WO2020095339A1 - Work machine and calculation method - Google Patents

Work machine and calculation method Download PDF

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Publication number
WO2020095339A1
WO2020095339A1 PCT/JP2018/040949 JP2018040949W WO2020095339A1 WO 2020095339 A1 WO2020095339 A1 WO 2020095339A1 JP 2018040949 W JP2018040949 W JP 2018040949W WO 2020095339 A1 WO2020095339 A1 WO 2020095339A1
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WO
WIPO (PCT)
Prior art keywords
lead
component
held
work
components
Prior art date
Application number
PCT/JP2018/040949
Other languages
French (fr)
Japanese (ja)
Inventor
広己 鈴木
泰成 水野
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2018/040949 priority Critical patent/WO2020095339A1/en
Priority to JP2020556368A priority patent/JP7095109B2/en
Publication of WO2020095339A1 publication Critical patent/WO2020095339A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a work machine for calculating the position of an electric component held by a work head, and a calculation method.
  • the present invention has an object to appropriately calculate the position of an electric component held by a work head.
  • the present specification describes a work head that holds a plurality of electric components having lead terminals, a moving device that can move the work head in a vertical direction, and an electric device that is held by the work head.
  • An image pickup device for picking up an image of a component in a state where light is radiated from the side, and a control device for controlling the operation of the work head and the moving device, the control device being a plurality of devices held by the work head.
  • the lead terminal of the electric component imaged by the imaging device in a state in which the working head is moved in the vertical direction by the moving device so that the light from the side is irradiated to the lead terminal.
  • a working machine for calculating the position of each lead terminal of each of the plurality of electric components based on the imaging data.
  • the present specification describes a work head that holds a plurality of electric components having lead terminals, a moving device that can move the work head in a vertical direction, and an electric device that is held by the work head.
  • a working machine equipped with an image pickup device for picking up an image of a part in a state where light is radiated from the side
  • light from the side is radiated to each lead terminal of a plurality of electric components held by the working head.
  • the lead terminals of each of the plurality of electrical components are A calculation method for calculating a position is disclosed.
  • the work head when the work head is moved in the vertical direction so that the lead terminals of each of the plurality of electric components held by the work head are irradiated with light from the side, The lead terminals of the plurality of electric components are imaged. Then, the positions of the lead terminals of the plurality of electric components are calculated based on the imaged data. Thereby, the positions of the lead terminals of the plurality of electric components held by the work head can be appropriately calculated.
  • FIG. 1 shows a component mounter 10.
  • the component mounter 10 is a device for executing a component mounting operation on the circuit substrate 12.
  • the component mounter 10 includes an apparatus main body 20, a base material transfer / holding device 22, a component mounting device 24, a mark camera 26, a part camera 28, a component supply device 30, a bulk component supply device 32, and a control device (see FIG. 6) 36.
  • the circuit substrate 12 may be a circuit board, a substrate having a three-dimensional structure, or the like, and the circuit substrate may be a printed wiring board, a printed circuit board, or the like.
  • the apparatus main body 20 is composed of a frame portion 40 and a beam portion 42 mounted on the frame portion 40.
  • the substrate transfer / holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and has a transfer device 50 and a clamp device 52.
  • the transfer device 50 is a device that transfers the circuit substrate 12
  • the clamp device 52 is a device that holds the circuit substrate 12.
  • the base material carrying / holding device 22 carries the circuit base material 12 and fixedly holds the circuit base material 12 at a predetermined position.
  • the transport direction of the circuit substrate 12 will be referred to as the X direction
  • the horizontal direction orthogonal to that direction will be referred to as the Y direction
  • the vertical direction will be referred to as the Z direction. That is, the width direction of the component mounter 10 is the X direction, and the front-back direction is the Y direction.
  • the component mounting device 24 is disposed in the beam section 42 and has two work heads 56 and 58 and a work head moving device 62.
  • the work head moving device 62 includes an X-direction moving device 63, a Y-direction moving device 64, and a Z-direction moving device 65.
  • the X-direction moving device 63 and the Y-direction moving device 64 have electromagnetic motors (see FIG. 6) 66 and 68, respectively, and the operation of the electromagnetic motors 66 and 68 causes the two work heads 56 and 58 to move. , Integrally move to an arbitrary position on the frame portion 40.
  • the Z-direction moving device 65 has electromagnetic motors (see FIG.
  • the work heads 56 and 58 are detachably attached to the sliders 74 and 76. As a result, the work heads 56 and 58 are individually moved in the vertical direction by the Z-direction moving device 65.
  • the work heads 56 and 58 are for mounting components on the circuit substrate 12, and are provided with eight rod-shaped mounting units 80 as shown in FIG.
  • a component holder 82 is attached to the tip of each of the eight attachment units 80.
  • the component holder 82 is a so-called chuck, and as shown in FIG. 4, includes a main body portion 84 and a pair of claw portions 86.
  • the pair of claw portions 86 are arranged so as to extend downward from the lower surface of the main body portion 84, and slide so that they can approach and separate from each other.
  • the component holder 82 holds the component by the pair of claws 86 by bringing the pair of claws 86 close to each other, and separates the pair of claws 86 from each other by the pair of claws 86.
  • the part is removed from between the parts 86.
  • the eight mounting units 80 are held on the outer peripheral portion of the unit holder 88 at equal angular pitches in a state where the axial direction is vertical, and the component holder 82 is It extends downward from the lower surface of the unit holder 88.
  • the unit holder 88 is intermittently rotated by the electromagnetic motor (see FIG. 6) 92 of the holder rotating device 90 at each installation angle of the mounting unit 80.
  • the mounting unit 80 sequentially stops at the lifting station, which is one of the stopping positions of the plurality of mounting units 80.
  • the mounting unit 80 located at the lifting station is lifted and lowered by the electromagnetic motor (see FIG. 6) 98 of the unit lifting device 96.
  • the vertical position of the component held by the component holder 82 is changed. That is, in the work heads 56 and 58, only one of the eight mounting units 80 located in the lifting station moves up and down and is held by the component holder 82 of the mounting unit 80 located in the lifting station. Only the removed parts move up and down.
  • Each of the eight component holders 82 mounted on the lower ends of the eight mounting units 80 can be attached / detached to / from the mounting unit 80 with one touch. For example, depending on the size of the component to be held, etc. Can be exchanged.
  • the mark camera 26 is attached to the slider 74 while facing downward, and moves with the work head 56 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 moves to an arbitrary position by the operation of the work head moving device 62, and images the arbitrary position on the frame unit 40.
  • the parts camera 28 is arranged between the base material conveying and holding device 22 on the frame portion 40 and the parts supply device 30 so as to face upward.
  • the work heads 56 and 58 holding the parts move above the parts camera 28 by the operation of the work head moving device 62, and the parts camera 28 images the parts held by the part holder 82. ..
  • the parts camera 28 includes an imaging device 100, a lens 102, and a laser illumination 104.
  • the image pickup apparatus 100 has an image pickup element (not shown), and is arranged with the light receiving surface facing upward.
  • the lens 102 is fixed to the light receiving surface side of the imaging device 100, that is, the upper surface side in FIG.
  • the laser illumination 104 is composed of four laser irradiation devices (only two laser irradiation devices are shown in the drawing) 106.
  • the four laser irradiation devices 106 are arranged at four equal positions so as to surround the components held by the component holder 82 from the periphery. Then, the four laser irradiation devices 106 irradiate the components held by the component holder 82 with laser light from four lateral positions. As a result, the component held by the component holder 82 is imaged by the imaging device 100.
  • the component supply device 30 is arranged at one end of the frame portion 40 in the front-rear direction.
  • the component supply device 30 has a tray-type component supply device 110 and a feeder-type component supply device (see FIG. 6) 112.
  • the tray-type component supply device 110 is a device that supplies components placed on a tray.
  • the feeder-type component supply device 112 is a device that supplies components using a tape feeder or a stick feeder (not shown).
  • the loose-parts supply device 32 is arranged at the other end of the frame 40 in the front-rear direction.
  • the discrete component supply device 32 is a device that aligns a plurality of components in a scattered state and supplies the components in the aligned state. In other words, it is a device that aligns a plurality of components in arbitrary postures in a predetermined posture and supplies the components in a predetermined posture.
  • the control device 36 includes a controller 120, a plurality of drive circuits 122, and an image processing device 126.
  • the plurality of drive circuits 122 are provided in the transfer device 50, the clamp device 52, the electromagnetic motors 66, 68, 70, 72, 92, 98, the tray type component supply device 110, the feeder type component supply device 112, and the bulk component supply device 32. It is connected.
  • the controller 120 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 122. As a result, the controller 120 controls the operations of the base material carrying and holding device 22, the component mounting device 24, and the like.
  • the controller 120 is also connected to the image processing device 126.
  • the image processing device 126 processes the image data obtained by the mark camera 26 and the parts camera 28, and the controller 120 acquires various information from the image data.
  • the component mounting operation is performed on the circuit substrate 12 held by the substrate transfer / holding device 22 with the above-described configuration.
  • the component mounter 10 can perform various component mounting work.
  • the mounting work of electrical components having leads, so-called lead components, will be described below.
  • the lead component 150 is composed of a block-shaped component body 152 and two leads 154 protruding from the bottom surface of the component body 152.
  • the circuit substrate 12 is transported to the work position and is fixedly held by the clamp device 52 at that position.
  • the mark camera 26 moves above the circuit board 12 and takes an image of the circuit board 12.
  • the controller 120 calculates the error of the holding position of the circuit substrate 12 by the clamp device 52, the position of the insertion hole formed in the circuit substrate 12, and the like based on the imaged data.
  • the component supply device 30 or the bulk component supply device 32 supplies the lead component 150 at a predetermined supply position. Then, one of the work heads 56, 58 moves above the component supply position, and the component holder 152 holds the component body 152 of the lead component 150.
  • the work heads 56 and 58 move above the parts camera 28, and the parts camera 28 takes an image of the lead part 150 held by the part holder 82. More specifically, the work heads 56 and 58 that have moved above the parts camera 28 are lowered to irradiate the leads 154 of the lead part 150 held by the part holder 82 from the laser irradiation device 106 of the parts camera 28. Laser light is emitted from the side. At this time, the light emitted from the laser irradiation device 106 is reflected by the lead 154 of the lead component 150 held by the component holder 82, and the reflected light enters the lens 102.
  • the light that has entered the lens 102 enters the imaging device 100 and is detected by the imaging element of the imaging device 100.
  • the imaging data of the lead 154 of the lead component 150 held by the component holder 82 is obtained.
  • the image data is analyzed by the controller 120, and the position of the tip of the lead 154 of the lead component 150 is calculated.
  • the X-direction moving device 63 and the Y-direction moving device are arranged so that the coordinates in the XY directions of the tips of the leads 154 of the lead component 150 and the coordinates in the XY directions of the insertion holes of the circuit substrate 12 match.
  • the operation of 64 is controlled.
  • the work heads 56 and 58 move in the XY directions, so that the position of the tip of the lead 154 of the lead component 150 and the position of the insertion hole of the circuit substrate 12 overlap in the vertical direction.
  • the work heads 56 and 58 are lowered by the operation of the Z-direction moving device 65, so that the leads 154 of the lead component 150 held by the component holder 82 are inserted into the insertion holes of the circuit substrate 12. As a result, the lead component 150 is mounted on the circuit substrate 12.
  • the lead 154 of the lead component 150 held by the component holder 82 is inserted into the insertion hole of the circuit substrate 12, so that the lead component 150 is mounted on the circuit substrate 12. It Therefore, it is necessary to identify the position of the tip of the lead 154 of the lead component 150 held by the component holder 82. To identify the position of the tip of the lead 154, The held lead component 150 is imaged by the parts camera 28 as described above. In the component mounter 10, work heads 56 and 58 that can simultaneously hold a plurality of components are used. Therefore, in the component mounter 10, the plurality of lead components are imaged by the parts camera 28 while the work heads 56 and 58 holding the plurality of lead components are moved in the vertical direction, that is, while being moved.
  • a plurality of mounting units 80 may be mounted with a plurality of component holders 82a, b, c, d having different sizes. In such a case, the height of the held portion, which is the portion of the lead component 150 held by the component holder 82, differs for each lead component.
  • the held portion of the lead component 150 is a portion where the side surface of the component body 152 of the lead component 150 is gripped by the claw portion 86 of the component holder 82, and the portion where the component body 152 and the claw portion 86 contact each other. Is. In other words, it is a portion where the component body 152 and the claw portion 86 overlap in the left-right direction, strictly speaking, in the horizontal direction. Further, since the plurality of lead components 150 are of different types, the size differs for each lead component. Therefore, the positions of the leads of the plurality of lead components held by the work heads 56 and 58 are different in the vertical direction.
  • the work heads 56 and 58 reach the position where the light emitted by the laser irradiation device 106 of the parts camera 28 is emitted to the leads 154 of the lead component 150b held by the component holder 82b. To descend. Then, the parts camera 28 takes an image at the timing when the lead 154 of the lead component 150b is irradiated with light. At this time, the light emitted from the laser irradiation device 106 is reflected by the lead 154 of the lead component 150b, and the reflected light enters the lens 102. Then, the light that has entered the lens 102 enters the imaging device 100 and is detected by the imaging element of the imaging device 100. Thereby, the imaging data of the lead 154 of the lead component 150b is obtained. Then, the controller 120 analyzes the imaged data and calculates the position of the tip of the lead 154 of the lead component 150b.
  • the work heads 56 and 58 descend to the position where the light emitted by the laser irradiation device 106 is emitted to the lead 154 of the lead component 150c held by the component holder 82c, and at that timing, the lead component is moved.
  • the lead 154 of 150c is imaged by the parts camera 28.
  • the controller 120 analyzes the imaged data and calculates the position of the tip of the lead 154 of the lead component 150c.
  • the work heads 56 and 58 descend to the position where the light emitted by the laser irradiation device 106 is emitted to the lead 154 of the lead component 150a held by the component holder 82a, and at that timing, the lead component is moved.
  • the lead 154 of 150a is imaged by the parts camera 28. Then, the controller 120 analyzes the imaged data and calculates the position of the tip portion of the lead 154 of the lead component 150a. Further, the work heads 56 and 58 descend to the position where the light emitted by the laser irradiation device 106 is emitted to the leads 154 of the lead component 150d held by the component holder 82d, and at that timing, the lead component 150d. The lead 154 is imaged by the parts camera 28. Then, the controller 120 analyzes the imaged data and calculates the position of the tip of the lead 154 of the lead component 150d.
  • the tip positions of the leads of the plurality of lead components are obtained by capturing an image of the plurality of lead components with the work heads 56 and 58 holding the plurality of lead components being moved in the vertical direction. Is calculated. Accordingly, the leading ends of the lead components 150 held by the work heads 56 and 58 can be properly inserted into the insertion holes of the circuit substrate 12, and the mounting work of the lead components 150 can be appropriately performed. ..
  • the work heads 56 and 58 may or may not be temporarily stopped when the parts camera 28 takes an image.
  • a plurality of lead parts may be imaged by the parts camera 28 in a state in which the work heads 56, 58 are continuously moved in the vertical direction, and a state in which the work heads 56, 58 are intermittently moved in the vertical direction. Then, a plurality of lead parts may be imaged by the parts camera 28.
  • the parts camera 28 images each lead component and the imaging data obtained by the imaging is analyzed, it takes a long time to analyze the imaging data. That is, in the above method, the image data of the lead component 150b is analyzed, the image data of the lead component 150c is analyzed, the image data of the lead component 150a is analyzed, and the image data of the lead component 150d is analyzed.
  • the imaged data By analyzing the imaged data once, the time required for analyzing the imaged data and the like becomes long. Therefore, the plurality of lead components may be collectively imaged by one-time imaging while the work heads 56 and 58 holding the plurality of lead components are moved in the vertical direction.
  • the work heads 56 and 58 are moved above the parts camera 28 by the operation of the X-direction moving device 63 and the Y-direction moving device 64, and are lowered to the lower imaging position by the operation of the Z-direction moving device 65.
  • the lead component is held.
  • FIG. 8 it is the position in the vertical direction of the work heads 56 and 58 when the light emitted from the laser irradiation device 106 is applied to the lead 154 of the 150.
  • the lead of the held lead component when the lead of the held lead component is positioned at the uppermost position, the light emitted by the laser irradiation device 106 is irradiated.
  • the positions of the work heads 56 and 58 in the vertical direction are the lower imaging positions. In other words, when the lead of the lead component held by the work heads 56 and 58 is located closest to the lower end surface of the mounting unit 80, the lead is irradiated by the laser irradiation device 106.
  • the position of the work heads 56, 58 in the up-down direction when the light is irradiated is the lower imaging position.
  • the parts camera 28 starts imaging. That is, the shutter of the imaging device 100 of the parts camera 28 is released. Then, with the shutter of the imaging device 100 being opened, the work heads 56 and 58 are moved up from the lower imaging position to the upper imaging position by the operation of the Z-direction moving device 65. At the upper imaging position, when the component holder 82 having the largest size is mounted on the mounting unit 80 of the work heads 56 and 58 and the lead component 150 having the largest size is held by the component holder 82, the lead component is held. As shown in FIG.
  • the positions of the work heads 56 and 58 in the vertical direction are the upper imaging positions. In other words, when the leads of the lead components held by the work heads 56 and 58 are located farthest from the lower end surface of the mounting unit 80, the leads are irradiated by the laser irradiation device 106.
  • the position of the work heads 56, 58 in the up-down direction when the light is irradiated is the upper imaging position.
  • the shutter of the image pickup device 100 is closed. That is, while the work heads 56 and 58 are elevated from the lower image pickup position to the upper image pickup position, the shutter of the image pickup apparatus 100 is kept open. As a result, all the leads of the plurality of lead components held by the work heads 56 and 58 are irradiated with light from the laser irradiation device 106, and all the leads of the plurality of lead components are imaged once. The images are taken together.
  • the tip positions of all the leads of the plurality of lead components held by the work heads 56 and 58 can be calculated by analyzing the imaged data obtained by the image pickup. This makes it possible to specify the tip positions of all the leads of the plurality of lead components held by the work heads 56 and 58 by analyzing the imaged data once, and shorten the time required for the imaged data analysis and the like. it can.
  • the component mounter 10 is an example of a working machine.
  • the parts camera 28 is an example of an imaging device.
  • the control device 36 is an example of a control device.
  • the work heads 56 and 58 are examples of work heads.
  • the work head moving device 62 is an example of a moving device.
  • the component holder 82 is an example of a holder.
  • the claw portion 86 is an example of a grip claw.
  • the lead component 150 is an example of an electrical component.
  • the lead 154 is an example of a lead terminal.
  • the present invention is not limited to the above-mentioned embodiments, and can be carried out in various modes with various modifications and improvements based on the knowledge of those skilled in the art.
  • the position of the lead 154 of the lead component 150 is calculated based on the imaged data, but the position of the lead terminal such as the pin, terminal, or bump of the electrical component is included in the imaged data. It may be calculated based on.
  • the lead component 150 is mounted on the circuit substrate 12 by inserting the lead 154 of the lead component 150 into the insertion hole of the circuit substrate 12, but the lead terminals such as the lead 154 have through holes, recesses,
  • the electric component may be mounted on the circuit substrate 12 or the like by being positioned by the hooking portion, the positioning portion, or the like.
  • a plurality of different types of holders are attached to the plurality of attachment units 80 of the work heads 56 and 58, and a plurality of different types of lead components are held by the plurality of different types of holders.
  • the present invention can be applied to other aspects. For example, in a mode in which a plurality of holders of the same type are mounted on the plurality of mounting units 80 of the work heads 56 and 58, and a plurality of different types of lead components are held by the plurality of holders of the same type, Due to the difference in size of each component, the positions of the leads of the plurality of lead components held by the work heads 56 and 58 in the vertical direction naturally differ.
  • a plurality of holders of the same type are mounted on the plurality of mounting units 80 of the work heads 56 and 58, and a plurality of lead components of the same type are held by the plurality of holders of the same type. Even if there is, the work heads 56 and 58 are held by the variation in the length of the lead 154, the variation in the height of the component body 152, the variation in the height of the lead component supply position, the tolerance of the component holder 82, and the like. The positions of the leads of the plurality of lead components in the vertical direction are different. Therefore, the present invention can be applied to those aspects as well.
  • the plurality of lead components 150 held by the work heads 56 and 58 are imaged in a state where the work heads 56 and 58 are raised from the lower image pickup position to the upper image pickup position.
  • the plurality of lead components 150 held by the work heads 56 and 58 may be imaged in a state where the 56 and 58 are lowered from the upper imaging position to the lower imaging position.
  • the working heads 56 and 58 are not limited to being located between the lower imaging position and the upper imaging position, and the work heads 56 and 58 are moved in the vertical direction between a position below the lower imaging position and a position above the upper imaging position. Then, the plurality of lead components 150 held by the work heads 56 and 58 may be imaged.
  • the up-down direction here is not limited to the Z direction, strictly speaking, the vertical direction, and is a concept including diagonally upward and diagonally downward.
  • the lead component 150 is mounted on the circuit substrate 12 by inserting the lead 154 of the lead component 150 into the insertion hole formed in the circuit substrate 12. That is, the lead component 150 is directly mounted on the circuit substrate 12.
  • the lead component 150 may be indirectly attached to the circuit substrate 12 via a component different from the lead component 150. That is, the lead component 150 may be mounted on a component such as a connector component mounted on the circuit substrate 12.
  • the component holder 82 that is, the chuck is adopted as the holder for holding the component, but a suction nozzle may be adopted.
  • the suction nozzle may be mounted on all the mounting units 80 of the work heads 56 and 58, or the suction nozzle and the chuck may be mounted together.
  • the tip position of the lead 154 of the lead component 150 is calculated in the component mounter 10, and the mounting work of the lead component 150 is executed based on the tip position of the lead 154.
  • the work of mounting the lead component 150 may be performed by a work machine different from the machine 10. In other words, the work machine provided with the work head only needs to arrange the lead components held by the work head with appropriate positioning.
  • the component mounter 10 calculates the tip position of the lead 154 of the lead component 150, but the mounting work of the lead component 150 may not be executed. For example, the quality or accuracy of the lead component held by the work head may be measured.
  • the side light emitted when the lead is imaged is not limited to laser light.
  • Component mounter (working machine) 28 Parts camera (imaging device) 36: Control device 56: Working head 58: Working head 62: Working head moving device (moving device) 82: Parts holding tool (holding tool) 86: Claw (grasping claw) 150: lead component (electric component) 154: lead (lead terminal)

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

This work machine is provided with: a work head for holding a plurality of electric components having lead terminals; a moving device capable of moving the work head in up-down directions; an image capture device which captures an image of the electric components being held by the work head in a state in which the electric components are being irradiated with light laterally; and a control device which controls the operation of the work head and the moving device. The control device, in a state in which the work head has been moved in the up-down directions by the moving device so that the lead terminal of each of the plurality of electric components being held by the work head is irradiated with light laterally, calculates the position of the lead terminal of each of the plurality of electric components on the basis of captured image data of the lead terminals of the electric components captured by the image capture device.

Description

作業機、および演算方法Working machine and calculation method
　本発明は、作業ヘッドに保持された電気部品の位置を演算する作業機、および演算方法に関する。 The present invention relates to a work machine for calculating the position of an electric component held by a work head, and a calculation method.
　作業機には、下記特許文献に記載されているように、作業ヘッドに保持された電気部品の位置を演算するものがある。 There are some working machines that calculate the position of an electric component held by a working head, as described in the following patent documents.
特開２０１１－２２８５８３号公報JP, 2011-228583, A 特開２００３－２１８６００号公報JP, 2003-218600, A
　本発明は、作業ヘッドに保持された電気部品の位置を適切に演算することを課題とする。 The present invention has an object to appropriately calculate the position of an electric component held by a work head.
　上記課題を解決するために、本明細書は、リード端子を有する複数の電気部品を保持する作業ヘッドと、前記作業ヘッドを上下方向に移動可能な移動装置と、前記作業ヘッドにより保持された電気部品を、側方から光を照射した状態で撮像する撮像装置と、前記作業ヘッドと前記移動装置との作動を制御する制御装置とを備え、前記制御装置が、前記作業ヘッドに保持された複数の電気部品の各々のリード端子に前記側方からの光が照射されるように前記作業ヘッドを前記移動装置によって上下方向に移動させた状態で、前記撮像装置によって撮像された電気部品のリード端子の撮像データに基づいて、前記複数の電気部品の各々のリード端子の位置を演算する作業機を開示する。 In order to solve the above problems, the present specification describes a work head that holds a plurality of electric components having lead terminals, a moving device that can move the work head in a vertical direction, and an electric device that is held by the work head. An image pickup device for picking up an image of a component in a state where light is radiated from the side, and a control device for controlling the operation of the work head and the moving device, the control device being a plurality of devices held by the work head. Of the electric component, the lead terminal of the electric component imaged by the imaging device in a state in which the working head is moved in the vertical direction by the moving device so that the light from the side is irradiated to the lead terminal. Disclosed is a working machine for calculating the position of each lead terminal of each of the plurality of electric components based on the imaging data.
　上記課題を解決するために、本明細書は、リード端子を有する複数の電気部品を保持する作業ヘッドと、前記作業ヘッドを上下方向に移動可能な移動装置と、前記作業ヘッドにより保持された電気部品を、側方から光を照射した状態で撮像する撮像装置とを備えた作業機において、前記作業ヘッドに保持された複数の電気部品の各々のリード端子に前記側方からの光が照射されるように前記作業ヘッドを前記移動装置によって上下方向に移動させた状態で、前記撮像装置によって撮像された電気部品のリード端子の撮像データに基づいて、前記複数の電気部品の各々のリード端子の位置を演算する演算方法を開示する。 In order to solve the above problems, the present specification describes a work head that holds a plurality of electric components having lead terminals, a moving device that can move the work head in a vertical direction, and an electric device that is held by the work head. In a working machine equipped with an image pickup device for picking up an image of a part in a state where light is radiated from the side, light from the side is radiated to each lead terminal of a plurality of electric components held by the working head. As described above, in a state where the work head is moved in the vertical direction by the moving device, based on the imaging data of the lead terminals of the electrical components imaged by the imaging device, the lead terminals of each of the plurality of electrical components are A calculation method for calculating a position is disclosed.
　本開示によれば、作業ヘッドに保持された複数の電気部品の各々のリード端子に側方からの光が照射されるように作業ヘッドを上下方向に移動させた状態で、撮像装置によって、それら複数の電気部品のリード端子が撮像される。そして、その撮像データに基づいて、複数の電気部品の各々のリード端子の位置が演算される。これにより、作業ヘッドに保持された複数の電気部品のリード端子の位置を適切に演算することができる。 According to the present disclosure, when the work head is moved in the vertical direction so that the lead terminals of each of the plurality of electric components held by the work head are irradiated with light from the side, The lead terminals of the plurality of electric components are imaged. Then, the positions of the lead terminals of the plurality of electric components are calculated based on the imaged data. Thereby, the positions of the lead terminals of the plurality of electric components held by the work head can be appropriately calculated.
部品実装機を示す斜視図である。It is a perspective view showing a component mounter. 部品実装機の部品装着装置を示す斜視図である。It is a perspective view showing a component mounting device of a component mounter. 作業ヘッドを示す概略図である。It is a schematic diagram showing a work head. 部品保持具を示す概略図である。It is a schematic diagram showing a component holder. パーツカメラを示す概略図である。It is a schematic diagram showing a parts camera. 制御装置を示すブロック図である。It is a block diagram which shows a control apparatus. 作業ヘッドにより保持された複数のリード部品を示す概略図である。It is a schematic diagram showing a plurality of lead parts held by a work head. 作業ヘッドにより保持された複数のリード部品を示す概略図である。It is a schematic diagram showing a plurality of lead parts held by a work head. 作業ヘッドにより保持された複数のリード部品を示す概略図である。It is a schematic diagram showing a plurality of lead parts held by a work head.
　以下、本発明を実施するための形態として、本発明の実施例を、図を参照しつつ詳しく説明する。 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings as a mode for carrying out the present invention.
　図１に、部品実装機１０を示す。部品実装機１０は、回路基材１２に対する部品の実装作業を実行するための装置である。部品実装機１０は、装置本体２０、基材搬送保持装置２２、部品装着装置２４、マークカメラ２６、パーツカメラ２８、部品供給装置３０、ばら部品供給装置３２、制御装置（図６参照）３６を備えている。なお、回路基材１２として、回路基板、三次元構造の基材等が挙げられ、回路基板として、プリント配線板、プリント回路板等が挙げられる。 FIG. 1 shows a component mounter 10. The component mounter 10 is a device for executing a component mounting operation on the circuit substrate 12. The component mounter 10 includes an apparatus main body 20, a base material transfer / holding device 22, a component mounting device 24, a mark camera 26, a part camera 28, a component supply device 30, a bulk component supply device 32, and a control device (see FIG. 6) 36. I have it. The circuit substrate 12 may be a circuit board, a substrate having a three-dimensional structure, or the like, and the circuit substrate may be a printed wiring board, a printed circuit board, or the like.
　装置本体２０は、フレーム部４０と、そのフレーム部４０に上架されたビーム部４２とによって構成されている。基材搬送保持装置２２は、フレーム部４０の前後方向の中央に配設されており、搬送装置５０とクランプ装置５２とを有している。搬送装置５０は、回路基材１２を搬送する装置であり、クランプ装置５２は、回路基材１２を保持する装置である。これにより、基材搬送保持装置２２は、回路基材１２を搬送するとともに、所定の位置において、回路基材１２を固定的に保持する。なお、以下の説明において、回路基材１２の搬送方向をＸ方向と称し、その方向に直角な水平の方向をＹ方向と称し、鉛直方向をＺ方向と称する。つまり、部品実装機１０の幅方向は、Ｘ方向であり、前後方向は、Ｙ方向である。 The apparatus main body 20 is composed of a frame portion 40 and a beam portion 42 mounted on the frame portion 40. The substrate transfer / holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and has a transfer device 50 and a clamp device 52. The transfer device 50 is a device that transfers the circuit substrate 12, and the clamp device 52 is a device that holds the circuit substrate 12. As a result, the base material carrying / holding device 22 carries the circuit base material 12 and fixedly holds the circuit base material 12 at a predetermined position. In the following description, the transport direction of the circuit substrate 12 will be referred to as the X direction, the horizontal direction orthogonal to that direction will be referred to as the Y direction, and the vertical direction will be referred to as the Z direction. That is, the width direction of the component mounter 10 is the X direction, and the front-back direction is the Y direction.
　部品装着装置２４は、ビーム部４２に配設されており、２台の作業ヘッド５６，５８と作業ヘッド移動装置６２とを有している。作業ヘッド移動装置６２は、図２に示すように、Ｘ方向移動装置６３とＹ方向移動装置６４とＺ方向移動装置６５とによって構成されている。Ｘ方向移動装置６３及びＹ方向移動装置６４は、それぞれ、電磁モータ（図６参照）６６，６８を有しており、各電磁モータ６６，６８の作動により、２台の作業ヘッド５６，５８が、一体的にフレーム部４０上の任意の位置に移動する。また、Ｚ方向移動装置６５は、電磁モータ（図６参照）７０，７２を有しており、各電磁モータ７０，７２の作動により、スライダ７４，７６が個別に上下方向に移動する。そして、そのスライダ７４，７６に作業ヘッド５６，５８が着脱可能に装着されている。これにより、作業ヘッド５６，５８は、Ｚ方向移動装置６５によって、個別に上下方向に移動する。 The component mounting device 24 is disposed in the beam section 42 and has two work heads 56 and 58 and a work head moving device 62. As shown in FIG. 2, the work head moving device 62 includes an X-direction moving device 63, a Y-direction moving device 64, and a Z-direction moving device 65. The X-direction moving device 63 and the Y-direction moving device 64 have electromagnetic motors (see FIG. 6) 66 and 68, respectively, and the operation of the electromagnetic motors 66 and 68 causes the two work heads 56 and 58 to move. , Integrally move to an arbitrary position on the frame portion 40. Further, the Z-direction moving device 65 has electromagnetic motors (see FIG. 6) 70 and 72, and the sliders 74 and 76 individually move in the vertical direction by the operation of the electromagnetic motors 70 and 72. The work heads 56 and 58 are detachably attached to the sliders 74 and 76. As a result, the work heads 56 and 58 are individually moved in the vertical direction by the Z-direction moving device 65.
　また、各作業ヘッド５６，５８は、回路基材１２に部品を装着するものであり、図３に示すように、８本の棒状の装着ユニット８０を備えている。そして、それら８本の装着ユニット８０の各々の先端部に、部品保持具８２が装着されている。部品保持具８２は、所謂チャックであり、図４に示すように、本体部８４と１対の爪部８６とを含む。１対の爪部８６は、本体部８４の下面から下方に延び出すように配設されており、互いに接近・離間可能にスライドする。これにより、部品保持具８２は、１対の爪部８６を接近させることで、１対の爪部８６によって部品を狭持し、１対の爪部８６を離間させることで、１対の爪部８６の間から部品を離脱する。 Further, the work heads 56 and 58 are for mounting components on the circuit substrate 12, and are provided with eight rod-shaped mounting units 80 as shown in FIG. A component holder 82 is attached to the tip of each of the eight attachment units 80. The component holder 82 is a so-called chuck, and as shown in FIG. 4, includes a main body portion 84 and a pair of claw portions 86. The pair of claw portions 86 are arranged so as to extend downward from the lower surface of the main body portion 84, and slide so that they can approach and separate from each other. As a result, the component holder 82 holds the component by the pair of claws 86 by bringing the pair of claws 86 close to each other, and separates the pair of claws 86 from each other by the pair of claws 86. The part is removed from between the parts 86.
　また、図３に示すように、８本の装着ユニット８０は、ユニット保持体８８の外周部に、等角度ピッチで、軸方向が垂直となる状態に保持されており、部品保持具８２は、ユニット保持体８８の下面から下方に向かって延び出している。ユニット保持体８８は、保持体回転装置９０の電磁モータ（図６参照）９２によって、装着ユニット８０の配設角度毎に間欠回転する。これにより、複数の装着ユニット８０の停止位置のうちの１つの停止位置である昇降ステーションに、装着ユニット８０が順次停止する。そして、その昇降ステーションに位置する装着ユニット８０は、ユニット昇降装置９６の電磁モータ（図６参照）９８によって昇降する。これにより、部品保持具８２に保持された部品の上下方向の位置が変更される。つまり、作業ヘッド５６，５８では、８本の装着ユニット８０のうちの昇降ステーションに位置する１本の装着ユニット８０のみが昇降し、その昇降ステーションに位置する装着ユニット８０の部品保持具８２に保持された部品のみが上下方向に移動する。なお、８本の装着ユニット８０の下端に装着されている８個の部品保持具８２の各々は、装着ユニット８０にワンタッチで着脱可能とされており、例えば、保持対象の部品のサイズ等に応じて交換可能とされている。 Further, as shown in FIG. 3, the eight mounting units 80 are held on the outer peripheral portion of the unit holder 88 at equal angular pitches in a state where the axial direction is vertical, and the component holder 82 is It extends downward from the lower surface of the unit holder 88. The unit holder 88 is intermittently rotated by the electromagnetic motor (see FIG. 6) 92 of the holder rotating device 90 at each installation angle of the mounting unit 80. As a result, the mounting unit 80 sequentially stops at the lifting station, which is one of the stopping positions of the plurality of mounting units 80. Then, the mounting unit 80 located at the lifting station is lifted and lowered by the electromagnetic motor (see FIG. 6) 98 of the unit lifting device 96. As a result, the vertical position of the component held by the component holder 82 is changed. That is, in the work heads 56 and 58, only one of the eight mounting units 80 located in the lifting station moves up and down and is held by the component holder 82 of the mounting unit 80 located in the lifting station. Only the removed parts move up and down. Each of the eight component holders 82 mounted on the lower ends of the eight mounting units 80 can be attached / detached to / from the mounting unit 80 with one touch. For example, depending on the size of the component to be held, etc. Can be exchanged.
　また、マークカメラ２６は、図２に示すように、下方を向いた状態でスライダ７４に取り付けられており、作業ヘッド５６とともに、Ｘ方向，Ｙ方向およびＺ方向に移動する。これにより、マークカメラ２６は、作業ヘッド移動装置６２の作動により任意の位置に移動し、フレーム部４０上の任意の位置を撮像する。 Further, as shown in FIG. 2, the mark camera 26 is attached to the slider 74 while facing downward, and moves with the work head 56 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 moves to an arbitrary position by the operation of the work head moving device 62, and images the arbitrary position on the frame unit 40.
　また、パーツカメラ２８は、図１に示すように、フレーム部４０上の基材搬送保持装置２２と部品供給装置３０との間に、上を向いた状態で配設されている。これにより、部品を保持する作業ヘッド５６，５８が、作業ヘッド移動装置６２の作動によりパーツカメラ２８の上方に移動することで、パーツカメラ２８が、部品保持具８２に保持された部品を撮像する。詳しくは、パーツカメラ２８は、図５に示すように、撮像装置１００と、レンズ１０２と、レーザー照明１０４とを備えている。撮像装置１００は、撮像素子（図示省略）を有しており、受光面を上方に向けて配設されている。レンズ１０２は、撮像装置１００の受光面側、つまり、図５での上面側に固定されており、レンズ１０２の上に、箱型部材１０５などを介して、レーザー照明１０４が設けられている。レーザー照明１０４は、４個のレーザー照射装置（図では２個のレーザー照射装置のみが記されている）１０６によって構成されている。４個のレーザー照射装置１０６は、部品保持具８２に保持された部品を周囲から囲むように、４等配の位置に配設されている。そして、４個のレーザー照射装置１０６は、部品保持具８２に保持された部品に向かって、側方の４箇所からレーザー光を照射する。これにより、部品保持具８２に保持された部品が、撮像装置１００により撮像される。 Further, as shown in FIG. 1, the parts camera 28 is arranged between the base material conveying and holding device 22 on the frame portion 40 and the parts supply device 30 so as to face upward. As a result, the work heads 56 and 58 holding the parts move above the parts camera 28 by the operation of the work head moving device 62, and the parts camera 28 images the parts held by the part holder 82. .. Specifically, as shown in FIG. 5, the parts camera 28 includes an imaging device 100, a lens 102, and a laser illumination 104. The image pickup apparatus 100 has an image pickup element (not shown), and is arranged with the light receiving surface facing upward. The lens 102 is fixed to the light receiving surface side of the imaging device 100, that is, the upper surface side in FIG. 5, and the laser illumination 104 is provided on the lens 102 via a box-shaped member 105 and the like. The laser illumination 104 is composed of four laser irradiation devices (only two laser irradiation devices are shown in the drawing) 106. The four laser irradiation devices 106 are arranged at four equal positions so as to surround the components held by the component holder 82 from the periphery. Then, the four laser irradiation devices 106 irradiate the components held by the component holder 82 with laser light from four lateral positions. As a result, the component held by the component holder 82 is imaged by the imaging device 100.
　また、部品供給装置３０は、図１に示すように、フレーム部４０の前後方向での一方側の端部に配設されている。部品供給装置３０は、トレイ型部品供給装置１１０とフィーダ型部品供給装置（図６参照）１１２とを有している。トレイ型部品供給装置１１０は、トレイの上に載置された状態の部品を供給する装置である。フィーダ型部品供給装置１１２は、テープフィーダ、スティックフィーダ（図示省略）によって部品を供給する装置である。 Further, as shown in FIG. 1, the component supply device 30 is arranged at one end of the frame portion 40 in the front-rear direction. The component supply device 30 has a tray-type component supply device 110 and a feeder-type component supply device (see FIG. 6) 112. The tray-type component supply device 110 is a device that supplies components placed on a tray. The feeder-type component supply device 112 is a device that supplies components using a tape feeder or a stick feeder (not shown).
　ばら部品供給装置３２は、フレーム部４０の前後方向での他方側の端部に配設されている。ばら部品供給装置３２は、ばらばらに散在された状態の複数の部品を整列させて、整列させた状態で部品を供給する装置である。つまり、任意の姿勢の複数の部品を、所定の姿勢に整列させて、所定の姿勢の部品を供給する装置である。 The loose-parts supply device 32 is arranged at the other end of the frame 40 in the front-rear direction. The discrete component supply device 32 is a device that aligns a plurality of components in a scattered state and supplies the components in the aligned state. In other words, it is a device that aligns a plurality of components in arbitrary postures in a predetermined posture and supplies the components in a predetermined posture.
　制御装置３６は、図６に示すように、コントローラ１２０、複数の駆動回路１２２、画像処理装置１２６を備えている。複数の駆動回路１２２は、上記搬送装置５０、クランプ装置５２、電磁モータ６６，６８，７０，７２，９２，９８、トレイ型部品供給装置１１０、フィーダ型部品供給装置１１２、ばら部品供給装置３２に接続されている。コントローラ１２０は、ＣＰＵ，ＲＯＭ，ＲＡＭ等を備え、コンピュータを主体とするものであり、複数の駆動回路１２２に接続されている。これにより、基材搬送保持装置２２、部品装着装置２４等の作動が、コントローラ１２０によって制御される。また、コントローラ１２０は、画像処理装置１２６にも接続されている。画像処理装置１２６は、マークカメラ２６およびパーツカメラ２８によって得られた画像データを処理するものであり、コントローラ１２０は、画像データから各種情報を取得する。 As shown in FIG. 6, the control device 36 includes a controller 120, a plurality of drive circuits 122, and an image processing device 126. The plurality of drive circuits 122 are provided in the transfer device 50, the clamp device 52, the electromagnetic motors 66, 68, 70, 72, 92, 98, the tray type component supply device 110, the feeder type component supply device 112, and the bulk component supply device 32. It is connected. The controller 120 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 122. As a result, the controller 120 controls the operations of the base material carrying and holding device 22, the component mounting device 24, and the like. The controller 120 is also connected to the image processing device 126. The image processing device 126 processes the image data obtained by the mark camera 26 and the parts camera 28, and the controller 120 acquires various information from the image data.
　部品実装機１０では、上述した構成によって、基材搬送保持装置２２に保持された回路基材１２に対して部品の装着作業が行われる。部品実装機１０では、種々の部品の装着作業を行うことが可能であるが、リードを有する電気部品、所謂リード部品の装着作業について、以下に説明する。なお、リード部品１５０は、図５に示すように、ブロック状の部品本体１５２と、部品本体１５２の底面から突出する２本のリード１５４とから構成されている。 In the component mounter 10, the component mounting operation is performed on the circuit substrate 12 held by the substrate transfer / holding device 22 with the above-described configuration. The component mounter 10 can perform various component mounting work. The mounting work of electrical components having leads, so-called lead components, will be described below. As shown in FIG. 5, the lead component 150 is composed of a block-shaped component body 152 and two leads 154 protruding from the bottom surface of the component body 152.
　具体的には、回路基材１２が、作業位置まで搬送され、その位置において、クランプ装置５２によって固定的に保持される。次に、マークカメラ２６が、回路基材１２の上方に移動し、回路基材１２を撮像する。そして、コントローラ１２０が、その撮像データに基づいて、クランプ装置５２による回路基材１２の保持位置の誤差，回路基材１２に形成されている挿入穴の位置などを演算する。また、部品供給装置３０若しくは、ばら部品供給装置３２は、所定の供給位置において、リード部品１５０を供給する。そして、作業ヘッド５６，５８の何れかが、部品の供給位置の上方に移動し、部品保持具８２によってリード部品１５０の部品本体１５２を保持する。 Specifically, the circuit substrate 12 is transported to the work position and is fixedly held by the clamp device 52 at that position. Next, the mark camera 26 moves above the circuit board 12 and takes an image of the circuit board 12. Then, the controller 120 calculates the error of the holding position of the circuit substrate 12 by the clamp device 52, the position of the insertion hole formed in the circuit substrate 12, and the like based on the imaged data. Further, the component supply device 30 or the bulk component supply device 32 supplies the lead component 150 at a predetermined supply position. Then, one of the work heads 56, 58 moves above the component supply position, and the component holder 152 holds the component body 152 of the lead component 150.
　続いて、作業ヘッド５６，５８が、パーツカメラ２８の上方に移動し、パーツカメラ２８によって、部品保持具８２に保持されたリード部品１５０が撮像される。詳しくは、パーツカメラ２８の上方に移動した作業ヘッド５６，５８が下降することで、部品保持具８２により保持されたリード部品１５０のリード１５４に、パーツカメラ２８のレーザー照射装置１０６から照射されたレーザー光が側方から照射される。この際、レーザー照射装置１０６から照射された光は、部品保持具８２に保持されたリード部品１５０のリード１５４によって反射し、その反射光がレンズ１０２に入射する。そして、レンズ１０２に入射した光が、撮像装置１００に入射し、撮像装置１００の撮像素子により検出される。これにより、部品保持具８２に保持されたリード部品１５０のリード１５４の撮像データが得られる。そして、その撮像データがコントローラ１２０において解析されることで、リード部品１５０のリード１５４の先端部の位置が演算される。 Subsequently, the work heads 56 and 58 move above the parts camera 28, and the parts camera 28 takes an image of the lead part 150 held by the part holder 82. More specifically, the work heads 56 and 58 that have moved above the parts camera 28 are lowered to irradiate the leads 154 of the lead part 150 held by the part holder 82 from the laser irradiation device 106 of the parts camera 28. Laser light is emitted from the side. At this time, the light emitted from the laser irradiation device 106 is reflected by the lead 154 of the lead component 150 held by the component holder 82, and the reflected light enters the lens 102. Then, the light that has entered the lens 102 enters the imaging device 100 and is detected by the imaging element of the imaging device 100. As a result, the imaging data of the lead 154 of the lead component 150 held by the component holder 82 is obtained. Then, the image data is analyzed by the controller 120, and the position of the tip of the lead 154 of the lead component 150 is calculated.
　次に、リード部品１５０のリード１５４の先端部のＸＹ方向での座標と、回路基材１２の挿入穴のＸＹ方向での座標とが一致するように、Ｘ方向移動装置６３及びＹ方向移動装置６４の作動が制御される。これにより、作業ヘッド５６，５８が、ＸＹ方向に沿って移動することで、リード部品１５０のリード１５４の先端部の位置と、回路基材１２の挿入穴の位置とが上下方向に重なった状態となる。そして、Ｚ方向移動装置６５の作動により、作業ヘッド５６，５８が下降することで、部品保持具８２に保持されたリード部品１５０のリード１５４が回路基材１２の挿入穴に挿入される。これにより、リード部品１５０が、回路基材１２に装着される。 Next, the X-direction moving device 63 and the Y-direction moving device are arranged so that the coordinates in the XY directions of the tips of the leads 154 of the lead component 150 and the coordinates in the XY directions of the insertion holes of the circuit substrate 12 match. The operation of 64 is controlled. As a result, the work heads 56 and 58 move in the XY directions, so that the position of the tip of the lead 154 of the lead component 150 and the position of the insertion hole of the circuit substrate 12 overlap in the vertical direction. Becomes Then, the work heads 56 and 58 are lowered by the operation of the Z-direction moving device 65, so that the leads 154 of the lead component 150 held by the component holder 82 are inserted into the insertion holes of the circuit substrate 12. As a result, the lead component 150 is mounted on the circuit substrate 12.
　このように、部品実装機１０では、部品保持具８２に保持されたリード部品１５０のリード１５４が回路基材１２の挿入穴に挿入されることで、リード部品１５０が回路基材１２に装着される。このため、部品保持具８２に保持されたリード部品１５０のリード１５４の先端部の位置を特定することが必要であり、そのリード１５４の先端部の位置を特定するために、部品保持具８２に保持されたリード部品１５０が、上述したように、パーツカメラ２８により撮像される。また、部品実装機１０では、複数の部品を同時に保持することが可能な作業ヘッド５６，５８が用いられている。このため、部品実装機１０では、複数のリード部品を保持する作業ヘッド５６，５８を上下方向に移動させた状態、つまり、移動させながら、複数のリード部品がパーツカメラ２８により撮像される。 As described above, in the component mounter 10, the lead 154 of the lead component 150 held by the component holder 82 is inserted into the insertion hole of the circuit substrate 12, so that the lead component 150 is mounted on the circuit substrate 12. It Therefore, it is necessary to identify the position of the tip of the lead 154 of the lead component 150 held by the component holder 82. To identify the position of the tip of the lead 154, The held lead component 150 is imaged by the parts camera 28 as described above. In the component mounter 10, work heads 56 and 58 that can simultaneously hold a plurality of components are used. Therefore, in the component mounter 10, the plurality of lead components are imaged by the parts camera 28 while the work heads 56 and 58 holding the plurality of lead components are moved in the vertical direction, that is, while being moved.
　詳しくは、例えば、図７に示すように、作業ヘッド５６，５８により複数の異なる種類のリード部品１５０ａ，ｂ，ｃ，ｄが保持される場合において、それら複数の異なる種類のリード部品１５０ａ，ｂ，ｃ，ｄのサイズに応じて、複数の装着ユニット８０に、複数の異なるサイズの部品保持具８２ａ，ｂ，ｃ，ｄが装着される場合がある。このような場合には、リード部品１５０の部品保持具８２により保持される部分である被保持部の高さが、リード部品毎に異なる。なお、リード部品１５０の被保持部は、リード部品１５０の部品本体１５２の側面が、部品保持具８２の爪部８６により把持される部分であり、部品本体１５２と爪部８６とが接触する部分である。また、別の言い方をすれば、部品本体１５２と爪部８６とが左右方向、厳密に言えば水平方向において重なる部分である。また、それら複数のリード部品１５０は異なる種類であるため、サイズがリード部品毎に異なる。このため、作業ヘッド５６，５８に保持された複数のリード部品のリードの位置が上下方向において異なる。 Specifically, for example, as shown in FIG. 7, when a plurality of different types of lead components 150a, b, c, d are held by the work heads 56, 58, the plurality of different types of lead components 150a, 150b are held. , C, d, a plurality of mounting units 80 may be mounted with a plurality of component holders 82a, b, c, d having different sizes. In such a case, the height of the held portion, which is the portion of the lead component 150 held by the component holder 82, differs for each lead component. The held portion of the lead component 150 is a portion where the side surface of the component body 152 of the lead component 150 is gripped by the claw portion 86 of the component holder 82, and the portion where the component body 152 and the claw portion 86 contact each other. Is. In other words, it is a portion where the component body 152 and the claw portion 86 overlap in the left-right direction, strictly speaking, in the horizontal direction. Further, since the plurality of lead components 150 are of different types, the size differs for each lead component. Therefore, the positions of the leads of the plurality of lead components held by the work heads 56 and 58 are different in the vertical direction.
　このような場合において、例えば、パーツカメラ２８のレーザー照射装置１０６により照射された光が、部品保持具８２ｂに保持されたリード部品１５０ｂのリード１５４に照射される位置まで、作業ヘッド５６，５８が下降する。そして、リード部品１５０ｂのリード１５４に光が照射されたタイミングでパーツカメラ２８による撮像が行われる。この際、レーザー照射装置１０６から照射された光は、リード部品１５０ｂのリード１５４によって反射し、その反射光がレンズ１０２に入射する。そして、レンズ１０２に入射した光が、撮像装置１００に入射し、撮像装置１００の撮像素子により検出される。これにより、リード部品１５０ｂのリード１５４の撮像データが得られる。そして、コントローラ１２０において、その撮像データが解析され、リード部品１５０ｂのリード１５４の先端部の位置が演算される。 In such a case, for example, the work heads 56 and 58 reach the position where the light emitted by the laser irradiation device 106 of the parts camera 28 is emitted to the leads 154 of the lead component 150b held by the component holder 82b. To descend. Then, the parts camera 28 takes an image at the timing when the lead 154 of the lead component 150b is irradiated with light. At this time, the light emitted from the laser irradiation device 106 is reflected by the lead 154 of the lead component 150b, and the reflected light enters the lens 102. Then, the light that has entered the lens 102 enters the imaging device 100 and is detected by the imaging element of the imaging device 100. Thereby, the imaging data of the lead 154 of the lead component 150b is obtained. Then, the controller 120 analyzes the imaged data and calculates the position of the tip of the lead 154 of the lead component 150b.
　次に、レーザー照射装置１０６により照射された光が、部品保持具８２ｃに保持されたリード部品１５０ｃのリード１５４に照射される位置まで、作業ヘッド５６，５８が下降し、そのタイミングで、リード部品１５０ｃのリード１５４がパーツカメラ２８により撮像される。そして、コントローラ１２０において、撮像データが解析され、リード部品１５０ｃのリード１５４の先端部の位置が演算される。続いて、レーザー照射装置１０６により照射された光が、部品保持具８２ａに保持されたリード部品１５０ａのリード１５４に照射される位置まで、作業ヘッド５６，５８が下降し、そのタイミングで、リード部品１５０ａのリード１５４がパーツカメラ２８により撮像される。そして、コントローラ１２０において、撮像データが解析され、リード部品１５０ａのリード１５４の先端部の位置が演算される。さらに、レーザー照射装置１０６により照射された光が、部品保持具８２ｄに保持されたリード部品１５０ｄのリード１５４に照射される位置まで、作業ヘッド５６，５８が下降し、そのタイミングで、リード部品１５０ｄのリード１５４がパーツカメラ２８により撮像される。そして、コントローラ１２０において、撮像データが解析され、リード部品１５０ｄのリード１５４の先端部の位置が演算される。 Next, the work heads 56 and 58 descend to the position where the light emitted by the laser irradiation device 106 is emitted to the lead 154 of the lead component 150c held by the component holder 82c, and at that timing, the lead component is moved. The lead 154 of 150c is imaged by the parts camera 28. Then, the controller 120 analyzes the imaged data and calculates the position of the tip of the lead 154 of the lead component 150c. Then, the work heads 56 and 58 descend to the position where the light emitted by the laser irradiation device 106 is emitted to the lead 154 of the lead component 150a held by the component holder 82a, and at that timing, the lead component is moved. The lead 154 of 150a is imaged by the parts camera 28. Then, the controller 120 analyzes the imaged data and calculates the position of the tip portion of the lead 154 of the lead component 150a. Further, the work heads 56 and 58 descend to the position where the light emitted by the laser irradiation device 106 is emitted to the leads 154 of the lead component 150d held by the component holder 82d, and at that timing, the lead component 150d. The lead 154 is imaged by the parts camera 28. Then, the controller 120 analyzes the imaged data and calculates the position of the tip of the lead 154 of the lead component 150d.
　このように、複数のリード部品を保持する作業ヘッド５６，５８を上下方向に移動させた状態で、複数のリード部品がパーツカメラ２８により撮像されることで、複数のリード部品のリードの先端位置が演算される。これにより、作業ヘッド５６，５８に保持された複数のリード部品１５０の先端部を回路基材１２の挿入穴に適切に挿入し、それら複数のリード部品１５０の装着作業を適切に行うことができる。なお、パーツカメラ２８による撮像時に、作業ヘッド５６，５８は一時的に停止してもよく、停止しなくてもよい。つまり、作業ヘッド５６，５８を上下方向に連続的に移動させた状態で、複数のリード部品がパーツカメラ２８により撮像されてよく、作業ヘッド５６，５８を上下方向に断続的に移動させた状態で、複数のリード部品がパーツカメラ２８により撮像されてもよい。 In this way, the tip positions of the leads of the plurality of lead components are obtained by capturing an image of the plurality of lead components with the work heads 56 and 58 holding the plurality of lead components being moved in the vertical direction. Is calculated. Accordingly, the leading ends of the lead components 150 held by the work heads 56 and 58 can be properly inserted into the insertion holes of the circuit substrate 12, and the mounting work of the lead components 150 can be appropriately performed. .. The work heads 56 and 58 may or may not be temporarily stopped when the parts camera 28 takes an image. That is, a plurality of lead parts may be imaged by the parts camera 28 in a state in which the work heads 56, 58 are continuously moved in the vertical direction, and a state in which the work heads 56, 58 are intermittently moved in the vertical direction. Then, a plurality of lead parts may be imaged by the parts camera 28.
　ただし、上記手法では、リード部品毎にパーツカメラ２８による撮像が行われ、撮像により得られた撮像データの解析が行われるため、撮像データの解析等に要する時間が長くなる。つまり、上記手法では、リード部品１５０ｂの撮像データが解析され、リード部品１５０ｃの撮像データが解析され、リード部品１５０ａの撮像データが解析され、リード部品１５０ｄの撮像データが解析されることで、４回の撮像データの解析により、撮像データの解析等に要する時間が長くなる。そこで、複数のリード部品を保持する作業ヘッド５６，５８を上下方向に移動させた状態で、それら複数のリード部品が１回の撮像により纏めて撮像されてもよい。 However, in the above method, since the parts camera 28 images each lead component and the imaging data obtained by the imaging is analyzed, it takes a long time to analyze the imaging data. That is, in the above method, the image data of the lead component 150b is analyzed, the image data of the lead component 150c is analyzed, the image data of the lead component 150a is analyzed, and the image data of the lead component 150d is analyzed. By analyzing the imaged data once, the time required for analyzing the imaged data and the like becomes long. Therefore, the plurality of lead components may be collectively imaged by one-time imaging while the work heads 56 and 58 holding the plurality of lead components are moved in the vertical direction.
　詳しくは、作業ヘッド５６，５８が、Ｘ方向移動装置６３及びＹ方向移動装置６４の作動によりパーツカメラ２８の上方に移動され、Ｚ方向移動装置６５の作動により下方撮像位置まで下降する。下方撮像位置は、作業ヘッド５６，５８の装着ユニット８０に最もサイズの小さい部品保持具８２が装着され、その部品保持具８２により最もサイズの小さいリード部品１５０が保持された場合に、そのリード部品１５０のリード１５４に、図８に示すように、レーザー照射装置１０６により照射された光が照射される際の作業ヘッド５６，５８の上下方向における位置である。つまり、作業ヘッド５６，５８により保持可能なリード部品のうちの、保持されたリード部品のリードが最も上方に位置するリード部品のリードに、レーザー照射装置１０６により照射された光が照射される際の作業ヘッド５６，５８の上下方向における位置が、下方撮像位置となる。また、別の言い方をすれば、作業ヘッド５６，５８に保持されたリード部品のリードが装着ユニット８０の下端面の最も近くに位置する状態において、そのリードに、レーザー照射装置１０６により照射された光が照射される際の作業ヘッド５６，５８の上下方向における位置が、下方撮像位置となる。 Specifically, the work heads 56 and 58 are moved above the parts camera 28 by the operation of the X-direction moving device 63 and the Y-direction moving device 64, and are lowered to the lower imaging position by the operation of the Z-direction moving device 65. At the lower imaging position, when the component holder 82 having the smallest size is mounted on the mounting unit 80 of the work heads 56 and 58 and the lead component 150 having the smallest size is held by the component holder 82, the lead component is held. As shown in FIG. 8, it is the position in the vertical direction of the work heads 56 and 58 when the light emitted from the laser irradiation device 106 is applied to the lead 154 of the 150. That is, of the lead components that can be held by the work heads 56 and 58, when the lead of the held lead component is positioned at the uppermost position, the light emitted by the laser irradiation device 106 is irradiated. The positions of the work heads 56 and 58 in the vertical direction are the lower imaging positions. In other words, when the lead of the lead component held by the work heads 56 and 58 is located closest to the lower end surface of the mounting unit 80, the lead is irradiated by the laser irradiation device 106. The position of the work heads 56, 58 in the up-down direction when the light is irradiated is the lower imaging position.
　このように作業ヘッド５６，５８が下方撮像位置まで下降すると、パーツカメラ２８による撮像が開始される。つまり、パーツカメラ２８の撮像装置１００のシャッターが開放される。そして、撮像装置１００のシャッターが開放された状態で、作業ヘッド５６，５８が、Ｚ方向移動装置６５の作動により、下方撮像位置から上方撮像位置まで上昇する。上方撮像位置は、作業ヘッド５６，５８の装着ユニット８０に最もサイズの大きい部品保持具８２が装着され、その部品保持具８２により最もサイズの大きいリード部品１５０が保持された場合に、そのリード部品１５０のリード１５４に、図９に示すように、レーザー照射装置１０６により照射された光が照射される際の作業ヘッド５６，５８の上下方向における位置である。つまり、作業ヘッド５６，５８により保持可能なリード部品のうちの、保持されたリード部品のリードが最も下方に位置するリード部品のリードに、レーザー照射装置１０６により照射された光が照射される際の作業ヘッド５６，５８の上下方向における位置が、上方撮像位置となる。また、別の言い方をすれば、作業ヘッド５６，５８に保持されたリード部品のリードが装着ユニット８０の下端面の最も遠くに位置する状態において、そのリードに、レーザー照射装置１０６により照射された光が照射される際の作業ヘッド５６，５８の上下方向における位置が、上方撮像位置となる。 When the work heads 56 and 58 descend to the lower imaging position in this way, the parts camera 28 starts imaging. That is, the shutter of the imaging device 100 of the parts camera 28 is released. Then, with the shutter of the imaging device 100 being opened, the work heads 56 and 58 are moved up from the lower imaging position to the upper imaging position by the operation of the Z-direction moving device 65. At the upper imaging position, when the component holder 82 having the largest size is mounted on the mounting unit 80 of the work heads 56 and 58 and the lead component 150 having the largest size is held by the component holder 82, the lead component is held. As shown in FIG. 9, it is the position in the vertical direction of the work heads 56, 58 when the light emitted by the laser irradiation device 106 is applied to the lead 154 of 150. That is, of the lead components that can be held by the work heads 56 and 58, when the lead of the held lead component is located at the lowermost position, the light emitted by the laser irradiation device 106 is irradiated. The positions of the work heads 56 and 58 in the vertical direction are the upper imaging positions. In other words, when the leads of the lead components held by the work heads 56 and 58 are located farthest from the lower end surface of the mounting unit 80, the leads are irradiated by the laser irradiation device 106. The position of the work heads 56, 58 in the up-down direction when the light is irradiated is the upper imaging position.
　そして、作業ヘッド５６，５８が、Ｚ方向移動装置６５の作動により、下方撮像位置から上方撮像位置まで上昇すると、撮像装置１００のシャッターが閉じられる。つまり、作業ヘッド５６，５８が下方撮像位置から上方撮像位置に上昇している間、撮像装置１００のシャッターが開放された状態で維持される。これにより、作業ヘッド５６，５８に保持された複数のリード部品の全てのリードに、レーザー照射装置１０６から光が照射された状態で、それら複数のリード部品の全てのリードが１回の撮像により纏めて撮像される。このため、その撮像により得られる撮像データを解析することで、作業ヘッド５６，５８に保持された複数のリード部品の全てのリードの先端位置を演算することができる。これにより、１回の撮像データの解析により、作業ヘッド５６，５８に保持された複数のリード部品の全てのリードの先端位置を特定することが可能となり、撮像データの解析等に要する時間を短縮できる。 Then, when the work heads 56 and 58 are moved up from the lower image pickup position to the upper image pickup position by the operation of the Z direction moving device 65, the shutter of the image pickup device 100 is closed. That is, while the work heads 56 and 58 are elevated from the lower image pickup position to the upper image pickup position, the shutter of the image pickup apparatus 100 is kept open. As a result, all the leads of the plurality of lead components held by the work heads 56 and 58 are irradiated with light from the laser irradiation device 106, and all the leads of the plurality of lead components are imaged once. The images are taken together. Therefore, the tip positions of all the leads of the plurality of lead components held by the work heads 56 and 58 can be calculated by analyzing the imaged data obtained by the image pickup. This makes it possible to specify the tip positions of all the leads of the plurality of lead components held by the work heads 56 and 58 by analyzing the imaged data once, and shorten the time required for the imaged data analysis and the like. it can.
　なお、部品実装機１０は、作業機の一例である。パーツカメラ２８は、撮像装置の一例である。制御装置３６は、制御装置の一例である。作業ヘッド５６，５８は、作業ヘッドの一例である。作業ヘッド移動装置６２は、移動装置の一例である。部品保持具８２は、保持具の一例である。爪部８６は、把持爪の一例である。リード部品１５０は、電気部品の一例である。リード１５４は、リード端子の一例である。 The component mounter 10 is an example of a working machine. The parts camera 28 is an example of an imaging device. The control device 36 is an example of a control device. The work heads 56 and 58 are examples of work heads. The work head moving device 62 is an example of a moving device. The component holder 82 is an example of a holder. The claw portion 86 is an example of a grip claw. The lead component 150 is an example of an electrical component. The lead 154 is an example of a lead terminal.
　また、本発明は、上記実施例に限定されるものではなく、当業者の知識に基づいて種々の変更、改良を施した種々の態様で実施することが可能である。具体的には、例えば、上記実施例では、撮像データに基づいてリード部品１５０のリード１５４の位置が演算されているが、電気部品のピン，端子，バンプなどのリード端子の位置が撮像データに基づいて演算されてもよい。また、リード部品１５０のリード１５４が回路基材１２の挿入穴に挿入されることで、リード部品１５０が回路基材１２に装着されているが、リード１５４等のリード端子が貫通孔，凹部，引っ掛け部，位置決め部などにより位置決めされることで、電気部品が回路基材１２等に装着されてもよい。 Further, the present invention is not limited to the above-mentioned embodiments, and can be carried out in various modes with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the position of the lead 154 of the lead component 150 is calculated based on the imaged data, but the position of the lead terminal such as the pin, terminal, or bump of the electrical component is included in the imaged data. It may be calculated based on. Further, the lead component 150 is mounted on the circuit substrate 12 by inserting the lead 154 of the lead component 150 into the insertion hole of the circuit substrate 12, but the lead terminals such as the lead 154 have through holes, recesses, The electric component may be mounted on the circuit substrate 12 or the like by being positioned by the hooking portion, the positioning portion, or the like.
　また、上記実施例では、作業ヘッド５６，５８の複数の装着ユニット８０に複数の異なる種類の保持具が装着され、それら複数の異なる種類の保持具により、複数の異なる種類のリード部品が保持される態様について説明されているが、他の態様においても、本発明を適用できる。例えば、作業ヘッド５６，５８の複数の装着ユニット８０に複数の同じ種類の保持具が装着され、それら複数の同じ種類の保持具により、複数の異なる種類のリード部品が保持される態様では、リード部品毎のサイズの相違により、作業ヘッド５６，５８に保持された複数のリード部品のリードの上下方向における位置は、当然、異なる。また、例えば、作業ヘッド５６，５８の複数の装着ユニット８０に複数の同じ種類の保持具が装着され、それら複数の同じ種類の保持具により、複数の同じ種類のリード部品が保持される態様であっても、リード１５４の長さのバラツキ，部品本体１５２の高さのバラツキ，リード部品の供給位置の高さのバラツキ，部品保持具８２の公差等により、作業ヘッド５６，５８に保持された複数のリード部品のリードの上下方向における位置は異なる。このため、それらの態様においても、本発明を適用することができる。 Further, in the above-described embodiment, a plurality of different types of holders are attached to the plurality of attachment units 80 of the work heads 56 and 58, and a plurality of different types of lead components are held by the plurality of different types of holders. However, the present invention can be applied to other aspects. For example, in a mode in which a plurality of holders of the same type are mounted on the plurality of mounting units 80 of the work heads 56 and 58, and a plurality of different types of lead components are held by the plurality of holders of the same type, Due to the difference in size of each component, the positions of the leads of the plurality of lead components held by the work heads 56 and 58 in the vertical direction naturally differ. In addition, for example, a plurality of holders of the same type are mounted on the plurality of mounting units 80 of the work heads 56 and 58, and a plurality of lead components of the same type are held by the plurality of holders of the same type. Even if there is, the work heads 56 and 58 are held by the variation in the length of the lead 154, the variation in the height of the component body 152, the variation in the height of the lead component supply position, the tolerance of the component holder 82, and the like. The positions of the leads of the plurality of lead components in the vertical direction are different. Therefore, the present invention can be applied to those aspects as well.
　また、上記実施例では、作業ヘッド５６，５８を下方撮像位置から上方撮像位置に上昇させた状態で、作業ヘッド５６，５８に保持された複数のリード部品１５０が撮像されているが、作業ヘッド５６，５８を上方撮像位置から下方撮像位置に下降させた状態で、作業ヘッド５６，５８に保持された複数のリード部品１５０が撮像されてもよい。また、下方撮像位置と上方撮像位置との間に限られず、下方撮像位置より下方の位置と、上方撮像位置より上方の位置との間で、作業ヘッド５６，５８を上下方向に移動させた状態で、作業ヘッド５６，５８に保持された複数のリード部品１５０が撮像されてもよい。なお、ここでの上下方向は、Ｚ方向、厳密に言えば、鉛直方向に限られず、斜め上方，斜め下方も含む概念である。 In addition, in the above-described embodiment, the plurality of lead components 150 held by the work heads 56 and 58 are imaged in a state where the work heads 56 and 58 are raised from the lower image pickup position to the upper image pickup position. The plurality of lead components 150 held by the work heads 56 and 58 may be imaged in a state where the 56 and 58 are lowered from the upper imaging position to the lower imaging position. Further, the working heads 56 and 58 are not limited to being located between the lower imaging position and the upper imaging position, and the work heads 56 and 58 are moved in the vertical direction between a position below the lower imaging position and a position above the upper imaging position. Then, the plurality of lead components 150 held by the work heads 56 and 58 may be imaged. It should be noted that the up-down direction here is not limited to the Z direction, strictly speaking, the vertical direction, and is a concept including diagonally upward and diagonally downward.
　また、上記実施例では、リード部品１５０のリード１５４が、回路基材１２に形成された挿入穴に挿入されることで、リード部品１５０が回路基材１２に装着されている。つまり、リード部品１５０は、回路基材１２に直接的に装着されている。一方、リード部品１５０は、リード部品１５０と異なる部品を介して回路基材１２に間接的に装着されてもよい。つまり、リード部品１５０は、回路基材１２に装着されたコネクタ部品等の部品の上に装着されてもよい。 Further, in the above-described embodiment, the lead component 150 is mounted on the circuit substrate 12 by inserting the lead 154 of the lead component 150 into the insertion hole formed in the circuit substrate 12. That is, the lead component 150 is directly mounted on the circuit substrate 12. On the other hand, the lead component 150 may be indirectly attached to the circuit substrate 12 via a component different from the lead component 150. That is, the lead component 150 may be mounted on a component such as a connector component mounted on the circuit substrate 12.
　また、上記実施例では、部品を保持する保持具として、部品保持具８２、つまり、チャックが採用されているが、吸着ノズルが採用されてもよい。そして、吸着ノズルを保持具として採用する場合に、作業ヘッド５６，５８の全ての装着ユニット８０に吸着ノズルが装着されてもよく、吸着ノズルとチャックとを混在して装着してもよい。 Further, in the above embodiment, the component holder 82, that is, the chuck is adopted as the holder for holding the component, but a suction nozzle may be adopted. When the suction nozzle is used as the holder, the suction nozzle may be mounted on all the mounting units 80 of the work heads 56 and 58, or the suction nozzle and the chuck may be mounted together.
　また、上記実施例では、部品実装機１０においてリード部品１５０のリード１５４の先端位置が演算され、そのリード１５４の先端位置に基づいて、リード部品１５０の装着作業が実行されているが、部品実装機１０と異なる作業機において、リード部品１５０の装着作業が実行されてもよい。つまり、作業ヘッドを備えた作業機が、その作業ヘッドが保持したリード部品を、適切な位置決めをして配設するものでさえあれば良い。また、部品実装機１０は、リード部品１５０のリード１５４の先端位置を演算するが、リード部品１５０の装着作業を実行しなくてもよい。例えば、作業ヘッドが保持したリード部品の良否や精度を測定するものであっても良い。 Further, in the above-described embodiment, the tip position of the lead 154 of the lead component 150 is calculated in the component mounter 10, and the mounting work of the lead component 150 is executed based on the tip position of the lead 154. The work of mounting the lead component 150 may be performed by a work machine different from the machine 10. In other words, the work machine provided with the work head only needs to arrange the lead components held by the work head with appropriate positioning. Further, the component mounter 10 calculates the tip position of the lead 154 of the lead component 150, but the mounting work of the lead component 150 may not be executed. For example, the quality or accuracy of the lead component held by the work head may be measured.
　また、リードの撮像時に照射する側射光はレーザー光に限定されない。リード先端部の位置を正確に把握するためにも、拡散光ではなく平行光が望ましく、かつ、その照射する光の幅は制限することがより望ましい。 Also, the side light emitted when the lead is imaged is not limited to laser light. In order to accurately grasp the position of the tip of the lead, it is preferable to use parallel light instead of diffused light, and it is more preferable to limit the width of the light to be emitted.
　１０：部品実装機（作業機）　　２８：パーツカメラ（撮像装置）　　３６：制御装置　　５６：作業ヘッド　　５８：作業ヘッド　　６２：作業ヘッド移動装置（移動装置）　８２：部品保持具（保持具）　　８６：爪部（把持爪）　　１５０：リード部品（電気部品）　　１５４：リード（リード端子） 10: Component mounter (working machine) 28: Parts camera (imaging device) 36: Control device 56: Working head 58: Working head 62: Working head moving device (moving device) 82: Parts holding tool (holding tool) 86: Claw (grasping claw) 150: lead component (electric component) 154: lead (lead terminal)

Claims (6)

  1. 　リード端子を有する複数の電気部品を保持する作業ヘッドと、
    　前記作業ヘッドを上下方向に移動可能な移動装置と、
    　前記作業ヘッドにより保持された電気部品を、側方から光を照射した状態で撮像する撮像装置と、
    　前記作業ヘッドと前記移動装置との作動を制御する制御装置と
    　を備え、
    　前記制御装置が、
    　前記作業ヘッドに保持された複数の電気部品の各々のリード端子に前記側方からの光が照射されるように前記作業ヘッドを前記移動装置によって上下方向に移動させた状態で、前記撮像装置によって撮像された電気部品のリード端子の撮像データに基づいて、前記複数の電気部品の各々のリード端子の位置を演算する作業機。     A work head for holding a plurality of electric components having lead terminals;
    A moving device capable of moving the working head in the vertical direction,
    An image pickup device for picking up an image of an electric component held by the work head in a state where light is radiated from the side,
    A control device for controlling the operation of the work head and the moving device,
    The control device is
    By the imaging device in a state where the working head is moved in the vertical direction by the moving device so that the lead terminals of the plurality of electric components held by the working head are irradiated with the light from the side. A working machine for calculating the position of each lead terminal of the plurality of electrical components based on the imaged data of the captured lead terminals of the electrical component.
  2. 　前記作業ヘッドは、
    　異なる種類の複数の電気部品を保持し、
    　前記制御装置は、
    　前記異なる種類の複数の電気部品の各々のリード端子の位置を演算し、演算された前記異なる種類の複数の電気部品の各々のリード端子の位置に基づいて、前記異なる種類の複数の電気部品の装着作業を行う請求項１に記載の作業機。     The working head is
    Holds multiple electrical components of different types,
    The control device is
    The positions of the lead terminals of the different types of electrical components are calculated, and the positions of the lead terminals of the different types of electrical components of the different types are calculated based on the calculated positions of the lead terminals of the different types of electrical components. The working machine according to claim 1, which is used for mounting work.
  3. 　前記作業ヘッドは、
    　同じ種類の複数の電気部品を保持し、
    　前記制御装置は、
    　前記同じ種類の複数の電気部品の各々のリード端子の位置を演算し、演算された前記同じ種類の複数の電気部品の各々のリード端子の位置に基づいて、前記同じ種類の複数の電気部品の装着作業を行う請求項１に記載の作業機。     The working head is
    Holds multiple electrical components of the same type,
    The control device is
    The position of each lead terminal of the plurality of electric components of the same type is calculated, and based on the calculated position of each lead terminal of the plurality of electric components of the same type, The working machine according to claim 1, which is used for mounting work.
  4. 　前記作業ヘッドは、
    　前記複数の電気部品を保持するための複数の保持具を有し、
    　前記電気部品の前記保持具により保持される部分である被保持部の高さが、前記複数の電気部品を保持する前記複数の保持具のうちの少なくとも２以上のものにおいて異なる請求項１ないし請求項３のいずれか１項に記載の作業機。     The working head is
    Having a plurality of holders for holding the plurality of electrical components,
    The height of a held portion, which is a portion of the electric component held by the holder, is different in at least two or more of the plurality of holders that hold the plurality of electric components. Item 4. The work machine according to any one of Item 3.
  5. 　前記作業ヘッドは、
    　前記複数の電気部品を保持するための複数の保持具を有し、
    　前記複数の保持具の各々が、
    　複数の把持爪を有し、前記複数の把持爪により前記電気部品を保持する請求項１ないし請求項４のいずれか１項に記載の作業機。     The working head is
    Having a plurality of holders for holding the plurality of electrical components,
    Each of the plurality of holders,
    The working machine according to claim 1, further comprising a plurality of grip claws, wherein the plurality of grip claws hold the electric component.
  6. 　リード端子を有する複数の電気部品を保持する作業ヘッドと、
    　前記作業ヘッドを上下方向に移動可能な移動装置と、
    　前記作業ヘッドにより保持された電気部品を、側方から光を照射した状態で撮像する撮像装置と
    　を備えた作業機において、
    　前記作業ヘッドに保持された複数の電気部品の各々のリード端子に前記側方からの光が照射されるように前記作業ヘッドを前記移動装置によって上下方向に移動させた状態で、前記撮像装置によって撮像された電気部品のリード端子の撮像データに基づいて、前記複数の電気部品の各々のリード端子の位置を演算する演算方法。     A work head for holding a plurality of electric components having lead terminals;
    A moving device capable of moving the working head in the vertical direction,
    A working machine comprising: an image pickup device that picks up an image of an electric component held by the work head in a state where light is radiated from a side,
    By the imaging device in a state where the working head is moved in the vertical direction by the moving device so that the lead terminals of the plurality of electric components held by the working head are irradiated with the light from the side. A calculation method for calculating the position of each lead terminal of the plurality of electrical components based on the imaged data of the imaged lead terminals of the electrical component.
PCT/JP2018/040949 2018-11-05 2018-11-05 Work machine and calculation method WO2020095339A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000277999A (en) * 1999-03-29 2000-10-06 Tenryu Technics Co Ltd Electronic component mounting method
WO2016147332A1 (en) * 2015-03-18 2016-09-22 富士機械製造株式会社 Recognition device
WO2017085864A1 (en) * 2015-11-20 2017-05-26 富士機械製造株式会社 Substrate working machine and insertion method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4989518B2 (en) 2008-02-29 2012-08-01 株式会社日立ハイテクインスツルメンツ Electronic component mounting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000277999A (en) * 1999-03-29 2000-10-06 Tenryu Technics Co Ltd Electronic component mounting method
WO2016147332A1 (en) * 2015-03-18 2016-09-22 富士機械製造株式会社 Recognition device
WO2017085864A1 (en) * 2015-11-20 2017-05-26 富士機械製造株式会社 Substrate working machine and insertion method

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