WO2020057311A1 - 光网络设备 - Google Patents

光网络设备 Download PDF

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Publication number
WO2020057311A1
WO2020057311A1 PCT/CN2019/101687 CN2019101687W WO2020057311A1 WO 2020057311 A1 WO2020057311 A1 WO 2020057311A1 CN 2019101687 W CN2019101687 W CN 2019101687W WO 2020057311 A1 WO2020057311 A1 WO 2020057311A1
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WIPO (PCT)
Prior art keywords
heat dissipation
circuit board
optical network
network device
heat
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PCT/CN2019/101687
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English (en)
French (fr)
Inventor
梁伟青
司宝峰
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青岛海信宽带多媒体技术有限公司
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Publication of WO2020057311A1 publication Critical patent/WO2020057311A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing

Definitions

  • the present application relates to the field of optical communication technologies, and in particular, to an optical network device.
  • a heat-dissipating material is mainly pasted on the surface of the main chip.
  • the heat-dissipating material includes a metal heat sink or a graphite sheet. The heat-dissipating material diffuses the heat generated during the operation of the main chip to the external environment to achieve heat dissipation of the chip.
  • the present application provides an optical network device, which includes a housing, a circuit board and a heat sink disposed in the housing, and a chip provided on an upper surface of the circuit board.
  • the heat sink includes a heat sink base and a protrusion.
  • the radiating fins on the radiating base are attached to the surface of the chip.
  • the optical network device further includes a heat dissipation bracket.
  • the heat dissipation bracket includes a first end and a second end. The first end is fixedly connected to the heat dissipation fin, and the second end is attached to the lower surface of the circuit board. .
  • FIG. 1 is a schematic diagram of an overall structure of an optical network device according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a part of an optical network device according to an embodiment of the present application.
  • FIG. 3 is an exploded view of the structure shown in FIG. 2;
  • FIG. 4 is another exploded view of the structure shown in FIG. 2;
  • FIG. 5 is a schematic structural diagram of a heat dissipation member according to an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a heat dissipation bracket according to an embodiment of the present application.
  • FIG. 7 is an assembly schematic diagram of an optical network device according to an embodiment of the present application.
  • the level of heat dissipation performance will directly affect the working performance and stability of the optical network equipment, so the heat dissipation efficiency of the chip and the surface of the circuit board needs to be improved.
  • a heat sink is attached to the chip surface to achieve heat dissipation of the chip, but the thermal resistance of the paste material is large, that is, the thermal conductivity is poor, and the curing time is longer. Assembly, it may cause the assembly position of the uncured installed heat sink to change, and then affect the heat dissipation of the chip by the heat sink.
  • the heat sink is only disposed on the surface of the chip, and its heat-conducting contact area with the chip is small, resulting in a low heat dissipation efficiency of the heat sink to the chip.
  • this application provides an optical network device, which includes a housing, a circuit board, a heat sink, and a chip disposed on a surface of the circuit board.
  • the heat sink includes a heat sink base and a heat sink protruding from the heat sink base.
  • the fins and the heat dissipation base are attached to the surface of the chip.
  • the optical network device may further include a heat dissipation bracket.
  • the heat dissipation bracket includes a first end and a second end. The first end is fixedly connected to the heat dissipation fin, and the second end is attached to the lower surface of the circuit board. Heat from the surface is transferred to the fins.
  • the heat emitted by the chip during operation can be transferred to the circuit board. Since the second end of the heat dissipation bracket is attached to the lower surface of the circuit board, the heat of the circuit board can be transferred to the first end of the heat dissipation bracket. Further, the first end is fixedly connected to the heat dissipation fin, and the transferred heat can be diffused to the outside through the heat dissipation fin, thereby effectively improving the heat dissipation contact area of the heat sink with the circuit board and the chip.
  • the heat dissipating member is clamped and connected to the circuit board through the heat dissipating bracket in a certain sense, the fixing stability of the heat dissipating member on the circuit board can be effectively improved, and the heat dissipation efficiency of the heat dissipating member to the chip can also be guaranteed.
  • the heat from the lower surface of the circuit board is transmitted to the heat dissipation fins of the heat sink through the heat dissipation bracket, which increases the heat dissipation area of the circuit board, and realizes double-sided heat dissipation of the circuit board.
  • the first end of the heat dissipation bracket is fixedly connected to the heat dissipation fin, and the second end of the heat dissipation bracket is attached to the surface of the circuit board, thereby improving the fixing stability of the heat dissipation member on the circuit board through the heat dissipation bracket and ensuring the heat dissipation member.
  • the cooling effect and efficiency of the chip is improved.
  • FIG. 1 shows a schematic diagram of the overall internal structure of an optical network device according to an embodiment of the present application
  • FIG. 2 shows a schematic diagram of a part of the interior of a housing in the optical network device
  • FIG. 3 is an exploded view of the structure shown in FIG. 2.
  • 4 is another exploded view of the structure shown in FIG. 2.
  • the optical network device provided in the embodiment of the present application includes a housing 10, a circuit board 100, a heat sink 200, and a chip 300 disposed on an upper surface 110 of the circuit board 100.
  • the optical network equipment mentioned in this embodiment refers to an ONU (Optical Network Unit) or an ONT (Optical Network Terminal).
  • the casing 10 is used to receive the circuit board 100 and other electrical components of the optical network device.
  • the casing 10 is made of metal or plastic.
  • circuit board 100 includes pads, vias, mounting holes, wires, components, and connectors, etc., and provides support and electrical signal transmission carriers for various electronic components (such as chips).
  • the chip 300 is disposed on the upper surface 110 of the circuit board 100.
  • the chip 300 may be disposed on the surface of the circuit board 100 in an integrated manner or a glue mounting manner.
  • the signal line of the chip 300 and the signal line on the circuit board 100 are usually connected in a wire-bounding manner.
  • the heat generated by the chip 300 during operation can be transferred to the surface of the circuit board 100 via a thermally conductive adhesive such as glue. Therefore, dissipating heat from the surface of the circuit board 100 has a positive effect on diffusing the heat generated by the chip 300 itself to the outside world and is also the key to ensuring the stability of the optical network equipment.
  • the heat dissipating member 200 includes a heat dissipating base 210 and at least one heat dissipating fin 220 protruding from the heat dissipating base 210. Heat spreads to the outside world.
  • the number of the heat dissipation fins 220 may be one heat dissipation fin, or a plurality of heat dissipation fins as shown in FIG. 1-5.
  • the heat dissipation base 210 is attached to the surface of the chip 300, and the heat dissipation fins 220 provided on the heat dissipation base 210 are arranged to face away from the surface of the chip 300, that is, extend away from the upper surface 110 of the circuit board 100.
  • the heat dissipation fins 220 are vertically protruding and disposed on the surface of the heat dissipation base 210 away from the chip 300.
  • the heat radiating fins 220 can increase the contact area with the external air flow.
  • air flowing through the heat dissipation fins 220 can speed up its circulation speed, thereby effectively improving the heat dissipation efficiency between the heat sink 200 and the external environment. That is to improve the heat dissipation efficiency of the entire optical network equipment.
  • the heat sink 200 is an extruded aluminum material.
  • the optical network device provided in the embodiment of the present application may further include a heat dissipation bracket 400.
  • the heat dissipation bracket 400 includes a first end 410 and a second end 420. The first end 410 is fixedly connected to the heat dissipation fin 220, and the second end 420 is attached to the lower surface 120 of the circuit board 100.
  • the heat generated during the operation of the chip 300 disposed on the upper surface 110 of the circuit board 100 can be transferred to the lower surface 120 of the circuit board 100 body, and conducted to the first end 420 through the second end 420 in close contact with the lower surface 120.
  • One end 410 is conducted to the heat dissipation fin 220 through the first end 410, so as to dissipate heat from the lower surface 120 of the circuit board 100.
  • the heat dissipation bracket 400 transfers heat from the lower surface of the circuit board 100 to the heat dissipation member 200 through the first end 410 and the second end 420, which can effectively improve the heat dissipation contact area and heat dissipation efficiency of the circuit board 100.
  • a heat conductive adhesive 600 is sandwiched between the second end 420 of the heat dissipation bracket 400 and the lower surface 120 of the circuit board 100, as shown in FIG. 7.
  • a heat conductive silicone grease or a heat conductive glue 660 may also be provided between the heat dissipation base 210 and the chip 300.
  • the second end 420 and the first end 410 may be arranged in a bent manner.
  • the second end 420 and the first end 410 are arranged in an “L” shape.
  • the second end 420 can be attached to the lower surface 120 of the circuit board 100 and fully contact the lower surface 120 to receive the heat on the lower surface 120, as shown in FIG. 2.
  • the first end 410 is disposed at an angle to the upper surface 110 of the circuit board 100, so that the first end 410 can be fixed on a corresponding surface of the heat dissipation fin 220, for example, as shown in FIG. 2, it can be substantially perpendicular to the surface of the circuit board 100 .
  • the first end 410 is disposed at an acute angle with the upper surface 110 of the circuit board 100, and the heat dissipation fin 220 is disposed at the same acute angle as the heat dissipation base 210.
  • the heat dissipation base 210 is attached to the surface of the chip 300, and the heat dissipation fins 220 are protrudingly provided on the heat dissipation base 210.
  • the first end 410 is parallel to the heat dissipation
  • the surface of the fin 220 is disposed in a direction, that is, the surface 221 of the fin 220 that is attached to the fin 220 and is perpendicular to the radiating base 210, see FIGS. 2 and 5.
  • the first end 410 extends in a direction substantially perpendicular to the upper surface 110
  • the second end 420 is substantially parallel to the lower surface 120, that is, parallel to the upper surface 110.
  • the second end 420 and the first end 410 are arranged in a bent manner.
  • the circuit board 100, the heat dissipating member 200, and the heat dissipating bracket 400 are fixedly mounted on the surface of the heat dissipating fin 220 under the assembly position relationship.
  • the second end 420 is rotated around the connection point between the first end 410 and the heat dissipation fin 220 by a fixing torque.
  • the rotation direction can be seen in FIG. 7 A direction, that is, when the first end 410 and the heat dissipation fin 220 are connected, the second end 420 arranged in a bend with the first end 410 approaches the lower surface 120 so that the second end 420 faces the lower surface 120 motion.
  • the distance between the second end 420 and the lower surface 120 can be reduced, so that the second end 420 is closely attached to the lower surface 120, and at the same time, the tightness of the connection between the second end 420 and the lower surface 120 of the thermally conductive adhesive 600 is improved.
  • the first end 410 and the heat dissipation fin 220 are fastened and connected by a screw 500 as shown in FIG. 3, FIG. 4 and FIG. 7.
  • the screw 500 may connect the heat dissipation fin 220 and the first end 410 in a direction perpendicular to the surface 221 of the heat dissipation fin 220.
  • the heat dissipation bracket 400 can increase the mounting area of the heat sink 200 on the circuit board 100, that is, while accelerating heat conduction through the second end 420, the heat sink 200 connected to the first end 410 can be more firmly connected to Circuit board 100.
  • the assembly manner in which the heat dissipation bracket 400 clamps the heat dissipation member 200 on the circuit board 100 can improve the fixing stability of the heat dissipation member 200 on the circuit board 100.
  • the heat sink base 210 and the circuit board 100 are connected by pins 700, and the pins 700 are fixed by welding.
  • the pins 700 are fixed by welding.
  • FIG. 5 at least two through holes 211 are provided on the heat dissipation base 210.
  • the two through holes 211 can be arranged along the diagonal of the heat dissipation base 210.
  • the pins 700 are inserted into the through holes 211 and soldered to the circuit.
  • the circuit board 100 is fixedly connected to the circuit board 100 and the heat dissipation base 210.
  • the first end of the heat dissipation bracket is fixedly connected to the heat dissipation base, and the second end is attached to the lower surface of the circuit board.
  • the first end is fixedly connected to the upper surface of the heat dissipation base parallel to the heat dissipation base of the circuit board. The first end and the second end are arranged in parallel, and the circuit board and the heat dissipation base are clamped. .
  • the heat dissipation bracket which is fixedly connected to the heat dissipation base
  • a larger first end can be set to contact the heat dissipation fin, and the transferred heat can be transmitted through The radiating fins diffuse to the outside to a large extent.
  • the heat sink is fixedly connected to the heat sink fin through the first end of the heat sink in a certain sense, and is clamped and connected to the circuit board.
  • the first end of the heat sink is fixedly connected to the heat sink fin, which can solve the upper surface of the heat sink base. Because the heat dissipation fins are covered, there is no problem of fixedly connecting the first end with extra parts, and the installation is simple and easy to operate.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种光网络设备，包括壳体（10）以及设置在壳体（10）内的电路板（100）、散热件（200）和设置在电路板（100）的上表面上的芯片（300）。其中，散热件（200）包括散热底座（210）和凸出设置在散热底座（210）上的散热翅片（220），散热底座（210）贴合设置于芯片（300）的表面。光网络设备还包括散热支架（400），散热支架（400）包括第一端（410）和第二端（420），第一端（410）固定连接于散热翅片（220）上，第二端（420）贴合于电路板（100）的下表面。芯片（300）在工作时所发出的热量可传递至电路板（100），并经由散热支架（400）的与电路板（100）的下表面相贴合的第二端（420）以及散热支架（400）的与散热翅片（220）连接的第一端（410）传递至散热翅片（220），最终由散热翅片（220）向外界扩散。

Description

光网络设备
相关申请的交叉引用
本申请要求于2018年09月20日提交中国专利局、申请号为201811103377.4、申请名称为“一种光网络设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光通信技术领域，尤其涉及一种光网络设备。
背景技术
在光网络设备产品中，集成电路上主芯片的散热对于整机的稳定工作具有重要意义。目前主要是在主芯片表面粘贴散热材料，散热材料包括金属散热片或石墨片，由散热材料将主芯片工作时所产生的热量向外界环境进行扩散，以实现对芯片散热。
发明内容
本申请提供一种光网络设备，包括壳体、设置在所述壳体内的电路板和散热件、以及设置在所述电路板上表面上的芯片，所述散热件包括散热底座和凸出设置在所述散热底座上的散热翅片，所述散热底座贴合设置于所述芯片的表面。光网络设备还包括散热支架，所述散热支架包括第一端和第二端，所述第一端固定连接于所述散热翅片上，所述第二端贴合于所述电路板的下表面。
附图说明
为了更清楚地说明本申请的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为根据本申请实施例的光网络设备的整体结构示意图；
图2为根据本申请实施例的光网络设备的部分结构示意图；
图3为图2所示结构的***示意图；
图4为图2所示结构的另一***示意图；
图5为根据本申请实施例中散热件的结构示意图；
图6为根据本申请实施例中散热支架的结构示意图；以及
图7为根据本申请实施例中所提供的光网络设备的装配示意图。
具体实施方式
在光网络设备中，因散热性能的高低将直接影响光网络设备的工作性能及稳定性，所以需要提高芯片和电路板表面的散热效率。通常采用在芯片表面上粘贴散热件以实现芯片的散热，但粘贴材料的热阻较大，即导热性能较差，且需固化时间较长，若在粘贴材料固化期间进行光网络设备内其他元件的装配，则将可能导致未固化安装的散热件的装配位置发生改变，进而影响散热件对芯片的散热。再者，散热件仅设置在芯片的表面，其与芯片的导热接触面积较少，导致散热件对芯片的散热效率较低。
针对上述问题，本申请提供一种光网络设备，包括壳体、电路板、散热件和设置在电路板上表面上的芯片，其中：散热件包括散热底座和凸出设置在散热底座上的散热翅片，散热底座贴合设置于芯片的表面。此外，该光网络设备还可包括散热支架，散热支架包括第一端和第二端，第一端固定连接于散热翅片上，第二端贴合于电路板的下表面，由散热支架将下表面的热量传递至散热翅片。这样，芯片在工作时所发出的热量可传递至电路板，由于散热支架的第二端与电路板的下表面相贴合，从而可将电路板的热量传递至散热支架的第一端。进一步，第一端与散热翅片固定连接，所传递来的热量可经散热翅片向外界扩散，从而可有效提高散热件与电路板和芯片的散热接触面积。此外，由于散热件在一定意义上通过散热支架夹持连接于电路板上，可有效提高散热件在电路板上的固定稳定性，也可保证散热件对芯片的散热效率。通过散热支架将电路板下表面的热量传导至散热件的散热翅片上，增大电路板的散热面积，实现了电路板的双面散热。同时，散热支架上的第一端固定连接于散热翅片上，其第二端贴合于电路板的表面，由此可通过散热支架提高对散热件在电路板上的固定稳定性，保证散热件对芯片的散热效果和散热效率。
下面以具体实施例结合附图的方式对本申请提供的光网络设备进行详细描述。
图1示出了本申请实施例提供的光网络设备的内部整体结构示意图，图2示出了光网络设备中壳体内部的部分结构示意图，图3为图2所示结构的***示意图，图4为图 2所示结构的另一***示意图。本申请实施例提供的光网络设备包括壳体10、电路板100、散热件200和设置在电路板100上表面110上的芯片300。本实施例中所提到的光网络设备是指ONU(Optical Network Unit，光网络单元)或ONT(Optical Network Terminal，光网络终端)。壳体10用于容纳电路板100及光网络设备的其他电气元件。可选的，壳体10为金属材质或塑料材质。
进一步地，电路板100包括焊盘、过孔、安装孔、导线、元器件以及接插件等，为各电子元器件(如：芯片)提供支撑和电信号传输载体。
芯片300设置在电路板100的上表面110上。例如，芯片300可通过集成的方式或胶水贴装的方式设置在电路板100的表面。
为实现芯片300与电路板100之间信号的通信传输，通常采用wire bounding(连接金线)的方式将芯片300的信号线与电路板100上的信号线相连。其中，芯片300在工作时所发出的热量可以经由例如胶水等导热胶粘剂传递至电路板100的表面。因此，对电路板100的表面进行散热，这对向外界扩散芯片300本身工作所产生的热量具有积极作用，同样也是保证光网络设备工作稳定性的关键。
例如，请参见图5所示，散热件200包括散热底座210和凸出设置在散热底座210上的至少一个散热翅片220，由散热翅片220将传递至散热底座210或散热件200本体的热量向外界扩散。其中，散热翅片220的个数可为一个散热翅片，也可如图1-5所示为多个。散热底座210贴合于芯片300的表面，设置在散热底座210上的散热翅片220被布设为背离芯片300的表面，也就是沿远离电路板100的上表面110的方向延伸。优选的，散热翅片220呈垂直凸出设置在散热底座210的远离芯片300的表面上。
散热翅片220可增大与外界空气流的接触面积。而且，在散热翅片220的延伸方向朝向光网络设备的通风孔的情况下，空气流经散热翅片220可加快其流通速度，进而可有效提高散热件200与外界环境之间的散热效率，即提高光网络设备整机的散热效率。可选的，散热件200为铝挤型材料。
为增大电路板100表面的散热面积并提高散热件200在电路板100上的固定稳妥性，本申请实施例提供的光网络设备还可包括散热支架400。请参见图6所示，散热支架400包括第一端410和第二端420，第一端410固定连接于散热翅片220上，第二端420贴合于电路板100的下表面120。这样，设置在电路板100上表面110上的芯片300工作时所产生的热量可经电路板100本体传递至其下表面120，经由与下表面120相贴合接 触的第二端420传导至第一端410，再经由第一端410传导至散热翅片220，从而实现对电路板100下表面120进行散热。散热支架400通过第一端410、第二端420将电路板100下表面的热量传递至散热件200上，可有效提高电路板100的散热接触面积和散热效率。
为提高散热支架400与电路板100的导热效率，在散热支架400的第二端420与电路板100的下表面120之间夹设有导热胶600，如图7所示。同样的，为提高芯片300的表面与散热底座210之间的导热效率，在散热底座210与芯片300之间也可设置导热硅脂或导热胶660。
进一步地，第二端420与第一端410可呈弯折布设，示例的，如图6所示，第二端420与第一端410呈“L”型弯折布设。第二端420可贴合于电路板100的下表面120，充分接触下表面120以接收下表面120上的热量，如图2所示。第一端410与电路板100的上表面110成角度地设置，使得第一端410可装配固定于散热翅片220的对应的表面，例如可如图2所示大致垂直于电路板100的表面。示例地，第一端410与电路板100的上表面110成锐角设置，而散热翅片220与散热底座210成同样锐角设置。散热底座210贴合于芯片300的表面，散热翅片220凸出设置在散热底座210上，为使第一端410能够充分接触散热翅片220以保证导热效率，第一端410沿平行于散热翅片220表面的方向设置，也就是贴合于散热翅片220的垂直于散热底座210的表面221，参见图2和图5。基于上述位置关系，第一端410沿与上表面110大致垂直的方向延伸，而第二端420大致平行于下表面120、也即平行于上表面110。由此，使得第二端420与第一端410呈弯折布设。
如图5和图7所示，电路板100、散热件200和散热支架400在装配位置关系下，散热支架400的第一端410固定装配于散热翅片220的表面。当第一端410与散热翅片220进行固定时，第二端420受固定力矩的作用绕第一端410与散热翅片220之间的连接点转动，其转动方向可参见图7中所示的A向，也就是说，连接第一端410和散热翅片220时，与第一端410呈弯折布设的第二端420朝向下表面120靠近，以使第二端420朝向下表面120运动。这样可缩小第二端420与下表面120之间的距离，使得第二端420紧贴于下表面120，并同时提高导热胶600在第二端420与下表面120之间的连接紧密性。
可选的，第一端410与散热翅片220通过图3、图4和图7所示的螺钉500紧固连接。例如，螺钉500可沿垂直于散热翅片220的表面221的方向连接散热翅片220和第 一端410。
通过散热支架400可增大散热件200在电路板100上安装固定面积，也即在经由第二端420加速热量传导的同时，可使与第一端410相连的散热件200更稳固地连接在电路板100上。散热支架400将散热件200夹持于电路板100上的装配方式可提高散热件200在电路板100上固定稳定性。
为提高散热底座210在电路板100上的固定稳定性，可选的，如图3和图4所示，将散热底座210与电路板100通过插针700相连，插针700通过焊接的方式固定。例如，如图5所示，散热底座210上至少设置两个通孔211，两个通孔211可沿散热底座210的对角所布设，插针700穿设于通孔211内并焊接于电路板100上，以使电路板100与散热底座210固定连接。
在本申请的一些实施例中，散热支架的第一端固定连接于散热底座上，第二端贴合于电路板的下表面。在某些实施例中，第一端固定连接于散热底座的平行于电路板的散热底座的上表面。第一端和第二端平行设置，夹持电路板和散热底座。。
相较于散热支架的第一端固定连接于散热底座上，由于散热翅片的尺寸大于散热底座的边沿尺寸，可以设置较大的第一端于散热翅片接触，所传递来的热量可经散热翅片较大限度地向外界扩散。此外，相较于散热支架的第一端固定连接于散热底座，一方面，散热件在一定意义上通过散热支架的第一端固定连接于散热翅片而夹持连接于电路板上，可较大幅度地提高散热件在电路板上的固定稳定性，也可保证散热件对芯片的散热效率；另一方面，散热支架的第一端固定连接于散热翅片上，可以解决散热底座的上表面因布满散热翅片而没有多余的部位固定连接第一端的问题，而且安装较简单，易于操作。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本公开的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
以上仅为本公开的较佳实施例而已，并不用以限制本公开，凡在本公开的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本公开的保护范围之内。

Claims (20)

  1. 一种光网络设备，包括：
    壳体；
    电路板，所述电路板设置在所述壳体内；
    散热件，所述散热件设置在所述壳体内，包括：
    散热底座；和
    至少一个散热翅片，所述散热翅片凸出设置在所述散热底座上；
    芯片，所述芯片设置在所述电路板的上表面上，所述散热底座贴合设置于所述芯片的表面；和
    散热支架，所述散热支架包括：
    第一端，所述第一端固定连接于所述散热翅片上；
    第二端，所述第二端贴合于所述电路板的下表面。
  2. 根据权利要求1所述的光网络设备，其中，所述第二端与所述第一端呈弯折布设，所述第一端与所述电路板的上表面成角度地设置。
  3. 根据权利要求2所述的光网络设备，其中，所述第二端与所述第一端垂直。
  4. 根据权利要求1所述的光网络设备，其中，所述散热翅片呈基本上垂直于所述散热底座。
  5. 根据权利要求1所述的光网络设备，其中，所述第一端贴合于所述散热翅片的垂直于所述散热底座的表面。
  6. 根据权利要求1所述的光网络设备，其中，所述散热底座与所述芯片之间设置导热硅脂和/或导热胶。
  7. 根据权利要求1所述的光网络设备，其中，所述第二端与所述电路板的下表面之间夹设有导热胶。
  8. 根据权利要求1所述的光网络设备，其中，所述散热翅片与所述第一端通过螺钉固定连接。
  9. 根据权利要求8所述的光网络设备，其中，所述螺钉沿垂直于所述散热翅片表面的方向连接所述散热翅片和所述第一端。
  10. 根据权利要求1所述的光网络设备，其中，所述散热底座通过插针焊接设置在所述电路板上。
  11. 根据权利要求10所述的光网络设备，其中，所述散热底座上至少设置两个通孔，两个所述通孔沿所述散热底座的对角所布设，所述插针穿设于所述通孔内并焊接于 所述电路板上。
  12. 根据权利要求1所述的光网络设备，其中，所述散热件为铝挤型材料。
  13. 一种光网络设备，包括：
    壳体；
    电路板，所述电路板设置在所述壳体内；
    散热件，所述散热件设置在所述壳体内，包括：
    散热底座；和
    至少一个散热翅片，所述散热翅片凸出设置在所述散热底座上；
    芯片，所述芯片设置在所述电路板的上表面上，所述散热底座贴合设置于所述芯片的表面；和
    散热支架，所述散热支架包括：
    第一端，所述第一端固定连接于所述散热件上；
    第二端，所述第二端贴合于所述电路板的下表面。
  14. 根据权利要求13所述的光网络设备，其中，所述第一端固定连接于所述散热底座上。
  15. 根据权利要求14所述的光网络设备，其中，所述第二端与所述第一端平行。
  16. 根据权利要求13所述的光网络设备，其中，所述散热翅片呈基本上垂直于所述散热底座。
  17. 根据权利要求13所述的光网络设备，其中，所述散热底座与所述芯片之间设置导热硅脂和/或导热胶。
  18. 根据权利要求13所述的光网络设备，其中，所述第二端与所述电路板的下表面之间夹设有导热胶。
  19. 根据权利要求13所述的光光网络设备，其中，所述散热底座与所述第一端通过螺钉固定连接。
  20. 根据权利要求13所述的光光网络设备，其中，所述散热底座通过插针焊接设置在所述电路板上。
PCT/CN2019/101687 2018-09-20 2019-08-21 光网络设备 WO2020057311A1 (zh)

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