WO2020147355A1 - 一种子母平台印刷机及调整印刷方法 - Google Patents

一种子母平台印刷机及调整印刷方法 Download PDF

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Publication number
WO2020147355A1
WO2020147355A1 PCT/CN2019/112494 CN2019112494W WO2020147355A1 WO 2020147355 A1 WO2020147355 A1 WO 2020147355A1 CN 2019112494 W CN2019112494 W CN 2019112494W WO 2020147355 A1 WO2020147355 A1 WO 2020147355A1
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Prior art keywords
platform
mother
substrate
child
steel mesh
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PCT/CN2019/112494
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English (en)
French (fr)
Inventor
邱国良
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东莞市凯格精密机械有限公司
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Priority claimed from CN201920056537.8U external-priority patent/CN209775800U/zh
Priority claimed from CN201910032188.0A external-priority patent/CN109532217B/zh
Application filed by 东莞市凯格精密机械有限公司 filed Critical 东莞市凯格精密机械有限公司
Publication of WO2020147355A1 publication Critical patent/WO2020147355A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

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  • the invention relates to a circuit board printer, in particular to a mother-child platform printer and a method for adjusting printing.
  • the most critical part of the process is the overlap of the position identification points of the stencil and the substrate.
  • multiple alignments are required to achieve the best printing effect.
  • existing printers are generally only suitable for printing a single substrate or the same kind of substrate. Can not complete the printing of different types of substrates.
  • the purpose of the present invention is to provide a mother-and-child platform printer and a method for adjusting printing in response to the above-mentioned defects of the prior art.
  • a mother-child platform printer including a mother platform, a child platform and a CCD module, the CCD module sequentially or simultaneously positioning the mother platform and the child platform The position of the base plate and the steel mesh is identified, and then the mother platform and the sub platform adjust the overlap of the base plate and the steel mesh.
  • the sub-platform is provided with a suction cavity jig.
  • the CCD module simultaneously positions the substrate and the steel on the mother platform and the sub-platform. The net position identifies the point, and then the mother platform and the sub-platform adjust the overlap of the substrate and the steel net at the same time.
  • the child platform is embedded in the mother platform, and the CCD module sequentially locates the position identification points of the substrate and steel mesh on the mother platform and the child platform, and then the mother platform and the child platform The platform adjusts the overlap of the base plate and the steel mesh in turn.
  • the CCD module is arranged above the mother platform and the child platform.
  • the child-mother platform printer of the present invention also includes two transport rails for transporting substrate jigs, the suction cavity jig is located between the two transport rails, and the transport rails are located Above the mother platform, the transport guide rail transports the jig carrying the substrate to the center position of the printer, the mother platform is lifted to the image capturing position, the suction cavity jig absorbs the substrate, and the CCD module is positioned
  • the position identification points of the base plate and steel mesh on the mother platform and the sub platform, the mother platform and the sub platform adjust the overlap of the base plate and the steel mesh.
  • the CCD module sequentially or simultaneously locates the position identification points of the substrate and steel mesh on the parent platform and the child platform,
  • the platform and the sub-platform adjust the overlap of the base plate and the steel mesh sequentially or simultaneously.
  • the CCD module when there is one child platform, the CCD module separately locates the position recognition point of the substrate and the steel mesh on the mother platform, and the mother platform adjusts the overlap of the substrate and the steel mesh.
  • the sub-platform remains stationary.
  • the present invention adopts a sub-platform and a parent platform.
  • the sub-platform and the parent platform can be completely independent, and the sub-platform can also be embedded in the parent platform.
  • the parent platform and the sub-platform can adjust the overlap of the substrate and the stencil position identification point in turn, and can also control the substrate and the stencil on the parent platform separately Coincidence of position identification points.
  • Multiple substrates can be printed at the same time, and each substrate can be the same or different substrates can be selected; improve printing efficiency.
  • Another object of the present invention is to provide a method for adjusting the printing of the mother and child platform.
  • a child platform, a mother platform and a CCD module are arranged on the printing frame, and the child platform is embedded in the mother platform, including the following steps:
  • Substrate transport transport the jig loaded with two substrates or more than two substrates to the center of the printing machine through the transport rail, and the vacuum pump is turned on;
  • the MARK point coincides and aligns; the platform module is lifted by the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module locates the substrate on the mother platform and the steel mesh MARK Point, the mother platform adjusts the base plate to coincide with the steel mesh; the platform module includes the child platform and the mother platform;
  • the CCD module locates the MARK point of the substrate and the steel mesh on the sub-platform, and the sub-platform adjusts the substrate to coincide with the steel mesh;
  • the platform module rises to the printing position, and multiple substrates are printed at the same time. After the multiple substrates are printed, the platform is lowered, and the jigs loaded with substrates are transported out of the printer through the transportation rail;
  • Another object of the present invention is to provide a method for adjusting the printing of the mother and child platform.
  • a child platform, a mother platform and a CCD module are arranged on the printing frame, and the child platform and the mother platform are independent, including the following steps:
  • Substrate transport transport the jig loaded with two substrates or more than two substrates to the center of the printing machine through the transport rail, and the vacuum pump is turned on;
  • the MARK point coincides and aligns; the platform module is lifted from the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module locates the substrate on the sub-platform and the mother platform at the same time At the same time as the MARK point of the steel mesh, the sub-platform and the mother platform adjust the overlap of the substrate and the steel mesh; the platform module includes the sub-platform and the mother platform;
  • the platform module rises to the printing position, and multiple substrates are printed at the same time. After the printing is completed, the platform module descends, and the jig loaded with multiple substrates is transported out of the printer through the transportation rail;
  • Another object of the present invention is to provide a method for adjusting the printing of the mother and child platform.
  • a child platform, a mother platform and a CCD module are arranged on the printing frame, and the child platform and the mother platform are integrated, including the following steps:
  • Substrate transportation transport the jig loaded with a single substrate to the center of the printing machine through the transport rail, and the vacuum pump is turned on;
  • the MARK point coincides and aligns; the platform module is lifted by the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module separately positions the substrate and the steel mesh on the mother platform MARK point, the mother platform adjusts the substrate to coincide with the steel mesh, and the child platform does not move; the platform module includes the child platform and the mother platform;
  • the platform module rises to the printing position, and the substrate is printed. After the printing is completed, the platform module descends, and the jig loaded with a single substrate is transported out of the printer through the transportation rail.
  • Figure 1 is a schematic diagram of the three-dimensional structure of the present invention.
  • Figure 2 is a schematic diagram of the CCD module structure.
  • a mother-child platform printer includes a mother platform 1, a child platform 2 and a CCD module 3.
  • the sub-platform 2 also has two or more.
  • Each sub-platform 2 and the mother platform 1 are independent.
  • the CCD module 3 positions and adjusts the substrates on the mother platform 1 and each sub-platform 2 at the same time.
  • the coincidence of the identification points of the steel mesh position In detail, the CCD module 3 simultaneously locates the position identification points of the substrate and the steel mesh on the mother platform 1 and each sub platform 2 so that the mother platform 1 and each sub platform 2 adjust the overlap of the substrate and the steel mesh.
  • the sub-platform 2 is provided with a suction cavity fixture 4.
  • the suction cavity fixture 4 is used to adsorb the substrate on the fixture.
  • the CCD module 3 is arranged above the mother platform 1 and the sub platform 2.
  • the suction cavity jig 4 is located between the two transport rails 5, the transport rail 5 is above the mother platform 1, and the transport rail 5 will carry the substrate jigs Convey to the center of the printer, the mother platform 1 is lifted to the image capturing position, the suction cavity fixture 4 absorbs the substrate, and the CCD module 3 locates the identification points of the substrate and steel mesh on the mother platform 1 and the sub platform 2.
  • the CCD module 3 has an X-axis moving device 31 and a Y-axis moving device 32.
  • the X-axis moving device 31 is equipped with a CCD33, the X-axis moving device 31 is controlled by the Y-axis moving device 32, and the CCD33 is controlled by the X-axis moving device 31. . Find the position identification point and the position of the substrate and steel mesh through CCD33.
  • Substrate transport transport the jig loaded with two substrates or more than two substrates to the center of the printing machine through the transport rail, and the vacuum pump is turned on;
  • the MARK point coincides and aligns; the platform module is lifted from the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module locates the substrate on the sub-platform and the mother platform at the same time At the same time as the MARK point of the steel mesh, the sub-platform and the mother platform adjust the overlap of the substrate and the steel mesh; the platform module includes the sub-platform and the mother platform;
  • the platform module rises to the printing position, and multiple substrates are printed at the same time. After the printing is completed, the platform module descends, and the jig loaded with multiple substrates is transported out of the printer through the transportation rail.
  • the second embodiment a mother-child platform printer, including a mother platform 1, a child platform 2 and a CCD module 3.
  • the sub-platform 2 also has two or more. Each sub-platform is adsorbed with a substrate. A plurality of sub-platforms 2 are embedded in the mother platform 1.
  • the CCD module 3 positions and adjusts the substrates on the mother platform 1 and the child platform 2 in turn. The coincidence of the identification points of the steel mesh position.
  • the CCD module 3 sequentially locates the position identification points of the substrate and the steel mesh on the mother platform 1 and the sub platform 2 so that the mother platform 1 and the sub platform 2 adjust the overlap of the substrate and the steel mesh.
  • Substrate transport transport the jig loaded with two substrates or more than two substrates to the center of the printing machine through the transport rail, and the vacuum pump is turned on;
  • the MARK point coincides and aligns; the platform module is lifted by the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module locates the substrate on the mother platform and the steel mesh MARK Point, the mother platform adjusts the base plate to coincide with the steel mesh; the platform module includes the child platform and the mother platform;
  • the CCD module locates the MARK point of the substrate and the steel mesh on the sub-platform, and the sub-platform adjusts the substrate to coincide with the steel mesh;
  • the platform module rises to the printing position, and multiple substrates are printed at the same time. After the multiple substrates are printed, the platform is lowered, and the jigs loaded with substrates are transported out of the printer through the transportation rail;
  • the third embodiment a mother-child platform printer, including mother platform 1, child platform 2, and CCD module 3.
  • mother platform 1, child platform 2, and CCD module 3 There is one sub-platform 2, and each sub-platform has a substrate adsorbed on it.
  • the sub-platform 2 is embedded in the mother platform 1.
  • the CCD module 3 separately adjusts the overlap between the substrate on the mother platform 1 and the position identification point of the steel mesh.
  • the CCD module 3 separately locates the position identification points of the substrate and the steel mesh on the mother platform 1 so that the mother platform 1 adjusts the overlap of the substrate and the steel mesh.
  • a method for adjusting and printing on a sub-platform A sub-platform, a mother platform and a CCD module are arranged on a printing frame.
  • the sub-platform and the mother platform are integrated and include the following steps:
  • Substrate transportation transport the jig loaded with a single substrate to the center of the printing machine through the transport rail, and the vacuum pump is turned on;
  • the MARK point coincides and aligns; the platform module is lifted by the jacking device to the image capturing position, the suction cavity fixture on the platform module sucks the substrate, and the CCD module separately positions the substrate and the steel mesh on the mother platform MARK point, the mother platform adjusts the substrate to coincide with the steel mesh, and the child platform does not move; the platform module includes the child platform and the mother platform;
  • the platform module rises to the printing position, and the substrate is printed. After the printing is completed, the platform module descends, and the jig loaded with a single substrate is transported out of the printer through the transportation rail.
  • the invention adopts a sub-platform and a parent platform.
  • the sub-platform and the parent platform can be completely independent, and the sub-platform can also be embedded in the parent platform.
  • the parent platform and the sub-platform can simultaneously adjust the overlap of the substrate and the steel mesh position identification point, or can independently control and adjust the parent platform or the sub-platform.
  • Multiple substrates can be printed at the same time, and each substrate can be the same or different; improving printing efficiency.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)

Abstract

一种子母平台印刷机，包括母平台（1）、子平台（2）和CCD模组（3），CCD模组同时或依次定位母平台和子平台上的基板与钢网位置识别点，然后母平台和子平台同时或依次调整基板与钢网的重合；其中，子平台与母平台可以是完全独立的，子平台也可以镶嵌在母平台内，母平台和子平台能够依次调整基板与钢网位置识别点的重合，也可以单独控制母平台上的基板与钢网位置识别点的重合。这种印刷机可以同时对多块基板进行印刷，每块基板可以相同，也可以不同，由此提高了印刷效率。

Description

一种子母平台印刷机及调整印刷方法
本申请要求于2019年01月14日提交中国专利局、申请号为201910032188.0、发明名称为“一种子母平台印刷机及调整印刷方法”以及于同日提交中国专利局、申请号为201920056537.8、发明名称为“一种子母平台印刷机及调整印刷方法”的两件中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电路板印刷机，特别涉及一种子母平台印刷机及调整印刷方法。
背景技术
目前，电路板的锡膏印刷，其最关键的流程部分是钢网与基板的位置识别点的重合，为了找到重合点，需要多次对位后才能实现最好的印刷效果。但现有的印刷机一般只适合单块基板或同种基板的印刷。不能完成不同类型基板的印刷。
发明内容
本发明的目的是针对现有技术的上述缺陷，提供一种子母平台印刷机及调整印刷方法。
为解决现有技术的上述缺陷，本发明提供的技术方案是：一种子母平台印刷机，包括母平台、子平台和CCD模组，所述CCD模组依次或同时定位母平台和子平台上的基板与钢网位置识别点，然后母平台、子平台调整基板与钢网的重合。
作为本发明子母平台印刷机的一种改进，所述子平台上设有吸腔治具，所述子平台为独立平台时，所述CCD模组同时定位母平台和子平台上的基板与钢网位置识别点,然后母平台和子平台同时调整基板与钢网的重合。
作为本发明子母平台印刷机的一种改进，所述子平台镶嵌入所述母平 台上，所述CCD模组依次定位母平台和子平台上的基板与钢网位置识别点，然后母平台和子平台依次调整基板与钢网的重合。
作为本发明子母平台印刷机的一种改进，所述CCD模组设置在所述母平台和子平台的上方。
作为本发明子母平台印刷机的一种改进，还包括两条用于输送载有基板治具的运输导轨，所述吸腔治具位于两条所述运输导轨之间，所述运输导轨位于所述母平台上方，所述运输导轨将载有基板的治具输送至印刷机中心位置，所述母平台顶升至取像位置，所述吸腔治具吸附基板，所述CCD模组定位母平台和子平台上的基板与钢网位置识别点，母平台和子平台调整基板与钢网的重合。
作为本发明子母平台印刷机的一种改进，所述子平台为两个或两个以上时，所述CCD模组依次或同时定位母平台和子平台上的基板与钢网位置识别点，母平台和子平台依次或同时调整基板与钢网的重合。
作为本发明子母平台印刷机的一种改进，所述子平台为一个时，所述CCD模组单独定位母平台上的基板与钢网位置识别点，母平台调整基板与钢网的重合，所述子平台保持不动。
与现有技术相比，本发明的优点是：本发明采用子平台和母平台。子平台与母平台可以是完全独立的，子平台也可以镶嵌在母平台内，母平台和子平台能够依次调整基板与钢网位置识别点的重合，也可以单独控制母平台上的基板与钢网位置识别点的重合。可以同时对多块基板进行印刷，每块基板可以相同，也可以选择不同的基板；提高印刷效率。
本发明的另一目的是提供一种子母平台调整印刷方法，在印刷机架上设置有子平台、母平台和CCD模组，子平台镶嵌在母平台内，包括以下步骤：
(1)基板输送；将装载有两块基板或两块基板以上的治具通过运输导轨运输到印刷机中心位置，真空泵开启；
(2)、MARK点重合对位；平台模组由顶升装置顶升至取像位置，平台模组上的吸腔治具吸住基板，CCD模组定位母平台上的基板与钢网MARK点，母平台调整基板与钢网重合；平台模组包括子平台和母平台；
(3)、然后CCD模组定位子平台上基板与钢网MARK点，子平台调 整基板与钢网重合；
(4)、多块基板调整完成之后，平台模组上升到印刷位置，多块基板同时印刷，多块基板印刷完成后平台下降，装载有基板的治具通过运输导轨运输出印刷机；
(5)、子平台与母平台能够单独进行补偿调节。
本发明的另一目的是提供一种子母平台调整印刷方法，在印刷机架上设置有子平台、母平台和CCD模组，子平台和母平台是独立的，包括以下步骤：
(1)基板输送；将装载有两块基板或两块基板以上的治具通过运输导轨运输到印刷机中心位置，真空泵开启；
(2)、MARK点重合对位；平台模组由顶升装置顶升至取像位置，平台模组上的吸腔治具吸住基板，CCD模组同时定位子平台和母平台上的基板与钢网MARK点，子平台和母平台同时调整基板与钢网重合；平台模组包括子平台和母平台；
(3)、多块基板调整完成之后，平台模组上升到印刷位置，多块基板同时印刷，印刷完成后平台模组下降，装载有多块基板的治具通过运输导轨运输出印刷机；
(4)、子平台与母平台可单独进行补偿调节。
本发明的另一目的是提供一种子母平台调整印刷方法，在印刷机架上设置有子平台、母平台和CCD模组，子平台和母平台是一体的，包括以下步骤：
(1)基板输送；将装载有单块基板的治具通过运输导轨运输到印刷机中心位置，真空泵开启；
(2)、MARK点重合对位；平台模组由顶升装置顶升至取像位置，平台模组上的吸腔治具吸住基板，CCD模组单独定位母平台上的基板与钢网MARK点，母平台调整基板与钢网重合，子平台不动；平台模组包括子平台和母平台；
(3)、基板定位完成之后，平台模组上升到印刷位置，印刷基板，印刷完成后平台模组下降，装载有单块基板的治具通过运输导轨运输出印刷机。
附图说明
下面就根据附图和具体实施方式对本发明及其有益的技术效果作进一步详细的描述，其中：
图1是本发明立体结构示意图。
图2是CCD模组结构示意图。
附图标记名称：1、母平台 2、子平台 3、CCD模组 4、吸腔治具 5、运输导轨。
具体实施方式
下面就根据附图和具体实施例对本发明作进一步描述，但本发明的实施方式不局限于此。
实施例一：如图1和图2所示，一种子母平台印刷机，包括母平台1、子平台2和CCD模组3。同时印刷多块基板时，子平台2也具有两个或以上，每个子平台2和母平台1均是独立的，由CCD模组3同时定位调整母平台1和每个子平台2上的基板与钢网位置识别点的重合。详细而言，是由CCD模组3同时定位母平台1和每个子平台2上的基板与钢网位置识别点，使得母平台1和每个子平台2调整基板与钢网的重合。
子平台2上设有吸腔治具4。吸腔治具4用于吸附治具上的基板。
优选的，CCD模组3设置在母平台1和子平台2的上方。
还包括两条用于输送载有基板治具的运输导轨5，吸腔治具4位于两条运输导轨5之间，运输导轨5位于母平台1上方，运输导轨5将载有基板的治具输送至印刷机中心位置，母平台1顶升至取像位置，吸腔治具4吸附基板，CCD模组3定位母平台1和子平台2上的基板与钢网位置识别点。
CCD模组3具有X轴移动装置31和Y轴移动装置32，X轴移动装置31上设有CCD33，X轴移动装置31由Y轴移动装置32控制移动，CCD33由X轴移动装置31控制移动。通过CCD33寻找位置识别点及基板与钢网的位置。
此实施例的印刷步骤：
(1)基板输送；将装载有两块基板或两块基板以上的治具通过运输导轨运输到印刷机中心位置，真空泵开启；
(2)、MARK点重合对位；平台模组由顶升装置顶升至取像位置，平台模组上的吸腔治具吸住基板，CCD模组同时定位子平台和母平台上的基板与钢网MARK点，子平台和母平台同时调整基板与钢网重合；平台模组包括子平台和母平台；
(3)、多块基板调整完成之后，平台模组上升到印刷位置，多块基板同时印刷，印刷完成后平台模组下降，装载有多块基板的治具通过运输导轨运输出印刷机。
(4)、子平台与母平台可单独进行补偿调节。
实施例二：一种子母平台印刷机，包括母平台1、子平台2和CCD模组3。子平台2也具有两个或以上，每个子平台上均吸附有一个基板，多个子平台2均是镶嵌入母平台1上，CCD模组3依次定位调整母平台1和子平台2上的基板与钢网位置识别点的重合。详细而言，是由CCD模组3依次定位母平台1和子平台2上的基板与钢网位置识别点，使得母平台1和子平台2调整基板与钢网的重合。
此实施例的印刷步骤：
(1)基板输送；将装载有两块基板或两块基板以上的治具通过运输导轨运输到印刷机中心位置，真空泵开启；
(2)、MARK点重合对位；平台模组由顶升装置顶升至取像位置，平台模组上的吸腔治具吸住基板，CCD模组定位母平台上的基板与钢网MARK点，母平台调整基板与钢网重合；平台模组包括子平台和母平台；
(3)、然后CCD模组定位子平台上基板与钢网MARK点，子平台调整基板与钢网重合；
(4)、多块基板调整完成之后，平台模组上升到印刷位置，多块基板同时印刷，多块基板印刷完成后平台下降，装载有基板的治具通过运输导轨运输出印刷机；
(5)、子平台与母平台能够单独进行补偿调节。
实施例三：一种子母平台印刷机，包括母平台1、子平台2和CCD模 组3。子平台2有一个，子平台上均吸附有一个基板，子平台2是镶嵌入母平台1上，CCD模组3单独调整母平台1上的基板与钢网位置识别点的重合。详细而言，是由CCD模组3单独定位母平台1上的基板与钢网位置识别点，使得母平台1调整基板与钢网的重合。
一种子母平台调整印刷方法，在印刷机架上设置有子平台、母平台和CCD模组，子平台和母平台是一体的，包括以下步骤：
(1)基板输送；将装载有单块基板的治具通过运输导轨运输到印刷机中心位置，真空泵开启；
(2)、MARK点重合对位；平台模组由顶升装置顶升至取像位置，平台模组上的吸腔治具吸住基板，CCD模组单独定位母平台上的基板与钢网MARK点，母平台调整基板与钢网重合，子平台不动；平台模组包括子平台和母平台；
(3)、基板调整完成之后，平台模组上升到印刷位置，印刷基板，印刷完成后平台模组下降，装载有单块基板的治具通过运输导轨运输出印刷机。
本发明采用子平台和母平台。子平台与母平台可以是完全独立的，子平台也可以镶嵌在母平台内，母平台和子平台能够同时调整基板与钢网位置识别点的重合，也可以单独独立控制调整母平台或子平台上的基板与钢网位置识别点的重合。可以同时对多块基板进行印刷，每块基板可以相同，也可以不同；提高印刷效率。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和结构的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同范围限定。

Claims (10)

  1. 一种子母平台印刷机，其特征在于，包括母平台、子平台和CCD模组，所述CCD模组依次或同时定位母平台和子平台上的基板与钢网位置识别点，母平台和子平台调整基板与钢网的重合。
  2. 根据权利要求1所述的子母平台印刷机，其特征在于，所述子平台上设有吸腔治具，所述子平台为独立平台时，所述CCD模组同时定位母平台和子平台上的基板与钢网位置识别点，母平台和子平台同时调整基板与钢网的重合。
  3. 根据权利要求1所述的子母平台印刷机，其特征在于，所述子平台镶嵌入所述母平台上，所述CCD模组依次定位母平台和子平台上的基板与钢网位置识别点，母平台和子平台依次调整基板与钢网的重合。
  4. 根据权利要求1所述的子母平台印刷机，其特征在于，所述CCD模组设置在所述母平台和子平台的上方。
  5. 根据权利要求2所述的子母平台印刷机，其特征在于，还包括两条用于输送载有基板治具的运输导轨，所述吸腔治具位于两条所述运输导轨之间，所述运输导轨位于所述母平台上方，所述运输导轨将载有基板的治具输送至印刷机中心位置，所述母平台顶升至取像位置，所述吸腔治具吸附基板，所述CCD模组定位母平台和子平台上的基板与钢网位置识别点，母平台和子平台调整基板与钢网的重合。
  6. 根据权利要求1所述的子母平台印刷机，其特征在于，所述子平台为两个或两个以上时，所述CCD模组同时或依次定位母平台和子平台上的基板与钢网位置识别点，母平台和子平台依次调整基板与钢网的重合。
  7. 根据权利要求1所述的子母平台印刷机，其特征在于，所述子平台为一个时，所述CCD模组与母平台单独定位调整基板与钢网位置识别点的重合，所述子平台保持不动。
  8. 一种子母平台调整印刷方法，在印刷机架上设置有子平台、母平台和CCD模组，子平台镶嵌在母平台内，其特征在于，包括以下步骤：
    (1)基板输送；将装载有两块基板或两块基板以上的治具通过运输导轨运输到印刷机中心位置，真空泵开启；
    (2)、MARK点重合对位；平台模组由顶升装置顶升至取像位置，平台模组上的吸腔治具吸住基板，CCD模组定位母平台上的基板与钢网MARK点，母平台调整基板与钢网重合；平台模组包括子平台和母平台；
    (3)、然后CCD模组定位子平台上基板与钢网MARK点，子平台调整基板与钢网重合；
    (4)、多块基板定调整完成之后，平台模组上升到印刷位置，多块基板同时印刷，多块基板印刷完成后平台下降，装载有基板的治具通过运输导轨运输出印刷机；
    (5)、子平台与母平台能够单独进行补偿调节。
  9. 一种子母平台调整印刷方法，在印刷机架上设置有子平台、母平台和CCD模组，子平台和母平台是独立的，其特征在于，包括以下步骤：
    (1)基板输送；将装载有两块基板或两块基板以上的治具通过运输导轨运输到印刷机中心位置，真空泵开启；
    (2)、MARK点重合对位；平台模组由顶升装置顶升至取像位置，子平台上的吸腔治具吸住基板，CCD模组同时定位子平台和母平台上的基板与钢网MARK点，然后子平台和母平台同时调整基板与钢网重合；平台模组包括子平台和母平台；
    (3)、多块基板调整完成之后，平台模组上升到印刷位置，多块基板同时印刷，印刷完成后平台模组下降，装载有多块基板的治具通过运输导轨运输出印刷机；
    (4)、子平台与母平台可单独进行补偿调节。
  10. 一种子母平台调整印刷方法，在印刷机架上设置有子平台、母平台和CCD模组，子平台和母平台是一体的，其特征在于，包括以下步骤：
    (1)基板输送；将装载有单块基板的治具通过运输导轨运输到印刷机中心位置，真空泵开启；
    (2)、MARK点重合对位；平台模组由顶升装置顶升至取像位置，平台模组上的吸腔治具吸住基板，CCD模组单独定位母平台上的基板与钢网MARK点，然后母平台调整基板与钢网重合，子平台不动；平台模组包括子平台和母平台；
    (3)、基板定位完成之后，平台模组上升到印刷位置，印刷基板，印 刷完成后平台模组下降，装载有单块基板的治具通过运输导轨运输出印刷机。
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