sensing unit 1131 includes a second pattern
  • the first pattern and the second pattern have the same shape
  • first pattern and the second pattern means that the first pattern and the second pattern are viewed from the side where the first sensing unit 1121 of the substrate 111 is located to the side where the second sensing unit 1131 is located.
  • the two patterns overlap, or the second pattern is hidden under the first pattern and covered by the first pattern.
  • the first pattern and the second pattern are both grid patterns, the grid size of the first pattern and the second pattern are the same, or the grid of the second pattern is larger than that of the first pattern.
  • the patterned grid is sparse.
  • the first sensing unit 1121 and the second sensing unit 1131 are both copper foil layers.
  • the first sensing unit 1121 and the second sensing unit 1131 may be a copper foil layer etched on the substrate 111, and the connecting circuit 12 may also be a copper foil layer etched on the substrate 111.
  • FIG. 2 is a schematic diagram of the position of a connection circuit 12 provided by an application embodiment.
  • the connection circuit 12 is disposed on one or both sides of the substrate 111.
  • the side of the substrate 111 where the first sensing layer 112 is located is the first side
  • the side of the substrate 111 where the second sensing layer 113 is located is the second side
  • the connecting circuit 12 connects the first sensing unit 1121 and The branch of the differential detection circuit 13 is used as the first branch
  • the branch of the connecting circuit 12 that connects the second sensing unit 1131 and the differential detection circuit 13 is used as the second branch; in FIG. 2, the connecting circuit 12 is set on the substrate
  • the first side of 111 is taken as an example, which does not mean that the application is limited to this.
  • the connecting circuit 12 can be arranged on the first surface of the substrate 111; at this time, the first branch and the second branch are both located on the first surface of the substrate 111, and the first branch can be directly connected to the first sensing unit 1121, The second branch may pass through the substrate 111 and be connected to the second sensing unit 1131.
  • the connecting circuit 12 is arranged on the second surface of the substrate 111; at this time, the first branch and the second branch are both located on the second surface of the substrate 111, and the second branch can be directly connected to the second sensing unit 1131, The first branch can pass through the base material 111 and be connected to the first sensing unit 1121;
  • connection circuit 12 is provided on the first surface of the substrate 111 and a part is provided on the second surface of the substrate 111.
  • first branch can be arranged on the first surface of the substrate 111 and the second branch can be arranged on the second surface of the substrate 111.
  • a first ground pattern is provided on the first sensing layer 112, and/or a second ground pattern is provided on the second sensing layer 113.
  • the first ground pattern and the second ground pattern are used to shield interference.
  • the second ground pattern provided on the second sensing layer 113 in FIG. 2 is taken as an example, which does not mean that the application is limited to this.
  • the connection circuit 12 includes a connector 121, and the connector 121 includes a first connection point 1211, a second connection point 1212, and a ground point 1213; the first sensing unit 1121 and the second The sensing unit 1131 is electrically connected to the differential detection circuit 13 through the first connection point 1211 and the second connection point 1212 respectively; the first ground pattern is electrically connected to the ground point 1213, and/or the second ground pattern is electrically connected to the ground point 1213.
  • the connector 121 is only the part of the connection circuit 12 that is connected to the differential detection circuit 13. It can be an independent device, or just an area that contains the connection point of the connection circuit 12.
  • the connection point can be a solder joint. There is no restriction on the specific form.
  • FIG. 3a is a schematic structural diagram of a first sensing layer 112 provided by an embodiment of the present application
  • FIG. 3b is a schematic diagram of a second sensing layer 113 provided by an embodiment of the present application. Structure diagram.
  • the first sensing layer 112 further includes a first protection element 1122
  • the second sensing layer 113 further includes a second protection element 1132, a first protection element 1122 and a second protection element 1132 All are conductive media;
  • the first protection element 1122 is not in contact with the first sensing unit 1121, and the second protection element 1132 is not in contact with the second sensing unit 1131.
  • the first protective element 1122 is disposed on the first sensing layer 112 to surround the first sensing unit 1121
  • the second protective element 1132 is disposed on the second sensing layer 113 to surround the second sensing unit 1131.
  • the first protection element 1122 and the second protection element 1132 are located relative to each other, have the same size, and have the same shape.
  • the first protection element 1122 and the second protection element 1132 are used to prevent the first sensing unit 1121 and the second sensing unit 1131 from contacting with water.
  • FIG. 4 is a schematic cross-sectional view of a capacitance detection device 10 provided by an embodiment of the present application.
  • the capacitance detection device 10 further includes a cover plate 14
  • the board 14 is fixed on the first sensing layer 112 by glue.
  • FIG. 5 is a schematic cross-sectional view of a capacitance detection device 10 provided by an embodiment of the present application.
  • the cross-section of the substrate 111 is spiral, and The first sensing layer 112 and the second sensing layer 113 on the substrate 111 are ring-shaped.
  • the capacitance detection device 10 further includes a third protection element 15, and the cross sections of the first sensing layer 112, the second sensing layer 113, and the third protection element 15 are ring-shaped.
  • the third protection element 15 is fixed inside the second sensing layer 113.
  • the capacitance detection device 10 further includes a ground layer 16; the cross section of the substrate 111 is spiral, and the inner part of the substrate 111 is located between the third protective element 15 and the ground layer. Between 16, the outer part of the substrate 111 is located between the first sensing layer 112 and the second sensing layer 113.
  • FIG. 6 is a schematic structural diagram of a capacitance detection device 10 provided by an embodiment of the present application.
  • the capacitance detection device 10 further includes an excitation circuit 17;
  • the first induction unit 1121 and the second induction unit 1131 are respectively electrically connected to the excitation circuit 17, and the excitation circuit 17 is used to transmit electrical signals to the first induction unit 1121 and the second induction unit 1131.
  • the excitation circuit 17 provides electrical signals for excitation to the first induction unit 1121 and the second induction unit 1131, and charges the first induction unit 1121 and the second induction unit 1131 so that the first induction unit 1121 and the second induction unit 1131 are
  • the differential detection circuit 13 transmits the detection electric signal.
  • FIG. 7 is a schematic structural diagram of a capacitance detection device 10 provided by an embodiment of the present application.
  • the capacitance detection device 10 further includes a control logic circuit 18 and Switch module 19;
  • the first sensing unit 1121 and the second sensing unit 1131 are respectively electrically connected to the switch module 19, and the switch module 19 is respectively electrically connected to the excitation circuit 17 and the differential detection circuit 13;
  • the control logic circuit 18 is electrically connected to the switch module 19, and the control logic circuit 18 controls the switch module 19 to be connected or disconnected.
  • the first sensing unit 1121 and the second sensing unit 1131 can be controlled to be connected or disconnected from the excitation circuit 17, and the first sensing unit 1121 and the second sensing unit can also be controlled. 1131 is connected or disconnected from the differential detection circuit 13. In one implementation, the first sensing unit 1121 and the second sensing unit 1131 can only communicate with the excitation circuit 17 or, or the differential detection circuit 13, and cannot communicate with the excitation circuit 17 and the differential detection circuit 13 at the same time.
  • the excitation circuit 17 provides the first sensing unit 1121 and the second sensing unit 1131 with electrical signals for excitation;
  • the two sensing units 1131 are connected to the differential detection circuit 13
  • the first sensing unit 1121 transmits the first detection electrical signal to the differential detection circuit 13
  • the second sensing unit 1131 transmits the second detection electrical signal to the differential detection circuit 13.
  • the first sensing unit 1121 and the second sensing unit 1131 can be copper foil layers, the first sensing unit 1121 can form a capacitor to the ground, and the second sensing unit 1131 can form a capacitor to the ground.
  • the induction module 11 When the induction module 11 is connected with the excitation circuit 17, the excitation circuit 17 charges the capacitor, and then the excitation circuit 17 and the induction module 11 are disconnected, and the induction module 11 and the differential detection circuit 13 are connected. At this time, the capacitor transfers the charge to the differential detection circuit 13. In this way, the differential detection circuit 13 detects the capacitance change of the sensing module 11.
  • the control logic circuit 18 can control the switch module 19 in multiple implementation manners. Here, three specific implementation manners are listed. Of course, this is only an exemplary description, which does not mean that the application is limited to this.
  • FIG. 8 is a schematic structural diagram of a capacitance detection device 10 provided by an embodiment of the present application, and the switch module 19 includes a first switch 191 and a second switch 192;
  • the first switch 191 is connected between the first sensing unit 1121 and the differential detection circuit 13.
  • the control logic circuit 18 controls the first sensing unit 1121 to communicate with the excitation circuit 17 through the first switch 191, or controls the first sensing unit 1121 to communicate with the differential detection circuit.
  • Circuit 13 is connected;
  • the second switch 192 is connected between the second sensing unit 1131 and the differential detection circuit 13.
  • the control logic circuit 18 controls the second sensing unit 1131 to communicate with the excitation circuit 17 through the second switch 192, or controls the second sensing unit 1131 to communicate with the differential detection circuit.
  • the circuit 13 is connected.
  • the control logic circuit 18 can control the first switch 191 and the second switch 192 in advance, and the control logic circuit 18 can periodically control the first switch 191 and the second switch 192.
  • the first switch 191 and the second switch 192 can be one switch, or a combination of several switches can achieve the same effect.
  • the first switch 191 may be a switch for switching a circuit, connecting the first sensing unit 1121 and the excitation circuit 17, or connecting the first sensing unit 1121 and the differential detection circuit 13;
  • the first switch 191 may include two sub-switches. One sub-switch controls the connection or disconnection between the first sensing unit 1121 and the excitation circuit 17, and the other sub-switch controls the connection or disconnection between the first sensing unit 1121 and the differential detection circuit 13. Connected or disconnected.
  • FIG. 9 is a schematic structural diagram of a differential detection circuit 13 provided by an embodiment of the present application.
  • the differential detection circuit 13 includes a first operational amplifier 131, a first An analog-to-digital converter (ADC) 132, a first capacitor 133 and a second capacitor 134;
  • ADC An analog-to-digital converter
  • the positive input terminal of the first operational amplifier 131 is electrically connected to the first switch 191, and the negative input terminal of the first operational amplifier 131 is electrically connected to the second switch 192;
  • the first capacitor 133 is connected between the positive input terminal of the first operational amplifier 131 and the output terminal of the first operational amplifier 131, and the second capacitor 134 is connected between the negative input terminal of the first operational amplifier 131 and the output terminal of the first operational amplifier 131. Between the terminals, the output terminal of the first operational amplifier 131 is electrically connected to the first analog-to-digital converter 132.
  • the differential detection circuit 13 shown in FIG. 9 is a true differential detection circuit 13.
  • the first operational amplifier 131 receives the first detection electrical signal transmitted by the first sensing unit 1121 through the positive input terminal, and receives the second sensing signal through the negative input terminal.
  • the second detection electrical signal transmitted by the unit 1131, the first operational amplifier 131 calculates the first sensing unit 1121 and the second sensing unit 1121 according to the current value or voltage value of the first detection electrical signal and the current value or voltage value of the second detection electrical signal
  • the capacitance difference between the units 1131 can obtain the value of the sensing capacitance.
  • the capacitance detection device 10 shown in FIG. 8 may be a true differential detection circuit 13.
  • the first switch 191 and the second switch 192 are both connected to the excitation circuit 17 during the capacitor charging phase.
  • the first switch 191 and the second switch 192 code in turn, the first switch 191 is connected to the differential detection circuit 13 and then disconnected once, which is called one coding, that is, the first switch 191 and the second switch 192 are connected to or disconnected from the differential detection circuit 13 in turn;
  • the switch 191 is connected with the differential detection circuit 13, the capacitance formed by the first sensing unit 1121 and the ground transfers charge to the differential detection circuit 13.
  • the differential detection circuit 13 When the second switch 192 is connected with the differential detection circuit 13, the capacitance formed by the second sensing unit 1131 and the ground The charge is transferred to the differential detection circuit 13, and the differential detection circuit 13 can detect the capacitance change of the first sensing unit 1121 and the second sensing unit 1131 in the sensing module 11 through the charge transferred by the capacitance.
  • FIG. 10 is a schematic structural diagram of a capacitance detection device 10 provided by an embodiment of the present application.
  • the switch module 19 includes a third switch 193, a fourth switch 194, and a fifth switch. 195;
  • the third switch 193 is connected between the first sensing unit 1121 and the first connecting terminal 196, and the control logic circuit 18 controls the first sensing unit 1121 to communicate with the first connecting terminal 196 through the third switch 193, or controls the first sensing unit 1121 Ground
  • the fourth switch 194 is connected between the second sensing unit 1131 and the first connecting terminal 196, and the control logic circuit 18 controls the second sensing unit 1131 to communicate with the first connecting terminal 196 through the third switch 193, or controls the second sensing unit 1131 Ground
  • the fifth switch 195 is connected between the first connection terminal 196 and the differential detection circuit 13.
  • the control logic circuit 18 controls the first connection terminal 196 to communicate with the excitation circuit 17 through the fifth switch 195, or controls the first connection terminal 196 to communicate with the differential detection circuit.
  • the circuit 13 is connected.
  • the third switch 193 can control the connection or disconnection of the first sensing unit 1121 and the differential detection circuit 13
  • the fourth switch 194 can control the second sensing unit 1131 and the differential detection circuit 13 are connected or disconnected
  • the fifth switch 195 connects the first connection terminal 196 with the excitation circuit 17
  • the third switch 193 can control the first sensing unit 1121 and the excitation circuit 17 to be connected or disconnected.
  • the four switches 194 can control the connection or disconnection of the second sensing unit 1131 and the excitation circuit 17.
  • connection end 196 is only used to illustrate the connection relationship between the various components of the circuit, and is not an element in an actual circuit.
  • FIG. 11 is a schematic structural diagram of a differential detection circuit 13 provided by an embodiment of the present application.
  • the differential detection circuit 13 includes a second operational amplifier 135 and a second operational amplifier 135.
  • the positive input terminal of the second operational amplifier 135 is connected to the reference voltage, and the negative input terminal of the second operational amplifier 135 is electrically connected to the fifth switch 195;
  • the third capacitor 137 is connected between the negative input terminal of the second operational amplifier 135 and the output terminal of the second operational amplifier 135, and the output terminal of the second operational amplifier 135 is electrically connected to the second analog-to-digital converter 136.
  • the differential detection circuit 13 shown in FIG. 11 may be the pseudo differential detection circuit 13.
  • the fifth switch 195 connects the first connection terminal 196 with the excitation circuit 17, and the third switch 193 and the fourth switch 194 are both connected to the first The connecting end is connected, that is, the sensing module 11 is connected with the excitation circuit 17.
  • the excitation circuit 17 charges the capacitance of the sensing module 11 (the capacitance of the first sensing unit 1121 to the ground and the capacitance of the second sensing unit 1131 to the ground).
  • the fifth switch 195 connects the first connection terminal 196 with the differential detection circuit 13
  • the third switch 193 switches between the connected or disconnected states with the first connection terminal 196
  • the third switch 193 connects to the first connection terminal.
  • 196 is connected and disconnected once is one coding.
  • the negative input terminal of the second operational amplifier 135 is connected to the first sensing unit 1121 or the second sensing unit 1131 in turn.
  • the second operational amplifier 135 When the negative input terminal of the second operational amplifier 135 is connected to the first sensing unit 1121, the second operational amplifier 135 outputs the difference between the voltage of the first detection electrical signal and the reference voltage, and the negative input terminal of the second operational amplifier 135 is connected to the second When the sensing unit 1131 is connected, the second operational amplifier 135 outputs the difference between the voltage of the second detection electrical signal and the reference voltage, and the difference obtained twice is subtracted to obtain the voltage corresponding to the sensing capacitor.
  • the first sensing unit 1121 is provided on the first sensing layer 112 of the capacitance detecting device 10
  • the second sensing unit 1131 is provided on the second sensing layer 113 of the capacitance detecting device 10.
  • the capacitance of the first sensing unit 1121 is affected by the temperature and the detection object, and the capacitance of the second sensing unit 1131 is only affected by the temperature.
  • the first sensing unit 1121 and the second sensing unit 1131 The capacitance can eliminate the influence of temperature, determine the capacitance change caused by the detection object, and improve the detection accuracy of the capacitance detection device 10.
  • FIG. 12 is a schematic cross-sectional view of an electronic device provided by an embodiment of the present application; the electronic device includes any one of the first to sixth embodiments. Described capacitance detection device 10.
  • the electronic device is an earphone
  • the sensing module 11 of the capacitance detecting device 10 is arranged around the speaker 21 of the earphone.
  • the first sensing layer 112 of the sensing module 11 is disposed on the side close to the user, and the second sensing layer 113 of the sensing module 11 is disposed on the side facing away from the user.
  • the substrate 111 forms a laminated structure by encircling the speaker 21 in two circles.
  • the length of the first sensing unit 1121 in the first sensing layer 112 and the length of the second sensing unit 1131 in the second sensing layer 113 are less than or equal to the circumference of the speaker 21.
  • the length of the first sensing unit 1121 and the second sensing unit 1131 is less than or equal to the circumference of the speaker 21, which can not only reduce the increase in thickness caused by the four-layer structure, but also leak out the SHD of the inner layer for improving waterproofness.
  • the third protection element 15 of the capacitance detection device 10 is located outside the ground layer 16 of the capacitance detection device 10, and the length surrounded by the third protection element 15 and the ground layer 16 is the speaker The circumference of 21.
  • the length of the third protective element 15 and the grounding layer 16 can be the circumference of the speaker 21, the grounding layer 16 can shield the digital interference generated by the speaker 21, and the third protective element 15 can reduce the grounding layer 16 to the first sensing unit 1121 and/or The influence of the second sensing unit 1131.
  • the first sensing unit 1121 and the second sensing unit 1131 form a capacitor.
  • the excitation circuit 17 transfers the capacitance of the sensing module 11 (the capacitance of the first sensing unit 1121 to ground and the second The capacitance of the second sensing unit 1131 to the ground is charged.
  • the first sensing unit 1121 is facing the human body, and the capacitance of the first sensing unit 1121 to the ground changes because it is close to the human body, and it is also affected by temperature changes. , The capacitance changes.
  • the capacitance of the first sensing unit 1121 to ground includes the base capacitance of the first sensing unit 1121, the temperature drift capacitance affected by the temperature, and the sensing capacitance generated by the proximity of the human body; the second sensing unit 1131 Back to the human body, there is no induction capacitance due to the proximity of the human body, but it is affected by the temperature change caused by the proximity of the human body.
  • the capacitance of the second sensing unit 1131 to the ground includes the base of the second sensing unit 1131. Capacitance, temperature drift capacitance affected by temperature.
  • the amount of charge transferred from the capacitance in the sensing module 11 to the differential detection circuit 13 changes, resulting in a change in the output signal of the differential detection circuit 13, and the output generated by the charge transferred by the first sensing unit 1121
  • the voltage includes the voltage change caused by the temperature-drift capacitor and the voltage change caused by the human body induced capacitance.
  • the output voltage generated by the charge transferred by the second sensing unit 1131 includes the voltage change caused by the temperature-drift capacitor.
  • the output obtained by performing the differential operation of the two output voltages The voltage difference is the voltage change caused by the sensing capacitor. This reduces the influence of temperature on sensor detection and improves detection accuracy.
  • the electronic devices in the embodiments of this application exist in various forms, including but not limited to:
  • Mobile communication equipment This type of equipment is characterized by mobile communication functions, and its main goal is to provide voice and data communications.
  • Such terminals include: smart phones (such as iPhone), multimedia phones, functional phones, and low-end phones.
  • Ultra-mobile personal computer equipment This type of equipment belongs to the category of personal computers, has calculation and processing functions, and generally also has mobile Internet features.
  • Such terminals include: PDA, MID and UMPC devices, such as iPad.
  • Portable entertainment equipment This type of equipment can display and play multimedia content.
  • Such devices include: audio, video players (such as iPod), handheld game consoles, e-books, as well as smart toys and portable car navigation devices.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electronic Switches (AREA)
  • Measurement Of Resistance Or Impedance (AREA)

Abstract

一种电容检测装置（10）及电子设备，电容检测装置（10）包括：感应模块（11）、连接电路（12）及用于检测感应模块（11）电容变化的差分检测电路（13）；感应模块（11）包括：基材（111）、分别位于基材（111）两面的第一感应层（112）和第二感应层（113），第一感应层（112）上的第一感应单元（1121）和第二感应层（113）上的第二感应单元（1131）位置相对，且第一感应单元（1121）覆盖第二感应单元（1131）；第一感应单元（1121）和第二感应单元（1131）通过连接电路（12）分别与差分检测电路（13）电连接；在检测对象接近电容检测装置（10）时，第一感应单元（1121）的电容受到温度和检测对象的影响，第二感应单元（1131）的电容只受到温度的影响，通过第一感应单元（1121）和第二感应单元（1131）的电容，就可以消除温度的影响，确定检测对象引起的电容变化，提高电容检测装置（10）检测的准确度。

Description

电容检测装置及电子设备
本申请要求在2019年7月16日提交中国专利局、申请号为201921117878.8、发明名称为“电容检测装置及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及传感器技术领域，尤其涉及一种电容检测装置及电子设备。
背景技术
电子设备的发展越来越快，为了提高用户体验，人机交互的方式更加智能化，例如，触控操作、智能化检测等，都是通过检测人体与设备的接触实现人机交互。在检测人体与设备接触的方案中，电容式传感器因为安装简便、成本低廉，应用更加广泛。
但是，因为电容式传感器在检测人体接触时，因为受到温度的影响，导致电容式传感器检测结果不准确。
发明内容
有鉴于此，本申请实施例所解决的技术问题之一在于提供一种电容检测装置及电子设备，用以克服现有技术中电容式传感器因为受到温度的影响，导致电容式传感器检测结果不准确的缺陷。
本申请实施例提供一种电容检测装置，其包括：感应模块、连接电路及用于检测感应模块电容变化的差分检测电路；
感应模块包括：基材、分别位于基材两面的第一感应层和第二感应层，
第一感应层上的第一感应单元和第二感应层上的第二感应单元位置相对，且第一感应单元覆盖第二感应单元；
第一感应单元和第二感应单元通过连接电路分别与差分检测电路电连接。
可选地，在本申请的一种实施例中，第一感应单元上包括第一图案，第二感应单元上包括第二图案，第一图案和第二图案形状相同。
可选地，在本申请的一种实施例中，第一图案和第二图案均为网格图案， 第一图案和第二图案的网格大小相同，或者第二图案的网格比第一图案的网格稀疏。
可选地，在本申请的一种实施例中，第一感应单元和第二感应单元均为铜箔层。
可选地，在本申请的一种实施例中，连接电路设置于基材的一面或两面。
可选地，在本申请的一种实施例中，第一感应层上设置有第一接地图案，和/或第二感应层上设置有第二接地图案。
可选地，在本申请的一种实施例中，连接电路包括连接器，连接器包括第一连接点、第二连接点和接地点；
第一感应单元和第二感应单元分别通过第一连接点和第二连接点与差分检测电路电连接；
第一接地图案与接地点电连接，和/或第二接地图案与接地点电连接。
可选地，在本申请的一种实施例中，第一感应层还包括第一防护元件，第二感应层还包括第二防护元件，第一防护元件和第二防护元件均为导电介质；
第一防护元件与第一感应单元不接触，第二防护元件与第二感应单元不接触。
可选地，在本申请的一种实施例中，第一防护元件在第一感应层环绕第一感应单元设置，第二防护元件在第二感应层环绕第二感应单元设置。
可选地，在本申请的一种实施例中，第一防护元件和第二防护元件位置相对、大小相同、且形状相同。
可选地，在本申请的一种实施例中，电容检测装置还包括盖板，盖板通过胶材固定在第一感应层上。
可选地，在本申请的一种实施例中，电容检测装置还包括第三防护元件，第一感应层、第二感应层和第三防护元件的横截面呈环状，第三防护元件固定于第二感应层内侧。
可选地，在本申请的一种实施例中，电容检测装置还包括接地层；
基材的横截面呈螺旋状，基材靠内的部分位于第三防护元件与接地层之间，基材靠外的部分位于第一感应层和第二感应层之间。
可选地，在本申请的一种实施例中，电容检测装置还包括激励电路；
第一感应单元和第二感应单元通过连接电路分别与激励电路电连接，激励电路用于向第一感应单元和第二感应单元传输电信号。
可选地，在本申请的一种实施例中，电容检测装置还包括控制逻辑电路 和开关模块；
第一感应单元和第二感应单元通过连接电路分别与开关模块电连接，开关模块分别与激励电路和差分检测电路电连接；
控制逻辑电路与开关模块电连接，控制逻辑电路用于控制开关模块连通或断开。
可选地，在本申请的一种实施例中，开关模块包括第一开关和第二开关；
第一开关连接在第一感应单元与差分检测电路之间，控制逻辑电路通过第一开关控制第一感应单元与激励电路连通，或者控制第一感应单元与差分检测电路连通；
第二开关连接在第二感应单元与差分检测电路之间，控制逻辑电路通过第二开关控制第二感应单元与激励电路连通，或者控制第二感应单元与差分检测电路连通。
可选地，在本申请的一种实施例中，差分检测电路包括第一运算放大器、第一模数转换器、第一电容和第二电容；
第一运算放大器的正输入端与第一开关电连接，第一运算放大器的负输入端与第二开关电连接；
第一电容连接在第一运算放大器的正输入端和第一运算放大器的输出端之间，第二电容连接在第一运算放大器的负输入端和第一运算放大器的输出端之间，第一运算放大器的输出端与第一模数转换器电连接。
可选地，在本申请的一种实施例中，开关模块包括第三开关、第四开关和第五开关；
第三开关连接在第一感应单元与第一连接端之间，控制逻辑电路通过第三开关控制第一感应单元与第一连接端连通，或者控制第一感应单元接地；
第四开关连接在第二感应单元与第一连接端之间，控制逻辑电路通过第三开关控制第二感应单元与第一连接端连通，或者控制第二感应单元接地；
第五开关连接在第一连接端和差分检测电路之间，控制逻辑电路通过第五开关控制第一连接端与激励电路连通，或者控制第一连接端与差分检测电路连通。
可选地，在本申请的一种实施例中，差分检测电路包括第二运算放大器、第二模数转换器和第三电容；
第二运算放大器的正输入端接入参考电压，第二运算放大器的负输入端与第五开关电连接；
第三电容连接在第二运算放大器的负输入端和第二运算放大器的输出端之间，第二运算放大器的输出端与第二模数转换器电连接。
本申请实施例提供一种电子设备，电子设备包括如本申请任一实施例所描述的电容检测装置。
可选地，在本申请的一种实施例中，电子设备为耳机，电容检测装置的感应模块环绕设置在耳机的扬声器上。
感应模块的第一感应层设置于靠近用户的一侧，感应模块的第二感应层设置于背对用户的一侧。
可选地，在本申请的一种实施例中，基材通过在扬声器上环绕两圈形成叠层结构。
可选地，在本申请的一种实施例中，第一感应层中第一感应单元的长度和第二感应层中第二感应单元的长度小于或等于扬声器的周长。
可选地，在本申请的一种实施例中，电容检测装置的第三防护元件位于电容检测装置的接地层的外侧，第三防护元件和接地层环绕的长度是扬声器的周长。
本申请实施例中，在电容检测装置的第一感应层上设置了第一感应单元，在电容检测装置的第二感应层上设置了第二感应单元，在进行检测时，检测对象接近电容检测装置时，第一感应单元的电容受到温度和检测对象的影响，第二感应单元的电容只受到温度的影响，通过第一感应单元和第二感应单元的电容，就可以消除温度的影响，确定检测对象引起的电容变化，提高了电容检测装置检测的准确度。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本申请实施例的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比值绘制的。附图中：
图1是本申请实施例提供的一种电容检测装置的结构示意图；
图2是申请实施例提供的一种连接电路的位置示意图；
图3a是本申请实施例提供的一种第一感应层的结构示意图；
图3b是本申请实施例提供的一种第一感应层的结构示意图；
图4是本申请实施例提供的一种电容检测装置的截面示意图；
图5是本申请实施例提供的一种差分检测电路的截面示意图；
图6是本申请实施例提供的一种电容检测装置的结构示意图；
图7是本申请实施例提供的一种电容检测装置的结构示意图；
图8是本申请实施例提供的一种电容检测装置的结构示意图；
图9是本申请实施例提供的一种差分检测电路的结构示意图；
图10是本申请实施例提供的一种电容检测装置的结构示意图；
图11是本申请实施例提供的一种差分检测电路的结构示意图；
图12是本申请实施例提供的一种电子设备的截面示意图。
具体实施方式
实施本申请实施例的任一技术方案必不一定需要同时达到以上的所有优点。
下面结合本申请实施例附图进一步说明本申请实施例具体实现。
实施例一、
本申请实施例一提供一种电容检测装置10，如图1所示，图1是本申请实施例提供的一种电容检测装置10的结构示意图，该电容检测装置10包括：
感应模块11、连接电路12及用于检测感应模块11电容变化的差分检测电路13；
感应模块11包括：基材111、分别位于基材111两面的第一感应层112和第二感应层113，
第一感应层112上的第一感应单元1121和第二感应层113上的第二感应单元1131位置相对，且第一感应单元1121覆盖第二感应单元1131；
第一感应单元1121和第二感应单元1131通过连接电路12分别与差分检测电路13电连接。
需要说明的是，第一感应单元1121和第二感应单元1131分别位于基材111两面，第一感应单元1121所在的一侧可以是正对人体的一侧，第二感应单元1131所在的一侧可以是背对人体的一侧，第一感应单元1121在基材111第一面的位置与第二感应单元1131在基材111第二面的位置相同，第一感应单元1121覆盖第二感应单元1131指的是，从基材111的第一感应单元1121所在的一侧看向第二感应单元1131所在的一侧时，第二感应单元1131隐藏在第一感应单元1121之下，第一感应单元1121覆盖所述第二感应单元1131。
基材111可以是PCB(英文：Printed Circuit Board，印制电路板)或FPC(英文：Flexible Printed Circuit，柔性电路板)，第一感应单元1121和第二感 应单元1131可以是刻蚀在PCB或FPC上的铜箔图案，PCB或FPC可以是至少两层，在PCB或FPC大于两层时，选择其中两层刻蚀图案，剩余层可用于走线或者其他用途。
本申请实施例所提供的电容检测装置10可以检测是否有检测对象靠近，在有检测对象靠近电容检测装置10的第一感应层112时，第一感应单元1121的电容受到检测对象的影响，第一感应单元1121对地的电容值包含第一感应单元1121的基电容、由温度引起的第一感应单元1121的基电容温漂和检测对象引起的感应电容，第二感应单元1131因为远离检测对象，因此不包含感应电容，第二感应单元1131对地的电容值包含第二感应单元1131的基电容、由温度引起的第二感应单元1131的基电容温漂，用第一感应单元1121对地的电容值减去第二感应单元1131对地的电容值就可以得到感应电容的大小。
需要说明的是，第一感应单元1121受检测对象影响电容发生变化时，向差分检测电路13传输第一检测电信号，第二感应单元1131也向差分检测电路13传输第二检测电信号，差分检测电路13可以检测到两个检测电信号的电流大小或电压大小，根据电流值或电压值计算得到电容值，当然，此处只是示例性说明，也可以有其他实现方式，本申请对此不作限制。检测电信号用于表示该电信号用于检测第一感应单元1121和第二感应单元1131的电容大小，第一和第二用于区分两个不同的电信号，不具有任何限制作用。检测对象包括能够引起第一感应单元1121电容变化的物体，例如，检测对象可以是人体。
实施例二、
可选地，在本申请的一种实施例中，第一感应单元1121上包括第一图案，第二感应单元1131上包括第二图案，第一图案和第二图案形状相同。
需要说明的是，第一图案和第二图案形状相同指的是，从基材111的第一感应单元1121所在的一侧看向第二感应单元1131所在的一侧时，第一图案和第二图案重合，或者，第二图案隐藏在第一图案之下被第一图案覆盖。
可选地，在本申请的一种实施例中，第一图案和第二图案均为网格图案，第一图案和第二图案的网格大小相同，或者第二图案的网格比第一图案的网格稀疏。
可选地，在本申请的一种实施例中，第一感应单元1121和第二感应单元1131均为铜箔层。
第一感应单元1121和第二感应单元1131可以是刻蚀在基材111上的铜箔层，连接电路12也可以是刻蚀在基材111上的铜箔层。
实施例三、
如图2所示，图2是申请实施例提供的一种连接电路12的位置示意图，可选地，连接电路12设置于基材111的一面或两面。
例如，将基材111上第一感应层112所在的一面作为第一面，将基材111上第二感应层113所在的一面作为第二面，将连接电路12中连接第一感应单元1121和差分检测电路13的支路作为第一支路，将连接电路12中连接第二感应单元1131和差分检测电路13的支路作为第二支路；图2中，以连接电路12设置在基材111的第一面为例，并不代表本申请局限于此。
连接电路12可以设置在基材111的第一面；此时，第一支路和第二支路都位于基材111的第一面，第一支路可以直接和第一感应单元1121连接，第二支路可以穿过基材111与第二感应单元1131连接。
或者连接电路12设置在基材111的第二面；此时，第一支路和第二支路都位于基材111的第二面，第二支路可以直接和第二感应单元1131连接，第一支路可以穿过基材111与第一感应单元1121连接；
或者，连接电路12一部分设置在基材111的第一面，一部分设置在基材111的第二面。进一步的，可以将第一支路设置在基材111的第一面，将第二支路设置在基材111的第二面。
可选地，在本申请的一种实施例中，第一感应层112上设置有第一接地图案，和/或第二感应层113上设置有第二接地图案。第一接地图案和第二接地图案用于屏蔽干扰。
如图2所示，图2中以第二感应层113上设置有第二接地图案为例，并不代表本申请局限于此。
可选地，在本申请的一种实施例中，连接电路12包括连接器121，连接器121包括第一连接点1211、第二连接点1212和接地点1213；第一感应单元1121和第二感应单元1131分别通过第一连接点1211和第二连接点1212与差分检测电路13电连接；第一接地图案与接地点1213电连接，和/或第二接地图案与接地点1213电连接。连接器121只是连接电路12中与差分检测电路13连接的部分，可以是一个独立器件，也可以只是包含了连接电路12连接点的一个区域，连接点可以是焊点，本申请对连接器121的具体形式不做限制。
实施例四、
可选地，如图3a和图3b所示，图3a是本申请实施例提供的一种第一感应层112的结构示意图，图3b是本申请实施例提供的一种第二感应层113的结 构示意图，在本申请的一种实施例中，第一感应层112还包括第一防护元件1122，第二感应层113还包括第二防护元件1132，第一防护元件1122和第二防护元件1132均为导电介质；
第一防护元件1122与第一感应单元1121不接触，第二防护元件1132与第二感应单元1131不接触。
可选地，在本申请的一种实施例中，第一防护元件1122在第一感应层112环绕第一感应单元1121设置，第二防护元件1132在第二感应层113环绕第二感应单元1131设置。
可选地，在本申请的一种实施例中，第一防护元件1122和第二防护元件1132位置相对、大小相同、形状相同。
第一防护元件1122和第二防护元件1132用于防止第一感应单元1121和第二感应单元1131和水接触。
可选地，如图4所示，图4是本申请实施例提供的一种电容检测装置10的截面示意图，在本申请的一种实施例中，电容检测装置10还包括盖板14，盖板14通过胶材固定在第一感应层112上。
实施例5、
可选地，如图5所示，图5是本申请实施例提供的一种电容检测装置10的截面示意图，在本申请的一种实施例中，基材111的横截面呈螺旋状，设置在基材111上的第一感应层112和第二感应层113呈环状。
可选地，在本申请的一种实施例中，电容检测装置10还包括第三防护元件15，第一感应层112、第二感应层113和第三防护元件15的横截面呈环状，第三防护元件15固定于第二感应层113内侧。
可选地，在本申请的一种实施例中，电容检测装置10还包括接地层16；基材111的横截面呈螺旋状，基材111靠内的部分位于第三防护元件15与接地层16之间，基材111靠外的部分位于第一感应层112和第二感应层113之间。
实施例六、
可选地，如图6所示，图6是本申请实施例提供的一种电容检测装置10的结构示意图，在本申请的一种实施例中，电容检测装置10还包括激励电路17；
第一感应单元1121和第二感应单元1131分别与激励电路17电连接，激励电路17用于向第一感应单元1121和第二感应单元1131传输电信号。
激励电路17向第一感应单元1121和第二感应单元1131提供用于激励的 电信号，向第一感应单元1121和第二感应单元1131充电，以便第一感应单元1121和第二感应单元1131向差分检测电路13传输检测电信号。
实施例七、
可选地，如图7所示，图7是本申请实施例提供的一种电容检测装置10的结构示意图，在本申请的一种实施例中，电容检测装置10还包括控制逻辑电路18和开关模块19；
第一感应单元1121和第二感应单元1131分别与开关模块19电连接，开关模块19分别与激励电路17和差分检测电路13电连接；
控制逻辑电路18与开关模块19电连接，控制逻辑电路18控制开关模块19连通或断开。
需要说明的是，通过控制开关模块19连通或断开，可以控制第一感应单元1121和第二感应单元1131与激励电路17连通或断开，还可以控制第一感应单元1121和第二感应单元1131与差分检测电路13连通或断开。在一种实现方式中，第一感应单元1121和第二感应单元1131只能与激励电路17连通或者，或者与差分检测电路13连通，不能同时与激励电路17和差分检测电路13连通。在第一感应单元1121和第二感应单元1131与激励电路17连通时，激励电路17向第一感应单元1121和第二感应单元1131提供用于激励的电信号；在第一感应单元1121和第二感应单元1131与差分检测电路13连通时，第一感应单元1121向差分检测电路13传输第一检测电信号，第二感应单元1131向差分检测电路13传输第二检测电信号。
在一种具体的应用场景中，第一感应单元1121和第二感应单元1131可以是铜箔层，第一感应单元1121对地可以形成一个电容，第二感应单元1131对地可以形成一个电容，在感应模块11与激励电路17连通时，激励电路17向电容充电，然后激励电路17和感应模块11断开，感应模块11和差分检测电路13连通，此时，电容向差分检测电路13转移电荷，差分检测电路13以此检测感应模块11的电容变化。
控制逻辑电路18对开关模块19进行控制可以有多种实现方式，此处，列举三种具体的实现方式，当然，此处只是示例性说明，并不代表本申请局限于此。
在第一种实现方式中，如图8所示，图8是本申请实施例提供的一种电容检测装置10的结构示意图，开关模块19包括第一开关191和第二开关192；
第一开关191连接在第一感应单元1121与差分检测电路13之间，控制 逻辑电路18通过第一开关191控制第一感应单元1121与激励电路17连通，或者控制第一感应单元1121与差分检测电路13连通；
第二开关192连接在第二感应单元1131与差分检测电路13之间，控制逻辑电路18通过第二开关192控制第二感应单元1131与激励电路17连通，或者控制第二感应单元1131与差分检测电路13连通。
控制逻辑电路18对第一开关191和第二开关192的控制可以是预先设定好的，控制逻辑电路18可以周期性控制第一开关191和第二开关192。当然，第一开关191和第二开关192可以是一个开关，或者由几个开关组合实现相同的效果。例如，以第一开关191为例，第一开关191可以是一个用于切换电路的开关，将第一感应单元1121和激励电路17连通，或者将第一感应单元1121和差分检测电路13连通；又如，第一开关191可以包括两个子开关，一个子开关控制第一感应单元1121和激励电路17之间连通或断开，另一个子开关控制第一感应单元1121和差分检测电路13之间连通或断开。
可选地，结合上述第一种实现方式，如图9所示，图9是本申请实施例提供的一种差分检测电路13的结构示意图，差分检测电路13包括第一运算放大器131、第一模数转换器(ADC)132、第一电容133和第二电容134；
第一运算放大器131的正输入端与第一开关191电连接，第一运算放大器131的负输入端与第二开关192电连接；
第一电容133连接在第一运算放大器131的正输入端和第一运算放大器131的输出端之间，第二电容134连接在第一运算放大器131的负输入端和第一运算放大器131的输出端之间，第一运算放大器131的输出端与第一模数转换器132电连接。
图9所示的差分检测电路13是真差分检测电路13，第一运算放大器131通过正输入端接收到第一感应单元1121传输的第一检测电信号，并且通过负输入端接收到第二感应单元1131传输的第二检测电信号，第一运算放大器131根据第一检测电信号的电流值或电压值，以及第二检测电信号的电流值或电压值计算第一感应单元1121和第二感应单元1131之间的电容差，即可得到感应电容的值。
图8所示的电容检测装置10可以是真差分检测电路13，第一开关191和第二开关192在电容充电阶段，均与激励电路17连通，在检测阶段，第一开关191和第二开关192轮流打码，第一开关191与差分检测电路13连通，然后断开一次，称为一次打码，即第一开关191和第二开关192轮流与差分检测电 路13连通或断开；第一开关191与差分检测电路13连通时，第一感应单元1121与地形成的电容向差分检测电路13转移电荷，第二开关192与差分检测电路13连通时，第二感应单元1131与地形成的电容向差分检测电路13转移电荷，差分检测电路13通过电容转移的电荷就可以检测到感应模块11中第一感应单元1121和第二感应单元1131的电容变化。
在第二种实现方式中，如图10所示，图10是本申请实施例提供的一种电容检测装置10的结构示意图，开关模块19包括第三开关193、第四开关194和第五开关195；
第三开关193连接在第一感应单元1121与第一连接端196之间，控制逻辑电路18通过第三开关193控制第一感应单元1121与第一连接端196连通，或者控制第一感应单元1121接地；
第四开关194连接在第二感应单元1131与第一连接端196之间，控制逻辑电路18通过第三开关193控制第二感应单元1131与第一连接端196连通，或者控制第二感应单元1131接地；
第五开关195连接在第一连接端196和差分检测电路13之间，控制逻辑电路18通过第五开关195控制第一连接端196与激励电路17连通，或者控制第一连接端196与差分检测电路13连通。
在第五开关195将第一连接端196和差分检测电路13连通时，第三开关193可以控制第一感应单元1121和差分检测电路13连通或者断开，第四开关194可以控制第二感应单元1131和差分检测电路13连通或者断开；在第五开关195将第一连接端196和激励电路17连通时，第三开关193可以控制第一感应单元1121和激励电路17连通或者断开，第四开关194可以控制第二感应单元1131和激励电路17连通或者断开。
需要说明的是，第一连接端196只是用于说明电路各个元件之间的连接关系，并不是一个实际电路中的一个元件。
可选地，结合上述第二种实现方式，如图11所示，图11是本申请实施例提供的一种差分检测电路13的结构示意图，差分检测电路13包括第二运算放大器135、第二模数转换器(ADC)136和第三电容137；
第二运算放大器135的正输入端接入参考电压，第二运算放大器135的负输入端与第五开关195电连接；
第三电容137连接在第二运算放大器135的负输入端和第二运算放大器135的输出端之间，第二运算放大器135的输出端与第二模数转换器136电连 接。
图11所示的差分检测电路13可以是伪差分检测电路13，在充电阶段，第五开关195将第一连接端196与激励电路17连通，第三开关193和第四开关194均与第一连接端连通，即感应模块11与激励电路17连通，此时，激励电路17向感应模块11的电容(第一感应单元1121对地的电容和第二感应单元1131对地的电容)充电，在检测阶段，第五开关195将第一连接端196和差分检测电路13连通，第三开关193在与第一连接端196连通或断开的状态之间切换，第三开关193与第一连接端196连通且断开一次就是一次打码，通常情况下，第三开关193打码10次，然后第四开关194打码10次，这样交替打码，当然，也可以是连续打码20次或者更多次，轮流打码。第二运算放大器135的负输入端轮流第一感应单元1121或第二感应单元1131连接。第二运算放大器135的负输入端和第一感应单元1121连接时，第二运算放大器135输出第一检测电信号的电压和参考电压的差值，第二运算放大器135的负输入端和第二感应单元1131连接时，第二运算放大器135输出第二检测电信号的电压和参考电压的差值，将两次得到的差值相减，即可得到感应电容对应的电压。
本申请实施例中，在电容检测装置10的第一感应层112上设置了第一感应单元1121，在电容检测装置10的第二感应层113上设置了第二感应单元1131，在进行检测时，检测对象接近电容检测装置10时，第一感应单元1121的电容受到温度和检测对象的影响，第二感应单元1131的电容只受到温度的影响，通过第一感应单元1121和第二感应单元1131的电容，就可以消除温度的影响，确定检测对象引起的电容变化，提高电容检测装置10检测的准确度。
实施例七、
本申请实施例提供一种电子设备，如图12所示，图12是本申请实施例提供的一种电子设备的截面示意图；电子设备包括如实施例一到实施例六中任意一个实施例所描述的电容检测装置10。
可选地，在本申请的一种实施例中，电子设备为耳机，电容检测装置10的感应模块11环绕设置在耳机的扬声器21上。
感应模块11的第一感应层112设置于靠近用户的一侧，感应模块11的第二感应层113设置于背对用户的一侧。
可选地，在本申请的一种实施例中，基材111通过在扬声器21上环绕两圈形成叠层结构。
可选地，在本申请的一种实施例中，第一感应层112中第一感应单元1121 的长度和第二感应层113中第二感应单元1131的长度小于或等于扬声器21的周长。
第一感应单元1121和第二感应单元1131的长度小于或等于扬声器21的周长，不仅能够减少四层结构引起的厚度增加，还能将内层的SHD漏出来，用于提升防水。
可选地，在本申请的一种实施例中，电容检测装置10的第三防护元件15位于电容检测装置10的接地层16的外侧，第三防护元件15和接地层16环绕的长度是扬声器21的周长。
第三防护元件15和接地层16的长度可以是扬声器21的周长，接地层16可以屏蔽扬声器21产生的数字干扰，第三防护元件15可以降低接地层16对第一感应单元1121和/或第二感应单元1131的影响。
扬声器21外侧环绕的感应模块11中，第一感应单元1121和第二感应单元1131形成一个电容，在充电阶段，激励电路17向感应模块11的电容(第一感应单元1121对地的电容和第二感应单元1131对地的电容)充电，在用户佩戴耳机时，第一感应单元1121因为正对人体，第一感应单元1121对地的电容因为和人体接近电容大小变化，同时受到温度变化的影响，电容大小发生变化，因此，第一感应单元1121对地的电容包含了第一感应单元1121的基电容，受温度影响的温漂电容以及和人体接近产生的感应电容；第二感应单元1131因为背对人体，没有因为人体接近产生感应电容，但受到了人体接近导致的温度变化产生的对电容大小的影响，此时，第二感应单元1131对地的电容包含了第二感应单元1131的基电容，受温度影响的温漂电容。在检测阶段，因为电容大小变化，导致感应模块11中的电容向差分检测电路13转移的电荷量发生变化，导致差分检测电路13的输出信号变化，第一感应单元1121转移的电荷所产生的输出电压包含温漂电容引起的电压变化和人体感应电容引起的电压变化，第二感应单元1131转移的电荷产生的输出电压包含温漂电容引起的电压变化，将两个输出电压进行差分运算得到的输出电压差值即为感应电容所引起的电压变化。这就减小了温度对传感器检测的影响，提高了检测精度。
本申请实施例的电子设备以多种形式存在，包括但不限于：
(1)移动通信设备：这类设备的特点是具备移动通信功能，并且以提供话音、数据通信为主要目标。这类终端包括：智能手机(例如iPhone)、多媒体手机、功能性手机，以及低端手机等。
(2)超移动个人计算机设备：这类设备属于个人计算机的范畴，有计算和 处理功能，一般也具备移动上网特性。这类终端包括：PDA、MID和UMPC设备等，例如iPad。
(3)便携式娱乐设备：这类设备可以显示和播放多媒体内容。该类设备包括：音频、视频播放器(例如iPod)，掌上游戏机，电子书，以及智能玩具和便携式车载导航设备。
(4)其他具有数据交互功能的电子设备。
至此，已经对本主题的特定实施例进行了描述。其它实施例在所附权利要求书的范围内。在一些情况下，在权利要求书中记载的动作可以按照不同的顺序来执行并且仍然可以实现期望的结果。另外，在附图中描绘的过程不一定要求示出的特定顺序或者连续顺序，以实现期望的结果。在某些实施方式中，多任务处理和并行处理可以是有利的。
还需要说明的是，本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例，例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、商品或者设备中还存在另外的相同要素。
以上所述仅为本申请的实施例而已，并不用于限制本申请。对于本领域技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (24)

  1. 一种电容检测装置，包括：感应模块、连接电路及用于检测所述感应模块电容变化的差分检测电路；
    所述感应模块包括：基材、分别位于所述基材两面的第一感应层和第二感应层，
    所述第一感应层上的第一感应单元和所述第二感应层上的第二感应单元位置相对，且所述第一感应单元覆盖所述第二感应单元；
    所述第一感应单元和所述第二感应单元通过所述连接电路分别与所述差分检测电路电连接。
  2. 根据权利要求1所述的电容检测装置，其中，
    所述第一感应单元上包括第一图案，所述第二感应单元上包括第二图案，所述第一图案和所述第二图案形状相同。
  3. 根据权利要求2所述的电容检测装置，其中，
    所述第一图案和所述第二图案均为网格图案，所述第一图案和所述第二图案的网格大小相同，或者所述第二图案的网格比所述第一图案的网格稀疏。
  4. 根据权利要求1-3任一项所述的电容检测装置，其中，
    所述第一感应单元和所述第二感应单元均为铜箔层。
  5. 根据权利要求1所述的电容检测装置，其中，所述连接电路设置于所述基材的一面或两面。
  6. 根据权利要求1所述的电容检测装置，其中，所述第一感应层上设置有第一接地图案，和/或所述第二感应层上设置有第二接地图案。
  7. 根据权利要求6所述的电容检测装置，其中，所述连接电路包括连接器，所述连接器包括第一连接点、第二连接点和接地点；
    所述第一感应单元和所述第二感应单元分别通过所述第一连接点和所述第二连接点与所述差分检测电路电连接；
    所述第一接地图案与所述接地点电连接，和/或所述第二接地图案与所述接地点电连接。
  8. 根据权利要求1-7任一项所述的电容检测装置，其中，所述第一感应层还包括第一防护元件，所述第二感应层还包括第二防护元件，所述第一防护元件和所述第二防护元件均为导电介质；
    所述第一防护元件与所述第一感应单元不接触，所述第二防护元件与所述第二感应单元不接触。
  9. 根据权利要求8所述的电容检测装置，其中，所述第一防护元件在所述 第一感应层环绕所述第一感应单元设置，所述第二防护元件在所述第二感应层环绕所述第二感应单元设置。
  10. 根据权利要求8所述的电容检测装置，其中，所述第一防护元件和所述第二防护元件位置相对、大小相同、且形状相同。
  11. 根据权利要求1-10任一项所述的电容检测装置，其中，所述电容检测装置还包括盖板，所述盖板通过胶材固定在所述第一感应层上。
  12. 根据权利要求1所述的电容检测装置，其中，所述电容检测装置还包括第三防护元件，所述第一感应层、所述第二感应层和所述第三防护元件的横截面呈环状，所述第三防护元件固定于所述第二感应层内侧。
  13. 根据权利要求12所述的电容检测装置，其中，所述电容检测装置还包括接地层；
    所述基材的横截面呈螺旋状，所述基材靠内的部分位于所述第三防护元件与所述接地层之间，所述基材靠外的部分位于所述第一感应层和所述第二感应层之间。
  14. 根据权利要求1所述的电容检测装置，其中，所述电容检测装置还包括激励电路；
    所述第一感应单元和所述第二感应单元通过所述连接电路分别与所述激励电路电连接，所述激励电路用于向所述第一感应单元和所述第二感应单元传输电信号。
  15. 根据权利要求14所述的电容检测装置，其中，所述电容检测装置还包括控制逻辑电路和开关模块；
    所述第一感应单元和所述第二感应单元通过所述连接电路分别与所述开关模块电连接，所述开关模块分别与所述激励电路和所述差分检测电路电连接；
    所述控制逻辑电路与所述开关模块电连接，所述控制逻辑电路用于控制所述开关模块连通或断开。
  16. 根据权利要求15所述的电容检测装置，其中，所述开关模块包括第一开关和第二开关；
    所述第一开关连接在所述第一感应单元与所述差分检测电路之间，所述控制逻辑电路通过所述第一开关控制所述第一感应单元与所述激励电路连通，或者控制所述第一感应单元与所述差分检测电路连通；
    所述第二开关连接在所述第二感应单元与所述差分检测电路之间，所述控制逻辑电路通过所述第二开关控制所述第二感应单元与所述激励电路连通，或 者控制所述第二感应单元与所述差分检测电路连通。
  17. 根据权利要求16所述的电容检测装置，其中，所述差分检测电路包括第一运算放大器、第一模数转换器、第一电容和第二电容；
    所述第一运算放大器的正输入端与所述第一开关电连接，所述第一运算放大器的负输入端与所述第二开关电连接；
    所述第一电容连接在所述第一运算放大器的正输入端和所述第一运算放大器的输出端之间，所述第二电容连接在所述第一运算放大器的负输入端和所述第一运算放大器的输出端之间，所述第一运算放大器的输出端与所述第一模数转换器电连接。
  18. 根据权利要求15所述的电容检测装置，其中，所述开关模块包括第三开关、第四开关和第五开关；
    所述第三开关连接在所述第一感应单元与第一连接端之间，所述控制逻辑电路通过所述第三开关控制所述第一感应单元与所述第一连接端连通，或者控制所述第一感应单元接地；
    所述第四开关连接在所述第二感应单元与第一连接端之间，所述控制逻辑电路通过所述第三开关控制所述第二感应单元与所述第一连接端连通，或者控制所述第二感应单元接地；
    所述第五开关连接在所述第一连接端和所述差分检测电路之间，所述控制逻辑电路通过所述第五开关控制所述第一连接端与所述激励电路连通，或者控制所述第一连接端与所述差分检测电路连通。
  19. 根据权利要求18所述的电容检测装置，其中，所述差分检测电路包括第二运算放大器、第二模数转换器和第三电容；
    所述第二运算放大器的正输入端接入参考电压，所述第二运算放大器的负输入端与所述第五开关电连接；
    所述第三电容连接在所述第二运算放大器的负输入端和所述第二运算放大器的输出端之间，所述第二运算放大器的输出端与所述第二模数转换器电连接。
  20. 一种电子设备，所述电子设备包括如权利要求1-19任一项所述的电容检测装置。
  21. 根据权利要求20所述电子设备，其中，所述电子设备为耳机，所述电容检测装置的感应模块环绕设置在耳机的扬声器上。
    所述感应模块的第一感应层设置于靠近用户的一侧，所述感应模块的第二感应层设置于背对用户的一侧。
  22. 根据权利要求20所述的电子设备，其中，
    所述基材通过在扬声器上环绕两圈形成叠层结构。
  23. 根据权利要求20所述的电子设备，其中，
    所述第一感应层中第一感应单元的长度和所述第二感应层中第二感应单元的长度小于或等于所述扬声器的周长。
  24. 根据权利要求20-23任一项所述的电子设备，其中，
    所述电容检测装置的第三防护元件位于所述电容检测装置的接地层的外侧，所述第三防护元件和所述接地层环绕的长度是所述扬声器的周长。
PCT/CN2019/108636 2019-07-16 2019-09-27 电容检测装置及电子设备 WO2021007955A1 (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP19931508.6A EP3792737B1 (en) 2019-07-16 2019-09-27 Capacitance detection apparatus and electronic device
KR1020207035730A KR102475549B1 (ko) 2019-07-16 2019-09-27 캐패시터 측정장치 및 전자장치
US17/033,258 US11953350B2 (en) 2019-07-16 2020-09-25 Capacitance detection apparatus and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201921117878.8 2019-07-16
CN201921117878.8U CN211348433U (zh) 2019-07-16 2019-07-16 电容检测装置及电子设备

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/033,258 Continuation US11953350B2 (en) 2019-07-16 2020-09-25 Capacitance detection apparatus and electronic device

Publications (1)

Publication Number Publication Date
WO2021007955A1 true WO2021007955A1 (zh) 2021-01-21

Family

ID=72100972

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/108636 WO2021007955A1 (zh) 2019-07-16 2019-09-27 电容检测装置及电子设备

Country Status (5)

Country Link
US (1) US11953350B2 (zh)
EP (1) EP3792737B1 (zh)
KR (1) KR102475549B1 (zh)
CN (1) CN211348433U (zh)
WO (1) WO2021007955A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022155874A1 (zh) * 2021-01-22 2022-07-28 深圳市汇顶科技股份有限公司 检测电路、芯片及相关电子装置
CN112415604B (zh) * 2021-01-22 2021-06-18 深圳市汇顶科技股份有限公司 检测电路、芯片及相关电子装置
CN113038320A (zh) * 2021-02-26 2021-06-25 隔空（上海）智能科技有限公司 一种电容检测方法、装置及一种耳机
CN116047116B (zh) * 2023-03-07 2023-06-23 深圳市优界科技有限公司 一种电容自动化测试线

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101261552A (zh) * 2007-03-09 2008-09-10 洋华光电股份有限公司 复合式触控感应装置
CN101261558A (zh) * 2007-03-08 2008-09-10 洋华光电股份有限公司 触控感应装置
US20100231530A1 (en) * 2009-03-13 2010-09-16 Sentrend Corporation Touch pad for multiple sensing
CN202632259U (zh) * 2011-09-23 2012-12-26 杨锡波 一种电容触摸屏传感器
CN103475352A (zh) * 2013-09-06 2013-12-25 深圳市芯海科技有限公司 电容触摸按键的检测电路
CN104516597A (zh) * 2013-09-30 2015-04-15 升达科技股份有限公司 整合电容触控与电阻触控的装置及其操作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100495901B1 (ko) * 2002-11-21 2005-06-16 에이디반도체(주) 정전용량 스위치
US7116117B2 (en) * 2004-02-16 2006-10-03 Honda Motor Co., Ltd. Capacitive sensor
KR101474897B1 (ko) * 2009-12-28 2014-12-19 쿄세라 코포레이션 입력 장치 및 이것을 구비한 표시 장치
US8941393B2 (en) * 2011-01-14 2015-01-27 Cypress Semiconductor Corporation Detection of a conductive object during an initialization process of a touch-sensing device
DE102011081666A1 (de) * 2011-08-26 2013-02-28 Siemens Aktiengesellschaft Kontaktloser kapazitiver Abstandssensor
TWI599921B (zh) * 2012-09-07 2017-09-21 財團法人工業技術研究院 觸控面板
US9739816B2 (en) * 2013-11-27 2017-08-22 Analog Devices, Inc. Capacitive sensor with differential shield
WO2018176199A1 (zh) * 2017-03-27 2018-10-04 深圳市汇顶科技股份有限公司 压阻式传感器、压力检测装置以及电子设备
KR102397114B1 (ko) * 2017-09-29 2022-05-13 삼성전자주식회사 외부 마이크로폰의 그라운드 단자와 전기적으로 연결될 수 있는 커넥터에 포함된 지정된 핀이 회로 기판의 지정된 그라운드와 전기적으로 연결된 회로 구조를 갖는 전자 장치
DE102018211024A1 (de) * 2017-12-20 2019-06-27 Gerd Reime Verfahren und Sensorvorrichtung zum Erkennen einer Annäherung an zwei kapazitive Sensorelektroden

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101261558A (zh) * 2007-03-08 2008-09-10 洋华光电股份有限公司 触控感应装置
CN101261552A (zh) * 2007-03-09 2008-09-10 洋华光电股份有限公司 复合式触控感应装置
US20100231530A1 (en) * 2009-03-13 2010-09-16 Sentrend Corporation Touch pad for multiple sensing
CN202632259U (zh) * 2011-09-23 2012-12-26 杨锡波 一种电容触摸屏传感器
CN103475352A (zh) * 2013-09-06 2013-12-25 深圳市芯海科技有限公司 电容触摸按键的检测电路
CN104516597A (zh) * 2013-09-30 2015-04-15 升达科技股份有限公司 整合电容触控与电阻触控的装置及其操作方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3792737A4

Also Published As

Publication number Publication date
KR20210010507A (ko) 2021-01-27
US20210018339A1 (en) 2021-01-21
KR102475549B1 (ko) 2022-12-07
EP3792737A4 (en) 2021-09-29
US11953350B2 (en) 2024-04-09
CN211348433U (zh) 2020-08-25
EP3792737A1 (en) 2021-03-17
EP3792737B1 (en) 2023-05-03

Similar Documents

Publication Publication Date Title
WO2021007955A1 (zh) 电容检测装置及电子设备
CN106605193B (zh) 用于手势检测及跟踪的电极布置
RU2530761C2 (ru) Устройство
CN111164557B (zh) 电容检测电路、触控芯片及电子设备
TWI750162B (zh) 位置檢測裝置及位置檢測感測器之控制方法
US8599166B2 (en) Touch sensor controller for driving a touch sensor shield
US20130093696A1 (en) Touch device and manufacturing method thereof
WO2005073834A3 (en) Touch screens
KR20160108477A (ko) 자기 용량 터치 감지 회로
CN106817447A (zh) 一种移动终端
US20210397321A1 (en) Display apparatus and touch control method
CN115485653A (zh) 触摸输入装置
TW201704970A (zh) 觸控感測方法及觸控顯示裝置
US9323399B2 (en) Capacitive touch pad with adjacent touch pad electric field suppression
TWI622906B (zh) 控制裝置
CN208298157U (zh) 一种复合式触控面板和触控装置
CN204808292U (zh) 触控显示装置及压力触控单元
US11206019B2 (en) Capacitance detection circuit, capacitance detection method, touch chip, and electronic device
JP2012243072A (ja) 静電容量型タッチセンサ
CN105430882B (zh) 柔性线路板及移动终端
CN214586836U (zh) 线型触控结构及电子设备
CN106997256B (zh) 金属壳中的嵌入式电容传感器
CN102221924A (zh) 显示屏、电子设备
WO2014090074A1 (zh) 触控装置及其制造方法
US20190094992A1 (en) Rotation Input Device For a Capacitive Sense Cord

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 20207035730

Country of ref document: KR

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2019931508

Country of ref document: EP

Effective date: 20201210

NENP Non-entry into the national phase

Ref country code: DE