WO2020175843A1 - Micro led display module and manufacturing method therefor - Google Patents

Micro led display module and manufacturing method therefor Download PDF

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Publication number
WO2020175843A1
WO2020175843A1 PCT/KR2020/002275 KR2020002275W WO2020175843A1 WO 2020175843 A1 WO2020175843 A1 WO 2020175843A1 KR 2020002275 W KR2020002275 W KR 2020002275W WO 2020175843 A1 WO2020175843 A1 WO 2020175843A1
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WO
WIPO (PCT)
Prior art keywords
micro led
heat dissipation
display module
led chip
led display
Prior art date
Application number
PCT/KR2020/002275
Other languages
French (fr)
Korean (ko)
Inventor
김민표
김보균
문주경
Original Assignee
주식회사 루멘스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020190024337A external-priority patent/KR102617458B1/en
Priority claimed from KR1020190036743A external-priority patent/KR20200114646A/en
Application filed by 주식회사 루멘스 filed Critical 주식회사 루멘스
Publication of WO2020175843A1 publication Critical patent/WO2020175843A1/en

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Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission

Definitions

  • the present invention relates to the micro-LED display module and its manufacturing method. Background
  • the four micro LED display modules include a substrate such as a printed circuit board (PCB) and a plurality of micro LED chips mounted on the substrate.
  • the plurality of micro LED chips are the first micro LED chip emitting red light and a green light. It includes a second micro LED chip that emits light and a third micro LED chip that emits blue light.
  • the gathered first micro LED chip, the second micro LED chip and the third micro LED chip can constitute one micro LED pixel, A plurality of micro LED pixels are arranged in a matrix on a substrate.
  • the display panel has a problem that external light such as sunlight is reflected on the substrate of the display module.
  • external light such as sunlight
  • the need for a structure capable of absorbing external light on the surface of the micro LED display module is required.
  • a micro LED manufactured by applying an adhesive layer on the substrate on which the micro LED chips are mounted, and attaching an external light absorbing sheet to the adhesive layer.
  • a display module is proposed.
  • the heat generated during driving is blocked by the external light-absorbing sheet and cannot be easily radiated to the outside, and this heat can cause thermal damage to the micro-LED chip.
  • the adhesive strength between the adhesive layer and the external light-absorbing sheet is weakened, The external light-absorbing sheet may fall off the adhesive, or the external light-absorbing sheet may be raised. The raised external light-absorbing sheet absorbs light generated by the microLED chips.
  • Diffuse reflection can reduce the quality of the displayed image.
  • the assembly has been proposed in the past.
  • the conventional LED display module assembly includes a plate-shaped frame, a plurality of LED display modules arranged in a matrix on the frame, and black films attached to the upper surface of each of the display modules.
  • the frame may be manufactured by assembling, for example, bar-shaped plates, and may include a plurality of openings.
  • PCB Print Circuit Board
  • LED chips mounted on the PCB to form a plurality of pixels.
  • a gap occurs between the edges of black films that are adjacent to each other. Some of the light emitted from the LED chip of the edge pixel in the LED display module to which the corresponding black film is attached is formed of black film. It is emitted directly to the outside through the above-described gap without going through. For this reason, a light leakage phenomenon occurs between neighboring two LED display modules during operation of the LED display device. The light leakage phenomenon is the blue, green, or red light generated from the LED chip of the corresponding pixel.
  • a red LED chip is located at the edge of the LED display module and the red LED chip is smaller than the adjacent green LED chip. Due to this, yellow seam may occur.
  • the above gap is due to the size tolerance of the PCB, the size error of the black film and/or the unevenness of the cut surface, and the occurrence and expansion of the gap due to PCB bending during the process. Due to the occurrence and expansion of the problem, the same problems as described above have arisen.
  • the distance between adjacent pixels is required to be constant. However, it is easy to make the distance between neighboring pixels in one LED display module constant, but the two neighboring LED
  • the task to be solved by the present invention is to provide a micro LED display module having a structure in which heat generated from the micro LED chip can be better radiated to the outside through an external light absorbing sheet.
  • the black film provides a micro-LED display module assembly that covers not only the top surface of the display module, but also the side.
  • a micro LED display module includes a substrate; a plurality of micro LED chips arranged in a matrix on the substrate, including a first micro LED chip, a second micro LED chip, and a third micro LED chip.
  • Micro LED pixels The first micro LED chip, the second micro LED chip, and the third micro 2020/175843 1»(:1 ⁇ 1 ⁇ 2020/002275
  • An adhesive layer formed on the substrate to cover the side and upper surfaces of the LED chip;
  • an external light absorbing sheet formed on the adhesive layer, wherein the external light
  • the absorption sheet includes a plurality of radiating holes arranged in a matrix, and at least one microLED pixel is located in a region connecting the centers of the four radiating holes among the heat dissipating holes.
  • the external light absorbing sheet is preferably a light-transmitting sheet having a black color.
  • one row of micro LED pixels is positioned between the II-th heat-radiating hole row and the 11+1-th heat-radiating hole row among the rows of the heat-radiating holes.
  • the second heat dissipation hole row of the rows and rows of the heat dissipation holes, the second heat dissipation hole row and
  • One microLED pixel is located between the 11+1st heat dissipation hole rows and between the IIIth heat dissipation hole rows and the II heat dissipation hole rows.
  • the heat dissipation holes are the first micro
  • Heat generated from the LED chip, the second micro LED chip, and the third micro LED chip is discharged to the outside.
  • each of the heat dissipation holes is located between a first micro LED chip and a third micro LED chip between two micro LED pixels adjacent to each other.
  • each of the heat dissipation holes is elongated to be adjacent to a plurality of micro LED pixels.
  • the upper surface of the adhesive layer is by the external light absorbing sheet
  • the height of the area covered by the heat dissipation holes is the same.
  • the adhesive layer includes recesses recessed to a predetermined depth in regions exposed by the heat dissipation holes.
  • each of the heat dissipation holes has a maximum width of 30 to 200;/111.
  • a method of manufacturing a micro LED display module includes a first micro LED chip, a second micro LED chip and a third micro LED chip on a substrate.
  • Arranging a plurality of micro LED pixels including an LED chip in a matrix; an adhesive on the substrate to cover the sides and upper surfaces of the first micro LED chip, the second micro LED chip, and the third micro LED chip Forming a layer; and forming an external light-absorbing sheet on the adhesive layer, wherein the external light-absorbing sheet includes a plurality of heat-radiating holes arranged in a matrix, and four heat-radiating holes among the heat-radiating holes At least one micro LED pixel is located in the area connecting the centers of the fields.
  • the plurality of heat-radiating holes are formed in the external light-absorbing sheet using multi-pins.
  • the external light absorbing sheet is not formed with the heat dissipation holes.
  • 2020/175843 1 (:1 ⁇ 1 ⁇ 2020/002275)
  • a plurality of heat-radiating holes are formed in the external light absorbing sheet using multi-pins.
  • multi-pins are lowered to form a plurality of heat-radiating holes in the external light-absorbing sheet, After the heat dissipation holes are formed, the multi-pins are further lowered to form heat dissipation recesses connected to the heat dissipation holes in the adhesive layer.
  • one row of micro LED pixels is positioned between the II-th heat-radiating hole row and the 11+1-th heat-radiating hole row among the rows of the heat-radiating holes.
  • One micro LED pixel is located between the first heat dissipation hole rows and the III heat dissipation hole row and the II heat dissipation hole row.
  • the plurality of heat dissipation holes are used to transfer heat generated from the first micro LED chip, the second micro LED chip, and the third micro LED chip to the outside.
  • each of the heat dissipation holes is circular.
  • each of the heat dissipation holes is positioned between a first micro LED chip and a third micro LED chip between two micro LED pixels adjacent to each other.
  • the micro LED display module according to the present invention has an adhesive layer covering the side and upper surfaces of the micro LED chips constituting the micro LED pixels.
  • an external light absorbing sheet is bonded to the upper surface of the adhesive layer.
  • the absorption sheet absorbs external light to increase the contrast ratio
  • Micro-LED display module to which the display module is applied makes the exterior of the display panel luxurious.
  • the micro-LED display module according to the present day is applied with an external light-absorbing sheet with heat dissipation holes formed, it promotes the release of heat generated by the micro-LED chips. , Prevents the external light-absorbing sheet from being lifted due to its heat or from the adhesive layer.
  • FIG. 1 shows a micro LED display module according to a first embodiment of the present invention.
  • FIG. 2 is a micro LED display module according to the first embodiment of the present invention.
  • FIG. 3 is a micro-LED display module according to an embodiment 1-1 of the present invention.
  • Figure 4 is a micro-LED display module shown in Figures 1 to 3
  • Figure 5 is a micro-LED display module taken according to the show-show of Figure 3
  • 6 and 7 are micro LED modules according to the first embodiment 1-1 of the present invention.
  • FIG. 8 is a micro LED display module according to a 1-2 embodiment of the present invention.
  • FIG. 9 is a method for manufacturing the micro LED display module shown in FIG.
  • FIG. 12 shows an LED display module assembly according to a second embodiment of the present invention.
  • Example 13 is a lower surface of a black film and an LED according to Example 2-1 of the present invention.
  • FIG. 14 shows an LED display module assembly according to a 2-1 embodiment of the present invention.
  • FIG. 15 is an enlarged cross-sectional view of a part of FIG. 14.
  • FIG. 19 shows an LED display module assembly according to a 2-2 embodiment of the present invention.
  • FIG 20 shows an LED display assembly according to another 2-3 embodiment of the present invention.
  • FIG. 21 is a diagram illustrating an LED display assembly manufactured according to the method shown in FIG.
  • FIG. 1 shows a micro LED display module according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view showing a micro LED display module according to a first embodiment of the present invention
  • FIG. 3 is a plan view showing a micro LED display module according to a first embodiment of the present invention
  • Figure 4 is Figure 1 to 3 is a diagram for explaining the positional relationship between the micro LED pixels or micro LED chips and the heat dissipation hole in the micro LED display module shown in FIG. 3, and
  • FIG. 5 is a micro LED display module taken according to P, -P, and It is a cross-sectional view.
  • the micro LED display module for example, PCB (Printed Circuit Boar), FPCB (Flexible Circuit Board, or TFT It includes a substrate 100 on which an electric circuit is formed, such as, and a plurality of micro LED pixels 2 arranged in a matrix on the substrate 100.
  • first micro LED chips 200a On the substrate 100, first micro LED chips 200a , A plurality of micro LED chips 200a, 200b, 200c including the second micro LED chips 200 b and the third micro LED chips 200 c are mounted, the first micro LED chips 200 a ), the second micro LED chip 200b and the third micro LED chip 200c constitute one micro LED pixel 2.
  • the "micro LED chip” refers to at least one side length of several hundred micrometers or less, More preferably, it means a light emitting semiconductor chip of 500/ _ or less.
  • each of the micro LED chips 200a, 200b, 200c is a first conductive type electrode pad and a second conductive layer connected to the first conductive type semiconductor layer. It is preferable that a flip-chip type micro-LED chip including all of the second conductive type electrode pad connected to the type semiconductor layer is included, and the substrate 100 is a material corresponding to the first conductive type electrode pad and the second conductive type electrode pad. It includes a first electrode and a second electrode.
  • micro LED display module the first micro
  • the adhesive layer 300 may be formed of a transparent acrylic resin, is formed to a height greater than the thickness of the micro LED chips (200a, 200b, 200c), the micro LED chips (200a, 200b, 200c) And, the adhesive layer 300 has a flat upper surface, and therefore the external light absorbing sheet 400 bonded to the flat upper surface of the adhesive layer 300 is also present in a flat state.
  • the external light absorption sheet 400 has a function of increasing the contrast ratio of the display screen by absorbing external light such as sunlight and preventing glare caused by external light reflection. Furthermore, the external light absorption sheet 400 ) May also function as a protective layer.
  • the external light-absorbing sheet 400 is formed of a light-transmitting resin sheet having a dark color (most preferably, black color) that absorbs light. In this embodiment, , A black color external light absorbing sheet 400 based on PET resin is used.
  • the external light absorption sheet 400 is the heat generated from the first micro LED chip (200a), the second micro LED chip (200b) and the third micro LED chip (200c) 2020/175843 1 » (:1 ⁇ 1 ⁇ 2020/002275) It includes a plurality of heat dissipation holes 420 that are discharged to the outside.
  • Each of the heat dissipation holes has a maximum width of 80-200 /L.
  • the heat dissipation holes 420 are formed in a circular shape so that the distance from the center of each of the peripheral micro LED pixels 2 is uniform. Accordingly, the minimum width and the maximum width of the heat dissipation hole 420 are the same as the diameter of the heat dissipation hole 420.
  • the heat dissipation effect decreases, and when the maximum width of the heat dissipation hole 420 exceeds 200//111, the external light absorbing sheet 400 is an adhesive layer 300 The area attached to) is excessively reduced.
  • the heat dissipation holes 420 are formed in a matrix arrangement on the external light absorbing sheet 420
  • one row of micro LED pixels 2 is located between the !!th heat dissipation hole row and the 11+1 th heat dissipation hole row.
  • the two microLED pixels (2) neighboring within a row are adjacent to each other microLED chips of the same wavelength, i.e., the first microchip.
  • micro LED chip (200 yen is the first micro LED chip (200 yen and is close to each other
  • the second micro LED chip (200) is the second micro LED chip (200 is the first micro LED chip
  • the third micro LED chip (200 is silver) 3 Micro LED chips (it is adjacent to each other over 200.
  • one row of micro LED pixels (2) is located between the 111th heat dissipation hole row and the 111+1th heat dissipation hole row among the rows of the heat dissipation holes 420. .
  • the two microLED pixels (2) neighboring within a row are adjacent to each other micro LED chips of different wavelengths. That is, the first micro LED chips are adjacent to each other.
  • one micro LED pixel between the rows and rows of the heat dissipation holes 420, between the IIth heat dissipation hole row and the 11+1th heat dissipation hole row, and the 111th heat dissipation hole row and the IIth heat dissipation hole row ( 2)
  • one micro LED pixel (2) is always located in a rectangular or square area connecting the centers of the four adjacent heat radiation holes 420 among the heat radiation holes 420.
  • micro LED pixels 2 are arranged near the center of the area, so that each micro LED pixel 2 has 4
  • the heat dissipation holes 420 may be arranged at approximately the same distance, and thus, the paths through which the heat generated from the micro LED pixels 2 is transmitted to the heat dissipation holes 420 may be almost constant and short.
  • the four heat dissipation holes 420 arranged in the entire area and gathered together surround the periphery of the micro LED pixel 420, so that uniform heat dissipation can occur over the entire area of the micro LED module.
  • the first micro LED chip (20 ( ⁇ )) and the second micro LED chip (200 and third micro LED chips (200 and 3 micro LED chips) are formed on the top surface and are 2020/175843 1»(:1 ⁇ 1 ⁇ 2020/002275 LED chip (200 is mounted by flip chip bonding method. And,
  • Adhesive layer 300 is the first micro LED chip (200 yen, the second micro
  • the upper surface of the adhesive layer 300 is flat, and the adhesive layer 300 is The external light absorbing sheet 400 in which the heat dissipating holes 420 are formed is bonded on the flat top surface.
  • the upper surface area of the adhesive layer 300 is an area covered by the external light absorbing sheet 400 1) It is divided into areas exposed to the outside by the heat dissipation holes 420. And the exposed areas 2) are on the same plane as the area covered by the external light absorbing sheet 400. And its height is the same.
  • the heat dissipation holes 420 are pre-fabricated with the external light absorbing sheet 400. Each of them has a fine diameter of 80-200 ⁇ .
  • the external light-absorbing sheet 400 on which the heat dissipation holes 420 are formed on a flat top surface of the adhesive layer 300 applied on the substrate 100 to cover the LED chips 200 is bonded.
  • a plurality of external light absorbing sheets 400 are applied by using multi-pins.
  • heat dissipation holes 420 are formed, a plurality of heat dissipation holes 420 may be formed by etching or laser processing using a mask.
  • the entire area of the upper surface of the adhesive layer 300 is blocked by the absorbent sheet 400, so that the surface temperature of the microLED chip is turned on and the surface temperature of the microLED module reaches approximately 60°(:.
  • This state is maintained for a considerable time, ,Severe thermal damage is applied to the micro LED chip, as well as a serious problem in which the external light absorbing sheet 400 falls off the adhesive layer 300.
  • the heat generated in the micro LED chips 200 20 (3 ⁇ 4, 200 and transferred to the adhesive layer 300 is discharged to the outside through the heat dissipation holes 420 as described above, It is possible to greatly reduce the thermal effect on the micro LED chips (200 200 ⁇ 200.
  • the maximum surface temperature of the micro LED module is approximately 53 to 56 o (: about 4 to 7 degrees than the comparative example) 0 is small.
  • FIG. 8 is a cross-sectional view for explaining a micro LED display module according to the 1-2 embodiment of the present invention.
  • the module as in the previous embodiment, on the substrate 100 and the substrate 100
  • a plurality of heat dissipation holes that are bonded to the phase and dissipate heat generated by the first micro LED chip 20 and the second micro LED chip 200 and the third micro LED chip 200 to the outside It includes an external light absorbing sheet 400 in which 420 are formed.
  • micro LED display module according to this embodiment is
  • the heat dissipation recesses 320 are an upper surface exposed by the heat dissipation holes 420 among the upper surface regions of the adhesive layer 300 Regions are formed by being recessed to a certain depth.
  • Each of the plurality of heat dissipation recesses 320 is connected to each of the heat dissipation holes 420.
  • micro LED chips (200 200 ⁇ 200 occurs at
  • the heat transferred to the adhesive layer 300 is radiated to the outside through the heat dissipation holes 420 on the flat top surface of the adhesive layer 300, but in this embodiment, the
  • the heat dissipation recesses 320 each of which are formed with a bottom surface icon-shaped inclined surface 322, have a large heat dissipation area compared to the floor having a horizontal plane, thereby further increasing the heat dissipation efficiency.
  • the heat dissipation recess 320 may be formed to a depth contacting the substrate 100. Furthermore, a hole passing through the substrate 100 may be additionally formed, and the hole may be connected to the heat dissipation recess 320. .
  • FIG. 9 is for explaining the method of manufacturing the micro LED module shown in FIG.
  • Four micro LED pixels 2 are arranged in a matrix on the substrate 100.
  • the first micro LED chip 20, the second micro LED chip 200 and the third micro LED chip An adhesive layer 300 is applied on the substrate 100 so as to cover the side surfaces and the upper surface of 200.
  • an external light absorbing sheet 400 in a state in which no heat dissipation holes are formed is placed on the adhesive 300 layer.
  • a plurality of heat dissipation poles 420 are formed on the top number sheet 400.
  • the external light absorption sheet 400 is formed with the heat dissipation holes 420 In the unformed state
  • the multi-pins 3 are lowered to form a plurality of heat dissipation holes 420 in the external light absorbing sheet 400, but after the heat dissipation holes 420 are formed, the multi-pins 3
  • the fins (3) are further lowered to form heat-radiating recesses (320) connected to the heat-radiating holes (420) in the adhesive layer (300).
  • the bottom of each of the multi-fins (3) is formed in a sharp cone shape. If you do, it is easier to use external light
  • heat dissipation holes 420 and heat dissipation recesses 320 are formed in the absorbent sheet 400 and the adhesive layer 300, and by the sharp cone shape, the bottom shape of the heat dissipation recesses 320 is a heat dissipation area. It can also be made into a cone shape that can be increased.
  • a plurality of heat dissipation holes 420 are formed in the external light absorbing sheet 400 using multi-pins, but a plurality of heat dissipation holes 420 may be formed by etching or laser processing using a mask. By using a laser for etching, the adhesive layer 300 and external light are not damaged without damaging the substrate or the micro LED chip.
  • Only the absorption sheet 400 can be precisely formed with the heat radiation recesses 320 and the heat radiation holes 420.
  • FIG. 11 are plan views of a micro LED module for explaining still other embodiments of the present invention.
  • one row of micro LED pixels 2 is positioned between the !!th heat dissipation hole row and the 11+1th heat dissipation hole row among the rows of the heat dissipation holes 420.
  • neighboring micro LED chips in the corresponding micro LED pixel (2) between 12 (between ⁇ and 12 Ah 5 and 12 (and 120)),
  • Narrow-width heat dissipation holes 421 may be additionally formed.
  • micro LED pixel 2 is located in a rectangular area adjacent to each other, in the embodiment shown in FIGS. 10 and 11, adjacent two radiating holes 420
  • One micro LED pixel (2) or a row of micro LED pixels (2) are located in the area between the 420), and the heat dissipation holes 420 are two micro LED pixels (2, 2) adjacent to each other.
  • the first micro LED chip between 200 and the third micro LED chip between 200 is located.
  • each of the heat dissipation holes 420 is elongated so as to be in contact with a plurality of micro LED pixels, and in this embodiment, all three micro LED pixels 2.
  • FIG. 12 is a diagram illustrating an LED display module assembly according to Embodiment 2-1 of the present invention.
  • 2020/175843 1»(:1 ⁇ 1 ⁇ 2020/002275 is a partial exploded perspective view to explain
  • FIG. 13 is a view so that the lower surface of the black film and the lower surface of the LED display module can be seen according to the second embodiment of the present invention.
  • Fig. 14 is an exploded perspective view
  • Fig. 14 is a cross-sectional view for explaining an LED display module assembly according to a second embodiment of the present invention
  • Fig. 15 is an enlarged sectional view of a part of Fig. 14, and
  • Figs. 16, 17 and 18 is the LED shown in Figs. 12 to 15
  • the LED display module assembly according to the second embodiment of the present invention, a frame 200 having a substantially rectangular plate shape and the above
  • the frame 200 is formed of a metal or plastic material to have rigidity
  • the frame 200 without openings is used, but a plate-shaped frame 200 in which several rectangular openings are formed may also be used, for example, by assembling bar-shaped plates.
  • the upper surface of the frame 200 is only a flat surface, but
  • a frame with a curved upper surface may be used for the display implementation.
  • a plurality of stud holes 210 are formed in the frame 200.
  • one LED display module 100, respectively Four stud holes 210 arranged in a square are allocated.
  • the LED display modules 100 are rectangular or square
  • a circuit board (0) and a plurality of LED chips are mounted on the upper surface of the circuit board (0) to form a plurality of pixels. Each of the pixels is adjacent to each other and is arranged in a line with red LEDs arranged in a row. Chip (120 ⁇ , green LED chip (120 ratio, blue LED chip (120)).
  • the plurality of LED display modules (100) include first and second LED display modules (100, 0) adjacent to each other. .
  • the light absorbing means, the first and second light absorbing means are the first and second LEDs
  • the first and second black films 300 absorb light (especially, external light) to adjust the contrast ratio of the display screen. In addition to its height as a light absorbing means, it serves as a protective film that protects the LED chips 120 12 (3 ⁇ 4, 120 from the external environment. At this time, the first and second black films 300 and 300) include the LED chips 120. 12 (3 ⁇ 4, 120 of course have light transmittance to emit light from them.
  • the term "black film” is defined to include the meaning of a film containing a dark-colored material capable of absorbing light. .
  • each of the first and second LED display modules 100 and 100 may further include a light-transmitting molding unit 140 formed to cover the side surfaces of the LED chips 120 12 (3 ⁇ 4, 120).
  • the light-transmitting molding part 140 is made of a black resin material that absorbs light. 2020/175843 1»(:1 ⁇ 1 ⁇ 2020/002275 can be formed or formed of a clear resin material.
  • the upper surface of the LED display module 100 is the upper surface of the light-transmitting molding unit 140 and the LED chips 120 Including 12 (3 ⁇ 4, 120.
  • the light-transmitting molding part 140 may be formed to cover the 120 12 (3 ⁇ 4, 120 clothing part), in this case, the upper surface of the LED display module 100 is Of the translucent molding part 140
  • the upper surface of the LED display module 100 is the LED chips 120 12 (3 ⁇ 4, 120 upper surface and the circuit board (0) Includes the clothing part.
  • the first and second LED display modules 100 are fixed on the frame 200. And, the studs 114 are fixed to the corresponding stud holes 0.
  • the spacing between the first and second LED display modules (100, 0) can be set to be constant. At this time, a gap exists between the first and the first LED display modules 100.
  • the positions of the first and second LED display modules 100 and 0 are determined so that the pixel spacing between the studs 114 and the stud holes 0 is constant between the first and second LED display modules 100 and 100 Positioning means including other types of fasteners may be used instead of studs and stud holes.
  • each of the first and second black films 300 and 300 is larger than the upper cover part 320 on the four sides of the square top cover part 320 and the top cover part 320. It is composed of four side cover portions 340 that are approximately orthogonal.
  • the top cover portion 320 has substantially the same shape and area as the top surfaces of each of the first and second LED display modules 100 and 100. Each of the first and second LED display modules 100 and 100 is covered. Accordingly, the top surfaces of each of the first and second LED display modules 100 and 100 are 120 12 (3 ⁇ 4, 120s). All of them are covered by the upper cover part 320.
  • An adhesive material is formed on the lower surface of the upper cover part 320.
  • each of the four side cover parts 340 is the first and second LEDs.
  • the display modules 100 and 100 are formed to cover each of the four sides.
  • An adhesive material is formed on the inner side of the side cover part 340.
  • Each of the side cover parts 340 includes the first and second LED displays. It may cover the entire corresponding side of the module 100, 0, but may not cover at least a part of the side of the circuit board 0.
  • Each side of the first and second LED display modules 100, 100 is the side of the light emitting side It is composed of a light emitting part and a side surface of the circuit board 110, and the side cover part 3400 is preferably formed to cover the side light emitting part of the LED display module 100.
  • Each of the black film 300 is in a state as shown in FIG. 17, that is, the top surface
  • FIGS. 12 to 15 From the state in which the cover part 320 and the four side cover parts 340 are on the same plane, along the fold lines 301, after the side cover parts 340 are folded approximately 90 degrees, FIGS. 12 to 15 It can be applied as shown in Fig. 17, which is limited by the intersection of the two fold lines 301, is eliminated. It should be noted that Fig. 17 is shown exaggerated without taking into account the ratio for convenience of understanding.
  • the pixel gap between the modules 100 and 100 that is, the gap between the edge LED chips 12 and 120 of the first and second LED display modules 100 and 0 is &, and the edge LED chip 12
  • the distance to the adjacent ends of each of the first and second circuit boards (110, 100) of 120 ⁇ s each is bar, 2, and the thickness of each of the first and second black films (300, 300) is I
  • the width w of the core gap formed between the side cover parts of the first and second black films 300 and 300 attached to the first and second LED display modules 100 and 100 satisfies the following equation, and is less than 50 01 If the width of the deliberation is less than 50 01, the deliberation is difficult to see with the naked eye. 151 + 2) ⁇ 50
  • the interval between the chips (120 120 ⁇ , i.e., the pixel interval between the first and second LED display modules 100 and 100) & is equal to the pixel interval in one LED display module 100.
  • the upper period interval & is ,As determined by the insertion of the studs into the aforementioned stud holes, the edge LED chip (120 120 ⁇ each corresponding to each
  • the distance bar for each of the circuit boards (0, 110), the distance bar for each of the adjacent ends, is constant even if 2 is different, and, depending on the thickness of the black film 300, the sides of the neighboring first and second black films 300 It is possible to finely adjust the width ⁇ of the severe gap formed between the cover parts.
  • Figures 16, 17, and 18 are for manufacturing the aforementioned Han LED display module assembly.
  • a plurality of LED display modules 100 including first and second LED display modules 100 and 100 as shown in FIG. 16 are prepared.
  • a rectangle or a rectangle A square circuit board (0) is prepared, and a plurality of LED chips (120 12015, 120) including a red LED chip, a green LED chip and a blue LED chip are mounted on the top surface of the circuit board (0).
  • the red LED chips (120 ⁇ , green LED chips (12a5), and blue LED chips (120), which are arranged and gathered together constitute one pixel, and a plurality of pixels are arranged in a matrix on the circuit board (0).
  • the light-transmitting molding part 140 may be further formed to cover the side surfaces of the LED chips 120 12a5 and 120s.
  • the molding part 140 is formed of a light-absorbing black resin material or a clear resin material. Can be formed
  • an LED display module 100 and a black film 300 are prepared, respectively.
  • the black film 300 is PET (Poly
  • Ethylene terephthalate) layer 301 an AG (Anti Glare) layer 302 having a thickness of approximately 2 ⁇ formed on the upper side of the PET layer 301, and silicon having a thickness of ⁇ 0 formed on the lower side of the PET layer 301
  • a (silicone) PSA adhesive material layer 304 is included, and a black coating layer 303 having a thickness of approximately 5 is interposed between the PET layer 301 and the adhesive material layer 304.
  • the black film 300 is composed of a PET layer, an AG layer, and an adhesive material layer.
  • the black coating layer 303 When compared with an AG (Anti Glare) film or an AG (Anti Glare) sheet, by implementing deep black by the black coating layer 303 interposed between the PET layer 301 and the adhesive material layer 304, the contrast ratio is reduced. At this time, the transmittance of light can be adjusted within 50-70% by the black coating layer 303. And, the black
  • the film 300 can minimize luminance loss.
  • the black film 300 is attached to cover the upper and four sides of the LED display module 100.
  • the black film 300 includes an upper cover part 320 and four side cover parts 340 ) From a state in which they are on the same plane, along the fold lines 301, the side cover parts 340 are folded approximately 90 degrees to be applied.
  • the upper cover part 320 and the side cover part of the black film 300 Each of the 340 is attached to a top surface of the LED display module 100 and a side surface of the LED display module 100.
  • the side cover portions 340 are attached to a side surface other than the top surface of the LED display module 100. Since it covers the light, it is possible to suppress the occurrence of light leakage through the gap between the neighboring LED display modules 100.
  • the LED display modules 100 with black film 300 attached are fixed on the frame in a matrix arrangement. Become, LED
  • 19 is an LED display module assembly according to a second embodiment of the present invention.
  • the LED display module assembly according to the second embodiment 2-2 of the present invention as in the previous embodiment 2-1, a matrix on the frame 200 and the frame 200 A plurality of LED display modules 100 arranged in, and the
  • the display modules 100 include black films 300 attached to each of the upper surfaces of each of them.
  • the LED display modules 100 are, like the first example, a circuit board (no ) and the circuit A plurality of LED chips 120a, 120b, 120c, which are mounted on the top surface of the substrate no , to form a plurality of pixels, and a light-transmitting molding part 140 formed to cover the side surfaces of the LED chips 120a, 120b, and 120c. ).
  • the molding of the previous example 2-1 is added to the molding or mold by the squeeze method. 2020/175843 1»(:1 ⁇ 1 ⁇ 2020/002275 Unlike the one having a flat top surface by molding using, the molding part according to the second embodiment of the present invention 140 is the LED chips 120 12 (3 ⁇ 4 , 1200)
  • Each of the plurality of valleys 142 and 144 is an inter-pixel valley 142 formed between two neighboring LED chips, and an inter-chip valley 144 formed between two neighboring LED chips in a corresponding pixel. Since the distance between the two neighboring pixels and the two neighboring LED chips is larger than the distance between the two neighboring LED chips in each pixel, the width of the inter-pixel valley 142 is set to be larger than the width of the inter-chip valley 144. All.
  • the molding part 140 may be formed by spraying a liquid or gel resin material including a black color material on the circuit board 110 in a spray manner.
  • the black color material may be black carbon, for example.
  • a liquid or gel resin material containing a black color material is applied by spraying the plurality of LED chips (120 12 (3 ⁇ 4, 120) on a circuit board (0), the liquid or gel resin material
  • the above-described light-transmitting molding part 140 is formed by filling between neighboring pixels or between LED chips in a pixel. Nevertheless, due to the surface tension of the liquid or gel resin, the liquid or gel resin is formed.
  • the molding part 140 further includes a half valley 146 in an area adjacent to the edge of the circuit board 0.
  • the molding part 140 includes both a surface in contact with the side surface of the edge LED chip in the region where the half valley 146 is formed and a surface on the same plane as the side surface of the circuit board 0.
  • FIG. 20 shows an LED display assembly according to a third alternative embodiment of the present invention.
  • FIG. 21 is a cross-sectional view showing an LED display module assembly manufactured according to the method shown in FIG. 20.
  • the black film provided corresponding to each LED display module in the previous embodiments is omitted.
  • a square plate-shaped frame 200 in which stud holes 210 are formed is first prepared, unlike the previous embodiment. LED display without black film attached
  • Modules 100 are fixed on the frame 200 in a matrix arrangement.
  • studs 114 formed on the lower surface of each LED display module 100 are provided with corresponding stud holes formed in the frame 200 ( 0).
  • the stud holes (114) By inserting the stud holes (114) into the corresponding stud holes (0), the neighboring LED display 2020/175843 1»(:1 ⁇ 1 ⁇ 2020/002275
  • the spacing between the modules 100 can be fixed. At this time, a gap exists between the neighboring LED display modules 100.
  • a black molding layer 300 ′ is formed to cover the entire upper surface of the LED display modules 100 fixed on the upper surface of the frame 200.
  • the black molding layer 300 ′ is made of a black color material. It may be formed by applying a mixed liquid or gel resin to cover the entire upper surface of the LED display modules 100 and then curing.
  • the black molding layer 300' is the LED display.
  • a top cover part 320' covering the entire upper surface of the modules 100 and a side that partially covers the sides of the LED display module 100
  • the side cover part 340 ′ is applied so that a liquid or gel black resin mixed with a black color material covers the entire upper surface of the LED display modules 100.
  • the gap between the LED display modules 100 it is formed by hardening the black resin that has entered the inside.
  • a top cover part 320 ′ covering the entire upper surface of the LED display modules 100 and the LED display module 100 ), the black molding layer 300' including the side cover portion 340' that partially covers the sides of the LEDs is applied to cover the LED display modules 100, so that the core between the neighboring LED display modules 100 It can be prevented from occurring.
  • the LED display module assemblies according to the second embodiments of the present invention adopt a black film that covers the top and sides of the LED display module, instead of the black film disposed to cover the top surface of the LED display module. It is possible to suppress the occurrence of light leakage through the gap between the LED modules and the black films attached thereon.
  • the studs formed on the lower surfaces of the LED display modules are inserted into the stud holes formed in the frame to determine the positions of the LED display modules. Not only the pixel pitch spacing within the display module, but also the pixel pitch spacing between neighboring LED display modules is also fixed. Due to the difference in size of the circuit boards of the LED display modules, a gap occurs between the LED display modules, but the LED display module The attached black films are composed of a top cover part and a side cover part that is approximately orthogonal thereto, and the gap size between the adjacent LED display modules of the side cover parts is reduced.

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Abstract

Disclosed is a micro LED display module. The micro LED display module comprises: a substrate; a plurality of micro LED pixels arranged in a matrix on the substrate and comprising a first micro LED chip, a second micro LED chip, and a third micro LED chip; an adhesive layer formed on the substrate to cover side surfaces and top surfaces of the first micro LED chip, the second micro LED chip, and the third micro LED chip; and an external light absorbing sheet formed on the adhesive layer, wherein the external light absorbing sheet includes a plurality of heat dissipation holes arranged in a matrix, and at least one micro LED pixel is located in an area connecting the centers of four heat dissipation holes among the heat dissipation holes.

Description

2020/175843 1»（：1/10公020/002275 명세서 2020/175843 1»（：1/10公020/002275 Specification
발명의명칭:마이크로엘이디디스플레이모듈및그제조방법 기술분야 Name of the invention: Micro LED display module and manufacturing method technology field
[1] 본발명은마이크로엘이디디스플레이모듈및그제조방법에관한것이다. 배경기술 [1] The present invention relates to the micro-LED display module and its manufacturing method. Background
四 마이크로엘이디디스플레이모듈은예컨대 PCB(Printed Circuit Board)와같은 기판과,기판상에실장된복수개의마이크로엘이디칩들을포함한다.복수개의 마이크로엘이디칩들은적색광을발하는제 1마이크로엘이디칩과,녹색광을 발하는제 2마이크로엘이디칩과,청색광을발하는제 3마이크로엘이디칩을 포함한다.모여 있는제 1마이크로엘이디칩,제 2마이크로엘이디칩및제 3 마이크로엘이디칩이하나의마이크로엘이디픽셀을구성할수있으며, 복수개의마이크로엘이디픽셀들을기판상에매트릭스로배열된다. The four micro LED display modules include a substrate such as a printed circuit board (PCB) and a plurality of micro LED chips mounted on the substrate. The plurality of micro LED chips are the first micro LED chip emitting red light and a green light. It includes a second micro LED chip that emits light and a third micro LED chip that emits blue light. The gathered first micro LED chip, the second micro LED chip and the third micro LED chip can constitute one micro LED pixel, A plurality of micro LED pixels are arranged in a matrix on a substrate.
[3] 마이크로엘이디디스플레이모듈을이용하여제작된마이크로엘이디 [3] Micro LEDs manufactured using micro LED display modules
디스플레이패널은태양광같은외부광이엘이디디스플레이모듈의기판에 반사되는것으로인한문제점을안고있다.이에대하여,마이크로엘이디 디스플레이모듈표면에외부광을흡수할수있는구조의필요성이요구되었다. The display panel has a problem that external light such as sunlight is reflected on the substrate of the display module. In this regard, the need for a structure capable of absorbing external light on the surface of the micro LED display module is required.
[4] 여기에서는마이크로엘이디칩들이실장된기판상에접착제층을적용하고,그 접착제층상에외부광흡수시트를부착하여제작된마이크로엘이디 [4] Here, a micro LED manufactured by applying an adhesive layer on the substrate on which the micro LED chips are mounted, and attaching an external light absorbing sheet to the adhesive layer.
디스플레이모듈이제안된다. A display module is proposed.
[5] 그러나,일반적인외부광흡수시트를적용하는경우,마이크로엘이디칩 [5] However, when a general external light absorbing sheet is applied, the micro LED chip
구동시발생한열이외부광흡수시트에막혀외부로잘방출되지못하고,이 열이마이크로엘이디칩에열적대미지를줄수있다.또한,높은열로인해, 접착제층과외부광흡수시트사이에접착력이약화되어,외부광흡수시트가 접착제로부터떨어지거나,외부광흡수시트가들뜨게되는형상이초래될수 있다.들뜬외부광흡수시트는마이크로엘이디칩들에서발생된광을 The heat generated during driving is blocked by the external light-absorbing sheet and cannot be easily radiated to the outside, and this heat can cause thermal damage to the micro-LED chip. In addition, due to the high heat, the adhesive strength between the adhesive layer and the external light-absorbing sheet is weakened, The external light-absorbing sheet may fall off the adhesive, or the external light-absorbing sheet may be raised. The raised external light-absorbing sheet absorbs light generated by the microLED chips.
난반사시켜디스플레이되는영상의품질을떨어뜨릴수있다. Diffuse reflection can reduce the quality of the displayed image.
[6] 한편,블랙필름이외부광흡수시트로이용되는엘이디디스플레이모듈 [6] Meanwhile, an LED display module in which the black film is used as an external light absorbing sheet
조립체가종래에제안된바있다.종래의 엘이디디스플레이모듈조립체는 판상의프레임및그프레임상에행렬로배열된복수개의 엘이디디스플레이 모듈들과,그디스플레이모듈들각각의상면에부착되는,블랙필름들을 포함한다.프레임은예컨대,바형상의판들을조립하여제작될수있으며, 복수개의개구부를포함할수있다.엘이디디스플레이모듈들각각은 The assembly has been proposed in the past. The conventional LED display module assembly includes a plate-shaped frame, a plurality of LED display modules arranged in a matrix on the frame, and black films attached to the upper surface of each of the display modules. The frame may be manufactured by assembling, for example, bar-shaped plates, and may include a plurality of openings. Each of the LED display modules
PCB(Printed Circuit Board)와, PCB상에실장되어복수개의픽셀을형성하는 복수개의 엘이디칩들을포함한다.블랙필름은엘이디칩들을외부 It includes a PCB (Printed Circuit Board) and a plurality of LED chips mounted on the PCB to form a plurality of pixels.
환경으로부터보호하는보호필름으로서의역할과광 (특히,외부광)을흡수하여 명암비를증대시키는광흡수필름으로서의역할을한다. [7] 종래엘이디디스플레이모듈조립체에있어서,서로이웃하는블랙필름들의 가장자리들사이에는갭이발생한다.해당블랙필름이부착되어 있는해당 엘이디디스플레이모듈내가장자리픽셀의엘이디칩에서나온광일부는블랙 필름을거치지않고전술한갭을통해바로외부로방출된다.이때문에엘이디 디스플레이장치동작중에이웃하는두엘이디디스플레이모듈사이에서빛샘 현상이발생한다.빛샘현상은해당픽셀의 엘이디칩에서발생한청색,녹색 또는적색광이새어나오는블루심 (blue seam),그린심 (green seam).또는적색 심 (blue seam)현상이거나또는혼합된광이갭을통해새어나오는심현상，특히 , 옐로우심 (yellow seam)현상일수있다.해당엘이디디스플레이모듈내 가장자리에적색엘이디칩이위치해있고그적색엘이디칩이인접한녹색 엘이디칩보다작은경우가있는데,이경우,적색엘이디칩에서나온광과인접 녹색엘이디칩에서나온광이혼합되어갭을통과할수있는데이로인해, 옐로우심현상이발생할수있다.위와같은갭은 PCB의사이즈공차,블랙 필름의사이즈오차및/또는절단면의불균일및공정중 PCB벤딩에의한갭의 발생및확장에기인하며,이와같은갭의발생및확장으로인해전술한것과 같은문제점이초래되고있다. It plays a role as a protective film to protect from the environment and as a light-absorbing film that increases the contrast ratio by absorbing light (especially external light). [7] In a conventional LED display module assembly, a gap occurs between the edges of black films that are adjacent to each other. Some of the light emitted from the LED chip of the edge pixel in the LED display module to which the corresponding black film is attached is formed of black film. It is emitted directly to the outside through the above-described gap without going through. For this reason, a light leakage phenomenon occurs between neighboring two LED display modules during operation of the LED display device. The light leakage phenomenon is the blue, green, or red light generated from the LED chip of the corresponding pixel. It may be a leaking blue seam, green seam, or red seam phenomenon, or a seam phenomenon in which mixed light leaks through the gap, especially yellow seam. In some cases, a red LED chip is located at the edge of the LED display module and the red LED chip is smaller than the adjacent green LED chip. Due to this, yellow seam may occur. The above gap is due to the size tolerance of the PCB, the size error of the black film and/or the unevenness of the cut surface, and the occurrence and expansion of the gap due to PCB bending during the process. Due to the occurrence and expansion of the problem, the same problems as described above have arisen.
[8] 한편,엘이디디스플레이모듈조립체있어서,인접하는픽셀들사이의간격은 일정한것이요구된다.그런데,하나의 엘이디디스플레이모듈내에서이웃하는 픽셀들사이의간격을일정하게하는것은쉽지만,이웃하는두엘이디 [8] On the other hand, in the LED display module assembly, the distance between adjacent pixels is required to be constant. However, it is easy to make the distance between neighboring pixels in one LED display module constant, but the two neighboring LED
디스플레이모듈들의이웃하는두픽셀들간간격을제어하는것은어려웠다. 이는여러요인이 있지만,해당엘이디디스플레이모듈의가장자리에위치한 엘이디칩과그해당엘이디디스플레이모듈의 PCB가장자리사이의거리가 일정할수없는것도하나의원인이될수있다. It was difficult to control the spacing between two neighboring pixels of the display modules. This has several factors, but one cause is that the distance between the LED chip located at the edge of the LED display module and the edge of the PCB of the LED display module is not constant.
발명의상세한설명 Detailed description of the invention
기술적과제 Technical task
[9] 본발명이해결하고자하는과제는마이크로엘이디칩에서발생한열이외부광 흡수시트를통해외부로더잘방출될수있는구조를갖는마이크로엘이디 디스플레이모듈을제공하는것이다. [9] The task to be solved by the present invention is to provide a micro LED display module having a structure in which heat generated from the micro LED chip can be better radiated to the outside through an external light absorbing sheet.
[1이 본발명이해결하고자하는다른과제는는두엘이디디스플레이모듈들 [1] Another task to be solved by this invention is the DuL display modules
각각의상면에부착된블랙필름들의가장자리사이의갭을통해빛샘이 발생하는것을억제하도록,블랙필름이디스플레이모듈의상면뿐아니라 측면도덮는마이크로엘이디디스플레이모듈조립체를제공하는것이다. In order to suppress light leakage through the gap between the edges of the black films attached to each top surface, the black film provides a micro-LED display module assembly that covers not only the top surface of the display module, but also the side.
과제해결수단 Problem solving means
[11] 본발명의일측면에따른마이크로엘이디디스플레이모듈은,기판;상기기판 상에매트릭스로배열되고,제 1마이크로엘이디칩,제 2마이크로엘이디칩및 제 3마이크로엘이디칩을포함하는,복수개의마이크로엘이디픽셀들;상기제 1 마이크로엘이디칩,상기제 2마이크로엘이디칩및상기제 3마이크로 2020/175843 1»（：1^1{2020/002275 엘이디칩의측면들과상면을덮도록상기기판상에형성된접착제층;및상기 접착제층상에형성되는외부광흡수시트를포함하며 ,상기외부광흡수시트는 매트릭스로배열된복수개의방열홀들을포함하며,상기방열홀들중 4개의 방열홀들의중심을연결한영역안에적어도하나의마이크로엘이디픽셀이 위치한다. [11] A micro LED display module according to an aspect of the present invention includes a substrate; a plurality of micro LED chips arranged in a matrix on the substrate, including a first micro LED chip, a second micro LED chip, and a third micro LED chip. Micro LED pixels; The first micro LED chip, the second micro LED chip, and the third micro 2020/175843 1»（：1^1{2020/002275 An adhesive layer formed on the substrate to cover the side and upper surfaces of the LED chip; And an external light absorbing sheet formed on the adhesive layer, wherein the external light The absorption sheet includes a plurality of radiating holes arranged in a matrix, and at least one microLED pixel is located in a region connecting the centers of the four radiating holes among the heat dissipating holes.
[12] 일실시예에따라,외부광흡수시트는블랙컬러를갖는광투과성시트인것이 바람직하다. [12] According to one embodiment, the external light absorbing sheet is preferably a light-transmitting sheet having a black color.
[13] 일실시예에따라,상기방열홀들의열들중 II번째방열홀열과 11+1번째방열홀 열사이에한열의마이크로엘이디픽셀들이위치한다. [13] According to an embodiment, one row of micro LED pixels is positioned between the II-th heat-radiating hole row and the 11+1-th heat-radiating hole row among the rows of the heat-radiating holes.
[14] 일실시예에따라,상기방열홀들의열들과행들중, II번째방열홀열과 [14] According to an embodiment, of the rows and rows of the heat dissipation holes, the second heat dissipation hole row and
11+1번째방열홀열사이와 III번째방열홀행과 II번째방열홀행사이에하나의 마이크로엘이디픽셀이위치한다. One microLED pixel is located between the 11+1st heat dissipation hole rows and between the IIIth heat dissipation hole rows and the II heat dissipation hole rows.
[15] 일실시예에따라,상기방열홀들은상기방열홀들은상기제 1마이크로 [15] According to an embodiment, the heat dissipation holes are the first micro
엘이디칩,제 2마이크로엘이디칩및제 3마이크로엘이디칩에서발생한열을 외부로방출한다. Heat generated from the LED chip, the second micro LED chip, and the third micro LED chip is discharged to the outside.
[16] 일실시예에따라,상기방열홀들각각은서로이웃하는두마이크로엘이디 픽셀들사이의제 1마이크로엘이디칩과제 3마이크로엘이디칩사이에 위치한다. According to an embodiment, each of the heat dissipation holes is located between a first micro LED chip and a third micro LED chip between two micro LED pixels adjacent to each other.
[17] 일실시예에따라,상기방열홀들각각은복수개의마이크로엘이디픽셀과 인접해있도록기다랗게형성된다. [17] According to an embodiment, each of the heat dissipation holes is elongated to be adjacent to a plurality of micro LED pixels.
[18] 일실시예에따라,상기접착제층의상면은상기외부광흡수시트에의해 [18] According to one embodiment, the upper surface of the adhesive layer is by the external light absorbing sheet
가려진영역과상기방열홀들에의해노출된영역들의높이가같다. The height of the area covered by the heat dissipation holes is the same.
[19] 일실시예에따라,상기접착제층은상기방열홀들에의해노출된영역들에 일정깊이함몰된리세스들을포함한다. According to an embodiment, the adhesive layer includes recesses recessed to a predetermined depth in regions exposed by the heat dissipation holes.
[2이 일실시예에따라,상기방열홀들각각은 30~200;/111의최대폭을갖는다. [2 According to this embodiment, each of the heat dissipation holes has a maximum width of 30 to 200;/111.
[21] 본발명의일측면에따른마이크로엘이디디스플레이모듈제조방법은,기판 상에제 1마이크로엘이디칩,제 2마이크로엘이디칩및제 3마이크로 [21] A method of manufacturing a micro LED display module according to one aspect of the present invention includes a first micro LED chip, a second micro LED chip and a third micro LED chip on a substrate.
엘이디칩을포함하는복수개의마이크로엘이디픽셀들을매트릭스로배열하는 단계;상기제 1마이크로엘이디칩,상기제 2마이크로엘이디칩및상기제 3 마이크로엘이디칩의측면들과상면을덮도록상기기판상에접착제층을 형성하는단계 ;및외부광흡수시트를상기접착제층상에형성하는단계를 포함하며,상기외부광흡수시트는매트릭스로배열된복수개의방열홀들을 포함하며,상기방열홀들중 4개의방열홀들의중심을연결한영역안에적어도 하나의마이크로엘이디픽셀이위치한다. Arranging a plurality of micro LED pixels including an LED chip in a matrix; an adhesive on the substrate to cover the sides and upper surfaces of the first micro LED chip, the second micro LED chip, and the third micro LED chip Forming a layer; and forming an external light-absorbing sheet on the adhesive layer, wherein the external light-absorbing sheet includes a plurality of heat-radiating holes arranged in a matrix, and four heat-radiating holes among the heat-radiating holes At least one micro LED pixel is located in the area connecting the centers of the fields.
[22] 일실시예에따라,상기외부광흡수시트를상기접착체층상에접착하기전에， 멀티핀들을이용하여상기외부광흡수시트에상기복수개의방열홀들을 형성한다. According to an embodiment, before bonding the external light-absorbing sheet to the adhesive layer, the plurality of heat-radiating holes are formed in the external light-absorbing sheet using multi-pins.
[23] 일실시예에따라,상기외부광흡수시트를상기방열홀들이형성되지않은 2020/175843 1»（：1^1{2020/002275 상태로상기접착제층상에형성한후에 ,멀티핀들을이용하여 ,상기외부광 흡수시트에복수개의방열홀들을형성한다. [23] According to one embodiment, the external light absorbing sheet is not formed with the heat dissipation holes. 2020/175843 1» (:1^1{2020/002275) After forming on the adhesive layer in a state, a plurality of heat-radiating holes are formed in the external light absorbing sheet using multi-pins.
[24] 일실시예에따라,상기외부광흡수시트를상기방열홀들이형성되지않은 상태로상기접착제층상에형성한후에,멀티핀들을하강하여상기외부광 흡수시트에복수개의방열홀들을형성하되,상기방열홀들형성후,상기 멀티핀들을더하강하여.상기접착제층에상기방열홀들과연결된방열 리세스들을형성한다. [24] According to an embodiment, after forming the external light-absorbing sheet on the adhesive layer in a state in which the heat-radiating holes are not formed, multi-pins are lowered to form a plurality of heat-radiating holes in the external light-absorbing sheet, After the heat dissipation holes are formed, the multi-pins are further lowered to form heat dissipation recesses connected to the heat dissipation holes in the adhesive layer.
[25] 일실시예에따라,상기방열홀들의열들중 II번째방열홀열과 11+1번째방열홀 열사이에한열의마이크로엘이디픽셀들이위치한다. According to an embodiment, one row of micro LED pixels is positioned between the II-th heat-radiating hole row and the 11+1-th heat-radiating hole row among the rows of the heat-radiating holes.
[26] 일실시예에따라,상기방열홀들의열들과행들중, II번째방열홀열과 [26] According to an embodiment, among the rows and rows of the heat dissipation holes, the second heat dissipation hole row and
11+ 1번째방열홀열사이와 III번째방열홀행과 II번째방열홀행사이에하나의 마이크로엘이디픽셀이위치한다. 11+ One micro LED pixel is located between the first heat dissipation hole rows and the III heat dissipation hole row and the II heat dissipation hole row.
[27] 일실시예에따라,상기복수개의방열홀들은상기제 1마이크로엘이디칩,제 2 마이크로엘이디칩및제 3마이크로엘이디칩에서발생한열을외부로 [27] According to an embodiment, the plurality of heat dissipation holes are used to transfer heat generated from the first micro LED chip, the second micro LED chip, and the third micro LED chip to the outside.
방출한다. Emit
[28] 일실시예에따라,상기방열홀들각각은원형인것이바람직하다. [28] According to an embodiment, it is preferable that each of the heat dissipation holes is circular.
[29] 일실시예에따라,상기방열홀들각각은서로이웃하는두마이크로엘이디 픽셀들사이의제 1마이크로엘이디칩과제 3마이크로엘이디칩사이에 위치한다. According to an embodiment, each of the heat dissipation holes is positioned between a first micro LED chip and a third micro LED chip between two micro LED pixels adjacent to each other.
발명의효과 Effects of the Invention
[3이 본발명에따른마이크로엘이디디스플레이모듈은마이크로엘이디픽셀들을 구성하는마이크로엘이디칩들의측면들과상면을덮도록접착제층이 [3] The micro LED display module according to the present invention has an adhesive layer covering the side and upper surfaces of the micro LED chips constituting the micro LED pixels.
형성되고,그접착제층상면에는외부광흡수시트가접합된다.외부광 And an external light absorbing sheet is bonded to the upper surface of the adhesive layer.
흡수시트는외부광을흡수하여명암비를높여주고,마이크로엘이디 The absorption sheet absorbs external light to increase the contrast ratio, and
디스플레이모듈이적용된마이크로엘이디디스플레이패널의외부를 고급스럽게해준다.게다가,본밤령에따른마이크로엘이디디스플레이모듈은, 방열홀들이형성된외부광흡수시트가적용되므로,마이크로엘이디칩들에서 발생한열의방출을촉진하여,그열로인한외부광흡수시트의들뜸현상이나 접착제층으로부터분리형상을방지한다. Micro-LED display module to which the display module is applied makes the exterior of the display panel luxurious. In addition, since the micro-LED display module according to the present day is applied with an external light-absorbing sheet with heat dissipation holes formed, it promotes the release of heat generated by the micro-LED chips. , Prevents the external light-absorbing sheet from being lifted due to its heat or from the adhesive layer.
[31] 본발명의다른여러이점이나효과들은이하실시예들의설명으로부터이해될 수있을것이다. [31] Many other advantages and effects of the present invention can be understood from the explanation of the examples below.
도면의간단한설명 Brief description of the drawing
[32] 도 1은본발명의제 1-1실시예에따른마이크로엘이디디스플레이모듈을 1 shows a micro LED display module according to a first embodiment of the present invention.
도시한사시도이다. It is an isometric view.
[33] 도 2는본발명의제 1-1실시예에따른마이크로엘이디디스플레이모듈을 2 is a micro LED display module according to the first embodiment of the present invention.
도시한분해사시도이다. It is an exploded perspective view shown.
[34] 도 3은본발명의제 1-1실시예예에따른마이크로엘이디디스플레이모듈을 2020/175843 1»（：1^1{2020/002275 도시한평면도이다. 3 is a micro-LED display module according to an embodiment 1-1 of the present invention. 2020/175843 1»（：1^1{2020/002275 This is a plan view of the city.
[35] 도 4는도 1내지도 3에도시된마이크로엘이디디스플레이모듈에서 [35] Figure 4 is a micro-LED display module shown in Figures 1 to 3
마이크로엘이디픽셀및/또는마이크로엘이디칩들과방열홀사이의위치 관계를설명하기위한도면이다. This is a drawing for explaining the positional relationship between the micro LED pixels and/or the micro LED chips and the heat dissipation hole.
[36] 도 5는도 3의쇼-쇼를따라취해진마이크로엘이디디스플레이모듈의 [36] Figure 5 is a micro-LED display module taken according to the show-show of Figure 3
단면도이다. It is a cross-sectional view.
[37] 도 6및도 7은본발명의제 1-1실시예에따른마이크로엘이디모듈 6 and 7 are micro LED modules according to the first embodiment 1-1 of the present invention
제조방법을설명하기위한도면이다. It is a drawing to explain the manufacturing method.
[38] 도 8은본발명의제 1-2실시예에따른마이크로엘이디디스플레이모듈을 8 is a micro LED display module according to a 1-2 embodiment of the present invention.
설명하기위한단면도이다. It is a cross-sectional view for explanation.
[39] 도 9는도 8에도시된마이크로엘이디디스플레이모듈의제조방법을 9 is a method for manufacturing the micro LED display module shown in FIG.
설명하기위한도면이다. This is a drawing for explanation.
[4이 도 및도 11은본발명의여러다양한실시예들을설명하기위한도면들이다. [4] Figures and 11 are views for explaining various embodiments of the present invention.
[41] 도 12는본발명의제 2-1실시예에따른엘이디디스플레이모듈조립체를 12 shows an LED display module assembly according to a second embodiment of the present invention.
설명하기부분적인분해사시도이다. This is a partial exploded perspective view to explain.
[42] 도 13은본발명의제 2-1실시예에따라블랙필름의하부면과엘이디 13 is a lower surface of a black film and an LED according to Example 2-1 of the present invention.
디스플레이모듈의하부면을볼수있도록도시한분해사시도이다. It is an exploded perspective view showing the lower surface of the display module to be seen.
[43] 도 14는본발명의제 2-1실시예에따른엘이디디스플레이모듈조립체를 14 shows an LED display module assembly according to a 2-1 embodiment of the present invention.
설명하기위한단면도이다. It is a cross-sectional view for explanation.
[44] 도 15는도 14의일부를확대한단면도이다. 15 is an enlarged cross-sectional view of a part of FIG. 14.
[45] 도 16,도 17및도 18은도 12내지도 15에도시된엘이디디스플레이모듈 16, 17 and 18 are the LED display module shown in Figs. 12 to 15
조립체의제조공정을설명하기위한도면들이다. These are drawings for explaining the manufacturing process of the assembly.
[46] 도 19는본발명의제 2-2실시예에따른엘이디디스플레이모듈조립체를 19 shows an LED display module assembly according to a 2-2 embodiment of the present invention.
설명하기위한단면도이다. It is a cross-sectional view for explanation.
[47] 도 20은본발명의제 2-3다른실시예에따른엘이디디스플레이조립체를 20 shows an LED display assembly according to another 2-3 embodiment of the present invention.
제조하는방법을설명하기위한도면이다. It is a drawing to explain how to manufacture.
[48] 도 21은도 20에도시된방법에따라제조된엘이디디스플레이조립체를 [48] FIG. 21 is a diagram illustrating an LED display assembly manufactured according to the method shown in FIG.
도시한단면도이다. It is a sectional view shown.
발명의실시를위한형태 Modes for the implementation of the invention
[49] 이하첨부된도면을참조로하여본발명의바람직한실시예들을상세히 [49] Preferred embodiments of the present invention are described in detail with reference to the accompanying drawings.
설명한다. Explain.
[5이 [제 1실시예들] [5] [First Embodiments]
[51] （제 1-1실시예） [51] (Example 1-1)
[52] 도 1은본발명의제 1-1실시예에따른마이크로엘이디디스플레이모듈을 1 shows a micro LED display module according to a first embodiment of the present invention.
도시한사시도이고,도 2는본발명의제 1-1실시예예에따른마이크로엘이디 디스플레이모듈을도시한분해사시도이고,도 3은본발명의제 1-1실시예에 따른마이크로엘이디디스플레이모듈을도시한평면도이고,도 4는도 1내지 도 3에도시된마이크로엘이디디스플레이모듈에서마이크로엘이디픽셀 또는마이크로엘이디칩들과방열홀사이의위치관계를설명하기위한 도면이고,도 5는도 3의 P、-P、를따라취해진마이크로엘이디디스플레이모듈의 단면도이다. FIG. 2 is an exploded perspective view showing a micro LED display module according to a first embodiment of the present invention, and FIG. 3 is a plan view showing a micro LED display module according to a first embodiment of the present invention. And Figure 4 is Figure 1 to 3 is a diagram for explaining the positional relationship between the micro LED pixels or micro LED chips and the heat dissipation hole in the micro LED display module shown in FIG. 3, and FIG. 5 is a micro LED display module taken according to P, -P, and It is a cross-sectional view.
[53] 도 1내지도 5에도시된바와같이,본발명의제 1-1실시예에따른마이크로 엘이디디스플레이모듈은,예를들면, PCB(Printed Circuit Boar), FPCB(Flexible Circuit Board,또는 TFT등과같이전기회로가형성된기판 (100)과,상기 기판 (100)상에매트릭스로배열된복수개의마이크로엘이디픽셀 (2)들을 포함한다.상기기판 (100)상에는제 1마이크로엘이디칩 (200a)들,제 2마이크로 엘이디칩 (200b)들및제 3마이크로엘이디칩 (200c)들을포함하는복수개의 마이크로엘이디칩들 (200a, 200b, 200c)들이실장되는데,나란하게모여 있는제 1 마이크로엘이디칩 (200a),제 2마이크로엘이디칩 (200b)및제 3마이크로 엘이디칩 (200c)이하나의마이크로엘이디픽셀 (2)을구성한다.본명세서에서, "마이크로엘이디칩”은적어도한변의길이가수백마이크로미터이하,더 바람직하게는 , 500/_이하인발광반도체칩을의미한다.그리고,상기마이크로 엘이디칩들 (200a, 200b, 200c)각각은제 1도전형반도체층과연결된제 1도전형 전극패드와제 2도전형반도체층과연결된제 2도전형전극패드를모두 포함하는플립칩형마이크로엘이디칩입인것이바람직하고,상기기판 (100)은 상기제 1도전형전극패드및상기제 2도전형전극패드에대응되는제 1전극및 제 2전극을포함한다. 1 to 5, the micro LED display module according to the first embodiment of the present invention, for example, PCB (Printed Circuit Boar), FPCB (Flexible Circuit Board, or TFT It includes a substrate 100 on which an electric circuit is formed, such as, and a plurality of micro LED pixels 2 arranged in a matrix on the substrate 100. On the substrate 100, first micro LED chips 200a , A plurality of micro LED chips 200a, 200b, 200c including the second micro LED chips 200 b and the third micro LED chips 200 c are mounted, the first micro LED chips 200 a ), the second micro LED chip 200b and the third micro LED chip 200c constitute one micro LED pixel 2. In the present specification, the "micro LED chip" refers to at least one side length of several hundred micrometers or less, More preferably, it means a light emitting semiconductor chip of 500/ _ or less. And, each of the micro LED chips 200a, 200b, 200c is a first conductive type electrode pad and a second conductive layer connected to the first conductive type semiconductor layer. It is preferable that a flip-chip type micro-LED chip including all of the second conductive type electrode pad connected to the type semiconductor layer is included, and the substrate 100 is a material corresponding to the first conductive type electrode pad and the second conductive type electrode pad. It includes a first electrode and a second electrode.
[54] 또한,상기마이크로엘이디디스플레이모듈은,상기제 1마이크로 [54] In addition, the micro LED display module, the first micro
엘이디칩 (200a),상기제 2마이크로엘이디칩 (200b)및상기제 3마이크로 엘이디칩 (200c)을포함하는모든마이크로엘이디칩들의측면들과상면을 덮도록상기기판상 (100)에도포됨으로써적용된접착제층 (300)과,상기 접착제층 (300)상에접합되는외부광흡수시트 (400)를포함한다. It was applied by being applied on the substrate 100 so as to cover the side and upper surfaces of all micro LED chips including the LED chip 200a, the second micro LED chip 200b and the third micro LED chip 200c. It includes an adhesive layer 300 and an external light absorbing sheet 400 bonded to the adhesive layer 300.
[55] 상기접착제층 (300)은투명아크릴수지로형성될수있으며 ,상기마이크로 엘이디칩들 (200a, 200b, 200c)의두께보다큰높이로형성되어상기마이크로 엘이디칩들 (200a, 200b, 200c)의측면들과상면들을모두덮을수있다.그리고, 상기접착제층 (300)은평평한상면을가지며,따라서상기접착제층 (300)의 평평한상면에접합된외부광흡수시트 (400)도평탄한상태로존재한다.상기 외부광흡수시트 (400)는태양광과같은외부광을흡수하여디스플레이화면의 명암비를높여주고외부광반사로인한눈부심을방지하는기능을할있다.더 나아가,상기외부광흡수시트 (400)는보호층으로서의기능도할수있다.상기 외부광흡수시트 (400)는,광을흡수하는다크컬러 (가장바람직하게는,블랙 컬러 )를갖는광투광성수지시트로형성된다.본실시예에 있어서는, PET 수지를기반으로하는블랙컬러외부광흡수시트 (400)가이용된다. [55] The adhesive layer 300 may be formed of a transparent acrylic resin, is formed to a height greater than the thickness of the micro LED chips (200a, 200b, 200c), the micro LED chips (200a, 200b, 200c) And, the adhesive layer 300 has a flat upper surface, and therefore the external light absorbing sheet 400 bonded to the flat upper surface of the adhesive layer 300 is also present in a flat state. The external light absorption sheet 400 has a function of increasing the contrast ratio of the display screen by absorbing external light such as sunlight and preventing glare caused by external light reflection. Furthermore, the external light absorption sheet 400 ) May also function as a protective layer. The external light-absorbing sheet 400 is formed of a light-transmitting resin sheet having a dark color (most preferably, black color) that absorbs light. In this embodiment, , A black color external light absorbing sheet 400 based on PET resin is used.
[56] 또한,상기외부광흡수시트 (400)는상기제 1마이크로엘이디칩 (200a),제 2 마이크로엘이디칩 (200b)및제 3마이크로엘이디칩 (200c)에서발생한열을 2020/175843 1»（：1^1{2020/002275 외부로방출하는복수개의방열홀 (420)들을포함한다.상기방열홀들각각은 80-200 /패의최대폭을갖는다.본실시예에서는,방열홀 (420)들각각의중심에서 주변마이크로엘이디픽셀 (2)들까지의거리가균일하도록원형으로형성된다. 따라서,상기방열홀 (420)의최소폭과최대폭은상기방열홀 (420)의직경과같다. 상기방열홀 (420)의최대폭이 80^미만인경우,방열효과가떨어지게되고, 상기방열홀 (420)의최대폭이 200//111를초과하는경우,외부광흡수시트 (400)가 접착제층 (300)에접착되어 있는면적이과도하게감소된다. In addition, the external light absorption sheet 400 is the heat generated from the first micro LED chip (200a), the second micro LED chip (200b) and the third micro LED chip (200c) 2020/175843 1 » (:1^1{2020/002275) It includes a plurality of heat dissipation holes 420 that are discharged to the outside. Each of the heat dissipation holes has a maximum width of 80-200 /L. In this embodiment, The heat dissipation holes 420 are formed in a circular shape so that the distance from the center of each of the peripheral micro LED pixels 2 is uniform. Accordingly, the minimum width and the maximum width of the heat dissipation hole 420 are the same as the diameter of the heat dissipation hole 420. When the maximum width of the heat dissipation hole 420 is less than 80^, the heat dissipation effect decreases, and when the maximum width of the heat dissipation hole 420 exceeds 200//111, the external light absorbing sheet 400 is an adhesive layer 300 The area attached to) is excessively reduced.
[57] 방열홀 (420)들은상기외부광흡수시트 (420)에매트릭스배열로형성되어 [57] The heat dissipation holes 420 are formed in a matrix arrangement on the external light absorbing sheet 420
기판 (100)에매트릭스배열로배치된마이크로엘이디픽셀 (2)들과일정한 관계를갖는다. It has a certain relationship with the micro LED pixels 2 arranged in a matrix arrangement on the substrate 100.
[58] 도 4에가장잘도시된바와같이 ,상기방열홀 (420)들의열들중 !!번째방열홀 열과 11+1번째방열홀열사이에한열의마이크로엘이디픽셀 (2)들이위치한다. 이때한열내에서이웃하는두마이크로엘이디픽셀 (2)들끼리는서로같은 파장의마이크로엘이디칩들끼리이웃하여있다.즉,제 1마이크로 As best shown in FIG. 4, among the rows of the heat dissipation holes 420, one row of micro LED pixels 2 is located between the !!th heat dissipation hole row and the 11+1 th heat dissipation hole row. At this time, the two microLED pixels (2) neighboring within a row are adjacent to each other microLED chips of the same wavelength, i.e., the first microchip.
엘이디칩 (200幻은제 1마이크로엘이디칩 (200幻과마주보며이웃해있고,제 2 마이크로엘이디칩 (200비은제 2마이크로엘이디칩 (200비과마주보며이웃해 있고,제 3마이크로엘이디칩 (200 은제 3마이크로엘이디칩 (200 과마주보며 이웃해있다.또한,상기방열홀 (420)들의행들중 111번째방열홀행과 111+1번째 방열홀행사이에는한행의마이크로엘이디픽셀 (2)들이위치한다. LED chip (200 yen is the first micro LED chip (200 yen and is close to each other, the second micro LED chip (200) is the second micro LED chip (200 is the first micro LED chip, and the third micro LED chip (200 is silver) 3 Micro LED chips (it is adjacent to each other over 200. In addition, one row of micro LED pixels (2) is located between the 111th heat dissipation hole row and the 111+1th heat dissipation hole row among the rows of the heat dissipation holes 420. .
[59] 이때 ,한행내에서이웃하는두마이크로엘이디픽셀 (2)들끼리는서로다른 파장의마이크로엘이디칩들끼리이웃하여있다.즉,제 1마이크로 [59] At this time, the two microLED pixels (2) neighboring within a row are adjacent to each other micro LED chips of different wavelengths. That is, the first micro LED chips are adjacent to each other.
엘이디칩 (200幻과제 3마이크로엘이디칩 (200이이서로마주보며이웃해있다. LED chip (200 yen task 3 micro LED chip (200 are neighbors looking at each other).
[6이 더나아가,상기방열홀 (420)들의열들과행들중, II번째방열홀열과 11+1번째 방열홀열사이와 111번째방열홀행과 II번째방열홀행사이에하나의마이크로 엘이디픽셀 (2)이위치한다.그리고,상기방열홀 (420)들중인접해있는 4개의 방열홀 (420)들의중심을연결한직사각형또는정사각형영역안에는항상 하나의마이크로엘이디픽셀 (2)이위치하는것이바람직하다.위와같이서로 모여 있는 4개의방열홀 (420)들의중심을연결한직사각형또는정사각형영역 안에,특히,그영역의중심부근에마이크로엘이디픽셀 (2)이배치됨으로써,각 마이크로엘이디픽셀 (2)은 4개의방열홀 (420)들과거의같은간격을가지고 배치될수있으며,이에따라,마이크로엘이디픽셀 (2)에서발생한열이 방열홀 (420)들까지전달되는경로들이거의일정하면서도짧아질수있다. [6 goes further, one micro LED pixel between the rows and rows of the heat dissipation holes 420, between the IIth heat dissipation hole row and the 11+1th heat dissipation hole row, and the 111th heat dissipation hole row and the IIth heat dissipation hole row ( 2) In addition, it is preferable that one micro LED pixel (2) is always located in a rectangular or square area connecting the centers of the four adjacent heat radiation holes 420 among the heat radiation holes 420. In the rectangular or square area connecting the centers of the four heat-radiating holes 420 gathered together as above, in particular, micro LED pixels 2 are arranged near the center of the area, so that each micro LED pixel 2 has 4 The heat dissipation holes 420 may be arranged at approximately the same distance, and thus, the paths through which the heat generated from the micro LED pixels 2 is transmitted to the heat dissipation holes 420 may be almost constant and short.
그리고,전영역에설쳐,서로모여있는 4개의방열홀 (420)들이해당마이크로 엘이디픽셀 (420)의주변을둘러쌈으로써,마이크로엘이디모듈전영역에걸쳐 균일한방열이일어날수있다. In addition, the four heat dissipation holes 420 arranged in the entire area and gathered together surround the periphery of the micro LED pixel 420, so that uniform heat dissipation can occur over the entire area of the micro LED module.
[61] 도 5에잘도시된바와같이,기판 (100)은전극들이형성된부분을제외하면 5, the substrate 100 except for the portion where the electrodes are formed
거의평평한상면을가지며 ,그위에마이크로엘이디픽셀 (2)들을구성하는제 1 마이크로엘이디칩 (20(切),제 2마이크로엘이디칩 (200비및제 3마이크로 2020/175843 1»（：1^1{2020/002275 엘이디칩 (200 이플립칩본딩방식으로실장되어있다.그리고, The first micro LED chip (20 (切)) and the second micro LED chip (200 and third micro LED chips (200 and 3 micro LED chips) are formed on the top surface and are 2020/175843 1»（：1^1{2020/002275 LED chip (200 is mounted by flip chip bonding method. And,
접착제층 (300)은상기제 1마이크로엘이디칩 (200幻,제 2마이크로 Adhesive layer 300 is the first micro LED chip (200 yen, the second micro
엘이디칩 (200비및제 3마이크로엘이디칩 (200 의측면들과상면들을모두 덮도록상기기판 (100)상에적용된다.상기접착체층 (300)의상면은평평하며 , 상기접착제층 (300)의평평한상면상으로방열홀 (420)들이형성된외부광 흡수시트 (400)가접합되어 있다.이때,상기접착제층 (300)의상면영역은상기 외부광흡수시트 (400)에의해가려진영역 1)과상기방열홀 (420)들에의해 외부로노출된영역知2)들로구분된다.그리고상기노출된영역 2)들은상기 외부광흡수시트 (400)에의해가려진영역 ( )과동일평면상에위치하여그 높이가같다. It is applied on the substrate 100 so as to cover both the side surfaces and the upper surfaces of the LED chip 200 and the third micro LED chip 200. The upper surface of the adhesive layer 300 is flat, and the adhesive layer 300 is The external light absorbing sheet 400 in which the heat dissipating holes 420 are formed is bonded on the flat top surface. In this case, the upper surface area of the adhesive layer 300 is an area covered by the external light absorbing sheet 400 1) It is divided into areas exposed to the outside by the heat dissipation holes 420. And the exposed areas 2) are on the same plane as the area covered by the external light absorbing sheet 400. And its height is the same.
[62] 도 6및도 7은본발명의제 1-1실시예에따른마이크로엘이디모듈 6 and 7 are a micro LED module according to the first embodiment 1-1 of the present invention
제조방법을설명하기위한도면들이다. These are drawings to explain the manufacturing method.
[63] 먼저도 6을참조하면,방열홀 (420)들이외부광흡수시트 (400)를미리제작하는 과정을볼수있다.각각이 80-200 ^의미세직경을갖는다수의 First, referring to FIG. 6, it can be seen that the heat dissipation holes 420 are pre-fabricated with the external light absorbing sheet 400. Each of them has a fine diameter of 80-200^.
방열홀 (420)들을외부광흡수시트 (400)에한번에형성하기위해,하나의 베이스 (4)에일체화되어동시에움직일수있는동일직경의멀티핀 (3)들이 이용된다.구멍없이준비된외부광흡수시트 (400)에대하여멀티핀 (3)들을 하강시켜그멀티핀 (3)들로외부광흡수시트 (400)를펀칭하며,이에의해,다수의 방열홀 (420)들이형성된다.다음,도 7에도시된바와같이 ,제 1마이크로 엘이디칩 (200幻들,제 2마이크로엘이디칩 (200비들및제 3마이크로 In order to form the heat dissipation holes 420 in the external light absorption sheet 400 at one time, multi-pins 3 of the same diameter, which are integrated in one base 4 and can move at the same time, are used. External light absorption prepared without holes is used. The multi-pins 3 are lowered against the sheet 400, and the external light-absorbing sheet 400 is punched with the multi-pins 3, thereby forming a plurality of heat dissipation holes 420. Next, FIG. As shown in 7, the first micro LED chip (200 幻, the second micro LED chip (200 beads and the third micro LED chip)
엘이디칩 (200 들을덮도록기판 (100)상에도포적용된접착제층 (300)상의 평평한상면상에상기방열홀 (420)들이형성된외부광흡수시트 (400)를 접합한다. The external light-absorbing sheet 400 on which the heat dissipation holes 420 are formed on a flat top surface of the adhesive layer 300 applied on the substrate 100 to cover the LED chips 200 is bonded.
[64] 본실시예에서는멀티핀을이용하여외부광흡수시트 (400)에다수의 [64] In this embodiment, a plurality of external light absorbing sheets 400 are applied by using multi-pins.
방열홀 (420)들을형성하지만,마스크를이용한식각이나레이저가공에의해 다수의방열홀 (420)들을형성할수도있다. Although the heat dissipation holes 420 are formed, a plurality of heat dissipation holes 420 may be formed by etching or laser processing using a mask.
[65] 비교예로서 ,방열홀들없는외부광흡수시트 (400)를적용한경우,외부광 [65] As a comparative example, when the external light absorbing sheet 400 without heat dissipation holes is applied, external light
흡수시트 (400)에의해접착제층 (300)의상면전체영역이막혀있게되어, 마이크로엘이디칩점등시마이크로엘이디모듈의표면온도가대략 60ᄋ(：에 이르게된다.이와같은상태가상당시간유지되면,마이크로엘이디칩에 심각한열적대미지가가해지는것은물론이고외부광흡수시트 (400)가 접착제층 (300)에서떨어지는심각한문제를초래할수있다. The entire area of the upper surface of the adhesive layer 300 is blocked by the absorbent sheet 400, so that the surface temperature of the microLED chip is turned on and the surface temperature of the microLED module reaches approximately 60°(:. When this state is maintained for a considerable time, ,Severe thermal damage is applied to the micro LED chip, as well as a serious problem in which the external light absorbing sheet 400 falls off the adhesive layer 300.
[66] 그에반해,본실시예는마이크로엘이디칩들 (200 20(¾, 200 에서발생하여 접착제층 (300)으로전달된열이전술한것과같은방열홀 (420)들을통해외부로 방출되므로,마이크로엘이디칩들 (200 200江 200 들에대한열적인영향을 크게줄여줄수있다.본실시예에따르면,마이크로엘이디모듈의최대표면 온도가대략 53~56ᄋ (:로비교예보다약 4~7°0작다. On the other hand, in the present embodiment, since the heat generated in the micro LED chips 200 20 (¾, 200 and transferred to the adhesive layer 300 is discharged to the outside through the heat dissipation holes 420 as described above, It is possible to greatly reduce the thermal effect on the micro LED chips (200 200 江 200. According to this embodiment, the maximum surface temperature of the micro LED module is approximately 53 to 56 o (: about 4 to 7 degrees than the comparative example) 0 is small.
[67] (제 1_2실시예) 2020/175843 1»（：1^1{2020/002275 [67] (1_ the second embodiment) 2020/175843 1»（：1^1{2020/002275
[68] 도 8은본발명의제 1-2실시예에따른마이크로엘이디디스플레이모듈을 설명하기위한단면도이다. 8 is a cross-sectional view for explaining a micro LED display module according to the 1-2 embodiment of the present invention.
[69] 도 8에도시된바와같이,본실시예에따른마이크로엘이디디스플레이 [69] As shown in FIG. 8, a micro-LED display according to this embodiment
모듈은,앞선실시예와마찬가지로,기판 (100)과,상기기판 (100)상에 The module, as in the previous embodiment, on the substrate 100 and the substrate 100
매트릭스로배열되고,각각이제 1마이크로엘이디칩 (200幻,제 2마이크로 엘이디칩 (200비및제 3마이크로엘이디칩 (200 을포함하는,복수개의마이크로 엘이디픽셀 (2)들과,상기제 1마이크로엘이디칩 (200幻，상기제 2마이크로 엘이디칩 (200비및상기제 3마이크로엘이디칩 (200 의측면들과상면을덮도록 상기기판 (100)상에적용된접착제층 (300)과,상기접착제층 (300)상에접합되고 상기제 1마이크로엘이디칩 (20(切)，상기제 2마이크로엘이디칩 (200비및상기 제 3마이크로엘이디칩 (200 서발생한열을외부로방출하는복수개의 방열홀 (420)들이형성된외부광흡수시트 (400)을포함한다. Arranged in a matrix, each of the first micro LED chip (200 幻, the second micro LED chip (200 ratio and the third micro LED chip (200), including a plurality of micro LED pixels (2)), the first micro LED chip (200)) The adhesive layer 300 applied on the substrate 100 to cover the side and upper surfaces of the LED chip 200, the second micro LED chip 200 and the third micro LED chip 200, and the adhesive layer (300) A plurality of heat dissipation holes that are bonded to the phase and dissipate heat generated by the first micro LED chip 20 and the second micro LED chip 200 and the third micro LED chip 200 to the outside ( It includes an external light absorbing sheet 400 in which 420 are formed.
이 그에더하여,본실시예에따른마이크로엘이디디스플레이모듈은상기 In addition to this, the micro LED display module according to this embodiment is
접착제층 (300)에형성된복수의방열리세스 (320)들을포함한다.상기방열 리세스 (320)들은상기접착제층 (300)의상면영역들중상기방열홀 (420)들에 의해노출된상면영역들이일정깊이함몰되어형성된다.상기복수의방열 리세스 (320)들각각은상기방열홀 (420)들각각과연결되어 있다.앞선 It includes a plurality of heat dissipation recesses 320 formed in the adhesive layer 300. The heat dissipation recesses 320 are an upper surface exposed by the heat dissipation holes 420 among the upper surface regions of the adhesive layer 300 Regions are formed by being recessed to a certain depth. Each of the plurality of heat dissipation recesses 320 is connected to each of the heat dissipation holes 420.
실시예에서는,마이크로엘이디칩들 (200 200江 200 에서발생하여 In the embodiment, micro LED chips (200 200 江 200 occurs at
접착체층 (300)에전달된열이상기접착체층 (300)의평평한상면에서상기 방열홀 (420)들을통해외부로방출되지만,본실시예에서는,상기 The heat transferred to the adhesive layer 300 is radiated to the outside through the heat dissipation holes 420 on the flat top surface of the adhesive layer 300, but in this embodiment, the
접착체층 (300)에형성된방열리세스 (320)내로상당량의열이전달되어그열이 방열홀 (420)을통해외부로방출되므로,보다더효율적이방열이이루어질수 있다.본실시예에따르며,상기방열리세스 (320)들,각각은바닥면이콘형태의 경사면 (322)으로형성되어,바닥이수평면으로되어 있는것과비교하여,방열 면적이크며,이에의해,더욱더방열효율을높일수있다.더나아가,상기방열 리세스 (320)가상기기판 (100)과접하는깊이까지형성될수있다.더나아가, 기판 (100)을관통하는홀이추가로형성되어,그홀이방열리세스 (320)와연결될 수도있다. Since a considerable amount of heat is transferred into the heat dissipation recess 320 formed in the adhesive layer 300 and the heat is discharged to the outside through the heat dissipation hole 420, more efficient heat dissipation can be achieved. According to the present embodiment, the above The heat dissipation recesses 320, each of which are formed with a bottom surface icon-shaped inclined surface 322, have a large heat dissipation area compared to the floor having a horizontal plane, thereby further increasing the heat dissipation efficiency. , The heat dissipation recess 320 may be formed to a depth contacting the substrate 100. Furthermore, a hole passing through the substrate 100 may be additionally formed, and the hole may be connected to the heat dissipation recess 320. .
1] 도 9는도 8에도시된마이크로엘이디모듈제조방법을설명하기위한 1] FIG. 9 is for explaining the method of manufacturing the micro LED module shown in FIG.
도면이다. It is a drawing.
2] 도 9를참조하면,각각이기판 (100)상에실장된제 1마이크로엘이디칩 (20(切), 제 2마이크로엘이디칩 (200비및제 3마이크로엘이디칩 (200 을포함하도록, 복수개의마이크로엘이디픽셀 (2)들이상기기판 (100)상에매트릭스배열된다. 다음,상기제 1마이크로엘이디칩 (20(切)，상기제 2마이크로엘이디칩 (200비및 상기제 3마이크로엘이디칩 (200 의측면들과상면을덮도록상기기판 (100) 상에접착제층 (300)이도포된다.다음,방열홀들이형성되지않은상태의외부광 흡수시트 (400)가상기접착제 (300)층상에접합된다.다음,베이스 (4)에 2] Referring to FIG. 9, a plurality of first micro LED chips (20 (切) and second micro LED chips (200 and a third micro LED chip 200 are included) respectively mounted on the substrate 100 Four micro LED pixels 2 are arranged in a matrix on the substrate 100. Next, the first micro LED chip 20, the second micro LED chip 200 and the third micro LED chip An adhesive layer 300 is applied on the substrate 100 so as to cover the side surfaces and the upper surface of 200. Next, an external light absorbing sheet 400 in a state in which no heat dissipation holes are formed is placed on the adhesive 300 layer. Next, to the base (4)
일체화되어동시에움직일수있는멀티핀 (3)들을이용하여,상기외부광 2020/175843 1»（：1/10公020/002275 톱수시트 (400)에복수개의 방열폴 (420)들을형성한다.다시 말해,상기외부광 흡수시트 (400)를상기 방열홀 (420)들이 형성되지 않은상태로상기 Using multi-pins (3) that are integrated and can move at the same time, the external light 2020/175843 1»（：1/10公020/002275 A plurality of heat dissipation poles 420 are formed on the top number sheet 400. In other words, the external light absorption sheet 400 is formed with the heat dissipation holes 420 In the unformed state
접착제층 (300)상에 접합한후에,멀티핀들 (3)을하강하여상기 외부광 흡수시트 (400)에복수개의 방열홀 (420)들을형성하되,상기 방열홀 (420)들이 형성된후,상기멀티핀 (3)들을더하강하여.상기접착제층 (300)에상기 방열홀 (420)들과연결된방열리세스 (320)들을형성한다.상기멀티핀 (3)들 각각의하단을뾰족한콘형상으로하면,보다더용이하게외부광 After bonding on the adhesive layer 300, the multi-pins 3 are lowered to form a plurality of heat dissipation holes 420 in the external light absorbing sheet 400, but after the heat dissipation holes 420 are formed, the multi-pins 3 The fins (3) are further lowered to form heat-radiating recesses (320) connected to the heat-radiating holes (420) in the adhesive layer (300). The bottom of each of the multi-fins (3) is formed in a sharp cone shape. If you do, it is easier to use external light
흡수시트 (400)와접착제층 (300)에 방열홀 (420)들과방열리세스 (320)들을형성할 수있으며,그뾰족한콘형상에 의해,방열리세스 (320)들의바닥형상을방열 면적을증가시킬수있는콘형상으로만들수도있다. It is possible to form heat dissipation holes 420 and heat dissipation recesses 320 in the absorbent sheet 400 and the adhesive layer 300, and by the sharp cone shape, the bottom shape of the heat dissipation recesses 320 is a heat dissipation area. It can also be made into a cone shape that can be increased.
본실시예에서는멀티핀들을이용하여 외부광흡수시트 (400)에다수의 방열홀 (420)들을형성하지만,마스크를이용한식각이나레이저가공에 의해 다수의 방열홀 (420)들을형성할수도있다.식각이라레이저를이용하면, 기판이나마이크로엘이디칩의손상없이,접착제층 (300)과외부광 In the present embodiment, a plurality of heat dissipation holes 420 are formed in the external light absorbing sheet 400 using multi-pins, but a plurality of heat dissipation holes 420 may be formed by etching or laser processing using a mask. By using a laser for etching, the adhesive layer 300 and external light are not damaged without damaging the substrate or the micro LED chip.
흡수시트 (400)에만방열리세스 (320)들과방열홀 (420)들을정밀하게 형성할수 있다. Only the absorption sheet 400 can be precisely formed with the heat radiation recesses 320 and the heat radiation holes 420.
[74] (제 1-3실시예) [74] (Example 1-3)
도 및도 11은본발명의또다른다른실시예들을설명하기 위한마이크로 엘이디모듈의평면도들이다. And FIG. 11 are plan views of a micro LED module for explaining still other embodiments of the present invention.
[76] 도 10및도 11에도시된실시예에 있어서도,방열홀 (420)들의 열들중 !!번째 방열홀열과 11+1번째방열홀열사이에 한열의마이크로엘이디픽셀 (2)들이 위치한다.또한,해당마이크로엘이디픽셀 (2)내 이웃하는마이크로엘이디칩들 사이 (12(切와 12아5사이 및 12( 와 120 에상기 방열홀 (420)보다작은폭을갖는 In the embodiment shown in FIGS. 10 and 11 as well, one row of micro LED pixels 2 is positioned between the !!th heat dissipation hole row and the 11+1th heat dissipation hole row among the rows of the heat dissipation holes 420. In addition, between neighboring micro LED chips in the corresponding micro LED pixel (2) (between 12 (between 切 and 12 Ah 5 and 12 (and 120)),
]] 협폭방열홀 (421)들이추가적으로더 형성될수도있다. ]] Narrow-width heat dissipation holes 421 may be additionally formed.
90 90
7 787 7 735 다만,앞선실시예에 있어서는,서로모여 있는 4개의 방열홀 (420)들이 7 787 7 735 However, in the previous embodiment, four heat dissipation holes 420 gathered together
인접하면서마주하는사각형 영역 안에하나의마이크로엘이디픽셀 (2)이 위치하지만,도 10및도 11에도시된실시예에서는,이웃하는두방열홀 (420, Although one micro LED pixel 2 is located in a rectangular area adjacent to each other, in the embodiment shown in FIGS. 10 and 11, adjacent two radiating holes 420
420)들사이 영역에하나의마이크로엘이디픽셀 (2)또는일렬의마이크로 엘이디픽셀 (2)들이 위치한다.그리고,방열홀 (420)들각각은서로이웃하는두 마이크로엘이디픽셀들 (2, 2)사이의 제 1마이크로엘이디칩 (200幻과제 3 마이크로엘이디칩 (200이사이에위치한다. One micro LED pixel (2) or a row of micro LED pixels (2) are located in the area between the 420), and the heat dissipation holes 420 are two micro LED pixels (2, 2) adjacent to each other. The first micro LED chip between 200 and the third micro LED chip between 200 is located.
[78] 특히,도 11을참조하면,상기방열홀 (420)들각각은복수개의마이크로엘이디 픽셀,본실시예에서는 , 3개의마이크로엘이디픽셀 (2)과모두인접해 있도록 기다랗게 형성된다. In particular, referring to FIG. 11, each of the heat dissipation holes 420 is elongated so as to be in contact with a plurality of micro LED pixels, and in this embodiment, all three micro LED pixels 2.
［제 2실시예들］ [Second Examples]
81； (제 2-1실시예) 81; (Example 2-1)
82 도 12는본발명의 제 2-1실시예에따른엘이디디스플레이모듈조립체를 2020/175843 1»（：1^1{2020/002275 설명하기부분적인분해사시도이고,도 13은본발명의제 2-1실시예에따라 블랙필름의하부면과엘이디디스플레이모듈의하부면을볼수있도록도시한 분해사시도이고,도 14는본발명의제 2-1실시예에따른엘이디디스플레이 모듈조립체를설명하기 위한단면도이고,도 15는도 14의 일부를확대한 단면도이고,도 16,도 17및도 18은도 12내지도 15에도시된엘이디 82 FIG. 12 is a diagram illustrating an LED display module assembly according to Embodiment 2-1 of the present invention. 2020/175843 1»（：1^1{2020/002275 is a partial exploded perspective view to explain, and FIG. 13 is a view so that the lower surface of the black film and the lower surface of the LED display module can be seen according to the second embodiment of the present invention. Fig. 14 is an exploded perspective view, and Fig. 14 is a cross-sectional view for explaining an LED display module assembly according to a second embodiment of the present invention, Fig. 15 is an enlarged sectional view of a part of Fig. 14, and Figs. 16, 17 and 18 is the LED shown in Figs. 12 to 15
디스플레이모듈조립체의 제조공정을설명하기위한도면들이다. These are drawings for explaining the manufacturing process of the display module assembly.
[83] 도 12내지도 15에도시된바와같이,본발명의제 2- 1실시예에 따른엘이디 디스플레이모듈조립체는,대략사각판상을갖는프레임 (200)및상기 12 to 15, the LED display module assembly according to the second embodiment of the present invention, a frame 200 having a substantially rectangular plate shape and the above
프레임 (200)의상에 행렬로배열된복수개의 엘이디 디스플레이모듈 (100)들과, 상기 디스플레이모듈 (100)들각각의상면및측면을덮도록형성된광흡수 수단들을포함한다. A plurality of LED display modules 100 arranged in a matrix on the frame 200, and light absorbing means formed to cover an upper surface and a side surface of each of the display modules 100 are included.
[84] 상기프레임 (200)은금속또는플라스틱소재로형성되어 강성을갖는것이 [84] The frame 200 is formed of a metal or plastic material to have rigidity
바람직하다.본실시예에서는,개구부없는프레임 (200)이 이용되었지만,예컨대, 바형상의판들이조립됨으로써 여러 개의사각형 개구부들이 형성된판형상 프레임 (200)이 이용될수도있다.또한,본실시예에서는,평탄면디스플레이 구현을위해프레임 (200)의상부면이 평탄면으로만되어 있지만,곡면 In the present embodiment, the frame 200 without openings is used, but a plate-shaped frame 200 in which several rectangular openings are formed may also be used, for example, by assembling bar-shaped plates. In addition, in this embodiment, To implement a flat surface display, the upper surface of the frame 200 is only a flat surface, but
디스플레이구현을위해상부면이곡면으로된프레임이 이용될수도있음에 유의한다.상기프레임 (200)에는다수의스터드홀 (210)들이 형성된다.본 실시예에서는,하나의 엘이디디스플레이모듈 (100)각각에 대하여사각형으로 배열된 4개의스터드홀 (210)들이 할당된다. Note that a frame with a curved upper surface may be used for the display implementation. A plurality of stud holes 210 are formed in the frame 200. In this embodiment, one LED display module 100, respectively Four stud holes 210 arranged in a square are allocated.
[85] 상기 엘이디 디스플레이모듈 (100)들은직사각형또는정사각형 [85] The LED display modules 100 are rectangular or square
회로기판 ( 0)과,상기회로기판 ( 0)의상면에실장되어복수개의픽셀을 형성하는복수개의 엘이디 칩 (120 12015, 120 들을포함한다.픽셀각각은서로 인접해 있고일렬로배열된적색 엘이디칩 (120幻，녹색 엘이디 칩 (120비,청색 엘이디 칩 (120 으로구성된다.상기복수개의 엘이디디스플레이모듈 (100)들은 서로인접해 있는제 1및제 2엘이디 디스플레이모듈 (100, 0)을포함한다. A circuit board (0) and a plurality of LED chips (120 12015, 120) are mounted on the upper surface of the circuit board (0) to form a plurality of pixels. Each of the pixels is adjacent to each other and is arranged in a line with red LEDs arranged in a row. Chip (120 ×, green LED chip (120 ratio, blue LED chip (120)). The plurality of LED display modules (100) include first and second LED display modules (100, 0) adjacent to each other. .
[86] 상기광흡수수단들,제 1및제 2광흡수수단은상기 제 1및제 2엘이디 [86] The light absorbing means, the first and second light absorbing means are the first and second LEDs
디스플레이모듈 (100, 100)에 대응되는제 1및제 2블랙필름 (300, 300)을 포함한다.상기 제 1및제 2블랙필름 (300)은광 (특히,외부광)을흡수하여 디스플레이 화면의 명암비를높이는광흡수수단으로서의 역할과더불어상기 엘이디 칩 (120 12(¾, 120 들을외부환경으로부터보호하는보호필름으로서의 역할을한다.이때,상기제 1및제 2블랙필름 (300, 300)이상기 엘이디칩 (120 12(¾, 120이들에서 나온광을내보내도록광투과성을가짐은물론이다.본 명세서에서,용어 "블랙필름”은광을흡수할수있는어두운색 계열의물질을 포함하는필름의의미를포함하는것으로정의한다. It includes first and second black films 300 and 300 corresponding to the display modules 100 and 100. The first and second black films 300 absorb light (especially, external light) to adjust the contrast ratio of the display screen. In addition to its height as a light absorbing means, it serves as a protective film that protects the LED chips 120 12 (¾, 120 from the external environment. At this time, the first and second black films 300 and 300) include the LED chips 120. 12 (¾, 120 of course have light transmittance to emit light from them. In this specification, the term "black film" is defined to include the meaning of a film containing a dark-colored material capable of absorbing light. .
[87] 또한,상기제 1및제 2엘이디디스플레이모듈 (100, 100)각각은상기 엘이디 칩들 (120 12(¾, 120 의측면을덮도록형성된투광성몰딩부 (140)를더포함할 수있다.그리고이러한투광성몰딩부 (140)는광을흡수하는블랙수지 재료로 2020/175843 1»（：1^1{2020/002275 형성되거나클리어수지 재료로형성될수있다.이에 따라,상기 엘이디 디스플레이모듈 (100)의상부면은광투광성몰딩부 (140)의상부면과엘이디 칩들 (120 12(¾, 120 을포함한다.상기투광성몰딩부 (140)가상기 엘이디 칩 (120 12(¾, 120 의상부면들을덮도록형성될수있는데,이 경우,상기 엘이디 디스플레이모듈 (100)의상부면은상기투광성몰딩부 (140)의 In addition, each of the first and second LED display modules 100 and 100 may further include a light-transmitting molding unit 140 formed to cover the side surfaces of the LED chips 120 12 (¾, 120). And such The light-transmitting molding part 140 is made of a black resin material that absorbs light. 2020/175843 1»（：1^1{2020/002275 can be formed or formed of a clear resin material. Accordingly, the upper surface of the LED display module 100 is the upper surface of the light-transmitting molding unit 140 and the LED chips 120 Including 12 (¾, 120. The light-transmitting molding part 140 may be formed to cover the 120 12 (¾, 120 clothing part), in this case, the upper surface of the LED display module 100 is Of the translucent molding part 140
상부면으로만구성된다.더나아가,투광성몰딩부 (140)가생략된경우에는,상기 엘이디 디스플레이모듈 (100)의상부면은상기 엘이디 칩들 (120 12(¾, 120이의 상부면과회로기판 ( 0)의상부면을포함한다. Further, when the light-transmitting molding unit 140 is omitted, the upper surface of the LED display module 100 is the LED chips 120 12 (¾, 120 upper surface and the circuit board (0) Includes the clothing part.
[88] 상기제 1및제 2엘이디디스플레이모듈 (100, ^0)의하부면은제 1및제 2 [88] The lower surfaces of the first and second LED display modules (100, ^0) are the first and second
회로기판 (110, 110)의하부면과같다.상기제 1및제 2회로기판 (110, 110)의 하부면각각에는 4개의스터드 (114)들이 형성된다.상기 4개의스터드 (114)들은 상기프레임 (200)에 형성된대응스터드홀 (210)에삽입된다.상기 It is the same as the lower surface of the circuit boards 110 and 110. Four studs 114 are formed on each of the lower surfaces of the first and second circuit boards 110 and 110. The four studs 114 are the frame It is inserted into the corresponding stud hole 210 formed in 200).
스터드 (114)들이 대응스터드홀 ( 0)들에삽입되는것에 의해,상기제 1및제 2 엘이디 디스플레이모듈 (100)이프레임 (200)상에고정된다.그리고,상기 스터드 (114)들이 대응스터드홀 ( 0)들에삽입되는것에 의해,제 1및제 2 엘이디 디스플레이모듈 (100, 0)들사이의 간격이 일정하게정해질수있다. 이때,제 1및제 엘이디디스플레이모듈 (100)들사이에는갭이존재한다. By inserting the studs 114 into the corresponding stud holes 0, the first and second LED display modules 100 are fixed on the frame 200. And, the studs 114 are fixed to the corresponding stud holes 0. By being inserted into the (0)s, the spacing between the first and second LED display modules (100, 0) can be set to be constant. At this time, a gap exists between the first and the first LED display modules 100.
스터드 (114)들과상기스터드홀 ( 0)들은제 1및제 2엘이디 디스플레이 모듈 (100, 100)사이의픽셀간간격이 일정하도록상기 제 1및제 2엘이디 디스플레이모듈 (100, 0)의 위치를결정하는위치결정수단이된다.스터드와 스터드홀대신에다른종류의 체결구를포함하는위치결정수단이 이용될수도 있다. The positions of the first and second LED display modules 100 and 0 are determined so that the pixel spacing between the studs 114 and the stud holes 0 is constant between the first and second LED display modules 100 and 100 Positioning means including other types of fasteners may be used instead of studs and stud holes.
[89] 본실시예에 따르면,상기제 1및제 2블랙필름 (300, 300)각각은사각형의상면 커버부 (320)와상기상면커버부 (320)의 네변에서상기상면커버부 (320)과대략 직교하는 4개의측면커버부 (340)로구성된다.상기상면커버부 (320)는상기 제 1 및제 2엘이디 디스플레이모듈 (100, 100)각각의상면과실질적으로동일한형상 및동일한면적을갖는것으로상기제 1및제 2엘이디디스플레이모듈 (100, 100) 각각의상면을모두덮는다.이에의해,상기 제 1및제 2엘이디 디스플레이 모듈 (100, 100)각각의 엘이디칩 (120 12(¾, 120 들의상면들은모두상기상면 커버부 (320)에의해 덮인다.상기상면커버부 (320)의하부면에는접착물질이 형성되어 있다.또한,상기 4개의측면커버부 (340)들각각은상기제 1및제 2 엘이디 디스플레이모듈 (100, 100)각각의 네측면을덮도록형성된다.상기측면 커버부 (340)의내측면에는접착물질이 형성되어 있다.상기측면커버부 (340) 각각은상기제 1및제 2엘이디디스플레이모듈 (100, 0)의 해당측면전체를 덮을수있지만,회로기판 ( 0)의측면적어도일부를덮지 않을수도있다.상기 제 1및제 2엘이디디스플레이모듈 (100, 100)각각의측면은빛이나오는측면 발광부와회로기판 (110)의측면으로구성되는데,상기측면커버부 (3400)는상기 엘이디 디스플레이모듈 (100)의측면발광부를덮도록형성되는것이좋다. 2020/175843 1»（：1^1{2020/002275 [89] According to the present embodiment, each of the first and second black films 300 and 300 is larger than the upper cover part 320 on the four sides of the square top cover part 320 and the top cover part 320. It is composed of four side cover portions 340 that are approximately orthogonal. The top cover portion 320 has substantially the same shape and area as the top surfaces of each of the first and second LED display modules 100 and 100. Each of the first and second LED display modules 100 and 100 is covered. Accordingly, the top surfaces of each of the first and second LED display modules 100 and 100 are 120 12 (¾, 120s). All of them are covered by the upper cover part 320. An adhesive material is formed on the lower surface of the upper cover part 320. In addition, each of the four side cover parts 340 is the first and second LEDs. The display modules 100 and 100 are formed to cover each of the four sides. An adhesive material is formed on the inner side of the side cover part 340. Each of the side cover parts 340 includes the first and second LED displays. It may cover the entire corresponding side of the module 100, 0, but may not cover at least a part of the side of the circuit board 0. Each side of the first and second LED display modules 100, 100 is the side of the light emitting side It is composed of a light emitting part and a side surface of the circuit board 110, and the side cover part 3400 is preferably formed to cover the side light emitting part of the LED display module 100. 2020/175843 1»（：1^1{2020/002275
[9이 상기블랙필름 (300)각각은,도 17에도시된것과같은상태,즉,상면 [9] Each of the black film 300 is in a state as shown in FIG. 17, that is, the top surface
커버부 (320)와 4개의측면커버부 (340)들이동일평면상에 있는상태로부터, 접힘선 (301)들을따라,상기측면커버부 (340)들이대략 90도접혀진후에,도 12 내지도 15에도시된것과같이적용될수있다.두접힘선 (301)들의교차에의해 한정된사각형모서리영역들을제거된다.도 17은이해의편의위해비율을 고려하지않고과장하여도시된것임에유의한다. From the state in which the cover part 320 and the four side cover parts 340 are on the same plane, along the fold lines 301, after the side cover parts 340 are folded approximately 90 degrees, FIGS. 12 to 15 It can be applied as shown in Fig. 17, which is limited by the intersection of the two fold lines 301, is eliminated. It should be noted that Fig. 17 is shown exaggerated without taking into account the ratio for convenience of understanding.
[91] 도 15에잘도시된바와같이,서로이웃하는제 1및제 2엘이디디스플레이 [91] As well as shown in Fig. 15, the first and second LED displays adjacent to each other
모듈 (100, 100)사이의픽셀간간격,즉,제 1및제 2엘이디디스플레이모듈 (100, 0)의가장자리엘이디칩들 (12此, 120幻사이의간격은 &이고,그가장자리 엘이디칩 (12此, 120幻들각각의제 1및제 2회로기판 (110, 100)각각의인접 단부에대한거리가각각바, 2이고,상기제 1및제 2블랙필름 (300, 300)각각의 두께가 I일때,제 1및제 2엘이디디스플레이모듈 (100, 100)에부착된제 1및제 2 블랙필름 (300, 300)의측면커버부들사이에형성된심간격부의폭 w는아래의 식을만족하며 , 50 01미만인것이바람직하다.심의폭이 50 01미만에서는심이 육안으로잘보이지않는다.
Figure imgf000015_0001
151 + 2) <50 The pixel gap between the modules 100 and 100, that is, the gap between the edge LED chips 12 and 120 of the first and second LED display modules 100 and 0 is &, and the edge LED chip 12 When the distance to the adjacent ends of each of the first and second circuit boards (110, 100) of 120 幻s each is bar, 2, and the thickness of each of the first and second black films (300, 300) is I ,The width w of the core gap formed between the side cover parts of the first and second black films 300 and 300 attached to the first and second LED display modules 100 and 100 satisfies the following equation, and is less than 50 01 If the width of the deliberation is less than 50 01, the deliberation is difficult to see with the naked eye.
Figure imgf000015_0001
151 + 2) <50
[94] 이때,제 1및제 2엘이디디스플레이모듈 (100, ^0)의가장자리 엘이디 [94] At this time, the edge LEDs of the first and second LED display modules (100, ^0)
칩들 (120 120幻사이의간격 즉,제 1및제 2엘이디디스플레이모듈 (100, 100) 사이의픽셀간간격 &는하나의엘이디디스플레이모듈 (100)내픽셀간간격과 같다.그리고,상기간격 &는,전술한스터드홀들에대한스터드들의삽입에의해 결정되는것으로서,가장자리엘이디칩 (120 120幻들각각의해당 The interval between the chips (120 120 幻, i.e., the pixel interval between the first and second LED display modules 100 and 100) & is equal to the pixel interval in one LED display module 100. And, the upper period interval & is ,As determined by the insertion of the studs into the aforementioned stud holes, the edge LED chip (120 120 幻 each corresponding to each
회로기판들 ( 0, 110)각각의인접단부에대한거리바, 2가다르더라도 일정하다.그리고,블랙필름 (300)의두께선택에의해,이웃하는제 1및제 2블랙 필름 (300)의측면커버부들사이에형성되는심각격부의폭 \¥를미세하게 조절하는것이가능하다. The distance bar for each of the circuit boards (0, 110), the distance bar for each of the adjacent ends, is constant even if 2 is different, and, depending on the thickness of the black film 300, the sides of the neighboring first and second black films 300 It is possible to finely adjust the width \¥ of the severe gap formed between the cover parts.
[95] 도 16,도 17및도 18은전술한엘이디디스플레이모듈조립체를제조하는 [95] Figures 16, 17, and 18 are for manufacturing the aforementioned Han LED display module assembly.
여러공정들을설명하기위한도면들이다. These are drawings to explain various processes.
[96] 도 16에도시된것과같은제 1및제 2엘이디디스플레이모듈 (100, 100)들을 포함하는복수개의엘이디디스플레이모듈 (100)들이준비된다.상기 엘이디 디스플레이모듈 (100)제작을위해,직사각형또는정사각형회로기판 ( 0)이 준비되고,상기회로기판 ( 0)의상면에적색엘이디칩,녹색엘이디칩및청색 엘이디칩을포함하는복수개의엘이디칩 (120 12015, 120 들이실장된다.이때, 일열로배열된채서로모여 있는적색엘이디칩 (120幻，녹색엘이디칩 (12아5), 청색엘이디칩 (120 이하나의픽셀을구성하며,회로기판 ( 0)상에는 복수개의픽셀들이행렬배열된다.복수개의엘이디칩 (120 12아5, 120 들의 측면을덮도록투광성몰딩부 (140)가더형성될수있다.상기투광성 A plurality of LED display modules 100 including first and second LED display modules 100 and 100 as shown in FIG. 16 are prepared. For the production of the LED display module 100, a rectangle or a rectangle A square circuit board (0) is prepared, and a plurality of LED chips (120 12015, 120) including a red LED chip, a green LED chip and a blue LED chip are mounted on the top surface of the circuit board (0). The red LED chips (120幻, green LED chips (12a5), and blue LED chips (120), which are arranged and gathered together constitute one pixel, and a plurality of pixels are arranged in a matrix on the circuit board (0). The light-transmitting molding part 140 may be further formed to cover the side surfaces of the LED chips 120 12a5 and 120s.
몰딩부 (140)는광을흡수하는블랙수지재료로형성되거나클리어수지재료로 형성될수있다. The molding part 140 is formed of a light-absorbing black resin material or a clear resin material. Can be formed
[97] 도 16내지도 18을참조하면,엘이디 디스플레이모듈 (100)과블랙필름 (300)이 각각준비된다. 16 to 18, an LED display module 100 and a black film 300 are prepared, respectively.
[98] 본실시예에 있어서,상기블랙필름 (300)은대략 100 두께의 PET(Poly [98] In this embodiment, the black film 300 is PET (Poly
Ethylene Terephthalate)층 (301)과,상기 PET층 (301)의상측에 형성된대략 2炯 두께의 AG(Anti Glare)층 (302)과,상기 PET층 (301)의하측에 형성된 ^0 두께의 실리콘 (silicone) PSA접착물질층 (304)을포함하며,상기 PET층 (301)과상기 접착물질층 (304)사이에는대략 5 두께의블랙코팅층 (303)이 개재되어 있다. 상기블랙필름 (300)은, PET층과 AG층과접착물질층으로구성된통상의 Ethylene terephthalate) layer 301, an AG (Anti Glare) layer 302 having a thickness of approximately 2 炯 formed on the upper side of the PET layer 301, and silicon having a thickness of ^ 0 formed on the lower side of the PET layer 301 A (silicone) PSA adhesive material layer 304 is included, and a black coating layer 303 having a thickness of approximately 5 is interposed between the PET layer 301 and the adhesive material layer 304. The black film 300 is composed of a PET layer, an AG layer, and an adhesive material layer.
AG(Anti Glare)필름또는 AG(Anti Glare)시트와비교할때 ,상기 PET층 (301)과 상기 접착물질층 (304)사이에 개재된블랙코팅층 (303)에 의해딥블랙을 구현함으로써,명암비를더 향상시킬수있다.이때,광의투광율은블랙 코팅층 (303)에의해 50~70%내에서조절가능하다.그리고,상기블랙 When compared with an AG (Anti Glare) film or an AG (Anti Glare) sheet, by implementing deep black by the black coating layer 303 interposed between the PET layer 301 and the adhesive material layer 304, the contrast ratio is reduced. At this time, the transmittance of light can be adjusted within 50-70% by the black coating layer 303. And, the black
필름 (300)은휘도손실을최소화할수있다. The film 300 can minimize luminance loss.
[99] 한편,상기블랙필름 (300)은엘이디디스플레이모듈 (100)의상면과네측면을 덮도록부착된다.상기블랙필름 (300)은상면커버부 (320)와 4개의측면 커버부 (340)들이동일평면상에 있는상태로부터,접힘선 (301)들을따라,상기 측면커버부 (340)들이 대략 90도접혀져 적용된다.상기블랙필름 (300)의상면 커버부 (320)와측면커버부 (340)들각각은상기 엘이디 디스플레이모듈 (100)의 상면과상기 엘이디 디스플레이모듈 (100)의측면에부착된다.상기측면 커버부 (340)들이 엘이디 디스플레이모듈 (100)의상면이아닌측면으로나오는 광을커버하므로이웃하는엘이디디스플레이모듈 (100)들사이의 갭을통해 빛샘현상이발생하는것을억제할수있다.블랙필름 (300)이부착된엘이디 디스플레이모듈 (100)들이프레임상에 행렬배열로고정되어,엘이디 On the other hand, the black film 300 is attached to cover the upper and four sides of the LED display module 100. The black film 300 includes an upper cover part 320 and four side cover parts 340 ) From a state in which they are on the same plane, along the fold lines 301, the side cover parts 340 are folded approximately 90 degrees to be applied. The upper cover part 320 and the side cover part of the black film 300 Each of the 340 is attached to a top surface of the LED display module 100 and a side surface of the LED display module 100. The side cover portions 340 are attached to a side surface other than the top surface of the LED display module 100. Since it covers the light, it is possible to suppress the occurrence of light leakage through the gap between the neighboring LED display modules 100. The LED display modules 100 with black film 300 attached are fixed on the frame in a matrix arrangement. Become, LED
디스플레이모듈조립체의 제작이완료된다. Manufacturing of the display module assembly is completed.
0이 0 this
[101] [제 2-2실시예] [101] [Example 2-2]
[102] 도 19는본발명의 제 2-2실시예에따른엘이디디스플레이모듈조립체를 19 is an LED display module assembly according to a second embodiment of the present invention.
설명하기 위한단면도이다. It is a cross-sectional view for explanation.
[103] 도 19를참조하면,본발명의 제 2-2실시예에따른엘이디디스플레이모듈 조립체는,앞선제 2- 1실시예와마찬가지로,프레임 (200)및상기프레임 (200)의 상에 행렬로배열된복수개의 엘이디 디스플레이모듈 (100)들과,상기 [103] Referring to Figure 19, the LED display module assembly according to the second embodiment 2-2 of the present invention, as in the previous embodiment 2-1, a matrix on the frame 200 and the frame 200 A plurality of LED display modules 100 arranged in, and the
디스플레이모듈 (100)들각각의상면에 덮도록부착된블랙필름 (300)들을 포함한다.또한,상기 엘이디디스플레이모듈 (100)들은,앞선제 1예와 마찬가지로,회로기판 (no)과,상기회로기판 (no)의상면에실장되어복수개의 픽셀을형성하는복수개의 엘이디칩 (120a, 120b, 120c)들과,상기 엘이디 칩들 (120a, 120b, 120c)의측면을덮도록형성된투광성몰딩부 (140)를더포함할 수있다.앞선제 2- 1실시예의몰딩부가스퀴즈방식에 의한성형또는금형을 2020/175843 1»（：1^1{2020/002275 이용한성형에의해평탄한상면을가진것과달리,본발명의 제 2-2실시예에 따른몰딩부는 (140)는엘이디칩들 (120 12(¾, 1200)사이로복수개의 The display modules 100 include black films 300 attached to each of the upper surfaces of each of them. In addition, the LED display modules 100 are, like the first example, a circuit board (no ) and the circuit A plurality of LED chips 120a, 120b, 120c, which are mounted on the top surface of the substrate no , to form a plurality of pixels, and a light-transmitting molding part 140 formed to cover the side surfaces of the LED chips 120a, 120b, and 120c. ). The molding of the previous example 2-1 is added to the molding or mold by the squeeze method. 2020/175843 1»（：1^1{2020/002275 Unlike the one having a flat top surface by molding using, the molding part according to the second embodiment of the present invention 140 is the LED chips 120 12 (¾ , 1200)
밸리 신노 142, 144)를포함하는대략요철형태의상면을갖도록형성된다. 상기복수개의 밸리 (142, 144)각각은이웃하는두픽셀사이에서 이웃하는두 엘이디 칩사이에 형성된픽셀간밸리 (142)와,해당픽셀내에서 이웃하는두 엘이디 칩사이에 형성된칩간밸리 (144)로구분된다.이웃하는두픽셀사이의 두이웃하는엘이디 칩사이의 간격이각픽셀내두이웃하는엘이디칩사이의 간격보다크므로,픽셀간밸리 (142)의폭은칩간밸리 (144)의폭보다크게 정해진다. It is formed to have a roughly uneven top surface including Valley Shinno 142, 144). Each of the plurality of valleys 142 and 144 is an inter-pixel valley 142 formed between two neighboring LED chips, and an inter-chip valley 144 formed between two neighboring LED chips in a corresponding pixel. Since the distance between the two neighboring pixels and the two neighboring LED chips is larger than the distance between the two neighboring LED chips in each pixel, the width of the inter-pixel valley 142 is set to be larger than the width of the inter-chip valley 144. All.
[104] 상기몰딩부 (140)는블랙 컬러 재료를포함하는액상또는겔상의수지 재료를 상기 회로기판 (110)상에스프레이 방식으로도포하여 형성될수있다.상기블랙 컬러 재료는예컨대블랙카본일수있다,블랙 컬러 재료를포함하는액상또는 겔상의수지 재료를상기복수개의 엘이디칩들 (120 12(¾, 120 이실장되어 있는회로기판 ( 0)에스프레이방식으로도포하면,상기 액상또는겔상의수지 재료가이웃하는픽셀들사이의또는픽셀내의 엘이디칩들사이를채워 전술한 투광성몰딩부 (140)을형성한다.그러함에도불구하고,액상또는겔상의수지가 갖는표면장력에의해,액상또는겔상의수지가엘이디 칩들 (120 12(¾, 120 의 상면으로부터측면으로모두흘러들어가며,이에의해,엘이디 칩 (120 12아5, 120이의상면은외부로노출된다.따라서,상기 엘이디 칩 (120 12(¾, 120이의 상면은상기 밸리 (142, 144)의상단과같은높이를가진채로,외부로노출된다. 또한,상기몰딩부 (140)는상기회로기판 ( 0)의 가장자리와인접한영역에 하프밸리 (146)를더포함한다.상기몰딩부 (140)는상기하프밸리 (146)가형성된 영역에서 가장자리 엘이디 칩의측면과접하는면과상기회로기판 ( 0)의 측면과동일평면상에 있는면을모두포함한다. The molding part 140 may be formed by spraying a liquid or gel resin material including a black color material on the circuit board 110 in a spray manner. The black color material may be black carbon, for example. ,When a liquid or gel resin material containing a black color material is applied by spraying the plurality of LED chips (120 12 (¾, 120) on a circuit board (0), the liquid or gel resin material The above-described light-transmitting molding part 140 is formed by filling between neighboring pixels or between LED chips in a pixel. Nevertheless, due to the surface tension of the liquid or gel resin, the liquid or gel resin is formed. The LED chips (120 12 (¾, 120) all flow from the top surface to the side, and thereby, the top surfaces of the LED chips (120 12 Ah 5, 120 are exposed to the outside. Therefore, the LED chips (120 12 (¾, 120)) are exposed to the outside. The upper surface thereof is exposed to the outside while having the same height as the upper ends of the valleys 142 and 144. In addition, the molding part 140 further includes a half valley 146 in an area adjacent to the edge of the circuit board 0. The molding part 140 includes both a surface in contact with the side surface of the edge LED chip in the region where the half valley 146 is formed and a surface on the same plane as the side surface of the circuit board 0.
[105] [105]
[106] [제 2-3실시예] [106] [Example 2-3]
[107] 도 20은본발명의 제 3다른실시예에따른엘이디디스플레이조립체를 20 shows an LED display assembly according to a third alternative embodiment of the present invention.
제조하는방법을설명하기 위한도면이고,도 21은도 20에도시된방법에따라 제조된엘이디디스플레이모듈조립체를도시한단면도이다. It is a drawing for explaining a manufacturing method, and FIG. 21 is a cross-sectional view showing an LED display module assembly manufactured according to the method shown in FIG. 20.
[108] 본발명의 제 3실시에에 따르면,앞선실시예들에서 각엘이디 디스플레이 모듈에 대응되게제공된블랙필름은생략된다. According to the third embodiment of the present invention, the black film provided corresponding to each LED display module in the previous embodiments is omitted.
[109] 도 20을참조하면,본발명의 제 2-3실시예에따른모듈조립체제조를위해 , 먼저스터드홀 (210)들이 형성된사각판형의프레임 (200)이준비되고,앞선 실시예와달리블랙필름이부착되어 있지 않은엘이디디스플레이 [109] Referring to Fig. 20, for manufacturing a module assembly according to the 2-3rd embodiment of the present invention, a square plate-shaped frame 200 in which stud holes 210 are formed is first prepared, unlike the previous embodiment. LED display without black film attached
모듈 (100)들이 행렬배열로상기프레임 (200)상에고정된다.상기고정을위해, 각엘이디디스플레이모듈 (100)의하부면에 형성된스터드 (114)들이상기 프레임 (200)에 형성된대응스터드홀 ( 0)에삽입된다.상기스터드홀 (114)들이 대응스터드홀 ( 0)들에삽입되는것에의해,이웃하는엘이디디스플레이 2020/175843 1»（：1^1{2020/002275 모듈 (100)들사이의간격이일정하게정해질수있다.이때,이웃하는엘이디 디스플레이모듈 (100)들사이에는갭 ( 이존재한다. Modules 100 are fixed on the frame 200 in a matrix arrangement. For the fixing, studs 114 formed on the lower surface of each LED display module 100 are provided with corresponding stud holes formed in the frame 200 ( 0). By inserting the stud holes (114) into the corresponding stud holes (0), the neighboring LED display 2020/175843 1»（：1^1{2020/002275 The spacing between the modules 100 can be fixed. At this time, a gap exists between the neighboring LED display modules 100.
[110] 다음,상기프레임 (200)의상면에고정된엘이디디스플레이모듈 (100)들의 상면전체를덮도록블랙몰딩층 (300’)이형성된다.상기블랙몰딩층 (300’)은 블랙컬러재료가혼합된액상또는겔상의수지를상기 엘이디디스플레이 모듈 (100)들의상면전체를덮도록도포한후경화시켜형성될수있다. Next, a black molding layer 300 ′ is formed to cover the entire upper surface of the LED display modules 100 fixed on the upper surface of the frame 200. The black molding layer 300 ′ is made of a black color material. It may be formed by applying a mixed liquid or gel resin to cover the entire upper surface of the LED display modules 100 and then curing.
[111] 도 21을참조하면,상기블랙몰딩층 (300’)은상기엘이디디스플레이 [111] Referring to FIG. 21, the black molding layer 300' is the LED display.
모듈 (100)들의상면을전체적으로덮는상면커버부 (320’)와상기엘이디 디스플레이모듈 (100)들의측면들을적어도부분적으로덮는측면 A top cover part 320' covering the entire upper surface of the modules 100 and a side that partially covers the sides of the LED display module 100
커버부 (340’)를포함하는것을알수있다.상기측면커버부 (340’)는블랙컬러 재료가혼합된액상또는겔상의블랙수지가상기엘이디디스플레이 모듈 (100)들의상면전체를덮도록도포하는과정에서상기엘이디디스플레이 모듈 (100)들사이의갭 ( 내로들어간블랙수지가굳어져형성된것이다.상기 엘이디디스플레이모듈 (100)들의상면을전체적으로덮는상면커버부 (320’)와 상기 엘이디디스플레이모듈 (100)들의측면들을적어도부분적으로덮는측면 커버부 (340’)를포함하는블랙몰딩층 (300’)을엘이디디스플레이모듈 (100)들을 덮도록적용하면,이웃하는엘이디디스플레이모듈 (100)들사이에심이생기는 것을원천적으로막을수있다. It can be seen that the side cover part 340 ′ is applied so that a liquid or gel black resin mixed with a black color material covers the entire upper surface of the LED display modules 100. In the process, the gap between the LED display modules 100 (it is formed by hardening the black resin that has entered the inside. A top cover part 320 ′ covering the entire upper surface of the LED display modules 100 and the LED display module 100 ), the black molding layer 300' including the side cover portion 340' that partially covers the sides of the LEDs is applied to cover the LED display modules 100, so that the core between the neighboring LED display modules 100 It can be prevented from occurring.
[112] [112]
[113] 본발명의제 2실시예들에따른엘이디디스플레이모듈조립체들은,엘이디 디스플레이모듈의상면을덮도록배치되었던블랙필름대신에,엘이디 디스플레이모듈의상면및측면을덮는블랙필름을채용함으로써,이웃하는 엘이디모듈들사이의갭과그위에부착된블랙필름들사이의갭을통해빛샘 현상이발생하는것을억제할수있다. [113] The LED display module assemblies according to the second embodiments of the present invention adopt a black film that covers the top and sides of the LED display module, instead of the black film disposed to cover the top surface of the LED display module. It is possible to suppress the occurrence of light leakage through the gap between the LED modules and the black films attached thereon.
[114] 또한,본발명의제 2실시예들에따른엘이디디스플레이모듈조립체들은, 엘이디디스플레이모듈들의하부면에형성된스터드들이프레임에형성된 스터드홀에삽입되어 엘이디디스플레이모듈들의위치가결정되므로,해당 엘이디디스플레이모듈내픽셀피치간격뿐아니라,이웃하는엘이디 디스플레이모듈사이의픽셀피치간격도일정하게정해진다.엘이디 디스플레이모듈들의회로기판들의사이즈차이로인해엘이디디스플레이 모듈사이에는갭이발생하지만,엘이디디스플레이모듈에부착되는블랙 필름들이상면커버부및이와대략직교하는측면커버부로구성되고,측면 커버부들이이웃하는엘이디디스플레이모듈들사이의갭크기를 In addition, in the LED display module assembly according to the second embodiment of the present invention, the studs formed on the lower surfaces of the LED display modules are inserted into the stud holes formed in the frame to determine the positions of the LED display modules. Not only the pixel pitch spacing within the display module, but also the pixel pitch spacing between neighboring LED display modules is also fixed. Due to the difference in size of the circuit boards of the LED display modules, a gap occurs between the LED display modules, but the LED display module The attached black films are composed of a top cover part and a side cover part that is approximately orthogonal thereto, and the gap size between the adjacent LED display modules of the side cover parts is reduced.
감소시키므로,심의크기를사람이시각적으로거의인지할수있을정도로 줄여줄수있다. As it is reduced, it is possible to reduce the size of the deliberation to the extent that a person can visually perceive it.

Claims

2020/175843 1»（：1^1{2020/002275 청구범위 2020/175843 1»（：1^1{2020/002275 claims
[청구항 1] 기판; [Claim 1] Substrate;
상기 기판상에 매트릭스로배열되고,제 1마이크로엘이디칩,제 2 마이크로엘이디칩 및제 3마이크로엘이디칩을포함하는,복수개의 마이크로엘이디픽셀들; A plurality of micro LED pixels arranged in a matrix on the substrate and including a first micro LED chip, a second micro LED chip, and a third micro LED chip;
상기 제 1마이크로엘이디칩,상기제 2마이크로엘이디칩 및상기 제 3 마이크로엘이디칩의측면들과상면을덮도록상기기판상에 형성된 접착제층;및 An adhesive layer formed on the substrate to cover side surfaces and upper surfaces of the first micro LED chip, the second micro LED chip, and the third micro LED chip; And
상기 접착제층상에 형성되는외부광흡수시트를포함하며 , It includes an external light absorbing sheet formed on the adhesive layer,
상기 외부광흡수시트는매트릭스로배열된복수개의방열홀들을 포함하며, The external light absorption sheet includes a plurality of heat dissipation holes arranged in a matrix,
상기 방열홀들중 4개의방열홀들의중심을연결한영역 안에 적어도 하나의마이크로엘이디픽셀이위치하는것을특징으로하는마이크로 엘이디 디스플레이모듈. A micro LED display module, characterized in that at least one micro LED pixel is located in a region connecting the centers of four of the heat radiation holes.
[청구항 2] 청구항 1에 있어서,상기 외부광흡수시트는블랙 컬러를갖는광투과성 시트인것을특징으로하는마이크로엘이디디스플레이모듈. [Claim 2] The micro LED display module according to claim 1, wherein the external light absorbing sheet is a light-transmitting sheet having a black color.
[청구항 3] 청구항 1에 있어서,상기 방열홀들의 열들중 !!번째방열홀열과 11+1번째 방열홀열사이에 한열의마이크로엘이디픽셀들이위치하는것을 특징으로하는마이크로엘이디디스플레이모듈. [Claim 3] The micro LED display module according to claim 1, wherein one row of micro LED pixels is located between the !!th heat dissipation hole row and the 11+1th heat dissipation hole row among the rows of the heat dissipation holes.
[청구항 4] 청구항 1에 있어서,상기 방열홀들의 열들과행들중, II번째방열홀열과 [Claim 4] The method according to claim 1, Among rows and rows of the heat dissipation holes,
11+1번째방열홀열사이와 III번째방열홀행과 II번째방열홀행사이에 하나의마이크로엘이디픽셀이위치하는것을특징으로하는마이크로 엘이디 디스플레이모듈. A micro LED display module characterized in that one micro LED pixel is located between the 11+1st heat dissipation hole rows and the IIIth heat dissipation hole row and the IIth heat dissipation hole row.
[청구항 5] 청구항 1에 있어서,상기 방열홀들은상기 제 1마이크로엘이디칩,상기 제 2마이크로엘이디칩 및상기 제 3마이크로엘이디칩에서발생한열을 외부로방출하는것을특징으로하는마이크로엘이디 디스플레이모듈. [Claim 5] The micro LED display module according to claim 1, wherein the heat dissipation holes discharge heat generated from the first micro LED chip, the second micro LED chip, and the third micro LED chip to the outside.
[청구항 6] 청구항 1에 있어서,상기 방열홀들각각은원형인것을특징으로하는 마이크로엘이디디스플레이모듈. [Claim 6] The micro LED display module according to claim 1, wherein each of the heat dissipation holes is circular.
[청구항 7] 청구항 1에 있어서,상기 방열홀들각각은서로이웃하는두마이크로 엘이디픽셀들사이의 제 1마이크로엘이디칩과제 3마이크로엘이디칩 사이에 위치하는것을특징으로하는마이크로엘이디 디스플레이모듈.[Claim 7] The micro LED display module according to claim 1, wherein each of the heat dissipation holes is positioned between a first micro LED chip and a third micro LED chip between two micro LED pixels adjacent to each other.
[청구항 8] 청구항 1에 있어서,상기 방열홀들각각은복수개의마이크로엘이디 픽셀과인접해 있도록기다란것을특징으로하는마이크로엘이디 디스플레이모듈. [Claim 8] The microLED display module according to claim 1, wherein each of the heat dissipation holes is elongated so as to be adjacent to a plurality of microLED pixels.
[청구항 9] 청구항 1에 있어서,상기 접착제층의상면은상기외부광흡수시트에 의해가려진영역과상기방열홀들에 의해노출된영역들의높이가같은 것을특징으로하는마이크로엘이디 디스플레이모듈. 2020/175843 1»（：1^1{2020/002275 [Claim 9] The microLED display module according to claim 1, wherein the upper surface of the adhesive layer has the same height as the area covered by the external light absorbing sheet and the areas exposed by the heat dissipation holes. 2020/175843 1»（：1^1{2020/002275
[청구항 10] 청구항 1에있어서,상기접착제층은상기방열홀들에의해노출된 [Claim 10] In claim 1, wherein the adhesive layer is exposed by the heat dissipation holes
영역들에일정깊이함몰된리세스들을포함하는것을특징으로하는 마이크로엘이디디스플레이모듈. A micro LED display module characterized by including recesses depressed to a certain depth in the areas.
[청구항 11] 청구항 1에있어서,상기방열홀들각각은 30~200;/111의최대폭을갖는 것을특징으로하는마이크로엘이디디스플레이모듈. [Claim 11] The micro LED display module according to claim 1, wherein each of the heat dissipation holes has a maximum width of 30 to 200;/111.
[청구항 12] 기판상에제 1마이크로엘이디칩,제 2마이크로엘이디칩및제 3 [Claim 12] The first micro LED chip, the second micro LED chip and the third on the substrate
마이크로엘이디칩을포함하는복수개의마이크로엘이디픽셀들을 매트릭스로배열하는단계; Arranging a plurality of micro LED pixels including a micro LED chip in a matrix;
상기제 1마이크로엘이디칩,상기제 2마이크로엘이디칩및상기제 3 마이크로엘이디칩의측면들과상면을덮도록상기기판상에 The first micro LED chip, the second micro LED chip, and the third micro LED chip are formed on the substrate so as to cover the side surfaces and the top surface of the first micro LED chip.
접착제층을형성하는단계 ;및 Forming an adhesive layer; and
상기접착제층상에외부광흡수시트를형성하는단계를포함하며 , 상기외부광흡수시트를상기접착제층상에형성하는단계에서 ,상기 외부광흡수시트는매트릭스로배열된복수개의방열홀들을포함하며, 상기방열홀들중 4개의방열홀들의중심을연결한영역안에적어도 하나의마이크로엘이디픽셀이위치하는것을특징으로하는마이크로 엘이디디스플레이모듈제조방법. Including the step of forming an external light absorption sheet on the adhesive layer, in the step of forming the external light absorption sheet on the adhesive layer, the external light absorption sheet includes a plurality of heat dissipation holes arranged in a matrix, the A method of manufacturing a micro LED display module, characterized in that at least one micro LED pixel is located in an area connecting the centers of the four radiating holes among the heat radiation holes.
[청구항 13] 청구항 12에있어서 ,상기외부광흡수시트를상기접착체층상에 [Claim 13] In claim 12, the external light absorbing sheet is placed on the adhesive layer.
형성하기전에,멀티핀들을이용하여상기외부광흡수시트에상기 복수개의방열홀들을형성하는것을특징으로하는마이크로엘이디 디스플레이모듈제조방법 . Prior to formation, a method of manufacturing a micro LED display module characterized by forming the plurality of heat dissipation holes in the external light absorbing sheet using multi-pins.
[청구항 14] 청구항 12에있어서,상기외부광흡수시트를상기방열홀들이형성되지 않은상태로상기접착제층상에형성한후에,멀티핀들을이용하여 ,상기 외부광흡수시트에복수개의방열홀들을형성하는것을특징으로하는 마이크로엘이디디스플레이모듈제조방법. [Claim 14] According to claim 12, After forming the external light-absorbing sheet on the adhesive layer in a state in which the heat-radiating holes are not formed, a plurality of heat-radiating holes are formed in the external light-absorbing sheet by using multi-pins. A method of manufacturing a micro LED display module characterized by that.
[청구항 15] 청구항 14에있어서,상기외부광흡수시트를상기방열홀들이형성되지 않은상태로상기접착제층상에형성한후에,멀티핀들을하강하여상기 외부광흡수시트에복수개의방열홀들을형성하되,상기방열홀들형성 후,상기멀티핀들을더하강하여.상기접착제층에상기방열홀들과 연결된방열리세스들을형성하는것을특징으로하는마이크로엘이디 디스플레이모듈제조방법 . [Claim 15] According to claim 14, After forming the external light-absorbing sheet on the adhesive layer in a state in which the heat-radiating holes are not formed, the multi-pins are lowered to form a plurality of heat-radiating holes in the external light-absorbing sheet, After the heat dissipation holes are formed, the multi-pins are further lowered to form heat dissipation recesses connected to the heat dissipation holes in the adhesive layer. A method of manufacturing a micro LED display module.
[청구항 16] 청구항 12에있어서,상기방열홀들의열들중 II번째방열홀열과 11+1번째 방열홀열사이에한열의마이크로엘이디픽셀들이위치하는것을 특징으로하는마이크로엘이디디스플레이모듈제조방법. [Claim 16] The method of manufacturing a micro LED display module according to claim 12, wherein one row of micro LED pixels is located between the II-th heat-radiating hole row and the 11+1-th heat-radiating hole row among the rows of the heat-radiating holes.
[청구항 17] 청구항 12에있어서,상기방열홀들의열들과행들중, II번째방열홀열과 [Claim 17] In claim 12, of the rows and rows of the heat dissipation holes, the second heat dissipation hole row and
11+1번째방열홀열사이와 III번째방열홀행과 II번째방열홀행사이에 하나의마이크로엘이디픽셀이위치하는것을특징으로하는마이크로 엘이디디스플레이모듈제조방법. 2020/175843 1»（：1^1{2020/002275 A method of manufacturing a micro LED display module, characterized in that one micro-LED pixel is located between the 11+1st heat dissipation hole rows and the IIIth heat dissipation hole row and the IIth heat dissipation hole row. 2020/175843 1»（：1^1{2020/002275
［청구항 18］ 청구항 12에있어서,상기복수개의방열홀들은상기제 1마이크로 엘이디칩,상기제 2마이크로엘이디칩및상기제 3마이크로 엘이디칩에서발생한열을외부로방출하는것을특징으로하는 마이크로엘이디디스플레이모듈제조방법. [Claim 18] In claim 12, the plurality of heat dissipation holes are micro LED display characterized in that heat generated from the first micro LED chip, the second micro LED chip, and the third micro LED chip is discharged to the outside. Module manufacturing method.
［청구항 19］ 청구항 12에있어서,상기방열홀들각각은원형인것을특징으로하는 마이크로엘이디디스플레이모듈제조방법. [Claim 19] The method of manufacturing a micro LED display module according to claim 12, wherein each of the heat dissipation holes is circular.
［청구항 2이 청구항 12에있어서,상기방열홀들각각은서로이웃하는두마이크로 엘이디픽셀들사이의제 1마이크로엘이디칩과제 3마이크로엘이디칩 사이에위치하는것을특징으로하는마이크로엘이디디스플레이모듈 제조방법. [Claim 2 is claim 12, wherein each of the heat dissipation holes is located between the first micro LED chip and the third micro LED chip between two micro LED pixels adjacent to each other. A method of manufacturing a micro LED display module, characterized in that.
PCT/KR2020/002275 2019-02-28 2020-02-18 Micro led display module and manufacturing method therefor WO2020175843A1 (en)

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