WO2020223270A1

WO2020223270A1 - Power interposer with bypass capacitors

Info

Publication number: WO2020223270A1
Application number: PCT/US2020/030348
Authority: WO
Inventors: Istvan Novak
Original assignee: Samtec, Inc.
Priority date: 2019-04-30
Filing date: 2020-04-29
Publication date: 2020-11-05
Also published as: TW202044678A

Abstract

In one embodiment, an electrical power interposer has a first mounting interface that can mount to a first electrical component, and a second mounting interface that is opposite the first mounting interface and can mount to a second electrical component. The interposer has a plurality of electrical contacts that extend from the first mounting interface to the second mounting interface. Each electrical contact has a first mounting end at the first mounting interface and a second mounting end at the second mounting interface. The interposer has a plurality of capacitors that interconnect pairs of the electrical contacts to one another. The capacitors can limit inductance along a path that extends through the interposer along a direction from the first mounting interface to the second mounting interface.

Description

POWER INTERPOSER WITH BYPASS CAPACITORS

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. provisional patent application no.

62/840,731, filed April 30, 2019, the disclosure of which is hereby incorporated by reference as if set forth in its entirety herein.

BACKGROUND

[0002] Electrical connector systems generally include circuits and components on one or more interconnected circuit boards. Examples of circuit boards in an electrical connector system can include daughter boards, motherboards, backplane boards, midplane boards, or the like. Electrical assemblies can further include an electrical connector that provides an interface between electrical components, and provides electrically conductive paths for electrical communications data signals and/or electrical power so as to place the electrical components in electrical communication with each other.

SUMMARY

[0003] In one example, an electrical power interposer comprises a first mounting interface, a second mounting interface, a plurality of electrical contacts, and a plurality of capacitors. The first mounting interface is configured to mount to a first electrical component. The second mounting interface is opposite the first mounting interface and configured to mount to a second electrical component. The plurality of electrical contacts extends from the first mounting interface to the second mounting interface. Each electrical contact has a first mounting end at the first mounting interface and a second mounting end at the second mounting interface. Each capacitor is electrically coupled to a pair of the electrical contacts.

BRIEF DESCRIPTION OF THE DRAWINGS

[0004] The foregoing summary, as well as the following detailed description of example embodiments of the present disclosure, will be better understood when read in conjunction with the appended drawings. For the purposes of illustrating the example embodiments of the present disclosure, references to the drawings are made. It should be understood, however, that the application is not limited to the precise arrangements and instrumentalities shown. In the drawings:

[0005] Fig. 1 shows a simplified elevation view of system having an electrical power interposer that interconnects a first printed circuit board (PCB) and a chip package, the chip package having a second PCB, with an integrated circuit (IC), capacitors, and electrical connectors mounted thereto;

[0006] Fig. 2 shows a perspective view of an electrical power interposer according to one embodiment;

[0007] Fig. 3 shows a perspective view of the electrical power interposer of Fig. 2 according to an embodiment in which the electrical power interposer has a plurality of frames and the housing is shown transparently for illustrative purposes;

[0008] Fig. 4 shows a perspective view of one of the frames of the power interposer of Fig. 3 according to one embodiment;

[0009] Fig. 5 shows a front elevation view of a portion of a plurality of electrical contacts of the electrical power interposer of Fig. 2 according to an embodiment in which the capacitors have a regular geometry;

[0010] Fig. 6 shows a front elevation view of a portion of a plurality of electrical contacts of the electrical power interposer of Fig. 2 according to an embodiment in which the capacitors have a reverse geometry;

[0011] Fig. 7 shows a side elevation view of an electrical contact of the interposer of Fig. 2 according to an embodiment in which the capacitors are attached using a conductive strip;

[0012] Fig. 8 shows a front elevation view of first and second rows of electrical contacts of the electrical power interposer of Fig. 2 according to an embodiment in which bypass capacitors are attached to tabs of the electrical contacts;

[0013] Fig. 9 shows a top view of the electrical power interposer of Fig. 2 according to one embodiment in which the electrical power interposer implements the rows of Fig. 8;

[0014] Fig. 10 shows dimensions of first and second capacitors that can be

implemented in the electrical power interposer of Fig. 9 according to one embodiment;

[0015] Fig. 11 shows a top view of the electrical power interposer of Fig. 2 according to one embodiment in which the housing is hidden for illustrative purposes and each capacitor interconnects a first electrical contact with an adjacent electrical contact that is in an adjacent row and an adjacent column;

[0016] Fig. 12 shows a side elevation view of the electrical power interposer of Fig. 2 according to one embodiment in which the housing is hidden for illustrative purposes and the electrical contacts are curved so as to support the capacitors;

[0017] Fig. 13 graphically illustrates the impedance characteristics of a high-power switch chip, CPU, or GPU chip package with a 7 millimeter electrical power interposer without capacitors; and [0018] Fig. 14 graphically illustrates the impedance characteristics of a high-power switch chip, CPU, or GPU chip package with a 7 millimeter electrical power interposer according to one embodiment having a plurality of capacitors.

DETAILED DESCRIPTION

[0019] In electronic circuits, an interposer is commonly used to route electrical connections of a first electrical component, such as a first printed circuit board (PCB), to electrical connections of a second electrical component, such as a second PCB. In many cases, the interposer is used to route electrical connections having a first pitch to electrical connections having a second pitch that is different from the first pitch, or to reroute one or more of the electrical connections to a different location relative to one or more of the other electrical connections.

[0020] An interposer can additionally, or alternatively, be used to place a first electrical component in electrical communication with a second electrical component such that the interposer creates a standoff between the first and second electrical components. This may be advantageous when one or more other electrical components are disposed between the first and second electrical components. However, the inductance along a path that extends from the first electrical component to the second electrical component through the interposer is related to a distance between the first and second electrical components, and hence a length of the routings within the interposer. Longer routings within the interposer can experience a greater inductance than comparable shorter routings would experience. To offset or limit the inductance, an interposer can comprise a plurality of capacitors attached to the routings as discussed below. An interposer having routings with a plurality of capacitors attached thereto can have an inductance that is lower than a comparable interposer (e.g., having the same length routings) that is devoid of the capacitors.

[0021] Referring to Fig. 1, in general, a system 100 comprises a first electrical component 104 and a second electrical component 106. The first electrical component 104 can be, for example, a main printed circuit board (PCB), and the second electrical component 106 can be, for example, a secondary PCB, a packaged integrated circuit (IC) having an IC die mounted onto a secondary PCB, or a bare IC die that is not mounted to a PCB. The first electrical component 104 provides power to the second electrical component 106. The first electrical component 104 could be directly connected to the second electrical component 106 so as to provide power to the second electrical component 106. However, as shown in Fig. 1, the system 100 includes at least one other electrical component between the first and second electrical components 104 and 106. In particular, the system 100 comprises an electrical power interposer 102 that (1) spaces the first electrical component 104 from the second electrical component 106 and (2) electrically couples the first electrical component 104 to the second electrical component 106 so as to provide power from the first electrical component 104 to the second electrical component 106. It will be understood that systems of the disclosure can include the electrical power interposer 102, and at least one, such as both of, the first electrical component 104 and the second electrical component 106. As will be described in further detail below, the electrical power interposer 102 can comprise a plurality of capacitors that are connected to the electrical contacts of the electrical power interposer 102 so as to limit or offset inductance along conductive paths that extend from the first electrical component 104 to the second electrical component 106.

[0022] Referring now more specifically to the details of the system 100, the first electrical component 104 has a first surface 104a and a second surface 104b that oppose one another along a first direction Di. The first surface 104a can be considered to be an inner surface, and the second surface 104b can be considered to be an outer surface. The first surface 104a and the second surface 104b can each extend generally along a second direction D2, and a third direction D3 (into the page in Fig. 1). The first, second, and third directions can be substantially perpendicular to one another. The first, or inner surface 104a of the first component 104 can comprise a plurality of electrical contacts 104c that are configured to electrically couple to the electrical power interposer 102. In one example, the electrical contacts 104c can be arranged in a plurality of rows and a plurality of columns; however, it will be understood that other arrangements are contemplated. The rows of electrical contacts 104c can be spaced from one another along the third direction D3. Each row of electrical contacts 104c can extend along the second direction D2. The plurality of columns of electrical contacts 104c can be spaced from one another along the second direction D2. Each column of electrical contacts 104c can extend along the third direction D3. Each electrical contact 104c can be a conductive contact pad, a plated through-hole, or any other suitable electrical contact configured to mount an electrical component to a PCB.

[0023] Similarly, the second electrical component 106 has a first surface 106a and a second surface 106b that oppose one another along the first direction Di. The first surface 106a can be considered to be an inner surface, and the second surface 106b can be considered to be an outer surface. The first surface 106a and the second surface 106b can each extend generally along the second direction D2 and the third direction D3. The first, or inner surface 104a of the first component 104 can face the first, or inner surface 106a of the second component 106. The first, or inner surface 106a of the second component 106 can comprise a plurality of electrical contacts 106c. In one example, the electrical contacts 106c can be arranged in a plurality of rows R and a plurality of columns C; however, it will be understood that other arrangements are contemplated. The rows R can be spaced from one another along the third direction Di. Each row can extend along the second direction D2. The plurality of columns C can be spaced from one another along the second direction D2. Each column can extend along the third direction D3. Each electrical contact 106c can be a conductive contact pad, a plated through-hole, or any other suitable electrical contact configured to mount an electrical component to a PCB.

[0024] The system 100 can comprise a plurality of electrical components supported by the second electrical component 106. For example, the system 100 can comprise an integrated circuit (IC) 108 mounted onto the second electrical component 106. The IC 108 can be mounted to the second surface 106b of the second electrical component 106 such that the IC 108 is in electrical communication with the second electrical component 106. The second electrical component 106 with IC 108 and optionally one or more additional electrical components (e.g., one or more of 110, 112, 114, 116, 118, 120, 122, and 124) can be referred to as a chip package or a die package. In alternative examples, the system 100 can be devoid of the secondary PCB, and the IC 108 can be second electrical component 106 that is directly mounted to the interposer 102. The inner surface of the IC 108 can comprise a plurality of electrical contacts, and in such alterative examples, the plurality of electrical contacts of the IC 108 can be the electrical contacts 106c of the second electrical component 106.

[0025] The system 100 can optionally comprise at least one, such as a plurality of, electrical connectors (e.g., 118, 120, 122, 124) mounted onto the second electrical component 106. Each electrical connector can be mounted onto one of the first surface 106a and the second surface 106b of the second electrical component 106 so as to be in electrical communication with the second electrical component 106. The second electrical component 106 can place each of the electrical connectors in communication with the IC 108. Thus, the second electrical component 106 can comprise electrical communication paths that extend from each of the at least one electrical connectors to the IC 108. Each electrical connector can be configured to mate with a corresponding electrical connector (not shown) so as to place the corresponding electrical connector in electrical communication with the second electrical component 106, and hence the IC 108.

[0026] In an example, the at least one electrical connector can include a first inner electrical connector 118 mounted to the first surface 106a of the second electrical component 106 such that the first inner electrical connector 118 is outwardly offset from a first side of the electrical power interposer 102 with respect to the second direction D2. Additionally, or altematively, the at least one electrical connector can include a second inner electrical connector 120 mounted to the first surface 106a of the second electrical component 106 such that the second inner electrical connector 120 is outwardly offset from a second side of the electrical power interposer 102 with respect to the second direction D2, the second side being opposite the first side of the power interposer 102. Thus, the first and second inner electrical connectors 118 and 120 can be mounted to the second electrical component 106 on opposed sides of the electrical power interposer 102. Stated differently, the first and second inner electrical connectors 118 and 120 can be outwardly spaced from the electrical power interposer 102 along opposite directions with respect to the second direction D2.

[0027] Additionally, or alternatively, the at least one electrical connector can include a first outer electrical connector 122 mounted to the second surface 106b of the second electrical component 106 such that the first outer electrical connector 122 is outwardly offset from a first side of the IC 108 with respect to the second direction D2. Additionally, or alternatively, the at least one electrical connector can include a second outer electrical connector 124 mounted to the second surface 106b of the second electrical component 106 such that the second outer electrical connector 124 is outwardly offset from a second side of the IC 108 with respect to the second direction D2, the second side being opposite the first side of the IC 108. Thus, the first and second outer electrical connectors 122 and 124 can be mounted to the second electrical component 106 on opposed sides of the IC 108. Stated differently, the first and second outer electrical connectors 122 and 124 can be outwardly spaced from the IC 108 along opposite directions with respect to the second direction D2.

[0028] In some embodiments, the first outer electrical connector 122 can be in-line with the first inner electrical connector 118 with respect to the first direction Di. Additionally, or alternatively, the second outer electrical connector 124 can be in-line with the second inner electrical connector 120 with respect to the first direction Di. It will be understood, however, that alternative arrangements of the electrical connectors 118, 120, 122, and 124 is contemplated.

[0029] The system 100 can optionally comprise at least one, such as a plurality of, capacitors (e.g., 110, 112, 114, 116) mounted onto the second electrical component 106. Each capacitor can be mounted to one of the first surface 106a and the second surface 106b of the second electrical component 106 so as to be in electrical communication with the second electrical component 106. Each capacitor can be configured to limit or offset at least one of resistance and inductance along a conductive path that extends from one of the electrical connectors (e.g., 118, 120, 122, and 124) to IC chip 108. [0030] In an example, the at least one capacitor can include a first inner capacitor 110 mounted to the first surface 106a of the second electrical component 106 such that the first inner capacitor 110 is outwardly offset from a first side of the power interposer 102 with respect to the second direction D2. The first inner capacitor 110 can be within a signal path that extends from the first inner electrical connector 118 to the IC 108, such as in the signal path between the first inner electrical connector 118 to the IC 108. Additionally, or alternatively, the at least one capacitor can include a second inner capacitor 112 mounted to the first surface 106a of the second electrical component 106 such that the second inner capacitor 112 is outwardly offset from a second side of the power interposer 102 with respect to the second direction D2, the second side being opposite the first side of the power interposer 102. The second inner capacitor 112 can be within a signal path that extends from the second inner electrical connector 1120 to the IC 108, such as in the signal path between the second inner electrical connector 120 to the IC 108. Thus, the first and second inner capacitors 110 and 112 can be mounted to the second electrical component 106 on opposed sides of the power interposer 102. Stated differently, the first and second inner capacitors 110 and 112 can be outwardly spaced from the power interposer 102 along opposite directions with respect to the second direction D2.

[0031] Additionally, or alternatively, the at least one capacitor can include a first outer capacitor 114 mounted to the second surface 106b of the second electrical component 106 such that the first outer capacitor 114 is outwardly offset from a first side of the IC 108 with respect to the second direction D2. The first outer capacitor 114 can be within a signal path that extends from the first outer electrical connector 122 to the IC 108, such as in the signal path between the first outer electrical connector 122 to the IC 108. Additionally, or alternatively, the at least one capacitor can include a second outer capacitor 116 mounted to the second surface 106b of the second electrical component 106 such that the second outer capacitor 116 is outwardly offset from a second side of the IC 108 with respect to the second direction D2, the second side being opposite the first side of the IC 108. The second outer capacitor 116 can be within a signal path that extends from the second outer electrical connector 124 to the IC 108, such as in the signal path between the second outer electrical connector 124 to the IC 108. Thus, the first and second outer capacitors 114 and 116 can be mounted to the second electrical component 106 on opposed sides of the IC 108. Stated differently, the first and second outer capacitors 114 and 116 can be outwardly spaced from the IC 108 along opposite directions with respect to the second direction

D .

[0032] In some embodiments, the first outer capacitor 114 mounted to the second surface 106b can be in-line with the first inner capacitor 110 mounted to the first surface 106a with respect to the first direction Di. Additionally, or alternatively, the second outer capacitor 116 mounted to the second surface 106b can be in-line with the second inner capacitor 112 mounted to the first surface 106a with respect to the first direction Di. It will be understood, however, that alternative arrangements of the capacitors 110, 112, 114, and 116 is contemplated.

[0033] As can be seen in Fig. 1, the system 100 can optionally comprise at least one inner electrical component (e.g., 110, 112, 118, and 120) between the first electrical component 104 and the second electrical component 106. The at least one inner electrical component has an outer dimension along the first direction Di. The interposer 102 can space the first and second electrical components 104 and 106 from one another by at least the outer dimension such that the at least one inner electrical component does not mechanically interfere with the first electrical component 104. Therefore, the system 100 defines a space 107 between the first electrical component 104 and the second electrical component 106 that is configured to provide clearance for the at least one inner electrical component. The space 107 can extend from the first surface 104a of the first electrical component 104 to the first surface 106a of the second electrical component 106 along the first direction Di. At least one, up to all, of the first inner electrical connector 118, the second inner electrical connector 120, the first inner capacitor 110, and the second inner capacitor 112 can be disposed in the space 107 between the first electrical component 104 and the second electrical component 106.

[0034] The space 107 can have a dimension Hi along the first direction Di from the first surface 104a to the first surface 106a that is greater than or equal to a maximum dimension of the inner electrical components disposed in the space 107. For instance, the dimension Hi can be greater than or equal to a maximum dimension of at least one of the inner electrical connectors 118 and 120 along the first direction Di. Accordingly, the second electrical component 106 can be mounted to the first electrical component 104 such that the inner electrical components mounted to the first surface 106a of the second electrical component 106 do not cause a mechanical interference with the first electrical component 104.

[0035] Referring to Figs. 1 and 2, the system 100 comprises the electrical power interposer 102 between the first and second electrical components 104 and 106 so as to create a standoff between the first and second electrical components 104 and 106 that defines the space 107. The electrical power interposer 102 has a first mounting interface 130 and a second mounting interface 132 that are offset from one another along the first direction Di. The electrical power interposer 102 has a dimension ¾ along the first direction Di from the first mounting interface 130 to the second mounting interface 132 that at least partially defines the dimension Hi of the space 107. The electrical power interposer 102 can be a straight interposer in which the first and second mounting interfaces 130 and 132 mount in the same direction (i.e., the first direction Di). However, in alternative embodiments, the interposer 102 can be an angled interposer, such as a right-angle interposer, in which the first and second interfaces 130 and 132 mount in directions that are angularly offset from one another.

[0036] The electrical power interposer 102 comprises a plurality of electrical contacts 134 (shown in Figs. 4, 5-9, and 12). The electrical contacts 134 can be supported by a dielectric or non-conductive housing 136. Each electrical contact 134 has a first mounting end 134a and a second mounting end 134b that are offset from one another along the first direction Di. Each electrical contact 134 has a contact body 134c (shown in Figs. 4, 5-9, and 12) that extends from the first mounting end 134a to the second mounting end 134b. The contact body 134c can be elongate generally along the first direction Di. Each electrical contact 134 can have a dimension H2 from its first mounting end 134a to its second mounting end 134b. When mounted to the first and second electrical components 104 and 106, each electrical contact 134 forms a conductive path from one of the electrical contacts 104c of the first electrical component 104 to one of the electrical contacts 106c of the second electrical component 106.

[0037] The first mounting ends 134a at least partially define the first mounting interface 130 and are configured to mount to the second electrical component 106. For example, each first mounting end 134a is configured to mount to an electrical contact 106c of the second electrical component 104. The first mounting ends 134a can be arranged in a plurality of rows R and a plurality of columns C; however, it will be understood that other arrangements are contemplated. The rows R can be spaced from one another along the third direction D3. Each row can extend along the second direction D2. The plurality of columns C can be spaced from one another along the second direction D2. Each column can extend along the third direction D3. The plurality of first mounting ends 134a can define a grid or other suitable pattern. The grid can have a uniform pitch across each row R and each column C. In other words, a distance between the first mounting ends 134a can be constant across each row R and across each column C. Alternatively, the pitch can vary from one row to the next, from one column to the next, within a row R, and/or within a column C.

[0038] Each first mounting end 134a can be configured as a mounting tail that is configured to receive a solder ball. In some embodiments, each first mounting end 134a can include a solder ball such that the first mounting ends 134a together define a ball grid array (as shown). However, in alternative embodiments, each first mounting feature can be configured as a press-fit mounting tail, a surface-mount tail, a compression mount, or any other suitable mounting feature or combination of mounting features suitable for mounting the electrical power interposer 102 onto a PCB.

[0039] The second mounting ends 134b at least partially define the second mounting interface 132 and are configured to mount to the first electrical component 104. For example, each second mounting end 134b is configured to mount to an electrical contact 104c of the first electrical component 104. The second mounting ends 134b can be arranged in a plurality of rows R and a plurality of columns C; however, it will be understood that other arrangements are contemplated. The rows R can be spaced from one another along the third direction D3. Each row can extend along the second direction D2. The plurality of columns C can be spaced from one another along the second direction D2. Each column can extend along the third direction D3. The plurality of second mounting ends 134b can define a grid or other suitable pattern. The grid can have a uniform pitch across each row R and each column C. In other words, a distance between the second mounting ends 134b can be constant across each row R and across each column C. Alternatively, the pitch can vary from one row to the next, from one column to the next, within a row R, and/or within a column C. The arrangement and pitch of the second mounting ends 134b can match the arrangement and pitch of the first mounting ends 134a.

Alternatively, at least one of the arrangement and pitch of the second mounting ends 134b can vary from that of the first mounting ends 134a.

[0040] Each second mounting end 134b can be configured as any suitable mounting feature. Fig. 3 shows one example of a mount, although other compression mounts are contemplated. It will be understood that, in alternative embodiments, each second mounting feature can alternatively be configured as a solder ball, a mounting tail that is configured to receive a solder ball, a pin, land, a press-fit mounting tail, a surface-mount tail, or any other suitable mounting feature or combination of mounting features suitable for mounting the electrical power interposer 102 onto a PCB.

[0041] Referring to Figs. 3, 4, 6, 8, and 9, in one example, each contact body 134c can be a linear beam or pin that extends from the first mounting end 134a to the second mounting end 134b. For example, each contact body 134c can have a pair of opposed broadsides and a pair of edges that extend from one of the broadsides to the other of the broadsides. The broadsides can have a width that is greater than a thickness of the edges. The electrical contacts 134 in a row R of electrical contacts 134 can be aligned edge-to-edge along the second direction D2. A distance between adjacent electrical contacts 134 in a row R of electrical contacts 134 can be less than the width of the adjacent electrical contacts 134 along the row R. It will be understood, however, that the electrical contacts 134 can have other suitable shapes and can be oriented relative to one another in a manner different from that discussed above. For example, each contact body 134c can define a pin having a circular cross-section. Additionally, or alternatively, each contact body 134 can be non-linear such as in embodiments wherein one or more of the electrical connections are rerouted to a different location relative to one or more of the other electrical connections.

[0042] With specific reference to Figs. 3 and 4, in one example, the electrical power interposer 102 can include a plurality of frames 135, which can be referred to as lead frames. Each frame 135 has a body formed of a dielectric or non-conductive material. Each body supports a plurality of electrical contacts 134 in a row R. The frames 135 can be supported by the housing 136, and can be offset from one another along the third direction D3.

[0043] Inductance along a path that extends through the electrical power interposer from the first electrical component 104 to the second electrical component 106 is determined at least in part by the dimension Eh of the electrical contacts 134, and hence the dimension Hi of the space 107. A conventional interposer (i.e., w/o capacitors) having a greater dimension H2 can result in a greater inductance than a comparable interposer having a smaller dimension H2. However, selecting electrical contacts 134 with a smaller dimension H2 can result in one or more of the inner electrical components (e.g., 110, 112, 118, and 120) providing a mechanical interference with the first electrical component 104.

[0044] To offset or limit the inductance along the path from the first electrical component 104 to the second electrical component 106, the electrical power interposer 102 comprises a plurality of capacitors 138, where each capacitor 138 is electrically connected to a pair of the electrical contacts 134. Each capacitor 138 can extend across a gap between a pair of electrical contacts 134 so as to interconnect the pair of electrical contacts 134. Thus, each capacitor 138 can be in parallel with the pair of electrical contacts 134. The plurality of capacitors 138 can comprise a plurality of sets of the capacitors 138. Each set of the capacitors 138 can electrically connect the electrical contacts 134 of a different pair of the plurality of electrical contacts 134 to one another. In other words, the electrical contacts 134 of each pair of the plurality of electrical contacts 134 can be interconnected to one another by a different set of capacitors 138. The capacitors 138 in each set can be spaced from one another along a direction that extends from the first mounting interface 130 to the second mounting interface 132, such as along the first direction Di.

[0045] Intermediate electrical contacts 134 that are between two electrical contacts 134 can be interconnected to each of the two electrical contacts 134 by a different one of the sets of capacitors 138. In some embodiments, each intermediate electrical contact 134 can be interconnected to two electrical contacts 134 on opposed sides of the intermediate electrical contact 134. For example, each intermediate electrical contact 134 can be interconnected to a first electrical contact 134 on a first side of the intermediate electrical contact 134 by a first one of the sets of the capacitors 138 and to a second electrical contact 134 on a second side of the intermediate electrical contact 134 by a second one of the sets of the capacitors 138.

[0046] In at least some embodiments, the electrical contacts 134 in each pair can be adjacent to one another. For example, adjacent ones of the electrical contacts 134 can be immediately adjacent one another without any other electrical contacts 134 therebetween. The electrical contacts 134 of each pair can be in-line with one another along at least one of (1) the second direction D2, (2) the third direction D3, and (3) a direction DA that is angularly offset from the second and third directions D2 and D3. For example, the electrical contacts 134 of a pair can be aligned in a row R along the second direction D2 as shown in Fig. 3. Thus, electrical contacts 134 can be interconnected with electrical contacts 134 in the same row R. As another example, the electrical contacts 134 of a pair can be aligned in a column C along the third direction D3. Thus, electrical contacts 134 can be interconnected with electrical contacts 134 in the same column C. As yet another example, the electrical contacts 134 of a pair can be aligned in a direction DA that is angularly offset from the second and third directions D2 and D3. For instance, an electrical contact 134 in a given row R and a given column C can be interconnected with an electrical contact 134 in an adjacent row R and an adjacent column C as shown in Fig.

11

[0047] Preferably, at least some of the capacitors 138 are located closer to the first mounting interface 130 that mounts to the second electrical component 106 than to the second mounting interface 132 that mounts to the first electrical component 104. Arranging the capacitors 138 in such a manner can avoid the electrical contacts 134 having long stretches adjacent to the second electrical component 106 that are devoid of capacitors 138.

[0048] With continued reference to Fig. 4, each capacitor 138 can have first and second conductors 138a and 138b that are spaced from one another by a dielectric 138c. Each capacitor 138 can have a width along a select direction that extends from the first conductor 138a to the second conductor 138b. Each capacitor 138 can have a height along the first direction Di. In some embodiments, such as when the capacitors 138 interconnect electrical contacts 134 along the second direction D2, the width can be along the second direction D2. However, it will be understood that, in alternative embodiments, the width can be along another direction such as the third direction D3 or a direction DA that is angularly offset from the second and third directions D2 and D3. [0049] In one example, the plurality of capacitors 138 can comprise smaller-sized capacitors 138, and larger-sized capacitors 138 that are larger than the smaller-sized capacitors 138. Each larger-sized capacitor 138 can have at least one, such as both, of a height that is greater than a height of the smaller-sized capacitors 138, and a width that is greater than a width of the smaller-sized capacitors 138. Each set of capacitors 138 can comprise smaller-sized capacitors 138 and larger-sized capacitors 138. The smaller-sized capacitors 138 and larger- sized capacitors 138 in a set can be altematingly arranged along the first direction Di.

Additionally, or alternatively, the smaller-sized capacitors 138 and larger-sized capacitors 138 can be altematingly arranged along the select direction that extends from the first conductor 138a of one of the capacitors 138 to the second conductor 138b of the capacitor 138 (e.g., along the second direction D2, the third direction D3, or a direction DA that is angularly offset from the second and third directions D2 and D3). Additionally, or alternatively, the smaller-sized capacitors 138 and larger-sized capacitors 138 can be altematingly arranged along a

perpendicular direction that is perpendicular to the select direction. Alternating the differently- sized capacitors 138 can enable the capacitors 138 to be more densely packed. As a result, the total capacitance of all of the capacitors 138 can be greater than a comparable interposer that does not alternate differently-sized capacitors 138. It will be understood, however, that alternative embodiments can be implemented without using differently-sized capacitors.

[0050] The electrical contacts 134 can all be assigned to the same power domain or can be assigned to different power domains. For example, differently-sized and valued capacitors 138 can be mounted to electrical contacts 134 assigned to different power domains. The plurality of electrical contacts 134 include a plurality of power contacts that are configured to provide power from the first mounting ends 134a to the second mounting ends 134b. In some embodiments, each capacitor 138 can be coupled to a pair of power contacts. In alternative embodiments, the plurality of electrical contacts 134 can include a plurality of power contacts and a plurality of ground contacts, and each capacitor 138 can be coupled to a pair of contacts that includes a power contact and a ground contact.

[0051] The plurality of capacitors 138 can be implemented as regular geometry capacitors as shown in Fig. 5, as reverse geometry capacitors as shown in Fig. 6, or as an assortment of regular geometry capacitors and reverse geometry capacitors. Regular geometry capacitors can have a width along the select direction that extends from the first conductor 138a to the second conductor 138b that is less than a height of the capacitor along the first direction Di as shown in Fig. 5. Reverse geometry capacitors can have a width along the select direction that extends from the first conductor 138a to the second conductor 138b that is greater than a height of the capacitor along the first direction Di as shown in Fig. 6. The equivalent series inductance of a capacitor can be dependent on the length of its current loop. The reverse geometry conductor can have a shorter current loop than the regular geometry capacitor. Consequently, the parasitic inductance of the reverse geometry conductor can be lower than that of the regular geometry capacitor, and the speed of energy transfer to the load can be greater for a reverse geometry capacitor than for a regular geometry capacitor. Therefore, reverse geometry capacitors may be preferable to regular geometry capacitors, although embodiments of the disclosure are not limited to using reverse geometry capacitors.

[0052] Turning to Fig. 7, the capacitors 138 can be mounted to the electrical contacts 134 using any suitable mounting technique, including, but not limited to, welding, soldering, conductive gluing, compression mounting (e.g., with potting), mechanical fastening, and any combination thereof. Fig. 7 shows one example of a mechanical fastening technique. As shown in Fig. 7, the electrical power interposer 102 can comprise conductive strips 140 that secure the capacitors 138 to the electrical contacts 134. Each conductive strip 140 can be shaped or bent so as to define a plurality of recesses 141 that are offset from one another along the first direction Di. Each recess 141 can be sized to receive a capacitor 138 therein. Each conductive strip 140 can have, for each recess 141, an inner portion 140a, that is welded, glued with a conductive adhesive, or otherwise attached to an electrical contact 134. The inner portions 140a of a conductive strip 140 can be offset from one another along the first direction Di. Each inner portion 140a can be disposed between a capacitor 138 and the electrical contact 134.

[0053] Each conductive strip 140 can have, for each recess 141, first and second engagement portions 140b and 140c that are spaced from one another along the first direction Di so as to define the recess 141 therebetween. The first and second engagement portions 140b and 140c of each recess 141 are configured to engage opposed ends of the capacitor 138 disposed in the recess 141, such as upper and lower ends of the capacitor 138. Each of the first and second engagement portions 140b and 140c can be formed by bending the conductive strip 140 into an s-shape, although other shapes are contemplated. The first and second engagement portions 140b and 140c of each recess 141 can be resiliently biased towards one another so as to grasp the opposed ends of the capacitor 138 therebetween.

[0054] Turning to Figs. 8 to 10, in another embodiment, an electrical power interposer 102 has a plurality of electrical contacts 134 that have a contact body 134c and first and second mounting ends 134a and 134b as described above. In addition, the electrical contacts 134 comprise a plurality of tabs 142 to which the capacitors 138(1) and 138(2) are attached. The plurality of tabs 142 can comprise a plurality of sets of the tabs 142. Each set of the tabs 142 can extend from the contact body 134a of one of the electrical contacts 134 towards a set of tabs 142 of an adjacent electrical contact 134. The tabs 142 in each set can be spaced from one another along the first direction Di. Each tab 142 of an electrical contact 134 can project towards an adjacent tab 142 of an adjacent electrical contact 134 so as to define a gap 137 between the tab 142 and the adjacent tab 142.

[0055] Intermediate electrical contacts 134 that are between two electrical contacts 134 can comprise first and second sets of tabs 142 that extend in opposite directions from one another. The tabs 142 of the first and second sets can be staggered from one another such that tabs 142 of the first set extend from the contact body 134c at a location that is between the tabs 142 of the second set relative to the first direction Di. Similarly, tabs 142 of the second set can extend from the contact body 134c at a location that is between the tabs 142 of the first set with respect to the first direction Di. Thus, the tabs 142 of the first and second sets can be altematingly offset from one another with respect to the first direction Di. As such, the capacitors 138(1) or 138(2) attached to a first set of tabs 142 of an intermediate electrical contact 134 can be staggered from the capacitors 138(1) or 138(2) attached to second set of tabs 142 of the intermediate electrical contact 134 with respect to the first direction Di.

[0056] The electrical power interposer 102 has a plurality of capacitors 138(1) and 138(2). Each capacitor 138(1) and 138(2) can be attached to a tab 142 of an electrical contact 134 and an adjacent tab 142 of an adjacent electrical contact 134 so as to span the gap 137 between the tab 142 and the adjacent tab 142. The plurality of capacitors 138(1) and 138(2) can comprise a plurality of sets of capacitors. The capacitors 138(1) and 138(2) in each set of capacitors can be spaced from one another along the first direction Di so as to define spaces 144 therebetween. The capacitors 138(1) and 138(2) in a set of capacitors can be in-line with the spaces 144 between the capacitors 138(1) and 138(2) in an adjacent set of capacitors along a select direction. The capacitors 138(1) and 138(2) in an intermediate set of capacitors that is between first and second adjacent sets of capacitors can be in-line with the spaces 144 between the capacitors 138(1) and 138(2) in the first adjacent set of capacitors 138(1) and 138(2) along the select direction and in-line with the spaces 144 between the capacitors 138(1) and 138(2) in the second adjacent set of capacitors 138(1) and 138(2) along the select direction. The select direction can extend from one of the conductors 138a and 138b of a capacitor 138 to the other one of the conductors 138a and 138b of the capacitor 138. In Figs. 8 and 9, the select direction is the second direction D2. However, in alternatively embodiments, the select direction could be the third direction D3 or an angled direction DA that is angularly offset from the second and third directions D2 and D3. [0057] The capacitors 138(1) and 138(2) can also be staggered along the third direction D3 from one row to another. For example, a first row A of electrical contacts 134 can have capacitors 138(1) that are in-line with the spaces 144 between the capacitors 138(2) of a second row B of electrical contacts 134 along a perpendicular direction that is perpendicular to the select direction. Similarly, the capacitors 138(2) of the second row B of electrical contacts 134 can be in-line with the spaces 144 between the capacitors 138(1) of the first row A of electrical contacts 134 along the perpendicular direction. In Figs. 8 and 9, the perpendicular direction is the third direction D3. However, in alternative embodiments, the perpendicular direction could be the second direction D2 or the angled direction DA that is angularly offset from the second and third directions D2 and D3.

[0058] In some examples, the types or sizes of the capacitors can also vary from one row to another. For example, a first row A of electrical contacts 134 can have capacitors 138(1) of a first size, and a second row B of electrical contacts 134 can have capacitors 138(2) of a second size, different from the first size. Fig. 10 shows example dimensions of the capacitors 138(1) and capacitors 138(2). It will be understood that, in alternative embodiments, the sizes of the capacitors 138(1) and 138(2) can vary from that shown in Fig. 10. It will also be understood that, in alternative embodiments, the size of the capacitors 138(1) can be the same as the size of the capacitors 138(2). Yet further, it will be understood that the capacitors can vary in size from one row to the next, from one column to the next, within one row, within one column, or any combination thereof.

[0059] Turning now to Figs. 11 and 12, in another embodiment, an electrical power interposer 102 has a plurality of electrical contacts 134 that have first and second mounting ends 134a and 134b as described above. In addition, each electrical contact 134 can have a contact body 134c that is curved or bent between its first and second mounting ends 134a and 134b. For instance, each contact body 134c can have a curved or bent shape that is substantially sinusoidal, although other shapes are contemplated. Each electrical contact 134 can be a substantial mirror image of an adjacent electrical contact 134, although embodiments of the disclosure are not so limited.

[0060] Each electrical contact 134 can define at least one set of recesses 134d that are offset from one another along the first direction Di. At least some of the electrical contacts 134, such as intermediate electrical contacts that are each disposed between two adjacent electrical contacts 134, can comprise a first set of recesses 134d and a second set of recesses 134d that are open towards opposing directions. The recesses 134d in the first and second sets can be altematingly offset from one another along the first direction Di. Each recess 134d can be in- line with, and open to, a recess 134d of an adjacent electrical contact 134. Thus, adjacent electrical contacts 134 can have opposing recesses 134d that are open towards one another. A capacitor 134 can be received in each pair of opposing recesses 134d of adjacent electrical contacts 134.

[0061] The plurality of capacitors 138 can comprise a plurality of sets of capacitors 138. The capacitors 138 in each set can be spaced from one another along the first direction Di so as to define spaces 144 therebetween. Each intermediate electrical contact 134 can support a first set of capacitors 138 in its first set of recesses 134d that interconnect the intermediate electrical contact 134 to a first adjacent electrical contact 134, and a second set of capacitors 138 in its second set of recesses 134d that interconnect the intermediate electrical contact 134 to a second adjacent electrical contact 134, opposite from the first adjacent electrical contact 134. Each capacitor 138 can be electrically coupled to adjacent electrical contacts 134. For instance, the electrical power interposer 102 can comprise connecting blades or wires 146 that electrically connect each capacitor 138 to a pair of adjacent electrical contacts 134. The electrical power interposer 102 can comprise, for each capacitor 138, a first blade or wire 146 that couples a first conductor 138a (shown in Fig. 11) of the capacitor 138 to a first electrical contact 134, and a second blade or wire 146 that couples a second conductor 138b (shown in Fig. 11) of the capacitor 138 to a second electrical contact 134, adjacent to the first electrical contact 134. In alternative examples, the package can be devoid of blades or wires 146, and each capacitor 138 can directly contact adjacent electrical contacts 134. In one such example, each contact 134 can be configured such that its recesses 134d can be expanded so as to receive capacitors 138 and contracted so as to trap the capacitors 138 in the recesses 134d. Upon contracting around the capacitors 138, the contact 134 can contact the capacitors 138 so as to be in electrical communication with the capacitors 138.

[0062] The capacitors 138 in each set of capacitors can be spaced from one another along the first direction Di so as to define spaces 144 therebetween. The capacitors 138 in a set of capacitors can be in-line with the spaces 144 between the capacitors 138 in an adjacent set of capacitors along a select direction. The capacitors 138 in an intermediate set of capacitors that is between first and second adjacent sets of capacitors can be in-line with the spaces 144 between the capacitors 138 in the first adjacent set of capacitors 138 along the select direction and in-line with the spaces 144 between the capacitors 138 in the second adjacent set of capacitors 138 along the select direction. The select direction can extend from one of the conductors 138a and 138b of a capacitor 138 to the other one of the conductors 138a and 138b of the capacitor 138.

In Fig. 11, the select direction is an angled direction DA that is angularly offset from the second and third directions D2 and D3. However, in alternatively embodiments, the select direction could be the second direction D2 or the third direction D3.

[0063] In some embodiments, the electrical power interposer can comprise a plurality of trays 148. Each tray 148 can be formed of a non-conductive material such as plastic. Each tray 148 can be configured to support a plurality of capacitors 138 that are in-line with one another along a perpendicular direction that is perpendicular to the first direction Di, such as along the angled direction DA, the second direction D2, or the third direction D3.

[0064] As shown in Fig. 11, the plurality of electrical contacts 134 include a plurality of power contacts PWR that are configured to provide power from the first mounting ends 134a to the second mounting ends 134b. The plurality of electrical contacts 134 can also include a plurality of ground contacts GND. Each capacitor 138 can be coupled to a pair of contacts that includes a power contact PWR and a ground contact GND. In Fig. 11, the electrical power interposer comprises a row of power contacts PWR between two rows of ground contacts GND. However, alternative arrangements of power contacts and ground contacts are contemplated.

[0065] In one embodiment, a method of assembling an electrical system comprising a first electrical component 104 and a second electrical component 106 can comprise a step of placing the first electrical component 104 into electrical communication with the second electrical component 106 through an electrical power interposer 102 such that the electrical power interposer 102 is configured to provide power from the first electrical component 104 to the second electrical component 106 through a plurality of electrical contacts 134 of the electrical power interposer 102. The electrical power interposer 102 comprises a plurality of capacitors 138, each electrically coupled to a pair of the electrical contacts 134 so as to limit inductance through the electrical power interposer 102 when power is provided through the electrical power interposer 102. The placing step can comprise a step of mounting the electrical power interposer 102 onto the first electrical component 104. Additionally or alternatively, the placing step can comprise a step of mounting the electrical power interposer 102 onto the second electrical connector 106. The placing step can comprise placing the first electrical component 104 into electrical communication with the second electrical component 106 such that one or more inner electrical components are disposed between the first electrical component 104 and the second electrical component 106. The method can further comprise a step of transmitting power through the electrical power interposer 102 from the first electrical component 104 to the second electrical component 106 such that the capacitors 138 limit inductance through the electrical power interposer 102. [0066] Although example interposers were discussed above relative to their use in preventing the inner electrical components mounted to the first surface 106a of the second electrical component 106 from mechanically interfering with the first electrical component 104, it will be understood that interposers of this disclosure can have other uses. For example, in some conventional larger ICs having an array of contacts (e.g., as a ball grid array, pin grid array, or land grid array), a rectangular area of contacts of the grid is omitted (typically from the center of the array) to allow room for a capacitor. However, omitting contacts in such a manner lessens the maximum current carrying capability of such ICs. As an alternative, each such larger IC can be made without omitting a portion of the grid, and can be mounted directly to an interposer of this disclosure. The interposer can comprise capacitors as discussed above, and can have a contact array that matches the array of the larger IC so that each contact of the IC electrically couples to a contact of the interposer. The interposer can in turn be mounted to another electrical component. In such alternatives, the interposers can be implemented to have relatively short heights (e.g., about 2-3 mm) so that a distance between the IC and the other electrical component is kept relatively small.

[0067] Referring to Figs. 13 and 14, it can be seen that employing an interposer of the disclosure can reduce the cumulative impedance of a chip package. Fig. 13 graphically illustrates the impedance characteristics of a high-power switch chip, CPU, or GPU chip package with a conventional 7 millimeter electrical power interposer without capacitors therein. Fig. 14 graphically illustrates the impedance characteristics of a comparable high-power switch chip, CPU, or GPU chip package with a 7 millimeter electrical power interposer according to one embodiment of the disclosure that has a plurality of capacitors as discussed above. In Figs. 13 and 14, Zcl, Zc2, Zc3, and Zc4 illustrate impedances for first, second, third, and fourth, capacitor banks, respectively. Further, Zcum illustrates the cumulative parallel impedance of the Zcl, Zc2, Zc3, and Zc4. As can be seen, the peak cumulative parallel impedance Zcum of the package with conventional interposer Fig. 13 is 8.4 mOhm, whereas the peak cumulative parallel impedance Zcum of the package with interposer comprising capacitors in Fig. 14 is 1.3 mOhm.

[0068] It should be noted that the illustrations and descriptions of the examples and embodiments shown in the figures are for exemplary purposes only, and should not be construed limiting the disclosure. One skilled in the art will appreciate that the present disclosure contemplates various embodiments. Additionally, it should be understood that the concepts described above with the above-described examples and embodiments may be employed alone or in combination with any of the other examples and embodiments described above. It should further be appreciated that the various alternative examples and embodiments described above with respect to one illustrated embodiment can apply to all examples and embodiments as described herein, unless otherwise indicated.

[0069] Unless explicitly stated otherwise, each numerical value and range should be interpreted as being approximate as if the word“about,”“approximately,” or“substantially” preceded the value or range. The terms“about,”“approximately,” and“substantially” can be understood as describing a range that is within 15 percent of a specified value unless otherwise stated.

[0070] Conditional language used herein, such as, among others, "can," "could," "might," "may,"“e.g.,” and the like, unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments include, while other embodiments do not include, certain features, elements, and/or steps. Thus, such conditional language is not generally intended to imply that features, elements, and/or steps are in any way required for one or more embodiments or that one or more embodiments necessarily include logic for deciding, with or without author input or prompting, whether these features, elements and/or steps are included or are to be performed in any particular embodiment. The terms“comprising,”“including,”“having,” and the like are synonymous and are used inclusively, in an open-ended fashion, and do not exclude additional elements, features, acts, operations, and so forth. Also, the term“or” is used in its inclusive sense (and not in its exclusive sense) so that when used, for example, to connect a list of elements, the term“or” means one, some, or all of the elements in the list.

[0071] While certain example embodiments have been described, these embodiments have been presented by way of example only and are not intended to limit the scope of the inventions disclosed herein. Thus, nothing in the foregoing description is intended to imply that any particular feature, characteristic, step, module, or block is necessary or indispensable.

Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions, and changes in the form of the methods and systems described herein may be made without departing from the spirit of the inventions disclosed herein. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of certain of the inventions disclosed herein.

[0072] Although there has been shown and described the preferred embodiment of the present disclosure, it will be readily apparent to those skilled in the art that modifications may be made thereto which do not exceed the scope of the appended claims. The embodiments described in connection with the illustrated embodiments have been presented by way of illustration, and the present invention is therefore not intended to be limited to the disclosed embodiments. Furthermore, the structure and features of each the embodiments described above can be applied to the other embodiments described herein. Accordingly, those skilled in the art will realize that the invention is intended to encompass all modifications and alternative arrangements included within the spirit and scope of the invention, as set forth by the appended claims.

Claims

What is Claimed:

1. An electrical power interposer, comprising:

a first mounting interface configured to mount to a first electrical component, and a second mounting interface that is opposite the first mounting interface and configured to mount to a second electrical component;

a plurality of electrical contacts that extend from the first mounting interface to the second mounting interface, each electrical contact having a first mounting end at the first mounting interface and a second mounting end at the second mounting interface; and

a plurality of capacitors, each electrically coupled to a pair of the electrical contacts.

2. The electrical power interposer of claim 1, wherein the plurality of capacitors comprises a plurality of sets of the capacitors, and each of the sets interconnects a different pair of the plurality of electrical contacts to one another.

3. The electrical power interposer of claim 2, wherein the plurality of electrical contacts comprises intermediate electrical contacts, each intermediate electrical contact being between two electrical contacts and interconnected to the two electrical contacts by a different one of the sets of capacitors.

4. The electrical power interposer of claim 3, wherein each intermediate electrical contact is interconnected to 1) a first electrical contact on a first side of the intermediate electrical contact by a first one of the sets of the capacitors and 2) a second electrical contact on a second side of the intermediate electrical contact by a second one of the sets of the capacitors.

5. The electrical power interposer of claim 2, wherein the capacitors in each set are spaced from one another along a first direction that extends from the first mounting interface to the second mounting interface.

6. The electrical power interposer of claim 5, wherein each set of capacitors comprises smaller-sized capacitors and larger-sized capacitors, and the smaller-sized capacitors and larger- sized capacitors in a set are altematingly arranged along the first direction.

7. The electrical power interposer of claim 5, wherein each set of capacitors comprises smaller-sized capacitors and larger-sized capacitors, and the smaller-sized capacitors and larger- sized capacitors of different sets are altematingly arranged along at least one of 1) a second direction, perpendicular to the first direction, 2) a third direction, perpendicular to the first and second directions, and 3) a direction that is angularly offset from the second and third directions.

8. The electrical power interposer of claim 5, wherein the electrical power interposer comprises conductive strips that secure the capacitors to the electrical contacts.

9. The electrical power interposer of claim 8, wherein each conductive strip is shaped so as to define a plurality of recesses that are offset from one another along the first direction, and each recess supports a capacitor of the plurality of capacitors therein.

10. The electrical power interposer of claim 9, wherein each conductive strip has for each recess, first and second engagement portions that are spaced from one another along the first direction so as to define one of the recess therebetween, and the first and second engagement portions of each recess engage opposed ends of one of the capacitors.

11. The electrical power interposer of claim 5, wherein the electrical contacts comprise a plurality of tabs to which the capacitors are attached.

12. The electrical power interposer of claim 11, wherein the plurality of tabs comprise a plurality of sets of the tabs, and each set of tabs extends from a contact body of one of the electrical contacts towards a set of tabs of an adjacent electrical contact.

13. The electrical power interposer of claim 11, wherein the tabs in each set are spaced from one another along the first direction.

14. The electrical power interposer of claim 11, wherein each tab of an electrical contact projects towards an adjacent tab of an adjacent electrical contact so as to define a gap between the tab and the adjacent tab, and a capacitor spans the gap.

15. The electrical power interposer of claim 11, wherein the plurality of electrical contacts comprises intermediate electrical contacts that are between two electrical contacts, and each intermediate electrical contact comprises first and second sets of tabs that extend in opposite directions from one another.

16. The electrical power interposer of claim 15, wherein the first and second sets of tabs of an intermediate electrical contact are staggered from one another such that tabs of the first set extend from a contact body of the intermediate electrical contact at a location that is between the tabs of the second set.

17. The electrical power interposer of claim 15, wherein a first set of capacitors are attached to the first set of tabs of an intermediate electrical contact, a second set of capacitors are attached to the second set of tabs of the intermediate electrical power, and the capacitors in the first set are staggered from the capacitors in the second set with respect to the first direction.

18. The electrical power interposer of claim 5, wherein the capacitors in each set of capacitors are spaced from one another along the first direction so as to define spaces therebetween, and the capacitors in a set of capacitors are in-line with the spaces between the capacitors in an adjacent set of capacitors along a direction, perpendicular to the first direction.

19. The electrical power interposer of claim 2, wherein the first and second mounting interfaces are offset from one another along a first direction, the electrical contacts are arranged in a plurality of rows that extend along a second direction, and the electrical contacts are arranged in a plurality of columns that extend along a third direction, wherein the first, second, and third directions are perpendicular to one another.

20. The electrical power interposer of claim 19, wherein each pair of the plurality of electrical contacts that are interconnected to one another are offset from one another along the second direction.

21. The electrical power interposer of claim 19, wherein each pair of the plurality of electrical contacts that are interconnected to one another are offset from one another along the third direction.

22. The electrical power interposer of claim 19, wherein each pair of the plurality of electrical contacts that are interconnected to one another are offset from one another along an angled direction that is angularly offset from the second and third directions.

23. The electrical power interposer of claim 1, wherein the plurality of capacitors are implemented as reverse geometry capacitors.

24. The electrical power interposer of claim 1, wherein the contacts in each pair are adjacent to one another.

25. The electrical power interposer of claim 1, wherein each electrical contact has a contact body that is linear as it extends from its first mounting end to its second mounting end.

26. The electrical power interposer of claim 1, wherein each electrical contact has a contact body that is curved or bent as it extends from its first mounting end to its second mounting end.

27. The electrical power interposer of claim 26, wherein each contact body has a curved or bent shape that is substantially sinusoidal.

28. The electrical power interposer of claim 27, wherein each electrical contact is a substantial mirror image of an adjacent electrical contact.

29. The electrical power interposer of claim 27, wherein each electrical contact defines at least one set of recesses that are offset from one another along a first direction that extends from the first mounting interface to the second mounting interface, and each capacitor of the plurality of capacitors is received in a different one of the recesses.

30. The electrical power interposer of claim 29, wherein each intermediate electrical contact that is disposed between two adjacent electrical contacts comprises a first set of recesses and a second set of recesses that are open towards opposing directions.

31. The electrical power interposer of claim 30, wherein the recesses in the first and second sets are altematingly offset from one another along the first direction.

32. The electrical power interposer of claim 29, wherein each capacitor is received a pair of opposing recesses of adjacent electrical contacts.

33. A system comprising:

at least one electrical component; and

the electrical power interposer of any one of claims 1 to 32, wherein at least one of the first mounting interface and the second mounting interface is mounted to the at last one electrical component.

34. The system of claim 33, wherein the at least one electrical component comprises an electrical component that is configured to provide power to the electrical power interposer.

35. The system of any one of claims 33 and 34, wherein the at least one electrical component comprises an electrical component that is configured to receive power from the electrical power interposer.

36. The system of any one of claims 33 to 35, comprising an integrated circuit mounted onto the at least one electrical component, wherein the integrated circuit is configured to receive power from the electrical power interposer.

37. The system of any one of claims 33 to 36, wherein the at least one electrical component comprises a printed circuit board (PCB).

38. The system of claim 33, wherein:

the at least one electrical component comprises a first electrical component and a second electrical component;

the first mounting interface is mounted to the first electrical component; and

the second mounting interface is mounted to the second electrical component.

39. The system of claim 38, wherein the electrical power interposer is configured to provide power from the first electrical component to the second electrical component.

40. The system of claim 38, wherein each of the first and second electrical components is a printed circuit board.

41. The system of any one of claims 38 and 39, comprising an integrated circuit mounted onto the second electrical component.

42. The system of any of claims 38 to 41, comprising at least one inner electrical component mounted to the second electrical component, between the first and second electrical components.

43. The system of claim 42, wherein the interposer spaces the first electrical component from the second electrical component so that the at least one inner electrical component does not mechanically interfere with the first electrical component.

44. The system of claim 42, wherein the at least one inner electrical component comprises at least one electrical connector.

45. The system of claim 42, wherein the at least one inner electrical component has an outer dimension along a first direction from the first mounting interface to the second mounting interface, and the electrical power interposer spaces the first and second electrical components from one another by at least the outer dimension.

46. The system of claim 38, wherein the second electrical component is an integrated circuit die mounted directly to the interposer.

47. A method of assembling an electrical system comprising a first electrical component and a second electrical component, the method comprising:

placing the first electrical component into electrical communication with the second electrical component through an electrical power interposer such that the electrical power interposer is configured to provide power from the first electrical component to the second electrical component through a plurality of electrical contacts of the electrical power interposer, wherein the electrical power interposer comprises a plurality of capacitors, each electrically coupled to a pair of the electrical contacts so as to limit inductance through the electrical power interposer when power is provided through the electrical power interposer.

48. The method of claim 47, wherein the placing step comprises a step of mounting the electrical power interposer onto the first electrical component.

49. The method of any one of claims 47 and 48, wherein the placing step comprises a step of mounting the electrical power interposer onto the second electrical connector.