WO2020181313A1

WO2020181313A1 - Protective housing for image-based monitoring system

Info

Publication number: WO2020181313A1
Application number: PCT/AU2019/050213
Authority: WO
Inventors: Qutubuddin ABRO; Subhash Challa
Original assignee: Sensen Networks Group Pty Ltd
Priority date: 2019-03-08
Filing date: 2019-03-08
Publication date: 2020-09-17

Abstract

Some embodiments relate to a protective housing for an image-based monitoring system and to systems comprising such housings. According to some embodiments, the housing comprises: a sealed housing body defining an interior chamber and having a front part and a rear part, the front part having a transparent window; a thermal cooling plate in the housing; a device holder disposed adjacent the thermal cooling plate and configured to hold a smart imaging device close to the thermal cooling plate; a power supply cable extending into the housing and coupleable to an external power supply; a switching unit arranged to switch power from the external power supply to the thermal cooling plate in response to receipt of a switching control signal from the smart imaging device to turn on or off a cooling function of the thermal cooling plate.

Description

"Protective housing for image-based monitoring system"

Technical Field

[0001] Embodiments generally relate to protective housings for image-based monitoring systems and to systems including such housings.

Background

[0002] In image based monitoring applications such as object identification, people detection, vehicle detection, and number plate recognition, it can be advantageous to provide consistent high quality imaging processing of target objects. Under such applications, video monitoring systems can be subject to high loads on processors and batteries, and may generate levels of heat that cause problems or interruptions to the monitoring system.

[0003] Existing cooling systems such as fans or vents may introduce pollutants to the overall system, draw undesired attention through noise, or otherwise reduce the efficacy of the imaging ability of the monitoring system.

[0004] Accordingly, It is desired to address or ameliorate one or more shortcomings or disadvantages associated with prior methods or systems of image based monitoring systems, or to at least provide a useful alternative thereto.

Summary

[0005] Some embodiments relate to a protective housing for an image -based monitoring system, the housing comprising: a sealed housing body defining an interior chamber and having a front part and a rear part, the front part having a transparent window; a thermal cooling plate in the housing; a device holder disposed adjacent the thermal cooling plate and configured to hold a smart imaging device close to the thermal cooling plate; a power supply cable extending into the housing and coupleable to an external power supply; a switching unit arranged to switch power from the external power supply to the thermal cooling plate in response to receipt of a switching control signal from the smart imaging device to turn on or off a cooling function of the thermal cooling plate.

[0006] The thermal cooling plate may be configured to act as a Peltier heat pump. The thermal cooling plate may have a cooling contact surface area of between about 500mm² and about 5000mm², or in other embodiments between about 1000mm² and about 3600mm². There may be a thermally conductive plate disposed on the cooling contact surface to distribute a cooling effect from the thermal cooling plate to the smart imaging device.

[0007] The housing may further comprise a heat sink to dissipate heat from the thermal cooling plate. In some embodiments, the heat sink comprises heat dissipation vanes mounted on the front part of the housing.

[0008] The housing may further comprise a switching unit, comprising a local wireless transceiver to communicate with a wireless radio antenna of the smart imaging device to receive the switching control signal.

[0009] The housing may further comprise a charging cable to supply power to the smart imaging device, and the switching unit may be further arranged to switch power from the external power supply to the charging cable to supply charge to a battery of the smart imaging device when the charging cable is electrically coupled to the smart imaging device.

[0010] The housing may further comprise a housing body formed of one or more materials that permit transmission of mobile telephony radio signals without substantial attenuation.

[0011] Some embodiments relate to an image-based monitoring system, comprising: the protective housing as described herein; and the smart imaging device in the housing. [0012] The smart imaging device may have a camera and the smart imaging device may be held in the device holder so that a field of view of the camera is directed out of the window.

[0013] The smart imaging device may comprise a temperature sensor to sense a temperature of the smart imaging device. In some embodiments, the smart imaging device is configured to determine a current temperature of the smart imaging device based on an output of the temperature sensor and to compare the current temperature to a stored temperature threshold, wherein when the current temperature is equal to or above the temperature threshold, the smart imaging device transmits the switching control signal to the switching unit to turn on the cooling function of the thermal cooling plate.

[0014] The smart imaging device may be configured to transmit a charging control signal to the switching unit to cause the external power supply to switch power to the charging cable when the smart imaging device determines that its battery charge level has fallen below a predetermined battery charge threshold.

[0015] The smart imaging device may comprise a smart phone or a tablet computing device having a touch sensitive screen on a front side and the camera on the opposite back side of the smart imaging device. A part of the back side of the smart imaging device that is spaced from the camera may be positioned to receive cooling from the thermal cooling plate. The device holder may be configured to fix the smart imaging device in a static position relative to the window.

[0016] The smart imaging device may be configured to execute image processing software to detect objects, actions and/or predefined image content in images captured through the window.

[0017] In some embodiments, the smart imaging device is further configured to generate and send to a remote server a detection notification in response to the detection of one or more of the objects, actions and/or predefined image content.

[0018] The system may further comprise an external power supply comprising a solar array and a rechargeable battery coupled to the solar array. [0019] As an alternative to embodiments configured to cooling, some embodiments relate to a protective housing for an image-based monitoring system, the housing comprising: a sealed housing body defining an interior chamber and having a front part and a rear part, the front part having a transparent window; a switchable thermal plate in the housing to provide cooling or heating; a device holder disposed adjacent the switchable thermal plate and configured to hold a smart imaging device close to the switchable thermal plate; a power supply cable extending into the housing and coupleable to an external power supply; a switching unit arranged to switch power from the external power supply to the switchable thermal plate in response to receipt of a switching control signal from the smart imaging device to turn on or off a cooling function or a heating function of the switchable thermal plate.

Brief Description of Drawings

[0020] Figure 1 is an example block diagram of an image-based monitoring system, according to some embodiments;

[0021] Figure 2 is a perspective view of a protective housing for a monitoring system, according to some embodiments;

[0022] Figure 3 is a front view of a housing lid of the protective housing for a monitoring system, according to some embodiments;

[0023] Figure 4 is an interior view of the protective housing for a monitoring system, according to some embodiments;

[0024] Figure 5 is an example diagram of a power schematic for a monitoring system, according to some embodiments; [0025] Figure 6 is a flow chart for operation of an example cooling system for a monitoring system, according to some embodiments;

[0026] Figure 7 is a flow chart for operation of battery charging for a monitoring system, according to some embodiments;

[0027] Figure 8 is a side sectional view of an example heat exchange assembly according to some embodiments;

[0028] Figure 9 is an interior plan view of a heatsink backplane, according to some embodiments; and

[0029] Figure 10 is a plan view of an example mounting plate of a video monitoring system, according to some embodiments.

Detailed Description

[0030] Figure 1 depicts a block diagram of an image-based (e.g. video) monitoring system 100 within a system housing 110. The system housing 100 houses a smart imaging device 120 comprising a processor 130 in connection with: a battery 121, a temperature sensor 122, a display with user interface 123, a camera 124, a wireless communication module 125, and a memory 140. The smart imaging device 120 may comprise a smartphone, tablet, or other computing device, for example. The smart imaging device 120 may include a serial charging port 126 to receive power from a battery backup 185 and/or a power supply 180. The smart imaging device 120 may be configured to use camera 124 for still image capture and/or for video image capture.

[0031] System 100 also comprises a switchable thermal plate 170 that can be switched on or off to provide a cooling function for contact cooling of the smart imaging device 120 when the smart imaging device 120 is positioned adjacent the switchable thermal plate 170.

Switchable thermal plate 170 may be configured to provide a heating function as an alternative to the cooling function, for example by switching electrical polarity of the power supplied to the switchable thermal plate 170 from power supply 180. Switchable thermal plate 170 may comprise a Peltier heat pump, for example, which can generate either heat or cooling one side of the plate, depending on the polarity of the electrical supply. For the purposes of the present description, it is anticipated that the cooling function would be used more than the heating function and the present description therefore focuses on the cooling function and the switchable thermal plate is therefore also referred to herein as“cooling module 170”.

[0032] The memory 140 may include an operating system 141 and application 150. The application 150 may comprise a monitoring module 151, image processing module 152, function library 153, and reporting module 154. The function library 153 may host a catalogue of different user selectable image processing functions for the image processing module 152, to trigger a report to be sent via reporting module 154. In some embodiments, the image processing functions selectable in the function library 153 may relate to image processing functions for identifying vehicles, activities, or events in a monitoring region. The reporting module 154 may upload processed images or video from image processing module 152 to a remote server 105 through use of the wireless communications module 125.

[0033] The wireless communications module 125 may comprise a mobile telephony unit and/or a short range wireless transceiver in some embodiments, and be configured to send processed images or video, or receive instructions. The wireless communications module 125 may send and receive data through a cellular network, or other available networks.

[0034] Power may be supplied to the smart imaging device 120 through a relay module 160, acting as a switching unit to alternately switch between connecting and disconnecting power to the serial port 126 and the cooling module 170 through relays 161, 162. The switching function of relays 161, 162 may be controlled through instructions sent from the smart imaging device 120 over the wireless communication module 125 and received by the local low power wireless receiver 164.

[0035] The relay module 160 may further switch power to the solid state thermal cooling module 170, in some embodiments comprising a Peltier cooling module. The cooling module 170 may be activated by the monitoring module 151 to provide a cooling effect that dissipates heat generated by the smart imaging device 120, to ensure that the device remains within functional temperature thresholds. The cooling module 170 may comprise a substantially square or rectangular profile having a cooling contact surface of between 500 to 5,000mm². In other embodiments the cooling module 170 may comprise a cooling contact surface area between about 1,000 and about 3,600 mm². The cooling contact surface area may be around 1600 mm².

[0036] The power supply 180 may supply power to a battery backup 185, arranged to provide power to the system in event of interruption of the supply 180. The power supply 180 may comprise mains power, or an alternative power source such as a solar panel array 200 in some embodiments, and may be provided through a power supply coupling in the housing 110.

[0037] Figure 2 is a mountable image capture system 100 installed against a support 220 by system mounts 205. In some embodiment the support 220 comprises a telecommunications pole, street light pole, or may comprise a custom built support pole of a sufficient height to grant clear sight to a monitoring region such as a roadside, or other environment. The system mounts 205 secure the system 100 to the support 220 and may allow the system 100 to be detached for inspection or maintenance.

[0038] The system housing 110 comprises a housing lid 215 detachable from a housing body 210, joined through fixing screws 21. The housing lid 215 further comprises a housing window aperture and housing window screen to allow photographic access of an environment to the camera module 124. In some embodiments, the system housing 110 comprises an IP67 enclosure. The camera module 124 may comprise a digital camera module having a suitable resolution for image processing. In some embodiments this comprise an image resolution between 6-12MP. In other embodiments, different resolutions may be utilised.

[0039] The housing lid provides a fixation point for a heat dissipation array 206, comprising an array of heat dissipating vanes in thermal communication with the smart imaging device 120, in order to dissipate heat generated by system operations. The heat dissipation vanes may be constructed of a metal, for example an aluminium alloy, and may be environmentally protected by a coating to reduce environmental wear. In other embodiments, suitable heat conductive alternatives may be used, such as copper, or polymers. The heat dissipation array 206 of Figure 2 displays a vane configuration, however in other embodiments, a pin configuration or flared fin configuration of vanes may be utilised. In some embodiments the heat dissipation array 206 comprises an anodised aluminium array of dimensions between 150 to 200 mm in length, 100 to 150 mm in width, and of a height extending from the housing lid 215 of between 10 to 40 mm in length. In some embodiments the heat dissipation array 206 comprises an anodised aluminium heatsink with multiple heat dissipation vanes. The heat dissipation array 206 may have the dimensions of 200 mm x 125mm x 25 mm. The array 206 may have 1 to 2 fins or parts of multiple fins around the outer part of the window cut away to prevent obstruction of the field of view of the camera 124

[0040] The vanes of the heat dissipation array 206 may be installed in such a fashion so as to not obscure the housing window aperture 217. In some embodiments, this may comprise a vane array with substantially shorter vanes either side of the aperture 217. In other embodiments, vanes of equal length across the width of the housing body 210 may be modified, having a cut-away section across a number of vanes to accommodate housing window aperture 217.

[0041] In the embodiment of Figure 2, the power supply 180 comprises a solar panel system 200, arranged to deliver power to the overall system 100 without requiring mains power access. In other embodiments, a mains power connection may be supplied in conjunction with the solar panel system 200 to provide further backup power in case of interruption to the solar panel system. In other embodiments, mains power may comprise the sole power supply 180 to system 100.

[0042] Figure 3 depicts a front view of the housing lid 215 showing a connection interface 300 with connection cabling 305.

[0043] Figure 4 depicts an internal view of the system housing 110, showing a smart imaging device 120 in connection to a circuit board 410 containing the processor 130 and memory 140, and further depicting the placement of relays 161, 162. Circuit board 410 and other components mounted in the rear part of the housing body 210 may be mounted on a mounting plate 446 that has apertures or other structure suitable to assist in component mounting. The internal components of the system housing 110 further include a device mount 415comprising a mounting frame bracket 420, fixable secured to the interior of the housing lid 215 by mounting screws 421, arrange to secure the smart imaging device 210 proximally close to the housing window aperture 217 to ensure the camera 124 has a clear field of view to an external monitoring region. In some embodiments, the mounting frame bracket comprises an acrylic frame of suitable dimensions to house a smart imaging device 120 such as a smartphone. In one example, the smartphone having the dimensions 156mm x 73.8mm x 8.53mm.

[0044] The housing lid 215 further includes a lid sealing rim 430, in some embodiments comprising a rubber rim, to provide an overlapping internal seal against the rim of the housing body 210. The sealing rim 430 may reduce the impact or protect against rain or other environmental effects which may otherwise penetrate the housing 110.

[0045] The internal components may further include a serial interface 440, in some embodiments comprising a USB interface such as a 12v to 5v USB charger interface, to connect to the smart imaging device 210. The cabling 305 of the system 100 may be internally secured by a pin board 445.

[0046] In the embodiment of Figure 4, power is supplied from a power supply 180 through a power supply coupling 450.

[0047] Figure 5 depicts an indicative wiring diagram of the power supplied to the relay module 160, cooling module 170, and serial interface 440. In this diagram, power is supplied via the relay module to both the serial interface 440 and cooling module 170, such that the activation of these components may be controlled via the opening and closing of the relays 161, 162 within the relay module 160.

[0048] Figure 6 depicts a flowchart of a cooling operation of the system 100. At 610 the smart imaging device 120 activates the temperature sensor 122 by way of the monitoring module 151. The temperature sensor 122 provides a temperature reading of the smart imaging device 120 and at 620 the monitoring module 151 identifies whether the current temperature is equal to or greater than a specified maximum (or upper) temperature threshold (for effective device operation). For example, the maximum temperature threshold may be a selected (preconfigured) temperature in the range of 45 to 55°C. The maximum temperature threshold is selected to be at a predetermined temperature level below the actual maximum rated operating temperature of the device 120 at which the device 120 can still function effectively for a certain period of time, such as 20 to 50 minutes, for example. In some embodiments, a higher or lower maximum threshold may be automatically determined by the application 150 according to the safe operation requirements of the smart imaging device 120. [0049] If the temperature has not exceeded the maximum temperature threshold level at 620, the monitoring module reverts to 610 and performs another temperature check at a later time. This reiteration may occur after a specifiable time delay in the application 150, or be associated with a user selected monitoring operation in the function library 153.

[0050] If the temperature sensor 122 detects that a maximum temperature threshold has been reached or exceeded at 620, the application 150 may initiate a check of the wireless communications module 125 to ensure it is operable or active. If it is inactive, a diagnostic process at 635 may occur and the communication connection with the wireless module 125 may be reinitialised. Should the wireless module 125 be active, then instructions (including a control signal) are sent by the monitoring module 151 to the relay module 160 to engage power to the cooling module 170 at step 640.

[0051] At 650, the temperature sensor 122 provides a temperature reading of the smart imaging device 120 and the monitoring module 151 identifies whether the current temperature is equal to or lower than a specified lower temperature threshold. For example, the lower temperature threshold may be in the range of around 15 to 25°C. In some embodiments, a higher or lower minimum threshold may be specified according the safe operation

requirements of the smart imaging device 120.

[0052] If the smart imaging device 120 has not yet reached or fallen below the lower temperature threshold, then the monitoring module may wait for a specified time period before taking another temperature reading. This reiteration may occur after a specifiable time delay in the application 150, or be associated with a user selected monitoring operation in the function library 153.

[0053] If the temperature of the smart imaging device 120 has reached or fallen below the lower temperature threshold, then instructions (including a control signal) may be sent by the monitoring module 151 to the relay module 160 to disengage power to the cooling module 170 at step 660. After which, the operation of the system reverts to the initial stage at 610.

[0054] Smart imaging device 120 has the capability to operate the cooling module as a heating module instead, depending on the sensed temperature of the smart imaging device 120. If the cooling module 170 is used as a heating module instead, then a similar method to that described in relation to Figure 6 is performed, except that the threshold values for switching on and off the heating function would be inverted relative to the thresholds described above in relation to the cooling function.

[0055] Figure 7 depicts a flowchart of a smart imaging device charging operation of the system 100. At 710 the charge level of battery 121 is read by monitoring module 151 of the application 150. At 720 the monitoring module 151 identifies whether the charge level is below a minimum threshold, for example between 15-25% of maximum battery capacity. In some embodiments, a higher or lower minimum threshold may be specified according to system requirements.

[0056] If the minimum charge threshold has not been reached, then the system reverts to stage 710 after a user specified time. This reiteration may occur after a specifiable time delay in the application 150, or be associated with a user selected monitoring operation in the function library 153.

[0057] If the minimum charge threshold has been reached or the charge level is lower than the minimum threshold, then the application 150 may initiate a check of the wireless communications module 125 to ensure it is operable or active. If it is inactive, a diagnostic process at 735 may occur and communication connection with the wireless module 125 may be reinitialised. Should the wireless module 125 be active, then instructions (including a control signal) are sent by the monitoring module 151 to the relay module 160 to engage connection of power supply 180 to the serial port 126 of smart imaging device 120 at step 740. Should the power supply 180 be interrupted, then the battery backup 185 may provide power to the smart imaging device 120 by serial port 126.

[0058] At 750, the monitoring module 151 identifies whether the charge level of battery 121 is equal to or above a maximum charge threshold, in some embodiments this threshold maybe 90 to 100% of maximum battery capacity. If the charge level has not reached or exceeded this maximum charge threshold, then the operation reverts to stage 750 after a specifiable time. This reiteration may occur after a specifiable time delay in the application 150, or be associated with a user selected monitoring operation in the function library 153. [0059] If the charge level of battery 121 has reached or exceeded the maximum charge threshold then the monitoring module 151 sends instructions (including a control signal) to relay module 160 to disengage power from the power supply 180 or battery backup 185 to the serial port 126. After which, the system reverts to the initial stage 710.

[0060] Figure 8 depicts a sectional view of a heat dissipation assembly 800, which is disposed in a front part of the housing. The Heat dissipation assembly 800 is mounted to housing lid 215 and comprises heat dissipation array 206, cooling modulel70, and smart imaging device 120. The smart imaging device 120 is affixed within the housing lid 215 by fixing screws 216 and secured by mounting frame bracket 420. The cooling module 170 is affixed through the housing lid 215, in thermal communication with a heat conduction plate 820, and cooling conduction plate 810. In some embodiments, for example where the local environmental temperature is cold, the smart imaging device 120 can execute control software so that heat conduction plate 820 instead functions as a cooling conduction plate and the cooling conduction plate 810 instead functions as a heating conduction plate.

[0061] The cooling conduction plate 810 may comprise a copper plate of substantially similar dimensions to cooling module 170, and being approximately 2 to 5mm in thickness. In other embodiments, the cooling conduction plate 810 may be larger in planar contact area than the plate of the cooling module 170. For example, the cooling conduction plate 810 may be between around 5% and around 20% larger than the contact surface area dimensions of the cooling module 170. In some embodiments, the cooling conduction plate 810 may comprise other suitable thermally conductive materials, such as other metals, or polymers.

[0062] The cooling conduction plate 810 provides a surface through which generated heat is drawn from the smart imaging device 120 and dissipated through the opposing side of the cooling module 170, and into the heat dissipation array 206 by way of the heat conduction plate 820.

[0063] Heat conduction plate 820 may comprise a metal plate attached between the exterior of the housing lid 215 and the heat dissipation array 206, separated from the surface of the housing lid 215 by an insulation layer 830 . The heat conduction plate 820 conducts heat from the cooling module 170 into the heat dissipation array 206, which in turn dissipates the heat into the atmosphere. The heat conduction plate 820 may comprise a copper plate, proportionate to the heat dissipation array 206 but dimensionally smaller such that the plate 820 does not extend beyond the edges of the array 206. In some embodiments the heat conduction plate 820 comprises a copper plate between 1 to 3mm in thickness, and of dimensions being 1 to 2mm shorter on each side relative to the heat dissipation array 206. In some embodiments, the heat conduction plate 820 comprises a 3mm thick copper plate, measuring 199mm x 124mm x 25mm, approximately.

[0064] Insulation layer 830 may comprise a heat resistant layer between a heat dissipation side of the cooling module 170 and the heat conduction plate 820, such than when the plate 820 conducts heat during a cooling operation of cooling module 170, the plate 820 does not conduct heat back into the housing lid 215. The insulation layer 830 may also reduce the potential of heat damage to the housing lid 215. In some embodiments the insulation layer 830 comprises a PVE foam layer, between 2 to 5mm in thickness, in proportions and dimensions matching the heat conduction plate 820. In some embodiments, the PVE foam layer may be 3mm in thickness, and 1mm shorter in all directions than the heat dissipation array 206.

[0065] The in the embodiment of Figure 8, the width of the cooling module 170 may be defined by dimension reference A, and be of an approximate size between 30 to 50mm. In some embodiments the cooling module 170 may comprise a substantially square profile, having sides of equal length. In other embodiments, a rectangular or circular profile may be used, wherein dimension A would describe a side length or diameter. In some embodiments, the cooling module 170 may comprise a 40mm x 40mm Peltier module, under a 50mm x 50mm copper cooling conduction plate 810, and positioned 75mm centrally below the top of the housing lid 215.

[0066] Figure 9 depicts an embodiment of an interior of housing lid 215. In such an embodiment, cooling conduction plate 810 may be located a distance from the top of the housing, as indicated by dimension reference B. In some embodiments reference B may define a distance of between 50 to 100mm between the top edge of a cooling conduction plate 810 and the top edge of the housing. In other embodiments, different distances may be utilised in order for the camera 124 to have a clear field of view through the housing window aperture 217, while remaining in substantially in contact with the smart imaging device 120. [0067] An array of fixing points 900 may be provided as a guide for fixing means. In some embodiments the fixing points 900 may comprise holes between 3 to 5mm in diameter for mounting bolts, screws, or other appropriate means. In some embodiments, the fixing means may comprise 4mm nylon bolts.

[0068] In the embodiment of Figures 8 and 9, the cooling conduction plate 810 may be centrally aligned with the cooling module 170 and of a larger size in order to accommodate fixing means such as mounting bolts, screws, or other appropriate means. In such

embodiments, the over-extending region may be between 3 to 5mm in width. In some embodiments, a channel or rim is provided on the underside of the cooling conduction plate 810 with fine tolerances in order to position the cooling side of the cooling module 170 within the body of the cooling conduction plate 810. In some embodiments, the base of the cooling conduction plate 810 may be 2mm, and the rim may be 1mm thick, having a width of 5mm around the underside of the plate, sufficient to encompass a 40mm x 40mm cooling module, such as a Peltier module, for example.

[0069] Figure 10 depicts an embodiment of a heat conduction plate 820, having a series of fixing points 1000 across its area. In some embodiments these fixing points comprise holes of between 3 to 5mm in diameter, allowing the copper plate to be affixed to the heat dissipation array 206 and housing lid 215. The fixing points 1000 may further define points for the mounting frame screws 421 and the cooling conduction plate 810. In some embodiments, fixing points 1010 may comprise 3.5mm countersunk holes provided to mount the heat conduction plate against the heat dissipation array 206. Fixing points 1020 may comprise 3.5mm holes provided to mount the heat conduction plate against a housing lid 215. Fixing points 1030 may comprise 4mm holes provided to mount the heat conduction plate through the housing lid 216 to the cooling conduction plate 810. Fixing points 1040 may comprise 4mm holes to provide access through which mounting screws 421 are inserted to secure the mounting frame bracket 420 to the front housing part. In some embodiments, the positions of the fixing points 1000 are substantially symmetrical across line reference C, being a longitudinal centre line of the plate 820.

[0070] It will be appreciated by persons skilled in the art that numerous variations and/or modifications may be made to the above-described embodiments, without departing from the broad general scope of the present disclosure. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive.

Claims

CLAIMS:

1. A protective housing for an image-based monitoring system, the housing comprising: a sealed housing body defining an interior chamber and having a front part and a rear part, the front part having a transparent window; a thermal cooling plate in the housing; a device holder disposed adjacent the thermal cooling plate and configured to hold a smart imaging device close to the thermal cooling plate; a power supply cable extending into the housing and coupleable to an external power supply; a switching unit arranged to switch power from the external power supply to the thermal cooling plate in response to receipt of a switching control signal from the smart imaging device to turn on or off a cooling function of the thermal cooling plate.

2. The housing of claim 1, wherein the thermal cooling plate is configured to act as a Peltier heat pump.

3. The housing of claim 1 or claim 2, wherein the thermal cooling plate has a cooling contact surface area of between about 500mm² and about 5000mm².

4. The housing of claim 3, wherein the cooling contact surface area is between about 1000mm² and about 3600mm².

5. The housing of any one of the preceding claims 1 to 4, further comprising a thermally conductive plate disposed on the cooling contact surface to distribute a cooling effect from the thermal cooling plate to the smart imaging device.

6. The housing of any of the preceding claims 1 to 5, further comprising a heat sink to dissipate heat from the thermal cooling plate.

7. The housing of claim 6, wherein the heat sink comprises heat dissipation vanes mounted on the front part of the housing.

8. The housing of any of the preceding claims 1 to 7, wherein the switching unit comprises a local wireless transceiver to communicate with a wireless radio antenna of the smart imaging device to receive the switching control signal.

9. The housing of any one of the preceding claims 1 to 8 further comprising a charging cable to supply power to the smart imaging device, wherein the switching unit is further arranged to switch power from the external power supply to the charging cable to supply charge to a battery of the smart imaging device when the charging cable is electrically coupled to the smart imaging device.

10. The housing of any one of the preceding claims 1 to 9, wherein the housing body is formed of one or more materials that permit transmission of mobile telephony radio signals without substantial attenuation.

11. An image-based monitoring system, comprising: the protective housing of any one of claims 1 to 10; and the smart imaging device in the housing.

12. The system of claim 11, wherein the smart imaging device has a camera and the smart imaging device is held in the device holder so that a field of view of the camera is directed out of the window.

13. The system of claim 11 or claim 12, wherein the smart imaging device comprises a temperature sensor to sense a temperature of the smart imaging device.

14. The system of claim 13, wherein the smart imaging device is configured to determine a current temperature of the smart imaging device based on an output of the temperature sensor and to compare the current temperature to a stored temperature threshold, wherein when the current temperature is equal to or above the temperature threshold, the smart imaging device transmits the switching control signal to the switching unit to turn on the cooling function of the thermal cooling plate.

15. The system of claim 11 when dependent on claim 9, wherein the smart imaging device is configured to transmit a charging control signal to the switching unit to cause the external power supply to switch power to the charging cable when the smart imaging device determines that its battery charge level has fallen below a predetermined battery charge threshold.

16. The system of any of the preceding claims 11 to 15 wherein the smart imaging device is a smart phone or a tablet computing device having a touch sensitive screen on a front side and the camera on the opposite back side of the smart imaging device.

17. The system of claim 16, wherein a part of the back side of the smart imaging device that is spaced from the camera is positioned to receive cooling from the thermal cooling plate.

18. The system of any one of the preceding claims 11 to 17, wherein the device holder is configured to fix the smart imaging device in a static position relative to the window.

19. The system of any one of the preceding claims 11 to 18, wherein the smart imaging device is configured to execute image processing software to detect objects, actions and/or predefined image content in images captured through the window.

20. The system of claim 19, wherein the smart imaging device is further configured to generate and send to a remote server a detection notification in response to the detection of one or more of the objects, actions and/or predefined image content.

21. The system of any one of the preceding claims 11 to 20, wherein the external power supply comprises a solar array and a rechargeable battery coupled to the solar array.

22. A protective housing for an image-based monitoring system, the housing comprising: a sealed housing body defining an interior chamber and having a front part and a rear part, the front part having a transparent window; a switchable thermal plate in the housing to provide cooling or heating; a device holder disposed adjacent the switchable thermal plate and configured to hold a smart imaging device close to the switchable thermal plate; a power supply cable extending into the housing and coupleable to an external power supply; a switching unit arranged to switch power from the external power supply to the switchable thermal plate in response to receipt of a switching control signal from the smart imaging device to turn on or off a cooling function or a heating function of the switchable thermal plate.