WO2020079118A1 - Laservorrichtung und verfahren zur herstellung einer laser-vorrichtung - Google Patents
Laservorrichtung und verfahren zur herstellung einer laser-vorrichtung Download PDFInfo
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- WO2020079118A1 WO2020079118A1 PCT/EP2019/078153 EP2019078153W WO2020079118A1 WO 2020079118 A1 WO2020079118 A1 WO 2020079118A1 EP 2019078153 W EP2019078153 W EP 2019078153W WO 2020079118 A1 WO2020079118 A1 WO 2020079118A1
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- circuit board
- plate
- laser
- housing
- interior
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
- H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
Definitions
- the present invention relates to a laser device and a method for producing a laser device.
- Lasers in particular power lasers, which emit short-wave light such as green or blue light, currently have to be encapsulated at high cost.
- the laser elements In order to ensure stable operation in the long term, the laser elements must be operated in a clean atmosphere. The reason for this is that, in particular in the case of short-wave radiation-emitting semiconductor lasers, high field strengths occur in connection with a large beam divergence. As a result, particles and also molecules from the environment are transported to the facet. Due to the high energy densities in the area of the laser facet, decomposition and deposition or attachment of particles and decomposition products can occur on the facet. If the reaction products are not perfectly transparent, there is an interaction with the emitted radiation, which in turn leads to additional heating in the area of the facet.
- hermetic housings also called packages.
- Hermetically means that the housing is sealed so tightly that no particles or molecules that could damage or destroy the laser can penetrate into the housing from outside.
- the present invention is based on the object of creating an advantageous laser device with a hermetic housing and a laser element integrated into the housing, the laser device being particularly inexpensive to manufacture and suitable for further miniaturization and integration. Furthermore, a corresponding method for producing a laser device is to be specified.
- a laser device comprises a hermetic or hermetically encapsulated or hermetically sealed housing, which has an interior or a cavity and is at least partially made of printed circuit board material. At least one laser element is arranged in the interior of the housing. Furthermore, the laser device comprises at least one inorganic layer which hermetically shields the interior from the printed circuit board material.
- a printed circuit board, also called PCB (printed circuit board), printed circuit board, circuit board or printed circuit is a carrier for electronic components.
- Printed circuit boards consist of electrically insulating material with adhering, electrically conductive connections, so-called conductor tracks.
- electrically insulating material fiber-reinforced plastic is often used.
- the electrically insulating material can consist of glass fibers that are embedded in an epoxy or silicone resin.
- the conductor tracks of a printed circuit board are mostly etched from a thin layer of copper.
- the invention proposes to hermetically shield the interior of the housing in which the laser element is located from the printed circuit board material by means of the at least one inorganic layer.
- the at least one inorganic layer can cover surfaces of the printed circuit board material and possibly surfaces of other components of the laser device in such a way that no printed circuit board material is in contact with the interior or the atmosphere in the interior and is also guaranteed, that no organic or partially organic material from the circuit board material can get into the interior or at most as much organic or partially organic material from the circuit board material can get into the interior that the functionality or the integrity of the laser element is not impaired thereby.
- the circuit board material is hermetically encapsulated by the at least one inorganic layer with respect to the interior of the housing.
- the hermetic shielding (or encapsulation) of the circuit board material from the interior of the housing by the at least one inorganic layer should be designed such that a maximum of as much gaseous organic or partially organic substances from the circuit board material get into the interior that the laser element is not damaged or is affected.
- the leak rate of the gaseous organic or partially organic substances from the printed circuit board material through the at least one inorganic layer in the interior of the housing can be at most IO -4 mbar * 1 / s or at most IO -5 mbar * 1 / s or at most IO -6 mbar * 1 / s or at most IO -7 mbar * 1 / s or at most IO -8 mbar * 1 / s or at most IO -9 mbar * 1 / s.
- the limit value depends, for example, on the organic or partially organic substances contained in the circuit board and the type of laser used and can be determined experimentally.
- the laser element can be hermetically encapsulated to protect the facet and prevented that gaseous organic or partially organic substances are released from the circuit board material and get into the interior, where the substances could potentially deposit on the laser facet.
- the laser device enables the atmosphere in the interior of the housing in which the laser element is operated to be set in a targeted manner.
- the interior can be filled with dry air and / or the oxygen partial pressure can be set in a targeted manner.
- getters is also possible.
- the laser device can, for example, in AR (augmented reality, augmented reality) data glasses, intelligent data glasses (English: smart glass) that project information into the glasses or directly onto the retina, flash lights in particular from mobile devices, headlights or other lighting devices or compact projection devices used in vehicles.
- the laser element can be formed as a semiconductor laser or laser diode. Furthermore, the laser element can be implemented as a semiconductor chip.
- At least one laser element integrated in the housing can emit short-wave laser radiation, the wavelength of the laser radiation not exceeding 570 nm.
- the at least one laser element can be designed to emit green, blue or violet light or ultraviolet (UV) radiation.
- UV ultraviolet
- several laser elements are integrated in the housing and one or more of these laser elements light emit with a wavelength greater than 570 nm.
- the laser device can be designed as a so-called RGB package with three laser elements that emit red, green and blue light. In this case, the laser radiation of the red light-emitting laser element has a wavelength of over 570 nm.
- the housing has a printed circuit board as the base plate.
- the circuit board can be used as an assembly and / or connection level in order to mount the laser device and to electrically couple it to another device or a system.
- the laser device can be easily integrated into an application, for example as an SMT (surface mount technology) component.
- the circuit board should be encapsulated towards the interior of the housing by the at least one inorganic layer, so that no gaseous organic or partially organic substances are released from the circuit board material and can reach the interior.
- An insert on which the laser element is arranged can be integrated or inserted into the printed circuit board.
- the laser element does not have to be placed directly on the insert, there may well be one or more components between the insert and the laser element.
- the insert is made of an inorganic material and in particular designed such that no gaseous organic or partially organic substances are released from the insert and can get into the interior.
- the insert part fulfills the requirements regarding hermeticity, so that no particles or molecules that could damage or destroy the laser can pass through the outside Insert part can penetrate into the interior of the housing.
- the insert part consists entirely of one or more inorganic material (s).
- the insert can be made of silicon, A1N, Al 2 O 3 , SiC, ceramic or other suitable materials.
- the insert can serve as a heat sink in order to be able to dissipate heat generated by the laser element during operation to the outside.
- the insert part should be made of a material with sufficient thermal conductivity.
- further heat sinks for example in the form of carbon foils, can be integrated into the housing.
- the insert part can have at least one electrical and hermetic plated-through hole.
- the at least one electrical plated-through hole can extend from a first main surface of the insert part to a second main surface of the insert part opposite the first main surface.
- the at least one electrical cal through contact allows electrical signal and / or power transmission from the outside of the housing to the interior and in the opposite direction.
- the at least one electrical plated-through hole can be connected to one or more printed conductors on the printed circuit board, in particular on the underside of the printed circuit board, which serves as a mounting and / or connection surface.
- the base plate can also be a ceramic base plate or made of an inorganic material without an additional insert.
- the at least one electrical and hermetic plated-through hole can be integrated in the ceramic or inorganic base plate.
- the circuit board as a base plate, further components can be integrated into the housing. For example, at least one active component and / or at least one passive component can be integrated or embedded in the printed circuit board.
- Active components can be, for example, switching elements, such as a MOSFET (English: metal-oxide-semiconductor field-effect transistor, metal-oxide-semiconductor field-effect transistor), a GaNFET (English: gallium nitride field-effect transistor) , Gallium nitride field effect transistor) or a differently designed transistor.
- Passive components can be capacitors, for example.
- the active and / or passive construction elements can also be integrated into the other printed circuit board material built into the housing.
- the construction elements can be installed in the side walls and / or the cover plate of the housing, provided that these components are at least partially made of printed circuit board material.
- At least one side wall of the housing is at least partially made of a circuit board material.
- a further plate which is at least partially made of an organic material and has a recess, on the circuit board be arranged.
- the recess in the plate can at least partially form the interior of the housing.
- the organic material from which the further board is made can be the same material from which the electrically insulating part of the circuit board is made.
- the at least one inorganic layer can be applied to the further board in order to hermetically encapsulate it relative to the interior of the housing and to prevent gaseous organic or partially organic substances which can be harmful to the laser element are released from the organic material and get into the interior.
- the housing can have a cover plate which is at least partially made of a material which is transparent to the laser radiation emitted by the laser element. This enables the laser radiation to be led out of the housing and made available for a desired application. If necessary, one or more optical elements can be arranged in the interior which direct the laser radiation in the desired direction.
- the cover plate can be mounted on the side walls of the housing. The joints between the cover plate and the side walls can be hermetically sealed.
- the cover plate can be made entirely of one or more of the above-mentioned materials or only partially from these materials.
- the cover plate can be at least partially made of an organic material, in which an insert part is integrated from a material that is transparent to the laser radiation emitted by the laser element.
- the organic material of the cover plate can be the same material from which the electrically insulating part of the circuit board is made. This can be advantageous since in this case the base plate and the cover plate have similar thermal expansion coefficients.
- the at least one inorganic layer can be applied to the further board in order to hermetically encapsulate it relative to the interior of the housing and to prevent gaseous organic or partially organic substances, which can be harmful to the laser element, from the organic Material are released and get into the interior.
- the insert in the cover plate can for example consist of glass, sapphire (Al 2 O 3 ) or silicon.
- the at least one inorganic layer can be at least one metal layer which is galvanically, ie electrochemically, deposited on the printed circuit board material, ie in particular the base plate, the side walls and / or the cover plate.
- copper in particular so-called ED-Cu (English: eletrically deposited copper)
- ED-Cu eletrically deposited copper
- several metal layers can be stacked one above the other.
- the at least one inorganic layer can consist of inorganic, non-metallic layers or layer stacks which, for example, with the aid of sputtering, vapor deposition, PVD (English: physical vapor deposition, physical vapor deposition) - or CVD (English: chemical vapor deposition, chemical vapor deposition) process.
- the materials and layer thicknesses used for the at least one inorganic layer are intended to ensure hermetic encapsulation of the organic components of the housing. Furthermore, the shielding can be improved by providing appropriate shields in the housing, for example by laminating metal foils or metal-coated foils. This embodiment not only has the advantage of gas tightness, but can also shield high-frequency electromagnetic radiation.
- a method according to one embodiment is used to manufacture a laser device.
- the method provides that a housing is made at least partially from a circuit board material, at least one laser element is arranged in an interior of the housing, the interior is shielded from the circuit board material with at least one inorganic layer, and the housing is hermetically sealed.
- the method for producing a laser device can have the above-described configurations of the laser device.
- a circuit board into which an insert part made of an inorganic material is inserted can be provided as the base plate of the housing and the laser element can be arranged on the insert part.
- a further plate, which is at least partially made of an organic material and has a recess, can be arranged on the printed circuit board. The recess can at least partially form the interior of the housing.
- the at least one inorganic layer can be applied to the printed circuit board and the further plate, and since a cover plate can be made, which at least partially consists of a for the laser radiation emitted by the laser element is made by casual material, are brought up on the further plate.
- the cover plate can be attached to the further plate by means of a joining material which has a metallic material, a low-temperature glass, a suitable solder material and / or an inorganic adhesive material or consists entirely of such a material.
- the joining material should also ensure the hermeticity of the housing.
- the metallic material can be, for example, an AuSn solder joint with a process temperature in the range of approximately 280 to 320 ° C, an Auln solder joint with a process temperature in the range of approximately 180 to 220 ° C or an AuAu compression bond layer with a process temperature in Range from about 200 to 250 ° C.
- an AuSn solder joint with a process temperature in the range of approximately 280 to 320 ° C an AuSn solder joint with a process temperature in the range of approximately 180 to 220 ° C
- an AuAu compression bond layer with a process temperature in Range from about 200 to 250 ° C.
- tellurium-based glasses with a process temperature in the range of approximately 350 to 500 ° C. can be used as low-temperature glass.
- an organic adhesive material is used as the joining material, it must be sufficiently hermetically sealed so that no gaseous organic or partially organic substances can get through the adhesive material into the interior, which could damage or impair the laser element.
- a cover plate which is at least partially made of a material that is transparent to the laser radiation emitted by the laser element, is provided and another plate that is at least partially made of an organic material and at least partially the interior of the housing forming recess has, is attached to the cover plate.
- the at least one inorganic layer can be applied to the circuit board and after attaching the others Plate on the cover plate, at least one other inorganic layer can be applied to the further plate in order to shield the interior from the further plate.
- the cover plate can then be applied to the circuit board together with the further plate.
- the cover plate or the further plate can be attached to the circuit board by means of a joining material which, as in the embodiment described above, can have a metallic material, a low-temperature glass and / or an inorganic adhesive material or can consist entirely of such a material and that can ensure the hermeticity of the housing.
- the at least one inorganic layer can be at least one metal layer that is electrodeposited on the circuit board material.
- Fig. 1 shows a schematic illustration of an exemplary embodiment of a laser device
- Fig. 2 shows a variant of that shown in FIG. 1
- Fig. 3 shows a schematic illustration of a further exemplary embodiment of a laser device
- Fig. 4 shows a variant of that shown in FIG. 3
- FIG. 5 shows a variant of the embodiment shown in FIG. 4;
- Fig. 6 shows a variant of that shown in FIG. 1
- FIG. 1 schematically shows a laser device 10 with a hermetic housing 11, which has an interior 12.
- a laser element 13 is arranged, which is designed in particular to generate green or blue laser radiation 14.
- the housing 11 contains a printed circuit board 20 as the base plate, the body of which at least partially contains organic material.
- An insert 21 is integrated into the printed circuit board 20 and is made of an inorganic material, for example silicon, A1N, AI2O3 or SiC, is manufactured.
- the insert part 21 comprises electrical vias 22 which extend from a first main surface 23 of the insert part 21 to a second main surface 24 opposite the first main surface 23 of the insert part 21 and are made of a metal, for example copper.
- first and second main surfaces 23, 24, respective metallization layers 25 and 26 are deposited, which are formed into conductor tracks and are connected to the plated-through holes 22 at desired locations.
- the metallization layer 26 on the second main surface 24 of the insert part 21 also extends to the underside of the printed circuit board 20.
- the first main surface 23 of the insert part 21 in the present exemplary embodiment is flush with the upper side of the at least partially made of an organic material body of the printed circuit board 20 designed.
- the second main surface 24 of the insert part 21 is configured flush with the underside of the body of the printed circuit board 20.
- the laser device 10 can be mounted with the underside of the printed circuit board 20 on an external component , in particular soldered.
- the metallization layer 25 can be electrically connected to the laser element 13, which allows the laser element 13 to be electrically controlled from the outside of the laser device 10 via the metallization layers 26.
- circuit board 20 further active or passive construction elements can be integrated, which are not shown in Fig. 1.
- a submount 30 is mounted on the insert part 21, on which in turn the laser element 13 is mounted.
- an optical element 31 is arranged on the insert part 21, which serves to direct the laser radiation 14 generated by the laser element 13 in the desired direction and, if necessary, to shape it.
- Another plate 32 is mounted on the circuit board 20. Together with the printed circuit board 20, the board 32 can form a multilayer printed circuit board (English: multi-layer PCB).
- the plate 32 forms the side walls of the housing 11 and has a recess through which the interior 12 of the housing 11 is formed.
- the plate 32 is also made of a printed circuit board material and, like the printed circuit board 20, contains organic material.
- gaseous organic or partially organic substances can escape from the printed circuit board 20 and the plate 32. So that these substances do not get into the interior 12 of the housing 11 and damage the facet of the laser element 13 there, the circuit board 20 and the plate 32 are hermetically encapsulated to the interior of the housing 11 by means of a layer 35 formed as a diffusion barrier from an inorganic material.
- the diffusion barrier 35 is formed from electrodeposited copper.
- the diffusion barrier 35 covers all surfaces of the circuit board 20 and the plate 32, which would otherwise be in contact with the atmosphere of the interior 12. Furthermore, the diffusion barrier 35 completely covers the top of the plate 32 and the joints between the circuit board 20 and the insert part 21 to effect a hermetic encapsulation.
- the housing 11 On its upper side, the housing 11 is closed off by a cover plate 40 through which the laser radiation 14 emerges.
- the cover plate 40 is made entirely of glass.
- the cover plate 40 has at its edges metallizations 41 with which the cover plate 40 is attached to the diffusion barrier 35 applied to the top of the plate 32.
- the joining point between the cover plate 40 and the diffusion barrier 35 is hermetically sealed by means of a joining material as 42.
- the joining material 42 can be, for example, a metallic material, a low-temperature glass or an inorganic adhesive material as described above.
- the cover plate 40 can be hermetically connected to the diffusion barrier 35 by laser welding.
- the circuit board 20, the plate 32, the laser element 13, the diffusion barrier 35 and the components in the interior 12 of the housing 11 are first assembled or assembled. Only then is the cover plate 40 placed and hermetically sealed.
- Fig. 2 shows schematically a laser device 50 which is largely identical to the device 10 shown in Fig. 1.
- the cover plate 40 of the laser device 50 is not completely made of glass, but consists of a plate 51 made of an organic material, into which an insert part 52 made of glass is integrated.
- the plate 51 can be made of the same material as the body of the circuit board 20.
- the insert 52 is arranged in the plate 51 such that the laser radiation 14 can exit through the insert 52.
- the plate 51 is hermetically encapsulated towards the interior 12 by a layer 53 of an inorganic material.
- layer 53 is an electrodeposited copper layer.
- FIG. 3 schematically shows a laser device 60 which largely corresponds to the laser device 10 shown in FIG. 1. The differences between the laser devices 10 and 60 are due to the different manufacturing processes.
- the laser element 13 and the optical element 31 are mounted on the insert part 21 integrated in the printed circuit board 20. Furthermore, the diffusion barrier 35 is applied to the printed circuit board 20. However, the side walls of the housing 11 forming plate 32 is not attached directly to the circuit board 20, but by means of an adhesive 61, for example an organic adhesive, on the cover plate 40. Subsequently, the plate 32 is hermetically sealed towards the interior 12 by a layer made of an inorganic and designed as a diffusion barrier 62
- the diffusion barrier 62 is an electrodeposited copper layer. Then the two components described above are joined together and the joint is welded by laser or hermetically sealed with the aid of the joining material 42 or another suitable material.
- Fig. 4 shows schematically a laser device 70 which is largely identical to the laser device 60 shown in Fig. 3 device.
- the cover plate 40 of the laser device 70 is not made entirely of glass, but, as in the laser device 50 shown in FIG. 2, the cover plate 40 consists of the plate 51 made of an organic material into which the insert part 52 is made of glass is integrated.
- the diffusion barrier 62 extends in the Laservor device 70 over the interior 11 facing surface of the plate 51 so that no gaseous organic or partially organic substances from the plate 51 can be released into the interior 12.
- Fig. 5 shows schematically a laser device 80, which is largely identical to the device 70 shown in Fig. 4 device 70.
- the base plate does not consist of a printed circuit board into which an insert part made of an inorganic material is integrated, but the base plate is made in the laser device 80 without an insert part and comprises a continuous ceramic base plate 81 or a base plate 81 made of an inorganic material .
- Fig. 6 shows schematically a laser device 90, which is largely identical to the device 10 shown in Fig. 1.
- the base plate does not consist of a printed circuit board into which an insert part made of an inorganic material is integrated, but the base plate is implemented in the laser device 90 without an insert part and comprises the continuous ceramic base plate 81 or one made of an inorganic material as in the laser device 80 shown in FIG. 5.
- the cover plate 40 also has no insert and is made entirely of glass.
- the cover plate 40 has at its edges metallizations 41 with which the cover plate 40 is attached to the diffusion barrier 35 applied to the top of the plate 32.
- the joining point between the cover plate 40 and the diffusion barrier 35 is hermetically sealed by means of a joining material as 42. It is also conceivable to dispense with the metallizations 41, so that the joining material 42 is in direct contact with the cover plate 40.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CN201980068637.5A CN112868146B (zh) | 2018-10-17 | 2019-10-17 | 激光设备和用于制造激光设备的方法 |
JP2021515635A JP7124214B2 (ja) | 2018-10-17 | 2019-10-17 | レーザ装置およびレーザ装置の製造方法 |
US17/285,244 US12009633B2 (en) | 2018-10-17 | 2019-10-17 | Laser device and method for manufacturing a laser device |
DE112019005205.5T DE112019005205A5 (de) | 2018-10-17 | 2019-10-17 | Laservorrichtung und verfahren zur herstellung einer laser-vorrichtung |
Applications Claiming Priority (4)
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DE102018125787 | 2018-10-17 | ||
DE102018125787.2 | 2018-10-17 | ||
DE102018130578.8A DE102018130578A1 (de) | 2018-11-30 | 2018-11-30 | Laservorrichtung und verfahren zur herstellung einer laservorrichtung |
DE102018130578.8 | 2018-11-30 |
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WO2020079118A1 true WO2020079118A1 (de) | 2020-04-23 |
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PCT/EP2019/078153 WO2020079118A1 (de) | 2018-10-17 | 2019-10-17 | Laservorrichtung und verfahren zur herstellung einer laser-vorrichtung |
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US (1) | US12009633B2 (de) |
JP (1) | JP7124214B2 (de) |
CN (1) | CN112868146B (de) |
DE (1) | DE112019005205A5 (de) |
WO (1) | WO2020079118A1 (de) |
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WO2023222483A1 (en) * | 2022-05-18 | 2023-11-23 | Ams-Osram International Gmbh | Optoelectronic device and method for manufacturing an optoelectronic device |
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2019
- 2019-10-17 WO PCT/EP2019/078153 patent/WO2020079118A1/de active Application Filing
- 2019-10-17 US US17/285,244 patent/US12009633B2/en active Active
- 2019-10-17 CN CN201980068637.5A patent/CN112868146B/zh active Active
- 2019-10-17 DE DE112019005205.5T patent/DE112019005205A5/de active Pending
- 2019-10-17 JP JP2021515635A patent/JP7124214B2/ja active Active
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Also Published As
Publication number | Publication date |
---|---|
JP2022503768A (ja) | 2022-01-12 |
JP7124214B2 (ja) | 2022-08-23 |
CN112868146A (zh) | 2021-05-28 |
US20210376562A1 (en) | 2021-12-02 |
DE112019005205A5 (de) | 2021-07-01 |
CN112868146B (zh) | 2024-06-04 |
US12009633B2 (en) | 2024-06-11 |
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