WO2020262218A1 - Box-type electronic unit and method for manufacturing same - Google Patents

Box-type electronic unit and method for manufacturing same Download PDF

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Publication number
WO2020262218A1
WO2020262218A1 PCT/JP2020/024084 JP2020024084W WO2020262218A1 WO 2020262218 A1 WO2020262218 A1 WO 2020262218A1 JP 2020024084 W JP2020024084 W JP 2020024084W WO 2020262218 A1 WO2020262218 A1 WO 2020262218A1
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WO
WIPO (PCT)
Prior art keywords
case
intervening member
connector
lid
box
Prior art date
Application number
PCT/JP2020/024084
Other languages
French (fr)
Japanese (ja)
Inventor
將博 大西
卓宏 篠▲崎▼
恭之 三輪
雅大 舟橋
Original Assignee
住友理工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2019118496A external-priority patent/JP7240969B2/en
Priority claimed from JP2020073565A external-priority patent/JP2021170604A/en
Application filed by 住友理工株式会社 filed Critical 住友理工株式会社
Publication of WO2020262218A1 publication Critical patent/WO2020262218A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to a box-type electronic unit and a method for manufacturing the same.
  • Japanese Unexamined Patent Publication No. 2003-069275 describes a housing shield structure.
  • This housing shield structure includes a case that houses an electronic circuit board and has a shielding function, and a shield cover that covers an opening of the case.
  • the case and shield cover are formed by casting using materials such as aluminum, magnesium and zinc.
  • the housing shield structure includes a packing formed of conductive rubber which is interposed and arranged between the case and the shield cover. That is, the packing has a shielding function and a waterproof function. Therefore, a complete shield structure can be formed in the case.
  • Japanese Patent Application Laid-Open No. 2002-185181 describes that a gasket made of electromagnetic wave shield rubber is arranged between a circuit board and a shield plate. Further, Japanese Patent Application Laid-Open No. 2002-185181 describes that a gasket similar to the above is arranged between the inner surface of the housing and the shield plate.
  • box-type electronic units that house an electronic circuit board include a case that houses the electronic circuit board, a connector, and a lid.
  • a case that houses the electronic circuit board, a connector, and a lid.
  • an electronic circuit board, a case, a connector, and a lid are separately formed, and the case and the connector are adhered with an adhesive and the case and the lid are adhered to each other. doing.
  • the electronic circuit board and the connector are integrally formed, and other elements are separately formed. Then, a sealing material is applied to the facing surface between the case and the connector, and another sealing material is applied to the facing surface between the case and the lid and the facing surface between the connector and the lid.
  • the case and lid are fixed by a fixture such as a screw.
  • the case and the connector are integrally formed, the lid is formed separately from the integrated element of the case and the connector, and the case and the connector are integrated.
  • a sealing material is interposed on the facing surface between the element and the lid.
  • the box-type electronic unit is required to have an electromagnetic wave shielding function with respect to the electronic circuit board.
  • the electromagnetic wave shielding function includes a function of reflecting electromagnetic waves and a function of absorbing electromagnetic waves.
  • an electromagnetic wave shielding member formed separately from the resin case by a material having a coefficient of thermal expansion different from that of the resin case may be arranged in the resin case.
  • the relative positions of the two may change due to the difference in the coefficient of thermal expansion. Due to this change in relative position, a gap may be created and the desired electromagnetic wave shielding function may not be exhibited.
  • both the connector and the case are joined and the case and the lid are joined by an adhesive.
  • joining the connector to the case and joining the lid to the case are not performed at the same time but at different timings, so that the adhesive application process is performed a plurality of times at different timings.
  • the cost increases due to the large number of adhesive application steps.
  • it is necessary to maintain the coating accuracy of the adhesive and it is not easy to maintain the coating accuracy as the number of coating steps increases. Therefore, it is required to reduce the number of times the material functioning as an adhesive is supplied.
  • the box-type electronic unit described in JP-A-2007-23503 also has the same problems associated with the timing of the adhesive as in JP-A-2010-258360. Further, in the box-type electronic unit described in International Publication No. 2018/016261, since the case and the connector are integrally formed, the number of adhesive application steps is reduced. However, since the case and the connector are integrated, the molding of the integrated element becomes high cost. Further, since it is integrally molded with resin, it is not easy to give the case a heat dissipation function and an electromagnetic wave shielding function. It is required to prevent the cost increase due to the molding of the integrated element by forming each element separately.
  • the present invention provides a box-shaped electronic unit capable of exhibiting a desired electromagnetic wave shielding function even if the relative positions of the resin case and the electromagnetic wave shielding member change due to the difference in the coefficient of thermal expansion. It is one of the purposes. Further, the present invention reduces the number of times of supplying a material having an adhesive function by forming a connector separately from other elements and joining only a part of the elements to be bonded with a material having an adhesive function. It is one of the other purposes of providing a box-shaped electronic unit capable of providing a method for manufacturing the same.
  • the first box-shaped electronic unit is formed separately from the case by using an electronic circuit board, a resin case for accommodating the electronic circuit board, and a material having a thermal expansion coefficient different from that of the case, and is attached to the case.
  • the case and the electromagnetic wave shield member are formed in contact with the case and the electromagnetic wave shield member by being formed of an electromagnetic wave shield member that exposes at least a part thereof and a polymer viscoelastic material having an electromagnetic wave shield property. It is provided with a viscoelastic shield layer arranged so as to straddle it.
  • a viscoelastic shield layer formed of a polymer viscoelastic material having an electromagnetic wave shielding property is arranged straddling the resin case and the electromagnetic wave shielding member in a state of being in contact with the electromagnetic wave shielding member. ing. Therefore, even if the relative positions of the resin case and the electromagnetic wave shield member change due to the resin case and the electromagnetic wave shield member being molded by materials having different coefficients of thermal expansion, the viscoelastic shield layer changes in the relative position. Can be followed. Therefore, the desired electromagnetic wave shielding function can be exhibited.
  • the second box-shaped electronic unit includes an electronic circuit board, a case that houses the electronic circuit board and has a lid opening and a connector opening, and a lid that closes the lid opening of the case.
  • the case is formed separately from the case, fixed to the opening for the connector of the case, and formed of a connector that electrically connects the electronic circuit board and the outside, and a polymer viscoelastic material.
  • the connector of the case formed of a first interposition member that is adhered to the peripheral edge of the lid opening and holds the lid in a non-adherent and sealed state to the lid, and a polymer viscoelastic material. It is provided with a second intervening member that is adhered to each of the peripheral edge of the opening for the connector and the facing surface of the connector and that seals between the peripheral edge of the opening for the connector and the connector.
  • Cost reduction can be achieved by forming the connector separately from other elements.
  • the connector separately from other elements, it becomes easy to attach the terminal to the main body of the connector.
  • the second intervening member interposed between the case and the connector is adhered to both, while the first intervening member interposed between the case and the lid is adhered to one lid.
  • the first intervening member is adhered to the case, but not to the lid, and is held in a non-adhesive state with respect to the lid. That is, the first intervening member and the second intervening member are adhered to the two elements of the case and the connector, and the lid is not the object of adhesion. In this way, by limiting the objects to be bonded by the intervening member to only the case and the connector, the number of times the intervening member having an adhesive function is formed can be reduced.
  • the method for manufacturing the box-type electronic unit is the above-mentioned method for manufacturing the second box-type electronic unit, which comprises a step of arranging the case and the connector in the mold and supplying a fluid material of a polymer viscoelastic material. Then, the step of filling the area of the first intervening member and the area of the second intervening member with the fluid material, and the step of heating and solidifying the fluid material to solidify the first intervening member and the second interposition member. It includes a step of forming a member and a step of attaching the lid.
  • the fluid material of the polymer viscoelastic material By using the fluid material of the polymer viscoelastic material, the fluid material can be easily filled in the desired position in the mold. Then, by heating and solidifying the fluid material, the first intervening member and the second intervening member are formed, so that the first intervening member and the second intervening member are formed at the same time. In other words, the heating and solidification of the fluid material causes the first intervening member to adhere to the case and at the same time the second intervening member to adhere to the case and connector. Therefore, it is possible to easily fill the mold with the fluid material and to bond the first intervening member and the second interposing member. As a result, the cost can be reduced. Further, since the first intervening member and the second intervening member can be formed at the same time, the number of fillings can be reduced. From this as well, it is possible to reduce the cost.
  • FIG. 1 It is sectional drawing which shows the product in steps S6 and S7 of FIG. It is a perspective view of the box type electronic unit of the second example. It is a perspective view of the box type electronic unit of the 2nd example seen from the back surface side of FIG. It is an exploded perspective view of the box type electronic unit of the second example. It is an exploded perspective view which shows the case and the connector among the connector integrated cases constituting the box type electronic unit of the 2nd example. It is an exploded perspective view of the connector integrated case seen from the back side of FIG. It is a perspective view of the part excluding the connector in the connector integrated case shown in FIG. It is a flowchart which shows the manufacturing method of the box type electronic unit of the 2nd example.
  • FIG. 28 It is a perspective view of the box type electronic unit of the 4th example. It is a perspective view of the box-shaped electronic unit of the second example seen from the back surface side of FIG. 26. It is an exploded perspective view of the box type electronic unit of the 4th example. It is an exploded perspective view which shows the case and the connector among the connector integrated cases constituting the box type electronic unit of 4th example. It is an exploded perspective view of the connector integrated case seen from the back side of FIG. 29. It is a perspective view of the part excluding the connector in the connector integrated case shown in FIG. 28. It is a flowchart which shows the manufacturing method of the box type electronic unit of 4th example. It is a perspective view of the state where the case and the connector are arranged in the molding die. It is a perspective view of the connector integrated case which constitutes the box type electronic unit of 5th example. It is a perspective view of the case which constitutes the box type electronic unit of the 5th example.
  • the box-type electronic unit is a unit that houses an electronic circuit board and is required to be drip-proof and waterproof.
  • the box-type electronic unit has a heat dissipation function in order to dissipate the heat of the electronic circuit board housed inside to the outside. Further, the box-type electronic unit has an electromagnetic wave shielding function in order to make the electronic circuit board housed inside less susceptible to electromagnetic wave noise from the outside.
  • the box-type electronic unit is applied to, for example, an automobile ECU (electronic control unit).
  • the box-type electronic unit is applied to, for example, an engine ECU, a motor ECU, an air conditioner ECU, a camera ECU, a radar ECU, and the like as an automobile ECU.
  • the box-shaped electronic unit 1 has a flat outer shape due to the resin case 10 and the lid 20.
  • the outer shape of the box-shaped electronic unit 1 is shown as a rectangular flat shape, but it can be a flat shape having an arbitrary shape such as another polygon or a circle.
  • An electronic circuit board 30 (shown in FIG. 3) is housed inside the resin case 10 and the lid 20.
  • the resin case 10 is provided with a heat dissipation opening 11a1 that penetrates on the back surface.
  • the resin case 10 is provided with a non-penetrating recess 11a2 on the back surface.
  • the box-type electronic unit 1 further includes a connector 40 that protrudes outward from a flat outer shape formed by the resin case 10 and the lid 20.
  • the connector 40 is fitted into an external connector (not shown) and electrically connected.
  • the terminals of the connector 40 are electrically connected by contacting the terminals of the electronic circuit board 30 (shown in FIG. 3).
  • the case where the box-type electronic unit 1 includes one connector 40 is given as an example, but a plurality of connectors 40 may also be provided.
  • the box-type electronic unit 1 further includes an electromagnetic wave shielding member 50 exposed on the back surface of the resin case 10.
  • the electromagnetic wave shield member 50 is a heat sink having a heat dissipation function.
  • the electromagnetic wave shield member 50 is fitted in the heat dissipation opening 11a1 of the resin case 10.
  • the electromagnetic wave shield member 50 having a heat dissipation function includes a plurality of protrusions protruding from the back surface of the resin case 10 in order to enhance the heat dissipation effect.
  • the box-shaped electronic unit 1 includes a resin case 10, a lid 20, an electronic circuit board 30, a connector 40, electromagnetic wave shielding members 50 and 60, a viscoelastic joining member 70, and viscoelasticity.
  • a seal member 80 and a viscoelastic shield layer 90 are provided.
  • the resin case 10 is formed in a container shape by a resin material.
  • the resin material forming the resin case 10 is a resin material having no conductivity. That is, the resin material does not have a shielding function.
  • the resin material is formed of, for example, general-purpose plastic, engineering plastic, super engineering plastic, or the like. Specifically, the resin material is, for example, ABS, polypropylene, polycarbonate, polybutylene terephthalate, polyphenylene sulfide and the like.
  • the resin case 10 includes a case main body 11 and a partition plate 12, and is a member in which the case main body 11 and the partition plate 12 are integrally molded.
  • the case body 11 is formed in the shape of a container forming the internal space A0, and has a main opening above FIG. In this example, the case body 11 is formed in a rectangular container shape.
  • the case main body 11 includes a bottom surface 11a, a peripheral wall 11b erected on the peripheral edge of the bottom surface 11a, and a connector holding portion 11c. Therefore, the case body 11 has a main opening formed by the tip of the peripheral wall 11b.
  • the bottom surface 11a of the case body 11 is formed in a rectangular plate shape, for example. As shown in FIG. 5, the bottom surface 11a includes a heat dissipation opening 11a1 that penetrates the bottom surface 11a in the normal direction.
  • the heat dissipation opening 11a1 is an opening for discharging the heat generated by the electronic circuit board 30 to the outside.
  • the heat dissipation opening 11a1 is a rectangular opening.
  • the bottom surface 11a of the case body 11 is provided with a non-penetrating recess 11a2 on the outer surface side of the bottom surface 11a at a position different from the heat dissipation opening 11a1.
  • the peripheral wall 11b of the case body 11 forms a space A0 for accommodating the electronic circuit board 30 inside.
  • the peripheral wall 11b is provided on the entire peripheral edge of the bottom surface 11a. That is, the peripheral wall 11b is formed in a rectangular frame shape. Then, a rectangular main opening is formed by the tip of the peripheral wall 11b.
  • outer seating surfaces 11b1 that support the four corners of the lid 20 are formed. Further, at the four corners of the internal space A0 formed from the peripheral wall 11b, inner seat surfaces 11b2 that support the four corners of the electronic circuit board 30 are formed.
  • the connector holding portion 11c is formed in a part of the peripheral wall 11b.
  • the connector holding portion 11c is a hole that penetrates one side of the peripheral wall 11b in the normal direction of the bottom surface 11a.
  • the connector holding portion 11c may be a hole or a notch on one side of the peripheral wall 11b that penetrates in the surface direction of the bottom surface 11a.
  • the partition plate 12 is provided in the internal space A0 of the case body 11.
  • the partition plate 12 is formed so that the base end is connected to the bottom surface 11a and faces the peripheral wall 11b. However, a part of the partition plate 12 is connected to the peripheral wall 11b. Therefore, the partition plate 12 partitions the internal space A0 of the case body 11 into a plurality of spaces A1, A2, A3, and A4.
  • Each of the plurality of spaces A1, A2, A3, and A4 has an electromagnetic wave shielding function.
  • the electromagnetic wave shielding function includes a function of reflecting electromagnetic waves and a function of absorbing electromagnetic waves.
  • the spaces A1-A4 may all have the same electromagnetic wave shielding function, or may have different electromagnetic wave shielding functions.
  • the first space A1 is an electromagnetic wave absorption space having a function of absorbing electromagnetic waves.
  • the second space A2, the third space A3, and the fourth space A4 have a function of reflecting electromagnetic waves.
  • the first space A1 is a rectangular space located at the center of the internal space A0 of the case body 11.
  • the first space A1 is formed by the bottom surface 11a and the partition plate 12.
  • the second space A2 is a large space located on the opposite side of the internal space A0 of the case body 11 from the connector holding portion 11c.
  • the second space A2 is formed by a bottom surface 11a, a part of the peripheral wall 11b, and a partition plate 12. Further, a heat dissipation opening 11a1 is formed on the bottom surface 11a forming the second space A2.
  • the third space A3 is a space located on the connector holding portion 11c side of the periphery of the internal space A0 of the case body 11.
  • the third space A3 is formed by a bottom surface 11a, a part of the peripheral wall 11b, and a partition plate 12.
  • the fourth space A4 is a space located on the connector holding portion 11c side of the periphery of the internal space A0 of the case body 11.
  • the fourth space A4 is formed by a bottom surface 11a, a part of the peripheral wall 11b, and a partition plate 12.
  • the lid 20 closes the main opening of the case body 11, that is, the main opening formed by the tip of the peripheral wall 11b.
  • the lid 20 is supported by the outer seat surface 11b1 of the peripheral wall 11b of the case body 11, and is fastened by a fastening member (not shown).
  • the lid 20 is formed in a plate shape, for example, a rectangular plate shape.
  • the lid 20 may be formed so that the case body 11 is turned upside down, that is, a shape having a space inside.
  • the electronic circuit board 30 has an electronic circuit component 32 mounted on a board body 31.
  • the electronic circuit component 32 is mounted on the lower surface side of FIG. 5 of the substrate main body 31, that is, the surface on the resin case 10 side.
  • the electronic circuit component 32 may also be mounted on the upper surface side of FIG. 5 of the substrate main body 31, that is, the surface on the lid 20 side.
  • the four corners of the electronic circuit board 30 are supported by the inner seating surface 11b2 of the peripheral wall 11b of the case body 11.
  • the electronic circuit board 30 has a plurality of compartments B1, B2, B3, and B4.
  • the electronic circuit components arranged in the first section B1 are arranged in the first space A1, and the electronic circuit parts arranged in the second section B2 are arranged in the second space A2.
  • the electronic circuit components arranged in the third section B3 are arranged in the third space A3, and the electronic circuit parts arranged in the fourth section B4 are arranged in the fourth space A4.
  • the electronic circuit board 30 is supported by the tip surface of the partition plate 12 in addition to the inner seat surface 11b2 of the peripheral wall 11b of the case body 11. That is, the central portion of the electronic circuit board 30 is supported by the partition plate 12.
  • the partition plate 12 supports the boundary surface of each compartment B1-B4.
  • the connector 40 As shown in FIGS. 3 and 5, a part of the connector 40 is held by the connector holding portion 11c of the case main body 11, and the remaining part of the connector 40 projects outward from the outer surface of the case main body 11. .
  • the connector 40 may be formed in a straight line having an angle but not having an angle. Further, when the connector 40 has an angle, it can be any angle.
  • the connector 40 is formed separately from the resin case 10 and the lid 20 is taken as an example.
  • the connector 40 may be formed in the same shape as the case body 11 of the resin case 10.
  • the case body 11 does not have the connector holding portion 11c, and a part of the connector 40 constitutes a wall surface forming the third space A3.
  • the electromagnetic wave shield member 50 has an electromagnetic wave shield function and a heat dissipation function. That is, the electromagnetic wave shield member 50 is a heat sink.
  • the electromagnetic wave shield member 50 is formed of, for example, a metal material having good heat transfer characteristics such as aluminum, copper, and iron.
  • the electromagnetic wave shield member 50 may be formed of a material other than the metal material. Therefore, the electromagnetic wave shield member 50 is formed separately from the resin case 10 by a material having a coefficient of thermal expansion different from that of the resin case 10.
  • the electromagnetic wave shield member 50 is arranged in the second space A2, which is one of the shield target areas of the resin case 10.
  • the electromagnetic wave shield member 50 is attached to the heat dissipation opening 11a1 on the bottom surface 11a forming the second space A2.
  • the electromagnetic wave shield member 50 is arranged so as not to be detached from the bottom surface 11a of the case body 11 by being fitted into the heat dissipation opening 11a1.
  • the electromagnetic wave shield member 50 is locked to the bottom surface 11a in both directions along the normal of the bottom surface 11a.
  • the electromagnetic wave shield member 50 since the electromagnetic wave shield member 50 is arranged in the heat dissipation opening 11a1, it constitutes a part of the inner wall surface of the second space A2. That is, at least a part of the electromagnetic wave shield member 50 is exposed inside the second space A2. Further, since the electromagnetic wave shield member 50 is arranged in the heat dissipation opening 11a1, it is also exposed to the outside of the bottom surface 11a of the case body 11.
  • the electromagnetic wave shield member 50 includes a plurality of protrusions 51 projecting to the outside of the bottom surface 11a in order to enhance the heat dissipation effect.
  • the electromagnetic wave shielding member 60 is an electromagnetic wave absorbing member having an electromagnetic wave absorbing function as an electromagnetic wave shielding function.
  • the electromagnetic wave shield member 60 is formed separately from the resin case 10 by using a material having a coefficient of thermal expansion different from that of the resin case 10.
  • the electromagnetic wave shield member 60 includes, for example, a resin absorbing layer 61 and a metal layer 62. The material and thickness of the resin absorbing layer 61 are adjusted according to the frequency to be absorbed.
  • the electromagnetic wave shield member 60 can also be formed of any one of a conductive radio wave absorbing material, a dielectric radio wave absorbing material, and a magnetic radio wave absorbing material.
  • the conductive radio wave absorbing material absorbs the current generated by the radio wave by the resistance inside the material.
  • the dielectric radio wave absorbing material utilizes the dielectric loss caused by the polarization reaction of molecules, and is formed by mixing, for example, carbon or the like with a dielectric material such as rubber, urethane foam, or polystyrene foam.
  • the magnetic radio wave absorbing material absorbs radio waves by the magnetic loss of the magnetic material, and absorbs radio waves by using iron, nickel, ferrite, or the like.
  • the electromagnetic wave shield member 60 is arranged in the first space A1, which is one of the shield target areas of the resin case 10.
  • the electromagnetic wave shield member 60 is arranged on a part of the inner wall surface of the first space A1.
  • the electromagnetic wave shield member 60 is attached to the bottom surface 11a forming the first space A1.
  • the metal layer 62 of the electromagnetic wave shielding member 60 is adhered to the bottom surface 11a, and the resin absorbing layer 61 is adhered to the surface of the metal layer 62 opposite to the bottom surface 11a.
  • the viscoelastic joining member 70 is formed of a polymer viscoelastic material, and joins the connector holding portion 11c and the connector 40.
  • the viscoelastic joining member 70 is interposed between the inner peripheral surface of the connector holding portion 11c and the outer peripheral surface of the connector 40, and is interposed between the inner peripheral surface of the connector holding portion 11c and the outer peripheral surface of the connector 40. It is joined.
  • the viscoelastic bonding member 70 is formed of, for example, silicone rubber, ethylene propylene rubber, or the like. As will be described later, the viscoelastic joining member 70 is molded by injection molding. Therefore, the viscoelastic joining member 70 can easily and surely join the connector holding portion 11c and the connector 40. When the connector 40 is formed in the same shape as the case body 11, the viscoelastic joining member 70 becomes unnecessary.
  • the viscoelastic seal member 80 is formed of a polymer viscoelastic material and is joined to the tip surface of the peripheral wall 11b of the case body 11.
  • the viscoelastic sealing member 80 has a sealing function between the case body 11 of the resin case 10 and the lid 20.
  • the viscoelastic sealing member 80 is formed of, for example, the same material as the viscoelastic joining member 70. That is, the viscoelastic seal member 80 is molded of, for example, silicone rubber, ethylene propylene rubber, or the like.
  • the viscoelastic seal member 80 is joined to the peripheral wall 11b of the case body 11, and can exhibit the sealing function by being brought into contact with the lid 20 in a compressed state. Further, as will be described later, the viscoelastic seal member 80 is molded by injection molding. Therefore, the viscoelastic seal member 80 can be easily molded.
  • the viscoelastic shield layer 90 is formed of a polymer viscoelastic material having electromagnetic wave shielding properties.
  • the viscoelastic shield layer 90 is arranged on the inner wall surface forming the first space A1 to the fourth space A4, which is the electromagnetic wave shielding space in the resin case 10.
  • the viscoelastic shield layer 90 does not cover the entire region in the region where the electromagnetic wave shield members 50 and 60 are arranged, but the electromagnetic wave shield members 50 and 60. At least a part of is exposed.
  • the viscoelastic shield layer 90 covers all the inner wall surfaces formed by the bottom surface 11a, the peripheral wall 11b, and the partition plate 12. Further, the viscoelastic shield layer 90 is also arranged on the tip surface of the partition plate 12.
  • the viscoelastic shield layer 90 is only arranged in the resin case 10 and not in the lid 20. However, the viscoelastic shield layer 90 may also be arranged on the lid 20.
  • a material in which a conductive filler is contained in a viscoelastic main component such as rubber or elastomer is used.
  • a viscoelastic main component synthetic rubber such as EPDM, NBR, acrylic rubber, fluororubber, silicone rubber, and chloroprene rubber is used.
  • a conductive filler carbon black, metal particles, or the like is used.
  • the viscoelastic shield layer 90 can surely exert the electromagnetic wave shielding effect in the first space A1 to the fourth space A4 as the shield target area.
  • the viscoelastic shield layer 90 is in a state where at least a part of the electromagnetic wave shield members 50 and 60 is exposed, it is possible to maintain a state in which the electromagnetic wave shield members 50 and 60 exert their functions. That is, the heat dissipation effect can be exerted by the exposed portion of the electromagnetic wave shield member 50, and the electromagnetic wave absorption function can be exerted by the exposed portion of the electromagnetic wave shield member 60.
  • the viscoelastic shield layer 90 is molded by injection molding. Therefore, the viscoelastic shield layer 90 can be easily molded.
  • An electromagnetic wave shield member 60 having an electromagnetic wave absorbing function is arranged in the first space A1. Specifically, the electromagnetic wave shield member 60 is arranged on the bottom surface 11a forming the inner wall surface of the first space A1. In particular, the metal layer 62 constituting the electromagnetic wave shielding member 60 is adhered to the bottom surface 11a, and the resin absorbing layer 61 is laminated on the metal layer 62.
  • the viscoelastic shield layer 90 covers the inner wall surface of the first space A1 in a region other than the region where the electromagnetic wave shield member 60 is arranged. In this example, the viscoelastic shield layer 90 covers all the surfaces of the inner wall surface of the first space A1 except for the region where the electromagnetic wave shield member 60 is arranged.
  • the inner wall surface of the first space A1 means a surface formed by the resin case 10, and does not include the main opening side of the resin case 10, that is, the surface on which the electronic circuit board 30 is arranged.
  • the viscoelastic shield layer 90 is arranged so as to straddle the resin case 10 and the electromagnetic wave shield member 60 in a state of being in contact with the resin case 10 and the electromagnetic wave shield member 60. Specifically, in the first space A1, the viscoelastic shield layer 90 straddles the bottom surface 11a or the partition plate 12 and the peripheral edge of the metal layer 62 of the electromagnetic wave shield member 60. More specifically, the viscoelastic shield layer 90 extends over the entire periphery of the metal layer 62 except for the central portion of the metal layer 62.
  • the viscoelastic shield layer 90 is continuously arranged from the surface of the inner wall surface of the first space A1 excluding the region where the electromagnetic wave shield member 60 is arranged to the electromagnetic wave shield member 60.
  • At least one of the electromagnetic wave shield member 60 and the viscoelastic shield layer 90 exists on the inner wall surface forming the first space A1.
  • both the viscoelastic shield layer 90 and the electromagnetic wave shield member 60 are present. That is, the electromagnetic wave shielding function can be exhibited on all surfaces of the inner wall surface of the first space A1.
  • the viscoelastic shield layer 90 is arranged so as to straddle the resin case 10 and the electromagnetic wave shield member 60 in a state of being in contact with the electromagnetic wave shield member 60.
  • the resin case 10 and the electromagnetic wave shield member 60 are formed of materials having different coefficients of thermal expansion. Therefore, the relative position of the resin case 10 and the electromagnetic wave shield member 60 changes due to the temperature change. However, even if the relative position changes, the viscoelastic shield layer 90 can follow the change in the relative position between the resin case 10 and the electromagnetic wave shield member 60. Therefore, the desired electromagnetic wave shielding function can be exhibited.
  • the metal layer 62 constituting the electromagnetic wave shielding member 60 includes a laminated portion 62a that is laminated and adhered to the resin absorbing layer 61, and a flange portion 62b that projects outward from the outer periphery of the laminated portion 62a.
  • the viscoelastic shield layer 90 straddles the bottom surface 11a or the partition plate 12 and the flange portion of the metal layer 62. By making the viscoelastic shield layer 90 continuous with the metal layer 62, the electromagnetic wave reflection function can be continuously exhibited in the first space A1.
  • the viscoelastic shield layer 90 is not arranged so as to overlap the resin absorbing layer 61 having an electromagnetic wave absorbing function. Therefore, it is possible to prevent the viscoelastic shield layer 90 from adversely affecting the electromagnetic wave absorption function of the resin absorption layer 61. That is, the desired electromagnetic wave absorption function can be exhibited.
  • An electromagnetic wave shield member 50 having a heat dissipation function is arranged in the second space A2. Specifically, the electromagnetic wave shield member 50 is fitted in the heat dissipation opening 11a1 on the bottom surface 11a.
  • the viscoelastic shield layer 90 covers the inner wall surface of the second space A2 in a region other than the region where the electromagnetic wave shield member 50 is arranged. In this example, the viscoelastic shield layer 90 covers all the surfaces of the inner wall surface of the second space A2 except the region where the electromagnetic wave shield member 50 is arranged.
  • the inner wall surface of the second space A2 means a surface formed by the resin case 10 and the electromagnetic wave shielding member 50, and includes the main opening side of the resin case 10, that is, the surface on which the electronic circuit board 30 is arranged. Absent.
  • the viscoelastic shield layer 90 is arranged so as to straddle the resin case 10 and the electromagnetic wave shield member 50 in a state of being in contact with the resin case 10 and the electromagnetic wave shield member 50. Specifically, the viscoelastic shield layer 90 straddles the bottom surface 11a, the peripheral wall 11b or the partition plate 12, and the electromagnetic wave shield member 50. More specifically, the viscoelastic shield layer 90 straddles the entire peripheral edge of the heat dissipation opening 11a1 on the bottom surface 11a and the entire peripheral edge of the electromagnetic wave shielding member 50 excluding the central portion of the electromagnetic wave shielding member 50.
  • At least one of the electromagnetic wave shield member 50 and the viscoelastic shield layer 90 exists on the inner wall surface forming the second space A2.
  • both the viscoelastic shield layer 90 and the electromagnetic wave shield member 50 are present. That is, the electromagnetic wave shielding function can be exhibited on all surfaces of the inner wall surface of the second space A2.
  • the viscoelastic shield layer 90 is arranged so as to straddle the resin case 10 and the electromagnetic wave shield member 50 in a state of being in contact with the electromagnetic wave shield member 50.
  • the resin case 10 and the electromagnetic wave shield member 50 are formed of materials having different coefficients of thermal expansion. Therefore, the relative position of the resin case 10 and the electromagnetic wave shield member 50 changes due to the temperature change. However, even if the relative position changes, the viscoelastic shield layer 90 can follow the change in the relative position between the resin case 10 and the electromagnetic wave shield member 50. Therefore, the desired electromagnetic wave shielding function can be exhibited.
  • the viscoelastic shield layer 90 is in a state where at least a part of the electromagnetic wave shield member 50 is exposed.
  • the electromagnetic wave shield member 50 is a member having a heat dissipation function. That is, the viscoelastic shield layer 90 is not arranged so as to overlap at least a part of the electromagnetic wave shield member 50. Therefore, it is possible to prevent the viscoelastic shield layer 90 from adversely affecting the heat dissipation function of the electromagnetic wave shield member 50. That is, the exposed portion of the electromagnetic wave shield member 50 can exert a heat dissipation function.
  • the electromagnetic wave shield member 50 is fitted into the heat dissipation opening 11a1 formed on the bottom surface 11a of the case body 11 of the resin case 10. As shown in FIG. 5, in the fitted state, the bottom surface 11a of the resin case 10 and the surface of the electromagnetic wave shield member 50 form a stepped shape.
  • the viscoelastic shield layer 90 is arranged so as to straddle the bottom surface 11a of the resin case 10 and the electromagnetic wave shield member 50 at a stepped portion.
  • the layer thickness of the viscoelastic shield layer 90 is formed so that the layer thickness at the stepped step portion is thicker than the layer thickness around the stepped step portion.
  • the thicker the layer the higher the displacement followability. That is, by forming the layer thickness as described above, even if the relative positions of the resin case 10 and the electromagnetic wave shield member 50 change, the viscoelastic shield layer 90 more reliably secures the resin case 10 and the electromagnetic wave shield. It is possible to follow a change in the position relative to the member 50.
  • the viscoelastic shield layer 90 is also arranged on the tip surface of the partition plate 12. That is, the viscoelastic shield layer 90 is arranged on each inner wall surface (side wall surface of the partition plate 12) forming an adjacent space and the tip surface of the partition plate 12 located at the boundary portion with each inner wall surface. ing. More specifically, the viscoelastic shield layer 90 is continuously arranged on the inner wall surface of each of the adjacent spaces and the tip surface of the partition plate 12.
  • the viscoelastic shield layer 90 is continuously arranged on the inner wall surface forming the first space A1, the tip surface of the partition plate 12 which is the boundary of the inner wall surface, and the inner wall surface forming the second space A2. ing. First space A1 and third space A3, first space A1 and fourth space A4, second space A2 and third space A3, second space A2 and fourth space A4, third space A3 and fourth space A4 The same applies to each boundary portion.
  • the viscoelastic shield layer 90 arranged on the tip surface of the partition plate 12 supports the electronic circuit board 30. Therefore, even if the position of the electronic circuit board 30 with respect to the resin case 10 changes, the viscoelastic shield layer 90 can follow it. Therefore, the viscoelastic shield layer 90 can surely exert a desired electromagnetic wave shielding function between the electronic circuit board 30 and the partition plate 12. Further, the central portion of the electronic circuit board 30 is supported by the partition plate 12 via the viscoelastic shield layer 90, so that the electronic circuit board 30 can be in a stable posture.
  • step S1 the electromagnetic wave shield member 50 as an insert is arranged in the first mold (not shown) (step S1).
  • the resin case 10 is molded by supplying the resin material into the first mold (step S2).
  • step S2 the product 1a shown in FIG. 7 is produced.
  • the electromagnetic wave shield member 50 is fitted into the bottom surface 11a of the case body 11 of the resin case 10. Therefore, the electromagnetic wave shield member 50 is fixed to the resin case 10.
  • the metal layer 62 of the electromagnetic wave shielding member 60 is adhered to the bottom surface 11a of the first space A1 of the resin case 10 (step S3).
  • the metal layer 62 can also be insert-molded in step S2 together with the electromagnetic wave shielding member 50.
  • the metal layer 62 and the resin absorbing layer 61 may be integrally bonded to the bottom surface 11a of the first space A1 in advance, or the integrated product may be insert-molded in step S2.
  • the connector 40 as an insert is arranged in the second mold (not shown) (step S4).
  • the object 1b in the second type at this time is as shown in FIG.
  • the viscoelastic joining member 70, the viscoelastic sealing member 80, and the viscoelastic shield layer 90 are formed by supplying the viscoelastic material into the second mold (step S5).
  • the product 1c shown in FIG. 9 is produced.
  • the viscoelastic joining member 70 and the viscoelastic sealing member 80 are formed of the same material, and the viscoelastic shield layer 90 is formed of a material different from that of the viscoelastic joining member 70 and the like. Therefore, two-color molding is performed here.
  • step S6 the resin absorbing layer 61, which is the remaining member of the electromagnetic wave shielding member 60, is arranged (step S6).
  • step S7 the electronic circuit board 30 is attached (step S7).
  • step S8 the box-shaped electronic unit 1 shown in FIG. 5 is completed (step S8).
  • step S5 the viscoelastic joining member 70, the viscoelastic sealing member 80, and the viscoelastic shield layer 90 can be molded in one step. Therefore, the manufacturing cost is low.
  • the viscoelastic shield layer 90 is arranged on the inner wall surface of the resin case 10.
  • the viscoelastic shield layer 90 may be arranged on the outer wall surface of the resin case 10. In this case, the viscoelastic shield layer 90 is exposed to the outside.
  • box-type electronic unit 2 of the second example (3-1. Appearance of box-type electronic unit 2)
  • the appearance of the box-type electronic unit 2 will be described with reference to FIGS. 11 and 12.
  • the box-shaped electronic unit 2 has a flat outer shape formed by the case 110 and the lid 120.
  • the outer shape of the box-shaped electronic unit 2 is shown as a rectangular flat shape, but it can be a flat shape having an arbitrary shape.
  • An electronic circuit board 130 (shown in FIG. 13) is housed inside the case 110 and the lid 120.
  • the box-type electronic unit 2 further includes a connector 140 connected to an external connector on the side surface (peripheral surface) of the flat outer shape formed by the case 110 and the lid 120.
  • the connector 140 has a rectangular connection hole.
  • the terminals of the connector 140 are electrically connected to the electronic circuit board 130 (shown in FIG. 13).
  • the case where the box-type electronic unit 2 includes one connector 140 is given as an example, but a plurality of connectors 140 may also be provided.
  • the box-type electronic unit 2 includes an electronic circuit board 130, a connector integrated case 150, and a lid 120.
  • the electronic circuit board 130 is a board on which an electronic circuit is formed, and includes a plurality of electronic components.
  • a plurality of electronic components are arranged on the back surface of the substrate.
  • the electronic circuit may include, for example, a heat-generating component, or may have a configuration that can be affected by external noise.
  • the connector integrated case 150 is a member in which the case 110 and the connector 140 are integrally formed.
  • the connector integrated case 150 is formed by integrally joining the separately formed case 110 and the connector 140.
  • the box-type electronic unit 2 may also have a plurality of connectors 140.
  • the connector-integrated case 150 is a member in which the case 110 and a plurality of connectors 140 are integrally formed.
  • the connector-integrated case 150 further includes a first intervening member 151 interposed between the case 110 and the lid 120, a second intervening member 152 interposed between the case 110 and the connector 140, and between the connector 140 and the lid 120.
  • a first auxiliary intervening member 153 is provided.
  • the connector integrated case 150 will be described in detail with reference to FIGS. 14 to 16.
  • the case 110 constituting the connector integrated case 150 is formed in a flat shape and accommodates the electronic circuit board 130.
  • the case 110 is made of metal or resin.
  • the case 110 is made of, for example, aluminum, iron, stainless steel, magnesium, or the like as a metal.
  • the case 110 is formed of resin, for example, general-purpose plastic, engineering plastic, super engineering plastic, or the like.
  • the case 110 is formed of, for example, ABS, polypropylene, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, or the like as a detailed type of resin.
  • the case 110 may be made of metal in order to have at least one of a heat dissipation function and an electromagnetic wave shielding function. Further, when it is not necessary for the case 110 to have a heat dissipation function and an electromagnetic wave shielding function, the weight can be reduced by adopting a resin. However, when the case 110 is made of resin, it can have an electromagnetic wave shielding function by adopting the configuration of the box-shaped electronic unit 1 of the first example. Further, by adopting the heat sink constituting the box-type electronic unit 1 of the first example, it is possible to have a heat dissipation function.
  • the case 110 is formed in the shape of a bottomed container.
  • the case 110 includes a bottom surface 111 and a peripheral wall 112.
  • the bottom surface 111 is formed in a plane shape, for example, in a rectangular shape.
  • the bottom surface 111 is formed in a shape corresponding to the outer shape of the electronic circuit board 130.
  • the outer surface of the bottom surface 111 is formed in an uneven shape in order to improve heat dissipation.
  • the peripheral wall 112 is formed so as to surround the peripheral edge of the bottom surface 111.
  • the peripheral wall 112 does not surround the entire peripheral edge of the bottom surface 111, and is not arranged on a part of the peripheral edge of the bottom surface 111. That is, the peripheral wall 112 is formed in a C shape when viewed from the normal direction of the bottom surface 111.
  • the peripheral wall 112 has a lid opening 112a that opens in the normal direction of the bottom surface 111 at an end of the peripheral wall 112 that is opposite to the bottom surface 111.
  • the lid opening 112a has, for example, a rectangular shape corresponding to the outer shape of the electronic circuit board 130.
  • the peripheral wall 112 has a first adhesive surface 112a1 on the peripheral surface forming the peripheral edge of the lid opening 112a.
  • the first adhesive surface 112a1 is formed on the outer peripheral surface of the peripheral wall 112 is given as an example, but it can also be formed on the inner peripheral surface of the peripheral wall 112.
  • the first adhesive surface 112a1 has a surface parallel to the axial direction of the peripheral wall 112. Although the details will be described later, the first adhesive surface 112a1 constitutes an adhesive surface with the first intervening member 151.
  • the peripheral wall 112 has a connector opening 112b that opens in the surface direction of the bottom surface 111.
  • the connector opening 112b corresponds to the circumferential opening in the peripheral wall 112.
  • the connector opening 112b is formed on one side of the four sides forming the rectangular shape of the bottom surface 111. More specifically, the connector opening 112b is formed at the center of one side.
  • the connector opening 112b may be formed near the end of one side, or may be formed at a rectangular corner of the bottom surface 111. Further, the connector opening 112b is formed by being continuously connected to the lid opening 112a. That is, the peripheral wall 112 has a second adhesive surface 112b1 which is a U-shaped inner surface with the peripheral edge of the connector opening 112b as a forming portion.
  • the case 110 further has a mounting seat 113 for mounting a fastening member (not shown) for fastening to the lid 120.
  • the case 110 has mounting seats 113 at four corners of a rectangle, for example.
  • the mounting seat 113 is formed with a hole for inserting the fastening member.
  • the connector 140 constituting the connector integrated case 150 is formed separately from the case 110.
  • the connector 140 is fixed to the connector opening 112b of the case 110. Further, the connector 140 electrically connects the electronic circuit board (shown in FIG. 13) to the outside.
  • the connector 140 includes a mating portion 141, an adhesive portion 142, and a plurality of terminals 143.
  • the main body (141, 142) composed of the mating portion 141 and the adhesive portion 142 is formed of, for example, resin.
  • the mating portion 141 and the adhesive portion 142 are integrally formed.
  • the main body (141, 142) of the connector 140 is formed of, for example, general-purpose plastic, engineering plastic, super engineering plastic, or the like as the resin.
  • the case 110 is formed of, for example, ABS, polypropylene, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, or the like as a detailed type of resin.
  • the mating portion 141 is exposed to the outside from the outer surface of the case 110 and constitutes a protruding portion.
  • the mating portion 141 is a portion to be mounted with a connector (not shown) of an external mating member.
  • the mating portion 141 is formed in a tubular shape, for example, in a rectangular tubular shape.
  • the adhesive portion 142 is located on the end side of the mating mounting portion 141, and has an outer peripheral surface 142a centered on the tubular central axis of the mating mounting portion 141.
  • the outer peripheral surface 142a of the adhesive portion 142 has, for example, a rectangular shape, and the three rectangular sides face the U-shaped second adhesive surface 112b1 of the connector opening 112b.
  • the adhesive portion 142 further has a seat surface 142b protruding outward from one side of the outer peripheral surface 142a.
  • the seat surface 142b of the adhesive portion 142 constitutes a surface continuous with the first adhesive surface 112a1 of the peripheral wall 112 in a state where the connector 140 is arranged in the connector opening 112b. That is, the first adhesive surface 112a1 of the peripheral wall 112 and the seat surface 142b of the adhesive portion 142 form a tubular surface continuous in the circumferential direction.
  • the outer cylinder surface is formed by the first adhesive surface 112a1 and the seat surface 142b.
  • the plurality of terminals 143 are formed in an L shape by metal, and one end of the L shape is inserted from the end face on the adhesive portion 142 side toward the mating portion 141 side. The other end of the L-shape of the plurality of terminals 143 is exposed from the adhesive portion 142, and when the connector 140 is arranged in the connector opening 112b, the side opposite to the bottom surface 111, that is, the lid opening 112a Extend to the side.
  • the first intervening member 151 constituting the connector integrated case 150 is made of a polymer viscoelastic material.
  • the first intervening member 151 is interposed between the peripheral wall 112 of the case 110 and the lid 120.
  • the first intervening member 151 is adhered to the first adhesive surface 112a1 which is a peripheral surface forming the peripheral edge of the lid opening 112a on the peripheral wall 112 of the case 110. That is, the first intervening member 151 is formed in a C shape when viewed from the normal direction of the bottom surface 111 of the case 110.
  • the first adhesive surface 112a1 constitutes the outer peripheral surface
  • the first intervening member 151 is formed in a circumferential shape on the outer peripheral side of the first adhesive surface 112a1.
  • the first intervening member 151 has a plurality of lips 151a extending in the circumferential direction on the surface opposite to the first adhesive surface 112a1, in this example, the outer peripheral surface. The portion where the lip 151a comes into contact with the lid 120 in a non-adhesive state. Then, the lip 151a exerts a sealing function with the lid 120 and exerts a holding force of the lid 120. That is, the lip 151a functions as a portion that holds the lid 120 in a non-adhesive state and a sealed state with respect to the lid 120.
  • the first intervening member 151 when the first adhesive surface 112a1 is formed on the inner peripheral surface of the peripheral wall 112, the first intervening member 151 will have a plurality of lips 151a on the inner peripheral surface.
  • the first interposition member 151 is formed of, for example, silicone rubber, ethylene propylene rubber, or the like as a polymer viscoelastic material.
  • silicone rubber ethylene propylene rubber, or the like as a polymer viscoelastic material.
  • the second intervening member 152 constituting the connector integrated case 150 is made of a polymer viscoelastic material.
  • the second intervening member 152 is interposed between the peripheral wall 112 of the case 110 and the connector 140. As shown in FIGS. 13 and 16, the second intervening member 152 is adhered to each of the peripheral edge of the connector opening 112b of the case 110 and the facing surface of the connector 140 with the adhesive portion 142. Then, the second intervening member 152 seals between the peripheral edge of the connector opening 112b and the outer peripheral surface 142a of the adhesive portion 142 of the connector 140.
  • the second intervening member 152 is adhered to the second adhesive surface 112b1, which is the U-shaped inner surface of the peripheral wall 112 of the case 110. Further, the second intervening member 152 is bonded to the U-shaped outer surface of the outer peripheral surface 142a of the bonding portion 142 of the connector 140 facing the second bonding surface 112b1. Therefore, the second intervening member 152 is formed in a U-shape on both side surfaces and the bottom surface 111 side of the outer peripheral surface of the connector 140, excluding the side of the lid opening 112a. Further, the second intervening member 152 is continuously formed on the first intervening member 151. That is, both ends of the U-shape of the second intervening member 152 are continuously formed with both ends of the C-shape of the first intervening member 151.
  • the second intervening member 152 may be formed of the same polymer viscoelastic material as the first intervening member 151, or may be formed of a different polymer viscoelastic material.
  • the second interposition member 152 is formed of, for example, silicone rubber, ethylene propylene rubber, or the like as a polymer viscoelastic material. In particular, by forming the second intervening member 152 with silicone rubber, it is possible to satisfactorily exhibit the sealing function and durability.
  • the second intervening member 152 By forming the second intervening member 152 from the same material as the first intervening member 151, manufacturing becomes easy, and as a result, cost reduction can be achieved.
  • the second intervening member 152 is formed of a material different from that of the first intervening member 151
  • the second intervening member 152 is made of a material having a high adhesive function
  • the first intervening member 151 has a high sealing function by the lip 151a. It can be a material to have. In this way, the material according to the function can be selected.
  • the first auxiliary intervening member 153 constituting the connector integrated case 150 is made of a polymer viscoelastic material.
  • the first auxiliary intervening member 153 is formed at a connection portion between the lid opening 112a and the connector opening 112b.
  • the seat surface 142b of the adhesive portion 142 of the connector 140 is located at the connection portion. Therefore, the first auxiliary intervening member 153 is adhered to the seat surface 142b of the adhesive portion 142, which is a part of the outer surface of the connector 140 in the state of being arranged in the connector opening 112b. Further, the first auxiliary intervening member 153 is continuously formed on the first intervening member 151.
  • the first auxiliary intervening member 153 serves as a portion that supplements the C-shaped cutting region of the first intervening member 151. That is, the first intervening member 151 and the first auxiliary intervening member 153 form a continuous tubular shape in the circumferential direction.
  • the first auxiliary intervening member 153 is continuously formed with the first intervening member 151. Further, the first auxiliary intervening member 153 may be formed continuously with the second intervening member 152. That is, the second intervening member 152 is continuously formed on at least one of the first intervening member 151 and the first auxiliary intervening member 153.
  • the first auxiliary intervening member 153 has a plurality of lips 153a on the surface of the adhesive portion 142 opposite to the seat surface 142b, in this example, the outer surface.
  • the lip 153a is continuously formed with the lip 151a of the first intervening member 151.
  • the lip 153a is a portion that comes into contact with the lid 120 in a non-adhesive state.
  • the lip 153a can exert a sealing function with the lid 120 and exert a holding force of the lid 120. That is, the lip 153a functions as a portion that holds the lid 120 in a non-adhesive state and a sealed state with respect to the lid 120.
  • the first auxiliary intervening member 153 is a member having the same function as the first intervening member 151. Therefore, the first auxiliary intervening member 153 may be formed of the same polymer viscoelastic material as the first intervening member 151. That is, the first auxiliary interposition member 153 is formed of, for example, silicone rubber, ethylene propylene rubber, or the like as the polymer viscoelastic material.
  • the lid 120 closes the lid opening 112a of the case 110.
  • the lid 120 like the case 110, is made of metal or resin.
  • the lid 120 is made of metal such as aluminum, iron, stainless steel, magnesium and the like.
  • the lid 120 is formed of resin, for example, general-purpose plastic, engineering plastic, super engineering plastic, or the like.
  • the lid 120 is formed of, for example, ABS, polypropylene, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, or the like as a detailed type of resin.
  • the lid 120 may be made of metal in order to have at least one of a heat dissipation function and an electromagnetic wave shielding function. Further, when it is not necessary for the lid 120 to have a heat dissipation function and an electromagnetic wave shielding function, the weight can be reduced by adopting a resin.
  • the lid 120 is formed in the shape of a bottomed container corresponding to the case 110.
  • the lid 120 includes a bottom surface 121, a peripheral wall 122, and a mounting seat 123.
  • the bottom surface 121 is formed in a flat plate shape.
  • the outer shape of the bottom surface 121 is formed in the same manner as the outer shape of the bottom surface 111 of the case 110. That is, the outer shape of the bottom surface 121 is formed in a rectangular shape, for example.
  • the peripheral wall 122 is formed so as to surround the peripheral edge of the bottom surface 121 over the entire circumference.
  • the inner peripheral surface of the peripheral wall 122 is a portion that comes into contact with the lip 151a of the first intervening member 151 and the lip 153a of the first auxiliary intervening member 153 in a non-adhesive state.
  • first intervening member 151 is sealed while being sandwiched between the first adhesive surface 112a1 of the peripheral wall 112 of the case 110 and the inner peripheral surface of the peripheral wall 122 of the lid 120. Further, the first auxiliary intervening member 153 is sealed while being sandwiched between the seat surface 142b of the adhesive portion 142 of the connector 140 and the inner peripheral surface of the peripheral wall 122 of the lid 120.
  • the mounting seat 123 is provided at four rectangular corners of the peripheral wall 122 of the lid 120.
  • the mounting seat 123 is located at a position corresponding to the mounting seat 113 of the case 110, and a hole for fastening is formed by a fastening member.
  • the molding die 160 is a mold for molding the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153.
  • the mold 160 has one or more supply ports 161 for supplying a fluid material of a polymer viscoelastic material. That is, the molding die 160 may have one supply port 161 or may have a plurality of supply ports 161.
  • the fluid material of the polymer viscoelastic material is supplied from the supply port 161 of the molding die 160. Then, the fluid material is made to flow between the region of the first intervening member 151, the region of the second interposing member 152, and the region of the first auxiliary intervening member 153.
  • the supply port 161 communicates with the region of the first intervening member 151. In this case, the fluid material flows from the region of the first intervening member 151 to the region of the second intervening member 152, and flows from the region of the first intervening member 151 to the region of the first auxiliary intervening member 153.
  • the fluid material is filled in the region of the first intervening member 151, the region of the second interposing member 152, and the region of the first auxiliary intervening member 153 (step S12).
  • the supply port 161 of the molding die 160 may communicate with the region of the second intervening member 152, or may communicate with the region of the first auxiliary intervening member 153.
  • the fluid material is heated to further solidify the fluid material, whereby the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 are formed ( Step S13).
  • the first intervening member 151 is adhered to the first adhesive surface 112a1 of the case 110 by heating the fluid material.
  • the second intervening member 152 is adhered to the second adhesive surface 112b1 of the case 110 and also to the outer peripheral surface 142a of the adhesive portion 142 of the connector 140.
  • the first auxiliary intervening member 153 is adhered to the seat surface 142b of the adhesive portion 142 of the connector 140. In this way, the connector integrated case 150 is completed.
  • the electronic circuit board 130 is attached to the connector integrated case 150 (step S14).
  • the lid 120 is attached to the connector integrated case 150 (step S15).
  • the peripheral wall 122 of the lid 120 is fitted to the outside of the first adhesive surface 112a1 of the peripheral wall 112 of the case 110 and to the outside of the seat surface 142b of the adhesive portion 142 of the connector 140.
  • the first intervening member 151 is in a compressed state between the first adhesive surface 112a1 of the case 110 and the peripheral wall 122 of the lid 120, and seals and holds the lid 120.
  • the first auxiliary intervening member 153 is in a compressed state between the seat surface 142b of the adhesive portion 142 of the connector 140 and the peripheral wall 122 of the lid 120, and seals the lid 120 while exerting the holding force of the lid 120.
  • the cost can be reduced by forming each element of the case 110, the lid 120, and the connector 140 separately.
  • the connector 140 separately from other elements, it becomes easy to attach the terminal 143 to the main bodies 141 and 142 of the connector 140.
  • the second intervening member 152 interposed between the case 110 and the connector 140 is adhered to both, while the first intervening member 151 interposed between the case 110 and the lid 120 is one. It is not adhered to the lid 120.
  • the first intervening member 151 is adhered to the case 110, but is not adhered to the lid 120, and is held in a non-adhesive state with respect to the lid 120. That is, the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 are adhered to the two elements of the case 110 and the connector 140, and the lid 120 is not the object of adhesion.
  • the objects to be bonded are the case 110, the connector 140, and the lid 120. It becomes three elements of. In this case, it is necessary to form the first intervening member 151 and the second intervening member 152 at different timings. That is, it is necessary to form the intervening members 151 and 152 a plurality of times. On the other hand, in this example, only two elements, the case 110 and the connector 140, are bonded by the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153.
  • the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 can be formed at the same time. It is possible to reduce the number of times the intervening members 151, 152, 153 having an adhesive function are formed.
  • the fluid material can be easily filled in a desired position in the molding die 160.
  • the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 are formed by heating and solidifying the fluid material. That is, the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 are formed at the same time.
  • the first intervening member 151 is adhered to the case 110
  • the second intervening member 152 is adhered to the case 110 and the connector 140
  • the first auxiliary intervening member is adhered to the connector 140 at the same time. Therefore, it is possible to easily fill the mold 160 with the fluid material and to bond the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 to the target. Further, the fluid material can flow between the region of the first intervening member 151, the region of the second intervening member 152, and the region of the first auxiliary intervening member 153, so that the fluid material can be formed in the molding die 160. It can be filled very easily.
  • the cost can be reduced. Further, since the first intervening member 151 and the second intervening member 152 can be formed at the same time, the number of times of filling the fluid material can be reduced. From this as well, it is possible to reduce the cost.
  • the box-shaped electronic unit 3 has a flat outer shape formed by a case 210, a lid 120 (hereinafter, referred to as “first lid 120” for distinction), and a second lid 260.
  • the outer shape of the box-shaped electronic unit 3 is shown as a rectangular flat shape, but it can be a flat shape having an arbitrary shape.
  • An electronic circuit board 130 shown in FIG. 20
  • a second electronic circuit board 270 shown in FIG. 20
  • the first lid 120 and the electronic circuit board 130 have the same configuration as that of the second example.
  • the second electronic circuit board 270 has a different circuit configuration, it has substantially the same configuration as the electronic circuit board 130.
  • the box-type electronic unit 3 further includes a connector 140 on the side surface (peripheral surface) of the flat outer shape formed by the case 210, the first lid 120, and the second lid 260.
  • the connector 140 has the same configuration as that of the second example.
  • the box-type electronic unit 3 includes an electronic circuit board 130, a second electronic circuit board 270, a connector integrated case 280, a first lid 120, and a second lid 260.
  • the connector integrated case 280 is a member in which the case 210 and the connector 140 are integrally formed.
  • the connector integrated case 280 is formed by integrally joining the separately formed case 210 and the connector 140.
  • the connector integrated case 280 further includes a first intervening member 151 interposed between the case 210 and the first lid 120, a second intervening member 282 interposed between the case 210 and the connector 140, and the connector 140 and the first lid.
  • a first auxiliary intervening member 153 interposed between the 120 and 120 is provided.
  • the first intervening member 151 and the first auxiliary intervening member 153 have the same configuration as that of the second example.
  • the connector-integrated case 280 includes a third intervening member 284 interposed between the case 210 and the second lid 260.
  • the connector integrated case 280 will be described with reference to FIGS. 21 to 23.
  • the case 210 constituting the connector integrated case 280 is formed in a flat shape and accommodates the electronic circuit board 130 and the second electronic circuit board 270.
  • the case 210 is made of the same material as the case 110 in the second example.
  • the case 210 is formed in a tubular shape.
  • the case 210 may have a partition plate inside, or may be formed in a through-cylindrical shape.
  • the case 210 includes at least a peripheral wall 211.
  • the peripheral wall 211 is formed in an annular shape, has an annular lid opening 112a that opens at one end in the axial direction, and has a second lid opening 213 that opens at the other end in the annular direction.
  • the peripheral wall 211 has a connector opening 214 that opens in a direction intersecting the annular axial direction.
  • the lid opening 112a has the same configuration as the second example. That is, the peripheral wall 211 has a first adhesive surface 112a1 on the peripheral surface forming the peripheral edge of the lid opening 112a.
  • the first adhesive surface 112a1 constitutes an adhesive surface with the first intervening member 151.
  • the second lid opening 213 is formed at the end opposite to the lid opening 112a.
  • the peripheral wall 211 has a third adhesive surface 213a on the peripheral surface forming the peripheral edge of the second lid opening 213.
  • the case where the third adhesive surface 213a is formed on the outer peripheral surface of the peripheral wall 211 is given as an example, but it can also be formed on the inner peripheral surface of the peripheral wall 211.
  • the third adhesive surface 213a has a surface parallel to the axial direction of the peripheral wall 211.
  • the third adhesive surface 213a is formed with a tubular surface continuous in the circumferential direction. In this example, the third adhesive surface 213a forms an outer cylinder surface.
  • the third adhesive surface 213a constitutes an adhesive surface with the third intervening member 284.
  • the connector opening 214 corresponds to the circumferential opening in the peripheral wall 211.
  • the connector opening 214 is formed by being continuously connected to the lid opening 112a.
  • the connector opening 214 is not connected to the second lid opening 213. That is, the peripheral wall 211 has a U-shaped inner surface with the peripheral edge of the connector opening 214 as a forming portion.
  • the peripheral wall 211 has a second adhesive surface 214a which is a facing side surface of the U-shaped inner surface.
  • the second adhesive surface 214a is formed on the peripheral edge of the connector opening 214 at at least two locations on both side surfaces except the side of the lid opening 112a and the side of the second lid opening 213.
  • the second adhesive surface 214a may be formed in a part of the second lid opening 213 in addition to the above two locations on both side surfaces.
  • the connector opening 214 may be formed by being continuously connected to the lid opening 112a and continuously connected to the second lid opening 213.
  • the peripheral wall 211 has a second adhesive surface 214a, which is two surfaces facing the peripheral wall 211 in the circumferential direction, as the peripheral edge of the connector opening 214.
  • the first intervening member 151 constituting the connector integrated case 280 has the same configuration as the first intervening member 151 of the second example. That is, the first intervening member 151 is adhered to the first adhesive surface 112a1 of the case 210, and is formed in a C shape when viewed from the axial direction of the peripheral wall 211 of the case 210.
  • the second intervening member 282 is formed of a polymer viscoelastic material.
  • the second intervening member 282 is interposed between the peripheral wall 211 of the case 210 and the connector 140. As shown in FIG. 23, the second intervening member 282 is adhered to each of the facing surfaces of the second adhesive surface 214a of the peripheral edge of the connector opening 214 and the outer peripheral surface 142a of the adhesive portion 142 of the connector 140. There is. That is, the second intervening member 282 is formed at two positions on both side surfaces of the outer peripheral surface of the adhesive portion 142 of the connector 140, excluding the side of the lid opening 112a and the side of the second lid opening 213. .. Then, the second intervening member 282 seals between the peripheral edge of the connector opening 214 and the outer peripheral surface 142a of the adhesive portion 142 of the connector 140.
  • the first auxiliary intervening member 153 has the same configuration as the first auxiliary intervening member 153 of the second example.
  • the first auxiliary intervening member 153 is formed continuously with the first intervening member 151.
  • the first auxiliary intervening member 153 may be formed continuously with the second intervening member 282. That is, the second intervening member 282 is continuously formed on at least one of the first intervening member 151 and the first auxiliary intervening member 153.
  • the third interposition member 284 is formed of a polymer viscoelastic material.
  • the third intervening member 284 is interposed between the third adhesive surface 213a of the peripheral wall 211 of the case 210 and the second lid 260. As shown in FIGS. 20 and 23, the third intervening member 284 is adhered to the third adhesive surface 213a, which is a peripheral surface forming the peripheral edge of the second lid opening 213 of the case 210.
  • the third intervening member 284 is formed in a tubular shape continuous in the circumferential direction.
  • the third intervening member 284 is formed in a U shape. Further, the third intervening member 284 is continuously formed with the second intervening member 282.
  • the third intervening member 284 has a plurality of lips 284a extending in the circumferential direction on the surface opposite to the third adhesive surface 213a, in this example, the outer peripheral surface.
  • the lip 284a is a portion that comes into contact with the second lid 260 in a non-adhesive state. Then, the lip 284a exerts a sealing function with the second lid 260 and exerts a holding force of the second lid 260. That is, the lip 284a functions as a portion that holds the second lid 260 in a non-adhesive state and a sealed state with respect to the second lid 260.
  • the third intervening member 284 when the third adhesive surface 213a is formed on the inner peripheral surface of the peripheral wall 211, the third intervening member 284 will have a plurality of lips 284a on the inner peripheral surface. Further, the third intervening member 284 is formed of the same polymer viscoelastic material as the first intervening member 151.
  • the connector integrated case 280 is further interposed between the connector 140 and the second lid 260.
  • a third auxiliary intervening member (not shown) is provided.
  • the third auxiliary intervening member is formed at a connection portion between the second lid opening 213 and the connector opening 214.
  • the third auxiliary intervening member has substantially the same configuration as the first auxiliary intervening member 153.
  • the second lid 260 closes the second lid opening 213 of the case 210.
  • the second lid 260 like the first lid 120, is made of metal or resin.
  • the second lid 260 is formed in the shape of a bottomed container corresponding to the case 210.
  • the second lid 260 includes a bottom surface 261 and a peripheral wall 262.
  • the bottom surface 261 is formed in a flat plate shape.
  • the outer shape of the bottom surface 261 is formed in the same manner as the outer shape of the second lid opening 213 of the case 210. That is, the outer shape of the bottom surface 261 is formed in a rectangular shape, for example.
  • the peripheral wall 262 is formed so as to surround the peripheral edge of the bottom surface 261 over the entire circumference.
  • the inner peripheral surface of the peripheral wall 262 is a portion that comes into contact with the lip 284a of the third intervening member 284 in a non-adhesive state. That is, the third intervening member 284 is sealed while being sandwiched between the third adhesive surface 213a of the peripheral wall 211 of the case 210 and the inner peripheral surface of the peripheral wall 262 of the second lid 260.
  • the molding die 290 is a mold for molding the first intervening member 151, the second intervening member 282, the first auxiliary intervening member 153, and the third intervening member 284.
  • the mold 290 has one or more supply ports 291 for supplying a fluid material of a polymer viscoelastic material.
  • the fluid material of the polymer viscoelastic material is supplied from the supply port 291 of the molding die 290. Then, the fluid material is made to flow between the region of the first intervening member 151, the region of the second intervening member 282, the region of the first auxiliary intervening member 153, and the region of the third intervening member 284.
  • the supply port 291 communicates with the region of the first intervening member 151.
  • the fluid material flows from the region of the first intervening member 151 to the region of the second intervening member 282, and flows from the region of the first intervening member 151 to the region of the first auxiliary intervening member 153. Further, the fluid material flows from the region of the second intervening member 282 to the region of the third intervening member 284.
  • the fluid material is filled in the region of the first intervening member 151, the region of the second intervening member 152, the region of the first auxiliary intervening member 153, and the region of the third intervening member 284 (step S22). ..
  • the supply port 291 of the molding die 290 may communicate with the region of the second intervening member 282, may communicate with the region of the first auxiliary intervening member 153, or may communicate with the region of the third intervening member 153. It may communicate with the area of 284.
  • the fluid material is heated to further solidify the fluid material, whereby the first intervening member 151, the second intervening member 282, the first auxiliary intervening member 153, and the third intervening member are solidified. 284 is formed (step S23).
  • the first intervening member 151 is adhered to the first adhesive surface 112a1 of the case 210 by heating the fluid material.
  • the second intervening member 282 is adhered to the second adhesive surface 214a of the case 210 and also to the outer peripheral surface 142a of the adhesive portion 142 of the connector 140.
  • the first auxiliary intervening member 153 is adhered to the seat surface 142b of the adhesive portion 142 of the connector 140.
  • the third intervening member 284 is adhered to the third adhesive surface 213a of the case 210. In this way, the connector integrated case 280 is completed.
  • the electronic circuit board 130 is attached to the connector integrated case 280 (step S24).
  • the lid 120 is attached to the connector integrated case 280 (step S25).
  • the peripheral wall 122 of the lid 120 is fitted to the outside of the first adhesive surface 112a1 of the peripheral wall 211 of the case 210 and to the outside of the seat surface 142b of the adhesive portion 142 of the connector 140.
  • the first intervening member 151 is in a compressed state between the first adhesive surface 112a1 of the case 210 and the peripheral wall 122 of the lid 120, and seals and holds the lid 120.
  • the first auxiliary intervening member 153 is in a compressed state between the seat surface 142b of the adhesive portion 142 of the connector 140 and the peripheral wall 122 of the lid 120, and seals the lid 120 while exerting the holding force of the lid 120.
  • the integrated object attached up to the lid 120 is inverted, and the second electronic circuit board 270 is attached to the connector integrated case 280 (step S26).
  • the second lid 260 is attached to the connector integrated case 280 (step S27).
  • the peripheral wall 262 of the second lid 260 is fitted to the outside of the third adhesive surface 213a of the peripheral wall 211 of the case 210.
  • the third intervening member 284 is in a compressed state between the third adhesive surface 213a of the case 210 and the peripheral wall 262 of the second lid 260, seals the case 210, and holds the second lid 260.
  • the connector integrated case 280 further includes the third intervening member 284, but the number of manufacturing steps is the same. That is, the first intervening member 151, the second intervening member 282, the first auxiliary intervening member 153, and the third intervening member 284 can be easily formed. As a result, the cost of the box-type electronic unit 3 can be reduced.
  • box-shaped electronic unit 4 of the fourth example (5-1. Appearance of Box-type Electronic Unit 4)
  • the appearance of the box-shaped electronic unit 4 will be described with reference to FIGS. 26 and 27.
  • the box-shaped electronic unit 4 has a flat outer shape formed by the case 310 and the lid 320.
  • the outer shape of the box-shaped electronic unit 4 is shown as a rectangular flat shape, but it can be a flat shape having an arbitrary shape.
  • An electronic circuit board 130 (shown in FIG. 28) is housed inside the case 310 and the lid 320.
  • the electronic circuit board 130 has substantially the same configuration as that of the second example.
  • the box-type electronic unit 4 further includes a connector 340 connected to an external connector on a flat outer flat surface formed by the case 310 and the lid 320.
  • the connector 340 has an oval-shaped connection hole.
  • the connection hole of the connector 340 is formed so as to extend toward the side of the flat outer shape formed by, for example, the case 310 and the lid 320.
  • the connection hole of the connector 340 may be formed so as to extend in the normal direction of the flat outer shape, or may be formed in a direction having an arbitrary angle in the normal direction (for example, a direction of 45 °). It may be formed so as to extend.
  • the terminals of the connector 340 are electrically connected to the electronic circuit board 130 (shown in FIG. 28).
  • the box-type electronic unit 4 includes an electronic circuit board 130, a connector integrated case 350, and a lid 320.
  • the connector integrated case 350 is a member in which the case 310 and the connector 340 are integrally formed.
  • the connector integrated case 350 is formed by integrally joining the separately formed case 310 and the connector 340.
  • the connector-integrated case 350 further includes a first intervening member 351 interposed between the case 310 and the lid 320, and a second intervening member 352 interposed between the case 310 and the connector 340.
  • the connector integrated case 350 will be described with reference to FIGS. 28-30.
  • the case 310 constituting the connector integrated case 350 is formed in a flat shape and accommodates the electronic circuit board 130.
  • the case 310 is made of the same material as the case 110 in the second example.
  • the case 310 is formed in the shape of a bottomed container.
  • the case 310 includes a bottom surface 311 and a peripheral wall 312.
  • the bottom surface 311 is formed in a plane shape, for example, in a rectangular shape.
  • the bottom surface 311 is formed in a shape corresponding to the outer shape of the electronic circuit board 130.
  • the outer surface of the bottom surface 311 is formed in an uneven shape in order to improve heat dissipation.
  • the bottom surface 311 has a connector opening 311a that opens in the normal direction of the bottom surface 311.
  • the connector opening 311a is formed in a rectangular shape, for example.
  • the bottom surface 311 has a second adhesive surface 311a1 on an inner peripheral surface forming the peripheral edge of the connector opening 311a.
  • the central axis (second central axis) of the second adhesive surface 311a1 is an axis parallel to the normal direction of the bottom surface 311.
  • the second adhesive surface 311a1 constitutes an adhesive surface with the second intervening member 352.
  • the connector opening 311a may be formed only on the bottom surface 311 or may have a tubular portion extending in the normal direction from the bottom surface 311 in addition to the bottom surface 311.
  • the peripheral wall 312 is formed so as to surround the peripheral edge of the bottom surface 311 over the entire circumference. That is, the peripheral wall 312 is formed in a tubular shape continuous in the circumferential direction.
  • the peripheral wall 312 has a lid opening 312a that opens in the normal direction of the bottom surface 311 at an end opposite to the bottom surface 311 in the axial direction of the peripheral wall 312.
  • the lid opening 312a has, for example, a rectangular shape corresponding to the outer shape of the electronic circuit board 130.
  • the peripheral wall 312 has a first adhesive surface 312a1 on the peripheral surface forming the peripheral edge of the lid opening 312a.
  • the first adhesive surface 312a1 is formed on the outer peripheral surface of the peripheral wall 312 as an example, but it can also be formed on the inner peripheral surface of the peripheral wall 312.
  • the first adhesive surface 312a1 has a surface parallel to the axial direction of the peripheral wall 312. Although the details will be described later, the first adhesive surface 312a1 constitutes an adhesive surface with the first intervening member 351.
  • the first adhesive surface 312a1 and the second adhesive surface 311a1 are formed independently. That is, the first adhesive surface 312a1 and the second adhesive surface 311a1 are not connected. Further, the central axis of the first adhesive surface 312a1 (first central axis) and the central axis of the second adhesive surface 311a1 are parallel. Therefore, the first adhesive surface 312a1 has a tubular shape having a first central axis, and the second adhesive surface 311a1 has a tubular shape having a second central axis.
  • the case 310 further has a mounting seat 313 for mounting a fastening member (not shown) for fastening to the lid 320.
  • the case 310 has mounting seats 313 at four corners of the rectangle, for example.
  • the mounting seat 313 is formed with a hole for inserting the fastening member.
  • the connector 340 constituting the connector integrated case 350 is formed separately from the case 310.
  • the connector 340 is fixed to the connector opening 311a of the case 310. Further, the connector 340 electrically connects the electronic circuit board (shown in FIG. 28) to the outside.
  • the connector 340 includes a mating portion 341, an adhesive portion 342, and a plurality of terminals 343.
  • the main body (341, 342) composed of the mating portion 341 and the adhesive portion 342 is formed of, for example, resin.
  • the mating portion 341 and the adhesive portion 342 are integrally formed.
  • the mating portion 341 is exposed to the outside from the bottom surface 311 of the case 310 and constitutes a protruding portion.
  • the mating portion 341 is a portion to be mounted with a connector (not shown) of an external mating member.
  • the mating portion 341 is formed, for example, in a tubular shape having a central axis parallel to the surface direction of the bottom surface 311.
  • the mating portion 341 may be formed in a tubular shape having a central axis parallel to the surface normal direction of the bottom surface 311 or having a central axis line at an arbitrary angle in the surface direction of the bottom surface 311. It may be formed in a tubular shape. Further, although the mating portion 341 is formed in a long cylindrical shape, for example, it may be formed in an arbitrary tubular shape.
  • the adhesive portion 342 is located on the end side of the mating portion mounting portion 341, and has, for example, an outer peripheral surface 342a centered on an axis orthogonal to the tubular central axis of the mating mounting portion 341.
  • the adhesive portion 342 may have an outer peripheral surface 342a centered on an axis parallel to or coaxial with the tubular central axis of the mating portion 341, and may be provided on the tubular central axis of the mating mounting portion 341. It may have an outer peripheral surface 342a centered on an axis having an arbitrary angle.
  • the outer peripheral surface 342a of the adhesive portion 342 has, for example, a rectangular shape, and faces the second adhesive surface 311a1 of the connector opening 311a.
  • the plurality of terminals 343 are, for example, formed in an L shape by metal, and are insert-molded into the main body of the connector 340 composed of the mating portion 341 and the adhesive portion 342. One end of the terminal 343 is exposed to the mating portion 341 side, and the other end is exposed to the adhesive portion 342 side.
  • the terminal 343 may be formed in a straight line.
  • the terminal 343 is also formed so as to have an arbitrary angle (for example, 45 °).
  • the first intervening member 351 constituting the connector integrated case 350 is made of a polymer viscoelastic material.
  • the first intervening member 351 is interposed between the peripheral wall 312 of the case 310 and the lid 320. As shown in FIGS. 28 and 31, the first intervening member 351 is adhered to the peripheral edge of the lid opening 312a of the case 310. Specifically, the first intervening member 351 is adhered to the first adhesive surface 312a1, which is a peripheral surface forming the peripheral edge of the lid opening 312a, on the peripheral wall 312 of the case 310. That is, the first intervening member 351 is formed in a tubular shape continuous in the circumferential direction.
  • the first intervening member 351 has a plurality of lips 351a extending in the circumferential direction on the surface opposite to the first adhesive surface 312a1, the outer peripheral surface in this example.
  • the lip 351a is a portion that comes into contact with the lid 320 in a non-adhesive state. Then, the lip 351a exerts a sealing function with the lid 320 and exerts a holding force of the lid 320. That is, the lip 351a functions as a portion that holds the lid 320 in a non-adhesive state and a sealed state with respect to the lid 320.
  • the polymer viscoelastic material forming the first intervening member 351 is the same as the first intervening member 151 of the second example.
  • the second intervening member 352 constituting the connector integrated case 350 is made of a polymer viscoelastic material.
  • the second intervening member 352 is interposed between the peripheral edge of the connector opening 311a on the bottom surface 311 of the case 310 and the connector 340.
  • the second intervening member 352 is adhered to each of the facing surfaces of the second adhesive surface 311a1 on the periphery of the connector opening 311a of the case 310 and the adhesive portion 342 of the connector 340. There is. Therefore, the second intervening member 352 is formed in a tubular shape continuous in the circumferential direction.
  • the second intervening member 352 seals between the second adhesive surface 311a1 of the case 310 and the outer peripheral surface 342a of the adhesive portion 342 of the connector 340.
  • the second intervening member 352 may be formed of the same polymer viscoelastic material as the first interposing member 351 or may be formed of a different polymer viscoelastic material.
  • the lid 320 closes the lid opening 312a of the case 310.
  • the lid 320 is made of metal or resin like the lid 120 of the second example.
  • the lid 320 is formed in the shape of a bottomed container corresponding to the case 310.
  • the lid 320 includes a bottom surface 321, a peripheral wall 322, and a mounting seat 323.
  • the bottom surface 321 is formed in a flat plate shape.
  • the outer shape of the bottom surface 321 is formed in the same manner as the outer shape of the lid opening 312a of the case 310. That is, the outer shape of the bottom surface 321 is formed in a rectangular shape, for example.
  • the peripheral wall 322 is formed so as to surround the peripheral edge of the bottom surface 321 over the entire circumference.
  • the inner peripheral surface of the peripheral wall 322 is a portion that comes into contact with the lip 351a of the first intervening member 351 in a non-adhesive state. That is, the first intervening member 351 is sealed while being sandwiched between the first adhesive surface 312a1 of the peripheral wall 312 of the case 310 and the inner peripheral surface of the peripheral wall 322 of the lid 320.
  • the mounting seat 323 is provided at four rectangular corners of the peripheral wall 322 of the lid 320.
  • the mounting seat 323 is located at a position corresponding to the mounting seat 313 of the case 310, and a hole for fastening is formed by the fastening member.
  • the molding die 360 is a mold for molding the first intervening member 351 and the second intervening member 352.
  • the mold 360 has one or more supply ports 361 for supplying a fluid material of a polymer viscoelastic material.
  • the fluid material of the polymer viscoelastic material is supplied from the supply port 361 of the molding die 360. Then, the fluid material is supplied to the region of the first intervening member 351 and the region of the second intervening member 352. Then, the fluid material is filled in the region of the first intervening member 351 and the region of the second intervening member 352 (step S32).
  • the fluid material is heated to further solidify the fluid material, whereby the first intervening member 351 and the second intervening member 352 are formed (step S33).
  • the first interposition member 351 is adhered to the first adhesive surface 312a1 of the case 310 by heating the fluid material.
  • the second intervening member 352 is adhered to the second adhesive surface 311a1 of the case 310 and also to the outer peripheral surface 342a of the adhesive portion 342 of the connector 340. In this way, the connector integrated case 350 is completed.
  • the electronic circuit board 130 is attached to the connector integrated case 350 (step S34).
  • the lid 320 is attached to the connector integrated case 350 (step S35). Specifically, the peripheral wall 322 of the lid 320 is fitted to the outside of the first adhesive surface 312a1 of the peripheral wall 312 of the case 310. At this time, the first intervening member 351 is in a compressed state between the first adhesive surface 312a1 of the case 310 and the peripheral wall 322 of the lid 320, and seals and holds the lid 320.
  • the first intervening member 351 and the second intervening member 352 can be easily formed as in the second and third examples. As a result, the cost of the box-type electronic unit 4 can be reduced.
  • the box-type electronic unit 5 of the fifth example differs from the box-type electronic unit 4 of the fourth example only in the connector integrated case 450.
  • the connector integrated case 450 will be described with reference to FIGS. 34 and 35.
  • the connector integrated case 450 includes a case 410, a connector 340, a first intervening member 451 and a second intervening member 452, and a first auxiliary intervening member 453.
  • the connector 340 has the same configuration as the connector 340 in the box-type electronic unit 4 of the fourth example.
  • the case 410 includes a bottom surface 411 and a peripheral wall 412.
  • the bottom surface 411 has a connector opening 411a.
  • the inner peripheral surface forming the peripheral edge of the connector opening 411a has a second adhesive surface 411a1.
  • the central axis (second central axis) of the second adhesive surface 411a1 is an axis parallel to the normal direction of the bottom surface 411.
  • the peripheral wall 412 is formed so as to surround the vicinity of the peripheral edge of the bottom surface 411 over the entire circumference. That is, the peripheral wall 412 is formed in a tubular shape continuous in the circumferential direction. However, the peripheral wall 412 is formed so that the connector opening 411a is located outside the peripheral wall 412 at the portion where the connector opening 411a is formed. That is, the peripheral wall 412 is formed in a U shape when viewed from the normal direction of the bottom surface 411 at the portion where the connector opening 411a is formed.
  • the peripheral wall 412 has a lid opening 412a at the end opposite to the bottom surface 411.
  • the peripheral wall 412 has a first adhesive surface 412a1 on the peripheral surface forming the peripheral edge of the lid opening 412a.
  • the case 410 further has a mounting seat 413 for mounting a fastening member (not shown) for fastening to the lid 320.
  • the case 410 has mounting seats 413 at four corners of the rectangle, for example.
  • the mounting seat 413 is formed with a hole for inserting the fastening member.
  • the first intervening member 451 is adhered to a portion of the first adhesive surface 412a1 of the peripheral wall 412 of the case 410 except the portion where the connector opening 411a is formed. That is, the first intervening member 451 is formed in a C shape when viewed from the normal direction of the bottom surface 411.
  • the first intervening member 451 has a plurality of lips 451a extending in the circumferential direction on a surface opposite to the first adhesive surface 412a1.
  • the second intervening member 452 is a U having no first intervening member 451 of the second adhesive surface 411a1 which is the inner peripheral surface of the connector opening 411a of the bottom surface 411 of the case 410 and the first adhesive surface 412a1 of the peripheral wall 412. It is adhered to the character-shaped part. Further, the second intervening member 452 is adhered to the outer peripheral surface 342a (shown in FIG. 29) of the adhesive portion 342 of the connector 340, which faces the first adhesive surface 412a1 and the second adhesive surface 411a1. The second intervening member 452 is formed continuously with the first intervening member 451.
  • the first auxiliary intervening member 453 is adhered to a portion of the outer peripheral surface 342a of the adhesive portion 342 of the connector 340 to which the second intervening member 452 is not adhered.
  • the first auxiliary intervening member 453 has a plurality of lips 453a extending in the circumferential direction on a surface opposite to the outer peripheral surface 342a of the adhesive portion 342 of the connector 340.
  • the first auxiliary intervening member 453 is formed continuously with the first intervening member 451. Further, the lip 453a of the first auxiliary intervening member 453 is also formed continuously with the lip 451a of the first intervening member 451. Further, the first auxiliary intervening member 453 may be formed continuously with the second intervening member 452.
  • the fluid material of the polymer viscoelastic material is supplied, and between the region of the first intervening member 451 and the region of the second intervening member 452 and the region of the first auxiliary intervening member 453.
  • the fluid material can be filled in the region of the first intervening member 451 and the region of the second intervening member 452 and the region of the first auxiliary intervening member 453.
  • the other manufacturing process is the same as the manufacturing process of the box-type electronic unit 4 of the fourth example.
  • Techniques relating to 152, 282, 352, 452, etc. can be applied.
  • the viscoelastic shield layer 90 and any of the intervening members 151,152,153,282,284,351,352,451,452,453 may be molded at the same time or separately. Good.
  • simultaneous molding the same material may be used or different materials may be used. When simultaneous molding with different materials, it can be realized by two-color molding.
  • 1,2,3,4,5 Box type electronic unit, 10: Resin case, 11: Case body, 11a: Bottom surface, 11a1: Heat dissipation opening, 11a2: Recess, 11b: Peripheral wall, 11b1: Outer seat surface, 11b2: Inner seat surface, 11c: Connector holding part, 12: Partition plate, 20: Lid, 30: Electronic circuit board, 31: Board body, 32: Electronic circuit parts, 40: Connector, 50: Electromagnetic shield member, 51: Projection, 60: Electromagnetic wave shielding member, 61: Resin absorbing layer, 62: Metal layer, 62a: Laminated part, 62b: Flange part, 70: Viscoelastic bonding member, 80: Viscoelastic sealing member, 90: Viscoelastic shield layer A0: Internal space, A1: First space, A2: Second space, A3: Third space, A4: Fourth space, B1: First section, B2: Second section, B3: Third section, B4: First Four compartment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Provided is a box-type electronic unit which can exert a desired electromagnetic wave shielding function even when the relative position of a resin case and an electromagnetic wave shield member shifts due to a difference in thermal expansion coefficient. A box-type electronic unit (1) comprises: an electronic circuit board (30); a case (10) for accommodating the electronic circuit board (30); electromagnetic wave shield members (50, 60) which are formed, separately from the case (10), from a material having a thermal expansion coefficient different from that of the case (10), and are attached to the case (10) such that at least a portion thereof is exposed; and a viscoelastic shield layer (90) which is formed from a viscoelastic polymer material having electromagnetic wave shielding properties and is disposed, in contact with the case (10) and the electromagnetic wave shield members (50, 60), across the case (10) and the electromagnetic wave shield members (50, 60).

Description

箱型電子ユニットおよびその製造方法Box-type electronic unit and its manufacturing method
　本発明は、箱型電子ユニットおよびその製造方法に関するものである。 The present invention relates to a box-type electronic unit and a method for manufacturing the same.
　特開２００３－０６９２７５号公報には、筐体シールド構造が記載されている。この筐体シールド構造は、電子回路基板を収容すると共にシールド機能を有するケースと、ケースの開口を覆うシールドカバーとを備える。ケースおよびシールドカバーは、アルミニウム、マグネシウム、亜鉛などの材料を用いてキャスティングにより形成されている。さらに、筐体シールド構造は、ケースとシールドカバーとの間に介在させて挟み込んで配置された導電ゴムにより形成されたパッキンとを備える。つまり、パッキンは、シールド機能および防水機能を有する。従って、ケース内において、完全なシールド構造を形成することができる。 Japanese Unexamined Patent Publication No. 2003-069275 describes a housing shield structure. This housing shield structure includes a case that houses an electronic circuit board and has a shielding function, and a shield cover that covers an opening of the case. The case and shield cover are formed by casting using materials such as aluminum, magnesium and zinc. Further, the housing shield structure includes a packing formed of conductive rubber which is interposed and arranged between the case and the shield cover. That is, the packing has a shielding function and a waterproof function. Therefore, a complete shield structure can be formed in the case.
　特開２００２－１８５１８１号公報には、回路基板とシールド板との間に、電磁波シールドゴム製のガスケットを配置することが記載されている。さらに、特開２００２－１８５１８１号公報には、筐体の内面とシールド板との間に、上記同様のガスケットを配置することが記載されている。 Japanese Patent Application Laid-Open No. 2002-185181 describes that a gasket made of electromagnetic wave shield rubber is arranged between a circuit board and a shield plate. Further, Japanese Patent Application Laid-Open No. 2002-185181 describes that a gasket similar to the above is arranged between the inner surface of the housing and the shield plate.
　また、電子回路基板を収容する箱型電子ユニットは、電子回路基板を収容するケースと、コネクタと、蓋とを備えるものが存在する。特開２０１０－２５８３６０号公報に記載の箱型電子ユニットは、電子回路基板、ケース、コネクタ、蓋を別体に形成しており、接着剤によりケースとコネクタを接着すると共にケースと蓋とを接着している。 In addition, some box-type electronic units that house an electronic circuit board include a case that houses the electronic circuit board, a connector, and a lid. In the box-type electronic unit described in JP-A-2010-258360, an electronic circuit board, a case, a connector, and a lid are separately formed, and the case and the connector are adhered with an adhesive and the case and the lid are adhered to each other. doing.
　特開２００７－２３５０１３号公報に記載の箱型電子ユニットにおいては、電子回路基板とコネクタとが一体に形成されており、他の要素が別体に形成されている。そして、ケースとコネクタとの対向面にシール材を塗布し、ケースと蓋との対向面およびコネクタと蓋との対向面に他のシール材を塗布している。ケースと蓋とは、ビス等の固定具によって固定される。 In the box-type electronic unit described in Japanese Patent Application Laid-Open No. 2007-235013, the electronic circuit board and the connector are integrally formed, and other elements are separately formed. Then, a sealing material is applied to the facing surface between the case and the connector, and another sealing material is applied to the facing surface between the case and the lid and the facing surface between the connector and the lid. The case and lid are fixed by a fixture such as a screw.
　国際公開第２０１８／０１６２６１号に記載の箱型電子ユニットにおいては、ケースとコネクタとが一体に形成されており、蓋がケースおよびコネクタの一体要素とは別体に形成され、ケースおよびコネクタの一体要素と蓋との対向面にシール材が介在している。 In the box-type electronic unit described in International Publication No. 2018/016261, the case and the connector are integrally formed, the lid is formed separately from the integrated element of the case and the connector, and the case and the connector are integrated. A sealing material is interposed on the facing surface between the element and the lid.
　近年、箱型電子ユニットにおいて、ケースは、軽量化、低コスト化の観点から、金属ではなく、樹脂を用いることが増加している。ここで、箱型電子ユニットは、電子回路基板に対して電磁波シールド機能を有することが求められる。電磁波シールド機能には、電磁波を反射する機能と、電磁波を吸収する機能とが含まれる。 In recent years, in box-type electronic units, the use of resin instead of metal for the case has been increasing from the viewpoint of weight reduction and cost reduction. Here, the box-type electronic unit is required to have an electromagnetic wave shielding function with respect to the electronic circuit board. The electromagnetic wave shielding function includes a function of reflecting electromagnetic waves and a function of absorbing electromagnetic waves.
　電磁波シールド機能を有する部位において、樹脂ケースとは熱膨張率が異なる材料により樹脂ケースとは別体に形成された電磁波シールド部材を、樹脂ケースに配置することがある。このような構造において、例えば、樹脂ケースと電磁波シールド部材の周縁との接続部位において、熱膨張率の違いに起因して、両者の相対的位置が変化するおそれがある。この相対的位置の変化によって、隙間が生じ、所望の電磁波シールド機能を発揮できなくなるおそれがある。 In the part having the electromagnetic wave shielding function, an electromagnetic wave shielding member formed separately from the resin case by a material having a coefficient of thermal expansion different from that of the resin case may be arranged in the resin case. In such a structure, for example, at the connection portion between the resin case and the peripheral edge of the electromagnetic wave shield member, the relative positions of the two may change due to the difference in the coefficient of thermal expansion. Due to this change in relative position, a gap may be created and the desired electromagnetic wave shielding function may not be exhibited.
　特開２０１０－２５８３６０号公報に記載の箱型電子ユニットにおいては、コネクタとケースとの接合も、ケースと蓋との接合も、全て接着剤により行っている。通常、ケースにコネクタを接合することと、ケースに蓋を接合することとは、同時に行われず異なるタイミングであるため、接着剤の塗布工程が異なるタイミングで複数回行われる。接着剤の塗布工程の回数が多いことに伴う高コスト化を招来する。特に、作業者が、接着剤を塗布する場合には、接着剤の塗布精度を維持する必要があり、塗布工程が多いほど塗布精度の維持は容易ではない。従って、接着剤として機能する材料の供給回数を低減することが求められる。 In the box-type electronic unit described in Japanese Patent Application Laid-Open No. 2010-258360, both the connector and the case are joined and the case and the lid are joined by an adhesive. Usually, joining the connector to the case and joining the lid to the case are not performed at the same time but at different timings, so that the adhesive application process is performed a plurality of times at different timings. The cost increases due to the large number of adhesive application steps. In particular, when an operator applies an adhesive, it is necessary to maintain the coating accuracy of the adhesive, and it is not easy to maintain the coating accuracy as the number of coating steps increases. Therefore, it is required to reduce the number of times the material functioning as an adhesive is supplied.
　特開２００７－２３５０１３号公報に記載の箱型電子ユニットにおいても、特開２０１０－２５８３６０号公報と同様の接着剤のタイミングに伴う課題を同様に有している。また、国際公開第２０１８／０１６２６１号に記載の箱型電子ユニットは、ケースとコネクタとが一体に形成されているため、接着剤の塗布工程の回数は低減されている。しかし、ケースとコネクタとを一体とするため、当該一体要素の成形が高コストとなる。また、樹脂により一体成形されるため、ケースに、放熱機能や電磁波シールド機能を持たせることが容易ではない。各要素を別体に形成することにより一体要素の成形に伴う高コスト化を防止することが求められる。 The box-type electronic unit described in JP-A-2007-23503 also has the same problems associated with the timing of the adhesive as in JP-A-2010-258360. Further, in the box-type electronic unit described in International Publication No. 2018/016261, since the case and the connector are integrally formed, the number of adhesive application steps is reduced. However, since the case and the connector are integrated, the molding of the integrated element becomes high cost. Further, since it is integrally molded with resin, it is not easy to give the case a heat dissipation function and an electromagnetic wave shielding function. It is required to prevent the cost increase due to the molding of the integrated element by forming each element separately.
　本発明は、熱膨張率の違いに起因して樹脂ケースと電磁波シールド部材との相対的位置が変化したとしても、所望の電磁波シールド機能を発揮することができる箱型電子ユニットを提供することを目的の１つとする。また、本発明は、コネクタを他の要素と別体に形成し、且つ、接合する要素同士の一部のみを接着機能を有する材料により接合することで、接着機能する材料の供給回数を低減することができる箱型電子ユニットおよびその製造方法を提供することを目的の他の１つとする。 The present invention provides a box-shaped electronic unit capable of exhibiting a desired electromagnetic wave shielding function even if the relative positions of the resin case and the electromagnetic wave shielding member change due to the difference in the coefficient of thermal expansion. It is one of the purposes. Further, the present invention reduces the number of times of supplying a material having an adhesive function by forming a connector separately from other elements and joining only a part of the elements to be bonded with a material having an adhesive function. It is one of the other purposes of providing a box-shaped electronic unit capable of providing a method for manufacturing the same.
　（１．第一の箱型電子ユニット）
　第一の箱型電子ユニットは、電子回路基板と、前記電子回路基板を収容する樹脂ケースと、前記ケースとは熱膨張率の異なる材料により前記ケースとは別体に形成され、前記ケースに取り付けられ、少なくとも一部を露出している電磁波シールド部材と、電磁波シールド性を有する高分子粘弾性材料により成形され、前記ケースおよび前記電磁波シールド部材に接触した状態で前記ケースと前記電磁波シールド部材とに跨って配置される粘弾性シールド層とを備える。 (1. First box-type electronic unit)
The first box-shaped electronic unit is formed separately from the case by using an electronic circuit board, a resin case for accommodating the electronic circuit board, and a material having a thermal expansion coefficient different from that of the case, and is attached to the case. The case and the electromagnetic wave shield member are formed in contact with the case and the electromagnetic wave shield member by being formed of an electromagnetic wave shield member that exposes at least a part thereof and a polymer viscoelastic material having an electromagnetic wave shield property. It is provided with a viscoelastic shield layer arranged so as to straddle it.
　当該箱型電子ユニットによれば、電磁波シールド性を有する高分子粘弾性材料により成形された粘弾性シールド層が、電磁波シールド部材に接触した状態で、樹脂ケースと電磁波シールド部材とに跨って配置されている。従って、樹脂ケースと電磁波シールド部材とが熱膨張率の異なる材料により成形されることによって、樹脂ケースと電磁波シールド部材との相対的位置が変化するとしても、粘弾性シールド層が相対的位置の変化に追従することができる。従って、所望の電磁波シールド機能を発揮することができる。 According to the box-shaped electronic unit, a viscoelastic shield layer formed of a polymer viscoelastic material having an electromagnetic wave shielding property is arranged straddling the resin case and the electromagnetic wave shielding member in a state of being in contact with the electromagnetic wave shielding member. ing. Therefore, even if the relative positions of the resin case and the electromagnetic wave shield member change due to the resin case and the electromagnetic wave shield member being molded by materials having different coefficients of thermal expansion, the viscoelastic shield layer changes in the relative position. Can be followed. Therefore, the desired electromagnetic wave shielding function can be exhibited.
　（２．第二の箱型電子ユニット）
　第二の箱型電子ユニットは、電子回路基板と、前記電子回路基板を収容し、蓋用開口部およびコネクタ用開口部を有するケースと、前記ケースの前記蓋用開口部を閉塞する蓋と、前記ケースと別体に形成され、前記ケースの前記コネクタ用開口部に固定され、前記電子回路基板と外部とを電気的に接続するコネクタと、高分子粘弾性材料により形成され、前記ケースの前記蓋用開口部の周縁に接着され、前記蓋に対して非接着状態であり且つシールした状態で前記蓋を保持する第一介在部材と、高分子粘弾性材料により形成され、前記ケースの前記コネクタ用開口部の周縁と前記コネクタとの対向面のそれぞれに接着され、且つ、前記コネクタ用開口部の周縁と前記コネクタとの間をシールする第二介在部材とを備える。 (2. Second box-type electronic unit)
The second box-shaped electronic unit includes an electronic circuit board, a case that houses the electronic circuit board and has a lid opening and a connector opening, and a lid that closes the lid opening of the case. The case is formed separately from the case, fixed to the opening for the connector of the case, and formed of a connector that electrically connects the electronic circuit board and the outside, and a polymer viscoelastic material. The connector of the case, formed of a first interposition member that is adhered to the peripheral edge of the lid opening and holds the lid in a non-adherent and sealed state to the lid, and a polymer viscoelastic material. It is provided with a second intervening member that is adhered to each of the peripheral edge of the opening for the connector and the facing surface of the connector and that seals between the peripheral edge of the opening for the connector and the connector.
　コネクタを他の要素と別体に形成することにより、低コスト化を図ることができる。特に、コネクタを他要素と別体に形成することにより、コネクタの本体に端子を装着することが容易となる。 Cost reduction can be achieved by forming the connector separately from other elements. In particular, by forming the connector separately from other elements, it becomes easy to attach the terminal to the main body of the connector.
　さらに、ケースとコネクタとの間に介在する第二介在部材は、両者に接着しているのに対して、ケースと蓋との間に介在する第一介在部材は、一方である蓋に接着していない。第一介在部材は、ケースに接着されるが、蓋には接着されておらず、蓋に対して非接着状態で保持する。つまり、第一介在部材および第二介在部材は、ケースとコネクタの２要素に接着されており、蓋を接着対象としていない。このように、介在部材により接着する対象をケースとコネクタのみとすることにより、接着機能する介在部材の形成回数を低減することができる。 Further, the second intervening member interposed between the case and the connector is adhered to both, while the first intervening member interposed between the case and the lid is adhered to one lid. Not. The first intervening member is adhered to the case, but not to the lid, and is held in a non-adhesive state with respect to the lid. That is, the first intervening member and the second intervening member are adhered to the two elements of the case and the connector, and the lid is not the object of adhesion. In this way, by limiting the objects to be bonded by the intervening member to only the case and the connector, the number of times the intervening member having an adhesive function is formed can be reduced.
　（３．箱型電子ユニットの製造方法）
　箱型電子ユニットの製造方法は、上記の第二の箱型電子ユニットの製造方法であって、前記ケースおよび前記コネクタを型内に配置する工程と、高分子粘弾性材料の流動性素材を供給し、前記第一介在部材の領域および前記第二介在部材の領域に前記流動性素材を充填する工程と、加熱し且つ前記流動性素材を固化させることにより前記第一介在部材および前記第二介在部材を形成する工程と、前記蓋を装着する工程とを備える。 (3. Manufacturing method of box-type electronic unit)
The method for manufacturing the box-type electronic unit is the above-mentioned method for manufacturing the second box-type electronic unit, which comprises a step of arranging the case and the connector in the mold and supplying a fluid material of a polymer viscoelastic material. Then, the step of filling the area of the first intervening member and the area of the second intervening member with the fluid material, and the step of heating and solidifying the fluid material to solidify the first intervening member and the second interposition member. It includes a step of forming a member and a step of attaching the lid.
　高分子粘弾性材料の流動性素材を用いることで、流動性素材を型内の所望位置に容易に充填することができる。そして、流動性素材を加熱し且つ固化させることにより、第一介在部材および第二介在部材を形成することにより、第一介在部材および第二介在部材が同時に形成される。換言すると、流動性素材の加熱および固化により、第一介在部材がケースに接着されると同時に、第二介在部材がケースおよびコネクタに接着される。従って、流動性素材を型内に充填させることと、第一介在部材および第二介在部材を接着させることとが、容易に行うことができる。その結果、低コスト化を図ることができる。さらに、第一介在部材と第二介在部材とを同時に形成することができるため、充填回数を低減することができる。このことからも、低コスト化を図ることができる。 By using the fluid material of the polymer viscoelastic material, the fluid material can be easily filled in the desired position in the mold. Then, by heating and solidifying the fluid material, the first intervening member and the second intervening member are formed, so that the first intervening member and the second intervening member are formed at the same time. In other words, the heating and solidification of the fluid material causes the first intervening member to adhere to the case and at the same time the second intervening member to adhere to the case and connector. Therefore, it is possible to easily fill the mold with the fluid material and to bond the first intervening member and the second interposing member. As a result, the cost can be reduced. Further, since the first intervening member and the second intervening member can be formed at the same time, the number of fillings can be reduced. From this as well, it is possible to reduce the cost.
第一例の箱型電子ユニットの外観を上方から見た斜視図である。It is a perspective view which looked at the appearance of the box-shaped electronic unit of 1st example from above. 第一例の箱型電子ユニットの外観を下方から見た斜視図である。It is a perspective view which looked at the appearance of the box-shaped electronic unit of 1st example from the bottom. 第一例の箱型電子ユニットの分解斜視図である。It is an exploded perspective view of the box type electronic unit of 1st example. 第一例の箱型電子ユニットにおける一部構造体のさらなる分解斜視図である。It is a further exploded perspective view of a part structure in the box type electronic unit of 1st example. 図１のＡ－Ａ断面の拡大図である。It is an enlarged view of the cross section AA of FIG. 第一例の箱型電子ユニットの製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the box type electronic unit of 1st example. 図６のステップＳ２における製造物を示す断面図である。It is sectional drawing which shows the product in step S2 of FIG. 図６のステップＳ４における第二型内における対象物を示す断面図である。It is sectional drawing which shows the object in the 2nd type in step S4 of FIG. 図６のステップＳ５における製造物を示す断面図である。It is sectional drawing which shows the product in step S5 of FIG. 図６のステップＳ６，Ｓ７における製造物を示す断面図である。It is sectional drawing which shows the product in steps S6 and S7 of FIG. 第二例の箱型電子ユニットの斜視図である。It is a perspective view of the box type electronic unit of the second example. 図１１の裏面側からみた第二例の箱型電子ユニットの斜視図である。It is a perspective view of the box type electronic unit of the 2nd example seen from the back surface side of FIG. 第二例の箱型電子ユニットの分解斜視図である。It is an exploded perspective view of the box type electronic unit of the second example. 第二例の箱型電子ユニットを構成するコネクタ一体ケースのうち、ケースおよびコネクタを示す分解斜視図である。It is an exploded perspective view which shows the case and the connector among the connector integrated cases constituting the box type electronic unit of the 2nd example. 図１４の裏面側から見たコネクタ一体ケースの分解斜視図である。It is an exploded perspective view of the connector integrated case seen from the back side of FIG. 図１３に示すコネクタ一体ケースにおいて、コネクタを除いた部分の斜視図である。It is a perspective view of the part excluding the connector in the connector integrated case shown in FIG. 第二例の箱型電子ユニットの製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the box type electronic unit of the 2nd example. 成形型にケースおよびコネクタを配置した状態の斜視図である。It is a perspective view of the state where the case and the connector are arranged in the molding die. 第三例の箱型電子ユニットの斜視図である。It is a perspective view of the box type electronic unit of the 3rd example. 第三例の箱型電子ユニットの分解斜視図である。It is an exploded perspective view of the box-shaped electronic unit of the third example. 第三例の箱型電子ユニットを構成するコネクタ一体ケースのうち、ケースおよびコネクタを示す分解斜視図である。It is an exploded perspective view which shows the case and the connector among the connector integrated cases constituting the box type electronic unit of 3rd example. 図２１の裏面側から見たコネクタ一体ケースの分解斜視図である。It is an exploded perspective view of the connector integrated case seen from the back side of FIG. 21. 図２０に示すコネクタ一体ケースにおいて、コネクタを除いた部分の斜視図である。It is a perspective view of the part excluding the connector in the connector integrated case shown in FIG. 第三例の箱型電子ユニットの製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the box type electronic unit of 3rd example. 成形型にケースおよびコネクタを配置した状態の斜視図である。It is a perspective view of the state where the case and the connector are arranged in the molding die. 第四例の箱型電子ユニットの斜視図である。It is a perspective view of the box type electronic unit of the 4th example. 図２６の裏面側からみた第二例の箱型電子ユニットの斜視図である。It is a perspective view of the box-shaped electronic unit of the second example seen from the back surface side of FIG. 26. 第四例の箱型電子ユニットの分解斜視図である。It is an exploded perspective view of the box type electronic unit of the 4th example. 第四例の箱型電子ユニットを構成するコネクタ一体ケースのうち、ケースおよびコネクタを示す分解斜視図である。It is an exploded perspective view which shows the case and the connector among the connector integrated cases constituting the box type electronic unit of 4th example. 図２９の裏面側から見たコネクタ一体ケースの分解斜視図である。It is an exploded perspective view of the connector integrated case seen from the back side of FIG. 29. 図２８に示すコネクタ一体ケースにおいて、コネクタを除いた部分の斜視図である。It is a perspective view of the part excluding the connector in the connector integrated case shown in FIG. 28. 第四例の箱型電子ユニットの製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the box type electronic unit of 4th example. 成形型にケースおよびコネクタを配置した状態の斜視図である。It is a perspective view of the state where the case and the connector are arranged in the molding die. 第五例の箱型電子ユニットを構成するコネクタ一体ケースの斜視図である。It is a perspective view of the connector integrated case which constitutes the box type electronic unit of 5th example. 第五例の箱型電子ユニットを構成するケースの斜視図である。It is a perspective view of the case which constitutes the box type electronic unit of the 5th example.
　（１．適用対象）
　箱型電子ユニットは、電子回路基板を収容するユニットであって、防滴、防水が要求されるユニットである。箱型電子ユニットは、内部に収容した電子回路基板の熱を外部に放熱するために、放熱機能を有する。さらに、箱型電子ユニットは、内部に収容した電子回路基板が外部から電磁波ノイズの影響を受けにくくするために、電磁波シールド機能を有する。 (1. Applicable target)
The box-type electronic unit is a unit that houses an electronic circuit board and is required to be drip-proof and waterproof. The box-type electronic unit has a heat dissipation function in order to dissipate the heat of the electronic circuit board housed inside to the outside. Further, the box-type electronic unit has an electromagnetic wave shielding function in order to make the electronic circuit board housed inside less susceptible to electromagnetic wave noise from the outside.
　箱型電子ユニットは、例えば、自動車のＥＣＵ（電子制御ユニット）に適用される。箱型電子ユニットは、例えば、自動車のＥＣＵとして、エンジンＥＣＵ、モータＥＣＵ、エアコンＥＣＵ、カメラＥＣＵ、レーダＥＣＵなどに適用される。 The box-type electronic unit is applied to, for example, an automobile ECU (electronic control unit). The box-type electronic unit is applied to, for example, an engine ECU, a motor ECU, an air conditioner ECU, a camera ECU, a radar ECU, and the like as an automobile ECU.
　（２．第一例の箱型電子ユニット１）
　（２－１．第一例の箱型電子ユニット１の外観）
　第一例の箱型電子ユニット１の外観について、図１および図２を参照して説明する。箱型電子ユニット１は、図１および図２に示すように、樹脂ケース１０と蓋２０とにより扁平状の外形を有する。本例では、箱型電子ユニット１の外形は、矩形扁平状を図示するが、他の多角形、円形等の任意の形状を有する扁平状とすることができる。樹脂ケース１０と蓋２０の内部には、電子回路基板３０（図３に示す）が収容されている。また、樹脂ケース１０には、裏面において、貫通した放熱用開口１１ａ１を備える。さらに、樹脂ケース１０は、裏面において、非貫通の凹所１１ａ２を備える。 (2. Box-type electronic unit 1 of the first example)
(2-1. Appearance of the box-shaped electronic unit 1 of the first example)
The appearance of the box-shaped electronic unit 1 of the first example will be described with reference to FIGS. 1 and 2. As shown in FIGS. 1 and 2, the box-shaped electronic unit 1 has a flat outer shape due to the resin case 10 and the lid 20. In this example, the outer shape of the box-shaped electronic unit 1 is shown as a rectangular flat shape, but it can be a flat shape having an arbitrary shape such as another polygon or a circle. An electronic circuit board 30 (shown in FIG. 3) is housed inside the resin case 10 and the lid 20. Further, the resin case 10 is provided with a heat dissipation opening 11a1 that penetrates on the back surface. Further, the resin case 10 is provided with a non-penetrating recess 11a2 on the back surface.
　箱型電子ユニット１は、さらに、樹脂ケース１０と蓋２０とにより形成される扁平状の外形から外部に突出するコネクタ４０を備える。コネクタ４０は、外部コネクタ（図示せず）に嵌め込まれると共に電気的に接続される。コネクタ４０の端子は、電子回路基板３０（図３に示す）の端子に接触することにより、電気的に接続されている。ここで、本例では、箱型電子ユニット１は、１つのコネクタ４０を備える場合を例に挙げるが、複数のコネクタ４０を備えることもできる。 The box-type electronic unit 1 further includes a connector 40 that protrudes outward from a flat outer shape formed by the resin case 10 and the lid 20. The connector 40 is fitted into an external connector (not shown) and electrically connected. The terminals of the connector 40 are electrically connected by contacting the terminals of the electronic circuit board 30 (shown in FIG. 3). Here, in this example, the case where the box-type electronic unit 1 includes one connector 40 is given as an example, but a plurality of connectors 40 may also be provided.
　箱型電子ユニット１は、さらに、樹脂ケース１０の裏面に露出する電磁波シールド部材５０を備える。電磁波シールド部材５０は、放熱機能を有するヒートシンクである。電磁波シールド部材５０は、樹脂ケース１０の放熱用開口１１ａ１に嵌め込まれている。放熱機能を有する電磁波シールド部材５０は、放熱効果を高めるために、樹脂ケース１０の裏面から突出する複数の突起を備える。 The box-type electronic unit 1 further includes an electromagnetic wave shielding member 50 exposed on the back surface of the resin case 10. The electromagnetic wave shield member 50 is a heat sink having a heat dissipation function. The electromagnetic wave shield member 50 is fitted in the heat dissipation opening 11a1 of the resin case 10. The electromagnetic wave shield member 50 having a heat dissipation function includes a plurality of protrusions protruding from the back surface of the resin case 10 in order to enhance the heat dissipation effect.
　（２－２．箱型電子ユニット１の各要素の構成）
　箱型電子ユニット１の各要素の構成について、図３－図５を参照して説明する。図３に示すように、箱型電子ユニット１は、樹脂ケース１０と、蓋２０と、電子回路基板３０と、コネクタ４０と、電磁波シールド部材５０，６０と、粘弾性接合部材７０と、粘弾性シール部材８０と、粘弾性シールド層９０とを備える。 (2-2. Configuration of each element of the box-type electronic unit 1)
The configuration of each element of the box-type electronic unit 1 will be described with reference to FIGS. 3 to 5. As shown in FIG. 3, the box-shaped electronic unit 1 includes a resin case 10, a lid 20, an electronic circuit board 30, a connector 40, electromagnetic wave shielding members 50 and 60, a viscoelastic joining member 70, and viscoelasticity. A seal member 80 and a viscoelastic shield layer 90 are provided.
　樹脂ケース１０は、樹脂材料により容器形状に形成されている。樹脂ケース１０を形成する樹脂材料は、導電性を有しない樹脂材料である。つまり、当該樹脂材料は、シールド機能を有しない。当該樹脂材料は、例えば、汎用プラスチック、エンプラ、スーパーエンプラなどにより形成される。詳細には、当該樹脂材料は、例えば、ＡＢＳ、ポリプロピレン、ポリカーボネート、ポリブチレンテレフタレート、ポリフェニレンサルファイド等である。 The resin case 10 is formed in a container shape by a resin material. The resin material forming the resin case 10 is a resin material having no conductivity. That is, the resin material does not have a shielding function. The resin material is formed of, for example, general-purpose plastic, engineering plastic, super engineering plastic, or the like. Specifically, the resin material is, for example, ABS, polypropylene, polycarbonate, polybutylene terephthalate, polyphenylene sulfide and the like.
　また、樹脂ケース１０は、図４に示すように、ケース本体１１と仕切板１２とを備えており、ケース本体１１と仕切板１２とを一体成形された部材である。ケース本体１１は、内部空間Ａ０を形成する容器形状に形成され、図４の上方に主開口を有している。本例では、ケース本体１１は、矩形の容器形状に形成されている。ケース本体１１は、図４に示すように、底面１１ａと、底面１１ａの周縁に立設された周壁１１ｂと、コネクタ保持部１１ｃとを備える。従って、ケース本体１１は、周壁１１ｂの先端によって形成される主開口を有する。 Further, as shown in FIG. 4, the resin case 10 includes a case main body 11 and a partition plate 12, and is a member in which the case main body 11 and the partition plate 12 are integrally molded. The case body 11 is formed in the shape of a container forming the internal space A0, and has a main opening above FIG. In this example, the case body 11 is formed in a rectangular container shape. As shown in FIG. 4, the case main body 11 includes a bottom surface 11a, a peripheral wall 11b erected on the peripheral edge of the bottom surface 11a, and a connector holding portion 11c. Therefore, the case body 11 has a main opening formed by the tip of the peripheral wall 11b.
　ケース本体１１の底面１１ａは、例えば、矩形板状に形成されている。底面１１ａは、図５に示すように、底面１１ａの法線方向に貫通する放熱用開口１１ａ１を備える。放熱用開口１１ａ１は、電子回路基板３０により生じた熱を外部へ排出するための開口である。本例では、放熱用開口１１ａ１は、矩形開口である。さらに、ケース本体１１の底面１１ａは、図５に示すように、放熱用開口１１ａ１とは異なる位置に、底面１１ａの外面側に、非貫通の凹所１１ａ２を備える。 The bottom surface 11a of the case body 11 is formed in a rectangular plate shape, for example. As shown in FIG. 5, the bottom surface 11a includes a heat dissipation opening 11a1 that penetrates the bottom surface 11a in the normal direction. The heat dissipation opening 11a1 is an opening for discharging the heat generated by the electronic circuit board 30 to the outside. In this example, the heat dissipation opening 11a1 is a rectangular opening. Further, as shown in FIG. 5, the bottom surface 11a of the case body 11 is provided with a non-penetrating recess 11a2 on the outer surface side of the bottom surface 11a at a position different from the heat dissipation opening 11a1.
　ケース本体１１の周壁１１ｂは、図４に示すように、内側に、電子回路基板３０を収容する空間Ａ０を形成する。本例では、周壁１１ｂは、底面１１ａの周縁全周に設けられている。つまり、周壁１１ｂは、矩形枠状に形成されている。そして、周壁１１ｂの先端によって、矩形の主開口が形成される。 As shown in FIG. 4, the peripheral wall 11b of the case body 11 forms a space A0 for accommodating the electronic circuit board 30 inside. In this example, the peripheral wall 11b is provided on the entire peripheral edge of the bottom surface 11a. That is, the peripheral wall 11b is formed in a rectangular frame shape. Then, a rectangular main opening is formed by the tip of the peripheral wall 11b.
　周壁１１ｂの四隅には、蓋２０の四隅を支持する外側座面１１ｂ１が形成されている。また、周壁１１ｂより形成される内部空間Ａ０の四隅には、電子回路基板３０の四隅を支持する内側座面１１ｂ２が形成されている。 At the four corners of the peripheral wall 11b, outer seating surfaces 11b1 that support the four corners of the lid 20 are formed. Further, at the four corners of the internal space A0 formed from the peripheral wall 11b, inner seat surfaces 11b2 that support the four corners of the electronic circuit board 30 are formed.
　コネクタ保持部１１ｃは、図４に示すように、周壁１１ｂの一部に形成されている。本例では、コネクタ保持部１１ｃは、周壁１１ｂの一辺に、底面１１ａの法線方向に貫通する孔である。他の例としては、コネクタ保持部１１ｃは、周壁１１ｂの一辺に、底面１１ａの面方向に貫通する孔または切欠としてもよい。 As shown in FIG. 4, the connector holding portion 11c is formed in a part of the peripheral wall 11b. In this example, the connector holding portion 11c is a hole that penetrates one side of the peripheral wall 11b in the normal direction of the bottom surface 11a. As another example, the connector holding portion 11c may be a hole or a notch on one side of the peripheral wall 11b that penetrates in the surface direction of the bottom surface 11a.
　仕切板１２は、図４に示すように、ケース本体１１の内部空間Ａ０に設けられている。仕切板１２は、基端が底面１１ａに接続され、周壁１１ｂに対向するように形成されている。ただし、仕切板１２の一部は、周壁１１ｂに接続されている。従って、仕切板１２は、ケース本体１１の内部空間Ａ０を、複数の空間Ａ１，Ａ２，Ａ３，Ａ４に仕切る。 As shown in FIG. 4, the partition plate 12 is provided in the internal space A0 of the case body 11. The partition plate 12 is formed so that the base end is connected to the bottom surface 11a and faces the peripheral wall 11b. However, a part of the partition plate 12 is connected to the peripheral wall 11b. Therefore, the partition plate 12 partitions the internal space A0 of the case body 11 into a plurality of spaces A1, A2, A3, and A4.
　複数の空間Ａ１，Ａ２，Ａ３，Ａ４のそれぞれは、電磁波シールド機能を有する。ここで、電磁波シールド機能は、電磁波を反射する機能、電磁波を吸収する機能を含む。空間Ａ１－Ａ４は、全て同一の電磁波シールド機能を有するようにしてもよいし、異なる電磁波シールド機能を有するようにしてもよい。 Each of the plurality of spaces A1, A2, A3, and A4 has an electromagnetic wave shielding function. Here, the electromagnetic wave shielding function includes a function of reflecting electromagnetic waves and a function of absorbing electromagnetic waves. The spaces A1-A4 may all have the same electromagnetic wave shielding function, or may have different electromagnetic wave shielding functions.
　本例では、第一空間Ａ１は、電磁波を吸収する機能を有する電磁波吸収空間である。第二空間Ａ２、第三空間Ａ３、第四空間Ａ４は、電磁波を反射する機能を有する。また、図３に示すように、第一空間Ａ１は、ケース本体１１の内部空間Ａ０における中央に位置する矩形空間である。第一空間Ａ１は、底面１１ａと仕切板１２により形成される。 In this example, the first space A1 is an electromagnetic wave absorption space having a function of absorbing electromagnetic waves. The second space A2, the third space A3, and the fourth space A4 have a function of reflecting electromagnetic waves. Further, as shown in FIG. 3, the first space A1 is a rectangular space located at the center of the internal space A0 of the case body 11. The first space A1 is formed by the bottom surface 11a and the partition plate 12.
　第二空間Ａ２は、ケース本体１１の内部空間Ａ０における周囲のうち、コネクタ保持部１１ｃとは反対側に位置する大きな空間である。第二空間Ａ２は、底面１１ａ、周壁１１ｂの一部、および、仕切板１２により形成される。また、第二空間Ａ２を形成する底面１１ａに、放熱用開口１１ａ１が形成されている。 The second space A2 is a large space located on the opposite side of the internal space A0 of the case body 11 from the connector holding portion 11c. The second space A2 is formed by a bottom surface 11a, a part of the peripheral wall 11b, and a partition plate 12. Further, a heat dissipation opening 11a1 is formed on the bottom surface 11a forming the second space A2.
　第三空間Ａ３は、ケース本体１１の内部空間Ａ０における周囲のうち、コネクタ保持部１１ｃ側に位置する空間である。第三空間Ａ３は、底面１１ａ、周壁１１ｂの一部、および、仕切板１２により形成される。第四空間Ａ４は、ケース本体１１の内部空間Ａ０における周囲のうち、コネクタ保持部１１ｃ側に位置する空間である。第四空間Ａ４は、底面１１ａ、周壁１１ｂの一部、および、仕切板１２により形成される。 The third space A3 is a space located on the connector holding portion 11c side of the periphery of the internal space A0 of the case body 11. The third space A3 is formed by a bottom surface 11a, a part of the peripheral wall 11b, and a partition plate 12. The fourth space A4 is a space located on the connector holding portion 11c side of the periphery of the internal space A0 of the case body 11. The fourth space A4 is formed by a bottom surface 11a, a part of the peripheral wall 11b, and a partition plate 12.
　蓋２０は、図３に示すように、ケース本体１１の主開口、すなわち、周壁１１ｂの先端によって形成される主開口を閉塞する。蓋２０は、ケース本体１１の周壁１１ｂの外側座面１１ｂ１に支持され、締結部材（図示せず）によって締結される。また、本例では、図３に示すように、蓋２０は、板状、例えば矩形板状に形成されている。ただし、蓋２０は、ケース本体１１を上下反転させた形状、すなわち内側に空間を有する形状に形成してもよい。 As shown in FIG. 3, the lid 20 closes the main opening of the case body 11, that is, the main opening formed by the tip of the peripheral wall 11b. The lid 20 is supported by the outer seat surface 11b1 of the peripheral wall 11b of the case body 11, and is fastened by a fastening member (not shown). Further, in this example, as shown in FIG. 3, the lid 20 is formed in a plate shape, for example, a rectangular plate shape. However, the lid 20 may be formed so that the case body 11 is turned upside down, that is, a shape having a space inside.
　電子回路基板３０は、図５に示すように、基板本体３１に電子回路部品３２を実装している。本例では、電子回路部品３２は、基板本体３１における図５の下面側、すなわち、樹脂ケース１０側の面に実装されている。ただし、電子回路部品３２は、基板本体３１における図５の上面側、すなわち、蓋２０側の面にも実装してもよい。電子回路基板３０の四隅は、ケース本体１１の周壁１１ｂの内側座面１１ｂ２に支持される。 As shown in FIG. 5, the electronic circuit board 30 has an electronic circuit component 32 mounted on a board body 31. In this example, the electronic circuit component 32 is mounted on the lower surface side of FIG. 5 of the substrate main body 31, that is, the surface on the resin case 10 side. However, the electronic circuit component 32 may also be mounted on the upper surface side of FIG. 5 of the substrate main body 31, that is, the surface on the lid 20 side. The four corners of the electronic circuit board 30 are supported by the inner seating surface 11b2 of the peripheral wall 11b of the case body 11.
　ここで、電子回路基板３０は、図５に示すように、複数の区画Ｂ１，Ｂ２，Ｂ３，Ｂ４を有する。第一区画Ｂ１に配置されている電子回路部品は、第一空間Ａ１に配置され、第二区画Ｂ２に配置されている電子回路部品は、第二空間Ａ２に配置されている。第三区画Ｂ３に配置されている電子回路部品は、第三空間Ａ３に配置され、第四区画Ｂ４に配置されている電子回路部品は、第四空間Ａ４に配置されている。 Here, as shown in FIG. 5, the electronic circuit board 30 has a plurality of compartments B1, B2, B3, and B4. The electronic circuit components arranged in the first section B1 are arranged in the first space A1, and the electronic circuit parts arranged in the second section B2 are arranged in the second space A2. The electronic circuit components arranged in the third section B3 are arranged in the third space A3, and the electronic circuit parts arranged in the fourth section B4 are arranged in the fourth space A4.
　さらに、電子回路基板３０は、ケース本体１１の周壁１１ｂの内側座面１１ｂ２に加えて、仕切板１２の先端面によっても支持される。つまり、電子回路基板３０の中央部が、仕切板１２によって支持される。特に、仕切板１２は、各区画Ｂ１－Ｂ４の境界面を支持する。 Further, the electronic circuit board 30 is supported by the tip surface of the partition plate 12 in addition to the inner seat surface 11b2 of the peripheral wall 11b of the case body 11. That is, the central portion of the electronic circuit board 30 is supported by the partition plate 12. In particular, the partition plate 12 supports the boundary surface of each compartment B1-B4.
　図３および図５に示すように、コネクタ４０の一部は、ケース本体１１のコネクタ保持部１１ｃに保持され、コネクタ４０の残りの一部は、ケース本体１１の外面から外方に突出している。本例では、コネクタ４０は、角度を有しているが、角度を有しない直線状に形成されるようにしてもよい。また、コネクタ４０が角度を有する場合、任意の角度とすることができる。 As shown in FIGS. 3 and 5, a part of the connector 40 is held by the connector holding portion 11c of the case main body 11, and the remaining part of the connector 40 projects outward from the outer surface of the case main body 11. .. In this example, the connector 40 may be formed in a straight line having an angle but not having an angle. Further, when the connector 40 has an angle, it can be any angle.
　なお、コネクタ４０は、樹脂ケース１０および蓋２０とは別体に形成した場合を例に挙げた。この他に、コネクタ４０は、樹脂ケース１０のケース本体１１と同一成形されるようにしてもよい。この場合、ケース本体１１は、コネクタ保持部１１ｃを有さず、コネクタ４０の一部が、第三空間Ａ３を形成する壁面を構成する。 The case where the connector 40 is formed separately from the resin case 10 and the lid 20 is taken as an example. In addition to this, the connector 40 may be formed in the same shape as the case body 11 of the resin case 10. In this case, the case body 11 does not have the connector holding portion 11c, and a part of the connector 40 constitutes a wall surface forming the third space A3.
　電磁波シールド部材５０は、電磁波シールド機能を有すると共に、放熱機能を有する。つまり、電磁波シールド部材５０は、ヒートシンクである。電磁波シールド部材５０は、例えば、アルミニウム、銅、鉄等の伝熱特性の良好な金属材料により形成されている。もちろん、電磁波シールド部材５０は、金属材料以外の材料により形成してもよい。従って、電磁波シールド部材５０は、樹脂ケース１０とは熱膨張率の異なる材料により、樹脂ケース１０とは別体に形成されている。 The electromagnetic wave shield member 50 has an electromagnetic wave shield function and a heat dissipation function. That is, the electromagnetic wave shield member 50 is a heat sink. The electromagnetic wave shield member 50 is formed of, for example, a metal material having good heat transfer characteristics such as aluminum, copper, and iron. Of course, the electromagnetic wave shield member 50 may be formed of a material other than the metal material. Therefore, the electromagnetic wave shield member 50 is formed separately from the resin case 10 by a material having a coefficient of thermal expansion different from that of the resin case 10.
　電磁波シールド部材５０は、樹脂ケース１０のシールド対象領域の１つである第二空間Ａ２に配置されている。電磁波シールド部材５０は、第二空間Ａ２を形成する底面１１ａの放熱用開口１１ａ１に取り付けられている。本例においては、電磁波シールド部材５０は、放熱用開口１１ａ１に嵌め込まれることで、ケース本体１１の底面１１ａから離脱不能に配置されている。特に、電磁波シールド部材５０は、底面１１ａに、底面１１ａの法線の両方向に係止されている。 The electromagnetic wave shield member 50 is arranged in the second space A2, which is one of the shield target areas of the resin case 10. The electromagnetic wave shield member 50 is attached to the heat dissipation opening 11a1 on the bottom surface 11a forming the second space A2. In this example, the electromagnetic wave shield member 50 is arranged so as not to be detached from the bottom surface 11a of the case body 11 by being fitted into the heat dissipation opening 11a1. In particular, the electromagnetic wave shield member 50 is locked to the bottom surface 11a in both directions along the normal of the bottom surface 11a.
　さらに、電磁波シールド部材５０は、放熱用開口１１ａ１に配置されているため、第二空間Ａ２の内壁面の一部を構成する。つまり、電磁波シールド部材５０の少なくとも一部は、第二空間Ａ２の内側に露出している。さらに、電磁波シールド部材５０は、放熱用開口１１ａ１に配置されているため、ケース本体１１の底面１１ａの外側にも露出している。電磁波シールド部材５０は、放熱効果を高めるために、底面１１ａの外側に突出する複数の突起５１を備える。 Further, since the electromagnetic wave shield member 50 is arranged in the heat dissipation opening 11a1, it constitutes a part of the inner wall surface of the second space A2. That is, at least a part of the electromagnetic wave shield member 50 is exposed inside the second space A2. Further, since the electromagnetic wave shield member 50 is arranged in the heat dissipation opening 11a1, it is also exposed to the outside of the bottom surface 11a of the case body 11. The electromagnetic wave shield member 50 includes a plurality of protrusions 51 projecting to the outside of the bottom surface 11a in order to enhance the heat dissipation effect.
　電磁波シールド部材６０は、電磁波シールド機能としての電磁波吸収機能を有する電磁波吸収部材である。そして、電磁波シールド部材６０は、樹脂ケース１０とは熱膨張率の異なる材料により、樹脂ケース１０とは別体に形成されている。電磁波シールド部材６０は、例えば、樹脂吸収層６１および金属層６２を備える。吸収対象の周波数に応じて、樹脂吸収層６１の材料および厚み等が調整される。 The electromagnetic wave shielding member 60 is an electromagnetic wave absorbing member having an electromagnetic wave absorbing function as an electromagnetic wave shielding function. The electromagnetic wave shield member 60 is formed separately from the resin case 10 by using a material having a coefficient of thermal expansion different from that of the resin case 10. The electromagnetic wave shield member 60 includes, for example, a resin absorbing layer 61 and a metal layer 62. The material and thickness of the resin absorbing layer 61 are adjusted according to the frequency to be absorbed.
　電磁波シールド部材６０は、上記構成の他に、導電性電波吸収材料、誘電性電波吸収材料、磁性電波吸収材料の何れか１つにより形成することもできる。導電性電波吸収材料は、材料内部の抵抗によって、電波によって発生する電流を吸収するものである。誘電性電波吸収材料は、分子の分極反応に起因する誘電損失を利用するものであり、例えば、カーボン等をゴム、発泡ウレタン、発泡ポリスチロール等の誘電体に混合して形成される。磁性電波吸収材料は、磁性材料の磁気損失によって電波を吸収するものであって、鉄、ニッケル、フェライト等を使用して電波を吸収する。 In addition to the above configuration, the electromagnetic wave shield member 60 can also be formed of any one of a conductive radio wave absorbing material, a dielectric radio wave absorbing material, and a magnetic radio wave absorbing material. The conductive radio wave absorbing material absorbs the current generated by the radio wave by the resistance inside the material. The dielectric radio wave absorbing material utilizes the dielectric loss caused by the polarization reaction of molecules, and is formed by mixing, for example, carbon or the like with a dielectric material such as rubber, urethane foam, or polystyrene foam. The magnetic radio wave absorbing material absorbs radio waves by the magnetic loss of the magnetic material, and absorbs radio waves by using iron, nickel, ferrite, or the like.
　電磁波シールド部材６０は、樹脂ケース１０のシールド対象領域の１つである第一空間Ａ１に配置されている。電磁波シールド部材６０は、第一空間Ａ１の内壁面の一部に配置されている。本例においては、電磁波シールド部材６０は、第一空間Ａ１を形成する底面１１ａに取り付けられている。電磁波シールド部材６０の金属層６２が底面１１ａに接着されており、樹脂吸収層６１が金属層６２における底面１１ａとは反対側の面に接着されている。 The electromagnetic wave shield member 60 is arranged in the first space A1, which is one of the shield target areas of the resin case 10. The electromagnetic wave shield member 60 is arranged on a part of the inner wall surface of the first space A1. In this example, the electromagnetic wave shield member 60 is attached to the bottom surface 11a forming the first space A1. The metal layer 62 of the electromagnetic wave shielding member 60 is adhered to the bottom surface 11a, and the resin absorbing layer 61 is adhered to the surface of the metal layer 62 opposite to the bottom surface 11a.
　粘弾性接合部材７０は、高分子粘弾性材料により成形されており、コネクタ保持部１１ｃとコネクタ４０とを接合する。本例では、粘弾性接合部材７０は、コネクタ保持部１１ｃの内周面とコネクタ４０の外周面との間に介在されており、コネクタ保持部１１ｃの内周面とコネクタ４０の外周面とに接合されている。粘弾性接合部材７０は、例えば、シリコーンゴム、エチレンプロピレンゴム等により成形される。後述するが、粘弾性接合部材７０は、射出成形により成形される。従って、粘弾性接合部材７０は、容易に且つ確実に、コネクタ保持部１１ｃとコネクタ４０とを接合することができる。なお、コネクタ４０がケース本体１１と同一成形されている場合には、粘弾性接合部材７０は不要となる。 The viscoelastic joining member 70 is formed of a polymer viscoelastic material, and joins the connector holding portion 11c and the connector 40. In this example, the viscoelastic joining member 70 is interposed between the inner peripheral surface of the connector holding portion 11c and the outer peripheral surface of the connector 40, and is interposed between the inner peripheral surface of the connector holding portion 11c and the outer peripheral surface of the connector 40. It is joined. The viscoelastic bonding member 70 is formed of, for example, silicone rubber, ethylene propylene rubber, or the like. As will be described later, the viscoelastic joining member 70 is molded by injection molding. Therefore, the viscoelastic joining member 70 can easily and surely join the connector holding portion 11c and the connector 40. When the connector 40 is formed in the same shape as the case body 11, the viscoelastic joining member 70 becomes unnecessary.
　粘弾性シール部材８０は、高分子粘弾性材料により成形されており、ケース本体１１の周壁１１ｂの先端面に接合されている。粘弾性シール部材８０は、樹脂ケース１０のケース本体１１と蓋２０との間のシール機能を有する。粘弾性シール部材８０は、例えば、粘弾性接合部材７０と同一材料により成形される。つまり、粘弾性シール部材８０は、例えば、シリコーンゴム、エチレンプロピレンゴム等により成形される。 The viscoelastic seal member 80 is formed of a polymer viscoelastic material and is joined to the tip surface of the peripheral wall 11b of the case body 11. The viscoelastic sealing member 80 has a sealing function between the case body 11 of the resin case 10 and the lid 20. The viscoelastic sealing member 80 is formed of, for example, the same material as the viscoelastic joining member 70. That is, the viscoelastic seal member 80 is molded of, for example, silicone rubber, ethylene propylene rubber, or the like.
　従って、粘弾性シール部材８０は、ケース本体１１の周壁１１ｂに接合しており、圧縮状態で蓋２０に接触されることで、シール機能を発揮することができる。また、後述するが、粘弾性シール部材８０は、射出成形により成形される。従って、粘弾性シール部材８０は、容易に成形することができる。 Therefore, the viscoelastic seal member 80 is joined to the peripheral wall 11b of the case body 11, and can exhibit the sealing function by being brought into contact with the lid 20 in a compressed state. Further, as will be described later, the viscoelastic seal member 80 is molded by injection molding. Therefore, the viscoelastic seal member 80 can be easily molded.
　粘弾性シールド層９０は、電磁波シールド性を有する高分子粘弾性材料により成形されている。粘弾性シールド層９０は、樹脂ケース１０における電磁波シールド空間である第一空間Ａ１－第四空間Ａ４を形成する内壁面に配置されている。 The viscoelastic shield layer 90 is formed of a polymer viscoelastic material having electromagnetic wave shielding properties. The viscoelastic shield layer 90 is arranged on the inner wall surface forming the first space A1 to the fourth space A4, which is the electromagnetic wave shielding space in the resin case 10.
　ただし、第一空間Ａ１および第二空間Ａ２においては、粘弾性シールド層９０は、電磁波シールド部材５０，６０が配置されている領域において全ての領域を被覆するのではなく、電磁波シールド部材５０，６０の少なくとも一部を露出させた状態としている。一方、第三空間Ａ３および第四空間Ａ４においては、粘弾性シールド層９０は、底面１１ａ、周壁１１ｂおよび仕切板１２により形成される全ての内壁面を被覆している。さらに、粘弾性シールド層９０は、仕切板１２の先端面にも配置されている。 However, in the first space A1 and the second space A2, the viscoelastic shield layer 90 does not cover the entire region in the region where the electromagnetic wave shield members 50 and 60 are arranged, but the electromagnetic wave shield members 50 and 60. At least a part of is exposed. On the other hand, in the third space A3 and the fourth space A4, the viscoelastic shield layer 90 covers all the inner wall surfaces formed by the bottom surface 11a, the peripheral wall 11b, and the partition plate 12. Further, the viscoelastic shield layer 90 is also arranged on the tip surface of the partition plate 12.
　なお、本例では、粘弾性シールド層９０は、樹脂ケース１０に配置されているのみであって、蓋２０には配置されていない。ただし、粘弾性シールド層９０は、蓋２０にも配置されるようにしてもよい。 In this example, the viscoelastic shield layer 90 is only arranged in the resin case 10 and not in the lid 20. However, the viscoelastic shield layer 90 may also be arranged on the lid 20.
　粘弾性シールド層９０は、例えば、ゴムやエラストマー等の粘弾性主成分に、導電性フィラーを含有させた材料を用いる。粘弾性主成分としては、ＥＰＤＭ、ＮＢＲ、アクリルゴム、フッ素ゴム、シリコーンゴム、クロロプレンゴム等の合成ゴムが用いられる。導電性フィラーとしては、カーボンブラックや金属粒子等が用いられる。 For the viscoelastic shield layer 90, for example, a material in which a conductive filler is contained in a viscoelastic main component such as rubber or elastomer is used. As the viscoelastic main component, synthetic rubber such as EPDM, NBR, acrylic rubber, fluororubber, silicone rubber, and chloroprene rubber is used. As the conductive filler, carbon black, metal particles, or the like is used.
　従って、粘弾性シールド層９０は、シールド対象領域としての第一空間Ａ１－第四空間Ａ４において、確実に電磁波シールド効果を発揮することができる。ただし、粘弾性シールド層９０は、電磁波シールド部材５０，６０の少なくとも一部を露出させた状態としているため、電磁波シールド部材５０，６０による機能を発揮させる状態を維持することができる。すなわち、電磁波シールド部材５０の露出部位によって放熱効果を発揮させることができ、電磁波シールド部材６０の露出部位によって電磁波吸収機能を発揮させることができる。また、後述するが、粘弾性シールド層９０は、射出成形により成形される。従って、粘弾性シールド層９０は、容易に成形することができる。 Therefore, the viscoelastic shield layer 90 can surely exert the electromagnetic wave shielding effect in the first space A1 to the fourth space A4 as the shield target area. However, since the viscoelastic shield layer 90 is in a state where at least a part of the electromagnetic wave shield members 50 and 60 is exposed, it is possible to maintain a state in which the electromagnetic wave shield members 50 and 60 exert their functions. That is, the heat dissipation effect can be exerted by the exposed portion of the electromagnetic wave shield member 50, and the electromagnetic wave absorption function can be exerted by the exposed portion of the electromagnetic wave shield member 60. Further, as will be described later, the viscoelastic shield layer 90 is molded by injection molding. Therefore, the viscoelastic shield layer 90 can be easily molded.
　（２－３．第一空間Ａ１における電磁波シールド機能の詳細）
　第一空間Ａ１における電磁波シールド機能の詳細について、図５を参照して説明する。第一空間Ａ１には、電磁波吸収機能を有する電磁波シールド部材６０が配置されている。詳細には、電磁波シールド部材６０は、第一空間Ａ１の内壁面を構成する底面１１ａに配置されている。特に、電磁波シールド部材６０を構成する金属層６２が、底面１１ａに接着されており、樹脂吸収層６１が、金属層６２に積層されている。 (2-3. Details of electromagnetic wave shielding function in the first space A1)
The details of the electromagnetic wave shielding function in the first space A1 will be described with reference to FIG. An electromagnetic wave shield member 60 having an electromagnetic wave absorbing function is arranged in the first space A1. Specifically, the electromagnetic wave shield member 60 is arranged on the bottom surface 11a forming the inner wall surface of the first space A1. In particular, the metal layer 62 constituting the electromagnetic wave shielding member 60 is adhered to the bottom surface 11a, and the resin absorbing layer 61 is laminated on the metal layer 62.
　粘弾性シールド層９０は、第一空間Ａ１の内壁面のうち電磁波シールド部材６０が配置された領域を除く領域における面を被覆する。本例では、粘弾性シールド層９０は、第一空間Ａ１の内壁面のうち電磁波シールド部材６０が配置された領域を除く領域における全ての面を被覆する。ここで、第一空間Ａ１の内壁面とは、樹脂ケース１０により形成される面を意味し、樹脂ケース１０の主開口側、すなわち電子回路基板３０が配置される面を含まない。 The viscoelastic shield layer 90 covers the inner wall surface of the first space A1 in a region other than the region where the electromagnetic wave shield member 60 is arranged. In this example, the viscoelastic shield layer 90 covers all the surfaces of the inner wall surface of the first space A1 except for the region where the electromagnetic wave shield member 60 is arranged. Here, the inner wall surface of the first space A1 means a surface formed by the resin case 10, and does not include the main opening side of the resin case 10, that is, the surface on which the electronic circuit board 30 is arranged.
　さらに、粘弾性シールド層９０は、樹脂ケース１０および電磁波シールド部材６０に接触した状態で、樹脂ケース１０と電磁波シールド部材６０とに跨って配置されている。詳細には、第一空間Ａ１においては、粘弾性シールド層９０は、底面１１ａまたは仕切板１２と電磁波シールド部材６０の金属層６２の周縁とに跨っている。さらに詳細には、粘弾性シールド層９０は、金属層６２の中央部を除き、金属層６２の周縁全周に跨っている。 Further, the viscoelastic shield layer 90 is arranged so as to straddle the resin case 10 and the electromagnetic wave shield member 60 in a state of being in contact with the resin case 10 and the electromagnetic wave shield member 60. Specifically, in the first space A1, the viscoelastic shield layer 90 straddles the bottom surface 11a or the partition plate 12 and the peripheral edge of the metal layer 62 of the electromagnetic wave shield member 60. More specifically, the viscoelastic shield layer 90 extends over the entire periphery of the metal layer 62 except for the central portion of the metal layer 62.
　つまり、粘弾性シールド層９０は、第一空間Ａ１の内壁面のうち電磁波シールド部材６０が配置された領域を除く領域における面から、電磁波シールド部材６０まで連続して配置されている。 That is, the viscoelastic shield layer 90 is continuously arranged from the surface of the inner wall surface of the first space A1 excluding the region where the electromagnetic wave shield member 60 is arranged to the electromagnetic wave shield member 60.
　従って、第一空間Ａ１を形成する内壁面には、電磁波シールド部材６０と粘弾性シールド層９０との少なくとも一方が存在する。特に、粘弾性シールド層９０のうち電磁波シールド部材６０に接触している部分においては、粘弾性シールド層９０と電磁波シールド部材６０との両者が存在する。つまり、第一空間Ａ１の内壁面の全ての面において、電磁波シールド機能を発揮することができる。 Therefore, at least one of the electromagnetic wave shield member 60 and the viscoelastic shield layer 90 exists on the inner wall surface forming the first space A1. In particular, in the portion of the viscoelastic shield layer 90 that is in contact with the electromagnetic wave shield member 60, both the viscoelastic shield layer 90 and the electromagnetic wave shield member 60 are present. That is, the electromagnetic wave shielding function can be exhibited on all surfaces of the inner wall surface of the first space A1.
　さらに、粘弾性シールド層９０が、電磁波シールド部材６０に接触した状態で、樹脂ケース１０と電磁波シールド部材６０とに跨って配置されている。ここで、樹脂ケース１０と電磁波シールド部材６０とは、熱膨張率が異なる材料により成形されている。そのため、温度変化によって、樹脂ケース１０と電磁波シールド部材６０との相対的位置が変化する。しかし、相対的位置が変化したとしても、粘弾性シールド層９０は、樹脂ケース１０と電磁波シールド部材６０との相対的位置の変化に追従することができる。従って、所望の電磁波シールド機能を発揮することができる。 Further, the viscoelastic shield layer 90 is arranged so as to straddle the resin case 10 and the electromagnetic wave shield member 60 in a state of being in contact with the electromagnetic wave shield member 60. Here, the resin case 10 and the electromagnetic wave shield member 60 are formed of materials having different coefficients of thermal expansion. Therefore, the relative position of the resin case 10 and the electromagnetic wave shield member 60 changes due to the temperature change. However, even if the relative position changes, the viscoelastic shield layer 90 can follow the change in the relative position between the resin case 10 and the electromagnetic wave shield member 60. Therefore, the desired electromagnetic wave shielding function can be exhibited.
　また、電磁波シールド部材６０を構成する金属層６２は、樹脂吸収層６１に積層して接着された積層部６２ａと、積層部６２ａの外周から外方に張り出した鍔部６２ｂとを備える。そして、粘弾性シールド層９０は、底面１１ａまたは仕切板１２と金属層６２の鍔部とに跨っている。粘弾性シールド層９０は、金属層６２と連続させることにより、第一空間Ａ１において電磁波反射機能を連続して発揮することができる。 Further, the metal layer 62 constituting the electromagnetic wave shielding member 60 includes a laminated portion 62a that is laminated and adhered to the resin absorbing layer 61, and a flange portion 62b that projects outward from the outer periphery of the laminated portion 62a. The viscoelastic shield layer 90 straddles the bottom surface 11a or the partition plate 12 and the flange portion of the metal layer 62. By making the viscoelastic shield layer 90 continuous with the metal layer 62, the electromagnetic wave reflection function can be continuously exhibited in the first space A1.
　一方、電磁波吸収機能を有する樹脂吸収層６１には、粘弾性シールド層９０は重なって配置されていない。そのため、粘弾性シールド層９０が、樹脂吸収層６１による電磁波吸収機能に対して、悪影響を及ぼすことを防止できる。つまり、所望の電磁波吸収機能を発揮させることができる。 On the other hand, the viscoelastic shield layer 90 is not arranged so as to overlap the resin absorbing layer 61 having an electromagnetic wave absorbing function. Therefore, it is possible to prevent the viscoelastic shield layer 90 from adversely affecting the electromagnetic wave absorption function of the resin absorption layer 61. That is, the desired electromagnetic wave absorption function can be exhibited.
　（２－４．第二空間Ａ２における電磁波シールド機能の詳細）
　第二空間Ａ２における電磁波シールド機能の詳細について、図５を参照して説明する。第二空間Ａ２には、放熱機能を有する電磁波シールド部材５０が配置されている。詳細には、電磁波シールド部材５０が、底面１１ａの放熱用開口１１ａ１に嵌め込まれている。 (2-4. Details of electromagnetic wave shielding function in the second space A2)
The details of the electromagnetic wave shielding function in the second space A2 will be described with reference to FIG. An electromagnetic wave shield member 50 having a heat dissipation function is arranged in the second space A2. Specifically, the electromagnetic wave shield member 50 is fitted in the heat dissipation opening 11a1 on the bottom surface 11a.
　粘弾性シールド層９０は、第二空間Ａ２の内壁面のうち電磁波シールド部材５０が配置された領域を除く領域における面を被覆する。本例では、粘弾性シールド層９０は、第二空間Ａ２の内壁面のうち電磁波シールド部材５０が配置された領域を除く領域における全ての面を被覆する。ここで、第二空間Ａ２の内壁面とは、樹脂ケース１０および電磁波シールド部材５０により形成される面を意味し、樹脂ケース１０の主開口側、すなわち電子回路基板３０が配置される面を含まない。 The viscoelastic shield layer 90 covers the inner wall surface of the second space A2 in a region other than the region where the electromagnetic wave shield member 50 is arranged. In this example, the viscoelastic shield layer 90 covers all the surfaces of the inner wall surface of the second space A2 except the region where the electromagnetic wave shield member 50 is arranged. Here, the inner wall surface of the second space A2 means a surface formed by the resin case 10 and the electromagnetic wave shielding member 50, and includes the main opening side of the resin case 10, that is, the surface on which the electronic circuit board 30 is arranged. Absent.
　さらに、粘弾性シールド層９０は、樹脂ケース１０および電磁波シールド部材５０に接触した状態で、樹脂ケース１０と電磁波シールド部材５０とに跨って配置されている。詳細には、粘弾性シールド層９０は、底面１１ａ、周壁１１ｂまたは仕切板１２と、電磁波シールド部材５０とに跨っている。さらに詳細には、粘弾性シールド層９０は、底面１１ａの放熱用開口１１ａ１の周縁全周と、電磁波シールド部材５０の中央部を除く電磁波シールド部材５０の周縁全周とに跨っている。 Further, the viscoelastic shield layer 90 is arranged so as to straddle the resin case 10 and the electromagnetic wave shield member 50 in a state of being in contact with the resin case 10 and the electromagnetic wave shield member 50. Specifically, the viscoelastic shield layer 90 straddles the bottom surface 11a, the peripheral wall 11b or the partition plate 12, and the electromagnetic wave shield member 50. More specifically, the viscoelastic shield layer 90 straddles the entire peripheral edge of the heat dissipation opening 11a1 on the bottom surface 11a and the entire peripheral edge of the electromagnetic wave shielding member 50 excluding the central portion of the electromagnetic wave shielding member 50.
　従って、第二空間Ａ２を形成する内壁面には、電磁波シールド部材５０と粘弾性シールド層９０との少なくとも一方が存在する。特に、粘弾性シールド層９０のうち電磁波シールド部材５０に接触している部分においては、粘弾性シールド層９０と電磁波シールド部材５０との両者が存在する。つまり、第二空間Ａ２の内壁面の全ての面において、電磁波シールド機能を発揮することができる。 Therefore, at least one of the electromagnetic wave shield member 50 and the viscoelastic shield layer 90 exists on the inner wall surface forming the second space A2. In particular, in the portion of the viscoelastic shield layer 90 that is in contact with the electromagnetic wave shield member 50, both the viscoelastic shield layer 90 and the electromagnetic wave shield member 50 are present. That is, the electromagnetic wave shielding function can be exhibited on all surfaces of the inner wall surface of the second space A2.
　さらに、粘弾性シールド層９０が、電磁波シールド部材５０に接触した状態で、樹脂ケース１０と電磁波シールド部材５０とに跨って配置されている。ここで、樹脂ケース１０と電磁波シールド部材５０とは、熱膨張率が異なる材料により成形されている。そのため、温度変化によって、樹脂ケース１０と電磁波シールド部材５０との相対的位置が変化する。しかし、相対的位置が変化したとしても、粘弾性シールド層９０は、樹脂ケース１０と電磁波シールド部材５０との相対的位置の変化に追従することができる。従って、所望の電磁波シールド機能を発揮することができる。 Further, the viscoelastic shield layer 90 is arranged so as to straddle the resin case 10 and the electromagnetic wave shield member 50 in a state of being in contact with the electromagnetic wave shield member 50. Here, the resin case 10 and the electromagnetic wave shield member 50 are formed of materials having different coefficients of thermal expansion. Therefore, the relative position of the resin case 10 and the electromagnetic wave shield member 50 changes due to the temperature change. However, even if the relative position changes, the viscoelastic shield layer 90 can follow the change in the relative position between the resin case 10 and the electromagnetic wave shield member 50. Therefore, the desired electromagnetic wave shielding function can be exhibited.
　また、粘弾性シールド層９０は、電磁波シールド部材５０の少なくとも一部を露出させた状態としている。ここで、電磁波シールド部材５０は、放熱機能を有する部材である。つまり、粘弾性シールド層９０は、電磁波シールド部材５０の少なくとも一部には重なって配置されていない。そのため、粘弾性シールド層９０が、電磁波シールド部材５０による放熱機能に対して、悪影響を及ぼすことを防止できる。つまり、電磁波シールド部材５０における露出部位は、放熱機能を発揮することができる。 Further, the viscoelastic shield layer 90 is in a state where at least a part of the electromagnetic wave shield member 50 is exposed. Here, the electromagnetic wave shield member 50 is a member having a heat dissipation function. That is, the viscoelastic shield layer 90 is not arranged so as to overlap at least a part of the electromagnetic wave shield member 50. Therefore, it is possible to prevent the viscoelastic shield layer 90 from adversely affecting the heat dissipation function of the electromagnetic wave shield member 50. That is, the exposed portion of the electromagnetic wave shield member 50 can exert a heat dissipation function.
　さらに、電磁波シールド部材５０は、樹脂ケース１０のケース本体１１の底面１１ａに形成された放熱用開口１１ａ１に嵌め込まれている。図５に示すように、嵌め込まれた状態において、樹脂ケース１０の底面１１ａと電磁波シールド部材５０の面とにより、階段状に形成されている。そして、粘弾性シールド層９０は、階段状の部位にて樹脂ケース１０の底面１１ａと電磁波シールド部材５０とに跨って配置されている。 Further, the electromagnetic wave shield member 50 is fitted into the heat dissipation opening 11a1 formed on the bottom surface 11a of the case body 11 of the resin case 10. As shown in FIG. 5, in the fitted state, the bottom surface 11a of the resin case 10 and the surface of the electromagnetic wave shield member 50 form a stepped shape. The viscoelastic shield layer 90 is arranged so as to straddle the bottom surface 11a of the resin case 10 and the electromagnetic wave shield member 50 at a stepped portion.
　さらに詳細には、粘弾性シールド層９０の層厚は、階段状の段差部位における層厚を、階段状の段差部位の周囲における層厚よりも厚くなるように形成されている。層厚が厚いほど、変位追従性が高くなる。つまり、層厚を上記のように形成することで、樹脂ケース１０と電磁波シールド部材５０との相対的位置が変化したとしても、粘弾性シールド層９０が、より確実に、樹脂ケース１０と電磁波シールド部材５０との相対的位置の変化に追従することができる。 More specifically, the layer thickness of the viscoelastic shield layer 90 is formed so that the layer thickness at the stepped step portion is thicker than the layer thickness around the stepped step portion. The thicker the layer, the higher the displacement followability. That is, by forming the layer thickness as described above, even if the relative positions of the resin case 10 and the electromagnetic wave shield member 50 change, the viscoelastic shield layer 90 more reliably secures the resin case 10 and the electromagnetic wave shield. It is possible to follow a change in the position relative to the member 50.
　（２－５．仕切板１２の先端面における電磁波シールド機能）
　図５に示すように、粘弾性シールド層９０は、仕切板１２の先端面にも配置されている。つまり、粘弾性シールド層９０は、隣接する空間を形成するそれぞれの内壁面（仕切板１２の側壁面）と、それぞれの内壁面との境界部分に位置する仕切板１２の先端面とに配置されている。より詳細には、粘弾性シールド層９０は、隣接する空間のそれぞれの内壁面と仕切板１２の先端面とに連続して配置されている。 (2-5. Electromagnetic wave shielding function on the tip surface of the partition plate 12)
As shown in FIG. 5, the viscoelastic shield layer 90 is also arranged on the tip surface of the partition plate 12. That is, the viscoelastic shield layer 90 is arranged on each inner wall surface (side wall surface of the partition plate 12) forming an adjacent space and the tip surface of the partition plate 12 located at the boundary portion with each inner wall surface. ing. More specifically, the viscoelastic shield layer 90 is continuously arranged on the inner wall surface of each of the adjacent spaces and the tip surface of the partition plate 12.
　例えば、粘弾性シールド層９０は、第一空間Ａ１を形成する内壁面、当該内壁面の境界である仕切板１２の先端面、および、第二空間Ａ２を形成する内壁面に連続して配置されている。第一空間Ａ１と第三空間Ａ３、第一空間Ａ１と第四空間Ａ４、第二空間Ａ２と第三空間Ａ３、第二空間Ａ２と第四空間Ａ４、第三空間Ａ３と第四空間Ａ４の各境界部分についても同様である。 For example, the viscoelastic shield layer 90 is continuously arranged on the inner wall surface forming the first space A1, the tip surface of the partition plate 12 which is the boundary of the inner wall surface, and the inner wall surface forming the second space A2. ing. First space A1 and third space A3, first space A1 and fourth space A4, second space A2 and third space A3, second space A2 and fourth space A4, third space A3 and fourth space A4 The same applies to each boundary portion.
　そして、仕切板１２の先端面に配置された粘弾性シールド層９０は、電子回路基板３０を支持する。従って、電子回路基板３０が、樹脂ケース１０に対する相対的位置が変化したとしても、粘弾性シールド層９０は、追従することができる。そのため、電子回路基板３０と仕切板１２との間において、粘弾性シールド層９０が確実に所望の電磁波シールド機能を発揮することができる。また、電子回路基板３０の中央部分が、粘弾性シールド層９０を介して仕切板１２に支持されることにより、電子回路基板３０を安定した姿勢とすることができる。 The viscoelastic shield layer 90 arranged on the tip surface of the partition plate 12 supports the electronic circuit board 30. Therefore, even if the position of the electronic circuit board 30 with respect to the resin case 10 changes, the viscoelastic shield layer 90 can follow it. Therefore, the viscoelastic shield layer 90 can surely exert a desired electromagnetic wave shielding function between the electronic circuit board 30 and the partition plate 12. Further, the central portion of the electronic circuit board 30 is supported by the partition plate 12 via the viscoelastic shield layer 90, so that the electronic circuit board 30 can be in a stable posture.
　（２－６．箱型電子ユニット１の製造方法）
　箱型電子ユニット１の製造方法について、図５－図１０を参照して説明する。図６に示すように、第一型内（図示せず）に、インサートとしての電磁波シールド部材５０を配置する（ステップＳ１）。第一型内に、樹脂材料を供給することにより、樹脂ケース１０を成形する（ステップＳ２）。これにより、図７に示す製造物１ａが生成される。このとき、電磁波シールド部材５０は、樹脂ケース１０のケース本体１１の底面１１ａに嵌め込まれている。従って、電磁波シールド部材５０は、樹脂ケース１０に固定される。 (2-6. Manufacturing method of box-type electronic unit 1)
A method for manufacturing the box-type electronic unit 1 will be described with reference to FIGS. 5 to 10. As shown in FIG. 6, the electromagnetic wave shield member 50 as an insert is arranged in the first mold (not shown) (step S1). The resin case 10 is molded by supplying the resin material into the first mold (step S2). As a result, the product 1a shown in FIG. 7 is produced. At this time, the electromagnetic wave shield member 50 is fitted into the bottom surface 11a of the case body 11 of the resin case 10. Therefore, the electromagnetic wave shield member 50 is fixed to the resin case 10.
　続いて、電磁波シールド部材６０の金属層６２を、樹脂ケース１０の第一空間Ａ１の底面１１ａに接着する（ステップＳ３）。なお、金属層６２は、電磁波シールド部材５０と共に、ステップＳ２においてインサート成形することも可能である。また、予め金属層６２と樹脂吸収層６１とを一体にしたものを、第一空間Ａ１の底面１１ａに接着してもよいし、当該一体にしたものをステップＳ２においてインサート成形してもよい。続いて、第二型内（図示せず）に、インサートとしてのコネクタ４０を配置する（ステップＳ４）。このときの第二型内における対象物１ｂは、図８に示すようになる。 Subsequently, the metal layer 62 of the electromagnetic wave shielding member 60 is adhered to the bottom surface 11a of the first space A1 of the resin case 10 (step S3). The metal layer 62 can also be insert-molded in step S2 together with the electromagnetic wave shielding member 50. Further, the metal layer 62 and the resin absorbing layer 61 may be integrally bonded to the bottom surface 11a of the first space A1 in advance, or the integrated product may be insert-molded in step S2. Subsequently, the connector 40 as an insert is arranged in the second mold (not shown) (step S4). The object 1b in the second type at this time is as shown in FIG.
　続いて、第二型内に、粘弾性材料を供給することにより、粘弾性接合部材７０、粘弾性シール部材８０、粘弾性シールド層９０を成形する（ステップＳ５）。これにより、図９に示す製造物１ｃが生成される。ここで、粘弾性接合部材７０と粘弾性シール部材８０とは、同一材料により成形し、粘弾性シールド層９０は、粘弾性接合部材７０等とは異なる材料により成形する。従って、ここでは２色成形が行われる。 Subsequently, the viscoelastic joining member 70, the viscoelastic sealing member 80, and the viscoelastic shield layer 90 are formed by supplying the viscoelastic material into the second mold (step S5). As a result, the product 1c shown in FIG. 9 is produced. Here, the viscoelastic joining member 70 and the viscoelastic sealing member 80 are formed of the same material, and the viscoelastic shield layer 90 is formed of a material different from that of the viscoelastic joining member 70 and the like. Therefore, two-color molding is performed here.
　続いて、電磁波シールド部材６０の残り部材である樹脂吸収層６１を配置する（ステップＳ６）。続いて、電子回路基板３０を取付ける（ステップＳ７）。これにより、図１０に示す製造物１ｄが生成される。続いて、蓋２０を取付けることで、図５に示す箱型電子ユニット１が完成する（ステップＳ８）。 Subsequently, the resin absorbing layer 61, which is the remaining member of the electromagnetic wave shielding member 60, is arranged (step S6). Subsequently, the electronic circuit board 30 is attached (step S7). As a result, the product 1d shown in FIG. 10 is produced. Subsequently, by attaching the lid 20, the box-shaped electronic unit 1 shown in FIG. 5 is completed (step S8).
　上記製造方法によれば、ステップＳ５において、粘弾性接合部材７０、粘弾性シール部材８０、粘弾性シールド層９０を１工程にて成形することができる。従って、製造コストが安価となる。 According to the above manufacturing method, in step S5, the viscoelastic joining member 70, the viscoelastic sealing member 80, and the viscoelastic shield layer 90 can be molded in one step. Therefore, the manufacturing cost is low.
　（２－７．第一の箱型電子ユニット１の変形例）
　上記においては、粘弾性シールド層９０は、樹脂ケース１０の内壁面に配置する例をあげた。この他に、粘弾性シールド層９０は、樹脂ケース１０の外壁面に配置するようにしてもよい。この場合、粘弾性シールド層９０が、外部に露出することになる。 (2-7. Modification example of the first box-type electronic unit 1)
In the above, the viscoelastic shield layer 90 is arranged on the inner wall surface of the resin case 10. In addition to this, the viscoelastic shield layer 90 may be arranged on the outer wall surface of the resin case 10. In this case, the viscoelastic shield layer 90 is exposed to the outside.
　（３．第二例の箱型電子ユニット２）
　（３－１．箱型電子ユニット２の外観）
　箱型電子ユニット２の外観について、図１１および図１２を参照して説明する。箱型電子ユニット２は、図１１および図１２に示すように、ケース１１０と蓋１２０とにより扁平状の外形を形成する。本例では、箱型電子ユニット２の外形は、矩形扁平状を図示するが、任意の形状を有する扁平状とすることができる。ケース１１０と蓋１２０の内部には、電子回路基板１３０（図１３に示す）が収容されている。 (3. Box-type electronic unit 2 of the second example)
(3-1. Appearance of box-type electronic unit 2)
The appearance of the box-type electronic unit 2 will be described with reference to FIGS. 11 and 12. As shown in FIGS. 11 and 12, the box-shaped electronic unit 2 has a flat outer shape formed by the case 110 and the lid 120. In this example, the outer shape of the box-shaped electronic unit 2 is shown as a rectangular flat shape, but it can be a flat shape having an arbitrary shape. An electronic circuit board 130 (shown in FIG. 13) is housed inside the case 110 and the lid 120.
　箱型電子ユニット２は、さらに、ケース１１０と蓋１２０とにより形成される扁平状の外形の側面（周面）に、外部コネクタに接続されるコネクタ１４０を備える。コネクタ１４０は、矩形状の接続孔を有する。コネクタ１４０の端子は、電子回路基板１３０（図１３に示す）に電気的に接続されている。ここで、本例では、箱型電子ユニット２は、１つのコネクタ１４０を備える場合を例に挙げるが、複数のコネクタ１４０を備えることもできる。 The box-type electronic unit 2 further includes a connector 140 connected to an external connector on the side surface (peripheral surface) of the flat outer shape formed by the case 110 and the lid 120. The connector 140 has a rectangular connection hole. The terminals of the connector 140 are electrically connected to the electronic circuit board 130 (shown in FIG. 13). Here, in this example, the case where the box-type electronic unit 2 includes one connector 140 is given as an example, but a plurality of connectors 140 may also be provided.
　（３－２．箱型電子ユニット２の各要素の構成）
　箱型電子ユニット２の各要素の構成について、図１３－図１６を参照して説明する。図１３に示すように、箱型電子ユニット２は、電子回路基板１３０と、コネクタ一体ケース１５０と、蓋１２０とを備える。電子回路基板１３０は、電子回路が形成され基板であって、複数の電子部品を備えている。図１３においては、基板の裏面に、複数の電子部品が配置されている。ここで、電子回路は、例えば、発熱部品を含んでいたり、外部ノイズの影響を受け得る構成を有したりする。 (3-2. Configuration of each element of the box-type electronic unit 2)
The configuration of each element of the box-type electronic unit 2 will be described with reference to FIGS. 13 to 16. As shown in FIG. 13, the box-type electronic unit 2 includes an electronic circuit board 130, a connector integrated case 150, and a lid 120. The electronic circuit board 130 is a board on which an electronic circuit is formed, and includes a plurality of electronic components. In FIG. 13, a plurality of electronic components are arranged on the back surface of the substrate. Here, the electronic circuit may include, for example, a heat-generating component, or may have a configuration that can be affected by external noise.
　コネクタ一体ケース１５０は、ケース１１０とコネクタ１４０が一体に形成された部材である。コネクタ一体ケース１５０は、別体に形成されたケース１１０とコネクタ１４０とを、一体的に接合することにより形成されている。なお、箱型電子ユニット２は、複数のコネクタ１４０を有することもできる。この場合、コネクタ一体ケース１５０は、ケース１１０と複数のコネクタ１４０が一体に形成された部材となる。コネクタ一体ケース１５０は、さらに、ケース１１０と蓋１２０との間に介在する第一介在部材１５１、ケース１１０とコネクタ１４０との間に介在する第二介在部材１５２、コネクタ１４０と蓋１２０との間に介在する第一補助介在部材１５３を備える。 The connector integrated case 150 is a member in which the case 110 and the connector 140 are integrally formed. The connector integrated case 150 is formed by integrally joining the separately formed case 110 and the connector 140. The box-type electronic unit 2 may also have a plurality of connectors 140. In this case, the connector-integrated case 150 is a member in which the case 110 and a plurality of connectors 140 are integrally formed. The connector-integrated case 150 further includes a first intervening member 151 interposed between the case 110 and the lid 120, a second intervening member 152 interposed between the case 110 and the connector 140, and between the connector 140 and the lid 120. A first auxiliary intervening member 153 is provided.
　コネクタ一体ケース１５０について、図１４－図１６を参照して詳細に説明する。コネクタ一体ケース１５０を構成するケース１１０は、図１４および図１５に示すように、扁平状に形成されており、電子回路基板１３０を収容する。ケース１１０は、金属または樹脂により形成されている。ケース１１０は、金属として、例えば、アルミニウム、鉄、ステンレス、マグネシウムなどにより形成される。また、ケース１１０は、樹脂として、例えば、汎用プラスチック、エンプラ、スーパーエンプラなどにより形成される。ケース１１０は、樹脂の詳細な種類として、例えば、ＡＢＳ、ポリプロピレン、ポリカーボネート、ポリブチレンテレフタレート、ポリフェニレンサルファイドなどにより形成される。ケース１１０は、放熱機能および電磁波シールド機能の少なくとも一方を有するようにするためには、金属により形成されるとよい。また、ケース１１０は、放熱機能および電磁波シールド機能を有する必要がない場合には、樹脂を採用することにより、軽量化を図ることができる。ただし、ケース１１０が樹脂により形成されている場合において、第一例の箱型電子ユニット１の構成を採用することにより、電磁波シールド機能を有するようにできる。また、第一例の箱型電子ユニット１を構成するヒートシンクを採用することにより、放熱機能を有するようにできる。 The connector integrated case 150 will be described in detail with reference to FIGS. 14 to 16. As shown in FIGS. 14 and 15, the case 110 constituting the connector integrated case 150 is formed in a flat shape and accommodates the electronic circuit board 130. The case 110 is made of metal or resin. The case 110 is made of, for example, aluminum, iron, stainless steel, magnesium, or the like as a metal. Further, the case 110 is formed of resin, for example, general-purpose plastic, engineering plastic, super engineering plastic, or the like. The case 110 is formed of, for example, ABS, polypropylene, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, or the like as a detailed type of resin. The case 110 may be made of metal in order to have at least one of a heat dissipation function and an electromagnetic wave shielding function. Further, when it is not necessary for the case 110 to have a heat dissipation function and an electromagnetic wave shielding function, the weight can be reduced by adopting a resin. However, when the case 110 is made of resin, it can have an electromagnetic wave shielding function by adopting the configuration of the box-shaped electronic unit 1 of the first example. Further, by adopting the heat sink constituting the box-type electronic unit 1 of the first example, it is possible to have a heat dissipation function.
　ケース１１０は、図１４に示すように、有底容器状に形成されている。ケース１１０は、底面１１１と、周壁１１２とを備える。底面１１１は、平面状に形成されており、例えば矩形に形成されている。底面１１１は、電子回路基板１３０の外形に対応する形状に形成されている。底面１１１の外面は、図１５に示すように、放熱性を良好とするために、凹凸状に形成されている。 As shown in FIG. 14, the case 110 is formed in the shape of a bottomed container. The case 110 includes a bottom surface 111 and a peripheral wall 112. The bottom surface 111 is formed in a plane shape, for example, in a rectangular shape. The bottom surface 111 is formed in a shape corresponding to the outer shape of the electronic circuit board 130. As shown in FIG. 15, the outer surface of the bottom surface 111 is formed in an uneven shape in order to improve heat dissipation.
　周壁１１２は、図１４に示すように、底面１１１の周縁を囲むように形成されている。ただし、周壁１１２は、底面１１１の周縁全周を囲むのではなく、底面１１１の周縁のうち一部分に配置されていない。つまり、周壁１１２は、底面１１１の法線方向から見た場合に、Ｃ字状に形成されている。 As shown in FIG. 14, the peripheral wall 112 is formed so as to surround the peripheral edge of the bottom surface 111. However, the peripheral wall 112 does not surround the entire peripheral edge of the bottom surface 111, and is not arranged on a part of the peripheral edge of the bottom surface 111. That is, the peripheral wall 112 is formed in a C shape when viewed from the normal direction of the bottom surface 111.
　周壁１１２は、周壁１１２の軸方向のうち底面１１１とは反対側の端に、底面１１１の法線方向に開口する蓋用開口部１１２ａを有する。蓋用開口部１１２ａは、例えば、電子回路基板１３０の外形に対応する矩形状を有する。周壁１１２は、蓋用開口部１１２ａの周縁を形成する周面に、第一接着面１１２ａ１を有する。ここで、第一接着面１１２ａ１は、周壁１１２の外周面に形成する場合を例にあげるが、周壁１１２の内周面に形成することもできる。そして、第一接着面１１２ａ１は、周壁１１２の軸方向に平行な面を有している。詳細は後述するが、第一接着面１１２ａ１は、第一介在部材１５１との接着面を構成する。 The peripheral wall 112 has a lid opening 112a that opens in the normal direction of the bottom surface 111 at an end of the peripheral wall 112 that is opposite to the bottom surface 111. The lid opening 112a has, for example, a rectangular shape corresponding to the outer shape of the electronic circuit board 130. The peripheral wall 112 has a first adhesive surface 112a1 on the peripheral surface forming the peripheral edge of the lid opening 112a. Here, the case where the first adhesive surface 112a1 is formed on the outer peripheral surface of the peripheral wall 112 is given as an example, but it can also be formed on the inner peripheral surface of the peripheral wall 112. The first adhesive surface 112a1 has a surface parallel to the axial direction of the peripheral wall 112. Although the details will be described later, the first adhesive surface 112a1 constitutes an adhesive surface with the first intervening member 151.
　周壁１１２は、底面１１１の面方向に開口するコネクタ用開口部１１２ｂを有する。コネクタ用開口部１１２ｂは、周壁１１２における周方向の開口部分に対応する。本例では、例えば、コネクタ用開口部１１２ｂは、底面１１１の矩形状を構成する４辺のうち、１つの辺の部分に形成されている。より詳細には、コネクタ用開口部１１２ｂは、１辺の中央部に形成されている。なお、コネクタ用開口部１１２ｂは、１辺の端寄りに形成されるようにしてもよいし、底面１１１の矩形状の角部に形成されるようにしてもよい。また、コネクタ用開口部１１２ｂは、蓋用開口部１１２ａに連続的につながって形成されている。つまり、周壁１１２は、コネクタ用開口部１１２ｂの周縁を形成部位として、Ｕ字状内面である第二接着面１１２ｂ１を有する。 The peripheral wall 112 has a connector opening 112b that opens in the surface direction of the bottom surface 111. The connector opening 112b corresponds to the circumferential opening in the peripheral wall 112. In this example, for example, the connector opening 112b is formed on one side of the four sides forming the rectangular shape of the bottom surface 111. More specifically, the connector opening 112b is formed at the center of one side. The connector opening 112b may be formed near the end of one side, or may be formed at a rectangular corner of the bottom surface 111. Further, the connector opening 112b is formed by being continuously connected to the lid opening 112a. That is, the peripheral wall 112 has a second adhesive surface 112b1 which is a U-shaped inner surface with the peripheral edge of the connector opening 112b as a forming portion.
　ケース１１０は、さらに、蓋１２０と締結するための締結部材（図示せず）を取り付けるための取付座１１３を有する。ケース１１０は、例えば、矩形の４隅に取付座１１３を有する。取付座１１３は、締結部材を挿通するための孔が形成されている。 The case 110 further has a mounting seat 113 for mounting a fastening member (not shown) for fastening to the lid 120. The case 110 has mounting seats 113 at four corners of a rectangle, for example. The mounting seat 113 is formed with a hole for inserting the fastening member.
　コネクタ一体ケース１５０を構成するコネクタ１４０は、図１４および図１５に示すように、ケース１１０と別体に形成されている。コネクタ１４０は、ケース１１０のコネクタ用開口部１１２ｂに固定される。さらに、コネクタ１４０は、電子回路基板（図１３に示す）と外部とを電気的に接続する。 As shown in FIGS. 14 and 15, the connector 140 constituting the connector integrated case 150 is formed separately from the case 110. The connector 140 is fixed to the connector opening 112b of the case 110. Further, the connector 140 electrically connects the electronic circuit board (shown in FIG. 13) to the outside.
　ここで、コネクタ１４０は、相手装着部１４１と、接着部１４２と、複数の端子１４３とを備える。相手装着部１４１と接着部１４２とにより構成される本体（１４１，１４２）は、例えば、樹脂により形成されている。そして、相手装着部１４１と接着部１４２とは、一体に形成されている。コネクタ１４０の本体（１４１，１４２）は、当該樹脂としては、例えば、汎用プラスチック、エンプラ、スーパーエンプラなどにより形成される。ケース１１０は、樹脂の詳細な種類として、例えば、ＡＢＳ、ポリプロピレン、ポリカーボネート、ポリブチレンテレフタレート、ポリフェニレンサルファイドなどにより形成される。 Here, the connector 140 includes a mating portion 141, an adhesive portion 142, and a plurality of terminals 143. The main body (141, 142) composed of the mating portion 141 and the adhesive portion 142 is formed of, for example, resin. The mating portion 141 and the adhesive portion 142 are integrally formed. The main body (141, 142) of the connector 140 is formed of, for example, general-purpose plastic, engineering plastic, super engineering plastic, or the like as the resin. The case 110 is formed of, for example, ABS, polypropylene, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, or the like as a detailed type of resin.
　相手装着部１４１は、ケース１１０の外面より外側に露出して、突出する部分を構成する。相手装着部１４１は、外部の相手部材のコネクタ（図示せず）と装着される部分である。相手装着部１４１は、筒状に形成されており、例えば矩形筒状に形成されている。 The mating portion 141 is exposed to the outside from the outer surface of the case 110 and constitutes a protruding portion. The mating portion 141 is a portion to be mounted with a connector (not shown) of an external mating member. The mating portion 141 is formed in a tubular shape, for example, in a rectangular tubular shape.
　接着部１４２は、相手装着部１４１の端側に位置し、相手装着部１４１の筒状の中心軸線を中心とする外周面１４２ａを有する。接着部１４２の外周面１４２ａは、例えば矩形状を有しており、矩形状の３辺が、コネクタ用開口部１１２ｂのＵ字状の第二接着面１１２ｂ１に対向する。 The adhesive portion 142 is located on the end side of the mating mounting portion 141, and has an outer peripheral surface 142a centered on the tubular central axis of the mating mounting portion 141. The outer peripheral surface 142a of the adhesive portion 142 has, for example, a rectangular shape, and the three rectangular sides face the U-shaped second adhesive surface 112b1 of the connector opening 112b.
　接着部１４２は、さらに、外周面１４２ａの１つの辺から外側に突出する座面１４２ｂを有する。接着部１４２の座面１４２ｂは、コネクタ１４０がコネクタ用開口部１１２ｂに配置された状態において、周壁１１２の第一接着面１１２ａ１と連続的な面を構成する。つまり、周壁１１２の第一接着面１１２ａ１と接着部１４２の座面１４２ｂとにより、周方向に連続した筒状面が形成される。本例では、第一接着面１１２ａ１と座面１４２ｂとにより、外筒面が形成される。 The adhesive portion 142 further has a seat surface 142b protruding outward from one side of the outer peripheral surface 142a. The seat surface 142b of the adhesive portion 142 constitutes a surface continuous with the first adhesive surface 112a1 of the peripheral wall 112 in a state where the connector 140 is arranged in the connector opening 112b. That is, the first adhesive surface 112a1 of the peripheral wall 112 and the seat surface 142b of the adhesive portion 142 form a tubular surface continuous in the circumferential direction. In this example, the outer cylinder surface is formed by the first adhesive surface 112a1 and the seat surface 142b.
　複数の端子１４３は、金属によりＬ字状に形成されており、Ｌ字状の一端が接着部１４２側の端面から相手装着部１４１側に向かって差し込まれている。複数の端子１４３のＬ字状の他端は、接着部１４２から露出しており、コネクタ１４０がコネクタ用開口部１１２ｂに配置された状態において、底面１１１とは反対側、すなわち蓋用開口部１１２ａ側に延びる。 The plurality of terminals 143 are formed in an L shape by metal, and one end of the L shape is inserted from the end face on the adhesive portion 142 side toward the mating portion 141 side. The other end of the L-shape of the plurality of terminals 143 is exposed from the adhesive portion 142, and when the connector 140 is arranged in the connector opening 112b, the side opposite to the bottom surface 111, that is, the lid opening 112a Extend to the side.
　コネクタ一体ケース１５０を構成する第一介在部材１５１は、高分子粘弾性材料により形成されている。第一介在部材１５１は、ケース１１０の周壁１１２と蓋１２０との間に介在する。第一介在部材１５１は、図１３および図１６に示すように、ケース１１０の周壁１１２において、蓋用開口部１１２ａの周縁を形成する周面である第一接着面１１２ａ１に接着されている。つまり、第一介在部材１５１は、ケース１１０の底面１１１の法線方向から見た場合に、Ｃ字状に形成されている。なお、本例では、第一接着面１１２ａ１は、外周面を構成するため、第一介在部材１５１は、第一接着面１１２ａ１の外周側に周状に形成されている。 The first intervening member 151 constituting the connector integrated case 150 is made of a polymer viscoelastic material. The first intervening member 151 is interposed between the peripheral wall 112 of the case 110 and the lid 120. As shown in FIGS. 13 and 16, the first intervening member 151 is adhered to the first adhesive surface 112a1 which is a peripheral surface forming the peripheral edge of the lid opening 112a on the peripheral wall 112 of the case 110. That is, the first intervening member 151 is formed in a C shape when viewed from the normal direction of the bottom surface 111 of the case 110. In this example, since the first adhesive surface 112a1 constitutes the outer peripheral surface, the first intervening member 151 is formed in a circumferential shape on the outer peripheral side of the first adhesive surface 112a1.
　さらに、第一介在部材１５１は、第一接着面１１２ａ１とは反対側の面、本例では外周面に、周方向に延びる複数のリップ１５１ａを有する。リップ１５１ａが、蓋１２０に対して非接着状態で接触する部分である。そして、リップ１５１ａが、蓋１２０との間でシール機能を発揮し、蓋１２０の保持力を発揮する。つまり、リップ１５１ａは、蓋１２０に対して非接着状態であり且つシールした状態で蓋１２０を保持する部分として機能する。 Further, the first intervening member 151 has a plurality of lips 151a extending in the circumferential direction on the surface opposite to the first adhesive surface 112a1, in this example, the outer peripheral surface. The portion where the lip 151a comes into contact with the lid 120 in a non-adhesive state. Then, the lip 151a exerts a sealing function with the lid 120 and exerts a holding force of the lid 120. That is, the lip 151a functions as a portion that holds the lid 120 in a non-adhesive state and a sealed state with respect to the lid 120.
　ここで、第一接着面１１２ａ１が周壁１１２の内周面に形成されている場合には、第一介在部材１５１は、内周面に複数のリップ１５１ａを有することになる。また、第一介在部材１５１は、高分子粘弾性材料として、例えば、シリコーンゴム、エチレンプロピレンゴムなどにより形成される。特に、第一介在部材１５１は、シリコーンゴムにより形成することにより、蓋１２０の保持力、シール機能、および、耐久性を良好に発揮することができる。 Here, when the first adhesive surface 112a1 is formed on the inner peripheral surface of the peripheral wall 112, the first intervening member 151 will have a plurality of lips 151a on the inner peripheral surface. Further, the first interposition member 151 is formed of, for example, silicone rubber, ethylene propylene rubber, or the like as a polymer viscoelastic material. In particular, by forming the first intervening member 151 with silicone rubber, the holding power, the sealing function, and the durability of the lid 120 can be satisfactorily exhibited.
　コネクタ一体ケース１５０を構成する第二介在部材１５２は、高分子粘弾性材料により形成されている。第二介在部材１５２は、ケース１１０の周壁１１２とコネクタ１４０との間に介在する。第二介在部材１５２は、図１３および図１６に示すように、ケース１１０のコネクタ用開口部１１２ｂの周縁とコネクタ１４０の接着部１４２との対向面のそれぞれに接着されている。そして、第二介在部材１５２は、コネクタ用開口部１１２ｂの周縁とコネクタ１４０の接着部１４２の外周面１４２ａとの間をシールする。 The second intervening member 152 constituting the connector integrated case 150 is made of a polymer viscoelastic material. The second intervening member 152 is interposed between the peripheral wall 112 of the case 110 and the connector 140. As shown in FIGS. 13 and 16, the second intervening member 152 is adhered to each of the peripheral edge of the connector opening 112b of the case 110 and the facing surface of the connector 140 with the adhesive portion 142. Then, the second intervening member 152 seals between the peripheral edge of the connector opening 112b and the outer peripheral surface 142a of the adhesive portion 142 of the connector 140.
　詳細には、第二介在部材１５２は、ケース１１０の周壁１１２におけるＵ字状内面である第二接着面１１２ｂ１に接着される。さらに、第二介在部材１５２は、コネクタ１４０の接着部１４２の外周面１４２ａのうち、第二接着面１１２ｂ１に対向するＵ字状外面に接着される。従って、第二介在部材１５２は、コネクタ１４０の外周面のうち、蓋用開口部１１２ａの側を除く、両側面および底面１１１の側を連続するＵ字状に形成されている。さらに、第二介在部材１５２は、第一介在部材１５１に連続的に形成される。つまり、第二介在部材１５２のＵ字状の両端が、第一介在部材１５１のＣ字状の両端と連続的に形成される。 Specifically, the second intervening member 152 is adhered to the second adhesive surface 112b1, which is the U-shaped inner surface of the peripheral wall 112 of the case 110. Further, the second intervening member 152 is bonded to the U-shaped outer surface of the outer peripheral surface 142a of the bonding portion 142 of the connector 140 facing the second bonding surface 112b1. Therefore, the second intervening member 152 is formed in a U-shape on both side surfaces and the bottom surface 111 side of the outer peripheral surface of the connector 140, excluding the side of the lid opening 112a. Further, the second intervening member 152 is continuously formed on the first intervening member 151. That is, both ends of the U-shape of the second intervening member 152 are continuously formed with both ends of the C-shape of the first intervening member 151.
　第二介在部材１５２は、第一介在部材１５１と同一の高分子粘弾性材料により形成されるようにしてもよいし、異なる高分子粘弾性材料により形成されるようにしてもよい。第二介在部材１５２は、高分子粘弾性材料として、例えば、シリコーンゴム、エチレンプロピレンゴムなどにより形成される。特に、第二介在部材１５２は、シリコーンゴムにより形成することにより、シール機能、および、耐久性を良好に発揮することができる。 The second intervening member 152 may be formed of the same polymer viscoelastic material as the first intervening member 151, or may be formed of a different polymer viscoelastic material. The second interposition member 152 is formed of, for example, silicone rubber, ethylene propylene rubber, or the like as a polymer viscoelastic material. In particular, by forming the second intervening member 152 with silicone rubber, it is possible to satisfactorily exhibit the sealing function and durability.
　第二介在部材１５２が第一介在部材１５１と同一の材料により形成することで、製造が容易となり、結果として低コスト化を図ることができる。また、第二介在部材１５２が第一介在部材１５１と異なる材料により形成する場合には、第二介在部材１５２は高い接着機能を有する材料とし、第一介在部材１５１はリップ１５１ａによる高いシール機能を有する材料とすることができる。このように、機能に応じた材料を選択することができる。 By forming the second intervening member 152 from the same material as the first intervening member 151, manufacturing becomes easy, and as a result, cost reduction can be achieved. When the second intervening member 152 is formed of a material different from that of the first intervening member 151, the second intervening member 152 is made of a material having a high adhesive function, and the first intervening member 151 has a high sealing function by the lip 151a. It can be a material to have. In this way, the material according to the function can be selected.
　コネクタ一体ケース１５０を構成する第一補助介在部材１５３は、高分子粘弾性材料により形成されている。第一補助介在部材１５３は、蓋用開口部１１２ａとコネクタ用開口部１１２ｂとの接続部位に形成されている。当該接続部位には、コネクタ１４０の接着部１４２の座面１４２ｂが位置する。そこで、第一補助介在部材１５３は、コネクタ用開口部１１２ｂに配置された状態のコネクタ１４０の外面の一部である、接着部１４２の座面１４２ｂに接着される。さらに、第一補助介在部材１５３は、第一介在部材１５１に連続的に形成される。第一補助介在部材１５３は、第一介在部材１５１のＣ字状の切断領域を補う部位となる。つまり、第一介在部材１５１と第一補助介在部材１５３とにより、周方向に連続した筒状に形成されている。 The first auxiliary intervening member 153 constituting the connector integrated case 150 is made of a polymer viscoelastic material. The first auxiliary intervening member 153 is formed at a connection portion between the lid opening 112a and the connector opening 112b. The seat surface 142b of the adhesive portion 142 of the connector 140 is located at the connection portion. Therefore, the first auxiliary intervening member 153 is adhered to the seat surface 142b of the adhesive portion 142, which is a part of the outer surface of the connector 140 in the state of being arranged in the connector opening 112b. Further, the first auxiliary intervening member 153 is continuously formed on the first intervening member 151. The first auxiliary intervening member 153 serves as a portion that supplements the C-shaped cutting region of the first intervening member 151. That is, the first intervening member 151 and the first auxiliary intervening member 153 form a continuous tubular shape in the circumferential direction.
　このように、第一補助介在部材１５３は、第一介在部材１５１と連続的に形成されている。さらに、第一補助介在部材１５３は、第二介在部材１５２とも連続的に形成されるようにしてもよい。つまり、第二介在部材１５２は、第一介在部材１５１と第一補助介在部材１５３の少なくとも一方に連続的に形成されている。 As described above, the first auxiliary intervening member 153 is continuously formed with the first intervening member 151. Further, the first auxiliary intervening member 153 may be formed continuously with the second intervening member 152. That is, the second intervening member 152 is continuously formed on at least one of the first intervening member 151 and the first auxiliary intervening member 153.
　さらに、第一補助介在部材１５３は、接着部１４２の座面１４２ｂとは反対側の面、本例では外面に複数のリップ１５３ａを有する。リップ１５３ａは、第一介在部材１５１のリップ１５１ａと連続的に形成されている。リップ１５３ａは、リップ１５１ａと同様に、蓋１２０に対して非接着状態で接触する部分である。そして、リップ１５３ａは、蓋１２０との間でシール機能を発揮し、蓋１２０の保持力を発揮し得る。つまり、リップ１５３ａは、蓋１２０に対して非接着状態であり且つシールした状態で蓋１２０を保持する部分として機能する。 Further, the first auxiliary intervening member 153 has a plurality of lips 153a on the surface of the adhesive portion 142 opposite to the seat surface 142b, in this example, the outer surface. The lip 153a is continuously formed with the lip 151a of the first intervening member 151. Like the lip 151a, the lip 153a is a portion that comes into contact with the lid 120 in a non-adhesive state. Then, the lip 153a can exert a sealing function with the lid 120 and exert a holding force of the lid 120. That is, the lip 153a functions as a portion that holds the lid 120 in a non-adhesive state and a sealed state with respect to the lid 120.
　第一補助介在部材１５３は、第一介在部材１５１と同様の機能を有する部材である。そこで、第一補助介在部材１５３は、第一介在部材１５１と同一の高分子粘弾性材料により形成されるとよい。すなわち、第一補助介在部材１５３は、高分子粘弾性材料として、例えば、シリコーンゴム、エチレンプロピレンゴムなどにより形成される。 The first auxiliary intervening member 153 is a member having the same function as the first intervening member 151. Therefore, the first auxiliary intervening member 153 may be formed of the same polymer viscoelastic material as the first intervening member 151. That is, the first auxiliary interposition member 153 is formed of, for example, silicone rubber, ethylene propylene rubber, or the like as the polymer viscoelastic material.
　蓋１２０は、図１３に示すように、ケース１１０の蓋用開口部１１２ａを閉塞する。蓋１２０は、ケース１１０と同様に、金属または樹脂により形成されている。蓋１２０は、金属として、例えば、アルミニウム、鉄、ステンレス、マグネシウムなどにより形成される。また、蓋１２０は、樹脂として、例えば、汎用プラスチック、エンプラ、スーパーエンプラなどにより形成される。蓋１２０は、樹脂の詳細な種類として、例えば、ＡＢＳ、ポリプロピレン、ポリカーボネート、ポリブチレンテレフタレート、ポリフェニレンサルファイドなどにより形成される。蓋１２０は、放熱機能および電磁波シールド機能の少なくとも一方を有するようにするためには、金属により形成されるとよい。また、蓋１２０は、放熱機能および電磁波シールド機能を有する必要がない場合には、樹脂を採用することにより、軽量化を図ることができる。 As shown in FIG. 13, the lid 120 closes the lid opening 112a of the case 110. The lid 120, like the case 110, is made of metal or resin. The lid 120 is made of metal such as aluminum, iron, stainless steel, magnesium and the like. Further, the lid 120 is formed of resin, for example, general-purpose plastic, engineering plastic, super engineering plastic, or the like. The lid 120 is formed of, for example, ABS, polypropylene, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, or the like as a detailed type of resin. The lid 120 may be made of metal in order to have at least one of a heat dissipation function and an electromagnetic wave shielding function. Further, when it is not necessary for the lid 120 to have a heat dissipation function and an electromagnetic wave shielding function, the weight can be reduced by adopting a resin.
　蓋１２０は、ケース１１０に対応する有底容器状に形成されている。詳細には、蓋１２０は、底面１２１と、周壁１２２と、取付座１２３とを備える。底面１２１は、平板状に形成されている。底面１２１の外形は、ケース１１０の底面１１１の外形と同様に形成されている。つまり、底面１２１の外形は、例えば、矩形状に形成されている。周壁１２２は、底面１２１の周縁を全周に亘って囲むように形成されている。周壁１２２の内周面は、第一介在部材１５１のリップ１５１ａおよび第一補助介在部材１５３のリップ１５３ａに非接着状態で接触する部位である。 The lid 120 is formed in the shape of a bottomed container corresponding to the case 110. Specifically, the lid 120 includes a bottom surface 121, a peripheral wall 122, and a mounting seat 123. The bottom surface 121 is formed in a flat plate shape. The outer shape of the bottom surface 121 is formed in the same manner as the outer shape of the bottom surface 111 of the case 110. That is, the outer shape of the bottom surface 121 is formed in a rectangular shape, for example. The peripheral wall 122 is formed so as to surround the peripheral edge of the bottom surface 121 over the entire circumference. The inner peripheral surface of the peripheral wall 122 is a portion that comes into contact with the lip 151a of the first intervening member 151 and the lip 153a of the first auxiliary intervening member 153 in a non-adhesive state.
　つまり、第一介在部材１５１が、ケース１１０の周壁１１２の第一接着面１１２ａ１と蓋１２０の周壁１２２の内周面との間に挟まれた状態でシールする。さらに、第一補助介在部材１５３が、コネクタ１４０の接着部１４２の座面１４２ｂと蓋１２０の周壁１２２の内周面との間に挟まれた状態でシールする。 That is, the first intervening member 151 is sealed while being sandwiched between the first adhesive surface 112a1 of the peripheral wall 112 of the case 110 and the inner peripheral surface of the peripheral wall 122 of the lid 120. Further, the first auxiliary intervening member 153 is sealed while being sandwiched between the seat surface 142b of the adhesive portion 142 of the connector 140 and the inner peripheral surface of the peripheral wall 122 of the lid 120.
　取付座１２３は、蓋１２０の周壁１２２の矩形の４隅に設けられている。取付座１２３は、ケース１１０の取付座１１３に対応する位置に位置しており、締結部材により締結するための孔が形成されている。 The mounting seat 123 is provided at four rectangular corners of the peripheral wall 122 of the lid 120. The mounting seat 123 is located at a position corresponding to the mounting seat 113 of the case 110, and a hole for fastening is formed by a fastening member.
　（３－３．箱型電子ユニット２の製造方法）
　箱型電子ユニット２の製造方法について、図１７および図１８を参照して説明する。図１７および図１８に示すように、ケース１１０およびコネクタ１４０を、成形型１６０内に配置する（ステップＳ１１）。成形型１６０は、第一介在部材１５１、第二介在部材１５２および第一補助介在部材１５３を成形するための型である。成形型１６０は、高分子粘弾性材料の流動性素材を供給するための１つ以上の供給口１６１を有している。つまり、成形型１６０は、１つの供給口１６１を有するようにしてもよいし、複数の供給口１６１を有するようにしてもよい。 (3-3. Manufacturing method of box-type electronic unit 2)
A method of manufacturing the box-type electronic unit 2 will be described with reference to FIGS. 17 and 18. As shown in FIGS. 17 and 18, the case 110 and the connector 140 are arranged in the mold 160 (step S11). The molding die 160 is a mold for molding the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153. The mold 160 has one or more supply ports 161 for supplying a fluid material of a polymer viscoelastic material. That is, the molding die 160 may have one supply port 161 or may have a plurality of supply ports 161.
　続いて、高分子粘弾性材料の流動性素材を、成形型１６０の供給口１６１から供給する。そして、流動性素材を、第一介在部材１５１の領域、第二介在部材１５２の領域および第一補助介在部材１５３の領域との間で流動させる。例えば、供給口１６１は、第一介在部材１５１の領域に連通している。この場合、流動性素材は、第一介在部材１５１の領域から第二介在部材１５２の領域へ流動し、且つ、第一介在部材１５１の領域から第一補助介在部材１５３の領域へ流動する。このようにして、流動性素材は、第一介在部材１５１の領域、第二介在部材１５２の領域および第一補助介在部材１５３の領域に充填される（ステップＳ１２）。なお、成形型１６０の供給口１６１は、第二介在部材１５２の領域に連通するようにしてもよいし、第一補助介在部材１５３の領域に連通するようにしてもよい。 Subsequently, the fluid material of the polymer viscoelastic material is supplied from the supply port 161 of the molding die 160. Then, the fluid material is made to flow between the region of the first intervening member 151, the region of the second interposing member 152, and the region of the first auxiliary intervening member 153. For example, the supply port 161 communicates with the region of the first intervening member 151. In this case, the fluid material flows from the region of the first intervening member 151 to the region of the second intervening member 152, and flows from the region of the first intervening member 151 to the region of the first auxiliary intervening member 153. In this way, the fluid material is filled in the region of the first intervening member 151, the region of the second interposing member 152, and the region of the first auxiliary intervening member 153 (step S12). The supply port 161 of the molding die 160 may communicate with the region of the second intervening member 152, or may communicate with the region of the first auxiliary intervening member 153.
　続いて、成形型１６０内において、流動性素材を加熱して、さらに流動性素材を固化させることにより、第一介在部材１５１、第二介在部材１５２および第一補助介在部材１５３が形成される（ステップＳ１３）。このとき、流動性素材の加熱によって、第一介在部材１５１は、ケース１１０の第一接着面１１２ａ１に接着される。また、第二介在部材１５２は、ケース１１０の第二接着面１１２ｂ１に接着されると共に、コネクタ１４０の接着部１４２の外周面１４２ａに接着される。さらに、第一補助介在部材１５３は、コネクタ１４０の接着部１４２の座面１４２ｂに接着される。このようにして、コネクタ一体ケース１５０が完成する。 Subsequently, in the molding die 160, the fluid material is heated to further solidify the fluid material, whereby the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 are formed ( Step S13). At this time, the first intervening member 151 is adhered to the first adhesive surface 112a1 of the case 110 by heating the fluid material. Further, the second intervening member 152 is adhered to the second adhesive surface 112b1 of the case 110 and also to the outer peripheral surface 142a of the adhesive portion 142 of the connector 140. Further, the first auxiliary intervening member 153 is adhered to the seat surface 142b of the adhesive portion 142 of the connector 140. In this way, the connector integrated case 150 is completed.
　続いて、コネクタ一体ケース１５０に、電子回路基板１３０を取り付ける（ステップＳ１４）。続いて、コネクタ一体ケース１５０に、蓋１２０を装着する（ステップＳ１５）。詳細には、蓋１２０の周壁１２２を、ケース１１０の周壁１１２の第一接着面１１２ａ１の外側、且つ、コネクタ１４０の接着部１４２の座面１４２ｂの外側に、嵌め込む。このとき、第一介在部材１５１が、ケース１１０の第一接着面１１２ａ１と蓋１２０の周壁１２２との間に圧縮された状態となり、シールすると共に、蓋１２０を保持する。さらに、第一補助介在部材１５３が、コネクタ１４０の接着部１４２の座面１４２ｂと蓋１２０の周壁１２２との間に圧縮された状態となり、シールすると共に、蓋１２０の保持力を発揮する。 Subsequently, the electronic circuit board 130 is attached to the connector integrated case 150 (step S14). Subsequently, the lid 120 is attached to the connector integrated case 150 (step S15). Specifically, the peripheral wall 122 of the lid 120 is fitted to the outside of the first adhesive surface 112a1 of the peripheral wall 112 of the case 110 and to the outside of the seat surface 142b of the adhesive portion 142 of the connector 140. At this time, the first intervening member 151 is in a compressed state between the first adhesive surface 112a1 of the case 110 and the peripheral wall 122 of the lid 120, and seals and holds the lid 120. Further, the first auxiliary intervening member 153 is in a compressed state between the seat surface 142b of the adhesive portion 142 of the connector 140 and the peripheral wall 122 of the lid 120, and seals the lid 120 while exerting the holding force of the lid 120.
　（３－４．効果）
　第二例の箱型電子ユニット２によれば、ケース１１０、蓋１２０、コネクタ１４０の各要素を別体に形成することにより、低コスト化を図ることができる。特に、コネクタ１４０を他要素と別体に形成することにより、コネクタ１４０の本体１４１，１４２に端子１４３を装着することが容易となる。 (3-4. Effect)
According to the box-type electronic unit 2 of the second example, the cost can be reduced by forming each element of the case 110, the lid 120, and the connector 140 separately. In particular, by forming the connector 140 separately from other elements, it becomes easy to attach the terminal 143 to the main bodies 141 and 142 of the connector 140.
　さらに、ケース１１０とコネクタ１４０との間に介在する第二介在部材１５２は、両者に接着しているのに対して、ケース１１０と蓋１２０との間に介在する第一介在部材１５１は、一方である蓋１２０には接着していない。第一介在部材１５１は、ケース１１０に接着されるが、蓋１２０には接着されておらず、蓋１２０に対して非接着状態で保持する。つまり、第一介在部材１５１、第二介在部材１５２および第一補助介在部材１５３は、ケース１１０およびコネクタ１４０の２要素に接着されており、蓋１２０を接着対象としていない。 Further, the second intervening member 152 interposed between the case 110 and the connector 140 is adhered to both, while the first intervening member 151 interposed between the case 110 and the lid 120 is one. It is not adhered to the lid 120. The first intervening member 151 is adhered to the case 110, but is not adhered to the lid 120, and is held in a non-adhesive state with respect to the lid 120. That is, the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 are adhered to the two elements of the case 110 and the connector 140, and the lid 120 is not the object of adhesion.
　仮に、第一介在部材１５１がケース１１０とコネクタ１４０とを接着すると共に、第二介在部材１５２がケース１１０と蓋１２０とを接着する場合には、接着対象が、ケース１１０、コネクタ１４０および蓋１２０の３要素となる。この場合、第一介在部材１５１の形成と、第二介在部材１５２の形成とを、別々のタイミングで行う必要がある。つまり、介在部材１５１，１５２の形成を複数回行う必要がある。これに対して、本例においては、第一介在部材１５１、第二介在部材１５２および第一補助介在部材１５３により接着する対象が、ケース１１０とコネクタ１４０の２要素のみとなる。従って、第一介在部材１５１、第二介在部材１５２、第一補助介在部材１５３を同時に形成することができる。接着機能を有する介在部材１５１，１５２，１５３の形成回数を低減することができる。 If the first intervening member 151 adheres the case 110 and the connector 140 and the second intervening member 152 adheres the case 110 and the lid 120, the objects to be bonded are the case 110, the connector 140, and the lid 120. It becomes three elements of. In this case, it is necessary to form the first intervening member 151 and the second intervening member 152 at different timings. That is, it is necessary to form the intervening members 151 and 152 a plurality of times. On the other hand, in this example, only two elements, the case 110 and the connector 140, are bonded by the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153. Therefore, the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 can be formed at the same time. It is possible to reduce the number of times the intervening members 151, 152, 153 having an adhesive function are formed.
　特に、高分子粘弾性材料の流動性素材を用いることで、流動性素材を、成形型１６０内の所望位置に容易に充填することができる。そして、流動性素材を加熱し且つ固化させることにより、第一介在部材１５１、第二介在部材１５２および第一補助介在部材１５３を形成している。つまり、第一介在部材１５１、第二介在部材１５２および第一補助介在部材１５３が、同時に形成される。 In particular, by using a fluid material of a polymer viscoelastic material, the fluid material can be easily filled in a desired position in the molding die 160. Then, the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 are formed by heating and solidifying the fluid material. That is, the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 are formed at the same time.
　換言すると、流動性素材の加熱および固化により、第一介在部材１５１がケース１１０に接着されること、第二介在部材１５２がケース１１０およびコネクタ１４０に接着されること、および、第一補助介在部材１５３がコネクタ１４０に接着されることが、同時に行われる。従って、流動性素材を成形型１６０内に充填させることと、第一介在部材１５１、第二介在部材１５２および第一補助介在部材１５３を対象に接着させることとが、容易に行うことができる。さらに、第一介在部材１５１の領域、第二介在部材１５２の領域および第一補助介在部材１５３の領域の間で、流動性素材が流動可能となることで、成形型１６０内に流動性素材を充填させることが非常に容易にできる。その結果、低コスト化を図ることができる。さらに、第一介在部材１５１と第二介在部材１５２とを同時に形成することができるため、流動性素材の充填回数を低減することができる。このことからも、低コスト化を図ることができる。 In other words, by heating and solidifying the fluid material, the first intervening member 151 is adhered to the case 110, the second intervening member 152 is adhered to the case 110 and the connector 140, and the first auxiliary intervening member. The 153 is glued to the connector 140 at the same time. Therefore, it is possible to easily fill the mold 160 with the fluid material and to bond the first intervening member 151, the second intervening member 152, and the first auxiliary intervening member 153 to the target. Further, the fluid material can flow between the region of the first intervening member 151, the region of the second intervening member 152, and the region of the first auxiliary intervening member 153, so that the fluid material can be formed in the molding die 160. It can be filled very easily. As a result, the cost can be reduced. Further, since the first intervening member 151 and the second intervening member 152 can be formed at the same time, the number of times of filling the fluid material can be reduced. From this as well, it is possible to reduce the cost.
　（４．第三例の箱型電子ユニット３）
　（４－１．箱型電子ユニット３の外観）
　箱型電子ユニット３の外観について、図１９を参照して説明する。箱型電子ユニット３は、図１９に示すように、ケース２１０、蓋１２０（以下、区別するために「第一蓋１２０」と称する）および第二蓋２６０により扁平状の外形を形成する。本例では、箱型電子ユニット３の外形は、矩形扁平状を図示するが、任意の形状を有する扁平状とすることができる。ケース２１０、第一蓋１２０および第二蓋２６０の内部には、電子回路基板１３０（図２０に示す）および第二電子回路基板２７０（図２０に示す）が収容されている。ここで、第一蓋１２０および電子回路基板１３０は、第二例と同一構成からなる。なお、第二電子回路基板２７０は、回路構成は異なるが、実質的に電子回路基板１３０と同様の構成からなる。 (4. Box-type electronic unit 3 of the third example)
(4-1. Appearance of Box-type Electronic Unit 3)
The appearance of the box-type electronic unit 3 will be described with reference to FIG. As shown in FIG. 19, the box-shaped electronic unit 3 has a flat outer shape formed by a case 210, a lid 120 (hereinafter, referred to as “first lid 120” for distinction), and a second lid 260. In this example, the outer shape of the box-shaped electronic unit 3 is shown as a rectangular flat shape, but it can be a flat shape having an arbitrary shape. An electronic circuit board 130 (shown in FIG. 20) and a second electronic circuit board 270 (shown in FIG. 20) are housed inside the case 210, the first lid 120, and the second lid 260. Here, the first lid 120 and the electronic circuit board 130 have the same configuration as that of the second example. Although the second electronic circuit board 270 has a different circuit configuration, it has substantially the same configuration as the electronic circuit board 130.
　箱型電子ユニット３は、さらに、ケース２１０、第一蓋１２０および第二蓋２６０により形成される扁平状の外形の側面（周面）に、コネクタ１４０を備える。コネクタ１４０は、第二例と同一構成からなる。 The box-type electronic unit 3 further includes a connector 140 on the side surface (peripheral surface) of the flat outer shape formed by the case 210, the first lid 120, and the second lid 260. The connector 140 has the same configuration as that of the second example.
　（４－２．箱型電子ユニット３の各要素の構成）
　箱型電子ユニット３の各要素の構成について、図２０－図２３を参照して説明する。図２０に示すように、箱型電子ユニット３は、電子回路基板１３０と、第二電子回路基板２７０と、コネクタ一体ケース２８０と、第一蓋１２０と、第二蓋２６０とを備える。 (4-2. Configuration of each element of the box-type electronic unit 3)
The configuration of each element of the box-type electronic unit 3 will be described with reference to FIGS. 20 to 23. As shown in FIG. 20, the box-type electronic unit 3 includes an electronic circuit board 130, a second electronic circuit board 270, a connector integrated case 280, a first lid 120, and a second lid 260.
　コネクタ一体ケース２８０は、ケース２１０とコネクタ１４０とが一体に形成された部材である。コネクタ一体ケース２８０は、別体に形成されたケース２１０とコネクタ１４０とを、一体的に接合することにより形成されている。コネクタ一体ケース２８０は、さらに、ケース２１０と第一蓋１２０との間に介在する第一介在部材１５１、ケース２１０とコネクタ１４０との間に介在する第二介在部材２８２、コネクタ１４０と第一蓋１２０との間に介在する第一補助介在部材１５３を備える。第一介在部材１５１および第一補助介在部材１５３は、第二例と同一構成からなる。さらに、コネクタ一体ケース２８０は、ケース２１０と第二蓋２６０との間に介在する第三介在部材２８４を備える。 The connector integrated case 280 is a member in which the case 210 and the connector 140 are integrally formed. The connector integrated case 280 is formed by integrally joining the separately formed case 210 and the connector 140. The connector integrated case 280 further includes a first intervening member 151 interposed between the case 210 and the first lid 120, a second intervening member 282 interposed between the case 210 and the connector 140, and the connector 140 and the first lid. A first auxiliary intervening member 153 interposed between the 120 and 120 is provided. The first intervening member 151 and the first auxiliary intervening member 153 have the same configuration as that of the second example. Further, the connector-integrated case 280 includes a third intervening member 284 interposed between the case 210 and the second lid 260.
　コネクタ一体ケース２８０について、図２１－図２３を参照して説明する。コネクタ一体ケース２８０を構成するケース２１０は、扁平状に形成されており、電子回路基板１３０および第二電子回路基板２７０を収容する。ケース２１０は、第二例におけるケース１１０と同種の材料により形成されている。 The connector integrated case 280 will be described with reference to FIGS. 21 to 23. The case 210 constituting the connector integrated case 280 is formed in a flat shape and accommodates the electronic circuit board 130 and the second electronic circuit board 270. The case 210 is made of the same material as the case 110 in the second example.
　ケース２１０は、図２１に示すように、筒状に形成されている。ケース２１０は、内部に仕切板を有していてもよいし、貫通筒状に形成してもよい。ケース２１０は、少なくとも周壁２１１を備える。周壁２１１は、環状に形成されており、環状の軸方向一端に開口する蓋用開口部１１２ａを有し、環状の軸方向他端に開口する第二蓋用開口部２１３を有する。周壁２１１は、環状の軸方向に交差する方向に開口するコネクタ用開口部２１４を有する。 As shown in FIG. 21, the case 210 is formed in a tubular shape. The case 210 may have a partition plate inside, or may be formed in a through-cylindrical shape. The case 210 includes at least a peripheral wall 211. The peripheral wall 211 is formed in an annular shape, has an annular lid opening 112a that opens at one end in the axial direction, and has a second lid opening 213 that opens at the other end in the annular direction. The peripheral wall 211 has a connector opening 214 that opens in a direction intersecting the annular axial direction.
　ここで、蓋用開口部１１２ａは、第二例と同一構成からなる。すなわち、周壁２１１は、蓋用開口部１１２ａの周縁を形成する周面に、第一接着面１１２ａ１を有する。第一接着面１１２ａ１は、第一介在部材１５１との接着面を構成する。 Here, the lid opening 112a has the same configuration as the second example. That is, the peripheral wall 211 has a first adhesive surface 112a1 on the peripheral surface forming the peripheral edge of the lid opening 112a. The first adhesive surface 112a1 constitutes an adhesive surface with the first intervening member 151.
　第二蓋用開口部２１３は、蓋用開口部１１２ａと反対側の端に形成されている。周壁２１１は、第二蓋用開口部２１３の周縁を形成する周面に、第三接着面２１３ａを有する。ここで、第三接着面２１３ａは、周壁２１１の外周面に形成する場合を例にあげるが、周壁２１１の内周面に形成することもできる。そして、第三接着面２１３ａは、周壁２１１の軸方向に平行な面を有している。第三接着面２１３ａは、周方向に連続した筒状面が形成される。本例では、第三接着面２１３ａは、外筒面を形成する。詳細は後述するが、第三接着面２１３ａは、第三介在部材２８４との接着面を構成する。 The second lid opening 213 is formed at the end opposite to the lid opening 112a. The peripheral wall 211 has a third adhesive surface 213a on the peripheral surface forming the peripheral edge of the second lid opening 213. Here, the case where the third adhesive surface 213a is formed on the outer peripheral surface of the peripheral wall 211 is given as an example, but it can also be formed on the inner peripheral surface of the peripheral wall 211. The third adhesive surface 213a has a surface parallel to the axial direction of the peripheral wall 211. The third adhesive surface 213a is formed with a tubular surface continuous in the circumferential direction. In this example, the third adhesive surface 213a forms an outer cylinder surface. Although the details will be described later, the third adhesive surface 213a constitutes an adhesive surface with the third intervening member 284.
　コネクタ用開口部２１４は、周壁２１１における周方向の開口部分に対応する。コネクタ用開口部２１４は、蓋用開口部１１２ａに連続的につながって形成されている。ただし、本例では、コネクタ用開口部２１４は、第二蓋用開口部２１３に対してはつながっていない。つまり、周壁２１１は、コネクタ用開口部２１４の周縁を形成部位として、Ｕ字状内面を有する。そして、周壁２１１は、Ｕ字状内面のうち、対向する両側面である第二接着面２１４ａを有する。第二接着面２１４ａは、コネクタ用開口部２１４の周縁において、蓋用開口部１１２ａの側および第二蓋用開口部２１３の側を除く、少なくとも両側面の２箇所に形成されている。ただし、第二接着面２１４ａは、上記の両側面の２箇所に加えて、第二蓋用開口部２１３の一部に形成されるようにしてもよい。 The connector opening 214 corresponds to the circumferential opening in the peripheral wall 211. The connector opening 214 is formed by being continuously connected to the lid opening 112a. However, in this example, the connector opening 214 is not connected to the second lid opening 213. That is, the peripheral wall 211 has a U-shaped inner surface with the peripheral edge of the connector opening 214 as a forming portion. The peripheral wall 211 has a second adhesive surface 214a which is a facing side surface of the U-shaped inner surface. The second adhesive surface 214a is formed on the peripheral edge of the connector opening 214 at at least two locations on both side surfaces except the side of the lid opening 112a and the side of the second lid opening 213. However, the second adhesive surface 214a may be formed in a part of the second lid opening 213 in addition to the above two locations on both side surfaces.
　なお、コネクタ用開口部２１４は、蓋用開口部１１２ａに連続的につながって形成され、且つ、第二蓋用開口部２１３に連続的につながって形成されるようにしてもよい。この場合、周壁２１１は、コネクタ用開口部２１４の周縁として、周壁２１１の周方向に対向する２つの面である第二接着面２１４ａを有する。 Note that the connector opening 214 may be formed by being continuously connected to the lid opening 112a and continuously connected to the second lid opening 213. In this case, the peripheral wall 211 has a second adhesive surface 214a, which is two surfaces facing the peripheral wall 211 in the circumferential direction, as the peripheral edge of the connector opening 214.
　コネクタ一体ケース２８０を構成する第一介在部材１５１は、第二例の第一介在部材１５１と同一構成からなる。つまり、第一介在部材１５１は、ケース２１０の第一接着面１１２ａ１に接着されており、ケース２１０の周壁２１１の軸方向から見た場合に、Ｃ字状に形成されている。 The first intervening member 151 constituting the connector integrated case 280 has the same configuration as the first intervening member 151 of the second example. That is, the first intervening member 151 is adhered to the first adhesive surface 112a1 of the case 210, and is formed in a C shape when viewed from the axial direction of the peripheral wall 211 of the case 210.
　第二介在部材２８２は、高分子粘弾性材料により形成されている。第二介在部材２８２は、ケース２１０の周壁２１１とコネクタ１４０との間に介在する。第二介在部材２８２は、図２３に示すように、コネクタ用開口部２１４の周縁のうちの第二接着面２１４ａとコネクタ１４０の接着部１４２の外周面１４２ａとの対向面のそれぞれに接着されている。つまり、第二介在部材２８２は、コネクタ１４０の接着部１４２の外周面のうち蓋用開口部１１２ａの側および第二蓋用開口部２１３の側を除く、両側面の２箇所に形成されている。そして、第二介在部材２８２は、コネクタ用開口部２１４の周縁とコネクタ１４０の接着部１４２の外周面１４２ａとの間をシールする。 The second intervening member 282 is formed of a polymer viscoelastic material. The second intervening member 282 is interposed between the peripheral wall 211 of the case 210 and the connector 140. As shown in FIG. 23, the second intervening member 282 is adhered to each of the facing surfaces of the second adhesive surface 214a of the peripheral edge of the connector opening 214 and the outer peripheral surface 142a of the adhesive portion 142 of the connector 140. There is. That is, the second intervening member 282 is formed at two positions on both side surfaces of the outer peripheral surface of the adhesive portion 142 of the connector 140, excluding the side of the lid opening 112a and the side of the second lid opening 213. .. Then, the second intervening member 282 seals between the peripheral edge of the connector opening 214 and the outer peripheral surface 142a of the adhesive portion 142 of the connector 140.
　第一補助介在部材１５３は、第二例の第一補助介在部材１５３と同一構成からなる。第一補助介在部材１５３は、第一介在部材１５１と連続的に形成されている。さらに、第一補助介在部材１５３は、第二介在部材２８２とも連続的に形成されるようにしてもよい。つまり、第二介在部材２８２は、第一介在部材１５１と第一補助介在部材１５３の少なくとも一方に連続的に形成されている。 The first auxiliary intervening member 153 has the same configuration as the first auxiliary intervening member 153 of the second example. The first auxiliary intervening member 153 is formed continuously with the first intervening member 151. Further, the first auxiliary intervening member 153 may be formed continuously with the second intervening member 282. That is, the second intervening member 282 is continuously formed on at least one of the first intervening member 151 and the first auxiliary intervening member 153.
　第三介在部材２８４は、高分子粘弾性材料により形成されている。第三介在部材２８４は、ケース２１０の周壁２１１の第三接着面２１３ａと第二蓋２６０との間に介在する。第三介在部材２８４は、図２０および図２３に示すように、ケース２１０の第二蓋用開口部２１３の周縁を形成する周面である第三接着面２１３ａに接着されている。 The third interposition member 284 is formed of a polymer viscoelastic material. The third intervening member 284 is interposed between the third adhesive surface 213a of the peripheral wall 211 of the case 210 and the second lid 260. As shown in FIGS. 20 and 23, the third intervening member 284 is adhered to the third adhesive surface 213a, which is a peripheral surface forming the peripheral edge of the second lid opening 213 of the case 210.
　コネクタ用開口部２１４が、第二蓋用開口部２１３に連続的につながっていない場合には、第三介在部材２８４は、周方向に連続した筒状に形成されている。一方、コネクタ用開口部２１４が、第二蓋用開口部２１３に連続的につながっている場合には、第三介在部材２８４は、Ｕ字状に形成される。また、第三介在部材２８４は、第二介在部材２８２と連続的に形成されている。 When the connector opening 214 is not continuously connected to the second lid opening 213, the third intervening member 284 is formed in a tubular shape continuous in the circumferential direction. On the other hand, when the connector opening 214 is continuously connected to the second lid opening 213, the third intervening member 284 is formed in a U shape. Further, the third intervening member 284 is continuously formed with the second intervening member 282.
　さらに、第三介在部材２８４は、第三接着面２１３ａとは反対側の面、本例では外周面に、周方向に延びる複数のリップ２８４ａを有する。リップ２８４ａが、第二蓋２６０に対して非接着状態で接触する部分である。そして、リップ２８４ａが、第二蓋２６０との間でシール機能を発揮し、第二蓋２６０の保持力を発揮する。つまり、リップ２８４ａは、第二蓋２６０に対して非接着状態であり且つシールした状態で第二蓋２６０を保持する部分として機能する。 Further, the third intervening member 284 has a plurality of lips 284a extending in the circumferential direction on the surface opposite to the third adhesive surface 213a, in this example, the outer peripheral surface. The lip 284a is a portion that comes into contact with the second lid 260 in a non-adhesive state. Then, the lip 284a exerts a sealing function with the second lid 260 and exerts a holding force of the second lid 260. That is, the lip 284a functions as a portion that holds the second lid 260 in a non-adhesive state and a sealed state with respect to the second lid 260.
　ここで、第三接着面２１３ａが周壁２１１の内周面に形成されている場合には、第三介在部材２８４は、内周面に複数のリップ２８４ａを有することになる。また、第三介在部材２８４は、第一介在部材１５１と同一の高分子粘弾性材料により形成される。 Here, when the third adhesive surface 213a is formed on the inner peripheral surface of the peripheral wall 211, the third intervening member 284 will have a plurality of lips 284a on the inner peripheral surface. Further, the third intervening member 284 is formed of the same polymer viscoelastic material as the first intervening member 151.
　ここで、コネクタ用開口部２１４が、第二蓋用開口部２１３に連続的につながって形成される場合には、コネクタ一体ケース２８０は、さらに、コネクタ１４０と第二蓋２６０との間に介在する第三補助介在部材（図示せず）を備える。第三補助介在部材は、第二蓋用開口部２１３とコネクタ用開口部２１４との接続部位に形成される。第三補助介在部材は、位置および形成対象が異なるが、実質的に、第一補助介在部材１５３と同様の構成からなる。 Here, when the connector opening 214 is formed by being continuously connected to the second lid opening 213, the connector integrated case 280 is further interposed between the connector 140 and the second lid 260. A third auxiliary intervening member (not shown) is provided. The third auxiliary intervening member is formed at a connection portion between the second lid opening 213 and the connector opening 214. Although the position and the object to be formed are different, the third auxiliary intervening member has substantially the same configuration as the first auxiliary intervening member 153.
　第二蓋２６０は、図２０に示すように、ケース２１０の第二蓋用開口部２１３を閉塞する。第二蓋２６０は、第一蓋１２０と同様に、金属または樹脂により形成されている。第二蓋２６０は、ケース２１０に対応する有底容器状に形成されている。 As shown in FIG. 20, the second lid 260 closes the second lid opening 213 of the case 210. The second lid 260, like the first lid 120, is made of metal or resin. The second lid 260 is formed in the shape of a bottomed container corresponding to the case 210.
　詳細には、第二蓋２６０は、底面２６１と、周壁２６２とを備える。底面２６１は、平板状に形成されている。底面２６１の外形は、ケース２１０の第二蓋用開口部２１３の外形と同様に形成されている。つまり、底面２６１の外形は、例えば、矩形状に形成されている。 Specifically, the second lid 260 includes a bottom surface 261 and a peripheral wall 262. The bottom surface 261 is formed in a flat plate shape. The outer shape of the bottom surface 261 is formed in the same manner as the outer shape of the second lid opening 213 of the case 210. That is, the outer shape of the bottom surface 261 is formed in a rectangular shape, for example.
　周壁２６２は、底面２６１の周縁を全周に亘って囲むように形成されている。周壁２６２の内周面は、第三介在部材２８４のリップ２８４ａに非接着状態で接触する部位である。つまり、第三介在部材２８４が、ケース２１０の周壁２１１の第三接着面２１３ａと第二蓋２６０の周壁２６２の内周面との間に挟まれた状態でシールする。 The peripheral wall 262 is formed so as to surround the peripheral edge of the bottom surface 261 over the entire circumference. The inner peripheral surface of the peripheral wall 262 is a portion that comes into contact with the lip 284a of the third intervening member 284 in a non-adhesive state. That is, the third intervening member 284 is sealed while being sandwiched between the third adhesive surface 213a of the peripheral wall 211 of the case 210 and the inner peripheral surface of the peripheral wall 262 of the second lid 260.
　（４－３．箱型電子ユニット３の製造方法）
　箱型電子ユニット３の製造方法について、図２４および図２５を参照して説明する。図２４および図２５に示すように、ケース２１０およびコネクタ１４０を、成形型２９０内に配置する（ステップＳ２１）。成形型２９０は、第一介在部材１５１、第二介在部材２８２、第一補助介在部材１５３および第三介在部材２８４を成形するための型である。成形型２９０は、高分子粘弾性材料の流動性素材を供給するための１つ以上の供給口２９１を有している。 (4-3. Manufacturing method of box-type electronic unit 3)
A method of manufacturing the box-type electronic unit 3 will be described with reference to FIGS. 24 and 25. As shown in FIGS. 24 and 25, the case 210 and the connector 140 are placed in the mold 290 (step S21). The molding die 290 is a mold for molding the first intervening member 151, the second intervening member 282, the first auxiliary intervening member 153, and the third intervening member 284. The mold 290 has one or more supply ports 291 for supplying a fluid material of a polymer viscoelastic material.
　続いて、高分子粘弾性材料の流動性素材を、成形型２９０の供給口２９１から供給する。そして、流動性素材を、第一介在部材１５１の領域、第二介在部材２８２の領域、第一補助介在部材１５３の領域および第三介在部材２８４の領域との間で流動させる。例えば、供給口２９１は、第一介在部材１５１の領域に連通している。この場合、流動性素材は、第一介在部材１５１の領域から第二介在部材２８２の領域へ流動し、且つ、第一介在部材１５１の領域から第一補助介在部材１５３の領域へ流動する。さらに、流動性素材は、第二介在部材２８２の領域から第三介在部材２８４の領域へ流動する。 Subsequently, the fluid material of the polymer viscoelastic material is supplied from the supply port 291 of the molding die 290. Then, the fluid material is made to flow between the region of the first intervening member 151, the region of the second intervening member 282, the region of the first auxiliary intervening member 153, and the region of the third intervening member 284. For example, the supply port 291 communicates with the region of the first intervening member 151. In this case, the fluid material flows from the region of the first intervening member 151 to the region of the second intervening member 282, and flows from the region of the first intervening member 151 to the region of the first auxiliary intervening member 153. Further, the fluid material flows from the region of the second intervening member 282 to the region of the third intervening member 284.
　このようにして、流動性素材は、第一介在部材１５１の領域、第二介在部材１５２の領域、第一補助介在部材１５３の領域および第三介在部材２８４の領域に充填される（ステップＳ２２）。なお、成形型２９０の供給口２９１は、第二介在部材２８２の領域に連通するようにしてもよいし、第一補助介在部材１５３の領域に連通するようにしてもよいし、第三介在部材２８４の領域に連通するようにしてもよい。 In this way, the fluid material is filled in the region of the first intervening member 151, the region of the second intervening member 152, the region of the first auxiliary intervening member 153, and the region of the third intervening member 284 (step S22). .. The supply port 291 of the molding die 290 may communicate with the region of the second intervening member 282, may communicate with the region of the first auxiliary intervening member 153, or may communicate with the region of the third intervening member 153. It may communicate with the area of 284.
　続いて、成形型２９０内において、流動性素材を加熱して、さらに流動性素材を固化させることにより、第一介在部材１５１、第二介在部材２８２、第一補助介在部材１５３および第三介在部材２８４が形成される（ステップＳ２３）。 Subsequently, in the molding die 290, the fluid material is heated to further solidify the fluid material, whereby the first intervening member 151, the second intervening member 282, the first auxiliary intervening member 153, and the third intervening member are solidified. 284 is formed (step S23).
　このとき、流動性素材の加熱によって、第一介在部材１５１は、ケース２１０の第一接着面１１２ａ１に接着される。また、第二介在部材２８２は、ケース２１０の第二接着面２１４ａに接着されると共に、コネクタ１４０の接着部１４２の外周面１４２ａに接着される。さらに、第一補助介在部材１５３は、コネクタ１４０の接着部１４２の座面１４２ｂに接着される。さらに、第三介在部材２８４は、ケース２１０の第三接着面２１３ａに接着される。このようにして、コネクタ一体ケース２８０が完成する。 At this time, the first intervening member 151 is adhered to the first adhesive surface 112a1 of the case 210 by heating the fluid material. Further, the second intervening member 282 is adhered to the second adhesive surface 214a of the case 210 and also to the outer peripheral surface 142a of the adhesive portion 142 of the connector 140. Further, the first auxiliary intervening member 153 is adhered to the seat surface 142b of the adhesive portion 142 of the connector 140. Further, the third intervening member 284 is adhered to the third adhesive surface 213a of the case 210. In this way, the connector integrated case 280 is completed.
　続いて、コネクタ一体ケース２８０に、電子回路基板１３０を取り付ける（ステップＳ２４）。続いて、コネクタ一体ケース２８０に、蓋１２０を装着する（ステップＳ２５）。詳細には、蓋１２０の周壁１２２を、ケース２１０の周壁２１１の第一接着面１１２ａ１の外側、且つ、コネクタ１４０の接着部１４２の座面１４２ｂの外側に、嵌め込む。このとき、第一介在部材１５１が、ケース２１０の第一接着面１１２ａ１と蓋１２０の周壁１２２との間に圧縮された状態となり、シールすると共に、蓋１２０を保持する。さらに、第一補助介在部材１５３が、コネクタ１４０の接着部１４２の座面１４２ｂと蓋１２０の周壁１２２との間に圧縮された状態となり、シールすると共に、蓋１２０の保持力を発揮する。 Subsequently, the electronic circuit board 130 is attached to the connector integrated case 280 (step S24). Subsequently, the lid 120 is attached to the connector integrated case 280 (step S25). Specifically, the peripheral wall 122 of the lid 120 is fitted to the outside of the first adhesive surface 112a1 of the peripheral wall 211 of the case 210 and to the outside of the seat surface 142b of the adhesive portion 142 of the connector 140. At this time, the first intervening member 151 is in a compressed state between the first adhesive surface 112a1 of the case 210 and the peripheral wall 122 of the lid 120, and seals and holds the lid 120. Further, the first auxiliary intervening member 153 is in a compressed state between the seat surface 142b of the adhesive portion 142 of the connector 140 and the peripheral wall 122 of the lid 120, and seals the lid 120 while exerting the holding force of the lid 120.
　続いて、蓋１２０まで装着した一体物を反転させて、コネクタ一体ケース２８０に、第二電子回路基板２７０を取り付ける（ステップＳ２６）。続いて、コネクタ一体ケース２８０に、第二蓋２６０を装着する（ステップＳ２７）。詳細には、第二蓋２６０の周壁２６２を、ケース２１０の周壁２１１の第三接着面２１３ａの外側に嵌め込む。このとき、第三介在部材２８４が、ケース２１０の第三接着面２１３ａと第二蓋２６０の周壁２６２との間に圧縮された状態となり、シールすると共に、第二蓋２６０を保持する。 Subsequently, the integrated object attached up to the lid 120 is inverted, and the second electronic circuit board 270 is attached to the connector integrated case 280 (step S26). Subsequently, the second lid 260 is attached to the connector integrated case 280 (step S27). Specifically, the peripheral wall 262 of the second lid 260 is fitted to the outside of the third adhesive surface 213a of the peripheral wall 211 of the case 210. At this time, the third intervening member 284 is in a compressed state between the third adhesive surface 213a of the case 210 and the peripheral wall 262 of the second lid 260, seals the case 210, and holds the second lid 260.
　（４－４．効果）
　第二例に対して、第三例では、コネクタ一体ケース２８０が第三介在部材２８４をさらに備えるが、製造工程数としては同数である。つまり、第一介在部材１５１、第二介在部材２８２、第一補助介在部材１５３および第三介在部材２８４が、容易に形成できる。その結果、箱型電子ユニット３の低コスト化を図ることができる。 (4-4. Effect)
In contrast to the second example, in the third example, the connector integrated case 280 further includes the third intervening member 284, but the number of manufacturing steps is the same. That is, the first intervening member 151, the second intervening member 282, the first auxiliary intervening member 153, and the third intervening member 284 can be easily formed. As a result, the cost of the box-type electronic unit 3 can be reduced.
　（５．第四例の箱型電子ユニット４）
　（５－１．箱型電子ユニット４の外観）
　箱型電子ユニット４の外観について、図２６および図２７を参照して説明する。箱型電子ユニット４は、図２６および図２７に示すように、ケース３１０と蓋３２０とにより扁平状の外形を形成する。本例では、箱型電子ユニット４の外形は、矩形扁平状を図示するが、任意の形状を有する扁平状とすることができる。ケース３１０と蓋３２０の内部には、電子回路基板１３０（図２８に示す）が収容されている。ここで、電子回路基板１３０は、第二例と実質的に同一構成からなる。 (5. Box-type electronic unit 4 of the fourth example)
(5-1. Appearance of Box-type Electronic Unit 4)
The appearance of the box-shaped electronic unit 4 will be described with reference to FIGS. 26 and 27. As shown in FIGS. 26 and 27, the box-shaped electronic unit 4 has a flat outer shape formed by the case 310 and the lid 320. In this example, the outer shape of the box-shaped electronic unit 4 is shown as a rectangular flat shape, but it can be a flat shape having an arbitrary shape. An electronic circuit board 130 (shown in FIG. 28) is housed inside the case 310 and the lid 320. Here, the electronic circuit board 130 has substantially the same configuration as that of the second example.
　箱型電子ユニット４は、さらに、ケース３１０と蓋３２０とにより形成される扁平状の外形の扁平面に、外部コネクタに接続されるコネクタ３４０を備える。コネクタ３４０は、長円形状の接続孔を有する。コネクタ３４０の接続孔は、例えば、ケース３１０と蓋３２０とにより形成される扁平状の外形の側方に向かって延びるように形成されている。なお、コネクタ３４０の接続孔は、扁平状の外形の法線方向に向かって延びるように形成してもよいし、法線方向に任意の角度を有する方向（例えば、４５°の方向）に向かって延びるように形成してもよい。コネクタ３４０の端子は、電子回路基板１３０（図２８に示す）に電気的に接続されている。 The box-type electronic unit 4 further includes a connector 340 connected to an external connector on a flat outer flat surface formed by the case 310 and the lid 320. The connector 340 has an oval-shaped connection hole. The connection hole of the connector 340 is formed so as to extend toward the side of the flat outer shape formed by, for example, the case 310 and the lid 320. The connection hole of the connector 340 may be formed so as to extend in the normal direction of the flat outer shape, or may be formed in a direction having an arbitrary angle in the normal direction (for example, a direction of 45 °). It may be formed so as to extend. The terminals of the connector 340 are electrically connected to the electronic circuit board 130 (shown in FIG. 28).
　（５－２．箱型電子ユニット４の各要素の構成）
　箱型電子ユニット４の各要素の構成について、図２８－図３０を参照して説明する。図２８に示すように、箱型電子ユニット４は、電子回路基板１３０と、コネクタ一体ケース３５０と、蓋３２０とを備える。 (5-2. Configuration of each element of the box-type electronic unit 4)
The configuration of each element of the box-type electronic unit 4 will be described with reference to FIGS. 28 to 30. As shown in FIG. 28, the box-type electronic unit 4 includes an electronic circuit board 130, a connector integrated case 350, and a lid 320.
　コネクタ一体ケース３５０は、ケース３１０とコネクタ３４０とが一体に形成された部材である。コネクタ一体ケース３５０は、別体に形成されたケース３１０とコネクタ３４０とを、一体的に接合することにより形成されている。コネクタ一体ケース３５０は、さらに、ケース３１０と蓋３２０との間に介在する第一介在部材３５１、ケース３１０とコネクタ３４０との間に介在する第二介在部材３５２を備える。 The connector integrated case 350 is a member in which the case 310 and the connector 340 are integrally formed. The connector integrated case 350 is formed by integrally joining the separately formed case 310 and the connector 340. The connector-integrated case 350 further includes a first intervening member 351 interposed between the case 310 and the lid 320, and a second intervening member 352 interposed between the case 310 and the connector 340.
　コネクタ一体ケース３５０について、図２８－図３０を参照して説明する。コネクタ一体ケース３５０を構成するケース３１０は、扁平状に形成されており、電子回路基板１３０を収容する。ケース３１０は、第二例におけるケース１１０と同種の材料により形成されている。 The connector integrated case 350 will be described with reference to FIGS. 28-30. The case 310 constituting the connector integrated case 350 is formed in a flat shape and accommodates the electronic circuit board 130. The case 310 is made of the same material as the case 110 in the second example.
　ケース３１０は、図２９に示すように、有底容器状に形成されている。ケース３１０は、底面３１１と、周壁３１２とを備える。底面３１１は、平面状に形成されており、例えば矩形に形成されている。底面３１１は、電子回路基板１３０の外形に対応する形状に形成されている。底面３１１の外面は、図２６に示すように、放熱性を良好とするために、凹凸状に形成されている。 As shown in FIG. 29, the case 310 is formed in the shape of a bottomed container. The case 310 includes a bottom surface 311 and a peripheral wall 312. The bottom surface 311 is formed in a plane shape, for example, in a rectangular shape. The bottom surface 311 is formed in a shape corresponding to the outer shape of the electronic circuit board 130. As shown in FIG. 26, the outer surface of the bottom surface 311 is formed in an uneven shape in order to improve heat dissipation.
　さらに、底面３１１は、底面３１１の法線方向に開口するコネクタ用開口部３１１ａを有する。コネクタ用開口部３１１ａは、例えば、矩形状に形成されている。底面３１１は、コネクタ用開口部３１１ａの周縁を形成する内周面に、第二接着面３１１ａ１を有する。第二接着面３１１ａ１の中心軸線（第二中心軸線）は、底面３１１の法線方向に平行な軸線である。詳細は後述するが、第二接着面３１１ａ１は、第二介在部材３５２との接着面を構成する。なお、コネクタ用開口部３１１ａは、底面３１１のみに形成してもよいし、底面３１１に加えて底面３１１から法線方向に延びる筒状部を有するようにしてもよい。 Further, the bottom surface 311 has a connector opening 311a that opens in the normal direction of the bottom surface 311. The connector opening 311a is formed in a rectangular shape, for example. The bottom surface 311 has a second adhesive surface 311a1 on an inner peripheral surface forming the peripheral edge of the connector opening 311a. The central axis (second central axis) of the second adhesive surface 311a1 is an axis parallel to the normal direction of the bottom surface 311. Although the details will be described later, the second adhesive surface 311a1 constitutes an adhesive surface with the second intervening member 352. The connector opening 311a may be formed only on the bottom surface 311 or may have a tubular portion extending in the normal direction from the bottom surface 311 in addition to the bottom surface 311.
　周壁３１２は、図２９に示すように、底面３１１の周縁を全周に亘って囲むように形成されている。つまり、周壁３１２は、周方向に連続した筒状に形成されている。周壁３１２は、周壁３１２の軸方向のうち底面３１１とは反対側の端に、底面３１１の法線方向に開口する蓋用開口部３１２ａを有する。蓋用開口部３１２ａは、例えば、電子回路基板１３０の外形に対応する矩形状を有する。周壁３１２は、蓋用開口部３１２ａの周縁を形成する周面に、第一接着面３１２ａ１を有する。ここで、第一接着面３１２ａ１は、周壁３１２の外周面に形成する場合を例にあげるが、周壁３１２の内周面に形成することもできる。そして、第一接着面３１２ａ１は、周壁３１２の軸方向に平行な面を有している。詳細は後述するが、第一接着面３１２ａ１は、第一介在部材３５１との接着面を構成する。 As shown in FIG. 29, the peripheral wall 312 is formed so as to surround the peripheral edge of the bottom surface 311 over the entire circumference. That is, the peripheral wall 312 is formed in a tubular shape continuous in the circumferential direction. The peripheral wall 312 has a lid opening 312a that opens in the normal direction of the bottom surface 311 at an end opposite to the bottom surface 311 in the axial direction of the peripheral wall 312. The lid opening 312a has, for example, a rectangular shape corresponding to the outer shape of the electronic circuit board 130. The peripheral wall 312 has a first adhesive surface 312a1 on the peripheral surface forming the peripheral edge of the lid opening 312a. Here, the case where the first adhesive surface 312a1 is formed on the outer peripheral surface of the peripheral wall 312 will be given as an example, but it can also be formed on the inner peripheral surface of the peripheral wall 312. The first adhesive surface 312a1 has a surface parallel to the axial direction of the peripheral wall 312. Although the details will be described later, the first adhesive surface 312a1 constitutes an adhesive surface with the first intervening member 351.
　ここで、第一接着面３１２ａ１と第二接着面３１１ａ１とは、独立して形成されている。つまり、第一接着面３１２ａ１と第二接着面３１１ａ１とは、つながっていない。また、第一接着面３１２ａ１の中心軸線（第一中心軸線）と第二接着面３１１ａ１の中心軸線とは、平行である。従って、第一接着面３１２ａ１は、第一中心軸線を有する筒状を構成しており、第二接着面３１１ａ１は、第二中心軸線を有する筒状を構成している。 Here, the first adhesive surface 312a1 and the second adhesive surface 311a1 are formed independently. That is, the first adhesive surface 312a1 and the second adhesive surface 311a1 are not connected. Further, the central axis of the first adhesive surface 312a1 (first central axis) and the central axis of the second adhesive surface 311a1 are parallel. Therefore, the first adhesive surface 312a1 has a tubular shape having a first central axis, and the second adhesive surface 311a1 has a tubular shape having a second central axis.
　ケース３１０は、さらに、蓋３２０と締結するための締結部材（図示せず）を取り付けるための取付座３１３を有する。ケース３１０は、例えば、矩形の４隅に取付座３１３を有する。取付座３１３は、締結部材を挿通するための孔が形成されている。 The case 310 further has a mounting seat 313 for mounting a fastening member (not shown) for fastening to the lid 320. The case 310 has mounting seats 313 at four corners of the rectangle, for example. The mounting seat 313 is formed with a hole for inserting the fastening member.
　コネクタ一体ケース３５０を構成するコネクタ３４０は、図２９および図３０に示すように、ケース３１０と別体に形成されている。コネクタ３４０は、ケース３１０のコネクタ用開口部３１１ａに固定される。さらに、コネクタ３４０は、電子回路基板（図２８に示す）と外部とを電気的に接続する。 As shown in FIGS. 29 and 30, the connector 340 constituting the connector integrated case 350 is formed separately from the case 310. The connector 340 is fixed to the connector opening 311a of the case 310. Further, the connector 340 electrically connects the electronic circuit board (shown in FIG. 28) to the outside.
　ここで、コネクタ３４０は、相手装着部３４１と、接着部３４２と、複数の端子３４３とを備える。相手装着部３４１と接着部３４２とにより構成される本体（３４１，３４２）は、例えば、樹脂により形成されている。そして、相手装着部３４１と接着部３４２とは、一体に形成されている。 Here, the connector 340 includes a mating portion 341, an adhesive portion 342, and a plurality of terminals 343. The main body (341, 342) composed of the mating portion 341 and the adhesive portion 342 is formed of, for example, resin. The mating portion 341 and the adhesive portion 342 are integrally formed.
　相手装着部３４１は、ケース３１０の底面３１１より外側に露出して、突出する部分を構成する。相手装着部３４１は、外部の相手部材のコネクタ（図示せず）と装着される部分である。相手装着部３４１は、例えば、底面３１１の面方向に平行な中心軸線を有する筒状に形成されている。なお、相手装着部３４１は、底面３１１の面法線方向に平行な中心軸線を有する筒状に形成されるようにしてもよいし、底面３１１の面方向に任意の角度となる中心軸線を有する筒状に形成されるようにしてもよい。また、相手装着部３４１は、例えば長円筒状に形成されているが、任意の筒状に形成されるようにしてもよい。 The mating portion 341 is exposed to the outside from the bottom surface 311 of the case 310 and constitutes a protruding portion. The mating portion 341 is a portion to be mounted with a connector (not shown) of an external mating member. The mating portion 341 is formed, for example, in a tubular shape having a central axis parallel to the surface direction of the bottom surface 311. The mating portion 341 may be formed in a tubular shape having a central axis parallel to the surface normal direction of the bottom surface 311 or having a central axis line at an arbitrary angle in the surface direction of the bottom surface 311. It may be formed in a tubular shape. Further, although the mating portion 341 is formed in a long cylindrical shape, for example, it may be formed in an arbitrary tubular shape.
　接着部３４２は、相手装着部３４１の端側に位置し、例えば、相手装着部３４１の筒状の中心軸線に直交する軸線を中心とする外周面３４２ａを有する。なお、接着部３４２は、相手装着部３４１の筒状の中心軸線に平行または同軸である軸線を中心とする外周面３４２ａを有するようにしてもよく、相手装着部３４１の筒状の中心軸線に任意の角度を有する軸線を中心とする外周面３４２ａを有するようにしてもよい。接着部３４２の外周面３４２ａは、例えば矩形状を有しており、コネクタ用開口部３１１ａの第二接着面３１１ａ１に対向する。 The adhesive portion 342 is located on the end side of the mating portion mounting portion 341, and has, for example, an outer peripheral surface 342a centered on an axis orthogonal to the tubular central axis of the mating mounting portion 341. The adhesive portion 342 may have an outer peripheral surface 342a centered on an axis parallel to or coaxial with the tubular central axis of the mating portion 341, and may be provided on the tubular central axis of the mating mounting portion 341. It may have an outer peripheral surface 342a centered on an axis having an arbitrary angle. The outer peripheral surface 342a of the adhesive portion 342 has, for example, a rectangular shape, and faces the second adhesive surface 311a1 of the connector opening 311a.
　複数の端子３４３は、例えば、金属によりＬ字状に形成されており、相手装着部３４１および接着部３４２により構成されるコネクタ３４０の本体にインサート成形されている。端子３４３のＬ字状の一端は、相手装着部３４１側に露出しており、他端は、接着部３４２側に露出している。なお、相手装着部３４１と接着部３４２とが平行または同軸である場合には、端子３４３は、直線状に形成するようにしてもよい。また、相手装着部３４１と接着部３４２とが任意の角度（例えば４５°）を有する場合には、端子３４３も、任意の角度（例えば４５°）を有するように形成される。 The plurality of terminals 343 are, for example, formed in an L shape by metal, and are insert-molded into the main body of the connector 340 composed of the mating portion 341 and the adhesive portion 342. One end of the terminal 343 is exposed to the mating portion 341 side, and the other end is exposed to the adhesive portion 342 side. When the mating portion 341 and the adhesive portion 342 are parallel or coaxial, the terminal 343 may be formed in a straight line. Further, when the mating portion 341 and the adhesive portion 342 have an arbitrary angle (for example, 45 °), the terminal 343 is also formed so as to have an arbitrary angle (for example, 45 °).
　コネクタ一体ケース３５０を構成する第一介在部材３５１は、高分子粘弾性材料により形成されている。第一介在部材３５１は、ケース３１０の周壁３１２と蓋３２０との間に介在する。第一介在部材３５１は、図２８および図３１に示すように、ケース３１０の蓋用開口部３１２ａの周縁に接着されている。詳細には、第一介在部材３５１は、ケース３１０の周壁３１２において、蓋用開口部３１２ａの周縁を形成する周面である第一接着面３１２ａ１に接着されている。つまり、第一介在部材３５１は、周方向に連続した筒状に形成されている。 The first intervening member 351 constituting the connector integrated case 350 is made of a polymer viscoelastic material. The first intervening member 351 is interposed between the peripheral wall 312 of the case 310 and the lid 320. As shown in FIGS. 28 and 31, the first intervening member 351 is adhered to the peripheral edge of the lid opening 312a of the case 310. Specifically, the first intervening member 351 is adhered to the first adhesive surface 312a1, which is a peripheral surface forming the peripheral edge of the lid opening 312a, on the peripheral wall 312 of the case 310. That is, the first intervening member 351 is formed in a tubular shape continuous in the circumferential direction.
　さらに、第一介在部材３５１は、第一接着面３１２ａ１とは反対側の面、本例では外周面に、周方向に延びる複数のリップ３５１ａを有する。リップ３５１ａが、蓋３２０に対して非接着状態で接触する部分である。そして、リップ３５１ａが、蓋３２０との間でシール機能を発揮し、蓋３２０の保持力を発揮する。つまり、リップ３５１ａは、蓋３２０に対して非接着状態であり且つシールした状態で蓋３２０を保持する部分として機能する。第一介在部材３５１を形成する高分子粘弾性材料は、第二例の第一介在部材１５１と同一である。 Further, the first intervening member 351 has a plurality of lips 351a extending in the circumferential direction on the surface opposite to the first adhesive surface 312a1, the outer peripheral surface in this example. The lip 351a is a portion that comes into contact with the lid 320 in a non-adhesive state. Then, the lip 351a exerts a sealing function with the lid 320 and exerts a holding force of the lid 320. That is, the lip 351a functions as a portion that holds the lid 320 in a non-adhesive state and a sealed state with respect to the lid 320. The polymer viscoelastic material forming the first intervening member 351 is the same as the first intervening member 151 of the second example.
　コネクタ一体ケース３５０を構成する第二介在部材３５２は、高分子粘弾性材料により形成されている。第二介在部材３５２は、ケース３１０の底面３１１のコネクタ用開口部３１１ａの周縁とコネクタ３４０との間に介在する。第二介在部材３５２は、図２８および図３１に示すように、ケース３１０のコネクタ用開口部３１１ａの周縁の第二接着面３１１ａ１とコネクタ３４０の接着部３４２との対向面のそれぞれに接着されている。従って、第二介在部材３５２は、周方向に連続した筒状に形成されている。そして、第二介在部材３５２は、ケース３１０の第二接着面３１１ａ１とコネクタ３４０の接着部３４２の外周面３４２ａとの間をシールする。第二介在部材３５２は、第一介在部材３５１と同一の高分子粘弾性材料により形成されるようにしてもよいし、異なる高分子粘弾性材料により形成されるようにしてもよい。 The second intervening member 352 constituting the connector integrated case 350 is made of a polymer viscoelastic material. The second intervening member 352 is interposed between the peripheral edge of the connector opening 311a on the bottom surface 311 of the case 310 and the connector 340. As shown in FIGS. 28 and 31, the second intervening member 352 is adhered to each of the facing surfaces of the second adhesive surface 311a1 on the periphery of the connector opening 311a of the case 310 and the adhesive portion 342 of the connector 340. There is. Therefore, the second intervening member 352 is formed in a tubular shape continuous in the circumferential direction. Then, the second intervening member 352 seals between the second adhesive surface 311a1 of the case 310 and the outer peripheral surface 342a of the adhesive portion 342 of the connector 340. The second intervening member 352 may be formed of the same polymer viscoelastic material as the first interposing member 351 or may be formed of a different polymer viscoelastic material.
　蓋３２０は、図２８に示すように、ケース３１０の蓋用開口部３１２ａを閉塞する。蓋３２０は、第二例の蓋１２０と同様に、金属または樹脂により形成されている。蓋３２０は、ケース３１０に対応する有底容器状に形成されている。 As shown in FIG. 28, the lid 320 closes the lid opening 312a of the case 310. The lid 320 is made of metal or resin like the lid 120 of the second example. The lid 320 is formed in the shape of a bottomed container corresponding to the case 310.
　詳細には、蓋３２０は、底面３２１と、周壁３２２と、取付座３２３とを備える。底面３２１は、平板状に形成されている。底面３２１の外形は、ケース３１０の蓋用開口部３１２ａの外形と同様に形成されている。つまり、底面３２１の外形は、例えば、矩形状に形成されている。 Specifically, the lid 320 includes a bottom surface 321, a peripheral wall 322, and a mounting seat 323. The bottom surface 321 is formed in a flat plate shape. The outer shape of the bottom surface 321 is formed in the same manner as the outer shape of the lid opening 312a of the case 310. That is, the outer shape of the bottom surface 321 is formed in a rectangular shape, for example.
　周壁３２２は、底面３２１の周縁を全周に亘って囲むように形成されている。周壁３２２の内周面は、第一介在部材３５１のリップ３５１ａに非接着状態で接触する部位である。つまり、第一介在部材３５１が、ケース３１０の周壁３１２の第一接着面３１２ａ１と蓋３２０の周壁３２２の内周面との間に挟まれた状態でシールする。 The peripheral wall 322 is formed so as to surround the peripheral edge of the bottom surface 321 over the entire circumference. The inner peripheral surface of the peripheral wall 322 is a portion that comes into contact with the lip 351a of the first intervening member 351 in a non-adhesive state. That is, the first intervening member 351 is sealed while being sandwiched between the first adhesive surface 312a1 of the peripheral wall 312 of the case 310 and the inner peripheral surface of the peripheral wall 322 of the lid 320.
　取付座３２３は、蓋３２０の周壁３２２の矩形の４隅に設けられている。取付座３２３は、ケース３１０の取付座３１３に対応する位置に位置しており、締結部材により締結するための孔が形成されている。 The mounting seat 323 is provided at four rectangular corners of the peripheral wall 322 of the lid 320. The mounting seat 323 is located at a position corresponding to the mounting seat 313 of the case 310, and a hole for fastening is formed by the fastening member.
　（５－３．箱型電子ユニット４の製造方法）
　箱型電子ユニット４の製造方法について、図３２および図３３を参照して説明する。図３２および図３３に示すように、ケース３１０およびコネクタ３４０を、成形型３６０内に配置する（ステップＳ３１）。成形型３６０は、第一介在部材３５１、第二介在部材３５２を成形するための型である。成形型３６０は、高分子粘弾性材料の流動性素材を供給するための１つ以上の供給口３６１を有している。 (5-3. Manufacturing method of box-type electronic unit 4)
A method of manufacturing the box-type electronic unit 4 will be described with reference to FIGS. 32 and 33. As shown in FIGS. 32 and 33, the case 310 and the connector 340 are placed in the mold 360 (step S31). The molding die 360 is a mold for molding the first intervening member 351 and the second intervening member 352. The mold 360 has one or more supply ports 361 for supplying a fluid material of a polymer viscoelastic material.
　続いて、高分子粘弾性材料の流動性素材を、成形型３６０の供給口３６１から供給する。そして、流動性素材が、第一介在部材３５１の領域および第二介在部材３５２の領域に供給させる。そうすると、流動性素材が、第一介在部材３５１の領域および第二介在部材３５２の領域に充填される（ステップＳ３２）。 Subsequently, the fluid material of the polymer viscoelastic material is supplied from the supply port 361 of the molding die 360. Then, the fluid material is supplied to the region of the first intervening member 351 and the region of the second intervening member 352. Then, the fluid material is filled in the region of the first intervening member 351 and the region of the second intervening member 352 (step S32).
　続いて、成形型３６０内において、流動性素材を加熱して、さらに流動性素材を固化させることにより、第一介在部材３５１および第二介在部材３５２が形成される（ステップＳ３３）。このとき、流動性素材の加熱によって、第一介在部材３５１は、ケース３１０の第一接着面３１２ａ１に接着される。また、第二介在部材３５２は、ケース３１０の第二接着面３１１ａ１に接着されると共に、コネクタ３４０の接着部３４２の外周面３４２ａに接着される。このようにして、コネクタ一体ケース３５０が完成する。 Subsequently, in the molding die 360, the fluid material is heated to further solidify the fluid material, whereby the first intervening member 351 and the second intervening member 352 are formed (step S33). At this time, the first interposition member 351 is adhered to the first adhesive surface 312a1 of the case 310 by heating the fluid material. Further, the second intervening member 352 is adhered to the second adhesive surface 311a1 of the case 310 and also to the outer peripheral surface 342a of the adhesive portion 342 of the connector 340. In this way, the connector integrated case 350 is completed.
　続いて、コネクタ一体ケース３５０に、電子回路基板１３０を取り付ける（ステップＳ３４）。続いて、コネクタ一体ケース３５０に、蓋３２０を装着する（ステップＳ３５）。詳細には、蓋３２０の周壁３２２を、ケース３１０の周壁３１２の第一接着面３１２ａ１の外側に嵌め込む。このとき、第一介在部材３５１が、ケース３１０の第一接着面３１２ａ１と蓋３２０の周壁３２２との間に圧縮された状態となり、シールすると共に、蓋３２０を保持する。 Subsequently, the electronic circuit board 130 is attached to the connector integrated case 350 (step S34). Subsequently, the lid 320 is attached to the connector integrated case 350 (step S35). Specifically, the peripheral wall 322 of the lid 320 is fitted to the outside of the first adhesive surface 312a1 of the peripheral wall 312 of the case 310. At this time, the first intervening member 351 is in a compressed state between the first adhesive surface 312a1 of the case 310 and the peripheral wall 322 of the lid 320, and seals and holds the lid 320.
　（５－４．効果）
　第四例の箱型電子ユニット４においても、第二例、第三例と同様に、第一介在部材３５１および第二介在部材３５２が、容易に形成できる。その結果、箱型電子ユニット４の低コスト化を図ることができる。 (5-4. Effect)
In the box-shaped electronic unit 4 of the fourth example, the first intervening member 351 and the second intervening member 352 can be easily formed as in the second and third examples. As a result, the cost of the box-type electronic unit 4 can be reduced.
　（６．第五例の箱型電子ユニット５）
　第五例の箱型電子ユニット５は、第四例の箱型電子ユニット４に対して、コネクタ一体ケース４５０のみ相違する。コネクタ一体ケース４５０について、図３４および図３５を参照して説明する。コネクタ一体ケース４５０は、ケース４１０、コネクタ３４０、第一介在部材４５１、第二介在部材４５２、第一補助介在部材４５３を備える。コネクタ３４０は、第四例の箱型電子ユニット４におけるコネクタ３４０と同一構成からなる。 (6. Box-type electronic unit 5 of the fifth example)
The box-type electronic unit 5 of the fifth example differs from the box-type electronic unit 4 of the fourth example only in the connector integrated case 450. The connector integrated case 450 will be described with reference to FIGS. 34 and 35. The connector integrated case 450 includes a case 410, a connector 340, a first intervening member 451 and a second intervening member 452, and a first auxiliary intervening member 453. The connector 340 has the same configuration as the connector 340 in the box-type electronic unit 4 of the fourth example.
　ケース４１０は、図３５に示すように、底面４１１と、周壁４１２とを備える。底面４１１は、コネクタ用開口部４１１ａを有する。コネクタ用開口部４１１ａの周縁を形成する内周面は、第二接着面４１１ａ１を有する。第二接着面４１１ａ１の中心軸線（第二中心軸線）は、底面４１１の法線方向に平行な軸線である。 As shown in FIG. 35, the case 410 includes a bottom surface 411 and a peripheral wall 412. The bottom surface 411 has a connector opening 411a. The inner peripheral surface forming the peripheral edge of the connector opening 411a has a second adhesive surface 411a1. The central axis (second central axis) of the second adhesive surface 411a1 is an axis parallel to the normal direction of the bottom surface 411.
　周壁４１２は、底面４１１の周縁付近を全周に亘って囲むように形成されている。つまり、周壁４１２は、周方向に連続した筒状に形成されている。ただし、周壁４１２は、コネクタ用開口部４１１ａが形成されている部位において、コネクタ用開口部４１１ａが周壁４１２の外側に位置するように形成されている。つまり、周壁４１２は、コネクタ用開口部４１１ａが形成されている部位において、底面４１１の法線方向から見た場合に、Ｕ字状に形成されている。 The peripheral wall 412 is formed so as to surround the vicinity of the peripheral edge of the bottom surface 411 over the entire circumference. That is, the peripheral wall 412 is formed in a tubular shape continuous in the circumferential direction. However, the peripheral wall 412 is formed so that the connector opening 411a is located outside the peripheral wall 412 at the portion where the connector opening 411a is formed. That is, the peripheral wall 412 is formed in a U shape when viewed from the normal direction of the bottom surface 411 at the portion where the connector opening 411a is formed.
　そして、周壁４１２は、底面４１１とは反対側の端に、蓋用開口部４１２ａを有する。周壁４１２は、蓋用開口部４１２ａの周縁を形成する周面に、第一接着面４１２ａ１を有する。 The peripheral wall 412 has a lid opening 412a at the end opposite to the bottom surface 411. The peripheral wall 412 has a first adhesive surface 412a1 on the peripheral surface forming the peripheral edge of the lid opening 412a.
　ケース４１０は、さらに、蓋３２０と締結するための締結部材（図示せず）を取り付けるための取付座４１３を有する。ケース４１０は、例えば、矩形の４隅に取付座４１３を有する。取付座４１３は、締結部材を挿通するための孔が形成されている。 The case 410 further has a mounting seat 413 for mounting a fastening member (not shown) for fastening to the lid 320. The case 410 has mounting seats 413 at four corners of the rectangle, for example. The mounting seat 413 is formed with a hole for inserting the fastening member.
　第一介在部材４５１は、ケース４１０の周壁４１２の第一接着面４１２ａ１のうち、コネクタ用開口部４１１ａが形成されている部位を除く部位に接着されている。つまり、第一介在部材４５１は、底面４１１の法線方向から見た場合に、Ｃ字状に形成されている。第一介在部材４５１は、第一接着面４１２ａ１とは反対側の面に、周方向に延びる複数のリップ４５１ａを有する。 The first intervening member 451 is adhered to a portion of the first adhesive surface 412a1 of the peripheral wall 412 of the case 410 except the portion where the connector opening 411a is formed. That is, the first intervening member 451 is formed in a C shape when viewed from the normal direction of the bottom surface 411. The first intervening member 451 has a plurality of lips 451a extending in the circumferential direction on a surface opposite to the first adhesive surface 412a1.
　第二介在部材４５２は、ケース４１０の底面４１１のコネクタ用開口部４１１ａの内周面である第二接着面４１１ａ１と、周壁４１２の第一接着面４１２ａ１のうち第一介在部材４５１が存在しないＵ字状の部位とに接着されている。さらに、第二介在部材４５２は、コネクタ３４０の接着部３４２の外周面３４２ａ（図２９に示す）のうち、第一接着面４１２ａ１および第二接着面４１１ａ１に対向する部位に接着されている。第二介在部材４５２は、第一介在部材４５１と連続的に形成されている。 The second intervening member 452 is a U having no first intervening member 451 of the second adhesive surface 411a1 which is the inner peripheral surface of the connector opening 411a of the bottom surface 411 of the case 410 and the first adhesive surface 412a1 of the peripheral wall 412. It is adhered to the character-shaped part. Further, the second intervening member 452 is adhered to the outer peripheral surface 342a (shown in FIG. 29) of the adhesive portion 342 of the connector 340, which faces the first adhesive surface 412a1 and the second adhesive surface 411a1. The second intervening member 452 is formed continuously with the first intervening member 451.
　第一補助介在部材４５３は、コネクタ３４０の接着部３４２の外周面３４２ａのうち、第二介在部材４５２が接着されていない部位に接着されている。第一補助介在部材４５３は、コネクタ３４０の接着部３４２の外周面３４２ａとは反対側の面に、周方向に延びる複数のリップ４５３ａを有する。第一補助介在部材４５３は、第一介在部材４５１と連続的に形成されている。さらに、第一補助介在部材４５３のリップ４５３ａも、第一介在部材４５１のリップ４５１ａと連続的に形成されている。さらに、第一補助介在部材４５３は、第二介在部材４５２とも連続的に形成されているようにしてもよい。 The first auxiliary intervening member 453 is adhered to a portion of the outer peripheral surface 342a of the adhesive portion 342 of the connector 340 to which the second intervening member 452 is not adhered. The first auxiliary intervening member 453 has a plurality of lips 453a extending in the circumferential direction on a surface opposite to the outer peripheral surface 342a of the adhesive portion 342 of the connector 340. The first auxiliary intervening member 453 is formed continuously with the first intervening member 451. Further, the lip 453a of the first auxiliary intervening member 453 is also formed continuously with the lip 451a of the first intervening member 451. Further, the first auxiliary intervening member 453 may be formed continuously with the second intervening member 452.
　そして、コネクタ一体ケース４５０の製造において、高分子粘弾性材料の流動性素材を供給し、第一介在部材４５１の領域と第二介在部材４５２の領域と第一補助介在部材４５３の領域の間で流動させることにより、第一介在部材４５１の領域、第二介在部材４５２の領域および第一補助介在部材４５３の領域に流動性素材を充填することができる。他の製造工程は、第四例の箱型電子ユニット４の製造工程と同様である。 Then, in the manufacture of the connector integrated case 450, the fluid material of the polymer viscoelastic material is supplied, and between the region of the first intervening member 451 and the region of the second intervening member 452 and the region of the first auxiliary intervening member 453. By flowing, the fluid material can be filled in the region of the first intervening member 451 and the region of the second intervening member 452 and the region of the first auxiliary intervening member 453. The other manufacturing process is the same as the manufacturing process of the box-type electronic unit 4 of the fourth example.
　（７．その他）
　第一例の箱型電子ユニット１において、第二例－第五例の箱型電子ユニット２，３，４，５において説明したコネクタ１４０、第一介在部材１５１，３５１，４５１、第二介在部材１５２，２８２，３５２，４５２等に関する技術を適用することができる。この場合、粘弾性シールド層９０と、介在部材１５１，１５２，１５３，２８２，２８４，３５１，３５２，４５１，４５２，４５３の何れかとは、同時に成形してもよいし、別々に成形してもよい。同時成形の場合には、同一材料としてもよいし、異なる材料としてもよい。異なる材料で同時成形を行う場合には、２色成形により実現できる。 (7. Others)
In the box-type electronic unit 1 of the first example, the connector 140, the first intervening member 151,351,451, and the second intervening member described in the box-type electronic units 2, 3, 4, and 5 of the second example to the fifth example. Techniques relating to 152, 282, 352, 452, etc. can be applied. In this case, the viscoelastic shield layer 90 and any of the intervening members 151,152,153,282,284,351,352,451,452,453 may be molded at the same time or separately. Good. In the case of simultaneous molding, the same material may be used or different materials may be used. When simultaneous molding with different materials, it can be realized by two-color molding.
１，２，３，４，５：箱型電子ユニット、　１０：樹脂ケース、　１１：ケース本体、　１１ａ：底面、　１１ａ１：放熱用開口、　１１ａ２：凹所、　１１ｂ：周壁、　１１ｂ１：外側座面、　１１ｂ２：内側座面、　１１ｃ：コネクタ保持部、　１２：仕切板、　２０：蓋、　３０：電子回路基板、　３１：基板本体、　３２：電子回路部品、　４０：コネクタ、　５０：電磁波シールド部材、　５１：突起、　６０：電磁波シールド部材、　６１：樹脂吸収層、　６２：金属層、　６２ａ：積層部、　６２ｂ：鍔部、　７０：粘弾性接合部材、　８０：粘弾性シール部材、　９０：粘弾性シールド層、　Ａ０：内部空間、　Ａ１：第一空間、　Ａ２：第二空間、　Ａ３：第三空間、　Ａ４：第四空間、　Ｂ１：第一区画、　Ｂ２：第二区画、　Ｂ３：第三区画、　Ｂ４：第四区画、１１０：ケース、１１１：底面、１１２：周壁、１１２ａ：蓋用開口部、１１２ａ１：第一接着面、１１２ｂ：コネクタ用開口部、１１２ｂ１：第二接着面、１１３：取付座、１２０：蓋、１２１：底面、１２２：周壁、１２３：取付座、１３０：電子回路基板、１４０：コネクタ、１４１：相手装着部、１４２：接着部、１４２ａ：外周面、１４２ｂ：座面、１４３：端子、１５０：コネクタ一体ケース、１５１：第一介在部材、１５１ａ：リップ、１５２：第二介在部材、１５３：第一補助介在部材、１５３ａ：リップ、１６０：成形型、１６１：供給口、２１０：ケース、２１１：周壁、２１３：第二蓋用開口部、２１３ａ：第三接着面、２１４：コネクタ用開口部、２１４ａ：第二接着面、２６０：第二蓋、２６１：底面、２６２：周壁、２７０：第二電子回路基板、２８０：コネクタ一体ケース、２８２：第二介在部材、２８４：第三介在部材、２８４ａ：リップ、２９０：成形型、２９１：供給口、３１０：ケース、３１１：底面、３１１ａ：コネクタ用開口部、３１１ａ１：第二接着面、３１２：周壁、３１２ａ：蓋用開口部、３１２ａ１：第一接着面、３１３：取付座、３２０：蓋、３２１：底面、３２２：周壁、３４０：コネクタ、３４１：相手装着部、３４２：接着部、３４２ａ：外周面、３４３：端子、３５０：コネクタ一体ケース、３５１：第一介在部材、３５１ａ：リップ、３５２：第二介在部材、３６０：成形型、３６１：供給口、４１０：ケース、４１１：底面、４１１ａ：コネクタ用開口部、４１１ａ１：第二接着面、４１２：周壁、４１２ａ：蓋用開口部、４１２ａ１：第一接着面、４５０：コネクタ一体ケース、４５１：第一介在部材、４５１ａ：リップ、４５２：第二介在部材、４５３：第一補助介在部材、４５３ａ：リップ 1,2,3,4,5: Box type electronic unit, 10: Resin case, 11: Case body, 11a: Bottom surface, 11a1: Heat dissipation opening, 11a2: Recess, 11b: Peripheral wall, 11b1: Outer seat surface, 11b2: Inner seat surface, 11c: Connector holding part, 12: Partition plate, 20: Lid, 30: Electronic circuit board, 31: Board body, 32: Electronic circuit parts, 40: Connector, 50: Electromagnetic shield member, 51: Projection, 60: Electromagnetic wave shielding member, 61: Resin absorbing layer, 62: Metal layer, 62a: Laminated part, 62b: Flange part, 70: Viscoelastic bonding member, 80: Viscoelastic sealing member, 90: Viscoelastic shield layer A0: Internal space, A1: First space, A2: Second space, A3: Third space, A4: Fourth space, B1: First section, B2: Second section, B3: Third section, B4: First Four compartments, 110: Case, 111: Bottom surface, 112: Circumferential wall, 112a: Opening for lid, 112a1: First adhesive surface, 112b: Opening for connector, 112b1: Second adhesive surface, 113: Mounting seat, 120: Lid, 121: bottom surface, 122: peripheral wall, 123: mounting seat, 130: electronic circuit board, 140: connector, 141: mating mounting part, 142: adhesive part, 142a: outer peripheral surface, 142b: seat surface, 143: terminal, 150: Connector integrated case, 151: First intervening member, 151a: Lip, 152: Second intervening member, 153: First auxiliary intervening member, 153a: Lip, 160: Molding mold, 161: Supply port, 210: Case, 211: Peripheral wall, 213: Second lid opening, 213a: Third adhesive surface, 214: Connector opening, 214a: Second adhesive surface, 260: Second lid, 261: Bottom surface, 262: Peripheral wall, 270: Second electronic circuit board, 280: Connector integrated case, 282: Second intervening member, 284: Third intervening member, 284a: Lip, 290: Mold, 291: Supply port, 310: Case, 311: Bottom surface, 311a: Connector opening, 311a1: Second adhesive surface, 312: Peripheral wall, 312a: Lid opening, 312a1: First adhesive surface, 313: Mounting seat, 320: Lid, 321: Bottom surface, 322: Peripheral wall, 340: Connector , 341: Mating part, 342: Adhesive part, 342a: Outer peripheral surface, 343: Terminal, 350: Connector integrated case, 351: First intervening member, 351a: Lip, 352: Second intervening member, 360: Molding mold, 361: Supply port, 410: Case, 411: Bottom surface, 411a: Connector opening, 411a 1: Second adhesive surface, 412: Peripheral wall, 412a: Lid opening, 412a 1: First adhesive surface, 450: Connector integrated case, 451: First intervening member, 451a: Lip, 452: Second intervening member, 453 : First auxiliary intervening member, 453a: Lip

Claims (28)

  1. 　電子回路基板と、
    　前記電子回路基板を収容し、樹脂により形成されたケースと、
    　前記ケースとは熱膨張率の異なる材料により前記ケースとは別体に形成され、前記ケースに取り付けられ、少なくとも一部を露出している電磁波シールド部材と、
    　電磁波シールド性を有する高分子粘弾性材料により成形され、前記ケースおよび前記電磁波シールド部材に接触した状態で前記ケースと前記電磁波シールド部材とに跨って配置される粘弾性シールド層と、
    　を備える、箱型電子ユニット。     Electronic circuit board and
    A case that houses the electronic circuit board and is made of resin,
    An electromagnetic wave shield member formed separately from the case by a material having a coefficient of thermal expansion different from that of the case, attached to the case, and at least partially exposed.
    A viscoelastic shield layer formed of a polymer viscoelastic material having an electromagnetic wave shielding property and arranged so as to straddle the case and the electromagnetic wave shielding member in contact with the case and the electromagnetic wave shielding member.
    A box-type electronic unit equipped with.
  2. 　前記電磁波シールド部材は、前記ケースのシールド対象領域の一部に配置され、
    　前記粘弾性シールド層は、前記ケースの前記シールド対象領域の内壁面または外壁面のうち前記電磁波シールド部材が配置された領域を除く領域における面を被覆し、さらに前記電磁波シールド部材まで連続して配置される、請求項１に記載の箱型電子ユニット。     The electromagnetic wave shield member is arranged in a part of the shield target area of the case, and is arranged.
    The viscoelastic shield layer covers the inner wall surface or the outer wall surface of the shield target region of the case excluding the region where the electromagnetic wave shield member is arranged, and is further arranged continuously to the electromagnetic wave shield member. The box-type electronic unit according to claim 1.
  3. 　前記ケースは、貫通した放熱用開口を有し、
    　前記電磁波シールド部材は、ヒートシンクであり、且つ、前記放熱用開口に嵌め込まれて、
    　前記粘弾性シールド層は、前記ケースの前記放熱用開口の周縁と前記ヒートシンクとに跨って配置される、請求項１または２に記載の箱型電子ユニット。     The case has a through opening for heat dissipation.
    The electromagnetic wave shield member is a heat sink and is fitted into the heat dissipation opening.
    The box-shaped electronic unit according to claim 1 or 2, wherein the viscoelastic shield layer is arranged so as to straddle the peripheral edge of the heat dissipation opening of the case and the heat sink.
  4. 　前記ケースの面と前記ヒートシンクの面とにより階段状に形成され、
    　前記粘弾性シールド層は、前記階段状の部位にて前記ケースと前記ヒートシンクとに跨って配置され、
    　前記粘弾性シールド層の層厚は、前記階段状の段差部位における層厚を前記階段状の前記段差部位の周囲における層厚よりも厚くなるように形成される、請求項３に記載の箱型電子ユニット。     The surface of the case and the surface of the heat sink form a stepped shape.
    The viscoelastic shield layer is arranged so as to straddle the case and the heat sink at the stepped portion.
    The box type according to claim 3, wherein the layer thickness of the viscoelastic shield layer is formed so that the layer thickness at the stepped portion is thicker than the layer thickness around the stepped portion. Electronic unit.
  5. 　前記ケースは、電磁波吸収空間を有し、
    　前記電磁波シールド部材は、前記ケースの前記電磁波吸収空間の内壁面の一部に配置された電磁波吸収部材であり、
    　前記粘弾性シールド層は、前記電磁波吸収空間の内壁面のうち前記電磁波シールド部材が配置された領域を除く領域における面を被覆し、さらに前記電磁波吸収部材まで連続して配置される、請求項１または２に記載の箱型電子ユニット。     The case has an electromagnetic wave absorption space and
    The electromagnetic wave shielding member is an electromagnetic wave absorbing member arranged on a part of the inner wall surface of the electromagnetic wave absorbing space of the case.
    The viscoelastic shield layer covers the inner wall surface of the electromagnetic wave absorbing space in a region other than the region where the electromagnetic wave shielding member is arranged, and is further arranged continuously up to the electromagnetic wave absorbing member. Or the box-type electronic unit according to 2.
  6. 　前記電磁波吸収部材は、樹脂吸収層、および、前記樹脂吸収層に積層された金属層を備え、
    　前記粘弾性シールド層は、前記ケースと前記電磁波吸収部材の前記金属層とに跨って配置される、請求項５に記載の箱型電子ユニット。     The electromagnetic wave absorbing member includes a resin absorbing layer and a metal layer laminated on the resin absorbing layer.
    The box-shaped electronic unit according to claim 5, wherein the viscoelastic shield layer is arranged so as to straddle the case and the metal layer of the electromagnetic wave absorbing member.
  7. 　前記金属層は、前記樹脂吸収層に積層して接着された積層部と、前記積層部の外周から外方に張り出した鍔部とを備え、
    　前記粘弾性シールド層は、前記ケースと前記電磁波吸収部材の前記金属層の前記鍔部とに跨って配置される、請求項６に記載の箱型電子ユニット。     The metal layer includes a laminated portion that is laminated and adhered to the resin absorbing layer, and a flange portion that projects outward from the outer periphery of the laminated portion.
    The box-shaped electronic unit according to claim 6, wherein the viscoelastic shield layer is arranged so as to straddle the case and the collar portion of the metal layer of the electromagnetic wave absorbing member.
  8. 　前記電子回路基板は、第一区画と第二区画とを有し、
    　前記ケースは、
    　容器形状のケース本体と、
    　前記ケース本体の内部空間を第一空間と第二空間とに仕切ると共に、先端面にて前記電子回路基板の前記第一区画と前記第二区画との境界面を支持する仕切板と、
    　を備え、
    　前記粘弾性シールド層は、前記第一空間を形成する内壁面、前記仕切板の前記先端面、および、前記第二空間を形成する内壁面に連続して配置され、
    　前記粘弾性シールド層のうち前記仕切板の前記先端面に配置された部位は、前記電子回路基板に接触した状態で配置される、請求項１－７の何れか１項に記載の箱型電子ユニット。     The electronic circuit board has a first section and a second section.
    The case is
    Container-shaped case body and
    A partition plate that divides the internal space of the case body into a first space and a second space, and supports a boundary surface between the first section and the second section of the electronic circuit board at the tip surface.
    With
    The viscoelastic shield layer is continuously arranged on the inner wall surface forming the first space, the tip surface of the partition plate, and the inner wall surface forming the second space.
    The box-shaped electron according to any one of claims 1-7, wherein a portion of the viscoelastic shield layer arranged on the tip surface of the partition plate is arranged in contact with the electronic circuit board. unit.
  9. 　前記ケースは、前記電子回路基板を収容し、蓋用開口部およびコネクタ用開口部を有し、
    　前記箱型電子ユニットは、さらに、
    　前記ケースの前記蓋用開口部を閉塞する蓋と、
    　前記ケースと別体に形成され、前記ケースの前記コネクタ用開口部に固定され、前記電子回路基板と外部とを電気的に接続するコネクタと、
    　高分子粘弾性材料により形成され、前記ケースの前記蓋用開口部の周縁に接着され、前記蓋に対して非接着状態であり且つシールした状態で前記蓋を保持する第一介在部材と、
    　高分子粘弾性材料により形成され、前記ケースの前記コネクタ用開口部の周縁と前記コネクタとの対向面のそれぞれに接着され、且つ、前記コネクタ用開口部の周縁と前記コネクタとの間をシールする第二介在部材と、
    　を備える、請求項１－８の何れか１項に記載の箱型電子ユニット。     The case houses the electronic circuit board and has a lid opening and a connector opening.
    The box-shaped electronic unit further includes
    A lid that closes the lid opening of the case,
    A connector formed separately from the case, fixed to the connector opening of the case, and electrically connecting the electronic circuit board and the outside.
    A first interposition member formed of a polymer viscoelastic material, adhered to the peripheral edge of the lid opening of the case, and holding the lid in a non-adhesive and sealed state with respect to the lid.
    It is formed of a polymer viscoelastic material, is adhered to each of the peripheral edge of the connector opening of the case and the facing surface of the connector, and seals between the peripheral edge of the connector opening and the connector. With the second intervening member,
    The box-type electronic unit according to any one of claims 1 to 8.
  10. 　電子回路基板と、
    　前記電子回路基板を収容し、蓋用開口部およびコネクタ用開口部を有するケースと、
    　前記ケースの前記蓋用開口部を閉塞する蓋と、
    　前記ケースと別体に形成され、前記ケースの前記コネクタ用開口部に固定され、前記電子回路基板と外部とを電気的に接続するコネクタと、
    　高分子粘弾性材料により成形され、前記ケースの前記蓋用開口部の周縁に接着され、前記蓋に対して非接着状態であり且つシールした状態で前記蓋を保持する第一介在部材と、
    　高分子粘弾性材料により成形され、前記ケースの前記コネクタ用開口部の周縁と前記コネクタとの対向面のそれぞれに接着され、且つ、前記コネクタ用開口部の周縁と前記コネクタとの間をシールする第二介在部材と、
    　を備える、箱型電子ユニット。     Electronic circuit board and
    A case that houses the electronic circuit board and has an opening for a lid and an opening for a connector,
    A lid that closes the lid opening of the case,
    A connector formed separately from the case, fixed to the connector opening of the case, and electrically connecting the electronic circuit board and the outside.
    A first interposition member formed of a polymer viscoelastic material, adhered to the peripheral edge of the lid opening of the case, and holding the lid in a non-adhesive and sealed state with respect to the lid.
    It is molded from a polymer viscoelastic material, adhered to each of the peripheral edge of the connector opening of the case and the facing surface of the connector, and seals between the peripheral edge of the connector opening and the connector. With the second intervening member,
    A box-type electronic unit equipped with.
  11. 　前記ケースは、
    　底面と、
    　前記底面の周縁を囲み、前記底面の法線方向に開口する前記蓋用開口部を有し、前記底面の面方向に開口する前記コネクタ用開口部を有する周壁と、
    　を備え、
    　前記第一介在部材は、前記周壁において前記蓋用開口部の周縁を形成する内周面または外周面に接着され、
    　前記第二介在部材は、前記周壁において前記コネクタ用開口部の周縁を形成する内周面に接着され、且つ、前記コネクタの外周面に接着される、請求項９または１０に記載の箱型電子ユニット。     The case is
    On the bottom and
    A peripheral wall that surrounds the peripheral edge of the bottom surface, has the lid opening that opens in the normal direction of the bottom surface, and has the connector opening that opens in the surface direction of the bottom surface.
    With
    The first intervening member is adhered to an inner peripheral surface or an outer peripheral surface forming the peripheral edge of the lid opening on the peripheral wall.
    The box-shaped electron according to claim 9 or 10, wherein the second intervening member is adhered to an inner peripheral surface forming the peripheral edge of the connector opening on the peripheral wall and is adhered to the outer peripheral surface of the connector. unit.
  12. 　前記コネクタ用開口部は、前記蓋用開口部に連続的につながって形成されており、
    　前記箱型電子ユニットは、さらに、
    　高分子粘弾性材料により形成され、前記蓋用開口部と前記コネクタ用開口部との接続部位に形成され、前記コネクタ用開口部に配置された状態の前記コネクタの外面の一部に接着され、前記第一介在部材に連続的に形成され、前記蓋に対して非接着状態であり且つシールした状態で前記蓋の保持力を有する第一補助介在部材を備え、
    　前記第二介在部材は、前記第一介在部材および前記第一補助介在部材の少なくとも一方に連続的に形成される、請求項１１に記載の箱型電子ユニット。     The connector opening is formed by being continuously connected to the lid opening.
    The box-shaped electronic unit further includes
    It is formed of a polymer viscoelastic material, is formed at a connection portion between the lid opening and the connector opening, and is adhered to a part of the outer surface of the connector in a state of being arranged in the connector opening. A first auxiliary intervening member which is continuously formed on the first intervening member and has a holding force of the lid in a non-adhesive state and a sealed state with respect to the lid is provided.
    The box-shaped electronic unit according to claim 11, wherein the second intervening member is continuously formed on at least one of the first intervening member and the first auxiliary intervening member.
  13. 　前記第二介在部材は、前記コネクタの外周面のうち前記蓋用開口部の側を除く、両側面および前記底面の側を連続するＵ字状に形成される、請求項１２に記載の箱型電子ユニット。 The box shape according to claim 12, wherein the second intervening member is formed in a U shape in which both side surfaces and the bottom surface side of the outer peripheral surface of the connector are continuous except for the side of the lid opening. Electronic unit.
  14. 　前記ケースは、さらに、
    　環状に形成され、前記環状の軸方向一端に開口する前記蓋用開口部を有し、前記環状の軸方向他端に開口する第二蓋用開口部を有し、前記環状の軸方向に交差する方向に開口する前記コネクタ用開口部を有する周壁を備え、
    　前記箱型電子ユニットは、さらに、
    　前記ケースの前記第二蓋用開口部を閉塞する第二蓋と、
    　高分子粘弾性材料により形成され、前記ケースの前記周壁において前記第二蓋用開口部の周縁を形成する内周面または外周面に接着され、前記第二蓋に対して非接着状態であり且つシールした状態で前記蓋を保持する第三介在部材と、
    　を備える、請求項９または１０に記載の箱型電子ユニット。     The case further
    It is formed in an annular shape and has the lid opening that opens at one end in the axial direction of the ring, and has a second lid opening that opens at the other end of the axial direction of the ring, and intersects in the axial direction of the ring. A peripheral wall having an opening for the connector that opens in the direction of
    The box-shaped electronic unit further includes
    A second lid that closes the opening for the second lid of the case,
    It is formed of a polymer viscoelastic material, is adhered to the inner peripheral surface or the outer peripheral surface forming the peripheral edge of the opening for the second lid on the peripheral wall of the case, and is in a non-adhesive state with respect to the second lid. A third intervening member that holds the lid in a sealed state,
    The box-shaped electronic unit according to claim 9 or 10.
  15. 　前記コネクタ用開口部は、前記蓋用開口部に連続的につながって形成されており、
    　前記箱型電子ユニットは、さらに、
    　高分子粘弾性材料により形成され、前記蓋用開口部と前記コネクタ用開口部との接続部位に形成され、前記コネクタ用開口部に配置された状態の前記コネクタの外面の一部に接着され、前記第一介在部材に連続的に形成され、前記蓋に対して非接着状態であり且つシールした状態で前記蓋の保持力を有する第一補助介在部材を備え、
    　前記第二介在部材は、前記第一介在部材および前記第一補助介在部材の少なくとも一方に連続的に形成されると共に、前記第三介在部材に連続的に形成される、請求項１４に記載の箱型電子ユニット。     The connector opening is formed by being continuously connected to the lid opening.
    The box-shaped electronic unit further includes
    It is formed of a polymer viscoelastic material, is formed at a connection portion between the lid opening and the connector opening, and is adhered to a part of the outer surface of the connector in a state of being arranged in the connector opening. A first auxiliary intervening member which is continuously formed on the first intervening member and has a holding force of the lid in a non-adhesive state and a sealed state with respect to the lid is provided.
    The 14th aspect of the present invention, wherein the second intervening member is continuously formed on at least one of the first intervening member and the first auxiliary intervening member, and is continuously formed on the third intervening member. Box type electronic unit.
  16. 　前記第二介在部材は、前記コネクタの外周面のうち前記蓋用開口部の側および前記第二蓋用開口部の側を除く、少なくとも両側面の２箇所に形成される、請求項１５に記載の箱型電子ユニット。 15. The second aspect of claim 15, wherein the second intervening member is formed at least on both sides of the outer peripheral surface of the connector, excluding the side of the opening for the lid and the side of the opening for the second lid. Box type electronic unit.
  17. 　前記第一介在部材による前記ケースとの接着面は、第一中心軸線を有する筒状を構成し、
    　前記第二介在部材による前記ケースとの接着面は、前記第一中心軸線に平行な第二中心軸線を有する筒状を構成する、請求項９または１０に記載の箱型電子ユニット。     The adhesive surface of the first intervening member to the case forms a tubular shape having a first central axis.
    The box-shaped electronic unit according to claim 9 or 10, wherein the adhesive surface of the second intervening member to the case forms a tubular shape having a second central axis parallel to the first central axis.
  18. 　前記コネクタ用開口部は、前記蓋用開口部とは独立して形成されている、請求項１７に記載の箱型電子ユニット。 The box-shaped electronic unit according to claim 17, wherein the connector opening is formed independently of the lid opening.
  19. 　前記箱型電子ユニットは、さらに、
    　高分子粘弾性材料により形成され、前記コネクタ用開口部に配置された状態の前記コネクタの外面の一部に接着され、前記第一介在部材に連続的に形成され、前記蓋に対して非接着状態であり且つシールした状態で前記蓋の保持力を有する第一補助介在部材を備え、
    　前記第二介在部材は、前記第一介在部材および前記第一補助介在部材の少なくとも一方に連続的に形成される、請求項１７に記載の箱型電子ユニット。     The box-shaped electronic unit further includes
    It is formed of a polymer viscoelastic material, is adhered to a part of the outer surface of the connector in a state of being arranged in the opening for the connector, is continuously formed on the first intervening member, and is not adhered to the lid. A first auxiliary intervening member having a holding force of the lid in a state and a sealed state is provided.
    The box-shaped electronic unit according to claim 17, wherein the second intervening member is continuously formed on at least one of the first intervening member and the first auxiliary intervening member.
  20. 　前記第一介在部材と前記第二介在部材とは、同一の高分子粘弾性材料により形成されている、請求項９－１９の何れか１項に記載の箱型電子ユニット。 The box-shaped electronic unit according to any one of claims 9 to 19, wherein the first intervening member and the second intervening member are formed of the same polymer viscoelastic material.
  21. 　前記第一介在部材と前記第二介在部材とは、異なる高分子粘弾性材料により形成されている、請求項９－１９の何れか１項に記載の箱型電子ユニット。 The box-shaped electronic unit according to any one of claims 9 to 19, wherein the first intervening member and the second intervening member are formed of different polymer viscoelastic materials.
  22. 　前記高分子粘弾性材料は、シリコーンゴムである、請求項９－２１の何れか１項に記載の箱型電子ユニット。 The box-type electronic unit according to any one of claims 9-21, wherein the polymer viscoelastic material is silicone rubber.
  23. 　前記ケースは、放熱機能または電磁波シールド機能を有する金属により形成され、
    　前記コネクタの本体は、樹脂により形成されている、請求項１０に記載の箱型電子ユニット。     The case is made of a metal having a heat dissipation function or an electromagnetic wave shielding function.
    The box-shaped electronic unit according to claim 10, wherein the main body of the connector is made of resin.
  24. 　請求項９または１０に記載の箱型電子ユニットの製造方法であって、
    　前記ケースおよび前記コネクタを型内に配置する工程と、
    　高分子粘弾性材料の流動性素材を供給し、前記第一介在部材の領域および前記第二介在部材の領域に前記流動性素材を充填する工程と、
    　加熱し且つ前記流動性素材を固化させることにより前記第一介在部材および前記第二介在部材を成形する工程と、
    　前記蓋を装着する工程と、
    　を備える、箱型電子ユニットの製造方法。     The method for manufacturing a box-type electronic unit according to claim 9 or 10.
    The process of arranging the case and the connector in the mold,
    A step of supplying a fluid material of a polymer viscoelastic material and filling the region of the first intervening member and the region of the second intervening member with the fluid material.
    A step of molding the first interposition member and the second interposition member by heating and solidifying the fluid material, and
    The process of attaching the lid and
    A method for manufacturing a box-type electronic unit.
  25. 　請求項１１に記載の箱型電子ユニットの製造方法であって、
    　前記ケースおよび前記コネクタを型内に配置する工程と、
    　高分子粘弾性材料の流動性素材を供給し、前記第一介在部材の領域と前記第二介在部材の領域との間で流動させることにより前記第一介在部材の領域および前記第二介在部材の領域に前記流動性素材を充填する工程と、
    　加熱し且つ前記流動性素材を固化させることにより前記第一介在部材および前記第二介在部材を成形する工程と、
    　前記蓋を装着する工程と、
    　を備える、箱型電子ユニットの製造方法。     The method for manufacturing a box-type electronic unit according to claim 11.
    The process of arranging the case and the connector in the mold,
    By supplying a fluid material of the polymer viscoelastic material and flowing it between the region of the first intervening member and the region of the second interposing member, the region of the first interposing member and the region of the second interposing member The process of filling the area with the fluid material and
    A step of molding the first interposition member and the second interposition member by heating and solidifying the fluid material, and
    The process of attaching the lid and
    A method for manufacturing a box-type electronic unit.
  26. 　請求項１４に記載の箱型電子ユニットの製造方法であって、
    　前記ケースおよび前記コネクタを型内に配置する工程と、
    　高分子粘弾性材料の流動性素材を供給し、前記第一介在部材の領域と前記第二介在部材の領域との間で流動させると共に前記第三介在部材の領域と前記第二介在部材の領域との間で流動させることにより、前記第一介在部材の領域、前記第二介在部材の領域および前記第三介在部材の領域に前記流動性素材を充填する工程と、
    　加熱し且つ前記流動性素材を固化させることにより前記第一介在部材、前記第二介在部材および前記第三介在部材を成形する工程と、
    　前記蓋および前記第二蓋を装着する工程と、
    　を備える、箱型電子ユニットの製造方法。     The method for manufacturing a box-type electronic unit according to claim 14.
    The process of arranging the case and the connector in the mold,
    A fluid material of a polymer viscoelastic material is supplied and flowed between the region of the first intervening member and the region of the second intervening member, and the region of the third intervening member and the region of the second intervening member. The step of filling the fluid material into the region of the first intervening member, the region of the second intervening member, and the region of the third intervening member by flowing between the two.
    A step of molding the first intervening member, the second intervening member, and the third interposing member by heating and solidifying the fluid material.
    The process of attaching the lid and the second lid, and
    A method for manufacturing a box-type electronic unit.
  27. 　請求項１８に記載の箱型電子ユニットの製造方法であって、
    　前記ケースおよび前記コネクタを型内に配置する工程と、
    　高分子粘弾性材料の流動性素材を前記第一介在部材の領域に供給することにより前記第一介在部材の領域に前記流動性素材を充填し、高分子粘弾性材料の流動性素材を前記第一介在部材の領域への供給とは独立して前記第二介在部材の領域に供給することにより前記第二介在部材の領域に前記流動性素材を充填する工程と、
    　加熱し且つ前記流動性素材を固化させることにより前記第一介在部材および前記第二介在部材を成形する工程と、
    　前記蓋を装着する工程と、
    　を備える、箱型電子ユニットの製造方法。     The method for manufacturing a box-type electronic unit according to claim 18.
    The process of arranging the case and the connector in the mold,
    By supplying the fluid material of the polymer viscoelastic material to the region of the first intervening member, the fluid material is filled in the region of the first intervening member, and the fluid material of the polymer viscoelastic material is used as the first. A step of filling the region of the second intervening member with the fluid material by supplying the intervening member to the region of the second intervening member independently of the supply to the region of the intervening member.
    A step of molding the first interposition member and the second interposition member by heating and solidifying the fluid material, and
    The process of attaching the lid and
    A method for manufacturing a box-type electronic unit.
  28. 　請求項１９に記載の箱型電子ユニットの製造方法であって、
    　前記ケースおよび前記コネクタを型内に配置する工程と、
    　高分子粘弾性材料の流動性素材を供給し、前記第一介在部材の領域と前記第二介在部材の領域と前記第一補助介在部材の領域の間で流動させることにより前記第一介在部材の領域、前記第二介在部材の領域および前記第一補助介在部材の領域に前記流動性素材を充填する工程と、
    　加熱し且つ前記流動性素材を固化させることにより前記第一介在部材、前記第二介在部材および前記第一補助介在部材を成形する工程と、
    　前記蓋を装着する工程と、
    　を備える、箱型電子ユニットの製造方法。     The method for manufacturing a box-type electronic unit according to claim 19.
    The process of arranging the case and the connector in the mold,
    By supplying a fluid material of a polymer viscoelastic material and flowing it between a region of the first intervening member, a region of the second intervening member, and a region of the first auxiliary intervening member, the first intervening member The step of filling the fluid material into the region, the region of the second intervening member, and the region of the first auxiliary intervening member, and
    A step of molding the first intervening member, the second intervening member, and the first auxiliary intervening member by heating and solidifying the fluid material.
    The process of attaching the lid and
    A method for manufacturing a box-type electronic unit.
PCT/JP2020/024084 2019-06-26 2020-06-19 Box-type electronic unit and method for manufacturing same WO2020262218A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-118496 2019-06-26
JP2019118496A JP7240969B2 (en) 2019-06-26 2019-06-26 BOX-TYPE ELECTRONIC UNIT AND MANUFACTURING METHOD THEREOF
JP2020073565A JP2021170604A (en) 2020-04-16 2020-04-16 Box type electronic unit
JP2020-073565 2020-04-16

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260785A (en) * 1993-03-04 1994-09-16 Oki Electric Ind Co Ltd Substrate shielding structure
JP2001111282A (en) * 1999-10-14 2001-04-20 Shin Etsu Polymer Co Ltd Electromagnetic wave shield molded product and manufacturing method therefore
JP2007195319A (en) * 2006-01-19 2007-08-02 Yazaki Corp Electrical connection box
JP2014003206A (en) * 2012-06-20 2014-01-09 Hitachi Automotive Systems Ltd On-vehicle apparatus and waterproof seal
JP2014017479A (en) * 2012-07-05 2014-01-30 Lsis Co Ltd Electric component housing for vehicle

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260785A (en) * 1993-03-04 1994-09-16 Oki Electric Ind Co Ltd Substrate shielding structure
JP2001111282A (en) * 1999-10-14 2001-04-20 Shin Etsu Polymer Co Ltd Electromagnetic wave shield molded product and manufacturing method therefore
JP2007195319A (en) * 2006-01-19 2007-08-02 Yazaki Corp Electrical connection box
JP2014003206A (en) * 2012-06-20 2014-01-09 Hitachi Automotive Systems Ltd On-vehicle apparatus and waterproof seal
JP2014017479A (en) * 2012-07-05 2014-01-30 Lsis Co Ltd Electric component housing for vehicle

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