WO2020177949A1 - Object positioner device and device manufacturing method - Google Patents

Object positioner device and device manufacturing method Download PDF

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Publication number
WO2020177949A1
WO2020177949A1 PCT/EP2020/051992 EP2020051992W WO2020177949A1 WO 2020177949 A1 WO2020177949 A1 WO 2020177949A1 EP 2020051992 W EP2020051992 W EP 2020051992W WO 2020177949 A1 WO2020177949 A1 WO 2020177949A1
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WO
WIPO (PCT)
Prior art keywords
stage
support
stage support
positioning plane
positioner device
Prior art date
Application number
PCT/EP2020/051992
Other languages
French (fr)
Inventor
Marcel SCHOLTS
Joshua Ruben BOEIJE
Johannes Hendrik Everhardus Aldegonda MUIJDERMAN
Johannes Hubertus Antonius Van De Rijdt
Original Assignee
Asml Netherlands B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands B.V. filed Critical Asml Netherlands B.V.
Priority to CN202080017999.4A priority Critical patent/CN113544587A/en
Publication of WO2020177949A1 publication Critical patent/WO2020177949A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground

Definitions

  • the present invention relates to an object positioner device, a stage support, a lithographic apparatus, an object inspection apparatus, a method for adapting an object positioner device and a device manufacturing method.
  • a lithographic apparatus is a machine constructed to apply a desired pattern onto a substrate.
  • a lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs).
  • a lithographic apparatus may, for example, project a pattern (also often referred to as“design layout” or “design”) of a patterning device (e.g., a mask) onto a layer of radiation-sensitive material (resist) provided on a substrate (e.g., a wafer).
  • An object inspection apparatus is for example suitable for inspecting a pattern which has been applied to an object e.g. to a substrate.
  • a lithographic apparatus may use electromagnetic radiation.
  • the wavelength of this radiation determines the minimum size of features which are patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm and 13.5 nm.
  • a lithographic apparatus which uses extreme ultraviolet (EUV) radiation, having a wavelength within a range of 4 nm to 20 nm, for example 6.7 nm or 13.5 nm, may be used to form smaller features on a substrate than a lithographic apparatus which uses, for example, radiation with a wavelength of 193 nm.
  • EUV extreme ultraviolet
  • a high production rate involves high accelerations of for example substrate supports, patterning device supports, balance masses and/or other, often heavy, objects.
  • a relevant source of undesired loads on the base frame at high production rates can be found in a stage of an object positioner device.
  • the stage for example comprises an object support table and a balance mass, which move relative to each other in a positioner plane.
  • the stage is designed such that the forces in or parallel to the positioning plane balance each other out as much as possible.
  • the centre of gravity of the object support table and the centre of gravity of the balance mass are offset from each other in a direction perpendicular to the positioner plane.
  • the driving forces exerted on the object support table and the reaction forces exerted on the balance mass are typically not applied or generated in the respective centres of gravity.
  • This torque has a detrimental effect on the deformation and the dynamic behaviour of the base frame and components that are attached to the base frame.
  • the invention aims to provide an object positioner device which allows high production rates while maintaining good positioning accuracy.
  • an object positioner device which comprises:
  • a frame support foot which is configured to support the base frame on a support surface
  • stage support comprises:
  • stage support foot which is configured to support the stage support body on a support surface.
  • stage support further comprises a second connector, which connects the stage support body and the base frame to each other.
  • the forces and/or torques which are generated by the stage are guided through the support surface before they reach the base frame.
  • the support surface which is for example a pedestal or a strong, e.g. reinforced, floor, is generally strong and rigid compared to the base frame. This, together with the relatively compliant base frame foot, makes that the influence on the base frame of the forces and/or torques that are generated by the stage at high production rates is reduced.
  • This embodiment has shown to be particularly effective in reducing the effect on the base frame (including components attached to the base frame) of torques that are generated due to the offset of the respective driving forces of a e.g. an object support table and a balance mass in the stage.
  • the second connector adds stability to the stage support body.
  • the frame support foot has a frame support foot stiffness in a direction perpendicular to the positioning plane
  • the stage support foot has a stage support foot stiffness in a direction perpendicular to the positioning plane which is equal to or higher than the frame support foot stiffness
  • the stage support further comprises a second connector, which connects the stage support body and the base frame to each other in a direction perpendicular to the positioning plane.
  • the second connector has a stiffness in a direction perpendicular to the positioning plane which is lower than the stage support foot stiffness in a direction perpendicular to the positioning plane.
  • the second connector adds stability to the stage support body, while at the same time not or at least not significantly compromising the dynamic behaviour of the base frame. A more or less constant pretension force is added due to the relatively low stiffness of the second connector.
  • the stage support further comprises a second connector, which connects the stage support body and the base frame to each other in a direction perpendicular to the positioning plane.
  • the second connector has a stiffness in a direction perpendicular to the positioning plane which is lower than the frame support foot stiffness in a direction perpendicular to the positioning plane.
  • the second connector adds stability to the stage support body, while at the same time not or at least not significantly compromising the dynamic behaviour of the base frame.
  • the stage support further comprises a second connector, which connects the stage support body and the base frame to each other in a direction perpendicular to the positioning plane.
  • the second connector has a stiffness in a direction perpendicular to the positioning plane and a stiffness in a direction parallel to the positioning plane, wherein the stiffness in a direction parallel to the positioning plane is higher than stiffness in a direction perpendicular to the positioning plane.
  • the second connector adds stability to the stage support body, while at the same time not or at least not significantly compromising the dynamic behaviour of the base frame.
  • the stage support further comprises a second connector, which connects the stage support body and the base frame to each other in a direction perpendicular to the positioning plane.
  • the second connector comprises a compliant element and a pre -tensioner, wherein the stiffness of the compliant element in a direction perpendicular to the positioning plane is higher than the stiffness of the pre -tensioner is in a direction perpendicular to the positioning plane, and wherein the pre-tensioner carries a part of the weight of the base frame
  • This embodiment has a positive effect on the stability of the stage in some designs of the object positioner device.
  • the first connector is or comprises a vibration isolator and/or an air mount and/or an air bearing.
  • the object positioner device comprises at least three frame support feet and at least two stage supports.
  • the stage is configured to position an object in an x-direction and in a y-direction which is perpendicular to the x-direction, the x- direction and the y-direction both extending in the positioning plane
  • the object positioner device comprises at least two stage supports, which are arranged in a stage support plane which extends perpendicular to the positioning plane and parallel to either the x-direction or the y-direction.
  • This embodiment is in particular suited to reduce the effect on the base frame of torques that are generated due to the offset of the respective driving forces of e.g. an object support table and a balance mass in the stage.
  • the influence of accelerations of the stage e.g. due to translations in the direction perpendicular to the positioning plane or rotations around one or more axis in the positioning plane, on the base frame and on components mounted on the base frame may be reduced.
  • the stage is configured to position an object in an x-direction and in a y-direction which is perpendicular to the x-direction, the x- direction and the y-direction both extending in the positioning plane, and the base frame is longer in the y-direction than in the x-direction
  • the object positioner device comprises at least two stage supports, which are arranged in a stage support plane which extends perpendicular to the positioning plane and parallel to the x-direction.
  • This embodiment is in particular suited to reduce the effect on the base frame of torques about the y-direction that are generated due to the offset of the respective driving forces of e.g. an object support table and a balance mass in the stage.
  • the influence of accelerations of the stage e.g. due to translations in the z-direction perpendicular to the positioning plane or rotations around the x-axis, on the base frame and on components mounted on the base frame may be reduced.
  • stage support foot is arranged adjacent to the frame support foot, e.g. wherein the distance in a direction parallel to the positioning plane between the stage support foot and the frame support foot is 60 centimeters or less.
  • the base frame comprises a compliant side and a rigid side, wherein the compliant side is arranged opposite to the rigid side, and wherein the stage support foot is arranged at the compliant side of the base frame.
  • the stage comprises an object support table and a balance mass which are moveable relative to each other in or parallel to the positioning plane.
  • an stage support is provided
  • first connector which is connected to the stage support body and connectable to a stage which is configured to position an object, which first connector is configured to provide a connection between the stage support body and the stage in a first direction,
  • a second connector which is connected to the stage support body and connectable to a base frame, which second connector is configured to provide a connection between the stage support body and the base frame,
  • stage support foot which is configured to support the stage support body on a support surface, which stage support foot has a stage support foot stiffness in the first direction
  • the second connector has a stiffness in the first direction which is lower than the frame support foot stiffness in the first direction.
  • This embodiment allows to update an existing apparatus, e.g. an object positioner device, a lithographic apparatus and/or an object inspection apparatus, in order to improve the dynamic behavior of that existing apparatus.
  • an existing apparatus e.g. an object positioner device, a lithographic apparatus and/or an object inspection apparatus
  • the first direction is a direction which is perpendicular to a positioning plane in which the stage is configured to position the object.
  • the first direction is the vertical direction.
  • a lithographic apparatus which comprises an object positioner device according to the invention.
  • a lithographic apparatus which comprises a stage support according to the invention.
  • the lithographic apparatus comprises a projection system and an object positioner device for positioning a substrate relative to the projection system, and the object positioner device is an object positioner device according to the invention.
  • an object inspection apparatus which comprises an object positioner device according to the invention.
  • a method for adapting an object positioner device which method comprises the following steps:
  • This embodiment allows to update an existing apparatus, e.g. an object positioner device, a lithographic apparatus and/or an object inspection apparatus, in order to improve the dynamic behavior of that existing apparatus.
  • an existing apparatus e.g. an object positioner device, a lithographic apparatus and/or an object inspection apparatus
  • the stage support foot is arranged adjacent to a frame support foot of the object positioner device.
  • a method for adapting an object positioner device comprises the following steps:
  • stage support foot on a support surface, which stage support foot has a stage support foot stiffness in a direction perpendicular to the positioning plane, which stage support foot is connected to a stage support body
  • first connector provides a connection between the stage support body and a stage of the object positioner device which stage is configured to position an object in a positioning plane, the connection between the support body and the stage being a connection in a direction perpendicular to the positioning plane,
  • This embodiment allows to update an existing apparatus, e.g. an object positioner device, a lithographic apparatus and/or an object inspection apparatus, in order to improve the dynamic behavior of that existing apparatus.
  • device manufacturing method comprises transferring a pattern from a patterning device onto a substrate, comprising the step of using a lithographic apparatus according to the invention.
  • Figure 1 depicts a schematic overview of a lithographic apparatus
  • Figure 2 depicts a detailed view of a part of the lithographic apparatus of Figure 1 ;
  • Figure 3 schematically depicts a position control system
  • Figure 4 schematically shows an object positioner device as known from the prior art
  • FIG. 5 schematically shows an embodiment of an object positioner device according to the invention
  • Figure 6 schematically shows a further embodiment of the second connector
  • Figure 7 schematically shows an embodiment of the base frame
  • Figure 8 schematically shows an embodiment of a stage support according to the invention.
  • the terms“radiation” and“beam” are used to encompass all types of electromagnetic radiation, including ultraviolet radiation (e.g. with a wavelength of 365, 248, 193, 157 or 126 nm) and EUV (extreme ultra-violet radiation, e.g. having a wavelength in the range of about 5-100 nm).
  • reticle “mask” or“patterning device” as employed in this text may be broadly interpreted as referring to a generic patterning device that can be used to endow an incoming radiation beam with a patterned cross-section, corresponding to a pattern that is to be created in a target portion of the substrate.
  • the term“light valve” can also be used in this context. Besides the classic mask
  • Examples of other such patterning devices include a programmable mirror array and a programmable FCD array.
  • FIG. 1 schematically depicts a lithographic apparatus FA.
  • the lithographic apparatus FA includes an illumination system (also referred to as illuminator) IF configured to condition a radiation beam B (e.g., UV radiation, DUV radiation or EUV radiation), a mask support (e.g., a mask table) MT constructed to support a patterning device (e.g., a mask) MA and connected to a first positioner PM configured to accurately position the patterning device MA in accordance with certain parameters, a substrate support (e.g., a wafer table) WT constructed to hold a substrate (e.g., a resist coated wafer) W and connected to a second positioner PW configured to accurately position the substrate support in accordance with certain parameters, and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g., comprising one or more dies) of the substrate W.
  • the illumination system IL receives a radiation beam from a radiation source SO, e.g. via a beam delivery system BD.
  • the illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and/or other types of optical components, or any combination thereof, for directing, shaping, and/or controlling radiation.
  • the illuminator IL may be used to condition the radiation beam B to have a desired spatial and angular intensity distribution in its cross section at a plane of the patterning device MA.
  • projection system PS used herein should be broadly interpreted as encompassing various types of projection system, including refractive, reflective, catadioptric, anamorphic, magnetic, electromagnetic and/or electrostatic optical systems, or any combination thereof, as appropriate for the exposure radiation being used, and/or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term“projection lens” herein may be considered as synonymous with the more general term“projection system” PS.
  • the lithographic apparatus LA may be of a type wherein at least a portion of the substrate may be covered by a liquid having a relatively high refractive index, e.g., water, so as to fill a space between the projection system PS and the substrate W - which is also referred to as immersion lithography. More information on immersion techniques is given in US6952253, which is incorporated herein by reference.
  • the lithographic apparatus LA may also be of a type having two or more substrate supports WT (also named“dual stage”).
  • the substrate supports WT may be used in parallel, and/or steps in preparation of a subsequent exposure of the substrate W may be carried out on the substrate W located on one of the substrate support WT while another substrate W on the other substrate support WT is being used for exposing a pattern on the other substrate W.
  • the lithographic apparatus LA may comprise a measurement stage.
  • the measurement stage is arranged to hold a sensor and/or a cleaning device.
  • the sensor may be arranged to measure a property of the projection system PS or a property of the radiation beam B.
  • the measurement stage may hold multiple sensors.
  • the cleaning device may be arranged to clean part of the lithographic apparatus, for example a part of the projection system PS or a part of a system that provides the immersion liquid.
  • the measurement stage may move beneath the projection system PS when the substrate support WT is away from the projection system PS.
  • the radiation beam B is incident on the patterning device, e.g.
  • the mask, MA which is held on the mask support MT, and is patterned by the pattern (design layout) present on patterning device MA.
  • the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of the substrate W.
  • the substrate support WT can be moved accurately, e.g., so as to position different target portions C in the path of the radiation beam B at a focused and aligned position.
  • the first positioner PM and possibly another position sensor may be used to accurately position the patterning device MA with respect to the path of the radiation beam B.
  • Patterning device MA and substrate W may be aligned using mask alignment marks Ml, M2 and substrate alignment marks PI, P2. Although the substrate alignment marks PI, P2 as illustrated occupy dedicated target portions, they may be located in spaces between target portions. Substrate alignment marks PI, P2 are known as scribe-lane alignment marks when these are located between the target portions C.
  • a Cartesian coordinate system is used.
  • the Cartesian coordinate system has three axis, i.e., an x-axis, a y-axis and a z-axis. Each of the three axis is orthogonal to the other two axis.
  • a rotation around the x-axis is referred to as an Rx-rotation.
  • a rotation around the y-axis is referred to as an Ry-rotation.
  • a rotation around about the z-axis is referred to as an Rz -rotation.
  • the x- axis and the y-axis define a horizontal plane, whereas the z-axis is in a vertical direction.
  • Cartesian coordinate system is not limiting the invention and is used for clarification only. Instead, another coordinate system, such as a cylindrical coordinate system, may be used to clarify the invention.
  • the orientation of the Cartesian coordinate system may be different, for example, such that the z-axis has a component along the horizontal plane.
  • FIG. 2 shows a more detailed view of a part of the lithographic apparatus LA of Figure 1.
  • the lithographic apparatus LA may be provided with a base frame BF, a balance mass BM, a metrology frame MF and a vibration isolation system IS.
  • the metrology frame MF supports the projection system PS. Additionally, the metrology frame MF may support a part of the position measurement system PMS.
  • the metrology frame MF is supported by the base frame BF via the vibration isolation system IS.
  • the vibration isolation system IS is arranged to prevent or reduce vibrations from propagating from the base frame BF to the metrology frame MF.
  • the second positioner PW is arranged to accelerate the substrate support WT by providing a driving force between the substrate support WT and the balance mass BM.
  • the driving force accelerates the substrate support WT in a desired direction. Due to the conservation of momentum, the driving force is also applied to the balance mass BM with equal magnitude, but at a direction opposite to the desired direction.
  • the mass of the balance mass BM is significantly larger than the masses of the moving part of the second positioner PW and the substrate support WT.
  • the driving forces of the substrate support WT and the balance mass BM generally compensate each other in the plane of movement of the substrate support or a plane parallel to the plane of movement of the substrate support WT.
  • the centre of gravity of the substrate support WT and the centre of gravity of the balance mass BM are offset from each other in a direction perpendicular to the plane of movement of the substrate support WT.
  • the driving forces exerted on the substrate support WT and the reaction forces exerted on the balance mass BM are typically not applied or generated in the respective centres of gravity.
  • the second positioner PW is supported by the balance mass BM.
  • the second positioner PW comprises a planar motor to levitate the substrate support WT above the balance mass BM.
  • the second positioner PW is supported by the base frame BF.
  • the second positioner PW comprises a linear motor and wherein the second positioner PW comprises a bearing, like a gas bearing, to levitate the substrate support WT above the base frame BF.
  • the base frame BF is arranged on a support surface PED, for example a pedestal.
  • the support surface PED is generally strong and rigid in order to provide a stable mounting surface for the lithographic apparatus.
  • the base frame BS is supported onto the support surface by one or more frame support feet BFF.
  • the position measurement system PMS may comprise any type of sensor that is suitable to determine a position of the substrate support WT.
  • the position measurement system PMS may comprise any type of sensor that is suitable to determine a position of the mask support MT.
  • the sensor may be an optical sensor such as an interferometer or an encoder.
  • the position measurement system PMS may comprise a combined system of an interferometer and an encoder.
  • the sensor may be another type of sensor, such as a magnetic sensor a capacitive sensor or an inductive sensor.
  • the position measurement system PMS may determine the position relative to a reference, for example the metrology frame MF or the projection system PS.
  • the position measurement system PMS may determine the position of the substrate table WT and/or the mask support MT by measuring the position or by measuring a time derivative of the position, such as velocity or acceleration.
  • the position measurement system PMS may comprise an encoder system.
  • An encoder system is known from for example, United States patent application US2007/0058173A1, filed on September 7, 2006, hereby incorporated by reference.
  • the encoder system comprises an encoder head, a grating and a sensor.
  • the encoder system may receive a primary radiation beam and a secondary radiation beam. Both the primary radiation beam as well as the secondary radiation beam originate from the same radiation beam, i.e., the original radiation beam. At least one of the primary radiation beam and the secondary radiation beam is created by diffracting the original radiation beam with the grating.
  • the encoder system optically combines the primary radiation beam and the secondary radiation beam into a combined radiation beam.
  • a sensor in the encoder head determines a phase or phase difference of the combined radiation beam.
  • the sensor generates a signal based on the phase or phase difference.
  • the signal is representative of a position of the encoder head relative to the grating.
  • One of the encoder head and the grating may be arranged on the substrate structure WT.
  • the other of the encoder head and the grating may be arranged on the metrology frame MF or the base frame BF.
  • a plurality of encoder heads are arranged on the metrology frame MF, whereas a grating is arranged on a top surface of the substrate support WT.
  • a grating is arranged on a bottom surface of the substrate support WT, and an encoder head is arranged below the substrate support WT.
  • the position measurement system PMS may comprise an interferometer system.
  • An interferometer system is known from, for example, United States patent US6,020,964, filed on July 13, 1998, hereby incorporated by reference.
  • the interferometer system may comprise a beam splitter, a mirror, a reference mirror and a sensor.
  • a beam of radiation is split by the beam splitter into a reference beam and a measurement beam.
  • the measurement beam propagates to the mirror and is reflected by the mirror back to the beam splitter.
  • the reference beam propagates to the reference mirror and is reflected by the reference mirror back to the beam splitter.
  • the measurement beam and the reference beam are combined into a combined radiation beam.
  • the combined radiation beam is incident on the sensor.
  • the sensor determines a phase or a frequency of the combined radiation beam.
  • the sensor generates a signal based on the phase or the frequency.
  • the signal is representative of a displacement of the mirror.
  • the mirror is connected to the substrate support WT.
  • the reference mirror may be connected to the metrology frame MF.
  • the measurement beam and the reference beam are combined into a combined radiation beam by an additional optical component instead of the beam splitter.
  • the first positioner PM may comprise a long-stroke module and a short-stroke module.
  • the short-stroke module is arranged to move the mask support MT relative to the long-stroke module with a high accuracy over a small range of movement.
  • the long-stroke module is arranged to move the short- stroke module relative to the projection system PS with a relatively low accuracy over a large range of movement.
  • the first positioner PM is able to move the mask support MT relative to the projection system PS with a high accuracy over a large range of movement.
  • the second positioner PW may comprise a long- stroke module and a short-stroke module.
  • the short-stroke module is arranged to move the substrate support WT relative to the long-stroke module with a high accuracy over a small range of movement.
  • the long-stroke module is arranged to move the short-stroke module relative to the projection system PS with a relatively low accuracy over a large range of movement.
  • the second positioner PW is able to move the substrate support WT relative to the projection system PS with a high accuracy over a large range of movement.
  • the first positioner PM and the second positioner PW each are provided with an actuator to move respectively the mask support MT and the substrate support WT.
  • the actuator may be a linear actuator to provide a driving force along a single axis, for example the y-axis. Multiple linear actuators may be applied to provide driving forces along multiple axis.
  • the actuator may be a planar actuator to provide a driving force along multiple axis. For example, the planar actuator may be arranged to move the substrate support WT in 6 degrees of freedom.
  • the actuator may be an electro-magnetic actuator comprising at least one coil and at least one magnet. The actuator is arranged to move the at least one coil relative to the at least one magnet by applying an electrical current to the at least one coil.
  • the actuator may be a moving-magnet type actuator, which has the at least one magnet coupled to the substrate support WT respectively to the mask support MT.
  • the actuator may be a moving-coil type actuator which has the at least one coil coupled to the substrate support WT respectively to the mask support MT.
  • the actuator may be a voice-coil actuator, a reluctance actuator, a Lorentz-actuator or a piezo-actuator, or any other suitable actuator.
  • the lithographic apparatus LA comprises a position control system PCS as schematically depicted in Figure 3.
  • the position control system PCS comprises a setpoint generator SP, a feedforward controller FF and a feedback controller FB.
  • the position control system PCS provides a drive signal to the actuator ACT.
  • the actuator ACT may be the actuator of the first positioner PM or the second positioner PW.
  • the actuator ACT drives the plant P, which may comprise the substrate support WT or the mask support MT.
  • An output of the plant P is a position quantity such as position or velocity or acceleration.
  • the position quantity is measured with the position measurement system PMS.
  • the position measurement system PMS generates a signal, which is a position signal representative of the position quantity of the plant P.
  • the setpoint generator SP generates a signal, which is a reference signal representative of a desired position quantity of the plant P.
  • the reference signal represents a desired trajectory of the substrate support WT.
  • a difference between the reference signal and the position signal forms an input for the feedback controller FB.
  • the feedback controller FB Based on the input, the feedback controller FB provides at least part of the drive signal for the actuator ACT.
  • the reference signal may form an input for the feedforward controller FF.
  • the feedforward controller FF provides at least part of the drive signal for the actuator ACT.
  • the feedforward FF may make use of information about dynamical characteristics of the plant P, such as mass, stiffness, resonance modes and eigenfrequencies.
  • Figure 4 shows an object positioner device 1 as known from the prior art.
  • the object positioner device 1 comprises a stage 10 and a base frame BF.
  • the stage comprises an object support table WT and a balance mass BM.
  • the object support table WT is configured for positioning an object, e.g. a substrate.
  • the substrate can for example be a wafer.
  • the object support table is for example a substrate support or wafer table.
  • the object support table WT is moveable in a positioning plane. If the object is a substrate, the object support table WT is movable in the plane of the substrate, e.g. in an x-y-plane and/or in a horizontal plane. In this case, the plane of the substrate is the positioning plane.
  • a second positioner PW (not shown in figure 4, but similar to figure 2) may be provided for positioning the object support table WT.
  • the stage comprises two object support tables WT.
  • the second positioner PW may comprise a long-stroke module and a short-stroke module.
  • the short-stroke module is arranged to move the object support table WT relative to the long-stroke module with a high accuracy over a small range of movement.
  • the long-stroke module is arranged to move the short-stroke module in or parallel to the positioning plane with a relatively low accuracy over a large range of movement. With the combination of the long-stroke module and the short-stroke module, the second positioner PW is able to move the substrate support WT in or parallel to the positioning plane with a high accuracy.
  • the stage 10 further comprises a balance mass BM.
  • the balance mass is moved in a direction opposite to the direction of movement of the object support table WT.
  • the stage 10 is mounted onto the base frame BF through first connectors 21.
  • a first connector 21 is or comprises for example an air mount, an air bearing and/or a vibration isolator.
  • the base frame BF is mounted onto a support surface PED.
  • the base frame BF is supported by frame support feet BFF which are arranged between the support surface PED and the base frame BF.
  • the first connector 21 engages the base frame BF at a stage support portion SSP.
  • the object support table WT has a centre of gravity WT-COG.
  • the balance mass has a centre of gravity BM-COG.
  • the centre of gravity WT-COG of the object support table WT and the centre of gravity BM-COG of the balance mass BM are offset from each other in a direction perpendicular to the positioning plane.
  • the driving forces exerted on the object support table WT and the reaction forces exerted on the balance mass BM are typically not applied or generated in the respective centres of gravity.
  • the driving force on the object support table WT is applied between the centre of gravity and the lower edge of the object support table WT, or even at the lower edge of the object support table WT.
  • the driving force on the balance mass BM is for example applied between the centre of gravity and the top edge of the balance mass BM, or even at the top edge of the balance mass BM. So, there is also an offset in the direction perpendicular to the positioning plane between the driving force on the object support table WT and the driving force on the balance mass BM. These offsets together make that these driving forces generate a torque T.
  • the torque T is transferred directly to the base frame BF via the first connectors 21.
  • the torque T excites the base frame BF, which has a negative impact on the dynamic behavior of the base frame BF and on components attached to the base frame.
  • the object positioner device 1 of figure 4 can be used in for example a lithographic apparatus or in an object inspection apparatus.
  • several other important components of the apparatus are mounted onto the base frame, such as sensors, a wafer handler, and/or a reticle handler. Deformation and vibrations of the base frame BF may have a negative impact on the performance and/or life span of such components.
  • Figure 5 shows an embodiment of an object positioner device 1 according to the invention.
  • the object positioner device 1 comprises a stage 10 and a base frame BF.
  • the stage comprises an object support table WT and a balance mass BM.
  • the object support table WT is configured for positioning an object, e.g. a substrate.
  • the substrate can for example be a wafer.
  • the object support table is for example a substrate support or wafer table.
  • the object support table WT is moveable in a positioning plane. If the object is a substrate, the object support table WT is movable in the plane of the substrate, e.g. in an x-y-plane and/or in a horizontal plane. In this case, the plane of the substrate is the positioning plane.
  • a second positioner PW (not shown in figure 5, but similar to figure 2) may be provided for positioning the object support table WT.
  • the second positioner PW optionally comprises a long-stroke module and a short-stroke module.
  • the short-stroke module is arranged to move the object support table WT relative to the long- stroke module with a high accuracy over a small range of movement.
  • the long-stroke module is arranged to move the short-stroke module in or parallel to the positioning plane with a relatively low accuracy over a large range of movement. With the combination of the long-stroke module and the short-stroke module, the second positioner PW is able to move the substrate support WT in or parallel to the positioning plane with a high accuracy.
  • the stage 10 further comprises a balance mass BM.
  • the balance mass is movable in a direction opposite to the direction of movement of the object support table WT, in particular in a plane parallel to the positioning plane.
  • the base frame BF is mounted onto a support surface PED, which is for example a pedestal or a factory floor, e.g. a reinforced factory floor. If a pedestal is used, this pedestal may be arranged on a factory floor.
  • the base frame BF is supported by frame support feet BFF which are arranged between the support surface PED and the base frame BF. For example, one, two, three, four or six frame support feet BFF may be provided.
  • a frame support foot is configured to support the base frame BF on a support surface PED.
  • Each frame support foot BFF has a frame support foot stiffness in a direction perpendicular to the positioning plane. In the embodiment of figure 5, this is the z-direction.
  • the z-direction is for example the vertical direction.
  • the object positioner device 1 is further provided with two stage supports 20. Any other number of stage supports 20 is possible.
  • Each stage support 20 comprises a stage support body 22, a first connector 21 and a stage support foot 24.
  • a second connector 23 is provided.
  • the first connector 21 connects the stage 10 and the stage support body 22 to each other in a direction perpendicular to the positioning plane, which direction in the embodiment of figure 5 is the z- direction.
  • the first connector 21 may have two opposite ends, one being connected to the balance mass BM of the stage 10 and the other one being connected to the stage support body 22.
  • the first connector 21 is or comprises a vibration isolator and/or an air mount and/or an air bearing.
  • the first connector 21 also connects the stage 10 and the stage support body 22 in at least one direction in a plane parallel to the positioning plane.
  • the stage support foot 24 is configured to support the stage support body 22 on the support surface PED.
  • the stage support foot 24 has a stage support foot stiffness in a direction perpendicular to the positioning plane. This direction is for example the z-direction, e.g. the vertical direction.
  • the stage support foot stiffness optionally is equal to or higher than the frame support foot stiffness.
  • the direction of the stage support foot stiffness is the same as the direction of the frame support foot stiffness.
  • the stage support foot 24 may be provided with damping material, such as viscoelastic damping material.
  • damping material such as viscoelastic damping material.
  • the temperature of the damping material is kept at a constant temperature, e.g. 20° Celsius by using e.g. a cooling fluid. This is advantageous as the stiffness characteristics of the damping material might change if the temperature of the damping material changes.
  • the damping material is applied in such a way that it is loaded under shear stress. This is advantageous as under such conditions the damping material can provide improved damping characteristics.
  • the stage support foot stiffness is between 3 and 10 times higher than the frame support foot stiffness. In an embodiment, the stage support foot stiffness is between 4 and 7 times higher than the frame support foot stiffness. Optionally, the stage support foot stiffness is between 5 and 6 times higher than the frame support foot stiffness.
  • the stage support foot stiffness is between 0.6xl0 9 N/m and 1.5xl0 9 N/m.
  • the frame support foot stiffness is between 0.8x10 s N/m and 5xl0 8 N/m.
  • the forces and/or torques which are generated by the stage 10 are guided through the support surface PED before they reach the base frame BF.
  • the support surface PED which is for example a pedestal or a strong, e.g. reinforced, floor, is generally strong and rigid compared to the base frame BF.
  • This embodiment has shown to be particularly effective in reducing the effect on the base frame BF of torques that are generated due to the offset of the respective driving forces on the object support table WT and the balance mass BM, which driving forces are exerted in or parallel to the positioning plane.
  • any detrimental influence from forces and/or torques in other directions on the base frame and/or on components mounted on the base frame may be reduced as well.
  • the stage support 20 further comprises a second connector 23.
  • the second connector 23 connects the stage support body 22 and the base frame BF to each other, for example in a direction perpendicular to the positioning plane, so in this embodiment in the z-direction.
  • the z-direction is for example the vertical direction.
  • the second connector 23 optionally has a stiffness in a direction perpendicular to the positioning plane (e.g. z-direction, e.g. vertical direction) which is lower than the stage support foot stiffness in a direction perpendicular to the positioning plane (e.g. z-direction, e.g. vertical direction).
  • This stiffness of the second connector 23 is the stiffness in the same direction as the stage support foot stiffness.
  • the second connector 23 may be provided with damping such as viscoelastic damping.
  • the second connector 23 connects the stage support body 22 and the base frame BF to each other in a direction parallel to the positioning plane.
  • the stiffness of the second connector 23 in the direction perpendicular to the positioning plane optionally is lower than the frame support foot stiffness in the direction perpendicular to the positioning plane.
  • the second connector 23 optionally has a stiffness in the direction perpendicular to the positioning plane and a stiffness in a direction parallel to the positioning plane.
  • the stiffness in the direction parallel to the positioning plane is higher than stiffness in the direction perpendicular to the positioning plane.
  • the stiffness of the second connector 23 in the direction perpendicular to the positioning plane is between 0.8xl0 7 N/m and 5xl0 7 N/m.
  • FIG. 6 shows a further embodiment of the second connector 23.
  • the second connector 23 comprises a compliant element 25 and a pre-tensioner 26.
  • the stiffness of the compliant element 25 in a direction perpendicular to the positioning plane is higher than the stiffness of the pre-tensioner 26 is in a direction perpendicular to the positioning plane.
  • the pre -tensioner 26 is preloaded with a biasing force in the direction perpendicular to the positioning plane (which is e.g. the z- direction, which is for example the vertical direction). This improves the stability of the stage 10.
  • the pre- loading can for example be achieved by making that the pre -tensioner 26 carries a part of the weight of the base frame BF.
  • the stiffness of the compliant element 25 in a direction perpendicular to the positioning plane is higher than the stiffness of the pre-tensioner 26 is in a direction perpendicular to the positioning plane, such that the pre -tensioner 26 does not dominate the dynamic behavior of the stage support.
  • Figure 7 shows an embodiment of the base frame BF.
  • the stage 10 is not shown for reasons of clarity.
  • the positioning plane is the x-y-plane.
  • the object positioner device comprises at least three frame support feet and at least two stage supports. More specifically, in this embodiment there are four frame support feet BFF and three stage supports 20.
  • the base frame BF comprises a compliant side BFC and a rigid side BFR.
  • the compliant side BFC is arranged opposite to the rigid side BFR.
  • the compliant side BFC is sometimes also referred to as the“leaf spring side”.
  • the compliant side BFC has a lower stiffness, e.g. in the y-direction, than the rigid side BFR, for example in order to avoid tension building up in the base frame BF.
  • the stage is configured to position an object (e.g. a substrate, e.g. a wafer) in an x-direction and in a y-direction which is perpendicular to the x-direction.
  • the x-direction and the y-direction are both extending in the positioning plane.
  • This set up causes torques to be generated by the offset in the z-direction of the respective centres of gravity of the object support table WT and the balance mass BM. These generated torques are directed around the x-axis and around the y-axis.
  • the object positioner device comprises at least two stage supports 20 which are arranged in a stage support plane which extends perpendicular to the positioning plane and parallel to either the x-direction or the y-direction.
  • the two stage supports 20 are arranged on the compliant side BFC of the base frame BF, in the z-x -plane.
  • the base frame BF is longer in the y-direction than in the x- direction.
  • the torques generated by the offset in the z-direction of the respective driving forces of the object support table WT and the balance mass BM which are directed around the y-axis are the most prominent.
  • one or more additional stage supports 20 are arranged at the rigid side BFR of the base frame BF.
  • Such additional stage supports are optionally designed and/or arranged in such a way that they mainly counteract torques or forces in other directions than the generated torque around the y-axis.
  • At least one stage support foot is arranged adjacent to a frame support.
  • the distance in a direction parallel to the positioning plane between the stage support foot and the frame support foot is 60 centimeters or less, e.g. between 20 and 45 centimeters.
  • FIG. 8 shows an embodiment of a stage support 20 according to the invention.
  • the stage support comprises a stage support body 22, a first connector 21, a second connector 23 and a stage support foot 24.
  • the first connector 21 is connected to the stage support body 22 and connectable to a stage which is configured to position an object.
  • the first connector 21 is configured to provide a connection between the stage support body 22 and the stage in a first direction, e.g. the z-direction, e.g. the vertical direction.
  • the first connector 21 is or comprises for example a vibration isolator and/or an air mount and/or an air bearing.
  • the second connector 23 is connected to the stage support body 22 and connectable to a base frame.
  • the second connector 23 is configured to provide a connection between the stage support body 22 and the base frame, for example in the first direction.
  • the first direction is for example the z-direction, e.g. the vertical direction.
  • the second connector 23 is configured to provide a connection between stage support body 22 and the base frame BF in a direction parallel to the positioning plane.
  • the stage support foot 24 is configured to support the stage support body 22 on a support surface.
  • the stage support foot 24 has a stage support foot stiffness in the first direction.
  • the second connector 23 has a stiffness in the first direction which is lower than the frame support foot stiffness in the first direction.
  • the second connector 23 and/or the stage support foot 24 may be provided with damping material, such as viscoelastic damping material.
  • the temperature of the damping material is kept at a constant temperature, e.g. 20° Celsius by using e.g. a cooling fluid. This is advantageous as the stiffness characteristics of the damping material might change if the temperature of the damping material changes.
  • the damping material is applied in such a way that it is loaded under shear stress. This is advantageous as under such conditions the damping material can provide improved damping characteristics.
  • the stage support 20 can be used to update and/or upgrade an existing apparatus, e.g. an existing lithographic apparatus, an existing object inspection apparatus or an existing object positioner device.
  • an existing apparatus e.g. an existing lithographic apparatus, an existing object inspection apparatus or an existing object positioner device.
  • the stage support 20 is for example arranged adjacent to an existing frame support foot of the apparatus which is updated and/or upgraded.
  • the stage support 20 can for example be used for adapting an object positioner device. This can for example be carried out by the following steps:
  • the stage support foot is arranged adjacent to a frame support foot of the object positioner device.
  • stage support 20 can be used to adapt an object positioner using the following steps:
  • stage support foot 24 on a support surface PED, which stage support foot 24 has a stage support foot stiffness in a direction perpendicular to the positioning plane, which stage support foot 24 is connected to a stage support body 22,
  • first connector 21 provides a connection between the stage support body 22 and a stage 10 of the object positioner device which stage 10 is configured to position an object in a positioning plane, the connection between the support body 22 and the stage 10 being a connection in a direction perpendicular to the positioning plane,
  • a second connector 23 which has a stiffness in a direction perpendicular to the positioning plane which is lower than the frame support foot stiffness in a direction perpendicular to the positioning plane, to the stage support body 22 and to the base frame BF of the object positioner device, thereby providing a connection between the stage support body 22 and the base frame BF, for example in a direction perpendicular to the positioning plane and/or parallel to the positioning plane.
  • the stage support portion SSP may for example be separated from the base frame BF by cutting, e.g. by laser cutting or water jet cutting.
  • the first connector 21 which provides the connection between the stage 10 and the stage support body 22 is for example the first connector which was already present in the apparatus that is adapted, or alternatively may be a first connector of the stage support 20 that is used to adapted the apparatus.
  • Embodiments of the invention may form part of a mask inspection apparatus, a metrology apparatus, or any apparatus that measures or processes an object such as a wafer (or other substrate) or mask (or other patterning device).
  • lithographic tools Such a lithographic tool may use vacuum conditions or ambient (non-vacuum) conditions.
  • embodiments of the invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented as instructions stored on a machine -readable medium, which may be read and executed by one or more processors.
  • a machine-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing device).
  • a machine-readable medium may include read only memory (ROM); random access memory (RAM); magnetic storage media; optical storage media; flash memory devices; electrical, optical, acoustical or other forms of propagated signals (e.g. carrier waves, infrared signals, digital signals, etc.), and others.
  • firmware, software, routines, instructions may be described herein as performing certain actions.

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Abstract

The invention provides an object positioning device (1) which comprises a stage (10) configured to position an object in a positioning plane, a base frame (BF), a frame support foot (BFF) configured to support the base frame on a support surface (RED), and a stage support (20). The stage support comprises a stage support body (22), a first connector (21) connecting the stage and the stage support body to each other in a direction perpendicular to the positioning plane, and a stage support foot (24) configured to support the stage support body on the support surface. The stage support further comprises a second connector (23) which connects the stage support body and the base frame to each other.

Description

OBJECT POSITIONER DEVICE AND DEVICE MANUFACTURING METHOD
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The application claims priority of EP application 19160192.1 which was filed on March 01, 2019 which is incorporated herein in its entirely by reference.
FIELD
[0002] The present invention relates to an object positioner device, a stage support, a lithographic apparatus, an object inspection apparatus, a method for adapting an object positioner device and a device manufacturing method.
BACKGROUND
[0003] A lithographic apparatus is a machine constructed to apply a desired pattern onto a substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus may, for example, project a pattern (also often referred to as“design layout” or “design”) of a patterning device (e.g., a mask) onto a layer of radiation-sensitive material (resist) provided on a substrate (e.g., a wafer). An object inspection apparatus is for example suitable for inspecting a pattern which has been applied to an object e.g. to a substrate.
[0004] As semiconductor manufacturing processes continue to advance, the dimensions of circuit elements have continually been reduced while the amount of functional elements, such as transistors, per device has been steadily increasing over decades, following a trend commonly referred to as‘Moore’s law’. To keep up with Moore’s law the semiconductor industry is chasing technologies that enable to create increasingly smaller features. To project a pattern on a substrate a lithographic apparatus may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of features which are patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm and 13.5 nm. A lithographic apparatus, which uses extreme ultraviolet (EUV) radiation, having a wavelength within a range of 4 nm to 20 nm, for example 6.7 nm or 13.5 nm, may be used to form smaller features on a substrate than a lithographic apparatus which uses, for example, radiation with a wavelength of 193 nm.
[0005] In lithographic processes, it is of the utmost importance that the pattern that is projected on the substrate is highly accurate. In addition, a high production rate is also desired. A high production rate involves high accelerations of for example substrate supports, patterning device supports, balance masses and/or other, often heavy, objects.
[0006] These high accelerations tend to cause significant forces, and therewith deformations and vibrations of for example a base frame of an object positioner device. This is undesirable, as many components (including for example sensors, a wafer handler, and/or a reticle handler) are attached to the base frame. This way, the high accelerations of e.g. a substrate support also influence the performance of other components in a negative way.
[0007] A relevant source of undesired loads on the base frame at high production rates can be found in a stage of an object positioner device. The stage for example comprises an object support table and a balance mass, which move relative to each other in a positioner plane. The stage is designed such that the forces in or parallel to the positioning plane balance each other out as much as possible. The centre of gravity of the object support table and the centre of gravity of the balance mass are offset from each other in a direction perpendicular to the positioner plane. The driving forces exerted on the object support table and the reaction forces exerted on the balance mass are typically not applied or generated in the respective centres of gravity. There is also an offset in the direction perpendicular to positioning plane between the driving force on the object support table and the driving force on the balance mass. These offsets together make that these driving forces generate a torque.
[0008] This torque has a detrimental effect on the deformation and the dynamic behaviour of the base frame and components that are attached to the base frame.
SUMMARY
[0009] The invention aims to provide an object positioner device which allows high production rates while maintaining good positioning accuracy.
[00010] According to an embodiment of the invention, an object positioner device is provided which comprises:
- a stage which is configured to position an object in a positioning plane,
- a base frame,
- a frame support foot, which is configured to support the base frame on a support surface,
- a stage support, which stage support comprises:
- a stage support body,
- a first connector, which connects the stage and the stage support body to each other in a direction perpendicular to the positioning plane,
- a stage support foot, which is configured to support the stage support body on a support surface. wherein the stage support further comprises a second connector, which connects the stage support body and the base frame to each other.
[00011] In accordance with the current invention, it has been found that by supporting the stage on a stage support which in turn is supported on a support surface, the deformation and vibrations of the frame that are caused by movements, in particular by fast movements, of the stage or components of the stage are reduced.
[00012] The forces and/or torques which are generated by the stage are guided through the support surface before they reach the base frame. The support surface, which is for example a pedestal or a strong, e.g. reinforced, floor, is generally strong and rigid compared to the base frame. This, together with the relatively compliant base frame foot, makes that the influence on the base frame of the forces and/or torques that are generated by the stage at high production rates is reduced.
[00013] This embodiment has shown to be particularly effective in reducing the effect on the base frame (including components attached to the base frame) of torques that are generated due to the offset of the respective driving forces of a e.g. an object support table and a balance mass in the stage. Whereas, the second connector adds stability to the stage support body.
[00014] In addition, in this arrangement according to the invention, removal of the stage e.g. for maintenance, and mounting of the stage e.g. after maintenance is possible via a path below the base frame. So, the stage can be moved underneath the base frame if desired. This facilitates the removal of the stage, the mounting of the stage and the exchanges of a the stage.
[00015] In an embodiment, the frame support foot has a frame support foot stiffness in a direction perpendicular to the positioning plane, and the stage support foot has a stage support foot stiffness in a direction perpendicular to the positioning plane which is equal to or higher than the frame support foot stiffness.
[00016] This provides a further improved dynamic behavior of the base frame and the components mounted thereon.
[00017] In an embodiment of the substrate support according to the invention, the stage support further comprises a second connector, which connects the stage support body and the base frame to each other in a direction perpendicular to the positioning plane. In this embodiment, the second connector has a stiffness in a direction perpendicular to the positioning plane which is lower than the stage support foot stiffness in a direction perpendicular to the positioning plane.
[00018] In this embodiment, the second connector adds stability to the stage support body, while at the same time not or at least not significantly compromising the dynamic behaviour of the base frame. A more or less constant pretension force is added due to the relatively low stiffness of the second connector. [00019] In an embodiment of the substrate support according to the invention, the stage support further comprises a second connector, which connects the stage support body and the base frame to each other in a direction perpendicular to the positioning plane. In this embodiment, the second connector has a stiffness in a direction perpendicular to the positioning plane which is lower than the frame support foot stiffness in a direction perpendicular to the positioning plane.
[00020] In this embodiment, the second connector adds stability to the stage support body, while at the same time not or at least not significantly compromising the dynamic behaviour of the base frame.
[00021] In an embodiment of the substrate support according to the invention, the stage support further comprises a second connector, which connects the stage support body and the base frame to each other in a direction perpendicular to the positioning plane. In this embodiment, the second connector has a stiffness in a direction perpendicular to the positioning plane and a stiffness in a direction parallel to the positioning plane, wherein the stiffness in a direction parallel to the positioning plane is higher than stiffness in a direction perpendicular to the positioning plane.
[00022] In this embodiment, the second connector adds stability to the stage support body, while at the same time not or at least not significantly compromising the dynamic behaviour of the base frame.
[00023] In an embodiment of the substrate support according to the invention, the stage support further comprises a second connector, which connects the stage support body and the base frame to each other in a direction perpendicular to the positioning plane. In this embodiment, the second connector comprises a compliant element and a pre -tensioner, wherein the stiffness of the compliant element in a direction perpendicular to the positioning plane is higher than the stiffness of the pre -tensioner is in a direction perpendicular to the positioning plane, and wherein the pre-tensioner carries a part of the weight of the base frame
[00024] This embodiment has a positive effect on the stability of the stage in some designs of the object positioner device.
[00025] In an embodiment of the substrate support according to the invention, the first connector is or comprises a vibration isolator and/or an air mount and/or an air bearing.
[00026] This embodiment provides a practical implementation of the invention.
[00027] In an embodiment of the substrate support according to the invention the object positioner device comprises at least three frame support feet and at least two stage supports.
[00028] This embodiment provides a practical implementation of the invention.
[00029] In an embodiment of the substrate support according to the invention, the stage is configured to position an object in an x-direction and in a y-direction which is perpendicular to the x-direction, the x- direction and the y-direction both extending in the positioning plane, and the object positioner device comprises at least two stage supports, which are arranged in a stage support plane which extends perpendicular to the positioning plane and parallel to either the x-direction or the y-direction.
[00030] This embodiment is in particular suited to reduce the effect on the base frame of torques that are generated due to the offset of the respective driving forces of e.g. an object support table and a balance mass in the stage. In addition, in this embodiment also the influence of accelerations of the stage, e.g. due to translations in the direction perpendicular to the positioning plane or rotations around one or more axis in the positioning plane, on the base frame and on components mounted on the base frame may be reduced.
[00031] In an embodiment of the substrate support according to the invention, the stage is configured to position an object in an x-direction and in a y-direction which is perpendicular to the x-direction, the x- direction and the y-direction both extending in the positioning plane, and the base frame is longer in the y-direction than in the x-direction, and the object positioner device comprises at least two stage supports, which are arranged in a stage support plane which extends perpendicular to the positioning plane and parallel to the x-direction.
[00032] This embodiment is in particular suited to reduce the effect on the base frame of torques about the y-direction that are generated due to the offset of the respective driving forces of e.g. an object support table and a balance mass in the stage. In addition, in this embodiment also the influence of accelerations of the stage, e.g. due to translations in the z-direction perpendicular to the positioning plane or rotations around the x-axis, on the base frame and on components mounted on the base frame may be reduced.
[00033] In an embodiment of the substrate support according to the invention, wherein the stage support foot is arranged adjacent to the frame support foot, e.g. wherein the distance in a direction parallel to the positioning plane between the stage support foot and the frame support foot is 60 centimeters or less.
[00034] This embodiment provides a practical implementation of the invention.
[00035] In an embodiment of the substrate support according to the invention, the base frame comprises a compliant side and a rigid side, wherein the compliant side is arranged opposite to the rigid side, and wherein the stage support foot is arranged at the compliant side of the base frame.
[00036] This embodiment is in particular suited to reduce the effect on the base frame of torques that are generated due to the offset of the respective driving forces of e.g. an object support table and a balance mass in the stage. In addition, in this embodiment also the influence of accelerations of the stage, e.g. due to translations in the direction perpendicular to the positioning plane or rotations around one or more axis in the positioning plane, on the base frame and on components mounted on the base frame may be reduced. [00037] In an embodiment of the substrate support according to the invention, the stage comprises an object support table and a balance mass which are moveable relative to each other in or parallel to the positioning plane.
[00038] This embodiment provides a practical implementation of the invention.
[00039] According to an embodiment of the invention, an stage support is provided
which comprises:
- a stage support body,
- a first connector, which is connected to the stage support body and connectable to a stage which is configured to position an object, which first connector is configured to provide a connection between the stage support body and the stage in a first direction,
- a second connector, which is connected to the stage support body and connectable to a base frame, which second connector is configured to provide a connection between the stage support body and the base frame,
- a stage support foot, which is configured to support the stage support body on a support surface, which stage support foot has a stage support foot stiffness in the first direction,
wherein the second connector has a stiffness in the first direction which is lower than the frame support foot stiffness in the first direction.
[00040] This embodiment allows to update an existing apparatus, e.g. an object positioner device, a lithographic apparatus and/or an object inspection apparatus, in order to improve the dynamic behavior of that existing apparatus.
[00041] In an embodiment of the stage support according to the invention, the first direction is a direction which is perpendicular to a positioning plane in which the stage is configured to position the object. Optionally, the first direction is the vertical direction.
[00042] In a further embodiment of the invention, a lithographic apparatus is provided which comprises an object positioner device according to the invention.
[00043] In a further embodiment of the invention, a lithographic apparatus is provided which comprises a stage support according to the invention.
[00044] In an embodiment of the lithographic apparatus according to the invention, the lithographic apparatus comprises a projection system and an object positioner device for positioning a substrate relative to the projection system, and the object positioner device is an object positioner device according to the invention.
[00045] In a further embodiment of the invention, an object inspection apparatus is provided which comprises an object positioner device according to the invention. [00046] According to an embodiment of the invention, a method is provided for adapting an object positioner device, which method comprises the following steps:
- arranging a stage support foot of the stage support according to the invention on a support surface
- connecting a second connector of the stage support according to the invention to a base frame of the object positioner device, thereby providing a connection between the stage support body and the base frame,
- connecting a first connector of a stage support according to the invention to a stage of an object positioner device which is configured to position an object in a positioning plane, thereby providing a connection between the stage support body and the stage in a direction perpendicular to the positioning plane.
[00047] This embodiment allows to update an existing apparatus, e.g. an object positioner device, a lithographic apparatus and/or an object inspection apparatus, in order to improve the dynamic behavior of that existing apparatus.
[00048] In an embodiment of the method according to the invention for updating an object positioner device, the stage support foot is arranged adjacent to a frame support foot of the object positioner device.
[00049] This embodiment provides a practical implementation of the invention.
[00050] According to an embodiment of the invention, a method is provided for adapting an object positioner device, which method comprises the following steps:
- separating a stage support portion from a base frame of an object positioner device,
- arranging a stage support foot on a support surface, which stage support foot has a stage support foot stiffness in a direction perpendicular to the positioning plane, which stage support foot is connected to a stage support body,
- connecting a first connector to the stage support body, which first connector provides a connection between the stage support body and a stage of the object positioner device which stage is configured to position an object in a positioning plane, the connection between the support body and the stage being a connection in a direction perpendicular to the positioning plane,
- connecting a second connector, which has a stiffness in a direction perpendicular to the positioning plane which is lower than the frame support foot stiffness in a direction perpendicular to the positioning plane, to the stage support body and to the base frame of the object positioner device, thereby providing a connection between the stage support body and the base frame.
[00051] This embodiment allows to update an existing apparatus, e.g. an object positioner device, a lithographic apparatus and/or an object inspection apparatus, in order to improve the dynamic behavior of that existing apparatus. [00052] In a further embodiment of the invention, device manufacturing method is provided which comprises transferring a pattern from a patterning device onto a substrate, comprising the step of using a lithographic apparatus according to the invention.
BRIEF DESCRIPTION OF THE DRAWINGS
[00053] Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings, in which:
Figure 1 depicts a schematic overview of a lithographic apparatus;
Figure 2 depicts a detailed view of a part of the lithographic apparatus of Figure 1 ;
Figure 3 schematically depicts a position control system;
Figure 4 schematically shows an object positioner device as known from the prior art,
Figure 5 schematically shows an embodiment of an object positioner device according to the invention,
Figure 6 schematically shows a further embodiment of the second connector,
Figure 7 schematically shows an embodiment of the base frame,
Figure 8 schematically shows an embodiment of a stage support according to the invention.
DETAIFED DESCRIPTION
[00054] In the present document, the terms“radiation” and“beam” are used to encompass all types of electromagnetic radiation, including ultraviolet radiation (e.g. with a wavelength of 365, 248, 193, 157 or 126 nm) and EUV (extreme ultra-violet radiation, e.g. having a wavelength in the range of about 5-100 nm).
[00055] The term“reticle”,“mask” or“patterning device” as employed in this text may be broadly interpreted as referring to a generic patterning device that can be used to endow an incoming radiation beam with a patterned cross-section, corresponding to a pattern that is to be created in a target portion of the substrate. The term“light valve” can also be used in this context. Besides the classic mask
(transmissive or reflective, binary, phase-shifting, hybrid, etc.), examples of other such patterning devices include a programmable mirror array and a programmable FCD array.
[00056] Figure 1 schematically depicts a lithographic apparatus FA. The lithographic apparatus FA includes an illumination system (also referred to as illuminator) IF configured to condition a radiation beam B (e.g., UV radiation, DUV radiation or EUV radiation), a mask support (e.g., a mask table) MT constructed to support a patterning device (e.g., a mask) MA and connected to a first positioner PM configured to accurately position the patterning device MA in accordance with certain parameters, a substrate support (e.g., a wafer table) WT constructed to hold a substrate (e.g., a resist coated wafer) W and connected to a second positioner PW configured to accurately position the substrate support in accordance with certain parameters, and a projection system (e.g., a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g., comprising one or more dies) of the substrate W.
[00057] In operation, the illumination system IL receives a radiation beam from a radiation source SO, e.g. via a beam delivery system BD. The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, and/or other types of optical components, or any combination thereof, for directing, shaping, and/or controlling radiation. The illuminator IL may be used to condition the radiation beam B to have a desired spatial and angular intensity distribution in its cross section at a plane of the patterning device MA.
[00058] The term“projection system” PS used herein should be broadly interpreted as encompassing various types of projection system, including refractive, reflective, catadioptric, anamorphic, magnetic, electromagnetic and/or electrostatic optical systems, or any combination thereof, as appropriate for the exposure radiation being used, and/or for other factors such as the use of an immersion liquid or the use of a vacuum. Any use of the term“projection lens” herein may be considered as synonymous with the more general term“projection system” PS.
[00059] The lithographic apparatus LA may be of a type wherein at least a portion of the substrate may be covered by a liquid having a relatively high refractive index, e.g., water, so as to fill a space between the projection system PS and the substrate W - which is also referred to as immersion lithography. More information on immersion techniques is given in US6952253, which is incorporated herein by reference.
[00060] The lithographic apparatus LA may also be of a type having two or more substrate supports WT (also named“dual stage”). In such“multiple stage” machine, the substrate supports WT may be used in parallel, and/or steps in preparation of a subsequent exposure of the substrate W may be carried out on the substrate W located on one of the substrate support WT while another substrate W on the other substrate support WT is being used for exposing a pattern on the other substrate W.
[00061] In addition to the substrate support WT, the lithographic apparatus LA may comprise a measurement stage. The measurement stage is arranged to hold a sensor and/or a cleaning device. The sensor may be arranged to measure a property of the projection system PS or a property of the radiation beam B. The measurement stage may hold multiple sensors. The cleaning device may be arranged to clean part of the lithographic apparatus, for example a part of the projection system PS or a part of a system that provides the immersion liquid. The measurement stage may move beneath the projection system PS when the substrate support WT is away from the projection system PS. [00062] In operation, the radiation beam B is incident on the patterning device, e.g. mask, MA which is held on the mask support MT, and is patterned by the pattern (design layout) present on patterning device MA. Having traversed the patterning device MA, the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of the substrate W. With the aid of the second positioner PW and a position measurement system IF, the substrate support WT can be moved accurately, e.g., so as to position different target portions C in the path of the radiation beam B at a focused and aligned position. Similarly, the first positioner PM and possibly another position sensor (which is not explicitly depicted in Figure 1) may be used to accurately position the patterning device MA with respect to the path of the radiation beam B. Patterning device MA and substrate W may be aligned using mask alignment marks Ml, M2 and substrate alignment marks PI, P2. Although the substrate alignment marks PI, P2 as illustrated occupy dedicated target portions, they may be located in spaces between target portions. Substrate alignment marks PI, P2 are known as scribe-lane alignment marks when these are located between the target portions C.
[00063] To clarify the invention, a Cartesian coordinate system is used. The Cartesian coordinate system has three axis, i.e., an x-axis, a y-axis and a z-axis. Each of the three axis is orthogonal to the other two axis. A rotation around the x-axis is referred to as an Rx-rotation. A rotation around the y-axis is referred to as an Ry-rotation. A rotation around about the z-axis is referred to as an Rz -rotation. The x- axis and the y-axis define a horizontal plane, whereas the z-axis is in a vertical direction. The Cartesian coordinate system is not limiting the invention and is used for clarification only. Instead, another coordinate system, such as a cylindrical coordinate system, may be used to clarify the invention. The orientation of the Cartesian coordinate system may be different, for example, such that the z-axis has a component along the horizontal plane.
[00064] Figure 2 shows a more detailed view of a part of the lithographic apparatus LA of Figure 1. The lithographic apparatus LA may be provided with a base frame BF, a balance mass BM, a metrology frame MF and a vibration isolation system IS. The metrology frame MF supports the projection system PS. Additionally, the metrology frame MF may support a part of the position measurement system PMS. The metrology frame MF is supported by the base frame BF via the vibration isolation system IS. The vibration isolation system IS is arranged to prevent or reduce vibrations from propagating from the base frame BF to the metrology frame MF.
[00065] The second positioner PW is arranged to accelerate the substrate support WT by providing a driving force between the substrate support WT and the balance mass BM. The driving force accelerates the substrate support WT in a desired direction. Due to the conservation of momentum, the driving force is also applied to the balance mass BM with equal magnitude, but at a direction opposite to the desired direction. Typically, the mass of the balance mass BM is significantly larger than the masses of the moving part of the second positioner PW and the substrate support WT. The driving forces of the substrate support WT and the balance mass BM generally compensate each other in the plane of movement of the substrate support or a plane parallel to the plane of movement of the substrate support WT. The centre of gravity of the substrate support WT and the centre of gravity of the balance mass BM are offset from each other in a direction perpendicular to the plane of movement of the substrate support WT. The driving forces exerted on the substrate support WT and the reaction forces exerted on the balance mass BM are typically not applied or generated in the respective centres of gravity. There is also an offset in the direction perpendicular to the plane of movement of the substrate support WT between the driving force on the substrate support WT and the driving force on the balance mass BM. These offsets together make that these driving forces generate a torque T.
[00066] In an embodiment, the second positioner PW is supported by the balance mass BM. For example, wherein the second positioner PW comprises a planar motor to levitate the substrate support WT above the balance mass BM. In another embodiment, the second positioner PW is supported by the base frame BF. For example, wherein the second positioner PW comprises a linear motor and wherein the second positioner PW comprises a bearing, like a gas bearing, to levitate the substrate support WT above the base frame BF.
[00067] In an embodiment, the base frame BF is arranged on a support surface PED, for example a pedestal. The support surface PED is generally strong and rigid in order to provide a stable mounting surface for the lithographic apparatus. The base frame BS is supported onto the support surface by one or more frame support feet BFF.
[00068] The position measurement system PMS may comprise any type of sensor that is suitable to determine a position of the substrate support WT. The position measurement system PMS may comprise any type of sensor that is suitable to determine a position of the mask support MT. The sensor may be an optical sensor such as an interferometer or an encoder. The position measurement system PMS may comprise a combined system of an interferometer and an encoder. The sensor may be another type of sensor, such as a magnetic sensor a capacitive sensor or an inductive sensor. The position measurement system PMS may determine the position relative to a reference, for example the metrology frame MF or the projection system PS. The position measurement system PMS may determine the position of the substrate table WT and/or the mask support MT by measuring the position or by measuring a time derivative of the position, such as velocity or acceleration.
[00069] The position measurement system PMS may comprise an encoder system. An encoder system is known from for example, United States patent application US2007/0058173A1, filed on September 7, 2006, hereby incorporated by reference. The encoder system comprises an encoder head, a grating and a sensor. The encoder system may receive a primary radiation beam and a secondary radiation beam. Both the primary radiation beam as well as the secondary radiation beam originate from the same radiation beam, i.e., the original radiation beam. At least one of the primary radiation beam and the secondary radiation beam is created by diffracting the original radiation beam with the grating. If both the primary radiation beam and the secondary radiation beam are created by diffracting the original radiation beam with the grating, the primary radiation beam needs to have a different diffraction order than the secondary radiation beam. Different diffraction orders are, for example, +lst order, -1st order, +2nd order and -2nd order. The encoder system optically combines the primary radiation beam and the secondary radiation beam into a combined radiation beam. A sensor in the encoder head determines a phase or phase difference of the combined radiation beam. The sensor generates a signal based on the phase or phase difference. The signal is representative of a position of the encoder head relative to the grating. One of the encoder head and the grating may be arranged on the substrate structure WT. The other of the encoder head and the grating may be arranged on the metrology frame MF or the base frame BF. For example, a plurality of encoder heads are arranged on the metrology frame MF, whereas a grating is arranged on a top surface of the substrate support WT. In another example, a grating is arranged on a bottom surface of the substrate support WT, and an encoder head is arranged below the substrate support WT.
[00070] The position measurement system PMS may comprise an interferometer system. An interferometer system is known from, for example, United States patent US6,020,964, filed on July 13, 1998, hereby incorporated by reference. The interferometer system may comprise a beam splitter, a mirror, a reference mirror and a sensor. A beam of radiation is split by the beam splitter into a reference beam and a measurement beam. The measurement beam propagates to the mirror and is reflected by the mirror back to the beam splitter. The reference beam propagates to the reference mirror and is reflected by the reference mirror back to the beam splitter. At the beam splitter, the measurement beam and the reference beam are combined into a combined radiation beam. The combined radiation beam is incident on the sensor. The sensor determines a phase or a frequency of the combined radiation beam. The sensor generates a signal based on the phase or the frequency. The signal is representative of a displacement of the mirror. In an embodiment, the mirror is connected to the substrate support WT. The reference mirror may be connected to the metrology frame MF. In an embodiment, the measurement beam and the reference beam are combined into a combined radiation beam by an additional optical component instead of the beam splitter.
[00071] The first positioner PM may comprise a long-stroke module and a short-stroke module. The short-stroke module is arranged to move the mask support MT relative to the long-stroke module with a high accuracy over a small range of movement. The long-stroke module is arranged to move the short- stroke module relative to the projection system PS with a relatively low accuracy over a large range of movement. With the combination of the long-stroke module and the short-stroke module, the first positioner PM is able to move the mask support MT relative to the projection system PS with a high accuracy over a large range of movement. Similarly, the second positioner PW may comprise a long- stroke module and a short-stroke module. The short-stroke module is arranged to move the substrate support WT relative to the long-stroke module with a high accuracy over a small range of movement. The long-stroke module is arranged to move the short-stroke module relative to the projection system PS with a relatively low accuracy over a large range of movement. With the combination of the long-stroke module and the short-stroke module, the second positioner PW is able to move the substrate support WT relative to the projection system PS with a high accuracy over a large range of movement.
[00072] The first positioner PM and the second positioner PW each are provided with an actuator to move respectively the mask support MT and the substrate support WT. The actuator may be a linear actuator to provide a driving force along a single axis, for example the y-axis. Multiple linear actuators may be applied to provide driving forces along multiple axis. The actuator may be a planar actuator to provide a driving force along multiple axis. For example, the planar actuator may be arranged to move the substrate support WT in 6 degrees of freedom. The actuator may be an electro-magnetic actuator comprising at least one coil and at least one magnet. The actuator is arranged to move the at least one coil relative to the at least one magnet by applying an electrical current to the at least one coil. The actuator may be a moving-magnet type actuator, which has the at least one magnet coupled to the substrate support WT respectively to the mask support MT. The actuator may be a moving-coil type actuator which has the at least one coil coupled to the substrate support WT respectively to the mask support MT. The actuator may be a voice-coil actuator, a reluctance actuator, a Lorentz-actuator or a piezo-actuator, or any other suitable actuator.
[00073] The lithographic apparatus LA comprises a position control system PCS as schematically depicted in Figure 3. The position control system PCS comprises a setpoint generator SP, a feedforward controller FF and a feedback controller FB. The position control system PCS provides a drive signal to the actuator ACT. The actuator ACT may be the actuator of the first positioner PM or the second positioner PW. The actuator ACT drives the plant P, which may comprise the substrate support WT or the mask support MT. An output of the plant P is a position quantity such as position or velocity or acceleration. The position quantity is measured with the position measurement system PMS. The position measurement system PMS generates a signal, which is a position signal representative of the position quantity of the plant P. The setpoint generator SP generates a signal, which is a reference signal representative of a desired position quantity of the plant P. For example, the reference signal represents a desired trajectory of the substrate support WT. A difference between the reference signal and the position signal forms an input for the feedback controller FB. Based on the input, the feedback controller FB provides at least part of the drive signal for the actuator ACT. The reference signal may form an input for the feedforward controller FF. Based on the input, the feedforward controller FF provides at least part of the drive signal for the actuator ACT. The feedforward FF may make use of information about dynamical characteristics of the plant P, such as mass, stiffness, resonance modes and eigenfrequencies.
[00074] Figure 4 shows an object positioner device 1 as known from the prior art.
[00075] The object positioner device 1 comprises a stage 10 and a base frame BF. The stage comprises an object support table WT and a balance mass BM. The object support table WT is configured for positioning an object, e.g. a substrate. The substrate can for example be a wafer. The object support table is for example a substrate support or wafer table. The object support table WT is moveable in a positioning plane. If the object is a substrate, the object support table WT is movable in the plane of the substrate, e.g. in an x-y-plane and/or in a horizontal plane. In this case, the plane of the substrate is the positioning plane. A second positioner PW (not shown in figure 4, but similar to figure 2) may be provided for positioning the object support table WT. Optionally, the stage comprises two object support tables WT.
[00076] The second positioner PW may comprise a long-stroke module and a short-stroke module. The short-stroke module is arranged to move the object support table WT relative to the long-stroke module with a high accuracy over a small range of movement. The long-stroke module is arranged to move the short-stroke module in or parallel to the positioning plane with a relatively low accuracy over a large range of movement. With the combination of the long-stroke module and the short-stroke module, the second positioner PW is able to move the substrate support WT in or parallel to the positioning plane with a high accuracy.
[00077] The stage 10 further comprises a balance mass BM. The balance mass is moved in a direction opposite to the direction of movement of the object support table WT.
[00078] The stage 10 is mounted onto the base frame BF through first connectors 21. A first connector 21 is or comprises for example an air mount, an air bearing and/or a vibration isolator. The base frame BF is mounted onto a support surface PED. The base frame BF is supported by frame support feet BFF which are arranged between the support surface PED and the base frame BF. The first connector 21 engages the base frame BF at a stage support portion SSP.
[00079] The object support table WT has a centre of gravity WT-COG. The balance mass has a centre of gravity BM-COG. As can be seen in figure 4, the centre of gravity WT-COG of the object support table WT and the centre of gravity BM-COG of the balance mass BM are offset from each other in a direction perpendicular to the positioning plane. The driving forces exerted on the object support table WT and the reaction forces exerted on the balance mass BM are typically not applied or generated in the respective centres of gravity. For example, the driving force on the object support table WT is applied between the centre of gravity and the lower edge of the object support table WT, or even at the lower edge of the object support table WT. The driving force on the balance mass BM is for example applied between the centre of gravity and the top edge of the balance mass BM, or even at the top edge of the balance mass BM. So, there is also an offset in the direction perpendicular to the positioning plane between the driving force on the object support table WT and the driving force on the balance mass BM. These offsets together make that these driving forces generate a torque T.
[00080] The torque T is transferred directly to the base frame BF via the first connectors 21. The torque T excites the base frame BF, which has a negative impact on the dynamic behavior of the base frame BF and on components attached to the base frame.
[00081] The object positioner device 1 of figure 4 can be used in for example a lithographic apparatus or in an object inspection apparatus. In these kinds of apparatus, several other important components of the apparatus are mounted onto the base frame, such as sensors, a wafer handler, and/or a reticle handler. Deformation and vibrations of the base frame BF may have a negative impact on the performance and/or life span of such components.
[00082] Figure 5 shows an embodiment of an object positioner device 1 according to the invention.
[00083] The object positioner device 1 comprises a stage 10 and a base frame BF. The stage comprises an object support table WT and a balance mass BM. The object support table WT is configured for positioning an object, e.g. a substrate. The substrate can for example be a wafer. The object support table is for example a substrate support or wafer table. The object support table WT is moveable in a positioning plane. If the object is a substrate, the object support table WT is movable in the plane of the substrate, e.g. in an x-y-plane and/or in a horizontal plane. In this case, the plane of the substrate is the positioning plane. A second positioner PW (not shown in figure 5, but similar to figure 2) may be provided for positioning the object support table WT.
[00084] The second positioner PW optionally comprises a long-stroke module and a short-stroke module. The short-stroke module is arranged to move the object support table WT relative to the long- stroke module with a high accuracy over a small range of movement. The long-stroke module is arranged to move the short-stroke module in or parallel to the positioning plane with a relatively low accuracy over a large range of movement. With the combination of the long-stroke module and the short-stroke module, the second positioner PW is able to move the substrate support WT in or parallel to the positioning plane with a high accuracy.
[00085] The stage 10 further comprises a balance mass BM. The balance mass is movable in a direction opposite to the direction of movement of the object support table WT, in particular in a plane parallel to the positioning plane.
[00086] The base frame BF is mounted onto a support surface PED, which is for example a pedestal or a factory floor, e.g. a reinforced factory floor. If a pedestal is used, this pedestal may be arranged on a factory floor. The base frame BF is supported by frame support feet BFF which are arranged between the support surface PED and the base frame BF. For example, one, two, three, four or six frame support feet BFF may be provided. A frame support foot is configured to support the base frame BF on a support surface PED. Each frame support foot BFF has a frame support foot stiffness in a direction perpendicular to the positioning plane. In the embodiment of figure 5, this is the z-direction. The z-direction is for example the vertical direction.
[00087] In the embodiment of figure 5, the object positioner device 1 is further provided with two stage supports 20. Any other number of stage supports 20 is possible.
[00088] Each stage support 20 comprises a stage support body 22, a first connector 21 and a stage support foot 24. Optionally, also a second connector 23 is provided.
[00089] The first connector 21 connects the stage 10 and the stage support body 22 to each other in a direction perpendicular to the positioning plane, which direction in the embodiment of figure 5 is the z- direction. For example, the first connector 21 may have two opposite ends, one being connected to the balance mass BM of the stage 10 and the other one being connected to the stage support body 22. For example, the first connector 21 is or comprises a vibration isolator and/or an air mount and/or an air bearing. Optionally, the first connector 21 also connects the stage 10 and the stage support body 22 in at least one direction in a plane parallel to the positioning plane.
[00090] The stage support foot 24 is configured to support the stage support body 22 on the support surface PED. The stage support foot 24 has a stage support foot stiffness in a direction perpendicular to the positioning plane. This direction is for example the z-direction, e.g. the vertical direction. The stage support foot stiffness optionally is equal to or higher than the frame support foot stiffness. The direction of the stage support foot stiffness is the same as the direction of the frame support foot stiffness.
Optionally the stage support foot 24 may be provided with damping material, such as viscoelastic damping material. In an embodiment the temperature of the damping material is kept at a constant temperature, e.g. 20° Celsius by using e.g. a cooling fluid. This is advantageous as the stiffness characteristics of the damping material might change if the temperature of the damping material changes. In an embodiment the damping material is applied in such a way that it is loaded under shear stress. This is advantageous as under such conditions the damping material can provide improved damping characteristics.
[00091] For example, the stage support foot stiffness is between 3 and 10 times higher than the frame support foot stiffness. In an embodiment, the stage support foot stiffness is between 4 and 7 times higher than the frame support foot stiffness. Optionally, the stage support foot stiffness is between 5 and 6 times higher than the frame support foot stiffness. For example, the stage support foot stiffness is between 0.6xl09 N/m and 1.5xl09 N/m. For example, the frame support foot stiffness is between 0.8x10s N/m and 5xl08N/m.
[00092] In the embodiment of figure 5, the forces and/or torques which are generated by the stage 10 are guided through the support surface PED before they reach the base frame BF. The support surface PED, which is for example a pedestal or a strong, e.g. reinforced, floor, is generally strong and rigid compared to the base frame BF. This makes that the influence on the base frame BF of the forces and/or torques that are generated by the stage 10 at high production rates is reduced. This embodiment has shown to be particularly effective in reducing the effect on the base frame BF of torques that are generated due to the offset of the respective driving forces on the object support table WT and the balance mass BM, which driving forces are exerted in or parallel to the positioning plane. In addition, any detrimental influence from forces and/or torques in other directions on the base frame and/or on components mounted on the base frame may be reduced as well.
[00093] In the embodiment of figure 5, the stage support 20 further comprises a second connector 23. The second connector 23 connects the stage support body 22 and the base frame BF to each other, for example in a direction perpendicular to the positioning plane, so in this embodiment in the z-direction. The z-direction is for example the vertical direction. The second connector 23 optionally has a stiffness in a direction perpendicular to the positioning plane (e.g. z-direction, e.g. vertical direction) which is lower than the stage support foot stiffness in a direction perpendicular to the positioning plane (e.g. z-direction, e.g. vertical direction). This stiffness of the second connector 23 is the stiffness in the same direction as the stage support foot stiffness. Optionally the second connector 23 may be provided with damping such as viscoelastic damping. Alternatively or in addition, the second connector 23 connects the stage support body 22 and the base frame BF to each other in a direction parallel to the positioning plane.
[00094] In the embodiment of figure 5, the stiffness of the second connector 23 in the direction perpendicular to the positioning plane optionally is lower than the frame support foot stiffness in the direction perpendicular to the positioning plane.
[00095] In the embodiment of figure 5, the second connector 23 optionally has a stiffness in the direction perpendicular to the positioning plane and a stiffness in a direction parallel to the positioning plane. Optionally, the stiffness in the direction parallel to the positioning plane is higher than stiffness in the direction perpendicular to the positioning plane.
[00096] For example, the stiffness of the second connector 23 in the direction perpendicular to the positioning plane is between 0.8xl07 N/m and 5xl07N/m.
[00097] Figure 6 shows a further embodiment of the second connector 23. In this embodiment, the second connector 23 comprises a compliant element 25 and a pre-tensioner 26. The stiffness of the compliant element 25 in a direction perpendicular to the positioning plane is higher than the stiffness of the pre-tensioner 26 is in a direction perpendicular to the positioning plane. The pre -tensioner 26 is preloaded with a biasing force in the direction perpendicular to the positioning plane (which is e.g. the z- direction, which is for example the vertical direction). This improves the stability of the stage 10. The pre- loading can for example be achieved by making that the pre -tensioner 26 carries a part of the weight of the base frame BF.
[00098] The stiffness of the compliant element 25 in a direction perpendicular to the positioning plane is higher than the stiffness of the pre-tensioner 26 is in a direction perpendicular to the positioning plane, such that the pre -tensioner 26 does not dominate the dynamic behavior of the stage support.
[00099] Figure 7 shows an embodiment of the base frame BF. The stage 10 is not shown for reasons of clarity. In this embodiment, the positioning plane is the x-y-plane.
[000100] In this embodiment, the object positioner device comprises at least three frame support feet and at least two stage supports. More specifically, in this embodiment there are four frame support feet BFF and three stage supports 20.
[000101] In the embodiment of figure 7, the base frame BF comprises a compliant side BFC and a rigid side BFR. The compliant side BFC is arranged opposite to the rigid side BFR. The compliant side BFC is sometimes also referred to as the“leaf spring side”. The compliant side BFC has a lower stiffness, e.g. in the y-direction, than the rigid side BFR, for example in order to avoid tension building up in the base frame BF.
[000102] In the embodiment of figure 7, the stage is configured to position an object (e.g. a substrate, e.g. a wafer) in an x-direction and in a y-direction which is perpendicular to the x-direction. The x-direction and the y-direction are both extending in the positioning plane. This set up causes torques to be generated by the offset in the z-direction of the respective centres of gravity of the object support table WT and the balance mass BM. These generated torques are directed around the x-axis and around the y-axis.
[000103] In the embodiment of figure 7, the object positioner device comprises at least two stage supports 20 which are arranged in a stage support plane which extends perpendicular to the positioning plane and parallel to either the x-direction or the y-direction. In particular, in the embodiment of figure 7, the two stage supports 20 are arranged on the compliant side BFC of the base frame BF, in the z-x -plane.
[000104] In the embodiment of figure 7, the base frame BF is longer in the y-direction than in the x- direction. The torques generated by the offset in the z-direction of the respective driving forces of the object support table WT and the balance mass BM which are directed around the y-axis are the most prominent. In this situation, it is advantageous to have at least two stage supports 20 which are arranged in a stage support plane which extends perpendicular to the positioning plane and parallel to the x- direction (so, in the z-x-plane). [000105] In the embodiment of figure 7, optionally one or more additional stage supports 20 are arranged at the rigid side BFR of the base frame BF. Such additional stage supports are optionally designed and/or arranged in such a way that they mainly counteract torques or forces in other directions than the generated torque around the y-axis.
[000106] In the embodiment of figure 7, at least one stage support foot is arranged adjacent to a frame support. For example, the distance in a direction parallel to the positioning plane between the stage support foot and the frame support foot is 60 centimeters or less, e.g. between 20 and 45 centimeters.
[000107] Figure 8 shows an embodiment of a stage support 20 according to the invention. The stage support comprises a stage support body 22, a first connector 21, a second connector 23 and a stage support foot 24.
[000108] The first connector 21 is connected to the stage support body 22 and connectable to a stage which is configured to position an object. The first connector 21 is configured to provide a connection between the stage support body 22 and the stage in a first direction, e.g. the z-direction, e.g. the vertical direction. The first connector 21 is or comprises for example a vibration isolator and/or an air mount and/or an air bearing.
[000109] The second connector 23 is connected to the stage support body 22 and connectable to a base frame. The second connector 23 is configured to provide a connection between the stage support body 22 and the base frame, for example in the first direction. The first direction is for example the z-direction, e.g. the vertical direction. Alternatively or in addition, the second connector 23 is configured to provide a connection between stage support body 22 and the base frame BF in a direction parallel to the positioning plane.
[000110] The stage support foot 24 is configured to support the stage support body 22 on a support surface. The stage support foot 24 has a stage support foot stiffness in the first direction.
[000111] The second connector 23 has a stiffness in the first direction which is lower than the frame support foot stiffness in the first direction. Optionally the second connector 23 and/or the stage support foot 24 may be provided with damping material, such as viscoelastic damping material. In an embodiment the temperature of the damping material is kept at a constant temperature, e.g. 20° Celsius by using e.g. a cooling fluid. This is advantageous as the stiffness characteristics of the damping material might change if the temperature of the damping material changes. In an embodiment the damping material is applied in such a way that it is loaded under shear stress. This is advantageous as under such conditions the damping material can provide improved damping characteristics.
[000112] The stage support 20 according to the invention, e.g. the stage support as shown in figure 8, can be used to update and/or upgrade an existing apparatus, e.g. an existing lithographic apparatus, an existing object inspection apparatus or an existing object positioner device. When the stage support 20 is used for this purpose, it is for example arranged adjacent to an existing frame support foot of the apparatus which is updated and/or upgraded.
[000113] The stage support 20 can for example be used for adapting an object positioner device. This can for example be carried out by the following steps:
- arranging a stage support foot 24 of the stage support 20 on a support surface,
- connecting a second connector 23 of the stage support 20 to a base frame of the object positioner device, thereby providing a connection between the stage support body 22 and the base frame, for example in a direction perpendicular to the positioning plane and/or in a direction parallel to the positioning plane,
- connecting a first connector 21 of a stage support 20 to a stage of an object positioner device which is configured to position an object in a positioning plane, thereby providing a connection between the stage support body 22 and the stage in a direction perpendicular to the positioning plane.
[000114] For example, the stage support foot is arranged adjacent to a frame support foot of the object positioner device.
[000115] In another embodiment, the stage support 20 can be used to adapt an object positioner using the following steps:
- separating a stage support portion SSP from a base frame BF of an object positioner device,
- arranging a stage support foot 24 on a support surface PED, which stage support foot 24 has a stage support foot stiffness in a direction perpendicular to the positioning plane, which stage support foot 24 is connected to a stage support body 22,
- connecting a first connector 21 to the stage support body 22, which first connector 21 provides a connection between the stage support body 22 and a stage 10 of the object positioner device which stage 10 is configured to position an object in a positioning plane, the connection between the support body 22 and the stage 10 being a connection in a direction perpendicular to the positioning plane,
- connecting a second connector 23, which has a stiffness in a direction perpendicular to the positioning plane which is lower than the frame support foot stiffness in a direction perpendicular to the positioning plane, to the stage support body 22 and to the base frame BF of the object positioner device, thereby providing a connection between the stage support body 22 and the base frame BF, for example in a direction perpendicular to the positioning plane and/or parallel to the positioning plane.
[000116] The stage support portion SSP may for example be separated from the base frame BF by cutting, e.g. by laser cutting or water jet cutting. The stage support body 22, which is for example the stage support body 22 of the stage support 20 as shown in fig. 8 replaces the stage support portion SSP of the base frame BF.
[000117] The first connector 21 which provides the connection between the stage 10 and the stage support body 22 is for example the first connector which was already present in the apparatus that is adapted, or alternatively may be a first connector of the stage support 20 that is used to adapted the apparatus.
[000118] Although specific reference may be made in this text to the use of a lithographic apparatus in the manufacture of ICs, it should be understood that the lithographic apparatus described herein may have other applications. Possible other applications include the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, flat-panel displays, liquid-crystal displays (LCDs), thin-film magnetic heads, etc.
[000119] Although specific reference may be made in this text to embodiments of the invention in the context of a lithographic apparatus, embodiments of the invention may be used in other apparatus.
Embodiments of the invention may form part of a mask inspection apparatus, a metrology apparatus, or any apparatus that measures or processes an object such as a wafer (or other substrate) or mask (or other patterning device). These apparatus may be generally referred to as lithographic tools. Such a lithographic tool may use vacuum conditions or ambient (non-vacuum) conditions.
[000120] Although specific reference may have been made above to the use of embodiments of the invention in the context of optical lithography, it will be appreciated that the invention, where the context allows, is not limited to optical lithography and may be used in other applications, for example imprint lithography.
[000121] Where the context allows, embodiments of the invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented as instructions stored on a machine -readable medium, which may be read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable medium may include read only memory (ROM); random access memory (RAM); magnetic storage media; optical storage media; flash memory devices; electrical, optical, acoustical or other forms of propagated signals (e.g. carrier waves, infrared signals, digital signals, etc.), and others. Further, firmware, software, routines, instructions may be described herein as performing certain actions.
However, it should be appreciated that such descriptions are merely for convenience and that such actions in fact result from computing devices, processors, controllers, or other devices executing the firmware, software, routines, instructions, etc. and in doing that may cause actuators or other devices to interact with the physical world.
[000122] While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. The descriptions above are intended to be illustrative, not limiting. Thus it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set out below.

Claims

WHAT IS CLAIMED IS
1. Object positioner device, which comprises:
- a stage which is configured to position an object in a positioning plane,
- a base frame,
- a frame support foot, which is configured to support the base frame on a support surface,
- a stage support, which comprises:
- a stage support body,
- a first connector, which connects the stage and the stage support body to each other in a direction perpendicular to the positioning plane,
- a stage support foot, which is configured to support the stage support body on the support surface.
- wherein the stage support further comprises a second connector, which connects the stage support body and the base frame to each other.
2. Object positioner device according to claim 1,
wherein the frame support foot has a frame support foot stiffness in a direction perpendicular to the positioning plane, and
the stage support foot has a stage support foot stiffness in a direction perpendicular to the positioning plane which is equal to or higher than the frame support foot stiffness.
3. Object positioner device according to claims 1 or 2,
wherein the second connector has a stiffness in a direction perpendicular to the positioning plane which is lower than the stage support foot stiffness in a direction perpendicular to the positioning plane.
4. Object positioner device according to any of the claims 1 - 3,
wherein the second connector has a stiffness in a direction perpendicular to the positioning plane and a stiffness in a direction parallel to the positioning plane, wherein the stiffness in a direction parallel to the positioning plane is higher than stiffness in a direction perpendicular to the positioning plane.
5. Object positioner device according to any of the preceding claims,
wherein the first connector is or comprises a vibration isolator and/or an air mount and/or an air bearing.
6. Object positioner device according to any of the claims 1 - 5, wherein the second connector comprises a compliant element and a pre-tensioner, wherein the stiffness of the compliant element in a direction perpendicular to the positioning plane is higher than the stiffness of the pre-tensioner is in a direction perpendicular to the positioning plane, and wherein the pre -tensioner carries a part of the weight of the base frame.
7. Object positioner device according to any of the preceding claims,
wherein the object positioner device comprises at least three frame support feet and at least two stage supports.
8. Object positioner device according to any of the preceding claims,
wherein the stage is configured to position an object in an x-direction and in a y-direction which is perpendicular to the x-direction, the x-direction and the y-direction both extending in the positioning plane, and
wherein the object positioner device comprises at least two stage supports, which are arranged in a stage support plane which extends perpendicular to the positioning plane and parallel to either the x-direction or the y-direction.
9. Object positioner device according to any of the preceding claims,
wherein the stage is configured to position an object in an x-direction and in a y-direction which is perpendicular to the x-direction, the x-direction and the y-direction both extending in the positioning plane, and
wherein the base frame is longer in the y-direction than in the x-direction, and
wherein the object positioner device comprises at least two stage supports, which are arranged in a stage support plane which extends perpendicular to the positioning plane and parallel to the x-direction.
10. Object positioner device according to any of the preceding claims,
wherein the stage support foot is arranged adjacent to the frame support foot, e.g. wherein the distance in a direction parallel to the positioning plane between the stage support foot and the frame support foot is 60 centimeters or less.
11. Object positioner device according to any of the preceding claims,
wherein the base frame comprises a compliant side and a rigid side, wherein the compliant side is arranged opposite to the rigid side, and wherein the stage support foot is arranged at the compliant side of the base frame.
12. Object positioner device according to any of the preceding claims,
wherein the stage comprises an object support table and a balance mass which are moveable relative to each other in or parallel to the positioning plane.
13. Object positioner device according to any the proceeding claims, wherein the stage support foot is provided with damping material, for example viscoelastic damping material.
14. Object positioner device according to claim 13, wherein the temperature of the damping material is maintained at a constant temperature.
15. Stage support, which stage support comprises:
- a stage support body,
- a first connector, which is connected to the stage support body and connectable to a stage which is configured to position an object, which first connector is configured to provide a connection between the stage support body and the stage in a first direction,
- a second connector, which is connected to the stage support body and connectable to a base frame, which second connector is configured to provide a connection between the stage support body and the base frame,
- a stage support foot, which is configured to support the stage support body on a support surface, which stage support foot has a stage support foot stiffness in the first direction,
wherein the second connector has a stiffness in the first direction which is lower than the frame support foot stiffness in the first direction.
16. Stage support according to claim 13,
wherein the first direction is a direction which is perpendicular to a positioning plane in which the stage is configured to position the object, wherein the first direction optionally is the vertical direction.
17. Lithographic apparatus,
which lithographic apparatus comprises an object positioner device according to any of the claims 1-14.
18. Lithographic apparatus,
which lithographic apparatus comprises a stage support according to any of the claims 15-16.
19. Lithographic apparatus,
which lithographic apparatus comprises a projection system and an object positioner device for positioning an object relative to the projection system, wherein the object positioner device is an object positioner device according to any of the claims 1-14.
20. Object inspection apparatus,
which object inspection apparatus comprises a object positioner device according to any of the claims 1- 14.
21. Method for adapting an object positioner device,
which method comprises the following steps:
- arranging a stage support foot of the stage support according to any of the claims 15-16 on a support surface,
- connecting a second connector of the stage support according to any of the claims 15-16 to a base frame of the object positioner device, thereby providing a connection between the stage support body and the base frame,
- connecting a first connector of a stage support according to any of the claims 15-16 to a stage of an object positioner device which is configured to position an object in a positioning plane, thereby providing a connection between the stage support body and the stage in a direction perpendicular to the positioning plane.
22. Method according to claim 21,
wherein the stage support foot is arranged adjacent to a frame support foot of the object positioner device.
23. Method for adapting an object positioner device,
which method comprises the following steps:
- separating a stage support portion from a base frame of an object positioner device,
- arranging a stage support foot on a support surface, which stage support foot has a stage support foot stiffness in a direction perpendicular to the positioning plane, which stage support foot is connected to a stage support body,
- connecting a first connector to the stage support body, which first connector provides a connection between the stage support body and a stage of the object positioner device which stage is configured to position an object in a positioning plane, the connection between the support body and the stage being a connection in a direction perpendicular to the positioning plane, - connecting a second connector, which has a stiffness in a direction perpendicular to the positioning plane which is lower than the frame support foot stiffness in a direction perpendicular to the positioning plane, to the stage support body and to the base frame of the object positioner device, thereby providing a connection between the stage support body and the base frame.
24. A device manufacturing method comprising transferring a pattern from a patterning device onto a substrate, comprising the step of using a lithographic apparatus according to one of claims 17-19.
PCT/EP2020/051992 2019-03-01 2020-01-28 Object positioner device and device manufacturing method WO2020177949A1 (en)

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EP19160192.1 2019-03-01

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Citations (7)

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US6020964A (en) 1997-12-02 2000-02-01 Asm Lithography B.V. Interferometer system and lithograph apparatus including an interferometer system
US6952253B2 (en) 2002-11-12 2005-10-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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US20090278411A1 (en) * 2007-07-30 2009-11-12 Sumitomo Heavy Industries, Ltd. Reaction force cancel system
US20180017879A1 (en) * 2015-03-03 2018-01-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20190049852A1 (en) * 2016-03-03 2019-02-14 Asml Netherlands B.V. Vibration isolator, lithographic apparatus and device manufacturing method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020964A (en) 1997-12-02 2000-02-01 Asm Lithography B.V. Interferometer system and lithograph apparatus including an interferometer system
US6952253B2 (en) 2002-11-12 2005-10-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060279716A1 (en) * 2005-06-08 2006-12-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing substrate stage compensating
US20070058173A1 (en) 2005-09-12 2007-03-15 Wolfgang Holzapfel Position-measuring device
US20090278411A1 (en) * 2007-07-30 2009-11-12 Sumitomo Heavy Industries, Ltd. Reaction force cancel system
US20180017879A1 (en) * 2015-03-03 2018-01-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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