WO2020231148A1 - Antenna apparatus - Google Patents

Antenna apparatus Download PDF

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Publication number
WO2020231148A1
WO2020231148A1 PCT/KR2020/006226 KR2020006226W WO2020231148A1 WO 2020231148 A1 WO2020231148 A1 WO 2020231148A1 KR 2020006226 W KR2020006226 W KR 2020006226W WO 2020231148 A1 WO2020231148 A1 WO 2020231148A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
unit
substrate
installation space
main board
Prior art date
Application number
PCT/KR2020/006226
Other languages
French (fr)
Korean (ko)
Inventor
유창우
지교성
윤민선
김혜연
Original Assignee
주식회사 케이엠더블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020200012454A external-priority patent/KR102290036B1/en
Application filed by 주식회사 케이엠더블유 filed Critical 주식회사 케이엠더블유
Priority to EP20806278.6A priority Critical patent/EP3972052A4/en
Priority to CN202080035053.0A priority patent/CN114128047A/en
Priority to JP2021567805A priority patent/JP7285341B2/en
Publication of WO2020231148A1 publication Critical patent/WO2020231148A1/en
Priority to US17/522,917 priority patent/US20220069476A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/50—Feeding or matching arrangements for broad-band or multi-band operation

Definitions

  • the present invention relates to an antenna device (ANTENNA APPARATUS), and more particularly, to an antenna device capable of dual band formation capable of very simply dualizing a use band.
  • Wireless communication technology for example, MIMO (Multiple-Input Multiple-Output) technology
  • MIMO Multiple-Input Multiple-Output
  • a transmitter transmits different data through each transmission antenna.
  • the receiver it is a Spatial multiplexing technique that distinguishes transmission data through appropriate signal processing.
  • the channel capacity increases and more data can be transmitted.
  • a channel capacity of about 10 times is secured by using the same frequency band compared to the current single antenna system.
  • the number of transmitters and filters also increases.
  • a frequency band corresponding to a plurality of antennas installed in one antenna device corresponds to only one preset band (for example, either 3.5 GHz or 4.5 GHz band).
  • the antenna element is designed to be possible, there is a problem in that the entire antenna device must be replaced when changing to a different frequency band.
  • the present invention has been conceived to solve the above technical problem, and an object of the present invention is to provide an antenna device capable of applying a dual band of an available frequency band.
  • another object of the present invention is to provide an antenna device that is easy to change design from a preset frequency band to a different frequency band.
  • another object of the present invention is to provide an antenna device including an antenna transmitting/receiving module that can be partitioned for each module so as to expand the unit heat dissipation efficiency of a plurality of heating elements.
  • an inner space is formed so that the main board is embedded, a main housing provided with a plurality of radiating fins on an outer surface, and provided to shield the inner space of the main housing, and a plurality of A cover housing provided with a radiating fin, and a plurality of unit antenna blocks including detachably coupled to occupy a part of an outer surface of the cover housing, and having an antenna substrate in which at least one antenna element and at least one antenna filter are coupled therein, ,
  • the plurality of unit antenna blocks are signal-connected to the main board through at least one connecting card.
  • a mounting portion accommodating a portion of an end portion of each of the plurality of unit antenna blocks may be provided in a form in which some of the plurality of other side heat dissipation fins are removed.
  • a through slot through which the connecting card connected to each of the plurality of unit antenna blocks passes may be formed in the cover housing.
  • main board may be mounted such that calibration ports are respectively connected to the antenna elements of each of the plurality of unit antenna blocks.
  • the phase of the frequency band may be integrated calibration controlled by the main board.
  • each of the plurality of unit antenna blocks includes a first substrate installation space in which the antenna substrate is installed, and an antenna block body in which a second substrate installation space is provided toward the cover housing to be partitioned from the first substrate installation space, A pair of transmission/reception boards installed at one side and the other side of the second board installation space so as to be perpendicular to the main board, and a unit radome coupled to the antenna block body to cover the first board installation space may be further included.
  • each of the pair of transmission/reception boards is provided with a card slot port through which one end of the connecting card is pin-coupled, and the other end of the connecting card is provided with a second card slot port through which the other end of the connecting card is pin-coupled.
  • a card slot port through which one end of the connecting card is pin-coupled
  • the other end of the connecting card is provided with a second card slot port through which the other end of the connecting card is pin-coupled.
  • signal processing of the antenna elements of each of the plurality of unit antenna blocks may be integrated and controlled by the main board.
  • the antenna block body is provided on one side in the width direction and the other side in the width direction to shield the second substrate installation space, so as to radiate heat generated from the first substrate installation space and the second substrate installation space.
  • a pair of unit block heat sinks may be provided.
  • the pair of unit block heat sinks may extend parallel to one surface of the main board.
  • the antenna block body may further include at least one EMI shielding part disposed between the pair of transmission/reception boards to shield mutual EMI.
  • two transmitters (2T) and two receivers (2R) are mounted on each of the pair of transmission/reception boards, and eight or 16 antenna block bodies are connected to the main board, so that 32 transmitters (32T) and It may be possible to implement 32 receivers 32R or 64 transmitters 64T and 64 receivers 64R.
  • each of the plurality of unit antenna blocks further includes an antenna block body provided with a substrate installation space in which the antenna substrate and a single transmission/reception substrate are installed, and a unit radome coupled to the antenna block body to cover the substrate installation space. I can.
  • one card slot hole to which one end of the connecting card is pin-coupled may be provided, and on the main board, the other card slot hole to which the other end of the connecting card is pin-coupled may be provided.
  • a unit block heat sink for dissipating heat generated from the substrate installation space may be provided on a surface of the antenna block body facing the cover housing.
  • the unit block heat sink may extend perpendicularly to one surface of the main board.
  • a single EMI shielding unit disposed between the antenna substrate and the single transmission/reception substrate to shield mutual EMI may be further provided in the substrate installation space.
  • 4 transmitters 4T and 4 receivers 4R are mounted on the single transmission/reception board, and 8 or 16 antenna block bodies are connected to the main board to provide 32 transmitters 32T and 32 receivers. (32R) or 64 transmitters 64T and 64 receivers 64R may be implemented.
  • the antenna substrate and the single transmission/reception substrate may be stacked and disposed to be spaced apart from each other in the substrate installation space.
  • an antenna corresponding to a preset frequency band is provided so as to be selectively attached and detached for each module before setting of the usable frequency band, so that single-band or dual-band conversion has an easy effect.
  • FIG. 1 is a perspective view showing an antenna device according to an embodiment of the present invention
  • Figure 2 is a side view of Figure 1
  • Figure 3 is an exploded perspective view of Figure 1
  • FIG. 4 is a perspective view showing a unit antenna block in the configuration of FIG. 1,
  • Figure 5 is an exploded perspective view of Figure 4,
  • FIG. 6 is a cross-sectional view showing a connection relationship between the unit antenna block of FIG. 4 and the main board in the main housing,
  • FIG. 7 is a cross-sectional view of the other side showing a connection relationship between the unit antenna block of FIG. 4 and the main board in the main housing,
  • FIG. 8 is a perspective view showing an antenna device according to another embodiment of the present invention.
  • Figure 9 is a side view of Figure 8.
  • FIG. 10 is an exploded perspective view of FIG. 8,
  • FIG. 11 is a perspective view showing a unit antenna block in the configuration of FIG. 8,
  • FIG. 12 is an exploded perspective view of FIG. 11,
  • FIG. 13 is a side cross-sectional view showing a connection relationship between the unit antenna block of FIG. 11 and a main board in a main housing,
  • FIG. 14 is a cross-sectional view of the other side showing a connection relationship between the unit antenna block of FIG. 11 and a main board in a main housing.
  • antenna device 110 main housing
  • main board 112 PSU board
  • antenna block body 140 a plurality of unit antenna blocks 141: antenna block body
  • combination block 144a, 144b unit block heat sink
  • transceiver board 149 a pair of connecting cards
  • antenna board 151 antenna board
  • FIG. 1 is a perspective view showing an antenna device according to an embodiment of the present invention
  • FIG. 2 is a side view of FIG. 1
  • FIG. 3 is an exploded perspective view of FIG. 1
  • FIG. 4 is a unit antenna block in the configuration of FIG. Fig. 5 is an exploded perspective view of Fig. 4
  • Fig. 6 is a cross-sectional view showing a connection relationship between the unit antenna block of Fig. 4 and the main body
  • Fig. 7 is a connection relationship between the unit antenna block of Fig. 4 and the main body. It is the other side sectional view shown.
  • An embodiment 100 of the antenna device according to the present invention is configured to include a main housing 110, a cover housing 120, and a plurality of unit antenna blocks 140, as shown in FIGS. 1 to 7 do.
  • an inner space 116 is formed so that the main board 111 is embedded, and a plurality of radiating fins 114 may be provided on an outer surface of the main housing 110.
  • the main housing 110 is formed such that one surface is opened in a rectangular shape, and the inner space 116 may be shielded from the outside by coupling the cover housing 120.
  • the inner space 116 is sufficient if it has a thickness at which a printed circuit board and a PSU board 112 to be described later can be installed.
  • Heat generated from heat-generating elements not shown mounted on the printed circuit board is designed to radiate heat in the direction in which a plurality of radiating fins 114 are provided, and generated from a power supply unit (PSU) mounted on the PSU board 112. Heat may be designed to radiate heat in the direction in which the plurality of radiating fins 124 of the cover housing 120 are provided.
  • PSU power supply unit
  • the outer side of the main housing 110 on which the plurality of radiating fins 114 are provided is referred to as “rear or rear”, and the cover housing based on the main housing 110
  • the side on which the 120 and the plurality of unit antenna blocks 140 are provided will be referred to as "front or front” and described.
  • the main board 111 although not shown in detail in the drawings, is provided in the form of a printed circuit board (PCB) on which a calibration network is implemented, and installed on a plurality of unit antenna blocks 140 to be described in detail later. It serves as a control unit that enables power supply or signal control and calibration control of the antenna substrate 150 including RF elements and digital elements (not shown in the drawing) and a plurality of filters 153.
  • PCB printed circuit board
  • a digital processing circuit may be implemented, and a plurality of other card slots 115 for signally connecting to a plurality of unit antenna blocks 140 to be described in detail later may be provided on the front side. . This will be described in more detail later.
  • the front side of the main board 111 may be mounted so that the calibration ports 105 are respectively connected to the antenna elements 152 of a plurality of unit antenna blocks 140 to be described later.
  • the calibration port 105 may control a phase deviation caused by an antenna filter 153 and a feeder line to be described later.
  • One side of the main board 111 may be provided with a PSU board 112 on which a plurality of power supply units (PSUs) are mounted, as shown in FIG. 3.
  • the power supply unit of the PSU board 112 may be a power supply device for supplying power to each electronic component.
  • a plurality of heat dissipation fins 114 formed on the rear surface of the main housing 110 dissipate heat generated from electrical components, which are a number of heating elements mounted on the main board 111, from the inner space 116 to the outside (in particular, the main housing It may be provided so as to radiate heat to the rear side of 110) to prevent deterioration of electric field performance due to heat generation.
  • each of the plurality of radiating fins 114 formed on the rear surface of the main housing 110 is formed to be elongated in the vertical direction in consideration of the rising discharge of air due to heat when radiating to the outside so that air flows between the adjacent radiating fins 114 It may be provided to form a flow path.
  • the main housing 110 and the plurality of radiating fins 114 are made of a thermally conductive material for smooth heat dissipation, and a lightweight metal material to ensure ease of external installation. It is preferably provided with.
  • the cover housing 120 is coupled to the front end of the main housing 110 to shield the inner space 116 of the main housing 110, and has a plurality of Radiation fins 124 may be provided.
  • the cover housing 120 has an open surface of the main housing 110 (more specifically, a surface opposite to the side on which a plurality of radiating fins 124 are provided). Combined to shield.
  • the cover housing 120 may serve to protect the main board 111 and the PSU board 112 installed in the inner space 116 of the main housing 110 from the outside.
  • a plurality of radiating fins 124 may be provided on the outer surface of the cover housing 120.
  • the plurality of radiating fins 124 formed in the cover housing 120 are also formed to be elongated in the vertical direction in consideration of the rising and discharge of air due to heat when radiating to the outside, like the plurality of radiating fins 114 formed on the rear surface of the main housing 110 It is preferable that it is provided so as to form a flow path through which air flows between the adjacent radiating fins 124.
  • An antenna assembly 130 including a plurality of unit antenna blocks 140 may be installed on the outer surface of the cover housing 120.
  • the antenna assembly 130 may be provided as an assembly applied to at least 4 or more and 16 or less MIMO antenna devices.
  • the plurality of unit antenna blocks 140 are detachably coupled to occupy a part of the outer surface of the cover housing 120, as shown in FIGS. 3 to 7, and one or more antenna elements 152 therein.
  • at least one antenna filter 153 may be combined with the antenna substrate 150.
  • a unit antenna block to occupy part of the outer surface of the cover housing 120 (140) Eight can be firmly coupled using a fastening member (for example, fastening screws, etc.) not shown.
  • the plurality of unit antenna blocks 140 may be arranged side by side in 2 rows and 4 columns or 4 rows and 2 columns on the outer surface of the cover housing 120.
  • a mounting portion 121 accommodating a portion of each end portion of the plurality of unit antenna blocks 140 may be provided in a form in which a portion of the plurality of other side heat dissipation fins 124 is removed.
  • One end surface of the coupling block 143 of the unit antenna block 140 to be described later may be coupled to the mounting portion 121 formed on the cover housing 120 so as to be in close contact with each other.
  • the plurality of unit antenna blocks 140 may be provided to be signal-connected to the main board 111 through at least one connecting card 149.
  • a through slot 125 through which the connecting card 149 connected to each of the plurality of unit antenna blocks 140 passes may be further formed in the cover housing 120.
  • the at least one connecting card 149 is positioned to be protected from the outside by the coupling block 143 of the unit antenna block 140 to be described later, and is safely disposed through the through slot 125 without being exposed to the outside.
  • at least one connecting card 149 may be provided as a pair spaced apart a predetermined distance in the width direction.
  • a first substrate installation space 142a in which the antenna substrate 150 is installed is provided on the front side, and the first substrate installation space ( The antenna block body 141 provided with a second substrate installation space 142b on the rear side of which the cover housing 120 is provided to be partitioned from 142a, and the main board 111 on one side and the other side of the second substrate installation space 142b ), and a unit radome 160 coupled to the antenna block body 141 to cover the first substrate installation space 142a and a pair of transmission/reception substrates 148 installed to be orthogonal to each other.
  • the above various electronic components are placed in the inner space 116 of the main housing 110 and a plurality of unit antenna blocks 140.
  • the antenna device according to an embodiment of the present invention as shown in FIGS.
  • a plurality of radiating fins 114 on one side of the main housing 110 and a plurality of radiating heat of the other side of the cover housing 120 It is provided to exclusively dissipate heat generated from electric components, which are multiple heating elements mounted on the main board 111 provided in the inner space 116 of the main housing 110 through the pin 124, and a plurality of antennas
  • a plurality of unit antenna blocks 140 are spaced outward from the inner space 116 of the main housing 110 through a pair of unit block heat sinks 144a and 144b formed on the outer surface of each block 140. Heat generated from the antenna element 152 and the antenna filter 153 mounted therein may be exclusively provided to radiate heat.
  • the antenna block body 141 is a block body having a substantially T-shaped vertical cross-sectional appearance, as shown in FIGS. 4 to 7, and a position corresponding to the upper end (ie, front part) of a T-shaped shape in the drawing
  • a first substrate installation space 142a is provided in the.
  • a second substrate installation space 142b is provided at a position corresponding to a lower end portion (ie, rear portion) having a T-shaped shape in the drawing of the antenna block body 141.
  • the second substrate installation space 142b may be formed to penetrate in the left and right directions.
  • the second substrate installation space 142b formed to penetrate in the left and right direction may be shielded by an operation in which a pair of unit block heat sinks 144a and 144b to be described later are respectively coupled.
  • the first substrate installation space 142a may be formed in the form of a thin rectangular parallelepiped space that is approximately long in one side or the other side in the drawing and has a relatively small upper and lower height, and a second substrate is installed.
  • the space 142b may be formed in a shape of a rectangular parallelepiped space having a relatively long width and a relatively small width in one or the other direction and the vertical direction in the drawing.
  • the second substrate installation space 142b may be formed in communication to be opened to one side or the other side in the width direction, as described later.
  • the first substrate installation space 142a and the second substrate installation space 142b may be formed to communicate with each other through a communication port 145 as shown in FIG. 5.
  • a card installation hole 146 through which at least one connecting card 149 is installed may be formed in the second substrate installation space 142b.
  • the card installation hole 146 may be formed to penetrate the inside of the coupling block 143 formed to extend a predetermined length toward the cover housing 120 from the lower end of the T-shaped lower end of the antenna block body 141.
  • the coupling block 143 may be firmly matched and coupled to the mounting portion 121 formed on the cover housing 120 using a fastening member (not shown).
  • the antenna substrate 150 mounted on the first substrate installation space 142a includes an antenna board 151 and one or more antenna elements 152 installed on the outer surface of the antenna board 151 as shown in FIG. 5. And, it may include one or more antenna filters 153 (MBF, Micro Bellows Filter) installed on the inner surface of the antenna board 151.
  • MMF Micro Bellows Filter
  • a pair of transmission/reception boards 148 mounted in the second board installation space 142b may be installed to be spaced apart from each other in the width direction. At this time, the pair of transmission/reception boards 148 are disposed between each of the antenna block body 141 with at least one EMI shielding unit 147 interposed therebetween to shield mutual electromagnetic interference (EMI).
  • EMI mutual electromagnetic interference
  • One on the side and one on the other side of the antenna block body 141 may be disposed.
  • the EMI shielding part 147 includes one EMI shielding part 147 provided to shield EMI of one of the transmission/reception boards among the pair of transmission/reception boards 148, and the other transmission/reception board of the pair of transmission/reception boards 148 Including the other side EMI shielding part 147 provided to shield the EMI of, and one side EMI shielding part 147 and the other side EMI shielding part 147 may be located between a pair of transmission and reception boards 148.
  • the one side EMI shielding part 147 and the other side EMI shielding part 147 are vertically disposed adjacent to each other in the middle part of the second board installation space 142b, and the second side corresponding to the outside of the one side EMI shielding part 147
  • One side transmission/reception board 148 is disposed in the board installation space 142b, and the other side transmission/reception board 148 is disposed in the second board installation space 142b corresponding to the outside of the other side EMI shielding part 147.
  • pair of transmission/reception boards 148 are electrically connected to enable signal connection through the antenna board 151 and the communication port 145 previously installed in the first board installation space 142a.
  • the antenna block body 141 is provided to shield the second substrate installation space 142b on one side in the width direction and the other side in the width direction, respectively, and the first substrate installation space 142a and the second substrate installation space 142b
  • a pair of unit block heat sinks 144a and 144b for dissipating heat generated from the heat sink may be provided.
  • One (144a) of the pair of unit block heat sinks (144a, 144b) is coupled to the open side of the second substrate installation space (142b) to shield one side of the second substrate installation space (142b), and
  • the remaining one 144b of the unit block heat sinks 144a and 144b may be coupled to the other open side of the second substrate installation space 142b to shield the other side of the second substrate installation space 142b.
  • a plurality of radiating fins (not shown in the drawings) extending parallel to one surface of the main board 111 may be provided on the outer surfaces of the pair of unit block heat sinks 144a and 144b.
  • the plurality of radiating fins directly radiate heat collected in the space formed by the first substrate installation space 142a and the second substrate installation space 142b to the outside, thereby preventing performance degradation of the electronic component.
  • an embodiment 100 of the antenna device according to the present invention is a part of an electric component that is a heating element intensively installed in the inner space 116 of the conventional main housing 110 (that is, the antenna element 152, the antenna
  • the filter 153 and the transmitting/receiving board, etc.) are separately installed on the outside separated from the main housing 110, and heat dissipated by external heat dissipation through a pair of unit block heat sinks 144a and 144b for each unit antenna block 140 It can create an advantage that can further improve performance.
  • a plurality of unit antenna blocks 140 are provided to be detachably connected to the main board 111, which has not been implemented in a conventional antenna device. It provides the advantage of very easy to implement dual-band frequency band.
  • the frequency band corresponding to one or more antenna elements 152 and antenna filter 153 signal-connected to the main board 111 is initially set to 3.5 GHz, it can be changed to 4.5 GHz.
  • the antenna element 152 corresponding to the 4.5 GHz frequency band is changed And it is possible to implement a dual band and more bands by replacing and assembling only the unit antenna block 140 designed as the antenna filter 153.
  • the plurality of unit antenna blocks 140 may be signal-connected to the main board 111 through at least one connecting card 149. That is, in the embodiment 100 of the present invention, eight unit antenna blocks 140 are provided, and each of the eight unit antenna blocks 140 is configured to enable integrated signal control by the main board 111. Signal is connected to the board 111 through at least one connecting card 149.
  • a through slot 125 through which the connecting cards 149 connected to each of the plurality of unit antenna blocks 140 pass may be formed in the cover housing 120.
  • one card slot opening 148a to which one end of the connecting card 149 is pin-coupled is provided, and the other end of the connecting card 149 is provided on the main board 111
  • the other side card slot 115 to which the pin is coupled may be provided.
  • One card slot port 148a and the other card slot port 115 may be provided in a structure in which 120 pin terminals provided at both ends of the connecting card 149 are socket-coupled.
  • One of the connecting cards 149 is coupled to a transmission/reception board provided on one side of the pair of transmission/reception boards 148, and one of the pair of transmission/reception boards 148 is coupled to a transmission/reception board provided on the other side. Accordingly, the connecting cards 149 used in the antenna device 100 according to an embodiment of the present invention may be employed in two pieces provided to be spaced apart from each other in the width direction of the plurality of unit antenna blocks 140.
  • the antenna substrate 150 of each unit antenna block 140 is provided with a 4T4R antenna element 152 provided so that four transmitters 4T and four receivers 4R function, and a pair of transmission/reception
  • the substrate 148 may be mounted so that each of the above four transmitters and receivers 4T4R is divided into two (ie, 2T2R) to be separated.
  • the main board 111 may further include a calibration port 105 provided to be connected to the antenna elements 152 of each of the plurality of unit antenna blocks 140.
  • a plurality of unit antenna blocks 140 are separated from the main board 111, and the frequency band is connected to the calibration port 105.
  • the phase can be provided to be integrated calibration control.
  • FIG. 8 is a perspective view showing an antenna device according to another embodiment of the present invention
  • FIG. 9 is a side view of FIG. 8
  • FIG. 10 is an exploded perspective view of FIG. 8
  • FIG. 11 is a unit antenna block in the configuration of FIG. Fig. 12 is an exploded perspective view of Fig. 11
  • Fig. 13 is a side sectional view showing a connection relationship between the unit antenna block of Fig. 11 and a main board in the main housing
  • Fig. 14 is a unit antenna block and main housing of Fig. 11 It is the other side sectional view showing the connection relationship with the inner main board.
  • the transmission/reception board 148 is separated into two with respect to the antenna board 150 to provide functions of each transmitter and receiver.
  • the antenna substrate 250 and the transmission/reception board 248 are not divided according to the number of transmitters and receivers. would say.
  • the antenna device 200 according to another embodiment of the present invention, as shown in FIGS. 8 to 14, a plurality of unit antenna blocks 240, respectively, an antenna substrate 250 and a single transmission and reception An antenna block body 241 provided with a substrate installation space 242a on which the substrate 248 is installed, and a unit radome 260 coupled to the antenna block body 241 to cover the substrate installation space 242a. I can.
  • the first substrate installation space 142a and the second substrate installation space 142b in which the antenna substrate 150 is installed on the antenna block body 141 are separated
  • only a single board installation space 242a may be formed in the antenna block body 241 so that the antenna board 250 and the single transmission/reception board 248 are installed together.
  • the antenna board 250 and a single transmission/reception board Silver may be stacked and disposed in the vertical direction on the drawing.
  • the antenna substrate 150 is installed in the first substrate installation space 142a, but in the other embodiment 200, the antenna substrate ( Since both the 250 and the single transmission/reception board 248 are stacked and arranged to be spaced apart from each other by a predetermined distance, the upper and lower heights of the single board installation space 242a are set to be larger than in the case of the embodiment 100. desirable.
  • one end of the connecting card 149 is pin-coupled to one end of the card slot hole 148a is provided at the end of the pair of transmission and reception boards, but in the case of the other embodiment 200, There is a difference in that one card slot hole 248a to which one end of the connecting card 249 is pin-coupled is provided on the'one side (lower surface)' of the single transmission/reception board 248. That is, in another embodiment 200, as a result of being installed in the board installation space 242a in a structure in which a single transmission/reception board 248 is stacked with respect to the antenna board 250 parallel to the main board 211, 120 pins are combined.
  • the connecting card 149 is provided in a straight line by dividing two in a lengthwise direction in a single board installation space 242a, and a single card slot hole 248a is also provided so that each connecting card 149 is socket-coupled. It may be arranged in a straight line in the length direction of the substrate installation space 242a.
  • the antenna device 200 on the surface of the antenna block body 241 facing the cover housing 220, the substrate installation space 242a A unit block heat sink 244 for dissipating heat generated from) may be provided.
  • the unit block heat sink 244 may be provided with a plurality of heat dissipation fins (not shown in drawings) extending toward the main board 211. That is, the unit block heat sink 244 may be formed to extend orthogonal to one surface of the main board 211.
  • the antenna device 200 includes a single EMI shield 247 disposed between the antenna substrate 250 and the single transmission/reception board 248 to shield mutual EMI. It may be further provided in (242a).
  • the antenna block bodies 241 are connected to eight or sixteen, so that it is possible to implement 32 transmitters 32T and 32 receivers 32R, or 64 transmitters 64T and 64 receivers 64R. .
  • each of them is implemented to correspond to the functions of 2T2R in response to the antenna board 150 performing the function of 4T4R. Except for that point, even in the case of the other embodiment 200 of the present invention, only a single transmission/reception board 248 corresponding to the antenna substrate 250 performing the function of 4T4R is provided, thereby implementing the aforementioned 32T32R or 64T64R. I can.
  • FIGS. 8 to 14 Each of the structures and features of the configurations not described among the configurations of the antenna device 200 according to another embodiment of the present invention implemented in FIGS. 8 to 14 have the same structure and characteristics except for the above-described differences, It will be replaced with a description of the configurations of the antenna device 100 according to an embodiment of the present invention previously described with reference to FIGS. 1 to 7.
  • the antenna devices 100 and 200 include the antenna substrates 150 and 250 for each module from the main housings 110 and 210 provided with the main boards 111 and 211 in charge of integrated calibration control and integrated signal control. Since the transmission/reception boards 148 and 248 are separated and detachably provided, it is easy to change a frequency band selectively from a single band to a dual band, and a more reliable product can be manufactured through decentralization of heat dissipation.
  • the present invention provides an antenna device that can be partitioned for each module so that it is easy to apply a dual band of an available frequency band and change the design from a preset frequency band to a different frequency band, and to extend the unit heat dissipation efficiency of a plurality of heating elements. do.

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Abstract

The present invention relates to an antenna apparatus and, in particular, comprises: a main housing having an inner space formed therein so as to embed a main board and having a plurality of radiating fins provided on an outer surface thereof; a cover housing provided so as to shield the inner space of the main housing and having a plurality of radiating fins provided on an outer surface thereof; and a plurality of unit antenna blocks detachably coupled so as to occupy a portion of the outer surface of the cover housing, and having an antenna substrate embedded therein, the antenna substrate having one or more antenna elements and one or more antenna filters combined thereto, wherein the plurality of unit antenna blocks are signal-connected to the main board via at least one connecting card, thereby providing an advantage that dual banding can be realized as well as enabling effective heat dissipation.

Description

안테나 장치Antenna device
본 발명은 안테나 장치(ANTENNA APPARATUS)에 관한 것으로서, 보다 상세하게는, 사용 대역을 매우 간편하게 듀얼화 할 수 있는 듀얼 밴드화가 가능한 안테나 장치에 관한 것이다.The present invention relates to an antenna device (ANTENNA APPARATUS), and more particularly, to an antenna device capable of dual band formation capable of very simply dualizing a use band.
무선 통신 기술, 예를 들어, MIMO(Multiple-Input Multiple-Output) 기술은, 다수의 안테나를 사용하여 데이터 전송용량을 획기적으로 늘리는 기술로서, 송신기에서는 각각의 송신 안테나를 통해 서로 다른 데이터를 전송하고, 수신기에서는 적절한 신호처리를 통해 송신 데이터들을 구분해내는 Spatial multiplexing 기법이다.Wireless communication technology, for example, MIMO (Multiple-Input Multiple-Output) technology, is a technology that dramatically increases data transmission capacity by using multiple antennas. A transmitter transmits different data through each transmission antenna. , In the receiver, it is a Spatial multiplexing technique that distinguishes transmission data through appropriate signal processing.
따라서, 송수신 안테나의 개수를 동시에 증가시킴에 따라 채널 용량이 증가하여 보다 많은 데이터를 전송할 수 있게 한다. 예를 들어 안테나 수를 10개로 증가시키려면 현재의 단일 안테나 시스템에 비해 같은 주파수 대역을 사용하여 약 10배의 채널 용량을 확보하게 된다. 이와 같은 MIMO 기술이 적용된 송수신 장치의 경우, 안테나의 개수가 늘어남에 따라 송신기(Transmitter)와 필터(Filter)의 개수도 함께 증가하게 된다.Accordingly, as the number of transmit/receive antennas is simultaneously increased, the channel capacity increases and more data can be transmitted. For example, to increase the number of antennas to 10, a channel capacity of about 10 times is secured by using the same frequency band compared to the current single antenna system. In the case of a transceiver to which such MIMO technology is applied, as the number of antennas increases, the number of transmitters and filters also increases.
그런데, 종래의 MIMO 기술이 적용된 안테나 장치의 경우, 하나의 안테나 장치에 설치된 다수의 안테나에 대응되는 주파수 대역은 기설정된 하나의 대역(예를 들면, 3.5GHz 또는 4.5GHz 대역 중 어느 하나)에만 대응되도록 안테나 소자가 설계되어 있는 바, 상이한 주파수 대역으로의 변경 시 전체의 안테나 장치를 교체하여야 하는 문제점이 있다.However, in the case of an antenna device to which a conventional MIMO technology is applied, a frequency band corresponding to a plurality of antennas installed in one antenna device corresponds to only one preset band (for example, either 3.5 GHz or 4.5 GHz band). As the antenna element is designed to be possible, there is a problem in that the entire antenna device must be replaced when changing to a different frequency band.
본 발명은 상기한 기술적 과제를 해결하기 위하여 안출된 것으로서, 가용 주파수 대역의 듀얼 밴드화의 적용이 가능한 안테나 장치를 제공하는 것을 그 목적으로 한다.The present invention has been conceived to solve the above technical problem, and an object of the present invention is to provide an antenna device capable of applying a dual band of an available frequency band.
또한, 본 발명은, 기설정된 주파수 대역에서 상이한 주파수 대역으로의 변경 설계가 용이한 안테나 장치를 제공하는 것을 다른 목적으로 한다.In addition, another object of the present invention is to provide an antenna device that is easy to change design from a preset frequency band to a different frequency band.
아울러, 본 발명은, 다수의 발열 소자의 단위 방열 효율을 확장할 수 있도록 모듈별로 구획 설치 가능한 안테나 송수신 모듈을 포함하는 안테나 장치를 제공하는 것을 또 다른 목적으로 한다.In addition, another object of the present invention is to provide an antenna device including an antenna transmitting/receiving module that can be partitioned for each module so as to expand the unit heat dissipation efficiency of a plurality of heating elements.
본 발명에 따른 안테나 장치의 실시예는, 메인보드가 내장되도록 내부 공간이 형성되고, 외측면에 다수의 방열핀이 마련된 메인 하우징, 상기 메인 하우징의 내부 공간을 차폐하도록 구비되고, 외측면에 다수의 방열핀이 마련된 커버 하우징 및 상기 커버 하우징의 외측면 중 일부를 점하도록 착탈 가능하게 결합되고, 내부에 하나 이상의 안테나 소자 및 하나 이상의 안테나 필터가 결합된 안테나 기판이 내장된 다수의 단위 안테나 블록을 포함하고, 상기 다수의 단위 안테나 블록은, 적어도 하나의 커넥팅 카드를 매개로 상기 메인보드와 신호 연결된다.In an embodiment of the antenna device according to the present invention, an inner space is formed so that the main board is embedded, a main housing provided with a plurality of radiating fins on an outer surface, and provided to shield the inner space of the main housing, and a plurality of A cover housing provided with a radiating fin, and a plurality of unit antenna blocks including detachably coupled to occupy a part of an outer surface of the cover housing, and having an antenna substrate in which at least one antenna element and at least one antenna filter are coupled therein, , The plurality of unit antenna blocks are signal-connected to the main board through at least one connecting card.
여기서, 상기 커버 하우징에는, 상기 다수의 단위 안테나 블록 각각의 단부 일부가 수용되는 마운팅부가 상기 다수의 타측 방열 핀 일부가 제거된 형태로 마련될 수 있다.Here, in the cover housing, a mounting portion accommodating a portion of an end portion of each of the plurality of unit antenna blocks may be provided in a form in which some of the plurality of other side heat dissipation fins are removed.
또한, 상기 커버 하우징에는, 상기 다수의 단위 안테나 블록 각각에 연결된 상기 커넥팅 카드가 관통하는 관통 슬롯이 형성될 수 있다.In addition, a through slot through which the connecting card connected to each of the plurality of unit antenna blocks passes may be formed in the cover housing.
또한, 상기 메인보드에는, 상기 다수의 단위 안테나 블록 각각의 상기 안테나 소자에 캘리브레이션 포트가 각각 접속되도록 실장될 수 있다.In addition, the main board may be mounted such that calibration ports are respectively connected to the antenna elements of each of the plurality of unit antenna blocks.
또한, 상기 다수의 단위 안테나 블록 각각의 상기 안테나 소자는, 상기 메인보드에 의하여 주파수 대역의 위상이 통합 캘리브레이션 제어될 수 있다.In addition, in the antenna elements of each of the plurality of unit antenna blocks, the phase of the frequency band may be integrated calibration controlled by the main board.
또한, 상기 다수의 단위 안테나 블록은 각각, 상기 안테나 기판이 설치되는 제1기판 설치 공간이 마련되고, 상기 제1기판 설치 공간과 구획되게 상기 커버 하우징 측으로 제2기판 설치 공간이 마련된 안테나 블록 바디, 상기 제2기판 설치 공간의 일측 및 타측에 상기 메인보드와 직교되도록 설치되는 한 쌍의 송수신 기판 및 상기 제1기판 설치 공간을 커버링하도록 상기 안테나 블록 바디에 결합된 단위 레이돔을 더 포함할 수 있다.In addition, each of the plurality of unit antenna blocks includes a first substrate installation space in which the antenna substrate is installed, and an antenna block body in which a second substrate installation space is provided toward the cover housing to be partitioned from the first substrate installation space, A pair of transmission/reception boards installed at one side and the other side of the second board installation space so as to be perpendicular to the main board, and a unit radome coupled to the antenna block body to cover the first board installation space may be further included.
또한, 상기 한 쌍의 송수신 기판 각각의 단부에는, 상기 커넥팅 카드의 일단이 핀 결합되는 일측 카드 슬롯구가 마련되고, 상기 메인보드에는, 상기 커넥팅 카드의 타단이 핀 결합되는 타측 카드 슬롯구가 마련될 수 있다.In addition, one end of each of the pair of transmission/reception boards is provided with a card slot port through which one end of the connecting card is pin-coupled, and the other end of the connecting card is provided with a second card slot port through which the other end of the connecting card is pin-coupled. Can be.
또한, 상기 다수의 단위 안테나 블록 각각의 상기 안테나 소자는, 상기 메인보드에 의하여 신호 처리가 통합 제어될 수 있다.In addition, signal processing of the antenna elements of each of the plurality of unit antenna blocks may be integrated and controlled by the main board.
또한, 상기 안테나 블록 바디에는, 폭방향 일측과 폭방향 타측에 상기 제2기판 설치 공간을 차폐하도록 각각 구비되어, 상기 제1기판 설치 공간 및 상기 제2기판 설치 공간으로부터 발생한 열을 방열하기 위한 한 쌍의 단위블록 히트싱크가 구비될 수 있다.In addition, the antenna block body is provided on one side in the width direction and the other side in the width direction to shield the second substrate installation space, so as to radiate heat generated from the first substrate installation space and the second substrate installation space. A pair of unit block heat sinks may be provided.
또한, 상기 한 쌍의 단위블록 히트싱크는, 상기 메인보드의 일면에 대하여 평행되게 연장될 수 있다.In addition, the pair of unit block heat sinks may extend parallel to one surface of the main board.
또한, 상기 안테나 블록 바디에는, 상기 한 쌍의 송수신 기판 사이에 배치되어 상호간의 EMI를 차폐하는 적어도 하나의 EMI 차폐부가 상기 제2기판 설치 공간에 더 구비될 수 있다.In addition, the antenna block body may further include at least one EMI shielding part disposed between the pair of transmission/reception boards to shield mutual EMI.
또한, 상기 한 쌍의 송수신 기판 각각에는 2개의 송신기(2T)와 2개의 수신기(2R)가 실장되고, 상기 메인보드에는 상기 안테나 블록 바디가 8개 또는 16개 연결되어 32개의 송신기(32T)와 32개의 수신기(32R) 또는 64개의 송신기(64T)와 64개의 수신기(64R)의 구현이 가능할 수 있다.In addition, two transmitters (2T) and two receivers (2R) are mounted on each of the pair of transmission/reception boards, and eight or 16 antenna block bodies are connected to the main board, so that 32 transmitters (32T) and It may be possible to implement 32 receivers 32R or 64 transmitters 64T and 64 receivers 64R.
또한, 상기 다수의 단위 안테나 블록은 각각, 상기 안테나 기판 및 단일 송수신 기판이 설치되는 기판 설치 공간이 마련된 안테나 블록 바디 및 상기 기판 설치 공간을 커버링하도록 상기 안테나 블록 바디에 결합된 단위 레이돔을 더 포함할 수 있다.In addition, each of the plurality of unit antenna blocks further includes an antenna block body provided with a substrate installation space in which the antenna substrate and a single transmission/reception substrate are installed, and a unit radome coupled to the antenna block body to cover the substrate installation space. I can.
또한, 상기 단일 송수신 기판의 일면에는, 상기 커넥팅 카드의 일단이 핀 결합되는 일측 카드 슬롯구가 마련되고, 상기 메인보드에는, 상기 커넥팅 카드의 타단이 핀 결합되는 타측 카드 슬롯구가 마련될 수 있다.In addition, on one surface of the single transmission/reception board, one card slot hole to which one end of the connecting card is pin-coupled may be provided, and on the main board, the other card slot hole to which the other end of the connecting card is pin-coupled may be provided. .
또한, 상기 안테나 블록 바디 중 상기 커버 하우징을 향하는 면에는, 상기 기판 설치 공간으로부터 발생한 열을 방열하기 위한 단위블록 히트싱크가 구비될 수 있다.In addition, a unit block heat sink for dissipating heat generated from the substrate installation space may be provided on a surface of the antenna block body facing the cover housing.
또한, 상기 단위블록 히트싱크는, 상기 메인보드의 일면에 대하여 직교되게 연장될 수 있다.In addition, the unit block heat sink may extend perpendicularly to one surface of the main board.
또한, 상기 안테나 블록 바디에는, 상기 안테나 기판과 상기 단일 송수신 기판 사이에 배치되어 상호간의 EMI를 차폐하는 단일 EMI 차폐부가 상기 기판 설치 공간에 더 구비될 수 있다.In addition, in the antenna block body, a single EMI shielding unit disposed between the antenna substrate and the single transmission/reception substrate to shield mutual EMI may be further provided in the substrate installation space.
또한, 상기 단일 송수신 기판에는 4개의 송신기(4T)와 4개의 수신기(4R)가 실장되고, 상기 메인보드에는 상기 안테나 블록 바디가 8개 또는 16개 연결되어 32개의 송신기(32T)와 32개의 수신기(32R) 또는 64개의 송신기(64T)와 64개의 수신기(64R)의 구현이 가능할 수 있다.In addition, 4 transmitters 4T and 4 receivers 4R are mounted on the single transmission/reception board, and 8 or 16 antenna block bodies are connected to the main board to provide 32 transmitters 32T and 32 receivers. (32R) or 64 transmitters 64T and 64 receivers 64R may be implemented.
또한, 상기 안테나 기판 및 단일 송수신 기판은, 각각 상기 기판 설치 공간에 소정간격 이격되도록 적층 배치될 수 있다.In addition, the antenna substrate and the single transmission/reception substrate may be stacked and disposed to be spaced apart from each other in the substrate installation space.
본 발명에 따른 안테나 장치의 일 실시예에 따르면 다음과 같은 다양한 효과를 달성할 수 있다.According to an embodiment of the antenna device according to the present invention, various effects as follows can be achieved.
첫째, 가용 주파수 대역의 설정 전 미리 기설정된 주파수 대역에 대응하는 안테나를 모듈별로 선택적 착탈이 가능하도록 구비되어 싱글 밴드 또는 듀얼 밴드화의 전용이 손쉬운 효과를 가진다.First, an antenna corresponding to a preset frequency band is provided so as to be selectively attached and detached for each module before setting of the usable frequency band, so that single-band or dual-band conversion has an easy effect.
둘째, 다수의 발열 소자인 전장부품 중 일부를 메인보드(BB Board)로부터 분리하여 모듈화 장착함으로써 단위 방열 효율을 향상시킬 수 있는 효과를 가진다.Second, it has the effect of improving unit heat dissipation efficiency by separating some of the electrical components, which are multiple heating elements, from the main board (BB Board) and mounting them in a modular manner.
도 1은 본 발명의 일 실시예에 따른 안테나 장치를 나타낸 사시도이고,1 is a perspective view showing an antenna device according to an embodiment of the present invention,
도 2는 도 1의 측면도이며,Figure 2 is a side view of Figure 1,
도 3은 도 1의 분해 사시도이고,Figure 3 is an exploded perspective view of Figure 1,
도 4는 도 1의 구성 중 단위 안테나 블록을 나타낸 사시도이며,4 is a perspective view showing a unit antenna block in the configuration of FIG. 1,
도 5는 도 4의 분해 사시도이고,Figure 5 is an exploded perspective view of Figure 4,
도 6은 도 4의 단위 안테나 블록과 메인 하우징 내의 메인보드와의 연결 관계를 나타낸 일측 단면도이며,6 is a cross-sectional view showing a connection relationship between the unit antenna block of FIG. 4 and the main board in the main housing,
도 7은 도 4의 단위 안테나 블록과 메인 하우징 내의 메인보드와의 연결 관계를 나타낸 타측 단면도이고,7 is a cross-sectional view of the other side showing a connection relationship between the unit antenna block of FIG. 4 and the main board in the main housing,
도 8은 본 발명의 다른 실시예에 따른 안테나 장치를 나타낸 사시도이고,8 is a perspective view showing an antenna device according to another embodiment of the present invention,
도 9는 도 8의 측면도이며,Figure 9 is a side view of Figure 8,
도 10은 도 8의 분해 사시도이고,10 is an exploded perspective view of FIG. 8,
도 11은 도 8의 구성 중 단위 안테나 블록을 나타낸 사시도이며,11 is a perspective view showing a unit antenna block in the configuration of FIG. 8,
도 12는 도 11의 분해 사시도이고,12 is an exploded perspective view of FIG. 11,
도 13은 도 11의 단위 안테나 블록과 메인 하우징 내의 메인보드와의 연결 관계를 나타낸 일측 단면도이며,13 is a side cross-sectional view showing a connection relationship between the unit antenna block of FIG. 11 and a main board in a main housing,
도 14는 도 11의 단위 안테나 블록과 메인 하우징 내의 메인보드와의 연결 관계를 나타낸 타측 단면도이다.14 is a cross-sectional view of the other side showing a connection relationship between the unit antenna block of FIG. 11 and a main board in a main housing.
<부호의 설명> <Explanation of code>
100,200: 안테나 장치 110: 메인 하우징100,200: antenna device 110: main housing
111: 메인보드 112: PSU 보드111: main board 112: PSU board
114: 방열 핀 115: 타측 카드 슬롯구114: heat dissipation pin 115: other side card slot
116: 내부 공간 120: 커버 하우징116: inner space 120: cover housing
121: 마운팅부 124: 방열 핀121: mounting portion 124: radiating fin
125: 관통 슬롯 130: 안테나 어셈블리125: through slot 130: antenna assembly
140: 다수의 단위 안테나 블록 141: 안테나 블록 바디140: a plurality of unit antenna blocks 141: antenna block body
142a: 제1기판 설치 공간 142b: 제2기판 설치 공간142a: space for installing the first substrate 142b: space for installing the second substrate
143: 결합 블록 144a,144b: 단위블록 히트싱크143: combination block 144a, 144b: unit block heat sink
145: 연통구 147: EMI 차폐부145: communication port 147: EMI shield
148: 송수신 기판 149: 한 쌍의 커넥팅 카드148: transceiver board 149: a pair of connecting cards
150: 안테나 기판 151: 안테나 보드150: antenna board 151: antenna board
152: 안테나 소자 153: 안테나 필터152: antenna element 153: antenna filter
160: 단일 레이돔160: single radome
이하, 본 발명에 따른 안테나 장치의 실시예들을 첨부된 도면을 참조하여 상세하게 설명하기로 한다. 각 도면의 구성요소들에 참조부호를 부가함에 있어서, 동일한 구성 요소들에 대해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 부호를 가지도록 하고 있음에 유의해야 한다. 또한, 본 발명의 실시예를 설명함에 있어, 관련된 공지 구성 또는 기능에 대한 구체적인 설명이 본 발명의 실시예에 대한 이해를 방해한다고 판단되는 경우에는 그 상세한 설명은 생략한다.Hereinafter, embodiments of an antenna device according to the present invention will be described in detail with reference to the accompanying drawings. In adding reference numerals to elements of each drawing, it should be noted that the same elements are to have the same numerals as possible even if they are indicated on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function obstructs an understanding of the embodiment of the present invention, a detailed description thereof will be omitted.
본 발명의 실시예의 구성 요소를 설명하는 데 있어서, 제1, 제2, A, B, (a), (b) 등의 용어를 사용할 수 있다. 이러한 용어는 그 구성 요소를 다른 구성 요소와 구별하기 위한 것일 뿐, 그 용어에 의해 해당 구성 요소의 본질이나 차례 또는 순서 등이 한정되지 않는다. 또한, 다르게 정의되지 않는 한, 기술적이거나 과학적인 용어를 포함해서 여기서 사용되는 모든 용어들은 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 일반적으로 이해되는 것과 동일한 의미를 가진다. 일반적으로 사용되는 사전에 정의되어 있는 것과 같은 용어들은 관련 기술의 문맥상 가지는 의미와 일치하는 의미를 가진 것으로 해석되어야 하며, 본 출원에서 명백하게 정의하지 않는 한, 이상적이거나 과도하게 형식적인 의미로 해석되지 않는다.In describing the constituent elements of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), and the like may be used. These terms are only used to distinguish the component from other components, and the nature, order, or order of the component is not limited by the term. In addition, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.
도 1은 본 발명의 일 실시예에 따른 안테나 장치를 나타낸 사시도이고, 도 2는 도 1의 측면도이며, 도 3은 도 1의 분해 사시도이고, 도 4는 도 1의 구성 중 단위 안테나 블록을 나타낸 사시도이며, 도 5는 도 4의 분해 사시도이고, 도 6은 도 4의 단위 안테나 블록과 메인 바디의 연결 관계를 나타낸 일측 단면도이며, 도 7은 도 4의 단위 안테나 블록과 메인 바디의 연결 관계를 나타낸 타측 단면도이다.1 is a perspective view showing an antenna device according to an embodiment of the present invention, FIG. 2 is a side view of FIG. 1, FIG. 3 is an exploded perspective view of FIG. 1, and FIG. 4 is a unit antenna block in the configuration of FIG. Fig. 5 is an exploded perspective view of Fig. 4, Fig. 6 is a cross-sectional view showing a connection relationship between the unit antenna block of Fig. 4 and the main body, and Fig. 7 is a connection relationship between the unit antenna block of Fig. 4 and the main body. It is the other side sectional view shown.
본 발명에 따른 안테나 장치의 일 실시예(100)는, 도 1 내지 도 7에 참조된 바와 같이, 메인 하우징(110)과 커버 하우징(120) 및 다수의 단위 안테나 블록(140)을 포함하도록 구성된다.An embodiment 100 of the antenna device according to the present invention is configured to include a main housing 110, a cover housing 120, and a plurality of unit antenna blocks 140, as shown in FIGS. 1 to 7 do.
메인 하우징(110)은, 메인보드(111)가 내장되도록 내부 공간(116)이 형성되고, 외측면에 다수의 방열핀(114)이 마련될 수 있다. 여기서, 메인 하우징(110)은 일면이 장방형으로 개구되게 형성되고, 커버 하우징(120)이 결합됨으로써 내부 공간(116)이 외부와 차폐될 수 있다. 내부 공간(116)은, 후술하는 인쇄회로기판과 PSU 보드(112)가 설치될 수 있는 두께를 가지면 충분하다. 인쇄회로기판에 실장된 미도시의 발열소자들로부터 발생된 열은 다수의 방열핀(114)이 구비된 방향으로 방열되도록 설계되고, PSU 보드(112)에 실장된 파워 서플라이 유닛(PSU)으로부터 발생된 열은 커버 하우징(120)의 다수의 방열핀(124)이 구비된 방향으로 방열되도록 설계될 수 있다.In the main housing 110, an inner space 116 is formed so that the main board 111 is embedded, and a plurality of radiating fins 114 may be provided on an outer surface of the main housing 110. Here, the main housing 110 is formed such that one surface is opened in a rectangular shape, and the inner space 116 may be shielded from the outside by coupling the cover housing 120. The inner space 116 is sufficient if it has a thickness at which a printed circuit board and a PSU board 112 to be described later can be installed. Heat generated from heat-generating elements not shown mounted on the printed circuit board is designed to radiate heat in the direction in which a plurality of radiating fins 114 are provided, and generated from a power supply unit (PSU) mounted on the PSU board 112. Heat may be designed to radiate heat in the direction in which the plurality of radiating fins 124 of the cover housing 120 are provided.
이하에서는, 이해의 혼선을 방지하기 위하여, 메인 하우징(110)을 기준으로 다수의 방열핀(114)이 구비된 외측면 측을 "후방 또는 배면"이라 칭하고, 메인 하우징(110)을 기준으로 커버 하우징(120) 및 다수의 단위 안테나 블록(140)이 구비된 측을 "전방 또는 전면"이라 칭하여 설명하기로 한다.Hereinafter, in order to prevent confusion of understanding, the outer side of the main housing 110 on which the plurality of radiating fins 114 are provided is referred to as “rear or rear”, and the cover housing based on the main housing 110 The side on which the 120 and the plurality of unit antenna blocks 140 are provided will be referred to as "front or front" and described.
메인보드(111)는, 도면으로 상세하게 도시되지 않았으나, 캘리브레이션 네트워크가 구현된 인쇄회로기판(Printed Circuit Board : PCB) 형태로 구비되고, 뒤에 상세하게 설명할 다수의 단위 안테나 블록(140)에 설치된 RF 소자들 및 디지털 소자들(도면부호 미표기)과, 다수의 필터(153)들로 구비된 안테나 기판(150)의 급전 또는 신호 제어 및 캘리브레이션 제어가 가능하도록 하는 제어부 역할을 수행한다.The main board 111, although not shown in detail in the drawings, is provided in the form of a printed circuit board (PCB) on which a calibration network is implemented, and installed on a plurality of unit antenna blocks 140 to be described in detail later. It serves as a control unit that enables power supply or signal control and calibration control of the antenna substrate 150 including RF elements and digital elements (not shown in the drawing) and a plurality of filters 153.
메인보드(111)에는, 디지털 프로세싱 회로가 구현되고, 뒤에 상세하게 설명할 다수의 단위 안테나 블록(140)과 신호적으로 연결하기 위한 다수의 타측 카드 슬롯구(115)가 전면에 마련될 수 있다. 이에 대해서는 뒤에 보다 상세하게 설명하기로 한다.In the main board 111, a digital processing circuit may be implemented, and a plurality of other card slots 115 for signally connecting to a plurality of unit antenna blocks 140 to be described in detail later may be provided on the front side. . This will be described in more detail later.
아울러, 메인보드(111)의 전면에는, 후술하는 다수의 단위 안테나 블록(140) 각각의 안테나 소자(152)에 캘리브레이션 포트(105)가 각각 접속되도록 실장될 수 있다. 캘리브레이션 포트(105)는, 후술하는 안테나 필터(153)와 피더 라인으로 인해 발생하는 위상 편차를 제어할 수 있다.In addition, the front side of the main board 111 may be mounted so that the calibration ports 105 are respectively connected to the antenna elements 152 of a plurality of unit antenna blocks 140 to be described later. The calibration port 105 may control a phase deviation caused by an antenna filter 153 and a feeder line to be described later.
메인보드(111)의 일측, 즉 커버 하우징(120)과의 사이에는, 도 3에 참조된 바와 같이, 다수의 파워 서플라이 유닛(PSU)이 실장된 PSU 보드(112)가 구비될 수 있다. PSU 보드(112)의 파워 서플라이 유닛은, 각 전장부품으로 전원을 공급하기 위한 전원 공급 장치일 수 있다.One side of the main board 111, that is, between the cover housing 120 and the cover housing 120, may be provided with a PSU board 112 on which a plurality of power supply units (PSUs) are mounted, as shown in FIG. 3. The power supply unit of the PSU board 112 may be a power supply device for supplying power to each electronic component.
메인 하우징(110)의 배면에 형성된 다수의 방열핀(114)은, 메인보드(111)에 실장된 다수의 발열소자인 전장부품들로부터 생성된 열을 내부 공간(116)으로부터 외부(특히, 메인 하우징(110)의 후방측)로 방열하여 발열에 의한 전장성능의 저하를 방지하도록 구비될 수 있다.A plurality of heat dissipation fins 114 formed on the rear surface of the main housing 110 dissipate heat generated from electrical components, which are a number of heating elements mounted on the main board 111, from the inner space 116 to the outside (in particular, the main housing It may be provided so as to radiate heat to the rear side of 110) to prevent deterioration of electric field performance due to heat generation.
여기서, 메인 하우징(110)의 배면에 형성된 다수의 방열핀(114) 각각은, 외부로 방열시 열에 따른 공기의 상승 배출을 고려하여 상하 방향으로 길게 형성되어 인접하는 방열핀(114) 사이로 공기가 유동되는 유로가 형성되도록 구비될 수 있다.Here, each of the plurality of radiating fins 114 formed on the rear surface of the main housing 110 is formed to be elongated in the vertical direction in consideration of the rising discharge of air due to heat when radiating to the outside so that air flows between the adjacent radiating fins 114 It may be provided to form a flow path.
또한, 다수의 방열핀(114)은, 원활한 방열을 위해 메인 하우징(110)과 다수의 방열핀(114)은 열전도성 재질로 구비되는 것이 바람직하고, 외부 설치에 대한 용이성을 확보하기 위해 경량의 금속 재질로 구비됨이 바람직하다.In addition, for the plurality of radiating fins 114, it is preferable that the main housing 110 and the plurality of radiating fins 114 are made of a thermally conductive material for smooth heat dissipation, and a lightweight metal material to ensure ease of external installation. It is preferably provided with.
한편, 커버 하우징(120)은, 도 3에 참조된 바와 같이, 메인 하우징(110)의 전단부에 결합되어 메인 하우징(110)의 내부 공간(116)을 차폐하도록 구비되고, 외측면에 다수의 방열핀(124)이 마련될 수 있다.Meanwhile, as shown in FIG. 3, the cover housing 120 is coupled to the front end of the main housing 110 to shield the inner space 116 of the main housing 110, and has a plurality of Radiation fins 124 may be provided.
보다 상세하게는, 커버 하우징(120)은, 도 3에 참조된 바와 같이, 메인 하우징(110)의 개구된 일면(보다 상세하게는, 다수의 방열핀(124)이 구비된 측의 반대면)을 차폐하도록 결합된다. 커버 하우징(120)은, 메인 하우징(110)의 내부 공간(116)에 설치된 메인보드(111) 및 PSU 보드(112)를 외부로부터 보호하는 역할을 수행할 수 있다.In more detail, the cover housing 120, as shown in FIG. 3, has an open surface of the main housing 110 (more specifically, a surface opposite to the side on which a plurality of radiating fins 124 are provided). Combined to shield. The cover housing 120 may serve to protect the main board 111 and the PSU board 112 installed in the inner space 116 of the main housing 110 from the outside.
아울러, 커버 하우징(120)의 외측면에는 상술한 바와 같이, 다수의 방열핀(124)이 마련될 수 있다. 다수의 방열핀(124)은, 메인 하우징(110)의 외측면에 형성된 다수의 방열핀(114)과 함께 메인 하우징(110)의 내부 공간(116)에 집열된 열을 외부로 방열하는 역할을 수행한다.In addition, as described above, a plurality of radiating fins 124 may be provided on the outer surface of the cover housing 120. The plurality of radiating fins 124, together with the plurality of radiating fins 114 formed on the outer surface of the main housing 110, serve to radiate heat collected in the inner space 116 of the main housing 110 to the outside. .
커버 하우징(120)에 형성된 다수의 방열핀(124) 또한, 메인 하우징(110)의 배면에 형성된 다수의 방열핀(114)과 마찬가지로 외부로 방열시 열에 따른 공기의 상승 배출을 고려하여 상하 방향으로 길게 형성되어 인접하는 방열핀(124) 사이로 공기가 유동되는 유로가 형성되도록 구비되는 것이 바람직하다.The plurality of radiating fins 124 formed in the cover housing 120 are also formed to be elongated in the vertical direction in consideration of the rising and discharge of air due to heat when radiating to the outside, like the plurality of radiating fins 114 formed on the rear surface of the main housing 110 It is preferable that it is provided so as to form a flow path through which air flows between the adjacent radiating fins 124.
이와 같은 커버 하우징(120)의 외측면에는, 다수의 단위 안테나 블록(140)으로 구비된 안테나 어셈블리(130)가 설치될 수 있다. 안테나 어셈블리(130)는 적어도 4개 이상 16개 이하의 MIMO 안테나 장치에 적용되는 조립체로 구비될 수 있다.An antenna assembly 130 including a plurality of unit antenna blocks 140 may be installed on the outer surface of the cover housing 120. The antenna assembly 130 may be provided as an assembly applied to at least 4 or more and 16 or less MIMO antenna devices.
한편, 다수의 단위 안테나 블록(140)은, 도 3 내지 도 7에 참조된 바와 같이, 커버 하우징(120)의 외측면 중 일부를 점하도록 착탈 가능하게 결합되고, 내부에 하나 이상의 안테나 소자(152) 및 하나 이상의 안테나 필터(153)가 결합된 안테나 기판(150)이 내장될 수 있다.Meanwhile, the plurality of unit antenna blocks 140 are detachably coupled to occupy a part of the outer surface of the cover housing 120, as shown in FIGS. 3 to 7, and one or more antenna elements 152 therein. ) And at least one antenna filter 153 may be combined with the antenna substrate 150.
보다 상세하게는, 커버 하우징(120)의 외측면이 소정 넓이를 가지도록 구비된 것으로 가정할 경우, 도 3에 참조된 바와 같이, 커버 하우징(120)의 외측면 중 일부를 점하도록 단위 안테나 블록(140) 8개가 미도시의 체결부재(예를 들면 체결 나사 등)를 이용하여 견고하게 결합될 수 있다. 가령, 다수의 단위 안테나 블록(140)은, 커버 하우징(120)의 외측면에 2행 4열 또는 4행 2열로 나란하게 배치될 수 있다.In more detail, assuming that the outer surface of the cover housing 120 is provided to have a predetermined width, as shown in FIG. 3, a unit antenna block to occupy part of the outer surface of the cover housing 120 (140) Eight can be firmly coupled using a fastening member (for example, fastening screws, etc.) not shown. For example, the plurality of unit antenna blocks 140 may be arranged side by side in 2 rows and 4 columns or 4 rows and 2 columns on the outer surface of the cover housing 120.
여기서, 커버 하우징(120)에는, 다수의 단위 안테나 블록(140) 각각의 단부 일부가 수용되는 마운팅부(121)가 다수의 타측 방열 핀(124) 일부가 제거된 형태로 마련될 수 있다. 커버 하우징(120)에 형성된 마운팅부(121)에는 후술하는 단위 안테나 블록(140)의 결합 블록(143)의 일단면이 밀착되도록 결합될 수 있다.Here, in the cover housing 120, a mounting portion 121 accommodating a portion of each end portion of the plurality of unit antenna blocks 140 may be provided in a form in which a portion of the plurality of other side heat dissipation fins 124 is removed. One end surface of the coupling block 143 of the unit antenna block 140 to be described later may be coupled to the mounting portion 121 formed on the cover housing 120 so as to be in close contact with each other.
이와 같은, 다수의 단위 안테나 블록(140)은, 적어도 하나의 커넥팅 카드(149)를 매개로 메인보드(111)와 신호 연결되도록 구비될 수 있다. 이를 위해, 커버 하우징(120)에는, 다수의 단위 안테나 블록(140) 각각에 연결된 커넥팅 카드(149)가 관통하는 관통 슬롯(125)이 추가로 더 형성될 수 있다. 이때, 적어도 하나의 커넥팅 카드(149)는, 후술하는 단위 안테나 블록(140)의 결합 블록(143)에 의하여 외부로부터 보호받도록 위치되는 바, 외부로 노출되지 않고 안전하게 관통 슬롯(125)을 통하여 배치될 수 있다. 본 발명의 일 실시예에 따른 안테나 장치에서는, 적어도 하나의 커넥팅 카드(149)는, 폭 방향으로 소정거리 이격된 한 쌍으로 구비될 수 있다.As such, the plurality of unit antenna blocks 140 may be provided to be signal-connected to the main board 111 through at least one connecting card 149. To this end, a through slot 125 through which the connecting card 149 connected to each of the plurality of unit antenna blocks 140 passes may be further formed in the cover housing 120. At this time, the at least one connecting card 149 is positioned to be protected from the outside by the coupling block 143 of the unit antenna block 140 to be described later, and is safely disposed through the through slot 125 without being exposed to the outside. Can be. In the antenna device according to an embodiment of the present invention, at least one connecting card 149 may be provided as a pair spaced apart a predetermined distance in the width direction.
다수의 단위 안테나 블록(140)은, 도 4 내지 도 7에 참조된 바와 같이, 안테나 기판(150)이 설치되는 제1기판 설치 공간(142a)이 전방 측에 마련되고, 제1기판 설치 공간(142a)과 구획되게 커버 하우징(120)이 구비된 후방 측으로 제2기판 설치 공간(142b)이 마련된 안테나 블록 바디(141)와, 제2기판 설치 공간(142b)의 일측 및 타측에 메인보드(111)와 직교되도록 설치되는 한 쌍의 송수신 기판(148)과, 제1기판 설치 공간(142a)을 커버링하도록 안테나 블록 바디(141)에 결합된 단위 레이돔(160)을 더 포함할 수 있다.In the plurality of unit antenna blocks 140, as shown in FIGS. 4 to 7, a first substrate installation space 142a in which the antenna substrate 150 is installed is provided on the front side, and the first substrate installation space ( The antenna block body 141 provided with a second substrate installation space 142b on the rear side of which the cover housing 120 is provided to be partitioned from 142a, and the main board 111 on one side and the other side of the second substrate installation space 142b ), and a unit radome 160 coupled to the antenna block body 141 to cover the first substrate installation space 142a and a pair of transmission/reception substrates 148 installed to be orthogonal to each other.
이미 공지된 종래의 MIMO 안테나 장치의 대부분(대표적으로, 대한민국 등록특허 제10-1854309호(2018.05.03.공고)은, 하나의 내부 공간을 가지는 메인 하우징 내부에 메인보드, PSU 보드, 안테나 기판 및 후술하는 송수신 기판이 적층되게 구비되고, 하나의 레이돔을 이용하여 메인 하우징을 차폐하도록 구비된 것이 개시되어 있다. 그러나, 이와 같은 종래의 MIMO 안테나 장치의 일예는, 메인 하우징의 내부 공간이라는 한정된 공간에 다수의 발열소자인 전장부품이 집약 설치된 결과 그 방열에 한계가 있는 문제점이 있었다.Most of the known conventional MIMO antenna devices (typically, Korean Patent Registration No. 10-1854309 (announced on May 3, 2018), has a main board, a PSU board, an antenna board, and a main housing inside a main housing having one internal space. It is disclosed that a transmission/reception board to be described later is stacked and provided to shield a main housing using a single radome However, an example of such a conventional MIMO antenna device is in a limited space called an internal space of the main housing. As a result of intensive installation of electrical components, which are a number of heating elements, there is a problem in that heat dissipation is limited.
본 발명의 실시예들에 따른 안테나 장치는, 상술한 종래의 문제점을 능동적으로 해결하기 위하여, 위 다양한 전장부품을 메인 하우징(110)의 내부 공간(116)과 다수의 단위 안테나 블록(140)에 분리하여 분산 배치하는 구조를 제안한다. 요컨대, 본 발명의 일 실시예에 따른 안테나 장치는, 도 1 내지 도 7에 참조된 바와 같이, 메인 하우징(110)의 다수의 일측 방열 핀(114) 및 커버 하우징(120)의 다수의 타측 방열 핀(124)을 통해 메인 하우징(110)의 내부 공간(116)에 마련된 메인보드(111)에 실장된 다수의 발열소자인 전장부품들로부터 생성된 열을 전담하여 방열하도록 구비되고, 다수의 안테나 블록(140) 각각의 외면에 형성된 한 쌍의 단위블록 히트싱크(144a,144b)를 통해 메인 하우징(110)의 내부 공간(116)과 외측으로 이격된 부위에 다수의 단위 안테나 블록(140)의 내부에 실장된 안테나 소자(152) 및 안테나 필터(153) 등으로부터 생성된 열을 전담하여 방열하도록 구비될 수 있다.In the antenna device according to the embodiments of the present invention, in order to actively solve the above-described conventional problem, the above various electronic components are placed in the inner space 116 of the main housing 110 and a plurality of unit antenna blocks 140. We propose a structure that is separated and distributed. In short, the antenna device according to an embodiment of the present invention, as shown in FIGS. 1 to 7, a plurality of radiating fins 114 on one side of the main housing 110 and a plurality of radiating heat of the other side of the cover housing 120 It is provided to exclusively dissipate heat generated from electric components, which are multiple heating elements mounted on the main board 111 provided in the inner space 116 of the main housing 110 through the pin 124, and a plurality of antennas A plurality of unit antenna blocks 140 are spaced outward from the inner space 116 of the main housing 110 through a pair of unit block heat sinks 144a and 144b formed on the outer surface of each block 140. Heat generated from the antenna element 152 and the antenna filter 153 mounted therein may be exclusively provided to radiate heat.
안테나 블록 바디(141)는, 도 4 내지 도 7에 참조된 바와 같이, 대략 T자 형상의 수직 단면 외관을 가지는 블록체로써, 도면상 T자 형상의 상단부(즉, 전방부)에 해당하는 위치에 제1기판 설치 공간(142a)이 마련된다. 아울러, 안테나 블록 바디(141) 중 도면상 T자 형상의 하단부(즉, 후방부)에 해당하는 위치에 제2기판 설치 공간(142b)이 마련된다. 제2기판 설치 공간(142b)은, 좌우 방향으로 관통되게 형성될 수 있다. 좌우 방향으로 관통되게 형성된 제2기판 설치 공간(142b)은, 후술하는 한 쌍의 단위블록 히트싱크(144a,144b)가 각각 결합되는 동작으로 차폐될 수 있다.The antenna block body 141 is a block body having a substantially T-shaped vertical cross-sectional appearance, as shown in FIGS. 4 to 7, and a position corresponding to the upper end (ie, front part) of a T-shaped shape in the drawing A first substrate installation space 142a is provided in the. In addition, a second substrate installation space 142b is provided at a position corresponding to a lower end portion (ie, rear portion) having a T-shaped shape in the drawing of the antenna block body 141. The second substrate installation space 142b may be formed to penetrate in the left and right directions. The second substrate installation space 142b formed to penetrate in the left and right direction may be shielded by an operation in which a pair of unit block heat sinks 144a and 144b to be described later are respectively coupled.
도 5 및 도 6에 참조된 바와 같이, 제1기판 설치 공간(142a)은, 대략 도면상 일측 또는 타측으로 길고 그 상하 높이가 상대적으로 작은 얇은 직육면체 공간 형태로 형성될 수 있고, 제2기판 설치 공간(142b)은, 대략 도면상 일측 또는 타측 방향과 상하 방향으로 길고 그 폭이 상대적으로 작은 직육면체 공간 형태로 형성될 수 있다. 특히, 제2기판 설치 공간(142b)은, 후술하는 바와 같이, 폭 방향 일측 또는 타측으로 개구되게 연통 형성될 수 있다.5 and 6, the first substrate installation space 142a may be formed in the form of a thin rectangular parallelepiped space that is approximately long in one side or the other side in the drawing and has a relatively small upper and lower height, and a second substrate is installed. The space 142b may be formed in a shape of a rectangular parallelepiped space having a relatively long width and a relatively small width in one or the other direction and the vertical direction in the drawing. In particular, the second substrate installation space 142b may be formed in communication to be opened to one side or the other side in the width direction, as described later.
제1기판 설치 공간(142a)과 제2기판 설치 공간(142b)은, 도 5에 참조된 바와 같이, 연통구(145)에 의하여 상호 연통되도록 형성될 수 있다. 아울러, 제2기판 설치 공간(142b)에는, 적어도 하나의 커넥팅 카드(149)가 관통 설치되는 카드 설치홀(146)이 형성될 수 있다. 카드 설치홀(146)은, 안테나 블록 바디(141)의 T자 형상의 하단부의 하단으로부터 커버 하우징(120) 측으로 소정길이 추가 연장 형성된 결합 블록(143)의 내부를 관통하도록 형성될 수 있다. 결합 블록(143)은, 커버 하우징(120)에 형성된 마운팅부(121)에 체결부재(미도시)를 이용하여 견고하게 매칭 결합될 수 있다.The first substrate installation space 142a and the second substrate installation space 142b may be formed to communicate with each other through a communication port 145 as shown in FIG. 5. In addition, a card installation hole 146 through which at least one connecting card 149 is installed may be formed in the second substrate installation space 142b. The card installation hole 146 may be formed to penetrate the inside of the coupling block 143 formed to extend a predetermined length toward the cover housing 120 from the lower end of the T-shaped lower end of the antenna block body 141. The coupling block 143 may be firmly matched and coupled to the mounting portion 121 formed on the cover housing 120 using a fastening member (not shown).
제1기판 설치 공간(142a)에 안착되는 안테나 기판(150)은, 도 5에 참조된 바와 같이, 안테나 보드(151)와, 안테나 보드(151)의 외측면에 설치된 하나 이상의 안테나 소자(152)와, 안테나 보드(151)의 내측면에 설치된 하나 이상의 안테나 필터(153)(MBF, Micro Bellows Filter)를 포함할 수 있다.The antenna substrate 150 mounted on the first substrate installation space 142a includes an antenna board 151 and one or more antenna elements 152 installed on the outer surface of the antenna board 151 as shown in FIG. 5. And, it may include one or more antenna filters 153 (MBF, Micro Bellows Filter) installed on the inner surface of the antenna board 151.
제2기판 설치 공간(142b)에 안착되는 한 쌍의 송수신 기판(148)은, 폭 방향으로 상호 이격되게 설치될 수 있다. 이때, 한 쌍의 송수신 기판(148)은, 각각의 사이에 배치되어 상호간의 EMI(Electro Magnetic Interference)를 차폐하는 적어도 하나의 EMI 차폐부(147)를 사이에 두고 안테나 블록 바디(141)의 일측면에 하나 및 안테나 블록 바디(141)의 타측면에 하나가 배치될 수 있다. 여기서, EMI 차폐부(147)는, 한 쌍의 송수신 기판(148) 중 일측 송수신 기판의 EMI를 차폐하도록 구비된 일측 EMI 차폐부(147)와, 한 쌍의 송수신 기판(148) 중 타측 송수신 기판의 EMI를 차폐하도록 구비된 타측 EMI 차폐부(147)를 포함하고, 일측 EMI 차폐부(147)와 타측 EMI 차폐부(147)는 한 쌍의 송수신 기판(148) 사이에 위치될 수 있다. 일측 EMI 차폐부(147)와 타측 EMI 차폐부(147)는, 제2기판 설치 공간(142b)의 중간 부분에 상호 인접되게 수직 배치되고, 일측 EMI 차폐부(147)의 외측에 해당하는 제2기판 설치 공간(142b)에 일측 송수신 기판(148)이 배치되며, 타측 EMI 차폐부(147)의 외측에 해당하는 제2기판 설치 공간(142b)에 타측 송수신 기판(148)이 배치된다.A pair of transmission/reception boards 148 mounted in the second board installation space 142b may be installed to be spaced apart from each other in the width direction. At this time, the pair of transmission/reception boards 148 are disposed between each of the antenna block body 141 with at least one EMI shielding unit 147 interposed therebetween to shield mutual electromagnetic interference (EMI). One on the side and one on the other side of the antenna block body 141 may be disposed. Here, the EMI shielding part 147 includes one EMI shielding part 147 provided to shield EMI of one of the transmission/reception boards among the pair of transmission/reception boards 148, and the other transmission/reception board of the pair of transmission/reception boards 148 Including the other side EMI shielding part 147 provided to shield the EMI of, and one side EMI shielding part 147 and the other side EMI shielding part 147 may be located between a pair of transmission and reception boards 148. The one side EMI shielding part 147 and the other side EMI shielding part 147 are vertically disposed adjacent to each other in the middle part of the second board installation space 142b, and the second side corresponding to the outside of the one side EMI shielding part 147 One side transmission/reception board 148 is disposed in the board installation space 142b, and the other side transmission/reception board 148 is disposed in the second board installation space 142b corresponding to the outside of the other side EMI shielding part 147.
한 쌍의 송수신 기판(148)은, 제1기판 설치 공간(142a)에 기 설치된 안테나 보드(151)와 연통구(145)를 통해 상호 신호 접속이 가능하도록 전기적으로 도통되게 연결되는 것은 당연하다.It is natural that the pair of transmission/reception boards 148 are electrically connected to enable signal connection through the antenna board 151 and the communication port 145 previously installed in the first board installation space 142a.
한편, 안테나 블록 바디(141)에는, 폭방향 일측과 폭방향 타측에 제2기판 설치 공간(142b)을 차폐하도록 각각 구비되어, 제1기판 설치 공간(142a) 및 제2기판 설치 공간(142b)으로부터 발생한 열을 방열하기 위한 한 쌍의 단위블록 히트싱크(144a,144b)가 구비될 수 있다.Meanwhile, the antenna block body 141 is provided to shield the second substrate installation space 142b on one side in the width direction and the other side in the width direction, respectively, and the first substrate installation space 142a and the second substrate installation space 142b A pair of unit block heat sinks 144a and 144b for dissipating heat generated from the heat sink may be provided.
한 쌍의 단위블록 히트싱크(144a,144b) 중 하나(144a)는 제2기판 설치 공간(142b)의 개방된 일측에 결합되어 제2기판 설치 공간(142b)의 일측을 차폐하고, 한 쌍의 단위블록 히트싱크(144a,144b) 중 나머지 하나(144b)는 제2기판 설치 공간(142b)의 개방된 타측에 결합되어 제2기판 설치 공간(142b)의 타측을 차폐할 수 있다.One (144a) of the pair of unit block heat sinks (144a, 144b) is coupled to the open side of the second substrate installation space (142b) to shield one side of the second substrate installation space (142b), and The remaining one 144b of the unit block heat sinks 144a and 144b may be coupled to the other open side of the second substrate installation space 142b to shield the other side of the second substrate installation space 142b.
아울러, 한 쌍의 단위블록 히트싱크(144a,144b)의 외측면에는 각각 메인보드(111)의 일면에 대하여 평행되게 연장된 다수의 방열핀(도면부호 미표기)이 마련될 수 있다. 다수의 방열핀은, 제1기판 설치 공간(142a) 및 제2기판 설치 공간(142b)이 이루는 공간에서 포집된 열을 외부로 직접 방열함으로써 전장부품의 성능 저하를 방지하는 역할을 수행한다.In addition, a plurality of radiating fins (not shown in the drawings) extending parallel to one surface of the main board 111 may be provided on the outer surfaces of the pair of unit block heat sinks 144a and 144b. The plurality of radiating fins directly radiate heat collected in the space formed by the first substrate installation space 142a and the second substrate installation space 142b to the outside, thereby preventing performance degradation of the electronic component.
이와 같이 본 발명에 따른 안테나 장치의 일 실시예(100)는, 종래 메인 하우징(110)의 내부 공간(116)에 집중적으로 설치된 발열소자인 전장부품의 일부(즉, 안테나 소자(152), 안테나 필터(153) 및 송수신 기판 등)를 메인 하우징(110)과 이격된 외측에 분리 설치하고, 각 단위 안테나 블록(140) 별로 한 쌍의 단위블록 히트싱크(144a,144b)를 통해 외부 방열함으로써 방열 성능을 보다 향상시킬 수 있는 이점을 창출할 수 있다.As described above, an embodiment 100 of the antenna device according to the present invention is a part of an electric component that is a heating element intensively installed in the inner space 116 of the conventional main housing 110 (that is, the antenna element 152, the antenna The filter 153 and the transmitting/receiving board, etc.) are separately installed on the outside separated from the main housing 110, and heat dissipated by external heat dissipation through a pair of unit block heat sinks 144a and 144b for each unit antenna block 140 It can create an advantage that can further improve performance.
또한, 본 발명에 따른 안테나 장치의 일 실시예(100)에서, 다수의 단위 안테나 블록(140)이 메인보드(111)에 착탈 가능하게 접속되도록 구비됨으로써, 종래 하나의 안테나 장치에서 구현하지 못하였던 주파수 대역의 듀얼 밴드화를 매우 손쉽게 구현 가능한 이점을 제공한다.In addition, in the embodiment 100 of the antenna device according to the present invention, a plurality of unit antenna blocks 140 are provided to be detachably connected to the main board 111, which has not been implemented in a conventional antenna device. It provides the advantage of very easy to implement dual-band frequency band.
예를 들면, 종래의 경우, 메인보드(111)에 신호 연결되는 하나 이상의 안테나 소자(152) 및 안테나 필터(153)에 대응하는 주파수 대역이 3.5GHz로 최초 설정된 후에는 4.5GHz로 변경이 가능하기는 하지만, 제품 전체를 분해하여 새롭게 설계 및 조립하여야 하는 불편함이 있었다. 그러나, 본 발명의 일 실시예(100)의 경우, 최초 3.5GHz로 설정된 경우에도, 기존의 단위 안테나 블록(140)을 분리한 후, 변경하고자 하는 4.5GHz 주파수 대역에 대응하는 안테나 소자(152) 및 안테나 필터(153)로 설계된 단위 안테나 블록(140)만을 교체하여 조립하는 매우 간편한 작업으로 듀얼 밴드화 및 그 이상의 밴드화 구현이 가능하다. 즉, 일부는 3.5GHz 주파수 대역의 제1밴드 및 다른 일부는 4.5GHz 주파수 대역의 제2밴드를 구성하도록 다수의 단위 안테나 블록(140)의 배열 및 교체 조립이 가능할 수 있다. 특히, 이 경우 커버 하우징(120)의 관통 슬롯(125)을 통한 안테나 블록(140)의 후술하는 커넥팅 카드(149)의 삽입 접속만으로도 가능하므로, 그 배열 및 교체 조립이 매우 용이한 이점을 가진다.For example, in the conventional case, after the frequency band corresponding to one or more antenna elements 152 and antenna filter 153 signal-connected to the main board 111 is initially set to 3.5 GHz, it can be changed to 4.5 GHz. However, there was an inconvenience of having to disassemble the entire product and newly design and assemble it. However, in the case of the embodiment 100 of the present invention, even if the unit is initially set to 3.5 GHz, after separating the existing unit antenna block 140, the antenna element 152 corresponding to the 4.5 GHz frequency band to be changed And it is possible to implement a dual band and more bands by replacing and assembling only the unit antenna block 140 designed as the antenna filter 153. That is, it is possible to arrange and replace and assemble the plurality of unit antenna blocks 140 so that some of them constitute the first band of the 3.5 GHz frequency band and the other part of the second band of the 4.5 GHz frequency band. In particular, in this case, since it is possible to insert and connect the connecting card 149 to be described later of the antenna block 140 through the through slot 125 of the cover housing 120, the arrangement and replacement assembly are very easy.
다수의 단위 안테나 블록(140)은, 적어도 하나의 커넥팅 카드(149)를 매개로 메인보드(111)와 신호 연결될 수 있다. 즉, 본 발명의 일 실시예(100)에서, 단위 안테나 블록(140)은 8개가 마련되고, 8개의 단위 안테나 블록(140) 각각은 메인보드(111)에 의한 통합 신호 제어가 가능하도록, 메인보드(111)에 적어도 하나의 커넥팅 카드(149)를 통해 신호 연결된다.The plurality of unit antenna blocks 140 may be signal-connected to the main board 111 through at least one connecting card 149. That is, in the embodiment 100 of the present invention, eight unit antenna blocks 140 are provided, and each of the eight unit antenna blocks 140 is configured to enable integrated signal control by the main board 111. Signal is connected to the board 111 through at least one connecting card 149.
여기서, 커버 하우징(120)에는, 다수의 단위 안테나 블록(140) 각각에 연결된 커넥팅 카드(149)가 관통하는 관통 슬롯(125)이 형성될 수 있다. 아울러, 한 쌍의 송수신 기판(148) 각각의 단부에는, 커넥팅 카드(149)의 일단이 핀 결합되는 일측 카드 슬롯구(148a)가 마련되고, 메인보드(111)에는 커넥팅 카드(149)의 타단이 핀 결합되는 타측 카드 슬롯구(115)가 마련될 수 있다. 일측 카드 슬롯구(148a)와 타측 카드 슬롯구(115)는, 커넥팅 카드(149)의 양단에 구비된 120핀 단자가 소켓 결합되는 구조로 구비될 수 있다.Here, a through slot 125 through which the connecting cards 149 connected to each of the plurality of unit antenna blocks 140 pass may be formed in the cover housing 120. In addition, at the ends of each of the pair of transmission/reception boards 148, one card slot opening 148a to which one end of the connecting card 149 is pin-coupled is provided, and the other end of the connecting card 149 is provided on the main board 111 The other side card slot 115 to which the pin is coupled may be provided. One card slot port 148a and the other card slot port 115 may be provided in a structure in which 120 pin terminals provided at both ends of the connecting card 149 are socket-coupled.
커넥팅 카드(149)는, 한 쌍의 송수신 기판(148) 중 일측에 구비된 송수신 기판에 하나가 결합되고, 한 쌍의 송수신 기판(148) 중 타측에 구비된 송수신 기판에 하나가 결합된다. 따라서, 본 발명의 일 실시예에 따른 안테나 장치(100)에서 사용되는 커넥팅 카드(149)는 다수의 단위 안테나 블록(140)의 폭 방향으로 상호 이격되게 구비된 2개로 채용될 수 있다.One of the connecting cards 149 is coupled to a transmission/reception board provided on one side of the pair of transmission/reception boards 148, and one of the pair of transmission/reception boards 148 is coupled to a transmission/reception board provided on the other side. Accordingly, the connecting cards 149 used in the antenna device 100 according to an embodiment of the present invention may be employed in two pieces provided to be spaced apart from each other in the width direction of the plurality of unit antenna blocks 140.
여기서, 각각의 단위 안테나 블록(140) 중 안테나 기판(150)에는 4개의 송신기(4T) 및 4개의 수신기(4R)가 기능하도록 구비되는 4T4R의 안테나 소자(152)가 구비되고, 한 쌍의 송수신 기판(148)은 위 각 4개의 송신기 및 수신기(4T4R)가 2개로 분할(즉, 2T2R)되어 분리 담당하도록 실장 구비될 수 있다.Here, the antenna substrate 150 of each unit antenna block 140 is provided with a 4T4R antenna element 152 provided so that four transmitters 4T and four receivers 4R function, and a pair of transmission/reception The substrate 148 may be mounted so that each of the above four transmitters and receivers 4T4R is divided into two (ie, 2T2R) to be separated.
따라서, 메인보드(111)에는 안테나 블록 바디(141)가 8개 또는 16개 연결되는 경우, 5G 환경에서 요구되는 총 32개의 송신기(32T)와 32개의 수신기(32R) 또는 64개의 송신기(64T)와 64개의 수신기(64R)의 구현이 가능할 수 있다.Therefore, when 8 or 16 antenna block bodies 141 are connected to the main board 111, a total of 32 transmitters 32T and 32 receivers 32R or 64 transmitters 64T required in a 5G environment And 64 receivers 64R may be implemented.
한편, 메인보드(111)에는, 도 3에 참조된 바와 같이, 다수의 단위 안테나 블록(140) 각각의 안테나 소자(152)에 접속되도록 구비된 캘리브레이션 포트(105)가 더 구비될 수 있다. 이와 같이, 본 발명에 따른 안테나 장치의 일 실시예(100)는, 메인보드(111)로부터 다수의 단위 안테나 블록(140)이 분리되게 결합되되, 캘리브레이션 포트(105)의 접속을 통해 주파수 대역의 위상이 통합 캘리브레이션 제어되도록 구비될 수 있다.Meanwhile, as shown in FIG. 3, the main board 111 may further include a calibration port 105 provided to be connected to the antenna elements 152 of each of the plurality of unit antenna blocks 140. As described above, in an embodiment 100 of the antenna device according to the present invention, a plurality of unit antenna blocks 140 are separated from the main board 111, and the frequency band is connected to the calibration port 105. The phase can be provided to be integrated calibration control.
도 8은 본 발명의 다른 실시예에 따른 안테나 장치를 나타낸 사시도이고, 도 9는 도 8의 측면도이며, 도 10은 도 8의 분해 사시도이고, 도 11은 도 8의 구성 중 단위 안테나 블록을 나타낸 사시도이며, 도 12는 도 11의 분해 사시도이고, 도 13은 도 11의 단위 안테나 블록과 메인 하우징 내의 메인보드와의 연결 관계를 나타낸 일측 단면도이며, 도 14는 도 11의 단위 안테나 블록과 메인 하우징 내의 메인보드와의 연결 관계를 나타낸 타측 단면도이다.8 is a perspective view showing an antenna device according to another embodiment of the present invention, FIG. 9 is a side view of FIG. 8, FIG. 10 is an exploded perspective view of FIG. 8, and FIG. 11 is a unit antenna block in the configuration of FIG. Fig. 12 is an exploded perspective view of Fig. 11, Fig. 13 is a side sectional view showing a connection relationship between the unit antenna block of Fig. 11 and a main board in the main housing, and Fig. 14 is a unit antenna block and main housing of Fig. 11 It is the other side sectional view showing the connection relationship with the inner main board.
도 1 내지 도 7을 통해 기 설명한 본 발명의 일 실시예에 따른 안테나 장치(100)의 경우, 안테나 기판(150)에 대하여 송수신 기판(148)이 2개로 분리되어 각 송순기 및 수신기의 기능을 분할 담당하도록 구비된 것이라면, 이하에서 설명하는 본 발명의 다른 실시예에 따른 안테나 장치(200)의 경우, 안테나 기판(250)과 송수신 기판(248)이 송신기 및 수신기의 개수별로 분할되지 않는 실시예라고 할 것이다.In the case of the antenna device 100 according to an embodiment of the present invention previously described with reference to FIGS. 1 to 7, the transmission/reception board 148 is separated into two with respect to the antenna board 150 to provide functions of each transmitter and receiver. In the case of the antenna device 200 according to another embodiment of the present invention described below, if provided to be divided, the antenna substrate 250 and the transmission/reception board 248 are not divided according to the number of transmitters and receivers. Would say.
보다 상세하게는, 본 발명의 다른 실시예에 따른 안테나 장치(200)는, 도 8 내지 도 14에 참조된 바와 같이, 다수의 단위 안테나 블록(240)은 각각, 안테나 기판(250) 및 단일 송수신 기판(248)이 설치되는 기판 설치 공간(242a)이 마련된 안테나 블록 바디(241)와, 기판 설치 공간(242a)을 커버링하도록 안테나 블록 바디(241)에 결합된 단위 레이돔(260)을 더 포함할 수 있다.In more detail, the antenna device 200 according to another embodiment of the present invention, as shown in FIGS. 8 to 14, a plurality of unit antenna blocks 240, respectively, an antenna substrate 250 and a single transmission and reception An antenna block body 241 provided with a substrate installation space 242a on which the substrate 248 is installed, and a unit radome 260 coupled to the antenna block body 241 to cover the substrate installation space 242a. I can.
즉, 일 실시예(100)의 경우, 안테나 블록 바디(141)에 안테나 기판(150)이 설치되는 제1기판 설치 공간(142a) 및 제2기판 설치 공간(142b)이 분리 마련됨에 반하여, 다른 실시예(200)의 경우, 안테나 블록 바디(241)에는 안테나 기판(250)과 단일 송수신 기판(248)이 함께 설치되도록 단일의 기판 설치 공간(242a)만이 형성될 수 있다.That is, in the case of the embodiment 100, while the first substrate installation space 142a and the second substrate installation space 142b in which the antenna substrate 150 is installed on the antenna block body 141 are separated In the case of the embodiment 200, only a single board installation space 242a may be formed in the antenna block body 241 so that the antenna board 250 and the single transmission/reception board 248 are installed together.
또한, 일 실시예(100)의 경우, 안테나 기판(150)에 대하여 한 쌍의 송수신 기판이 직교되게 배치되는 것에 반하여, 다른 실시예(200)의 경우, 안테나 기판(250)과 단일의 송수신 기판은 도면상 상하 방향으로 상호 적층 배치될 수 있다. 여기서, 일 실시예(100)의 경우에는 제1기판 설치 공간(142a)에 안테나 기판(150) 만이 설치되지만, 다른 실시예(200)의 경우에는 단일의 기판 설치 공간(242a)에 안테나 기판(250)과 단일 송수신 기판(248)이 모두 상호 소정간격 이격되도록 적층 배치되는 점에서, 상대적으로 일 실시예(100)의 경우보다 단일의 기판 설치 공간(242a)의 상하 높이가 더 크게 설정됨이 바람직하다.In addition, in the case of the embodiment 100, while the pair of transmission/reception boards are arranged orthogonally with respect to the antenna board 150, in the case of the other embodiment 200, the antenna board 250 and a single transmission/reception board Silver may be stacked and disposed in the vertical direction on the drawing. Here, in the case of the embodiment 100, only the antenna substrate 150 is installed in the first substrate installation space 142a, but in the other embodiment 200, the antenna substrate ( Since both the 250 and the single transmission/reception board 248 are stacked and arranged to be spaced apart from each other by a predetermined distance, the upper and lower heights of the single board installation space 242a are set to be larger than in the case of the embodiment 100. desirable.
아울러, 일 실시예(100)의 경우, 한 쌍의 송수신 기판의 단부에 커넥팅 카드(149)의 일단이 핀 결합되는 일측 카드 슬롯구(148a)가 마련되나, 다른 실시예(200)의 경우, 단일 송수신 기판(248)의 '일면(도면상 하면)'에 커넥팅 카드(249)의 일단이 핀 결합되는 일측 카드 슬롯구(248a)가 마련되는 점에서 차이가 있다. 즉, 다른 실시예(200)에서는, 단일 송수신 기판(248)이 메인보드(211)에 평행되게 안테나 기판(250)에 대하여 적층되는 구조로 기판 설치 공간(242a)에 설치되는 결과, 120핀 결합 소켓에 해당하는 일측 카드 슬롯구(248a)가 단일 송수신 기판(248)의 일면에 형성되는 것이 구조적으로 바람직하기 때문이다. 이때, 커넥팅 카드(149)는 단일의 기판 설치 공간(242a)에 길이방향으로 2개가 나뉘어 일직선 형태로 구비되고, 일측 카드 슬롯구(248a) 또한 각각의 커넥팅 카드(149)가 소켓 결합되도록 단일의 기판 설치 공간(242a)의 길이방향으로 일직선 배열될 수 있다.In addition, in the case of the embodiment 100, one end of the connecting card 149 is pin-coupled to one end of the card slot hole 148a is provided at the end of the pair of transmission and reception boards, but in the case of the other embodiment 200, There is a difference in that one card slot hole 248a to which one end of the connecting card 249 is pin-coupled is provided on the'one side (lower surface)' of the single transmission/reception board 248. That is, in another embodiment 200, as a result of being installed in the board installation space 242a in a structure in which a single transmission/reception board 248 is stacked with respect to the antenna board 250 parallel to the main board 211, 120 pins are combined. This is because it is structurally preferable that one card slot hole 248a corresponding to the socket is formed on one surface of the single transmission/reception board 248. At this time, the connecting card 149 is provided in a straight line by dividing two in a lengthwise direction in a single board installation space 242a, and a single card slot hole 248a is also provided so that each connecting card 149 is socket-coupled. It may be arranged in a straight line in the length direction of the substrate installation space 242a.
한편, 본 발명의 다른 실시예에 따른 안테나 장치(200)는, 도 11 및 도 12에 참조된 바와 같이, 안테나 블록 바디(241) 중 커버 하우징(220)을 향하는 면에, 기판 설치 공간(242a)으로부터 발생한 열을 방열하기 위한 단위블록 히트싱크(244)가 구비될 수 있다. 단위블록 히트싱크(244)에는, 메인보드(211)를 향하도록 연장 형성된 다수의 방열 핀(도면부호 미표기)이 마련될 수 있다. 즉, 단위블록 히트싱크(244)는, 메인보드(211)의 일면에 대하여 직교되게 연장 형성될 수 있다.On the other hand, the antenna device 200 according to another embodiment of the present invention, as shown in Figs. 11 and 12, on the surface of the antenna block body 241 facing the cover housing 220, the substrate installation space 242a A unit block heat sink 244 for dissipating heat generated from) may be provided. The unit block heat sink 244 may be provided with a plurality of heat dissipation fins (not shown in drawings) extending toward the main board 211. That is, the unit block heat sink 244 may be formed to extend orthogonal to one surface of the main board 211.
아울러, 본 발명의 다른 실시예에 따른 안테나 장치(200)는, 안테나 기판(250)과 단일 송수신 기판(248) 사이에 배치되어 상호간의 EMI를 차폐하는 단일 EMI 차폐부(247)가 기판 설치 공간(242a)에 더 구비될 수 있다.In addition, the antenna device 200 according to another embodiment of the present invention includes a single EMI shield 247 disposed between the antenna substrate 250 and the single transmission/reception board 248 to shield mutual EMI. It may be further provided in (242a).
상기와 같이 구성되는 본 발명의 다른 실시예에 따른 안테나 장치(200)에 있어서도, 단일 송수신 기판(248)에는 4개의 송신기(4T)와 4개의 수신기(4R)가 실장되고, 상기 메인보드(211)에는 상기 안테나 블록 바디(241)가 8개 또는 16개 연결되어 32개의 송신기(32T)와 32개의 수신기(32R) 또는 64개의 송신기(64T)와 64개의 수신기(64R)의 구현이 가능할 수 있다.Also in the antenna device 200 according to another embodiment of the present invention configured as described above, four transmitters 4T and four receivers 4R are mounted on a single transmission/reception board 248, and the main board 211 ), the antenna block bodies 241 are connected to eight or sixteen, so that it is possible to implement 32 transmitters 32T and 32 receivers 32R, or 64 transmitters 64T and 64 receivers 64R. .
즉, 상술한 일 실시예(100)의 경우, 송수신 기판(148)이 한 쌍으로 구비되어 분리되는 결과, 4T4R의 기능을 수행하는 안테나 기판(150)에 대응하여 각각 2T2R의 기능에 대응되도록 구현된 점을 제외하면, 본 발명의 다른 실시예(200)의 경우에도, 4T4R의 기능을 수행하는 안테나 기판(250)에 대응하는 단일 송수신 기판(248) 만이 마련됨으로써 상술한 32T32R 또는 64T64R이 구현될 수 있다.That is, in the case of the above-described embodiment 100, as a result of the transmission/reception boards 148 being provided as a pair and being separated, each of them is implemented to correspond to the functions of 2T2R in response to the antenna board 150 performing the function of 4T4R. Except for that point, even in the case of the other embodiment 200 of the present invention, only a single transmission/reception board 248 corresponding to the antenna substrate 250 performing the function of 4T4R is provided, thereby implementing the aforementioned 32T32R or 64T64R. I can.
도 8 내지 도 14로 구현되는 본 발명의 다른 실시예에 따른 안테나 장치(200)의 구성 중 설명되지 않은 구성들의 각 구조 및 특징들은 상술한 차이점을 제외하고는 모두 동일한 구조 및 특성을 가지므로, 도 1 내지 도 7을 통해 기 설명된 본 발명의 일 실시예에 따른 안테나 장치(100)의 구성들의 설명으로 대체하기로 한다.Each of the structures and features of the configurations not described among the configurations of the antenna device 200 according to another embodiment of the present invention implemented in FIGS. 8 to 14 have the same structure and characteristics except for the above-described differences, It will be replaced with a description of the configurations of the antenna device 100 according to an embodiment of the present invention previously described with reference to FIGS. 1 to 7.
상기와 같이 본 발명의 실시예들에 따른 안테나 장치(100,200)는, 통합 캘리브레이션 제어 및 통합 신호 제어를 담당하는 메인보드(111,211)가 구비된 메인 하우징(110,210)으로부터 모듈별로 안테나 기판(150,250) 및 송수신 기판(148,248)이 분리되어 착탈 가능하게 구비됨으로써, 종래 싱글 밴드로부터 선택적으로 듀얼 밴드화의 주파수 대역 변경이 용이함은 물론, 방열의 분산화를 통해 보다 신뢰성 높은 제품의 제조가 가능한 이점을 제공한다.As described above, the antenna devices 100 and 200 according to the embodiments of the present invention include the antenna substrates 150 and 250 for each module from the main housings 110 and 210 provided with the main boards 111 and 211 in charge of integrated calibration control and integrated signal control. Since the transmission/ reception boards 148 and 248 are separated and detachably provided, it is easy to change a frequency band selectively from a single band to a dual band, and a more reliable product can be manufactured through decentralization of heat dissipation.
이상, 본 발명에 따른 안테나 장치의 실시예들을 첨부된 도면을 참조하여 상세하게 설명하였다. 그러나, 본 발명의 실시예가 반드시 상술한 실시예들에 의하여 한정되는 것은 아니고, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의한 다양한 변형 및 균등한 범위에서의 실시가 가능함은 당연하다고 할 것이다. 그러므로, 본 발명의 진정한 권리범위는 후술하는 청구범위에 의하여 정해진다고 할 것이다.In the above, embodiments of the antenna device according to the present invention have been described in detail with reference to the accompanying drawings. However, the embodiments of the present invention are not necessarily limited by the above-described embodiments, and it is natural that various modifications and implementations in an equivalent range by those of ordinary skill in the art to which the present invention pertains are possible. will be. Therefore, it will be said that the true scope of the present invention is determined by the claims to be described later.
본 발명은 가용 주파수 대역의 듀얼 밴드화의 적용 및 기설정된 주파수 대역에서 상이한 주파수 대역으로의 변경 설계가 용이하고 다수의 발열 소자의 단위 방열 효율을 확장시킬 수 있도록 모듈별로 구획 설치 가능한 안테나 장치를 제공한다.The present invention provides an antenna device that can be partitioned for each module so that it is easy to apply a dual band of an available frequency band and change the design from a preset frequency band to a different frequency band, and to extend the unit heat dissipation efficiency of a plurality of heating elements. do.

Claims (19)

  1. 메인보드가 내장되도록 내부 공간이 형성되고, 외측면에 다수의 방열핀이 마련된 메인 하우징;A main housing in which an inner space is formed so that the main board is embedded, and a plurality of radiating fins are provided on an outer surface;
    상기 메인 하우징의 내부 공간을 차폐하도록 구비되고, 외측면에 다수의 방열핀이 마련된 커버 하우징; 및A cover housing provided to shield the inner space of the main housing and having a plurality of radiating fins on an outer surface thereof; And
    상기 커버 하우징의 외측면 중 일부를 점하도록 착탈 가능하게 결합되고, 내부에 하나 이상의 안테나 소자 및 하나 이상의 안테나 필터가 결합된 안테나 기판이 내장된 다수의 단위 안테나 블록; 을 포함하고,A plurality of unit antenna blocks that are detachably coupled to occupy a portion of an outer surface of the cover housing, and have an antenna substrate in which at least one antenna element and at least one antenna filter are combined; Including,
    상기 다수의 단위 안테나 블록은, 적어도 하나의 커넥팅 카드를 매개로 상기 메인보드와 신호 연결되는, 안테나 장치.The plurality of unit antenna blocks are signal-connected to the main board via at least one connecting card.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 커버 하우징에는, 상기 다수의 단위 안테나 블록 각각의 단부 일부가 수용되는 마운팅부가 상기 다수의 타측 방열 핀 일부가 제거된 형태로 마련된, 안테나 장치.In the cover housing, a mounting portion accommodating a portion of an end portion of each of the plurality of unit antenna blocks is provided in a form in which a portion of the plurality of other side radiating fins is removed.
  3. 청구항 1에 있어서,The method according to claim 1,
    상기 커버 하우징에는, 상기 다수의 단위 안테나 블록 각각에 연결된 상기 커넥팅 카드가 관통하는 관통 슬롯이 형성된, 안테나 장치.In the cover housing, a through slot through which the connecting card connected to each of the plurality of unit antenna blocks passes is formed.
  4. 청구항 1에 있어서,The method according to claim 1,
    상기 메인보드에는, 상기 다수의 단위 안테나 블록 각각의 상기 안테나 소자에 캘리브레이션 포트가 각각 접속되도록 실장된, 안테나 장치.In the main board, the antenna device is mounted so that the calibration ports are respectively connected to the antenna elements of each of the plurality of unit antenna blocks.
  5. 청구항 4에 있어서,The method of claim 4,
    상기 다수의 단위 안테나 블록 각각의 상기 안테나 소자는, 상기 메인보드에 의하여 주파수 대역의 위상이 통합 캘리브레이션 제어되는, 안테나 장치.In the antenna element of each of the plurality of unit antenna blocks, the phase of the frequency band is integrated calibration controlled by the main board.
  6. 청구항 1에 있어서,The method according to claim 1,
    상기 다수의 단위 안테나 블록은 각각,Each of the plurality of unit antenna blocks,
    상기 안테나 기판이 설치되는 제1기판 설치 공간이 마련되고, 상기 제1기판 설치 공간과 구획되게 상기 커버 하우징 측으로 제2기판 설치 공간이 마련된 안테나 블록 바디;An antenna block body having a first substrate installation space in which the antenna substrate is installed, and a second substrate installation space disposed toward the cover housing so as to be partitioned from the first substrate installation space;
    상기 제2기판 설치 공간의 일측 및 타측에 상기 메인보드와 직교되도록 설치되는 한 쌍의 송수신 기판; 및A pair of transmission/reception boards installed at one side and the other side of the second board installation space so as to be perpendicular to the main board; And
    상기 제1기판 설치 공간을 커버링하도록 상기 안테나 블록 바디에 결합된 단위 레이돔; 을 더 포함하는, 안테나 장치.A unit radome coupled to the antenna block body to cover the installation space of the first substrate; Further comprising, the antenna device.
  7. 청구항 6에 있어서,The method of claim 6,
    상기 한 쌍의 송수신 기판 각각의 단부에는, 상기 커넥팅 카드의 일단이 핀 결합되는 일측 카드 슬롯구가 마련되고,At the ends of each of the pair of transmission/reception boards, one card slot hole to which one end of the connecting card is pin-coupled is provided,
    상기 메인보드에는, 상기 커넥팅 카드의 타단이 핀 결합되는 타측 카드 슬롯구가 마련된, 안테나 장치.In the main board, the other end of the connecting card is provided with a card slot hole is pin-coupled, the antenna device.
  8. 청구항 7에 있어서,The method of claim 7,
    상기 다수의 단위 안테나 블록 각각의 상기 안테나 소자는, 상기 메인보드에 의하여 신호 처리가 통합 제어되는, 안테나 장치.In the antenna element of each of the plurality of unit antenna blocks, signal processing is integrally controlled by the main board.
  9. 청구항 6에 있어서,The method of claim 6,
    상기 안테나 블록 바디에는,In the antenna block body,
    폭방향 일측과 폭방향 타측에 상기 제2기판 설치 공간을 차폐하도록 각각 구비되어, 상기 제1기판 설치 공간 및 상기 제2기판 설치 공간으로부터 발생한 열을 방열하기 위한 한 쌍의 단위블록 히트싱크가 구비된, 안테나 장치.A pair of unit block heat sinks are provided on one side in the width direction and on the other side in the width direction to shield the second substrate installation space, and to dissipate heat generated from the first substrate installation space and the second substrate installation space. , Antenna device.
  10. 청구항 9에 있어서,The method of claim 9,
    상기 한 쌍의 단위블록 히트싱크는, 상기 메인보드의 일면에 대하여 평행되게 연장되는, 안테나 장치.The pair of unit block heat sinks, the antenna device extending in parallel with the one surface of the main board.
  11. 청구항 9에 있어서,The method of claim 9,
    상기 안테나 블록 바디에는,In the antenna block body,
    상기 한 쌍의 송수신 기판 사이에 배치되어 상호간의 EMI를 차폐하는 적어도 하나의 EMI 차폐부가 상기 제2기판 설치 공간에 더 구비된, 안테나 장치.At least one EMI shielding part disposed between the pair of transmission/reception boards to shield mutual EMI is further provided in the second board installation space.
  12. 청구항 6에 있어서,The method of claim 6,
    상기 한 쌍의 송수신 기판 각각에는 2개의 송신기(2T)와 2개의 수신기(2R)가 실장되고,Two transmitters 2T and two receivers 2R are mounted on each of the pair of transmission/reception boards,
    상기 메인보드에는 상기 안테나 블록 바디가 8개 또는 16개 연결되어 32개의 송신기(32T)와 32개의 수신기(32R) 또는 64개의 송신기(64T)와 64개의 수신기(64R)의 구현이 가능한, 안테나 장치.An antenna device capable of implementing 32 transmitters (32T) and 32 receivers (32R) or 64 transmitters (64T) and 64 receivers (64R) by connecting 8 or 16 antenna block bodies to the main board .
  13. 청구항 1에 있어서,The method according to claim 1,
    상기 다수의 단위 안테나 블록은 각각,Each of the plurality of unit antenna blocks,
    상기 안테나 기판 및 단일 송수신 기판이 설치되는 기판 설치 공간이 마련된 안테나 블록 바디; 및An antenna block body provided with a substrate installation space in which the antenna substrate and a single transmission/reception substrate are installed; And
    상기 기판 설치 공간을 커버링하도록 상기 안테나 블록 바디에 결합된 단위 레이돔; 을 더 포함하는, 안테나 장치.A unit radome coupled to the antenna block body to cover the substrate installation space; Further comprising, the antenna device.
  14. 청구항 13에 있어서,The method of claim 13,
    상기 단일 송수신 기판의 일면에는, 상기 커넥팅 카드의 일단이 핀 결합되는 일측 카드 슬롯구가 마련되고,One side of the single transmission/reception board is provided with a card slot hole on which one end of the connecting card is pin-coupled,
    상기 메인보드에는, 상기 커넥팅 카드의 타단이 핀 결합되는 타측 카드 슬롯구가 마련된, 안테나 장치.In the main board, the other end of the connecting card is provided with a card slot hole is pin-coupled, the antenna device.
  15. 청구항 13에 있어서,The method of claim 13,
    상기 안테나 블록 바디 중 상기 커버 하우징을 향하는 면에는,On a surface of the antenna block body facing the cover housing,
    상기 기판 설치 공간으로부터 발생한 열을 방열하기 위한 단위블록 히트싱크가 구비된, 안테나 장치.An antenna device provided with a unit block heat sink for dissipating heat generated from the substrate installation space.
  16. 청구항 15에 있어서,The method of claim 15,
    상기 단위블록 히트싱크는, 상기 메인보드의 일면에 대하여 직교되게 연장되는, 안테나 장치.The unit block heat sink extends orthogonally with respect to one surface of the main board.
  17. 청구항 13에 있어서,The method of claim 13,
    상기 안테나 블록 바디에는,In the antenna block body,
    상기 안테나 기판과 상기 단일 송수신 기판 사이에 배치되어 상호간의 EMI를 차폐하는 단일 EMI 차폐부가 상기 기판 설치 공간에 더 구비된, 안테나 장치.An antenna device further comprising a single EMI shielding unit disposed between the antenna substrate and the single transmission/reception substrate to shield mutual EMI.
  18. 청구항 13에 있어서,The method of claim 13,
    상기 단일 송수신 기판에는 4개의 송신기(4T)와 4개의 수신기(4R)가 실장되고,Four transmitters 4T and four receivers 4R are mounted on the single transmission/reception board,
    상기 메인보드에는 상기 안테나 블록 바디가 8개 또는 16개 연결되어 32개의 송신기(32T)와 32개의 수신기(32R) 또는 64개의 송신기(64T)와 64개의 수신기(64R)의 구현이 가능한, 안테나 장치.An antenna device capable of implementing 32 transmitters (32T) and 32 receivers (32R) or 64 transmitters (64T) and 64 receivers (64R) by connecting 8 or 16 antenna block bodies to the main board .
  19. 청구항 13에 있어서,The method of claim 13,
    상기 안테나 기판 및 단일 송수신 기판은, 각각 상기 기판 설치 공간에 소정간격 이격되도록 적층 배치된, 안테나 장치.The antenna substrate and the single transmission/reception substrate are stacked and disposed to be spaced apart from each other in the substrate installation space.
PCT/KR2020/006226 2019-05-15 2020-05-12 Antenna apparatus WO2020231148A1 (en)

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EP20806278.6A EP3972052A4 (en) 2019-05-15 2020-05-12 Antenna apparatus
CN202080035053.0A CN114128047A (en) 2019-05-15 2020-05-12 Antenna device
JP2021567805A JP7285341B2 (en) 2019-05-15 2020-05-12 antenna device
US17/522,917 US20220069476A1 (en) 2019-05-15 2021-11-10 Antenna apparatus

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KR20190056993 2019-05-15
KR10-2019-0056993 2019-05-15
KR10-2020-0012454 2020-02-03
KR1020200012454A KR102290036B1 (en) 2019-05-15 2020-02-03 Antenna apparatus

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KR100810383B1 (en) * 2006-12-01 2008-03-04 삼성전자주식회사 Built-in type antenna apparatus
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