WO2020103688A1 - 一种成像装置及终端设备 - Google Patents
一种成像装置及终端设备Info
- Publication number
- WO2020103688A1 WO2020103688A1 PCT/CN2019/115852 CN2019115852W WO2020103688A1 WO 2020103688 A1 WO2020103688 A1 WO 2020103688A1 CN 2019115852 W CN2019115852 W CN 2019115852W WO 2020103688 A1 WO2020103688 A1 WO 2020103688A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- actuator
- image sensor
- stage
- pad
- imaging device
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
- G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
Definitions
- the present application relates to the technical field of photographing, in particular to an imaging device and terminal equipment.
- the mobile phone camera module can obtain a clear image on the image sensor when the camera body is stable. However, during the photographing process, the camera body is shaken due to hand shaking, which causes the image of the object to be photographed to be shifted in the image sensor, which results in the blurred image.
- Optical image stabilization (OIS) technology can suppress the image blur caused by hand shake by using optical methods such as moving lens groups or moving image sensors, so as to improve the picture quality of mobile phone camera modules.
- OIS optical image stabilization
- an optical image stabilizer which includes a fixed base and a movable stage. The movable stage can be pushed by an actuator, which in turn drives the image sensor on the movable stage to produce displacement.
- the image sensor is directly stacked on the optical image stabilizer.
- the height of the imaging surface of the image sensor is raised, that is, the distance between the lens group and the imaging surface
- the distance between the lens group and the imaging surface needs to be extended, which will additionally increase the overall height of the camera module.
- the embodiments of the present application provide an imaging device and a terminal device.
- the image sensor can move in its plane to achieve anti-shake compensation, and the height of the imaging surface of the image sensor is not raised, so that the imaging device has an anti-shake function. It can be made thinner on the basis.
- an embodiment of the present application provides an imaging device.
- the imaging device includes: an image sensor and an anti-shake module, wherein the image sensor includes a photosensitive region, and the photosensitive region is disposed on the front of the image sensor, and the anti-shake module includes a base, a stage, a flexible connector, and an actuator set;
- the substrate includes a concave cavity, the depth of the concave cavity is greater than or equal to the thickness of the image sensor, the carrier is disposed in the cavity, the substrate provides support for the carrier through a flexible connector, and the number of flexible connectors is greater than or equal to 1;
- the stage includes a through hole, the size of the through hole is greater than or equal to the photosensitive area, the stage is electrically connected to the image sensor and the substrate, the bottom surface of the stage is fixedly connected to the front surface of the image sensor, and the image sensor is disposed in the cavity;
- the actuator set includes at least a first actuator, a second actuator, a third actuator, and a fourth actuator.
- the first actuator and the second actuator are arranged along the first coordinate axis.
- the third actuator and the fourth actuator are arranged along the second coordinate axis, the first coordinate axis and the second coordinate axis are in the same plane, and the angle between the first coordinate axis and the second coordinate axis is 90 degrees ,
- Each actuator in the actuator set includes a fixed end and a movable end;
- each actuator in the actuator set is connected to the base, and the movable end of each actuator in the actuator set moves the stage by moving toward or away from the base, and Drive the image sensor to move.
- the image sensor can move in its plane to achieve anti-shake compensation, and because the image sensor and the stage are disposed in the cavity of the substrate, where the depth of the cavity is greater than or equal to the thickness of the image sensor, so The height of the imaging surface of the image sensor will not be raised, so that the imaging device can be made thinner based on the anti-shake function.
- the image sensor further includes a pad, the pad is disposed on the front of the image sensor, and the number of pads is greater than or equal to 1;
- the stage further includes a first front pad, the first front The pads are arranged on the front of the stage, the first front pads are electrically connected to the pads, and the number of the first front pads is greater than or equal to 1.
- an implementation method for achieving electrical connection between the image sensor and the carrier is provided, which can lead the signal of the image sensor to the carrier, which improves the achievability of the solution.
- the stage further includes a first conductive through hole and a first bottom surface pad, the first bottom surface pad is disposed on the bottom surface of the stage, and the first conductive through hole is used to connect the first The front pad and the first bottom pad, the first bottom pad and the pad are welded together, and the number of the first conductive vias and the first bottom pad are greater than or equal to 1.
- an implementation method of electrical connection between the pad on the front of the stage and the pad of the image sensor is provided, and no wire bonding operation is required between the stage and the image sensor, thereby avoiding wire bonding
- the impact of the process on each device reduces the possibility of damage to each device.
- the first front pad is electrically connected to the pad by wire bonding, and the bottom surface of the stage is bonded to the front surface of the image sensor.
- another implementation manner of electrical connection between the pad on the front surface of the stage and the pad of the image sensor is provided, which improves the flexibility of the solution.
- the substrate further includes a second front pad, the second front pad is disposed on the front of the substrate, and the first front pad is electrically connected to the second front pad through a flexible connector,
- the number of second front pads is greater than or equal to 1.
- the imaging device further includes a printed circuit board PCB, the PCB is fixedly connected to the bottom surface of the substrate, the substrate further includes a second conductive via and a second bottom surface pad, and the second bottom surface pad is provided On the bottom surface of the substrate, the second conductive vias are used to connect the second front surface pads and the second bottom surface pads, the second bottom surface pads are soldered together with the PCB, the number of the second conductive vias and the second bottom surface pads are both Greater than or equal to 1.
- an implementation method of electrical connection between the pad on the front surface of the substrate and the PCB is provided, and the signal of the image sensor can be further led out to the PCB without wire bonding between the substrate and the PCB. Therefore, the impact of the wire bonding process on each device is avoided, and the possibility of damage to each device is reduced.
- the imaging device further includes a PCB, the PCB is fixedly connected to the bottom surface of the substrate, and the second front pad is electrically connected to the PCB through wire bonding.
- the PCB is fixedly connected to the bottom surface of the substrate
- the second front pad is electrically connected to the PCB through wire bonding.
- another implementation method of electrical connection between the pad on the front surface of the substrate and the PCB is provided, which increases the flexibility of the solution.
- the imaging device further includes a set of cantilever beams, the set of cantilever beams includes at least a first cantilever beam, a second cantilever beam, a third cantilever beam, and a fourth cantilever beam, the first cantilever beam and The second cantilever beam is arranged along the first coordinate axis, the third cantilever beam and the fourth cantilever beam are arranged along the second coordinate axis, the movable end of the first actuator is connected to the stage through the first cantilever beam, the second The movable end of the actuator is connected to the stage through the second cantilever beam, the movable end of the third actuator is connected to the stage through the third cantilever beam, and the movable end of the fourth actuator is through the fourth cantilever beam Connect to the stage.
- an implementation manner in which the actuator drives the stage and the image sensor through the cantilever beam is provided, which improves the achievability of the solution.
- one end of the flexible connector is connected to the substrate, and the other end of the flexible connector is connected to the stage.
- one end of the flexible connector is connected to the base, and the other end of the flexible connector is connected to at least one cantilever beam in the cantilever beam set.
- one end of the flexible connector is connected to the substrate, and the other end of the flexible connector is connected to the movable end of at least one actuator in the actuator set.
- the fixed end and the movable end of each actuator in the actuator set are electrostatic comb-shaped structures.
- a specific structure of an actuator is provided, which improves the achievability of this solution.
- the first actuator and the second actuator move in the same direction, and drive the stage and the image sensor to move along the first coordinate axis.
- the image sensor can move along the first coordinate axis, and the anti-shake function in the direction of the first coordinate axis can be realized.
- the third actuator and the fourth actuator move in the same direction, and drive the stage and the image sensor to move along the second coordinate axis.
- the image sensor can move along the second coordinate axis, and the anti-shake function in the direction of the second coordinate axis can be realized.
- the first actuator and the second actuator move in opposite directions and / or the third actuator and the fourth actuator move in opposite directions, and drive
- the stage and the image sensor respectively rotate in the corresponding plane.
- the image sensor can also rotate in the plane where it is located, which can realize the anti-shake function in the direction of the Roll axis.
- an embodiment of the present application provides a terminal device, the terminal device includes: a processor, a controller, a memory, a bus, and an imaging device, where the processor, controller, memory, and imaging device communicate with each other through a bus Connection, where the memory is used to store programs and instructions, the processor is used to call the programs and instructions stored in the memory, and the processor is also used to control the imaging device through the controller;
- the imaging device includes: an image sensor and an anti-shake module, wherein the image sensor includes a photosensitive area, and the photosensitive area is disposed on the front of the image sensor, and the anti-shake module includes a base, a stage, a flexible connector, and an actuator set;
- the substrate includes a concave cavity, the depth of the concave cavity is greater than or equal to the thickness of the image sensor, the carrier is disposed in the cavity, the substrate provides support for the carrier through a flexible connector, and the number of flexible connectors is greater than or equal to 1;
- the stage includes a through hole, the size of the through hole is greater than or equal to the photosensitive area, the stage is electrically connected to the image sensor and the substrate, the bottom surface of the stage is fixedly connected to the front surface of the image sensor, and the image sensor is disposed in the cavity;
- the actuator set includes at least a first actuator, a second actuator, a third actuator, and a fourth actuator.
- the first actuator and the second actuator are arranged along the first coordinate axis.
- the third actuator and the fourth actuator are arranged along the second coordinate axis, the first coordinate axis and the second coordinate axis are in the same plane, and the angle between the first coordinate axis and the second coordinate axis is 90 degrees ,
- Each actuator in the actuator set includes a fixed end and a movable end;
- each actuator in the actuator set is connected to the base, and the movable end of each actuator in the actuator set moves the stage by moving toward or away from the base, and Drive the image sensor to move.
- Figure 1 is a schematic diagram of the camera shaking on the Roll axis
- FIG. 3 is a schematic diagram of an imaging beam passing through an imaging mirror group and imaging on an image sensor
- FIG. 4 is a schematic cross-sectional structural diagram of an imaging device in an embodiment of the present application.
- FIG. 5 is a schematic diagram of a front stereo structure of an imaging device in an embodiment of the present application.
- FIG. 6 (a) is a schematic diagram of the image sensor moving along the first coordinate axis
- FIG. 6 (b) is a schematic diagram of the image sensor moving along the second coordinate axis
- FIG. 7 is a schematic diagram of a stereo structure of an image sensor
- FIG. 8 is a schematic diagram of an electrical connection between a carrier and an image sensor
- FIG. 9 is a schematic diagram of another electrical connection between the carrier and the image sensor.
- FIG. 10 is a schematic diagram of an electrical connection between a substrate and a PCB
- FIG. 11 is a schematic diagram of another substrate and PCB to achieve electrical connection
- FIG. 12 is a schematic structural diagram of a terminal device of the present application.
- the embodiments of the present application provide an imaging device and a terminal device.
- the image sensor can move in its plane to achieve anti-shake compensation, and the height of the imaging surface of the image sensor is not raised, so that the imaging device has an anti-shake function. It can be made thinner on the basis.
- the embodiments of the present application may be applied to a camera including an imaging device, where the camera may be integrated on a terminal device, and the terminal device may specifically be a mobile phone, a tablet computer, a wearable device, augmented reality (augmented reality (AR) ⁇ virtual reality ( Virtual reality (VR) equipment, notebook computers, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs), and other user equipments with shooting functions. No restrictions.
- AR augmented reality
- VR virtual reality
- UMPCs ultra-mobile personal computers
- PDAs personal digital assistants
- the camera can get a clear image on the image sensor when the camera body is stable. However, during the photographing process, the camera body is shaken due to hand shaking, which causes the image of the object to be photographed to be shifted in the image sensor, which results in the blurred image.
- Optical image stabilization (OIS) technology can suppress the image blur caused by hand shake by using optical methods such as moving lens groups or moving image sensors, so as to improve the picture quality of mobile phone camera modules.
- the OIS of the moving lens group is implemented by driving devices such as actuators or motors to move the lens group in the opposite direction of the body shake to achieve anti-shake.
- the OIS of the image sensor is implemented by driving devices such as actuators or motors to move the image sensor in the opposite direction of the shaking of the body to achieve anti-shake.
- FIG. 1 shows that the camera shakes on the Roll axis It can be seen that if you want to compensate the anti-shake on the Roll axis, the rotation of the lens group will not work, and the anti-shake on the Roll axis can only be achieved by the rotation of the image sensor. For this reason, OIS technology that uses an image sensor on a camera is essential.
- FIG. 2 is a schematic structural diagram of an anti-shake camera in the prior art solution.
- the structure of the camera usually includes a lens group, a base, an actuator, a movable stage, and a The image sensor on the stage and the movable stage can be pushed by the actuator, which in turn drives the image sensor on the movable stage to produce displacement.
- the stage and the image sensor are stacked on the substrate, so that the height of the imaging surface of the image sensor is raised when the distance between the substrate and the lens group is constant, that is, the lens group and the imaging surface The distance between them has been shortened.
- the distance between the lens group and the imaging surface needs to be extended, which will additionally increase the overall height of the camera module. Based on the current available user equipment The trend towards a lighter and thinner direction is difficult to accept.
- the present application provides an imaging device, so that the imaging device can be made thinner on the basis of having an anti-shake function.
- FIG. 3 is a schematic diagram of an imaging beam passing through an imaging lens group and imaging on an image sensor.
- FIG. 3 is illustrated by taking the mobile phone camera module as an example.
- the imaging device in the embodiment of the present application may be the complete mobile phone camera module shown in FIG. 3, which includes the An imaging mirror group and an imaging device.
- the imaging device further includes an image sensor.
- the imaging device in the embodiments of the present application may not include the imaging mirror group. limited.
- FIG. 4 is a schematic cross-sectional structural diagram of an imaging device in an embodiment of the present application.
- the imaging device 400 includes an image sensor 401 and an anti-shake module 402.
- a photosensitive area 4011 is provided on the front of the image sensor 401, and the anti-shake module 402 includes The base 403, the stage 404, the flexible connector 405, and the actuator set 406.
- the substrate includes a cavity, and the stage and the image sensor are both arranged in the cavity.
- the depth of the cavity is greater than or equal to the thickness of the image sensor, because the stage is suspended In the cavity, the base provides support for the stage through at least one flexible connecting member.
- the actuator will push or pull the carrier and drive the image sensor to move. Therefore, a flexible connector is required to provide support to the carrier, that is, the connection part is allowed to axially expand, contract, and The connection method with a certain displacement in the vertical axis.
- the bottom surface of the stage is fixedly connected to the front surface of the image sensor, so that the movement of the carrier can drive the image sensor to move, and the stage is also electrically connected to the image sensor and the substrate respectively, so that the signal of the image sensor can be led out to the substrate; in addition, the stage Including through holes, the size of the through holes is greater than or equal to the photosensitive area of the image sensor, that is, the stage will not block the photosensitive area from receiving the imaging beam.
- the actuator set in the imaging device is described below:
- FIG. 5 is a schematic front view of the imaging device according to an embodiment of the present application.
- the actuator set includes at least a first actuator 4061, a second actuator 4062, a third actuator 4063, and The fourth actuator 4064, the first actuator and the second actuator are arranged along the first coordinate axis, the third actuator and the fourth actuator are arranged along the second coordinate axis, the first coordinate axis is The second coordinate axis is in the same plane, and the angle between the first coordinate axis and the second coordinate axis is 90 degrees.
- Each actuator in the actuator set includes a fixed end and a movable end. The fixed end of each actuator in the actuator set is connected to the substrate. The movable end of each actuator in the actuator set moves the stage and moves the image by moving toward or away from the substrate The sensor moves.
- the image sensor can move in its plane to achieve anti-shake compensation, and since the image sensor and the stage are disposed in the cavity of the substrate, the depth of the cavity is greater than or equal to the thickness of the image sensor, so The height of the imaging surface of the image sensor will not be raised, so that the imaging device can be made thinner based on the anti-shake function.
- the image sensor in the embodiment of the present application must not only be able to move along the first coordinate axis or the second coordinate axis in the plane where it is located, but also need to enable the image sensor to rotate in its plane, therefore, actuation
- the actuator set needs to include at least 4 actuators, and each actuator can realize bidirectional translation along the axis where it is located.
- the imaging device further includes a set of cantilever beams, and each actuator is connected to the stage through a corresponding cantilever beam, that is, one end of the cantilever beam is connected to the actuator
- the movable end is connected, and the other end of the cantilever beam is connected to the stage.
- the cantilever beam set includes at least a first cantilever beam 4071, a second cantilever beam 4072, a third cantilever beam 4073, and a fourth cantilever beam 4074.
- the first cantilever beam and the second cantilever beam are disposed along the first coordinate axis.
- the three cantilever beam and the fourth cantilever beam are arranged along the second coordinate axis, the movable end of the first actuator is connected to the stage through the first cantilever beam, and the movable end of the second actuator is connected to the carrier through the second cantilever beam
- the stage is connected, the movable end of the third actuator is connected to the stage through the third cantilever beam, and the movable end of the fourth actuator is connected to the stage through the fourth cantilever beam.
- the cantilever beam in the embodiment of the present application may generate a certain amount of deformation in a plane parallel to the image sensor.
- the fixed end and the movable end of each actuator in the actuator set are electrostatic comb-tooth structures
- the actuators of the electrostatic comb-tooth structure generally use a micro-electromechanical system (micro -electro-mechanical system (MEMS) technology, which can change the attractive force between the movable end and the fixed end of the actuator by changing the electric potential of the movable end and the fixed end of the actuator, so that the actuator pushes or pulls the stage , So that the carrier drives the image sensor to move along the first coordinate axis or the second coordinate axis in the plane where it is located, or makes the carrier drive the image sensor to rotate in the plane where it is located.
- MEMS micro-electro-mechanical system
- FIG. 6 (a) is a schematic diagram of the image sensor moving along the first coordinate axis.
- the first actuator and the second actuator move in the same direction along the first coordinate axis, thereby driving the stage and the image sensor to move along the first coordinate axis.
- the first actuator pushes the stage and the second actuator pulls the stage, thereby driving the image sensor to move toward the first coordinate axis, or the first actuator pulls the stage and the second actuator
- the stage is pushed to drive the image sensor to move in the reverse direction toward the first coordinate axis.
- FIG. 6 (b) is a schematic diagram of the image sensor moving along the second coordinate axis.
- the third actuator and the fourth actuator move in the same direction along the second coordinate axis, thereby driving the stage and the image sensor to move along the second coordinate axis.
- the third actuator pushes the stage and the fourth actuator pulls the stage, thereby driving the image sensor to move forward toward the second coordinate axis, or the third actuator pulls the stage and the fourth actuator
- the stage is pushed to drive the image sensor to move in the opposite direction to the second coordinate axis.
- FIG. 6 (c) is a schematic diagram of the image sensor rotating in its plane.
- the first actuator and the second actuator move in opposite directions along the first coordinate axis, or the third actuator and the fourth actuator move in opposite directions along the second coordinate axis, or either
- the actuator and the second actuator move in the opposite direction along the first coordinate axis while the third actuator and the fourth actuator move in the opposite direction along the second coordinate axis, thereby driving the stage And the image sensor rotates in its plane.
- both the first and second actuators move away from the substrate and / or the third and fourth actuators move away from the substrate, thereby driving the stage and the image sensor respectively Rotate clockwise in the corresponding plane, or both the first and second actuators move toward the substrate and / or the third and fourth actuators move toward the substrate Move in the direction to drive the stage and the image sensor to rotate counterclockwise in the corresponding plane.
- the clockwise and counterclockwise directions described above can also be changed, that is, both the first actuator and the second actuator move away from the base and / Or both the third actuator and the fourth actuator move away from the substrate, thereby driving the stage and the image sensor to rotate counterclockwise in the corresponding planes, or the first actuator and the second actuator
- the actuators move toward the substrate and / or the third actuator and the fourth actuator move toward the substrate, thereby driving the stage and the image sensor to rotate clockwise in the corresponding planes .
- the image sensor can not only move along the first coordinate axis or the second coordinate axis in its plane, but also rotate in its plane, so that the anti-shake function in various directions can be realized, which improves user experience.
- the stage In order for the signal of the image sensor to be led out to the substrate, the stage needs to be electrically connected to the image sensor and the substrate respectively.
- the embodiments of the present application provide a variety of different implementations for this purpose, which are described below:
- FIG. 7 is a schematic diagram of the stereo structure of the image sensor.
- the image sensor 401 also includes a solder provided on the front of the image sensor.
- the number of pads is greater than or equal to 1. It can be understood that the positions of the pads are located around the photosensitive area and will not coincide with the photosensitive area.
- a first front pad 4041 is also provided on the front of the stage 404, and the first front pad and the pad of the image sensor are electrically connected.
- the stage 404 further includes a first conductive via 4043 and a first bottom pad 4042 provided on the bottom of the stage, wherein the first conductive via is used to connect the first front pad It is soldered to the first bottom surface pad, the first bottom surface pad and the image sensor pad. Since the first front surface pad and the first bottom surface pad are electrically connected through the first conductive via, the first A front pad is electrically connected to the pad of the image sensor. It should be noted that the number of first front pads, first conductive vias, and first bottom pads are all greater than or equal to 1, and the first front pad, first conductive via, first bottom pad, and image The pads on the sensor can be one-to-one correspondence.
- the second implementation is shown in Figure 9.
- the first front pad on the stage is electrically connected to the pad on the image sensor by wire bonding, and the bottom surface of the stage can be bonded to the front surface of the image sensor. It acts as a fixed image sensor.
- the substrate further includes a second front pad 4031 provided on the front of the substrate.
- the first front pad 4041 of the carrier can be connected to
- the second front pads 4031 of the substrate are electrically connected, the number of the second front pads is greater than or equal to 1, and the first front pads and the second front pads may be in one-to-one correspondence.
- the lead wire drawn from the first front pad may be electrically connected to the second front pad along the flexible connector.
- the first front pad 4041 can be electrically connected to the second front pad 4031 along the closest flexible connector, of course
- the first front pad 4041 can be electrically connected to the second front pad 4031 along other flexible connectors, which is not specifically limited herein.
- the flexible connector serves to provide support for the stage
- the movable end of the actuator can be connected to the stage through the cantilever beam, so the actuation
- the movable end of the actuator, the cantilever beam and the carrier can be regarded as a whole structure, then one end of the flexible connector is connected to the base, and the other end can be connected to the carrier or the movable end of the actuator, or it can be
- the connection of the cantilever beam is not limited here.
- the imaging device further includes a printed circuit board (PCB), the PCB is fixedly connected to the bottom surface of the substrate, and the signal of the image sensor is further led to the PCB on the basis of the signal to the substrate. Therefore, electrical connection must also be achieved between the substrate and the PCB.
- PCB printed circuit board
- the substrate further includes a second bottom pad 4032 and a second conductive via 4033 disposed on the bottom of the substrate, wherein the second conductive via is used to connect the second front pad and the second
- the bottom surface pad, the second bottom surface pad and the PCB are soldered together. Since the second front surface pad and the second bottom surface pad are electrically connected through the second conductive through hole, the second front surface pad and the PCB can be realized Electrical connection.
- the number of second front pads, second conductive vias, and second bottom pads are all greater than or equal to 1, and the second front pads, second conductive vias, and second bottom pads may be corresponding.
- the second implementation is shown in Figure 11.
- the front pad on the substrate is electrically connected to the PCB by wire bonding.
- the first implementation manner described above is different from the second implementation manner. Conduct the wire bonding operation between the substrate and the PCB, thereby avoiding the impact of the wire bonding process on each device and reducing the possibility of damage to each device.
- the imaging apparatus provided in the embodiment of the present application may be a component part of a terminal device, and the following uses the terminal device as a mobile phone as an example for introduction:
- FIG. 12 is a block diagram showing a partial structure of a mobile phone related to an imaging device provided by an embodiment of the present application.
- the mobile phone includes: a memory 1220, an input unit 1230, a display unit 1240, a controller 1250, an imaging device 1260, a processor 1270, and a power supply 1280.
- the structure of the mobile phone shown in FIG. 12 does not constitute a limitation on the mobile phone, and may include more or fewer components than shown, or combine some components, or arrange different components.
- the memory 1220 may be used to store software programs and modules.
- the processor 1270 executes various functional applications and data processing of the mobile phone by running the software programs and modules stored in the memory 1220.
- the memory 1220 may mainly include a storage program area and a storage data area, wherein the storage program area may store an operating system, application programs required by at least one function (such as a sound playback function, an image playback function, etc.), etc .; the storage data area may store Data created by the use of mobile phones (such as audio data, phone books, etc.), etc.
- the memory 1220 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state storage devices.
- the input unit 1230 may be used to receive input numeric or character information, and generate key signal input related to user settings and function control of the mobile phone.
- the input unit 1230 may include a touch panel 1231 and other input devices 1232.
- the touch panel 1231 also known as a touch screen, can collect user's touch operations on or near it (for example, the user uses any suitable objects or accessories such as fingers, stylus, etc. on the touch panel 1231 or near the touch panel 1231. Operation), and drive the corresponding connection device according to the preset program.
- the touch panel 1231 may include a touch detection device and a touch controller.
- the touch detection device detects the user's touch orientation, and detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device and converts it into contact coordinates, and then sends To the processor 1270, and can receive the command sent by the processor 1270 and execute it.
- the touch panel 1231 can be implemented in various types such as resistive, capacitive, infrared, and surface acoustic waves.
- the input unit 1230 may also include other input devices 1232.
- other input devices 1232 may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), trackball, mouse, joystick, and so on.
- the display unit 1240 can be used to display the information input by the user or the information provided to the user and various menus of the mobile phone. In the embodiment of the present application, it is mainly used to display the captured image.
- the display unit 1240 may include a display panel 1241.
- the display panel 1241 may be configured in the form of a liquid crystal display (Liquid Crystal) (LCD), an organic light emitting diode (Organic Light-Emitting Diode, OLED), or the like.
- the touch panel 1231 can cover the display panel 1241.
- the touch panel 1231 When the touch panel 1231 detects a touch operation on or near it, it is transmitted to the processor 1270 to determine the type of touch event, and then the processor 1270 according to the touch event The type provides corresponding visual output on the display panel 1241.
- the touch panel 1231 and the display panel 1241 are two separate components to realize the input and input functions of the mobile phone, in some embodiments, the touch panel 1231 and the display panel 1241 may be integrated and Realize the input and output functions of the mobile phone.
- the controller 1250 can be used to control the actuator of the imaging device to move, thereby driving the carrier and the image sensor to move, so as to realize the anti-shake function of the imaging device.
- the imaging device 1260 may be the imaging device described in any of the embodiments corresponding to FIG. 3 to FIG. 12 described above.
- the processor 1270 is the control center of the mobile phone, and uses various interfaces and lines to connect the various parts of the entire mobile phone, by running or executing the software programs and / or modules stored in the memory 1220, and calling the data stored in the memory 1220 to execute Various functions and processing data of the mobile phone to monitor the mobile phone as a whole.
- the processor is mainly used to call programs and instructions stored in the memory and control the imaging device through the controller.
- the processor 1270 may include one or more processing units; preferably, the processor 1270 may integrate an application processor and a modem processor, where the application processor mainly processes an operating system, a user interface, and application programs, etc.
- the modem processor mainly handles wireless communication.
- the foregoing modem processor may not be integrated into the processor 1270.
- the processor 1270 may also perform processing such as denoising, enhancing, and segmenting blurring on the image according to the acquired signal of the image sensor.
- the mobile phone also includes a power supply 1280 (such as a battery) that supplies power to various components.
- a power supply 1280 (such as a battery) that supplies power to various components.
- the power supply can be logically connected to the processor 1270 through a power management system, so as to implement functions such as charging, discharging, and power management through the power management system.
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Abstract
本申请实施例提供了一种成像装置及终端设备,该成像装置包括:图像传感器和防抖模组,其中,图像传感器包括感光区,防抖模组包括基底、载台、柔性连接件以及致动器集合;基底包括凹腔,凹腔的深度大于或等于图像传感器的厚度,载台及图像传感器设置于凹腔内,基底通过柔性连接件为载台提供支撑;载台包括通孔,通孔的尺寸大于或等于感光区,载台分别与图像传感器以及基底电气连接,载台的底面与图像传感器的正面固定连接;致动器集合中的每个致动器均包括固定端和可动端;致动器集合中的每个致动器的固定端均与基底连接,致动器集合中每个致动器的可动端通过向靠近基底或远离基底的方向移动来带动载台移动,并带动图像传感器移动。
Description
相关申请的交叉引用
本申请要求在2018年11月23日提交中国国家知识产权局、申请号为201811415352.8、申请名称为“一种成像装置及终端设备”的中国专利申请的优先权,并要求在2018年12月1日提交中国国家知识产权局、申请号为201811460672.5、申请名称为“一种成像装置及终端设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
本申请涉及拍照技术领域,尤其涉及一种成像装置及终端设备。
手机摄像模组在机身稳定情况下,被拍物体在图像传感器上能够得到清晰的图像。然而在拍照过程,由于手抖造成机身晃动,导致被拍摄物体在图像传感器所呈的图像发生偏移,导致拍摄图像模糊。
光学图像稳定(optical image stabilization,OIS)技术则可通过采用移动镜头组或移动图像传感器等光学的办法来抑制手抖造成的成像模糊,以提高手机摄像模组的拍照画质。现有技术中,有提出一种光学图像稳定器,包含固定基底、可动载台。可动载台可以由致动器推动,进而带动可动载台上的图像传感器产生位移。
然而,该技术方案中图像传感器直接堆叠在光学图像稳定器上,在摄像模组中镜头组不变的情况下,图像传感器成像面的高度被抬升了,即镜头组和成像面之间的距离拉近了,为了保持原有的成像效果就需要使镜头组和成像面之间的距离拉远,这样会额外造成摄像模组整体高度的增加。
发明内容
本申请实施例提供了一种成像装置及终端设备,图像传感器可以在其所在平面内移动来实现防抖补偿,并且图像传感器成像面的高度不会被抬升,使得成像装置在具有防抖功能的基础上可以做的更薄。
第一方面,本申请实施例提供了一种成像装置。该成像装置包括:图像传感器和防抖模组,其中,图像传感器包括感光区,感光区设置于图像传感器的正面,防抖模组包括基底、载台、柔性连接件以及致动器集合;
基底包括凹腔,凹腔的深度大于或等于图像传感器的厚度,载台设置于凹腔内,基底通过柔性连接件为载台提供支撑,柔性连接件的数量大于或等于1;
载台包括通孔,通孔的尺寸大于或等于感光区,载台分别与图像传感器以及基底电气连接,载台的底面与图像传感器的正面固定连接,并且图像传感器设置于凹腔内;
致动器集合至少包括第一致动器、第二致动器、第三致动器以及第四致动器,第一致动器和第二致动器沿着第一坐标轴设置,第三致动器和第四致动器沿着第二坐标轴设置,第一坐标轴与第二坐标轴在同一平面内,且第一坐标轴与第二坐标轴之间的夹角为90度,致动器集合中的每个致动器均包括固定端和可动端;
致动器集合中的每个致动器的固定端均与基底连接,致动器集合中每个致动器的可动端通过向靠近基底或远离基底的方向移动来带动载台移动,并带动图像传感器移动。
在该实施方式中,图像传感器可以在其所在平面内移动来实现防抖补偿,并且由于图 像传感器以及载台设置于基底的凹腔内,其中凹腔的深度大于或等于图像传感器的厚度,因此图像传感器成像面的高度不会被抬升,使得成像装置在具有防抖功能的基础上可以做的更薄。
可选的,在一些可能的实施方式中,图像传感器还包括焊盘,焊盘设置于图像传感器的正面,焊盘的数量大于或等于1;载台还包括第一正面焊盘,第一正面焊盘设置于载台的正面,第一正面焊盘与焊盘电气连接,第一正面焊盘的数量大于或等于1。在该实施方式中,提供了一种图像传感器与载台之间实现电气连接的实现方式,可以将图像传感器的信号引出至载台,提高了本方案的可实现性。
可选的,在一些可能的实施方式中,载台还包括第一导电通孔以及第一底面焊盘,第一底面焊盘设置于载台的底面,第一导电通孔用于连接第一正面焊盘和第一底面焊盘,第一底面焊盘与焊盘焊接在一起,第一导电通孔以及第一底面焊盘的数量均大于或等于1。在该实施方式中,提供了一种载台正面上的焊盘与图像传感器的焊盘之间电气连接的实现方式,不用进行载台与图像传感器之间的打线操作,从而避免了打线过程对各器件造成的冲击,降低了对各器件造成损伤的可能性。
可选地,在一些可能的实施方式中,第一正面焊盘通过打线与焊盘电气连接,载台的底面与图像传感器的正面粘接在一起。在该实施方式中,提供了另一种载台正面上的焊盘与图像传感器的焊盘之间电气连接的实现方式,提高了本方案的灵活性。
可选地,在一些可能的实施方式中,基底还包括第二正面焊盘,第二正面焊盘设置于基底的正面,第一正面焊盘通过柔性连接件与第二正面焊盘电气连接,第二正面焊盘的数量大于或等于1。在该实施方式中,提供了一种载台与基底之间实现电气连接的方式,可以将图像传感器的信号通过载台引出至基底,进一步提高了本方案的可实现性。
可选地,在一些可能的实施方式中,成像装置还包括印刷电路板PCB,PCB与基底的底面固定连接,基底还包括第二导电通孔以及第二底面焊盘,第二底面焊盘设置于基底的底面,第二导电通孔用于连接第二正面焊盘和第二底面焊盘,第二底面焊盘与PCB焊接在一起,第二导电通孔以及第二底面焊盘的数量均大于或等于1。在该实施方式中,提供了一种基底正面上的焊盘与PCB之间电气连接的实现方式,可以进一步将图像传感器的信号引出至PCB,并且不用进行基底与PCB之间的打线操作,从而避免了打线过程对各器件造成的冲击,降低了对各器件造成损伤的可能性。
可选地,在一些可能的实施方式中,成像装置还包括PCB,PCB与基底的底面固定连接,第二正面焊盘通过打线与PCB电气连接。在该实施方式中,提供了另一种基底正面上的焊盘与PCB之间电气连接的实现方式,提高了本方案的灵活性。
可选地,在一些可能的实施方式中,成像装置还包括悬臂梁集合,悬臂梁集合至少包括第一悬臂梁、第二悬臂梁、第三悬臂梁以及第四悬臂梁,第一悬臂梁和第二悬臂梁沿着第一坐标轴设置,第三悬臂梁和第四悬臂梁沿着第二坐标轴设置,第一致动器的可动端通过第一悬臂梁与载台连接,第二致动器的可动端通过第二悬臂梁与载台连接,第三致动器的可动端通过第三悬臂梁与载台连接,第四致动器的可动端通过第四悬臂梁与载台连接。在该实施方式中,提供了一种致动器通过悬臂梁带动载台及图像传感器运动的实现方式,提高了本方案的可实现性。
可选地,在一些可能的实施方式中,柔性连接件的一端与基底连接,柔性连接件的另一端与载台连接。或者柔性连接件的一端与基底连接,柔性连接件的另一端与悬臂梁集合 中的至少一个悬臂梁连接。又或者柔性连接件的一端与基底连接,柔性连接件的另一端与致动器集合中至少一个致动器的可动端连接。在该实施方式中,提供了多种柔性连接件的具体连接方式,提高了本方案的灵活性。
可选地,在一些可能的实施方式中,致动器集合中每个致动器的固定端与可动端均为静电梳齿型结构。在该实施方式中,提供了一种致动器的具体结构,提高了本方案的可实现性。
可选地,在一些可能的实施方式中,第一致动器与第二致动器朝相同的方向移动,并带动载台及图像传感器沿第一坐标轴移动。在该实施方式中,图像传感器可以沿第一坐标轴移动,可以实现第一坐标轴方向上的防抖功能。
可选地,在一些可能的实施方式中,第三致动器与第四致动器朝相同的方向移动,并带动载台及图像传感器沿第二坐标轴移动。在该实施方式中,图像传感器可以沿第二坐标轴移动,可以实现第二坐标轴方向上的防抖功能。
可选地,在一些可能的实施方式中,第一致动器与第二致动器朝相反的方向移动和/或第三致动器与第四致动器朝相反的方向移动,并带动载台及图像传感器分别在对应的平面内转动。在该实施方式中,图像传感器还可以在其所在平面内转动,可以实现Roll轴方向上的防抖功能。
第二方面,本申请实施例提供了一种终端设备,该终端设备包括:处理器、控制器、存储器、总线及成像装置,其中,处理器、控制器、存储器及成像装置之间通过总线互相连接,其中,存储器用于存储程序与指令,处理器用于调用存储器中存储的程序与指令,处理器还用于通过控制器对成像装置进行控制;
成像装置包括:图像传感器和防抖模组,其中,图像传感器包括感光区,感光区设置于图像传感器的正面,防抖模组包括基底、载台、柔性连接件以及致动器集合;
基底包括凹腔,凹腔的深度大于或等于图像传感器的厚度,载台设置于凹腔内,基底通过柔性连接件为载台提供支撑,柔性连接件的数量大于或等于1;
载台包括通孔,通孔的尺寸大于或等于感光区,载台分别与图像传感器以及基底电气连接,载台的底面与图像传感器的正面固定连接,并且图像传感器设置于凹腔内;
致动器集合至少包括第一致动器、第二致动器、第三致动器以及第四致动器,第一致动器和第二致动器沿着第一坐标轴设置,第三致动器和第四致动器沿着第二坐标轴设置,第一坐标轴与第二坐标轴在同一平面内,且第一坐标轴与第二坐标轴之间的夹角为90度,致动器集合中的每个致动器均包括固定端和可动端;
致动器集合中的每个致动器的固定端均与基底连接,致动器集合中每个致动器的可动端通过向靠近基底或远离基底的方向移动来带动载台移动,并带动图像传感器移动。
图1为照相机在Roll轴上发生抖动的示意图;
图2为现有技术方案中防抖相机的结构示意图;
图3为成像光束经过成像镜组在图像传感器上成像的示意图;
图4为本申请实施例中成像装置的剖面结构示意图;
图5为本申请实施例中成像装置的正面立体结构示意图;
图6(a)为图像传感器沿着第一坐标轴运动的示意图;
图6(b)为图像传感器沿着第二坐标轴运动的示意图;
图6(c)为图像传感器在其所在平面内转动的示意图;
图7为图像传感器的立体结构示意图;
图8为一种载台与图像传感器实现电气连接的示意图;
图9为另一种载台与图像传感器实现电气连接的示意图;
图10为一种基底与PCB实现电气连接的示意图;
图11为另一种基底与PCB实现电气连接的示意图;
图12为本申请终端设备的结构示意图。
本申请实施例提供了一种成像装置及终端设备,图像传感器可以在其所在平面内移动来实现防抖补偿,并且图像传感器成像面的高度不会被抬升,使得成像装置在具有防抖功能的基础上可以做的更薄。
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便这里描述的实施例能够以除了在这里图示或描述的内容以外的顺序实施。此外,术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元的过程、方法、***、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
本申请实施例可应用于包含有成像装置的照相机,其中,照相机可以集成在终端设备上,终端设备具体可以是手机、平板电脑、可穿戴设备、增强现实(augmented reality,AR)\虚拟现实(virtual reality,VR)设备、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer,UMPC)、上网本、个人数字助理(personal digital assistant,PDA)等具有拍摄功能的用户设备,本申请实施例对此不作任何限制。
照相机在机身稳定情况下,被拍物体在图像传感器上能够得到清晰的图像。然而在拍照过程,由于手抖造成机身晃动,导致被拍摄物体在图像传感器所呈的图像发生偏移,导致拍摄图像模糊。光学图像稳定(optical image stabilization,OIS)技术则可通过采用移动镜头组或移动图像传感器等光学的办法来抑制手抖造成的成像模糊,以提高手机摄像模组的拍照画质。移动镜头组的OIS是通过致动器或马达等驱动装置推动镜头组朝着机身晃动的反方向运动来实现防抖。图像传感器的OIS是通过致动器或马达等驱动装置推动图像传感器朝着机身晃动的反方向运动来实现防抖。
为了使照相机可以实现X、Y、Pitch、Yaw和Roll五个轴向的手抖补偿,仅仅使用移动镜头组的OIS技术是不够的,请参阅图1,图1为照相机在Roll轴上发生抖动的示意图,可以看出,如要在Roll轴上对防抖进行补偿,对镜头组的转动是起不到作用的,只能通过图像传感器的转动来实现Roll轴上的防抖。为此,在照相机上采用图像传感器的OIS技术是必不可少的。
为了实现图像传感器的OIS技术,请参阅图2,图2为现有技术方案中防抖相机的结构示意图,照相机的结构中通常包括镜头组、基底、致动器、可动载台以及设置在载台上的图像传感器,可动载台可以由致动器推动,进而带动可动载台上的图像传感器产生位移。然而这种方案中,载台以及图像传感器都是堆叠在基底上,那么在基底和镜头组之间距离不变的情况下,就使得图像传感器成像面高度被抬升了,即镜头组和成像面之间的距离拉 近了,为了保持原有的成像效果就需要使镜头组和成像面之间的距离拉远,这样会额外造成摄像模组整体高度的增加,基于当前可拍摄用户设备都在朝更轻薄方向发展的趋势,这个缺陷很难接受。
为此,本申请提供了一种成像装置,使得成像装置在具有防抖功能的基础上可以做的更薄。
请参阅图3,图3为成像光束经过成像镜组在图像传感器上成像的示意图。图3是以手机摄像模组为例进行示意的,需要说明的是,本申请实施例中的成像装置可以是图3中所示的完整的手机摄像模组,即包括图3中所示的成像镜组以及成像装置,成像装置进一步包括有图像传感器,此外,由于本申请主要基于图像传感器OIS技术的改进,本申请实施例中的成像装置也可以不包括成像镜组,具体此处不做限定。
下面结合附图对本申请实施例中成像装置的具体结构进行描述:
请参阅图4,图4本申请实施例中成像装置的剖面结构示意图,成像装置400包括图像传感器401和防抖模组402,图像传感器401的正面设置有感光区4011,防抖模组402包括基底403、载台404、柔性连接件405以及致动器集合406。
其中,基底包括凹腔,载台和图像传感器均设置于该凹腔内,为了避免图像传感器成像面高度被抬升,该凹腔的深度大于或等于图像传感器的厚度,由于载台悬空地设置于凹腔内,基底通过至少一个柔性连接件为载台提供支撑。需要说明的是,本申请实施例中致动器将推动或拉动载台并带动图像传感器进行移动,因此需要使用柔性连接件为载台提供支撑,即允许连接部位发生轴向伸缩、折转和垂直轴向产生一定位移量的连接方式。
载台的底面与图像传感器的正面固定连接,使得载体的运动可以带动图像传感器进行移动,载台还分别与图像传感器以及基底电气连接,以使得图像传感器的信号可以引出至基底;另外,载台包括通孔,通孔的尺寸大于或等于图像传感器的感光区,即载台不会遮挡感光区接收成像光束。
下面对成像装置中的致动器集合进行描述:
请参阅图5,图5为本申请实施例中成像装置的正面立体结构示意图,其中,致动器集合至少包括第一致动器4061、第二致动器4062、第三致动器4063以及第四致动器4064,第一致动器和第二致动器沿着第一坐标轴设置,第三致动器和第四致动器沿着第二坐标轴设置,第一坐标轴与第二坐标轴在同一平面内,且第一坐标轴与第二坐标轴之间的夹角为90度,致动器集合中的每个致动器均包括固定端和可动端,致动器集合中的每个致动器的固定端均与基底连接,致动器集合中每个致动器的可动端通过向靠近基底或远离基底的方向移动来带动载台移动,并带动图像传感器移动。
本申请实施例中,图像传感器可以在其所在平面内移动来实现防抖补偿,并且由于图像传感器以及载台设置于基底的凹腔内,其中凹腔的深度大于或等于图像传感器的厚度,因此图像传感器成像面的高度不会被抬升,使得成像装置在具有防抖功能的基础上可以做的更薄。
需要说明的是,本申请实施例中图像传感器不仅要能在其所在平面内沿着第一坐标轴或第二坐标轴移动,还需要使得图像传感器在其平面内可以实现转动,因此,致动器集合至少需要包括4个致动器,每个致动器均可以沿其所在的轴向实现双向平动。
下面分别对本申请实施例中图像传感器可能的移动方式进行描述:
请参阅图5,在一种可能的实施方式中,成像装置还包括悬臂梁集合,每个致动器都 通过与之对应的悬臂梁与载台连接,即悬臂梁的一端与致动器的可动端连接,悬臂梁的另一端与载台连接。具体地,悬臂梁集合至少包括第一悬臂梁4071、第二悬臂梁4072、第三悬臂梁4073以及第四悬臂梁4074,第一悬臂梁和第二悬臂梁沿着第一坐标轴设置,第三悬臂梁和第四悬臂梁沿着第二坐标轴设置,第一致动器的可动端通过第一悬臂梁与载台连接,第二致动器的可动端通过第二悬臂梁与载台连接,第三致动器的可动端通过第三悬臂梁与载台连接,第四致动器的可动端通过第四悬臂梁与载台连接。可以理解的是,本申请实施例中的悬臂梁可以在与图像传感器平行的平面内产生一定量的形变。
在一种可能的实施方式中,致动器集合中每个致动器的固定端与可动端均为静电梳齿型结构,该静电梳齿结构的致动器通常采用微机电***(micro-electro-mechanical system,MEMS)技术制作,可以通过改变致动器可动端与固定端的电势进而改变致动器可动端与固定端之间的吸引力,使得致动器推动或拉动载台,使得载台带动图像传感器在其所在平面内沿着第一坐标轴或者第二坐标轴运动,又或者使得载台带动图像传感器在其所在平面内转动。下面分别对上述三种图像传感器的运动方式进行描述:
请参阅图6(a),图6(a)为图像传感器沿着第一坐标轴运动的示意图。第一致动器及第二致动器沿着第一坐标轴朝相同的方向移动,从而带动载台及图像传感器沿着第一坐标轴的方向运动。例如,第一致动器推动载台且第二致动器拉动载台,从而带动图像传感器朝第一坐标轴的正向运动,或者,第一致动器拉动载台且第二致动器推动载台,从而带动图像传感器朝第一坐标轴的反向运动。
请参阅图6(b),图6(b)为图像传感器沿着第二坐标轴运动的示意图。第三致动器及第四致动器沿着第二坐标轴朝相同的方向移动,从而带动载台及图像传感器沿着第二坐标轴的方向运动。例如,第三致动器推动载台且第四致动器拉动载台,从而带动图像传感器朝第二坐标轴的正向运动,或者,第三致动器拉动载台且第四致动器推动载台,从而带动图像传感器朝第二坐标轴的反向运动。
请参阅图6(c),图6(c)为图像传感器在其所在平面内转动的示意图。第一致动器与第二致动器沿着第一坐标轴朝相反的方向运动,或者第三致动器与第四致动器沿着第二坐标轴朝相反的方向运动,又或者第一致动器与第二致动器沿着第一坐标轴朝相反的方向运动的同时第三致动器与第四致动器沿着第二坐标轴朝相反的方向运动,从而带动载台及图像传感器在其所在平面内转动。例如,第一致动器与第二致动器均朝远离基底的方向移动和/或第三致动器与第四致动器均朝远离基底的方向移动,从而带动载台及图像传感器分别在对应的平面内沿顺时针方向转动,或者,第一致动器与第二致动器均朝靠近基底的方向移动和/或第三致动器与第四致动器均朝靠近基底的方向移动,从而带动载台及图像传感器分别在对应的平面内沿逆时针方向转动。
需要说明的是,在一种可能的实施方式中,上面所描述的顺时针和逆时针的方向也可以进行调换,即第一致动器与第二致动器均朝远离基底的方向移动和/或第三致动器与第四致动器均朝远离基底的方向移动,从而带动载台及图像传感器分别在对应的平面内沿逆时针方向转动,或者,第一致动器与第二致动器均朝靠近基底的方向移动和/或第三致动器与第四致动器均朝靠近基底的方向移动,从而带动载台及图像传感器分别在对应的平面内沿顺时针方向转动。
本申请实施例中,图像传感器不仅可以在其所在平面内沿着第一坐标轴或第二坐标轴移动,还可以在其平面内转动,从而可以实现各种方向上的防抖功能,提升了用户体验。
为了使图像传感器的信号可以引出至基底,载台需要分别和图像传感器以及基底实现电气连接,本申请实施例为此提供了多种不同的实施方式,下面分别进行说明:
首先介绍关于载台与图像传感器之间的电气连接,请参阅图7,图7为图像传感器的立体结构示意图,其中,图像传感器401除了包括感光区4011外,还包括设置于图像传感器正面的焊盘4012,焊盘的数量大于或等于1,可以理解的是,焊盘的位置位于感光区的四周,不会与感光区重合。
另外,载台404的正面还设置有第一正面焊盘4041,并且第一正面焊盘与图像传感器的焊盘之间电气连接。这里具体可以有两种不同实现方式,下面分别进行描述:
第一种实现方式如图8所示,载台404还包括第一导电通孔4043以及设置于载台底面的第一底面焊盘4042,其中第一导电通孔用于连接第一正面焊盘和第一底面焊盘,第一底面焊盘与图像传感器的焊盘焊接在一起,由于第一正面焊盘和第一底面焊盘之间通过第一导电通孔实现电气连接,从而可以实现第一正面焊盘与图像传感器的焊盘之间电气连接。需要说明的是,第一正面焊盘、第一导电通孔以及第一底面焊盘的数量均大于或等于1,并且第一正面焊盘、第一导电通孔、第一底面焊盘与图像传感器上的焊盘可以是一一对应的。
第二种实现方式如图9所示,载台上的第一正面焊盘通过打线的方式与图像传感器上的焊盘电气连接,载台的底面可以与图像传感器的正面粘接在一起,起到固定图像传感器的作用。
本申请实施例中,提供了不同的方式实现载台和图像传感器之间的电气连接,提高了本申请的可实现性以及灵活性,另外,上述第一种实现方式相对于第二种实现方式,不用进行载台与图像传感器之间的打线操作,从而避免了打线过程对各器件造成的冲击,降低了对各器件造成损伤的可能性。
下面介绍关于载台与基底之间的电气连接,请参阅图5,基底还包括设置于基底正面的第二正面焊盘4031,其中,载台的第一正面焊盘4041可以通过柔性连接件与基底的第二正面焊盘4031电气连接,第二正面焊盘的数量大于或等于1,且第一正面焊盘与第二正面焊盘可以是一一对应的。具体地,第一正面焊盘引出的导线可以沿着柔性连接件与第二正面焊盘电气连接。可以理解的是,若柔性连接件的数量有多个,那么优选地,第一正面焊盘4041可以沿着距离其最近的柔性连接件与第二正面焊盘4031电气连接,当然除此之外,第一正面焊盘4041可以沿着其他的柔性连接件与第二正面焊盘4031电气连接,具体此处不做限定。
需要说明的是,在一种可能的实施方式中,由于柔性连接件是起到为载台提供支撑的作用,另外,致动器的可动端可以通过悬臂梁与载台连接,因此致动器的可动端、悬臂梁以及载台可以视作一个整体的结构,那么柔性连接件的一端连接基底,而另一端可以连接载台,也可以连接致动器的可动端,又或者可以连接悬臂梁,具体此处不做限定。
在一种可能的实施方式中,成像装置还包括印刷电路板(printed circuit board,PCB),PCB与基底的底面固定连接,图像传感器的信号在引出到基底的基础上还要进一步引出至PCB,因此基底与PCB之间也要实现电气连接,这里具体可以有两种不同实现方式,下面分别进行描述:
第一种实现方式如图10示,基底还包括设置于基底底面的第二底面焊盘4032以及第二导电通孔4033,其中,第二导电通孔用于连接第二正面焊盘和第二底面焊盘,第二底面 焊盘与PCB焊接在一起,由于第二正面焊盘和第二底面焊盘之间通过第二导电通孔实现电气连接,从而可以实现第二正面焊盘与PCB之间电气连接。需要说明的是,第二正面焊盘、第二导电通孔以及第二底面焊盘的数量均大于或等于1,并且第二正面焊盘、第二导电通孔以及第二底面焊盘可以是一一对应的。
第二种实现方式如图11所示,基底上的正面焊盘通过打线的方式与PCB电气连接。
本申请实施例中,提供了不同的方式实现基底和PCB之间的电气连接,提高了本申请的可实现性以及灵活性,另外,上述第一种实现方式相对于第二种实现方式,不用进行基底与PCB之间的打线操作,从而避免了打线过程对各器件造成的冲击,降低了对各器件造成损伤的可能性。
本申请实施例提供的成像装置可以是终端设备的组成部分,下面以该终端设备为手机为例进行介绍:
图12示出的是与本申请实施例提供的成像装置相关的手机的部分结构的框图。参考图12,手机包括:存储器1220、输入单元1230、显示单元1240、控制器1250、成像装置1260、处理器1270、以及电源1280等部件。本领域技术人员可以理解,图12中示出的手机结构并不构成对手机的限定,可以包括比图示更多或更少的部件,或者组合某些部件,或者不同的部件布置。
下面结合图12对手机的各个构成部件进行具体的介绍:
存储器1220可用于存储软件程序以及模块,处理器1270通过运行存储在存储器1220的软件程序以及模块,从而执行手机的各种功能应用以及数据处理。存储器1220可主要包括存储程序区和存储数据区,其中,存储程序区可存储操作***、至少一个功能所需的应用程序(比如声音播放功能、图像播放功能等)等;存储数据区可存储根据手机的使用所创建的数据(比如音频数据、电话本等)等。此外,存储器1220可以包括高速随机存取存储器,还可以包括非易失性存储器,例如至少一个磁盘存储器件、闪存器件、或其他易失性固态存储器件。
输入单元1230可用于接收输入的数字或字符信息,以及产生与手机的用户设置以及功能控制有关的键信号输入。具体地,输入单元1230可包括触控面板1231以及其他输入设备1232。触控面板1231,也称为触摸屏,可收集用户在其上或附近的触摸操作(比如用户使用手指、触笔等任何适合的物体或附件在触控面板1231上或在触控面板1231附近的操作),并根据预先设定的程式驱动相应的连接装置。可选的,触控面板1231可包括触摸检测装置和触摸控制器两个部分。其中,触摸检测装置检测用户的触摸方位,并检测触摸操作带来的信号,将信号传送给触摸控制器;触摸控制器从触摸检测装置上接收触摸信息,并将它转换成触点坐标,再送给处理器1270,并能接收处理器1270发来的命令并加以执行。此外,可以采用电阻式、电容式、红外线以及表面声波等多种类型实现触控面板1231。除了触控面板1231,输入单元1230还可以包括其他输入设备1232。具体地,其他输入设备1232可以包括但不限于物理键盘、功能键(比如音量控制按键、开关按键等)、轨迹球、鼠标、操作杆等中的一种或多种。
显示单元1240可用于显示由用户输入的信息或提供给用户的信息以及手机的各种菜单,在本申请实施例中主要用于显示拍摄到的图像。显示单元1240可包括显示面板1241,可选的,可以采用液晶显示器(Liquid Crystal Display,LCD)、有机发光二极管(Organic Light-Emitting Diode,OLED)等形式来配置显示面板1241。进一步的,触控面板1231可 覆盖显示面板1241,当触控面板1231检测到在其上或附近的触摸操作后,传送给处理器1270以确定触摸事件的类型,随后处理器1270根据触摸事件的类型在显示面板1241上提供相应的视觉输出。虽然在图12中,触控面板1231与显示面板1241是作为两个独立的部件来实现手机的输入和输入功能,但是在某些实施例中,可以将触控面板1231与显示面板1241集成而实现手机的输入和输出功能。
控制器1250可用于控制成像装置的致动器进行移动,从而带动载体和图像传感器运动,以此来实现成像装置的防抖功能。
成像装置1260可以为上述图3至图12对应的任一个实施例中所描述的成像装置。
处理器1270是手机的控制中心,利用各种接口和线路连接整个手机的各个部分,通过运行或执行存储在存储器1220内的软件程序和/或模块,以及调用存储在存储器1220内的数据,执行手机的各种功能和处理数据,从而对手机进行整体监控,在本申请实施例中处理器主要用于调用存储器中存储的程序与指令并通过控制器对成像装置进行控制。可选的,处理器1270可包括一个或多个处理单元;优选的,处理器1270可集成应用处理器和调制解调处理器,其中,应用处理器主要处理操作***、用户界面和应用程序等,调制解调处理器主要处理无线通信。可以理解的是,上述调制解调处理器也可以不集成到处理器1270中。在本申请实施例中处理器1270还可以根据获取到的图像传感器的信号对图像进行去噪,增强,分割虚化等处理。
手机还包括给各个部件供电的电源1280(比如电池),优选的,电源可以通过电源管理***与处理器1270逻辑相连,从而通过电源管理***实现管理充电、放电、以及功耗管理等功能。
需要说明的是,以上实施例仅用以说明本申请的技术方案,而非对其限制。尽管参照前述实施例对本申请进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。
Claims (13)
- 一种成像装置,其特征在于,包括:图像传感器和防抖模组,其中,所述图像传感器包括感光区,所述感光区设置于所述图像传感器的正面,所述防抖模组包括基底、载台、柔性连接件以及致动器集合;所述基底包括凹腔,所述凹腔的深度大于或等于所述图像传感器的厚度,所述载台设置于所述凹腔内,所述基底通过所述柔性连接件为所述载台提供支撑,所述柔性连接件的数量大于或等于1;所述载台包括通孔,所述通孔的尺寸大于或等于所述感光区,所述载台分别与所述图像传感器以及所述基底电气连接,所述载台的底面与所述图像传感器的正面固定连接,并且所述图像传感器设置于所述凹腔内;所述致动器集合至少包括第一致动器、第二致动器、第三致动器以及第四致动器,所述第一致动器和所述第二致动器沿着第一坐标轴设置,所述第三致动器和所述第四致动器沿着第二坐标轴设置,所述第一坐标轴与所述第二坐标轴在同一平面内,且所述第一坐标轴与所述第二坐标轴之间的夹角为90度,所述致动器集合中的每个致动器均包括固定端和可动端;所述致动器集合中的每个致动器的固定端均与所述基底连接,所述致动器集合中每个致动器的可动端通过向靠近所述基底或远离所述基底的方向移动来带动所述载台移动,并带动所述图像传感器移动。
- 根据权利要求1所述的成像装置,其特征在于,所述图像传感器还包括焊盘,所述焊盘设置于所述图像传感器的正面,所述焊盘的数量大于或等于1;所述载台还包括第一正面焊盘,所述第一正面焊盘设置于所述载台的正面,所述第一正面焊盘与所述焊盘电气连接,所述第一正面焊盘的数量大于或等于1。
- 根据权利要求2所述的成像装置,其特征在于,所述载台还包括第一导电通孔以及第一底面焊盘,所述第一底面焊盘设置于所述载台的底面,所述第一导电通孔用于连接所述第一正面焊盘和所述第一底面焊盘,所述第一底面焊盘与所述焊盘焊接在一起,所述第一导电通孔以及所述第一底面焊盘的数量均大于或等于1。
- 根据权利要求2所述的成像装置,其特征在于,所述第一正面焊盘通过打线与所述焊盘电气连接,所述载台的底面与所述图像传感器的正面粘接在一起。
- 根据权利要求2所述的成像装置,其特征在于,所述基底还包括第二正面焊盘,所述第二正面焊盘设置于所述基底的正面,所述第一正面焊盘通过所述柔性连接件与所述第二正面焊盘电气连接,所述第二正面焊盘的数量大于或等于1。
- 根据权利要求5所述的成像装置,其特征在于,所述成像装置还包括印刷电路板PCB,所述PCB与所述基底的底面固定连接,所述基底还包括第二导电通孔以及第二底面焊盘,所述第二底面焊盘设置于所述基底的底面,所述第二导电通孔用于连接所述第二正面焊盘和所述第二底面焊盘,所述第二底面焊盘与所述PCB焊接在一起,所述第二导电通孔以及所述第二底面焊盘的数量均大于或等于1。
- 根据权利要求5所述的成像装置,其特征在于,所述成像装置还包括PCB,所述PCB与所述基底的底面固定连接,所述第二正面焊盘通过打线与所述PCB电气连接。
- 根据权利要求1至7中任一项所述的成像装置,其特征在于,所述成像装置还包括悬臂梁集合,所述悬臂梁集合至少包括第一悬臂梁、第二悬臂梁、第三悬臂梁以及第四 悬臂梁,所述第一悬臂梁和所述第二悬臂梁沿着所述第一坐标轴设置,所述第三悬臂梁和所述第四悬臂梁沿着所述第二坐标轴设置,所述第一致动器的可动端通过所述第一悬臂梁与所述载台连接,所述第二致动器的可动端通过所述第二悬臂梁与所述载台连接,所述第三致动器的可动端通过所述第三悬臂梁与所述载台连接,所述第四致动器的可动端通过所述第四悬臂梁与所述载台连接。
- 根据权利要求1至7中任一项所述的成像装置,其特征在于,所述致动器集合中每个致动器的固定端与可动端均为静电梳齿型结构。
- 根据权利要求9所述的成像装置,其特征在于,所述第一致动器与所述第二致动器朝相同的方向移动,并带动所述载台及所述图像传感器沿所述第一坐标轴移动。
- 根据权利要求9所述的成像装置,其特征在于,所述第三致动器与所述第四致动器朝相同的方向移动,并带动所述载台及所述图像传感器沿所述第二坐标轴移动。
- 根据权利要求9所述的成像装置,其特征在于,所述第一致动器与所述第二致动器朝相反的方向移动和/或所述第三致动器与所述第四致动器朝相反的方向移动,并带动所述载台及所述图像传感器分别在对应的平面内转动。
- 一种终端设备,其特征在于,包括处理器、控制器、存储器、总线及成像装置,其中,所述处理器、所述控制器、所述存储器及所述成像装置之间通过所述总线互相连接,其中,所述存储器用于存储程序与指令,所述处理器用于调用所述存储器中存储的程序与指令,所述处理器还用于通过所述控制器对所述成像装置进行控制;所述成像装置包括:图像传感器和防抖模组,其中,所述图像传感器包括感光区,所述感光区设置于所述图像传感器的正面,所述防抖模组包括基底、载台、柔性连接件以及致动器集合;所述基底包括凹腔,所述凹腔的深度大于或等于所述图像传感器的厚度,所述载台设置于所述凹腔内,所述基底通过所述柔性连接件为所述载台提供支撑,所述柔性连接件的数量大于或等于1;所述载台包括通孔,所述通孔的尺寸大于或等于所述感光区,所述载台分别与所述图像传感器以及所述基底电气连接,所述载台的底面与所述图像传感器的正面固定连接,并且所述图像传感器设置于所述凹腔内;所述致动器集合至少包括第一致动器、第二致动器、第三致动器以及第四致动器,所述第一致动器和所述第二致动器沿着第一坐标轴设置,所述第三致动器和所述第四致动器沿着第二坐标轴设置,所述第一坐标轴与所述第二坐标轴在同一平面内,且所述第一坐标轴与所述第二坐标轴之间的夹角为90度,所述致动器集合中的每个致动器均包括固定端和可动端;所述致动器集合中的每个致动器的固定端均与所述基底连接,所述致动器集合中每个致动器的可动端通过向靠近所述基底或远离所述基底的方向移动来带动所述载台移动,并带动所述图像传感器移动。
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