WO2020098577A1 - 一种平面光波导器件及温度测量*** - Google Patents

一种平面光波导器件及温度测量*** Download PDF

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Publication number
WO2020098577A1
WO2020098577A1 PCT/CN2019/116731 CN2019116731W WO2020098577A1 WO 2020098577 A1 WO2020098577 A1 WO 2020098577A1 CN 2019116731 W CN2019116731 W CN 2019116731W WO 2020098577 A1 WO2020098577 A1 WO 2020098577A1
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Prior art keywords
temperature measurement
optical path
paths
light
light splitting
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PCT/CN2019/116731
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English (en)
French (fr)
Inventor
谢建豪
刘东昌
***
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深圳伊讯科技有限公司
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Priority to KR1020217017693A priority Critical patent/KR20210088681A/ko
Priority to US17/293,908 priority patent/US20210381907A1/en
Priority to EP19885161.0A priority patent/EP3882594A4/en
Publication of WO2020098577A1 publication Critical patent/WO2020098577A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • G01K11/32—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/268—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light using optical fibres
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/026—Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
    • G01K11/32—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres
    • G01K11/3206—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres at discrete locations in the fibre, e.g. using Bragg scattering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/12138—Sensor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/1215—Splitter

Definitions

  • the present application relates to the technical field of optical fiber sensing, in particular to a planar optical waveguide device and a temperature measurement system.
  • FBG fiber fiber Bragg grating
  • FBG sensors are fundamentally different from electricity-based sensors. FBG sensors use light as a carrier for sensitive information and optical fiber as a medium for transmitting sensitive information. They have the advantages of strong anti-electromagnetic interference and good radiation resistance, and are particularly suitable for easy It is used in harsh environments such as flammable, explosive, space is strictly restricted and strong electromagnetic interference. New energy vehicle battery temperature measurement is a good example.
  • FBG sensor is a better solution for temperature measurement of new energy vehicle batteries.
  • the present application proposes a planar optical waveguide device and a temperature measurement system.
  • the planar optical waveguide device can replace the transmission fiber in the prior art. Simplify the structure of the equipment, reduce the production costs and maintenance costs of the equipment, and facilitate subsequent maintenance.
  • a planar optical waveguide device includes a substrate provided with N parallel temperature measurement channels; N is an integer greater than 1;
  • Each of the temperature measurement channels includes an incident optical path, a reflected optical path, and an exit optical path; in the same temperature measurement channel, the incident optical path, the reflected optical path, and the exit optical path are connected by a common node ;
  • an intersection point is provided between the incident optical path of one temperature measurement channel and the reflected optical path of at least one other temperature measurement channel.
  • the detection light enters the temperature measurement channel from one end of the incident optical path, reaches the intersection point through the other end of the incident optical path, and then enters the exit optical path;
  • the detection light passes through the FBG sensor, it will reflect back the optical signal carrying the temperature information.
  • the optical signal After the optical signal is transmitted back to the intersection point, it enters the reflected optical path and enters the photodetector through the reflected optical path for demodulation.
  • the present planar optical waveguide device of the present technical solution When performing multi-channel temperature measurement, in the present planar optical waveguide device of the present technical solution, it is not through the transmission fiber to realize the crossover between different optical paths as in the prior art, but in N temperature measurement channels arranged in parallel There is a cross point between the incident optical path of one temperature measurement channel and the reflected optical path of at least one other temperature measurement channel to realize the transmission, measurement and demodulation of optical signals.
  • a temperature measurement system includes a detection light source, a photodetector, a planar optical waveguide device, and a measurement optical fiber;
  • the planar optical waveguide device includes a substrate with N temperature measurement channels arranged in parallel; N is an integer greater than 1;
  • Each of the temperature measurement channels includes an incident optical path, a reflected optical path, and an exit optical path; in the same temperature measurement channel, the incident optical path, the reflected optical path, and the exit optical path are connected by a common node ;
  • an intersection point is set between the incident optical path of one temperature measurement channel and the reflected optical path of at least one other temperature measurement channel;
  • the detection light source is connected to the end of the incident optical path away from the common node, the photodetector is connected to the end of the reflected optical path away from the common node, and the measurement fiber is away from the exit optical path One end of the common node is connected;
  • An FBG sensor is provided in the measurement fiber.
  • the detection light emitted by the detection light source enters the temperature measurement channel from one end of the incident light path, reaches the intersection point through the other end of the incident light path, and then enters the exit light path;
  • the detection light of the outgoing optical path will reflect back the optical signal carrying the temperature information when passing through the FBG sensor. After the optical signal is transmitted back to the intersection point, it enters the reflected optical path and enters the photodetector through the reflected optical path for demodulation.
  • one temperature measurement channel A cross point is provided between the incident optical path and the reflected optical path of at least one other temperature measurement channel to realize transmission, measurement and demodulation of optical signals.
  • FIG. 1 is a schematic diagram of a temperature measurement channel in a planar optical waveguide device of this application;
  • FIG. 2 is a schematic diagram of an embodiment of a planar optical waveguide device of this application.
  • FIG. 3 is a schematic diagram of a sloping platform in a planar optical waveguide device of this application;
  • FIG. 4 is a schematic diagram of another embodiment of a planar optical waveguide device of this application.
  • FIG. 5 is a schematic diagram of a first embodiment of a temperature measurement system according to this application.
  • FIG. 6 is a schematic diagram of a second embodiment of a temperature measurement system according to this application.
  • FIG. 7 is a schematic diagram of another embodiment of a planar optical waveguide device of this application.
  • FIG. 8 is a schematic diagram of another embodiment of a planar optical waveguide device of the present application.
  • Probe light source 2. Photodetector, 3. Planar optical waveguide device, 4. Measuring fiber, 5. Substrate;
  • first temperature measurement channel 315.
  • second temperature measurement channel 316.
  • third temperature measurement channel 317. fourth temperature measurement channel;
  • Planar optical waveguide namely PLC, Planar Lightwave Circuit.
  • the planar optical waveguide devices in the prior art are mostly used for communication splitting.
  • the planar optical waveguide device generally includes a substrate, and the optical path is carved on the substrate through photolithography, etching, development and other technologies, and the optical signal is reflected in the light by reflection Spread forward on the road. Therefore, the working principle of the planar optical waveguide device is to propagate the optical signal in a specific direction through the optical path provided on the substrate.
  • silicon dioxide, lithium niobate, and group III-V semiconductor compounds can be used as the substrate material.
  • Communication systems have relatively high requirements for crosstalk.
  • a planar optical waveguide device used for communication splitting there can be no intersection between different communication channels. Therefore, when the optical paths of the two communication channels need to be crossed, the two optical paths can only be crossed through the optical fiber, and the optical paths of the two communication channels cannot be realized in the planar optical waveguide device.
  • a planar optical waveguide device includes a substrate with N temperature measurement channels 31 arranged in parallel; wherein, N is greater than An integer of 1.
  • N is greater than An integer of 1.
  • at least two temperature measurement channels 31 are provided. If only one temperature measurement channel 31 is provided in the planar optical waveguide device, there will be no intersection between the optical paths of different temperature measurement channels 31.
  • each temperature measurement channel 31 includes an incident optical path 311, a reflected optical path 312, and an exit optical path 313.
  • the incident optical path 311, the reflected optical path 312 and the exit optical path 313 are connected by a common node; among the N parallel temperature measurement channels 31, one temperature measurement channel A cross point is provided between the incident optical path 311 and the reflected optical path 312 of at least one other temperature measurement channel.
  • each incident optical path 311, reflected optical path 312, and exit optical path 313 are connected to the temperature measurement system through the end away from the intersection point, and the detection light enters the temperature measurement channel 31, and then enters the incident optical path 311 Propagating forward and entering the exit optical path 313 through the intersection; the temperature measurement system is docked with the exit optical path 313 through the FBG sensor, and the detection light enters the exit optical path 313 from the intersection.
  • the FBG sensor When the detection light meets the FBG sensor, the FBG sensor will The optical information carrying the temperature information is reflected back, and the reflected optical information enters the reflected optical path 312 through the intersection, and then is sent to the temperature measurement system by the reflected optical path 312; the temperature measurement system demodulates the optical information carrying the temperature information, namely The temperature of the measured point can be obtained to achieve the purpose of temperature measurement.
  • the optical path can be laid out by setting a cross point between the incident optical path of one temperature measurement channel and the reflected optical paths of other temperature measurement channels, instead of The connection between the temperature measurement system and different temperature measurement channels needs to be realized through the transmission fiber of the prior art.
  • the invention of the present application lies in that, in a planar optical waveguide device for temperature measurement, among N parallel temperature measurement channels, the incident optical path of one temperature measurement channel and the reflected optical path of at least one other temperature measurement channel
  • the intersection point is set, so that it does not affect the temperature measurement function of each temperature measurement channel, and there is no need to connect the temperature measurement system and the measured object through the transmission fiber, so there is no fault due to fiber damage. It can reduce maintenance cost and facilitate subsequent maintenance; at the same time, when the temperature measurement system is assembled on the measured object, the coupling can be completed directly through the planar optical waveguide device in the technical solution, and such a planar optical waveguide device is convenient For large-scale production, there is no need to equip the transmission fiber, which can reduce the production cost of the equipment.
  • the temperature measurement system When temperature measurement is performed by a planar optical waveguide device combined with an FBG sensor, the temperature measurement system is not sensitive to crosstalk. For example, when the probe light propagates from the incident light path to the intersection point, most of it enters the exit light path, but a small part enters the reflected light path, and crosstalk occurs. However, the temperature measurement system does not require high accuracy, and crosstalk does not affect the normal operation of the temperature measurement system. Therefore, a planar optical waveguide device with an intersection between optical paths of different temperature measurement channels can be used for temperature measurement.
  • N ends of the incident optical paths away from the common node are collected to form a first interface 34, and N ends of the reflected optical paths away from the common node are formed to form In the second interface 35, the ends of the N output light paths away from the common node are collected to form a third interface 36.
  • the first interface 34 and the second interface 35 are provided together on one side of the substrate, and the third interface 36 is provided on the other side of the substrate. Since the first interface 34 and the second interface 35 need to be docked with the temperature measurement system, and the third interface 36 needs to be docked with the measured object through the measurement fiber, such a setting makes the structure of the entire system more rational.
  • the planar optical waveguide device further integrates a photodetector 2, which is used to convert the optical signal into an electrical signal.
  • the photodetector 2 is vertically arranged on the side close to the second interface 34 of the substrate 5, that is, the photodetector 2 and the substrate 5 are perpendicular to each other, and the photodetector 2 is connected to the N The reflected light paths are connected.
  • Such an arrangement enables the optical signal output through the reflected optical path to be directly input into the input terminal of the photodetector 2 without first connecting to the reflected optical path through the optical fiber line, and then connecting the photodetector 2 through the optical fiber line
  • the input terminal connection reduces the use of connecting optical fibers, simplifies the connection of the optical path, improves the maintainability of the system, and can reduce costs.
  • the substrate has a sheet-like structure, a slope 32 with an inclination angle is provided on one side of the substrate, and the second interface is provided on the slope 32.
  • the inclination angle of the inclined table 32 is 40 ° to 50 °.
  • the advantage of this arrangement is that the process is simple, the coupling efficiency is high, and the optical signal output from the reflected optical path can be emitted out of the vertical horizontal plane after being reflected by the inclined table.
  • the inclination angle of the slant table 32 may also be 7 °, 8 °, or 45 °, or may be other angles.
  • the specific angle is determined according to the angle between the reflected light path and the horizontal in the substrate, usually It is suitable for the optical signal output by the reflected optical path to be emitted in a vertical horizontal plane after being reflected by the inclined table, and this application is not further limited.
  • the light information carrying the temperature information comes out of the reflected light path.
  • demodulation can obtain the temperature of the measured object.
  • the temperature measurement system and each reflected optical path should be coupled.
  • a tilt table 32 is provided on the substrate to fix the photodetector 2 and the substrate relatively, and light information carrying temperature information passes through the tilt table 32 and enters the photoelectric Inside the detector. In this way, the photodetector 2 can perform the next demodulation.
  • the photodetector 2 is integrated in the planar optical waveguide device, and the photodetector 2 is disposed on the side close to the second interface 34 of the substrate.
  • the photodetector 2 is provided at different positions close to the second interface 34 of the substrate according to the tilt direction and tilt angle of the tilt table, for example: when the tilt table is tilted downward, the photodetector 2 is horizontally placed at Below the side of the second interface 34 of the substrate; when the slant is inclined upward, the photodetector 2 is horizontally placed above the side of the second interface 34 of the substrate;
  • the detector 2 may also be arranged above or below, on the left or right side of the side close to the second interface 34 of the substrate at a certain inclination angle, as long as the photodetector 2 can pass through the second interface 34 need only be in communication with the N reflected light paths.
  • the light signal output through the reflected light path can be directly injected into the input terminal of the photodetector 2 through the reflection of the inclined table 32 without first passing through the optical fiber line and the reflected light path Connection, and then connected to the input terminal of the photodetector 2 through the optical fiber line, reducing the use of connecting optical fibers, simplifying the connection of the optical path, improving the maintainability of the system, and thereby reducing costs.
  • placing the photodetector 2 below or above the planar optical waveguide device that is, placing the photodetector 2 horizontally below or above the planar optical waveguide device, rather than perpendicularly to the substrate, can solve the problem
  • the photodetector is vertically installed, the larger width leads to the problem of a thicker planar optical waveguide device, so that the thickness of the planar optical waveguide device can be reduced, and thus the planar optical waveguide device can be made lighter and thinner.
  • a spectroscopic unit 33 is also provided in the substrate.
  • the light splitting unit 33 includes a light splitting input optical path 331 and N light splitting output optical paths 332, the output ends of the light splitting input optical path 331 are respectively connected to the input ends of the N light splitting output optical paths 332, and the N light splitting output
  • the output end of the optical path 332 is in one-to-one correspondence with the N incident light paths.
  • a splitting unit may be composed of multiple one-point two-way optical paths.
  • the splitting unit includes a splitting input optical path and four splitting output optical paths
  • the splitting unit is composed of three one-point two-path optical paths, and the specific structure is that the two output ends of the first one-point two-path optical path are The two one-by-two optical paths are connected to the input of the third one-by-two optical path, and the output ends of the second one-by-two optical path and the third one-by-two optical path form four outlets, thereby achieving one-by-four.
  • a light splitting unit 33 may be formed by a light splitting input light path 331 and N light splitting output light paths 332.
  • the detection light needs to be connected to each incident optical path through the beam splitter, so that an additional beam splitter is required, and in order to enable the beam splitter to be connected to each incident optical path It also needs to be equipped with multiple transmission fibers.
  • a light splitting unit 33 is further provided in the substrate.
  • the detection light enters the spectroscopic input optical path 331, and then is divided into multiple paths, and then output through multiple spectroscopic output optical paths 332, and enters multiple incident optical paths one by one. In this way, there is no need to additionally equip the optical splitter, which further simplifies the temperature measurement system.
  • the spectroscopic unit can be docked with the detection light only through the spectroscopic input optical path, in the second embodiment, there is no need to provide a first interface.
  • the number of temperature measurement channels may be 2, 3, 4, etc., or 12, 16, 18, or 24 temperature measurement channels may be provided according to actual needs. That is, N is an integer greater than 1.
  • the substrate is provided with four temperature measurement channels arranged in parallel, and the four temperature measurement channels 31 arranged in parallel include a first temperature measurement channel 314, a second temperature measurement channel 315, and a Three temperature measurement channels 316 and a fourth temperature measurement channel 317.
  • the incident optical path 311 in the first temperature measurement channel 314 is respectively in contact with the reflected optical path 312 in the second temperature measurement channel 315, the reflected optical path 312 in the third temperature measurement channel 316, and the fourth temperature measurement channel
  • the reflected light path 312 in 317 is provided with intersections.
  • the incident optical path 311 in the second temperature measurement channel 315 and the reflected optical path 312 in the third temperature measurement channel 316 and the reflected optical path 312 in the fourth temperature measurement channel 317 are respectively provided with intersection points.
  • the incident light path 311 in the third temperature measurement channel 316 and the reflected light path 312 in the fourth temperature measurement channel 317 are provided with intersections.
  • a temperature measurement system includes a detection light source 1, a photodetector 2, a planar optical waveguide device 3, and a measurement optical fiber 4.
  • the planar optical waveguide device 3 includes a substrate, and there are N temperature measurement channels arranged in parallel in the substrate; wherein, N is an integer greater than 1. In this application, at least two temperature measurement channels are provided. If only one temperature measurement channel is provided in the planar optical waveguide device, there will be no crossover between the optical paths of different temperature measurement channels.
  • Each temperature measurement channel 31 includes an incident optical path 311, a reflected optical path 312, and an exit optical path 313; in the same temperature measurement channel 31, the incident optical path 311, the reflected optical path 312, and the exit optical path 313 is connected by a common node.
  • an intersection point is provided between the incident optical path 311 of one temperature measurement channel and the reflected optical path 312 of at least one other temperature measurement channel.
  • the detection light source 1 is connected to the end of the incident optical path 311 far from the common node, the photodetector 2 is connected to the end of the reflected light path 312 far from the common node, and the measurement fiber 4 is connected to the The end of the exit optical path 313 far away from the common node is in communication; the measurement fiber 4 is provided with an FBG sensor.
  • the principle of temperature measurement by the temperature measurement system is: the detection light source emits detection light, and the detection light propagates along the measurement fiber; the measurement fiber is provided with an FBG sensor. At different temperatures, the FBG sensor will exhibit different effects due to thermal expansion and contraction at different temperatures The fiber grating structure of the sensor will reflect when the detected light propagates to the FBG sensor, reflecting the light information carrying the temperature information back. However, due to the different structure of the fiber grating at different temperatures, the FBG sensor will reflect back the light information of different wavelengths. The receiver receives the reflected light information carrying the temperature information, and compares it with the detection light emitted by the detection light source. The temperature value can be obtained according to the center wavelength offset, and the temperature measurement is completed.
  • each incident light path, reflected light path and exit light path are docked with the temperature measurement system through the end away from the intersection point, where the incident light path is docked with the detection light source through the end away from the intersection point ,
  • the reflected light path is docked with the photodetector through the end far away from the intersection point, and the exit light path is docked with the measurement fiber through the end away from the intersection point; after the detection light enters the temperature measurement channel from the detection light source, it travels forward in the incident light path and passes The intersection enters the exit optical path; the FBG sensor in the measurement fiber is docked with the exit optical path, and the detection light enters the exit optical path from the intersection.
  • the FBG sensor When the detection light encounters the FBG sensor, the FBG sensor will reflect the light information carrying the temperature information back The reflected light information enters the reflected light path through the intersection point, and then is sent to the photodetector by the reflected light path; the temperature measurement system demodulates the light information carrying the temperature information through the photodetector to obtain the temperature of the measured point , To achieve the purpose of temperature measurement.
  • the optical path can be laid out by setting a cross point between the incident optical path of one temperature measurement channel and the reflected optical paths of other temperature measurement channels, instead of The connection between the temperature measurement system and different temperature measurement channels needs to be realized through the transmission fiber of the prior art.
  • the invention of the present application lies in that, in a planar optical waveguide device for temperature measurement, among N parallel temperature measurement channels, the incident optical path of one temperature measurement channel and the reflected optical path of at least one other temperature measurement channel
  • the intersection point is set, so that it does not affect the temperature measurement function of each temperature measurement channel, and there is no need to connect the temperature measurement system and the measured object through the transmission fiber, so there is no fault due to fiber damage. It can reduce maintenance costs and facilitate subsequent maintenance; at the same time, when the measuring fiber is assembled on the measured object, the coupling can be completed directly through the planar optical waveguide device in this technical solution, and such a planar optical waveguide device is convenient for large Large-scale production, without the need for transmission fiber, can reduce the production cost of equipment.
  • the temperature measurement system When temperature measurement is performed by a planar optical waveguide device combined with an FBG sensor, the temperature measurement system is not sensitive to crosstalk. For example, when the detection light propagates from the detection light source through the incident light path to the intersection point, most of it enters the exit light path, but a small part enters the reflected light path, and crosstalk occurs at this time. However, the temperature measurement system does not require high accuracy, and crosstalk does not affect the normal operation of the temperature measurement system. Therefore, a planar optical waveguide device with an intersection between optical paths of different temperature measurement channels can be used for temperature measurement.
  • N temperature measurement channels arranged in parallel, N ends of the incident optical paths away from the common node are collected to form a first interface 34, and N ends of the reflected optical paths away from the common node are formed to form In the second interface 35, the ends of the N output light paths away from the common node are collected to form a third interface 36.
  • first interface 34, the second interface 35, and the third interface 36 are docked to complete the coupling between the temperature measurement system and the planar optical waveguide device, thereby achieving modular docking.
  • the detection light source communicates with N incident light paths through the first interface 34
  • the photodetector is integrated in the planar optical waveguide device, and is vertically arranged near the substrate
  • One side of the second interface 34 that is, the photodetector and the substrate are perpendicular to each other, and the photodetector communicates with the N reflected light paths through the second interface 34.
  • Such an arrangement enables the optical signal output through the reflected optical path to be directly input into the input terminal of the photodetector 2 without first connecting to the reflected optical path through the optical fiber line, and then connecting the photodetector 2 through the optical fiber line
  • the input terminal connection reduces the use of connecting optical fibers, simplifies the connection of the optical path, improves the maintainability of the system, and can reduce costs.
  • the first interface 34 and the second interface 35 are provided together on one side of the substrate, and the third interface 36 is provided on the other side of the substrate. Since the first interface 34 and the second interface 35 need to be connected with the detection light source and the photodetector in the temperature measurement system, and the third interface needs to be connected with the measured object through the measurement fiber, such a setting makes the structure of the entire system More rationalized.
  • the substrate is a sheet-like structure
  • a slope 32 with an inclination angle is provided on one side of the substrate
  • the second interface is provided on the slope 32 on.
  • the inclination angle of the inclined table 32 is 40 ° to 50 °.
  • the inclination angle of the slant table 32 may also be 7 °, 8 °, or 45 °, or may be other angles.
  • the specific angle is determined according to the angle between the reflected light path and the horizontal in the substrate, usually It is suitable for the optical signal output by the reflected optical path to be emitted in a vertical horizontal plane after being reflected by the inclined table, and this application is not further limited.
  • the light information carrying the temperature information comes out of the reflected light path.
  • demodulation can obtain the temperature of the measured object.
  • the photodetector should be coupled with each reflected light path.
  • a tilt table is provided on the substrate. After the photodetector is attached to the tilt table, the optical information carrying the temperature information will directly enter the photodetector through the tilt table. In this way, the photodetector can perform the next demodulation.
  • the photodetector 2 is integrated in the planar optical waveguide device, and the photodetector 2 is disposed on the side close to the second interface 34 of the substrate.
  • the photodetector 2 is provided at different positions close to the second interface 34 of the substrate according to the tilt direction and tilt angle of the tilt table, for example: when the tilt table is tilted downward, the photodetector 2 is horizontally placed at Below the side of the second interface 34 of the substrate; when the tilt table is inclined downward, the photodetector 2 is horizontally placed above the side of the second interface 34 of the substrate; in addition,
  • the photodetector 2 may also be arranged at a certain angle of inclination above, below, to the left or right of the side close to the second interface 34 of the substrate, as long as the photodetector 2 can pass through the second The interface 34 only needs to communicate with the N reflected light paths.
  • the light signal output through the reflected light path can be directly injected into the input terminal of the photodetector 2 through the reflection of the inclined table 32 without first passing through the optical fiber line and the reflected light path Connect, and then connect to the input terminal of the photodetector 2 through the optical fiber line, so that the optical fiber can be saved and the cost can be reduced.
  • placing the photodetector 2 below or above the planar optical waveguide device that is, placing the photodetector 2 horizontally below or above the planar optical waveguide device, rather than perpendicularly to the substrate, can solve the problem
  • the photodetector is vertically installed, the larger width leads to the problem of a thicker planar optical waveguide device, so that the thickness of the planar optical waveguide device can be reduced, and thus the planar optical waveguide device can be made lighter and thinner.
  • a light splitting unit 33 is further provided in the substrate.
  • the light splitting unit 33 includes a light splitting input optical path 331 and N light splitting output optical paths 332, the output ends of the light splitting input optical path 331 are respectively connected to the input ends of the N light splitting output optical paths 332, and the N light splitting output
  • the output end of the optical path 332 is in one-to-one correspondence with the N incident light paths.
  • the detection light source 1 is connected to the input end of the split optical input optical path 331, and the multiple incident optical paths in the planar optical waveguide device 3 are respectively connected to the multiple split optical output optical paths 332.
  • the detection light needs to be connected to each incident optical path through the beam splitter, so that an additional beam splitter is required, and in order to enable the beam splitter to be connected to each incident optical path, Multiple transmission fibers are also required.
  • the solution provided in this application is to further provide a light splitting unit in the substrate.
  • the detection light enters the spectroscopic input optical path, and then is divided into multiple paths, and then output through multiple spectroscopic output optical paths, and enters multiple incident optical paths one by one. In this way, there is no need to additionally equip the optical splitter, which further simplifies the temperature measurement system.
  • the spectroscopic unit can be docked with the detection light only through the spectroscopic input optical path, in the second embodiment, there is no need to provide a first interface.
  • the number of temperature measurement channels may be 2, 3, 4, etc., or 12, 16, 18, or 24 temperature measurement channels may be provided according to actual needs. That is, N is an integer greater than 1.
  • the substrate is provided with four temperature measurement channels arranged in parallel.
  • the four temperature measurement channels 31 arranged in parallel include a first temperature measurement channel 314, a second temperature measurement channel 315, and a Three temperature measurement channels 316 and a fourth temperature measurement channel 317.
  • the incident optical path 311 in the first temperature measurement channel 314 is respectively in contact with the reflected optical path 312 in the second temperature measurement channel 315, the reflected optical path 312 in the third temperature measurement channel 316, and the fourth temperature measurement channel
  • the reflection optical path 312 in the 317 is provided with a cross point; the incident optical path 311 in the second temperature measurement channel 315 and the reflection optical path 312 in the third temperature measurement channel 316 and in the fourth temperature measurement channel 317 respectively
  • the reflected light path 312 is provided with intersections.
  • the incident light path 311 in the third temperature measurement channel 316 and the reflected light path 312 in the fourth temperature measurement channel 317 are provided with intersections.
  • FIGS. 2, 4, 5 and 6 are also laser transmission routes.
  • the dotted line indicates the laser transmission path, just to distinguish the different components.

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Abstract

一种平面光波导器件（3）及温度测量***，包括探测光源（1）、光电探测器（2）、平面光波导器件（3）和测量光纤（4）；平面光波导器件（3）包括一基片（5），基片（5）内设置有N个测温通道（31）；每个测温通道（31）包括入射光路（311）、反射光路（312）和出射光路（313）；在N个并列设置的测温通道（31）中，一个测温通道（31）的入射光路（311）与其它至少一个测温通道（31）的反射光路（312）之间设置有交叉点；探测光源（1）与入射光路（311）相连通，光电探测器（2）与反射光路（312）相连通，测量光纤（4）与出射光路（313）相连通；测量光纤（4）内设置有FBG传感器。进行多通道测温时，在N个并列设置的测温通道（31）中，一个测温通道（31）的入射光路（311）与其它至少一个测温通道（31）的反射光路（312）之间设置有交叉点，实现光信号的传输、测量和解调。

Description

一种平面光波导器件及温度测量***
本申请要求于2018年11月14日提交中国专利局、申请号为201811350200.4、发明名称为“一种平面光波导器件及温度测量***”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光纤传感技术领域，尤其涉及一种平面光波导器件及温度测量***。
背景技术
一般的温度测量***通常都借助温度传感器和红外测量仪等设备来探测物体的温度；更先进地，还可以通过光纤测温技术进行温度测量。FBG(fiberBragg grating，布拉格光纤光栅)传感器为光纤测温技术中的常用器件。FBG传感器与以电为基础的传感器有本质区别，FBG传感器用光作为敏感信息的载体，用光纤作为传递敏感信息的媒质，具有抗电磁干扰能力强和抗辐射性能好等优点，特别适合于易燃、易爆、空间受严格限制及强电磁干扰等恶劣环境下使用。新能源汽车电池测温便是很好的例子。由于新能源汽车的电池包的工作环境限制，传统温度传感器和红外测量仪无法适用于新能源汽车电池测温。因此，FBG传感器为新能源汽车电池测温的一种较优解决方案。
当温度测量点较多时，需要设置多个测温通道进行测温，而多个测温通道的光路之间难免存在交叉点。现有技术中，一般都在温度测量***和被测物体之间耦合有很多传输光纤，不同测温通道的光路之间通过传输光纤即可实现交叉。但在温度测量***和被测物体之间耦合传输光纤存在以下问题：一方面， 耦合大量的传输光纤耗时耗力，增加生产成本；另一方面，大量传输光纤使得温度测量***的结构变得非常复杂，不便于后续的维修保养。
发明内容
为了克服上述现有技术的不足，本申请提出了一种平面光波导器件及温度测量***，在利用FBG传感器进行温度测量的过程中，通过平面光波导器件取代现有技术中的传输光纤，能够简化设备的结构，减少设备的生产成本和维护成本，并便于后续的维修保养。
本申请解决上述技术问题的技术方案如下：一种平面光波导器件，包括一基片，所述基片内设置有N个并列设置的测温通道；其中，N为大于1的整数；
每个所述测温通道包括一个入射光路、一个反射光路和一个出射光路；在同一测温通道中，所述入射光路、所述反射光路和所述出射光路通过一共同结点相连通；
在N个并列设置的测温通道中，一个测温通道的入射光路与其它至少一个测温通道的反射光路之间设置有交叉点。
与现有技术相比，本技术方案的有益效果是：探测光从入射光路的一端进入到测温通道，并经过入射光路的另一端到达交叉点，进而进入出射光路；进入出射光路的探测光在经过FBG传感器时会反射回来携带温度信息的光信号，光信号传输回到交叉点后进入反射光路，并经反射光路进入光电探测器进行解调。当进行多通道测温时，在本技术方案的本平面光波导器件中，并不是如现有技术一般通过传输光纤来实现不同光路间的交叉，而是在N个并列设置的测温通道中，一个测温通道的入射光路与其它至少一个测温通道的反射光路之间设置有交叉点，实现光信号的传输、测量和解调。
本申请解决上述技术问题的技术方案如下：一种温度测量***，包括探测光源、光电探测器、平面光波导器件和测量光纤；
所述平面光波导器件包括一基片，所述基片内设置有N个并列设置的测温通道；其中，N为大于1的整数；
每个所述测温通道包括一个入射光路、一个反射光路和一个出射光路；在同一测温通道中，所述入射光路、所述反射光路和所述出射光路通过一共同结点相连通；
在N个并列设置的测温通道中，一个测温通道的入射光路与其它至少一个测温通道的反射光路之间设置有交叉点；
所述探测光源与所述入射光路上远离共同结点的一端相连通，所述光电探测器与所述反射光路上远离共同结点的一端相连通，所述测量光纤与所述出射光路上远离共同结点的一端相连通；
所述测量光纤内设置有FBG传感器。
与现有技术相比，本技术方案的有益效果是：探测光源发出的探测光从入射光路的一端进入到测温通道，并经过入射光路的另一端到达交叉点，进而进入出射光路；进入出射光路的探测光在经过FBG传感器时会反射回来携带温度信息的光信号，光信号传输回到交叉点后进入反射光路，并经反射光路进入光电探测器进行解调。当进行多通道测温时，在本技术方案中，并不是如现有技术一般通过传输光纤来实现不同光路间的交叉，而是在N个并列设置的测温通道中，一个测温通道的入射光路与其它至少一个测温通道的反射光路之间设置有交叉点，实现光信号的传输、测量和解调。
附图说明
图1为本申请一种平面光波导器件中一个测温通道的示意图；
图2为本申请一种平面光波导器件中一实施例的示意图；
图3为本申请一种平面光波导器件中斜台的示意图；
图4为本申请一种平面光波导器件中另一实施例的示意图；
图5为本申请一种温度测量***中第一实施例的示意图；
图6为本申请一种温度测量***中第二实施例的示意图；
图7为本申请一种平面光波导器件中另一实施例的示意图；
图8为本申请一种平面光波导器件中另一实施例的示意图。
图中，各标号所代表的部件列表如下：
1.探测光源，2.光电探测器，3.平面光波导器件，4.测量光纤，5.基片；
31.测温通道，32.斜台，33.分光单元，34.第一接口，35.第二接口，36.第三接口；
311.入射光路，312.反射光路，313.出射光路，314.第一测温通道，315.第二测温通道，316.第三测温通道，317.第四测温通道；
331.分光输入光路，332.分光输出光路。
具体实施方式
以下结合附图对本申请的原理和特征进行描述，所举实例只用于解释本申请，并非用于限定本申请的范围。
平面光波导，即PLC，Planar Lightwave Circuit。现有技术中的平面光波导器件多用于通信分光用，平面光波导器件一般包括一基片，在基片上通过光刻、腐蚀、显影等技术在基片上刻出光路，光信号通过反射在光路上向前传播。因此，平面光波导器件的工作原理为通过设置在基片上的光路把光信号往特定的方向传播。具体地，基片的材料可采用二氧化硅、铌酸锂和III-V族半导体化合物。
通信***对串扰的要求比较高，在通信分光用的平面光波导器件中，各个不同通信通道之间是不能够存在交叉点的。因此，当两个通信通道的光路需要交叉时，仅能通过光纤的方式对两个光路进行交叉，而无法在平面光波导器件 中实现两个通信通道的光路交叉。
如图1和图2所示，在第一实施例中，一种平面光波导器件，包括一基片，所述基片内设置有N个并列设置的测温通道31；其中，N为大于1的整数。在本申请中，至少设置有两个测温通道31，若平面光波导器件内仅设置有一个测温通道31，则不会出现不同测温通道31的光路之间的交叉。
N个并列设置的测温通道31中，每个所述测温通道31包括一个入射光路311、一个反射光路312和一个出射光路313。在同一测温通道31中，所述入射光路311、所述反射光路312和所述出射光路313通过一共同结点相连通；在N个并列设置的测温通道31中，一个测温通道的入射光路311与其它至少一个测温通道的反射光路312之间设置有交叉点。
上述平面光波导器件的工作原理为：各个入射光路311、反射光路312和出射光路313均通过远离交叉点的一端与温度测量***对接，探测光进入到测温通道31后，在入射光路311内向前传播，并经过交叉点进入出射光路313；温度测量***通过FBG传感器与出射光路313对接，探测光从交叉点进入出射光路313，当探测光遇到FBG传感器，FBG传感器会把携带有温度信息的光信息反射回来，反射的光信息再经过交叉点进入反射光路312，再由反射光路312送入温度测量***；温度测量***对携带有温度信息的光信息进行解调，即可得到被测点的温度，达到温度测量的目的。
如此一来，就算一个平面光波导器件内并列设置有多个测温通道，也可通过在一个测温通道的入射光路与其他测温通道的反射光路间设置交叉点对光路进行布局，而不需要通过现有技术的传输光纤来实现温度测量***与不同测温通道之间的对接。
需要说明的是，在现有技术的通信分光用的平面光波导器件内，若不同通信通道的光路之间存在交叉点，就会发生串扰。由于通信***较为敏感，这样的串扰会对通信产生极大影响。因此，在现有技术的平面光波导器件内，不同通道的光路之间不会存在交叉点。
本申请的发明点在于，在用于进行温度测量的平面光波导器件内，在N个并列设置的测温通道中，一个测温通道的入射光路与其它至少一个测温通道的反射光路之间设置有交叉点，如此一来，即不影响各个测温通道的温度测量功能，也无需在温度测量***和被测物体之间通过传输光纤对接，因此完全不存在由于光纤损坏而造成的故障，能够减少维护成本并便于后续的维修保养；同时，在把温度测量***装配在被测物体上时，直接通过本技术方案中的平面光波导器件就可完成耦合，而这样的平面光波导器件便于大规模生产，无需配备传输光纤，能够减少设备的生产成本。
当通过平面光波导器件结合FBG传感器进行温度测量时，温度测量***对串扰并不敏感。例如，当探测光从入射光路传播到交叉点后，大部分进入出射光路，但有小部分进入了反射光路，此时便出现了串扰。但温度测量***对精度的要求并不高，串扰并不影响温度测量***的正常工作。因此，不同测温通道的光路间存在交叉点的平面光波导器件能够用于温度测量。
如图2所示，在N个并列设置的测温通道中，N个所述入射光路远离共同结点的一端汇集形成第一接口34，N个所述反射光路远离共同结点的一端汇集形成第二接口35，N个所述出射光路远离共同结点的一端汇集形成第三接口36。
只需要在温度测量***的各个部件上设置有与第一接口34、第二接口35和第三接口36匹配的接口，通过温度测量***上的接口分别与第一接口34、第二接口35和第三接口36对接，就可以完成温度测量***与平面光波导器件的耦合，实现模块化对接。
优选地，第一接口34和第二接口35共同设置在基片的一侧，而第三接口36设置在基片的另一侧。由于第一接口34和第二接口35需要与温度测量***进行对接，而第三接口36需要通过测量光纤与被测物体进行对接，这样的设置，使得整个***的结构更加合理化。
如图7所示，在一实施方式中，所述平面光波导器件还集成有光电探测器2，该光电探测器2用于将光信号转换为电信号。该光电探测器2垂直设置于靠近 基片5的第二接口34的一侧，即该光电探测器2与基片5相互垂直，且该光电探测器2通过第二接口34与N个所述反射光路相连通。这样的设置，使得通过反射光路输出的光信号可以直接射入至光电探测器2中的输入端子中，而不用先通过光纤线路与该反射光路连接，然后再通过光纤线路与光电探测器2的输入端子连接，减少了连接光纤的使用，精简了光路的连接，提高***的可维护性，进而可以降低成本。
如图3、图8所示，所述基片为片状结构，所述基片的一侧边上设置带有倾角的斜台32，所述第二接口设置在所述斜台32上。优选地，斜台32的倾角角度为40°～50°，这样的设置的优点是工艺简单，耦合效率高，且可以使得反射光路输出的光信号经过斜台的反射之后可以垂直水平面射出。在本发明其他实施方式中，斜台32的倾角角度也可为7°、8°或者45°，也可以为其它的角度，具体角度根据基片内的反射光路与水平的夹角决定，通常以使反射光路输出的光信号经过斜台的反射之后可以垂直水平面射出为宜，本申请不作进一步限定。
从反射光路出来的为携带有温度信息的光信息，温度测量***从反射光路得到携带有温度信息的光信息后，再进行解调即可得到被测物体的温度。为了实现二者之间的光传输，温度测量***与各个反射光路之间要进行耦合。以光电探测器2为例说明斜台32的工作原理：在基片上设置有斜台32，把光电探测器2和基片相对固定，携带有温度信息的光信息经过斜台32后入射到光电探测器内。如此一来，光电探测器2便可进行下一步的解调。
需要说明的是，在本实施例中，该光电探测器2集成设置于平面光波导器件中，且该光电探测器2设置于靠近所述基片的第二接口34的一侧。具体地，光电探测器2根据斜台的倾斜方向和倾斜角度设置于靠近所述基片的第二接口34的不同位置，例如：当斜台向下倾斜时，将光电探测器2水平设置于靠近所述基片的第二接口34的一侧的下方；当斜台向上倾斜时，将光电探测器2水平设置于靠近所述基片的第二接口34的一侧的上方；此外，光电探测器2 也可以以一定的倾角角度设置于靠近所述基片的第二接口34的一侧的上方或者下方、左侧或右侧等，只要保证光电探测器2能够通过所述第二接口34与N个所述反射光路相连通即可。本发明实施例通过这样的设置，使得通过反射光路输出的光信号可以通过斜台32的反射而直接全部射入至光电探测器2中的输入端子中，而不用先通过光纤线路与该反射光路连接，然后再通过光纤线路与光电探测器2的输入端子连接，减少了连接光纤的使用，精简了光路的连接，提高***的可维护性，进而可以降低成本。此外，将光电探测器2设置于该平面光波导器件的下方或者上方，即将该光电探测器2水平放置在该平面光波导器件的下方或者上方，而不是与基片相互垂直设置，可以解决因光电探测器垂直设置时宽度较大导致平面光波导器件的厚度较厚的问题，从而可以降低平面光波导器件的厚度，进而实现平面光波导器件的轻薄化。
如图4所示，在第二实施例中，所述基片内还设置分光单元33。所述分光单元33包括一个分光输入光路331和N个分光输出光路332，所述分光输入光路331的输出端分别与N个所述分光输出光路332的输入端相连通，N个所述分光输出光路332的输出端与N个所述入射光路一一对应连通。
分光单元33的作用在于把探测光分为均匀的N份。为了实现这一目的，一个分光单元可由多个一分二光路组成。例如，分光单元包括一个分光输入光路和四个分光输出光路时，实际上，分光单元由三个一分二光路组成，具体的结构为第一个一分二光路的两个输出端分别与第二个一分二光路和第三个一分二光路的输入端相连，第二个一分二光路和第三个一分二光路的输出端则形成四个出口，由此实现一分四。当然，除了由多个一分二光路组成分光单元外，还可以直接如图4所示，由一个分光输入光路331和N个分光输出光路332组成分光单元33。
一般地，由于设置有多个测温通道，探测光需要经过分光器再分别接入到各个入射光路内，如此一来，就需要额外配备分光器，而为了使得分光器能与各个入射光路相连通，还需要设置有多个传输光纤。
对此，在本申请提供的解决方案为，在基片内还设置分光单元33。探测光进入分光输入光路331，然后被分为多路，再通过多个分光输出光路332输出，一一进入多个入射光路内。通过这样，便不需要额外配备分光器，进一步简化温度测量***。
需要说明的是，由于分光单元只通过分光输入光路即可与探测光对接，因此，在第二实施例中，无须设置有第一接口。
测温通道越多，若采用光纤进行耦合时***就越复杂；对应地，测温通道越多，实施本申请的有益效果越显著。具体地，测温通道的数量可为2、3、4等，也可根据实际需要，设置有12、16、18或者24个测温通道。即N为大于1的整数。
在第一实施例和第二实施例中均设置有4个测温通道。如图2和图4所示，所述基片内设置有4个并列设置的测温通道，4个并列设置的测温通道31包括第一测温通道314、第二测温通道315、第三测温通道316和第四测温通道317。
所述第一测温通道314中的入射光路311分别与所述第二测温通道315中的反射光路312、所述第三测温通道316中的反射光路312和所述第四测温通道317中的反射光路312设置有交叉点。所述第二测温通道315中的入射光路311分别与所述第三测温通道316中的反射光路312和所述第四测温通道317中的反射光路312设置有交叉点。所述第三测温通道316中的入射光路311与所述第四测温通道317中的反射光路312设置有交叉点。
因此，在第一实施例和第二实施例中，共设置有6个交叉点。若通过光纤进行对接，则需要12根光纤，这将使得温度测量***变得非常复杂，不便于后续的维修保养。
下面对一种温度测量***进行详细说明。
如图1和图5所示，在第一实施例中，一种温度测量***，包括探测光源1、光电探测器2、平面光波导器件3和测量光纤4。所述平面光波导器件3包括一基片，所述基片内设置有N个并列设置的测温通道；其中，N为大于1的整数。在 本申请中，至少设置有两个测温通道，若平面光波导器件内仅设置有一个测温通道，则不会出现不同测温通道的光路之间的交叉。
每个所述测温通道31包括一个入射光路311、一个反射光路312和一个出射光路313；在同一测温通道31中，所述入射光路311、所述反射光路312和所述出射光路313通过一共同结点相连通。在N个并列设置的测温通道31中，一个测温通道的入射光路311与其它至少一个测温通道的反射光路312之间设置有交叉点。
所述探测光源1与所述入射光路311上远离共同结点的一端相连通，所述光电探测器2与所述反射光路312上远离共同结点的一端相连通，所述测量光纤4与所述出射光路313上远离共同结点的一端相连通；所述测量光纤4内设置有FBG传感器。
温度测量***进行温度测量的原理为：探测光源发出探测光，探测光沿着测量光纤传播；测量光纤内设置有FBG传感器，FBG传感器在不同的温度下，由于热胀冷缩的作用会呈现不同的光纤光栅结构，探测光传播到FBG传感器时会发生反射，把携带有温度信息的光信息反射回来，而不同温度下由于光纤光栅结构不同，FBG传感器会反射回不同波长的光信息，光电探测器接收到反射回来的携带有温度信息的光信息，并与探测光源发出探测光进行对比，根据中心波长偏移量即可得到温度值，完成测温。
结合平面光波导器件说明温度测量***的工作原理：各个入射光路、反射光路和出射光路均通过远离交叉点的一端与温度测量***对接，其中，入射光路通过远离交叉点的一端与探测光源对接，反射光路通过远离交叉点的一端与光电探测器对接，出射光路通过远离交叉点的一端与测量光纤对接；探测光从探测光源进入到测温通道后，在入射光路内向前传播，并经过交叉点进入出射光路；测量光纤内的FBG传感器与出射光路对接，探测光从交叉点进入出射光路，当探测光遇到FBG传感器，FBG传感器会把携带有温度信息的光信息反射回来，反射的光信息再经过交叉点进入反射光路，再由反射光路送入光电探测 器；温度测量***通过光电探测器对携带有温度信息的光信息进行解调，即可得到被测点的温度，达到温度测量的目的。
如此一来，就算一个平面光波导器件内并列设置有多个测温通道，也可通过在一个测温通道的入射光路与其他测温通道的反射光路间设置交叉点对光路进行布局，而不需要通过现有技术的传输光纤来实现温度测量***与不同测温通道之间的对接。
需要说明的是，在现有技术的通信分光用的平面光波导器件内，若不同通信通道的光路之间存在交叉点，就会发生串扰，由于通信***较为敏感，这样的串扰会对通信产生极大影响，因此，在现有技术的平面光波导器件内，不同通道的光路之间不会存在交叉点。
本申请的发明点在于，在用于进行温度测量的平面光波导器件内，在N个并列设置的测温通道中，一个测温通道的入射光路与其它至少一个测温通道的反射光路之间设置有交叉点，如此一来，即不影响各个测温通道的温度测量功能，也无需在温度测量***和被测物体之间通过传输光纤对接，因此完全不存在由于光纤损坏而造成的故障，能够减少维护成本并便于后续的维修保养；同时，在把测量光纤装配在被测物体上时，直接通过本技术方案中的平面光波导器件就可完成耦合，而这样的平面光波导器件便于大规模生产，无需配备传输光纤，能够减少设备的生产成本。
当通过平面光波导器件结合FBG传感器进行温度测量时，温度测量***对串扰并不敏感。例如，当探测光从探测光源经入射光路传播到交叉点后，大部分进入出射光路，但有小部分进入了反射光路，此时便出现了串扰。但温度测量***对精度的要求并不高，串扰并不影响温度测量***的正常工作。因此，不同测温通道的光路间存在交叉点的平面光波导器件能够用于温度测量。
如图5所示，在N个并列设置的测温通道中，N个所述入射光路远离共同结点的一端汇集形成第一接口34，N个所述反射光路远离共同结点的一端汇集形成第二接口35，N个所述出射光路远离共同结点的一端汇集形成第三接口36。
只需要在探测光源、光电探测器和测量光纤上分别设置有与第一接口34、第二接口35和第三接口36匹配的接口，通过探测光源、光电探测器和测量光纤上的接口分别与第一接口34、第二接口35和第三接口36对接，就可以完成温度测量***与平面光波导器件的耦合，实现模块化对接。
具体地，所述探测光源通过所述第一接口34与N个所述入射光路相连通，所述光电探测器集成设置于所述平面光波导器件中，且垂直设置于靠近所述基片的第二接口34的一侧，即该光电探测器与基片相互垂直，且该光电探测器通过第二接口34与N个所述反射光路相连通。这样的设置，使得通过反射光路输出的光信号可以直接射入至光电探测器2中的输入端子中，而不用先通过光纤线路与该反射光路连接，然后再通过光纤线路与光电探测器2的输入端子连接，减少了连接光纤的使用，精简了光路的连接，提高***的可维护性，进而可以降低成本。
优选地，第一接口34和第二接口35共同设置在基片的一侧，而第三接口36设置在基片的另一侧。由于第一接口34和第二接口35需要与温度测量***中的探测光源和光电探测器进行对接，而第三接口需要通过测量光纤与被测物体进行对接，这样的设置，使得整个***的结构更加合理化。
优选地，如图3、图8所示，所述基片为片状结构，所述基片的一侧边上设置带有倾角的斜台32，所述第二接口设置在所述斜台32上。优选地，斜台32的倾角角度为40°～50°，这样的设置的优点是工艺简单，耦合效率高，且可以使得反射光路输出的光信号经过斜台的反射之后可以垂直水平面射出。在本发明其他实施方式中，斜台32的倾角角度也可为7°、8°或者45°，也可以为其它的角度，具体角度根据基片内的反射光路与水平的夹角决定，通常以使反射光路输出的光信号经过斜台的反射之后可以垂直水平面射出为宜，本申请不作进一步限定。
从反射光路出来的为携带有温度信息的光信息，光电探测器从反射光路得到携带有温度信息的光信息后，再进行解调即可得到被测物体的温度。为了实 现二者之间的光传输，光电探测器与各个反射光路之间要进行耦合。在基片上设置有斜台，把光电探测器贴在斜台上后，携带有温度信息的光信息会直接经过斜台进入到光电探测器内。如此一来，光电探测器便可进行下一步的解调。
需要说明的是，在本实施例中，该光电探测器2集成设置于平面光波导器件中，且该光电探测器2设置于靠近所述基片的第二接口34的一侧。具体地，光电探测器2根据斜台的倾斜方向和倾斜角度设置于靠近所述基片的第二接口34的不同位置，例如：当斜台向下倾斜时，将光电探测器2水平设置于靠近所述基片的第二接口34的一侧的下方；当斜台向下倾斜时，将光电探测器2水平设置于靠近所述基片的第二接口34的一侧的上方；此外，光电探测器2也可以以一定的倾角角度设置于靠近所述基片的第二接口34的一侧的上方、下方、左侧或右侧等，只要保证光电探测器2能够通过所述第二接口34与N个所述反射光路相连通即可。本发明实施例通过这样的设置，使得通过反射光路输出的光信号可以通过斜台32的反射而直接全部射入至光电探测器2中的输入端子中，而不用先通过光纤线路与该反射光路连接，然后再通过光纤线路与光电探测器2的输入端子连接，从而可以节省光纤，进而降低成本。此外，将光电探测器2设置于该平面光波导器件的下方或者上方，即将该光电探测器2水平放置在该平面光波导器件的下方或者上方，而不是与基片相互垂直设置，可以解决因光电探测器垂直设置时宽度较大导致平面光波导器件的厚度较厚的问题，从而可以降低平面光波导器件的厚度，进而实现平面光波导器件的轻薄化。
如图4和图6所示，在第二实施例中，所述基片内还设置分光单元33。所述分光单元33包括一个分光输入光路331和N个分光输出光路332，所述分光输入光路331的输出端分别与N个所述分光输出光路332的输入端相连通，N个所述分光输出光路332的输出端与N个所述入射光路一一对应连通。所述探测光源1与所述分光输入光路331的输入端相连，而平面光波导器件3中的多个入射光路分别与多个分光输出光路332相连。
一般地，由于设置有多个测温通道，探测光需要经过分光器再分别接入到各个入射光路内，如此一来，就需要额外配备分光器，而为了使得分光器能与各个入射光路，还需要设置有多个传输光纤。
对此，在本申请提供的解决方案为在基片内还设置分光单元。探测光进入分光输入光路，然后被分为多路，再通过多个分光输出光路输出，一一进入多个入射光路内。通过这样，便不需要额外配备分光器，进一步简化温度测量***。
需要说明的是，由于分光单元只通过分光输入光路即可与探测光对接，因此，在第二实施例中，无须设置有第一接口。
测温通道越多，若采用光纤进行耦合时***就越复杂；对应地，测温通道越多，实施本申请的有益效果越显著。具体地，测温通道的数量可为2、3、4等，也可根据实际需要，设置有12、16、18或者24个测温通道。即N为大于1的整数。
在第一实施例和第二实施例中均设置有4个测温通道。如图5和图6所示，所述基片内设置有4个并列设置的测温通道，4个并列设置的测温通道31包括第一测温通道314、第二测温通道315、第三测温通道316和第四测温通道317。
所述第一测温通道314中的入射光路311分别与所述第二测温通道315中的反射光路312、所述第三测温通道316中的反射光路312和所述第四测温通道317中的反射光路312设置有交叉点；所述第二测温通道315中的入射光路311分别与所述第三测温通道316中的反射光路312和所述第四测温通道317中的反射光路312设置有交叉点。所述第三测温通道316中的入射光路311与所述第四测温通道317中的反射光路312设置有交叉点。
因此，在第一实施例和第二实施例中，共设置有6个交叉点。若通过光纤进行对接，则需要12根光纤，这将使得温度测量***变得非常复杂，不便于后续的维修保养。
需要说明的是，图2、图4、图5和图6中的虚线也为激光传输的路线。通过 虚线表示激光传输路线，只是为了区分开不同的部件。
以上所述仅为本申请的较佳实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种平面光波导器件，包括一基片，所述基片内设置有N个并列设置的测温通道；其中，N为大于1的整数；
    每个所述测温通道包括一个入射光路、一个反射光路和一个出射光路；在同一测温通道中，所述入射光路、所述反射光路和所述出射光路通过一共同结点相连通；
    在N个并列设置的测温通道中，一个测温通道的入射光路与其它至少一个测温通道的反射光路之间设置有交叉点。
  2. 根据权利要求1所述的一种平面光波导器件，在N个并列设置的测温通道中，N个所述入射光路远离共同结点的一端汇集形成第一接口，N个所述反射光路远离共同结点的一端汇集形成第二接口，N个所述出射光路远离共同结点的一端汇集形成第三接口。
  3. 根据权利要求2所述的一种平面光波导器件，所述基片为片状结构，所述基片的一侧边上设置带有倾角的斜台，所述第二接口设置在所述斜台上。
  4. 根据权利要求1所述的一种平面光波导器件，所述基片内还设置分光单元；
    所述分光单元包括一个分光输入光路和N个分光输出光路，所述分光输入光路的输出端分别与N个所述分光输出光路的输入端相连通，N个所述分光输出光路的输出端与N个所述入射光路一一对应连通。
  5. 根据权利要求2所述的一种平面光波导器件，所述基片内还设置分光单元；
    所述分光单元包括一个分光输入光路和N个分光输出光路，所述分光输入光路的输出端分别与N个所述分光输出光路的输入端相连通，N个所述分光输出光路的输出端与N个所述入射光路一一对应连通。
  6. 根据权利要求3所述的一种平面光波导器件，所述基片内还设置分光单元；
    所述分光单元包括一个分光输入光路和N个分光输出光路，所述分光输入光路的输出端分别与N个所述分光输出光路的输入端相连通，N个所述分光输出光路的输出端与N个所述入射光路一一对应连通。
  7. 根据权利要求2所述的一种平面光波导器件，所述平面光波导器件还包括：
    光电探测器，所述光电探测器垂直设置于靠近所述基片的第二接口的一侧，所述光电探测器通过所述第二接口与N个所述反射光路相连通。
  8. 根据权利要求3所述的一种平面光波导器件，所述平面光波导器件还包括：
    光电探测器，所述光电探测器设置于靠近所述基片的第二接口的一侧，所述光电探测器通过所述第二接口与N个所述反射光路相连通。
  9. 根据权利要求3所述的一种平面光波导器件，所述斜台的倾角角度为40°～50°。
  10. 根据权利要求1所述的一种平面光波导器件，所述基片内设置有4个并列设置的测温通道，4个并列设置的测温通道包括第一测温通道、第二测温通道、第三测温通道和第四测温通道；
    所述第一测温通道中的入射光路分别与所述第二测温通道中的反射光路、所述第三测温通道中的反射光路和所述第四测温通道中的反射光路设置有交叉点；
    所述第二测温通道中的入射光路分别与所述第三测温通道中的反射光路和所述第四测温通道中的反射光路设置有交叉点；
    所述第三测温通道中的入射光路与所述第四测温通道中的反射光路设置有交叉点。
  11. 一种温度测量***，包括探测光源、光电探测器、平面光波导器 件和测量光纤；
    所述平面光波导器件包括一基片，所述基片内设置有N个并列设置的测温通道；其中，N为大于1的整数；
    每个所述测温通道包括一个入射光路、一个反射光路和一个出射光路；在同一测温通道中，所述入射光路、所述反射光路和所述出射光路通过一共同结点相连通；
    在N个并列设置的测温通道中，一个测温通道的入射光路与其它至少一个测温通道的反射光路之间设置有交叉点；
    所述探测光源与所述入射光路上远离共同结点的一端相连通，所述光电探测器与所述反射光路上远离共同结点的一端相连通，所述测量光纤与所述出射光路上远离共同结点的一端相连通；
    所述测量光纤内设置有FBG传感器。
  12. 根据权利要求11所述的一种温度测量***，在N个并列设置的测温通道中，N个所述入射光路远离共同结点的一端汇集形成第一接口，N个所述反射光路远离共同结点的一端汇集形成第二接口，N个所述出射光路远离共同结点的一端汇集形成第三接口；
    所述探测光源通过所述第一接口与N个所述入射光路相连通，所述光电探测器通过所述第二接口与N个所述反射光路相连通，所述测量光纤通过所述第三接口与N个所述出射光路相连通。
  13. 根据权利要求12所述的一种温度测量***，所述基片为片状结构，所述基片的一侧边上设置带有倾角的斜台，所述第二接口设置在所述斜台上；
    所述光电探测器设置在所述斜台的外侧，所述反射光路内的激光信号在所述斜台进行反射后，进入所述光电探测器。
  14. 根据权利要求11所述的一种温度测量***，所述基片内还设置分光单元；
    所述分光单元包括一个分光输入光路和N个分光输出光路，所述分光输 入光路的输出端分别与N个所述分光输出光路的输入端相连通，N个所述分光输出光路的输出端与N个所述入射光路一一对应连通；
    所述探测光源与所述分光输入光路的输入端相连。
  15. 根据权利要求12所述的一种温度测量***，所述基片内还设置分光单元；
    所述分光单元包括一个分光输入光路和N个分光输出光路，所述分光输入光路的输出端分别与N个所述分光输出光路的输入端相连通，N个所述分光输出光路的输出端与N个所述入射光路一一对应连通；
    所述探测光源与所述分光输入光路的输入端相连。
  16. 根据权利要求13所述的一种温度测量***，所述基片内还设置分光单元；
    所述分光单元包括一个分光输入光路和N个分光输出光路，所述分光输入光路的输出端分别与N个所述分光输出光路的输入端相连通，N个所述分光输出光路的输出端与N个所述入射光路一一对应连通；
    所述探测光源与所述分光输入光路的输入端相连。
  17. 根据权利要求12所述的一种温度测量***，其特征在于：所述光电探测器集成设置于所述平面光波导器件中，所述光电探测器垂直设置于靠近所述基片的第二接口的一侧。
  18. 根据权利要求13所述的一种温度测量***，其特征在于：所述光电探测器集成设置于所述平面光波导器件中，所述光电探测器设置于靠近所述基片的第二接口的一侧。
  19. 根据权利要求13所述的一种温度测量***，其特征在于：所述斜台的倾角角度为40°～50°。
  20. 根据权利要求11所述的一种温度测量***，其特征在于：所述基片内设置有4个并列设置的测温通道，4个并列设置的测温通道包括第一测温通道、第二测温通道、第三测温通道和第四测温通道；
    所述第一测温通道中的入射光路分别与所述第二测温通道中的反射光路、所述第三测温通道中的反射光路和所述第四测温通道中的反射光路设置有交叉点；
    所述第二测温通道中的入射光路分别与所述第三测温通道中的反射光路和所述第四测温通道中的反射光路设置有交叉点；
    所述第三测温通道中的入射光路与所述第四测温通道中的反射光路设置有交叉点。
PCT/CN2019/116731 2018-11-14 2019-11-08 一种平面光波导器件及温度测量*** WO2020098577A1 (zh)

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