WO2020132925A1 - 超声设备的主机 - Google Patents
超声设备的主机 Download PDFInfo
- Publication number
- WO2020132925A1 WO2020132925A1 PCT/CN2018/123799 CN2018123799W WO2020132925A1 WO 2020132925 A1 WO2020132925 A1 WO 2020132925A1 CN 2018123799 W CN2018123799 W CN 2018123799W WO 2020132925 A1 WO2020132925 A1 WO 2020132925A1
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- WO
- WIPO (PCT)
- Prior art keywords
- installation cavity
- module
- host
- housing
- motherboard
- Prior art date
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
Definitions
- the present application relates to an ultrasound device, in particular to a layout of a host of the ultrasound device.
- This application mainly provides a main unit of an ultrasonic device, which has different layouts, which is convenient for disassembly and assembly of each module.
- a host for an ultrasonic device which includes a housing, a host motherboard, a circuit board equipped with a control unit, a probe adapter box, a power module, an input and output interface module, a hard disk, and heat dissipation for the host Fan:
- the housing includes a main housing, a front housing facing the user, and a rear housing opposite to the front housing, the front housing is installed on the front side of the main housing, and the rear housing is installed On the rear side of the main casing;
- the host motherboard is installed in the main casing, which encloses a front installation cavity with the front casing and a rear installation cavity with the rear casing;
- the circuit board and the probe adapter box A part of the power supply module, the input/output interface module and the hard disk are installed in the front installation cavity, and the other part is installed in the rear installation cavity.
- the circuit board, probe adapter box, and power module are located in the front installation cavity and installed on the host motherboard; the input and output interface module is located in the rear installation cavity and installed On the motherboard.
- the main housing has a cavity that opens in the front and rear directions
- the host motherboard is located in the middle of the cavity
- the front and rear housings are respectively covered from the openings in the front and rear directions Live the cavity.
- the fan is located at the lower part of the main housing and below the circuit board, probe adapter box, hard disk, and input/output interface module.
- the front case includes a first front case and a second front case, the first front case is located above the second front case, the first front case and the main case
- the body surrounds a first front installation cavity, the probe adapter box is located in the first front installation cavity, the first front housing has a socket corresponding to the probe adapter box; the second front housing is The main housing encloses a second front installation cavity, the second front installation cavity is located below the first front installation cavity, and the circuit board and the power module are located in the second front installation cavity.
- the front case includes a first front case and a second front case, the first front case is located above the second front case, the first front case and the main case
- the body surrounds a first front installation cavity, the circuit board and the power module are located in the first front installation cavity; the second front housing and the main housing surround a second front installation cavity, the second front The installation cavity is located below the first front installation cavity, the probe adapter box is located in the second front installation cavity, and the second front housing has a socket corresponding to the probe adapter box.
- it also includes an electrocardiogram module, which is installed in the front installation cavity.
- the ECG module and the probe adapter box are installed in the first front installation cavity.
- the front housing and the rear housing are respectively fixedly installed on the main housing with a detachable snap structure or a screw fastening structure.
- a communication module for communication is further included, and the communication module is installed on the motherboard of the host computer and located in the rear installation cavity.
- the communication module includes at least one of a wifi module and a 4G module.
- the communication module is installed on the lower part of the host motherboard.
- the hard disk is installed in the rear installation cavity, and is installed together with the hard disk on the lower part of the host motherboard.
- it further includes a chassis, the circuit board is installed in the chassis, and the chassis is installed on the host motherboard.
- a battery module is further included, and the battery module is installed in the front installation cavity.
- the chassis, the battery module, and the power module are installed side by side on the host motherboard.
- it further includes a sound, which is installed in the rear installation cavity.
- the sound is located in the upper part of the rear installation cavity.
- the main board of the main unit is installed in the main housing, which encloses the front mounting cavity with the front housing and the rear mounting cavity housing with the rear housing.
- Part of the chassis, probe adapter box, power supply module, input/output interface module and hard disk of the host are installed in the front installation cavity, and the other part is installed in the rear installation cavity.
- This layout distributes the modules reasonably on the front and back sides of the motherboard. Each module can be disassembled separately. When the related modules need to be maintained or replaced, they can be loaded and unloaded by opening the front or rear shells. Corresponding modules, fewer disassembly and assembly steps, easy operation, greatly improved maintenance efficiency.
- some of the larger modules in the host such as the chassis with the control unit, the probe adapter box, and the power module, can be installed in the front installation cavity for disassembly and assembly, while some of the smaller volumes Modules, such as input and output interface modules, can be installed in the rear installation cavity.
- FIG. 1 is a schematic diagram of an appearance of an ultrasonic device host in an embodiment of the present application
- FIG. 2 is an exploded schematic diagram of an ultrasonic device host in an embodiment of the present application.
- connection and “connection” mentioned in this application, unless otherwise specified, include direct and indirect connection (connection).
- An embodiment of the present application provides a host of an ultrasound device.
- the ultrasound device is a device that uses ultrasound imaging technology for related applications, such as medical diagnosis.
- the host is an important component of the ultrasound equipment, and usually the control unit, probe adapter and other components are installed on the host.
- the host includes a housing 100, a host motherboard 200, a chassis 301, a probe adapter box 302, a power module 303, an input and output interface module (IO module) 304, a hard disk 305 Fan 306.
- IO module input and output interface module
- the housing 100 has an installation cavity, and each module is installed in the installation cavity.
- the case 100 includes a main case 110, a front case 120 facing the user, and a rear case 130 opposite to the front case 120, the front case 120 is installed on the front side of the main case 110, the rear case 130 Installed on the rear side of the main housing 110.
- front and back refer to the side facing the user in the normal use state, and the side away from the user is the front.
- the main housing 110 has a cavity that opens in the front-rear direction, and the front housing 120 and the rear housing 130 respectively cover the cavity from the front-rear direction, thereby The installation cavity is formed.
- the host motherboard 200 is installed in the main housing 110, which encloses a front installation cavity with the front housing 120 and a rear installation cavity with the rear housing 130 at the same time.
- Part of the chassis 301, probe adapter box 302, power module 303, input/output interface module 304, and hard disk 305 of the host are installed in the front installation cavity, and the other part is installed in the rear installation cavity.
- This layout distributes the modules reasonably on the front and back sides of the motherboard.
- Each module can be disassembled separately. When the related modules need to be maintained or replaced, they can be loaded and unloaded by opening the front or rear shells. Corresponding modules, fewer disassembly and assembly steps, easy operation, greatly improved maintenance efficiency.
- Each module can be installed separately in the front installation cavity and the rear installation cavity to form a reasonable layout.
- the front case 120 and the rear case 130 can be installed in an easily detachable manner, for example, the front case 120 and the rear case 130 are fixedly installed on the main case 110 with a detachable snap structure or a screw fastening structure, respectively. Above, during maintenance, the front case 120 and the rear case 130 can be easily disassembled to further facilitate maintenance work.
- the chassis 301 is equipped with components such as a circuit board provided with a control unit.
- the control unit includes a central processing unit (CPU), a memory, and other components for centralized control and data processing.
- the chassis 301 is located in the front installation cavity and is installed on the motherboard 200 of the host computer.
- the circuit board with the control unit can also be directly installed in the front installation cavity or the rear installation cavity, for example, the circuit board is directly installed in front of the host motherboard 200 Side or rear side, so that the chassis 301 can be omitted, simplifying the structure.
- the probe adapter box 302 is used to dock the ultrasonic probe, and it is also installed in the front installation cavity with the power module 303, and can be fixed by being installed on the host motherboard 200.
- the chassis 301, the probe adapter box 302, and the power module 303 are large in size, so they are all installed in the front installation cavity, which is convenient for disassembly and assembly, and can also maintain the balance of the host, and these modules are also easy to install in the front installation cavity.
- the input-output interface module 304 has a small volume, and can be installed in the rear installation cavity and installed on the host motherboard 200.
- the hard disk 305 can be installed in the chassis 301, in the front installation cavity or in the rear installation cavity as needed. As shown in FIG. 2, in this embodiment, the hard disk 305 is installed on the host motherboard 200 and is located in the rear installation cavity.
- the fan 306 is installed in the main housing 110 for heat dissipation of the host.
- the fan 306 is located at the lower part of the main housing 110 and below the chassis 301, the probe adapter box 302, the hard disk 305, and the input/output interface module 304.
- the fan 306 may be installed in the front installation cavity, or in the rear installation cavity, or may span across the two installation cavities, and the airflow is blown upward from the bottom of the host to dissipate heat from the above modules.
- the fan 306 can be fixed by a quick-release screw and other easily removable methods. When the quick-release screw is manually removed, it can be directly pulled out from the side.
- the front housing 120 includes a first front housing 121 and a second front housing 122.
- the first front case 121 is located above the second front case 122.
- the first front housing 121 and the main housing 110 form a first front installation cavity.
- the probe adapter box 302 is located in the first front installation cavity, and the first front housing 121 has a socket corresponding to the probe adapter box 302.
- the second front housing 122 and the main housing 110 form a second front installation cavity.
- the second front installation cavity is located below the first front installation cavity.
- the chassis 301 and the power module 303 are located in the second front installation cavity.
- the design of the first front case 121 and the second front case 122 can divide the front installation cavity into at least two parts.
- the entire front case 120 does not need to be disassembled, and can be disassembled only.
- the first front case 121 When it is necessary to perform maintenance on the chassis 301 and the power module 303, etc., it is only necessary to disassemble the second front case 122. This structure can further simplify the maintenance workload and improve work efficiency.
- the chassis 301 (or the circuit board provided with the control unit) and the power module may also be located in the first front installation cavity.
- the probe adapter box 302 is located in the second front installation cavity, and the second front housing has a socket corresponding to the probe adapter box 302.
- front housing 120 may also be an integral housing, or may be separated into three or more components.
- the host further includes an electrocardiogram module (ECG module) 309 for implementing the electrocardiogram drawing function.
- ECG module electrocardiogram module
- the electrocardiogram module 309 is installed in the front installation cavity, and can be fixed by being installed on the host motherboard 200 or the housing 100.
- the electrocardiogram module 309 and the probe adapter box 302 are installed in the first front installation cavity to facilitate disassembly and connection.
- the host further includes a communication module for communication.
- the communication module is installed on the host motherboard 200 and is located in the rear installation cavity.
- the communication module may include at least one of a wifi module 307 and a 4G module 308.
- the communication module may also be another form of module, such as a wired communication module.
- the communication module (such as the wifi module 307 and the 4G module 308) can be installed in the lower part of the host motherboard 200 to make full use of the lower space of the host motherboard 200.
- the communication module can also be installed in the middle and upper part of the host motherboard 200.
- the hard disk 305 is installed in the rear installation cavity, and is installed in the lower part of the host motherboard 200 together with the communication module (such as the wifi module 307 and the 4G module 308), which is convenient for centralized maintenance and management.
- the communication module such as the wifi module 307 and the 4G module 308
- the host further includes a battery module 310 installed in the front installation cavity.
- the battery module 310 can be installed on the host motherboard 200.
- the chassis 301, the battery module 310, and the power module 303 are installed side by side on the host motherboard 200, so that these modules are arranged in an orderly arrangement, which is convenient for management, and is beneficial to maximize the use of the front installation cavity Space.
- it may be installed in the lower part of the front installation cavity, that is, in the second front installation cavity, to make full use of the space of the second front installation cavity.
- a dust screen 312 can also be installed above the chassis 301, the battery module 310 and the power module 303.
- the host further includes an audio 311, which is installed in the rear installation cavity.
- the sound 311 may be located in the upper part of the rear installation cavity, so as to facilitate the transmission of sound.
- the electrocardiogram module 309 and the probe adapter box 302 can be divided into an area, which is located in the first front installation cavity.
- the chassis 301, the battery module 310, and the power module 303 can be divided into one area, which is located in the second front installation cavity, and when maintenance is required, only the second front case 122 can be opened.
- the audio 311, wifi module 307, 4G module 308, hard disk 305, and input/output interface module (IO module) 304 can be divided into an area, which is located in the rear installation cavity.
- the fan 306 can be separately divided into an area, which can be directly taken out from the bottom of the main housing 110.
- the layout structure of the host shown in this embodiment can distribute the modules on both the front and back sides of the host motherboard, and only need to remove the corresponding front shell or rear shell during maintenance to directly operate the modules. Moreover, the structure also designs the main module or the vulnerable module at a higher position convenient for maintenance, so as to facilitate disassembly and assembly, and greatly improves the maintenance efficiency.
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Abstract
一种超声设备主机，其主机母板安装在主壳体内，其与前壳体围成前安装腔，与后壳体围成后安装腔壳体。该主机中装有控制单元的电路板、探头转接盒、电源模块、输入输出接口模块以及硬盘等模块中一部分安装在前安装腔内，另一部分安装在后安装腔内。这种布局将各模块合理的分布在主机母板前后两侧，每个模块都可以单独拆装，在需要对相关模块进行维护或更换时，只需打开前壳体或后壳体即可装卸对应模块，拆装步骤少、操作方便，极大地提高了维护效率。
Description
本申请涉及一种超声设备，具体涉及一种超声设备主机的布局。
通常的超声设备主机内部模块分布混乱，在维护时，拆装步骤较多，工时较长。例如，要拆除某些主要模块时，经常需要拆除多个外壳，甚至某些情况需要先拆除多个其它模块，这将导致整个维护工作非常繁琐。
本申请主要提供一种超声设备的主机，其具有不同的布局，便于各个模块的拆装。
一种实施例中提供一种超声设备的主机，包括壳体、主机母板、装有控制单元的电路板、探头转接盒、电源模块、输入输出接口模块、硬盘以及用于对主机进行散热的风扇：所述壳体包括主壳体、朝向使用者的前壳体和与前壳体相对的后壳体，所述前壳体安装在主壳体的前侧，所述后壳体安装在主壳体的后侧；所述主机母板安装在主壳体内，其与前壳体围成前安装腔，同时与后壳体围成后安装腔；所述电路板、探头转接盒、电源模块、输入输出接口模块以及硬盘中一部分安装在所述前安装腔内，另一部分安装在所述后安装腔内。
一种实施例中，所述电路板、探头转接盒、电源模块位于所述前安装腔内，并安装在主机母板上；所述输入输出接口模块位于所述后安装腔内，并安装在主机母板上。
一种实施例中，所述主壳体具有在前、后方向上开口的腔体，所述主机母板位于腔体中部，所述前壳体和后壳体分别从前、后方向上的开口封盖住所述腔体。
一种实施例中，所述风扇位于主壳体下部，并处于所述电路板、探头转接盒、硬盘以及输入输出接口模块的下方。
一种实施例中，所述前壳体包括第一前壳体和第二前壳体，所述第一前壳***于第二前壳体的上方，所述第一前壳体与主壳体围成第一前安装腔，所述探头转接盒位于所述第一前安装腔内，所述第一前壳体具有与探头转接盒对应的插口；所述第二前壳体与主壳体围成第二前安装腔，所述第二前安装腔位于第一前安装腔的下方，所述电路板和电源模块位于所述第二前安装腔内。
一种实施例中，所述前壳体包括第一前壳体和第二前壳体，所述第一前壳***于第二前壳体的上方，所述第一前壳体与主壳体围成第一前安装腔，所述电路板和电源模块位于所述第一前安装腔内；所述第二前壳体与主壳体围成第二前安装腔，所述第二前安装腔位于第一前安装腔的下方，所述探头转接盒位于所述第二前安装腔内，所述第二前壳体具有与探头转接盒对应的插口。
一种实施例中，还包括心电图模块，所述心电图模块安装在前安装腔内。
一种实施例中，所述心电图模块与探头转接盒一起安装在第一前安装腔内。
一种实施例中，所述前壳体和后壳体分别以可拆卸式地卡接结构或螺钉紧固结构固定安装在主壳体上。
一种实施例中，还包括用于通信的通信模块，所述通信模块安装在主机母板上，位于所述后安装腔内。
一种实施例中，所述通信模块包括wifi模块和4G模块中的至少一种。
一种实施例中，所述通信模块安装在主机母板的下部。
一种实施例中，所述硬盘安装在后安装腔内，并与硬盘一起安装在主机母板的下部。
一种实施例中，还包括机箱，所述电路板安装在机箱内，所述机箱安装在主机母板上。
一种实施例中，还包括电池模块，所述电池模块安装在所述前安装腔内。
一种实施例中，所述机箱、电池模块和电源模块并排安装在主机母板上。
一种实施例中，还包括音响，所述音响安装在后安装腔内。
一种实施例中，所述音响位于后安装腔的上部。
依据上述实施例的超声设备主机，其主机母板安装在主壳体内，其与前壳体围成前安装腔，与后壳体围成后安装腔壳体。该主机的机箱、探头转接盒、电源模块、输入输出接口模块以及硬盘等模块中一部分安装在前安装腔内，另一部分安装在后安装腔内。这种布局将各模块合理的分布在主机母板前后两侧，每个模块都可以单独拆装，在需要对相关模块进行维护或更换时，只需打开前壳体或后壳体即可装卸对应模块，拆装步骤少、操作方便，极大地提高了维护效率。
尤其是，可以将该主机中一些体积较大的模块，例如装有控制单元的机箱、探头转接盒以及电源模块等可以安装在该前安装腔内，以便拆装，而一些体积较小的模块，例如输入输出接口模块则可以安装在后安装腔内。
图1为本申请一种实施例中超声波设备主机的一种外形示意图；
图2为本申请一种实施例中超声波设备主机的分解示意图。
具体实施方式
下面通过具体实施方式结合附图对本发明作进一步详细说明。其中不同实施方式中类似元件采用了相关联的类似的元件标号。在以下的实施方式中，很多细节描述是为了使得本申请能被更好的理解。然而，本领域技术人员可以毫不费力的认识到，其中部分特征在不同情况下是可以省略的，或者可以由其他元件、材料、方法所替代。在某些情况下，本申请相关的一些操作并没有在说明书中显示或者描述，这是为了避免本申请的核心部分被过多的描述所淹没，而对于本领域技术人员而言，详细描述这些相关操作并不是必要的，他们根据说明书中的描述以及本领域的一般技术知识即可完整了解相关操作。
另外，说明书中所描述的特点、操作或者特征可以以任意适当的方式结合形成各种实施方式。同时，方法描述中的各步骤或者动作也可以按照本领域技术人员所能显而易见的方式进行顺序调换或调整。因此，说明书和附图中的各种顺序只是为了清楚描述某一个实施例，并不意味着是必须的顺序，除非另有说明其中某个顺序是必须遵循的。
本文中为部件所编序号本身，例如“第一”、“第二”等，仅用于区分所描述的对象，不具有任何顺序或技术含义。而本申请所说“连接”、“联接”，如无特别说明，均包括直接和间接连接（联接）。
本申请一种实施例提供了一种超声设备的主机。该超声设备为利用超声波成像技术来进行相关应用的设备，如进行医学诊断等。该主机为超声设备的重要部件，通常会将控制单元、探头转接头等部件安装在该主机上。
请参考图1和2，一种实施例中，该主机包括壳体100、主机母板200、机箱301、探头转接盒302、电源模块303、输入输出接口模块（IO模块）304、硬盘305以及风扇306。
该壳体100具有安装腔，各模块均安装在该安装腔内。该壳体100包括主壳体110、朝向使用者的前壳体120和与前壳体120相对的后壳体130，该前壳体120安装在主壳体110的前侧，后壳体130安装在主壳体110的后侧。这里所说的前、后是指在正常的使用状态下，主机朝向使用者的一侧为前，远离使用者的一侧为后。
请参考图1和2，一种实施例中，该主壳体110具有在前后方向上开口的腔体，该前壳体120和后壳体130分别从前后方向封盖住该腔体，从而形成安装腔。
请继续参考图1和2，该主机母板200安装在主壳体110内，其与前壳体120围成前安装腔，同时与后壳体130围成后安装腔。该主机的机箱301、探头转接盒302、电源模块303、输入输出接口模块304以及硬盘305中一部分安装在前安装腔内，另一部分安装在后安装腔内。
这种布局将各模块合理的分布在主机母板前后两侧，每个模块都可以单独拆装，在需要对相关模块进行维护或更换时，只需打开前壳体或后壳体即可装卸对应模块，拆装步骤少、操作方便，极大地提高了维护效率。可将各模块分装在前安装腔和后安装腔内，形成合理的布局。
该前壳体120和后壳体130可采用易拆卸地方式进行安装，例如前壳体120和后壳体130分别以可拆卸式地卡接结构或螺钉紧固结构固定安装在主壳体110上，在维护时，可以容易地拆卸前壳体120和后壳体130，进一步方便维护工作。
该机箱301内装有设置了控制单元的电路板等部件，控制单元包括中央处理器（CPU）、存储器等用于实现集中控制和数据处理的部件。该机箱301位于前安装腔内，并安装在主机母板200上。其中，除了将具有控制单元的电路板安装在机箱301内，还可以直接将具有控制单元的电路板安装到前安装腔或后安装腔内，例如直接将电路板安装在主机母板200的前侧或后侧，这样可省略机箱301，简化结构。
该探头转接盒302用于对接超声探头，其与电源模块303也安装在前安装腔内，可通过安装在主机母板200进行固定。该机箱301、探头转接盒302以及电源模块303体积较大，因此其均安装在前安装腔内，便于拆装，也可以使主机保持力的平衡，而且这些模块安装在前安装腔也便于线路的连接。输入输出接口模块304体积较小，可设置在后安装腔内，并安装在主机母板200上。
该硬盘305可以根据需要安装在机箱301内、前安装腔内或后安装腔内。如图2所示，该实施例中，该硬盘305安装在主机母板200上，位于后安装腔内。该风扇306安装在主壳体110内，用于主机的散热。
进一步地，请参考图2，一种实施例中，该风扇306位于主壳体110下部，并处于机箱301、探头转接盒302、硬盘305以及输入输出接口模块304的下方。该风扇306既可设置在前安装腔内，也可设置在后安装腔内，或者也可以横跨在两个安装腔内，其从主机底部向上吹出气流，对上述各模块进行散热。风扇306可通过快拆螺钉等易拆卸的方式固定，当手动拆下快拆螺钉后，可从侧面直接拔出。
请继续参考图1和2，一种实施例中，该前壳体120包括第一前壳体121和第二前壳体122。第一前壳体121位于第二前壳体122的上方。第一前壳体121与主壳体110围成第一前安装腔。探头转接盒302位于第一前安装腔内，第一前壳体121具有与探头转接盒302对应的插口。第二前壳体122与主壳体110围成第二前安装腔。第二前安装腔位于第一前安装腔的下方。机箱301和电源模块303位于第二前安装腔内。
通过第一前壳体121和第二前壳体122的设计可以使前安装腔分为至少两部分，当需要对探头转接盒302进行维护时，无需拆卸整个前壳体120，可以只拆卸第一前壳体121。需要对机箱301和电源模块303等进行维护时，只需拆卸第二前壳体122即可。该结构可以进一步简化维护工作量，提高工作效率。
当然，在其他实施例中，该机箱301（或设置有控制单元的电路板）和电源模块也可以位于第一前安装腔内。该探头转接盒302位于第二前安装腔内，该第二前壳体具有与探头转接盒302对应的插口。
此外，该前壳体120也可以是一个整体壳体，或者也可以分离成三个乃至更多的组成部分。
进一步地，一些实施例中，该主机还包括心电图模块（ECG模块）309，用以实现心电图绘制功能。请参考图2，该心电图模块309安装在前安装腔内，可通过安装在主机母板200或壳体100上进行固定。
更具体地，该心电图模块309与探头转接盒302一起安装在第一前安装腔内，以便于拆装和连线。
进一步地，一些实施例中，该主机还包括用于通信的通信模块。通信模块安装在主机母板200上，位于后安装腔内。其中，请参考图2，该通信模块可以包括wifi模块307和4G模块308中的至少一种。当然，通信模块还可以是其他形式的模块，例如有线通信模块等。请参考图2，一种实施例中，该通信模块（如wifi模块307和4G模块308）可安装在主机母板200的下部，充分利用主机母板200的下部空间。当然，通信模块也可安装在主机母板200的中、上部。
请继续参考图2，一种实施例中，硬盘305安装在后安装腔内，并与通信模块（如wifi模块307和4G模块308）一起安装在主机母板200的下部，便于集中的维护和管理。
进一步地，请参考图2，一些实施例中，该主机还包括电池模块310，该电池模块310安装在前安装腔内。该电池模块310可以安装在主机母板200上。一种示例结构中，该机箱301、电池模块310和电源模块303并排安装在主机母板200上，使这几个模块形成有序的排列，便于管理，同时有利于最大化地利用前安装腔的空间。具体可以是安装在前安装腔的下部，即第二前安装腔内，充分利用第二前安装腔的空间。同时，为了防尘，在该机箱301、电池模块310和电源模块303上方还可安装防尘网312。
进一步地，请参考图2，一些实施例中，该主机还包括音响311，该音响311安装在后安装腔内。具体地，该音响311可位于后安装腔的上部，以便于声音的传播。
如图2所示，该心电图模块309与探头转接盒302可以划分为一个区域，其位于第一前安装腔内，当需要维护时，只需打开第一前壳体121即可。该机箱301、电池模块310和电源模块303可以划分为一个区域，其位于第二前安装腔内，当需要维护时，只需打开第二前壳体122即可。该音响311、wifi模块307、4G模块308、硬盘305以及输入输出接口模块（IO模块）304可以划分为一个区域，其位于后安装腔内，当需要维护时，只需打开后壳体130即可。风扇306则可单独划分为一个区域，其可直接从主壳体110底部取出。
本实施例所示的主机布局结构可以使各模块分布在主机母板前后两侧，在维护时仅需拆除对应的前壳体或后壳体，即可直接对模块进行操作。而且，该结构还将主要模块或易损模块设计在方便维护的较高位置，以便于拆装，极大地提高了维护效率。
以上应用了具体个例对本申请进行阐述，只是用于帮助理解本申请，并不用以限制本申请。对于本领域的一般技术人员，依据本申请的思想，可以对上述具体实施方式进行变化。
Claims (18)
- 一种超声设备的主机,其特征在于，包括壳体、主机母板、装有控制单元的电路板、探头转接盒、电源模块、输入输出接口模块、硬盘以及用于对主机进行散热的风扇：所述壳体包括主壳体、朝向使用者的前壳体和与前壳体相对的后壳体，所述前壳体安装在主壳体的前侧，所述后壳体安装在主壳体的后侧；所述主机母板安装在主壳体内，其与前壳体围成前安装腔，同时与后壳体围成后安装腔；所述电路板、探头转接盒、电源模块、输入输出接口模块以及硬盘中一部分安装在所述前安装腔内，另一部分安装在所述后安装腔内。
- 如权利要求1所述的主机，其特征在于，所述电路板、探头转接盒、电源模块位于所述前安装腔内，并安装在主机母板上；所述输入输出接口模块位于所述后安装腔内，并安装在主机母板上。
- 如权利要求1或2所述的主机，其特征在于，所述主壳体具有在前、后方向上开口的腔体，所述主机母板位于腔体中部，所述前壳体和后壳体分别从前、后方向上的开口封盖住所述腔体。
- 如权利要求1-3任一项所述的主机，其特征在于，所述风扇位于主壳体下部，并处于所述电路板、探头转接盒、电源模块、硬盘以及输入输出接口模块的下方。
- 如权利要求1-4任一项所述的主机，其特征在于，所述前壳体包括第一前壳体和第二前壳体，所述第一前壳***于第二前壳体的上方，所述第一前壳体与主壳体围成第一前安装腔，所述探头转接盒位于所述第一前安装腔内，所述第一前壳体具有与探头转接盒对应的插口；所述第二前壳体与主壳体围成第二前安装腔，所述第二前安装腔位于第一前安装腔的下方，所述电路板和电源模块位于所述第二前安装腔内。
- 如权利要求1-4任一项所述的主机，其特征在于，所述前壳体包括第一前壳体和第二前壳体，所述第一前壳***于第二前壳体的上方，所述第一前壳体与主壳体围成第一前安装腔，所述电路板和电源模块位于所述第一前安装腔内；所述第二前壳体与主壳体围成第二前安装腔，所述第二前安装腔位于第一前安装腔的下方，所述探头转接盒位于所述第二前安装腔内，所述第二前壳体具有与探头转接盒对应的插口。
- 如权利要求5所述的主机，其特征在于，还包括心电图模块，所述心电图模块安装在前安装腔内。
- 如权利要求7所述的主机，其特征在于，所述心电图模块与探头转接盒一起安装在第一前安装腔内。
- 如权利要求1-8任一项所述的主机，其特征在于，所述前壳体和后壳体分别以可拆卸式地卡接结构或螺钉紧固结构固定安装在主壳体上。
- 如权利要求1-9中任一项所述的主机，其特征在于，还包括用于通信的通信模块，所述通信模块安装在主机母板上，位于所述后安装腔内。
- 如权利要求10所述的主机，其特征在于，所述通信模块包括wifi模块和4G模块中的至少一种。
- 如权利要求10或11所述的主机，其特征在于，所述通信模块安装在主机母板的下部。
- 如权利要求12所述的主机，其特征在于，所述硬盘安装在后安装腔内，并与硬盘一起安装在主机母板的下部。
- 如权利要求1-13中任一项所述的主机，其特征在于，还包括机箱，所述电路板安装在机箱内，所述机箱安装在主机母板上。
- 如权利要求14所述的主机，其特征在于，还包括电池模块，所述电池模块安装在所述前安装腔内。
- 如权利要求15所述的主机，其特征在于，所述机箱、电池模块和电源模块并排安装在主机母板上。
- 如权利要求1-16中任一项所述的主机，其特征在于，还包括音响，所述音响安装在后安装腔内。
- 如权利要求17所述的主机，其特征在于，所述音响位于后安装腔的上部。
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