WO2020129734A1 - 基板処理装置及び基板処理方法 - Google Patents
基板処理装置及び基板処理方法 Download PDFInfo
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- WO2020129734A1 WO2020129734A1 PCT/JP2019/048093 JP2019048093W WO2020129734A1 WO 2020129734 A1 WO2020129734 A1 WO 2020129734A1 JP 2019048093 W JP2019048093 W JP 2019048093W WO 2020129734 A1 WO2020129734 A1 WO 2020129734A1
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- substrate
- wafer
- peripheral edge
- laser light
- internal surface
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
Definitions
- the present disclosure relates to a substrate processing apparatus and a substrate processing method.
- Patent Document 1 discloses a method for manufacturing a stacked semiconductor device.
- two or more semiconductor wafers are stacked to manufacture a stacked semiconductor device.
- each semiconductor wafer is laminated on another semiconductor wafer and then backside ground to have a desired thickness.
- Patent Document 2 a disk-shaped grinding tool provided with abrasive grains on the outer peripheral portion is rotated, and at least the outer peripheral surface of the grinding tool is linearly contacted with the semiconductor wafer so that the peripheral end portion of the semiconductor wafer is substantially removed. Grinding into an L-shape is disclosed. A semiconductor wafer is produced by bonding two silicon wafers together.
- the technology according to the present disclosure efficiently performs the pretreatment of removing the peripheral portion of one substrate and thinning the one substrate in a superposed substrate in which the substrates are joined together.
- One aspect of the present disclosure is a substrate processing apparatus that processes a substrate, including a holding unit that holds the second substrate in a superposed substrate in which a first substrate and a second substrate are bonded, and the first substrate.
- a detection unit that detects a boundary between a bonding region where the substrate and the second substrate are bonded, and a non-bonding region outside the bonding region, and the inside of the first substrate held by the holding unit are removed.
- An internal surface reforming unit that irradiates an internal surface laser beam along the surface direction to form an internal surface reforming layer, a holding unit moving mechanism that horizontally moves the holding unit, and a detection unit that detects the internal surface reforming unit. From the detection result, the eccentricity amount of the center of the holding unit and the center of the joining region is calculated, and based on the eccentricity amount, the holding unit is aligned so that the center of the holding unit and the center of the joining region match.
- a controller for performing an eccentricity correction for controlling the moving mechanism to move the holding unit, wherein the peripheral edge reforming unit performs the eccentricity correction and moves the holding unit while the first substrate is being moved.
- the inside surface of the first substrate is irradiated with the laser light for the peripheral edge, and the internal surface reforming unit irradiates the laser light for the internal surface without performing the eccentricity correction, at least in the central portion of the inside of the first substrate.
- a semiconductor wafer (hereinafter, referred to as a wafer) having a plurality of devices such as electronic circuits formed on the front surface is attached to the back surface of the wafer.
- the wafer is thinned by grinding.
- Grinding of the back surface of the wafer is performed, for example, by rotating the wafer and the grinding wheel with the grinding wheel in contact with the back surface and further lowering the grinding wheel. In such a case, the grinding wheel is worn and needs to be replaced regularly. Further, in the grinding process, it is necessary to use grinding water and treat the waste liquid. Therefore, a conventional wafer thinning process requires running costs.
- peripheral edge of the wafer is usually chamfered, but when the back surface of the wafer is ground as described above, the peripheral edge of the wafer becomes a sharp pointed shape (so-called knife edge shape). Then, chipping may occur at the peripheral edge of the wafer and the wafer may be damaged. Therefore, so-called edge trim is performed in advance to remove the peripheral portion of the wafer before the grinding process.
- the end surface grinding device described in Patent Document 2 described above is a device that performs this edge trim.
- the edge trim is performed by grinding, the grindstone is worn out and needs to be replaced regularly.
- a large amount of grinding water is used, and waste liquid treatment is required. Therefore, the conventional edge trim has a running cost.
- the technology according to the present disclosure efficiently performs thinning processing and edge trimming of a wafer, and thus efficiently performs these pretreatments.
- a wafer processing system as a substrate processing apparatus and a wafer processing method as a substrate processing method according to the present embodiment will be described with reference to the drawings.
- elements having substantially the same functional configuration are designated by the same reference numerals, and duplicate description is omitted.
- FIG. 1 is a plan view schematically showing the outline of the configuration of the wafer processing system 1.
- a processed wafer W as a first substrate and a support wafer S as a second substrate are bonded to a superposed wafer T as a superposed substrate. Perform predetermined processing. Then, in the wafer processing system 1, the peripheral edge portion We of the processed wafer W is removed, and the processed wafer W is further thinned.
- a surface bonded to the support wafer S is referred to as a front surface Wa
- a surface opposite to the front surface Wa is referred to as a back surface Wb.
- the surface bonded to the processing wafer W is referred to as the front surface Sa
- the surface opposite to the front surface Sa is referred to as the back surface Sb.
- the processing wafer W is, for example, a semiconductor wafer such as a silicon wafer, and has a device layer (not shown) including a plurality of devices formed on the front surface Wa. Further, an oxide film F, for example, a SiO 2 film (TEOS film) is further formed on the device layer.
- the peripheral edge We of the processed wafer W is chamfered, and the thickness of the cross section of the peripheral edge We decreases toward the tip thereof.
- the peripheral edge portion We is a portion to be removed in the edge trim, and is, for example, within a range of 1 mm to 5 mm in the radial direction from the outer end portion of the processed wafer W.
- oxide film F is not shown in FIG. 2 in order to avoid the complexity of the drawing. Similarly, in other drawings used in the following description, illustration of the oxide film F may be omitted.
- the support wafer S is a wafer that supports the processing wafer W, and is, for example, a silicon wafer.
- An oxide film (not shown) is formed on the surface Sa of the support wafer S.
- the support wafer S functions as a protective material that protects the device on the front surface Wa of the processing wafer W.
- a device layer (not shown) is formed on the front surface Sa similarly to the processed wafer W.
- a bonding region Aa where the oxide film F and the surface Sa of the supporting wafer S are bonded and an unbonded region Ab which is a region radially outside the bonding region Aa are provided at the interface between the processing wafer W and the supporting wafer S.
- an unbonded region Ab which is a region radially outside the bonding region Aa.
- the wafer processing system 1 has a configuration in which a loading/unloading station 2 and a processing station 3 are integrally connected.
- the loading/unloading station 2 loads/unloads a cassette Ct capable of accommodating a plurality of overlapped wafers T with the outside, for example.
- the processing station 3 includes various processing devices that perform predetermined processing on the overlapped wafer T.
- the cassette loading table 10 is provided in the loading/unloading station 2.
- a plurality of, for example, three cassettes Ct can be mounted on the cassette mounting table 10 in a line in the Y-axis direction.
- the number of cassettes Ct mounted on the cassette mounting table 10 is not limited to this embodiment, and can be arbitrarily determined.
- a wafer transfer device 20 is provided adjacent to the cassette mounting table 10 on the X axis negative direction side of the cassette mounting table 10.
- the wafer transfer device 20 is configured to be movable on a transfer path 21 extending in the Y-axis direction.
- the wafer transfer device 20 has, for example, two transfer arms 22, 22 that hold and transfer the overlapped wafer T.
- Each transfer arm 22 is configured to be movable in the horizontal direction, the vertical direction, around the horizontal axis, and around the vertical axis.
- the configuration of the transfer arm 22 is not limited to this embodiment, and may have any configuration.
- the wafer transfer device 20 is configured to be able to transfer the overlapped wafer T to the cassette Ct of the cassette mounting table 10 and the transition device 30 described later.
- the loading/unloading station 2 is provided with a transition device 30 for transferring the overlapped wafer T, adjacent to the wafer transfer device 20 on the X-axis negative direction side of the wafer transfer device 20.
- the processing station 3 is provided with, for example, three processing blocks G1 to G3.
- the first processing block G1, the second processing block G2, and the third processing block G3 are arranged side by side in this order from the X-axis positive direction side (the loading/unloading station 2 side) to the negative direction side.
- the first processing block G1 is provided with an etching device 40, a cleaning device 41, and a wafer transfer device 50.
- the etching device 40 and the cleaning device 41 are arranged in layers.
- the number and arrangement of the etching device 40 and the cleaning device 41 are not limited to this.
- the etching device 40 and the cleaning device 41 may extend in the X-axis direction and may be placed side by side in parallel in a plan view. Further, each of the etching device 40 and the cleaning device 41 may be laminated.
- the etching device 40 performs an etching process on the back surface Wb of the processing wafer W ground by the processing device 80 described later.
- a chemical solution etching solution
- HF, HNO 3 , H 3 PO 4 , TMAH, Choline, KOH or the like is used as the chemical liquid.
- the cleaning device 41 cleans the back surface Wb of the processed wafer W ground by the processing device 80 described later. For example, a brush is brought into contact with the back surface Wb to scrub and clean the back surface Wb. Note that a pressurized cleaning liquid may be used for cleaning the back surface Wb. Further, the cleaning device 41 may have a configuration for cleaning the back surface Sb of the support wafer S together with the back surface Wb of the processing wafer W.
- the wafer transfer device 50 is arranged, for example, on the Y axis negative direction side with respect to the etching device 40 and the cleaning device 41.
- the wafer transfer device 50 has, for example, two transfer arms 51, 51 for holding and transferring the overlapped wafer T.
- Each transfer arm 51 is configured to be movable in the horizontal direction, the vertical direction, around the horizontal axis, and around the vertical axis.
- the configuration of the transfer arm 51 is not limited to this embodiment, and may have any configuration.
- the wafer transfer device 50 is configured to transfer the superposed wafer T to the transition device 30, the etching device 40, the cleaning device 41, and the reforming device 60 described later.
- the second processing block G2 is provided with a reforming device 60, a peripheral edge removing device 61, and a wafer transfer device 70.
- the reforming device 60 and the peripheral edge removing device 61 are arranged in layers. The number and arrangement of the reforming device 60 and the peripheral edge removing device 61 are not limited to this.
- the reforming device 60 irradiates the inside of the processed wafer W with laser light to form a peripheral reforming layer, a split reforming layer, and an inner surface reforming layer.
- the specific configuration of the reformer 60 will be described later.
- the peripheral edge removing device 61 removes the peripheral edge portion We of the processed wafer W with the peripheral edge modified layer formed by the reforming device 60 as a starting point.
- the specific configuration of the peripheral edge removing device 61 will be described later.
- the wafer transfer device 70 is arranged, for example, on the Y axis positive direction side with respect to the reforming device 60 and the peripheral edge removing device 61.
- the wafer transfer device 70 has, for example, two transfer arms 71, 71 for holding and transferring the overlapped wafer T.
- Each transfer arm 71 is supported by an articulated arm member 72, and is configured to be movable in a horizontal direction, a vertical direction, a horizontal axis, and a vertical axis. The specific configuration of the transfer arm 71 will be described later.
- the wafer transfer device 70 is configured to transfer the superposed wafer T to the cleaning device 41, the reforming device 60, the peripheral edge removing device 61, and the processing device 80 described later.
- a processing device 80 is provided in the third processing block G3. Note that the number and arrangement of the processing devices 80 are not limited to this embodiment, and a plurality of processing devices 80 may be arranged arbitrarily.
- the processing device 80 grinds the back surface Wb of the processed wafer W. Then, on the back surface Wb on which the inner surface reforming layer is formed, the inner surface reforming layer is removed and the peripheral edge reforming layer is further removed. Specifically, the processing device 80 rotates the processing wafer W and the grinding wheel, respectively, in a state where the back surface Wb of the processing wafer W held by the chuck 81 is in contact with a grinding wheel (not shown), and the back surface Wb is rotated. To grind.
- a known grinding device (polishing device) is used as the processing device 80, and for example, the device described in JP 2010-69601 A is used.
- the wafer processing system 1 described above is provided with the control device 90 as a control unit.
- the control device 90 is, for example, a computer and has a program storage unit (not shown).
- the program storage unit stores a program for controlling the processing of the overlapped wafer T in the wafer processing system 1.
- the program storage unit also stores a program for controlling the operation of drive systems such as the above-described various processing devices and transfer devices so as to realize substrate processing to be described later in the wafer processing system 1.
- the program may be recorded in a computer-readable storage medium H and may be installed in the control device 90 from the storage medium H.
- FIG. 4 is a plan view showing the outline of the configuration of the reformer 60.
- FIG. 5 is a side view showing the outline of the configuration of the reformer 60.
- the reforming device 60 has a chuck 100 as a holding unit that holds the superposed wafer T on its upper surface.
- the chuck 100 sucks and holds the support wafer S in a state where the processing wafer W is on the upper side and the support wafer S is on the lower side.
- the chuck 100 is supported by the slider table 102 via an air bearing 101.
- a rotating unit 103 is provided on the lower surface side of the slider table 102.
- the rotating unit 103 incorporates, for example, a motor as a drive source.
- the chuck 100 is configured to be rotatable about the vertical axis by the rotating unit 103 via the air bearing 101.
- the slider table 102 is configured to be movable along a rail 105 provided on a base 106 and extending in the Y-axis direction by a horizontal moving unit 104 provided on the lower surface side.
- the rotating unit 103 and the horizontal moving unit 104 form a holding unit moving mechanism.
- the drive source of the horizontal moving unit 104 is not particularly limited, but a linear motor is used, for example.
- a laser head 110 is provided above the chuck 100.
- the laser head 110 has a lens 111.
- the lens 111 is a cylindrical member provided on the lower surface of the laser head 110, and irradiates the processing wafer W held by the chuck 100 with laser light.
- the peripheral edge reforming portion and the inner surface reforming portion have the common laser head 110.
- the laser head 110 further has an LCOS (Liquid Crystal on Silicon) not shown.
- the LCOS is a spatial light modulator that modulates and outputs laser light.
- the LCOS can control the focal position and phase of the laser light, and can adjust the shape and number (branch number) of the laser light with which the processing wafer W is irradiated.
- the laser head 110 emits high-frequency pulsed laser light oscillated from a laser light oscillator (not shown) having a wavelength that is transparent to the processing wafer W inside the processing wafer W.
- the light is condensed and irradiated at a predetermined position. As a result, the portion where the laser light is focused inside the processed wafer W is modified, and the peripheral modified layer, the split modified layer, and the inner surface modified layer are formed.
- the laser head 110 is supported by the support member 120.
- the laser head 110 is configured to be movable up and down by a lifting mechanism 130 along a rail 121 extending in the vertical direction. Further, the laser head 110 is configured to be movable in the Y-axis direction by the moving mechanism 131.
- the elevating mechanism 130 and the moving mechanism 131 are supported by the support columns 132, respectively.
- a macro camera 140 and a micro camera 150 as a detection unit are provided above the chuck 100 and on the Y-axis positive direction side of the laser head 110.
- the macro camera 140 and the micro camera 150 are integrally formed, and the macro camera 140 is arranged on the Y-axis positive direction side of the micro camera 150.
- the macro camera 140 and the micro camera 150 are configured to be movable up and down by a lifting mechanism 160, and are further configured to be movable in the Y-axis direction by a moving mechanism 161.
- the macro camera 140 images (detects) the outer edge R1 (dotted line in FIG. 6) of the processed wafer W (overlapping wafer T) as shown in FIG.
- the macro camera 140 includes, for example, a coaxial lens, emits visible light, for example, red light, and further receives reflected light from an object.
- the visible light is reflected on the back surface Wb of the processing wafer W, but is absorbed by the chuck 100. Therefore, in the image captured by the macro camera 140, the processed wafer W appears white and the chuck 100 appears black.
- the imaging magnification of the macro camera 140 is 2 times.
- the image captured by the macro camera 140 is output to the control device 90.
- the controller 90 calculates the first eccentricity amount between the center Cc of the chuck 100 and the center Cw of the processed wafer W from the image captured by the macro camera 140 as shown in FIG. 7.
- the micro camera 150 images the peripheral portion of the processed wafer W as shown in FIG. 8, and images (detects) the boundary R2 (dotted line in FIG. 8) between the bonded area Aa and the unbonded area Ab.
- the micro camera 150 includes, for example, a coaxial lens, irradiates infrared light (IR light), and further receives reflected light from an object. Note that, for example, the imaging magnification of the micro camera 150 is 10 times, the field of view is about 1 ⁇ 5 of the macro camera 140, and the pixel size is about 1 ⁇ 5 of the macro camera 140.
- the image captured by the micro camera 150 is output to the control device 90.
- the controller 90 calculates the second eccentricity amount between the center Cc of the chuck 100 and the center Ca of the bonding area Aa from the image captured by the micro camera 150 as shown in FIG. Further, the control device 90 controls the holding part moving mechanism (the rotating part 103 and the horizontal moving part 104) so that the center of the chuck 100 and the center of the bonding area Aa match based on the second eccentric amount.
- the chuck 100 is moved.
- the control for moving the chuck 100 may be referred to as eccentricity correction.
- FIG. 10 is a plan view showing the outline of the configuration of the peripheral edge removing device 61.
- FIG. 11 is a side view showing the outline of the configuration of the peripheral edge removing device 61.
- the peripheral edge removing device 61 has a chuck 170 for holding the overlapped wafer T on its upper surface.
- the chuck 170 sucks and holds the support wafer S in a state where the processing wafer W is on the upper side and the support wafer S is on the lower side.
- the chuck 170 is configured to be rotatable about a vertical axis by a rotating mechanism 171.
- a pad 180 for holding and transferring the peripheral edge portion We of the processing wafer W is provided above the chuck 170.
- a suction mechanism (not shown) such as a vacuum pump is connected to the pad 180, and the pad 180 sucks and holds the peripheral edge portion We on the lower surface thereof.
- the pad 180 is provided with an elevating mechanism 181 for vertically elevating the pad 180 and a moving mechanism 182 for moving the pad 180 in the horizontal direction (X-axis direction and Y-axis direction).
- a detection unit 190 for confirming whether or not the peripheral edge portion We has been removed from the processing wafer W is provided.
- the detection unit 190 detects the presence or absence of the peripheral edge We in the processed wafer W held by the chuck 170 and having the peripheral edge We removed.
- a sensor is used for the detection unit 190, for example.
- the sensor is, for example, a line type laser displacement meter, and detects the presence or absence of the peripheral edge portion We by irradiating the peripheral edge portion of the overlapped wafer T (processed wafer W) with a laser to measure the thickness of the overlapped wafer T. ..
- the detection method of the presence or absence of the peripheral edge portion We by the detection unit 190 is not limited to this.
- a line camera may be used as the detection unit 190, and the presence or absence of the peripheral edge portion We may be detected by imaging the overlapped wafer T (processed wafer W).
- a recovery unit (not shown) that recovers the peripheral edge portion We transferred by the pad 180 is provided below the chuck 170.
- the recovery unit accommodates and recovers the peripheral edge We that is suction-held by the pad 180.
- FIG. 12 is a vertical cross-sectional view showing the outline of the configuration of the transfer arm 71.
- the transfer arm 71 has a disk-shaped suction plate 200 having a larger diameter than the overlapped wafer T.
- a holding unit 210 that holds the central portion Wc of the processing wafer W is provided on the lower surface of the suction plate 200.
- a suction pipe 211 for sucking the central portion Wc is connected to the holding portion 210, and the suction pipe 211 communicates with a suction mechanism 212 such as a vacuum pump.
- the suction pipe 211 is provided with a pressure sensor 213 that measures suction pressure.
- the configuration of the pressure sensor 213 is arbitrary, but for example, a diaphragm type pressure gauge is used.
- a rotation mechanism 220 that rotates the suction plate 200 around a vertical axis is provided on the upper surface of the suction plate 200.
- the rotation mechanism 220 is supported by the support member 221.
- the support member 221 (rotation mechanism 220) is supported by the arm member 72.
- FIG. 13 is a flowchart showing the main steps of wafer processing.
- FIG. 14 is an explanatory diagram of main steps of wafer processing.
- the processing wafer W and the supporting wafer S are bonded to each other in the bonding apparatus (not shown) outside the wafer processing system 1 to form the overlapped wafer T in advance.
- the cassette Ct containing a plurality of overlapping wafers T shown in FIG. 14A is placed on the cassette placing table 10 of the loading/unloading station 2.
- the overlapped wafer T in the cassette Ct is taken out by the wafer transfer device 20 and transferred to the transition device 30.
- the wafer transfer device 50 takes out the overlapped wafer T of the transition device 30 and transfers it to the reforming device 60.
- the peripheral reforming layer M1 and the divided reforming layer M2 are sequentially formed inside the processed wafer W (steps A1 and A2 in FIG. 13), and further in FIG. As shown in c), the inner surface modified layer M3 is formed (step A3 in FIG. 13).
- the peripheral edge modifying layer M1 serves as a base point for removing the peripheral edge We in the edge trim.
- the divided reformed layer M2 serves as a base point for making the removed peripheral edge portion We into small pieces.
- the inner surface modified layer M3 serves as a base point for thinning the processed wafer W.
- FIG. 15 is an explanatory diagram of main steps of the reforming process in the reforming device 60.
- the chuck 100 sliding table 102
- the superposed wafer T is loaded from the wafer transfer device 50 and held by the chuck 100.
- the chuck 100 is moved to the macro alignment position P2 as shown in FIG. 15(b).
- the macro alignment position P2 is a position where the macro camera 140 can capture an image of the outer edge of the processing wafer W.
- the macro camera 140 captures an image of the outer edge R1 of the processed wafer W in the circumferential direction of 360 degrees.
- the captured image is output from the macro camera 140 to the control device 90.
- the controller 90 calculates the first eccentricity amount of the center Cc of the chuck 100 and the center Cw of the processed wafer W from the image of the macro camera 140. Further, the control device 90 calculates the movement amount of the chuck 100 based on the first eccentricity amount so as to correct the Y-axis component of the first eccentricity amount.
- the chuck 100 moves in the Y-axis direction based on the calculated movement amount, and moves the chuck 100 to the micro alignment position P3 as shown in FIG.
- the micro alignment position P3 is a position where the micro camera 150 can capture an image of the peripheral portion of the processing wafer W.
- the field of view of the micro camera 150 is as small as about 1/5 of that of the macro camera 140.
- the peripheral portion of the processing wafer W is the micro camera.
- the micro camera 150 may not be able to capture an image because it does not enter the angle of view of 150. Therefore, the correction of the Y-axis component based on the first amount of eccentricity can also be said to be for moving the chuck 100 to the micro alignment position P3.
- the micro camera 150 takes an image of the boundary R2 between the bonded area Aa and the unbonded area Ab in the circumferential direction of 360 degrees of the processed wafer W.
- the captured image is output from the micro camera 150 to the control device 90.
- the controller 90 calculates the second eccentricity amount between the center Cc of the chuck 100 and the center Ca of the bonding area Aa from the image of the micro camera 150. Further, the controller 90 determines the position of the chuck 100 with respect to the peripheral modified layer M1 based on the second eccentricity amount so that the center of the chuck 100 and the center of the bonding area Aa coincide with each other.
- the unbonded area Ab is formed before the processing wafer W and the supporting wafer S are bonded.
- the center of the unbonded area Ab (center Ca of the bonding area Aa) and the center of the processed wafer W are formed. There is a case that it is misaligned.
- the deviation of the unbonded region Ab is corrected.
- the modification position P4 is a position where the laser head 110 irradiates the processing wafer W with laser light to form the peripheral modification layer M1.
- the modified position P4 is the same as the micro alignment position P3.
- laser light L1 (peripheral edge laser light L1) is emitted from the laser head 110, and the peripheral edge modifying layer M1 is applied to the boundary between the peripheral edge We and the central portion Wc of the processing wafer W.
- the shape and number of the laser light L1 are adjusted by the LCOS. Specifically, the laser light L1 is controlled in its focal position and phase so as to form a peripheral modified layer M1 described later, and its shape is adjusted. Further, in the present embodiment, the number of laser beams L1 is one.
- the peripheral edge modified layer M1 formed by the laser beam L1 is stretched in the thickness direction and has a vertically long aspect ratio.
- the lower end of the peripheral modified layer M1 is located above the target surface (dotted line in FIG. 16) of the thinned processed wafer W. That is, the distance H1 between the lower end of the peripheral modified layer M1 and the surface Wa of the processed wafer W is larger than the target thickness H2 of the thinned processed wafer W.
- the peripheral modified layer M1 does not remain on the processed wafer W after thinning. Inside the processed wafer W, cracks C1 have propagated from the peripheral modified layer M1 and have reached the front surface Wa and the back surface Wb.
- the peripheral modified layer M1 is formed radially inward of the outer end of the bonding area Aa.
- the peripheral edge modifying layer M1 is formed by the laser light L1 from the laser head 110, even if the peripheral edge modifying layer M1 is formed deviating from the outer end of the bonding area Aa due to, for example, a processing error, the peripheral edge modifying layer M1 is changed. It is possible to suppress the quality layer M1 from being formed radially outward from the outer end portion of the bonding area Aa.
- the peripheral edge modified layer M1 floats on the support wafer S after the peripheral edge We is removed. I will end up. In this respect, in the present embodiment, the state of the processed wafer W can be reliably suppressed.
- the inventors of the present invention have diligently studied and confirmed that the peripheral edge We can be appropriately removed if the distance D between the peripheral edge modified layer M1 and the outer end of the bonding area Aa is sufficiently small.
- the distance D is preferably within 500 ⁇ m, more preferably within 50 ⁇ m.
- the control device 90 determines the position of the chuck 100 based on the second amount of eccentricity.
- step A1 the rotating unit 103 rotates the chuck 100 and the horizontal moving unit 104 rotates the chuck 100 so that the center of the chuck 100 and the center of the bonding area Aa match with the determined position of the chuck 100. Is moved in the Y-axis direction. That is, in step A1, eccentricity correction is performed. At this time, the rotation of the chuck 100 and the movement in the Y-axis direction are synchronized. By performing the complete synchronization control in this manner, the movement of the chuck 100 can be appropriately followed by the determined position with a small error.
- the laser light L1 is irradiated from the laser head 110 to the inside of the processing wafer W. That is, the peripheral edge modified layer M1 is formed while correcting the second eccentricity amount. Then, the peripheral modified layer M1 is annularly formed concentrically with the bonding area Aa. That is, the distance D between the peripheral modified layer M1 and the outer end of the bonding area Aa shown in FIG. 16 can be made constant. Therefore, in the peripheral edge removing device 61, the peripheral edge portion We can be appropriately removed with the peripheral edge modifying layer M1 as a base point.
- the chuck 100 when the second amount of eccentricity has an X-axis component, the chuck 100 is rotated in the Y-axis direction and the chuck 100 is rotated to correct the X-axis component.
- the second amount of eccentricity when the second amount of eccentricity does not include the X-axis component, it is sufficient to move the chuck 100 in the Y-axis direction without rotating it.
- the laser head 110 is moved in the Y-axis direction, and laser light L2 (division laser light L2) is emitted from the laser head 110 as shown in FIGS.
- the divided reformed layer M2 is formed on the outer side in the direction (step A2 in FIG. 13).
- the laser light emitted from the laser head 110 is switched from the laser light L1 to the laser light L2 by the LCOS, and the shape and number of the laser light L2 are adjusted.
- the laser beam L2 is controlled in its focal position and phase to adjust its shape so as to form a split modification layer M2 described later.
- the number of laser beams L2 is one.
- the divided modified layer M2 is also stretched in the thickness direction and has a vertically long aspect ratio.
- the divided reformed layer M2 is formed at the same height as the peripheral reformed layer M1. Further, the crack C2 has propagated from the divided reformed layer M2 and reaches the front surface Wa and the back surface Wb.
- the divided reformed layers M2 of the line extending in the radial direction are formed at eight locations, but the number of divided reformed layers M2 is arbitrary. If at least the divided modified layer M2 is formed at two locations, the peripheral edge portion We can be removed.
- the peripheral edge We is divided into a plurality of pieces by the division modified layer M2 while separating from the annular peripheral modified layer M1 as a base point. Then, the removed peripheral edge We is made into small pieces, which can be removed more easily.
- the chuck 100 may be moved in the Y-axis direction.
- laser light L3 (inner surface laser light L3) is emitted from the laser head 110 to form an inner surface modified layer M3 along the surface direction (FIG. 13).
- Step A3 the laser light emitted from the laser head 110 is switched from the laser light L2 to the laser light L3 by the LCOS, and the shape and number of the laser light L3 are adjusted.
- the laser beam L3 is controlled in its focal position and phase to adjust its shape so as to form an internal surface reforming layer M3 described later.
- the number of laser beams L3 is one.
- the black arrow shown in FIG. 21 indicates the rotation direction of the chuck 100, and the same applies to the following description.
- the lower end of the inner surface modified layer M3 is located slightly above the target surface (dotted line in FIG. 20) of the thinned processed wafer W. That is, the distance H3 between the lower end of the inner surface modified layer M3 and the front surface Wa of the processed wafer W is slightly larger than the target thickness H2 of the thinned processed wafer W.
- a crack C3 propagates in the surface direction from the inner surface modified layer M3.
- Step A3 the chuck 100 (processed wafer W) is rotated, and the laser head 110 is moved from the outer peripheral portion of the processed wafer W toward the central portion in the Y-axis direction while being moved from the laser head 110 to the inside of the processed wafer W.
- the laser light L3 is emitted.
- the inner surface modified layer M3 is formed in a spiral shape from the outer side to the inner side in the surface of the processing wafer W.
- the chuck 100 may be moved in the Y-axis direction.
- eccentricity correction is performed when forming the peripheral modified layer M1 in step A1, but eccentricity correction is performed when forming the internal surface modified layer M3 in step A3 in the present embodiment. Not performed.
- the rotation speed of the chuck 100 is controlled to adjust the distance between the inner surface modified layers M3. That is, when the radial position of the laser head 110 (irradiation position of the laser beam L3) is on the outer peripheral portion, the rotation speed is slowed, and when the radial position of the laser head 110 is at the central portion, the rotation speed is increased. doing.
- the rotation speed is 30 rpm to 60 rpm in the outer peripheral portion of the processed wafer W (for example, in the range of 120 mm to 150 mm in the radial direction).
- the rotation speed is 500 rpm to 3000 rpm. In the range of 20 mm to 120 mm in the radial direction of the processed wafer W, the rotation speed linearly changes from 60 rpm to 500 rpm.
- the chuck 100 is rotating at a high speed, so it is difficult to follow the movement of the chuck 100 with the eccentricity correction. Therefore, when the laser head 110 is located at the center, the laser light L3 is emitted from the laser head 110 without performing the eccentricity correction.
- the laser light L3 is emitted from the laser head 110 without performing the eccentricity correction.
- the irradiation start position Ps of the laser light L3 from the laser head 110 is located radially outside of the peripheral modified layer M1.
- the radial distance Q between the irradiation start position Ps and the peripheral modified layer M1 is equal to or greater than the second eccentric amount.
- the inner surface reforming layer M3 is formed by radiating the laser light L3 for approximately one round on the outer side in the radial direction of the peripheral reforming layer M1.
- the irradiation start position Ps of the laser beam L3 is on the outer side in the radial direction of the peripheral edge modified layer M1, and the inner surface modified layer M3 may be one turn or less outside the peripheral edge modified layer M1.
- the chuck 100 is moved to the loading/unloading position P1 as shown in FIG. Then, the overlapped wafer T is unloaded by the wafer transfer device 70.
- the overlapped wafer T is transferred to the peripheral edge removing device 61 by the wafer transfer device 70.
- the peripheral edge removing device 61 removes the peripheral edge portion We of the processed wafer W from the peripheral edge modified layer M1 as a base point (step A4 in FIG. 13).
- the lifting mechanism 181 lowers the pad 180 to suck and hold the peripheral edge portion We, and then raises the pad 180 further.
- the peripheral edge portion We held by the pad 180 is separated from the processed wafer W with the peripheral edge modified layer M1 as a base point.
- the peripheral edge portion We is divided into small pieces based on the divided reformed layer M2.
- the removed peripheral edge portion We is recovered from the pad 180 to a recovery unit (not shown).
- the overlapped wafer T is transferred to the processing device 80 by the wafer transfer device 70.
- the processing apparatus 80 first, when transferring the overlapped wafer T from the transfer arm 71 to the chuck 81, as shown in FIG. , Back wafer Wb1) (step A5 in FIG. 13).
- step A5 as shown in FIG. 23A, the processing wafer W is suction-held by the suction plate 200 of the transfer arm 71, while the supporting wafer S is suction-held by the chuck 81. Then, the suction plate 200 is rotated, and the back surface wafer Wb1 is cut along the boundary of the inner surface reforming layer M3. After that, as shown in FIG. 23B, in a state where the suction plate 200 suction-holds the back surface wafer Wb1, the suction plate 200 is raised to separate the back surface wafer Wb1 from the processing wafer W.
- the pressure sensor 213 measures the pressure with which the backside wafer Wb1 is sucked, whereby the presence or absence of the backside wafer Wb1 can be detected, and it can be confirmed whether or not the backside wafer Wb1 is separated from the processed wafer W. If the backside wafer Wb1 can be separated only by raising the suction plate 200 as shown in FIG. 23B, the rotation of the suction plate 200 shown in FIG. 23A may be omitted. The separated backside wafer Wb1 is collected outside the wafer processing system 1.
- step A6 the back surface Wb is ground by rotating the processing wafer W and the grinding wheel while the back surface Wb is in contact with the grinding wheel.
- the back surface Wb of the processed wafer W may be cleaned with the cleaning liquid using a cleaning liquid nozzle (not shown).
- the overlapped wafer T is transferred to the cleaning device 41 by the wafer transfer device 70.
- the back surface Wb which is the ground surface of the processed wafer W is scrubbed and cleaned (step A7 in FIG. 13).
- the back surface Sb of the support wafer S may be cleaned together with the back surface Wb of the processing wafer W.
- the overlapped wafer T is transferred to the etching device 40 by the wafer transfer device 50.
- the back surface Wb of the processed wafer W is wet-etched with a chemical solution (step A8 in FIG. 13).
- a grinding mark may be formed on the back surface Wb ground by the processing device 80 described above.
- the grinding marks can be removed by wet etching, and the back surface Wb can be smoothed.
- the superposed wafer T that has undergone all the processes is transferred to the transition device 30 by the wafer transfer device 50, and further transferred to the cassette Ct of the cassette mounting table 10 by the wafer transfer device 20. In this way, a series of wafer processing in the wafer processing system 1 is completed.
- the peripheral portion We is removed from the peripheral modified layer M1 as a starting point to perform edge trim, and the back surface wafer Wb1 is separated from the internal modified surface layer M3 as a starting point to reduce the thickness of the processed wafer W.
- the conversion process is being performed.
- the laser head 110 used for forming the peripheral modified layer M1 and the internal modified layer M3 is less likely to deteriorate with time and the consumables are reduced, so that the maintenance frequency can be reduced. Further, since it is a dry process using a laser, it is not necessary to process grinding water or waste water. Therefore, the running cost can be reduced. Therefore, the running cost can be suppressed as compared with the conventional edge trimming by grinding or thinning processing by grinding.
- the back surface Wb is ground in step A6, but this grinding may be performed by removing the inner surface modified layer M3 and the peripheral modified layer M1, and the grinding amount is about several tens of ⁇ m. Few.
- the grinding amount is large, for example, 700 ⁇ m or more, and the degree of wear of the grinding wheel is large. Therefore, in the present embodiment, the maintenance frequency can be reduced.
- the peripheral edge modified layer M1, the split modified layer M2, and the internal surface modified layer M3 are formed. Can be formed. That is, even if the direction in which the modified layer is stretched and the required processing quality are different, it is possible to use one laser head 110 to select an appropriate shape of the laser beam. Since the modified layer having an arbitrary shape can be formed in this manner, the degree of freedom in forming the modified layer is improved. Further, the area occupied by the device (footprint) can be reduced, and space saving can be realized. Further, since the device configuration is simple, the device cost can be reduced. As described above, in this embodiment, the thinning process of the processed wafer W and the pre-process of the edge trim can be efficiently performed.
- eccentricity correction is performed to align the center of the chuck 100 with the center of the bonding area Aa, so that the peripheral edge modified layer M1 is bonded. It can be formed concentrically with the area Aa at an appropriate position. Therefore, the peripheral edge portion We can be appropriately removed in the subsequent step A4.
- eccentricity correction is not performed when forming the inner surface reforming layer M3 in step A3, and the irradiation start position Ps of the laser light L3 thereof is located radially outside the peripheral reforming layer M1. ..
- the inner surface modified layer M3 can be formed on the entire surface of the processed wafer W at an appropriate position.
- eccentricity correction is not performed, and a high rotation speed can be maintained.
- the inner surface reforming layers M3 can have the same spacing in the surface direction. Therefore, in the subsequent step A5, the processed wafer W can be appropriately separated.
- both the formation of the peripheral edge modified layer M1 in step A1 and the formation of the internal surface modified layer M3 in step A3 are appropriately realized by properly using the presence or absence of eccentricity correction. be able to.
- the irradiation start position Ps of the laser beam L3 is radially outside of the peripheral edge modifying layer M1 without performing the eccentricity correction in step A3, thereby absorbing the second eccentricity amount and processing wafer. It was realized that the inner surface modified layer M3 was appropriately formed inside the W. In this respect, the method of forming the inner surface modified layer M3 in consideration of the second eccentricity is not limited to this.
- the irradiation start position Ps of the laser beam L3 from the laser head 110 is set radially inward of the peripheral modified layer M1. Then, eccentricity correction is performed in a range where the laser head 110 is located on the outer peripheral portion of the processing wafer W. That is, while moving the laser head 110 from the outer side to the inner side in the radial direction, the rotating unit 103 rotates the chuck 100 so that the center of the chuck 100 coincides with the center of the bonding area Aa, and the horizontal moving unit 104 moves the chuck 100. Is moved in the Y-axis direction. At this time, since the rotation speed of the chuck 100 is low, eccentricity correction can be appropriately performed.
- the eccentricity correction in this embodiment may be performed only while the laser head 110 irradiates the laser light L3 for several turns from the outside.
- the eccentricity correction is not performed in the range where the laser head 110 is located in the central portion. Therefore, a high rotation speed can be maintained, and as a result, the inner surface reforming layers M3 can have the same spacing in the surface direction.
- the laser beams L1 to L3 having different shapes are emitted by one laser head 110.
- the laser head 110 does not carry the processed wafer T to be processed into the reforming apparatus 60. Is preferably calibrated. More specifically, it is preferable to calibrate the laser head 110 before the overlapped wafer T is held on the chuck 100. In such a case, it is not necessary to calibrate the laser head 110 during the reforming process for one processed wafer W, and the time required for switching the laser beams L1 to L3 can be shortened. As a result, the throughput of wafer processing can be improved.
- peripheral modified layer M1 when the peripheral modified layer M1 is formed, one laser beam L1 is emitted from the laser head 110 into the inside of the processing wafer W, but a plurality of laser beams L1 may be emitted. In such a case, the time for forming the peripheral modified layer M1 can be shortened, and the throughput of wafer processing can be further improved.
- the internal surface reforming layer M3 when the internal surface reforming layer M3 is formed, one laser beam L3 is emitted from the laser head 110 to the inside of the processing wafer W, but a plurality of laser beams L3 may be emitted. Even in such a case, the time for forming the inner surface modified layer M3 can be shortened, and the throughput of wafer processing can be further improved.
- the laser head 110 is referred to as a first laser head 110
- the laser head 300 is referred to as a second laser head 300.
- the number of laser heads is not limited to this embodiment.
- the macro camera 140 and the micro camera 150 are not shown in order to avoid complication of illustration.
- the second laser head 300 is provided on the Y-axis positive direction side of the first laser head 110.
- the configuration of the second laser head 300 is similar to that of the first laser head 110. That is, the second laser head 300 has the lens 301 and the LCOS (not shown).
- the supporting structure of the second laser head 300 is similar to the supporting structure of the first laser head 110. That is, the second laser head 300 is supported by the support member 310, the rail 311, the elevating mechanism 320, and the moving mechanism 321.
- the second laser head 300 is configured to be movable up and down and movable in the Y-axis direction.
- the first laser head 110 and the second laser head 300 are arranged concentrically on the outer peripheral portion of the processed wafer W. Then, while rotating the processing wafer W, the laser beam L11 is emitted from the first laser head 110 and the laser beam L12 is emitted from the second laser head 300. Then, the laser light L11 forms the peripheral modified layer M11, and the laser light L12 forms the peripheral modified layer M12.
- the peripheral edge modified layers M11 and M12 are respectively formed over a half circumference of the processed wafer W, and the peripheral edge modified layers M1 and M12 are combined to form the peripheral edge modified layer M1 in an annular shape.
- the processed wafer W only needs to be rotated 180 degrees when forming the peripheral modified layer M1. Therefore, the time for forming the peripheral modified layer M1 can be shortened, and as a result, the throughput of wafer processing can be further improved.
- the laser light L11 from the first laser head 110 and the laser light L12 from the second laser head 300 are irradiated to the same depth inside the processing wafer W to modify the peripheral edge.
- the layer M11 and the peripheral modified layer M12 were formed at the same depth.
- the laser light L11 and the laser light L12 may be irradiated to different depths to form the peripheral modified layer M11 and the modified peripheral layer M12 at different depths.
- the first laser head 110 and the second laser head 300 are arranged concentrically on the outer peripheral portion of the processed wafer W. Then, while rotating the processing wafer W, the first laser head 110 and the second laser head 300 are moved in the Y-axis direction from the outer peripheral portion of the processing wafer W toward the central portion. That is, the first laser head 110 is moved in the Y-axis positive direction, and the second laser head 300 is moved in the Y-axis negative direction.
- the first laser head 110 irradiates the inside of the processing wafer W with the laser light L31
- the second laser head 300 emits the laser light into the inside of the processing wafer W.
- the light L32 is emitted.
- the laser light L31 forms the inner surface reforming layer M31
- the laser light L32 forms the inner surface reforming layer M32.
- the inner surface modified layers M31 and M32 are each formed in a spiral shape, and the inner surface modified layer M3 is formed on the entire surface of the processed wafer W.
- the divided reformed layer M2 is formed by using the laser head 110 used in the reformer 60 to form the other peripheral reformed layer M1 and the inner surface reformed layer M3.
- a separate laser head may be used.
- the peripheral reforming layer M1, the divided reforming layer M2, and the inner surface reforming layer M3 may be formed using different laser heads (not shown).
- the peripheral edge We is removed by holding the peripheral edge We with the pad 180 in the peripheral edge removing device 61, but the removing method is not limited to this.
- the peripheral edge portion We may be removed by applying physical impact or ultrasonic waves.
- the backside wafer Wb1 is separated from the processed wafer W when the overlapping wafer T is transferred from the transfer arm 71 of the wafer transfer device 70 to the chuck 81 of the processing device 80.
- a separating device may be provided in the same device as the peripheral edge removing device 61, or a separating device (not shown) may be provided separately.
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Abstract
Description
60 改質装置
90 制御装置
100 チャック
103 回転部
104 水平移動部
110 レーザヘッド
150 マイクロカメラ
Aa 接合領域
Ab 未接合領域
S 支持ウェハ
T 重合ウェハ
W 処理ウェハ
Claims (14)
- 基板を処理する基板処理装置であって、
第1の基板と第2の基板が接合された重合基板において前記第2の基板を保持する保持部と、
前記第1の基板と第2の基板が接合された接合領域と、当該接合領域の外側の未接合領域との境界を検出する検出部と、
前記保持部に保持された前記第1の基板の内部に、除去対象の周縁部と中央部との境界に沿って周縁用レーザ光を照射して周縁改質層を形成する周縁改質部と、
前記保持部に保持された前記第1の基板の内部に、面方向に沿って内部面用レーザ光を照射して内部面改質層を形成する内部面改質部と、
前記保持部を水平方向に移動させる保持部移動機構と、
前記検出部で検出された検出結果から、前記保持部の中心と前記接合領域の中心の偏心量を算出し、当該偏心量に基づいて、前記保持部の中心と前記接合領域の中心が一致するように、前記保持部移動機構を制御して前記保持部を移動させる偏心補正を行う制御部と、を有し、
前記周縁改質部は、前記偏心補正を行って前記保持部を移動させながら、前記第1の基板の内部に前記周縁用レーザ光を照射し、
前記内部面改質部は、少なくとも前記第1の基板の内部の中心部において、前記偏心補正を行わずに前記内部面用レーザ光を照射する、基板処理装置。 - 前記内部面改質部による前記内部面用レーザ光の照射開始位置は、前記周縁改質層より径方向外側であって、
前記内部面改質部は、前記照射開始位置から径方向内側に向けて、前記偏心補正を行わずに前記内部面用レーザ光を照射する、請求項1に記載の基板処理装置。 - 前記照射開始位置は、前記周縁改質層から径方向外側に前記偏心量以上離間した位置である、請求項2に記載の基板処理装置。
- 前記内部面改質部による前記内部面用レーザ光の照射開始位置は、前記周縁改質層より径方向内側であって、
前記内部面改質部は、
前記第1の基板の内部の外周部において、前記照射開始位置から径方向内側に向けて、前記偏心補正を行って前記保持部を移動させながら前記内部面用レーザ光を照射し、
その後、前記第1の基板の内部の中心部において、前記偏心補正を行わずに前記内部面用レーザ光を照射する、請求項1に記載の基板処理装置。 - 前記周縁改質部と前記内部面改質部は、共通のレーザヘッドを有し、
前記レーザヘッドは、前記周縁用レーザ光と前記内部面用レーザ光を切り換える、請求項1~4のいずれか一項に記載の基板処理装置。 - 前記レーザヘッドを複数有する、請求項5に記載の基板処理装置。
- 前記レーザヘッドは、鉛直方向に昇降自在且つ水平方向に移動自在に構成されている、請求項5又は6に記載の基板処理装置。
- 基板を処理する基板処理方法であって、
第1の基板と第2の基板が接合された重合基板において前記第2の基板を保持部で保持することと、
前記第1の基板と第2の基板が接合された接合領域と、当該接合領域の外側の未接合領域との境界を検出することと、
前記接合領域と前記未接合領域との境界の検出結果から、前記保持部の中心と前記接合領域の中心の偏心量を算出することと、
前記偏心量に基づいて、前記保持部の中心と前記接合領域の中心が一致するように、前記保持部を移動させる偏心補正を行うことと、
周縁改質部から前記保持部に保持された前記第1の基板の内部に、除去対象の周縁部と中央部との境界に沿って周縁用レーザ光を照射して周縁改質層を形成することと、
内部面改質部から前記保持部に保持された前記第1の基板の内部に、面方向に沿って内部面用レーザ光を照射して内部面改質層を形成することと、を有し、
前記周縁改質部は、前記偏心補正を行って前記保持部を移動させながら、前記第1の基板の内部に前記周縁用レーザ光を照射し、
前記内部面改質部は、少なくとも前記第1の基板の内部の中心部において、前記偏心補正を行わずに前記内部面用レーザ光を照射する、基板処理方法。 - 前記内部面改質部による前記内部面用レーザ光の照射開始位置は、前記周縁改質層より径方向外側であって、
前記内部面改質部は、前記照射開始位置から径方向内側に向けて、前記偏心補正を行わずに前記内部面用レーザ光を照射する、請求項8に記載の基板処理方法。 - 前記照射開始位置は、前記周縁改質層から径方向外側に前記偏心量以上離間した位置である、請求項9に記載の基板処理方法。
- 前記内部面改質部による前記内部面用レーザ光の照射開始位置は、前記周縁改質層より径方向内側であって、
前記内部面改質部は、
前記第1の基板の内部の外周部において、前記照射開始位置から径方向内側に向けて、前記偏心補正を行って前記保持部を移動させながら前記内部面用レーザ光を照射し、
その後、前記第1の基板の内部の中心部において、前記偏心補正を行わずに前記内部面用レーザ光を照射する、請求項8に記載の基板処理方法。 - 前記周縁改質部と前記内部面改質部は、共通のレーザヘッドを有し、
前記レーザヘッドは、前記周縁用レーザ光と前記内部面用レーザ光を切り換える、請求項8~11のいずれか一項に記載の基板処理方法。 - 前記レーザヘッドは複数設けられ、
前記周縁改質層を形成する際に、複数の前記レーザヘッドは、前記第1の基板の内部に前記周縁用レーザ光を同時に照射する、請求項12に記載の基板処理方法。 - 前記レーザヘッドは複数設けられ、
前記内部面改質層を形成する際に、複数の前記レーザヘッドは、前記第1の基板の内部に前記内部面用レーザ光を同時に照射する、請求項12に記載の基板処理方法。
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