WO2020118629A1 - Electronic device - Google Patents

Abstract

An electronic device (100), comprising a housing (10), a heat dissipation assembly (20), and a circuit board (30). An air inlet (111), an air outlet (121), and an air duct (13) that communicates the air inlet (111) with the air outlet (121) are arranged on the housing (10); the heat dissipation assembly (20) and the circuit board (30) are located in the air duct (13); the heat dissipation assembly (20) comprises a heat sink (21); the circuit board (30) is provided with a first heat source (31) and a second heat source (32); the heat sink (21) comprises an upper surface (211) and a lower surface (212); the first heat source (31) is located on the upper surface (211) and connected to the heat sink (21) in a thermally conductive manner, and the second heat source (32) is located on the lower surface (212) and connected to the heat sink (21) in a thermally conductive manner.

Description

电子设备Electronic equipment 技术领域Technical field

本申请涉及电子设备技术领域，更具体而言，涉及一种电子设备。This application relates to the technical field of electronic devices, and more specifically, to an electronic device.

背景技术Background technique

通常地，电子设备，如无人机会设置有散热结构，以对该无人机内的芯片、主板或其他发热部件进行散热，进而保证无人机能够正常运转。对于消费级无人机来说，由于使用环境温度相对较低，对图传和算法的要求相对较小，芯片功耗相对较小，且由于结构尺寸的限制，往往采用离心风扇加散热片进行散热设计。这种散热方案在小型无人机上起到了较好的效果，但随之无人机在各个领域的应用逐渐深入。需要在各种严酷的环境条件下进行作业的工业级无人机对散热提出了更高的要求，成为整机结构设计中一个需要攻克的难题。传统的散热方案无法满足工业级飞机的散热需求(高功耗，环境恶劣，芯片热源分散，但结构空闲相对小型无人机相对宽阔。特别是针对订制化无人机，采用模块化设计使得热源更加分散，无法兼顾)。Generally, electronic equipment, such as a drone, is provided with a heat dissipation structure to dissipate heat from the chip, motherboard, or other heat-generating components in the drone, thereby ensuring the normal operation of the drone. For consumer-grade drones, due to the relatively low ambient temperature of use, the requirements for image transmission and algorithms are relatively small, the chip power consumption is relatively small, and due to structural size limitations, centrifugal fans and heat sinks are often used for Thermal design. This heat dissipation scheme has played a good role on small drones, but then the application of drones in various fields has gradually deepened. Industrial-grade drones that need to operate under a variety of harsh environmental conditions put forward higher requirements for heat dissipation, which has become a difficult problem to be overcome in the structure design of the whole machine. Traditional heat dissipation solutions cannot meet the heat dissipation requirements of industrial-grade aircraft (high power consumption, harsh environment, chip heat source dispersion, but idle structure is relatively wide compared to small UAVs. Especially for customized UAVs, the modular design makes The heat source is more dispersed and cannot be taken into account).

发明内容Summary of the invention

本申请提供一种电子设备。This application provides an electronic device.

本申请实施方式的电子设备包括壳体、散热组件和电路板，所述壳体开设有进风口、出风口和连通所述进风口和所述出风口的风道，所述散热组件和所述电路板位于所述风道内，所述散热组件包括散热片，所述电路板设有第一热源和第二热源，所述散热片包括上表面和下表面，所述第一热源位于所述上表面且与所述散热片导热地连接，所述第二热源位于所述下表面且与所述散热片导热地连接。An electronic device according to an embodiment of the present application includes a housing, a heat dissipation component, and a circuit board. The housing is provided with an air inlet, an air outlet, and an air passage connecting the air inlet and the air outlet. The heat dissipation component and the The circuit board is located in the air duct, the heat dissipation assembly includes a heat sink, the circuit board is provided with a first heat source and a second heat source, the heat sink includes an upper surface and a lower surface, the first heat source is located on the upper The surface is thermally connected to the heat sink, and the second heat source is located on the lower surface and thermally connected to the heat sink.

上述电子设备中，由于第一热源和第二热源分别分布在散热片的上下表面，因此，在壳体内形成风道并联热阻的形式，降低了电子设备整机的热阻，进而满足了壳体内分散热源的散热需求，提高了电子设备的散热效率。In the above electronic equipment, since the first heat source and the second heat source are distributed on the upper and lower surfaces of the heat sink respectively, the form of air duct parallel thermal resistance is formed in the housing, which reduces the thermal resistance of the entire electronic equipment and thus satisfies the housing The heat dissipation requirement of the dispersed heat source in the body improves the heat dissipation efficiency of electronic equipment.

本申请实施方式的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。Additional aspects and advantages of the embodiments of the present application will be partially given in the following description, and some will become apparent from the following description, or be learned through practice of the present application.

附图说明BRIEF DESCRIPTION

本申请的上述和/或附加的方面和优点从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：The above and/or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

图1是本申请实施方式的电子设备的立体示意图；FIG. 1 is a schematic perspective view of an electronic device according to an embodiment of the present application;

图2是图1的电子设备Ⅰ部分的放大示意图；2 is an enlarged schematic view of the electronic device I part of FIG. 1;

图3是本申请实施方式的电子设备的立体分解示意图；3 is an exploded perspective view of an electronic device according to an embodiment of the present application;

图4是图3的电子设备Ⅱ部分的放大示意图；4 is an enlarged schematic view of the electronic device II part of FIG. 3;

图5是图4的电子设备Ⅲ部分的放大示意图；5 is an enlarged schematic view of the electronic device III part of FIG. 4;

图6是图4的电子设备Ⅳ部分的放大示意图；6 is an enlarged schematic view of the portion IV of the electronic device of FIG. 4;

图7是本申请实施方式的电子设备的壳体的结构示意图；7 is a schematic structural diagram of a casing of an electronic device according to an embodiment of the present application;

图8是本申请实施方式的电子设备的部分剖面示意图；8 is a schematic partial cross-sectional view of an electronic device according to an embodiment of the present application;

图9是本申请实施方式的电子设备的散热组件的立体示意图；9 is a schematic perspective view of a heat dissipation assembly of an electronic device according to an embodiment of the present application;

图10是本申请实施方式的电子设备的散热组件的另一立体示意图；10 is another schematic perspective view of a heat dissipation assembly of an electronic device according to an embodiment of the present application;

图11是本申请实施方式的电子设备的进风部件的结构示意图；11 is a schematic structural diagram of an air intake component of an electronic device according to an embodiment of the present application;

图12是本申请实施方式的电子设备的进风部件的剖面示意图；12 is a schematic cross-sectional view of an air intake component of an electronic device according to an embodiment of the present application;

图13是本申请实施方式的电子设备的出风部件的结构示意图；13 is a schematic structural diagram of an air outlet component of an electronic device according to an embodiment of the present application;

图14是本申请实施方式的电子设备的出风部件的剖面示意图；14 is a schematic cross-sectional view of an air outlet component of an electronic device according to an embodiment of the present application;

图15是本申请实施方式的电子设备的风扇支架的立体示意图；15 is a schematic perspective view of a fan bracket of an electronic device according to an embodiment of the present application;

图16是本申请实施方式的电子设备的散热片结构的结构示意图；16 is a schematic structural diagram of a heat sink structure of an electronic device according to an embodiment of the present application;

图17是本申请实施方式的电子设备的散热结构的剖面示意图；17 is a schematic cross-sectional view of a heat dissipation structure of an electronic device according to an embodiment of the present application;

图18是本申请实施方式的电子设备的散热片结构的剖面示意图；18 is a schematic cross-sectional view of a heat sink structure of an electronic device according to an embodiment of the present application;

图19是图18的散热片结构Ⅴ部分的放大示意图；19 is an enlarged schematic view of the heat sink structure V part of FIG. 18;

图20是本申请实施方式的电子设备的第一屏蔽罩的结构示意图；20 is a schematic structural diagram of a first shield cover of an electronic device according to an embodiment of the present application;

图21是本申请实施方式的电子设备的减震结构的立体示意图；21 is a perspective schematic view of a shock-absorbing structure of an electronic device according to an embodiment of the present application;

图22是本申请实施方式的电子设备的减震结构的侧面示意图；22 is a schematic side view of a shock absorbing structure of an electronic device according to an embodiment of the present application;

图23是本申请实施方式的电子设备的减震结构的剖面示意图；23 is a schematic cross-sectional view of a shock-absorbing structure of an electronic device according to an embodiment of the present application;

图24是本申请实施方式的电子设备的减震结构的减震部件和安装部的剖面示意图；24 is a schematic cross-sectional view of a shock-absorbing member and a mounting portion of a shock-absorbing structure of an electronic device according to an embodiment of the present application;

图25是本申请实施方式的减震结构的实心部和空心部的尺寸示意图；25 is a schematic diagram of the size of the solid portion and the hollow portion of the shock absorbing structure of the embodiment of the present application;

图26是本申请实施方式的减震结构的实心部和空心部的另一尺寸示意图。Fig. 26 is another schematic view of the solid portion and the hollow portion of the shock absorbing structure according to the embodiment of the present application.

主要元件符号说明：Symbol description of main components:

电子设备100； Electronic equipment 100;

壳体10、进风部件11、进风防尘罩110、进风口111、进风通孔1101、进风通道112、通道出口1121、进风挡板113、出风部件12、出风防尘罩120、出风通孔1201、出风口121、出风通道122、第一通道1221、第二通道1222、出风挡板123、风道13、散热组件20、散热片21、上表面211、下表面212、第一散热鳍片213、第一鳍片2131、第二鳍片2132、收容通道2134、本体部214、第一安装部215、第一收容槽2151、热管22、电路板30、第一热源31、第一发热件311、第二热源32、第二发热件321、第一子发热件322、第二子发热件323、主控板33、电源板34、第三热源340、图传板35、图传板散热片351、飞控板36、定位板37、风扇组件40、风扇支架41、容置部411、容置腔4111、挡板部412、挡板4121、风扇42、第一屏蔽罩50、凸包501、第二屏蔽罩51、第三屏蔽罩52、散热块54、底板60、通孔601、散热片结构61、绝缘片62、安装件63、基板64、第一安装孔640、凸部641、表面部位642、鳍片部65、连接板651、第二散热鳍片652、减震结构70、第二安装孔711、减震部件72、实心部721、空心部722、固持部723、第一卡块724、第二安装部73、预安装部731、第二卡块732。 Housing 10, air inlet member 11, air inlet dust cover 110, air inlet 111, air inlet hole 1101, air inlet channel 112, channel outlet 1121, air inlet baffle 113, air outlet member 12, air outlet dust The cover 120, the air outlet hole 1201, the air outlet 121, the air outlet channel 122, the first channel 1221, the second channel 1222, the air outlet baffle 123, the air channel 13, the heat dissipation assembly 20, the heat sink 21, the upper surface 211, The lower surface 212, the first heat dissipation fin 213, the first fin 2131, the second fin 2132, the receiving channel 2134, the body portion 214, the first mounting portion 215, the first receiving groove 2151, the heat pipe 22, the circuit board 30, The first heat source 31, the first heating element 311, the second heat source 32, the second heating element 321, the first sub heating element 322, the second sub heating element 323, the main control board 33, the power board 34, the third heat source 340, Image transmission plate 35, image transmission plate heat sink 351, flight control board 36, positioning plate 37, fan assembly 40, fan bracket 41, accommodating portion 411, accommodating cavity 4111, baffle portion 412, baffle 4121, fan 42 , The first shield 50, the convex hull 501, the second shield 51, the third shield 52, the heat dissipation block 54, the bottom plate 60, the through hole 601, the heat sink structure 61, the insulating sheet 62, the mounting member 63, the substrate 64, The first mounting hole 640, the convex portion 641, the surface portion 642, the fin portion 65, the connection plate 651, the second heat dissipation fin 652, the damping structure 70, the second mounting hole 711, the damping member 72, the solid portion 721, The hollow portion 722, the holding portion 723, the first block 724, the second mounting portion 73, the pre-mounting portion 731, and the second block 732.

具体实施方式detailed description

下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the drawings, in which the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary, and are only used to explain the present application, and cannot be construed as limiting the present application.

在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back, "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise" etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it cannot be understood as a limitation to this application. In addition, the terms “first” and “second” are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise specifically limited.

在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接。可以是机械连接，也可以是电连接。可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be fixed connection or detachable Connect, or connect integrally. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the connection between two elements or the interaction between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

请参阅图1及图3，本申请实施方式的电子设备100包括壳体10、散热组件20、电路板30、 风扇组件40和减震结构70(参见图22)。电子设备100包括无人机和机器人，在图示的实施方式中，电子设备100为无人机。其中，风扇组件40设置于壳体10内。Referring to FIGS. 1 and 3, the electronic device 100 according to the embodiment of the present application includes a housing 10, a heat dissipation component 20, a circuit board 30, a fan component 40, and a shock absorbing structure 70 (see FIG. 22). The electronic device 100 includes a drone and a robot. In the illustrated embodiment, the electronic device 100 is a drone. Among them, the fan assembly 40 is disposed in the housing 10.

请结合图1至图3和图11-图14，壳体10包括进风部件11和出风部件12。进风部件11开设有进风口111。出风部件12开设有出风口121。壳体10开设有连通进风口111和出风口121的风道13。散热组件20和电路板30位于风道13内。外界的空气能够由进风口111流入到风道13内，并能够在风道13内形成气流。气流能够将风道13内的热量经由出风口121散出。Please refer to FIGS. 1-3 and FIGS. 11-14, the housing 10 includes an air inlet component 11 and an air outlet component 12. The air inlet member 11 is provided with an air inlet 111. The air outlet member 12 is provided with an air outlet 121. The casing 10 defines an air duct 13 communicating with the air inlet 111 and the air outlet 121. The heat dissipation assembly 20 and the circuit board 30 are located in the air duct 13. Outside air can flow into the air duct 13 from the air inlet 111 and can form an air flow in the air duct 13. The airflow can dissipate the heat in the air duct 13 through the air outlet 121.

风扇组件40可位于散热组件20和出风部件12之间，即位于散热组件20和出风口121之间，也可位于散热组件20和进风部件11之间，即位于散热组件20和进风口111之间。在图示的例子中，风扇组件40位于散热组件20和出风口121之间。The fan assembly 40 may be located between the heat dissipation assembly 20 and the air outlet member 12, that is, between the heat dissipation assembly 20 and the air outlet 121, or between the heat dissipation assembly 20 and the air inlet member 11, that is, between the heat dissipation assembly 20 and the air inlet Between 111. In the illustrated example, the fan assembly 40 is located between the heat dissipation assembly 20 and the air outlet 121.

为了防止灰尘由进风口111进入风道13内，可在进风口111处设置进风防尘罩110。进一步，进风防尘罩110开设有网格状的进风通孔1101阵列。这样进风口111处的进风较为均匀。In order to prevent dust from entering the air duct 13 from the air inlet 111, an air inlet dust cover 110 may be provided at the air inlet 111. Furthermore, the air inlet dust cover 110 is provided with a grid-like array of air inlet through holes 1101. In this way, the air intake at the air inlet 111 is relatively uniform.

在图7及图11所示的例子中，进风口111的数量是多个，每个进风口111处设有进风通孔1101阵列的多个进风通孔1101。In the examples shown in FIGS. 7 and 11, the number of air inlets 111 is plural, and each air inlet 111 is provided with a plurality of air inlet through holes 1101 in an array of air inlet through holes 1101.

为了防止灰尘由出风口121进入风道13内，可在出风口121处设置出风防尘罩120(如图13所示)。进一步，出风防尘罩120开设有网格状的出风通孔1201阵列。可以理解，防尘罩上的通孔阵列可以是均匀排布，也可以是成间隔排布，在此不作限定。In order to prevent dust from entering the air duct 13 through the air outlet 121, an air outlet dust cover 120 may be provided at the air outlet 121 (as shown in FIG. 13). Furthermore, the air outlet dust cover 120 is provided with a grid-shaped air outlet through hole 1201 array. It can be understood that the array of through holes on the dust cover may be evenly arranged or arranged in intervals, which is not limited herein.

具体地，散热组件20和电路板30可构成电子设备100的散热部件，散热部件位于风道13内，为了提高电子设备100的防水性能和提升对散热部件的散热效率，进风部件11开设连通进风口111的进风通道112，进风通道112的侧壁形成进风挡板113。进风挡板113被配置成将从进风口111进入进风通道112的气流向上转向至风道13(如图12所示)。这样通过在进风通道112设置相应进风挡板113，使得进入气流转向，在达到电子设备100的防水性能要求的同时，可使进风口111大小最大化，因此，在提高电子设备100的可靠性的同时，也能提升对散热部件的散热效率。可以理解，在其它实施方式中，散热部件可为散热组件20或电路板30，或散热组件20与电子设备100的其它部件构成，或电路板30与电子设备100的其它部件构成，或电子设备内需要散热的其它部件。Specifically, the heat dissipation component 20 and the circuit board 30 may constitute a heat dissipation component of the electronic device 100. The heat dissipation component is located in the air duct 13. In order to improve the waterproof performance of the electronic device 100 and improve the heat dissipation efficiency of the heat dissipation component, the air inlet component 11 is opened to communicate The air inlet duct 112 of the air inlet 111 and the side wall of the air inlet duct 112 form an air inlet baffle 113. The air inlet baffle 113 is configured to divert the airflow entering the air inlet passage 112 from the air inlet 111 upward to the air duct 13 (as shown in FIG. 12 ). In this way, by providing the corresponding air inlet baffle 113 in the air inlet channel 112, the incoming air flow is diverted, and the size of the air inlet 111 can be maximized while meeting the waterproof performance requirements of the electronic device 100, therefore, the reliability of the electronic device 100 is improved At the same time, it can also improve the heat dissipation efficiency of the heat dissipation components. It can be understood that, in other embodiments, the heat dissipation component may be the heat dissipation component 20 or the circuit board 30, or the heat dissipation component 20 and other components of the electronic device 100, or the circuit board 30 and other components of the electronic device 100, or the electronic device Other components that need heat dissipation.

出风部件12开设连通出风口121的出风通道122，出风通道122的侧壁形成出风挡板123。出风挡板123被配置成将进入出风通道122的气流向下转向至出风口121(如图14所示)。这样通过在出风通道122设置相应出风挡板123，使得出风气流转向，在达到电子设备100的防水性能要求的同时，可使出风口121大小最大化，因此，在提高电子设备100的可靠性的同时，也能提升对散热组件20的散热效率。当然，在其它实施方式中，进风通道112的侧壁形成进风挡板113或出风通道122的侧壁形成出风挡板123。The air outlet member 12 defines an air outlet passage 122 communicating with the air outlet 121, and an air outlet baffle 123 is formed on the side wall of the air outlet passage 122. The air outlet baffle 123 is configured to turn the airflow entering the air outlet channel 122 downward to the air outlet 121 (as shown in FIG. 14 ). In this way, by providing the corresponding air outlet baffle 123 in the air outlet channel 122, the air outlet air flow is diverted, and the size of the air outlet 121 can be maximized while meeting the waterproof performance requirements of the electronic device 100. Therefore, the At the same time as the reliability, the heat dissipation efficiency of the heat dissipation assembly 20 can also be improved. Of course, in other embodiments, the side wall of the air inlet channel 112 forms an air baffle 113 or the side wall of the air outlet channel 122 forms an air baffle 123.

在本实施方式中，请结合图12，进风通道112的数量可以是多个。多个进风通道112沿竖直方向排列。进风通道112包括通道出口1121。进风挡板113与相邻的通道出口1121相对。其中，气流在进风通道112内的流动方向如图12的虚线箭头所示。In this embodiment, referring to FIG. 12, the number of the air inlet channels 112 may be multiple. A plurality of air inlet channels 112 are arranged in the vertical direction. The air inlet channel 112 includes a channel outlet 1121. The air inlet baffle 113 is opposed to the adjacent channel outlet 1121. Among them, the flow direction of the air flow in the air inlet channel 112 is shown by the dotted arrow in FIG. 12.

请结合图14，出风通道122包括第一通道1221和第二通道1222。第二通道1222连通第一通道1221和出风口121。第二通道1222的斜率大于第一通道1221的斜率。如此，这样利于气流由出风通道122导出，并且防尘防水。具体地，第一通道1221和第二能道1222均呈直线状，如此，可减少出风气流的阻力，使出风更顺畅，提高了电子设备的散热效率。14, the air outlet channel 122 includes a first channel 1221 and a second channel 1222. The second channel 1222 communicates with the first channel 1221 and the air outlet 121. The slope of the second channel 1222 is greater than the slope of the first channel 1221. In this way, it is advantageous for the airflow to be led out from the air outlet channel 122, and it is dustproof and waterproof. Specifically, both the first channel 1221 and the second energy channel 1222 are linear, so that the resistance of the airflow can be reduced, the airflow can be smoother, and the heat dissipation efficiency of the electronic device is improved.

请结合图5及图9，散热组件20包括散热片21和热管22。散热片21包括上表面211和下表面212。散热片21的上表面211设有第一散热鳍片213。第一散热鳍片213的设置能够增加散热片21的散热面积。散热片21、热管22和第一散热鳍片213的集成设置能够提高电子设备100整体的集成度。5 and 9, the heat dissipation assembly 20 includes a heat sink 21 and a heat pipe 22. The heat sink 21 includes an upper surface 211 and a lower surface 212. The upper surface 211 of the heat sink 21 is provided with first heat dissipation fins 213. The arrangement of the first heat radiation fin 213 can increase the heat radiation area of the heat radiation fin 21. The integrated arrangement of the heat sink 21, the heat pipe 22 and the first heat dissipation fin 213 can improve the overall integration of the electronic device 100.

进一步，请结合图5和-9，第一散热鳍片213包括第一鳍片2131和第二鳍片2132。第一鳍片2131与散热片21为一体结构。散热片21设有本体部214和第一安装部215。本体部214连接第一安装部215。第一鳍片2131设在本体部214。第二鳍片2132通过冲压方式形成在第一安装部215。Further, referring to FIGS. 5 and -9, the first heat dissipation fin 213 includes a first fin 2131 and a second fin 2132. The first fin 2131 and the heat sink 21 have an integrated structure. The heat sink 21 is provided with a body portion 214 and a first mounting portion 215. The body portion 214 is connected to the first mounting portion 215. The first fin 2131 is provided on the body portion 214. The second fin 2132 is formed on the first mounting portion 215 by stamping.

其中，第二鳍片2132可采用铝合金冲压工艺制成，这样第二鳍片2132的鳍片间距可以设置的很小，以利用有限的体积较大增加散热片21的换热面积。The second fins 2132 can be made by an aluminum alloy stamping process, so that the fin spacing of the second fins 2132 can be set very small, so as to increase the heat exchange area of the heat sink 21 with a limited volume.

进一步，第一鳍片2131的截面呈沿进风口111至出风口121方向上升的台阶状。如此，第一鳍片2131能够减小热量在第一散热鳍片213的聚集作用，使得热量能够在第一鳍片2131的导向下快速散发，并且由于第一鳍片2131具有不同的高度，使得远离进风口111的较高的第一鳍片2131也能够获取到较多的冷空气。在本实施方式中，第一鳍片2131形成两级台阶。Further, the cross section of the first fin 2131 is a stepped shape that rises in the direction from the air inlet 111 to the air outlet 121. In this way, the first fins 2131 can reduce the concentration of heat in the first heat dissipation fins 213, so that the heat can be quickly dissipated under the guidance of the first fins 2131, and because the first fins 2131 have different heights, the The higher first fins 2131 away from the air inlet 111 can also obtain more cold air. In this embodiment, the first fin 2131 forms two steps.

进一步，请参图5，第一安装部215开设有第一收容槽2151。热管22至少部分地收容在第一收容槽2151，例如热管22的下半部分收容在第一收容槽2151。热管22连接第一鳍片2131和第二鳍片2132。这样热管22与散热片21的接触面积较大，能够有效提高散热效率。进一步，第二鳍片2132的下端开设有与第一收容槽2151对应的第二收容槽(图未示出)。第一收容槽2151和第二收容槽共同形成收容通道2134。热管22至少部分地收容在收容通道2134。这样散热片21将电子设备内的热源与热管22和第一散热鳍片213连接起来，集成度较高，并且散热片21、热管22和第一散热鳍片213之间相互接触的面积较大，利于热量传递和散发。其中，热管22可通过汽液换相循环的方式使热量较快速传导到第一散热鳍片213处，进而散发到环境中。Further, referring to FIG. 5, the first mounting portion 215 defines a first receiving slot 2151. The heat pipe 22 is accommodated at least partially in the first accommodation groove 2151, for example, the lower half of the heat pipe 22 is accommodated in the first accommodation groove 2151. The heat pipe 22 connects the first fin 2131 and the second fin 2132. In this way, the contact area between the heat pipe 22 and the heat sink 21 is large, and the heat dissipation efficiency can be effectively improved. Further, a second receiving groove (not shown) corresponding to the first receiving groove 2151 is opened at the lower end of the second fin 2132. The first receiving groove 2151 and the second receiving groove together form a receiving passage 2134. The heat pipe 22 is accommodated at least partially in the accommodation passage 2134. In this way, the heat sink 21 connects the heat source in the electronic device to the heat pipe 22 and the first heat dissipation fin 213, the integration is relatively high, and the area of the heat sink 21, the heat pipe 22, and the first heat dissipation fin 213 contacting each other is large , Conducive to heat transfer and distribution. Wherein, the heat pipe 22 can quickly conduct heat to the first heat dissipation fin 213 by means of vapor-liquid commutation circulation, and then radiate it to the environment.

请结合图4及图10，在某些实施方式中，电路板30设置有第一热源31和第二热源32。第一热源31位于散热片21的上表面211且与散热片21导热地连接(thermal connection)。第二热源32位于散热片21的下表面212且与散热片21导热地连接。由于第一热源31和第二热源32分别分布在散热片21的上下表面，因此，在壳体10内形成风道13并联热阻的形式，降低了电子设备100整机的热阻，进而满足了壳体10内分散热源的散热需求，提高了电子设备100的散热效率。4 and 10, in some embodiments, the circuit board 30 is provided with a first heat source 31 and a second heat source 32. The first heat source 31 is located on the upper surface 211 of the heat sink 21 and is thermally connected to the heat sink 21. The second heat source 32 is located on the lower surface 212 of the heat sink 21 and is thermally connected to the heat sink 21. Since the first heat source 31 and the second heat source 32 are respectively distributed on the upper and lower surfaces of the heat sink 21, the heat resistance of the air duct 13 is formed in the housing 10 in parallel, which reduces the heat resistance of the entire electronic device 100, thereby satisfying The heat dissipation requirements of the distributed heat sources in the housing 10 are improved, and the heat dissipation efficiency of the electronic device 100 is improved.

在本实施方式中，第二热源32产生的热量大于第一热源31产生的热量，第二热源32相对第一热源31靠近风道13内的中间位置。这样第二热源32处热阻较低，利于气流带走第二热源32的热量。In the present embodiment, the heat generated by the second heat source 32 is greater than the heat generated by the first heat source 31, and the second heat source 32 is closer to the middle position in the air duct 13 relative to the first heat source 31. In this way, the thermal resistance at the second heat source 32 is lower, which is advantageous for the airflow to take away the heat of the second heat source 32.

可以理解，为了进一步促进第一热源31的散热，可使得第一热源31直接设在第一散热鳍片213上，这样第一热源31与散热片21的接触面积较大，热量散发较快。It can be understood that, in order to further promote the heat dissipation of the first heat source 31, the first heat source 31 may be directly disposed on the first heat dissipation fin 213, so that the contact area between the first heat source 31 and the heat dissipation fin 21 is larger, and the heat is radiated faster.

请结合图5，第一热源31包括至少一个第一发热件311。第一发热件311在工作时产生热量。请结合图4，第二热源32包括至少一个第二发热件321。第二发热件321在工作时产生热量。5, the first heat source 31 includes at least one first heating element 311. The first heating element 311 generates heat during operation. 4, the second heat source 32 includes at least one second heating element 321. The second heating element 321 generates heat during operation.

请结合图2至图6，电路板30包括主控板33、电源板34、图传板35、飞控板36和定位板37。2 to FIG. 6, the circuit board 30 includes a main control board 33, a power board 34, an image transmission board 35, a flight control board 36 and a positioning board 37.

其中，主控板33位于散热片21的下方，至少一个第二发热件321设置于主控板33。当然，可以理解，设置在主控板33的第二发热件321的数目可根据具体情况进行设置。The main control board 33 is located below the heat sink 21, and at least one second heating element 321 is disposed on the main control board 33. Of course, it can be understood that the number of the second heating elements 321 provided on the main control board 33 can be set according to specific circumstances.

在一种实施方式中，至少一个第二发热件321包括第一子发热件322和与第一子发热322间隔的第二子发热件323和第三子发热件324。导热的第一屏蔽罩50连接第一子发热件322和散热片21。导热的第二屏蔽罩51连接第二子发热件323、第三子发热件324和散热片21。第一子发热件322产生的热量能够传导至第一屏蔽罩50的表面，并经由第一屏蔽罩50传导至散热片21以得到散发。第二子发热件323产生的热量能够传导至第二屏蔽罩51的表面，并经由第二屏蔽罩51传导至散热片21以得到散发。第一屏蔽罩50和第二屏蔽罩51的设置能够有效降低外界对第一子发热件322和第二子发热件323的不利影响。第一子发热件322、第二子发热件323和第三子发热件324可为某些处理芯片或控制芯片。In one embodiment, at least one second heating element 321 includes a first sub heating element 322 and a second sub heating element 323 and a third sub heating element 324 spaced apart from the first sub heating element 322. The thermally conductive first shield 50 connects the first sub-heating element 322 and the heat sink 21. The heat-conductive second shield 51 connects the second sub-heating element 323, the third sub-heating element 324 and the heat sink 21. The heat generated by the first sub-heating element 322 can be conducted to the surface of the first shielding case 50 and be conducted to the heat sink 21 via the first shielding case 50 to be radiated. The heat generated by the second sub-heating element 323 can be conducted to the surface of the second shield case 51 and conducted to the heat sink 21 via the second shield case 51 to be radiated. The arrangement of the first shielding cover 50 and the second shielding cover 51 can effectively reduce the adverse effects of the outside world on the first sub heating element 322 and the second sub heating element 323. The first sub heating element 322, the second sub heating element 323, and the third sub heating element 324 may be some processing chips or control chips.

可以理解，第一屏蔽罩50对第一子发热件322具有保护的作用，第二屏蔽罩51对第二子发热件323具有保护的作用。第一屏蔽罩50和第二屏蔽罩51均可以采用高导热系数的铜材料成型，例如在不影响电路板的正常工作的情况下可采用导热系数高的铜合金材料成型。It can be understood that the first shield 50 has a protective effect on the first sub-heating element 322, and the second shield 51 has a protective effect on the second sub-heating element 323. Both the first shield 50 and the second shield 51 can be formed of copper material with high thermal conductivity, for example, copper alloy material with high thermal conductivity can be formed without affecting the normal operation of the circuit board.

可以理解，为了提高第一屏蔽罩50和第一子发热件322之间的热传递效率，可通过导热涂层连接第一屏蔽罩50和第一子发热件322。其中，导热涂层例如可为导热硅脂。在图20所示 的例子中，较佳地，第一屏蔽罩50向第一子发热件322方向凸设有凸包501，第一屏蔽罩50通过凸包501连接导热涂层。It can be understood that, in order to improve the heat transfer efficiency between the first shielding case 50 and the first sub-heating member 322, the first shielding case 50 and the first sub-heating member 322 may be connected through a thermal conductive coating. Wherein, the thermally conductive coating may be thermally conductive silicone grease, for example. In the example shown in FIG. 20, preferably, the first shielding case 50 is convexly provided with a convex hull 501 toward the first sub-heating element 322, and the first shielding case 50 is connected to the thermally conductive coating through the convex hull 501.

可以理解，为了提高第二屏蔽罩51和第二子发热件323之间的热传递效率，可通过散热块54连接第二屏蔽罩51和第二子发热件323。可以理解，散热块54的导热***可设置得较高，这样即使第二子发热件323的功耗较高，散热块54也能够使第二子发热件323产生的热量充分地传导至第二屏蔽罩51的表面，进而传递到散热片以进行有效散发。第三子发热件324也可通过导热涂层与第二屏蔽罩51连接。It can be understood that, in order to improve the heat transfer efficiency between the second shielding case 51 and the second sub heating element 323, the second shielding case 51 and the second sub heating element 323 may be connected through the heat dissipation block 54. It can be understood that the heat conduction system of the heat dissipation block 54 can be set higher, so that even if the power consumption of the second sub-heating element 323 is high, the heat dissipation block 54 can sufficiently conduct the heat generated by the second sub-heating element 323 to the second The surface of the shield 51 is further transferred to the heat sink for effective distribution. The third sub-heating element 324 may also be connected to the second shield 51 through a thermally conductive coating.

在一个例子中，散热块54为铝块。散热块54贴设于第二屏蔽罩51和第二子发热件323之间。由于铝材料的散热块54的导热系数较高，这样第二子发热件323产生的热量能够得到充分地的散发。这样即使第二子发热件323的功耗较高(例如为25W)，并且使用的芯片的额定温度较低(例如为85摄氏度)，在整机使用温度较高(例如55摄氏度)的情况下，依然能够保证第二子发热件323产生的热量能够得到有效散发。In one example, the heat sink block 54 is an aluminum block. The heat dissipation block 54 is attached between the second shield 51 and the second sub-heating element 323. Since the heat dissipation block 54 of the aluminum material has a high thermal conductivity, the heat generated by the second sub-heating element 323 can be sufficiently dissipated. In this way, even if the power consumption of the second sub-heating element 323 is high (for example, 25W), and the rated temperature of the chip used is low (for example, 85 degrees Celsius), when the temperature of the whole machine is high (for example, 55 degrees Celsius) , It can still ensure that the heat generated by the second sub-heating element 323 can be effectively dissipated.

电源板34位于主控板33的下方。下面对电源板34设置方式及散热方式进行说明。其中，电源板34可包括印刷电路板。The power board 34 is located below the main control board 33. The installation method of the power board 34 and the heat dissipation method will be described below. Among them, the power board 34 may include a printed circuit board.

请结合图6、图16至图19，本实施方式提供一种散热结构，散热结构包括电路板、底板60和散热片结构61。其中，在图示的实施方式中，电路板以电源板34为例说明，可以理解，在其它实施方式中，电路板可为电子设备的其它电路板，在此不作具体限定。6, FIG. 16 to FIG. 19, this embodiment provides a heat dissipation structure. The heat dissipation structure includes a circuit board, a bottom plate 60 and a heat sink structure 61. In the illustrated embodiment, the power board 34 is used as an example for the circuit board. It can be understood that in other embodiments, the circuit board may be another circuit board of the electronic device, which is not specifically limited herein.

散热片结构61包括基板64和连接在基板64一侧的鳍片部65。电源板34安装在底板60。基板64位于电源板34和底板60之间。电源板34设有热源，例如，在该实施例中，热源为第三热源340。基板64与第三热源340导热地连接。如此，散热片结构61的基板64放在电源板34和底板60之间，这样可充分利用散热结构的空间，电源板34和底板60基本不需要做任何修改。同时，位于基板64侧边的鳍片部65可将第三热源340传递到基板64的热量及时散发出去，保证了第三热源340的散热效果。需要说明的是，散热片结构61整体作为电源板34的电源板散热片使用，以促进电源板34的散热。另外，基板64的壁厚可根据具体情况进行设置，例如基板64的壁厚可为1毫米。底板60可为结构底板。The heat sink structure 61 includes a substrate 64 and a fin portion 65 connected to the substrate 64 side. The power board 34 is mounted on the bottom plate 60. The substrate 64 is located between the power board 34 and the bottom plate 60. The power board 34 is provided with a heat source. For example, in this embodiment, the heat source is the third heat source 340. The substrate 64 is thermally connected to the third heat source 340. In this way, the base plate 64 of the heat sink structure 61 is placed between the power board 34 and the bottom plate 60, so that the space of the heat dissipation structure can be fully utilized, and the power board 34 and the bottom plate 60 basically do not need any modification. At the same time, the fins 65 on the side of the substrate 64 can dissipate the heat transferred from the third heat source 340 to the substrate 64 in time, ensuring the heat dissipation effect of the third heat source 340. It should be noted that the entire heat sink structure 61 is used as a power board heat sink of the power board 34 to promote heat dissipation of the power board 34. In addition, the wall thickness of the substrate 64 may be set according to specific circumstances, for example, the wall thickness of the substrate 64 may be 1 mm. The bottom plate 60 may be a structural bottom plate.

进一步地，请结合图17和图18，基板64设有向电源板34凸出的凸部64。第三热源340与凸部641导热地连接。如此，第三热源340产生的热量能够充分地经由凸部641传导至基板64，以进行散发。Further, referring to FIGS. 17 and 18, the substrate 64 is provided with a convex portion 64 that protrudes toward the power supply board 34. The third heat source 340 is thermally connected to the convex portion 641. In this way, the heat generated by the third heat source 340 can be sufficiently conducted to the substrate 64 via the convex portion 641 to be radiated.

可以理解，为了提高热传递效率，可使第三热源340和凸部641之间通过导热层连接。其中，导热层例如可采用导热硅胶。It can be understood that, in order to improve the heat transfer efficiency, the third heat source 340 and the convex portion 641 may be connected by a heat conductive layer. Wherein, for example, the thermally conductive layer may use thermally conductive silicone.

在本实施方式中，凸部641的数量可以为多个。散热结构可开设贯穿基板64的通孔601，多个凸部641围绕通孔601设置。多个凸部641可分别与多个第三热源340对应设置。这样第三热源340能够把热量充分地传导至各自的凸部641，再通过鳍片部65与空气进行换热，继而达到将高功耗器件的热量传递到环境中的目的。通孔601的设置可使散热结构底部的冷空气进入散热片结构61，加快了散热结构的散热效率。在图18所示的方位中，通孔601上下贯穿基板64。In this embodiment, the number of convex portions 641 may be plural. The heat dissipation structure may have a through hole 601 penetrating through the substrate 64, and a plurality of convex portions 641 are disposed around the through hole 601. The plurality of convex portions 641 may be respectively provided corresponding to the plurality of third heat sources 340. In this way, the third heat source 340 can fully conduct the heat to the respective convex portions 641, and then exchange heat with the air through the fin portion 65, and then achieve the purpose of transferring the heat of the high power consumption device to the environment. The arrangement of the through hole 601 allows cold air at the bottom of the heat dissipation structure to enter the heat dissipation fin structure 61, which accelerates the heat dissipation efficiency of the heat dissipation structure. In the orientation shown in FIG. 18, the through hole 601 penetrates the substrate 64 up and down.

可以理解，凸部641可由基板64的压型所形成，也即是，可将板材通过带有凸凹图案的模具冲压来形成凸部641以及通孔601。这样便于凸部641和通孔601的形成，减少了制造工艺。基板64可采用高导热系数的铝合金压铸而成，这样制造成本较低。It can be understood that the convex portion 641 can be formed by pressing the substrate 64, that is, the convex portion 641 and the through hole 601 can be formed by stamping the plate material through a die with a convex-concave pattern. This facilitates the formation of the convex portion 641 and the through hole 601, which reduces the manufacturing process. The substrate 64 can be made of aluminum alloy with high thermal conductivity die-casting, so the manufacturing cost is lower.

在某些实施方式中，鳍片部65包括连接板651和第二散热鳍片652。连接板651连接在基板64的一侧并安装在底板60。第二散热鳍片652设置在与底板60相背的连接板651的一表面。如此，鳍片部65的散热面积较大，这样利于基板64热量的散出。In some embodiments, the fin part 65 includes a connection plate 651 and a second heat dissipation fin 652. The connection plate 651 is connected to one side of the substrate 64 and is mounted on the bottom plate 60. The second heat dissipation fin 652 is disposed on a surface of the connecting plate 651 opposite to the bottom plate 60. In this way, the heat dissipation area of the fin portion 65 is large, which facilitates the heat dissipation of the substrate 64.

进一步，第二散热鳍片652的数目为多个。多个第二散热鳍片652间隔设置在连接板651的表面。相邻两个第二散热鳍片652形成通道6521。通道6521的一端开口至少部分地朝向电源板34和底板60之间的空间。如此，风道13内的气流能够通过电源板34和底板60之间的空间进入通道6521内以带走电源板34的热量，以使电源板34的散热得到及时散发。较佳地，通 道6521的一端开口正对电源板34和底板60之间的空间。Further, the number of the second heat dissipation fins 652 is plural. A plurality of second heat dissipation fins 652 are arranged on the surface of the connecting plate 651 at intervals. Two adjacent second heat dissipation fins 652 form a channel 6521. One end of the channel 6521 is open at least partially toward the space between the power board 34 and the bottom plate 60. In this way, the airflow in the air duct 13 can enter the passage 6521 through the space between the power board 34 and the bottom plate 60 to take away the heat of the power board 34, so that the heat dissipation of the power board 34 can be radiated in time. Preferably, one end of the channel 6521 is open to face the space between the power supply board 34 and the bottom plate 60.

进一步，多个通道6521相互平行。如此，相互平行的多个通道6521可对气流有较佳的整流效果，不会或较小地引起气流的紊乱，使得气流能够较快的通过多个通道6521，散热片结构61具有较佳的散热效果。Further, multiple channels 6521 are parallel to each other. In this way, the multiple channels 6521 parallel to each other can have a better rectification effect on the airflow, without causing or turbulence of the airflow, so that the airflow can pass through the multiple channels 6521 faster, and the heat sink structure 61 has a better heat radiation.

请结合图17，较佳地，为了提高第二散热鳍片652的散热效率，可使得第二散热鳍片652位于电源板34的一侧，并使第二散热鳍片652的高度高于电源板34的高度。这样使得电源板34上方的气流能够吹到第二散热鳍片652。Please refer to FIG. 17. Preferably, in order to improve the heat dissipation efficiency of the second heat dissipation fin 652, the second heat dissipation fin 652 may be located on the side of the power board 34, and the height of the second heat dissipation fin 652 is higher than the power supply The height of the plate 34. This enables the airflow above the power board 34 to blow to the second heat dissipation fin 652.

通常地，散热片结构采用金属材料制造。而电源板34设有电容器(图未示出)。为了使减少基板64对电容器的影响，可使电容器与基板64之间绝缘，因此，请结合图19，散热结构包括绝缘片62，绝缘片62设置在基板64的表面部位642，并使表面部位642与电源板34相对且与电容器的位置对应。其中，绝缘片62可采用聚碳酸酯(PC)材料，这样硬度较高。绝缘片62可通过单片背胶的方式贴在基板64上。Generally, the heat sink structure is made of metal materials. The power board 34 is provided with a capacitor (not shown). In order to reduce the influence of the substrate 64 on the capacitor, the capacitor can be insulated from the substrate 64. Therefore, please refer to FIG. 19, the heat dissipation structure includes an insulating sheet 62, the insulating sheet 62 is provided on the surface portion 642 of the substrate 64, and the surface portion 642 is opposite to the power board 34 and corresponds to the position of the capacitor. Among them, the insulating sheet 62 can be made of polycarbonate (PC) material, so that the hardness is higher. The insulating sheet 62 can be attached to the substrate 64 by a single piece of adhesive.

为了便于基板64的安装和提高安装稳定性，基板64开设第一安装孔640，安装件63穿设第一安装孔640并连接电源板34和底板60。在图16中，第一安装孔640的数量为多个，多个第一安装孔640沿基板64的周向间隔设置。在一个例子中，安装件63可为螺钉和/或卡件。In order to facilitate the installation of the substrate 64 and improve the installation stability, the substrate 64 defines a first mounting hole 640, and the mounting member 63 penetrates the first mounting hole 640 and connects the power board 34 and the bottom plate 60. In FIG. 16, the number of the first mounting holes 640 is plural, and the plurality of first mounting holes 640 are arranged at intervals along the circumferential direction of the substrate 64. In one example, the mounting member 63 may be a screw and/or a clip.

可以理解，上述的电源板34设置方式及散热方式也适用于其他电路板中，这里不做进一步阐述，具体可参考电源板34的设置方式及散热方式。It can be understood that the above-mentioned power board 34 setting method and heat dissipation method are also applicable to other circuit boards, which will not be further elaborated here. For details, refer to the power board 34 setting method and heat dissipation method.

请结合图4和图5，图传板35位于散热片21的上方。至少一个第一发热件311设置在图传板35。可以理解，第一发热件311的数目可根据具体情况进行设置。可以理解，为了促进第一发热件311的散热，可在图传板35的上方设置图传板散热片351，并使图传板散热片351导热地连接至少一个第一发热件311。至少一个第一发热件311可包括一个、两个或两个以上的第一发热件311。4 and 5, the picture transmission board 35 is located above the heat sink 21. At least one first heating element 311 is provided on the image transmission board 35. It can be understood that the number of the first heating elements 311 can be set according to specific conditions. It can be understood that, in order to promote the heat dissipation of the first heat generating element 311, a heat transmitting plate fin 351 may be provided above the picture transmitting plate 35, and the heat transmitting plate fin 351 is thermally connected to at least one first heat generating element 311. The at least one first heating element 311 may include one, two or more first heating elements 311.

为了减少外界影响第一发热件311的运行，可通过导热的第三屏蔽罩52连接至少一个第一发热件311和图传板散热片21。可以理解，第三屏蔽罩52对第一发热件311具有保护的作用。第三屏蔽罩52均可以采用高导热系数的铜材料成型，例如在不影响电路板的正常工作的情况下可采用导热系数高的铜合金材料成型。In order to reduce the influence of the outside on the operation of the first heating element 311, at least one first heating element 311 and the heat sink 21 of the image transmission board may be connected through the thermally conductive third shield 52. It can be understood that the third shield 52 has a protective effect on the first heating element 311. The third shield 52 can be formed by using a copper material with a high thermal conductivity. For example, it can be formed by using a copper alloy material with a high thermal conductivity without affecting the normal operation of the circuit board.

在图5所示的例子中，第一发热件311的数目为两个，两个第一发热件311间隔设置。第三屏蔽罩52罩设两个第一发热件311。两个第一发热件311产生的热量能够传导至第三屏蔽罩52的表面，并经由图传板散热片21进行散发。图传板散热片21也可包括散热鳍片。In the example shown in FIG. 5, the number of the first heating elements 311 is two, and the two first heating elements 311 are spaced apart. The third shield 52 covers two first heating elements 311. The heat generated by the two first heating elements 311 can be conducted to the surface of the third shield 52 and dissipated through the heat sink 21 of the image transmission plate. The image transmission plate heat sink 21 may also include heat dissipation fins.

飞控板36设置在散热片21的上表面。具体地，图传板35设在第一鳍片2131的较低一级，飞控板36设在第一鳍片2131的较高一级，如此，通过错层布置图传板35和飞控板36，使得两个电路板均能够得到较效的散热。The flight control board 36 is provided on the upper surface of the heat sink 21. Specifically, the image transmission plate 35 is provided at the lower level of the first fin 2131, and the flight control plate 36 is provided at the higher level of the first fin 2131. Thus, the image transmission plate 35 and the flight control are arranged by split layers The board 36 enables both circuit boards to obtain effective heat dissipation.

请结合图4及图15，风扇组件40包括风扇支架41和风扇42。风扇支架41包括容置部411和挡板部412。容置部411开设有容置腔4111。风扇42收容在容置腔4111。风道13包括形成在挡板部412且沿靠近出风口11的方向呈渐缩形状的挡板风道131。容置腔4111连通挡板风道131和出风口11。其中，风扇支架41能够起到将风扇42安装到壳体10的作用。4 and FIG. 15, the fan assembly 40 includes a fan bracket 41 and a fan 42. The fan bracket 41 includes an accommodating portion 411 and a baffle portion 412. The accommodating portion 411 defines an accommodating cavity 4111. The fan 42 is accommodated in the accommodating cavity 4111. The air duct 13 includes a baffle air duct 131 formed in the baffle portion 412 and tapered in a direction close to the air outlet 11. The accommodating cavity 4111 communicates with the baffle duct 131 and the air outlet 11. Among them, the fan bracket 41 can play a role of mounting the fan 42 to the housing 10.

在图15所示的例子中，挡板部412包括连接在容置部411两侧的两个挡板4121。挡板风道131形成在两个挡板4121之间。两个挡板4121连接壳体10的底部。两个挡板4121围成呈漏斗状的风道形状，保证从进风侧进入壳体10内部的空气能够最大限度地被风扇42排出，避免在风扇42两侧产生涡流和死区。In the example shown in FIG. 15, the baffle portion 412 includes two baffles 4121 connected to both sides of the accommodating portion 411. The baffle duct 131 is formed between the two baffles 4121. Two baffles 4121 are connected to the bottom of the housing 10. The two baffles 4121 enclose a funnel-shaped air duct shape to ensure that the air entering the inside of the housing 10 from the air inlet side can be discharged to the maximum extent by the fan 42 to avoid vortexes and dead zones on both sides of the fan 42.

较佳地，为了使风扇42能够提供较大的风量，风扇42为轴流风扇，风扇42吸入风道13的空气，并通过出风口11排出。Preferably, in order to enable the fan 42 to provide a larger air volume, the fan 42 is an axial fan. The fan 42 sucks the air in the air duct 13 and discharges it through the air outlet 11.

可以理解，为了便于风扇支架41的成型和提高风扇支架41的结构强度，可使风扇支架41为一体结构。并且，风扇支架41可采用注塑工艺成型，以减少零件数量，并减轻电子设备100整机重量。It can be understood that, in order to facilitate the formation of the fan bracket 41 and improve the structural strength of the fan bracket 41, the fan bracket 41 may be made into an integrated structure. Moreover, the fan bracket 41 can be formed by an injection molding process to reduce the number of parts and reduce the weight of the entire electronic device 100.

在某些实施方式中，为了对定位板35的散热，定位板35至少部分地位于挡板风道131内 且与散热片21导热地连接。这样定位板35离风扇42较近，风压较高，不需做其他处理。其中，定位板35可采用RTK(Real-time kinematic，实时动态)载波相位差分技术进行定位，也可以通过全球定位***(GPS)进行定位，在此不作限定。In some embodiments, in order to dissipate heat from the positioning plate 35, the positioning plate 35 is located at least partially within the baffle duct 131 and is thermally connected to the heat sink 21. In this way, the positioning plate 35 is closer to the fan 42 and the wind pressure is higher, so no other processing is required. Wherein, the positioning board 35 may be positioned using RTK (Real-time Kinematic, real-time dynamic) carrier phase differential technology, or may be positioned through a global positioning system (GPS), which is not limited herein.

可以理解，在其他实施方式中，主控板33、电源板34、图传板35、飞控板36和定位板37的排布方式可以根据实际需要进行设置，电路板也可以包括主控板33、电源板34、图传板35、飞控板36和定位板37中的一个或多个，本实施例仅为示例性说明，在此不作限定。It can be understood that in other embodiments, the arrangement of the main control board 33, the power board 34, the image transmission board 35, the flight control board 36 and the positioning board 37 can be set according to actual needs, and the circuit board can also include the main control board 33. One or more of the power board 34, the image transmission board 35, the flight control board 36 and the positioning board 37. This embodiment is only an exemplary description and is not limited herein.

请结合图21及图25，本实施方式提供一种减震结构70，其设置在壳体10内。减震结构70包括板体、减震部件72和第二安装部73。减震部件72通过第二安装部73与板体安装在一起。减震部件72包括实心部721和空心部722。21 and FIG. 25, this embodiment provides a shock absorbing structure 70, which is disposed in the housing 10. The shock absorbing structure 70 includes a plate body, a shock absorbing member 72, and a second mounting portion 73. The shock absorbing member 72 is attached to the plate body through the second attachment portion 73. The shock absorbing member 72 includes a solid portion 721 and a hollow portion 722.

请结合图23、为了进一步优化减震结构70的减震效果，可将实心部721的长度H2所占的减震部件72的总长H1的第一比例在第一预设范围内，以使实心部721和空心部722能够同时兼顾硬度和软度，这样能够通过对第一比例的设定，可精确设计减震部件72的模态，可满足电子设备100的减震需求。和/或者，可将实心部721的截面面积m1(如图23所示的虚线框k2内减震部件72的剖面线部位的面积)所占减震部件72的总截面面积m2(如图23所示的虚线框k1内减震部件72的剖面线部位的面积)的第二比例在第二预设范围内，以使实心部721和空心部722能够同时兼顾硬度和软度，这样能够通过对第二比例的设定，可精确设计减震部件72的模态，可满足电子设备100的减震需求。可以理解，可同时通过对第一比例和第二比例进行设定，以满足电子设备100的减震需求。23, in order to further optimize the damping effect of the damping structure 70, the first proportion of the total length H1 of the damping member 72 occupied by the length H2 of the solid portion 721 may be within a first preset range to make the solid The portion 721 and the hollow portion 722 can take into account both the hardness and the softness, so that by setting the first ratio, the modal of the shock-absorbing member 72 can be accurately designed, which can meet the shock-absorbing requirements of the electronic device 100. And/or, the cross-sectional area m1 of the solid portion 721 (the area of the cross-sectional area of the damping member 72 in the dotted frame k2 shown in FIG. 23) can occupy the total cross-sectional area m2 of the damping member 72 (see FIG. 23 The second ratio of the area of the cross-sectional area of the shock absorbing member 72 in the dashed frame k1 shown is within the second preset range, so that the solid portion 721 and the hollow portion 722 can take into account both hardness and softness, so that it can pass For the setting of the second ratio, the modal of the shock-absorbing component 72 can be accurately designed to meet the shock-absorbing requirements of the electronic device 100. It can be understood that the first ratio and the second ratio can be set at the same time to meet the shock absorption requirements of the electronic device 100.

需要说明的是，上述的第一比例和第二比例可根据具体情况进行相应的设定。较佳地，第一比例的比例范围为大于0.3并小于0.5，而第二比例的比例范围为大于0.5并小于0.75。在一些例子中，第一比例为0.38，而第二比例为0.64。另外，减震结构70的模态设计还可根据具体的使用需要进行相应的优化，例如，在电子设备100为无人机时，可在20-70赫兹(Hz)的范围内对减震结构70进行模态设计，以避开无人机的整机振动和云台振动的共振频率，并保证减震结构70实际的减震效果。It should be noted that the above-mentioned first ratio and second ratio can be set according to specific conditions. Preferably, the ratio range of the first ratio is greater than 0.3 and less than 0.5, and the ratio range of the second ratio is greater than 0.5 and less than 0.75. In some examples, the first ratio is 0.38 and the second ratio is 0.64. In addition, the modal design of the shock-absorbing structure 70 can also be optimized according to the specific use needs. For example, when the electronic device 100 is a drone, the shock-absorbing structure can be adjusted in the range of 20-70 hertz (Hz) 70 performs modal design to avoid the resonant frequency of UAV's whole machine vibration and gimbal vibration, and to ensure the actual shock absorption effect of shock absorption structure 70.

在一个例子中，实心部721和空心部722均呈圆柱状，实心部721的直径大于空心部722的直径，这样实心部721的承载面积较大，利于减震结构70的减震。当然，实心部721和空心部722还均可呈其他形状这可根据具体情况进行设置。In an example, the solid portion 721 and the hollow portion 722 are both cylindrical, and the diameter of the solid portion 721 is larger than the diameter of the hollow portion 722, so that the solid area 721 has a larger bearing area, which is beneficial to the shock absorption of the shock absorbing structure 70. Of course, the solid portion 721 and the hollow portion 722 may also have other shapes, which can be set according to specific circumstances.

在图23至图25所示的例子中，实心部721和空心部722均呈圆柱状，其中D ₁和D ₃分别代表空心部722的外径和内径，D ₂代表实心部721的直径。在实际对减震结构70的模态设计时，可设定三个方向(X方向、Y方向和Z方向，如图24所示)的仿真模拟频率分布为f _x、f _y和f _z，并可设定X方向、Y方向和Z方向的目标频率分别为f _x0、f _y0和f _z0。这样可通过改变H ₂、D ₂来调整f _z，并可通过改变D ₂来调整f _x和f _y。在一种实施方式中，可将H ₁和H ₂设定为受结构形式限制的定值，并且D ₃也保持不变。这样可通过下列公式得到新的H ₂和D ₂。 In the examples shown in FIGS. 23 to 25, the solid portion 721 and the hollow portion 722 are both cylindrical, where D ₁ and D ₃ respectively represent the outer diameter and the inner diameter of the hollow portion 722, and D ₂ represents the diameter of the solid portion 721. In the actual design of the mode of the shock absorbing structure 70 can be set when three directions (X direction, Y direction and Z direction shown in FIG. 24) distribution of simulation frequency f _x, f _y, and f _z, and setting the X-direction, the target frequency Y and Z directions respectively f _x0, f _y0 and f _z0. In this way, f _z can be adjusted by changing H ₂ and D ₂ , and f _x and f _y can be adjusted by changing D ₂ . In one embodiment, H ₁ and H ₂ can be set to fixed values limited by the structural form, and D ₃ also remains unchanged. In this way, new H ₂ and D ₂ can be obtained by the following formula.

重复上述步骤，这样可通过迭代算法上述公式以得到合适的H ₂和D ₂。 Repeat the above steps, so that iterative algorithm can obtain the appropriate H ₂ and D ₂ by the above formula.

在本实施方式中，第二安装部73的数目是两个，两个第二安装部73分别安装在减震部件72的相背两侧，这样减震部件72能够起到较佳的减震效果，而且减震部件72也可安装更多的板体。In this embodiment, the number of the second mounting portions 73 is two, and the two second mounting portions 73 are respectively installed on opposite sides of the shock absorbing member 72, so that the shock absorbing member 72 can achieve better shock absorption. Effect, and the shock absorbing member 72 can also be installed with more plates.

具体地，板体可包括第一板和第二板，可将两个第二安装部73分别安装在第一板和第二板，以减小第一板和第二板之间的振动。需要说明的是，减震部件72可由具有一定弹性的材料构成，例如可包括硅胶。Specifically, the plate body may include a first plate and a second plate, and two second mounting portions 73 may be installed on the first plate and the second plate, respectively, to reduce vibration between the first plate and the second plate. It should be noted that the shock absorbing member 72 may be composed of a material with a certain elasticity, for example, it may include silicone.

在一种实施方式中，板体可以为电路板，诸如主控板、电源板、图传板、飞控板和定位板中的一个和多个，在此不作限定。In an embodiment, the board body may be a circuit board, such as one or more of a main control board, a power board, a picture transmission board, a flight control board, and a positioning board, which is not limited herein.

在本实施方式中，请结合图21，第一板可为散热片21，第二板可为电源板34。In this embodiment, please refer to FIG. 21, the first board may be a heat sink 21 and the second board may be a power board 34.

进一步地，板体包括第三板，第三板通过第一板安装在减震部件72。这样，第三板通过第一板悬挂在减震结构上，使得第三板的减震效果更佳。Further, the plate body includes a third plate, and the third plate is mounted on the shock absorbing member 72 through the first plate. In this way, the third board is suspended on the shock-absorbing structure through the first board, so that the third board has a better shock-absorbing effect.

在本实施方式中，请结合图21，第三板可为主控板33。另外，板体所包括的板体的数目和类型可根据具体情况进行设置，在此不作具体限定。In this embodiment, please refer to FIG. 21, the third board may be the main control board 33. In addition, the number and type of the board bodies included in the board body can be set according to specific conditions, and is not specifically limited herein.

在图9及图21所示的例子中，第一板为散热片21，散热片21包括安装臂216，安装臂216开设有安装槽210。减震部件72通过第二安装部73和第二安装孔711以使第一板与减震部件72实现连接。In the examples shown in FIGS. 9 and 21, the first plate is a heat sink 21. The heat sink 21 includes a mounting arm 216, and the mounting arm 216 defines a mounting groove 210. The damping member 72 passes through the second mounting portion 73 and the second mounting hole 711 to connect the first plate to the damping member 72.

为了进一步优化减震结构70的安装，第二安装部73包括固持部723和预安装部731，固持部723连接预安装部731和空心部722，板体开设第二安装孔711，固持部723穿设第二安装孔711并将板体固定在减震部件72。其中，预安装部731用于在减震部件72与板体安装时，通过第二安装孔711预定位减震部件72。In order to further optimize the installation of the shock absorbing structure 70, the second mounting portion 73 includes a holding portion 723 and a pre-installing portion 731, the holding portion 723 connects the pre-installing portion 731 and the hollow portion 722, the plate body defines a second mounting hole 711, and the holding portion 723 The second mounting hole 711 is penetrated and the plate body is fixed to the shock absorbing member 72. Wherein, the pre-mounting portion 731 is used to pre-position the damping member 72 through the second mounting hole 711 when the damping member 72 is mounted on the plate body.

如此，在安装时，可通过预安装部731进行定位，这样在在狭小的空间进行操作时，预安装部731可以提供多余的安装支撑点，并且在通过预安装部731对减震结构70实现预安装后，可通过拉伸预安装部731来实现减震部件72的固定安装，方便操作和维修。另外，在实现减震结构70的安装后，可将预安装部731(如图23所示的t1段和t2段)移除。可以理解，为了提高固持部723安装的稳定性，可沿板体安装至固持部723的方向，使固持部723设有呈渐扩形状的第一卡块724。这样第一卡块724在固持部723的安装过程中能够起到卡紧的作用。In this way, during installation, the pre-installation portion 731 can be used for positioning, so that the pre-installation portion 731 can provide redundant installation support points when operating in a small space, and the pre-installation portion 731 can realize the shock-absorbing structure 70 After the pre-installation, the pre-installation portion 731 can be stretched to achieve the fixed installation of the shock absorbing member 72, which is convenient for operation and maintenance. In addition, after the installation of the shock absorbing structure 70 is achieved, the pre-installed portion 731 (the t1 and t2 sections shown in FIG. 23) may be removed. It can be understood that, in order to improve the stability of the mounting of the holding portion 723, the first clamping block 724 in a gradually expanding shape may be provided in the holding portion 723 along the direction in which the plate body is mounted to the holding portion 723. In this way, the first clamping block 724 can play a clamping role during the installation of the holding portion 723.

可以理解，为了便于对预安装部731进行定位，可在沿板体安装至固持部723的方向，使预安装部731设有呈渐扩形状的第二卡块732。另外，相对于减震部件72的轴线a，可使第二卡块732凸出的高度小于第一卡块724凸出的高度，这样第二卡块732对预安装部731具有较佳的导向作用，而第一卡块724的卡紧作用较佳。It can be understood that, in order to facilitate positioning of the pre-installation portion 731, the pre-installation portion 731 may be provided with a second block 732 having a gradually expanding shape in the direction of mounting the plate body to the holding portion 723. In addition, with respect to the axis a of the shock absorbing member 72, the protrusion height of the second clamping block 732 may be smaller than the protrusion height of the first clamping block 724, so that the second clamping block 732 has better guidance to the pre-mounting portion 731 The first clamping block 724 has a better clamping effect.

上述的减震结构70可采用如下的的安装方法进行安装，减震结构70的安装方法包括步骤：The above shock absorbing structure 70 can be installed by using the following installation method. The installation method of the shock absorbing structure 70 includes steps:

步骤S1、使预安装部731穿设第二安装孔711并从第二安装孔711露出；Step S1, the pre-mounting portion 731 is penetrated through the second mounting hole 711 and exposed from the second mounting hole 711;

步骤S2、固定板体并向远离板体的方向拉伸预安装部731以使固持部723卡在板体。Step S2: Fix the plate body and stretch the pre-mounting portion 731 in a direction away from the plate body so that the holding portion 723 is stuck to the plate body.

在步骤S2中，在固持部723卡在板体后(如图22及23所示)，移除预安装部731，以使减震结构70如图21所示。如此，可减少减震结构70的占用空间。In step S2, after the holding portion 723 is stuck on the plate body (as shown in FIGS. 22 and 23), the pre-installation portion 731 is removed, so that the shock absorbing structure 70 is as shown in FIG. In this way, the occupied space of the shock absorbing structure 70 can be reduced.

综上所述，本实施方式的电子设备100包括壳体10、散热组件20和电路板30，壳体10开设有进风口111、出风口121和连通进风口111和出风口121的风道13，散热组件20和电路板30位于风道13内，散热组件20包括散热片22，电路板30设有第一热源31和第二热源32，散热片21包括上表面211和下表面212，第一热源31位于上表面211且与散热片21导热地连接，第二热源32位于下表面212且与散热片21导热地连接。In summary, the electronic device 100 of this embodiment includes a housing 10, a heat dissipation assembly 20, and a circuit board 30. The housing 10 defines an air inlet 111, an air outlet 121, and an air duct 13 connecting the air inlet 111 and the air outlet 121 The heat dissipation assembly 20 and the circuit board 30 are located in the air duct 13. The heat dissipation assembly 20 includes a heat sink 22. The circuit board 30 is provided with a first heat source 31 and a second heat source 32. The heat sink 21 includes an upper surface 211 and a lower surface 212. A heat source 31 is located on the upper surface 211 and thermally connected to the heat sink 21, and a second heat source 32 is located on the lower surface 212 and thermally connected to the heat sink 21.

上述电子设备100中，由于第一热源31和第二热源32分别分布在散热片21的上下表面，因此，在壳体10内形成风道并联热阻的形式，降低了电子设备100整机的热阻，进而满足了壳体10内分散热源的散热需求，提高了电子设备100的散热效率。In the above electronic device 100, since the first heat source 31 and the second heat source 32 are distributed on the upper and lower surfaces of the heat sink 21, respectively, a form of air duct parallel thermal resistance is formed in the housing 10, which reduces the overall power of the electronic device 100 The thermal resistance, in turn, satisfies the heat dissipation requirements of the dispersed heat source in the housing 10, and improves the heat dissipation efficiency of the electronic device 100.

在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。In this application, unless otherwise clearly specified and defined, the first feature "above" or "below" the second feature may include the direct contact of the first and second features, or may include the first and second features Contact not directly but through another feature between them. Moreover, the first feature is “above”, “above” and “above” the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature is “below”, “below” and “below” the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is less horizontal than the second feature.

上文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，上文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了 简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The above disclosure provides many different implementations or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit this application. In addition, the present application may repeat reference numerals and/or reference letters in different examples. Such repetition is for simplicity and clarity, and does not itself indicate the relationship between the various embodiments and/or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and/or the use of other materials.

在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。In the description of this specification, the descriptions referring to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" mean combined embodiments The specific features, structures, materials, or characteristics described in the examples are included in at least one embodiment or example of the present application. In this specification, the schematic expression of the above-mentioned terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

尽管已经示出和描述了本申请的实施方式，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。Although the embodiments of the present application have been shown and described, those of ordinary skill in the art may understand that various changes, modifications, replacements, and variations can be made to these embodiments without departing from the principle and purpose of the present application, The scope of the application is defined by the claims and their equivalents.

Claims (40)

1. 一种电子设备，其特征在于，包括壳体、散热组件和电路板，所述壳体开设有进风口、出风口和连通所述进风口和所述出风口的风道，所述散热组件和所述电路板位于所述风道内，所述散热组件包括散热片，所述电路板设有第一热源和第二热源，所述散热片包括上表面和下表面，所述第一热源位于所述上表面且与所述散热片导热地连接，所述第二热源位于所述下表面且与所述散热片导热地连接。An electronic device is characterized by comprising a housing, a heat dissipation component and a circuit board, the housing is provided with an air inlet, an air outlet and an air channel connecting the air inlet and the air outlet, the heat dissipation component and The circuit board is located in the air duct, the heat dissipation assembly includes a heat sink, the circuit board is provided with a first heat source and a second heat source, the heat sink includes an upper surface and a lower surface, and the first heat source is located The upper surface is thermally connected to the heat sink, and the second heat source is located on the lower surface and thermally connected to the heat sink.
2. 根据权利要求1所述的电子设备，其特征在于，所述电路板包括主控板，所述主控板位于所述散热片的下方，所述第二热源包括设置在所述主控板的至少一发热件。The electronic device according to claim 1, wherein the circuit board includes a main control board, the main control board is located below the heat sink, and the second heat source includes a At least one heating element.
3. 根据权利要求2所述的电子设备，其特征在于，所述至少一发热件包括第一发热件，所述电子设备包括连接所述第一发热件和所述散热片的导热的第一屏蔽罩。The electronic device according to claim 2, wherein the at least one heat generating element includes a first heat generating element, and the electronic device includes a thermally conductive first shielding case connecting the first heat generating element and the heat sink .
4. 根据权利要求3所述的电子设备，其特征在于，所述电子设备包括导热涂层，所述导热涂层连接所述第一屏蔽罩和所述第一发热件。The electronic device according to claim 3, wherein the electronic device includes a thermally conductive coating, the thermally conductive coating connecting the first shielding case and the first heating element.
5. 根据权利要求3所述的电子设备，其特征在于，所述至少一发热件包括与所述第一发热件间隔的第二发热件，所述电子设备包括连接所述第二发热件和所述散热片的导热的所述第二屏蔽罩。The electronic device according to claim 3, wherein the at least one heating element includes a second heating element spaced from the first heating element, and the electronic device includes a connection between the second heating element and the The heat-conducting second shield of the heat sink.
6. 根据权利要求5所述的电子设备，其特征在于，所述电子设备包括散热块，所述散热块连接所述第二屏蔽罩和所述第二发热件。The electronic device according to claim 5, wherein the electronic device includes a heat dissipation block, and the heat dissipation block connects the second shield case and the second heating element.
7. 根据权利要求2所述的电子设备，其特征在于，所述电路板包括电源板，所述电源板位于所述主控板下方，所述电源板连接有电源板散热片。The electronic device according to claim 2, wherein the circuit board includes a power board, the power board is located below the main control board, and the power board is connected with a power board heat sink.
8. 根据权利要求7所述的电子设备，其特征在于，所述电子设备包括底板，所述电源板散热片包括基板和连接在所述基板一侧的鳍片部，所述电源板安装在所述底板，所述基板位于所述电源板和所述底板之间，所述电源板设有第三热源，所述基板与所述第三热源导热地连接。The electronic device according to claim 7, wherein the electronic device includes a bottom plate, the power board heat sink includes a substrate and a fin portion connected to one side of the substrate, the power board is mounted on the A bottom plate, the substrate is located between the power supply plate and the bottom plate, the power supply plate is provided with a third heat source, and the substrate is thermally connected to the third heat source.
9. 根据权利要求8所述的电子设备，其特征在于，所述基板设有向所述电源板凸出的凸部，所述第三热源与所述凸部导热地连接。The electronic device according to claim 8, wherein the substrate is provided with a convex portion protruding toward the power supply board, and the third heat source is thermally connected to the convex portion.
10. 根据权利要求9所述的电子设备，其特征在于，所述第三热源和所述凸部之间通过导热层连接。The electronic device according to claim 9, wherein the third heat source and the convex portion are connected by a heat conductive layer.
11. 根据权利要求9所述的电子设备，其特征在于，所述凸部的数量是多个，所述散热结构开设有贯穿所述基板的通孔，多个所述凸部围绕所述通孔设置。The electronic device according to claim 9, wherein the number of the convex portions is plural, the heat dissipation structure is provided with a through hole penetrating the substrate, and the plural convex portions are disposed around the through hole .
12. 根据权利要求9所述的电子设备，其特征在于，所述凸部由所述基板的压型所形成。The electronic device according to claim 9, wherein the convex portion is formed by pressing the substrate.
13. 根据权利要求8所述的电子设备，其特征在于，所述鳍片部包括连接板和散热鳍片，所述连接板连接在所述基板的一侧并安装在所述底板，所述散热鳍片设置在与所述底板相背的所述连接板的一表面。The electronic device according to claim 8, wherein the fin portion includes a connection plate and a heat dissipation fin, the connection plate is connected to one side of the base plate and installed on the bottom plate, the heat dissipation fin The sheet is provided on a surface of the connecting plate opposite to the bottom plate.
14. 根据权利要求13所述的电子设备，其特征在于，所述散热鳍片的数目为多个，多个所述散热鳍片间隔设置在所述连接板的表面，相邻两个所述散热鳍片形成通道，所述通道的一端开口至少部分地朝向所述电源板和所述底板之间的空间。The electronic device according to claim 13, wherein the number of the heat dissipation fins is plural, the plurality of heat dissipation fins are arranged on the surface of the connecting plate at intervals, and the two adjacent heat dissipation fins The sheet forms a channel with one end opening of the channel at least partially facing the space between the power board and the bottom plate.
15. 根据权利要求14所述的电子设备，其特征在于，多个所述散热鳍片形成有多个所述通道，多个所述通道相互平行。The electronic device according to claim 14, wherein a plurality of the cooling fins are formed with a plurality of the channels, and the plurality of the channels are parallel to each other.
16. 根据权利要求13所述的电子设备，其特征在于，所述散热鳍片位于所述电源板的一侧，所述散热鳍片的高度高于所述电源板的高度。The electronic device according to claim 13, wherein the heat dissipation fin is located on one side of the power board, and the height of the heat dissipation fin is higher than the height of the power board.
17. 根据权利要求8所述的电子设备，其特征在于，所述电源板设有电容器，所述散热结构包括绝缘片，所述绝缘片设置在所述基板的表面部位，所述表面部位与所述电源板相对且与所述电容器的位置对应。The electronic device according to claim 8, wherein the power board is provided with a capacitor, the heat dissipation structure includes an insulating sheet, the insulating sheet is provided on a surface portion of the substrate, the surface portion and the The power board is opposite and corresponds to the position of the capacitor.
18. 根据权利要求8所述的电子设备，其特征在于，所述基板开设有安装孔，所述散热结构包括安装件，所述安装件穿设所述安装孔并连接所述电源板和所述底板。The electronic device according to claim 8, wherein the substrate is provided with a mounting hole, and the heat dissipation structure includes a mounting member, the mounting member penetrates the mounting hole and connects the power supply board and the bottom plate .
19. 根据权利要求1所述的电子设备，其特征在于，所述电路板包括图传板，所述图传板 位于所述散热片的上方，所述第一热源包括设置在所述图传板的至少一发热件。The electronic device according to claim 1, wherein the circuit board comprises a picture transmission board, the picture transmission board is located above the heat sink, and the first heat source comprises a board arranged on the picture transmission board At least one heating element.
20. 根据权利要求19所述的电子设备，其特征在于，所述电子设备包括位于所述图传板上方的图传板散热片，所述图传板散热片导热地连接所述至少一发热件。The electronic device according to claim 19, characterized in that the electronic device includes a heat sink of a picture transmission board located above the picture transmission board, and the heat sink of the picture transmission board is thermally connected to the at least one heating element.
21. 根据权利要求20所述的电子设备，其特征在于，所述电子设备包括连接所述至少一发热件和所述图传板散热片的导热的第三屏蔽罩。The electronic device according to claim 20, characterized in that the electronic device includes a thermally conductive third shielding case connecting the at least one heating element and the heat sink of the image transmission board.
22. 根据权利要求1所述的电子设备，其特征在于，所述电路板包括飞控板，所述飞控板设置在所述散热片的上表面。The electronic device according to claim 1, wherein the circuit board includes a flight control board, and the flight control board is disposed on an upper surface of the heat sink.
23. 根据权利要求1所述的电子设备，其特征在于，所述散热片的上表面设有散热鳍片，所述第一热源设在所述散热鳍片上。The electronic device according to claim 1, wherein the upper surface of the heat sink is provided with heat dissipation fins, and the first heat source is provided on the heat dissipation fins.
24. 根据权利要求24所述的电子设备，其特征在于，所述散热鳍片包括第一鳍片和第二鳍片，所述第一鳍片与所述散热片为一体结构，所述散热片设有本体部和安装部，所述本体部连接所述安装部，所述第一鳍片设在所述本体部，所述第二鳍片通过冲压方式形成在所述安装部。The electronic device according to claim 24, wherein the heat dissipation fin includes a first fin and a second fin, the first fin and the heat dissipation fin are an integral structure, and the heat dissipation fin is provided There is a body portion and a mounting portion, the body portion is connected to the mounting portion, the first fin is provided on the body portion, and the second fin is formed on the mounting portion by stamping.
25. 根据权利要求24所述的电子设备，其特征在于，所述安装部开设有第一收容槽，所述散热组件包括至少部分地收容在所述第一收容槽的热管，所述热管连接所述第一鳍片和所述第二鳍片。The electronic device according to claim 24, wherein the mounting portion is provided with a first receiving groove, and the heat dissipation assembly includes a heat pipe at least partially received in the first receiving groove, the heat pipe is connected to the The first fin and the second fin.
26. 根据权利要求25所述的电子设备，其特征在于，所述第二鳍片的下端开设有与所述第一收容槽对应的第二收容槽，所述第一收容槽和所述第二收容槽共同形成收容通道，所述热管至少部分地收容在所述收容通道。The electronic device according to claim 25, wherein a lower end of the second fin is provided with a second receiving slot corresponding to the first receiving slot, the first receiving slot and the second receiving slot The grooves together form a receiving channel, and the heat pipe is at least partially received in the receiving channel.
27. 根据权利要求24所述的电子设备，其特征在于，所述第一鳍片的截面呈沿所述进风口至所述出风口方向上升的台阶状。The electronic device according to claim 24, wherein the cross section of the first fin has a stepped shape rising in the direction from the air inlet to the air outlet.
28. 根据权利要求1所述的电子设备，其特征在于，所述电子设备包括设置在所述壳体内的风扇组件，所述风扇组件位于所述散热组件和所述出风口之间，和/或位于所述散热组件和所述进风口之间。The electronic device according to claim 1, wherein the electronic device includes a fan assembly disposed in the housing, the fan assembly is located between the heat dissipation assembly and the air outlet, and/or Between the heat dissipation component and the air inlet.
29. 根据权利要求1所述的电子设备，其特征在于，所述壳体包括进风部件和出风部件，所述进风部件开设所述进风口，所述出风部件开设所述出风口，所述进风部件开设有连通所述进风口的进风通道，所述进风通道的侧壁形成有进风挡板，所述进风挡板被配置成将从所述进风口进入所述进风通道的气流向上转向至所述风道，和/或，所述出风部件开设有连通所述出风口的出风通道，所述出风通道的侧壁形成有出风挡板，所述出风挡板被配置成将进入所述出风通道的气流向下转向至所述出风口。The electronic device according to claim 1, wherein the housing includes an air inlet part and an air outlet part, the air inlet part opens the air inlet, and the air outlet part opens the air outlet, so The air inlet member is provided with an air inlet channel communicating with the air inlet, an air inlet baffle is formed on a side wall of the air inlet passage, and the air inlet baffle is configured to enter the air inlet from the air inlet The air flow of the air channel is turned upward to the air channel, and/or, the air outlet member is provided with an air outlet channel that communicates with the air outlet, and a side wall of the air outlet channel is formed with an air outlet baffle, The air outlet baffle is configured to turn the airflow entering the air outlet channel downward to the air outlet.
30. 根据权利要求29所述的电子设备，其特征在于，所述电子设备包括进风防尘罩，所述进风防尘罩设在所述进风口处。The electronic device according to claim 29, characterized in that the electronic device includes an air inlet dust cover, and the air inlet dust cover is provided at the air inlet.
31. 根据权利要求30所述的电子设备，其特征在于，所述进风防尘罩开设有网格状的进风通孔阵列。The electronic device according to claim 30, wherein the air inlet dust cover is provided with a grid-shaped air inlet through-hole array.
32. 根据权利要求29所述的电子设备，其特征在于，所述进风通道的数量是多个，所述多个进风通道沿竖直方向排列，所述进风通道包括通道出口，所述进风挡板与相邻的所述通道出口相对。The electronic device according to claim 29, wherein the number of the air inlet channels is a plurality, and the plurality of air inlet channels are arranged in a vertical direction, and the air inlet channels include a channel outlet, the inlet The wind baffle is opposite to the adjacent outlet of the channel.
33. 根据权利要求29所述的电子设备，其特征在于，所述电子设备包括出风防尘罩，所述出风防尘罩设在所述出风口处。The electronic device according to claim 29, characterized in that the electronic device includes an air outlet dust cover, and the air outlet dust cover is provided at the air outlet.
34. 根据权利要求33所述的电子设备，其特征在于，所述出风防尘罩开设有网格状的出风通孔阵列。The electronic device according to claim 33, wherein the air outlet dust cover is provided with a grid-like air outlet through hole array.
35. 根据权利要求29所述的电子设备，其特征在于，所述出风通道包括第一通道和第二通道，所述第二通道连通所述第一通道和所述出风口，所述第二通道的斜率大于所述第一通道的斜率。The electronic device according to claim 29, wherein the air outlet channel includes a first channel and a second channel, the second channel communicates with the first channel and the air outlet, and the second channel The slope of is greater than the slope of the first channel.
36. 根据权利要求1所述的电子设备，其特征在于，所述电子设备包括设置在所述壳体内的风扇组件，所述风扇组件位于所述散热组件和所述出风口之间，所述风扇组件包括风扇支架和风扇，所述风扇支架包括容置部和挡板部，所述容置部开设有容置腔，所述风扇收容在所述 容置腔，所述风道包括形成在所述挡板部且沿靠近所述出风口的方向呈渐缩形状的挡板风道，所述容置腔连通所述挡板风道和所述出风口。The electronic device according to claim 1, wherein the electronic device includes a fan assembly disposed in the housing, the fan assembly is located between the heat dissipation assembly and the air outlet, the fan assembly It includes a fan bracket and a fan. The fan bracket includes an accommodating portion and a baffle portion. The accommodating portion is provided with an accommodating cavity, the fan is accommodated in the accommodating cavity, and the air duct includes a The baffle part is a baffle air duct with a tapered shape in a direction close to the air outlet, and the accommodating cavity communicates with the baffle air duct and the air outlet.
37. 根据权利要求36所述的电子设备，其特征在于，所述风扇为轴流风扇，所述风扇吸入所述风道的空气，并通过所述出风口排出。The electronic device according to claim 36, wherein the fan is an axial fan, and the fan sucks air in the air duct and discharges it through the air outlet.
38. 根据权利要求36所述的电子设备，其特征在于，所述风扇支架为一体结构。The electronic device according to claim 36, wherein the fan bracket has an integrated structure.
39. 根据权利要求36所述的电子设备，其特征在于，所述电路板包括定位板，所述定位板至少部分地位于所述挡板风道内且与所述散热片导热地连接。The electronic device according to claim 36, wherein the circuit board includes a positioning plate at least partially located in the baffle duct and thermally connected to the heat sink.
40. 根据权利要求1所述的电子设备，其特征在于，所述电子设备包括无人机和机器人。The electronic device according to claim 1, wherein the electronic device includes a drone and a robot.

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