WO2020222359A1 - Surface light source module for backlight device - Google Patents
Surface light source module for backlight device Download PDFInfo
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- WO2020222359A1 WO2020222359A1 PCT/KR2019/009186 KR2019009186W WO2020222359A1 WO 2020222359 A1 WO2020222359 A1 WO 2020222359A1 KR 2019009186 W KR2019009186 W KR 2019009186W WO 2020222359 A1 WO2020222359 A1 WO 2020222359A1
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- light
- light source
- source module
- diffusion member
- sealing layer
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0051—Diffusing sheet or layer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133611—Direct backlight including means for improving the brightness uniformity
Definitions
- the present invention relates to a display device, and more particularly, to an LED module for a backlight of a display device capable of simplifying a structure and a manufacturing process by applying a highly transparent substrate.
- a display device is a device that receives and displays an image signal, and includes a TV or a monitor, and is a liquid crystal display device (LCD) and an organic light emitting device (OLED) as a means for displaying an image.
- LCD liquid crystal display device
- OLED organic light emitting device
- Emitting Display plasma display device
- PDP Plasma Display Panel
- the LCD further includes a backlight device of a surface light source in addition to the liquid crystal panel, and the backlight device uniformly supplies a high-intensity light source to the liquid crystal panel, thereby realizing a quality image.
- the backlight device refers to a surface lighting device for realizing an image of a display device such as an LCD, and is classified into a direct lighting type or an edge lighting type according to a position at which a light source is disposed.
- a light source of a backlight device a light emitting diode (hereinafter referred to as'LED') having advantages such as small size, low power consumption, and high reliability is mainly used.
- LED devices widely used in direct-type backlight devices can primarily disperse light generated from the LED devices widely through a secondary lens so that the thickness of the backlight device can be reduced and light can be uniformly irradiated.
- Korean Patent Publication No. 10-2015-0050655 introduces a'surface light source display device'.
- a plurality of light-emitting elements 12 are formed on a substrate 11 while securing a predetermined distance, and the lower surface of the light-emitting element 12 A first reflective layer 13 and a second reflective layer 14 are formed on the upper and upper surfaces, respectively.
- the transparent resin layer 15 is filled in the space between the light emitting elements 12, and the wavelength conversion sheet 16 is coupled to the light emitting element 12 and the transparent resin layer 15.
- the surface light source display device In the surface light source display device, light emitted from the light emitting element 12 is reflected by the first reflective layer 13 and the second reflective layer 14 and is emitted to the transparent resin layer 15 on the side surface, and then is emitted upward.
- the conventional surface light source display device as described above exhibits advantageous advantages in slimming and lightening.
- the conventional surface light source display device since the light of the light emitting element is guided to the side by the first reflective layer and the second reflective layer and is emitted, there is a disadvantage in overall luminance.
- An object of the present invention is to provide a surface light source module that is advantageous for slimming a backlight device.
- an object of the present invention is to provide a surface light source module of a direct type backlight device capable of improving light uniformity by preventing hot spots while exhibiting high luminance.
- the surface light source module of this embodiment for achieving the above-described problems includes: a substrate on which a circuit is printed, a molding unit coupled to the substrate while providing a plurality of cavities, a light-emitting element mounted on the substrate within the cavity, and the A sealing layer filled in the cavity while sealing the light emitting device, and a plurality of light blocking patterns formed at positions corresponding to 1:1 with the plurality of light emitting devices, and the light emitting device and the light blocking pattern corresponding to each other are vertical Including a diffusion member laminated on the upper surface of the sealing layer so that the central axis coincides with each other, light emitted from the light emitting element is reflected and diffused by the light blocking pattern, and is mixed and emitted in the diffusion member region.
- the sealing layer may be made of a silicone material having adhesive strength.
- the light blocking pattern may be formed on an upper surface of the diffusion member, and may form a three-dimensional structure in a hemispherical, semi-elliptical, or polygonal pyramid shape.
- the molding part may have a first reflective surface on a side surface of the cavity and a second reflective surface on an upper surface.
- the first reflective surface may have an inclined surface or a convex curved surface shape.
- a transparent resin may be filled in the cavity through a screen printing process, and a diffusion member may be laminated without a separate bonding process, thereby simplifying the manufacturing process and shortening the manufacturing time.
- FIG. 1 is a cross-sectional view showing a surface light source display device according to the prior art
- FIG. 2 is an exploded perspective view showing the main configuration of a surface light source module according to an embodiment of the present subject
- FIG. 3 is an I-I cross-sectional view showing the surface light source module of FIG. 2;
- FIG. 5 is a cross-sectional view showing a surface light source module according to another embodiment of the present subject.
- FIG. 2 is an exploded perspective view showing a main configuration of a surface light source module according to an embodiment of the present subject
- FIG. 3 is a cross-sectional view in the direction I-I showing the surface light source module of FIG. 2.
- the surface light source module of the present embodiment includes a substrate 100 on which a circuit is printed, a plurality of LED elements 200 mounted on the substrate 100, and an LED element 200 on the substrate 100. ) Forming a cavity 310, a molding part 300 formed to a predetermined height while forming a cavity 310, a sealing layer 400 that seals the LED element 200 while being filled in the cavity 310, a light blocking pattern ( It includes a diffusion member 500 laminated to the sealing layer 400 while having 510.
- the substrate 100 may be composed of a printed circuit board (PCB) or a flexible printed circuit board (FPCB).
- PCB printed circuit board
- FPCB flexible printed circuit board
- the LED device 200 is a light emitting source of a surface light source module, and is mounted on the substrate 100 by die bonding and wire bonding to be electrically connected. A plurality of LED elements 200 are mounted horizontally, vertically, and in arbitrary directions while forming a predetermined interval.
- the LED device 200 may be configured as a top view type device emitting light upward or a multi-faceted light emitting device including an upper light emitting surface.
- the molding part 300 forms a cavity 310 which is a space in which the LED device 200 is mounted.
- the molding part 300 forms a partition wall shape having a predetermined height on the substrate 100, and the height of the molding part 300 is at least higher than the LED device 200 so as to protect the LED device 200 It is preferably formed of.
- One or more LED devices 200 may be mounted in one cavity 310 formed by the molding part 300.
- the molding part 300 may be formed by bonding to the substrate 100 after a resin of an insulating material is formed in a plate shape, or by directly molding an insulating resin on the substrate 100 by a process such as insert molding.
- the molding unit 300 functions as a reflective member that reflects light emitted from the LED element 200 while exposing the LED element 200 through the cavity 310.
- the molding part 300 may be made of a material having a high reflectance.
- the molding part 300 includes a first reflective surface 320 in a vertical direction formed on the side of the cavity 310 and a second reflective surface 330 formed on the upper surface.
- the first reflective surface 320 forms a reflective surface in a vertical direction to reflect light emitted from the side of the LED element 200 to the optical mixing space S
- the second reflective surface 330 is a half horizontal direction. The slope is formed to reflect light reflected from the light blocking pattern 510 or distributed in the light mixing space S upwardly.
- the sealing layer 400 is filled with a transparent resin in the cavity 310 to protect the LED element 200 and diffuse the light emitted from the LED element 200.
- the sealing layer 400 may be made of a resin material having high transparency, and for example, it may be made of a transparent material including any one or more of PS, PC, PMMA, PE, PET, PP, and MMA-styrene. It can be, and if it is a material having high transparency, it is not limited to the type.
- the sealing layer 400 may be formed by filling the inside of the cavity 310 with a gel-like transparent resin through a screen printing process and curing it. Accordingly, the sealing layer 400 may have improved uniformity such as thickness and density. A light scattering material may be dispersed in the sealing layer 400 to diffuse light as necessary. In addition, a phosphor for converting a wavelength of light may be dispersed in the sealing layer 400 according to the type of the LED element 200.
- the sealing layer 400 may also be formed on the second reflective surface 330 in order to efficiently laminate the diffusion member 500 together with the space inside the cavity 310.
- the thickness of the sealing layer 400 formed on the second reflective surface 330 is a thickness such that the diffusion member 500 can be adhered, and the transparent resin is used as the second reflective surface 330 according to the screen printing process. ) It is enough to print on the surface. Therefore, since the silicone resin constituting the sealing layer 400 exhibits adhesiveness by itself, the diffusion member 500 can be easily coupled even if a separate adhesive means is not applied.
- the diffusion member 500 is bonded to the upper surface of the sealing layer 400 to protect the sealing layer 400 and provide a light mixing space S in which the light emitted from the LED device 200 is mixed.
- the diffusion member 500 for this may be made of a resin having high transparency, and for example, a transparent sheet or plate such as PC, PS, or PMMA may be used.
- the diffusion member 500 has a thickness at which a minimum optical distance OD is secured in order to sufficiently perform optical mixing. Accordingly, the surface light source device of the present embodiment may provide a surface light source device showing the best light uniformity by applying the diffusion member 500 having a predetermined thickness according to the emission characteristics of the LED element 200. In this embodiment, the diffusion member 500 may have a thickness of 0.05 to 4.5 mm.
- the diffusion member 500 includes a light blocking pattern 510.
- the shading pattern 510 reflects and diffuses the light emitted from the upper surface of the LED device 200 into the space between the LED devices, thereby improving overall light uniformity of the light emitted from the surface light source module.
- the light blocking pattern 510 may be formed by coating ink or resin having a predetermined reflectance on the upper surface of the diffusion member 500.
- the light blocking pattern 510 has a diameter larger than the light exit surface of the LED device 200 at least, and may form a three-dimensional structure of a hemispherical shape, a semi-elliptic shape, or a polygonal pyramid shape.
- a plurality of shading patterns 510 are formed at positions corresponding to the LED element 200 in a 1:1 manner.
- the diffusion member 500 having the light blocking pattern 510 is directly adhered to the upper surface of the sealing layer 400 by laminating. This is because, as the sealing layer 400 is made of a resin material such as silicone, the diffusion member 500 can be easily adhered without a separate adhesive member.
- the surface light source module of this embodiment is advantageous in slimming the backlight device because a separate configuration such as a light diffusion lens is not required by controlling the light uniformity by a diffusion member made of a transparent material and a light blocking member formed on one surface thereof. It has the effect of simplifying and can be manufactured by a process of directly laminating the diffusion member without a separate adhesive member, thereby simplifying the manufacturing process.
- FIG. 4 is a flowchart showing a manufacturing process of the surface light source module according to the present embodiment.
- a substrate 100 on which an LED element 200 is mounted and a molding part 300 formed along the periphery of the LED element 200 is prepared.
- the molding part 300 may be formed by manufacturing a plate in which the cavity 310 is formed and bonding to the substrate 100, or by directly molding an insulating resin on the substrate 100.
- a transparent resin is filled in the cavity 310 by using screen printing as shown.
- the filling of the transparent resin can be sufficiently performed by screen printing about 1 to 2 times, so that the process time can be shortened, and at the same time, the filled transparent resin can have excellent uniformity.
- the filled transparent resin is cured under conditions to form a sealing layer.
- a diffusion member 500 having a light blocking pattern 510 formed on one surface thereof is manufactured and prepared in a separate process, and the diffusion member 500 is laminated on the upper surface of the sealing layer 400 using a rolling device.
- the plurality of shading patterns 510 and the LED element 200 must be corresponded to each other in a 1:1 manner, and laminated so that the corresponding shading patterns 510 and the vertical central axis of the LED element 200 coincide. Since the diffusion member 500 is adhered using the adhesive force of the sealing layer 400, a separate molding process for bonding may be eliminated.
- the surface light source module is completed by laminating the diffusion member 500 and then removing the protective paper 500 ′ protecting the light blocking pattern 510.
- FIG. 5 is a cross-sectional view showing a surface light source module according to another embodiment of the present subject.
- the first reflective surface 320 provided in the molding part 300 has an inclined surface structure. That is, the first reflective surface 320 is inclined upward so that the width of the cavity 310 increases as it goes upward.
- the first reflective surface 320 having such an inclined structure may further improve light uniformity by dispersing light emitted from the LED device 200 into a space between the LED devices.
- the first reflective surface 320 may have a convex curved shape. Since the curved first reflective surface 320 does not form a bent corner at the connection portion between the first reflective surface 320 and the second reflective surface 330, the first reflective surface 320 and the second reflective surface 330 ) To alleviate the surface tension that may occur on the surface of the joint. Therefore, the first reflective surface 320 having a convex curved shape minimizes the occurrence of reflow due to surface tension when the transparent resin for forming the sealing layer 400 is cured, thereby preventing deterioration of optical properties due to reflow. I can.
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Abstract
The present invention relates to an LED module for a backlight of a display device that can simplify the structure and manufacturing process thereof by applying a high-transparency substrate. The surface light source module of the present embodiment comprises: a circuit-printed board; a molding unit coupled to the board while providing a plurality of cavities; a light-emitting element mounted on the board inside the cavities; a sealing layer filled in the cavities while sealing the light-emitting element; and a diffusion member having a plurality of light-shielding patterns formed in positions corresponding one-to-one to the plurality of light-emitting elements and laminated on the upper surface of the sealing layer such that the vertical central axes of the light-emitting elements and the light-shielding patterns corresponding to each other coincide, wherein light emitted from the light-emitting elements is reflected and diffused by the light-shielding patterns, and is mixed and emitted in the area of the diffusion member.
Description
본 발명은 디스플레이 장치에 관한 것으로, 더욱 상세하게는 고투명 기재를 적용하여 구조와 제조 공정을 단순화할 수 있는 디스플레이 장치의 백라이트용 LED 모듈에 관한 것이다.The present invention relates to a display device, and more particularly, to an LED module for a backlight of a display device capable of simplifying a structure and a manufacturing process by applying a highly transparent substrate.
일반적으로 디스플레이 장치는 영상 신호를 전달받아 표시하는 장치로, TV나 모니터 등이 이에 속하며, 영상을 표시하기 위한 수단으로 액정표시장치(LCD : Liquid Crystal Display Device), 유기발광장치(OLED : Organic Light Emitting Display), 플라즈마표시장치(PDP : Plasma Display Panel) 등 다양한 장치가 이용되고 있다.In general, a display device is a device that receives and displays an image signal, and includes a TV or a monitor, and is a liquid crystal display device (LCD) and an organic light emitting device (OLED) as a means for displaying an image. Emitting Display), plasma display device (PDP: Plasma Display Panel), etc. are used.
LCD는 다른 표시장치와는 달리 그 자체에서 빛을 발하지 못하여, 고품질의 화상을 실현하기 위해서는 반드시 별도의 외부 광원을 필요로 한다. 따라서 LCD는 액정패널 외에 면광원의 백라이트 장치를 더 포함하고, 백라이트 장치가 액정패널로 고휘도의 광원을 균일하게 공급함으로써 양질의 화상을 구현하게 된다. 이와 같이 백라이트 장치는 LCD와 같은 디스플레이 장치의 화상을 실현하기 위한 면조명 장치를 말하며, 광원이 배치되는 위치에 따라 직하형(Direct Lighting type) 또는 측면형(Edge Lighting type) 백라이트 장치로 구분된다. 백라이트 장치의 광원으로는 소형, 저소비 전력, 고신뢰성 등의 장점을 갖는 발광다이오드(Light Emitting Diode, 이하 'LED'라 함)가 주로 이용되고 있다.Unlike other display devices, LCDs do not emit light on their own, and therefore require a separate external light source in order to realize high-quality images. Accordingly, the LCD further includes a backlight device of a surface light source in addition to the liquid crystal panel, and the backlight device uniformly supplies a high-intensity light source to the liquid crystal panel, thereby realizing a quality image. As described above, the backlight device refers to a surface lighting device for realizing an image of a display device such as an LCD, and is classified into a direct lighting type or an edge lighting type according to a position at which a light source is disposed. As a light source of a backlight device, a light emitting diode (hereinafter referred to as'LED') having advantages such as small size, low power consumption, and high reliability is mainly used.
직하형 백라이트 장치에서 널리 사용되는 LED 소자는 백라이트 장치의 두께를 줄이는 동시에 광을 균일하게 조사할 수 있도록, 1차로 LED 소자에서 발생된 빛을 2차 렌즈를 통해서 넓게 분산시킬 수 있다.LED devices widely used in direct-type backlight devices can primarily disperse light generated from the LED devices widely through a secondary lens so that the thickness of the backlight device can be reduced and light can be uniformly irradiated.
그러나, 종래의 백라이트 장치는 2차 렌즈와 같이 특정 기구물을 삽입하여 제품의 전체적인 두께가 증가되며, 제품의 슬림화, 경량화 또는 플렉시블한 제품을 만드는 데에 한계가 있고, 성형성이 저하되는 문제가 있다. 이러한 문제점을 해결하기 위하여, 한국공개특허 10-2015-0050655호에는 '면광원 디스플레이 장치'를 소개하고 있다. However, in the conventional backlight device, the overall thickness of the product is increased by inserting a specific device such as a secondary lens, and there is a limitation in making the product slimmer, lighter, or flexible, and there is a problem that the moldability is deteriorated. . In order to solve this problem, Korean Patent Publication No. 10-2015-0050655 introduces a'surface light source display device'.
도 1에 도시된 바와 같이 상기 선행문헌에 의한 종래의 면광원 디스플레이 장치는, 기판(11) 상에 소정의 간격을 확보하면서 다수의 발광 소자(12)가 형성되고, 발광 소자(12)의 하면과 상면에 각각 제 1 반사층(13), 제 2 반사층(14)이 형성된다. 또한, 발광 소자(12) 사이의 공간에는 투명 수지층(15)이 채워지고, 발광 소자(12)와 투명 수지층(15) 상부에는 파장변환시트(16)가 결합된다. As shown in FIG. 1, in the conventional surface light source display device according to the prior literature, a plurality of light-emitting elements 12 are formed on a substrate 11 while securing a predetermined distance, and the lower surface of the light-emitting element 12 A first reflective layer 13 and a second reflective layer 14 are formed on the upper and upper surfaces, respectively. In addition, the transparent resin layer 15 is filled in the space between the light emitting elements 12, and the wavelength conversion sheet 16 is coupled to the light emitting element 12 and the transparent resin layer 15.
상기 면광원 디스플레이 장치는 발광 소자(12)에서 출사되는 빛은 제 1 반사층(13)과 제 2 반사층(14)에 반사되면서 측면의 투명 수지층(15)으로 출사된 후, 상측으로 출사된다. In the surface light source display device, light emitted from the light emitting element 12 is reflected by the first reflective layer 13 and the second reflective layer 14 and is emitted to the transparent resin layer 15 on the side surface, and then is emitted upward.
상기와 같은 종래의 면광원 디스플레이 장치는 슬림화 및 경량화에 유리한 장점을 나타낸다. 그러나 종래의 면광원 디스플레이 장치는, 발광 소자의 빛이 제 1 반사층 및 제 2 반사층에 의하여 측면으로 유도되어 출사되므로, 전체적인 휘도에 불리한 단점이 있다.The conventional surface light source display device as described above exhibits advantageous advantages in slimming and lightening. However, in the conventional surface light source display device, since the light of the light emitting element is guided to the side by the first reflective layer and the second reflective layer and is emitted, there is a disadvantage in overall luminance.
또한, 종래의 면광원 디스플레이 장치는, 발광 소자 상면에 반사층이 형성되므로, 반사층에 의한 암부 영역과 그 사이의 명부 영역에서 빛이 충분히 믹싱(mixing)되지 못하여 광 균일도가 저하되는 문제점이 있다.In addition, in the conventional surface light source display device, since a reflective layer is formed on an upper surface of a light emitting element, there is a problem in that light uniformity is not sufficiently mixed in a dark region by the reflective layer and a bright region therebetween.
또한, 종래의 면광원 디스플레이 장치는, 휘도를 향상시키기 위하여 탑뷰 방식의 발광 소자를 채용하는 경우 발광 소자에 의한 핫 스팟(hot spot)이 시인되어 광 특성이 저하되는 문제점 있다.In addition, in the conventional surface light source display device, when a top-view type light emitting device is employed in order to improve luminance, a hot spot by the light emitting device is visually recognized, thereby deteriorating light characteristics.
본 발명의 과제는, 백라이트 장치의 슬림화에 유리한 면광원 모듈을 제공하는 것이다. An object of the present invention is to provide a surface light source module that is advantageous for slimming a backlight device.
또한, 본 발명의 과제는, 높은 휘도를 나타냄과 동시에 핫 스팟을 방지하여 광 균일도를 향상시킬 수 있는 직하형 백라이트 장치의 면광원 모듈을 제공하는 것이다.Further, an object of the present invention is to provide a surface light source module of a direct type backlight device capable of improving light uniformity by preventing hot spots while exhibiting high luminance.
상기와 같은 과제를 달성하기 위한 본 실시예의 면광원 모듈은, 회로가 인쇄된 기판, 다수의 캐비티를 제공하면서 상기 기판 상에 결합되는 몰딩부, 상기 캐비티 내부에서 상기 기판에 실장되는 발광 소자, 상기 발광 소자를 밀봉하면서 상기 캐비티 내에 충진되는 밀봉층, 및, 다수의 상기 발광 소자와 1:1로 대응되는 위치에 형성되는 다수의 차광패턴을 가지며, 서로 대응하는 상기 발광 소자와 상기 차광패턴의 수직 중심축이 일치하도록 상기 밀봉층 상면에 라미네이팅되는 확산부재를 포함하여, 상기 발광 소자에서 출사되는 빛이 상기 차광패턴에 의하여 반사 및 확산되고, 상기 확산부재 영역 내에서 믹싱되어 출사된다.The surface light source module of this embodiment for achieving the above-described problems includes: a substrate on which a circuit is printed, a molding unit coupled to the substrate while providing a plurality of cavities, a light-emitting element mounted on the substrate within the cavity, and the A sealing layer filled in the cavity while sealing the light emitting device, and a plurality of light blocking patterns formed at positions corresponding to 1:1 with the plurality of light emitting devices, and the light emitting device and the light blocking pattern corresponding to each other are vertical Including a diffusion member laminated on the upper surface of the sealing layer so that the central axis coincides with each other, light emitted from the light emitting element is reflected and diffused by the light blocking pattern, and is mixed and emitted in the diffusion member region.
여기서, 상기 밀봉층은, 점착력을 갖는 실리콘 소재로 구성될 수 있다.Here, the sealing layer may be made of a silicone material having adhesive strength.
또한, 상기 차광패턴은, 상기 확산부재 상면에 형성되고, 반구형, 반타원형 또는 다각형의 피라미드 형상의 입체 구조를 이룰 수 있다.In addition, the light blocking pattern may be formed on an upper surface of the diffusion member, and may form a three-dimensional structure in a hemispherical, semi-elliptical, or polygonal pyramid shape.
또한, 상기 몰딩부는, 상기 캐비티 측면의 제 1 반사면과, 상면의 제 2 반사면을 가질 수 있다.In addition, the molding part may have a first reflective surface on a side surface of the cavity and a second reflective surface on an upper surface.
또한, 상기 제 1 반사면은, 경사면 또는 볼록한 곡면 형상을 이룰 수 있다.In addition, the first reflective surface may have an inclined surface or a convex curved surface shape.
본 발명은, 투명 수지 소재의 확산부재과 그 일면에 형성되는 차광부재에 의하여 광 균일도를 제어함으로써, 광 확산 렌즈와 같은 별도의 구성이 요구되지 않아 백라이트 장치의 슬림화에 유리하고 구조를 단순화하는 효과가 있다.In the present invention, by controlling the light uniformity by a diffusion member made of a transparent resin material and a light blocking member formed on one side thereof, a separate configuration such as a light diffusion lens is not required, thus advantageous in slimming the backlight device and simplifying the structure. have.
또한, 본 발명은 스크린 프린팅 공정으로 캐비티 내에 투명 수지가 충진될 수 있고, 별도의 접착 공정 없이 확산부재가 라미네이팅될 수 있어, 제조 공정을 단순화하고 제조 시간을 단축할 수 있다.In addition, according to the present invention, a transparent resin may be filled in the cavity through a screen printing process, and a diffusion member may be laminated without a separate bonding process, thereby simplifying the manufacturing process and shortening the manufacturing time.
도 1은 종래의 기술에 따른 면광원 디스플레이 장치를 나타낸 단면도,1 is a cross-sectional view showing a surface light source display device according to the prior art;
도 2는 본 과제의 실시예에 따른 면광원 모듈의 주요 구성을 나타낸 분해 사시도,2 is an exploded perspective view showing the main configuration of a surface light source module according to an embodiment of the present subject,
도 3은 도 2의 면광원 모듈을 나타낸 I-I 단면도,3 is an I-I cross-sectional view showing the surface light source module of FIG. 2;
도 4는 본 실시예에 따른 면광원 모듈의 제조 과정을 나타낸 공정도,4 is a process chart showing the manufacturing process of the surface light source module according to the present embodiment,
도 5는 본 과제의 다른 실시예에 따른 면광원 모듈을 나타낸 단면도.5 is a cross-sectional view showing a surface light source module according to another embodiment of the present subject.
본 발명과 본 발명의 실시에 의해 달성되는 기술적 과제는 다음에서 설명하는 바람직한 실시예들에 의해 명확해질 것이다. 이하 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 상세히 살펴보기로 한다.The present invention and the technical problem achieved by the implementation of the present invention will be clarified by the preferred embodiments described below. Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
후술되는, 본 실시예의 차이는 상호 배타적이지 않은 사항으로 이해되어야 한다. 즉 본 발명의 기술 사상 및 범위를 벗어나지 않으면서, 기재되어 있는 특정 형상, 구조 및 특성은, 일 실시예에 관련하여 다른 실시예로 구현될 수 있으며, 각각의 개시된 실시예 내의 개별 구성요소의 위치 또는 배치는 변경될 수 있음이 이해되어야 하며, 도면에서 유사한 참조부호는 여러 측면에 걸쳐서 동일하거나 유사한 기능을 지칭하며, 길이, 면적 및 두께 등과 그 형태는 편의를 위하여 과장되어 표현될 수도 있다. It should be understood that the differences between the present embodiments, which will be described later, are not mutually exclusive. That is, without departing from the spirit and scope of the present invention, specific shapes, structures, and characteristics described may be implemented in other embodiments in relation to one embodiment, and the location of individual components within each disclosed embodiment. Alternatively, it should be understood that the arrangement may be changed, and similar reference numerals in the drawings refer to the same or similar functions over various aspects, and the length, area, thickness, and the like may be exaggerated for convenience.
도 2는 본 과제의 실시예에 따른 면광원 모듈의 주요 구성을 나타낸 분해 사시도이고, 도 3은 도 2의 면광원 모듈을 나타낸 I-I 방향의 단면도이다.2 is an exploded perspective view showing a main configuration of a surface light source module according to an embodiment of the present subject, and FIG. 3 is a cross-sectional view in the direction I-I showing the surface light source module of FIG. 2.
이들 도면에 도시된 바와 같이 본 실시예의 면광원 모듈은, 회로가 인쇄된 기판(100)과, 기판(100)에 실장되는 다수의 LED 소자(200), 기판(100) 상에 LED 소자(200)가 배치되는 캐비티(310, cavity)를 형성하면서 소정의 높이로 형성되는 몰딩부(300), 캐비티(310) 내부에 충진되면서 LED 소자(200)를 밀봉하는 밀봉층(400), 차광패턴(510)을 가지면서 밀봉층(400)에 라미네이팅되는 확산부재(500)를 포함한다. As shown in these drawings, the surface light source module of the present embodiment includes a substrate 100 on which a circuit is printed, a plurality of LED elements 200 mounted on the substrate 100, and an LED element 200 on the substrate 100. ) Forming a cavity 310, a molding part 300 formed to a predetermined height while forming a cavity 310, a sealing layer 400 that seals the LED element 200 while being filled in the cavity 310, a light blocking pattern ( It includes a diffusion member 500 laminated to the sealing layer 400 while having 510.
구체적으로 살펴보면, 기판(100)은 LED 소자(200)를 구동시키기 위한 소정의 회로가 인쇄되면, 인쇄회로기판(PCB)이나 플렉시블 인쇄회로기판(FPCB) 등으로 구성될 수 있다. Specifically, when a predetermined circuit for driving the LED element 200 is printed, the substrate 100 may be composed of a printed circuit board (PCB) or a flexible printed circuit board (FPCB).
LED 소자(200)는 면광원 모듈의 발광원으로, 다이 본딩 및 와이어 본딩으로 기판(100)에 실장되어 전기적으로 연결된다. LED 소자(200)는 소정의 간격을 이루면서 가로, 세로 및 임의의 방향으로 다수 개 실장된다. LED 소자(200)는 상측으로 빛을 발하는 탑 뷰(top view) 방식의 소자 또는 상측 출광면을 포함하는 다면 발광 소자로 구성될 수 있다. The LED device 200 is a light emitting source of a surface light source module, and is mounted on the substrate 100 by die bonding and wire bonding to be electrically connected. A plurality of LED elements 200 are mounted horizontally, vertically, and in arbitrary directions while forming a predetermined interval. The LED device 200 may be configured as a top view type device emitting light upward or a multi-faceted light emitting device including an upper light emitting surface.
몰딩부(300)는 LED 소자(200)가 실장되기 위한 공간인 캐비티(310)를 형성한다. 이를 위한 몰딩부(300)는 기판(100) 상에 소정의 높이를 갖는 격벽 형상을 이루고, 몰딩부(300)의 높이는 LED 소자(200)를 보호할 수 있도록 적어도 LED 소자(200)보다 높은 높이로 형성되는 것이 바람직하다. 몰딩부(300)가 형성하는 하나의 캐비티(310) 내에는 하나 또는 다수의 LED 소자(200)가 실장될 수 있다. 이러한 몰딩부(300)는 절연 소재의 수지가 플레이트 형상으로 형성된 후 기판(100)에 결합되거나, 인서트 몰딩 등의 공정으로 절연 수지를 기판(100) 상에 직접 몰딩하여 형성할 수 있다.The molding part 300 forms a cavity 310 which is a space in which the LED device 200 is mounted. For this, the molding part 300 forms a partition wall shape having a predetermined height on the substrate 100, and the height of the molding part 300 is at least higher than the LED device 200 so as to protect the LED device 200 It is preferably formed of. One or more LED devices 200 may be mounted in one cavity 310 formed by the molding part 300. The molding part 300 may be formed by bonding to the substrate 100 after a resin of an insulating material is formed in a plate shape, or by directly molding an insulating resin on the substrate 100 by a process such as insert molding.
또한, 몰딩부(300)는 캐비티(310)를 통하여 LED 소자(200)를 노출시키면서 LED 소자(200)에서 출사되는 빛을 반사시키는 반사부재로 기능한다. 이를 위한 몰딩부(300)는 고반사율을 갖는 소재로 구성될 수 있다. 따라서, 몰딩부(300)는 캐비티(310) 측면에 형성되는 수직 방향의 제 1 반사면(320)과, 상면에 형성되는 제 2 반사면(330)을 포함한다. 제 1 반사면(320)은 수직 방향의 반사면을 형성하여 LED 소자(200)에서 측면으로 출사되는 빛을 광 믹싱 공간(S)으로 반사시키고, 제 2 반사면(330)은 수평 방향의 반사면을 형성하여 차광패턴(510)에서 반사되거나 광 믹싱 공간(S)에 분포하는 빛을 상측으로 반사한다.In addition, the molding unit 300 functions as a reflective member that reflects light emitted from the LED element 200 while exposing the LED element 200 through the cavity 310. For this, the molding part 300 may be made of a material having a high reflectance. Accordingly, the molding part 300 includes a first reflective surface 320 in a vertical direction formed on the side of the cavity 310 and a second reflective surface 330 formed on the upper surface. The first reflective surface 320 forms a reflective surface in a vertical direction to reflect light emitted from the side of the LED element 200 to the optical mixing space S, and the second reflective surface 330 is a half horizontal direction. The slope is formed to reflect light reflected from the light blocking pattern 510 or distributed in the light mixing space S upwardly.
밀봉층(400)은 투명 수지가 캐비티(310) 내부에 충진되어 LED 소자(200)를 보호하고, LED 소자(200)에서 출사되는 빛을 확산시키는 기능을 한다. 이를 위한 밀봉층(400)은 고투명도를 갖는 수지 재질로 구성될 수 있으며, 일 예로, PS, PC, PMMA, PE, PET, PP, MMA-styrene 중 어느 하나 이상을 포함하는 투명 소재로 구성될 수 있고, 고투명도를 갖는 소재라면 그 종류에 한정되지 않는다.The sealing layer 400 is filled with a transparent resin in the cavity 310 to protect the LED element 200 and diffuse the light emitted from the LED element 200. For this purpose, the sealing layer 400 may be made of a resin material having high transparency, and for example, it may be made of a transparent material including any one or more of PS, PC, PMMA, PE, PET, PP, and MMA-styrene. It can be, and if it is a material having high transparency, it is not limited to the type.
밀봉층(400)을 겔(gel) 상의 투명 수지를 스크린 인쇄(Screen Printing) 공정으로 캐비티(310) 내부에 충진하고, 이를 경화시켜 형성할 수 있다. 따라서, 밀봉층(400)은 두께나 밀도 등의 균일성(uniformity)이 향상될 수 있다. 밀봉층(400)에는 필요에 따라 광 확산을 위하여 광 산란재가 분산될 수 있다. 또한, 밀봉층(400) 내부에는 LED 소자(200)의 종류에 따라 빛의 파장을 변환시키기 위한 형광체도 분산될 수 있다. The sealing layer 400 may be formed by filling the inside of the cavity 310 with a gel-like transparent resin through a screen printing process and curing it. Accordingly, the sealing layer 400 may have improved uniformity such as thickness and density. A light scattering material may be dispersed in the sealing layer 400 to diffuse light as necessary. In addition, a phosphor for converting a wavelength of light may be dispersed in the sealing layer 400 according to the type of the LED element 200.
밀봉층(400)은 캐비티(310) 내부의 공간과 함께 확산부재(500)를 효율적으로 라미네이팅 시키기 위하여 제 2 반사면(330)에도 형성될 수 있다. 이때, 제 2 반사면(330)에 형성되는 밀봉층(400)의 두께는, 확산부재(500)가 접착될 수 있는 정도의 두께로서, 스크린 인쇄 공정에 따라 투명 수지가 제 2 반사면(330) 표면에 인쇄되는 정도로도 충분하다. 따라서 밀봉층(400)을 구성하는 실리콘 수지는 그 자체에서 점착성을 나타내므로, 별도의 접착 수단이 적용되지 않더라도 확산부재(500)가 쉽게 결합될 수 있다.The sealing layer 400 may also be formed on the second reflective surface 330 in order to efficiently laminate the diffusion member 500 together with the space inside the cavity 310. At this time, the thickness of the sealing layer 400 formed on the second reflective surface 330 is a thickness such that the diffusion member 500 can be adhered, and the transparent resin is used as the second reflective surface 330 according to the screen printing process. ) It is enough to print on the surface. Therefore, since the silicone resin constituting the sealing layer 400 exhibits adhesiveness by itself, the diffusion member 500 can be easily coupled even if a separate adhesive means is not applied.
확산부재(500)는 밀봉층(400) 상면에 접합되어 밀봉층(400)을 보호하고 LED 소자(200)에서 출사된 빛이 믹싱되는 광 믹싱 공간(S)을 제공한다. 이를 위한 확산부재(500)는 높은 투명도를 갖는 수지로 구성될 수 있으며, 일 예로, PC, PS, PMMA 등의 투명 시트 또는 플레이트가 이용될 수 있다.The diffusion member 500 is bonded to the upper surface of the sealing layer 400 to protect the sealing layer 400 and provide a light mixing space S in which the light emitted from the LED device 200 is mixed. The diffusion member 500 for this may be made of a resin having high transparency, and for example, a transparent sheet or plate such as PC, PS, or PMMA may be used.
또한, 확산부재(500)는 광 믹싱이 충분히 이루어지기 위하여 최소의 광학 거리(OD)가 확보되는 두께를 갖는다. 따라서 본 실시예의 면광원 장치는 LED 소자(200)의 출사 특성에 따라 소정의 두께를 갖는 확산부재(500)를 적용함으로써, 최상의 광 균일도를 나타내는 면광원 장치를 제공할 수 있다. 본 실시예에서는 확산부재(500)는 0.05 내지 4.5mm의 두께를 가질 수 있다.Further, the diffusion member 500 has a thickness at which a minimum optical distance OD is secured in order to sufficiently perform optical mixing. Accordingly, the surface light source device of the present embodiment may provide a surface light source device showing the best light uniformity by applying the diffusion member 500 having a predetermined thickness according to the emission characteristics of the LED element 200. In this embodiment, the diffusion member 500 may have a thickness of 0.05 to 4.5 mm.
또한, 확산부재(500)는 차광패턴(510)을 구비한다. 차광패턴(510)은 LED 소자(200)의 상면으로 출사되는 빛을 LED 소자 사이의 공간으로 반사 및 확산시켜 면광원 모듈에서 출사되는 빛의 전체적인 광 균일도를 향상시킨다. 이를 위한 차광패턴(510)은 소정의 반사율을 갖는 잉크 또는 수지가 확산부재(500) 상면에 코팅되어 형성될 수 있다. In addition, the diffusion member 500 includes a light blocking pattern 510. The shading pattern 510 reflects and diffuses the light emitted from the upper surface of the LED device 200 into the space between the LED devices, thereby improving overall light uniformity of the light emitted from the surface light source module. For this, the light blocking pattern 510 may be formed by coating ink or resin having a predetermined reflectance on the upper surface of the diffusion member 500.
또한, 차광패턴(510)은, 적어도 LED 소자(200)의 출광면 보다 큰 직경을 가지며, 일 예로, 반구 형상, 반타원 형상 또는 다각형의 피라미드 형상의 입체 구조를 이룰 수 있다. 또한, 차광패턴(510)은 LED 소자(200)와 1:1로 대응하는 위치에서 다수 개 형성된다. 차광패턴(510)을 갖는 확산부재(500)는 라미네이팅으로 밀봉층(400) 상면에 직접 접착된다. 밀봉층(400)이 실리콘과 같은 수지 재질로 이루어짐에 따라 확산부재(500)는 별도의 접착부재 없이 쉽게 접착될 수 있기 때문이다. In addition, the light blocking pattern 510 has a diameter larger than the light exit surface of the LED device 200 at least, and may form a three-dimensional structure of a hemispherical shape, a semi-elliptic shape, or a polygonal pyramid shape. In addition, a plurality of shading patterns 510 are formed at positions corresponding to the LED element 200 in a 1:1 manner. The diffusion member 500 having the light blocking pattern 510 is directly adhered to the upper surface of the sealing layer 400 by laminating. This is because, as the sealing layer 400 is made of a resin material such as silicone, the diffusion member 500 can be easily adhered without a separate adhesive member.
이와 같은 본 실시예의 면광원 모듈은, 투명 소재인 확산부재과 그 일면에 형성되는 차광부재에 의하여 광 균일도를 제어함으로써, 광 확산 렌즈와 같은 별도의 구성이 요구되지 않아 백라이트 장치의 슬림화에 유리하고 구조를 단순화하는 효과가 있으며, 별도의 접착부재 없이 확산부재를 직접 라미네이팅하는 공정으로 제조될 수 있어 제조 공정을 단순화한다.The surface light source module of this embodiment is advantageous in slimming the backlight device because a separate configuration such as a light diffusion lens is not required by controlling the light uniformity by a diffusion member made of a transparent material and a light blocking member formed on one surface thereof. It has the effect of simplifying and can be manufactured by a process of directly laminating the diffusion member without a separate adhesive member, thereby simplifying the manufacturing process.
도 4는 본 실시예에 따른 면광원 모듈의 제조 과정을 나타낸 공정도이다.4 is a flowchart showing a manufacturing process of the surface light source module according to the present embodiment.
도 4를 참조하면, 본 실시예의 면광원 모듈은, LED 소자(200)가 실장되고, LED 소자(200)의 주위를 따라 몰딩부(300)가 형성된 기판(100)을 준비한다. 몰딩부(300)는 캐비티(310)가 형성된 플레이트를 제조하여 기판(100)에 결합하거나, 기판(100)상에 직접 절연 수지를 몰딩하여 형성할 수 있다. 기판(100)을 준비한 후, 도시된 바와 같이 캐비티(310) 내부에 스크린 프린팅을 이용하여 투명 수지를 충진한다. 투명 수지의 충진은 1 ~ 2회 정도의 스크린 프린팅으로 충분히 이루어질 수 있어 공정 시간을 단축할 수 있으며, 동시에 충진된 투명 수지는 우수한 균일도를 가질 수 있다. 충진된 투명 수지는 조건에서 경화하여 밀봉층을 형성한다.Referring to FIG. 4, in the surface light source module of this embodiment, a substrate 100 on which an LED element 200 is mounted and a molding part 300 formed along the periphery of the LED element 200 is prepared. The molding part 300 may be formed by manufacturing a plate in which the cavity 310 is formed and bonding to the substrate 100, or by directly molding an insulating resin on the substrate 100. After the substrate 100 is prepared, a transparent resin is filled in the cavity 310 by using screen printing as shown. The filling of the transparent resin can be sufficiently performed by screen printing about 1 to 2 times, so that the process time can be shortened, and at the same time, the filled transparent resin can have excellent uniformity. The filled transparent resin is cured under conditions to form a sealing layer.
그리고 일면에 차광패턴(510)이 형성된 확산부재(500)를 별도의 공정에서 제조하여 준비하고, 롤링 장치를 이용하여 확산부재(500)를 밀봉층(400) 상면에 라미네이팅 한다. 이때, 다수의 차광패턴(510)과 LED 소자(200)는 1:1로 대응되어야 하고, 서로 대응하는 차광패턴(510)과 LED 소자(200)의 수직 중심축이 일치하도록 라미네이팅되어야 한다. 확산부재(500)는 밀봉층(400)의 점착력을 이용하여 접착되므로, 접착을 위한 별도의 몰딩 공정이 삭제될 수 있다.Then, a diffusion member 500 having a light blocking pattern 510 formed on one surface thereof is manufactured and prepared in a separate process, and the diffusion member 500 is laminated on the upper surface of the sealing layer 400 using a rolling device. In this case, the plurality of shading patterns 510 and the LED element 200 must be corresponded to each other in a 1:1 manner, and laminated so that the corresponding shading patterns 510 and the vertical central axis of the LED element 200 coincide. Since the diffusion member 500 is adhered using the adhesive force of the sealing layer 400, a separate molding process for bonding may be eliminated.
또한, 확산부재(500)를 라미네이팅 한 후 차광패턴(510)을 보호하고 있는 보호지(500')를 제거함으로써, 면광원 모듈이 완성된다.In addition, the surface light source module is completed by laminating the diffusion member 500 and then removing the protective paper 500 ′ protecting the light blocking pattern 510.
도 5는 본 과제의 다른 실시예에 따른 면광원 모듈을 나타낸 단면도이다.5 is a cross-sectional view showing a surface light source module according to another embodiment of the present subject.
본 실시예의 면광원 모듈은 몰딩부(300)에 구비되는 제 1 반사면(320)이 경사면 구조를 갖는다. 즉, 캐비티(310)는 상측으로 갈수록 폭이 증가하도록 제 1 반사면(320)이 상향 경사를 이룬다. 이러한 경사 구조의 제 1 반사면(320)은 LED 소자(200)에서 출사되는 빛을 LED 소자 사이의 공간으로 분산시켜 광 균일도를 더욱 향상시킬 수 있다.In the surface light source module of the present embodiment, the first reflective surface 320 provided in the molding part 300 has an inclined surface structure. That is, the first reflective surface 320 is inclined upward so that the width of the cavity 310 increases as it goes upward. The first reflective surface 320 having such an inclined structure may further improve light uniformity by dispersing light emitted from the LED device 200 into a space between the LED devices.
또한, 도시되지는 않았지만, 제 1 반사면(320)은 볼록한 곡면 형상을 이룰 수 있다. 곡면 형상의 제 1 반사면(320)은 제 1 반사면(320)과 제 2 반사면(330)의 연결부에서 꺾임 모서리를 형성하지 않으므로, 제 1 반사면(320)과 제 2 반사면(330)의 연결부 표면에 발생될 수 있는 표면 장력을 완화시킨다. 따라서, 볼록한 곡면 형상의 제 1 반사면(320)은 밀봉층(400) 형성을 위한 투명 수지 경화시 표면 장력에 의한 리플로우(reflow) 발생을 최소로 하여 리플로우에 의한 광 특성 저하를 방지할 수 있다.Further, although not shown, the first reflective surface 320 may have a convex curved shape. Since the curved first reflective surface 320 does not form a bent corner at the connection portion between the first reflective surface 320 and the second reflective surface 330, the first reflective surface 320 and the second reflective surface 330 ) To alleviate the surface tension that may occur on the surface of the joint. Therefore, the first reflective surface 320 having a convex curved shape minimizes the occurrence of reflow due to surface tension when the transparent resin for forming the sealing layer 400 is cured, thereby preventing deterioration of optical properties due to reflow. I can.
이상 설명한 바와 같이 본 발명의 예시적인 실시예가 도시되어 설명되었지만, 다양한 변형과 다른 실시예가 본 분야의 숙련된 기술자들에 의해 행해질 수 있을 것이다. 이러한 변형과 다른 실시예들은 첨부된 청구범위에 모두 고려되고 포함되어 본 발명의 진정한 취지 및 범위를 벗어나지 않는다 할 것이다.Although the exemplary embodiments of the present invention have been shown and described as described above, various modifications and other embodiments may be made by those skilled in the art. These modifications and other embodiments are all considered and included in the appended claims and will not depart from the true spirit and scope of the present invention.
Claims (5)
- 회로가 인쇄된 기판;A printed circuit board;다수의 캐비티를 제공하면서 상기 기판 상에 결합되는 몰딩부;A molding unit coupled to the substrate while providing a plurality of cavities;상기 캐비티 내부에서 상기 기판에 실장되는 발광 소자;A light-emitting element mounted on the substrate inside the cavity;상기 발광 소자를 밀봉하면서 상기 캐비티 내에 충진되는 밀봉층; 및A sealing layer that is filled in the cavity while sealing the light emitting device; And다수의 상기 발광 소자와 1:1로 대응되는 위치에 형성되는 다수의 차광패턴을 가지며, 서로 대응하는 상기 발광 소자와 상기 차광패턴의 수직 중심축이 일치하도록 상기 밀봉층 상면에 라미네이팅되는 확산부재;를 포함하여,A diffusion member having a plurality of light-shielding patterns formed at positions corresponding to the plurality of light-emitting elements 1:1, and laminated on an upper surface of the sealing layer so that the vertical central axes of the light-emitting elements and the light-shielding patterns correspond to each other; Including,상기 발광 소자에서 출사되는 빛이 상기 차광패턴에 의하여 반사 및 확산되고, 상기 확산부재 영역 내에서 믹싱되어 출사되는, 백라이트 장치용 면광원 모듈. A surface light source module for a backlight device, wherein the light emitted from the light emitting device is reflected and diffused by the light blocking pattern, and is mixed and emitted within the diffusion member region.
- 제 1 항에 있어서, 상기 밀봉층은, The method of claim 1, wherein the sealing layer,점착력을 갖는 실리콘 소재로 구성되는, 백라이트 장치용 면광원 모듈. A surface light source module for a backlight device, which is made of a silicone material with adhesive strength.
- 제 1 항에 있어서, 상기 차광패턴은,The method of claim 1, wherein the light blocking pattern,상기 확산부재 상면에 형성되고, 반구형, 반타원형 또는 다각형의 피라미드 형상의 입체 구조를 이루는, 백라이트 장치용 면광원 모듈.A surface light source module for a backlight device, which is formed on the upper surface of the diffusion member and forms a three-dimensional structure of a hemispherical, semi-elliptical or polygonal pyramid shape.
- 제 1 항에 있어서, 상기 몰딩부는,The method of claim 1, wherein the molding part,상기 캐비티 측면의 제 1 반사면과, 상면의 제 2 반사면을 갖는, 백라이트 장치용 면광원 모듈.A surface light source module for a backlight device having a first reflective surface on a side surface of the cavity and a second reflective surface on an upper surface.
- 제 4 항에 있어서, 상기 제 1 반사면은,The method of claim 4, wherein the first reflective surface,경사면 또는 볼록한 곡면 형상을 이루는, 백라이트 장치용 면광원 모듈.A surface light source module for a backlight device that forms an inclined surface or a convex curved surface shape.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020190050483A KR20200127083A (en) | 2019-04-30 | 2019-04-30 | Light source module for backlight unit |
KR10-2019-0050483 | 2019-04-30 |
Publications (1)
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WO2020222359A1 true WO2020222359A1 (en) | 2020-11-05 |
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PCT/KR2019/009186 WO2020222359A1 (en) | 2019-04-30 | 2019-07-24 | Surface light source module for backlight device |
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KR (1) | KR20200127083A (en) |
CN (1) | CN111856813A (en) |
TW (1) | TW202041935A (en) |
WO (1) | WO2020222359A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116951345A (en) * | 2023-06-07 | 2023-10-27 | 东莞市谷麦光学科技有限公司 | Light homogenizing sheet and backlight module |
Families Citing this family (1)
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CN115407551B (en) * | 2021-05-28 | 2024-03-15 | 海信视像科技股份有限公司 | Display device |
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KR20100039115A (en) * | 2008-10-07 | 2010-04-15 | 안수호 | Lighting apparatus using led |
KR20150050655A (en) * | 2013-10-29 | 2015-05-11 | 주식회사 루멘스 | Surface light source displayer, illumination device and backlight unit having it |
KR101718486B1 (en) * | 2010-04-12 | 2017-04-04 | 엘지전자 주식회사 | Back Light Unit and Display Apparatus |
KR101754228B1 (en) * | 2010-12-13 | 2017-07-07 | 엘지디스플레이 주식회사 | Liquid crystal display device |
JP2018082000A (en) * | 2016-11-15 | 2018-05-24 | ミネベアミツミ株式会社 | Light-emitting device and method for manufacturing the same |
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CN100437276C (en) * | 2005-08-05 | 2008-11-26 | 鸿富锦精密工业(深圳)有限公司 | Straight down type back light component and liquid crystal display device |
JP2008153553A (en) * | 2006-12-19 | 2008-07-03 | Nichia Chem Ind Ltd | Light-emitting device and method of manufacturing same |
JP2018101521A (en) * | 2016-12-20 | 2018-06-28 | オムロン株式会社 | Light guiding plate, surface light source device, display device, and electronic apparatus |
-
2019
- 2019-04-30 KR KR1020190050483A patent/KR20200127083A/en unknown
- 2019-07-24 WO PCT/KR2019/009186 patent/WO2020222359A1/en active Application Filing
- 2019-09-06 TW TW108132256A patent/TW202041935A/en unknown
- 2019-09-29 CN CN201910935150.4A patent/CN111856813A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20100039115A (en) * | 2008-10-07 | 2010-04-15 | 안수호 | Lighting apparatus using led |
KR101718486B1 (en) * | 2010-04-12 | 2017-04-04 | 엘지전자 주식회사 | Back Light Unit and Display Apparatus |
KR101754228B1 (en) * | 2010-12-13 | 2017-07-07 | 엘지디스플레이 주식회사 | Liquid crystal display device |
KR20150050655A (en) * | 2013-10-29 | 2015-05-11 | 주식회사 루멘스 | Surface light source displayer, illumination device and backlight unit having it |
JP2018082000A (en) * | 2016-11-15 | 2018-05-24 | ミネベアミツミ株式会社 | Light-emitting device and method for manufacturing the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN116951345A (en) * | 2023-06-07 | 2023-10-27 | 东莞市谷麦光学科技有限公司 | Light homogenizing sheet and backlight module |
Also Published As
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TW202041935A (en) | 2020-11-16 |
CN111856813A (en) | 2020-10-30 |
KR20200127083A (en) | 2020-11-10 |
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