WO2021002589A1 - Electronic device including microphone-mounting structure - Google Patents

Electronic device including microphone-mounting structure Download PDF

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Publication number
WO2021002589A1
WO2021002589A1 PCT/KR2020/006566 KR2020006566W WO2021002589A1 WO 2021002589 A1 WO2021002589 A1 WO 2021002589A1 KR 2020006566 W KR2020006566 W KR 2020006566W WO 2021002589 A1 WO2021002589 A1 WO 2021002589A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
microphone
receiving groove
disposed
circuit board
Prior art date
Application number
PCT/KR2020/006566
Other languages
French (fr)
Korean (ko)
Inventor
한브라이언
Original Assignee
삼성전자 주식회사
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Publication of WO2021002589A1 publication Critical patent/WO2021002589A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • G06F1/1605—Multimedia displays, e.g. with integrated or attached speakers, cameras, microphones
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops

Definitions

  • Various embodiments of the present invention relate to a microphone mounting structure of an electronic device.
  • a plurality of electronic components may be mounted on the electronic device.
  • at least one speaker or at least one microphone may be mounted at a loading position of the housing.
  • At least one microphone may be mounted on a housing of the main body or a housing in which the display is disposed. At least one such acoustic component may be disposed around the housing.
  • the acoustic path to the microphone hole must be well sealed, and sound that can enter through other paths other than the microphone hole needs to be blocked.
  • the microphone hole is formed in the edge portion of the front surface of the housing, the sound of the microphone may be difficult to radiate toward the user when the electronic device is folded.
  • Various embodiments of the present disclosure may provide an electronic device including a slim-type microphone mounting structure that is advantageous in reducing a bezel width.
  • Various embodiments of the present invention may provide an electronic device implementing a slim microphone mounting structure by using a microphone module in which a metal case for component protection is removed.
  • Various embodiments of the present disclosure may provide an electronic device including a slim microphone mounting structure that does not require a separate acoustic path sealing structure.
  • a first plate disposed to face in a first direction
  • a second plate disposed to face in a second direction opposite to the first direction
  • the first and second plates And a side member disposed to surround at least a portion of the upper space, coupled to the second plate or integrally formed with the second plate, and including an inner surface facing the inside of the electronic device and an outer surface facing the outside of the electronic device
  • the side member includes at least one through hole
  • a receiving groove connected to the through hole and formed on an inner surface of the side member. It may include a microphone module disposed in the receiving groove.
  • it is effective in reducing a bezel width of an electronic device by reducing a space in which a microphone module is mounted.
  • the assembly process of the silicon rubber constituting the sealing structure in the acoustic path of the microphone module is not required, it is advantageous to reduce manufacturing cost.
  • the width of the electronic device in the horizontal direction (X direction) is reduced in the microphone mounting structure, the width of the bezel of the electronic device may be reduced.
  • FIG. 1 is a perspective view illustrating an electronic device in a folded state according to various embodiments of the present disclosure.
  • FIG. 2 is a perspective view illustrating an electronic device in an unfolded state according to various embodiments of the present disclosure.
  • 3A is a plan view illustrating a second housing of an electronic device according to various embodiments of the present disclosure.
  • 3B is a side view illustrating a second housing of an electronic device according to various embodiments of the present disclosure.
  • FIG. 4 is a perspective view illustrating a receiving groove in which a microphone module is mounted according to various embodiments of the present disclosure.
  • FIG. 5 is a perspective view illustrating a microphone module according to various embodiments of the present disclosure.
  • FIG. 6 is a perspective view illustrating a state in which a microphone module is mounted in an accommodation groove according to various embodiments of the present disclosure.
  • FIG. 7A and 7B are cross-sectional views each showing a microphone mounting structure according to various embodiments of the present disclosure.
  • 1 is a perspective view illustrating an electronic device in a folded state according to various embodiments of the present disclosure.
  • 2 is a perspective view illustrating an electronic device in an unfolded state according to various embodiments of the present disclosure.
  • an electronic device 10 includes, for example, a smartphone, a tablet personal computer, a mobile phone, and Video phone, e-book reader, desktop personal computer (desktop personal computer), laptop personal computer (laptop personal computer), netbook computer, workstation, server, personal digital assistant (PDA) , Portable multimedia player (PMP), MP3 player, mobile medical device, camera, or wearable device (e.g. smart glasses, head-mounted-device (HMD)), electronic clothing , An electronic bracelet, an electronic necklace, an electronic appcessory, an electronic tattoo, a smart mirror, or a smart watch).
  • PDA personal digital assistant
  • PMP Portable multimedia player
  • MP3 player Portable multimedia player
  • mobile medical device e.g. smart glasses, head-mounted-device (HMD)
  • HMD head-mounted-device
  • the electronic device 10 will be described using a notebook as an example.
  • the electronic device 10 may include a first housing 11, a second housing 12, and a hinge device 13.
  • the second housing 12 is rotatably connected by a hinge device 13 so that it can be folded or unfolded on the first housing 11.
  • the first and second housings 11 and 12 may be made of a metal material, but are not limited thereto.
  • the first housing 11 is a data input device, a plurality of keys 111 and a touch pad 112, a plurality of ports 113, a printed circuit board not shown, and a battery. It may include.
  • the second housing 12 is a data output device, and a display module 30 and at least one acoustic component, such as a microphone module, may be disposed.
  • 3A is a plan view illustrating a second housing of an electronic device according to various embodiments of the present disclosure.
  • 3B is a side view illustrating a second housing of an electronic device according to various embodiments of the present disclosure.
  • a microphone mounting structure included in an electronic device may be related to a display area.
  • the microphone mounting structure according to the present invention is disposed at a position where the width of the bezel of the second housing 12 can be reduced, and thus may be positioned on the second housing 12 in which the display module is disposed.
  • the microphone module may be disposed in a position closest to the user and free from obstructions.
  • the microphone module may be disposed in the middle portion p of the side member 123 of the second housing 12.
  • the middle part (p) where such a microphone module is placed is located at a distance from the noise of the fan or HDD disposed in the first housing 11, has less influence from environmental noise, and has less frequency distortion. I can.
  • the second housing 12 is directed in a first plate 121 disposed in a first direction (1) and a second direction (2) opposite to the first direction (1).
  • the second plate 122 is disposed, and the third direction (3) is disposed to surround at least a portion of the space on the first and second plates 121 and 122 and is perpendicular to the first and second directions (1, 2)).
  • It may include a side member 123 that is disposed facing toward.
  • the side members 123 may extend along between the first and second plates 121 and 122.
  • the side member 123 may be made of a metal material or a synthetic resin material.
  • FIG. 4 is a perspective view illustrating a receiving groove in which a microphone module is mounted according to various embodiments of the present disclosure.
  • At least one microphone module may be disposed along the side member 123 of the second housing 12. In consideration of the user's location, at least one microphone module may be disposed at an intermediate point of the side member 123 viewed from the front.
  • the side member 123 may include an inner surface 123a facing the inside of the electronic device 10 and an outer surface 123b facing the outside of the electronic device 10.
  • the side member 123 may have a receiving groove 124 for mounting a microphone module formed on the inner surface 123a.
  • the receiving groove 124 is in a third direction (eg, a third direction (3) shown in FIG. 3B), that is, an electronic device (eg, the electronic device 10 shown in FIGS. 1 and 2). It can be recessed in a direction from inside to outside.
  • the receiving groove 124 is a substantially rectangular parallelepiped shape, but need not be limited to the rectangular parallelepiped shape.
  • the receiving groove 124 may include first and second surfaces 1241 and 1242. According to an embodiment, the receiving groove 124 may have a structure in which the second surface 1242 surrounds the first surface 1241. According to an embodiment, at least one through hole 125 may be formed on the first surface 1241. The receiving groove 124 may be spatially connected to the outside of the electronic device 10 through the through hole 125. For example, the through hole 125 may be a microphone hole.
  • the configuration of the microphone module 20 mounted in the receiving groove 124 will be described with reference to FIG. 5.
  • FIG. 5 is a perspective view illustrating a microphone module according to various embodiments of the present disclosure.
  • the microphone module 20 may include a circuit board 21, a microphone IC 23, and a vibration unit 22.
  • the microphone IC 23 and the vibrating unit 22 may be disposed on the circuit board 21.
  • the circuit board 21 may be made of either rigid or flexible materials.
  • the microphone module 20 includes a side wall 24 to support the inserted state after being inserted into the receiving groove (for example, the receiving groove 124 shown in FIG. 4). can do.
  • the sidewall 24 may protrude in a vertical direction from one surface of the circuit board 21.
  • the sidewall 24 may have a structure surrounding the microphone IC 23 and the vibration unit 22.
  • the sidewall 24 may include a metal material or a synthetic resin material.
  • the sidewall 24 may be directly soldered to a ground portion on the circuit board 21 to shield electromagnetic waves.
  • the vibrating unit 22 may include a diaphragm or a membrane.
  • all or at least a portion of the sidewall 24 may be deleted or omitted.
  • electromagnetic waves may be shielded from the side member (eg, the side member 123 shown in FIG. 4 ).
  • the microphone module 20 may be mounted in the receiving groove 124 by the adhesive material 25.
  • the adhesive material 25 is a double-sided tape, one side is attached to the circuit board 21, the other side may be attached to the inner surface (123a) of the side member (123).
  • the adhesive material 25 need not be limited to a double-sided tape, and may be implemented by applying a bonding solution.
  • a bonding liquid application position and a bonding liquid application liquid may be considered.
  • the bonding solution application position may be determined by using a vision camera, and the bonding solution may be applied to the reference application position so that the application solution of the bonding solution does not overflow from the dispenser.
  • the adhesive material 25 may be disposed on the circuit board 21 in a shape surrounding the sidewall 24. According to an embodiment, when viewed from above the circuit board 21, the adhesive material 25 may have a closed curve shape.
  • FIG. 6 A state in which a microphone module (eg, the microphone module 20 shown in FIG. 5) is mounted in the receiving groove (eg, the receiving groove 124 shown in FIG. 4) is shown in FIG. 6.
  • the microphone module is mounted in the receiving groove of the side member 123 (for example, the receiving groove 124 shown in FIG. 4)
  • only the circuit board 21 is visible, and the remaining components can be inserted into the receiving groove and hidden. .
  • FIG. 7A and 7B are cross-sectional views each showing a microphone mounting structure according to various embodiments of the present disclosure.
  • the microphone module 20 may be fixed after being accommodated in the receiving groove 124 by the adhesive material 25.
  • the adhesive material 25 is attached to the inner surface 123a of the side member 123, so that the inserted microphone module 20 is accommodated. It may be fixed to the groove 124.
  • the adhesive material 25 fixing the microphone module 20 to the receiving groove 124 may be a sealing structure of the microphone module 20.
  • the adhesive material 25 may be disposed between the inner surface 123a of the side member 123 located around the receiving groove 124 and one surface of the circuit board 21.
  • the space provided by the receiving groove 124 by the adhesive material 25 is spatially communicated through the through hole from the external space of the electronic device (eg, the electronic device 10 shown in FIGS. 1 and 2 ), It may be sealed from the inner space of the electronic device 10.
  • the microphone module 20 when the microphone module 20 is mounted in the receiving groove 124, the microphone IC 23 and the vibration unit 22 are accommodated in the receiving groove 124, and the circuit board 21 is the receiving groove It may not be accepted in (124).
  • the microphone IC 23 and the vibrating unit 22 may directly face the first surface 1241.
  • the microphone IC 23 and the vibrating unit 22 may face the through hole 125.
  • the through hole 125 may be located adjacent to either the microphone IC 23 or the vibration unit 22.
  • the microphone module 20 when the microphone module 20 is mounted in the receiving groove 124, it may directly face the first surface 1241 or the through hole 125.
  • the length in the Y direction of the microphone mounting structure becomes smaller than before, so the bezel width may be reduced.
  • the microphone mounting structure is disposed in a structure received in the receiving groove 124, and is disposed in the receiving groove 124 in a state in which the metal can or shield can of the microphone module 20 is removed, By reducing the length of the microphone mounting structure in the Y direction, a slim microphone mounting space can be implemented.
  • the circuit board 21 may be adjacent to the display module 30 and face the side surface 301 of the display module 30.
  • Reference numeral W may refer to a window.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Multimedia (AREA)
  • Telephone Set Structure (AREA)

Abstract

An electronic device according to various embodiments of the present invention may comprise: a housing which comprises a first plate arranged to face a first direction, a second plate arranged to face a second direction opposite to the first direction, and a side member arranged to at least partially surround the space on the first and second plates, coupled to or integrated with the second plate, and comprising an inner surface facing the inside of the electronic device and an outer surface facing the outside of the electronic device, wherein the side member includes at least one through-hole, and a receiving groove connected to the through-hole and formed at the inner surface of the side member; and a microphone module disposed in the receiving groove. Various other embodiments are also possible.

Description

마이크 실장 구조를 포함하는 전자 장치Electronic device including microphone mounting structure
본 발명의 다양한 실시예는 전자 장치의 마이크 실장 구조에 관한 것이다.Various embodiments of the present invention relate to a microphone mounting structure of an electronic device.
전자 장치에는 복수의 전자 부품이 실장될 수 있다. 예컨대, 전자 장치에 실장되는 음향 부품으로서, 적어도 하나 이상의 스피커 또는 적어도 하나 이상의 마이크가 하우징의 적재 적소에 실장될 수 있다. 적어도 하나 이상의 마이크는 본체의 하우징이나 디스플레이가 배치된 하우징에 실장될 수 있다. 이러한 음향 부품은 하우징의 둘레에 적어도 하나 이상 배치될 수 있다. A plurality of electronic components may be mounted on the electronic device. For example, as an acoustic component to be mounted on an electronic device, at least one speaker or at least one microphone may be mounted at a loading position of the housing. At least one microphone may be mounted on a housing of the main body or a housing in which the display is disposed. At least one such acoustic component may be disposed around the housing.
이러한 마이크는 하우징에 실장될 시, 마이크 홀까지의 음향 경로의 실링이 잘되어야 하고, 마이크 홀을 제외한 다른 경로를 통해 들어올 수 있는 음향은 차단해야 할 필요가 있다. When such a microphone is mounted in a housing, the acoustic path to the microphone hole must be well sealed, and sound that can enter through other paths other than the microphone hole needs to be blocked.
한편, 현재의 전자 장치는 디스플레이가 실장되는 하우징의 베젤 폭을 줄여서, 디스플레이 영역을 확장하는 추세에 있다. 하우징의 베젤 폭을 줄이기 위해서는 마이크 성능을 유지하면서, 하우징에 배치되는 마이크 실장 공간을 최소화해야 한다. Meanwhile, current electronic devices tend to expand the display area by reducing the width of the bezel of the housing on which the display is mounted. In order to reduce the width of the bezel of the housing, it is necessary to minimize the microphone mounting space disposed in the housing while maintaining the microphone performance.
하지만, 마이크 홀이 하우징의 전면에서 에지 부분에 형성될 경우, 전자 장치의 폴딩 상태에서는 마이크의 음향이 사용자 방향으로 발산되기 어려운 구조일 수 있다. However, when the microphone hole is formed in the edge portion of the front surface of the housing, the sound of the microphone may be difficult to radiate toward the user when the electronic device is folded.
또한, 마이크 홀이 하우징의 측면을 따라서 형성될 경우, 마이크 모듈의 사이즈와, 마이크 모듈의 음향 경로에 형성되는 실링 구조 및 마이크 모듈의 회로 기판의 배치와 벤딩을 고려하면, 베젤 폭을 줄이기 어려운 구조일 수 있다. In addition, when the microphone hole is formed along the side of the housing, considering the size of the microphone module, the sealing structure formed in the acoustic path of the microphone module, and the arrangement and bending of the circuit board of the microphone module, it is difficult to reduce the bezel width. Can be
본 발명의 다양한 실시예는 베젤 폭을 줄이는데 유리한 슬림형 마이크 실장 구조를 포함하는 전자 장치를 제공할 수 있다.Various embodiments of the present disclosure may provide an electronic device including a slim-type microphone mounting structure that is advantageous in reducing a bezel width.
본 발명의 다양한 실시예는 부품 보호를 위한 금속 재질의 케이스를 삭제한 마이크 모듈을 이용하여 슬림형 마이크 실장 구조를 구현한 전자 장치를 제공할 수 있다.Various embodiments of the present invention may provide an electronic device implementing a slim microphone mounting structure by using a microphone module in which a metal case for component protection is removed.
본 발명의 다양한 실시예는 별도의 음향 경로의 실링 구조가 필요없는 슬림형 마이크 실장 구조를 포함하는 전자 장치를 제공할 수 있다.Various embodiments of the present disclosure may provide an electronic device including a slim microphone mounting structure that does not require a separate acoustic path sealing structure.
본 발명의 다양한 실시예는 전자 장치에 있어서, 제1방향으로 향하게 배치되는 제1플레이트와, 상기 제1방향과 반대방향인 제2방향으로 향하게 배치되는 제2플레이트와, 상기 제1,2플레이트 상의 공간의 적어도 일부를 감싸게 배치되며, 상기 제2플레이트에 결합되거나 상기 제2플레이트와 일체로 형성되고, 상기 전자 장치 내부로 향하는 내면과, 상기 전자 장치 외부로 향하는 외면을 포함하는 측면 부재를 포함하는 하우징으로서, 상기 측면 부재는, 적어도 하나의 관통홀; 및 상기 관통홀과 연결되고 상기 측면 부재 내면에 형성된 수용 홈; 상기 수용 홈에 배치되는 마이크 모듈을 포함할 수 있다.According to various embodiments of the present disclosure, in an electronic device, a first plate disposed to face in a first direction, a second plate disposed to face in a second direction opposite to the first direction, and the first and second plates And a side member disposed to surround at least a portion of the upper space, coupled to the second plate or integrally formed with the second plate, and including an inner surface facing the inside of the electronic device and an outer surface facing the outside of the electronic device A housing, wherein the side member includes at least one through hole; And a receiving groove connected to the through hole and formed on an inner surface of the side member. It may include a microphone module disposed in the receiving groove.
본 발명의 다양한 실시예에 따르면, 마이크 모듈이 실장되는 공간을 줄여서, 전자 장치의 베젤 폭을 줄이는데 효과적이다.According to various embodiments of the present disclosure, it is effective in reducing a bezel width of an electronic device by reducing a space in which a microphone module is mounted.
본 발명의 다양한 실시예에 따르면, 마이크 모듈의 음향 경로에 있는 실링 구조를 구성하는 실리콘 러버의 조립 과정이 필요없어서, 제작원가 절감에 유리하다.According to various embodiments of the present invention, since the assembly process of the silicon rubber constituting the sealing structure in the acoustic path of the microphone module is not required, it is advantageous to reduce manufacturing cost.
본 발명의 다양한 실시예에 따르면, 마이크 실장 구조는 전자 장치 가로 방향(X 방향) 폭이 줄어들게 되어서, 전자 장치의 베젤 폭을 줄일 수 있다.According to various embodiments of the present disclosure, since the width of the electronic device in the horizontal direction (X direction) is reduced in the microphone mounting structure, the width of the bezel of the electronic device may be reduced.
도 1은 본 발명의 다양한 실시예에 따른 폴딩 상태의 전자 장치를 나타내는 사시도이다.1 is a perspective view illustrating an electronic device in a folded state according to various embodiments of the present disclosure.
도 2는 본 발명의 다양한 실시예에 따른 언폴딩 상태의 전자 장치를 나타내는 사시도이다.2 is a perspective view illustrating an electronic device in an unfolded state according to various embodiments of the present disclosure.
도 3a는 본 발명의 다양한 실시예에 따른 전자 장치의 제2하우징을 나타내는 평면도이다.3A is a plan view illustrating a second housing of an electronic device according to various embodiments of the present disclosure.
도 3b는 본 발명의 다양한 실시예에 따른 전자 장치의 제2하우징을 나타내는 측면도이다.3B is a side view illustrating a second housing of an electronic device according to various embodiments of the present disclosure.
도 4는 본 발명의 다양한 실시예에 따른 마이크 모듈이 실장되는 수용홈을 나타내는 사시도이다.4 is a perspective view illustrating a receiving groove in which a microphone module is mounted according to various embodiments of the present disclosure.
도 5는 본 발명의 다양한 실시예에 따른 마이크 모듈을 나타내는 사시도이다.5 is a perspective view illustrating a microphone module according to various embodiments of the present disclosure.
도 6은 본 발명의 다양한 실시예에 따른 마이크 모듈이 수용홈에 실장된 상태를 나타내는 사시도이다.6 is a perspective view illustrating a state in which a microphone module is mounted in an accommodation groove according to various embodiments of the present disclosure.
도 7a, 도 7b는 본 발명의 다양한 실시예에 따른 마이크 실장 구조를 각각 나타내는 단면도이다.7A and 7B are cross-sectional views each showing a microphone mounting structure according to various embodiments of the present disclosure.
이하, 본 개시의 다양한 실시예가 첨부된 도면을 참조하여 기재된다. 그러나, 이는 본 개시를 특정한 실시 형태에 대해 한정하려는 것이 아니며, 본 개시의 실시예의 다양한 변경(modification), 균등물(equivalent), 및/또는 대체물(alternative)을 포함하는 것으로 이해되어야 한다. 도면의 설명과 관련하여, 유사한 구성요소에 대해서는 유사한 참조 부호가 사용될 수 있다.Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. However, this is not intended to limit the present disclosure to a specific embodiment, and it should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present disclosure. In connection with the description of the drawings, similar reference numerals may be used for similar elements.
도 1은 본 발명의 다양한 실시예에 따른 폴딩 상태의 전자 장치를 나타내는 사시도이다. 도 2는 본 발명의 다양한 실시예에 따른 언폴딩 상태의 전자 장치를 나타내는 사시도이다.1 is a perspective view illustrating an electronic device in a folded state according to various embodiments of the present disclosure. 2 is a perspective view illustrating an electronic device in an unfolded state according to various embodiments of the present disclosure.
도 1, 도 2를 참조하면, 본 개시의 다양한 실시예들에 따른 전자 장치(10)는, 예를 들면, 스마트폰(smartphone), 태블릿 PC(tablet personal computer), 이동 전화기(mobile phone), 화상 전화기, 전자북 리더기(e-book reader), 데스크탑 PC(desktop personal computer), 랩탑 PC(laptop personal computer), 넷북 컴퓨터(netbook computer), 워크스테이션(workstation), 서버, PDA(personal digital assistant), PMP(portable multimedia player), MP3 플레이어, 모바일 의료기기, 카메라(camera), 또는 웨어러블 장치(wearable device)(예: 스마트 안경, 머리 착용형 장치(head-mounted-device(HMD)), 전자 의복, 전자 팔찌, 전자 목걸이, 전자 앱세서리(appcessory), 전자 문신, 스마트 미러, 또는 스마트 와치(smart watch))중 적어도 하나를 포함할 수 있다. Referring to FIGS. 1 and 2, an electronic device 10 according to various embodiments of the present disclosure includes, for example, a smartphone, a tablet personal computer, a mobile phone, and Video phone, e-book reader, desktop personal computer (desktop personal computer), laptop personal computer (laptop personal computer), netbook computer, workstation, server, personal digital assistant (PDA) , Portable multimedia player (PMP), MP3 player, mobile medical device, camera, or wearable device (e.g. smart glasses, head-mounted-device (HMD)), electronic clothing , An electronic bracelet, an electronic necklace, an electronic appcessory, an electronic tattoo, a smart mirror, or a smart watch).
한 실시예에 따르면, 전자 장치(10)는 노트북을 예를 들어서 설명하기로 한다. 한 실시예에 따르면, 전자 장치(10)는 제1하우징(11)과, 제2하우징(12)과, 힌지 장치(13)를 포함할 수 있다. 한 실시예에 따르면, 제2하우징(12)은 힌지 장치(13)에 의해 회전가능하게 연결되어서, 제1하우징(11) 상에 폴딩되거나 언폴딩될 수 있다. 예컨대, 제1,2하우징(11,12)은 금속 재질로 구성될 수 있으나, 이에 국한되지 않는다.According to an embodiment, the electronic device 10 will be described using a notebook as an example. According to an embodiment, the electronic device 10 may include a first housing 11, a second housing 12, and a hinge device 13. According to one embodiment, the second housing 12 is rotatably connected by a hinge device 13 so that it can be folded or unfolded on the first housing 11. For example, the first and second housings 11 and 12 may be made of a metal material, but are not limited thereto.
한 실시예에 따르면, 제1하우징(11)은 데이터 입력 장치로서, 복수의 키들(111)과 터치 패드(112)와, 복수의 포트들(113)과, 미도시된 인쇄회로기판과, 배터리를 포함할 수 있다.According to an embodiment, the first housing 11 is a data input device, a plurality of keys 111 and a touch pad 112, a plurality of ports 113, a printed circuit board not shown, and a battery. It may include.
한 실시예에 따르면, 제2하우징(12)은 데이터 출력 장치로서, 디스플레이 모듈(30)과, 적어도 하나 이상의 음향 부품, 예컨대 마이크 모듈이 배치될 수 있다. According to an embodiment, the second housing 12 is a data output device, and a display module 30 and at least one acoustic component, such as a microphone module, may be disposed.
도 3a는 본 발명의 다양한 실시예에 따른 전자 장치의 제2하우징을 나타내는 평면도이다. 도 3b는 본 발명의 다양한 실시예에 따른 전자 장치의 제2하우징을 나타내는 측면도이다.3A is a plan view illustrating a second housing of an electronic device according to various embodiments of the present disclosure. 3B is a side view illustrating a second housing of an electronic device according to various embodiments of the present disclosure.
도 3a, 도 3b에 도시된 바와 같이, 한 실시예에 따르면, 전자 장치(예 ; 도 1, 도 2에 도시된 전자 장치(10))에 포함되는 마이크 실장 구조는 디스플레이 영역과 관련될 수 있다. 예컨대, 본 발명에 따른 마이크 실장 구조는 제2하우징(12)의 베젤 폭을 줄일 수 있는 위치에 배치되어 짐으로서, 디스플레이 모듈이 배치되는 제2하우징(12)에 위치할 수 있다. As shown in FIGS. 3A and 3B, according to an embodiment, a microphone mounting structure included in an electronic device (eg, the electronic device 10 illustrated in FIGS. 1 and 2) may be related to a display area. . For example, the microphone mounting structure according to the present invention is disposed at a position where the width of the bezel of the second housing 12 can be reduced, and thus may be positioned on the second housing 12 in which the display module is disposed.
한 실시예에 따르면, 마이크 모듈은 유저와 가장 가깝고, 방해물이 없는 위치에 배치될 수 있다. 예컨대, 마이크 모듈은 제2하우징(12)의 측면 부재(123)의 중간 부분(p)에 배치될 수 있다. 이러한 마이크 모듈이 배치되는 중간 부분(p)은 제1하우징(11)에 배치된 팬(fan)이나 HDD의 노이즈와 원거리에 있고, 환경 소음의 영향이 적으며, 주파수 왜곡이 적은 것을 고려한 위치일 수 있다.According to an embodiment, the microphone module may be disposed in a position closest to the user and free from obstructions. For example, the microphone module may be disposed in the middle portion p of the side member 123 of the second housing 12. The middle part (p) where such a microphone module is placed is located at a distance from the noise of the fan or HDD disposed in the first housing 11, has less influence from environmental noise, and has less frequency distortion. I can.
이하에서는 디스플레이 모듈(30)을 포함하는 제2하우징(12)에 배치된 마이크 실장 구조에 대해서 설명하기로 한다. Hereinafter, a structure for mounting a microphone disposed on the second housing 12 including the display module 30 will be described.
한 실시예에 따르면, 제2하우징(12)은 제1방향(①)으로 향하게 배치되는 제1플레이트(121)와, 상기 제1방향(①)과 반대방향인 제2방향(②)으로 향하게 배치되는 제2플레이트(122)와, 상기 제1,2플레이트(121,122) 상의 공간의 적어도 일부를 감싸게 배치되며, 상기 제1,2방향(①,②))과 수직인 제3방향(③)으로 향하게 배치되는 측면 부재(123)를 포함할 수 있다. 한 실시예에 따르면, 측면 부재(123)는 제1,2플레이트(121,122) 사이를 따라서 연장될 수 있다. 예컨대, 측면 부재(123)는 금속 재질이나 합성 수지 재질일 수 있다.According to an embodiment, the second housing 12 is directed in a first plate 121 disposed in a first direction (①) and a second direction (②) opposite to the first direction (①). The second plate 122 is disposed, and the third direction (③) is disposed to surround at least a portion of the space on the first and second plates 121 and 122 and is perpendicular to the first and second directions (①, ②)). It may include a side member 123 that is disposed facing toward. According to an embodiment, the side members 123 may extend along between the first and second plates 121 and 122. For example, the side member 123 may be made of a metal material or a synthetic resin material.
도 4는 본 발명의 다양한 실시예에 따른 마이크 모듈이 실장되는 수용홈을 나타내는 사시도이다.4 is a perspective view illustrating a receiving groove in which a microphone module is mounted according to various embodiments of the present disclosure.
도 4를 참조하면, 한 실시예에 따르면, 제2하우징(12)은 측면 부재(123)를 따라서 적어도 하나 이상의 마이크 모듈이 배치될 수 있다. 사용자의 위치를 고려하여, 적어도 하나 이상의 마이크 모듈은 전방에서 보이는 측면 부재(123)의 중간 지점에 배치될 수 있다. Referring to FIG. 4, according to an embodiment, at least one microphone module may be disposed along the side member 123 of the second housing 12. In consideration of the user's location, at least one microphone module may be disposed at an intermediate point of the side member 123 viewed from the front.
한 실시예에 따른 측면 부재(123)는 전자 장치(10) 내부로 향하는 내면(123a)과, 전자 장치(10) 외부로 향하는 외면(123b)을 포함할 수 있다. 한 실시예에 따르면, 측면 부재(123)는 마이크 모듈을 실장하기 위한 수용홈(124)이 내면(123a)에 형성될 수 있다. 한 실시예에 따르면 수용홈(124)은 제3방향(예 ; 도 3b에 도시된 제3방향(③)), 즉 전자 장치(예 ; 도 1, 도 2에 도시된 전자 장치(10)) 내부에서 외부로 향하는 방향으로 리세스될 수 있다. 한 실시예에 따르면, 수용홈(124)은 대략적으로 직육면체 형상이지만, 직육면체 형상으로 제한될 필요는 없다.The side member 123 according to an embodiment may include an inner surface 123a facing the inside of the electronic device 10 and an outer surface 123b facing the outside of the electronic device 10. According to an embodiment, the side member 123 may have a receiving groove 124 for mounting a microphone module formed on the inner surface 123a. According to an embodiment, the receiving groove 124 is in a third direction (eg, a third direction (③) shown in FIG. 3B), that is, an electronic device (eg, the electronic device 10 shown in FIGS. 1 and 2). It can be recessed in a direction from inside to outside. According to one embodiment, the receiving groove 124 is a substantially rectangular parallelepiped shape, but need not be limited to the rectangular parallelepiped shape.
한 실시예에 따르면, 수용홈(124)은 제1,2면(1241,1242)을 포함할 수 있다. 한 실시예에 따르면, 수용홈(124)은 제2면(1242)이 제1면(1241) 둘레를 감싸는 구조일 수 있다. 한 실시예에 따르면, 제1면(1241)은 적어도 하나 이상의 관통홀(125)이 형성될 수 있다. 수용홈(124)은 관통홀(125)에 의해 전자 장치(10) 외부와 공간적으로 연결될 수 있다. 예컨대, 관통홀(125)은 마이크 홀일 수 있다.According to an embodiment, the receiving groove 124 may include first and second surfaces 1241 and 1242. According to an embodiment, the receiving groove 124 may have a structure in which the second surface 1242 surrounds the first surface 1241. According to an embodiment, at least one through hole 125 may be formed on the first surface 1241. The receiving groove 124 may be spatially connected to the outside of the electronic device 10 through the through hole 125. For example, the through hole 125 may be a microphone hole.
이러한 수용홈(124)에 실장되는 마이크 모듈(20)의 구성에 대해서 도 5를 참조하여 설명하기로 한다. The configuration of the microphone module 20 mounted in the receiving groove 124 will be described with reference to FIG. 5.
도 5는 본 발명의 다양한 실시예에 따른 마이크 모듈을 나타내는 사시도이다.5 is a perspective view illustrating a microphone module according to various embodiments of the present disclosure.
도 5를 참조하면, 한 실시예에 따르면, 마이크 모듈(20)은 회로 기판(21)과, 마이크 IC(23)와, 진동부(22)를 포함할 수 있다. 한 실시예에 따르면, 회로 기판(21) 상에 마이크 IC(23)와 진동부(22)가 배치될 수 있다. 예컨대, 회로 기판(21)은 리지드하거나 플렉시블한 재질 중 어느 하나의 재질일 수 있다. Referring to FIG. 5, according to an embodiment, the microphone module 20 may include a circuit board 21, a microphone IC 23, and a vibration unit 22. According to an embodiment, the microphone IC 23 and the vibrating unit 22 may be disposed on the circuit board 21. For example, the circuit board 21 may be made of either rigid or flexible materials.
한 실시예에 따르면, 마이크 모듈(20)은 수용홈(예 ; 도 4에 도시된 수용홈(124))에 삽입된 후, 삽입된 상태를 지지하기 위해서 측벽(24)(side wall)을 포함할 수 있다. 한 실시예에 따르면, 측벽(24)은 회로 기판(21) 일면에서 수직방향으로 돌출될 수 있다. 한 실시예에 따르면, 측벽(24)은 마이크 IC(23)와 진동부(22)를 감싸는 구조일 수 있다. 한 실시예에 따르면, 측벽(24)은 금속 재질 또는 합성 수지 재질을 포함할 수 있다. 한 실시예에 따르면, 측벽(24)은 회로 기판(21)상의 접지 부분과 직접 솔더링되어 전자파를 차폐할 수 있다. 마이크 모듈(20)이 수용홈(124)에 실장된 경우, 마이크 모듈(20)의 실장 상태는 측벽(24)에 의해 지지될 수 있다. 예컨대, 진동부(22)는 진동판 또는 멤브레인(membrane)을 포함할 수 있다.According to an embodiment, the microphone module 20 includes a side wall 24 to support the inserted state after being inserted into the receiving groove (for example, the receiving groove 124 shown in FIG. 4). can do. According to an embodiment, the sidewall 24 may protrude in a vertical direction from one surface of the circuit board 21. According to one embodiment, the sidewall 24 may have a structure surrounding the microphone IC 23 and the vibration unit 22. According to an embodiment, the sidewall 24 may include a metal material or a synthetic resin material. According to an embodiment, the sidewall 24 may be directly soldered to a ground portion on the circuit board 21 to shield electromagnetic waves. When the microphone module 20 is mounted in the receiving groove 124, the mounting state of the microphone module 20 may be supported by the sidewall 24. For example, the vibrating unit 22 may include a diaphragm or a membrane.
한 실시예에 따르면, 측벽(24)은 전체 또는 적어도 일부가 삭제 또는 생략될 수 있다. 측벽(24)의 전체 또는 적어도 일부가 삭제 또는 생략되면 측면 부재(예 ; 도 4에 도시된 측면 부재(123))에서 전자파를 차폐할 수 있다.According to an embodiment, all or at least a portion of the sidewall 24 may be deleted or omitted. When all or at least a portion of the sidewall 24 is deleted or omitted, electromagnetic waves may be shielded from the side member (eg, the side member 123 shown in FIG. 4 ).
한 실시예에 따르면, 마이크 모듈(20)은 접착 물질(25)에 의해 수용홈(124)에 실장될 수 있다. 한 실시예에 따르면, 접착 물질(25)은 양면 테이프로서, 일면은 회로 기판(21)에 부착되고, 타면은 측면 부재(123)의 내면(123a)에 부착될 수 있다. 예컨대 접착 물질(25)은 양면 테이프로 한정될 필요는 없으며, 본딩액을 도포하여 구현할 수도 있다. 한 실시예에 따르면, 접착 물질로서 본딩액을 적용해야 할 경우, 본딩액 도포 위치와, 본딩액 도포액이 고려될 수 있다. 예컨대, 본딩액 도포 위치는 비젼 카메라를 이용하여 기준 도포 위치를 결정할 수 있고, 본딩액의 도포액은 디스펜서로부터 흘러 넘치치 않을 정도의 본딩액이 기준 도포 위치에 도포될 수 있다. According to an embodiment, the microphone module 20 may be mounted in the receiving groove 124 by the adhesive material 25. According to one embodiment, the adhesive material 25 is a double-sided tape, one side is attached to the circuit board 21, the other side may be attached to the inner surface (123a) of the side member (123). For example, the adhesive material 25 need not be limited to a double-sided tape, and may be implemented by applying a bonding solution. According to an embodiment, when a bonding liquid is to be applied as an adhesive material, a bonding liquid application position and a bonding liquid application liquid may be considered. For example, the bonding solution application position may be determined by using a vision camera, and the bonding solution may be applied to the reference application position so that the application solution of the bonding solution does not overflow from the dispenser.
한 실시예에 따르면, 접착 물질(25)은 회로 기판(21) 상에 측벽(24)을 감싸는 형상으로 배치될 수 있다. 한 실시예에 따르면, 회로 기판(21) 일면 위에서 볼 경우, 접착 물질(25)은 폐곡선 형상일 수 있다.According to an embodiment, the adhesive material 25 may be disposed on the circuit board 21 in a shape surrounding the sidewall 24. According to an embodiment, when viewed from above the circuit board 21, the adhesive material 25 may have a closed curve shape.
이러한 수용홈(예 ; 도 4에 도시된 수용홈(124))에 마이크 모듈(예 ; 도 5에 도시된 마이크 모듈(20))이 실장된 상태가 도 6에 도시되었다. 마이크 모듈이 측면 부재(123)의 수용홈(예 ; 도 4에 도시된 수용홈(124))에 실장되면, 회로 기판(21)만이 보여지고, 나머지 구성들은 수용홈에 삽입되어서 숨겨질 수 있다.A state in which a microphone module (eg, the microphone module 20 shown in FIG. 5) is mounted in the receiving groove (eg, the receiving groove 124 shown in FIG. 4) is shown in FIG. 6. When the microphone module is mounted in the receiving groove of the side member 123 (for example, the receiving groove 124 shown in FIG. 4), only the circuit board 21 is visible, and the remaining components can be inserted into the receiving groove and hidden. .
도 7a, 도 7b는 본 발명의 다양한 실시예에 따른 마이크 실장 구조를 각각 나타내는 단면도이다.7A and 7B are cross-sectional views each showing a microphone mounting structure according to various embodiments of the present disclosure.
도 7a, 도 7b를 참조하면, 한 실시예에 따른 마이크 모듈(20)이 접착 물질(25)에 의해 수용홈(124)에 수용된 후에 고정될 수 있다. 한 실시예에 따르면, 마이크 모듈(20)을 수용홈(124)에 삽입되면, 접착 물질(25)이 측면 부재(123)의 내면(123a)에 부착되어서, 삽입된 마이크 모듈(20)은 수용홈(124)에 고정될 수 있다.7A and 7B, the microphone module 20 according to an exemplary embodiment may be fixed after being accommodated in the receiving groove 124 by the adhesive material 25. According to one embodiment, when the microphone module 20 is inserted into the receiving groove 124, the adhesive material 25 is attached to the inner surface 123a of the side member 123, so that the inserted microphone module 20 is accommodated. It may be fixed to the groove 124.
한 실시예에 따르면, 마이크 모듈(20)을 수용홈(124)에 고정시킨 접착 물질(25)은 마이크 모듈(20)의 실링 구조일 수 있다. 한 실시예에 따르면, 접착 물질(25)은 수용홈(124) 둘레에 위치한 측면 부재(123)의 내면(123a)과 회로 기판(21)의 일면 사이에 배치될 수 있다. 접착 물질(25)에 의해 수용홈(124)에 의해 마련된 공간은 전자 장치(예 ; 도 1, 도 2에 도시된 전자 장치(10))의 외부 공간으로부터는 관통홀에 의해 공간적으로 통하지만, 전자 장치(10)의 내부 공간으로부터 실링될 수 있다. According to one embodiment, the adhesive material 25 fixing the microphone module 20 to the receiving groove 124 may be a sealing structure of the microphone module 20. According to an embodiment, the adhesive material 25 may be disposed between the inner surface 123a of the side member 123 located around the receiving groove 124 and one surface of the circuit board 21. The space provided by the receiving groove 124 by the adhesive material 25 is spatially communicated through the through hole from the external space of the electronic device (eg, the electronic device 10 shown in FIGS. 1 and 2 ), It may be sealed from the inner space of the electronic device 10.
한 실시예에 따르면, 마이크 모듈(20)이 수용홈(124)에 실장되면, 마이크 IC(23)와 진동부(22)는 수용홈(124)에 수용되고, 회로 기판(21)은 수용홈(124)에 수용되지 않을 수도 있다. According to one embodiment, when the microphone module 20 is mounted in the receiving groove 124, the microphone IC 23 and the vibration unit 22 are accommodated in the receiving groove 124, and the circuit board 21 is the receiving groove It may not be accepted in (124).
한 실시예에 따르면, 마이크 모듈(20)이 수용홈(124)에 실장되면, 마이크 IC(23)와 진동부(22)는 제1면(1241)과 직접적으로 대면할 수 있다. 한 실시예에 따르면, 마이크 모듈(20)이 수용홈(124)에 실장되면, 마이크 IC(23)와 진동부(22)는 관통홀(125)과 대면할 수 있다. 예컨대, 관통홀(125)은 마이크 IC(23) 또는 진동부(22) 중 어느 하나와 근접하게 위치할 수 있다. 한 실시예에 다르면, 마이크 모듈(20)이 수용홈(124)에 실장되면, 제1면(1241) 또는 관통홀(125)과 직접적으로 대면할 수 있다.According to one embodiment, when the microphone module 20 is mounted in the receiving groove 124, the microphone IC 23 and the vibrating unit 22 may directly face the first surface 1241. According to an embodiment, when the microphone module 20 is mounted in the receiving groove 124, the microphone IC 23 and the vibrating unit 22 may face the through hole 125. For example, the through hole 125 may be located adjacent to either the microphone IC 23 or the vibration unit 22. According to one embodiment, when the microphone module 20 is mounted in the receiving groove 124, it may directly face the first surface 1241 or the through hole 125.
한 실시예에 따르면, 마이크 모듈(20)이 수용홈(124)에 실장되면, 마이크 실장 구조의 Y 방향의 길이가 기존보다 작아지기 때문에, 베젤 폭이 줄어들 수 있다. 한 실시예에 따르면, 마이크 실장 구조는 수용홈(124)에 수용되는 구조로 배치되고, 마이크 모듈(20)의 금속 캔이나 쉴드 캔이 제거된 상태로 수용홈(124)에 배치되어지기 때문에, 마이크 실장 구조의 Y 방향의 길이가 줄어듬으로서, 슬림한 마이크 실장 공간을 구현할 수 있다.According to an embodiment, when the microphone module 20 is mounted in the receiving groove 124, the length in the Y direction of the microphone mounting structure becomes smaller than before, so the bezel width may be reduced. According to one embodiment, since the microphone mounting structure is disposed in a structure received in the receiving groove 124, and is disposed in the receiving groove 124 in a state in which the metal can or shield can of the microphone module 20 is removed, By reducing the length of the microphone mounting structure in the Y direction, a slim microphone mounting space can be implemented.
한 실시예에 따르면, 회로 기판(21)은 디스플레이 모듈(30)과 인접하고, 디스플레이 모듈(30) 측면(301)과 대면할 수 있다. 참조부호 W는 윈도우를 지칭할 수 있다.According to an embodiment, the circuit board 21 may be adjacent to the display module 30 and face the side surface 301 of the display module 30. Reference numeral W may refer to a window.
본 명세서와 도면에 개시된 본 개시의 다양한 실시예들은 본 개시의 기술 내용을 쉽게 설명하고 본 개시의 이해를 돕기 위해 특정 예를 제시한 것일 뿐이며, 본 개시의 범위를 한정하고자 하는 것은 아니다. 따라서 본 개시의 범위는 여기에 개시된 실시 예들 이외에도 본 개시의 기술적 사상을 바탕으로 도출되는 모든 변경 또는 변형된 형태가 본 개시의 범위에 포함되는 것으로 해석되어야 한다.Various embodiments of the present disclosure disclosed in the present specification and drawings are merely provided with specific examples to easily describe the technical content of the present disclosure and to aid understanding of the present disclosure, and are not intended to limit the scope of the disclosure. Therefore, the scope of the present disclosure should be construed that all changes or modified forms derived based on the technical idea of the present disclosure in addition to the embodiments disclosed herein are included in the scope of the present disclosure.

Claims (15)

  1. 전자 장치에 있어서, In the electronic device,
    제1방향으로 향하게 배치되는 제1플레이트와, 상기 제1방향과 반대방향인 제2방향으로 향하게 배치되는 제2플레이트와, 상기 제1,2플레이트 상의 공간의 적어도 일부를 감싸게 배치되며, 상기 제2플레이트에 결합되거나 상기 제2플레이트와 일체로 형성되고, 상기 전자 장치 내부로 향하는 내면과, 상기 전자 장치 외부로 향하는 외면을 포함하는 측면 부재를 포함하는 하우징으로서,A first plate disposed facing a first direction, a second plate disposed facing a second direction opposite to the first direction, and disposed to surround at least a portion of the space on the first and second plates, the first plate A housing including a side member coupled to the two plate or integrally formed with the second plate and including an inner surface facing the inside of the electronic device and an outer surface facing the outside of the electronic device,
    상기 측면 부재는,The side member,
    적어도 하나의 관통홀;At least one through hole;
    상기 관통홀과 연결되고 상기 측면 부재 내면에 형성된 수용 홈; 및A receiving groove connected to the through hole and formed on an inner surface of the side member; And
    상기 수용 홈에 배치되는 마이크 모듈을 포함하는 전자 장치.Electronic device including a microphone module disposed in the receiving groove.
  2. 제1항에 있어서, 상기 마이크 모듈은 상기 제1,2방향과 수직방향으로 향하는 제3방향으로 향하게 배치되는 전자 장치.The electronic device of claim 1, wherein the microphone module faces in a third direction perpendicular to the first and second directions.
  3. 제2항에 있어서, 상기 마이크 모듈은The method of claim 2, wherein the microphone module
    회로 기판;Circuit board;
    상기 회로 기판 상에 배치된 마이크 IC; 및A microphone IC disposed on the circuit board; And
    상기 회로 기판 상에 배치되되, 상기 마이크 IC와 인접한 진동부를 포함하며, It is disposed on the circuit board and includes a vibration unit adjacent to the microphone IC,
    상기 마이크 IC 및 진동부는 상기 수용홈에 노출되게 배치되는 전자 장치.The microphone IC and the vibration unit is an electronic device disposed to be exposed to the receiving groove.
  4. 제3항에 있어서, 상기 마이크 IC 및 상기 진동부는 상기 수용홈에 완전히 수용되고, 상기 회로 기판은 상기 수용홈에 수용되지 않고, 상기 수용홈의 둘레에 있는 상기 측면 부재의 내면에 부착되는 전자 장치.The electronic device of claim 3, wherein the microphone IC and the vibration unit are completely accommodated in the receiving groove, and the circuit board is not accommodated in the receiving groove, and is attached to an inner surface of the side member around the receiving groove. .
  5. 제3항에 있어서, 상기 마이크 모듈은 The method of claim 3, wherein the microphone module
    상기 회로 기판 상에 형성되되, 상기 마이크 IC와 상기 진동부를 감싸며, 상기 마이크 모듈의 실장 상태를 지지하는 측벽을 포함하는 전자 장치.An electronic device formed on the circuit board and including a sidewall surrounding the microphone IC and the vibration unit, and supporting a mounting state of the microphone module.
  6. 제5항에 있어서, 상기 측벽은 금속 재질을 포함하는 전자 장치.The electronic device of claim 5, wherein the sidewall comprises a metal material.
  7. 제5항에 있어서, 상기 회로 기판을 위에서 봤을 경우, 상기 측벽은 폐곡선 형상인 전자 장치.The electronic device according to claim 5, wherein when the circuit board is viewed from above, the sidewall has a closed curve shape.
  8. 제5항에 있어서, 상기 마이크 모듈은 접착 물질에 의해 상기 수용홈에 부착되는 전자 장치.The electronic device of claim 5, wherein the microphone module is attached to the receiving groove by an adhesive material.
  9. 제8항에 있어서, 상기 접착 물질은 상기 수용홈의 둘레에 위치하는 상기 측면 부재 내면과 상기 회로 기판 사이에 위치하고,The method of claim 8, wherein the adhesive material is positioned between the circuit board and the inner surface of the side member positioned around the receiving groove,
    상기 접착 물질은 양면 테이프로서, 상기 수용홈을 상기 전자 장치 내부 공간으로부터 실링시키는 실링 구조인 전자 장치.The adhesive material is a double-sided tape, and has a sealing structure that seals the receiving groove from an inner space of the electronic device.
  10. 제8항에 있어서, 상기 접착 물질은 상기 측벽을 감싸게 배치되는 전자 장치.The electronic device of claim 8, wherein the adhesive material is disposed to surround the sidewall.
  11. 제10항에 있어서, 상기 마이크 IC 및 상기 진동부는 상기 관통홀과 직접적으로 대면하는 전자 장치.The electronic device of claim 10, wherein the microphone IC and the vibration unit directly face the through hole.
  12. 제5항에 있어서, 상기 수용홈은 직육면체 형상으로서, The method of claim 5, wherein the receiving groove has a rectangular parallelepiped shape,
    제1면; 및First side; And
    상기 제1면을 감싸는 복수 개의 제2면을 포함하는 전자 장치.An electronic device including a plurality of second surfaces surrounding the first surface.
  13. 제12항에 있어서, 상기 측벽은 상기 수용홈에 삽입되어 상기 마이크 모듈의 실장 상태를 지지하되, 상기 수용홈의 제2면과 직접적으로 접촉하는 전자 장치.The electronic device of claim 12, wherein the sidewall is inserted into the receiving groove to support the mounting state of the microphone module, and directly contacts the second surface of the receiving groove.
  14. 제12항에 있어서, 상기 마이크 IC 및 상기 진동부는 상기 수용홈의 제1면과 직접적으로 대면하는 전자 장치.The electronic device of claim 12, wherein the microphone IC and the vibration unit directly face the first surface of the receiving groove.
  15. 제3항에 있어서, 상기 하우징은 디스플레이 모듈을 더 포함하고, 상기 디스플레이 모듈 측면은 상기 회로 기판과 직접적으로 대면하는 전자 장치.The electronic device of claim 3, wherein the housing further comprises a display module, and a side surface of the display module directly faces the circuit board.
PCT/KR2020/006566 2019-07-04 2020-05-20 Electronic device including microphone-mounting structure WO2021002589A1 (en)

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KR10-2019-0080758 2019-07-04
KR1020190080758A KR20210004396A (en) 2019-07-04 2019-07-04 Electronic device with microphone mounting structure

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Citations (5)

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JP2006186726A (en) * 2004-12-28 2006-07-13 Kenwood Corp Electronic apparatus
KR20140050912A (en) * 2012-10-22 2014-04-30 삼성전자주식회사 Microphone for electronic device
KR20140089768A (en) * 2013-01-07 2014-07-16 삼성전자주식회사 Electronic device with sensor for detecting external environment
CN108307283A (en) * 2018-03-22 2018-07-20 广东欧珀移动通信有限公司 Microphone, shell and electronic device
KR20180092219A (en) * 2017-02-08 2018-08-17 삼성전자주식회사 the Electronic Device including the Speaker

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186726A (en) * 2004-12-28 2006-07-13 Kenwood Corp Electronic apparatus
KR20140050912A (en) * 2012-10-22 2014-04-30 삼성전자주식회사 Microphone for electronic device
KR20140089768A (en) * 2013-01-07 2014-07-16 삼성전자주식회사 Electronic device with sensor for detecting external environment
KR20180092219A (en) * 2017-02-08 2018-08-17 삼성전자주식회사 the Electronic Device including the Speaker
CN108307283A (en) * 2018-03-22 2018-07-20 广东欧珀移动通信有限公司 Microphone, shell and electronic device

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