WO2020250427A1 - Carte de circuit et procédé de montage - Google Patents

Carte de circuit et procédé de montage Download PDF

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Publication number
WO2020250427A1
WO2020250427A1 PCT/JP2019/023686 JP2019023686W WO2020250427A1 WO 2020250427 A1 WO2020250427 A1 WO 2020250427A1 JP 2019023686 W JP2019023686 W JP 2019023686W WO 2020250427 A1 WO2020250427 A1 WO 2020250427A1
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WO
WIPO (PCT)
Prior art keywords
circuit
heat
circuit board
sheet
solder
Prior art date
Application number
PCT/JP2019/023686
Other languages
English (en)
Japanese (ja)
Inventor
杉山　和弘
佐藤　彰
光樹 福田
Original Assignee
株式会社ワンダーフューチャーコーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ワンダーフューチャーコーポレーション filed Critical 株式会社ワンダーフューチャーコーポレーション
Priority to CN201980097508.9A priority Critical patent/CN113994771A/zh
Priority to PCT/JP2019/023686 priority patent/WO2020250427A1/fr
Priority to KR1020217036078A priority patent/KR20210151872A/ko
Priority to JP2020526340A priority patent/JP6738057B1/ja
Priority to TW109119860A priority patent/TW202107645A/zh
Publication of WO2020250427A1 publication Critical patent/WO2020250427A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering

Definitions

  • the present invention relates to a sheet-shaped circuit board and a method of mounting on the circuit board.
  • solder joining is performed by arranging the solder between the objects to be joined and then heating and melting the solder.
  • a reflow furnace heating furnace
  • a non-heat resistant resin such as polyester or polyethylene may be used instead of the conventional polyimide resin.
  • Soldering with a reflow furnace may cause thermal deformation of the substrate made of non-heat resistant resin.
  • a technique using electromagnetic induction heating has been proposed as a method for mounting electronic components on a circuit board provided on a non-heat resistant sheet (for example, Patent Document 1).
  • FIG. 18 is a conceptual diagram relating to the basic principle of electromagnetic induction heating.
  • the electromagnetic induction heating device is composed of an induction coil, a power supply, and a control device.
  • induction heating When an alternating current is passed through the induction coil, magnetic field lines with varying strength are generated. When a substance that conducts electricity (specifically, it is a bonding target and is usually formed of metal) is placed near it, eddy currents flow in the metal under the influence of these changing magnetic field lines. Since metals usually have electrical resistance, when an electric current flows through the metal, Joule heat is generated and the metal self-heats. This phenomenon is called induction heating.
  • the calorific value Q due to electromagnetic induction is expressed by the following formula.
  • a predetermined Joule heat can be obtained within a uniform magnetic field, so that the bonding accuracy is high. Further, if it is in a uniform magnetic field, a plurality of bonds can be formed at one time.
  • the metal terminals on the circuit board side generate heat, the heat is transferred to the solder, and the solder melts.
  • solder bonding by electromagnetic induction heating can be applied to the miniaturization of electronic devices and electronic parts.
  • the area of the metal terminal that is the target of heat generation will also become smaller.
  • the metal terminal area becomes even smaller.
  • the resistance R becomes large, and a sufficient amount of heat generation cannot be secured (the denominator of the above theoretical formula becomes large).
  • the calorific value Q can be secured by increasing the applied voltage V or increasing the applied time t.
  • the inventor of the present application has tried and succeeded in mounting an electronic component having a metal terminal area of about 250 ⁇ m ⁇ 250 ⁇ m. In the future, we are also considering mounting electronic components with a metal terminal area of about 50 ⁇ m ⁇ 50 ⁇ m.
  • the present invention solves the above-mentioned problems, and an object of the present invention is to provide a solder joining technique capable of dealing with a small metal terminal area.
  • the circuit board corresponds to the non-heat-resistant sheet, the circuit provided on one side of the non-heat-resistant sheet, the circuit-side terminal provided in the circuit, and the circuit-side terminal on the other side of the non-heat-resistant sheet. It is provided with a conductive pad provided at a position to be used.
  • the indirect heating (quasi-direct heating) by the conductive pad compensates for the insufficient heat generation of the circuit terminals, and the solder melts. At that time, the thermal effect on the non-heat resistant sheet is limited.
  • a plurality of the electronic components can be arranged.
  • the present invention solder bonding is possible even when the metal terminal area is small.
  • a plurality of circuit-side terminals corresponding to one electronic component are set as one unit, and the conductive pad is provided for each one unit.
  • circuit-side terminals corresponding to one electronic component are used as one unit.
  • the electronic component Since the electronic component has a large number of terminals, the area of each terminal becomes narrow. According to the present invention, solder bonding is possible even when the metal terminal area is small.
  • the size of the circuit side terminal is preferably 1 mm ⁇ 1 mm or less.
  • the terminal size is 1 mm x 1 mm or less, problems such as insufficient heat generation are occasionally seen. According to the present invention, solder bonding is possible even when the metal terminal area is small.
  • the size of the conductive pad preferably includes the one unit.
  • the indirect heating by the conductive pad surely compensates for the insufficient heat generation of the circuit terminal, and the solder melts.
  • the conductive pad is preferably circular or polygonal. It is preferably pentagonal or more.
  • the conductive pad efficiently heats indirectly.
  • the heat effect on the sheet can be suppressed.
  • the present invention that solves the above problems is a mounting method in which electronic components are solder-bonded to the circuit board.
  • the terminals of the electronic component are opposed to the circuit side terminals via solder, and the conductive pad is heated by the electromagnetic induction heating on the other surface side of the non-heat resistant sheet to generate the non heat resistant sheet and the non heat resistant sheet.
  • the heat generated by the conductive pad is conducted to the solder through the circuit-side terminal to melt the solder.
  • the indirect heating by the conductive pad compensates for the insufficient heat generation of the circuit terminals, and the solder melts.
  • the electronic component is a full-color LED with a built-in control unit.
  • the sheet-shaped display is formed by arranging the LEDs.
  • the area of each terminal becomes narrow because a large number of electronic components are arranged in a predetermined area and the LED has a large number of terminals. According to the present invention, solder bonding is possible even when the metal terminal area is small.
  • an electronic component having a narrow metal terminal area can be mounted on a sheet-shaped circuit board.
  • LED mounting structure according to this embodiment (cross-sectional view) Circuit board main part (plan view) according to this embodiment The entire circuit board according to this embodiment (plan view) Application example of this embodiment Application example of this embodiment
  • Electromagnetic induction heating (conventional example) Explanation of Principle of the Present Invention (Uneven Softening) (Cross-sectional View) Explanation of Principle of the Present Invention (Uneven Softening) (Plan View) Description of Principle of the Present Invention (Temperature Profile) Description of Principle of the Present Invention (Temperature Profile) LED mounting structure according to Modification 1 (cross-sectional view) Circuit board main part (plan view) according to the first modification BGA mounting structure according to Modification 2 (cross-sectional view) Circuit board main part (plan view) according to modification 2 Outline of FPC joining according to Modification 3 (perspective view) FPC joint main part (perspective view) according to Modification 3 FPC joining main part (cross-sectional view) according to modification 3 Basic principle of electromagnetic induction
  • FIG. 1 is a schematic cross-sectional view of the LED mounting structure according to the present embodiment.
  • the LED mounting structure is formed by soldering electronic components (for example, LEDs) 20 to a circuit board 10.
  • the LED 20 is, for example, a full-color LED with a built-in control unit, and has six terminals 21. As the LED 20 becomes smaller and the number of terminals increases, the bonding area of the terminals 21 also becomes smaller.
  • the size of the LED used in this embodiment is, for example, about 2 mm ⁇ 2 mm, and the terminal size is, for example, about 500 ⁇ m ⁇ 500 ⁇ m.
  • FIG. 2 is a plan view of a main part of the circuit board 10 according to the present embodiment
  • FIG. 3 is an overall plan view of the circuit board 10 according to the present embodiment.
  • the circuit is formed by wiring on one surface of the sheet 11.
  • the sheet 11 may be a heat-resistant resin such as polyamide-imide or polyimide, but if it is a non-heat-resistant resin such as ABS resin, acrylic, polycarbo, polyester, polybutylene, or polyurethane, the effect peculiar to the present application (details will be described later) is remarkably exhibited.
  • a heat-resistant resin such as polyamide-imide or polyimide
  • non-heat-resistant resin such as ABS resin, acrylic, polycarbo, polyester, polybutylene, or polyurethane
  • Paper, cloth, or the like may be used instead of the non-heat resistant resin.
  • PET polyethylene terephthalate
  • PET has a glass transition point of about 80 ° C. and a melting point of about 260 ° C.
  • polyamide-imide has a melting point of about 300 ° C.
  • the influence of thermal deformation or the like occurs above 300 ° C., it is treated as non-heat resistant.
  • the thickness of the sheet 11 is not particularly limited, but it is preferably about 50 to 300 ⁇ m in consideration of use as a flexible substrate.
  • the circuit is composed of wiring and terminals 12.
  • the terminal 12 is located at the end of the wiring and is arranged so as to correspond to the terminal 21 on the electronic component side. In the illustrated example, six circuit-side terminals 12 are arranged.
  • the wiring and the terminal 12 are made of a conductive material. Generally, it is a metallic material containing gold, silver, copper, aluminum, nickel, chromium and the like.
  • the wiring and the terminal 12 are formed by a general conventional method (printing, etching, metal deposition, plating, silver salt, etc.).
  • a conductive polymer, conductive carbon, or the like may be used. Further, since the wiring is sufficiently thin compared to the size of the terminal 12 and does not contribute to electromagnetic induction heating, the description thereof will be omitted below as appropriate.
  • the size of the terminal 12 is not particularly limited, but if the area is about 1 mm ⁇ 1 mm or less, defects are scattered in the conventional method, so it is preferable that the area is about 1 mm ⁇ 1 mm or less. In the examples of FIGS. 2 and 3, the size of the terminal 12 is about 400 ⁇ m ⁇ 600 ⁇ m in area.
  • the circuit side terminal 12 and the electronic component side terminal 21 are joined via solder 30. As a result, the LED 20 is mounted on the circuit board 10.
  • This embodiment has a conductive pad 40 as a characteristic configuration.
  • the conductive pad 40 is provided on the other surface side of the sheet 11 at a position corresponding to the circuit side terminal 12.
  • the sheet 11 is translucent, and when viewed from the circuit side terminal 12, the conductive pad 40 can be visually recognized through the sheet 11.
  • the six electronic component side terminals 21 are set as one unit, and the six circuit side terminals 12 corresponding to the electronic component side terminals 21 are set as one unit.
  • the conductive pad 40 corresponds to one unit (six circuit-side terminals 12).
  • the conductive pad 40 has a size that includes one unit (six circuit-side terminals 12).
  • the conductive pad 40 has a circular shape. It may be changed to a circle and made into a polygon. In the examples of FIGS. 2 and 3, the size of the conductive pad 40 is about 3 mm in diameter. However, if it is too large, the sheet 11 may be damaged.
  • the conductive pad 40 is made of a metal-based material containing gold, silver, copper, aluminum, nickel, chromium, and the like. Further, the conductive pad 40 is formed by the same method as the wiring and the circuit side terminal 12.
  • the joining method between the circuit side terminal 12 and the electronic component side terminal 21 is not limited, but solder joining is particularly preferable.
  • the solder joining method is not limited, but the electromagnetic induction heating method is particularly preferable.
  • solder bonding by electromagnetic induction heating will be described.
  • the electromagnetic induction heating device consists of an induction coil lead wire, a power supply, and a control unit (see FIG. 18).
  • the solder 30 is installed on the circuit side terminal 12, and the electronic component side terminals 21 are arranged at opposite positions via the solder 30.
  • the electromagnetic induction heating device is arranged on the conductive pad 40 side (opposite side to the electronic component mounting) and is operated. If the electronic component is not affected, an electromagnetic induction heating device may be arranged on the electronic component mounting side.
  • the area of the terminal 12 is small, and a sufficient amount of heat generation cannot be secured.
  • the conductive pad 40 has a sufficient area as compared with the terminal 12, and generates heat reliably.
  • Part of the heat generated by the conductive pad 40 is diffused on the surface of the sheet 11, but most of the heat is conducted from the sheet 11 to the circuit side terminal 12 and further to the solder 30.
  • the type of solder 30 is not limited, and general solder can be used.
  • high-temperature solder for example, SnAgCu-based solder, melting point of about 220 ° C.
  • low-temperature solder for example, SnBi solder, melting point of about 140 ° C.
  • high temperature solder since the thermal deformation of the sheet 11 can be suppressed within a range not affected (details will be described later), high temperature solder can be positively used.
  • a plurality of units are arranged vertically and horizontally on the circuit board 10 in FIG.
  • a full-color LED 20 with a built-in control unit is mounted corresponding to each unit. If a uniform magnetic field can be formed within a certain range, a plurality of solder joints can be formed at one time.
  • a sheet-like display can be formed by arranging a plurality of full-color LEDs 20 with built-in control units on the circuit board 10.
  • FIG. 4 is an image diagram of a sheet-shaped display. Since the sheet 11 is flexible, the display can also be flexibly deformed.
  • the full-color LED with built-in control unit has three RGB elements and a control unit in one electronic component.
  • the control unit selectively emits RGB based on a command signal from the outside.
  • Multiple LEDs function as color displays by controlling the signals transmitted to the full-color LEDs built into each control unit by the external main control unit. For example, it functions as a display by arranging 640 ⁇ 480 LEDs. It does not have to be a single sheet, and for example, a sheet in which 64 ⁇ 48 LEDs are arranged may be arranged in 10 ⁇ 10 sheets.
  • FIG. 5 is an image diagram showing an application example of a sheet-shaped display. Since the sheet-shaped display has flexibility, it can be wrapped around a pillar in an underground mall or the like, and functions as a digital signage.
  • the sheet-shaped display has light transmission, for example, when it is attached to a show window in a downtown area, the effect of stimulating purchase desire can be enhanced.
  • the LED when the LED is not lit, the products in the store can be visually recognized in the same way as a general show window. If you want to appeal the product to passers-by, or if you do not want to show the situation inside the store to passers-by, turn on the LED.
  • the LED has sufficient brightness and functions as a sheet-like display even during the day.
  • FIG. 6 is a simple explanatory view according to the conventional method. The conventional method will be briefly described, and the background from the conventional method to the present invention will be described.
  • the conductive pad 40 is unnecessary. Further, the size of the circuit side terminal 12 and the electronic component side terminal 21 is sufficiently wider than the area of about 1 mm ⁇ 1 mm. Further, the number of terminals of the electronic component side terminal 21 is often two, that is, the anode and the cathode. A sufficient area is secured in this respect as well.
  • the circuit side terminal 12 surely generates heat. Most of the heat generated at the circuit side terminal 12 is conducted to the solder 30, and the solder 30 melts.
  • the present invention is characterized in that the heat generated by the conductive pad 40 is indirectly used to compensate for the insufficient heat generation amount.
  • the amount of heat generated by the circuit side terminal 12 is insufficient for solder melting, a certain amount of heat is generated. Therefore, the amount of heat indirectly supplied from the conductive pad 40 may be sufficient to make up for the shortage for solder melting. Also in this respect, the absolute amount of heat supplied to the sheet 11 may be small.
  • the sheet 11 does not undergo thermal deformation.
  • FIG. 7 is a conceptual diagram of the heat path in the sheet 11. Since FIG. 7 corresponds to FIG. 1, reference numerals are omitted. Assuming that the conductive pad 40 generates heat uniformly, it is uniformly conducted to the sheet 11 on the lower surface side shown in the sheet. On the other hand, on the upper surface side shown in the sheet, the terminal 12 having a high thermal conductivity and the air having a low thermal conductivity are mixed. The heat is conducted by selecting the terminal 12 having a high thermal conductivity. That is, unevenness occurs in the heat conduction in the sheet 11.
  • FIG. 8 is a plan view showing heat conduction unevenness. Since FIG. 8 corresponds to FIG. 2, reference numerals are omitted.
  • the distance between the terminals is secured in order to prevent a short circuit.
  • the distance between the terminals is also secured in the circuit side terminal 12. In the illustrated example, even if the distance between the terminals is the narrowest, the distance corresponding to the width of the terminals 12 (at least half or more) is secured.
  • the softened area is expressed as S (soft), and the non-softened area is expressed as H (hard).
  • the softening area S is surrounded by the non-softening area H. Even if a part of the sheet softens and the molecules try to move actively, they are restrained by the surroundings. As a result, thermal deformation of the entire sheet is suppressed.
  • FIGS. 9 and 10 are temperature profiles of the conductive pad 40. In FIG. 9, information on solder melting is superimposed. In FIG. 10, information on sheet softening is superimposed. Since the objects to be compared are different, FIGS. 9 and 10 are conceptual diagrams.
  • heat above the solder melting point is supplied from the conductive pad 40 for t1 seconds (for example, about 1 to 3 seconds). Assuming that the entire amount of heat supplied Q1 is conducted to the solder 30, the solder 30 melts if the energy is equal to or greater than the energy required for melting the solder. As described in Inference 1, the amount of heat required for melting the solder is small, and the application time may be short.
  • heat that is equal to or higher than the resin glass transition point is supplied from the conductive pad 40 for t2 seconds (for example, about 4 to 10 seconds). Assuming that the entire amount of heat supplied Q2 is conducted to the sheet 11, the sheet 11 is thermally deformed if the energy is equal to or greater than the energy required for the thermal deformation of the sheet 11. However, since the application time is short, t2 is also short and the amount of heat Q2 is small. It is insufficient to thermally deform the sheet 11.
  • the mounting method of the present application has few restrictions, such as the use of a non-heat resistant material for the sheet 11 and the use of high temperature solder for the solder 30.
  • FIG. 11 is a schematic cross-sectional view of the LED mounting structure according to the modification 1.
  • FIG. 12 is a plan view of a main part of the circuit board 10 according to the first modification.
  • the conductive pad 40 is provided corresponding to one unit (six circuit-side terminals 12), but in the first modification, it corresponds to four units (six circuit-side terminals 12). A conductive pad 40 is provided. One unit corresponding to one electronic component is shown by a broken line.
  • the area of the circuit side terminal 12 As the electronic component 20 becomes smaller, the area of the circuit side terminal 12 also becomes smaller. Further, the area of the conductive pad 40 corresponding to one unit is also narrowed, and there is a possibility that a sufficient amount of heat generation cannot be secured. For example, if the size of the electronic component 20 is about 1 mm ⁇ 1 mm, the terminal size is about 250 ⁇ m ⁇ 250 ⁇ m, and the ratio example of the above embodiment is applied, the diameter of the conductive pad 40 is about 1.5 mm.
  • the conductive pad 40 corresponding to the four units is used to secure the area of the conductive pad 40 and secure the amount of heat generated. This enables reliable solder joining.
  • the size of the conductive pad 40 is assumed to be about 2.5 to 3 mm in diameter.
  • FIG. 13 is a schematic cross-sectional view of the BGA mounting structure according to the modified example 2.
  • FIG. 14 is a plan view of a main part of the circuit board 10 according to the second modification.
  • one conductive pad 40 is provided corresponding to one unit (six circuit-side terminals 12), but in the second modification, seven conductive pads 40 correspond to one unit. It is provided. One unit corresponding to one BGA is shown by a broken line.
  • the ball grit array (BGA) 20 is one of the electronic components and is a package substrate having an electrode shape in which solder balls are arranged in a grid pattern.
  • the BGA 20 has 32 terminals 21.
  • the circuit board 10 is provided with 32 terminals 12 per unit.
  • the area of the circuit side terminals 12 is further reduced.
  • one conductive pad 40 is provided corresponding to one unit, the amount of heat generated may be too large.
  • the BGA 20 size is about 5 mm ⁇ 5 mm to 10 mm ⁇ 10 mm
  • the terminal size is 500 ⁇ m ⁇ 500 ⁇ m
  • the conductive pad 40 size is about 2 mm in diameter.
  • the mounting method of the present application can be applied to mounting a chip size package (CSP).
  • CSP chip size package
  • FIG. 15 is a schematic diagram of the FPC mounting structure according to the modified example 3.
  • FIG. 16 is a perspective view of a main part of FPCs 10 and 20 according to the third modification.
  • FIG. 17 is a cross-sectional view of a main part of FPCs 10 and 20 according to the third modification.
  • the mounting of the electronic component 20 on the circuit board 10 has been described.
  • the FPC 10 is interpreted as a circuit board and the FPC 20 is interpreted as an electronic component in a broad sense, the FPCs 10 and 20 can be joined in the same manner. ..
  • FPC flexible printed circuit
  • a conductive pad 40 is provided at the back end of the FPC 10 and indirectly heated to secure the amount of heat generated. This enables reliable solder joining.
  • Modification example 4 Although it relates to solder bonding, it can be applied to other than solder bonding.
  • the mounting method of the present application can be applied to thermosetting adhesive curing.
  • thermosetting adhesive is applied to the metal part to perform electromagnetic induction heating. Heats the conductive pad 40 and reacts the thermosetting adhesive.
  • Circuit board 11 Sheet 12 Circuit side terminal 20 Electronic component 21 Electronic component side terminal 30 Solder 40 Conductive pad

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne une technologie de soudage avec laquelle il est possible de monter un composant électronique ayant une petite surface de borne métallique sur une carte de circuit imprimé en forme de feuille.　Une structure de montage de composant électronique est formée en soudant un composant électronique (par exemple, une DEL) 20 à une carte de circuit imprimé 10. La carte de circuit imprimé 10 est pourvue : d'une feuille non résistante à la chaleur 11 ; d'un circuit disposé sur un côté de la feuille non résistante à la chaleur 11 ; d'une borne côté circuit 12 disposée sur le circuit ; et d'un tampon électroconducteur 40 disposé à une position, correspondant à la borne côté circuit 12, de l'autre côté de la feuille non résistante à la chaleur 11. La borne côté circuit 12 génère de la chaleur par chauffage par induction électromagnétique. La chaleur générée par le tampon électroconducteur 40 est transmise à travers la feuille non résistante à la chaleur 11 et la borne côté circuit 12. Un manque de quantité de chaleur générée par la borne côté circuit 12 est compensé par chauffage indirect par le tampon électroconducteur 40, ce par quoi la soudure de génération de chaleur 30 est amenée à fondre.
PCT/JP2019/023686 2019-06-14 2019-06-14 Carte de circuit et procédé de montage WO2020250427A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201980097508.9A CN113994771A (zh) 2019-06-14 2019-06-14 电路基板及安装方法
PCT/JP2019/023686 WO2020250427A1 (fr) 2019-06-14 2019-06-14 Carte de circuit et procédé de montage
KR1020217036078A KR20210151872A (ko) 2019-06-14 2019-06-14 회로 기판 및 실장 방법
JP2020526340A JP6738057B1 (ja) 2019-06-14 2019-06-14 回路基板及び実装方法
TW109119860A TW202107645A (zh) 2019-06-14 2020-06-12 電路基板及封裝方法

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Application Number Priority Date Filing Date Title
PCT/JP2019/023686 WO2020250427A1 (fr) 2019-06-14 2019-06-14 Carte de circuit et procédé de montage

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WO2020250427A1 true WO2020250427A1 (fr) 2020-12-17

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JP2000183513A (ja) * 1998-12-16 2000-06-30 Nec Corp 回路基板と電子部品との接続解除装置及びその解除方法
JP2009164404A (ja) * 2008-01-08 2009-07-23 Fujitsu Ltd 電子部品のリペア方法、リペア装置および配線板ユニット
JP3163841U (ja) * 2010-08-23 2010-11-04 黄顯榮 モジュール化したｌｅｄディスプレイ及びそのシステム
JP2013171863A (ja) * 2012-02-17 2013-09-02 Panasonic Corp 電子部品実装構造体及びその製造方法
JP2018148136A (ja) * 2017-03-08 2018-09-20 東レエンジニアリング株式会社 半田接合装置

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JP2000183513A (ja) * 1998-12-16 2000-06-30 Nec Corp 回路基板と電子部品との接続解除装置及びその解除方法
JP2009164404A (ja) * 2008-01-08 2009-07-23 Fujitsu Ltd 電子部品のリペア方法、リペア装置および配線板ユニット
JP3163841U (ja) * 2010-08-23 2010-11-04 黄顯榮 モジュール化したｌｅｄディスプレイ及びそのシステム
JP2013171863A (ja) * 2012-02-17 2013-09-02 Panasonic Corp 電子部品実装構造体及びその製造方法
JP2018148136A (ja) * 2017-03-08 2018-09-20 東レエンジニアリング株式会社 半田接合装置

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