WO2020211034A1 - Controller device - Google Patents
Controller device Download PDFInfo
- Publication number
- WO2020211034A1 WO2020211034A1 PCT/CN2019/083174 CN2019083174W WO2020211034A1 WO 2020211034 A1 WO2020211034 A1 WO 2020211034A1 CN 2019083174 W CN2019083174 W CN 2019083174W WO 2020211034 A1 WO2020211034 A1 WO 2020211034A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat dissipation
- conductive
- module
- control module
- controller device
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L15/00—Methods, circuits, or devices for controlling the traction-motor speed of electrically-propelled vehicles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
Definitions
- the present invention relates to a controller device, in particular to a controller device that can be applied to electric vehicles.
- the driver of the prior art electric vehicle generally has the driver's control circuit, power transistor and capacitor arranged on the same printed circuit board, and there is no concept of modular design. Therefore, a non-modularized design will make it more difficult to cope with different customer specifications, and if the power demand of the design architecture increases, the number of power transistors and capacitors will increase, and finally the printed circuit board area will increase.
- the power transistors and capacitors in the prior art are laminated on the printed circuit board facing the same direction, but this design will cause the overall structure of the driver to become thicker and the capacitors will not easily dissipate heat.
- the technical problem to be solved by the present invention is to provide a controller device for the shortcomings of the prior art.
- a controller device which includes: a heat dissipation module and a first control module.
- the heat dissipation module includes a heat dissipation structure and an accommodation space located on the heat dissipation structure and recessed relative to the heat dissipation structure.
- the first control module is arranged on the heat dissipation module, the first control module includes a circuit board, a chip, and a capacitor, and the circuit board includes a first surface facing away from the heat dissipation module and a surface facing The second surface of the heat dissipation module, wherein the chip is arranged on the first surface, and the capacitor is arranged on the second surface.
- a part of the second surface of the circuit board abuts on the heat dissipation structure, and the capacitor provided on the second surface is located in the accommodating space.
- the heat dissipation module further includes a liquid flow channel arranged in the heat dissipation structure, a first orifice arranged on the heat dissipation structure and connected to the liquid flow channel, and a liquid flow channel arranged in the heat dissipation structure.
- a liquid flow channel arranged in the heat dissipation structure, a first orifice arranged on the heat dissipation structure and connected to the liquid flow channel, and a liquid flow channel arranged in the heat dissipation structure.
- the vertical projection of the liquid flow channel with respect to the heat dissipation structure can form a first projection area
- the circuit board is opposite to the The vertical projection of the heat dissipation structure can form a second projection area, and the first projection area and the second projection area at least partially overlap.
- the heat dissipation structure includes a heat dissipation body and a cover body connected to the heat dissipation body, and the liquid flow channel is arranged between the heat dissipation body and the cover body; wherein, the accommodating body The space faces a first predetermined direction relative to an opening of the heat dissipating body, the liquid flow channel faces a second predetermined direction relative to an opening of the heat dissipating body, and the first predetermined direction is opposite to the second predetermined direction.
- the directions are different from each other.
- the circuit board includes a first circuit board and a second circuit board, the first circuit board includes a first substrate, the second circuit board includes a second substrate, and the chip is disposed on On the first substrate, the capacitor is arranged on the second substrate.
- the materials of the first substrate and the second substrate are different, and the thermal conductivity of the first substrate is greater than the thermal conductivity of the second substrate.
- the first substrate is coupled to the second substrate, the first substrate is disposed on the heat dissipation module, the second substrate is disposed on the first substrate, and the first substrate is The vertical projection of the substrate relative to the heat dissipation module and the vertical projection of the second substrate relative to the heat dissipation module at least partially overlap.
- the controller device further includes: a first conductive structure and a second conductive structure, the first conductive structure being disposed on the first control module and coupled to the first control module ,
- the second conductive structure is disposed on the first control module and coupled to the first control module; wherein, the first conductive structure includes a first positioner disposed on the first control module Plate and a first conductive post connected to the first positioning plate, the second conductive structure includes a second positioning plate arranged on the first control module and a second positioning plate connected to the second positioning plate The second conductive pillar.
- the controller device further includes: a first locking member and a second locking member, and the first conductive structure further includes a first locking hole provided on the first positioning plate , The second conductive structure further includes a second locking hole provided on the second positioning plate, the first control module includes a first opening corresponding to the first locking hole, and A second opening corresponding to the second locking hole; wherein, the first locking member passes through the first opening and the first locking hole in sequence to fit into the heat dissipation module to The first conductive structure and the first control module are fixed on the heat dissipation module, and the second locking member sequentially passes through the second opening and the second locking hole and the heat dissipation module Mating to fix the second conductive structure and the first control module on the heat dissipation module.
- the first positioning plate includes a first end portion and a second end portion corresponding to the first end portion
- the second positioning plate includes a third end portion and a second end portion corresponding to the The fourth end portion of the third end portion; wherein the distance from the first conductive post to the first end portion is different from the distance from the first conductive post to the second end portion, and the first The distance from the two conductive pillars to the third end portion is different from the distance from the second conductive pillar to the fourth end portion.
- the first control module further includes a first conductive element arranged on the circuit board, a second conductive element arranged on the circuit board, and a second conductive element arranged on the circuit board.
- the third conductive element is a first conductive element arranged on the circuit board, a second conductive element arranged on the circuit board, and a second conductive element arranged on the circuit board.
- controller device further includes: a second control module, the second control module is arranged on the heat dissipation module, and the first control module and the second control module are far away The heat dissipation modules are stacked in one direction.
- the second control module includes a third circuit board
- the third circuit board includes a first through hole corresponding to the first conductive column of the first conductive structure and corresponding to the A second through hole of the second conductive pillar of the second conductive structure, the first conductive pillar passes through the first through hole, and the second conductive pillar passes through the second through hole.
- the controller device further includes: a current sensing module, the current sensing module is arranged on the second control module; wherein, the third circuit board of the second control module It further includes a third through hole corresponding to the first conductive element, a fourth through hole corresponding to the second conductive element, and a fifth through hole corresponding to the third conductive element; wherein, The current sensing module corresponds to at least one of the first conductive element, the second conductive element, and the third conductive element.
- controller device further includes: a housing structure, and the housing structure is disposed on the heat dissipation module.
- the controller device provided by the present invention can pass "the circuit board includes a first surface facing away from the heat dissipation module and a second surface facing the heat dissipation module, Wherein, the chip is arranged on the first surface, the capacitor is arranged on the second surface” and "a part of the second surface of the circuit board abuts against the heat dissipation structure, And the technical solution of "the capacitor arranged on the second surface is located in the accommodating space” is to increase the heat dissipation efficiency while reducing the overall height of the controller device.
- FIG. 1 is a schematic diagram of a three-dimensional assembly of a controller device according to an embodiment of the present invention.
- FIG. 2 is another three-dimensional assembly diagram of the controller device according to the embodiment of the present invention.
- FIG. 3 is a three-dimensional exploded schematic diagram of the controller device according to the embodiment of the present invention.
- FIG. 4 is another three-dimensional exploded schematic diagram of the controller device according to the embodiment of the present invention.
- FIG. 5 is a three-dimensional assembly diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to an embodiment of the present invention.
- FIG. 6 is an exploded perspective view of one of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.
- FIG. 7 is another three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.
- FIG. 8 is another three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.
- FIG. 9 is an exploded perspective view of one of the heat dissipation modules of the controller device according to the embodiment of the present invention.
- FIG. 10 is another three-dimensional exploded schematic diagram of the heat dissipation module of the controller device according to the embodiment of the present invention.
- FIG. 11 is a three-dimensional schematic diagram of another embodiment of the heat dissipation module of the controller device according to the embodiment of the present invention.
- FIG. 12 is a three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the second control module, the first conductive structure, the second conductive structure, and the current sensing module of the controller device according to an embodiment of the present invention.
- FIG. 13 is a three-dimensional assembly diagram of the heat dissipation module, the first control module, the second control module, the first conductive structure, the second conductive structure, and the current sensing module of the controller device according to an embodiment of the present invention.
- FIG. 14 is a three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the present invention.
- 15 is another three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the present invention.
- Figures 1 and 2 are respectively a three-dimensional assembly schematic diagram of the controller device according to an embodiment of the invention
- Figures 3 and 4 are respectively a three-dimensional exploded schematic diagram of the controller device according to an embodiment of the invention
- the embodiment of the present invention provides a controller device U, which includes a heat dissipation module 1 and a first control module 2.
- the first control module 2 can be arranged on the heat dissipation module 1, and the first control module 2 can abut on the heat dissipation module 1.
- the controller device U may further include a second control module 3, a first conductive structure 4, a second conductive structure 5, a current sensing module 6 and/or a housing structure 7.
- the housing structure 7 can be arranged on the heat dissipation module 1 and cover the first control module 2, the second control module 3, the first conductive structure 4, the second conductive structure 5 and the current sensing module 6.
- the second control module 3 can be arranged on the heat dissipation module 1, and the first control module 2 and the second control module 3 can be stacked in sequence along a direction away from the heat dissipation module 1 (the Y direction).
- the second control module 3 can be elevated by using copper pillars C, so that the first control module 2 is located between the heat dissipation module 1 and the second control module 3.
- the present invention does not use the second control module 3
- the arrangement above the first control module 2 is limited.
- the first conductive structure 4 can be disposed on the first control module 2 and coupled to the first control module 2
- the second conductive structure 5 can be disposed on the first control module 2 and coupled to the first control module 2
- the first control module 2 may include a circuit board 21, a chip 22, a capacitor 23, a first conductive element 24, a second conductive element 25 and a third conductive element 26.
- the first conductive structure 4, the second conductive structure 5, the chip 22, the capacitor 23, the first conductive element 24, the second conductive element 25 and the third conductive element 26 may be disposed on the circuit board 21 and coupled to the circuit board 21.
- the controller device U provided in the embodiment of the present invention can preferably be applied to a drive of an electric vehicle, but the present invention is not limited thereto.
- the controller device U provided by the embodiment of the present invention can also be applied to a system that requires high heat dissipation efficiency.
- the first conductive element 24, the second conductive element 25, and the third conductive element 26 of the controller device U can be respectively connected to the motor, and the first conductive structure 4 and the second conductive structure 5 can be used as the positive and negative electrodes of the direct current, respectively
- the present invention is not limited to this.
- the first control module 2 may also include other electronic components.
- the coupling in the full text of the present invention may be a direct connection or an indirect connection, or a direct electrical connection or an indirect electrical connection, and the present invention is not limited thereto.
- the current sensing module 6 can be arranged on the second control module 3, and the current sensing module 6 can be used to sense the flow through the first conductive structure 4, the second conductive structure 5, the first conductive element 24, and the second The current value of the conductive element 25 and/or the third conductive element 26.
- the present invention is not limited by whether the current sensing module 6 is installed or not, and at the same time, it is not limited by the form and quantity of the current sensing module 6.
- the shell structure 7 may include a shell body 71, a first hole 72 provided on the shell body 71 and corresponding to the first conductive structure 4, and a first hole 72 provided on the shell body 71 and corresponding to the second conductive structure 5.
- the second hole 73, a third hole 74 provided on the shell body 71 and corresponding to the first conductive element 24, a fourth hole 75 provided on the shell body 71 and corresponding to the second conductive element 25, and a fourth hole 75 provided on the The shell body 71 corresponds to the fifth hole 76 of the third conductive element 26. More specifically, the first conductive structure 4, the second conductive structure 5, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can pass through the first hole 72, the second hole 73, and the third hole, respectively. The hole 74, the fourth hole 75, and the fifth hole 76 are exposed outside the shell body 71 for insertion of other components.
- FIG. 5 shows the heat dissipation module, the first control module, and the first conductive structure of the controller device according to the embodiment of the present invention.
- Figure 6 to Figure 8 are the three-dimensional exploded schematic diagrams of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device of the embodiment of the present invention. Further exemplify the configuration of the heat dissipation module 1, the first control module 2, the first conductive structure 4, and the second conductive structure 5.
- the first conductive structure 4 may include a first positioning plate 41 arranged on the first control module 2 and a first conductive column 42 connected to the first positioning plate 41.
- the length direction of the first positioning plate 41 The (X direction) and the length direction (Y direction) of the first conductive pillar 42 are perpendicular to each other.
- the second conductive structure 5 includes a second positioning plate 51 provided on the first control module 2 and a second conductive column 52 connected to the second positioning plate 51.
- the length direction (X direction) of the second positioning plate 51 is the same as
- the length directions (Y direction) of the second conductive pillars 52 are perpendicular to each other.
- the first conductive pillar 42 may be disposed at a position between the center (not numbered in the figure) of the first positioning plate 41 and a first end portion 411 of the first positioning plate 41, that is, the first conductive pillar
- the distance from 42 to the first end portion 411 of the first positioning plate 41 is different from the distance from the first conductive pillar 42 to a second end portion 412 of the first positioning plate 41.
- the second conductive pillar 52 may be disposed at a position between the center (not numbered in the figure) of the second positioning plate 51 and a third end portion 511 of the second positioning plate 51, that is, the second conductive pillar 52
- the distance to a third end portion 511 of the second positioning plate 51 is different from the distance from the second conductive column 52 to the fourth end portion 512 of the second positioning plate 51.
- the position of the center of the first positioning plate 41 refers to the middle position between the first end 411 and the second end 633 of the first positioning plate 41, and the center of the second positioning plate 51 The position of refers to the middle position between the third end portion 511 and the fourth end portion 512 of the second positioning plate 51.
- the length of the first positioning plate 41 may be greater than the length of the first conductive pillar 42 and the length of the second positioning plate 51 may be greater than the length of the second conductive pillar 52, but the present invention is not limited thereto.
- the shape of the first positioning plate 41 and the second positioning plate 51 may be elongated, the length of the first positioning plate 41 may be greater than that of the first conductive column 42, and the length of the second positioning plate 51 may be It is larger than the second conductive pillar 52, but the present invention is not limited thereto.
- the first conductive structure 4 and the second conductive structure 5 are disposed on the first control module 2, the first positioning plate 41 and the second positioning plate 51 can be arranged parallel to each other and side by side, and the first conductive structure The pillars 42 and the second conductive pillars 52 can be arranged alternately.
- the present invention can utilize the position of the first conductive structure 4 and the second conductive structure 5 arranged on the first control module 2, so that when the first conductive structure 4 and the second conductive structure 5 are made, the first conductive structure 4 and the second conductive structure 5
- the shape and structure of the conductive structure 5 may be completely the same.
- the controller device U may further include a first fastener S1 and a second fastener S2, that is, a first conductive structure 4 and the second conductive structure 5 can be respectively disposed on the first control module 2 and the heat dissipation module 1 by using a first locking member S1 and a second locking member S2 and are electrically connected to the first control module 2.
- the first conductive structure 4 may further include a first locking hole 43 provided on the first positioning plate 41
- the second conductive structure 5 may further include a first locking hole 43 provided on the second positioning plate 51.
- the first control module 2 may include a first opening 212A corresponding to the first locking hole 43 and a second opening 212B corresponding to the second locking hole 53.
- the first locking member S1 can be fitted into the heat dissipation module 1 through the first opening 212A and the first locking hole 43 in sequence to fix the first conductive structure 4 and the first control module 2 on the heat dissipation module 1.
- the second locking member S2 can be fitted into the heat dissipation module 1 through the second opening 212B and the second locking hole 53 in sequence to fix the second conductive structure 5 and the first control module 2 on the heat dissipation module 1.
- the controller device U may include a plurality of first locking members S1 and a second locking member S2, so that the plurality of first locking members S1 and the second locking members S2 are respectively Locked on the plurality of first locking holes 43, the plurality of second locking holes 53, the plurality of first openings 212A, and the plurality of second openings 212B, and the first conductive structure 4, the second conductive structure 5 and the first control module 2 are fixed on the heat dissipation module 1.
- controller device U may further include one or more insulating pads R, the insulating pads R may respectively correspond to the first locking member S1 and/or the second locking member S2, and the insulating pad R is arranged on the A locking member S1 and the first conductive structure 4, and an insulating pad R is disposed between the second locking member S2 and the second conductive structure 5, but the present invention is not limited thereto.
- the heat dissipation module 1 may include a heat dissipation structure 11, and the circuit board 21 may be disposed on a bearing surface 110 of the heat dissipation structure 11 and abut against the bearing surface 110 of the heat dissipation structure 11.
- the circuit board 21 may include a first surface 2101 facing away from the heat dissipation module 1 and a second surface 2102 facing the heat dissipation module 1.
- the chip 22 may be disposed on the first surface 2101, and the capacitor 23 may be disposed on the second surface 2102. on.
- the height direction (positive Y direction) of the chip 22 provided on the circuit board 21 and the height direction (negative Y direction) of the capacitor 23 provided on the circuit board 21 are opposite to each other. That is, the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation module 1, and the height direction (negative Y direction) of the capacitor 23 is a direction closer to the heat dissipation module 1. Furthermore, since the height direction (negative Y direction) of the capacitor 23 is toward the direction close to the heat dissipation module 1, the heat dissipation module 1 preferably may further include a heat dissipation structure 11 that is recessed relative to the heat dissipation structure 11 Housing space 12.
- a part of the second surface 2102 of the circuit board 21 can abut on the heat dissipation structure 11, and the capacitor 23 provided on the second surface 2102 can be located in the accommodating space 12. Thereby, the capacitor 23 can be arranged in an inverted manner relative to the chip 22 to reduce the volume of the controller device U.
- a part of the second surface 2102 of the circuit board 21 may directly abut on the heat dissipation structure 11, or a thermally conductive adhesive may be provided between the second surface 2102 of the circuit board 21 and the heat dissipation structure 11. Therefore, a part of the second surface 2102 of the circuit board 21 can indirectly abut on the heat dissipation structure 11.
- the controller device U may further include a thermally conductive material T, the thermally conductive material T may be disposed in the accommodating space 12, and the capacitor 23 disposed on the circuit board 21 may be disposed in the accommodating space 12 And embedded in the thermal conductive material T.
- the thermally conductive material T may be a thermally conductive gel, but the invention is not limited to this.
- the circuit board 21 can be composed of a first circuit board 21A and a second circuit board 21B, that is, the first control module 2 can It includes a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23.
- the first circuit board 21A may include a first substrate 211A
- the second circuit board 21B includes a second substrate 211B
- the first substrate 211A may be coupled to the second substrate 211B
- the first conductive structure 4 and the second conductive structure 5 It can be coupled to the first substrate 211A and the second substrate 211B.
- one or more conductive pads P may be provided on the first substrate 211A and the second substrate 211B, respectively, so that the first substrate 211A and the second substrate 211B are coupled to each other by the conductive pads.
- the first substrate 211A may be disposed on the heat dissipation module 1
- the second substrate 211B may be disposed on the first substrate 211A
- the vertical projection of the first substrate 211A relative to the heat dissipation module 1 and the second substrate 211A relative to the heat dissipation module The vertical projections of 1 at least partially overlap.
- the first substrate 211A and the second substrate 211B are at least partially overlapped.
- the conductive pads P of the first substrate 211A and the second substrate 211B can be arranged at the position where the first substrate 211A and the second substrate 211B are overlapped, so that the first substrate 211A and the second substrate 211B are arranged by overlap And coupled with each other.
- the first substrate 211A of the first circuit board 21A may include a first surface 2101A facing away from the heat dissipation module 1 and a second surface 2102A facing the heat dissipation module 1, and the second circuit board 21B
- the second substrate 211B may include a first surface 2101B facing away from the heat dissipation module 1 and a second surface 2102B facing the accommodating space 12 of the heat dissipation module 1.
- the chip 22 may be disposed on the first surface 2101A of the first substrate 211A, and the capacitor 23 may be disposed on the second surface 2102B of the second substrate 211B.
- the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation module 1
- the height direction (negative Y direction) of the capacitor 23 is a direction closer to the heat dissipation module 1.
- the second surface 2102A of the first substrate 211A can be disposed on a bearing surface 110 of the heat dissipation structure 11 and abuts against the bearing surface 110 of the heat dissipation structure 11, whereby the heat generated by the chip 22 It can be directly transferred to the heat dissipation structure 11 through the first substrate 211A, thereby increasing the heat dissipation efficiency of the chip 22.
- the conductive pad P provided on the first substrate 211A may be provided on the first surface 2101A of the first substrate 211A.
- the conductive pad P provided on the second substrate 211B can be provided on the second surface 2102B of the second substrate 211B, and the second surface 2102B of the second substrate 211B can abut against the first substrate On the first surface 2101A of the 211A, the conductive pad P provided on the first surface 2101A of the first substrate 211A and the conductive pad P provided on the second substrate 211B abut against each other to be coupled to each other.
- the conductive pad P can also be further disposed on the first surface 2101B of the second substrate 211B, so that the first conductive structure 4 and the second conductive structure 5 abut against the second substrate 211B.
- the conductive pad P on the first surface 2101B is coupled to the conductive pad P provided on the first surface 2101B of the second substrate 211B.
- the first conductive structure 4 and the second conductive structure 5 can be coupled to the first circuit board 21A and the second circuit board 21B.
- the first conductive element 24, the second conductive element 25, and the third conductive element 26 can be disposed on the first surface 2101A of the first substrate 211A and coupled to the first substrate 211A.
- the first conductive element 24, the second conductive element 25, and the third conductive element 26 can also be disposed on the first substrate 211A and the heat dissipation module 1 by using the fastener S, and are electrically connected to the first substrate 211A.
- the materials of the first substrate 211A and the second substrate 211B may be different from each other. More preferably, the thermal conductivity of the first substrate 211A may be greater than the thermal conductivity of the second substrate 211B.
- the first substrate 211A may be an aluminum substrate
- the second substrate 211B may be an FR4 substrate
- the chip 22 may be a power transistor (such as but not limited to MOS (Metal Oxide Semiconductor) field effect power).
- Transistor Field-effect Power Transistor
- the capacitor 23 can be used to stabilize the power supply and instantaneous current
- the present invention is not limited to this.
- the heat generated by the power transistor is conducted to the heat dissipation structure 11 through the first substrate 211A (aluminum substrate), and the heat dissipation efficiency of the chip 22 is greatly improved.
- the heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 through the conduction of the thermally conductive material T.
- the heat dissipation structure 11 may also be a metal with good thermal conductivity, such as but not limited to aluminum.
- FIGS. 9 and 10 are respectively an exploded view of the heat dissipation module of the controller device according to the embodiment of the present invention.
- the heat dissipation module 1 may further include a liquid flow channel 13 arranged in the heat dissipation structure 11, a first opening 14 arranged on the heat dissipation structure 11 and connected to the liquid flow channel 13, and a first opening 14 arranged in the heat dissipation structure 11
- the structure 11 is connected to the second orifice 15 of the liquid channel 13.
- the heat dissipation module 1 provided by the present invention may be a water-cooled heat dissipation module 1 to increase the overall heat dissipation efficiency of the controller device U.
- the controller device U may further include a connecting tube V connected to the first orifice 14 and the second orifice 15 to use the connecting tube V to connect an external liquid pipeline.
- the vertical projection of the liquid channel 13 relative to the bearing surface 110 of the heat dissipation structure 11 can form a first projection area
- the vertical projection of the circuit board 21 relative to the bearing surface 110 of the heat dissipation structure 11 can form a second projection area.
- the first projection area and the second projection area at least partially overlap.
- the second projection area is preferably a vertical projection of the first substrate 211A of the circuit board 21 with respect to the carrying surface 110 of the heat dissipation structure 11, and the first projection area and the second projection area at least partially overlap.
- the liquid flow channel 13 is preferably arranged below the first substrate 211A to improve the heat dissipation efficiency of the first circuit board 21A.
- the heat dissipation structure 11 may include a heat dissipation body 111 and a cover 112 connected to the heat dissipation body 111, and the liquid flow channel 13 is disposed between the heat dissipation body 111 and the cover 112.
- the heat dissipation structure 11 can be composed of the heat dissipation body 111 and the cover 112, and the cover 112 can be used to seal the liquid flow channel 13.
- the accommodating space 12 faces a first predetermined direction (positive Y direction) relative to an opening of the heat dissipation body 11, and the liquid flow channel 13 faces a second predetermined direction relative to an opening of the heat dissipation body 11 (Negative Y direction), and the first predetermined direction and the second predetermined direction are different from each other.
- the accommodating space 12 is provided on one side of the heat dissipation body 11, and the liquid flow channel 13 is provided on the other side of the heat dissipation body 11, and the accommodating space 12 and the liquid flow channel 13 are mutually exclusive. Connected.
- the accommodating space 12 and the liquid flow channel 13 may be arranged perpendicular to the height direction (Y direction) of the heat dissipation body 11. That is, the accommodating space 12 is adjacent to the liquid flow channel 13.
- FIG. 11 is a perspective schematic diagram of another embodiment of the heat dissipation module of the controller device according to the embodiment of the present invention. From the comparison of FIG. 11 with FIG. 9 and FIG. 10, it can be seen that in the embodiment of FIG. 11, the liquid flow channel 13 may not be provided, and the heat dissipation structure 11 includes a plurality of heat dissipation fins provided on the heat dissipation body 111.
- the heat dissipation module 1 shown in FIG. 11 may be an air-cooled heat dissipation module 1.
- the heat dissipation module 1 may still include a accommodating space 12 for accommodating the capacitor 23.
- Fig. 12 shows the heat dissipation module, the first control module, the second control module, and the first control module of the controller device according to the embodiment of the present invention.
- the second control module 3 can be arranged on the heat dissipation module 1, and the second control module 3 can be elevated by using copper pillars C, so that the first control module 2 is located between the heat dissipation module 1 and the second control module 3.
- the second control module 3 may include a third circuit board 31 and an electronic component 32 disposed on the third circuit board 31.
- the electronic component 32 may be a chip, a capacitor, a microprocessor, or a signal.
- the connection port is not limited to the present invention.
- the third circuit board 31 may further include a first through hole 311 corresponding to the first conductive pillar 42 of the first conductive structure 4, and corresponding to the second conductive Structure 5 has a second through hole 312 of the second conductive pillar 52, a third through hole 313 corresponding to the first conductive element 24, a fourth through hole 314 corresponding to the second conductive element 25, and a fourth through hole 314 corresponding to the third conductive element.
- the first conductive pillar 42 may pass through the first through hole 311, and the second conductive pillar 52 may pass through the second through hole 312.
- first conductive element 24 can pass through the third through hole 313, the second conductive element 25 can pass through the fourth through hole 314, and the third conductive element 26 can pass through the fifth through hole 315.
- first conductive pillar 42 of the first conductive structure 4 can pass through the third through hole 313
- second conductive element 25 can pass through the fourth through hole 314
- third conductive element 26 can pass through the fifth through hole 315.
- the current sensing module 6 can be disposed on the third circuit board 31 of the second control module 3 and coupled to the third circuit board 31.
- the current sensing module 6 may at least correspond to at least one of the first conductive element 24, the second conductive element 25, and the third conductive element 26, and the first conductive element 24, the second conductive element 25, and the third conductive element At least one of the conductive elements 26 can pass through the current sensing module 6 to detect the current value through the current sensing module 6.
- a plurality of current sensing modules 6 may be provided to detect the current values passing through the first conductive element 24, the second conductive element 25, and the third conductive element 26, respectively.
- the current sensing module 6 may also correspond to at least one of the first conductive pillar 42 and the second conductive pillar 52.
- a plurality of current sensing modules 6 may be provided to detect the passage of the first conductive pillar respectively.
- the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 can respectively pass through the current sensing module 6, and the first conductive element 24.
- the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 are arranged in a convex shape relative to the current sensing module 6.
- FIGS. 14 and 15 are respectively a three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the present invention.
- the current sensing module 6 may include a carrier board 61, a current sensing element 62 arranged on the carrier board 61 and coupled to the carrier board 61, and a current sensing element 62 arranged on the carrier board 61 and corresponding to the current sensing element 62 Sensing ring 63.
- the current sensing module 6 can be a Hall Current Sensor
- the carrier 61 can be a printed circuit board (PCB)
- the current sensing ring 63 can be a C
- the invention is not limited to this.
- the current sensing ring 63 may include an annular body portion 631, a first end portion connected to the annular body portion 631, and a second end portion 633 connected to the annular body portion 631.
- the first end portion 632 and the second end portion 633 There can be an air gap 634 between the two end portions 633, and the ring-shaped body portion 631 can surround a sensing space 635.
- the current sensing ring 63 may be formed by powder metallurgy, or formed by a wound silicon steel sheet, and the present invention is not limited thereto.
- the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 can be respectively located in the sensing space 635 of the current sensing module 6 to Check the current value.
- the current sensing module 6 can also be arranged on the third circuit board 31 of the second control module 3 by using a copper pillar C.
- the circuit board 21 includes a first surface 2101 facing away from the heat dissipation module 1 and a second surface 2102 facing the heat dissipation module 1.
- the chip 22 is arranged on the first surface 2101
- the capacitor 23 is arranged on the second surface 2102" and "a part of the second surface 2102 of the circuit board 21 abuts on the heat dissipation structure 11 and is arranged on the second surface 2102.
- the upper capacitor 23 is located in the accommodating space 12" to increase the heat dissipation efficiency and reduce the overall height of the controller device U.
- the controller device U provided by the present invention can be implemented by "the chip 22 is arranged on the first surface 2101 of the circuit board 21, and the capacitor 23 is arranged on the second surface 2102 of the circuit board 21" and "the capacitor The technical solution that 23 is located in the accommodating space 12" enables the capacitor 23 to be inverted compared to the chip, which can reduce the overall height of the controller device U.
- the controller device U provided by the present invention can be configured by "the first control module 2 is arranged on the heat dissipation module 1, the second control module 3 is arranged on the heat dissipation module 1, and the first control module 2 and The second control module 3 is stacked in a direction away from the heat dissipation module 1 to increase the heat dissipation efficiency.
- the controller device U provided by the present invention can be inserted into the heat dissipation module 1 through the first locking member S1 through the first opening 212A and the first locking hole 43 in sequence, so as The conductive structure 4 and the first control module 2 are fixed on the heat dissipating module 1, and the second locking member S2 is fitted into the heat dissipating module 1 through the second opening 212B and the second locking hole 53 in order to mate the second conductive structure 5 And the first control module 2 is fixed on the heat dissipation module 1 to improve the assembly efficiency of the manufacturing process.
- the controller device U can pass "the first control module 2 includes a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23, and the first circuit
- the board 21A includes a first substrate 211A
- the second circuit board 21B includes a second substrate 211B
- the chip 22 is disposed on the first substrate 211A
- the capacitor 23 is disposed on the second substrate 211B.
- the materials of the two substrates 211B are different, and the thermal conductivity of the first substrate 211A is greater than the thermal conductivity of the second substrate 211B, so that the hotter chip 22 is arranged on the first substrate 211A with better thermal conductivity. It can increase the heat dissipation efficiency of the controller device U.
- the heat dissipation module 1, the first control module 2, the second control module 3, the current sensing module 6, the first conductive structure 4 and/or the first conductive structure 4 of the present invention are of modular design, and It can be directly replaced by different specifications.
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Abstract
A controller device (U), comprising a heat dissipation module (1) and a first control module (2). The heat dissipation module (1) comprises a heat dissipation structure (11) and an accommodation space (12) provided on the heat dissipation structure (11) and recessed relative to the heat dissipation structure (11). The first control module (2) is disposed on the heat dissipation module (1), and comprises a circuit board (21), a chip (22), and a capacitor (23). The circuit board (21) comprises a first surface (2101) facing away from the heat dissipation module (1) and a second surface (2102) facing the heat dissipation module (1). The chip (22) is disposed on the first surface, and the capacitor (23) is disposed on the second surface. A portion of the second surface of the circuit board (21) contacts the heat dissipation structure (11), and the capacitor (23) disposed on the second surface is located in the accommodation space (12). The invention thus improves the efficiency of heat dissipation while reducing the overall height of the controller device (U).
Description
本发明涉及一种控制器装置,特别是涉及一种能应用于电动车的控制器装置。The present invention relates to a controller device, in particular to a controller device that can be applied to electric vehicles.
首先,随着节能减碳的全球性议题,各国对于新能源车的品质及性能的要求也越来越高,而为了适应不同法规及不同客群的需求,各种零部件的规格需求也越来越高。因此,如何作出高集成且模块化的驱动器,来适应不同的规格需求变得日益重要。First of all, with the global issue of energy saving and carbon reduction, countries have higher and higher requirements for the quality and performance of new energy vehicles. In order to meet the needs of different regulations and different customer groups, the specifications of various parts are also increasing. Come higher. Therefore, how to make highly integrated and modular drives to adapt to different specifications becomes increasingly important.
接着,现有技术的电动车的驱动器一般都是将驱动器的控制电路、功率晶体管与电容设置在同一块印刷电路板上,并无模块化设计的概念。因此,无模块化的设计会使得较难应付不同客户规格,且该设计架构若功率需求提高会使得功率晶体管与电容数量增加,最终使得印刷电路板面积变大。此外,现有技术的功率晶体管与电容都是朝向同一方向层叠于印刷电路板上,但此设计将会导致驱动器的整体结构变厚,且电容散热不易。Next, the driver of the prior art electric vehicle generally has the driver's control circuit, power transistor and capacitor arranged on the same printed circuit board, and there is no concept of modular design. Therefore, a non-modularized design will make it more difficult to cope with different customer specifications, and if the power demand of the design architecture increases, the number of power transistors and capacitors will increase, and finally the printed circuit board area will increase. In addition, the power transistors and capacitors in the prior art are laminated on the printed circuit board facing the same direction, but this design will cause the overall structure of the driver to become thicker and the capacitors will not easily dissipate heat.
因此,如何通过结构设计的改良,来避免增加电动车的控制器装置的散热效率,以克服上述的缺陷,已成为该项事业所欲解决的重要课题之一。Therefore, how to avoid increasing the heat dissipation efficiency of the controller device of an electric vehicle by improving the structural design to overcome the above-mentioned shortcomings has become one of the important issues to be solved by this business.
发明内容Summary of the invention
本发明所要解决的技术问题在于,针对现有技术的不足提供一种控制器装置。The technical problem to be solved by the present invention is to provide a controller device for the shortcomings of the prior art.
为了解决上述的技术问题,本发明所采用的其中一技术方案是,提供一种控制器装置,其包括:一散热模块以及一第一控制模块。所述散热模块包括一散热结构以及一位于所述散热结构上且相对于所述散热结构呈凹陷设置的容置空间。所述第一控制模块设置在所述散热模块上,所述第一控制模块包括一电路板、一芯片以及一电容,所述电路板包括一背向所述散热模块的第一表面以及一面向所述散热模块的第二表面,其中,所述芯片设置在所述第一表面上,所述电容设置在所述第二表面上。其中,所述电路板的所述第二表面的其中一部分抵靠在所述散热结构上,且设置在所述第二表面上的所述电容位于所述容置空间中。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a controller device, which includes: a heat dissipation module and a first control module. The heat dissipation module includes a heat dissipation structure and an accommodation space located on the heat dissipation structure and recessed relative to the heat dissipation structure. The first control module is arranged on the heat dissipation module, the first control module includes a circuit board, a chip, and a capacitor, and the circuit board includes a first surface facing away from the heat dissipation module and a surface facing The second surface of the heat dissipation module, wherein the chip is arranged on the first surface, and the capacitor is arranged on the second surface. Wherein, a part of the second surface of the circuit board abuts on the heat dissipation structure, and the capacitor provided on the second surface is located in the accommodating space.
更进一步地,所述散热模块还进一步包括一设置在所述散热结构中的液体流道、一设 置在所述散热结构上且连接于所述液体流道的第一孔口以及一设置在所述散热结构上且连接于所述液体流道的第二孔口,其中,所述液体流道相对于所述散热结构的垂直投影能形成一第一投影区域,所述电路板相对于所述散热结构的垂直投影能形成一第二投影区域,所述第一投影区域与所述第二投影区域至少部分重叠。Furthermore, the heat dissipation module further includes a liquid flow channel arranged in the heat dissipation structure, a first orifice arranged on the heat dissipation structure and connected to the liquid flow channel, and a liquid flow channel arranged in the heat dissipation structure. On the heat dissipation structure and connected to the second orifice of the liquid flow channel, wherein the vertical projection of the liquid flow channel with respect to the heat dissipation structure can form a first projection area, and the circuit board is opposite to the The vertical projection of the heat dissipation structure can form a second projection area, and the first projection area and the second projection area at least partially overlap.
更进一步地,所述散热结构包括一散热本体以及一连接于所述散热本体的盖体,且所述液体流道设置在所述散热本体与所述盖体之间;其中,所述容置空间相对于所述散热本体的一开口朝向一第一预定方向,所述液体流道相对于所述散热本体的一开口朝向一第二预定方向,所述第一预定方向与所述第二预定方向彼此相异。Furthermore, the heat dissipation structure includes a heat dissipation body and a cover body connected to the heat dissipation body, and the liquid flow channel is arranged between the heat dissipation body and the cover body; wherein, the accommodating body The space faces a first predetermined direction relative to an opening of the heat dissipating body, the liquid flow channel faces a second predetermined direction relative to an opening of the heat dissipating body, and the first predetermined direction is opposite to the second predetermined direction. The directions are different from each other.
更进一步地,所述电路板包括一第一电路板以及一第二电路板,所述第一电路板包括一第一基板,所述第二电路板包括一第二基板,所述芯片设置在所述第一基板上,所述电容设置在所述第二基板上。Furthermore, the circuit board includes a first circuit board and a second circuit board, the first circuit board includes a first substrate, the second circuit board includes a second substrate, and the chip is disposed on On the first substrate, the capacitor is arranged on the second substrate.
更进一步地,所述第一基板与所述第二基板的材质相异,且所述第一基板的导热率大于所述第二基板的导热率。Furthermore, the materials of the first substrate and the second substrate are different, and the thermal conductivity of the first substrate is greater than the thermal conductivity of the second substrate.
更进一步地,所述第一基板耦接于所述第二基板,所述第一基板设置在所述散热模块上,所述第二基板设置在所述第一基板上,且所述第一基板相对于所述散热模块的垂直投影与所述第二基板相对于所述散热模块的垂直投影至少部分重叠。Furthermore, the first substrate is coupled to the second substrate, the first substrate is disposed on the heat dissipation module, the second substrate is disposed on the first substrate, and the first substrate is The vertical projection of the substrate relative to the heat dissipation module and the vertical projection of the second substrate relative to the heat dissipation module at least partially overlap.
更进一步地,所述控制器装置还进一步包括:一第一导电结构以及一第二导电结构,所述第一导电结构设置在所述第一控制模块上且耦接于所述第一控制模块,所述第二导电结构设置在所述第一控制模块上且耦接于所述第一控制模块;其中,所述第一导电结构包括一设置在所述第一控制模块上的第一定位板以及一连接于所述第一定位板的第一导电柱,所述第二导电结构包括一设置在所述第一控制模块上的第二定位板以及一连接于所述第二定位板的第二导电柱。Furthermore, the controller device further includes: a first conductive structure and a second conductive structure, the first conductive structure being disposed on the first control module and coupled to the first control module , The second conductive structure is disposed on the first control module and coupled to the first control module; wherein, the first conductive structure includes a first positioner disposed on the first control module Plate and a first conductive post connected to the first positioning plate, the second conductive structure includes a second positioning plate arranged on the first control module and a second positioning plate connected to the second positioning plate The second conductive pillar.
更进一步地,所述控制器装置还进一步包括:一第一锁固件以及一第二锁固件,所述第一导电结构还进一步包括一设置在所述第一定位板上的第一锁固孔,所述第二导电结构还进一步包括一设置在所述第二定位板上的第二锁固孔,所述第一控制模块包括一对应于所述第一锁固孔的第一开孔以及一对应于所述第二锁固孔的第二开孔;其中,所述第一锁固件依序通过所述第一开孔以及所述第一锁固孔与所述散热模块嵌合,以将所述第一导电结构与所述第一控制模块固定于所述散热模块上,所述第二锁固件依序通过所述第二开孔以及所述第二锁固孔与所述散热模块嵌合,以将所述第二导电结构与所述第一控制模块固 定于所述散热模块上。Furthermore, the controller device further includes: a first locking member and a second locking member, and the first conductive structure further includes a first locking hole provided on the first positioning plate , The second conductive structure further includes a second locking hole provided on the second positioning plate, the first control module includes a first opening corresponding to the first locking hole, and A second opening corresponding to the second locking hole; wherein, the first locking member passes through the first opening and the first locking hole in sequence to fit into the heat dissipation module to The first conductive structure and the first control module are fixed on the heat dissipation module, and the second locking member sequentially passes through the second opening and the second locking hole and the heat dissipation module Mating to fix the second conductive structure and the first control module on the heat dissipation module.
更进一步地,所述第一定位板包括一第一末端部以及一对应于所述第一末端部的第二末端部,所述第二定位板包括一第三末端部以及一对应于所述第三末端部的第四末端部;其中,所述第一导电柱至所述第一末端部的距离与所述第一导电柱至所述第二末端部的距离相异,且所述第二导电柱至所述第三末端部的距离与所述第二导电柱至所述第四末端部的距离相异。Further, the first positioning plate includes a first end portion and a second end portion corresponding to the first end portion, and the second positioning plate includes a third end portion and a second end portion corresponding to the The fourth end portion of the third end portion; wherein the distance from the first conductive post to the first end portion is different from the distance from the first conductive post to the second end portion, and the first The distance from the two conductive pillars to the third end portion is different from the distance from the second conductive pillar to the fourth end portion.
更进一步地,所述第一控制模块还进一步包括一设置在所述电路板上的第一导电元件、一设置在所述电路板上的第二导电元件以及一设置在所述电路板上的第三导电元件。Furthermore, the first control module further includes a first conductive element arranged on the circuit board, a second conductive element arranged on the circuit board, and a second conductive element arranged on the circuit board. The third conductive element.
更进一步地,所述控制器装置还进一步包括:一第二控制模块,所述第二控制模块设置在所述散热模块上,且所述第一控制模块及所述第二控制模块沿着远离所述散热模块的一方向堆叠设置。Further, the controller device further includes: a second control module, the second control module is arranged on the heat dissipation module, and the first control module and the second control module are far away The heat dissipation modules are stacked in one direction.
更进一步地,所述第二控制模块包括一第三电路板,所述第三电路板包括对应于所述第一导电结构的所述第一导电柱的一第一贯穿孔以及对应于所述第二导电结构的所述第二导电柱的一第二贯穿孔,所述第一导电柱穿过所述第一贯穿孔,且所述第二导电柱穿过所述第二贯穿孔。Furthermore, the second control module includes a third circuit board, and the third circuit board includes a first through hole corresponding to the first conductive column of the first conductive structure and corresponding to the A second through hole of the second conductive pillar of the second conductive structure, the first conductive pillar passes through the first through hole, and the second conductive pillar passes through the second through hole.
更进一步地,所述控制器装置还进一步包括:一电流感测模块,所述电流感测模块设置在所述第二控制模块上;其中,所述第二控制模块的所述第三电路板还进一步包括对应于所述第一导电元件的一第三贯穿孔、对应于所述第二导电元件的一第四贯穿孔以及对应于所述第三导电元件的一第五贯穿孔;其中,所述电流感测模块至少对应于所述第一导电元件、所述第二导电元件及所述第三导电元件中的至少其中之一。Furthermore, the controller device further includes: a current sensing module, the current sensing module is arranged on the second control module; wherein, the third circuit board of the second control module It further includes a third through hole corresponding to the first conductive element, a fourth through hole corresponding to the second conductive element, and a fifth through hole corresponding to the third conductive element; wherein, The current sensing module corresponds to at least one of the first conductive element, the second conductive element, and the third conductive element.
更进一步地,所述控制器装置还进一步包括:一壳体结构,所述壳体结构设置在所述散热模块上。Furthermore, the controller device further includes: a housing structure, and the housing structure is disposed on the heat dissipation module.
本发明的其中一有益效果在于,本发明所提供的控制器装置,其能通过“所述电路板包括一背向所述散热模块的第一表面以及一面向所述散热模块的第二表面,其中,所述芯片设置在所述第一表面上,所述电容设置在所述第二表面上”以及“所述电路板的所述第二表面的其中一部分抵靠在所述散热结构上,且设置在所述第二表面上的所述电容位于所述容置空间中”的技术方案,以增加散热效率,同时降低控制器装置的整体高度。One of the beneficial effects of the present invention is that the controller device provided by the present invention can pass "the circuit board includes a first surface facing away from the heat dissipation module and a second surface facing the heat dissipation module, Wherein, the chip is arranged on the first surface, the capacitor is arranged on the second surface" and "a part of the second surface of the circuit board abuts against the heat dissipation structure, And the technical solution of "the capacitor arranged on the second surface is located in the accommodating space" is to increase the heat dissipation efficiency while reducing the overall height of the controller device.
为使能更进一步了解本发明的特征及技术内容,请参阅以下有关本发明的详细说明与附图,然而所提供的附图仅用于提供参考与说明,并非用来对本发明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description, and are not used to limit the present invention.
图1为本发明实施例的控制器装置的其中一立体组合示意图。FIG. 1 is a schematic diagram of a three-dimensional assembly of a controller device according to an embodiment of the present invention.
图2为本发明实施例的控制器装置的另外一立体组合示意图。FIG. 2 is another three-dimensional assembly diagram of the controller device according to the embodiment of the present invention.
图3为本发明实施例的控制器装置的其中一立体分解示意图。FIG. 3 is a three-dimensional exploded schematic diagram of the controller device according to the embodiment of the present invention.
图4为本发明实施例的控制器装置的另外一立体分解示意图。4 is another three-dimensional exploded schematic diagram of the controller device according to the embodiment of the present invention.
图5为本发明实施例的控制器装置的散热模块、第一控制模块、第一导电结构及第二导电结构的立体组合示意图。5 is a three-dimensional assembly diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to an embodiment of the present invention.
图6为本发明实施例的控制器装置的散热模块、第一控制模块、第一导电结构及第二导电结构的其中一立体分解示意图。6 is an exploded perspective view of one of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.
图7为本发明实施例的控制器装置的散热模块、第一控制模块、第一导电结构及第二导电结构的另外一立体分解示意图。FIG. 7 is another three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.
图8为本发明实施例的控制器装置的散热模块、第一控制模块、第一导电结构及第二导电结构的再一立体分解示意图。8 is another three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device according to the embodiment of the present invention.
图9为本发明实施例的控制器装置的散热模块的其中一立体分解示意图。FIG. 9 is an exploded perspective view of one of the heat dissipation modules of the controller device according to the embodiment of the present invention.
图10为本发明实施例的控制器装置的散热模块的另外一立体分解示意图。10 is another three-dimensional exploded schematic diagram of the heat dissipation module of the controller device according to the embodiment of the present invention.
图11为本发明实施例的控制器装置的散热模块的另外一实施方式的立体示意图。FIG. 11 is a three-dimensional schematic diagram of another embodiment of the heat dissipation module of the controller device according to the embodiment of the present invention.
图12为本发明实施例的控制器装置的散热模块、第一控制模块、第二控制模块、第一导电结构、第二导电结构及电流感测模块的立体分解示意图。12 is a three-dimensional exploded schematic diagram of the heat dissipation module, the first control module, the second control module, the first conductive structure, the second conductive structure, and the current sensing module of the controller device according to an embodiment of the present invention.
图13为本发明实施例的控制器装置的散热模块、第一控制模块、第二控制模块、第一导电结构、第二导电结构及电流感测模块的立体组合示意图。FIG. 13 is a three-dimensional assembly diagram of the heat dissipation module, the first control module, the second control module, the first conductive structure, the second conductive structure, and the current sensing module of the controller device according to an embodiment of the present invention.
图14为本发明实施例的控制器装置的电流感测模块的其中一立体分解示意图。FIG. 14 is a three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the present invention.
图15为本发明实施例的控制器装置的电流感测模块的另外一立体分解示意图。15 is another three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the present invention.
以下是通过特定的具体实施例来说明本发明所公开有关“控制器装置”的实施方式,本领域技术人员可由本说明书所公开的内容了解本发明的优点与效果。本发明可通过其他不同的具体实施例加以施行或应用,本说明书中的各项细节也可基于不同观点与应用,在不悖离本发明的构思下进行各种修改与变更。另外,本发明的附图仅为简单示意说明,并非依实际尺寸的描绘,事先声明。以下的实施方式将进一步详细说明本发明的相关技术内 容,但所公开的内容并非用以限制本发明的保护范围。The following is a specific embodiment to illustrate the implementation of the "controller device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.
应当可以理解的是,虽然本文中可能会使用到“第一”、“第二”、“第三”等术语来描述各种元件,但这些元件不应受这些术语的限制。这些术语主要是用以区分一元件与另一元件。另外,本文中所使用的术语“或”,应视实际情况可能包括相关联的列出项目中的任一个或者多个的组合。It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.
实施例Example
首先,参阅图1至图4所示,图1及图2分别为本发明实施例的控制器装置的立体组合示意图,图3及图4分别为本发明实施例的控制器装置的立体分解示意图。本发明实施例提供一种控制器装置U,其包括一散热模块1以及一第一控制模块2。第一控制模块2可设置在散热模块1上,且第一控制模块2可抵靠在散热模块1上。优选地,控制器装置U还可进一步包括一第二控制模块3、一第一导电结构4、一第二导电结构5、一电流感测模块6及/或一壳体结构7。壳体结构7可设置在散热模块1上,且遮盖第一控制模块2、第二控制模块3、第一导电结构4、第二导电结构5以及电流感测模块6。First, referring to Figures 1 to 4, Figures 1 and 2 are respectively a three-dimensional assembly schematic diagram of the controller device according to an embodiment of the invention, and Figures 3 and 4 are respectively a three-dimensional exploded schematic diagram of the controller device according to an embodiment of the invention . The embodiment of the present invention provides a controller device U, which includes a heat dissipation module 1 and a first control module 2. The first control module 2 can be arranged on the heat dissipation module 1, and the first control module 2 can abut on the heat dissipation module 1. Preferably, the controller device U may further include a second control module 3, a first conductive structure 4, a second conductive structure 5, a current sensing module 6 and/or a housing structure 7. The housing structure 7 can be arranged on the heat dissipation module 1 and cover the first control module 2, the second control module 3, the first conductive structure 4, the second conductive structure 5 and the current sensing module 6.
承上述,第二控制模块3可设置在散热模块1上,且第一控制模块2及第二控制模块3可沿着远离散热模块1的一方向(Y方向)依序堆叠设置。另外,举例来说,第二控制模块3可利用铜柱C将其架高,以使得第一控制模块2位于散热模块1及第二控制模块3之间,然本发明不以第二控制模块3设置在第一控制模块2的上方的方式为限制。In view of the above, the second control module 3 can be arranged on the heat dissipation module 1, and the first control module 2 and the second control module 3 can be stacked in sequence along a direction away from the heat dissipation module 1 (the Y direction). In addition, for example, the second control module 3 can be elevated by using copper pillars C, so that the first control module 2 is located between the heat dissipation module 1 and the second control module 3. However, the present invention does not use the second control module 3 The arrangement above the first control module 2 is limited.
承上述,第一导电结构4可设置在第一控制模块2上且耦接于第一控制模块2,第二导电结构5可设置在第一控制模块2上且耦接于第一控制模块2。此外,第一控制模块2可包括一电路板21、一芯片22、一电容23、一第一导电元件24、一第二导电元件25以及一第三导电元件26。第一导电结构4、第二导电结构5、芯片22、电容23、第一导电元件24、第二导电元件25以及第三导电元件26可设置在电路板21上且耦接于电路板21。另外,举例来说,本发明实施例所提供的控制器装置U优选可应用于电动车的驱动器,然本发明不以此为限。本发明实施例所提供的控制器装置U也可以应用在需要散热效率较高的***中。另外,控制器装置U的第一导电元件24、第二导电元件25以及第三导电元件26可分别连接于电动机,而第一导电结构4及第二导电结构5可分别作为直流电的正极及负极,然本发明不以此为限。另外,须说明的是,虽然上述内容是以第一控制模块2中包括芯片22及电容23作为举例说明,然而,在其他实施方式中,第一控制模块2也可以包括其他电子零件。另外,值得说明的是,本发明全文中的耦接可以是直接连接或是间接 连接,或是直接电性连接或者是间接电性连接,本发明不以此为限。In view of the above, the first conductive structure 4 can be disposed on the first control module 2 and coupled to the first control module 2, and the second conductive structure 5 can be disposed on the first control module 2 and coupled to the first control module 2 . In addition, the first control module 2 may include a circuit board 21, a chip 22, a capacitor 23, a first conductive element 24, a second conductive element 25 and a third conductive element 26. The first conductive structure 4, the second conductive structure 5, the chip 22, the capacitor 23, the first conductive element 24, the second conductive element 25 and the third conductive element 26 may be disposed on the circuit board 21 and coupled to the circuit board 21. In addition, for example, the controller device U provided in the embodiment of the present invention can preferably be applied to a drive of an electric vehicle, but the present invention is not limited thereto. The controller device U provided by the embodiment of the present invention can also be applied to a system that requires high heat dissipation efficiency. In addition, the first conductive element 24, the second conductive element 25, and the third conductive element 26 of the controller device U can be respectively connected to the motor, and the first conductive structure 4 and the second conductive structure 5 can be used as the positive and negative electrodes of the direct current, respectively However, the present invention is not limited to this. In addition, it should be noted that although the foregoing content is illustrated by using the chip 22 and the capacitor 23 in the first control module 2 as an example, in other embodiments, the first control module 2 may also include other electronic components. In addition, it is worth noting that the coupling in the full text of the present invention may be a direct connection or an indirect connection, or a direct electrical connection or an indirect electrical connection, and the present invention is not limited thereto.
承上述,电流感测模块6可设置在第二控制模块3上,且电流感测模块6可用于感测流经第一导电结构4、第二导电结构5、第一导电元件24、第二导电元件25及/或第三导电元件26的电流值。然而,须说明的是,本发明不以电流感测模块6的设置与否为限制,同时,也不以电流感测模块6的形式与数量为限制。另外,壳体结构7可包括一壳本体71、一设置在壳本体71上且对应于第一导电结构4的第一孔洞72、一设置在壳本体71上且对应于第二导电结构5的第二孔洞73、一设置在壳本体71上且对应于第一导电元件24的第三孔洞74、一设置在壳本体71上且对应于第二导电元件25的第四孔洞75以及一设置在壳本体71上且对应于第三导电元件26的第五孔洞76。更进一步来说,第一导电结构4、第二导电结构5、第一导电元件24、第二导电元件25及第三导电元件26的可分别通过第一孔洞72、第二孔洞73、第三孔洞74、第四孔洞75及第五孔洞76而裸露在壳本体71的外部,以供其他元件插设。In view of the above, the current sensing module 6 can be arranged on the second control module 3, and the current sensing module 6 can be used to sense the flow through the first conductive structure 4, the second conductive structure 5, the first conductive element 24, and the second The current value of the conductive element 25 and/or the third conductive element 26. However, it should be noted that the present invention is not limited by whether the current sensing module 6 is installed or not, and at the same time, it is not limited by the form and quantity of the current sensing module 6. In addition, the shell structure 7 may include a shell body 71, a first hole 72 provided on the shell body 71 and corresponding to the first conductive structure 4, and a first hole 72 provided on the shell body 71 and corresponding to the second conductive structure 5. The second hole 73, a third hole 74 provided on the shell body 71 and corresponding to the first conductive element 24, a fourth hole 75 provided on the shell body 71 and corresponding to the second conductive element 25, and a fourth hole 75 provided on the The shell body 71 corresponds to the fifth hole 76 of the third conductive element 26. More specifically, the first conductive structure 4, the second conductive structure 5, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can pass through the first hole 72, the second hole 73, and the third hole, respectively. The hole 74, the fourth hole 75, and the fifth hole 76 are exposed outside the shell body 71 for insertion of other components.
接着,请复参阅图3及图4所示,并请一并参阅图5至图8所示,图5为本发明实施例的控制器装置的散热模块、第一控制模块、第一导电结构及第二导电结构的立体组合示意图,图6至图8分别为本发明实施例的控制器装置的散热模块、第一控制模块、第一导电结构及第二导电结构的立体分解示意图,以下将进一步举例说明散热模块1、第一控制模块2、第一导电结构4及第二导电结构5的配置方式。详细来说,第一导电结构4可包括一设置在第一控制模块2上的第一定位板41以及一连接于第一定位板41的第一导电柱42,第一定位板41的长度方向(X方向)与第一导电柱42的长度方向(Y方向)彼此相互垂直。第二导电结构5包括一设置在第一控制模块2上的第二定位板51以及一连接于第二定位板51的第二导电柱52,第二定位板51的长度方向(X方向)与第二导电柱52的长度方向(Y方向)彼此相互垂直。借此,第一导电结构4及第二导电结构5可形成一类似倒T型的结构。Next, please refer to FIGS. 3 and 4 again, and please also refer to FIGS. 5 to 8. FIG. 5 shows the heat dissipation module, the first control module, and the first conductive structure of the controller device according to the embodiment of the present invention. Figure 6 to Figure 8 are the three-dimensional exploded schematic diagrams of the heat dissipation module, the first control module, the first conductive structure, and the second conductive structure of the controller device of the embodiment of the present invention. Further exemplify the configuration of the heat dissipation module 1, the first control module 2, the first conductive structure 4, and the second conductive structure 5. In detail, the first conductive structure 4 may include a first positioning plate 41 arranged on the first control module 2 and a first conductive column 42 connected to the first positioning plate 41. The length direction of the first positioning plate 41 The (X direction) and the length direction (Y direction) of the first conductive pillar 42 are perpendicular to each other. The second conductive structure 5 includes a second positioning plate 51 provided on the first control module 2 and a second conductive column 52 connected to the second positioning plate 51. The length direction (X direction) of the second positioning plate 51 is the same as The length directions (Y direction) of the second conductive pillars 52 are perpendicular to each other. Thereby, the first conductive structure 4 and the second conductive structure 5 can form an inverted T-shaped structure.
承上述,第一导电柱42可设置在第一定位板41的中心(图中未标号)与第一定位板41的一第一末端部411之间的位置,也就是说,第一导电柱42至第一定位板41的第一末端部411的距离与第一导电柱42至第一定位板41的一第二末端部412的距离相异。此外,第二导电柱52可设置在第二定位板51的中心(图中未标号)与第二定位板51的一第三末端部511之间的位置,也就是说,第二导电柱52至第二定位板51的一第三末端部511的距离与第二导电柱52至第二定位板51的第四末端部512的距离相异。另外,值得说明的是, 第一定位板41的中心的位置所指的是第一定位板41的第一末端部411与第二端部633之间的中间位置,第二定位板51的中心的位置所指的是第二定位板51的第三末端部511与第四末端部512之间的中间位置。另外,举例来说,第一定位板41的长度可大于第一导电柱42的长度,第二定位板51的长度可大于第二导电柱52的长度,然本发明不以此为限。In view of the above, the first conductive pillar 42 may be disposed at a position between the center (not numbered in the figure) of the first positioning plate 41 and a first end portion 411 of the first positioning plate 41, that is, the first conductive pillar The distance from 42 to the first end portion 411 of the first positioning plate 41 is different from the distance from the first conductive pillar 42 to a second end portion 412 of the first positioning plate 41. In addition, the second conductive pillar 52 may be disposed at a position between the center (not numbered in the figure) of the second positioning plate 51 and a third end portion 511 of the second positioning plate 51, that is, the second conductive pillar 52 The distance to a third end portion 511 of the second positioning plate 51 is different from the distance from the second conductive column 52 to the fourth end portion 512 of the second positioning plate 51. In addition, it is worth noting that the position of the center of the first positioning plate 41 refers to the middle position between the first end 411 and the second end 633 of the first positioning plate 41, and the center of the second positioning plate 51 The position of refers to the middle position between the third end portion 511 and the fourth end portion 512 of the second positioning plate 51. In addition, for example, the length of the first positioning plate 41 may be greater than the length of the first conductive pillar 42 and the length of the second positioning plate 51 may be greater than the length of the second conductive pillar 52, but the present invention is not limited thereto.
承上述,举例来说,第一定位板41及第二定位板51的形状可以呈长条状,第一定位板41的长度可大于第一导电柱42,且第二定位板51的长度可大于第二导电柱52,然本发明不以此为限。进一步来说,当第一导电结构4及第二导电结构5设置在第一控制模块2上时,第一定位板41与第二定位板51可彼此相互呈平行且并排设置,且第一导电柱42及第二导电柱52可彼此呈交错设置。借此,由于第一导电柱42相对于第一定位板41的设置位置呈不对称的设置,且第二导电柱52相对于第二定位板51的设置位置呈不对称的设置,所以,本发明可以利用第一导电结构4及第二导电结构5设置在第一控制模块2上的位置,而使得在制作第一导电结构4及第二导电结构5时,第一导电结构4及第二导电结构5的形状及构造可以完全相同。In view of the above, for example, the shape of the first positioning plate 41 and the second positioning plate 51 may be elongated, the length of the first positioning plate 41 may be greater than that of the first conductive column 42, and the length of the second positioning plate 51 may be It is larger than the second conductive pillar 52, but the present invention is not limited thereto. Furthermore, when the first conductive structure 4 and the second conductive structure 5 are disposed on the first control module 2, the first positioning plate 41 and the second positioning plate 51 can be arranged parallel to each other and side by side, and the first conductive structure The pillars 42 and the second conductive pillars 52 can be arranged alternately. Thereby, because the first conductive pillar 42 is arranged asymmetrically with respect to the first positioning plate 41, and the second conductive pillar 52 is arranged asymmetrically with respect to the second positioning plate 51, the present invention The invention can utilize the position of the first conductive structure 4 and the second conductive structure 5 arranged on the first control module 2, so that when the first conductive structure 4 and the second conductive structure 5 are made, the first conductive structure 4 and the second conductive structure 5 The shape and structure of the conductive structure 5 may be completely the same.
接着,请复参阅图5至图8所示,优选地,以本发明而言,控制器装置U还可进一步包括一第一锁固件S1以及一第二锁固件S2,即,第一导电结构4及第二导电结构5可分别利用第一锁固件S1以及一第二锁固件S2而设置在第一控制模块2及散热模块1上且电性连接于第一控制模块2。进一步来说,第一导电结构4还可进一步包括一设置在第一定位板41上的第一锁固孔43,第二导电结构5还可进一步包括一设置在第二定位板51上的第二锁固孔53,第一控制模块2可包括一对应于第一锁固孔43的第一开孔212A以及一对应于第二锁固孔53的第二开孔212B。第一锁固件S1可依序通过第一开孔212A以及第一锁固孔43与散热模块1嵌合,以将第一导电结构4与第一控制模块2固定于散热模块1上。第二锁固件S2可依序通过第二开孔212B以及第二锁固孔53与散热模块1嵌合,以将第二导电结构5与第一控制模块2固定于散热模块1上。另外,须说明的是,在一优选实施方式中,控制器装置U可包括多个第一锁固件S1及第二锁固件S2,以使得多个第一锁固件S1及第二锁固件S2分别锁固在多个第一锁固孔43、多个第二锁固孔53、多个第一开孔212A及多个第二开孔212B上,而将第一导电结构4、第二导电结构5及第一控制模块2固定于散热模块1上。另外,值得说明的是,控制器装置U还可进一步包括一个或多个绝缘垫R,绝缘垫R可分别对应于第一锁固件S1及/或第二锁固件S2,绝缘垫R 设置在第一锁固件S1与第一导电结构4之间,且绝缘垫R设置在第二锁固件S2与第二导电结构5之间,然本发明不以此为限。Next, please refer to FIGS. 5 to 8 again. Preferably, in terms of the present invention, the controller device U may further include a first fastener S1 and a second fastener S2, that is, a first conductive structure 4 and the second conductive structure 5 can be respectively disposed on the first control module 2 and the heat dissipation module 1 by using a first locking member S1 and a second locking member S2 and are electrically connected to the first control module 2. Furthermore, the first conductive structure 4 may further include a first locking hole 43 provided on the first positioning plate 41, and the second conductive structure 5 may further include a first locking hole 43 provided on the second positioning plate 51. Two locking holes 53, the first control module 2 may include a first opening 212A corresponding to the first locking hole 43 and a second opening 212B corresponding to the second locking hole 53. The first locking member S1 can be fitted into the heat dissipation module 1 through the first opening 212A and the first locking hole 43 in sequence to fix the first conductive structure 4 and the first control module 2 on the heat dissipation module 1. The second locking member S2 can be fitted into the heat dissipation module 1 through the second opening 212B and the second locking hole 53 in sequence to fix the second conductive structure 5 and the first control module 2 on the heat dissipation module 1. In addition, it should be noted that in a preferred embodiment, the controller device U may include a plurality of first locking members S1 and a second locking member S2, so that the plurality of first locking members S1 and the second locking members S2 are respectively Locked on the plurality of first locking holes 43, the plurality of second locking holes 53, the plurality of first openings 212A, and the plurality of second openings 212B, and the first conductive structure 4, the second conductive structure 5 and the first control module 2 are fixed on the heat dissipation module 1. In addition, it is worth noting that the controller device U may further include one or more insulating pads R, the insulating pads R may respectively correspond to the first locking member S1 and/or the second locking member S2, and the insulating pad R is arranged on the A locking member S1 and the first conductive structure 4, and an insulating pad R is disposed between the second locking member S2 and the second conductive structure 5, but the present invention is not limited thereto.
承上述,以本发明而言,散热模块1可包括一散热结构11,电路板21可设置在散热结构11的一承载面110上且抵靠于散热结构11的承载面110。另外,电路板21可包括一背向散热模块1的第一表面2101以及一面向散热模块1的第二表面2102,芯片22可设置在第一表面2101上,电容23可设置在第二表面2102上。换句话说,设置在电路板21上的芯片22的高度方向(正Y方向)与设置在电路板21上的电容23的高度方向(负Y方向)彼此相反。即,芯片22的高度方向(正Y方向)是朝向远离散热模块1的方向,电容23的高度方向(负Y方向)是朝向靠近散热模块1的方向。进一步来说,由于电容23的高度方向(负Y方向)是朝向靠近散热模块1的方向,因此,散热模块1优选还可进一步包括一位于散热结构11上且相对于散热结构11呈凹陷设置的容置空间12。所以,电路板21的第二表面2102的其中一部分可抵靠在散热结构11上,且设置在第二表面2102上的电容23可位于容置空间12中。借此,电容23相对于芯片22可形成倒置设置的方式,以降低控制器装置U的体积。另外,值得说明的是,电路板21的第二表面2102的其中一部分可直接抵靠在散热结构11上,或者是将一导热胶材设置在电路板21的第二表面2102与散热结构11之间,而使得电路板21的第二表面2102的其中一部分可间接抵靠在散热结构11上。In view of the above, in terms of the present invention, the heat dissipation module 1 may include a heat dissipation structure 11, and the circuit board 21 may be disposed on a bearing surface 110 of the heat dissipation structure 11 and abut against the bearing surface 110 of the heat dissipation structure 11. In addition, the circuit board 21 may include a first surface 2101 facing away from the heat dissipation module 1 and a second surface 2102 facing the heat dissipation module 1. The chip 22 may be disposed on the first surface 2101, and the capacitor 23 may be disposed on the second surface 2102. on. In other words, the height direction (positive Y direction) of the chip 22 provided on the circuit board 21 and the height direction (negative Y direction) of the capacitor 23 provided on the circuit board 21 are opposite to each other. That is, the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation module 1, and the height direction (negative Y direction) of the capacitor 23 is a direction closer to the heat dissipation module 1. Furthermore, since the height direction (negative Y direction) of the capacitor 23 is toward the direction close to the heat dissipation module 1, the heat dissipation module 1 preferably may further include a heat dissipation structure 11 that is recessed relative to the heat dissipation structure 11 Housing space 12. Therefore, a part of the second surface 2102 of the circuit board 21 can abut on the heat dissipation structure 11, and the capacitor 23 provided on the second surface 2102 can be located in the accommodating space 12. Thereby, the capacitor 23 can be arranged in an inverted manner relative to the chip 22 to reduce the volume of the controller device U. In addition, it is worth noting that a part of the second surface 2102 of the circuit board 21 may directly abut on the heat dissipation structure 11, or a thermally conductive adhesive may be provided between the second surface 2102 of the circuit board 21 and the heat dissipation structure 11. Therefore, a part of the second surface 2102 of the circuit board 21 can indirectly abut on the heat dissipation structure 11.
承上述,进一步来说,控制器装置U还可进一步包括一导热材料T,导热材料T可设置在容置空间12中,且设置在电路板21上的电容23可设置在容置空间12中并嵌埋在导热材料T中。借此,可利用导热材料T将电容23所产生的热传导至散热结构11,进而增加电容23的散热效率。此外,通过将电容23嵌埋在导热材料T中,也可以达到减震的效果。举例来说,导热材料T可以为一导热胶体,然本发明不以此为限。In view of the above, further speaking, the controller device U may further include a thermally conductive material T, the thermally conductive material T may be disposed in the accommodating space 12, and the capacitor 23 disposed on the circuit board 21 may be disposed in the accommodating space 12 And embedded in the thermal conductive material T. Thereby, the heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 by the thermally conductive material T, thereby increasing the heat dissipation efficiency of the capacitor 23. In addition, by embedding the capacitor 23 in the thermally conductive material T, the effect of shock absorption can also be achieved. For example, the thermally conductive material T may be a thermally conductive gel, but the invention is not limited to this.
接着,请复参阅图5至图8所示,优选地,以本发明而言,电路板21可由第一电路板21A及第二电路板21B所组成,也就是说,第一控制模块2可包括一第一电路板21A、一第二电路板21B、一芯片22以及一电容23。第一电路板21A可包括一第一基板211A,第二电路板21B包括一第二基板211B,第一基板211A可耦接于第二基板211B,且第一导电结构4及第二导电结构5可耦接于第一基板211A及第二基板211B。举例来说,以本发明而言,第一基板211A及第二基板211B上可分别设置一个或多个导电垫P,以利用导电垫P将第一基板211A及第二基板211B彼此耦接。进一步来说,第一基板211A可设置 在散热模块1上,第二基板211B可设置在第一基板211A上,且第一基板211A相对于散热模块1的垂直投影与第二基板相对于散热模块1的垂直投影至少部分重叠。换句话说,第一基板211A及第二基板211B至少部分叠合。此外,第一基板211A及第二基板211B的导电垫P可设置在第一基板211A及第二基板211B所叠合的位置,以使得第一基板211A及第二基板211B通过叠合设置的方式而相互耦接。Next, please refer to FIGS. 5 to 8 again. Preferably, according to the present invention, the circuit board 21 can be composed of a first circuit board 21A and a second circuit board 21B, that is, the first control module 2 can It includes a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23. The first circuit board 21A may include a first substrate 211A, the second circuit board 21B includes a second substrate 211B, the first substrate 211A may be coupled to the second substrate 211B, and the first conductive structure 4 and the second conductive structure 5 It can be coupled to the first substrate 211A and the second substrate 211B. For example, in the present invention, one or more conductive pads P may be provided on the first substrate 211A and the second substrate 211B, respectively, so that the first substrate 211A and the second substrate 211B are coupled to each other by the conductive pads. Furthermore, the first substrate 211A may be disposed on the heat dissipation module 1, the second substrate 211B may be disposed on the first substrate 211A, and the vertical projection of the first substrate 211A relative to the heat dissipation module 1 and the second substrate 211A relative to the heat dissipation module The vertical projections of 1 at least partially overlap. In other words, the first substrate 211A and the second substrate 211B are at least partially overlapped. In addition, the conductive pads P of the first substrate 211A and the second substrate 211B can be arranged at the position where the first substrate 211A and the second substrate 211B are overlapped, so that the first substrate 211A and the second substrate 211B are arranged by overlap And coupled with each other.
承上述,进一步来说,第一电路板21A的第一基板211A可包括一背向散热模块1的第一表面2101A以及一面向散热模块1的第二表面2102A,且第二电路板21B的第二基板211B可包括一背向散热模块1的第一表面2101B以及一面向散热模块1的容置空间12的第二表面2102B。芯片22可设置在第一基板211A的第一表面2101A上,电容23可设置在第二基板211B的第二表面2102B上。借此,芯片22的高度方向(正Y方向)是朝向远离散热模块1的方向,电容23的高度方向(负Y方向)是朝向靠近散热模块1的方向。In view of the above, further, the first substrate 211A of the first circuit board 21A may include a first surface 2101A facing away from the heat dissipation module 1 and a second surface 2102A facing the heat dissipation module 1, and the second circuit board 21B The second substrate 211B may include a first surface 2101B facing away from the heat dissipation module 1 and a second surface 2102B facing the accommodating space 12 of the heat dissipation module 1. The chip 22 may be disposed on the first surface 2101A of the first substrate 211A, and the capacitor 23 may be disposed on the second surface 2102B of the second substrate 211B. Thereby, the height direction (positive Y direction) of the chip 22 is a direction away from the heat dissipation module 1, and the height direction (negative Y direction) of the capacitor 23 is a direction closer to the heat dissipation module 1.
承上述,更进一步来说,第一基板211A的第二表面2102A可设置在散热结构11的一承载面110上且抵靠于散热结构11的承载面110,借此,芯片22所产生的热能够直接通过第一基板211A而传递至散热结构11,而增加芯片22的散热效率。此外,设置在第一基板211A上的导电垫P可设置在第一基板211A的第一表面2101A上。In view of the above, and further speaking, the second surface 2102A of the first substrate 211A can be disposed on a bearing surface 110 of the heat dissipation structure 11 and abuts against the bearing surface 110 of the heat dissipation structure 11, whereby the heat generated by the chip 22 It can be directly transferred to the heat dissipation structure 11 through the first substrate 211A, thereby increasing the heat dissipation efficiency of the chip 22. In addition, the conductive pad P provided on the first substrate 211A may be provided on the first surface 2101A of the first substrate 211A.
承上述,更进一步来说,设置在第二基板211B上的导电垫P可设置在第二基板211B的第二表面2102B上,且第二基板211B的第二表面2102B可抵靠在第一基板211A的第一表面2101A上,以使得设置在第一基板211A的第一表面2101A上的导电垫P与设置在第二基板211B上的导电垫P彼此抵靠而相互耦接。In view of the above, and further, the conductive pad P provided on the second substrate 211B can be provided on the second surface 2102B of the second substrate 211B, and the second surface 2102B of the second substrate 211B can abut against the first substrate On the first surface 2101A of the 211A, the conductive pad P provided on the first surface 2101A of the first substrate 211A and the conductive pad P provided on the second substrate 211B abut against each other to be coupled to each other.
承上述,更进一步来说,导电垫P也可以进一步地设置在第二基板211B的第一表面2101B上,以使得第一导电结构4及第二导电结构5抵靠在设置在第二基板211B的第一表面2101B上的导电垫P而耦接于设置在第二基板211B的第一表面2101B上的导电垫P。借此,第一导电结构4及第二导电结构5可以耦接于第一电路板21A及第二电路板21B。In view of the above, and further speaking, the conductive pad P can also be further disposed on the first surface 2101B of the second substrate 211B, so that the first conductive structure 4 and the second conductive structure 5 abut against the second substrate 211B. The conductive pad P on the first surface 2101B is coupled to the conductive pad P provided on the first surface 2101B of the second substrate 211B. Thereby, the first conductive structure 4 and the second conductive structure 5 can be coupled to the first circuit board 21A and the second circuit board 21B.
承上述,更进一步来说,第一导电元件24、第二导电元件25以及第三导电元件26可设置在第一基板211A的第一表面2101A上且耦接于第一基板211A。此外,第一导电元件24、第二导电元件25以及第三导电元件26也可以分别利用锁固件S而设置在第一基板211A及散热模块1上且电性连接于第一基板211A。In view of the above, and further, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can be disposed on the first surface 2101A of the first substrate 211A and coupled to the first substrate 211A. In addition, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can also be disposed on the first substrate 211A and the heat dissipation module 1 by using the fastener S, and are electrically connected to the first substrate 211A.
承上述,优选地,以本发明而言,第一基板211A与第二基板211B的材质可以彼此相异,更优选地,第一基板211A的导热率可大于第二基板211B的导热率。举例来说, 第一基板211A可以是一铝基板,第二基板211B可以是一FR4基板,且芯片22可以是一功率晶体管(例如但不限于MOS(Metal Oxide Semiconductor金属氧化物半导体)场效功率晶体管(Field-effect Power Transistor)),以控制通过第一导电元件24、第二导电元件25以及第三导电元件26而传输至电动机的电信号,电容23可以用于电源的稳压及瞬间电流的提供,然本发明不以此为限。借此,功率晶体管所产生的热能通过第一基板211A(铝基板)而传导至散热结构11,而大幅提升芯片22的散热效率。电容23所产生的热则可以通过导热材料T的传导而传导至散热结构11。此外,举例来说,散热结构11也可以一具有良好导热性质的金属,例如但不限于铝。In view of the above, preferably, according to the present invention, the materials of the first substrate 211A and the second substrate 211B may be different from each other. More preferably, the thermal conductivity of the first substrate 211A may be greater than the thermal conductivity of the second substrate 211B. For example, the first substrate 211A may be an aluminum substrate, the second substrate 211B may be an FR4 substrate, and the chip 22 may be a power transistor (such as but not limited to MOS (Metal Oxide Semiconductor) field effect power). Transistor (Field-effect Power Transistor) to control the electric signal transmitted to the motor through the first conductive element 24, the second conductive element 25, and the third conductive element 26. The capacitor 23 can be used to stabilize the power supply and instantaneous current However, the present invention is not limited to this. In this way, the heat generated by the power transistor is conducted to the heat dissipation structure 11 through the first substrate 211A (aluminum substrate), and the heat dissipation efficiency of the chip 22 is greatly improved. The heat generated by the capacitor 23 can be conducted to the heat dissipation structure 11 through the conduction of the thermally conductive material T. In addition, for example, the heat dissipation structure 11 may also be a metal with good thermal conductivity, such as but not limited to aluminum.
接着,请参阅图9及图10所示,图9及图10分别为本发明实施例的控制器装置的散热模块的体分解示意图。以本发明而言,散热模块1还可包括一设置在散热结构11中的液体流道13、一设置在散热结构11上且连接于液体流道13的第一孔口14以及一设置在散热结构11上且连接于液体流道13的第二孔口15。换句话说,本发明所提供的散热模块1可以是一水冷式的散热模块1,以增加控制器装置U整体的散热效率。此外,控制器装置U还可包括连接于第一孔口14及第二孔口15的连接管V,以利用连接管V连接外部的液体管路。Next, please refer to FIGS. 9 and 10. FIGS. 9 and 10 are respectively an exploded view of the heat dissipation module of the controller device according to the embodiment of the present invention. According to the present invention, the heat dissipation module 1 may further include a liquid flow channel 13 arranged in the heat dissipation structure 11, a first opening 14 arranged on the heat dissipation structure 11 and connected to the liquid flow channel 13, and a first opening 14 arranged in the heat dissipation structure 11 The structure 11 is connected to the second orifice 15 of the liquid channel 13. In other words, the heat dissipation module 1 provided by the present invention may be a water-cooled heat dissipation module 1 to increase the overall heat dissipation efficiency of the controller device U. In addition, the controller device U may further include a connecting tube V connected to the first orifice 14 and the second orifice 15 to use the connecting tube V to connect an external liquid pipeline.
承上述,液体流道13相对于散热结构11的承载面110的垂直投影能形成一第一投影区域,电路板21相对于散热结构11的承载面110的垂直投影能形成一第二投影区域,第一投影区域与第二投影区域至少部分重叠。进一步来说,第二投影区域优选是电路板21的第一基板211A相对于散热结构11的承载面110的垂直投影,且第一投影区域与第二投影区域至少部分重叠。换句话说,液体流道13优选是设置在第一基板211A的下方,以提高第一电路板21A的散热效率。此外,散热结构11可包括一散热本体111以及一连接于散热本体111的盖体112,且液体流道13设置在散热本体111与盖体112之间。换句话说,散热结构11可以由散热本体111及盖体112所组成,盖体112可用于封闭液体流道13。In view of the above, the vertical projection of the liquid channel 13 relative to the bearing surface 110 of the heat dissipation structure 11 can form a first projection area, and the vertical projection of the circuit board 21 relative to the bearing surface 110 of the heat dissipation structure 11 can form a second projection area. The first projection area and the second projection area at least partially overlap. Furthermore, the second projection area is preferably a vertical projection of the first substrate 211A of the circuit board 21 with respect to the carrying surface 110 of the heat dissipation structure 11, and the first projection area and the second projection area at least partially overlap. In other words, the liquid flow channel 13 is preferably arranged below the first substrate 211A to improve the heat dissipation efficiency of the first circuit board 21A. In addition, the heat dissipation structure 11 may include a heat dissipation body 111 and a cover 112 connected to the heat dissipation body 111, and the liquid flow channel 13 is disposed between the heat dissipation body 111 and the cover 112. In other words, the heat dissipation structure 11 can be composed of the heat dissipation body 111 and the cover 112, and the cover 112 can be used to seal the liquid flow channel 13.
承上述,值得说明的是,容置空间12相对于散热本体11的一开口朝向一第一预定方向(正Y方向),液体流道13相对于散热本体11的一开口朝向一第二预定方向(负Y方向),且第一预定方向与第二预定方向彼此相异。换句话说,容置空间12是设置在散热本体11的其中一侧边,且液体流道13是设置在散热本体11的另外一侧边,且容置空间12与液体流道13彼此互不连通。进一步来说,为了降低散热模块1的整体厚度,容置空间12与 液体流道13可以垂直于散热本体11的高度方向(Y方向)排列设置。即,容置空间12相邻于液体流道13。In view of the above, it is worth noting that the accommodating space 12 faces a first predetermined direction (positive Y direction) relative to an opening of the heat dissipation body 11, and the liquid flow channel 13 faces a second predetermined direction relative to an opening of the heat dissipation body 11 (Negative Y direction), and the first predetermined direction and the second predetermined direction are different from each other. In other words, the accommodating space 12 is provided on one side of the heat dissipation body 11, and the liquid flow channel 13 is provided on the other side of the heat dissipation body 11, and the accommodating space 12 and the liquid flow channel 13 are mutually exclusive. Connected. Furthermore, in order to reduce the overall thickness of the heat dissipation module 1, the accommodating space 12 and the liquid flow channel 13 may be arranged perpendicular to the height direction (Y direction) of the heat dissipation body 11. That is, the accommodating space 12 is adjacent to the liquid flow channel 13.
接着,请参阅图11所示,图11为本发明实施例的控制器装置的散热模块的另外一实施方式的立体示意图。由图11与图9及图10的比较可知,在图11的实施方式中可以不设置有液体流道13,且散热结构11包括多个设置在散热本体111上的散热鳍片。换句话说,图11所示的散热模块1可以是一气冷式的散热模块1。然而,须说明的是,图11所示的散热模块1的实施方式中,散热模块1仍可以包括一用于容置电容23的容置空间12。Next, please refer to FIG. 11, which is a perspective schematic diagram of another embodiment of the heat dissipation module of the controller device according to the embodiment of the present invention. From the comparison of FIG. 11 with FIG. 9 and FIG. 10, it can be seen that in the embodiment of FIG. 11, the liquid flow channel 13 may not be provided, and the heat dissipation structure 11 includes a plurality of heat dissipation fins provided on the heat dissipation body 111. In other words, the heat dissipation module 1 shown in FIG. 11 may be an air-cooled heat dissipation module 1. However, it should be noted that in the embodiment of the heat dissipation module 1 shown in FIG. 11, the heat dissipation module 1 may still include a accommodating space 12 for accommodating the capacitor 23.
接着,请附参阅图5所示,并请一并参阅图12及图13所示,图12为本发明实施例的控制器装置的散热模块、第一控制模块、第二控制模块、第一导电结构、第二导电结构及电流感测模块的立体分解示意图,图13为本发明实施例的控制器装置的散热模块、第一控制模块、第二控制模块、第一导电结构、第二导电结构及电流感测模块的立体组合示意图。第二控制模块3可设置在散热模块1上,且第二控制模块3可利用铜柱C将其架高,以使得第一控制模块2位于散热模块1及第二控制模块3之间。此外,举例来说,第二控制模块3可包括一第三电路板31以及一设置在第三电路板31上的电子元件32,此外,电子元件32可为芯片、电容、微处理器或信号连接端口,本发明不以此为限。Next, please refer to Fig. 5, and please also refer to Figs. 12 and 13. Fig. 12 shows the heat dissipation module, the first control module, the second control module, and the first control module of the controller device according to the embodiment of the present invention. The three-dimensional exploded schematic diagram of the conductive structure, the second conductive structure, and the current sensing module. A schematic diagram of the three-dimensional assembly of the structure and the current sensing module. The second control module 3 can be arranged on the heat dissipation module 1, and the second control module 3 can be elevated by using copper pillars C, so that the first control module 2 is located between the heat dissipation module 1 and the second control module 3. In addition, for example, the second control module 3 may include a third circuit board 31 and an electronic component 32 disposed on the third circuit board 31. In addition, the electronic component 32 may be a chip, a capacitor, a microprocessor, or a signal. The connection port is not limited to the present invention.
承上述,请复参阅图12及图13所示,第三电路板31还可进一步包括一对应于第一导电结构4的第一导电柱42的一第一贯穿孔311、对应于第二导电结构5的第二导电柱52的一第二贯穿孔312、对应于第一导电元件24的一第三贯穿孔313、对应于第二导电元件25的一第四贯穿孔314以及对应于第三导电元件26的一第五贯穿孔315。第一导电柱42可穿过第一贯穿孔311,且第二导电柱52可穿过第二贯穿孔312。此外,第一导电元件24可穿过第三贯穿孔313,第二导电元件25可穿过第四贯穿孔314,且第三导电元件26可穿过第五贯穿孔315。借此,第一导电结构4的第一导电柱42、第二导电结构5的第二导电柱52、第一导电元件24、第二导电元件25及第三导电元件26可相对于第三电路板31呈凸出状的设置。In view of the above, please refer to FIGS. 12 and 13, the third circuit board 31 may further include a first through hole 311 corresponding to the first conductive pillar 42 of the first conductive structure 4, and corresponding to the second conductive Structure 5 has a second through hole 312 of the second conductive pillar 52, a third through hole 313 corresponding to the first conductive element 24, a fourth through hole 314 corresponding to the second conductive element 25, and a fourth through hole 314 corresponding to the third conductive element. A fifth through hole 315 of the conductive element 26. The first conductive pillar 42 may pass through the first through hole 311, and the second conductive pillar 52 may pass through the second through hole 312. In addition, the first conductive element 24 can pass through the third through hole 313, the second conductive element 25 can pass through the fourth through hole 314, and the third conductive element 26 can pass through the fifth through hole 315. Thereby, the first conductive pillar 42 of the first conductive structure 4, the second conductive pillar 52 of the second conductive structure 5, the first conductive element 24, the second conductive element 25, and the third conductive element 26 can be relative to the third circuit The plate 31 is arranged in a convex shape.
承上述,电流感测模块6可设置在第二控制模块3的第三电路板31上且耦接于第三电路板31。此外,电流感测模块6可至少对应于第一导电元件24、第二导电元件25及第三导电元件26中的至少其中之一,且第一导电元件24、第二导电元件25及第三导电元件26中的至少其中之一可穿过电流感测模块6,以通过电流感测模块6检测电流值。优选地,可提供多个电流感测模块6,以分别检测通过第一导电元件24、第二导电元件25 及第三导电元件26的电流值。进一步来说,电流感测模块6也可以对应于第一导电柱42及第二导电柱52中的至少其中之一,优选地,可提供多个电流感测模块6,以分别检测通过第一导电柱42及第二导电柱52的电流值。进一步来说,第一导电元件24、第二导电元件25、第三导电元件26、第一导电柱42及/或第二导电柱52可分别穿过电流感测模块6,且第一导电元件24、第二导电元件25、第三导电元件26、第一导电柱42及/或第二导电柱52相对于电流感测模块6呈凸出状的设置。In view of the above, the current sensing module 6 can be disposed on the third circuit board 31 of the second control module 3 and coupled to the third circuit board 31. In addition, the current sensing module 6 may at least correspond to at least one of the first conductive element 24, the second conductive element 25, and the third conductive element 26, and the first conductive element 24, the second conductive element 25, and the third conductive element At least one of the conductive elements 26 can pass through the current sensing module 6 to detect the current value through the current sensing module 6. Preferably, a plurality of current sensing modules 6 may be provided to detect the current values passing through the first conductive element 24, the second conductive element 25, and the third conductive element 26, respectively. Furthermore, the current sensing module 6 may also correspond to at least one of the first conductive pillar 42 and the second conductive pillar 52. Preferably, a plurality of current sensing modules 6 may be provided to detect the passage of the first conductive pillar respectively. The current value of the conductive pillar 42 and the second conductive pillar 52. Furthermore, the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 can respectively pass through the current sensing module 6, and the first conductive element 24. The second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 are arranged in a convex shape relative to the current sensing module 6.
接着,请参阅图14及图15所示,图14及图15分别为本发明实施例的控制器装置的电流感测模块的立体分解示意图。电流感测模块6可包括一载板61、一设置在载板61上且耦接于载板61的电流感测元件62以及一设置在载板61上且对应于电流感测元件62的电流感测环63。举例来说,电流感测模块6可为一霍尔电流感测器(Hall Current Sensor),载板61可为一印刷电路板(Printed circuit board,PCB),电流感测环63可为一C型磁环,然本发明不以此为限。进一步来说,电流感测环63可包括一环形本体部631、一连接于环形本体部631的第一端部以及一连接于环形本体部631第二端部633,第一端部632与第二端部633间可具有一气隙(air gap)634,且环形本体部631能围绕出一感测空间635。另外,值得说明的是,电流感测环63可以是利用粉末冶金所形成,或者是利用卷绕的硅钢片所形成,本发明不以此为限。Next, please refer to FIGS. 14 and 15. FIGS. 14 and 15 are respectively a three-dimensional exploded schematic diagram of the current sensing module of the controller device according to the embodiment of the present invention. The current sensing module 6 may include a carrier board 61, a current sensing element 62 arranged on the carrier board 61 and coupled to the carrier board 61, and a current sensing element 62 arranged on the carrier board 61 and corresponding to the current sensing element 62 Sensing ring 63. For example, the current sensing module 6 can be a Hall Current Sensor, the carrier 61 can be a printed circuit board (PCB), and the current sensing ring 63 can be a C However, the invention is not limited to this. Furthermore, the current sensing ring 63 may include an annular body portion 631, a first end portion connected to the annular body portion 631, and a second end portion 633 connected to the annular body portion 631. The first end portion 632 and the second end portion 633 There can be an air gap 634 between the two end portions 633, and the ring-shaped body portion 631 can surround a sensing space 635. In addition, it is worth noting that the current sensing ring 63 may be formed by powder metallurgy, or formed by a wound silicon steel sheet, and the present invention is not limited thereto.
承上述,第一导电元件24、第二导电元件25、第三导电元件26、第一导电柱42及/或第二导电柱52可分别位于电流感测模块6的感测空间635中,以检测其电流值。此外,电流感测模块6也可以利用铜柱C而设置在第二控制模块3的第三电路板31上。In view of the above, the first conductive element 24, the second conductive element 25, the third conductive element 26, the first conductive pillar 42 and/or the second conductive pillar 52 can be respectively located in the sensing space 635 of the current sensing module 6 to Check the current value. In addition, the current sensing module 6 can also be arranged on the third circuit board 31 of the second control module 3 by using a copper pillar C.
实施例的有益效果Advantages of the embodiment
本发明的其中一有益效果在于,本发明所提供的控制器装置U,其能通过“电路板21包括一背向散热模块1的第一表面2101以及一面向散热模块1的第二表面2102,其中,芯片22设置在第一表面2101上,电容23设置在第二表面2102上”以及“电路板21的第二表面2102的其中一部分抵靠在散热结构11上,且设置在第二表面2102上的电容23位于容置空间12中”的技术方案,以增加散热效率,同时降低控制器装置U的整体高度。One of the beneficial effects of the present invention is that the controller device U provided by the present invention can pass through "The circuit board 21 includes a first surface 2101 facing away from the heat dissipation module 1 and a second surface 2102 facing the heat dissipation module 1. Among them, the chip 22 is arranged on the first surface 2101, and the capacitor 23 is arranged on the second surface 2102" and "a part of the second surface 2102 of the circuit board 21 abuts on the heat dissipation structure 11 and is arranged on the second surface 2102. The upper capacitor 23 is located in the accommodating space 12" to increase the heat dissipation efficiency and reduce the overall height of the controller device U.
更进一步来说,本发明所提供的控制器装置U,其能通过“芯片22设置在电路板21的第一表面2101上,电容23设置在电路板21的第二表面2102上”以及“电容23位于容置空间12”的技术方案,以使得电容23相较于芯片呈倒置,而能够降低控制器装置U的整体高度。Furthermore, the controller device U provided by the present invention can be implemented by "the chip 22 is arranged on the first surface 2101 of the circuit board 21, and the capacitor 23 is arranged on the second surface 2102 of the circuit board 21" and "the capacitor The technical solution that 23 is located in the accommodating space 12" enables the capacitor 23 to be inverted compared to the chip, which can reduce the overall height of the controller device U.
更进一步来说,本发明所提供的控制器装置U,其能通过“第一控制模块2设置在散热模块1上,第二控制模块3设置在散热模块1上,且第一控制模块2及第二控制模块3沿着远离散热模块1的一方向堆叠设置”的技术方案,以增加散热效率。Furthermore, the controller device U provided by the present invention can be configured by "the first control module 2 is arranged on the heat dissipation module 1, the second control module 3 is arranged on the heat dissipation module 1, and the first control module 2 and The second control module 3 is stacked in a direction away from the heat dissipation module 1 to increase the heat dissipation efficiency.
更进一步来说,本发明所提供的控制器装置U,其能通过“第一锁固件S1依序通过第一开孔212A以及第一锁固孔43与散热模块1嵌合,以将第一导电结构4与第一控制模块2固定于散热模块1上,第二锁固件S2依序通过第二开孔212B以及第二锁固孔53与散热模块1嵌合,以将第二导电结构5与第一控制模块2固定于散热模块1上”的技术方案,而增进制造工艺上的组装效率。Furthermore, the controller device U provided by the present invention can be inserted into the heat dissipation module 1 through the first locking member S1 through the first opening 212A and the first locking hole 43 in sequence, so as The conductive structure 4 and the first control module 2 are fixed on the heat dissipating module 1, and the second locking member S2 is fitted into the heat dissipating module 1 through the second opening 212B and the second locking hole 53 in order to mate the second conductive structure 5 And the first control module 2 is fixed on the heat dissipation module 1 to improve the assembly efficiency of the manufacturing process.
更进一步来说,本发明所提供的控制器装置U,其能通过“第一控制模块2包括一第一电路板21A、一第二电路板21B、一芯片22以及一电容23,第一电路板21A包括一第一基板211A,第二电路板21B包括一第二基板211B,芯片22设置在第一基板211A上,电容23设置在第二基板211B上”以及“,第一基板211A与第二基板211B的材质相异,且第一基板211A的导热率大于第二基板211B的导热率”的技术方案,以使得较热的芯片22是设置在导热率较佳的第一基板211A上,而能够增加控制器装置U的散热效率。Furthermore, the controller device U provided by the present invention can pass "the first control module 2 includes a first circuit board 21A, a second circuit board 21B, a chip 22 and a capacitor 23, and the first circuit The board 21A includes a first substrate 211A, the second circuit board 21B includes a second substrate 211B, the chip 22 is disposed on the first substrate 211A, and the capacitor 23 is disposed on the second substrate 211B. The materials of the two substrates 211B are different, and the thermal conductivity of the first substrate 211A is greater than the thermal conductivity of the second substrate 211B, so that the hotter chip 22 is arranged on the first substrate 211A with better thermal conductivity. It can increase the heat dissipation efficiency of the controller device U.
更进一步来说,本发明的散热模块1、第一控制模块2、第二控制模块3、电流感测模块6、第一导电结构4及/或第一导电结构4为模块化的设计,而能够适应不同的规格需求直接替换。Furthermore, the heat dissipation module 1, the first control module 2, the second control module 3, the current sensing module 6, the first conductive structure 4 and/or the first conductive structure 4 of the present invention are of modular design, and It can be directly replaced by different specifications.
以上所公开的内容仅为本发明的优选可行实施例,并非因此局限本发明的权利要求书的保护范围,所以凡是运用本发明说明书及附图内容所做的等效技术变化,均包含于本发明的权利要求书的保护范围内。The content disclosed above is only a preferred and feasible embodiment of the present invention, and does not therefore limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made using the content of the description and drawings of the present invention are included in this invention. Within the protection scope of the claims of the invention.
Claims (14)
- 一种控制器装置,其特征在于,所述控制器装置包括:A controller device, characterized in that the controller device includes:一散热模块,所述散热模块包括一散热结构以及一位于所述散热结构上且相对于所述散热结构呈凹陷设置的容置空间;以及A heat dissipation module, the heat dissipation module including a heat dissipation structure and an accommodation space located on the heat dissipation structure and recessed relative to the heat dissipation structure; and一第一控制模块,所述第一控制模块设置在所述散热模块上,所述第一控制模块包括一电路板、一芯片以及一电容,所述电路板包括一背向所述散热模块的第一表面以及一面向所述散热模块的第二表面,其中,所述芯片设置在所述第一表面上,所述电容设置在所述第二表面上;A first control module, the first control module is arranged on the heat dissipation module, the first control module includes a circuit board, a chip and a capacitor, the circuit board includes a back of the heat dissipation module A first surface and a second surface facing the heat dissipation module, wherein the chip is disposed on the first surface, and the capacitor is disposed on the second surface;其中,所述电路板的所述第二表面的其中一部分抵靠在所述散热结构上,且设置在所述第二表面上的所述电容位于所述容置空间中。Wherein, a part of the second surface of the circuit board abuts on the heat dissipation structure, and the capacitor provided on the second surface is located in the accommodating space.
- 根据权利要求1所述的控制器装置,其特征在于,所述散热模块还进一步包括一设置在所述散热结构中的液体流道、一设置在所述散热结构上且连接于所述液体流道的第一孔口以及一设置在所述散热结构上且连接于所述液体流道的第二孔口,其中,所述液体流道相对于所述散热结构的垂直投影能形成一第一投影区域,所述电路板相对于所述散热结构的垂直投影能形成一第二投影区域,所述第一投影区域与所述第二投影区域至少部分重叠。The controller device according to claim 1, wherein the heat dissipation module further comprises a liquid flow channel arranged in the heat dissipation structure, and a liquid flow channel arranged on the heat dissipation structure and connected to the liquid flow channel. The first orifice of the channel and a second orifice arranged on the heat dissipation structure and connected to the liquid flow channel, wherein the vertical projection of the liquid flow channel with respect to the heat dissipation structure can form a first In the projection area, the vertical projection of the circuit board relative to the heat dissipation structure can form a second projection area, and the first projection area and the second projection area at least partially overlap.
- 根据权利要求2所述的控制器装置,其特征在于,所述散热结构包括一散热本体以及一连接于所述散热本体的盖体,且所述液体流道设置在所述散热本体与所述盖体之间;其中,所述容置空间相对于所述散热本体的一开口朝向一第一预定方向,所述液体流道相对于所述散热本体的一开口朝向一第二预定方向,所述第一预定方向与所述第二预定方向彼此相异。3. The controller device according to claim 2, wherein the heat dissipation structure comprises a heat dissipation body and a cover connected to the heat dissipation body, and the liquid flow channel is provided between the heat dissipation body and the heat dissipation body. Between the covers; wherein the accommodating space faces a first predetermined direction relative to an opening of the heat dissipation body, and the liquid flow channel faces a second predetermined direction relative to an opening of the heat dissipation body, so The first predetermined direction and the second predetermined direction are different from each other.
- 根据权利要求1所述的控制器装置,其特征在于,所述电路板包括一第一电路板以及一第二电路板,所述第一电路板包括一第一基板,所述第二电路板包括一第二基板,所述芯片设置在所述第一基板上,所述电容设置在所述第二基板上。3. The controller device of claim 1, wherein the circuit board comprises a first circuit board and a second circuit board, the first circuit board comprises a first substrate, and the second circuit board It includes a second substrate, the chip is arranged on the first substrate, and the capacitor is arranged on the second substrate.
- 根据权利要求4所述的控制器装置,其特征在于,所述第一基板与所述第二基板的材质相异,且所述第一基板的导热率大于所述第二基板的导热率。4. The controller device of claim 4, wherein the first substrate and the second substrate are made of different materials, and the thermal conductivity of the first substrate is greater than the thermal conductivity of the second substrate.
- 根据权利要求4所述的控制器装置,其特征在于,所述第一基板耦接于所述第二基板,所述第一基板设置在所述散热模块上,所述第二基板设置在所述第一基板上,且所述第一基板相对于所述散热模块的垂直投影与所述第二基板相对于所述散热模块的垂直投 影至少部分重叠。4. The controller device of claim 4, wherein the first substrate is coupled to the second substrate, the first substrate is disposed on the heat dissipation module, and the second substrate is disposed on the On the first substrate, the vertical projection of the first substrate relative to the heat dissipation module and the vertical projection of the second substrate relative to the heat dissipation module at least partially overlap.
- 根据权利要求1所述的控制器装置,其特征在于,所述控制器装置还进一步包括:一第一导电结构以及一第二导电结构,所述第一导电结构设置在所述第一控制模块上且耦接于所述第一控制模块,所述第二导电结构设置在所述第一控制模块上且耦接于所述第一控制模块;其中,所述第一导电结构包括一设置在所述第一控制模块上的第一定位板以及一连接于所述第一定位板的第一导电柱,所述第二导电结构包括一设置在所述第一控制模块上的第二定位板以及一连接于所述第二定位板的第二导电柱。The controller device according to claim 1, wherein the controller device further comprises: a first conductive structure and a second conductive structure, the first conductive structure is disposed on the first control module Above and coupled to the first control module, the second conductive structure is disposed on the first control module and coupled to the first control module; wherein, the first conductive structure includes a A first positioning plate on the first control module and a first conductive column connected to the first positioning plate, and the second conductive structure includes a second positioning plate arranged on the first control module And a second conductive post connected to the second positioning plate.
- 根据权利要求7所述的控制器装置,其特征在于,所述控制器装置还进一步包括:一第一锁固件以及一第二锁固件,所述第一导电结构还进一步包括一设置在所述第一定位板上的第一锁固孔,所述第二导电结构还进一步包括一设置在所述第二定位板上的第二锁固孔,所述第一控制模块包括一对应于所述第一锁固孔的第一开孔以及一对应于所述第二锁固孔的第二开孔;其中,所述第一锁固件依序通过所述第一开孔以及所述第一锁固孔与所述散热模块嵌合,以将所述第一导电结构与所述第一控制模块固定于所述散热模块上,所述第二锁固件依序通过所述第二开孔以及所述第二锁固孔与所述散热模块嵌合,以将所述第二导电结构与所述第一控制模块固定于所述散热模块上。8. The controller device of claim 7, wherein the controller device further comprises: a first locking member and a second locking member, and the first conductive structure further includes a The first locking hole on the first positioning plate, the second conductive structure further includes a second locking hole provided on the second positioning plate, and the first control module includes a A first opening of the first locking hole and a second opening corresponding to the second locking hole; wherein the first locking member passes through the first opening and the first lock in sequence The fixing hole is engaged with the heat dissipation module to fix the first conductive structure and the first control module on the heat dissipation module, and the second locking member sequentially passes through the second opening and the The second locking hole is engaged with the heat dissipation module to fix the second conductive structure and the first control module on the heat dissipation module.
- 根据权利要求7所述的控制器装置,其特征在于,所述第一定位板包括一第一末端部以及一对应于所述第一末端部的第二末端部,所述第二定位板包括一第三末端部以及一对应于所述第三末端部的第四末端部;其中,所述第一导电柱至所述第一末端部的距离与所述第一导电柱至所述第二末端部的距离相异,且所述第二导电柱至所述第三末端部的距离与所述第二导电柱至所述第四末端部的距离相异。7. The controller device of claim 7, wherein the first positioning plate includes a first end portion and a second end portion corresponding to the first end portion, and the second positioning plate includes A third end portion and a fourth end portion corresponding to the third end portion; wherein the distance from the first conductive pillar to the first end portion is the same as the distance from the first conductive pillar to the second conductive pillar The distances of the end portions are different, and the distance from the second conductive pillar to the third end portion is different from the distance from the second conductive pillar to the fourth end portion.
- 根据权利要求7所述的控制器装置,其特征在于,所述第一控制模块还进一步包括一设置在所述电路板上的第一导电元件、一设置在所述电路板上的第二导电元件以及一设置在所述电路板上的第三导电元件。The controller device according to claim 7, wherein the first control module further comprises a first conductive element arranged on the circuit board, and a second conductive element arranged on the circuit board. Components and a third conductive component arranged on the circuit board.
- 根据权利要求7所述的控制器装置,其特征在于,所述控制器装置还进一步包括:一第二控制模块,所述第二控制模块设置在所述散热模块上,且所述第一控制模块及所述第二控制模块沿着远离所述散热模块的一方向堆叠设置。8. The controller device of claim 7, wherein the controller device further comprises: a second control module, the second control module is disposed on the heat dissipation module, and the first control The module and the second control module are stacked in a direction away from the heat dissipation module.
- 根据权利要求11所述的控制器装置,其特征在于,所述第二控制模块包括一第三电路板,所述第三电路板包括对应于所述第一导电结构的所述第一导电柱的一第一贯穿孔以及对应于所述第二导电结构的所述第二导电柱的一第二贯穿孔,所述第一导电柱穿过所 述第一贯穿孔,且所述第二导电柱穿过所述第二贯穿孔。11. The controller device of claim 11, wherein the second control module includes a third circuit board, and the third circuit board includes the first conductive pillar corresponding to the first conductive structure A first through hole of the second conductive structure and a second through hole of the second conductive column corresponding to the second conductive structure, the first conductive column passes through the first through hole, and the second conductive The column passes through the second through hole.
- 根据权利要求11所述的控制器装置,其特征在于,所述控制器装置还进一步包括:一电流感测模块,所述电流感测模块设置在所述第二控制模块上;其中,所述第二控制模块的所述第三电路板还进一步包括对应于所述第一导电元件的一第三贯穿孔、对应于所述第二导电元件的一第四贯穿孔以及对应于所述第三导电元件的一第五贯穿孔;其中,所述电流感测模块至少对应于所述第一导电元件、所述第二导电元件及所述第三导电元件中的至少其中之一。The controller device according to claim 11, wherein the controller device further comprises: a current sensing module, the current sensing module is arranged on the second control module; wherein, the The third circuit board of the second control module further includes a third through hole corresponding to the first conductive element, a fourth through hole corresponding to the second conductive element, and a fourth through hole corresponding to the third conductive element. A fifth through hole of the conductive element; wherein the current sensing module corresponds to at least one of the first conductive element, the second conductive element, and the third conductive element.
- 根据权利要求1所述的控制器装置,其特征在于,所述控制器装置还进一步包括:一壳体结构,所述壳体结构设置在所述散热模块上。The controller device according to claim 1, wherein the controller device further comprises: a housing structure, and the housing structure is disposed on the heat dissipation module.
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