WO2020187305A1 - 低比电阻物质处理方法及处理装置 - Google Patents

低比电阻物质处理方法及处理装置 Download PDF

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WO2020187305A1
WO2020187305A1 PCT/CN2020/080276 CN2020080276W WO2020187305A1 WO 2020187305 A1 WO2020187305 A1 WO 2020187305A1 CN 2020080276 W CN2020080276 W CN 2020080276W WO 2020187305 A1 WO2020187305 A1 WO 2020187305A1
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Prior art keywords
specific resistance
low specific
resistance material
low
electrode
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PCT/CN2020/080276
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English (en)
French (fr)
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唐万福
王大祥
段志军
奚勇
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上海必修福企业管理有限公司
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Priority to CN202080024784.5A priority Critical patent/CN114072236A/zh
Priority to JP2021556694A priority patent/JP2022528313A/ja
Priority to EP20773545.7A priority patent/EP3943195A1/en
Publication of WO2020187305A1 publication Critical patent/WO2020187305A1/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/34Constructional details or accessories or operation thereof
    • B03C3/40Electrode constructions
    • B03C3/45Collecting-electrodes
    • B03C3/49Collecting-electrodes tubular
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/01Pretreatment of the gases prior to electrostatic precipitation
    • B03C3/011Prefiltering; Flow controlling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/017Combinations of electrostatic separation with other processes, not otherwise provided for
    • B03C3/0175Amassing particles by electric fields, e.g. agglomeration
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/019Post-treatment of gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/34Constructional details or accessories or operation thereof
    • B03C3/36Controlling flow of gases or vapour
    • B03C3/368Controlling flow of gases or vapour by other than static mechanical means, e.g. internal ventilator or recycler
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/34Constructional details or accessories or operation thereof
    • B03C3/40Electrode constructions
    • B03C3/41Ionising-electrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/34Constructional details or accessories or operation thereof
    • B03C3/40Electrode constructions
    • B03C3/45Collecting-electrodes
    • B03C3/47Collecting-electrodes flat, e.g. plates, discs, gratings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B03SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03CMAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C3/00Separating dispersed particles from gases or vapour, e.g. air, by electrostatic effect
    • B03C3/34Constructional details or accessories or operation thereof
    • B03C3/66Applications of electricity supply techniques
    • B03C3/70Applications of electricity supply techniques insulating in electric separators

Definitions

  • the present invention relates to a low specific resistance material processing method and processing device, in particular to a low specific resistance material processing method and processing device with higher efficiency for collecting low specific resistance materials.
  • mist eliminators are used to remove water in the flue gas, but the actual mist eliminators cannot achieve the removal effect at all due to temperature differences and fine mist characteristics.
  • the wet electrostatic precipitator is mainly used as a treatment method, but due to the deviation of the structure and charging principle, the water mist cannot be charged and adsorbed, and the efficiency of white smoke treatment is also extremely low. In this way, a large amount of the above-mentioned pollutants are discharged into the atmosphere, forming haze and acid rain.
  • the above-mentioned discharged water mist is a low-resistance material.
  • the existing technology for processing low-resistance materials has the problem that low-resistance materials are easily de-energized after being charged, and it is impossible to remove low-resistance materials discharged into the air, such as The purification and collection of acid mist in industrial exhaust is still a technical problem that needs to be solved urgently today.
  • the technical problem to be solved by the present invention is to provide a low specific resistance material processing method and device, which can collect low specific resistance materials with high collection efficiency.
  • Example 1 provided by the present invention: A method for processing low-resistance materials, including the following steps:
  • the charged low-resistance substance is attracted by the absorption electrode, and the charged low-resistance substance is moved to the absorption electrode.
  • Example 2 provided by the present invention: including the low-resistance material processing method described in Example 1, wherein the step of conducting electrons to the low-resistance material with a conductive electrode includes: electrons located on the conductive electrode and The low-resistance substances between the adsorption electrodes are transferred to each other, so that more low-resistance substances are charged.
  • Example 3 provided by the present invention: including the low-resistance material processing method described in Example 1 or 2, wherein the low-resistance material conducts electrons between the conductive electrode and the adsorption electrode and forms a current.
  • Example 4 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-3, wherein the step of conducting electrons to the low-resistance material with a conductive electrode includes: The electrode charges the low specific resistance material by contacting the low specific resistance material.
  • Example 5 provided by the present invention: The method for processing a low-resistance material including any one of Examples 1-4, wherein the conductive electrode is in the shape of a surface, a mesh, a hole plate, a plate, a ball cage, Box-shaped or tube-shaped.
  • Example 6 provided by the present invention: The method for processing a low-resistance material including any one of Examples 1-5, wherein the conductive electrode is solid, liquid, gaseous molecular group, plasma, conductive mixed state material, biological body Naturally mixed conductive materials or artificial processing of objects to form a combination of one or more forms of conductive materials.
  • Example 7 provided by the present invention: The method for processing a low-resistance material including any one of Examples 1-6, wherein the conductive electrode is solid metal, graphite or ion-containing conductive liquid.
  • Example 8 provided by the present invention: including the method for processing low-resistance substances described in any one of Examples 1-7, wherein the adsorption electrode is in the shape of a multilayer mesh, mesh, orifice plate, tube, barrel, Ball cage shape, box shape, plate shape, particle accumulation layered or bent plate shape.
  • Example 9 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-8, wherein at least one through hole is provided on the conductive electrode.
  • Example 10 provided by the present invention: including the method for processing a low specific resistance substance according to any one of Example 9, wherein the step of conducting electrons to the low specific resistance substance with a conductive electrode includes: making the low specific resistance The resistance material passes through the through hole of the conductive electrode to charge the low specific resistance material.
  • Example 11 provided by the present invention: including the low-resistance material processing method described in Example 9 or 10, wherein the shape of the through hole on the conductive electrode is polygonal, circular, elliptical, square, rectangular, or trapezoidal , Or diamond.
  • Example 12 provided by the present invention: including the low-resistance material processing method described in any one of Examples 9-11, wherein the aperture of the through hole on the conductive electrode is 0.1-3 mm.
  • Example 13 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-12, wherein at least one through hole is provided on the adsorption electrode.
  • Example 14 provided by the present invention: including the low-resistance material processing method described in Example 13, wherein the shape of the through hole of the adsorption electrode is polygonal, circular, oval, square, rectangular, trapezoidal, or rhombus .
  • Example 15 provided by the present invention: including the low-resistance material processing method described in Example 13 or 14, wherein the aperture of the through hole of the adsorption electrode is 0.1-3 mm.
  • Example 16 provided by the present invention: includes the method for processing a material with low specific resistance according to any one of Examples 1-15, wherein the adsorption electrode is made of a conductive material, or the surface of the adsorption electrode has a conductive material.
  • Example 17 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-16, wherein an electric field is formed between the conductive electrode and the adsorption electrode.
  • Example 18 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-17, wherein the conductive electrode is perpendicular or parallel to the adsorption electrode.
  • Example 19 provided by the present invention: The method for processing a low-resistance material including any one of Examples 1-18, wherein the conductive electrode is in a mesh shape, the adsorption electrode is in a planar shape, and the conductive electrode is parallel to The adsorption pole.
  • Example 20 provided by the present invention: includes the method for processing a low-resistance material according to any one of Examples 1-19, wherein the conductive electrode and the adsorption electrode are both planar, and the conductive electrode and the adsorption electrode Parallel.
  • Example 21 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-20, wherein the conductive electrode is a metal wire mesh.
  • Example 22 provided by the present invention: including the method for processing a material with low specific resistance according to any one of Examples 1-21, wherein the conductive electrode is in a planar shape or a spherical shape.
  • Example 23 provided by the present invention: includes the method for processing a low-resistance material according to any one of Examples 1-22, wherein the adsorption electrode is curved or spherical.
  • Example 24 provided by the present invention: including the method for processing a low-resistance substance according to any one of Examples 1-23, wherein the conductive electrode is electrically connected to an electrode of the power supply, and the adsorption electrode is connected to the power supply. The other electrode of the power supply is electrically connected.
  • Example 25 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-24, wherein the conductive electrode is electrically connected to the negative electrode of the power supply, and the adsorption electrode is connected to the power supply The positive pole is electrically connected.
  • Example 26 includes the low specific resistance material processing method described in any one of Examples 1-25, wherein the power-on driving voltage range of the power-on power supply may be 5-50KV.
  • Example 27 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-26, wherein the power-on driving voltage of the power-on power supply is less than the initial corona initiation voltage.
  • Example 28 provided by the present invention: includes the low specific resistance material processing method described in any one of Examples 1-27, wherein the power-on driving voltage of the power-on power supply is 0.1-2 kv/mm.
  • Example 29 includes the low specific resistance material processing method described in any one of Examples 1-28, wherein the power-on driving voltage waveform of the power-on power supply is a DC waveform, a sine wave, or a modulation waveform.
  • Example 30 includes the low specific resistance material processing method described in any one of Examples 1-29, wherein the power source is an AC power source, and the variable frequency pulse range of the power-on power source is 0.1 Hz to 5 GHz.
  • Example 31 provided by the present invention: including the low-resistance material processing method described in any one of Examples 1-30, wherein the conductive electrode and the adsorption electrode extend in the left-right direction, and the left end of the conductive electrode is located at the adsorption electrode The left end of the left.
  • Example 32 provided by the present invention: includes the method for processing a material with low specific resistance according to any one of Examples 1-31, wherein there are two adsorption electrodes, and the conductive electrode is located between the two adsorption electrodes.
  • Example 33 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-32, wherein the conductive electrode and the adsorption electrode constitute an adsorption unit, and there are multiple adsorption units.
  • Example 34 provided by the present invention: The method for processing a low-resistance material including any one of Examples 1-33, wherein all the adsorption units are arranged in one or more of the longitudinal, transverse, oblique, and spiral directions Distribute.
  • Example 35 provided by the present invention: including the method for processing a low-resistance material according to any one of Examples 1-34, wherein the conductive electrode and the adsorption electrode are both installed in a housing, and the housing has an inlet and Export.
  • Example 36 includes the low specific resistance material processing method described in any one of Examples 1-35, wherein the method further includes a flow channel located in the housing between the inlet and the outlet.
  • Example 37 provided by the present invention: including the method for processing low-resistance material described in Example 35 or 36, wherein the inlet is circular, and the diameter of the inlet is 300-1000 mm, or 500 mm.
  • Example 38 provided by the present invention: including the low specific resistance material processing method described in Example 35 or 36, wherein the outlet is circular, and the diameter of the outlet is 300-1000 mm, or 500 mm.
  • Example 39 includes the low specific resistance material processing method described in any one of Examples 1-38, wherein the material of the shell is metal, non-metal, conductor, non-conductor, water, and various conductive liquids , All kinds of porous materials, or all kinds of foam materials.
  • Example 40 provided by the present invention: includes the method for processing low specific resistance materials described in any one of Examples 1-39, wherein the material of the housing is stainless steel, aluminum alloy, iron alloy, conductive liquid, cloth, sponge, molecular sieve, Activated carbon, foamed iron, or foamed silicon carbide.
  • Example 41 includes the low specific resistance material processing method described in any one of Examples 1-40, wherein the housing includes a first barrel, a second barrel, and a barrel that are sequentially distributed from an inlet to an outlet. And the third barrel, the inlet is located at one end of the first barrel, and the outlet is located at one end of the third barrel.
  • Example 42 provided by the present invention: including the low specific resistance material processing method described in Example 41, wherein the outline size of the first barrel gradually increases from the inlet to the outlet.
  • Example 43 provided by the present invention: including the method for processing a low-resistance substance described in Example 41 or 42, wherein the first barrel has a straight tube shape.
  • Example 44 provided by the present invention: includes the method for processing a low-resistance material according to any one of Examples 41-43, wherein the second barrel has a straight tube shape, and the conductive electrode and the adsorption electrode are installed in In the second barrel.
  • Example 45 includes the low specific resistance material processing method described in any one of Examples 41 to 44, wherein the outline size of the third barrel gradually decreases from the inlet to the outlet.
  • Example 46 provided by the present invention: includes the low specific resistance material processing method described in any one of Examples 41 to 45, wherein the cross section of the second barrel is rectangular.
  • Example 47 provided by the present invention: includes the method for processing a low-resistance material according to any one of Examples 1-46, wherein the conductive electrode is fixed to the housing through an insulating member.
  • Example 48 provided by the present invention: including the low specific resistance material processing method described in Example 47, wherein the material of the insulating member is insulating mica.
  • Example 49 provided by the present invention: including the method for processing a low-resistance substance as described in Example 47 or 48, wherein the insulating member is in a columnar shape or a tower shape.
  • Example 50 provided by the present invention: includes the method for processing a low-resistance material according to any one of Examples 1-49, wherein a first connecting portion is provided on the conductive electrode, and the first connecting portion is fixed to the insulating member. Pick up.
  • Example 51 provided by the present invention: includes the low specific resistance material processing method described in any one of Examples 1-50, wherein a second connecting portion is provided on the inner wall of the housing, and the second connecting portion is fixed to the insulating member. Pick up.
  • Example 52 includes the low specific resistance material processing method described in any one of Examples 1-51, wherein the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%, or 90-10%, or 80-20%, or 70-30%, or 60-40%, or 50%.
  • Example 53 provided by the present invention: includes the method for processing a low-resistance substance according to any one of Examples 1-52, wherein the low-resistance substance is one of liquid, mist, solid, or plasma state or A combination of multiple forms.
  • Example 54 includes the method for processing a low specific resistance material according to any one of Examples 1-53, wherein the low specific resistance material is conductive liquid, conductive mist, conductive particles, charged liquid, charged mist, Charged particles, water, emulsion, aerosol, liquefied dust, multi-component mixture, multi-phase mixture, multi-component multi-phase mixture, water mist, emulsion mist, multi-component mixture liquid mist, multi-phase mixture liquid mist, Multi-material and multi-state mixed liquid mist, haze, steam, acid mist, water-containing exhaust gas, water-containing flue gas, gaseous molecular clusters, ion clusters, plasma, conductive powder, conductive droplets, conductive dust, liquid ion clusters, gas One or a combination of one or more forms of medium ion groups, liquid compounds, and gas compounds.
  • the low specific resistance material is conductive liquid, conductive mist, conductive particles, charged liquid, charged mist, Charged particles, water, emulsion,
  • Example 55 includes the method for processing a low-resistance substance according to any one of Examples 1-54, wherein the low-resistance substance is water, emulsion, multi-material mixture, multi-state mixture, Or an organism with a mixture of multi-objects and multi-states.
  • Example 56 includes the low specific resistance material processing method described in any one of Examples 1-55, wherein the low specific resistance material is a conductor or a semiconductor.
  • Example 57 provided by the present invention: including the low specific resistance material processing method described in any one of Examples 1-56, which includes the following steps:
  • the low specific resistance material enters the flow channel from the inlet and moves toward the exit direction; when the low specific resistance material passes through the electrode, the conductive electrode conducts electrons to the low specific resistance material, and the low specific resistance material is charged.
  • Example 58 provided by the present invention: a low specific resistance material processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • Example 59 provided by the present invention: The low specific resistance material processing device including Example 58, wherein the conductive electrode is in the shape of a surface, a mesh, a plate, a plate, a cage, a box, or a tube .
  • Example 60 includes the low-resistance material processing device described in Example 58 or 59, wherein the conductive electrode is solid, liquid, gaseous molecular cluster, plasma, conductive mixed state material, and biological body naturally mixed conductive The material or object is artificially processed to form one or a combination of forms in the conductive material.
  • Example 61 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 60, wherein the conductive electrode is solid metal, graphite or ion-containing conductive liquid.
  • Example 62 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58-61, wherein the adsorption electrode is in the shape of a multilayer mesh, mesh, orifice plate, tube, barrel, Ball cage shape, box shape, plate shape, particle accumulation layered or bent plate shape.
  • Example 63 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 62, wherein at least one through hole is provided on the conductive electrode.
  • Example 64 provided by the present invention: including the low specific resistance material processing device described in any one of Examples 58 to 63, wherein the step of conducting electrons to the low specific resistance material with a conductive electrode includes: making the The low specific resistance material passes through the through hole of the conductive electrode to charge the low specific resistance material.
  • Example 65 provided by the present invention: including the low-resistance substance processing device described in Example 63 or 64, wherein the shape of the through hole on the conductive electrode is polygonal, circular, elliptical, square, rectangular, or trapezoidal , Or diamond.
  • Example 66 provided by the present invention: including the low specific resistance material processing device described in any one of Examples 63-64, wherein the aperture of the through hole on the conductive electrode is 0.1-3 mm.
  • Example 67 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 66, wherein at least one through hole is provided on the adsorption electrode.
  • Example 68 provided by the present invention: including the low-resistance material processing device of Example 67, wherein the shape of the through hole of the adsorption electrode is polygonal, circular, oval, square, rectangular, trapezoidal, or rhombus .
  • Example 69 provided by the present invention: including the low specific resistance material processing device described in Example 67 or 68, wherein the aperture of the through hole of the adsorption electrode is 0.1-3 mm.
  • Example 70 includes the low specific resistance material processing device described in any one of Examples 58 to 69, wherein the adsorption electrode is made of conductive material, or the surface of the adsorption electrode has conductive material.
  • Example 71 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 70, wherein an electric field is formed between the conductive electrode and the adsorption electrode.
  • Example 72 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 71, wherein the conductive electrode is perpendicular or parallel to the adsorption electrode.
  • Example 73 provided by the present invention: including the low specific resistance material processing device of any one of Examples 58-72, wherein the conductive electrode is in a mesh shape, the adsorption electrode is planar, and the conductive electrode is parallel to the adsorption electrode.
  • Example 74 provided by the present invention: includes the low specific resistance material processing device of any one of Examples 58-73, wherein the conductive electrode and the adsorption electrode are both planar, and the conductive electrode and the adsorption electrode are parallel .
  • Example 75 includes the low specific resistance substance processing device described in any one of Examples 58 to 74, wherein the conductive electrode adopts a metal wire mesh.
  • Example 76 provided by the present invention: includes the low specific resistance material processing device of any one of Examples 58 to 75, wherein the conductive electrode is in a planar shape or a spherical shape.
  • Example 77 provided by the present invention: including the low specific resistance material processing device of any one of Examples 58 to 76, wherein the adsorption electrode is in a curved or spherical shape.
  • Example 78 provided by the present invention: includes the low-resistance material processing device described in any one of Examples 58-77, wherein the conductive electrode is electrically connected to one electrode of the power source, and the adsorption electrode is connected to the power source. The other electrode of the power supply is electrically connected.
  • Example 79 provided by the present invention: includes the low specific resistance material processing device of any one of Examples 58-78, wherein the conductive electrode is electrically connected to the negative electrode of the power source, and the adsorption electrode is connected to the power source The positive pole is electrically connected.
  • Example 80 includes the low specific resistance material processing device described in any one of Examples 58-79, wherein the power-on driving voltage range of the power-on power supply may be 5-50KV.
  • Example 81 provided by the present invention includes the low specific resistance material processing device described in any one of Examples 58 to 80, wherein the power-on driving voltage of the power-on power supply is less than the initial corona initiation voltage.
  • Example 82 provided by the present invention: includes the low specific resistance material processing device of any one of Examples 58 to 81, wherein the power-on driving voltage of the power-on power supply is 0.1 kv/mm-2 kv/mm.
  • Example 83 provided by the present invention includes the low specific resistance material processing device described in any one of Examples 58 to 82, wherein the power-on driving voltage waveform of the power-on power supply is a DC waveform, a sine wave, or a modulated waveform.
  • Example 84 provided by the present invention: including the low specific resistance material processing device of any one of Examples 58-83, wherein the power source is an alternating current power source, and the variable frequency pulse range of the power-on power source is 0.1 Hz-5 GHz.
  • Example 85 provided by the present invention: including the low-resistance material processing device of any one of Examples 58-84, wherein the conductive electrode and the adsorption electrode extend in the left-right direction, and the left end of the conductive electrode is located at the adsorption electrode The left end of the left.
  • Example 86 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 85, wherein there are two adsorption electrodes, and the conductive electrode is located between the two adsorption electrodes.
  • Example 87 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 86, wherein the conductive electrode and the adsorption electrode constitute an adsorption unit, and there are multiple adsorption units.
  • Example 88 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 87, wherein all the adsorption units are along one or more of the longitudinal, transverse, oblique, or spiral directions Distribution in the direction.
  • Example 89 includes the low specific resistance material processing device described in any one of Examples 58 to 88, wherein it further includes a housing with an inlet and an outlet, and the conductive electrode and the adsorption electrode are both installed in the housing in.
  • Example 90 provided by the present invention: includes the low specific resistance material processing device of any one of Examples 58-89, wherein it further includes a flow channel located in the housing at the inlet and the outlet between.
  • Example 91 provided by the present invention: including the low specific resistance substance processing device described in Example 89 or 90, wherein the inlet is circular, and the diameter of the inlet is 300-1000 mm, or 500 mm.
  • Example 92 provided by the present invention: including the low specific resistance substance processing device described in Example 89 or 90, wherein the outlet is circular, and the diameter of the outlet is 300-1000 mm, or 500 mm.
  • Example 93 provided by the present invention: includes the low-resistance substance processing device described in any one of Examples 58-92, wherein the material of the housing is metal, non-metal, conductor, non-conductor, water, and various conductive liquids , All kinds of porous materials, or all kinds of foam materials.
  • Example 94 includes the low specific resistance material processing device described in any one of Examples 58-93, wherein the material of the housing is stainless steel, aluminum alloy, iron alloy, conductive liquid, cloth, sponge, molecular sieve, Activated carbon, foamed iron, or foamed silicon carbide.
  • Example 95 includes the low specific resistance material processing device of any one of Examples 58-94, wherein the housing includes a first barrel, a second barrel, and And the third barrel, the inlet is located at one end of the first barrel, and the outlet is located at one end of the third barrel.
  • Example 96 provided by the present invention: including the low specific resistance substance processing device of Example 95, wherein the outline size of the first barrel gradually increases from the inlet to the outlet.
  • Example 97 provided by the present invention: including the low-resistance substance processing device of Example 95 or 96, wherein the first barrel has a straight tube shape.
  • Example 98 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 95-97, wherein the second barrel has a straight tube shape, and the conductive electrode and the adsorption electrode are installed in the second In the barrel.
  • Example 99 includes the low specific resistance material processing device described in any one of Examples 95 to 98, wherein the outline size of the third barrel gradually decreases from the inlet to the outlet.
  • Example 100 includes the low specific resistance substance processing device described in any one of Examples 95 to 99, wherein the cross section of the second barrel is rectangular.
  • Example 101 includes the low specific resistance material processing device described in any one of Examples 58 to 100, wherein the conductive electrode is fixed to the housing through an insulating member.
  • Example 102 provided by the present invention: including the low specific resistance material processing device described in Examples 39-101, wherein the material of the insulating member is insulating mica.
  • Example 103 provided by the present invention: includes the low specific resistance material processing device described in Example 101 or 102, wherein the insulating member is in a columnar shape or a tower shape.
  • Example 104 includes the low specific resistance material processing device described in any one of Examples 58-103, wherein a first connecting portion is provided on the conductive electrode, and the first connecting portion is fixed to the insulating member. Pick up.
  • Example 105 provided by the present invention: includes the low specific resistance substance processing device described in any one of Examples 58-104, wherein a second connecting portion is provided on the inner wall of the housing, and the second connecting portion is fixed to the insulating member. Pick up.
  • Example 106 provided by the present invention: includes the low specific resistance material processing device of any one of Examples 58-105, wherein the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%, or 90-10%, or 80-20%, or 70-30%, or 60-40%, or 50%.
  • Example 107 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 106, wherein the low specific resistance material is one of liquid, mist, solid, or plasma state or A combination of multiple forms.
  • Example 108 includes the low specific resistance material processing device described in any one of Examples 58 to 107, wherein the low specific resistance material is conductive liquid, conductive mist, conductive particles, charged liquid, charged mist, Charged particles, water, emulsion, aerosol, liquefied dust, multi-component mixture, multi-phase mixture, multi-component multi-phase mixture, water mist, emulsion mist, multi-component mixture liquid mist, multi-phase mixture liquid mist, Multi-material and multi-state mixed liquid mist, haze, steam, acid mist, water-containing exhaust gas, water-containing flue gas, gaseous molecular clusters, ion clusters, plasma, conductive powder, conductive droplets, conductive dust, liquid ion clusters, gas One or a combination of one or more forms of medium ion groups, liquid compounds, and gas compounds.
  • the low specific resistance material is conductive liquid, conductive mist, conductive particles, charged liquid, charged mist, Charged particles, water, emulsion
  • Example 109 provided by the present invention: includes the low specific resistance material processing device described in any one of Examples 58 to 108, wherein the low specific resistance material is water, emulsion, multi-material mixture, multi-state mixture, Or an organism that is a mixture of multi-object and multi-state.
  • Example 110 provided by the present invention: includes the low specific resistance material processing device of any one of Examples 58 to 109, wherein the low specific resistance material is a conductor or a semiconductor.
  • Example 111 provided by the present invention: includes the low specific resistance substance processing device used in any one of Examples 58-110, which includes an inlet, an outlet, and a flow channel between the inlet and the outlet, and the flow channel A conductive electrode capable of conducting electrons to a material with low specific resistance is installed; and the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%, and the processing device for the low specific resistance material also includes charging The low specific resistance material exerts an attractive force on the adsorption pole.
  • the working principle of the low-resistance material processing device in the present invention is: the conductive electrode is used to conduct electrons to the low-resistance material, so that the low-resistance material is charged, and the adsorption electrode is used to apply attractive force to the charged low-resistance material to attract The low specific resistance material moves to the adsorption electrode until the low specific resistance material adheres to the adsorption electrode, so as to realize the collection of the low specific resistance material on the adsorption plate; at the same time, the low specific resistance material processing device of the present invention passes through the electron-conducting The method makes the low specific resistance material charged.
  • This method overcomes the problem caused by the low specific resistance material being easy to lose electricity after being charged, so that the low specific resistance material can quickly obtain electrons after losing the electrons, increasing the low specific resistance material The probability of charging, and keep the low-resistance material in a charged state, so that the adsorption electrode can continue to apply attractive force to the low-resistance material to absorb the low-resistance material, and make the low-resistance material processing device low The collection capacity of specific resistance materials is stronger and the collection efficiency is higher.
  • the low specific resistance material processing method provided by the present invention can collect low specific resistance materials with higher collection efficiency.
  • the processing method of the present invention has the following beneficial effects:
  • the present invention realizes the collection of low specific resistance materials on the adsorption plate; and this processing method overcomes the problem that low specific resistance materials are easy to lose electricity after being charged, so that low specific resistance materials lose electrons again The electrons can be quickly obtained to ensure that the low-resistance material remains charged.
  • the adsorption electrode can continue to apply attractive force to the low-resistance material, so as to attract the low-resistance material, so that the treatment method is effective for the low-resistance material.
  • the collection efficiency is higher.
  • the conductive electrode is installed in the flow channel, and the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%, so that the conductive electrode can effectively conduct electrons to the low specific resistance material.
  • FIG. 1 is a schematic diagram of the structure of a low-resistance substance processing device in the first embodiment of the present invention.
  • Figure 2 is a left side view of the low specific resistance material processing device in the first embodiment of the present invention.
  • Fig. 3 is a perspective view of a low specific resistance material processing device in the first embodiment of the present invention.
  • Fig. 4 is a schematic diagram of the structure of a low-resistance substance processing device in a second embodiment of the present invention.
  • Fig. 5 is a top view of a low specific resistance material processing device in a second embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of an air intake device in an engine-based gas treatment system in a twentieth embodiment of the present invention.
  • Fig. 7 is a schematic structural diagram of another embodiment of the first water filter mechanism provided in the air intake device in the engine-based gas treatment system in the twentieth embodiment of the present invention.
  • Fig. 8 is a schematic structural diagram of the exhaust gas treatment system of a diesel engine in a twenty-first embodiment of the embodiment of the present invention.
  • the inventor of the present invention has provided the following low-resistance material processing device and processing method after extensive research.
  • the low specific resistance material processing method and processing device can collect low specific resistance materials with higher collection efficiency.
  • the low specific resistance material in the present invention refers to a material whose unit volume resistance is less than 1 ⁇ 10 9 ohms, where the unit volume refers to cubic centimeters; that is, a low specific resistance material per cubic centimeter has a resistance of less than 1 ⁇ 10 9 ohms.
  • Some embodiments of the present invention provide a low specific resistance substance processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • the working principle of the low specific resistance material processing device in the present invention is: the conductive electrode is used to conduct electrons to the low specific resistance material, so that the low specific resistance material is charged, and the adsorption electrode is used to apply attractive force to the charged low specific resistance material to attract The low specific resistance material moves to the adsorption electrode until the low specific resistance material adheres to the adsorption electrode, so as to realize the collection of the low specific resistance material on the adsorption plate; at the same time, the low specific resistance material processing device of the present invention passes through the electron-conducting The method makes the low specific resistance material charged.
  • This method overcomes the problem caused by the low specific resistance material being easy to lose electricity after being charged, so that the low specific resistance material can quickly obtain electrons after losing the electrons, increasing the low specific resistance material The probability of charging, and keep the low-resistance material in a charged state, so that the adsorption electrode can continue to apply attractive force to the low-resistance material to absorb the low-resistance material, and make the low-resistance material processing device low The collection capacity of specific resistance materials is stronger and the collection efficiency is higher.
  • the present invention provides a low specific resistance material processing method, including the following steps:
  • the charged low-resistance substance is attracted by the absorption electrode, and the charged low-resistance substance is moved to the absorption electrode.
  • the processing method of the present invention realizes the collection of low-resistance materials on the adsorption plate based on the above steps; and this processing method overcomes the problem that low-resistance materials are easy to lose electricity after being charged, so that the low-resistance materials are lost After the electrons, electrons can be obtained quickly to ensure that the low-resistance material remains charged. In this way, the adsorption electrode can continue to apply attractive force to the low-resistance material, so as to attract the low-resistance material, thereby making this treatment method less effective.
  • the collection efficiency of specific resistance materials is higher.
  • Certain embodiments of the present invention provide a low-resistance substance processing device, including an inlet, an outlet, and a flow channel between the inlet and the outlet, and a conductive electrode that can conduct electrons to the low-resistance substance is installed in the flow channel; and
  • the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%
  • the low specific resistance material processing device also includes an adsorption electrode that can apply attractive force to the charged low specific resistance material.
  • the working principle of the low specific resistance material processing device in the present invention is: the low specific resistance material enters the flow channel from the inlet, the conductive electrode installed in the flow channel conducts electrons to the low specific resistance material, the low specific resistance material is charged, and the adsorption electrode is charged The low specific resistance material exerts attraction force, and the low specific resistance material moves to the adsorption electrode until the low specific resistance material adheres to the adsorption electrode, so as to realize the collection of the low specific resistance material on the adsorption plate; meanwhile, the conductive electrode is installed in the present invention In the flow channel, and the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%, so that the conductive electrode can effectively conduct electrons to the low specific resistance material; in addition, the low specific resistance material processing device of the present invention, The low specific resistance material is charged by the above-mentioned conduction electron method.
  • This method overcomes the problem caused by the easy loss of electricity after the low specific resistance material is charged, so that the low specific resistance material can quickly obtain electrons after losing electrons, which increases The probability of charging the low-resistance material and keeping the low-resistance material in a charged state.
  • the adsorption pole can continue to apply attractive force to the low-resistance material to adsorb the low-resistance material and make the low-resistance material.
  • the material processing device has a stronger collection capacity and a higher collection efficiency for low specific resistance materials.
  • Certain embodiments of the present invention provide a low-resistance substance processing device, including an inlet, an outlet, and a flow channel between the inlet and the outlet, and a conductive electrode that can conduct electrons to the low-resistance substance is installed in the flow channel; and
  • the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%
  • the low specific resistance material processing device also includes an adsorption electrode that can apply attractive force to the charged low specific resistance material.
  • Some embodiments of the present invention provide the method for processing the low specific resistance material, including the following steps:
  • the low specific resistance material enters the flow channel from the inlet and moves toward the outlet direction; when the low specific resistance material passes through the conductive electrode, the conductive electrode conducts electrons to the low specific resistance material, and the low specific resistance material is charged; the adsorption electrode is used to attract all charged materials.
  • the low specific resistance material moves the charged low specific resistance material to the adsorption electrode.
  • the low-resistance material processing method of the present invention realizes the collection of the low-resistance material on the adsorption plate based on the above steps; at the same time, the conductive electrode is installed in the flow channel, and the cross-sectional area of the conductive electrode and the cross-sectional area of the flow channel are With a ratio of 99-10%, the low-resistance material passes through the conductive electrode, and the contact area between the low-resistance material and the conductive electrode is increased, so that the conductive electrode can effectively conduct electrons to the low-resistance material, and this treatment method overcomes The problem caused by the low specific resistance material being easily de-energized after being charged, so that the low specific resistance material can quickly obtain electrons after losing electrons to ensure that the low specific resistance material remains charged, so that the adsorption electrode can continue to be low.
  • the specific resistance material exerts an attractive force to attract the low specific resistance material, thereby making the collection efficiency of the low specific resistance material higher in this processing method.
  • the conductive electrode is located in the flow channel.
  • the cross-sectional area of the conductive electrode in the present invention is the sum of the area of the solid part of the conductive electrode along the cross-section.
  • the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel may be 99-10%, or 90-10%, or 80-20%, or 70-30%, or 60-40. %, or 50%.
  • the form of the low-resistance substance in the present invention may be one or a combination of a liquid state, a mist state, a solid state, or a plasma state.
  • the low specific resistance substance in the present invention may be conductive liquid, conductive mist, conductive particles, charged liquid, charged mist, charged particles, water, emulsion, aerosol, liquefied dust, multi-material mixture, multi-state mixture, Multi-material multi-state mixed liquid, water mist, emulsion mist, multi-material mixed liquid mist, multi-state mixed liquid mist, multi-material multi-state mixed liquid mist, haze, steam, acid mist, water-containing exhaust gas, water-containing flue gas, gaseous state Molecular clusters, ion clusters, plasma, conductive powders, conductive droplets, conductive dust, ion clusters in liquid, ion clusters in gas, compounds in liquid, compounds in gas, etc.
  • the low-resistance substance in the present invention may also be an organism containing water, an emulsion, a multi-material mixture, a multi-state mixture, or a multi-material and multi-state mixture.
  • the low specific resistance substance in the present invention may be a conductor or a semiconductor.
  • the present invention can collect the low specific resistance material on the adsorption electrode by the above-mentioned processing method.
  • the treatment device in the present invention can be used as an electrocoagulation demister, and can be applied to ozone denitration tail gas recovery, wet desulfurization flue gas dehydration, wet dust removal escape water recovery, industrial tail gas demister, emulsion purifier, oil mist static Carburetor, electronic cigarette, nuclear fusion restraint device.
  • the acid mist formed in the ozone denitration tail gas is a kind of low specific resistance material, and the resistance of the tail gas containing acid mist per cubic centimeter is 0.1 to 1000 ohms;
  • the specific resistance material treatment method specifically includes the following steps: the ozone denitrification tail gas flows through the conductive electrode, and the conductive electrode conducts electrons to the acid mist in the ozone denitrification tail gas, and makes the acid mist charged; the adsorption electrode applies attraction to the charged acid mist; The mist moves to the adsorption electrode and adheres to the adsorption electrode, so as to realize the recovery of the acid mist in the ozone denitration tail gas, and prevent the acid mist in the ozone denitration tail gas from being directly discharged into the atmosphere and causing pollution to the atmosphere.
  • the above treatment method is also called an acid mist electrostatic recovery method.
  • the processing device and processing method of the present invention can be used for de-whitening treatment of fugitive fog, aerosol, etc. discharged from chimneys of power plants, glass plants, steel plants, and chemical plants.
  • the invention solves the problem that the traditional wet electric precipitator cannot remove the low-resistance substances contained in the exhaust gas, including water mist, acid mist, aerosol, emulsion, liquefied dust, etc., and adopts a space power-up method to directly use electric field Adsorption and recovery of low specific resistance substances contained in tail gas.
  • the processing method and device of the present invention can also be used to separate or enrich the target substance, that is, the low specific resistance substance from the gas phase, the liquid phase, or the sol.
  • the conductive electrode is electrically connected to one electrode of the power source; the adsorption electrode is electrically connected to the other electrode of the power source. In an embodiment of the present invention, the conductive electrode is electrically connected to the negative electrode of the power source, and the adsorption electrode is electrically connected to the positive electrode of the power source.
  • the power-up method of the low-resistance material in the present invention is to use a conductive electrode to introduce positive or negative electrons into the low-resistance material.
  • This power-up method can quickly obtain electrons after the low-resistance material is easily de-energized, so that the low-resistance material
  • the resistive material maintains a charged state, so that the adsorption pole can continue to attract the low specific resistance material so as to be able to adsorb the low specific resistance material.
  • the conductive electrode in the present invention can have a positive or negative potential; when the conductive electrode has a positive potential, the adsorption electrode has a negative potential; when the conductive electrode has a negative potential, the adsorption electrode has a positive potential.
  • the poles are all electrically connected to the power source.
  • the conductive electrode and the adsorption pole can be respectively electrically connected to the positive and negative poles of the power source.
  • the voltage of the power-on power supply is called the power-on driving voltage, and the selection of the power-on driving voltage is related to the ambient temperature and the temperature of the medium.
  • the power-on driving voltage range of the power-on power supply can be 5-50KV, 10-50KV, 5-10KV, 10-20KV, 20-30KV, 30-40KV, or 40-50KV, from bio-electricity to space haze treatment Use electricity.
  • the power-on power supply can be a DC power supply or an AC power supply, and the waveform of the power-on driving voltage can be a DC, a sine wave, or a modulated waveform.
  • DC power supply is used as the basic application of adsorption; sine wave is used for movement, such as the power-on driving voltage of sine wave acts between the conductive electrode and the adsorption electrode, and the generated electric field will drive the charged particles in the electric field, such as mist droplets, to adsorb Polar movement; oblique wave is used as a pulling force, and the waveform needs to be modulated according to the degree of pulling force.
  • the pulling force generated on the medium has obvious directionality to drive the medium in the electric field to move in this direction .
  • the range of its variable frequency pulse can be 0.1Hz-5GHz, 0.1Hz-1Hz, 0.5Hz-10Hz, 5Hz-100Hz, 50Hz-1KHz, 1KHz-100KHz, 50KHz-1MHz, 1MHz-100MHz , 50MHz-1GHz, 500MHz-2GHz, or 1GHz-5GHz, suitable for the adsorption of organisms to pollutant particles.
  • the conductive electrode of the present invention can be used as a wire, and when it is in contact with a low-resistance material, it directly introduces positive and negative electrons into the low-resistance material.
  • the low-resistance material itself can be used as an electrode.
  • the low specific resistance material will repeatedly obtain and lose electrons during the process of moving from the conductive electrode to the adsorption electrode; at the same time, a large number of electrons are located between the multiple low specific resistance materials between the conductive electrode and the adsorption electrode. It transfers and finally reaches the adsorption pole, thereby forming a current, which is also called the power-on driving current.
  • the magnitude of the power-on drive current is related to the ambient temperature, medium temperature, amount of electrons, mass of adsorbed substances, and amount of escape. For example, as the amount of electrons increases, movable particles such as fog droplets increase, and the current formed by the moving charged particles increases. The more charged substances, such as fog droplets, are adsorbed per unit time, the greater the current. The escaping droplets are only charged, but have not reached the adsorption pole, that is to say, no effective neutralization is formed, so under the same conditions, the more droplets that escape, the smaller the current. Under the same conditions, the higher the ambient temperature, the faster the velocity of gas particles and droplets, and the higher its own kinetic energy.
  • the escape occurs, but because the escape occurs after the electric neutralization, and possibly after repeated electric neutralization, the electron conduction velocity is correspondingly increased, and the current also increases accordingly.
  • the higher the ambient temperature the higher the momentum of the gas molecules, droplets, etc., and the less likely it is to be adsorbed by the adsorption electrode. Even after the adsorption electrode is adsorbed, it will escape from the adsorption electrode again, that is, the probability of escaping after neutralization is greater.
  • the above-mentioned power-on driving voltage needs to be increased, and the limit of the power-on driving voltage is to achieve the effect of air breakdown.
  • the influence of medium temperature is basically equivalent to the influence of ambient temperature. The lower the temperature of the medium is, the smaller the energy required to excite the medium, such as fog droplets, and the smaller the kinetic energy it has. Under the same electric field force, the easier it is to be adsorbed to the adsorption electrode, resulting in a higher current. Big.
  • the treatment device of the present invention has a better adsorption effect on cold substances.
  • the relationship between the power-on driving voltage and the medium temperature is basically the same as the relationship between the power-on driving voltage and the ambient temperature.
  • the power-on driving voltage of the power-on power supply can be less than the initial corona initiation voltage of the corona initiation power supply.
  • the conductive electrode of the present invention can also charge low-resistance materials , Can conduct electricity without ionization; when the power-on driving voltage can be greater than the initial corona initiation voltage of the corona initiation power supply, the corona discharge and the conductive electrode conduct electrons to the low specific resistance material to charge the low specific resistance material simultaneously exist.
  • the corona initiating power source is a power source that can cause the conductive electrode or the adsorbing electrode to discharge when the conductive electrode and the adsorbing electrode are electrically connected to the corona initiating power source, and when the conductive electrode or the adsorbing electrode generates discharge, the gas will be ionized, causing smoke in the gas Substances such as particles acquire a negative charge.
  • the voltage of the corona initiation power supply is called the corona initiation voltage
  • the minimum value of the corona initiation voltage is called the initial corona initiation voltage
  • the initial corona initiation voltage is certain.
  • the power-on driving voltage can be specifically 0.1-2 kv/mm.
  • the power-on driving voltage of the power-on power supply is less than the air corona initiation voltage.
  • the low specific resistance substance processing method of the present invention can be applied to the exhaust gas of an engine.
  • the low specific resistance substance processing device and the processing method of the present invention can be used to treat low specific resistance substances such as water mist in the exhaust gas of the engine.
  • both the conductive electrode and the adsorption electrode extend in the left-right direction, and the left end of the conductive electrode is located to the left of the left end of the adsorption electrode.
  • the conductive electrode is located between the two adsorption electrodes.
  • the distance between the conductive electrode and the adsorption electrode in the present invention can be set according to the power-on driving voltage between the two, the flow rate of the low specific resistance material, and the charging ability of the low specific resistance material.
  • the distance between the conductive electrode and the adsorption electrode can be 5-50mm, 5-10mm, 10-20mm, 20-30mm, 30-40mm, or 40-50mm.
  • the conductive electrode may be a combination of one or more forms of solid, liquid, gas molecular cluster, or plasma.
  • the conductive electrode can be a solid metal, such as 304 steel, or other solid conductors, such as graphite, etc.; when the conductive electrode is extremely liquid, the conductive electrode can be an ion-containing conductive liquid.
  • the conductive electrode may also be a conductive mixed material, a biological body naturally mixes a conductive material, and an object is artificially processed to form a conductive material.
  • the adsorption electrode is made of conductive material, or the surface of the adsorption electrode has conductive material.
  • the shape of the conductive electrode may be in the shape of a surface, a mesh, a perforated plate, a plate, a ball cage, a box, or a tube.
  • the mesh shape is a shape including any porous structure.
  • the conductive electrode has a plate shape, a ball cage shape, a box shape or a tube shape
  • the conductive electrode can be a non-porous structure or a porous structure.
  • one or more through holes can be provided on the conductive electrode, and the shape of the through holes on the conductive electrode can be polygonal, round, oval, square, rectangular, trapezoidal, or rhombus, etc. .
  • the outline size of the through hole on the conductive electrode can be 0.1-3mm, 0.1-0.3mm, 0.3-0.5mm, 0.5-0.8mm, 0.8-1.0mm, 1.0-1.2mm, 1.2-1.0mm, 1.0-1.5mm, 1.5-1.8mm, 1.8-2.0mm, 2.0-2.3mm, 2.3-2.5mm, 2.5-2.8mm, or 2.8-3.0mm.
  • the shape of the conductive electrode may also be other material natural forms or material processing forms.
  • the through hole on the conductive electrode in the present invention is any hole that allows substances to flow through the conductive electrode.
  • the shape of the adsorption electrode can be in the form of a multi-layer mesh, net, orifice, tube, barrel, ball cage, box, plate, particle accumulation layer, and bent plate. Shape, or panel shape.
  • the adsorption electrode can also have a non-porous structure or a porous structure.
  • the adsorption electrode has a porous structure, one or more through holes can be provided on the adsorption electrode, and the shape of the through holes of the adsorption electrode can be polygonal, circular, elliptical, square, rectangular, trapezoidal, or diamond.
  • the outline size of the through hole of the adsorption pole can be 0.1-3mm, 0.1-0.3mm, 0.3-0.5mm, 0.5-0.8mm, 0.8-1.0mm, 1.0-1.2mm, 1.2-1.0mm, 1.0-1.5mm, 1.5 -1.8mm, 1.8-2.0mm, 2.0-2.3mm, 2.3-2.5mm, 2.5-2.8mm, or 2.8-3.0mm.
  • the through holes on the adsorption electrode in the present invention are any holes that allow substances to flow through the adsorption electrode.
  • an electric field is formed between the conductive electrode and the adsorption electrode, and the electric field may be a mesh electric field or a mesh barrel electric field.
  • the conductive electrode is in the shape of a mesh, and the adsorption electrode is in a planar shape, and the conductive electrode is parallel to the adsorption electrode, thereby forming a mesh surface electric field; or the conductive electrode is in a mesh shape and is fixed by a metal wire or metal needle, and the adsorption electrode is in a barrel shape.
  • the conductive electrode is located at the geometric symmetry center of the adsorption electrode, thereby forming a net barrel electric field.
  • the adsorption pole When the adsorption pole is in a planar shape, it may be planar, curved, or spherical. When the conductive electrode is in a mesh shape, it can be planar, spherical, or other geometrical shapes, and can also be rectangular or irregular. When the adsorption pole is in a barrel shape, the adsorption pole can be further evolved into various box shapes. The conductive electrode can also be changed accordingly to form an electrode and electric field layer sleeve.
  • the conductive electrode is perpendicular to the adsorption electrode. In an embodiment of the present invention, the conductive electrode and the adsorption electrode are parallel. In an embodiment of the present invention, the conductive electrode and the adsorption electrode are both planar, and the conductive electrode and the adsorption electrode are parallel. In an embodiment of the present invention, a wire mesh is used for the conductive electrode. In one embodiment of the present invention, the conductive electrode is flat or spherical. In an embodiment of the present invention, the adsorption electrode is curved or spherical.
  • the conductive electrode is in a mesh shape
  • the adsorption electrode is in a barrel shape
  • the conductive electrode is located inside the adsorption electrode
  • the conductive electrode is located on the central symmetry axis of the adsorption electrode.
  • the conductive electrode and the adsorption electrode constitute an adsorption unit.
  • there are multiple adsorption units so that more low specific resistance substances can be adsorbed by multiple adsorption units, thereby improving the efficiency of collecting low specific resistance substances.
  • the distribution of all adsorption units can be flexibly adjusted according to needs; all adsorption units can be the same or different.
  • all the adsorption units can be distributed in one or more of the longitudinal, lateral, oblique, and spiral directions to meet the requirements of different air volumes.
  • All the adsorption units can be distributed in a rectangular array or in a pyramid shape.
  • the aforementioned conductive electrodes and adsorption electrodes of various shapes can be freely combined to form an adsorption unit.
  • a linear conductive electrode is inserted into a tubular adsorption electrode to form an adsorption unit, and then combined with a linear conductive electrode to form a new adsorption unit.
  • two linear conductive electrodes can be electrically connected; the new adsorption unit is Distributed in one or more of the longitudinal, transverse, oblique, and spiral directions.
  • a linear conductive electrode is inserted into a tubular adsorption electrode to form an adsorption unit.
  • the adsorption unit is distributed in one or more of the longitudinal, lateral, oblique, and spiral directions to form a new adsorption unit.
  • the adsorption unit is combined with the above-mentioned conductive electrodes of various shapes to form a new adsorption unit.
  • the distance between the conductive electrode and the adsorption electrode in the adsorption unit of the present invention can be adjusted arbitrarily to meet the requirements of different working voltages and adsorption objects.
  • different adsorption units can be combined.
  • different adsorption units can use the same power supply or different power supplies. When different power-on power supplies are used, the power-on driving voltage of the power-on power supplies may be the same or different.
  • the low-resistance material processing device further includes a housing.
  • the housing includes an inlet, an outlet, and a flow channel. The two ends of the flow channel are respectively connected to the inlet and the outlet.
  • the inlet is circular, and the diameter of the inlet is 300-1000 mm, or 500 mm.
  • the outlet is circular, and the diameter of the outlet is 300-1000 mm, or 500 mm.
  • the housing includes a first barrel, a second barrel, and a third barrel that are sequentially distributed from the inlet to the outlet, the inlet is located at one end of the first barrel, and the inlet is located at one end of the third barrel. .
  • the outline size of the first barrel gradually increases from the inlet to the outlet.
  • the first barrel body is straight and tubular.
  • the second barrel body is straight and tubular, and the conductive electrode and the adsorption electrode are installed in the second barrel body.
  • the contour size of the third barrel gradually decreases from the inlet to the outlet.
  • the cross sections of the first barrel, the second barrel, and the third barrel are all rectangular, and in an embodiment of the present invention, the cross section of the second barrel is rectangular.
  • the material of the housing is stainless steel, aluminum alloy, iron alloy, cloth, sponge, molecular sieve, activated carbon, foamed iron, or foamed silicon carbide.
  • the conductive electrode is connected to the housing through an insulating member.
  • the material of the insulating member is insulating mica.
  • the insulating member is columnar or tower-shaped.
  • a cylindrical front connecting portion is provided on the conductive electrode, and the front connecting portion is fixedly connected to the insulating member.
  • a cylindrical rear connecting portion is provided on the suction electrode or the inner wall of the housing, and the rear connecting portion is fixedly connected to the insulating member.
  • the low specific resistance material processing device further includes a housing having an inlet and an outlet, and the conductive electrode and the adsorption electrode are all installed in the housing.
  • the low specific resistance materials enter the shell from the inlet and move toward the outlet; when the low specific resistance materials move toward the outlet, the low specific resistance materials will pass through the conductive electrode and be charged; the adsorption electrode The charged low specific resistance material is adsorbed to collect the low specific resistance material on the adsorption electrode.
  • the invention uses the shell to guide the low specific resistance material to flow through the conductive plate to charge the low specific resistance material with the conductive electrode, and uses the adsorption electrode to collect the low specific resistance material, thereby effectively reducing the amount of the low specific resistance material flowing out from the outlet.
  • the material of the housing can be metal, non-metal, conductor, non-conductor, water, various conductive liquids, various porous materials, or various foam materials.
  • the material of the shell is metal, the material may be stainless steel, aluminum alloy, or the like.
  • the material of the shell is non-metal, the material can be cloth or sponge.
  • the material of the shell is a conductor, the material may specifically be iron alloy or the like.
  • the conductive electrode is fixedly connected to the housing through an insulating member, and the material of the insulating member may be insulating mica.
  • the adsorption electrode is directly electrically connected to the casing.
  • This connection method allows the casing and the adsorption electrode to have the same electric potential, so that the casing can also adsorb charged low-resistance substances, and the casing also constitutes a Adsorption pole.
  • the casing is provided with the above-mentioned flow channel, and the conductive electrode is installed in the flow channel.
  • the adsorption electrode can extend in the up and down direction, so that when the condensation accumulated on the adsorption electrode reaches a certain weight, it will flow down the adsorption electrode under the action of gravity, and finally gather at the set position or
  • the low specific resistance material attached to the adsorption electrode can be recovered.
  • This processing device can be used for refrigeration and demisting.
  • an external electric field can also be used to collect substances attached to the adsorption plate.
  • the collecting direction of the material on the adsorption plate can be the same as the airflow direction, or it can be different from the airflow direction.
  • the above-mentioned processing device can be used independently as an adsorption device for low-resistance substances.
  • the above-mentioned processing device in some embodiments of the present invention can also be used in combination with a refrigeration device, a catalytic device, a corona device, a heating device, a centrifugal device, a screening device, an electromagnetic device, an irradiation device, etc., to achieve condensation.
  • the above devices can also be combined arbitrarily according to site needs.
  • the current theory of electrostatic field charging is to use corona discharge to ionize oxygen and generate a large amount of negative oxygen ions.
  • the negative oxygen ions are in contact with dust, and the dust is charged, and the charged dust is adsorbed by the opposite electrode.
  • low-resistance materials such as water mist, metal particles, and conductive dust, the existing electric field has almost no adsorption effect.
  • the low specific resistance material is easy to lose electricity after being energized, when the moving negative oxygen ions charge the low specific resistance material, the low specific resistance material will quickly lose electricity, and the negative oxygen ions only move once, resulting in low It is difficult to recharge after the specific resistance is de-energized, or this charging method greatly reduces the probability of charging the low specific resistance material, so that the low specific resistance material is in an uncharged state, so that it is difficult for the different poles to continuously apply adsorption force to the low specific resistance material , Which ultimately leads to extremely low adsorption efficiency of the existing electric field for low specific resistance substances.
  • the above-mentioned processing device and processing method do not use a charging method to charge these low-resistance materials, but directly transfer electrons to the low-resistance material to be charged. After losing power again, new electrons will be quickly transferred from the conductive electrode and through other low-resistance materials to the low-resistance material that has lost power, so that the low-resistance material can quickly gain electricity after losing power, which greatly increases
  • the charging probability of the low-resistance material such as this repetition, makes the low-resistance material as a whole in an electrified state, and enables the adsorption pole to continue to apply attractive force to the low-resistance material until the low-resistance material is adsorbed, thereby ensuring the processing device
  • the collection efficiency of low specific resistance materials is higher.
  • the above-mentioned method of charging low-resistance materials adopted by the present invention does not require corona wires, corona electrodes, or corona plates, etc., which simplifies the overall structure of the processing device and reduces the manufacturing cost of the processing device.
  • the present invention adopts the above-mentioned power-on method, so that a large number of electrons on the conductive electrode will be transferred to the adsorption electrode through the low-resistance substance and form a current.
  • the concentration of the low specific resistance material flowing through the processing device is greater, the electrons on the conductive electrode are more easily transferred to the adsorption electrode through the low specific resistance material, and more electrons will be transferred between the low specific resistance materials, making the conductive electrode
  • the current formed between the adsorption electrode and the adsorption electrode is larger, and the charging probability of the low specific resistance material is higher, and the collection efficiency of the low specific resistance material of the processing device is higher.
  • the above-mentioned treatment method can be used as a new method for de-whitening and defogging of the chimney.
  • the processing device of the present invention can be added to the wet electric precipitator.
  • a method for processing a material with low specific resistance includes the following steps:
  • the conductive electrode charges the low specific resistance material, and the adsorption electrode exerts an attractive force on the charged low specific resistance material, causing the low specific resistance material to move to the adsorption electrode until the low specific resistance material adheres to it.
  • the adsorption is extremely high.
  • the step of flowing the low specific resistance material through the conductive electrode includes: electrons are transferred between the low specific resistance material located between the conductive electrode and the adsorption electrode, so that more low specific resistance materials are charged. .
  • electrons are conducted between the conductive electrode and the adsorbing electrode through a material with low specific resistance, and a current is formed.
  • the step of flowing the low-resistance material through the conductive electrode includes: the conductive electrode charges the low-resistance material by contacting the low-resistance material.
  • the low-resistance substances attached to the adsorption electrode are gathered together.
  • the gas with nitric acid mist flows through the conductive electrode; when the gas with nitric acid mist flows through the conductive electrode, the conductive electrode charges the nitric acid mist in the gas, and the adsorption electrode exerts attractive force on the charged nitric acid mist , Make the nitric acid mist move to the adsorption pole until the nitric acid mist adheres to the adsorption pole.
  • the step of introducing electrons into the nitric acid mist by the conductive electrode includes: electrons are transferred between the mist droplets located between the conductive electrode and the adsorption electrode, so that more mist droplets are charged.
  • electrons are conducted between the conductive electrode and the adsorption electrode through the nitric acid mist, and a current is formed.
  • the step of introducing electrons into the nitric acid mist by the conductive electrode includes: charging the nitric acid mist by contacting the conductive electrode with the nitric acid mist.
  • the present invention further includes a housing, the inlet and the outlet are both provided on the housing, the conductive electrode and the adsorption electrode are both installed in the housing, and the flow channel is located in the housing at the inlet and the outlet. between.
  • a method for processing a material with low specific resistance includes the following steps:
  • the conductive electrode is provided with at least one through hole, and when the low specific resistance material passes through the through hole on the conductive electrode, the low specific resistance material passes through the conductive electrode to make the low specific resistance material charged.
  • the step of conducting electrons to the low-resistance material with the conductive electrode includes: allowing the electrons to proceed between the low-resistance material located between the conductive electrode and the adsorption electrode. Transfer to charge more low specific resistance materials.
  • the conductive electrode and the adsorption electrode conduct electrons through a material with low specific resistance and form a current, which is the discharge current of the conductive electrode.
  • the step of conducting electrons to the low specific resistance material with the conductive electrode includes: the conductive electrode charges the low specific resistance material by contacting the low specific resistance material.
  • the conductive electrode and the adsorption electrode are both installed in a housing, and the housing has an inlet and an outlet.
  • the casing further includes a flow passage, and the flow passage is located in the casing between the inlet and the outlet.
  • the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%.
  • a low-resistance material processing device including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • Adsorption electrode which can exert attractive force on charged low specific resistance material
  • At least one through hole is provided on the conductive electrode.
  • the low specific resistance material when the low specific resistance material passes through the through hole on the conductive electrode, the low specific resistance material passes through the conductive electrode to charge the low specific resistance material.
  • a housing with an inlet and an outlet is further included, and the conductive electrode and the adsorption electrode are both installed in the housing.
  • the casing further includes a flow passage, and the flow passage is located in the casing between the inlet and the outlet.
  • the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%.
  • a method for processing a material with low specific resistance includes the following steps:
  • the low specific resistance material enters the flow channel from the inlet and moves toward the outlet direction; the conductive electrode is used to conduct electrons to the low specific resistance material to charge the low specific resistance material;
  • the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%.
  • the step of conducting electrons to the low specific resistance material with the conductive electrode includes: electrons are transferred between the low specific resistance material located between the conductive electrode and the adsorption electrode , So that more low specific resistance materials are charged.
  • the conductive electrode and the adsorption electrode conduct electrons through a material with low specific resistance and form a current, which is the discharge current of the conductive electrode.
  • the step of conducting electrons to the low specific resistance material with the conductive electrode includes: the conductive electrode charges the low specific resistance material by contacting the low specific resistance material.
  • the conductive electrode and the adsorption electrode are both installed in a housing, and the housing has an inlet and an outlet.
  • the flow channel is located in the housing between the inlet and the outlet.
  • a low-resistance material processing device including:
  • the conductive electrode located in the flow channel, can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole located in the flow channel, can exert an attractive force on the charged low specific resistance material
  • the ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the flow channel is 99%-10%.
  • the conductive electrode is used to conduct electrons to the low specific resistance material.
  • Conduction means that when the guide electrode is in contact with the uncharged low specific resistance material, the electrons on the conductive electrode are transferred to the low specific resistance material. , The low specific resistance material is charged with the same charge as the conductive electrode, and the charged low specific resistance material transfers the charge to other uncharged low specific resistance materials, so that more low specific resistance materials are charged.
  • this embodiment provides a low-resistance substance processing device, including:
  • the conductive electrode 301 can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption electrode 302 can apply an attractive force to the charged low specific resistance material.
  • the low specific resistance material processing device in this embodiment further includes a housing 303 having an inlet 3031 and an outlet 3032, and the conductive electrode 301 and the adsorption electrode 302 are both installed in the housing 303.
  • the conductive electrode 301 is fixed to the inner wall of the housing 303 through the insulating member 304, and the adsorption electrode 302 is directly fixed to the housing 303.
  • the insulating member 304 has a column shape, which is also called an insulating column.
  • the insulating member 304 may also be tower-shaped. The insulator 304 mainly prevents pollution and leakage.
  • the conductive electrode 301 and the adsorption electrode 302 are both mesh-shaped (that is, a plurality of through holes are provided on the conductive electrode and the adsorption electrode), and both are between the inlet 3031 and the outlet 3032.
  • the conductive electrode 301 has a negative potential
  • the adsorption electrode 302 has a positive potential.
  • the housing 303 and the adsorption electrode 302 have the same electric potential, and the housing 303 also has an adsorption effect on charged substances.
  • the casing is provided with a flow channel 3036
  • the conductive electrode 301 and the adsorption electrode 302 are both installed in the flow channel 3036
  • the cross-sectional area ratio of the conductive electrode 301 to the cross-sectional area of the flow channel 3036 is 70%.
  • This embodiment also provides a low-resistance substance treatment method for treating industrial exhaust gas containing acid mist (in this embodiment, the industrial exhaust gas is engine exhaust), including the following steps: Conducting electrons to the industrial exhaust gas by a conductive electrode 301 The acid mist is charged; the adsorption electrode 302 is used to attract the charged acid mist, and the charged acid mist is moved to the adsorption electrode 302.
  • the inlet 3031 is connected to the port for discharging industrial exhaust gas.
  • the working process and working principle are as follows: Industrial exhaust gas flows into the housing 303 from the inlet 3031 and flows out through the outlet 3032; in the process , The industrial exhaust gas will flow through the conductive electrode 301.
  • the conductive electrode 301 transfers electrons to the acid mist, and the acid mist is charged.
  • the adsorption electrode 302 exerts an attractive force on the charged acid mist, and the acid mist moves to the adsorption electrode 302 and adheres to the adsorption electrode 302; because the acid mist has the characteristics of being easy to carry and easy to lose electricity, a certain charged mist drops on the adsorption electrode 302 will lose electricity again during the moving process. At this time, other charged droplets will quickly transfer electrons to the lost droplets.
  • the droplets are in a continuously charged state, and the adsorption electrode 302 can continue to apply to the droplets.
  • the voltage between the conductive electrode and the adsorption electrode is the power-on driving voltage 12KV 2 Lead discharge current 0.01A 3
  • Initial corona voltage 5.5KV 4 The ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the runner 70% 5
  • the conductive electrode 301 and the adsorption electrode 302 constitute an adsorption unit.
  • the low specific resistance material processing device and processing method in this embodiment can remove 80% of the acid mist in the industrial exhaust gas, greatly reducing the discharge of acid mist, and having a significant environmental protection effect.
  • the conductive electrode 301 is provided with three first connection portions 3011, and the three first connection portions 3011 are respectively connected to the three second connections on the inner wall of the housing 303 through three insulators 304.
  • This connection form can effectively enhance the connection strength between the conductive electrode 301 and the housing 303.
  • the first connecting portion 3011 has a cylindrical shape.
  • the first connecting portion 3011 may also have a tower shape or the like.
  • the insulating member 304 is cylindrical, and in other embodiments, the insulating member 304 may also be tower-shaped.
  • the second connecting portion is cylindrical, in other embodiments the insulating member 304 may also be tower-shaped. As shown in FIG.
  • the housing 303 in this embodiment includes a first barrel portion 3033, a second barrel portion 3034, and a third barrel portion 3035 that are sequentially distributed from the inlet 3031 to the outlet 3032.
  • the inlet 3031 is located at one end of the first barrel portion 3033, and the outlet 3032 is located at one end of the third barrel portion 3035.
  • the outline size of the first barrel portion 3033 gradually increases from the inlet 3031 to the outlet 3032, and the outline size of the third barrel portion 3035 gradually decreases from the inlet 3031 to the outlet 3032.
  • the cross section of the second barrel 3034 in this embodiment is rectangular.
  • the housing 303 adopts the above-mentioned structural design, so that the exhaust gas reaches a certain inlet flow rate at the inlet 3031, and more importantly, it can make the airflow distribution more uniform, so that the medium in the exhaust gas, such as mist droplets, is more easily excited on the conductive electrode 301 Charged under action.
  • the casing 303 is more convenient to encapsulate, reduces the amount of materials, and saves space. It can be connected by pipes, and it is also considered for insulation. Any shell 303 that can achieve the above effects is acceptable.
  • the inlet 3031 and the outlet 3032 are both circular.
  • the inlet 3031 may also be called an air inlet, and the outlet 3032 may also be called an air outlet.
  • the diameter of the inlet 3031 is 300mm-1000mm, specifically 500mm.
  • the diameter of the outlet 3032 in this embodiment is 300mm-1000mm, specifically 500mm.
  • this embodiment provides a low-resistance material processing device, including:
  • the conductive electrode 301 can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption electrode 302 can apply an attractive force to the charged low specific resistance material.
  • the low specific resistance material processing device in this embodiment further includes a housing 303 having an inlet 3031 and an outlet 3032, and the conductive electrode 301 and the adsorption electrode 302 are both installed in the housing 303.
  • the conductive electrode 301 is fixed to the inner wall of the housing 303 through the insulating member 304, and the adsorption electrode 302 is directly fixed to the housing 303.
  • the insulating member 304 has a column shape, which is also called an insulating column.
  • the conductive electrode 301 has a negative potential
  • the adsorption electrode 302 has a positive potential.
  • the housing 303 and the adsorption electrode 302 have the same electric potential, and the housing 303 also has an adsorption effect on charged substances.
  • This embodiment also provides a processing method using the above-mentioned low-resistance substance processing device for processing industrial exhaust gas containing acid mist, including the following steps: using a conductive electrode 301 to conduct electrons to the acid mist in the industrial exhaust gas to charge the acid mist ; Use the adsorption electrode 302 to attract the charged acid mist, so that the charged acid mist moves to the adsorption electrode 302.
  • the inlet 3031 is connected to the port for discharging industrial exhaust gas.
  • the working process and working principle are as follows: the industrial exhaust gas flows into the housing 303 from the inlet 3031 and flows out through the outlet 3032; in this process , The industrial exhaust gas will flow through one of the conductive electrodes 301 first.
  • the conductive electrode 301 transfers electrons to the acid mist , Part of the acid mist is charged, and the adsorption pole 302 exerts an attractive force on the charged acid mist, and the acid mist moves to the adsorption pole 302 and adheres to the adsorption pole 302; another part of the acid mist is not adsorbed on the adsorption pole 302, this part The acid mist continues to flow toward the outlet 3032.
  • the processing device and method in this embodiment can remove the industrial exhaust gas.
  • the inlet 3031 and the outlet 3032 in this embodiment are both circular, the inlet 3031 can also be called an air inlet, and the outlet 3032 can also be called an air outlet.
  • the voltage between the conductive electrode and the adsorption electrode is the power-on driving voltage 5KV 2 Lead discharge current 0.005A 3
  • Initial corona voltage 5.5KV 4 The ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the runner 75% 5
  • This embodiment provides a low specific resistance material processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • the conductive electrode is in a mesh shape, and the conductive electrode has a negative potential.
  • the adsorption electrode in this embodiment is planar, and the adsorption electrode has a positive potential, and the adsorption electrode is also called a collector.
  • the adsorption electrode is specifically planar, and the conductive electrode is parallel to the adsorption electrode.
  • a mesh electric field is formed between the conductive electrode and the adsorption electrode.
  • the conductive electrode is a mesh structure made of metal wire, and the conductive electrode is composed of a metal wire mesh. The area of the adsorption electrode in this embodiment is larger than the area of the conductive electrode.
  • This embodiment provides a low specific resistance material processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • the conductive electrode is in a mesh shape, and the conductive electrode has a negative potential.
  • the adsorption electrode in this embodiment is barrel-shaped, and the adsorption electrode has a positive potential, and the adsorption electrode is also called a collector.
  • the conductive electrode is fixed by a metal wire or a metal needle.
  • the conductive electrode is located at the geometric symmetry center of the barrel-shaped adsorption electrode. In this embodiment, a net barrel electric field is formed between the conductive electrode and the adsorption electrode.
  • This embodiment provides a low specific resistance material processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • the conductive electrode is located between the two adsorption electrodes.
  • the length of the conductive electrode in the left-right direction is greater than the length of the adsorption electrode in the left-right direction.
  • the left end of the conductive electrode is located on the left of the adsorption electrode. square.
  • the left end of the conductive electrode and the left end of the suction electrode form a line of electric force extending in an oblique direction.
  • an asymmetric electric field is formed between the conductive electrode and the adsorption electrode.
  • This embodiment provides a low specific resistance material processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • the conductive electrode and the adsorption electrode constitute an adsorption unit.
  • all the adsorption units are specifically distributed along the left and right directions.
  • This embodiment provides a low specific resistance material processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • the conductive electrode and the adsorption electrode constitute an adsorption unit.
  • This embodiment provides a low specific resistance material processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • the conductive electrode and the adsorption electrode constitute an adsorption unit.
  • This embodiment provides a low specific resistance material processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • the conductive electrode and the adsorption electrode constitute an adsorption unit.
  • This embodiment provides a low specific resistance material processing device, including:
  • the conductive electrode can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance material is charged;
  • the adsorption pole can exert attractive force on charged low specific resistance materials.
  • the conductive electrode and the adsorption electrode constitute an adsorption unit.
  • This embodiment provides an engine-based gas processing system, including the above-mentioned low specific resistance material processing device and a Venturi plate.
  • the low specific resistance material processing device is used in combination with the venturi plate.
  • This embodiment provides an engine-based gas treatment system, which includes the above-mentioned low specific resistance substance treatment device, a Venturi plate, a NOx oxidation catalyst device, and an ozone decomposing device.
  • the low specific resistance material processing device and the Venturi plate are located between the NOx oxidation catalytic device and the ozone digestion device.
  • the NOx oxidation catalytic device has a NOx oxidation catalyst
  • the ozone decomposition device has an ozone decomposition catalyst.
  • This embodiment provides an engine-based gas processing system, including the above-mentioned low specific resistance substance processing device, corona device and venturi plate, wherein the low specific resistance substance processing device is located between the corona device and the venturi plate.
  • This embodiment provides an engine-based gas processing system, including the above-mentioned low specific resistance substance processing device, a heating device, and an ozone digestion device, wherein the heating device is located between the low specific resistance substance processing device and the ozone digestion device.
  • This embodiment provides an engine-based gas processing system, including the above-mentioned low specific resistance substance processing device, a centrifugal device and a venturi plate, wherein the low specific resistance substance processing device is located between the centrifugal device and the venturi plate.
  • This embodiment provides an engine-based gas processing system, including the above-mentioned low-resistance substance processing device, corona device, venturi plate, and molecular sieve.
  • the Chinese slab and low-resistance substance processing device are located in the corona device and molecular sieve. between.
  • This embodiment provides an engine-based gas processing system, including the above-mentioned low specific resistance substance processing device, corona device and electromagnetic device, wherein the low specific resistance substance processing device is located between the corona device and the electromagnetic device.
  • This embodiment provides an engine-based gas processing system, including the above-mentioned low specific resistance substance processing device, corona device, and irradiation device, wherein the irradiation device is located between the corona device and the low specific resistance substance processing device.
  • This embodiment provides an engine-based gas processing system, including the above-mentioned low-resistance material processing device, corona device, and wet electric dust removal device, wherein the wet electric dust removing device is located between the corona device and the low specific resistance material processing device.
  • FIG. 6 provides an engine-based gas processing system, including an air intake device.
  • FIG. 1 is a schematic structural diagram of the air intake device.
  • the air intake device 101 includes an air inlet 1011, a separation mechanism 1012, a first water filtering mechanism 1013, an electrostatic dust removal mechanism 1014, an insulation mechanism 1015, an air equalization mechanism, a second water filtering mechanism 1017 and/or an ozone mechanism 1018.
  • the first water filtering mechanism 1013 is a low specific resistance material processing device provided by the present invention.
  • the air inlet 1011 is provided on the air inlet wall of the separation mechanism 1012 to receive gas with particulate matter.
  • the electrostatic precipitating mechanism 1014 includes an anode dust accumulating part 10141 and a first cathode discharging part 10142 arranged in the anode dust accumulating part 10141.
  • An asymmetric electrostatic field is formed between the anode dust accumulating part 10141 and the cathode discharging part 10142.
  • the first water filter mechanism 1013 arranged in the separation mechanism 1012 includes a conductive electrode and a conductive mesh plate arranged in the air inlet 1011, and the conductive mesh plate is used to conduct electrons to the low ratio after being powered on. Resistance substance.
  • the adsorption pole for adsorbing the charged low-resistance material is the anode dust collecting part 10141 of the electrostatic dust removal mechanism 1014 in this embodiment.
  • FIG. 7 shows a schematic structural diagram of another embodiment of the first water filter mechanism disposed in the air intake device.
  • the conductive electrode 10131 of the first water filter mechanism is disposed at the air inlet, and the conductive electrode 10131 is a conductive mesh plate with a negative potential.
  • the adsorption electrode 10132 is arranged in the air intake device in a surface mesh shape, and the adsorption electrode 10132 has a positive potential.
  • the adsorption electrode 10132 is also called a collector.
  • the adsorption electrode 10132 has a planar mesh shape, and the conductive electrode 10131 is parallel to the adsorption electrode 10132.
  • a mesh electric field is formed between the conductive electrode 10131 and the adsorption electrode 10132.
  • the conductive electrode 10131 is a mesh structure made of metal wire, and the conductive electrode 10131 is formed of a metal wire mesh.
  • the area of the adsorption electrode 10132 is larger than the area of the conductive electrode 10131.
  • the engine-based gas treatment system also includes an exhaust gas treatment device.
  • the exhaust gas treatment device includes a third water filter mechanism.
  • the first water filter mechanism is also applicable to the third filter of the exhaust gas treatment device of the engine-based gas treatment system. Water agency.
  • a diesel engine exhaust gas treatment system includes:
  • Nitrogen oxide (NO x ) removal device for removing nitrogen oxides (NO x ) from diesel engine exhaust;
  • the nitrogen oxide removal (NO x ) device includes: an ozone source such as ozone generator 201 for providing ozone; reaction field 202, for a diesel engine exhaust with ozone reaction mixture; denitration apparatus 203, for removing the diesel engine exhaust gas by denitrification after oxide (NO x) in the processing apparatus nitrate; 203 comprising a denitrator
  • the electrocoagulation defogging unit 2031 is a low-resistance substance processing device, used to electrocoagulate the engine exhaust after ozone treatment, and the water mist containing nitric acid is deposited on the adsorption electrode in the low-resistance substance processing device.
  • the denitrification device 203 also includes a denitrification liquid collection unit 2032 for storing the nitric acid aqueous solution and/or nitrate aqueous solution removed from the exhaust gas; an ozone digester 204 for digesting ozone in the exhaust gas of the diesel engine after the denitration device .
  • the ozone digester can digest ozone by ultraviolet, catalysis and other methods.
  • the low specific resistance material processing device that is, the electrocoagulation defogging unit 2031 includes: a conductive electrode 301, which can conduct electrons to the low specific resistance material; when the electrons are conducted to the low specific resistance material, the low specific resistance The substance is charged; the adsorption pole 302 can exert attractive force on the charged low specific resistance substance.
  • the low specific resistance material processing device in this embodiment further includes a housing 303 having an inlet 3031 and an outlet 3032, and the conductive electrode 301 and the adsorption electrode 302 are both installed in the housing 303.
  • the conductive electrode 301 is fixed to the inner wall of the outer shell 303 through the insulating member 304, and the adsorption electrode 302 is directly fixed to the outer shell 303.
  • the insulating member 304 has a column shape, which is also called an insulating column.
  • the conductive electrode 301 has a negative potential
  • the adsorption electrode 302 has a positive potential.
  • the housing 303 and the adsorption electrode 302 have the same electric potential, and the housing 303 also has an adsorption effect on charged substances.
  • This embodiment also provides a processing method using the above-mentioned low-resistance substance processing device for processing industrial exhaust gas containing acid mist, including the following steps: using a conductive electrode 301 to conduct electrons to the acid mist in the industrial exhaust gas to charge the acid mist ; Use the adsorption electrode 302 to attract the charged acid mist, so that the charged acid mist moves to the adsorption electrode 302.
  • the inlet 3031 is connected to the port for discharging industrial exhaust gas.
  • the working process and working principle are as follows: the industrial exhaust gas flows into the housing 303 from the inlet 3031 and flows out through the outlet 3032; in this process, the industrial exhaust gas will flow first Via one of the conductive electrodes 301, when the acid mist in the industrial exhaust gas comes into contact with the conductive electrode 301 or the distance from the conductive electrode 301 reaches a certain value, the conductive electrode 301 transfers electrons to the acid mist, and part of the acid mist is charged.
  • the adsorption pole 302 exerts an attraction force on the charged acid mist, and the acid mist moves to the adsorption pole 302 and adheres to the adsorption pole 302; another part of the acid mist is not adsorbed on the adsorption pole 302, and this part of the acid mist continues to the outlet 3032
  • the part of the acid mist is in contact with another conductive electrode 301, or when the distance from the other conductive electrode 301 reaches a certain value, the part of the acid mist will be charged, and the housing 303 will apply adsorption force to the part of the charged acid mist , So that this part of the charged acid mist is attached to the inner wall of the housing 303, thereby greatly reducing the discharge of acid mist in the industrial exhaust gas, and the processing device and method in this embodiment can remove 90% of the acid mist in the industrial exhaust gas.
  • the effect of removing acid mist is very significant.
  • the inlet 3031 and the outlet 3032 in this embodiment are both circular, the inlet
  • the voltage between the conductive electrode and the adsorption electrode is the power-on driving voltage 12KV 2 Lead discharge current 0.018A 3
  • Initial corona voltage 6.5KV 4 The ratio of the cross-sectional area of the conductive electrode to the cross-sectional area of the runner 90% 5
  • the present invention effectively overcomes various shortcomings in the prior art and has high industrial value.

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Abstract

一种低比电阻物质处理方法及处理装置,处理方法包括如下步骤:用导电极(301)将电子传导给低比电阻物质,使低比电阻物质带电;用吸附极(302)吸引带电的低比电阻物质,使带电的低比电阻物质向吸附极(302)移动。通过传导电子的方式使低比电阻物质带电,克服了低比电阻物质带电后容易失电所带来的问题,使得低比电阻物质在失去电子后又能快速得到电子,增加了使低比电阻物质带电的几率,并使得低比电阻物质保持带电状态,吸附极(302)能持续给低比电阻物质施加吸引力,以将低比电阻物质吸附住,并使得低比电阻物质处理方法对低比电阻物质的收集能力强、收集效率高。

Description

低比电阻物质处理方法及处理装置 技术领域
本发明涉及一种低比电阻物质处理方法及处理装置,特别是涉及一种收集低比电阻物质的效率更高的低比电阻物质处理方法及处理装置。
背景技术
当前环保领域历经除尘、脱硫、脱硝、除雾等环节,烟囱排放的黑烟、蓝烟、黄烟没有了,却多了白烟。白烟的成分中大部分为水雾,其中还夹杂细颗粒、铵盐、钙、硝酸、气溶胶等,这些是当前急需解决的主要污染物。目前使用的旋风除尘器、布袋除尘器、冷凝除雾器、湿电除尘器、酸雾除雾器等等基本无效。比如,在臭氧脱硝以及锅炉、烧结机烟气湿法治理末端,使用除雾器去除烟气带水,而实际除雾器由于温差以及细雾特性,根本达不到去除效果。当前主要使用湿式静电除尘器作为治理手段,但由于结构和荷电原理偏差,无法让水雾带电并吸附,对治理白烟的效率也极低。这样,大量的上述污染物排放到大气中,形成雾霾和酸雨。由于有逃逸粉尘、铵盐、脱硫剂、脱硝剂、芬、高价重金属等夹带排放,严重影响到当地人的健康。同时,大量排放工业水,不利于节约水资源。
上述排出的水雾为低比电阻物质,现有处理低比电阻物质的技术存在低比电阻物质带电后容易失电所带来的问题,无法实现去除排入空气中的低比电阻物质,例如工业尾气中的酸雾净化、收集问题仍是当今亟需解决的技术问题。
发明内容
鉴于以上所述现有技术的缺点,本发明要解决的技术问题在于提供一种低比电阻物质处理方法和装置,能收集低比电阻物质,收集效率高。
为实现上述目的及其他相关目的,本发明提供以下示例:
1.本发明提供的示例1:一种低比电阻物质处理方法,包括如下步骤:
用导电极将电子传导给所述低比电阻物质,使所述低比电阻物质带电;
用吸附极吸引带电的所述低比电阻物质,使带电的所述低比电阻物质向所述吸附极移动。
2.本发明提供的示例2:包括示例1所述低比电阻物质处理方法,其中,所述用导电极将电子传导给所述低比电阻物质的步骤包括:电子在位于所述导电极和所述吸附极之间的低比 电阻物质之间进行传递,使更多低比电阻物质带电。
3.本发明提供的示例3:包括示例1或2所述低比电阻物质处理方法,其中,所述导电极和所述吸附极之间通过低比电阻物质传导电子、并形成电流。
4.本发明提供的示例4:包括示例1-3任一项所述低比电阻物质处理方法,其中,所述用导电极将电子传导给所述低比电阻物质的步骤包括:所述导电极通过与低比电阻物质接触的方式使低比电阻物质带电。
5.本发明提供的示例5:包括示例1-4任一项所述低比电阻物质处理方法,其中,所述导电极呈面状、网状、孔板状、板状、球笼状、盒状、或管状。
6.本发明提供的示例6:包括示例1-5任一项所述低比电阻物质处理方法,其中,所述导电极为固体、液体、气体分子团、等离子体、导电混合态物质、生物体自然混合导电物质或物体人工加工形成导电物质中的一种或多种形态的组合。
7.本发明提供的示例7:包括示例1-6任一项所述低比电阻物质处理方法,其中,所述导电极为固态金属、石墨或含离子导电液体。
8.本发明提供的示例8:包括示例1-7任一项所述低比电阻物质处理方法,其中,所述吸附极呈多层网状、网状、孔板状、管状、桶状、球笼状、盒状、板状、颗粒堆积层状或折弯板状。
9.本发明提供的示例9:包括示例1-8任一项所述低比电阻物质处理方法,其中,所述导电极上设有至少一个通孔。
10.本发明提供的示例10:包括示例9任一项所述低比电阻物质处理方法,其中,所述用导电极将电子传导给所述低比电阻物质的步骤包括:使所述低比电阻物质通过所述导电极的通孔,使所述低比电阻物质带电。
11.本发明提供的示例11:包括示例9或10所述低比电阻物质处理方法,其中,所述导电极上的通孔的形状为多角形、圆形、椭圆形、正方形、长方形、梯形、或菱形。
12.本发明提供的示例12:包括示例9-11任一项所述低比电阻物质处理方法,其中,所述导电极上的通孔的孔径为0.1-3毫米。
13.本发明提供的示例13:包括示例1-12任一项所述低比电阻物质处理方法,其中,所述吸附极上设有至少一个通孔。
14.本发明提供的示例14:包括示例13所述低比电阻物质处理方法,其中,所述吸附极的通孔的形状为多角形、圆形、椭圆形、正方形、长方形、梯形、或菱形。
15.本发明提供的示例15:包括示例13或14所述低比电阻物质处理方法,其中,所述吸 附极的通孔的孔径为0.1-3毫米。
16.本发明提供的示例16:包括示例1-15任一项所述低比电阻物质处理方法,其中,所述吸附极由导电物质制成,或所述吸附极的表面具有导电物质。
17.本发明提供的示例17:包括示例1-16任一项所述低比电阻物质处理方法,其中,所述导电极与所述吸附极之间形成电场。
18.本发明提供的示例18:包括示例1-17任一项所述低比电阻物质处理方法,其中,所述导电极垂直或平行于所述吸附极。
19.本发明提供的示例19:包括示例1-18任一项所述低比电阻物质处理方法,其中,所述导电极呈网状,所述吸附极呈面状,所述导电极平行于所述吸附极。
20.本发明提供的示例20:包括示例1-19任一项所述低比电阻物质处理方法,其中,所述导电极和吸附极均呈面状,且所述导电极与所述吸附极相平行。
21.本发明提供的示例21:包括示例1-20任一项所述低比电阻物质处理方法,其中,所述导电极采用金属丝网。
22.本发明提供的示例22:包括示例1-21任一项所述低比电阻物质处理方法,其中,所述导电极呈平面状或球面状。
23.本发明提供的示例23:包括示例1-22任一项所述低比电阻物质处理方法,其中,所述吸附极呈曲面状或球面状。
24.本发明提供的示例24:包括示例1-23任一项所述低比电阻物质处理方法,其中,所述导电极与上电电源的一个电极电性连接,所述吸附极与上电电源的另一个电极电性连接。
25.本发明提供的示例25:包括示例1-24任一项所述低比电阻物质处理方法,其中,所述导电极与上电电源的负极电性连接,所述吸附极与上电电源的正极电性连接。
26.本发明提供的示例26:包括示例1-25任一项所述低比电阻物质处理方法,其中,上电电源的上电驱动电压范围可以为5-50KV。
27.本发明提供的示例27:包括示例1-26任一项所述低比电阻物质处理方法,其中,所述上电电源的上电驱动电压小于起始起晕电压。
28.本发明提供的示例28:包括示例1-27任一项所述低比电阻物质处理方法,其中,所述上电电源的上电驱动电压为0.1-2kv/mm。
29.本发明提供的示例29:包括示例1-28任一项所述低比电阻物质处理方法,其中,所述上电电源的上电驱动电压波形为直流波形、正弦波、或调制波形。
30.本发明提供的示例30:包括示例1-29任一项所述低比电阻物质处理方法,其中,所 述电源为交流电源,所述上电电源的变频脉冲范围为0.1Hz-5GHz。
31.本发明提供的示例31:包括示例1-30任一项所述低比电阻物质处理方法,其中,所述导电极和吸附极均沿左右方向延伸,所述导电极的左端位于吸附极的左端的左方。
32.本发明提供的示例32:包括示例1-31任一项所述低比电阻物质处理方法,其中,所述吸附极有两个,所述导电极位于两个吸附电极之间。
33.本发明提供的示例33:包括示例1-32任一项所述低比电阻物质处理方法,其中,所述导电极和吸附极构成吸附单元,所述吸附单元有多个。
34.本发明提供的示例34:包括示例1-33任一项所述低比电阻物质处理方法,其中,全部吸附单元沿纵向、横向、斜向、螺旋方向中的一个方向或多个方向上进行分布。
35.本发明提供的示例35:包括示例1-34任一项所述低比电阻物质处理方法,其中,所述导电极和所述吸附极均安装在一外壳内,所述外壳具有进口和出口。
36.本发明提供的示例36:包括示例1-35任一项所述低比电阻物质处理方法,其中,还包括流道,所述流道位于外壳中位于进口和出口之间。
37.本发明提供的示例37:包括示例35或36所述低比电阻物质处理方法,其中,所述进口呈圆形,且所述进口的直径为300-1000mm、或500mm。
38.本发明提供的示例38:包括示例35或36所述低比电阻物质处理方法,其中,所述出口呈圆形,且所述出口的直径为300-1000mm、或500mm。
39.本发明提供的示例39:包括示例1-38任一项所述低比电阻物质处理方法,其中,所述外壳的材质为金属、非金属、导体、非导体、水、各类导电液体、各类多孔材料、或各类泡沫材料。
40.本发明提供的示例40:包括示例1-39任一项所述低比电阻物质处理方法,其中,所述外壳的材质为不锈钢、铝合金、铁合金、导电液体、布、海绵、分子筛、活性炭、泡沫铁、或泡沫碳化硅。
41.本发明提供的示例41:包括示例1-40任一项所述低比电阻物质处理方法,其中,所述外壳包括由进口至出口方向依次分布的第一桶体、第二桶体、及第三桶体,所述进口位于第一桶体的一端,所述出口位于第三桶体的一端。
42.本发明提供的示例42:包括示例41所述低比电阻物质处理方法,其中,所述第一桶体的轮廓大小由进口至出口方向逐渐增大。
43.本发明提供的示例43:包括示例41或42所述低比电阻物质处理方法,其中,所述第一桶体呈直管状。
44.本发明提供的示例44:包括示例41-43任一项所述低比电阻物质处理方法,其中,所述第二桶体呈直管状,且所述导电极和所述吸附极安装在第二桶体中。
45.本发明提供的示例45:包括示例41-44任一项所述低比电阻物质处理方法,其中,所述第三桶体的轮廓大小由进口至出口方向逐渐减小。
46.本发明提供的示例46:包括示例41-45任一项所述低比电阻物质处理方法,其中,所述第二桶体的截面均呈矩形。
47.本发明提供的示例47:包括示例1-46任一项所述低比电阻物质处理方法,其中,所述导电极通过绝缘件与外壳固接。
48.本发明提供的示例48:包括示例47所述低比电阻物质处理方法,其中,所述绝缘件的材质为绝缘云母。
49.本发明提供的示例49:包括示例47或48所述低比电阻物质处理方法,其中,所述绝缘件呈柱状、或塔状。
50.本发明提供的示例50:包括示例1-49任一项所述低比电阻物质处理方法,其中,所述导电极上设有第一连接部,所述第一连接部与绝缘件固接。
51.本发明提供的示例51:包括示例1-50任一项所述低比电阻物质处理方法,其中,所述外壳内壁上设有第二连接部,所述第二连接部与绝缘件固接。
52.本发明提供的示例52:包括示例1-51任一项所述低比电阻物质处理方法,其中,所述导电极的截面面积与流道的截面面积比为99%-10%、或90-10%、或80-20%、或70-30%、或60-40%、或50%。
53.本发明提供的示例53:包括示例1-52任一项所述低比电阻物质处理方法,其中,所述低比电阻物质为液态、雾态、固态、或等离子态中的一种或多种形态的组合。
54.本发明提供的示例54:包括示例1-53任一项所述低比电阻物质处理方法,其中,所述低比电阻物质为导电液、导电雾、导电颗粒、带电液、带电雾、带电颗粒、水、乳化液、气溶胶、液化粉尘、多物混合液、多态混合液、多物多态混合液、水雾、乳化液雾、多物混合液雾、多态混合液雾、多物多态混合液雾、雾霾、蒸汽、酸雾、含水尾气、含水烟气、气态分子团、离子团、等离子体、导电粉末体、导电飞沫、导电尘、液中离子团、气中离子团、液中化合物、气中化合物中的一种或多种形态的组合。
55.本发明提供的示例55:包括示例1-54任一项所述低比电阻物质处理方法,其中,所述低比电阻物质为含水、乳化液、多物混合液、多态混合液、或多物多态混合液的生物体。
56.本发明提供的示例56:包括示例1-55任一项所述低比电阻物质处理方法,其中,所 述低比电阻物质为导体或半导体。
57.本发明提供的示例57:包括示例1-56任一项所述低比电阻物质处理方法,其中,包括如下步骤:
所述低比电阻物质由进口进入流道中,并朝向出口方向移动;当所述低比电阻物质经过所述极时,所述导电极将电子传导给低比电阻物质,低比电阻物质带电。
58.本发明提供的示例58:一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
59.本发明提供的示例59:包括示例58所述低比电阻物质处理装置,其中,所述导电极呈面状、网状、孔板状、板状、球笼状、盒状、或管状。
60.本发明提供的示例60:包括示例58或59所述低比电阻物质处理装置,其中,所述导电极为固体、液体、气体分子团、等离子体、导电混合态物质、生物体自然混合导电物质或物体人工加工形成导电物质中的一种或多种形态的组合。
61.本发明提供的示例61:包括示例58-60任一项所述低比电阻物质处理装置,其中,所述导电极为固态金属、石墨或含离子导电液体。
62.本发明提供的示例62:包括示例58-61任一项所述低比电阻物质处理装置,其中,所述吸附极呈多层网状、网状、孔板状、管状、桶状、球笼状、盒状、板状、颗粒堆积层状或折弯板状。
63.本发明提供的示例63:包括示例58-62任一项所述低比电阻物质处理装置,其中,所述导电极上设有至少一个通孔。
64.本发明提供的示例64:包括示例58-63任一项所述低比电阻物质处理装置,其中,所述用导电极将电子传导给所述低比电阻物质的步骤包括:使所述低比电阻物质通过所述导电极的通孔,使所述低比电阻物质带电。
65.本发明提供的示例65:包括示例63或64所述低比电阻物质处理装置,其中,所述导电极上的通孔的形状为多角形、圆形、椭圆形、正方形、长方形、梯形、或菱形。
66.本发明提供的示例66:包括示例63-64任一项所述低比电阻物质处理装置,其中,所述导电极上的通孔的孔径为0.1-3毫米。
67.本发明提供的示例67:包括示例58-66任一项所述低比电阻物质处理装置,其中,所述吸附极上设有至少一个通孔。
68.本发明提供的示例68:包括示例67所述低比电阻物质处理装置,其中,所述吸附极的通孔的形状为多角形、圆形、椭圆形、正方形、长方形、梯形、或菱形。
69.本发明提供的示例69:包括示例67或68所述低比电阻物质处理装置,其中,所述吸附极的通孔的孔径为0.1-3毫米。
70.本发明提供的示例70:包括示例58-69任一项所述低比电阻物质处理装置,其中,所述吸附极由导电物质制成,或吸附极的表面具有导电物质。
71.本发明提供的示例71:包括示例58-70任一项所述低比电阻物质处理装置,其中,所述导电极与吸附极之间形成电场。
72.本发明提供的示例72:包括示例58-71任一项所述低比电阻物质处理装置,其中,所述导电极垂直或平行于吸附极。
73.本发明提供的示例73:包括示例58-72任一项所述低比电阻物质处理装置,其中,所述导电极呈网状,吸附极呈面状,导电极平行于吸附极。
74.本发明提供的示例74:包括示例58-73任一项所述低比电阻物质处理装置,其中,所述导电极和吸附极均呈面状,且所述导电极与吸附极相平行。
75.本发明提供的示例75:包括示例58-74任一项所述低比电阻物质处理装置,其中,所述导电极采用金属丝网。
76.本发明提供的示例76:包括示例58-75任一项所述低比电阻物质处理装置,其中,所述导电极呈平面状或球面状。
77.本发明提供的示例77:包括示例58-76任一项所述低比电阻物质处理装置,其中,所述吸附极呈曲面状或球面状。
78.本发明提供的示例78:包括示例58-77任一项所述低比电阻物质处理装置,其中,所述导电极与上电电源的一个电极电性连接,所述吸附极与上电电源的另一个电极电性连接。
79.本发明提供的示例79:包括示例58-78任一项所述低比电阻物质处理装置,其中,所述导电极与上电电源的负极电性连接,所述吸附极与上电电源的正极电性连接。
80.本发明提供的示例80:包括示例58-79任一项所述低比电阻物质处理装置,其中,上电电源的上电驱动电压范围可以为5-50KV。
81.本发明提供的示例81:包括示例58-80任一项所述低比电阻物质处理装置,其中,所述上电电源的上电驱动电压小于起始起晕电压。
82.本发明提供的示例82:包括示例58-81任一项所述低比电阻物质处理装置,其中,所述上电电源的上电驱动电压为0.1kv/mm-2kv/mm。
83.本发明提供的示例83:包括示例58-82任一项所述低比电阻物质处理装置,其中,所述上电电源的上电驱动电压波形为直流波形、正弦波、或调制波形。
84.本发明提供的示例84:包括示例58-83任一项所述低比电阻物质处理装置,其中,所述电源为交流电源,所述上电电源的变频脉冲范围为0.1Hz-5GHz。
85.本发明提供的示例85:包括示例58-84任一项所述低比电阻物质处理装置,其中,所述导电极和吸附极均沿左右方向延伸,所述导电极的左端位于吸附极的左端的左方。
86.本发明提供的示例86:包括示例58-85任一项所述低比电阻物质处理装置,其中,所述吸附极有两个,所述导电极位于两个吸附电极之间。
87.本发明提供的示例87:包括示例58-86任一项所述低比电阻物质处理装置,其中,所述导电极和吸附极构成吸附单元,所述吸附单元有多个。
88.本发明提供的示例88:包括示例58-87任一项所述低比电阻物质处理装置,其中,全部吸附单元沿纵向、横向、、斜向、或螺旋方向中的一个方向或多个方向上进行分布。
89.本发明提供的示例89:包括示例58-88任一项所述低比电阻物质处理装置,其中,还包括具有进口和出口的外壳,所述导电极和吸附极均安装在所述外壳中。
90.本发明提供的示例90:包括示例58-89任一项所述低比电阻物质处理装置,其中,还包括流道,所述流道位于所述外壳中位于所述进口和所述出口之间。
91.本发明提供的示例91:包括示例89或90所述低比电阻物质处理装置,其中,所述进口呈圆形,且所述进口的直径为300-1000mm、或500mm。
92.本发明提供的示例92:包括示例89或90所述低比电阻物质处理装置,其中,所述出口呈圆形,且所述出口的直径为300-1000mm、或500mm。
93.本发明提供的示例93:包括示例58-92任一项所述低比电阻物质处理装置,其中,所述外壳的材质为金属、非金属、导体、非导体、水、各类导电液体、各类多孔材料、或各类泡沫材料。
94.本发明提供的示例94:包括示例58-93任一项所述低比电阻物质处理装置,其中,所述外壳的材质为不锈钢、铝合金、铁合金、导电液体、布、海绵、分子筛、活性炭、泡沫铁、或泡沫碳化硅。
95.本发明提供的示例95:包括示例58-94任一项所述低比电阻物质处理装置,其中,所述外壳包括由进口至出口方向依次分布的第一桶体、第二桶体、及第三桶体,所述进口位于第一桶体的一端,所述出口位于第三桶体的一端。
96.本发明提供的示例96:包括示例95所述低比电阻物质处理装置,其中,所述第一桶 体的轮廓大小由进口至出口方向逐渐增大。
97.本发明提供的示例97:包括示例95或96所述低比电阻物质处理装置,其中,所述第一桶体呈直管状。
98.本发明提供的示例98:包括示例95-97任一项所述低比电阻物质处理装置,其中,所述第二桶体呈直管状,且所述导电极和吸附极安装在第二桶体中。
99.本发明提供的示例99:包括示例95-98任一项所述低比电阻物质处理装置,其中,,所述第三桶体的轮廓大小由进口至出口方向逐渐减小。
100.本发明提供的示例100:包括示例95-99任一项所述低比电阻物质处理装置,其中,所述第二桶体的截面均呈矩形。
101.本发明提供的示例101:包括示例58-100任一项所述低比电阻物质处理装置,其中,所述导电极通过绝缘件与外壳固接。
102.本发明提供的示例102:包括示例39-101所述低比电阻物质处理装置,其中,所述绝缘件的材质为绝缘云母。
103.本发明提供的示例103:包括示例101或102所述低比电阻物质处理装置,其中,所述绝缘件呈柱状、或塔状。
104.本发明提供的示例104:包括示例58-103任一项所述低比电阻物质处理装置,其中,所述导电极上设有第一连接部,所述第一连接部与绝缘件固接。
105.本发明提供的示例105:包括示例58-104任一项所述低比电阻物质处理装置,其中,所述外壳内壁上设有第二连接部,所述第二连接部与绝缘件固接。
106.本发明提供的示例106:包括示例58-105任一项所述低比电阻物质处理装置,其中,所述导电极的截面面积与流道的截面面积比为99%-10%、或90-10%、或80-20%、或70-30%、或60-40%、或50%。
107.本发明提供的示例107:包括示例58-106任一项所述低比电阻物质处理装置,其中,所述低比电阻物质为液态、雾态、固态、或等离子态中的一种或多种形态的组合。
108.本发明提供的示例108:包括示例58-107任一项所述低比电阻物质处理装置,其中,所述低比电阻物质为导电液、导电雾、导电颗粒、带电液、带电雾、带电颗粒、水、乳化液、气溶胶、液化粉尘、多物混合液、多态混合液、多物多态混合液、水雾、乳化液雾、多物混合液雾、多态混合液雾、多物多态混合液雾、雾霾、蒸汽、酸雾、含水尾气、含水烟气、气态分子团、离子团、等离子体、导电粉末体、导电飞沫、导电尘、液中离子团、气中离子团、液中化合物、气中化合物中的一种或多种形态的组合。
109.本发明提供的示例109:包括示例58-108任一项所述低比电阻物质处理装置,其中,所述低比电阻物质为含水、乳化液、多物混合液、多态混合液、或多物多态混合液的生物体。
110.本发明提供的示例110:包括示例58-109任一项所述低比电阻物质处理装置,其中,所述低比电阻物质为导体或半导体。
111.本发明提供的示例111:包括用于示例58-110任一项所述低比电阻物质处理装置,其中,包括进口、出口、及位于进口和出口之间的流道,所述流道中安装有能将电子传导给低比电阻物质的导电极;且所述导电极的截面面积与流道的截面面积比为99%-10%,所述低比电阻物质处理装置还包括能给带电的低比电阻物质施加吸引力的吸附极。
本发明中的低比电阻物质处理装置工作原理为:利用导电极将电子传导给低比电阻物质,使得低比电阻物质带电,并利用吸附极给带电的低比电阻物质施加吸引力,以吸引低比电阻物质向吸附极移动,直至低比电阻物质附着在吸附极上,从而实现将低比电阻物质收集在吸附板上;同时,本发明中低比电阻物质处理装置,通过上述传导电子的方式使低比电阻物质带电,此种方式克服了低比电阻物质带电后容易失电所带来的问题,使得低比电阻物质在失去电子后又能快速得到电子,增加了使低比电阻物质带电的几率,并使得低比电阻物质保持带电状态,这样,吸附极就能持续给低比电阻物质施加吸引力,以将低比电阻物质吸附住,并使得本低比电阻物质处理装置对低比电阻物质的收集能力更强、收集效率更高。
本发明提供的低比电阻物质处理方法,能收集低比电阻物质,且收集效率更高。
如上所述,本发明涉及的处理方法,具有以下有益效果:
本发明基于上述方法实现了将低比电阻物质收集在吸附板上;且此种处理方法克服了低比电阻物质带电后容易失电所带来的问题,使得低比电阻物质在失去电子后又能快速得到电子,以保证低比电阻物质保持带电状态,这样,吸附极就能持续给低比电阻物质施加吸引力,以将低比电阻物质吸引住,进而使得本处理方法对低比电阻物质的收集效率更高。
本发明将导电极安装在流道中,且导电极的截面面积与流道的截面面积比为99%-10%,使得导电极能有效将电子传导给低比电阻物质。
附图说明
图1为本发明第一种实施例中低比电阻物质处理装置的结构示意图。
图2为本发明第一种实施例中低比电阻物质处理装置的左视图。
图3为本发明第一种实施例中低比电阻物质处理装置的立体图。
图4为本发明第二种实施例中低比电阻物质处理装置的结构示意图。
图5为本发明第二种实施例中低比电阻物质处理装置的俯视图。
图6为本发明第二十种实施例中基于发动机的气体处理***中进气装置于一实施例中的结构示意图。
图7为本发明第二十种实施例中基于发动机的气体处理***中设置于进气装置内的第一滤水机构的另一实施例结构示意图。
图8为本发明实施例第二十一种实施例中柴油发动机的尾气处理***的原理结构示意图。
元件标号说明
301                    导电极
3011                   第一连接部
302                    吸附极
303                    外壳
3031                   进口
3032                   出口
3033                   第一桶体部
3034                   第二桶体部
3035                   第三桶体部
3036                   流道
304                    绝缘件
101                    进气装置
1011                   进气口
1012                   分离机构
1013                   第一滤水机构
1014                   静电除尘机构
10141                  阳极积尘部
10142                  阴极放电部
1015                   第一绝缘机构
1016                   均风机构
1017                   第二滤水机构
1018                   臭氧机构
201                    臭氧发生器
202                    反应场
2021                   蜂窝状腔体
2022                   间隙
203                    脱硝装置
2031                   电凝除雾单元
2032                   脱硝液收集单元
204                    臭氧消解器
具体实施方式
本发明发明人经过大量研究,提供了以下低比电阻物质处理装置及处理方法。所述低比电阻物质处理方法及处理装置,能收集低比电阻物质,且收集效率更高。同时,本发明中低比电阻物质是指单位体积电阻小于1×10 9欧姆的物质,其中单位体积指立方厘米;即每立方厘米的低比电阻物质,其电阻小于1×10 9欧姆。
本发明某些实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给所述低比电阻物质;当电子被传导给所述低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
本发明中低比电阻物质处理装置的工作原理为:利用导电极将电子传导给低比电阻物质,使得低比电阻物质带电,并利用吸附极给带电的低比电阻物质施加吸引力,以吸引低比电阻物质向吸附极移动,直至低比电阻物质附着在吸附极上,从而实现将低比电阻物质收集在吸附板上;同时,本发明中低比电阻物质处理装置,通过上述传导电子的方式使低比电阻物质带电,此种方式克服了低比电阻物质带电后容易失电所带来的问题,使得低比电阻物质在失去电子后又能快速得到电子,增加了使低比电阻物质带电的几率,并使得低比电阻物质保持带电状态,这样,吸附极就能持续给低比电阻物质施加吸引力,以将低比电阻物质吸附住,并使得本低比电阻物质处理装置对低比电阻物质的收集能力更强、收集效率更高。
同时,本发明提供一种低比电阻物质处理方法,包括如下步骤:
用导电极将电子传导给所述低比电阻物质,使所述低比电阻物质带电;
用吸附极吸引带电的所述低比电阻物质,使带电的所述低比电阻物质向所述吸附极移动。
本发明中处理方法基于上述步骤实现了将低比电阻物质收集在吸附板上;且此种处理方法克服了低比电阻物质带电后容易失电所带来的问题,使得低比电阻物质在失去电子后又能 快速得到电子,以保证低比电阻物质保持带电状态,这样,吸附极就能持续给低比电阻物质施加吸引力,以将低比电阻物质吸引住,进而使得本处理方法对低比电阻物质的收集效率更高。
本发明某些施实例提供一种低比电阻物质处理装置,包括进口、出口、及位于进口和出口之间的流道,流道中安装有能将电子传导给低比电阻物质的导电极;且导电极的截面面积与流道的截面面积比为99%-10%,低比电阻物质处理装置还包括能给带电的低比电阻物质施加吸引力的吸附极。本发明中低比电阻物质处理装置的工作原理为:低比电阻物质由进口进入流道,安装在流道中的导电极将电子传导给低比电阻物质,低比电阻物质带电,吸附极给带电的低比电阻物质施加吸引力,低比电阻物质向吸附极移动,直至低比电阻物质附着在吸附极上,从而实现将低比电阻物质收集在吸附板上;同时,本发明中导电极安装在流道中,且导电极的截面面积与流道的截面面积比为99%-10%,使得导电极能有效将电子传导给低比电阻物质;另外,本发明中低比电阻物质处理装置,通过上述传导电子的方式使低比电阻物质带电,此种方式克服了低比电阻物质带电后容易失电所带来的问题,使得低比电阻物质在失去电子后又能快速得到电子,增加了使低比电阻物质带电的几率,并使得低比电阻物质保持带电状态,这样,吸附极就能持续给低比电阻物质施加吸引力,以将低比电阻物质吸附住,并使得本低比电阻物质处理装置对低比电阻物质的收集能力更强、收集效率更高。
本发明某些施实例提供一种低比电阻物质处理装置,包括进口、出口、及位于进口和出口之间的流道,流道中安装有能将电子传导给低比电阻物质的导电极;且导电极的截面面积与流道的截面面积比为99%-10%,低比电阻物质处理装置还包括能给带电的低比电阻物质施加吸引力的吸附极。
本发明某些施实例提供所述低比电阻物质处理方法包括如下步骤:
低比电阻物质由进口进入流道中,并朝向出口方向移动;当低比电阻物质经过导电极时,导电极将电子传导给低比电阻物质,低比电阻物质带电;用吸附极吸引带电的所述低比电阻物质,使带电的所述低比电阻物质向所述吸附极移动。
本发明中低比电阻物质处理方法,基于上述步骤实现了将低比电阻物质收集在吸附板上;同时,本发明中导电极安装在流道中,且导电极的截面面积与流道的截面面积比为99-10%,使低比电阻物质穿过导电极,增大低比电阻物质与导电极的接触面积,使得导电极能有效将电子传导给低比电阻物质,且此种处理方法克服了低比电阻物质带电后容易失电所带来的问题,使得低比电阻物质在失去电子后又能快速得到电子,以保证低比电阻物质保持带电状态,这样,吸附极就能持续给低比电阻物质施加吸引力,以将低比电阻物质吸引住,进而使得本 处理方法对低比电阻物质的收集效率更高。
于本发明一实施例中导电极位于流道中。本发明中导电极的截面面积是指导电极沿截面上实体部分的面积之和。另外,本发明某些实施例中导电极的截面面积与流道的截面面积比可以为99-10%、或90-10%、或80-20%、或70-30%、或60-40%、或50%。
本发明中低比电阻物质的形态可为液态、雾态、固态、或等离子态中的一种或多种形态的组合。例如,本发明中低比电阻物质可以为导电液、导电雾、导电颗粒、带电液、带电雾、带电颗粒、水、乳化液、气溶胶、液化粉尘、多物混合液、多态混合液、多物多态混合液、水雾、乳化液雾、多物混合液雾、多态混合液雾、多物多态混合液雾、雾霾、蒸汽、酸雾、含水尾气、含水烟气、气态分子团、离子团、等离子体、导电粉末体、导电飞沫、导电尘、液中离子团、气中离子团、液中化合物、气中化合物等。本发明中低比电阻物质还可以是含水、乳化液、多物混合液、多态混合液、或多物多态混合液的生物体。本发明中低比电阻物质可以是导体或半导体。本发明可通过上述处理方法,将低比电阻物质收集在吸附极上。本发明中处理装置可作为电凝除雾器,并能应用于臭氧脱硝尾气回收、湿法脱硫烟气脱水、湿法除尘逃逸水回收、工业尾气除雾器、乳化液净化器、油雾静化器、电子香烟、核聚变约束装置。比如,当本处理装置应用于臭氧脱硝尾气回收时,臭氧脱硝尾气中形成的酸雾就是一种低比电阻物质,每立方厘米含酸雾的尾气的电阻为0.1至1000欧姆;此时本低比电阻物质处理方法具体包括如下步骤:臭氧脱硝尾气流经导电极,导电极将电子传导给臭氧脱硝尾气中的酸雾,并使得酸雾带电;吸附极给带电的酸雾施加吸引力;酸雾向吸附极移动,并附着在吸附极上,从而实现将臭氧脱硝尾气中的酸雾进行回收,避免臭氧脱硝尾气中的酸雾直接排放至大气,并对大气造成污染。此时上述处理方法也称作一种酸雾静电回收方法。本发明中处理装置及处理方法可用于电厂、玻璃厂、钢厂、化工厂烟囱排放的逃逸雾、气溶胶等脱白治理。本发明解决了传统湿电除尘器无法去除排放气体中含有的低比电阻物质,包括水雾、酸雾、气溶胶、乳化液、液化粉尘等的问题,并采用空间上电方式,直接利用电场吸附、回收尾气中含有的低比电阻物质。另外,本发明中处理方法及装置还可以用于将目标物质即低比电阻物质从气相、液相、或溶胶体中分离或富集。
于本发明一实施例中导电极与电源的一个电极电性连接;吸附极与电源的另一个电极电性连接。于本发明一实施例中导电极具体与电源的负极电性连接,吸附极具体与电源的正极电性连接。
本发明中低比电阻物质的上电方式是利用导电极将正电子或负电子导入低比电阻物质,此种上电方式在低比电阻物质容易失电后又能快速得到电子,使得低比电阻物质保持带电状 态,进而使得上述吸附极能持续吸引低比电阻物质,以能将低比电阻物质吸附住。同时,本发明中导电极可以具有正电势或负电势;当导电极具有正电势时,吸附极具有负电势;当导电极具有负电势时,吸附极具有正电势,本发明中导电极和吸附极均与上电电源电性连接,具体地导电极和吸附极可分别与上电电源的正负极电性连接。该上电电源的电压称作上电驱动电压,上电驱动电压大小的选择与环境温度、介质温度等有关。例如,上电电源的上电驱动电压范围可以为5-50KV、10-50KV、5-10KV、10-20KV、20-30KV、30-40KV、或40-50KV,从生物电至空间雾霾治理用电。上电电源可以是直流电源或交流电源,其上电驱动电压的波形可以是直流、正弦波、或调制波形。直流电源作为吸附的基本应用;正弦波作为移动使用,如正弦波的上电驱动电压作用于导电极和吸附极之间,所产生的电场将驱动电场中带电的粒子、如雾滴等向吸附极移动;斜波作为拉动使用,根据拉动力度需要调制波形,如非对称电场的两端边缘处,对其中的介质所产生的拉力具有明显的方向性,以驱动电场中的介质沿该方向移动。当上电电源采用交流电源时,其变频脉冲的范围可以为0.1Hz-5GHz、0.1Hz-1Hz、0.5Hz-10Hz、5Hz-100Hz、50Hz-1KHz、1KHz-100KHz、50KHz-1MHz、1MHz-100MHz、50MHz-1GHz、500MHz-2GHz、或1GHz-5GHz,适用生物体至污染物颗粒的吸附。本发明导电极可作为导线,在与低比电阻物质接触时,直接将正负电子导入低比电阻物质,此时低比电阻物质本身可作为电极。本发明中低比电阻物质在由导电极向吸附极移动过程中,将重复得到电子和失去电子;与此同时,大量电子在位于导电极和吸附极之间的多个低比电阻物质之间进行传递,并最终到达吸附极,从而形成电流,该电流也称作上电驱动电流。上电驱动电流的大小与环境温度、介质温度、电子量、被吸附物质量、逃逸量有关。比如,随电子量增加,可移动的粒子、如雾滴增加,由移动的带电粒子形成的电流会随之增加。单位时间内被吸附的带电物质、如雾滴越多,电流越大。逃逸的雾滴只是带了电,但并未到达吸附极,也就是说未形成有效的电中和,从而在相同的条件下,逃逸的雾滴越多,电流越小。相同的条件下,环境温度越高,气体粒子和雾滴速度越快,其自身的动能也就越高,其自身与导电极和吸附极碰撞机率就会越大,也越不易被吸附极吸附住,从而产生逃逸,但由于其逃逸是发生在电中和之后,且可能是发生了反复多次的电中和之后,从而相应的增加了电子传导速度,电流也就相应增加。同时,由于环境温度越高,气体分子、雾滴等的动量越高,且越不易被吸附极吸附,即使吸附极吸附后,再次从吸附极逃逸、即电中和之后逃逸的机率也越大,因此在导电极与吸附极的间距不变的情况下,需要增加上述上电驱动电压,该上电驱动电压的极限为达到空气击穿的效果。另外,介质温度的影响基本与环境温度的影响相当。介质温度越低,需激发介质、如雾滴带电的能量小,且其自身所具有的动能也越小,在同样的电场 力作用下,越容易被吸附到吸附极上,从而形成的电流较大。本发明中处理装置对冷态的物质的吸附效果更好。而随介质、如雾滴的浓度增加,带电的介质在与吸附极碰撞之前已与其它介质产生电子传递的机率越大,从而形成有效电中和的机会也会越大,形成的电流也相应地会越大;所以当介质浓度越高时,形成的电流越大。上电驱动电压与介质温度的关系与上电驱动电压与环境温度的关系基本相同。
于本发明一实施例中上电电源的上电驱动电压可小于起晕电源的起始起晕电压,在不存在电晕放电的情况下,本发明的导电极也可使低比电阻物质带电,没有电离也可导电;在上电驱动电压可大于起晕电源的起始起晕电压时,电晕放电和导电极将电子传导给所述低比电阻物质,使所述低比电阻物质带电同时存在。该起晕电源为假如在导电极和吸附极均与起晕电源电性连接时能使导电极或吸附极产生放电的电源,且导电极或吸附极产生放电时将电离气体,使得气体中烟尘颗粒等物质获得负电荷。该起晕电源的电压就称作起晕电压,而起晕电压的最小值称作起始起晕电压;即在导电极和吸附极均与起晕电源电性连接情况下,能使导电极或吸附极产生放电并电离气体的最小电压值称作起始起晕电压。对于不同的气体、及不同的工作环境等,起始起晕电压的大小可能会不相同。但对于本领域技术人员来说,针对确定的气体、及工作环境,所对应的起始起晕电压是确定的。同时,于本发明一些实施例中上电驱动电压具体可为0.1-2kv/mm。上电电源的上电驱动电压小于空气电晕起晕电压。另外,本发明中低比电阻物质处理方法可应用于处理发动机的尾气,特别是可利用本发明中低比电阻物质处理装置及处理方法来处理发动机的尾气中的水雾等低比电阻物质。
于本发明一实施例中导电极和吸附极均沿左右方向延伸,导电极的左端位于吸附极的左端的左方。
于本发明一实施例中吸附极有两个,导电极位于两个吸附极之间。
本发明中导电极与吸附极之间的距离可根据两者间的上电驱动电压大小、低比电阻物质的流速、以及低比电阻物质的带电能力等进行设置。比如,导电极和吸附极的间距可以为5-50mm、5-10mm、10-20mm、20-30mm、30-40mm、或40-50mm。导电极和吸附极的间距越大,需要的上电驱动电压越高,以形成足够强大的电场,用于驱动带电的介质快速移向吸附极,以免介质逃逸。同样的条件下,导电极和吸附极的间距越大,顺着气流方向,越靠近中心位置,物质流速越快;越靠近吸附极的物质的流速越慢;而垂直于气流方向,带电介质粒子、如雾粒,随导电极和吸附极的间距增加,在没有发生碰撞的情况下,被电场加速的时间越长,因此,物质在接近吸附极之前沿垂直方向的移动速度越大。在同样的条件下,如果上电驱动电压不变,随距离增加,电场强度不断减小,电场中介质带电的能力也就越弱。
于本发明一些实施例中导电极可为固体、液体、气体分子团、或等离子体中的一种或多种形态的组合。当导电极为固体时,导电极可采用固态金属、比如304钢,或其它固态的导体、比如石墨等;当导电极为液体时,导电极可以是含离子导电液体。另外,于本发明一些实施例中导电极还可以是导电混合态物质、生物体自然混合导电物质、物体人工加工形成导电物质。本发明中吸附极由导电物质制成,或吸附极的表面具有导电物质。
于本发明一些实施例中导电极的形状可以呈面状、网状、孔板状、板状、球笼状、盒状、或管状。本发明中网状为包括任何有孔结构的形状。当导电极呈板状、球笼状、盒状或管状时,导电极可以是无孔结构,也可以是有孔结构。当导电极为有孔结构时,导电极上可以设有一个或多个通孔,该导电极上的通孔的形状可以是多角形、圆形、椭圆形、正方形、长方形、梯形、或菱形等。导电极上的通孔的轮廓大小可以为0.1-3mm、0.1-0.3mm、0.3-0.5mm、0.5-0.8mm、0.8-1.0mm、1.0-1.2mm、1.2-1.0mm、1.0-1.5mm、1.5-1.8mm、1.8-2.0mm、2.0-2.3mm、2.3-2.5mm、2.5-2.8mm、或2.8-3.0mm。另外,于本发明一些实施例中导电极的形状还可以是其它物质自然形态、或物质加工形态。本发明中当低比电阻物质通过导电极上的通孔时,低比电阻物质穿过所述导电极,提高低比电阻物质与导电极的接触面积,增加带电效率。本发明中导电极上的通孔为任何允许物质流过导电极的孔。
同时,于本发明一些实施例中吸附极的形状可以呈多层网状、网状、孔板状、管状、桶状、球笼状、盒状、板状、颗粒堆积层状、折弯板状、或面板状。当吸附极呈板状、球笼状、盒状或管状时,吸附极也可以是无孔结构,或有孔结构。当吸附极为有孔结构时,吸附极上可以设有一个或多个通孔,该吸附极的通孔的形状可以是多角形、圆形、椭圆形、正方形、长方形、梯形、或菱形等。吸附极的通孔的轮廓大小可以为0.1-3mm、0.1-0.3mm、0.3-0.5mm、0.5-0.8mm、0.8-1.0mm、1.0-1.2mm、1.2-1.0mm、1.0-1.5mm、1.5-1.8mm、1.8-2.0mm、2.0-2.3mm、2.3-2.5mm、2.5-2.8mm、或2.8-3.0mm。本发明中吸附极上的通孔为任何允许物质流过吸附极的孔。
本发明一些实施例中导电极与吸附极之间形成电场,该电场可以是网面电场或网桶电场等多种电场。比如:导电极呈网状,吸附极呈面状,导电极平行于吸附极,从而形成网面电场;或导电极呈网状,并通过金属丝或金属针进行固定,吸附极呈桶状,导电极位于吸附极的几何对称中心处,从而形成网桶电场。当吸附极呈面状时,具体可以是平面状、曲面状、或球面状。当导电极呈网状时,具体可以是平面的、球面的或其它几何面状,也可以是矩形,或不规则形状。当吸附极呈桶状时,吸附极还可以进一步演化成各种盒状。导电极也可作相应变化,形成电极和电场层套。
于本发明一实施例中导电极垂直于吸附极。于本发明一实施例中导电极和吸附极相平行。于本发明一实施例中导电极和吸附极均呈面状,且导电极和吸附极相平行。于本发明一实施例中导电极采用金属丝网。于本发明一实施例中导电极呈平面状或球面状。于本发明一实施例中吸附极呈曲面状或球面状。于本发明一实施例中导电极呈网状,吸附极呈桶状,导电极位于吸附极的内部,且导电极位于吸附极的中心对称轴上。
本发明中导电极和吸附极构成吸附单元。所述吸附单元可以有一个或多个,具体数量依据实际需要来确定。在一种实施例中,吸附单元有一个。在另一种实施例中吸附单元有多个,以利用多个吸附单元吸附更多的低比电阻物质,从而提高收集低比电阻物质的效率。当吸附单元有多个时,全部吸附单元的分布形式可以根据需要灵活进行调整;全部吸附单元可以是相同的,也可以是不同的。比如,全部吸附单元可沿纵向、横向、斜向、螺旋方向中的一个方向或多个方向上进行分布,以满足不同风量的要求。全部吸附单元可以呈矩形阵列分布,也可以呈金字塔状分布。上述各种形状的导电极和吸附极可以自由组合形成吸附单元。例如,线状的导电极***管状的吸附极形成吸附单元,再与线状的导电极组合,形成新的吸附单元,此时两个线状的导电极可电连接;新的吸附单元再在纵向、横向、斜向、螺旋方向中的一个方向或多个方向上进行分布。再例如,线状的导电极***管状的吸附极形成吸附单元,此吸附单元在纵向、横向、斜向、螺旋方向中的一个方向或多个方向上进行分布,形成新的吸附单元,该新的吸附单元再与上述各种形状的导电极进行组合,以形成新的吸附单元。本发明中吸附单元中的导电极和吸附极之间的距离可以任意调整,以适应不同的工作电压和吸附对象的要求。本发明中不同的吸附单元之间可以进行组合。本发明中不同的吸附单元可以使用同一上电电源,也可以使用不同的上电电源。当使用不同的上电电源时,各上电电源的上电驱动电压可以是相同的,也可以是不同的。另外,本发明中的处理装置也可以有多个,且全部处理装置可以沿纵向、横向、斜向、螺旋方向中的一个方向或多个方向上进行分布。
于本发明一实施例中低比电阻物质处理装置还包括外壳,该外壳包括进口、出口及流道,流道的两端分别与进口和出口相连通。于本发明一实施例中进口呈圆形,且进口的直径为300-1000mm、或500mm。于本发明一实施例中出口呈圆形,且出口的直径为300-1000mm、或500mm。于本发明一实施例中外壳包括由进口至出口方向依次分布的第一桶体、第二桶体、及第三桶体,进口位于第一桶体的一端,进口位于第三桶体的一端。于本发明一实施例中第一桶体的轮廓大小由进口至出口方向逐渐增大。于本发明一实施例中第一桶体呈直管状。于本发明一实施例中第二桶体呈直管状,且导电极和吸附极安装在第二桶体中。于本发明一实施例中第三桶体的轮廓大小由进口至出口方向逐渐减小。于本发明一实施例中第一桶体、第 二桶体、及第三桶体的截面均呈矩形,于本发明一实施例中第二桶体的截面呈矩形。于本发明一实施例中外壳的材质为不锈钢、铝合金、铁合金、布、海绵、分子筛、活性炭、泡沫铁、或泡沫碳化硅。于本发明一实施例中导电极通过绝缘件与外壳相连接。于本发明一实施例中绝缘件的材质为绝缘云母。于本发明一实施例中绝缘件呈柱状、或塔状。于本发明一实施例中导电极上设有呈圆柱形的前连接部,且前连接部与绝缘件固接。于本发明一实施例中吸附极或外壳内壁上设有呈圆柱形的后连接部,且后连接部与绝缘件固接。
本发明某些实施例中低比电阻物质处理装置还包括具有进口和出口的外壳,上述导电极和吸附极均安装在外壳中。在收集低比电阻物质的过程中,低比电阻物质由进口进入外壳,并朝向出口处移动;在低比电阻物质朝向出口移动过程中,低比电阻物质将经过导电极,并带电;吸附极将带电的低比电阻物质吸附住,以将低比电阻物质收集在吸附极上。本发明利用外壳引导低比电阻物质流经导电板,以利用导电极使低比电阻物质带电,并利用吸附极收集低比电阻物质,从而有效降低由出口处流出的低比电阻物质的量。于本发明一些实施例中外壳的材质可以是金属、非金属、导体、非导体、水、各类导电液体、各类多孔材料、或各类泡沫材料等。当外壳的材质为金属时,其材质具体可以是不锈钢、或铝合金等。当外壳的材质是非金属时,其材质具体可以是布、或海绵等。当外壳的材质是导体时,其材质具体可以是铁合金等。当外壳的材质是非导体时,其表面形成水层水即成为电极,如吸水后的沙层。当外壳的材质为水和各类导电液体时,外壳是静止或流动的。当外壳的材质为各类多孔材料时,其材质具体可以是分子筛或活性炭。当外壳的材质为各类泡沫材料时,其材质具体可以是泡沫铁、泡沫碳化硅等。在本发明一种实施例中导电极通过绝缘件与外壳固接,绝缘件的材质可以为绝缘云母。同时,在本发明一种实施例中吸附极直接与外壳电连接,此种连接方式使得外壳可以与吸附极具有相同的电势,这样外壳也能吸附带电的低比电阻物质,外壳也构成一种吸附极。外壳中设有上述流道,导电极安装在流道中。
当水雾等低比电阻物质附着在吸附极后,将形成凝露。本发明某些实施例中吸附极可沿上下方向延伸,这样堆积在吸附极上的凝露达到一定重量时,将在重力的作用下沿吸附极向下流动,并最终汇集在设定位置或装置中,从而实现对附着在吸附极上的低比电阻物质的回收。本处理装置可用于制冷除雾。另外,也可以采用外加电场的方式对附着在吸附板上的物质进行收集。对吸附板上的物质收集方向既可以同气流相同,也可以与气流方向不同。在具体实施时,因为是要充分利用重力作用,使吸附极上的水滴或水层尽快流入收集槽中的;同时会尽量利用气流方向及其作用力,来加速吸附极上水流的速度。因此会根据不同的安装条件,以及绝缘的方便性、经济性和可行性等,尽量达到上述目的,不拘束于特定的方向。
本发明某些实施例中上述处理装置可独立使用,以作为低比电阻物质的吸附装置。同时,本发明某些实施例中上述处理装置还可以与制冷装置、催化装置、电晕装置、加热装置、离心装置、筛分装置、电磁装置、辐照装置等进行组合使用,以实现凝露、催化、电晕、加热、离心、筛分等功能。另外,上述装置还可以根据现场需要进行任意组合。
另外,当前已有的静电场荷电理论是利用电晕放电,电离氧气,产生大量的负氧离子,负氧离子和粉尘接触,粉尘荷电,荷电后的粉尘被异极吸附。但当遇到水雾、金属颗粒、导体尘埃等低比电阻物质时,现有的电场吸附作用几乎没有。因低比电阻物质在得电后容易失电,当移动中的负氧离子使低比电阻物质荷电后,低比电阻物质又将很快失电,而负氧离子只移动一次,导致低比电阻失电后难以再带电,或此种带电方式大大降低了低比电阻物质带电的几率,使得低比电阻物质整体处于不带电状态,这样异极就难以对低比电阻物质持续施加吸附力,最终导致现有的电场对低比电阻物质的吸附效率极低。本发明某些实施例中上述处理装置及处理方法,不是采用荷电方式让这些低比电阻物质带电,而是直接将电子传递给低比电阻物质使其带电,在某个低比电阻物质带电又失电后,新的电子将快速由导电极、并通过其它低比电阻物质传递到该失电的低比电阻物质上,使得低比电阻物质失电后又能快速得电,大大增加了低比电阻物质带电几率,如次重复,使得低比电阻物质整体处于得电状态,并使得吸附极能持续给低比电阻物质施加吸引力,直至吸附住低比电阻物质,从而保证本处理装置对低比电阻物质的收集效率更高。本发明采用的上述使低比电阻物质带电的方法,不需要使用电晕线、电晕极、或电晕板等,简化了本处理装置的整体结构,降低了本处理装置的制造成本。同时,本发明采用上述上电方式,也使得导电极上的大量电子,将通过低比电阻物质传递给吸附极,并形成电流。当流经本处理装置的低比电阻物质的浓度越大时,导电极上的电子更容易通过低比电阻物质传递给吸附极,更多的电子将在低比电阻物质间传递,使得导电极和吸附极之间形成的电流更大,并使得低比电阻物质的带电几率更高,且使本处理装置对低比电阻物质的收集效率更高。本发明中上述处理方法可作为烟囱脱白、除雾新方法。本发明中处理装置可增设在湿电除尘器上。
于本发明一实施例中提供一种低比电阻物质处理方法,包括如下步骤:
使低比电阻物质流经导电极;
当低比电阻物质流经导电极时,导电极使低比电阻物质带电,吸附极给带电的低比电阻物质施加吸引力,使低比电阻物质向吸附极移动,直至低比电阻物质附着在吸附极上。
于本发明一实施例中所述使低比电阻物质流经导电极的步骤包括:电子在位于导电极和吸附极之间的低比电阻物质之间进行传递,使更多低比电阻物质带电。
于本发明一实施例中导电极和吸附极之间通过低比电阻物质传导电子、并形成电流。
于本发明一实施例中所述使低比电阻物质流经导电极的步骤包括:导电极通过与低比电阻物质接触的方式使低比电阻物质带电。
于本发明一实施例中附着在吸附极上的低比电阻物质聚集在一起。
于本发明一实施例中使带硝酸雾的气体流经导电极;当带硝酸雾的气体流经导电极时,导电极使气体中的硝酸雾带电,吸附极给带电的硝酸雾施加吸引力,使硝酸雾向吸附极移动,直至硝酸雾附着在吸附极上。
于本发明一实施例中导电极将电子导入硝酸雾的步骤包括:电子在位于导电极和吸附极之间的雾滴之间进行传递,使更多雾滴带电。
于本发明一实施例中导电极和吸附极之间通过硝酸雾传导电子、并形成电流。
于本发明一实施例中导电极将电子导入硝酸雾的步骤包括:导电极通过与硝酸雾接触的方式使硝酸雾带电。
于本发明上述实施例中,还包括一外壳,所述进口和所述出口均设在外壳上,所述导电极和吸附极均安装在外壳中,所述流道位于外壳中位于进口和出口之间。
于本发明一实施例提供一种低比电阻物质处理方法,包括如下步骤:
用导电极将电子传导给所述低比电阻物质,使所述低比电阻物质带电;
用吸附极吸引带电的所述低比电阻物质,使带电的所述低比电阻物质向所述吸附极移动;
所述导电极上设有至少一个通孔,当所述低比电阻物质通过所述导电极上的通孔时,所述低比电阻物质穿过所述导电极,使所述低比电阻物质带电。
于本发明上述实施例中,所述用导电极将电子传导给所述低比电阻物质的步骤包括:使电子在位于所述导电极和所述吸附极之间的低比电阻物质之间进行传递,使更多低比电阻物质带电。
于本发明上述实施例中,所述导电极和所述吸附极之间通过低比电阻物质传导电子、并形成电流,为导电极放电电流。
于本发明上述实施例中,所述用导电极将电子传导给所述低比电阻物质的步骤包括:所述导电极通过与低比电阻物质接触的方式使低比电阻物质带电。
于本发明一实施例中,所述导电极和所述吸附极均安装在一外壳内,所述外壳具有进口和出口。
于本发明上述实施例中,所述外壳内还包括流道,所述流道位于外壳中位于进口和出口 之间。
于本发明上述实施例中,所述导电极的截面面积与流道的截面面积比为99%-10%。
于本发明一实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力;
所述导电极上设有至少一个通孔。
于本发明上述实施例中,当所述低比电阻物质通过所述导电极上的通孔时,所述低比电阻物质穿过所述导电极,使所述低比电阻物质带电。
于本发明上述实施例中,还包括具有进口和出口的外壳,所述导电极和吸附极均安装在所述外壳中。
于本发明上述实施例中,所述外壳内还包括流道,所述流道位于所述外壳中位于所述进口和所述出口之间。
于本发明上述实施例中,所述导电极的截面面积与流道的截面面积比为99%-10%。
于本发明一实施例提供一种低比电阻物质处理方法,包括如下步骤:
所述低比电阻物质由进口进入流道中,并朝向出口方向移动;用导电极将电子传导给所述低比电阻物质,使所述低比电阻物质带电;
用吸附极吸引带电的所述低比电阻物质,使带电的所述低比电阻物质向所述吸附极移动;
所述导电极的截面面积与流道的截面面积比为99%-10%。
于本发明上述实施例中,所述用导电极将电子传导给所述低比电阻物质的步骤包括:电子在位于所述导电极和所述吸附极之间的低比电阻物质之间进行传递,使更多低比电阻物质带电。
于本发明上述实施例中,所述导电极和所述吸附极之间通过低比电阻物质传导电子、并形成电流,为导电极放电电流。
于本发明上述实施例中,所述用导电极将电子传导给所述低比电阻物质的步骤包括:所述导电极通过与低比电阻物质接触的方式使低比电阻物质带电。
于本发明上述实施例中,所述导电极和所述吸附极均安装在一外壳中,所述外壳具有进口和出口。
于本发明上述实施例中,所述流道位于外壳中位于进口和出口之间。
于本发明一实施例提供一种低比电阻物质处理装置,包括:
包括进口、出口、及位于进口和出口之间的流道;
导电极,位于流道中,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,位于流道中,能给带电的低比电阻物质施加吸引力;
所述导电极的截面面积与流道的截面面积比为99%-10%。
本发明某些实施例中,用导电极将电子传导给所述低比电阻物质中“传导”是指导电极与不带电的低比电阻物质接触时,导电极上的电子传给低比电阻物质,使低比电阻物质带上与导电极相同的电荷,带电的低比电阻物质将电荷传递给其他不带电的低比电阻物质,使更多低比电阻物质带电。
以下由特定的具体实施例说明本发明的实施方式,熟悉此技术的人士可由本说明书所揭露的内容轻易地了解本发明的其他优点及功效。
须知,本说明书附图所绘示的结构、比例、大小等,均仅用以配合说明书所揭示的内容,以供熟悉此技术的人士了解与阅读,并非用以限定本发明可实施的限定条件,故不具技术上的实质意义,任何结构的修饰、比例关系的改变或大小的调整,在不影响本发明所能产生的功效及所能达成的目的下,均应仍落在本发明所揭示的技术内容所能涵盖的范围内。同时,本说明书中所引用的如“上”、“下”、“左”、“右”、“中间”及“一”等用语,亦仅为便于叙述明了,而非用以限定本发明可实施的范围,其相对关系的改变或调整,在无实质变更技术内容下,当亦视为本发明可实施的范畴。
第一种实施例
如图1至图3所示,本实施例提供一种低比电阻物质处理装置,包括:
导电极301,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极302,能给带电的低比电阻物质施加吸引力。
同时,如图1所示,本实施例中低比电阻物质处理装置还包括具有进口3031和出口3032的外壳303,导电极301和吸附极302均安装在外壳303中。且导电极301通过绝缘件304与外壳303的内壁固接,吸附极302直接与外壳303固接。本实施例中绝缘件304呈柱状,又称作绝缘柱。在另一种实施例中绝缘件304还可以呈塔状等。本绝缘件304主要是防污染 防漏电。本实施例中导电极301和吸附极302均呈网状(即导电极和吸附极上均设有若干通孔),且两者均于进口3031和出口3032之间。导电极301具有负电势,吸附极302具有正电势。同时,本实施例中外壳303与吸附极302具有相同的电势,该外壳303同样对带电的物质具有吸附作用。本实施例中外壳中设有流道3036,导电极301和吸附极302均安装在流道3036中,且导电极301的截面面积与流道3036的截面面积比为70%。
本实施例还提供低比电阻物质处理方法,用于处理含有酸雾的工业尾气(本实施例中工业尾气为发动机的排气),包括如下步骤:用导电极301将电子传导给工业尾气中的酸雾,使酸雾带电;用吸附极302吸引带电的酸雾,使带电的酸雾向所述吸附极302移动。具体地,本实施例中进口3031与排放工业尾气的口相连通,如图1所示,工作过程及工作原理如下:工业尾气由进口3031流入外壳303,并经出口3032流出;在此过程中,工业尾气将流经导电极301,当工业尾气中的酸雾与导电极301接触时,或与导电极301的距离达到一定值时,导电极301将电子传递给酸雾,酸雾带电,吸附极302给带电的酸雾施加吸引力,酸雾向吸附极302移动,并附着在吸附极302上;由于酸雾具有易带且易失电特性,某个带电的雾滴在向吸附极302移动过程中又将失电,此时其它带电的雾滴又将快速将电子传递给该失电的雾滴,如此重复,雾滴处于持续带电状态,吸附极302就能持续给雾滴施加吸附力,并使得雾滴附着在吸附极302,从而实现对工业尾气中酸雾的去除,避免酸雾直接排放至大气中,并对大气造成污染。
本实施例提供的处理方法及处理装置中各参数如表1所示:
表1
1 导电极和吸附极之间的电压即上电驱动电压 12KV
2 导电极放电电流 0.01A
3 起始起晕电压 5.5KV
4 导电极的截面面积与流道的截面面积比 70%
5 导电极与吸附极之间的间距 10mm
本实施例中导电极301和吸附极302构成吸附单元。且在吸附单元仅有一个的情况下,本实施例中低比电阻物质处理装置及处理方法能除去工业尾气中80%的酸雾,大大降低了酸雾的排放量,具有显著的环保效果。
如图2所示,本实施例中导电极301上设有3个第一连接部3011,3个第一连接部3011分别通过3个绝缘件304与外壳303的内壁上的3个第二连接部固接,此种连接形式能有效增强导电极301与外壳303间的连接强度。本实施例中第一连接部3011呈圆柱形,在其它实 施例中第一连接部3011还可以呈塔状等。本实施例中绝缘件304呈圆柱状,在其它实施例中绝缘件304还可以呈塔状等。本实施例中第二连接部呈圆柱状,在其它实施例中绝缘件304还可以呈塔状等。如图1所示,本实施例中外壳303包括由进口3031至出口3032方向依次分布的第一桶体部3033、第二桶体部3034、及第三桶体部3035。进口3031位于第一桶体部3033的一端,出口3032位于第三桶体部3035的一端。第一桶体部3033的轮廓大小由进口3031至出口3032方向逐渐增大,第三桶体部3035的轮廓大小由进口3031至出口3032方向逐渐减小。本实施例中第二桶体部3034的截面呈矩形。本实施例中外壳303采用上述结构设计,使尾气在进口3031处达到一定的入口流速,更主要能使气流分布更加均匀,进而使尾气中的介质、如雾滴更容易在导电极301的激发作用下带电。同时本外壳303封装更加方便,减少材料用量,并节省空间,可以用管道连接,且还有利用于绝缘的考虑。任何可达到上述效果的外壳303均可以接受。
本实施例中进口3031和出口3032均呈圆形,进口3031也可称作进气口,出口3032也可称作出气口。本实施例中进口3031的直径为300mm-1000mm,具体为500mm。同时,本实施例中出口3032的直径为300mm-1000mm,具体为500mm。
第二种实施例
如图4和图5所示,本实施例提供一种低比电阻物质处理装置,包括:
导电极301,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极302,能给带电的低比电阻物质施加吸引力。
如图4和图5所示,本实施例中导电极301有两个,两个导电极301均呈网状且呈球笼状。本实施例中吸附极302有一个,该吸附极302呈网状且呈球笼状。吸附极302位于两个导电极301之间。同时,如图4所示,本实施例中低比电阻物质处理装置还包括具有进口3031和出口3032的外壳303,导电极301和吸附极302均安装在外壳303中。且导电极301通过绝缘件304与外壳303的内壁固接,吸附极302直接与外壳303固接。本实施例中绝缘件304呈柱状,又称作绝缘柱。本实施例中导电极301具有负电势,吸附极302具有正电势。同时,本实施例中外壳303与吸附极302具有相同的电势,该外壳303同样对带电的物质具有吸附作用。
本实施例还提供采用上述低比电阻物质处理装置的处理方法,用于处理含有酸雾的工业尾气,包括如下步骤:用导电极301将电子传导给工业尾气中的酸雾,使酸雾带电;用吸附极302吸引带电的酸雾,使带电的酸雾向所述吸附极302移动。具体地,本实施例中进口3031 与排放工业尾气的口相连通,如图4所示,工作过程及工作原理如下:工业尾气由进口3031流入外壳303,并经出口3032流出;在此过程中,工业尾气将先流经其中一个导电极301,当工业尾气中的酸雾与该导电极301接触时,或与该导电极301的距离达到一定值时,导电极301将电子传递给酸雾,部分酸雾带电,吸附极302给带电的酸雾施加吸引力,酸雾向吸附极302移动,并附着在吸附极302上;另有一部分酸雾未被吸附在吸附极302上,该部分酸雾继续向出口3032方向流动,当该部分酸雾与另一个导电极301接触时,或与另一个导电极301的距离达到一定值时,该部分酸雾将带电,外壳303给该部分带电的酸雾施加吸附力,使得该部分带电的酸雾附着在外壳303的内壁上,从而大大减少了工业尾气中酸雾的排放量,且本实施例中处理装置及处理方法能去除工业尾气中90%的酸雾,去除酸雾的效果非常显著。另外,本实施例中进口3031和出口3032均呈圆形,进口3031也可称作进气口,出口3032也可称作出气口。
本实施例提供的处理方法及处理装置中各参数如表2所示:
表2
1 导电极和吸附极之间的电压即上电驱动电压 5KV
2 导电极放电电流 0.005A
3 起始起晕电压 5.5KV
4 导电极的截面面积与流道的截面面积比 75%
5 导电极与吸附极之间的间距 10mm
第三种实施例
本实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
本实施例中导电极呈网状,且导电极带有负电势。同时,本实施例中吸附极呈面状,且吸附极带有正电势,该吸附极也称作收集极。本实施例中吸附极具体呈平面状,且导电极平行于吸附极。本实施例中导电极和吸附极之间形成网面电场。另外,本实施例中导电极由金属丝制成的网状结构,该导电极由金属丝网构成。本实施例中吸附极的面积大于导电极的面积。
第四种实施例
本实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
本实施例中导电极呈网状,且导电极带有负电势。同时,本实施例中吸附极呈桶状,且吸附极带有正电势,该吸附极也称作收集极。本实施例中导电极通过金属线或金属针进行固定。且本实施例中导电极位于桶状的吸附极的几何对称中心处。本实施例中导电极和吸附极之间形成网桶电场。
第五种实施例
本实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
本实施例中吸附极有两个,且导电极位于两个吸附极之间,导电极沿左右方向方向上的长度大于吸附极沿左右方向上的长度,有导电极的左端位于吸附极的左方。导电极的左端与吸附极的左端形成沿斜向延伸的电力线。本实施例中导电极与吸附极之间形成非对称电场。在使用时,低比电阻物质、如雾滴由左进入两个吸附极之间。部分雾滴带电后,由导电极的左端沿斜向向吸附极的左端移动,从而对雾滴形成拉动作用。
第六种实施例
本实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
本实施例中导电极和吸附极构成吸附单元。本实施例中吸附单元有多个,且全部吸附单元沿横向分布。本实施例中全部吸附单元具体沿左右方向分布。
第七种实施例
本实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
本实施例中导电极和吸附极构成吸附单元。本实施例中吸附单元有多个,且全部吸附单 元沿纵向方向分布。
第八种实施例
本实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
本实施例中导电极和吸附极构成吸附单元。本实施例中吸附单元有多个,且全部吸附单元沿斜向分布。
第九种实施例
本实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
本实施例中导电极和吸附极构成吸附单元。本实施例中吸附单元有多个,且全部吸附单元沿螺旋方向分布。
第十种实施例
本实施例提供一种低比电阻物质处理装置,包括:
导电极,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;
吸附极,能给带电的低比电阻物质施加吸引力。
本实施例中导电极和吸附极构成吸附单元。本实施例中吸附单元有多个,且全部吸附单元沿横向、纵向和斜向分布。
第十一种实施例
本实施例提供一种基于发动机的气体处理***,包括上述低比电阻物质处理装置和文氏板。本实施例中低比电阻物质处理装置与文氏板组合使用。
第十二种实施例
本实施例提供一种基于发动机的气体处理***,包括上述低比电阻物质处理装置、文氏板、NOx氧化催化装置、及臭氧消解装置。本实施例中低比电阻物质处理装置和文氏板位于NOx氧化催化装置和臭氧消解装置之间。且NOx氧化催化装置中具有NOx氧化催化剂,臭氧消解装置中具有臭氧消解催化剂。
第十三种实施例
本实施例提供一种基于发动机的气体处理***,包括上述低比电阻物质处理装置、电晕装置和文氏板,其中低比电阻物质处理装置位于电晕装置和文氏板之间。
第十四种实施例
本实施例提供一种基于发动机的气体处理***,包括上述低比电阻物质处理装置、加热装置和臭氧消解装置,其中加热装置位于低比电阻物质处理装置和臭氧消解装置之间。
第十五种实施例
本实施例提供一种基于发动机的气体处理***,包括上述低比电阻物质处理装置、离心装置和文氏板,其中低比电阻物质处理装置位于离心装置和文氏板之间。
第十六种实施例
本实施例提供一种基于发动机的气体处理***,包括上述低比电阻物质处理装置、电晕装置、文氏板、及分子筛,其中文氏板和低比电阻物质处理装置位于电晕装置和分子筛之间。
第十七种实施例
本实施例提供一种基于发动机的气体处理***,包括上述低比电阻物质处理装置、电晕装置和电磁装置,其中低比电阻物质处理装置位于电晕装置和电磁装置之间。
第十八种实施例
本实施例提供一种基于发动机的气体处理***,包括上述低比电阻物质处理装置、电晕装置和辐照装置,其中辐照装置位于电晕装置和低比电阻物质处理装置之间。
第十九种实施例
本实施例提供一种基于发动机的气体处理***,包括上述低比电阻物质处理装置、电晕装置和湿电除尘装置,其中湿电除尘装置位于电晕装置和低比电阻物质处理装置之间。
第二十种实施例
如图6所示,本实施例提供一种基于发动机的气体处理***,包括进气装置,图1为进气装置的结构示意图。所述进气装置101包括进气口1011、分离机构1012、第一滤水机构1013、静电除尘机构1014、绝缘机构1015、均风机构、第二滤水机构1017和/或臭氧机构1018。本实施例中第一滤水机构1013为本发明提供的低比电阻物质处理装置。
如图6所示,所述进气口1011设置于所述分离机构1012的进气壁上,以接收带有颗粒物的气体。
所述静电除尘机构1014包括阳极积尘部10141和设置于阳极积尘部10141内的第一阴极放电部10142,阳极积尘部10141与阴极放电部10142之间形成非对称静电场。
设置于所述分离机构1012内的第一滤水机构1013包括设置于所述进气口1011的导电极为一导电网板,所述导电网板用于在上电后,将电子传导给低比电阻物质。用于吸附带电的低比电阻物质的吸附极于本实施例中为所述静电除尘机构1014的阳极积尘部10141。
请参阅图7,显示为设置于所述进气装置内的第一滤水机构的另一实施例结构示意图。所述第一滤水机构的导电极10131设置于所述进气口,所述导电极10131为一带有负电势导电网板。同时,吸附极10132设置于所述进气装置内呈面网状,且吸附极10132带有正电势,该吸附极10132也称作收集极。本实施例中吸附极10132具体呈平面网状,且导电极10131平行于吸附极10132。本实施例中导电极10131和吸附极10132之间形成网面电场。另外,导电极10131由金属丝制成的网状结构,该导电极10131由金属丝网构成。该吸附极10132的面积大于导电极10131的面积。
基于发动机的气体处理***还包括尾气处理装置,所述尾气处理装置包括第三滤水机构,本实施例中第一滤水机构也适用于基于发动机的气体处理***的尾气处理装置的第三滤水机构。
第二十一种实施例
一种柴油发动机的尾气处理***,如图8所示,包括:
脱氮氧化物(NO x)装置,用于脱除柴油发动机尾气中氮氧化物(NO x);所述脱氮氧化物(NO x)装置包括:臭氧源如臭氧发生器201,用于提供臭氧;反应场202,用于柴油发动机尾气与臭氧混合反应;脱硝装置203,用于脱除经脱氮氧化物(NO x)装置处理后的柴油发动机尾气中的硝酸;所述脱硝装置203包括电凝除雾单元2031,为低比电阻物质处理装置,用于将臭氧处理后的发动机尾气进行电凝,含硝酸的水雾堆积在低比电阻物质处理装置中的吸附极上。所述脱硝装置203还包括脱硝液收集单元2032,用于存储废气中脱除的硝酸水溶液和/或硝酸盐水溶液;臭氧消解器204,用于消解经脱硝装置处理后的柴油发动机尾气中的臭氧。臭氧消解器可以通过紫外线,催化等方式进行臭氧消解。
本实施例中,所述低比电阻物质处理装置即电凝除雾单元2031包括:导电极301,能将电子传导给低比电阻物质;当电子被传导给低比电阻物质时,低比电阻物质带电;吸附极302,能给带电的低比电阻物质施加吸引力。
本实施例中导电极301有两个,两个导电极301均呈网状且呈球笼状。本实施例中吸附极302有一个,该吸附极302呈网状且呈球笼状。吸附极302位于两个导电极301之间。同时,如图4所示,本实施例中低比电阻物质处理装置还包括具有进口3031和出口3032的外壳303,导电极301和吸附极302均安装在外壳303中。且导电极301通过绝缘件304与外 壳303的内壁固接,吸附极302直接与外壳303固接。本实施例中绝缘件304呈柱状,又称作绝缘柱。本实施例中导电极301具有负电势,吸附极302具有正电势。同时,本实施例中外壳303与吸附极302具有相同的电势,该外壳303同样对带电的物质具有吸附作用。
本实施例还提供采用上述低比电阻物质处理装置的处理方法,用于处理含有酸雾的工业尾气,包括如下步骤:用导电极301将电子传导给工业尾气中的酸雾,使酸雾带电;用吸附极302吸引带电的酸雾,使带电的酸雾向所述吸附极302移动。具体地,本实施例中进口3031与排放工业尾气的口相连通,工作过程及工作原理如下:工业尾气由进口3031流入外壳303,并经出口3032流出;在此过程中,工业尾气将先流经其中一个导电极301,当工业尾气中的酸雾与该导电极301接触时,或与该导电极301的距离达到一定值时,导电极301将电子传递给酸雾,部分酸雾带电,吸附极302给带电的酸雾施加吸引力,酸雾向吸附极302移动,并附着在吸附极302上;另有一部分酸雾未被吸附在吸附极302上,该部分酸雾继续向出口3032方向流动,当该部分酸雾与另一个导电极301接触时,或与另一个导电极301的距离达到一定值时,该部分酸雾将带电,外壳303给该部分带电的酸雾施加吸附力,使得该部分带电的酸雾附着在外壳303的内壁上,从而大大减少了工业尾气中酸雾的排放量,且本实施例中处理装置及处理方法能去除工业尾气中90%的酸雾,去除酸雾的效果非常显著。另外,本实施例中进口3031和出口3032均呈圆形,进口3031也可称作进气口,出口3032也可称作出气口。
本实施例提供的处理方法及处理装置中各参数如表3所示:
表3
1 导电极和吸附极之间的电压即上电驱动电压 12KV
2 导电极放电电流 0.018A
3 起始起晕电压 6.5KV
4 导电极的截面面积与流道的截面面积比 90%
5 导电极与吸附极之间的间距 10mm
综上所述,本发明有效克服了现有技术中的种种缺点而具高度产业利用价值。
上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本发明的权利要求所涵盖。

Claims (16)

  1. 一种低比电阻物质处理方法,包括如下步骤:
    用导电极将电子传导给所述低比电阻物质,使所述低比电阻物质带电;
    用吸附极吸引带电的所述低比电阻物质,使带电的所述低比电阻物质向所述吸附极移动。
  2. 根据权利要求1所述低比电阻物质处理方法,其特征在于,所述用导电极将电子传导给所述低比电阻物质的步骤包括:使电子在位于所述导电极和所述吸附极之间的低比电阻物质之间进行传递,使更多低比电阻物质带电。
  3. 根据权利要求1或2所述低比电阻物质处理方法,其特征在于,所述导电极和所述吸附极之间通过低比电阻物质传导电子、并形成电流。
  4. 根据权利要求1-3任一项所述低比电阻物质处理方法,其特征在于,所述用导电极将电子传导给所述低比电阻物质的步骤包括:所述导电极通过与所述低比电阻物质接触的方式使低比电阻物质带电。
  5. 根据权利要求1-4任一项所述低比电阻物质处理方法,其特征在于,所述导电极上设有至少一个通孔。
  6. 根据权利要求5所述低比电阻物质处理方法,其特征在于,所述用导电极将电子传导给所述低比电阻物质的步骤包括:使所述低比电阻物质通过所述导电极的通孔,使所述低比电阻物质带电。
  7. 根据权利要求1-6任一项所述低比电阻物质处理方法,其特征在于,所述导电极和所述吸附极均安装在一外壳中,所述外壳具有进口和出口。
  8. 根据权利要求1-7任一项所述低比电阻物质处理方法,其特征在于,所述外壳内还包括流道,所述流道位于所述外壳中位于所述进口和所述出口之间。
  9. 根据权利要求1-8任一项所述低比电阻物质处理方法,其特征在于,包括如下步骤:
    所述低比电阻物质由进口进入流道中,并朝向出口方向移动;当所述低比电阻物质经过所述导电极时,所述导电极将电子传导给低比电阻物质,低比电阻物质带电。
  10. 根据权利要求1-9任一项所述低比电阻物质处理方法,其特征在于,所述导电极的截面面积与流道的截面面积比为99%-10%。
  11. 一种低比电阻物质处理装置,包括:
    导电极,能将电子传导给所述低比电阻物质;当电子被传导给所述低比电阻物质时,所述低比电阻物质带电;
    吸附极,能给带电的低比电阻物质施加吸引力。
  12. 根据权利要求11任一项所述低比电阻物质处理装置,其特征在于,所述导电极上设有至少一个通孔。
  13. 根据权利要求11或12所述低比电阻物质处理装置,其特征在于,当所述低比电阻物质通过所述导电极上的通孔时,使所述低比电阻物质带电。
  14. 根据权利要求11-13任一项所述低比电阻物质处理装置,其特征在于,还包括具有进口和出口的外壳,所述导电极和所述吸附极均安装在所述外壳中。
  15. 根据权利要求11-14任一项所述低比电阻物质处理装置,其特征在于,所述外壳内还包括流道,所述流道位于所述外壳中位于所述进口和所述出口之间。
  16. 根据权利要求11-15任一项所述低比电阻物质处理装置,其特征在于,所述导电极的截面面积与所述流道的截面面积比为99%-10%。
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