WO2020075487A1 - Sensor - Google Patents

Sensor Download PDF

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Publication number
WO2020075487A1
WO2020075487A1 PCT/JP2019/037270 JP2019037270W WO2020075487A1 WO 2020075487 A1 WO2020075487 A1 WO 2020075487A1 JP 2019037270 W JP2019037270 W JP 2019037270W WO 2020075487 A1 WO2020075487 A1 WO 2020075487A1
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WO
WIPO (PCT)
Prior art keywords
sensor
opening
heat
substrate
housing
Prior art date
Application number
PCT/JP2019/037270
Other languages
French (fr)
Japanese (ja)
Inventor
康洋 森
橋本　裕介
智宏 上津
室　直樹
香菜 大井
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2019111538A external-priority patent/JP2020061122A/en
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to EP19871633.4A priority Critical patent/EP3866130A4/en
Publication of WO2020075487A1 publication Critical patent/WO2020075487A1/en

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    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B17/00—Fire alarms; Alarms responsive to explosion
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B17/00—Fire alarms; Alarms responsive to explosion
    • G08B17/06—Electric actuation of the alarm, e.g. using a thermally-operated switch
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B17/00—Fire alarms; Alarms responsive to explosion
    • G08B17/10—Actuation by presence of smoke or gases, e.g. automatic alarm devices for analysing flowing fluid materials by the use of optical means
    • G08B17/103—Actuation by presence of smoke or gases, e.g. automatic alarm devices for analysing flowing fluid materials by the use of optical means using a light emitting and receiving device

Definitions

  • the present disclosure relates generally to sensors, and more particularly to sensors that sense heat generated by, for example, a fire.
  • the sensor includes a heat sensing unit that senses heat and a smoke sensing unit that senses smoke that has flowed into the dark box.
  • the heat sensing means includes a lead wire connected to the circuit board and protruding upward from the circuit board, and a heat sensitive element such as a thermistor provided on an upper end of the lead wire.
  • the present disclosure has been made in view of the above circumstances, and an object thereof is to provide a sensor that can be downsized.
  • a sensor includes a substrate, a heat detection element, and a housing.
  • the housing accommodates the substrate.
  • the housing has a flow path that is provided in the internal space and through which gas flows, and an opening that connects the flow path and the external space of the housing.
  • the heat detecting element is a chip thermistor mounted on the substrate and detecting heat of the gas flowing from the opening.
  • FIG. 1 is a cross-sectional view of the sensor according to the first embodiment.
  • FIG. 2 is a perspective view of the above sensor seen from below.
  • FIG. 3A is a partially transparent plan view of the above sensor.
  • FIG. 3B is an enlarged plan view of a main part in FIG. 3A.
  • FIG. 4 is a schematic block configuration diagram of the above-mentioned sensor.
  • FIG. 5 is an enlarged view of the opening of the above-mentioned sensor as viewed from the front.
  • FIG. 6 is a schematic cross-sectional view of Modification 1 of the above sensor.
  • FIG. 7: is a schematic sectional drawing of the modification 2 in a sensor same as the above.
  • FIG. 8A is a perspective view of a modified example 3 of the sensor of the above, viewed from below.
  • FIG. 8B is a partially transparent plan view of Modification 3 of the above.
  • FIG. 9A is a perspective view of a modified example 4 of the sensor of the above when viewed from below.
  • FIG. 9B is a partially transparent plan view of Modification 4 of the above.
  • FIG. 10A is a perspective view of a modified example 5 of the sensor of the above when viewed from below.
  • FIG. 10B is a partially transparent plan view of Modification 5 of the above.
  • FIG. 11 is a perspective view of another modified example of the above-mentioned sensor as viewed from below.
  • FIG. 12A is a side view of a main part of the sensor according to the second embodiment.
  • FIG. 12B is a cross-sectional view of a main part of the sensor of the same taken along the horizontal direction.
  • FIG. 12A is a side view of a main part of the sensor according to the second embodiment.
  • FIG. 12B is a cross-sectional view of a main part of the sensor of the same
  • FIG. 13A is a side view of a main part of Modification 1 of the sensor of the above.
  • FIG. 13B is a cross-sectional view of a main part of Modification 1 of the above, taken along the horizontal direction.
  • FIG. 13C is a cross-sectional view of a main part of another example of the first modified example cut along the horizontal direction.
  • FIG. 14A is a side view of an essential part of a second modification of the above sensor.
  • FIG. 14B is a cross-sectional view of a main portion of Modification 2 of the above, taken along the horizontal direction.
  • FIG. 14C is a perspective view of a main part of the second modified example.
  • FIG. 15: is a disassembled perspective view of the principal part of the modification 2 same as the above.
  • FIG. 15 is a disassembled perspective view of the principal part of the modification 2 same as the above.
  • FIG. 16 is a side view of the principal part of the modification 3 in a sensor same as the above.
  • FIG. 17A is a side view of the essential parts of Modification 4 of the above sensor.
  • FIG. 17B is a cross-sectional view of a main part of Modification 4 of the above, taken along the horizontal direction.
  • FIG. 18A is a perspective view of the sensor according to the third embodiment viewed from below.
  • FIG. 18B is a partially transparent plan view of the above sensor.
  • FIG. 18C is a cross-sectional view of the main part taken along the vertical direction near the inflow port of the above sensor.
  • FIG. 19A is a diagram showing a state in which a sensor is installed on a structure and a heating inspection is performed using a tester.
  • FIG. 19B is a schematic cross-sectional view of the tester in a state in which the above-mentioned sensor is covered with the tester.
  • FIG. 20 is a perspective view of a modified example of the above-mentioned sensor as seen from below.
  • FIG. 21A is a perspective view showing a state in which the main body of the sensor according to the fourth embodiment is directly mounted on the structure using the mounting base.
  • FIG. 21B is an exploded perspective view of the main body of the sensor and the mounting base of the same.
  • FIG. 22A is a perspective view showing a state in which the main body of the above sensor is embedded and installed in a structure using an embedded base.
  • FIG. 22B is an exploded perspective view of the main body of the sensor and the embedded base of the same.
  • FIG. 23A is a partial cross-sectional view schematically showing how the embedded base of the above is attached to a structure by using the first attachment fitting.
  • FIG. 23B is a partial cross-sectional view schematically showing how the embedded base of the same is attached to the structure using the second attachment fitting.
  • the detector 1 of the present embodiment is, for example, a fire detector, and includes a heat detecting element 30 that detects heat generated by a fire or the like.
  • the sensor 1 is a sensor that has at least the function of detecting heat.
  • the detector 1 is a so-called combined fire detector further including a smoke detector 4 (see FIG. 1) (see FIGS. 1 to 5).
  • the sensor 1 may include a detection unit that detects CO (carbon monoxide) generation due to flame, gas leakage, or incomplete combustion, instead of the smoke detection unit 4, or in addition to the smoke detection unit 4. Good.
  • the senor 1 is installed on a structure X1 (ceiling in the illustrated example) which is a construction material such as a ceiling or a wall of a building.
  • a structure X1 (ceiling in the illustrated example) which is a construction material such as a ceiling or a wall of a building.
  • the senor 1 includes a substrate 2, one or more heat detection elements 30, and a housing 5.
  • the sensor 1 includes four heat detection elements 30.
  • the housing 5 houses the substrate 2. As shown in FIG. 1, the housing 5 has a flow path 6 that is provided in the internal space SP1 and through which gas flows, and an opening 7 that connects the flow path 6 and the external space SP2 of the housing 5. ing. In FIG. 1, in order to facilitate understanding of the flow of gas, the flow path 6 is schematically shown by an arrow line, but the void portion around the smoke detection unit 4 in the internal space SP1 is generally in the flow path 6 Can correspond to. Further, here, as an example, the housing 5 has six openings 7 (only three are shown in FIG. 2).
  • the heat detecting element 30 in the present embodiment is a chip thermistor which is mounted on the substrate 2 and detects the heat of the gas flowing in from the opening 7, as shown in FIG.
  • the heat detecting element 30 is a chip thermistor mounted on the substrate 2, for example, as compared with the configuration in which the heat sensitive element in Patent Document 1 is provided at the upper end of the lead wire, the entire sensor 1 is provided. Can be miniaturized (particularly thin).
  • the detector 1 is a so-called combined fire detector that detects heat and smoke.
  • the sensor 1 includes the heat detection unit 3 having the four heat detection elements 30 described above.
  • the sensor 1 further includes a display unit 8 and a control unit 9 (see FIG. 4) in addition to the substrate 2, the heat detection unit 3, the smoke detection unit 4, and the housing 5.
  • the sensor 1 also includes a mounting portion 10 for mounting on the structure X1 (see FIG. 1).
  • FIG. 1 the illustration of a mounting structure (for example, a disc-shaped mounting base) on the side of the structure X1 to which the mounting portion 10 is fixed is omitted.
  • the sensor 1 is detachably attached to the attachment base fixed to the structure X1.
  • the detector 1 includes a communication unit 11 that transmits a signal informing the occurrence of a fire to an external alarm device (not shown) when a fire is detected and receives a signal from the alarm device. .
  • the sensor 1 may be supplied with power from a commercial power supply, or may be supplied with power from a battery provided inside the housing 5.
  • the housing 5 includes the substrate 2, the heat detection unit 3, the smoke detection unit 4, the light source 81 of the display unit 8, the control unit 9, the communication unit 11, and other circuit modules inside. Accommodate.
  • the housing 5 also supports one surface of the guide portion 82 of the display unit 8 so as to be exposed to the outside (see FIG. 2).
  • the housing 5 is made of synthetic resin, for example, flame-retardant ABS resin.
  • the housing 5 is formed in a generally flat cylindrical shape in the vertical direction. As shown in FIG. 1, the housing 5 has a cylindrical front cover 51 whose one surface (upper surface in the illustrated example) is open, and a disk-shaped back cover 52.
  • the housing 5 has an installation surface 55 (see FIG. 1) facing the structure X1 to which the sensor 1 is attached.
  • one surface (upper surface) of the back cover 52 corresponds to the installation surface 55.
  • the housing 5 is configured by assembling the back cover 52 from the open one surface side of the front cover 51.
  • the housing 5 has six side surface openings (lateral holes) as six openings 7 that connect the flow path 6 and the external space SP2, which are provided in the internal space SP1 and through which gas flows. 7A.
  • the opening 7 has the side opening 7A.
  • the number of openings 7 is not particularly limited, it is preferable that two or more openings 7 are provided in consideration of the inflow and outflow of gas to and from the housing 5.
  • the front cover 51 includes a flat cylindrical body 510 whose upper and lower ends are open, and a disc-shaped base 511 below the cylindrical body 510. It is composed of a plurality of (for example, 6) crosspieces 512 connecting the cylindrical body 510 and the base 511.
  • the cylindrical body 510, the base 511, and the six crosspieces 512 are integrally formed.
  • the six crosspieces 512 are arranged in the peripheral portion of the base 511 at substantially equal intervals along the circumferential direction, and project from the peripheral portion toward the open lower edge of the cylindrical body 510.
  • the six crosspieces 512 keep the distance between the cylindrical body 510 and the base 511 at a specified distance.
  • the six openings 7 are arranged at substantially equal intervals along the circumferential direction on the circumferential wall of the front cover 51 thus configured.
  • Each opening 7 is a substantially rectangular through hole that radially penetrates the peripheral wall of the front cover 51, and serves as an opening that connects the flow path 6 and the external space SP2.
  • the front cover 51 has a positioning structure for positioning the substrate 2 on the upper surface side of the base 511.
  • a recess for positioning may be provided on the upper surface side of the base portion 511, and a claw piece protruding from the substrate 2 may be fitted into the recess.
  • the base portion 511 has a diameter dimension slightly larger than that of the substrate 2.
  • the front cover 51 has a pair of holes 513 (see FIG. 3A) in the base 511 for exposing one surface (lower surface) of the guide portion 82 of the display unit 8 to the external space SP2.
  • the pair of holes 513 are located near the peripheral edge of the base 511 when the base 511 is viewed from below.
  • the pair of holes 513 are arranged at equal intervals in the circumferential direction of the base 511. In other words, the pair of holes 513 are arranged so that an imaginary line connecting them substantially passes through the center of the base 511.
  • the arrangement direction of the pair of holes 513 corresponds to the front-back direction in the present disclosure.
  • Each hole 513 penetrates the base 511 in its thickness direction (vertical direction).
  • the opening of each hole 513 has a substantially rectangular shape.
  • a corresponding guide portion 82 is fitted into each hole portion 513. Therefore, the light emitted from the pair of light sources 81 is led out of the housing 5 through the pair of guide portions 82, respectively.
  • the back cover 52 has a plurality of fitting holes 520 into which the plurality (for example, four) of the connection pieces 101 of the mounting portion 10 fixed to the substrate 2 are fitted (see FIG. 1).
  • the plurality of connection pieces 101 are electrically connected to the circuit module provided on the substrate 2.
  • the plurality of connection pieces 101 are inserted to such an extent that the tips of the connection pieces 101 project sufficiently from the back surface side (the installation surface 55 side) of the back cover 52.
  • the plurality of connecting pieces 101 can be mechanically and electrically connected to a contact portion of a mounting base (not shown) fixed to the structure X1.
  • the mounting portion 10 is not only mechanically connected to the mounting base, but is also electrically connected to the electric wires (the power supply line and the signal line) on the back side of the structure X1, and the substrate 2 is connected to the back cover 52. It is a part that also functions as stable positioning. This positioning includes not only radial positioning of the substrate 2 but also vertical positioning of the substrate 2.
  • the back cover 52 has a housing recess 521 (see FIG. 1) for housing the upper portion of the smoke detection unit 4 mounted on the board 2 on one surface (lower surface) facing the board 2. That is, the smoke detector 4 is stably positioned by the housing recess 521.
  • the back cover 52 has a plurality of control plates (walls) 522 (see FIG. 3A: four in the illustrated example) for controlling the flow of gas in the flow path 6 on one surface (lower surface) facing the substrate 2.
  • Each control plate 522 is formed in a substantially arc shape when viewed from the substrate 2 side.
  • Each control plate 522 projects in a direction (downward) approaching the base portion 511 of the front cover 51.
  • the four control plates 522 are arranged at substantially equal intervals along the circumferential direction of the back cover 52 in the vicinity of the peripheral edge of the back cover 52 when viewed from the substrate 2 side.
  • the four control plates 522 control (guide) the airflow so that the gas flowing through the flow path 6 in the internal space SP1 of the housing 5 is more likely to flow toward the heat detection element 30 or the smoke detection unit 4.
  • the number of control plates 522 is not particularly limited and may be one.
  • the substrate 2 is a printed circuit board.
  • the board 2 is mounted with a heat detection unit 3, a smoke detection unit 4, a display unit 8, a control unit 9, a communication unit 11, and other circuit modules (not shown).
  • the other circuit modules include a lighting circuit that lights the light source 81 of the display unit 8 and the optical element 41 of the smoke detection unit 4, and a power supply that generates operating power of various circuits by using power supplied from a commercial power supply or the like. Including circuits etc.
  • FIG. 3A is a plan view of a part (the substrate 2, the control plate 522, and the smoke detection unit 4) seen through from the lower side of the sensor 1 and is transparent.
  • At least four heat detection elements 30 of the heat detection unit 3 are surface-mounted on the first surface 21 (front surface) of the substrate 2.
  • the first surface 21 is an upper surface (see FIG. 1).
  • the smoke detection unit 4 is also arranged on the same plane side as the first surface 21 of the substrate 2.
  • the smoke detector 4 is mounted on the first surface 21 of the substrate 2.
  • the labyrinth portion 43 (described later) of the smoke detector 4 has an engaging claw on the lower surface of its bottom, and the engaging claw engages with an engaging hole formed in the substrate 2 to fix it. Has been done.
  • the light source 81 of the display unit 8 is also mounted on the first surface 21 of the substrate 2.
  • the control unit 9 and a plurality of electronic components forming the circuit module are mounted on the first surface 21 or the second surface 22 of the substrate 2.
  • the control unit 9 and the plurality of electronic components configuring the circuit module may not be mounted only on the substrate 2, and for example, another mounting substrate may be arranged around the substrate 2 and the mounting substrate may include: Some or all of them may be implemented.
  • the surface opposite to the first surface 21 (upper surface) of the substrate 2 may be referred to as the second surface 22 (lower surface).
  • the substrate 2 is transparent and its second surface 22 is visible.
  • the heat detection element 30, the light source 81, and the smoke detection unit 4 are actually mounted on the first surface 21 on the back side of the second surface 22, but for convenience of description, these are also shown in perspective in FIG. 3A. Shows.
  • the optical element 41 and the light receiving element 42 arranged in the labyrinth portion 43 of the smoke detecting portion 4 are illustrated by being simplified by dots.
  • the first surface 21 of the first surface 21 and the second surface 22 corresponds to the surface closer to the installation surface 55. Therefore, it can be said that the heat detection element 30 and the smoke detection unit 4 are both arranged on the surface of the substrate 2 on the side close to the installation surface 55.
  • the substrate 2 has a circular main body portion 200, and a plurality of (eight in the illustrated example) extending portions that extend in a direction away from the center of the main body portion 200 at the edges of the main body portion 200. have.
  • the eight extended portions will be referred to as a pair of first extended portions 201, a pair of second extended portions 202, a pair of third extended portions 203, and a pair of fourth extended portions 204.
  • the smoke detector 4 is arranged on the upper surface of the main body 200.
  • the four heat detecting elements 30 and the two light sources 81 are arranged in the six extending portions (201, 202, 203), respectively.
  • the pair of first extending portions 201 extend from the left and right edges of the main body portion 200 in directions away from each other.
  • One corresponding connecting piece 101 is arranged on the upper surface of each first extending portion 201.
  • each of the first extending portions 201 has a narrower piece portion Y1 at the tip thereof.
  • One corresponding heat detection element 30 is arranged on the upper surface of each small piece portion Y1.
  • the pair of second extending portions 202 extend from the front and rear edges of the main body portion 200 in directions away from each other.
  • the extension amount of the second extension portion 202 is smaller than the extension amounts of the other extension portions.
  • One corresponding light source 81 is arranged on the upper surface of each second extending portion 202.
  • the pair of third extending portions 203 respectively extend away from each other from positions slightly offset in the counterclockwise direction from the front and rear edges of the main body portion 200 when viewed from the lower side of the substrate 2.
  • the third extension portion 203 on the front side is disposed on the left side of the second extension portion 202 on the front side
  • the third extension portion 203 on the rear side is the second extension portion 202 on the rear side. It is located on the right side of.
  • each of the third extending portions 203 also has a narrower piece portion Y1 at the tip thereof.
  • One corresponding heat detection element 30 is arranged on the upper surface of each small piece portion Y1.
  • the pair of fourth extending portions 204 extend in directions away from each other from positions slightly offset from the front and rear edges of the main body portion 200 in the clockwise direction when viewed from the lower side of the substrate 2.
  • the fourth extension portion 204 on the front side is disposed on the right side of the second extension portion 202 on the front side
  • the fourth extension portion 204 on the rear side is the second extension portion 202 on the rear side. It is located to the left of.
  • One corresponding connecting piece 101 is arranged on the upper surface of each fourth extending portion 204.
  • the substrate 2 has, for example, a two-fold symmetric shape that is symmetrical by rotating the center of the substrate 2 by 180 degrees.
  • FIG. 3B is an enlarged view of a circle portion surrounded by a dotted line (imaginary line) in FIG. 3A as an example.
  • the through hole 31 is arranged inside the heat detection element 30 (on the side of the center of the internal space SP1).
  • the heat detecting element 30 and the through hole 31 are arranged adjacent to each other.
  • the through hole 31 improves the thermal insulation property.
  • the opening area of the through hole 31 is preferably larger than the surface area of the heat detecting element 30 (for example, the surface area viewed from the upper side of the substrate 2).
  • the heat detection section 3 has the four heat detection elements 30 mounted on the first surface 21 of the substrate 2 as described above (one in FIG. 4). Only shown).
  • the number of heat detecting elements 30 is not particularly limited, and may be one, but it is preferable that the number is at least two.
  • the heat detecting element 30 in the present embodiment is a chip thermistor that detects the heat of the gas flowing from the opening 7, and is surface-mounted on the substrate 2.
  • Each heat detection element 30 is arranged so as to face one opening 7 different from the other. The positional relationship of the heat detecting element 30 with respect to the flow path 6 and the opening 7 will be described in detail later in the section “(2.7) Arrangement structure of heat detecting section”.
  • the heat detection unit 3 is electrically connected to the control unit 9 via a pattern wiring or the like formed on the substrate 2.
  • Each heat detection element 30 outputs an electric signal (detection signal) to the control unit 9.
  • the control unit 9 monitors the resistance value of each heat detection element 30 that can change depending on the temperature rise, through the electric signal output from each heat detection element 30.
  • the heat detection unit 3 may further include, in addition to the heat detection element 30, an amplification circuit that amplifies an electric signal from the heat detection element 30, a conversion circuit that performs analog-digital conversion, or the like. , May be performed on the circuit module side.
  • the smoke detector 4 is arranged in the center of the internal space SP1 and is configured to detect smoke. Specifically, the smoke detector 4 is arranged on the upper surface of the main body 200 of the substrate 2, and the upper portion thereof is housed in the housing recess 521 of the back cover 52.
  • the smoke detection unit 4 is, for example, a photoelectric sensor that detects smoke. As shown in FIG. 4, the smoke detection unit 4 includes an optical element 41 that emits light, a light receiving element 42 that receives the light emitted from the optical element 41, and a labyrinth portion 43.
  • the optical element 41 is, for example, an LED (Light Emitting Diode).
  • the light receiving element 42 is, for example, a photodiode.
  • the labyrinth portion 43 is formed inside a case having a flat and substantially cylindrical outer shell.
  • the case of the smoke detector 4 has a plurality of ports for introducing gas into the labyrinth portion 43 on the outer peripheral surface thereof, and has a structure for suppressing outside light from entering the inside.
  • the optical element 41 and the light receiving element 42 are arranged in the labyrinth portion 43 so as not to face each other.
  • the light receiving surface of the light receiving element 42 is arranged so as to be off the optical axis C1 (see FIG. 3A) of the irradiation light of the optical element 41.
  • smoke may enter the casing 5 through the opening 7 of the casing 5 and be introduced into the labyrinth portion 43.
  • the irradiation light of the optical element 41 hardly reaches the light receiving surface of the light receiving element 42.
  • the irradiation light of the optical element 41 is scattered by the smoke, and a part of the scattered light reaches the light receiving surface of the light receiving element 42. That is, in the smoke detector 4, the light receiving element 42 receives the irradiation light of the optical element 41 scattered by the smoke.
  • the light receiving element 42 of the smoke detector 4 is electrically connected to the controller 9.
  • the smoke detection unit 4 transmits to the control unit 9 an electric signal (detection signal) indicating a voltage level corresponding to the amount of light received by the light receiving element 42.
  • the control unit 9 converts the light amount of the detection signal received from the smoke detection unit 4 into smoke density and determines a fire.
  • the control unit 9 may use the light amount as it is for the threshold determination.
  • the smoke detection unit 4 may convert the amount of light received by the light receiving element 42 into smoke concentration, and then transmit a detection signal indicating a voltage level corresponding to the smoke concentration to the control unit 9.
  • the smoke detection unit 4 may further include an amplifier circuit that amplifies the electric signal from the light receiving element 42, a conversion circuit that performs analog-digital conversion, or the like, or the amplification and conversion is performed on the circuit module side. Good.
  • the number of optical elements 41 for smoke detection is not limited to one, and may be plural.
  • the display unit 8 has a pair of light sources 81 and a pair of guides 82.
  • Each light source 81 is configured as, for example, a package type LED in which at least one LED chip is mounted in the center of the mounting surface of a flat mounting substrate.
  • Each light source 81 is mounted on the substrate 2 as described above.
  • Each guide portion 82 is a light-transmitting portion formed in a substantially L shape.
  • Each of the guide portions 82 faces the corresponding light source 81 on the substrate 2 and has an incident surface on which the light emitted from the light source 81 is incident.
  • Each guide portion 82 has an emission surface through which the light incident from the incident surface is emitted to the outside of the guide portion 82. The emission surface of each guide portion 82 is exposed through the corresponding hole portion 513 of the front cover 51.
  • the display unit 8 is an operating light that notifies the operating state of the sensor 1 to the outside. Under normal conditions (when monitoring a fire), the lighting circuit of the circuit module turns off the light source 81 under the control of the control unit 9. When it is determined that a fire has occurred, the lighting circuit of the circuit module starts blinking or lighting of the light source 81 under the control of the control unit 9. In FIG. 4, the lighting circuit between the control unit 9 and the display unit 8 is omitted.
  • the control unit 9 is composed of, for example, a microcontroller (CPU) having a CPU (Central Processing Unit) and a memory as main components.
  • the control unit 9 is realized by a computer having a CPU and a memory, and the computer functions as the control unit 9 when the CPU executes the program stored in the memory.
  • the program is recorded in the memory here in advance, but may be provided through an electric communication line such as the Internet or in a non-transitory recording medium such as a memory card.
  • the control unit 9 is configured to control the communication unit 11 and the circuit module (lighting circuit, power supply circuit, etc.).
  • the control unit 9 is also configured to receive detection signals from the heat detection unit 3 and the smoke detection unit 4 and determine whether a fire has occurred. Specifically, the control unit 9 individually monitors the detection signals from the four heat detection elements 30 of the heat detection unit 3, and the signal level (corresponding to the resistance value) included in the detection signals exceeds the threshold value. When even one (or lower) heat detecting element 30 is found, it is determined that a fire has occurred. The control unit 9 also monitors the detection signal from the smoke detection unit 4, and if the signal level included in the detection signal (corresponding to the amount of light received by the light receiving element 42 or the smoke concentration) exceeds a threshold value, a fire will occur. Determine what has occurred.
  • the control unit 9 determines that a fire has occurred based on the heat detection or the smoke detection, the control unit 9 sends a signal indicating the occurrence of the fire via the communication unit 11 to the receiver of the automatic fire notification system and the fire. Send to an alarm device.
  • the communication unit 11 is a communication interface for communicating with a receiver, a fire alarm device, and the like by wire, for example.
  • the communication unit 11 is communicably connected to a receiver, a fire alarm device, and the like through the connection piece 101 of the mounting unit 10, the connector unit of the mounting base, and the signal line wired on the back side of the structure X1. ing.
  • the control unit 9 determines that a fire has occurred, it outputs a control signal for blinking or lighting the light source 81 of the display unit 8 (operation lamp) to the lighting circuit of the circuit module.
  • the heat detection element 30 of the heat detection unit 3 is a chip thermistor mounted on the first surface 21 of the substrate 2. Therefore, the sensor 1 as a whole can be downsized (particularly thin). Further, the cost of the thermistor itself and the mounting cost thereof can be suppressed to be lower than those of the lead type thermistor.
  • the smoke detector 4 is arranged in the center of the first surface 21, and the smoke detector 4 substantially occupies the center of the internal space SP1 of the housing 5.
  • the flow path 6 substantially corresponds to the space around the central portion (smoke detection unit 4) of the internal space SP1. In other words, the flow path 6 has a generally donut shape. Therefore, in the present embodiment, the entire peripheral area of the first surface 21 of the substrate 2 other than the mounting area of the smoke detector 4 is exposed in the flow path 6.
  • the peripheral area also includes the upper surfaces of the above-mentioned eight extending portions (201 to 204) in total.
  • the four thermal detection elements 30 in the first extending portion 201 and the third extending portion 203 are connected to the chip thermistor. However, the possibility of being exposed to the gas flowing through the flow path 6 can be further increased.
  • the heat detection element 30 detects heat at a temperature corresponding to a fire, and the detector 1 can quickly determine that a fire has occurred.
  • the sensor 1 can be downsized while further improving the heat detection performance of the sensor 1.
  • the sensor 1 of the present embodiment further includes a smoke detection unit 4, and the smoke detection unit 4 is located at the center of the internal space SP1 behind the flow path 6.
  • the flow path 6 is a common flow path through which heat and smoke can pass. Therefore, if the gas introduced into the housing 5 through the plurality of openings 7 has a smoke concentration higher than the specified value, smoke can be detected. Therefore, it is possible to reduce the size of the detector 1 as a whole while improving the fire detection performance.
  • each heat detection element 30 which is a chip thermistor is arranged so as to face one opening 7 different from the other.
  • the heat detection element 30 on the left side is arranged to face one opening 7 on the left side
  • the heat detection element 30 on the right side faces another opening 7 on the right side. It is arranged to.
  • each heat detection element 30 is placed within the substantially rectangular opening area 70 when the opening area 70 (see FIGS. 1 and 5) of the corresponding opening 7 is viewed from the external space SP2 side. It is located in.
  • each heat detection element 30 is arranged so as to be within the opening region 70 when the heat detection element 30 is viewed along the normal direction of the cylindrical body 510 of the housing 5.
  • the area of the heat detection element 30 projected onto the opening area 70 is contained in the opening area 70. Therefore, as compared with the case where at least a part of the heat detecting element 30 is arranged so as to be hidden outside the opening region 70, that is, behind the cylindrical body 510 of the housing 5 or the back side of the crosspiece 512, the heat detecting element 30 is not exposed from the opening 7. The possibility of being exposed to the gas that has entered can be increased.
  • each heat detection element 30 which is a chip thermistor has the first surface 21 within the opening area 70 when the opening area 70 is viewed from the external space SP2 side. It is located at the center of the opening region 70 in the orthogonal direction (vertical direction). In other words, the positional relationship between the opening 7 and the substrate 2 is defined so that each heat detecting element 30 is located at the center of the opening region 70. This positional relationship depends on, for example, the protrusion amount of the rib 514 (see FIG. 1) protruding from the back side of the base portion 511 of the front cover 51 and in contact with the substrate 2 and the insertion amount of the connection piece 101 of the mounting portion 10. Adjusted.
  • the heat detecting element 30 is exposed to the gas entering from the opening 7 as compared with the case where the heat detecting element 30 is positioned near one end (closer to the upper end or closer to the lower end) of the opening region 70. It is possible to further increase the possibility.
  • each heat detection element 30 is arranged not in the side of the smoke detection section 4 but in the vicinity of the opening 7.
  • the chip thermistor Each heat detecting element 30 is in the first path 61 (see FIG. 1). Therefore, as compared with the case where the chip thermistor is in the second path 62, for example, it is possible to improve the responsiveness regarding the heat detection in the sensor 1.
  • the flow path 6 is schematically illustrated by the arrow line in FIG. 1, but in reality, the first path 61 is a void portion around the smoke detection unit 4 in the internal space SP1.
  • the second path 62 corresponds to the inner half of the void portion.
  • the center P1 of the internal space of the labyrinth portion 43 is preferably located between the thermal detection element 30 which is a chip thermistor and the installation surface 55 in the vertical direction (FIG. 1).
  • the heat detecting element 30 is below the center P1 in the vertical direction.
  • the optical element 41 and the light receiving element 42 arranged in the labyrinth portion 43 are schematically illustrated by dots.
  • the heights of the optical element 41 and the light receiving element 42 are the same as each other, and the intersection of the optical axis C1 of the optical element 41 and the optical axis C2 of the light receiving element 42 substantially coincides with the center P1 as an example. To do.
  • the height positions of the optical element 41 and the light receiving element 42 and the directions of the optical axes C1 and C2 are not particularly limited as long as the optical axis C1 does not intersect the light receiving surface of the light receiving element 42.
  • the height of either the optical element 41 or the light receiving element 42 may be lower than the height of the other.
  • the optical axis C1 and the optical axis C2 may not intersect with each other. In this case, the midpoint between the optical axis C1 and the optical axis C2 when viewed from the side of the smoke detection unit 4 may substantially coincide with the center P1.
  • the center P1 is between the heat detecting element 30 and the installation surface 55, an ascending air current is generated when a gas having heat flows through the flow path 6 in the housing 5.
  • the smoke (gas) that has passed through the heat detection element 30 can be effectively guided to the smoke detection unit 4. Therefore, in the sensor 1 that detects not only heat but also smoke, the size of the sensor 1 as a whole can be reduced while further improving the fire detection performance.
  • the control unit 9 of the sensor 1 according to the present disclosure includes a computer system.
  • the computer system mainly has a processor and a memory as hardware.
  • the function as the control unit 9 of the sensor 1 according to the present disclosure is realized by the processor executing the program recorded in the memory of the computer system.
  • the program may be pre-recorded in the memory of the computer system, may be provided through an electric communication line, or may be recorded in a non-transitory recording medium such as a memory card, an optical disk, a hard disk drive, which can be read by the computer system. May be provided.
  • a processor of a computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI).
  • the integrated circuit such as an IC or an LSI referred to here has a different name depending on the degree of integration, and includes an integrated circuit called a system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration).
  • FPGAs Field-Programmable Gate Arrays
  • the plurality of electronic circuits may be integrated on one chip, or may be provided separately on a plurality of chips.
  • the plurality of chips may be integrated in one device, or may be provided separately in a plurality of devices.
  • the computer system includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.
  • the plurality of functions of the control unit 9 of the sensor 1 are integrated in one housing, and the constituent elements of the sensor 1 are distributed in the plurality of housings. It may be provided. Furthermore, at least a part of the functions of the sensor 1, for example, a part of the functions of the sensor 1 may be realized by a cloud (cloud computing) or the like. On the contrary, as in the basic example, the plurality of functions of the sensor 1 may be integrated in one housing.
  • FIG. 6 shows a schematic cross-sectional view of the sensor 1A.
  • the sensor 1A differs from the basic example in that the airflow adjusting unit Z1 is provided in the internal space SP1.
  • the airflow adjusting unit Z1 extends from the lower edge of the cylindrical body 510 in the front cover 51 of the housing 5 toward the smoke detecting unit 4.
  • the airflow adjusting unit Z1 is a plate member having a substantially donut shape when viewed in the vertical direction.
  • the airflow adjusting unit Z1 may be formed integrally with the front cover 51, or may be a member separate from the front cover 51 and fixed to the front cover 51 by screwing or the like.
  • the airflow adjusting unit Z1 extends straight along the substrate 2 for a certain distance from the edge of the opening 7 into the housing 5. However, the airflow adjusting unit Z1 is inclined toward the installation surface 55 as it goes from the middle to the center of the internal space SP1.
  • the opening cross-sectional area of the first passage 61 when viewed along the direction connecting the opening 7 and the central portion of the internal space SP1 is , Smaller than the opening cross-sectional area of the second path 62. Therefore, the gas that has entered the flow path 6 through the opening 7 can be promoted to flow from the first path 61 having a narrow space toward the second path 62 having a wide space.
  • the airflow adjusting unit Z1 since the airflow adjusting unit Z1 is inclined in the direction of approaching the installation surface 55 from the middle, the second path 62 expands in the direction of approaching the installation surface 55 from the first path 61 toward the central portion. . Therefore, the smoke (gas) that has passed through the heat detecting element 30 can be effectively treated by the smoke detecting section against the characteristic that an ascending air current is generated when the gas having heat flows through the flow path 6 in the housing 5. You can lead to 4.
  • FIG. 7 shows a schematic cross-sectional view of the sensor 1B.
  • the sensor 1B differs from the basic example in that the smoke detection unit 4 is mounted on the second surface 22 of the substrate 2 instead of the first surface 21.
  • the heat detecting element 30 is mounted on the first surface 21 as in the basic example.
  • the front cover 51 has the housing recess 515 for housing the smoke detector 4.
  • the base portion 511 of the front cover 51 is formed such that the central portion thereof is convex downward.
  • the back cover 52 has an accommodating recess 521 for accommodating the upper portion of the smoke detecting section 4 (see FIG. 1).
  • the base 511 has a hole 5111 for introducing gas (smoke) into the housing 5 on the peripheral wall of the convex portion 5110.
  • the channel 6 is divided into two parts, an upper channel 6X and a lower channel 6Y, with the substrate 2 as a boundary.
  • the gas having heat passing through the upper flow path 6X passes through the heat detecting element 30.
  • a part of the gas passing through the lower flow path 6Y goes up to the upper flow path 6X through the through hole 31 (see FIG. 3B) of the substrate 2 and passes through the heat detecting element 30.
  • the rest of the gas passing through the lower flow path 6Y goes directly to the smoke detector 4 in the center.
  • FIG. 8A is a perspective view of the sensor 1C viewed from below
  • FIG. 8B is a plan view of a part (only the substrate 2) viewed from below of the sensor 1C.
  • the detector 1C is, for example, a P-type heat detector that transmits a fire signal to the outside by a so-called P-type (Proprietary-type) communication method.
  • the sensor 1C includes the heat detection unit 3 as in the basic example, but does not include the smoke detection unit 4 unlike the basic example. That is, the sensor 1C determines the occurrence of a fire or the like only by detecting heat.
  • the senor 1C differs from the basic example in that the number of heat detecting elements 30 is three (four in the basic example).
  • the substrate 2 of the sensor 1C has a substantially rhombic shape when the substrate 2 is viewed from below.
  • Two of the three heat detecting elements 30 are surface-mounted on the first surface 21 (upper surface) of the diamond-shaped substrate 2.
  • the two heat detection elements 30 are arranged at diagonal positions in the left-right direction on the first surface 21 (upper surface).
  • the substrate 2 has a pair of convex portions 23 protruding outward (having a slight inclination with respect to the left-right direction) at both edge portions at diagonal positions. .
  • a corresponding heat detecting element 30 is arranged on the upper surface of each convex portion 23.
  • the other heat detecting element 30 is arranged on the upper surface of the central portion of the substrate 2.
  • through holes 31 are provided in the vicinity of each heat detection element 30 in order to improve heat insulation.
  • two semicircular through holes 31 are arranged so as to sandwich the heat detecting element 30 therebetween.
  • the front cover 51 of the sensor 1C has one inflow port (vertical hole) 7B and two auxiliary ports (vertical hole) 56 at its base 511.
  • the two auxiliary ports 56 are arranged near both left and right edges of the base 511, and the inflow port 7B is arranged in the center of the base 511.
  • Each of the inflow port 7B and the two auxiliary ports 56 penetrates the base portion 511 of the front cover 51 in the thickness direction thereof.
  • the two auxiliary ports 56 near the left and right edges of the base 511 have a substantially crescent-shaped opening, and the inflow port 7B at the center of the base 511 has a substantially circular opening.
  • the pair of convex portions 23 of the substrate 2 face the two auxiliary ports 56 in a one-to-one correspondence, and the central portion of the substrate 2 faces the central inlet 7B.
  • the convex portion 23 and the central portion of the substrate 2 are respectively exposed from the two auxiliary ports 56 and the inflow port 7B, as shown in FIG. 8B. Therefore, the rising gas having heat enters the housing 5 through the two auxiliary ports 56 and the inflow port 7B, and further flows into the first surface 21 (upper surface) side through the through hole 31. Therefore, the heat detecting element 30 is easily exposed not only to the gas flowing in from the opening 7 (side opening 7A: lateral hole) but also to the gas flowing in from the two auxiliary openings 56 and the inflow opening 7B. .
  • FIGS. 9A and 9B Constituent elements that are substantially common to the sensor 1 of the basic example are denoted by the same reference numerals, and description thereof may be appropriately omitted.
  • FIG. 9A is a perspective view of the sensor 1D seen from below
  • FIG. 9B is a plan view partially (only the substrate 2) seen from below of the sensor 1D.
  • the detector 1D is, for example, an R-type heat detector that transmits a fire signal to the outside by a so-called R-type (Record-type) communication method.
  • the sensor 1D includes the heat detection unit 3 as in the basic example, but does not include the smoke detection unit 4 unlike the basic example. That is, the sensor 1D, like the sensor 1C of Modification 3, determines the occurrence of a fire or the like only by detecting heat.
  • the sensor 1D differs from the basic example in that the number of the heat detection elements 30 is five (four in the basic example).
  • the substrate 2 of the sensor 1D has a shape slightly similar to that of the substrate 2 of the basic example, as shown in FIG. 9B.
  • the substrate 2 of the sensor 1D has a circular main body 200, and a plurality of (six in the illustrated example) extending in a direction away from the center of the main body 200 at the edge of the main body 200. It has a protruding part.
  • the six extending portions are referred to as a pair of first extending portions 201, a pair of second extending portions 202, and a pair of third extending portions 203.
  • One of the five heat detecting elements 30 is arranged in the center of the main body 200, and the remaining four heat detecting elements 30 and the two light sources 81 are provided in the six extending portions (201, 202, 203). Each is arranged.
  • the pair of first extending portions 201 extend from the left and right edges of the main body portion 200 in directions away from each other.
  • Each of the first extending portions 201 has a narrower piece Y1 at the tip thereof.
  • One corresponding heat detection element 30 is arranged on the upper surface of each small piece portion Y1.
  • the pair of second extending portions 202 extend from the front and rear edges of the main body portion 200 in directions away from each other.
  • the extension amount of the second extension portion 202 is smaller than the extension amounts of the other extension portions.
  • One corresponding light source 81 is arranged on the upper surface of each second extending portion 202.
  • the pair of third extending portions 203 respectively extend away from each other from positions slightly offset in the counterclockwise direction from the front and rear edges of the main body portion 200 when viewed from the lower side of the substrate 2.
  • the third extension portion 203 on the front side is disposed on the left side of the second extension portion 202 on the front side
  • the third extension portion 203 on the rear side is the second extension portion 202 on the rear side. It is located on the right side of.
  • each of the third extending portions 203 also has a narrower piece portion Y1 at the tip thereof.
  • One corresponding heat detection element 30 is arranged on the upper surface of each small piece portion Y1.
  • the substrate 2 of the sensor 1D has, for example, a two-fold symmetric shape that is symmetric by rotating the center of the sensor 1D by 180 degrees about the axis.
  • through holes 31 are provided in the vicinity of each heat detection element 30 in order to improve heat insulation.
  • two semicircular through holes 31 are arranged so as to sandwich the heat detecting element 30 therebetween.
  • the pair of guide portions 82 of the display unit 8 are exposed on the front cover 51 of the sensor 1D.
  • the front cover 51 of the sensor 1D has one inflow port (vertical hole) 7B and two auxiliary ports (vertical hole) 57 at its base 511.
  • the two auxiliary ports 57 are arranged near both left and right edges of the base portion 511, and the inflow port 7B is arranged at the center of the base portion 511.
  • Each of the two auxiliary ports 57 and the inflow port 7B penetrates the base portion 511 of the front cover 51 in the thickness direction thereof.
  • the two auxiliary ports 57 near the left and right edges of the base 511 have a substantially rectangular opening, and the inflow port 7B at the center of the base 511 has a substantially circular opening.
  • the tip ends of the small piece portions Y1 of the pair of first extending portions 201 of the substrate 2 face the left and right auxiliary ports 57 in a one-to-one correspondence, and the central portion of the substrate 2 has a central inlet port. Face 7B.
  • the tip of the small piece portion Y1 and the central portion of the substrate 2 are exposed from the two auxiliary ports 57 and the inflow port 7B, respectively, as shown in FIG. 9B. Therefore, the rising gas having heat enters the housing 5 through the two auxiliary ports 57 and the inflow port 7B, and further flows into the first surface 21 (upper surface) side through the through hole 31. Therefore, the heat detecting element 30 is easily exposed not only to the gas flowing in from the opening 7 (side surface port 7A: lateral hole) but also to the gas flowing in from the two auxiliary ports 57 and the inflow port 7B. .
  • FIGS. 10A and 10B Constituent elements that are substantially common to the sensor 1 of the basic example are denoted by the same reference numerals, and description thereof may be appropriately omitted.
  • 10A is a perspective view of the sensor 1E seen from below
  • FIG. 10B is a plan view partially (only the substrate 2) seen from below of the sensor 1E.
  • the sensor 1E is, for example, a fire alarm that outputs a sound such as an alarm sound when a fire occurs.
  • the sensor 1E includes the heat detection unit 3 as in the basic example, but does not include the smoke detection unit 4 unlike the basic example. That is, the sensor 1E, like the sensor 1C of the modified example 3 and the sensor 1D of the modified example 4, determines the occurrence of a fire or the like only by detecting heat.
  • the senor 1E is different from the basic example in that it is equipped with a speaker that outputs a sound such as an alarm sound and an acoustic circuit.
  • the sensor 1E is, for example, a battery-type fire alarm. Therefore, the sensor 1E has a battery, a housing space for housing the battery, and the like. In the sensor 1E, the operation unit U1 is exposed on the front surface of the front cover 51.
  • the operation unit U1 receives an operation from the outside.
  • the operation unit U1 can be pushed upward by a pressing operation with a user's finger or the like.
  • the operation unit U1 is a disc-shaped member having a light-transmitting property.
  • the operation unit U1 is arranged so as to face the operation lamp in the housing 5. Further, the operation unit U1 is configured to press a push button switch in the housing 5 by a pressing operation. For example, if the operation unit U1 is pressed while the alarm sound is issued, the output of the alarm sound is stopped. Further, when the sensor 1E is operating or when the battery runs out, the operation unit U1 lights up. An operation test or the like can be executed by operating the operation unit U1.
  • the sensor 1E also differs from the basic example in that the number of heat detecting elements 30 is three (four in the basic example).
  • the substrate 2 of the sensor 1E has an inverted Y-shape when the substrate 2 is viewed from below, as shown in FIG. 10B.
  • a member having a relatively large volume such as a speaker, a battery, and an operation unit U1 is housed or supported in the housing 5. Therefore, in order to avoid them, the substrate 2 is space-saving. It has a Y shape.
  • the substrate 2 of the sensor 1 ⁇ / b> E has a circular main body portion 200 with a left side chipped off, and a plurality of edges (3 in the example shown in the drawing) extending from the center of the main body portion 200 at the edge of the main body portion 200. 3) has an extended portion.
  • the three extending portions will be referred to as extending pieces 205.
  • the three heat detecting elements 30 are arranged on the three extending pieces 205, respectively.
  • One of the three extension pieces 205 on the front side extends from the front edge of the main body 200, and one corresponding heat detection element 30 is arranged on the upper surface of the tip.
  • the two rearward extending pieces 205 extend from positions slightly displaced to the left and right from the rear edge of the main body section 200, and the corresponding two thermal pieces are provided on the upper surfaces of their tips.
  • the detection elements 30 are arranged respectively.
  • through holes 31 are provided in the vicinity of the inside of each heat detecting element 30 in order to improve the heat insulating property.
  • the front cover 51 of the sensor 1E has one auxiliary port (vertical hole) 58 at its base 511.
  • the auxiliary port 58 is arranged near the front edge of the base 511.
  • the auxiliary port 58 penetrates the base portion 511 of the front cover 51 in the thickness direction thereof.
  • the auxiliary port 58 has a substantially rectangular opening.
  • the tip of the extension piece 205 on the front side of the three extension pieces 205 faces the auxiliary opening 58.
  • the front end of the extension piece 205 on the front side is exposed from the auxiliary opening 58, as shown in FIG. 10B. Therefore, the rising gas having heat enters the housing 5 through the auxiliary port 58 and further flows into the first surface 21 (upper surface) side through the through hole 31. Therefore, the heat detecting element 30 is easily exposed not only to the gas flowing in from the opening 7 (side surface port 7A: lateral hole) but also to the gas flowing in from the auxiliary port 58.
  • the sensor 1 (composite fire sensor) of the basic example does not have a vertical hole in the front cover 51, unlike the modifications 3 to 5.
  • the detector 1 (composite fire detector) has one or more auxiliary ports (vertical holes) 59 (two in the illustrated example) in the front cover 51, as shown in FIG. One).
  • the heat detection element 30 is mounted on the first surface 21 (upper surface) of the substrate 2.
  • the heat detecting element 30 may be mounted on the second surface 22 (lower surface) of the substrate 2.
  • some of the plurality of heat detecting elements 30 may be separately mounted on the first surface 21 and the rest on the second surface 22.
  • both the heat detection element 30 and the smoke detection unit 4 may be mounted on the second surface 22 (lower surface) of the substrate 2.
  • the number of the through holes 31 adjacent to one heat detection element 30 is one, but as shown in the modified examples 3 and 4, it may be two or more.
  • a plurality of through holes 31 may be provided so as to surround the periphery of one heat detection element 30.
  • the heat detecting element 30 is mounted on the first surface 21 of the substrate 2, and the through holes 31 are arranged adjacent to each other.
  • the through holes 31 be arranged adjacent to each other.
  • the board 2 is composed of one printed board.
  • the board 2 may be divided into two or more printed boards.
  • the opening 7 is a lateral hole formed in the peripheral wall of the housing 5.
  • the opening 7 referred to in the present disclosure is not a horizontal hole, but an inflow port (vertical hole) 7B, auxiliary ports (vertical holes) 56 to 58 in Modifications 3 to 5, and the above-described auxiliary port (vertical hole) 59. May correspond to.
  • the sensor 1F according to the present embodiment is different from the sensors (1, 1A to 1E) according to the first embodiment (including modified examples) in that the sensor 1F further includes a shield portion V1.
  • the shielding part V1 of the present embodiment may be appropriately applied to the sensors (1, 1A to 1E) of the first embodiment.
  • the sensor 1F shown in FIGS. 12A and 12B is, as an example, a P-type heat sensor, similar to the sensor 1C (FIGS. 8A and 8B) of Modification 3 of the first embodiment.
  • the sensor 1F is a heat sensor that does not include the smoke detector 4 and determines the occurrence of a fire or the like only by detecting heat.
  • the heat detecting element 30 fits within the opening area 70 when the opening area 70 of the opening 7 (side opening 7A: lateral hole) is seen from the external space SP2 side. Is located in. Then, the shielding portion V1 is configured to shield a part of the opening region 70 on the external space SP2 side of the heat detection element 30 (chip thermistor).
  • the shielding part V1 has a pair of pillars V11.
  • the shielding part V1 is composed of a pair of columns V11.
  • Each pillar V11 is long along the vertical direction (here, for example, the thickness direction of the substrate 2).
  • Each pillar V11 is formed integrally with the front cover 51 of the housing 5. Specifically, the first end (upper end) of each pillar V11 is connected to the cylindrical body 510 of the housing 5, and the second end (lower end) of each pillar V11 is connected to the base 511. As a result, each pillar V11 extends from the upper edge to the lower edge of the opening 7 (side opening 7A).
  • the pair of pillars V11 have a predetermined distance L1 in the direction D1 (here, the left-right direction) orthogonal to the arrangement direction of the back cover 52 and the front cover 51 when the opening region 70 is viewed from the side of the external space SP2. Will be placed.
  • the back cover 52 corresponds to the first cover and the front cover 51 corresponds to the second cover.
  • the back cover 52 corresponds to the second cover and the front cover 51 corresponds to the second cover. It may correspond to the first cover.
  • the predetermined distance L1 is a distance defined so that the test finger does not enter.
  • the test finger is, for example, a pseudo finger defined in Appendix 41 (2) C of Appendix 4 of the Electrical Appliance and Material Safety Law of Japan.
  • the heat detection element 30 is arranged between the pair of pillars V11 in the direction D1 when the opening region 70 is viewed from the side of the external space SP2 (see FIG. 12A). In other words, the heat detecting element 30 is exposed from between the pair of pillars V11.
  • the senor 1F further includes the shielding portion V1 to prevent the heat inflow from the opening 7 from being hindered, and unintentionally, for example, a finger or a tool of a person comes into contact with the chip thermistor. The possibility can be reduced.
  • each pillar V11 has a guide surface V2 for guiding the airflow from the external space SP2 toward the heat detection element 30 (chip thermistor), as shown in FIG. 12B.
  • each pillar V11 has a substantially semi-elliptical cross-section taken along the horizontal direction, and its curved surface corresponds to the guide surface V2.
  • the tip of the semi-elliptical shape faces the heat detection element 30. Therefore, it is possible to further reduce the possibility that the inflow of heat from the opening 7 is blocked by the shield V1.
  • the number of pillars V11 of the shielding portion V1 is two, but the number of pillars of the shielding portion V1 is not particularly limited.
  • 13A and 13B show a sensor 1G of the first modification.
  • the sensor 1G of Modification 1 is different from the sensor 1F in that the number of columns of the shielding portion V1 is three.
  • the sensor 1G of the modified example 1 is, for example, a P-type heat sensor.
  • the convex portion 23 of the substrate 2 of the sensor 1F protrudes slightly obliquely with respect to the radial direction of the housing 5 when viewed in the up-down direction (see FIG. 12B), the substrate 2 of the sensor 1G.
  • the convex portion 23 of is projected outward along the radial direction of the housing 5 (see FIG. 13B).
  • the shield V1 of the sensor 1G has three columns (a pair of left and right first columns V12 and a second column V13 in the middle).
  • the shield V1 is composed of three columns.
  • Each of the pair of first pillars V12 and second pillars V13 is long along the vertical direction (here, for example, the thickness direction of the substrate 2).
  • Each of the pair of first pillars V12 and second pillars V13 is formed integrally with the front cover 51 of the housing 5. Specifically, the first end (upper end) of each pillar is connected to the cylindrical body 510 of the housing 5, and the second end (lower end) of each pillar is connected to the base portion 511. As a result, each pillar extends from the upper edge to the lower edge of the opening 7.
  • the pair of first pillars V12 and the second pillar V13 are spaced apart from each other by a predetermined distance L2 in the direction D1 (here, the left-right direction) when the opening region 70 is viewed from the external space SP2 side. Will be placed.
  • the predetermined distance L2 is also a distance defined so that the test finger does not enter.
  • the heat detection element 30 is arranged between the pair of first columns V12 in the direction D1 when the opening region 70 is viewed from the side of the external space SP2 (see FIG. 13A). However, the heat detection element 30 is located at a position overlapping the second pillar V13 when the opening region 70 is viewed from the external space SP2 side. In other words, the heat detection element 30 is hidden behind the second pillar V13 and invisible.
  • the senor 1G is provided with the shielding portion V1 having three columns, so that it is difficult for the heat inflow from the opening 7 to be prevented, and a human finger, a tool, or the like comes into contact with the chip thermistor. It is possible to further reduce the possibility of the accident.
  • each of the pair of first pillars V12 has a guide surface V2 that guides the airflow from the external space SP2 toward the heat detection element 30 (chip thermistor).
  • each of the pair of first pillars V12 has a substantially racetrack shape in which the cross-sectional shape cut along the horizontal direction is long along the outer edge of the housing 5, and a semicircle is formed as a guide surface V2 on the left and right sides thereof. It has an arcuate curved surface. Therefore, it is possible to further reduce the possibility that the inflow of heat from the opening 7 is blocked by the shield V1.
  • the second pillar V13 has a substantially rectangular cross-sectional shape cut along the horizontal direction, but has a substantially racetrack shape like the first pillar V12 and has a guide surface V2. Good.
  • FIG. 13C shows another example of the sensor 1G of the first modification.
  • each of the pair of first pillars V12 has a substantially trapezoidal cross section cut along the horizontal direction.
  • Each of the first pillars V12 is configured such that, of the two sides parallel to each other in the trapezoidal shape, the short side is on the heat detecting element 30 side and the long side is on the external space SP2 side.
  • a first surface V121 facing the second pillar V13 in the middle and a second surface V122 opposite to the first surface V121 are inclined so as to face the heat detection element 30. Is a face.
  • the inclination angle of the second surface V122 with respect to the radial direction of the housing 5 is larger than the inclination angle of the first surface V121.
  • the second pillar V13 in the middle has a cross section cut along the horizontal direction in the shape of a shell that is long in the radial direction of the housing 5, and the side facing the heat detection element 30 has a semi-arcuate shape.
  • the first surface V121, the second surface V122, and the end surface having a semicircular arc cross section correspond to the guide surface V2.
  • each of the pair of first pillars V12 has the guide surface V2.
  • since the guide surface V2 is provided, it is possible to further reduce the possibility that the heat inflow from the opening portion 7 is blocked by the shield portion V1.
  • FIG. 14A to 14C and FIG. 15 show a sensor 1H according to the second modification.
  • the sensor 1H of the modification 2 is an R-type heat sensor as an example.
  • the convex portion 23 of the substrate 2 of the sensor 1H projects outward along the radial direction of the housing 5.
  • the shielding part V1 in the sensor 1H of the modified example 2 has a pair of first protrusions V14 and one second protrusion V15.
  • the shielding part V1 is composed of a pair of a first protrusion V14 and a second protrusion V15.
  • Each of the pair of first protrusions V14 extends from the back cover 52 (first cover) that covers the substrate 2 from one direction (here, above) in the thickness direction of the substrate 2 toward the front cover 51 (second cover). Project.
  • the front cover 51 covers the substrate 2 from a direction (here, below) opposite to the one direction in the thickness direction of the substrate 2.
  • the second protrusion V15 projects from the front cover 51 toward the back cover 52.
  • Each of the pair of first protrusion V14 and second protrusion V15 is elongated along the vertical direction (here, for example, the thickness direction of the substrate 2).
  • the pair of first projections V14 are formed integrally with the back cover 52, as shown in FIG. Specifically, the pair of first protrusions V14 continuously protrude downward from the peripheral edge portion on the lower surface of the back cover 52. The tip ends of the pair of first protrusions V14 are not in contact with the front cover 51, and a gap is left between the front cover 51 and the front cover 51.
  • the pair of first protrusions V14 are arranged at a predetermined distance L3 from each other in the direction D1 when the opening region 70 is viewed from the external space SP2 side.
  • the predetermined distance L3 is also a distance defined so that the test finger does not enter.
  • the heat detecting element 30 is arranged between the pair of first protrusions V14 in the direction D1 when the opening region 70 is viewed from the external space SP2 side (see FIG. 14A).
  • the second protrusion V15 is arranged in the center between the pair of first protrusions V14 in the direction D1.
  • each of the pair of first protrusions V14 is displaced from the second protrusion V15 in the direction D1 when the opening region 70 is viewed from the external space SP2 side. Therefore, it is possible to further reduce the possibility that the inflow of heat from the opening 7 is blocked by the shield V1.
  • the second protrusion V15 is formed integrally with the front cover 51. Specifically, the second protrusion V15 continuously protrudes upward from the peripheral edge portion on the upper surface of the front cover 51. The tip of the second protrusion V15 is not in contact with the upper edge of the opening 7 and has a gap between the upper edge and the upper edge.
  • the second protrusion V15 is at the same position as the chip thermistor in the direction D1 when the opening region 70 is viewed from the external space SP2 side.
  • the projection amount of the second protrusion V15 is defined so that at least a part of the chip thermistor is exposed.
  • the protrusion amount of the second protrusion V15 is defined so that the tip of the second protrusion V15 does not exceed the upper surface of the chip thermistor.
  • the tip of the second protrusion V15 is located below the lower surface of the substrate 2, and the heat detecting element 30 is hidden behind the second protrusion V15 between the pair of first protrusions V14. Exposed without.
  • the protrusion amount of the second protrusion V15 is defined so that at least a part of the chip thermistor is exposed in this way, it is further difficult to prevent the heat inflow from the opening 7 and the finger or the tool of the person. It is possible to reduce the possibility that the like will contact the chip thermistor.
  • each of the pair of first protrusions V14 also has a guide surface V2 as shown in FIG. 14B.
  • each of the pair of first protrusions V14 has a cross-sectional shape cut along the horizontal direction and has an elongated elliptical shape along the radial direction of the housing 5, and has curved surfaces on both left and right sides thereof as guide surfaces V2. are doing. Therefore, it is possible to further reduce the possibility that the inflow of heat from the opening 7 is blocked by the shield V1. In particular, since the width dimension of each first protrusion V14 is relatively small, it is possible to further reduce the possibility that heat inflow will be hindered.
  • the second protrusion V15 also has a guide surface V2 as shown in FIG. 14C.
  • the second protrusion V15 is formed in a substantially triangular shape when viewed in the arrangement direction of the pair of first protrusions V14.
  • the second protrusion V15 has a curved surface V150 that is recessed and inclined in a substantially arc shape on the side of the internal space SP1 when viewed along the direction in which the pair of first protrusions V14 are arranged.
  • This curved surface V150 also corresponds to the guide surface V2. The hot air flow can be guided toward the chip thermistor above the second protrusion V15 by colliding with the guide surface V2.
  • the sensor 1H is provided with the shield portion V1 having three protrusions, so that it is difficult for the heat inflow from the opening 7 to be prevented, and a human finger, a tool, or the like comes into contact with the chip thermistor. The possibility can be further reduced.
  • the shielding part V1 may have, for example, another first projection V14 between the pair of first projections V14.
  • the first protrusion V14 and the second protrusion V15 may be projected so that their tips are opposed to each other. Also in this case, similarly to the second protrusion V15, it is desirable that the protrusion amount of the other first protrusion V14 is regulated so that at least a part of the chip thermistor is exposed.
  • FIG. 16 shows a sensor 1I according to Modification 3.
  • the sensor 1I of Modification 3 is an R-type heat sensor as an example.
  • the shield portion V1 of the sensor 1I has a pair of first projections V16 formed integrally with the back cover 52, similarly to the pair of first projections V14 of the sensor 1H of the modified example 2. .
  • the pair of first protrusions V16 protrude from the back cover 52 toward the front cover 51.
  • the heat detection element 30 is arranged between the pair of first protrusions V16 in the direction D1 when the opening region 70 is viewed from the external space SP2 side.
  • the shield V1 of the sensor 1I further includes a pair of second protrusions V17.
  • Each of the pair of second protrusions V17 is formed integrally with the front cover 51, similarly to the second protrusion V15 of the sensor 1H according to the second modification.
  • the pair of second protrusions V17 protrude from the front cover 51 toward the back cover 52.
  • the pair of second protrusions V17 protrude so that their tips face the tip of the pair of first protrusions V16 in a one-to-one manner. In other words, there is a gap between each first protrusion V16 and the second protrusion V17 facing it.
  • the shield V1 of the sensor 1I further has a pillar V18.
  • the pillar V18 is formed integrally with the front cover 51 of the housing 5, similarly to the second pillar V13 of the sensor 1G of the first modification. Then, the heat detecting element 30 is in a position overlapping the pillar V18 when the opening region 70 is viewed from the side of the external space SP2. In other words, the heat detection element 30 is hidden behind the pillar V18 and is invisible.
  • Each of the pair of first protrusions V16 and the pillar V18 are arranged at a predetermined distance L4 in the direction D1 when the opening region 70 is viewed from the external space SP2 side.
  • the predetermined distance L4 is also a distance defined so that the test finger does not enter.
  • the senor 1I is provided with the shielding portion V1 having four protrusions and one pillar, so that the inflow of heat from the opening 7 is not easily obstructed, and the finger or the tool of a person can be chip thermistor. It is possible to further reduce the possibility of contact with.
  • the shield V1 of the sensor 1I also has a guide surface V2.
  • 17A and 17B show a sensor 1J according to Modification 4.
  • the sensor 1J of the modification 4 is an R-type heat sensor as an example.
  • the shield V1 of the sensor 1J has only one pillar V19.
  • the pillar V19 is formed integrally with the front cover 51 of the housing 5, similarly to the second pillar V13 of the sensor 1G of the first modification.
  • the heat detecting element 30 is located at a position overlapping the pillar V19 when the opening region 70 is viewed from the external space SP2 side. In other words, the heat detecting element 30 is hidden behind the pillar V19 and is invisible.
  • the pillar V19 has a guide surface V2 as shown in FIG. 17B.
  • the pillar V19 has a tapered cross-sectional shape cut along the horizontal direction toward the internal space SP1, and this tapered surface corresponds to the guide surface V2.
  • the cross-sectional shape of the pillar V19 is a semi-circular shape on the left and right sides thereof, and the surfaces on the left and right sides also correspond to the guide surface V2.
  • the sensor 1J has only one pillar V19, but the possibility that a human finger, a tool, or the like may come into contact with the chip thermistor while preventing the heat inflow from the opening 7 from being hindered. It can be reduced.
  • the number of protrusions and pillars of the shielding portion V1 is two as in the sensors 1F to 1I. The above is desirable.
  • the sensor 1K according to the present embodiment will be described with reference to FIGS. 18A to 18C.
  • configurations that are substantially the same as those of the first embodiment will be denoted by common reference numerals, and description thereof will be appropriately omitted.
  • the sensor 1K of the present embodiment has the outer surface 53 having a first surface 531 formed in a tapered shape, and thus the sensors (1, 1A to 1E) of the first embodiment (including modified examples). ) Different.
  • the tapered first surface 531 in the present embodiment may be appropriately applied to the sensor (1, 1A to 1E) of the first embodiment or the sensor (1F to 1J) of the second embodiment. Good.
  • the sensor 1K is a heat sensor that does not include the smoke detector 4 and determines the occurrence of a fire or the like only by detecting heat. Further, the sensor 1K includes a plurality of sets of shielding portions V1 similarly to the sensor 1H of the second modification of the second embodiment.
  • the opening 7 of the sensor 1K according to the present embodiment has an inflow port 7B. are doing. That is, the opening portion 7 has the inflow port 7B in addition to the six side surface ports (lateral holes) 7A.
  • the inflow port 7B is provided on the outer surface 53 (the lower surface of the front cover 51) of the housing 5 on the side opposite to the structure X1 to which the sensor 1K is attached.
  • the inflow port 7B is provided at the center of the outer surface 53.
  • the inflow port 7B penetrates the front cover 51 in its thickness direction.
  • the inflow port 7B has a substantially circular opening.
  • the substrate 2 has a hole portion 25 penetrating in the thickness direction at the center thereof.
  • the hole 25 has a substantially circular opening.
  • the hole 25 is arranged so as to substantially overlap the inflow port 7B.
  • the substrate 2 has a pair of protrusions 26 that protrude so as to approach each other at the opening edges of the holes 25. The tips of the pair of protrusions 26 are exposed from the inflow port 7B.
  • the heat detecting element 30 (chip thermistor) is also provided on the upper surface of each protrusion 26 of the substrate 2.
  • the sensor 1K includes two heat detecting elements 30 in the vicinity of the inlet 7B. have.
  • the substrate 2 has a substantially triangular shape in order to prevent the heat of the heat detecting element 30 from being transmitted through the substrate 2 in the vicinity of each heat detecting element 30 and lowering the temperature of the heat detecting element 30. It has a through hole 31.
  • the opening 7 of the sensor 1K has the inflow port 7B, the heat of the gas flowing in from the inflow port 7B can be detected, so that the responsiveness regarding the heat detection can be enhanced.
  • the outer surface 53 of the sensor 1K of the present embodiment has a first surface 531 around the inflow port 7B and a second surface 532 that is outside the first surface 531.
  • the second surface 532 is outside the first surface 531 around the first surface 531.
  • the first surface 531 has a different inclination angle from the second surface 532, and is formed in a taper shape so as to approach the structure X1 side toward the inflow port 7B (upward).
  • the outer surface 53 further includes a third surface 533. The third surface 533 is outside the first surface 531 and inside the second surface 532.
  • Each of the first surface 531 to the third surface 533 has a donut shape when the outer surface 53 is viewed from the front.
  • the radial dimension of the outer surface 53 for example, the second surface 532 is the largest, the third surface 533 is the second largest, and the first surface 531 is the smallest, but the dimensions are not particularly limited.
  • the inclination angle ⁇ 1 of the first surface 531 with respect to the horizontal plane is, for example, 23 °.
  • the inclination angle ⁇ 2 of the second surface 532 with respect to the horizontal plane is, for example, 0 ° to 1 °.
  • the inclination angle ⁇ 3 of the third surface 533 with respect to the horizontal plane is, for example, 8 °.
  • the outer surface 53 has the first surface 531 and the second surface 532, in the event of a fire, the heat inflow to the inflow port 7B is prevented. It can be further promoted (see arrow in FIG. 18C).
  • the outer surface 53 including the third surface 533 is inclined in two steps, so that the heat flow into the inflow port 7B can be more effectively promoted.
  • the inspector 600 uses a predetermined (heating) tester 900 for the heat detection element 30 of the sensor 1K installed in the structure X1 (ceiling in the illustrated example). Perform heating inspection.
  • the tester 900 includes a heat source 910 such as a Hakkin Cairo, a main body 920 having a substantially cylindrical shape with an open upper surface and accommodating the heat source 910, and a support rod 930 supporting the main body 920. .
  • the main body 920 is arranged so as to cover the base 511 and the opening 7 of the front cover 51 of the sensor 1K from below. If the heat detection element 30 and the like are normal, the sensor 1K receives the heat flow from the heat source 910 and performs the same operation as when detecting a fire.
  • the heat detecting element 30 is a chip thermistor mounted on the substrate 2, reduction in size (especially thinness) of the entire sensor (1, 1A to 1K) is achieved. Has been. On the other hand, with the downsizing of the sensor, the stability of the position of the tester 900 with respect to the sensor may be impaired during inspection.
  • the housing 5 of the sensor 1K has a plurality of (for example, six) convex portions W1 (see FIGS. 18A and 18B: however, only four are shown in FIG. 18A).
  • the plurality of protrusions W1 project from the edge (here, the upper edge) of the opening 7 in a direction (for example, downward) away from the side of the structure X1 to which the sensor 1K is attached.
  • the plurality of convex portions W1 are arranged at equal intervals along the circumferential direction of the housing 5 when viewed from below, for example.
  • the plurality of convex portions W1 come into contact with the peripheral portion 901 (see FIG. 19B) of the tester 900 in a state in which the tester 900 for performing the heat check of the heat detection element 30 is arranged so as to cover the housing 5.
  • the tester 900 is stably arranged in the housing 5. That is, the possibility that the convex portion W1 makes a point contact with the peripheral edge portion 901 increases, and rattling can be suppressed as compared with the case where the housing 5 makes a surface contact with the peripheral edge portion 901 without the convex portion W1. .
  • each convex portion W1 protrude downward from the peripheral edge of the lower end of the cylindrical body 510.
  • the plurality of convex portions W1 are located at the same position along the circumferential direction of the housing 5 so as to correspond to the plurality of crosspieces 512 one-to-one.
  • each convex portion W1 is formed integrally with a part (upper portion) of the corresponding cross section 512.
  • each convex portion W1 also functions as a portion that reinforces the corresponding cross section 512.
  • each convex portion W1 may not have a function as a reinforcing portion of the crosspiece 512.
  • Each convex portion W1 may be located at a position displaced from the crosspiece 512 in the circumferential direction of the housing 5.
  • the number of the convex portions W1 is not particularly limited, and may be one, for example. Even when the number of the convex portions W1 is one, the positioning can be performed more stably than when the housing 5 makes surface contact with the peripheral edge portion 901 of the tester 900.
  • FIG. 20 shows a sensor 1L which is a modified example of the third embodiment.
  • the sensor 1L of this modification also has a first surface 531 in which the outer surface 53 is tapered.
  • the sensor 1L is, for example, a P-type heat sensor.
  • the sensor 1L includes the shielding portion V1 having three columns (a pair of left and right first columns V12 and the second column V13 in the middle) as in the sensor 1G of the first modification of the second embodiment. I have a set. In FIG. 20, only one set of the two sets of shields V1 is shown, and the remaining one set of shields V1 is located on the back side.
  • the sensor 1L has a plurality of (for example, four) convex portions W1 configured to contact the peripheral portion 901 (see FIG. 19B) of the tester 900 (see FIG. 20: 3 Only one shown).
  • at least one of the four protrusions W1 has a part (upper part) of the second pillar V13 so that at least one protrusion W1 also functions as a part that reinforces the second pillar V13 in the middle of the shielding portion V1. ) Is formed integrally.
  • the four convex portions W1 of the sensor 1L are formed on the two crosspieces 512 and the two second pillars V13 (including the second pillar V13 of the shielding portion V1 on the opposite side of the shielding portion V1 shown in the drawing). On the other hand, they are at the same positions along the circumferential direction of the housing 5 so as to correspond to each other one by one.
  • the sensor 1M shown in FIGS. 21A and 21B is, for example, an R-type heat sensor.
  • the sensor 1M is a heat sensor that does not include the smoke detector 4 and determines the occurrence of a fire or the like only by detecting heat.
  • the sensor 1M includes a plurality of sets of shielding portions V1 having three columns.
  • the sensor 1M further includes a mounting base 100B for mounting the main body 100A on the structure X1 (ceiling in the illustrated example).
  • the mounting base 100B may be appropriately applied to the sensors (1, 1A to 1E) of the first embodiment, the sensors (1F to 1J) of the second embodiment, or the third embodiment (1K, 1L). .
  • the mounting base 100B is formed in a flat cylindrical shape with an open lower surface as a whole.
  • the mounting base 100B is fixed to the surface of the structure X1 by screwing or the like.
  • the structure X1 is provided with a hole for leading out an electric wire (a power supply line, a signal line, etc.) on the back side thereof.
  • the mounting base 100B has a through hole 103 (see FIG. 21B) in the bottom portion 106 for passing an electric wire led out from the hole of the structure X1 toward the main body 100A.
  • the mounting base 100B has an outer peripheral wall 104 and a flange portion 105 projecting outward from the outer peripheral wall 104.
  • the outer peripheral wall 104 is configured to fit into a recess formed by the cylindrical body 510 and the back cover 52 (see FIG. 1) on the upper side of the main body 100A.
  • a detailed description is omitted, for example, when the outer peripheral wall 104 is fitted in the recess of the main body 100A and rotated clockwise with respect to the axial direction, the engaging portion of the back cover 52 is engaged.
  • the engaged portion is provided on the mounting base 100B.
  • the main body 100A is fixed to the mounting base 100B by the engaging portion of the back cover 52 engaging with the engaged portion.
  • the outer peripheral surface of the collar portion 105 and the outer peripheral surface of the cylindrical body 510 of the sensor 1M are substantially flush with each other. It can be provided as a good-looking sensor.
  • the mounting base 100B described above is a type of base unit in which the sensor 1M is directly mounted on the surface of the structure X1.
  • the sensor 1M may include an embedded base 100C as shown in FIGS. 22A and 22B.
  • the embedded base 100C is a base unit of a type in which the sensor 1M is embedded and installed in the structure X1.
  • the embedded base 100C has a base body 107 that is inserted into a hole for embedding in the structure X1 and a decorative portion 108 that is integrally formed with the base body 107.
  • the base body 107 is formed in a flat cylindrical shape with an open lower surface. Further, the embedded base 100C further includes, for example, a mounting bracket (a first mounting bracket T1 or a second mounting bracket T2 described later) for fixing the embedded base 100C to the structure X1 while being inserted into the hole of the structure X1. ing.
  • the base body 107 has a through hole 110 (see FIG. 22B) in the bottom portion 109 for passing an electric wire on the back side of the structure X1 toward the body 100A.
  • the base body 107 has a recess 111 having an inner diameter slightly larger than the outer diameter of the main body 100A. That is, the main body 100A can be housed in the recess 111.
  • the recess 111 has a depth such that approximately half of the vertical direction of the cylindrical body 510 fits into the recess 111.
  • Decorative part 108 protrudes outward from the lower end of base body 107 in a brim shape.
  • the makeup section 108 is positioned and exposed below the surface of the structure X1 with the base body 107 inserted into the hole of the structure X1.
  • the engagement portion of the back cover 52 is engaged.
  • the engaged portion is provided in the embedded base 100C.
  • the main body 100A is fixed to the embedding base 100C by the engaging portion of the back cover 52 engaging with the engaged portion.
  • the sensor 1M can suppress the amount of protrusion from the surface of the structure X1 in a state where the main body 100A is fixed to the embedded base 100C, and thus has a good appearance. Can be provided as.
  • the embedded base 100C has a pair of first mounting brackets T1.
  • Each first mounting member T1 has a fixing screw T11 and a partially bent plate spring-shaped fixing piece T12.
  • the fixing piece T12 has a screw hole into which the fixing screw T11 is screwed.
  • the fixing piece T12 is temporarily fixed to the fixing screw T11 on the upper side of the base body 107 in a state where the fixing screw T11 is inserted into the through hole in the bottom portion 109 of the base body 107 from below. In other words, the bottom portion 109 is sandwiched between the flat portion T120 of the fixed piece T12 and the head portion of the fixing screw T11.
  • each fixing piece T12 When attaching the embedded base 100C to the structure X1, first loosen each fixing screw T11 with a tool such as a screwdriver to release the pinched state. In this state, each fixing piece T12 can be tilted inward together with the fixing screw T11 (see the imaginary line in FIG. 23A). Each fixing piece T12 is tilted inward, and the base body 107 is inserted into the hole X11 of the structure X1 while maintaining that state. Then, by tightening each fixing screw T11 with a tool such as a screwdriver, the fixing piece T12 falls outward with the flat portion T120 in contact with the base body 107 as a fulcrum, and its tip T121 (point of action) is the structure. Touch the back of X1.
  • a tool such as a screwdriver
  • each fixing screw T11 by further tightening each fixing screw T11, the structure X1 is sandwiched in the vertical direction by the tip T121 of each fixing piece T12 and the decorative portion 108, and as a result, the embedded base 100C becomes the structure X1. Fixed to.
  • the embedded base 100C has a pair of second mounting brackets T2.
  • Each second mounting member T2 has a fixing screw T21 and a flat rectangular plate-shaped fixing piece T22.
  • the fixing piece T22 has a screw hole into which the fixing screw T21 is screwed.
  • the fixing piece T22 is temporarily fixed to the fixing screw T21 on the upper side of the decorative portion 108 in a state where the fixing screw T21 is inserted into the through hole in the decorative portion 108 from below.
  • each fixing screw T21 When mounting the embedded base 100C to the structure X1, first loosen each fixing screw T21 with a tool such as a screwdriver, and rotate so that the tip of the fixing piece T22 faces inward. While maintaining this state, the base body 107 is inserted into the hole X11 of the structure X1. Then, by tightening each fixing screw T21 with a tool such as a screwdriver, the tip of the fixing piece T22 faces outward, and further, the fixing piece T22 descends toward the back surface of the structure X1 to make substantially surface contact. Then, by further tightening each fixing screw T21, the structure X1 is sandwiched by each fixing piece T22 and the decorative portion 108 in the vertical direction, and as a result, the embedded base 100C is fixed to the structure X1. It
  • first mounting bracket T1 and second mounting bracket T2 are merely examples, and the mounting bracket for fixing the embedded base 100C to the structure X1 is not limited to these. Further, the above-described mounting method is also merely an example and is not limited to these.
  • the senor (1, 1A to 1M) includes the substrate (2), the heat detecting element (30), and the housing (5). .
  • the housing (5) houses the substrate (2).
  • the housing (5) is provided with an internal space (SP1) and a flow path (6) through which gas flows, and an opening (connecting the flow path (6) and the external space (SP2) of the housing (5) ( 7) and.
  • the heat detecting element (30) is a chip thermistor mounted on the substrate (2) and detecting the heat of the gas flowing in from the opening (7). According to the first aspect, since the heat detection element (30) is a chip thermistor mounted on the substrate (2), the size of the sensor (1, 1A to 1M) as a whole can be reduced.
  • the first aspect at least a partial region of the surface (eg, the first surface 21) of the substrate (2) is in the flow path (6). It is preferable to expose. According to the second aspect, it is possible to further increase the possibility that the heat detection element (30) is exposed to the gas flowing through the flow path (6), and therefore, it is possible to improve the heat detection performance and reduce the size. Can be planned.
  • the chip thermistor has an opening area (70) of the opening (7) from the side of the external space (SP2). ), It is preferably arranged so as to fit within the opening region (70). According to the third aspect, it is possible to further increase the possibility that the heat detecting element (30) is exposed to the gas flowing through the flow path (6), and thus it is possible to reduce the size while improving the heat detecting performance. Can be planned.
  • the chip thermistor is preferably located at the following position. That is, the chip thermistor has a direction orthogonal to the surface (eg, the first surface 21) of the substrate (2) within the opening region (70) when the opening region (70) is viewed from the external space (SP2) side. It is preferably located in the center of the open area (70) at.
  • the heat detecting element (30) is exposed to the gas flowing through the flow path (6) as compared with the case where the chip thermistor is located near one end of the opening region (70) in the above direction. The possibility can be further increased.
  • the flow path (6) is the first path on the side of the opening (7). (61) and a second path (62) connected to the first path (61) and located on the side of the central portion of the internal space (SP1).
  • the chip thermistor is preferably in the first path (61). According to the fifth aspect, the responsiveness regarding heat detection can be improved as compared with the case where the chip thermistor is in the second path (62), for example.
  • the flow path (6) is the first path on the side of the opening (7). (61) and a second path (62) connected to the first path (61) and located on the side of the central portion of the internal space (SP1).
  • the opening cross-sectional area of the first path (61) is preferably smaller than the opening cross-sectional area of the second path (62).
  • the gas that has entered the flow path (6) through the opening (7) can be promoted to flow from the first path (61) toward the second path (62). .
  • the housing (5) faces the structure (X1) to which the sensor (1, 1A to 1M) is attached. It is preferable to have an installation surface (55) for It is preferable that the second road (62) expands in a direction closer to the installation surface (55) from the first road (61) toward the central portion. According to the seventh aspect, it is possible to more effectively generate the airflow from the first road (61) to the second road (62).
  • the sensor (1, 1A to 1M) according to the eighth aspect is the smoke detecting section according to any one of the first to seventh aspects, which is arranged in a central portion of the internal space (SP1) and detects smoke. It is preferable to further include (4). According to the eighth aspect, since not only heat but also smoke is detected, it is possible to reduce the size of the detector (1, 1A to 1M) as a whole while improving the fire detection performance.
  • the smoke detecting section (4) has a surface (for example, the first surface 21) of the substrate (2) on which the chip thermistor is mounted. It is preferably arranged on the same plane side as. According to the ninth aspect, it is possible to reduce the size of the detector (1, 1A to 1M) as a whole while further improving the fire detection performance.
  • the housing (5) has a structure to which the sensor (1, 1A to 1M) is attached. It is preferable to have an installation surface (55) facing (X1).
  • the smoke detection unit (4) is a surface (e.g., the first surface 21) of the substrate (2) and a surface (e.g., the second surface 22) opposite to the surface, which is closer to the installation surface (55). It is preferable that they are arranged. According to the tenth aspect, it is possible to further reduce the size, for example, as compared with the case where the smoke detection unit (4) is arranged on the surface far from the installation surface (55).
  • the housing (5) has one or more walls in the internal space (SP1). It is preferable to have a body (control plate 522). It is preferable that one or a plurality of walls (control plate 522) guide the gas to the heat detecting element (30) or the smoke detecting section (4). According to the eleventh aspect, the fire sensing performance can be further enhanced.
  • the sensor (1, 1A to 1M) is attached to the housing (5). It is preferable to have an installation surface (55) facing the structure (X1) to be formed.
  • the smoke detecting section (4) has an optical element (41) for emitting light, a light receiving element (42) for receiving the light emitted from the optical element (41), and a labyrinth section (43). In the labyrinth portion (43), the optical element (41) and the light receiving element (42) are arranged so as not to face each other.
  • the center (P1) of the internal space of the labyrinth portion (43) is preferably located between the chip thermistor and the installation surface (55).
  • the size of the sensor (1, 1A to 1M) as a whole can be reduced while further improving fire detection performance. Can be achieved.
  • the chip thermistor has an opening (7) from the side of the external space (SP2). It is preferably arranged to fit within the open area (70) when the area (70) is viewed. It is preferable that the sensors (1, 1A to 1M) further include a shield (V1) that shields a part of the opening region (70) on the side of the external space (SP2) with respect to the chip thermistor.
  • the shielding part (V1) since the shielding part (V1) is provided, it is possible to prevent the heat inflow from the opening part (7) from being hindered and, for example, to unintentionally insert a finger or a tool of a person into the tip. The possibility of contacting the thermistor can be reduced.
  • the shielding part (V1) includes a guide surface (V2 that guides the airflow from the external space (SP2) toward the chip thermistor. ) are preferred. According to the fourteenth aspect, it is possible to further reduce the possibility that the flow of heat through the opening (7) is blocked by the shield (V1).
  • the housing (5) includes the first cover (for example, one of the front cover 51 and the back cover 52). And a second cover (the other side).
  • the first cover covers the substrate (2) from one direction in the thickness direction of the substrate (2).
  • the second cover covers the substrate (2) from a direction opposite to the one direction in the thickness direction.
  • the shielding part (V1) includes a first protrusion (V14, V16) protruding from the first cover toward the second cover, and a second protrusion (V15, V17) protruding from the second cover toward the first cover. It is preferable to have According to the fifteenth aspect, it is possible to further reduce the possibility that a human finger, a tool, or the like will come into contact with the chip thermistor while making it more difficult to prevent the heat inflow from the opening (7).
  • the first protrusion (V14) is preferably arranged as follows. That is, the first protrusion (V14) is the second protrusion in the direction orthogonal to the arranging direction of the first cover and the second cover when the opening region (70) is viewed from the side of the external space (SP2). It is preferable to dispose with respect to (V15). According to the sixteenth aspect, it is possible to further reduce the possibility that the flow of heat from the opening (7) is blocked by the shield (V1).
  • the first protrusion (V16) and the second protrusion (V17) project so that their tips are opposed to each other. Is preferred. According to the seventeenth aspect, it is possible to further reduce the possibility that a human finger, a tool, or the like will come into contact with the chip thermistor.
  • One here, the second protrusion V15
  • the second protrusion V15 is preferably as follows. That is, at least one of the above is at the same position as the chip thermistor in the direction orthogonal to the arranging direction of the first cover and the second cover when the opening region (70) is viewed from the side of the external space (SP2). It is preferable.
  • the projection amount of at least one of the at least one is defined such that at least a part of the chip thermistor is exposed when the opening region (70) is viewed from the side of the external space (SP2). .
  • the eighteenth aspect it is possible to further reduce the possibility that a human finger, a tool, or the like will come into contact with the chip thermistor while making it more difficult to prevent heat inflow from the opening (7).
  • the opening (7) has an inflow port (7B).
  • the inlet (7B) is provided on the outer surface (53) of the housing (5) opposite the structure (X1) to which the sensors (1, 1A-1M) are attached.
  • the heat of the gas flowing in from the inflow port (7B) can be detected, so that the responsiveness regarding heat detection can be improved.
  • the outer surface (53) has a first surface (531) around the inlet (7B) and a first surface (531). 531) and the 2nd surface (532) located outside. It is preferable that the first surface (531) has an inclination angle different from that of the second surface (532) and is formed in a taper shape so as to be closer to the structure (X1) side as it is closer to the inflow port (7B). . According to the twentieth aspect, the heat inflow into the inflow port (7B) can be further promoted.
  • the housing (5) has one or more convex portions (W1). Is preferred.
  • the one or more protrusions (W1) protrude from the edge of the opening (7) in a direction away from the side of the structure (X1) to which the sensors (1, 1A to 1M) are attached.
  • the one or more convex portions (W1) are provided with a tester (900) for performing heating inspection of the heat detecting element (30) arranged so as to cover the housing (5). It is preferably configured to contact the peripheral portion (901) of the.
  • the tester (900) is stably arranged in the housing (5). That is, the convex portion (W1) is more likely to come into point contact with the peripheral edge portion (901), and rattling can be suppressed as compared with surface contact.
  • the configurations according to the second to twenty-first aspects are not essential for the sensors (1, 1A to 1M) and can be omitted as appropriate.

Abstract

The purpose of the present invention is to achieve downsizing. This sensor (1) is provided with a substrate (2), a heat-sensing element (30), and a case (5). The case (5) houses the substrate (2) therein. The case (5) has: a flow channel (6) which is provided in an interior space (SP1) of the case and which has gas flowing therethrough; and an opening (7) which connects the flow channel (6) and an exterior space (SP2) of the case (5). The heat-sensing element (30) is a chip thermistor that is mounted on the substrate (2) so as to sense heat of the gas flowing in through the opening (7).

Description

感知器sensor
　本開示は、一般に、感知器に関し、より詳細には、例えば火災等によって発生する熱を感知する感知器に関する。 The present disclosure relates generally to sensors, and more particularly to sensors that sense heat generated by, for example, a fire.
　従来例として、特許文献１に記載の熱煙複合式感知器を例示する。この感知器は、熱を感知する熱感知手段と、暗箱内に流入した煙を感知する煙感知部と、を備える。熱感知手段は、回路基板に接続されて回路基板から上側に向けて突出するリード線と、リード線の上端に設けられたサーミスタ等の感熱素子と、を備えて構成される。 As a conventional example, the heat and smoke combined type sensor described in Patent Document 1 will be illustrated. The sensor includes a heat sensing unit that senses heat and a smoke sensing unit that senses smoke that has flowed into the dark box. The heat sensing means includes a lead wire connected to the circuit board and protruding upward from the circuit board, and a heat sensitive element such as a thermistor provided on an upper end of the lead wire.
　しかし、特許文献１の感知器では、感熱素子がリード線の上端に設けられているため、リード線の長さに依存して、感知器全体としての小型化（特に、薄型化）を図り難くしている可能性がある。 However, in the sensor of Patent Document 1, since the heat-sensitive element is provided at the upper end of the lead wire, it is difficult to reduce the size of the sensor as a whole (particularly, thinning) depending on the length of the lead wire. There is a possibility that
特開２０１２－０１４３３０号公報JP, 2012-014330, A
　本開示は上記事由に鑑みてなされ、小型化を図ることができる感知器を提供することを目的とする。 The present disclosure has been made in view of the above circumstances, and an object thereof is to provide a sensor that can be downsized.
　本開示の一態様に係る感知器は、基板と、熱検知素子と、筐体と、を備える。前記筐体は、前記基板を収容する。前記筐体は、その内部空間に設けられて気体が流れる流路と、前記流路と前記筐体の外部空間とを繋ぐ開口部と、を有する。前記熱検知素子は、前記基板に実装されて、前記開口部から流入した前記気体の熱を検知するチップサーミスタである。 A sensor according to one aspect of the present disclosure includes a substrate, a heat detection element, and a housing. The housing accommodates the substrate. The housing has a flow path that is provided in the internal space and through which gas flows, and an opening that connects the flow path and the external space of the housing. The heat detecting element is a chip thermistor mounted on the substrate and detecting heat of the gas flowing from the opening.
図１は、実施形態１に係る感知器の断面図である。FIG. 1 is a cross-sectional view of the sensor according to the first embodiment. 図２は、同上の感知器の下方から見た斜視図である。FIG. 2 is a perspective view of the above sensor seen from below. 図３Ａは、同上の感知器における一部透視化された平面図である。図３Ｂは、図３Ａにおける要部の拡大平面図である。FIG. 3A is a partially transparent plan view of the above sensor. FIG. 3B is an enlarged plan view of a main part in FIG. 3A. 図４は、同上の感知器の概略ブロック構成図である。FIG. 4 is a schematic block configuration diagram of the above-mentioned sensor. 図５は、同上の感知器における開口部を正面から見た拡大図である。FIG. 5 is an enlarged view of the opening of the above-mentioned sensor as viewed from the front. 図６は、同上の感知器における変形例１の概略断面図である。FIG. 6 is a schematic cross-sectional view of Modification 1 of the above sensor. 図７は、同上の感知器における変形例２の概略断面図である。FIG. 7: is a schematic sectional drawing of the modification 2 in a sensor same as the above. 図８Ａは、同上の感知器における変形例３の下方から見た斜視図である。図８Ｂは、同上の変形例３における一部透視化された平面図である。FIG. 8A is a perspective view of a modified example 3 of the sensor of the above, viewed from below. FIG. 8B is a partially transparent plan view of Modification 3 of the above. 図９Ａは、同上の感知器における変形例４の下方から見た斜視図である。図９Ｂは、同上の変形例４における一部透視化された平面図である。FIG. 9A is a perspective view of a modified example 4 of the sensor of the above when viewed from below. FIG. 9B is a partially transparent plan view of Modification 4 of the above. 図１０Ａは、同上の感知器における変形例５の下方から見た斜視図である。図１０Ｂは、同上の変形例５における一部透視化された平面図である。FIG. 10A is a perspective view of a modified example 5 of the sensor of the above when viewed from below. FIG. 10B is a partially transparent plan view of Modification 5 of the above. 図１１は、同上の感知器における別の変形例の下方から見た斜視図である。FIG. 11 is a perspective view of another modified example of the above-mentioned sensor as viewed from below. 図１２Ａは、実施形態２に係る感知器の要部の側面図である。図１２Ｂは、同上の感知器の、水平方向に沿って切った要部の断面図である。FIG. 12A is a side view of a main part of the sensor according to the second embodiment. FIG. 12B is a cross-sectional view of a main part of the sensor of the same taken along the horizontal direction. 図１３Ａは、同上の感知器における変形例１の要部の側面図である。図１３Ｂは、同上の変形例１の、水平方向に沿って切った要部の断面図である。図１３Ｃは、同上の変形例１の別の例の、水平方向に沿って切った要部の断面図である。FIG. 13A is a side view of a main part of Modification 1 of the sensor of the above. FIG. 13B is a cross-sectional view of a main part of Modification 1 of the above, taken along the horizontal direction. FIG. 13C is a cross-sectional view of a main part of another example of the first modified example cut along the horizontal direction. 図１４Ａは、同上の感知器における変形例２の要部の側面図である。図１４Ｂは、同上の変形例２の、水平方向に沿って切った要部の断面図である。図１４Ｃは、同上の変形例２の、要部の斜視図である。FIG. 14A is a side view of an essential part of a second modification of the above sensor. FIG. 14B is a cross-sectional view of a main portion of Modification 2 of the above, taken along the horizontal direction. FIG. 14C is a perspective view of a main part of the second modified example. 図１５は、同上の変形例２の要部の分解斜視図である。FIG. 15: is a disassembled perspective view of the principal part of the modification 2 same as the above. 図１６は、同上の感知器における変形例３の要部の側面図である。FIG. 16: is a side view of the principal part of the modification 3 in a sensor same as the above. 図１７Ａは、同上の感知器における変形例４の要部の側面図である。図１７Ｂは、同上の変形例４の、水平方向に沿って切った要部の断面図である。FIG. 17A is a side view of the essential parts of Modification 4 of the above sensor. FIG. 17B is a cross-sectional view of a main part of Modification 4 of the above, taken along the horizontal direction. 図１８Ａは、実施形態３に係る感知器の下方から見た斜視図である。図１８Ｂは、同上の感知器における一部透視化された平面図である。図１８Ｃは、同上の感知器における流入口付近の、垂直方向に沿って切った要部の断面図である。FIG. 18A is a perspective view of the sensor according to the third embodiment viewed from below. FIG. 18B is a partially transparent plan view of the above sensor. FIG. 18C is a cross-sectional view of the main part taken along the vertical direction near the inflow port of the above sensor. 図１９Ａは、構造体に設置された同上の感知器に対して、試験器を用いて加熱点検を行う様子を示す図である。図１９Ｂは、同上の感知器が試験器で覆われた状態における、試験器の模式的な断面図である。FIG. 19A is a diagram showing a state in which a sensor is installed on a structure and a heating inspection is performed using a tester. FIG. 19B is a schematic cross-sectional view of the tester in a state in which the above-mentioned sensor is covered with the tester. 図２０は、同上の感知器における変形例の下方から見た斜視図である。FIG. 20 is a perspective view of a modified example of the above-mentioned sensor as seen from below. 図２１Ａは、実施形態４に係る感知器の本体が取付ベースを用いて構造体に直付け設置された様子を示す斜視図である。図２１Ｂは、同上の感知器の本体及び同上の取付ベースの分解斜視図である。FIG. 21A is a perspective view showing a state in which the main body of the sensor according to the fourth embodiment is directly mounted on the structure using the mounting base. FIG. 21B is an exploded perspective view of the main body of the sensor and the mounting base of the same. 図２２Ａは、同上の感知器の本体が埋込ベースを用いて、構造体に埋め込み設置された様子を示す斜視図である。図２２Ｂは、同上の感知器の本体及び同上の埋込ベースの分解斜視図である。FIG. 22A is a perspective view showing a state in which the main body of the above sensor is embedded and installed in a structure using an embedded base. FIG. 22B is an exploded perspective view of the main body of the sensor and the embedded base of the same. 図２３Ａは、同上の埋込ベースが、第１取付金具を用いて、構造体に取り付けられる様子を模式的に示す部分断面図である。図２３Ｂは、同上の埋込ベースが、第２取付金具を用いて、構造体に取り付けられる様子を模式的に示す部分断面図である。FIG. 23A is a partial cross-sectional view schematically showing how the embedded base of the above is attached to a structure by using the first attachment fitting. FIG. 23B is a partial cross-sectional view schematically showing how the embedded base of the same is attached to the structure using the second attachment fitting.
　（実施形態１）
　（１）概要
　以下の実施形態において説明する各図は、模式的な図であり、各図中の各構成要素の大きさ及び厚さそれぞれの比が、必ずしも実際の寸法比を反映しているとは限らない。 (Embodiment 1)
(1) Overview Each of the drawings described in the following embodiments is a schematic drawing, and the ratio of the size and the thickness of each constituent element in each drawing does not necessarily reflect the actual dimensional ratio. Not necessarily.
　本実施形態の感知器１は、例えば火災感知器であり、火災等によって発生する熱を検知する熱検知素子３０を備えている。言い換えると、感知器１は、少なくとも熱を検知する機能を有した感知器である。以下では一例として、感知器１が、煙検知部４（図１参照）も更に備えた、いわゆる複合火災感知器であるものとする（図１～図５参照）。感知器１は、煙検知部４の代わりに、又は煙検知部４に加えて、炎、ガス漏れ、又は不完全燃焼によるＣＯ（一酸化炭素）の発生等を検知する検知部を備えてもよい。 The detector 1 of the present embodiment is, for example, a fire detector, and includes a heat detecting element 30 that detects heat generated by a fire or the like. In other words, the sensor 1 is a sensor that has at least the function of detecting heat. In the following, as an example, it is assumed that the detector 1 is a so-called combined fire detector further including a smoke detector 4 (see FIG. 1) (see FIGS. 1 to 5). The sensor 1 may include a detection unit that detects CO (carbon monoxide) generation due to flame, gas leakage, or incomplete combustion, instead of the smoke detection unit 4, or in addition to the smoke detection unit 4. Good.
　感知器１は、図２に示すように、例えば建物の天井又は壁等の造営材である構造体Ｘ１（図示例では天井）に設置される。 As shown in FIG. 2, the sensor 1 is installed on a structure X1 (ceiling in the illustrated example) which is a construction material such as a ceiling or a wall of a building.
　感知器１は、図１～図３Ａに示すように、基板２と、１又は複数の熱検知素子３０と、筐体５と、を備えている。ここでは一例として、感知器１は、４つの熱検知素子３０を備えている。 As shown in FIGS. 1 to 3A, the sensor 1 includes a substrate 2, one or more heat detection elements 30, and a housing 5. Here, as an example, the sensor 1 includes four heat detection elements 30.
　筐体５は、基板２を収容する。筐体５は、図１に示すように、その内部空間ＳＰ１に設けられて気体が流れる流路６と、流路６と筐体５の外部空間ＳＰ２とを繋ぐ開口部７と、を有している。図１では、気体の流れを理解し易くするために、流路６を模式的に矢印線で図示しているが、内部空間ＳＰ１における煙検知部４の周囲の空隙部分は、概ね流路６に相当し得る。またここでは一例として、筐体５は、６つの開口部７を有している（図２では３つのみ図示）。 The housing 5 houses the substrate 2. As shown in FIG. 1, the housing 5 has a flow path 6 that is provided in the internal space SP1 and through which gas flows, and an opening 7 that connects the flow path 6 and the external space SP2 of the housing 5. ing. In FIG. 1, in order to facilitate understanding of the flow of gas, the flow path 6 is schematically shown by an arrow line, but the void portion around the smoke detection unit 4 in the internal space SP1 is generally in the flow path 6 Can correspond to. Further, here, as an example, the housing 5 has six openings 7 (only three are shown in FIG. 2).
　ここで本実施形態における熱検知素子３０は、図１に示すように、基板２に実装されて、開口部７から流入した気体の熱を検知するチップサーミスタである。 Here, the heat detecting element 30 in the present embodiment is a chip thermistor which is mounted on the substrate 2 and detects the heat of the gas flowing in from the opening 7, as shown in FIG.
　この構成によれば、熱検知素子３０が基板２に実装されるチップサーミスタであるため、例えば特許文献１における感熱素子がリード線の上端に設けられている構成に比べて、感知器１全体としての小型化（特に薄型化）を図ることができる。 According to this configuration, since the heat detecting element 30 is a chip thermistor mounted on the substrate 2, for example, as compared with the configuration in which the heat sensitive element in Patent Document 1 is provided at the upper end of the lead wire, the entire sensor 1 is provided. Can be miniaturized (particularly thin).
　（２）詳細
　（２．１）全体構成
　以下、本実施形態に係る感知器１の全体構成について詳しく説明する。感知器１は、上述の通り、熱及び煙を検知する、いわゆる複合火災感知器である。 (2) Details (2.1) Overall Configuration Hereinafter, the overall configuration of the sensor 1 according to the present embodiment will be described in detail. As described above, the detector 1 is a so-called combined fire detector that detects heat and smoke.
　以下では、図２の例の通り、感知器１が天井面（構造体Ｘ１の一面）に設置されていることを想定する。これにより、感知器１の上下、左右、前後の方向を、図２に図示されている上下、左右、前後の矢印を用いて規定して説明する。これらの矢印は、単に説明を補助する目的で記載しているに過ぎず、実体を伴わない。またこれらの方向は、感知器１の使用方向を限定する趣旨ではない。 In the following, it is assumed that the sensor 1 is installed on the ceiling surface (one surface of the structure X1) as in the example of FIG. Therefore, the up, down, left and right, front and back directions of the sensor 1 will be described using the up, down, left and right, front and back arrows shown in FIG. These arrows are provided merely for the purpose of assisting the description and have no substance. Further, these directions are not intended to limit the usage direction of the sensor 1.
　感知器１は、上述した４つの熱検知素子３０を有する熱検知部３を備えている。感知器１は、基板２、熱検知部３、煙検知部４及び筐体５に加えて、表示部８及び制御部９（図４参照）を更に備えている。また感知器１は、構造体Ｘ１に取り付けるための取付部１０を備えている（図１参照）。図１では、取付部１０が固定される構造体Ｘ１側の取付構造（例えば円盤状の取付ベース）の図示を省略している。感知器１は、構造体Ｘ１に固定された取付ベースに対して着脱可能に取り付けられる。 The sensor 1 includes the heat detection unit 3 having the four heat detection elements 30 described above. The sensor 1 further includes a display unit 8 and a control unit 9 (see FIG. 4) in addition to the substrate 2, the heat detection unit 3, the smoke detection unit 4, and the housing 5. The sensor 1 also includes a mounting portion 10 for mounting on the structure X1 (see FIG. 1). In FIG. 1, the illustration of a mounting structure (for example, a disc-shaped mounting base) on the side of the structure X1 to which the mounting portion 10 is fixed is omitted. The sensor 1 is detachably attached to the attachment base fixed to the structure X1.
　感知器１は、火災を検知したときに、火災の発生を知らせる信号を外部の警報器等（図示せず）へ送信し、また警報器等からの信号を受信する通信部１１を備えている。 The detector 1 includes a communication unit 11 that transmits a signal informing the occurrence of a fire to an external alarm device (not shown) when a fire is detected and receives a signal from the alarm device. .
　感知器１は、商用電源によって電力が供給されてもよいし、筐体５の内部に設けられた電池によって電力が供給されてもよい。 The sensor 1 may be supplied with power from a commercial power supply, or may be supplied with power from a battery provided inside the housing 5.
　（２．２）筐体
　筐体５は、基板２、熱検知部３、煙検知部４、表示部８の光源８１、制御部９、通信部１１、及びその他の回路モジュール等を、内部に収容する。また筐体５は、表示部８のガイド部８２の一面を外部に露出するように支持する（図２参照）。 (2.2) Housing The housing 5 includes the substrate 2, the heat detection unit 3, the smoke detection unit 4, the light source 81 of the display unit 8, the control unit 9, the communication unit 11, and other circuit modules inside. Accommodate. The housing 5 also supports one surface of the guide portion 82 of the display unit 8 so as to be exposed to the outside (see FIG. 2).
　筐体５は、合成樹脂製であり、例えば難燃性ＡＢＳ樹脂製である。筐体５は、全体として、上下方向にへん平な円筒状に形成されている。筐体５は、図１に示すように、一面（図示例では上面）が開放された円筒状の表カバー５１と、円板状の裏カバー５２と、を有している。筐体５は、感知器１が取り付けられる構造体Ｘ１と対向する設置面５５（図１参照）を有している。ここでは、裏カバー５２の一面（上面）が、設置面５５に相当する。筐体５は、裏カバー５２が表カバー５１に対してその開放された一面側から組み付けられることにより構成される。 The housing 5 is made of synthetic resin, for example, flame-retardant ABS resin. The housing 5 is formed in a generally flat cylindrical shape in the vertical direction. As shown in FIG. 1, the housing 5 has a cylindrical front cover 51 whose one surface (upper surface in the illustrated example) is open, and a disk-shaped back cover 52. The housing 5 has an installation surface 55 (see FIG. 1) facing the structure X1 to which the sensor 1 is attached. Here, one surface (upper surface) of the back cover 52 corresponds to the installation surface 55. The housing 5 is configured by assembling the back cover 52 from the open one surface side of the front cover 51.
　また筐体５は、上述の通り、その内部空間ＳＰ１に設けられて気体が流れる流路６と、流路６と外部空間ＳＰ２とを繋ぐ６つの開口部７として６つの側面口（横孔）７Ａと、を有している。言い換えると、開口部７は、側面口７Ａを有する。開口部７の数は特に限定されないが、筐体５に対する気体の出入りを考慮すれば、２つ以上設けられていることが好ましい。 Further, as described above, the housing 5 has six side surface openings (lateral holes) as six openings 7 that connect the flow path 6 and the external space SP2, which are provided in the internal space SP1 and through which gas flows. 7A. In other words, the opening 7 has the side opening 7A. Although the number of openings 7 is not particularly limited, it is preferable that two or more openings 7 are provided in consideration of the inflow and outflow of gas to and from the housing 5.
　ここでは６つの開口部７（６つの側面口７Ａ）が、表カバー５１に設けられている。具体的には、表カバー５１は、図１及び図２に示すように、上下の両端が開放されたへん平な円筒体５１０と、円筒体５１０の下方にある円板状の基部５１１と、円筒体５１０及び基部５１１を繋ぐ複数本（例えば６本）の桟部５１２と、から構成されている。円筒体５１０、基部５１１、及び６本の桟部５１２は、一体なって形成されている。６本の桟部５１２は、基部５１１の周縁部において周方向に沿って略等間隔に並んでいて、かつ当該周縁部から円筒体５１０の開放された下縁部に向かって突出している。６本の桟部５１２は、円筒体５１０と基部５１１との間の距離を規定距離に保つ。６つの開口部７は、このように構成された表カバー５１の周壁において、その周方向に沿って略等間隔に並んでいる。 Here, six openings 7 (six side openings 7A) are provided in the front cover 51. Specifically, as shown in FIGS. 1 and 2, the front cover 51 includes a flat cylindrical body 510 whose upper and lower ends are open, and a disc-shaped base 511 below the cylindrical body 510. It is composed of a plurality of (for example, 6) crosspieces 512 connecting the cylindrical body 510 and the base 511. The cylindrical body 510, the base 511, and the six crosspieces 512 are integrally formed. The six crosspieces 512 are arranged in the peripheral portion of the base 511 at substantially equal intervals along the circumferential direction, and project from the peripheral portion toward the open lower edge of the cylindrical body 510. The six crosspieces 512 keep the distance between the cylindrical body 510 and the base 511 at a specified distance. The six openings 7 are arranged at substantially equal intervals along the circumferential direction on the circumferential wall of the front cover 51 thus configured.
　各開口部７（各側面口７Ａ）は、表カバー５１の周壁を径方向に貫通する、略矩形状の貫通孔であり、流路６と外部空間ＳＰ２とを繋ぐ口となる。 Each opening 7 (each side opening 7A) is a substantially rectangular through hole that radially penetrates the peripheral wall of the front cover 51, and serves as an opening that connects the flow path 6 and the external space SP2.
　表カバー５１は、基部５１１の上面側に、基板２を位置決めするための位置決め構造を有している。位置決め構造の例としては、基部５１１の上面側に位置決め用の凹所が設けられていて、基板２に突設された爪片が当該凹所に嵌入されてもよい。基部５１１は、図３Ａに示すように、基板２の径寸法よりもやや大きい径寸法を有している。 The front cover 51 has a positioning structure for positioning the substrate 2 on the upper surface side of the base 511. As an example of the positioning structure, a recess for positioning may be provided on the upper surface side of the base portion 511, and a claw piece protruding from the substrate 2 may be fitted into the recess. As shown in FIG. 3A, the base portion 511 has a diameter dimension slightly larger than that of the substrate 2.
　また表カバー５１は、基部５１１に、表示部８のガイド部８２の一面（下面）を外部空間ＳＰ２に露出するための一対の孔部５１３（図３Ａ参照）を有している。 Also, the front cover 51 has a pair of holes 513 (see FIG. 3A) in the base 511 for exposing one surface (lower surface) of the guide portion 82 of the display unit 8 to the external space SP2.
　一対の孔部５１３は、基部５１１を下側から見たときに、基部５１１の周縁部寄りの位置にある。一対の孔部５１３は、基部５１１の周方向において等間隔となるように配置されている。言い換えると、一対の孔部５１３は、それらを結ぶ仮想線が基部５１１の中心を概ね通るように配置されている。一対の孔部５１３の並び方向は、本開示における前後方向に相当する。 The pair of holes 513 are located near the peripheral edge of the base 511 when the base 511 is viewed from below. The pair of holes 513 are arranged at equal intervals in the circumferential direction of the base 511. In other words, the pair of holes 513 are arranged so that an imaginary line connecting them substantially passes through the center of the base 511. The arrangement direction of the pair of holes 513 corresponds to the front-back direction in the present disclosure.
　各孔部５１３は、基部５１１をその厚み方向（上下方向）に貫通している。各孔部５１３の開口は、略矩形状である。各孔部５１３に、対応するガイド部８２が嵌入されている。したがって、一対の光源８１から放射された光は、一対のガイド部８２をそれぞれ介して、筐体５の外部に導出される。 Each hole 513 penetrates the base 511 in its thickness direction (vertical direction). The opening of each hole 513 has a substantially rectangular shape. A corresponding guide portion 82 is fitted into each hole portion 513. Therefore, the light emitted from the pair of light sources 81 is led out of the housing 5 through the pair of guide portions 82, respectively.
　裏カバー５２は、基板２に固定された取付部１０の複数（例えば４つ）の接続片１０１が嵌入される嵌入孔５２０を複数有している（図１参照）。複数の接続片１０１は、基板２上に設けられている回路モジュールと電気的に接続されている。複数の接続片１０１は、その先端が裏カバー５２の裏面側（設置面５５側）から十分に突出する程度にまで差し込まれている。複数の接続片１０１は、構造体Ｘ１に固定された（不図示の）取付ベースのコンタクト部に対して、機械的及び電気的に接続され得る。要するに、取付部１０は、単に取付ベースへの機械的な接続だけではなく、構造体Ｘ１の裏側にある電線（給電線及び信号線）との電気的な接続、さらに裏カバー５２に対する基板２の安定的な位置決めも兼ねた部位である。この位置決めとは、基板２の径方向の位置決めだけではなく、基板２の上下方向の位置決めも含む。 The back cover 52 has a plurality of fitting holes 520 into which the plurality (for example, four) of the connection pieces 101 of the mounting portion 10 fixed to the substrate 2 are fitted (see FIG. 1). The plurality of connection pieces 101 are electrically connected to the circuit module provided on the substrate 2. The plurality of connection pieces 101 are inserted to such an extent that the tips of the connection pieces 101 project sufficiently from the back surface side (the installation surface 55 side) of the back cover 52. The plurality of connecting pieces 101 can be mechanically and electrically connected to a contact portion of a mounting base (not shown) fixed to the structure X1. In short, the mounting portion 10 is not only mechanically connected to the mounting base, but is also electrically connected to the electric wires (the power supply line and the signal line) on the back side of the structure X1, and the substrate 2 is connected to the back cover 52. It is a part that also functions as stable positioning. This positioning includes not only radial positioning of the substrate 2 but also vertical positioning of the substrate 2.
　また裏カバー５２は、基板２と対向する一面（下面）において、基板２に実装された煙検知部４の上部を収容するための収容凹部５２１（図１参照）を有している。つまり、煙検知部４は、収容凹部５２１により安定的に位置決めされる。 The back cover 52 has a housing recess 521 (see FIG. 1) for housing the upper portion of the smoke detection unit 4 mounted on the board 2 on one surface (lower surface) facing the board 2. That is, the smoke detector 4 is stably positioned by the housing recess 521.
　さらに裏カバー５２は、基板２と対向する一面（下面）において、流路６内における気体の流れを制御する、複数の制御板（壁体）５２２（図３Ａ参照：図示例では４つ）を有している。各制御板５２２は、基板２の側から見て、略円弧状に形成されている。各制御板５２２は、表カバー５１の基部５１１に近づく方向（下方向）に突出している。４つの制御板５２２は、基板２の側から見て、裏カバー５２の周縁部近傍において、裏カバー５２の周方向に沿って略等間隔に配置されている。４つの制御板５２２は、筐体５の内部空間ＳＰ１において、流路６を流れる気体が、熱検知素子３０又は煙検知部４に向かってより流れ易くなるように気流を制御（誘導）する。制御板５２２の数は、特に限定されず、１つでもよい。 Further, the back cover 52 has a plurality of control plates (walls) 522 (see FIG. 3A: four in the illustrated example) for controlling the flow of gas in the flow path 6 on one surface (lower surface) facing the substrate 2. Have Each control plate 522 is formed in a substantially arc shape when viewed from the substrate 2 side. Each control plate 522 projects in a direction (downward) approaching the base portion 511 of the front cover 51. The four control plates 522 are arranged at substantially equal intervals along the circumferential direction of the back cover 52 in the vicinity of the peripheral edge of the back cover 52 when viewed from the substrate 2 side. The four control plates 522 control (guide) the airflow so that the gas flowing through the flow path 6 in the internal space SP1 of the housing 5 is more likely to flow toward the heat detection element 30 or the smoke detection unit 4. The number of control plates 522 is not particularly limited and may be one.
　（２．３）基板
　基板２は、プリント基板である。基板２には、熱検知部３、煙検知部４、表示部８、制御部９、通信部１１、及びその他の回路モジュール（不図示）等が実装されている。その他の回路モジュールとは、表示部８の光源８１及び煙検知部４の光学素子４１を点灯させる点灯回路、並びに、商用電源等より供給される電力を用いて各種回路の動作電力を生成する電源回路等を含む。 (2.3) Substrate The substrate 2 is a printed circuit board. The board 2 is mounted with a heat detection unit 3, a smoke detection unit 4, a display unit 8, a control unit 9, a communication unit 11, and other circuit modules (not shown). The other circuit modules include a lighting circuit that lights the light source 81 of the display unit 8 and the optical element 41 of the smoke detection unit 4, and a power supply that generates operating power of various circuits by using power supplied from a commercial power supply or the like. Including circuits etc.
　基板２は、図３Ａに示すように、全体として略円形状に形成されている。図３Ａは、感知器１の下側から見た、一部（基板２と制御板５２２と煙検知部４）透視化されている平面図である。 The substrate 2 is formed in a substantially circular shape as a whole as shown in FIG. 3A. FIG. 3A is a plan view of a part (the substrate 2, the control plate 522, and the smoke detection unit 4) seen through from the lower side of the sensor 1 and is transparent.
　本実施形態では、少なくとも熱検知部３の４つの熱検知素子３０が、基板２の第１面２１（表面）に表面実装されている。第１面２１は、上面である（図１参照）。ここでは一例として、煙検知部４も、基板２の第１面２１と同一平面側に配置されている。煙検知部４は、基板２の第１面２１上に実装されている。煙検知部４の（後述する）ラビリンス部４３は、その底部の下面に係合爪を有しており、その係合爪が基板２に形成されている係合穴に係合することで固定されている。また表示部８の光源８１も、基板２の第１面２１上に実装されている。 In this embodiment, at least four heat detection elements 30 of the heat detection unit 3 are surface-mounted on the first surface 21 (front surface) of the substrate 2. The first surface 21 is an upper surface (see FIG. 1). Here, as an example, the smoke detection unit 4 is also arranged on the same plane side as the first surface 21 of the substrate 2. The smoke detector 4 is mounted on the first surface 21 of the substrate 2. The labyrinth portion 43 (described later) of the smoke detector 4 has an engaging claw on the lower surface of its bottom, and the engaging claw engages with an engaging hole formed in the substrate 2 to fix it. Has been done. The light source 81 of the display unit 8 is also mounted on the first surface 21 of the substrate 2.
　制御部９、及び回路モジュールを構成する複数の電子部品は、基板２の第１面２１又は第２面２２に実装されている。制御部９、及び回路モジュールを構成する複数の電子部品は、基板２のみに実装されていなくてもよく、例えば、基板２の周辺に別の実装基板が配置されていて、当該実装基板に、それらの一部又は全部が実装されてもよい。 The control unit 9 and a plurality of electronic components forming the circuit module are mounted on the first surface 21 or the second surface 22 of the substrate 2. The control unit 9 and the plurality of electronic components configuring the circuit module may not be mounted only on the substrate 2, and for example, another mounting substrate may be arranged around the substrate 2 and the mounting substrate may include: Some or all of them may be implemented.
　以下、基板２の第１面２１（上面）の反対側の面を、第２面２２（下面）と呼ぶこともある。図３Ａでは、基板２は、透視化されており、その第２面２２が見えている。熱検知素子３０、光源８１及び煙検知部４は、実際には、第２面２２の裏側の第１面２１に実装されているが、説明の便宜上、図３Ａではこれらも透視化されて図示している。特に、図３Ａでは、煙検知部４のラビリンス部４３内に配置される光学素子４１及び受光素子４２について点（ドット）により簡略化した上で図示している。 Hereinafter, the surface opposite to the first surface 21 (upper surface) of the substrate 2 may be referred to as the second surface 22 (lower surface). In FIG. 3A, the substrate 2 is transparent and its second surface 22 is visible. The heat detection element 30, the light source 81, and the smoke detection unit 4 are actually mounted on the first surface 21 on the back side of the second surface 22, but for convenience of description, these are also shown in perspective in FIG. 3A. Shows. In particular, in FIG. 3A, the optical element 41 and the light receiving element 42 arranged in the labyrinth portion 43 of the smoke detecting portion 4 are illustrated by being simplified by dots.
　第１面２１及び第２面２２のうち、第１面２１が、設置面５５に近い側の面に相当する。したがって、熱検知素子３０及び煙検知部４は、いずれも、基板２における設置面５５に近い側の面に配置されているといえる。 The first surface 21 of the first surface 21 and the second surface 22 corresponds to the surface closer to the installation surface 55. Therefore, it can be said that the heat detection element 30 and the smoke detection unit 4 are both arranged on the surface of the substrate 2 on the side close to the installation surface 55.
　以下、基板２の構造について詳しく説明する。基板２は、図３Ａに示すように、円形状の本体部２００と、本体部２００の縁において、本体部２００の中心から離れる方向に延出した複数（図示例では８つ）の延出部分を有している。以下、８つの延出部分を、一対の第１延出部２０１、一対の第２延出部２０２、一対の第３延出部２０３、及び一対の第４延出部２０４と呼ぶ。 The structure of the substrate 2 will be described in detail below. As shown in FIG. 3A, the substrate 2 has a circular main body portion 200, and a plurality of (eight in the illustrated example) extending portions that extend in a direction away from the center of the main body portion 200 at the edges of the main body portion 200. have. Hereinafter, the eight extended portions will be referred to as a pair of first extended portions 201, a pair of second extended portions 202, a pair of third extended portions 203, and a pair of fourth extended portions 204.
　煙検知部４は、本体部２００の上面に配置されている。一方、４つの熱検知素子３０、及び２つの光源８１は、６つの延出部（２０１、２０２、２０３）に、それぞれ配置されている。 The smoke detector 4 is arranged on the upper surface of the main body 200. On the other hand, the four heat detecting elements 30 and the two light sources 81 are arranged in the six extending portions (201, 202, 203), respectively.
　一対の第１延出部２０１は、本体部２００の左右の縁から、それぞれ、互いに離れる方向に延出している。各第１延出部２０１の上面に、対応する１個の接続片１０１が配置されている。また各第１延出部２０１は、その先端に、さらに幅狭の小片部Ｙ１を有している。各小片部Ｙ１の上面に、対応する１つの熱検知素子３０が配置されている。 The pair of first extending portions 201 extend from the left and right edges of the main body portion 200 in directions away from each other. One corresponding connecting piece 101 is arranged on the upper surface of each first extending portion 201. Further, each of the first extending portions 201 has a narrower piece portion Y1 at the tip thereof. One corresponding heat detection element 30 is arranged on the upper surface of each small piece portion Y1.
　一対の第２延出部２０２は、本体部２００の前後の縁から、それぞれ、互いに離れる方向に延出している。第２延出部２０２の延出量は、他の延出部の延出量よりも少ない。各第２延出部２０２の上面に、対応する１つの光源８１が配置されている。 The pair of second extending portions 202 extend from the front and rear edges of the main body portion 200 in directions away from each other. The extension amount of the second extension portion 202 is smaller than the extension amounts of the other extension portions. One corresponding light source 81 is arranged on the upper surface of each second extending portion 202.
　一対の第３延出部２０３は、基板２の下側から見て、本体部２００の前後の縁より反時計回りの方向に少しずれた位置から、それぞれ、互いに離れる方向に延出している。具体的には、前側の第３延出部２０３は、前側の第２延出部２０２の左横に配置され、後側の第３延出部２０３は、後側の第２延出部２０２の右横に配置されている。各第３延出部２０３も、第１延出部２０１と同様に、その先端に、さらに幅狭の小片部Ｙ１を有している。各小片部Ｙ１の上面に、対応する１つの熱検知素子３０が配置されている。 The pair of third extending portions 203 respectively extend away from each other from positions slightly offset in the counterclockwise direction from the front and rear edges of the main body portion 200 when viewed from the lower side of the substrate 2. Specifically, the third extension portion 203 on the front side is disposed on the left side of the second extension portion 202 on the front side, and the third extension portion 203 on the rear side is the second extension portion 202 on the rear side. It is located on the right side of. Similarly to the first extending portion 201, each of the third extending portions 203 also has a narrower piece portion Y1 at the tip thereof. One corresponding heat detection element 30 is arranged on the upper surface of each small piece portion Y1.
　一対の第４延出部２０４は、基板２の下側から見て、本体部２００の前後の縁から時計回りの方向に少しずれた位置から、それぞれ、互いに離れる方向に延出している。具体的には、前側の第４延出部２０４は、前側の第２延出部２０２の右横に配置され、後側の第４延出部２０４は、後側の第２延出部２０２の左横に配置されている。各第４延出部２０４の上面に、対応する１個の接続片１０１が配置されている。 The pair of fourth extending portions 204 extend in directions away from each other from positions slightly offset from the front and rear edges of the main body portion 200 in the clockwise direction when viewed from the lower side of the substrate 2. Specifically, the fourth extension portion 204 on the front side is disposed on the right side of the second extension portion 202 on the front side, and the fourth extension portion 204 on the rear side is the second extension portion 202 on the rear side. It is located to the left of. One corresponding connecting piece 101 is arranged on the upper surface of each fourth extending portion 204.
　要するに、基板２は、一例として、その中心を軸に１８０度回転させることで対称となる、二回対称の形状である。 In short, the substrate 2 has, for example, a two-fold symmetric shape that is symmetrical by rotating the center of the substrate 2 by 180 degrees.
　ところで、４つの熱検知素子３０が配置されている一対の第１延出部２０１及び一対の第３延出部２０３の各々には、矩形状の開口を有した貫通孔３１（図３Ｂ参照）が設けられている。図３Ｂは、一例として、図３Ａの点線（想像線）で囲まれた円部分の拡大図である。貫通孔３１は、熱検知素子３０よりも内側（内部空間ＳＰ１の中心部側）に配置されている。熱検知素子３０と貫通孔３１とは、互いに隣接して配置されている。このような貫通孔３１が、各熱検知素子３０の傍に設けられていることで、熱検知素子３０の周囲において基板２が占める領域を減らすことができ、熱検知素子３０における熱が基板２を伝達して低くなってしまうことを抑制できる。すなわち、貫通孔３１によって熱絶縁性が向上される。貫通孔３１の開口面積は、熱検知素子３０の表面積（例えば基板２の上側から見た表面積）よりも大きいことが望ましい。 By the way, in each of the pair of first extending portions 201 and the pair of third extending portions 203 in which the four heat detecting elements 30 are arranged, a through hole 31 having a rectangular opening (see FIG. 3B). Is provided. FIG. 3B is an enlarged view of a circle portion surrounded by a dotted line (imaginary line) in FIG. 3A as an example. The through hole 31 is arranged inside the heat detection element 30 (on the side of the center of the internal space SP1). The heat detecting element 30 and the through hole 31 are arranged adjacent to each other. By providing such a through hole 31 near each heat detecting element 30, the area occupied by the substrate 2 around the heat detecting element 30 can be reduced, and the heat in the heat detecting element 30 can be absorbed by the substrate 2. Can be suppressed from being transmitted. That is, the through hole 31 improves the thermal insulation property. The opening area of the through hole 31 is preferably larger than the surface area of the heat detecting element 30 (for example, the surface area viewed from the upper side of the substrate 2).
　（２．４）熱検知部と煙検知部
　熱検知部３は、上述の通り、基板２の第１面２１に実装された４つの熱検知素子３０を有している（図４では１つのみ図示）。熱検知素子３０の数は、特に限定されず、１つでもよいが、少なくとも２つ以上であることが好ましい。そして、本実施形態における熱検知素子３０は、開口部７から流入した気体の熱を検知するチップサーミスタであり、基板２に表面実装されている。各熱検知素子３０は、互いに異なる１つの開口部７と対向するように配置されている。なお、流路６及び開口部７に対する熱検知素子３０の位置関係については、後の「（２．７）熱検知部の配置構造」の欄で詳しく説明する。 (2.4) Heat Detection Section and Smoke Detection Section The heat detection section 3 has the four heat detection elements 30 mounted on the first surface 21 of the substrate 2 as described above (one in FIG. 4). Only shown). The number of heat detecting elements 30 is not particularly limited, and may be one, but it is preferable that the number is at least two. The heat detecting element 30 in the present embodiment is a chip thermistor that detects the heat of the gas flowing from the opening 7, and is surface-mounted on the substrate 2. Each heat detection element 30 is arranged so as to face one opening 7 different from the other. The positional relationship of the heat detecting element 30 with respect to the flow path 6 and the opening 7 will be described in detail later in the section “(2.7) Arrangement structure of heat detecting section”.
　熱検知部３は、基板２上に形成されたパターン配線等を介して、制御部９と電気的に接続されている。各熱検知素子３０は、制御部９に電気信号（検知信号）を出力する。言い換えると、制御部９は、各熱検知素子３０から出力される電気信号を通じて、温度上昇に依存して変化し得る各熱検知素子３０の抵抗値を監視している。 The heat detection unit 3 is electrically connected to the control unit 9 via a pattern wiring or the like formed on the substrate 2. Each heat detection element 30 outputs an electric signal (detection signal) to the control unit 9. In other words, the control unit 9 monitors the resistance value of each heat detection element 30 that can change depending on the temperature rise, through the electric signal output from each heat detection element 30.
　熱検知部３は、熱検知素子３０以外に、熱検知素子３０からの電気信号を増幅する増幅回路、及びアナログ－デジタル変換する変換回路等を更に有してもよいし、あるいは増幅及び変換は、回路モジュール側で行われてもよい。 The heat detection unit 3 may further include, in addition to the heat detection element 30, an amplification circuit that amplifies an electric signal from the heat detection element 30, a conversion circuit that performs analog-digital conversion, or the like. , May be performed on the circuit module side.
　煙検知部４は、内部空間ＳＰ１の中央部に配置され、煙を検知するように構成されている。具体的には、煙検知部４は、基板２の本体部２００の上面に配置されて、かつその上部が裏カバー５２の収容凹部５２１に収められている。煙検知部４は、例えば煙を検知する光電式のセンサである。煙検知部４は、図４に示すように、光を放射する光学素子４１と、光学素子４１から放射された光を受光する受光素子４２と、ラビリンス部４３と、を有している。光学素子４１は、例えばＬＥＤ（Light Emitting Diode）である。受光素子４２は、例えばフォトダイオードである。ラビリンス部４３は、へん平な略円筒形状の外郭を有しているケースの内部に形成されている。煙検知部４のケースは、その外周面において気体をラビリンス部４３内に導入する複数の口を有して、かつ外光が内部に入射することを抑制する構造を有している。 The smoke detector 4 is arranged in the center of the internal space SP1 and is configured to detect smoke. Specifically, the smoke detector 4 is arranged on the upper surface of the main body 200 of the substrate 2, and the upper portion thereof is housed in the housing recess 521 of the back cover 52. The smoke detection unit 4 is, for example, a photoelectric sensor that detects smoke. As shown in FIG. 4, the smoke detection unit 4 includes an optical element 41 that emits light, a light receiving element 42 that receives the light emitted from the optical element 41, and a labyrinth portion 43. The optical element 41 is, for example, an LED (Light Emitting Diode). The light receiving element 42 is, for example, a photodiode. The labyrinth portion 43 is formed inside a case having a flat and substantially cylindrical outer shell. The case of the smoke detector 4 has a plurality of ports for introducing gas into the labyrinth portion 43 on the outer peripheral surface thereof, and has a structure for suppressing outside light from entering the inside.
　光学素子４１及び受光素子４２は、ラビリンス部４３内において、互いに対向しないように配置される。言い換えると、受光素子４２の受光面が、光学素子４１の照射光の光軸Ｃ１（図３Ａ参照）上から外れるように配置されている。 The optical element 41 and the light receiving element 42 are arranged in the labyrinth portion 43 so as not to face each other. In other words, the light receiving surface of the light receiving element 42 is arranged so as to be off the optical axis C1 (see FIG. 3A) of the irradiation light of the optical element 41.
　火災等の発生時には、煙が筐体５の開口部７を通じて筐体５内に入り、ラビリンス部４３内に導入され得る。ラビリンス部４３内に煙が存在しない場合、光学素子４１の照射光は、受光素子４２の受光面にほとんど到達しない。一方、ラビリンス部４３内に煙が存在する場合、光学素子４１の照射光が煙によって散乱し、散乱した光の一部が受光素子４２の受光面に到達する。つまり、煙検知部４は、煙によって散乱された光学素子４１の照射光を受光素子４２で受光する。 When a fire or the like occurs, smoke may enter the casing 5 through the opening 7 of the casing 5 and be introduced into the labyrinth portion 43. When there is no smoke in the labyrinth portion 43, the irradiation light of the optical element 41 hardly reaches the light receiving surface of the light receiving element 42. On the other hand, when smoke is present in the labyrinth portion 43, the irradiation light of the optical element 41 is scattered by the smoke, and a part of the scattered light reaches the light receiving surface of the light receiving element 42. That is, in the smoke detector 4, the light receiving element 42 receives the irradiation light of the optical element 41 scattered by the smoke.
　煙検知部４の受光素子４２は、制御部９と電気的に接続されている。煙検知部４は、受光素子４２で受光された光量に応じた電圧レベルを示す電気信号（検知信号）を制御部９に送信する。制御部９は、煙検知部４から受け取った検知信号の光量を煙濃度に換算して火災の判定を行う。制御部９は、光量をそのまま閾値判定に用いてもよい。煙検知部４は、受光素子４２で受光された光量を煙濃度に換算してから煙濃度に応じた電圧レベルを示す検知信号を制御部９に送信してもよい。 The light receiving element 42 of the smoke detector 4 is electrically connected to the controller 9. The smoke detection unit 4 transmits to the control unit 9 an electric signal (detection signal) indicating a voltage level corresponding to the amount of light received by the light receiving element 42. The control unit 9 converts the light amount of the detection signal received from the smoke detection unit 4 into smoke density and determines a fire. The control unit 9 may use the light amount as it is for the threshold determination. The smoke detection unit 4 may convert the amount of light received by the light receiving element 42 into smoke concentration, and then transmit a detection signal indicating a voltage level corresponding to the smoke concentration to the control unit 9.
　煙検知部４は、受光素子４２からの電気信号を増幅する増幅回路、及びアナログ－デジタル変換する変換回路等を更に有してもよいし、あるいは増幅及び変換は、回路モジュール側で行われてもよい。また煙検知用の光学素子４１の数は、１つに限定されず、複数でもよい。 The smoke detection unit 4 may further include an amplifier circuit that amplifies the electric signal from the light receiving element 42, a conversion circuit that performs analog-digital conversion, or the like, or the amplification and conversion is performed on the circuit module side. Good. The number of optical elements 41 for smoke detection is not limited to one, and may be plural.
　（２．５）表示部
　表示部８は、一対の光源８１と、一対のガイド部８２とを有している。各光源８１は、例えば、平板状の実装基板の実装面の中央に少なくとも１個のＬＥＤチップが実装された、パッケージ型のＬＥＤとして構成される。各光源８１は、上述の通り、基板２上に実装されている。各ガイド部８２は、略Ｌ字形状に形成された、透光性を有している部位である。各ガイド部８２は、基板２上の対応する光源８１と対向し、かつ光源８１から放射された光が入射する入射面を有している。各ガイド部８２は、入射面から入射した光がガイド部８２の外部に出射される出射面を有している。各ガイド部８２の出射面は、表カバー５１の対応する孔部５１３を介して露出している。 (2.5) Display Unit The display unit 8 has a pair of light sources 81 and a pair of guides 82. Each light source 81 is configured as, for example, a package type LED in which at least one LED chip is mounted in the center of the mounting surface of a flat mounting substrate. Each light source 81 is mounted on the substrate 2 as described above. Each guide portion 82 is a light-transmitting portion formed in a substantially L shape. Each of the guide portions 82 faces the corresponding light source 81 on the substrate 2 and has an incident surface on which the light emitted from the light source 81 is incident. Each guide portion 82 has an emission surface through which the light incident from the incident surface is emitted to the outside of the guide portion 82. The emission surface of each guide portion 82 is exposed through the corresponding hole portion 513 of the front cover 51.
　表示部８は、感知器１の動作状態を外部に通知する、作動灯である。通常時（火災の監視時）には、回路モジュールの点灯回路は、制御部９の制御下で光源８１を消灯させる。火災が発生したと判定したときには、回路モジュールの点灯回路は、制御部９の制御下で光源８１の点滅又は点灯を開始する。図４では、制御部９と表示部８との間における点灯回路の図示を省略している。 The display unit 8 is an operating light that notifies the operating state of the sensor 1 to the outside. Under normal conditions (when monitoring a fire), the lighting circuit of the circuit module turns off the light source 81 under the control of the control unit 9. When it is determined that a fire has occurred, the lighting circuit of the circuit module starts blinking or lighting of the light source 81 under the control of the control unit 9. In FIG. 4, the lighting circuit between the control unit 9 and the display unit 8 is omitted.
　（２．６）制御部
　制御部９は、例えば、ＣＰＵ（Central Processing Unit）及びメモリを主構成とするマイクロコントローラにて構成されている。言い換えれば、制御部９は、ＣＰＵ及びメモリを有するコンピュータにて実現されており、ＣＰＵがメモリに格納されているプログラムを実行することにより、コンピュータが制御部９として機能する。プログラムは、ここではメモリに予め記録されているが、インターネット等の電気通信回線を通じて、又はメモリカード等の非一時的な記録媒体に記録されて提供されてもよい。 (2.6) Control Unit The control unit 9 is composed of, for example, a microcontroller (CPU) having a CPU (Central Processing Unit) and a memory as main components. In other words, the control unit 9 is realized by a computer having a CPU and a memory, and the computer functions as the control unit 9 when the CPU executes the program stored in the memory. The program is recorded in the memory here in advance, but may be provided through an electric communication line such as the Internet or in a non-transitory recording medium such as a memory card.
　制御部９は、通信部１１、及び回路モジュール（点灯回路及び電源回路等）を制御するように構成されている。 The control unit 9 is configured to control the communication unit 11 and the circuit module (lighting circuit, power supply circuit, etc.).
　また制御部９は、熱検知部３及び煙検知部４からの検知信号を受信し、火災が発生したか否かを判定するように構成されている。具体的には、制御部９は、熱検知部３の４つの熱検知素子３０からの検知信号を個別に監視し、検知信号に含まれている信号レベル（抵抗値に相当）が閾値を上回る（又は下回る）熱検知素子３０が１つでも見つかると、火災が発生した判定する。また制御部９は、煙検知部４からの検知信号も監視し、検知信号に含まれている信号レベル（受光素子４２で受光された光量又は煙濃度に相当）が閾値を超えると、火災が発生した判定する。 The control unit 9 is also configured to receive detection signals from the heat detection unit 3 and the smoke detection unit 4 and determine whether a fire has occurred. Specifically, the control unit 9 individually monitors the detection signals from the four heat detection elements 30 of the heat detection unit 3, and the signal level (corresponding to the resistance value) included in the detection signals exceeds the threshold value. When even one (or lower) heat detecting element 30 is found, it is determined that a fire has occurred. The control unit 9 also monitors the detection signal from the smoke detection unit 4, and if the signal level included in the detection signal (corresponding to the amount of light received by the light receiving element 42 or the smoke concentration) exceeds a threshold value, a fire will occur. Determine what has occurred.
　制御部９は、熱検知に基づいて、又は煙検知に基づいて、火災が発生したと判定すると、通信部１１を介して、火災の発生を知らせる信号を、自動火災報知システムの受信機及び火災警報器等へ送信する。通信部１１は、例えば有線により、受信機及び火災警報器等と通信するための通信インターフェイスである。通信部１１は、取付部１０の接続片１０１、取付ベースのコネクタ部、及び、構造体Ｘ１の裏側に配線されている信号線を介して、受信機及び火災警報器等と通信可能に接続されている。また制御部９は、火災が発生したと判定すると、表示部８（作動灯）の光源８１を点滅又は点灯させるための制御信号を、回路モジュールの点灯回路へ出力する。 When the control unit 9 determines that a fire has occurred based on the heat detection or the smoke detection, the control unit 9 sends a signal indicating the occurrence of the fire via the communication unit 11 to the receiver of the automatic fire notification system and the fire. Send to an alarm device. The communication unit 11 is a communication interface for communicating with a receiver, a fire alarm device, and the like by wire, for example. The communication unit 11 is communicably connected to a receiver, a fire alarm device, and the like through the connection piece 101 of the mounting unit 10, the connector unit of the mounting base, and the signal line wired on the back side of the structure X1. ing. When the control unit 9 determines that a fire has occurred, it outputs a control signal for blinking or lighting the light source 81 of the display unit 8 (operation lamp) to the lighting circuit of the circuit module.
　（２．７）熱検知部の配置構造
　ここで本実施形態の熱検知部３の配置構造について説明する。 (2.7) Arrangement Structure of Heat Detection Unit Here, the arrangement structure of the heat detection unit 3 of the present embodiment will be described.
　本実施形態では、上述の通り、熱検知部３の熱検知素子３０が、基板２の第１面２１に実装されるチップサーミスタである。そのため、感知器１全体としての小型化（特に薄型化）を図ることができる。またリードタイプのサーミスタに比べて、サーミスタ自体のコスト、及びその実装コストについても、安価に抑えることができる。 In the present embodiment, as described above, the heat detection element 30 of the heat detection unit 3 is a chip thermistor mounted on the first surface 21 of the substrate 2. Therefore, the sensor 1 as a whole can be downsized (particularly thin). Further, the cost of the thermistor itself and the mounting cost thereof can be suppressed to be lower than those of the lead type thermistor.
　さらに本実施形態では、基板２の第１面２１（表面）の少なくとも一部の領域は、流路６に露出している。ここで、第１面２１の中央には煙検知部４が配置されており、筐体５の内部空間ＳＰ１の中央部は、概ね煙検知部４が占有している。流路６は、実質的に、内部空間ＳＰ１のうち中央部（煙検知部４）の周囲の空間に相当する。言い換えると、流路６は、概ねドーナツ形状となっている。したがって、本実施形態では、基板２の第１面２１の全領域うち、煙検知部４の実装領域以外の周辺領域が、流路６に露出していることになる。周辺領域には、上述した合計８つの延出部（２０１～２０４）の上面も含まれる。 Further, in the present embodiment, at least a part of the area of the first surface 21 (surface) of the substrate 2 is exposed in the flow path 6. Here, the smoke detector 4 is arranged in the center of the first surface 21, and the smoke detector 4 substantially occupies the center of the internal space SP1 of the housing 5. The flow path 6 substantially corresponds to the space around the central portion (smoke detection unit 4) of the internal space SP1. In other words, the flow path 6 has a generally donut shape. Therefore, in the present embodiment, the entire peripheral area of the first surface 21 of the substrate 2 other than the mounting area of the smoke detector 4 is exposed in the flow path 6. The peripheral area also includes the upper surfaces of the above-mentioned eight extending portions (201 to 204) in total.
　このように基板２の第１面２１の周辺領域が流路６に露出していることで、第１延出部２０１及び第３延出部２０３にある４つの熱検知素子３０が、チップサーミスタでありながらも、流路６を流れる気体に曝される可能性をより高めることができる。 Since the peripheral region of the first surface 21 of the substrate 2 is exposed to the flow path 6 in this way, the four thermal detection elements 30 in the first extending portion 201 and the third extending portion 203 are connected to the chip thermistor. However, the possibility of being exposed to the gas flowing through the flow path 6 can be further increased.
　すなわち、例えば火災等の発生に起因して熱を持った気体が下から上昇する際に、複数の開口部７から筐体５内に導入されて流路６を流れる。その時に、熱検知素子３０が、火災に相当する温度の熱を検知して、感知器１は、速やかに火災が発生していると判定できる。その結果、感知器１における熱の検知性能をより向上させつつ、感知器１の小型化を図ることができる。 That is, for example, when a gas having heat rises from below due to the occurrence of a fire or the like, it is introduced into the housing 5 through the plurality of openings 7 and flows through the flow path 6. At that time, the heat detection element 30 detects heat at a temperature corresponding to a fire, and the detector 1 can quickly determine that a fire has occurred. As a result, the sensor 1 can be downsized while further improving the heat detection performance of the sensor 1.
　ここで本実施形態の感知器１は煙検知部４も更に備えていて、流路６の奥となる内部空間ＳＰ１の中央部には、煙検知部４が位置している。言い換えれば、流路６は、熱も煙も通り得る共通の流路である。したがって、複数の開口部７から筐体５内に導入された気体が規定以上の煙濃度を有していれば、煙の検知も行える。したがって、火災の感知性能を高めつつ、感知器１全体としての小型化を図ることができる。 Here, the sensor 1 of the present embodiment further includes a smoke detection unit 4, and the smoke detection unit 4 is located at the center of the internal space SP1 behind the flow path 6. In other words, the flow path 6 is a common flow path through which heat and smoke can pass. Therefore, if the gas introduced into the housing 5 through the plurality of openings 7 has a smoke concentration higher than the specified value, smoke can be detected. Therefore, it is possible to reduce the size of the detector 1 as a whole while improving the fire detection performance.
　また本実施形態では、チップサーミスタである各熱検知素子３０は、互いに異なる１つの開口部７と対向するように配置されている。図１で言えば、左側にある熱検知素子３０は、左側にある１つの開口部７と対向するように配置され、右側にある熱検知素子３０は、右側にある別の開口部７と対向するように配置されている。そして、各熱検知素子３０は、外部空間ＳＰ２の側から、対応する開口部７の開口領域７０（図１及び図５参照）を見たときに、略矩形状の開口領域７０内に収まるように配置されている。言い換えれば、各熱検知素子３０は、筐体５の円筒体５１０の法線方向に沿ってその熱検知素子３０を見たときに、開口領域７０内に収まるように配置されている。要するに、開口領域７０に対して投影された熱検知素子３０の領域が、開口領域７０内に収まっている。したがって、熱検知素子３０の少なくとも一部が、開口領域７０の外、すなわち筐体５の円筒体５１０の裏側又は桟部５１２の裏側に隠れるように配置される場合に比べて、開口部７から入り込んだ気体に曝される可能性をより高めることができる。 Further, in the present embodiment, each heat detection element 30 which is a chip thermistor is arranged so as to face one opening 7 different from the other. In FIG. 1, the heat detection element 30 on the left side is arranged to face one opening 7 on the left side, and the heat detection element 30 on the right side faces another opening 7 on the right side. It is arranged to. Then, each heat detection element 30 is placed within the substantially rectangular opening area 70 when the opening area 70 (see FIGS. 1 and 5) of the corresponding opening 7 is viewed from the external space SP2 side. It is located in. In other words, each heat detection element 30 is arranged so as to be within the opening region 70 when the heat detection element 30 is viewed along the normal direction of the cylindrical body 510 of the housing 5. In short, the area of the heat detection element 30 projected onto the opening area 70 is contained in the opening area 70. Therefore, as compared with the case where at least a part of the heat detecting element 30 is arranged so as to be hidden outside the opening region 70, that is, behind the cylindrical body 510 of the housing 5 or the back side of the crosspiece 512, the heat detecting element 30 is not exposed from the opening 7. The possibility of being exposed to the gas that has entered can be increased.
　特に本実施形態では、チップサーミスタである各熱検知素子３０は、図５に示すように、外部空間ＳＰ２の側から開口領域７０を見たときに、開口領域７０内において、第１面２１と直交する方向（上下方向）における開口領域７０の中央に位置する。言い換えると、各熱検知素子３０が開口領域７０の中央に位置するように、開口部７と基板２との位置関係が規定されている。この位置関係は、例えば、表カバー５１の基部５１１の裏側から突出して基板２と接触しているリブ５１４（図１参照）の突出量、及び取付部１０の接続片１０１の差込量等によって調整される。このような位置関係により、例えば熱検知素子３０が開口領域７０の一端寄り（上端寄り又は下端寄り）に位置する場合に比べて、熱検知素子３０が、開口部７から入り込んだ気体に曝される可能性を更に高めることができる。 In particular, in the present embodiment, as shown in FIG. 5, each heat detection element 30 which is a chip thermistor has the first surface 21 within the opening area 70 when the opening area 70 is viewed from the external space SP2 side. It is located at the center of the opening region 70 in the orthogonal direction (vertical direction). In other words, the positional relationship between the opening 7 and the substrate 2 is defined so that each heat detecting element 30 is located at the center of the opening region 70. This positional relationship depends on, for example, the protrusion amount of the rib 514 (see FIG. 1) protruding from the back side of the base portion 511 of the front cover 51 and in contact with the substrate 2 and the insertion amount of the connection piece 101 of the mounting portion 10. Adjusted. Due to such a positional relationship, for example, the heat detecting element 30 is exposed to the gas entering from the opening 7 as compared with the case where the heat detecting element 30 is positioned near one end (closer to the upper end or closer to the lower end) of the opening region 70. It is possible to further increase the possibility.
　また本実施形態では、各熱検知素子３０は、単に煙検知部４の側方に配置されているのではなく、開口部７の近傍に配置されている。言い換えると、流路６を、開口部７の側にある第１路６１と、第１路６１と繋がっていて内部空間ＳＰ１の中央部の側にある第２路６２とに分けると、チップサーミスタである各熱検知素子３０は第１路６１内にある（図１参照）。したがって、例えばチップサーミスタが第２路６２内にある場合に比べて、感知器１における熱検知に関する応答性を高めることができる。なお、既述の通り、図１では流路６を模式的に矢印線で図示しているが、実際には、第１路６１は、内部空間ＳＰ１における煙検知部４の周囲の空隙部分のうちの外側半分に相当し、第２路６２は、空隙部分のうちの内側半分に相当する。 Further, in the present embodiment, each heat detection element 30 is arranged not in the side of the smoke detection section 4 but in the vicinity of the opening 7. In other words, if the flow path 6 is divided into a first path 61 on the side of the opening 7 and a second path 62 connected to the first path 61 and on the side of the central portion of the internal space SP1, the chip thermistor Each heat detecting element 30 is in the first path 61 (see FIG. 1). Therefore, as compared with the case where the chip thermistor is in the second path 62, for example, it is possible to improve the responsiveness regarding the heat detection in the sensor 1. Note that, as described above, the flow path 6 is schematically illustrated by the arrow line in FIG. 1, but in reality, the first path 61 is a void portion around the smoke detection unit 4 in the internal space SP1. The second path 62 corresponds to the inner half of the void portion.
　ところで、基板２の厚み方向（上下方向）において、ラビリンス部４３の内部空間の中心Ｐ１は、上下方向において、チップサーミスタである熱検知素子３０と設置面５５との間にあることが好ましい（図１参照）。言い換えると、熱検知素子３０は、上下方向において、中心Ｐ１よりも下側にある。図３Ａでは、ラビリンス部４３内に配置されている光学素子４１及び受光素子４２を模式的に点（ドット）で図示している。本実施形態では、光学素子４１及び受光素子４２の高さは、互いに同じであり、光学素子４１の光軸Ｃ１と受光素子４２の光軸Ｃ２との交点は、一例として、中心Ｐ１と略一致する。 By the way, in the thickness direction (vertical direction) of the substrate 2, the center P1 of the internal space of the labyrinth portion 43 is preferably located between the thermal detection element 30 which is a chip thermistor and the installation surface 55 in the vertical direction (FIG. 1). In other words, the heat detecting element 30 is below the center P1 in the vertical direction. In FIG. 3A, the optical element 41 and the light receiving element 42 arranged in the labyrinth portion 43 are schematically illustrated by dots. In the present embodiment, the heights of the optical element 41 and the light receiving element 42 are the same as each other, and the intersection of the optical axis C1 of the optical element 41 and the optical axis C2 of the light receiving element 42 substantially coincides with the center P1 as an example. To do.
　光学素子４１及び受光素子４２の高さ位置、並びに光軸Ｃ１及びＣ２の向きは、光軸Ｃ１が、受光素子４２の受光面と交わらない限り、特に限定されない。例えば、光学素子４１及び受光素子４２のうちのいずれか一方の高さは、他方の高さよりも低くてもよい。また光軸Ｃ１と光軸Ｃ２は、互いに交わらなくてもよい。この場合、煙検知部４の側方から見て光軸Ｃ１と光軸Ｃ２との間の中点が、中心Ｐ１と略一致してもよい。 The height positions of the optical element 41 and the light receiving element 42 and the directions of the optical axes C1 and C2 are not particularly limited as long as the optical axis C1 does not intersect the light receiving surface of the light receiving element 42. For example, the height of either the optical element 41 or the light receiving element 42 may be lower than the height of the other. Further, the optical axis C1 and the optical axis C2 may not intersect with each other. In this case, the midpoint between the optical axis C1 and the optical axis C2 when viewed from the side of the smoke detection unit 4 may substantially coincide with the center P1.
　このように中心Ｐ１が熱検知素子３０と設置面５５との間にあることで、熱を持った気体が筐体５内の流路６を流れる際に、上昇気流が発生するという特性に対して、熱検知素子３０を通過した煙（気体）を効果的に煙検知部４へ誘導することができる。したがって、熱だけでなく煙も検知する感知器１において、火災の感知性能を更に高めつつ、感知器１全体としての小型化を図ることができる。 As described above, since the center P1 is between the heat detecting element 30 and the installation surface 55, an ascending air current is generated when a gas having heat flows through the flow path 6 in the housing 5. Thus, the smoke (gas) that has passed through the heat detection element 30 can be effectively guided to the smoke detection unit 4. Therefore, in the sensor 1 that detects not only heat but also smoke, the size of the sensor 1 as a whole can be reduced while further improving the fire detection performance.
　（３）変形例
　上記実施形態は、本開示の様々な実施形態の一つに過ぎない。上記実施形態は、本開示の目的を達成できれば、設計等に応じて種々の変更が可能である。また、上記実施形態に係る感知器１と同様の機能は、感知器１の制御方法、コンピュータプログラム、又はコンピュータプログラムを記録した非一時的記録媒体等で具現化されてもよい。 (3) Modifications The above embodiments are merely one of various embodiments of the present disclosure. The above embodiment can be variously modified according to the design and the like as long as the object of the present disclosure can be achieved. Further, the same function as that of the sensor 1 according to the above-described embodiment may be embodied by a control method of the sensor 1, a computer program, or a non-transitory recording medium having the computer program recorded therein.
　以下、上記実施形態の変形例を列挙する。以下に説明する変形例は、適宜組み合わせて適用可能である。なお、以下では、上記実施形態を「基本例」と呼ぶこともある。 The following is a list of modifications of the above embodiment. The modifications described below can be applied in appropriate combinations. In addition, below, the above-mentioned embodiment may be called a "basic example."
　本開示における感知器１の制御部９は、コンピュータシステムを含んでいる。コンピュータシステムは、ハードウェアとしてのプロセッサ及びメモリを主構成とする。コンピュータシステムのメモリに記録されたプログラムをプロセッサが実行することによって、本開示における感知器１の制御部９としての機能が実現される。プログラムは、コンピュータシステムのメモリに予め記録されてもよく、電気通信回線を通じて提供されてもよく、コンピュータシステムで読み取り可能なメモリカード、光学ディスク、ハードディスクドライブ等の非一時的記録媒体に記録されて提供されてもよい。コンピュータシステムのプロセッサは、半導体集積回路（ＩＣ）又は大規模集積回路（ＬＳＩ）を含む１ないし複数の電子回路で構成される。ここでいうＩＣ又はＬＳＩ等の集積回路は、集積の度合いによって呼び方が異なっており、システムＬＳＩ、ＶＬＳＩ（Very Large Scale Integration）、又はＵＬＳＩ（Ultra Large Scale Integration）と呼ばれる集積回路を含む。さらに、ＬＳＩの製造後にプログラムされる、ＦＰＧＡ（Field-Programmable Gate Array）、又はＬＳＩ内部の接合関係の再構成若しくはＬＳＩ内部の回路区画の再構成が可能な論理デバイスについても、プロセッサとして採用することができる。複数の電子回路は、１つのチップに集約されていてもよいし、複数のチップに分散して設けられていてもよい。複数のチップは、１つの装置に集約されていてもよいし、複数の装置に分散して設けられていてもよい。ここでいうコンピュータシステムは、１以上のプロセッサ及び１以上のメモリを有するマイクロコントローラを含む。したがって、マイクロコントローラについても、半導体集積回路又は大規模集積回路を含む１ないし複数の電子回路で構成される。 The control unit 9 of the sensor 1 according to the present disclosure includes a computer system. The computer system mainly has a processor and a memory as hardware. The function as the control unit 9 of the sensor 1 according to the present disclosure is realized by the processor executing the program recorded in the memory of the computer system. The program may be pre-recorded in the memory of the computer system, may be provided through an electric communication line, or may be recorded in a non-transitory recording medium such as a memory card, an optical disk, a hard disk drive, which can be read by the computer system. May be provided. A processor of a computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large-scale integrated circuit (LSI). The integrated circuit such as an IC or an LSI referred to here has a different name depending on the degree of integration, and includes an integrated circuit called a system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). In addition, FPGAs (Field-Programmable Gate Arrays) that are programmed after the LSI is manufactured, or logic devices that can reconfigure the junction relationships inside the LSI or the circuit sections inside the LSI can also be used as processors. You can The plurality of electronic circuits may be integrated on one chip, or may be provided separately on a plurality of chips. The plurality of chips may be integrated in one device, or may be provided separately in a plurality of devices. The computer system includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.
　また、感知器１の制御部９における複数の機能が、１つの筐体内に集約されていることは感知器１に必須の構成ではなく、感知器１の構成要素は、複数の筐体に分散して設けられていてもよい。さらに、感知器１の少なくとも一部の機能、例えば、感知器１の一部の機能がクラウド（クラウドコンピューティング）等によって実現されてもよい。反対に、基本例のように、感知器１の複数の機能が１つの筐体内に集約されていてもよい。 Further, it is not an essential configuration of the sensor 1 that the plurality of functions of the control unit 9 of the sensor 1 are integrated in one housing, and the constituent elements of the sensor 1 are distributed in the plurality of housings. It may be provided. Furthermore, at least a part of the functions of the sensor 1, for example, a part of the functions of the sensor 1 may be realized by a cloud (cloud computing) or the like. On the contrary, as in the basic example, the plurality of functions of the sensor 1 may be integrated in one housing.
　（３．１）変形例１
　以下、本変形例（変形例１）の感知器１Ａについて、図６を参照しながら説明する。基本例の感知器１と概ね共通する構成要素については、同じ参照符号を付してそれらの説明を適宜に省略することもある。なお、図６は、感知器１Ａの模式的な断面図を示す。 (3.1) Modification 1
Hereinafter, the sensor 1A of the present modification (Modification 1) will be described with reference to FIG. Constituent elements that are substantially common to the sensor 1 of the basic example are denoted by the same reference numerals, and description thereof may be appropriately omitted. Note that FIG. 6 shows a schematic cross-sectional view of the sensor 1A.
　感知器１Ａは、内部空間ＳＰ１内に、気流調整部Ｚ１を備えている点で、基本例と異なる。気流調整部Ｚ１は、筐体５の表カバー５１における円筒体５１０の下縁から、煙検知部４に向かって延び出ている。気流調整部Ｚ１は、上下方向から見て、略ドーナツ状の板部材である。気流調整部Ｚ１は、表カバー５１と一体となって形成されてもよいし、表カバー５１とは別部材で、表カバー５１に対してネジ止め等により固定されてもよい。 The sensor 1A differs from the basic example in that the airflow adjusting unit Z1 is provided in the internal space SP1. The airflow adjusting unit Z1 extends from the lower edge of the cylindrical body 510 in the front cover 51 of the housing 5 toward the smoke detecting unit 4. The airflow adjusting unit Z1 is a plate member having a substantially donut shape when viewed in the vertical direction. The airflow adjusting unit Z1 may be formed integrally with the front cover 51, or may be a member separate from the front cover 51 and fixed to the front cover 51 by screwing or the like.
　気流調整部Ｚ１は、開口部７の縁から筐体５内に向かって一定の距離の間、基板２に沿って真っ直ぐ延びている。ただし、気流調整部Ｚ１は、途中から内部空間ＳＰ１の中央部に向かうほど、設置面５５に近づく方向に傾斜している。 The airflow adjusting unit Z1 extends straight along the substrate 2 for a certain distance from the edge of the opening 7 into the housing 5. However, the airflow adjusting unit Z1 is inclined toward the installation surface 55 as it goes from the middle to the center of the internal space SP1.
　つまり、感知器１Ａでは、気流調整部Ｚ１が設けられていることにより、開口部７と内部空間ＳＰ１の中央部とを結ぶ方向に沿って見たときの、第１路６１の開口断面積は、第２路６２の開口断面積よりも小さく設定されている。したがって、開口部７を通じて流路６内へ入った気体を、狭い空間の第１路６１から、広い空間の第２路６２に向かって流れるように促進させることができる。 That is, in the sensor 1A, since the airflow adjusting unit Z1 is provided, the opening cross-sectional area of the first passage 61 when viewed along the direction connecting the opening 7 and the central portion of the internal space SP1 is , Smaller than the opening cross-sectional area of the second path 62. Therefore, the gas that has entered the flow path 6 through the opening 7 can be promoted to flow from the first path 61 having a narrow space toward the second path 62 having a wide space.
　特に、気流調整部Ｚ１が途中から設置面５５に近づく方向に傾斜しているため、第２路６２は、第１路６１から上記中央部に向かうほど、設置面５５に近づく方向に拡がっている。したがって、熱を持った気体が筐体５内の流路６を流れる際に、上昇気流が発生するという特性に対して、熱検知素子３０を通過した煙（気体）を効果的に煙検知部４へ誘導することができる。 In particular, since the airflow adjusting unit Z1 is inclined in the direction of approaching the installation surface 55 from the middle, the second path 62 expands in the direction of approaching the installation surface 55 from the first path 61 toward the central portion. . Therefore, the smoke (gas) that has passed through the heat detecting element 30 can be effectively treated by the smoke detecting section against the characteristic that an ascending air current is generated when the gas having heat flows through the flow path 6 in the housing 5. You can lead to 4.
　（３．２）変形例２
　以下、本変形例（変形例２）の感知器１Ｂについて、図７を参照しながら説明する。基本例の感知器１と概ね共通する構成要素については、同じ参照符号を付してそれらの説明を適宜に省略することもある。なお、図７は、感知器１Ｂの模式的な断面図を示す。 (3.2) Modification 2
Hereinafter, the sensor 1B of this modification (Modification 2) will be described with reference to FIG. Constituent elements that are substantially common to the sensor 1 of the basic example are denoted by the same reference numerals, and description thereof may be appropriately omitted. Note that FIG. 7 shows a schematic cross-sectional view of the sensor 1B.
　感知器１Ｂは、煙検知部４が基板２の第１面２１ではなく、第２面２２に実装されている点で、基本例と異なる。なお、熱検知素子３０は、基本例と同様に、第１面２１に実装されている。 The sensor 1B differs from the basic example in that the smoke detection unit 4 is mounted on the second surface 22 of the substrate 2 instead of the first surface 21. The heat detecting element 30 is mounted on the first surface 21 as in the basic example.
　この感知器１Ｂの筐体５では、煙検知部４が第２面２２（下面）に実装されているため、表カバー５１が、煙検知部４を収容する収容凹部５１５を有している。具体的には、表カバー５１の基部５１１は、その中央部が下方に凸となるように形成されている。なお、基本例では、裏カバー５２が、煙検知部４の上部を収容するための収容凹部５２１を有している（図１参照）。 In the case 5 of the sensor 1B, since the smoke detector 4 is mounted on the second surface 22 (lower surface), the front cover 51 has the housing recess 515 for housing the smoke detector 4. Specifically, the base portion 511 of the front cover 51 is formed such that the central portion thereof is convex downward. In the basic example, the back cover 52 has an accommodating recess 521 for accommodating the upper portion of the smoke detecting section 4 (see FIG. 1).
　基部５１１は、その凸となる部位５１１０の周壁に、気体（煙）を筐体５内に導入させる孔部５１１１を有している。 The base 511 has a hole 5111 for introducing gas (smoke) into the housing 5 on the peripheral wall of the convex portion 5110.
　また流路６は、基板２を境に、上側流路６Ｘと、下側流路６Ｙの２手に分かれるように構成されている。上側流路６Ｘを通る熱を持った気体は、熱検知素子３０を通ることになる。また下側流路６Ｙを通る気体の一部は、基板２の貫通孔３１（図３Ｂ参照）を通って上側流路６Ｘへ上昇し、熱検知素子３０を通ることになる。また下側流路６Ｙを通る気体の残りは、そのまま中央部の煙検知部４に向かう。 The channel 6 is divided into two parts, an upper channel 6X and a lower channel 6Y, with the substrate 2 as a boundary. The gas having heat passing through the upper flow path 6X passes through the heat detecting element 30. Further, a part of the gas passing through the lower flow path 6Y goes up to the upper flow path 6X through the through hole 31 (see FIG. 3B) of the substrate 2 and passes through the heat detecting element 30. The rest of the gas passing through the lower flow path 6Y goes directly to the smoke detector 4 in the center.
　（３．３）変形例３
　以下、本変形例（変形例３）の感知器１Ｃについて、図８Ａ及び図８Ｂを参照しながら説明する。基本例の感知器１と概ね共通する構成要素については、同じ参照符号を付してそれらの説明を適宜に省略することもある。なお、図８Ａは、感知器１Ｃを下側から見た斜視図で、図８Ｂは、感知器１Ｃの下側から見た、一部（基板２のみ）透視化されている平面図である。 (3.3) Modification 3
Hereinafter, the sensor 1C of the present modification (Modification 3) will be described with reference to FIGS. 8A and 8B. Constituent elements that are substantially common to the sensor 1 of the basic example are denoted by the same reference numerals, and description thereof may be appropriately omitted. Note that FIG. 8A is a perspective view of the sensor 1C viewed from below, and FIG. 8B is a plan view of a part (only the substrate 2) viewed from below of the sensor 1C.
　感知器１Ｃは、一例として、いわゆるＰ型（Proprietary-type）の通信方式で火災信号を外部に送信する、Ｐ型熱感知器である。感知器１Ｃは、基本例と同様に熱検知部３を備える一方で、基本例と異なり煙検知部４を備えていない。すなわち、感知器１Ｃは、熱の検知のみにより火災等の発生を判定する。 The detector 1C is, for example, a P-type heat detector that transmits a fire signal to the outside by a so-called P-type (Proprietary-type) communication method. The sensor 1C includes the heat detection unit 3 as in the basic example, but does not include the smoke detection unit 4 unlike the basic example. That is, the sensor 1C determines the occurrence of a fire or the like only by detecting heat.
　また感知器１Ｃでは、熱検知素子３０の数が３つである点も、基本例と異なる（基本例では４つ）。 Also, the sensor 1C differs from the basic example in that the number of heat detecting elements 30 is three (four in the basic example).
　感知器１Ｃの基板２は、図８Ｂに示すように、基板２を下側から見て略菱形状となっている。３つの熱検知素子３０のうち２つは、その菱形状の基板２の第１面２１（上面）に表面実装されている。当該２つの熱検知素子３０は、第１面２１（上面）において、左右方向における対角する位置に、それぞれ配置されている。具体的には、基板２は、対角する位置における両縁部に、外方に向かって（左右方向に対してやや傾きを持って）突出する、一対の凸部２３を、有している。各凸部２３の上面に、対応する熱検知素子３０が配置されている。もう１つの熱検知素子３０は、基板２の中央部の上面に配置されている。 As shown in FIG. 8B, the substrate 2 of the sensor 1C has a substantially rhombic shape when the substrate 2 is viewed from below. Two of the three heat detecting elements 30 are surface-mounted on the first surface 21 (upper surface) of the diamond-shaped substrate 2. The two heat detection elements 30 are arranged at diagonal positions in the left-right direction on the first surface 21 (upper surface). Specifically, the substrate 2 has a pair of convex portions 23 protruding outward (having a slight inclination with respect to the left-right direction) at both edge portions at diagonal positions. . A corresponding heat detecting element 30 is arranged on the upper surface of each convex portion 23. The other heat detecting element 30 is arranged on the upper surface of the central portion of the substrate 2.
　また基本例と同様に、各熱検知素子３０の近傍には、熱絶縁性を向上させるために貫通孔３１が設けられている。ただし、基板２の中央部に配置されている熱検知素子３０については、半円状の２つの貫通孔３１が、その熱検知素子３０を間に挟むように配置されている。 Also, as in the basic example, through holes 31 are provided in the vicinity of each heat detection element 30 in order to improve heat insulation. However, with respect to the heat detecting element 30 arranged in the central portion of the substrate 2, two semicircular through holes 31 are arranged so as to sandwich the heat detecting element 30 therebetween.
　また感知器１Ｃの表カバー５１は、その基部５１１に、１つの流入口（縦孔）７Ｂと、２つの補助口（縦孔）５６と、を有している。２つの補助口５６は、基部５１１の左右の両縁近傍に配置され、流入口７Ｂは、基部５１１の中央に配置されている。流入口７Ｂ及び２つの補助口５６の各々は、表カバー５１の基部５１１をその厚み方向に貫通している。基部５１１の左右の両縁近傍にある２つの補助口５６は、略三日月形状の開口を有し、基部５１１の中央にある流入口７Ｂは、略円形状の開口を有している。そして、基板２の一対の凸部２３は、２つの補助口５６とそれぞれ一対一で対応するように対向し、基板２の中央部は、中央の流入口７Ｂと対向する。その結果、凸部２３及び基板２の中央部は、図８Ｂに示すように、２つの補助口５６と流入口７Ｂとからそれぞれ露出している。したがって、上昇してくる熱を持った気体は、２つの補助口５６及び流入口７Ｂを通って筐体５内に入り、さらに貫通孔３１を通って第１面２１（上面）側に流れ込む。よって、熱検知素子３０は、開口部７（側面口７Ａ：横孔）から流入してくる気体だけでなく、２つの補助口５６及び流入口７Ｂから流入してくる気体にも曝され易くなる。 Further, the front cover 51 of the sensor 1C has one inflow port (vertical hole) 7B and two auxiliary ports (vertical hole) 56 at its base 511. The two auxiliary ports 56 are arranged near both left and right edges of the base 511, and the inflow port 7B is arranged in the center of the base 511. Each of the inflow port 7B and the two auxiliary ports 56 penetrates the base portion 511 of the front cover 51 in the thickness direction thereof. The two auxiliary ports 56 near the left and right edges of the base 511 have a substantially crescent-shaped opening, and the inflow port 7B at the center of the base 511 has a substantially circular opening. The pair of convex portions 23 of the substrate 2 face the two auxiliary ports 56 in a one-to-one correspondence, and the central portion of the substrate 2 faces the central inlet 7B. As a result, the convex portion 23 and the central portion of the substrate 2 are respectively exposed from the two auxiliary ports 56 and the inflow port 7B, as shown in FIG. 8B. Therefore, the rising gas having heat enters the housing 5 through the two auxiliary ports 56 and the inflow port 7B, and further flows into the first surface 21 (upper surface) side through the through hole 31. Therefore, the heat detecting element 30 is easily exposed not only to the gas flowing in from the opening 7 (side opening 7A: lateral hole) but also to the gas flowing in from the two auxiliary openings 56 and the inflow opening 7B. .
　この構成においても、火災の感知性能を更に高めつつ、感知器１Ｃ全体としての小型化（特に薄型化）を図ることができる。 Even with this configuration, it is possible to reduce the size of the detector 1C as a whole (especially to reduce the thickness) while further improving the fire detection performance.
　（３．４）変形例４
　以下、本変形例（変形例４）の感知器１Ｄについて、図９Ａ及び図９Ｂを参照しながら説明する。基本例の感知器１と概ね共通する構成要素については、同じ参照符号を付してそれらの説明を適宜に省略することもある。なお、図９Ａは、感知器１Ｄを下側から見た斜視図で、図９Ｂは、感知器１Ｄの下側から見た、一部（基板２のみ）透視化されている平面図である。 (3.4) Modification 4
Hereinafter, the sensor 1D of the present modification (modification 4) will be described with reference to FIGS. 9A and 9B. Constituent elements that are substantially common to the sensor 1 of the basic example are denoted by the same reference numerals, and description thereof may be appropriately omitted. Note that FIG. 9A is a perspective view of the sensor 1D seen from below, and FIG. 9B is a plan view partially (only the substrate 2) seen from below of the sensor 1D.
　感知器１Ｄは、一例として、いわゆるＲ型（Record-type）の通信方式で火災信号を外部に送信する、Ｒ型熱感知器である。感知器１Ｄは、基本例と同様に熱検知部３を備える一方で、基本例と異なり煙検知部４を備えていない。すなわち、感知器１Ｄは、変形例３の感知器１Ｃと同様に、熱の検知のみにより火災等の発生を判定する。 The detector 1D is, for example, an R-type heat detector that transmits a fire signal to the outside by a so-called R-type (Record-type) communication method. The sensor 1D includes the heat detection unit 3 as in the basic example, but does not include the smoke detection unit 4 unlike the basic example. That is, the sensor 1D, like the sensor 1C of Modification 3, determines the occurrence of a fire or the like only by detecting heat.
　また感知器１Ｄでは、熱検知素子３０の数が５つである点も、基本例と異なる（基本例では４つ）。 Also, the sensor 1D differs from the basic example in that the number of the heat detection elements 30 is five (four in the basic example).
　感知器１Ｄの基板２は、図９Ｂに示すように、基本例の基板２とやや類似した形状となっている。具体的には、感知器１Ｄの基板２は、円形状の本体部２００と、本体部２００の縁において、本体部２００の中心から離れる方向に延出した複数（図示例では６つ）の延出部分を有している。以下、６つの延出部分を、一対の第１延出部２０１、一対の第２延出部２０２、及び一対の第３延出部２０３と呼ぶ。５つの熱検知素子３０のうち１つは、本体部２００の中央に配置され、残り４つの熱検知素子３０、及び２つの光源８１は、６つの延出部（２０１、２０２、２０３）に、それぞれ配置されている。 The substrate 2 of the sensor 1D has a shape slightly similar to that of the substrate 2 of the basic example, as shown in FIG. 9B. Specifically, the substrate 2 of the sensor 1D has a circular main body 200, and a plurality of (six in the illustrated example) extending in a direction away from the center of the main body 200 at the edge of the main body 200. It has a protruding part. Hereinafter, the six extending portions are referred to as a pair of first extending portions 201, a pair of second extending portions 202, and a pair of third extending portions 203. One of the five heat detecting elements 30 is arranged in the center of the main body 200, and the remaining four heat detecting elements 30 and the two light sources 81 are provided in the six extending portions (201, 202, 203). Each is arranged.
　一対の第１延出部２０１は、本体部２００の左右の縁から、それぞれ、互いに離れる方向に延出している。各第１延出部２０１は、その先端に、さらに幅狭の小片部Ｙ１を有している。各小片部Ｙ１の上面に、対応する１つの熱検知素子３０が配置されている。 The pair of first extending portions 201 extend from the left and right edges of the main body portion 200 in directions away from each other. Each of the first extending portions 201 has a narrower piece Y1 at the tip thereof. One corresponding heat detection element 30 is arranged on the upper surface of each small piece portion Y1.
　一対の第２延出部２０２は、本体部２００の前後の縁から、それぞれ、互いに離れる方向に延出している。第２延出部２０２の延出量は、他の延出部の延出量よりも少ない。各第２延出部２０２の上面に、対応する１つの光源８１が配置されている。 The pair of second extending portions 202 extend from the front and rear edges of the main body portion 200 in directions away from each other. The extension amount of the second extension portion 202 is smaller than the extension amounts of the other extension portions. One corresponding light source 81 is arranged on the upper surface of each second extending portion 202.
　一対の第３延出部２０３は、基板２の下側から見て、本体部２００の前後の縁より反時計回りの方向に少しずれた位置から、それぞれ、互いに離れる方向に延出している。具体的には、前側の第３延出部２０３は、前側の第２延出部２０２の左横に配置され、後側の第３延出部２０３は、後側の第２延出部２０２の右横に配置されている。各第３延出部２０３も、第１延出部２０１と同様に、その先端に、さらに幅狭の小片部Ｙ１を有している。各小片部Ｙ１の上面に、対応する１つの熱検知素子３０が配置されている。 The pair of third extending portions 203 respectively extend away from each other from positions slightly offset in the counterclockwise direction from the front and rear edges of the main body portion 200 when viewed from the lower side of the substrate 2. Specifically, the third extension portion 203 on the front side is disposed on the left side of the second extension portion 202 on the front side, and the third extension portion 203 on the rear side is the second extension portion 202 on the rear side. It is located on the right side of. Similarly to the first extending portion 201, each of the third extending portions 203 also has a narrower piece portion Y1 at the tip thereof. One corresponding heat detection element 30 is arranged on the upper surface of each small piece portion Y1.
　要するに、感知器１Ｄの基板２は、一例として、その中心を軸に１８０度回転させることで対称となる、二回対称の形状である。 In short, the substrate 2 of the sensor 1D has, for example, a two-fold symmetric shape that is symmetric by rotating the center of the sensor 1D by 180 degrees about the axis.
　また基本例と同様に、各熱検知素子３０の近傍には、熱絶縁性を向上させるために貫通孔３１が設けられている。ただし、基板２の中央部に配置されている熱検知素子３０については、半円状の２つの貫通孔３１が、その熱検知素子３０を間に挟むように配置されている。また基本例と同様に、感知器１Ｄの表カバー５１には、表示部８の一対のガイド部８２が露出している。 Also, as in the basic example, through holes 31 are provided in the vicinity of each heat detection element 30 in order to improve heat insulation. However, with respect to the heat detecting element 30 arranged in the central portion of the substrate 2, two semicircular through holes 31 are arranged so as to sandwich the heat detecting element 30 therebetween. Further, similarly to the basic example, the pair of guide portions 82 of the display unit 8 are exposed on the front cover 51 of the sensor 1D.
　感知器１Ｄの表カバー５１は、その基部５１１に、１つの流入口（縦孔）７Ｂと、２つの補助口（縦孔）５７と、を有している。２つの補助口５７は、基部５１１の左右の両縁近傍に配置され、流入口７Ｂは、基部５１１の中央に配置されている。２つの補助口５７及び流入口７Ｂの各々は、表カバー５１の基部５１１をその厚み方向に貫通している。基部５１１の左右の両縁近傍にある２つの補助口５７は、略矩形状の開口を有し、基部５１１の中央にある流入口７Ｂは、略円形状の開口を有している。そして、基板２の一対の第１延出部２０１における小片部Ｙ１の先端は、左右２つの補助口５７とそれぞれ一対一で対応するように対向し、基板２の中央部は、中央の流入口７Ｂと対向する。その結果、小片部Ｙ１の先端及び基板２の中央部は、図９Ｂに示すように、２つの補助口５７と流入口７Ｂとからそれぞれ露出している。したがって、上昇してくる熱を持った気体は、２つの補助口５７及び流入口７Ｂを通って筐体５内に入り、さらに貫通孔３１を通って第１面２１（上面）側に流れ込む。よって、熱検知素子３０は、開口部７（側面口７Ａ：横孔）から流入してくる気体だけでなく、２つの補助口５７及び流入口７Ｂから流入してくる気体にも曝され易くなる。 The front cover 51 of the sensor 1D has one inflow port (vertical hole) 7B and two auxiliary ports (vertical hole) 57 at its base 511. The two auxiliary ports 57 are arranged near both left and right edges of the base portion 511, and the inflow port 7B is arranged at the center of the base portion 511. Each of the two auxiliary ports 57 and the inflow port 7B penetrates the base portion 511 of the front cover 51 in the thickness direction thereof. The two auxiliary ports 57 near the left and right edges of the base 511 have a substantially rectangular opening, and the inflow port 7B at the center of the base 511 has a substantially circular opening. The tip ends of the small piece portions Y1 of the pair of first extending portions 201 of the substrate 2 face the left and right auxiliary ports 57 in a one-to-one correspondence, and the central portion of the substrate 2 has a central inlet port. Face 7B. As a result, the tip of the small piece portion Y1 and the central portion of the substrate 2 are exposed from the two auxiliary ports 57 and the inflow port 7B, respectively, as shown in FIG. 9B. Therefore, the rising gas having heat enters the housing 5 through the two auxiliary ports 57 and the inflow port 7B, and further flows into the first surface 21 (upper surface) side through the through hole 31. Therefore, the heat detecting element 30 is easily exposed not only to the gas flowing in from the opening 7 (side surface port 7A: lateral hole) but also to the gas flowing in from the two auxiliary ports 57 and the inflow port 7B. .
　この構成においても、火災の感知性能を更に高めつつ、感知器１Ｄ全体としての小型化（特に薄型化）を図ることができる。 Even with this configuration, it is possible to reduce the size of the detector 1D as a whole (especially to reduce the thickness) while further improving the fire detection performance.
　（３．５）変形例５
　以下、本変形例（変形例５）の感知器１Ｅについて、図１０Ａ及び図１０Ｂを参照しながら説明する。基本例の感知器１と概ね共通する構成要素については、同じ参照符号を付してそれらの説明を適宜に省略することもある。なお、図１０Ａは、感知器１Ｅを下側から見た斜視図で、図１０Ｂは、感知器１Ｅの下側から見た、一部（基板２のみ）透視化されている平面図である。 (3.5) Modification 5
Hereinafter, the sensor 1E of the present modification (modification 5) will be described with reference to FIGS. 10A and 10B. Constituent elements that are substantially common to the sensor 1 of the basic example are denoted by the same reference numerals, and description thereof may be appropriately omitted. 10A is a perspective view of the sensor 1E seen from below, and FIG. 10B is a plan view partially (only the substrate 2) seen from below of the sensor 1E.
　感知器１Ｅは、一例として火災の発生時に警報音等の音を出力する火災警報器である。感知器１Ｅは、基本例と同様に熱検知部３を備える一方で、基本例と異なり煙検知部４を備えていない。すなわち、感知器１Ｅは、変形例３の感知器１Ｃ及び変形例４の感知器１Ｄと同様に、熱の検知のみにより火災等の発生を判定する。 The sensor 1E is, for example, a fire alarm that outputs a sound such as an alarm sound when a fire occurs. The sensor 1E includes the heat detection unit 3 as in the basic example, but does not include the smoke detection unit 4 unlike the basic example. That is, the sensor 1E, like the sensor 1C of the modified example 3 and the sensor 1D of the modified example 4, determines the occurrence of a fire or the like only by detecting heat.
　また感知器１Ｅは、警報音等の音を出力するスピーカ、及び音響回路等を備えている点も、基本例と異なる。また感知器１Ｅは、一例として電池式の火災警報器である。したがって、感知器１Ｅは、電池、及び電池を収容するための収容空間等を有している。感知器１Ｅでは、操作部Ｕ１が表カバー５１の正面に露出している。 Also, the sensor 1E is different from the basic example in that it is equipped with a speaker that outputs a sound such as an alarm sound and an acoustic circuit. The sensor 1E is, for example, a battery-type fire alarm. Therefore, the sensor 1E has a battery, a housing space for housing the battery, and the like. In the sensor 1E, the operation unit U1 is exposed on the front surface of the front cover 51.
　操作部Ｕ１は、外部からの操作を受け付ける。操作部Ｕ１は、ユーザの指等による押し操作により上方へ押し込み可能となっている。また操作部Ｕ１は、透光性を有した円板状の部材である。操作部Ｕ１は、筐体５内の作動灯と対向して配置されている。さらに操作部Ｕ１は、押し操作により、筐体５内の押し釦スイッチを押すように構成されている。例えば警報音を発報中に操作部Ｕ１が押されると、警報音の出力が停止される。また感知器１Ｅが動作中である時、又は電池切れ等の発生時には、操作部Ｕ１が光る。なお、操作部Ｕ１への操作により動作試験等も実行可能である。 The operation unit U1 receives an operation from the outside. The operation unit U1 can be pushed upward by a pressing operation with a user's finger or the like. The operation unit U1 is a disc-shaped member having a light-transmitting property. The operation unit U1 is arranged so as to face the operation lamp in the housing 5. Further, the operation unit U1 is configured to press a push button switch in the housing 5 by a pressing operation. For example, if the operation unit U1 is pressed while the alarm sound is issued, the output of the alarm sound is stopped. Further, when the sensor 1E is operating or when the battery runs out, the operation unit U1 lights up. An operation test or the like can be executed by operating the operation unit U1.
　感知器１Ｅでは、熱検知素子３０の数が３つである点も、基本例と異なる（基本例では４つ）。 The sensor 1E also differs from the basic example in that the number of heat detecting elements 30 is three (four in the basic example).
　感知器１Ｅの基板２は、図１０Ｂに示すように、基板２を下側から見て逆Ｙ字形状となっている。感知器１Ｅは、筐体５内に、スピーカ、電池及び操作部Ｕ１等、比較的体積の大きい部材が収容又は支持されるため、それらを避けるために、基板２は、省スペース化となる逆Ｙ字形状を有している。 The substrate 2 of the sensor 1E has an inverted Y-shape when the substrate 2 is viewed from below, as shown in FIG. 10B. In the sensor 1E, a member having a relatively large volume such as a speaker, a battery, and an operation unit U1 is housed or supported in the housing 5. Therefore, in order to avoid them, the substrate 2 is space-saving. It has a Y shape.
　具体的には、感知器１Ｅの基板２は、左側が欠けた円形状の本体部２００と、本体部２００の縁において、本体部２００の中心から離れる方向に延出した複数（図示例では３つ）の延出部分を有している。以下、３つの延出部分を、延出片２０５と呼ぶ。３つの熱検知素子３０は、３つの延出片２０５に、それぞれ配置されている。 Specifically, the substrate 2 of the sensor 1 </ b> E has a circular main body portion 200 with a left side chipped off, and a plurality of edges (3 in the example shown in the drawing) extending from the center of the main body portion 200 at the edge of the main body portion 200. 3) has an extended portion. Hereinafter, the three extending portions will be referred to as extending pieces 205. The three heat detecting elements 30 are arranged on the three extending pieces 205, respectively.
　３つの延出片２０５のうち前側の１つの延出片２０５は、本体部２００の前縁から延出していて、その先端の上面に、対応する１つの熱検知素子３０が配置されている。３つの延出片２０５のうち後側の２つの延出片２０５は、本体部２００の後縁より少し左右にずれた位置から延出していて、それらの先端の上面に、対応する２つの熱検知素子３０がそれぞれ配置されている。 One of the three extension pieces 205 on the front side extends from the front edge of the main body 200, and one corresponding heat detection element 30 is arranged on the upper surface of the tip. Of the three extending pieces 205, the two rearward extending pieces 205 extend from positions slightly displaced to the left and right from the rear edge of the main body section 200, and the corresponding two thermal pieces are provided on the upper surfaces of their tips. The detection elements 30 are arranged respectively.
　また基本例と同様に、各熱検知素子３０より内側の近傍には、熱絶縁性を向上させるために貫通孔３１（合計３つ）が設けられている。 Also, as in the basic example, through holes 31 (three in total) are provided in the vicinity of the inside of each heat detecting element 30 in order to improve the heat insulating property.
　感知器１Ｅの表カバー５１は、その基部５１１に、１つの補助口（縦孔）５８を有している。補助口５８は、基部５１１の前縁近傍に配置されている。補助口５８は、表カバー５１の基部５１１をその厚み方向に貫通している。補助口５８は、略矩形状の開口を有している。そして、３つの延出片２０５のうち前側の延出片２０５の先端は、補助口５８と対向する。その結果、前側の延出片２０５の先端は、図１０Ｂに示すように、補助口５８から露出している。したがって、上昇してくる熱を持った気体は、補助口５８を通って筐体５内に入り、さらに貫通孔３１を通って第１面２１（上面）側に流れ込む。よって、熱検知素子３０は、開口部７（側面口７Ａ：横孔）から流入してくる気体だけでなく、補助口５８から流入してくる気体にも曝され易くなる。 The front cover 51 of the sensor 1E has one auxiliary port (vertical hole) 58 at its base 511. The auxiliary port 58 is arranged near the front edge of the base 511. The auxiliary port 58 penetrates the base portion 511 of the front cover 51 in the thickness direction thereof. The auxiliary port 58 has a substantially rectangular opening. The tip of the extension piece 205 on the front side of the three extension pieces 205 faces the auxiliary opening 58. As a result, the front end of the extension piece 205 on the front side is exposed from the auxiliary opening 58, as shown in FIG. 10B. Therefore, the rising gas having heat enters the housing 5 through the auxiliary port 58 and further flows into the first surface 21 (upper surface) side through the through hole 31. Therefore, the heat detecting element 30 is easily exposed not only to the gas flowing in from the opening 7 (side surface port 7A: lateral hole) but also to the gas flowing in from the auxiliary port 58.
　この構成においても、火災の感知性能を更に高めつつ、感知器１Ｅ全体としての小型化（特に薄型化）を図ることができる。 Even with this configuration, it is possible to reduce the size of the detector 1E as a whole (especially to make it thinner) while further improving the fire detection performance.
　（３．６）その他の変形例
　基本例の感知器１（複合火災感知器）は、変形例３～５とは異なり、表カバー５１に縦孔を有していない。しかし、変形例３～５と同様に、感知器１（複合火災感知器）は、図１１に示すように、表カバー５１に、１又は複数の補助口（縦孔）５９（図示例では２つ）を有していてもよい。 (3.6) Other Modifications The sensor 1 (composite fire sensor) of the basic example does not have a vertical hole in the front cover 51, unlike the modifications 3 to 5. However, as in Modifications 3 to 5, the detector 1 (composite fire detector) has one or more auxiliary ports (vertical holes) 59 (two in the illustrated example) in the front cover 51, as shown in FIG. One).
　基本例では、基板２の第１面２１（上面）に熱検知素子３０が実装されている。しかし、熱検知素子３０は、基板２の第２面２２（下面）に実装されてもよい。あるいは、複数の熱検知素子３０のうちの一部が第１面２１に、残りが第２面２２に、分かれて実装されてもよい。また、例えば熱検知素子３０と煙検知部４の両方が、基板２の第２面２２（下面）に実装されてもよい。 In the basic example, the heat detection element 30 is mounted on the first surface 21 (upper surface) of the substrate 2. However, the heat detecting element 30 may be mounted on the second surface 22 (lower surface) of the substrate 2. Alternatively, some of the plurality of heat detecting elements 30 may be separately mounted on the first surface 21 and the rest on the second surface 22. Further, for example, both the heat detection element 30 and the smoke detection unit 4 may be mounted on the second surface 22 (lower surface) of the substrate 2.
　基本例では、１つの熱検知素子３０に対して隣接する貫通孔３１の数は１つであるが、変形例３及び４に示したように、２つ以上であってもよい。例えば１つの熱検知素子３０の周囲を囲むように複数の貫通孔３１が設けられてもよい。 In the basic example, the number of the through holes 31 adjacent to one heat detection element 30 is one, but as shown in the modified examples 3 and 4, it may be two or more. For example, a plurality of through holes 31 may be provided so as to surround the periphery of one heat detection element 30.
　基本例では、熱検知素子３０が基板２の第１面２１に実装された上で、貫通孔３１が隣接して配置されている。しかし、たとえ熱検知素子３０が基板２の第２面２２に実装されていても、貫通孔３１が隣接して配置されていることが望ましい。 In the basic example, the heat detecting element 30 is mounted on the first surface 21 of the substrate 2, and the through holes 31 are arranged adjacent to each other. However, even if the heat detecting element 30 is mounted on the second surface 22 of the substrate 2, it is desirable that the through holes 31 be arranged adjacent to each other.
　基本例では、基板２は、１枚のプリント基板から構成されている。しかし、基板２は、２枚以上のプリント基板に分割されて構成されてもよい。ただし、分割された複数のプリント基板は、同一平面上に配置されることが望ましい。 In the basic example, the board 2 is composed of one printed board. However, the board 2 may be divided into two or more printed boards. However, it is desirable that the plurality of divided printed boards be arranged on the same plane.
　基本例では、開口部７は、筐体５の周壁に形成されている横孔である。しかし、本開示で言う開口部７は、横孔ではなく、変形例３～５における流入口（縦孔）７Ｂ、補助口（縦孔）５６～５８、及び上述した補助口（縦孔）５９に相当してもよい。 In the basic example, the opening 7 is a lateral hole formed in the peripheral wall of the housing 5. However, the opening 7 referred to in the present disclosure is not a horizontal hole, but an inflow port (vertical hole) 7B, auxiliary ports (vertical holes) 56 to 58 in Modifications 3 to 5, and the above-described auxiliary port (vertical hole) 59. May correspond to.
　（実施形態２）
　以下、本実施形態に係る感知器１Ｆについて図１２Ａ及び図１２Ｂを参照しながら説明する。本実施形態に係る感知器１Ｆは、遮蔽部Ｖ１を更に備える点で、実施形態１（変形例を含む）の感知器（１、１Ａ～１Ｅ）と異なる。以下、実施形態１と実質的に同様の構成については、共通の符号を付して適宜説明を省略する。本実施形態の遮蔽部Ｖ１は、実施形態１の感知器（１、１Ａ～１Ｅ）に対しても適宜適用されてもよい。 (Embodiment 2)
Hereinafter, the sensor 1F according to the present embodiment will be described with reference to FIGS. 12A and 12B. The sensor 1F according to the present embodiment is different from the sensors (1, 1A to 1E) according to the first embodiment (including modified examples) in that the sensor 1F further includes a shield portion V1. Hereinafter, configurations that are substantially the same as those of the first embodiment will be denoted by common reference numerals, and description thereof will be appropriately omitted. The shielding part V1 of the present embodiment may be appropriately applied to the sensors (1, 1A to 1E) of the first embodiment.
　なお、図１２Ａ及び図１２Ｂに示す感知器１Ｆは、実施形態１における変形例３の感知器１Ｃ（図８Ａ及び図８Ｂ）と同様に、一例としてＰ型熱感知器である。また感知器１Ｆは、実施形態１における変形例３の感知器１Ｃと同様に、煙検知部４を備えておらず熱の検知のみにより火災等の発生を判定する熱感知器である。 Note that the sensor 1F shown in FIGS. 12A and 12B is, as an example, a P-type heat sensor, similar to the sensor 1C (FIGS. 8A and 8B) of Modification 3 of the first embodiment. Like the sensor 1C of the third modification of the first embodiment, the sensor 1F is a heat sensor that does not include the smoke detector 4 and determines the occurrence of a fire or the like only by detecting heat.
　本実施形態においても、熱検知素子３０（チップサーミスタ）は、外部空間ＳＰ２の側から開口部７（側面口７Ａ：横孔）の開口領域７０を見たときに、開口領域７０内に収まるように配置される。そして、遮蔽部Ｖ１は、熱検知素子３０（チップサーミスタ）よりも外部空間ＳＰ２の側において開口領域７０の一部を遮るように構成される。 Also in the present embodiment, the heat detecting element 30 (chip thermistor) fits within the opening area 70 when the opening area 70 of the opening 7 (side opening 7A: lateral hole) is seen from the external space SP2 side. Is located in. Then, the shielding portion V1 is configured to shield a part of the opening region 70 on the external space SP2 side of the heat detection element 30 (chip thermistor).
　遮蔽部Ｖ１は、一対の柱Ｖ１１を有している。ここでは遮蔽部Ｖ１は、一対の柱Ｖ１１から構成される。各柱Ｖ１１は、上下方向（ここでは例えば基板２の厚み方向）に沿って長尺である。各柱Ｖ１１は、筐体５の表カバー５１と一体となって形成されている。具体的には、各柱Ｖ１１の第１端（上端）は、筐体５の円筒体５１０に繋がっていて、各柱Ｖ１１の第２端（下端）は、基部５１１に繋がっている。その結果、各柱Ｖ１１は、開口部７（側面口７Ａ）の上縁から下縁まで延びている。 The shielding part V1 has a pair of pillars V11. Here, the shielding part V1 is composed of a pair of columns V11. Each pillar V11 is long along the vertical direction (here, for example, the thickness direction of the substrate 2). Each pillar V11 is formed integrally with the front cover 51 of the housing 5. Specifically, the first end (upper end) of each pillar V11 is connected to the cylindrical body 510 of the housing 5, and the second end (lower end) of each pillar V11 is connected to the base 511. As a result, each pillar V11 extends from the upper edge to the lower edge of the opening 7 (side opening 7A).
　一対の柱Ｖ１１は、外部空間ＳＰ２の側から開口領域７０を見たときに、裏カバー５２と表カバー５１とが並ぶ並び方向と直交する方向Ｄ１（ここでは左右方向）において、所定の距離Ｌ１を空けて配置される。以下、一例として、裏カバー５２が第１カバーに相当し、表カバー５１が第２カバーに相当するものとするが、その逆で、裏カバー５２が第２カバーに相当し、表カバー５１が第１カバーに相当してもよい。 The pair of pillars V11 have a predetermined distance L1 in the direction D1 (here, the left-right direction) orthogonal to the arrangement direction of the back cover 52 and the front cover 51 when the opening region 70 is viewed from the side of the external space SP2. Will be placed. Hereinafter, as an example, it is assumed that the back cover 52 corresponds to the first cover and the front cover 51 corresponds to the second cover. On the contrary, the back cover 52 corresponds to the second cover and the front cover 51 corresponds to the second cover. It may correspond to the first cover.
　ここでは一例として、所定の距離Ｌ１は、試験指が入らないように規定された距離である。試験指は、例えば、日本の電気用品安全法の別表第四１（２）ハに規定された擬似指とする。 Here, as an example, the predetermined distance L1 is a distance defined so that the test finger does not enter. The test finger is, for example, a pseudo finger defined in Appendix 41 (2) C of Appendix 4 of the Electrical Appliance and Material Safety Law of Japan.
　熱検知素子３０は、外部空間ＳＰ２の側から開口領域７０を見たときに、方向Ｄ１において、一対の柱Ｖ１１間に配置される（図１２Ａ参照）。言い換えると、熱検知素子３０は、一対の柱Ｖ１１の間から露出する。 The heat detection element 30 is arranged between the pair of pillars V11 in the direction D1 when the opening region 70 is viewed from the side of the external space SP2 (see FIG. 12A). In other words, the heat detecting element 30 is exposed from between the pair of pillars V11.
　このように感知器１Ｆは、遮蔽部Ｖ１を更に備えることで、開口部７からの熱流入が妨げられにくくしつつ、例えば意図せずに人の指又は工具等がチップサーミスタに接触してしまう可能性を低減できる。 As described above, the sensor 1F further includes the shielding portion V1 to prevent the heat inflow from the opening 7 from being hindered, and unintentionally, for example, a finger or a tool of a person comes into contact with the chip thermistor. The possibility can be reduced.
　ところで、各柱Ｖ１１は、図１２Ｂに示すように、外部空間ＳＰ２からの気流を熱検知素子３０（チップサーミスタ）に向かって誘導する誘導面Ｖ２を有している。ここでは各柱Ｖ１１は、水平方向に沿って切った断面形状が略半楕円形状となっていて、その曲面が誘導面Ｖ２に相当する。そして、当該半楕円形状の先端が熱検知素子３０に向いてある。したがって、遮蔽部Ｖ１によって開口部７からの熱流入が妨げられる可能性をさらに低減できる。 By the way, each pillar V11 has a guide surface V2 for guiding the airflow from the external space SP2 toward the heat detection element 30 (chip thermistor), as shown in FIG. 12B. Here, each pillar V11 has a substantially semi-elliptical cross-section taken along the horizontal direction, and its curved surface corresponds to the guide surface V2. The tip of the semi-elliptical shape faces the heat detection element 30. Therefore, it is possible to further reduce the possibility that the inflow of heat from the opening 7 is blocked by the shield V1.
　次に本実施形態の変形例１について説明する。上述した図１２Ａ及び図１２Ｂの例では、遮蔽部Ｖ１の柱Ｖ１１の数は２本であるが、遮蔽部Ｖ１の柱の数は特に限定されない。図１３Ａ及び図１３Ｂは、変形例１の感知器１Ｇを示す。変形例１の感知器１Ｇは、遮蔽部Ｖ１の柱の数が３本である点で、感知器１Ｆと異なる。 Next, a modified example 1 of this embodiment will be described. In the example of FIGS. 12A and 12B described above, the number of pillars V11 of the shielding portion V1 is two, but the number of pillars of the shielding portion V1 is not particularly limited. 13A and 13B show a sensor 1G of the first modification. The sensor 1G of Modification 1 is different from the sensor 1F in that the number of columns of the shielding portion V1 is three.
　変形例１の感知器１Ｇは、一例としてＰ型熱感知器である。なお、感知器１Ｆの基板２の凸部２３は、上下方向に沿って見て、筐体５の径方向に対してやや斜めに突出しているが（図１２Ｂ参照）、感知器１Ｇの基板２の凸部２３は、筐体５の径方向に沿って外側に突出している（図１３Ｂ参照）。 The sensor 1G of the modified example 1 is, for example, a P-type heat sensor. Although the convex portion 23 of the substrate 2 of the sensor 1F protrudes slightly obliquely with respect to the radial direction of the housing 5 when viewed in the up-down direction (see FIG. 12B), the substrate 2 of the sensor 1G. The convex portion 23 of is projected outward along the radial direction of the housing 5 (see FIG. 13B).
　感知器１Ｇの遮蔽部Ｖ１は、３本の柱（左右一対の第１柱Ｖ１２と真ん中の第２柱Ｖ１３）を有している。ここでは遮蔽部Ｖ１は、３本の柱から構成される。一対の第１柱Ｖ１２及び第２柱Ｖ１３の各々は、上下方向（ここでは例えば基板２の厚み方向）に沿って長尺である。一対の第１柱Ｖ１２及び第２柱Ｖ１３の各々は、筐体５の表カバー５１と一体となって形成されている。具体的には、各柱の第１端（上端）は、筐体５の円筒体５１０に繋がっていて、各柱の第２端（下端）は、基部５１１に繋がっている。その結果、各柱は、開口部７の上縁から下縁まで延びている。 The shield V1 of the sensor 1G has three columns (a pair of left and right first columns V12 and a second column V13 in the middle). Here, the shield V1 is composed of three columns. Each of the pair of first pillars V12 and second pillars V13 is long along the vertical direction (here, for example, the thickness direction of the substrate 2). Each of the pair of first pillars V12 and second pillars V13 is formed integrally with the front cover 51 of the housing 5. Specifically, the first end (upper end) of each pillar is connected to the cylindrical body 510 of the housing 5, and the second end (lower end) of each pillar is connected to the base portion 511. As a result, each pillar extends from the upper edge to the lower edge of the opening 7.
　一対の第１柱Ｖ１２の各々と、第２柱Ｖ１３とは、外部空間ＳＰ２の側から開口領域７０を見たときに、方向Ｄ１（ここでは左右方向）において、それぞれ所定の距離Ｌ２を空けて配置される。ここでは一例として、所定の距離Ｌ２も、試験指が入らないように規定された距離である。 The pair of first pillars V12 and the second pillar V13 are spaced apart from each other by a predetermined distance L2 in the direction D1 (here, the left-right direction) when the opening region 70 is viewed from the external space SP2 side. Will be placed. Here, as an example, the predetermined distance L2 is also a distance defined so that the test finger does not enter.
　熱検知素子３０は、外部空間ＳＰ２の側から開口領域７０を見たときに、方向Ｄ１において、一対の第１柱Ｖ１２間に配置される（図１３Ａ参照）。ただし、熱検知素子３０は、外部空間ＳＰ２の側から開口領域７０を見たときに、第２柱Ｖ１３と重なる位置にある。言い換えると、熱検知素子３０は、第２柱Ｖ１３の裏側に隠れて見えない位置にある。 The heat detection element 30 is arranged between the pair of first columns V12 in the direction D1 when the opening region 70 is viewed from the side of the external space SP2 (see FIG. 13A). However, the heat detection element 30 is located at a position overlapping the second pillar V13 when the opening region 70 is viewed from the external space SP2 side. In other words, the heat detection element 30 is hidden behind the second pillar V13 and invisible.
　このように感知器１Ｇは、３本の柱を有した遮蔽部Ｖ１を備えることで、開口部７からの熱流入が妨げられにくくしつつ、人の指又は工具等がチップサーミスタに接触してしまう可能性をさらに低減できる。 As described above, the sensor 1G is provided with the shielding portion V1 having three columns, so that it is difficult for the heat inflow from the opening 7 to be prevented, and a human finger, a tool, or the like comes into contact with the chip thermistor. It is possible to further reduce the possibility of the accident.
　ところで、一対の第１柱Ｖ１２の各々は、図１３Ｂに示すように、外部空間ＳＰ２からの気流を熱検知素子３０（チップサーミスタ）に向かって誘導する誘導面Ｖ２を有している。ここでは一対の第１柱Ｖ１２の各々は、水平方向に沿って切った断面形状が筐体５の外縁に沿って長い略レーストラック形状となっていて、その左右両側に誘導面Ｖ２として半円弧状の曲面を有している。したがって、遮蔽部Ｖ１によって開口部７からの熱流入が妨げられる可能性をさらに低減できる。なお、第２柱Ｖ１３は、水平方向に沿って切った断面形状が略矩形状となっているが、第１柱Ｖ１２と同様に略レーストラック形状となっていて、誘導面Ｖ２を有してもよい。 Incidentally, as shown in FIG. 13B, each of the pair of first pillars V12 has a guide surface V2 that guides the airflow from the external space SP2 toward the heat detection element 30 (chip thermistor). Here, each of the pair of first pillars V12 has a substantially racetrack shape in which the cross-sectional shape cut along the horizontal direction is long along the outer edge of the housing 5, and a semicircle is formed as a guide surface V2 on the left and right sides thereof. It has an arcuate curved surface. Therefore, it is possible to further reduce the possibility that the inflow of heat from the opening 7 is blocked by the shield V1. The second pillar V13 has a substantially rectangular cross-sectional shape cut along the horizontal direction, but has a substantially racetrack shape like the first pillar V12 and has a guide surface V2. Good.
　なお、図１３Ｃは、変形例１の感知器１Ｇの別の例を示す。この別の例では、一対の第１柱Ｖ１２の各々は、水平方向に沿って切った断面形状が略台形状となっている。各第１柱Ｖ１２は、当該台形状において互いに平行な２辺のうち短辺が熱検知素子３０の側に、長辺が外部空間ＳＰ２の側となるように構成される。特に各第１柱Ｖ１２は、真ん中の第２柱Ｖ１３と対向する第１面Ｖ１２１、及び当該第１面Ｖ１２１とは反対側の第２面Ｖ１２２が、熱検知素子３０に向かうように傾斜した傾斜面となっている。筐体５の径方向に対する第２面Ｖ１２２の傾斜角度は、第１面Ｖ１２１の傾斜角度よりも大きい。真ん中の第２柱Ｖ１３は、水平方向に沿って切った断面形状が、筐体５の径方向に長い砲弾形状になっていて、熱検知素子３０と対向する側が半円弧状である。この別の例では、第１面Ｖ１２１、第２面Ｖ１２２及び断面半円弧状の端面が、誘導面Ｖ２に相当する。要するに、この別の例では、一対の第１柱Ｖ１２の各々が、誘導面Ｖ２を有している。この別の例においても、誘導面Ｖ２が設けられていることで、遮蔽部Ｖ１によって開口部７からの熱流入が妨げられる可能性をさらに低減できる。 Note that FIG. 13C shows another example of the sensor 1G of the first modification. In this another example, each of the pair of first pillars V12 has a substantially trapezoidal cross section cut along the horizontal direction. Each of the first pillars V12 is configured such that, of the two sides parallel to each other in the trapezoidal shape, the short side is on the heat detecting element 30 side and the long side is on the external space SP2 side. In particular, in each first pillar V12, a first surface V121 facing the second pillar V13 in the middle and a second surface V122 opposite to the first surface V121 are inclined so as to face the heat detection element 30. Is a face. The inclination angle of the second surface V122 with respect to the radial direction of the housing 5 is larger than the inclination angle of the first surface V121. The second pillar V13 in the middle has a cross section cut along the horizontal direction in the shape of a shell that is long in the radial direction of the housing 5, and the side facing the heat detection element 30 has a semi-arcuate shape. In this another example, the first surface V121, the second surface V122, and the end surface having a semicircular arc cross section correspond to the guide surface V2. In short, in this another example, each of the pair of first pillars V12 has the guide surface V2. Also in this another example, since the guide surface V2 is provided, it is possible to further reduce the possibility that the heat inflow from the opening portion 7 is blocked by the shield portion V1.
　次に本実施形態の変形例２について説明する。図１４Ａ～１４Ｃ及び図１５は、変形例２の感知器１Ｈを示す。変形例２の感知器１Ｈは、一例としてＲ型熱感知器である。感知器１Ｈの基板２の凸部２３は、筐体５の径方向に沿って外側に突出している。 Next, a modified example 2 of this embodiment will be described. 14A to 14C and FIG. 15 show a sensor 1H according to the second modification. The sensor 1H of the modification 2 is an R-type heat sensor as an example. The convex portion 23 of the substrate 2 of the sensor 1H projects outward along the radial direction of the housing 5.
　変形例２の感知器１Ｈにおける遮蔽部Ｖ１は、一対の第１突起Ｖ１４と、１つの第２突起Ｖ１５とを有している。ここでは遮蔽部Ｖ１は、一対の第１突起Ｖ１４と、第２突起Ｖ１５とから構成される。一対の第１突起Ｖ１４の各々は、基板２の厚み方向における一の方向（ここでは上方）から基板２を覆う裏カバー５２（第１カバー）から、表カバー５１（第２カバー）に向かって突出する。表カバー５１は、基板２の厚み方向における上記一の方向とは反対の方向（ここでは下方）から基板２を覆う。第２突起Ｖ１５は、表カバー５１から裏カバー５２に向かって突出する。一対の第１突起Ｖ１４及び第２突起Ｖ１５の各々は、上下方向（ここでは例えば基板２の厚み方向）に沿って長尺である。 The shielding part V1 in the sensor 1H of the modified example 2 has a pair of first protrusions V14 and one second protrusion V15. Here, the shielding part V1 is composed of a pair of a first protrusion V14 and a second protrusion V15. Each of the pair of first protrusions V14 extends from the back cover 52 (first cover) that covers the substrate 2 from one direction (here, above) in the thickness direction of the substrate 2 toward the front cover 51 (second cover). Project. The front cover 51 covers the substrate 2 from a direction (here, below) opposite to the one direction in the thickness direction of the substrate 2. The second protrusion V15 projects from the front cover 51 toward the back cover 52. Each of the pair of first protrusion V14 and second protrusion V15 is elongated along the vertical direction (here, for example, the thickness direction of the substrate 2).
　一対の第１突起Ｖ１４は、図１５に示すように、裏カバー５２と一体となって形成されている。具体的には、一対の第１突起Ｖ１４は、裏カバー５２の下面における周縁部から連続して下方に突出する。なお、一対の第１突起Ｖ１４の各々の先端は、表カバー５１と接触しておらず、表カバー５１との間に隙間を空けている。 The pair of first projections V14 are formed integrally with the back cover 52, as shown in FIG. Specifically, the pair of first protrusions V14 continuously protrude downward from the peripheral edge portion on the lower surface of the back cover 52. The tip ends of the pair of first protrusions V14 are not in contact with the front cover 51, and a gap is left between the front cover 51 and the front cover 51.
　一対の第１突起Ｖ１４は、外部空間ＳＰ２の側から開口領域７０を見たときに、方向Ｄ１において、互いに所定の距離Ｌ３を空けて配置される。ここでは一例として、所定の距離Ｌ３も、試験指が入らないように規定された距離である。熱検知素子３０は、外部空間ＳＰ２の側から開口領域７０を見たときに、方向Ｄ１において、一対の第１突起Ｖ１４間に配置される（図１４Ａ参照）。 The pair of first protrusions V14 are arranged at a predetermined distance L3 from each other in the direction D1 when the opening region 70 is viewed from the external space SP2 side. Here, as an example, the predetermined distance L3 is also a distance defined so that the test finger does not enter. The heat detecting element 30 is arranged between the pair of first protrusions V14 in the direction D1 when the opening region 70 is viewed from the external space SP2 side (see FIG. 14A).
　第２突起Ｖ１５は、方向Ｄ１において、一対の第１突起Ｖ１４の間の中央に配置される。言い換えると、一対の第１突起Ｖ１４の各々は、外部空間ＳＰ２の側から開口領域７０を見たときに、方向Ｄ１において第２突起Ｖ１５に対してずれて配置される。そのため、遮蔽部Ｖ１によって開口部７からの熱流入が妨げられる可能性をさらに低減できる。 The second protrusion V15 is arranged in the center between the pair of first protrusions V14 in the direction D1. In other words, each of the pair of first protrusions V14 is displaced from the second protrusion V15 in the direction D1 when the opening region 70 is viewed from the external space SP2 side. Therefore, it is possible to further reduce the possibility that the inflow of heat from the opening 7 is blocked by the shield V1.
　第２突起Ｖ１５は、表カバー５１と一体となって形成されている。具体的には、第２突起Ｖ１５は、表カバー５１の上面における周縁部から連続して上方に突出する。第２突起Ｖ１５の先端は、開口部７の上縁と接触しておらず、当該上縁との間に隙間を空けている。 The second protrusion V15 is formed integrally with the front cover 51. Specifically, the second protrusion V15 continuously protrudes upward from the peripheral edge portion on the upper surface of the front cover 51. The tip of the second protrusion V15 is not in contact with the upper edge of the opening 7 and has a gap between the upper edge and the upper edge.
　第２突起Ｖ１５は、図１４Ａに示すように、外部空間ＳＰ２の側から開口領域７０を見たときに、方向Ｄ１において、チップサーミスタと同じ位置にある。ただし、第２突起Ｖ１５は、チップサーミスタの少なくとも一部が露出するように、その突出量が規定されている。具体的には、第２突起Ｖ１５の先端が、チップサーミスタの上面を超えないように、その突出量が規定されている。なお、ここでは一例として、第２突起Ｖ１５の先端は、基板２の下面よりも下に位置し、熱検知素子３０は、一対の第１突起Ｖ１４の間において、第２突起Ｖ１５の裏側に隠れることなく露出する。 As shown in FIG. 14A, the second protrusion V15 is at the same position as the chip thermistor in the direction D1 when the opening region 70 is viewed from the external space SP2 side. However, the projection amount of the second protrusion V15 is defined so that at least a part of the chip thermistor is exposed. Specifically, the protrusion amount of the second protrusion V15 is defined so that the tip of the second protrusion V15 does not exceed the upper surface of the chip thermistor. Here, as an example, the tip of the second protrusion V15 is located below the lower surface of the substrate 2, and the heat detecting element 30 is hidden behind the second protrusion V15 between the pair of first protrusions V14. Exposed without.
　このようにチップサーミスタの少なくとも一部が露出するように、第２突起Ｖ１５の突出量が規定されていることで、さらに開口部７からの熱流入が妨げられにくくしつつ、人の指又は工具等がチップサーミスタに接触してしまう可能性を低減できる。 Since the protrusion amount of the second protrusion V15 is defined so that at least a part of the chip thermistor is exposed in this way, it is further difficult to prevent the heat inflow from the opening 7 and the finger or the tool of the person. It is possible to reduce the possibility that the like will contact the chip thermistor.
　ところで、一対の第１突起Ｖ１４の各々も、図１４Ｂに示すように、誘導面Ｖ２を有している。ここでは一対の第１突起Ｖ１４の各々は、水平方向に沿って切った断面形状が筐体５の径方向に沿って細長い楕円形状となっていて、その左右両側に誘導面Ｖ２として曲面を有している。したがって、遮蔽部Ｖ１によって開口部７からの熱流入が妨げられる可能性をさらに低減できる。特に各第１突起Ｖ１４の幅寸法が比較的小さいことで、さらに熱流入が妨げられる可能性をさらに低減できる。 By the way, each of the pair of first protrusions V14 also has a guide surface V2 as shown in FIG. 14B. Here, each of the pair of first protrusions V14 has a cross-sectional shape cut along the horizontal direction and has an elongated elliptical shape along the radial direction of the housing 5, and has curved surfaces on both left and right sides thereof as guide surfaces V2. are doing. Therefore, it is possible to further reduce the possibility that the inflow of heat from the opening 7 is blocked by the shield V1. In particular, since the width dimension of each first protrusion V14 is relatively small, it is possible to further reduce the possibility that heat inflow will be hindered.
　一方、第２突起Ｖ１５も、図１４Ｃに示すように、誘導面Ｖ２を有している。第２突起Ｖ１５は、一対の第１突起Ｖ１４が並ぶ並び方向に沿ってみて、略三角形状に形成されている。特に第２突起Ｖ１５は、一対の第１突起Ｖ１４が並ぶ並び方向に沿ってみて、内部空間ＳＰ１の側において、略円弧状に凹んで傾斜した曲面Ｖ１５０を有している。この曲面Ｖ１５０も、誘導面Ｖ２に相当する。熱気流は、誘導面Ｖ２に衝突することで、第２突起Ｖ１５より上にあるチップサーミスタに向かって誘導され得る。 On the other hand, the second protrusion V15 also has a guide surface V2 as shown in FIG. 14C. The second protrusion V15 is formed in a substantially triangular shape when viewed in the arrangement direction of the pair of first protrusions V14. In particular, the second protrusion V15 has a curved surface V150 that is recessed and inclined in a substantially arc shape on the side of the internal space SP1 when viewed along the direction in which the pair of first protrusions V14 are arranged. This curved surface V150 also corresponds to the guide surface V2. The hot air flow can be guided toward the chip thermistor above the second protrusion V15 by colliding with the guide surface V2.
　このように感知器１Ｈは、３つの突起を有した遮蔽部Ｖ１を備えることで、開口部７からの熱流入が妨げられにくくしつつ、人の指又は工具等がチップサーミスタに接触してしまう可能性をさらに低減できる。 As described above, the sensor 1H is provided with the shield portion V1 having three protrusions, so that it is difficult for the heat inflow from the opening 7 to be prevented, and a human finger, a tool, or the like comes into contact with the chip thermistor. The possibility can be further reduced.
　なお、遮蔽部Ｖ１は、例えば、一対の第１突起Ｖ１４の間に、もう１本別の第１突起Ｖ１４を有してもよい。当該別の第１突起Ｖ１４及び第２突起Ｖ１５は、互いの先端同士が対向するように突出してもよい。この場合においても第２突起Ｖ１５と同様に、当該別の第１突起Ｖ１４は、チップサーミスタの少なくとも一部が露出するように、その突出量が規定されていることが望ましい。 Note that the shielding part V1 may have, for example, another first projection V14 between the pair of first projections V14. The first protrusion V14 and the second protrusion V15 may be projected so that their tips are opposed to each other. Also in this case, similarly to the second protrusion V15, it is desirable that the protrusion amount of the other first protrusion V14 is regulated so that at least a part of the chip thermistor is exposed.
　次に本実施形態の変形例３について説明する。図１６は、変形例３の感知器１Ｉを示す。変形例３の感知器１Ｉは、一例としてＲ型熱感知器である。 Next, a modified example 3 of this embodiment will be described. FIG. 16 shows a sensor 1I according to Modification 3. The sensor 1I of Modification 3 is an R-type heat sensor as an example.
　感知器１Ｉの遮蔽部Ｖ１は、変形例２の感知器１Ｈの一対の第１突起Ｖ１４と同様に、裏カバー５２と一体となって形成されている一対の第１突起Ｖ１６を有している。一対の第１突起Ｖ１６は、裏カバー５２から表カバー５１に向かって突出する。熱検知素子３０は、外部空間ＳＰ２の側から開口領域７０を見たときに、方向Ｄ１において、一対の第１突起Ｖ１６間に配置される。 The shield portion V1 of the sensor 1I has a pair of first projections V16 formed integrally with the back cover 52, similarly to the pair of first projections V14 of the sensor 1H of the modified example 2. . The pair of first protrusions V16 protrude from the back cover 52 toward the front cover 51. The heat detection element 30 is arranged between the pair of first protrusions V16 in the direction D1 when the opening region 70 is viewed from the external space SP2 side.
　感知器１Ｉの遮蔽部Ｖ１は、一対の第２突起Ｖ１７を更に有している。一対の第２突起Ｖ１７の各々は、変形例２の感知器１Ｈの第２突起Ｖ１５と同様に、表カバー５１と一体となって形成されている。一対の第２突起Ｖ１７は、表カバー５１から裏カバー５２に向かって突出する。ただし、一対の第２突起Ｖ１７は、これらの先端が一対の第１突起Ｖ１６の先端と一対一で対向するように突出する。言い換えると、各第１突起Ｖ１６とそれに対向する第２突起Ｖ１７との間には隙間が空けられている。 The shield V1 of the sensor 1I further includes a pair of second protrusions V17. Each of the pair of second protrusions V17 is formed integrally with the front cover 51, similarly to the second protrusion V15 of the sensor 1H according to the second modification. The pair of second protrusions V17 protrude from the front cover 51 toward the back cover 52. However, the pair of second protrusions V17 protrude so that their tips face the tip of the pair of first protrusions V16 in a one-to-one manner. In other words, there is a gap between each first protrusion V16 and the second protrusion V17 facing it.
　また感知器１Ｉの遮蔽部Ｖ１は、柱Ｖ１８を更に有している。柱Ｖ１８は、変形例１の感知器１Ｇの第２柱Ｖ１３と同様に、筐体５の表カバー５１と一体となって形成されている。そして、熱検知素子３０は、外部空間ＳＰ２の側から開口領域７０を見たときに、柱Ｖ１８と重なる位置にある。言い換えると、熱検知素子３０は、柱Ｖ１８の裏側に隠れて見えない位置にある。 The shield V1 of the sensor 1I further has a pillar V18. The pillar V18 is formed integrally with the front cover 51 of the housing 5, similarly to the second pillar V13 of the sensor 1G of the first modification. Then, the heat detecting element 30 is in a position overlapping the pillar V18 when the opening region 70 is viewed from the side of the external space SP2. In other words, the heat detection element 30 is hidden behind the pillar V18 and is invisible.
　一対の第１突起Ｖ１６の各々と、柱Ｖ１８とは、外部空間ＳＰ２の側から開口領域７０を見たときに、方向Ｄ１において、それぞれ所定の距離Ｌ４を空けて配置される。ここでは一例として、所定の距離Ｌ４も、試験指が入らないように規定された距離である。 Each of the pair of first protrusions V16 and the pillar V18 are arranged at a predetermined distance L4 in the direction D1 when the opening region 70 is viewed from the external space SP2 side. Here, as an example, the predetermined distance L4 is also a distance defined so that the test finger does not enter.
　このように感知器１Ｉは、４つの突起と１本の柱を有した遮蔽部Ｖ１を備えることで、開口部７からの熱流入が妨げられにくくしつつ、人の指又は工具等がチップサーミスタに接触してしまう可能性をさらに低減できる。 As described above, the sensor 1I is provided with the shielding portion V1 having four protrusions and one pillar, so that the inflow of heat from the opening 7 is not easily obstructed, and the finger or the tool of a person can be chip thermistor. It is possible to further reduce the possibility of contact with.
　なお、図示は省略するが、感知器１Ｉの遮蔽部Ｖ１も、誘導面Ｖ２を有していることが望ましい。 Although not shown, it is desirable that the shield V1 of the sensor 1I also has a guide surface V2.
　次に本実施形態の変形例４について説明する。図１７Ａ及び図１７Ｂは、変形例４の感知器１Ｊを示す。変形例４の感知器１Ｊは、一例としてＲ型熱感知器である。 Next, a modified example 4 of this embodiment will be described. 17A and 17B show a sensor 1J according to Modification 4. The sensor 1J of the modification 4 is an R-type heat sensor as an example.
　感知器１Ｊの遮蔽部Ｖ１は、１本の柱Ｖ１９のみを有している。柱Ｖ１９は、変形例１の感知器１Ｇの第２柱Ｖ１３と同様に、筐体５の表カバー５１と一体となって形成されている。そして、熱検知素子３０は、外部空間ＳＰ２の側から開口領域７０を見たときに、柱Ｖ１９と重なる位置にある。言い換えると、熱検知素子３０は、柱Ｖ１９の裏側に隠れて見えない位置にある。 The shield V1 of the sensor 1J has only one pillar V19. The pillar V19 is formed integrally with the front cover 51 of the housing 5, similarly to the second pillar V13 of the sensor 1G of the first modification. The heat detecting element 30 is located at a position overlapping the pillar V19 when the opening region 70 is viewed from the external space SP2 side. In other words, the heat detecting element 30 is hidden behind the pillar V19 and is invisible.
　柱Ｖ１９は、図１７Ｂに示すように、誘導面Ｖ２を有している。ここでは柱Ｖ１９は、水平方向に沿って切った断面形状が、内部空間ＳＰ１に向かって先の尖ったテーパ形状となっていて、このテーパ面が誘導面Ｖ２に相当する。また柱Ｖ１９の断面形状は、その左右両側において半円弧状となっていて、この左右両側の面も、誘導面Ｖ２に相当する。 The pillar V19 has a guide surface V2 as shown in FIG. 17B. Here, the pillar V19 has a tapered cross-sectional shape cut along the horizontal direction toward the internal space SP1, and this tapered surface corresponds to the guide surface V2. The cross-sectional shape of the pillar V19 is a semi-circular shape on the left and right sides thereof, and the surfaces on the left and right sides also correspond to the guide surface V2.
　このように感知器１Ｊは、１本の柱Ｖ１９のみでありながらも、開口部７からの熱流入が妨げられにくくしつつ、人の指又は工具等がチップサーミスタに接触してしまう可能性を低減できる。なお、人の指又は工具等がチップサーミスタに接触してしまう可能性を低減する点を重視する場合には、遮蔽部Ｖ１の突起及び柱の数は、感知器１Ｆ～１Ｉのように２つ以上であることが望ましい。 As described above, the sensor 1J has only one pillar V19, but the possibility that a human finger, a tool, or the like may come into contact with the chip thermistor while preventing the heat inflow from the opening 7 from being hindered. It can be reduced. When the importance of reducing the possibility that a human finger, a tool, or the like will come into contact with the chip thermistor, the number of protrusions and pillars of the shielding portion V1 is two as in the sensors 1F to 1I. The above is desirable.
　（実施形態３）
　以下、本実施形態に係る感知器１Ｋについて図１８Ａ～図１８Ｃを参照しながら説明する。以下、実施形態１と実質的に同様の構成については、共通の符号を付して適宜説明を省略する。本実施形態の感知器１Ｋは、後述の通り、外表面５３がテーパ状に形成された第１表面５３１を有する点で、実施形態１（変形例を含む）の感知器（１、１Ａ～１Ｅ）と異なる。本実施形態におけるテーパ状に形成された第１表面５３１は、実施形態１の感知器（１、１Ａ～１Ｅ）又は実施形態２の感知器（１Ｆ～１Ｊ）に対しても適宜適用されてもよい。なお、図１８Ａ～図１８Ｃに示す感知器１Ｋは、一例としてＲ型熱感知器である。また感知器１Ｋは、実施形態１における変形例３の感知器１Ｃと同様に、煙検知部４を備えておらず熱の検知のみにより火災等の発生を判定する熱感知器である。また感知器１Ｋは、実施形態２の変形例２の感知器１Ｈと同様に、遮蔽部Ｖ１を複数セット備えている。 (Embodiment 3)
Hereinafter, the sensor 1K according to the present embodiment will be described with reference to FIGS. 18A to 18C. Hereinafter, configurations that are substantially the same as those of the first embodiment will be denoted by common reference numerals, and description thereof will be appropriately omitted. As will be described later, the sensor 1K of the present embodiment has the outer surface 53 having a first surface 531 formed in a tapered shape, and thus the sensors (1, 1A to 1E) of the first embodiment (including modified examples). ) Different. The tapered first surface 531 in the present embodiment may be appropriately applied to the sensor (1, 1A to 1E) of the first embodiment or the sensor (1F to 1J) of the second embodiment. Good. The sensor 1K shown in FIGS. 18A to 18C is, for example, an R-type heat sensor. Like the sensor 1C of the third modification of the first embodiment, the sensor 1K is a heat sensor that does not include the smoke detector 4 and determines the occurrence of a fire or the like only by detecting heat. Further, the sensor 1K includes a plurality of sets of shielding portions V1 similarly to the sensor 1H of the second modification of the second embodiment.
　本実施形態に係る感知器１Ｋの開口部７は、実施形態１で説明した感知器１Ｃ（図８Ａ、８Ｂ参照）及び感知器１Ｄ（図９Ａ、９Ｂ参照）と同様に、流入口７Ｂを有している。つまり、開口部７は、６つの側面口（横孔）７Ａに加えて、流入口７Ｂを有している。流入口７Ｂは、筐体５における、感知器１Ｋが取り付けられる構造体Ｘ１とは反対側の外表面５３（表カバー５１の下面）に設けられている。ここでは例えば、流入口７Ｂは、外表面５３の中央に設けられている。流入口７Ｂは、表カバー５１をその厚み方向に貫通する。流入口７Ｂは、略円形状の開口を有している。 Like the sensor 1C (see FIGS. 8A and 8B) and the sensor 1D (see FIGS. 9A and 9B) described in the first embodiment, the opening 7 of the sensor 1K according to the present embodiment has an inflow port 7B. are doing. That is, the opening portion 7 has the inflow port 7B in addition to the six side surface ports (lateral holes) 7A. The inflow port 7B is provided on the outer surface 53 (the lower surface of the front cover 51) of the housing 5 on the side opposite to the structure X1 to which the sensor 1K is attached. Here, for example, the inflow port 7B is provided at the center of the outer surface 53. The inflow port 7B penetrates the front cover 51 in its thickness direction. The inflow port 7B has a substantially circular opening.
　感知器１Ｋにおいては、図１８Ｂに示すように、基板２の一部が流入口７Ｂから露出している。具体的には、基板２は、その中央において厚み方向に貫通する孔部２５を有している。孔部２５は、略円形状の開口を有している。孔部２５は、流入口７Ｂと概ね重なるように配置される。基板２は、孔部２５の開口縁において、互いに近づくように突出する一対の突起部２６を有している。一対の突起部２６の先端が、流入口７Ｂから露出している。そして、基板２の各突起部２６の上面にも、熱検知素子３０（チップサーミスタ）が設けられている。要するに、感知器１Ｋは、側面口（横孔）７Ａの近傍に設けられた複数の熱検知素子３０（図示例では６つ）に加えて、流入口７Ｂの近傍にも２つの熱検知素子３０を有している。また基板２は、各熱検知素子３０の近傍において、熱検知素子３０における熱が基板２を伝達して、熱検知素子３０の温度が低くなってしまうことを抑制するために、略三角形状の貫通孔３１を有している。 In the sensor 1K, as shown in FIG. 18B, a part of the substrate 2 is exposed from the inflow port 7B. Specifically, the substrate 2 has a hole portion 25 penetrating in the thickness direction at the center thereof. The hole 25 has a substantially circular opening. The hole 25 is arranged so as to substantially overlap the inflow port 7B. The substrate 2 has a pair of protrusions 26 that protrude so as to approach each other at the opening edges of the holes 25. The tips of the pair of protrusions 26 are exposed from the inflow port 7B. The heat detecting element 30 (chip thermistor) is also provided on the upper surface of each protrusion 26 of the substrate 2. In short, in addition to the plurality of heat detecting elements 30 (six in the illustrated example) provided in the vicinity of the side opening (lateral hole) 7A, the sensor 1K includes two heat detecting elements 30 in the vicinity of the inlet 7B. have. Further, the substrate 2 has a substantially triangular shape in order to prevent the heat of the heat detecting element 30 from being transmitted through the substrate 2 in the vicinity of each heat detecting element 30 and lowering the temperature of the heat detecting element 30. It has a through hole 31.
　感知器１Ｋの開口部７は、流入口７Ｂを有していることで、流入口７Ｂから流入した気体の熱を検知できるため、熱検知に関する応答性を高めることができる。 Since the opening 7 of the sensor 1K has the inflow port 7B, the heat of the gas flowing in from the inflow port 7B can be detected, so that the responsiveness regarding the heat detection can be enhanced.
　ここで本実施形態の感知器１Ｋの外表面５３は、流入口７Ｂの周囲における第１表面５３１と、第１表面５３１よりも外側にある第２表面５３２と、を有している。ここでは、第２表面５３２は、第１表面５３１の周りにおいて第１表面５３１よりも外側にある。特に第１表面５３１は、図１８Ｃに示すように、第２表面５３２とは異なる傾斜角で、流入口７Ｂに近づくほど構造体Ｘ１の側に近づく向き（上向き）にテーパ状に形成されている。なお、ここでは一例として、外表面５３は、第３表面５３３を更に有している。第３表面５３３は、第１表面５３１よりも外側で、かつ第２表面５３２よりも内側にある。第１表面５３１～第３表面５３３は、外表面５３を正面から見て、いずれもドーナツ形状である。外表面５３の径方向における寸法に関して、例えば、第２表面５３２が最も大きく、次に第３表面５３３が大きく、第１表面５３１が最も小さいが、特に限定されない。 Here, the outer surface 53 of the sensor 1K of the present embodiment has a first surface 531 around the inflow port 7B and a second surface 532 that is outside the first surface 531. Here, the second surface 532 is outside the first surface 531 around the first surface 531. In particular, as shown in FIG. 18C, the first surface 531 has a different inclination angle from the second surface 532, and is formed in a taper shape so as to approach the structure X1 side toward the inflow port 7B (upward). . Here, as an example, the outer surface 53 further includes a third surface 533. The third surface 533 is outside the first surface 531 and inside the second surface 532. Each of the first surface 531 to the third surface 533 has a donut shape when the outer surface 53 is viewed from the front. Regarding the radial dimension of the outer surface 53, for example, the second surface 532 is the largest, the third surface 533 is the second largest, and the first surface 531 is the smallest, but the dimensions are not particularly limited.
　水平面に対する第１表面５３１の傾斜角θ１は、例えば２３°である。水平面に対する第２表面５３２の傾斜角θ２は、例えば０°～１°である。水平面に対する第３表面５３３の傾斜角θ３は、例えば８°である。 The inclination angle θ1 of the first surface 531 with respect to the horizontal plane is, for example, 23 °. The inclination angle θ2 of the second surface 532 with respect to the horizontal plane is, for example, 0 ° to 1 °. The inclination angle θ3 of the third surface 533 with respect to the horizontal plane is, for example, 8 °.
　このように本実施形態に係る感知器１Ｋでは、外表面５３が第１表面５３１と第２表面５３２とを有しているため、火災が発生した際には、流入口７Ｂへの熱流入をさらに促進できる（図１８Ｃの矢印参照）。特に、感知器１Ｋでは、外表面５３が、第３表面５３３も含めて２段階で傾斜しているため、流入口７Ｂへの熱流入をより効果的に促進できる。 As described above, in the sensor 1K according to the present embodiment, since the outer surface 53 has the first surface 531 and the second surface 532, in the event of a fire, the heat inflow to the inflow port 7B is prevented. It can be further promoted (see arrow in FIG. 18C). In particular, in the sensor 1K, the outer surface 53 including the third surface 533 is inclined in two steps, so that the heat flow into the inflow port 7B can be more effectively promoted.
　ところで、この種の感知器においては、正常に動作するか否かについての定期点検が法令で義務付けられている（例えば半年に１回の点検）。図１９Ａに示すように、点検作業者６００は、所定の（加熱）試験器９００を用いて、構造体Ｘ１（図示例では天井）に設置されている感知器１Ｋの熱検知素子３０に対して加熱点検を行う。 By the way, with this type of sensor, regular inspection is required by law to check whether or not it operates normally (for example, inspection once every six months). As shown in FIG. 19A, the inspector 600 uses a predetermined (heating) tester 900 for the heat detection element 30 of the sensor 1K installed in the structure X1 (ceiling in the illustrated example). Perform heating inspection.
　試験器９００は、ハクキンカイロ等の熱源９１０と、上面が開放された略円筒形状で内部に熱源９１０を収容する本体部９２０と、本体部９２０を支持する支持棒９３０と、を有している。点検時には、本体部９２０は、感知器１Ｋの表カバー５１の基部５１１及び開口部７を、下方から覆うように配置される。感知器１Ｋは、熱検知素子３０等が正常であれば、熱源９１０からの熱流を受けることで、火災を検知した場合と同様の動作を行うことになる。 The tester 900 includes a heat source 910 such as a Hakkin Cairo, a main body 920 having a substantially cylindrical shape with an open upper surface and accommodating the heat source 910, and a support rod 930 supporting the main body 920. . At the time of inspection, the main body 920 is arranged so as to cover the base 511 and the opening 7 of the front cover 51 of the sensor 1K from below. If the heat detection element 30 and the like are normal, the sensor 1K receives the heat flow from the heat source 910 and performs the same operation as when detecting a fire.
　ここで実施形態１でも説明したように、熱検知素子３０が基板２に実装されるチップサーミスタであることで、感知器（１、１Ａ～１Ｋ）全体としての小型化（特に薄型化）が図られている。一方で、感知器の小型化に伴って、点検時において、感知器に対する試験器９００の位置に関する安定性が損なわれる可能性がある。 Here, as described in the first embodiment, since the heat detecting element 30 is a chip thermistor mounted on the substrate 2, reduction in size (especially thinness) of the entire sensor (1, 1A to 1K) is achieved. Has been. On the other hand, with the downsizing of the sensor, the stability of the position of the tester 900 with respect to the sensor may be impaired during inspection.
　そこで、本実施形態に係る感知器１Ｋの筐体５は、複数（例えば６つ）の凸部Ｗ１を有している（図１８Ａ及び図１８Ｂ参照：ただし、図１８Ａでは４つのみ図示）。複数の凸部Ｗ１は、開口部７の縁部（ここでは上縁部）から、感知器１Ｋが取り付けられる構造体Ｘ１の側から離れる方向（例えば下方）に突出する。複数の凸部Ｗ１は、例えば下方から見て、筐体５の周方向に沿って等間隔に並んでいる。 Therefore, the housing 5 of the sensor 1K according to this embodiment has a plurality of (for example, six) convex portions W1 (see FIGS. 18A and 18B: however, only four are shown in FIG. 18A). The plurality of protrusions W1 project from the edge (here, the upper edge) of the opening 7 in a direction (for example, downward) away from the side of the structure X1 to which the sensor 1K is attached. The plurality of convex portions W1 are arranged at equal intervals along the circumferential direction of the housing 5 when viewed from below, for example.
　複数の凸部Ｗ１は、熱検知素子３０の加熱点検を行うための試験器９００が筐体５を覆うように配置された状態で、試験器９００の周縁部９０１（図１９Ｂ参照）と接触するように構成される。このように複数の凸部Ｗ１が設けられていることで、筐体５に対して試験器９００が安定的に配置される。すなわち、凸部Ｗ１が周縁部９０１と点接触する可能性が高くなり、凸部Ｗ１が存在せずに筐体５が周縁部９０１と面接触する場合に比べて、がたつきが抑制され得る。 The plurality of convex portions W1 come into contact with the peripheral portion 901 (see FIG. 19B) of the tester 900 in a state in which the tester 900 for performing the heat check of the heat detection element 30 is arranged so as to cover the housing 5. Is configured as follows. By providing the plurality of convex portions W1 in this manner, the tester 900 is stably arranged in the housing 5. That is, the possibility that the convex portion W1 makes a point contact with the peripheral edge portion 901 increases, and rattling can be suppressed as compared with the case where the housing 5 makes a surface contact with the peripheral edge portion 901 without the convex portion W1. .
　ここでは複数の凸部Ｗ１は、円筒体５１０の下端の周縁から下方に突出する。そして、複数の凸部Ｗ１は、複数の桟部５１２と、それぞれ一対一で対応するように、筐体５の周方向に沿って同じ位置にある。具体的には、各凸部Ｗ１は、対応する桟部５１２の一部（上部）と一体となって形成されている。言い換えると、各凸部Ｗ１は、対応する桟部５１２を補強する部位としても機能する。ただし、各凸部Ｗ１は、桟部５１２の補強部位としての機能は有してなくてもよい。各凸部Ｗ１は、筐体５の周方向において、桟部５１２からずれた位置にあってもよい。 Here, the plurality of convex portions W1 protrude downward from the peripheral edge of the lower end of the cylindrical body 510. The plurality of convex portions W1 are located at the same position along the circumferential direction of the housing 5 so as to correspond to the plurality of crosspieces 512 one-to-one. Specifically, each convex portion W1 is formed integrally with a part (upper portion) of the corresponding cross section 512. In other words, each convex portion W1 also functions as a portion that reinforces the corresponding cross section 512. However, each convex portion W1 may not have a function as a reinforcing portion of the crosspiece 512. Each convex portion W1 may be located at a position displaced from the crosspiece 512 in the circumferential direction of the housing 5.
　なお、凸部Ｗ１の数は、特に限定されず、例えば１つでもよい。凸部Ｗ１の数が１つであっても、筐体５が試験器９００の周縁部９０１と面接触する場合に比べると、安定的に位置決めされ得る。 The number of the convex portions W1 is not particularly limited, and may be one, for example. Even when the number of the convex portions W1 is one, the positioning can be performed more stably than when the housing 5 makes surface contact with the peripheral edge portion 901 of the tester 900.
　また図２０は、実施形態３の変形例である感知器１Ｌを示す。この変形例の感知器１Ｌも、外表面５３がテーパ状に形成された第１表面５３１を有している。感知器１Ｌは、一例としてＰ型熱感知器である。特に感知器１Ｌは、実施形態２の変形例１の感知器１Ｇと同様に、３本の柱（左右一対の第１柱Ｖ１２と真ん中の第２柱Ｖ１３）を有した遮蔽部Ｖ１を、２セット備えている。図２０では、２セットの遮蔽部Ｖ１のうち１セットだけが図示されていて、残りの１セットの遮蔽部Ｖ１は、裏側に位置する。 Further, FIG. 20 shows a sensor 1L which is a modified example of the third embodiment. The sensor 1L of this modification also has a first surface 531 in which the outer surface 53 is tapered. The sensor 1L is, for example, a P-type heat sensor. In particular, the sensor 1L includes the shielding portion V1 having three columns (a pair of left and right first columns V12 and the second column V13 in the middle) as in the sensor 1G of the first modification of the second embodiment. I have a set. In FIG. 20, only one set of the two sets of shields V1 is shown, and the remaining one set of shields V1 is located on the back side.
　また感知器１Ｌは、試験器９００の周縁部９０１（図１９Ｂ参照）と接触するように構成された、複数（例えば４つ）の凸部Ｗ１を有している（図２０参照：ただし、３つのみ図示）。ここで４つの凸部Ｗ１のうちの、少なくとも１つの凸部Ｗ１は、遮蔽部Ｖ１の真ん中の第２柱Ｖ１３を補強する部位としても機能するように、当該第２柱Ｖ１３の一部（上部）と一体となって形成されている。要するに、感知器１Ｌの４つの凸部Ｗ１は、２つの桟部５１２及び２つの第２柱Ｖ１３（図示される遮蔽部Ｖ１とは反対側にある遮蔽部Ｖ１の第２柱Ｖ１３も含む）に対して、それぞれ一対一で対応するように、筐体５の周方向に沿って、これらと同じ位置にある。 Further, the sensor 1L has a plurality of (for example, four) convex portions W1 configured to contact the peripheral portion 901 (see FIG. 19B) of the tester 900 (see FIG. 20: 3 Only one shown). Here, at least one of the four protrusions W1 has a part (upper part) of the second pillar V13 so that at least one protrusion W1 also functions as a part that reinforces the second pillar V13 in the middle of the shielding portion V1. ) Is formed integrally. In short, the four convex portions W1 of the sensor 1L are formed on the two crosspieces 512 and the two second pillars V13 (including the second pillar V13 of the shielding portion V1 on the opposite side of the shielding portion V1 shown in the drawing). On the other hand, they are at the same positions along the circumferential direction of the housing 5 so as to correspond to each other one by one.
　（実施形態４）
　以下、本実施形態に係る感知器１Ｍについて図２１Ａ及び図２１Ｂを参照しながら説明する。以下、実施形態１と実質的に同様の構成については、共通の符号を付して適宜説明を省略する。なお、図２１Ａ及び図２１Ｂに示す感知器１Ｍは、一例としてＲ型熱感知器である。また感知器１Ｍは、実施形態１における変形例３の感知器１Ｃと同様に、煙検知部４を備えておらず熱の検知のみにより火災等の発生を判定する熱感知器である。また感知器１Ｍは、３本の柱を有した遮蔽部Ｖ１を複数セット備えている。 (Embodiment 4)
Hereinafter, the sensor 1M according to the present embodiment will be described with reference to FIGS. 21A and 21B. Hereinafter, configurations that are substantially the same as those of the first embodiment will be denoted by common reference numerals, and description thereof will be appropriately omitted. The sensor 1M shown in FIGS. 21A and 21B is, for example, an R-type heat sensor. Like the sensor 1C of the third modification of the first embodiment, the sensor 1M is a heat sensor that does not include the smoke detector 4 and determines the occurrence of a fire or the like only by detecting heat. In addition, the sensor 1M includes a plurality of sets of shielding portions V1 having three columns.
　感知器１Ｍは、その本体１００Ａを構造体Ｘ１（図示例では天井）に設置するための取付ベース１００Ｂを更に備える。取付ベース１００Ｂは、実施形態１の感知器（１、１Ａ～１Ｅ）、実施形態２の感知器（１Ｆ～１Ｊ）、又は実施形態３（１Ｋ、１Ｌ）に対しても適宜適用されてもよい。 The sensor 1M further includes a mounting base 100B for mounting the main body 100A on the structure X1 (ceiling in the illustrated example). The mounting base 100B may be appropriately applied to the sensors (1, 1A to 1E) of the first embodiment, the sensors (1F to 1J) of the second embodiment, or the third embodiment (1K, 1L). .
　取付ベース１００Ｂは、全体として下面が開放された扁平な円筒状に形成されている。取付ベース１００Ｂは、ねじ止め等により構造体Ｘ１の表面に固定される。構造体Ｘ１には、その裏側にある電線（給電線及び信号線等）を導出するための孔が設けられている。取付ベース１００Ｂは、その底部１０６に、構造体Ｘ１の孔から導出された電線を本体１００Ａに向かって通すための貫通孔１０３（図２１Ｂ参照）を有している。 The mounting base 100B is formed in a flat cylindrical shape with an open lower surface as a whole. The mounting base 100B is fixed to the surface of the structure X1 by screwing or the like. The structure X1 is provided with a hole for leading out an electric wire (a power supply line, a signal line, etc.) on the back side thereof. The mounting base 100B has a through hole 103 (see FIG. 21B) in the bottom portion 106 for passing an electric wire led out from the hole of the structure X1 toward the main body 100A.
　また取付ベース１００Ｂは、外周壁１０４と、外周壁１０４よりも外側に突出する鍔部１０５とを有している。外周壁１０４は、本体１００Ａの上側における、円筒体５１０と裏カバー５２（図１参照）とによって構成された凹所に嵌まり込むように構成される。詳細な説明は省略するが、例えば外周壁１０４を本体１００Ａの上記凹所に嵌め込んだ状態で、軸方向に対して右回りに回転させることで、裏カバー５２の係合部が係合する被係合部が、取付ベース１００Ｂに設けられている。本体１００Ａは、裏カバー５２の係合部が被係合部に係合することで、取付ベース１００Ｂに固定される。 Further, the mounting base 100B has an outer peripheral wall 104 and a flange portion 105 projecting outward from the outer peripheral wall 104. The outer peripheral wall 104 is configured to fit into a recess formed by the cylindrical body 510 and the back cover 52 (see FIG. 1) on the upper side of the main body 100A. Although a detailed description is omitted, for example, when the outer peripheral wall 104 is fitted in the recess of the main body 100A and rotated clockwise with respect to the axial direction, the engaging portion of the back cover 52 is engaged. The engaged portion is provided on the mounting base 100B. The main body 100A is fixed to the mounting base 100B by the engaging portion of the back cover 52 engaging with the engaged portion.
　感知器１Ｍは、図２１Ａに示すように、本体１００Ａが取付ベース１００Ｂに固定された状態において、鍔部１０５の外周面と円筒体５１０の外周面とが略面一となるので、外観上の見栄えのよい感知器として提供できる。 As shown in FIG. 21A, when the main body 100A is fixed to the mounting base 100B, the outer peripheral surface of the collar portion 105 and the outer peripheral surface of the cylindrical body 510 of the sensor 1M are substantially flush with each other. It can be provided as a good-looking sensor.
　ところで、上述した取付ベース１００Ｂは、感知器１Ｍを構造体Ｘ１の表面に直付け設置するタイプのベースユニットである。これに対して、本実施形態の変形例として、取付ベース１００Ｂの代わりに、感知器１Ｍは、図２２Ａ及び図２２Ｂに示すように、埋込ベース１００Ｃを備えてもよい。埋込ベース１００Ｃは、感知器１Ｍを構造体Ｘ１に対して埋め込み設置するタイプのベースユニットである。 By the way, the mounting base 100B described above is a type of base unit in which the sensor 1M is directly mounted on the surface of the structure X1. On the other hand, as a modified example of the present embodiment, instead of the mounting base 100B, the sensor 1M may include an embedded base 100C as shown in FIGS. 22A and 22B. The embedded base 100C is a base unit of a type in which the sensor 1M is embedded and installed in the structure X1.
　埋込ベース１００Ｃは、構造体Ｘ１にある埋め込み用の孔に挿入されるベース本体１０７と、ベース本体１０７と一体となって形成されている化粧部１０８と、を有している。 The embedded base 100C has a base body 107 that is inserted into a hole for embedding in the structure X1 and a decorative portion 108 that is integrally formed with the base body 107.
　ベース本体１０７は、下面が開放された扁平な円筒状に形成されている。また埋込ベース１００Ｃは、例えば、構造体Ｘ１の上記孔に挿入された状態で構造体Ｘ１に固定するための取付金具（後述する第１取付金具Ｔ１又は第２取付金具Ｔ２）を更に有している。ベース本体１０７は、その底部１０９に、構造体Ｘ１の裏側にある電線を本体１００Ａに向かって通すための貫通孔１１０（図２２Ｂ参照）を有している。 The base body 107 is formed in a flat cylindrical shape with an open lower surface. Further, the embedded base 100C further includes, for example, a mounting bracket (a first mounting bracket T1 or a second mounting bracket T2 described later) for fixing the embedded base 100C to the structure X1 while being inserted into the hole of the structure X1. ing. The base body 107 has a through hole 110 (see FIG. 22B) in the bottom portion 109 for passing an electric wire on the back side of the structure X1 toward the body 100A.
　ベース本体１０７は、本体１００Ａの外径よりも僅かに大きい内径の凹所１１１を有している。すなわち、本体１００Ａは、凹所１１１内に収容可能となっている。ここでは、凹所１１１は、円筒体５１０における上下方向の略半分が凹所１１１内に収まる程度の深さを有している。 The base body 107 has a recess 111 having an inner diameter slightly larger than the outer diameter of the main body 100A. That is, the main body 100A can be housed in the recess 111. Here, the recess 111 has a depth such that approximately half of the vertical direction of the cylindrical body 510 fits into the recess 111.
　化粧部１０８は、ベース本体１０７の下端から外側に向かって鍔状に突出する。化粧部１０８は、ベース本体１０７が構造体Ｘ１の上記孔に挿入された状態で、構造体Ｘ１の表面よりも下方に位置して露出する。 Decorative part 108 protrudes outward from the lower end of base body 107 in a brim shape. The makeup section 108 is positioned and exposed below the surface of the structure X1 with the base body 107 inserted into the hole of the structure X1.
　詳細な説明は省略するが、例えば本体１００Ａをベース本体１０７の凹所１１１内に嵌め込んだ状態で、軸方向に対して右回りに回転させることで、裏カバー５２の係合部が係合する被係合部が、埋込ベース１００Ｃに設けられている。本体１００Ａは、裏カバー５２の係合部が被係合部に係合することで、埋込ベース１００Ｃに固定される。 Although a detailed description is omitted, for example, when the main body 100A is fitted in the recess 111 of the base main body 107 and rotated clockwise with respect to the axial direction, the engagement portion of the back cover 52 is engaged. The engaged portion is provided in the embedded base 100C. The main body 100A is fixed to the embedding base 100C by the engaging portion of the back cover 52 engaging with the engaged portion.
　感知器１Ｍは、図２２Ａに示すように、本体１００Ａが埋込ベース１００Ｃに固定された状態において、構造体Ｘ１の表面からの突出量を抑えることができるため、外観上の見栄えのよい感知器として提供できる。 As shown in FIG. 22A, the sensor 1M can suppress the amount of protrusion from the surface of the structure X1 in a state where the main body 100A is fixed to the embedded base 100C, and thus has a good appearance. Can be provided as.
　ここで、一対の第１取付金具Ｔ１を用いて埋込ベース１００Ｃを構造体Ｘ１へ取り付ける取付方法について、図２３Ａを参照しながら説明する。埋込ベース１００Ｃは、一対の第１取付金具Ｔ１を有している。図２３Ａでは、説明の便宜上、構造体Ｘ１のみを断面で示している。各第１取付金具Ｔ１は、固定ねじＴ１１と、部分的に屈曲した板ばね状の固定片Ｔ１２と、を有している。固定片Ｔ１２は、固定ねじＴ１１が螺合されるねじ孔を有している。固定片Ｔ１２は、固定ねじＴ１１がベース本体１０７の底部１０９にある貫通孔に下方から挿入された状態で、ベース本体１０７の上側で、固定ねじＴ１１に仮固定されている。言い換えれば、固定片Ｔ１２の平坦部Ｔ１２０と固定ねじＴ１１の頭部とで底部１０９を挟み込んだ状態となっている。 Here, a mounting method for mounting the embedded base 100C to the structure X1 using the pair of first mounting brackets T1 will be described with reference to FIG. 23A. The embedded base 100C has a pair of first mounting brackets T1. In FIG. 23A, for convenience of description, only the structure X1 is shown in a cross section. Each first mounting member T1 has a fixing screw T11 and a partially bent plate spring-shaped fixing piece T12. The fixing piece T12 has a screw hole into which the fixing screw T11 is screwed. The fixing piece T12 is temporarily fixed to the fixing screw T11 on the upper side of the base body 107 in a state where the fixing screw T11 is inserted into the through hole in the bottom portion 109 of the base body 107 from below. In other words, the bottom portion 109 is sandwiched between the flat portion T120 of the fixed piece T12 and the head portion of the fixing screw T11.
　埋込ベース１００Ｃを構造体Ｘ１へ取り付ける際には、まず各固定ねじＴ１１をドライバー等の工具で緩めて、上記の挟み込んだ状態を解除する。この状態で、各固定片Ｔ１２は、固定ねじＴ１１と共に、内側へ傾斜可能となっている（図２３Ａの想像線を参照）。各固定片Ｔ１２を内側に傾けて、その状態を維持しながらベース本体１０７を構造体Ｘ１の孔Ｘ１１に挿入する。その後、各固定ねじＴ１１をドライバー等の工具で締め付けることで、固定片Ｔ１２が、ベース本体１０７と接触している平坦部Ｔ１２０を支点として外側に倒れこみ、その先端Ｔ１２１（作用点）が構造体Ｘ１の裏面に接触する。そして更に各固定ねじＴ１１を締め付けることで、構造体Ｘ１は、各固定片Ｔ１２の先端Ｔ１２１と、化粧部１０８とで、上下方向において挟み込むことになり、その結果、埋込ベース１００Ｃが構造体Ｘ１に固定される。 When attaching the embedded base 100C to the structure X1, first loosen each fixing screw T11 with a tool such as a screwdriver to release the pinched state. In this state, each fixing piece T12 can be tilted inward together with the fixing screw T11 (see the imaginary line in FIG. 23A). Each fixing piece T12 is tilted inward, and the base body 107 is inserted into the hole X11 of the structure X1 while maintaining that state. Then, by tightening each fixing screw T11 with a tool such as a screwdriver, the fixing piece T12 falls outward with the flat portion T120 in contact with the base body 107 as a fulcrum, and its tip T121 (point of action) is the structure. Touch the back of X1. Then, by further tightening each fixing screw T11, the structure X1 is sandwiched in the vertical direction by the tip T121 of each fixing piece T12 and the decorative portion 108, and as a result, the embedded base 100C becomes the structure X1. Fixed to.
　次に、一対の第２取付金具Ｔ２を用いて埋込ベース１００Ｃを構造体Ｘ１へ取り付ける取付方法について、図２３Ｂを参照しながら説明する。埋込ベース１００Ｃは、一対の第２取付金具Ｔ２を有している。図２３Ｂでは、説明の便宜上、構造体Ｘ１のみを断面で示している。各第２取付金具Ｔ２は、固定ねじＴ２１と、平坦な矩形の板状の固定片Ｔ２２と、を有している。固定片Ｔ２２は、固定ねじＴ２１が螺合されるねじ孔を有している。固定片Ｔ２２は、固定ねじＴ２１が化粧部１０８にある貫通孔に下方から挿入された状態で、化粧部１０８の上側で、固定ねじＴ２１に仮固定されている。 Next, a mounting method for mounting the embedded base 100C to the structure X1 using the pair of second mounting brackets T2 will be described with reference to FIG. 23B. The embedded base 100C has a pair of second mounting brackets T2. In FIG. 23B, for convenience of description, only the structure X1 is shown in a cross section. Each second mounting member T2 has a fixing screw T21 and a flat rectangular plate-shaped fixing piece T22. The fixing piece T22 has a screw hole into which the fixing screw T21 is screwed. The fixing piece T22 is temporarily fixed to the fixing screw T21 on the upper side of the decorative portion 108 in a state where the fixing screw T21 is inserted into the through hole in the decorative portion 108 from below.
　埋込ベース１００Ｃを構造体Ｘ１へ取り付ける際には、まず各固定ねじＴ２１をドライバー等の工具で緩めて、固定片Ｔ２２の先端が内側を向くように回転させる。この状態を維持しながらベース本体１０７を構造体Ｘ１の孔Ｘ１１に挿入する。その後、各固定ねじＴ２１をドライバー等の工具で締め付けることで、固定片Ｔ２２の先端が外側を向き、さらに固定片Ｔ２２は、構造体Ｘ１の裏面に向かって下降して概ね面接触する。そして更に各固定ねじＴ２１を締め付けることで、構造体Ｘ１は、各固定片Ｔ２２と、化粧部１０８とで、上下方向において挟み込むことになり、その結果、埋込ベース１００Ｃが構造体Ｘ１に固定される。 When mounting the embedded base 100C to the structure X1, first loosen each fixing screw T21 with a tool such as a screwdriver, and rotate so that the tip of the fixing piece T22 faces inward. While maintaining this state, the base body 107 is inserted into the hole X11 of the structure X1. Then, by tightening each fixing screw T21 with a tool such as a screwdriver, the tip of the fixing piece T22 faces outward, and further, the fixing piece T22 descends toward the back surface of the structure X1 to make substantially surface contact. Then, by further tightening each fixing screw T21, the structure X1 is sandwiched by each fixing piece T22 and the decorative portion 108 in the vertical direction, and as a result, the embedded base 100C is fixed to the structure X1. It
　上述した第１取付金具Ｔ１及び第２取付金具Ｔ２は、単なる一例であって、埋込ベース１００Ｃを構造体Ｘ１に固定するための取付金具は、これらに限定されない。また上述した取付方法も、単なる一例であって、これらに限定されない。 The above-described first mounting bracket T1 and second mounting bracket T2 are merely examples, and the mounting bracket for fixing the embedded base 100C to the structure X1 is not limited to these. Further, the above-described mounting method is also merely an example and is not limited to these.
　（４）まとめ
　以上説明したように、第１の態様に係る感知器（１、１Ａ～１Ｍ）は、基板（２）と、熱検知素子（３０）と、筐体（５）と、を備える。筐体（５）は、基板（２）を収容する。筐体（５）は、その内部空間（ＳＰ１）に設けられて気体が流れる流路（６）と、流路（６）と筐体（５）の外部空間（ＳＰ２）とを繋ぐ開口部（７）と、を有する。熱検知素子（３０）は、基板（２）に実装されて、開口部（７）から流入した気体の熱を検知するチップサーミスタである。第１の態様によれば、熱検知素子（３０）が、基板（２）に実装されるチップサーミスタであるため、感知器（１、１Ａ～１Ｍ）全体としての小型化を図ることができる。 (4) Summary As described above, the sensor (1, 1A to 1M) according to the first aspect includes the substrate (2), the heat detecting element (30), and the housing (5). . The housing (5) houses the substrate (2). The housing (5) is provided with an internal space (SP1) and a flow path (6) through which gas flows, and an opening (connecting the flow path (6) and the external space (SP2) of the housing (5) ( 7) and. The heat detecting element (30) is a chip thermistor mounted on the substrate (2) and detecting the heat of the gas flowing in from the opening (7). According to the first aspect, since the heat detection element (30) is a chip thermistor mounted on the substrate (2), the size of the sensor (1, 1A to 1M) as a whole can be reduced.
　第２の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１の態様において、基板（２）の表面（例えば第１面２１）の少なくとも一部の領域は、流路（６）に露出することが好ましい。第２の態様によれば、熱検知素子（３０）が流路（６）を流れる気体に曝される可能性をより高めることができるため、熱の検知性能をより向上させつつ、小型化を図ることができる。 Regarding the sensor (1, 1A to 1M) according to the second aspect, in the first aspect, at least a partial region of the surface (eg, the first surface 21) of the substrate (2) is in the flow path (6). It is preferable to expose. According to the second aspect, it is possible to further increase the possibility that the heat detection element (30) is exposed to the gas flowing through the flow path (6), and therefore, it is possible to improve the heat detection performance and reduce the size. Can be planned.
　第３の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１の態様又は第２の態様において、チップサーミスタは、外部空間（ＳＰ２）の側から開口部（７）の開口領域（７０）を見たときに、開口領域（７０）内に収まるように配置されていることが好ましい。第３の態様によれば、熱検知素子（３０）が流路（６）を流れる気体に曝される可能性をより高めることができるため、熱の検知性能をより向上させつつ、小型化を図ることができる。 Regarding the sensor (1, 1A to 1M) according to the third aspect, in the first aspect or the second aspect, the chip thermistor has an opening area (70) of the opening (7) from the side of the external space (SP2). ), It is preferably arranged so as to fit within the opening region (70). According to the third aspect, it is possible to further increase the possibility that the heat detecting element (30) is exposed to the gas flowing through the flow path (6), and thus it is possible to reduce the size while improving the heat detecting performance. Can be planned.
　第４の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第３の態様において、チップサーミスタは、次の位置にあることが好ましい。すなわち、チップサーミスタは、外部空間（ＳＰ２）の側から開口領域（７０）を見たときに、開口領域（７０）内において、基板（２）の表面（例えば第１面２１）と直交する方向における開口領域（７０）の中央に位置することが好ましい。第４の態様によれば、例えばチップサーミスタが上記方向における開口領域（７０）の一端寄りに位置する場合に比べて、熱検知素子（３０）が流路（６）を流れる気体に曝される可能性を更に高めることができる。 Regarding the sensors (1, 1A to 1M) according to the fourth aspect, in the third aspect, the chip thermistor is preferably located at the following position. That is, the chip thermistor has a direction orthogonal to the surface (eg, the first surface 21) of the substrate (2) within the opening region (70) when the opening region (70) is viewed from the external space (SP2) side. It is preferably located in the center of the open area (70) at. According to the fourth aspect, for example, the heat detecting element (30) is exposed to the gas flowing through the flow path (6) as compared with the case where the chip thermistor is located near one end of the opening region (70) in the above direction. The possibility can be further increased.
　第５の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１～第４の態様のいずれか１つにおいて、流路（６）は、開口部（７）の側にある第１路（６１）と、第１路（６１）と繋がっていて内部空間（ＳＰ１）の中央部の側にある第２路（６２）とを含む。チップサーミスタは、第１路（６１）内にあることが好ましい。第５の態様によれば、例えばチップサーミスタが第２路（６２）内にある場合に比べて、熱検知に関する応答性を高めることができる。 Regarding the sensor (1, 1A to 1M) according to the fifth aspect, in any one of the first to fourth aspects, the flow path (6) is the first path on the side of the opening (7). (61) and a second path (62) connected to the first path (61) and located on the side of the central portion of the internal space (SP1). The chip thermistor is preferably in the first path (61). According to the fifth aspect, the responsiveness regarding heat detection can be improved as compared with the case where the chip thermistor is in the second path (62), for example.
　第６の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１～第５の態様のいずれか１つにおいて、流路（６）は、開口部（７）の側にある第１路（６１）と、第１路（６１）と繋がっていて内部空間（ＳＰ１）の中央部の側にある第２路（６２）とを含む。第１路（６１）の開口断面積は、第２路（６２）の開口断面積よりも小さいことが好ましい。第６の態様によれば、開口部（７）を通じて流路（６）内へ入った気体が、第１路（６１）から第２路（６２）に向かって流れるように促進させることができる。 Regarding the sensor (1, 1A to 1M) according to the sixth aspect, in any one of the first to fifth aspects, the flow path (6) is the first path on the side of the opening (7). (61) and a second path (62) connected to the first path (61) and located on the side of the central portion of the internal space (SP1). The opening cross-sectional area of the first path (61) is preferably smaller than the opening cross-sectional area of the second path (62). According to the sixth aspect, the gas that has entered the flow path (6) through the opening (7) can be promoted to flow from the first path (61) toward the second path (62). .
　第７の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第６の態様において、筐体（５）は、当該感知器（１、１Ａ～１Ｍ）が取り付けられる構造体（Ｘ１）と対向する設置面（５５）を有することが好ましい。第２路（６２）は、第１路（６１）から上記中央部に向かうほど、設置面（５５）に近づく方向に拡がっていることが好ましい。第７の態様によれば、第１路（６１）から第２路（６２）に向かう気流をより効果的に発生させることができる。 Regarding the sensor (1, 1A to 1M) according to the seventh aspect, in the sixth aspect, the housing (5) faces the structure (X1) to which the sensor (1, 1A to 1M) is attached. It is preferable to have an installation surface (55) for It is preferable that the second road (62) expands in a direction closer to the installation surface (55) from the first road (61) toward the central portion. According to the seventh aspect, it is possible to more effectively generate the airflow from the first road (61) to the second road (62).
　第８の態様に係る感知器（１、１Ａ～１Ｍ）は、第１～第７の態様のいずれか１つにおいて、内部空間（ＳＰ１）の中央部に配置され、煙を検知する煙検知部（４）を、更に備えることが好ましい。第８の態様によれば、熱だけでなく煙も検知するため、火災の感知性能を高めつつ、感知器（１、１Ａ～１Ｍ）全体としての小型化を図ることができる。 The sensor (1, 1A to 1M) according to the eighth aspect is the smoke detecting section according to any one of the first to seventh aspects, which is arranged in a central portion of the internal space (SP1) and detects smoke. It is preferable to further include (4). According to the eighth aspect, since not only heat but also smoke is detected, it is possible to reduce the size of the detector (1, 1A to 1M) as a whole while improving the fire detection performance.
　第９の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第８の態様において、煙検知部（４）は、チップサーミスタが実装された基板（２）の表面（例えば第１面２１）と同一平面側に配置されていることが好ましい。第９の態様によれば、火災の感知性能を更に高めつつ、感知器（１、１Ａ～１Ｍ）全体としての小型化を図ることができる。 Regarding the sensor (1, 1A to 1M) according to the ninth aspect, in the eighth aspect, the smoke detecting section (4) has a surface (for example, the first surface 21) of the substrate (2) on which the chip thermistor is mounted. It is preferably arranged on the same plane side as. According to the ninth aspect, it is possible to reduce the size of the detector (1, 1A to 1M) as a whole while further improving the fire detection performance.
　第１０の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第８の態様又は第９の態様において、筐体（５）は、当該感知器（１、１Ａ～１Ｍ）が取り付けられる構造体（Ｘ１）と対向する設置面（５５）を有することが好ましい。煙検知部（４）は、基板（２）における表面（例えば第１面２１）、及び表面とは反対側の裏面（例えば第２面２２）のうち、設置面（５５）に近い側の面に、配置されていることが好ましい。第１０の態様によれば、例えば煙検知部（４）が設置面（５５）に遠い側の面に配置されている場合に比べて、さらに小型化を図ることができる。 Regarding the sensor (1, 1A to 1M) according to the tenth aspect, in the eighth or ninth aspect, the housing (5) has a structure to which the sensor (1, 1A to 1M) is attached. It is preferable to have an installation surface (55) facing (X1). The smoke detection unit (4) is a surface (e.g., the first surface 21) of the substrate (2) and a surface (e.g., the second surface 22) opposite to the surface, which is closer to the installation surface (55). It is preferable that they are arranged. According to the tenth aspect, it is possible to further reduce the size, for example, as compared with the case where the smoke detection unit (4) is arranged on the surface far from the installation surface (55).
　第１１の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第８～第１０の態様のいずれか１つにおいて、筐体（５）は、内部空間（ＳＰ１）において、１又は複数の壁体（制御板５２２）を有することが好ましい。１又は複数の壁体（制御板５２２）は、熱検知素子（３０）又は煙検知部（４）に気体を誘導することが好ましい。第１１の態様によれば、火災の感知性能を更に高めることができる。 Regarding the sensor (1, 1A to 1M) according to the eleventh aspect, in any one of the eighth to tenth aspects, the housing (5) has one or more walls in the internal space (SP1). It is preferable to have a body (control plate 522). It is preferable that one or a plurality of walls (control plate 522) guide the gas to the heat detecting element (30) or the smoke detecting section (4). According to the eleventh aspect, the fire sensing performance can be further enhanced.
　第１２の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第８～第１１の態様のいずれか１つにおいて、筐体（５）は、当該感知器（１、１Ａ～１Ｍ）が取り付けられる構造体（Ｘ１）と対向する設置面（５５）を有することが好ましい。煙検知部（４）は、光を放射する光学素子（４１）と、光学素子（４１）から放射された光を受光する受光素子（４２）と、ラビリンス部（４３）と、を有する。ラビリンス部（４３）内において、光学素子（４１）及び受光素子（４２）は、互いに対向しないように配置される。基板（２）の厚み方向（上下方向）において、ラビリンス部（４３）の内部空間の中心（Ｐ１）は、チップサーミスタと設置面（５５）との間にあることが好ましい。第１２の態様によれば、熱だけでなく煙も検知する感知器（１、１Ａ～１Ｍ）において、火災の感知性能を更に高めつつ、感知器（１、１Ａ～１Ｍ）全体としての小型化を図ることができる。 Concerning the sensor (1, 1A to 1M) according to the twelfth aspect, in any one of the eighth to eleventh aspects, the sensor (1, 1A to 1M) is attached to the housing (5). It is preferable to have an installation surface (55) facing the structure (X1) to be formed. The smoke detecting section (4) has an optical element (41) for emitting light, a light receiving element (42) for receiving the light emitted from the optical element (41), and a labyrinth section (43). In the labyrinth portion (43), the optical element (41) and the light receiving element (42) are arranged so as not to face each other. In the thickness direction (vertical direction) of the substrate (2), the center (P1) of the internal space of the labyrinth portion (43) is preferably located between the chip thermistor and the installation surface (55). According to the twelfth aspect, in the sensor (1, 1A to 1M) that detects not only heat but also smoke, the size of the sensor (1, 1A to 1M) as a whole can be reduced while further improving fire detection performance. Can be achieved.
　第１３の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１～第１２の態様のいずれか１つにおいて、チップサーミスタは、外部空間（ＳＰ２）の側から開口部（７）の開口領域（７０）を見たときに開口領域（７０）内に収まるように配置されることが好ましい。感知器（１、１Ａ～１Ｍ）は、チップサーミスタよりも外部空間（ＳＰ２）の側において開口領域（７０）の一部を遮る遮蔽部（Ｖ１）を、更に備えることが好ましい。第１３の態様によれば、遮蔽部（Ｖ１）が設けられていることで、開口部（７）からの熱流入が妨げられにくくしつつ、例えば意図せずに人の指又は工具等がチップサーミスタに接触してしまう可能性を低減できる。 Regarding the sensor (1, 1A to 1M) according to the thirteenth aspect, in any one of the first to twelfth aspects, the chip thermistor has an opening (7) from the side of the external space (SP2). It is preferably arranged to fit within the open area (70) when the area (70) is viewed. It is preferable that the sensors (1, 1A to 1M) further include a shield (V1) that shields a part of the opening region (70) on the side of the external space (SP2) with respect to the chip thermistor. According to the thirteenth aspect, since the shielding part (V1) is provided, it is possible to prevent the heat inflow from the opening part (7) from being hindered and, for example, to unintentionally insert a finger or a tool of a person into the tip. The possibility of contacting the thermistor can be reduced.
　第１４の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１３の態様において、遮蔽部（Ｖ１）は、外部空間（ＳＰ２）からの気流をチップサーミスタに向かって誘導する誘導面（Ｖ２）を有することが好ましい。第１４の態様によれば、遮蔽部（Ｖ１）によって開口部（７）からの熱流入が妨げられる可能性をさらに低減できる。 Regarding the sensor (1, 1A to 1M) according to the fourteenth aspect, in the thirteenth aspect, the shielding part (V1) includes a guide surface (V2 that guides the airflow from the external space (SP2) toward the chip thermistor. ) Are preferred. According to the fourteenth aspect, it is possible to further reduce the possibility that the flow of heat through the opening (7) is blocked by the shield (V1).
　第１５の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１３の態様又は第１４の態様において、筐体（５）は、第１カバー（例えば表カバー５１及び裏カバー５２の一方）と、第２カバー（他方）と、を有することが好ましい。第１カバーは、基板（２）の厚み方向における一の方向から基板（２）を覆う。第２カバーは、上記厚み方向における上記一の方向とは反対の方向から基板（２）を覆う。遮蔽部（Ｖ１）は、第１カバーから第２カバーに向かって突出する第１突起（Ｖ１４、Ｖ１６）と、第２カバーから第１カバーに向かって突出する第２突起（Ｖ１５、Ｖ１７）と、を有することが好ましい。第１５の態様によれば、さらに開口部（７）からの熱流入が妨げられにくくしつつ、人の指又は工具等がチップサーミスタに接触してしまう可能性を低減できる。 Regarding the sensor (1, 1A to 1M) according to the fifteenth aspect, in the thirteenth aspect or the fourteenth aspect, the housing (5) includes the first cover (for example, one of the front cover 51 and the back cover 52). And a second cover (the other side). The first cover covers the substrate (2) from one direction in the thickness direction of the substrate (2). The second cover covers the substrate (2) from a direction opposite to the one direction in the thickness direction. The shielding part (V1) includes a first protrusion (V14, V16) protruding from the first cover toward the second cover, and a second protrusion (V15, V17) protruding from the second cover toward the first cover. It is preferable to have According to the fifteenth aspect, it is possible to further reduce the possibility that a human finger, a tool, or the like will come into contact with the chip thermistor while making it more difficult to prevent the heat inflow from the opening (7).
　第１６の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１５の態様において、第１突起（Ｖ１４）は、次のように配置されることが好ましい。すなわち、第１突起（Ｖ１４）は、外部空間（ＳＰ２）の側から開口領域（７０）を見たときに、第１カバーと第２カバーとが並ぶ並び方向と直交する方向において、第２突起（Ｖ１５）に対して、ずれて配置されることが好ましい。第１６の態様によれば、遮蔽部（Ｖ１）によって開口部（７）からの熱流入が妨げられる可能性をさらに低減できる。 Regarding the sensor (1, 1A to 1M) according to the sixteenth aspect, in the fifteenth aspect, the first protrusion (V14) is preferably arranged as follows. That is, the first protrusion (V14) is the second protrusion in the direction orthogonal to the arranging direction of the first cover and the second cover when the opening region (70) is viewed from the side of the external space (SP2). It is preferable to dispose with respect to (V15). According to the sixteenth aspect, it is possible to further reduce the possibility that the flow of heat from the opening (7) is blocked by the shield (V1).
　第１７の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１５の態様において、第１突起（Ｖ１６）及び第２突起（Ｖ１７）は、互いの先端同士が対向するように突出することが好ましい。第１７の態様によれば、人の指又は工具等がチップサーミスタに接触してしまう可能性をさらに低減できる。 With regard to the sensor (1, 1A to 1M) according to the seventeenth aspect, in the fifteenth aspect, the first protrusion (V16) and the second protrusion (V17) project so that their tips are opposed to each other. Is preferred. According to the seventeenth aspect, it is possible to further reduce the possibility that a human finger, a tool, or the like will come into contact with the chip thermistor.
　第１８の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１５～第１７の態様のいずれか１つにおいて、第１突起（Ｖ１４、Ｖ１６）及び第２突起（Ｖ１５、Ｖ１７）の少なくとも一方（ここでは第２突起Ｖ１５）は、次の通りであることが好ましい。すなわち、上記少なくとも一方は、外部空間（ＳＰ２）の側から開口領域（７０）を見たときに、第１カバーと第２カバーとが並ぶ並び方向と直交する方向においてチップサーミスタと同じ位置にあることが好ましい。さらに上記少なくとも一方は、外部空間（ＳＰ２）の側から開口領域（７０）を見たときに、チップサーミスタの少なくとも一部が露出するように上記少なくとも一方の突出量が規定されていることが好ましい。第１８の態様によれば、さらに開口部（７）からの熱流入が妨げられにくくしつつ、人の指又は工具等がチップサーミスタに接触してしまう可能性を低減できる。 Regarding the sensor (1, 1A to 1M) according to the eighteenth aspect, in any one of the fifteenth to seventeenth aspects, at least the first protrusion (V14, V16) and the second protrusion (V15, V17). One (here, the second protrusion V15) is preferably as follows. That is, at least one of the above is at the same position as the chip thermistor in the direction orthogonal to the arranging direction of the first cover and the second cover when the opening region (70) is viewed from the side of the external space (SP2). It is preferable. Furthermore, it is preferable that the projection amount of at least one of the at least one is defined such that at least a part of the chip thermistor is exposed when the opening region (70) is viewed from the side of the external space (SP2). . According to the eighteenth aspect, it is possible to further reduce the possibility that a human finger, a tool, or the like will come into contact with the chip thermistor while making it more difficult to prevent heat inflow from the opening (7).
　第１９の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１～第１８の態様のいずれか１つにおいて、開口部（７）は、流入口（７Ｂ）を有することが好ましい。流入口（７Ｂ）は、筐体（５）における、感知器（１、１Ａ～１Ｍ）が取り付けられる構造体（Ｘ１）とは反対側の外表面（５３）に設けられている。第１９の態様によれば、流入口（７Ｂ）から流入した気体の熱を検知できるため、熱検知に関する応答性を高めることができる。 Regarding the sensor (1, 1A to 1M) according to the nineteenth aspect, in any one of the first to eighteenth aspects, it is preferable that the opening (7) has an inflow port (7B). The inlet (7B) is provided on the outer surface (53) of the housing (5) opposite the structure (X1) to which the sensors (1, 1A-1M) are attached. According to the nineteenth aspect, the heat of the gas flowing in from the inflow port (7B) can be detected, so that the responsiveness regarding heat detection can be improved.
　第２０の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１９の態様において、外表面（５３）は、流入口（７Ｂ）の周囲における第１表面（５３１）と、第１表面（５３１）よりも外側にある第２表面（５３２）と、を有することが好ましい。第１表面（５３１）は、第２表面（５３２）とは異なる傾斜角で、流入口（７Ｂ）に近づくほど構造体（Ｘ１）の側に近づく向きにテーパ状に形成されていることが好ましい。第２０の態様によれば、流入口（７Ｂ）への熱流入をさらに促進できる。 Regarding the sensor (1, 1A to 1M) according to the twentieth aspect, in the nineteenth aspect, the outer surface (53) has a first surface (531) around the inlet (7B) and a first surface (531). 531) and the 2nd surface (532) located outside. It is preferable that the first surface (531) has an inclination angle different from that of the second surface (532) and is formed in a taper shape so as to be closer to the structure (X1) side as it is closer to the inflow port (7B). . According to the twentieth aspect, the heat inflow into the inflow port (7B) can be further promoted.
　第２１の態様に係る感知器（１、１Ａ～１Ｍ）に関して、第１～第２０の態様のいずれか１つにおいて、筐体（５）は、１又は複数の凸部（Ｗ１）を有することが好ましい。１又は複数の凸部（Ｗ１）は、開口部（７）の縁部から、感知器（１、１Ａ～１Ｍ）が取り付けられる構造体（Ｘ１）の側から離れる方向に突出する。１又は複数の凸部（Ｗ１）は、熱検知素子（３０）の加熱点検を行うための試験器（９００）が筐体（５）を覆うように配置された状態で、試験器（９００）の周縁部（９０１）と接触するように構成されることが好ましい。第２１の態様によれば、凸部（Ｗ１）が設けられていることで、筐体（５）に対して試験器（９００）が安定的に配置される。すなわち、凸部（Ｗ１）が周縁部（９０１）と点接触する可能性が高くなり、面接触に比べて、がたつきが抑制され得る。 As for the sensor (1, 1A to 1M) according to the twenty-first aspect, in any one of the first to twentieth aspects, the housing (5) has one or more convex portions (W1). Is preferred. The one or more protrusions (W1) protrude from the edge of the opening (7) in a direction away from the side of the structure (X1) to which the sensors (1, 1A to 1M) are attached. The one or more convex portions (W1) are provided with a tester (900) for performing heating inspection of the heat detecting element (30) arranged so as to cover the housing (5). It is preferably configured to contact the peripheral portion (901) of the. According to the twenty-first aspect, since the convex portion (W1) is provided, the tester (900) is stably arranged in the housing (5). That is, the convex portion (W1) is more likely to come into point contact with the peripheral edge portion (901), and rattling can be suppressed as compared with surface contact.
　第２～２１の態様に係る構成については、感知器（１、１Ａ～１Ｍ）に必須の構成ではなく、適宜省略可能である。 The configurations according to the second to twenty-first aspects are not essential for the sensors (1, 1A to 1M) and can be omitted as appropriate.
　１、１Ａ～１Ｍ　感知器
　２　基板
　３０　熱検知素子
　４　煙検知部
　４１　光学素子
　４２　受光素子
　４３　ラビリンス部
　５　筐体
　５１　表カバー（第２カバー）
　５２　裏カバー（第１カバー）
　５３　外表面
　５３１　第１表面
　５３２　第２表面
　５５　設置面
　５２２　制御板（壁体）
　６　流路
　６１　第１路
　６２　第２路
　７　開口部
　７Ｂ　流入口
　７０　開口領域
　Ｐ１　中心
　ＳＰ１　内部空間
　ＳＰ２　外部空間
　Ｖ１　遮蔽部
　Ｖ１４、Ｖ１６　第１突起
　Ｖ１５、Ｖ１７　第２突起
　Ｖ２　誘導面
　Ｗ１　凸部
　Ｘ１　構造体
　９００　試験器
　９０１　周縁部 1, 1A to 1M Sensor 2 Substrate 30 Heat detecting element 4 Smoke detecting section 41 Optical element 42 Light receiving element 43 Labyrinth section 5 Case 51 Front cover (second cover)
52 Back cover (first cover)
53 outer surface 531 first surface 532 second surface 55 installation surface 522 control plate (wall)
6 Flow Path 61 1st Road 62 2nd Road 7 Opening 7B Inlet 70 Opening Area P1 Center SP1 Internal Space SP2 External Space V1 Shielding V14, V16 First Protrusion V15, V17 Second Protrusion V2 Guide Surface W1 Convex X1 Structure 900 Tester 901 Perimeter

Claims (21)

  1. 　基板と、
    　熱検知素子と、
    　前記基板を収容する筐体と、
    を備え、
    　前記筐体は、
    　　その内部空間に設けられて気体が流れる流路と、
    　　前記流路と前記筐体の外部空間とを繋ぐ開口部と、
    を有し、
    　前記熱検知素子は、前記基板に実装されて、前記開口部から流入した前記気体の熱を検知するチップサーミスタである、
    　感知器。     Board and
    A heat sensing element,
    A housing for housing the substrate,
    With
    The housing is
    A flow path provided in the internal space through which gas flows,
    An opening connecting the flow path and the external space of the housing,
    Have
    The heat detecting element is a chip thermistor mounted on the substrate and detecting heat of the gas flowing from the opening.
    sensor.
  2. 　前記基板の表面の少なくとも一部の領域は、前記流路に露出する、
    　請求項１に記載の感知器。     At least a portion of the surface of the substrate is exposed in the flow path,
    The sensor according to claim 1.
  3. 　前記チップサーミスタは、前記外部空間の側から前記開口部の開口領域を見たときに、前記開口領域内に収まるように配置されている、
    　請求項１又は２に記載の感知器。     The chip thermistor is arranged so as to fit within the opening area when the opening area of the opening is viewed from the side of the external space.
    The sensor according to claim 1 or 2.
  4. 　前記チップサーミスタは、前記外部空間の側から前記開口領域を見たときに、前記開口領域内において、前記基板の表面と直交する方向における前記開口領域の中央に位置する、
    　請求項３に記載の感知器。     The chip thermistor is located at the center of the opening region in the direction orthogonal to the surface of the substrate in the opening region when the opening region is viewed from the side of the external space.
    The sensor according to claim 3.
  5. 　前記流路は、前記開口部の側にある第１路と、前記第１路と繋がっていて前記内部空間の中央部の側にある第２路とを含み、
    　前記チップサーミスタは、前記第１路内にある、
    　請求項１～４のいずれか１項に記載の感知器。     The flow path includes a first path on the side of the opening and a second path connected to the first path on the side of the central portion of the internal space,
    The chip thermistor is in the first path,
    The sensor according to any one of claims 1 to 4.
  6. 　前記流路は、前記開口部の側にある第１路と、前記第１路と繋がっていて前記内部空間の中央部の側にある第２路とを含み、
    　前記第１路の開口断面積は、前記第２路の開口断面積よりも小さい、
    　請求項１～５のいずれか１項に記載の感知器。     The flow path includes a first path on the side of the opening and a second path connected to the first path on the side of the central portion of the internal space,
    The opening cross-sectional area of the first path is smaller than the opening cross-sectional area of the second path,
    The sensor according to any one of claims 1 to 5.
  7. 　前記筐体は、当該感知器が取り付けられる構造体と対向する設置面を有し、
    　前記第２路は、前記第１路から前記中央部に向かうほど、前記設置面に近づく方向に拡がっている、
    　請求項６に記載の感知器。     The housing has an installation surface facing a structure to which the sensor is attached,
    The second road expands in a direction closer to the installation surface from the first road toward the central portion.
    The sensor according to claim 6.
  8. 　前記内部空間の中央部に配置され、煙を検知する煙検知部を、更に備える、
    　請求項１～７のいずれか１項に記載の感知器。     A smoke detector arranged in the central portion of the internal space to detect smoke is further provided.
    The sensor according to any one of claims 1 to 7.
  9. 　前記煙検知部は、前記チップサーミスタが実装された前記基板の表面と同一平面側に配置されている、
    　請求項８に記載の感知器。     The smoke detection unit is arranged on the same plane as the surface of the substrate on which the chip thermistor is mounted,
    The sensor according to claim 8.
  10. 　前記筐体は、当該感知器が取り付けられる構造体と対向する設置面を有し、
    　前記煙検知部は、前記基板における表面、及び前記表面とは反対側の裏面のうち、前記設置面に近い側の面に、配置されている、
    　請求項８又は９に記載の感知器。     The housing has an installation surface facing a structure to which the sensor is attached,
    The smoke detection unit is disposed on a surface of the substrate, and a back surface opposite to the surface, on a surface close to the installation surface.
    The sensor according to claim 8 or 9.
  11. 　前記筐体は、前記内部空間において、前記熱検知素子又は前記煙検知部に前記気体を誘導する１又は複数の壁体を有する、
    　請求項８～１０のいずれか１項に記載の感知器。     The casing has one or more wall bodies that guide the gas to the heat detection element or the smoke detection unit in the internal space,
    The sensor according to any one of claims 8 to 10.
  12. 　前記筐体は、当該感知器が取り付けられる構造体と対向する設置面を有し、
    　前記煙検知部は、
    　　光を放射する光学素子と、
    　　前記光学素子から放射された光を受光する受光素子と、
    　　前記光学素子及び前記受光素子が互いに対向しないように配置されるラビリンス部と、
    を有し、
    　前記基板の厚み方向においてラビリンス部の内部空間の中心は、前記チップサーミスタと前記設置面との間にある、
    　請求項８～１１のいずれか１項に記載の感知器。     The housing has an installation surface facing a structure to which the sensor is attached,
    The smoke detector is
    An optical element that emits light,
    A light receiving element for receiving the light emitted from the optical element,
    A labyrinth portion arranged such that the optical element and the light receiving element do not face each other,
    Have
    The center of the internal space of the labyrinth portion in the thickness direction of the substrate is between the chip thermistor and the installation surface,
    The sensor according to any one of claims 8 to 11.
  13. 　前記チップサーミスタは、前記外部空間の側から前記開口部の開口領域を見たときに、前記開口領域内に収まるように配置され、
    　前記チップサーミスタよりも前記外部空間の側において前記開口領域の一部を遮る遮蔽部を、更に備える、
    　請求項１～１２のいずれか１項に記載の感知器。     The chip thermistor is arranged so as to fit within the opening area when the opening area of the opening is viewed from the side of the external space,
    Further comprising a shielding portion that shields a part of the opening region on the side of the external space with respect to the chip thermistor,
    The sensor according to any one of claims 1 to 12.
  14. 　前記遮蔽部は、前記外部空間からの気流を前記チップサーミスタに向かって誘導する誘導面を有する、
    　請求項１３に記載の感知器。     The shielding portion has a guide surface that guides an air flow from the external space toward the chip thermistor,
    The sensor according to claim 13.
  15. 　前記筐体は、
    　　前記基板の厚み方向における一の方向から前記基板を覆う第１カバーと、
    　　前記厚み方向における前記一の方向とは反対の方向から前記基板を覆う第２カバーと、
    を有し、
    　前記遮蔽部は、
    　　前記第１カバーから前記第２カバーに向かって突出する第１突起と、
    　　前記第２カバーから前記第１カバーに向かって突出する第２突起と、
    を有する、
    　請求項１３又は１４に記載の感知器。     The housing is
    A first cover that covers the substrate from one direction in the thickness direction of the substrate;
    A second cover that covers the substrate from a direction opposite to the one direction in the thickness direction;
    Have
    The shield is
    A first protrusion protruding from the first cover toward the second cover;
    A second protrusion protruding from the second cover toward the first cover;
    Having,
    The sensor according to claim 13 or 14.
  16. 　前記第１突起は、前記外部空間の側から前記開口領域を見たときに、前記第１カバーと前記第２カバーとが並ぶ並び方向と直交する方向において、前記第２突起に対して、ずれて配置される、
    　請求項１５に記載の感知器。     The first protrusion is displaced from the second protrusion in a direction orthogonal to a direction in which the first cover and the second cover are arranged side by side when the opening region is viewed from the external space side. Are placed,
    The sensor according to claim 15.
  17. 　前記第１突起及び前記第２突起は、互いの先端同士が対向するように突出する、
    　請求項１５に記載の感知器。     The first protrusion and the second protrusion protrude so that their tips are opposed to each other,
    The sensor according to claim 15.
  18. 　前記第１突起及び前記第２突起の少なくとも一方は、前記外部空間の側から前記開口領域を見たときに、前記第１カバーと前記第２カバーとが並ぶ並び方向と直交する方向において前記チップサーミスタと同じ位置にあり、かつ、前記チップサーミスタの少なくとも一部が露出するように前記少なくとも一方の突出量が規定されている、
    　請求項１５～１７のいずれか１項に記載の感知器。     At least one of the first protrusion and the second protrusion is the chip in a direction orthogonal to a direction in which the first cover and the second cover are arranged side by side when the opening region is viewed from the external space side. At the same position as the thermistor, and the projection amount of at least one of the chip thermistors is defined so that at least a part of the chip thermistor is exposed,
    The sensor according to any one of claims 15 to 17.
  19. 　前記開口部は、流入口を有し、
    　前記流入口は、前記筐体における、当該感知器が取り付けられる構造体とは反対側の外表面に設けられている、
    　請求項１～１８のいずれか１項に記載の感知器。     The opening has an inlet,
    The inlet is provided on an outer surface of the housing opposite to a structure to which the sensor is attached,
    The sensor according to any one of claims 1 to 18.
  20. 　前記外表面は、前記流入口の周囲における第１表面と、前記第１表面よりも外側にある第２表面と、を有し、
    　前記第１表面は、前記第２表面とは異なる傾斜角で、前記流入口に近づくほど前記構造体の側に近づく向きにテーパ状に形成されている、
    　請求項１９に記載の感知器。     The outer surface has a first surface around the inlet and a second surface outside the first surface,
    The first surface has a different inclination angle from that of the second surface, and is formed in a taper shape so as to approach the structure side toward the inlet.
    The sensor according to claim 19.
  21. 　前記筐体は、前記開口部の縁部から、当該感知器が取り付けられる構造体の側から離れる方向に突出した１又は複数の凸部を有し、
    　前記１又は複数の凸部は、前記熱検知素子の加熱点検を行うための試験器が前記筐体を覆うように配置された状態で、前記試験器の周縁部と接触するように構成される、
    　請求項１～２０のいずれか１項に記載の感知器。     The casing has one or a plurality of protrusions protruding from the edge of the opening in a direction away from the side of the structure to which the sensor is attached,
    The one or more convex portions are configured to come into contact with a peripheral portion of the tester in a state where a tester for performing heat inspection of the heat detecting element is arranged so as to cover the housing. ,
    The sensor according to any one of claims 1 to 20.
PCT/JP2019/037270 2018-10-10 2019-09-24 Sensor WO2020075487A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021215460A1 (en) * 2020-04-21 2021-10-28
EP4080476A1 (en) * 2021-04-21 2022-10-26 Panasonic Intellectual Property Management Co., Ltd. Sensor

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0916869A (en) * 1995-06-27 1997-01-17 Matsushita Electric Works Ltd Smoke and heat composite sensor
JP2005071139A (en) * 2003-08-26 2005-03-17 Matsushita Electric Works Ltd Waterproof fire sensor and its manufacturing method
JP2005250912A (en) * 2004-03-04 2005-09-15 Nohmi Bosai Ltd Flame sensor and testing device for operation of flame sensor
JP2009230510A (en) * 2008-03-24 2009-10-08 Panasonic Electric Works Co Ltd Fire alarm
JP2009245088A (en) * 2008-03-31 2009-10-22 Nohmi Bosai Ltd Fire detector and protective cover for fire detector
JP2010117881A (en) * 2008-11-13 2010-05-27 Fenwall Controls Of Japan Ltd Fire detector
JP2011215689A (en) * 2010-03-31 2011-10-27 Nohmi Bosai Ltd Photoelectric smoke sensor
JP2012014330A (en) 2010-06-30 2012-01-19 Lixil Nittan Co Ltd Heat-smoke composite type sensor
JP2014126878A (en) * 2012-12-25 2014-07-07 Hochiki Corp Distributed fire monitoring system

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0916869A (en) * 1995-06-27 1997-01-17 Matsushita Electric Works Ltd Smoke and heat composite sensor
JP2005071139A (en) * 2003-08-26 2005-03-17 Matsushita Electric Works Ltd Waterproof fire sensor and its manufacturing method
JP2005250912A (en) * 2004-03-04 2005-09-15 Nohmi Bosai Ltd Flame sensor and testing device for operation of flame sensor
JP2009230510A (en) * 2008-03-24 2009-10-08 Panasonic Electric Works Co Ltd Fire alarm
JP2009245088A (en) * 2008-03-31 2009-10-22 Nohmi Bosai Ltd Fire detector and protective cover for fire detector
JP2010117881A (en) * 2008-11-13 2010-05-27 Fenwall Controls Of Japan Ltd Fire detector
JP2011215689A (en) * 2010-03-31 2011-10-27 Nohmi Bosai Ltd Photoelectric smoke sensor
JP2012014330A (en) 2010-06-30 2012-01-19 Lixil Nittan Co Ltd Heat-smoke composite type sensor
JP2014126878A (en) * 2012-12-25 2014-07-07 Hochiki Corp Distributed fire monitoring system

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021215460A1 (en) * 2020-04-21 2021-10-28
WO2021215460A1 (en) * 2020-04-21 2021-10-28 パナソニックＩｐマネジメント株式会社 Detector
EP4141833A4 (en) * 2020-04-21 2023-10-11 Panasonic Intellectual Property Management Co., Ltd. Detector
JP7394360B2 (en) 2020-04-21 2023-12-08 パナソニックＩｐマネジメント株式会社 Detector and fire alarm system
EP4080476A1 (en) * 2021-04-21 2022-10-26 Panasonic Intellectual Property Management Co., Ltd. Sensor

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