WO2020124416A1 - Flexible panel and method for manufacturing same - Google Patents

Flexible panel and method for manufacturing same Download PDF

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Publication number
WO2020124416A1
WO2020124416A1 PCT/CN2018/121996 CN2018121996W WO2020124416A1 WO 2020124416 A1 WO2020124416 A1 WO 2020124416A1 CN 2018121996 W CN2018121996 W CN 2018121996W WO 2020124416 A1 WO2020124416 A1 WO 2020124416A1
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WO
WIPO (PCT)
Prior art keywords
flexible panel
rubber
flexible
processed
substrate
Prior art date
Application number
PCT/CN2018/121996
Other languages
French (fr)
Chinese (zh)
Inventor
雷晓华
袁泽
朱林
陈鑫
胡康军
李贺
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to PCT/CN2018/121996 priority Critical patent/WO2020124416A1/en
Priority to CN201880097602.XA priority patent/CN113169189A/en
Publication of WO2020124416A1 publication Critical patent/WO2020124416A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body

Definitions

  • the present application relates to the field of flexible equipment, in particular to a flexible panel and a method of manufacturing the flexible panel.
  • the substrates of flexible sensors, flexible display screens, and flexible wearable devices are subject to deformation under heat and pressure.
  • the substrate is easily deformed during the hot pressing process, resulting in the inability of the electronic devices on the substrate to be effectively connected to the functional elements at the binding area, which affects the functional stability of the flexible panel.
  • the present application provides a method for manufacturing a flexible panel and a flexible panel.
  • the present application provides a method for manufacturing a flexible panel, wherein a substrate is provided, the substrate having a portion to be processed and a flexible portion connected to the portion to be processed;
  • An electronic device is formed on the flexible portion, and a wire connecting the electronic device is formed, the wire extending to the binding area.
  • This application provides a flexible panel prepared by the above method
  • the flexible panel includes a substrate and an electronic device, the substrate is provided with a binding area, the substrate is hardened at the binding area to form a hard part, and the electronic device is fixed to the The substrate, the electronic device and the wire extending to the binding area are connected to the wire.
  • the manufacturing method of the flexible panel and the flexible panel of the present application form a hard part by hardening the substrate at the binding area, and the hard part provides stress reinforcement to the binding area, so that the binding area is not easy to deform and prevent electronic
  • the failure of the connection between the device and the functional element improves the functional stability of the flexible panel.
  • FIG. 1 is a schematic diagram of a flexible panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 3 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
  • FIG. 5 is a schematic perspective view of a flexible panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 7 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
  • FIG. 8 is a perspective schematic view of a flexible panel provided by another embodiment of the present application.
  • FIG. 9 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
  • FIG. 10 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
  • FIG. 11 is a schematic diagram of a manufacturing process of a flexible panel provided by an embodiment of the present application.
  • FIG. 12 is a schematic flowchart of manufacturing a flexible panel provided by an embodiment of the present application.
  • a component when a component is said to be “fixed” to another component, it can be directly on another component or there can also be a centered component. When a component is considered to be “connected” to another component, it can be directly connected to another component or there may be a centered component at the same time.
  • This application provides a flexible panel 100 including a substrate 10 and an electronic device 20.
  • the base material 10 is provided with a binding area 11, and the base material 10 is hardened at the binding area 11 to form a hard portion 12.
  • the electronic device 20 is fixed to the substrate 10 and is located in an area of the substrate 10 outside the binding area 11.
  • the electronic device 20 is connected to the wire 30 extending to the binding area 11.
  • the flexible panel 100 may be a flexible sensor such as a flexible sensor, a flexible display panel, or a flexible touch panel.
  • the flexible panel 100 may be applied to a bendable or stretchable electronic device, and the bendable or stretchable electronic device may be a wearable device such as a mobile phone, a watch, a wristband, or the like.
  • the flexible panel 100 can also be used in bendable or stretchable electronic devices in the fields of monitoring, entertainment interaction, and smart wear.
  • the hard portion 12 is formed by hardening treatment at the binding area 11 of the base material 10, so that the hard portion 12 provides stress reinforcement to the binding area 11, so that the binding area 11 is not easily deformed, preventing the electrical connection of the electronic device 20
  • the wire fails to connect with the functional element in the binding area 11, which improves the functional stability of the flexible panel 100.
  • the substrate 10 is a substrate having flexibility and flexibility or a substrate having elasticity and being stretchable.
  • the base material 10 includes a first short side 13 and a second short side 14 disposed opposite to the first short side 13, and two opposite long sides 15 connected between the first short side 13 and the second short side 14.
  • the base material 10 is also provided with a flexible portion 16 connected to the hard portion 12.
  • the flexible portion 16 occupies a larger area of the base material 10, and the hard portion 12 is substantially connected to the first short side 13.
  • the hard portion 12 may be substantially elongated.
  • the hard portion 12 may extend substantially parallel to the first short side 13.
  • the length of the hard portion 12 is approximately equal to the length of the first short side 13.
  • the hardness of the hard portion 12 is greater than the hardness of the flexible portion 16.
  • the thickness of the flexible portion 16 matches the thickness of the hard portion 12.
  • the thickness of the substrate 10 is approximately 5 ⁇ m to 80 ⁇ m.
  • the flexible portion 16 can be bent and stretched arbitrarily according to requirements to meet the bending and deformation requirements of the base material 10.
  • the hard portion 12 has strong internal stress, and the hard portion 12 is not likely to deform under the action of heat and pressure.
  • the hard portion 12 can provide a more stable connection structure for the binding area 11 to facilitate the connection of the substrate 10 with external devices in the binding area 11, prevent the substrate 10 from failing to connect with external devices in the binding area 11, and improve the flexible panel 100 security.
  • the base material 10 may be a mixture of a polymer material such as rubber, plastic, or organic resin, and a crosslinking agent, a photoinitiator, or a curing agent, which may cause a crosslinking reaction. Part of the base material 10 is subjected to chemical cross-linking treatment or oxidative decomposition, aging, hardening and other treatment methods to form a hard portion 12 with high hardness. That is, the rigid portion 12 and the flexible portion 16 have a stable structure and are not easy to separate, and the rigid portion 12 can effectively provide stress support to the binding area 11 to prevent the binding area 11 from deforming under heat and pressure and prevent the flexible panel 100 from failing .
  • the hard portion 12 may extend substantially in the direction parallel to the long side 15.
  • the base material 10 may be provided with a plurality of hard portions 12 isolated from each other.
  • the shape of the hard portion 12 may also be other shapes such as a circle, a square, or a triangle.
  • the electronic device 20 is a touch electrode, that is, the flexible panel 100 is a flexible touch panel.
  • the flexible panel 100 can be applied to electronic devices such as folding mobile phones, flexible wearable devices, and flexible detection devices that can sense external signals.
  • the electronic device 20 may be composed of a plurality of capacitance sensing units 21.
  • a plurality of capacitive sensing units 21 are arranged in an array on the flexible portion 16.
  • the plurality of capacitive sensing units 21 may be printed on the substrate 10 by a screen printing process.
  • the plurality of capacitive sensing units 21 may move closer to or move away from each other as the flexible portion 16 bends or stretches.
  • the wire 30 includes a plurality of signal lines 31.
  • the signal line 31 is connected to the capacitance sensing unit 21, and one end of the signal line 31 extends to the binding area 11 to facilitate the conduction of the functional element in the binding area 11 to the signal line 31 and the switch connecting line 32, and to obtain multiple capacitance sensing units 21 Sensor signal.
  • the signal line 31 can be bent and stretched along with the flexible portion 16 to facilitate the flexible panel 100 to sense the signal in the bent and stretched deformation state.
  • the signal line 31 located at one end of the binding area 11 constitutes the leading end of the electronic device 20.
  • the hard portion 12 reinforces one end of the signal line 31 located in the binding area 11 to prevent the binding area 11 from being deformed by heat and causing poor contact with the functional element, thereby increasing the functional stability of the flexible panel 100.
  • the flexible panel 100 is a flexible touch panel.
  • a flexible touch display 1000 is provided.
  • the flexible touch display 1000 includes a transparent cover 1001, a flexible panel 100, and a display panel 1002. .
  • the flexible panel 100 is attached between the light-transmitting cover plate 1001 and the display panel 1002.
  • the flexible portion 16 of the flexible panel 100 is substantially aligned with the display area of the display panel 1002, so that the flexible panel 100 can form a virtual key in combination with the display area of the display panel 1002.
  • the binding area 11 of the flexible panel 100 may protrude from the display panel 1002 to facilitate binding with the flexible circuit board 60, so that the flexible touch display 1000 has a touch function.
  • the flexible panel 100 may also be attached to the side of the display panel 1002 facing away from the light-transmitting cover plate 1001, or integrated into the light-transmitting cover plate 1001.
  • the flexible panel 100 can also be applied to wearable devices such as wristbands, watches, straps and the like that need to be provided with a touch function.
  • FIG. 3 is different from the embodiment shown in FIG. 2 in that the flexible panel 100 is a flexible display panel.
  • a flexible display screen 2000 is provided.
  • the flexible display screen 2000 includes a light-transmitting cover plate 2001 and a flexible panel 100.
  • the flexible panel 100 is attached to the light-transmitting cover plate 2001.
  • the flexible panel 100 further includes a display layer 110, and the display layer 110 is attached to the side of the substrate 10 where the electronic device 20 is arranged.
  • the display layer 110 has a plurality of light emitting cells in an array.
  • the electronic device 20 is a driving electrode.
  • the electronic device 20 can drive the plurality of light emitting units of the display layer 110 to emit light.
  • the electronic device 20 may be composed of a plurality of drive units 22 in an array.
  • Each driving unit 22 is directly opposite to each light emitting unit of the display layer 110.
  • Each driving unit 22 may be composed of a thin film crystal diode switch.
  • the flexible portion 16 is substantially aligned with the display area of the display layer 110 to facilitate driving the display area of the display layer 110 through the electronic device 20 to emit light and display an image.
  • the binding area 11 protrudes from the display layer 110 to facilitate binding with the flexible circuit board 60, so that the flexible display screen 2000 can obtain a display signal through the flexible circuit board 60.
  • the flexible panel 100 may also be applied to electronic devices with flexible display functions such as foldable tablet computers, foldable displays, and the like.
  • the binding area 11 is disposed on the hard portion 12.
  • the base material 10 has a first surface 111 and a second surface 112 opposite to the first surface 111.
  • the binding area 11 may be located on the first surface 111.
  • the hard portion 12 may extend toward the second surface 112 via the first surface 111.
  • the hard portion 12 may extend from the first surface 111 to the second surface 112, or may extend to a position at a distance from the second surface 112.
  • the hard portion 12 may also extend from the second surface 112 to a position at a distance from the first surface 111.
  • the base material 10 forms a hard portion 12 after being hardened in an area covering the binding area 11.
  • the hard portion 12 has an upper surface 121 substantially flush with the first surface 111.
  • a wire 30 extending to the binding area 11 may be attached to the upper surface 121, and the hard portion 12 provides a stable connection platform for the wire 30.
  • the hard portion 12 is formed by chemical reaction, and can be integrally formed with the flexible portion 16 of the base material 10 to increase the stability of the flexible panel 100.
  • the binding area 11 occupies a part of the hard portion 12, that is, the orthographic projection of the hard portion 12 on the substrate 10 is greater than the orthographic projection of the binding area 11 on the substrate 10, and the hard portion 12 is in the binding area
  • a support structure with higher hardness is provided in 11 to facilitate the conduction of the wire 30 in the binding area 11 to external devices.
  • the hard portion 12 can still provide a support structure with high hardness for the wire 30 in an area beyond the binding area 11, further enhancing the functional stability of the flexible panel 100.
  • FIG. 6 is different from the embodiment of FIG. 5 in that the hard portion 12 extends from the second surface 112 to the first surface 111 with a distance from the first surface 111. That is, the binding area 11 is at a distance from the hard portion 12. Binding Area 11 The orthographic projection of the binding area 11 on the hard portion 12 is located on the hard portion 12.
  • FIG. 7 is different from the embodiment of FIG. 1 in that a plurality of sub-hard parts 122 arranged at intervals are formed on the peripheral side of the binding area 11.
  • the plurality of inner edges 123 are substantially aligned with the peripheral edge of the binding area 11, and have a plurality of outer edges 124 that are parallel to the peripheral edge of the binding area 11.
  • a plurality of inner edges 123 and a plurality of outer edges 124 are staggered along the circumferential direction of the binding zone 11. That is, the plurality of sub-hard parts 122 form a zigzag structure on the peripheral side of the binding area 11.
  • a plurality of sub-hard parts 122 are arranged on the peripheral side of the binding area 11 to reduce the hardening area of the base material 10 and the cost of hardening and aging of the base material 10 through chemical treatment, and to ensure the hardness of the hard portion 12 so that The functional stability of the flexible panel 100 is improved.
  • FIG. 8 is different from the embodiment shown in FIG. 4 in that a part of the binding area 11 coincides with the hard portion 12.
  • the substrate 10 is provided with a plurality of hard portions 12 arranged at intervals, the binding area 11 covers the hard portions 12, and covers a portion between two adjacent hard portions 12.
  • the hard portion 12 extends substantially straight.
  • the plurality of hard portions 12 are arranged in parallel and equidistant from each other. There is a space 125 between two adjacent hard portions 12.
  • the service life of the base material 10 is ensured, and the base material 10 has a certain hardness in the binding area 11 by using a plurality of hard portions 12, so that the hardness of the base material 10 in the binding area 11 is achieved It can be adjusted as needed to improve the functional stability of the flexible panel 100.
  • the flexible panel 100 further includes a coating 40 that covers the hard portion 12.
  • the coating layer 40 may be applied to the first surface 111, the second surface 112, or the first surface 111 and the second surface 112.
  • the coating layer 40 can increase the hardness of the hard portion 12.
  • the coating layer 40 covers the hard portion 12 and the junction between the hard portion 12 and the flexible portion 16 to ensure the functional stability of the flexible panel 100.
  • the wires 30 may be arranged on the side of the coating 40 facing away from the substrate 10. That is, the wire 30 covers the coating 40.
  • the thickness of the coating layer 40 is relatively thin, and the thickness of the coating layer 40 is smaller than the thickness of the hard portion 12.
  • the thickness difference between the flexible portion 11 and the hard portion 12 of the coating 40 is negligible to ensure the smoothness of the surface of the flexible panel 100.
  • the flexible panel 100 further includes a flexible circuit board 60.
  • a part of the flexible circuit board 60 is fixed to the binding area 11 and connected to the wire 30.
  • the flexible circuit board 60 includes a first end 61 fixedly connected to the base material 10 and a second end 62 disposed opposite to the first end 61.
  • the first end 61 is fixed to the binding area 11.
  • the first end 61 covers the binding area 11.
  • the first end 61 is provided with a plurality of exposed copper.
  • the plurality of exposed copper is connected to the plurality of wires 30 in the bonding area 11, so that the electronic device 20 can be connected to the flexible circuit board 60 via the wires 30.
  • the second end 62 is offset from the substrate 10.
  • the second end 62 may be provided with a connector 621.
  • the connector 621 and the plurality of exposed copper are connected through a copper foil cable, so that the connector 621 can be connected to the electronic device 20 through the wire 30.
  • the electronic device 20 can transmit the sensing signal to the external device via the flexible circuit board 60, so that the flexible panel 100 can send the sensing signal to the outside.
  • the hard portion 12 can be used to strengthen the binding area 11 to ensure that the wires 30 and the first end 61 of the flexible circuit board 60 can be in firm contact with each other to increase the conduction performance.
  • the flexible circuit board 60 is fixed to the binding area 11 via the conductive adhesive 70, and is connected to the wire 30 via the conductive adhesive 70.
  • the conductive adhesive 70 is adhered between the coating layer 40 and the first end 61 of the flexible circuit board 60, so that the flexible circuit board 60 and the substrate 10 are firmly bonded, and the exposed copper of the flexible circuit board 60 and the wire 30 can be effectively guided through.
  • the flexible circuit board 60 and the substrate 10 being firmly connected by the conductive adhesive 70, the flexible circuit board 60, the conductive adhesive 70 and the substrate 10 need to be heated, and the flexible circuit board 60 and the substrate 10 are under a greater pressure
  • the conductive adhesive 70 is squeezed under the action to make the conductive particles in the conductive adhesive 70 conduct up and down, so that the conductive adhesive 70 can exhibit stable adhesion and conduction performance.
  • the hard portion 12 is used to reinforce the binding area 11 and the coating 40 covers the hard portion 12 so that the hardness of the substrate 10 in the binding area 11 increases, and the substrate 10 is not easily deformed in the binding area 11 to reduce flexibility
  • the connection between the circuit board 60 and the base material 10 fails, and the functional stability of the flexible circuit board 100 is improved.
  • this application also provides a method for manufacturing a flexible panel, including the steps of:
  • a base material 10 is provided.
  • the base material 10 has a portion 120 to be processed and a flexible portion 16 connected to the portion 120 to be processed.
  • the base material 10 may be obtained through a cutting process.
  • the base material 10 may have a rectangular shape.
  • the portion to be processed 120 may be located at one end of the substrate 10 in the longitudinal direction.
  • the region to be processed is preset on the portion to be processed 120 to facilitate subsequent processing of the portion to be processed 120.
  • the thickness of the substrate 10 may be 5 ⁇ m to 80 ⁇ m.
  • the portion to be processed 120 is provided integrally with the flexible portion 16.
  • the processing portion 120 is processed to obtain the base material 10 with a certain hardness, thereby improving the functional stability of the flexible panel 100.
  • the substrate 10 is a substrate with flexible properties and elastic properties.
  • the base material 10 mainly includes flexible materials such as natural rubber or synthetic rubber.
  • the preparation material of the base material 10 uses a mixture of a polymer material containing an unsaturated double bond functional group and a cross-linking agent. That is, the raw materials for preparing the base material 10 may include styrene-based elastomer, polyisoprene rubber, polybutadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, polyurethane rubber, chlorohydrin rubber , Acrylic rubber and other natural or synthetic rubber materials.
  • the preparation material of the base material 10 is further mixed with a cross-linking agent.
  • the cross-linking agent may be sulfide, metal oxide, peroxide, fat or aromatic amines, sulfonate, aromatic diol and quaternary phosphonium (ammonium ) Salt and other compounds.
  • the base material 10 includes a mixture containing the above-mentioned natural rubber, synthetic rubber, and cross-linking agent, so that the to-be-processed portion 120 of the base material 10 can be processed by chemical cross-linking reaction.
  • the to-be-processed portion 120 is heated, or immersed in a vulcanization soaking solution to form the hard portion 12, so that the hardness of the formed hard portion 12 can be adjusted as needed, so that the flexible panel 100 meets the use requirements, both Can guarantee a certain hardness, and can meet the bending deformation performance.
  • a binding area 11 can be provided on the hard portion 12 to facilitate the hard portion 12 to enhance the hardness of the binding area 11 and prevent the binding area 11 from being generated under the action of heat and pressure deformation.
  • An electronic device 20 is formed on the flexible portion 16, and a wire 30 connecting the electronic device 20 is formed, and the wire 30 extends to the bonding area 11.
  • the electronic device 20 and the wire 30 may be arranged on the base material 10 by a process such as screen printing.
  • the electronic device 20 may be composed of a plurality of capacitive sensing units 21 arranged in an array.
  • the electronic device 20 is formed at a position where the substrate 10 can be bent or stretched, so that the electronic device 20 can be bent and stretched with the substrate 10.
  • the wire 30 is partially formed on the same side of the base material 10 and the electronic device 20 to electrically connect the electronic device 20 and the bonding area 11.
  • the base material 10 is coated with the conductive adhesive 70 at the binding area 11, and one end of the flexible circuit board 60 is attached to the conductive adhesive 70. Apply a certain squeezing force to the flexible circuit board 60 and the substrate 10, and heat the conductive adhesive 70 to facilitate the conductive adhesive 70 to firmly connect the flexible circuit board 60 and the substrate 10, and to guide the flexible circuit board 60 and the lead 30 through. Since the rigid portion 12 enhances the hardness of the binding area 11, the deformation of the base material 10 is prevented, and the functional stability of the flexible panel 100 is ensured.
  • the substrate 10 is a substrate with flexible properties.
  • the base material 10 mainly includes natural rubber or synthetic rubber.
  • the raw material for preparing the substrate 10 uses a mixture of a polymer material containing an unsaturated double bond functional group and a photoinitiator. That is, the raw materials for preparing the base material 10 may include styrene-based elastomer, polyisoprene rubber, polybutadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, polyurethane rubber, chlorohydrin rubber , Acrylic rubber and other natural or synthetic rubber materials.
  • the raw material for preparing the base material 10 is further mixed with a photoinitiator.
  • the photoinitiator may be a compound such as benzoin and derivatives, benzyls, acylphosphine oxides, benzophenones, thioxanthones, etc. .
  • the substrate 10 includes a mixture containing the above-mentioned natural rubber, synthetic rubber, and photoinitiator, so that the to-be-processed portion 120 of the substrate 10 can be processed by chemical cross-linking reaction.
  • the portion to be processed 120 is irradiated with light such as ultraviolet light, electron beams, etc., so that the portion to be processed 120 is chemically cross-linked, that is, the molecules inside the portion to be processed 120 generate a chemical cross-linking reaction, and hardened to form a hard ⁇ 12 ⁇ Quality 12.
  • the hardness of the hard portion 12 can be adjusted according to needs, so that the flexible panel 100 meets the use requirements, which can not only ensure a certain hardness, but also satisfy the bending deformation performance.
  • the main material of the substrate 10 is a flexible polymer material containing active hydrogen.
  • the base material 10 mainly includes flexible polymer materials containing active hydrogen functional groups such as amino groups, hydroxyl groups, and carboxyl groups.
  • the preparation material of the base material 10 is a mixture of a flexible polymer material containing active hydrogen and a high-temperature curing agent. That is, the raw materials for preparing the substrate 10 may include thermoplastic elastomers such as polyurethane elastomer, silicone rubber, urethane rubber, chlorohydrin rubber, and acrylic rubber, and synthetic resin rubber materials.
  • the preparation material of the base material 10 is further mixed with a high-temperature curing agent, which may be a blocked isocyanate such as phenol-blocked polyisocyanate, caprolactam-blocked polyisocyanate, butanone-blocked polyisocyanate, hydroxy resin, carboxyl-terminated resin, etc. , Acrylic resin, epoxy resin and other active functional resin compounds.
  • a high-temperature curing agent which may be a blocked isocyanate such as phenol-blocked polyisocyanate, caprolactam-blocked polyisocyanate, butanone-blocked polyisocyanate, hydroxy resin, carboxyl-terminated resin, etc. , Acrylic resin, epoxy resin and other active functional resin compounds.
  • the base material 10 includes a mixture of a flexible polymer material containing active hydrogen and a high-temperature curing agent, so that the to-be-processed portion 120 of the base material 10 can be processed by chemical cross-linking reaction.
  • step 102 the portion to be processed 120 is subjected to chemical hardening by heating, infrared light radiation, etc., so that the portion to be processed 120 is chemically cross-linked, that is, the molecules inside the portion to be processed 120 undergo chemical cross-linking reactions to harden to form hard Department 12.
  • the hardness of the hard portion 12 can be adjusted according to needs, so that the flexible panel 100 meets the use requirements, which can not only ensure a certain hardness, but also satisfy the bending deformation performance.
  • the substrate 10 is a substrate having flexible properties and elastic properties.
  • the main material of the base material 10 is a polymer material such as synthetic rubber, thermal plastic, or elastic plastic.
  • polymer materials such as polyurethane, silicone, natural rubber, ethylene-propylene rubber, styrene-butadiene rubber, butyl rubber, and silicone rubber can be used.
  • the base material 10 includes a polymer material containing synthetic rubber, thermal plastic, or elastic plastic, so that the to-be-processed portion 120 of the base material 10 can be molecularly cleaved to generate free radicals, and then the main chain is broken and cross-linked. An oxidative decomposition reaction of the organic group of the side chain occurs to realize the chemical reaction hardening treatment.
  • step 102 Before step 102, it includes a step of performing aging and hardening treatment on the processing part 120.
  • a chemical environment such as light, heat, ultraviolet high-energy radiation, ozone, acid, alkali, etc.
  • the molecular chain of the to-be-processed portion 120 is broken to facilitate subsequent chemical treatment of the to-be-processed portion 120 , To reduce the chemical processing time of the to-be-processed part 120 and reduce the manufacturing cost.
  • step 102 chemical processing is performed on the to-be-processed portion 120 by heating, UV light, chemical immersion, etc., so that the polymer in the to-be-processed portion 10 undergoes oxidative decomposition reaction or carbonization, resulting in the hard-to-be-processed portion 120 being hardened to form hard Department 12.
  • the hardness of the hard portion 12 can be adjusted according to needs, so that the flexible panel 100 meets the use requirements, which can not only ensure a certain hardness, but also satisfy the bending deformation performance.
  • the method further includes the step of applying a coating layer 40 to the hard portion 12 of the base material 10.
  • the coating layer 40 may be formed on one side or opposite sides of the substrate 10 by a printing process.
  • the coating 40 can increase the hardness of the flexible panel 100. Since the base material 10 is chemically processed to form the hard portion 12, in order to ensure that the reliability of the base material 10 at the hard portion 12 meets the requirements, the coating 40 covers the hard portion 12, and covers the hard portion 12 and the flexible portion 16 At the junction, to ensure the functional stability of the flexible panel 100.
  • the wires 30 may be arranged on the side of the coating 40 facing away from the substrate 10.
  • the substrate is hardened at the binding area to form a hard part, and the hard part provides stress reinforcement to the binding area, so that the binding area is not easily deformed, preventing the failure of the electronic device to connect the functional element in the binding area and improving The functional stability of the performance of the flexible panel.

Abstract

The present application provides a flexible panel and a method for manufacturing same. The flexible panel (100) comprises a substrate (10) and an electronic device (20). The substrate (10) is provided with a binding area (11). The part of the substrate (10) connected to the binding area (11) is hardened to form a hard part (12). The electronic device (20) is fixed to the substrate (10). The electronic device (20) is connected to a wire (30) extending to the binding area (11). The hard part (12) provides stress reinforcement to the binding area (11), so that the binding area (11) is not easily deformed, preventing the failure of connection between the wire (30) connecting the electronic device (20) and a functional element at the binding area (11), thereby improving the function stability of the flexible panel (100).

Description

柔性面板及柔性面板制作方法Flexible panel and manufacturing method of flexible panel 技术领域Technical field
本申请涉及柔性设备领域，具体涉及一种柔性面板及柔性面板制作方法。The present application relates to the field of flexible equipment, in particular to a flexible panel and a method of manufacturing the flexible panel.
背景技术Background technique
目前柔性传感器、柔性显示屏、柔性可穿戴器件的基材在受热、受压作用下，容易产生变形。比如，基材在热压过程中，容易引起变形，导致基材上的电子器件在绑定区处与功能元件无法有效的连接，导致影响柔性面板的功能稳定性。At present, the substrates of flexible sensors, flexible display screens, and flexible wearable devices are subject to deformation under heat and pressure. For example, the substrate is easily deformed during the hot pressing process, resulting in the inability of the electronic devices on the substrate to be effectively connected to the functional elements at the binding area, which affects the functional stability of the flexible panel.
发明内容Summary of the invention
本申请提供一种柔性面板制作方法及柔性面板。The present application provides a method for manufacturing a flexible panel and a flexible panel.
本申请提供一种柔性面板制作方法，其中，提供基材，所述基材具有待加工部和与所述待加工部连接的柔性部；The present application provides a method for manufacturing a flexible panel, wherein a substrate is provided, the substrate having a portion to be processed and a flexible portion connected to the portion to be processed;
对所述待加工部进行硬化加工，以使所述待加工部形成具有绑定区的硬质部；Hardening the part to be processed so that the part to be processed forms a hard part with a binding area;
在所述柔性部上形成电子器件，并形成连接所述电子器件的导线，所述导线延伸至所述绑定区。An electronic device is formed on the flexible portion, and a wire connecting the electronic device is formed, the wire extending to the binding area.
本申请提供一种利用上述方法制备的柔性面板；This application provides a flexible panel prepared by the above method;
其中，所述柔性面板包括基材和电子器件，所述基材设有绑定区，所述基材在所述绑定区处经硬化处理形成硬质部，所述电子器件固定于所述基材，所述电子器件与延伸至所述绑定区的导线连接导线。Wherein, the flexible panel includes a substrate and an electronic device, the substrate is provided with a binding area, the substrate is hardened at the binding area to form a hard part, and the electronic device is fixed to the The substrate, the electronic device and the wire extending to the binding area are connected to the wire.
本申请的柔性面板的制作方法及柔性面板，通过基材在绑定区处经硬化处理形成硬质部，硬质部对绑定区提供应力补强，使得绑定区不易产生变形，防止电子器件与功能元件连接失效，提高了柔性面板的功能稳定性。The manufacturing method of the flexible panel and the flexible panel of the present application form a hard part by hardening the substrate at the binding area, and the hard part provides stress reinforcement to the binding area, so that the binding area is not easy to deform and prevent electronic The failure of the connection between the device and the functional element improves the functional stability of the flexible panel.
附图说明BRIEF DESCRIPTION
图1是本申请实施例提供的柔性面板的示意图。FIG. 1 is a schematic diagram of a flexible panel provided by an embodiment of the present application.
图2是本申请另一实施例提供的柔性面板的示意图。2 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
图3是本申请另一实施例提供的柔性面板的示意图。3 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
图4是本申请实施例提供的柔性面板的截面示意图。4 is a schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
图5是本申请实施例提供的柔性面板的立体示意图。5 is a schematic perspective view of a flexible panel provided by an embodiment of the present application.
图6是本申请另一实施例提供的柔性面板的示意图。6 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
图7是本申请另一实施例提供的柔性面板的示意图。7 is a schematic diagram of a flexible panel provided by another embodiment of the present application.
图8是本申请另一实施例提供的柔性面板的立体示意图。8 is a perspective schematic view of a flexible panel provided by another embodiment of the present application.
图9是本申请实施例提供的柔性面板的另一截面示意图。9 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
图10是本申请实施例提供的柔性面板的另一截面示意图。10 is another schematic cross-sectional view of a flexible panel provided by an embodiment of the present application.
图11是本申请实施例提供的柔性面板制作的加工示意图。FIG. 11 is a schematic diagram of a manufacturing process of a flexible panel provided by an embodiment of the present application.
图12是本申请实施例提供的柔性面板制作的流程示意图。FIG. 12 is a schematic flowchart of manufacturing a flexible panel provided by an embodiment of the present application.
具体实施例Specific examples
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be described clearly below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present invention.
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。It should be noted that when a component is said to be "fixed" to another component, it can be directly on another component or there can also be a centered component. When a component is considered to be "connected" to another component, it can be directly connected to another component or there may be a centered component at the same time.
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terminology used in the description of the present invention herein is for the purpose of describing specific embodiments, and is not intended to limit the present invention. The term "and/or" as used herein includes any and all combinations of one or more related listed items.
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。The following describes some embodiments of the present invention in detail with reference to the accompanying drawings. In the case of no conflict, the following embodiments and the features in the embodiments can be combined with each other.
请一并参阅图1，本申请提供一种柔性面板100包括基材10和电子器件20。基材10设有绑定区11，基材10在绑定区11处硬化处理形成硬质部12。电子器件20固定于基材10，并位于基材10在绑定区11之外的区域，电子器件20与延伸至绑定区11的导线30连接。可以理解的是，柔性面板100可以是柔性传感器、或柔性显示面板、或柔性触摸面板等柔性面板。柔性面板100可以应用于可弯曲或可拉伸的电子设备中，可弯曲或可拉伸的电子设备可以是手机、手表、护腕等可穿戴设备。柔性面板100还可以用于检测监测、娱乐交互和智能穿戴等领域的可弯曲或可拉伸电子设备中。Please refer to FIG. 1 together. This application provides a flexible panel 100 including a substrate 10 and an electronic device 20. The base material 10 is provided with a binding area 11, and the base material 10 is hardened at the binding area 11 to form a hard portion 12. The electronic device 20 is fixed to the substrate 10 and is located in an area of the substrate 10 outside the binding area 11. The electronic device 20 is connected to the wire 30 extending to the binding area 11. It can be understood that the flexible panel 100 may be a flexible sensor such as a flexible sensor, a flexible display panel, or a flexible touch panel. The flexible panel 100 may be applied to a bendable or stretchable electronic device, and the bendable or stretchable electronic device may be a wearable device such as a mobile phone, a watch, a wristband, or the like. The flexible panel 100 can also be used in bendable or stretchable electronic devices in the fields of monitoring, entertainment interaction, and smart wear.
通过在基材10的绑定区11处硬化处理形成硬质部12，使硬质部12对绑定区11提供应力补强，使得绑定区11不易产生变形，防止电连接电子器件20的导线在绑定区11与功能元件连接失效，提高了柔性面板100功能稳定性。The hard portion 12 is formed by hardening treatment at the binding area 11 of the base material 10, so that the hard portion 12 provides stress reinforcement to the binding area 11, so that the binding area 11 is not easily deformed, preventing the electrical connection of the electronic device 20 The wire fails to connect with the functional element in the binding area 11, which improves the functional stability of the flexible panel 100.
本实施方式中，基材10为具有柔性性能可弯曲的基材或具有弹性性能可拉伸的基材。基材10包括第一短边13和相对第一短边13设置的第二短边14，以及连接于第一短边13和第二短边14之间的两个相对的长边15。基材10还设有与硬质部12相连接的柔性部16。柔性部16占据基材10较大的面积，硬质部12大致连接于第一短边13。硬质部12可以大致呈长条状。硬质部12可以大致沿平行第一短边13延伸。硬质部12的长度大致与第一短边13的长度相等。硬质部12的硬度大于柔性部16的硬度。柔性部16的厚度与硬质部12的厚度一致。基材10的厚度大致为5μm～80μm。柔性部16可以根据需求任意弯曲和拉伸，以满足基材10的弯曲、变形要求。硬质部12具有较强的内应力，硬质部12在受热、受压作用下，不易产生变形。硬质部12可以为绑定区11提供较稳固的连接结构，以方便基材10在绑定区11与外部器件连接，防止基材10在绑定区11与外部器件连接失效，提高柔性面板100的安全性。基材10可以是橡胶、塑胶、或有机树脂等高分子材料与交联剂、光引发剂、或固化剂等可产生交联反应的材料的混合物。基材10的局部经化学交联处理、或者是经氧化分解、老化、硬化等处理方式形成硬度较高的硬质部12。即硬质部12与柔性部16结构稳固，不易分离，而且硬质部12可以有效对绑定区11提供应力支撑，防止绑定区 11在受热受压情况下产生形变，防止柔性面板100失效。当然，在其他实施方式中，硬质部12也可以大致沿平行长边15的方向延伸。基材10也可以设有多个硬质部12相互隔离。硬质部12的形状还可以是圆形或方形或三角形的其他形状。In the present embodiment, the substrate 10 is a substrate having flexibility and flexibility or a substrate having elasticity and being stretchable. The base material 10 includes a first short side 13 and a second short side 14 disposed opposite to the first short side 13, and two opposite long sides 15 connected between the first short side 13 and the second short side 14. The base material 10 is also provided with a flexible portion 16 connected to the hard portion 12. The flexible portion 16 occupies a larger area of the base material 10, and the hard portion 12 is substantially connected to the first short side 13. The hard portion 12 may be substantially elongated. The hard portion 12 may extend substantially parallel to the first short side 13. The length of the hard portion 12 is approximately equal to the length of the first short side 13. The hardness of the hard portion 12 is greater than the hardness of the flexible portion 16. The thickness of the flexible portion 16 matches the thickness of the hard portion 12. The thickness of the substrate 10 is approximately 5 μm to 80 μm. The flexible portion 16 can be bent and stretched arbitrarily according to requirements to meet the bending and deformation requirements of the base material 10. The hard portion 12 has strong internal stress, and the hard portion 12 is not likely to deform under the action of heat and pressure. The hard portion 12 can provide a more stable connection structure for the binding area 11 to facilitate the connection of the substrate 10 with external devices in the binding area 11, prevent the substrate 10 from failing to connect with external devices in the binding area 11, and improve the flexible panel 100 security. The base material 10 may be a mixture of a polymer material such as rubber, plastic, or organic resin, and a crosslinking agent, a photoinitiator, or a curing agent, which may cause a crosslinking reaction. Part of the base material 10 is subjected to chemical cross-linking treatment or oxidative decomposition, aging, hardening and other treatment methods to form a hard portion 12 with high hardness. That is, the rigid portion 12 and the flexible portion 16 have a stable structure and are not easy to separate, and the rigid portion 12 can effectively provide stress support to the binding area 11 to prevent the binding area 11 from deforming under heat and pressure and prevent the flexible panel 100 from failing . Of course, in other embodiments, the hard portion 12 may extend substantially in the direction parallel to the long side 15. The base material 10 may be provided with a plurality of hard portions 12 isolated from each other. The shape of the hard portion 12 may also be other shapes such as a circle, a square, or a triangle.
本实施方式中，电子器件20为触控电极，即柔性面板100为柔性触控面板。柔性面板100可以应用于可感应外部信号的折叠手机、柔性可穿戴设备、柔性检测设备等电子设备。作为一种实施方式，电子器件20可以是由多个电容感应单元21构成。多个电容感应单元21在柔性部16上阵列排布。多个电容感应单元21可以是丝网印刷工艺印刷于基材10上。多个电容感应单元21可以随柔性部16弯曲或拉伸而相互靠拢或相互远离。导线30包括多条信号线31。信号线31连接电容感应单元21，信号线31的一端延伸至绑定区11以方便功能元件在绑定区11与信号线31和开关连接线32导通，并实现获取多个电容感应单元21的感应信号。信号线31可以随柔性部16弯曲、拉伸，以方便柔性面板100在弯曲、拉伸形变状态下可以感应信号。信号线31位于绑定区11的一端构成电子器件20的引导端。硬质部12对位于绑定区11的信号线31一端补强，防止绑定区11受热变形而导致与功能元件接触不良，增加柔性面板100功能稳定性。In this embodiment, the electronic device 20 is a touch electrode, that is, the flexible panel 100 is a flexible touch panel. The flexible panel 100 can be applied to electronic devices such as folding mobile phones, flexible wearable devices, and flexible detection devices that can sense external signals. As an embodiment, the electronic device 20 may be composed of a plurality of capacitance sensing units 21. A plurality of capacitive sensing units 21 are arranged in an array on the flexible portion 16. The plurality of capacitive sensing units 21 may be printed on the substrate 10 by a screen printing process. The plurality of capacitive sensing units 21 may move closer to or move away from each other as the flexible portion 16 bends or stretches. The wire 30 includes a plurality of signal lines 31. The signal line 31 is connected to the capacitance sensing unit 21, and one end of the signal line 31 extends to the binding area 11 to facilitate the conduction of the functional element in the binding area 11 to the signal line 31 and the switch connecting line 32, and to obtain multiple capacitance sensing units 21 Sensor signal. The signal line 31 can be bent and stretched along with the flexible portion 16 to facilitate the flexible panel 100 to sense the signal in the bent and stretched deformation state. The signal line 31 located at one end of the binding area 11 constitutes the leading end of the electronic device 20. The hard portion 12 reinforces one end of the signal line 31 located in the binding area 11 to prevent the binding area 11 from being deformed by heat and causing poor contact with the functional element, thereby increasing the functional stability of the flexible panel 100.
本实施方式中，所述柔性面板100为柔性触控面板，如图2所示，提供一种柔性触摸显示屏1000，柔性触摸显示屏1000包括透光盖板1001、柔性面板100和显示面板1002。所述柔性面板100贴合于所述透光盖板1001和所述显示面板1002之间。所述柔性面板100的柔性部16大致与所述显示面板1002的显示区域相对齐，以使得所述柔性面板100可以结合所述显示面板1002的显示区域形成虚拟按键。所述柔性面板100的绑定区11可以相对显示面板1002凸出，方便与柔性电路板60绑定，以使得所述柔性触摸显示屏1000具有触控功能。当然，在其他实施方式中，所述柔性面板100还可以贴合于显示面板1002背离透光盖板1001一侧，或者是集成于透光盖板1001。当然，所述柔性面板100也可以应用于护腕、手表、绑带等具有需要设置触控功能的可穿戴设备。In this embodiment, the flexible panel 100 is a flexible touch panel. As shown in FIG. 2, a flexible touch display 1000 is provided. The flexible touch display 1000 includes a transparent cover 1001, a flexible panel 100, and a display panel 1002. . The flexible panel 100 is attached between the light-transmitting cover plate 1001 and the display panel 1002. The flexible portion 16 of the flexible panel 100 is substantially aligned with the display area of the display panel 1002, so that the flexible panel 100 can form a virtual key in combination with the display area of the display panel 1002. The binding area 11 of the flexible panel 100 may protrude from the display panel 1002 to facilitate binding with the flexible circuit board 60, so that the flexible touch display 1000 has a touch function. Of course, in other embodiments, the flexible panel 100 may also be attached to the side of the display panel 1002 facing away from the light-transmitting cover plate 1001, or integrated into the light-transmitting cover plate 1001. Of course, the flexible panel 100 can also be applied to wearable devices such as wristbands, watches, straps and the like that need to be provided with a touch function.
在另一个实施例中，请参阅图3，与图2所示实施例不同的是，所述柔性面板100为柔性显示面板。提供了一种柔性显示屏2000，柔性显示屏2000包括透光盖板2001和柔性面板100。柔性面板100贴合于所述透光盖板2001，柔性面板100还包括显示层110，显示层110贴合于所述基材10排布所述电子器件20一侧。显示层110具有阵列的多个发光单元。电子器件20为驱动电极。电子器件20可以驱动所述显示层110的多个发光单元发光。电子器件20可以由阵列的多个驱动单元22构成。每一驱动单元22与显示层110的每一发光单元正对。每一驱动单元22可以由薄膜晶体二极管开关构成。柔性部16与显示层110的显示区域大致对齐，以方便通过电子器件20驱动显示层110的显示区域发光显示图像。绑定区11相对显示层110凸出，方便与柔性电路板60绑定，以使得柔性显示屏2000可以经柔性电路板60获取显示信号。当然，在其他实施方式中，柔性面板100也可以是应用于可折叠平板电脑、可折叠显示器等具有柔性显示功能的电子设备中。In another embodiment, please refer to FIG. 3, which is different from the embodiment shown in FIG. 2 in that the flexible panel 100 is a flexible display panel. A flexible display screen 2000 is provided. The flexible display screen 2000 includes a light-transmitting cover plate 2001 and a flexible panel 100. The flexible panel 100 is attached to the light-transmitting cover plate 2001. The flexible panel 100 further includes a display layer 110, and the display layer 110 is attached to the side of the substrate 10 where the electronic device 20 is arranged. The display layer 110 has a plurality of light emitting cells in an array. The electronic device 20 is a driving electrode. The electronic device 20 can drive the plurality of light emitting units of the display layer 110 to emit light. The electronic device 20 may be composed of a plurality of drive units 22 in an array. Each driving unit 22 is directly opposite to each light emitting unit of the display layer 110. Each driving unit 22 may be composed of a thin film crystal diode switch. The flexible portion 16 is substantially aligned with the display area of the display layer 110 to facilitate driving the display area of the display layer 110 through the electronic device 20 to emit light and display an image. The binding area 11 protrudes from the display layer 110 to facilitate binding with the flexible circuit board 60, so that the flexible display screen 2000 can obtain a display signal through the flexible circuit board 60. Of course, in other embodiments, the flexible panel 100 may also be applied to electronic devices with flexible display functions such as foldable tablet computers, foldable displays, and the like.
进一步地，请参阅图4和图5，绑定区11设置于硬质部12。Further, referring to FIGS. 4 and 5, the binding area 11 is disposed on the hard portion 12.
本实施方式中，基材10具有第一表面111和相对第一表面111的第二表面112。绑定区11可以位于第一表面111。硬质部12可以是经第一表面111向第二表面112延伸。硬质部12可以是由第一表面111延伸至第二表面112，也可以是延伸至与第二表面112存在一 定距离的位置。硬质部12还可以是由第二表面112延伸至与第一表面111存在一定距离的位置。基材10在覆盖绑定区11的区域经硬化处理后形成硬质部12。硬质部12具有大致与第一表面111平齐的上表面121。上表面121上可以附设延伸至绑定区11的导线30，硬质部12为导线30提供稳固连接平台。硬质部12经化学反应成型，可以与基材10的柔性部16一体成型，以增加柔性面板100的稳固性。In this embodiment, the base material 10 has a first surface 111 and a second surface 112 opposite to the first surface 111. The binding area 11 may be located on the first surface 111. The hard portion 12 may extend toward the second surface 112 via the first surface 111. The hard portion 12 may extend from the first surface 111 to the second surface 112, or may extend to a position at a distance from the second surface 112. The hard portion 12 may also extend from the second surface 112 to a position at a distance from the first surface 111. The base material 10 forms a hard portion 12 after being hardened in an area covering the binding area 11. The hard portion 12 has an upper surface 121 substantially flush with the first surface 111. A wire 30 extending to the binding area 11 may be attached to the upper surface 121, and the hard portion 12 provides a stable connection platform for the wire 30. The hard portion 12 is formed by chemical reaction, and can be integrally formed with the flexible portion 16 of the base material 10 to increase the stability of the flexible panel 100.
在一个实施例中绑定区11占据硬质部12的一部分，即硬质部12在基材10的正投影大于绑定区11在基材10的正投影，硬质部12在绑定区11内提供硬度较高的支撑结构，以方便绑定区11内的导线30与外部器件导通。硬质部12在超出绑定区11之外的区域仍然可以为导线30提供硬度较高的支撑结构，进一步增强柔性面板100的功能稳定性。In one embodiment, the binding area 11 occupies a part of the hard portion 12, that is, the orthographic projection of the hard portion 12 on the substrate 10 is greater than the orthographic projection of the binding area 11 on the substrate 10, and the hard portion 12 is in the binding area A support structure with higher hardness is provided in 11 to facilitate the conduction of the wire 30 in the binding area 11 to external devices. The hard portion 12 can still provide a support structure with high hardness for the wire 30 in an area beyond the binding area 11, further enhancing the functional stability of the flexible panel 100.
在另一个实施例中，请参阅图6，与图5的实施例不同之处在于，硬质部12由第二表面112延伸至与第一表面111，并与第一表面111存在间距。即绑定区11，距离硬质部12存在间距。绑定区11绑定区11在硬质部12的正投影位于硬质部12上。In another embodiment, please refer to FIG. 6, which is different from the embodiment of FIG. 5 in that the hard portion 12 extends from the second surface 112 to the first surface 111 with a distance from the first surface 111. That is, the binding area 11 is at a distance from the hard portion 12. Binding Area 11 The orthographic projection of the binding area 11 on the hard portion 12 is located on the hard portion 12.
在另一个实施例中，请参阅图7，与图1的实施例不同之处在于，在绑定区11周侧形成多个间隔排布的子硬质部122。多条内边缘123大致与绑定区11的周侧边缘对齐，以及具有多条外边缘124，多条外边缘124与绑定区11的周侧边缘相平行。多条内边缘123和多条外边缘124沿绑定区11的周向交错排布。即多个子硬质部122在绑定区11的周侧形成锯齿状结构。多个子硬质部122排布于绑定区11周侧，以减小基材10的硬化面积，减少基材10经化学处理硬化、老化的成本，并保证硬质部12的硬度，以使柔性面板100的功能稳定性提高。In another embodiment, please refer to FIG. 7, which is different from the embodiment of FIG. 1 in that a plurality of sub-hard parts 122 arranged at intervals are formed on the peripheral side of the binding area 11. The plurality of inner edges 123 are substantially aligned with the peripheral edge of the binding area 11, and have a plurality of outer edges 124 that are parallel to the peripheral edge of the binding area 11. A plurality of inner edges 123 and a plurality of outer edges 124 are staggered along the circumferential direction of the binding zone 11. That is, the plurality of sub-hard parts 122 form a zigzag structure on the peripheral side of the binding area 11. A plurality of sub-hard parts 122 are arranged on the peripheral side of the binding area 11 to reduce the hardening area of the base material 10 and the cost of hardening and aging of the base material 10 through chemical treatment, and to ensure the hardness of the hard portion 12 so that The functional stability of the flexible panel 100 is improved.
在另一个实施方式中，请参阅图8，与图4所示实施例不同的是，绑定区11的一部分与硬质部12相重合。基材10设有多条间隔排布的硬质部12，绑定区11覆盖硬质部12，以及覆盖相邻两个硬质部12之间的部分。硬质部12大致沿直线延伸。多个硬质部12相互平行等距排列。相邻两个硬质部12之间存在间隔部125。通过在基材10上设置掩膜版，利用掩膜版对基材10的特定区域进行化学处理，形成多个硬质部12。通过减少基材10的硬化面积，保证了基材10的使用寿命，并且利用多个硬质部12使基材10在绑定区11具有一定硬度，实现基材10在绑定区11的硬度可以根据需要进行调整，以提高柔性面板100的功能稳定性。In another embodiment, please refer to FIG. 8, which is different from the embodiment shown in FIG. 4 in that a part of the binding area 11 coincides with the hard portion 12. The substrate 10 is provided with a plurality of hard portions 12 arranged at intervals, the binding area 11 covers the hard portions 12, and covers a portion between two adjacent hard portions 12. The hard portion 12 extends substantially straight. The plurality of hard portions 12 are arranged in parallel and equidistant from each other. There is a space 125 between two adjacent hard portions 12. By providing a mask plate on the base material 10, a specific area of the base material 10 is chemically treated with the mask plate to form a plurality of hard portions 12. By reducing the hardening area of the base material 10, the service life of the base material 10 is ensured, and the base material 10 has a certain hardness in the binding area 11 by using a plurality of hard portions 12, so that the hardness of the base material 10 in the binding area 11 is achieved It can be adjusted as needed to improve the functional stability of the flexible panel 100.
进一步地，请参阅图9，柔性面板100还包括涂层40，涂层40覆盖硬质部12。涂层40可以涂布于第一表面111，也可以涂布于第二表面112，还可以是涂布于第一表面111和第二表面112。涂层40可以增加硬质部12的硬度。为了保证基材10在硬质部12处的可靠性满足要求，涂层40覆盖硬质部12，并覆盖硬质部12与柔性部16的交界处，以保证柔性面板100的功能稳定性。导线30可以排布于涂层40背离基材10一侧。即导线30覆盖于涂层40上。涂层40厚度较薄，涂层40的厚度小于硬质部12的厚度，涂层40在柔性部11与硬质部12的厚度差可以忽略不计，以保证柔性面板100的表面平整性能。Further, referring to FIG. 9, the flexible panel 100 further includes a coating 40 that covers the hard portion 12. The coating layer 40 may be applied to the first surface 111, the second surface 112, or the first surface 111 and the second surface 112. The coating layer 40 can increase the hardness of the hard portion 12. In order to ensure that the reliability of the base material 10 at the hard portion 12 meets the requirements, the coating layer 40 covers the hard portion 12 and the junction between the hard portion 12 and the flexible portion 16 to ensure the functional stability of the flexible panel 100. The wires 30 may be arranged on the side of the coating 40 facing away from the substrate 10. That is, the wire 30 covers the coating 40. The thickness of the coating layer 40 is relatively thin, and the thickness of the coating layer 40 is smaller than the thickness of the hard portion 12. The thickness difference between the flexible portion 11 and the hard portion 12 of the coating 40 is negligible to ensure the smoothness of the surface of the flexible panel 100.
进一步地，请参阅图10，柔性面板100还包括柔性电路板60，柔性电路板60的一部分固定于绑定区11，并与导线30连接。Further, referring to FIG. 10, the flexible panel 100 further includes a flexible circuit board 60. A part of the flexible circuit board 60 is fixed to the binding area 11 and connected to the wire 30.
本实施方式中，柔性电路板60包括固定连接基材10的第一端61和相对第一端61设置的第二端62。第一端61固定于绑定区11。第一端61覆盖绑定区11。第一端61设置有 多个露铜。多个露铜在绑定区11与多条导线30连接，以使得电子器件20可以经导线30与柔性电路板60导通。第二端62与基材10相错开。第二端62可以设有连接器621。连接器621与多个露铜经铜箔线缆导通，以使得连接器621可以经导线30与电子器件20导通。在连接器621与外部器件连接时，电子器件20可以将感应信号经柔性电路板60传送至外部器件，以使得柔性面板100可以对外发送感应信号。利用硬质部12可以对绑定区11进行强化，以保证与绑定区11的导线30与柔性电路板60的第一端61可以稳固接触，以增加导通性能。In this embodiment, the flexible circuit board 60 includes a first end 61 fixedly connected to the base material 10 and a second end 62 disposed opposite to the first end 61. The first end 61 is fixed to the binding area 11. The first end 61 covers the binding area 11. The first end 61 is provided with a plurality of exposed copper. The plurality of exposed copper is connected to the plurality of wires 30 in the bonding area 11, so that the electronic device 20 can be connected to the flexible circuit board 60 via the wires 30. The second end 62 is offset from the substrate 10. The second end 62 may be provided with a connector 621. The connector 621 and the plurality of exposed copper are connected through a copper foil cable, so that the connector 621 can be connected to the electronic device 20 through the wire 30. When the connector 621 is connected to an external device, the electronic device 20 can transmit the sensing signal to the external device via the flexible circuit board 60, so that the flexible panel 100 can send the sensing signal to the outside. The hard portion 12 can be used to strengthen the binding area 11 to ensure that the wires 30 and the first end 61 of the flexible circuit board 60 can be in firm contact with each other to increase the conduction performance.
柔性电路板60经导电胶70固定于绑定区11，并经导电胶70与导线30导通。导电胶70粘接于涂层40与柔性电路板60的第一端61之间，使得柔性电路板60与基材10粘接稳固，以及使得柔性电路板60的露铜与导线30可有效导通。在柔性电路板60与基材10经导电胶70稳固连接的过程中，需要对柔性电路板60、导电胶70和基材10进行加热，并使得柔性电路板60和基材10在较大压力作用下进行挤压导电胶70，使得导电胶70内的导电粒子上下导通，以使得导电胶70可以呈现稳固粘接和导通性能。利用硬质部12对绑定区11补强，以及涂层40覆盖硬质部12，使得基材10在绑定区11硬度增加，基材10在绑定区11处不易变形，减小柔性电路板60与基材10连接失效，提高柔性电路板100的功能稳定性。The flexible circuit board 60 is fixed to the binding area 11 via the conductive adhesive 70, and is connected to the wire 30 via the conductive adhesive 70. The conductive adhesive 70 is adhered between the coating layer 40 and the first end 61 of the flexible circuit board 60, so that the flexible circuit board 60 and the substrate 10 are firmly bonded, and the exposed copper of the flexible circuit board 60 and the wire 30 can be effectively guided through. In the process of the flexible circuit board 60 and the substrate 10 being firmly connected by the conductive adhesive 70, the flexible circuit board 60, the conductive adhesive 70 and the substrate 10 need to be heated, and the flexible circuit board 60 and the substrate 10 are under a greater pressure The conductive adhesive 70 is squeezed under the action to make the conductive particles in the conductive adhesive 70 conduct up and down, so that the conductive adhesive 70 can exhibit stable adhesion and conduction performance. The hard portion 12 is used to reinforce the binding area 11 and the coating 40 covers the hard portion 12 so that the hardness of the substrate 10 in the binding area 11 increases, and the substrate 10 is not easily deformed in the binding area 11 to reduce flexibility The connection between the circuit board 60 and the base material 10 fails, and the functional stability of the flexible circuit board 100 is improved.
请参阅图11和图12，本申请还提供一种柔性面板制作方法，包括步骤：Please refer to FIG. 11 and FIG. 12, this application also provides a method for manufacturing a flexible panel, including the steps of:
101：提供基材10，基材10具有待加工部120和与待加工部120连接的柔性部16。101: A base material 10 is provided. The base material 10 has a portion 120 to be processed and a flexible portion 16 connected to the portion 120 to be processed.
本实施方式中，基材10可以是通过裁切工艺获得。基材10可以呈矩形状。待加工部120可以位于基材10长度方向的一端。通过在待加工部120上预先设置待加工区域，以方便后续对待加工部120进行加工。基材10的厚度可以是5μm～80μm。待加工部120与柔性部16一体设置。通过对待加工部120加工，以获得具有一定硬度的基材10，进而提高柔性面板100的功能稳定性。In this embodiment, the base material 10 may be obtained through a cutting process. The base material 10 may have a rectangular shape. The portion to be processed 120 may be located at one end of the substrate 10 in the longitudinal direction. The region to be processed is preset on the portion to be processed 120 to facilitate subsequent processing of the portion to be processed 120. The thickness of the substrate 10 may be 5 μm to 80 μm. The portion to be processed 120 is provided integrally with the flexible portion 16. The processing portion 120 is processed to obtain the base material 10 with a certain hardness, thereby improving the functional stability of the flexible panel 100.
在一个实施例中，基材10为具有柔性性能及弹性性能的基材。基材10主要包括天然橡胶或合成橡胶等柔性材料。基材10的制备原料采用内含不饱和双键官能团的高分子材料与交联剂的混合物。即基材10的制备原料可以包括含有苯乙烯类弹性体、聚异戊二烯橡胶、聚丁二烯橡胶、乙丙橡胶、丁苯橡胶、丁腈橡胶、硅橡胶、聚氨酯橡胶、氯醇橡胶、丙烯酸酯橡胶等天然橡胶或合成橡胶材料。基材10的制备原料中还混入有交联剂，该交联剂可以是硫化物、金属氧化物、过氧化物、脂肪或芳香胺类、磺酸盐、芳香二元醇及季鏻(铵)盐等化合物。利用基材10包括含有上述的天然橡胶、合成橡胶与交联剂的混合物，以方便基材10的待加工部120可以进行化学交联反应加工。In one embodiment, the substrate 10 is a substrate with flexible properties and elastic properties. The base material 10 mainly includes flexible materials such as natural rubber or synthetic rubber. The preparation material of the base material 10 uses a mixture of a polymer material containing an unsaturated double bond functional group and a cross-linking agent. That is, the raw materials for preparing the base material 10 may include styrene-based elastomer, polyisoprene rubber, polybutadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, polyurethane rubber, chlorohydrin rubber , Acrylic rubber and other natural or synthetic rubber materials. The preparation material of the base material 10 is further mixed with a cross-linking agent. The cross-linking agent may be sulfide, metal oxide, peroxide, fat or aromatic amines, sulfonate, aromatic diol and quaternary phosphonium (ammonium ) Salt and other compounds. The base material 10 includes a mixture containing the above-mentioned natural rubber, synthetic rubber, and cross-linking agent, so that the to-be-processed portion 120 of the base material 10 can be processed by chemical cross-linking reaction.
102：对待加工部120进行硬化加工，以使待加工部120形成具有绑定区11的硬质部12。102: Harden the to-be-processed portion 120 so that the to-be-processed portion 120 forms the hard portion 12 having the binding area 11.
在一个实施例中，对待加工部120加热、或在硫化浸泡液中浸泡加工形成硬质部12，以使得形成硬质部12的硬度可以根据需要进行调整，使得柔性面板100满足使用要求，既可以保证一定硬度，又可以满足弯曲形变性能。硬质部12经化学处理成型之后，可以在硬质部12上设置绑定区11，以方便硬质部12增强绑定区11的硬度，防止绑定区11在受热、受压作用下产生形变。In one embodiment, the to-be-processed portion 120 is heated, or immersed in a vulcanization soaking solution to form the hard portion 12, so that the hardness of the formed hard portion 12 can be adjusted as needed, so that the flexible panel 100 meets the use requirements, both Can guarantee a certain hardness, and can meet the bending deformation performance. After the hard portion 12 is formed by chemical treatment, a binding area 11 can be provided on the hard portion 12 to facilitate the hard portion 12 to enhance the hardness of the binding area 11 and prevent the binding area 11 from being generated under the action of heat and pressure deformation.
103：在柔性部16形成电子器件20，并形成连接电子器件20的导线30，导线30延伸至绑定区11。103: An electronic device 20 is formed on the flexible portion 16, and a wire 30 connecting the electronic device 20 is formed, and the wire 30 extends to the bonding area 11.
本实施方式中，电子器件20和导线30可以采用经丝网印刷等工艺布置于基材10上。电子器件20可以由多个阵列排布的电容感应单元21构成。电子器件20形成于基材10可弯曲或可拉伸处，以方便电子器件20可随基材10弯曲及拉伸。导线30部分形成于基材10与电子器件20相同一侧，以将电子器件20与绑定区11电连接。In this embodiment, the electronic device 20 and the wire 30 may be arranged on the base material 10 by a process such as screen printing. The electronic device 20 may be composed of a plurality of capacitive sensing units 21 arranged in an array. The electronic device 20 is formed at a position where the substrate 10 can be bent or stretched, so that the electronic device 20 can be bent and stretched with the substrate 10. The wire 30 is partially formed on the same side of the base material 10 and the electronic device 20 to electrically connect the electronic device 20 and the bonding area 11.
104：提供柔性电路板60，将柔性电路板60在绑定区11处与基材10绑定。104: Provide a flexible circuit board 60, and bind the flexible circuit board 60 to the substrate 10 at the binding area 11.
本实施方式中，在基材10在绑定区11处涂刷导电胶70，将柔性电路板60的一端贴合于导电胶70上。对柔性电路板60和基材10施加一定挤压作用力，并对导电胶70进行加热，以方便导电胶70稳固连接柔性电路板60和基材10，以及使得柔性电路板60与导线30导通。由于硬质部12增强了绑定区11的硬度，防止基材10形变，保证柔性面板100功能稳定性。In this embodiment, the base material 10 is coated with the conductive adhesive 70 at the binding area 11, and one end of the flexible circuit board 60 is attached to the conductive adhesive 70. Apply a certain squeezing force to the flexible circuit board 60 and the substrate 10, and heat the conductive adhesive 70 to facilitate the conductive adhesive 70 to firmly connect the flexible circuit board 60 and the substrate 10, and to guide the flexible circuit board 60 and the lead 30 through. Since the rigid portion 12 enhances the hardness of the binding area 11, the deformation of the base material 10 is prevented, and the functional stability of the flexible panel 100 is ensured.
在另一个实施例中，与图11所示实施例不同的是，在步骤101中，基材10为具有柔性性能的基材。基材10的主要包括天然橡胶或合成橡胶。基材10的制备原料采用内含不饱和双键官能团的高分子材料与光引发剂的混合物。即基材10的制备原料可以包括含有苯乙烯类弹性体、聚异戊二烯橡胶、聚丁二烯橡胶、乙丙橡胶、丁苯橡胶、丁腈橡胶、硅橡胶、聚氨酯橡胶、氯醇橡胶、丙烯酸酯橡胶等天然橡胶或合成橡胶材料。基材10的制备原料中还混入有光引发剂，该光引发剂可以是苯偶姻及衍生物、苯偶酰类、酰基磷氧化物、二苯甲酮类、硫杂蒽酮类等化合物。基材10包括含有上述的天然橡胶、合成橡胶与光引发剂的混合物，以方便基材10的待加工部120可以进行化学交联反应加工。In another embodiment, different from the embodiment shown in FIG. 11, in step 101, the substrate 10 is a substrate with flexible properties. The base material 10 mainly includes natural rubber or synthetic rubber. The raw material for preparing the substrate 10 uses a mixture of a polymer material containing an unsaturated double bond functional group and a photoinitiator. That is, the raw materials for preparing the base material 10 may include styrene-based elastomer, polyisoprene rubber, polybutadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, nitrile rubber, silicone rubber, polyurethane rubber, chlorohydrin rubber , Acrylic rubber and other natural or synthetic rubber materials. The raw material for preparing the base material 10 is further mixed with a photoinitiator. The photoinitiator may be a compound such as benzoin and derivatives, benzyls, acylphosphine oxides, benzophenones, thioxanthones, etc. . The substrate 10 includes a mixture containing the above-mentioned natural rubber, synthetic rubber, and photoinitiator, so that the to-be-processed portion 120 of the substrate 10 can be processed by chemical cross-linking reaction.
在步骤102中，对待加工部120进行紫外光、电子束等光辐射方式进行照射，使得待加工部120产生化学交联，即待加工部120内部分子产生化学交联反应，以硬化处理形成硬质部12。硬质部12的硬度可以根据需要进行调整，使得柔性面板100满足使用要求，既可以保证一定硬度，又可以满足弯曲形变性能。In step 102, the portion to be processed 120 is irradiated with light such as ultraviolet light, electron beams, etc., so that the portion to be processed 120 is chemically cross-linked, that is, the molecules inside the portion to be processed 120 generate a chemical cross-linking reaction, and hardened to form a hard质部12。 Quality 12. The hardness of the hard portion 12 can be adjusted according to needs, so that the flexible panel 100 meets the use requirements, which can not only ensure a certain hardness, but also satisfy the bending deformation performance.
提供另一实施例，与图11所示实施例不同的是，在步骤101中，基材10的主要材质为内含活泼氢的柔性高分子材料。基材10的主要包括含有氨基、羟基、羧基等活泼氢官能团的柔性高分子材料。基材10的制备原料采用内含活泼氢的柔性高分子材料与高温固化剂的混合物。即基材10的制备原料可以包括含有聚氨弹性体、硅橡胶、聚氨酯橡胶、氯醇橡胶、丙烯酸酯橡胶等热塑性弹性体、合成树脂橡胶材料。基材10的制备原料中还混入有高温固化剂，该高温固化剂可以是苯酚封闭的多异氰酸酯、己内酰胺封闭的多异氰酸酯、丁酮亏封闭的多异氰酸酯等封闭型异氰酸酯、羟基树脂、端羧基树脂、丙烯酸树脂、环氧树脂等活性官能团树脂化合物。利用基材10包括含有活泼氢的柔性高分子材料与高温固化剂的混合物，以方便基材10的待加工部120可以进行化学交联反应加工。Another embodiment is provided, which is different from the embodiment shown in FIG. 11 in that in step 101, the main material of the substrate 10 is a flexible polymer material containing active hydrogen. The base material 10 mainly includes flexible polymer materials containing active hydrogen functional groups such as amino groups, hydroxyl groups, and carboxyl groups. The preparation material of the base material 10 is a mixture of a flexible polymer material containing active hydrogen and a high-temperature curing agent. That is, the raw materials for preparing the substrate 10 may include thermoplastic elastomers such as polyurethane elastomer, silicone rubber, urethane rubber, chlorohydrin rubber, and acrylic rubber, and synthetic resin rubber materials. The preparation material of the base material 10 is further mixed with a high-temperature curing agent, which may be a blocked isocyanate such as phenol-blocked polyisocyanate, caprolactam-blocked polyisocyanate, butanone-blocked polyisocyanate, hydroxy resin, carboxyl-terminated resin, etc. , Acrylic resin, epoxy resin and other active functional resin compounds. The base material 10 includes a mixture of a flexible polymer material containing active hydrogen and a high-temperature curing agent, so that the to-be-processed portion 120 of the base material 10 can be processed by chemical cross-linking reaction.
在步骤102中，对待加工部120进行加热、红外光辐射等方式进行化学硬化加工，使得待加工部120产生化学交联，即待加工部120内部分子产生化学交联反应，以硬化形成硬质部12。硬质部12的硬度可以根据需要进行调整，使得柔性面板100满足使用要求，既可以保证一定硬度，又可以满足弯曲形变性能。In step 102, the portion to be processed 120 is subjected to chemical hardening by heating, infrared light radiation, etc., so that the portion to be processed 120 is chemically cross-linked, that is, the molecules inside the portion to be processed 120 undergo chemical cross-linking reactions to harden to form hard Department 12. The hardness of the hard portion 12 can be adjusted according to needs, so that the flexible panel 100 meets the use requirements, which can not only ensure a certain hardness, but also satisfy the bending deformation performance.
提供另一实施例，与图11所示实施例不同的是，在步骤101中，基材10为具有柔性 性能及弹性性能的基材。基材10的主要材质为合成橡胶、热性塑料、或弹性塑料等高分子物质。基材10的制备原料可以采用聚氨酯、有机硅、天然橡胶、乙丙橡胶、丁苯橡胶、丁基橡胶、硅橡胶等高分子材料。基材10包括含有上合成橡胶、或热性塑料、或弹性塑料等高分子物质，以方便基材10的待加工部120可以通过分子裂解并生成自由基，进而主链断裂及形成交联，发生侧链有机基团的氧化分解反应，实现化学反应硬化处理。Another embodiment is provided, which is different from the embodiment shown in FIG. 11 in that in step 101, the substrate 10 is a substrate having flexible properties and elastic properties. The main material of the base material 10 is a polymer material such as synthetic rubber, thermal plastic, or elastic plastic. As the raw material for preparing the base material 10, polymer materials such as polyurethane, silicone, natural rubber, ethylene-propylene rubber, styrene-butadiene rubber, butyl rubber, and silicone rubber can be used. The base material 10 includes a polymer material containing synthetic rubber, thermal plastic, or elastic plastic, so that the to-be-processed portion 120 of the base material 10 can be molecularly cleaved to generate free radicals, and then the main chain is broken and cross-linked. An oxidative decomposition reaction of the organic group of the side chain occurs to realize the chemical reaction hardening treatment.
在步骤102之前包括步骤：对待加工部120进行老化及硬化处理。通过将基材10的待加工部120放置于光、热、紫外高能辐射、臭氧、酸碱等化学环境下，实现将待加工部120的分子链断裂，以方便后续对待加工部120进行化学处理，减小待加工部120的化学处理时间，减少制作成本。Before step 102, it includes a step of performing aging and hardening treatment on the processing part 120. By placing the to-be-processed portion 120 of the base material 10 in a chemical environment such as light, heat, ultraviolet high-energy radiation, ozone, acid, alkali, etc., the molecular chain of the to-be-processed portion 120 is broken to facilitate subsequent chemical treatment of the to-be-processed portion 120 , To reduce the chemical processing time of the to-be-processed part 120 and reduce the manufacturing cost.
在步骤102中，对待加工部120进行加热、UV强光、化学浸泡等方式进行化学加工，使得待加工部10内的高分子产生氧化分解反应或碳化，导致待加工部120硬化处理形成硬质部12。硬质部12的硬度可以根据需要进行调整，使得柔性面板100满足使用要求，既可以保证一定硬度，又可以满足弯曲形变性能。In step 102, chemical processing is performed on the to-be-processed portion 120 by heating, UV light, chemical immersion, etc., so that the polymer in the to-be-processed portion 10 undergoes oxidative decomposition reaction or carbonization, resulting in the hard-to-be-processed portion 120 being hardened to form hard Department 12. The hardness of the hard portion 12 can be adjusted according to needs, so that the flexible panel 100 meets the use requirements, which can not only ensure a certain hardness, but also satisfy the bending deformation performance.
在步骤102之后，还包括步骤：在基材10的硬质部12涂布涂层40。涂层40可以是采用印刷工艺成型于基材10的一侧或相对的两侧。涂层40可以增加柔性面板100的硬度。由于基材10经化学处理形成硬质部12，为了保证基材10在硬质部12处的可靠性满足要求，涂层40覆盖硬质部12，并覆盖硬质部12与柔性部16的交界处，以保证柔性面板100的功能稳定性。导线30可以排布于涂层40背离基材10一侧。After step 102, the method further includes the step of applying a coating layer 40 to the hard portion 12 of the base material 10. The coating layer 40 may be formed on one side or opposite sides of the substrate 10 by a printing process. The coating 40 can increase the hardness of the flexible panel 100. Since the base material 10 is chemically processed to form the hard portion 12, in order to ensure that the reliability of the base material 10 at the hard portion 12 meets the requirements, the coating 40 covers the hard portion 12, and covers the hard portion 12 and the flexible portion 16 At the junction, to ensure the functional stability of the flexible panel 100. The wires 30 may be arranged on the side of the coating 40 facing away from the substrate 10.
通过基材在绑定区处经硬化处理形成硬质部，硬质部对绑定区提供应力补强，使得绑定区不易产生变形，防止电子器件在绑定区与功能元件连接失效，提高了柔性面板性能的功能稳定性。The substrate is hardened at the binding area to form a hard part, and the hard part provides stress reinforcement to the binding area, so that the binding area is not easily deformed, preventing the failure of the electronic device to connect the functional element in the binding area and improving The functional stability of the performance of the flexible panel.
以上对本申请实施例所提供的一种柔性面板制作方法及柔性面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施例进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施例及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。The flexible panel manufacturing method and flexible panel provided by the embodiments of the present application are described above in detail. Specific examples are used in this article to explain the principles and embodiments of the present application. The descriptions of the above embodiments are only used to help understanding The method of the present application and its core idea; meanwhile, for those of ordinary skill in the art, according to the idea of the present application, there will be changes in specific embodiments and scope of application. In summary, the content of this specification should not be understood as Restrictions on this application.

Claims (18)

  1. 一种柔性面板制作方法，其特征在于，所述柔性面板制作方法包括步骤：A method for manufacturing a flexible panel, characterized in that the method for manufacturing a flexible panel includes the steps of:
    提供基材，所述基材具有待加工部和与所述待加工部连接的柔性部；Providing a substrate, the substrate having a portion to be processed and a flexible portion connected to the portion to be processed;
    对所述待加工部进行硬化加工，以使所述待加工部形成具有绑定区的硬质部；在所述柔性部上形成电子器件，并形成连接所述电子器件的导线，所述导线延伸至所述绑定区。Hardening the portion to be processed so that the portion to be processed forms a hard portion with a binding area; an electronic device is formed on the flexible portion, and a wire connecting the electronic device is formed, the wire Extend to the binding zone.
  2. 如权利要求1所述的柔性面板制作方法，其特征在于，提供基材的步骤中，所述基材包括内含不饱和双键官能团的高分子材料与交联剂的混合物；The method for manufacturing a flexible panel according to claim 1, wherein in the step of providing a substrate, the substrate comprises a mixture of a polymer material containing an unsaturated double bond functional group and a crosslinking agent;
    对所述待加工部进行硬化加工的步骤中，对所述待加工部加热或在硫化浸泡液中浸泡加工形成所述硬质部。In the step of hardening the portion to be processed, the portion to be processed is heated or immersed in a vulcanization soaking solution to form the hard portion.
  3. 如权利要求2所述的柔性面板制作方法，其特征在于，所述基材包括含有苯乙烯类弹性体、聚异戊二烯橡胶、聚丁二烯橡胶、乙丙橡胶、丁苯橡胶、丁腈橡胶、硅橡胶、聚氨酯橡胶、氯醇橡胶、丙烯酸酯橡胶任意一种或多种的天然橡胶或合成橡胶材料，所述交联剂为硫化物、金属氧化物、过氧化物、脂肪或芳香胺类、磺酸盐、芳香二元醇及铵盐任意一种或多种的化合物。The method for manufacturing a flexible panel according to claim 2, wherein the base material comprises a styrene elastomer, polyisoprene rubber, polybutadiene rubber, ethylene propylene rubber, styrene butadiene rubber, butyl Any one or more of natural rubber or synthetic rubber materials of nitrile rubber, silicone rubber, urethane rubber, chlorohydrin rubber, acrylate rubber, the cross-linking agent is sulfide, metal oxide, peroxide, fat or aromatic Any one or more compounds of amines, sulfonates, aromatic diols and ammonium salts.
  4. 如权利要求1所述的柔性面板制作方法，其特征在于，提供基材的步骤中，所述基材包括内含不饱和双键官能团的高分子材料与光引发剂的混合物；The method for manufacturing a flexible panel according to claim 1, wherein in the step of providing a substrate, the substrate includes a mixture of a polymer material containing an unsaturated double bond functional group and a photoinitiator;
    对所述待加工部进行硬化加工的步骤中，对所述待加工部进行紫外光辐射、电子束辐射加工形成硬质部。In the step of hardening the portion to be processed, the portion to be processed is subjected to ultraviolet light irradiation and electron beam radiation processing to form a hard portion.
  5. 如权利要求4所述的柔性面板制作方法，其特征在于，所述基材包括含有苯乙烯类弹性体、聚异戊二烯橡胶、聚丁二烯橡胶、乙丙橡胶、丁苯橡胶、丁腈橡胶、硅橡胶、聚氨酯橡胶、氯醇橡胶、丙烯酸酯橡胶任意一种或多种的天然橡胶或合成橡胶材料，所述光引发剂为苯偶姻及衍生物、苯偶酰类、酰基磷氧化物、二苯甲酮类、硫杂蒽酮类任意一种或多种的化合物。The method for manufacturing a flexible panel according to claim 4, wherein the base material comprises a styrene elastomer, polyisoprene rubber, polybutadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, butadiene Any one or more of natural rubber or synthetic rubber materials of nitrile rubber, silicone rubber, urethane rubber, chlorohydrin rubber, acrylate rubber, the photoinitiator is benzoin and derivatives, benzyls, acyl phosphorous Any one or more compounds of oxides, benzophenones, and xanthones.
  6. 如权利要求1所述的柔性面板制作方法，其特征在于，提供基材的步骤中，所述基材包括内含活泼氢的高分子材料与高温固化剂的混合物；The method for manufacturing a flexible panel according to claim 1, wherein in the step of providing a substrate, the substrate comprises a mixture of a polymer material containing active hydrogen and a high-temperature curing agent;
    对所述待加工部进行硬化加工的步骤中，对所述待加工部加热、红外辐射加工形成硬质部。In the step of hardening the portion to be processed, the portion to be processed is heated and processed by infrared radiation to form a hard portion.
  7. 如权利要求6所述的柔性面板制作方法，其特征在于，所述基材包括含有聚氨弹性体、硅橡胶、聚氨酯橡胶、氯醇橡胶、丙烯酸酯橡胶的任意一种或多种的热塑性弹性体、合成树脂橡胶材料，所述高温固化剂为苯酚封闭的多异氰酸酯、己内酰胺封闭的多异氰酸酯、丁酮亏封闭的多异氰酸酯等封闭型异氰酸酯、羟基树脂、端羧基树脂、丙烯酸树脂、环氧树脂任意一种或多种的活性官能团树脂化合物。The method for manufacturing a flexible panel according to claim 6, wherein the base material comprises any one or more types of thermoplastic elastomers including polyurethane elastomer, silicone rubber, urethane rubber, chlorohydrin rubber, and acrylic rubber Body, synthetic resin rubber material, the high-temperature curing agent is phenol-blocked polyisocyanate, caprolactam-blocked polyisocyanate, methyl ethyl ketone-blocked polyisocyanate and other blocked isocyanates, hydroxyl resin, carboxyl-terminated resin, acrylic resin, epoxy resin Any one or more active functional group resin compounds.
  8. 如权利要求1所述的柔性面板制作方法，其特征在于，提供基材的步骤中，所述基材的材质为高分子材料；The method for manufacturing a flexible panel according to claim 1, wherein in the step of providing a base material, the material of the base material is a polymer material;
    对所述待加工部进行硬化加工的步骤中，对所述待加工部进行氧化分解反应或碳化形成硬质部。In the step of hardening the portion to be processed, an oxidative decomposition reaction or carbonization is performed on the portion to be processed to form a hard portion.
  9. 如权利要求8所述的柔性面板制作方法，其特征在于，对所述待加工部进行硬化加工的步骤之前，还包括步骤：The method for manufacturing a flexible panel according to claim 8, wherein before the step of hardening the portion to be processed, the method further comprises the steps of:
    对所述待加工部的分子链断裂加工。The molecular chain of the portion to be processed is broken and processed.
  10. 如权利要求9所述的柔性面板制作方法，其特征在于，在所述柔性部上形成硬质部之后，还包括步骤：The method for manufacturing a flexible panel according to claim 9, wherein after the hard portion is formed on the flexible portion, the method further comprises the steps of:
    在所述基材的所述硬质部涂布涂层。A coating is applied to the hard portion of the substrate.
  11. 一种柔性面板，其特征在于，所述柔性面板由权利要求1-10任意一项所述的柔性面板制作方法制成。A flexible panel, characterized in that the flexible panel is made by the method for manufacturing a flexible panel according to any one of claims 1-10.
  12. 如权利要求11所述的柔性面板，其特征在于，所述柔性面板包括基材和电子器件，所述基材设有绑定区，所述基材在所述绑定区处经硬化处理形成硬质部，所述电子器件固定于所述基材，所述电子器件与延伸至所述绑定区的导线连接。The flexible panel according to claim 11, wherein the flexible panel includes a substrate and an electronic device, the substrate is provided with a binding area, and the substrate is formed by hardening treatment at the binding area In the hard part, the electronic device is fixed to the base material, and the electronic device is connected to a wire extending to the binding area.
  13. 如权利要求11所述的柔性面板，其特征在于，所述基材包括连接所述硬质部的柔性部，所述硬质部的硬度大于所述柔性部的硬度。The flexible panel according to claim 11, wherein the base material includes a flexible portion connected to the hard portion, and the hardness of the hard portion is greater than the hardness of the flexible portion.
  14. 如权利要求11所述的柔性面板，其特征在于，所述基材在所述绑定区设有多条间隔排布的硬质部，所述绑定区覆盖所述硬质部，以及覆盖相邻两个所述硬质部之间的部分。The flexible panel according to claim 11, wherein the base material is provided with a plurality of spaced hard portions in the binding area, the binding area covers the hard portions, and covers The part between two adjacent hard parts.
  15. 如权利要求12～14任意一项所述的柔性面板，其特征在于，所述柔性面板还包括涂层，所述涂层覆盖所述硬质部。The flexible panel according to any one of claims 12 to 14, wherein the flexible panel further includes a coating layer, and the coating layer covers the hard portion.
  16. 如权利要求15所述的柔性面板，其特征在于，所述涂层厚度小于所述硬质部厚度。The flexible panel according to claim 15, wherein the thickness of the coating layer is smaller than the thickness of the hard portion.
  17. 如权利要求11～16任意一项所述的柔性面板，其特征在于，所述柔性面板还包括柔性电路板，所述柔性电路板的一部分固定于所述绑定区，并与所述导线电连接。The flexible panel according to any one of claims 11 to 16, wherein the flexible panel further comprises a flexible circuit board, and a part of the flexible circuit board is fixed to the binding area and electrically connected to the wire connection.
  18. 如权利要求17所述的柔性面板，其特征在于，所述柔性电路板经导电胶固定于所述绑定区，并经所述导电胶与所述导线导通。The flexible panel according to claim 17, wherein the flexible circuit board is fixed to the binding area via conductive adhesive, and is electrically connected to the wire via the conductive adhesive.
PCT/CN2018/121996 2018-12-19 2018-12-19 Flexible panel and method for manufacturing same WO2020124416A1 (en)

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