WO2021000132A1 - Loudspeaker - Google Patents

Loudspeaker Download PDF

Info

Publication number
WO2021000132A1
WO2021000132A1 PCT/CN2019/094032 CN2019094032W WO2021000132A1 WO 2021000132 A1 WO2021000132 A1 WO 2021000132A1 CN 2019094032 W CN2019094032 W CN 2019094032W WO 2021000132 A1 WO2021000132 A1 WO 2021000132A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover plate
lower cover
sounding
cavity
hole
Prior art date
Application number
PCT/CN2019/094032
Other languages
French (fr)
Chinese (zh)
Inventor
邵益
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/094032 priority Critical patent/WO2021000132A1/en
Priority to CN201921031416.4U priority patent/CN210093523U/en
Publication of WO2021000132A1 publication Critical patent/WO2021000132A1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • This application relates to the field of electro-acoustic conversion, and in particular to an integrated speaker integrated with a lower splint and a back cover.
  • speaker modules are widely used in mobile phones, laptops, etc.
  • Portable electronic equipment The speaker is a playback device with voice function, and the size of the cavity of the speaker module is directly related to the improvement of the acoustic performance of the product.
  • the overflowing glue will flow into and be accommodated in the glue tank provided between the lower cover and the lower splint and extend to the height of 5-10s formed by the upper surface of the lower splint and the lower surface of the lower cover. Space, so the speaker position height will waste 5-10s.
  • the overflowing glue will flow into and be accommodated in the glue tank provided between the lower cover and the lower splint and extend to the height of 5-10s formed by the upper surface of the lower splint and the lower surface of the lower cover. Space, so the speaker position height will waste 5-10s.
  • the purpose of this application is to solve the above-mentioned defects, save height space, increase the height of the component or cavity, and improve performance.
  • the loudspeaker includes an upper cover plate, a lower cover plate enclosing a sounding cavity with the upper cover plate, and a sounding monomer arranged in the sounding cavity.
  • the lower cover plate is provided with a through hole at a position relative to the sounding cavity, and the sounding monomer includes a lower splint arranged in the through hole and completely covering the through hole, and a lower splint assembled on the lower splint , And the lower clamping plate and the lower cover plate are an integral structure.
  • the lower cover plate and the lower splint are integrally formed by an injection molding process.
  • the lower splint includes a first surface facing away from the sound cavity, a second surface disposed opposite to the first surface, and a first surface connecting the first surface and the second surface.
  • the lower cover includes a third surface facing away from the sound cavity, a fourth surface disposed opposite to the third surface, and a second side surface connecting the third surface and the fourth surface, The second side surface encloses the through hole;
  • the lower cover plate further includes a concave portion recessed from the second side surface, and the convex portion is received in the concave portion.
  • first surface is lower than the third surface
  • second surface is lower than the fourth surface
  • the magnetic steel component is glued to the second surface of the lower splint.
  • the lower cover plate and the lower splint have an integrated structure, so that the reserved 5-10s height space can be saved, and the height of the speaker unit can be increased to improve performance.
  • Figure 1 is a perspective view of the speaker provided by the present application.
  • FIG. 2 is an exploded schematic diagram of the structure of the speaker shown in FIG. 1;
  • FIG. 3 is a schematic diagram of the structure of the lower cover and the lower splint of the speaker shown in FIG. 1;
  • Figure 4 is a cross-sectional view of the speaker shown in Figure 1 along the line IV-IV;
  • Fig. 5 is a partial enlarged view of a cross-sectional view of the speaker shown in Fig. 4 taken along line IV-IV.
  • FIG. 1 is a perspective view of the speaker provided by the present application.
  • Fig. 2 is an exploded schematic diagram of the structure of the speaker shown in Fig. 1.
  • Fig. 3 is a partial structural diagram of the speaker shown in Fig. 1.
  • Fig. 4 is an enlarged schematic diagram of a partial structure of the speaker shown in Fig. 3.
  • the loudspeaker 100 includes an upper cover 11 and a lower cover 13 in which the upper cover jointly encloses a sounding cavity 10 and a sounding monomer 15 placed in the sounding cavity 10.
  • the lower cover 13 is provided with a through hole 130 at a position relative to the sounding cavity 15.
  • the vocal unit 15 includes a lower splint 151.
  • the lower clamping plate 151 is disposed in the through hole 130 and completely covers the through hole 130.
  • the lower clamping plate 151 and the lower cover plate 13 are an integral structure.
  • the lower cover plate 13 and the lower clamping plate 151 are integrally formed by an injection molding process.
  • the lower cover 13 and the lower splint 151 have an integrated structure, so that the reserved 5-10s height space can be saved, and the height of the speaker unit can be increased to improve performance.
  • the vocal unit also includes a magnetic steel component 152 assembled on the lower splint 151.
  • the magnetic steel component 152 is glued to the lower splint 151.
  • the magnet assembly 152 includes a main magnet 1521 and an auxiliary magnet 1523.
  • the auxiliary magnet 1523 is 4 magnets surrounding the main magnet 1521, and the voice coil 154 is located between the main magnet 1521 and the auxiliary magnet 1523.
  • the magnetic gap between the magnets 1523 surrounds the main magnet 1521.
  • the main magnet 1521 includes the pole core (not shown) stacked on a side away from the lower clamping plate 151.
  • the secondary pole core includes the secondary pole core (not shown) stacked on a side away from the lower clamping plate 151.
  • the sound unit 15 further includes a voice coil 153, a basin frame 154, an FPC board 155 and a diaphragm 156.
  • One end of the voice coil 153 is located in the magnetic gap (not labeled) of the magnetic steel assembly 152, and the other end is fixed to the basin frame 154.
  • the FPC board 155 is electrically connected to the voice coil 154 and is arranged adjacent to the basin frame 154.
  • the diaphragm 156 is erected between the basin frame 154 and the voice coil 153.
  • the lower splint 151 includes a first surface 1511 on the side facing away from the sound cavity body, and a second surface 1513 opposite to the first surface, connecting the first surface and the A first side surface 1515 of the second surface and a protrusion 1517 provided on the first side surface;
  • the lower cover 13 includes a third surface 131 facing away from the sound cavity, a fourth surface 133 disposed opposite to the third surface, and a second surface connecting the third surface and the fourth surface.
  • the side surface 135 and the concave portion 137 recessed from the second side surface, and the convex portion 1517 is received in the concave portion 117.
  • the first surface 1511 is lower than the third surface 131, and the second surface 1513 is lower than the fourth surface 133.
  • the magnetic steel component 152 is glued to the second surface 1513 of the lower splint.
  • the lower cover 13 and the lower splint 151 have an integrated structure, which saves 5-10 s of space and increases the height of the speaker, thereby improving performance.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

The present application provides a loudspeaker. The loudspeaker comprises: an upper cover plate; a lower cover plate which together with the upper cover plate encloses a sounding cavity; and a sounding unit arranged in the sounding cavity. A through-hole is provided in the lower cover plate at a position corresponding to the sounding cavity; the sounding unit comprises a lower clamp plate arranged in the through-hole and completely covering the through-hole, and a magnetic steel component assembled on the lower clamp plate, and the lower clamp plate and the lower cover plate are an integral structure. In comparison with the related art, the lower cover plate and the lower clamp plate have an integral structure, conserving an amount of space 5-10s high and increasing same to the height of the component or cavity, improving performance.

Description

扬声器speaker 技术领域Technical field
本申请涉及电声转换领域，尤其涉及一种集成下夹板及后盖的集成化扬声器。This application relates to the field of electro-acoustic conversion, and in particular to an integrated speaker integrated with a lower splint and a back cover.
背景技术Background technique
随着科技的快速发展，音频设备的普及率越来越高，在众多的娱乐消遣方式中，高品质的音乐享受慢慢地普及于众，因此，扬声器模组广泛应用于手机、笔记本电脑等便携性电子设备 。扬声器作为语音功能的播放装置 ，扬声器模组的腔体的大小直接关系到产品声学性能的提升 。With the rapid development of science and technology, the penetration rate of audio equipment is getting higher and higher. Among the many entertainment and pastimes, high-quality music enjoyment is slowly popularizing. Therefore, speaker modules are widely used in mobile phones, laptops, etc. Portable electronic equipment. The speaker is a playback device with voice function, and the size of the cavity of the speaker module is directly related to the improvement of the acoustic performance of the product.
相关技术的扬声器结构为防止打胶时胶水爬到下夹板上，而超出外壳的外形高度，所以所述下夹板一般会比所述后盖最高面矮5-10s（1s=0.01mm），过溢的胶水会流入、收容于设置于所述下盖板与所述下夹板之间的胶水槽并延伸至所述下夹板上表面与所述下盖板下表面形成的高度为5-10s的空间，因此扬声器位置高度会浪费5-10s。The speaker structure of the related technology is to prevent the glue from climbing to the lower splint during glueing and exceeding the outer height of the shell. Therefore, the lower splint is generally 5-10s (1s=0.01mm) shorter than the highest surface of the back cover. The overflowing glue will flow into and be accommodated in the glue tank provided between the lower cover and the lower splint and extend to the height of 5-10s formed by the upper surface of the lower splint and the lower surface of the lower cover. Space, so the speaker position height will waste 5-10s.
所以，有必要提供一种新的扬声器解决上述缺陷。Therefore, it is necessary to provide a new speaker to solve the above-mentioned defects.
技术问题technical problem
相关技术的扬声器结构为防止打胶时胶水爬到下夹板上，而超出外壳的外形高度，所以所述下夹板一般会比所述后盖最高面矮5-10s（1s=0.01mm），过溢的胶水会流入、收容于设置于所述下盖板与所述下夹板之间的胶水槽并延伸至所述下夹板上表面与所述下盖板下表面形成的高度为5-10s的空间，因此扬声器位置高度会浪费5-10s。The speaker structure of the related technology is to prevent the glue from climbing to the lower splint during glueing and exceeding the outer height of the shell. Therefore, the lower splint is generally 5-10s (1s=0.01mm) shorter than the highest surface of the back cover. The overflowing glue will flow into and be accommodated in the glue tank provided between the lower cover and the lower splint and extend to the height of 5-10s formed by the upper surface of the lower splint and the lower surface of the lower cover. Space, so the speaker position height will waste 5-10s.
技术解决方案Technical solutions
本申请的目的是解决上述缺陷，节约高度空间，增加到组件或腔体高度上去，提升性能。The purpose of this application is to solve the above-mentioned defects, save height space, increase the height of the component or cavity, and improve performance.
为实现上述目的，本申请提供一种扬声器。所述扬声器包括上盖板、与所述上盖板共同围成发声腔体的下盖板和设置于所述发声腔体内的发声单体。To achieve the above objective, the present application provides a speaker. The loudspeaker includes an upper cover plate, a lower cover plate enclosing a sounding cavity with the upper cover plate, and a sounding monomer arranged in the sounding cavity.
所述下盖板相对所述发声腔体的位置设置有通孔，所述发声单体包括设置于所述通孔内并完全覆盖所述通孔的下夹板和组配于所述下夹板上的磁钢组件，且所述下夹板与所述下盖板为一体结构。 The lower cover plate is provided with a through hole at a position relative to the sounding cavity, and the sounding monomer includes a lower splint arranged in the through hole and completely covering the through hole, and a lower splint assembled on the lower splint , And the lower clamping plate and the lower cover plate are an integral structure.
进一步地，所述下盖板与所述下夹板通过注塑工艺一体成型。Further, the lower cover plate and the lower splint are integrally formed by an injection molding process.
进一步地，所述下夹板包括背向所述发声腔体一侧的第一表面、与所述第一表面相对设置的第二表面、连接所述第一表面和所述第二表面的第一侧表面以及设置于所述第一侧表面上的凸起部；Further, the lower splint includes a first surface facing away from the sound cavity, a second surface disposed opposite to the first surface, and a first surface connecting the first surface and the second surface. A side surface and a protrusion provided on the first side surface;
所述下盖板包括背离所述发声腔体一侧的第三表面、与所述第三表面相对设置的第四表面、连接所述第三表面和所述第四表面的第二侧表面，所述第二侧表面围成所述通孔；The lower cover includes a third surface facing away from the sound cavity, a fourth surface disposed opposite to the third surface, and a second side surface connecting the third surface and the fourth surface, The second side surface encloses the through hole;
所述下盖板还包括自所述第二侧表面凹陷形成的凹陷部，所述凸起部收容于所述凹陷部内。The lower cover plate further includes a concave portion recessed from the second side surface, and the convex portion is received in the concave portion.
进一步地，所述第一表面低于所述第三表面，所述第二表面低于所述第四表面。Further, the first surface is lower than the third surface, and the second surface is lower than the fourth surface.
进一步地，所述磁钢组件胶合于所述下夹板的第二表面。Further, the magnetic steel component is glued to the second surface of the lower splint.
有益效果Beneficial effect
与相关技术相比，所述下盖板与所述下夹板一体结构，这样可以节省预留的5-10s高度空间，增加到扬声器单体高度上去，提升性能。Compared with the related art, the lower cover plate and the lower splint have an integrated structure, so that the reserved 5-10s height space can be saved, and the height of the speaker unit can be increased to improve performance.
附图说明Description of the drawings
为了更清楚地说明本申请中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：In order to explain the technical solutions in this application more clearly, the following will briefly introduce the drawings used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the application. For those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings, among which:
图1是本申请提供的扬声器立体图；Figure 1 is a perspective view of the speaker provided by the present application;
图2是图1所示扬声器的结构分解示意图；FIG. 2 is an exploded schematic diagram of the structure of the speaker shown in FIG. 1;
图3是图1所示扬声器中下盖板和下夹板的结构示意图；FIG. 3 is a schematic diagram of the structure of the lower cover and the lower splint of the speaker shown in FIG. 1;
图4是图1所示扬声器沿IV-IV线的剖视图；Figure 4 is a cross-sectional view of the speaker shown in Figure 1 along the line IV-IV;
图5是图4所示扬声器沿IV-IV线的剖视图局部放大图。Fig. 5 is a partial enlarged view of a cross-sectional view of the speaker shown in Fig. 4 taken along line IV-IV.
本发明的最佳实施方式The best mode of the invention
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of this application.
请同时参阅图1-图4，图1是本申请提供的扬声器立体图。图2是图1所示扬声器的结构分解示意图。图3是图1所示扬声器的局部结构示意图。图4是图3所示扬声器的局部结构放大示意图。Please refer to FIGS. 1 to 4 at the same time. FIG. 1 is a perspective view of the speaker provided by the present application. Fig. 2 is an exploded schematic diagram of the structure of the speaker shown in Fig. 1. Fig. 3 is a partial structural diagram of the speaker shown in Fig. 1. Fig. 4 is an enlarged schematic diagram of a partial structure of the speaker shown in Fig. 3.
所述扬声器100包括上盖板11所述上盖板共同围成发声腔体10的下盖板13和置于所述发声腔体10内的发声单体15。The loudspeaker 100 includes an upper cover 11 and a lower cover 13 in which the upper cover jointly encloses a sounding cavity 10 and a sounding monomer 15 placed in the sounding cavity 10.
所述下盖板13相对所述发声腔体15的位置设置有通孔130。The lower cover 13 is provided with a through hole 130 at a position relative to the sounding cavity 15.
所述发声单体15包括下夹板151。The vocal unit 15 includes a lower splint 151.
所述下夹板151设置于所述通孔130内并完全覆盖所述通孔130。The lower clamping plate 151 is disposed in the through hole 130 and completely covers the through hole 130.
所述下夹板151与所述下盖板13为一体结构。 优选的，所述下盖板13与所述下夹板151通过注塑工艺一体成型。所述下盖板13与所述下夹板151一体结构，这样可以节省预留的5-10s高度空间，增加到扬声器单体高度上去，提升性能。The lower clamping plate 151 and the lower cover plate 13 are an integral structure. Preferably, the lower cover plate 13 and the lower clamping plate 151 are integrally formed by an injection molding process. The lower cover 13 and the lower splint 151 have an integrated structure, so that the reserved 5-10s height space can be saved, and the height of the speaker unit can be increased to improve performance.
所述发声单体还包括组配于所述下夹板151上的磁钢组件152。优选地，所述磁钢组件152胶合在所述下夹板151上。The vocal unit also includes a magnetic steel component 152 assembled on the lower splint 151. Preferably, the magnetic steel component 152 is glued to the lower splint 151.
所述磁钢组件152包括主磁钢1521和副磁钢1523，所述副磁钢1523为4个环绕主磁钢1521的磁体，所述音圈154位于所述主磁钢1521和所述副磁钢1523之间的磁间隙环绕所述主磁钢1521。The magnet assembly 152 includes a main magnet 1521 and an auxiliary magnet 1523. The auxiliary magnet 1523 is 4 magnets surrounding the main magnet 1521, and the voice coil 154 is located between the main magnet 1521 and the auxiliary magnet 1523. The magnetic gap between the magnets 1523 surrounds the main magnet 1521.
所述主磁钢1521包括背离所述下夹板151的一侧叠设所述极芯（未标出）。The main magnet 1521 includes the pole core (not shown) stacked on a side away from the lower clamping plate 151.
所述副极芯包括背离所述下夹板151的一侧叠设所述副极芯（未标出）。 The secondary pole core includes the secondary pole core (not shown) stacked on a side away from the lower clamping plate 151.
所述发声单体15还包括音圈153、盆架154、FPC板155及振膜156。The sound unit 15 further includes a voice coil 153, a basin frame 154, an FPC board 155 and a diaphragm 156.
所述音圈153一端位于所述磁钢组件152的磁间隙（未标号），另一端固设于所述盆架154。One end of the voice coil 153 is located in the magnetic gap (not labeled) of the magnetic steel assembly 152, and the other end is fixed to the basin frame 154.
所述FPC板155与所述音圈154电性连接，并相邻所述盆架154设置。The FPC board 155 is electrically connected to the voice coil 154 and is arranged adjacent to the basin frame 154.
所述振膜156和架设于所述盆架154与所述音圈153之间。The diaphragm 156 is erected between the basin frame 154 and the voice coil 153.
请结合参阅图5，所述下夹板151包括背向所述发声腔体一侧的第一表面1511、与所述第一表面相对设置的第二表面1513、连接所述第一表面和所述第二表面的第一侧表面1515以及设置于所述第一侧表面上的凸起部1517；Please refer to FIG. 5 in combination. The lower splint 151 includes a first surface 1511 on the side facing away from the sound cavity body, and a second surface 1513 opposite to the first surface, connecting the first surface and the A first side surface 1515 of the second surface and a protrusion 1517 provided on the first side surface;
所述下盖板13包括背离所述发声腔体一侧的第三表面131、与所述第三表面相对设置的第四表面133、连接所述第三表面和所述第四表面的第二侧表面135以及自所述第二侧表面凹陷形成的凹陷部137，所述凸起部1517收容于所述凹陷部内117。The lower cover 13 includes a third surface 131 facing away from the sound cavity, a fourth surface 133 disposed opposite to the third surface, and a second surface connecting the third surface and the fourth surface. The side surface 135 and the concave portion 137 recessed from the second side surface, and the convex portion 1517 is received in the concave portion 117.
所述第一表面1511低于所述第三表面131，所述第二表面1513低于所述第四表面133。The first surface 1511 is lower than the third surface 131, and the second surface 1513 is lower than the fourth surface 133.
所述磁钢组件152胶合于所述下夹板的第二表面1513。The magnetic steel component 152 is glued to the second surface 1513 of the lower splint.
与相关技术相比，所述下盖板13与所述下夹板151一体结构，节约了5-10s高的空间增加到扬声器的高度上去，提升了性能。Compared with the related art, the lower cover 13 and the lower splint 151 have an integrated structure, which saves 5-10 s of space and increases the height of the speaker, thereby improving performance.
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。The above are only the implementation manners of this application. It should be pointed out here that for those of ordinary skill in the art, improvements can be made without departing from the creative concept of this application, but these all belong to this application. The scope of protection.
本发明的实施方式Embodiments of the invention
在此处键入本发明的实施方式描述段落。Type here a paragraph describing the embodiment of the present invention.
工业实用性Industrial applicability
在此处键入工业实用性描述段落。Type a paragraph describing industrial applicability here.
序列表自由内容Sequence Listing Free Content
在此处键入序列表自由内容描述段落。Type here the free content description paragraph of the sequence listing.

Claims (10)

  1. 一种扬声器，包括上盖板、与所述上盖板共同围成发声腔体的下盖板和设置于所述发声腔体内的发声单体，其特征在于，所述下盖板相对所述发声腔体的位置设置有通孔(需要标号，在附图中示出)，所述发声单体包括设置于所述通孔内并完全覆盖所述通孔的下夹板和组配于所述下夹板上的磁钢组件，且所述下夹板与所述下盖板为一体结构。A loudspeaker comprising an upper cover plate, a lower cover plate enclosing a sounding cavity with the upper cover plate, and a sounding monomer arranged in the sounding cavity, characterized in that the lower cover plate is opposite to the The sounding cavity is provided with a through hole (number is required, shown in the drawings), and the sounding monomer includes a lower splint that is arranged in the through hole and completely covers the through hole and is assembled in the The magnetic steel component on the lower splint, and the lower splint and the lower cover are an integral structure.
  2. 如权利要求1所述的扬声器，其特征在于：所述下盖板与所述下夹板通过注塑工艺一体成型。The speaker according to claim 1, wherein the lower cover plate and the lower splint are integrally formed by an injection molding process.
  3. 如权利要求2所述的扬声器，其特征在于：所述下夹板包括背向所述发声腔体一侧的第一表面、与所述第一表面相对设置的第二表面、连接所述第一表面和所述第二表面的第一侧表面以及设置于所述第一侧表面上的凸起部；The speaker according to claim 2, wherein the lower splint comprises a first surface facing away from the sound cavity, a second surface disposed opposite to the first surface, and a second surface connected to the first surface. A surface and a first side surface of the second surface and a protrusion provided on the first side surface;
    所述下盖板包括背离所述发声腔体一侧的第三表面、与所述第三表面相对设置的第四表面、连接所述第三表面和所述第四表面的第二侧表面，所述第二侧表面围成所述通孔；The lower cover includes a third surface facing away from the sound cavity, a fourth surface disposed opposite to the third surface, and a second side surface connecting the third surface and the fourth surface, The second side surface encloses the through hole;
    所述下盖板还包括自所述第二侧表面凹陷形成的凹陷部，所述凸起部收容于所述凹陷部内。The lower cover plate further includes a concave portion recessed from the second side surface, and the convex portion is received in the concave portion.
  4. 如权利要求3所述的扬声器，其特征在于：所述第一表面低于所述第三表面，所述第二表面低于所述第四表面。5. The speaker of claim 3, wherein the first surface is lower than the third surface, and the second surface is lower than the fourth surface.
  5. 如权利要求3所述的扬声器，其特征在于：所述磁钢组件胶合于所述下夹板的第二表面。5. The speaker of claim 3, wherein the magnetic steel component is glued to the second surface of the lower splint.
     To
  6. 在此处键入权利要求项6。Type claim 6 here.
  7. 在此处键入权利要求项7。Type claim 7 here.
  8. 在此处键入权利要求项8。Type claim 8 here.
  9. 在此处键入权利要求项9。Type claim 9 here.
  10. 在此处键入权利要求项10。Type claim 10 here.
PCT/CN2019/094032 2019-06-30 2019-06-30 Loudspeaker WO2021000132A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2019/094032 WO2021000132A1 (en) 2019-06-30 2019-06-30 Loudspeaker
CN201921031416.4U CN210093523U (en) 2019-06-30 2019-07-02 Loudspeaker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/094032 WO2021000132A1 (en) 2019-06-30 2019-06-30 Loudspeaker

Publications (1)

Publication Number Publication Date
WO2021000132A1 true WO2021000132A1 (en) 2021-01-07

Family

ID=69484589

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/094032 WO2021000132A1 (en) 2019-06-30 2019-06-30 Loudspeaker

Country Status (2)

Country Link
CN (1) CN210093523U (en)
WO (1) WO2021000132A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016176981A1 (en) * 2015-05-06 2016-11-10 歌尔声学股份有限公司 Loudspeaker module
CN206524943U (en) * 2016-12-12 2017-09-26 瑞声科技(新加坡)有限公司 Loudspeaker
US20180048964A1 (en) * 2014-09-01 2018-02-15 Goertek Inc. Loudspeaker module
CN207869359U (en) * 2018-01-08 2018-09-14 瑞声科技(新加坡)有限公司 Sounding monomer and loudspeaker enclosure
CN109905819A (en) * 2018-12-27 2019-06-18 瑞声科技(新加坡)有限公司 A kind of assemble method of loadspeaker structure, mobile device and loadspeaker structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180048964A1 (en) * 2014-09-01 2018-02-15 Goertek Inc. Loudspeaker module
WO2016176981A1 (en) * 2015-05-06 2016-11-10 歌尔声学股份有限公司 Loudspeaker module
CN206524943U (en) * 2016-12-12 2017-09-26 瑞声科技(新加坡)有限公司 Loudspeaker
CN207869359U (en) * 2018-01-08 2018-09-14 瑞声科技(新加坡)有限公司 Sounding monomer and loudspeaker enclosure
CN109905819A (en) * 2018-12-27 2019-06-18 瑞声科技(新加坡)有限公司 A kind of assemble method of loadspeaker structure, mobile device and loadspeaker structure

Also Published As

Publication number Publication date
CN210093523U (en) 2020-02-18

Similar Documents

Publication Publication Date Title
WO2020024677A1 (en) Speaker
CN204442665U (en) Stack Microspeaker
US10750286B2 (en) Speaker
WO2020140544A1 (en) Sound generation device
WO2020140539A1 (en) Speaker
WO2020134370A1 (en) Sound generating component
CN109831723B (en) Sounding device and assembling method thereof
WO2020248194A1 (en) Loudspeaker
WO2020125169A1 (en) Sound producing device
CN220292185U (en) Sound producing device and electronic equipment
CN214177551U (en) Sound production device
CN109275073A (en) The assembly method and loudspeaker of loudspeaker
WO2022007024A1 (en) Loudspeaker
CN117641208A (en) Sound producing device and electronic equipment
WO2021223255A1 (en) Sounding device
CN204887463U (en) Terminal that vibrates vocal structure and have vocal structure of this vibration
WO2021000155A1 (en) Speaker box
WO2021000106A1 (en) Loudspeaker enclosure
WO2021000132A1 (en) Loudspeaker
CN212811995U (en) Sound production device
WO2024087296A1 (en) Multifunctional sound production device
CN212812015U (en) Sound production device
CN110248289B (en) Sound generator
US10932020B2 (en) Sound generator
WO2021000142A1 (en) Loudspeaker and loudspeaker box

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19936324

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19936324

Country of ref document: EP

Kind code of ref document: A1