WO2020184426A1 - Glass plate - Google Patents

Glass plate Download PDF

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Publication number
WO2020184426A1
WO2020184426A1 PCT/JP2020/009642 JP2020009642W WO2020184426A1 WO 2020184426 A1 WO2020184426 A1 WO 2020184426A1 JP 2020009642 W JP2020009642 W JP 2020009642W WO 2020184426 A1 WO2020184426 A1 WO 2020184426A1
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Prior art keywords
glass plate
region
stress
plate
compressive stress
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PCT/JP2020/009642
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French (fr)
Japanese (ja)
Inventor
出 鹿島
齋藤 勲
保真 加藤
尚史 青山
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Agc株式会社
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Publication of WO2020184426A1 publication Critical patent/WO2020184426A1/en

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B27/00Tempering or quenching glass products
    • C03B27/012Tempering or quenching glass products by heat treatment, e.g. for crystallisation; Heat treatment of glass products before tempering by cooling

Definitions

  • the present invention relates to a glass plate.
  • Patent Document 1 A glass plate obtained by chemically treating a glass plate into tempered glass is known (see Patent Document 1).
  • Patent Document 1 is a method for manufacturing a reinforced glass plate and a reinforced glass plate having a compressive stress layer having compressive stress on a main surface and a tensile stress layer having tensile stress inside, and at least a part of an edge portion.
  • the peripheral edge is strengthened by chemical strengthening (ion exchange), but in the case of this method, a difference in the progress of ion exchange is provided between the edge portion and the center depending on the presence or absence of the ion exchange suppressing film, and the difference is high.
  • a directional stress region and a low anisotropic stress region are generated, and the compressive stress layer in the high anisotropic stress region is expanded.
  • not only the compressive stress layer but also the tensile stress layer always remains in the highly anisotropic stress region, and this portion is insufficient in terms of strength. Specifically, there is a problem that cracks may greatly develop from end faces (edges), corners, etc. when dropped.
  • the present invention provides a glass plate that is locally heated to form a physical tensile stress region at least in the center of the plate thickness in a plane, and only a compressive stress region can be formed on the peripheral edge.
  • the glass plate of the present invention is a glass plate having a plate thickness t, and a compressive stress region having compressive stress is formed at least in a part of the end face, and the compressive stress region is in the plate thickness direction of the glass plate.
  • the compressive stress region is formed up to a length of x from the end face to the inside along the surface direction of the glass plate, and the normal line perpendicular to the tangent line of the end face is the glass.
  • the compressive stress region is formed in all directions of the thickness direction of the glass plate, and is formed from the end face to the inside along the surface direction of the glass plate.
  • Tensile stress is not generated, and even when cracks occur, it does not easily extend toward the center of the plate thickness and can be further strengthened.
  • the peripheral edge (including the end face) is particularly liable to fall and be destroyed when the device is dropped, but it is possible to provide a glass plate capable of suppressing fatal damage.
  • FIG. 1 (a) to 1 (c) show an example of a glass plate according to the present invention.
  • 1 (a) is a front perspective view of a rectangular (rectangular) glass plate
  • FIG. 1 (b) is a side view of FIG. 1 (a)
  • FIG. 1 (c) is a front perspective view of a circular glass plate.
  • .. 2A and 2B show a front view of the glass plate according to the present invention.
  • FIG. 2A shows a rectangular shape (rectangular shape)
  • FIG. 2B shows a circular shape.
  • 3A and 3B show schematic views showing a heated state of the glass plate according to the present invention.
  • FIG. 3A shows a side view
  • FIG. 3B shows a front view.
  • FIG. 4 (a) and 4 (b) show schematic views showing the stress distribution of the glass plate according to the present invention.
  • FIG. 4A shows a side view
  • FIG. 4B shows a front view.
  • 5 (a) and 5 (b) are views for Example 1 of a stress behavior simulation of a glass plate.
  • FIG. 5A is a plan view showing 1/4 of the glass plate
  • FIG. 5B is a graph showing the measurement result.
  • 6 (a) and 6 (b) are diagrams for the second embodiment of the stress behavior simulation of the glass plate.
  • FIG. 6A is a plan view showing 1/4 of the glass plate
  • FIG. 6B is a graph showing the measurement result.
  • 7 (a) and 7 (b) are diagrams for Example 3 of a stress behavior simulation of a glass plate.
  • FIG. 4A shows a side view
  • FIG. 4B shows a front view.
  • 5 (a) and 5 (b) are views for Example 1 of a stress behavior simulation of a glass plate.
  • FIG. 7A is a plan view showing 1/4 of the glass plate
  • FIG. 7B is a graph showing the measurement result.
  • 8 (a) and 8 (b) are diagrams for Example 4 of a stress behavior simulation of a glass plate.
  • FIG. 8A is a plan view showing 1/4 of the glass plate
  • FIG. 8B is a graph showing the measurement result.
  • 9 (a) and 9 (b) are diagrams for the fifth embodiment of the stress behavior simulation of the glass plate.
  • FIG. 9A is a plan view showing 1/4 of the glass plate
  • FIG. 9B is a graph showing the measurement result.
  • 10 (a) and 10 (b) are diagrams for the sixth embodiment of the stress behavior simulation of the glass plate.
  • FIG. 10A is a plan view showing a quarter of a glass plate
  • FIG. 10 (a) and 10 (b) are diagrams for the sixth embodiment of the stress behavior simulation of the glass plate.
  • FIG. 10A is a plan view showing a quarter of a glass plate
  • FIG. 10B is a graph showing a measurement result.
  • 11 (a) and 11 (b) are views for Example 7 of a stress behavior simulation of a glass plate.
  • FIG. 11A is a plan view showing a quarter of a glass plate
  • FIG. 11B is a graph showing a measurement result.
  • 12 (a) and 12 (b) are diagrams for Example 8 of a stress behavior simulation of a glass plate.
  • FIG. 12A is a plan view showing 1/4 of the glass plate
  • FIG. 12B is a graph showing the measurement result.
  • FIG. 1A and 1B show an example of a glass plate of the present embodiment
  • FIG. 1A is a front perspective view of a rectangular (rectangular) glass plate
  • FIG. 1B is a side view and a view of FIG. 1A
  • 1 (c) is a front perspective view of a circular glass plate
  • FIG. 2A is a front view of a rectangular (rectangular) glass plate
  • FIG. 2B is a front view of a circular glass plate.
  • the glass plate of the present embodiment will be described with reference to FIGS. 1 and 2.
  • the glass plate 1 of the present embodiment is formed from a flat plate-shaped original glass plate and is used as a cover glass for electronic devices such as smartphones and tablets, and includes a surface 10, an end surface 20, and a plate thickness t.
  • the surface 10 has a first surface 11 and a second surface facing the first surface 11 in the plate thickness direction.
  • the end surface 20 connects the first surface 11 and the second surface 12, and the distance between the first surface 11 and the second surface 12 is the plate thickness t.
  • the end face 20 has a first end face 21, a second end face 22 facing the first end face 21, a third end face 23 and a second end face 22 connecting the first end face 21 and the second end face 22. It has a fourth end face 24 facing the third end face 23. If the glass plate 1 has a circular shape, it will be described as one end face 20.
  • the x-axis, y-axis, and z-axis of Cartesian coordinates are introduced, the surface 10 exists in the plane formed by the x-axis and the y-axis, and the thickness of the end surface 20 is formed on the z-axis. It is defined that there is a plate thickness t to be formed. Further, the length when the normal line V perpendicular to the tangent line P of the end face 20 is maximized in the plane of the glass plate 1 is defined as the length L (see FIG. 2).
  • the short side is the tangent line P
  • the long side is the normal line V
  • the length of the long side is the length L.
  • the length of the diameter is the length L.
  • a physical tensile stress region is formed at least in the center of the plate thickness in a plane not including the vicinity of the end face.
  • the second surface 12 of the glass plate 1 is placed on the heater 100, and the central portion on the first surface 11 side is heated by the heating device 101, as shown in FIG. Heat.
  • the entire glass plate 1 is heated by the heater 100, for example, in the range below the strain point, and locally heated by the heating device 101, for example, above the slow cooling point.
  • Masking 102 may be provided in order to efficiently perform local heating.
  • the heating method of the heating device 101 includes, for example, a heating method by dielectric loss (for example, dielectric heating, microwave heating, etc.), a heating method by light absorption (for example, lamp heating, laser heating, etc.), and a heating method by heat transfer. (For example, heater radiation, hot gas convection, contact heat transfer, etc.).
  • physical strengthening can be performed by heating the central region in the plate thickness direction and the central region in the plan view. That is, it is also possible to generate a temperature difference in the plate thickness direction by selective heating and to form stress in the plate thickness direction.
  • a physical tensile stress region is formed at least in the center of the plate thickness in the plane.
  • a compressive stress region Q As shown in FIG. 4, in the glass plate 1 in which a physical tensile stress region is formed at least in the center of the plate thickness in the plane, a compressive stress region Q, a tensile stress region T, and a neutral region N are formed. ..
  • a compressive stress region Q is formed in the vicinity of the end face 20 side, and the compressive stress region Q is formed over the entire thickness direction (z-axis) of the glass plate 1.
  • the compressive stress region Q is formed from the end surface 20 to the inside along the surface direction of the glass plate 1 up to a length of x.
  • the tensile stress region T is formed between the neutral region N and the neutral region N formed in the center of the glass plate 1.
  • the "compressive stress region Q" is a non-zero negative value when the stress is integrated within a range included in the compressive stress region Q in an arbitrary plane parallel to the plate thickness direction. Refers to the area.
  • the sign of stress is negative for compressive stress and positive for tensile stress.
  • the "tensile stress region T” refers to a region in which the value becomes positive when the stress is integrated within the range included in the tensile stress region T, among arbitrary planes parallel to the plate thickness direction.
  • the “neutral region N” refers to a region that becomes zero when the stress is integrated within the range included in the neutral region N among arbitrary planes parallel to the plate thickness direction. In the generally used physical strengthening and chemical strengthening, the integrated value in the plate thickness direction becomes zero in almost the entire area, and the neutral region is formed in almost the entire area.
  • the compressive stress region Q there is a region within the compressive stress region Q that is continuous from one surface to the other surface and has compressive stress at all points along the plate thickness direction. It is also called the complete compressive stress region. In the present embodiment, the compressive stress region Q and the complete compressive stress region may be the same.
  • the plate thickness t is preferably 0.1 mm or more, more preferably 0.2 mm or more, and further preferably 0.3 mm or more.
  • the plate thickness t is preferably 4 mm or less, more preferably 2 mm or less, and even more preferably 1 mm or less.
  • the compressive stress region Q may be formed up to 1/4 (L / 4) of the long side as the upper limit, and when the glass plate 1 is circular, it is formed up to half the radius. You just have to.
  • the length L is preferably 30 cm or less (L ⁇ 30 cm), more preferably 27.5 cm or less, and further preferably 25 cm or less.
  • the length L is typically preferably 20 cm or more.
  • FIGS. 5 to 12 show the results of simulating and analyzing the stress distribution by changing the conditions of the plate thickness t and the heating region using a square glass plate 1 having a side of 100 mm. ..
  • (a) is a plan view showing 1/4 of the glass plate 1, and represents a heating region and a measurement point.
  • (b) is a graph showing the measurement result.
  • Example 1 the plate thickness t is 1.8 mm, the heating region is 50 mm ⁇ 50 mm, and the film is rapidly cooled after being strongly heated.
  • the measurement of stress behavior is performed by measuring the stress along the x-axis of FIG. 5 (a) along the center of the plate thickness [ ⁇ (hereinafter, white circle)] and the stress along the surface [ ⁇ (hereinafter, hereinafter, white circle). Indicated by white squares)], the process went from the center to the end face 20 along the plane direction.
  • Example 2 the plate thickness t is 1.8 mm, the heating region is 50 mm ⁇ 50 mm, and the film is rapidly cooled after heating.
  • the measurement of stress behavior is the point indicated by the black circle in FIG. 6A.
  • A is the center point of the glass plate 1, and the measured values are indicated by white circles.
  • B is the boundary point of the heating region on the x-axis, and the measured values are indicated by white squares.
  • C is a position 10 mm from the end face 20 on the x-axis, and the measured value is indicated by ⁇ (hereinafter, white triangle).
  • D is the end face 20 on the x-axis, and the measured value is indicated by ⁇ (hereinafter, white rhombus).
  • the measurement was performed from the center of the plate thickness to the surface. From the graph, it can be understood that at points B, C, and D, a negative compressive stress region Q exists from the center of the plate thickness to the surface.
  • Example 3 the plate thickness t is 0.5 mm, the heating region is 50 mm ⁇ 50 mm, and the material is rapidly cooled after being strongly heated.
  • the stress behavior is measured by the stress along the center of the plate thickness (indicated by a white circle) and the stress along the surface (indicated by a white square) on the x-axis of FIG. 7 (a). , From the center to the end face 20 along the plane direction. From the graph, the stress along the center of the plate thickness suddenly changes from tensile stress to negative compressive stress in the vicinity of 25 mm from the center, and in the stress along the surface, there is a negative compressive stress region Q in the entire surface direction. I can understand what you are doing.
  • Example 4 the plate thickness t is 0.5 mm, the heating region is 50 mm ⁇ 50 mm, and the material is rapidly cooled after being strongly heated.
  • the measurement of stress behavior is the point shown by the black circle in FIG. 8A.
  • A is the center point of the glass plate 1, and the measured values are indicated by white circles.
  • B is the boundary point of the heating region on the x-axis, and the measured values are indicated by white squares.
  • C is a position 10 mm from the end face 20 on the x-axis, and the measured value is indicated by a white triangle.
  • D is the end face 20 on the x-axis, and the measured values are shown in white diamonds.
  • the measurement was performed from the center of the plate thickness to the surface. From the graph, it can be understood that at points B, C, and D, a negative compressive stress region Q exists from the center of the plate thickness to the surface.
  • the compressive stress region Q is set in the plate thickness direction of the glass plate 1 by performing the local heat treatment (physical treatment) regardless of the difference in plate thickness. It can be understood that it is formed over all of the above, and is formed from the end face 20 to the inside along the surface direction of the glass plate 1.
  • Example 5 the plate thickness t is 1.8 mm, the heating region is 75 mm ⁇ 75 mm, and the film is rapidly cooled after being strongly heated.
  • the stress behavior is measured by the stress along the center of the plate thickness (indicated by a white circle) and the stress along the surface (indicated by a white square) on the x-axis of FIG. 9 (a). , From the center to the end face 20 along the plane direction. From the graph, the stress along the center of the plate thickness suddenly changes from tensile stress to negative compressive stress near the center 35 mm, and in the stress along the surface, there is a negative compressive stress region Q in the entire surface direction. I can understand what you are doing.
  • Example 6 the plate thickness t is 1.8 mm, the heating region is 75 mm ⁇ 75 mm, and the plate is rapidly cooled after heating.
  • the measurement of stress behavior is the point indicated by the black circle in FIG. 10 (a).
  • A is the center point of the glass plate 1, and the measured values are indicated by white circles.
  • B is the boundary point of the heating region on the x-axis, and the measured values are indicated by white squares.
  • C is the end face 20 on the x-axis, and the measured values are indicated by white triangles.
  • the measurement was performed from the center of the plate thickness to the surface. From the graph, it can be understood that at points B and C, a negative compressive stress region Q exists from the center of the plate thickness to the surface.
  • Example 7 the plate thickness t is 0.5 mm, the heating region is 75 mm ⁇ 75 mm, and the material is rapidly cooled after being strongly heated.
  • the stress behavior is measured by the stress along the center of the plate thickness (indicated by a white circle) and the stress along the surface (indicated by a white square) on the x-axis of FIG. 11 (a).
  • Example 8 the plate thickness t is 0.5 mm, the heating region is 75 mm ⁇ 75 mm, and the material is rapidly cooled after being strongly heated.
  • the measurement of stress behavior is the point indicated by the black circle in FIG. 12 (a).
  • A is the center point of the glass plate 1, and the measured values are indicated by white circles.
  • B is the boundary point of the heating region on the x-axis, and the measured values are indicated by white squares.
  • C is the end face 20 on the x-axis, and the measured values are indicated by white triangles.
  • the measurement was performed from the center of the plate thickness to the surface. From the graph, it can be understood that at points B and C, a negative compressive stress region Q exists from the center of the plate thickness to the surface.
  • the present invention is not limited to the above-described embodiment, and can be appropriately modified, improved, and the like.
  • the material, shape, size, numerical value, form, number, arrangement location, etc. of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.
  • the glass plate of the present invention is suitably used in a field where a tempered glass plate in which a physical tensile stress region is formed at least in the center of the thickness of the glass plate in a plane is required.

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

A glass plate (1) that has surfaces (10), an end surface (20), and a plate thickness t. The maximum length along the surfaces of the glass plate (1) of normal lines (V) that are perpendicular to tangents to the end surface (20) is defined as length L. Physical strengthening is achieved by local heating of a plate-thickness-direction center region and a plan-view center region, and a compressive stress region (Q) is formed at at least a portion of the end surface (20). The compressive stress region (Q) is formed over the entire plate-thickness direction of the glass plate (1) and from the end surface (20) to the inside to a length of x along the surface direction of the glass plate. Length x satisfies t≤x≤L/4, and, as a result, unlike with chemical strengthening, tensile stress is not generated near the end surface (20), which leads to greater strengthening that, even if a crack occurs, impedes elongation toward the center of the plate thickness.

Description

ガラス板Glass plate
 本発明は、ガラス板に関する。 The present invention relates to a glass plate.
 ガラス板を化学処理して強化ガラスにしたガラス板が知られている(特許文献1参照)。 A glass plate obtained by chemically treating a glass plate into tempered glass is known (see Patent Document 1).
 特許文献1は、圧縮応力を有する圧縮応力層を主面に備え、引張応力を有する引張応力層を内部に備えた強化ガラス板および強化ガラス板の製造方法であり、端縁部の少なくとも一部に設けられ、主面と平行な面内で異方性を示す応力を有する高異方性応力領域と、高異方性応力領域に隣接して主面方向の中央側に設けられ、主面と平行な同一面内において高異方性応力領域より低い異方性を示す応力を有する低異方性応力領域を備えることにより、領域を跨ぐクラックの進展を抑制できることが開示されている。 Patent Document 1 is a method for manufacturing a reinforced glass plate and a reinforced glass plate having a compressive stress layer having compressive stress on a main surface and a tensile stress layer having tensile stress inside, and at least a part of an edge portion. A highly anisotropic stress region having a stress showing anisotropy in a plane parallel to the main surface, and a highly anisotropic stress region adjacent to the highly anisotropic stress region and provided on the central side in the main surface direction and provided on the main surface. It is disclosed that the growth of cracks across the regions can be suppressed by providing a low anisotropic stress region having a stress showing anisotropy lower than that of the highly anisotropic stress region in the same plane parallel to the region.
国際公開第2017/217388号International Publication No. 2017/217388
 特許文献1は、化学強化(イオン交換)により周縁を強化しているが、この方法の場合、イオン交換抑制膜の有無により、端縁部と中央でイオン交換の進度の差を設け、高異方性応力領域と低異方性応力領域が生じさせ、高異方性応力領域の圧縮応力層を拡げている。しかしながら、このような製法では高異方性応力領域には圧縮応力層のみならず、引張応力層も必ず残存することとなり、この部分は強度の点から不十分なことになる。具体的には落下時などに、端面(エッジ)、コーナー等からクラックが大きく進展してしまう恐れがあるという課題があった。 In Patent Document 1, the peripheral edge is strengthened by chemical strengthening (ion exchange), but in the case of this method, a difference in the progress of ion exchange is provided between the edge portion and the center depending on the presence or absence of the ion exchange suppressing film, and the difference is high. A directional stress region and a low anisotropic stress region are generated, and the compressive stress layer in the high anisotropic stress region is expanded. However, in such a manufacturing method, not only the compressive stress layer but also the tensile stress layer always remains in the highly anisotropic stress region, and this portion is insufficient in terms of strength. Specifically, there is a problem that cracks may greatly develop from end faces (edges), corners, etc. when dropped.
 本発明は、局所的に加熱して平面内の少なくとも板厚中心部に物理的な引張応力領域の形成を行い、周縁に圧縮応力領域のみ形成可能としたガラス板を提供する。 The present invention provides a glass plate that is locally heated to form a physical tensile stress region at least in the center of the plate thickness in a plane, and only a compressive stress region can be formed on the peripheral edge.
 本発明のガラス板は、板厚tを有するガラス板であって、少なくとも端面の一部において圧縮応力を有する圧縮応力領域が形成されており、前記圧縮応力領域は、当該ガラス板の板厚方向の全てに亘って形成され、当該圧縮応力領域は、前記端面から当該ガラス板の面方向に沿って内側までxの長さまで形成され、前記端面の接線に対して垂直な法線が、当該ガラス板の面内において最大となるときの長さを長さLとして定義した場合、t≦x≦L/4が成立する。 The glass plate of the present invention is a glass plate having a plate thickness t, and a compressive stress region having compressive stress is formed at least in a part of the end face, and the compressive stress region is in the plate thickness direction of the glass plate. The compressive stress region is formed up to a length of x from the end face to the inside along the surface direction of the glass plate, and the normal line perpendicular to the tangent line of the end face is the glass. When the maximum length in the plane of the plate is defined as the length L, t ≦ x ≦ L / 4 holds.
 本発明によれば、圧縮応力領域が、ガラス板の板厚方向の全てに亘って形成され、端面からガラス板の面方向に沿って内側まで形成されることにより、化学強化と異なり端面近傍に引張応力が発生せず、クラック発生時も板厚の中心方向へ伸びにくくより強化が図れる。周縁(端面を含む)は機器の落下時などに、特に真っ先に落ちて破壊され易いが、致命的な破損を抑制できるガラス板を提供できる。 According to the present invention, the compressive stress region is formed in all directions of the thickness direction of the glass plate, and is formed from the end face to the inside along the surface direction of the glass plate. Tensile stress is not generated, and even when cracks occur, it does not easily extend toward the center of the plate thickness and can be further strengthened. The peripheral edge (including the end face) is particularly liable to fall and be destroyed when the device is dropped, but it is possible to provide a glass plate capable of suppressing fatal damage.
図1(a)~(c)は、本発明に係るガラス板の一例を示す。図1(a)は長方形状(矩形状)ガラス板の正面斜視図、図1(b)は図1(a)の側面図、図1(c)は円形状ガラス板の正面斜視図を示す。1 (a) to 1 (c) show an example of a glass plate according to the present invention. 1 (a) is a front perspective view of a rectangular (rectangular) glass plate, FIG. 1 (b) is a side view of FIG. 1 (a), and FIG. 1 (c) is a front perspective view of a circular glass plate. .. 図2(a)及び(b)は、本発明に係るガラス板の正面図を示す。図2(a)は長方形状(矩形状)、図2(b)は円形状を示す。2A and 2B show a front view of the glass plate according to the present invention. FIG. 2A shows a rectangular shape (rectangular shape), and FIG. 2B shows a circular shape. 図3(a)及び(b)は、本発明に係るガラス板の加熱状態を示す模式図を示す。図3(a)は側面視、図3(b)は正面視を示す。3A and 3B show schematic views showing a heated state of the glass plate according to the present invention. FIG. 3A shows a side view, and FIG. 3B shows a front view. 図4(a)及び(b)は、本発明に係るガラス板の応力分布を示す模式図を示す。図4(a)は側面視、図4(b)は正面視を示す。4 (a) and 4 (b) show schematic views showing the stress distribution of the glass plate according to the present invention. FIG. 4A shows a side view, and FIG. 4B shows a front view. 図5(a)及び(b)は、ガラス板の応力挙動シミュレーションの実施例1についての図である。図5(a)はガラス板の1/4を示す平面図、図5(b)は測定結果を示すグラフである。5 (a) and 5 (b) are views for Example 1 of a stress behavior simulation of a glass plate. FIG. 5A is a plan view showing 1/4 of the glass plate, and FIG. 5B is a graph showing the measurement result. 図6(a)及び(b)は、ガラス板の応力挙動シミュレーションの実施例2についての図である。図6(a)はガラス板の1/4を示す平面図、図6(b)は測定結果を示すグラフである。6 (a) and 6 (b) are diagrams for the second embodiment of the stress behavior simulation of the glass plate. FIG. 6A is a plan view showing 1/4 of the glass plate, and FIG. 6B is a graph showing the measurement result. 図7(a)及び(b)は、ガラス板の応力挙動シミュレーションの実施例3についての図である。図7(a)はガラス板の1/4を示す平面図、図7(b)は測定結果を示すグラフである。7 (a) and 7 (b) are diagrams for Example 3 of a stress behavior simulation of a glass plate. FIG. 7A is a plan view showing 1/4 of the glass plate, and FIG. 7B is a graph showing the measurement result. 図8(a)及び(b)は、ガラス板の応力挙動シミュレーションの実施例4についての図である。図8(a)はガラス板の1/4を示す平面図、図8(b)測定結果を示すグラフである。8 (a) and 8 (b) are diagrams for Example 4 of a stress behavior simulation of a glass plate. FIG. 8A is a plan view showing 1/4 of the glass plate, and FIG. 8B is a graph showing the measurement result. 図9(a)及び(b)は、ガラス板の応力挙動シミュレーションの実施例5についての図である。図9(a)はガラス板の1/4を示す平面図、図9(b)は測定結果を示すグラフである。9 (a) and 9 (b) are diagrams for the fifth embodiment of the stress behavior simulation of the glass plate. FIG. 9A is a plan view showing 1/4 of the glass plate, and FIG. 9B is a graph showing the measurement result. 図10(a)及び(b)は、ガラス板の応力挙動シミュレーションの実施例6についての図である。図10(a)はガラス板の1/4を示す平面図、図10(b)は測定結果を示すグラフである。10 (a) and 10 (b) are diagrams for the sixth embodiment of the stress behavior simulation of the glass plate. FIG. 10A is a plan view showing a quarter of a glass plate, and FIG. 10B is a graph showing a measurement result. 図11(a)及び(b)は、ガラス板の応力挙動シミュレーションの実施例7についての図である。図11(a)はガラス板の1/4を示す平面図、図11(b)は測定結果を示すグラフである。11 (a) and 11 (b) are views for Example 7 of a stress behavior simulation of a glass plate. FIG. 11A is a plan view showing a quarter of a glass plate, and FIG. 11B is a graph showing a measurement result. 図12(a)及び(b)は、ガラス板の応力挙動シミュレーションの実施例8について図である。図12(a)はガラス板の1/4を示す平面図、図12(b)は測定結果を示すグラフである。12 (a) and 12 (b) are diagrams for Example 8 of a stress behavior simulation of a glass plate. FIG. 12A is a plan view showing 1/4 of the glass plate, and FIG. 12B is a graph showing the measurement result.
 以下、図面を用いて、本発明に係るガラス板の具体的な実施の形態について詳述する。 Hereinafter, specific embodiments of the glass plate according to the present invention will be described in detail with reference to the drawings.
 図1は、本実施形態のガラス板の一例を示し、図1(a)は長方形状(矩形状)ガラス板の正面斜視図、図1(b)は図1(a)の側面図、図1(c)は円形状ガラス板の正面斜視図である。図2(a)は長方形状(矩形状)のガラス板の正面図、図2(b)は円形状のガラス板の正面図である。図1及び図2に基づいて本実施形態のガラス板を説明する。 1A and 1B show an example of a glass plate of the present embodiment, FIG. 1A is a front perspective view of a rectangular (rectangular) glass plate, and FIG. 1B is a side view and a view of FIG. 1A. 1 (c) is a front perspective view of a circular glass plate. FIG. 2A is a front view of a rectangular (rectangular) glass plate, and FIG. 2B is a front view of a circular glass plate. The glass plate of the present embodiment will be described with reference to FIGS. 1 and 2.
 本実施形態のガラス板1は、平板状の元ガラス板から成形され、スマートフォン、タブレットなどの電子機器用のカバーガラスとして用いられ、面10と、端面20と、板厚tとを備える。板厚方向に対して、面10は、第1面11と、第1面11に対向した第2面とを有する。端面20は、第1面11と第2面12とを繋ぎ、第1面11と第2面12との距離が板厚tである。ガラス板1が矩形状であれば、端面20は、第1端面21と、第1端面21に対向する第2端面22と、第1端面21及び第2端面22を繋ぐ第3端面23及び第3端面23に対向する第4端面24を有する。ガラス板1が円形状であれば、一つの端面20として説明する。 The glass plate 1 of the present embodiment is formed from a flat plate-shaped original glass plate and is used as a cover glass for electronic devices such as smartphones and tablets, and includes a surface 10, an end surface 20, and a plate thickness t. The surface 10 has a first surface 11 and a second surface facing the first surface 11 in the plate thickness direction. The end surface 20 connects the first surface 11 and the second surface 12, and the distance between the first surface 11 and the second surface 12 is the plate thickness t. If the glass plate 1 has a rectangular shape, the end face 20 has a first end face 21, a second end face 22 facing the first end face 21, a third end face 23 and a second end face 22 connecting the first end face 21 and the second end face 22. It has a fourth end face 24 facing the third end face 23. If the glass plate 1 has a circular shape, it will be described as one end face 20.
 ガラス板1の構成に基づいて、直交座標のx軸、y軸、z軸を導入し、x軸とy軸とがなす平面内に面10が存在し、z軸に端面20の厚みが形成される板厚tが存在すると定義する。また、端面20の接線Pに対して垂直な法線Vが、ガラス板1の面内において最大となるときの長さを長さLと定義する(図2参照)。ガラス板1が平面視(x軸-y軸)において長方形状である場合、短辺を接線Pとし、長辺を法線Vとして長辺の長さが長さLとなる。また、ガラス板1が平面視において円形である場合は、直径の長さが長さLとなる。 Based on the configuration of the glass plate 1, the x-axis, y-axis, and z-axis of Cartesian coordinates are introduced, the surface 10 exists in the plane formed by the x-axis and the y-axis, and the thickness of the end surface 20 is formed on the z-axis. It is defined that there is a plate thickness t to be formed. Further, the length when the normal line V perpendicular to the tangent line P of the end face 20 is maximized in the plane of the glass plate 1 is defined as the length L (see FIG. 2). When the glass plate 1 has a rectangular shape in a plan view (x-axis −y-axis), the short side is the tangent line P, the long side is the normal line V, and the length of the long side is the length L. When the glass plate 1 is circular in a plan view, the length of the diameter is the length L.
 本実施形態のガラス板1は、端面近傍を含まない平面内の少なくとも板厚中心部に、物理的な引張応力領域が形成されている。物理的な引張応力領域の形成は、図3に示されるように、例えばヒータ100上にガラス板1の第2面12を載置して、第1面11側の中央部分を加熱装置101で加熱する。ヒータ100によりガラス板1全体を、例えば歪点以下の範囲で加熱し、加熱装置101で、例えば徐冷点以上で局所的に加熱する。局所加熱を効率良く行うためにマスキング102を設けてもよい。加熱装置101の加熱方法は、例えば誘電体損失よる加熱方法(例えば、誘電加熱、マイクロ波加熱など)や、光吸収による加熱方法(例えば、ランプ加熱、レーザ加熱など)や、伝熱による加熱方法(例えば、ヒータ輻射、ホットガス対流、接触熱伝達など)である。さらに、板厚方向で中心領域、平面視で中央領域を加熱することにより物理的な強化ができる。即ち、選択的な加熱により板厚方向に温度差を生じさせ、板厚方向に応力を形成させる事も可能である。ガラス板1の平面視で中央領域のみ局所的に加熱して、周縁に強化された圧縮応力を入れるため、平面内の少なくとも板厚中心部に物理的な引張応力領域の形成を行っている。 In the glass plate 1 of the present embodiment, a physical tensile stress region is formed at least in the center of the plate thickness in a plane not including the vicinity of the end face. To form the physical tensile stress region, for example, the second surface 12 of the glass plate 1 is placed on the heater 100, and the central portion on the first surface 11 side is heated by the heating device 101, as shown in FIG. Heat. The entire glass plate 1 is heated by the heater 100, for example, in the range below the strain point, and locally heated by the heating device 101, for example, above the slow cooling point. Masking 102 may be provided in order to efficiently perform local heating. The heating method of the heating device 101 includes, for example, a heating method by dielectric loss (for example, dielectric heating, microwave heating, etc.), a heating method by light absorption (for example, lamp heating, laser heating, etc.), and a heating method by heat transfer. (For example, heater radiation, hot gas convection, contact heat transfer, etc.). Further, physical strengthening can be performed by heating the central region in the plate thickness direction and the central region in the plan view. That is, it is also possible to generate a temperature difference in the plate thickness direction by selective heating and to form stress in the plate thickness direction. In order to locally heat only the central region of the glass plate 1 in a plan view and apply enhanced compressive stress to the peripheral edge, a physical tensile stress region is formed at least in the center of the plate thickness in the plane.
 図4に示されるように、平面内の少なくとも板厚中心部に物理的な引張応力領域が形成されたガラス板1は、圧縮応力領域Qと引張応力領域Tとニュートラル領域Nとが形成される。端面20側近傍では全て圧縮応力領域Qが形成され、また、圧縮応力領域Qはガラス板1の板厚方向(z軸)の全てに亘って形成されている。そして、圧縮応力領域Qは、端面20からガラス板1の面方向に沿って内側までxの長さまで形成されている。一方、引張応力領域Tは、ガラス板1の中央に形成されるニュートラル領域Nとの間に形成されている。 As shown in FIG. 4, in the glass plate 1 in which a physical tensile stress region is formed at least in the center of the plate thickness in the plane, a compressive stress region Q, a tensile stress region T, and a neutral region N are formed. .. A compressive stress region Q is formed in the vicinity of the end face 20 side, and the compressive stress region Q is formed over the entire thickness direction (z-axis) of the glass plate 1. The compressive stress region Q is formed from the end surface 20 to the inside along the surface direction of the glass plate 1 up to a length of x. On the other hand, the tensile stress region T is formed between the neutral region N and the neutral region N formed in the center of the glass plate 1.
 本明細書において、「圧縮応力領域Q」とは、板厚方向に平行な任意の平面内で、圧縮応力領域Q内に含まれる範囲で応力を積分した場合、ゼロではない負の値となる領域をさす。ここで応力の符号を圧縮応力は負、引張応力は正としている。同様に、「引張応力領域T」とは板厚方向に平行な任意の平面のうち、引張応力領域T内に含まれる範囲で応力を積分した場合に値が正となる領域をさす。「ニュートラル領域N」とは、板厚方向に平行な任意の平面のうち、ニュートラル領域N内に含まれる範囲で応力を積分した場合、ゼロとなる領域をさす。一般的に用いられる物理強化、化学強化では、板厚方向の積分値はほぼ全域でゼロとなり、ほぼ全域でニュートラル領域となる。 In the present specification, the "compressive stress region Q" is a non-zero negative value when the stress is integrated within a range included in the compressive stress region Q in an arbitrary plane parallel to the plate thickness direction. Refers to the area. Here, the sign of stress is negative for compressive stress and positive for tensile stress. Similarly, the "tensile stress region T" refers to a region in which the value becomes positive when the stress is integrated within the range included in the tensile stress region T, among arbitrary planes parallel to the plate thickness direction. The “neutral region N” refers to a region that becomes zero when the stress is integrated within the range included in the neutral region N among arbitrary planes parallel to the plate thickness direction. In the generally used physical strengthening and chemical strengthening, the integrated value in the plate thickness direction becomes zero in almost the entire area, and the neutral region is formed in almost the entire area.
 本実施形態では、圧縮応力領域Q内の領域であって、一方の表面からもう一方の表面まで連続しており、かつ板厚方向に沿ったすべての点で圧縮応力である領域が存在する。それを完全圧縮応力領域とも呼ぶ。本実施形態においては、圧縮応力領域Qと完全圧縮応力領域とを同一とする場合もある。 In the present embodiment, there is a region within the compressive stress region Q that is continuous from one surface to the other surface and has compressive stress at all points along the plate thickness direction. It is also called the complete compressive stress region. In the present embodiment, the compressive stress region Q and the complete compressive stress region may be the same.
 板厚方向に沿って完全に圧縮応力となる(完全)圧縮応力領域Qが、面方向に沿って板厚t以上であると、実用上十分な強度があるガラス板1が得られ、製造上妥当範囲としてはL/4以下となることが好ましい。即ち、t≦x≦L/4の関係式が成立する。この関係式において、板厚tは0.1mm以上が好ましく、0.2mm以上がより好ましく、0.3mm以上がさらに好ましい。また、板厚tは、4mm以下が好ましく、2mm以下がより好ましく、1mm以下がさらに好ましい。ガラス板1が長方形状(矩形)の場合、上限として長辺の1/4(L/4)まで、圧縮応力領域Qが形成されていればよく、円形状の場合、半径の半分まで形成されていればよい。また、長さLが30cm以下(L≦30cm)であることが好ましく、27.5cm以下がより好ましく、25cm以下がさらに好ましい。長さLは典型的には20cm以上であることが好ましい。 When the (complete) compressive stress region Q, which is completely compressive stress along the plate thickness direction, is equal to or greater than the plate thickness t along the plane direction, a glass plate 1 having practically sufficient strength can be obtained, and in manufacturing. The appropriate range is preferably L / 4 or less. That is, the relational expression of t ≦ x ≦ L / 4 is established. In this relational expression, the plate thickness t is preferably 0.1 mm or more, more preferably 0.2 mm or more, and further preferably 0.3 mm or more. The plate thickness t is preferably 4 mm or less, more preferably 2 mm or less, and even more preferably 1 mm or less. When the glass plate 1 is rectangular (rectangular), the compressive stress region Q may be formed up to 1/4 (L / 4) of the long side as the upper limit, and when the glass plate 1 is circular, it is formed up to half the radius. You just have to. Further, the length L is preferably 30 cm or less (L ≦ 30 cm), more preferably 27.5 cm or less, and further preferably 25 cm or less. The length L is typically preferably 20 cm or more.
 図5から図12の実施例は、1辺が100mmの正方形のガラス板1を用いて、板厚t及び加熱領域の条件を変更し、応力の分布をシミュレーションして解析した結果を示している。図中(a)は、ガラス板1の1/4を示す平面図で、加熱領域及び測定点を表している。図中(b)は、測定結果を示すグラフである。 The examples of FIGS. 5 to 12 show the results of simulating and analyzing the stress distribution by changing the conditions of the plate thickness t and the heating region using a square glass plate 1 having a side of 100 mm. .. In the figure, (a) is a plan view showing 1/4 of the glass plate 1, and represents a heating region and a measurement point. In the figure, (b) is a graph showing the measurement result.
 実施例1(図5)は、板厚tが1.8mm、加熱領域50mm×50mmで強加熱後急冷している。応力の挙動の測定は、図5(a)のx軸上において板厚の中心に沿った応力[○(以下、白円)で示されている]と表面に沿った応力[□(以下、白四角)で示されている]で、中心から面方向に沿って端面20まで行った。グラフから、板厚の中心に沿った応力は、中心から25mm近傍で急激に引張応力からマイナスの圧縮応力に変化し、表面に沿った応力では、面方向全体でマイナスの圧縮応力領域Qが存在していることが理解できる。 In Example 1 (FIG. 5), the plate thickness t is 1.8 mm, the heating region is 50 mm × 50 mm, and the film is rapidly cooled after being strongly heated. The measurement of stress behavior is performed by measuring the stress along the x-axis of FIG. 5 (a) along the center of the plate thickness [○ (hereinafter, white circle)] and the stress along the surface [□ (hereinafter, hereinafter, white circle). Indicated by white squares)], the process went from the center to the end face 20 along the plane direction. From the graph, the stress along the center of the plate thickness suddenly changes from tensile stress to negative compressive stress in the vicinity of 25 mm from the center, and in the stress along the surface, there is a negative compressive stress region Q in the entire surface direction. I can understand what you are doing.
 実施例2(図6)は、板厚tが1.8mm、加熱領域50mm×50mmで加熱後急冷している。応力の挙動の測定は、図6(a)に黒円で示される点である。Aがガラス板1の中心点であり測定値は白円で示している。Bがx軸上の加熱領域境界点であり測定値は白四角で示している。Cがx軸上の端面20から10mmの位置であり測定値は△(以下、白三角)で示している。Dがx軸上の端面20であり測定値は◇(以下、白ひし形)で示している。測定は板厚中心から表面まで行った。グラフから、B、C、D点では、板厚中心から表面まで全てマイナスの圧縮応力領域Qが存在していることが理解できる。 In Example 2 (FIG. 6), the plate thickness t is 1.8 mm, the heating region is 50 mm × 50 mm, and the film is rapidly cooled after heating. The measurement of stress behavior is the point indicated by the black circle in FIG. 6A. A is the center point of the glass plate 1, and the measured values are indicated by white circles. B is the boundary point of the heating region on the x-axis, and the measured values are indicated by white squares. C is a position 10 mm from the end face 20 on the x-axis, and the measured value is indicated by Δ (hereinafter, white triangle). D is the end face 20 on the x-axis, and the measured value is indicated by ◇ (hereinafter, white rhombus). The measurement was performed from the center of the plate thickness to the surface. From the graph, it can be understood that at points B, C, and D, a negative compressive stress region Q exists from the center of the plate thickness to the surface.
 実施例3(図7)は、板厚tが0.5mm、加熱領域50mm×50mmで強加熱後急冷している。応力の挙動の測定は、図7(a)のx軸上において板厚の中心に沿った応力(白円で示されている)と表面に沿った応力(白四角で示されている)で、中心から面方向に沿って端面20まで行った。グラフから、板厚の中心に沿った応力は、中心から25mm近傍で急激に引張応力からマイナスの圧縮応力に変化し、表面に沿った応力では、面方向全体でマイナスの圧縮応力領域Qが存在していることが理解できる。 In Example 3 (FIG. 7), the plate thickness t is 0.5 mm, the heating region is 50 mm × 50 mm, and the material is rapidly cooled after being strongly heated. The stress behavior is measured by the stress along the center of the plate thickness (indicated by a white circle) and the stress along the surface (indicated by a white square) on the x-axis of FIG. 7 (a). , From the center to the end face 20 along the plane direction. From the graph, the stress along the center of the plate thickness suddenly changes from tensile stress to negative compressive stress in the vicinity of 25 mm from the center, and in the stress along the surface, there is a negative compressive stress region Q in the entire surface direction. I can understand what you are doing.
 実施例4(図8)は、板厚tが0.5mm、加熱領域50mm×50mmで強加熱後急冷している。応力の挙動の測定は、図8(a)に黒円で示される点である。Aがガラス板1の中心点であり測定値は白円で示している。Bがx軸上の加熱領域境界点であり測定値は白四角で示している。Cがx軸上の端面20から10mmの位置であり測定値は白三角で示している。Dがx軸上の端面20であり測定値は白ひし形で示している。測定は板厚中心から表面まで行った。グラフから、B、C、D点では、板厚中心から表面まで全てマイナスの圧縮応力領域Qが存在していることが理解できる。 In Example 4 (FIG. 8), the plate thickness t is 0.5 mm, the heating region is 50 mm × 50 mm, and the material is rapidly cooled after being strongly heated. The measurement of stress behavior is the point shown by the black circle in FIG. 8A. A is the center point of the glass plate 1, and the measured values are indicated by white circles. B is the boundary point of the heating region on the x-axis, and the measured values are indicated by white squares. C is a position 10 mm from the end face 20 on the x-axis, and the measured value is indicated by a white triangle. D is the end face 20 on the x-axis, and the measured values are shown in white diamonds. The measurement was performed from the center of the plate thickness to the surface. From the graph, it can be understood that at points B, C, and D, a negative compressive stress region Q exists from the center of the plate thickness to the surface.
 実施例1から実施例4での応力挙動測定の結果、板厚の相違に関わらず、局所的な加熱処理(物理処理)を行うことにより、圧縮応力領域Qは、ガラス板1の板厚方向の全てに亘って形成され、端面20からガラス板1の面方向に沿って内側まで形成されていることが理解できる。 As a result of the stress behavior measurement in Examples 1 to 4, the compressive stress region Q is set in the plate thickness direction of the glass plate 1 by performing the local heat treatment (physical treatment) regardless of the difference in plate thickness. It can be understood that it is formed over all of the above, and is formed from the end face 20 to the inside along the surface direction of the glass plate 1.
 実施例5(図9)は、板厚tが1.8mm、加熱領域75mm×75mmで強加熱後急冷している。応力の挙動の測定は、図9(a)のx軸上において板厚の中心に沿った応力(白円で示されている)と表面に沿った応力(白四角で示されている)で、中心から面方向に沿って端面20まで行った。グラフから、板厚の中心に沿った応力は、中心から35mm近傍で急激に引張応力からマイナスの圧縮応力に変化し、表面に沿った応力では、面方向全体でマイナスの圧縮応力領域Qが存在していることが理解できる。 In Example 5 (FIG. 9), the plate thickness t is 1.8 mm, the heating region is 75 mm × 75 mm, and the film is rapidly cooled after being strongly heated. The stress behavior is measured by the stress along the center of the plate thickness (indicated by a white circle) and the stress along the surface (indicated by a white square) on the x-axis of FIG. 9 (a). , From the center to the end face 20 along the plane direction. From the graph, the stress along the center of the plate thickness suddenly changes from tensile stress to negative compressive stress near the center 35 mm, and in the stress along the surface, there is a negative compressive stress region Q in the entire surface direction. I can understand what you are doing.
 実施例6(図10)は、板厚tが1.8mm、加熱領域75mm×75mmで加熱後急冷している。応力の挙動の測定は、図10(a)に黒円で示される点である。Aがガラス板1の中心点であり測定値は白円で示している。Bがx軸上の加熱領域境界点であり測定値は白四角で示している。Cがx軸上の端面20であり測定値は白三角で示している。測定は板厚中心から表面まで行った。グラフから、B及びC点では、板厚中心から表面まで全てマイナスの圧縮応力領域Qが存在していることが理解できる。 In Example 6 (FIG. 10), the plate thickness t is 1.8 mm, the heating region is 75 mm × 75 mm, and the plate is rapidly cooled after heating. The measurement of stress behavior is the point indicated by the black circle in FIG. 10 (a). A is the center point of the glass plate 1, and the measured values are indicated by white circles. B is the boundary point of the heating region on the x-axis, and the measured values are indicated by white squares. C is the end face 20 on the x-axis, and the measured values are indicated by white triangles. The measurement was performed from the center of the plate thickness to the surface. From the graph, it can be understood that at points B and C, a negative compressive stress region Q exists from the center of the plate thickness to the surface.
 実施例7(図11)は、板厚tが0.5mm、加熱領域75mm×75mmで強加熱後急冷している。応力の挙動の測定は、図11(a)のx軸上において板厚の中心に沿った応力(白円で示されている)と表面に沿った応力(白四角で示されている)で、中心から面方向に沿って端面20まで行った。グラフから、板厚の中心に沿った応力は、中心から35mm近傍で急激に引張応力からマイナスの圧縮応力に変化し、表面に沿った応力では、面方向全体でマイナスの圧縮応力領域Qが存在していることが理解できる。 In Example 7 (FIG. 11), the plate thickness t is 0.5 mm, the heating region is 75 mm × 75 mm, and the material is rapidly cooled after being strongly heated. The stress behavior is measured by the stress along the center of the plate thickness (indicated by a white circle) and the stress along the surface (indicated by a white square) on the x-axis of FIG. 11 (a). , From the center to the end face 20 along the plane direction. From the graph, the stress along the center of the plate thickness suddenly changes from tensile stress to negative compressive stress near the center 35 mm, and in the stress along the surface, there is a negative compressive stress region Q in the entire surface direction. I can understand what you are doing.
 実施例8(図12)は、板厚tが0.5mm、加熱領域75mm×75mmで強加熱後急冷している。応力の挙動の測定は、図12(a)に黒円で示される点である。Aがガラス板1の中心点であり測定値は白円で示している。Bがx軸上の加熱領域境界点であり測定値は白四角で示している。Cがx軸上の端面20であり測定値は白三角で示している。測定は板厚中心から表面まで行った。グラフから、B及びC点では、板厚中心から表面まで全てマイナスの圧縮応力領域Qが存在していることが理解できる。 In Example 8 (FIG. 12), the plate thickness t is 0.5 mm, the heating region is 75 mm × 75 mm, and the material is rapidly cooled after being strongly heated. The measurement of stress behavior is the point indicated by the black circle in FIG. 12 (a). A is the center point of the glass plate 1, and the measured values are indicated by white circles. B is the boundary point of the heating region on the x-axis, and the measured values are indicated by white squares. C is the end face 20 on the x-axis, and the measured values are indicated by white triangles. The measurement was performed from the center of the plate thickness to the surface. From the graph, it can be understood that at points B and C, a negative compressive stress region Q exists from the center of the plate thickness to the surface.
 実施例5から実施例8での応力挙動測定の結果、実施例1から実施例4までと同様に板厚の相違に関わらず、局所的な加熱処理(物理処理)を行うことにより、圧縮応力領域Qは、ガラス板1の板厚方向の全てに亘って形成され、端面20からガラス板1の面方向に沿って内側まで形成されていることが理解できる。また、実施例1から4と実施例5から8との比較において、全体を加熱してしまうと、中央領域における表面が引張応力となりガラス板1が強化不十分となるため、本実施形態のガラス板1の様に局所的に加熱することが重要であることが理解できる。 As a result of stress behavior measurement in Examples 5 to 8, compressive stress was performed by performing local heat treatment (physical treatment) regardless of the difference in plate thickness as in Examples 1 to 4. It can be understood that the region Q is formed over the entire thickness direction of the glass plate 1 and is formed from the end surface 20 to the inside along the surface direction of the glass plate 1. Further, in comparison between Examples 1 to 4 and Examples 5 to 8, if the whole is heated, the surface in the central region becomes tensile stress and the glass plate 1 is insufficiently strengthened. Therefore, the glass of the present embodiment is insufficiently strengthened. It can be understood that it is important to heat locally like the plate 1.
 尚、本発明は、上述した実施形態に限定されるものではなく、適宜、変形、改良、等が可能である。その他、上述した実施形態における各構成要素の材質、形状、寸法、数値、形態、数、配置箇所、等は本発明を達成できるものであれば任意であり、限定されない。 The present invention is not limited to the above-described embodiment, and can be appropriately modified, improved, and the like. In addition, the material, shape, size, numerical value, form, number, arrangement location, etc. of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.
 本発明のガラス板は、ガラス板周縁が平面内の少なくとも板厚中心部に物理的な引張応力領域が形成された強化ガラス板を要求する分野に好適に用いられる。 The glass plate of the present invention is suitably used in a field where a tempered glass plate in which a physical tensile stress region is formed at least in the center of the thickness of the glass plate in a plane is required.
 本発明を特定の態様を参照して詳細に説明したが、本発明の精神と範囲を離れることなく様々な変更および修正が可能であることは、当業者にとって明らかである。なお、本出願は、2019年3月13日付けで出願された日本特許出願(特願2019-046226)に基づいており、その全体が引用により援用される。また、ここに引用されるすべての参照は全体として取り込まれる。 Although the present invention has been described in detail with reference to specific embodiments, it will be apparent to those skilled in the art that various modifications and modifications can be made without departing from the spirit and scope of the invention. This application is based on a Japanese patent application (Japanese Patent Application No. 2019-046226) filed on March 13, 2019, and the entire application is incorporated by reference. Also, all references cited here are taken in as a whole.
 1 ガラス板
 10 面
 11 第1面
 12 第2面
 20 端面
 21 第1端面
 22 第2端面
 23 第3端面
 24 第4端面
 L 長さ
 N ニュートラル領域
 Q 圧縮応力領域
 x 長さ
 T 引張応力領域
 t 板厚
1 Glass plate 10 surface 11 1st surface 12 2nd surface 20 End surface 21 1st end surface 22 2nd end surface 23 3rd end surface 24 4th end surface L Length N Neutral region Q Compressive stress region x Length T Tensile stress region t Plate Thick

Claims (4)

  1.  板厚tを有するガラス板であって、
     少なくとも端面の一部において圧縮応力を有する圧縮応力領域が形成されており、
     前記圧縮応力領域は、当該ガラス板の板厚方向の全てに亘って形成され、
     当該圧縮応力領域は、前記端面から当該ガラス板の面方向に沿って内側までxの長さまで形成され、
     前記端面の接線に対して垂直な法線が、当該ガラス板の面内において最大となるときの長さを長さLとして定義した場合、
     t≦x≦L/4が成立する、
     ガラス板。
    A glass plate having a plate thickness t
    A compressive stress region having compressive stress is formed at least in a part of the end face.
    The compressive stress region is formed over the entire thickness direction of the glass plate.
    The compressive stress region is formed up to a length of x from the end face to the inside along the surface direction of the glass plate.
    When the length when the normal line perpendicular to the tangent line of the end face is the maximum in the plane of the glass plate is defined as the length L.
    t ≦ x ≦ L / 4 holds,
    Glass plate.
  2.  前記長さLが30cm以下である、請求項1に記載のガラス板。 The glass plate according to claim 1, wherein the length L is 30 cm or less.
  3.  前記板厚tが4mm以下である、請求項1または2に記載のガラス板。 The glass plate according to claim 1 or 2, wherein the plate thickness t is 4 mm or less.
  4.  前記板厚tが2mm以下である、請求項1~3のいずれか1項に記載のガラス板。 The glass plate according to any one of claims 1 to 3, wherein the plate thickness t is 2 mm or less.
PCT/JP2020/009642 2019-03-13 2020-03-06 Glass plate WO2020184426A1 (en)

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JP2019-046226 2019-03-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020134857A1 (en) 2020-12-23 2022-06-23 Schott Ag Laminated glass with thermally induced stress zone

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50161514A (en) * 1974-05-17 1975-12-27
JPS59217630A (en) * 1983-05-24 1984-12-07 Asahi Glass Co Ltd Laterally excited co2 laser device having dielectric electrode
JP2003048734A (en) * 2001-07-31 2003-02-21 Asahi Glass Co Ltd Tempered glass and laminated glass using the same
US20160207819A1 (en) * 2013-08-26 2016-07-21 Corning Incorporated Methods for localized annealing of chemically strengthened glass

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50161514A (en) * 1974-05-17 1975-12-27
JPS59217630A (en) * 1983-05-24 1984-12-07 Asahi Glass Co Ltd Laterally excited co2 laser device having dielectric electrode
JP2003048734A (en) * 2001-07-31 2003-02-21 Asahi Glass Co Ltd Tempered glass and laminated glass using the same
US20160207819A1 (en) * 2013-08-26 2016-07-21 Corning Incorporated Methods for localized annealing of chemically strengthened glass

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020134857A1 (en) 2020-12-23 2022-06-23 Schott Ag Laminated glass with thermally induced stress zone

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