WO2020107647A1 - Repairing method in manufacturing process for array substrate - Google Patents

Repairing method in manufacturing process for array substrate Download PDF

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Publication number
WO2020107647A1
WO2020107647A1 PCT/CN2019/070313 CN2019070313W WO2020107647A1 WO 2020107647 A1 WO2020107647 A1 WO 2020107647A1 CN 2019070313 W CN2019070313 W CN 2019070313W WO 2020107647 A1 WO2020107647 A1 WO 2020107647A1
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metal layer
forming
layer
conductive pattern
metal
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PCT/CN2019/070313
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French (fr)
Chinese (zh)
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何伟
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深圳市华星光电技术有限公司
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Publication of WO2020107647A1 publication Critical patent/WO2020107647A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136259—Repairing; Defects

Definitions

  • the present invention relates to the field of display technology, and in particular to a repair method in the manufacturing process of an array substrate.
  • liquid crystal displays Liquid Crystal Display, LCD
  • LCD liquid crystal Display
  • other flat display devices have been widely used in mobile phones, TVs, and individuals due to their advantages of high image quality, power saving, thin body, and wide range of applications.
  • Various consumer electronic products such as digital assistants, digital cameras, notebook computers, and desktop computers have become the mainstream in display devices.
  • liquid crystal display devices which include a liquid crystal display panel and a backlight module.
  • the working principle of the liquid crystal display panel is to place liquid crystal molecules in two parallel glass substrates. There are many vertical and horizontal small wires between the two glass substrates.
  • the liquid crystal molecules can be controlled to change the direction by turning on or off, and the backlight module light Refracted to produce a picture.
  • a liquid crystal display panel is composed of a color filter substrate (CF, Color Filter) and a thin film transistor substrate (TFT, Thin Film) Transistor), liquid crystal (LC, Liquid Crystal) and sealant frame (Sealant) sandwiched between the color film substrate and the thin film transistor substrate
  • the molding process generally includes: the front-end array (Array) process (film, yellow light, etching And film stripping), the middle cell (Cell) process (the TFT substrate is bonded to the CF substrate) and the rear stage module assembly process (the driver IC is pressed to the printed circuit board).
  • the front stage Array process is mainly to form a TFT substrate to facilitate the control of the movement of liquid crystal molecules;
  • the middle stage Cell process is mainly to add liquid crystal between the TFT substrate and the CF substrate;
  • the rear stage module assembly process is mainly to drive the IC pressing and printed circuit The integration of the board then drives the liquid crystal molecules to rotate and display images.
  • the array process is a key process for the manufacture of liquid crystal display panels, which includes the process of forming each signal line.
  • line defects short or open circuit of the signal line
  • the existing array In the electrical inspection of the process, some line defects cannot be accurately positioned through electrical inspection, and the operator cannot repair the defects and lead to product scrapping.
  • optical inspection and electrical properties in the existing array process Inspections are independent of each other, mainly by taking images of multiple areas on the substrate to determine whether the process is defective, but optical inspections are mainly based on the images taken to determine defects, and it is impossible to accurately know whether the defect will affect product quality and need to be repaired. Therefore, it is prone to wrong killing, and only images of part of the area on the substrate will be taken during optical inspection. At this time, the defect points in the area cannot be detected, so there will be missed killing.
  • the purpose of the present invention is to provide a repair method in the manufacturing process of an array substrate, which can improve the accuracy and success rate of defect point search and improve the repair success rate of defect points.
  • the present invention provides a repair method in the manufacturing process of an array substrate, including the following steps:
  • the position of the defect point on the conductive pattern is determined, and the defect point is repaired.
  • the repair method in the manufacturing process of the array substrate specifically includes the following steps:
  • the detection result determines the position of the defect point on the first metal layer, and repairs the first metal layer
  • the detection result, the third optical detection result and the second electrical detection result determine the position of the defect point on the second metal layer, and perform the first repair on the second metal layer;
  • the step of forming a first metal layer on the substrate specifically includes: forming a first metal thin film on the substrate, sequentially exposing, developing, and etching the first metal thin film to obtain the first metal layer ;
  • the first optical detection is performed between the steps of developing the first metal thin film and etching the first metal thin film
  • the first electrical detection is performed between the step of etching the first metal thin film and the step of forming the first insulating layer.
  • the step of forming a second metal layer on the first insulating layer specifically includes: forming a second metal film on the first insulating layer, and sequentially exposing, developing, and etching the second metal film to obtain The second metal layer;
  • the second optical inspection is performed between the steps of developing the second metal thin film and etching the second metal thin film
  • the third optical inspection is performed between the step of etching the second metal thin film and the step of forming a passivation layer;
  • the second electrical detection is performed between the step of etching the second metal thin film and the step of forming a passivation layer.
  • the optical detection specifically includes: taking images of multiple areas on the conductive pattern through a camera;
  • the electrical detection specifically includes: inputting an electrical signal to the conductive pattern, and acquiring a transmission state of the electrical signal in the conductive pattern.
  • the combination of the optical detection result and the electrical detection result to determine the position of the defect point on the conductive pattern is specifically:
  • the specific position of the defect point in the poor transmission area is obtained according to the image of the poor transmission area captured by optical detection.
  • the defect point is specifically a point where a short circuit occurs in the conductive pattern.
  • the defect point is specifically a point where a disconnection occurs in the conductive pattern.
  • the step of forming a second metal layer on the first insulating layer and the step of forming a second metal layer on the first insulating layer further include between the second metal layer and the passivation layer The step of forming the color resist layer.
  • the invention also provides a repair method in the manufacturing process of the array substrate, including the following steps:
  • the detection result determines the position of the defect point on the first metal layer, and repairs the first metal layer
  • the detection result, the third optical detection result and the second electrical detection result determine the position of the defect point on the second metal layer, and perform the first repair on the second metal layer;
  • the optical detection specifically includes: taking images of multiple areas on the conductive pattern through a camera;
  • the electrical detection specifically includes: inputting an electrical signal to the conductive pattern, and acquiring a transmission state of the electrical signal in the conductive pattern.
  • the present invention provides a repair method in the manufacturing process of an array substrate, including the following steps: forming a conductive pattern on the substrate; optically and electrically detecting the conductive pattern; using optical detection results and electricity The combination of the results of the property test to determine the location of the defect point on the conductive pattern and to repair the defect point. The position of the defect point is determined by the combination of the optical test result and the electrical test result, which can improve the accuracy of the defect point search Rate and success rate, to improve the success rate of defect repair.
  • FIG. 1 is a structural diagram of an array substrate in a repair method in an array substrate manufacturing process of the present invention
  • FIG. 2 is a flowchart of a repair method in the manufacturing process of the array substrate of the present invention.
  • the present invention provides a repair method in the manufacturing process of an array substrate, including the following steps:
  • Conductive pattern 20 On the substrate 10 Conductive pattern 20 ;
  • For the conductive pattern 20 Perform optical and electrical testing
  • the repair method in the manufacturing process of the array substrate specifically includes:
  • first metal layer twenty one On the substrate 10 Forming a first metal layer twenty one And forming the first metal layer twenty one During the process, the first optical detection and the first electrical detection are performed, and the first metal layer is determined according to the results of the first optical detection and the first electrical detection twenty one The location of the defect point on the first metal layer twenty one Make repairs;
  • first metal layer twenty one Forming a first insulating layer twenty two ;
  • the second optical inspection, the third optical inspection and the second electrical inspection are performed, and the second metal layer is determined according to the second optical inspection results, the third optical inspection results and the second electrical inspection results twenty three
  • the location of the defect point on the second metal layer twenty three Carry out the first repair;
  • the passivation layer twenty four Forming the transparent conductive layer 25 , The first metal layer twenty one , The second metal layer twenty three And transparent conductive layer 25 Together constitute the conductive pattern 20 ;
  • the first metal layer twenty one Including a gate, a gate line electrically connected to the gate, and the second metal layer twenty three Including a source electrode, a drain electrode and a source line electrically connected to the source electrode, the transparent conductive layer 25 Including a pixel electrode, the pixel electrode passes through the passivation layer twenty four Is electrically connected to the drain.
  • the array substrate is a color film array integrated ( Color filter on array , COA ) Substrate
  • the steps S13 And steps S14 Between the second metal layer twenty three And passivation layer twenty four Color resist layer 26
  • the steps of the color resist layer 26 Including multiple color blocks of different colors.
  • the substrate 10 Forming a first metal layer twenty one The steps include: the substrate 10 Forming a first metal film on the first metal film, sequentially exposing, developing and etching the first metal film to obtain the first metal layer twenty one ;
  • the first optical detection is performed between the steps of developing the first metal thin film and etching the first metal thin film, and the first electrical detection is performed on the first metal thin film Etching steps and forming the first insulating layer twenty two Between steps.
  • the above embodiment specifically includes: in the first insulating layer twenty two Forming a second metal layer twenty three
  • the step specifically includes the first insulating layer twenty two Forming a second metal film on the second metal film, sequentially exposing, developing and etching the second metal film to obtain the second metal layer twenty three ;
  • the second optical detection is performed between the steps of developing the second metal thin film and etching the second metal thin film; the third optical detection is performed on the second metal thin film Steps for etching and passivation layer formation twenty four Between the steps of the second electrical detection in the step of etching the second metal film and forming a passivation layer twenty four Between steps.
  • optical detection is specifically: shooting a conductive pattern through a camera 20 Images on multiple areas;
  • the electrical detection is specifically directed to the conductive pattern 20 Input an electrical signal to obtain the electrical signal in the conductive pattern 20 The transfer status in.
  • the first optical detection is to take images of a plurality of areas of the first metal thin film before etching after development, and the first electrical detection is to apply to the first metal layer
  • Each first metal layer (gate line) applies an electrical signal to obtain the transmission state of the electrical signal in the first metal layer (gate line).
  • the second optical detection is to photograph the second metal film in development Images of multiple areas before post-etching
  • the third optical inspection is to capture images of multiple areas of the second metal layer
  • the second electrical inspection is to apply to the second metal layer (source line) Applying an electrical signal to obtain the transmission state of the electrical signal in the second metal layer (source line)
  • the third electrical detection is to simultaneously apply the electrical signal to the first metal layer and the second metal layer To obtain the transmission state of the electrical signal in the first metal layer (gate line) and the second metal layer (source line).
  • the combination of the optical detection result and the electrical detection result is used to determine the conductive pattern 20
  • the location of the defect point on the specific is:
  • the specific position of the defect point in the poor transmission area is obtained according to the image of the poor transmission area captured by optical detection.
  • the defect point is specifically the conductive pattern 20 The point where a short circuit or open circuit occurs.
  • the optically detected image of the area where the gate line or source line is located to determine the The specific location of the open circuit or short circuit in the pole line or source line for repair.
  • the invention determines the position of the defect point through the combination of the optical detection result and the electrical detection result. Compared with performing a single optical detection, the invention eliminates the misjudgment and the error caused by the optical detection error during the single optical detection. Compared with the single electrical detection, the problem of missed fault points and fault repair and leak repair can accurately locate the position of the defect point through optical detection, thereby improving the efficiency and accuracy of defect point search and improving the defect point. Repair success rate.
  • the present invention provides a repair method in the manufacturing process of an array substrate, including the following steps: forming a conductive pattern on the substrate; performing optical detection and electrical detection on the conductive pattern; using optical detection results and electrical properties The combination of the detection results determines the position of the defect point on the conductive pattern, and repairs the defect point.
  • the position of the defect point is determined by combining the optical detection result and the electrical detection result, which can improve the accuracy of the defect point search And success rate, to improve the success rate of defect repair.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

A repairing method in the manufacturing process for an array substrate, comprising the following steps: forming a conductive pattern on a substrate; performing optical inspection and electrical inspection on the conductive pattern; and determining the positions of defect points on the conductive pattern by combining the optical inspection result with the electrical inspection result, and repairing the defect points. The positions of defect points are determined by combining the optical inspection result with the electrical inspection result, thereby increasing the accuracy and success rate of defect point searching, and improving the success rate of defect point repair.

Description

阵列基板制作过程中的修补方法Repairing method in manufacturing process of array substrate 技术领域Technical field
本发明涉及显示技术领域，尤其涉及一种阵列基板制作过程中的修补方法。The present invention relates to the field of display technology, and in particular to a repair method in the manufacturing process of an array substrate.
背景技术Background technique
随着显示技术的发展，液晶显示器（Liquid Crystal Display，LCD）等平面显示装置因具有高画质、省电、机身薄及应用范围广等优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。With the development of display technology, liquid crystal displays (Liquid Crystal Display, LCD) and other flat display devices have been widely used in mobile phones, TVs, and individuals due to their advantages of high image quality, power saving, thin body, and wide range of applications. Various consumer electronic products such as digital assistants, digital cameras, notebook computers, and desktop computers have become the mainstream in display devices.
现有市场上的液晶显示装置大部分为背光型液晶显示器，其包括液晶显示面板及背光模组（backlight module）。液晶显示面板的工作原理是在两片平行的玻璃基板当中放置液晶分子，两片玻璃基板中间有许多垂直和水平的细小电线，通过通电与否来控制液晶分子改变方向，将背光模组的光线折射出来产生画面。Most of the liquid crystal display devices on the existing market are backlight type liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is to place liquid crystal molecules in two parallel glass substrates. There are many vertical and horizontal small wires between the two glass substrates. The liquid crystal molecules can be controlled to change the direction by turning on or off, and the backlight module light Refracted to produce a picture.
通常液晶显示面板由彩膜基板（CF，Color Filter）、薄膜晶体管基板（TFT，Thin Film Transistor)、夹于彩膜基板与薄膜晶体管基板之间的液晶（LC，Liquid Crystal）及密封胶框（Sealant）组成，其成型工艺一般包括：前段阵列（Array）制程（薄膜、黄光、蚀刻及剥膜）、中段成盒（Cell）制程（TFT基板与CF基板贴合）及后段模组组装制程（驱动IC与印刷电路板压合）。其中，前段Array制程主要是形成TFT基板，以便于控制液晶分子的运动；中段Cell制程主要是在TFT基板与CF基板之间添加液晶；后段模组组装制程主要是驱动IC压合与印刷电路板的整合，进而驱动液晶分子转动，显示图像。Generally, a liquid crystal display panel is composed of a color filter substrate (CF, Color Filter) and a thin film transistor substrate (TFT, Thin Film) Transistor), liquid crystal (LC, Liquid Crystal) and sealant frame (Sealant) sandwiched between the color film substrate and the thin film transistor substrate, the molding process generally includes: the front-end array (Array) process (film, yellow light, etching And film stripping), the middle cell (Cell) process (the TFT substrate is bonded to the CF substrate) and the rear stage module assembly process (the driver IC is pressed to the printed circuit board). Among them, the front stage Array process is mainly to form a TFT substrate to facilitate the control of the movement of liquid crystal molecules; the middle stage Cell process is mainly to add liquid crystal between the TFT substrate and the CF substrate; the rear stage module assembly process is mainly to drive the IC pressing and printed circuit The integration of the board then drives the liquid crystal molecules to rotate and display images.
其中，阵列制程是液晶显示面板制作的关键制程，其包括形成各个信号线的制程，在各个信号线的制程过程中可能因各种原因而出现线缺陷（信号线短路或断路），现有阵列制程的电性检查中，部分线缺陷无法准确的通过电性检测定位，操作员无法进行缺陷修补导致产品报废，与此同时，在现有阵列制程中还设有光学检查，光学检查与电性检查相互独立，主要通过拍摄基板上多个区域的图像，来判断制程是否存在缺陷，但光学检查主要通过拍摄的图像来进行缺陷判断，无法准确知晓该缺陷是否会影响产品品质而需要修复的缺陷，因此容易出现错杀，并且光学检查时仅会拍摄基板上部分区域的图像，此时，未拍摄到区域中缺陷点就无法被检出，因此还会出现漏杀。Among them, the array process is a key process for the manufacture of liquid crystal display panels, which includes the process of forming each signal line. In the process of each signal line, line defects (short or open circuit of the signal line) may occur due to various reasons. The existing array In the electrical inspection of the process, some line defects cannot be accurately positioned through electrical inspection, and the operator cannot repair the defects and lead to product scrapping. At the same time, there are also optical inspection, optical inspection and electrical properties in the existing array process Inspections are independent of each other, mainly by taking images of multiple areas on the substrate to determine whether the process is defective, but optical inspections are mainly based on the images taken to determine defects, and it is impossible to accurately know whether the defect will affect product quality and need to be repaired. Therefore, it is prone to wrong killing, and only images of part of the area on the substrate will be taken during optical inspection. At this time, the defect points in the area cannot be detected, so there will be missed killing.
技术问题technical problem
本发明的目的在于提供阵列基板制作过程中的修补方法，能够提升缺陷点查找的准确率和成功率，改善缺陷点的修补成功率。The purpose of the present invention is to provide a repair method in the manufacturing process of an array substrate, which can improve the accuracy and success rate of defect point search and improve the repair success rate of defect points.
技术解决方案Technical solution
为实现上述目的，本发明提供一种阵列基板制作过程中的修补方法，包括如下步骤：In order to achieve the above object, the present invention provides a repair method in the manufacturing process of an array substrate, including the following steps:
在基板上形成导电图案； Forming conductive patterns on the substrate;
对所述导电图案进行光学检测和电性检测；Performing optical detection and electrical detection on the conductive pattern;
利用光学检测结果与电性检测结果的结合，确定所述导电图案上的缺陷点的位置，并对所述缺陷点进行修复。Using the combination of the optical detection result and the electrical detection result, the position of the defect point on the conductive pattern is determined, and the defect point is repaired.
所述的阵列基板制作过程中的修补方法具体包括如下步骤： The repair method in the manufacturing process of the array substrate specifically includes the following steps:
在所述基板上形成第一金属层，并在形成所述第一金属层的过程中进行第一次光学检测和第一次电性检测，根据第一次光学检测结果和第一次电性检测结果确定第一金属层上的缺陷点的位置，并对第一金属层进行修复；Forming a first metal layer on the substrate, and performing the first optical detection and the first electrical detection during the formation of the first metal layer, based on the results of the first optical detection and the first electrical detection The detection result determines the position of the defect point on the first metal layer, and repairs the first metal layer;
在所述第一金属层上形成第一绝缘层；Forming a first insulating layer on the first metal layer;
在所述第一绝缘层上形成第二金属层，在形成所述第二金属层的过程中进行第二次光学检测、第三次光学检测及第二次电性检测，根据第二次光学检测结果、第三次光学检测结果及第二次电性检测结果确定第二金属层上的缺陷点的位置，并对第二金属层进行第一次修复；Forming a second metal layer on the first insulating layer, performing a second optical inspection, a third optical inspection, and a second electrical inspection during the formation of the second metal layer, according to the second optical The detection result, the third optical detection result and the second electrical detection result determine the position of the defect point on the second metal layer, and perform the first repair on the second metal layer;
在所述第二金属层上形成钝化层；Forming a passivation layer on the second metal layer;
在所述钝化层形成所述透明导电层，所述第一金属层、第二金属层及透明导电层共同构成所述导电图案；Forming the transparent conductive layer on the passivation layer, the first metal layer, the second metal layer, and the transparent conductive layer together constitute the conductive pattern;
进行第三次电性检测，根据第二次光学检测结果、第三次光学检测结果及第三次电性检测结果再次确定第二金属层上的缺陷点的位置，并对第二金属层进行第二次修复。Perform the third electrical test, and determine the position of the defect point on the second metal layer again based on the second optical test result, the third optical test result, and the third electrical test result. The second repair.
所述在所述基板上形成第一金属层的步骤具体包括：在所述基板上形成第一金属薄膜，对所述第一金属薄膜依次进行曝光、显影及蚀刻，得到所述第一金属层；The step of forming a first metal layer on the substrate specifically includes: forming a first metal thin film on the substrate, sequentially exposing, developing, and etching the first metal thin film to obtain the first metal layer ;
所述第一次光学检测在对所述第一金属薄膜进行显影和对所述第一金属薄膜进行蚀刻的步骤之间进行；The first optical detection is performed between the steps of developing the first metal thin film and etching the first metal thin film;
所述第一次电性检测在对所述第一金属薄膜进行蚀刻的步骤以及形成第一绝缘层的步骤之间进行。The first electrical detection is performed between the step of etching the first metal thin film and the step of forming the first insulating layer.
所述在所述第一绝缘层上形成第二金属层的步骤具体包括：在所述第一绝缘层上形成第二金属薄膜，对所述第二金属薄膜依次进行曝光、显影及蚀刻，得到所述第二金属层；The step of forming a second metal layer on the first insulating layer specifically includes: forming a second metal film on the first insulating layer, and sequentially exposing, developing, and etching the second metal film to obtain The second metal layer;
所述第二次光学检测在对所述第二金属薄膜进行显影和对所述第二金属薄膜进行蚀刻的步骤之间进行；The second optical inspection is performed between the steps of developing the second metal thin film and etching the second metal thin film;
所述第三次光学检测在对所述第二金属薄膜进行蚀刻的步骤以及形成钝化层的步骤之间进行；The third optical inspection is performed between the step of etching the second metal thin film and the step of forming a passivation layer;
所述第二次电性检测在对所述第二金属薄膜进行蚀刻的步骤以及形成钝化层的步骤之间进行。The second electrical detection is performed between the step of etching the second metal thin film and the step of forming a passivation layer.
所述光学检测具体为：通过相机拍摄导电图案上多个区域的图像；The optical detection specifically includes: taking images of multiple areas on the conductive pattern through a camera;
所述电性检测具体为：向所述导电图案输入电信号，获取所述电信号在所述导电图案中的传输状态。The electrical detection specifically includes: inputting an electrical signal to the conductive pattern, and acquiring a transmission state of the electrical signal in the conductive pattern.
所述利用所述光学检测结果与电性检测结果的结合，确定所述导电图案上的缺陷点的位置具体为：The combination of the optical detection result and the electrical detection result to determine the position of the defect point on the conductive pattern is specifically:
根据所述电信号在所述导电图案中的传输状态判断得到导电图案出现传输不良的区域；Judging according to the transmission state of the electrical signal in the conductive pattern that the conductive pattern has a poor transmission area;
根据光学检测拍摄到的该传输不良的区域的图像获取该传输不良的区域中缺陷点的具***置。The specific position of the defect point in the poor transmission area is obtained according to the image of the poor transmission area captured by optical detection.
所述缺陷点具体为所述导电图案中出现短路的点。The defect point is specifically a point where a short circuit occurs in the conductive pattern.
所述缺陷点具体为所述导电图案中出现断路的点。The defect point is specifically a point where a disconnection occurs in the conductive pattern.
所述在所述第一绝缘层上形成第二金属层的步骤和在所述第一绝缘层上形成第二金属层的步骤之间还包括在所述第二金属层和钝化层之间形成色阻层的步骤。The step of forming a second metal layer on the first insulating layer and the step of forming a second metal layer on the first insulating layer further include between the second metal layer and the passivation layer The step of forming the color resist layer.
本发明还提供一种阵列基板制作过程中的修补方法，包括如下步骤：The invention also provides a repair method in the manufacturing process of the array substrate, including the following steps:
在所述基板上形成第一金属层，并在形成所述第一金属层的过程中进行第一次光学检测和第一次电性检测，根据第一次光学检测结果和第一次电性检测结果确定第一金属层上的缺陷点的位置，并对第一金属层进行修复；Forming a first metal layer on the substrate, and performing the first optical detection and the first electrical detection during the formation of the first metal layer, based on the results of the first optical detection and the first electrical detection The detection result determines the position of the defect point on the first metal layer, and repairs the first metal layer;
在所述第一金属层上形成第一绝缘层；Forming a first insulating layer on the first metal layer;
在所述第一绝缘层上形成第二金属层，在形成所述第二金属层的过程中进行第二次光学检测、第三次光学检测及第二次电性检测，根据第二次光学检测结果、第三次光学检测结果及第二次电性检测结果确定第二金属层上的缺陷点的位置，并对第二金属层进行第一次修复；Forming a second metal layer on the first insulating layer, performing a second optical inspection, a third optical inspection, and a second electrical inspection during the formation of the second metal layer, according to the second optical The detection result, the third optical detection result and the second electrical detection result determine the position of the defect point on the second metal layer, and perform the first repair on the second metal layer;
在所述第二金属层上形成钝化层；Forming a passivation layer on the second metal layer;
在所述钝化层形成所述透明导电层，所述第一金属层、第二金属层及透明导电层共同构成所述导电图案；Forming the transparent conductive layer on the passivation layer, the first metal layer, the second metal layer, and the transparent conductive layer together constitute the conductive pattern;
进行第三次电性检测，根据第二次光学检测结果、第三次光学检测结果及第三次电性检测结果再次确定第二金属层上的缺陷点的位置，并对第二金属层进行第二次修复；Perform the third electrical test, and determine the position of the defect point on the second metal layer again based on the second optical test result, the third optical test result, and the third electrical test result. The second repair;
所述光学检测具体为：通过相机拍摄导电图案上多个区域的图像；The optical detection specifically includes: taking images of multiple areas on the conductive pattern through a camera;
所述电性检测具体为：向所述导电图案输入电信号，获取所述电信号在所述导电图案中的传输状态。The electrical detection specifically includes: inputting an electrical signal to the conductive pattern, and acquiring a transmission state of the electrical signal in the conductive pattern.
有益效果Beneficial effect
本发明的有益效果：本发明提供一种阵列基板制作过程中的修补方法，包括如下步骤：在基板上形成导电图案；对所述导电图案进行光学检测和电性检测；利用光学检测结果与电性检测结果的结合，确定所述导电图案上的缺陷点的位置，并对所述缺陷点进行修复，通过光学检测结果与电性检测结果结合确定缺陷点的位置，能够提升缺陷点查找的准确率和成功率，改善缺陷点的修补成功率。Beneficial effect of the present invention: The present invention provides a repair method in the manufacturing process of an array substrate, including the following steps: forming a conductive pattern on the substrate; optically and electrically detecting the conductive pattern; using optical detection results and electricity The combination of the results of the property test to determine the location of the defect point on the conductive pattern and to repair the defect point. The position of the defect point is determined by the combination of the optical test result and the electrical test result, which can improve the accuracy of the defect point search Rate and success rate, to improve the success rate of defect repair.
附图说明BRIEF DESCRIPTION
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and explanation only, and are not intended to limit the present invention.
附图中，In the drawings,
图1为本发明阵列基板制作过程中的修补方法中的阵列基板的结构图；FIG. 1 is a structural diagram of an array substrate in a repair method in an array substrate manufacturing process of the present invention;
图2为本发明的阵列基板制作过程中的修补方法的流程图。FIG. 2 is a flowchart of a repair method in the manufacturing process of the array substrate of the present invention.
本发明的实施方式Embodiments of the invention
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。In order to further elaborate on the technical means adopted by the present invention and its effects, the following will be described in detail with reference to the preferred embodiments of the present invention and the accompanying drawings.
请参阅图Please refer to the picture 11 至图To figure 22 ，本发明提供一种阵列基板制作过程中的修补方法，包括如下步骤：The present invention provides a repair method in the manufacturing process of an array substrate, including the following steps:
在基板On the substrate 1010 上形成导电图案Conductive pattern 2020 ；;
对所述导电图案For the conductive pattern 2020 进行光学检测和电性检测；Perform optical and electrical testing;
利用光学检测结果与电性检测结果的结合，确定所述导电图案Using a combination of optical detection results and electrical detection results to determine the conductive pattern 2020 上的缺陷点的位置，并对所述缺陷点进行修复。The position of the defect point on the computer, and repair the defect point.
进一步地，在本发明的优选实施例中，阵列基板制作过程中的修补方法具体包括：Further, in a preferred embodiment of the present invention, the repair method in the manufacturing process of the array substrate specifically includes:
在所述基板On the substrate 1010 上形成第一金属层Forming a first metal layer 21twenty one ，并在形成所述第一金属层And forming the first metal layer 21twenty one 的过程中进行第一次光学检测和第一次电性检测，根据第一次光学检测结果和第一次电性检测结果确定第一金属层During the process, the first optical detection and the first electrical detection are performed, and the first metal layer is determined according to the results of the first optical detection and the first electrical detection 21twenty one 上的缺陷点的位置，并对第一金属层The location of the defect point on the first metal layer 21twenty one 进行修复；Make repairs;
在所述第一金属层In the first metal layer 21twenty one 上形成第一绝缘层Forming a first insulating layer 22twenty two ；;
在所述第一绝缘层In the first insulating layer 22twenty two 上形成第二金属层Forming a second metal layer 23twenty three ，在形成所述第二金属层, In forming the second metal layer 23twenty three 的过程中进行第二次光学检测、第三次光学检测及第二次电性检测，根据第二次光学检测结果、第三次光学检测结果及第二次电性检测结果确定第二金属层During the process, the second optical inspection, the third optical inspection and the second electrical inspection are performed, and the second metal layer is determined according to the second optical inspection results, the third optical inspection results and the second electrical inspection results 23twenty three 上的缺陷点的位置，并对第二金属层The location of the defect point on the second metal layer 23twenty three 进行第一次修复；Carry out the first repair;
在所述第二金属层In the second metal layer 22twenty two 上形成钝化层Passivation layer 24twenty four ；;
在所述钝化层In the passivation layer 24twenty four 形成所述透明导电层Forming the transparent conductive layer 2525 ，所述第一金属层, The first metal layer 21twenty one 、第二金属层, The second metal layer 23twenty three 及透明导电层And transparent conductive layer 2525 共同构成所述导电图案Together constitute the conductive pattern 2020 ；;
进行第三次电性检测，根据第二次光学检测结果、第三次光学检测结果及第三次电性检测结果再次确定第二金属层Conduct the third electrical test and determine the second metal layer again based on the second optical test results, the third optical test results, and the third electrical test results 23twenty three 上的缺陷点的位置，并对第二金属层The location of the defect point on the second metal layer 23twenty three 进行第二次修复。Perform a second repair.
其中，所述第一金属层Among them, the first metal layer 21twenty one 包括栅极、与所述栅极电性连接的栅极线，所述第二金属层Including a gate, a gate line electrically connected to the gate, and the second metal layer 23twenty three 包括源极、漏极及与源极电性连接的源极线，所述透明导电层Including a source electrode, a drain electrode and a source line electrically connected to the source electrode, the transparent conductive layer 2525 包括像素电极，所述像素电极通过穿越所述钝化层Including a pixel electrode, the pixel electrode passes through the passivation layer 24twenty four 的过孔与所述漏极电性连接。Is electrically connected to the drain.
进一步地，当所述阵列基板为彩膜阵列集成（Further, when the array substrate is a color film array integrated ( Color filter on arrayColor filter on array ，, COACOA ）基板时，所述步骤) Substrate, the steps S13S13 和步骤And steps S14S14 之间还包括在所述第二金属层Between the second metal layer 23twenty three 和钝化层And passivation layer 24twenty four 之间形成色阻层Color resist layer 2626 的步骤，所述色阻层The steps of the color resist layer 2626 包括多个不同颜色的色阻块。Including multiple color blocks of different colors.
具体地，在上述实施例中，在所述基板Specifically, in the above embodiment, the substrate 1010 上形成第一金属层Forming a first metal layer 21twenty one 的步骤具体包括：在所述基板The steps include: the substrate 1010 上形成第一金属薄膜，对所述第一金属薄膜依次进行曝光、显影及蚀刻，得到所述第一金属层Forming a first metal film on the first metal film, sequentially exposing, developing and etching the first metal film to obtain the first metal layer 21twenty one ；;
其中，所述第一次光学检测在对所述第一金属薄膜进行显影和对所述第一金属薄膜进行蚀刻的步骤之间进行，第一次电性检测在对所述第一金属薄膜进行蚀刻的步骤以及形成第一绝缘层Wherein, the first optical detection is performed between the steps of developing the first metal thin film and etching the first metal thin film, and the first electrical detection is performed on the first metal thin film Etching steps and forming the first insulating layer 22twenty two 的步骤之间进行。Between steps.
具体地，在上述实施例中，具体包括：在所述第一绝缘层Specifically, in the above embodiment, it specifically includes: in the first insulating layer 22twenty two 上形成第二金属层Forming a second metal layer 23twenty three 的步骤具体包括在所述第一绝缘层The step specifically includes the first insulating layer 22twenty two 上形成第二金属薄膜，对所述第二金属薄膜依次进行曝光、显影及蚀刻，得到所述第二金属层Forming a second metal film on the second metal film, sequentially exposing, developing and etching the second metal film to obtain the second metal layer 23twenty three ；;
其中，所述第二次光学检测在对所述第二金属薄膜进行显影和对所述第二金属薄膜进行蚀刻的步骤之间进行；所述第三次光学检测在对所述第二金属薄膜进行蚀刻的步骤以及形成钝化层Wherein, the second optical detection is performed between the steps of developing the second metal thin film and etching the second metal thin film; the third optical detection is performed on the second metal thin film Steps for etching and passivation layer formation 24twenty four 的步骤之间进行，所述第二次电性检测在对所述第二金属薄膜进行蚀刻的步骤以及形成钝化层Between the steps of the second electrical detection in the step of etching the second metal film and forming a passivation layer 24twenty four 的步骤之间进行。Between steps.
需要说明的是，所述光学检测具体为：通过相机拍摄导电图案It should be noted that the optical detection is specifically: shooting a conductive pattern through a camera 2020 上多个区域的图像；Images on multiple areas;
所述电性检测具体为：向所述导电图案The electrical detection is specifically directed to the conductive pattern 2020 输入电信号，获取所述电信号在所述导电图案Input an electrical signal to obtain the electrical signal in the conductive pattern 2020 中的传输状态。The transfer status in.
进一步地，在上述实施例中，所述第一次光学检测即为拍摄所述第一金属薄膜在显影后蚀刻前的多个区域的图像，第一电性检测即为向第一金属层上各个第一金属层（栅极线）施加电信号，获取所述电信号在第一金属层（栅极线）中的传输状态，第二次光学检测即为拍摄所述第二金属薄膜在显影后蚀刻前的多个区域的图像，第三次光学检测即为拍摄所述第二金属层的多个区域的图像，第二次电性检测即为向第二金属层（源极线）上施加电信号，获取所述电信号在第二金属层（源极线）中的传输状态，所述第三次电性检测即为向所述第一金属层和第二金属层同时施加电信号，获取所述电信号在第一金属层（栅极线）和第二金属层（源极线）中的传输状态。Further, in the above embodiment, the first optical detection is to take images of a plurality of areas of the first metal thin film before etching after development, and the first electrical detection is to apply to the first metal layer Each first metal layer (gate line) applies an electrical signal to obtain the transmission state of the electrical signal in the first metal layer (gate line). The second optical detection is to photograph the second metal film in development Images of multiple areas before post-etching, the third optical inspection is to capture images of multiple areas of the second metal layer, and the second electrical inspection is to apply to the second metal layer (source line) Applying an electrical signal to obtain the transmission state of the electrical signal in the second metal layer (source line), and the third electrical detection is to simultaneously apply the electrical signal to the first metal layer and the second metal layer To obtain the transmission state of the electrical signal in the first metal layer (gate line) and the second metal layer (source line).
进一步地，所述利用所述光学检测结果与电性检测结果的结合，确定所述导电图案Further, the combination of the optical detection result and the electrical detection result is used to determine the conductive pattern 2020 上的缺陷点的位置具体为：The location of the defect point on the specific is:
根据所述电信号在所述导电图案According to the electrical signal in the conductive pattern 2020 中的传输状态判断得到导电图案Judgment of the transmission state in the conductive pattern 2020 出现传输不良的区域；Areas with poor transmission;
根据光学检测拍摄到的该传输不良的区域的图像获取该传输不良的区域中缺陷点的具***置。The specific position of the defect point in the poor transmission area is obtained according to the image of the poor transmission area captured by optical detection.
具体地，所述缺陷点具体为所述导电图案Specifically, the defect point is specifically the conductive pattern 2020 中出现短路或断路的点。The point where a short circuit or open circuit occurs.
举例来说，当电信号在一条栅极线或源极线中传输状态呈现断路或短路状态时，则通过光学检测拍摄到的该栅极线或源极线所在的区域的图像，确定该栅极线或源极线中出现断路或短路的具***置，以进行修复。For example, when the transmission state of the electrical signal in a gate line or source line shows an open circuit or a short circuit state, then the optically detected image of the area where the gate line or source line is located to determine the The specific location of the open circuit or short circuit in the pole line or source line for repair.
本发明通过光学检测结果与电性检测结果结合确定缺陷点的位置，相比于进行单一的光学检测，本发明通过电性检测排除了在单一光学检测时，由于光学检测误差导致的错判和漏判缺陷点及错修复和漏修复的问题，相比于单一的电性检测，本发明能够通过光学检测准确定位缺陷点的位置，从而提升缺陷点查找的效率和准确率，改善缺陷点的修补成功率。The invention determines the position of the defect point through the combination of the optical detection result and the electrical detection result. Compared with performing a single optical detection, the invention eliminates the misjudgment and the error caused by the optical detection error during the single optical detection. Compared with the single electrical detection, the problem of missed fault points and fault repair and leak repair can accurately locate the position of the defect point through optical detection, thereby improving the efficiency and accuracy of defect point search and improving the defect point. Repair success rate.
综上所述，本发明提供一种阵列基板制作过程中的修补方法，包括如下步骤：在基板上形成导电图案；对所述导电图案进行光学检测和电性检测；利用光学检测结果与电性检测结果的结合，确定所述导电图案上的缺陷点的位置，并对所述缺陷点进行修复，通过光学检测结果与电性检测结果结合确定缺陷点的位置，能够提升缺陷点查找的准确率和成功率，改善缺陷点的修补成功率。In summary, the present invention provides a repair method in the manufacturing process of an array substrate, including the following steps: forming a conductive pattern on the substrate; performing optical detection and electrical detection on the conductive pattern; using optical detection results and electrical properties The combination of the detection results determines the position of the defect point on the conductive pattern, and repairs the defect point. The position of the defect point is determined by combining the optical detection result and the electrical detection result, which can improve the accuracy of the defect point search And success rate, to improve the success rate of defect repair.
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。As mentioned above, those of ordinary skill in the art can make various other corresponding changes and modifications according to the technical solutions and technical concepts of the present invention, and all such changes and modifications should fall within the protection scope of the claims of the present invention. .

Claims (15)

  1. 一种阵列基板制作过程中的修补方法，包括如下步骤：A repair method in the manufacturing process of an array substrate includes the following steps:
    在基板上形成导电图案； Forming conductive patterns on the substrate;
    对所述导电图案进行光学检测和电性检测；Performing optical detection and electrical detection on the conductive pattern;
    利用光学检测结果与电性检测结果的结合，确定所述导电图案上的缺陷点的位置，并对所述缺陷点进行修复。Using the combination of the optical detection result and the electrical detection result, the position of the defect point on the conductive pattern is determined, and the defect point is repaired.
  2. 如权利要求1所述的阵列基板制作过程中的修补方法，，具体包括如下步骤： The repair method in the manufacturing process of the array substrate according to claim 1, which specifically includes the following steps:
    在所述基板上形成第一金属层，并在形成所述第一金属层的过程中进行第一次光学检测和第一次电性检测，根据第一次光学检测结果和第一次电性检测结果确定第一金属层上的缺陷点的位置，并对第一金属层进行修复；Forming a first metal layer on the substrate, and performing the first optical detection and the first electrical detection during the formation of the first metal layer, based on the results of the first optical detection and the first electrical detection The detection result determines the position of the defect point on the first metal layer, and repairs the first metal layer;
    在所述第一金属层上形成第一绝缘层；Forming a first insulating layer on the first metal layer;
    在所述第一绝缘层上形成第二金属层，在形成所述第二金属层的过程中进行第二次光学检测、第三次光学检测及第二次电性检测，根据第二次光学检测结果、第三次光学检测结果及第二次电性检测结果确定第二金属层上的缺陷点的位置，并对第二金属层进行第一次修复；Forming a second metal layer on the first insulating layer, performing a second optical inspection, a third optical inspection, and a second electrical inspection during the formation of the second metal layer, according to the second optical The detection result, the third optical detection result and the second electrical detection result determine the position of the defect point on the second metal layer, and perform the first repair on the second metal layer;
    在所述第二金属层上形成钝化层；Forming a passivation layer on the second metal layer;
    在所述钝化层形成所述透明导电层，所述第一金属层、第二金属层及透明导电层共同构成所述导电图案；Forming the transparent conductive layer on the passivation layer, the first metal layer, the second metal layer, and the transparent conductive layer together constitute the conductive pattern;
    进行第三次电性检测，根据第二次光学检测结果、第三次光学检测结果及第三次电性检测结果再次确定第二金属层上的缺陷点的位置，并对第二金属层进行第二次修复。Perform the third electrical test, and determine the position of the defect point on the second metal layer again based on the second optical test result, the third optical test result, and the third electrical test result. The second repair.
  3. 如权利要求2所述的阵列基板制作过程中的修补方法，其中，所述在所述基板上形成第一金属层的步骤具体包括：在所述基板上形成第一金属薄膜，对所述第一金属薄膜依次进行曝光、显影及蚀刻，得到所述第一金属层；The method for repairing an array substrate according to claim 2, wherein the step of forming a first metal layer on the substrate specifically includes: forming a first metal thin film on the substrate A metal thin film is sequentially exposed, developed and etched to obtain the first metal layer;
    所述第一次光学检测在对所述第一金属薄膜进行显影和对所述第一金属薄膜进行蚀刻的步骤之间进行；The first optical detection is performed between the steps of developing the first metal thin film and etching the first metal thin film;
    所述第一次电性检测在对所述第一金属薄膜进行蚀刻的步骤以及形成第一绝缘层的步骤之间进行。The first electrical detection is performed between the step of etching the first metal thin film and the step of forming the first insulating layer.
  4. 如权利要求2所述的阵列基板制作过程中的修补方法，其中，所述在所述第一绝缘层上形成第二金属层的步骤具体包括：在所述第一绝缘层上形成第二金属薄膜，对所述第二金属薄膜依次进行曝光、显影及蚀刻，得到所述第二金属层；The method for repairing an array substrate according to claim 2, wherein the step of forming a second metal layer on the first insulating layer specifically includes: forming a second metal on the first insulating layer A thin film, sequentially exposing, developing and etching the second metal thin film to obtain the second metal layer;
    所述第二次光学检测在对所述第二金属薄膜进行显影和对所述第二金属薄膜进行蚀刻的步骤之间进行；The second optical inspection is performed between the steps of developing the second metal thin film and etching the second metal thin film;
    所述第三次光学检测在对所述第二金属薄膜进行蚀刻的步骤以及形成钝化层的步骤之间进行；The third optical inspection is performed between the step of etching the second metal thin film and the step of forming a passivation layer;
    所述第二次电性检测在对所述第二金属薄膜进行蚀刻的步骤以及形成钝化层的步骤之间进行。The second electrical detection is performed between the step of etching the second metal thin film and the step of forming a passivation layer.
  5. 如权利要求1所述的阵列基板制作过程中的修补方法，其中，所述光学检测具体为：通过相机拍摄导电图案上多个区域的图像；The repair method in the manufacturing process of the array substrate according to claim 1, wherein the optical detection specifically comprises: taking images of multiple areas on the conductive pattern through a camera;
    所述电性检测具体为：向所述导电图案输入电信号，获取所述电信号在所述导电图案中的传输状态。The electrical detection specifically includes: inputting an electrical signal to the conductive pattern, and acquiring a transmission state of the electrical signal in the conductive pattern.
  6. 如权利要求5所述的阵列基板制作过程中的修补方法，其中，所述利用所述光学检测结果与电性检测结果的结合，确定所述导电图案上的缺陷点的位置具体为：The method for repairing an array substrate according to claim 5, wherein the combination of the optical detection result and the electrical detection result to determine the position of the defect point on the conductive pattern is specifically:
    根据所述电信号在所述导电图案中的传输状态判断得到导电图案出现传输不良的区域；Judging according to the transmission state of the electrical signal in the conductive pattern that the conductive pattern has a poor transmission area;
    根据光学检测拍摄到的该传输不良的区域的图像获取该传输不良的区域中缺陷点的具***置。The specific position of the defect point in the poor transmission area is obtained according to the image of the poor transmission area captured by optical detection.
  7. 如权利要求1所述的阵列基板制作过程中的修补方法，其中，所述缺陷点具体为所述导电图案中出现短路的点。The method for repairing an array substrate according to claim 1, wherein the defect point is specifically a point where a short circuit occurs in the conductive pattern.
  8. 如权利要求1所述的阵列基板制作过程中的修补方法，其中，所述缺陷点具体为所述导电图案中出现断路的点。The repair method in the manufacturing process of the array substrate according to claim 1, wherein the defect point is specifically a point where a disconnection occurs in the conductive pattern.
  9. 如权利要求2所述的阵列基板制作过程中的修补方法，其中，所述在所述第一绝缘层上形成第二金属层的步骤和在所述第一绝缘层上形成第二金属层的步骤之间还包括在所述第二金属层和钝化层之间形成色阻层的步骤。The repair method in the manufacturing process of the array substrate according to claim 2, wherein the step of forming a second metal layer on the first insulating layer and The step further includes the step of forming a color resist layer between the second metal layer and the passivation layer.
  10. 一种阵列基板制作过程中的修补方法，包括如下步骤：A repair method in the manufacturing process of an array substrate includes the following steps:
    在所述基板上形成第一金属层，并在形成所述第一金属层的过程中进行第一次光学检测和第一次电性检测，根据第一次光学检测结果和第一次电性检测结果确定第一金属层上的缺陷点的位置，并对第一金属层进行修复；Forming a first metal layer on the substrate, and performing the first optical detection and the first electrical detection during the formation of the first metal layer, based on the results of the first optical detection and the first electrical detection The detection result determines the position of the defect point on the first metal layer, and repairs the first metal layer;
    在所述第一金属层上形成第一绝缘层；Forming a first insulating layer on the first metal layer;
    在所述第一绝缘层上形成第二金属层，在形成所述第二金属层的过程中进行第二次光学检测、第三次光学检测及第二次电性检测，根据第二次光学检测结果、第三次光学检测结果及第二次电性检测结果确定第二金属层上的缺陷点的位置，并对第二金属层进行第一次修复；Forming a second metal layer on the first insulating layer, performing a second optical inspection, a third optical inspection, and a second electrical inspection during the formation of the second metal layer, according to the second optical The detection result, the third optical detection result and the second electrical detection result determine the position of the defect point on the second metal layer, and perform the first repair on the second metal layer;
    在所述第二金属层上形成钝化层；Forming a passivation layer on the second metal layer;
    在所述钝化层形成所述透明导电层，所述第一金属层、第二金属层及透明导电层共同构成所述导电图案；Forming the transparent conductive layer on the passivation layer, the first metal layer, the second metal layer, and the transparent conductive layer together constitute the conductive pattern;
    进行第三次电性检测，根据第二次光学检测结果、第三次光学检测结果及第三次电性检测结果再次确定第二金属层上的缺陷点的位置，并对第二金属层进行第二次修复；Perform the third electrical test, and determine the position of the defect point on the second metal layer again based on the second optical test result, the third optical test result, and the third electrical test result. The second repair;
    其中，所述光学检测具体为：通过相机拍摄导电图案上多个区域的图像；Wherein, the optical detection is specifically: taking images of multiple areas on the conductive pattern through a camera;
    所述电性检测具体为：向所述导电图案输入电信号，获取所述电信号在所述导电图案中的传输状态。The electrical detection specifically includes: inputting an electrical signal to the conductive pattern, and acquiring a transmission state of the electrical signal in the conductive pattern.
  11. 如权利要求10As claimed in claim 10 所述的阵列基板制作过程中的修补方法，其中，所述在所述基板上形成第一金属层的步骤具体包括：在所述基板上形成第一金属薄膜，对所述第一金属薄膜依次进行曝光、显影及蚀刻，得到所述第一金属层；In the method for repairing an array substrate, the step of forming a first metal layer on the substrate specifically includes: forming a first metal film on the substrate, and sequentially placing the first metal film on the substrate Performing exposure, development and etching to obtain the first metal layer;
    所述第一次光学检测在对所述第一金属薄膜进行显影和对所述第一金属薄膜进行蚀刻的步骤之间进行；The first optical detection is performed between the steps of developing the first metal thin film and etching the first metal thin film;
    所述第一次电性检测在对所述第一金属薄膜进行蚀刻的步骤以及形成第一绝缘层的步骤之间进行。The first electrical detection is performed between the step of etching the first metal thin film and the step of forming the first insulating layer.
  12. 如权利要求10As claimed in claim 10 所述的阵列基板制作过程中的修补方法，其中，所述在所述第一绝缘层上形成第二金属层的步骤具体包括：在所述第一绝缘层上形成第二金属薄膜，对所述第二金属薄膜依次进行曝光、显影及蚀刻，得到所述第二金属层；In the method for repairing an array substrate, the step of forming a second metal layer on the first insulating layer specifically includes: forming a second metal film on the first insulating layer Performing exposure, development and etching sequentially on the second metal thin film to obtain the second metal layer;
    所述第二次光学检测在对所述第二金属薄膜进行显影和对所述第二金属薄膜进行蚀刻的步骤之间进行；The second optical inspection is performed between the steps of developing the second metal thin film and etching the second metal thin film;
    所述第三次光学检测在对所述第二金属薄膜进行蚀刻的步骤以及形成钝化层的步骤之间进行；The third optical inspection is performed between the step of etching the second metal thin film and the step of forming a passivation layer;
    所述第二次电性检测在对所述第二金属薄膜进行蚀刻的步骤以及形成钝化层的步骤之间进行。The second electrical detection is performed between the step of etching the second metal thin film and the step of forming a passivation layer.
  13. 如权利要求10As claimed in claim 10 所述的阵列基板制作过程中的修补方法，其中，所述利用所述光学检测结果与电性检测结果的结合，确定所述导电图案上的缺陷点的位置具体为：In the method for repairing an array substrate, the combination of the optical detection result and the electrical detection result to determine the position of the defect point on the conductive pattern is specifically:
    根据所述电信号在所述导电图案中的传输状态判断得到导电图案出现传输不良的区域；Judging according to the transmission state of the electrical signal in the conductive pattern that the conductive pattern has a poor transmission area;
    根据光学检测拍摄到的该传输不良的区域的图像获取该传输不良的区域中缺陷点的具***置。The specific position of the defect point in the poor transmission area is obtained according to the image of the poor transmission area captured by optical detection.
  14. 如权利要求10As claimed in claim 10 所述的阵列基板制作过程中的修补方法，其中，所述缺陷点具体为所述导电图案中出现短路的点。In the repair method of the array substrate manufacturing process, the defect point is specifically a point where a short circuit occurs in the conductive pattern.
  15. 如权利要求10As claimed in claim 10 所述的阵列基板制作过程中的修补方法，其中，所述缺陷点具体为所述导电图案中出现断路的点。In the repair method of the array substrate manufacturing process, the defect point is specifically a point where a disconnection occurs in the conductive pattern.
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