WO2020228624A1 - Electronic device and preparation method thereof - Google Patents

Electronic device and preparation method thereof Download PDF

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Publication number
WO2020228624A1
WO2020228624A1 PCT/CN2020/089311 CN2020089311W WO2020228624A1 WO 2020228624 A1 WO2020228624 A1 WO 2020228624A1 CN 2020089311 W CN2020089311 W CN 2020089311W WO 2020228624 A1 WO2020228624 A1 WO 2020228624A1
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WO
WIPO (PCT)
Prior art keywords
metal
metal plate
electronic device
plate
protective film
Prior art date
Application number
PCT/CN2020/089311
Other languages
French (fr)
Chinese (zh)
Inventor
黄礼忠
毛健
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2020228624A1 publication Critical patent/WO2020228624A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings

Definitions

  • This application relates to the technical field of the production of electronic equipment structural parts, in particular to an electronic equipment and a preparation method thereof.
  • Electronic equipment usually chooses lightweight metals (or alloys) to prepare structural parts, which is the preferred direction for lightweight electronic equipment, and ensuring long-term good conduction of the electrical contact positions of these metal structural parts is a necessary condition for lightweight electronic equipment .
  • the surface protection layer is usually removed by the laser engraving process, and conductive foam or spot-welded copper sheet is attached to realize the connection with the highly conductive metal to reduce the impedance of the contact position.
  • the conductive foam resistance itself is unstable, it will cause the antenna radiated spurious emission (RSE) to easily fail the standard; and the connection of dissimilar metals will produce the galvanic effect, and the alloy with low electrode potential acts as the anode in the galvanic cell, resulting in metal Structural parts are corroded to cause electrical connection failure, especially in humid or chloride-containing medium atmosphere.
  • RSE antenna radiated spurious emission
  • the embodiments of the present application provide an electronic device and a preparation method thereof, which are used to solve the problem of corrosion of metal structural parts at electrical contact positions in the prior art.
  • an electronic device including: a metal structure including an electrical contact position; a metal composite plate, including a first metal plate and a second metal plate, the first metal plate is located at the electrical contact position; the first metal plate
  • the electrode potential is the same as that of the metal structure, or the electrode potential difference between the first metal plate and the metal structure is less than or equal to 0.5V; the second metal plate is located above the first metal plate, and the conductivity of the second metal plate is greater than that of the first metal plate.
  • the conductivity of the metal plate, and the second metal plate is used for electrical connection with the circuit on the electronic device.
  • the first metal plate is located at the electrical contact position of the metal structure, and the electrode potential difference between the first metal plate and the metal structure is small, the first metal plate and the metal structure It is difficult to form a galvanic cell between them, which can improve the corrosion resistance of the metal structure.
  • the electronic device further includes a protective film, the protective film is located on the upper surface of the first metal plate, and the size of the second metal plate is smaller than the size of the first metal plate.
  • the electronic device further includes an electrical connection point, and the electrical connection point is arranged in an area with a protective film.
  • the electrical connection point can be welded or riveted to fix the metal composite board. Because the welded or riveted point is also metal, the covering protective film can further prevent corrosion and improve the corrosion resistance of the electrical contact position of the metal structure ability.
  • the upper surface of the metal structure is provided with a surface protection layer, and the surface protection layer is located between the metal structure and the first metal plate.
  • the surface protection film covered between the metal structure and the first metal plate can effectively prevent galvanic corrosion of the metal structure in a humid environment, and further improve the corrosion resistance of the electrical contact position of the metal structure. ability.
  • the periphery of the second metal plate is surrounded by a protective film.
  • the surface of the first metal plate and the surface of the second metal plate can be prevented from forming a galvanic corrosion circuit, and the connection between the first metal plate and the second metal plate can also be prevented from forming a galvanic corrosion circuit, Further improve the corrosion resistance of the electrical contact position of the metal structure.
  • the protective film includes a first protective film and a second protective film, the first protective film is a polymer organic coating, and the second protective film is a surface insulating hydrophobic layer.
  • the first protective film and the second protective film can also prevent the second metal plate and the metal structure from forming a galvanic corrosion circuit, thereby further improving the corrosion resistance of the electrical contact position of the metal structure.
  • the metal structure is an antenna radiator
  • the electronic device further includes a metal frame, a metal shrapnel, and a connecting plate.
  • the metal structure is connected to the metal frame, the metal shrapnel is fixed on the connecting plate, and the metal shrapnel is connected to the metal structure.
  • the electrical contact position of the metal composite board is electrically connected.
  • the connecting board is a metal middle frame or a printed circuit board.
  • the metal structure is the feed point of the antenna
  • the electronic device further includes a printed circuit board and a metal shrapnel.
  • the metal shrapnel is fixed on the printed circuit board, and the metal composite board is electrically connected to the metal shrapnel.
  • the first metal plate and the metal structure are the same metal material.
  • the electronic device of the embodiment of the present application there is no electrode potential difference between the first metal plate and the metal structure. Therefore, no galvanic cell can be formed between the first metal plate and the metal structure, thereby improving the corrosion resistance of the metal structure. ability.
  • the thickness of the second metal plate does not exceed 0.3 mm.
  • the conductivity of the metal composite board can be improved while controlling the height of the metal composite board.
  • the metal composite plate further includes a third metal plate, the third metal plate is located between the first metal plate and the second metal plate, and the conductivity of the second metal plate is greater than that of the third metal plate.
  • metal with higher conductivity cannot be directly fixed on the first metal plate, and can be fixed only by the third metal plate.
  • the electronic equipment adopts a metal with higher conductivity, which can improve the conductivity of the electrical contact position of the metal structure.
  • the metal composite plate further includes a fourth metal plate, and the fourth metal plate is located between the first metal plate and the third metal plate.
  • the metal with higher conductivity cannot be directly fixed on the first metal plate, and can be fixed only by the multilayer metal plate.
  • the electronic equipment adopts a metal with higher conductivity, which can improve the conductivity of the electrical contact position of the metal structure.
  • the material of the second metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • the material of the third metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • gold is used as the second metal plate, which can improve the conductivity of the electrical contact position of the metal structure.
  • the electronic device is a mobile phone, a wearable device, a display device, a tablet, a computer, or a smart home terminal.
  • the first metal plate is a magnesium alloy or a magnesium-lithium alloy.
  • the use of magnesium alloy or magnesium-lithium alloy can further reduce the weight of the terminal device.
  • an electronic device including a metal frame, a printed circuit board, and a metal composite board.
  • the metal frame is a metal structural member, wherein: the metal structural member includes electrical contact positions; the metal composite board includes a first metal plate and The second metal plate, the second metal plate is located above the first metal plate, and the first metal plate is welded at the electrical contact position; the electrode potential of the first metal plate and the metal structure is the same, or, the first metal plate and the metal structure The electrode potential difference is less than or equal to 0.5V; the conductivity of the second metal plate is greater than that of the first metal plate; the second metal plate is electrically connected to the printed circuit board.
  • the metal frame can be a metal middle frame, a metal frame or a metal back shell of an electronic device.
  • the metal frame may further include a metal middle frame and a metal frame, and the metal middle frame and the metal frame may be an integral structure.
  • the metal frame may further include a metal frame and a metal back shell, and the metal frame and the metal back shell may be an integral structure.
  • the electronic device further includes a protective film, the protective film is located on the upper surface of the first metal plate, and the size of the second metal plate is smaller than the size of the first metal plate.
  • the electronic device further includes an electrical connection point, and the electrical connection point is arranged in an area with a protective film.
  • the upper surface of the metal structure is provided with a surface protection layer, and the surface protection layer is located between the metal structure and the first metal plate.
  • the periphery of the second metal plate is surrounded by a protective film.
  • the protective film includes a first protective film and a second protective film, the first protective film is a polymer organic coating, and the second protective film is a surface insulating hydrophobic layer.
  • the second metal plate is electrically connected to the printed circuit board, specifically: the second metal plate is electrically connected to the printed circuit board through a metal elastic sheet.
  • the metal composite plate further includes a third metal plate, the third metal plate is located between the first metal plate and the second metal plate, and the conductivity of the second metal plate is greater than that of the third metal plate.
  • metal with higher conductivity cannot be directly fixed on the first metal plate, and can be fixed only by the third metal plate.
  • the electronic equipment adopts a metal with higher conductivity, which can improve the conductivity of the electrical contact position of the metal structure.
  • the metal composite plate further includes a fourth metal plate, and the fourth metal plate is located between the first metal plate and the third metal plate.
  • the metal with higher conductivity cannot be directly fixed on the first metal plate, and can be fixed only by the multilayer metal plate.
  • the electronic equipment adopts a metal with higher conductivity, which can improve the conductivity of the electrical contact position of the metal structure.
  • the material of the second metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • the material of the third metal plate can be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • gold is used as the second metal plate, which can improve the conductivity of the electrical contact position of the metal structure.
  • the electronic device is a mobile phone, wearable device, display device, tablet, computer, or smart home terminal.
  • an electronic device including a display screen, a metal frame, a printed circuit board, an antenna, and a metal composite board, wherein the antenna includes an antenna radiator, the antenna radiator is a metal structure, and the metal structure includes electrical contact positions
  • the metal composite plate includes a first metal plate and a second metal plate, the first metal plate is electrically connected to the electrical contact position; the electrode potential of the first metal plate and the metal structure is the same, or, the first metal plate and the metal structure The electrode potential difference is less than or equal to 0.5V; the second metal plate is located above the first metal plate, and the conductivity of the second metal plate is greater than the conductivity of the first metal plate; the second metal plate is electrically connected to the metal frame through the metal spring.
  • the metal frame is used to support the display screen.
  • the metal frame may be a metal middle frame.
  • the electronic device further includes a protective film, the protective film is located on the upper surface of the first metal plate, and the size of the second metal plate is smaller than the size of the first metal plate.
  • the electronic device further includes an electrical connection point, and the electrical connection point is arranged in an area with a protective film.
  • the upper surface of the metal structure is provided with a surface protection layer, and the surface protection layer is located between the metal structure and the first metal plate.
  • the periphery of the second metal plate is surrounded by a protective film.
  • the protective film includes a first protective film and a second protective film, the first protective film is a polymer organic coating, and the second protective film is a surface insulating hydrophobic layer.
  • the second metal plate is electrically connected to the printed circuit board, specifically: the second metal plate is electrically connected to the printed circuit board through a metal elastic sheet.
  • the metal composite plate further includes a third metal plate, the third metal plate is located between the first metal plate and the second metal plate, and the conductivity of the second metal plate is greater than that of the third metal plate.
  • the electronic device is a mobile phone, a wearable device, a display device, a tablet, a computer, or a smart home terminal.
  • a method for manufacturing an electronic device includes a metal structure and a metal composite plate, the metal structure includes electrical contact positions; the metal composite plate includes a first metal plate and a second metal plate, and the first metal
  • the electrode potential of the plate and the metal structure is the same or the electrode potential difference is less than or equal to 0.5V, and the conductivity of the second metal plate is greater than that of the first metal plate.
  • the method includes: placing the first metal plate at an electrical contact position; The second metal plate is electrically connected with the circuit in the electronic device.
  • the preparation method further includes: fixing the composite plate at the electrical contact position by welding, and covering the welding area of the metal composite plate with a protective film.
  • the preparation method further includes: fixing the composite plate at the electrical contact position by riveting, and covering the riveted area of the metal composite plate with a protective film.
  • the material of the second metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • the metal composite plate further includes a third metal plate, the third metal plate is located between the first metal plate and the second metal plate, and the conductivity of the second metal plate is higher than that of the third metal plate.
  • the second metal plate is gold
  • the material of the third metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • the second metal plate is located on the upper surface and the side surface of the first metal plate.
  • the thickness of the second metal plate does not exceed 0.3 mm.
  • the first metal plate and the second metal plate are the same metal material.
  • the first metal plate is a magnesium alloy or a magnesium-lithium alloy.
  • the first metal plate is located at the electrical contact position of the metal structure, and the electrode potential difference between the first metal plate and the metal structure is small, it is difficult to form a connection between the first metal plate and the metal structure.
  • the original battery can improve the corrosion resistance of the metal structure.
  • Fig. 1 is a side sectional view of an electronic device provided by an embodiment of the present application.
  • Fig. 2 is a plan view of the electronic device shown in Fig. 1.
  • FIG. 3 is a side sectional view of an electronic device provided by another embodiment of the application.
  • Fig. 4 is a plan view of the electronic device shown in Fig. 3.
  • Figure 5 is a side cross-sectional view of an electronic device provided by an embodiment of the present application.
  • Fig. 6 is a schematic structural diagram of a metal composite panel provided by an embodiment of the present application.
  • Fig. 7 is a schematic structural diagram of a metal composite panel provided by another embodiment of the present application.
  • FIG. 8 is a schematic diagram of an electrical connection mode between electronic equipment devices provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of an electrical connection mode between electronic equipment devices according to another embodiment of the present application.
  • FIG. 10 is a schematic diagram of an electrical connection mode between electronic equipment devices according to an embodiment of the present application.
  • FIG. 11 is a schematic flowchart of preparing an electronic device according to an embodiment of the present application.
  • Fig. 12 is a schematic diagram of an electronic device prepared in an embodiment of the present application.
  • the electronic device in the embodiments of this application can refer to any electronic device that uses metal as a structural member, such as a mobile terminal (such as a mobile phone), a wearable device, a display device (such as a TV), a tablet, a computer, a smart home terminal, etc. Electronic equipment.
  • Metal has electrode potential. There may be differences in electrode potential between different metals.
  • galvanic corrosion occurs at the electrical contact positions of metal structural parts in a humid environment, which may increase the corrosion rate of metals with low electrode potentials, and metals with high electrode potentials may be protected from corrosion.
  • the four basic components of a galvanic corrosion circuit are: cathode, anode, conductor and electrolyte.
  • cathode In a humid environment, humid air constitutes the basic component of the conductor and electrolyte, and the two metals at the electrical contact position can constitute The basic components of the cathode and anode.
  • the galvanic corrosion circuit forms a current loop, the metal with high electrode potential is protected as the cathode, and the metal with low electrode potential is corroded as the anode.
  • the electronic equipment in the embodiments of the present application uses metal with the same or similar electrode potential as that of the metal structure at the electrical contact position of the metal structure. There is no or only weak galvanic corrosion, which improves the corrosion protection of the electrical contact position of the metal structure. performance.
  • the material of the metal structure in the embodiments of the present application may be pure metal or alloy. Taking an alloy as an example, the material of the metal structure in the embodiments of the present application may be, for example, a magnesium alloy or a magnesium-lithium alloy.
  • Figures 1 and 2 show an electronic device 100 provided by an embodiment of the present application.
  • the electronic device 100 may include a metal composite board 110 and a metal structure 120.
  • the metal structure 120 includes an electrical contact position 140, and the metal composite board 110 may be located at the electrical contact position 140 and is electrically connected to the metal structure 120.
  • the electrical contact position 140 may be a position where the metal structure 120 is electrically connected to other metal plates.
  • the metal composite plate 110 may include a first metal plate 111 and a second metal plate 112.
  • the lower surface of the first metal plate 111 is located at the electrical contact position 140; the electrode potential of the first metal plate 111 and the metal structure 120 are the same, Alternatively, the electrode potential difference between the first metal plate 111 and the metal structure 120 is less than or equal to 0.5V; the conductivity of the second metal plate 112 is greater than the conductivity of the first metal plate 111, and the second metal plate 112 is used to interact with the electronic device Electrical connection on the circuit.
  • the second metal plate 112 may be electrically connected to an antenna radiator on the electronic device, or the second metal plate 112 may be electrically connected to a printed circuit board of the electronic device.
  • the lower surface of the first metal plate 111 is located at the electrical contact position 140, which may be: the first metal plate 111 is electrically connected to the metal structure 120 through the electrical contact position 140.
  • the second metal plate 112 is located above the first metal plate 111.
  • the second metal plate 112 may be located on the upper surface of the first metal plate 111.
  • the first metal plate 111 can be selected from the same metal as the metal structural member 120. If the metal structural member 120 is made of an alloy material, the first metal plate 111 can be selected from the same material as the metal structural member 120 (for example, Can be the same grade) alloy.
  • the second metal plate 112 may be a metal with low resistance and corrosion resistance characteristics.
  • the material properties of the second metal plate 112 can be used to achieve the low impedance requirement of the electrical contact position 140 of the metal structure. For example, if the second metal plate 112 uses copper, the metal structure 120 can obtain the conductive effect of the copper material property; If the plate 112 is nickel, the metal structure 120 can obtain the conductive effect of the nickel material; if the second metal plate 112 is gold, the metal structure 120 can obtain the conductive effect of the gold material.
  • the thickness of the second metal plate 112 does not exceed 0.3 mm.
  • the upper surface of the metal structure 120 may be provided with a surface protection layer 121.
  • the surface protection layer 121 is located between the metal structure 120 and the first metal plate 111.
  • the surface protection layer 121 can be obtained by surface treatment, surface modification, surface coating, etc., so as to achieve the purpose of preventing corrosion of the metal structure.
  • the metal composite board 110 may further include at least one electrical connection point 130.
  • the metal composite board 110 and the metal structure 120 may be fixed by an electrical connection point 130.
  • the metal composite plate 110 can be fixed to the electrical contact position 140 of the metal structure 120 at at least one electrical connection point 130 through a preparation process.
  • the preparation process used at the at least one electrical connection point 130 may be by welding, riveting, or conductive adhesive.
  • the metal composite plate 110 can be fixed to the electrical connection of the metal structure 120.
  • Contact location 140 Since these preparation methods use metal or other conductive materials, the first metal plate 111 can be electrically connected to the metal structure 120.
  • At least one electrical connection point 130 is a welding pool; if the metal composite plate 110 is fixed by riveting, at least one electrical connection point 130 is a rivet.
  • the electronic device can fix the metal composite board 110 at the electrical contact position 140 of the metal structure 120 at the four electrical connection points 130.
  • the first metal plate 111 whose electrode potential difference with the metal structure 120 is less than or equal to 0.5V and the second metal plate 112 which has better conductivity than the first metal plate 111 can be connected to form the metal composite plate 110.
  • the electrical contact position 140 may be an antenna feed point position or a ground point position
  • a welding process, a riveting process or other processes can be used.
  • the first metal plate 111 of the metal composite plate is electrically connected to 120 pieces of the metal structure, and directly forms a galvanic effect with the magnesium alloy or magnesium-lithium alloy.
  • the galvanic effect of the contact location 140 in a humid environment is not formed (or nearly not formed), and no galvanic corrosion is generated.
  • the second metal plate 112 of the metal composite plate is an exposed surface to realize electrical connection with other circuits.
  • the metal composite plate 110 does not form a galvanic effect with the metal structure 120; it can be realized that the electrical contact position 140 of the metal structure 120 can not only resist corrosion but also achieve good conductivity.
  • Figures 3 and 4 show an electronic device 100 provided by another embodiment of the present application.
  • the metal composite board 110 may further include a protective film 113.
  • the protective film 113 may be located on the upper surface of the first metal plate 111.
  • the protective film 113 is located on the upper surface of the first metal plate 111, where the upper surface is the upper surface without the second metal plate 112. Please refer to FIG. 3, the second metal plate 112 and the protective film 113 are located on the upper surface of the first metal plate 111 together.
  • the size of the second metal plate 112 is smaller than the size of the first metal plate 111.
  • the electrical connection point 130 is provided in the area where the protective film 113 is provided.
  • the function of the electrical connection point 130 can be to fix the metal composite plate 110 above the metal structure 120, and the metal composite plate 110 is electrically connected to the metal structure 120.
  • the method used can be welding, riveting or punching and coating. Glue and other ways.
  • the electrical connection point 130 may penetrate through the protective film 113 and the first metal plate 111 and then be electrically connected to the metal structure 120.
  • the protective film 113 may cover the upper surface of the electrical connection point 130, the electrical connection point 130, the first metal plate 111, and then are electrically connected to the metal structure 120.
  • the protective film 113 may be covered on the area formed by the at least one electrical connection point 130 by dispensing or attaching.
  • the protective film 113 may include a first protective film 114 and a second protective film 115.
  • the first protective film 114 may be a polymer organic coating, for example, the polymer organic coating may be ink or polyurethane.
  • the second protective film 115 may be a surface insulating hydrophobic layer, for example, the surface insulating hydrophobic layer may be an anti-fingerprint (AF) hydrophobic coating layer.
  • the second protective film 115 may be located on the upper surface of the first protective film 114.
  • the side of the second metal plate 112 (which can also be understood as the periphery of the second metal plate 112) is surrounded by the first protective film 114 and the second protective film 115, which can prevent the second metal plate 112 from being
  • a metal plate 111 forms a galvanic corrosion circuit, or it can prevent the second metal plate 112 and the metal structure 120 from forming a galvanic corrosion circuit.
  • the function of the first protective film 114 may be to prevent the formation of a galvanic corrosion circuit at the connection between the first metal plate 111 and the second metal plate 112.
  • the function of the second protective film 115 is to prevent the surface of the first metal plate 111 and the surface of the second metal plate 112 from forming a galvanic corrosion circuit, and can also prevent the formation of galvanic corrosion at the junction of the first metal plate 111 and the second metal plate 112 Circuit.
  • the first protective film 114 and the second protective film 115 can also prevent the second metal plate 112 and the metal structure 120 from forming a galvanic corrosion circuit.
  • the first protective film 114 may be an ink film
  • the second protective film 115 may be an anti-fingerprint (AF) hydrophobic coating.
  • AF anti-fingerprint
  • the protective film 113 may cover the periphery of the metal composite board 110, may include the upper surface and the side surface, and only expose the second metal board 112.
  • the metal structure 120 can be electrically connected to other circuits on the electronic device 100 (for example, electrically connected to a printed circuit board) through the metal composite board 110, so that better corrosion resistance can be obtained.
  • the metal structure 120 can be electrically connected to other circuits of the electronic device through the area of the second metal plate 112 that is not covered with the protective film 113 on the metal composite board 110.
  • the second metal plate 112 can be connected to the antenna current loop of the electronic device. Electric connection.
  • the metal structure 120 may be a metal structure of other shapes (for example, a circular, square, or rectangular metal structure).
  • the schematic diagram in the embodiment is only used as an example, and does not limit the specific shape of the metal structure 120.
  • the metal structure 120 may also have a groove structure.
  • FIG. 6 it is a schematic structural diagram of a metal composite plate provided by an embodiment of the present application.
  • the metal composite plate 110 may include a first metal plate 111 and a second metal plate 112, and the second metal plate 112 may be located on the first metal plate. 111 on the upper surface and side.
  • the second metal plate 112 on the upper surface of the first metal plate 111 may be different in size from the second metal plate 112 around the first metal plate 111.
  • the second metal plate 112 can be a metal with good electrical conductivity and corrosion resistance, which can further increase the corrosion resistance of the electronic device.
  • the material of the second metal plate 112 may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • the first metal plate 111 may cover the second metal plate 112 by means of electroplating or thermal diffusion.
  • FIG. 7 it is a schematic structural diagram of a metal composite plate provided by another embodiment of the present application.
  • the metal composite plate 110 may further include a third metal plate 116.
  • the third metal plate 116 may be located between the first metal plate 111 and the second metal plate 112, wherein the conductivity of the second metal plate 112 is greater than that of the third metal plate 116.
  • the second metal plate 112 may not be electroplated to the surface of the first metal plate 111, and the third metal plate 116 needs to be electroplated onto the surface of the first metal plate 111, and then the second metal plate 112 is electroplated to the surface of the third metal plate 116.
  • the metal composite plate 110 further includes a fourth metal plate, and the fourth metal plate is located between the first metal plate 111 and the third metal plate 116 or between the second metal plate 112 and the third metal plate 116.
  • the metal with higher conductivity cannot be directly fixed on the first metal plate 111 or the third metal plate 116, and may need to be fixed by a multilayer metal plate.
  • the conductivity of the third metal plate 116 and the fourth metal plate may not be limited.
  • the electronic device uses a metal with higher conductivity, which can improve the conductivity of the electrical contact position 140 of the metal structure.
  • the material of the second metal plate 112 can be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, and the material of the third metal plate 116 can be copper, nickel, gold, or silver. , Palladium nickel and other metals with high conductivity, the material of the fourth metal plate can be copper, nickel, gold, silver, palladium nickel and other metals with high conductivity.
  • metal structure to be electrically connected to the circuit on the electronic device through the metal composite board 110, such as electrical contact, coupling, welding, or conductive glue, which is not limited in the embodiment of the present application.
  • FIGS 8 and 9 show schematic diagrams of two different electrical connection modes between electronic equipment devices provided by embodiments of the present application.
  • the metal structure 120 may be an antenna of an electronic device, and the specific metal structure 120 may be a radiator of an antenna of the electronic device.
  • the antenna may include a radiator, a feeding network, a feeding point, and a grounding point.
  • the electronic device 100 may further include a frame 702, a metal dome 703, and a connecting plate 704.
  • the metal structure 120 can be connected to the frame 702 by means of snapping or nano-injection, and a metal spring 703 is fixed on the connecting plate 704.
  • the metal elastic piece 703 may be fixed on the connecting plate 704 by welding.
  • the metal structure 120 when the electronic device is assembled, the metal structure 120 is pressed against the metal elastic piece 703.
  • the metal elastic piece 703 has elasticity. After the metal structure 120 is fixed, the metal elastic piece 703 can be in electrical contact with the metal structure.
  • the 140 of the metal composite board 110 is electrically connected.
  • the electrical contact position 140 of the metal structure 120 may be the ground point or the feed point of the antenna.
  • the connecting board 704 may be a metal middle frame or a printed circuit board (PCB).
  • the metal structure 120 is used as an antenna radiator, wherein the antenna radiator can be electrically connected to the metal composite plate 110, and the metal composite plate 110 is electrically connected to the metal elastic piece 703, and the metal elastic piece 703 is fixed on the connecting plate 704 (for example, the metal elastic piece 703 and The metal middle frame is connected, or the metal spring 703 is connected to the metal coating of the printed circuit board), so that the antenna ground point is grounded.
  • the metal coating may refer to the copper layer of the printed circuit board.
  • the connection board 704 may be a printed circuit board (PCB).
  • PCB printed circuit board
  • the metal structure 120 can be used as the feed point of the antenna
  • the feed point of the antenna can be electrically connected to the metal composite board 110
  • the metal composite board 110 is electrically connected to the metal shrapnel 703.
  • the elastic piece 703 is fixed on the connecting plate 704 so as to realize the electrical connection between the PCB and the metal structure 120.
  • FIG. 9 another electrical connection manner of the metal structure 120 and other circuits in the electronic device 100 is given.
  • the electronic device 100 may also include an antenna 701.
  • the metal structure 120 may be a metal middle frame of the electronic device 100.
  • the metal middle frame can support the display screen.
  • the middle frame may be located between the display screen and the printed circuit board.
  • the antenna may include a radiator, a feeding network, a feeding point, and a grounding point.
  • the antenna 701 can be fixed to the back cover of the electronic device 100 or fixed to the frame of the electronic device by means of snaps or nano-injection, and the metal spring 703 is fixed at the feed point or ground point of the antenna 701.
  • the metal dome 703 may be fixed at the feed point or ground point of the antenna by welding.
  • the metal structure 120 is electrically connected to the metal composite plate 110, and the metal composite plate 110 is pressed against the metal elastic sheet 703.
  • the metal elastic piece 703 is elastic, and the antenna radiator 701 is electrically connected to the metal elastic piece 703.
  • one end of the metal elastic piece 703 is connected to the antenna 701 (for example, the antenna 701 may be a radiator), the metal structure 120 may be a PCB (for example, the metal structure 120 is a metal coating of the PCB board), and the antenna 701 may
  • the metal elastic sheet 703 is electrically connected to the metal composite board 110, and the metal composite board 110 is electrically connected to the metal structure 120, so that the antenna 701 and the metal structure 120 are electrically connected.
  • FIG. 10 shows an electrical connection mode of the metal structure 120 in the electronic device 100 with other circuits.
  • the metal structure 120 may be a metal frame of an electronic device, and the metal structure 120 may be a radiating stub of an antenna of the electronic device.
  • the metal frame can be a metal middle frame, a metal frame or a metal back shell.
  • the metal middle frame and the metal frame may be an integral structure, and the metal frame includes the metal middle frame and the metal frame.
  • the metal frame and the metal back shell may be an integral structure, and the metal frame includes the metal frame and the metal back shell.
  • the electronic device 100 may include a plurality of metal composite boards. As shown in FIG. 10, the electronic device includes a metal composite board 1101 and a metal composite board 1102. For the specific structure of the metal composite board, reference may be made to the description of the metal composite board 110 in the foregoing embodiment, which will not be detailed here.
  • the metal composite board 1101 and the metal structure 120 are electrically connected through electrical contact positions, and the second metal plate of the metal composite board 1101 may be electrically connected to the PCB through an elastic sheet.
  • the metal composite board 1102 and the metal structure 120 are electrically connected through electrical contact positions, and the second metal plate of the metal composite board 1102 can be electrically connected to the PCB through another elastic sheet.
  • the electronic device 100 may also include a PCB (Printed Circuit Board) 705 and a device 706.
  • the device 706 may be an electronic component such as a power management chip, a resonator, a duplexer, or a switch.
  • the electrical contact position where the metal composite board 1101 is located may be the feeding position of the metal structure 120, and the electronic device 100 may be the metal structure 120 through the device 706, the PCB705, the metal spring 7031 and the metal composite board 1101. Feed.
  • the electrical contact position where the metal composite board 1102 is located may be the grounding position of the metal structure 120, and the metal structure may be in electrical contact with the PCB 705 through the metal composite board 1102 and the elastic sheet 7032 to be grounded.
  • FIG. 11 is a schematic flowchart of preparing an electronic device according to an embodiment of the present application.
  • the method 900 may include:
  • a metal structure 120 is provided, and the metal structure 120 includes an electrical contact position 140.
  • the metal composite plate 110 includes a first metal plate 111 and a second metal plate 112.
  • the second metal plate is located on the upper surface of the first metal plate.
  • the electrode potential of the first metal plate 111 and the metal structure is When equal or the electrode potential difference is less than or equal to 0.5V, the conductivity of the second metal plate 112 is greater than the conductivity of the first metal plate 111.
  • the first metal plate 111 can be selected from the same metal as the metal structural member 120. If the metal structural member 120 is made of an alloy material, the first metal plate is preferably made of the same material as the metal structural member (may be of the same brand). )alloy.
  • the second metal plate 112 may have low impedance and corrosion resistance characteristics.
  • the material properties of the second metal plate 112 can be used to achieve the low impedance requirement of the electrical contact position 140 of the metal structure. For example, if the second metal plate 112 uses copper, the metal structure 120 can obtain the conductive effect of the copper material property; If the plate 112 is nickel, the metal structure 120 can obtain the conductive effect of the nickel material; if the second metal plate 112 is gold, the metal structure 120 can obtain the conductive effect of the gold material.
  • the material of the second metal plate 112 may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • punching, sawing, forging or computerized numerical control technology can be used to process the first metal plate according to the required shape and size. Processing. After the processing is completed, the second metal plate can be fixed on the first metal plate by electroplating or thermal diffusion. The formed metal composite board is blanked and punched according to the size of the electrical contact area to complete the preparation of the metal composite board.
  • S903 Place the lower surface of the first metal plate 111 at the electrical contact position 140, and electrically connect the second metal plate 112 with other circuits in the electronic device.
  • the metal composite plate 110 is positioned and fixed at the electrical contact position 140 of the metal structure by a clamp, and the method of welding (such as laser spot welding) connection, riveting connection or conductive glue can be adopted.
  • the metal composite board 110 is electrically connected to the metal structure 120 to form a high-strength connected integrated structure.
  • the preparation method may further include: fixing the composite board at the electrical contact position 140 by welding or riveting, and covering the welding area or riveting area of the metal composite board with a protective film.
  • the preparation method may further include: after the metal composite plate 110 is fixed, the second metal plate may be thinned so that the thickness of the second metal plate 112 does not exceed 0.3 mm, Furthermore, the thickness of the metal composite board can be reduced.
  • the second metal plate 112 is thinned by CNC milling.
  • the preparation method may further include: the metal composite plate further includes a third metal plate 116, and the third metal plate 116 is located on the first metal plate 111. And the second metal plate 112, as shown in FIG.
  • the metal composite plate 110 further includes a fourth metal plate, and the fourth metal plate is located between the first metal plate 111 and the third metal plate 116.
  • the metal with higher conductivity cannot be directly fixed on the first metal plate 111 or the third metal plate 116, and can be fixed by multiple metal plates.
  • the conductivity of the metal plate 116 and the fourth metal plate is not limited.
  • the electronic device uses a metal with higher conductivity, which can improve the conductivity of the electrical contact position 140 of the metal structure.
  • the material of the second metal plate 112 may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • the material of the third metal plate 116 may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
  • the preparation method may further include: the second metal 112 plate is located on the upper surface and the side surface of the first metal plate 111.
  • the preparation method when fixing the second metal plate 112 to the first metal plate 111, the preparation method further includes: positioning the second metal plate 112 on the upper surface of the first metal plate 111 by means of electroplating or thermal diffusion. And the side.
  • the first metal plate is located at the electrical contact position 140 of the metal structural member, and the electrode potential difference between the first metal plate and the metal structural member is small, it is difficult to connect the first metal plate and the metal structural member.
  • a galvanic cell is formed, so that the corrosion resistance of the metal structure can be improved.
  • the disclosed system, device, and method may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical or other forms.

Abstract

Embodiments of the present application provide an electronic device and a preparation method thereof. The electronic device comprises: a metal structural member, comprising an electrical contact position; and a metal composite plate, comprising a first metal plate and a second metal plate. The first metal plate is located at the electrical contact position. Electrode potential of the first metal plate is the same as that of the metal structural member, or an electrode potential difference between the first metal plate and the metal structural member is less than or equal to 0.5V. The second metal plate is located above the first metal plate. Electric conductivity of the second metal plate is greater than that of the first metal plate. The second metal plate is used to electrically connect to a circuit on the electronic device. The first metal plate is selected so that an electrode potential difference between the first metal plate and the metal structural member is zero or is less than or equal to 0.5V, thereby effectively improving the anti-corrosion performance of the electrical contact position of the metal structural member.

Description

电子设备及其制备方法Electronic equipment and preparation method thereof
本申请要求在2019年5月10日提交中国国家知识产权局、申请号为201910388572.4的中国专利申请的优先权，发明名称为“电子设备及其制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application filed with the State Intellectual Property Office of China with the application number 201910388572.4, and the priority of the Chinese patent application with the title of the invention "electronic equipment and its preparation method" on May 10, 2019, all of which The content is incorporated in this application by reference.
技术领域Technical field
本申请涉及电子设备结构件生产技术领域，尤其涉及一种电子设备及其制备方法。This application relates to the technical field of the production of electronic equipment structural parts, in particular to an electronic equipment and a preparation method thereof.
背景技术Background technique
电子设备通常会选用轻质的金属(或合金)来制备结构件，这是电子设备轻量化的优选方向，而保证这些金属结构件电接触位置的长期良好导通是电子设备轻量化的必要条件。Electronic equipment usually chooses lightweight metals (or alloys) to prepare structural parts, which is the preferred direction for lightweight electronic equipment, and ensuring long-term good conduction of the electrical contact positions of these metal structural parts is a necessary condition for lightweight electronic equipment .
由于大部分金属结构件耐腐蚀性能差，通常会在该金属结构件的表面做钝化等防护处理。在金属结构件电接触位置，为实现良好的导电效果，通常采用镭雕工艺去除表面保护层，粘贴导电泡棉或点焊铜片后实现与高导电金属连接，降低接触位置的阻抗。由于导电泡棉电阻本身不稳定，会导致天线辐射杂散发射(radiated spurious emission,RSE)容易不达标；而异种金属连接会产生原电池效应，低电极电位的合金在原电池中充当阳极，导致金属结构件被腐蚀而产生电连接失效，尤其在潮湿或含氯离子的介质氛围中更容易发生。Since most metal structural parts have poor corrosion resistance, passivation and other protective treatments are usually done on the surface of the metal structural parts. In the electrical contact position of the metal structure, in order to achieve a good conductive effect, the surface protection layer is usually removed by the laser engraving process, and conductive foam or spot-welded copper sheet is attached to realize the connection with the highly conductive metal to reduce the impedance of the contact position. Because the conductive foam resistance itself is unstable, it will cause the antenna radiated spurious emission (RSE) to easily fail the standard; and the connection of dissimilar metals will produce the galvanic effect, and the alloy with low electrode potential acts as the anode in the galvanic cell, resulting in metal Structural parts are corroded to cause electrical connection failure, especially in humid or chloride-containing medium atmosphere.
因此，如何提升金属结构件的电接触位置防腐蚀的能力是亟需的问题。Therefore, how to improve the anti-corrosion ability of the electrical contact position of the metal structure is an urgent problem.
发明内容Summary of the invention
本申请实施例提供一种电子设备及其制备方法，用于解决现有技术中金属结构件在电接触位置腐蚀的问题。The embodiments of the present application provide an electronic device and a preparation method thereof, which are used to solve the problem of corrosion of metal structural parts at electrical contact positions in the prior art.
第一方面，提供了一种电子设备，包括：金属结构件，包括电接触位置；金属复合板，包括第一金属板和第二金属板，第一金属板位于电接触位置；第一金属板与金属结构件的电极电位相同，或，第一金属板与金属结构件的电极电位差小于或等于0.5V；第二金属板位于第一金属板上方，第二金属板的导电率大于第一金属板的导电率，第二金属板用于与电子设备上的电路电连接。In a first aspect, an electronic device is provided, including: a metal structure including an electrical contact position; a metal composite plate, including a first metal plate and a second metal plate, the first metal plate is located at the electrical contact position; the first metal plate The electrode potential is the same as that of the metal structure, or the electrode potential difference between the first metal plate and the metal structure is less than or equal to 0.5V; the second metal plate is located above the first metal plate, and the conductivity of the second metal plate is greater than that of the first metal plate. The conductivity of the metal plate, and the second metal plate is used for electrical connection with the circuit on the electronic device.
根据本申请实施例的电子设备，由于第一金属板位于金属结构件的电接触位置，且第一金属板与金属结构件的电极电位差较小，因此，第一金属板和金属结构件之间难以形成原电池，从而可以提升金属结构件的防腐蚀能力。According to the electronic device of the embodiment of the present application, since the first metal plate is located at the electrical contact position of the metal structure, and the electrode potential difference between the first metal plate and the metal structure is small, the first metal plate and the metal structure It is difficult to form a galvanic cell between them, which can improve the corrosion resistance of the metal structure.
在一种实现方式中，电子设备还包括保护膜，保护膜位于第一金属板的上表面，第二金属板的大小小于第一金属板的大小。In an implementation manner, the electronic device further includes a protective film, the protective film is located on the upper surface of the first metal plate, and the size of the second metal plate is smaller than the size of the first metal plate.
在一种实现方式中，电子设备还包括电连接点，电连接点设置在有保护膜的区域。In an implementation manner, the electronic device further includes an electrical connection point, and the electrical connection point is arranged in an area with a protective film.
根据本申请实施例的电子设备，电连接点可以采用焊接或铆接的方式固定金属复合板，因为焊接或铆接点也是金属，覆盖保护膜可以进一步防止腐蚀，提升金属结构件电接 触位置的防腐蚀能力。According to the electronic device of the embodiment of the present application, the electrical connection point can be welded or riveted to fix the metal composite board. Because the welded or riveted point is also metal, the covering protective film can further prevent corrosion and improve the corrosion resistance of the electrical contact position of the metal structure ability.
在一种实现方式中，金属结构件上表面设有表面保护层，表面保护层位于金属结构件和第一金属板之间。In an implementation manner, the upper surface of the metal structure is provided with a surface protection layer, and the surface protection layer is located between the metal structure and the first metal plate.
根据本申请实施例的电子设备，金属结构件和第一金属板之间覆盖有表面保护膜可以有效防止金属结构件在潮湿环境下产生电偶腐蚀，进一步提升金属结构件电接触位置的防腐蚀能力。According to the electronic device of the embodiment of the present application, the surface protection film covered between the metal structure and the first metal plate can effectively prevent galvanic corrosion of the metal structure in a humid environment, and further improve the corrosion resistance of the electrical contact position of the metal structure. ability.
在一种实现方式中，第二金属板的四周被保护膜包围。In one implementation, the periphery of the second metal plate is surrounded by a protective film.
根据本申请实施例的电子设备，可以阻止第一金属板的表面与第二金属板的表面形成电偶腐蚀电路，也可以阻止第一金属板与第二金属板连接处形成电偶腐蚀电路，进一步提升金属结构件电接触位置的防腐蚀能力。According to the electronic device of the embodiment of the present application, the surface of the first metal plate and the surface of the second metal plate can be prevented from forming a galvanic corrosion circuit, and the connection between the first metal plate and the second metal plate can also be prevented from forming a galvanic corrosion circuit, Further improve the corrosion resistance of the electrical contact position of the metal structure.
在一种实现方式中，保护膜包括第一保护膜和第二保护膜，第一保护膜为高分子有机物涂层，第二保护膜为表面绝缘疏水层。In one implementation, the protective film includes a first protective film and a second protective film, the first protective film is a polymer organic coating, and the second protective film is a surface insulating hydrophobic layer.
根据本申请实施例的电子设备，第一保护膜和第二保护膜也可以阻止第二金属板与金属结构件形成电偶腐蚀电路，进一步提升金属结构件电接触位置的防腐蚀能力。According to the electronic device of the embodiment of the present application, the first protective film and the second protective film can also prevent the second metal plate and the metal structure from forming a galvanic corrosion circuit, thereby further improving the corrosion resistance of the electrical contact position of the metal structure.
在一种实现方式中，金属结构件为天线辐射体，电子设备还包括金属边框、金属弹片和连接板，金属结构件与金属边框连接，金属弹片固定在连接板，金属弹片与位于金属结构件的电接触位置的金属复合板电连接。In one implementation, the metal structure is an antenna radiator, and the electronic device further includes a metal frame, a metal shrapnel, and a connecting plate. The metal structure is connected to the metal frame, the metal shrapnel is fixed on the connecting plate, and the metal shrapnel is connected to the metal structure. The electrical contact position of the metal composite board is electrically connected.
在一种实现方式中，连接板为金属中框或印刷电路板。In one implementation, the connecting board is a metal middle frame or a printed circuit board.
在一种实现方式中，金属结构件为天线的馈电点，电子设备还包括印刷电路板和金属弹片，金属弹片固定在印刷电路板，金属复合板与金属弹片电连接。In one implementation, the metal structure is the feed point of the antenna, and the electronic device further includes a printed circuit board and a metal shrapnel. The metal shrapnel is fixed on the printed circuit board, and the metal composite board is electrically connected to the metal shrapnel.
在一种实现方式中，第一金属板与金属结构件是同一种金属材料。In an implementation manner, the first metal plate and the metal structure are the same metal material.
根据本申请实施例的电子设备，第一金属板与金属结构件之间没有电极电位差，因此，第一金属板和金属结构件之间不能形成原电池，从而可以提升金属结构件的防腐蚀能力。According to the electronic device of the embodiment of the present application, there is no electrode potential difference between the first metal plate and the metal structure. Therefore, no galvanic cell can be formed between the first metal plate and the metal structure, thereby improving the corrosion resistance of the metal structure. ability.
在一种实现方式中，第二金属板的厚度不超过0.3毫米。In one implementation, the thickness of the second metal plate does not exceed 0.3 mm.
根据本申请实施例的电子设备，可以提升金属复合板导电性的同时控制金属复合板的高度。According to the electronic device of the embodiment of the present application, the conductivity of the metal composite board can be improved while controlling the height of the metal composite board.
在一种实现方式中，金属复合板还包括第三金属板，第三金属板位于第一金属板与第二金属板之间，第二金属板的导电率大于第三金属板的导电率。In an implementation manner, the metal composite plate further includes a third metal plate, the third metal plate is located between the first metal plate and the second metal plate, and the conductivity of the second metal plate is greater than that of the third metal plate.
根据本申请实施例的电子设备，在一些情况下，具有更高导电率的金属无法直接固定在第一金属板上，可以通过第三金属板才能固定。电子设备采用导电率更高的金属，可以提高金属结构件电接触位置的导电性能。According to the electronic device of the embodiment of the present application, in some cases, metal with higher conductivity cannot be directly fixed on the first metal plate, and can be fixed only by the third metal plate. The electronic equipment adopts a metal with higher conductivity, which can improve the conductivity of the electrical contact position of the metal structure.
在一种实现方式中，金属复合板还包括第四金属板，第四金属板位于第一金属板与第三金属板之间。In an implementation manner, the metal composite plate further includes a fourth metal plate, and the fourth metal plate is located between the first metal plate and the third metal plate.
根据本申请实施例的电子设备，在一些情况下，具有导电率更高的金属无法直接固定在第一金属板上，可以通过多层金属板才能固定。电子设备采用导电率更高的金属，可以提高金属结构件电接触位置的导电性能。According to the electronic device of the embodiment of the present application, in some cases, the metal with higher conductivity cannot be directly fixed on the first metal plate, and can be fixed only by the multilayer metal plate. The electronic equipment adopts a metal with higher conductivity, which can improve the conductivity of the electrical contact position of the metal structure.
在一种实现方式中，第二金属板的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。第三金属板的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。In an implementation manner, the material of the second metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc. The material of the third metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
根据本申请实施例的电子设备，采用金作为第二金属板，可以提高金属结构件电接触位置的导电性能。According to the electronic device of the embodiment of the present application, gold is used as the second metal plate, which can improve the conductivity of the electrical contact position of the metal structure.
在一种实现方式中，电子设备为手机、穿戴式设备、显示屏设备、平板、电脑、或智能家庭终端。In one implementation, the electronic device is a mobile phone, a wearable device, a display device, a tablet, a computer, or a smart home terminal.
在一种实现方式中，第一金属板是镁合金或镁锂合金。In one implementation, the first metal plate is a magnesium alloy or a magnesium-lithium alloy.
根据本申请实施例的电子设备，采用镁合金或镁锂合金可以使终端设备的重量进一步减轻。According to the electronic device of the embodiment of the present application, the use of magnesium alloy or magnesium-lithium alloy can further reduce the weight of the terminal device.
第二方面，提供了一种电子设备，包括金属框、印刷电路板和金属复合板，金属框为金属结构件，其中：金属结构件包括电接触位置；金属复合板，包括第一金属板和第二金属板，第二金属板位于第一金属板的上方，第一金属板焊接在电接触位置；第一金属板与金属结构件的电极电位相同，或，第一金属板与金属结构件的电极电位差小于或等于0.5V；第二金属板的导电率大于第一金属板的导电率；第二金属板电连接印刷电路板。In a second aspect, an electronic device is provided, including a metal frame, a printed circuit board, and a metal composite board. The metal frame is a metal structural member, wherein: the metal structural member includes electrical contact positions; the metal composite board includes a first metal plate and The second metal plate, the second metal plate is located above the first metal plate, and the first metal plate is welded at the electrical contact position; the electrode potential of the first metal plate and the metal structure is the same, or, the first metal plate and the metal structure The electrode potential difference is less than or equal to 0.5V; the conductivity of the second metal plate is greater than that of the first metal plate; the second metal plate is electrically connected to the printed circuit board.
其中，金属框可以是电子设备的金属中框，金属边框或是金属背壳。The metal frame can be a metal middle frame, a metal frame or a metal back shell of an electronic device.
在一种实现方式中，金属框还可以包括金属中框和金属边框，金属中框可以与金属边框可以为一体结构。In an implementation manner, the metal frame may further include a metal middle frame and a metal frame, and the metal middle frame and the metal frame may be an integral structure.
在一种实现方式中，金属框还可以包括金属边框和金属背壳，金属边框和金属背壳可以为一体结构。In an implementation manner, the metal frame may further include a metal frame and a metal back shell, and the metal frame and the metal back shell may be an integral structure.
在一种实现方式中，电子设备还包括保护膜，保护膜位于第一金属板的上表面，第二金属板的大小小于第一金属板的大小。In an implementation manner, the electronic device further includes a protective film, the protective film is located on the upper surface of the first metal plate, and the size of the second metal plate is smaller than the size of the first metal plate.
在一种实现方式中，电子设备还包括电连接点，电连接点设置在有保护膜的区域。In an implementation manner, the electronic device further includes an electrical connection point, and the electrical connection point is arranged in an area with a protective film.
在一种实现方式中，金属结构件上表面设有表面保护层，表面保护层位于金属结构件和第一金属板之间。In an implementation manner, the upper surface of the metal structure is provided with a surface protection layer, and the surface protection layer is located between the metal structure and the first metal plate.
在一种实现方式中，第二金属板的四周被保护膜包围。In one implementation, the periphery of the second metal plate is surrounded by a protective film.
在一种实现方式中，保护膜包括第一保护膜和第二保护膜，第一保护膜为高分子有机物涂层，第二保护膜为表面绝缘疏水层。In one implementation, the protective film includes a first protective film and a second protective film, the first protective film is a polymer organic coating, and the second protective film is a surface insulating hydrophobic layer.
在一种实现方式中，第二金属板电连接印刷电路板，具体为：第二金属板通过金属弹片电连接印刷电路板。In an implementation manner, the second metal plate is electrically connected to the printed circuit board, specifically: the second metal plate is electrically connected to the printed circuit board through a metal elastic sheet.
在一种实现方式中，金属复合板还包括第三金属板，第三金属板位于第一金属板与第二金属板之间，第二金属板的导电率大于第三金属板的导电率。In an implementation manner, the metal composite plate further includes a third metal plate, the third metal plate is located between the first metal plate and the second metal plate, and the conductivity of the second metal plate is greater than that of the third metal plate.
根据本申请实施例的电子设备，在一些情况下，具有更高导电率的金属无法直接固定在第一金属板上，可以通过第三金属板才能固定。电子设备采用导电率更高的金属，可以提高金属结构件电接触位置的导电性能。According to the electronic device of the embodiment of the present application, in some cases, metal with higher conductivity cannot be directly fixed on the first metal plate, and can be fixed only by the third metal plate. The electronic equipment adopts a metal with higher conductivity, which can improve the conductivity of the electrical contact position of the metal structure.
在一种实现方式中，金属复合板还包括第四金属板，第四金属板位于第一金属板与第三金属板之间。In an implementation manner, the metal composite plate further includes a fourth metal plate, and the fourth metal plate is located between the first metal plate and the third metal plate.
根据本申请实施例的电子设备，在一些情况下，具有导电率更高的金属无法直接固定在第一金属板上，可以通过多层金属板才能固定。电子设备采用导电率更高的金属，可以提高金属结构件电接触位置的导电性能。According to the electronic device of the embodiment of the present application, in some cases, the metal with higher conductivity cannot be directly fixed on the first metal plate, and can be fixed only by the multilayer metal plate. The electronic equipment adopts a metal with higher conductivity, which can improve the conductivity of the electrical contact position of the metal structure.
在一种实现方式中，第二金属板的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。，第三金属板的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。In an implementation manner, the material of the second metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc. The material of the third metal plate can be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
根据本申请实施例的电子设备，采用金作为第二金属板，可以提高金属结构件电接触位置的导电性能。According to the electronic device of the embodiment of the present application, gold is used as the second metal plate, which can improve the conductivity of the electrical contact position of the metal structure.
在一种实现方式中，电子设备为手机、穿戴式设备、显示屏设备、平板、电脑、或智 能家庭终端。In one implementation, the electronic device is a mobile phone, wearable device, display device, tablet, computer, or smart home terminal.
第三方面，提供了一种电子设备，包括显示屏、金属框、印刷电路板、天线和金属复合板，其中天线包括天线辐射体，天线辐射体为金属结构件，金属结构件包括电接触位置；金属复合板，包括第一金属板和第二金属板，第一金属板电连接电接触位置；第一金属板与金属结构件的电极电位相同，或，第一金属板与金属结构件的电极电位差小于或等于0.5V；第二金属板位于第一金属板上方，第二金属板的导电率大于第一金属板的导电率；第二金属板通过金属弹片与金属框电连接。In a third aspect, an electronic device is provided, including a display screen, a metal frame, a printed circuit board, an antenna, and a metal composite board, wherein the antenna includes an antenna radiator, the antenna radiator is a metal structure, and the metal structure includes electrical contact positions The metal composite plate includes a first metal plate and a second metal plate, the first metal plate is electrically connected to the electrical contact position; the electrode potential of the first metal plate and the metal structure is the same, or, the first metal plate and the metal structure The electrode potential difference is less than or equal to 0.5V; the second metal plate is located above the first metal plate, and the conductivity of the second metal plate is greater than the conductivity of the first metal plate; the second metal plate is electrically connected to the metal frame through the metal spring.
在一种实现方式中，金属框用于支撑显示屏。In one implementation, the metal frame is used to support the display screen.
在一种实现方式中，金属框可以为金属中框。In one implementation, the metal frame may be a metal middle frame.
在一种实现方式中，电子设备还包括保护膜，保护膜位于第一金属板的上表面，第二金属板的大小小于第一金属板的大小。In an implementation manner, the electronic device further includes a protective film, the protective film is located on the upper surface of the first metal plate, and the size of the second metal plate is smaller than the size of the first metal plate.
在一种实现方式中，电子设备还包括电连接点，电连接点设置在有保护膜的区域。In an implementation manner, the electronic device further includes an electrical connection point, and the electrical connection point is arranged in an area with a protective film.
在一种实现方式中，金属结构件上表面设有表面保护层，表面保护层位于金属结构件和第一金属板之间。In an implementation manner, the upper surface of the metal structure is provided with a surface protection layer, and the surface protection layer is located between the metal structure and the first metal plate.
在一种实现方式中，第二金属板的四周被保护膜包围。In one implementation, the periphery of the second metal plate is surrounded by a protective film.
在一种实现方式中，保护膜包括第一保护膜和第二保护膜，第一保护膜为高分子有机物涂层，第二保护膜为表面绝缘疏水层。In one implementation, the protective film includes a first protective film and a second protective film, the first protective film is a polymer organic coating, and the second protective film is a surface insulating hydrophobic layer.
在一种实现方式中，第二金属板电连接印刷电路板，具体为：第二金属板通过金属弹片电连接印刷电路板。In an implementation manner, the second metal plate is electrically connected to the printed circuit board, specifically: the second metal plate is electrically connected to the printed circuit board through a metal elastic sheet.
在一种实现方式中，金属复合板还包括第三金属板，第三金属板位于第一金属板与第二金属板之间，第二金属板的导电率大于第三金属板的导电率。In an implementation manner, the metal composite plate further includes a third metal plate, the third metal plate is located between the first metal plate and the second metal plate, and the conductivity of the second metal plate is greater than that of the third metal plate.
在一种实现方式中，电子设备为手机、穿戴式设备、显示屏设备、平板、电脑、或智能家庭终端。In one implementation, the electronic device is a mobile phone, a wearable device, a display device, a tablet, a computer, or a smart home terminal.
第四方面，提供了一种电子设备的制备方法，电子设备包括金属结构件和金属复合板，金属结构件包括电接触位置；金属复合板包括第一金属板和第二金属板，第一金属板与金属结构件的电极电位相同或电极电位差小于或等于0.5V，第二金属板的导电率大于第一金属板，所述方法包括：将第一金属板放置到电接触位置；将第二金属板与电子设备中的电路电连接。In a fourth aspect, a method for manufacturing an electronic device is provided. The electronic device includes a metal structure and a metal composite plate, the metal structure includes electrical contact positions; the metal composite plate includes a first metal plate and a second metal plate, and the first metal The electrode potential of the plate and the metal structure is the same or the electrode potential difference is less than or equal to 0.5V, and the conductivity of the second metal plate is greater than that of the first metal plate. The method includes: placing the first metal plate at an electrical contact position; The second metal plate is electrically connected with the circuit in the electronic device.
在一种实现方式中，在将第一金属板放置到电接触位置后，制备方法还包括：通过焊接将复合板固定在电接触位置，并在金属复合板的焊接区域覆盖保护膜。In one implementation, after placing the first metal plate at the electrical contact position, the preparation method further includes: fixing the composite plate at the electrical contact position by welding, and covering the welding area of the metal composite plate with a protective film.
在一种实现方式中，在将第一金属板放置到电接触位置后，制备方法还包括：通过铆接将复合板固定在电接触位置，并在金属复合板的铆接区域覆盖保护膜。In one implementation, after placing the first metal plate at the electrical contact position, the preparation method further includes: fixing the composite plate at the electrical contact position by riveting, and covering the riveted area of the metal composite plate with a protective film.
在一种实现方式中，第二金属板的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。In an implementation manner, the material of the second metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
在一种实现方式中，金属复合板还包括第三金属板，第三金属板位于第一金属板与第二金属板之间，第二金属板的导电性高于第三金属板。In an implementation manner, the metal composite plate further includes a third metal plate, the third metal plate is located between the first metal plate and the second metal plate, and the conductivity of the second metal plate is higher than that of the third metal plate.
在一种实现方式中，第二金属板为金，第三金属板的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。In an implementation manner, the second metal plate is gold, and the material of the third metal plate may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
在一种实现方式中，第二金属板位于第一金属板的上表面及侧面。In one implementation, the second metal plate is located on the upper surface and the side surface of the first metal plate.
在一种实现方式中，第二金属板的厚度不超过0.3毫米。In one implementation, the thickness of the second metal plate does not exceed 0.3 mm.
在一种实现方式中，第一金属板与第二金属板是同一种金属材料。In one implementation, the first metal plate and the second metal plate are the same metal material.
在一种实现方式中，第一金属板是镁合金或镁锂合金。In one implementation, the first metal plate is a magnesium alloy or a magnesium-lithium alloy.
本申请实施例中，由于第一金属板位于金属结构件的电接触位置，且第一金属板与金属结构件的电极电位差较小，因此，第一金属板和金属结构件之间难以形成原电池，从而可以提升金属结构件的防腐蚀能力。In the embodiment of the present application, since the first metal plate is located at the electrical contact position of the metal structure, and the electrode potential difference between the first metal plate and the metal structure is small, it is difficult to form a connection between the first metal plate and the metal structure. The original battery can improve the corrosion resistance of the metal structure.
附图说明Description of the drawings
图1是本申请一个实施例提供的电子设备的侧剖图。Fig. 1 is a side sectional view of an electronic device provided by an embodiment of the present application.
图2是图1所示的电子设备的俯视图。Fig. 2 is a plan view of the electronic device shown in Fig. 1.
图3是本申请另一实施例提供的电子设备的侧剖图。FIG. 3 is a side sectional view of an electronic device provided by another embodiment of the application.
图4是图3所示的电子设备的俯视图。Fig. 4 is a plan view of the electronic device shown in Fig. 3.
图5是本申请一个实施例提供的电子设备的侧剖图。Figure 5 is a side cross-sectional view of an electronic device provided by an embodiment of the present application.
图6本申请一个实施例提供的金属复合板的结构示意图。Fig. 6 is a schematic structural diagram of a metal composite panel provided by an embodiment of the present application.
图7是本申请另一实施例提供的金属复合板的结构示意图。Fig. 7 is a schematic structural diagram of a metal composite panel provided by another embodiment of the present application.
图8是本申请一个实施例提供的电子设备器件之间电连接方式的示意图。FIG. 8 is a schematic diagram of an electrical connection mode between electronic equipment devices provided by an embodiment of the present application.
图9是本申请另一实施例提供的电子设备器件之间电连接方式的示意图。FIG. 9 is a schematic diagram of an electrical connection mode between electronic equipment devices according to another embodiment of the present application.
图10是本申请一个实施例提供的电子设备器件之间电连接方式的示意图。FIG. 10 is a schematic diagram of an electrical connection mode between electronic equipment devices according to an embodiment of the present application.
图11是本申请实施例的制备电子设备的示意性流程图。FIG. 11 is a schematic flowchart of preparing an electronic device according to an embodiment of the present application.
图12是本申请实施例制备出的电子设备的示意图。Fig. 12 is a schematic diagram of an electronic device prepared in an embodiment of the present application.
具体实施方式Detailed ways
下面将结合附图，对本申请中的技术方案进行描述。The technical solution in this application will be described below in conjunction with the drawings.
本申请实施例中的电子设备可以指任何采用金属作为结构件的电子设备，例如可以是移动终端(如手机)、穿戴式设备、显示屏设备(例如电视)、平板、电脑、智能家庭终端等电子设备。The electronic device in the embodiments of this application can refer to any electronic device that uses metal as a structural member, such as a mobile terminal (such as a mobile phone), a wearable device, a display device (such as a TV), a tablet, a computer, a smart home terminal, etc. Electronic equipment.
金属具有电极电位。不同金属之间的电极电位可能存在差异。Metal has electrode potential. There may be differences in electrode potential between different metals.
电子设备在使用过程中，金属结构件的电接触位置在潮湿环境中会产生电偶腐蚀，使电极电位低的金属腐蚀可能速度增加，电极电位高的金属可能被保护不发生腐蚀。During the use of electronic equipment, galvanic corrosion occurs at the electrical contact positions of metal structural parts in a humid environment, which may increase the corrosion rate of metals with low electrode potentials, and metals with high electrode potentials may be protected from corrosion.
电偶腐蚀电路的四个基本组成部分为：阴极，阳极，导体和电解质，在潮湿环境中，潮湿的空气就构成了基本组成部分的导体和电解质，而电接触位置的两种金属就可以构成基本组成部分的阴极和阳极。当电偶腐蚀电路形成电流回路时，高电极电位的金属作为阴极被保护，低电极电位的金属作为阳极被腐蚀。The four basic components of a galvanic corrosion circuit are: cathode, anode, conductor and electrolyte. In a humid environment, humid air constitutes the basic component of the conductor and electrolyte, and the two metals at the electrical contact position can constitute The basic components of the cathode and anode. When the galvanic corrosion circuit forms a current loop, the metal with high electrode potential is protected as the cathode, and the metal with low electrode potential is corroded as the anode.
本申请实施例中的电子设备，在金属结构件的电接触位置采用与金属结构件电极电位相同或相近的金属，没有或仅有微弱的电偶腐蚀产生，提升金属结构件电接触位置的防腐性能。The electronic equipment in the embodiments of the present application uses metal with the same or similar electrode potential as that of the metal structure at the electrical contact position of the metal structure. There is no or only weak galvanic corrosion, which improves the corrosion protection of the electrical contact position of the metal structure. performance.
本申请实施例中的金属结构件的材料可以是纯金属，也可以是合金。以合金为例，本申请实施例的金属结构件的材料例如可以是镁合金或镁锂合金。The material of the metal structure in the embodiments of the present application may be pure metal or alloy. Taking an alloy as an example, the material of the metal structure in the embodiments of the present application may be, for example, a magnesium alloy or a magnesium-lithium alloy.
下面结合附图，对本申请实施例进行详细描述。The embodiments of the present application will be described in detail below in conjunction with the drawings.
图1和图2示出了本申请一个实施例提供的电子设备100。Figures 1 and 2 show an electronic device 100 provided by an embodiment of the present application.
如图1和图2所示，电子设备100可以包括金属复合板110和金属结构件120。As shown in FIGS. 1 and 2, the electronic device 100 may include a metal composite board 110 and a metal structure 120.
金属结构件120包括电接触位置140，金属复合板110可以位于电接触位置140，与金属结构件120电连接。The metal structure 120 includes an electrical contact position 140, and the metal composite board 110 may be located at the electrical contact position 140 and is electrically connected to the metal structure 120.
其中，电接触位置140可以是金属结构件120与其他金属板电连接的位置。The electrical contact position 140 may be a position where the metal structure 120 is electrically connected to other metal plates.
具体地，金属复合板110可以包括第一金属板111和第二金属板112，第一金属板111的下表面位于电接触位置140；第一金属板111与金属结构件120的电极电位相同，或者，第一金属板111与金属结构件120的电极电位差小于或等于0.5V；第二金属板112的导电率大于第一金属板111的导电率，第二金属板112用于与电子设备上的电路电连接。例如，第二金属板112可以与电子设备上的天线辐射体电连接，或者第二金属板112可以与电子设备的印刷电路板电连接。Specifically, the metal composite plate 110 may include a first metal plate 111 and a second metal plate 112. The lower surface of the first metal plate 111 is located at the electrical contact position 140; the electrode potential of the first metal plate 111 and the metal structure 120 are the same, Alternatively, the electrode potential difference between the first metal plate 111 and the metal structure 120 is less than or equal to 0.5V; the conductivity of the second metal plate 112 is greater than the conductivity of the first metal plate 111, and the second metal plate 112 is used to interact with the electronic device Electrical connection on the circuit. For example, the second metal plate 112 may be electrically connected to an antenna radiator on the electronic device, or the second metal plate 112 may be electrically connected to a printed circuit board of the electronic device.
其中，第一金属板111的下表面位于电接触位置140，可以为：第一金属板111通过电接触位置140电连接金属结构件120。Wherein, the lower surface of the first metal plate 111 is located at the electrical contact position 140, which may be: the first metal plate 111 is electrically connected to the metal structure 120 through the electrical contact position 140.
其中，第二金属板112位于第一金属板111的上方。The second metal plate 112 is located above the first metal plate 111.
在一种实现方式中，第二金属板112可以位于第一金属板111的上表面。In one implementation, the second metal plate 112 may be located on the upper surface of the first metal plate 111.
在一种实现方式中，第一金属板111可以选取与金属结构件120相同的金属，若金属结构件120采用合金材料，则第一金属板111可以选取与金属结构件120材质相同(例如，可以是相同牌号)的合金。In one implementation, the first metal plate 111 can be selected from the same metal as the metal structural member 120. If the metal structural member 120 is made of an alloy material, the first metal plate 111 can be selected from the same material as the metal structural member 120 (for example, Can be the same grade) alloy.
在一种实现方式中，第二金属板112可以是具有低阻抗和耐腐蚀特性的金属。可以利用第二金属板112的材料特性实现金属结构件电接触位置140的低阻抗要求，例如：第二金属板112采用铜，则金属结构件120可以获得铜材料属性的导电效果；第二金属板112采用镍，则金属结构件120可以获得镍材料属性的导电效果；第二金属板112采用金，则金属结构件120可以获得金材料属性的导电效果。In one implementation, the second metal plate 112 may be a metal with low resistance and corrosion resistance characteristics. The material properties of the second metal plate 112 can be used to achieve the low impedance requirement of the electrical contact position 140 of the metal structure. For example, if the second metal plate 112 uses copper, the metal structure 120 can obtain the conductive effect of the copper material property; If the plate 112 is nickel, the metal structure 120 can obtain the conductive effect of the nickel material; if the second metal plate 112 is gold, the metal structure 120 can obtain the conductive effect of the gold material.
在一种实现方式中，第二金属板112厚度不超过0.3毫米。In one implementation, the thickness of the second metal plate 112 does not exceed 0.3 mm.
在一种实现方式中，金属结构件120的上表面可以设有表面保护层121。表面保护层121位于金属结构件120和第一金属板111之间。其中，表面保护层121可以采用表面处理、表面改性和表面涂镀等方式来获得，从而达到防止金属结构件腐蚀的目的。In an implementation manner, the upper surface of the metal structure 120 may be provided with a surface protection layer 121. The surface protection layer 121 is located between the metal structure 120 and the first metal plate 111. Wherein, the surface protection layer 121 can be obtained by surface treatment, surface modification, surface coating, etc., so as to achieve the purpose of preventing corrosion of the metal structure.
其中，金属复合板110还可以包括至少一个电连接点130。金属复合板110和金属结构件120可以通过电连接点130固定。在一种实现方式中，可以通过制备工艺在至少一个电连接点130处将金属复合板110固定在金属结构件120的电接触位置140。The metal composite board 110 may further include at least one electrical connection point 130. The metal composite board 110 and the metal structure 120 may be fixed by an electrical connection point 130. In an implementation manner, the metal composite plate 110 can be fixed to the electrical contact position 140 of the metal structure 120 at at least one electrical connection point 130 through a preparation process.
在一种实现方式中，在至少一个电连接点130处所采用的制备工艺可以是通过熔焊、铆接或导电胶等方式，通过这些制备工艺可以将金属复合板110固定在金属结构件120的电接触位置140。由于这些制备方式所采用的均是金属或其他导电材料，所以第一金属板111可以与金属结构件120电连接。In an implementation manner, the preparation process used at the at least one electrical connection point 130 may be by welding, riveting, or conductive adhesive. Through these preparation processes, the metal composite plate 110 can be fixed to the electrical connection of the metal structure 120. Contact location 140. Since these preparation methods use metal or other conductive materials, the first metal plate 111 can be electrically connected to the metal structure 120.
如图1和图2所示，若金属复合板110的固定方式采用熔焊，则至少一个电连接点130为熔接焊池；若金属复合板110的固定方式采用铆接，则至少一个电连接点130为铆钉。As shown in Figures 1 and 2, if the metal composite plate 110 is fixed by fusion welding, at least one electrical connection point 130 is a welding pool; if the metal composite plate 110 is fixed by riveting, at least one electrical connection point 130 is a rivet.
其中，电子设备可以通过在4个电连接点130处将金属复合板110固定在金属结构件120的电接触位置140。The electronic device can fix the metal composite board 110 at the electrical contact position 140 of the metal structure 120 at the four electrical connection points 130.
可以将与金属结构件120的电极电位差小于或等于0.5V的第一金属板111和具有导电性优于第一金属板111的第二金属板112连接形成金属复合板110。为了将金属复合板110固定在金属结构件120的电接触位置140(例如电接触位置140可以为天线馈电点位置 或接地点位置)，可以使用焊接工艺、铆接工艺或其他工艺。其中，在潮湿环境下，金属复合板的第一金属板111与金属结构120件电连接，直接与镁合金或镁锂合金形成原电池效应，由于电极电位差为0(或接近0)，电接触位置140在潮湿环境中的原电池效应未形成(或接近未形成)，不产生电偶腐蚀。金属复合板的第二金属板112为外露面，实现与其他电路电连接。金属复合板110未与金属结构件120形成原电池效应；可以实现金属结构件120电接触位置140既可以抗腐蚀又能实现良好导电性。The first metal plate 111 whose electrode potential difference with the metal structure 120 is less than or equal to 0.5V and the second metal plate 112 which has better conductivity than the first metal plate 111 can be connected to form the metal composite plate 110. In order to fix the metal composite board 110 at the electrical contact position 140 of the metal structure 120 (for example, the electrical contact position 140 may be an antenna feed point position or a ground point position), a welding process, a riveting process or other processes can be used. Among them, in a humid environment, the first metal plate 111 of the metal composite plate is electrically connected to 120 pieces of the metal structure, and directly forms a galvanic effect with the magnesium alloy or magnesium-lithium alloy. Since the electrode potential difference is 0 (or close to 0), the electric The galvanic effect of the contact location 140 in a humid environment is not formed (or nearly not formed), and no galvanic corrosion is generated. The second metal plate 112 of the metal composite plate is an exposed surface to realize electrical connection with other circuits. The metal composite plate 110 does not form a galvanic effect with the metal structure 120; it can be realized that the electrical contact position 140 of the metal structure 120 can not only resist corrosion but also achieve good conductivity.
图3和图4示出了本申请另一种实施例提供的电子设备100。Figures 3 and 4 show an electronic device 100 provided by another embodiment of the present application.
如图3和图4所示，给出了另一种电子设备100的示意图，金属复合板110还可以包括保护膜113。保护膜113可以位于第一金属板111的上表面。As shown in FIG. 3 and FIG. 4, a schematic diagram of another electronic device 100 is given, and the metal composite board 110 may further include a protective film 113. The protective film 113 may be located on the upper surface of the first metal plate 111.
具体的，保护膜113位于第一金属板111的上表面，这里的上表面为未有第二金属板112的上表面。请参阅图3，第二金属板112和保护膜113共同位于第一金属板111的上表面。其中，第二金属板112的大小小于第一金属板111的大小。电连接点130设置在有保护膜113的区域。Specifically, the protective film 113 is located on the upper surface of the first metal plate 111, where the upper surface is the upper surface without the second metal plate 112. Please refer to FIG. 3, the second metal plate 112 and the protective film 113 are located on the upper surface of the first metal plate 111 together. The size of the second metal plate 112 is smaller than the size of the first metal plate 111. The electrical connection point 130 is provided in the area where the protective film 113 is provided.
其中，电连接点130的作用可以是将金属复合板110固定在金属结构件120上方，金属复合板110与金属结构件120电连接，所采用的方式可以是焊接，铆接或是打孔涂导电胶等方式。Among them, the function of the electrical connection point 130 can be to fix the metal composite plate 110 above the metal structure 120, and the metal composite plate 110 is electrically connected to the metal structure 120. The method used can be welding, riveting or punching and coating. Glue and other ways.
在一些实现方式中，电连接点130可以贯穿保护膜113和第一金属板111，然后与金属结构件120电连接。In some implementations, the electrical connection point 130 may penetrate through the protective film 113 and the first metal plate 111 and then be electrically connected to the metal structure 120.
在一种实现方式中，保护膜113可以覆盖在电连接点130上表面，电连接点130、第一金属板111，然后与金属结构件120电连接。In an implementation manner, the protective film 113 may cover the upper surface of the electrical connection point 130, the electrical connection point 130, the first metal plate 111, and then are electrically connected to the metal structure 120.
在一种实现方式中，可以采用点胶或附着的方式对至少一个电连接点130所形成的区域覆盖保护膜113。In an implementation manner, the protective film 113 may be covered on the area formed by the at least one electrical connection point 130 by dispensing or attaching.
在一种实现方式中，保护膜113可以包括第一保护膜114和第二保护膜115。In one implementation, the protective film 113 may include a first protective film 114 and a second protective film 115.
其中，第一保护膜114可以为高分子有机物涂层，例如高分子有机物涂层可以为油墨或聚胺酯。第二保护膜115可以是表面绝缘疏水层，例如表面绝缘疏水层可以为防指纹(Anti-fingerprint，AF)疏水镀膜层。其中，第二保护膜115可以位于第一保护膜114的上表面。The first protective film 114 may be a polymer organic coating, for example, the polymer organic coating may be ink or polyurethane. The second protective film 115 may be a surface insulating hydrophobic layer, for example, the surface insulating hydrophobic layer may be an anti-fingerprint (AF) hydrophobic coating layer. The second protective film 115 may be located on the upper surface of the first protective film 114.
续请参阅图3，第二金属板112的侧面(也可以理解为第二金属板112的四周)被第一保护膜114和第二保护膜115包围，这样可以避免第二金属板112与第一金属板111形成电偶腐蚀电路，或，可以避免第二金属板112与金属结构件120形成电偶腐蚀电路。3, the side of the second metal plate 112 (which can also be understood as the periphery of the second metal plate 112) is surrounded by the first protective film 114 and the second protective film 115, which can prevent the second metal plate 112 from being A metal plate 111 forms a galvanic corrosion circuit, or it can prevent the second metal plate 112 and the metal structure 120 from forming a galvanic corrosion circuit.
其中，第一保护膜114的作用可以为阻止第一金属板111与第二金属板112连接处形成电偶腐蚀电路。第二保护膜115的作用为阻止第一金属板111的表面与第二金属板112的表面形成电偶腐蚀电路，也可以阻止第一金属板111与第二金属板112连接处形成电偶腐蚀电路。第一保护膜114和第二保护膜115也可以阻止第二金属板112与金属结构件120形成电偶腐蚀电路。The function of the first protective film 114 may be to prevent the formation of a galvanic corrosion circuit at the connection between the first metal plate 111 and the second metal plate 112. The function of the second protective film 115 is to prevent the surface of the first metal plate 111 and the surface of the second metal plate 112 from forming a galvanic corrosion circuit, and can also prevent the formation of galvanic corrosion at the junction of the first metal plate 111 and the second metal plate 112 Circuit. The first protective film 114 and the second protective film 115 can also prevent the second metal plate 112 and the metal structure 120 from forming a galvanic corrosion circuit.
在一种实现方式中，第一保护膜114可以为油墨膜，第二保护膜115可以为防指纹(Anti-fingerprint，AF)疏水镀膜，两者的结合使保护膜113具有很好的耐磨性和防腐蚀性。In one implementation, the first protective film 114 may be an ink film, and the second protective film 115 may be an anti-fingerprint (AF) hydrophobic coating. The combination of the two makes the protective film 113 have good wear resistance. Resistance and corrosion resistance.
在一种实现方式中，保护膜113可以覆盖金属复合板110的四周，可以包括上表面及侧面，只露出第二金属板112。金属结构件120可以通过金属复合板110与电子设备100 上的其他电路电连接(例如与印刷电路板电连接)，这样可以获得更好防腐蚀性。In one implementation, the protective film 113 may cover the periphery of the metal composite board 110, may include the upper surface and the side surface, and only expose the second metal board 112. The metal structure 120 can be electrically connected to other circuits on the electronic device 100 (for example, electrically connected to a printed circuit board) through the metal composite board 110, so that better corrosion resistance can be obtained.
通过在金属复合板110上的至少一个电连接点130所形成的区域覆盖保护膜113的方式，可以有效阻止第二金属板112和第一金属板111及金属结构件120通过表面形成电偶腐蚀电路，防腐蚀效果更好。同时，金属结构件120可以通过在金属复合板110上未覆盖保护膜113的第二金属板112的区域与电子设备的其他电路电连接，例如第二金属板112可以与电子设备的天线电流回路电连接。By covering the area formed by at least one electrical connection point 130 on the metal composite plate 110 with the protective film 113, the second metal plate 112, the first metal plate 111 and the metal structure 120 can be effectively prevented from forming galvanic corrosion on the surface. The circuit has better anti-corrosion effect. At the same time, the metal structure 120 can be electrically connected to other circuits of the electronic device through the area of the second metal plate 112 that is not covered with the protective film 113 on the metal composite board 110. For example, the second metal plate 112 can be connected to the antenna current loop of the electronic device. Electric connection.
应理解，金属结构件120可以是其他形状的金属结构件(例如圆形、方形或矩形的金属结构件)。实施例中的示意图仅作为举例使用，并不限制金属结构件120的具体形状，如图5所示，金属结构件120还可以是凹槽的结构。It should be understood that the metal structure 120 may be a metal structure of other shapes (for example, a circular, square, or rectangular metal structure). The schematic diagram in the embodiment is only used as an example, and does not limit the specific shape of the metal structure 120. As shown in FIG. 5, the metal structure 120 may also have a groove structure.
如图6所示，是本申请一个实施例提供的金属复合板的结构示意图，金属复合板110可以包括第一金属板111和第二金属板112，第二金属板112可以位于第一金属板111的上表面及侧面。在一种实现方式中，如图6所示，第一金属板111上表面的第二金属板112可以与第一金属板111的四周的第二金属板112大小可以不同。As shown in FIG. 6, it is a schematic structural diagram of a metal composite plate provided by an embodiment of the present application. The metal composite plate 110 may include a first metal plate 111 and a second metal plate 112, and the second metal plate 112 may be located on the first metal plate. 111 on the upper surface and side. In an implementation manner, as shown in FIG. 6, the second metal plate 112 on the upper surface of the first metal plate 111 may be different in size from the second metal plate 112 around the first metal plate 111.
其中，第二金属板112可以是具有良好的导电性能和抗腐蚀性能的金属，可以进一步增加电子设备的防腐蚀性能。Wherein, the second metal plate 112 can be a metal with good electrical conductivity and corrosion resistance, which can further increase the corrosion resistance of the electronic device.
在一种实现方式中，第二金属板112的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。In an implementation manner, the material of the second metal plate 112 may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
在一种实现方式中，第一金属板111可以通过电镀或热扩散的方式覆盖第二金属板112。In one implementation, the first metal plate 111 may cover the second metal plate 112 by means of electroplating or thermal diffusion.
如图7所示，是本申请另一实施例提供的金属复合板的结构示意图，金属复合板110还可以包括第三金属板116。As shown in FIG. 7, it is a schematic structural diagram of a metal composite plate provided by another embodiment of the present application. The metal composite plate 110 may further include a third metal plate 116.
第三金属板116可以位于第一金属板111与第二金属板112之间，其中第二金属板112的导电率大于第三金属板116的导电率。在一些情况下，例如采用电镀工艺时，第二金属板112可能无法电镀至第一金属板111表面，需要先将第三金属板116电镀到第一金属板111表面，再将第二金属板112电镀到第三金属板116表面。The third metal plate 116 may be located between the first metal plate 111 and the second metal plate 112, wherein the conductivity of the second metal plate 112 is greater than that of the third metal plate 116. In some cases, for example, when an electroplating process is used, the second metal plate 112 may not be electroplated to the surface of the first metal plate 111, and the third metal plate 116 needs to be electroplated onto the surface of the first metal plate 111, and then the second metal plate 112 is electroplated to the surface of the third metal plate 116.
在一种实现方式中，金属复合板110还包括第四金属板，第四金属板位于第一金属板111与第三金属板116之间或第二金属板112与第三金属板116之间。In an implementation manner, the metal composite plate 110 further includes a fourth metal plate, and the fourth metal plate is located between the first metal plate 111 and the third metal plate 116 or between the second metal plate 112 and the third metal plate 116.
根据本申请实施例的电子设备，在一些情况下，具有导电率更高的金属无法直接固定在第一金属板111或第三金属板116上，可能需要通过多层金属板固定。其中第三金属板116和第四金属板的导电率可以不做限制。电子设备采用导电率更高的金属，可以提高金属结构件电接触位置140的导电性能。According to the electronic device of the embodiment of the present application, in some cases, the metal with higher conductivity cannot be directly fixed on the first metal plate 111 or the third metal plate 116, and may need to be fixed by a multilayer metal plate. The conductivity of the third metal plate 116 and the fourth metal plate may not be limited. The electronic device uses a metal with higher conductivity, which can improve the conductivity of the electrical contact position 140 of the metal structure.
在一种实现方式总，第二金属板112的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属，第三金属板116的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属，第四金属板的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。In an implementation manner, the material of the second metal plate 112 can be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, and the material of the third metal plate 116 can be copper, nickel, gold, or silver. , Palladium nickel and other metals with high conductivity, the material of the fourth metal plate can be copper, nickel, gold, silver, palladium nickel and other metals with high conductivity.
金属结构件通过金属复合板110与电子设备上的电路电连接的方式有很多种，例如，电接触、耦合、焊接或者导电胶等方式，本申请实施例对此并不限定。There are many ways for the metal structure to be electrically connected to the circuit on the electronic device through the metal composite board 110, such as electrical contact, coupling, welding, or conductive glue, which is not limited in the embodiment of the present application.
图8和图9示出了是本申请实施例提供的电子设备器件之间两种不同的电连接方式的示意图。Figures 8 and 9 show schematic diagrams of two different electrical connection modes between electronic equipment devices provided by embodiments of the present application.
如图8所示，给出了一种电子设备100中金属结构件120与其他电路的电连接方式。As shown in FIG. 8, a method of electrical connection between the metal structure 120 in the electronic device 100 and other circuits is given.
其中，金属结构件120可以是电子设备的天线，具体的金属结构件120可以为电子设 备天线的辐射体。Wherein, the metal structure 120 may be an antenna of an electronic device, and the specific metal structure 120 may be a radiator of an antenna of the electronic device.
在一种实现方式中，天线可以包括辐射体，馈电网络，馈电点和接地点。In one implementation, the antenna may include a radiator, a feeding network, a feeding point, and a grounding point.
电子设备100还可以包括边框702，金属弹片703和连接板704。The electronic device 100 may further include a frame 702, a metal dome 703, and a connecting plate 704.
金属结构件120可以通过卡扣或者纳米注塑等方式与边框702连接，连接板704上固定有金属弹片703。The metal structure 120 can be connected to the frame 702 by means of snapping or nano-injection, and a metal spring 703 is fixed on the connecting plate 704.
在一种实现方式中，金属弹片703可以通过焊接的方式固定在连接板704上。In an implementation manner, the metal elastic piece 703 may be fixed on the connecting plate 704 by welding.
在一种实现方式中，电子设备在组装时，金属结构件120与金属弹片703压合，金属弹片703具有弹性，金属结构件120固定后，金属弹片703可以与位于金属结构件的电接触位置140的金属复合板110电连接。In one implementation, when the electronic device is assembled, the metal structure 120 is pressed against the metal elastic piece 703. The metal elastic piece 703 has elasticity. After the metal structure 120 is fixed, the metal elastic piece 703 can be in electrical contact with the metal structure. The 140 of the metal composite board 110 is electrically connected.
在一种实现方式中，金属结构件120的电接触位置140可以是天线的接地点或是馈电点。In one implementation, the electrical contact position 140 of the metal structure 120 may be the ground point or the feed point of the antenna.
若电接触位置140是天线的接地点，则连接板704可以是金属中框或是印刷电路板(Printed Circuit Board,PCB)。金属结构件120作为天线辐射体，其中天线辐射体可以与金属复合板110电连接，金属复合板110又与金属弹片703电连接，而金属弹片703固定在连接板704上(例如金属弹片703与金属中框连接，或，金属弹片703与印刷电路板的金属涂层连接)，从而实现天线接地点接地。其中，金属涂层可以是指印刷电路板的铺铜层。If the electrical contact position 140 is the ground point of the antenna, the connecting board 704 may be a metal middle frame or a printed circuit board (PCB). The metal structure 120 is used as an antenna radiator, wherein the antenna radiator can be electrically connected to the metal composite plate 110, and the metal composite plate 110 is electrically connected to the metal elastic piece 703, and the metal elastic piece 703 is fixed on the connecting plate 704 (for example, the metal elastic piece 703 and The metal middle frame is connected, or the metal spring 703 is connected to the metal coating of the printed circuit board), so that the antenna ground point is grounded. Among them, the metal coating may refer to the copper layer of the printed circuit board.
若电接触位置140是天线的馈电点，连接板704可以是PCB(Printed circuit board)。其中，PCB可以作为天线的辐射体，金属结构件120可以作为天线的馈电点，天线的馈电点可以与金属复合板110电连接，金属复合板110又与金属弹片703电连接，而金属弹片703固定在连接板704上，从而实现PCB与金属结构件120电连接。如图9所示，给出了另一种电子设备100中金属结构件120与其他电路的电连接方式，电子设备100还可以包括天线701。If the electrical contact position 140 is the feed point of the antenna, the connection board 704 may be a printed circuit board (PCB). Among them, the PCB can be used as the radiator of the antenna, the metal structure 120 can be used as the feed point of the antenna, the feed point of the antenna can be electrically connected to the metal composite board 110, and the metal composite board 110 is electrically connected to the metal shrapnel 703. The elastic piece 703 is fixed on the connecting plate 704 so as to realize the electrical connection between the PCB and the metal structure 120. As shown in FIG. 9, another electrical connection manner of the metal structure 120 and other circuits in the electronic device 100 is given. The electronic device 100 may also include an antenna 701.
其中，金属结构件120可以为电子设备100的金属中框。金属中框可以支撑显示屏。在一种实现方式中，中框可以位于显示屏和印刷电路板之间。The metal structure 120 may be a metal middle frame of the electronic device 100. The metal middle frame can support the display screen. In one implementation, the middle frame may be located between the display screen and the printed circuit board.
在一种实现方式中，天线可以包括辐射体，馈电网络，馈电点和接地点。In one implementation, the antenna may include a radiator, a feeding network, a feeding point, and a grounding point.
在一种实现方式中，天线701可以固定在电子设备100的后盖或者与电子设备边框通过卡扣或纳米注塑等方式固定，金属弹片703固定在天线701的馈电点或接地点处。In an implementation manner, the antenna 701 can be fixed to the back cover of the electronic device 100 or fixed to the frame of the electronic device by means of snaps or nano-injection, and the metal spring 703 is fixed at the feed point or ground point of the antenna 701.
在一种实现方式中，金属弹片703可以通过焊接的方式固定在天线的馈电点或接地点处。In an implementation manner, the metal dome 703 may be fixed at the feed point or ground point of the antenna by welding.
在一种实现方式中，金属结构件120与金属复合板110电连接，金属复合板110与金属弹片703压合。其中，金属弹片703具有弹性，天线辐射体701与金属弹片703电连接。In one implementation, the metal structure 120 is electrically connected to the metal composite plate 110, and the metal composite plate 110 is pressed against the metal elastic sheet 703. The metal elastic piece 703 is elastic, and the antenna radiator 701 is electrically connected to the metal elastic piece 703.
在一种实现方式中，金属弹片703一端与天线701(例如天线701可以为辐射体)连接，金属结构件120可以是PCB(例如金属结构件120为PCB板的金属涂层)，天线701可以通过金属弹片703与金属复合板110电连接，金属复合板110又与金属结构件120电连接，从而实现天线701与金属结构件120电连接。In one implementation, one end of the metal elastic piece 703 is connected to the antenna 701 (for example, the antenna 701 may be a radiator), the metal structure 120 may be a PCB (for example, the metal structure 120 is a metal coating of the PCB board), and the antenna 701 may The metal elastic sheet 703 is electrically connected to the metal composite board 110, and the metal composite board 110 is electrically connected to the metal structure 120, so that the antenna 701 and the metal structure 120 are electrically connected.
图10给出了一种电子设备100中金属结构件120与其他电路的电连接方式。FIG. 10 shows an electrical connection mode of the metal structure 120 in the electronic device 100 with other circuits.
如图10所示，金属结构件120可以是电子设备的金属框，金属结构件120可以是电子设备的天线的辐射枝节。As shown in FIG. 10, the metal structure 120 may be a metal frame of an electronic device, and the metal structure 120 may be a radiating stub of an antenna of the electronic device.
其中，金属框可以是金属中框，金属边框或金属背壳。Among them, the metal frame can be a metal middle frame, a metal frame or a metal back shell.
在一种实现方式中，金属中框可以与金属边框可以为一体结构，金属框包括金属中框和金属边框。In an implementation manner, the metal middle frame and the metal frame may be an integral structure, and the metal frame includes the metal middle frame and the metal frame.
在一种实现方式中，金属边框和金属背壳可以为一体结构，金属框包括金属边框和金属背壳。In one implementation, the metal frame and the metal back shell may be an integral structure, and the metal frame includes the metal frame and the metal back shell.
电子设备100可以包括多个金属复合板。如图10所示，电子设备包括金属复合板1101和金属复合板1102。具体的金属复合板的结构可以参见上述实施例中对金属复合板110的描述，此处不再详述。The electronic device 100 may include a plurality of metal composite boards. As shown in FIG. 10, the electronic device includes a metal composite board 1101 and a metal composite board 1102. For the specific structure of the metal composite board, reference may be made to the description of the metal composite board 110 in the foregoing embodiment, which will not be detailed here.
在一种实现方式中，金属复合板1101与金属结构件120通过电接触位置电连接，金属复合板1101的第二金属板可以通过弹片与PCB电连接。金属复合板1102与金属结构件120通过电接触位置电连接，金属复合板1102的第二金属板可以通过另一弹片与PCB电连接。In an implementation manner, the metal composite board 1101 and the metal structure 120 are electrically connected through electrical contact positions, and the second metal plate of the metal composite board 1101 may be electrically connected to the PCB through an elastic sheet. The metal composite board 1102 and the metal structure 120 are electrically connected through electrical contact positions, and the second metal plate of the metal composite board 1102 can be electrically connected to the PCB through another elastic sheet.
电子设备100还可以包括PCB(Printed Circuit Board)705和器件706。其中，器件706可以是电源管理芯片，谐振器，双工器，或开关等电子元件。The electronic device 100 may also include a PCB (Printed Circuit Board) 705 and a device 706. Among them, the device 706 may be an electronic component such as a power management chip, a resonator, a duplexer, or a switch.
在一种实现方式中，金属复合板1101所在的电接触位置可以是金属结构件120的馈电位置，电子设备100可以通过器件706，PCB705，金属弹片7031与金属复合板1101为金属结构件120馈电。In one implementation, the electrical contact position where the metal composite board 1101 is located may be the feeding position of the metal structure 120, and the electronic device 100 may be the metal structure 120 through the device 706, the PCB705, the metal spring 7031 and the metal composite board 1101. Feed.
在一种实现方式中，金属复合板1102所在的电接触位置可以是金属结构件120的接地位置，金属结构件可以通过金属复合板1102，弹片7032与PCB705电接触，接地。In an implementation manner, the electrical contact position where the metal composite board 1102 is located may be the grounding position of the metal structure 120, and the metal structure may be in electrical contact with the PCB 705 through the metal composite board 1102 and the elastic sheet 7032 to be grounded.
图11是本申请实施例的制备电子设备的示意性流程图。FIG. 11 is a schematic flowchart of preparing an electronic device according to an embodiment of the present application.
如图11所示，方法900可以包括：As shown in FIG. 11, the method 900 may include:
S901，提供金属结构件120，金属结构件120包括电接触位置140。S901, a metal structure 120 is provided, and the metal structure 120 includes an electrical contact position 140.
S902，提供金属复合板110，金属复合板110包括第一金属板111和第二金属板112，第二金属板位于第一金属板的上表面，第一金属板111与金属结构件的电极电位相等或电极电位差小于或等于0.5V，第二金属板112的导电率大于第一金属板111的导电率。S902. Provide a metal composite plate 110. The metal composite plate 110 includes a first metal plate 111 and a second metal plate 112. The second metal plate is located on the upper surface of the first metal plate. The electrode potential of the first metal plate 111 and the metal structure is When equal or the electrode potential difference is less than or equal to 0.5V, the conductivity of the second metal plate 112 is greater than the conductivity of the first metal plate 111.
在一种实现方式中，第一金属板111可以选取与金属结构件120相同的金属，若金属结构件120采用合金材料，则第一金属板优选与金属结构件材质相同的(可以是相同牌号)合金。In an implementation manner, the first metal plate 111 can be selected from the same metal as the metal structural member 120. If the metal structural member 120 is made of an alloy material, the first metal plate is preferably made of the same material as the metal structural member (may be of the same brand). )alloy.
在一种实现方式中，第二金属板112可以具有低阻抗和耐腐蚀的特性。可以利用第二金属板112的材料特性实现金属结构件电接触位置140的低阻抗要求，例如：第二金属板112采用铜，则金属结构件120可以获得铜材料属性的导电效果；第二金属板112采用镍，则金属结构件120可以获得镍材料属性的导电效果；第二金属板112采用金，则金属结构件120可以获得金材料属性的导电效果。In one implementation, the second metal plate 112 may have low impedance and corrosion resistance characteristics. The material properties of the second metal plate 112 can be used to achieve the low impedance requirement of the electrical contact position 140 of the metal structure. For example, if the second metal plate 112 uses copper, the metal structure 120 can obtain the conductive effect of the copper material property; If the plate 112 is nickel, the metal structure 120 can obtain the conductive effect of the nickel material; if the second metal plate 112 is gold, the metal structure 120 can obtain the conductive effect of the gold material.
第二金属板112的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。The material of the second metal plate 112 may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
在一种实现方式中，在制备金属复合板110的过程中，首先可以采用冲切、锯切、锻压或计算机数控技术(Computerized Numerical Control,CNC)按照需求的形状及尺寸对第一金属板进行加工。加工完成后，可以通过电镀或热扩散的方式将第二金属板固定在第一金属板上。将形成的金属复合板按照电接触面积尺寸大小进行下料冲切，完成金属复合板的制备。In one implementation, in the process of preparing the metal composite plate 110, punching, sawing, forging or computerized numerical control technology (Computerized Numerical Control, CNC) can be used to process the first metal plate according to the required shape and size. Processing. After the processing is completed, the second metal plate can be fixed on the first metal plate by electroplating or thermal diffusion. The formed metal composite board is blanked and punched according to the size of the electrical contact area to complete the preparation of the metal composite board.
S903，将第一金属板111的下表面放置到电接触位置140，将第二金属板112与电子设备中的其他电路电连接。S903: Place the lower surface of the first metal plate 111 at the electrical contact position 140, and electrically connect the second metal plate 112 with other circuits in the electronic device.
如图12所示的结构中，通过夹治具将金属复合板110定位固定在金属结构件电接触位置140，可以采用采用熔焊(如激光点焊)连接、铆接连接或导电胶的方式将金属复合板110与金属结构件120进行电连接，形成高强连接的一体结构。In the structure shown in Figure 12, the metal composite plate 110 is positioned and fixed at the electrical contact position 140 of the metal structure by a clamp, and the method of welding (such as laser spot welding) connection, riveting connection or conductive glue can be adopted. The metal composite board 110 is electrically connected to the metal structure 120 to form a high-strength connected integrated structure.
在一种实现方式中，在一些实施例中，制备方法还可以包括：通过焊接或铆接将复合板固定在电接触位置140，并在金属复合板的焊接区域或铆接区域覆盖保护膜。In an implementation manner, in some embodiments, the preparation method may further include: fixing the composite board at the electrical contact position 140 by welding or riveting, and covering the welding area or riveting area of the metal composite board with a protective film.
在一种实现方式中，在一些实施例中，制备方法还可以包括：将金属复合板110固定后，还可以对第二金属板进行削薄，使第二金属板112厚度不超过0.3毫米，进而可以使金属复合板的厚度降低。In an implementation manner, in some embodiments, the preparation method may further include: after the metal composite plate 110 is fixed, the second metal plate may be thinned so that the thickness of the second metal plate 112 does not exceed 0.3 mm, Furthermore, the thickness of the metal composite board can be reduced.
在一种实现方式中，采用CNC铣削的方式对第二金属板112进行削薄。In an implementation manner, the second metal plate 112 is thinned by CNC milling.
在一种实现方式中，在一些实施例中，为提升金属复合板的导电特性，制备方法还可以包括：金属复合板还包括第三金属板116，第三金属板116位于第一金属板111与第二金属板112之间，如图7所示。In an implementation manner, in some embodiments, in order to improve the conductive characteristics of the metal composite plate, the preparation method may further include: the metal composite plate further includes a third metal plate 116, and the third metal plate 116 is located on the first metal plate 111. And the second metal plate 112, as shown in FIG.
在一种实现方式中，金属复合板110还包括第四金属板，第四金属板位于第一金属板111与第三金属板116之间。In an implementation manner, the metal composite plate 110 further includes a fourth metal plate, and the fourth metal plate is located between the first metal plate 111 and the third metal plate 116.
根据本申请实施例的电子设备，在一些情况下，具有导电率更高的金属无法直接固定在第一金属板111或第三金属板116上，可以通过多层金属板才能固定，其中第三金属板116和第四金属板的导电率不做限制。电子设备采用导电率更高的金属，可以提高金属结构件电接触位置140的导电性能。According to the electronic device of the embodiment of the present application, in some cases, the metal with higher conductivity cannot be directly fixed on the first metal plate 111 or the third metal plate 116, and can be fixed by multiple metal plates. The conductivity of the metal plate 116 and the fourth metal plate is not limited. The electronic device uses a metal with higher conductivity, which can improve the conductivity of the electrical contact position 140 of the metal structure.
在一种实现方式中，第二金属板112的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。，第三金属板116的材料可以是铜、镍、金、银、钯镍等具有高导电率的金属。In an implementation manner, the material of the second metal plate 112 may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc. The material of the third metal plate 116 may be a metal with high conductivity such as copper, nickel, gold, silver, palladium nickel, etc.
在一种实现方式中，在一些实施例中，为提升金属复合板的防腐蚀性，制备方法还可以包括：第二金属112板位于第一金属板111的上表面及侧面。In an implementation manner, in some embodiments, in order to improve the corrosion resistance of the metal composite plate, the preparation method may further include: the second metal 112 plate is located on the upper surface and the side surface of the first metal plate 111.
在一种实现方式中，在将第二金属板112固定在第一金属板111时，制备方法还包括：通过电镀或热扩散的方式将第二金属112板位于第一金属板111的上表面及侧面。In an implementation manner, when fixing the second metal plate 112 to the first metal plate 111, the preparation method further includes: positioning the second metal plate 112 on the upper surface of the first metal plate 111 by means of electroplating or thermal diffusion. And the side.
本申请实施例中，由于第一金属板位于金属结构件的电接触位置140，且第一金属板与金属结构件的电极电位差较小，因此，第一金属板和金属结构件之间难以形成原电池，从而可以提升金属结构件的防腐蚀能力。In the embodiment of the present application, since the first metal plate is located at the electrical contact position 140 of the metal structural member, and the electrode potential difference between the first metal plate and the metal structural member is small, it is difficult to connect the first metal plate and the metal structural member. A galvanic cell is formed, so that the corrosion resistance of the metal structure can be improved.
本领域技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。Those skilled in the art can use different methods for each specific application to implement the described functions, but such implementation should not be considered beyond the scope of the present application.
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的***、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。Those skilled in the art can clearly understand that, for the convenience and conciseness of description, the specific working process of the above-described system, device, and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.
在本申请所提供的几个实施例中，应该理解到，所揭露的***、装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个***，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性或其它的形式。In the several embodiments provided in this application, it should be understood that the disclosed system, device, and method may be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical or other forms.
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖 在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Should be covered within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims (22)

  1. 一种电子设备，其特征在于，包括：An electronic device, characterized in that it comprises:
    金属结构件，包括电接触位置；Metal structural parts, including electrical contact locations;
    金属复合板，包括第一金属板和第二金属板，所述第一金属板位于所述电接触位置；所述第一金属板与所述金属结构件的电极电位相同，或，所述第一金属板与所述金属结构件的电极电位差小于或等于0.5V；所述第二金属板位于所述第一金属板上方，所述第二金属板的导电率大于所述第一金属板的导电率，所述第二金属板用于与所述电子设备上的电路电连接。The metal composite plate includes a first metal plate and a second metal plate, the first metal plate is located at the electrical contact position; the electrode potential of the first metal plate and the metal structure are the same, or, the first metal plate The electrode potential difference between a metal plate and the metal structure is less than or equal to 0.5V; the second metal plate is located above the first metal plate, and the conductivity of the second metal plate is greater than that of the first metal plate The second metal plate is used for electrical connection with the circuit on the electronic device.
  2. 根据权利要求1所述的电子设备，其特征在于，所述电子设备还包括保护膜，所述保护膜位于所述第一金属板的上表面，所述第二金属板的大小小于所述第一金属板的大小。The electronic device according to claim 1, wherein the electronic device further comprises a protective film, the protective film is located on the upper surface of the first metal plate, and the size of the second metal plate is smaller than that of the first metal plate. The size of a metal plate.
  3. 根据权利要求2所述的电子设备，其特征在于，所述电子设备还包括电连接点，所述电连接点设置在有所述保护膜的区域。The electronic device according to claim 2, wherein the electronic device further comprises an electrical connection point, and the electrical connection point is provided in an area where the protective film is provided.
  4. 根据权利要求1-3任一所述的电子设备，其特征在于，所述金属结构件上表面设有表面保护层，所述表面保护层位于所述金属结构件和所述第一金属板之间。The electronic device according to any one of claims 1-3, wherein the upper surface of the metal structure is provided with a surface protection layer, and the surface protection layer is located between the metal structure and the first metal plate. between.
  5. 根据权利要求2所述的电子设备，其特征在于，所述第二金属板的四周被所述保护膜包围。The electronic device according to claim 2, wherein the periphery of the second metal plate is surrounded by the protective film.
  6. 根据权利要求2或5所述的电子设备，其特征在于，所述保护膜包括第一保护膜和第二保护膜，所述第一保护膜为高分子有机物涂层，所述第二保护膜为表面绝缘疏水层。The electronic device according to claim 2 or 5, wherein the protective film comprises a first protective film and a second protective film, the first protective film is a polymer organic coating, and the second protective film It is the surface insulating hydrophobic layer.
  7. 根据权利要求1-6任一所述的电子设备，其特征在于，所述金属结构件为天线辐射体，所述电子设备还包括金属边框、金属弹片和连接板，所述金属结构件与所述金属边框连接，所述金属弹片固定在所述连接板，所述金属弹片与位于所述金属结构件的电接触位置的金属复合板电连接。The electronic device according to any one of claims 1-6, wherein the metal structure is an antenna radiator, and the electronic device further comprises a metal frame, a metal elastic sheet and a connecting plate, and the metal structure is connected to the The metal frame is connected, the metal elastic piece is fixed to the connecting plate, and the metal elastic piece is electrically connected to the metal composite board located at the electrical contact position of the metal structure.
  8. 根据权利要求7所述的电子设备，其特征在于，所述连接板为金属中框或印刷电路板。The electronic device according to claim 7, wherein the connecting board is a metal middle frame or a printed circuit board.
  9. 根据权利要求1-6任一所述的电子设备，其特征在于，所述金属结构件为天线的馈电点，所述电子设备还包括印刷电路板和金属弹片，所述金属弹片固定在所述印刷电路板，所述金属复合板与所述金属弹片电连接。The electronic device according to any one of claims 1-6, wherein the metal structure is a feed point of the antenna, the electronic device further comprises a printed circuit board and a metal shrapnel, the metal shrapnel is fixed on the In the printed circuit board, the metal composite board is electrically connected with the metal elastic sheet.
  10. 根据权利要求1-9任一所述的电子设备，其特征在于，所述第一金属板与所述金属结构件是同一种金属材料。8. The electronic device according to any one of claims 1-9, wherein the first metal plate and the metal structure are made of the same metal material.
  11. 根据权利要求1-10任一所述的电子设备，其特征在于，所述第二金属板的厚度不超过0.3毫米。The electronic device according to any one of claims 1-10, wherein the thickness of the second metal plate does not exceed 0.3 mm.
  12. 根据权利要求1-11任一所述的电子设备，其特征在于，所述金属复合板还包括第三金属板，所述第三金属板位于所述第一金属板与所述第二金属板之间，所述第二金属板的导电率大于所述第三金属板的导电率。The electronic device according to any one of claims 1-11, wherein the metal composite plate further comprises a third metal plate, and the third metal plate is located between the first metal plate and the second metal plate. In between, the conductivity of the second metal plate is greater than the conductivity of the third metal plate.
  13. 根据权利要求1-12任一所述的电子设备，其特征在于，所述电子设备为手机、穿戴式设备、显示屏设备、平板、电脑、或智能家庭终端。The electronic device according to any one of claims 1-12, wherein the electronic device is a mobile phone, a wearable device, a display device, a tablet, a computer, or a smart home terminal.
  14. 一种电子设备，包括金属框、印刷电路板和金属复合板，所述金属框为金属结构件，其中：An electronic device includes a metal frame, a printed circuit board, and a metal composite board. The metal frame is a metal structural member, wherein:
    所述金属结构件包括电接触位置；The metal structure includes electrical contact positions;
    所述金属复合板，包括第一金属板和第二金属板，所述第二金属板位于所述第一金属板的上方，所述第一金属板焊接在所述电接触位置；所述第一金属板与所述金属结构件的电极电位相同，或，所述第一金属板与所述金属结构件的电极电位差小于或等于0.5V；所述第二金属板的导电率大于所述第一金属板的导电率；The metal composite plate includes a first metal plate and a second metal plate, the second metal plate is located above the first metal plate, and the first metal plate is welded to the electrical contact position; A metal plate has the same electrode potential as the metal structure, or the electrode potential difference between the first metal plate and the metal structure is less than or equal to 0.5V; the conductivity of the second metal plate is greater than that of the The conductivity of the first metal plate;
    所述第二金属板电连接所述印刷电路板。The second metal plate is electrically connected to the printed circuit board.
  15. 根据权利要求14所述的电子设备，其特征在于，所述电子设备还包括保护膜，所述保护膜位于所述第一金属板的上表面，所述第二金属板的大小小于所述第一金属板的大小。The electronic device according to claim 14, wherein the electronic device further comprises a protective film, the protective film is located on the upper surface of the first metal plate, and the size of the second metal plate is smaller than that of the first metal plate. The size of a metal plate.
  16. 根据权利要求15所述的电子设备，其特征在于，所述电子设备还包括电连接点，所述电连接点设置在有所述保护膜的区域。The electronic device according to claim 15, wherein the electronic device further comprises an electrical connection point, and the electrical connection point is provided in an area where the protective film is provided.
  17. 根据权利要求14-16任一所述的电子设备，其特征在于，所述金属结构件上表面设有表面保护层，所述表面保护层位于所述金属结构件和所述第一金属板之间。The electronic device according to any one of claims 14-16, wherein the upper surface of the metal structure is provided with a surface protection layer, and the surface protection layer is located between the metal structure and the first metal plate. between.
  18. 根据权利要求15所述的电子设备，其特征在于，所述第二金属板的四周被所述保护膜包围。15. The electronic device of claim 15, wherein the periphery of the second metal plate is surrounded by the protective film.
  19. 根据权利要求15或18所述的电子设备，其特征在于，所述保护膜包括第一保护膜和第二保护膜，所述第一保护膜为高分子有机物涂层，所述第二保护膜为表面绝缘疏水层。The electronic device according to claim 15 or 18, wherein the protective film comprises a first protective film and a second protective film, the first protective film is a polymer organic coating, and the second protective film It is the surface insulating hydrophobic layer.
  20. 权利要求14-19任一所述的电子设备，其特征在于，所述第二金属板电连接所述印刷电路板，为：The electronic device of any one of claims 14-19, wherein the second metal plate is electrically connected to the printed circuit board and is:
    所述第二金属板通过金属弹片电连接所述印刷电路板。The second metal plate is electrically connected to the printed circuit board through a metal elastic sheet.
  21. 根据权利要求14-20任一所述的电子设备，其特征在于，所述金属复合板还包括第三金属板，所述第三金属板位于所述第一金属板与所述第二金属板之间，所述第二金属板的导电率大于所述第三金属板的导电率。The electronic device according to any one of claims 14-20, wherein the metal composite plate further comprises a third metal plate, and the third metal plate is located between the first metal plate and the second metal plate. In between, the conductivity of the second metal plate is greater than the conductivity of the third metal plate.
  22. 根据权利要求14-21任一所述的电子设备，其特征在于，所述电子设备为手机、穿戴式设备、显示屏设备、平板、电脑、或智能家庭终端。The electronic device according to any one of claims 14-21, wherein the electronic device is a mobile phone, a wearable device, a display device, a tablet, a computer, or a smart home terminal.
PCT/CN2020/089311 2019-05-10 2020-05-09 Electronic device and preparation method thereof WO2020228624A1 (en)

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