WO2020129863A1 - 接合方法および接合体 - Google Patents
接合方法および接合体 Download PDFInfo
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- WO2020129863A1 WO2020129863A1 PCT/JP2019/049049 JP2019049049W WO2020129863A1 WO 2020129863 A1 WO2020129863 A1 WO 2020129863A1 JP 2019049049 W JP2019049049 W JP 2019049049W WO 2020129863 A1 WO2020129863 A1 WO 2020129863A1
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- WIPO (PCT)
- Prior art keywords
- cover
- main body
- joining
- flow path
- bonding
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2336—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer both layers being aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
Definitions
- the present invention relates to a joining method and a joined body for joining members by diffusion joining.
- Electrodes, cooling plates, heaters, shower heads, etc. have plates with flow paths.
- the plate with a flow path is made of a metal or ceramics composite, and a main body portion in which a flow path through which a heating medium or a cooling medium or a process gas moves is formed is covered with a cover (see, for example, Patent Document 1). reference).
- Patent Document 1 after overlapping the cover and the main body, the main body and the cover are joined by brazing.
- the present invention has been made in view of the above, and an object of the present invention is to provide a joining method and a joined body which can suppress deterioration in quality due to joining while reliably joining the main body and the cover. ..
- a joining method according to the present invention is made of aluminum or an aluminum alloy, and a main body portion in which a flow path for circulating a medium that promotes heat exchange is formed, and aluminum or aluminum.
- a joining method of joining a cover made of an alloy and covering the flow path of the main body portion which comprises a covering step of covering the main body portion with the cover, a joining temperature of 500°C to 640°C, and a joining surface pressure of And a diffusion bonding step of bonding the main body portion and the cover by diffusion bonding under a condition of 0.7 MPa or more.
- the joining method according to the present invention is characterized in that, in the above invention, the flatness of the joining surface of the main body and the flatness of the joining surface of the cover are each 0.2 or less.
- the joining method according to the present invention is characterized in that, in the above invention, the surface roughness of the joint surface of the main body and the surface roughness of the joint surface of the cover are both greater than 0 and not more than Ra 0.4.
- the joined body according to the present invention is made of aluminum or an aluminum alloy, a main body portion in which a flow path for circulating a medium that promotes heat exchange is formed, and aluminum or an aluminum alloy, and the flow path of the main body portion is formed.
- the joined body according to the present invention is characterized in that, in the above-mentioned invention, the main body portion and the cover are made of No. 6061 aluminum alloy and have a tensile strength of 125 MPa or more.
- the present invention it is possible to reliably bond the main body and the cover while suppressing the quality deterioration due to the bonding.
- FIG. 1 is a partial cross-sectional view showing the structure of a plate with a flow path according to an embodiment of the present invention.
- FIG. 2 is an enlarged cross-sectional view of the region R shown in FIG.
- FIG. 3 is a cross-sectional view illustrating a method for manufacturing a plate with a flow path according to an embodiment of the present invention.
- FIG. 4 is a cross-sectional view illustrating a method of manufacturing a plate with a flow channel according to an embodiment of the present invention.
- FIG. 5 is a figure explaining the structure of the test piece used for the Example of this invention.
- FIG. 6A is a diagram showing an SEM image of an interface after joining in an example of the present invention.
- FIG. 6A is a diagram showing an SEM image of an interface after joining in an example of the present invention.
- FIG. 6B is a diagram showing an SEM image of the interface after joining in the example of the present invention.
- FIG. 6C is a diagram showing an SEM image of an interface after joining in an example of the present invention.
- FIG. 7A is a diagram showing an EDX observation image of the interface after joining in the example of the present invention.
- FIG. 7B is a diagram showing an EDX observation image of the interface after joining in the example of the present invention.
- FIG. 7C is a diagram showing an EDX observation image of the interface after joining in the example of the present invention.
- FIG. 7D is a diagram showing an EDX observation image of the interface after joining in the example of the present invention.
- FIG. 7A is a diagram showing an EDX observation image of the interface after joining in the example of the present invention.
- FIG. 7B is a diagram showing an EDX observation image of the interface after joining in the example of the present invention.
- FIG. 7C is a diagram showing an EDX observation image of the interface
- FIG. 8 is a figure which shows the tensile test result of the test piece which carried out the diffusion bonding by making joining surface pressure 0.7 MPa.
- FIG. 9 is a diagram showing a tensile test result of a test piece diffusion-bonded with a bonding surface pressure of 0.7 MPa.
- FIG. 10 is a diagram showing a tensile test result of a test piece diffusion-bonded with a bonding surface pressure of 0.5 MPa.
- FIG. 11 is a diagram showing a tensile test result of a test piece diffusion-bonded with a bonding surface pressure of 0.5 MPa.
- FIG. 12 is a diagram showing an ultrasonic flaw detection test result of the plate with flow passages according to the example.
- FIG. 13 is a diagram for explaining particle measurement.
- FIG. 1 is a partial cross-sectional view showing the structure of a plate with a flow channel according to an embodiment of the present invention.
- FIG. 2 is an enlarged cross-sectional view of the region R shown in FIG.
- the flow path plate 1 shown in FIG. 1 includes a disk-shaped main body 10 and a cover 20 that covers one surface (here, the upper surface) of the main body 10.
- the flow path plate 1 is a bonded body in which the main body 10 and the cover 20 are bonded by diffusion bonding.
- the flow path plate 1 is attached to, for example, a semiconductor device and functions as a cooling device in the semiconductor device.
- the flow path plate 1 may be used as a heater for warming an attached device, or may be used as a heater plate for allowing gas to flow in a flow path described later, and ejects process gas in a thin film forming apparatus. It may be used as a shower head.
- the main body 10 has a disk shape made of aluminum or an aluminum alloy.
- Flow paths (for example, flow paths 11 to 13 shown in FIG. 1) through which a medium that promotes heat exchange is circulated are formed in the main body portion 10.
- the surface of the main body 10 on the opening side of the flow path is joined to the cover 20 by diffusion joining.
- the channels 11 to 13 are separated by the wall portion 14 or the wall portion 15.
- the flow paths 11 to 13 may communicate with each other to form one flow path, or at least a part thereof may form an independent flow path.
- the medium is a liquid such as water or a gas.
- the cover 20 has a disc shape made of aluminum or an aluminum alloy.
- the cover 20 covers the flow path forming surface of the main body 10.
- Examples of the aluminum alloy include No. 6061 aluminum alloy (A6061).
- the main body 10 and the cover 20 are joined by diffusion joining described later.
- the medium is introduced from the medium inlet (not shown) to flow in the flow passage, and the medium is discharged from the medium outlet (not shown).
- the heat transferred from the heat source is released to the outside via the main body 10 and the cover 20, or the medium absorbing the heat transferred from the heat source is discharged from the flow path.
- 3 and 4 are cross-sectional views illustrating a method of manufacturing a plate with flow passages according to an embodiment of the present invention.
- the flow path plate 1 is, for example, in the shape of a disk having a diameter of 150 mm or more.
- the main body 10 and the base material 200 for the cover are joined by diffusion joining (see FIG. 4: diffusion joining step).
- diffusion bonding pressure is applied to the closely attached members under a temperature condition equal to or lower than the melting point of the members, and the diffusion is used to bond the atoms between the bonding surfaces. At this time, a load is applied to the closely attached members to the extent that plastic deformation does not occur as much as possible.
- a joining temperature is 500° C. or more and 640° C. or less, and a joining surface pressure is 0.7 MPa or more.
- the joining temperature varies depending on the type of aluminum alloy. For example, the temperature is set lower than the melting point of the member.
- the bonding surface pressure is preferably 3 MPa or less, though it depends on the kind of the member.
- the flatness of the joint surface of each member is preferably 0.2 or less.
- the surface roughness of the joint surface is preferably greater than 0 and Ra 0.4 or less, and more preferably Ra 0.1 or less.
- the main body 10 and the cover 20 are joined by diffusion joining.
- diffusion bonding it is possible to reliably bond the main body portion and the cover while suppressing deterioration of quality due to the bonding.
- the surface of the flow path is roughened, the flow rate varies in the portion where the brazing material stays, and the temperature changes due to the flow rate variation. It is possible to suppress deterioration of quality such as contamination of impurities due to a brazing material component, and reliably bond the members.
- the present invention may include various embodiments and the like not described here, and various design changes and the like may be made without departing from the technical idea specified by the claims. Is possible.
- FIG. 5 is a figure explaining the structure of the test piece used for the Example of this invention.
- the member 300 is made of No. 6061 aluminum alloy (A6061).
- the member 300 has a substantially columnar joint portion 301 having a joint surface, and a grip portion 302 which is continuous with the joint surface side of the joint portion 301 and which is gripped during a test.
- the grip 302 has a thread formed on its side surface.
- FIGS. 6A to 6C are views showing SEM images of the interface after joining in the example of the present invention.
- FIG. 6B is an enlarged view of the central portion of FIG. 6A.
- FIG. 6C is an enlarged view of the central portion of FIG. 6B. As shown in FIGS. 6A to 6C, it can be seen that the bonding is performed without defects at the bonding interface.
- FIG. 7A to 7D are diagrams showing EDX observation images of the interface after joining in the example of the present invention.
- FIG. 7A shows a reflection image at the interface after joining.
- FIG. 7B shows a distribution image of aluminum (Al) at the interface after joining.
- FIG. 7C shows a distribution image of magnesium (Mg) at the interface after joining.
- FIG. 7D shows a distribution image of silicon (Si) at the interface after bonding. 7B to 7D, the lighter the color, the more the component is included.
- FIG. 7B it can be seen that aluminum, which is the main component of the member 300, is widely distributed. Further, as shown in FIGS. 7C and 7D, it can be seen that magnesium and silicon are precipitated at the bonding interface. Here, magnesium and silicon reduce the oxide film of aluminum to an oxide. It is considered that this reaction causes the amorphous oxide film at the bonding interface to change to crystalline oxide particles, which contributes to bonding between the members 300.
- FIG. 8 is a diagram showing a tensile test result of a test piece diffusion-bonded with a bonding surface pressure of 0.7 MPa.
- Test piece No. 1 to No. No. 6 has a tensile strength of more than 125 MPa.
- the tensile strength of No. 6061 aluminum alloy (A6061) is 125 MPa. From this, the test piece No. 1 to No. No. 6 can be said to have a tensile strength that is greater than the tensile strength of the No. 6061 aluminum alloy (A6061) that is the main component of the member 300.
- FIG. 9 is a diagram showing a tensile test result of a test piece diffusion-bonded with a bonding surface pressure of 0.7 MPa. Test piece No. 1 to No. It can be seen that in all of No. 6, the fracture occurred in one member, not in the bonded interface.
- FIG. 10 is a diagram showing a tensile test result of a test piece diffusion-bonded with a bonding surface pressure of 0.5 MPa.
- Test piece No. 11-No. In No. 16 the test piece No. The tensile strength of No. 13 is less than 125 MPa. From this, the test piece No. 11-No. In some cases, 16 has a tensile strength smaller than the tensile strength of the No. 6061 aluminum alloy (A6061) which is the main component of the member 300.
- A6061 aluminum alloy
- FIG. 11 is a diagram showing a tensile test result of a test piece diffusion-bonded with a bonding surface pressure of 0.5 MPa. Test piece No. 11-No. It can be seen that some of 16 (test pieces No. 13 and No. 16) are fractured at the bonding interface.
- FIG. 12 is a diagram showing an ultrasonic flaw detection test result of the plate with flow passages according to the example.
- FIG. 12 shows a plate with a flow channel bonded with a bonding surface pressure of 0.7 MPa. As can be seen from FIG. 12, there is no defect such as damage in the flow path formed in the disk member.
- FIG. 13 is a diagram for explaining particle measurement.
- each test piece (test piece 100) was attached to the jig 101, and particles collected via the jig 101 were measured by the measuring device 102. Particle measurement was carried out three times for each test piece. Since the amount of initial particles is large, in the first measurement, the process of flowing nitrogen into the flow channel was carried out several times for several minutes to stabilize the particles, and then the particles were measured.
- IPA isopropyl alcohol
- nitrogen was introduced for 1 minute, and the number of particles (accumulated number) according to the particle diameter was counted.
- the number of particles having a particle size (particle size) of 0.3 ⁇ m or less and the number of particles having a particle size of more than 0.3 ⁇ m and 0.5 ⁇ m or less were counted.
- the results of particle measurement by the test pieces joined by diffusion joining are as follows. Particle size 0.5 ⁇ m or less 0.3 ⁇ m or less First time 88 15 Second time 39 13 Third time 15 2
- the results of particle measurement by the test pieces joined by brazing are as follows. Particle size 0.3 ⁇ m or less 0.5 ⁇ m or less First time 483 168 Second time 238 84 Third time 189 87
- the count number was zero in all sizes. From the above measurement results, it can be said that the flow channels of the plate with flow channels joined by diffusion bonding have less particles than the flow channels of the plate with flow channels joined by brazing.
- the joining method and the joined body according to the present invention are suitable for surely joining the main body and the cover and suppressing the quality deterioration due to the joining.
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Abstract
Description
アルミニウム合金としては、例えば6061番のアルミニウム合金(A6061)が挙げられる。
本体部10とカバー20とは、後述する拡散接合によって接合される。
接合温度は、アルミニウム合金の種類によって変わる。例えば、部材の融点よりも低い温度に設定される。
接合面圧は、部材の種類にもよるが、3MPa以下であることが好ましい。
また、各部材の接合面の精度として、平面度が0.2以下であることが好ましい。また、接合面の面粗度は、0より大きくRa0.4以下であることが好ましく、Ra0.1以下であることがさらに好ましい。
接合体として試験を行う試験片は、同一の形状をなす二つの部材を接合させたものを使用した。図5は、本発明の実施例に用いた試験片の構成を説明する図である。本試験片は、部材300を拡散接合させたものを使用した。部材300は、6061番のアルミニウム合金(A6061)からなる。部材300は、接合面を有する略円柱状の接合部301と、接合部301の接合面側と反対側に連なり、試験時に把持される把持部302とを有する。把持部302は、側面においてねじ山が形成されている。
また、図7Cおよび図7Dに示すように、マグネシウムやケイ素が接合界面において析出していることがわかる。ここでは、マグネシウムやケイ素が、アルミニウムの酸化皮膜を還元して酸化物となる。この反応によって、接合界面の非晶質酸化膜が結晶酸化物粒子に変化し、部材300同士の接合に寄与していることが考えられる。
また、これらの試験片について、引張試験を実施した。接合面圧を0.7MPaとして接合した試験片にNo.1~No.6の番号を付し、接合面圧を0.5MPaとして接合した試験片にNo.11~No.16の番号を付して試験を行った。引張試験結果を、図8~図11に示す。
図12は、実施例にかかる流路付きプレートの超音波探傷試験結果を示す図である。図12は、接合面圧を0.7MPaとして接合した流路付きプレートを示している。図12から分かるように、円板の部材に形成されている流路に損傷などの欠陥がないことがわかる。
また、上述した流路付きプレート1を作製し、この流路付きプレート1を試験片として、パーティクル測定を行った。比較対象として、ろう付によって接合した試験片を作製して、パーティクル測定を行った。図13は、パーティクル測定について説明する図である。本実施例では、各試験片(試験片100)を治具101に取り付け、治具101を介して収集したパーティクルを、測定器102によって測定した。パーティクル測定は、各試験片について、それぞれ三回実施した。
初期のパーティクルは量が多いため、一回目の測定では、数分間、流路に窒素を流す処理を複数回実施し、パーティクルを安定させてからパーティクルの測定を行った。パーティクル測定では、まず、イソプロピルアルコール(Isopropyl alcohol:IPA)を流路に導入し、45秒間、窒素でブローした。その後、窒素を1分導入し、粒径に応じた粒子数(積算数)をカウントした。本実施例では、粒径(パーティクルサイズ)が0.3μm以下の粒子数と、粒径が0.3μmより大きく0.5μm以下の粒子数をカウントした。
パーティクルサイズ
0.5μm以下 0.3μm以下
1回目 88 15
2回目 39 13
3回目 15 2
これに対し、ろう付けによって接合した試験片によるパーティクル測定の結果は、以下のようになった。
パーティクルサイズ
0.3μm以下 0.5μm以下
1回目 483 168
2回目 238 84
3回目 189 87
なお、治具のみのパーティクル測定では、いずれのサイズもカウント数がゼロであった。
上述した測定結果から、拡散接合によって接合した流路付きプレートの流路は、ろう付によって接合した流路付きプレートの流路と比して、パーティクルが少ないといえる。
10 本体部
11~13 流路
14、15 壁部
20 カバー
Claims (5)
- アルミニウムまたはアルミニウム合金からなり、熱交換を促す媒体を流通させる流路が形成される本体部と、アルミニウムまたはアルミニウム合金からなり、前記本体部の前記流路を覆うカバーとを接合する接合方法であって、
前記本体部に前記カバーを被せる被覆ステップと、
接合温度が500℃以上640℃以下、接合面圧が0.7MPa以上の条件下で拡散接合することによって、前記本体部と前記カバーとを接合する拡散接合ステップと、
を含むことを特徴とする接合方法。 - 前記本体部の接合面および前記カバーの接合面の平面度が、それぞれ0.2以下である
ことを特徴とする請求項1に記載の接合方法。 - 前記本体部の接合面および前記カバーの接合面の面粗度が、各々0より大きくRa0.4以下である
ことを特徴とする請求項1または2に記載の接合方法。 - アルミニウムまたはアルミニウム合金からなり、熱交換を促す媒体を流通させる流路が形成される本体部と、
アルミニウムまたはアルミニウム合金からなり、前記本体部の前記流路を覆うカバーと、
を備え、
前記本体部と前記カバーとが、拡散接合されてなる
ことを特徴とする接合体。 - 前記本体部および前記カバーが、6061番のアルミニウム合金からなり、
引張り強さが125MPa以上である
ことを特徴とする請求項4に記載の接合体。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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EP19900978.8A EP3900867A4 (en) | 2018-12-21 | 2019-12-13 | JOINING METHODS AND JOINT BODIES |
KR1020217017680A KR102670607B1 (ko) | 2018-12-21 | 2019-12-13 | 접합 방법 및 접합체 |
KR1020247017491A KR20240091000A (ko) | 2018-12-21 | 2019-12-13 | 접합 방법 및 접합체 |
JP2020561389A JPWO2020129863A1 (ja) | 2018-12-21 | 2019-12-13 | 接合方法および接合体 |
CN201980084269.3A CN113195146A (zh) | 2018-12-21 | 2019-12-13 | 接合方法及接合体 |
US17/413,680 US20220009022A1 (en) | 2018-12-21 | 2019-12-13 | Joining method and joined body |
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JP2018240266 | 2018-12-21 | ||
JP2018-240266 | 2018-12-21 |
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WO2020129863A1 true WO2020129863A1 (ja) | 2020-06-25 |
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US (1) | US20220009022A1 (ja) |
EP (1) | EP3900867A4 (ja) |
JP (1) | JPWO2020129863A1 (ja) |
KR (2) | KR102670607B1 (ja) |
CN (1) | CN113195146A (ja) |
TW (1) | TWI830840B (ja) |
WO (1) | WO2020129863A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TW202023722A (zh) | 2020-07-01 |
KR20240091000A (ko) | 2024-06-21 |
EP3900867A4 (en) | 2022-09-28 |
EP3900867A1 (en) | 2021-10-27 |
KR20210089732A (ko) | 2021-07-16 |
CN113195146A (zh) | 2021-07-30 |
US20220009022A1 (en) | 2022-01-13 |
JPWO2020129863A1 (ja) | 2021-11-25 |
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