WO2020119488A1 - Dip pin device, package structure, and pluggable device - Google Patents
Dip pin device, package structure, and pluggable device Download PDFInfo
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- WO2020119488A1 WO2020119488A1 PCT/CN2019/122228 CN2019122228W WO2020119488A1 WO 2020119488 A1 WO2020119488 A1 WO 2020119488A1 CN 2019122228 W CN2019122228 W CN 2019122228W WO 2020119488 A1 WO2020119488 A1 WO 2020119488A1
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- WIPO (PCT)
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- dip pin
- chamfer
- dip
- convex hull
- pcb
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Definitions
- This application relates to the technical field of electronic product manufacturing, in particular to a DIP pin device, a packaging structure, and a plug-in device.
- DIP pins can be mounted on the printed circuit board through surface mounting technology (SMT) and other methods (printed circuit board, PCB).
- SMT surface mounting technology
- PCB printed circuit board
- the DIP pin is After welding, problems such as offset and twisting may occur.
- the width H of the PCB slot is usually reduced, or the DIP lead is increased.
- the method of foot width L When H decreases or L increases, the gap between the DIP pin and the PCB slot decreases. Correspondingly, the movement range of the DIP pin in the PCB slot becomes smaller, thereby improving the positioning accuracy of the DIP pin.
- the probability that the DIP pin does not enter the PCB slot increases, which further leads to a decline in the excellent rate of the electronic product production line.
- the width L of the DIP pin is 0.15mm and the width H of the PCB slot is 0.45mm
- the probability of not entering the hole increases by parts per million (ppm) when H decreases by 0.05mm 139, and every time L increases by 0.1mm, the probability of not entering the hole increases by 441ppm.
- the method of reducing the width H of the PCB slot or increasing the width L of the DIP pin improves the positioning accuracy of the DIP pin, it will increase the probability of the DIP pin not entering the hole, and even reduce the production line of the electronic product. Excellent rate.
- the embodiments of the present application disclose a dual in-line package DIP pin device, a package structure, and a plug-in device.
- an embodiment of the present application provides a dual in-line package DIP pin device, including:
- the limit convex hull is located on the surface of the DIP pin, and when the DIP pin is inserted into the PCB slot of the printed circuit board, the limit convex hull is located in the PCB slot;
- the first chamfer is located on the surface of the DIP pin and is connected to the first side of the limiting convex hull.
- the limiting convex hull is located in the PCB slot, the limiting position
- the side of the convex hull facing the PCB slot is the first side of the limiting convex hull.
- the disclosed DIP pin device disclosed in the embodiment of the present application partially sets a limit convex hull.
- the movable range of the PCB pin in the PCB slot is reduced, which can improve the DIP pin positioning accuracy.
- the solution of the embodiment of the present application does not reduce the width H of the PCB slot, and does not increase the width L of the DIP pin, so there will not be any problems caused by reducing H or increasing L in the prior art. The probability that the DIP pin does not enter the hole increases, and the excellent rate of the production line decreases.
- the first chamfer is provided on the surface of the DIP pin, and the DIP pin enters the PCB slot, the first chamfer enters the PCB slot before the limit bump, in this case,
- the first chamfer is convenient for the DIP pin to enter the PCB slot, and has a certain guiding correction effect, which reduces the difficulty of the DIP pin and the limiting convex hull entering the PCB slot.
- the limiting convex hull is fixed on the surface of the DIP pin in the form of welding;
- the limit convex hull and the DIP pin are of an integrated structure.
- the material of the limiting convex hull and/or the first chamfer is the same as the material of the DIP pin;
- the material of the limiting convex hull and/or the first chamfer is a metal material.
- the angle range between the first chamfer and the DIP pin is [120°, 160°];
- the obtuse angle formed by the first target tangent of the first chamfer and the plane of the DIP pin is the angle between the first chamfer and the DIP pin, and the first target tangent is Among each tangent line of the first chamfer, a tangent line passing through a first target point, the first target point is a connection point of the first chamfer and the DIP pin.
- the method further includes:
- the second chamfer is located on the surface of the DIP pin and is connected to the second side of the limiting convex hull.
- the limiting convex hull is located in the PCB slot, the limiting position
- the side of the convex hull facing away from the PCB slot is the second side;
- the second chamfer is located in the PCB slot.
- the contact area between the DIP pin and the solder paste in the PCB slot can be further increased, so that the soldering strength of the DIP pin can be further increased.
- the material of the second chamfer is the same as the material of the DIP pin;
- the materials of the limiting convex hull and the second chamfer are metal materials.
- the angle range between the second chamfer and the DIP pin is [120°, 160°];
- the obtuse angle formed by the second target tangent of the second chamfer and the plane of the DIP pin is the angle between the second chamfer and the DIP pin
- the second target tangent is Each tangent line of the second chamfer passes through a tangent line of a second target point
- the second target point is a connection point of the second chamfer and the DIP pin.
- an embodiment of the present application provides a packaging structure, including:
- a DIP pin device as described in the first aspect and a PCB board provided with PCB slots;
- the DIP pin device is located in the PCB slot, and is fixed on the PCB board by the solder paste in the PCB slot.
- an embodiment of the present application provides a plug-in device, including:
- the DIP pin device as described in the first aspect.
- the plug-in device is a user identity module SIM card holder, a headset holder, or a universal serial bus USB connector.
- the embodiments of the present application disclose a DIP pin device, a packaging structure, and a plug-in device, wherein the DIP pin device is partially provided with a limiting convex hull, and when the DIP pin is inserted into the PCB slot, the PCB pin is reduced
- the movable range in the PCB slot hole can improve the positioning accuracy of the DIP pin.
- the solution of the embodiment of the present application does not reduce the width H of the PCB slot, and does not increase the width L of the DIP pin, so there will not be any problems caused by reducing H or increasing L in the prior art. The probability that the DIP pin does not enter the hole increases, and the excellent rate of the production line decreases.
- the first chamfer is provided on the surface of the DIP pin, and the DIP pin enters the PCB slot, the first chamfer enters the PCB slot before the limit bump, in this case,
- the first chamfer is convenient for the DIP pin to enter the PCB slot, and has a certain guiding correction effect, which reduces the difficulty of the DIP pin and the limiting convex hull entering the PCB slot.
- the DIP pin devices disclosed in the embodiments of the present application do not need to adjust the specifications of the PCB board, so there is no need to re-produce the PCB board with a smaller H, and the manufacturing cost of the PCB board will not be additionally increased.
- the width of the PCB slot is not reduced, it will not affect the amount of solder that the PCB slot can accommodate. Therefore, the problem of reduced soldering strength of the DIP pin caused by the reduction in solder will not occur.
- the limit convex hull and the first chamfer are provided on the DIP pin, compared with the scheme of increasing the width L of the DIP pin, the weight of the DIP pin The impact is small, so it is more conducive to the miniaturization and light weight of electronic equipment.
- the DIP pin device disclosed in the embodiment of the present application, when the DIP pin device is soldered to the PCB through the PCB slot, due to the limited convex hull and the first chamfer provided on the surface of the DIP pin, the relative For the DIP pin, the contact area with the solder paste in the PCB slot is increased.
- the limiting convex hull and the first chamfer function as a nail wedge. Therefore, when the DIP pin is stressed, it is not easy to remove it from the PCB board. Peeling, it can also increase the soldering strength of DIP pins.
- FIG. 1 is a schematic diagram of a DIP pin welding disclosed in the prior art
- FIG. 2(a) is a schematic diagram of another DIP pin welding disclosed in the prior art
- 3(a) is a front view of a DIP pin device disclosed in an embodiment of the present application.
- 3(b) is a top view of a DIP pin device disclosed in an embodiment of the present application.
- 3(c) is a right side view of a DIP pin device disclosed in an embodiment of the present application.
- FIG. 4(a) is a front view of a soldering situation of a DIP pin device disclosed in an embodiment of the present application
- FIG. 4(b) is a right side view of a welding situation of a DIP pin device disclosed in an embodiment of the present application;
- FIG. 5 is a right side view of a welding situation of a DIP pin device disclosed in an embodiment of the present application.
- FIG. 6 is a schematic cross-sectional view of a packaging structure disclosed in an embodiment of the present application.
- FIG. 7 is a schematic structural diagram of a plug-in device disclosed in an embodiment of the present application.
- the embodiments of the present application disclose a dual in-line package DIP pin device, a package structure, and a plug-in device.
- the first embodiment of the present application discloses a dual in-line package DIP pin device, see the front view of the DIP pin device shown in FIGS. 3(a), 3(b) and 3(c), From a top view and a right view, the DIP pin device includes: a DIP pin 10, a limiting convex hull 20, and a first chamfer 30.
- the limiting convex hull 20 is located on the surface of the DIP pin 10.
- the first chamfer 30 is located on the surface of the DIP pin and is connected to the first side 21 of the limiting convex hull 20.
- the side of the limiting convex hull 20 facing the PCB slot is the first side of the limiting convex hull 20.
- the first chamfer 30 is disposed on the side where the limiting protrusion 20 extends into the PCB slot.
- the first chamfer 30 is connected to the first side 21 of the limiting convex hull 20.
- the first chamfer 30 and the limiting convex hull 20 may be an integrated structure, that is, the first chamfer 30 and The limiting convex hull 20 is integrated, or the first chamfer 30 and the limiting convex hull 20 may be two separate parts, and the two parts may be fixedly connected together by welding or gluing.
- the limiting convex hull 20 when the DIP pin 10 is inserted into the PCB slot, the limiting convex hull 20 is located in the PCB slot, and the first chamfer 30 and the limiting convex hull The first side 21 of the 20 is connected. Therefore, when the DIP pin 10 is inserted into the PCB slot, the first chamfer 30 and the limiting convex package 20 are both located in the PCB slot. Moreover, in the process of soldering the DIP pin device disclosed in the embodiment of the present application to the PCB board, the first chamfer 30 first enters the PCB slot with the DIP pin 10, and then, the limiting convex hull 20 follows the DIP Pin 10 enters the PCB slot.
- the sides of the limiting convex hull 20 can be arranged in an arc shape, so that the DIP pin device can enter the PCB slot.
- the DIP pin device disclosed in the first embodiment of the present application partially sets a limit convex hull.
- the movable range of the PCB pin in the PCB slot is reduced, thereby improving the DIP Pin positioning accuracy.
- the solution of the embodiment of the present application does not reduce the width H of the PCB slot, and does not increase the width L of the DIP pin, so there will not be any problems caused by reducing H or increasing L in the prior art. The probability that the DIP pin does not enter the hole increases, and the excellent rate of the production line decreases.
- the first chamfer is provided on the surface of the DIP pin, and the DIP pin enters the PCB slot, the first chamfer enters the PCB slot before the limit bump, in this case,
- the first chamfer is convenient for the DIP pin to enter the PCB slot, and has a certain guiding correction effect, which reduces the difficulty of the DIP pin and the limiting convex hull entering the PCB slot.
- the DIP pin devices disclosed in the embodiments of the present application do not need to adjust the specifications of the PCB board, so there is no need to re-produce the PCB board with a smaller H, and the manufacturing cost of the PCB board will not be additionally increased.
- the width of the PCB slot is not reduced, it will not affect the amount of solder that the PCB slot can accommodate. Therefore, the problem of reduced soldering strength of the DIP pin caused by the reduction in solder will not occur.
- the limit convex hull and the first chamfer are provided on the DIP pin, compared with the scheme of increasing the width L of the DIP pin, the weight of the DIP pin The impact is small, so it is more conducive to the miniaturization and light weight of electronic equipment.
- the DIP pin device disclosed in the embodiment of the present application, when the DIP pin device is soldered to the PCB through the PCB slot, due to the limited convex hull and the first chamfer provided on the surface of the DIP pin, the relative For the DIP pin, the contact area with the solder paste in the PCB slot is increased.
- the limiting convex hull and the first chamfer function as a nail wedge. Therefore, when the DIP pin is stressed, it is not easy to remove it from the PCB board. Peeling, it can also increase the soldering strength of DIP pins.
- the limiting convex hull may be fixed on the surface of the DIP pin in various ways. In one of the modes, the limiting convex hull is fixed on the surface of the DIP pin by welding. Alternatively, the limit convex hull and the DIP pin have an integrated structure. In this case, the limit convex hull may be punched out from the DIP pin.
- the limiting convex hull can also be fixed on the surface of the DIP pin by means of adhesive bonding, which is not limited in the embodiment of the present application.
- the first chamfer can also be fixed on the surface of the DIP pin in various ways.
- the first chamfer may be fixed on the surface of the DIP pin by welding, or the first chamfer may be an integrated structure with the DIP pin.
- the first chamfer can also be fixed on the surface of the DIP pin by adhesive bonding or the like, which is not limited in the embodiment of the present application.
- the materials of the limiting convex hull and/or the first chamfer can also be of various types.
- the material of the limiting convex hull and/or the first chamfer is the same as the material of the DIP pin.
- the material of the limiting convex hull and/or the first chamfer is a metal material.
- the metal material is nickel white copper or stainless steel.
- the angle range between the angle between the first chamfer and the DIP pin is [120°, 160°].
- the obtuse angle formed by the first target tangent of the first chamfer and the plane of the DIP pin is the angle between the first chamfer and the DIP pin, and the first target tangent is Among each tangent line of the first chamfer, a tangent line passing through a first target point, the first target point is a connection point of the first chamfer and the DIP pin.
- the connection point between the first chamfer and the DIP pin is point A, that is, point A is the first target point.
- the first chamfer often corresponds to multiple tangents. Among them, the tangent passing through point A in each tangent is the first target tangent, and the obtuse angle ⁇ formed by the first target tangent and the plane where the DIP pin lies is the first chamfer and Angle between DIP pins.
- the angle ⁇ between the first chamfer and the DIP pin is too large, the closer the limiting convex hull is to the DIP pin, and the smaller the thickness of the limiting convex hull, the more the DIP pin device disclosed in the embodiment of the present application
- the DIP pin in the prior art is preferred, in this case, the limiting effect of the first chamfer is poor.
- the angle ⁇ between the first chamfer and the DIP pin is too small, the limiting convex hull is more prominent than the DIP pin, and it is easily interfered by the hole wall of the PCB slot, in this case , The guiding effect of the first chamfer is less.
- the angle ⁇ between the first chamfer and the DIP pin can be set to any value between 120° and 160°.
- the angle ⁇ between the first chamfer and the DIP pin can be set to 120°, or the angle ⁇ between the first chamfer and the DIP pin can be set to 160°, or the first The angle ⁇ between the chamfer and the DIP pin is set to the middle value of 120° and 160° (that is, 140°).
- the DIP pin device disclosed in the embodiment of the present application further includes: a second chamfer 40.
- the second chamfer 40 is located on the surface of the DIP pin 10 and is connected to the second side of the limiting convex hull 20.
- the side of the limiting convex hull 20 facing away from the PCB slot is the second side;
- the second chamfer 40 is located in the PCB slot.
- the second chamfer when the DIP pin is inserted into the PCB slot, the second chamfer is located above the first chamfer and the DIP pin. In this case, due to the existence of the second chamfer, the contact area with the solder paste in the PCB slot is further increased, so that the soldering strength of the DIP pin can be further increased.
- the second chamfer and the limiting convex hull may be an integrated structure, or the second angle and the limiting convex hull may also be two independent structures.
- the second chamfer can be fixed on the surface of the DIP pin in various ways.
- the second chamfer can be fixed on the surface of the DIP pin by soldering, or the limit convex hull and the DIP pin have an integrated structure.
- the limit convex The package may be punched out from the DIP pin.
- the second chamfer can also be fixed on the surface of the DIP pin by glue bonding or the like. This embodiment of the present application does not limit this.
- the material of the second chamfer can also be of various types.
- the material of the second chamfer is the same as the material of the DIP pin.
- the material of the second chamfer is a metal material.
- the metal material is nickel white copper or stainless steel.
- the angle range between the second chamfer and the DIP pin is [120°, 160°].
- the obtuse angle formed by the second target tangent of the second chamfer and the plane of the DIP pin is the angle between the second chamfer and the DIP pin
- the second target tangent is Each tangent line of the second chamfer passes through a tangent line of a second target point
- the second target point is a connection point of the second chamfer and the DIP pin.
- the second embodiment of the present application discloses a packaging structure. Refer to the schematic cross-sectional view of the packaging structure shown in FIG. 6.
- the packaging structure includes the DIP pin device 100 disclosed in the first embodiment of the present application, and further includes a PCB.
- the DIP pin device 100 is located in the PCB slot 210 and is fixed on the PCB board 200 by solder paste in the PCB slot 210.
- a plug-in device in a third embodiment of the present application, includes the DIP pin device disclosed in the first embodiment of the present application.
- the plug-in device is a SIM card holder of a user identity module, an earphone holder or a USB connector of a universal serial bus.
- the plug-in device can also be other devices with DIP pins, which are not limited in the embodiments of the present application.
- FIG. 6 is a schematic diagram of the SIM card holder, and the circled part in the figure includes the DIP pin device disclosed in the embodiment of the present application.
- the width L of the DIP pin is usually 0.15 mm
- the width H of the PCB slot is usually 0.45 mm.
- the SIM card holder disclosed in the embodiment of the present application is provided with a DIP pin device, that is, a limit convex hull and a first chamfer are provided on the surface of the DIP pin, and a second chamfer can also be provided, thereby reducing the DIP pin
- a DIP pin device that is, a limit convex hull and a first chamfer are provided on the surface of the DIP pin, and a second chamfer can also be provided, thereby reducing the DIP pin
- the movable range in the PCB slot improves the positioning accuracy of the SIM card holder.
- the width of the limiting convex hull is usually 0.05 mm.
- the SIM card holder disclosed in the examples of the present application has a low card tray insertion and removal high defect rate from 8.9% to 1.2%, which can meet normal mass production quality standards.
- the first chamfer can play a guiding role, and the probability of not entering the hole is less than 100mm, which is equivalent to the conventional design, and reduces the PCB slot width and increase Compared with the scheme of large DIP pin width, the probability of not entering the hole is reduced.
- the limit convex hull and the first chamfer not only play a role of "nail wedge", but also increase the contact area with the solder paste in the PCB slot, and the second chamfer can also increase the contact area with the solder paste, Thereby increasing the welding strength of the SIM card holder.
- the SIM card holder was tested many times, and the following scheme comparison table was obtained.
- the width of the PCB slot is 0.45mm
- the width of the DIP pin is 0.15mm
- the probability of the card floating height is 8.9%
- the probability of not entering the hole is 5ppm
- the PCB The cost of the board
- the SIM card holder of this solution has the disadvantage of low positioning accuracy, which makes it difficult to insert and remove the SIM card holder.
- Scheme 2 the method of reducing the width of the PCB slot is used. In this case, the width of the PCB slot is 0.40mm, the width of the DIP pin is 0.15mm, and the probability of the card floating height is 7.1%.
- the hole probability is 139ppm, and the cost of the PCB board is A+0.1 ⁇ 0.3 yuan/PCS, that is to say, although the SIM card holder of this solution improves the positioning accuracy, it increases the cost of the PCB board and the difficulty of soldering, and As the width of the PCB slot is reduced, the solder paste in the PCB slot is correspondingly reduced, which leads to a reduction in soldering strength.
- the method of increasing the width of the DIP pin is adopted.
- the width of the PCB slot is 0.45mm
- the width of the DIP pin is 0.25mm
- the floating height probability of the card is 1.2%, not in The hole probability is 441ppm
- the cost of the PCB board is A, that is to say, although the SIM card holder of this solution improves the positioning accuracy, it increases the difficulty of soldering, and because of the increase in the weight of the DIP pin, it leads to the SIM card
- the weight of the seat increases.
- the solution 4 adopts the solution disclosed in the embodiments of the present application, that is, the solution through the convex hull limit.
- the width of the PCB slot is 0.45mm
- the width of the DIP pin is 0.15mm
- the DIP The surface of the pin is provided with a limit convex hull with a width of 0.05mm.
- the probability of floating height of the card is 1.2%
- the probability of not entering the hole is ⁇ 100ppm
- the cost of the PCB board is A.
- the SIM of the program The card holder not only improves the positioning accuracy, and does not increase the cost of the PCB board, but also, compared with the solutions 2 and 3, the soldering difficulty is reduced, and, the solution 3 increases the width of the entire DIP pin, while the solution 4 It's just that the limit convex hull and at least one chamfer are added locally to the DIP pin. Therefore, this solution has little effect on the weight of the SIM card holder.
- option 4 can also increase the welding strength of the SIM card holder.
- the solution disclosed in the embodiments of the present application compared with the original solution (ie, solution 1), the positioning accuracy of the solution disclosed in the embodiments of the present application is significantly improved, and the floating probability of the card is reduced from 8.9% to 1.2%, which meets the needs of mass production.
- the solution disclosed in the embodiments of the present application has a lower cost of the PCB board of 0.1-0.3RMB/PCS, and has higher positioning accuracy, less welding processing difficulty, and welding high strength.
- this scheme has a lower soldering difficulty and a smaller device weight, which is conducive to the development of lightweight.
- the size of the sequence number of each process does not mean that the execution order is sequential, and the execution order of each process should be determined by its function and inherent logic, and should not correspond to the embodiments of this application.
- the implementation process constitutes no limitation.
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Abstract
Disclosed are a DIP pin device, a package structure, and a pluggable device. The DIP pin device comprises: a DIP pin, a limiting bulge, and a first chamfer, wherein the limiting bulge is located on the surface of the DIP pin, when the DIP pin is plugged into a PCB slot hole, the limiting bulge is located in the PCB slot hole; the first chamfer is located on the surface of the DIP pin, and is connected with a first side of the limiting bulge, and when the limiting bulge is located in the PCB slot hole, the side, facing the PCB slot hole, of the limiting bulge is the first side of the limiting bulge. The limiting bulge is arranged in the local portion, and after the DIP pin is plugged into the PCB slot hole, the movable range of the DIP pin in the PCB slot hole is narrowed, and thereby improving the positioning precision of the DIP pin. Furthermore, the problems that in the prior art, due to the fact that H is reduced or L is increased, the probability that a DIP pin cannot be plugged into a hole is increased, and the qualification rate of a production line is reduced are solved. Moreover, the first chamfer has guide and deviation correction effects, so that the difficulty of entering the PCB slot hole for the DIP pin and the limiting bulge is reduced.
Description
本申请要求在2018年12月12日提交中国国家知识产权局、申请号为201822081204.9、发明名称为“一种DIP引脚器件、封装结构及插拔装置”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application requires the priority of the Chinese patent application submitted to the State Intellectual Property Office of China on December 12, 2018, with the application number 201822081204.9 and the invention titled "a DIP pin device, packaging structure and plug-in device", all of which are The content is incorporated into this application by reference.
本申请涉及电子产品制造技术领域,特别是涉及一种DIP引脚器件、封装结构及插拔装置。This application relates to the technical field of electronic product manufacturing, in particular to a DIP pin device, a packaging structure, and a plug-in device.
目前,许多电子设备设置有双列直插式封装(dual inline-pin package,DIP)引脚,通过表面贴装技术(surface mounted technology,SMT)等方式,可将DIP引脚安装在印刷电路板(printed circuit board,PCB)上。其中,参见图1所示的焊接示意图,在PCB板上设置有PCB槽孔,在安装DIP引脚时,将DIP引脚***PCB槽孔内,并通过PCB槽孔内的焊锡将DIP引脚与PCB板焊接在一起。在图1中,PCB槽孔的宽度为H,DIP引脚的宽度称为L。At present, many electronic devices are equipped with dual in-line package (DIP) pins. DIP pins can be mounted on the printed circuit board through surface mounting technology (SMT) and other methods (printed circuit board, PCB). Among them, referring to the soldering schematic diagram shown in FIG. 1, a PCB slot is provided on the PCB board, when installing the DIP pin, the DIP pin is inserted into the PCB slot, and the DIP pin is inserted through the solder in the PCB slot Solder together with PCB board. In Figure 1, the width of the PCB slot is H, and the width of the DIP pin is called L.
但当DIP引脚与PCB槽孔之间的间隙(即H-L)过大时,则DIP引脚在PCB槽孔中活动范围较大,导致DIP引脚的定位精度不足,因此,DIP引脚在焊接之后,可能会出现偏移和扭转等问题。However, when the gap between the DIP pin and the PCB slot (ie, HL) is too large, the DIP pin has a large range of movement in the PCB slot, resulting in insufficient positioning accuracy of the DIP pin. Therefore, the DIP pin is After welding, problems such as offset and twisting may occur.
为了解决DIP引脚的定位精度不足的问题,参见图2(a)和图2(b)所示的焊接示意图,现有技术中通常采用减小PCB槽孔的宽度H,或者增大DIP引脚的宽度L的方法。当H减小或者L增大时,DIP引脚与PCB槽孔之间的间隙减小,相应的,DIP引脚在PCB槽孔中活动范围变小,从而提高了DIP引脚的定位精度。In order to solve the problem of insufficient positioning accuracy of DIP pins, please refer to the welding schematic diagrams shown in FIG. 2(a) and FIG. 2(b). In the prior art, the width H of the PCB slot is usually reduced, or the DIP lead is increased. The method of foot width L. When H decreases or L increases, the gap between the DIP pin and the PCB slot decreases. Correspondingly, the movement range of the DIP pin in the PCB slot becomes smaller, thereby improving the positioning accuracy of the DIP pin.
但是,发明人在本申请的研究过程中发现,上述两种方式由于减小了PCB槽孔的宽度H或者增大了DIP引脚的宽度L,导致DIP引脚进入PCB槽孔的难度增加,DIP引脚未进入PCB槽孔的概率(即不入孔概率)增加,进一步甚至导致电子产品生产线的优良率下降。经过试验发现,当DIP引脚的宽度L为0.15mm,PCB槽孔的宽度H为0.45mm时,H每减小0.05mm,则不入孔概率增加百万分之(parts per million,ppm)139,而L每增加0.1mm,则不入孔概率增加441ppm。也就是说,若通过减小PCB槽孔的宽度H或增大DIP引脚的宽度L的方法提高DIP引脚的定位精度,会增加DIP引脚的不入孔概率,甚至降低电子产品生产线的优良率。However, the inventor found in the research process of this application that the above two methods reduce the width H of the PCB slot or increase the width L of the DIP pin, which makes it more difficult for the DIP pin to enter the PCB slot, The probability that the DIP pin does not enter the PCB slot (that is, the probability of not entering the hole) increases, which further leads to a decline in the excellent rate of the electronic product production line. After testing, it was found that when the width L of the DIP pin is 0.15mm and the width H of the PCB slot is 0.45mm, the probability of not entering the hole increases by parts per million (ppm) when H decreases by 0.05mm 139, and every time L increases by 0.1mm, the probability of not entering the hole increases by 441ppm. That is to say, if the method of reducing the width H of the PCB slot or increasing the width L of the DIP pin improves the positioning accuracy of the DIP pin, it will increase the probability of the DIP pin not entering the hole, and even reduce the production line of the electronic product. Excellent rate.
实用新型内容Utility model content
为了解决现有技术中的DIP引脚定位精度低的问题,以及为了解决现有技术中通过减小H或者增大L的方式提高DIP引脚的定位精度时,所存在的不入孔概率增加,生产线的优良率下降的问题,本申请实施例公开一种双列直插式封装DIP引脚器件、封装结构和插拔装置。In order to solve the problem of low positioning accuracy of the DIP pin in the prior art, and to solve the problem of improving the positioning accuracy of the DIP pin by reducing H or increasing L in the prior art, the probability of existing non-intrusive holes increases In order to reduce the excellent rate of the production line, the embodiments of the present application disclose a dual in-line package DIP pin device, a package structure, and a plug-in device.
第一方面,本申请实施例提供一种双列直插式封装DIP引脚器件,包括:In a first aspect, an embodiment of the present application provides a dual in-line package DIP pin device, including:
DIP引脚、限位凸包和第一倒角;DIP pin, limit convex hull and first chamfer;
所述限位凸包位于所述DIP引脚的表面,当所述DIP引脚***印刷电路板PCB槽孔时,所述限位凸包位于PCB槽孔内;The limit convex hull is located on the surface of the DIP pin, and when the DIP pin is inserted into the PCB slot of the printed circuit board, the limit convex hull is located in the PCB slot;
所述第一倒角位于所述DIP引脚的表面,并且与所述限位凸包的第一侧相连接,当所述限位凸包位于所述PCB槽孔内时,所述限位凸包朝向所述PCB槽孔的一侧为所述限位凸包的第一侧。The first chamfer is located on the surface of the DIP pin and is connected to the first side of the limiting convex hull. When the limiting convex hull is located in the PCB slot, the limiting position The side of the convex hull facing the PCB slot is the first side of the limiting convex hull.
本申请实施例公开的公开的DIP引脚器件,在局部设置了限位凸包,当DIP引脚***PCB槽孔后,减少了PCB引脚在PCB槽孔内的可移动范围,从而能够提高DIP引脚的定位精度。并且,本申请实施例的方案并未减小PCB槽孔的宽度H,以及并未增大DIP引脚的宽度L,因此不会出现现有技术中由于减小H或者增大L,所导致的DIP引脚不入孔概率增加,生产线的优良率下降的问题。进一步的,由于在DIP引脚的表面设置了第一倒角,且DIP引脚进入PCB槽孔的过程中,第一倒角先于限位凸包进入PCB槽孔中,这种情况下,第一倒角便于DIP引脚进入PCB槽孔,具有一定的导向纠偏作用,减少了DIP引脚和限位凸包进入PCB槽孔的难度。The disclosed DIP pin device disclosed in the embodiment of the present application partially sets a limit convex hull. When the DIP pin is inserted into the PCB slot, the movable range of the PCB pin in the PCB slot is reduced, which can improve the DIP pin positioning accuracy. In addition, the solution of the embodiment of the present application does not reduce the width H of the PCB slot, and does not increase the width L of the DIP pin, so there will not be any problems caused by reducing H or increasing L in the prior art. The probability that the DIP pin does not enter the hole increases, and the excellent rate of the production line decreases. Further, since the first chamfer is provided on the surface of the DIP pin, and the DIP pin enters the PCB slot, the first chamfer enters the PCB slot before the limit bump, in this case, The first chamfer is convenient for the DIP pin to enter the PCB slot, and has a certain guiding correction effect, which reduces the difficulty of the DIP pin and the limiting convex hull entering the PCB slot.
结合第一方面,在第一方面第一种可能的实现方式中,所述限位凸包以焊接的形式固定在所述DIP引脚的表面;With reference to the first aspect, in a first possible implementation manner of the first aspect, the limiting convex hull is fixed on the surface of the DIP pin in the form of welding;
或者,所述限位凸包与所述DIP引脚为一体化结构。Alternatively, the limit convex hull and the DIP pin are of an integrated structure.
结合第一方面,在第一方面第二种可能的实现方式中,所述限位凸包和/或所述第一倒角的材质与所述DIP引脚的材质相同;With reference to the first aspect, in a second possible implementation manner of the first aspect, the material of the limiting convex hull and/or the first chamfer is the same as the material of the DIP pin;
或者,or,
所述限位凸包和/或所述第一倒角的材质为金属材质。The material of the limiting convex hull and/or the first chamfer is a metal material.
结合第一方面,在第一方面第三种可能的实现方式中,所述第一倒角与所述DIP引脚之间的夹角的角度范围为[120°,160°];With reference to the first aspect, in a third possible implementation manner of the first aspect, the angle range between the first chamfer and the DIP pin is [120°, 160°];
其中,所述第一倒角的第一目标切线与所述DIP引脚的平面形成的钝角为所述第一倒角与所述DIP引脚之间的夹角,所述第一目标切线为所述第一倒角的各条切线中,穿过第一目标点的切线,所述第一目标点为所述第一倒角与所述DIP引脚的连接点。The obtuse angle formed by the first target tangent of the first chamfer and the plane of the DIP pin is the angle between the first chamfer and the DIP pin, and the first target tangent is Among each tangent line of the first chamfer, a tangent line passing through a first target point, the first target point is a connection point of the first chamfer and the DIP pin.
结合第一方面,在第一方面第四种可能的实现方式中,还包括:With reference to the first aspect, in a fourth possible implementation manner of the first aspect, the method further includes:
第二倒角;Second chamfer
所述第二倒角位于所述DIP引脚的表面,并且与所述限位凸包的第二侧相连接,当所述限位凸包位于所述PCB槽孔内时,所述限位凸包背向所述PCB槽孔的一侧为第二侧;The second chamfer is located on the surface of the DIP pin and is connected to the second side of the limiting convex hull. When the limiting convex hull is located in the PCB slot, the limiting position The side of the convex hull facing away from the PCB slot is the second side;
当所述DIP引脚***印刷电路板PCB槽孔时,所述第二倒角位于所述PCB槽孔内。When the DIP pin is inserted into the PCB slot of the printed circuit board, the second chamfer is located in the PCB slot.
通过第二倒角,能够使DIP引脚与PCB槽孔内的锡膏的接触面积进一步增加,从而能够进一步增加DIP引脚的焊接强度。Through the second chamfer, the contact area between the DIP pin and the solder paste in the PCB slot can be further increased, so that the soldering strength of the DIP pin can be further increased.
结合第一方面第四种可能的实现方式,在第一方面第五种可能的实现方式中,With reference to the fourth possible implementation manner of the first aspect, in the fifth possible implementation manner of the first aspect,
所述第二倒角的材质与所述DIP引脚的材质相同;The material of the second chamfer is the same as the material of the DIP pin;
或者,or,
所述限位凸包和所述第二倒角的材质为金属材质。The materials of the limiting convex hull and the second chamfer are metal materials.
结合第一方面第四种可能的实现方式,在第一方面第六种可能的实现方式中,With reference to the fourth possible implementation manner of the first aspect, in the sixth possible implementation manner of the first aspect,
所述第二倒角与所述DIP引脚之间的夹角的角度范围为[120°,160°];The angle range between the second chamfer and the DIP pin is [120°, 160°];
其中,所述第二倒角的第二目标切线与所述DIP引脚的平面形成的钝角为所述第二倒角与所述DIP引脚之间的夹角,所述第二目标切线为所述第二倒角的各条切线中,穿过第二目标点的切线,所述第二目标点为所述第二倒角与所述DIP引脚的连接点。Where, the obtuse angle formed by the second target tangent of the second chamfer and the plane of the DIP pin is the angle between the second chamfer and the DIP pin, and the second target tangent is Each tangent line of the second chamfer passes through a tangent line of a second target point, and the second target point is a connection point of the second chamfer and the DIP pin.
第二方面,本申请实施例提供一种封装结构,包括:In a second aspect, an embodiment of the present application provides a packaging structure, including:
如第一方面所述的DIP引脚器件,以及设置有PCB槽孔的PCB板;A DIP pin device as described in the first aspect, and a PCB board provided with PCB slots;
所述DIP引脚器件位于所述PCB槽孔内,并通过所述PCB槽孔内的锡膏固定在所述PCB板上。The DIP pin device is located in the PCB slot, and is fixed on the PCB board by the solder paste in the PCB slot.
第三方面,本申请实施例提供一种插拔装置,包括:In a third aspect, an embodiment of the present application provides a plug-in device, including:
如第一方面所述的DIP引脚器件。The DIP pin device as described in the first aspect.
结合第三方面,在第三方面第一种可能的实现方式中,所述插拔装置为用户身份模块SIM卡座、耳机座或通用串行总线USB连接器。With reference to the third aspect, in a first possible implementation manner of the third aspect, the plug-in device is a user identity module SIM card holder, a headset holder, or a universal serial bus USB connector.
本申请实施例公开一种DIP引脚器件、封装结构及插拔装置,其中,该DIP引脚器件在局部设置了限位凸包,当DIP引脚***PCB槽孔后,减少了PCB引脚在PCB槽孔内的可移动范围,从而能够提高DIP引脚的定位精度。并且,本申请实施例的方案并未减小PCB槽孔的宽度H,以及并未增大DIP引脚的宽度L,因此不会出现现有技术中由于减小H或者增大L,所导致的DIP引脚不入孔概率增加,生产线的优良率下降的问题。进一步的,由于在DIP引脚的表面设置了第一倒角,且DIP引脚进入PCB槽孔的过程中,第一倒角先于限位凸包进入PCB槽孔中,这种情况下,第一倒角便于DIP引脚进入PCB槽孔,具有一定的导向纠偏作用,减少了DIP引脚和限位凸包进入PCB槽孔的难度。The embodiments of the present application disclose a DIP pin device, a packaging structure, and a plug-in device, wherein the DIP pin device is partially provided with a limiting convex hull, and when the DIP pin is inserted into the PCB slot, the PCB pin is reduced The movable range in the PCB slot hole can improve the positioning accuracy of the DIP pin. In addition, the solution of the embodiment of the present application does not reduce the width H of the PCB slot, and does not increase the width L of the DIP pin, so there will not be any problems caused by reducing H or increasing L in the prior art. The probability that the DIP pin does not enter the hole increases, and the excellent rate of the production line decreases. Further, since the first chamfer is provided on the surface of the DIP pin, and the DIP pin enters the PCB slot, the first chamfer enters the PCB slot before the limit bump, in this case, The first chamfer is convenient for the DIP pin to enter the PCB slot, and has a certain guiding correction effect, which reduces the difficulty of the DIP pin and the limiting convex hull entering the PCB slot.
另外,若采用现有技术中的减小PCB槽孔的宽度H的方案,则需要调整PCB板的规格,重新制作H较小的PCB板。而且,H越小,所需的PCB板的加工精度越高,这种情况下,往往需要特殊尺寸的铣刀加工,才能得到符合需求的PCB板。并且,还会增加PCB板生产过程中的报废率,从而增加PCB板的制作成本。经过多次试验发现,若PCB槽孔的宽度从0.45mm降至0.4mm,则PCB板的制造成本上升0.1-0.3RMB/PCS。而且,由于PCB槽孔的宽度减小,PCB槽孔所能容纳的焊锡体积减少,即焊接锡量较少,会降低DIP引脚的焊接强度。In addition, if the solution of reducing the width H of the PCB slot in the prior art is adopted, it is necessary to adjust the specifications of the PCB board and re-make the PCB board with a smaller H. Moreover, the smaller H is, the higher the processing accuracy of the required PCB board. In this case, a special size milling cutter is often required to obtain a PCB board that meets the needs. In addition, the scrap rate in the production process of the PCB board will be increased, thereby increasing the production cost of the PCB board. After many tests, it was found that if the width of the PCB slot is reduced from 0.45mm to 0.4mm, the manufacturing cost of the PCB board will increase by 0.1-0.3RMB/PCS. Moreover, because the width of the PCB slot is reduced, the volume of solder that the PCB slot can accommodate is reduced, that is, the amount of solder is less, which will reduce the soldering strength of the DIP pin.
而本申请实施例公开的DIP引脚器件,不需要调整PCB板的规格,因此不需要重新制作H较小的PCB板,不会额外增加PCB板的制造成本。并且,由于PCB槽孔的宽度未减小,不会影响PCB槽孔所能容纳的焊锡量,因此,不会出现由焊锡减少所导致的DIP引脚的焊接强度降低的问题。The DIP pin devices disclosed in the embodiments of the present application do not need to adjust the specifications of the PCB board, so there is no need to re-produce the PCB board with a smaller H, and the manufacturing cost of the PCB board will not be additionally increased. In addition, since the width of the PCB slot is not reduced, it will not affect the amount of solder that the PCB slot can accommodate. Therefore, the problem of reduced soldering strength of the DIP pin caused by the reduction in solder will not occur.
另外,若采用现有技术中的增大DIP引脚宽度L的方案,由于DIP引脚宽度增加,则DIP引脚的用料增加,DIP引脚的重量增加,导致应用DIP引脚的电子设备的重量增加,对于DIP引脚较多的电子设备,重量增加更加明显,从而不利于电子设备的小型化和轻型化。In addition, if the solution of increasing the width D of the DIP pin in the prior art is adopted, as the width of the DIP pin increases, the materials used for the DIP pin increase and the weight of the DIP pin increases, resulting in electronic equipment using the DIP pin The increase in the weight of electronic devices with more DIP pins makes the weight increase more obvious, which is not conducive to the miniaturization and lightweight of electronic devices.
而本申请实施例公开的DIP引脚器件,虽然在DIP引脚上设置限位凸包和第一倒角,但相对于增大DIP引脚宽度L的方案来说,对DIP引脚的重量的影响较小,因此,更利于电子设备的小型化和轻型化。In the DIP pin device disclosed in the embodiment of the present application, although the limit convex hull and the first chamfer are provided on the DIP pin, compared with the scheme of increasing the width L of the DIP pin, the weight of the DIP pin The impact is small, so it is more conducive to the miniaturization and light weight of electronic equipment.
并且,在本申请实施例公开的DIP引脚器件中,当DIP引脚器件通过PCB槽孔焊接在PCB板上时,由于在DIP引脚的表面设置有限位凸包和第一倒角,相对于DIP引脚来说,增加了与PCB槽孔内的锡膏的接触面积,限位凸包和第一倒角起到钉楔作用,因此DIP引脚在受力时,不易从PCB板上剥离,因而还能够增加DIP引脚的焊接强度。In addition, in the DIP pin device disclosed in the embodiment of the present application, when the DIP pin device is soldered to the PCB through the PCB slot, due to the limited convex hull and the first chamfer provided on the surface of the DIP pin, the relative For the DIP pin, the contact area with the solder paste in the PCB slot is increased. The limiting convex hull and the first chamfer function as a nail wedge. Therefore, when the DIP pin is stressed, it is not easy to remove it from the PCB board. Peeling, it can also increase the soldering strength of DIP pins.
为了更清楚地说明本申请的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,对于本领域普通技术人员而言,在不付出创造性劳动性的前提下,还可以 根据这些附图获得其他的附图。In order to more clearly explain the technical solution of the present application, the following will briefly introduce the drawings that need to be used in the embodiments. Obviously, for those of ordinary skill in the art, without paying creative labor, Other drawings can also be obtained from these drawings.
图1为现有技术公开的一种DIP引脚的焊接示意图;1 is a schematic diagram of a DIP pin welding disclosed in the prior art;
图2(a)为现有技术公开的另一种DIP引脚的焊接示意图;2(a) is a schematic diagram of another DIP pin welding disclosed in the prior art;
图2(b)为现有技术公开的另一种DIP引脚的焊接示意图;2(b) is a schematic diagram of another DIP pin welding disclosed in the prior art;
图3(a)为本申请实施例公开的一种DIP引脚器件的正视图;3(a) is a front view of a DIP pin device disclosed in an embodiment of the present application;
图3(b)为本申请实施例公开的一种DIP引脚器件的俯视图;3(b) is a top view of a DIP pin device disclosed in an embodiment of the present application;
图3(c)为本申请实施例公开的一种DIP引脚器件的右视图;3(c) is a right side view of a DIP pin device disclosed in an embodiment of the present application;
图4(a)为本申请实施例公开的一种DIP引脚器件的焊接情况的正视图;4(a) is a front view of a soldering situation of a DIP pin device disclosed in an embodiment of the present application;
图4(b)为本申请实施例公开的一种DIP引脚器件的焊接情况的右视图;FIG. 4(b) is a right side view of a welding situation of a DIP pin device disclosed in an embodiment of the present application;
图5为本申请实施例公开的一种DIP引脚器件的焊接情况的右视图;5 is a right side view of a welding situation of a DIP pin device disclosed in an embodiment of the present application;
图6为本申请实施例公开的一种封装结构的切面示意图;6 is a schematic cross-sectional view of a packaging structure disclosed in an embodiment of the present application;
图7为本申请实施例公开的一种插拔装置的结构示意图。7 is a schematic structural diagram of a plug-in device disclosed in an embodiment of the present application.
为了解决现有技术中的DIP引脚定位精度低的问题,以及为了解决现有技术中通过减小H或者增大L的方式提高DIP引脚的定位精度时,所存在的不入孔概率增加,生产线的优良率下降的问题,本申请实施例公开一种双列直插式封装DIP引脚器件、封装结构和插拔装置。In order to solve the problem of low positioning accuracy of the DIP pin in the prior art, and to solve the problem of improving the positioning accuracy of the DIP pin by reducing H or increasing L in the prior art, the probability of existing non-intrusive holes increases In order to reduce the excellent rate of the production line, the embodiments of the present application disclose a dual in-line package DIP pin device, a package structure, and a plug-in device.
本申请的第一实施例公开一种双列直插式封装DIP引脚器件,参见图3(a)、图3(b)和3(c)分别所示的DIP引脚器件的正视图、俯视图和右视图,该DIP引脚器件包括:DIP引脚10、限位凸包20和第一倒角30。The first embodiment of the present application discloses a dual in-line package DIP pin device, see the front view of the DIP pin device shown in FIGS. 3(a), 3(b) and 3(c), From a top view and a right view, the DIP pin device includes: a DIP pin 10, a limiting convex hull 20, and a first chamfer 30.
其中,所述限位凸包20位于所述DIP引脚10的表面。Wherein, the limiting convex hull 20 is located on the surface of the DIP pin 10.
参见图4(a)和图4(b)分别所示的焊接情况的正视图和右视图,当所述DIP引脚10***印刷电路板PCB槽孔时,所述限位凸包20位于PCB槽孔内。Referring to the front view and the right view of the soldering situation shown in FIG. 4(a) and FIG. 4(b) respectively, when the DIP pin 10 is inserted into the PCB slot of the printed circuit board, the limit bump 20 is located on the PCB Inside the slot.
另外,所述第一倒角30位于DIP引脚的表面,并且与所述限位凸包20的第一侧21相连接,当所述限位凸包20位于所述PCB槽孔内时,所述限位凸包20朝向所述PCB槽孔的一侧为所述限位凸包20的第一侧。In addition, the first chamfer 30 is located on the surface of the DIP pin and is connected to the first side 21 of the limiting convex hull 20. When the limiting convex hull 20 is located in the PCB slot, The side of the limiting convex hull 20 facing the PCB slot is the first side of the limiting convex hull 20.
也就是说,第一倒角30设置在限位凸包20伸入至PCB槽孔的一侧。其中,第一倒角30与限位凸包20的第一侧21相连接,这种情况下,第一倒角30与限位凸包20可以为一体化结构,即第一倒角30与限位凸包20是一体的,或者,第一倒角30与限位凸包20也可以为两个独立的部分,并且,这两个部分可通过焊接或胶接等方式固定连接在一起。That is to say, the first chamfer 30 is disposed on the side where the limiting protrusion 20 extends into the PCB slot. The first chamfer 30 is connected to the first side 21 of the limiting convex hull 20. In this case, the first chamfer 30 and the limiting convex hull 20 may be an integrated structure, that is, the first chamfer 30 and The limiting convex hull 20 is integrated, or the first chamfer 30 and the limiting convex hull 20 may be two separate parts, and the two parts may be fixedly connected together by welding or gluing.
在本申请实施例公开的DIP引脚器件中,当所述DIP引脚10***PCB槽孔时,所述限位凸包20位于PCB槽孔内,并且第一倒角30与限位凸包20的第一侧21相连接,因此,当DIP引脚10***PCB槽孔时,第一倒角30与限位凸包20均位于PCB槽孔内。并且,在将本申请实施例公开的DIP引脚器件焊接在PCB板的过程中,第一倒角30随DIP引脚10先进入PCB槽孔中,然后,限位凸包20再随着DIP引脚10进入PCB槽孔中。In the DIP pin device disclosed in the embodiment of the present application, when the DIP pin 10 is inserted into the PCB slot, the limiting convex hull 20 is located in the PCB slot, and the first chamfer 30 and the limiting convex hull The first side 21 of the 20 is connected. Therefore, when the DIP pin 10 is inserted into the PCB slot, the first chamfer 30 and the limiting convex package 20 are both located in the PCB slot. Moreover, in the process of soldering the DIP pin device disclosed in the embodiment of the present application to the PCB board, the first chamfer 30 first enters the PCB slot with the DIP pin 10, and then, the limiting convex hull 20 follows the DIP Pin 10 enters the PCB slot.
另外,如图3(a)、图3(b)和3(c)所示,限位凸包20的侧边可设置在弧形,从而便于DIP引脚器件进入PCB槽孔内。In addition, as shown in FIGS. 3(a), 3(b) and 3(c), the sides of the limiting convex hull 20 can be arranged in an arc shape, so that the DIP pin device can enter the PCB slot.
本申请第一实施例公开的DIP引脚器件在局部设置了限位凸包,当DIP引脚***PCB槽孔后,减少了PCB引脚在PCB槽孔内的可移动范围,从而能够提高DIP引脚的定位精度。并且,本申请实施例的方案并未减小PCB槽孔的宽度H,以及并未增大DIP引脚的宽度L,因此不会出现现有技术中由于减小H或者增大L,所导致的DIP引脚不入孔概率增加,生产 线的优良率下降的问题。进一步的,由于在DIP引脚的表面设置了第一倒角,且DIP引脚进入PCB槽孔的过程中,第一倒角先于限位凸包进入PCB槽孔中,这种情况下,第一倒角便于DIP引脚进入PCB槽孔,具有一定的导向纠偏作用,减少了DIP引脚和限位凸包进入PCB槽孔的难度。The DIP pin device disclosed in the first embodiment of the present application partially sets a limit convex hull. When the DIP pin is inserted into the PCB slot, the movable range of the PCB pin in the PCB slot is reduced, thereby improving the DIP Pin positioning accuracy. In addition, the solution of the embodiment of the present application does not reduce the width H of the PCB slot, and does not increase the width L of the DIP pin, so there will not be any problems caused by reducing H or increasing L in the prior art. The probability that the DIP pin does not enter the hole increases, and the excellent rate of the production line decreases. Further, since the first chamfer is provided on the surface of the DIP pin, and the DIP pin enters the PCB slot, the first chamfer enters the PCB slot before the limit bump, in this case, The first chamfer is convenient for the DIP pin to enter the PCB slot, and has a certain guiding correction effect, which reduces the difficulty of the DIP pin and the limiting convex hull entering the PCB slot.
另外,若采用现有技术中的减小PCB槽孔的宽度H的方案,则需要调整PCB板的规格,重新制作H较小的PCB板。而且,H越小,所需的PCB板的加工精度越高,这种情况下,往往需要特殊尺寸的铣刀加工,才能得到符合需求的PCB板。并且,还会增加PCB板生产过程中的报废率,从而增加PCB板的制作成本。经过多次试验发现,若PCB槽孔的宽度从0.45mm降至0.4mm,则PCB板的制造成本上升0.1-0.3RMB/PCS。而且,由于PCB槽孔的宽度减小,PCB槽孔所能容纳的焊锡体积减少,即焊接锡量较少,会降低DIP引脚的焊接强度。In addition, if the solution of reducing the width H of the PCB slot in the prior art is adopted, it is necessary to adjust the specifications of the PCB board and re-make the PCB board with a smaller H. Moreover, the smaller H is, the higher the processing accuracy of the required PCB board. In this case, a special size milling cutter is often required to obtain a PCB board that meets the needs. In addition, the scrap rate in the production process of the PCB board will be increased, thereby increasing the production cost of the PCB board. After many tests, it was found that if the width of the PCB slot is reduced from 0.45mm to 0.4mm, the manufacturing cost of the PCB board will increase by 0.1-0.3RMB/PCS. Moreover, because the width of the PCB slot is reduced, the volume of solder that the PCB slot can accommodate is reduced, that is, the amount of solder is less, which will reduce the soldering strength of the DIP pin.
而本申请实施例公开的DIP引脚器件,不需要调整PCB板的规格,因此不需要重新制作H较小的PCB板,不会额外增加PCB板的制造成本。并且,由于PCB槽孔的宽度未减小,不会影响PCB槽孔所能容纳的焊锡量,因此,不会出现由焊锡减少所导致的DIP引脚的焊接强度降低的问题。The DIP pin devices disclosed in the embodiments of the present application do not need to adjust the specifications of the PCB board, so there is no need to re-produce the PCB board with a smaller H, and the manufacturing cost of the PCB board will not be additionally increased. In addition, since the width of the PCB slot is not reduced, it will not affect the amount of solder that the PCB slot can accommodate. Therefore, the problem of reduced soldering strength of the DIP pin caused by the reduction in solder will not occur.
另外,若采用现有技术中的增大DIP引脚宽度L的方案,由于DIP引脚宽度增加,则DIP引脚的用料增加,DIP引脚的重量增加,导致应用DIP引脚的电子设备的重量增加,对于DIP引脚较多的电子设备,重量增加更加明显,从而不利于电子设备的小型化和轻型化。In addition, if the solution of increasing the width D of the DIP pin in the prior art is adopted, as the width of the DIP pin increases, the materials used for the DIP pin increase and the weight of the DIP pin increases, resulting in electronic equipment using the DIP pin The increase in the weight of electronic devices with more DIP pins makes the weight increase more obvious, which is not conducive to the miniaturization and lightweight of electronic devices.
而本申请实施例公开的DIP引脚器件,虽然在DIP引脚上设置限位凸包和第一倒角,但相对于增大DIP引脚宽度L的方案来说,对DIP引脚的重量的影响较小,因此,更利于电子设备的小型化和轻型化。In the DIP pin device disclosed in the embodiment of the present application, although the limit convex hull and the first chamfer are provided on the DIP pin, compared with the scheme of increasing the width L of the DIP pin, the weight of the DIP pin The impact is small, so it is more conducive to the miniaturization and light weight of electronic equipment.
并且,在本申请实施例公开的DIP引脚器件中,当DIP引脚器件通过PCB槽孔焊接在PCB板上时,由于在DIP引脚的表面设置有限位凸包和第一倒角,相对于DIP引脚来说,增加了与PCB槽孔内的锡膏的接触面积,限位凸包和第一倒角起到钉楔作用,因此DIP引脚在受力时,不易从PCB板上剥离,因而还能够增加DIP引脚的焊接强度。In addition, in the DIP pin device disclosed in the embodiment of the present application, when the DIP pin device is soldered to the PCB through the PCB slot, due to the limited convex hull and the first chamfer provided on the surface of the DIP pin, the relative For the DIP pin, the contact area with the solder paste in the PCB slot is increased. The limiting convex hull and the first chamfer function as a nail wedge. Therefore, when the DIP pin is stressed, it is not easy to remove it from the PCB board. Peeling, it can also increase the soldering strength of DIP pins.
进一步的,在本申请实施例公开的DIP引脚器件中,限位凸包可通过多种方式固定在DIP引脚的表面。在其中一种方式中,所述限位凸包以焊接的方式固定在所述DIP引脚的表面。或者,所述限位凸包与所述DIP引脚为一体化结构,这种情况下,所述限位凸包可以是所述DIP引脚上冲压出来的。Further, in the DIP pin device disclosed in the embodiments of the present application, the limiting convex hull may be fixed on the surface of the DIP pin in various ways. In one of the modes, the limiting convex hull is fixed on the surface of the DIP pin by welding. Alternatively, the limit convex hull and the DIP pin have an integrated structure. In this case, the limit convex hull may be punched out from the DIP pin.
另外,还可以通过胶接等方式将限位凸包固定在DIP引脚的表面,本申请实施例对此不做限定。In addition, the limiting convex hull can also be fixed on the surface of the DIP pin by means of adhesive bonding, which is not limited in the embodiment of the present application.
相应的,第一倒角也可以通过多种方式固定在DIP引脚的表面。例如,第一倒角可通过焊接的方式固定在所述DIP引脚的表面,或者,第一倒角可以与DIP引脚为一体化结构。另外,第一倒角也可以通过胶接等方式固定在DIP引脚的表面,本申请实施例对此不做限定。Correspondingly, the first chamfer can also be fixed on the surface of the DIP pin in various ways. For example, the first chamfer may be fixed on the surface of the DIP pin by welding, or the first chamfer may be an integrated structure with the DIP pin. In addition, the first chamfer can also be fixed on the surface of the DIP pin by adhesive bonding or the like, which is not limited in the embodiment of the present application.
另外,限位凸包和/或第一倒角的材质也可以为多种类型。例如,所述所述限位凸包和/或所述第一倒角的材质与所述DIP引脚的材质相同。或者,在另一种可行的方式中,所述限位凸包和/或所述第一倒角的材质为金属材质。例如,所述金属材质为洋白铜或不锈钢。In addition, the materials of the limiting convex hull and/or the first chamfer can also be of various types. For example, the material of the limiting convex hull and/or the first chamfer is the same as the material of the DIP pin. Or, in another feasible manner, the material of the limiting convex hull and/or the first chamfer is a metal material. For example, the metal material is nickel white copper or stainless steel.
进一步的,在本申请实施例公开的DIP引脚器件中,所述第一倒角与所述DIP引脚之间的夹角的角度范围为[120°,160°]。Further, in the DIP pin device disclosed in the embodiment of the present application, the angle range between the angle between the first chamfer and the DIP pin is [120°, 160°].
其中,所述第一倒角的第一目标切线与所述DIP引脚的平面形成的钝角为所述第一倒角与所述DIP引脚之间的夹角,所述第一目标切线为所述第一倒角的各条切线中,穿过第一目 标点的切线,所述第一目标点为所述第一倒角与所述DIP引脚的连接点。The obtuse angle formed by the first target tangent of the first chamfer and the plane of the DIP pin is the angle between the first chamfer and the DIP pin, and the first target tangent is Among each tangent line of the first chamfer, a tangent line passing through a first target point, the first target point is a connection point of the first chamfer and the DIP pin.
参见图5所示的焊接情况的右视图,该图中,第一倒角与DIP引脚的连接点为点A,也就是说,点A为第一目标点。第一倒角往往对应多条切线,其中,各条切线中经过点A的切线即为第一目标切线,而第一目标切线与DIP引脚所在平面形成的钝角θ即为第一倒角与DIP引脚之间的夹角。Referring to the right view of the welding situation shown in FIG. 5, in this figure, the connection point between the first chamfer and the DIP pin is point A, that is, point A is the first target point. The first chamfer often corresponds to multiple tangents. Among them, the tangent passing through point A in each tangent is the first target tangent, and the obtuse angle θ formed by the first target tangent and the plane where the DIP pin lies is the first chamfer and Angle between DIP pins.
若第一倒角与DIP引脚之间的夹角θ过大,则限位凸包越贴近DIP引脚,限位凸包的厚度越小,则本申请实施例公开的DIP引脚器件越倾向于现有技术中的DIP引脚,这种情况下,第一倒角的限位效果较差。另外,若第一倒角与DIP引脚之间的夹角θ过小,则限位凸包相对于DIP引脚来说较为突出,容易受到PCB槽孔的孔壁的干涉,这种情况下,第一倒角起到的导向作用较小。因此,在本申请实施例中,通常设置120°≤θ≤160°,即可将第一倒角与DIP引脚之间的夹角θ设置为120°和160°之间的任意值。例如,可将第一倒角与DIP引脚之间的夹角θ设置为120°,或者,将第一倒角与DIP引脚之间的夹角θ设置为160°,或者,将第一倒角与DIP引脚之间的夹角θ设置为120°与160°的中间值(即140°)。If the angle θ between the first chamfer and the DIP pin is too large, the closer the limiting convex hull is to the DIP pin, and the smaller the thickness of the limiting convex hull, the more the DIP pin device disclosed in the embodiment of the present application The DIP pin in the prior art is preferred, in this case, the limiting effect of the first chamfer is poor. In addition, if the angle θ between the first chamfer and the DIP pin is too small, the limiting convex hull is more prominent than the DIP pin, and it is easily interfered by the hole wall of the PCB slot, in this case , The guiding effect of the first chamfer is less. Therefore, in the embodiment of the present application, generally setting 120°≦θ≦160°, the angle θ between the first chamfer and the DIP pin can be set to any value between 120° and 160°. For example, the angle θ between the first chamfer and the DIP pin can be set to 120°, or the angle θ between the first chamfer and the DIP pin can be set to 160°, or the first The angle θ between the chamfer and the DIP pin is set to the middle value of 120° and 160° (that is, 140°).
进一步的,在本申请实施例所公开的DIP引脚器件中,还包括:第二倒角40。Further, the DIP pin device disclosed in the embodiment of the present application further includes: a second chamfer 40.
所述第二倒角40位于所述DIP引脚10的表面,并且与所述限位凸包20的第二侧相连接,当所述限位凸包20位于所述PCB槽孔内时,所述限位凸包20背向所述PCB槽孔的一侧为第二侧;The second chamfer 40 is located on the surface of the DIP pin 10 and is connected to the second side of the limiting convex hull 20. When the limiting convex hull 20 is located in the PCB slot, The side of the limiting convex hull 20 facing away from the PCB slot is the second side;
当所述DIP引脚10***印刷电路板PCB槽孔时,所述第二倒角40位于所述PCB槽孔内。When the DIP pin 10 is inserted into the PCB slot of the printed circuit board, the second chamfer 40 is located in the PCB slot.
也就是说,参见图4(a)和图4(b),当DIP引脚***PCB槽孔时,第二倒角位于第一倒角和DIP引脚的上方。这种情况下,由于第二倒角的存在,与PCB槽孔内的锡膏的接触面积进一步增加,从而能够进一步增加DIP引脚的焊接强度。That is, referring to FIGS. 4(a) and 4(b), when the DIP pin is inserted into the PCB slot, the second chamfer is located above the first chamfer and the DIP pin. In this case, due to the existence of the second chamfer, the contact area with the solder paste in the PCB slot is further increased, so that the soldering strength of the DIP pin can be further increased.
其中,第二倒角与限位凸包可以为一体化结构,或者,所述第二角与限位凸包也可以为两个独立的结构。Wherein, the second chamfer and the limiting convex hull may be an integrated structure, or the second angle and the limiting convex hull may also be two independent structures.
另外,第二倒角可通过多种方式固定在DIP引脚的表面。例如,第二倒角可通过焊接的方式固定在所述DIP引脚的表面,或者,所述限位凸包与所述DIP引脚为一体化结构,这种情况下,所述限位凸包可以是所述DIP引脚上冲压出来的。In addition, the second chamfer can be fixed on the surface of the DIP pin in various ways. For example, the second chamfer can be fixed on the surface of the DIP pin by soldering, or the limit convex hull and the DIP pin have an integrated structure. In this case, the limit convex The package may be punched out from the DIP pin.
另外,还可以通过胶接等方式将第二倒角固定在DIP引脚的表面。本申请实施例对此不作限定。In addition, the second chamfer can also be fixed on the surface of the DIP pin by glue bonding or the like. This embodiment of the present application does not limit this.
第二倒角的材质也可以为多种类型。例如,所述第二倒角的材质与所述DIP引脚的材质相同。或者,所述第二倒角的材质为金属材质。例如,所述金属材质为洋白铜或不锈钢。The material of the second chamfer can also be of various types. For example, the material of the second chamfer is the same as the material of the DIP pin. Alternatively, the material of the second chamfer is a metal material. For example, the metal material is nickel white copper or stainless steel.
进一步的,在本申请实施例公开的DIP引脚器件中,所述第二倒角与所述DIP引脚之间的夹角的角度范围为[120°,160°]。Further, in the DIP pin device disclosed in the embodiment of the present application, the angle range between the second chamfer and the DIP pin is [120°, 160°].
其中,所述第二倒角的第二目标切线与所述DIP引脚的平面形成的钝角为所述第二倒角与所述DIP引脚之间的夹角,所述第二目标切线为所述第二倒角的各条切线中,穿过第二目标点的切线,所述第二目标点为所述第二倒角与所述DIP引脚的连接点。Where, the obtuse angle formed by the second target tangent of the second chamfer and the plane of the DIP pin is the angle between the second chamfer and the DIP pin, and the second target tangent is Each tangent line of the second chamfer passes through a tangent line of a second target point, and the second target point is a connection point of the second chamfer and the DIP pin.
本申请第二实施例公开一种封装结构,参见图6所示的封装结构的切面示意图,该封装结构包括本申请的第一实施例所公开的DIP引脚器件100,并且还包括设置有PCB槽孔210的PCB板200。The second embodiment of the present application discloses a packaging structure. Refer to the schematic cross-sectional view of the packaging structure shown in FIG. 6. The packaging structure includes the DIP pin device 100 disclosed in the first embodiment of the present application, and further includes a PCB. The PCB 200 of the slot 210.
在该封装结构中,所述DIP引脚器件100位于所述PCB槽孔210内,并通过所述PCB 槽孔210内的锡膏固定在所述PCB板200上。In this packaging structure, the DIP pin device 100 is located in the PCB slot 210 and is fixed on the PCB board 200 by solder paste in the PCB slot 210.
在本申请第三实施例中,还公开一种插拔装置,该插拔装置包括本申请第一实施例所公开的DIP引脚器件。In a third embodiment of the present application, a plug-in device is also disclosed. The plug-in device includes the DIP pin device disclosed in the first embodiment of the present application.
其中,该插拔装置为用户身份模块SIM卡座、耳机座或通用串行总线USB连接器。当然,该插拔装置还可以为其他具有DIP引脚的装置,本申请实施例对此不作限定。Wherein, the plug-in device is a SIM card holder of a user identity module, an earphone holder or a USB connector of a universal serial bus. Of course, the plug-in device can also be other devices with DIP pins, which are not limited in the embodiments of the present application.
若该插拔装置为SIM卡座,则结构示意图如图6所示,其中,图6为SIM卡座的示意图,该图中圈出的部分包含本申请实施例公开的DIP引脚器件。If the plug-in device is a SIM card holder, the schematic structural diagram is shown in FIG. 6, wherein FIG. 6 is a schematic diagram of the SIM card holder, and the circled part in the figure includes the DIP pin device disclosed in the embodiment of the present application.
现有技术中的SIM卡座中,根据业界常规设计,DIP引脚宽度L通常为0.15mm,PCB槽孔的宽度H通常为0.45mm。多次试验表明,该SIM卡座中的DIP引脚在焊接之后,DIP引脚在PCB槽孔内的可移动范围过大,大约会造成8.9%卡托插拔浮高问题,而正常量产的SIM卡座插拔浮高需低于3%,也就是说,现有技术中的SIM卡座存在定位精度不足的问题。In the SIM card holder in the prior art, according to the conventional design in the industry, the width L of the DIP pin is usually 0.15 mm, and the width H of the PCB slot is usually 0.45 mm. Multiple tests have shown that after soldering the DIP pin in the SIM card holder, the movable range of the DIP pin in the PCB slot is too large, which will cause about 8.9% card tray floating height problem, and normal mass production The floating height of the SIM card holder needs to be less than 3%, that is to say, the SIM card holder in the prior art has the problem of insufficient positioning accuracy.
而本申请实施例公开的SIM卡座,设置DIP引脚器件,即在DIP引脚表面设置限位凸包和第一倒角,另外,还可以设置第二倒角,从而降低了DIP引脚在PCB槽孔内的可移动范围,提升了SIM卡座的定位精度。The SIM card holder disclosed in the embodiment of the present application is provided with a DIP pin device, that is, a limit convex hull and a first chamfer are provided on the surface of the DIP pin, and a second chamfer can also be provided, thereby reducing the DIP pin The movable range in the PCB slot improves the positioning accuracy of the SIM card holder.
其中,在SIM卡座中,限位凸包的宽度通常为0.05mm。这种情况下,经过多次试验,本申请实施例公开的SIM卡座的卡托插拔浮高不良率由8.9%降低至1.2%,从而能够满足正常量产质量标准。Among them, in the SIM card holder, the width of the limiting convex hull is usually 0.05 mm. In this case, after multiple tests, the SIM card holder disclosed in the examples of the present application has a low card tray insertion and removal high defect rate from 8.9% to 1.2%, which can meet normal mass production quality standards.
进一步的,在本申请实施例公开的SIM卡座中,第一倒角能够起到导向作用,不入孔概率低于100mm,与常规设计相当,与现有技术中减少PCB槽孔宽度和增大DIP引脚宽度的方案相比,减少了不入孔概率。另外,限位凸包和第一倒角不仅起到“钉楔作用”,还增加了与PCB槽孔内的锡膏的接触面积,以及第二倒角也能够增加与锡膏的接触面积,从而增加了SIM卡座的焊接强度。Further, in the SIM card holder disclosed in the embodiment of the present application, the first chamfer can play a guiding role, and the probability of not entering the hole is less than 100mm, which is equivalent to the conventional design, and reduces the PCB slot width and increase Compared with the scheme of large DIP pin width, the probability of not entering the hole is reduced. In addition, the limit convex hull and the first chamfer not only play a role of "nail wedge", but also increase the contact area with the solder paste in the PCB slot, and the second chamfer can also increase the contact area with the solder paste, Thereby increasing the welding strength of the SIM card holder.
为了明确本申请的优势,对SIM卡座进行了多次试验,并得到以下方案对比表格。该表格中,原始方案中的SIM卡座中,PCB槽孔的宽度为0.45mm,DIP引脚的宽度为0.15mm,插卡浮高概率为8.9%,不入孔概率为5ppm,并设置PCB板的成本为A,该方案的SIM卡座具有定位精度过低的缺点,从而导致SIM卡座插拔困难。另外,方案2中,采用了缩减PCB槽孔宽度的方法,这种情况下,PCB槽孔的宽度为0.40mm,DIP引脚的宽度为0.15mm,插卡浮高概率为7.1%,不入孔概率为139ppm,并且PCB板的成本为A+0.1~0.3元/PCS,也就是说,该方案的SIM卡座虽然提高了定位精度,但是增加了PCB板的成本,增加了焊接难度,并且,由于减少了PCB槽孔的宽度,PCB槽孔内的锡膏相应的减少,因此导致焊接强度降低。另外,方案3中,采用了增加DIP引脚宽度的方法,这种情况下,PCB槽孔的宽度为0.45mm,DIP引脚的宽度为0.25mm,插卡浮高概率为1.2%,不入孔概率为441ppm,并且PCB板的成本为A,也就是说,该方案的SIM卡座虽然提高了定位精度,但是增加了焊接难度,并且,由于增加了DIP引脚的重量,因此导致SIM卡座的重量增加。而方案4采用本申请实施例公开的方案,即采用的是通过凸包限位的方案,这种情况下,PCB槽孔的宽度为0.45mm,DIP引脚的宽度为0.15mm,并且在DIP引脚表面设置了宽度为0.05mm的限位凸包,插卡浮高概率为1.2%,不入孔概率为<100ppm,并且PCB板的成本为A,据此可以看出,该方案的SIM卡座不仅提高了定位精度,并且,不会增加PCB板的成本,而且,相对于方案2和方案3来说,焊接难度降低,并且,方案3增加了整个DIP引脚的宽度,而方案4只是在DIP引脚的局部增加限位凸包和至少一个倒角,因此,该方案对SIM卡座的重量的影响 较小。进一步的,由于限位凸包和第一倒角不仅起到“钉楔作用”,还增加了与PCB槽孔内的锡膏的接触面积,以及第二倒角也能够增加与锡膏的接触面积,因此方案4还能够增加SIM卡座的焊接强度。In order to clarify the advantages of this application, the SIM card holder was tested many times, and the following scheme comparison table was obtained. In this table, in the original SIM card holder, the width of the PCB slot is 0.45mm, the width of the DIP pin is 0.15mm, the probability of the card floating height is 8.9%, the probability of not entering the hole is 5ppm, and set the PCB The cost of the board is A. The SIM card holder of this solution has the disadvantage of low positioning accuracy, which makes it difficult to insert and remove the SIM card holder. In addition, in Scheme 2, the method of reducing the width of the PCB slot is used. In this case, the width of the PCB slot is 0.40mm, the width of the DIP pin is 0.15mm, and the probability of the card floating height is 7.1%. The hole probability is 139ppm, and the cost of the PCB board is A+0.1~0.3 yuan/PCS, that is to say, although the SIM card holder of this solution improves the positioning accuracy, it increases the cost of the PCB board and the difficulty of soldering, and As the width of the PCB slot is reduced, the solder paste in the PCB slot is correspondingly reduced, which leads to a reduction in soldering strength. In addition, in scheme 3, the method of increasing the width of the DIP pin is adopted. In this case, the width of the PCB slot is 0.45mm, the width of the DIP pin is 0.25mm, and the floating height probability of the card is 1.2%, not in The hole probability is 441ppm, and the cost of the PCB board is A, that is to say, although the SIM card holder of this solution improves the positioning accuracy, it increases the difficulty of soldering, and because of the increase in the weight of the DIP pin, it leads to the SIM card The weight of the seat increases. The solution 4 adopts the solution disclosed in the embodiments of the present application, that is, the solution through the convex hull limit. In this case, the width of the PCB slot is 0.45mm, the width of the DIP pin is 0.15mm, and the DIP The surface of the pin is provided with a limit convex hull with a width of 0.05mm. The probability of floating height of the card is 1.2%, the probability of not entering the hole is <100ppm, and the cost of the PCB board is A. According to this, the SIM of the program The card holder not only improves the positioning accuracy, and does not increase the cost of the PCB board, but also, compared with the solutions 2 and 3, the soldering difficulty is reduced, and, the solution 3 increases the width of the entire DIP pin, while the solution 4 It's just that the limit convex hull and at least one chamfer are added locally to the DIP pin. Therefore, this solution has little effect on the weight of the SIM card holder. Further, since the limiting convex hull and the first chamfer not only play a role of "nail wedge", but also increase the contact area with the solder paste in the PCB slot, and the second chamfer can also increase the contact with the solder paste Area, so option 4 can also increase the welding strength of the SIM card holder.
表1 各种卡座DIP脚设计方案对比Table 1 Comparison of DIP foot design schemes of various decks
根据上表可知,本申请实施例公开的方案,相对于原始方案(即方案1),定位精度有显著提升,插卡浮高概率由8.9%下降至1.2%,满足量产所需。并且,相对于缩减PCB槽孔宽度的方案(即方案2),本申请实施例公开的方案,PCB板的成本低0.1-0.3RMB/PCS,并且定位定位精度更高,焊接加工难度小,焊接强度高。相对于增加DIP引脚宽度的方案,本方案焊接难度更低,器件的重量更小,利于轻型化的发展。According to the above table, compared with the original solution (ie, solution 1), the positioning accuracy of the solution disclosed in the embodiments of the present application is significantly improved, and the floating probability of the card is reduced from 8.9% to 1.2%, which meets the needs of mass production. In addition, compared with the solution for reducing the width of the PCB slot (ie, solution 2), the solution disclosed in the embodiments of the present application has a lower cost of the PCB board of 0.1-0.3RMB/PCS, and has higher positioning accuracy, less welding processing difficulty, and welding high strength. Compared with the scheme of increasing the width of the DIP pin, this scheme has a lower soldering difficulty and a smaller device weight, which is conducive to the development of lightweight.
应理解,在本申请的各种实施例中,各过程的序号的大小并不意味着执行顺序的先后,各过程的执行顺序应以其功能和内在逻辑确定,而不应对本申请实施例的实施过程构成任何限定。It should be understood that in various embodiments of the present application, the size of the sequence number of each process does not mean that the execution order is sequential, and the execution order of each process should be determined by its function and inherent logic, and should not correspond to the embodiments of this application. The implementation process constitutes no limitation.
本说明书的各个部分均采用递进的方式进行描述,各个实施例之间相同相似的部分互相 参见即可,每个实施例重点介绍的都是与其他实施例不同之处。尤其,对于装置和***实施例而言,由于其基本相似于方法实施例,所以描述的比较简单,相关之处参见方法实施例部分的说明即可。Each part of this specification is described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the device and system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.
尽管已描述了本申请的优选实施例,但本领域内的技术人员一旦得知了基本创造性概念,则可对这些实施例作出另外的变更和修改。所以,所附权利要求意欲解释为包括优选实施例以及落入本申请范围的所有变更和修改。Although the preferred embodiments of the present application have been described, those skilled in the art can make additional changes and modifications to these embodiments once they learn the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.
Claims (10)
- 一种双列直插式封装DIP引脚器件,其特征在于,包括:A dual in-line package DIP pin device, characterized in that it includes:DIP引脚、限位凸包和第一倒角;DIP pin, limit convex hull and first chamfer;所述限位凸包位于所述DIP引脚的表面,当所述DIP引脚***印刷电路板PCB槽孔时,所述限位凸包位于PCB槽孔内;The limit convex hull is located on the surface of the DIP pin, and when the DIP pin is inserted into the PCB slot of the printed circuit board, the limit convex hull is located in the PCB slot;所述第一倒角位于所述DIP引脚的表面,并且与所述限位凸包的第一侧相连接,当所述限位凸包位于所述PCB槽孔内时,所述限位凸包朝向所述PCB槽孔的一侧为所述限位凸包的第一侧。The first chamfer is located on the surface of the DIP pin and is connected to the first side of the limiting convex hull. When the limiting convex hull is located in the PCB slot, the limiting position The side of the convex hull facing the PCB slot is the first side of the limiting convex hull.
- 根据权利要求1所述的DIP引脚器件,其特征在于,The DIP pin device according to claim 1, wherein:所述限位凸包以焊接的形式固定在所述DIP引脚的表面;The limiting convex hull is fixed on the surface of the DIP pin in the form of welding;或者,or,所述限位凸包与所述DIP引脚为一体化结构。The limit convex hull and the DIP pin have an integrated structure.
- 根据权利要求1所述的DIP引脚器件,其特征在于,The DIP pin device according to claim 1, wherein:所述限位凸包和/或所述第一倒角的材质与所述DIP引脚的材质相同;The material of the limiting convex hull and/or the first chamfer is the same as the material of the DIP pin;或者,or,所述限位凸包和/或所述第一倒角的材质为金属材质。The material of the limiting convex hull and/or the first chamfer is a metal material.
- 根据权利要求1所述的DIP引脚器件,其特征在于,The DIP pin device according to claim 1, wherein:所述第一倒角与所述DIP引脚之间的夹角的角度范围为[120°,160°];The angle range between the first chamfer and the DIP pin is [120°, 160°];其中,所述第一倒角的第一目标切线与所述DIP引脚的平面形成的钝角为所述第一倒角与所述DIP引脚之间的夹角,所述第一目标切线为所述第一倒角的各条切线中,穿过第一目标点的切线,所述第一目标点为所述第一倒角与所述DIP引脚的连接点。The obtuse angle formed by the first target tangent of the first chamfer and the plane of the DIP pin is the angle between the first chamfer and the DIP pin, and the first target tangent is Among each tangent line of the first chamfer, a tangent line passing through a first target point, the first target point is a connection point of the first chamfer and the DIP pin.
- 根据权利要求1所述的DIP引脚器件,其特征在于,还包括:The DIP pin device according to claim 1, further comprising:第二倒角;Second chamfer所述第二倒角位于所述DIP引脚的表面,并且与所述限位凸包的第二侧相连接,当所述限位凸包位于所述PCB槽孔内时,所述限位凸包背向所述PCB槽孔的一侧为第二侧;The second chamfer is located on the surface of the DIP pin and is connected to the second side of the limiting convex hull. When the limiting convex hull is located in the PCB slot, the limiting position The side of the convex hull facing away from the PCB slot is the second side;当所述DIP引脚***印刷电路板PCB槽孔时,所述第二倒角位于所述PCB槽孔内。When the DIP pin is inserted into the PCB slot of the printed circuit board, the second chamfer is located in the PCB slot.
- 根据权利要求5所述的DIP引脚器件,其特征在于,The DIP pin device according to claim 5, wherein:所述第二倒角的材质与所述DIP引脚的材质相同;The material of the second chamfer is the same as the material of the DIP pin;或者,or,所述限位凸包和所述第二倒角的材质为金属材质。The materials of the limiting convex hull and the second chamfer are metal materials.
- 根据权利要求5所述的DIP引脚器件,其特征在于,The DIP pin device according to claim 5, wherein:所述第二倒角与所述DIP引脚之间的夹角的角度范围为[120°,160°];The angle range between the second chamfer and the DIP pin is [120°, 160°];其中,所述第二倒角的第二目标切线与所述DIP引脚的平面形成的钝角为所述第二倒角 与所述DIP引脚之间的夹角,所述第二目标切线为所述第二倒角的各条切线中,穿过第二目标点的切线,所述第二目标点为所述第二倒角与所述DIP引脚的连接点。The obtuse angle formed by the second target tangent of the second chamfer and the plane of the DIP pin is the angle between the second chamfer and the DIP pin, and the second target tangent is Each tangent line of the second chamfer passes through a tangent line of a second target point, and the second target point is a connection point of the second chamfer and the DIP pin.
- 一种封装结构,其特征在于,包括:A packaging structure, which is characterized by comprising:如权利要求1至7任一项所述的DIP引脚器件,以及设置有PCB槽孔的PCB板;The DIP pin device according to any one of claims 1 to 7, and a PCB board provided with a PCB slot;所述DIP引脚器件位于所述PCB槽孔内,并通过所述PCB槽孔内的锡膏固定在所述PCB板上。The DIP pin device is located in the PCB slot, and is fixed on the PCB board by the solder paste in the PCB slot.
- 一种插拔装置,其特征在于,包括:A plug-in device is characterized by comprising:如权利要求1至7任一项所述的DIP引脚器件。The DIP pin device according to any one of claims 1 to 7.
- 根据权利要求9所述的插拔装置,其特征在于,The plug-in device according to claim 9, wherein:所述插拔装置为用户身份模块SIM卡座、耳机座或通用串行总线USB连接器。The plug-in device is a SIM card holder of a user identity module, an earphone holder or a USB connector of a universal serial bus.
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CN209592016U (en) * | 2018-12-12 | 2019-11-05 | 华为技术有限公司 | A kind of DIP pin device, encapsulating structure and plug-in and pull-off device |
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CN102883549A (en) * | 2011-07-15 | 2013-01-16 | 台达电子企业管理(上海)有限公司 | Circuit board with heat collection structure and manufacturing method for circuit board |
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US4521828A (en) * | 1982-12-23 | 1985-06-04 | At&T Technologies, Inc. | Component module for piggyback mounting on a circuit package having dual-in-line leads |
CN103166026A (en) * | 2011-12-08 | 2013-06-19 | 贵州航天电器股份有限公司 | Elastic contact-pin contact part |
CN106332449A (en) * | 2016-08-31 | 2017-01-11 | 安徽赛福电子有限公司 | Electronic element pin |
CN208113073U (en) * | 2017-03-24 | 2018-11-16 | 松下知识产权经营株式会社 | Electronic circuit cell and electrical equipment |
CN209592016U (en) * | 2018-12-12 | 2019-11-05 | 华为技术有限公司 | A kind of DIP pin device, encapsulating structure and plug-in and pull-off device |
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