WO2020071431A1 - Heat sink and robot control device provided with same - Google Patents

Heat sink and robot control device provided with same

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Publication number
WO2020071431A1
WO2020071431A1 PCT/JP2019/038944 JP2019038944W WO2020071431A1 WO 2020071431 A1 WO2020071431 A1 WO 2020071431A1 JP 2019038944 W JP2019038944 W JP 2019038944W WO 2020071431 A1 WO2020071431 A1 WO 2020071431A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
main surface
control device
robot control
substrate
Prior art date
Application number
PCT/JP2019/038944
Other languages
French (fr)
Japanese (ja)
Inventor
毅 田頭
Original Assignee
川崎重工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 川崎重工業株式会社 filed Critical 川崎重工業株式会社
Priority to CN201980064038.6A priority Critical patent/CN112789722A/en
Publication of WO2020071431A1 publication Critical patent/WO2020071431A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat sink and a robot control device including the same.
  • Heat sinks for cooling a heating element have been known.
  • a heat sink for example, there is a radiator proposed in the heat radiation structure of the element of Patent Document 1.
  • Patent Document 1 describes a heat dissipation structure including an element, a heat conductive material, a substrate, and a radiator.
  • the radiator has a plate-like portion having a first main surface and a second main surface, a protrusion protruding from the first main surface of the plate-like portion, and protruding from the second main surface of the plate-like portion.
  • a plurality of radiation fins. The radiator is arranged such that the protrusion penetrates a through hole formed in the substrate and the protrusion contacts the lower surface of the element via a heat conductive material.
  • the radiator of Patent Document 1 does not consider cooling an element as a heating element provided in the robot controller.
  • some robot control devices include a first element and a second element existing on a substrate. These two elements may have different distances from their respective tips to the substrate.
  • the distance from the tip of the first element to the substrate is longer than that of the second element.
  • the base of the heat sink contacts only the first element and does not contact the second element, it is difficult to cool these two elements with one heat sink.
  • a heat sink is a heat sink provided in a robot control device, wherein the robot control device includes a substrate, a first element and a second element existing on a main surface of the substrate. And a base portion formed in a plate shape having a first main surface, wherein the base portion is arranged such that the first main surface is in thermal contact with the first element. A projecting portion projecting from the main surface, the tip of which is arranged so as to be in thermal contact with the second element.
  • the first element can be cooled by the base portion arranged such that the first main surface thereof is in thermal contact with the first element, and
  • the second element can be cooled by a protrusion arranged such that the tip is in thermal contact with the second.
  • the method may further include a heat conductive material provided at a tip of the protrusion, and the protrusion may be arranged so as to be in thermal contact with the second element via the heat conductive material.
  • the heat generated by the second element can be satisfactorily transmitted to the protrusion by the heat conductive material.
  • the heat conductive material may be composed of an insulator.
  • the heat conductive material may be made of an elastic material.
  • the protrusion may be formed integrally with the base.
  • the heat generated by the second element can be transmitted well from the protrusion to the base, so that the second element can be efficiently cooled.
  • the robot control device may include a plurality of the second elements, and a plurality of the protrusions may be provided according to the second elements.
  • a plurality of fins each standing on a second main surface extending parallel to the first main surface of the base portion may be further provided.
  • both the first element and the second element can be efficiently cooled.
  • a robot control device including any one of the heat sinks, the substrate, the first element, and the second element, Further comprising a housing in which a first space isolated from the air and a second space open to the outside are provided, and wherein the substrate, the first element, and the second element are arranged in the first space. And at least a part of the heat sink is arranged in the second space.
  • the robot control device can cool both the first element and the second element having different distances from the respective tips to the substrate by including any one of the heat sinks. Becomes
  • the first element is configured as a power module mounted on a main surface of the substrate, and the second element is mounted on the main surface of the substrate to measure a current value output from the power module. It may be configured as an element.
  • the apparatus may further include a cooling fan that blows outside air to the heat sink.
  • both the first element and the second element can be efficiently cooled.
  • a heat sink and a robot control device including the same, which can cool both the first element and the second element having different distances from the respective tips to the substrate.
  • FIG. 1 is an external perspective view of a robot control device including a heat sink according to one embodiment of the present invention.
  • FIG. 1 is a schematic diagram illustrating a main structure of a robot control device including a heat sink according to an embodiment of the present invention. It is the schematic which looked at the state which expanded the principal part structure and its peripheral part of the robot control apparatus provided with the heat sink which concerns on one Embodiment of this invention from the right side plate side. It is a figure for explaining the positional relationship of the heat sink which concerns on one Embodiment of this invention, a power module, and a resistance element, (A) is a bottom view of a heat sink, (B) is a board
  • FIG. 1 is an external perspective view of a robot control device including a heat sink according to the present embodiment.
  • the robot control device 10 according to the present embodiment is used to control the operation of a robot (not shown).
  • the robot may include, for example, a robot arm having a plurality of joint axes, and an end effector attached to a tip of the robot arm.
  • the robot control device 10 includes a housing 20 for housing its internal structure (for example, a substrate 30, a power module 40, a resistance element 90, a heat sink 50, and the like, which will be described later).
  • the housing 20 has a hollow rectangular parallelepiped shape.
  • the housing 20 includes a rectangular bottom plate 21 in plan view, a front plate 22 erected on the front edge of the bottom plate 21, and a back plate 23 erected on the rear edge of the bottom plate 21.
  • the housing 20 includes a right side plate 24 erected on the right end edge of the bottom plate 21, a left side plate 25 erected on the left end edge of the bottom plate 21, a front plate 22, a back plate 23, a right side plate 24, and a left side plate.
  • a top plate provided to cover a box formed by the plate.
  • a tapered mounting portion 80 whose cross-sectional area decreases toward the bottom is provided.
  • FIG. 2 is a schematic view of an enlarged view of a main structure of a robot control device including a heat sink according to the present embodiment and a peripheral portion thereof as viewed from a right side plate.
  • the housing 20 further includes a partition plate 27 that extends horizontally at the center in the height direction.
  • a first space 28 and a second space 29 that are adjacent to each other in the height direction with the partition plate 27 as a boundary are provided inside the housing 20.
  • the partition plate 27 is provided with a rectangular through hole 27a having an area slightly smaller than a base portion 51 of the heat sink 50 described later in plan view.
  • the first space 28 is a space above the partition plate 27 and is shielded from the outside air.
  • the first space 28 mainly includes an upper surface of the partition plate 27, a first main surface 52 of a base portion 51 of the heat sink 50 described later, an upper inner surface of the front plate 22, an upper inner surface of the back plate 23, an upper inner surface of the right plate 24, The peripheral edge is defined by the upper inner surface of the left side plate 25 and the inner surface of the top plate 26.
  • the first space 28 has a dustproof property by being shielded from the outside air, and for example, precision machines such as a substrate 30, a power module 40, and a resistance element 90, which will be described later, are arranged.
  • the second space 29 is a space located below the partition plate 27 and is open to the outside air.
  • the second space 29 mainly includes a bottom surface of the partition plate 27, a second main surface 54 of a base portion 51 of a heat sink 50 described later, an inner surface of the bottom plate 21, a lower inner surface of the front plate 22, a lower inner surface of the back plate 23, and a right side plate.
  • the lower inner surface of the left side plate 24 and the lower inner surface of the left side plate 25 define the periphery thereof.
  • the robot controller 10 further includes a cooling fan 82 that blows outside air to the heat sink 50.
  • a cooling fan 82 that blows outside air to the heat sink 50.
  • four cooling fans 82 are arranged in parallel along the lower inner surface of the right side plate 24.
  • a plurality of intake slits 84 are formed in the lower portion of the right side plate 24 at positions corresponding to the four cooling fans 82.
  • a plurality of exhaust slits 85 corresponding to the plurality of intake slits 84 are formed in a lower portion of the left side plate 25.
  • the cooling fan 82 when the cooling fan 82 is driven, outside air is taken into the second space 29 from the intake slit 84 of the right side plate 24, and the outside air is exhausted from the exhaust slit 85 of the left side plate 25. . That is, the outside air flowing in the direction from the right side plate 24 to the left side plate 25 (X direction described later) is supplied to the second space 29 in the housing 20.
  • the second space 29 for example, at least a part of a heat sink 50 described later is arranged.
  • at least a part of the heat sink 50 includes a fin assembly 60 and a second main surface 54 of the base 51 described later.
  • FIG. 2 is a schematic diagram illustrating a main structure of a robot control device including the heat sink according to the present embodiment.
  • FIG. 3 is a schematic view of a main part structure of a robot control device including a heat sink according to the present embodiment and an enlarged view of a peripheral portion thereof when viewed from a right side plate side.
  • FIGS. 3A and 3B are diagrams for explaining the positional relationship between the heat sink, the power module, and the resistance element according to the present embodiment.
  • FIG. 3A is a bottom view of the heat sink
  • FIG. It is a bottom view of the power module and the resistance element which were obtained.
  • FIG. 4B the main structure (a base 51, a protrusion 77, and a heat conductive sheet 78 to be described later) of the heat sink 50 according to the present embodiment is indicated by a broken line.
  • the robot controller 10 measures the substrate 30, a power module 40 (first element) attached to the bottom surface of the substrate 30, and a current value output from the power module 40. And a resistive element 90 (second element).
  • the substrate 30, the power module 40, and the resistance element 90 are each disposed in the first space 28 that is shielded from the outside air.
  • the substrate 30 has, for example, a flat plate formed of an insulator such as silicon, and a plurality of electronic components each of which is disposed on the surface and inside of the flat plate and is electrically connected to each other, thereby forming an electronic circuit. May work.
  • eight power modules 40 are substantially rectangular parallelepiped, and eight power modules 40 are mounted on the bottom surface of the substrate 30.
  • the eight power modules 40 have the same shape and size as each other.
  • the plurality of power modules 40 are respectively arranged in the X direction shown in FIG. 4 (that is, the direction connecting the right side plate 24 and the left side plate 25 of the housing 20) and the Y direction orthogonal to the X direction. Are arranged in a matrix.
  • eight power modules 40 are arranged on the bottom surface of the substrate 30 by arranging four power modules 40 in parallel in the X direction and arranging two of the aggregates in the Y direction. Mounted in a matrix of ⁇ 4. Note that each of the eight power modules 40 may be attached to the substrate 30 via a spacer 41 (see FIG. 3). Thus, since the eight power modules 40 are arranged such that the top surfaces thereof do not contact the bottom surface of the substrate 30, it is possible to prevent heat generated in each of the eight power modules from being directly transmitted to the substrate 30.
  • the eight power modules 40 may be intelligent power modules (Intelligent Power Module, IPM), or may be main components of a servo amplifier. Then, for example, a current for a three-phase motor may be output from each of the plurality of servo amplifiers including the power module 40. With such a configuration, the robot controller 10 may be configured to control one axis by one power module 40.
  • the axis may include, for example, a joint axis or an external axis of the robot.
  • восем ⁇ resistance elements 90 are substantially rectangular parallelepiped, and eight resistance elements 90 are mounted on the bottom surface of the substrate 30 in correspondence with the power modules 40.
  • Each of the eight resistance elements 90 has the same shape and dimensions as each other.
  • Each of the eight resistance elements 90 is arranged along a surface existing outside the corresponding power module 40 in the front-rear direction (that is, the direction connecting the front plate 22 and the back plate 23).
  • the resistance elements 90 mounted corresponding to the four power modules 40 arranged in parallel in the X direction on the front plate 22 side are mounted on the front plate 22 side of the four power modules 40, respectively.
  • the resistance elements 90 mounted corresponding to the four power modules 40 arranged in parallel in the X direction on the back plate 23 side are mounted on the back plate 23 side of the four power modules 40, respectively.
  • Each of the four resistance elements 90 is connected in series to the corresponding power module 40 in order to measure a current value output from the corresponding power module 40.
  • the tip of the power module 40 (that is, the bottom surface in FIG. 3) is located farther from the main surface of the substrate 30 than the tip (before) of the resistance element 90.
  • the first main surface 52 of) the base portion 51 of the heat sink 50 according to the present embodiment directly (thermally) contacts only the power module 40 and does not contact the resistance element 90.
  • the heat sink 50 As shown in FIGS. 2 to 4, the heat sink 50 according to the present embodiment is disposed in the second space 29 open to the outside air.
  • the heat sink 50 is formed in a plate shape so as to have a first main surface 52 and a second main surface 54 extending in parallel with the first main surface 52, and the first main surface 52 includes eight power modules 40. And a plurality of fins 70 erected on the second main surface 54 of the base portion 51.
  • the base portion 51 is formed in a rectangular shape slightly larger than the through hole 27a formed in the partition plate 27 in a plan view.
  • the base portion 51 is fixed to the bottom surface of the partition plate 27 in a state where the edge portion of the first main surface 52 is in contact with the peripheral edge portion of the through hole 27a from the bottom surface side of the partition plate 27.
  • the base portion 51 is arranged in this manner, so that the first main surface 52 defines a part of the periphery of the first space 28 shielded from the outside air, and the second main surface 54 is connected to the outside air. It defines a part of the periphery of the opened second space 29.
  • Each of the plurality of fins 70 is formed in a plate shape, and is erected on the second main surface 54 of the base portion 51 in parallel with the Y direction with each thickness direction coinciding with the Y direction. .
  • the plurality of fins 70 form the fin assembly 60. Note that the intervals between the fins 70 adjacent to each other in the Y direction are the same as each other.
  • the plurality of fins 70 are arranged in parallel at positions corresponding to the eight power modules 40, so that each of the fin assemblies 60 extends in the Y direction and is arranged in parallel in the X direction.
  • the plurality of ridges 62 referred to herein means that the plurality of fins 70 are erected on the second main surface 54 of the base portion 51 as described above, so that the plurality of fins 70 as a whole A portion configured as a ridge or a protrusion extending in the Y direction on the second main surface 54 of the base portion 51.
  • the heat sink 50 according to the present embodiment is sufficiently cooled by the plurality of ridges 62 of the fin assembly 60 while the weight is reduced by the groove 64 of the fin assembly 60. It is possible to
  • the four power modules 40 are arranged in the X direction as described above, the four ridges 62 are arranged in the X direction correspondingly.
  • the four ridges 62 are arranged in parallel in this manner, there are a total of three groove-like portions 64 extending in the Y direction therebetween.
  • the plurality of fins 62 are arranged in parallel at positions corresponding to the power modules 40 adjacent to each other in the Y direction among the eight power modules 40, so that the four ridges 62 are formed. Extend in the Y direction even at positions corresponding to between the power modules 40 adjacent to each other in the Y direction.
  • the plurality of fins 70 each have a width corresponding to the length in the X direction of each of the eight power modules 40.
  • the heat sink 50 according to the present embodiment can appropriately reduce the weight. Therefore, it is possible to suppress a decrease in cooling efficiency due to a reduction in weight (that is, providing the groove portions 64 in the fin assembly 60).
  • each of the plurality of fins 70 has a base edge extending in the X direction as a lower bottom 71, a tip edge extending in the X direction as an upper bottom 72 when viewed in the thickness direction, and
  • the lower bottom 71 has a trapezoidal shape longer than the upper bottom 72. Accordingly, when the entire heat sink 50 is integrally formed by die casting, it is possible to appropriately perform the operation of pulling out the heat sink 50 from the mold.
  • connection portion 74 that connects the mutually adjacent fins 70 is provided between the mutually adjacent fins 70 in the X direction (the left and right direction in FIG. 2) among the plurality of fins 70.
  • the connecting portion 74 is erected on the second main surface 54 of the base portion 51 and has a shorter length from the second main surface 54 than the fin 70. This increases the surface area of the heat sink 50, so that it is possible to suppress a decrease in cooling efficiency due to the groove-shaped portions 64 of the fin assembly 60.
  • the groove formed between the fins 70 adjacent to each other in the Y direction and extending in the X direction and the groove formed between the connecting portions 74 adjacent to each other in the Y direction and extending in the X direction are continuous in the X direction.
  • a groove extending from one end to the other end in the X direction is formed. This prevents the outside air flowing in the X direction, which is blown into the second space 29 by the cooling fan 82, from diffusing inside the fin assembly 60, so that the heat sink 50 inhibits the flow of the outside air. Can be suppressed.
  • the cooling fan 82 is arranged so as to face the ridge 62 on the rightmost plate 24 side of the four ridges 62 in the X direction (the horizontal direction in FIG. 2). You. Thereby, the cooling fan 82 can blow the outside air flowing in the X direction to the fin assembly 60.
  • the heat sink 50 further includes a protrusion 77 projecting from the first main surface 52 of the base portion 51 and arranged so that the tip thereof is in thermal contact with the resistance element 90.
  • a protrusion 77 projecting from the first main surface 52 of the base portion 51 and arranged so that the tip thereof is in thermal contact with the resistance element 90.
  • Eight protrusions 77 are provided corresponding to the resistance elements 90.
  • Each of the eight protrusions 77 is formed in a rectangular parallelepiped shape, and has the same shape and size. Further, the eight protrusions 77 are formed integrally with the base 51 and the plurality of fins 70.
  • the tip (the bottom in FIG. 3) of the power module 40 is located farther from the main surface of the substrate 30 than the tip (the same as before) of the resistance element 90.
  • the height dimension of the protrusion 77 is a distance in the height direction from the tip of the resistance element 90 to the tip of the power module 40 (or the distance from the tip of the resistance element 90 to the first main surface 52 of the base portion 51).
  • the heat sink 50 further includes a heat conductive sheet 78 (heat conductive material) provided at the tip of the protrusion 77.
  • the gap is filled with the heat conductive sheet 78.
  • the protrusion 77 is arranged so as to be in thermal contact with the resistance element 90 via the heat conductive sheet 78.
  • the heat conductive sheet 78 is an insulator and an elastic body.
  • the power module 40 (first element) is cooled by the base portion 51 arranged so that the first main surface 52 is in direct (thermal) contact with the power module 40.
  • the resistance element 90 (second element) can be cooled by the protrusion 77 arranged so that the tip thereof is in thermal contact with the resistance element 90.
  • the heat sink 50 since the heat sink 50 according to the present embodiment includes the heat conductive sheet 78 (heat conductive material) provided at the tip of the protrusion 77, the heat generated by the resistance element 90 is favorably transmitted to the protrusion 77 by the heat conductive sheet 78. can do.
  • the heat conductive sheet 78 according to the present embodiment is made of an insulator, it is possible to eliminate the possibility that a short circuit occurs between the protrusion of the heat sink and the second element.
  • the heat conductive sheet 78 is formed of an elastic body, the heat conductive sheet 78 is elastically deformed in a gap formed between the tip of the protrusion 77 and the resistance element 90 (second element). Can be arranged. This makes it possible to easily and appropriately bring the tip of the protrusion 77 into thermal contact with the resistance element 90.
  • the protrusion 77 is formed integrally with the base 51 and the plurality of fins 70, the heat generated by the resistance element 90 is transmitted well from the protrusion 77 to the base 51, and Since the power can be transmitted well from the base portion 51 to the plurality of fins 70, the resistance element 90 can be efficiently cooled.
  • the entire heat sink 50 can be integrally formed by die casting, it is possible to manufacture the heat sink 50 at low cost.
  • the robot control device 10 since the robot control device 10 includes eight power modules 40 and eight resistance elements 90, and eight protrusions 77 are provided in accordance with the resistance elements 90, the first main surface 52 of the base part 51 is The eight power modules 40 can be cooled by directly contacting the two power modules 40, and the eight power modules 40 can be cooled by each of the eight protrusions 77 thermally contacting the corresponding resistance element 90.
  • the resistance element 90 can be cooled.
  • the heat sink 50 includes the plurality of fins 70, the surface area is increased. Thereby, the power module 40 and the resistance element 90 can be efficiently cooled.
  • the robot control device 10 includes the heat sinks 50, so that both the power module 40 and the resistance element 90 having different distances from the respective ends to the substrate 30 can be cooled.
  • the first element is configured as the power module 40 and the second element is configured as the resistance element 90 for measuring the current value output from the power module 40, the distances from the respective tips to the substrate 30 are different from each other. This makes it possible to cool both the power module 40 and the resistance element 90, which have been difficult to cool together due to being provided adjacent to each other.
  • the robot control device 10 includes the cooling fan 82 that blows outside air to the heat sink 50, so that the power module 40 and the resistance element 90 can be efficiently cooled.
  • the first element is configured as the power module 40 mounted on the main surface of the substrate 30, and the second element is mounted on the main surface of the substrate 30 to measure the current value output from the power module 40.
  • the resistor element 90 is mounted
  • the present invention is not limited to this. That is, the first element and the second element may be other electronic components as long as at least one of the shape and the dimension is different from each other.
  • the first element may be an IC chip mounted on the main surface of the substrate 30, or may be another electronic component. The same applies to the second element.
  • the base portion 51 of the heat sink 50 may contact the power module 40 via a member similar to the heat conductive sheet 78 provided at the tip of the protrusion 77.
  • the heat conductive material is the heat conductive sheet 78 which is an insulator and an elastic body
  • the heat conductive material may be another heat conductive sheet that is an insulator but not an elastic body, or may be another heat conductive sheet that is an elastic body but not an insulator, or Heat conductive material.
  • the heat conductive material is not an insulator, a short circuit may occur between the protrusion 77 of the heat sink 50 and the resistance element 90 (second element). Therefore, in such a case, an insulator may be provided between the protrusion 77 of the heat sink 50 and the resistance element 90 (second element) in addition to the heat conductive material, or no heat conductive material is provided. May be provided only with an insulator.
  • a total of eight power modules 40 are arranged in parallel in a 2 ⁇ 4 matrix, and correspondingly, eight resistive elements 90 and eight protrusions 77 are arranged in parallel.
  • the present invention is not limited to this. That is, one or more power modules 40 may be arranged, and one or more resistance elements 90 and one or more protrusions 77 may be arranged in parallel corresponding to this.
  • the power modules 40 need to be arranged at least in parallel in the X direction.
  • the protrusion 77 has a rectangular parallelepiped shape.
  • the present invention is not limited to this case.
  • it may have a tapered shape in which the cross-sectional area decreases as the distance from the first main surface 52 of the base portion 51 increases, or may have another shape.
  • each of the plurality of fins 70 has a trapezoidal shape when viewed in the thickness direction.
  • the present invention is not limited to this case.
  • each of the plurality of fins 70 may have another square shape such as a square shape or a rectangular shape when viewed in the thickness direction thereof, or may have another polygonal shape.
  • the shape may be as follows.
  • the X direction is the direction connecting the right side plate 24 and the left side plate 25 and the Y direction is the direction connecting the front plate 22 and the back plate 23
  • the present invention is not limited to this.
  • the X direction may be a direction connecting the front plate 22 and the back plate 23
  • the Y direction may be a direction connecting the right side plate 24 and the left side plate 25.
  • the X direction is the direction connecting the bottom plate 21 and the top plate 26
  • the Y direction is the direction connecting the front plate 22 and the back plate 23. Or vice versa.
  • robot control device 20 housing 21 bottom plate 22 front plate 23 back plate 24 right plate 25 left plate 26 top plate 27 partition plate 27a through hole 28 first space 29 second space 30 substrate 40 power module 50 heat sink 51 base 52 1 main surface 54 second main surface 60 fin assembly 62 ridge portion 64 groove portion 70 fin 71 trapezoidal lower bottom 72 trapezoidal upper bottom 74 connecting portion 77 protrusion 78 thermal conduction sheet 80 mounting portion 82 cooling fan 84 Inlet slit 85 Exhaust slit 90 Resistance element

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manipulator (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This heat sink is provided on a robot control device; and the robot control device comprises a substrate, and a first element and a second element, said elements being arranged on a main surface of the substrate. This heat sink is characterized by being provided with: a base part which is formed into a plate-like shape so as to have a first main surface, and which is arranged such that the first main surface is in thermal contact with the first element; and a projection part which is formed so as to protrude from the first main surface of the base part, and which is arranged such that the front end thereof is in thermal contact with the second element.

Description

ヒートシンク及びそれを備えるロボット制御装置Heat sink and robot control device including the same
　本発明は、ヒートシンク及びそれを備えるロボット制御装置に関する。 The present invention relates to a heat sink and a robot control device including the same.
　従来から、発熱体を冷却するためのヒートシンクが知られている。このようなヒートシンクとして、例えば、特許文献１の素子の放熱構造で提案されているような放熱器がある。 ヒ ー ト シ ン ク Heat sinks for cooling a heating element have been known. As such a heat sink, for example, there is a radiator proposed in the heat radiation structure of the element of Patent Document 1.
　特許文献１には、素子、熱伝導材、基板、及び放熱器を備える放熱構造が記載されている。放熱器は、第１主面及び第２主面を有する板状部と、板状部の第１主面に突設される突出部と、板状部の第２主面に突設される複数の放熱フィンとを備える。放熱器は、突出部が基板に穿設される貫通穴を貫通し、且つ、当該突出部が熱伝導材を介して素子の下面に接触するように配置される。 Patent Document 1 describes a heat dissipation structure including an element, a heat conductive material, a substrate, and a radiator. The radiator has a plate-like portion having a first main surface and a second main surface, a protrusion protruding from the first main surface of the plate-like portion, and protruding from the second main surface of the plate-like portion. A plurality of radiation fins. The radiator is arranged such that the protrusion penetrates a through hole formed in the substrate and the protrusion contacts the lower surface of the element via a heat conductive material.
特開２０１０－１４１２７９号公報JP 2010-141279 A
　ところで、特許文献１の放熱器は、ロボット制御装置に設けられる発熱体としての素子を冷却することについて考慮されていない。ここで、ロボット制御装置は、基板上に存する第１素子及び第２素子を備えるものがある。そして、これら２つの素子は、それぞれ、各々の先端から基板までの距離が互いに異なる場合がある。 By the way, the radiator of Patent Document 1 does not consider cooling an element as a heating element provided in the robot controller. Here, some robot control devices include a first element and a second element existing on a substrate. These two elements may have different distances from their respective tips to the substrate.
　ここで、第１素子の先端から基板までの距離が第２素子のそれと比較して長いこととする。このような場合、ヒートシンクのベース部は、第１素子のみに接触し、第２素子には接触しないので、一つのヒートシンクでこれら２つの素子を冷却することは困難であった。 Here, the distance from the tip of the first element to the substrate is longer than that of the second element. In such a case, since the base of the heat sink contacts only the first element and does not contact the second element, it is difficult to cool these two elements with one heat sink.
　そこで、本発明は、各々の先端から基板までの距離が互いに異なる第１素子及び第２素子をともに冷却することが可能な、ヒートシンク及びそれを備えるロボット制御装置を提供することを目的とする。 Accordingly, it is an object of the present invention to provide a heat sink and a robot control device including the same, which can cool both the first element and the second element having different distances from the respective tips to the substrate.
　前記課題を解決するために、本発明に係るヒートシンクは、ロボット制御装置に設けられるヒートシンクであって、前記ロボット制御装置は、基板と、前記基板の主面上に存する第１素子及び第２素子と、を備え、第１主面を有するように板状に形成され、前記第１主面が前記第１素子と熱的に接触するように配置されるベース部と、前記ベース部の第１主面上に突設され、その先端が前記第２素子と熱的に接触するように配置される突部と、を備えることを特徴とする。 In order to solve the above problem, a heat sink according to the present invention is a heat sink provided in a robot control device, wherein the robot control device includes a substrate, a first element and a second element existing on a main surface of the substrate. And a base portion formed in a plate shape having a first main surface, wherein the base portion is arranged such that the first main surface is in thermal contact with the first element. A projecting portion projecting from the main surface, the tip of which is arranged so as to be in thermal contact with the second element.
　上記構成によれば、本発明に係るヒートシンクは、その第１主面が第１素子と熱的に接触するように配置されるベース部によって前記第１素子を冷却することができ、且つ、その先端が第２と熱的に接触するように配置される突部によって前記第２素子を冷却することができる。 According to the configuration, in the heat sink according to the present invention, the first element can be cooled by the base portion arranged such that the first main surface thereof is in thermal contact with the first element, and The second element can be cooled by a protrusion arranged such that the tip is in thermal contact with the second.
　前記突部の先端に設けられる熱伝導材をさらに備え、前記突部は、前記熱伝導材を介して前記第２素子と熱的に接触するように配置されてもよい。 The method may further include a heat conductive material provided at a tip of the protrusion, and the protrusion may be arranged so as to be in thermal contact with the second element via the heat conductive material.
　上記構成によれば、第２素子が発する熱を熱伝導材によって突部へと良好に伝達することができる。 According to the above configuration, the heat generated by the second element can be satisfactorily transmitted to the protrusion by the heat conductive material.
　前記熱伝導材は絶縁体で構成されてもよい。 The heat conductive material may be composed of an insulator.
　上記構成によれば、ヒートシンクの突部と第２素子との間で短絡が生じる虞をなくすことが可能となる。 According to the above configuration, it is possible to eliminate the possibility that a short circuit occurs between the protrusion of the heat sink and the second element.
　前記熱伝導材は弾性体で構成されてもよい。 The heat conductive material may be made of an elastic material.
　上記構成によれば、容易且つ適切に突部の先端を第２素子と熱的に接触させることが可能となる。 According to the above configuration, it is possible to easily and appropriately bring the tip of the projection into thermal contact with the second element.
　前記突部は、前記ベース部と一体的に形成されてもよい。 突 The protrusion may be formed integrally with the base.
　上記構成によれば、第２素子が発する熱を突部からベース部へと良好に伝達することができるので、前記第２素子を効率良く冷却することが可能となる。 According to the above configuration, the heat generated by the second element can be transmitted well from the protrusion to the base, so that the second element can be efficiently cooled.
　前記ロボット制御装置は前記第２素子を複数備え、前記突部は、前記第２素子に応じて複数設けられてもよい。 The robot control device may include a plurality of the second elements, and a plurality of the protrusions may be provided according to the second elements.
　上記構成によれば、ロボット制御装置に設けられる複数の第２素子を冷却することが可能となる。 According to the above configuration, it is possible to cool the plurality of second elements provided in the robot control device.
　各々が前記ベース部の第１主面と平行に延在する第２主面上に立設される複数のフィンをさらに備えてもよい。 A plurality of fins each standing on a second main surface extending parallel to the first main surface of the base portion may be further provided.
　上記構成によれば、複数のフィンによってヒートシンクの表面積が大きくなるので、第１素子及び第２素子をともに効率良く冷却することが可能となる。 According to the above configuration, since the surface area of the heat sink is increased by the plurality of fins, both the first element and the second element can be efficiently cooled.
　前記課題を解決するために、本発明に係るロボット制御装置は、上記いずれかのヒートシンクと、前記基板と、前記第１素子と、前記第２素子と、を備えるロボット制御装置であって、外気から遮断された第１空間と、外気に開放された第２空間とがその内部に設けられる筐体をさらに備え、前記第１空間内に前記基板、前記第１素子及び前記第２素子が配置され、前記第２空間内に前記ヒートシンクの少なくとも一部が配置されることを特徴とする。 In order to solve the above problem, a robot control device according to the present invention is a robot control device including any one of the heat sinks, the substrate, the first element, and the second element, Further comprising a housing in which a first space isolated from the air and a second space open to the outside are provided, and wherein the substrate, the first element, and the second element are arranged in the first space. And at least a part of the heat sink is arranged in the second space.
　上記構成によれば、本発明に係るロボット制御装置は、上記いずれかのヒートシンクを備えることで、各々の先端から基板までの距離が互いに異なる第１素子及び第２素子をともに冷却することが可能となる。 According to the above configuration, the robot control device according to the present invention can cool both the first element and the second element having different distances from the respective tips to the substrate by including any one of the heat sinks. Becomes
　前記第１素子が前記基板の主面上に取り付けられるパワーモジュールとして構成され、前記第２素子が前記パワーモジュールから出力される電流値を測定するために前記基板の主面上に実装される抵抗素子として構成されてもよい。 The first element is configured as a power module mounted on a main surface of the substrate, and the second element is mounted on the main surface of the substrate to measure a current value output from the power module. It may be configured as an element.
　上記構成によれば、各々の先端から基板までの距離が互いに異なり、互いに隣接して設けられることに起因してともに冷却することが困難であったパワーモジュール及び抵抗素子をともに冷却することが可能となる。 According to the above configuration, it is possible to cool both the power module and the resistance element, which are difficult to cool together because the distances from the respective tips to the substrate are different from each other and are provided adjacent to each other. Becomes
　前記ヒートシンクに対して外気を送風する冷却ファンをさらに備えてもよい。 The apparatus may further include a cooling fan that blows outside air to the heat sink.
　上記構成によれば、第１素子及び第２素子をともに効率良く冷却することが可能となる。 According to the above configuration, both the first element and the second element can be efficiently cooled.
　本発明によれば、各々の先端から基板までの距離が互いに異なる第１素子及び第２素子をともに冷却することが可能な、ヒートシンク及びそれを備えるロボット制御装置を提供することが可能となる。 According to the present invention, it is possible to provide a heat sink and a robot control device including the same, which can cool both the first element and the second element having different distances from the respective tips to the substrate.
本発明の一実施形態に係るヒートシンクを備えるロボット制御装置の外観斜視図である。1 is an external perspective view of a robot control device including a heat sink according to one embodiment of the present invention. 本発明の一実施形態に係るヒートシンクを備えるロボット制御装置の要部構造を示す概略図である。FIG. 1 is a schematic diagram illustrating a main structure of a robot control device including a heat sink according to an embodiment of the present invention. 本発明の一実施形態に係るヒートシンクを備えるロボット制御装置の要部構造及びその周辺部分を拡大した様子を右側板側から見たときの概略図である。It is the schematic which looked at the state which expanded the principal part structure and its peripheral part of the robot control apparatus provided with the heat sink which concerns on one Embodiment of this invention from the right side plate side. 本発明の一実施形態に係るヒートシンクとパワーモジュール及び抵抗素子との位置関係を説明するための図であり、（Ａ）がヒートシンクの底面図、（Ｂ）が基板及び当該基板に取り付けられたパワーモジュール及び抵抗素子の底面図である。It is a figure for explaining the positional relationship of the heat sink which concerns on one Embodiment of this invention, a power module, and a resistance element, (A) is a bottom view of a heat sink, (B) is a board | substrate and the power attached to the said board | substrate. It is a bottom view of a module and a resistance element.
　以下、本発明の一実施形態に係るヒートシンク及びそれを備えるロボット制御装置について、図面を参照して説明する。なお、本実施形態によって本発明が限定されるものではない。また、以下では、全ての図を通じて、同一又は相当する要素には同一の参照符号を付して、その重複する説明を省略する。 Hereinafter, a heat sink according to an embodiment of the present invention and a robot control device including the same will be described with reference to the drawings. The present invention is not limited by the embodiment. In the following, the same or corresponding elements are denoted by the same reference symbols throughout all the drawings, and redundant description will be omitted.
　（ロボット制御装置１０）
　図１は、本実施形態に係るヒートシンクを備えるロボット制御装置の外観斜視図である。本実施形態に係るロボット制御装置１０は、図示しないロボットの動作を制御するために用いられる。前記ロボットは、例えば、複数の関節軸を有するロボットアームと、当該ロボットアームの先端に取り付けられるエンドエフェクタとを備えてもよい。 (Robot control device 10)
FIG. 1 is an external perspective view of a robot control device including a heat sink according to the present embodiment. The robot control device 10 according to the present embodiment is used to control the operation of a robot (not shown). The robot may include, for example, a robot arm having a plurality of joint axes, and an end effector attached to a tip of the robot arm.
　図１に示すように、ロボット制御装置１０は、その内部構造（例えば、後述する基板３０、パワーモジュール４０、抵抗素子９０及びヒートシンク５０等）を収容するための筐体２０を備える。筐体２０は中空の直方体状である。 As shown in FIG. 1, the robot control device 10 includes a housing 20 for housing its internal structure (for example, a substrate 30, a power module 40, a resistance element 90, a heat sink 50, and the like, which will be described later). The housing 20 has a hollow rectangular parallelepiped shape.
　筐体２０は、平面視において矩形状の底板２１と、底板２１の前端縁に立設される前板２２と、底板２１の後端縁に立設される背板２３とを有する。また、筐体２０は、底板２１の右端縁に立設される右側板２４と、底板２１の左端縁に立設される左側板２５と、前板２２、背板２３、右側板２４及び左側板２５によって形成される箱体に蓋をするように設けられる天板２６とをさらに有する。なお、底板２１の底面の四隅には、それぞれ、下方に向かうに連れて横断面積が小さくなるテーパ状の載置部８０が設けられる。 The housing 20 includes a rectangular bottom plate 21 in plan view, a front plate 22 erected on the front edge of the bottom plate 21, and a back plate 23 erected on the rear edge of the bottom plate 21. The housing 20 includes a right side plate 24 erected on the right end edge of the bottom plate 21, a left side plate 25 erected on the left end edge of the bottom plate 21, a front plate 22, a back plate 23, a right side plate 24, and a left side plate. A top plate provided to cover a box formed by the plate. In addition, at each of the four corners of the bottom surface of the bottom plate 21, a tapered mounting portion 80 whose cross-sectional area decreases toward the bottom is provided.
　図２は、本実施形態に係るヒートシンクを備えるロボット制御装置の要部構造及びその周辺部分を拡大した様子を右側板側から見たときの概略図である。図２に示すように、筐体２０は、高さ方向における中央を水平方向に延びる仕切板２７をさらに備える。筐体２０の内部には、仕切板２７を境界として高さ方向において互いに隣接する第１空間２８及び第２空間２９が設けられる。なお、仕切板２７には、平面視において、後述するヒートシンク５０のベース部５１よりも僅かに小さい面積を有する矩形状の貫通孔２７ａが穿設される。 FIG. 2 is a schematic view of an enlarged view of a main structure of a robot control device including a heat sink according to the present embodiment and a peripheral portion thereof as viewed from a right side plate. As shown in FIG. 2, the housing 20 further includes a partition plate 27 that extends horizontally at the center in the height direction. A first space 28 and a second space 29 that are adjacent to each other in the height direction with the partition plate 27 as a boundary are provided inside the housing 20. The partition plate 27 is provided with a rectangular through hole 27a having an area slightly smaller than a base portion 51 of the heat sink 50 described later in plan view.
　第１空間２８は、仕切板２７よりも上側に存する空間であり、外気から遮断されている。第１空間２８は、主として、仕切板２７の上面、後述するヒートシンク５０のベース部５１の第１主面５２、前板２２の上部内面、背板２３の上部内面、右側板２４の上部内面、左側板２５の上部内面、及び、天板２６の内面によってその周縁が画定される。第１空間２８は、外気から遮断されることで防塵性を有し、例えば、後述する基板３０、パワーモジュール４０及び抵抗素子９０等の精密機械が配置される。 The first space 28 is a space above the partition plate 27 and is shielded from the outside air. The first space 28 mainly includes an upper surface of the partition plate 27, a first main surface 52 of a base portion 51 of the heat sink 50 described later, an upper inner surface of the front plate 22, an upper inner surface of the back plate 23, an upper inner surface of the right plate 24, The peripheral edge is defined by the upper inner surface of the left side plate 25 and the inner surface of the top plate 26. The first space 28 has a dustproof property by being shielded from the outside air, and for example, precision machines such as a substrate 30, a power module 40, and a resistance element 90, which will be described later, are arranged.
　第２空間２９は、仕切板２７よりも下側に存する空間であり、外気に開放されている。第２空間２９は、主として、仕切板２７の底面、後述するヒートシンク５０のベース部５１の第２主面５４、底板２１の内面、前板２２の下部内面、背板２３の下部内面、右側板２４の下部内面、及び、左側板２５の下部内面によってその周縁が画定される。 The second space 29 is a space located below the partition plate 27 and is open to the outside air. The second space 29 mainly includes a bottom surface of the partition plate 27, a second main surface 54 of a base portion 51 of a heat sink 50 described later, an inner surface of the bottom plate 21, a lower inner surface of the front plate 22, a lower inner surface of the back plate 23, and a right side plate. The lower inner surface of the left side plate 24 and the lower inner surface of the left side plate 25 define the periphery thereof.
　ここで、ロボット制御装置１０は、ヒートシンク５０に対して外気を送風する冷却ファン８２をさらに備える。図１に示すように、本実施形態では、当該冷却ファン８２が、右側板２４の下部内面に沿うように並列して４つ配置される。また、図２に示すように、右側板２４の下部には、４つの冷却ファン８２に対応した位置に複数の吸気スリット８４が穿設される。さらに、左側板２５の下部には、複数の吸気スリット８４に対応した複数の排気スリット８５が穿設される。 Here, the robot controller 10 further includes a cooling fan 82 that blows outside air to the heat sink 50. As shown in FIG. 1, in the present embodiment, four cooling fans 82 are arranged in parallel along the lower inner surface of the right side plate 24. Further, as shown in FIG. 2, a plurality of intake slits 84 are formed in the lower portion of the right side plate 24 at positions corresponding to the four cooling fans 82. Further, a plurality of exhaust slits 85 corresponding to the plurality of intake slits 84 are formed in a lower portion of the left side plate 25.
　このような構造によれば、冷却ファン８２が駆動することで、右側板２４の吸気スリット８４から第２空間２９内に外気が吸気され、左側板２５の排気スリット８５から前記外気が排気される。すなわち、筐体２０内の第２空間２９には、右側板２４から左側板２５に向かう方向（後述するＸ方向）に流れる外気が供給される。そして、第２空間２９内には、例えば、後述するヒートシンク５０の少なくとも一部等が配置される。ここで、ヒートシンク５０の少なくとも一部は、後述するフィン集合体６０及びベース部５１の第２主面５４を含む。 According to such a structure, when the cooling fan 82 is driven, outside air is taken into the second space 29 from the intake slit 84 of the right side plate 24, and the outside air is exhausted from the exhaust slit 85 of the left side plate 25. . That is, the outside air flowing in the direction from the right side plate 24 to the left side plate 25 (X direction described later) is supplied to the second space 29 in the housing 20. In the second space 29, for example, at least a part of a heat sink 50 described later is arranged. Here, at least a part of the heat sink 50 includes a fin assembly 60 and a second main surface 54 of the base 51 described later.
　（要部構造）
　図２～４に基づき、本実施形態に係るヒートシンク５０及びそれを備えるロボット制御装置１０の要部構造について説明する。上記したように、図２は、本実施形態に係るヒートシンクを備えるロボット制御装置の要部構造を示す概略図である。また、図３は、本実施形態に係るヒートシンクを備えるロボット制御装置の要部構造及びその周辺部分を拡大した様子を右側板側から見たときの概略図である。 (Main structure)
With reference to FIGS. 2 to 4, a description will be given of a main part structure of a heat sink 50 according to the present embodiment and a robot control device 10 including the same. As described above, FIG. 2 is a schematic diagram illustrating a main structure of a robot control device including the heat sink according to the present embodiment. FIG. 3 is a schematic view of a main part structure of a robot control device including a heat sink according to the present embodiment and an enlarged view of a peripheral portion thereof when viewed from a right side plate side.
　そして、図３は、本実施形態に係るヒートシンクとパワーモジュール及び抵抗素子との位置関係を説明するための図であり、（Ａ）がヒートシンクの底面図、（Ｂ）が基板及び当該基板に取り付けられたパワーモジュール及び抵抗素子の底面図である。なお、図４（Ｂ）において、本実施形態に係るヒートシンク５０の要部構造（後述するベース部５１、突部７７及び熱伝導シート７８）が破線で示される。 FIGS. 3A and 3B are diagrams for explaining the positional relationship between the heat sink, the power module, and the resistance element according to the present embodiment. FIG. 3A is a bottom view of the heat sink, and FIG. It is a bottom view of the power module and the resistance element which were obtained. In FIG. 4B, the main structure (a base 51, a protrusion 77, and a heat conductive sheet 78 to be described later) of the heat sink 50 according to the present embodiment is indicated by a broken line.
　（基板３０、パワーモジュール４０及び抵抗素子９０）
　図２～４に示すように、ロボット制御装置１０は、基板３０と、当該基板３０の底面に取り付けられるパワーモジュール４０（第１素子）と、当該パワーモジュール４０から出力される電流値を測定するための抵抗素子９０（第２素子）と、をさらに備える。基板３０、パワーモジュール４０及び抵抗素子９０は、それぞれ、外気から遮断された第１空間２８内に配置される。 (Substrate 30, power module 40 and resistance element 90)
As shown in FIGS. 2 to 4, the robot controller 10 measures the substrate 30, a power module 40 (first element) attached to the bottom surface of the substrate 30, and a current value output from the power module 40. And a resistive element 90 (second element). The substrate 30, the power module 40, and the resistance element 90 are each disposed in the first space 28 that is shielded from the outside air.
　基板３０は、例えば、ケイ素などの絶縁体で形成された平板と、各々が当該平板の表面及び内部に配置され、互いに電気的に接続される複数の電子部品とを有することで、電子回路として機能してもよい。 The substrate 30 has, for example, a flat plate formed of an insulator such as silicon, and a plurality of electronic components each of which is disposed on the surface and inside of the flat plate and is electrically connected to each other, thereby forming an electronic circuit. May work.
　図２～４に示すように、パワーモジュール４０は、略直方体状であり、基板３０の底面上に８つ取り付けられる。なお、８つのパワーモジュール４０は、それぞれ、互いに同じ形状及び寸法を有する。また、複数のパワーモジュール４０は、それぞれ、図４に示すＸ方向（すなわち、筐体２０の右側板２４と左側板２５とを結ぶ方向）及び当該Ｘ方向に直交するＹ方向に並列されることで行列状に配置される。 パ ワ ー As shown in FIGS. 2 to 4, eight power modules 40 are substantially rectangular parallelepiped, and eight power modules 40 are mounted on the bottom surface of the substrate 30. The eight power modules 40 have the same shape and size as each other. In addition, the plurality of power modules 40 are respectively arranged in the X direction shown in FIG. 4 (that is, the direction connecting the right side plate 24 and the left side plate 25 of the housing 20) and the Y direction orthogonal to the X direction. Are arranged in a matrix.
　具体的には、本実施形態では、Ｘ方向に４つのパワーモジュール４０が並列され、その集合体がＹ方向に２つ並列されることで、基板３０の底面上に８つのパワーモジュール４０が２×４の行列状で取り付けられる。なお、８つのパワーモジュール４０は、それぞれ、スペーサ４１（図３参照）を介して基板３０に取り付けられてもよい。これにより、８つのパワーモジュール４０は、それぞれ、その上面が基板３０の底面に接触しないように配置されるので、各々で生じた熱が基板３０に直接伝わることを防止することができる。 Specifically, in the present embodiment, eight power modules 40 are arranged on the bottom surface of the substrate 30 by arranging four power modules 40 in parallel in the X direction and arranging two of the aggregates in the Y direction. Mounted in a matrix of × 4. Note that each of the eight power modules 40 may be attached to the substrate 30 via a spacer 41 (see FIG. 3). Thus, since the eight power modules 40 are arranged such that the top surfaces thereof do not contact the bottom surface of the substrate 30, it is possible to prevent heat generated in each of the eight power modules from being directly transmitted to the substrate 30.
　８つのパワーモジュール４０は、それぞれ、インテリジェントパワーモジュール（Ｉｎｔｅｌｌｉｇｅｎｔ　Ｐｏｗｅｒ　Ｍｏｄｕｌｅ、ＩＰＭ）であってもよく、また、サーボアンプの主要部品であってもよい。そして、例えば、各々がパワーモジュール４０を含む複数のサーボアンプそれぞれから、３相モータ用の電流が出力されてもよい。このような構成によって、ロボット制御装置１０は、一つのパワーモジュール４０によって一つの軸を制御するように構成されてもよい。ここで、前記軸は、例えば、ロボットの関節軸や外部軸などを含んでもよい。 The eight power modules 40 may be intelligent power modules (Intelligent Power Module, IPM), or may be main components of a servo amplifier. Then, for example, a current for a three-phase motor may be output from each of the plurality of servo amplifiers including the power module 40. With such a configuration, the robot controller 10 may be configured to control one axis by one power module 40. Here, the axis may include, for example, a joint axis or an external axis of the robot.
　図２～４に示すように、抵抗素子９０は、略直方体状であり、基板３０の底面上にパワーモジュール４０に対応して８つ実装される。８つの抵抗素子９０は、それぞれ、互いに同じ形状及び寸法を有する。また、８つの抵抗素子９０は、それぞれ、対応するパワーモジュール４０の前後方向（すなわち、前板２２と背板２３とを結ぶ方向）における外側に存する面に沿うように配置される。 抵抗 As shown in FIGS. 2 to 4, eight resistance elements 90 are substantially rectangular parallelepiped, and eight resistance elements 90 are mounted on the bottom surface of the substrate 30 in correspondence with the power modules 40. Each of the eight resistance elements 90 has the same shape and dimensions as each other. Each of the eight resistance elements 90 is arranged along a surface existing outside the corresponding power module 40 in the front-rear direction (that is, the direction connecting the front plate 22 and the back plate 23).
　すなわち、前板２２側においてＸ方向に並列して配置される４つのパワーモジュール４０に対応して実装される抵抗素子９０は、それぞれ、前記４つのパワーモジュール４０よりも前板２２側に実装される。一方、背板２３側においてＸ方向に並列して配置される４つのパワーモジュール４０に対応して実装される抵抗素子９０は、それぞれ、前記４つのパワーモジュール４０よりも背板２３側に実装される。４つの抵抗素子９０は、それぞれ、対応するパワーモジュール４０から出力される電流値を測定するために、当該対応するパワーモジュール４０に対して直列接続される。 That is, the resistance elements 90 mounted corresponding to the four power modules 40 arranged in parallel in the X direction on the front plate 22 side are mounted on the front plate 22 side of the four power modules 40, respectively. You. On the other hand, the resistance elements 90 mounted corresponding to the four power modules 40 arranged in parallel in the X direction on the back plate 23 side are mounted on the back plate 23 side of the four power modules 40, respectively. You. Each of the four resistance elements 90 is connected in series to the corresponding power module 40 in order to measure a current value output from the corresponding power module 40.
　図３に示すように、パワーモジュール４０の先端（すなわち、図３において底面）は、抵抗素子９０の先端（同前）よりも基板３０の主面から離れた位置に存する。これにより、本実施形態に係るヒートシンク５０のベース部５１（の第１主面５２）は、パワーモジュール４０のみに直接的に（熱的に）接触し、抵抗素子９０には接触しない。 (3) As shown in FIG. 3, the tip of the power module 40 (that is, the bottom surface in FIG. 3) is located farther from the main surface of the substrate 30 than the tip (before) of the resistance element 90. As a result, (the first main surface 52 of) the base portion 51 of the heat sink 50 according to the present embodiment directly (thermally) contacts only the power module 40 and does not contact the resistance element 90.
　（ヒートシンク５０）
　図２～４に示すように、本実施形態に係るヒートシンク５０は、外気に開放された第２空間２９内に配置される。ヒートシンク５０は、第１主面５２及び当該第１主面５２と平行に延在する第２主面５４を有するように板状に形成され、前記第１主面５２が８つのパワーモジュール４０それぞれと直接的に接触するように配置されるベース部５１と、当該ベース部５１の第２主面５４上に立設される複数のフィン７０とを備える。 (Heat sink 50)
As shown in FIGS. 2 to 4, the heat sink 50 according to the present embodiment is disposed in the second space 29 open to the outside air. The heat sink 50 is formed in a plate shape so as to have a first main surface 52 and a second main surface 54 extending in parallel with the first main surface 52, and the first main surface 52 includes eight power modules 40. And a plurality of fins 70 erected on the second main surface 54 of the base portion 51.
　ベース部５１は、平面視において、仕切板２７に穿設された貫通孔２７ａよりも僅かに大きい矩形状に形成される。そして、ベース部５１は、その第１主面５２の縁部が仕切板２７の底面側から貫通孔２７ａの周縁部に当接した状態で、当該仕切板２７の底面に固定される。ベース部５１は、このように配置されることで、その第１主面５２が外気から遮断された第１空間２８の周縁の一部を画定し、且つ、その第２主面５４が外気に開放された第２空間２９の周縁の一部を画定する。 The base portion 51 is formed in a rectangular shape slightly larger than the through hole 27a formed in the partition plate 27 in a plan view. The base portion 51 is fixed to the bottom surface of the partition plate 27 in a state where the edge portion of the first main surface 52 is in contact with the peripheral edge portion of the through hole 27a from the bottom surface side of the partition plate 27. The base portion 51 is arranged in this manner, so that the first main surface 52 defines a part of the periphery of the first space 28 shielded from the outside air, and the second main surface 54 is connected to the outside air. It defines a part of the periphery of the opened second space 29.
　複数のフィン７０は、各々が板状に形成され、且つ、各々の厚み方向がＹ方向と一致した状態で当該Ｙ方向に並列してベース部５１の第２主面５４上に立設される。そして、当該複数のフィン７０によって、フィン集合体６０が構成される。なお、Ｙ方向において互いに隣接するフィン７０の間隔は、それぞれ、互いに同一である。 Each of the plurality of fins 70 is formed in a plate shape, and is erected on the second main surface 54 of the base portion 51 in parallel with the Y direction with each thickness direction coinciding with the Y direction. . The plurality of fins 70 form the fin assembly 60. Note that the intervals between the fins 70 adjacent to each other in the Y direction are the same as each other.
　そして、図４に示すように、複数のフィン７０が８つのパワーモジュール４０に対応した位置に並列して配置されることで、フィン集合体６０は、各々がＹ方向に延び、Ｘ方向に並列される複数の畝状部６２と、複数の畝状部６２のうちＸ方向において互いに隣接する畝状部６２の間をＹ方向に延びる溝状部６４と、を有する。なお、ここでいう複数の畝状部６２とは、それぞれ、上記のようにベース部５１の第２主面５４上に複数のフィン７０が立設されることで、当該複数のフィン７０全体としてベース部５１の第２主面５４上をＹ方向に延びる突条又は突部として構成される部分をいう。 Then, as shown in FIG. 4, the plurality of fins 70 are arranged in parallel at positions corresponding to the eight power modules 40, so that each of the fin assemblies 60 extends in the Y direction and is arranged in parallel in the X direction. A plurality of ridges 62 and a groove 64 extending in the Y direction between the ridges 62 adjacent to each other in the X direction among the plurality of ridges 62. Note that the plurality of ridges 62 referred to herein means that the plurality of fins 70 are erected on the second main surface 54 of the base portion 51 as described above, so that the plurality of fins 70 as a whole A portion configured as a ridge or a protrusion extending in the Y direction on the second main surface 54 of the base portion 51.
　これにより、本実施形態に係るヒートシンク５０は、フィン集合体６０の溝状部６４によって軽量化が図られつつ、フィン集合体６０の複数の畝状部６２によって複数のパワーモジュール４０を十分に冷却することが可能である。 Thus, the heat sink 50 according to the present embodiment is sufficiently cooled by the plurality of ridges 62 of the fin assembly 60 while the weight is reduced by the groove 64 of the fin assembly 60. It is possible to
　なお、本実施形態では、上記のようにＸ方向に４つのパワーモジュール４０が並列されるので、それに対応してＸ方向に４つの畝状部６２が並列される。また、このように４つの畝状部６２が並列されるので、これらの間にＹ方向に延びる計３つの溝状部６４が存する。 In the present embodiment, since the four power modules 40 are arranged in the X direction as described above, the four ridges 62 are arranged in the X direction correspondingly. In addition, since the four ridges 62 are arranged in parallel in this manner, there are a total of three groove-like portions 64 extending in the Y direction therebetween.
　図４に示すように、複数のフィン７０が８つのパワーモジュール４０のうちＹ方向において互いに隣接するパワーモジュール４０の間に対応した位置でも並列して配置されることで、４つの畝状部６２は、それぞれ、Ｙ方向において互いに隣接するパワーモジュール４０の間に対応した位置でもＹ方向に延びる。 As shown in FIG. 4, the plurality of fins 62 are arranged in parallel at positions corresponding to the power modules 40 adjacent to each other in the Y direction among the eight power modules 40, so that the four ridges 62 are formed. Extend in the Y direction even at positions corresponding to between the power modules 40 adjacent to each other in the Y direction.
　これにより、ヒートシンク５０の表面積が大きくなるので、フィン集合体６０の溝状部６４によって冷却効率が低下することを抑制することができる。また、Ｙ方向において互いに隣接するパワーモジュール４０の間に、同様のパワーモジュール４０や他の発熱体がさらに配置されるような場合、これらを十分に冷却することが可能となる。 This increases the surface area of the heat sink 50, so that it is possible to suppress the cooling efficiency from being lowered by the groove-shaped portion 64 of the fin assembly 60. In the case where similar power modules 40 and other heating elements are further arranged between power modules 40 adjacent to each other in the Y direction, these can be sufficiently cooled.
　複数のフィン７０は、それぞれ、８つのパワーモジュール４０それぞれのＸ方向における長さに対応した幅を有する。これにより、本実施形態に係るヒートシンク５０は、適切に軽量化を図ることができる。それ故に、軽量化（すなわち、フィン集合体６０に溝状部６４を設けること）によって冷却効率が低下することを抑制することが可能となる。 The plurality of fins 70 each have a width corresponding to the length in the X direction of each of the eight power modules 40. Thus, the heat sink 50 according to the present embodiment can appropriately reduce the weight. Therefore, it is possible to suppress a decrease in cooling efficiency due to a reduction in weight (that is, providing the groove portions 64 in the fin assembly 60).
　また、複数のフィン７０は、それぞれ、その厚み方向に見て、Ｘ方向に延びる基端側の端縁を下底７１とし、Ｘ方向に延びる先端側の端縁を上底７２とし、且つ、下底７１が上底７２よりも長い台形状である。これにより、ヒートシンク５０全体をダイキャストで一体成形する場合、金型から引き抜く作業を適切に行うことが可能となる。 Further, each of the plurality of fins 70 has a base edge extending in the X direction as a lower bottom 71, a tip edge extending in the X direction as an upper bottom 72 when viewed in the thickness direction, and The lower bottom 71 has a trapezoidal shape longer than the upper bottom 72. Accordingly, when the entire heat sink 50 is integrally formed by die casting, it is possible to appropriately perform the operation of pulling out the heat sink 50 from the mold.
　複数のフィン７０のうちＸ方向（図２において左右方向）において互いに隣接するフィン７０の間には、互いに隣接するフィン７０同士を接続する接続部７４が設けられる。当該接続部７４は、ベース部５１の第２主面５４上に立設され、フィン７０と比較して当該第２主面５４からの長さが短い。これにより、ヒートシンク５０の表面積が大きくなるので、フィン集合体６０の溝状部６４によって冷却効率が低下することを抑制することができる。 接 続 A connection portion 74 that connects the mutually adjacent fins 70 is provided between the mutually adjacent fins 70 in the X direction (the left and right direction in FIG. 2) among the plurality of fins 70. The connecting portion 74 is erected on the second main surface 54 of the base portion 51 and has a shorter length from the second main surface 54 than the fin 70. This increases the surface area of the heat sink 50, so that it is possible to suppress a decrease in cooling efficiency due to the groove-shaped portions 64 of the fin assembly 60.
　さらに、Ｙ方向において互いに隣接するフィン７０の間に形成されＸ方向に延びる溝と、Ｙ方向において互いに隣接する接続部７４の間に形成されＸ方向に延びる溝とがＸ方向において連なるので、フィン集合体６０においてＸ方向の一端から他端まで延びる溝が形成される。これにより、冷却ファン８２によって第２空間２９内に送風されるＸ方向に流れる外気が、フィン集合体６０の内部で拡散することを防止することができるので、ヒートシンク５０によって外気の流れが阻害されることを抑制することが可能となる。 Further, the groove formed between the fins 70 adjacent to each other in the Y direction and extending in the X direction and the groove formed between the connecting portions 74 adjacent to each other in the Y direction and extending in the X direction are continuous in the X direction. In the aggregate 60, a groove extending from one end to the other end in the X direction is formed. This prevents the outside air flowing in the X direction, which is blown into the second space 29 by the cooling fan 82, from diffusing inside the fin assembly 60, so that the heat sink 50 inhibits the flow of the outside air. Can be suppressed.
　なお、図２に示すように、４つの畝状部６２のうち最も右側板２４側に存する畝状部６２とＸ方向（図２において左右方向）において対向するように上記冷却ファン８２が配置される。これにより、上記冷却ファン８２は、フィン集合体６０に対してＸ方向に流れる外気を送風することができる。 As shown in FIG. 2, the cooling fan 82 is arranged so as to face the ridge 62 on the rightmost plate 24 side of the four ridges 62 in the X direction (the horizontal direction in FIG. 2). You. Thereby, the cooling fan 82 can blow the outside air flowing in the X direction to the fin assembly 60.
　図２～４に示すように、ヒートシンク５０は、ベース部５１の第１主面５２上に突設され、その先端が抵抗素子９０と熱的に接触するように配置される突部７７をさらに備える。突部７７は、抵抗素子９０に対応して８つ設けられる。また、８つの突部７７は、それぞれ、直方体状に形成され、互いに同じ形状及び寸法を有する。さらに、８つの突部７７は、ベース部５１及び複数のフィン７０と一体的に形成される。 As shown in FIGS. 2 to 4, the heat sink 50 further includes a protrusion 77 projecting from the first main surface 52 of the base portion 51 and arranged so that the tip thereof is in thermal contact with the resistance element 90. Prepare. Eight protrusions 77 are provided corresponding to the resistance elements 90. Each of the eight protrusions 77 is formed in a rectangular parallelepiped shape, and has the same shape and size. Further, the eight protrusions 77 are formed integrally with the base 51 and the plurality of fins 70.
　上記したように、パワーモジュール４０の先端（図３において底面）は、抵抗素子９０の先端（同前）よりも基板３０の主面から離れた位置に存する。ここで、突部７７の高さ寸法は、抵抗素子９０の先端からパワーモジュール４０の先端までの高さ方向における距離（又は抵抗素子９０の先端からベース部５１の第１主面５２までの距離）よりも僅かに小さい。 As described above, the tip (the bottom in FIG. 3) of the power module 40 is located farther from the main surface of the substrate 30 than the tip (the same as before) of the resistance element 90. Here, the height dimension of the protrusion 77 is a distance in the height direction from the tip of the resistance element 90 to the tip of the power module 40 (or the distance from the tip of the resistance element 90 to the first main surface 52 of the base portion 51). ) Slightly smaller than
　これにより、突部７７の先端（図３において上面）と抵抗素子９０の先端（図３において底面）との間には間隙が形成される。ここで、ヒートシンク５０は、突部７７の先端に設けられる熱伝導シート７８（熱伝導材）をさらに備える。当該熱伝導シート７８によって、前記間隙が埋められる。このような構成によれば、突部７７は、熱伝導シート７８を介して抵抗素子９０と熱的に接触するように配置される。なお、熱伝導シート７８は、絶縁体であり且つ弾性体である。 Thereby, a gap is formed between the tip of the protrusion 77 (the top surface in FIG. 3) and the tip of the resistance element 90 (the bottom surface in FIG. 3). Here, the heat sink 50 further includes a heat conductive sheet 78 (heat conductive material) provided at the tip of the protrusion 77. The gap is filled with the heat conductive sheet 78. According to such a configuration, the protrusion 77 is arranged so as to be in thermal contact with the resistance element 90 via the heat conductive sheet 78. The heat conductive sheet 78 is an insulator and an elastic body.
　（効果）
　本実施形態に係るヒートシンク５０は、その第１主面５２がパワーモジュール４０と直接的に（熱的に）接触するように配置されるベース部５１によって前記パワーモジュール４０（第１素子）を冷却することができ、且つ、その先端が抵抗素子９０と熱的に接触するように配置される突部７７によって前記抵抗素子９０（第２素子）を冷却することができる。その結果、各々の先端から基板３０までの距離が互いに異なるパワーモジュール４０及び抵抗素子９０をともに冷却することが可能となる。 (effect)
In the heat sink 50 according to the present embodiment, the power module 40 (first element) is cooled by the base portion 51 arranged so that the first main surface 52 is in direct (thermal) contact with the power module 40. The resistance element 90 (second element) can be cooled by the protrusion 77 arranged so that the tip thereof is in thermal contact with the resistance element 90. As a result, it is possible to cool both the power module 40 and the resistance element 90 having different distances from the respective tips to the substrate 30.
　本実施形態に係るヒートシンク５０は、突部７７の先端に設けられる熱伝導シート７８（熱伝導材）を備えるので、抵抗素子９０が発する熱を熱伝導シート７８によって突部７７へと良好に伝達することができる。 Since the heat sink 50 according to the present embodiment includes the heat conductive sheet 78 (heat conductive material) provided at the tip of the protrusion 77, the heat generated by the resistance element 90 is favorably transmitted to the protrusion 77 by the heat conductive sheet 78. can do.
　本実施形態に係る熱伝導シート７８は絶縁体で構成されるので、ヒートシンクの突部と第２素子との間で短絡が生じる虞をなくすことが可能となる。 熱 Since the heat conductive sheet 78 according to the present embodiment is made of an insulator, it is possible to eliminate the possibility that a short circuit occurs between the protrusion of the heat sink and the second element.
　本実施形態に係る熱伝導シート７８は弾性体で構成されるので、突部７７の先端と抵抗素子９０（第２素子）との間に形成される間隙に熱伝導シート７８を弾性変形させつつ配置することができる。これにより、容易且つ適切に突部７７の先端を抵抗素子９０と熱的に接触させることが可能となる。 Since the heat conductive sheet 78 according to the present embodiment is formed of an elastic body, the heat conductive sheet 78 is elastically deformed in a gap formed between the tip of the protrusion 77 and the resistance element 90 (second element). Can be arranged. This makes it possible to easily and appropriately bring the tip of the protrusion 77 into thermal contact with the resistance element 90.
　したがって、例えば、突部７７の先端の高さ位置が高くなり過ぎることで、当該突部７７が抵抗素子９０を押圧してしまうことを防止することが可能となる。その結果、突部７７及び抵抗素子９０に応力集中が生じないので、これらが破損することを防止することができる。 Therefore, for example, it is possible to prevent the protrusion 77 from pressing the resistance element 90 due to the height of the tip of the protrusion 77 being too high. As a result, since stress concentration does not occur in the protrusion 77 and the resistance element 90, they can be prevented from being damaged.
　本実施形態では、突部７７がベース部５１及び複数のフィン７０と一体的に形成されるので、抵抗素子９０が発する熱を突部７７からベース部５１へと良好に伝達し、且つ、当該ベース部５１から複数のフィン７０へと良好に伝達することができるので、抵抗素子９０を効率良く冷却することが可能となる。また、ヒートシンク５０全体をダイキャストで一体成形することができるので、ヒートシンク５０の製造を安価に行うことが可能となる。 In the present embodiment, since the protrusion 77 is formed integrally with the base 51 and the plurality of fins 70, the heat generated by the resistance element 90 is transmitted well from the protrusion 77 to the base 51, and Since the power can be transmitted well from the base portion 51 to the plurality of fins 70, the resistance element 90 can be efficiently cooled. In addition, since the entire heat sink 50 can be integrally formed by die casting, it is possible to manufacture the heat sink 50 at low cost.
　本実施形態では、ロボット制御装置１０がパワーモジュール４０及び抵抗素子９０をそれぞれ８つ備え、突部７７が抵抗素子９０に応じて８つ設けられるので、ベース部５１の第１主面５２が８つのパワーモジュール４０と直接的に接触することによって当該８つのパワーモジュール４０を冷却することができ、且つ、８つの突部７７それぞれが対応する抵抗素子９０に熱的に接触することによって当該８つの抵抗素子９０を冷却することができる。 In the present embodiment, since the robot control device 10 includes eight power modules 40 and eight resistance elements 90, and eight protrusions 77 are provided in accordance with the resistance elements 90, the first main surface 52 of the base part 51 is The eight power modules 40 can be cooled by directly contacting the two power modules 40, and the eight power modules 40 can be cooled by each of the eight protrusions 77 thermally contacting the corresponding resistance element 90. The resistance element 90 can be cooled.
　本実施形態に係るヒートシンク５０は、複数のフィン７０を備えるので、その表面積が大きくなる。これにより、パワーモジュール４０及び抵抗素子９０を効率良く冷却することが可能となる。 ヒ ー ト シ ン ク Since the heat sink 50 according to the present embodiment includes the plurality of fins 70, the surface area is increased. Thereby, the power module 40 and the resistance element 90 can be efficiently cooled.
　本実施形態に係るロボット制御装置１０は、ヒートシンク５０を備えることで、各々の先端から基板３０までの距離が互いに異なるパワーモジュール４０及び抵抗素子９０をともに冷却することが可能となる。 ロ ボ ッ ト The robot control device 10 according to the present embodiment includes the heat sinks 50, so that both the power module 40 and the resistance element 90 having different distances from the respective ends to the substrate 30 can be cooled.
　第１素子がパワーモジュール４０として構成され、第２素子がパワーモジュール４０から出力される電流値を測定するための抵抗素子９０として構成されるので、各々の先端から基板３０までの距離が互いに異なり、互いに隣接して設けられることに起因してともに冷却することが困難であったパワーモジュール４０及び抵抗素子９０をともに冷却することが可能となる。 Since the first element is configured as the power module 40 and the second element is configured as the resistance element 90 for measuring the current value output from the power module 40, the distances from the respective tips to the substrate 30 are different from each other. This makes it possible to cool both the power module 40 and the resistance element 90, which have been difficult to cool together due to being provided adjacent to each other.
　本実施形態に係るロボット制御装置１０は、ヒートシンク５０に対して外気を送風する冷却ファン８２を備えることで、パワーモジュール４０及び抵抗素子９０を効率良く冷却することが可能となる。 The robot control device 10 according to the present embodiment includes the cooling fan 82 that blows outside air to the heat sink 50, so that the power module 40 and the resistance element 90 can be efficiently cooled.
　（変形例）
　上記説明から、当業者にとっては、本発明の多くの改良や他の実施形態が明らかである。したがって、上記説明は、例示としてのみ解釈されるべきであり、本発明を実行する最良の態様を当業者に教示する目的で提供されたものである。本発明の精神を逸脱することなく、その構造及び／又は機能の詳細を実質的に変更できる。 (Modification)
From the above description, many modifications and other embodiments of the present invention are obvious to one skilled in the art. Therefore, the above description should be construed as illustrative only and is provided for the purpose of teaching those skilled in the art the best mode of carrying out the invention. Details of its structure and / or function may be substantially changed without departing from the spirit of the invention.
　上記実施形態では、第１素子が基板３０の主面上に取り付けられるパワーモジュール４０として構成され、第２素子がパワーモジュール４０から出力される電流値を測定するために基板３０の主面上に実装される抵抗素子９０として構成される場合について説明したが、これに限定されない。すなわち、第１素子及び第２素子は、それぞれ、形状及び寸法のうち少なくとも何れか一方が互いに異なるのであれば、その他の電子部品であってもよい。例えば、第１素子は、基板３０の主面上に実装されるＩＣチップであってもよいし、その他の電子部品であってもよい。第２素子についても同様である。 In the above embodiment, the first element is configured as the power module 40 mounted on the main surface of the substrate 30, and the second element is mounted on the main surface of the substrate 30 to measure the current value output from the power module 40. Although the case where the resistor element 90 is mounted is described, the present invention is not limited to this. That is, the first element and the second element may be other electronic components as long as at least one of the shape and the dimension is different from each other. For example, the first element may be an IC chip mounted on the main surface of the substrate 30, or may be another electronic component. The same applies to the second element.
　上記実施形態では、ヒートシンク５０のベース部５１が、パワーモジュール４０（第１素子）と直接的に接触することで当該パワーモジュール４０と熱的に接触する場合を説明したが、これに限定されない。例えば、ヒートシンク５０のベース部５１は、突部７７の先端に設けられる熱伝導シート７８と同様の部材を介してパワーモジュール４０に接触してもよい。 In the above embodiment, the case where the base portion 51 of the heat sink 50 is in direct contact with the power module 40 (first element) to thermally contact the power module 40 has been described, but the present invention is not limited to this. For example, the base portion 51 of the heat sink 50 may contact the power module 40 via a member similar to the heat conductive sheet 78 provided at the tip of the protrusion 77.
　上記実施形態では、熱伝導材が、絶縁体であり且つ弾性体である熱伝導シート７８である場合を説明したが、これに限定されない。例えば、熱伝導材は、絶縁体であるが弾性体でない他の熱伝導シートであってもよいし、弾性体であるが絶縁体でない他の熱伝導シートであってもよいし、或いは、その他の熱伝導材であってもよい。なお、熱伝導材が絶縁体でない場合、ヒートシンク５０の突部７７と抵抗素子９０（第２素子）との間で短絡が生じる虞がある。したがって、このような場合、ヒートシンク５０の突部７７と抵抗素子９０（第２素子）との間に、熱伝導材に加えて絶縁体を設けてもよいし、或いは、熱伝導材を設けずに絶縁体のみ設けてもよい。 In the above embodiment, the case where the heat conductive material is the heat conductive sheet 78 which is an insulator and an elastic body has been described, but the present invention is not limited to this. For example, the heat conductive material may be another heat conductive sheet that is an insulator but not an elastic body, or may be another heat conductive sheet that is an elastic body but not an insulator, or Heat conductive material. If the heat conductive material is not an insulator, a short circuit may occur between the protrusion 77 of the heat sink 50 and the resistance element 90 (second element). Therefore, in such a case, an insulator may be provided between the protrusion 77 of the heat sink 50 and the resistance element 90 (second element) in addition to the heat conductive material, or no heat conductive material is provided. May be provided only with an insulator.
　上記実施形態では、８つのパワーモジュール４０が２×４の行列状で計８つ並列して配置され、これに対応して抵抗素子９０及び突部７７がそれぞれ８つずつ並列して配置される場合を説明したが、これに限定されない。すなわち、パワーモジュール４０は、１つ以上配置され、これに対応して抵抗素子９０及び突部７７がそれぞれ１つ以上ずつ並列して配置されてもよい。なお、上記実施形態のようにフィン集合体６０が畝状部６２及び溝状部６４を有する場合、パワーモジュール４０は、少なくともＸ方向に並列して配置されていることを要する。 In the above embodiment, a total of eight power modules 40 are arranged in parallel in a 2 × 4 matrix, and correspondingly, eight resistive elements 90 and eight protrusions 77 are arranged in parallel. Although the case has been described, the present invention is not limited to this. That is, one or more power modules 40 may be arranged, and one or more resistance elements 90 and one or more protrusions 77 may be arranged in parallel corresponding to this. When the fin assembly 60 has the ridge portions 62 and the groove portions 64 as in the above embodiment, the power modules 40 need to be arranged at least in parallel in the X direction.
　上記実施形態では、突部７７が直方体状である場合を説明したが、この場合に限定されない。例えば、ベース部５１の第１主面５２から離間するに連れて横断面積が小さくなるテーパ状であってもよいし、或いは、その他の形状であってもよい。 In the above-described embodiment, the case where the protrusion 77 has a rectangular parallelepiped shape has been described. However, the present invention is not limited to this case. For example, it may have a tapered shape in which the cross-sectional area decreases as the distance from the first main surface 52 of the base portion 51 increases, or may have another shape.
　上記実施形態では、複数のフィン７０は、それぞれ、その厚み方向に見て台形状である場合を説明したが、この場合に限定されない。例えば、複数のフィン７０は、それぞれ、その厚さ方向に見て、正方形状や長方形状などの他の四角形状であってもよいし、その他の多角形状であってもよいし、或いは、その他の形状であってもよい。 In the above embodiment, the case where each of the plurality of fins 70 has a trapezoidal shape when viewed in the thickness direction has been described. However, the present invention is not limited to this case. For example, each of the plurality of fins 70 may have another square shape such as a square shape or a rectangular shape when viewed in the thickness direction thereof, or may have another polygonal shape. The shape may be as follows.
　上記実施形態では、Ｘ方向が右側板２４と左側板２５を結ぶ方向であり、Ｙ方向が前板２２と背板２３とを結ぶ方向である場合について説明したが、これに限定されない。例えば、Ｘ方向が前板２２と背板２３とを結ぶ方向であり、Ｙ方向が右側板２４と左側板２５を結ぶ方向であってもよい。また、複数のパワーモジュール４０（発熱体）が鉛直方向に並列される場合、Ｘ方向が底板２１と天板２６とを結ぶ方向であり、Ｙ方向が前板２２と背板２３とを結ぶ方向であってもよいし、或いは、その逆であってもよい。 In the above embodiment, the case where the X direction is the direction connecting the right side plate 24 and the left side plate 25 and the Y direction is the direction connecting the front plate 22 and the back plate 23 is described, but the present invention is not limited to this. For example, the X direction may be a direction connecting the front plate 22 and the back plate 23, and the Y direction may be a direction connecting the right side plate 24 and the left side plate 25. When a plurality of power modules 40 (heating elements) are arranged in a vertical direction, the X direction is the direction connecting the bottom plate 21 and the top plate 26, and the Y direction is the direction connecting the front plate 22 and the back plate 23. Or vice versa.
　１０　ロボット制御装置
　２０　筐体
　２１　底板
　２２　前板
　２３　背板
　２４　右側板
　２５　左側板
　２６　天板
　２７　仕切板
　２７ａ　貫通孔
　２８　第１空間
　２９　第２空間
　３０　基板
　４０　パワーモジュール
　５０　ヒートシンク
　５１　ベース部
　５２　第１主面
　５４　第２主面
　６０　フィン集合体
　６２　畝状部
　６４　溝状部
　７０　フィン
　７１　台形の下底
　７２　台形の上底
　７４　接続部
　７７　突部
　７８　熱伝導シート
　８０　載置部
　８２　冷却ファン
　８４　吸気スリット
　８５　排気スリット
　９０　抵抗素子 REFERENCE SIGNS LIST 10 robot control device 20 housing 21 bottom plate 22 front plate 23 back plate 24 right plate 25 left plate 26 top plate 27 partition plate 27a through hole 28 first space 29 second space 30 substrate 40 power module 50 heat sink 51 base 52 1 main surface 54 second main surface 60 fin assembly 62 ridge portion 64 groove portion 70 fin 71 trapezoidal lower bottom 72 trapezoidal upper bottom 74 connecting portion 77 protrusion 78 thermal conduction sheet 80 mounting portion 82 cooling fan 84 Inlet slit 85 Exhaust slit 90 Resistance element

Claims (10)

  1. 　ロボット制御装置に設けられるヒートシンクであって、
    　前記ロボット制御装置は、基板と、前記基板の主面上に存する第１素子及び第２素子と、を備え、
    　第１主面を有するように板状に形成され、前記第１主面が前記第１素子と熱的に接触するように配置されるベース部と、
    　前記ベース部の第１主面上に突設され、その先端が前記第２素子と熱的に接触するように配置される突部と、を備えることを特徴とする、ヒートシンク。     A heat sink provided in the robot control device,
    The robot control device includes: a substrate; a first element and a second element existing on a main surface of the substrate;
    A base portion formed in a plate shape having a first main surface, the base portion being arranged such that the first main surface is in thermal contact with the first element;
    A protrusion protruding from the first main surface of the base portion and having a distal end disposed in thermal contact with the second element.
  2. 　前記突部の先端に設けられる熱伝導材をさらに備え、
    　前記突部は、前記熱伝導材を介して前記第２素子と熱的に接触するように配置される、請求項１に記載のヒートシンク。     Further comprising a heat conductive material provided at the tip of the protrusion,
    The heat sink according to claim 1, wherein the protrusion is arranged to be in thermal contact with the second element via the heat conductive material.
  3. 　前記熱伝導材は絶縁体で構成される、請求項２に記載のヒートシンク。 3. The heat sink according to claim 2, wherein the heat conductive material is made of an insulator.
  4. 　前記熱伝導材は弾性体で構成される、請求項２又は３に記載のヒートシンク。 4. The heat sink according to claim 2, wherein the heat conductive material is made of an elastic material.
  5. 　前記突部は、前記ベース部と一体的に形成される、請求項１乃至４のいずれかに記載のヒートシンク。 The heat sink according to any one of claims 1 to 4, wherein the protrusion is formed integrally with the base.
  6. 　前記ロボット制御装置は前記第２素子を複数備え、
    　前記突部は、前記第２素子に応じて複数設けられる、請求項１乃至５のいずれかに記載のヒートシンク。     The robot control device includes a plurality of the second elements,
    The heat sink according to claim 1, wherein a plurality of the protrusions are provided according to the second element.
  7. 　各々が前記ベース部の第１主面と平行に延在する第２主面上に立設される複数のフィンをさらに備える、請求項１乃至６のいずれかに記載のヒートシンク。 The heat sink according to any one of claims 1 to 6, further comprising a plurality of fins each standing on a second main surface extending parallel to the first main surface of the base portion.
  8. 　請求項１乃至７のいずれかに記載のヒートシンクと、前記基板と、前記第１素子と、前記第２素子と、を備えるロボット制御装置であって、
    　外気から遮断された第１空間と、外気に開放された第２空間とがその内部に設けられる筐体をさらに備え、
    　前記第１空間内に前記基板、前記第１素子及び前記第２素子が配置され、前記第２空間内に前記ヒートシンクの少なくとも一部が配置されることを特徴とする、ロボット制御装置。     A robot control device comprising the heat sink according to any one of claims 1 to 7, the substrate, the first element, and the second element,
    A first space that is shielded from outside air, and a second space that is open to outside air, further comprising a housing provided therein;
    The robot control device, wherein the substrate, the first element, and the second element are disposed in the first space, and at least a part of the heat sink is disposed in the second space.
  9. 　前記第１素子が前記基板の主面上に取り付けられるパワーモジュールとして構成され、前記第２素子が前記パワーモジュールから出力される電流値を測定するために前記基板の主面上に実装される抵抗素子として構成される、請求項８に記載のロボット制御装置。 The first element is configured as a power module mounted on a main surface of the substrate, and the second element is mounted on the main surface of the substrate to measure a current value output from the power module. The robot control device according to claim 8, wherein the robot control device is configured as an element.
  10. 　前記ヒートシンクに対して外気を送風する冷却ファンをさらに備える、請求項８又は９に記載のロボット制御装置。 The robot control device according to claim 8 or 9, further comprising a cooling fan that blows outside air to the heat sink.
PCT/JP2019/038944 2018-10-03 2019-10-02 Heat sink and robot control device provided with same WO2020071431A1 (en)

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