WO2020179731A1 - Vibration sensor - Google Patents

Vibration sensor Download PDF

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Publication number
WO2020179731A1
WO2020179731A1 PCT/JP2020/008672 JP2020008672W WO2020179731A1 WO 2020179731 A1 WO2020179731 A1 WO 2020179731A1 JP 2020008672 W JP2020008672 W JP 2020008672W WO 2020179731 A1 WO2020179731 A1 WO 2020179731A1
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WO
WIPO (PCT)
Prior art keywords
layer
vibration sensor
positive electrode
laminated
vibration
Prior art date
Application number
PCT/JP2020/008672
Other languages
French (fr)
Japanese (ja)
Inventor
央隆 佐藤
Original Assignee
株式会社バルカー
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Filing date
Publication date
Application filed by 株式会社バルカー filed Critical 株式会社バルカー
Publication of WO2020179731A1 publication Critical patent/WO2020179731A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Definitions

  • the present disclosure relates to a vibration sensor.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 7-234244
  • the space in which the acceleration detection element and the electronic circuit are housed is surrounded by the ceramic substrate and the ceramic cover. Since the housing is made of a ceramic material that has a large Young's modulus and is not easily deformed, the sensor body is not flexible and it is difficult to attach the sensor to the curved surface of the measurement target.
  • a vibration sensor that can be attached to a measurement target surface having a curved surface is provided.
  • a vibration sensor including a thin-film organic piezoelectric element, a positive electrode layer, a first insulating layer, a first shield layer, a cathode layer, a second insulating layer, and a second shield layer.
  • the organic piezoelectric element has a first surface and a second surface opposite to the first surface, and is polarized so that positive charges are unevenly distributed on the first surface and negative charges are unevenly distributed on the second surface.
  • the positive electrode layer is made of a metal material and is laminated on the first surface.
  • the first insulating layer is made of an insulating material and is laminated on the positive electrode layer.
  • the first shield layer is made of a metal material and is laminated on the first insulating layer.
  • the cathode layer is made of a metal material and is laminated on the second surface.
  • the second insulating layer is made of an insulating material and is laminated on the cathode layer.
  • the second shield layer is made of a metal material and is laminated on the second insulating layer.
  • the above vibration sensor further includes a first cover layer and a second cover layer.
  • the first cover layer is made of an insulating material and is laminated on the first shield layer.
  • the second cover layer is made of an insulating material and is laminated on the second shield layer.
  • the above vibration sensor further includes an intervening member.
  • the intervening member is laminated on at least a part of the peripheral edge of the second cover layer.
  • the intervening member is interposed between the vibration measurement object and the second cover layer in a state where the vibration sensor is attached to the vibration measurement object whose vibration is measured by the vibration sensor.
  • the above vibration sensor includes a mounting member and a connecting member.
  • the mounting member is laminated on the first cover layer.
  • the connecting member is attached to the mounting member and is electrically connected to the positive electrode layer.
  • the connecting member is attached to the attachment member by screwing.
  • the above vibration sensor is further equipped with a lead wire.
  • the lead wire has one end connected to the connecting member and the other end connected to the positive electrode layer.
  • the other end of the lead wire is connected to the positive electrode layer by soldering.
  • the vibration sensor described above further includes a bolt member that bolts the intervening member and the mounting member.
  • the bolt member is arranged so as to penetrate the cathode layer.
  • the cathode layer and the connecting member are electrically connected via a bolt member.
  • FIG. 3 is an exploded perspective view of the vibration sensor shown in FIG. 1 viewed from different angles.
  • FIG. 1 is a perspective view of a vibration sensor 1 according to the embodiment.
  • FIG. 2 is a partial cross-sectional view of the vibration sensor 1 shown in FIG.
  • FIG. 3 is a side view of the vibration sensor 1 shown in FIG.
  • FIG. 4 is an exploded perspective view of the vibration sensor 1 shown in FIG.
  • FIG. 5 is an exploded perspective view of the vibration sensor 1 shown in FIG. 1 as viewed from different angles. Note that FIG. 2 illustrates the vibration sensor 1 viewed from the direction of arrow II in FIG. 1, and FIG. 3 illustrates the vibration sensor 1 viewed from the direction of arrow III in FIG. 1.
  • the vibration sensor 1 includes a sensor unit 10.
  • the sensor unit 10 includes an organic piezoelectric element 20, a positive electrode layer 30, a cathode layer 40, a first insulating layer 50, a second insulating layer 60, and a first shield layer 70.
  • the second shield layer 80, the first cover layer 90, and the second cover layer 100 are provided.
  • the sensor unit 10 includes a second cover layer 100, a second shield layer 80, a second insulating layer 60, a cathode layer 40, an organic piezoelectric element 20, a positive electrode layer 30, a first insulating layer 50, a first shield layer 70, and a first.
  • the 1-cover layer 90 is formed by being laminated in this order and integrally joined.
  • the organic piezoelectric element 20 has a rectangular thin film shape as shown in FIGS.
  • the organic piezoelectric element 20 has a pair of long edge portions forming long sides of the rectangle and a pair of short edge portions forming short sides of the rectangle.
  • FIG. 6 is a schematic view showing the polarization of the organic piezoelectric element 20.
  • the organic piezoelectric element 20 has a first surface 21 and a second surface 23 opposite to the first surface 21.
  • the organic piezoelectric element 20 is polarized so that the positive charges are unevenly distributed on the first surface 21 and the negative charges are unevenly distributed on the second surface 23.
  • the organic piezoelectric element 20 is polarized by subjecting an arbitrary polarization treatment such as a known corona treatment in advance before assembling the sensor unit 10.
  • the positive electrode layer 30 has a thin film shape.
  • the positive electrode layer 30 is laminated on the first surface 21 of the organic piezoelectric element 20.
  • the positive electrode layer 30 is made of a conductive material, for example, a metal material typified by copper or SUS.
  • the positive electrode layer 30 has a substantially rectangular main body 31 and a connecting portion 32 that projects outward from the central portion of the rectangular short side of the main body 31.
  • the connection portion 32 is formed with a connection hole 33 that penetrates the positive electrode layer 30 in the thickness direction.
  • the connection hole 33 has a circular shape.
  • the cathode layer 40 has a thin film shape.
  • the cathode layer 40 is laminated on the second surface 23 of the organic piezoelectric element 20.
  • the cathode layer 40 is made of a conductive material, for example, a metal material typified by copper or SUS.
  • the cathode layer 40 has a substantially rectangular main body portion 41 and two connecting portions 42 protruding outward from both end portions of the rectangular short sides of the main body portion 41. ..
  • a coupling hole 44 that penetrates the cathode layer 40 in the thickness direction is formed in each connection portion 42.
  • the coupling hole 44 has a circular shape.
  • the first insulating layer 50 has a rectangular thin film shape as shown in FIGS.
  • the first insulating layer 50 is laminated on the positive electrode layer 30.
  • the first insulating layer 50 is formed of an electrically insulating material, for example, a resin material typified by polyimide.
  • the 1st insulating layer 50 has a pair of long edge part which comprises the long side of a rectangle, and a pair of short edge part which comprises the short side of a rectangle.
  • connection hole 53 and two coupling holes 54 that penetrate the first insulating layer 50 in the thickness direction are formed in the vicinity of one short edge portion.
  • the connection hole 53 and the coupling hole 54 each have a circular shape.
  • the connection hole 53 is formed in the central portion of the short edge portion.
  • the coupling holes 54 are formed at both ends of the short edge portion.
  • the coupling hole 54 is formed at a corner portion of a rectangle.
  • the connection hole 53 and the connection hole 54 are arranged along the short side of the rectangle of the first insulating layer 50.
  • the center of the connecting hole 53 and the center of the two connecting holes 54 are in a straight line.
  • the diameter of the connection hole 53 of the first insulating layer 50 is less than or equal to the diameter of the connection hole 33 of the positive electrode layer 30.
  • the connection holes 33 of the positive electrode layer 30 and the connection holes 53 of the first insulating layer 50 are arranged concentrically. With the positive electrode layer 30 and the first insulating layer 50 stacked, the center of the connection hole 33 of the positive electrode layer 30 and the center of the connection hole 53 of the first insulating layer 50 are aligned. All of the connection holes 53 of the first insulating layer 50 overlap with the connection holes 33 of the positive electrode layer 30.
  • FIG. 7 is a schematic view of a laminate of the organic piezoelectric element 20, the positive electrode layer 30, and the first insulating layer 50.
  • the organic piezoelectric element 20 overlaps with the main body 31 of the positive electrode layer 30.
  • the connecting portion 32 of the positive electrode layer 30 does not overlap with the organic piezoelectric element 20, and protrudes from the short edge portion of the organic piezoelectric element 20.
  • the connection hole 33 of the positive electrode layer 30 overlaps with the connection hole 53 of the first insulating layer 50, and the connection holes 33, 53 are arranged concentrically.
  • the connection holes 33 and 53 are arranged between the pair of coupling holes 54.
  • the pair of coupling holes 54 sandwich the connection holes 33 and 53.
  • the two coupling holes 54 and the connection holes 33, 53 are the rectangular short sides of the first insulating layer 50 so that the distances between the centers of the two coupling holes 54 and the centers of the connection holes 33, 53 are equal. Are lined up alongside.
  • the positive electrode layer 30 and the first insulating layer 50 are formed by preparing a commercially available copper-clad laminate in which a copper foil is bonded to a polyimide film by thermal pressure bonding or the like, and appropriately etching the polyimide film and the copper foil to form a pattern. , May be produced.
  • the second insulating layer 60 has a rectangular thin film shape as shown in FIGS.
  • the second insulating layer 60 is laminated on the cathode layer 40.
  • the second insulating layer 60 is formed of an electrically insulating material, for example, a resin material typified by polyimide.
  • the 2nd insulating layer 60 has a pair of long edge part which comprises the long side of a rectangle, and a pair of short edge part which comprises the short side of a rectangle.
  • connection hole 63 and two coupling holes 64 that penetrate the second insulating layer 60 in the thickness direction are formed in the vicinity of one short edge portion.
  • the connection hole 63 and the connection hole 64 each have a circular shape.
  • the connection hole 63 is formed in the central portion of the short edge portion. Bonding holes 64 are formed at both ends of the short edge portion.
  • the coupling hole 64 is formed at a corner portion of a rectangle.
  • the connection hole 63 and the connection hole 64 are arranged along the short side of the rectangle of the second insulating layer 60.
  • the center of the connecting hole 63 and the center of the two connecting holes 64 are in a straight line.
  • the diameter of the coupling hole 64 of the second insulating layer 60 is less than or equal to the diameter of the coupling hole 44 of the cathode layer 40.
  • the coupling hole 44 of the cathode layer 40 and the coupling hole 64 of the second insulating layer 60 are arranged concentrically.
  • the center of the coupling hole 44 of the cathode layer 40 and the center of the coupling hole 64 of the second insulating layer 60 are aligned. All of the coupling holes 64 of the second insulating layer 60 overlap with the coupling holes 44 of the cathode layer 40.
  • FIG. 8 is a schematic view of a laminated body of the organic piezoelectric element 20, the cathode layer 40, and the second insulating layer 60.
  • the organic piezoelectric element 20 overlaps with the main body 41 of the cathode layer 40.
  • the connecting portion 42 of the cathode layer 40 does not overlap with the organic piezoelectric element 20, and protrudes from the short edge portion of the organic piezoelectric element 20.
  • the coupling hole 44 of the cathode layer 40 overlaps with the coupling hole 64 of the second insulating layer 60, and the coupling holes 44 and 64 are arranged concentrically.
  • the connection hole 63 is arranged between the pair of coupling holes 44 and 64.
  • connection hole 63 is sandwiched between the pair of coupling holes 44 and 64.
  • the two coupling holes 44, 64 and the connection hole 63 are the rectangular short sides of the second insulating layer 60 so that the distances between the centers of the two coupling holes 44 and 64 and the center of the connection hole 63 are equal to each other. Are lined up alongside.
  • a commercially available copper-clad laminate in which a copper foil is bonded to a polyimide film by hot pressure bonding or the like is prepared, and the polyimide film and the copper foil are appropriately etched to form a pattern. , May be produced.
  • the first shield layer 70 has a rectangular thin film shape.
  • the first shield layer 70 is laminated on the first insulating layer 50.
  • the first shield layer 70 is made of a conductive material, for example, a metal material typified by copper or SUS.
  • the first shield layer 70 has a pair of long edge portions forming the long sides of the rectangle and a pair of short edge portions forming the short sides of the rectangle.
  • connection hole 73 and two coupling holes 74 that penetrate the first shield layer 70 in the thickness direction are formed in the vicinity of one short edge portion.
  • the connection hole 73 and the connection hole 74 each have a circular shape.
  • the connection hole 73 is formed in the central portion of the short edge portion.
  • the coupling holes 74 are formed at both ends of the short edge portion.
  • the coupling hole 74 is formed at a corner portion of a rectangle.
  • the connection hole 73 and the connection hole 74 are arranged along the short side of the rectangle of the first shield layer 70.
  • the center of the connecting hole 73 and the center of the two connecting holes 74 are in a straight line.
  • the second shield layer 80 has a rectangular thin film shape.
  • the second shield layer 80 is laminated on the second insulating layer 60.
  • the second shield layer 80 is formed of a conductive material, for example, a metal material represented by copper or SUS.
  • the second shield layer 80 has a pair of long edges that form the long sides of the rectangle and a pair of short edges that form the short sides of the rectangle.
  • connection hole 83 and two connection holes 84 that penetrate the second shield layer 80 in the thickness direction are formed in the vicinity of the pair of short edge portions.
  • the connection hole 83 and the connection hole 84 each have a circular shape.
  • the connection hole 83 is formed in the central portion of the short edge portion.
  • the coupling holes 84 are formed at both ends of the short edge portion.
  • the coupling hole 84 is formed at a corner portion of a rectangle.
  • the connection hole 83 and the connection hole 84 are arranged along the short side of the rectangle of the second shield layer 80.
  • the center of the connection hole 83 and the center of the two coupling holes 84 are on a straight line.
  • the first cover layer 90 has a rectangular thin film shape, as shown in FIGS.
  • the first cover layer 90 is laminated on the first shield layer 70.
  • the first cover layer 90 is formed of an electrically insulating material, for example, a resin material typified by polyimide.
  • the 1st cover layer 90 has a pair of long edge parts which make up the long side of a rectangle, and a pair of short edge parts which make up the short side of a rectangle.
  • connection hole 93 and two connection holes 94 that penetrate the first cover layer 90 in the thickness direction are formed in the vicinity of one short edge portion.
  • the connection hole 93 and the coupling hole 94 each have a circular shape.
  • the connection hole 93 is formed in the central portion of the short edge portion.
  • the coupling holes 94 are formed at both ends of the short edge portion.
  • the coupling hole 94 is formed at a corner portion of a rectangle.
  • the connection hole 93 and the coupling hole 94 are arranged along the short side of the rectangle of the first cover layer 90.
  • the center of the connecting hole 93 and the center of the two connecting holes 94 are in a straight line.
  • connection hole 93 of the first cover layer 90 has the same diameter as the connection hole 73 of the first shield layer 70.
  • the connection hole 73 of the first shield layer 70 and the connection hole 93 of the first cover layer 90 are arranged concentrically.
  • the center of the connection hole 73 of the first shield layer 70 and the center of the connection hole 93 of the first cover layer 90 are aligned. All of the connection holes 93 of the first cover layer 90 overlap the connection holes 73 of the first shield layer 70.
  • connection holes 73 and 93 are arranged between the pair of connection holes 74 and 94.
  • the pair of coupling holes 74 and 94 sandwich the connection holes 73 and 93.
  • the two coupling holes 74, 94 and the connection holes 73, 93 are the first shield layer 70 and so that the distances between the centers of the two coupling holes 74, 94 and the centers of the connection holes 73, 93 are equal to each other.
  • the first cover layers 90 are arranged along the short sides of the rectangle.
  • the first shield layer 70 and the first cover layer 90 are manufactured by sticking a polyimide film on a copper foil having a conductive adhesive on one side and appropriately etching the polyimide film and the copper foil to form a pattern. May be done.
  • the second cover layer 100 has a rectangular thin film shape as shown in FIGS.
  • the second cover layer 100 is laminated on the second shield layer 80.
  • the second cover layer 100 is made of an electrically insulating material, for example, a resin material typified by polyimide.
  • the second cover layer 100 has a pair of long edges that form the long sides of the rectangle and a pair of short edges that form the short sides of the rectangle.
  • connection hole 103 and two coupling holes 104 that penetrate the second cover layer 100 in the thickness direction are formed in the vicinity of one short edge portion.
  • the connection hole 103 and the connection hole 104 each have a circular shape.
  • the connection hole 103 is formed in the central portion of the short edge portion.
  • the coupling holes 104 are formed at both ends of the short edge portion.
  • the coupling hole 104 is formed at a corner portion of a rectangle.
  • the connection hole 103 and the coupling hole 104 are arranged along the short side of the rectangle of the second cover layer 100.
  • the center of the connection hole 103 and the center of the two connection holes 104 are in a straight line.
  • connection hole 103 of the second cover layer 100 has the same diameter as the connection hole 83 of the second shield layer 80.
  • the connection hole 83 of the second shield layer 80 and the connection hole 103 of the second cover layer 100 are arranged concentrically.
  • the center of the connection hole 83 of the second shield layer 80 and the center of the connection hole 103 of the second cover layer 100 are aligned.
  • the entire connection hole 103 of the second cover layer 100 overlaps the connection hole 83 of the second shield layer 80.
  • connection holes 83 and 103 are arranged between the pair of connection holes 84 and 104.
  • the pair of coupling holes 84 and 104 sandwich the connection holes 83 and 103.
  • the two coupling holes 84 and 104 and the connection holes 83 and 103 are arranged so that the distance between the center of each of the two coupling holes 84 and 104 and the center of each of the connection holes 83 and 103 becomes equal.
  • the second cover layers 100 are arranged along the short sides of the rectangle.
  • the second shield layer 80 and the second cover layer 100 are manufactured by attaching a polyimide film to a copper foil having a conductive adhesive on one side thereof and appropriately etching the polyimide film and the copper foil to form a pattern. May be done.
  • the sensor unit 10 has a thin-film second cover layer 100, a second shield layer 80, a second insulating layer 60, a cathode layer 40, an organic piezoelectric element 20, a positive electrode layer 30, a first insulating layer 50, and a first shield.
  • the layer 70 and the first cover layer 90 are laminated to each other to be formed into a flexible thin plate shape as a whole.
  • the vibration sensor 1 further includes an interposition member 110, a mounting member 120, a connecting member 130, a lead wire 140, and a bolt member 150.
  • the intervening member 110 is laminated on the second cover layer 100 as shown in FIGS. 4 and 5.
  • the interposition member 110 has a first member 111 laminated on one short edge of the second cover layer 100 and a second member 112 laminated on the other short edge of the second cover layer 100. doing.
  • the first member 111 and the second member 112 have a substantially rectangular box-shaped outer shape.
  • the interposition member 110 is disposed between the vibration measurement target 200 and the sensor unit 10. Intervenes in.
  • the first member 111 is interposed between the vibration measurement object 200 and the second cover layer 100.
  • the second member 112 is interposed between the vibration measurement object 200 and the second cover layer 100.
  • the intervening member 110 is made of an electrically insulating material typified by a resin material. Since the sensor unit 10 is arranged away from the vibration measurement object 200 due to the intervention of the intervening member 110 and the intervening member 110 is electrically insulating, the electricity between the sensor unit 10 and the vibration measurement object 200 Electrical insulation is maintained. Therefore, the influence of noise from the vibration measurement object 200 on the sensor unit 10 is suppressed.
  • two coupling holes 114 and a receiving hole 116 are formed in the first member 111.
  • the coupling hole 114 and the receiving hole 116 each have a circular shape in a plan view.
  • the receiving hole 116 is formed in the central portion of the first member 111.
  • the coupling holes 114 are formed at both end portions of the first member 111.
  • the coupling hole 114 and the receiving hole 116 are arranged along the longitudinal direction of the first member 111.
  • the centers of the two coupling holes 114 and the centers of the receiving holes 116 are in a straight line.
  • the two coupling holes 114 penetrate the first member 111 in the thickness direction.
  • the receiving hole 116 is formed by recessing the facing surface of the outer surface of the first member 111 facing the sensor portion 10.
  • the receiving hole 116 is a bottomed hole. The receiving hole 116 does not penetrate the first member 111.
  • the mounting member 120 is made of a conductive material.
  • the mounting member 120 is laminated on the first cover layer 90 as shown in FIGS. 4 and 5.
  • the attachment member 120 may be adhered to the first cover layer 90.
  • a hollow accommodation space 121 is formed inside the mounting member 120.
  • a female screw is formed on the engaging surface 122 forming the inner peripheral surface of the accommodation space 121.
  • the mounting member 120 is formed with a connection hole 123 that opens to the engaging surface 122 and also opens to the outer surface of the mounting member 120.
  • the connection hole 123 communicates the accommodation space 121 with the outside of the mounting member 120.
  • the mounting member 120 is further formed with two coupling holes 124.
  • the connecting member 130 has a core portion 131, an insulating cylinder portion 132, and an outer sheath portion 133.
  • the core portion 131 is made of a conductive material and penetrates the connecting member 130.
  • the insulating tubular portion 132 is made of an insulating material typified by resin.
  • the insulating cylinder portion 132 is interposed between the core portion 131 and the outer sheath portion 133, and electrically insulates the core portion 131 and the outer sheath portion 133.
  • the outer sheath portion 133 is made of a conductive material.
  • the outer sheath portion 133 has an engagement surface 134.
  • a male screw is formed on the engaging surface 134.
  • the engagement surface 134 is engaged with the engagement surface 122 of the mounting member 120.
  • the connecting member 130 is attached to the mounting member 120 by screwing. By rotating the connecting member 130 with respect to the mounting member 120, the connecting member 130 is fitted to the mounting member 120. With the connecting member 130 attached to the mounting member 120, one end of the core portion 131 is exposed to the outside, and the other end of the core portion 131 is arranged in the accommodation space 121 inside the mounting member 120.
  • the conductor 140 is made of a conductive material. As shown in FIG. 2, the lead wire 140 has one end 141 and the other end 142. One end 141 of the conducting wire 140 is connected to the connecting member 130. More specifically, one end 141 is connected to the core 131 of the connecting member 130. One end 141 is connected to the core 131 by soldering. A soldering portion is interposed between the core portion 131 of the connecting member 130 and the one end 141 of the conducting wire 140.
  • the other end 142 of the lead wire 140 is connected to the positive electrode layer 30 as shown in FIG. More specifically, the other end 142 is connected to the connecting portion 32 of the positive electrode layer 30. The other end 142 is connected to the connecting portion 32 by soldering. A soldered portion is interposed between the connecting portion 32 of the positive electrode layer 30 and the other end 142 of the conducting wire 140. The core portion 131 of the connecting member 130 is electrically connected to the positive electrode layer 30 via the conducting wire 140.
  • the bolt member 150 is made of a conductive material.
  • the bolt member 150 has a head portion 151 and a shaft portion 152. As shown in FIG. 3, the bolt member 150 bolts the intervening member 110 and the mounting member 120.
  • the shaft portion 152 of the bolt member 150 penetrates the sensor portion 10 and is screwed into both the coupling hole 114 of the intervening member 110 and the coupling hole 124 of the mounting member 120.
  • the entire head 151 is arranged in the coupling hole 114 of the interposition member 110. Therefore, when the vibration sensor 1 is attached to the vibration measurement object 200, the bolt member 150 does not interfere with the attachment.
  • the shaft portion 152 of the bolt member 150 penetrates the sensor portion 10.
  • the shaft portion 152 penetrates the coupling holes 44, 54, 64, 74, 84, 94, 104 of the layers forming the sensor unit 10.
  • the shaft portion 152 penetrates the cathode layer 40.
  • the shaft portion 152 penetrates the coupling hole 44 formed in the cathode layer 40.
  • the diameter of the coupling hole 44 is set to be equal to or smaller than the diameter of the shaft portion 152.
  • the cathode layer 40 is electrically connected to the mounting member 120 via a bolt member 150 that is coupled to the mounting member 120.
  • the outer sheath portion 133 of the connecting member 130 is electrically connected to the cathode layer 40 via the mounting member 120 and the bolt member 150.
  • the characteristic configurations of this embodiment are listed below.
  • the positive electrode layer 30, the first insulating layer 50, and the first shield layer 70 are sequentially laminated on the first surface 21 of the thin-film organic piezoelectric element 20.
  • the sensor unit 10 is provided with a cathode layer 40, a second insulating layer 60, and a second shield layer 80 laminated in this order on the second surface 23 of the organic piezoelectric element 20.
  • the sensor unit 10 is formed in a flexible thin plate shape as a whole.
  • the sensor portion 10 is formed into a thin plate shape, and the sensor portion 10 is bendable and deformable.
  • the vibration sensor 1 can be configured to be attached to the measurement target surface having a curved surface. Since the vibration sensor 1 has a thin shape, the vibration sensor 1 can be arranged in a narrow space such as between adjacent devices or between a device and a wall surface. Therefore, the vibration sensor 1 of the embodiment can be attached to a place where it was difficult to attach the conventional vibration sensor, and the versatility of the vibration sensor 1 is enhanced.
  • the vibration sensor 1 Since the vibration sensor 1 is lightened, the influence of the own weight of the vibration sensor 1 on the vibration of the vibration measurement target 200 is reduced, and therefore the vibration can be detected more accurately.
  • the positive electrode layer 30 and the cathode layer 40 form positive and negative electrodes
  • the first shield layer 70 made of a metal material is laminated on the positive electrode layer 30
  • the second shield layer made of a metal material is laminated on the cathode layer 40.
  • the 80s By configuring the 80s to be stacked, the influence of noise on the vibration sensor 1 can be reduced. Therefore, the vibration detection accuracy of the vibration sensor 1 of the embodiment can be improved.
  • the first insulating layer 50 between the positive electrode layer 30 and the first shield layer 70 the positive electrode layer 30 and the first shield layer 70 can be reliably electrically insulated.
  • the second insulating layer 60 is interposed between the cathode layer 40 and the second shield layer 80, the cathode layer 40 and the second shield layer 80 can be reliably electrically insulated.
  • the vibration sensor 1 further includes a first cover layer 90 laminated on the first shield layer 70 and a second cover layer 100 laminated on the second shield layer 80. ing.
  • a first cover layer 90 and a second cover layer 100 made of a resin material such as polyimide are laminated on the first shield layer 70 and the second shield layer 80 made of a metal material, respectively, and the outermost layer of the sensor unit 10 is made of a resin material.
  • the vibration sensor 1 further includes an intervening member 110.
  • the interposition member 110 is interposed between the second cover layer 100 of the sensor unit 10 and the vibration measurement object 200.
  • the intervening member 110 By interposing the intervening member 110, the sensor unit 10 is arranged away from the vibration measurement object 200. Therefore, the electrical insulation between the sensor unit 10 and the vibration measurement object 200 can be maintained, and the influence of noise from the vibration measurement object 200 on the vibration sensor 1 can be reduced.
  • the magnet plate is fixed to the intervening member 110 and the intervening member 110 is magnetically attached to the vibration measurement object 200, the intervening member 110 and the vibration measurement object 200 are attached with a joining tape such as double-sided tape, or the intervening member 110 is attached.
  • the vibration sensor 1 can be easily attached to the vibration measurement target 200 without affecting the sensor unit 10 by adhering it to the vibration measurement target 200.
  • connection member 130 electrically connected to the positive electrode layer 30 is attached to the attachment member 120 laminated on the first cover layer 90.
  • the vibration detection result of the vibration measurement object by the vibration sensor 1 can be output to the outside via the connecting member 130. If the core 131 of the connecting member 130 is configured to be connected to the charge converter, the charge signal can be converted into a voltage signal by the charge converter, and the vibration detection result can be output as a voltage.
  • the connection member 130 a commercially available product such as a 10-32 connector that can be obtained at low cost can be used, and in this case, the manufacturing cost of the vibration sensor 1 can be reduced.
  • the connecting member 130 is attached to the attachment member 120 by screwing. Since the connecting member 130 can be easily attached to the mounting member 120 only by rotating the connecting member 130, no special tool is required and no soldering is required, so that the assembly work of the vibration sensor 1 can be shortened.
  • one end 141 of the conductor wire 140 is electrically connected to the connection member 130, and the other end 142 of the conductor wire 140 is connected to the positive electrode layer 30.
  • the positive electrode layer 30 and the connecting member 130 can be reliably and electrically connected via the lead wire 140.
  • the other end 142 of the lead wire 140 is connected to the positive electrode layer 30 by soldering.
  • the conductive wire 140 can be reliably fixed to the positive electrode layer 30 by soldering, and electrical connection between the positive electrode layer 30 and the connection member 130 via the conductive wire 140 can be secured.
  • the bolt member 150 bolts the intervening member 110 and the mounting member 120.
  • the vibration sensor 1 By mounting the bolt member 150 in the coupling hole 114 of the interposition member 110, penetrating the sensor portion 10 and screwing it into the coupling hole 124 of the mounting member 120, the vibration sensor 1 can be easily assembled integrally.
  • the bolt member 150 is arranged so as to penetrate the cathode layer 40, and the cathode layer 40 and the connection member 130 are electrically connected via the bolt member 150.
  • the shaft portion 152 of the bolt member 150 comes into contact with the cathode layer 40, so that the cathode layer 40 and the connecting member 130 are electrically connected to each other via the bolt member 150. Connected to. Since it is not necessary to provide a dedicated process for electrically connecting the cathode layer 40 and the connection member 130, the assembly work of the vibration sensor 1 can be shortened and the productivity can be improved.
  • the vibration sensor according to the present disclosure is suitable for use in predictive maintenance by attaching a large number of vibration sensors to a vibration measurement object such as a machine or a factory and verifying the vibration tendency of the vibration measurement object in chronological order. Can be applied.

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Abstract

Provided is a vibration sensor which can be attached to a curved surface subjected to measurement. An organic piezoelectric element (20) has a first surface and a second surface on the side opposite to the first surface, the organic piezoelectric element being polarized such that a positive charge is distributed on the first surface and a negative charge is distributed on the second surface. A positive electrode layer is made of a metal material and layered on the first surface. A first insulating layer (50) is made of an insulating material and layered on the positive electrode layer. A first shield layer is made of a metal layer and layered on the first insulating layer (50). A cathode layer (40) is made of a metal material and layered on the second surface. A second insulating layer (60) is made of an insulating material and layered on the cathode layer. A second shield layer (80) is made of a metal material and layered on the second insulating layer (60).

Description

振動センサーVibration sensor
　本開示は、振動センサーに関する。 The present disclosure relates to a vibration sensor.
　従来、加速度センサに関し、加速度検出素子および電子回路をセラミック基板に実装し、セラミックカバーをセラミック基板に接着する技術が提案されている（たとえば、特開平７－２３４２４４号公報（特許文献１）参照）。 Conventionally, regarding an acceleration sensor, a technique of mounting an acceleration detection element and an electronic circuit on a ceramic substrate and adhering a ceramic cover to the ceramic substrate has been proposed (see, for example, Japanese Patent Application Laid-Open No. 7-234244 (Patent Document 1)). ..
特開平７－２３４２４４号公報Japanese Patent Laid-Open No. 7-234244
　上記文献に記載の構成では、加速度検出素子および電子回路が収容される空間が、セラミック基板およびセラミックカバーによって取り囲まれて形成されている。ヤング率が大きく変形しにくいセラミック材料が筐体を形成しているため、センサ本体に屈曲性がなく、曲面形状の計測対象面にセンサを取り付けることが困難である。 In the configuration described in the above document, the space in which the acceleration detection element and the electronic circuit are housed is surrounded by the ceramic substrate and the ceramic cover. Since the housing is made of a ceramic material that has a large Young's modulus and is not easily deformed, the sensor body is not flexible and it is difficult to attach the sensor to the curved surface of the measurement target.
　本開示では、曲面を持つ計測対象面にも取り付け可能な振動センサーが提供される。 In the present disclosure, a vibration sensor that can be attached to a measurement target surface having a curved surface is provided.
　本開示に従うと、薄膜状の有機圧電素子と、正極層と、第１絶縁層と、第１シールド層と、陰極層と、第２絶縁層と、第２シールド層と、を備える、振動センサーが提供される。有機圧電素子は、第１面と、第１面の反対側の第２面とを有しており、第１面に正電荷が偏在し第２面に負電荷が偏在するように分極されている。正極層は、金属材料製であり、第１面に積層されている。第１絶縁層は、絶縁材料製であり、正極層に積層されている。第１シールド層は、金属材料製であり、第１絶縁層に積層されている。陰極層は、金属材料製であり、第２面に積層されている。第２絶縁層は、絶縁材料製であり、陰極層に積層されている。第２シールド層は、金属材料製であり、第２絶縁層に積層されている。 According to the present disclosure, a vibration sensor including a thin-film organic piezoelectric element, a positive electrode layer, a first insulating layer, a first shield layer, a cathode layer, a second insulating layer, and a second shield layer. Is provided. The organic piezoelectric element has a first surface and a second surface opposite to the first surface, and is polarized so that positive charges are unevenly distributed on the first surface and negative charges are unevenly distributed on the second surface. There is. The positive electrode layer is made of a metal material and is laminated on the first surface. The first insulating layer is made of an insulating material and is laminated on the positive electrode layer. The first shield layer is made of a metal material and is laminated on the first insulating layer. The cathode layer is made of a metal material and is laminated on the second surface. The second insulating layer is made of an insulating material and is laminated on the cathode layer. The second shield layer is made of a metal material and is laminated on the second insulating layer.
　上記の振動センサーは、第１カバー層と、第２カバー層とをさらに備えている。第１カバー層は、絶縁材料製であり、第１シールド層に積層されている。第２カバー層は、絶縁材料製であり、第２シールド層に積層されている。 The above vibration sensor further includes a first cover layer and a second cover layer. The first cover layer is made of an insulating material and is laminated on the first shield layer. The second cover layer is made of an insulating material and is laminated on the second shield layer.
　上記の振動センサーは、介在部材をさらに備えている。介在部材は、第２カバー層の周縁部の少なくとも一部に積層されている。介在部材は、振動センサーにより振動を計測される振動計測対象物に振動センサーが取り付けられた状態で、振動計測対象物と第２カバー層との間に介在している。 The above vibration sensor further includes an intervening member. The intervening member is laminated on at least a part of the peripheral edge of the second cover layer. The intervening member is interposed between the vibration measurement object and the second cover layer in a state where the vibration sensor is attached to the vibration measurement object whose vibration is measured by the vibration sensor.
　上記の振動センサーは、取付部材と、接続部材とを備えている。取付部材は、第１カバー層に積層されている。接続部材は、取付部材に取り付けられており、正極層に電気的に接続している。 The above vibration sensor includes a mounting member and a connecting member. The mounting member is laminated on the first cover layer. The connecting member is attached to the mounting member and is electrically connected to the positive electrode layer.
　上記の振動センサーにおいて、接続部材は、取付部材にねじ込みにより取り付けられている。 In the above vibration sensor, the connecting member is attached to the attachment member by screwing.
　上記の振動センサーは、導線をさらに備えている。導線は、接続部材に接続される一端と、正極層に接続される他端とを有している。 The above vibration sensor is further equipped with a lead wire. The lead wire has one end connected to the connecting member and the other end connected to the positive electrode layer.
　上記の振動センサーにおいて、導線の他端は、正極層に半田付けにより接続されている。 In the above vibration sensor, the other end of the lead wire is connected to the positive electrode layer by soldering.
　上記の振動センサーは、介在部材と取付部材とをボルト結合するボルト部材をさらに備えている。 The vibration sensor described above further includes a bolt member that bolts the intervening member and the mounting member.
　上記の振動センサーにおいて、ボルト部材は、陰極層を貫通して配置されている。陰極層と接続部材とは、ボルト部材を介して電気的に接続されている。 In the above vibration sensor, the bolt member is arranged so as to penetrate the cathode layer. The cathode layer and the connecting member are electrically connected via a bolt member.
　本開示に従うと、曲面を持つ計測対象面に取り付け可能な振動センサーを実現することができる。 According to the present disclosure, it is possible to realize a vibration sensor that can be attached to a measurement target surface having a curved surface.
実施形態に基づく振動センサーの斜視図である。It is a perspective view of the vibration sensor based on embodiment. 図１に示す振動センサーの部分断面図である。It is a partial cross section figure of the vibration sensor shown in FIG. 図１に示す振動センサーの側面図である。It is a side view of the vibration sensor shown in FIG. 図１に示す振動センサーの分解斜視図である。It is a disassembled perspective view of the vibration sensor shown in FIG. 図１に示す振動センサーを異なる角度から見た分解斜視図である。FIG. 3 is an exploded perspective view of the vibration sensor shown in FIG. 1 viewed from different angles. 有機圧電素子の分極を示す模式図である。It is a schematic diagram which shows the polarization of an organic piezoelectric element. 有機圧電素子、正極層および第１絶縁層の積層体の模式図である。It is a schematic diagram of the laminated body of an organic piezoelectric element, a positive electrode layer and a first insulating layer. 有機圧電素子、陰極層および第２絶縁層の積層体の模式図である。It is a schematic diagram of the laminated body of an organic piezoelectric element, a cathode layer and a second insulating layer.
　以下、実施形態について図面に基づいて説明する。以下の説明では、同一の部品には同一の符号を付してある。それらの名称および機能も同じである。したがって、それらについての詳細な説明は繰り返さない。 Embodiments will be described below with reference to the drawings. In the following description, the same parts are designated by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.
　図１は、実施形態に基づく振動センサー１の斜視図である。図２は、図１に示す振動センサー１の部分断面図である。図３は、図１に示す振動センサー１の側面図である。図４は、図１に示す振動センサー１の分解斜視図である。図５は、図１に示す振動センサー１を異なる角度から見た分解斜視図である。なお図２には、図１中の矢印ＩＩ方向から見た振動センサー１が図示されており、図３には、図１中の矢印ＩＩＩ方向から見た振動センサー１が図示されている。 FIG. 1 is a perspective view of a vibration sensor 1 according to the embodiment. FIG. 2 is a partial cross-sectional view of the vibration sensor 1 shown in FIG. FIG. 3 is a side view of the vibration sensor 1 shown in FIG. FIG. 4 is an exploded perspective view of the vibration sensor 1 shown in FIG. FIG. 5 is an exploded perspective view of the vibration sensor 1 shown in FIG. 1 as viewed from different angles. Note that FIG. 2 illustrates the vibration sensor 1 viewed from the direction of arrow II in FIG. 1, and FIG. 3 illustrates the vibration sensor 1 viewed from the direction of arrow III in FIG. 1.
　図１，２に示されるように、振動センサー１は、センサー部１０を備えている。センサー部１０は、図４，５に示されるように、有機圧電素子２０と、正極層３０と、陰極層４０と、第１絶縁層５０と、第２絶縁層６０と、第１シールド層７０と、第２シールド層８０と、第１カバー層９０と、第２カバー層１００とを有している。センサー部１０は、第２カバー層１００、第２シールド層８０、第２絶縁層６０、陰極層４０、有機圧電素子２０、正極層３０、第１絶縁層５０、第１シールド層７０、および第１カバー層９０が、この順に積層されて一体に接合されることにより、形成されている。 As shown in FIGS. 1 and 2, the vibration sensor 1 includes a sensor unit 10. As shown in FIGS. 4 and 5, the sensor unit 10 includes an organic piezoelectric element 20, a positive electrode layer 30, a cathode layer 40, a first insulating layer 50, a second insulating layer 60, and a first shield layer 70. The second shield layer 80, the first cover layer 90, and the second cover layer 100 are provided. The sensor unit 10 includes a second cover layer 100, a second shield layer 80, a second insulating layer 60, a cathode layer 40, an organic piezoelectric element 20, a positive electrode layer 30, a first insulating layer 50, a first shield layer 70, and a first. The 1-cover layer 90 is formed by being laminated in this order and integrally joined.
　有機圧電素子２０は、図４，５に示されるように、矩形薄膜状の形状を有している。有機圧電素子２０は、矩形の長辺を成す一対の長縁部と、矩形の短辺を成す一対の短縁部とを有している。図６は、有機圧電素子２０の分極を示す模式図である。図６に示されるように、有機圧電素子２０は、第１面２１と、第１面２１の反対側の第２面２３とを有している。有機圧電素子２０は、第１面２１に正電荷が偏在し、第２面２３に負電荷が偏在するように、分極されている。有機圧電素子２０は、センサー部１０を組み立てる前に、公知のコロナ処理などの任意の分極処理を予め施すことにより、分極されている。 The organic piezoelectric element 20 has a rectangular thin film shape as shown in FIGS. The organic piezoelectric element 20 has a pair of long edge portions forming long sides of the rectangle and a pair of short edge portions forming short sides of the rectangle. FIG. 6 is a schematic view showing the polarization of the organic piezoelectric element 20. As shown in FIG. 6, the organic piezoelectric element 20 has a first surface 21 and a second surface 23 opposite to the first surface 21. The organic piezoelectric element 20 is polarized so that the positive charges are unevenly distributed on the first surface 21 and the negative charges are unevenly distributed on the second surface 23. The organic piezoelectric element 20 is polarized by subjecting an arbitrary polarization treatment such as a known corona treatment in advance before assembling the sensor unit 10.
　正極層３０は、図５に示されるように、薄膜状の形状を有している。正極層３０は、有機圧電素子２０の第１面２１に積層されている。正極層３０は、導電性の材料、たとえば銅またはＳＵＳに代表される金属材料で形成されている。正極層３０は、図５に示されるように、略矩形状の本体部３１と、本体部３１の矩形の短辺の中央部分から外側へ突出している接続部３２とを有している。接続部３２には、正極層３０を厚み方向に貫通する接続孔３３が形成されている。接続孔３３は、円形状を有している。 As shown in FIG. 5, the positive electrode layer 30 has a thin film shape. The positive electrode layer 30 is laminated on the first surface 21 of the organic piezoelectric element 20. The positive electrode layer 30 is made of a conductive material, for example, a metal material typified by copper or SUS. As shown in FIG. 5, the positive electrode layer 30 has a substantially rectangular main body 31 and a connecting portion 32 that projects outward from the central portion of the rectangular short side of the main body 31. The connection portion 32 is formed with a connection hole 33 that penetrates the positive electrode layer 30 in the thickness direction. The connection hole 33 has a circular shape.
　陰極層４０は、図４に示されるように、薄膜状の形状を有している。陰極層４０は、有機圧電素子２０の第２面２３に積層されている。陰極層４０は、導電性の材料、たとえば銅またはＳＵＳに代表される金属材料で形成されている。陰極層４０は、図４に示されるように、略矩形状の本体部４１と、本体部４１の矩形の短辺の両端部分から外側へ突出している２つの接続部４２とを有している。各々の接続部４２には、陰極層４０を厚み方向に貫通する結合孔４４が形成されている。結合孔４４は、円形状を有している。 As shown in FIG. 4, the cathode layer 40 has a thin film shape. The cathode layer 40 is laminated on the second surface 23 of the organic piezoelectric element 20. The cathode layer 40 is made of a conductive material, for example, a metal material typified by copper or SUS. As shown in FIG. 4, the cathode layer 40 has a substantially rectangular main body portion 41 and two connecting portions 42 protruding outward from both end portions of the rectangular short sides of the main body portion 41. .. A coupling hole 44 that penetrates the cathode layer 40 in the thickness direction is formed in each connection portion 42. The coupling hole 44 has a circular shape.
　第１絶縁層５０は、図４，５に示されるように、矩形薄膜状の形状を有している。第１絶縁層５０は、正極層３０に積層されている。第１絶縁層５０は、電気絶縁性の材料、たとえばポリイミドに代表される樹脂材料で形成されている。第１絶縁層５０は、矩形の長辺を成す一対の長縁部と、矩形の短辺を成す一対の短縁部とを有している。 The first insulating layer 50 has a rectangular thin film shape as shown in FIGS. The first insulating layer 50 is laminated on the positive electrode layer 30. The first insulating layer 50 is formed of an electrically insulating material, for example, a resin material typified by polyimide. The 1st insulating layer 50 has a pair of long edge part which comprises the long side of a rectangle, and a pair of short edge part which comprises the short side of a rectangle.
　一方の短縁部の近傍に、第１絶縁層５０を厚み方向に貫通する１つの接続孔５３と２つの結合孔５４とが形成されている。接続孔５３と結合孔５４とは、各々円形状を有している。接続孔５３は、短縁部の中央部分に形成されている。結合孔５４は、短縁部の両端部分に形成されている。結合孔５４は、矩形の角部分に形成されている。接続孔５３と結合孔５４とは、第１絶縁層５０の矩形の短辺に沿って並べられている。接続孔５３の中心と２つの結合孔５４の中心とは、一直線上にある。 One connection hole 53 and two coupling holes 54 that penetrate the first insulating layer 50 in the thickness direction are formed in the vicinity of one short edge portion. The connection hole 53 and the coupling hole 54 each have a circular shape. The connection hole 53 is formed in the central portion of the short edge portion. The coupling holes 54 are formed at both ends of the short edge portion. The coupling hole 54 is formed at a corner portion of a rectangle. The connection hole 53 and the connection hole 54 are arranged along the short side of the rectangle of the first insulating layer 50. The center of the connecting hole 53 and the center of the two connecting holes 54 are in a straight line.
　第１絶縁層５０の接続孔５３の直径は、正極層３０の接続孔３３の直径以下である。正極層３０と第１絶縁層５０とが積層された状態で、正極層３０の接続孔３３と第１絶縁層５０の接続孔５３とは、同心に配置されている。正極層３０と第１絶縁層５０とが積層された状態で、正極層３０の接続孔３３の中心と第１絶縁層５０の接続孔５３の中心とが一致している。第１絶縁層５０の接続孔５３の全部が、正極層３０の接続孔３３と重なっている。 The diameter of the connection hole 53 of the first insulating layer 50 is less than or equal to the diameter of the connection hole 33 of the positive electrode layer 30. In a state where the positive electrode layer 30 and the first insulating layer 50 are laminated, the connection holes 33 of the positive electrode layer 30 and the connection holes 53 of the first insulating layer 50 are arranged concentrically. With the positive electrode layer 30 and the first insulating layer 50 stacked, the center of the connection hole 33 of the positive electrode layer 30 and the center of the connection hole 53 of the first insulating layer 50 are aligned. All of the connection holes 53 of the first insulating layer 50 overlap with the connection holes 33 of the positive electrode layer 30.
　図７は、有機圧電素子２０、正極層３０および第１絶縁層５０の積層体の模式図である。図７に示されるように、有機圧電素子２０は、正極層３０の本体部３１と重なっている。正極層３０の接続部３２は、有機圧電素子２０と重なっておらず、有機圧電素子２０の短縁部から突出している。正極層３０の接続孔３３は、第１絶縁層５０の接続孔５３と重なっており、接続孔３３，５３は同心に配置されている。接続孔３３，５３は、一対の結合孔５４の間に配置されている。一対の結合孔５４は、接続孔３３，５３を挟んでいる。２つの結合孔５４の各々の中心と接続孔３３，５３の中心との距離が相等しくなるように、２つの結合孔５４と接続孔３３，５３とは第１絶縁層５０の矩形の短辺に沿って並べられている。 FIG. 7 is a schematic view of a laminate of the organic piezoelectric element 20, the positive electrode layer 30, and the first insulating layer 50. As shown in FIG. 7, the organic piezoelectric element 20 overlaps with the main body 31 of the positive electrode layer 30. The connecting portion 32 of the positive electrode layer 30 does not overlap with the organic piezoelectric element 20, and protrudes from the short edge portion of the organic piezoelectric element 20. The connection hole 33 of the positive electrode layer 30 overlaps with the connection hole 53 of the first insulating layer 50, and the connection holes 33, 53 are arranged concentrically. The connection holes 33 and 53 are arranged between the pair of coupling holes 54. The pair of coupling holes 54 sandwich the connection holes 33 and 53. The two coupling holes 54 and the connection holes 33, 53 are the rectangular short sides of the first insulating layer 50 so that the distances between the centers of the two coupling holes 54 and the centers of the connection holes 33, 53 are equal. Are lined up alongside.
　正極層３０と第１絶縁層５０とは、ポリイミドフィルムに銅箔を熱圧着などにより接合した市販の銅張積層板を準備し、ポリイミドフィルムおよび銅箔を適宜エッチングしてパターンを形成することにより、作製されてもよい。 The positive electrode layer 30 and the first insulating layer 50 are formed by preparing a commercially available copper-clad laminate in which a copper foil is bonded to a polyimide film by thermal pressure bonding or the like, and appropriately etching the polyimide film and the copper foil to form a pattern. , May be produced.
　第２絶縁層６０は、図４，５に示されるように、矩形薄膜状の形状を有している。第２絶縁層６０は、陰極層４０に積層されている。第２絶縁層６０は、電気絶縁性の材料、たとえばポリイミドに代表される樹脂材料で形成されている。第２絶縁層６０は、矩形の長辺を成す一対の長縁部と、矩形の短辺を成す一対の短縁部とを有している。 The second insulating layer 60 has a rectangular thin film shape as shown in FIGS. The second insulating layer 60 is laminated on the cathode layer 40. The second insulating layer 60 is formed of an electrically insulating material, for example, a resin material typified by polyimide. The 2nd insulating layer 60 has a pair of long edge part which comprises the long side of a rectangle, and a pair of short edge part which comprises the short side of a rectangle.
　一方の短縁部の近傍に、第２絶縁層６０を厚み方向に貫通する１つの接続孔６３と２つの結合孔６４とが形成されている。接続孔６３と結合孔６４とは、各々円形状を有している。接続孔６３は、短縁部の中央部分に形成されている。結合孔６４は、短縁部の両端部分に形成されている。結合孔６４は、矩形の角部分に形成されている。接続孔６３と結合孔６４とは、第２絶縁層６０の矩形の短辺に沿って並べられている。接続孔６３の中心と２つの結合孔６４の中心とは、一直線上にある。 One connection hole 63 and two coupling holes 64 that penetrate the second insulating layer 60 in the thickness direction are formed in the vicinity of one short edge portion. The connection hole 63 and the connection hole 64 each have a circular shape. The connection hole 63 is formed in the central portion of the short edge portion. Bonding holes 64 are formed at both ends of the short edge portion. The coupling hole 64 is formed at a corner portion of a rectangle. The connection hole 63 and the connection hole 64 are arranged along the short side of the rectangle of the second insulating layer 60. The center of the connecting hole 63 and the center of the two connecting holes 64 are in a straight line.
　第２絶縁層６０の結合孔６４の直径は、陰極層４０の結合孔４４の直径以下である。陰極層４０と第２絶縁層６０とが積層された状態で、陰極層４０の結合孔４４と第２絶縁層６０の結合孔６４とは、同心に配置されている。陰極層４０と第２絶縁層６０とが積層された状態で、陰極層４０の結合孔４４の中心と第２絶縁層６０の結合孔６４の中心とが一致している。第２絶縁層６０の結合孔６４の全部が、陰極層４０の結合孔４４と重なっている。 The diameter of the coupling hole 64 of the second insulating layer 60 is less than or equal to the diameter of the coupling hole 44 of the cathode layer 40. In the state where the cathode layer 40 and the second insulating layer 60 are laminated, the coupling hole 44 of the cathode layer 40 and the coupling hole 64 of the second insulating layer 60 are arranged concentrically. In the state where the cathode layer 40 and the second insulating layer 60 are stacked, the center of the coupling hole 44 of the cathode layer 40 and the center of the coupling hole 64 of the second insulating layer 60 are aligned. All of the coupling holes 64 of the second insulating layer 60 overlap with the coupling holes 44 of the cathode layer 40.
　図８は、有機圧電素子２０、陰極層４０および第２絶縁層６０の積層体の模式図である。図８に示されるように、有機圧電素子２０は、陰極層４０の本体部４１と重なっている。陰極層４０の接続部４２は、有機圧電素子２０と重なっておらず、有機圧電素子２０の短縁部から突出している。陰極層４０の結合孔４４は、第２絶縁層６０の結合孔６４と重なっており、結合孔４４，６４は同心に配置されている。接続孔６３は、一対の結合孔４４，６４の間に配置されている。一対の結合孔４４，６４は、接続孔６３を挟んでいる。２つの結合孔４４，６４の各々の中心と接続孔６３の中心との距離が相等しくなるように、２つの結合孔４４，６４と接続孔６３とは第２絶縁層６０の矩形の短辺に沿って並べられている。 FIG. 8 is a schematic view of a laminated body of the organic piezoelectric element 20, the cathode layer 40, and the second insulating layer 60. As shown in FIG. 8, the organic piezoelectric element 20 overlaps with the main body 41 of the cathode layer 40. The connecting portion 42 of the cathode layer 40 does not overlap with the organic piezoelectric element 20, and protrudes from the short edge portion of the organic piezoelectric element 20. The coupling hole 44 of the cathode layer 40 overlaps with the coupling hole 64 of the second insulating layer 60, and the coupling holes 44 and 64 are arranged concentrically. The connection hole 63 is arranged between the pair of coupling holes 44 and 64. The connection hole 63 is sandwiched between the pair of coupling holes 44 and 64. The two coupling holes 44, 64 and the connection hole 63 are the rectangular short sides of the second insulating layer 60 so that the distances between the centers of the two coupling holes 44 and 64 and the center of the connection hole 63 are equal to each other. Are lined up alongside.
　陰極層４０と第２絶縁層６０とは、ポリイミドフィルムに銅箔を熱圧着などにより接合した市販の銅張積層板を準備し、ポリイミドフィルムおよび銅箔を適宜エッチングしてパターンを形成することにより、作製されてもよい。 For the cathode layer 40 and the second insulating layer 60, a commercially available copper-clad laminate in which a copper foil is bonded to a polyimide film by hot pressure bonding or the like is prepared, and the polyimide film and the copper foil are appropriately etched to form a pattern. , May be produced.
　第１シールド層７０は、図５に示されるように、矩形薄膜状の形状を有している。第１シールド層７０は、第１絶縁層５０に積層されている。第１シールド層７０は、導電性の材料、たとえば銅またはＳＵＳに代表される金属材料で形成されている。第１シールド層７０は、矩形の長辺を成す一対の長縁部と、矩形の短辺を成す一対の短縁部とを有している。 As shown in FIG. 5, the first shield layer 70 has a rectangular thin film shape. The first shield layer 70 is laminated on the first insulating layer 50. The first shield layer 70 is made of a conductive material, for example, a metal material typified by copper or SUS. The first shield layer 70 has a pair of long edge portions forming the long sides of the rectangle and a pair of short edge portions forming the short sides of the rectangle.
　一方の短縁部の近傍に、第１シールド層７０を厚み方向に貫通する１つの接続孔７３と２つの結合孔７４とが形成されている。接続孔７３と結合孔７４とは、各々円形状を有している。接続孔７３は、短縁部の中央部分に形成されている。結合孔７４は、短縁部の両端部分に形成されている。結合孔７４は、矩形の角部分に形成されている。接続孔７３と結合孔７４とは、第１シールド層７０の矩形の短辺に沿って並べられている。接続孔７３の中心と２つの結合孔７４の中心とは、一直線上にある。 One connection hole 73 and two coupling holes 74 that penetrate the first shield layer 70 in the thickness direction are formed in the vicinity of one short edge portion. The connection hole 73 and the connection hole 74 each have a circular shape. The connection hole 73 is formed in the central portion of the short edge portion. The coupling holes 74 are formed at both ends of the short edge portion. The coupling hole 74 is formed at a corner portion of a rectangle. The connection hole 73 and the connection hole 74 are arranged along the short side of the rectangle of the first shield layer 70. The center of the connecting hole 73 and the center of the two connecting holes 74 are in a straight line.
　第２シールド層８０は、図４に示されるように、矩形薄膜状の形状を有している。第２シールド層８０は、第２絶縁層６０に積層されている。第２シールド層８０は、導電性の材料、たとえば銅またはＳＵＳに代表される金属材料で形成されている。第２シールド層８０は、矩形の長辺を成す一対の長縁部と、矩形の短辺を成す一対の短縁部とを有している。 As shown in FIG. 4, the second shield layer 80 has a rectangular thin film shape. The second shield layer 80 is laminated on the second insulating layer 60. The second shield layer 80 is formed of a conductive material, for example, a metal material represented by copper or SUS. The second shield layer 80 has a pair of long edges that form the long sides of the rectangle and a pair of short edges that form the short sides of the rectangle.
　一対の短縁部の近傍に、第２シールド層８０を厚み方向に貫通する１つの接続孔８３と２つの結合孔８４とが形成されている。接続孔８３と結合孔８４とは、各々円形状を有している。接続孔８３は、短縁部の中央部分に形成されている。結合孔８４は、短縁部の両端部分に形成されている。結合孔８４は、矩形の角部分に形成されている。接続孔８３と結合孔８４とは、第２シールド層８０の矩形の短辺に沿って並べられている。接続孔８３の中心と２つの結合孔８４の中心とは、一直線上にある。 One connection hole 83 and two connection holes 84 that penetrate the second shield layer 80 in the thickness direction are formed in the vicinity of the pair of short edge portions. The connection hole 83 and the connection hole 84 each have a circular shape. The connection hole 83 is formed in the central portion of the short edge portion. The coupling holes 84 are formed at both ends of the short edge portion. The coupling hole 84 is formed at a corner portion of a rectangle. The connection hole 83 and the connection hole 84 are arranged along the short side of the rectangle of the second shield layer 80. The center of the connection hole 83 and the center of the two coupling holes 84 are on a straight line.
　第１カバー層９０は、図４，５に示されるように、矩形薄膜状の形状を有している。第１カバー層９０は、第１シールド層７０に積層されている。第１カバー層９０は、電気絶縁性の材料、たとえばポリイミドに代表される樹脂材料で形成されている。第１カバー層９０は、矩形の長辺を成す一対の長縁部と、矩形の短辺を成す一対の短縁部とを有している。 The first cover layer 90 has a rectangular thin film shape, as shown in FIGS. The first cover layer 90 is laminated on the first shield layer 70. The first cover layer 90 is formed of an electrically insulating material, for example, a resin material typified by polyimide. The 1st cover layer 90 has a pair of long edge parts which make up the long side of a rectangle, and a pair of short edge parts which make up the short side of a rectangle.
　一方の短縁部の近傍に、第１カバー層９０を厚み方向に貫通する１つの接続孔９３と２つの結合孔９４とが形成されている。接続孔９３と結合孔９４とは、各々円形状を有している。接続孔９３は、短縁部の中央部分に形成されている。結合孔９４は、短縁部の両端部分に形成されている。結合孔９４は、矩形の角部分に形成されている。接続孔９３と結合孔９４とは、第１カバー層９０の矩形の短辺に沿って並べられている。接続孔９３の中心と２つの結合孔９４の中心とは、一直線上にある。 One connection hole 93 and two connection holes 94 that penetrate the first cover layer 90 in the thickness direction are formed in the vicinity of one short edge portion. The connection hole 93 and the coupling hole 94 each have a circular shape. The connection hole 93 is formed in the central portion of the short edge portion. The coupling holes 94 are formed at both ends of the short edge portion. The coupling hole 94 is formed at a corner portion of a rectangle. The connection hole 93 and the coupling hole 94 are arranged along the short side of the rectangle of the first cover layer 90. The center of the connecting hole 93 and the center of the two connecting holes 94 are in a straight line.
　第１カバー層９０の接続孔９３は、第１シールド層７０の接続孔７３と同じ直径を有している。第１シールド層７０と第１カバー層９０とが積層された状態で、第１シールド層７０の接続孔７３と第１カバー層９０の接続孔９３とは、同心に配置されている。第１シールド層７０と第１カバー層９０とが積層された状態で、第１シールド層７０の接続孔７３の中心と第１カバー層９０の接続孔９３の中心とが一致している。第１カバー層９０の接続孔９３の全部が、第１シールド層７０の接続孔７３と重なっている。 The connection hole 93 of the first cover layer 90 has the same diameter as the connection hole 73 of the first shield layer 70. In the state where the first shield layer 70 and the first cover layer 90 are laminated, the connection hole 73 of the first shield layer 70 and the connection hole 93 of the first cover layer 90 are arranged concentrically. With the first shield layer 70 and the first cover layer 90 stacked, the center of the connection hole 73 of the first shield layer 70 and the center of the connection hole 93 of the first cover layer 90 are aligned. All of the connection holes 93 of the first cover layer 90 overlap the connection holes 73 of the first shield layer 70.
　接続孔７３，９３は、一対の結合孔７４，９４の間に配置されている。一対の結合孔７４，９４は、接続孔７３，９３を挟んでいる。２つの結合孔７４，９４の各々の中心と接続孔７３，９３の中心との距離が相等しくなるように、２つの結合孔７４，９４と接続孔７３，９３とは第１シールド層７０および第１カバー層９０の矩形の短辺に沿って並べられている。 The connection holes 73 and 93 are arranged between the pair of connection holes 74 and 94. The pair of coupling holes 74 and 94 sandwich the connection holes 73 and 93. The two coupling holes 74, 94 and the connection holes 73, 93 are the first shield layer 70 and so that the distances between the centers of the two coupling holes 74, 94 and the centers of the connection holes 73, 93 are equal to each other. The first cover layers 90 are arranged along the short sides of the rectangle.
　第１シールド層７０と第１カバー層９０とは、片面に導電性粘着剤が付着した銅箔にポリイミドフィルムを貼付し、ポリイミドフィルムおよび銅箔を適宜エッチングしてパターンを形成することにより、作製されてもよい。 The first shield layer 70 and the first cover layer 90 are manufactured by sticking a polyimide film on a copper foil having a conductive adhesive on one side and appropriately etching the polyimide film and the copper foil to form a pattern. May be done.
　第２カバー層１００は、図４，５に示されるように、矩形薄膜状の形状を有している。第２カバー層１００は、第２シールド層８０に積層されている。第２カバー層１００は、電気絶縁性の材料、たとえばポリイミドに代表される樹脂材料で形成されている。第２カバー層１００は、矩形の長辺を成す一対の長縁部と、矩形の短辺を成す一対の短縁部とを有している。 The second cover layer 100 has a rectangular thin film shape as shown in FIGS. The second cover layer 100 is laminated on the second shield layer 80. The second cover layer 100 is made of an electrically insulating material, for example, a resin material typified by polyimide. The second cover layer 100 has a pair of long edges that form the long sides of the rectangle and a pair of short edges that form the short sides of the rectangle.
　一方の短縁部の近傍に、第２カバー層１００を厚み方向に貫通する１つの接続孔１０３と２つの結合孔１０４とが形成されている。接続孔１０３と結合孔１０４とは、各々円形状を有している。接続孔１０３は、短縁部の中央部分に形成されている。結合孔１０４は、短縁部の両端部分に形成されている。結合孔１０４は、矩形の角部分に形成されている。接続孔１０３と結合孔１０４とは、第２カバー層１００の矩形の短辺に沿って並べられている。接続孔１０３の中心と２つの結合孔１０４の中心とは、一直線上にある。 One connection hole 103 and two coupling holes 104 that penetrate the second cover layer 100 in the thickness direction are formed in the vicinity of one short edge portion. The connection hole 103 and the connection hole 104 each have a circular shape. The connection hole 103 is formed in the central portion of the short edge portion. The coupling holes 104 are formed at both ends of the short edge portion. The coupling hole 104 is formed at a corner portion of a rectangle. The connection hole 103 and the coupling hole 104 are arranged along the short side of the rectangle of the second cover layer 100. The center of the connection hole 103 and the center of the two connection holes 104 are in a straight line.
　第２カバー層１００の接続孔１０３は、第２シールド層８０の接続孔８３と同じ直径を有している。第２シールド層８０と第２カバー層１００とが積層された状態で、第２シールド層８０の接続孔８３と第２カバー層１００の接続孔１０３とは、同心に配置されている。第２シールド層８０と第２カバー層１００とが積層された状態で、第２シールド層８０の接続孔８３の中心と第２カバー層１００の接続孔１０３の中心とが一致している。第２カバー層１００の接続孔１０３の全部が、第２シールド層８０の接続孔８３と重なっている。 The connection hole 103 of the second cover layer 100 has the same diameter as the connection hole 83 of the second shield layer 80. In the state where the second shield layer 80 and the second cover layer 100 are laminated, the connection hole 83 of the second shield layer 80 and the connection hole 103 of the second cover layer 100 are arranged concentrically. In the state where the second shield layer 80 and the second cover layer 100 are laminated, the center of the connection hole 83 of the second shield layer 80 and the center of the connection hole 103 of the second cover layer 100 are aligned. The entire connection hole 103 of the second cover layer 100 overlaps the connection hole 83 of the second shield layer 80.
　接続孔８３，１０３は、一対の結合孔８４，１０４の間に配置されている。一対の結合孔８４，１０４は、接続孔８３，１０３を挟んでいる。２つの結合孔８４，１０４の各々の中心と接続孔８３，１０３の中心との距離が相等しくなるように、２つの結合孔８４，１０４と接続孔８３，１０３とは第２シールド層８０および第２カバー層１００の矩形の短辺に沿って並べられている。 The connection holes 83 and 103 are arranged between the pair of connection holes 84 and 104. The pair of coupling holes 84 and 104 sandwich the connection holes 83 and 103. The two coupling holes 84 and 104 and the connection holes 83 and 103 are arranged so that the distance between the center of each of the two coupling holes 84 and 104 and the center of each of the connection holes 83 and 103 becomes equal. The second cover layers 100 are arranged along the short sides of the rectangle.
　第２シールド層８０と第２カバー層１００とは、片面に導電性粘着剤が付着した銅箔にポリイミドフィルムを貼付し、ポリイミドフィルムおよび銅箔を適宜エッチングしてパターンを形成することにより、作製されてもよい。 The second shield layer 80 and the second cover layer 100 are manufactured by attaching a polyimide film to a copper foil having a conductive adhesive on one side thereof and appropriately etching the polyimide film and the copper foil to form a pattern. May be done.
　センサー部１０は、各々が薄膜状の第２カバー層１００、第２シールド層８０、第２絶縁層６０、陰極層４０、有機圧電素子２０、正極層３０、第１絶縁層５０、第１シールド層７０および第１カバー層９０が積層されて、全体として可撓性を有する薄板状に形成されている。 The sensor unit 10 has a thin-film second cover layer 100, a second shield layer 80, a second insulating layer 60, a cathode layer 40, an organic piezoelectric element 20, a positive electrode layer 30, a first insulating layer 50, and a first shield. The layer 70 and the first cover layer 90 are laminated to each other to be formed into a flexible thin plate shape as a whole.
　図１～５に示されるように、振動センサー１はさらに、介在部材１１０と、取付部材１２０と、接続部材１３０と、導線１４０と、ボルト部材１５０とを備えている。 As shown in FIGS. 1 to 5, the vibration sensor 1 further includes an interposition member 110, a mounting member 120, a connecting member 130, a lead wire 140, and a bolt member 150.
　介在部材１１０は、図４，５に示されるように、第２カバー層１００に積層されている。介在部材１１０は、第２カバー層１００の一方の短縁部に積層されている第１部材１１１と、第２カバー層１００の他方の短縁部に積層されている第２部材１１２とを有している。第１部材１１１と第２部材１１２とは、略矩形箱状の外形を有している。 The intervening member 110 is laminated on the second cover layer 100 as shown in FIGS. 4 and 5. The interposition member 110 has a first member 111 laminated on one short edge of the second cover layer 100 and a second member 112 laminated on the other short edge of the second cover layer 100. doing. The first member 111 and the second member 112 have a substantially rectangular box-shaped outer shape.
　図２に示されるように、振動センサー１により振動を計測される振動計測対象物２００に振動センサー１が取り付けられた状態で、介在部材１１０は、振動計測対象物２００とセンサー部１０との間に介在している。第１部材１１１は、振動計測対象物２００と第２カバー層１００との間に介在している。第２部材１１２は、振動計測対象物２００と第２カバー層１００との間に介在している。 As shown in FIG. 2, in a state where the vibration sensor 1 is attached to the vibration measurement target 200 whose vibration is measured by the vibration sensor 1, the interposition member 110 is disposed between the vibration measurement target 200 and the sensor unit 10. Intervenes in. The first member 111 is interposed between the vibration measurement object 200 and the second cover layer 100. The second member 112 is interposed between the vibration measurement object 200 and the second cover layer 100.
　介在部材１１０は、樹脂材料に代表される電気絶縁性の材料で形成されている。介在部材１１０の介在のためセンサー部１０が振動計測対象物２００から離隔して配置されており、また介在部材１１０が電気絶縁性であることから、センサー部１０と振動計測対象物２００との電気的絶縁が保たれている。そのため、振動計測対象物２００からのノイズがセンサー部１０に及ぼす影響が、抑制されている。 The intervening member 110 is made of an electrically insulating material typified by a resin material. Since the sensor unit 10 is arranged away from the vibration measurement object 200 due to the intervention of the intervening member 110 and the intervening member 110 is electrically insulating, the electricity between the sensor unit 10 and the vibration measurement object 200 Electrical insulation is maintained. Therefore, the influence of noise from the vibration measurement object 200 on the sensor unit 10 is suppressed.
　図３～５に示されるように、第１部材１１１には、２つの結合孔１１４と、受け穴１１６とが形成されている。結合孔１１４と受け穴１１６とは、平面視において各々円形状を有している。受け穴１１６は、第１部材１１１の中央部分に形成されている。結合孔１１４は、第１部材１１１の両端部分に形成されている。結合孔１１４と受け穴１１６とは、第１部材１１１の長手方向に沿って並べられている。２つの結合孔１１４の中心と受け穴１１６の中心とは、一直線上にある。 As shown in FIGS. 3 to 5, two coupling holes 114 and a receiving hole 116 are formed in the first member 111. The coupling hole 114 and the receiving hole 116 each have a circular shape in a plan view. The receiving hole 116 is formed in the central portion of the first member 111. The coupling holes 114 are formed at both end portions of the first member 111. The coupling hole 114 and the receiving hole 116 are arranged along the longitudinal direction of the first member 111. The centers of the two coupling holes 114 and the centers of the receiving holes 116 are in a straight line.
　２つの結合孔１１４は、第１部材１１１を厚み方向に貫通している。受け穴１１６は、第１部材１１１の外表面のうちセンサー部１０に対向する対向面が窪んで形成されている。受け穴１１６は有底の穴である。受け穴１１６は第１部材１１１を貫通していない。 The two coupling holes 114 penetrate the first member 111 in the thickness direction. The receiving hole 116 is formed by recessing the facing surface of the outer surface of the first member 111 facing the sensor portion 10. The receiving hole 116 is a bottomed hole. The receiving hole 116 does not penetrate the first member 111.
　取付部材１２０は、導電材料製である。取付部材１２０は、図４，５に示されるように、第１カバー層９０に積層されている。取付部材１２０は、第１カバー層９０に接着されていてもよい。取付部材１２０の内部には、中空の収容空間１２１が形成されている。収容空間１２１の内周面をなす係合面１２２には、雌ねじが形成されている。取付部材１２０には、係合面１２２に開口するとともに取付部材１２０の外表面に開口する接続孔１２３が形成されている。接続孔１２３は、収容空間１２１と取付部材１２０の外部とを連通している。取付部材１２０にはさらに、２つの結合孔１２４が形成されている。 The mounting member 120 is made of a conductive material. The mounting member 120 is laminated on the first cover layer 90 as shown in FIGS. 4 and 5. The attachment member 120 may be adhered to the first cover layer 90. A hollow accommodation space 121 is formed inside the mounting member 120. A female screw is formed on the engaging surface 122 forming the inner peripheral surface of the accommodation space 121. The mounting member 120 is formed with a connection hole 123 that opens to the engaging surface 122 and also opens to the outer surface of the mounting member 120. The connection hole 123 communicates the accommodation space 121 with the outside of the mounting member 120. The mounting member 120 is further formed with two coupling holes 124.
　接続部材１３０は、図２，４に示されるように、芯部１３１と、絶縁筒部１３２と、外鞘部１３３とを有している。芯部１３１は、導電材料製であり、接続部材１３０を貫通している。絶縁筒部１３２は、樹脂に代表される絶縁材料で形成されている。絶縁筒部１３２は、芯部１３１と外鞘部１３３との間に介在しており、芯部１３１と外鞘部１３３とを電気的に絶縁している。 As shown in FIGS. 2 and 4, the connecting member 130 has a core portion 131, an insulating cylinder portion 132, and an outer sheath portion 133. The core portion 131 is made of a conductive material and penetrates the connecting member 130. The insulating tubular portion 132 is made of an insulating material typified by resin. The insulating cylinder portion 132 is interposed between the core portion 131 and the outer sheath portion 133, and electrically insulates the core portion 131 and the outer sheath portion 133.
　外鞘部１３３は、導電材料製である。外鞘部１３３は、係合面１３４を有している。係合面１３４には、雄ねじが形成されている。係合面１３４は、取付部材１２０の係合面１２２に係合している。接続部材１３０は、取付部材１２０にねじ込みにより取り付けられている。接続部材１３０を取付部材１２０に対して回転させることにより、接続部材１３０は取付部材１２０に嵌合している。接続部材１３０が取付部材１２０に取り付けられた状態で、芯部１３１の一端は外部に露出しており、芯部１３１の他端は取付部材１２０の内部の収容空間１２１内に配置されている。 The outer sheath portion 133 is made of a conductive material. The outer sheath portion 133 has an engagement surface 134. A male screw is formed on the engaging surface 134. The engagement surface 134 is engaged with the engagement surface 122 of the mounting member 120. The connecting member 130 is attached to the mounting member 120 by screwing. By rotating the connecting member 130 with respect to the mounting member 120, the connecting member 130 is fitted to the mounting member 120. With the connecting member 130 attached to the mounting member 120, one end of the core portion 131 is exposed to the outside, and the other end of the core portion 131 is arranged in the accommodation space 121 inside the mounting member 120.
　導線１４０は、導電材料製である。図２に示されるように、導線１４０は、一端１４１と他端１４２とを有している。導線１４０の一端１４１は、接続部材１３０に接続されている。より詳細には、一端１４１は、接続部材１３０の芯部１３１に接続されている。一端１４１は、芯部１３１に半田付けにより接続されている。接続部材１３０の芯部１３１と導線１４０の一端１４１との間に、半田付け部が介在している。 The conductor 140 is made of a conductive material. As shown in FIG. 2, the lead wire 140 has one end 141 and the other end 142. One end 141 of the conducting wire 140 is connected to the connecting member 130. More specifically, one end 141 is connected to the core 131 of the connecting member 130. One end 141 is connected to the core 131 by soldering. A soldering portion is interposed between the core portion 131 of the connecting member 130 and the one end 141 of the conducting wire 140.
　導線１４０の他端１４２は、図５に示されるように、正極層３０に接続されている。より詳細には、他端１４２は、正極層３０の接続部３２に接続されている。他端１４２は、接続部３２に半田付けにより接続されている。正極層３０の接続部３２と導線１４０の他端１４２との間に、半田付け部が介在している。接続部材１３０の芯部１３１は、導線１４０を介して、正極層３０と電気的に接続されている。 The other end 142 of the lead wire 140 is connected to the positive electrode layer 30 as shown in FIG. More specifically, the other end 142 is connected to the connecting portion 32 of the positive electrode layer 30. The other end 142 is connected to the connecting portion 32 by soldering. A soldered portion is interposed between the connecting portion 32 of the positive electrode layer 30 and the other end 142 of the conducting wire 140. The core portion 131 of the connecting member 130 is electrically connected to the positive electrode layer 30 via the conducting wire 140.
　図１～３に示す振動センサー１が組み立てられた状態で、導線１４０は、取付部材１２０の収容空間１２１から、取付部材１２０の接続孔１２３およびセンサー部１０を構成する各層の接続孔３３，５３，６３，７３，８３，９３，１０３を貫通して、第１部材１１１の受け穴１１６にまで亘って、配置されている。 In the state where the vibration sensor 1 shown in FIGS. , 63, 73, 83, 93, 103 so as to extend through the receiving hole 116 of the first member 111.
　ボルト部材１５０は、導電材料製である。ボルト部材１５０は、頭部１５１と軸部１５２とを有している。図３に示されるように、ボルト部材１５０は、介在部材１１０と取付部材１２０とをボルト結合している。ボルト部材１５０の軸部１５２は、センサー部１０を貫通して、介在部材１１０の結合孔１１４と取付部材１２０の結合孔１２４との両方に螺合している。ボルト部材１５０を介在部材１１０と取付部材１２０とにねじ込んで取り付けることにより、センサー部１０が介在部材１１０および取付部材１２０によって上下から加締められて、振動センサー１の組立が完了する。 The bolt member 150 is made of a conductive material. The bolt member 150 has a head portion 151 and a shaft portion 152. As shown in FIG. 3, the bolt member 150 bolts the intervening member 110 and the mounting member 120. The shaft portion 152 of the bolt member 150 penetrates the sensor portion 10 and is screwed into both the coupling hole 114 of the intervening member 110 and the coupling hole 124 of the mounting member 120. By screwing and mounting the bolt member 150 on the interposition member 110 and the mounting member 120, the sensor unit 10 is crimped from above and below by the interposition member 110 and the mounting member 120, and the assembly of the vibration sensor 1 is completed.
　図３に示されるように、ボルト部材１５０が介在部材１１０と取付部材１２０とをボルト結合している状態で、頭部１５１の全部が介在部材１１０の結合孔１１４内に配置されている。そのため、振動センサー１を振動計測対象物２００に取り付けるときにボルト部材１５０が取り付けの妨げとなることがない。 As shown in FIG. 3, with the bolt member 150 bolting the interposition member 110 and the mounting member 120 together, the entire head 151 is arranged in the coupling hole 114 of the interposition member 110. Therefore, when the vibration sensor 1 is attached to the vibration measurement object 200, the bolt member 150 does not interfere with the attachment.
　ボルト部材１５０の軸部１５２は、センサー部１０を貫通している。軸部１５２は、センサー部１０を構成する各層の結合孔４４，５４，６４，７４，８４，９４，１０４を貫通している。軸部１５２は、陰極層４０を貫通している。軸部１５２は、陰極層４０に形成された結合孔４４を貫通している。結合孔４４の直径は、軸部１５２の直径以下とされている。軸部１５２が結合孔４４を貫通するとき、結合孔４４の縁部分が軸部１５２に接触する。陰極層４０は、取付部材１２０に結合されているボルト部材１５０を介して、取付部材１２０に電気的に接続されている。接続部材１３０の外鞘部１３３は、取付部材１２０およびボルト部材１５０を介して、陰極層４０に電気的に接続されている。 The shaft portion 152 of the bolt member 150 penetrates the sensor portion 10. The shaft portion 152 penetrates the coupling holes 44, 54, 64, 74, 84, 94, 104 of the layers forming the sensor unit 10. The shaft portion 152 penetrates the cathode layer 40. The shaft portion 152 penetrates the coupling hole 44 formed in the cathode layer 40. The diameter of the coupling hole 44 is set to be equal to or smaller than the diameter of the shaft portion 152. When the shaft portion 152 penetrates the coupling hole 44, the edge portion of the coupling hole 44 contacts the shaft portion 152. The cathode layer 40 is electrically connected to the mounting member 120 via a bolt member 150 that is coupled to the mounting member 120. The outer sheath portion 133 of the connecting member 130 is electrically connected to the cathode layer 40 via the mounting member 120 and the bolt member 150.
　上述した説明と一部重複する部分もあるが、本実施形態の特徴的な構成を列挙すると以下のようになる。実施形態の振動センサー１は、図４，５に示されるように、薄膜状の有機圧電素子２０の第１面２１に正極層３０、第１絶縁層５０および第１シールド層７０が順に積層され、有機圧電素子２０の第２面２３に陰極層４０、第２絶縁層６０および第２シールド層８０が順に積層された、センサー部１０を備えている。図１～３に示されるように、センサー部１０は全体として、柔軟性のある薄板形状に形成されている。 Although there is a part that overlaps with the above description, the characteristic configurations of this embodiment are listed below. In the vibration sensor 1 of the embodiment, as shown in FIGS. 4 and 5, the positive electrode layer 30, the first insulating layer 50, and the first shield layer 70 are sequentially laminated on the first surface 21 of the thin-film organic piezoelectric element 20. The sensor unit 10 is provided with a cathode layer 40, a second insulating layer 60, and a second shield layer 80 laminated in this order on the second surface 23 of the organic piezoelectric element 20. As shown in FIGS. 1 to 3, the sensor unit 10 is formed in a flexible thin plate shape as a whole.
　有機圧電素子２０の薄型形状および柔らかさを活かしてセンサー部１０が薄板形状に成形されており、センサー部１０は曲げ変形可能とされている。これにより、振動センサー１を、曲面を持つ計測対象面にも取り付け可能に構成することができる。振動センサー１が薄型の形状を有しているので、隣り合う機器の間または機器と壁面との間などの、狭隘な空間に振動センサー１を配置することもできる。したがって、実施形態の振動センサー１は、従来の振動センサーを取り付けが困難であった箇所にも取り付けが可能とされており、振動センサー１の汎用性が高められている。 Taking advantage of the thin shape and softness of the organic piezoelectric element 20, the sensor portion 10 is formed into a thin plate shape, and the sensor portion 10 is bendable and deformable. As a result, the vibration sensor 1 can be configured to be attached to the measurement target surface having a curved surface. Since the vibration sensor 1 has a thin shape, the vibration sensor 1 can be arranged in a narrow space such as between adjacent devices or between a device and a wall surface. Therefore, the vibration sensor 1 of the embodiment can be attached to a place where it was difficult to attach the conventional vibration sensor, and the versatility of the vibration sensor 1 is enhanced.
　振動センサー１が軽量化されているので、振動センサー１の自重が振動計測対象物２００の振動に及ぼす影響が低減されており、したがって振動をより精度よく検出することができる。 Since the vibration sensor 1 is lightened, the influence of the own weight of the vibration sensor 1 on the vibration of the vibration measurement target 200 is reduced, and therefore the vibration can be detected more accurately.
　センサー部１０において、正極層３０および陰極層４０が正負の電極を成し、正極層３０に金属材料製の第１シールド層７０が積層され、かつ陰極層４０に金属材料製の第２シールド層８０が積層される構成とすることで、振動センサー１に及ぼすノイズの影響を低減できる。したがって、実施形態の振動センサー１による振動の検出精度を高めることができる。正極層３０と第１シールド層７０との間に第１絶縁層５０が介在することで、正極層３０と第１シールド層７０とを確実に電気的に絶縁することができる。同様に、陰極層４０と第２シールド層８０との間に第２絶縁層６０が介在することで、陰極層４０と第２シールド層８０とを確実に電気的に絶縁することができる。 In the sensor unit 10, the positive electrode layer 30 and the cathode layer 40 form positive and negative electrodes, the first shield layer 70 made of a metal material is laminated on the positive electrode layer 30, and the second shield layer made of a metal material is laminated on the cathode layer 40. By configuring the 80s to be stacked, the influence of noise on the vibration sensor 1 can be reduced. Therefore, the vibration detection accuracy of the vibration sensor 1 of the embodiment can be improved. By interposing the first insulating layer 50 between the positive electrode layer 30 and the first shield layer 70, the positive electrode layer 30 and the first shield layer 70 can be reliably electrically insulated. Similarly, since the second insulating layer 60 is interposed between the cathode layer 40 and the second shield layer 80, the cathode layer 40 and the second shield layer 80 can be reliably electrically insulated.
　また図４，５に示されるように、振動センサー１は、第１シールド層７０に積層された第１カバー層９０と、第２シールド層８０に積層された第２カバー層１００とをさらに備えている。金属材料製の第１シールド層７０および第２シールド層８０に、ポリイミドなどの樹脂材料製の第１カバー層９０および第２カバー層１００をそれぞれ積層して、センサー部１０の最外層を樹脂材料で形成することで、センサー部１０の防錆性および耐薬品性を向上することができる。 Further, as shown in FIGS. 4 and 5, the vibration sensor 1 further includes a first cover layer 90 laminated on the first shield layer 70 and a second cover layer 100 laminated on the second shield layer 80. ing. A first cover layer 90 and a second cover layer 100 made of a resin material such as polyimide are laminated on the first shield layer 70 and the second shield layer 80 made of a metal material, respectively, and the outermost layer of the sensor unit 10 is made of a resin material. By forming the sensor unit 10, the rust resistance and chemical resistance of the sensor unit 10 can be improved.
　また図１～５に示されるように、振動センサー１は、介在部材１１０をさらに備えている。図２に示されるように、介在部材１１０は、センサー部１０の第２カバー層１００と振動計測対象物２００との間に介在している。介在部材１１０を介在させることで、センサー部１０が振動計測対象物２００から離れて配置されている。そのため、センサー部１０と振動計測対象物２００との電気的絶縁を保つことができ、振動計測対象物２００からのノイズが振動センサー１に及ぼす影響を低減することができる。 Further, as shown in FIGS. 1 to 5, the vibration sensor 1 further includes an intervening member 110. As shown in FIG. 2, the interposition member 110 is interposed between the second cover layer 100 of the sensor unit 10 and the vibration measurement object 200. By interposing the intervening member 110, the sensor unit 10 is arranged away from the vibration measurement object 200. Therefore, the electrical insulation between the sensor unit 10 and the vibration measurement object 200 can be maintained, and the influence of noise from the vibration measurement object 200 on the vibration sensor 1 can be reduced.
　介在部材１１０にマグネットプレートを固定して磁力で介在部材１１０を振動計測対象物２００に取り付ける、介在部材１１０と振動計測対象物２００とを両面テープなどの接合テープで貼り付ける、または介在部材１１０を振動計測対象物２００に接着するなどによって、センサー部１０に影響を与えることなく、振動センサー１を振動計測対象物２００に容易に取り付けることができる。 The magnet plate is fixed to the intervening member 110 and the intervening member 110 is magnetically attached to the vibration measurement object 200, the intervening member 110 and the vibration measurement object 200 are attached with a joining tape such as double-sided tape, or the intervening member 110 is attached. The vibration sensor 1 can be easily attached to the vibration measurement target 200 without affecting the sensor unit 10 by adhering it to the vibration measurement target 200.
　また図１～５に示されるように、第１カバー層９０に積層されている取付部材１２０に、正極層３０に電気的に接続する接続部材１３０が取り付けられている。接続部材１３０を介して、振動センサー１による振動計測対象物の振動の検出結果を外部に出力することができる。接続部材１３０の芯部１３１をチャージコンバータに接続するように構成すれば、チャージコンバータで電荷信号を電圧信号に変換して、振動の検出結果を電圧として出力することができる。接続部材１３０として、１０－３２コネクタなどの安価に入手可能な市販品を使用することができ、この場合、振動センサー１の製造コストを低減することができる。 Further, as shown in FIGS. 1 to 5, the connection member 130 electrically connected to the positive electrode layer 30 is attached to the attachment member 120 laminated on the first cover layer 90. The vibration detection result of the vibration measurement object by the vibration sensor 1 can be output to the outside via the connecting member 130. If the core 131 of the connecting member 130 is configured to be connected to the charge converter, the charge signal can be converted into a voltage signal by the charge converter, and the vibration detection result can be output as a voltage. As the connection member 130, a commercially available product such as a 10-32 connector that can be obtained at low cost can be used, and in this case, the manufacturing cost of the vibration sensor 1 can be reduced.
　また接続部材１３０は、取付部材１２０にねじ込みにより取り付けられている。接続部材１３０を回転させる動作だけで接続部材１３０を取付部材１２０に容易に取り付けることができ、特殊工具が必要なく半田付けの必要もないので、振動センサー１の組み立て作業を短縮することができる。 Further, the connecting member 130 is attached to the attachment member 120 by screwing. Since the connecting member 130 can be easily attached to the mounting member 120 only by rotating the connecting member 130, no special tool is required and no soldering is required, so that the assembly work of the vibration sensor 1 can be shortened.
　また図２，５に示されるように、導線１４０の一端１４１は接続部材１３０に電気的に接続されており、導線１４０の他端１４２は正極層３０に接続されている。係る構成により、導線１４０を介して正極層３０と接続部材１３０とを確実に電気的に接続することができる。 Further, as shown in FIGS. 2 and 5, one end 141 of the conductor wire 140 is electrically connected to the connection member 130, and the other end 142 of the conductor wire 140 is connected to the positive electrode layer 30. With such a configuration, the positive electrode layer 30 and the connecting member 130 can be reliably and electrically connected via the lead wire 140.
　また導線１４０の他端１４２は、正極層３０に半田付けにより接続されている。係る構成により、半田付けによって導線１４０を正極層３０に確実に固定でき、導線１４０を介した正極層３０と接続部材１３０との電気的接続を確保することができる。 Further, the other end 142 of the lead wire 140 is connected to the positive electrode layer 30 by soldering. With such a configuration, the conductive wire 140 can be reliably fixed to the positive electrode layer 30 by soldering, and electrical connection between the positive electrode layer 30 and the connection member 130 via the conductive wire 140 can be secured.
　また図３に示されるように、ボルト部材１５０は、介在部材１１０と取付部材１２０とをボルト結合している。ボルト部材１５０を介在部材１１０の結合孔１１４に取り付けてセンサー部１０を貫通させて取付部材１２０の結合孔１２４にねじ込むことにより、振動センサー１を容易に一体に組み立てることができる。 Further, as shown in FIG. 3, the bolt member 150 bolts the intervening member 110 and the mounting member 120. By mounting the bolt member 150 in the coupling hole 114 of the interposition member 110, penetrating the sensor portion 10 and screwing it into the coupling hole 124 of the mounting member 120, the vibration sensor 1 can be easily assembled integrally.
　またボルト部材１５０は、陰極層４０を貫通して配置されており、陰極層４０と接続部材１３０とはボルト部材１５０を介して電気的に接続されている。ボルト部材１５０を用いて振動センサー１をボルト結合するときに、ボルト部材１５０の軸部１５２が陰極層４０に接触することで、ボルト部材１５０を介して陰極層４０と接続部材１３０とが電気的に接続される。陰極層４０と接続部材１３０との電気的接続のための専用の工程を設ける必要がないので、振動センサー１の組み立て作業を短縮でき、生産性を向上することができる。 Further, the bolt member 150 is arranged so as to penetrate the cathode layer 40, and the cathode layer 40 and the connection member 130 are electrically connected via the bolt member 150. When the vibration sensor 1 is bolted using the bolt member 150, the shaft portion 152 of the bolt member 150 comes into contact with the cathode layer 40, so that the cathode layer 40 and the connecting member 130 are electrically connected to each other via the bolt member 150. Connected to. Since it is not necessary to provide a dedicated process for electrically connecting the cathode layer 40 and the connection member 130, the assembly work of the vibration sensor 1 can be shortened and the productivity can be improved.
　以上、実施形態について説明を行なったが、今回開示された実施形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなく、請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 The embodiments have been described above, but the embodiments disclosed this time are to be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description but by the claims, and is intended to include meanings equivalent to the claims and all modifications within the scope.
　本開示に係る振動センサーは、機械または工場などの振動計測対象物に多数の振動センサーを取り付けて、振動計測対象物の振動の傾向を時系列で検証して予知保全に使う用途に、好適に適用され得る。 The vibration sensor according to the present disclosure is suitable for use in predictive maintenance by attaching a large number of vibration sensors to a vibration measurement object such as a machine or a factory and verifying the vibration tendency of the vibration measurement object in chronological order. Can be applied.
　１　振動センサー、１０　センサー部、２０　有機圧電素子、２１　第１面、２３　第２面、３０　正極層、３１，４１　本体部、３２，４２　接続部、３３，５３，６３，７３，８３，９３，１０３，１２３　接続孔、４０　陰極層、４４，５４，６４，７４，８４，９４，１０４，１１４，１２４　結合孔、５０　第１絶縁層、６０　第２絶縁層、７０　第１シールド層、８０　第２シールド層、９０　第１カバー層、１００　第２カバー層、１１０　介在部材、１１１　第１部材、１１２　第２部材、１１６　受け穴、１２０　取付部材、１２１　取付空間、１２２，１３４　係合面、１３０　接続部材、１３１　芯部、１３２　絶縁筒部、１３３　外鞘部、１４０　導線、１４１　一端、１４２　他端、１５０　ボルト部材、１５１　頭部、１５２　軸部、２００　振動計測対象物。 1 Vibration sensor, 10 Sensor part, 20 Organic piezoelectric element, 21 1st surface, 23 2nd surface, 30 Positive electrode layer, 31,41 Main body part, 32,42 Connection part, 33,53,63,73,83,93 , 103, 123 Connection hole, 40 Cathode layer, 44, 54, 64, 74, 84, 94, 104, 114, 124 Bond hole, 50 1st insulation layer, 60 2nd insulation layer, 70 1st shield layer, 80 2nd shield layer, 90 1st cover layer, 100 2nd cover layer, 110 intervening member, 111 1st member, 112 2nd member, 116 receiving hole, 120 mounting member, 121 mounting space, 122, 134 engaging surface, 130 connection member, 131 core part, 132 insulation cylinder part, 133 outer sheath part, 140 lead wire, 141 one end, 142 other end, 150 bolt member, 151 head, 152 shaft part, 200 vibration measurement target.

Claims (9)

  1. 　第１面と、前記第１面の反対側の第２面とを有し、前記第１面に正電荷が偏在し前記第２面に負電荷が偏在するように分極された、薄膜状の有機圧電素子と、
    　前記第１面に積層された、金属材料製の正極層と、
    　前記正極層に積層された、絶縁材料製の第１絶縁層と、
    　前記第１絶縁層に積層された、金属材料製の第１シールド層と、
    　前記第２面に積層された、金属材料製の陰極層と、
    　前記陰極層に積層された、絶縁材料製の第２絶縁層と、
    　前記第２絶縁層に積層された、金属材料製の第２シールド層と、を備える、振動センサー。     A thin film having a first surface and a second surface opposite to the first surface, and polarized so that positive charges are unevenly distributed on the first surface and negative charges are unevenly distributed on the second surface. Organic piezoelectric element and
    A positive electrode layer made of a metal material laminated on the first surface and
    A first insulating layer made of an insulating material laminated on the positive electrode layer and
    A first shield layer made of a metal material laminated on the first insulating layer,
    A cathode layer made of a metal material laminated on the second surface and
    A second insulating layer made of an insulating material laminated on the cathode layer and
    A vibration sensor including a second shield layer made of a metal material laminated on the second insulating layer.
  2. 　前記第１シールド層に積層された、絶縁材料製の第１カバー層と、
    　前記第２シールド層に積層された、絶縁材料製の第２カバー層とをさらに備える、請求項１に記載の振動センサー。     A first cover layer made of an insulating material laminated on the first shield layer,
    The vibration sensor according to claim 1, further comprising a second cover layer made of an insulating material laminated on the second shield layer.
  3. 　前記第２カバー層の周縁部の少なくとも一部に積層され、前記振動センサーにより振動を計測される振動計測対象物に前記振動センサーが取り付けられた状態で前記振動計測対象物と前記第２カバー層との間に介在する、介在部材をさらに備える、請求項２に記載の振動センサー。 The vibration measurement target and the second cover layer are laminated on at least a part of the peripheral portion of the second cover layer, and the vibration sensor is attached to the vibration measurement target whose vibration is measured by the vibration sensor. The vibration sensor according to claim 2, further comprising an intervening member.
  4. 　前記第１カバー層に積層された取付部材と、
    　前記取付部材に取り付けられ、前記正極層に電気的に接続する接続部材を備える、請求項３に記載の振動センサー。     The mounting member laminated on the first cover layer and
    The vibration sensor according to claim 3, further comprising a connecting member that is attached to the mounting member and electrically connected to the positive electrode layer.
  5. 　前記接続部材は、前記取付部材にねじ込みにより取り付けられている、請求項４に記載の振動センサー。 The vibration sensor according to claim 4, wherein the connection member is attached to the attachment member by screwing.
  6. 　前記接続部材に接続される一端と、前記正極層に接続される他端とを有する導線をさらに備える、請求項４または５に記載の振動センサー。 The vibration sensor according to claim 4 or 5, further comprising a conductive wire having one end connected to the connecting member and the other end connected to the positive electrode layer.
  7. 　前記他端は、前記正極層に半田付けにより接続されている、請求項６に記載の振動センサー。 The vibration sensor according to claim 6, wherein the other end is connected to the positive electrode layer by soldering.
  8. 　前記介在部材と前記取付部材とをボルト結合するボルト部材をさらに備える、請求項４～７のいずれか１項に記載の振動センサー。 The vibration sensor according to any one of claims 4 to 7, further comprising a bolt member that bolts the intervening member and the mounting member together.
  9. 　前記ボルト部材は、前記陰極層を貫通して配置されており、
    　前記陰極層と前記接続部材とは、前記ボルト部材を介して電気的に接続されている、請求項８に記載の振動センサー。     The bolt member is arranged so as to penetrate the cathode layer.
    The vibration sensor according to claim 8, wherein the cathode layer and the connecting member are electrically connected via the bolt member.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017183708A1 (en) * 2016-04-22 2017-10-26 日本バルカー工業株式会社 Vibration detecting method, vibration sensor, vibration detecting device, vibration detecting program, and vibration detecting system
JP2018081020A (en) * 2016-11-17 2018-05-24 日本バルカー工業株式会社 Vibration sensor and vibration detection system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017183708A1 (en) * 2016-04-22 2017-10-26 日本バルカー工業株式会社 Vibration detecting method, vibration sensor, vibration detecting device, vibration detecting program, and vibration detecting system
JP2018081020A (en) * 2016-11-17 2018-05-24 日本バルカー工業株式会社 Vibration sensor and vibration detection system

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