WO2020238666A1 - 棱镜组件及投影设备 - Google Patents
棱镜组件及投影设备 Download PDFInfo
- Publication number
- WO2020238666A1 WO2020238666A1 PCT/CN2020/090763 CN2020090763W WO2020238666A1 WO 2020238666 A1 WO2020238666 A1 WO 2020238666A1 CN 2020090763 W CN2020090763 W CN 2020090763W WO 2020238666 A1 WO2020238666 A1 WO 2020238666A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fixing
- plate
- prism
- base
- dmd chip
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/28—Reflectors in projection beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
- G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
Definitions
- This application relates to the field of optical technology, in particular to prism components and projection equipment.
- DLP Digital Light Processing
- the DMD chip in the existing prism is easily affected by external force or temperature to cause the relative position of the DMD chip to change, correspondingly causing the dislocation of the projected image of each DMD, which seriously affects the viewing experience of the projection.
- the present application provides a prism assembly to solve the technical problem of image misalignment caused by temperature or external force in the DMD chip in the prism assembly.
- a technical solution adopted in this application is to provide a prism assembly, including:
- a prism having a symmetrical structure, comprising a first prism surface and a second prism surface, the first prism surface and the second prism surface are symmetrical with respect to the first cross section;
- a first fixing mechanism is provided corresponding to the first prism surface, and the first fixing mechanism is used for mounting a first DMD chip;
- the second fixing mechanism is arranged corresponding to the second prism surface, and the second fixing mechanism is used to mount a second DMD chip, wherein the first DMD chip and the second DMD chip are related to the first DMD chip.
- the profile is symmetrical.
- a projection device which includes a casing and the prism assembly provided in the above application.
- the beneficial effect of the present application is that the first fixing mechanism is provided on the first prism surface of the symmetrical structure prism, the second fixing mechanism is provided on the second prism surface of the symmetrical structure prism, and the first fixing mechanism and the second fixing mechanism
- the first DMD chip and the second DMD chip are respectively arranged on the mechanism, so that the first DMD chip and the second DMD chip are symmetrical about the first section, so that when the temperature or external force causes the DMD chip to shift, the first DMD chip and the second DMD chip
- the relative displacements of the DMD chips are equal, which reduces the probability of misalignment of the images projected by the two DMD chips, thereby improving the stability of the projected image of the prism assembly during long-term use.
- FIG. 1 is a schematic top view of an embodiment of the prism assembly of the present application
- Fig. 2 is a schematic structural diagram of an embodiment of the prism assembly of the present application
- Figure 3 is a schematic diagram of the exploded structure in Figure 2;
- FIG. 4 is a schematic diagram of a partial structure of an embodiment of the prism assembly of the present application.
- FIG. 5 is a schematic diagram of the structure of the first fixing plate of an embodiment of the prism assembly of the present application.
- FIG. 6 is a schematic structural diagram of a second fixing plate of an embodiment of the prism assembly of the present application.
- FIG. 7 is a schematic structural diagram of a base of an embodiment of the prism assembly of the present application.
- FIG. 8 is a schematic structural diagram of a cover plate of an embodiment of the prism assembly of the present application.
- FIG. 9 is a schematic structural diagram of the optical path direction of an embodiment of the prism assembly of the present application.
- FIG. 10 is a schematic structural diagram of a simulation analysis result of an embodiment of the prism assembly of the present application.
- FIG. 11 is a schematic structural diagram of an embodiment of a projection device of the present application.
- an embodiment of the present application provides a prism assembly 100, the prism assembly 100 includes: a prism 10, a first fixing mechanism 20, a second fixing mechanism 40, a base 60, a cover 70, The first side plate 80 and the second side plate 81.
- the prism 10 may be made of quartz glass, alkali metal halide crystal, or optical glass.
- the prism 10 may be integrally formed or a plurality of pieces combined.
- the prism 10 has a symmetrical structure, which includes at least a first prism surface 11 and a second prism surface 12.
- the first prism surface 11 may be the incident surface of light
- the second prism surface 12 may be the incident surface of light, that is, the prism at least Including two light incident surfaces.
- the prism 10 may also include a third prism surface or a fourth prism surface (not shown in the figure), such as an exit surface, which is not specifically limited herein.
- the terms “first” and “second” in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include at least one of the features.
- the first prism surface 11 and the second prism surface 12 are symmetric with respect to the first section A.
- the first fixing mechanism 20 is arranged corresponding to the first prism surface 11, and it can be understood that the first fixing mechanism 20 is arranged on the opposite side of the first prism surface 11.
- the first fixing mechanism 20 is used for mounting the first DMD chip 30, and the mounting method may be adhesive fixing or fixing by fixing.
- the first DMD chip 30 can receive the light from the first prism surface 11 and modulate the light to form an image and reflect the light into the prism 10.
- the second fixing mechanism 40 is arranged corresponding to the second prism surface 12, and it can be understood that the second fixing mechanism 40 is arranged on the opposite side of the second prism surface 12.
- the second fixing mechanism 40 is used to install the second DMD chip 50, and the installation method may be adhesive fixing or fixing by fixing.
- the second DMD chip 50 can receive light from the second prism surface 12 and modulate the light to form an image and reflect the light into the prism 10.
- the first DMD chip 30 and the second DMD chip 50 are receiving light ( Without image signal), the light is modulated by the first DMD chip 30 and the second DMD chip 50 to form image light (with image signal), and the image light is reflected to the prism 10 and projected in the same direction. Make the image light overlap to form an image. Since the light transmission in the prism assembly 100 requires high precision, the material of the first fixing mechanism 20 and the second fixing mechanism 40 can be the same, for example, SUS430 material, of course, can also be other metals or metal alloys, as long as it can provide a stable The structure is fine.
- first DMD chip 30 and the second DMD chip 50 are symmetrical about the first section A, and the structure and type of the first DMD chip 30 and the second DMD chip 50 may be the same. It can be understood that since the first prism surface 11 and the second prism surface 12 are symmetrical with respect to the first section A, the distance from the first DMD chip 30 to the first prism surface 11 is equal to the distance from the second DMD chip 50 to the second prism surface 12.
- the relative offset displacements of the first DMD chip 30 and the second DMD chip 50 are equal, so that the first DMD chip 50 The images projected from the prism 10 by the chip 30 and the second DMD chip 50 still overlap.
- the second fixing mechanism 40 is provided on the second prism surface 12 of the symmetrical prism 10, and the first fixing mechanism 20 and the second fixing mechanism
- the first DMD chip 30 and the second DMD chip 50 are respectively arranged on the mechanism 40, so that the first DMD chip 30 and the second DMD chip 50 are symmetrical with respect to the first section A, so that temperature or external force can cause the first DMD chip and the second DMD chip
- the relative offsets of the DMD chips are equal, which reduces the probability that the image light projected between the first DMD chip 30 and the second DMD chip 50 shifts and causes the image to be misaligned, thereby improving the projection of the image by the prism assembly 100 during long-term use The stability.
- the prism 10 may be composed of 6 small prisms, and may correspondingly include 4 triangular prisms and two quadrangular prisms.
- the above multiple small prisms are combined to form a symmetry about the first section A. structure.
- the first prism surface 11 may be the side surface of one of the triangular prisms
- the second prism surface 12 may be the side surface of the other triangular prism.
- the two quadrangular prisms form an angle of 90 degrees, that is, they are not in contact with the triangular prism and are far away
- the angles of the two quadrangular prisms of the triangular prism are 45 degrees
- the first DMD chip 30 and the second DMD chip 50 are perpendicular to each other, that is, the first DMD chip 30 and the second DMD chip 50 are symmetrical about a right angle, thereby reducing the DMD chip
- the incident light passes through the beam splitter 94 and is divided into two paths through the triangular prism to enter the first DMD chip 30 and the second DMD chip 50, and then is reflected by the first DMD chip 30 and the second DMD chip 50 to the quadrangular prism, and finally passes through the same A quadrangular prism shoots out.
- the first DMD chip 30 and the second DMD chip 50 may not be right-angled symmetry, for example, they may be 60 degrees, 120 degrees, or 145 degrees, which are not specifically limited here.
- the prism assembly 100 may further include a base 60 and a cover 70.
- the base 60 and the cover 70 can be made of the same material, for example, SUS430 material, or other metals or metal alloys.
- the prism 10 is disposed on the base 60, and may be fixed to the base 60 by bonding or the like, for example.
- the cover plate 70 is disposed opposite to the base 60 to cover the prism 10.
- the base 60 and the cover 70 can be hollowed out separately, for example, 3 holes are dug out respectively to reduce the weight of the entire prism assembly 100, reduce the cost of materials, and facilitate the heat dissipation of the prism assembly 100 .
- the first fixing mechanism 20 is connected to the base 60 and the cover 70 respectively
- the second fixing mechanism 40 is connected to the base 60 and the cover 70 respectively
- the first fixing mechanism 20 is adjacent to the second fixing mechanism 40.
- a stable support can be formed for the base 60 and the cover 70, so that the structure of the prism assembly 100 is more stable.
- the fixed connection can also be a detachable connection or an integral connection; it can be a mechanical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be a communication between two components.
- the specific meaning of the above-mentioned terms in this application can be understood according to the specific circumstances.
- the first fixing mechanism 20 may include a first fixing plate 21, a first mounting plate 22 and a first fixing member 23.
- the first fixing member 23 connects the first fixing plate 21 and the first mounting plate 22.
- the first fixing plate 21 is connected to the base 60 and the cover plate 70, and the connection method can be using a fixing member (not shown in the figure), bonding or clamping.
- the first mounting board 22 is used to mount the first DMD chip 30.
- the center of the first mounting board 22 may be provided with a recess for accommodating the first DMD chip 30, so as to prevent the first DMD chip 30 from protruding from the first mounting board 22, and effectively reduce the volume of the prism assembly 100.
- the second fixing mechanism 40 may include a second fixing plate 41, a second mounting plate 42 and a second fixing member 43.
- the second fixing member 43 is connected to the second fixing plate 41 and the second mounting plate 42, and the second fixing plate 41 is connected to the base 60 and the cover plate 70.
- the connection method can be the use of fixing members (not shown), bonding or clamping. Wait.
- the second mounting board 42 is used for mounting the second DMD chip 50.
- the center of the second mounting board 42 can also be provided with a recess for accommodating the second DMD chip 50, so as to prevent the second DMD chip 50 from protruding from the second mounting board 42 and effectively reduce the volume of the prism assembly 100.
- the second DMD chip is placed on the second mounting board 42, and then connected to the base 60 and the cover through the first fixing board 21 and the second fixing board 41
- the distance between the prism 10 and the first DMD chip 30 and the second DMD chip is increased, which facilitates the transmission of light, and reduces the temperature of the DMD chip directly contacting the prism 10 and affecting the prism 10.
- the thickness of the first fixing plate 21 and the second fixing plate 41 can be the same, and the thickness of the first mounting plate 22 and the second mounting plate 42 are the same, because their material and thickness are the same, so as to ensure that the external force or temperature changes , The relative displacement changes of the mounting board and the fixed board to the DMD chip are equal.
- a first gap is left between the first fixing plate 21 and the first mounting plate 22, and a second gap is left between the second fixing plate 41 and the second mounting plate 42.
- a plurality of spacers (not shown in the figure) can be bonded between the first fixing plate 21 and the first mounting plate 22, and a plurality of spacers can be bonded between the second fixing plate 41 and the second mounting plate 42 ( Figure not shown).
- the width of the first gap and the second gap are equal, and the width can be 1 mm, 1.5 mm, or 2 mm.
- the distance from the first DMD chip 30 to the first prism surface 11 is equal to the distance from the second DMD chip 50 to the second prism surface 12.
- the first fixing plate 21 may be provided with first fixing holes 211, and the first fixing holes 211 may be oppositely arranged at both ends of the first fixing plate 21, and the number It can be 4 or 6, etc.
- the first mounting plate 22 may be provided with a second fixing hole 221, and the second fixing hole 221 may be stepped. The positions and numbers of the second fixing holes 221 and the first fixing holes 211 are correspondingly the same.
- the first fixing member 23 may include a first fixing rod 231 and a first collar 232.
- the first fixing rod 231 may be a pin with a gasket provided on the pin.
- the first collar 232 may be a glass ring or the like.
- the first fixing rod 231 penetrates the first fixing hole 211 and the second fixing hole 221, and the first collar 232 is inserted into the first fixing rod 231 and is accommodated in the stepped second fixing hole 221, so that the first The collar 232 is flush with the surface of the first mounting plate 22, that is, the first collar 232 can be hidden to the surface of the first mounting plate 22, so the volume of the first fixing mechanism 20 can be effectively reduced.
- the diameter of the second fixing hole 221 is equal to the diameter of the first fixing rod 231.
- the surface of the first ring 232 is provided with a first glue dispensing area, which is used to fill curing glue to fix the first fixing member 23, the first fixing plate 21 and the first mounting plate 22, for example, it may be natural curing
- glue or epoxy resin can also be provided with a first glue dispensing area on the first fixing rod 231 or the first mounting plate 22, which is not specifically limited here, as long as the adhesion and fixing can be further achieved.
- the first fixing plate 21 and the first mounting plate 22 are connected by the first fixing rod 231 and the first collar 232, and finally the curing glue is used for bonding, so that the first fixing member 23 and the first fixing The board 21 and the first mounting board 22 are firmly fixed together.
- the surface of the first fixing rod 231 may also be provided with a knurled structure, so as to further enhance the bonding strength.
- the second fixing plate 41 may be provided with third fixing holes 411, and the third fixing holes 411 may be oppositely arranged at both ends of the second fixing plate 41, and the number may be 4 or 6 and so on.
- the second mounting plate 42 is provided with a fourth fixing hole 421, the fourth fixing hole 421 may be stepped, and the position and number of the fourth fixing hole 421 and the third fixing hole 411 are correspondingly the same.
- the second fixing member 43 may include a second fixing rod 431 and a second collar 432.
- the second fixing rod 431 may be a pin with a gasket provided on the pin.
- the second collar 432 may be a glass ring or the like.
- the second fixing rod 431 penetrates the third fixing hole 411 and the fourth fixing hole 421, and the second collar 432 is sleeved into the second fixing rod 431 and is accommodated in the stepped fourth fixing hole, so that the second set of The ring 432 is flush with the surface of the second mounting plate 42, that is, the second collar 432 can be hidden to the surface of the second mounting plate 42, so the volume of the second fixing mechanism 40 can be effectively reduced.
- the diameter of the fourth fixing hole 421 is larger than the diameter of the second fixing rod 431 so that the position of the second mounting plate 42 relative to the second fixing plate 41 is adjustable.
- the surface of the second collar 432 is provided with a second glue dispensing area
- the second glue dispensing area is used to fill curing glue to fix the second fixing member 43, the second fixing plate 41 and the second mounting plate 42, for example, natural curing Glue or epoxy resin, etc.
- a second glue dispensing area can also be provided on the second fixing rod 431 or the second mounting plate 42 correspondingly, which is not specifically limited here, as long as the adhesion and fixing can be further realized. It can be understood that the second fixing plate 41 and the second mounting plate 42 are connected by the second fixing rod 431 and the second collar 432, and finally the curing glue is used for bonding, so that the second fixing member 43 and the second fixing The board 41 and the second mounting board 42 are firmly fixed together.
- the surface of the second fixing rod 431 may also be provided with a knurled structure, so as to further enhance the bonding strength.
- the base 60 and the cover 70 may be provided with first positioning holes 61 and second positioning holes 71 on the side surfaces corresponding to the first fixing plate 21, respectively, and the number may be both. It is 1, 2, or 3.
- the side surfaces of the base 60 and the cover 70 corresponding to the second fixing plate 41 are respectively provided with a third positioning hole 62 and a fourth positioning hole 72, the number of which can be one, two or three.
- the first fixing plate 21 is provided with a fifth positioning hole 212, the number of the fifth positioning hole 212 may be 3 or 4, etc.
- the fifth positioning hole 212 is located between the adjacent first fixing holes 211.
- the second fixing plate 41 is provided with a sixth positioning hole 412, the number of the sixth positioning hole 412 can be 3 or 4, etc.
- the sixth positioning hole 412 is located between the adjacent third fixing holes 411, and the first long guide post 90
- the fifth positioning hole 212 to the first positioning hole 61 and the second positioning hole 71 are penetrated to position the first fixing plate 21 on the base 60 and the cover plate 70.
- the second long guide post 92 penetrates the sixth positioning hole 412 to the third positioning hole 62 and the fourth positioning hole 72 to position the second fixing plate 41 on the base 60 and the cover plate 70.
- the base 60 may be provided with a first bonding area 63 on the side facing the cover 70, and the number of the first bonding areas 63 may be multiple intervals Arrangement, the number can be 6, 7, 8, or 10, etc., which is not specifically limited here.
- the side of the cover plate 70 facing the base 60 may be provided with a second bonding area 73.
- the number of the second bonding area 73 may be arranged at intervals, and the number may be 6, 7, 8, or 10. Etc., the details are not limited here.
- a third bonding area 213 is provided on the side of the first fixing plate 21 facing away from the first mounting plate 22.
- the center of the first fixing plate 21 may be provided with a large through hole similar to a rectangle for receiving the central part of the first mounting plate 22, and the third bonding area 213 may be located between the fifth positioning hole 212 and the large through hole.
- the side of the second fixing plate 41 away from the second mounting plate 42 is provided with a fourth bonding area 413.
- the center of the second fixing plate 41 can also be provided with a large rectangular through hole for accommodating the center of the second mounting plate 42 Part, the fourth bonding area 413 may be located between the sixth positioning hole 412 and the large through hole.
- the first bonding area 63, the second bonding area 73, the third bonding area 213, and the fourth bonding area 413 are used for placing a glue material to bond the prism 10, for example, epoxy resin or UV glue. In the above manner, the prism 10 can be firmly fixed from multiple angles, and the risk of loosening of the prism 10 can be reduced.
- the prism assembly 100 may further include a first side plate 80 and a second side plate 81.
- a large through hole (not shown in the figure) is opened in the center of the first side plate 80 and the second side plate 81 so that the light in the prism 10 can be projected out.
- the first side plate 80 is connected to the base 60 and the cover plate 70 and is disposed opposite to the first fixing mechanism 20, and the second side plate 81 is connected to the base 60 and the cover plate 70 and is disposed opposite to the second fixing mechanism 40.
- the first side plate 80 and the second side plate 81 can be inserted into the holes in the side walls of the base 60 and the cover plate 70 by fasteners (such as bolts or screws, etc.) to form a fixed connection.
- the first side plate 80 and the second side plate 81 further support the base 60 and the cover 70 to prevent the base 60 and the cover 70 from crushing the prism 10.
- the base 60, the cover plate 70, the first fixing plate 21, the second fixing plate 41, the first side plate 80 and the second side plate 81 are enclosed in a stable hollow structure, and the hollow structure is reserved for accommodating The space of the prism 10, and the inner surface of the side facing the space is coated with matting paint or blackened to eliminate stray light emitted by the prism, thereby improving the contrast of the image projected by the prism 10.
- the first side plate 80 and the prism 10 can be kept parallel with a third gap, and the second side plate 81 and the prism 10 can be kept parallel with a fourth gap.
- the first side plate 80 and the second side plate The two side plates 81 can ensure that the first side plate 80 and the second side plate 81 block the stray light from entering and exiting. On the other hand, it can prevent the first side plate 80 and the second side plate 81 from being squeezed and damaged when the temperature rises. 10.
- narrow and thin adhesive strips can be pasted at the gaps between the base 60, the cover 70, the first side plate 80, and the second side plate 81 to form a seal, so as to prevent the glue from penetrating into the prism 10 during gluing, while reducing Dust enters the space of the prism 10 later.
- a heat sink (not shown in the figure) may be further provided behind the first DMD chip 30 and the second DMD chip 50.
- the heat sink is composed of an aluminum heat sink, a heat pipe and a copper heat sink.
- a DMD chip 30 is in contact with the back of the second DMD chip 50, and a thermal pad (not shown in the figure) is arranged on the contact surface, and the heat transferred to the heat sink is conducted by the thermal pipe to the copper heat sink for dissipation.
- the prism assembly 100 in FIG. 10 omits the first fixing mechanism 20 and the second fixing mechanism 40, a1 can represent displacement along the Y axis, b1 can represent displacement along the X axis, and c1 can represent For the displacement along the Z axis, the center of the circle in the figure can indicate the direction perpendicular to the paper.
- a2 can represent the displacement along the X axis
- b2 It can represent the displacement along the Y axis
- c2 can represent the displacement along the Z axis.
- the displacement value of a1 is equal to the displacement value of a2
- the displacement value of b1 is equal to the displacement value of b2
- the displacement value of c1 is equal to the displacement value of c2, that is, the offset displacement of the first DMD chip 30 and the second DMD chip 50 the same.
- the deviation direction of the images projected by the two DMD chips is Consistent, and the offset displacement is kept synchronized, which can effectively ensure that the environment temperature changes and the projected images of the first DMD chip 30 and the second DMD chip 50 can be kept stably overlapping, and the risk of image misalignment can be reduced.
- the present application also provides a projection device 200 that includes a casing 210 and the prism assembly 100 as described in the above embodiment connected to the casing 210, and the prism assembly 100 is disposed in the casing 210.
- a projection device 200 that includes a casing 210 and the prism assembly 100 as described in the above embodiment connected to the casing 210, and the prism assembly 100 is disposed in the casing 210.
- the prism assembly 100 For the specific content of the prism assembly 100, reference may be made to the description of the foregoing embodiment, which is not repeated here.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Projection Apparatus (AREA)
Abstract
一种棱镜组件(100)包括棱镜(10)、第一固定机构(20)以及第二固定机构(40),棱镜(10)为对称结构,包括第一棱镜面和第二棱镜面,第一棱镜面和第二棱镜面相对第一剖面对称;第一固定机构(20)与第一棱镜面对应设置并用于安装第一DMD芯片(30);第二固定机构(40)与第二棱镜面对应设置并用于安装第二DMD芯片(40),其中,第一DMD芯片(30)和第二DMD芯片(40)关于第一剖面对称。如此使得温度或者外力引起的第一DMD芯片(30)和第二DMD芯片(40)相对位移相等。还提供包括棱镜组件(100)的投影设备(200)。
Description
本申请涉及光学技术领域,特别涉及棱镜组件及投影设备。
近年来,液晶显示(LCD,Liquid Crystal Display)技术在一些应用中受到限制,数字光处理(DLP,Digital Light Processing)技术显示***得到不断发展。DLP投射显示方式的核心在于提供一个空间光调制单元,数字微透镜装置(DMD,Digital Micromirror Device)作为一种反射式空间光调制器在投影应用领域占了非常重要的位置。与投射式LCD技术相比,利用DMD的DLP技术在体积、响应速度等方面更具优势,因此在市场上具有良好的发展前景。
现有的棱镜中的DMD芯片容易受外力或温度影响引发DMD芯片相对位置的变动,相应造成各DMD投射图像的错位,严重影响投影的观赏体验感。
发明内容
本申请提供一种棱镜组件,以解决棱镜组件中的DMD芯片因温度或者外力引起的图像错位的技术问题。
为解决上述技术问题,本申请采用的一个技术方案是提供一种棱镜组件,包括:
棱镜,所述棱镜为对称结构,包括第一棱镜面和第二棱镜面,所述第一棱镜面和所述第二棱镜面相对第一剖面对称;
第一固定机构,与所述第一棱镜面对应设置,所述第一固定机构用于安装第一DMD芯片;以及
第二固定机构,与所述第二棱镜面对应设置,所述第二固定机构用 于安装第二DMD芯片,其中,所述第一DMD芯片和所述第二DMD芯片关于所述第一剖面对称。
为解决上述技术问题,本申请采用的另一个技术方案是提供一种投影设备,该投影设备包括机壳以及如上述本申请提供的棱镜组件。
本申请的有益效果是:通过在对称结构的棱镜的第一棱镜面设置第一固定机构,在对称结构的棱镜的第二棱镜面设置第二固定机构,并在第一固定机构和第二固定机构上分别设置第一DMD芯片和第二DMD芯片,使得第一DMD芯片和第二DMD芯片关于第一剖面对称,从而能够使得温度或者外力引起DMD芯片发生位移时,第一DMD芯片和第二DMD芯片的相对位移相等,降低两个DMD芯片投射的图像发生错位的概率,进而提升棱镜组件在长时间的使用过程中投射图像的稳定性。
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图,其中:
图1是本申请棱镜组件一实施例的俯视结构示意图;
图2是本申请棱镜组件一实施例的结构示意图;
图3是图2中的分解结构示意图;
图4是本申请棱镜组件一实施例的部分结构示意图;
图5是本申请棱镜组件一实施例的第一固定板的结构示意图;
图6是本申请棱镜组件一实施例的第二固定板的结构示意图;
图7是本申请棱镜组件一实施例的基座的结构示意图;
图8是本申请棱镜组件一实施例的盖板的结构示意图;
图9是本申请棱镜组件一实施例的光路走向的结构示意图;
图10是本申请棱镜组件一实施例的模拟分析结果的结构示意图;
图11是本申请投影设备一实施例的结构示意图。
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,均属于本申请保护的范围。
参见图1、图2和图3,本申请实施例提供一种棱镜组件100,该棱镜组件100包括:棱镜10、第一固定机构20、第二固定机构40、基座60、盖板70、第一侧板80以及第二侧板81。
继续参阅图1、图2和图3,棱镜10可以是石英玻璃、碱金属卤化物晶体或者光学玻璃等制成。棱镜10可以是一体成型或者多个拼合而成。棱镜10为对称结构,其中至少包括第一棱镜面11和第二棱镜面12,第一棱镜面11可以是光线的入射面,第二棱镜面12可以是光线的入射面,也即该棱镜至少包括两个光线入射面。当然棱镜10还可以包括第三棱镜面或者第四棱镜面(图未示出)例如出射面等,具体在此不作限定。本申请中的术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。第一棱镜面11和第二棱镜面12相对第一剖面A对称。第一固定机构20与第一棱镜面11对应设置,可以理解,第一固定机构20设置在第一棱镜面11的相对侧。第一固定机构20用于安装第一DMD芯片30,安装方式可以是粘合固定或者固定件固定等。第一DMD芯片30能够接收来自第一棱镜面11的光线并将该光线进行调制以形成图像光反射至棱镜10中。第二固定机构40与第二棱镜面12对应设置,可以理解,第二固定机构40设置在第二棱镜面12的相对侧。第二固定机构40用于安装第二DMD芯片50,安装方式可以是粘合固定或者固定件固定等。第二DMD芯片50能够接收来自第二棱镜面12的光线并将该光线进行调制以形成图像光反射至棱镜10中,可以理解,第一DMD芯片30和 第二DMD芯片50在接收到光线(未带图像信号)后,该光线经过第一DMD芯片30和第二DMD芯片50调制后会形成图像光(带有图像信号),图像光再反射至棱镜10中沿同一个方向投射出去,以使得图像光重合形成图像。由于棱镜组件100中光线传输对精度要求高,第一固定机构20和第二固定机构40的材质可以相同,例如使用SUS430材质,当然也可以是其它金属或者金属合金等材质,只要能提供稳定的结构即可。其中,第一DMD芯片30和第二DMD芯片50关于第一剖面A对称,第一DMD芯片30和第二DMD芯片50结构和类型可以相同。可以理解,由于第一棱镜面11和第二棱镜面12相对第一剖面A对称,第一DMD芯片30至第一棱镜面11的距离等于第二DMD芯片50至第二棱镜面12的距离。因此,当第一DMD芯片30和第二DMD芯片50因长时间工作引起发热或者受到外力推动时,第一DMD芯片30和第二DMD芯片50发生的相对偏移位移相等,从而使得第一DMD芯片30和第二DMD芯片50从棱镜10投射出去的图像仍然重合。
通过在对称结构的棱镜10的第一棱镜面11设置第一固定机构20,在对称结构的棱镜10的第二棱镜面12设置第二固定机构40,并在第一固定机构20和第二固定机构40上分别设置第一DMD芯片30和第二DMD芯片50,使得第一DMD芯片30和第二DMD芯片50关于第一剖面A对称,从而能够使得温度或者外力引起第一DMD芯片和第二DMD芯片相对偏移位移相等,降低了第一DMD芯片30和第二DMD芯片50之间投射的图像光发生偏移导致图像错位的概率,进而提升棱镜组件100在长时间的使用过程中投射图像的稳定性。
可选地,参阅图1和图9,棱镜10可以由6块小棱镜拼合而成,可相应包括4个三角棱镜和两个四角棱镜,上述多个小棱镜拼合构成关于第一剖面A的对称结构。其中,第一棱镜面11可为其中一个三角棱镜的侧面,第二棱镜面12可为其中另一个三角棱镜的侧面,两个四角棱镜构成90度的角度,也即未与三角棱镜接触且远离三角棱镜的两个四角棱镜的角度分别为45度,且第一DMD芯片30和第二DMD芯片50相互垂直,也即第一DMD芯片30和第二DMD芯片50关于直角对称, 从而降低DMD芯片安装调试的难度。可以理解,入射光线经过分光片94分成两路分别通过三角棱镜进入第一DMD芯片30和第二DMD芯片50,再由第一DMD芯片30和第二DMD芯片50反射至四角棱镜,最后通过同一个四角棱镜射出。当然在其它实施例中,第一DMD芯片30和第二DMD芯片50也可以不是直角对称,例如可以是60度、120度或者145度等角度的对称,具体在此不限定。
参阅图2和图3,棱镜组件100还可包括基座60和盖板70。基座60和盖板70的材质可以相同,例如使用SUS430材质,当然也可以是其它金属或者金属合金等材质。棱镜10设置在基座60上,例如可以是粘接等方式固定在基座60。盖板70与基座60相对设置从而盖设棱镜10。当然在基座60和盖板70上可分别进行挖空处理,例如分别对应挖出3个孔,以减轻整个棱镜组件100的重量,降低材料的使用成本,并且方便棱镜组件100的热量散出。第一固定机构20分别连接基座60和盖板70,第二固定机构40分别连接基座60和盖板70,第一固定机构20与第二固定机构40相邻。通过上述方式,可以对基座60和盖板70形成稳定的支撑,使得棱镜组件100的结构更加稳定。在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“设置在……上”应做广义理解,例如,可以是固定连接,也可以是可拆卸地连接,或者一体地连接;可以是机械连接;可以是直接连接,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以视具体情况理解上述术语在本申请中的具体含义。
继续参阅图3,第一固定机构20可包括第一固定板21、第一安装板22以及第一固定件23。第一固定件23连接第一固定板21和第一安装板22。第一固定板21连接基座60和盖板70,连接方式可以是使用固定件(图未示出)、粘接或者卡接等。第一安装板22用于安装第一DMD芯片30。第一安装板22的中心可设有凹陷部用于容置第一DMD芯片30,从而可以避免第一DMD芯片30突出第一安装板22,有效减小了棱镜组件100的体积。第二固定机构40可包括第二固定板41、第 二安装板42以及第二固定件43。第二固定件43连接第二固定板41和第二安装板42,第二固定板41连接基座60和盖板70,连接方式可以是使用固定件(图未示出)、粘接或者卡接等。第二安装板42用于安装第二DMD芯片50。第二安装板42的中心同样可设有凹陷部用于容置第二DMD芯片50,从而可以避免第二DMD芯片50突出第二安装板42,有效减小了棱镜组件100的体积。通过将第一DMD芯片30设置在第一安装板22上,将第二DMD芯片设置在第二安装板42上,再通过第一固定板21和第二固定板41连接到基座60和盖板70上,从而增加了棱镜10至第一DMD芯片30和第二DMD芯片之间的距离,有利于光线的传输,并降低DMD芯片温度直接接触棱镜10对棱镜10造成影响。
可选地,第一固定板21和第二固定板41厚度可相同,第一安装板22和第二安装板42的厚度相同,由于其材质和厚度都相同,从而确保外力或者温度发生变化时,安装板和固定板对DMD芯片的相对位移变化量相等。第一固定板21与第一安装板22之间留有第一空隙,第二固定板41与第二安装板42之间留有第二空隙。例如可以在第一固定板21与第一安装板22之间粘接多个隔片(图未示出),在第二固定板41与第二安装板42之间粘接多个隔片(图未示出)。第一空隙与第二空隙宽度相等,宽度可以是1毫米、1.5毫米或者2毫米等。第一DMD芯片30至第一棱镜面11的距离与第二DMD芯片50至第二棱镜面12的距离相等。通过上述方式,隔开了第一固定板21和第一安装板22、第二固定板41和第二安装板42,从而减少DMD芯片上的热量直接传导至棱镜10或者基座60或者盖板70上。
在一些实施例中,一并参阅图4和图5,第一固定板21可设有第一固定孔211,第一固定孔211可以是相对设置在第一固定板21的两端,其数量可以是4个或者6个等。第一安装板22可设有第二固定孔221,第二固定孔221可为阶梯状。第二固定孔221和第一固定孔211位置和数量对应相同。第一固定件23可包括第一固定杆231和第一套环232,第一固定杆231可以是销钉,销钉上还设有垫片,第一套环232可以是 玻璃环等。第一固定杆231穿设第一固定孔211和第二固定孔221,第一套环232套入第一固定杆231且容置在阶梯状的第二固定孔221内,从而可以使得第一套环232与第一安装板22的表面平齐,也即第一套环232可隐藏至第一安装板22的表面,因而可以有效减少第一固定机构20的体积。其中,第二固定孔221的孔径等于第一固定杆231的直径。第一套环232表面设有第一点胶区,第一点胶区用于填充固化胶以将第一固定件23、第一固定板21和第一安装板22固定,例如可以是自然固化胶或者环氧树脂等,当然还可相应在第一固定杆231或者第一安装板22上设置第一点胶区,具体在此不作限定,只要能够进一步实现粘合固定即可。可以理解,通过第一固定杆231和第一套环232连接好第一固定板21和第一安装板22,最后在通过固化胶进行粘合,从而可以使得第一固定件23、第一固定板21和第一安装板22之间牢牢的固定在一起。当然,第一固定杆231的表面还可以设置滚花结构,从而进一步增强粘接的强度。
可选地,一并参阅图6,第二固定板41可设有第三固定孔411,第三固定孔411可以是相对设置在第二固定板41的两端,其数量可以是4个或者6个等。第二安装板42设有第四固定孔421,第四固定孔421可为阶梯状,第四固定孔421和第三固定孔411位置和数量对应相同。第二固定件43可包括第二固定杆431和第二套环432,第二固定杆431可以是销钉,销钉上还设有垫片,第二套环432可以是玻璃环等。第二固定杆431穿设第三固定孔411和第四固定孔421,第二套环432套入第二固定杆431且容置在阶梯状的第四固定孔内,从而可以使得第二套环432与第二安装板42的表面平齐,也即第二套环432可隐藏至第二安装板42的表面,因而可以有效减少第二固定机构40的体积。其中,第四固定孔421的孔径大于第二固定杆431的直径以使第二安装板42相对第二固定板41的位置可调。第二套环432表面设有第二点胶区,第二点胶区用于填充固化胶以将第二固定件43、第二固定板41和第二安装板42固定,例如可以是自然固化胶或者环氧树脂等。当然还可相应在第二固定杆431或者第二安装板42上设置第二点胶区,具体在此不作 限定,只要能够进一步实现粘合固定即可。可以理解,通过第二固定杆431和第二套环432连接好第二固定板41和第二安装板42,最后在通过固化胶进行粘合,从而可以使得第二固定件43、第二固定板41和第二安装板42之间牢牢的固定在一起。当然,第二固定杆431的表面还可以设置滚花结构,从而进一步增强粘接的强度。通过使得第一固定机构20和第二固定机构40的具体固定方式完全相同,从而确保两者的一致性,以使得外力或者温度对第一固定机构20和第二固定机构40产生的影响相同,最终产生的偏移位移也相同。
可选地,继续参与图4、图5和图6,基座60和盖板70对应第一固定板21的侧面可分别设有第一定位孔61和第二定位孔71,其数量可以都是1个、2个或者3个。基座60和盖板70对应第二固定板41的侧面分别设有第三定位孔62和第四定位孔72,其数量可以都是1个、2个或者3个。第一固定板21设有第五定位孔212,第五定位孔212数量可以是3个或者4个等,第五定位孔212位于相邻第一固定孔211之间。第二固定板41设有第六定位孔412,第六定位孔412数量可以是3个或者4个等,第六定位孔412位于相邻第三固定孔411之间,第一长导向柱90穿设第五定位孔212至第一定位孔61和第二定位孔71以定位第一固定板21于基座60和盖板70上。第二长导向柱92穿设第六定位孔412至第三定位孔62和第四定位孔72以定位第二固定板41于基座60和盖板70上。可以理解,在安装时,通过定位孔与导向杆的安装方式可以满足DMD芯片的高精度定位要求,避免安装出现误差,同时通过上述方式安装不受棱镜10侧面结构的限制,进而提升安装效率。
可选地,参阅图5、图6、图7和图8,基座60朝向盖板70的一侧可设有第一粘接区63,第一粘接区63的数量可以是多个间隔排布,数量可以是6个、7个、8个或者10个等,具体在此不作限制。盖板70朝向基座60的一侧可设有第二粘接区73,第二粘接区73的数量可以是多个间隔排布,数量可以是6个、7个、8个或者10个等,具体在此不作限制。第一固定板21背离第一安装板22的一侧设有第三粘接区213。第一固定板21中心可设有类似矩形的大通孔以用于容置第一安装板22 的中心部,第三粘接区213可位于第五定位孔212和大通孔之间。第二固定板41背离第二安装板42的一侧设有第四粘接区413,第二固定板41中心也可设有类似矩形的大通孔以用于容置第二安装板42的中心部,第四粘接区413可位于第六定位孔412和大通孔之间。第一粘接区63、第二粘接区73、第三粘接区213和第四粘接区413用于放置胶质材料以粘接棱镜10,例如可以是环氧树脂或者UV胶等。通过上述方式可以从多个角度牢牢地将棱镜10固定住,降低棱镜10发生松动的风险。
在一些实施例中,参阅图2、图3和图4,棱镜组件100还可包括第一侧板80和第二侧板81。第一侧板80和第二侧板81的中心开设有大通孔(图未示出)从而可以使得棱镜10中的光线投射出去。第一侧板80连接基座60和盖板70,且与第一固定机构20相对设置,第二侧板81连接基座60和盖板70,且与第二固定机构40相对设置。第一侧板80和第二侧板81可以通过紧固件(例如螺栓或者螺钉等)穿设至基座60和盖板70侧壁的孔内以形成固定连接。通过第一侧板80和第二侧板81进一步对基座60和盖板70形成支撑,避免基座60和盖板70压坏棱镜10。其中,基座60、盖板70、第一固定板21、第二固定板41、第一侧板80和第二侧板81围设成一个稳定的中空结构,该中空结构留有用以容置棱镜10的空间,且朝向空间一侧的内表面涂有消光漆或者进行发黑处理以消除棱镜射出的杂光,进而提升棱镜10投射出去的图像对比度。
可选地,第一侧板80与棱镜10可保持平行且留有第三空隙,第二侧板81与棱镜10保持平行且留有第四空隙,通过上述方式,第一侧板80和第二侧板81能够确保第一侧板80和第二侧板81挡住杂光进出,另一方面可以避免温度升高时,第一侧板80和第二侧板81受热膨胀导致挤压损坏棱镜10。
可选地,在基座60、盖板70、第一侧板80和第二侧板81的缝隙处还可粘贴窄薄胶条以形成密封,从而避免粘胶时胶水渗入棱镜10,同时减少后期灰尘进入棱镜10的空间中。当然在第一DMD芯片30和第二DMD芯片50背后还可设有散热器(图未示出),散热器由铝制热沉、 导热管与铜制散热片组成,铝制热沉与第一DMD芯片30和第二DMD芯片50背面接触,并在接触面设置导热垫(图未示出),传递到热沉上的热量由导热管导出到铜制散热片散去。
参阅图10,在模拟实验下(例如在ansys软件中)得到第一DMD芯片30相对第一棱镜面11的偏移位移,第二DMD芯片50相对第二棱镜面12的位移,以世界坐标系为参考示例,其中图10中的棱镜组件100省去了第一固定机构20和第二固定机构40,a1可表示沿Y轴方向的位移,b1可表示沿X轴方向的位移,c1可表示沿Z轴方向的位移,图中的圆心可表示垂直纸面的方向,由于第一芯片30和第二芯片50关于第一剖面A对称,相应地,a2可表示沿X轴方向的位移,b2可表示沿Y轴方向的位移,c2可表示沿Z轴方向的位移。其中,a1的位移值等于a2的位移值,b1的位移值等于b2的位移值,c1的位移值等于c2的位移值,也即,第一DMD芯片30与第二DMD芯片50的偏移位移相同。因此第一DMD芯片30与第二DMD芯片50的因热变形与棱镜10的第一棱镜面11和第二棱镜面12产生的相对移动导致两DMD芯片所投射出来的图像产生的偏移方向是一致的,且偏移位移保持同步,从而能够有效保证环境温度发生变化仍可保持第一DMD芯片30与第二DMD芯片50投影图像的稳定重合,降低图像错位的风险。
参阅图11,本申请还提供一种投影设备200,该投影设备200包括机壳210以及与机壳210连接的如上述实施例所述的棱镜组件100,棱镜组件100设置在机壳210内。关于棱镜组件100的具体内容可参照上述实施例的描述,在此不再赘述。
以上所述仅为本申请的实施方式,并非因此限制本申请的专利范围,凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本申请的专利保护范围内。
Claims (10)
- 一种棱镜组件,其特征在于,包括:棱镜,所述棱镜为对称结构,包括第一棱镜面和第二棱镜面,所述第一棱镜面和所述第二棱镜面相对第一剖面对称;第一固定机构,与所述第一棱镜面对应设置,所述第一固定机构用于安装第一DMD芯片;以及第二固定机构,与所述第二棱镜面对应设置,所述第二固定机构用于安装第二DMD芯片,其中,所述第一DMD芯片和所述第二DMD芯片关于所述第一剖面对称。
- 根据权利要求1所述的棱镜组件,其特征在于,所述棱镜组件还包括:基座,所述棱镜设置在所述基座上;盖板,与所述基座相对设置,所述盖板盖设所述棱镜;所述第一固定机构分别连接所述基座和所述盖板,所述第二固定机构分别连接所述基座和所述盖板,所述第一固定机构与所述第二固定机构相邻。
- 根据权利要求1所述的棱镜组件,其特征在于,所述第一固定机构包括第一固定板、第一安装板以及第一固定件,所述第一固定件连接所述第一固定板和所述第一安装板,所述第一固定板连接所述基座和所述盖板,所述第一安装板用于安装所述第一DMD芯片,所述第二固定机构包括第二固定板、第二安装板以及第二固定件,所述第二固定件连接所述第二固定板和所述第二安装板,所述第二固定板连接所述基座和所述盖板,所述第二安装板用于安装所述第二DMD芯片。
- 根据权利要求3所述的棱镜组件,其特征在于,所述第一固定板和所述第二固定板厚度相同,所述第一安装板和所述第二安装板的厚度相同,所述第一固定板与所述第一安装板之间留有第一空隙,所述第二固定板与所述安装板之间留有第二空隙,所述第一空隙与所述第二空隙宽度相等,所述第一DMD芯片至所述第一棱镜面的距离与所述第二 DMD芯片至所述第二棱镜面的距离相等。
- 根据权利要求4所述的棱镜组件,其特征在于,所述第一固定板设有第一固定孔,所述第一安装板设有第二固定孔,所述第二固定孔为阶梯状,所述第一固定件包括第一固定杆和第一套环,所述第一固定杆穿设所述第一固定孔和所述第二固定孔,所述第一套环套入所述第一固定杆且贴在所述第一安装板的表面,其中,所述第二固定孔的孔径等于所述第一固定杆的直径,所述第一套环表面设有第一点胶区,所述第一点胶区用于填充固化胶以将所述第一固定件、所述第一固定板和所述第一安装板固定。所述第二固定板设有第三固定孔,所述第二安装板设有第四固定孔,所述第四固定孔为阶梯状,所述第二固定件包括第二固定杆和第二套环,所述第二固定杆穿设所述第三固定孔和所述第四固定孔,所述第二套环套入所述第二固定杆且贴在所述第二安装板的表面,其中,所述第四固定孔的孔径大于所述第二固定杆的直径以使所述第二安装板相对所述第二固定板的位置可调,所述第二套环表面设有第二点胶区,所述第二点胶区用于填充固化胶以将所述第二固定件、所述第二固定板和所述第二安装板固定。
- 根据权利要求1-5任一项所述的棱镜组件,其特征在于,所述基座和所述盖板对应所述第一固定板的侧面设有第一定位孔,所述基座和所述盖板对应所述第二固定板的侧面设有第二定位孔,所述第一固定板设有第三定位孔,所述第三定位孔位于相邻所述第一固定孔之间,所述第二固定板设有第四定位孔,所述第四定位孔位于相邻所述第三固定孔之间,第一长导向柱穿设所述第一定位孔和所述第三定位孔,以定位所述第一固定板于所述基座和所述盖板上,第二长导向柱穿设所述第二定位孔和所述第四定位孔,以定位所述第二固定板于所述基座和所述盖板上。
- 根据权利要求6所述的棱镜组件,其特征在于,所述基座朝向所述盖板的一侧设有第一粘接区,所述盖板朝向所述基座的一侧设有第二粘接区,所述第一固定板背离所述第一安装板的一侧设有第三粘接区, 所述第二固定板背离所述第二安装板的一侧设有第四粘接区,所述第一粘接区、所述第二粘接区、所述第三粘接区和所述第四粘接区用于放置胶质材料以粘接所述棱镜。
- 根据权利要求2所述的棱镜组件,其特征在于,所述棱镜组件还包括第一侧板和第二侧板,所述第一侧板连接所述基座和所述盖板,且与所述第一固定机构相对设置,所述第二侧板连接所述基座和所述盖板,且与所述第二固定机构相对设置,其中,所述基座、所述盖板、所述第一固定板、所述第二固定板、所述第一侧板和所述第二侧板围设成用以容置所述棱镜的空间,且朝向所述空间一侧的内表面涂有消光漆或者进行发黑处理。
- 根据权利要求8所述的棱镜组件,其特征在于,所述第一侧板与所述棱镜保持平行且留有第三空隙,所述第二侧板与所述棱镜保持平行且留有第四空隙。
- 一种投影设备,其特征在于,包括机壳以及与所述机壳连接的如权利要求1-9任意一项所述的棱镜组件,所述棱镜组件设置在所述机壳内。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910454884.0 | 2019-05-29 | ||
CN201910454884.0A CN112015039A (zh) | 2019-05-29 | 2019-05-29 | 棱镜组件及投影设备 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020238666A1 true WO2020238666A1 (zh) | 2020-12-03 |
Family
ID=73500689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/090763 WO2020238666A1 (zh) | 2019-05-29 | 2020-05-18 | 棱镜组件及投影设备 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN112015039A (zh) |
WO (1) | WO2020238666A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113075842B (zh) * | 2020-12-23 | 2022-03-29 | 深圳市安华光电技术有限公司 | 一种投影光机 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101034249A (zh) * | 2006-03-06 | 2007-09-12 | 精工爱普生株式会社 | 光学装置以及投影机 |
CN101046608A (zh) * | 2006-03-29 | 2007-10-03 | 富士能株式会社 | 电光元件的安装结构及投影型显示装置 |
CN101063795A (zh) * | 2006-04-24 | 2007-10-31 | 精工爱普生株式会社 | 光学装置及具备该光学装置的投影机 |
CN101165541A (zh) * | 2006-10-20 | 2008-04-23 | 台达电子工业股份有限公司 | 用于数字光处理投影装置的光处理结构 |
JP2009180793A (ja) * | 2008-01-29 | 2009-08-13 | Olympus Corp | 投影型表示装置 |
CN105204171A (zh) * | 2014-06-13 | 2015-12-30 | 深圳市绎立锐光科技开发有限公司 | 分光合光装置及投影光学*** |
US20180239230A1 (en) * | 2013-05-23 | 2018-08-23 | Texas Instruments Incorporated | Spatial light modulator image display projector apparatus with solid state illumination light sources |
CN210119657U (zh) * | 2019-05-29 | 2020-02-28 | 深圳光峰科技股份有限公司 | 棱镜组件及投影设备 |
-
2019
- 2019-05-29 CN CN201910454884.0A patent/CN112015039A/zh active Pending
-
2020
- 2020-05-18 WO PCT/CN2020/090763 patent/WO2020238666A1/zh active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101034249A (zh) * | 2006-03-06 | 2007-09-12 | 精工爱普生株式会社 | 光学装置以及投影机 |
CN101046608A (zh) * | 2006-03-29 | 2007-10-03 | 富士能株式会社 | 电光元件的安装结构及投影型显示装置 |
CN101063795A (zh) * | 2006-04-24 | 2007-10-31 | 精工爱普生株式会社 | 光学装置及具备该光学装置的投影机 |
CN101165541A (zh) * | 2006-10-20 | 2008-04-23 | 台达电子工业股份有限公司 | 用于数字光处理投影装置的光处理结构 |
JP2009180793A (ja) * | 2008-01-29 | 2009-08-13 | Olympus Corp | 投影型表示装置 |
US20180239230A1 (en) * | 2013-05-23 | 2018-08-23 | Texas Instruments Incorporated | Spatial light modulator image display projector apparatus with solid state illumination light sources |
CN105204171A (zh) * | 2014-06-13 | 2015-12-30 | 深圳市绎立锐光科技开发有限公司 | 分光合光装置及投影光学*** |
CN210119657U (zh) * | 2019-05-29 | 2020-02-28 | 深圳光峰科技股份有限公司 | 棱镜组件及投影设备 |
Also Published As
Publication number | Publication date |
---|---|
CN112015039A (zh) | 2020-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6375328B2 (en) | Optical modulation element and projector | |
JP2004527791A (ja) | 光学プリズムの位置決めのための方法および装置 | |
CN101373274B (zh) | 一种合光棱镜及其安装对位方法 | |
US6476986B2 (en) | Six-axis attachment apparatus and method for spatial light modulators | |
WO2020238666A1 (zh) | 棱镜组件及投影设备 | |
JP4055774B2 (ja) | プリズム構造体およびプロジェクタ | |
WO2020088081A1 (zh) | 背光模块及其制作方法、液晶显示装置 | |
US20220317345A1 (en) | Prism apparatus and projection device | |
CN210119657U (zh) | 棱镜组件及投影设备 | |
JP2004053970A (ja) | 光学ロッド、その製造方法、その製造治具、並びにそれを装備したプロジェクタ | |
US5236541A (en) | Joined prism assembly and method and apparatus for manufacturing same | |
US5221998A (en) | Joined prism assembly and method and apparatus for manufacturing same | |
CN100505893C (zh) | 光学装置及投影机 | |
CN211826681U (zh) | 棱镜组件以及投影仪 | |
WO2019127825A1 (zh) | 光学镜片安装结构 | |
WO2017161890A1 (zh) | 一种匀光装置和激光投影设备 | |
CN211348975U (zh) | 一种棱镜装置及投影设备 | |
CN103969925A (zh) | 图像投影设备和照明光学*** | |
JP2000321480A (ja) | プリズム装置及びプリズム装置の製造方法 | |
JP5516168B2 (ja) | プロジェクター | |
CN221039754U (zh) | 光机及投影机 | |
JP2006106410A (ja) | プロジェクタ | |
US6749305B1 (en) | Optical module and method for assembling the optical module | |
TW200921245A (en) | Liquid crystal display panel and a projector using the same | |
JP4736550B2 (ja) | 光学デバイス及びこれを用いた投射表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20814235 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20814235 Country of ref document: EP Kind code of ref document: A1 |