WO2020194394A1 - Circuit sheet, circuit board, semiconductor device, method for manufacturing circuit sheet, and method for manufacturing circuit board - Google Patents

Circuit sheet, circuit board, semiconductor device, method for manufacturing circuit sheet, and method for manufacturing circuit board Download PDF

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Publication number
WO2020194394A1
WO2020194394A1 PCT/JP2019/012191 JP2019012191W WO2020194394A1 WO 2020194394 A1 WO2020194394 A1 WO 2020194394A1 JP 2019012191 W JP2019012191 W JP 2019012191W WO 2020194394 A1 WO2020194394 A1 WO 2020194394A1
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WO
WIPO (PCT)
Prior art keywords
circuit
resin
sheet
average thickness
insulating layer
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Application number
PCT/JP2019/012191
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French (fr)
Japanese (ja)
Inventor
弘行 濱上
戸川　光生
天童　一良
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日立化成株式会社
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Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to PCT/JP2019/012191 priority Critical patent/WO2020194394A1/en
Publication of WO2020194394A1 publication Critical patent/WO2020194394A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Definitions

  • the present disclosure relates to a circuit sheet, a circuit board, a semiconductor device, a method for manufacturing a circuit sheet, and a method for manufacturing a circuit board.
  • a printed circuit board is generally manufactured by attaching a metal foil to the substrate, etching the metal foil, and processing the printed circuit board into a desired circuit shape.
  • Patent Document 1 proposes a circuit board manufactured by pressing a metal member that has been previously processed into a circuit state by etching, pressing, or the like into an insulating layer that has been softened by heating.
  • Patent Document 2 proposes a circuit board manufactured by installing a conductive metal bar, which is a circuit for energizing a large current, on a printed circuit board.
  • the circuit board When increasing the cross-sectional area of a circuit in order to cope with a large current, the circuit board is generally designed by widening the circuit pitch from the viewpoint of ensuring the insulation between the circuits. However, this may increase the size of the entire circuit board and may not meet the demand for high-density mounting of electronic components.
  • the present disclosure describes a circuit sheet having a large current capacity and capable of high-density mounting without impairing insulation reliability, a circuit board and a semiconductor device using the circuit sheet, and a method for manufacturing these.
  • the challenge is to provide.
  • Means for solving the above problems include the following aspects.
  • ⁇ 4> The circuit sheet according to any one of ⁇ 1> to ⁇ 3>, wherein the minimum value b of the second circuit pitch is smaller than the first average thickness.
  • ⁇ 5> The circuit sheet according to any one of ⁇ 1> to ⁇ 4>, wherein the ratio of the minimum value b of the second circuit pitch to the first average thickness is 0.50 or less.
  • ⁇ 6> The ratio of the minimum value b of the second circuit pitch to the second average thickness (minimum value b of the second circuit pitch / second average thickness) exceeds 0.00.
  • the circuit sheet according to any one of ⁇ 1> to ⁇ 5> which is within the range of 00 or less.
  • ⁇ 7> The circuit sheet according to any one of ⁇ 1> to ⁇ 6>, wherein the minimum value b of the second circuit pitch is smaller than the minimum value a of the first circuit pitch.
  • circuit sheet according to any one of ⁇ 1> to ⁇ 7>, further including an insulating layer existing on one surface.
  • Circuit board including. ⁇ 10> The circuit sheet according to any one of ⁇ 1> to ⁇ 7> and With the board An insulating layer arranged between the circuit sheet and the substrate, Circuit board including. ⁇ 11> A semiconductor device including the circuit board and semiconductor element according to ⁇ 9> or ⁇ 10>.
  • ⁇ 12> Space between a first circuit having a first average thickness and a second circuit having a second average thickness smaller than the first average thickness, which is arranged on the temporary base material.
  • a method of manufacturing a circuit sheet which comprises filling the sheet with resin.
  • a method for manufacturing a circuit board which comprises arranging an insulating layer between the circuit sheet manufactured by the manufacturing method according to ⁇ 12> and the substrate.
  • a first circuit having a first average thickness, a second circuit having a second average thickness smaller than the first average thickness, and the first circuit and the second circuit.
  • a method of manufacturing a circuit sheet comprising arranging an insulating layer on one surface of the circuit sheet containing the resin filled in the space between them.
  • a method for manufacturing a circuit board which comprises arranging a substrate on one surface of a circuit sheet manufactured by the manufacturing method according to ⁇ 14>.
  • a circuit sheet having a large current capacity and capable of high-density mounting without impairing insulation reliability, a circuit board and a semiconductor device using the circuit sheet, and a method for manufacturing these are provided. ..
  • the term "process” includes not only a process independent of other processes but also the process if the purpose of the process is achieved even if the process cannot be clearly distinguished from the other process. ..
  • the numerical range indicated by using "-" includes the numerical values before and after "-" as the minimum value and the maximum value, respectively.
  • the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. ..
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
  • each component may contain a plurality of applicable substances.
  • the content rate or content of each component is the total content rate or content of the plurality of substances present in the composition unless otherwise specified.
  • the term "layer” is used not only when the area where the layer exists is observed, but also when the layer is formed in the entire area or only a part of the area. included.
  • the circuit sheet of the present disclosure is A first circuit having a first average thickness and a first circuit pitch, A second circuit having a second average thickness smaller than the first average thickness and having a second circuit pitch, The resin filled in the space between the first circuit and the second circuit, including.
  • the circuit sheet of the present disclosure even a circuit board corresponding to a large current can be mounted at a high density without impairing the insulation reliability.
  • the circuit pitch is also designed to be wide from the viewpoint of ensuring the insulation between circuit members.
  • the cross section of the circuit is tapered, so that a sufficient circuit pitch is provided to ensure insulation. Therefore, the circuit board that can cope with a large current tends to be large.
  • a circuit is formed by using two or more types of circuits having different thicknesses.
  • FIG. 1 is a schematic view showing a cross-sectional view of an embodiment of the circuit sheet of the present disclosure.
  • the circuit sheet 11 includes a first circuit 1 having a first average thickness, a second circuit 2 having a second average thickness smaller than the first average thickness, and a first circuit 1. Includes a resin 3 that fills the space between the second circuit 2.
  • the circuit sheet is composed of a first circuit 1, a second circuit 2, and a resin 3.
  • One surface of the first circuit 1 and one surface of the second circuit 2 are exposed on one surface of the circuit sheet 11, and these exposed surfaces form a circuit surface.
  • the first circuit 1 penetrates the circuit sheet 11 in the thickness direction, and the second circuit 2 is embedded in the resin 3, but the first circuit 1 and the second circuit 2 are Both may be embedded in the resin 3.
  • FIG. 2 is a schematic view showing a cross-sectional view of another embodiment of the circuit sheet of the present disclosure.
  • the circuit sheet 21 shown in FIG. 2 has a configuration in which an insulating layer 4 is provided on one surface of the circuit sheet 11 of FIG. Although the insulating layer 4 and the resin 3 are shown as separate members in FIG. 2, the insulating layer 4 may be integrated with the resin 3.
  • the configuration has a first circuit 1, a second circuit 2, and a resin 3 and does not have an insulating layer, and as in the circuit sheet 21 of FIG.
  • any aspect of the configuration having the insulating layer 4 is referred to as a "circuit sheet" for convenience.
  • a structure in which a substrate is further provided across an insulating layer is referred to as a "circuit board”.
  • each member of the circuit sheet will be described in detail.
  • the reference numerals are omitted in the description of each member.
  • the circuit sheet of the present disclosure includes a first circuit and a second circuit.
  • the first circuit and the second circuit may be collectively referred to as a "circuit”.
  • the circuit sheet of the present disclosure may include circuits having different thicknesses in addition to the first circuit and the second circuit.
  • the material of the circuit is not particularly limited, and examples thereof include copper, silver, chromium copper, tungsten copper, nickel, nickel-plated copper, aluminum, and aluminum surface-modified to alumite.
  • the method of manufacturing the circuit is not particularly limited.
  • the circuit is obtained by processing a metal member into a desired shape.
  • the processing method is not particularly limited, and examples thereof include punching, laser processing, and etching processing. From the viewpoint of improving the accuracy in circuit fabrication, it is preferable to form the circuit by etching.
  • the circuit is preferably formed on the temporary base material by arranging the metal member on the temporary base material and then performing etching.
  • the etching method of the metal member is not particularly limited. From the viewpoint of suppressing the occurrence of the tapered portion of the circuit, it is preferable to form the circuit by etching from both sides (that is, two main surfaces facing each other) of the metal member.
  • the circuit may be roughened.
  • the surface in contact with the insulating layer described later if the surface in contact with the insulating layer is at least roughened, it is possible to sufficiently adhere to the insulating layer while suppressing the generation of voids.
  • the adhesion due to the Van der Waals force can be improved by roughening the surface in contact with the insulating layer of the circuit to improve the pull-out force due to the anchor effect or increase the adhesion area.
  • the method of roughening the circuit is not particularly limited, and it may be performed by a physical method or a chemical method.
  • the physical method includes sanding, sandblasting, laser irradiation, milling and the like.
  • the chemical method include magdamit treatment, CZ treatment, blackening treatment, etching treatment, plating treatment and the like.
  • the roughening treatment may be performed by any one method or a combination of two or more. When two or more kinds are combined, the physical method and the chemical method may be combined, the chemical methods may be combined, or the physical methods may be combined.
  • the average thickness of the second circuit (that is, the second average thickness) is smaller than the average thickness of the first circuit (that is, the first average thickness).
  • the "average thickness" of the circuit is an arithmetic mean value of the measured values obtained at five arbitrarily selected locations when the thickness differs depending on the location of the circuit.
  • the average thickness of the circuit means the average thickness of the circuit itself, and when a part of the circuit is embedded in an adjacent member, it is a value including the thickness of the embedded part.
  • the first average thickness is not particularly limited, and from the viewpoint of dealing with a large current, it is preferably 350 ⁇ m or more, more preferably 500 ⁇ m or more, and further preferably 1000 ⁇ m or more. From the viewpoint of the volume of the circuit board itself, the first average thickness is preferably 5000 ⁇ m or less, more preferably 4000 ⁇ m or less, and further preferably 3000 ⁇ m or less.
  • the ratio of the second average thickness to the first average thickness can be adjusted according to the desired current capacity.
  • the ratio of the second average thickness to the first average thickness is preferably 0.50 or less, more preferably 0.40 or less, and further preferably 0.30 or less.
  • the ratio of the second average thickness to the first average thickness is preferably 0.05 or more.
  • the circuit pitch of the first circuit (that is, the first circuit pitch) is not particularly limited, and can be selected according to the application of the circuit board manufactured using this.
  • the first circuit may have different circuit pitches depending on the part.
  • the minimum value (referred to as the minimum value a) of the first circuit pitch is preferably equal to or less than the first average thickness.
  • the minimum value a is preferably in the range of more than 0.00 and not more than 1.00 when the first average thickness is 1.0. From the viewpoint of dielectric strength, the minimum value a is more preferably in the range of 0.50 to 1.00.
  • the minimum value a of the first circuit pitch is the distance measured at the narrowest portion of the distances between the circuit members of the first circuit.
  • the maximum value of the first circuit pitch is not particularly limited.
  • the circuit pitch of the second circuit (that is, the second circuit pitch) is not particularly limited, and can be selected according to the application of the circuit board manufactured using this.
  • the second circuit may have different circuit pitches depending on the part.
  • the minimum value (referred to as the minimum value b) of the second circuit pitch is preferably equal to or less than the second average thickness.
  • the minimum value b is preferably in the range of more than 0.00 and not more than 1.00 when the second average thickness is 1.0. From the viewpoint of dielectric strength, the minimum value b is more preferably in the range of 0.50 to 1.00.
  • the minimum value b of the second circuit pitch is the distance measured at the narrowest portion of the distances between the circuit members of the second circuit.
  • the maximum value of the second circuit pitch is not particularly limited.
  • the minimum value b of the second circuit pitch is smaller than the first average thickness.
  • the ratio of the minimum value b of the second circuit pitch to the first average thickness is preferably 0.50 or less, more preferably 0.40 or less, and further preferably 0.30 or less. According to the circuit sheet of the present disclosure, even if the minimum value b of the second circuit pitch is set in the above range, the insulating property can be suitably ensured.
  • the ratio of the minimum value b of the second circuit pitch to the first average thickness may be 0.05 or more.
  • the minimum value b of the second circuit pitch can be made smaller than the minimum value a of the first circuit pitch, and the circuit sheet can be miniaturized.
  • the width and length of the circuit are not particularly limited, and can be appropriately selected according to the application of the circuit board manufactured using the circuit board.
  • the space between the first circuit and the second circuit is filled with resin. Since the space between the circuits is filled with resin, the moisture resistance and reliability of the circuit board can be ensured, and the occurrence of creepage discharge, partial discharge, tracking, migration, etc. tends to be suppressed.
  • the resin used for filling is not particularly limited.
  • thermosetting resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin, acrylic resin, imide resin, and amide imide resin can be mentioned.
  • the resin used for filling may be one type or two or more types. From the viewpoint of electrical insulation and adhesiveness, the resin used for filling preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, amidimide resin and urethane resin, and from the viewpoint of moisture resistance, epoxy. It preferably contains at least one selected from the group consisting of resins, acrylic resins and amidimide resins.
  • the resin used for filling may be only one type or two or more types. Further, the resin used for filling may contain components other than the resin such as fillers (powder, fiber, etc.), if necessary.
  • the method of filling the space between the first circuit and the second circuit with resin is not particularly limited.
  • Specific examples of the method using a solid resin material such as powder include an extrusion molding method, a compression molding method, a transfer mold, an insert molding method, and the like, and as a method using a liquid resin material, a casting method and a coating method. , Printing method, embedding method, etc.
  • the space between the first circuit and the second circuit arranged on the temporary base material may be filled with resin.
  • the space between the first circuit and the second circuit arranged on the insulating layer may be filled with resin.
  • the linear expansion coefficient of the resin used for filling after curing is preferably 10 ppm / K to 50 ppm / K, and more preferably 12 ppm / K to 45 ppm / K.
  • the coefficient of linear expansion of the resin portion is the slope of the tangent line when the strain of the sample is plotted against the temperature by the thermomechanical analysis method, and is a value measured in a temperature region equal to or lower than the glass transition temperature of the sample.
  • the first circuit and the second circuit are arranged in the horizontal direction, and form a sheet in which the space between the first circuit and the second circuit is filled with resin.
  • the first surface is such that one surface of the first circuit and one surface of the second circuit are coplanar.
  • a circuit and a second circuit are arranged, and the space between the first circuit and the second circuit is filled with resin.
  • resin is also filled between each circuit member of the first circuit and between each circuit member of the second circuit. The resin may be arranged outside the first circuit and / or the second circuit in addition to the space between the first circuit and the second circuit.
  • the amount of resin to be filled at least a part of the space between the first circuit and the second circuit is filled with resin, and the first circuit and the second circuit are connected to each other through the resin.
  • the amount is not particularly limited as long as it is connected to form a sheet.
  • the thickness of the filled resin may be the same as the thickness of the first circuit, may be smaller than the thickness of the first circuit, or may be larger than the thickness of the first circuit.
  • the thickness of the filled resin is preferably the same as the thickness of the first circuit or larger than the thickness of the first circuit.
  • the resin portion exceeding the thickness of the first circuit may function as an insulating layer described later.
  • the thickness of the filled resin is smaller than the thickness of the first circuit, when the circuit sheet is separately provided with the insulating layer described later, pressure is applied when the circuit sheet is placed on the insulating layer, and the filled resin is used. It is preferable that no voids are formed in the plastic.
  • the thickness of the filled resin is the same as the thickness of the first circuit from the viewpoint of averaging the distribution of the pressure applied when providing the insulating layer on the circuit sheet and suppressing the occurrence of places with insufficient insulation. It is preferably present or larger than the first circuit.
  • the circuit sheet may further include an insulating layer present on one side.
  • the insulating layer is a portion that exists between the circuit and the substrate when the circuit board is manufactured and is responsible for insulation.
  • the insulating layer may be a layer composed of layered members, or may be a resin portion integrated with a resin filled in the space between the first circuit and the second circuit.
  • the insulating layer may be a layer provided on the circuit sheet before the circuit board is arranged on the substrate to manufacture the circuit board, or is a layer provided in parallel when the circuit sheet is arranged on the substrate. You may.
  • the material of the insulating layer is not particularly limited.
  • thermosetting resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin, acrylic resin, imide resin, and amide imide resin can be mentioned.
  • epoxy resin is preferable as the material of the insulating layer.
  • the resin used for filling preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, amidimide resin and urethane resin, and from the viewpoint of moisture resistance, epoxy. It preferably contains at least one selected from the group consisting of resins, acrylic resins and amidimide resins.
  • the resin used for filling may be only one type or two or more types. Further, the resin used for filling may contain components other than the resin such as fillers (powder, fiber, etc.), if necessary.
  • the material of the insulating layer may be the same as or different from the resin filled in the space between the first circuit and the second circuit described above.
  • a resin composition may be used for forming the insulating layer.
  • the composition of the resin composition is not particularly limited, and for example, a resin composition containing the above-mentioned thermosetting resin, curing agent, filler, and if necessary, other components can be used.
  • the resin composition may be solid or liquid at 25 ° C.
  • the type of curing agent that may be contained in the resin composition is not particularly limited, and a heavy addition type curing agent such as an acid anhydride type curing agent, an amine type curing agent, a phenol type curing agent, a mercaptan type curing agent, imidazole and the like. Potential hardeners and the like. From the viewpoint of heat resistance and adhesion, an amine-based curing agent or a phenol-based curing agent is preferable. From the viewpoint of storage stability, a phenolic curing agent is preferable. One type of curing agent may be used alone, or two or more types may be used in combination.
  • the material of the filler that may be contained in the resin composition is not particularly limited, and is preferably a thermally conductive filler.
  • the filler is preferably non-conductive. The use of a non-conductive filler tends to suppress a decrease in insulating property.
  • the non-conductive filler examples include aluminum oxide (alumina), magnesium oxide, aluminum nitride, boron nitride, silicon nitride, silica (silicon oxide), aluminum hydroxide, and barium sulfate.
  • the filler is preferably at least one selected from the group consisting of aluminum oxide (alumina), boron nitride, magnesium oxide, aluminum nitride and silica (silicon oxide), and boron nitride. And at least one selected from the group consisting of aluminum oxide (alumina) is more preferable.
  • the filler one type may be used alone or two or more types may be used in combination.
  • “Use of two or more types of fillers” means, for example, when two or more types of fillers having the same component but different average particle diameters are used, when two or more types of fillers having the same average particle size but different components are used, and when the average. There are cases where two or more types of fillers having different particle sizes and types are used.
  • the shape of the filler is not particularly limited, and examples thereof include powder, spherical, and fibrous. From the viewpoint of fluidity during molding and mold wearability, a spherical shape is preferable.
  • components that may be contained in the resin composition include curing accelerators, silane coupling agents, stress relaxation agents, colorants, flame retardants, defoamers, solvents and the like.
  • curing accelerators silane coupling agents, stress relaxation agents, colorants, flame retardants, defoamers, solvents and the like.
  • silane coupling agents stress relaxation agents
  • colorants colorants
  • flame retardants defoamers
  • solvents solvents and the like.
  • each component that may be contained in the resin composition one type may be used alone or two or more types may be used in combination.
  • the thickness of the insulating layer is not particularly limited and can be selected according to the application of the circuit board and the like. From the viewpoint of ensuring sufficient insulating properties, the thicker the insulating layer, the more preferable.
  • the thickness of the insulating layer is preferably 70 ⁇ m or more, more preferably 90 ⁇ m or more, and further preferably 110 ⁇ m or more. From the viewpoint of ensuring sufficient heat dissipation, it is preferable that the thickness of the insulating layer is thin.
  • the thickness of the insulating layer is preferably 230 ⁇ m or less, more preferably 210 ⁇ m or less, and even more preferably 190 ⁇ m or less.
  • the thickness of the insulating layer is preferably smaller than the thickness of the first circuit.
  • the total thickness of both insulating layers is defined as the thickness of the insulating layer. ..
  • the thickness of the insulating layer is the distance between the bottom surface of the first circuit and the bottom surface of the insulating layer when the insulating layer is arranged vertically downward in the circuit sheet. If the thickness of the insulating layer differs depending on the location, the thickness of the insulating layer shall be the average thickness measured at any five or more locations.
  • the method of arranging the insulating layer on one surface of the circuit sheet is not particularly limited.
  • (3) A method of forming an insulating layer in parallel when filling the space between the first circuit and the second circuit with a resin (4)
  • a method of filling the space between the circuit sheet and the substrate with a resin to form an insulating layer, and the like From the viewpoint of improving the insulating property, a method of arranging the resin sheet between the circuit sheet and the substrate is preferable. From the viewpoint of workability, a method of forming an insulating layer in parallel when filling the space between the first circuit and the second circuit with the resin is preferable.
  • the resin sheet When a resin sheet is used as described in (1) above, the resin sheet may be made by using a resin composition or may be an existing one.
  • the resin sheet may be attached to the surface of the circuit sheet facing the circuit sheet, may be attached to the surface of the substrate facing the circuit sheet, or may be attached to both sides. From the viewpoint of improving the adhesion between the circuit sheet and the substrate and further improving the insulation reliability, resin sheets are arranged on both the surface of the circuit board facing the substrate and the surface of the substrate facing the circuit sheet of both. It is preferable to join the resin sheets. In this case, the materials and thicknesses of both resin sheets may be the same or different. The material and thickness of the resin sheet can be set according to the state of the circuit sheet and the base material (adhesiveness to the insulating layer, etc.).
  • the insulating layer may be formed by using a resin sheet in a semi-cured state.
  • a semi-cured (B stage) resin sheet may be placed between the circuit sheet and the substrate and post-cured to be cured.
  • the method and conditions of the post-curing treatment are not particularly limited, and can be set according to the resin composition of the resin sheet and the like.
  • the viscosity of the semi-cured resin sheet is at room temperature (25 ° C.) from the viewpoint of enhancing the adhesiveness of the resin sheet to at least one of the circuit sheet and the substrate.
  • the temperature change from room temperature (25 ° C.) to 100 ° C. viscosity It is preferably reduced by 0.0001% to 50%.
  • the cured insulating layer does not melt even by heating.
  • the viscosity can be measured by dynamic viscoelasticity measurement (frequency 1 Hz, load 40 g, heating rate 3 ° C./min).
  • the cured state of the resin sheet is not particularly limited.
  • the heating temperature is not particularly limited.
  • the pressurizing pressure is not particularly limited.
  • it can be selected from the range of 0.1 MPa to 30 MPa.
  • the method is not particularly limited.
  • it can be carried out by applying the resin composition to at least one surface of the circuit sheet and the substrate by a dispense method, a spray method, a gravure method, screen printing, screen printing using a metal mask, transfer, or the like.
  • the resin composition When the resin composition is applied and the insulating layer is arranged, it is preferable to use a liquid resin composition.
  • a liquid resin composition When a liquid resin composition is used, an insulating layer having excellent insulating properties tends to be obtained even when at least one surface of the circuit sheet and the substrate is not flat due to waviness, unevenness, or the like.
  • the resin composition is "liquid” in the present disclosure, it means that it is liquid at least at the time when the resin composition is applied to the circuit sheet or the substrate.
  • the degree of liquidity is not particularly limited, and can be selected depending on the state of at least one surface of the circuit sheet and the substrate, the method of applying the resin composition, and the like.
  • the viscosity when the resin composition is applied to the circuit sheet is 10 Pa ⁇ s or less.
  • the viscosity of the resin composition is determined by an E-type viscometer (for example, Toki Sangyo Co., Ltd., TV-33) at a temperature (for example, any of 18 ° C. to 23 ° C.) when the resin composition is applied to a circuit sheet. Is a value measured at 5 rpm (rpm).
  • the resin composition may contain a component for adjusting the viscosity such as a solvent.
  • the solvent may be removed by drying or the like after the resin composition is applied onto a circuit sheet or a substrate.
  • the content of the solvent after removing the solvent is preferably 2% by mass or less, and more preferably 1% by mass or less of the entire resin composition.
  • an insulating layer is formed in parallel when filling the space between the first circuit and the second circuit with resin as in (3) above, and when the circuit sheet and substrate are formed as in (4).
  • the method described above can be mentioned as a method of filling the space between the first circuit and the second circuit with resin. That is, examples of a method using a solid resin composition such as powder include an extrusion molding method, a compression molding method, a transfer mold, an insert molding method, and the like, and methods using a liquid resin composition include a casting method and a coating method. Examples include a printing method and an embedding method.
  • the circuit board in one embodiment of the present disclosure includes the circuit board described above, the board, and an insulating layer existing between the circuit sheet and the board.
  • a circuit board according to a further embodiment of the present disclosure includes a circuit sheet including an insulating layer existing on one surface, and a substrate provided on the surface of the insulating layer opposite to the first circuit and the second circuit. And, including.
  • FIG. 8 is a schematic view showing a cross-sectional view of an embodiment of the circuit board of the present disclosure.
  • the circuit board 12 includes a resin 3 filled in a space between a first circuit 1, a second circuit 2, a first circuit 1 and a second circuit 2, and an insulating layer. 4 and.
  • a substrate 5 is provided on the opposite side of the first circuit 1 and the second circuit 2 of the insulating layer 4.
  • the resin 3 and the insulating layer 4 shown in FIG. 8 may be the same member.
  • reference numerals will be omitted in the description of the circuit board.
  • the material of the substrate is not particularly limited, and examples thereof include copper alloys such as copper, aluminum, tungsten copper, and molybdenum copper, and nickel-plated copper.
  • the type of the substrate is not particularly limited, and may be a member having a heat dissipation function such as a heat spreader or a heat sink, a case having an air or water flow path, a metal foil, a filler resin composite, or the like.
  • the surface of the substrate may be smooth, and may be roughened to improve the adhesiveness with the insulating layer.
  • the method of providing the substrate is not particularly limited.
  • the substrate may be arranged in parallel when the insulating layer is arranged using the resin sheet or the resin composition.
  • a circuit sheet having an insulating layer already provided may be arranged on the substrate.
  • the circuit sheet may be arranged on a substrate provided with an insulating layer.
  • the semiconductor device includes the circuit board and the semiconductor element described above.
  • the circuit board and semiconductor device in this embodiment are suitable for high current and high density mounting.
  • semiconductor elements include elements such as active elements and passive elements.
  • the active element include semiconductor chips, transistors, diodes, thyristors and the like.
  • the passive element include a capacitor, a resistor, a coil and the like. It can also be applied to electronic components that are modularized by incorporating a plurality of elements such as these active elements and passive elements.
  • a first circuit having a first average thickness and a second average thickness smaller than the first average thickness are arranged on a temporary base material. It includes filling the space between the second circuit having the resin.
  • the circuit sheet manufacturing method of the present embodiment may include other steps, if necessary.
  • the resin filling method is as described above in the description of the circuit sheet. Further, the above-mentioned details of the circuit sheet can be applied to the details of the circuit sheet manufactured by the manufacturing method according to the present embodiment.
  • the method of arranging the first circuit and the second circuit on the temporary base material is not particularly limited.
  • the metal member held on the temporary base material may be etched to form a circuit.
  • the circuit may be arranged on the temporary base material after the circuit is formed by a known method such as punching, laser processing, or etching.
  • punching laser processing
  • etching When etching a metal member held on a temporary base material, if etching is performed from both sides (that is, two main surfaces) of the metal member, for example, the metal member arranged on the insulating layer is etched to form a circuit.
  • the length of the tapered portion formed at the end of the metal member is smaller than that in the case of According to the method for manufacturing a circuit sheet according to the above embodiment, the circuit pitch can be reduced, and a large current can be achieved while corresponding to high-density mounting and miniaturization of the circuit board.
  • the temporary base material means that the circuit can be temporarily fixed before filling the space between the first circuit and the second circuit arranged on the temporary base material with the resin, and the temporary base material is filled with the resin. It means something that can be removed from the circuit after it is done.
  • temporary fixed means that the circuit maintains a relative positional relationship due to contact with the temporary base material, and does not necessarily mean that the circuit does not move completely. ..
  • Examples of the temporary base material include a resin film and the like.
  • Examples of the resin film that can be used as the temporary base material include a resin film having a support film and an adhesive layer formed on the support film.
  • Temporary fixing of the circuit can be performed by bringing the circuit into contact with the adhesive layer of the resin film and applying pressure and temperature as necessary.
  • the resin film may have an adhesive layer at least on the surface on the side in contact with the circuit.
  • the resin film is preferably flexible from the viewpoint of being easily removed from the circuit after filling with the resin.
  • the material of the supporting film of the resin film is not particularly limited, and the material of aromatic polyimide, aromatic polyamide, aromatic polysulfone, aromatic polyethersulfone, polyphenylene sulfide, aromatic polyetherketone, polyarylate, aromatic polyetheretherketone and It is preferably selected from the group consisting of polyethylene terephthalate.
  • An adhesive may be applied to the adhesive layer.
  • the adhesive include acrylic adhesives, urethane adhesives, silicone adhesives and the like.
  • the adhesive refers to a substance capable of binding an object by interposing between the objects.
  • the thickness of the resin film is not particularly limited and may be 10 ⁇ m to 150 ⁇ m.
  • the length and width of the resin film can be appropriately adjusted depending on the shape of the circuit.
  • the method for manufacturing a circuit sheet when the temporary base material is removed from the circuit sheet formed on the temporary base material, the method is not particularly limited.
  • a flexible film may be used as a temporary base material, and this may be peeled off from the circuit.
  • a method of manufacturing a circuit sheet according to a further embodiment of the present disclosure includes a first circuit having a first average thickness, a second circuit having a second average thickness smaller than the first average thickness, and the above-mentioned. It includes arranging an insulating layer on one surface of a circuit sheet containing a resin that fills the space between the first circuit and the second circuit.
  • the circuit sheet manufacturing method of the present embodiment may include other steps, if necessary.
  • the method of arranging the insulating layer is as described above in the description of the circuit sheet. Further, the above-mentioned details of the circuit sheet can be applied to the details of the circuit sheet manufactured by the manufacturing method according to the present embodiment.
  • the method of manufacturing a circuit board according to an embodiment of the present disclosure includes arranging an insulating layer between the above-mentioned circuit sheet and the substrate.
  • a method of manufacturing a circuit board according to a further embodiment of the present disclosure includes arranging the substrate on one surface of a circuit sheet including an insulating layer manufactured by the method of manufacturing a circuit sheet described above.
  • the circuit board manufacturing method of these embodiments may include other steps, if necessary.
  • FIG. 3 is a plan view conceptually showing a state after the metal member is etched to form a circuit
  • FIG. 4 is a sectional view taken along line AA'. 3 and 4 show a state in which the first circuit 1 having a large thickness and the second circuit 2 having a small thickness are arranged on the temporary base material 10.
  • the circuit of the portion surrounded by the broken line in FIG. 3 represents the second circuit 2
  • the circuit of the portion not surrounded by the broken line represents the first circuit 1.
  • the first circuit 1 and the second circuit 2 are each composed of a plurality of circuit members, and a circuit pitch exists between the circuit members.
  • the circuit pitch of the second circuit 2 is narrower than the circuit pitch of the first circuit 1.
  • the cross section of the circuit tends to be tapered, and if the circuit pitch is narrowed, it tends to be difficult to secure insulation, but the thickness is small as in the second circuit 2. In the circuit, it is possible to prevent the cross section from becoming tapered. Therefore, the circuit pitch can be narrowed.
  • FIG. 5 is a plan view conceptually showing a state in which the space between the first circuit 1 and the second circuit 2 is filled with the resin 3
  • FIG. 6 is a sectional view taken along line AA'.
  • FIG. 7 is a plane conceptually showing a state in which the first circuit 1 and the second circuit 2 after removing the temporary base material 10 are arranged on the substrate 5 together with the resin 3 via the insulating layer 4.
  • FIG. 8 is a sectional view taken along line AA'.
  • the substrate 5 is arranged on the surface of the insulating layer 4 opposite to the first circuit 1 and the second circuit 2.
  • the insulating layer 4 is shown as a member separate from the resin 3 in FIG. 8, the insulating layer 4 may be integrated with the resin 3.

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Abstract

A circuit sheet (11) includes: a first circuit (1) having a first average thickness and a first circuit pitch; a second circuit (2) having a second average thickness which is thinner than the first average thickness, and a circuit pitch; and a resin (3) filling in a space between the first circuit and the second circuit.

Description

回路シート、回路基板、半導体装置、回路シートの製造方法、及び回路基板の製造方法Circuit sheet, circuit board, semiconductor device, circuit sheet manufacturing method, and circuit board manufacturing method
　本開示は、回路シート、回路基板、半導体装置、回路シートの製造方法、及び回路基板の製造方法に関する。 The present disclosure relates to a circuit sheet, a circuit board, a semiconductor device, a method for manufacturing a circuit sheet, and a method for manufacturing a circuit board.
　電子機器の小型化及び高機能化の進展に伴い、電子部品を基板上に高密度実装することが可能な回路基板としてプリント基板が広く用いられている。プリント基板は一般に、基板に金属箔を貼り付け、これをエッチングして所望の回路形状に加工することで製造されている。 With the progress of miniaturization and high functionality of electronic devices, printed circuit boards are widely used as circuit boards capable of mounting electronic components at high density on the board. A printed circuit board is generally manufactured by attaching a metal foil to the substrate, etching the metal foil, and processing the printed circuit board into a desired circuit shape.
　一方、電子機器の使用環境の多様化に伴い、回路基板の電流容量の増大（大電流化）が求められている。回路基板の電流容量を増大する方法としては、回路の断面積を大きくする方法が提案されている。例えば、特許文献１には、エッチング、プレス等であらかじめ回路の状態に加工した金属部材を、加熱により軟化させた絶縁層に押し込むことによって作製される回路基板が提案されている。また、特許文献２には、プリント基板に、大電流を通電する回路である導電性金属バーを設置することにより作製される回路基板が提案されている。 On the other hand, with the diversification of the usage environment of electronic devices, it is required to increase the current capacity of the circuit board (increase the current). As a method of increasing the current capacity of the circuit board, a method of increasing the cross section of the circuit has been proposed. For example, Patent Document 1 proposes a circuit board manufactured by pressing a metal member that has been previously processed into a circuit state by etching, pressing, or the like into an insulating layer that has been softened by heating. Further, Patent Document 2 proposes a circuit board manufactured by installing a conductive metal bar, which is a circuit for energizing a large current, on a printed circuit board.
特開２００１－３６２０１号公報Japanese Unexamined Patent Publication No. 2001-326201 特開平５－１６７２０７号公報Japanese Unexamined Patent Publication No. 5-167207
　大電流化に対応するために回路の断面積を大きくする場合、回路間の絶縁性を担保する観点から、一般的に、回路ピッチを広げて回路基板が設計される。しかしながら、これにより回路基板全体が大型化し、電子部品の高密度実装化の要請に応えられない場合がある。 When increasing the cross-sectional area of a circuit in order to cope with a large current, the circuit board is generally designed by widening the circuit pitch from the viewpoint of ensuring the insulation between the circuits. However, this may increase the size of the entire circuit board and may not meet the demand for high-density mounting of electronic components.
　上記事情に鑑み、本開示は、絶縁信頼性を損なうことなく、電流容量が大きく、高密度実装化が可能な回路シート、当該回路シートを用いた回路基板及び半導体装置、並びにこれらの製造方法を提供することを課題とする。 In view of the above circumstances, the present disclosure describes a circuit sheet having a large current capacity and capable of high-density mounting without impairing insulation reliability, a circuit board and a semiconductor device using the circuit sheet, and a method for manufacturing these. The challenge is to provide.
　上記課題を解決するための手段は、以下の態様を含む。
＜１＞　第１の平均厚みを有し、第１の回路ピッチを有する第１の回路と、
　前記第１の平均厚みより小さい第２の平均厚みを有し、第２の回路ピッチを有する第２の回路と、
　前記第１の回路と前記第２の回路との間の空間に充填されている樹脂と、
を含む、回路シート。
＜２＞　前記第１の平均厚みが３５０μｍ以上である、＜１＞に記載の回路シート。
＜３＞　前記第１の平均厚みに対する前記第２の平均厚みの割合が０．５０以下である、＜１＞又は＜２＞に記載の回路シート。
＜４＞　前記第２の回路ピッチの最小値ｂが、前記第１の平均厚みより小さい、＜１＞～＜３＞のいずれか１項に記載の回路シート。
＜５＞　前記第２の回路ピッチの最小値ｂの前記第１の平均厚みに対する割合が０．５０以下である、＜１＞～＜４＞のいずれか１項に記載の回路シート。
＜６＞　前記第２の平均厚みに対する、前記第２の回路ピッチの最小値ｂの比（第２の回路ピッチの最小値ｂ／第２の平均厚み）が、０．００を超えて１．００以下の範囲内である、＜１＞～＜５＞のいずれか１項に記載の回路シート。
＜７＞　前記第２の回路ピッチの最小値ｂが、前記第１の回路ピッチの最小値ａよりも小さい、＜１＞～＜６＞のいずれか１項に記載の回路シート。
＜８＞　一方の面に存在する絶縁層をさらに含む＜１＞～＜７＞のいずれか１項に記載の回路シート。
＜９＞　＜８＞に記載の回路シートと、
　前記絶縁層の、前記第１の回路及び前記第２の回路とは反対側の面に設けられる基板と、
を含む回路基板。
＜１０＞　＜１＞～＜７＞のいずれか１項に記載の回路シートと、
　基板と、
　前記回路シートと前記基板との間に配置されている絶縁層と、
を含む回路基板。
＜１１＞　＜９＞又は＜１０＞に記載の回路基板と半導体素子とを備える半導体装置。
＜１２＞　仮基材上に配置された、第１の平均厚みを有する第１の回路と、前記第１の平均厚みより小さい第２の平均厚みを有する第２の回路と、の間の空間に樹脂を充填することを含む、回路シートの製造方法。
＜１３＞　＜１２＞に記載の製造方法により製造された回路シートと、基板と、の間に絶縁層を配置することを含む、回路基板の製造方法。
＜１４＞　第１の平均厚みを有する第１の回路と、前記第１の平均厚みより小さい第２の平均厚みを有する第２の回路と、前記第１の回路と前記第２の回路との間の空間に充填されている樹脂と、を含む回路シートの一方の面に絶縁層を配置することを含む、回路シートの製造方法。
＜１５＞　＜１４＞に記載の製造方法により製造された回路シートの一方の面に基板を配置することを含む、回路基板の製造方法。 Means for solving the above problems include the following aspects.
<1> A first circuit having a first average thickness and a first circuit pitch, and
A second circuit having a second average thickness smaller than the first average thickness and having a second circuit pitch,
The resin filled in the space between the first circuit and the second circuit,
Including, circuit sheet.
<2> The circuit sheet according to <1>, wherein the first average thickness is 350 μm or more.
<3> The circuit sheet according to <1> or <2>, wherein the ratio of the second average thickness to the first average thickness is 0.50 or less.
<4> The circuit sheet according to any one of <1> to <3>, wherein the minimum value b of the second circuit pitch is smaller than the first average thickness.
<5> The circuit sheet according to any one of <1> to <4>, wherein the ratio of the minimum value b of the second circuit pitch to the first average thickness is 0.50 or less.
<6> The ratio of the minimum value b of the second circuit pitch to the second average thickness (minimum value b of the second circuit pitch / second average thickness) exceeds 0.00. The circuit sheet according to any one of <1> to <5>, which is within the range of 00 or less.
<7> The circuit sheet according to any one of <1> to <6>, wherein the minimum value b of the second circuit pitch is smaller than the minimum value a of the first circuit pitch.
<8> The circuit sheet according to any one of <1> to <7>, further including an insulating layer existing on one surface.
<9> The circuit sheet described in <8> and
A substrate provided on the surface of the insulating layer opposite to the first circuit and the second circuit.
Circuit board including.
<10> The circuit sheet according to any one of <1> to <7> and
With the board
An insulating layer arranged between the circuit sheet and the substrate,
Circuit board including.
<11> A semiconductor device including the circuit board and semiconductor element according to <9> or <10>.
<12> Space between a first circuit having a first average thickness and a second circuit having a second average thickness smaller than the first average thickness, which is arranged on the temporary base material. A method of manufacturing a circuit sheet, which comprises filling the sheet with resin.
<13> A method for manufacturing a circuit board, which comprises arranging an insulating layer between the circuit sheet manufactured by the manufacturing method according to <12> and the substrate.
<14> A first circuit having a first average thickness, a second circuit having a second average thickness smaller than the first average thickness, and the first circuit and the second circuit. A method of manufacturing a circuit sheet, comprising arranging an insulating layer on one surface of the circuit sheet containing the resin filled in the space between them.
<15> A method for manufacturing a circuit board, which comprises arranging a substrate on one surface of a circuit sheet manufactured by the manufacturing method according to <14>.
　本開示によれば、絶縁信頼性を損なうことなく、電流容量が大きく、高密度実装化が可能な回路シート、当該回路シートを用いた回路基板及び半導体装置、並びにこれらの製造方法が提供される。 According to the present disclosure, a circuit sheet having a large current capacity and capable of high-density mounting without impairing insulation reliability, a circuit board and a semiconductor device using the circuit sheet, and a method for manufacturing these are provided. ..
本開示の一実施形態に係る回路シートを概念的に示す断面図である。It is sectional drawing which conceptually shows the circuit sheet which concerns on one Embodiment of this disclosure. 本開示の一実施形態に係る回路シートを概念的に示す断面図である。It is sectional drawing which conceptually shows the circuit sheet which concerns on one Embodiment of this disclosure. 金属部材から回路を形成した後の状態を概念的に示す平面図である。It is a top view which conceptually shows the state after forming a circuit from a metal member. 金属部材から回路を形成した後の状態を概念的に示す断面図である。It is sectional drawing which conceptually shows the state after forming a circuit from a metal member. 第１の回路及び第２の回路の間の空間を樹脂で充填して形成した回路シートを概念的に示す平面図である。It is a top view which conceptually shows the circuit sheet formed by filling the space between the 1st circuit and the 2nd circuit with resin. 第１の回路及び第２の回路の間の空間を樹脂で充填して形成した回路シートを概念的に示す断面図である。It is sectional drawing which conceptually shows the circuit sheet formed by filling the space between the 1st circuit and the 2nd circuit with resin. 本開示の一実施形態に係る回路基板を概念的に示す平面図である。It is a top view which conceptually shows the circuit board which concerns on one Embodiment of this disclosure. 本開示の一実施形態に係る回路基板を概念的に示す断面図である。It is sectional drawing which conceptually shows the circuit board which concerns on one Embodiment of this disclosure.
　以下、本発明を実施するための形態について詳細に説明する。但し、本発明は以下の実施形態に限定されるものではない。以下の実施形態において、その構成要素（要素ステップ等も含む）は、特に明示した場合を除き、必須ではない。数値及びその範囲についても同様であり、本発明を制限するものではない。 Hereinafter, a mode for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the components (including element steps and the like) are not essential unless otherwise specified. The same applies to the numerical values and their ranges, and does not limit the present invention.
　本開示において「工程」との語には、他の工程から独立した工程に加え、他の工程と明確に区別できない場合であってもその工程の目的が達成されれば、当該工程も含まれる。
　本開示において「～」を用いて示された数値範囲には、「～」の前後に記載される数値がそれぞれ最小値及び最大値として含まれる。
　本開示中に段階的に記載されている数値範囲において、一つの数値範囲で記載された上限値又は下限値は、他の段階的な記載の数値範囲の上限値又は下限値に置き換えてもよい。また、本開示中に記載されている数値範囲において、その数値範囲の上限値又は下限値は、実施例に示されている値に置き換えてもよい。
　本開示において各成分は該当する物質を複数種含まれていてもよい。組成物中に各成分に該当する物質が複数種存在する場合、各成分の含有率又は含有量は、特に断らない限り、組成物中に存在する当該複数種の物質の合計の含有率又は含有量を意味する。
　本開示において「層」との語には、当該層が存在する領域を観察したときに、当該領域の全体に形成されている場合に加え、当該領域の一部にのみ形成されている場合も含まれる。
　本開示において実施形態を図面を参照して説明する場合、当該実施形態の構成は図面に示された構成に限定されない。また、各図における部材の大きさは概念的なものであり、部材間の大きさの相対的な関係はこれに限定されない。また、各図面において、実質的に同じ機能を有する部材には、全図面同じ符号を付与し、重複する説明は省略する場合がある。 In the present disclosure, the term "process" includes not only a process independent of other processes but also the process if the purpose of the process is achieved even if the process cannot be clearly distinguished from the other process. ..
In the present disclosure, the numerical range indicated by using "-" includes the numerical values before and after "-" as the minimum value and the maximum value, respectively.
In the numerical range described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. .. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
In the present disclosure, each component may contain a plurality of applicable substances. When a plurality of substances corresponding to each component are present in the composition, the content rate or content of each component is the total content rate or content of the plurality of substances present in the composition unless otherwise specified. Means quantity.
In the present disclosure, the term "layer" is used not only when the area where the layer exists is observed, but also when the layer is formed in the entire area or only a part of the area. included.
When the embodiment is described in the present disclosure with reference to the drawings, the configuration of the embodiment is not limited to the configuration shown in the drawings. Further, the size of the members in each figure is conceptual, and the relative relationship between the sizes of the members is not limited to this. Further, in each drawing, members having substantially the same function may be given the same reference numerals in all drawings, and duplicate description may be omitted.
≪回路シート≫
　本開示の回路シートは、
　第１の平均厚みを有し、第１の回路ピッチを有する第１の回路と、
　前記第１の平均厚みより小さい第２の平均厚みを有し、第２の回路ピッチを有する第２の回路と、
　前記第１の回路と前記第２の回路との間の空間に充填されている樹脂と、
を含む。 ≪Circuit sheet≫
The circuit sheet of the present disclosure is
A first circuit having a first average thickness and a first circuit pitch,
A second circuit having a second average thickness smaller than the first average thickness and having a second circuit pitch,
The resin filled in the space between the first circuit and the second circuit,
including.
　本開示の回路シートによれば、大電流化に対応した回路基板であっても、絶縁信頼性を損なうことなく、高密度実装化を図ることができる。
　一般的に、大電流化に対応するために回路の断面積を大きくする場合、回路部材間の絶縁性を担保する観点から、回路ピッチも広く設計される。特に、エッチングにより金属部材を加工して回路を作製する場合、回路の断面がテーパー状となるため、絶縁性を担保するために十分な回路ピッチが設けられる。したがって、大電流化に対応可能な回路基板は大型化する傾向にある。一方、本開示の回路シートでは、厚みの異なる２種類以上の回路を用いて回路を形成している。これは、厚みの大きい回路で大電流に対応しつつ、小電流のみを必要とする箇所には厚みの小さい回路を配置することで、回路ピッチを狭めることを可能とし、回路基板の小型化を図ったものである。これにより、回路基板の高密度実装化に対応しつつ大電流化を達成することができる。 According to the circuit sheet of the present disclosure, even a circuit board corresponding to a large current can be mounted at a high density without impairing the insulation reliability.
Generally, when the cross section of a circuit is increased in order to cope with a large current, the circuit pitch is also designed to be wide from the viewpoint of ensuring the insulation between circuit members. In particular, when a circuit is manufactured by processing a metal member by etching, the cross section of the circuit is tapered, so that a sufficient circuit pitch is provided to ensure insulation. Therefore, the circuit board that can cope with a large current tends to be large. On the other hand, in the circuit sheet of the present disclosure, a circuit is formed by using two or more types of circuits having different thicknesses. This makes it possible to narrow the circuit pitch by arranging a circuit with a small thickness in a place where only a small current is required while supporting a large current with a circuit with a large thickness, and downsizing the circuit board. It is a plan. As a result, it is possible to achieve a large current while supporting high-density mounting of the circuit board.
　以下、図面を参照して本開示の回路シートの具体例を説明する。
　図１は、本開示の回路シートの一実施形態の断面図を表す概略図である。図１において、回路シート１１は、第１の平均厚みを有する第１の回路１と、第１の平均厚みより小さい第２の平均厚みを有する第２の回路２と、第１の回路１と第２の回路２との間の空間に充填されている樹脂３と、を含む。回路シートは、第１の回路１、第２の回路２、及び樹脂３により、一枚のシートを構成している。回路シート１１の一方の面には、第１の回路１の一面と第２の回路２の一面が露出しており、これらの露出している面が回路面を形成している。回路シート１１では、第１の回路１は回路シート１１を厚み方向に貫通しており、第２の回路２は樹脂３に埋設されているが、第１の回路１及び第２の回路２がいずれも樹脂３に埋設されていてもよい。 Hereinafter, specific examples of the circuit sheet of the present disclosure will be described with reference to the drawings.
FIG. 1 is a schematic view showing a cross-sectional view of an embodiment of the circuit sheet of the present disclosure. In FIG. 1, the circuit sheet 11 includes a first circuit 1 having a first average thickness, a second circuit 2 having a second average thickness smaller than the first average thickness, and a first circuit 1. Includes a resin 3 that fills the space between the second circuit 2. The circuit sheet is composed of a first circuit 1, a second circuit 2, and a resin 3. One surface of the first circuit 1 and one surface of the second circuit 2 are exposed on one surface of the circuit sheet 11, and these exposed surfaces form a circuit surface. In the circuit sheet 11, the first circuit 1 penetrates the circuit sheet 11 in the thickness direction, and the second circuit 2 is embedded in the resin 3, but the first circuit 1 and the second circuit 2 are Both may be embedded in the resin 3.
　図２は、本開示の回路シートの別の一実施形態の断面図を表す概略図である。図２に示される回路シート２１は、図１の回路シート１１の一方の面に絶縁層４が設けられた構成をとっている。なお、図２では絶縁層４と樹脂３とが別個の部材として示されているが、絶縁層４は樹脂３と一体化されていてもよい。 FIG. 2 is a schematic view showing a cross-sectional view of another embodiment of the circuit sheet of the present disclosure. The circuit sheet 21 shown in FIG. 2 has a configuration in which an insulating layer 4 is provided on one surface of the circuit sheet 11 of FIG. Although the insulating layer 4 and the resin 3 are shown as separate members in FIG. 2, the insulating layer 4 may be integrated with the resin 3.
　なお、本開示では、図１の回路シート１１のように第１の回路１と第２の回路２と樹脂３とを有し絶縁層を有さない構成、及び図２の回路シート２１のようにさらに絶縁層４を有する構成のいずれの態様も便宜的に「回路シート」と称している。また、後述のように、絶縁層を隔ててさらに基板が設けられた構造を「回路基板」と称している。 In the present disclosure, as shown in the circuit sheet 11 of FIG. 1, the configuration has a first circuit 1, a second circuit 2, and a resin 3 and does not have an insulating layer, and as in the circuit sheet 21 of FIG. In addition, any aspect of the configuration having the insulating layer 4 is referred to as a "circuit sheet" for convenience. Further, as will be described later, a structure in which a substrate is further provided across an insulating layer is referred to as a "circuit board".
　以下、回路シートの各部材について詳述する。なお、各部材の説明において符号は省略する。 Hereinafter, each member of the circuit sheet will be described in detail. The reference numerals are omitted in the description of each member.
＜回路＞
　本開示の回路シートは第１の回路と第２の回路とを含む。以下、第１の回路及び第２の回路を包括して単に「回路」ということがある。本開示の回路シートは第１の回路と第２の回路に加えて、さらに厚みの異なる回路を含んでいてもよい。 <Circuit>
The circuit sheet of the present disclosure includes a first circuit and a second circuit. Hereinafter, the first circuit and the second circuit may be collectively referred to as a "circuit". The circuit sheet of the present disclosure may include circuits having different thicknesses in addition to the first circuit and the second circuit.
　回路の材質は特に制限されず、銅、銀、クロム銅、タングステン銅、ニッケル、ニッケルメッキ銅、アルミニウム、アルマイトに表面修飾したアルミニウム等が挙げられる。 The material of the circuit is not particularly limited, and examples thereof include copper, silver, chromium copper, tungsten copper, nickel, nickel-plated copper, aluminum, and aluminum surface-modified to alumite.
　回路の作製方法は特に制限されない。例えば、回路は、金属部材を所望の形状に加工することで得られる。加工の方法は特に制限されず、打抜き加工、レーザー加工、エッチング加工等が挙げられる。回路作製における精度の向上の観点からは、エッチング加工にて回路を形成することが好ましい。 The method of manufacturing the circuit is not particularly limited. For example, the circuit is obtained by processing a metal member into a desired shape. The processing method is not particularly limited, and examples thereof include punching, laser processing, and etching processing. From the viewpoint of improving the accuracy in circuit fabrication, it is preferable to form the circuit by etching.
　回路は、金属部材を仮基材上に配置し、次いでエッチングを行うことによって仮基材上に形成されたものであることが好ましい。 The circuit is preferably formed on the temporary base material by arranging the metal member on the temporary base material and then performing etching.
　回路をエッチング加工にて作製する場合、金属部材のエッチング方法は特に制限されない。回路のテーパー部分の発生を抑制する観点からは、金属部材の両面（すなわち向かい合う２つの主面）からエッチングすることにより回路を形成することが好ましい。 When the circuit is manufactured by etching, the etching method of the metal member is not particularly limited. From the viewpoint of suppressing the occurrence of the tapered portion of the circuit, it is preferable to form the circuit by etching from both sides (that is, two main surfaces facing each other) of the metal member.
　回路は、粗化処理されていてもよい。例えば、回路が後述の絶縁層と接する場合、当該絶縁層と接する面が少なくとも粗化処理されていると、ボイドの発生を抑制しながら、絶縁層と十分に接着できる状態とすることができる。具体的には、回路の絶縁層と接する面を粗化し、アンカー効果による引き抜き力を向上させるか密着面積を増大させることで、ファンデルワールス力による密着性を向上することができると考えられる。 The circuit may be roughened. For example, when the circuit is in contact with the insulating layer described later, if the surface in contact with the insulating layer is at least roughened, it is possible to sufficiently adhere to the insulating layer while suppressing the generation of voids. Specifically, it is considered that the adhesion due to the Van der Waals force can be improved by roughening the surface in contact with the insulating layer of the circuit to improve the pull-out force due to the anchor effect or increase the adhesion area.
　回路を粗化処理する方法は特に制限されず、物理的な方法で行っても、化学的な方法で行ってもよい。例えば、回路の材質が銅であれば、物理的な方法としては、やすりがけ、サンドブラスト処理、レーザー照射、フライス加工等が挙げられる。化学的な方法としては、マグダミット処理、ＣＺ処理、黒化処理、エッチング処理、メッキ処理等が挙げられる。粗化処理は、いずれか１種の方法により行っても、２種以上を組み合わせてもよい。２種以上を組み合わせる場合は、物理的な方法と化学的な方法を組み合わせて行っても、化学的な方法同士を組み合わせて行っても、物理的な方法同士を組み合わせて行ってもよい。 The method of roughening the circuit is not particularly limited, and it may be performed by a physical method or a chemical method. For example, when the material of the circuit is copper, the physical method includes sanding, sandblasting, laser irradiation, milling and the like. Examples of the chemical method include magdamit treatment, CZ treatment, blackening treatment, etching treatment, plating treatment and the like. The roughening treatment may be performed by any one method or a combination of two or more. When two or more kinds are combined, the physical method and the chemical method may be combined, the chemical methods may be combined, or the physical methods may be combined.
　第２の回路の平均厚み（すなわち、第２の平均厚み）は第１の回路の平均厚み（すなわち、第１の平均厚み）よりも小さい。本開示において、回路の「平均厚み」は、回路の場所によって厚みが異なる場合には、任意に選択した５箇所で得られた測定値の算術平均値とする。回路の平均厚みは回路自体の平均厚みを意味し、隣接する部材に回路の一部が埋め込まれている場合は埋め込まれている部分の厚みも含めた値とする。 The average thickness of the second circuit (that is, the second average thickness) is smaller than the average thickness of the first circuit (that is, the first average thickness). In the present disclosure, the "average thickness" of the circuit is an arithmetic mean value of the measured values obtained at five arbitrarily selected locations when the thickness differs depending on the location of the circuit. The average thickness of the circuit means the average thickness of the circuit itself, and when a part of the circuit is embedded in an adjacent member, it is a value including the thickness of the embedded part.
　第１の平均厚みは特に制限されず、大電流化に対応する観点からは、３５０μｍ以上であることが好ましく、５００μｍ以上であることがより好ましく、１０００μｍ以上であることがさらに好ましい。回路基板自体の容積の観点からは、第１の平均厚みは５０００μｍ以下であることが好ましく、４０００μｍ以下であることがより好ましく、３０００μｍ以下であることがさらに好ましい。 The first average thickness is not particularly limited, and from the viewpoint of dealing with a large current, it is preferably 350 μm or more, more preferably 500 μm or more, and further preferably 1000 μm or more. From the viewpoint of the volume of the circuit board itself, the first average thickness is preferably 5000 μm or less, more preferably 4000 μm or less, and further preferably 3000 μm or less.
　第１の平均厚みに対する第２の平均厚みの割合は、所望の電流容量に応じて調節できる。例えば、第１の平均厚みに対する第２の平均厚みの割合は、０．５０以下であることが好ましく、０．４０以下であることがより好ましく、０．３０以下であることがさらに好ましい。第１の平均厚みに対する第２の平均厚みの割合は０．０５以上であることが好ましい。 The ratio of the second average thickness to the first average thickness can be adjusted according to the desired current capacity. For example, the ratio of the second average thickness to the first average thickness is preferably 0.50 or less, more preferably 0.40 or less, and further preferably 0.30 or less. The ratio of the second average thickness to the first average thickness is preferably 0.05 or more.
　第１の回路の回路ピッチ（すなわち、第１の回路ピッチ）は特に制限されず、これを用いて製造される回路基板の用途等に応じて選択できる。第１の回路は部位によって異なる回路ピッチを有してもよい。第１の回路ピッチの最小値（最小値ａと称する）は、第１の平均厚み以下であることが好ましい。例えば、最小値ａは、第１の平均厚みを１．０とした場合に、０．００を超えて１．００以下の範囲内であることが好ましい。絶縁耐圧の観点からは、最小値ａは、０．５０～１．００の範囲内であることがより好ましい。第１の回路ピッチの最小値ａは、第１の回路の各回路部材間の距離のうち、最も狭い部分で測定される距離である。第１の回路ピッチの最大値は特に制限されない。 The circuit pitch of the first circuit (that is, the first circuit pitch) is not particularly limited, and can be selected according to the application of the circuit board manufactured using this. The first circuit may have different circuit pitches depending on the part. The minimum value (referred to as the minimum value a) of the first circuit pitch is preferably equal to or less than the first average thickness. For example, the minimum value a is preferably in the range of more than 0.00 and not more than 1.00 when the first average thickness is 1.0. From the viewpoint of dielectric strength, the minimum value a is more preferably in the range of 0.50 to 1.00. The minimum value a of the first circuit pitch is the distance measured at the narrowest portion of the distances between the circuit members of the first circuit. The maximum value of the first circuit pitch is not particularly limited.
　第２の回路の回路ピッチ（すなわち、第２の回路ピッチ）は特に制限されず、これを用いて製造される回路基板の用途等に応じて選択できる。第２の回路は部位によって異なる回路ピッチを有してもよい。第２の回路ピッチの最小値（最小値ｂと称する）は、第２の平均厚み以下であることが好ましい。例えば、最小値ｂは、第２の平均厚みを１．０とした場合に、０．００を超えて１．００以下の範囲内であることが好ましい。絶縁耐圧の観点からは、最小値ｂは、０．５０～１．００の範囲内であることがより好ましい。第２の回路ピッチの最小値ｂは第２の回路の各回路部材間の距離のうち、最も狭い部分で測定される距離である。第２の回路ピッチの最大値は特に制限されない。 The circuit pitch of the second circuit (that is, the second circuit pitch) is not particularly limited, and can be selected according to the application of the circuit board manufactured using this. The second circuit may have different circuit pitches depending on the part. The minimum value (referred to as the minimum value b) of the second circuit pitch is preferably equal to or less than the second average thickness. For example, the minimum value b is preferably in the range of more than 0.00 and not more than 1.00 when the second average thickness is 1.0. From the viewpoint of dielectric strength, the minimum value b is more preferably in the range of 0.50 to 1.00. The minimum value b of the second circuit pitch is the distance measured at the narrowest portion of the distances between the circuit members of the second circuit. The maximum value of the second circuit pitch is not particularly limited.
　一実施形態において、第２の回路ピッチの最小値ｂは第１の平均厚みより小さい。第２の回路ピッチの最小値ｂの第１の平均厚みに対する割合は０．５０以下であることが好ましく、０．４０以下であることがより好ましく、０．３０以下であることがさらに好ましい。本開示の回路シートによれば、第２の回路ピッチの最小値ｂを上記範囲としても、好適に絶縁性を確保することができる。第２の回路ピッチの最小値ｂの第１の平均厚みに対する割合は０．０５以上であってもよい。 In one embodiment, the minimum value b of the second circuit pitch is smaller than the first average thickness. The ratio of the minimum value b of the second circuit pitch to the first average thickness is preferably 0.50 or less, more preferably 0.40 or less, and further preferably 0.30 or less. According to the circuit sheet of the present disclosure, even if the minimum value b of the second circuit pitch is set in the above range, the insulating property can be suitably ensured. The ratio of the minimum value b of the second circuit pitch to the first average thickness may be 0.05 or more.
　本開示の回路シートによれば、第２の回路ピッチの最小値ｂを第１の回路ピッチの最小値ａよりも小さくすることができ、回路シートの小型化が可能である。 According to the circuit sheet of the present disclosure, the minimum value b of the second circuit pitch can be made smaller than the minimum value a of the first circuit pitch, and the circuit sheet can be miniaturized.
　回路の幅及び長さは特に制限されず、これを用いて製造される回路基板の用途等に応じて適宜選択できる。 The width and length of the circuit are not particularly limited, and can be appropriately selected according to the application of the circuit board manufactured using the circuit board.
＜第１の回路と第２の回路との間の空間に充填されている樹脂＞
　本開示の回路シートにおいて、第１の回路と第２の回路の間の空間には樹脂が充填されている。回路の間が樹脂で充填されていることで、回路基板の耐湿信頼性が確保でき、沿面放電、部分放電、トラッキング、マイグレーション等の発生が抑制される傾向にある。 <Resin filled in the space between the first circuit and the second circuit>
In the circuit sheet of the present disclosure, the space between the first circuit and the second circuit is filled with resin. Since the space between the circuits is filled with resin, the moisture resistance and reliability of the circuit board can be ensured, and the occurrence of creepage discharge, partial discharge, tracking, migration, etc. tends to be suppressed.
　充填に用いる樹脂は、特に制限されない。例えば、エポキシ樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、ウレタン樹脂、シリコーン樹脂、不飽和ポリエステル樹脂、アクリル樹脂、イミド樹脂、アミドイミド樹脂等の熱硬化性樹脂が挙げられる。充填に用いる樹脂は、１種であっても２種以上であってもよい。電気絶縁性と接着性の観点からは、充填に用いる樹脂はエポキシ樹脂、シリコーン樹脂、アミドイミド樹脂及びウレタン樹脂からなる群から選択される少なくとも１種を含むことが好ましく、耐湿性の観点からはエポキシ樹脂、アクリル樹脂及びアミドイミド樹脂からなる群から選択される少なくとも１種を含むことが好ましい。充填に用いる樹脂は、１種のみでも２種以上であってもよい。また、充填に用いる樹脂は、必要に応じてフィラー（粉末、繊維等）などの樹脂以外の成分を含んでもよい。 The resin used for filling is not particularly limited. For example, thermosetting resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin, acrylic resin, imide resin, and amide imide resin can be mentioned. The resin used for filling may be one type or two or more types. From the viewpoint of electrical insulation and adhesiveness, the resin used for filling preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, amidimide resin and urethane resin, and from the viewpoint of moisture resistance, epoxy. It preferably contains at least one selected from the group consisting of resins, acrylic resins and amidimide resins. The resin used for filling may be only one type or two or more types. Further, the resin used for filling may contain components other than the resin such as fillers (powder, fiber, etc.), if necessary.
　第１の回路と第２の回路との間の空間を樹脂で充填する方法は、特に制限されない。具体的には、粉末等の固体状の樹脂材料を用いる方法として押出成形法、圧縮成形法、トランスファーモールド、インサート成形方法等が挙げられ、液状の樹脂材料を用いる方法として注型法、塗布法、印刷法、埋め込み法等が挙げられる。また、回路の位置ずれを抑制する観点から、仮基材上に配置された第１の回路と第２の回路の間の空間を樹脂で充填してもよい。または、絶縁層上に配置された第１の回路と第２の回路の間の空間を樹脂で充填してもよい。 The method of filling the space between the first circuit and the second circuit with resin is not particularly limited. Specific examples of the method using a solid resin material such as powder include an extrusion molding method, a compression molding method, a transfer mold, an insert molding method, and the like, and as a method using a liquid resin material, a casting method and a coating method. , Printing method, embedding method, etc. Further, from the viewpoint of suppressing the misalignment of the circuit, the space between the first circuit and the second circuit arranged on the temporary base material may be filled with resin. Alternatively, the space between the first circuit and the second circuit arranged on the insulating layer may be filled with resin.
　絶縁性保持の観点からは、充填に用いる樹脂の硬化後の線膨張率は、１０ｐｐｍ／Ｋ～５０ｐｐｍ／Ｋであることが好ましく、１２ｐｐｍ／Ｋ～４５ｐｐｍ／Ｋであることがより好ましい。樹脂部の線膨張率は、熱機械分析法によりサンプルの歪みを温度に対してプロットした場合の接線の傾きであり、サンプルのガラス転移温度以下の温度領域により測定される値である。 From the viewpoint of maintaining insulation, the linear expansion coefficient of the resin used for filling after curing is preferably 10 ppm / K to 50 ppm / K, and more preferably 12 ppm / K to 45 ppm / K. The coefficient of linear expansion of the resin portion is the slope of the tangent line when the strain of the sample is plotted against the temperature by the thermomechanical analysis method, and is a value measured in a temperature region equal to or lower than the glass transition temperature of the sample.
　一実施形態において、第１の回路と第２の回路とは水平方向に配置され、当該第１の回路と第２の回路の間の空間に樹脂が充填されたシートを構成する。また、一実施形態において、図１に示される回路シートの例のように、第１の回路の一方の面と第２の回路の一方の面とが同一平面上に存在するように第１の回路及び第２の回路が配置されており、当該第１の回路と当該第２の回路との間の空間に樹脂が充填される。シートを構成するために、第１の回路の各回路部材間及び第２の回路の各回路部材間にも樹脂が充填される。樹脂は、第１の回路と第２の回路の間の空間に加え、第１の回路及び／又は第２の回路の外側に配置されていてもよい。 In one embodiment, the first circuit and the second circuit are arranged in the horizontal direction, and form a sheet in which the space between the first circuit and the second circuit is filled with resin. Further, in one embodiment, as in the example of the circuit sheet shown in FIG. 1, the first surface is such that one surface of the first circuit and one surface of the second circuit are coplanar. A circuit and a second circuit are arranged, and the space between the first circuit and the second circuit is filled with resin. In order to form a sheet, resin is also filled between each circuit member of the first circuit and between each circuit member of the second circuit. The resin may be arranged outside the first circuit and / or the second circuit in addition to the space between the first circuit and the second circuit.
　充填されている樹脂の量は、第１の回路と第２の回路の間の空間の少なくとも一部に樹脂が充填されており、当該樹脂を介して第１の回路と第２の回路とが連結されてシート状となる量である限り、特に制限されない。例えば、充填されている樹脂の厚みは第１の回路の厚みと同じ厚みであってもよく、第１の回路の厚みより小さくてもよく、第１の回路の厚みより大きくてもよい。充填されている樹脂の厚みは第１の回路の厚みと同じ厚みであるか、第１の回路の厚みより大きいことが好ましい。充填されている樹脂の厚みが第１の回路の厚みより大きいとき、第１の回路の厚みを越える樹脂部分を後述の絶縁層として機能させてもよい。 As for the amount of resin to be filled, at least a part of the space between the first circuit and the second circuit is filled with resin, and the first circuit and the second circuit are connected to each other through the resin. The amount is not particularly limited as long as it is connected to form a sheet. For example, the thickness of the filled resin may be the same as the thickness of the first circuit, may be smaller than the thickness of the first circuit, or may be larger than the thickness of the first circuit. The thickness of the filled resin is preferably the same as the thickness of the first circuit or larger than the thickness of the first circuit. When the thickness of the filled resin is larger than the thickness of the first circuit, the resin portion exceeding the thickness of the first circuit may function as an insulating layer described later.
　充填されている樹脂の厚みが第１の回路の厚みより小さいとき、回路シートに後述の絶縁層を別途設ける場合には、回路シートを絶縁層上に配置する際に加圧し、充填した樹脂中に空隙が生じないようにすることが好ましい。回路シートに絶縁層を設ける際に加える圧力の分布を平均化し、絶縁性の不十分な箇所の発生を抑制する観点からは、充填されている樹脂の厚みは第１の回路の厚みと同じであるか、第１の回路より大きいことが好ましい。 When the thickness of the filled resin is smaller than the thickness of the first circuit, when the circuit sheet is separately provided with the insulating layer described later, pressure is applied when the circuit sheet is placed on the insulating layer, and the filled resin is used. It is preferable that no voids are formed in the plastic. The thickness of the filled resin is the same as the thickness of the first circuit from the viewpoint of averaging the distribution of the pressure applied when providing the insulating layer on the circuit sheet and suppressing the occurrence of places with insufficient insulation. It is preferably present or larger than the first circuit.
＜絶縁層＞
　回路シートは、一方の面に存在する絶縁層をさらに含んでいてもよい。絶縁層は、回路基板を作製したときに回路と基板との間に存在して絶縁を担う部位である。絶縁層は層状の部材により構成される層であってもよく、第１の回路と第２の回路との間の空間に充填される樹脂と一体となっている樹脂部分であってもよい。絶縁層は、基板に回路シートを配置して回路基板を作製する前に回路シートに設けられている層であってもよく、基板に回路シートを配置するときに並行して設けられる層であってもよい。 <Insulation layer>
The circuit sheet may further include an insulating layer present on one side. The insulating layer is a portion that exists between the circuit and the substrate when the circuit board is manufactured and is responsible for insulation. The insulating layer may be a layer composed of layered members, or may be a resin portion integrated with a resin filled in the space between the first circuit and the second circuit. The insulating layer may be a layer provided on the circuit sheet before the circuit board is arranged on the substrate to manufacture the circuit board, or is a layer provided in parallel when the circuit sheet is arranged on the substrate. You may.
　絶縁層の材質は、特に制限されない。例えば、エポキシ樹脂、フェノール樹脂、ユリア樹脂、メラミン樹脂、ウレタン樹脂、シリコーン樹脂、不飽和ポリエステル樹脂、アクリル樹脂、イミド樹脂、アミドイミド樹脂等の熱硬化性樹脂が挙げられる。耐熱性の観点からは、絶縁層の材質としてはエポキシ樹脂が好ましい。電気絶縁性と接着性の観点からは、充填に用いる樹脂はエポキシ樹脂、シリコーン樹脂、アミドイミド樹脂及びウレタン樹脂からなる群から選択される少なくとも１種を含むことが好ましく、耐湿性の観点からはエポキシ樹脂、アクリル樹脂及びアミドイミド樹脂からなる群から選択される少なくとも１種を含むことが好ましい。充填に用いる樹脂は、１種のみでも２種以上であってもよい。また、充填に用いる樹脂は、必要に応じてフィラー（粉末、繊維等）などの樹脂以外の成分を含んでもよい。
　なお、絶縁層の材質は、上述した第１の回路と第２の回路との間の空間に充填されている樹脂と同じであっても異なってもよい。 The material of the insulating layer is not particularly limited. For example, thermosetting resins such as epoxy resin, phenol resin, urea resin, melamine resin, urethane resin, silicone resin, unsaturated polyester resin, acrylic resin, imide resin, and amide imide resin can be mentioned. From the viewpoint of heat resistance, epoxy resin is preferable as the material of the insulating layer. From the viewpoint of electrical insulation and adhesiveness, the resin used for filling preferably contains at least one selected from the group consisting of epoxy resin, silicone resin, amidimide resin and urethane resin, and from the viewpoint of moisture resistance, epoxy. It preferably contains at least one selected from the group consisting of resins, acrylic resins and amidimide resins. The resin used for filling may be only one type or two or more types. Further, the resin used for filling may contain components other than the resin such as fillers (powder, fiber, etc.), if necessary.
The material of the insulating layer may be the same as or different from the resin filled in the space between the first circuit and the second circuit described above.
　絶縁層の形成には樹脂組成物を用いてもよい。樹脂組成物の組成は特に制限されず、例えば上述の熱硬化性樹脂、硬化剤、フィラー、及び必要に応じてその他の成分を含有する樹脂組成物を用いることができる。樹脂組成物は２５℃で固体であっても液状であってもよい。 A resin composition may be used for forming the insulating layer. The composition of the resin composition is not particularly limited, and for example, a resin composition containing the above-mentioned thermosetting resin, curing agent, filler, and if necessary, other components can be used. The resin composition may be solid or liquid at 25 ° C.
　樹脂組成物に含まれてもよい硬化剤の種類は特に制限されず、酸無水物系硬化剤、アミン系硬化剤、フェノール系硬化剤、メルカプタン系硬化剤等の重付加型硬化剤、イミダゾール等の潜在性硬化剤などが挙げられる。耐熱性及び密着性の観点からは、アミン系硬化剤又はフェノール系硬化剤が好ましい。保存安定性の観点からは、フェノール系硬化剤が好ましい。硬化剤は１種を単独で用いても２種類以上を併用して用いてもよい。 The type of curing agent that may be contained in the resin composition is not particularly limited, and a heavy addition type curing agent such as an acid anhydride type curing agent, an amine type curing agent, a phenol type curing agent, a mercaptan type curing agent, imidazole and the like. Potential hardeners and the like. From the viewpoint of heat resistance and adhesion, an amine-based curing agent or a phenol-based curing agent is preferable. From the viewpoint of storage stability, a phenolic curing agent is preferable. One type of curing agent may be used alone, or two or more types may be used in combination.
　樹脂組成物に含まれてもよいフィラーの材質は特に制限されず、熱伝導性フィラーであることが好ましい。フィラーは非導電性であることが好ましい。非導電性のフィラーを使用すると、絶縁性の低下を抑制できる傾向にある。 The material of the filler that may be contained in the resin composition is not particularly limited, and is preferably a thermally conductive filler. The filler is preferably non-conductive. The use of a non-conductive filler tends to suppress a decrease in insulating property.
　非導電性のフィラーとして具体的には、酸化アルミニウム（アルミナ）、酸化マグネシウム、窒化アルミニウム、窒化ホウ素、窒化ケイ素、シリカ（酸化ケイ素）、水酸化アルミニウム、硫酸バリウム等が挙げられる。なかでも熱伝導率の観点から、フィラーは、酸化アルミニウム（アルミナ）、窒化ホウ素、酸化マグネシウム、窒化アルミニウム及びシリカ（酸化ケイ素）からなる群より選択される少なくとも１種であることが好ましく、窒化ホウ素及び酸化アルミニウム（アルミナ）からなる群より選択される少なくとも１種であることがより好ましい。フィラーは、１種を単独で用いても２種以上を併用してもよい。なお、「フィラーを２種類以上併用する」とは、例えば、同じ成分で平均粒子径が異なるフィラーを２種類以上用いる場合、平均粒子径が同じで成分の異なるフィラーを２種類以上用いる場合並びに平均粒子径及び種類の異なるフィラーを２種類以上用いる場合が挙げられる。 Specific examples of the non-conductive filler include aluminum oxide (alumina), magnesium oxide, aluminum nitride, boron nitride, silicon nitride, silica (silicon oxide), aluminum hydroxide, and barium sulfate. Among them, from the viewpoint of thermal conductivity, the filler is preferably at least one selected from the group consisting of aluminum oxide (alumina), boron nitride, magnesium oxide, aluminum nitride and silica (silicon oxide), and boron nitride. And at least one selected from the group consisting of aluminum oxide (alumina) is more preferable. As the filler, one type may be used alone or two or more types may be used in combination. “Use of two or more types of fillers” means, for example, when two or more types of fillers having the same component but different average particle diameters are used, when two or more types of fillers having the same average particle size but different components are used, and when the average. There are cases where two or more types of fillers having different particle sizes and types are used.
　フィラーの形状は特に限定されず、粉状、球状、繊維状等が挙げられる。成形時の流動性及び金型摩耗性の点からは、球形が好ましい。 The shape of the filler is not particularly limited, and examples thereof include powder, spherical, and fibrous. From the viewpoint of fluidity during molding and mold wearability, a spherical shape is preferable.
　樹脂組成物に含まれてもよいその他の成分としては、硬化促進剤、シランカップリング剤、応力緩和剤、着色剤、難燃剤、消泡剤、溶剤等が挙げられる。樹脂組成物に含まれてもよい各成分は、それぞれ、１種を単独で用いても２種以上を併用してもよい。 Other components that may be contained in the resin composition include curing accelerators, silane coupling agents, stress relaxation agents, colorants, flame retardants, defoamers, solvents and the like. As for each component that may be contained in the resin composition, one type may be used alone or two or more types may be used in combination.
　絶縁層の厚みは特に制限されず、回路基板の用途等に応じて選択できる。十分な絶縁性を確保する観点からは、絶縁層の厚みは厚いほど好ましい。例えば、絶縁層の厚みは７０μｍ以上であることが好ましく、９０μｍ以上であることがより好ましく、１１０μｍ以上であることがさらに好ましい。十分な放熱性を確保する観点からは、絶縁層の厚みは薄いほど好ましい。例えば、絶縁層の厚みは２３０μｍ以下であることが好ましく、２１０μｍ以下であることがより好ましく、１９０μｍ以下であることがさらに好ましい。
　絶縁層の厚みは、第１の回路の厚みよりも小さいことが好ましい。後述のように、回路シートの基板と対向する面と、基板の回路シートと対向する面の双方に絶縁層を配置する場合は、双方の絶縁層の厚みの合計を上記絶縁層の厚みとする。絶縁層の厚みは、回路シートにおいて絶縁層を鉛直下方向に配置したときの、第１の回路の底面と絶縁層の底面との距離とする。絶縁層の厚みが場所によって異なる場合には、絶縁層の厚みは任意の５箇所以上で測定したときの平均厚みとする。 The thickness of the insulating layer is not particularly limited and can be selected according to the application of the circuit board and the like. From the viewpoint of ensuring sufficient insulating properties, the thicker the insulating layer, the more preferable. For example, the thickness of the insulating layer is preferably 70 μm or more, more preferably 90 μm or more, and further preferably 110 μm or more. From the viewpoint of ensuring sufficient heat dissipation, it is preferable that the thickness of the insulating layer is thin. For example, the thickness of the insulating layer is preferably 230 μm or less, more preferably 210 μm or less, and even more preferably 190 μm or less.
The thickness of the insulating layer is preferably smaller than the thickness of the first circuit. As will be described later, when the insulating layers are arranged on both the surface of the circuit sheet facing the substrate and the surface of the substrate facing the circuit sheet, the total thickness of both insulating layers is defined as the thickness of the insulating layer. .. The thickness of the insulating layer is the distance between the bottom surface of the first circuit and the bottom surface of the insulating layer when the insulating layer is arranged vertically downward in the circuit sheet. If the thickness of the insulating layer differs depending on the location, the thickness of the insulating layer shall be the average thickness measured at any five or more locations.
　回路シートの一方の面に絶縁層を配置する方法は特に制限されない。例えば、（１）回路シートと基板との間に樹脂シートを配置し、必要に応じて硬化処理を行う方法、（２）絶縁層形成用の樹脂組成物を回路シート及び基板の少なくとも一方の表面に付与し、必要に応じて硬化処理を行う方法、（３）第１の回路と第２の回路との間の空間に樹脂を充填する際に並行して絶縁層を形成する方法、（４）回路シートと基板の間の空間に樹脂を充填して絶縁層を形成する方法、等が挙げられる。絶縁性の向上の観点からは、回路シートと基板との間に樹脂シートを配置する方法が好ましい。作業性の観点からは、第１の回路と第２の回路との間の空間に樹脂を充填する際に並行して絶縁層を形成する方法が好ましい。 The method of arranging the insulating layer on one surface of the circuit sheet is not particularly limited. For example, (1) a method of arranging a resin sheet between a circuit sheet and a substrate and performing a curing treatment as necessary, and (2) applying a resin composition for forming an insulating layer to at least one surface of the circuit sheet and the substrate. (3) A method of forming an insulating layer in parallel when filling the space between the first circuit and the second circuit with a resin, (4) ) A method of filling the space between the circuit sheet and the substrate with a resin to form an insulating layer, and the like. From the viewpoint of improving the insulating property, a method of arranging the resin sheet between the circuit sheet and the substrate is preferable. From the viewpoint of workability, a method of forming an insulating layer in parallel when filling the space between the first circuit and the second circuit with the resin is preferable.
　上記（１）のように、樹脂シートを用いる場合、樹脂シートは樹脂組成物を用いて作製したものであってもよく、既存のものであってもよい。 When a resin sheet is used as described in (1) above, the resin sheet may be made by using a resin composition or may be an existing one.
　樹脂シートは回路シートの基板に対向する面に貼り付けてもよく、基板の回路シートに対向する面に貼り付けてもよく、双方に貼り付けてもよい。回路シートと基板に対する密着性を高め、絶縁信頼性をより向上させる観点からは、回路シートの基板と対向する面と、基板の回路シートと対向する面の双方に樹脂シートを配置し、双方の樹脂シートを接合させることが好ましい。この場合、双方の樹脂シートの材質及び厚さはそれぞれ同じであっても異なっていてもよい。樹脂シートの材質及び厚さは、回路シート及び基材の状態（絶縁層に対する接着性等）に応じて設定できる。 The resin sheet may be attached to the surface of the circuit sheet facing the circuit sheet, may be attached to the surface of the substrate facing the circuit sheet, or may be attached to both sides. From the viewpoint of improving the adhesion between the circuit sheet and the substrate and further improving the insulation reliability, resin sheets are arranged on both the surface of the circuit board facing the substrate and the surface of the substrate facing the circuit sheet of both. It is preferable to join the resin sheets. In this case, the materials and thicknesses of both resin sheets may be the same or different. The material and thickness of the resin sheet can be set according to the state of the circuit sheet and the base material (adhesiveness to the insulating layer, etc.).
　絶縁層は、半硬化の状態の樹脂シートを用いて形成してもよい。例えば、半硬化（Ｂステージ）の状態の樹脂シートを回路シートと基板との間に配置し、後硬化処理を行って硬化した状態としてもよい。後硬化処理の方法及び条件は特に制限されず、樹脂シートの樹脂組成等に応じて設定することができる。 The insulating layer may be formed by using a resin sheet in a semi-cured state. For example, a semi-cured (B stage) resin sheet may be placed between the circuit sheet and the substrate and post-cured to be cured. The method and conditions of the post-curing treatment are not particularly limited, and can be set according to the resin composition of the resin sheet and the like.
　半硬化の状態の樹脂シートを用いて絶縁層を形成する場合、回路シート及び基板の少なくとも一方に対する樹脂シートの接着性を高める観点からは、半硬化した樹脂シートの粘度が、常温（２５℃）においては１０４Ｐａ・ｓ～１０９Ｐａ・ｓであり、１００℃においては１０２Ｐａ・ｓ～１０７Ｐａ・ｓであり、常温（２５℃）から１００℃への温度変化により、粘度が０．０００１％～５０％低下するものであることが好ましい。また、硬化後の絶縁層は、加温によっても溶融しないことが好ましい。なお、上記粘度は、動的粘弾性測定（周波数１ヘルツ、荷重４０ｇ、昇温速度３℃／分）によって測定されうるものである。 When the insulating layer is formed using the semi-cured resin sheet, the viscosity of the semi-cured resin sheet is at room temperature (25 ° C.) from the viewpoint of enhancing the adhesiveness of the resin sheet to at least one of the circuit sheet and the substrate. in a the 10 4 Pa · s ~ 10 9 Pa · s, in the 100 ° C. is 10 2 Pa · s ~ 10 7 Pa · s, the temperature change from room temperature (25 ° C.) to 100 ° C., viscosity It is preferably reduced by 0.0001% to 50%. Further, it is preferable that the cured insulating layer does not melt even by heating. The viscosity can be measured by dynamic viscoelasticity measurement (frequency 1 Hz, load 40 g, heating rate 3 ° C./min).
　回路シートと樹脂シートとの密着性を高める観点からは、回路シートに樹脂シートを接着する際に加熱及び加圧の少なくとも一方を行うことが好ましい。樹脂シートの硬化状態は特に制限されない。回路シートに樹脂シートを接着する際に加熱する場合、加熱の温度は特に制限されない。例えば、５０℃～２５０℃の範囲から選択することができる。回路シートを樹脂シート上に配置する際に加圧する場合、加圧の圧力は特に制限されない。例えば、０．１ＭＰａ～３０ＭＰａの範囲から選択することができる。 From the viewpoint of improving the adhesion between the circuit sheet and the resin sheet, it is preferable to perform at least one of heating and pressurization when adhering the resin sheet to the circuit sheet. The cured state of the resin sheet is not particularly limited. When heating when the resin sheet is adhered to the circuit sheet, the heating temperature is not particularly limited. For example, it can be selected from the range of 50 ° C. to 250 ° C. When pressurizing when arranging the circuit sheet on the resin sheet, the pressurizing pressure is not particularly limited. For example, it can be selected from the range of 0.1 MPa to 30 MPa.
　上記（２）のように、樹脂組成物を付与して絶縁層を配置する場合、その方法は特に制限されない。例えば、ディスペンス方式、スプレー方式、グラビア方式、スクリーン印刷、メタルマスクを用いたスクリーン印刷、転写等により、回路シート及び基板の少なくとも一方の表面に樹脂組成物を付与することで行うことができる。 When the resin composition is applied and the insulating layer is arranged as in (2) above, the method is not particularly limited. For example, it can be carried out by applying the resin composition to at least one surface of the circuit sheet and the substrate by a dispense method, a spray method, a gravure method, screen printing, screen printing using a metal mask, transfer, or the like.
　樹脂組成物を付与して絶縁層を配置する場合、液状の樹脂組成物を用いることが好ましい。液状の樹脂組成物を用いると、回路シート及び基板の少なくとも一方の表面がうねり、凹凸等によって平坦でない場合にも絶縁性に優れる絶縁層が得られる傾向にある。
　本開示において樹脂組成物が「液状である」という場合、少なくとも樹脂組成物を回路シート又は基板に付与する時点において液状であることを意味する。液状の程度は特に制限されず、回路シート及び基板の少なくとも一方の表面の状態、樹脂組成物を付与する方法等に応じて選択できる。例えば、樹脂組成物を回路シートに付与する際の粘度が１０Ｐａ・ｓ以下であることが好ましい。樹脂組成物の粘度は、樹脂組成物を回路シートに付与する際の温度（例えば、１８℃～２３℃のいずれか）において、Ｅ型粘度計（例えば、東機産業株式会社、ＴＶ－３３）を用いて５回転／分（ｒｐｍ）で測定される値とする。 When the resin composition is applied and the insulating layer is arranged, it is preferable to use a liquid resin composition. When a liquid resin composition is used, an insulating layer having excellent insulating properties tends to be obtained even when at least one surface of the circuit sheet and the substrate is not flat due to waviness, unevenness, or the like.
When the resin composition is "liquid" in the present disclosure, it means that it is liquid at least at the time when the resin composition is applied to the circuit sheet or the substrate. The degree of liquidity is not particularly limited, and can be selected depending on the state of at least one surface of the circuit sheet and the substrate, the method of applying the resin composition, and the like. For example, it is preferable that the viscosity when the resin composition is applied to the circuit sheet is 10 Pa · s or less. The viscosity of the resin composition is determined by an E-type viscometer (for example, Toki Sangyo Co., Ltd., TV-33) at a temperature (for example, any of 18 ° C. to 23 ° C.) when the resin composition is applied to a circuit sheet. Is a value measured at 5 rpm (rpm).
　樹脂組成物を付与して絶縁層を配置する場合、樹脂組成物は溶媒等の粘度を調節する成分を含んでいてもよい。樹脂組成物が溶媒を含む場合は、樹脂組成物を回路シート又は基板の上に付与した後に溶媒を乾燥等により除去してもよい。溶媒を除去した後の溶媒の含有率は、樹脂組成物全体の２質量％以下であることが好ましく、１質量％以下であることがより好ましい。 When the resin composition is applied and the insulating layer is arranged, the resin composition may contain a component for adjusting the viscosity such as a solvent. When the resin composition contains a solvent, the solvent may be removed by drying or the like after the resin composition is applied onto a circuit sheet or a substrate. The content of the solvent after removing the solvent is preferably 2% by mass or less, and more preferably 1% by mass or less of the entire resin composition.
　上記（３）のように、第１の回路と第２の回路との間の空間に樹脂を充填する際に並行して絶縁層を形成する場合、及び（４）のように回路シートと基板の間の空間に樹脂を充填して絶縁層を形成する場合、その方法としては、第１の回路と第２の回路との間の空間に樹脂を充填する方法として前述した方法が挙げられる。すなわち、粉末等の固体状の樹脂組成物を用いる方法として押出成形法、圧縮成形法、トランスファーモールド、インサート成形方法等が挙げられ、液状の樹脂組成物を用いる方法として注型法、塗布法、印刷法、埋め込み法等が挙げられる。 When an insulating layer is formed in parallel when filling the space between the first circuit and the second circuit with resin as in (3) above, and when the circuit sheet and substrate are formed as in (4). When the space between the circuits is filled with resin to form an insulating layer, the method described above can be mentioned as a method of filling the space between the first circuit and the second circuit with resin. That is, examples of a method using a solid resin composition such as powder include an extrusion molding method, a compression molding method, a transfer mold, an insert molding method, and the like, and methods using a liquid resin composition include a casting method and a coating method. Examples include a printing method and an embedding method.
≪回路基板≫
　本開示の一実施形態における回路基板は、前述の回路シートと、基板と、前記回路シート及び前記基板の間に存在する絶縁層と、を含む。
　本開示のさらなる一実施形態における回路基板は、一方の面に存在する絶縁層を含む回路シートと、前記絶縁層の、第１の回路及び第２の回路とは反対側の面に設けられる基板と、を含む。 ≪Circuit board≫
The circuit board in one embodiment of the present disclosure includes the circuit board described above, the board, and an insulating layer existing between the circuit sheet and the board.
A circuit board according to a further embodiment of the present disclosure includes a circuit sheet including an insulating layer existing on one surface, and a substrate provided on the surface of the insulating layer opposite to the first circuit and the second circuit. And, including.
　以下、図８を参照して本開示の回路基板の具体例を説明する。図８は、本開示の回路基板の一実施形態の断面図を表す概略図である。図８において、回路基板１２は、第１の回路１と、第２の回路２と、第１の回路１と第２の回路２との間の空間に充填されている樹脂３と、絶縁層４と、を有する。絶縁層４の、第１の回路１及び第２の回路２の反対側には基板５が設けられている。なお、図８で示される樹脂３と絶縁層４は同一の部材でもよい。
　以下、回路基板の説明において符号は省略する。 Hereinafter, a specific example of the circuit board of the present disclosure will be described with reference to FIG. FIG. 8 is a schematic view showing a cross-sectional view of an embodiment of the circuit board of the present disclosure. In FIG. 8, the circuit board 12 includes a resin 3 filled in a space between a first circuit 1, a second circuit 2, a first circuit 1 and a second circuit 2, and an insulating layer. 4 and. A substrate 5 is provided on the opposite side of the first circuit 1 and the second circuit 2 of the insulating layer 4. The resin 3 and the insulating layer 4 shown in FIG. 8 may be the same member.
Hereinafter, reference numerals will be omitted in the description of the circuit board.
　基板の材質は特に制限されず、銅、アルミニウム、タングステン銅、モリブデン銅等の銅合金、ニッケルめっき銅などが挙げられる。基板の種類は特に制限されず、ヒートスプレッダ、ヒートシンク等の放熱機能を有する部材、空気又は水の流路を持ったケース、金属箔、フィラー樹脂コンポジットなどであってもよい。基板の表面は平滑であってもよく、絶縁層との接着性を向上させるための粗化処理が施されていてもよい。 The material of the substrate is not particularly limited, and examples thereof include copper alloys such as copper, aluminum, tungsten copper, and molybdenum copper, and nickel-plated copper. The type of the substrate is not particularly limited, and may be a member having a heat dissipation function such as a heat spreader or a heat sink, a case having an air or water flow path, a metal foil, a filler resin composite, or the like. The surface of the substrate may be smooth, and may be roughened to improve the adhesiveness with the insulating layer.
　基板を設ける方法は特に制限されない。例えば、前述したように、樹脂シート又は樹脂組成物を用いて絶縁層を配置する際に並行して基板が配置されてもよい。また、基板上に、既に絶縁層が設けられている回路シートを配置してもよい。絶縁層が設けられた基板上に回路シートを配置してもよい。 The method of providing the substrate is not particularly limited. For example, as described above, the substrate may be arranged in parallel when the insulating layer is arranged using the resin sheet or the resin composition. Further, a circuit sheet having an insulating layer already provided may be arranged on the substrate. The circuit sheet may be arranged on a substrate provided with an insulating layer.
≪半導体装置≫
　本開示の一実施形態における半導体装置は、前述した回路基板と半導体素子とを備える。本実施形態における回路基板及び半導体装置は、大電流化及び高密度実装に適している。 ≪Semiconductor device≫
The semiconductor device according to the embodiment of the present disclosure includes the circuit board and the semiconductor element described above. The circuit board and semiconductor device in this embodiment are suitable for high current and high density mounting.
　半導体素子としては、能動素子、受動素子等の素子が挙げられる。能動素子としては、半導体チップ、トランジスタ、ダイオード、サイリスタ等が挙げられる。受動素子としては、コンデンサ、抵抗体、コイル等が挙げられる。また、これらの能動素子、受動素子等の素子を複数個内蔵しモジュール化した電子部品にも適用できる。 Examples of semiconductor elements include elements such as active elements and passive elements. Examples of the active element include semiconductor chips, transistors, diodes, thyristors and the like. Examples of the passive element include a capacitor, a resistor, a coil and the like. It can also be applied to electronic components that are modularized by incorporating a plurality of elements such as these active elements and passive elements.
≪回路シートの製造方法≫
　本開示の一実施形態における回路シートの製造方法は、仮基材上に配置された、第１の平均厚みを有する第１の回路と、前記第１の平均厚みより小さい第２の平均厚みを有する第２の回路と、の間の空間に樹脂を充填することを含む。本実施形態の回路シートの製造方法は、必要に応じてその他の工程を有していてもよい。樹脂の充填方法は、回路シートの説明において前述した通りである。また、本実施形態に係る製造方法によって製造される回路シートの詳細は前述の回路シートの詳細を適用することができる。 ≪Manufacturing method of circuit sheet≫
In the method of manufacturing a circuit sheet according to an embodiment of the present disclosure, a first circuit having a first average thickness and a second average thickness smaller than the first average thickness are arranged on a temporary base material. It includes filling the space between the second circuit having the resin. The circuit sheet manufacturing method of the present embodiment may include other steps, if necessary. The resin filling method is as described above in the description of the circuit sheet. Further, the above-mentioned details of the circuit sheet can be applied to the details of the circuit sheet manufactured by the manufacturing method according to the present embodiment.
　仮基材上に第１の回路及び第２の回路を配置する方法は特に制限されない。例えば、仮基材上に保持した金属部材をエッチング加工し、回路を形成してもよい。また、打抜き加工、レーザー加工、エッチング加工等の公知の方法から回路を形成した後に、仮基材上に回路を配置してもよい。仮基材上に保持した金属部材をエッチング加工する場合、金属部材の両面（すなわち、２つの主面）からエッチングを行うと、例えば絶縁層上に配置した金属部材をエッチング加工して回路を形成する場合と比較して、金属部材の端部に形成されるテーパー部分の長さが小さくなる。上記実施形態に係る回路シートの製造方法によれば、回路ピッチを小さくすることができ、回路基板の高密度実装化、及び小型化に対応しつつ、大電流化を達成することができる。 The method of arranging the first circuit and the second circuit on the temporary base material is not particularly limited. For example, the metal member held on the temporary base material may be etched to form a circuit. Further, the circuit may be arranged on the temporary base material after the circuit is formed by a known method such as punching, laser processing, or etching. When etching a metal member held on a temporary base material, if etching is performed from both sides (that is, two main surfaces) of the metal member, for example, the metal member arranged on the insulating layer is etched to form a circuit. The length of the tapered portion formed at the end of the metal member is smaller than that in the case of According to the method for manufacturing a circuit sheet according to the above embodiment, the circuit pitch can be reduced, and a large current can be achieved while corresponding to high-density mounting and miniaturization of the circuit board.
　また、上記実施形態に係る回路シートの製造方法では、樹脂を充填する際に仮基材に回路が仮固定されているため、回路の位置ずれが生じて寸法安定性が損なわれることを抑制できる。その結果、絶縁信頼性に優れる回路基板を製造できる傾向にある。 Further, in the method for manufacturing a circuit sheet according to the above embodiment, since the circuit is temporarily fixed to the temporary base material when the resin is filled, it is possible to prevent the circuit from being displaced and the dimensional stability from being impaired. .. As a result, there is a tendency that a circuit board having excellent insulation reliability can be manufactured.
　本開示において仮基材とは、仮基材上に配置された第１の回路と第２の回路の間との空間に樹脂を充填する前に回路を仮固定することができ、樹脂を充填した後に回路から除去できるものをいう。ここで、回路が仮固定されているとは、回路が仮基材との接触によって相対的な位置関係を維持していることをいい、必ずしも回路が完全に動かないことを意味するものではない。 In the present disclosure, the temporary base material means that the circuit can be temporarily fixed before filling the space between the first circuit and the second circuit arranged on the temporary base material with the resin, and the temporary base material is filled with the resin. It means something that can be removed from the circuit after it is done. Here, the term "temporarily fixed" means that the circuit maintains a relative positional relationship due to contact with the temporary base material, and does not necessarily mean that the circuit does not move completely. ..
　仮基材としては、樹脂フィルム等が挙げられる。仮基材に使用できる樹脂フィムルとしては、支持フィルムと支持フィルム上に形成される接着層とを有する樹脂フィルム等が挙げられる。回路の仮固定は、樹脂フィルムの接着層に回路を接触させ、必要に応じて圧力及び温度を加えることによって行うことができる。樹脂フィルムは少なくとも回路と接触する側の面に接着層を有すればよい。樹脂の充填後に回路から除去しやすい観点から、樹脂フィルムは可とう性を有することが好ましい。 Examples of the temporary base material include a resin film and the like. Examples of the resin film that can be used as the temporary base material include a resin film having a support film and an adhesive layer formed on the support film. Temporary fixing of the circuit can be performed by bringing the circuit into contact with the adhesive layer of the resin film and applying pressure and temperature as necessary. The resin film may have an adhesive layer at least on the surface on the side in contact with the circuit. The resin film is preferably flexible from the viewpoint of being easily removed from the circuit after filling with the resin.
　樹脂フィルムの支持フィルムの材質は特に制限されず、芳香族ポリイミド、芳香族ポリアミド、芳香族ポリスルホン、芳香族ポリエーテルスルホン、ポリフェニレンスルフィド、芳香族ポリエーテルケトン、ポリアリレート、芳香族ポリエーテルエーテルケトン及びポリエチレンテレフタレートからなる群より選択されることが好ましい。 The material of the supporting film of the resin film is not particularly limited, and the material of aromatic polyimide, aromatic polyamide, aromatic polysulfone, aromatic polyethersulfone, polyphenylene sulfide, aromatic polyetherketone, polyarylate, aromatic polyetheretherketone and It is preferably selected from the group consisting of polyethylene terephthalate.
　接着層には、接着剤が付与されていてもよい。接着剤としては、アクリル系接着剤、ウレタン接着剤、シリコーン系接着剤等が挙げられる。本開示において接着剤とは物体の間に介在することによって物体を結合することのできる物質をいう。 An adhesive may be applied to the adhesive layer. Examples of the adhesive include acrylic adhesives, urethane adhesives, silicone adhesives and the like. In the present disclosure, the adhesive refers to a substance capable of binding an object by interposing between the objects.
　樹脂フィルムの厚さは特に制限されず、１０μｍ～１５０μｍであってもよい。樹脂フィルムの長さ及び幅は回路の形状によって適宜調整することができる。 The thickness of the resin film is not particularly limited and may be 10 μm to 150 μm. The length and width of the resin film can be appropriately adjusted depending on the shape of the circuit.
　上記実施形態に係る回路シートの製造方法において、仮基材上に形成された回路シートから仮基材を除去する場合、その方法は特に制限されない。例えば、仮基材として可とう性を有するフィルムを使用し、これを回路から剥離することで行ってもよい。 In the method for manufacturing a circuit sheet according to the above embodiment, when the temporary base material is removed from the circuit sheet formed on the temporary base material, the method is not particularly limited. For example, a flexible film may be used as a temporary base material, and this may be peeled off from the circuit.
　本開示のさらなる一実施形態における回路シートの製造方法は、第１の平均厚みを有する第１の回路と、前記第１の平均厚みより小さい第２の平均厚みを有する第２の回路と、前記第１の回路と前記第２の回路との間の空間に充填されている樹脂と、を含む回路シートの一方の面に絶縁層を配置することを含む。本実施形態の回路シートの製造方法は、必要に応じてその他の工程を有していてもよい。絶縁層の配置方法は、回路シートの説明において前述した通りである。また、本実施形態に係る製造方法によって製造される回路シートの詳細は前述の回路シートの詳細を適用することができる。 A method of manufacturing a circuit sheet according to a further embodiment of the present disclosure includes a first circuit having a first average thickness, a second circuit having a second average thickness smaller than the first average thickness, and the above-mentioned. It includes arranging an insulating layer on one surface of a circuit sheet containing a resin that fills the space between the first circuit and the second circuit. The circuit sheet manufacturing method of the present embodiment may include other steps, if necessary. The method of arranging the insulating layer is as described above in the description of the circuit sheet. Further, the above-mentioned details of the circuit sheet can be applied to the details of the circuit sheet manufactured by the manufacturing method according to the present embodiment.
≪回路基板の製造方法≫
　本開示の一実施形態における回路基板の製造方法は、上述の回路シートと、基板と、の間に絶縁層を配置することを含む。
　本開示のさらなる一実施形態における回路基板の製造方法は、上述の回路シートの製造方法により製造された絶縁層を含む回路シートの一方の面に基板を配置することを含む。
　これらの実施形態の回路基板の製造方法は、必要に応じてその他の工程を有していてもよい。 ≪Circuit board manufacturing method≫
The method of manufacturing a circuit board according to an embodiment of the present disclosure includes arranging an insulating layer between the above-mentioned circuit sheet and the substrate.
A method of manufacturing a circuit board according to a further embodiment of the present disclosure includes arranging the substrate on one surface of a circuit sheet including an insulating layer manufactured by the method of manufacturing a circuit sheet described above.
The circuit board manufacturing method of these embodiments may include other steps, if necessary.
　以下、図面を参照して本開示の回路シート及び回路基板、並びにこれらの製造方法の一例を説明する。 Hereinafter, the circuit sheet and the circuit board of the present disclosure, and an example of the manufacturing method thereof will be described with reference to the drawings.
　図３は、金属部材をエッチング加工し、回路を形成した後の状態を概念的に示す平面図であり、図４はそのＡ－Ａ’線断面図である。図３及び図４では、厚みの大きい第１の回路１及び厚みの小さい第２の回路２が仮基材１０の上に配置された状態が示されている。図３における破線で囲まれた部分の回路が第２の回路２を表し、破線で囲まれていない部分の回路が第１の回路１を表す。第１の回路１及び第２の回路２はそれぞれ複数の回路部材からなっており、各回路部材の間には回路ピッチが存在する。第２の回路２の回路ピッチは第１の回路１の回路ピッチと比べて狭い。厚みの大きい金属部材のエッチングにより回路を形成する場合、回路の断面がテーパー状になりやすく、回路ピッチを狭くすると絶縁性の確保が困難となりやすいが、第２の回路２のように厚みが小さい回路では断面がテーパー状になることを抑制できる。このため、回路ピッチをより狭くすることができる。 FIG. 3 is a plan view conceptually showing a state after the metal member is etched to form a circuit, and FIG. 4 is a sectional view taken along line AA'. 3 and 4 show a state in which the first circuit 1 having a large thickness and the second circuit 2 having a small thickness are arranged on the temporary base material 10. The circuit of the portion surrounded by the broken line in FIG. 3 represents the second circuit 2, and the circuit of the portion not surrounded by the broken line represents the first circuit 1. The first circuit 1 and the second circuit 2 are each composed of a plurality of circuit members, and a circuit pitch exists between the circuit members. The circuit pitch of the second circuit 2 is narrower than the circuit pitch of the first circuit 1. When a circuit is formed by etching a thick metal member, the cross section of the circuit tends to be tapered, and if the circuit pitch is narrowed, it tends to be difficult to secure insulation, but the thickness is small as in the second circuit 2. In the circuit, it is possible to prevent the cross section from becoming tapered. Therefore, the circuit pitch can be narrowed.
　図５は、第１の回路１及び第２の回路２の間を樹脂３で充填した状態を概念的に示す平面図であり、図６はそのＡ－Ａ’線断面図である。 FIG. 5 is a plan view conceptually showing a state in which the space between the first circuit 1 and the second circuit 2 is filled with the resin 3, and FIG. 6 is a sectional view taken along line AA'.
　図７は、仮基材１０を除去した後の第１の回路１及び第２の回路２が、樹脂３とともに絶縁層４を介して基板５上に配置されている状態を概念的に示す平面図であり、図８はそのＡ－Ａ’線断面図である。図７及び図８では、絶縁層４の、第１の回路１及び第２の回路２とは反対側の面に基板５が配置されている。なお、図８では絶縁層４が樹脂３と別個の部材として示されているが、絶縁層４は樹脂３と一体化されていてもよい。 FIG. 7 is a plane conceptually showing a state in which the first circuit 1 and the second circuit 2 after removing the temporary base material 10 are arranged on the substrate 5 together with the resin 3 via the insulating layer 4. FIG. 8 is a sectional view taken along line AA'. In FIGS. 7 and 8, the substrate 5 is arranged on the surface of the insulating layer 4 opposite to the first circuit 1 and the second circuit 2. Although the insulating layer 4 is shown as a member separate from the resin 3 in FIG. 8, the insulating layer 4 may be integrated with the resin 3.
　本明細書に記載された全ての文献、特許出願、及び技術規格は、個々の文献、特許出願、及び技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に援用されて取り込まれる。 All documents, patent applications, and technical standards described herein are to the same extent as if the individual documents, patent applications, and technical standards were specifically and individually stated to be incorporated by reference. Incorporated and incorporated herein.
１　第１の回路
２　第２の回路
３　樹脂
４　絶縁層
５　基板
１０　仮基材
１１、２１　回路シート
１２　回路基板 1 1st circuit 2 2nd circuit 3 Resin 4 Insulation layer 5 Substrate 10 Temporary base material 11, 21 Circuit sheet 12 Circuit board

Claims (15)

  1. 　第１の平均厚みを有し、第１の回路ピッチを有する第１の回路と、
    　前記第１の平均厚みより小さい第２の平均厚みを有し、第２の回路ピッチを有する第２の回路と、
    　前記第１の回路と前記第２の回路との間の空間に充填されている樹脂と、
    を含む、回路シート。     A first circuit having a first average thickness and a first circuit pitch,
    A second circuit having a second average thickness smaller than the first average thickness and having a second circuit pitch,
    The resin filled in the space between the first circuit and the second circuit,
    Including, circuit sheet.
  2. 　前記第１の平均厚みが３５０μｍ以上である、請求項１に記載の回路シート。 The circuit sheet according to claim 1, wherein the first average thickness is 350 μm or more.
  3. 　前記第１の平均厚みに対する前記第２の平均厚みの割合が０．５０以下である、請求項１又は請求項２に記載の回路シート。 The circuit sheet according to claim 1 or 2, wherein the ratio of the second average thickness to the first average thickness is 0.50 or less.
  4. 　前記第２の回路ピッチの最小値ｂが、前記第１の平均厚みより小さい、請求項１～請求項３のいずれか１項に記載の回路シート。 The circuit sheet according to any one of claims 1 to 3, wherein the minimum value b of the second circuit pitch is smaller than the first average thickness.
  5. 　前記第２の回路ピッチの最小値ｂの前記第１の平均厚みに対する割合が０．５０以下である、請求項１～請求項４のいずれか１項に記載の回路シート。 The circuit sheet according to any one of claims 1 to 4, wherein the ratio of the minimum value b of the second circuit pitch to the first average thickness is 0.50 or less.
  6. 　前記第２の平均厚みに対する、前記第２の回路ピッチの最小値ｂの比（第２の回路ピッチの最小値ｂ／第２の平均厚み）が、０．００を超えて１．００以下の範囲内である、請求項１～請求項５のいずれか１項に記載の回路シート。 The ratio of the minimum value b of the second circuit pitch to the second average thickness (minimum value b of the second circuit pitch / second average thickness) is more than 0.00 and 1.00 or less. The circuit sheet according to any one of claims 1 to 5, which is within the range.
  7. 　前記第２の回路ピッチの最小値ｂが、前記第１の回路ピッチの最小値ａよりも小さい、請求項１～請求項６のいずれか１項に記載の回路シート。 The circuit sheet according to any one of claims 1 to 6, wherein the minimum value b of the second circuit pitch is smaller than the minimum value a of the first circuit pitch.
  8. 　一方の面に存在する絶縁層をさらに含む請求項１～請求項７のいずれか１項に記載の回路シート。 The circuit sheet according to any one of claims 1 to 7, further including an insulating layer existing on one surface.
  9. 　請求項８に記載の回路シートと、
    　前記絶縁層の、前記第１の回路及び前記第２の回路とは反対側の面に設けられる基板と、
    を含む回路基板。     The circuit sheet according to claim 8 and
    A substrate provided on the surface of the insulating layer opposite to the first circuit and the second circuit.
    Circuit board including.
  10. 　請求項１～請求項７のいずれか１項に記載の回路シートと、
    　基板と、
    　前記回路シートと前記基板との間に配置されている絶縁層と、
    を含む回路基板。     The circuit sheet according to any one of claims 1 to 7.
    With the board
    An insulating layer arranged between the circuit sheet and the substrate,
    Circuit board including.
  11. 　請求項９又は請求項１０に記載の回路基板と半導体素子とを備える半導体装置。 A semiconductor device including the circuit board according to claim 9 or claim 10 and a semiconductor element.
  12. 　仮基材上に配置された、第１の平均厚みを有する第１の回路と、前記第１の平均厚みより小さい第２の平均厚みを有する第２の回路と、の間の空間に樹脂を充填することを含む、回路シートの製造方法。 A resin is placed in the space between the first circuit having a first average thickness and the second circuit having a second average thickness smaller than the first average thickness, which are arranged on the temporary base material. A method of manufacturing a circuit sheet, including filling.
  13. 　請求項１２に記載の製造方法により製造された回路シートと、基板と、の間に絶縁層を配置することを含む、回路基板の製造方法。 A method for manufacturing a circuit board, which comprises arranging an insulating layer between the circuit sheet manufactured by the manufacturing method according to claim 12 and the board.
  14. 　第１の平均厚みを有する第１の回路と、前記第１の平均厚みより小さい第２の平均厚みを有する第２の回路と、前記第１の回路と前記第２の回路との間の空間に充填されている樹脂と、を含む回路シートの一方の面に絶縁層を配置することを含む、回路シートの製造方法。 A space between a first circuit having a first average thickness, a second circuit having a second average thickness smaller than the first average thickness, and the first circuit and the second circuit. A method of manufacturing a circuit sheet, comprising arranging an insulating layer on one surface of the circuit sheet containing the resin filled in.
  15. 　請求項１４に記載の製造方法により製造された回路シートの一方の面に基板を配置することを含む、回路基板の製造方法。 A method for manufacturing a circuit board, which comprises arranging the board on one surface of the circuit sheet manufactured by the manufacturing method according to claim 14.
PCT/JP2019/012191 2019-03-22 2019-03-22 Circuit sheet, circuit board, semiconductor device, method for manufacturing circuit sheet, and method for manufacturing circuit board WO2020194394A1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63232483A (en) * 1987-03-20 1988-09-28 古河電気工業株式会社 Molded printed wiring board
US6651324B1 (en) * 2000-11-06 2003-11-25 Viasystems Group, Inc. Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63232483A (en) * 1987-03-20 1988-09-28 古河電気工業株式会社 Molded printed wiring board
US6651324B1 (en) * 2000-11-06 2003-11-25 Viasystems Group, Inc. Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer

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