WO2020098055A1

WO2020098055A1 - Transfer printing apparatus

Info

Publication number: WO2020098055A1
Application number: PCT/CN2018/121784
Authority: WO
Inventors: 秦艺
Original assignee: 惠科股份有限公司; 重庆惠科金渝光电科技有限公司
Priority date: 2018-11-14
Filing date: 2018-12-18
Publication date: 2020-05-22
Also published as: CN209402964U

Abstract

A transfer printing apparatus, the transfer apparatus comprising a first substrate, a plurality of bosses provided on the first substrate, and detachable flexible adhesive layers provided on the bosses. The provision of a plurality of bosses on the first substrate and the provision of a flexible adhesive layer on each boss allows for components to be correspondingly adhered to the bosses by means of the flexible adhesive layers, and finally for the components to be detached from the bosses by means of irradiation, accomplishing transfer printing of a plurality of components simultaneously. The invention is thus simple and convenient. In addition, because the flexible adhesive layers can be separated from the bosses, the bosses can be reused for transfer printing of components, further reducing the costs of transfer printing.

Description

转印装置Transfer device

本申请要求于2018年11月14日提交中国专利局，申请号为201821880919.4，发明名称为“转印装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application requires the priority of the Chinese patent application filed on November 14, 2018 with the application number 201821880919.4 and the invention titled "transfer device", the entire contents of which are incorporated by reference in this application.

技术领域Technical field

本申请涉及显示器技术领域，尤其涉及一种转印装置。The present application relates to the technical field of displays, in particular to a transfer device.

背景技术Background technique

这里的陈述仅提供与本申请有关的背景信息，而不必然构成现有技术。Micro LED(Micro Light Emitting Diode，微型发光二极管)技术已逐渐成熟，并可逐步导入显示装置，然而Micro LED的芯片生产虽然比较成熟，但将晶片移转则较为耗时，现已成为限制LED显示技术发展的瓶颈技术。The statements here only provide background information related to the present application and do not necessarily constitute prior art. Micro LED (Micro Light Emitting Diode) technology has gradually matured and can be gradually introduced into display devices. However, although the production of Micro LED chips is relatively mature, it is more time-consuming to transfer chips, and it has become a limitation of LED display Technology development bottleneck technology.

目前，市场上的转印装置是通过弹性印模结合高精度运动控制打印头，有选择的拾取微型元器件，并将其打印至目标基板上，该种装置通过改变打印头的速度，选择性调整弹性印模和被转移器件之间的黏附力，从而准确的控制转印的工艺。然而这种转印成本较高，效率较低，不利于后期的大规模转印。At present, the transfer device on the market controls the print head through an elastic die combined with high-precision motion, selectively picks up micro-components and prints them on the target substrate. This device can selectively Adjust the adhesion between the elastic stamp and the transferred device to accurately control the transfer process. However, this kind of transfer cost is higher and the efficiency is lower, which is not conducive to large-scale transfer in the later period.

申请内容Application content

本申请的一个目的在于提供一种转印装置，包括但不限于降低转印装置成本、提高转印效率。An object of the present application is to provide a transfer device, including but not limited to reducing the cost of the transfer device and improving the transfer efficiency.

一种转印装置，包括：A transfer device, including:

第一基板；First substrate

若干凸台，设置于所述第一基板上；A plurality of bosses are provided on the first substrate;

柔性胶层，可分离设置于所述凸台上，设置为粘结待转印的元器件，并设置为通过光照射实现与所述元器件的解黏分离。The flexible adhesive layer can be detachably arranged on the boss, is arranged to bond the components to be transferred, and is arranged to realize the debonding and separation of the components by light irradiation.

本申请的另一目的在于提供一种转印装置，包括：Another object of the present application is to provide a transfer device, including:

第一基板；First substrate

若干凸台，一体连接于所述第一基板；Several bosses are integrally connected to the first substrate;

第二基板，设置为安装待转印的元器件；The second substrate is set to install the components to be transferred;

第二卡扣结构，呈间隔可拆卸设置于所述第二基板上，设置为连接所述元器件；The second snap structure is detachably arranged on the second substrate at intervals, and is arranged to connect the components;

柔性胶层，可分离设置于所述凸台上，设置为将待转印的元器件对应粘结于各所述凸台上，所述柔性胶层为可通过光照射实现与所述元器件解黏分离、通过清洗实现与所述凸台分离的胶层；A flexible adhesive layer can be detachably arranged on the boss, and is configured to correspondingly adhere the components to be transferred to each of the bosses, and the flexible adhesive layer can be realized with the components by light irradiation Adhesive separation, adhesive layer separated from the boss by cleaning;

所述柔性胶层的宽度等于或小于各所述凸台的宽度。The width of the flexible adhesive layer is equal to or smaller than the width of each boss.

本申请实施例提供的转印装置，通过在第一基板上设置若干凸台，并在各凸台上设置柔性胶层，这样，可通过柔性胶层将元器件对应粘结于上述凸台上，最后通过光照将柔性胶层解黏，将元器件从凸台上拆掉，同步实现对多个元器件的转印，简单便捷、提高了生产效率，且柔性胶层成本较低，从而有利于后期元器件的大规模转印，此外，由于该柔性胶层可与凸台分离，从而可重复利用上述凸台实现对元器件的转印，进一步降低了转印的成本。In the transfer device provided by the embodiment of the present application, a plurality of bosses are provided on the first substrate, and a flexible adhesive layer is provided on each boss, so that the components can be correspondingly bonded to the bosses through the flexible adhesive layer , Finally, the flexible adhesive layer is debonded by light, and the components are removed from the boss, and the transfer of multiple components is realized simultaneously, which is simple and convenient, and improves the production efficiency, and the cost of the flexible adhesive layer is low, which has It is beneficial to the large-scale transfer of components in the later period. In addition, because the flexible adhesive layer can be separated from the boss, the above-mentioned boss can be reused to realize the transfer of the components, further reducing the cost of transfer.

附图说明BRIEF DESCRIPTION

为了更清楚地说明本申请实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。In order to more clearly explain the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only for the application For some embodiments, those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

图1为本实用新型实施例提出的转印装置元器件转印前的结构示意图；1 is a schematic structural diagram of components of a transfer device before transfer according to an embodiment of the present invention;

图2为本实用新型实施例提出的转印装置元器件转印后的结构示意图；2 is a schematic diagram of the structure of the transfer device components after the transfer of the embodiment of the utility model after transfer;

图3为本实用新型实施例提出的第一基板及元器件的结构示意图；3 is a schematic structural diagram of a first substrate and components proposed by an embodiment of the present invention;

图4为本实用新型实施例提出的图3中的A的放大图；4 is an enlarged view of A in FIG. 3 proposed by an embodiment of the utility model;

图5为本实用新型实施例提出的第一种第一基板及凸台的连接结构示意图；5 is a schematic diagram of a connection structure between a first substrate and a boss according to an embodiment of the present invention;

图6为本实用新型实施例提出的图5中的B的放大图；6 is an enlarged view of B in FIG. 5 proposed by an embodiment of the utility model;

图7为本实用新型实施例提出的第二种第一基板及凸台的连接结构示意图；7 is a schematic diagram of a second connection structure between a first substrate and a boss according to an embodiment of the present invention;

图8为本实用新型实施例提出的图7中的C的放大图。8 is an enlarged view of C in FIG. 7 proposed by an embodiment of the present invention.

具体实施方式detailed description

为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不设置为限定本申请。In order to make the purpose, technical solutions and advantages of the present application more clear, the present application will be described in further detail in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not intended to limit the present application.

需说明的是，当部件被称为“固定于”或“设置于”另一个部件，它可以直接在另一个部件上或者间接在该另一个部件上。当一个部件被称为是“连接于”另一个部件，它可以是直接或者间接连接至该另一个部件上。术语“上”、“下”、“左”、“右”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本专利的限制，对于本领域的普通技术人员而言，可以根据具体情况理解上述术语的具体含义。术语“第一”、“第二”仅设置为便于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明技术特征的数量。“多个”的含义是两个或两个以上，除非另有明确具体的限定。It should be noted that when a component is referred to as being “fixed” or “disposed on” another component, it can be directly on another component or indirectly on the other component. When a component is said to be "connected to" another component, it can be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", etc. indicate the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, only for the convenience of description, not to indicate or imply the device referred to Or the element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meaning of the above terms can be understood according to specific circumstances. The terms "first" and "second" are only provided for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more, unless otherwise specifically limited.

为了说明本申请所述的技术方案，以下结合具体附图及实施例进行详细说明。In order to explain the technical solutions described in this application, the following detailed description will be made in conjunction with specific drawings and embodiments.

如图1～8示出了本申请实施例提供的一种转印装置，参考图1、图2和图7，该转印装置包括第一基板1，在上述第一基板1上设置有若干凸台4，在上述各凸台4上分别设有柔性胶层5，该柔性胶层5可分离设置于上述凸台4上。这样，通过在第一基板1上设置若干凸台4，并在各凸台4上设置柔性胶层5；从而通过柔性胶层5将待转印的元器件2对应粘结于上述凸台4上，最后通过光照将元器件2从凸台4上拆掉，同步实现对多个元器件2的转印，简单便捷、提高了生产效率，且柔性胶层5成本较低，从而有利于后期元器件2的大规模转印，此外，由于上述柔性胶层5可与上述凸台分离，从而可重复利用上述凸台4实现对元器件2的转印，进一步降低了转印的成本。1 to 8 show a transfer device provided by an embodiment of the present application. Referring to FIGS. 1, 2 and 7, the transfer device includes a first substrate 1, and a plurality of The boss 4 is provided with a flexible adhesive layer 5 on each of the bosses 4, and the flexible adhesive layer 5 can be detachably provided on the boss 4. In this way, a plurality of bosses 4 are provided on the first substrate 1, and a flexible adhesive layer 5 is provided on each boss 4; thus, the component 2 to be transferred is correspondingly bonded to the boss 4 through the flexible adhesive layer 5 Finally, the component 2 is removed from the boss 4 through the light, and the transfer of multiple components 2 is realized simultaneously, which is simple and convenient, and improves the production efficiency, and the cost of the flexible adhesive layer 5 is lower, which is beneficial to the later stage Large-scale transfer of the component 2. In addition, since the flexible adhesive layer 5 can be separated from the boss, the boss 4 can be reused to transfer the component 2, which further reduces the cost of transfer.

在一个实施例中，上述柔性胶层5采用UV(Ultraviolet Rays，紫外光线)解黏性胶制作的薄膜层制备，这样，通过将上述柔性胶层5设置为UV解黏性胶层，从而可通过UV光照使得柔性胶层5发生交联反应而容易被去除。当然，在本实施例中，上述柔性胶层5也可采用丙烯酸树脂或光引发剂材料制备，此处不作唯一限定。In one embodiment, the flexible adhesive layer 5 is prepared using a thin film layer made of UV (Ultraviolet Rays) debonding adhesive. In this way, by setting the flexible adhesive layer 5 as a UV debonding adhesive layer, With UV light, the flexible adhesive layer 5 undergoes a cross-linking reaction and is easily removed. Of course, in this embodiment, the flexible adhesive layer 5 may also be made of acrylic resin or photoinitiator material, which is not limited here.

在一个实施例中，上述柔性胶层5呈圆形设置，这样，保证了柔性胶层5具有较大的表面积，从而可将上述元器件2更好的黏贴于上述凸台4上，增大柔性胶层5的粘附力。当然，在本实施例中，上述柔性胶层5也可呈圆形长方形或正方形等其他形状设置，此处不作唯一限定。In one embodiment, the flexible adhesive layer 5 is arranged in a circular shape, which ensures that the flexible adhesive layer 5 has a large surface area, so that the component 2 can be better adhered to the boss 4 to increase The adhesion of the large flexible adhesive layer 5. Of course, in this embodiment, the above-mentioned flexible adhesive layer 5 may also be provided in other shapes such as a round rectangle or a square, which is not limited herein.

在一个实施例中，上述柔性胶层5呈透明状设置，这样，可增强光照的透过性，使得在解黏过程中效果较好，当然，在本实施例中，根据实际情况和具体需求，上述柔性胶层5也可设置半透明状等，此处不作唯一限定。In one embodiment, the above-mentioned flexible adhesive layer 5 is provided in a transparent state, which can enhance the transparency of light and make the effect better during the debonding process. Of course, in this embodiment, according to the actual situation and specific needs The above-mentioned flexible adhesive layer 5 may also be provided with a translucent shape, etc., which is not limited here.

在一个实施例中，上述柔性胶层5的厚度设置为1～2毫米，这样，可保证柔性胶层5具有一定的粘度，与此同时，也防止柔性胶层5厚度太大，增大制作的成本，当然，在本实施例中，根据实际情况和具体需求，上述柔性胶层5的厚度也可以设置为其他，此处不作唯一限定。In one embodiment, the thickness of the flexible adhesive layer 5 is set to 1 to 2 mm, so as to ensure that the flexible adhesive layer 5 has a certain viscosity, and at the same time, it also prevents the flexible adhesive layer 5 from being too thick and increasing the manufacturing Of course, in this embodiment, according to actual conditions and specific requirements, the thickness of the flexible adhesive layer 5 may also be set to other, which is not limited here.

在一个实施例中，上述柔性胶层5通过粘结的方式覆盖于上述凸台4上，通过粘结方式，一方面可实现将上述元器件2安装于上述凸台4上，另一方面，可通过药液将上述凸台4上的柔性胶层5清洗掉，便于后续上述凸台4的重复利用，降低了生产成本。当然，在本实施例中，上述各柔性胶层5也可通过热压、印刷、或涂覆等方式安装于上述各凸台4上，此处不作唯一限定。In one embodiment, the flexible adhesive layer 5 is covered on the boss 4 by means of adhesion. On the one hand, the component 2 can be mounted on the boss 4 by means of adhesion. On the other hand, The flexible adhesive layer 5 on the boss 4 can be washed away by a chemical solution, which facilitates the subsequent reuse of the boss 4 and reduces the production cost. Of course, in this embodiment, the above-mentioned flexible adhesive layers 5 can also be installed on the above-mentioned bosses 4 by means of hot pressing, printing, or coating, which is not limited herein.

在一个实施例中，请参阅图2所示，上述各凸台4呈倒梯形设置，且该倒梯形凸台4的面积较大端连接上述第一基板1上。这样，通过设置为倒梯形，一方面使得凸台4与第一基板1的接触面较大，增大了两者之间的结合力，另一方面，倒梯形凸台4的底部面积大于顶部面积，从第一基板1的一侧投射的UV光经过底部进入凸台4后，可以直接经过顶部射出，均匀的照射到柔性胶层5上，而采用底部面积小、顶部面积大的凸台4，则会在凸台4侧壁上发生反射和折射，导致UV光强度不均匀，影响柔性胶层5的剥离效果。当然，在本实施例中，上述各凸台4也可呈圆柱形等其他形状设置，此处不作唯一限定。In one embodiment, as shown in FIG. 2, each of the bosses 4 has an inverted trapezoidal shape, and the larger area of the inverted trapezoidal boss 4 is connected to the first substrate 1. In this way, by setting the inverted trapezoid, on the one hand, the contact surface between the boss 4 and the first substrate 1 is larger, and the bonding force between the two is increased. On the other hand, the bottom area of the inverted trapezoidal boss 4 is larger than the top Area, after the UV light projected from the side of the first substrate 1 enters the boss 4 through the bottom, it can be directly emitted through the top and be evenly irradiated onto the flexible adhesive layer 5, and a boss with a small bottom area and a large top area is used 4, reflection and refraction will occur on the side wall of the boss 4, resulting in uneven UV light intensity and affecting the peeling effect of the flexible adhesive layer 5. Of course, in this embodiment, the above-mentioned bosses 4 may also be provided in other shapes such as a cylindrical shape, which is not limited herein.

在一个实施例中，请参阅图2所示，上述若干凸台4与上述第一基板1一体成型。通过一体成型，从而增强了凸台4与第一基板1之间的结合力，提升了凸台4与第一基板1的使用寿命。当然，在本实施例中，根据实际情况和具体需求，上述若干凸台4也可通过其他方式与第一基板1连接，此处不作唯一限定。In one embodiment, please refer to FIG. 2, the above-mentioned several bosses 4 are integrally formed with the above-mentioned first substrate 1. Through integral molding, the bonding force between the boss 4 and the first substrate 1 is enhanced, and the service life of the boss 4 and the first substrate 1 is improved. Of course, in this embodiment, according to actual conditions and specific requirements, the above-mentioned several bosses 4 can also be connected to the first substrate 1 by other means, which is not limited here.

在一个实施例中，上述转印装置还包括若干第一安装位，各第一安装位7分别对应上述各凸台4位置设置于上述第一基板1上。这样，通过设置第一安装位，从而可实现将上述凸台4安装于上述第一基板1上。In one embodiment, the transfer device further includes a plurality of first mounting positions, and each of the first mounting positions 7 is respectively disposed on the first substrate 1 corresponding to the position of the boss 4. In this way, by providing the first mounting position, the boss 4 can be mounted on the first substrate 1.

可选地，请参阅图5与图6所示，上述第一安装位7包括第一卡扣结构71，该第一卡扣结构71包括第一卡扣711，该第一卡扣711设在凸台4的一端，此外，该第一卡扣结构71还包括第一扣位712，该第一扣位712连接于第一基板1，对应上述第一卡扣711的位置开设。这样，通过设置第一卡扣711与第一扣位712，从而通过第一卡扣711与第一扣位712相卡接，实现将各凸台4可拆卸的安装于第一基板1上。快速便捷。Optionally, please refer to FIGS. 5 and 6, the first mounting position 7 includes a first buckle structure 71, the first buckle structure 71 includes a first buckle 711, and the first buckle 711 is provided at One end of the boss 4. In addition, the first buckle structure 71 further includes a first buckle position 712. The first buckle position 712 is connected to the first substrate 1, corresponding to the position of the first buckle 711. In this way, by providing the first buckle 711 and the first buckling position 712, the first buckle 711 is engaged with the first buckling position 712, so that each boss 4 can be detachably mounted on the first substrate 1. Fast and convenient.

在一个实施例中，请参阅图6所示，在上述第一扣位712上开设有第一导向角713。通过设置第一导向角713，从而有利于上述第一卡扣711滑出上述第一扣位712，便于后续的安装。可选地，上述第一导向角713的角度范围呈45～60°，当然，根据实际情况和具体需求，上述第一导向角713的角度范围也可设置为其他角度，此处不作唯一限定。In one embodiment, please refer to FIG. 6, a first guide angle 713 is defined on the first buckle 712. By setting the first guide angle 713, the first buckle 711 is facilitated to slide out of the first buckling position 712, which is convenient for subsequent installation. Optionally, the angle range of the first guide angle 713 is 45-60 °. Of course, according to actual conditions and specific requirements, the angle range of the first guide angle 713 can also be set to other angles, which is not limited herein.

在一个实施例中，请参阅图7与图8所示，上述转印装置包括若干滑轨8，各滑轨8呈间隔设置于上述第一基板1上，在上述凸台4上开设有滑槽40，各滑槽40位于各凸台4正对上述滑轨8的一侧设置。这样，通过设置滑轨8与滑槽40，从而该滑轨8可滑入上述滑槽40中，实现凸台4与上述第一基板1的连接。In one embodiment, please refer to FIG. 7 and FIG. 8, the transfer device includes a plurality of slide rails 8, and each slide rail 8 is arranged on the first substrate 1 at intervals, and a slide is provided on the boss 4 Each of the sliding grooves 40 is located on the side of the boss 4 directly facing the sliding rail 8. In this way, by providing the slide rail 8 and the slide groove 40, the slide rail 8 can slide into the slide groove 40 to realize the connection between the boss 4 and the first substrate 1.

可选地，请参阅图8所示，上述各滑轨8呈工字型设置。通过设置为工字型，一方面可实现凸台4与上述第一基板1的连接，另一方面，可用于支撑上述凸台4。当然，在本实施例中，根据实际情况和具体需求，上述滑轨8也可设置为其他形状，此处不作唯一限定。Optionally, please refer to FIG. 8, the above slide rails 8 are arranged in an I-shape. By setting it as an I-shape, the connection between the boss 4 and the first substrate 1 can be realized on the one hand, and the boss 4 can be supported on the other hand. Of course, in this embodiment, according to the actual situation and specific requirements, the above-mentioned slide rail 8 may also be provided in other shapes, which is not limited herein.

在一个实施例中，请参阅图2所示，该转印装置还包括第二基板3，该第二基板3可设置为承载上述带转印的元器件2，在上述第二基板3上设有若干第二安装位6，该第二安装位6在上述第二基板3上的排布结构与上述凸台4在第一基板1上的排布结构相同。这样，通过设置第二基板3，从而可设置为承载上述元器件2，通过设置第二安装位，从而可将上述元器件2安装在上述第二基板3上，通过将第二安装位的排布结构与上述凸台4的排布结构设置相同，从而便于凸台4将上述待转印的元器件2从第二基板3转移至第一基板1上，当然，根据实际情况和具体需求，上述安装位的排布结构也可呈其他形式分布，此处不作唯一限定。In one embodiment, please refer to FIG. 2, the transfer device further includes a second substrate 3, the second substrate 3 may be configured to carry the transfer-carrying component 2, and the second substrate 3 is provided There are several second mounting positions 6, and the arrangement structure of the second mounting positions 6 on the second substrate 3 is the same as the arrangement structure of the boss 4 on the first substrate 1. In this way, by providing the second substrate 3, it can be set to carry the component 2, and by providing the second mounting position, the component 2 can be mounted on the second substrate 3, by arranging the second mounting position The layout structure is the same as the arrangement structure of the boss 4 described above, so as to facilitate the boss 4 to transfer the component 2 to be transferred from the second substrate 3 to the first substrate 1, of course, according to the actual situation and specific needs, The arrangement structure of the above installation positions may also be distributed in other forms, which is not limited here.

在一个实施例中，请参阅图2所示，上述第二安装位6包括第二卡扣结构61。这样，通过设置若干第二卡扣结构61，从而可将上述各元器件2可拆卸的安装于上述第一基板1上。In one embodiment, please refer to FIG. 2, the second mounting position 6 includes a second snap structure 61. In this way, by providing a plurality of second snap structures 61, the above-mentioned components 2 can be detachably mounted on the first substrate 1.

可选地，上述各第二卡扣结构61包括第二卡扣611，该第二卡扣611设置于上述元器件2的一端，在上述第二基板3上设置有第二扣位612，该第二扣位612对应上述第二卡扣611的位置设置，这样，通过第二卡扣611与第二扣位612相卡接，从而可将上述若干元器件2安装于上述第二基板3上。Optionally, each of the above-mentioned second buckle structures 61 includes a second buckle 611, and the second buckle 611 is disposed at one end of the component 2 and a second buckling position 612 is provided on the second substrate 3. The second buckle 612 corresponds to the position of the second buckle 611. In this way, the second buckle 611 and the second buckle 612 are engaged with each other, so that the components 2 can be mounted on the second substrate 3 .

在一个实施例中，请参阅图2、图3与图4所示，在上述第二扣位612上开设有第二导向角613。通过设置第二导向角613，从而有利于上述第二卡扣611滑出上述第二扣位612，便于后续的转印。可选地，上述第二导向角613的角度范围呈30～45°，当然，根据实际情况和具体需求，上述第二导向角613的角度范围也可设置为其他角度，此处不作唯一限定。In one embodiment, please refer to FIG. 2, FIG. 3 and FIG. 4, a second guide angle 613 is provided on the second buckling position 612. By setting the second guide angle 613, the second buckle 611 is facilitated to slide out of the second buckling position 612, which facilitates subsequent transfer. Optionally, the angle range of the second guide angle 613 is 30-45 °. Of course, according to actual conditions and specific requirements, the angle range of the second guide angle 613 may be set to other angles, which is not limited herein.

在本实施例中，还提供了另外一种转印装置，上述转印装置还包括第一基板1，在上述第一基板1上设有若干凸台4，该凸台4与第一基板1一体连接，该转印装置还包括设置为安装上述述待转印元器件2的第二基板3，各元器件2呈间隔可拆卸设置于上述第二基板3上，该第二基板3呈间隔设置于上述第一基板1的一侧，上述转印装置还包括第二卡扣结构61，该第二卡扣结构61可将上述元器件2安装在上述第二基板3上，另外，在上述若干凸台4上还设有一层柔性胶层5，该柔性胶层5可设置为将上述元器件2对应粘结于上述凸台4上，该柔性胶层5可通过随后的光照实现元器件2与上述各凸台4解黏分离、并通过清洗实现将上述凸台4分离，且上述若干柔性胶层5的宽度等于或小于上述凸台4的宽度。这样，通过在第一基板1上设置若干凸台4，并在各凸台4上设置柔性胶层5；通过设置柔性胶层5可将上述各元器件2对应粘结于上述各凸台4上，并通过各凸台4将各元器件2从第二基板3转移至第一基板1上，最后通过光照将元器件2从凸台4上拆掉，同步实现对多个元器件2的转印，简单便捷、提高了生产效率，且柔性胶层5成本较低，从而有利于后期元器件2的大规模转印，此外，由于上述柔性胶层5可通过清洗实现将上述柔性胶层5与凸台4分离，从而可重复利用上述凸台4实现对元器件2的转印，进一步降低了转印的成本，且通过将上述柔性胶层5的宽度设置为小于上述凸台4的宽度，从而有利于后续的拆除工序，当然，根据实际情况和具体需求，上述柔性胶层5的宽度也可设置为等于上述凸台4的宽度，此处不作唯一限定。In this embodiment, another transfer device is provided. The transfer device further includes a first substrate 1. A plurality of bosses 4 are provided on the first substrate 1. The bosses 4 and the first substrate 1 Integrally connected, the transfer device further includes a second substrate 3 configured to mount the components 2 to be transferred described above, each component 2 is detachably disposed on the second substrate 3 at intervals, and the second substrate 3 is at intervals Provided on the side of the first substrate 1, the transfer device further includes a second snap structure 61 that can mount the component 2 on the second substrate 3. In addition, Several bosses 4 are also provided with a layer of flexible adhesive layer 5 that can be configured to correspondingly bond the above-mentioned components 2 to the above-mentioned bosses 4 and that the flexible adhesive layer 5 can implement components through subsequent illumination 2 Debonding and separating from the above bosses 4 and separating the bosses 4 by cleaning, and the width of the plurality of flexible adhesive layers 5 is equal to or smaller than the width of the bosses 4. In this way, by providing a plurality of bosses 4 on the first substrate 1 and a flexible adhesive layer 5 on each boss 4; by providing the flexible adhesive layer 5, the above-mentioned components 2 can be correspondingly bonded to the above-mentioned bosses 4 And transfer each component 2 from the second substrate 3 to the first substrate 1 through the boss 4, and finally remove the component 2 from the boss 4 by light, and realize the synchronization of multiple components 2 The transfer is simple and convenient, improves the production efficiency, and the cost of the flexible adhesive layer 5 is low, which is conducive to the large-scale transfer of the component 2 in the later period. In addition, because the flexible adhesive layer 5 can be cleaned to achieve the above-mentioned flexible adhesive layer 5 is separated from the boss 4, so that the boss 4 can be repeatedly used to achieve the transfer of the component 2, which further reduces the cost of transfer, and by setting the width of the flexible adhesive layer 5 to be smaller than that of the boss 4 The width is beneficial to the subsequent dismantling process. Of course, according to the actual situation and specific requirements, the width of the flexible adhesive layer 5 can also be set equal to the width of the boss 4, which is not limited here.

以上仅为本申请的可选实施例而已，并不设置为限制本申请。对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。The above are only optional embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of this application shall be included in the scope of the claims of this application.

Claims

转印装置，其中，包括：Transfer device, which includes:

第一基板；First substrate

若干凸台，设置于所述第一基板上；A plurality of bosses are provided on the first substrate;

柔性胶层，可分离设置于所述凸台上，设置为粘结待转印的元器件，并设置为通过光照射实现与所述元器件的解黏分离。The flexible adhesive layer can be detachably arranged on the boss, is arranged to bond the components to be transferred, and is arranged to realize the debonding and separation of the components by light irradiation.
根据权利要求1所述的转印装置，其中，所述柔性胶层为紫外线解黏性胶制作的薄膜层。The transfer device according to claim 1, wherein the flexible adhesive layer is a film layer made of ultraviolet debonding adhesive.
根据权利要求2所述的转印装置，其中，所述柔性胶层粘结、热压、印刷或涂覆于所述凸台上。The transfer device according to claim 2, wherein the flexible adhesive layer is bonded, hot pressed, printed or coated on the boss.
根据权利要求2所述的转印装置，其中，所述柔性胶层的厚度为1～2毫米。The transfer device according to claim 2, wherein the thickness of the flexible adhesive layer is 1-2 mm.
根据权利要求2所述的转印装置，其中，所述柔性胶层呈透明状或半透明状设置。The transfer device according to claim 2, wherein the flexible adhesive layer is provided in a transparent or semi-transparent shape.
根据权利要求1所述的转印装置，其中，所述凸台呈倒梯形或圆柱形设置，所述倒梯形的凸台的面积较大端连接所述第一基板。The transfer device according to claim 1, wherein the boss is provided in an inverted trapezoidal or cylindrical shape, and the end of the inverted trapezoidal boss having a larger area is connected to the first substrate.
根据权利要求1所述的转印装置，其中，所述凸台与所述第一基板一体成型。The transfer device according to claim 1, wherein the boss is integrally formed with the first substrate.
根据权利要求1所述的转印装置，其中，所述转印装置还包括第一安装位，设置为将所述凸台安装于所述第一基板上，各所述第一安装位分别对应各所述凸台位置设置于所述第一基板上。The transfer device according to claim 1, wherein the transfer device further comprises a first mounting position configured to mount the boss on the first substrate, each of the first mounting positions corresponding to The positions of the bosses are set on the first substrate.
根据权利要求8所述的转印装置，其中，所述第一安装位包括第一卡扣结构，设置为将各所述凸台可拆卸的安装于所述第一基板上，所述第一卡扣结构包括设置为连接所述凸台一端的第一卡扣，以及设置于所述第一基板上对应所述第一卡扣位置开设的第一扣位，所述第一卡扣与所述第一扣位相卡接。The transfer device according to claim 8, wherein the first mounting position includes a first snap structure configured to detachably mount each boss on the first substrate, the first The buckle structure includes a first buckle arranged to be connected to one end of the boss, and a first buckle position provided on the first substrate corresponding to the first buckle position, the first buckle The first snap-in phase is snapped.
根据权利要求9所述的转印装置，其中，所述第一扣位上开设有供所述第一卡扣滑出所述第一扣位的第一导向角。The transfer device according to claim 9, wherein a first guide angle is provided on the first buckling position for the first buckle to slide out of the first buckling position.
根据权利要求10所述的转印装置，其中，所述第一导向角的角度范围为45～60°。The transfer device according to claim 10, wherein the angle range of the first guide angle is 45 to 60 °.
根据权利要求1所述的转印装置，其中，所述转印装置包括呈间隔设置于所述第一基板上的若干滑轨，各所述凸台正对各所述滑轨的一侧开设有供各所述滑轨伸入并滑动的滑槽。The transfer device according to claim 1, wherein the transfer device includes a plurality of slide rails disposed on the first substrate at intervals, and each of the bosses is opened to one side of each of the slide rails There is a chute for each slide rail to extend into and slide.
根据权利要求12所述的转印装置，其中，各所述滑轨呈工字型设置。The transfer device according to claim 12, wherein each of the slide rails is provided in an I-shape.
根据权利要求1所述的转印装置，其中，所述转印装置还包括第二基板，设置为承载待转印的元器件，所述第二基板设有若干个第二安装位，所述第二安装位在所述第二基板上的排布结构与所述凸台在所述第一基板上的排布结构相同。The transfer device according to claim 1, wherein the transfer device further comprises a second substrate configured to carry the component to be transferred, and the second substrate is provided with a plurality of second mounting positions, the The arrangement structure of the second mounting position on the second substrate is the same as the arrangement structure of the boss on the first substrate.
根据权利要求14所述的转印装置，其中，所述第二安装位包括设置为将各所述元器件可拆卸的安装于所述第二基板上的第二卡扣结构；所述第二卡扣结构包括设置为连接所述元器件一端的第二卡扣，以及设置于所述第二基板上对应所述第二卡扣开设的第二扣位，所述第二卡扣与所述第二扣位相卡接。The transfer device according to claim 14, wherein the second mounting position includes a second buckle structure configured to detachably mount each of the components on the second substrate; the second The buckle structure includes a second buckle arranged to connect one end of the component, and a second buckle position provided on the second substrate corresponding to the second buckle, the second buckle and the The second snap-in phase is snapped.
根据权利要求15所述的转印装置，其中，所述第二扣位上开设有供所述第二卡扣滑出所述第二扣位的第二导向角。The transfer device according to claim 15, wherein a second guide angle is provided on the second buckling position for the second buckle to slide out of the second buckling position.
根据权利要求16所述的转印装置，其中，所述第二导向角的角度范围为30～45°。The transfer device according to claim 16, wherein the angle range of the second guide angle is 30 to 45 °.
转印装置，其中，包括：Transfer device, which includes:

第一基板；First substrate

若干凸台，一体连接于所述第一基板；Several bosses are integrally connected to the first substrate;

第二基板，设置为安装待转印的元器件；The second substrate is set to install the components to be transferred;

第二卡扣结构，呈间隔可拆卸设置于所述第二基板上，设置为连接所述元器件；The second snap structure is detachably arranged on the second substrate at intervals, and is arranged to connect the components;

柔性胶层，可分离设置于所述凸台上，设置为将待转印的元器件对应粘结于各所述凸台上，所述柔性胶层为可通过光照射实现与所述元器件解黏分离、通过清洗实现与所述凸台分离的胶层；A flexible adhesive layer can be detachably arranged on the boss, and is configured to correspondingly adhere the components to be transferred to each of the bosses, and the flexible adhesive layer can be realized with the components by light irradiation Adhesive separation, adhesive layer separated from the boss by cleaning;

所述柔性胶层的宽度等于或小于各所述凸台的宽度。The width of the flexible adhesive layer is equal to or smaller than the width of each boss.