WO2020118626A1 - Flexible display panel and flexible display apparatus - Google Patents

Flexible display panel and flexible display apparatus Download PDF

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Publication number
WO2020118626A1
WO2020118626A1 PCT/CN2018/120913 CN2018120913W WO2020118626A1 WO 2020118626 A1 WO2020118626 A1 WO 2020118626A1 CN 2018120913 W CN2018120913 W CN 2018120913W WO 2020118626 A1 WO2020118626 A1 WO 2020118626A1
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WO
WIPO (PCT)
Prior art keywords
layer
flexible display
display panel
thin film
film encapsulation
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Application number
PCT/CN2018/120913
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French (fr)
Chinese (zh)
Inventor
陈羿恺
袁雄
赖瑞云
舒鹏
王超
Original Assignee
深圳市柔宇科技有限公司
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201880095922.1A priority Critical patent/CN112640150A/en
Priority to PCT/CN2018/120913 priority patent/WO2020118626A1/en
Publication of WO2020118626A1 publication Critical patent/WO2020118626A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details

Definitions

  • Embodiments of the present application relate to the field of display technology, and in particular, to a flexible display panel and a flexible display device.
  • OLED display technology has the characteristics of active light emission, low voltage drive, high brightness, and full color. With many advantages, OLED display technology is widely used in mobile phones, computers, TVs and other fields.
  • a thin film encapsulation layer is generally required to be deposited on the OLED device.
  • the thin film encapsulation layer can block moisture or oxygen from entering the OLED device to protect the OLED device from damage, thereby increasing the service life of the OLED device.
  • the flexible display panel has a bending and folding property
  • the thin film encapsulation layer is easily cracked or peeled off due to stress, which causes moisture or oxygen to enter the OLED device and cause the OLED device to fail.
  • Embodiments of the present application provide a flexible display panel and a flexible display device, which can relatively increase the service life of the flexible display panel.
  • a flexible display panel including:
  • Thin film transistor substrate including the deposition surface
  • OLED devices are arranged in sequence on the deposition surface, and each of the OLED devices is located between each adjacent two pixel defining layers;
  • a plurality of thin-film encapsulation layers each of which is encapsulated on a corresponding one of the OLED devices;
  • a buffer layer is laminated on the side of the thin film encapsulation layer.
  • An embodiment of the present application provides a flexible display device, including:
  • the flexible display panel can be accommodated in the housing.
  • the buffer layer is stacked on the side of the film encapsulation layer, and when folded, the buffer layer can prevent the two adjacent film encapsulation layers from directly squeezing and colliding with each other , Buffering the collision of the two thin-film encapsulation layers, reducing the probability of the side rupture of the thin-film encapsulation layer, thereby reducing the occurrence of the phenomenon of the side rupture of the thin-film encapsulation layer causing water and oxygen to enter the OLED device, thereby relatively improving the flexible display The service life of the panel.
  • FIG. 1a is a schematic structural diagram of a flexible display panel provided by an embodiment of the present application.
  • FIG. 1b is a schematic diagram of the buffer layer provided on the second side of the thin film encapsulation layer provided by the embodiment of the present application;
  • FIG. 1c is a schematic diagram of a buffer layer provided between each adjacent two thin-film encapsulation layers according to an embodiment of the present application;
  • 1d is a schematic diagram of a buffer layer stacked on a thin film encapsulation layer provided by another embodiment of the present application;
  • FIG. 2 is a schematic structural diagram of a flexible display panel provided by another embodiment of the present application.
  • 3a to 3d are schematic structural diagrams of OLED devices provided by various embodiments of the present application.
  • FIGS. 4a to 4d are schematic structural diagrams of a thin film encapsulation layer provided in various embodiments of the present application on a flexible display panel;
  • FIG. 5 is a schematic structural diagram of a flexible display device provided by an embodiment of the present application.
  • sputtering For example, sputtering, electroplating, molding, chemical vapor deposition (Chemical Vapor Deposition, CVD), physical vapor deposition (Physical Vapor Deposition, PVD), evaporation, hybrid physical-chemical vapor deposition (Hybrid Physical-Chemical Vapor Deposition, HPCVD) , Plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition (PECVD), low pressure chemical vapor deposition (Low Pressure Chemical Vapor Deposition, LPCVD), etc.
  • CVD chemical vapor deposition
  • PVD Physical vapor deposition
  • HPCVD Hybrid Physical-Chemical Vapor Deposition
  • PECVD Plasma enhanced chemical vapor deposition
  • Low Pressure Chemical Vapor Deposition Low Pressure Chemical Vapor Deposition
  • LPCVD Low Pressure Chemical Vapor Deposition
  • the flexible display panel 10 provided by the embodiment of the present application includes: a thin film transistor substrate 11, a plurality of pixel defining layers 12, a plurality of OLED devices 13, a plurality of thin film encapsulation layers 14, and a buffer layer 15.
  • the thin film transistor substrate 11 includes a deposition surface 110, each pixel defining layer 12 is sequentially arranged on the deposition surface 110 of the thin film transistor substrate 11, each OLED device 13 is sequentially arranged on the deposition surface 110 of the thin film transistor substrate 11, and, each The OLED devices 13 are located between every two adjacent pixel defining layers 12.
  • Each thin film encapsulation layer 14 is encapsulated on a corresponding one OLED device 13.
  • the buffer layer 15 is stacked on the side of the thin film encapsulation layer 14.
  • the buffer layer 15 can prevent two adjacent thin film encapsulation layers 14 from directly squeezing and colliding with each other, buffering the collision of the two thin film encapsulation layers, reducing the The probability that the thin film encapsulation layer 14 is broken on the side, thereby reducing the occurrence probability of the phenomenon that the thin film encapsulation layer 14 is broken on the side and causing water and oxygen to enter the OLED device, thereby relatively increasing the service life of the flexible display panel.
  • the buffer layer 15 can protect the thin film encapsulation layer 14 from being pressed by excessive compressive stress, the user can relatively fold the flexible display panel 10 at a larger folding angle, Therefore, the buffer layer 15 can improve the lateral ductility of the flexible display panel 10.
  • the side of the thin film encapsulation layer 14 includes opposite first side 141 and second side 142.
  • the position of the buffer layer 15 is not limited herein.
  • the buffer layer 15 is stacked on the first side 141 of the film encapsulation layer 14.
  • the buffer layer 15 can prevent the film encapsulation layer 14 from squeezing and colliding with the adjacent left film encapsulation layer, reducing the film encapsulation layer 14 The probability of a side rupture.
  • the buffer layer 15 is stacked on the second side 142 of the film encapsulation layer 14, and when folded, the buffer layer 15 can prevent the film encapsulation layer 14 and the adjacent right film encapsulation layer from being pressed against each other The collision reduces the probability that the thin film encapsulation layer 14 will crack on the side.
  • the number of buffer layers 15 is not limited herein.
  • the number of buffer layers 15 is selected to be a preset number, where the preset number is smaller than the number of OLED devices.
  • each buffer layer 15 is stacked between every two adjacent thin-film encapsulation layers 14.
  • the buffer layer 15 is stacked between the first thin-film encapsulation layer 143 and the second thin-film encapsulation layer 144.
  • the buffer layer 15 can buffer the squeeze collision between the first film encapsulation layer 143 and the second film encapsulation layer 144, which reduces the first film encapsulation layer 143 or the second film The probability that the encapsulation layer 144 will crack on the side.
  • each buffer layer 15 when each buffer layer 15 is stacked between each adjacent two thin-film encapsulation layers 14, the buffer layer 15 can buffer when folded in the first direction X1 or the second direction X2
  • the squeeze collision between two adjacent thin film encapsulation layers 143 can reduce the probability that each thin film encapsulation layer will undergo side cracks when subjected to a squeeze collision in the first direction X1 or the second direction X2.
  • the buffer layer 15 may be formed on the side of the thin film encapsulation layer 14 by inkjet printing, spin coating, or spray coating.
  • the buffer layers 15 all include an organic film layer, wherein the organic film layer may be selected from hexamethyl disiloxane (HMDSO), Acrylic (PMMA), and the like.
  • the organic film layer is selected as the buffer layer 15. On the one hand, it can increase the lateral tension of the thin film encapsulation layer, reduce the influence of the stress concentrated on the side of the thin film encapsulation layer, and prevent the thin film encapsulation layer from cracking. On the other hand, it can also block moisture or oxygen from entering the OLED device 13.
  • the thin film transistor substrate 11 is used to drive each OLED device 13 to emit light.
  • the thin film transistor substrate 11 includes a substrate and a thin film transistor formed on the substrate.
  • the thin film transistor may be formed on the substrate using any suitable process.
  • the substrate may use a flexible substrate such as a thin glass, a metal foil or a plastic base, etc. having a flexible material
  • the plastic substrate has a flexible structure including coating on both sides of a base film
  • the base film includes a material such as Polyimide (PI), polycarbonate (PC), polyethylene glycol terephthalate (PET), polyethersulfone (PES), polyethylene film (PEN), fiber reinforced plastic (FRP) and other resins .
  • PI Polyimide
  • PC polycarbonate
  • PET polyethylene glycol terephthalate
  • PES polyethersulfone
  • PEN polyethylene film
  • FRP fiber reinforced plastic
  • the thin film transistor substrate 11 can adopt a passive driving method (Passive Matrix, PMOLED) and an active driving method (Active Matrix, AMOLED).
  • a thin film transistor Thin-film Transistor, TFT
  • TFT thin film transistor
  • a static drive or a dynamic drive can be realized by scanning.
  • low-temperature polysilicon thin-film transistors Low-Temperature Poly-Si Thin Film Transistor (LTP-Si) TFT
  • amorphous silicon TFT polysilicon TFT
  • oxide semiconductor TFT or organic TFT etc.
  • the thin film transistor may be a transparent transistor.
  • the transparent transistor is a TFT transistor manufactured by using a transparent substance such as zinc oxide or titanium dioxide to replace the related art TFT transistor made of opaque silicon.
  • the transparent electrode may be composed of a material such as indium tin oxide (ITO) or graphene.
  • ITO indium tin oxide
  • graphene has a honeycomb lattice structure composed of carbon atoms, and has transparency.
  • the transparent organic light-emitting layer can be realized with various substances.
  • the pixel defining layer 12 defines the position of each OLED device 13, wherein the shape of each pixel defining layer 12 may be any suitable shape, such as trapezoid, inverted trapezoid, rectangle, square, and so on.
  • the pixel defining layer 12 includes a third inorganic layer 121 and a fourth inorganic layer 122.
  • the third inorganic layer 121 covers one of the two OLED devices adjacent to the pixel defining layer 12
  • the side 12a covers the fourth inorganic layer 122 covers the side surface 12b of the other one of the two OLED devices adjacent to the pixel defining layer 12.
  • Both the third inorganic layer 121 and the fourth inorganic layer 122 are used to block moisture or oxygen from entering from the side of the OLED device to avoid damaging the OLED device, thereby further improving the service life of the OLED device.
  • both the third inorganic layer 121 and the fourth inorganic layer 122 contain inorganic substances, optionally, the third inorganic layer 121 may include a silicon nitride layer, or the fourth inorganic layer 122 may include silicon nitride Layer, or both the third inorganic layer 121 and the fourth inorganic layer 122 may include a silicon nitride layer.
  • the density of the silicon nitride layer is better, and the efficiency of blocking water and oxygen is better.
  • the pixel defining layer 12 further includes a material filling layer 123 which is filled between the third inorganic layer 121 and the fourth inorganic layer 122.
  • the material filling layer 123 can assist the buffer layer 15 to improve the buffering force, further reduce the compressive stress directly received by the thin film encapsulation layer 14, thereby better protecting the thin film encapsulation layer 14, and further reducing the side edges of the thin film encapsulation layer 14 The probability of rupture.
  • the material filling layer 123 includes an organic film layer, an inorganic film layer, or a mixture of organic film layers and inorganic film layers alternately stacked.
  • the material-filled layer 123 When the material-filled layer 123 is an organic film layer and is folded, the material-filled layer 123 can assist the buffer layer 15 to improve the buffering force and reduce the compression stress directly received by the thin-film encapsulation layer 14, thereby better protecting the thin-film encapsulation layer 14, This further reduces the probability that the thin film encapsulation layer 14 will crack on the side.
  • the material-filled layer 123 When the material-filled layer 123 is an inorganic film layer, on the one hand, the material-filled layer 123 can prevent moisture or oxygen from entering the OLED device 13, thereby protecting the OLED device 13, on the other hand, when folded, the material-filled layer 123 can assist the buffer layer 15 Increase the buffering force and reduce the compressive stress directly received by the thin-film encapsulation layer 14.
  • the material filling layer 123 integrates the effects brought separately as the inorganic film layers and the organic film layers.
  • the third inorganic layer 121 includes: a first hook portion 1211 and a first extension portion 1212.
  • the first hooking portion 1211 covers a part of the top portion 12c of the material filling layer 123.
  • the first extension 1212 is in contact with the first hook 1211.
  • the first extension 1212 covers the side surface 12 a of one of the two OLED devices adjacent to the pixel defining layer 12.
  • the first hooking portion 1211 can be firmly laminated on a partial region of the top portion 12c of the material-filled layer 123, and the first extension portion 1212 is also firmly laminated on the side surface 12a of the OLED device through the association effect of the first hooking portion 1211 .
  • the third inorganic layer 121 of this structure on the one hand, the third inorganic layer 121 completely surrounds the side of the OLED device, thereby blocking moisture or oxygen from entering the OLED device in all directions.
  • the third inorganic layer 121 can be in stable and reliable contact with the OLED device by the function of the first hook 1211.
  • the fourth inorganic layer 122 includes: a second hook portion 1221 and a second extension portion 1222.
  • the second lifting portion 1221 covers another partial area of the top portion 12c of the material filling layer 123, and the second lifting portion 1221 is opposite to the first lifting portion 1211.
  • the second extension portion 1222 is in contact with the second hook portion 1221, and the second extension portion 1222 covers the side surface 12 b of the other OLED device of the two OLED devices adjacent to the pixel defining layer 12.
  • the second hooking portion 1221 can be firmly stacked on another part of the top portion 12c of the material-filled layer 123, and the second extension portion 1222 can also be firmly stacked on the side of the OLED device through the association effect of the second hooking portion 1221 12a.
  • the fourth inorganic layer 122 of this structure on the one hand, the fourth inorganic layer 122 completely surrounds the side of the OLED device, thereby blocking moisture or oxygen from entering the OLED device in all directions.
  • the fourth inorganic layer 122 can be in stable and reliable contact with the OLED device.
  • the side of the buffer layer 15 near the thin film transistor substrate 11 fills the gap between the first hooking portion 1211 and the second hooking portion 1221 and abuts on top of the material filling layer 123. Therefore, the buffer layer 15 can not only buffer the compressive stress between two adjacent thin-film encapsulation layers, but also buffer the compressive stress between the two adjacent pixel defining layers 12.
  • the buffer layer 15, the first hooking portion 1211 and the second hooking portion 1221 cover the top of the material filling layer 123 together. Therefore, the buffer layer 15 can fully close one side of the thin film encapsulation layer 11 and be fully protected Thin film encapsulation layer 11.
  • the OLED device 13 is used to emit light under the action of an external voltage.
  • the OLED device 13 can be prepared by any suitable process.
  • the OLED device 13 includes an anode 131, a cathode 132, and an organic functional layer 133.
  • the anode 131 is stacked on the deposition surface 110 of the thin film transistor substrate 11, and the anode 131 is located between every two adjacent pixel defining layers 12, and the organic functional layer 133 is stacked on the anode 131 and located between every two adjacent pixel definitions Between the layers 12, the cathode 132 is stacked on the organic functional layer 133 and away from the anode 131, and the thin film encapsulation layer 14 is encapsulated on the cathode 132.
  • an external voltage is applied between the anode 131 and the cathode 132, and the anode 131 releases holes under the action of the external voltage.
  • the cathode releases electrons under the action of an external voltage.
  • the holes migrate to the organic functional layer 133.
  • the electrons migrate to the organic functional layer 133.
  • the electrons and holes meet and recombine in the organic functional layer 133, they form excitons in an excited state.
  • Energy is transferred to the luminescent molecules, and the electrons that excite the luminescent molecules transition from the ground state to the excited state.
  • the electrons of the luminescent molecules will release energy mainly in the form of light and return to a stable ground state, thereby generating electroluminescence.
  • the anode 131 may be a transmissive electrode or a transflective electrode.
  • the cathode 132 may be a transmissive electrode or a transflective electrode, or may be a transmissive electrode with a multilayer structure.
  • one of the anode 131 and the cathode 132 must be a transparent electrode, and the other can be a transparent electrode or an opaque electrode.
  • the anode uses a transparent electrode of indium tin oxide
  • the cathode 132 uses a material such as magnesium, magnesium-silver alloy, calcium, or lithium aluminum alloy.
  • the organic functional layer 133 is prepared by doping the host material with a certain proportion of organic light-emitting materials.
  • the luminescent material has high quantum efficiency and sufficient thermal stability, sublimates without decomposition. When electrons and holes meet in the organic functional layer 133, the electrons are continuously filled from the high orbit to the low orbit hole, thereby releasing energy.
  • the organic light-emitting material can be a small molecule-based OLED that uses organic dyes or pigments as the light-emitting material, or a polymer-based OLED that uses conjugated polymers as the light-emitting material.
  • the small molecule-based OLED can use a vacuum thermal evaporation process.
  • the base OLED can use spin coating or inkjet process. According to the type of luminous excitons, the organic light-emitting material can be selected from fluorescent materials or phosphorescent materials.
  • the organic functional layer 133 includes a hole injection layer 1331, a hole transport layer 1332, an organic light emitting layer 1333, an electron transport layer 1334, and an electron injection layer 1335 that are prepared in sequence.
  • the hole injection layer 1331 can effectively inject holes into the hole transport layer 1332 and be injected into the organic light emitting layer 1333 through the hole transport layer 1332, so that holes meet electrons in the organic light emitting layer 1333.
  • the hole transport layer 1332 may include, for example, carbazole-based derivatives such as n-phenylcarbazole, polyvinylcarbazole, and fluorine-based derivatives.
  • the organic light emitting layer 1333 may include an organic light emitting material.
  • the organic light-emitting material may include a material that emits red light, green light, or blue light, and a fluorescent material or a phosphorescent material.
  • the organic light-emitting layer 1333 may include two or more light-emitting materials.
  • the organic light emitting layer 1333 may include a host and a dopant.
  • a host for example, Alq 3 (tris(8-hydroxyquinoline) aluminum) or the like can be used.
  • the electron transport layer 1334 includes, for example, Alq 3 (tris(8-hydroxyquinoline) aluminum), TPBi(1,3,5-tris(1-phenyl-1H-benzo[d]imidazole- 2-yl)phenyl) and so on.
  • the electron injection layer 1335 is made of an organic metal complex or an inorganic substance. In some embodiments, the electron injection layer 1335 is made of an alkali metal compound. For example, the electron injection layer 1335 is made of LiF, LiQ, One of NaF, CsF, Cs 2 CO 3 or other suitable materials.
  • the electron injection layer 1335 can effectively inject electrons into the electron transport layer 1334 and be injected into the organic light emitting layer 1333 through the electron transport layer 1334, so that electrons meet holes in the organic light emitting layer 1333.
  • the increase of the electron injection layer 1335 can improve the efficiency of electron injection into the organic light-emitting layer 1333, and on the other hand, it can also reduce the operating voltage.
  • the organic light-emitting layer 1333 includes: an organic light-emitting body layer 13331 and an organic light-emitting electron blocking layer 13332, the organic light-emitting body layer 13331 is stacked between the electron transport layer 1334 and the hole transport layer 1332, The organic light-emitting electron blocking layer 13332 is stacked between the organic light-emitting host layer 13331 and the hole transport layer 1332.
  • the organic light-emitting host layer 13331 may be configured with light-emitting materials of corresponding colors to generate light of corresponding colors.
  • the organic light emitting host layer 13331 includes multiple color light emitting host layers, the color light emitting host layer includes a red light emitting host layer 3d1, a green light emitting host layer 3d2, or a blue light emitting host Layer 3d3.
  • the color electron blocking layer includes a red light electron blocking layer 3d4, a green light electron blocking layer 3d5, or a blue light electron blocking layer 3d6.
  • the red light electron blocking layer 3d4 is opposite to the red light emitting body layer 3d1
  • the green light electron blocking layer 3d5 is opposite to the green light emitting body layer 3d2
  • the blue light electron blocking layer 3d6 is opposite to the blue light emitting body layer 3d3.
  • the red light emitting body layer 3d1 When an external voltage is applied to the organic light emitting diode device, the red light emitting body layer 3d1 emits red light, and the red light electron blocking layer 3d4 blocks the red light electrons from moving to the hole transport layer 133.
  • the green light emitting body layer 3d2 emits green light, and the green light electron blocking layer 3d5 blocks the movement of green light electrons to the hole transport layer 1332.
  • the blue light-emitting host layer 3d3 emits blue light, and the blue electron blocking layer 3d6 blocks blue electrons from moving to the hole transport layer 133.
  • the thin film encapsulation layer 14 includes a first inorganic layer 141, and the first inorganic layer 141 is stacked on each OLED device 13.
  • the first inorganic layer 141 is stacked on the cathode 132. Since the first inorganic layer 141 can block moisture or oxygen, and the moisture or oxygen can oxidize the cathode and damage the cathode, the first inorganic layer 141 can protect the cathode, thereby The service life of the OLED device 13 is increased.
  • the thickness of the first inorganic layer 141 is less than the thickness of the buffer layer 15, that is, the height of the buffer layer 15 stacked on the side of the first inorganic layer 141 is greater than the height of the first inorganic layer 141 stacked on the OLED device, Therefore, when folded, the buffer layer 15 can buffer the compression stress on all sides of the first inorganic layer 141 to better protect the first inorganic layer 141 from being directly compressed by the inorganic layer in another adjacent thin-film encapsulation layer .
  • the thin film encapsulation layer 14 further includes a first organic layer 142 that is stacked on the first inorganic layer 141 and away from the OLED device 13.
  • the first organic layer 142 can coat the particles and planarize the first inorganic layer 141, making it easier to stack various structural layers later.
  • the total thickness of both the first organic layer 142 and the first inorganic layer 141 is less than the thickness of the buffer layer 15, that is, the buffer layer 15 is stacked on both the first inorganic layer 141 and the first organic layer 142
  • the height of the side is greater than the total height of the first inorganic layer 141 and the first organic layer 142 stacked on the OLED device, therefore, when folded, the buffer layer 15 can buffer both the first inorganic layer 141 and the first organic layer 142
  • the compressive stresses on all the sides can better protect the first inorganic layer 141 and the first organic layer 142 from being directly compressed by another adjacent thin-film encapsulation layer.
  • the thin film encapsulation layer 14 further includes a second inorganic layer 143, which is stacked on the first organic layer 142 and away from the first inorganic layer 141.
  • the second inorganic layer 143 can block moisture or oxygen.
  • the total thickness of the first organic layer 142, the first inorganic layer 141, and the second inorganic layer 143 is less than the thickness of the buffer layer 15, that is, the buffer layer 15 is stacked on the first inorganic layer 141, the first The height of the side surfaces of the organic layer 142 and the second inorganic layer 143 is greater than the total height of the first inorganic layer 141, the first organic layer 142, and the second inorganic layer 143 stacked on the OLED device.
  • the buffer The layer 15 can buffer the compressive stress on all sides of the first inorganic layer 141, the first organic layer 142, and the second inorganic layer 143 to better protect the first inorganic layer 141, the first organic layer 142, and the first The two inorganic layers 143 avoid being directly pressed by another adjacent thin-film encapsulation layer.
  • the thin film encapsulation layer 14 further includes a second organic layer 144.
  • the second organic layer 144 is stacked on the second inorganic layer 143 and away from the first organic layer 142.
  • the second organic layer 144 may be Used as a mask pattern.
  • the height of the buffer layer 15 stacked on the sides of the first inorganic layer 141, the first organic layer 142, the second inorganic layer 143, and the second organic layer 144 may be greater than or less than or equal to the first inorganic layer 141 , The total height of the first organic layer 142, the second inorganic layer 143, and the second organic layer 144 stacked on the OLED device.
  • the inorganic layer referred to herein may be selected from metal oxides such as Al 2 O 3, and may also be selected from silicon nitrogen compounds, silicon oxide compounds, and the like.
  • the flexible display device 50 includes a housing 51 and a flexible display panel 52.
  • the flexible display panel 52 can be accommodated in the housing 51.
  • the flexible display panel 52 can be retracted in the housing 51.
  • the flexible display panel 52 is used to pull the flexible display panel 52 out of the housing 51.
  • the flexible display panel 52 may select the flexible display panel illustrated in FIGS. 1a to 4d.
  • the buffer layer can prevent the two adjacent film encapsulation layers from directly squeezing and colliding with each other, and buffer the collision of the two film encapsulation layers This reduces the probability that the thin film encapsulation layer will crack on the side, thereby reducing the probability that the thin film encapsulation layer will crack on the side to allow water and oxygen to enter the OLED device, thereby relatively increasing the service life of the flexible display panel 52.

Abstract

Disclosed are a flexible display panel and a flexible display apparatus. The flexible display panel (10) comprises: a thin film transistor substrate (11), pixel defining layers (12), OLED devices (13), thin film encapsulation layers (14) and buffer layers (15), wherein the thin film encapsulation layers (14) comprise lateral faces; and the buffer layers (15) are stacked on the lateral faces of the thin film encapsulation layers (14). During folding, the buffer layers (15) can prevent two adjacent thin film encapsulation layers (14) from directly extruding and colliding with each other to buffer the collision between the two thin film encapsulation layers (14), thereby reducing the probability of side rupture of the thin film encapsulation layers (14), and further reducing the probability of a phenomenon where water and oxygen enter the OLED devices due to the side rupture of the thin film encapsulation layers (14). Thus, the service life of the flexible display panel is relatively prolonged.

Description

柔性显示面板及柔性显示装置Flexible display panel and flexible display device 技术领域Technical field
本申请实施例涉及显示技术领域，尤其涉及一种柔性显示面板及柔性显示装置。Embodiments of the present application relate to the field of display technology, and in particular, to a flexible display panel and a flexible display device.
背景技术Background technique
有机发光二极管(Organic Light-Emitting Diode，OLED)显示技术具有主动发光、低电压驱动、高亮度、全色彩等特点，凭借着诸多优点，OLED显示技术广泛应用于手机、电脑、电视等领域。Organic Light-Emitting Diode (OLED) display technology has the characteristics of active light emission, low voltage drive, high brightness, and full color. With many advantages, OLED display technology is widely used in mobile phones, computers, TVs and other fields.
制作柔性显示面板时，一般需要在OLED器件上沉积薄膜封装层，薄膜封装层能够阻挡水分或者隔离氧气进入OLED器件，以保护OLED器件免受破坏，从而提高OLED器件的使用寿命。When manufacturing a flexible display panel, a thin film encapsulation layer is generally required to be deposited on the OLED device. The thin film encapsulation layer can block moisture or oxygen from entering the OLED device to protect the OLED device from damage, thereby increasing the service life of the OLED device.
然而，由于柔性显示面板具有弯曲折叠性质，折叠柔性显示面板时，薄膜封装层受到应力影响而容易破裂或脱落，导致水分或氧气进入OLED器件而使OLED器件失效。However, because the flexible display panel has a bending and folding property, when the flexible display panel is folded, the thin film encapsulation layer is easily cracked or peeled off due to stress, which causes moisture or oxygen to enter the OLED device and cause the OLED device to fail.
发明内容Summary of the invention
本申请实施例提供一种柔性显示面板及柔性显示装置，其能够相对地提高柔性显示面板的使用寿命。Embodiments of the present application provide a flexible display panel and a flexible display device, which can relatively increase the service life of the flexible display panel.
本申请实施例解决其技术问题提供以下技术方案：The embodiments of the present application solve the technical problems and provide the following technical solutions:
一种柔性显示面板，包括：A flexible display panel, including:
薄膜晶体管基板，包括沉积面；Thin film transistor substrate, including the deposition surface;
若干像素界定层，依次排列于所述沉积面上；Several pixel defining layers are arranged in sequence on the deposition surface;
若干OLED器件，依次排列于所述沉积面上，并且，每个所述OLED器件皆位于每相邻两个所述像素界定层之间；Several OLED devices are arranged in sequence on the deposition surface, and each of the OLED devices is located between each adjacent two pixel defining layers;
若干薄膜封装层，每个所述薄膜封装层封装于对应的一个所述OLED器件上；以及A plurality of thin-film encapsulation layers, each of which is encapsulated on a corresponding one of the OLED devices; and
缓冲层，层叠于所述薄膜封装层的侧面。A buffer layer is laminated on the side of the thin film encapsulation layer.
本申请实施例解决其技术问题提供以下技术方案：The embodiments of the present application solve the technical problems and provide the following technical solutions:
本申请实施例提供一种柔性显示装置，包括：An embodiment of the present application provides a flexible display device, including:
壳体；以及，Shell; and,
所述的柔性显示面板，所述柔性显示面板可收容于所述壳体内。In the flexible display panel, the flexible display panel can be accommodated in the housing.
与现有技术相比较，在本申请实施例提供的柔性显示面板中，缓冲层层叠于薄膜封装层的侧面，折叠时，缓冲层能够防止相邻的两个薄膜封装层直接互相挤压与碰撞，缓冲两个薄膜封装层的碰撞，降低了薄膜封装层出现侧边破裂的概率，进而降低薄膜封装层的侧边破裂而使水氧进入OLED器件的现象的出现概率，从而相对地提高柔性显示面板的使用寿命。Compared with the prior art, in the flexible display panel provided by the embodiments of the present application, the buffer layer is stacked on the side of the film encapsulation layer, and when folded, the buffer layer can prevent the two adjacent film encapsulation layers from directly squeezing and colliding with each other , Buffering the collision of the two thin-film encapsulation layers, reducing the probability of the side rupture of the thin-film encapsulation layer, thereby reducing the occurrence of the phenomenon of the side rupture of the thin-film encapsulation layer causing water and oxygen to enter the OLED device, thereby relatively improving the flexible display The service life of the panel.
附图说明BRIEF DESCRIPTION
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例中所需要使用的附图作简单地介绍。显而易见地，下面所描述的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings required in the embodiments of the present application will be briefly described below. Obviously, the drawings described below are only some embodiments of the present application. For a person of ordinary skill in the art, without paying any creative work, other drawings can be obtained based on these drawings.
图1a是本申请实施例提供的一种柔性显示面板的结构示意图；FIG. 1a is a schematic structural diagram of a flexible display panel provided by an embodiment of the present application;
图1b是本申请实施例提供的缓冲层层叠于薄膜封装层的第二侧面的示意图；FIG. 1b is a schematic diagram of the buffer layer provided on the second side of the thin film encapsulation layer provided by the embodiment of the present application;
图1c是本申请实施例提供的缓冲层于每相邻两个薄膜封装层之间的示意图；FIG. 1c is a schematic diagram of a buffer layer provided between each adjacent two thin-film encapsulation layers according to an embodiment of the present application;
图1d是本申请另一实施例提供的缓冲层层叠于薄膜封装层的示意图；1d is a schematic diagram of a buffer layer stacked on a thin film encapsulation layer provided by another embodiment of the present application;
图2是本申请另一实施例提供的一种柔性显示面板的结构示意图；2 is a schematic structural diagram of a flexible display panel provided by another embodiment of the present application;
图3a至图3d是本申请各个实施例提供的OLED器件的结构示意图；3a to 3d are schematic structural diagrams of OLED devices provided by various embodiments of the present application;
图4a至图4d是本申请各个实施例提供的薄膜封装层在柔性显示面板的结构示意图；4a to 4d are schematic structural diagrams of a thin film encapsulation layer provided in various embodiments of the present application on a flexible display panel;
图5是本申请实施例提供的一种柔性显示装置的结构示意图。5 is a schematic structural diagram of a flexible display device provided by an embodiment of the present application.
具体实施方式detailed description
为了便于理解本申请，下面结合附图和具体实施例，对本申请进行 更详细的说明。需要说明的是，当元件被表述“固定于”另一个元件，它可以直接在另一个元件上、或者其间可以存在一个或多个居中的元件。当一个元件被表述“连接”另一个元件，它可以是直接连接到另一个元件、或者其间可以存在一个或多个居中的元件。本说明书所使用的术语“垂直的”、“水平的”、“左”、“右”、“内”、“外”以及类似的表述只是为了说明的目的，并且仅表达实质上的位置关系，例如对于“垂直的”，如果某位置关系因为了实现某目的的缘故并非严格垂直，但实质上是垂直的，或者利用了垂直的特性，则属于本说明书所述“垂直的”范畴。In order to facilitate understanding of this application, the following describes the application in more detail with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed" to another element, it may be directly on the other element, or there may be one or more centered elements in between. When an element is expressed as "connecting" another element, it may be directly connected to the other element, or one or more centered elements may be present therebetween. The terms "vertical", "horizontal", "left", "right", "inner", "outer", and similar expressions used in this specification are for illustrative purposes only, and only express the substantial positional relationship, For example, for "vertical", if a certain positional relationship is not strictly vertical because it achieves a certain purpose, but is substantially vertical, or utilizes the vertical characteristics, it belongs to the "vertical" category described in this specification.
除非另有定义，本说明书所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是用于限制本申请。本说明书所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field of the present application. The terminology used in the description of this application is only for the purpose of describing specific embodiments, and is not intended to limit this application. The term "and/or" as used in this specification includes any and all combinations of one or more related listed items.
可以理解地是，如本文所示的本申请实施例涉及的一个或多个层间物质，层与层之间的位置关系使用了诸如术语“层叠”或“形成”或“施加”或“设置”进行表达，本领域技术人员可以理解的是：任何术语诸如“层叠”或“形成”或“施加”，其可覆盖“层叠”的全部方式、种类及技术。例如，溅射、电镀、模塑、化学气相沉积(Chemical Vapor Deposition，CVD)、物理气相沉积(Physical Vapor Deposition，PVD)、蒸发、混合物理-化学气相沉积(Hybrid Physical-Chemical Vapor Deposition，HPCVD)、等离子体增强化学气相沉积(Plasma Enhanced Chemical Vapor Deposition，PECVD)、低压化学气相沉积(Low Pressure Chemical Vapor Deposition，LPCVD)等。It is understandable that, as shown in this document, one or more interlayer substances involved in the embodiments of the present application, the positional relationship between layers uses such terms as “lamination” or “formation” or “application” or “arrangement” To express ", those skilled in the art can understand that any term such as "lamination" or "formation" or "application" can cover all the methods, types and techniques of "lamination". For example, sputtering, electroplating, molding, chemical vapor deposition (Chemical Vapor Deposition, CVD), physical vapor deposition (Physical Vapor Deposition, PVD), evaporation, hybrid physical-chemical vapor deposition (Hybrid Physical-Chemical Vapor Deposition, HPCVD) , Plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition (PECVD), low pressure chemical vapor deposition (Low Pressure Chemical Vapor Deposition, LPCVD), etc.
此外，下面所描述的本申请不同实施例中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。In addition, the technical features involved in different embodiments of the present application described below can be combined as long as they do not conflict with each other.
请参阅图1a，本申请实施例提供的柔性显示面板10包括：薄膜晶体管基板11、若干像素界定层12、若干OLED器件13、若干薄膜封装层14及缓冲层15。Referring to FIG. 1a, the flexible display panel 10 provided by the embodiment of the present application includes: a thin film transistor substrate 11, a plurality of pixel defining layers 12, a plurality of OLED devices 13, a plurality of thin film encapsulation layers 14, and a buffer layer 15.
薄膜晶体管基板11包括沉积面110，每个像素界定层12依次排列 于薄膜晶体管基板11的沉积面110上，每个OLED器件13依次排列于薄膜晶体管基板11的沉积面110上，并且，每个OLED器件13皆位于每相邻两个像素界定层12之间，每个薄膜封装层14皆封装于对应的一个OLED器件13上，缓冲层15层叠于薄膜封装层14的侧面。The thin film transistor substrate 11 includes a deposition surface 110, each pixel defining layer 12 is sequentially arranged on the deposition surface 110 of the thin film transistor substrate 11, each OLED device 13 is sequentially arranged on the deposition surface 110 of the thin film transistor substrate 11, and, each The OLED devices 13 are located between every two adjacent pixel defining layers 12. Each thin film encapsulation layer 14 is encapsulated on a corresponding one OLED device 13. The buffer layer 15 is stacked on the side of the thin film encapsulation layer 14.
折叠时，薄膜封装层14跟随着柔性显示面板10弯曲而弯曲时，缓冲层15能够防止相邻的两个薄膜封装层14直接互相挤压与碰撞，缓冲两个薄膜封装层的碰撞，降低了薄膜封装层14出现侧边破裂的概率，进而降低薄膜封装层14的侧边破裂而使水氧进入OLED器件的现象的出现概率，从而相对地提高柔性显示面板的使用寿命。并且，相对于传统折叠柔性显示面板的折叠角度，由于缓冲层15能够保护好薄膜封装层14免受过大压应力的挤压，用户相对地可以以更大的折叠角度折叠柔性显示面板10，因此，缓冲层15能够提高柔性显示面板10的侧向延展性。When folded, when the thin film encapsulation layer 14 follows the flexible display panel 10 and bends, the buffer layer 15 can prevent two adjacent thin film encapsulation layers 14 from directly squeezing and colliding with each other, buffering the collision of the two thin film encapsulation layers, reducing the The probability that the thin film encapsulation layer 14 is broken on the side, thereby reducing the occurrence probability of the phenomenon that the thin film encapsulation layer 14 is broken on the side and causing water and oxygen to enter the OLED device, thereby relatively increasing the service life of the flexible display panel. Moreover, relative to the folding angle of the conventional folded flexible display panel, since the buffer layer 15 can protect the thin film encapsulation layer 14 from being pressed by excessive compressive stress, the user can relatively fold the flexible display panel 10 at a larger folding angle, Therefore, the buffer layer 15 can improve the lateral ductility of the flexible display panel 10.
请继续参阅图1a，薄膜封装层14的侧面包括相对的第一侧面141与第二侧面142，在一些实施例中，本文并不对缓冲层15的位置作出任何限定，举例而言，如图1a所示，缓冲层15层叠于薄膜封装层14的第一侧面141，折叠时，缓冲层15能够防止薄膜封装层14与相邻的左侧薄膜封装层互相挤压碰撞，降低了薄膜封装层14出现侧边破裂的概率。Please continue to refer to FIG. 1a. The side of the thin film encapsulation layer 14 includes opposite first side 141 and second side 142. In some embodiments, the position of the buffer layer 15 is not limited herein. For example, as shown in FIG. 1a As shown, the buffer layer 15 is stacked on the first side 141 of the film encapsulation layer 14. When folded, the buffer layer 15 can prevent the film encapsulation layer 14 from squeezing and colliding with the adjacent left film encapsulation layer, reducing the film encapsulation layer 14 The probability of a side rupture.
再举例而言，如图1b所示，缓冲层15层叠于薄膜封装层14的第二侧面142，折叠时，缓冲层15能够防止薄膜封装层14与相邻的右侧薄膜封装层互相挤压碰撞，降低了薄膜封装层14出现侧边破裂的概率。For another example, as shown in FIG. 1b, the buffer layer 15 is stacked on the second side 142 of the film encapsulation layer 14, and when folded, the buffer layer 15 can prevent the film encapsulation layer 14 and the adjacent right film encapsulation layer from being pressed against each other The collision reduces the probability that the thin film encapsulation layer 14 will crack on the side.
在一些实施例中，本文不对缓冲层15的数量作出任何限制，例如，缓冲层15的数量选择预设数量，其中，预设数量小于OLED器件的数量。再例如，缓冲层15的数量n＝m+1，其中，m为OLED器件的数量，采用该数量的缓冲层15，其能够全面保护好柔性显示面板10内封装在每个OLED器件上的薄膜封装层。In some embodiments, the number of buffer layers 15 is not limited herein. For example, the number of buffer layers 15 is selected to be a preset number, where the preset number is smaller than the number of OLED devices. For another example, the number of buffer layers 15 is n=m+1, where m is the number of OLED devices, and this number of buffer layers 15 can fully protect the thin film encapsulated on each OLED device in the flexible display panel 10 Encapsulation layer.
在一些实施例中，当缓冲层15的数量为多个时，每个缓冲层15层叠于每相邻两个薄膜封装层14之间。请参阅图1c，缓冲层15层叠于第一薄膜封装层143与第二薄膜封装层144之间。往第一方向X1或第二 方向X2折叠时，缓冲层15能够缓冲第一薄膜封装层143与第二薄膜封装层144之间的挤压碰撞，降低了第一薄膜封装层143或第二薄膜封装层144出现侧边破裂的概率。In some embodiments, when the number of the buffer layers 15 is multiple, each buffer layer 15 is stacked between every two adjacent thin-film encapsulation layers 14. Referring to FIG. 1c, the buffer layer 15 is stacked between the first thin-film encapsulation layer 143 and the second thin-film encapsulation layer 144. When folded in the first direction X1 or the second direction X2, the buffer layer 15 can buffer the squeeze collision between the first film encapsulation layer 143 and the second film encapsulation layer 144, which reduces the first film encapsulation layer 143 or the second film The probability that the encapsulation layer 144 will crack on the side.
在一些实施例中，请参阅图1d，当每个缓冲层15层叠于每相邻两个薄膜封装层14之间时，往第一方向X1或第二方向X2折叠时，缓冲层15能够缓冲相邻两个薄膜封装层143之间的挤压碰撞，能够降低了各个薄膜封装层在受到第一方向X1或第二方向X2挤压碰撞时出现侧边破裂的概率。In some embodiments, please refer to FIG. 1d, when each buffer layer 15 is stacked between each adjacent two thin-film encapsulation layers 14, the buffer layer 15 can buffer when folded in the first direction X1 or the second direction X2 The squeeze collision between two adjacent thin film encapsulation layers 143 can reduce the probability that each thin film encapsulation layer will undergo side cracks when subjected to a squeeze collision in the first direction X1 or the second direction X2.
在一些实施例中，缓冲层15可以通过喷墨打印方式、旋涂方式或者喷涂方式形成在薄膜封装层14的侧面。In some embodiments, the buffer layer 15 may be formed on the side of the thin film encapsulation layer 14 by inkjet printing, spin coating, or spray coating.
在一些实施例中，缓冲层15都包括有机膜层，其中，有机膜层可以选择六甲基二硅醚(hexamethyl disiloxane，HMDSO)、亚加力(Acrylic，PMMA)等等。选择有机膜层作为缓冲层15，一方面，其能够提高薄膜封装层的侧向张力，降低集中于薄膜封装层的侧面上的应力的影响，避免薄膜封装层破裂。另一方面，其还能够阻挡水分或氧气进入OLED器件13。In some embodiments, the buffer layers 15 all include an organic film layer, wherein the organic film layer may be selected from hexamethyl disiloxane (HMDSO), Acrylic (PMMA), and the like. The organic film layer is selected as the buffer layer 15. On the one hand, it can increase the lateral tension of the thin film encapsulation layer, reduce the influence of the stress concentrated on the side of the thin film encapsulation layer, and prevent the thin film encapsulation layer from cracking. On the other hand, it can also block moisture or oxygen from entering the OLED device 13.
薄膜晶体管基板11用于驱动各个OLED器件13发光，在一些实施例中，薄膜晶体管基板11包括衬底与形成在衬底上的薄膜晶体管，其中，薄膜晶体管可以采用任何适当工艺形成在衬底。The thin film transistor substrate 11 is used to drive each OLED device 13 to emit light. In some embodiments, the thin film transistor substrate 11 includes a substrate and a thin film transistor formed on the substrate. The thin film transistor may be formed on the substrate using any suitable process.
衬底可以使用柔性基板，柔性基板诸如包括薄玻璃、金属箔片或塑料基底等等具有柔性的材料，例如，塑料基底具有包括涂覆在基膜的两侧上的柔性结构，基膜包括诸如聚酰亚胺(PI)、聚碳酸酯(PC)、聚乙二醇对酞酸酯(PET)、聚醚砜(PES)、聚乙烯薄膜(PEN)、纤维增强塑料(FRP)等等树脂。The substrate may use a flexible substrate such as a thin glass, a metal foil or a plastic base, etc. having a flexible material, for example, the plastic substrate has a flexible structure including coating on both sides of a base film, the base film includes a material such as Polyimide (PI), polycarbonate (PC), polyethylene glycol terephthalate (PET), polyethersulfone (PES), polyethylene film (PEN), fiber reinforced plastic (FRP) and other resins .
薄膜晶体管基板11可以采用无源驱动方式(Passive Matrix，PMOLED)与有源驱动方式(Active Matrix，AMOLED)。当薄膜晶体管基板11采用PMOLED方式，可以选择薄膜晶体管(Thin-film transistor，TFT)作为开关管，通过扫描作用，实现静态驱动或动态驱动。当薄膜晶体管基板11采用AMOLED方式，可以选择低温多晶硅薄膜晶 体管(Low Temperature Poly-Si Thin Film Transistor，LTP-Si TFT)、非晶硅TFT、多晶硅TFT、氧化物半导体TFT或者有机TFT等等作为开关管。The thin film transistor substrate 11 can adopt a passive driving method (Passive Matrix, PMOLED) and an active driving method (Active Matrix, AMOLED). When the thin film transistor substrate 11 adopts the PMOLED method, a thin film transistor (Thin-film Transistor, TFT) can be selected as a switching tube, and a static drive or a dynamic drive can be realized by scanning. When the thin-film transistor substrate 11 adopts the AMOLED method, low-temperature polysilicon thin-film transistors (Low-Temperature Poly-Si Thin Film Transistor (LTP-Si) TFT), amorphous silicon TFT, polysilicon TFT, oxide semiconductor TFT or organic TFT, etc. can be selected as switches tube.
在一些实施例中，薄膜晶体管可以为透明晶体管，透明晶体管是通过利用诸如氧化锌或二氧化钛之类的透明物质制造成的TFT晶体管替换相关技术由不透明硅制造的TFT晶体管。此外，透明电极可以由诸如铟锡氧化物(Indium tin oxide，ITO)或者石墨烯的材料组成。石墨烯具有由碳原子构成的蜂巢晶格面结构，并且具有透明性。此外，透明有机发光层可以利用各种各样的物质实现。In some embodiments, the thin film transistor may be a transparent transistor. The transparent transistor is a TFT transistor manufactured by using a transparent substance such as zinc oxide or titanium dioxide to replace the related art TFT transistor made of opaque silicon. In addition, the transparent electrode may be composed of a material such as indium tin oxide (ITO) or graphene. Graphene has a honeycomb lattice structure composed of carbon atoms, and has transparency. In addition, the transparent organic light-emitting layer can be realized with various substances.
像素界定层12界定各个OLED器件13的位置，其中，每个像素界定层12的形状可以为任意合适形状，诸如梯形、倒梯形、矩形、正方形等等。The pixel defining layer 12 defines the position of each OLED device 13, wherein the shape of each pixel defining layer 12 may be any suitable shape, such as trapezoid, inverted trapezoid, rectangle, square, and so on.
在一些实施例中，请参阅图2，像素界定层12包括第三无机层121与第四无机层122，第三无机层121覆盖于与像素界定层12相邻两个OLED器件中一个OLED器件的侧面12a。第四无机层122覆盖于与像素界定层12相邻两个OLED器件中另一个OLED器件的侧面12b。In some embodiments, please refer to FIG. 2, the pixel defining layer 12 includes a third inorganic layer 121 and a fourth inorganic layer 122. The third inorganic layer 121 covers one of the two OLED devices adjacent to the pixel defining layer 12 The side 12a. The fourth inorganic layer 122 covers the side surface 12b of the other one of the two OLED devices adjacent to the pixel defining layer 12.
第三无机层121与第四无机层122都用于阻挡水分或氧气从OLED器件的侧面进入OLED器件，避免损坏OLED器件，从而进一步提高OLED的使用寿命。Both the third inorganic layer 121 and the fourth inorganic layer 122 are used to block moisture or oxygen from entering from the side of the OLED device to avoid damaging the OLED device, thereby further improving the service life of the OLED device.
在一些实施例中，第三无机层121与第四无机层122都包含无机物，可选地，第三无机层121可以包括氮化硅层，或者，第四无机层122可以包括氮化硅层，或者，第三无机层121与第四无机层122两者都可以包括氮化硅层。氮化硅层的致密性比较好，阻水氧的效率更佳。In some embodiments, both the third inorganic layer 121 and the fourth inorganic layer 122 contain inorganic substances, optionally, the third inorganic layer 121 may include a silicon nitride layer, or the fourth inorganic layer 122 may include silicon nitride Layer, or both the third inorganic layer 121 and the fourth inorganic layer 122 may include a silicon nitride layer. The density of the silicon nitride layer is better, and the efficiency of blocking water and oxygen is better.
在一些实施例中，请继续参阅图2，像素界定层12还包括材料填充层123，材料填充层123填充于第三无机层121与第四无机层122之间。In some embodiments, please continue to refer to FIG. 2, the pixel defining layer 12 further includes a material filling layer 123 which is filled between the third inorganic layer 121 and the fourth inorganic layer 122.
折叠时，材料填充层123能够辅助缓冲层15提高缓冲力，进一步减少薄膜封装层14直接受到的挤压应力，从而更好地保护好薄膜封装层14，进一步降低了薄膜封装层14出现侧边破裂的概率。When folded, the material filling layer 123 can assist the buffer layer 15 to improve the buffering force, further reduce the compressive stress directly received by the thin film encapsulation layer 14, thereby better protecting the thin film encapsulation layer 14, and further reducing the side edges of the thin film encapsulation layer 14 The probability of rupture.
在一些实施例中，材料填充层123包括有机膜层、无机膜层或者有 机膜层与无机膜层交替层叠后的混合物。In some embodiments, the material filling layer 123 includes an organic film layer, an inorganic film layer, or a mixture of organic film layers and inorganic film layers alternately stacked.
当材料填充层123为有机膜层，并且折叠时，材料填充层123能够辅助缓冲层15提高缓冲力，减少薄膜封装层14直接受到的挤压应力，从而更好地保护好薄膜封装层14，进一步降低了薄膜封装层14出现侧边破裂的概率。When the material-filled layer 123 is an organic film layer and is folded, the material-filled layer 123 can assist the buffer layer 15 to improve the buffering force and reduce the compression stress directly received by the thin-film encapsulation layer 14, thereby better protecting the thin-film encapsulation layer 14, This further reduces the probability that the thin film encapsulation layer 14 will crack on the side.
当材料填充层123为无机膜层，一方面，材料填充层123能够避免水分或氧气进入OLED器件13，从而保护好OLED器件13，另一方面，折叠时，材料填充层123能够辅助缓冲层15提高提高缓冲力，减少薄膜封装层14直接受到的挤压应力。When the material-filled layer 123 is an inorganic film layer, on the one hand, the material-filled layer 123 can prevent moisture or oxygen from entering the OLED device 13, thereby protecting the OLED device 13, on the other hand, when folded, the material-filled layer 123 can assist the buffer layer 15 Increase the buffering force and reduce the compressive stress directly received by the thin-film encapsulation layer 14.
当像素界定层12为有机膜层与无机膜层交替层叠后的混合物，材料填充层123集成了单独作为无机膜层与有机膜层各自带来的效果。When the pixel defining layer 12 is a mixture in which organic film layers and inorganic film layers are alternately stacked, the material filling layer 123 integrates the effects brought separately as the inorganic film layers and the organic film layers.
在一些实施例中，请继续参阅图2，第三无机层121包括：第一勾起部1211与第一延伸部1212。In some embodiments, please continue to refer to FIG. 2, the third inorganic layer 121 includes: a first hook portion 1211 and a first extension portion 1212.
第一勾起部1211覆盖于材料填充层123顶部12c的部分区域。The first hooking portion 1211 covers a part of the top portion 12c of the material filling layer 123.
第一延伸部1212与第一勾起部1211相接，第一延伸部1212覆盖于与像素界定层12相邻两个OLED器件中一个OLED器件的侧面12a。The first extension 1212 is in contact with the first hook 1211. The first extension 1212 covers the side surface 12 a of one of the two OLED devices adjacent to the pixel defining layer 12.
第一勾起部1211能够紧固地层叠在材料填充层123顶部12c的部分区域，第一延伸部1212通过第一勾起部1211的关联作用，同时也紧固地层叠在OLED器件的侧面12a。采用此结构的第三无机层121，一方面，第三无机层121全面包围着OLED器件的侧面，从而全方位地阻隔水分或氧气进入OLED器件。另一方面，通过第一勾起部1211的作用，第三无机层121能够稳定可靠地与OLED器件接触。The first hooking portion 1211 can be firmly laminated on a partial region of the top portion 12c of the material-filled layer 123, and the first extension portion 1212 is also firmly laminated on the side surface 12a of the OLED device through the association effect of the first hooking portion 1211 . With the third inorganic layer 121 of this structure, on the one hand, the third inorganic layer 121 completely surrounds the side of the OLED device, thereby blocking moisture or oxygen from entering the OLED device in all directions. On the other hand, the third inorganic layer 121 can be in stable and reliable contact with the OLED device by the function of the first hook 1211.
在一些实施例中，请继续参阅图2，第四无机层122包括：第二勾起部1221与第二延伸部1222。In some embodiments, please continue to refer to FIG. 2, the fourth inorganic layer 122 includes: a second hook portion 1221 and a second extension portion 1222.
第二勾起部1221覆盖于材料填充层123顶部12c的另一部分区域，第二勾起部1221与第一勾起部1211相对。The second lifting portion 1221 covers another partial area of the top portion 12c of the material filling layer 123, and the second lifting portion 1221 is opposite to the first lifting portion 1211.
第二延伸部1222与第二勾起部1221接触，第二延伸部1222覆盖于与像素界定层12相邻两个OLED器件中另一个OLED器件的侧面12b。The second extension portion 1222 is in contact with the second hook portion 1221, and the second extension portion 1222 covers the side surface 12 b of the other OLED device of the two OLED devices adjacent to the pixel defining layer 12.
第二勾起部1221能够紧固地层叠在材料填充层123顶部12c的另一部分区域，第二延伸部1222通过第二勾起部1221的关联作用，同时也紧固地层叠在OLED器件的侧面12a。采用此结构的第四无机层122，一方面，第四无机层122全面包围着OLED器件的侧面，从而全方位地阻隔水分或氧气进入OLED器件。另一方面，通过第二勾起部1221的作用，第四无机层122能够稳定可靠地与OLED器件接触。The second hooking portion 1221 can be firmly stacked on another part of the top portion 12c of the material-filled layer 123, and the second extension portion 1222 can also be firmly stacked on the side of the OLED device through the association effect of the second hooking portion 1221 12a. With the fourth inorganic layer 122 of this structure, on the one hand, the fourth inorganic layer 122 completely surrounds the side of the OLED device, thereby blocking moisture or oxygen from entering the OLED device in all directions. On the other hand, by the function of the second hooking portion 1221, the fourth inorganic layer 122 can be in stable and reliable contact with the OLED device.
在一些实施例中，缓冲层15靠近薄膜晶体管基板11的一侧填充于第一勾起部1211与第二勾起部1221之间的空隙并且抵接在材料填充层123顶部。因此，缓冲层15不仅能够缓冲相邻的两个薄膜封装层之间的挤压应力，而且，还能够缓冲相邻的两个像素界定层12之间的挤压应力。In some embodiments, the side of the buffer layer 15 near the thin film transistor substrate 11 fills the gap between the first hooking portion 1211 and the second hooking portion 1221 and abuts on top of the material filling layer 123. Therefore, the buffer layer 15 can not only buffer the compressive stress between two adjacent thin-film encapsulation layers, but also buffer the compressive stress between the two adjacent pixel defining layers 12.
在一些实施例中，缓冲层15、第一勾起部1211以及第二勾起部1221共同覆盖材料填充层123顶部，因此，缓冲层15能够全面封闭薄膜封装层11的一侧，全面保护好薄膜封装层11。In some embodiments, the buffer layer 15, the first hooking portion 1211 and the second hooking portion 1221 cover the top of the material filling layer 123 together. Therefore, the buffer layer 15 can fully close one side of the thin film encapsulation layer 11 and be fully protected Thin film encapsulation layer 11.
OLED器件13用于在外部电压的作用下发光，OLED器件13可以采用任何合适工艺制备。The OLED device 13 is used to emit light under the action of an external voltage. The OLED device 13 can be prepared by any suitable process.
在一些实施例中，请参阅图3a，OLED器件13包括：阳极131、阴极132及有机功能层133。In some embodiments, referring to FIG. 3a, the OLED device 13 includes an anode 131, a cathode 132, and an organic functional layer 133.
阳极131层叠于薄膜晶体管基板11的沉积面110上，并且，阳极131皆位于每相邻两个像素界定层12之间，有机功能层133层叠于阳极131上并位于每相邻两个像素界定层12之间，阴极132层叠于有机功能层133上并远离阳极131，薄膜封装层14封装于阴极132上。The anode 131 is stacked on the deposition surface 110 of the thin film transistor substrate 11, and the anode 131 is located between every two adjacent pixel defining layers 12, and the organic functional layer 133 is stacked on the anode 131 and located between every two adjacent pixel definitions Between the layers 12, the cathode 132 is stacked on the organic functional layer 133 and away from the anode 131, and the thin film encapsulation layer 14 is encapsulated on the cathode 132.
电致发光时，阳极131与阴极132之间被施加外部电压，阳极131在外部电压的作用下，释放空穴。阴极在外部电压的作用下，释放电子。空穴迁移至有机功能层133，同理，电子迁移至有机功能层133，当电子与空穴在有机功能层133中相遇而复合，形成处于激发态的激子，激子在电场作用下将能量传递给发光分子，激发发光分子的电子从基态跃迁到激发态，发光分子的电子将主要以光的形式释放能量而回到稳定的基态，从而产生电致发光。In electroluminescence, an external voltage is applied between the anode 131 and the cathode 132, and the anode 131 releases holes under the action of the external voltage. The cathode releases electrons under the action of an external voltage. The holes migrate to the organic functional layer 133. Similarly, the electrons migrate to the organic functional layer 133. When the electrons and holes meet and recombine in the organic functional layer 133, they form excitons in an excited state. Energy is transferred to the luminescent molecules, and the electrons that excite the luminescent molecules transition from the ground state to the excited state. The electrons of the luminescent molecules will release energy mainly in the form of light and return to a stable ground state, thereby generating electroluminescence.
在一些实施例中，阳极131可以是透射式电极或半透反射式电极。In some embodiments, the anode 131 may be a transmissive electrode or a transflective electrode.
在一些实施例中，阴极132可以是透射式电极或半透反射式电极，亦可以是具有多层结构的透射式电极。In some embodiments, the cathode 132 may be a transmissive electrode or a transflective electrode, or may be a transmissive electrode with a multilayer structure.
在一些实施例中，阳极131与阴极132中的一个须为透明电极，另一个可为透明电极或不透明电极。举例而言，阳极采用铟锡氧化物透明电极，阴极132采用诸如由镁、镁银合金、钙或者锂铝合金等材质。In some embodiments, one of the anode 131 and the cathode 132 must be a transparent electrode, and the other can be a transparent electrode or an opaque electrode. For example, the anode uses a transparent electrode of indium tin oxide, and the cathode 132 uses a material such as magnesium, magnesium-silver alloy, calcium, or lithium aluminum alloy.
在一些实施例中，有机功能层133由在基质材料中掺杂一定比例的有机发光材料制备成的。发光材料具有较高的量子效率和足够的热稳定性，升华而不会分解。当电子与空穴在有机功能层133中相遇后，电子就源源不断地从高轨道填充到低轨道的空穴中，从而释放出能量。In some embodiments, the organic functional layer 133 is prepared by doping the host material with a certain proportion of organic light-emitting materials. The luminescent material has high quantum efficiency and sufficient thermal stability, sublimates without decomposition. When electrons and holes meet in the organic functional layer 133, the electrons are continuously filled from the high orbit to the low orbit hole, thereby releasing energy.
有机发光材料可以选择以有机染料或颜料等为发光材料的小分子基OLED，亦可以选择以共轭高分子为发光材料的高分子基OLED，小分子基OLED可以采用真空热蒸发工艺，高分子基OLED可以采用旋转涂覆或喷墨工艺。按照发光激子的种类，有机发光材料可以选择荧光材料，亦可以选择磷光材料。The organic light-emitting material can be a small molecule-based OLED that uses organic dyes or pigments as the light-emitting material, or a polymer-based OLED that uses conjugated polymers as the light-emitting material. The small molecule-based OLED can use a vacuum thermal evaporation process. The base OLED can use spin coating or inkjet process. According to the type of luminous excitons, the organic light-emitting material can be selected from fluorescent materials or phosphorescent materials.
请参阅图3b，有机功能层133包括依次制备的空穴注入层1331、空穴传输层1332、有机发光层1333、电子传输层1334及电子注入层1335。Referring to FIG. 3b, the organic functional layer 133 includes a hole injection layer 1331, a hole transport layer 1332, an organic light emitting layer 1333, an electron transport layer 1334, and an electron injection layer 1335 that are prepared in sequence.
空穴注入层1331能够将空穴有效地注入空穴传输层1332，并通过空穴传输层1332注入到有机发光层1333，使得空穴在有机发光层1333中与电子相遇。The hole injection layer 1331 can effectively inject holes into the hole transport layer 1332 and be injected into the organic light emitting layer 1333 through the hole transport layer 1332, so that holes meet electrons in the organic light emitting layer 1333.
空穴传输层1332可以包括例如n-苯基咔唑、聚乙烯基咔唑等的基于咔唑的衍生物、基于氟的衍生物等。The hole transport layer 1332 may include, for example, carbazole-based derivatives such as n-phenylcarbazole, polyvinylcarbazole, and fluorine-based derivatives.
有机发光层1333可以包括有机发光材料。在一些实施例中，有机发光材料可以包括发射红光、绿光或蓝光的材料以及荧光材料或磷光材料。在一些实施例中，有机发光层1333可以包括两种或更多种发光材料。The organic light emitting layer 1333 may include an organic light emitting material. In some embodiments, the organic light-emitting material may include a material that emits red light, green light, or blue light, and a fluorescent material or a phosphorescent material. In some embodiments, the organic light-emitting layer 1333 may include two or more light-emitting materials.
在一些实施例中，有机发光层1333可以包括主体和掺杂剂。作为主体，可以使用例如Alq 3(三(8-羟基喹啉)铝)等等。 In some embodiments, the organic light emitting layer 1333 may include a host and a dopant. As the main body, for example, Alq 3 (tris(8-hydroxyquinoline) aluminum) or the like can be used.
在一些实施例中，电子传输层1334包括例如Alq 3(三(8-羟基喹啉)铝)、TPBi(1,3,5-三(1-苯基-1H-苯并[d]咪唑-2-基)苯基)等等。 In some embodiments, the electron transport layer 1334 includes, for example, Alq 3 (tris(8-hydroxyquinoline) aluminum), TPBi(1,3,5-tris(1-phenyl-1H-benzo[d]imidazole- 2-yl)phenyl) and so on.
在一些实施例中，电子注入层1335由有机金属络合物或无机物制成，在一些实施例中，电子注入层1335由碱金属化合物制成，例如，电子注入层1335由LiF、LiQ、NaF、CsF、Cs 2CO 3中的一种制成或由其它合适的材料制成。 In some embodiments, the electron injection layer 1335 is made of an organic metal complex or an inorganic substance. In some embodiments, the electron injection layer 1335 is made of an alkali metal compound. For example, the electron injection layer 1335 is made of LiF, LiQ, One of NaF, CsF, Cs 2 CO 3 or other suitable materials.
在一些实施例中，电子注入层1335能够将电子有效地注入电子传输层1334，并通过电子传输层1334注入到有机发光层1333，使得电子在有机发光层1333中与空穴相遇，一方面，电子注入层1335的增加能够提高电子注入有机发光层1333的效率，另一方面，其还能够降低工作电压。In some embodiments, the electron injection layer 1335 can effectively inject electrons into the electron transport layer 1334 and be injected into the organic light emitting layer 1333 through the electron transport layer 1334, so that electrons meet holes in the organic light emitting layer 1333. On the one hand, The increase of the electron injection layer 1335 can improve the efficiency of electron injection into the organic light-emitting layer 1333, and on the other hand, it can also reduce the operating voltage.
在一些实施例中，请参阅图3c，有机发光层1333包括：有机发光主体层13331与有机发光电子阻挡层13332，有机发光主体层13331层叠于电子传输层1334与空穴传输层1332之间，有机发光电子阻挡层13332层叠于有机发光主体层13331与空穴传输层1332之间。In some embodiments, referring to FIG. 3c, the organic light-emitting layer 1333 includes: an organic light-emitting body layer 13331 and an organic light-emitting electron blocking layer 13332, the organic light-emitting body layer 13331 is stacked between the electron transport layer 1334 and the hole transport layer 1332, The organic light-emitting electron blocking layer 13332 is stacked between the organic light-emitting host layer 13331 and the hole transport layer 1332.
有机发光主体层13331可配置对应颜色的发光材料而产生对应颜色的光。例如，在一些实施例中，请参阅图3d，有机发光主体层13331包括多种颜色发光主体层，所述颜色发光主体层包括红光发光主体层3d1、绿光发光主体层3d2或者蓝光发光主体层3d3。相应的，为了阻挡对应颜色材料的电子，颜色电子阻挡层包括红光电子阻挡层3d4、绿光电子阻挡层3d5或者蓝光电子阻挡层3d6。其中，红光电子阻挡层3d4与红光发光主体层3d1相对，绿光电子阻挡层3d5与绿光发光主体层3d2相对，蓝光电子阻挡层3d6与蓝光发光主体层3d3相对。The organic light-emitting host layer 13331 may be configured with light-emitting materials of corresponding colors to generate light of corresponding colors. For example, in some embodiments, please refer to FIG. 3d, the organic light emitting host layer 13331 includes multiple color light emitting host layers, the color light emitting host layer includes a red light emitting host layer 3d1, a green light emitting host layer 3d2, or a blue light emitting host Layer 3d3. Accordingly, in order to block the electrons of the corresponding color material, the color electron blocking layer includes a red light electron blocking layer 3d4, a green light electron blocking layer 3d5, or a blue light electron blocking layer 3d6. Among them, the red light electron blocking layer 3d4 is opposite to the red light emitting body layer 3d1, the green light electron blocking layer 3d5 is opposite to the green light emitting body layer 3d2, and the blue light electron blocking layer 3d6 is opposite to the blue light emitting body layer 3d3.
有机发光二极管器件被施加外部电压时，红光发光主体层3d1发射红光，红光电子阻挡层3d4阻挡红光电子向空穴传输层133移动。绿光发光主体层3d2发射绿光，绿光电子阻挡层3d5阻挡绿光电子向空穴传输层1332移动。蓝光发光主体层3d3发射蓝光，蓝光电子阻挡层3d6阻挡蓝光电子向空穴传输层133移动。When an external voltage is applied to the organic light emitting diode device, the red light emitting body layer 3d1 emits red light, and the red light electron blocking layer 3d4 blocks the red light electrons from moving to the hole transport layer 133. The green light emitting body layer 3d2 emits green light, and the green light electron blocking layer 3d5 blocks the movement of green light electrons to the hole transport layer 1332. The blue light-emitting host layer 3d3 emits blue light, and the blue electron blocking layer 3d6 blocks blue electrons from moving to the hole transport layer 133.
在一些实施例中，请参阅图4a，薄膜封装层14包括第一无机层141， 第一无机层141层叠于每个OLED器件13上。例如，第一无机层141层叠于阴极132上，由于第一无机层141能够阻隔水分或氧气，并且，水分或氧气会氧化阴极而损坏阴极，因此，第一无机层141能够保护好阴极，从而提高OLED器件13的使用寿命。In some embodiments, please refer to FIG. 4 a, the thin film encapsulation layer 14 includes a first inorganic layer 141, and the first inorganic layer 141 is stacked on each OLED device 13. For example, the first inorganic layer 141 is stacked on the cathode 132. Since the first inorganic layer 141 can block moisture or oxygen, and the moisture or oxygen can oxidize the cathode and damage the cathode, the first inorganic layer 141 can protect the cathode, thereby The service life of the OLED device 13 is increased.
在一些实施例中，第一无机层141的厚度小于缓冲层15的厚度，亦即，缓冲层15层叠在第一无机层141侧面的高度大于第一无机层141层叠在OLED器件上的高度，因此，折叠时，缓冲层15能够缓冲第一无机层141侧面全部受到的挤压应力，更好地保护好第一无机层141避免直接受到相邻的另一个薄膜封装层中无机层的挤压。In some embodiments, the thickness of the first inorganic layer 141 is less than the thickness of the buffer layer 15, that is, the height of the buffer layer 15 stacked on the side of the first inorganic layer 141 is greater than the height of the first inorganic layer 141 stacked on the OLED device, Therefore, when folded, the buffer layer 15 can buffer the compression stress on all sides of the first inorganic layer 141 to better protect the first inorganic layer 141 from being directly compressed by the inorganic layer in another adjacent thin-film encapsulation layer .
在一些实施例中，请参阅图4b，薄膜封装层14还包括第一有机层142，第一有机层142层叠于第一无机层141上并远离OLED器件13。第一有机层142能够包覆粒子，并且平坦化第一无机层141，使得后续更加容易层叠各类结构层。In some embodiments, please refer to FIG. 4 b, the thin film encapsulation layer 14 further includes a first organic layer 142 that is stacked on the first inorganic layer 141 and away from the OLED device 13. The first organic layer 142 can coat the particles and planarize the first inorganic layer 141, making it easier to stack various structural layers later.
在一些实施例中，第一有机层142与第一无机层141两者的总厚度小于缓冲层15的厚度，亦即，缓冲层15层叠在第一无机层141与第一有机层142两者侧面的高度大于第一无机层141与第一有机层142两者层叠在OLED器件上的总高度，因此，折叠时，缓冲层15能够缓冲第一无机层141与第一有机层142两者各自侧面全部受到的挤压应力，更好地保护好第一无机层141与第一有机层142避免直接受到相邻的另一个薄膜封装层的挤压。In some embodiments, the total thickness of both the first organic layer 142 and the first inorganic layer 141 is less than the thickness of the buffer layer 15, that is, the buffer layer 15 is stacked on both the first inorganic layer 141 and the first organic layer 142 The height of the side is greater than the total height of the first inorganic layer 141 and the first organic layer 142 stacked on the OLED device, therefore, when folded, the buffer layer 15 can buffer both the first inorganic layer 141 and the first organic layer 142 The compressive stresses on all the sides can better protect the first inorganic layer 141 and the first organic layer 142 from being directly compressed by another adjacent thin-film encapsulation layer.
在一些实施例中，请参阅图4c，薄膜封装层14还包括第二无机层143，第二无机层143层叠于第一有机层142上并远离第一无机层141。第二无机层143能够阻隔水分或氧气。In some embodiments, referring to FIG. 4c, the thin film encapsulation layer 14 further includes a second inorganic layer 143, which is stacked on the first organic layer 142 and away from the first inorganic layer 141. The second inorganic layer 143 can block moisture or oxygen.
在一些实施例中，第一有机层142、第一无机层141及第二无机层143三者的总厚度小于缓冲层15的厚度，亦即，缓冲层15层叠在第一无机层141、第一有机层142及第二无机层143三者侧面的高度大于第一无机层141、第一有机层142及第二无机层143三者层叠在OLED器件上的总高度，因此，折叠时，缓冲层15能够缓冲第一无机层141、第一有机层142及第二无机层143三者各自侧面全部受到的挤压应力，更 好地保护好第一无机层141、第一有机层142及第二无机层143避免直接受到相邻的另一个薄膜封装层的挤压。In some embodiments, the total thickness of the first organic layer 142, the first inorganic layer 141, and the second inorganic layer 143 is less than the thickness of the buffer layer 15, that is, the buffer layer 15 is stacked on the first inorganic layer 141, the first The height of the side surfaces of the organic layer 142 and the second inorganic layer 143 is greater than the total height of the first inorganic layer 141, the first organic layer 142, and the second inorganic layer 143 stacked on the OLED device. Therefore, when folded, the buffer The layer 15 can buffer the compressive stress on all sides of the first inorganic layer 141, the first organic layer 142, and the second inorganic layer 143 to better protect the first inorganic layer 141, the first organic layer 142, and the first The two inorganic layers 143 avoid being directly pressed by another adjacent thin-film encapsulation layer.
在一些实施例中，请参阅图4d，薄膜封装层14还包括第二有机层144，第二有机层144层叠于第二无机层143上并远离第一有机层142，第二有机层144可作为掩膜图案化之用。In some embodiments, please refer to FIG. 4d, the thin film encapsulation layer 14 further includes a second organic layer 144. The second organic layer 144 is stacked on the second inorganic layer 143 and away from the first organic layer 142. The second organic layer 144 may be Used as a mask pattern.
在一些实施例中，缓冲层15层叠在第一无机层141、第一有机层142、第二无机层143及第二有机层144四者侧面的高度可以大于或小于或等于第一无机层141、第一有机层142、第二无机层143及第二有机层144四者层叠在OLED器件上的总高度。In some embodiments, the height of the buffer layer 15 stacked on the sides of the first inorganic layer 141, the first organic layer 142, the second inorganic layer 143, and the second organic layer 144 may be greater than or less than or equal to the first inorganic layer 141 , The total height of the first organic layer 142, the second inorganic layer 143, and the second organic layer 144 stacked on the OLED device.
在一些实施例中，本文所涉及的无机层可以选择Al 2O 3等金属氧化物，亦可以选择硅氮化合物、硅氧化合物等等。 In some embodiments, the inorganic layer referred to herein may be selected from metal oxides such as Al 2 O 3, and may also be selected from silicon nitrogen compounds, silicon oxide compounds, and the like.
本申请实施例提供一种柔性显示装置。请参阅图5，柔性显示装置50包括壳体51与柔性显示面板52，柔性显示面板52可收容于壳体51内，例如，柔性显示面板52可收缩于壳体51内，用户可以通过手拉柔性显示面板52，以将柔性显示面板52从壳体51内拉出。Embodiments of the present application provide a flexible display device. Referring to FIG. 5, the flexible display device 50 includes a housing 51 and a flexible display panel 52. The flexible display panel 52 can be accommodated in the housing 51. For example, the flexible display panel 52 can be retracted in the housing 51. The flexible display panel 52 is used to pull the flexible display panel 52 out of the housing 51.
在本实施例中，柔性显示面板52可以选择图1a至图4d所阐述的柔性显示面板。In this embodiment, the flexible display panel 52 may select the flexible display panel illustrated in FIGS. 1a to 4d.
在本实施例中，折叠时，柔性显示面板52中的薄膜封装层跟随着折叠时，缓冲层能够防止相邻的两个薄膜封装层直接互相挤压与碰撞，缓冲两个薄膜封装层的碰撞，降低了薄膜封装层出现侧边破裂的概率，进而降低薄膜封装层的侧边破裂而使水氧进入OLED器件的现象的出现概率，从而相对地提高柔性显示面板52的使用寿命。In this embodiment, when folding, the film encapsulation layer in the flexible display panel 52 follows the folding, the buffer layer can prevent the two adjacent film encapsulation layers from directly squeezing and colliding with each other, and buffer the collision of the two film encapsulation layers This reduces the probability that the thin film encapsulation layer will crack on the side, thereby reducing the probability that the thin film encapsulation layer will crack on the side to allow water and oxygen to enter the OLED device, thereby relatively increasing the service life of the flexible display panel 52.
本领域技术人员可以理解，本说明书中各实施例所描述工艺及材料仅为示例性，本申请实施例可以使用未来开发的适用于本申请的任何工艺或材料。Those skilled in the art can understand that the processes and materials described in the embodiments in this specification are only exemplary, and any process or material suitable for the application developed in the future may be used in the embodiments of the application.
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；在本申请的思路下，以上实施例或者不同实施例中的技术特征之间也可以进行组合，步骤可以以任意顺序实现，并存在如上所述的本申请的不同方面的许多其它变化，为了简明，它们没有在细节中提供； 尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, not to limit them; under the idea of the present application, the technical features in the above embodiments or different embodiments may also be combined, The steps can be implemented in any order, and there are many other variations of the different aspects of the application as described above. For simplicity, they are not provided in the details; although the application has been described in detail with reference to the foregoing embodiments, the ordinary The skilled person should understand that they can still modify the technical solutions described in the foregoing embodiments, or equivalently replace some of the technical features; and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the implementation of this application. Examples of technical solutions.

Claims (14)

  1. 一种柔性显示面板，其特征在于，包括：A flexible display panel, characterized in that it includes:
    薄膜晶体管基板，包括沉积面；Thin film transistor substrate, including the deposition surface;
    若干像素界定层，依次排列于所述沉积面上；Several pixel defining layers are arranged in sequence on the deposition surface;
    若干OLED器件，依次排列于所述沉积面上，并且，每个所述OLED器件皆位于每相邻两个所述像素界定层之间；Several OLED devices are arranged in sequence on the deposition surface, and each of the OLED devices is located between each adjacent two pixel defining layers;
    若干薄膜封装层，每个所述薄膜封装层封装于对应的一个所述OLED器件上；以及A plurality of thin-film encapsulation layers, each of which is encapsulated on a corresponding one of the OLED devices; and
    缓冲层，层叠于所述薄膜封装层的侧面。A buffer layer is laminated on the side of the thin film encapsulation layer.
  2. 根据权利要求1所述的柔性显示面板，其特征在于，所述缓冲层层叠于每相邻两个所述薄膜封装层之间。The flexible display panel according to claim 1, wherein the buffer layer is stacked between every two adjacent thin-film encapsulation layers.
  3. 根据权利要求1所述的柔性显示面板，其特征在于，所述缓冲层包括有机膜层。The flexible display panel according to claim 1, wherein the buffer layer comprises an organic film layer.
  4. 根据权利要求1所述的柔性显示面板，其特征在于，所述薄膜封装层包括：The flexible display panel according to claim 1, wherein the thin film encapsulation layer comprises:
    第一无机层，层叠于每个所述OLED器件上；A first inorganic layer stacked on each of the OLED devices;
    第一有机层，层叠于所述第一无机层上并远离所述OLED器件。A first organic layer is stacked on the first inorganic layer and away from the OLED device.
    第二无机层，层叠于所述第一有机层上并远离所述第一无机层。The second inorganic layer is stacked on the first organic layer and away from the first inorganic layer.
  5. 根据权利要求4所述的柔性显示面板，其特征在于，所述薄膜封装层包括：第二有机层，所述第二有机层层叠于所述第二无机层上并远离所述第一有机层。The flexible display panel according to claim 4, wherein the thin film encapsulation layer includes: a second organic layer stacked on the second inorganic layer and away from the first organic layer .
  6. 根据权利要求4所述的柔性显示面板，其特征在于，所述第一有机层、所述第一无机层及所述第二无机层三者的总厚度小于所述缓冲层的厚度。The flexible display panel according to claim 4, wherein the total thickness of the first organic layer, the first inorganic layer, and the second inorganic layer is less than the thickness of the buffer layer.
  7. 根据权利要求1所述的柔性显示面板，其特征在于，每个所述OLED器件皆包括：The flexible display panel according to claim 1, wherein each of the OLED devices includes:
    阳极，层叠于所述薄膜晶体管基板的沉积面上，并且，所述阳极皆位于每相邻两个所述像素界定层之间；An anode, stacked on the deposition surface of the thin film transistor substrate, and the anode is located between every two adjacent pixel defining layers;
    有机功能层，层叠于所述阳极上并位于每相邻两个所述像素界定层之间；An organic functional layer, stacked on the anode and located between every two adjacent pixel defining layers;
    阴极，层叠于所述有机功能层上并远离所述阳极，所述薄膜封装层封装于所述阴极上。The cathode is stacked on the organic functional layer and away from the anode, and the thin film encapsulation layer is encapsulated on the cathode.
  8. 根据权利要求1至7任一项所述的柔性显示面板，其特征在于，每个所述像素界定层皆包括：The flexible display panel according to any one of claims 1 to 7, wherein each of the pixel defining layers includes:
    第三无机层，覆盖于与所述像素界定层相邻两个OLED器件中一个OLED器件的侧面；A third inorganic layer covering the side of one of the two OLED devices adjacent to the pixel defining layer;
    第四无机层，覆盖于与所述像素界定层相邻两个OLED器件中另一个OLED器件的侧面。The fourth inorganic layer covers the side of the other one of the two OLED devices adjacent to the pixel defining layer.
  9. 根据权利要求8所述的柔性显示面板，其特征在于，每个所述像素界定层还包括：The flexible display panel according to claim 8, wherein each of the pixel defining layers further comprises:
    材料填充层，填充于所述第三无机层与所述第四无机层之间。A material-filled layer is filled between the third inorganic layer and the fourth inorganic layer.
  10. 根据权利要求8所述的柔性显示面板，其特征在于，所述第三无机层包括：The flexible display panel according to claim 8, wherein the third inorganic layer comprises:
    第一勾起部，覆盖于所述材料填充层顶部的部分区域；The first hooking portion covers a part of the top of the material filling layer;
    第一延伸部，与所述第一勾起部相接，所述第一延伸部覆盖于与所述像素界定层相邻两个OLED器件中一个OLED器件的侧面。The first extending portion is in contact with the first hooking portion, and the first extending portion covers a side of one of the two OLED devices adjacent to the pixel defining layer.
  11. 根据权利要求10所述的柔性显示面板，其特征在于，所述第四无机层包括：The flexible display panel of claim 10, wherein the fourth inorganic layer comprises:
    第二勾起部，覆盖于所述材料填充层顶部的部分区域，所述第二勾起部与所述第一勾起部相对；A second hooking portion covering a part of the top of the material filling layer, the second hooking portion is opposite to the first hooking portion;
    第二延伸部，与所述第二勾起部相接，所述第二延伸部覆盖于与所述像素界定层相邻两个OLED器件中另一个OLED器件的侧面。The second extending portion is in contact with the second hooking portion, and the second extending portion covers the side of the other OLED device of the two OLED devices adjacent to the pixel defining layer.
  12. 根据权利要求11所述的柔性显示面板，其特征在于，所述缓冲层靠近所述薄膜晶体管基板的一侧填充于所述第一勾起部与所述第二勾起部之间的空隙并且抵接在所述材料填充层顶部。The flexible display panel according to claim 11, wherein a side of the buffer layer close to the thin film transistor substrate fills a gap between the first hooked portion and the second hooked portion and Abut on top of the material filling layer.
  13. 根据权利要求11所述的柔性显示面板，其特征在于，所述缓冲层、所述第一勾起部以及所述第二勾起部共同覆盖所述材料填充层顶 部。The flexible display panel according to claim 11, wherein the buffer layer, the first hooking portion, and the second hooking portion collectively cover the top of the material-filled layer.
  14. 一种柔性显示装置，其特征在于，包括：A flexible display device is characterized by comprising:
    壳体；以及，Shell; and,
    如权利要求1至13任一项所述的柔性显示面板，所述柔性显示面板可收容于所述壳体内。The flexible display panel according to any one of claims 1 to 13, which can be accommodated in the housing.
PCT/CN2018/120913 2018-12-13 2018-12-13 Flexible display panel and flexible display apparatus WO2020118626A1 (en)

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