WO2020090957A1 - Electronic component mounting apparatus - Google Patents
Electronic component mounting apparatus Download PDFInfo
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- WO2020090957A1 WO2020090957A1 PCT/JP2019/042724 JP2019042724W WO2020090957A1 WO 2020090957 A1 WO2020090957 A1 WO 2020090957A1 JP 2019042724 W JP2019042724 W JP 2019042724W WO 2020090957 A1 WO2020090957 A1 WO 2020090957A1
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- WIPO (PCT)
- Prior art keywords
- collet
- mounting
- electronic component
- image
- deviation
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
Definitions
- the present invention relates to the structure of an electronic component mounting device.
- Many electronic component mounting devices are used to pick up a semiconductor die from a wafer and mount it on a substrate or lead frame.
- the mounting position on the substrate is recognized by the camera, and the center position of the mounting collet is aligned with the mounting position to position the semiconductor die and the mounting position.
- the semiconductor die is mounted while the temperature of the substrate is kept at about 100 ° C., if the mounting is continued for a long time, the positional relationship between the camera, the collet, and the substrate may change due to the temperature change over time. In some cases, the positioning accuracy may change and the positioning accuracy may decrease.
- a reference mark is provided on each of the transfer path for transferring the substrate and the bonding head to which the collet is attached, and each reference mark is imaged by the camera to detect the positional deviation between the camera and the bonding head with respect to the transfer path. It has been proposed to correct the positional relationship among the camera, collet, and substrate (for example, see Patent Document 1).
- the temperature change over time also affects the pickup unit that picks up the semiconductor die from the wafer.
- the semiconductor die to be picked up is recognized by the camera, the center position of the pickup collet is aligned with the center position of the semiconductor die, the semiconductor die is picked up, and the semiconductor die is transferred onto the substrate and mounted at the mounting position on the substrate. Therefore, when the center position of the pickup collet and the center position of the semiconductor die to be picked up are deviated, the mounting accuracy of the semiconductor die on the substrate may be deteriorated.
- the electronic component mounting apparatus of the present invention has a wafer ring that holds a wafer, a collet that has a central hole, and picks up an electronic component from the wafer, a collet drive unit that horizontally drives the collet, and a base side of the collet.
- a wafer-side illumination unit that allows light to enter the center hole of the collet, a wafer-side imaging device that captures an image of the collet from the base side of the collet, an image processing unit that processes the image captured by the wafer-side imaging device, and a collet
- a controller for adjusting the position and an electronic component mounting apparatus comprising, the wafer-side imaging device, an image of reflected light that is incident on the center hole of the collet and reflected on the surface of the wafer directly below the collet,
- the image processing unit determines the center position of the center hole of the collet based on the image of the reflected light reflected by the surface of the wafer captured by the wafer-side imaging device. As the center position of the collet, and the deviation between the detected center position of the collet and the reference position in the field of view of the wafer-side imaging device is detected. Adjusting the position of.
- the deviation between the center position of the collet and the reference position in the field of view of the wafer side imaging device is detected, and the position of the collet is adjusted by correcting the horizontal position of the collet based on the deviation.
- the deviation amount can be corrected at any time, and the semiconductor die can be accurately picked up from the wafer.
- the collet includes an push-up pin that pushes up the electronic component picked up from the lower side of the wafer, the wafer-side imaging device captures an image of the push-up pin from the upper side, and the image processing unit is the wafer side.
- the center position of the push-up pin may be detected as a pin center based on the image of the push-up pin captured by the image pickup device, and the detected pin center may be set as a reference position in the field of view of the wafer-side image pickup device.
- the wafer-side imaging device includes a wafer ring driving unit that horizontally drives the wafer ring, the wafer-side imaging device images an electronic component picked up by the collet from the upper side of the wafer, and the image processing unit includes the collet imaged by the wafer-side imaging device. Detects the center position of the electronic component picked up by the collet as the chip center based on the image of the electronic component picked up by the collet, and the control unit adjusts the wafer ring so that the chip center becomes the reference position in the field of view of the wafer side image pickup device.
- the horizontal position of the wafer ring may be adjusted by the driving unit.
- the center position of the push-up pin is set to the reference position in the field of view of the wafer side image pickup device, and the chip center, which is the center position of the electronic component picked up by the collet, is set to the reference position in the view field of the wafer side image pickup device. Since the position of the wafer ring in the horizontal direction is adjusted so that, the center position of the semiconductor die to be picked up can be aligned with the push-up pin.
- the deviation amount is corrected at any time, so the center position of the push-up pin, the semiconductor die to be picked up, and the collet The semiconductor die can be picked up with the center position of the semiconductor die aligned.
- it is possible to suppress the occurrence of chip misalignment at the time of pickup, and to suppress deterioration of the mounting accuracy of the semiconductor die on the substrate even when there is a temperature change over time.
- the collet includes a frame-side illumination unit that causes light to enter the center hole of the collet from the root side of the collet, and a frame-side imaging device that captures an image of the collet from the root side of the collet. Mounts the electronic component adsorbed on the tip on the mounting target, the image processing unit processes the image captured by the frame-side imaging device, and the frame-side imaging device adsorbs the electronic component on the tip of the collet.
- the control unit may adjust the position of the horizontal direction of the collet by the collet driving portion on the basis of the first difference may be.
- the collet center position and the reference position in the field of view of the frame-side imaging device Since the first deviation between them is detected and the horizontal position of the collet is adjusted based on the first deviation, there is a deviation in the positional relationship between the collet center position and the reference position in the field of view of the frame-side imaging device. When it occurs, the deviation amount can be corrected at any time, and the semiconductor die can be mounted accurately.
- the frame-side imaging device captures an image of the mounting target
- the image processing unit mounts the electronic component based on the image of the mounting target captured by the frame-side imaging device.
- the position is detected, a second deviation between the detected mounting position and the reference position in the field of view of the frame-side imaging device is detected, and the control unit determines the collet drive unit based on the first deviation and the second deviation.
- the horizontal position of the collet may be adjusted by.
- the second deviation between the mounting position of the substrate or the lead frame which is the mounting object and the reference position in the field of view of the frame-side imaging device is detected, and based on the first deviation and the second deviation. Since the horizontal position of the collet is adjusted, if there is a deviation in the positional relationship between the collet center position and the mounting position, the amount of deviation can be corrected at any time, and the semiconductor die can be mounted more accurately. Can be implemented in.
- the electronic component mounting apparatus of the present invention it is arranged between a pickup unit that picks up an electronic component from a wafer and a mounting unit that mounts the picked-up electronic component on a mounting target, and an image of the tip of the collet and a tip of the collet are provided.
- the backside camera that captures the image of the backside of the sucked electronic component is provided, and the image processing unit, based on the image of the tip of the collet and the backside image of the electronic component captured by the backside camera, displays the image of the electronic component for the collet.
- the control unit may detect the positional deviation amount and the control unit may adjust the horizontal position of the collet by the collet driving unit based on the first deviation, the second deviation, and the positional deviation amount of the electronic component with respect to the collet.
- the deviation can be corrected and the electronic component can be mounted on the board in a state where the chip center DC of the electronic component matches the mounting position.
- a mounting collet that has a central hole and mounts an electronic component adsorbed at the tip on a mounting target, a mounting collet driving unit that horizontally drives the mounting collet, and a root of the mounting collet.
- the frame-side illuminating section that allows light to enter the center hole of the mounting collet from the side
- the frame-side imaging device that captures the image of the mounting collet from the root side of the mounting collet. The captured image is processed, the control unit adjusts the position of the mounting collet, and the frame-side imaging device causes the electronic component to be adsorbed to the tip of the mounting collet and makes it enter the center hole of the mounting collet.
- An image of the reflected light reflected by the surface of the electronic component that is adsorbed on the tip of the mounting part is captured, and the image processing unit is attached to the tip of the mounting collet imaged by the frame-side imaging device.
- the center position of the center hole of the mounting collet is detected as the mounting collet center position based on the image of the reflected light reflected from the surface of the electronic component, and the detected mounting collet center position and the reference position in the field of view of the frame-side imaging device It is good also as detecting the 1st deviation between and, and controlling the position of the mounting collet in the horizontal direction by the mounting collet drive part based on the 1st deviation.
- the mounting collet center position and the reference position in the field of view of the frame-side imaging device Is detected and the horizontal position of the mounting collet is adjusted based on the first deviation, the positional relationship between the mounting collet center position and the reference position in the field of view of the frame-side imaging device. If a deviation occurs, the deviation amount can be corrected at any time, and the semiconductor die can be mounted accurately.
- the frame-side imaging device captures an image of the mounting target
- the image processing unit mounts the electronic component based on the image of the mounting target captured by the frame-side imaging device.
- the position is detected, the second deviation between the detected mounting position and the reference position in the field of view of the frame-side imaging device is detected, and the control unit drives the mounting collet based on the first deviation and the second deviation.
- the position of the mounting collet in the horizontal direction may be adjusted by the section.
- the second deviation between the mounting position of the substrate or the lead frame which is the mounting object and the reference position in the field of view of the frame-side imaging device is detected, and based on the first deviation and the second deviation. Since the horizontal position of the mounting collet is adjusted, if there is a deviation in the positional relationship between the mounting collet center position and the mounting position, the deviation amount can be corrected at any time, and the semiconductor die can be more accurately It can be mounted at the mounting position.
- the electronic component mounting apparatus of the present invention it is arranged between a pickup unit that picks up an electronic component from a wafer and a mounting unit that mounts the picked-up electronic component on a mounting target, and an image of the tip of the mounting collet and the mounting collet.
- the image processing unit includes a backside camera that captures an image of the backside of the electronic component that is attracted to the tip, and the image processing unit, based on the image of the tip of the mounting collet captured by the backside camera and the image of the backside of the electronic component, the mounting collet.
- the positional deviation amount of the electronic component relative to the mounting collet is detected, and the control unit adjusts the horizontal position of the mounting collet by the mounting collet driving unit based on the first deviation, the second deviation, and the positional deviation amount of the electronic component with respect to the mounting collet. You may.
- the deviation can be corrected and the electronic component can be mounted on the board in a state where the chip center DC of the electronic component matches the mounting position.
- the electronic component mounting apparatus of the present invention has a mounting collet that has a central hole and mounts an electronic component adsorbed at the tip on a mounting target, a mounting collet driving unit that horizontally drives the mounting collet, and a root of the mounting collet.
- FIG. 1 Side illumination unit that allows light to enter the center hole of the mounting collet from the side, a frame-side imaging device that captures an image of the mounting collet from the root side of the mounting collet, and image processing that processes the image captured by the frame-side imaging device
- An electronic component mounting apparatus comprising: a mounting section, and a control section for adjusting the position of the mounting collet, wherein the frame-side imaging device has a center hole of the mounting collet in a state where the electronic component is adsorbed to the tip of the mounting collet. An image of the reflected light that is incident and reflected on the surface of the electronic component that is adsorbed at the tip of the mounting collet is captured, and the image processing unit displays the mounting core image captured by the frame-side imaging device.
- the center position of the center hole of the mounting collet is detected as the mounting collet center position based on the image of the reflected light reflected on the surface of the electronic component that is adsorbed at the tip of the mount, and the detected mounting collet center position and the frame side imaging device
- the control unit detects a first deviation from the reference position in the field of view, and the control unit adjusts the horizontal position of the mounting collet by the mounting collet driving unit based on the first deviation.
- the amount of the deviation can be corrected at any time, and the semiconductor die can be mounted accurately.
- the frame-side imaging device captures an image of the mounting target
- the image processing unit mounts the electronic component based on the image of the mounting target captured by the frame-side imaging device.
- the position is detected, the second deviation between the detected mounting position and the reference position in the field of view of the frame-side imaging device is detected, and the control unit drives the mounting collet based on the first deviation and the second deviation.
- the position of the mounting collet may be adjusted depending on the part.
- the second deviation between the mounting position of the substrate or the lead frame which is the mounting object and the reference position in the field of view of the frame-side imaging device is detected, and based on the first deviation and the second deviation. Since the horizontal position of the mounting collet is adjusted, if there is a deviation in the positional relationship between the mounting collet center position and the mounting position, the deviation amount can be corrected at any time, and the semiconductor die can be more accurately It can be mounted at the mounting position.
- the electronic component mounting apparatus of the present invention can suppress deterioration of mounting accuracy of the semiconductor die on the substrate.
- FIG. 3 is a vertical sectional view of a pickup section of the electronic component mounting apparatus of the embodiment (AA sectional view shown in FIGS. 1 and 2).
- FIG. 3 is a vertical sectional view of a mounting portion of the electronic component mounting apparatus of the embodiment (BB sectional view shown in FIGS. 1 and 2).
- 6 is a flowchart showing the operation of the pickup section of the electronic component mounting apparatus of the embodiment.
- FIG. 5 is a vertical cross-sectional view showing a state in which the push-up needle is imaged by the wafer side camera from the upper side in the electronic component mounting apparatus of the embodiment.
- FIG. 6 is a vertical cross-sectional view showing a state where the collet of the pickup head has been moved to just above the wafer. It is a figure which shows the visual field of the wafer side camera in the state shown in FIG.
- FIG. 5 is a vertical cross-sectional view showing a state in which the center position of the collet of the pickup head is aligned with the reference position of the wafer side camera. It is a figure which shows the visual field of the wafer side camera in the state shown in FIG. It is an elevational sectional view showing the state where a semiconductor die is picked up from a wafer.
- FIG. 6 is a flowchart showing the operation of the mounting unit of the electronic component mounting apparatus of the embodiment.
- FIG. 3 is a vertical cross-sectional view showing a state in which a mounting collet having a semiconductor die attached to its tip is moved to directly above a substrate in the semiconductor mounting device of the embodiment. It is a figure which shows the visual field of the frame side camera in the state shown in FIG.
- FIG. 6 is a vertical cross-sectional view showing a state in which the mounting position of the board is captured by the frame side camera. It is a figure which shows the visual field of the frame side camera in the state of FIG.
- FIG. 18 is a view obtained by superimposing the view of FIG. 15 on the view of FIG. 17.
- FIG. 3 is a vertical cross-sectional view showing a state where mounting of a semiconductor die is completed. It is a figure which shows the visual field of the frame side camera in the state shown in FIG. It is an elevation sectional view of a pickup part of an electronic parts mounting device of other embodiments. It is an elevation sectional view of a mounting part of an electronic parts mounting device of other embodiments.
- FIG. 27 is a vertical sectional view of a mounting portion of an electronic component mounting apparatus according to another embodiment (BB sectional view shown in FIGS. 25 and 26). It is an elevation view which shows the structure of the electronic component mounting apparatus of other embodiment. It is a figure which shows the visual field of the back surface camera of the electronic component mounting apparatus shown in FIG.
- the electronic component mounting apparatus 100 includes a base 10, a pickup unit 101, a mounting unit 102, and a control device 80.
- the transport direction of the substrate 74 will be described as the X direction, the direction orthogonal to the X direction as the Y direction, and the vertical direction as the Z direction.
- the XY directions are horizontal directions.
- the pickup unit 101 includes a wafer ring 42, a push-up unit 43, a pickup head 20 to which the collet 30 is attached, and a wafer-side camera 12 that is a wafer-side imaging device. ing.
- the wafer ring 42 holds the wafer 35 on the upper surface and is driven in the XY directions by the wafer ring driving unit 41 arranged on the side surface.
- the push-up unit 43 is attached to the base 10 below the wafer ring 42, and a push-up pin 44 that pushes up the semiconductor die 36 that moves in the Z direction and picks up from the lower side of the wafer 35 is provided in the center. ..
- the pickup head 20 is fixed to the base 10 and is guided by the linear guide 14 extending in the X direction through the pickup unit 101 and the mounting unit 102 to move between the pickup unit 101 and the mounting unit 102 in the X direction.
- the pickup head 20 includes a main body 21 that is guided by the linear guide 14 to move between the pickup unit 101 and the mounting unit 102, a bracket 22 provided on the lower side of the main body 21, and a rotation shaft of a lower end portion of the bracket 22. It has an arm 23 rotatably attached around 24 and a collet 30 attached to the X-direction plus side end of the arm 23. The collet 30 of the pickup head 20 picks up the semiconductor die 36 and mounts it on the substrate 74.
- a spring 26 is provided between the minus side end of the arm 23 in the X direction and the protrusion 25 attached to the upper side of the bracket 22. The spring 26 pulls the X-direction negative end of the arm 23 upward, and presses the upper surface of the X-direction negative end of the arm 23 against the lower surface of the bracket 22.
- the main body 21 includes a Y-direction drive mechanism for driving the pickup head 20 in the Y-direction and a Z-direction drive mechanism for driving the collet 30 in the Z-direction inside.
- the Y-direction drive mechanism may be, for example, a linear motor
- the Z-direction drive mechanism may be, for example, a servomotor and a screw mechanism.
- the linear guide 14 moves in the X direction by a linear guide drive mechanism (not shown).
- the pickup head 20 and the linear guide drive mechanism form a collet drive unit that drives the collet 30 in the XY directions.
- the collet 30 is composed of a shaft 31 on the base side and a collet body 33 on the tip side.
- the shaft 31 is made of metal, and the collet body 33 is made of, for example, heat-resistant resin.
- Circular center holes 32 and 34 are coaxially provided at the centers of the shaft 31 and the collet body 33.
- the upper end of the shaft 31 is attached to a portion of the arm 23 where the concave portion 23a is provided, and the central hole 32 of the shaft 31 communicates with the concave portion 23a provided at the upper portion of the arm 23 and is located above the concave portion 23a in the Z direction. It is open towards.
- the center hole 34 of the collet body 33 communicates with the center hole 32 of the shaft 31 and is opened downward from the lower end surface in the Z direction.
- a light source 27 and a beam splitter 28 are provided on the upper surface of the recess 23 a of the arm 23.
- a wafer-side camera 12 that captures an image of the collet 30 from the root side of the collet 30 is attached to the upper base 11 on the upper side of the collet 30.
- the wafer-side camera 12 is arranged such that the optical axis 13 and the pin center PC at the center of the push-up pin 44 are at the same horizontal position.
- the beam splitter 28 is arranged directly above the central hole 32 of the shaft 31, and reflects the light from the light source 27 to make it enter the central hole 32 of the shaft 31 and the central hole 34 of the collet body 33. Further, the beam splitter 28 transmits the reflected light reflected on the surface of the wafer 35 located immediately below the collet 30 toward the upper side in the Z direction and makes it incident on the wafer side camera 12.
- the light source 27 and the beam splitter 28 form a wafer side illumination unit 29.
- the light source 27 may be a high brightness LED or a laser light source.
- the beam splitter 28 may be replaced by a half mirror.
- the mounting unit 102 includes a mounting stage 72 that sucks and fixes a substrate 74 that is a mounting target, and a frame-side camera 63 that is a frame-side imaging device.
- the pickup head 20 is guided by the linear guide 14 extending through the pickup unit 101 and the mounting unit 102 to move between the pickup unit 101 and the mounting unit 102, and the semiconductor die 36 is mounted on the mounting unit 102. Is mounted on the substrate 74.
- the mounting stage 72 is attached to the base 10 via the pedestal 71.
- a transport mechanism 73 configured of two guide rails extending in the X direction and transporting the substrate 74 in the X direction is provided.
- a frame-side camera 63 that captures an image of the collet 30 from the root side of the collet 30 when the pickup head 20 moves to the mounting unit 102 is attached to the upper side of the mounting stage 72.
- the frame-side camera 63 is attached to the upper base 11 and is attached to the tip of an arm 62 that is movable in the Y direction by being guided by a linear guide 61 extending in the Y direction.
- a Y-direction drive mechanism such as a linear motor for moving the arm 62 in the Y-direction is attached.
- the control device 80 is a computer that internally includes a CPU and a memory, and has two functional blocks, a control unit 81 and an image processing unit 82, which function by the CPU and the memory, which is a storage unit, operating in cooperation with each other.
- the wafer side camera 12, the pickup head 20, the wafer ring drive unit 41, the frame side camera 63, the transfer mechanism 73, and the mounting stage 72 are connected to the control unit 81, and operate according to commands from the control unit 81.
- the image captured by the wafer-side camera 12 is input to the image processing unit 82 and image-processed by the image processing unit 82.
- the data obtained by the image processing is input to the control unit 81.
- the control unit 81 captures an image of the push-up pin 44 with the wafer-side camera 12 from the upper side of the wafer ring 42 and outputs it to the image processing unit 82.
- the image processing unit 82 processes the input image data to detect the position of the tip of the push-up pin 44 as the pin center PC at the center of the push-up pin 44.
- the processing of the image data may use, for example, that the brightness of the tip image of the push-up pin 44 is higher than the brightness of the image of the tapered surface near the tip of the push-up pin 44.
- the optical axis 13 of the wafer side camera 12 and the pin center PC of the center of the push-up pin 44 are arranged at the same position by design, the optical axis 13 of the wafer side camera 12 and the push-up pin 44 are arranged.
- the pin center PC of the push-up pin 44 shown in FIG. 7 is the reference indicated by the intersection of the reference line 16 in the X direction and the reference line 17 in the Y direction of the field of view 15 of the wafer side camera 12. It is the same position as the position C1. However, as shown in FIG. 7, the position of the pin center PC and the position of the reference position C1 may be displaced.
- the control unit 81 defines the reference line C1 of the X direction and the reference line of the Y direction that define the reference position C1 of the visual field 15 so that the reference position C1 coincides with the pin center PC. 17 is moved in the XY directions. Then, the moved position is set as the reference position C1 of the visual field 15.
- the control unit 81 causes the collet 30 to be directly above the wafer 35 by the drive mechanism of the main body 21 of the pickup head 20 in the XY direction and the Z direction, and the lower surface of the collet body 33 to be about 0.1 mm from the wafer 35.
- the position is a minute height.
- the center axis of the collet 30 is aligned with the optical axis 13 of the wafer side camera 12.
- the control unit 81 turns on the light source 27 provided on the pickup head 20.
- the light from the light source 27 travels in the X direction, is reflected by the beam splitter 28, travels downward in the Z direction, and enters the center hole 32 of the shaft 31 from the root side of the collet 30.
- the light incident on the center hole 32 passes through the center hole 34 of the collet body 33 from the center hole 32, and is reflected by the surface of the wafer 35 immediately below the collet body 33.
- the reflected light reflected by the surface of the wafer 35 travels upward in the Z direction through the central holes 34 and 32, passes through the beam splitter 28, and enters the wafer side camera 12.
- the reflected light from the surface of the wafer 35 located near the lower surface of the collet body 33 is the wafer side camera.
- the central holes 32, 34 appear as white circular images.
- the size of the semiconductor die 36 and the collet 30 is drawn larger than the actual size.
- the size of the collet 30 and the central holes 32 and 34 is very small, and the size of the field of view 15 of the wafer side camera 12 is smaller than that of the recess 23a provided on the upper portion of the arm 23.
- the focus of the wafer side camera 12 is set near the lower surface of the collet body 33. Therefore, around the white circular images of the center holes 32 and 34 of the visual field 15, not the image of the bottom surface of the recess 23a but the arm 23 between the wafer side camera 12 and the lower surface of the collet body 33 which is the focal plane. Concave portion 23a appears as a black shadow background.
- the wafer-side camera 12 captures a white image of the reflected light that is incident on the center holes 32 and 34 of the collet 30 that is raised in the black background and reflected on the surface of the wafer 35, as shown in step S104 of FIG.
- the captured image is output to the image processing unit 82.
- a blurred image of the bottom surface of the recess 23a may appear around the white circular image.
- the bottom surface of the recess 23a is black. By doing so, a black background can appear around the white circular image.
- the image processing unit 82 processes the input image and detects the center positions of the center holes 32 and 34 of the collet 30 as the collet center position CC1.
- the collet center position CC1 There are various image processing methods for detecting the collet center position CC1, but as an example, the boundary line of the white circular image is detected from the contrast between the black background and the white circular images of the central holes 32 and 34. Then, the collet center position CC1 is detected by calculating the center position of the circle. As shown in FIG. 9, in the visual field 15, the collet center position CC1 is the intersection of the X-direction center line 37 and the Y-direction center line 38.
- the image processing unit 82 detects an X-direction deviation ⁇ X1 and a Y-direction deviation ⁇ Y1 between the collet center position CC1 and the reference position C1 of the visual field 15 detected as shown in step S106 of FIG. To do.
- the control unit 81 stores the input deviations ⁇ X1 and ⁇ Y1 in the storage unit.
- the image processing unit 82 recognizes the semiconductor die 36 to be picked up in the field of view 15 as shown in step S107 and FIG. 9 of FIG. 5, and as shown in step S108 of FIG.
- the center position of 36 is detected as the chip center DC and output to the control unit 81.
- the control unit 81 stores the input chip center DC in the storage unit.
- the recognized image of the semiconductor die 36 is processed to obtain a square contour line of the semiconductor die 36, the X-direction center line 36x and the Y-direction center line 36y are obtained, and the chip center DC is determined as the intersection. May be detected.
- the control unit 81 reads the chip center DC from the storage unit, and as shown in step S109 in FIG. 5, the chip center DC of the semiconductor die 36 to be picked up becomes the reference position C1 in the field of view 15 of the wafer side camera 12.
- the wafer ring drive unit 41 moves the wafer ring 42.
- the reference position C1 is set to the same position as the position of the pin center PC of the push-up pin 44, this operation can make the chip center DC, the reference position C1, and the pin center PC the same position. it can.
- the control unit 81 reads the deviations ⁇ X1 and ⁇ Y1 from the storage unit and corrects the position by the deviation ⁇ Y1 to set the collet center position CC1 in the visual field 15 of the wafer side camera 12 as shown in step S110 of FIG. Adjust to the reference position C1 of. Specifically, as shown in FIG. 9, when the deviation in the Y direction between the collet center position CC1 and the reference position C1 is ⁇ Y1, the control unit 81 moves the pickup head 20 toward the Y direction plus side. At this time, the pickup head 20 is moved to a position where the scale of the linear scale for detecting the position of the pickup head 20 in the Y direction is larger than the scale corresponding to the reference position C1 by a deviation ⁇ Y1.
- the deviation ⁇ Y1 is corrected and the position of the collet 30 in the Y direction coincides with the reference position C1.
- the deviation ⁇ X1 is corrected by moving the linear guide 14 in the X direction by the deviation ⁇ X1 by a linear guide drive mechanism (not shown).
- the chip center DC, the reference position C1, the pin center PC, and the collet center position CC1 are at the same position as shown in FIG. Can be
- the controller 81 lowers the collet 30 onto the semiconductor die 36 for picking up the collet 30 by the Z-direction drive mechanism of the main body 21 of the pickup head 20, as shown in step S111 and FIG. 12 of FIG.
- the semiconductor die 36 is attracted to the surface of the semiconductor die 36, and the push-up pins 44 are moved upward to push up the semiconductor die 36 from the lower side to pick up the semiconductor die 36 from the wafer 35.
- the chip center DC, the reference position C1, the pin center PC, and the collet center position CC1 are at the same position, the center of the semiconductor die 36 is pushed up by the push-up pin 44, and the semiconductor die 36 is placed at the center of the collet body 33. Can be adsorbed. Therefore, the semiconductor die 36 can be accurately picked up from the wafer 35, and a decrease in mounting accuracy of the semiconductor die 36 on the substrate 74 can be suppressed.
- the tip of the collet body 33 can be prevented from being deformed by the collet body 33 picking up the semiconductor die 36 in a biased manner.
- the electronic component mounting apparatus 100 of the present embodiment causes light to enter the center holes 32 and 34 from the upper side of the collet 30 and detects the collet center position CC1 by the reflected light from the wafer 35 immediately below the collet 30,
- the operation of detecting the deviation from Step S104 to Step S106 of Step 5 can be performed during the operation of picking up the semiconductor die 36 from the wafer 35.
- the deviation can be corrected and the pickup can be continued every time the pickup operation is performed several times, so that the semiconductor die 36 can be accurately picked up even if there is a change over time, and the substrate 74 It is possible to effectively prevent the mounting accuracy of the semiconductor die 36 from being reduced.
- deviation detection and correction may be performed for each pick-up instead of every pick-up.
- the deviation ⁇ X1 in the X direction detected by the image processing unit 82 and the deviation ⁇ Y1 in the Y direction are stored in the storage unit of the control unit 81, and in the subsequent mounting, the deviation stored in the storage unit is used. It is possible to make a correction and pick up a predetermined number of times. In this case, it is possible to effectively suppress a decrease in mounting accuracy of the semiconductor die 36 on the substrate 74 while suppressing a decrease in bonding efficiency.
- the controller 81 operates the Y-direction drive mechanism arranged inside the main body 21 of the pickup head 20 to move the pickup head 20 to the lower side of the frame side camera 63. To move. At this time, the control unit 81 moves the pickup head 20 so that the collet center position CC2 of the collet 30 coincides with the position of the optical axis 64 of the frame side camera 63. Further, since the focus of the frame side camera 63 is on the surface of the substrate 74, the position of the surface of the semiconductor die 36 attracted to the tip of the collet 30 is separated from the surface of the substrate 74 by a very small amount, for example, about 0.1 mm. The collet 30 is lowered so that the upper surface of the semiconductor die 36 enters the depth of focus of the frame side camera 63. The collet 30 is moved downward by driving in the Z direction arranged inside the main body 21 of the pickup head 20.
- the position of the optical axis 64 of the frame-side camera 63 is the reference position C2 indicated by the intersection of the X-direction center line 66 and the Y-direction center line 67 in the field of view 65 of the frame-side camera 63 as shown in FIG. Becomes In the field of view 65, the collet center position CC2 is the intersection of the X-direction center line 55x and the Y-direction center line 55y.
- the collet center position CC2 coincides with the reference position C2.
- the collet center position CC2 may deviate from the reference position C2.
- the control unit 81 turns on the light source 27a provided in the pickup head 20, as described above.
- the light from the light source 27 enters the center holes 32 and 34 of the collet 30 and becomes a white image of the reflected light reflected by the surface of the wafer 35.
- the white image has a black background around it.
- the frame side camera 63 captures a white image of the reflected light that is projected inward on a black background. The captured image is output to the image processing unit 82.
- the image processing unit 82 processes the input image and detects the center positions of the center holes 32 and 34 of the collet 30 as the collet center position CC2, as described above. ..
- the image processing unit 82 detects the X-direction first deviation ⁇ X2 and the Y-direction first deviation ⁇ Y2 between the collet center position CC2 detected as shown in step S204 of FIG. 13 and the reference position C2 of the visual field 65, and controls them. Output to the unit 81.
- the control unit 81 stores the input X-direction first deviation ⁇ X2 and Y-direction first deviation ⁇ Y2 in the storage unit.
- control unit 81 causes the reference position C2 of the visual field 65 of the frame side camera 63 to be in the visual field of the mounting position BC at the center of the mounting area 75 for mounting the semiconductor die 36 on the substrate 74.
- the frame side camera 63 is moved to such a position.
- the movement in the Y direction is performed by the Y direction drive mechanism arranged in the arm 62.
- the control unit 81 operates the frame side camera 63 to image the mounting area 75.
- the captured image is input to the image processing unit 82.
- the image processing unit 82 processes the acquired image to detect the mounting position BC at the center of the mounting area 75, and outputs it to the control unit 81, as shown in step S206 of FIG.
- the control unit 81 stores the input mounting position BC in the storage unit.
- the recognized mounting area 75 image is processed to obtain a square contour line of the mounting area 75, the X-direction center line 76 and the Y-direction center line 77 are obtained, and the mounting position BC is detected as the intersection. You can
- a displacement may occur between the reference position C2 of the field of view 65 of the frame side camera 63 and the mounting position BC.
- the image processing unit 82 detects the X-direction second deviation ⁇ X3 and the Y-direction second deviation ⁇ Y3 between the mounting position BC and the reference position C2 of the visual field 65 detected as shown in step S207 of FIG. 13, and the control unit Output to 81.
- the control unit 81 stores the input X-direction second deviation ⁇ X3 and Y-direction second deviation ⁇ Y3 in the storage unit.
- the control unit 81 reads the X-direction second deviation ⁇ X3 and the Y-direction second deviation ⁇ Y3 from the storage unit, and as shown in step S208 of FIG. 13 and FIG. 18, the Y-direction first deviation ⁇ Y2 and the Y-direction second deviation ⁇ Y3.
- the position is corrected by 2 deviations ⁇ Y3, the X direction first deviation ⁇ X2 and the X direction second deviation ⁇ X3 are corrected, and the collet center position CC2 is adjusted to the mounting position BC.
- the control unit 81 moves the pickup head 20 toward the Y direction plus side, the scale of the linear scale that detects the position of the pickup head 20 in the Y direction is larger than the scale corresponding to the mounting position BC.
- the pickup head 20 is moved to a position where the sum of the Y-direction first deviation ⁇ Y2 and the Y-direction second deviation ⁇ Y3 increases. Further, the control unit 81 moves the linear guide 14 in the X direction by a linear guide drive mechanism (not shown) to correct the deviation ⁇ X2. As a result, the Y-direction first deviation ⁇ Y2, the Y-direction second deviation ⁇ Y3, the X-direction first deviation ⁇ X2, and the X-direction second deviation ⁇ X3 are corrected so that the collet center position CC2 coincides with the mounting position BC.
- the collet center position CC2 can be matched with the mounting position BC in the state where the chip center DC is attracted so as to match the collet center position CC2 of the collet 30 as shown in FIG.
- the semiconductor die 36 can be mounted on the substrate 74 with the chip center DC aligned with the mounting position BC.
- step S209 of FIG. 13 the control unit 81 lowers the collet 30 in the state shown in FIG. 19 to mount the semiconductor die 36 on the mounting area 75.
- the electronic component mounting apparatus 100 of this embodiment it is possible to suppress deterioration of the mounting accuracy of the semiconductor die 36 on the substrate 74 when there is a change over time.
- the electronic component mounting apparatus 100 of the present embodiment causes light to enter the center holes 32 and 34 from the upper side of the collet 30 and detects the collet center position CC2 by the reflected light from the surface of the semiconductor die 36 adsorbed to the tip of the collet 30. Therefore, the operation of detecting the first deviation from step S201 to step S204 of FIG. 13 and the operation of detecting the second deviation of step S205 to S207 of FIG. 13 to correct the first and second deviations are performed. , Can be performed during mounting of the semiconductor die 36.
- the mounting unit 102 when the mounting unit 102 repeatedly picks up and mounts the semiconductor die 36, the mounting is first started with the first deviation set as a predetermined set value, and the semiconductor die 36 after mounting several times is mounted. Immediately before mounting on the substrate 74, the first deviation is detected while the surface of the semiconductor die 36 attracted to the tip of the collet 30 is lowered to a position slightly separated from the surface of the substrate 74, for example, about 0.1 mm.
- the result is stored in the storage unit of the control unit 81, and in the subsequent mounting, the correction can be performed using the first deviation stored in the storage unit, and the mounting can be performed a predetermined number of times.
- the detection of the second deviation is performed after the mounting has been performed many times, and the detection result is stored in the storage unit of the control unit 81. In the subsequent mounting, the detection is stored in the storage unit.
- the correction can be performed using the second deviation and the mounting can be performed a predetermined number of times.
- the pickup head 20 that picks up and mounts the semiconductor die 36 is guided by the linear guide 14 that extends between the pickup unit 101 and the mounting unit 102, and is in the X direction.
- the position of is adjusted by moving the linear guide 14 in the X direction. Therefore, when the mounting unit 102 adjusts the X-direction first deviation ⁇ X2 and the X-direction second deviation ⁇ X3, the pickup unit 101 shifts between the X-direction collet center position CC1 and the reference position C1 and the pin center PC. May occur.
- the position of the collet 30 is corrected using the difference between the deviation ⁇ X1 and the X-direction first deviation ⁇ X2 3 or the X-direction second deviation ⁇ X3 when the pickup operation is returned from the mounting section 102 to the pickup section 101. You may do so.
- the first deviation and the second deviation may be detected each time the mounting is performed, rather than every time the mounting is performed, and each deviation may be corrected. In this case, the deterioration of the mounting accuracy of the semiconductor die 36 on the substrate 74 can be suppressed more effectively.
- the semiconductor die 36 is mounted on the substrate 74.
- the electronic component mounting apparatus 100 is not limited to this, and the other semiconductor die 36 is used as a mounting target. It is also applicable when mounting the semiconductor die 36 on the die 36.
- an image of another semiconductor die 36 is picked up instead of the mounting area 75 of the substrate 74, the center position thereof is detected, and the second deviation between the mounting position BC and the reference position C2 of the frame side camera 63 is determined. It should be detected.
- FIGS. 23 is a vertical cross-sectional view of the pickup unit 101 of the electronic component mounting apparatus 200
- FIG. 24 is a vertical cross-sectional view of the mounting unit 102.
- the same parts as those of the electronic component mounting apparatus 100 described above with reference to FIGS. 1 to 22 are designated by the same reference numerals and the description thereof will be omitted.
- the light source 27 and the beam splitter 28 provided on the arm 23 are configured to cause light to enter the center holes 32 and 34 of the collet 30.
- ring illuminations 92 and 92a are arranged on the lower end side surfaces of the wafer side camera 12 and the frame side camera 63, and the center is located at the upper end of the shaft 31 of the collet 30.
- a glass cover 91 that covers the hole 32 is attached, and the light from the ring illumination 92 is configured to enter the center holes 32 and 34 through the glass cover 91.
- the ring illuminations 92 and 92a and the glass cover 91 constitute a wafer side illumination section 93 and a frame side illumination section 93a.
- the electronic component mounting apparatus 200 has the same operation and effect as the electronic component mounting apparatus 100.
- FIGS. 25 to 27 An electronic component mounting apparatus 300 of another embodiment will be described with reference to FIGS. 25 to 27.
- the same parts as those of the electronic component mounting apparatus 100 described above with reference to FIGS. 1 to 22 are designated by the same reference numerals and the description thereof will be omitted.
- the electronic component mounting apparatus 300 includes an intermediate stage 48 on which the semiconductor die 36 picked up by the pickup head 20 by the pickup unit 101 is placed, and a semiconductor die placed on the intermediate stage 48.
- the mounting head 50 mounts the semiconductor die 36 on the mounting unit 102 by picking up the semiconductor device 36.
- the configuration of the pickup head 20 is the same as the pickup head 20 of the electronic component mounting apparatus 100 described with reference to FIG.
- the pickup head 20 is guided by the linear guide 14 and moves in the X direction.
- the linear guide 14 is moved in the Y direction by a linear guide drive mechanism (not shown).
- the mounting head 50 includes a main body 51 guided by the linear guide 18 extending in the Y direction, a bracket 52 provided below the main body 51, and an arm attached to a lower end portion of the bracket 22. 53 and a mounting collet 55 attached to the X direction plus side end of the arm 53.
- the linear guide 18 moves in the X direction by a linear guide drive mechanism (not shown).
- the main body 51 internally includes a Y-direction drive mechanism that drives the mounting head 50 in the Y-direction and an X-direction drive mechanism that drives the mounting collet 55 in the Z-direction.
- the Y-direction drive mechanism may be, for example, a linear motor
- the Z-direction drive mechanism may be, for example, a voice coil motor.
- the mounting head 50 constitutes a mounting collet drive unit that drives the mounting collet 55 in the Y direction.
- the mounting collet 55 is composed of a shaft 56 on the root side and a mounting collet body 58 on the tip side.
- the shaft 56 is made of metal, and the mounting collet body 58 is made of, for example, metal or ceramics.
- Circular center holes 57 and 59 are coaxially provided at the centers of the shaft 56 and the mounting collet body 58.
- the upper end of the shaft 56 is attached to a portion of the arm 53 where the upper concave portion 53a is provided, and the central hole 57 of the shaft 56 communicates with the upper concave portion 53a of the arm 53 and is located upward in the Z direction from the concave portion 53a. It is open to the public.
- the center hole 59 of the mounting collet body 58 communicates with the center hole 57 of the shaft 56, and is opened downward from the lower end surface in the Z direction.
- a light source 27a and a beam splitter 28a are provided above the recess 53a in the upper part of the arm 53.
- the beam splitter 28a is disposed immediately above the center hole 57 of the shaft 56 of the mounting collet 55, reflects the light from the light source 27a, and extends from the root side of the mounting collet 55 to the center hole 57 of the shaft 56 and the center of the mounting collet body 58. It is made incident into the hole 59. Further, the beam splitter 28a transmits the reflected light reflected by the surface of the semiconductor die 36 adsorbed to the tip of the mounting collet body 58 of the mounting collet 55 toward the upper side in the Z direction and makes it incident on the frame side camera 63.
- the light source 27a and the beam splitter 28a form a frame side illumination unit 29a.
- the light source 27a may be a high brightness LED or a laser light source.
- the beam splitter 28a may be replaced with a half mirror.
- the intermediate stage 48 is arranged between the wafer ring 42 and the transfer mechanism 73 and is guided by a linear guide 47 which is a long member extending in the Y direction. Move in the direction.
- the operation of the pickup unit 101 of the electronic component mounting apparatus 300 of the embodiment described above is different from the operation of the pickup unit 101 of the electronic component mounting apparatus 100 described above in only the X direction and the Y direction, and the other movements are the same. is there.
- the operation of the mounting head 50 of the mounting unit 102 is similar to the operation after the pickup head 20 of the electronic component mounting apparatus 100 moves to the mounting unit 102.
- the electronic component mounting apparatus 300 of this embodiment has the same operation and effect as the electronic component mounting apparatus 100.
- the electronic component mounting apparatus 400 includes a back camera 85 for picking up an image of the semiconductor die 36 adsorbed to the tip of the collet 30 between the pickup unit 101 and the mounting unit 102, and a strobe 86 as a light source.
- the strobe 86 is connected to the image processing unit 82, and turns on and off according to a command from the image processing unit 82.
- the image captured by the rear camera 85 is input to the image processing unit 82.
- the electronic component mounting apparatus 100 is the same as the electronic component mounting apparatus 100 described with reference to FIGS.
- the back surface camera 85 focuses on the back surface (the surface in the Z direction lower side) of the semiconductor die 36 that is attracted to the tip of the collet 30 when the collet 30 moves to a predetermined position directly above. Are arranged so that they match each other, and are adjusted so that a sharp image of the back surface of the semiconductor die 36 can be obtained.
- the strobe 86 includes a reflecting mirror 86a that directs the emitted light toward the collet 30.
- the control unit 81 moves the pickup head 20 from the pickup unit 101 to the mounting unit 102, and as shown in FIG. 28, the collet 30 comes to a predetermined position directly above the rear surface camera 85, and the rear surface camera 85 moves.
- a trigger signal for causing the strobe 86 to emit light is output. This trigger signal is transmitted to the image processing unit 82.
- the image processing unit 82 When the trigger signal is input, the image processing unit 82 outputs a command to make the strobe 86 emit light. This command causes the strobe 86 to emit light. Further, when the trigger signal is input, the image processing unit 82 captures an image as shown in FIG. 29 from the rear camera 85 in synchronization with the light emission of the strobe 86. The captured image is stored in the memory of the image processing unit 82. The image is taken in while moving the collet 30 (without stopping the movement).
- FIG. 29 is a view showing the field of view 87 of the rear camera 85.
- a circular image showing the tip of the collet 30 and a square image showing the outer shape of the semiconductor die 36 appear in the visual field 87 of the rear surface camera 85.
- the image processing unit 82 processes the captured image to detect a circular image 191 showing the outer shape of the collet 30 and a square image 192 showing the outer shape of the semiconductor die 36. Then, the image processing unit 82 detects the position of the center 197 of the circular image 191 and the position of the center 198 of the square image 192, passes through the center 197 of the circular image 191, and moves toward the X direction of the visual field 87 of the rear camera 85.
- a direction reference line 194 and a Y direction reference line 193 that passes through the center 197 of the circular image 191 and extends in the Y direction of the visual field 87 of the rear camera 85 are set. Further, the image processing unit 82 passes through the center 198 of the square image 192 and the X direction measurement line 196 parallel to the side near the X direction reference line 194 of the square image 192 and the center 198 of the square image 192, and the Y of the square image 192. A Y direction measurement line 195 parallel to the side close to the direction reference line 193 is set.
- the image processing unit 82 obtains the shift amounts ⁇ X4 and ⁇ Y4 in the X direction and the Y direction between the position of the center 197 of the circular image 191 and the position of the center 198 of the square image 192. Further, the image processing unit 82 determines the square image 192 from the angle difference between the X-direction reference line 194 and the X-direction measurement line 196 in the ⁇ direction or the angle difference between the Y-direction reference line 193 and the Y-direction measurement line 195 in the ⁇ direction. The rotation angle deviation ⁇ 4 in the ⁇ direction is detected.
- the image processing unit 82 outputs the detected deviation amounts ⁇ X4 and ⁇ Y4 in the X and Y directions and the rotation angle deviation ⁇ 4 in the ⁇ direction to the control unit 81.
- the control unit 81 stores the input ⁇ X4, ⁇ Y4, and ⁇ 4 in the storage unit.
- the control unit 81 corrects the position by the Y-direction first deviation ⁇ Y2 and the Y-direction second deviation ⁇ Y3 to adjust the collet center position CC2 to the mounting position BC, and the X-direction.
- the positional deviation amounts of the semiconductor die 36 with respect to the collet 30, ⁇ X4, ⁇ Y4, and ⁇ 4 are considered.
- the collet center position CC2 is aligned with the mounting position BC.
- the electronic component mounting apparatus 400 corrects the deviation so that the chip center DC of the semiconductor die 36 coincides with the mounting position BC.
- the semiconductor die 36 can be mounted on the substrate 74 in the state.
- the pickup head 20 moves between the pickup unit 101 and the mounting unit 102, and the collet 30 picks up and mounts the semiconductor die 36.
- the configuration in which the rear surface camera 85 and the strobe 86 are arranged between the pickup unit 101 and the mounting unit 102 to detect the amount of positional deviation of the semiconductor die 36 with respect to the collet 30 has been described above with reference to FIGS. It can also be applied to the component mounting apparatus 300.
- the image processing unit 82 based on the image of the front end of the mounting collet 55 and the image of the rear surface of the semiconductor die 36 captured by the rear surface camera 85, the positional deviation amounts ⁇ X4 and ⁇ Y4 of the semiconductor die 36 with respect to the mounting collet 55. ⁇ 4 is detected and output to the control unit 81.
- the control unit 81 uses the mounting collet drive unit to mount the collet based on the first deviations ⁇ X2 and ⁇ Y2, the second deviations ⁇ X3 and ⁇ Y3, and the positional deviation amounts ⁇ X4, ⁇ Y4, and ⁇ 4. Adjust the horizontal position of 55.
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Abstract
Description
以下、図面を参照しながら実施形態の電子部品実装装置100について説明する。なお、視野を示す図以外の各立面図、各平面図、各立断面図では、理解しやすいように半導体ダイ36、コレット30を実際の寸法よりも大きく描いてある。 <Configuration of electronic component mounting device>
Hereinafter, the electronic
以上の様に構成された電子部品実装装置100のピックアップ部101の動作について、図5から図12を参照して説明する。 <Operation of pickup section>
The operation of the
コレット中心位置CC1を検出する画像処理の方法は様々な方法があるが、一例を示すと、黒い背景と中心穴32,34の白い円形の画像とのコントラストから白い円形の画像の境界線を検出し、その円の中心位置を計算することによりコレット中心位置CC1を検出する。図9に示すように、視野15の中ではコレット中心位置CC1はX方向中心線37、Y方向中心線38の交点となる。 As shown in step S105 of FIG. 5, the
There are various image processing methods for detecting the collet center position CC1, but as an example, the boundary line of the white circular image is detected from the contrast between the black background and the white circular images of the
次に図13、図14から図22を参照しながら、実装部102の動作について説明する。 <Operation of mounting part>
Next, the operation of the mounting
次に図23、24を参照して他の実施形態の電子部品実装装置200について説明する。図23は電子部品実装装置200のピックアップ部101の立断面図であり、図24は実装部102の立断面図である。先に図1から図22を参照して説明した電子部品実装装置100と同様の部位には同様の符号を付して説明は省略する。 <Other Embodiments>
Next, an electronic
Claims (11)
- ウェーハを保持するウェーハリングと、
中心穴を有し、前記ウェーハから電子部品をピックアップするコレットと、
前記コレットを水平方向に駆動するコレット駆動部と、
前記コレットの根元側から前記コレットの中心穴に光を入射させるウェーハ側照明部と、
前記コレットの根元側から前記コレットの画像を撮像するウェーハ側撮像装置と、
前記ウェーハ側撮像装置が撮像した画像を処理する画像処理部と、
前記コレットの位置を調整する制御部と、を備える電子部品実装装置であって、
前記ウェーハ側撮像装置は、前記コレットの中心穴に入射して前記コレットの直下の前記ウェーハの表面で反射した反射光の画像を撮像し、
前記画像処理部は、前記ウェーハ側撮像装置が撮像した前記コレットの画像と前記ウェーハの表面で反射した反射光の画像とに基づいて前記コレットの中心穴の中心位置をコレット中心位置として検出し、検出したコレット中心位置と前記ウェーハ側撮像装置の視野の中の基準位置との間の偏差を検出し、
前記制御部は、前記偏差に基づいてコレット駆動部によって前記コレットの水平方向の位置を調整すること、
を特徴とする電子部品実装装置。 A wafer ring that holds the wafer,
A collet that has a central hole and picks up electronic components from the wafer,
A collet drive unit for driving the collet horizontally,
A wafer side illuminating section which makes light enter the center hole of the collet from the root side of the collet,
A wafer-side imaging device that captures an image of the collet from the base side of the collet,
An image processing unit that processes an image captured by the wafer-side imaging device,
A controller for adjusting the position of the collet, and an electronic component mounting apparatus comprising:
The wafer-side imaging device captures an image of reflected light that is incident on the center hole of the collet and is reflected on the surface of the wafer directly below the collet,
The image processing unit detects the center position of the center hole of the collet as the collet center position based on the image of the collet imaged by the wafer-side imaging device and the image of the reflected light reflected on the surface of the wafer, Detecting a deviation between the detected collet center position and a reference position in the field of view of the wafer-side imaging device,
The controller adjusts the horizontal position of the collet by a collet driver based on the deviation,
An electronic component mounting device characterized by: - 請求項1に記載の電子部品実装装置であって、
前記コレットがピックアップする電子部品を前記ウェーハの下側から突き上げる突き上げピンを含み、
前記ウェーハ側撮像装置は、上側から前記突き上げピンの画像を撮像し、
前記画像処理部は、
前記ウェーハ側撮像装置が撮像した前記突き上げピンの画像に基づいて前記突き上げピンの中心位置をピンセンタとして検出し、
検出した前記ピンセンタを前記ウェーハ側撮像装置の視野の中の基準位置に設定すること、
を特徴とする電子部品実装装置。 The electronic component mounting apparatus according to claim 1, wherein
Including a push-up pin that pushes up the electronic component picked up by the collet from the lower side of the wafer,
The wafer-side imaging device captures an image of the push-up pin from above,
The image processing unit,
Detecting the center position of the push-up pin as a pin center based on the image of the push-up pin captured by the wafer-side imaging device,
Setting the detected pin center at a reference position in the field of view of the wafer-side imaging device,
An electronic component mounting device characterized by: - 請求項2に記載の電子部品実装装置であって、
前記ウェーハリングを水平方向に駆動するウェーハリング駆動部を含み、
前記ウェーハ側撮像装置は、前記ウェーハの上側から前記コレットがピックアップする電子部品を撮像し、
前記画像処理部は、
前記ウェーハ側撮像装置が撮像した前記コレットがピックアップする電子部品の画像に基づいて前記コレットがピックアップする電子部品の中心位置をチップセンタとして検出し、
前記制御部は、前記チップセンタが前記ウェーハ側撮像装置の視野の中の基準位置となるようにウェーハリング駆動部によって前記ウェーハリングの水平方向の位置を調整すること、
を特徴とする電子部品実装装置。 The electronic component mounting apparatus according to claim 2, wherein
A wafer ring driving unit for horizontally driving the wafer ring,
The wafer-side imaging device images an electronic component picked up by the collet from the upper side of the wafer,
The image processing unit,
The center position of the electronic component picked up by the collet is detected as a chip center based on the image of the electronic component picked up by the collet imaged by the wafer-side imaging device,
The control unit adjusts the horizontal position of the wafer ring by the wafer ring driving unit so that the chip center becomes a reference position in the field of view of the wafer side image pickup device;
An electronic component mounting device characterized by: - 請求項1から3のいずれか1項に記載の電子部品実装装置であって、
前記コレットの根元側から前記コレットの中心穴に光を入射させるフレーム側照明部と、
前記コレットの根元側から前記コレットの画像を撮像するフレーム側撮像装置と、を含み、
前記コレットは、先端に吸着した電子部品を実装対象物に実装し、
前記画像処理部は、前記フレーム側撮像装置が撮像した画像を処理し、
前記フレーム側撮像装置は、前記コレットの先端に電子部品を吸着させた状態で、前記コレットの中心穴に入射して前記コレットの先端に吸着された電子部品の表面で反射した反射光の画像を撮像し、
前記画像処理部は、前記フレーム側撮像装置が撮像した前記コレットの先端に吸着された電子部品の表面で反射した反射光の画像に基づいて前記コレットの中心穴の中心位置をコレット中心位置として検出し、検出したコレット中心位置と前記フレーム側撮像装置の視野の中の基準位置との間の第1偏差を検出し、
前記制御部は、前記第1偏差に基づいてコレット駆動部によって前記コレットの水平方向の位置を調整すること、
を特徴とする電子部品実装装置。 The electronic component mounting apparatus according to any one of claims 1 to 3,
A frame-side illumination unit that allows light to enter the center hole of the collet from the root side of the collet,
A frame-side imaging device that captures an image of the collet from the root side of the collet;
The collet mounts an electronic component adsorbed at the tip on a mounting object,
The image processing unit processes an image captured by the frame-side imaging device,
The frame-side imaging device, in a state in which an electronic component is adsorbed on the tip of the collet, makes an image of reflected light that is incident on the center hole of the collet and reflected on the surface of the electronic component adsorbed on the tip of the collet Take an image,
The image processing unit detects the center position of the center hole of the collet as the collet center position based on the image of the reflected light reflected by the surface of the electronic component adsorbed to the tip of the collet captured by the frame-side imaging device. Then, the first deviation between the detected center position of the collet and the reference position in the visual field of the frame-side imaging device is detected,
The controller adjusts a horizontal position of the collet by a collet driver based on the first deviation,
An electronic component mounting device characterized by: - 請求項4に記載の電子部品実装装置であって、
前記フレーム側撮像装置は、前記実装対象物の画像を撮像し、
前記画像処理部は、前記フレーム側撮像装置が撮像した前記実装対象物の画像に基づいて前記電子部品を実装する実装位置を検出し、検出した前記実装位置と前記フレーム側撮像装置の視野の中の基準位置との間の第2偏差を検出し、
前記制御部は、
前記第1偏差と前記第2偏差とに基づいて前記コレット駆動部によって前記コレットの水平方向の位置を調整すること、
を特徴とする電子部品実装装置。 The electronic component mounting apparatus according to claim 4,
The frame-side imaging device captures an image of the mounting target,
The image processing unit detects a mounting position for mounting the electronic component based on an image of the mounting target imaged by the frame-side imaging device, and detects the mounting position and the field of view of the frame-side imaging device. The second deviation from the reference position of
The control unit is
Adjusting the horizontal position of the collet by the collet driver based on the first deviation and the second deviation;
An electronic component mounting device characterized by: - 請求項5に記載の電子部品実装装置であって、
前記ウェーハから前記電子部品をピックアップするピックアップ部と、ピックアップした前記電子部品を前記実装対象物に実装する実装部との間に配置され、前記コレットの先端の画像と前記コレットの先端に吸着された前記電子部品の裏面の画像とを撮像する裏面カメラを備え、
前記画像処理部は、前記裏面カメラが撮像した前記コレットの先端の画像と前記電子部品の裏面の画像とに基づいて、前記コレットに対する前記電子部品の位置ずれ量を検出し、
前記制御部は、
前記第1偏差と前記第2偏差と前記コレットに対する前記電子部品の位置ずれ量とに基づいて前記コレット駆動部によって前記コレットの水平方向の位置を調整すること、
を特徴とする電子部品実装装置。 The electronic component mounting apparatus according to claim 5,
It is arranged between a pickup unit that picks up the electronic component from the wafer and a mounting unit that mounts the picked-up electronic component on the mounting target, and is attracted to the image of the tip of the collet and the tip of the collet. A backside camera for capturing an image of the backside of the electronic component,
The image processing unit, based on the image of the tip of the collet and the image of the back surface of the electronic component captured by the back camera, detects the amount of misalignment of the electronic component with respect to the collet,
The control unit is
Adjusting the horizontal position of the collet by the collet drive unit based on the first deviation, the second deviation, and the amount of displacement of the electronic component with respect to the collet.
An electronic component mounting device characterized by: - 請求項1から3のいずれか1項に記載の電子部品実装装置であって、
中心穴を有し、先端に吸着した電子部品を実装対象物に実装する実装コレットと、
前記実装コレットを水平方向に駆動する実装コレット駆動部と、
前記実装コレットの根元側から前記実装コレットの中心穴に光を入射させるフレーム側照明部と、
前記実装コレットの根元側から前記実装コレットの画像を撮像するフレーム側撮像装置と、を含み、
前記画像処理部は、前記フレーム側撮像装置が撮像した画像を処理し、
前記制御部は、前記実装コレットの位置を調整し、
前記フレーム側撮像装置は、前記実装コレットの先端に電子部品を吸着させた状態で、前記実装コレットの中心穴に入射して前記実装コレットの先端に吸着された電子部品の表面で反射した反射光の画像を撮像し、
前記画像処理部は、前記フレーム側撮像装置が撮像した前記実装コレットの先端に吸着された電子部品の表面で反射した反射光の画像とに基づいて前記実装コレットの中心穴の中心位置を実装コレット中心位置として検出し、検出した前記実装コレット中心位置と前記フレーム側撮像装置の視野の中の基準位置との間の第1偏差を検出し、
前記制御部は、前記第1偏差に基づいて前記実装コレット駆動部によって前記実装コレットの水平方向の位置を調整すること、
を特徴とする電子部品実装装置。 The electronic component mounting apparatus according to any one of claims 1 to 3,
A mounting collet that has a central hole and that mounts the electronic component that is adsorbed on the tip to the mounting target,
A mounting collet drive unit for driving the mounting collet in a horizontal direction,
A frame-side illumination unit that allows light to enter the center hole of the mounting collet from the root side of the mounting collet,
A frame-side imaging device that captures an image of the mounting collet from the root side of the mounting collet;
The image processing unit processes an image captured by the frame-side imaging device,
The control unit adjusts the position of the mounting collet,
The frame-side imaging device, in a state in which an electronic component is adsorbed on the tip of the mounting collet, is reflected light that is incident on the center hole of the mounting collet and reflected on the surface of the electronic component adsorbed on the tip of the mounting collet Image of
The image processing unit determines the center position of the center hole of the mounting collet based on the image of the reflected light reflected by the surface of the electronic component adsorbed to the tip of the mounting collet captured by the frame-side imaging device. Detecting as a center position, detecting a first deviation between the detected mounting collet center position and a reference position in the field of view of the frame-side imaging device,
The control unit adjusts a horizontal position of the mounting collet by the mounting collet driving unit based on the first deviation;
An electronic component mounting device characterized by: - 請求項7に記載の電子部品実装装置であって、
前記フレーム側撮像装置は、前記実装対象物の画像を撮像し、
前記画像処理部は、前記フレーム側撮像装置が撮像した前記実装対象物の画像に基づいて前記電子部品を実装する実装位置を検出し、検出した前記実装位置と前記フレーム側撮像装置の視野の中の基準位置との間の第2偏差を検出し、
前記制御部は、
前記第1偏差と前記第2偏差とに基づいて前記実装コレット駆動部によって前記実装コレットの水平方向の位置を調整すること、
を特徴とする電子部品実装装置。 The electronic component mounting apparatus according to claim 7,
The frame-side imaging device captures an image of the mounting target,
The image processing unit detects a mounting position for mounting the electronic component based on an image of the mounting target imaged by the frame-side imaging device, and detects the mounting position and the field of view of the frame-side imaging device. The second deviation from the reference position of
The control unit is
Adjusting the horizontal position of the mounting collet by the mounting collet driving unit based on the first deviation and the second deviation;
An electronic component mounting device characterized by: - 請求項8に記載の電子部品実装装置であって、
前記ウェーハから前記電子部品をピックアップするピックアップ部と、ピックアップした前記電子部品を前記実装対象物に実装する実装部との間に配置され、前記実装コレットの先端の画像と前記実装コレットの先端に吸着された前記電子部品の裏面の画像とを撮像する裏面カメラを備え、
前記画像処理部は、前記裏面カメラが撮像した前記実装コレットの先端の画像と前記電子部品の裏面の画像とに基づいて、前記実装コレットに対する前記電子部品の位置ずれ量を検出し、
前記制御部は、
前記第1偏差と前記第2偏差と前記実装コレットに対する前記電子部品の位置ずれ量とに基づいて前記実装コレット駆動部によって前記実装コレットの水平方向の位置を調整すること、
を特徴とする電子部品実装装置。 The electronic component mounting apparatus according to claim 8,
The pick-up unit that picks up the electronic component from the wafer and the mounting unit that mounts the picked-up electronic component on the mounting target are attached to the image of the tip of the mounting collet and the tip of the mounting collet. A rear surface camera for capturing an image of the rear surface of the electronic component,
The image processing unit, based on the image of the tip of the mounting collet and the image of the back surface of the electronic component captured by the back camera, detects the amount of positional deviation of the electronic component with respect to the mounting collet,
The control unit is
Adjusting the horizontal position of the mounting collet by the mounting collet drive unit based on the first deviation, the second deviation, and the amount of displacement of the electronic component with respect to the mounting collet.
An electronic component mounting device characterized by: - 中心穴を有し、先端に吸着した電子部品を実装対象物に実装する実装コレットと、
前記実装コレットを水平方向に駆動する実装コレット駆動部と、
前記実装コレットの根元側から前記実装コレットの中心穴に光を入射させるフレーム側照明部と、
前記実装コレットの根元側から前記実装コレットの画像を撮像するフレーム側撮像装置と、
前記フレーム側撮像装置が撮像した画像を処理する画像処理部と、
前記実装コレットの位置を調整する制御部と、を備える電子部品実装装置であって、
前記フレーム側撮像装置は、前記実装コレットの先端に電子部品を吸着させた状態で、前記実装コレットの中心穴に入射して前記実装コレットの先端に吸着された電子部品の表面で反射した反射光の画像を撮像し、
前記画像処理部は、前記フレーム側撮像装置が撮像した前記実装コレットの先端に吸着された電子部品の表面で反射した反射光の画像に基づいて前記実装コレットの中心穴の中心位置を実装コレット中心位置として検出し、検出した前記実装コレット中心位置と前記フレーム側撮像装置の視野の中の基準位置との間の第1偏差を検出し、
前記制御部は、前記第1偏差に基づいて実装コレット駆動部によって前記実装コレットの水平方向の位置を調整すること、
を特徴とする電子部品実装装置。 A mounting collet that has a central hole and that mounts the electronic component that is adsorbed on the tip to the mounting target,
A mounting collet drive unit for driving the mounting collet in a horizontal direction,
A frame-side illumination unit that allows light to enter the center hole of the mounting collet from the root side of the mounting collet,
A frame-side imaging device that captures an image of the mounting collet from the base side of the mounting collet,
An image processing unit that processes an image captured by the frame-side imaging device,
A controller for adjusting the position of the mounting collet, and an electronic component mounting apparatus comprising:
The frame-side imaging device, in a state where an electronic component is adsorbed on the tip of the mounting collet, is reflected light that is incident on the center hole of the mounting collet and is reflected on the surface of the electronic component adsorbed on the tip of the mounting collet. Image of
The image processing unit determines the center position of the center hole of the mounting collet based on the image of the reflected light reflected by the surface of the electronic component adsorbed to the tip of the mounting collet captured by the frame-side imaging device. Detecting as a position, and detecting a first deviation between the detected mounting collet center position and a reference position in the field of view of the frame-side imaging device,
The control unit adjusts a horizontal position of the mounting collet by a mounting collet driving unit based on the first deviation;
An electronic component mounting device characterized by: - 請求項9に記載の電子部品実装装置であって、
前記フレーム側撮像装置は、前記実装対象物の画像を撮像し、
前記画像処理部は、前記フレーム側撮像装置が撮像した前記実装対象物の画像に基づいて前記電子部品を実装する前記実装位置を検出し、検出した前記実装位置と前記フレーム側撮像装置の視野の中の基準位置との間の前記第2偏差を検出し、
前記制御部は、
前記第1偏差と前記第2偏差とに基づいて前記実装コレット駆動部によって前記実装コレットの位置を調整すること、
を特徴とする電子部品実装装置。 The electronic component mounting apparatus according to claim 9,
The frame-side imaging device captures an image of the mounting target,
The image processing unit detects the mounting position where the electronic component is mounted based on an image of the mounting target imaged by the frame-side imaging device, and detects the mounting position and the visual field of the frame-side imaging device. Detecting the second deviation from the reference position in
The control unit is
Adjusting the position of the mounting collet by the mounting collet driving unit based on the first deviation and the second deviation;
An electronic component mounting device characterized by:
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- 2019-10-31 WO PCT/JP2019/042724 patent/WO2020090957A1/en active Application Filing
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Also Published As
Publication number | Publication date |
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JP6940207B2 (en) | 2021-09-22 |
KR102488231B1 (en) | 2023-01-13 |
CN113287191A (en) | 2021-08-20 |
SG11202104308TA (en) | 2021-05-28 |
JPWO2020090957A1 (en) | 2021-09-02 |
KR20210082514A (en) | 2021-07-05 |
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