WO2020093311A1 - 触控面板及触控面板的制作方法 - Google Patents

触控面板及触控面板的制作方法 Download PDF

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Publication number
WO2020093311A1
WO2020093311A1 PCT/CN2018/114565 CN2018114565W WO2020093311A1 WO 2020093311 A1 WO2020093311 A1 WO 2020093311A1 CN 2018114565 W CN2018114565 W CN 2018114565W WO 2020093311 A1 WO2020093311 A1 WO 2020093311A1
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WO
WIPO (PCT)
Prior art keywords
layer
touch panel
conductive
panel body
conductive layer
Prior art date
Application number
PCT/CN2018/114565
Other languages
English (en)
French (fr)
Inventor
雷晓华
胡康军
李贺
Original Assignee
深圳柔显***技术有限公司
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳柔显***技术有限公司, 深圳市柔宇科技有限公司 filed Critical 深圳柔显***技术有限公司
Priority to CN201880003053.5A priority Critical patent/CN109564491A/zh
Priority to PCT/CN2018/114565 priority patent/WO2020093311A1/zh
Priority to CN201920183500.1U priority patent/CN209674346U/zh
Publication of WO2020093311A1 publication Critical patent/WO2020093311A1/zh
Priority to US17/307,145 priority patent/US20210255717A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds

Definitions

  • This application relates to the field of touch technology, in particular to a touch panel and a method for manufacturing the same.
  • Touch panels have been widely used in smart phones (smart phones), tablet computers (tablet personal computers), personal digital assistants (Personal Digital Assistants, PDAs) and laptop computers (laptop personal computers) due to the convenience of human-computer interaction. And other electronic products.
  • the surrounding cross-section of the conductive layer of the touch panel is completely exposed, and it will be affected by the external environment to varying degrees, such as interacting with water vapor, oxygen, or other infiltrating substances, thereby There is a risk that the conductive layer will gradually fail to varying degrees.
  • the purpose of the present application is to provide a touch panel and a method for manufacturing the touch panel, to solve the technical problem that the cross section around the electrode layer is likely to gradually fail due to the influence of the external environment.
  • the touch panel includes: a first touch panel body, the first touch panel body includes a substrate layer, a conductive layer and a protective layer, the conductive layer is disposed on the substrate layer, the conductive layer Including the outer side, the protective layer covers the outer side of the conductive layer to isolate the outside from the conductive layer.
  • the manufacturing method of the touch panel includes:
  • a protective layer covering the outer side of the conductive layer is deposited on the outer surface of the conductive layer to form a first touch panel body, wherein the protective layer isolates the outside from the conductive layer.
  • the touch panel of the present application covers the outer side of the conductive layer through the protective layer to isolate the outside from the conductive layer, and thus protects the surrounding cross-section of the conductive layer so that the surrounding cross-section of the conductive layer is wrapped
  • the technical problem that the conductive layer is easy to fail is solved. That is to say, the present application avoids that the conductive material of the cross-section around the conductive layer directly contacts the outside, but forms a sealed structure isolated from the outside, thus protecting the conductive layer from erosion, oxidation, penetration and other adverse effects.
  • FIG. 1 is a schematic structural diagram of a first touch panel body provided by an embodiment of the present application.
  • FIG. 2 is a schematic structural view of the first touch panel body shown in FIG. 1 with the protective layer removed.
  • FIG. 3 is a schematic structural diagram of a touch panel provided by the first embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a touch panel provided by a second embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a touch panel provided by a third embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a touch panel provided by a fourth embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a touch panel provided by a fifth embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a touch panel provided by a sixth embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a touch panel provided by a seventh embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a touch panel provided by an eighth embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a touch panel provided by a ninth embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of a touch panel provided by a tenth embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of a touch panel provided by an eleventh embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a touch panel provided in a twelfth embodiment of the present application.
  • 15 is a schematic flowchart of a method for manufacturing a touch panel provided by the present application.
  • the present application provides a touch panel, including: a first touch panel body 100, the first touch panel body 100 includes a substrate layer 10, a conductive layer 20 and a protective layer 30, the conductive layer 20
  • the conductive layer 20 includes an outer side 201.
  • the protective layer 30 covers the outer side 201 of the conductive layer 20 to isolate the outside from the conductive layer 20.
  • the touch panel of the present application covers the outer side 201 of the conductive layer 20 with the protective layer 30 to isolate the outside from the conductive layer 20, and further protects the surrounding cross-section of the conductive layer 20, so that the surrounding cross-section of the conductive layer 20 is wrapped,
  • the surrounding section of the conductive layer 20 is prevented from being affected by the external environment, thereby solving the technical problem that the conductive layer 20 is prone to failure. That is to say, the present application avoids that the conductive substances in the cross-section around the conductive layer 20 directly contact the outside, but forms a sealed structure isolated from the outside, thus protecting the conductive layer 20 from erosion, oxidation, penetration and other adverse effects.
  • the substrate layer 10 includes a surface 101 facing the conductive layer 20.
  • the surface 101 and the outer side 201 form an accommodating space 40, and the protective layer 30 fills the accommodating space 40. That is to say, in this application, the conductive material layer in the inactive area of the edge of the conductive layer 20 is removed or partially removed to form the accommodating space 40, and then the protective layer 30 is covered in the accommodating space 40 to cross-sectionally surround the conductive layer 20 Protection is carried out so as to prevent the conductive substances of the conductive layer 20 from directly contacting the outside, thereby forming a sealed structure isolated from the outside, thus protecting the conductive layer 20 from being adversely affected by erosion, oxidation, penetration and the like.
  • the accommodating space 40 formed by the outer surface 201 of the conductive layer 20 and the surface 101 of the base material layer 10 is an “L-shaped” accommodating space 40.
  • the shape of the accommodating space 40 is not limited. It is not limited whether the surface 101 of the base material layer 10 and the outer side surface 201 of the conductive layer 20 form the accommodating space 40, and the surface 101 of the base material layer 10 and the outer side surface 201 of the conductive layer 20 may be directly flush.
  • the base material layer 10 further includes a side surface 102 connected to the surface 101.
  • the protective layer 30 fills the accommodating space 40 and forms a protective layer
  • the side surface 304 of 30 is flush with the side surface 102 of the base material layer 10.
  • the protective layer 30 includes an insulating layer 301 and an adhesive layer 302, the insulating layer 301 is connected to the adhesive layer 302, the insulating layer 301 fills the accommodating space 40, and is bonded
  • the layer 302 is stacked on the conductive layer 20, and the insulating layer 301 and the adhesive layer 302 cover the conductive layer 20 together.
  • the conductive layer 20 includes a touch layer 203
  • the touch layer 203 includes a touch electrode (not shown in the figure) and a signal trace (not shown in the figure) electrically connected to the touch electrode
  • an isolation layer 301 covers signal traces.
  • the isolation layer 301 not only covers the accommodating space 40, but also covers the signal wiring, which solves the risk that the signal wiring is prone to failure, such as corrosion.
  • the insulating layer 301 includes a first upper surface 301 a facing away from the conductive layer 20, and the adhesive layer 302 extends toward the insulating layer 301 and covers the first upper surface 301 a of the insulating layer 301. Specifically, the insulating layer 301 covers the accommodating space 40 and the signal wiring, and the adhesive layer 302 covers the remaining surface 201 a of the insulating layer 301 and the touch layer 203 not covered by the insulating layer 301.
  • the touch panel further includes a protective layer 50 that is disposed on the protective layer 30.
  • the protective layer 50 is adhered to the adhesive layer 302.
  • the protective layer 50 is adhered to the remaining surface 201 a of the isolation layer 301 and the touch layer 203 without signal traces through the adhesive layer 302.
  • the insulating layer 301 may be optically transparent or may have different colors, such as black, white, color, etc., to achieve the functions of shading, hiding conductive lines, decoration, etc., thereby reducing the printing of decorative ink on the protective layer 50 Process, or reduce the requirement of the protective ink layer 50 on the decorative ink layer.
  • the touch electrode can form a single-layer electrode pattern or upper and lower electrode layer patterns by laser, chemical etching or printing on the substrate layer on the conductive layer, and the electrode layer material can be deposited on a substrate layer such as thin film or glass Conductive substances, such as metals, metals and their oxides, nano-metallized materials, conductive organic polymers, etc.
  • the insulating layer 301 can be manufactured by printing, printing, dispensing, spraying, etc. on the accommodating space 40 and the signal trace.
  • the adhesive layer 302 may be a pressure-sensitive optical adhesive, a double-sided adhesive without a substrate layer, or a double-sided adhesive with a substrate layer.
  • the conductive layer 20 further includes a conductive trace layer 202, and the conductive trace layer 202 is disposed on the touch layer On 203, the conductive trace layer 202 includes conductive traces (not shown).
  • the conductive traces cover the signal traces and are electrically connected to the signal traces.
  • the isolation layer 301 covers the conductive traces. That is to say, in this embodiment, because the signal transmission capability and sensitivity of the touch panel are high, if the signal transmission capability of the signal trace is limited, the conductive trace is used to assist signal transmission.
  • the touch layer 203 includes a first sub-side 203a
  • the conductive trace layer 202 includes a second sub-side 202a.
  • the first sub-side 203a is connected to the second sub-side 202a to form an outer side 201.
  • the first sub-side 203a may be flush with the second sub-side 202a. It can be understood that the first sub-side 203a may not be flush with the second sub-side 202a.
  • the conductive trace layer 202 can be printed on the touch layer 203 and printed with conductive ink and cured into a conductive trace layer; or by chemically depositing conductive metal lines and the like to form a conductive trace layer.
  • the touch panel further includes a second touch panel body 200 similar to the first touch panel body 100.
  • the first touch panel body 100 and the second touch The panel body 200 is stacked.
  • the base layer 10 of the second touch panel body 200 is connected to the protective layer 30 of the first touch panel body 100.
  • the adhesive layer 302 of the first touch panel body 100 adheres the substrate layer 10 of the second touch panel body 200, and the protective layer 50 adheres to the adhesive layer 302 of the second touch panel body 200.
  • the first touch panel body 100 in this embodiment is specifically the touch panel body in the second embodiment.
  • the first touch panel body 100 may also be the touch panel body in the first embodiment. Not shown.
  • second touch panel bodies 200 there may be a plurality of second touch panel bodies 200, and several second touch panel bodies 200 are stacked and then stacked on the first touch panel body 100. This application does not limit the number of second touch panel bodies 200.
  • the difference from the third embodiment is that the conductive trace layer 202 is disposed opposite to each other, and the protective layer 30 of the second touch panel body 200 and the first touch panel body The protective layer 30 of 100 is connected. Specifically, the adhesive layer 302 of the second touch panel body 200 is connected to the adhesive layer 302 of the first touch panel body 100.
  • the adhesive layers 302 of the two touch panel bodies are bonded to each other, so that the upper and lower surfaces of the touch panel are the base material layer 10 of the second touch panel body 200 and the base material of the first touch panel body 100, respectively Layer 10, which can protect the wiring and devices inside the touch panel, thereby eliminating the preparation of the protective layer 50, saving costs, and also when the touch panel is a multi-layer design, the touch panel is protected by the protective layer 50 Is omitted and the thickness is thin.
  • the difference from the first embodiment is that the insulating layer 301 includes a first upper surface 301 a facing away from the conductive layer 20, and the adhesive layer 302 includes a first surface facing away from the conductive layer 20.
  • Two upper surfaces 302a, the first upper surface 301a and the second upper surface 302a are coplanar.
  • the insulating layer 301 covers the accommodating space 40 and the signal wiring, and the adhesive layer 302 covers the remaining surface 201 a of the touch layer 203 that is not covered by the insulating layer 301.
  • the first upper surface 301a and the second upper surface 302a are coplanar to form a flat upper surface 303, and the protective layer 50 is laminated and bonded on the flat upper surface 303.
  • the insulating layer 301 differs from the first embodiment in that the insulating layer 301 can also adhere the protective layer 50, the outer side 201 and the surface 101 of the accommodating space 40, and the top surface of the touch layer 203; That is, the insulating layer 301 may be a liquid curable or solid thermally meltable substance, and the insulating layer 301 is re-adhesive by heating, irradiating, etc. to adhere the outer surface of the protective layer 50 and the accommodating space 40 201 and the top surface of the surface 101 and a part of the touch layer 203.
  • the insulating layer 301 is disposed outside the adhesive layer 302, when the first upper surface 301a of the insulating layer 301 and the second upper surface 302a of the adhesive layer 302 are coplanar, the insulating layer 301 completely replaces the adhesive layer 302
  • the side of the cover is covered to isolate the adhesive layer 302 from the outside world, avoiding the adhesive layer 302 from adhering to impurities such as dust and foreign objects, and improving the appearance and touch of the touch panel.
  • first upper surface 301a and the second upper surface 302a may not be coplanar, but form a stepped surface.
  • the protective layer 50 includes a convex portion and a concave portion adapted to the stepped surface, and the protective layer The convex portion and the concave portion of 50 may completely fit the stepped surface formed by the first upper surface 301a and the second upper surface 302a without a gap.
  • the conductive layer 20 further includes a conductive trace layer 202.
  • the conductive trace layer 202 is disposed on the touch layer 203 and conducts conductive traces.
  • the wire layer 202 includes conductive traces (not shown in the figure).
  • the conductive traces cover the signal traces and are electrically connected to the signal traces.
  • the isolation layer 301 covers the conductive traces. That is to say, in this embodiment, because the signal transmission capability and sensitivity of the touch panel are high, if the signal transmission capability of the signal trace is limited, the conductive trace is used to assist signal transmission.
  • the conductive traces are covered on the signal traces to prevent the signal traces from being exposed, so the signal traces will not be affected by the external environment, the signal traces will not fail, and because the insulating layer 301 of the present application covers the conductive traces , Conductive traces will not fail.
  • the difference from the third embodiment is that the base layer 10 of the second touch panel body 200 and the insulating layer 301 and the adhesion of the first touch panel body 100 Laminate 302 is connected.
  • the eighth embodiment of the present application is different from the seventh embodiment in that the isolation layer 301 of the second touch panel body 200 is connected to the isolation layer 301 of the first touch panel body 100.
  • the adhesive layer 302 of the two touch panel bodies 200 is connected to the adhesive layer 302 of the first touch panel body 100.
  • This embodiment also omits the preparation of the protective layer 50 and saves costs.
  • the touch panel is thinner due to the elimination of the protective layer 50.
  • the protective layer 30 is an insulating layer 301, and the insulating layer 301 completely covers the conductive layer 20.
  • the isolation layer 301 completely covers the accommodating space 40 and the touch layer 203.
  • the insulating layer 301 and the adhesive layer 302 may be the same substance.
  • the insulating layer 301 may be a liquid-curable or solid-state thermally meltable substance, which may generate adhesiveness by heating, illuminating, etc. to adhere the upper and lower layers.
  • the conductive layer 20 further includes a conductive trace layer 202.
  • the conductive trace layer 202 is disposed on the touch layer 203 and conducts conductive traces.
  • the wire layer 202 includes conductive traces (not shown in the figure).
  • the conductive traces cover the signal traces and are electrically connected to the signal traces.
  • the isolation layer 301 covers the conductive traces. That is to say, in this embodiment, because the signal transmission capability and sensitivity of the touch panel are high, if the signal transmission capability of the signal trace is limited, the conductive trace is used to assist signal transmission.
  • the conductive traces When the conductive traces are covered on the signal traces, the bareness of the signal traces is avoided, the signal traces are not affected by the external environment, the signal traces will not fail, and because the insulating layer 301 of the present application covers the conductive traces On, conductive traces will not fail.
  • the difference from the ninth embodiment is that the base layer 10 of the second touch panel body 200 is connected to the insulating layer 301 of the first touch panel body 100 .
  • the difference from the eleventh embodiment is that the insulating layer 301 of the second touch panel body 200 is connected to the insulating layer 301 of the first touch panel body 100 .
  • This embodiment also omits the preparation of the protective layer 50 and saves costs.
  • the touch panel is of a multi-layer design, the touch panel is thinner due to the elimination of the protective layer 50.
  • this application provides a method for manufacturing a touch panel, including:
  • step 110 a substrate layer 10 is provided.
  • Step 120 forming a conductive layer 20 on the substrate layer 10, wherein the conductive layer 20 includes an outer side 201.
  • Step 130 a protective layer 30 covering the outer side 201 of the conductive layer 20 is formed on the outer side 201 of the conductive layer 20 to form the first touch panel body 100, wherein the protective layer 30 isolates the outside from the conductive layer 20.
  • a protective layer 30 covering the outer side 201 of the conductive layer 20 is provided on the outer side 201 of the conductive layer 20 to isolate the outside from the conductive layer 20, and then the surrounding cross section
  • the protection is carried out so that the surrounding cross-section of the conductive layer 20 is wrapped, which avoids the surrounding cross-section of the conductive layer 20 being affected by the external environment, thereby solving the technical problem that the conductive layer 20 is prone to failure. That is to say, the present application avoids that the conductive substances in the cross-section around the conductive layer 20 directly contact the outside, but forms a sealed structure isolated from the outside, thus protecting the conductive layer 20 from erosion, oxidation, penetration and other adverse effects.
  • the protective layer 30 may be an insulating layer 301 which completely covers the conductive layer 20.
  • the protective layer 30 may further include an insulating layer 301 and an adhesive layer 302.
  • the insulating layer 301 and the adhesive layer 302 cover the conductive layer 20 together.
  • the insulating layer 301 and the adhesive layer 302 do not limit the coverage area of the conductive layer 20 as long as the insulating layer
  • the layer 301 and the adhesive layer 302 can completely cover the conductive layer 20 together.
  • Step 120 also includes:
  • Step 121 Pattern the conductive layer 20 on the substrate layer 10 to form a touch layer 203.
  • step 130 further includes:
  • the protection layer 30 is filled in the accommodating space 40 formed by the surface 101 of the base material layer 10 and the outer side 201 of the conductive layer 20.
  • the protective layer 30 when the protective layer 30 is the insulating layer 301, the insulating layer 301 completely covers the touch layer 203.
  • the protective layer 30 further includes an adhesive layer 302, the insulating layer 301 and the adhesive layer 302 cover the touch layer 203 together, and the insulating layer 301 and the adhesive layer 302 do not limit the coverage area of the touch layer 203 as long as the insulating layer It is sufficient that 301 and the adhesive layer 302 completely cover the touch layer 203.
  • step 120 further includes:
  • Step 122 forming a conductive trace layer 202 on the touch layer 203.
  • the protective layer 30 when the protective layer 30 is the insulating layer 301, the insulating layer 301 completely covers the conductive trace layer 202 and the touch layer 203 without the conductive trace layer 202.
  • the protective layer 30 further includes an adhesive layer 302, the insulating layer 301 completely covers the conductive trace layer 202, and as for the touch layer 203 without the conductive trace layer 202, the insulating layer 301 and the adhesive layer 302 cover together, the insulating layer
  • the coverage area of the touch layer 203 without the conductive trace layer 202 is not limited by the 301 and the adhesive layer 302, as long as the isolation layer 301 and the adhesive layer 302 work together to completely Just cover.
  • the conductive material layer in the inactive area of the edge of the conductive layer 20 is removed or partially removed to form the accommodating space 40, and then the protective layer 30 is covered in the accommodating space 40 to cross-sectionally surround the conductive layer 20 Protection is carried out so as to prevent the conductive substances of the conductive layer 20 from directly contacting the outside, thereby forming a sealed structure isolated from the outside, thus protecting the conductive layer 20 from being adversely affected by erosion, oxidation, penetration and the like.
  • the present application removes or partially removes the conductive material layer in the inactive area at the edge of the conductive layer 20
  • the volume occupied by the conductive material layer in the inactive area at the edge of the conductive layer 20 is saved, so that an accommodating space 40 can be formed, which in turn can Provide space for the filling of the protective layer 30.
  • the manufacturing method of the touch panel also includes:
  • Step 140 a second touch panel body 200 identical to the first touch panel body 100 is laminated on the first touch panel body 100.
  • the base layer 10 of the second touch panel body 200 is connected to the protective layer 30 of the first touch panel body 100.
  • the adhesive layer 302 of the first touch panel body 100 adheres the substrate layer 10 of the second touch panel body 200; or the substrate layer 10 of the second touch panel body 200 and the first touch panel body 100
  • the isolation layer 301 and the adhesive layer 302 are connected; or the substrate layer 10 of the second touch panel body 200 is connected to the isolation layer 301 of the first touch panel body 100.
  • second touch panel bodies 200 there may be a plurality of second touch panel bodies 200, and several second touch panel bodies 200 are stacked and then stacked on the first touch panel body 100. This application does not limit the number of second touch panel bodies 200.
  • the manufacturing method of the touch panel also includes:
  • Step 150 forming a protective layer 50 on the protective layer 30 of the first touch panel body 100 or the protective layer 30 of the second touch panel body 200.
  • the protective layer 30 of the second touch panel body 200 is connected to the protective layer 30 of the first touch panel body 100, and the adhesive layer 302 of the second touch panel body 200 is connected to the first touch panel body 100 is connected to the adhesive layer 302; or the insulating layer 301 of the second touch panel body 100 is connected to the insulating layer 301 of the first touch panel body 100, and the adhesive layer 302 of the second touch panel body 200 is connected to the first touch
  • the adhesive layer 302 of the control panel body 100 is connected; or the isolation layer 301 of the second touch panel body 200 is connected to the isolation layer 301 of the first touch panel body 100.
  • the protective layers 30 of the two touch panel bodies are connected to each other so that the upper and lower surfaces of the touch panel are the substrate layer 10 and the first of the second touch panel touch panel body 200, respectively.
  • the substrate layer 10 of the touch panel body 100 of the touch panel can not only protect the wiring and devices inside the touch panel, but also save the preparation of the protective layer 50 and save costs.
  • the thickness of the touch panel is thinner because the protective layer 50 is omitted.

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  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Position Input By Displaying (AREA)
  • Push-Button Switches (AREA)

Abstract

一种触控面板，包括：第一触控面板本体(100)，所述第一触控面板本体(100)包括基材层(10)、导电层(20)以及防护层(30)，所述导电层(20)设于所述基材层(10)上，所述导电层(20)包括外侧面(201)，所述防护层(30)覆盖所述导电层(20)的外侧面(201)以隔绝外界与所述导电层(20)。该触控面板解决了电极层的四周截面因受到外界环境的影响容易逐渐失效的技术问题。

Description

触控面板及触控面板的制作方法 技术领域
本申请涉及触控技术领域，特别涉及一种触控面板及其制作方法。
背景技术
触控面板因具有人机互动的便利性，已被广泛应用于智能手机(smart phone)、平板电脑(tablet personal computer)、个人数码助理(Personal Digital Assistant,PDA)以及笔记本电脑(laptop personal computer)等电子产品上。然而目前制造出的触控面板中，触控面板导电层的四周截面完全裸露出来，其不同程度的会受到外界环境的影响，如与水汽、或与氧气、或其它渗入的物质发生作用，从而存在不同程度的导电层逐渐失效的风险。
申请内容
本申请的目的在于提供一种触控面板及触控面板的制作方法，以解决电极层的四周截面因受到外界环境的影响容易逐渐失效的技术问题。
所述触控面板包括：第一触控面板本体，所述第一触控面板本体包括基材层、导电层以及防护层，所述导电层设于所述基材层上，所述导电层包括外侧面，所述防护层覆盖所述导电层的外侧面以隔绝外界与所述导电层。
所述触控面板的制作方法，包括：
提供一基材层；
在所述基材层上形成导电层，其中，所述导电层包括外侧面；
在所述导电层的外侧面上沉积覆盖所述导电层的外侧面的防护层以形成第一触控面板本体，其中，所述防护层隔绝外界与所述导电层。
综上所述，本申请的触控面板通过所述防护层覆盖导电层的外侧面以隔绝外界与所述导电层，进而对导电层的四周截面进行了保护，使得导电层的四周截面被包裹，避免了导电层的四周截面受到外界环境的影响，从而解决了导电层容易失效的技术问题。也就是说，本申请避免了导电层四周截面的导电物质直接接触外界，而是形成一种与外界隔绝的密闭结构，因而保护导电层不易受 到侵蚀、氧化、渗透等不良影响。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的第一触控面板本体的结构示意图。
图2是图1所示的第一触控面板本体去掉防护层的结构示意图。
图3是本申请第一实施例提供的触控面板的结构示意图。
图4是本申请第二实施例提供的触控面板的结构示意图。
图5是本申请第三实施例提供的触控面板的结构示意图。
图6是本申请第四实施例提供的触控面板的结构示意图。
图7是本申请第五实施例提供的触控面板的结构示意图。
图8是本申请第六实施例提供的触控面板的结构示意图。
图9是本申请第七实施例提供的触控面板的结构示意图。
图10是本申请第八实施例提供的触控面板的结构示意图。
图11是本申请第九实施例提供的触控面板的结构示意图。
图12是本申请第十实施例提供的触控面板的结构示意图。
图13是本申请第十一实施例提供的触控面板的结构示意图。
图14是本申请第十二实施例提供的触控面板的结构示意图。
图15是本申请提供的触控面板的制作方法的流程示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。
请参阅图1-2，本申请提供一种触控面板，包括：第一触控面板本体100，第一触控面板本体100包括基材层10、导电层20以及防护层30，导电层20设于基材层10上，导电层20包括外侧面201，防护层30覆盖导电层20的外 侧面201以隔绝外界与导电层20。
因此，本申请的触控面板通过防护层30覆盖导电层20的外侧面201以隔绝外界与导电层20，进而对导电层20的四周截面进行了保护，使得导电层20的四周截面被包裹，避免了导电层20的四周截面受到外界环境的影响，从而解决了导电层20容易失效的技术问题。也就是说，本申请避免了导电层20四周截面的导电物质直接接触外界，而是形成一种与外界隔绝的密闭结构，因而保护导电层20不易受到侵蚀、氧化、渗透等不良影响。
在一具体实施例中，基材层10包括朝向导电层20的表面101，表面101与外侧面201形成一容置空间40，防护层30填充容置空间40。也就是说，本申请通过对导电层20边缘无效区域的导电物质层进行去除或部分去除以形成容置空间40，再通过在容置空间40内覆盖防护层30以对导电层20的四周截面进行防护，从而避免了导电层20的导电物质直接接触外界，进而形成一种与外界隔绝的密闭结构，因而保护导电层20不易受到侵蚀、氧化、渗透等不良影响。同时，当本申请对导电层20边缘无效区域的导电物质层进行去除或部分去除后，节约了导电层20边缘无效区域的导电物质层所占用的体积，从而可形成容置空间40，进而可为防护层30的填充提供空间。本实施例中，导电层20的外侧面201与基材层10的表面101形成的容置空间40为“L型”容置空间40。本申请中，容置空间40的形状不做限定。基材层10的表面101与导电层20的外侧面201是否形成容置空间40不做限定，基材层10的表面101与导电层20的外侧面201还可以直接平齐。
基材层10还包括与表面101连接的侧面102，当导电层20的外侧面201与基材层10的表面101形成容置空间40时，防护层30填充容置空间40后形成的防护层30的侧面304与基材层10的侧面102平齐。本申请中，防护层30填充容置空间40后形成的防护层30的侧面304与基材层10的侧面102是否平齐不做限定，防护层30的侧面304与基材层10的侧面102还可以为台阶状。请参阅图3，在本申请的第一实施例中，防护层30包括隔绝层301与粘合层302，隔绝层301与粘合层302相连接，隔绝层301填充容置空间40，粘合层302层叠于导电层20上，隔绝层301与粘合层302共同覆盖导电层20。
在本实施中，导电层20包括触控层203，触控层203包括触控电极(图 中未示出)及与触控电极电连接的信号走线(图中未示出)，隔绝层301覆盖信号走线。也就是说，隔绝层301不仅覆盖容置空间40，还覆盖信号走线，解决了信号走线容易发生失效的风险，如发生腐蚀等。
隔绝层301包括背离导电层20的第一上表面301a，粘合层302向隔绝层301延伸并覆盖隔绝层301的第一上表面301a。具体为，隔绝层301覆盖容置空间40与信号走线，粘合层302覆盖隔绝层301与未被隔绝层301覆盖的触控层203的剩余表面201a。
触控面板还包括保护层50，保护层50设于防护层30上。在本实施中，保护层50粘合在粘合层302上。也就是说，通过粘合层302将保护层50粘合在隔绝层301与未设置信号走线的触控层203的剩余表面201a上。
本实施例中，隔绝层301可为光学透明或可有不同着色，诸如黑色、白色、彩色等颜色，以实现遮光、隐藏导电线路、装饰等功能，从而可减少保护层50上印刷装饰油墨的工序，或减少保护层50对装饰油墨层的要求。触控电极可通过在导电层上进行激光、化学蚀刻或者在基材层上印刷等方式形成单层电极图案或上下电极层图案，其电极层材料可为在薄膜、玻璃等基材层上沉积导电类物质，诸如各金属、金属及其氧化物、纳米金属化材料、导电类有机高分子等。隔绝层301可通过在容置空间40与信号走线上进行印刷、打印、点胶、喷涂等方式制造。粘合层302可为压敏性光学胶、无基材层双面胶、带基材层双面胶等粘胶。
请参阅图2及图4，在本申请的第二实施例中，与第一实施例的不同之处在于，导电层20还包括导电走线层202，导电走线层202设于触控层203上，导电走线层202包括导电走线(图中未示出)，导电走线覆盖于信号走线上，且与信号走线电连接，隔绝层301覆盖导电走线。也就是说，在本实施例中，因为触控面板的信号传递能力及灵敏性较高，若信号走线的传递信号的能力有限时，导电走线用于辅助传递信号。触控面板导电走线覆盖于信号走线上避免了信号走线的裸露，因此信号走线不会受到外界环境的影响，信号走线不会发生失效，且由于本申请的隔绝层301覆盖导电走线上，导电走线也不会发生失效。在本实施例中，触控层203包括第一子侧面203a，导电走线层202包括第二子侧面202a，第一子侧面203a与第二子侧面202a连接以形成外侧面201。 第一子侧面203a可以与第二子侧面202a平齐。可以理解的是，第一子侧面203a也可以与第二子侧面202a不平齐。
导电走线层202可通过在触控层203上印刷、打印导电类油墨固化成导电走线层；或通过化学沉积导电性金属线路等方式制成导电走线层。
请参阅图5，在本申请的第三实施例中，触控面板还包括与第一触控面板本体100相同的第二触控面板本体200，第一触控面板本体100与第二触控面板本体200层叠设置。
在本实施例中，第二触控面板本体200的基材层10与第一触控面板本体100的防护层30连接。第一触控面板本体100的粘合层302粘合第二触控面板本体200的基材层10，保护层50粘合在第二触控面板本体200的粘合层302上。本实施例中的第一触控面板本体100具体为第二实施例的触控面板本体，第一触控面板本体100还可以为第一实施例的触控面板本体，在本申请的附图中未示出。
可以理解的是，第二触控面板本体200可以为数个，数个第二触控面板本体200层叠后再层叠在第一触控面板本体100上。本申请对第二触控面板本体200的数量不做限定。
请参阅图6，在本申请的第四实施例中，与第三实施例的不同在于，导电走线层202相向设置，第二触控面板本体200的防护层30与第一触控面板本体100的防护层30连接。具体为，第二触控面板本体200的粘合层302与第一触控面板本体100的粘合层302连接。本申请通过两个触控面板本体的粘合层302相互粘合进而使得触控面板的上下表面分别为第二触控面板本体200的基材层10与第一触控面板本体100的基材层10，可以对触控面板内部的走线以及器件进行保护，进而省去了保护层50的制备，节约成本，同时也可在触控面板为多层设计时，触控面板由于保护层50的省去而厚度较薄。
请参阅图7，在本申请的第五实施例中，与第一实施例的不同在于，隔绝层301包括背离导电层20的第一上表面301a，粘合层302包括背离导电层20的第二上表面302a，第一上表面301a与第二上表面302a共面。在本实施例中，隔绝层301覆盖容置空间40与信号走线，粘合层302覆盖未被隔绝层301覆盖的触控层203的剩余表面201a。第一上表面301a与第二上表面302a共面后 形成一个平整的上表面303，保护层50层叠粘合在该平整的上表面303上。
在本实施例中，隔绝层301与第一实施例的不同在于，隔绝层301还可粘合保护层50、容置空间40的外侧面201与表面101、以及触控层203的顶面；即隔绝层301可以为液态可固化、或是固态可热熔化的物质，通过加热、光照等方式使隔绝层301再产生粘接性而粘接上述的保护层50、容置空间40的外侧面201与表面101、以及触控层203的部分顶面。进一步地，由于隔绝层301设于粘合层302的外侧，当隔绝层301的第一上表面301a与粘合层302的第二上表面302a共面时，隔绝层301完全将粘合层302的侧面覆盖以隔绝粘合层302与外界，避免了粘合层302粘吸灰尘、异物等杂质，改善触控面板的外观和手感接触性。
可以理解的是，第一上表面301a与第二上表面302a可以不共面，而是形成一个台阶面，保护层50包括与该台阶面适配的凸起部分与凹陷部分，且该保护层50的凸起部分与凹陷部分可以与第一上表面301a与第二上表面302a形成的台阶面完全配合，且没有缝隙。
请参阅图8，在本申请的第六实施例中，与第五实施例的不同在于，导电层20还包括导电走线层202，导电走线层202设于触控层203上，导电走线层202包括导电走线(图中未示出)，导电走线覆盖于信号走线上，且与信号走线电连接，隔绝层301覆盖导电走线。也就是说，在本实施例中，因为触控面板的信号传递能力及灵敏性较高，若信号走线的传递信号的能力有限时，导电走线用于辅助传递信号。导电走线覆盖于信号走线上避免了信号走线的裸露，因此信号走线不会受到外界环境的影响，信号走线不会发生失效，且由于本申请的隔绝层301覆盖导电走线上，导电走线也不会发生失效。
请参阅图9，在本申请的第七实施例中，与第三实施例的不同在于，第二触控面板本体200的基材层10与第一触控面板本体100的隔绝层301和粘合层302连接。同理，第二触控面板本体200可以为数个，数个第二触控面板本体200层叠后再层叠在第一触控面板本体100上。本申请对第二触控面板本体200的数量不做限定。
请参阅图10，在本申请的第八实施例中，与第七实施例的不同在于，第二触控面板本体200的隔绝层301与第一触控面板本体100的隔绝层301连接， 第二触控面板本体200的粘合层302与第一触控面板本体100的粘合层302连接。本实施例同样省去了保护层50的制备，节约成本，同时也可在触控面板为多层设计时，触控面板由于保护层50的省去而厚度较薄。
请参阅图11，在本申请的第九实施例中，与第一实施例以及第五实施例的不同在于，防护层30为隔绝层301，隔绝层301完全覆盖导电层20。也就是说，隔绝层301完全覆盖容置空间40与触控层203。隔绝层301与粘合层302可为同一种物质。隔绝层301可以为液态可固化、或是固态可热熔化的物质，可通过加热、光照等方式产生粘接性而粘接上下层的物质。
请参阅图12，在本申请的第十实施例中，与第九实施例的不同在于，导电层20还包括导电走线层202，导电走线层202设于触控层203上，导电走线层202包括导电走线(图中未示出)，导电走线覆盖于信号走线上，且与信号走线电连接，隔绝层301覆盖导电走线。也就是说，在本实施例中，因为触控面板的信号传递能力及灵敏性较高，若信号走线的传递信号的能力有限时，导电走线用于辅助传递信号。导电走线覆盖于信号走线上时，避免了信号走线的裸露，信号走线不会受到外界环境的影响，信号走线不会发生失效，且由于本申请的隔绝层301覆盖导电走线上，导电走线也不会发生失效。
请参阅图13，在本申请的第十一实施例中，与第九实施例的不同在于，第二触控面板本体200的基材层10与第一触控面板本体100的隔绝层301连接。同理，第二触控面板本体200可以为数个，数个第二触控面板本体200层叠后再层叠在第一触控面板本体100上。本申请对第二触控面板本体200的数量不做限定。
请参阅图14，在本申请的第十二实施例中，与第十一实施例的不同在于，第二触控面板本体200的隔绝层301与第一触控面板本体100的隔绝层301连接。本实施例同样省去了保护层50的制备，节约成本，同时也可在触控面板为多层设计时，触控面板由于保护层50的省去而厚度较薄。
请参阅图15，本申请提供一种触控面板的制作方法，包括：
步骤110，提供一基材层10。
步骤120，在基材层10上形成导电层20，其中，导电层20包括外侧面201。
步骤130，在导电层20的外侧面201上设置覆盖导电层20的外侧面201的防护层30以形成第一触控面板本体100，其中，防护层30隔绝外界与导电层20。
因此，本申请的触控面板的制作方法通过在导电层20的外侧面201上设置覆盖导电层20的外侧面201的防护层30以隔绝外界与导电层20，进而对导电层20的四周截面进行了保护，使得导电层20的四周截面被包裹，避免了导电层20的四周截面受到外界环境的影响，从而解决了导电层20容易失效的技术问题。也就是说，本申请避免了导电层20四周截面的导电物质直接接触外界，而是形成一种与外界隔绝的密闭结构，因而保护导电层20不易受到侵蚀、氧化、渗透等不良影响。
在本申请中，防护层30可以为隔绝层301，隔绝层301完全覆盖导电层20。防护层30还可以包括隔绝层301与粘合层302，隔绝层301与粘合层302共同覆盖导电层20，隔绝层301与粘合层302对导电层20的覆盖面积不做限定，只要隔绝层301与粘合层302共同对导电层20完全覆盖即可。
步骤120还包括：
步骤121，在基材层10上图案化导电层20形成触控层203。
其中，步骤130进一步包括：
在基材层10的表面101与导电层20的外侧面201形成的容置空间40内填充防护层30。在本实施例中，当防护层30为隔绝层301时，隔绝层301完全覆盖触控层203。当防护层30还包括粘合层302时，隔绝层301与粘合层302共同覆盖触控层203，隔绝层301与粘合层302对触控层203的覆盖面积不做限定，只要隔绝层301与粘合层302共同对触控层203完全覆盖即可。
在一些实施例中，步骤120进一步包括：
步骤122，在触控层203上形成导电走线层202。
在本实施例中，当防护层30为隔绝层301时，隔绝层301完全覆盖导电走线层202与未设置导电走线层202的触控层203。当防护层30还包括粘合层302时，隔绝层301完全覆盖导电走线层202，至于未设置导电走线层202的触控层203，隔绝层301与粘合层302共同覆盖，隔绝层301与粘合层302对未设置导电走线层202的触控层203的覆盖面积不做限定，只要隔绝层301 与粘合层302共同对未设置导电走线层202的触控层203完全覆盖即可。
也就是说，本申请通过对导电层20边缘无效区域的导电物质层进行去除或部分去除以形成容置空间40，再通过在容置空间40内覆盖防护层30以对导电层20的四周截面进行防护，从而避免了导电层20的导电物质直接接触外界，进而形成一种与外界隔绝的密闭结构，因而保护导电层20不易受到侵蚀、氧化、渗透等不良影响。同时，当本申请对导电层20边缘无效区域的导电物质层进行去除或部分去除后，节约了导电层20边缘无效区域的导电物质层所占用的体积，从而可形成容置空间40，进而可为防护层30的填充提供空间。
触控面板的制作方法还包括：
步骤140，在第一触控面板本体100上层叠与第一触控面板本体100相同的第二触控面板本体200。在本实施例中，第二触控面板本体200的基材层10与第一触控面板本体100的防护层30连接。如第一触控面板本体100的粘合层302粘合第二触控面板本体200的基材层10；或第二触控面板本体200的基材层10与第一触控面板本体100的隔绝层301和粘合层302连接；或第二触控面板本体200的基材层10与第一触控面板本体100的隔绝层301连接。
可以理解的是，第二触控面板本体200可以为数个，数个第二触控面板本体200层叠后再层叠在第一触控面板本体100上。本申请对第二触控面板本体200的数量不做限定。
触控面板的制作方法还包括：
步骤150，在第一触控面板本体100的防护层30或第二触控面板本体200的防护层30上形成保护层50。
在其他实施例中，第二触控面板本体200的防护层30与第一触控面板本体100的防护层30连接，第二触控面板本体200的粘合层302与第一触控面板本体100的粘合层302连接；或第二触控面板本体100的隔绝层301与第一触控面板本体100的隔绝层301连接，第二触控面板本体200的粘合层302与第一触控面板本体100的粘合层302连接；或第二触控面板本体200的隔绝层301与第一触控面板本体100的隔绝层301连接。
在一些优选的实施例中，通过使两个触控面板本体的防护层30相互连接进而使得触控面板的上下表面分别为第二触控面板触控面板本体200的基材 层10与第一触控面板触控面板本体100的基材层10，不但可以对触控面板内部的走线以及器件进行保护，而且省去了保护层50的制备，节约成本。同时也可在触控面板为多层设计时，触控面板由于保护层50的省去而厚度较薄。
以上所揭露的仅为本申请较佳实施例而已，当然不能以此来限定本申请之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本申请权利要求所作的等同变化，仍属于申请所涵盖的范围。

Claims (19)

  1. 一种触控面板，其特征在于，包括：第一触控面板本体，所述第一触控面板本体包括基材层、导电层以及防护层，所述导电层设于所述基材层上，所述导电层包括外侧面，所述防护层覆盖所述导电层的外侧面以隔绝外界与所述导电层。
  2. 根据权利要求1所述的触控面板，其特征在于，所述基材层包括朝向所述导电层的表面，所述表面与所述外侧面形成一容置空间，所述防护层填充所述容置空间。
  3. 根据权利要求2所述的触控面板，其特征在于，所述防护层包括隔绝层，所述隔绝层填充所述容置空间。
  4. 根据权利要求3所述的触控面板，其特征在于，所述导电层包括触控层，所述触控层包括触控电极及与所述触控电极电连接的信号走线，所述隔绝层覆盖所述信号走线。
  5. 根据权利要4所述的触控面板，其特征在于，所述导电层还包括导电走线层，所述导电走线层设于所述触控层上，所述导电走线层包括导电走线，所述导电走线覆盖于所述信号走线上，且与所述信号走线电连接，所述隔绝层覆盖所述导电走线。
  6. 根据权利要求4或5所述的触控面板，其特征在于，所述隔绝层完全覆盖所述导电层。
  7. 根据权利要求3-5任一项所述的触控面板，其特征在于，所述防护层还包括粘合层，所述粘合层层叠于所述导电层上，所述隔绝层与所述粘合层相连接，所述隔绝层与粘合层共同覆盖所述导电层。
  8. 根据权利要求7所述的触控面板，其特征在于，所述隔绝层包括背离所述导电层的第一上表面，所述粘合层包括背离所述导电层的第二上表面，所述第一上表面与第二上表面共面。
  9. 根据权利要求7所述的触控面板，其特征在于，所述隔绝层包括背离所述导电层的第一上表面，所述粘合层向所述隔绝层延伸并覆盖所述隔绝层的第一表面。
  10. 根据权利要求1-9任一项所述的触控面板，其特征在于，所述触控面板还包括与所述第一触控面板本体相同的第二触控面板本体，所述第一触控面板本体与所述第二触控面板本体层叠设置。
  11. 根据权利要求10所述的触控面板，其特征在于，所述第二触控面板本体的基材层与所述第一触控面板本体的防护层连接。
  12. 根据权利要求10所述的触控面板，其特征在于，所述第二触控面板本体的防护层与所述第一触控面板本体的防护层连接。
  13. 根据权利要求1-9、11任一项所述的触控面板，其特征在于，所述触控面板还包括保护层，所述保护层设于所述第一触控面板本体的防护层上或设于所述第二触控面板本体的防护层上。
  14. 一种触控面板的制作方法，其特征在于，包括：
    提供一基材层；
    在所述基材层上形成导电层，其中，所述导电层包括外侧面；
    在所述导电层的外侧面上设置覆盖所述导电层的外侧面的防护层以形成第一触控面板本体，其中，所述防护层隔绝外界与所述导电层。
  15. 根据权利要求14所述的触控面板的制作方法，其特征在于，所述在所述导电层的外侧面上设置覆盖所述导电层的外侧面的防护层以形成第一触控面板本体的步骤包括：
    在所述基材层的表面与所述导电层的外侧面形成的容置空间内填充所述防护层。
  16. 根据权利要求14所述的触控面板的制作方法，其特征在于，所述在所述基材层上形成导电层的步骤包括：
    在所述基材层上图案化所述导电层形成触控层。
  17. 根据权利要求15所述的触控面板的制作方法，其特征在于，所述在所述基材层上形成导电层的步骤还包括：
    在所述触控层上形成导电走线层。
  18. 根据权利要求17所述的触控面板的制作方法，其特征在于，所述触控面板的制作方法还包括：
    在所述第一触控面板本体上层叠与所述第一触控面板本体相同的第二触 控面板本体。
  19. 根据权利要求14-18任一项所述的触控面板的制作方法，其特征在于，所述触控面板的制作方法还包括：
    在所述第一触控面板本体的防护层或第二触控面板本体的防护层上形成保护层。
PCT/CN2018/114565 2018-11-08 2018-11-08 触控面板及触控面板的制作方法 WO2020093311A1 (zh)

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