WO2020151055A1

WO2020151055A1 - Novel combined headphone

Info

Publication number: WO2020151055A1
Application number: PCT/CN2019/077242
Authority: WO
Inventors: 萧轲飞
Original assignee: 海商电子(深圳)有限公司
Priority date: 2019-01-22
Filing date: 2019-03-07
Publication date: 2020-07-30
Also published as: CN109547891A

Abstract

Disclosed is a novel combined headphone, comprising: a headphone body, the headphone body comprising a first headphone and a second headphone provided opposite to the first headphone; each of the first headphone and the second headphone comprising an accommodating space which is enclosed by a headphone front housing and a headphone back housing, and a bone conduction unit and an air conduction unit which are located in the accommodating space and mounted on the inner wall of the headphone front housing, and a bone conduction structure provided corresponding to the bone conduction unit and an air conduction structure provided corresponding to the air conduction unit being mounted on the outer wall of the headphone front housing; and a head strap, two ends of the head strap being respectively connected to the first headphone and the second headphone. According to the technical solution of the present application, characteristics of bone conduction headphones and characteristics of air conduction headphones are integrated, the sound effect and the sonic experience of the headphone can be enhanced, and the user experience can be improved.

Description

新型组合式耳机 New combined earphone

[0001] 本申请是以申请号为 201910058265.X、申请日为 2019年 1月 22日的中国专利申请为基础，并主张其优先权，该申请的全部内容在此作为整体引入本申请中。 [0001] This application is based on a Chinese patent application with an application number of 201910058265.X and a filing date of January 22, 2019, and claims its priority. The entire content of this application is hereby incorporated into this application as a whole.

[0002] 技术领域 [0002] Technical Field

[0003] 本申请涉及一种耳机，尤其涉及一种新型组合式耳机。 [0003] This application relates to a headset, and in particular to a new type of combined headset.

[0004] 背景技术 [0004] Background Technology

[0005] 随着电子技术的不断发展，耳机已经成为音频输出的重要部件之一。 5见有技术中的耳机主要包括两种，一种是空气传导耳机，其原理是将声音信号转化为机械振动后，通过空气传导进入人的耳廓-外耳道-鼓膜-锤骨-砧骨-镫骨-前庭窗 -夕卜（内）淋巴-螺旋器-听神经 -听觉中枢；另一种是骨传导耳机，其原理是将声音信号转化为机械振动，直接传导进入人的颅骨 -骨迷路-内淋巴-螺旋器 -听神 -听觉中枢。由于上述两种耳机对声音的传导结构并不完全相同， 5见有技术中通常将两者分开独立设置。如何将两者结合呈整体，以提升耳机的音效与音感业已成为业内亟待解决的问题。 [0005] With the continuous development of electronic technology, earphones have become one of the important components of audio output. 5 See that there are two main types of earphones in the technology. One is the air conduction earphone. The principle is to convert the sound signal into mechanical vibration, and then enter the human auricle-external auditory canal-tympanic membrane-malleus-incus-through air conduction. The stapes-vestibular window-evening bu (inner) lymph-spiral organ-auditory nerve-auditory center; the other is bone conduction earphones, whose principle is to convert sound signals into mechanical vibrations, which are directly conducted into the human skull-bone labyrinth- Endolymph-spiral organ-hearing god-auditory center. Since the sound conduction structure of the above two kinds of earphones is not completely the same, it is usually set separately and independently in the existing technology. How to combine the two into a whole to improve the sound effect and sense of headphones has become an urgent problem in the industry.

[0006] 有鉴于此，有必要提出对目前的耳机结构进行进一步的改进。 [0006] In view of this, it is necessary to propose further improvements to the current earphone structure.

[0007] 申请内容 [0007] Application content

[0008] 为解决上述至少一技术问题，本申请的主要目的是提供一种新型组合式耳机，以增强耳机的音效与音感。 [0008] In order to solve the above-mentioned at least one technical problem, the main purpose of the present application is to provide a new type of combined earphone to enhance the sound effect and sense of the earphone.

[0009] 为实现上述目的，本申请采用的一个技术方案为：提供一种新型组合式耳机包括： [0009] In order to achieve the above objective, a technical solution adopted by this application is: a new type of combined earphone is provided, including:

[0010] 耳机体，所述耳机体包括第一耳机及与第一耳机相对设置的第二耳机；所述第耳机与第二耳机均包括耳机前壳与耳机后壳围成的容置空间，位于容置空间并安装于耳机前壳内壁的骨传导单元及空气传导单元；所述耳机前壳外壁安装有对应骨传导单元设置的骨传导结构以及对应空气传导单元设置的空气传导结构； [0010] an earphone body, the earphone body includes a first earphone and a second earphone arranged opposite to the first earphone; both the first earphone and the second earphone include an accommodation space enclosed by a front earphone shell and a back earphone shell, A bone conduction unit and an air conduction unit located in the accommodating space and installed on the inner wall of the earphone front shell; the outer wall of the earphone front shell is provided with a bone conduction structure corresponding to the bone conduction unit and an air conduction structure corresponding to the air conduction unit;

[0011] 头带，所述头带连接第一耳机及第二耳机。 [0012] 其中，所述骨传导结构为振动垫，振动垫上凸设有与头部紧接触的抵接部。 [0011] The headband is connected to the first earphone and the second earphone. [0012] Wherein, the bone conduction structure is a vibrating pad, and the vibrating pad is convexly provided with an abutting portion that is in close contact with the head.

[0013] 其中，所述骨传导单元的数量为一个或一个以上。 [0013] Wherein, the number of the bone conduction unit is one or more.

[0014] 其中，所述空气传导结构包括耳塞，所述耳塞压接于耳道外或伸入耳道内。 [0014] Wherein, the air conduction structure includes an earplug, which is crimped outside the ear canal or extends into the ear canal.

[0015] 其中，所述空气传导结构包括耳罩，所述耳罩贴近人耳或罩设于人耳外周侧。 [0015] Wherein, the air conduction structure includes earmuffs, and the earmuffs are close to the human ears or arranged on the outer peripheral side of the human ears.

[0016] 其中，所述空气传导单元的数量为一个或一个以上。 [0016] Wherein, the number of the air conduction unit is one or more.

[0017] 其中，所述骨传导单元与空气传导单元分开设置。 [0017] Wherein, the bone conduction unit and the air conduction unit are arranged separately.

[0018] 其中，所述新型组合式耳机还包括第一前壳、第一后壳以及连接第一前壳与第一后壳的连接线，所述第一前壳与第一后壳围成供容置空气传导单元的容置空间。 [0018] Wherein, the new type combined earphone further includes a first front shell, a first rear shell, and a connecting line connecting the first front shell and the first rear shell, the first front shell and the first rear shell enclose An accommodation space for accommodating the air conduction unit.

[0019] 其中，所述骨传导单元与空气传导单元通过音效平衡电路电性连接。 [0019] Wherein, the bone conduction unit and the air conduction unit are electrically connected through a sound balance circuit.

[0020] 其中，所述第一耳机或第二耳机的后壳上设有麦克风。 [0020] Wherein, a microphone is provided on the back shell of the first earphone or the second earphone.

[0021] 本申请的技术方案的耳机主要采用将耳机骨传导单元及空气传导单元设置于同一耳机中，具体的，骨传导单元及空气传导单元分别位于容置空间并安装于前壳内壁，且骨传导单元及空气传导单元电性连接，通过整合骨传导耳机及空气传导耳机的特性，能够增强耳机的音效与音感，提升用户体验。 [0021] The earphone of the technical solution of the present application mainly uses the earphone bone conduction unit and the air conduction unit to be arranged in the same earphone. Specifically, the bone conduction unit and the air conduction unit are respectively located in the accommodating space and installed on the inner wall of the front shell, and The bone conduction unit and the air conduction unit are electrically connected, and by integrating the characteristics of the bone conduction earphone and the air conduction earphone, the sound effect and sense of the earphone can be enhanced, and the user experience can be improved.

[0022] 附图说明 [0022] Description of the drawings

[0023] 图 1为本申请第一实施例新型组合式耳机的结构示意图； [0023] FIG. 1 is a schematic diagram of the structure of a new combined earphone according to the first embodiment of the application;

[0024] 图 2为图 1的剖视图； [0024] FIG. 2 is a cross-sectional view of FIG. 1;

[0025] 图 3为本申请第二实施例新型组合式耳机的结构示意图； [0025] FIG. 3 is a schematic structural diagram of a new combined earphone according to a second embodiment of the application;

[0026] 图 4为图 3的剖视图； [0026] FIG. 4 is a cross-sectional view of FIG. 3;

[0027] 图 5为本申请第三实施例新型组合式耳机的结构示意图； [0027] FIG. 5 is a schematic diagram of the structure of a novel combined earphone according to a third embodiment of the application;

[0028] 图 6为图 5的剖视图； [0028] FIG. 6 is a cross-sectional view of FIG. 5;

[0029] 图 7为本申请第四实施例新型组合式耳机的结构示意图； [0029] FIG. 7 is a schematic structural diagram of a new combined earphone according to a fourth embodiment of the application;

[0030] 图 8为图 7的剖视图。 [0030] FIG. 8 is a cross-sectional view of FIG. 7.

[0031] 本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。 [0031] The realization, functional characteristics, and advantages of the purpose of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

[0032] 具体实施方式 [0032] Specific embodiments

[0033] 下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。 [0033] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of them. Example of the department. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

[0034] 需要说明，本申请中涉及“第一”、 “第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、 “第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。 [0034] It should be noted that the descriptions related to "first", "second", etc. in this application are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of indicated technical features . Therefore, the features defined with “first” and “second” may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on what can be achieved by a person of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be achieved, it should be considered that such a combination of technical solutions does not exist. , Is not within the scope of protection required by this application.

[0035] 请参照图 1和图 2，图 1为本申请第一实施例新型组合式耳机的结构示意图；图 2 为图 1的剖视图。在本申请实施例中，该新型组合式耳机包括： [0035] Please refer to FIGS. 1 and 2. FIG. 1 is a schematic structural diagram of a new combined earphone according to a first embodiment of the application; FIG. 2 is a cross-sectional view of FIG. 1. In the embodiment of the present application, the new combined earphone includes:

[0036] 耳机体，所述耳机体包括第一耳机及与第一耳机相对设置的第二耳机；所述第一耳机与第二耳机均包括耳机前壳 ₃₀与耳机后壳 40围成的容置空间，位于容置空间并安装于耳机前壳 30内壁的骨传导单元 10及空气传导单元 20所述耳机前壳 3 0外壁安装有对应骨传导单元 10设置的骨传导结构以及对应空气传导单元 20设置的空气传导结构； [0036] Earphone body, the earphone body includes a first earphone and a second earphone arranged opposite to the first earphone; both the first earphone and the second earphone include a volume enclosed by the earphone front shell ₃₀ and the earphone rear shell 40 The bone conduction unit 10 and the air conduction unit 20 located in the accommodating space and installed on the inner wall of the earphone front shell 30 are equipped with a bone conduction structure corresponding to the bone conduction unit 10 and a corresponding air conduction unit on the outer wall of the earphone front shell 30 20 set air conduction structure;

[0037] 头带 70, 所述头带 70连接第一耳机及第二耳机。 [0037] The headband 70 is connected to the first earphone and the second earphone.

[0038] 上述的，头带 70内设连接线，以使第一耳机与第二耳机通过连接线连接。当然，该连接线也可以不用从头带 70上经过，直接从耳壳下引出连接线。 [0038] As mentioned above, the headband 70 is provided with a connecting wire, so that the first earphone and the second earphone are connected through the connecting wire. Of course, the connecting wire can also be directly led out from under the ear shell without passing through the headband 70.

[0039] 本实施例中，耳机在工作时，一部分音频信号通过放大器输出到骨传导单元 10 、骨传导结构传入头部最终汇集于听觉中枢；另一部分音频信号直接连接到空气传导单元 20、空气传导结构耳朵最终汇集于听觉中枢，能够使对应的音频信号共同作用听觉中枢，达到增强耳机的音效与音感的效果，能够提升用户体验 [0039] In this embodiment, when the earphone is working, a part of the audio signal is output to the bone conduction unit 10 through the amplifier, and the bone conduction structure is introduced into the head and finally collected in the auditory center; the other part of the audio signal is directly connected to the air conduction unit 20, The air conduction structure ears are finally collected in the auditory center, which enables the corresponding audio signals to work together on the auditory center, achieving the effect of enhancing the sound effect and sound perception of the headset, and improving the user experience

[0040] 本申请的技术方案的耳机主要采用将耳机骨传导单元 10及空气传导单元 20设置于同一耳机中，具体的，骨传导单元 10及空气传导单元 20分别位于容置空间并安装于前壳内壁，通过整合骨传导耳机及空气传导耳机的特性，能够增强耳机的音效与音感，提升用户体验。 [0040] The earphone of the technical solution of the present application mainly uses the earphone bone conduction unit 10 and the air conduction unit 20 to be arranged in the same earphone. Specifically, the bone conduction unit 10 and the air conduction unit 20 are respectively located in the accommodating space and installed in the front. The inner wall of the shell integrates the characteristics of bone conduction earphones and air conduction earphones, which can enhance the sound effect and sense of the earphones, and enhance the user experience.

[0041] 在一具体的实施例中，骨传导结构为振动垫 50, 振动垫 50上凸设有与头部紧接触的抵接部。振动垫 50上凸设有至少一抵接部，使用时，抵接部紧贴头部，以保证骨传导单元 10正常工作。振动垫 50的抵接部可以选用柔性材料，以避免抵接部直接挤压头部皮肤。 [0041] In a specific embodiment, the bone conduction structure is a vibrating pad 50, and the vibrating pad 50 is protrudingly provided with the head immediately The abutment part that touches. At least one abutting portion is protrudingly provided on the vibration pad 50. When in use, the abutting portion is close to the head to ensure the normal operation of the bone conduction unit 10. The abutting part of the vibrating pad 50 can be made of a flexible material to avoid the abutting part directly squeezing the skin of the head.

[0042] 进一步的，所述骨传导单元 10的数量为一个或一个以上。骨传导单元 10的数量可以为一个或一个以上，具体的数量可以实际的要求来设置，此处不作限定。 [0042] Further, the number of the bone conduction unit 10 is one or more. The number of bone conduction units 10 can be one or more than one, and the specific number can be set according to actual requirements, which is not limited here.

[0043] 在一具体的实施例中，所述空气传导结构包括耳塞 60, 所述耳塞 60上可以罩设耳罩，使用时耳罩伸入耳道内，形成入耳式空气传导***，以提高空气传导的音效。 [0043] In a specific embodiment, the air conduction structure includes earplugs 60. The earplugs 60 can be covered with earmuffs. When in use, the earmuffs extend into the ear canal to form an in-ear air conduction system to improve the air. Conducted sound effects.

[0044] 进一步的，所述空气传导单元 20的数量为一个或一个以上。空气传导单元 20的数量可以为一个或一个以上，具体的数量可以实际的要求来设置，此处不作限定。 [0044] Further, the number of the air conduction unit 20 is one or more than one. The number of air conduction units 20 can be one or more than one, and the specific number can be set according to actual requirements, and is not limited here.

[0045] 在一具体的实施例中，所述第一耳机或第二耳机的后壳上设有麦克风 80。通过麦克风 80可以实现音频输入，完成语音交互。本实施例中，优选为麦克风 80设置于带对应左耳或右耳设置的第二耳机上。 [0045] In a specific embodiment, a microphone 80 is provided on the back shell of the first earphone or the second earphone. Through the microphone 80, audio input can be realized and voice interaction can be completed. In this embodiment, it is preferable that the microphone 80 is arranged on a second earphone with corresponding left ear or right ear setting.

[0046] 在一具体的实施例中，为了平衡骨传导单元 10与空气传导单元 20传导的声音，骨传导单元 10与空气传导单元 20传均连入音效平衡电路，通过音效平衡电路调节两者的声音效果，以提高耳机的音效与音感。当然，骨传导单元 10与空气传导单元 20还可以不通过音效平衡电路进行声音效果平衡控制。 [0046] In a specific embodiment, in order to balance the sound conducted by the bone conduction unit 10 and the air conduction unit 20, both the bone conduction unit 10 and the air conduction unit 20 are connected to the sound effect balance circuit, and the two are adjusted by the sound effect balance circuit. Sound effects to improve the sound effect and sense of the headset. Of course, the bone conduction unit 10 and the air conduction unit 20 may also perform sound effect balance control without using the sound effect balance circuit.

[0047] 请参照图 3和图 4，图 3为本申请第二实施例新型组合式耳机的结构示意图；图 4 为图 3的剖视图。在本申请实施例中，该新型组合式耳机包括： [0047] Please refer to FIG. 3 and FIG. 4. FIG. 3 is a schematic structural diagram of a new combined earphone according to a second embodiment of the application; FIG. 4 is a cross-sectional view of FIG. 3. In the embodiment of the present application, the new combined earphone includes:

[0048] 耳机体，所述耳机体包括第一耳机及与第一耳机相对设置的第二耳机；所述第一耳机与第二耳机均包括耳机前壳 31与耳机后壳 41围成的容置空间，位于容置空间并安装于耳机前壳 31内壁的骨传导单元 11，及第一前壳 24与第一耳机后壳 1 4围成的容置空间，位于容置空间并安装于第一前壳 24内壁的空气传导单元 21，所述骨传导单元 11及空气传导单元 21通过连接线 15连接；所述耳机前壳 31外壁安装有对应骨传导单元 11设置的骨传导结构，以及第一前壳 24外壁安装有对应空气传导单元 21设置的空气传导结构； [0048] Earphone body, the earphone body includes a first earphone and a second earphone arranged opposite to the first earphone; both the first earphone and the second earphone include a volume enclosed by the earphone front shell 31 and the earphone rear shell 41 The bone conduction unit 11 located in the accommodating space and installed on the inner wall of the earphone front shell 31, and the accommodating space enclosed by the first front shell 24 and the first earphone rear shell 14 are located in the accommodating space and installed in the An air conduction unit 21 on the inner wall of the front shell 24, the bone conduction unit 11 and the air conduction unit 21 are connected by a connecting wire 15; the outer wall of the earphone front shell 31 is installed with a bone conduction structure corresponding to the bone conduction unit 11, and An air conduction structure corresponding to the air conduction unit 21 is installed on the outer wall of the front shell 24;

[0049] 头带，所述头带连接第一耳机及第二耳机。 [0050] 上述的头带 71内设连接线，以使第一耳机与第二耳机通过连接线连接。当然，该连接线也可以不用从头带 71上经过，直接从耳壳下引出连接线。 [0049] The headband is connected to the first earphone and the second earphone. [0050] The aforementioned headband 71 is provided with a connecting wire, so that the first earphone and the second earphone are connected through the connecting wire. Of course, the connecting wire can also be directly led out from under the ear shell without passing through the headband 71.

[0051] 在一具体的实施例中，骨传导结构为振动垫 51，振动垫 51上凸设有与头部紧接触的抵接部。振动垫 51上凸设有至少一抵接部，使用时，抵接部紧贴头部，以保证骨传导单元 11正常工作。振动垫 51的抵接部可以选用柔性材料，以避免抵接部直接挤压头部皮肤。 [0051] In a specific embodiment, the bone conduction structure is a vibrating pad 51, and the vibrating pad 51 is protrudingly provided with an abutting portion that is in close contact with the head. At least one abutting portion is protrudingly provided on the vibration pad 51. When in use, the abutting portion is close to the head to ensure the normal operation of the bone conduction unit 11. The abutting part of the vibrating pad 51 can be made of flexible materials to avoid the abutting part directly squeezing the skin of the head.

[0052] 进一步的，所述骨传导单元 11的数量为一个或一个以上。骨传导单元 11的数量可以为一个或一个以上，具体的数量可以实际的要求来设置，此处不作限定。 [0052] Further, the number of the bone conduction unit 11 is one or more. The number of bone conduction units 11 can be one or more than one, and the specific number can be set according to actual requirements, which is not limited here.

[0053] 在一具体的实施例中，所述空气传导结构包括耳壳 61，所述耳壳 61压接于耳道夕卜，使用时，耳壳 61塞于耳道外，形成耳塞式空气传导***，以提高空气传导的音效。 [0053] In a specific embodiment, the air conduction structure includes an ear shell 61, the ear shell 61 is crimped on the ear canal, when in use, the ear shell 61 is plugged outside the ear canal to form an ear plug type air conduction System to improve the sound effect of air conduction.

[0054] 在一具体的实施例中，所述骨传导单元 11与空气传导单元 21分开设置。具体的，所述新型组合式耳机还包括第一前壳 24、第一后壳 14以及连接第一前壳 24与第一后壳 14的连接线 15 , 所述第一前壳 24与第一后壳 14围成供容置空气传导单元 21的容置空间，所述空气传单元 21与骨传导单元 11通过连接线 15电性连接。本方案中，骨传导单元 11与空气传导单元 21可以整合在一起，也可以分开设置。分开设置时，空气传导单元 21位于第一前壳 24与第一后壳 14的容置空间，骨传导单元 11位于耳机前壳 31与耳机后壳 41的容置空间，空气传导单元 21与骨传导单元 11两者通过连接线 15连接。 [0054] In a specific embodiment, the bone conduction unit 11 and the air conduction unit 21 are provided separately. Specifically, the new type combined earphone further includes a first front shell 24, a first rear shell 14, and a connecting wire 15 connecting the first front shell 24 and the first rear shell 14. The first front shell 24 and the first rear shell 14 The back shell 14 encloses an accommodating space for accommodating the air conduction unit 21, and the air conduction unit 21 and the bone conduction unit 11 are electrically connected by a connecting wire 15. In this solution, the bone conduction unit 11 and the air conduction unit 21 can be integrated together, or can be arranged separately. When arranged separately, the air conduction unit 21 is located in the accommodating space of the first front shell 24 and the first rear shell 14, the bone conduction unit 11 is located in the accommodating space of the earphone front shell 31 and the earphone rear shell 41, and the air conduction unit 21 and the bone The two conductive units 11 are connected by a connecting wire 15.

[0055] 进一步的，所述空气传导单元 21的数量为一个或一个以上。空气传导单元 21的数量可以为一个或一个以上，具体的数量可以实际的要求来设置，此处不作限定。 [0055] Further, the number of the air conduction unit 21 is one or more than one. The number of air conduction units 21 can be one or more than one, and the specific number can be set according to actual requirements, which is not limited here.

[0056] 在一具体的实施例中，所述第一耳机或第二耳机的后壳上设有麦克风 81。通过麦克风 81可以实现音频输入，完成语音交互。本实施例中，优选为麦克风 81设置于带对应左耳或右耳设置的第二耳机上。 [0056] In a specific embodiment, a microphone 81 is provided on the back shell of the first earphone or the second earphone. The microphone 81 can realize audio input and complete voice interaction. In this embodiment, it is preferable that the microphone 81 is arranged on a second earphone with corresponding left ear or right ear setting.

[0057] 在一具体的实施例中，所述骨传导单元 11与空气传导单元 21通过音效平衡电路电性连接。为了平衡骨传导单元 11与空气传导单元 21传导的声音，骨传导单元 1 1与空气传导单元 21传均连入音效平衡电路，通过音效平衡电路调节两者的声音效果，以提高耳机的音效与音感。当然，骨传导单元 11与空气传导单元 21还可以不通过音效平衡电路进行声音效果平衡控制。 [0057] In a specific embodiment, the bone conduction unit 11 and the air conduction unit 21 are electrically connected through a sound balance circuit. In order to balance the sound conducted by the bone conduction unit 11 and the air conduction unit 21, both the bone conduction unit 11 and the air conduction unit 21 are connected to the sound effect balance circuit, and the sound of both is adjusted through the sound effect balance circuit. Effect to improve the sound effect and sense of the headset. Of course, the bone conduction unit 11 and the air conduction unit 21 may also perform sound effect balance control without using a sound effect balance circuit.

[0058] 请参照图 5和图 6，图 5为本申请第三实施例新型组合式耳机的结构示意图；图 6 为图 5的剖视图。在本申请实施例中，该新型组合式耳机包括： [0058] Please refer to FIG. 5 and FIG. 6. FIG. 5 is a schematic structural diagram of a new combined earphone according to a third embodiment of the application; FIG. 6 is a cross-sectional view of FIG. 5. In the embodiment of the present application, the new combined earphone includes:

[0059] 耳机体，所述耳机体包括第一耳机及与第一耳机相对设置的第二耳机；所述第一耳机与第二耳机均包括耳机前壳 32与耳机后壳 42围成的容置空间，位于容置空间并安装于耳机前壳 32内壁的骨传导单元 12及空气传导单元 22, ；所述耳机前壳 32外壁安装有对应骨传导单元 12设置的骨传导结构以及对应空气传导单元 2 2设置的空气传导结构； [0059] Earphone body, the earphone body includes a first earphone and a second earphone arranged opposite to the first earphone; both the first earphone and the second earphone include a volume enclosed by the earphone front shell 32 and the earphone rear shell 42 The bone conduction unit 12 and the air conduction unit 22, located in the accommodating space and installed on the inner wall of the earphone front shell 32; The outer wall of the earphone front shell 32 is installed with a bone conduction structure corresponding to the bone conduction unit 12 and corresponding air conduction Air conduction structure set in unit 22;

[0060] 头带 72, 所述头带 72连接第一耳机及第二耳机。 [0060] The headband 72 is connected to the first earphone and the second earphone.

[0061] 上述的头带 72内设连接线，以使第一耳机与第二耳机通过连接线连接。当然，该连接线也可以不用从头带 72上经过，直接从耳壳下引出连接线。 [0061] The aforementioned headband 72 is provided with a connecting wire, so that the first earphone and the second earphone are connected through the connecting wire. Of course, the connecting wire can also be directly led out from under the ear shell without passing through the headband 72.

[0062] 在一具体的实施例中，骨传导结构为振动垫 52, 振动垫 52上凸设有与头部紧接触的抵接部。振动垫 52上凸设有至少一抵接部，使用时，抵接部紧贴头部，以保证骨传导单元 12正常工作。振动垫 52的抵接部可以选用柔性材料，以避免抵接部直接挤压头部皮肤。 [0062] In a specific embodiment, the bone conduction structure is a vibrating pad 52, and the vibrating pad 52 is protrudingly provided with an abutting portion that is in close contact with the head. At least one abutting portion is protrudingly provided on the vibration pad 52. When in use, the abutting portion is close to the head to ensure the normal operation of the bone conduction unit 12. The abutting part of the vibration pad 52 can be made of flexible material to avoid the abutting part directly squeezing the skin of the head.

[0063] 进一步的，所述骨传导单元 12的数量为一个或一个以上。骨传导单元 12的数量可以为一个或一个以上，具体的数量可以实际的要求来设置，此处不作限定。 [0063] Further, the number of the bone conduction unit 12 is one or more. The number of bone conduction units 12 can be one or more than one, and the specific number can be set according to actual requirements, which is not limited here.

[0064] 在一具体的实施例中，所述空气传导结构包括耳罩 52, 所述耳罩 52贴紧人耳设置，使用时耳罩 52压紧于耳朵外，形成压耳式空气传导***，以提高空气传导的音效。 [0064] In a specific embodiment, the air conduction structure includes earmuffs 52. The earmuffs 52 are arranged close to the human ears. When in use, the earmuffs 52 are pressed against the ears to form an ear-pressing air conduction system , To improve the sound effect of air conduction.

[0065] 进一步的，所述空气传导单元 22的数量为一个或一个以上。空气传导单元 22的数量可以为一个或一个以上，具体的数量可以实际的要求来设置，此处不作限定。 [0065] Further, the number of the air conduction unit 22 is one or more than one. The number of air conduction units 22 can be one or more than one, and the specific number can be set according to actual requirements, and is not limited here.

[0066] 在一具体的实施例中，所述第一耳机或第二耳机的后壳上设有麦克风 82。通过麦克风 82可以实现音频输入，完成语音交互。本实施例中，优选为麦克风 82设置于带对应右耳设置的第二耳机上。 [0066] In a specific embodiment, a microphone 82 is provided on the back shell of the first earphone or the second earphone. The microphone 82 can realize audio input and complete voice interaction. In this embodiment, it is preferable that the microphone 82 is arranged on a second earphone with a setting corresponding to the right ear.

[0067] 在一具体的实施例中，所述骨传导单元 12与空气传导单元 22通过音效平衡电路电性连接。为了平衡骨传导单元 12与空气传导单元 22传导的声音，骨传导单元 1 2与空气传导单元 22传均连入音效平衡电路，通过音效平衡电路调节两者的声音效果，以提高耳机的音效与音感。当然，骨传导单元 12与空气传导单元 22还可以不通过音效平衡电路进行声音效果平衡控制。 [0067] In a specific embodiment, the bone conduction unit 12 and the air conduction unit 22 pass through a sound balance circuit Electrical connection. In order to balance the sound conducted by the bone conduction unit 12 and the air conduction unit 22, both the bone conduction unit 12 and the air conduction unit 22 are connected to the sound effect balance circuit, and the sound effects of the two are adjusted through the sound effect balance circuit to improve the sound effect of the headset. Sense of sound. Of course, the bone conduction unit 12 and the air conduction unit 22 may also perform sound effect balance control without using a sound effect balance circuit.

[0068] 请参照图 7和图 8，图 7为本申请第四实施例新型组合式耳机的结构示意图；图 8 为图 7的剖视图。在本申请实施例中，该新型组合式耳机包括： [0068] Please refer to FIG. 7 and FIG. 8. FIG. 7 is a schematic structural diagram of a new combined earphone according to a fourth embodiment of the application; FIG. 8 is a cross-sectional view of FIG. In the embodiment of the present application, the new combined earphone includes:

[0069] 耳机体，所述耳机体包括第一耳机及与第一耳机相对设置的第二耳机；所述第一耳机与第二耳机均包括耳机前壳 ₃₃与耳机后壳 43围成的容置空间，位于容置空间并安装于耳机前壳 33内壁的骨传导单元 13及空气传导单元 23 ; 所述耳机前壳 33外壁安装有对应骨传导单元 13设置的骨传导结构以及对应空气传导单元 23 设置的空气传导结构；头带 73 , 所述头带 73连接第一耳机及第二耳机。 [0069] Earphone body, the earphone body includes a first earphone and a second earphone arranged opposite to the first earphone; both the first earphone and the second earphone include a volume enclosed by the earphone front shell ₃₃ and the earphone rear shell 43 The bone conduction unit 13 and the air conduction unit 23 located in the accommodating space and installed on the inner wall of the earphone front shell 33; the outer wall of the earphone front shell 33 is installed with a bone conduction structure corresponding to the bone conduction unit 13 and a corresponding air conduction unit 23 The air conduction structure provided; a headband 73, the headband 73 is connected to the first earphone and the second earphone.

[0070] 上述的头带 73内设连接线，以使第一耳机与第二耳机通过连接线连接。当然 [0070] The aforementioned headband 73 is provided with a connecting wire, so that the first earphone and the second earphone are connected through the connecting wire. of course

，该连接线也可以不用从头带 73上经过，直接从耳壳下引出连接线。 The connecting wire can also be directly led out from under the ear shell without passing through the headband 73.

[0071] 在一具体的实施例中，骨传导结构为振动垫 53 , 振动垫 53上凸设有与头部紧接触的抵接部。振动垫 53上凸设有至少一抵接部，使用时，抵接部紧贴头部，以保证骨传导单元 13正常工作。振动垫 53的抵接部可以选用柔性材料，以避免抵接部直接挤压头部皮肤。 [0071] In a specific embodiment, the bone conduction structure is a vibrating pad 53, and the vibrating pad 53 is protrudingly provided with an abutting portion that is in close contact with the head. At least one abutting portion is protrudingly provided on the vibrating pad 53. When in use, the abutting portion is close to the head to ensure the normal operation of the bone conduction unit 13. The abutting part of the vibrating pad 53 can be made of flexible materials to avoid the abutting part directly squeezing the skin of the head.

[0072] 进一步的，所述骨传导单元 13的数量为一个或一个以上。骨传导单元 13的数量可以为一个或一个以上，具体的数量可以实际的要求来设置，此处不作限定。 [0072] Further, the number of the bone conduction unit 13 is one or more. The number of bone conduction units 13 can be one or more than one, and the specific number can be set according to actual requirements, which is not limited here.

[0073] 在一具体的实施例中，所述空气传导结构包括耳罩 53 , 耳罩 53设于人耳外周侧，使用时，耳罩 53罩盖于耳朵上，形成头戴式空气传导***，以提高空气传导的音效。 [0073] In a specific embodiment, the air conduction structure includes earmuffs 53, the earmuffs 53 are provided on the outer peripheral side of the human ear, when in use, the earmuffs 53 cover the ears to form a head-mounted air conduction system , To improve the sound effect of air conduction.

[0074] 进一步的，所述空气传导单元 23的数量为一个或一个以上。空气传导单元 23的数量可以为一个或一个以上，具体的数量可以实际的要求来设置，此处不作限定。 [0074] Further, the number of the air conduction unit 23 is one or more. The number of air conduction units 23 can be one or more than one, and the specific number can be set according to actual requirements, which is not limited here.

[0075] 在一具体的实施例中，所述第一耳机或第二耳机的后壳上设有麦克风 83。通过麦克风 83可以实现音频输入，完成语音交互。本实施例中，优选为麦克风 83设置于带对应右耳设置的第二耳机上。 [0076] 在一具体的实施例中，所述骨传导单元 13与空气传导单元 23通过音效平衡电路电性连接。为了平衡骨传导单元 13与空气传导单元 23传导的声音，骨传导单元 1 3与空气传导单元 23传均连入音效平衡电路，通过音效平衡电路调节两者的声音效果，以提高耳机的音效与音感。当然，骨传导单元 13与空气传导单元 23还可以不通过音效平衡电路进行声音效果平衡控制。 [0075] In a specific embodiment, a microphone 83 is provided on the rear shell of the first earphone or the second earphone. Audio input can be realized through the microphone 83, and voice interaction is completed. In this embodiment, it is preferable that the microphone 83 is provided on a second earphone with a setting corresponding to the right ear. [0076] In a specific embodiment, the bone conduction unit 13 and the air conduction unit 23 are electrically connected through a sound balance circuit. In order to balance the sound conducted by the bone conduction unit 13 and the air conduction unit 23, the bone conduction unit 13 and the air conduction unit 23 are both connected to the sound effect balance circuit, and the sound effects of the two are adjusted through the sound effect balance circuit to improve the sound effect of the earphone. Sense of sound. Of course, the bone conduction unit 13 and the air conduction unit 23 may also perform sound effect balance control without using the sound effect balance circuit.

[0077] 以上所述仅为本申请的优选实施例，并非因此限制本申请的专利范围，凡是在本申请的申请构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接 /间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。 [0077] The above descriptions are only preferred embodiments of this application, and do not limit the scope of this application. Any equivalent structure transformation made by using the content of the specification and drawings of this application under the application concept of this application, or directly /Indirect applications in other related technical fields are included in the scope of patent protection of this application.

发明概述 Summary of the invention

技术问题 technical problem

问题的解决方案 The solution to the problem

发明的有益效果 The beneficial effects of the invention

Claims

权利要求书 Claims

[权利要求 1] 一种新型组合式耳机，其特征在于，所述新型组合式耳机包括：耳机体，所述耳机体包括第一耳机及与第一耳机相对设置的第二耳机 ; 所述第一耳机与第二耳机均包括耳机前壳与耳机后壳围成的容置空间，位于容置空间并安装于耳机前壳内壁的骨传导单元及空气传导单元，所述骨传导单元及空气传导单元电性连接；所述耳机前壳外壁安装有对应骨传导单元设置的骨传导结构以及对应空气传导单元设置的空气传导结构； [Claim 1] A new type of combined earphone, characterized in that, the new type of combined earphone comprises: an earphone body, the earphone body includes a first earphone and a second earphone arranged opposite to the first earphone; Both the first earphone and the second earphone include an accommodating space enclosed by the earphone front shell and the earphone rear shell, a bone conduction unit and an air conduction unit located in the accommodating space and installed on the inner wall of the earphone front shell, the bone conduction unit and the air conduction unit The unit is electrically connected; the outer wall of the earphone front shell is provided with a bone conduction structure corresponding to the bone conduction unit and an air conduction structure corresponding to the air conduction unit;

头带，所述头带的两端分别连接第一耳机及第二耳机。 A headband, the two ends of the headband are respectively connected to the first earphone and the second earphone.

[权利要求 2] 如权利要求 1所述的新型组合式耳机，其特征在于，所述骨传导结构为振动垫，振动垫上凸设有与头部紧接触的抵接部。 [Claim 2] The new combined earphone according to claim 1, wherein the bone conduction structure is a vibrating pad, and the vibrating pad is protrudingly provided with an abutting portion in close contact with the head.

[权利要求 3] 如权利要求 2所述的新型组合式耳机，其特征在于，所述骨传导单元的数量为一个或一个以上。 [Claim 3] The new combined earphone according to claim 2, wherein the number of the bone conduction unit is one or more.

[权利要求 4] 如权利要求 1所述的新型组合式耳机，其特征在于，所述空气传导结构包括耳塞，所述耳塞压接于耳道外或伸入耳道内。 [Claim 4] The new combined earphone according to claim 1, wherein the air conduction structure comprises an earplug, and the earplug is crimped outside the ear canal or extends into the ear canal.

[权利要求 5] 如权利要求 1所述的新型组合式耳机，其特征在于，所述空气传导结构包括耳罩，所述耳罩贴近人耳或罩设于人耳外周侧。 [Claim 5] The new combined earphone according to claim 1, wherein the air conduction structure comprises an earmuff, and the earmuff is close to the human ear or the cover is arranged on the outer periphery of the human ear.

[权利要求 6] 如权利要 4或 5所述的新型组合式耳机，其特征在于，所述空气传导单元的数量为一个或一个以上。 [Claim 6] The new combined earphone according to claim 4 or 5, wherein the number of the air conduction unit is one or more.

[权利要求 7] 如权利要求 1所述的新型组合式耳机，其特征在于，所述骨传导单元与空气传导单元分开设置。 [Claim 7] The new combined earphone according to claim 1, wherein the bone conduction unit and the air conduction unit are arranged separately.

[权利要求 8] 如权利要求 7所述的新型组合式耳机，其特征在于，所述新型组合式耳机还包括第一前壳、第一后壳以及连接第一前壳与第一后壳的连接线，所述第一前壳与第一后壳围成供容置空气传导单元的容置空间。 [Claim 8] The new combined earphone according to claim 7, characterized in that, the new combined earphone further comprises a first front shell, a first rear shell, and a first front shell connecting the first front shell and the first rear shell. Connecting wires, the first front shell and the first rear shell enclose an accommodation space for accommodating the air conduction unit.

[权利要求 9] 如权利要求 1所述的新型组合式耳机，其特征在于，所述骨传导单元与空气传导单元通过音效平衡电路电性连接。 [Claim 9] The new combined earphone according to claim 1, wherein the bone conduction unit and the air conduction unit are electrically connected through a sound balance circuit.

[权利要求 10] 如权利要求 1所述的新型组合式耳机，其特征在于，所述第一耳机或第二耳机的后壳上设有麦克风。 [Claim 10] The new combined earphone according to claim 1, wherein a microphone is provided on the back shell of the first earphone or the second earphone.