WO2020055139A1 - Method for producing composite device and composite device realized thereby - Google Patents
Method for producing composite device and composite device realized thereby Download PDFInfo
- Publication number
- WO2020055139A1 WO2020055139A1 PCT/KR2019/011788 KR2019011788W WO2020055139A1 WO 2020055139 A1 WO2020055139 A1 WO 2020055139A1 KR 2019011788 W KR2019011788 W KR 2019011788W WO 2020055139 A1 WO2020055139 A1 WO 2020055139A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- varistor
- capacitor
- electrode
- external
- electrodes
- Prior art date
Links
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
Definitions
- the present invention relates to a composite device, and more particularly, to a method for manufacturing a composite device and a composite device implemented therein.
- the metal housing has high electrical conductivity due to the nature of the material, an electrical path may be formed between the metal housing and the internal circuit part through a specific element or due to an internal design of the device.
- the metal housing and the internal circuit portion form a loop, when static electricity having a high voltage is instantaneously introduced through the metal housing having a large external exposure area, circuit portions such as an IC may be damaged.
- the leakage current generated by the AC power may flow into the metal housing along the ground portion of the built-in circuit part. In this case, a countermeasure against this is caused because it causes an electric shock that may cause discomfort to the user or, in severe cases, injury to the user. This is required.
- the present invention has been devised in view of the above points, and is a composite device capable of simultaneously realizing high-reliability electrostatic response characteristics, leakage current blocking, and high-capacitance capacitance suitable for wireless communication even when the electrostatic protection function and the capacitor function are integrated into a single device. It is an object to provide a manufacturing method and a composite device implemented through it.
- the present invention can provide a composite device manufacturing method and a composite device implemented through the composite device manufacturing method that can secure the bonding reliability and the appearance reliability that can occur when implemented as a single package device, and especially in mass production. There are other purposes.
- the static electricity protection function and the capacitor function fluctuate due to heat applied in a manufacturing process for producing a complex single element or a process in which a single element is mounted on a circuit component, or heat generated in the element during repeated use of a single element.
- Another object is to provide a method for manufacturing a composite device that can be continuously expressed without and a composite device implemented through the same.
- the present invention has another object to realize various electronic devices, including portable electronic devices, through the composite device according to the present invention, which can continuously express heterogeneous functions with excellent electrical connection reliability as a single device.
- the present invention (1) a first body and a varistor portion disposed inside the first body and having at least one end of which the varistor electrodes are exposed on both sides of the first body, and the second body. And a capacitor part disposed inside the second body and having capacitor electrodes at least at both ends of which are exposed on both sides of the second body, (2) the upper surface of the varistor part or the upper surface of the capacitor part.
- Composite element provides a method comprising a.
- the temporary bonding portion of step (2) may be formed by including an epoxy component and a curing agent.
- the temporary bonding portion of step (2) may have a thickness of 15 to 60 ⁇ m.
- the temporary joining part of step (2) may be formed to have a length of 50 to 95% with respect to the length of the upper surface, and a width of 50 to 90% with respect to the width of the upper surface, more preferably the The joint may be formed to have a length of 70 to 95% with respect to the upper surface length and a width of 70 to 90% with respect to the width of the upper surface.
- the temporary bonding portion includes an epoxy component, a curing agent, and a glass filler for improving the bonding strength
- the glass filler may be provided at 20 to 65% by weight based on the total weight of the temporary bonding portion.
- the external terminal is formed by thermally curing an electrode paste containing a conductive epoxy component and a conductive metal in an amount of 50 to 90% by weight, and the heat curing temperature of the electrode paste is lower than a 5% weight loss temperature of the junction. Can be performed.
- the varistor portion of step (1) further includes a pair of first external electrodes provided on both sides of the first body to which the varistor electrode is exposed
- the capacitor portion further includes a pair of second external electrodes provided on both sides of the second body to which the capacitor electrode is exposed
- the external terminals of step (4) are external surfaces of the first external electrode and the second external electrode, respectively. It may be formed to cover at least a portion.
- first external electrode and the second external electrode may be sintered electrodes including a conductive metal and a glassy component.
- first external electrode and the second external electrode may be formed to have a thickness of 15 ⁇ m or less and a width of 200 ⁇ m or less.
- the first body is Zr, Nb, Pr, Bi, Co.
- a plurality of varistor layers including at least one oxide and ZnO selected from the group consisting of Si, Cr, and Mn are formed by lamination, and the second body is composed of Ti, Si, Sr, Bi, W, and Nd.
- a plurality of ceramic layers including at least one oxide and BaTiO 3 selected from the group may be stacked.
- provisional joining portion may be formed to cover 58 to 70% of the total area of the upper surface of the varistor portion or the capacitor portion.
- the present invention is disposed inside the first body and the first body, the varistor portion having a varistor electrode at least at both ends of which is exposed on both sides of the first body, the second body and the second body, A capacitor portion, a lower surface of the varistor portion, or an upper surface of the capacitor portion having capacitor electrodes exposed at least at both ends of the second body and having the same exposure direction of the varistor electrode and the capacitor electrode.
- a pair of external parts that are electrically connected to the exposed varistor electrode and the capacitor electrode provided on both sides of the junction between the varistor portion and the capacitor portion to cover 55 to 93% of the total area, and the stacked varistor portion and the capacitor portion. It provides a composite device including a terminal.
- the first body is formed integrally by stacking a plurality of varistor layers including a first varistor layer and a second varistor layer, and the varistor electrode is an electrode on one surface of the first varistor layer.
- a plurality of first varistor electrodes provided at regular intervals in the longitudinal direction of the first varistor layer, and spaced apart from the first varistor electrode in the stacking direction of the varistor layer, and correspond to a space between the adjacent first varistor electrodes
- at least one second varistor electrode formed on one surface of the second varistor layer may be included.
- the second body may be formed integrally by stacking a plurality of ceramic layers, and the capacitor electrodes may be respectively formed on at least two ceramic layers such that a part of the electrodes between the electrodes adjacent to each other in the stacking direction of the ceramic layers face each other. have.
- the average thickness of the junction may be 7 ⁇ 40 ⁇ m.
- the length of the junction portion is 75 to 99% of the total length of the lower surface of the varistor portion or the upper portion of the capacitor portion, and the width of the junction portion is 75 to 95% of the entire width of the lower surface of the varistor portion or the upper surface of the capacitor portion.
- the minimum adjacent distance between the first external electrode and the varistor electrode not connected to the first external electrode is 20 ⁇ m or more, and the second external electrode and the capacitor electrode not connected to the second external electrode The distance may be 20 ⁇ m or more.
- the varistor electrode and the capacitor electrode may have a thickness of 10 ⁇ m or less.
- the height of the first body may be greater than that of the second body.
- the vertical distance between the adjacent capacitor electrodes may be 10 ⁇ m or more.
- the composite device may have a volume of 0.32 mm or less.
- junction may be formed to cover 65 to 78% of the total area of the lower surface of the varistor or the upper surface of the capacitor.
- the composite element is an element that connects between a metal case, which is a human body contactable conductor of an electronic device including an area used as an antenna, and a built-in circuit part, wherein the capacitor part receives communication signals flowing from the metal case used as the antenna. Passing, and at the same time, the communication signal in the communication frequency band passes without attenuation, and at the same time improves the blocking ability of DC components in the leakage current by the external power of the electronic device flowing from the ground of the internal circuit part, and the external power of the electronic device. It has an insulation breakdown voltage higher than the rated voltage of the, the varistor portion can pass through the static electricity flowing from the metal case and block the leakage current is not transmitted to the metal case.
- the present invention provides a portable electronic device including a conductor including a tip portion protruding outwardly from a conductive case, a circuit portion, and a composite element according to the present invention that electrically connects the conductor and the circuit portion.
- the conductor may include a side key, or the tip portion may include one end of an insertion port of a connector for connection with an external device.
- the dielectric constant used in the present invention means a relative dielectric constant.
- the present invention despite the combination of a varistor and a capacitor as a single element, it has excellent response characteristics to static electricity and can realize high-capacitance, thereby improving product reliability. In addition, it is possible to prevent the deterioration of the appearance quality that may occur in the complexing process, and to realize the excellent bonding strength of the implemented product. Furthermore, the present invention can be simplified into a single device using an existing varistor and capacitor manufacturing process, thereby simplifying the manufacturing process and facilitating lineup according to various capacities to improve manufacturing efficiency and reduce manufacturing cost. In addition, by implementing capacitors separately from varistors, design freedom increases when capacitors are implemented, so lineups of various capacities are possible, so customers can quickly respond to customer demands without changing processes.
- the material transfer between the varistors and the capacitors, which occur as a single element and are sintered together before each of them can be sourced, can be blocked. Deterioration of properties can be prevented. Furthermore, the heat resistance is maintained even by heat applied from the outside or heat generated by itself, so the coupling reliability between two different devices is excellent. In addition, defects such as twisting and twisting due to a difference in the rate of temperature change between the varistor material and the capacitor material can be suppressed when a single element is sintered together.
- FIG. 1 is a perspective view of a composite device according to an embodiment of the present invention
- Figure 2 is a schematic cross-sectional view along the X 1 -X 1 'border line for the composite device of Figure 1,
- FIG. 3 is a schematic cross-sectional view along the X 2 -X 2 ′ boundary line for the composite device of FIG. 1;
- FIG. 4 is a schematic diagram of a process for forming an external terminal of a composite device according to an embodiment of the present invention
- 5A to 5C are cross-sectional views along a Y-Y 'boundary line for varistor parts of various embodiments included in the composite device of the present invention.
- 6A and 6B are cross-sectional views along Y-Y 'boundary lines for capacitor portions of various embodiments included in the composite device of the present invention.
- Figure 7 is a schematic diagram showing a temporary junction formed in step (2) included in an embodiment of the present invention.
- FIG. 8 is a cross-sectional view of a composite device according to another embodiment of the present invention.
- Figure 9 is a schematic diagram showing a temporary junction formed in step (2) included in another embodiment of the present invention.
- FIG. 10 is a graph comparing the characteristics of a composite device according to an embodiment of the present invention.
- 11 to 16 are conceptual views illustrating an application example of a composite device according to an embodiment of the present invention.
- the composite device 100 is provided at the bottom of the varistor unit 110 and the varistor unit 110. It includes a disposed capacitor unit 120, the varistor unit 110 and the junction between the capacitor unit 120, 130 and the external terminal 140.
- the composite device 100 may be a composite device having a volume of 0.32 mm or less, for example, 1.00 ⁇ 0.05 mm in length, 0.5 ⁇ 0.05 mm in width, and 0.5 ⁇ 0.05 mm in height.
- the composite device 100 has a protection against static electricity, leakage current blocking and high protection against static electricity despite having a varistor unit 110 and a capacitor unit 120 performing heterogeneous functions within a limited and very small volume as described above. It is implemented to simultaneously express capacitance.
- the varistor unit 110 is a conventional varistor type device, and has a low dielectric constant in material. While implementing the varistor characteristic, it is difficult to increase the dielectric constant to a predetermined value or more. Due to the low dielectric constant characteristic of the varistor element, attenuation occurs when the communication signal passes through the varistor element, thereby causing the varistor in the circuit through which the communication signal passes. It is difficult to use the device alone. In order to solve this, it is possible to consider using a device with varistor characteristics and a capacitor device to prevent attenuation of communication signals, and if the capacitance of the capacitor device is implemented at a high capacity, it is possible to compensate for the attenuation of the communication signal due to the varistor device. You can.
- a device is designed to include heterogeneous functions, that is, a capacitor characteristic and a varistor characteristic, from the beginning, and then a single desired size from the beginning through simultaneous firing.
- heterogeneous functions that is, a capacitor characteristic and a varistor characteristic
- a capacitor element and a varistor element are independently manufactured, and then two elements already manufactured are combined and integrated.
- the former method can simplify the manufacturing process, but it is not easy to find the conditions for simultaneous firing because the firing conditions are different due to the different material of the varistor element and the capacitor material.
- the co-firing condition is found, there is a problem in that material movement occurs between dissimilar materials at each boundary portion of the region performing the varistor function and the capacitor function, thereby deteriorating the electrical characteristics of each.
- the provided sheet layer occupies a significant volume in a limited volume space, and eventually a varistor element and / or a capacitor element The volume of must be reduced, and due to the reduced volume, it may be difficult to fully express desired properties.
- heterogeneous body materials have different thermal characteristics and may cause appearance abnormalities such as twisting, bending, and twisting during simultaneous firing.
- the composite device 100 combines the sintered varistor unit 110 and the capacitor unit 120 independently by using the latter method, thereby integrating and integrating the electrical characteristics of the electrical properties. , It can block the appearance problems.
- other properties for preventing physical property deterioration or property deterioration due to volume reduction of the varistor part 110 and the capacitor part 120 due to design changes such as additional sheet layers are added. Additional design changes can be avoided.
- an adhesive layer may be interposed to bond the sintered varistor portion 110 and the capacitor portion 120 independently, and specifically, an adhesive layer is formed on the upper surface of either the varistor portion or the capacitor portion, and then the other is It can be combined by stacking on top.
- the adhesive layer is formed by invading the side of the varistor or capacitor to deteriorate the appearance quality.
- the bonding layer is formed in an excessively small amount to prevent this, it may cause a decrease in bonding strength.
- the bonding layer formed in a small amount deeply forms the depth of the groove formed by the lower edge of the first body 110a of the varistor portion and the upper edge of the second body 120a of the capacitor portion, as shown in FIG. 3, Due to this, when external terminals are formed, external reliability and electrical reliability may be deteriorated. Specifically, when forming the external terminal 140 for electrically connecting the varistor electrode of the varistor unit 110 and the capacitor electrode of the capacitor unit 120, as shown in FIG. 4, the external terminal forming composition 140a is formed of a laminate. Capillary phenomenon due to the grooves C formed at both side ends may occur remarkably.
- the external terminal forming composition 140a moves along the groove to a length t exceeding the desired predetermined length s, and spreads, and the length exceeding the predetermined length s through firing or curing ( It may be implemented as an external terminal having a t), the possibility of conducting a pair of external terminals 140 increases, causing electrical reliability to deteriorate, and the appearance quality deteriorates as the external terminal spreads on the body. You can.
- the present invention has reached the manufacturing method described below while studying a composite device having a laminated structure in which all of the bonding reliability, appearance quality, and electrical reliability as described above are secured.
- the composite device 100 is (1) a varistor portion having a first body and a varistor electrode disposed inside the first body and having at least one end exposed on both sides of the first body, And a capacitor portion disposed inside the second body and the second body and having capacitor electrodes at least at both ends of which are exposed on both sides of the second body, (2) the varistor portion or the upper surface of the capacitor portion. Forming a temporary junction to cover 50 to 85% of the total area of the upper surface, (3) stacking the other one on the temporary junction of the varistor portion or the capacitor portion where the temporary junction is formed so that the electrode has the same exposure direction. Bonding, and (4) forming a pair of external terminals such that the varistor electrode and the capacitor electrode are electrically connected to both sides of the bonded varistor part and the electrode part exposed at the capacitor part. Is implemented including steps.
- the varistor unit 110 and the capacitor unit 120 are respectively prepared.
- the varistor unit 110 includes a first body 110a and varistor electrodes 112, 114, and 116, and has a leakage current blocking function and an electrostatic protection function.
- the composite element 100 is used as an element connecting a metal case, which is a human body contactable conductor of an electronic device including an area used as an antenna, and an internal circuit part, the static electricity flowing from the metal case passes and Leakage current may be blocked from being transmitted to the metal case.
- the first body 110a includes a varistor material, for example, Zr, Nb, Pr, Bi, Co. It may include at least one oxide and ZnO selected from the group consisting of Si, Cr, and Mn.
- the first body 110a may be integrally formed by stacking a plurality of varistor layers including a first varistor layer and a second varistor layer. That is, since the first varistor electrodes 112 and 114 or the second varistor electrodes 116 may be provided on different varistor layers or on both sides of the same varistor layer, the first varistor electrodes 112 and 114 and the second varistor electrodes ( Depending on the arrangement of 116), the varistor layer may be composed of a plurality. In this case, the first varistor layer and the second varistor layer may include varistor materials of the same type or different types, respectively.
- the first body 110a may have a curved surface by rounding the triple points and corners.
- the curved surface of the triple point and the edge is a first external electrode that can be further provided on the external terminal 140 or the varistor portion 110 "as shown in FIG. (142) It is possible to improve the thickness, it is also possible to prevent the spread of the plating layer that can be formed on the outer surface of the outer terminal 140, as described later, to reduce the defect due to damage to the outer terminal 140.
- the curved edge can relieve the body from being broken or damaged by an external force applied to the device.
- the varistor electrodes 112, 114, and 116 are spaced apart from the first varistor electrode in a stacking direction of a plurality of first varistor electrodes 112, 114 provided at regular intervals in the longitudinal direction of the electrode on one surface of the first varistor layer, and adjacent to the first varistor electrode.
- the first varistor electrode 112, 114 may include at least one second varistor electrode 116 formed on the other surface of the first varistor layer or one surface of the second varistor layer so as to correspond to the spaced apart portion. Specifically, when there are two first varistor electrodes 112 and 114 as shown in FIG. 5A, only one of the second varistor electrodes 116 may be disposed between the first varistor electrodes 112 and 114 on the cross section of the composite device 100.
- first varistor electrodes 112 and 114 and the second varistor electrode 116 are shown and described as being partially overlapped with each other, the present invention is not limited thereto, and may be disposed so as not to overlap each other.
- the distance between the first varistor electrodes 112 and 114 may be formed to be wider than the distance between the first varistor electrodes 112 and 114 and the second varistor electrodes 116. Accordingly, an incoming signal such as static electricity may be propagated in the order of the first varistor electrode 112, the second varistor electrode 116, and the first varistor electrode 114.
- the varistor unit 110 may be formed so that the gap between the pair of first varistor electrodes 112 and 114 and the second varistor electrode 116 and the particle diameter of the varistor material satisfy the breakdown voltage Vbr.
- the breakdown voltage (Vbr) of the varistor unit 110 is the respective breakdown between the first varistor electrode 112 and the second varistor electrode 116, between the second varistor electrode 116 and the first varistor electrode 114 It is the sum of voltages and may be greater than the rated voltage (Vin) of the external power source to block leakage currents from the external power source.
- the varistor unit 110 may turn on and pass static electricity because the voltage of the static electricity is greater than the breakdown voltage Vbr.
- Vbr breakdown voltage
- first varistor electrodes 112 and 114 may be disposed above and below the second varistor electrode 116. That is, the first varistor layer provided with the first varistor electrodes 112 and 114 and the second varistor layer provided with the second varistor electrode 116 may be alternately stacked alternately. Accordingly, since a plurality of paths of static electricity are provided in parallel, response characteristics to static electricity can be further improved.
- the first varistor electrodes 112 and 114 and the second varistor electrode 116 may include at least one of Ag, Pd, Pt, Au, Ni, and Cu.
- an electrode alloying at least one of the components listed above with Ag may be used.
- the varistor electrodes 112 and 114 may have a thickness of 1 to 10 ⁇ m, a width of 50 to 400 ⁇ m, and a length of 50 to 800 ⁇ m, but are not limited thereto.
- varistor electrodes 112 and 114 are exposed at both ends in the longitudinal direction of the first body 110a, and the ends of the exposed varistor electrodes 112 and 114 are respectively connected to a pair of external terminals 140 to be described later. It is electrically connected.
- the plurality of first varistor electrodes 112, 114, and 118 are arranged at predetermined intervals in the longitudinal direction of the electrodes so that the varistor parts 110 'according to another embodiment are vertically spaced to face each other.
- the second varistor electrode 116 may be disposed between the spaced apart first varistor electrodes 112, 114, 118 to correspond to the horizontally spaced portion between the first varistor electrodes 112, 114, 118.
- the number of varistor electrodes and the arrangement structure of the varistor parts that may be provided in the composite device of the present invention are not limited to FIGS. 5A and 5B.
- the varistor portion 110 ′′ has a first body (varistor electrodes 112 and 114) exposed to improve the reliability of conduction between the external terminal 140 and the varistor electrodes 112 and 114 ( 110a)
- a pair of first external electrodes 142 may be further provided on both sides.
- the capacitor unit 120 includes a second body 120a and capacitor electrodes 122 and 124.
- the capacitor electrodes 122 and 124 are exposed at least at both ends of the second body 120a in the lengthwise direction, and the ends of the exposed capacitor electrodes 122 and 124 are external to a pair described later.
- Each terminal 140 is electrically connected to each other.
- the capacitor unit 120 performs a function of transmitting communication signals for each band corresponding to a communication purpose without attenuation.
- the composite element 100 is used as an element that connects between a metal case that is a human body contactable conductor of an electronic device including an area used as an antenna and an internal circuit, a communication signal flowing from the metal case used as the antenna Through, the communication signal in the communication frequency band passes without attenuation, and at the same time, it is possible to improve the blocking capability of the DC component in the leakage current by the external power supply of the electronic device flowing from the ground of the internal circuit.
- the second body (120a) includes a dielectric, for example, at least one oxide selected from the group consisting of Ti, Si, Sr, Bi, W, and Nd and barium titanate (BaTiO 3 ) Can.
- the second body 120a is formed integrally by stacking a plurality of ceramic layers, and the capacitor electrodes 122 and 124 are formed on at least two ceramic layers so that a part of the electrodes between the adjacent electrodes in the stacking direction of the ceramic layers face each other. Respectively. That is, since one capacitor electrode is provided on one ceramic layer, a plurality of ceramic layers may be formed according to the number and arrangement of capacitor electrodes.
- the characteristics of the varistor unit 110 which is not easy to implement a large capacity of capacitance, can be supplemented to easily implement capacitance with various values while being large.
- the capacitor unit 120 excludes the influence with the varistor unit 110 to form a denser gap between the capacitor electrodes 122 and 124 that are stacked therein to increase the number of stacks of the capacitor electrodes 122 and 124.
- the body 120a may be made of a material having a high dielectric constant, so that high-capacity capacitance can be easily implemented.
- the capacitor unit 120 by implementing the capacitor unit 120 separately from the varistor unit 110, the degree of freedom in design for capacitance increases, so that a lineup of various capacities is possible without a separate process change, so that it can quickly respond to customer needs.
- communication signals for each band corresponding to a communication purpose can be transmitted without attenuation.
- the second body 120a may be a curved surface having a triple point and corners rounded.
- the triple points and corners that are curved surfaces may be further formed outside the body 120a, such as the external terminal 140 formed in step (4) described below at the point where the curvature is formed or the capacitor unit 120 'shown in FIG. 6B.
- the thickness of the second external electrode 144 can be improved.
- the curved edge can alleviate the body from being broken or damaged by an external force applied to the device.
- each of the capacitor electrodes 122 and 124 may be provided on different ceramic layers. That is, the capacitor unit 120 may be formed integrally by firing after sequentially stacking a plurality of ceramic layers provided with capacitor electrodes 122 and 124. At this time, different ceramic layers, each of which is provided with the first capacitor electrode 122 and the second capacitor electrode 124, may be alternately stacked symmetrically so that a part of the electrodes between the adjacent electrodes face each other.
- the capacitor unit 120 may have an insulation breakdown voltage Vcp greater than the rated voltage Vin of the external power supply. Accordingly, when the leakage current from the external power flows into the capacitor unit 120, the leakage current may be cut off to prevent electric shock of the user.
- the distance between the capacitor electrodes 122 and 124 may be 10 ⁇ m or more.
- the capacitor electrodes 122 and 124 sufficiently secure a gap therebetween, thereby realizing a capacitance suitable for wireless communication and increasing the breakdown voltage Vcp for blocking leakage current.
- the capacitor electrodes 122 and 124 may include at least one of Ag, Pd, Pt, Au, Ni, and Cu. As an example, since the capacitor electrodes 122 and 124 may deteriorate electrostatic (ESD) resistance when Ag alone is used, an alloy electrode in which at least one of the components listed above is alloyed with Ag may be used. In addition, the capacitor electrodes 122 and 124 may have a thickness of 1 to 10 ⁇ m, a width of 50 to 400 ⁇ m, and a length of 50 to 800 ⁇ m, but are not limited thereto.
- the prepared varistor unit 110 and the capacitor unit 120 may be provided with approximately the same thickness, but are not limited thereto, and the thickness may be provided differently depending on the application.
- the varistor unit 110 may be a capacitor. It may be thicker than the portion 120.
- the height of the varistor unit 110 is greater than or equal to the height of the capacitor unit 120 in order to protect the static electricity of the desired performance and to prevent leakage current. You can.
- the length and width of the varistor unit 110 and the capacitor unit 120 may be approximately the same and may be advantageous in order to facilitate alignment and secure adhesive strength after stacking elements through this, but is not limited thereto.
- a step of forming a provisional junction to cover 50 to 85% of the total area of the upper surface on the upper surface of the varistor portion or the capacitor portion is performed.
- the varistor unit 110 and the capacitor unit 120 may be combined by stacking one on top of the other. Accordingly, the provisional bonding portion may be formed on the upper surface of the varistor portion 110 or the capacitor portion 120, and the other one of which the provisional bonding portion is not formed may be stacked on the upper portion of the provisional bonding portion.
- the temporary junction is formed, that is, the element disposed in the lower portion of the stacked structure is not limited, but preferably, the composite element 100 is excellent in dielectric properties as shown in FIGS. 7 and 9 in consideration of reliability when soldering the circuit board.
- the capacitor parts 120 and 120 'made of may be disposed at the bottom, and in this case, the temporary bonding part 130a may be formed on the upper surface of the capacitor parts 120 and 120'.
- a provisional junction may be formed based on the total area of the upper surface of the device having a small area.
- the temporary bonding portion 130a is formed on the upper surfaces of the capacitors 120 and 120 ', but it is not limited thereto, and it is revealed that the varistors 110, 110' and 110 "may be formed on the upper surface.
- the provisional bonding portion 130a formed on the upper surface of the capacitor units 120 and 120 ' may cover the upper surface with an area of 50 to 85% of the total area of the upper surface, more Preferably, the upper surface may be covered with an area of 58 to 70%, thereby preventing degradation of bonding reliability, electrical reliability, and appearance quality that may occur in the bonding process through step (3) described later.
- the bonding force is significantly reduced, and the stacked varistor portions 110, 110', 110 "and the capacitor portions 120, 120 '
- the external terminal forming composition 140a for forming the external terminal during step (4) described later climbs the groove through the capillary phenomenon as shown in FIG. 4 to form an electrode.
- the electrical reliability may decrease due to an increase in the possibility that the pair of external terminals 140 conducts, and the appearance quality may deteriorate as the external terminals spread on the body.
- the appearance quality may also be deteriorated, and if the area where the provisional bonding part 130a is formed exceeds 90% of the area of the upper surface of the capacitor parts 120 and 120 ' The (130a) there is a possibility that flows to the side of the body decreases the appearance quality.
- the provisional joining portion 130a can achieve more improved joining reliability, electrical reliability, and appearance quality when the length and width are formed to have a predetermined range even when the above-described area conditions are satisfied.
- the length (l ') of the temporary joining portion 130a may be 50 to 95% with respect to the length of the upper surface (l), more preferably 70 to 95%, even more preferably 70 to 90% It may be, more preferably 77 to 90%.
- the width (w ') of the temporary bonding portion (130a) may be 50 to 90% with respect to the upper surface width (w), more preferably 70 to 90%, even more preferably 70 to 81% You can.
- the length (l ') of the temporary bonding portion (130a) is less than 50% relative to the length (l) of the upper surface, the adhesion of the varistor and capacitor parts may be deteriorated, poor appearance due to smearing of external electrodes, poor reliability, etc. In order to retain the adhesive strength, it may be formed in a relatively wide width, there is a fear of lowering the appearance quality. In addition, if the length exceeds 90%, the temporary junctions may flow to both sides of the body where the varistor electrode and the capacitor electrode are formed, thereby contaminating or covering the varistor electrode and / or the capacitor electrode, thereby deteriorating electrical reliability and deteriorating appearance quality. .
- the width may be relatively narrow, so that the adhesive strength may be lowered.
- the temporary junction also contaminates the external electrode. Electrical reliability may be deteriorated depending on the covering or covering.
- the width (w ') of the temporary joining portion (130a) is less than 50% of the upper surface width (w)
- the bonding strength is reduced, the depth of the groove formed on the side of the stacked varistor and capacitor portions is significantly
- the electrical reliability may be deteriorated due to excessive occurrence of the capillary phenomenon.
- a relatively long length may be formed to complement a width formed excessively short to express a certain level of adhesion, and in this case, a decrease in appearance quality may also be caused.
- the width (w ') of the temporary bonding portion (130a) is formed in excess of 90% with respect to the upper surface width (w), the temporary bonding portion may flow excessively in the width direction, thereby deteriorating the appearance quality.
- the width is excessively wide, the length may be relatively short, and in this case, there is a fear that the adhesive strength is also lowered.
- the thickness of the temporary bonding portion 130a may be formed of 15 to 60 ⁇ m, and more preferably 15 to 40 ⁇ m. If the thickness is less than 15 ⁇ m, there is a fear of lowering the bonding strength, and if it exceeds 60 ⁇ m, there is a fear that the temporary joining portion excessively flows to the side of the device during the provisional joining and / or joining process, thereby lowering electrical reliability and deteriorating appearance quality. have.
- the temporary bonding unit 130a may form a temporary bonding unit 130a by processing a bonding composition on the upper surface of the capacitor 120 by a screen or a dispensing method in an aligned state using an SMT facility or a jig.
- the drying process for the solvent contained in the bonding composition processed in the process of forming the provisional bonding part 130a may be performed, and the drying process may be left at room temperature for a certain period of time, or curing may not occur or the B-stage state It can be dried by applying heat to the extent that partial curing occurs.
- the bonding composition may have a known composition such that the final implemented bonding part 130 may be a polymer bonding part formed by curing an organic compound or a glassy bonding part having a glass component fired.
- the varistor 110 when the final implemented junction 130 is a polymer junction, the varistor 110 is implemented with a thinner thickness so that the volume occupied by the junction 130 in the composite device 100 in a limited volume space is small. And the capacitor unit 120 may exhibit excellent bonding strength. In addition, it can be easily cured through a relatively low temperature or light of 250 ° C. or less, so that it is easy to form, and the heat applied for bonding is relatively low, thereby preventing damage or deformation of the varistor 110 and / or capacitor 120. Can be prevented.
- the polymer junction may preferably have an insulation resistance of 10 kV or more, and an insulation breakdown strength of 20 kV / mm or more to prevent insulation breakdown by high voltage ESD.
- the polymer bonding portion may be formed by crosslinking a known organic compound such as an epoxy-based, urethane-based, acrylic-based, or ester-based curing agent through a curing agent, and the specific type thereof is not particularly limited in the present invention.
- a bonding composition including an epoxy component, a curing agent, a glass filler, and a solvent may be cured to form a polymer junction.
- the epoxy component may be a known one, but preferably to form a cured body having a non-conductive, heat-resistant property to electrically and thermally separate the varistor portion 110 and the capacitor portion 120 as described above. It can be a component capable of generating a large amount of thixotropy during application, less thixotropy after application, less aging change, excellent storage stability, less shrinkage during curing, and less gas.
- the curing agent can be used with a known epoxy so that the joint is cured together with the selected epoxy component to exhibit non-conductive, heat-resistant properties, according to the specific type and content can be determined according to the type of the specifically selected epoxy component
- the invention is not particularly limited.
- the glass filler is provided to improve the bonding strength of the varistor portion 110 and the capacitor portion 120, and to improve the flowability of the bonding composition, preferably 20 to 65 weight of the total weight of the bonding portion 130 %, More preferably 40 to 55% by weight, it is good to be provided in the bonding composition. If the glass filler is provided at less than 20% by weight of the total weight of the final joint 130, there is a problem that the bonding strength is lowered and the uniformity of the coating film may be difficult due to poor flowability.
- the glass filler is provided in excess of 65% by weight, the desired effect, such as a decrease in the content of the epoxy component can not express the desired bonding strength, it may be difficult to control the coating film of the bonding composition due to excessive flowability It can be difficult to achieve.
- the glass filler may be a known one, for example, aluminum, silicon, germanium, indium, tin, lead, phosphorus, boron, gallium, lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium , Neodymium, praseodymium, erbium, cerium, titanium, zirconium, tantalum, zinc, tungsten, vanadium, chromium, manganese, iron, cobalt, nickel, copper and molybdenum, or one or more elements, or a compound containing them, More preferably, it may be zinc, silicon, boron and manganese, or one or more elements selected from zinc, silicon, boron and aluminum, or a compound containing one or more of them, and may be, for example, silicon dioxide.
- the glass filler may be included in the composition in the form of granules, and in this case, the average particle diameter of the glass filler may be 0.1 to 10 ⁇ m, thereby improving dispersibility, and the first body 110a and the second body 120a. ) Can exhibit improved adhesion in all areas of contact with
- the bonding composition may further include a pigment to improve workability, and may be, for example, MnFe 2 O 4 , and may be provided at 5 to 15% by weight of the total weight of the bonding portion, but is not limited thereto.
- the content may be changed depending on the type of pigment included.
- the bonding composition may further include a known additive such as a curing accelerator, thixotropic agent, leveling agent, dispersant, and the present invention is not particularly limited.
- the final bonding part 130 is a glassy bonding part
- a temporary bonding part formed of a bonding composition containing a glass component is fired to form a bonding part, and in this process, the first body 110a and the second body 120a are joined.
- the vitreous junction part is implemented with a glass component having a calcination temperature higher than the calcination temperature or the calcination temperature of the external terminal 140 having a calcination temperature, as compared to the above-described polymer junction part.
- the varistor 110 and the capacitor unit are fused by melting or softening the glassy junction part or all by heat applied during the formation of the external terminal. Any one or more distortions of the top, bottom, left, and right of (120) may occur, and it may be difficult to express desired effects, such as deteriorating product reliability.
- the glass component may include one or more selected from the group consisting of SiO 2 , B 2 O 3 , BaO, CaO, Na 2 O, ZnO, Al 2 O 3 and PbO, but is not limited thereto. In addition, the glass component may be appropriately selected in consideration of the curing or firing temperature of the external terminal.
- a step (3) according to the present invention a step of forming a junction after stacking the other one on the provisional junction provided on the upper surface of the varistor portion or the capacitor portion so that the electrode has the same exposure direction is formed.
- the varistor 110 is stacked on the temporary junction 130a, and at this time, the varistor 110 And the capacitor unit 120 are stacked such that the varistor electrode 112 and the capacitor electrode 122 have the same exposure direction as illustrated in FIG. 3.
- the varistor electrode 112 and the capacitor electrode 122 can be simultaneously and electrically connected in parallel through a single external terminal 140, and at the same time, defects such as distortion of the varistor unit 110 and the capacitor unit 120 are prevented. There is an advantage to do.
- the varistor unit 110 may be laminated after being stacked on the upper portion of the capacitor unit 120 using an SMT facility or a jig. At this time, the alignment tolerance between the varistor unit 110 and the capacitor unit 120 may be laminated and bonded to be 50 ⁇ m or less.
- the varistor unit 110 and the capacitor unit 120 may be sufficiently in close contact with each other so that no bubbles or cavities are generated therein while the temporary bonding unit 130a is cured into the bonding unit 130.
- the temporary bonding unit 130a may be cured through heat or light depending on the type of the bonding composition to form the bonding unit 130. For example, in the case of a thermosetting bonding composition, heat may be applied at 70 to 250 ° C. It does not work.
- the varistor electrode (112,114) and the capacitor electrode (122,124) is electrically connected to both sides where the electrodes (112, 114, 122, 124) are exposed from the bonded varistor unit (110) and the capacitor unit (120).
- a step of forming a pair of external terminals 140 is performed.
- the external terminal 140 is an electrode for electrically connecting the varistor unit 110 and the capacitor unit 120 in parallel, and soldering the composite device 100 to the circuit board.
- the varistor unit 110 and the capacitor unit 120 are selectively operated with respect to static electricity, leakage current of external power, and communication signals through the external terminal 140, thereby protecting static electricity, preventing electric shock, and transmitting communication signals. Can be done.
- the external terminal 140 has a stacked varistor unit 110 and a capacitor unit (to increase the bonding force between the first body 110a and the second body 120a, and to improve the electrical connection and bonding strength with the outside of the circuit, etc.) 120) may be provided to cover the front end and the rear end of the 120, and both side ends respectively connected to the front end and the rear end by a predetermined length (w in FIG. 1).
- the external terminal 140 may be formed of a known conductive metal.
- the external terminal 140 is a plastic-type terminal formed by firing after being disposed on both sides of the varistor unit 110 and the capacitor unit 120 in a state where the conductive metal is mixed with the binder component, or the conductive metal is mixed with the binder component It may be a cured terminal formed by curing in the state.
- the external terminal 140 is formed in a condition that does not affect the junction 130 in consideration of the physical and chemical characteristics of the varistor 110 and the capacitor 120 bonded through the junction 130 desirable.
- the bonding unit 130 may be a polymer bonding unit due to various advantages as described above.
- the polymer bonding unit is a polymer bonding unit 130 according to difficulty in expressing heat resistance capable of fully withstanding at a temperature of 400 ° C. or higher.
- the external terminal 140 is very preferably configured as a hardening-type terminal that may not thermally deform or damage the bonding portion 130.
- the capacitor part and the varistor part are distorted during the firing process as the joint part containing the polymer is partially thermally decomposed or damaged or softened / melted in the firing process of the external terminal proceeding at a temperature of 500 ° C or higher, It may lead to deterioration of the physical properties of the joint, such as the adhesive strength may be lowered.
- the external terminal 140 may be a curing type terminal formed by thermally curing an electrode paste containing a conductive epoxy component and a conductive metal in an amount of 50 to 90% by weight, wherein the electrode paste is thermally cured.
- the heat curing temperature of the electrode paste is performed at a temperature lower than the 5% weight loss temperature of the junction 130, thereby preventing the deterioration of the physical properties of the junction. If the heat curing temperature of the electrode paste is performed at a temperature exceeding the 5% weight loss temperature of the junction, there is a concern that physical properties of the junction, peeling of the interface, cracks in the junction, etc. may occur.
- the bonding part 130 is a glassy bonding part
- the external terminal 140 can be cured or fired at a temperature condition lower than the firing temperature of the glassy bonding part, either a hardening external terminal or a plasticizing external terminal may be used.
- the external terminal 140 when the external terminal 140 is formed as a hardened external terminal, it is possible to compensate for bonding defects that may occur between the varistor unit 110 and the capacitor unit 120, and can be implemented in a dipping method, so the process is simple. There is an advantage that can form the external terminal 140 at a low cost. Alternatively, when the external terminal 140 is formed as a plastic external terminal, there is an advantage in improving electrical connection reliability between each of the varistor electrodes 112 and 114 and the capacitor electrodes 122 and 124 and the external terminal 140.
- the external terminal 140 may be implemented through a liquid electrode paste irrespective of whether the forming type is hardened or plasticized.
- the external terminal 140 is a hardening type terminal
- it is a known hardening type terminal formation composition capable of forming a terminal in a hardening type.
- the process conditions for forming the terminal are hardening type terminal formation compositions that do not cause damage or deformation of the joint. Can be used without restrictions.
- the curable terminal forming composition may include a conductive metal component, a curable binder component, a curing agent, and a solvent, and may further include other binder components or additives.
- the conductive metal component is Ag, Au, Cu, Pt, Sn, Ni, Al, W, Mo, Sb, Cr, Pb, a mixture containing two or more selected from the group consisting of Ti or a mixture of two or more thereof It may be an alloy, for example silver.
- the conductive metal component may be 70 to 85% by weight or more in the curable terminal forming composition.
- the curable binder component may be a known monomer, oligomer and / or polymer resin having a functional group that can be cured, such as acrylic, epoxy, or urethane, and preferably does not inhibit the conductivity of the conductive metal component after curing. It may be conductive or may be a component that realizes low resistance.
- An example of the curable binder component may be an epoxy-based component having a glycidyl group, specifically, a bisphenol A-based resin or a cresol novolac-based resin.
- the curing agent may use a known one to be cured together with the selected curable binder component, the present invention is not particularly limited as the specific type and content can be determined according to the type of the specifically selected curable binder component. .
- the solvent may use a known solvent
- the type and content of the present invention is not particularly limited as it depends on the specific curable binder component or the type and content of the curing agent, for example diethylene glycol monobutyl Ether.
- the above-described curable terminal forming composition may be cured through a known curing method such as heat or light, and may be cured through, for example, a thermal curing method.
- the external terminal 140 formed of the curable terminal forming composition may have, for example, a resistance of 10 ⁇ / mm or less.
- the external terminal 140 is a plastic-type terminal
- a known plastic-type terminal-forming composition capable of forming a terminal in a plastic type may be used.
- a conductive metal component and a glass component may be included, and as the material compatibility with the body increases through the glass component, adhesion strength may be improved to further secure electrical connection reliability and durability.
- the conductive metal component may include one or more selected from the group consisting of Ag, Au, Cu, Ni, Pd and Pt.
- the conductive metal component may be included in the composition in a granular form, and the average particle diameter of the conductive metal component may be 0.1 to 10 ⁇ m.
- the glass component is aluminum, silicon, germanium, indium, tin, lead, phosphorus, boron, gallium, lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, neodymium, praseodymium, erbium, It may contain one or more elements selected from cerium, titanium, zirconium, tantalum, zinc, tungsten, vanadium, chromium, manganese, iron, cobalt, nickel, copper and molybdenum, more preferably zinc, silicon, boron and manganese. Or zinc, silicon, boron and aluminum. At this time, the content of each element may be included 5 to 20% by weight in the firing electrode composition based on the oxide.
- the glass component may be included in the composition in the form of granules, and in this case, the average particle diameter of the glass component may be 0.1 to 10 ⁇ m, thereby improving dispersibility, through which all regions in contact with the bodies 110a and 120a It is possible to improve the adhesion of the external terminal 140 at.
- the sintered terminal forming composition may further include a solvent and a binder component in addition to the conductive metal component and glass component.
- the binder component may be used without limitation in the case of a conventional binder used to prepare an electrode, and as a non-limiting example, polyvinylbutyral resin, polyvinylacetate resin, ethyl cellulose, Nitrocellulose and polyacrylic resins, and the like.
- the solvent can be used without limitation in the case of a conventional water or organic solvent that does not have a problem in dissolving additives such as a binder component or other dispersant without affecting the above-mentioned conductive metal component and glass component.
- butoxyethoxyethyl acetate ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monobutyl ether, propylene glycol monoethyl ether (propylene) glycol monomethyl ether), diethylene glycol methyl ether, glycerol, diethylene glycol ethyl ether acetate, terpineol, menthol, Diethylene glycol methyl ethyl ether (MEDG) and butyl diglycol (BDG) may be used alone or in combination.
- EMG diethylene glycol methyl ethyl ether
- BDG butyl diglycol
- the plastic component may include 5 to 20 parts by weight of the glass component, 1 to 10 parts by weight of the binder component, and 5 to 20 parts by weight of the solvent relative to 100 parts by weight of the conductive component. If the glass component is contained in less than 5 parts by weight with respect to the conductive metal component, the adhesive strength between the desired external terminal and the body may not be expressed, and if the glass component is contained in excess of 20 parts by weight with respect to the conductive metal component When the external terminal and the varistor electrode / capacitor electrode are in contact, there is a fear of electrical contact failure as the glass component is dissolved and acts as an obstacle on the contact surface.
- the viscosity of the plastic terminal forming composition may be 10 to 60 Kcps when measured based on Brook Field HBDV-1 SC4-14, 10 RPM. If the viscosity range is unsatisfactory, it may not be easy to form an external terminal with a desired thickness, and the dispersibility of each component in the composition may be weak, thereby reducing the mechanical strength of the manufactured external terminal, adhesion to the body, and the like. There is a problem.
- the external terminal 140 formed of the plastic terminal forming composition may have, for example, a resistance of 1 ⁇ / mm or less.
- the external terminal 140 may be implemented by processing both sides of the stacked varistor unit 110 and the capacitor unit 120 to cover the external terminal forming composition 140a.
- the method for treating the curable terminal forming composition 140a for this may be through a variety of known methods, but the body is placed in the water tank 180 containing the external terminal forming composition 140a as shown in FIG. 4 in terms of process ease and manufacturing cost reduction. A dipping method to partially support can be used.
- the processed external terminal forming composition 140a may be realized as an external terminal after curing through heat and / or light.
- the plastic external terminal may be changed according to the type of the conductive metal component, but may be implemented as an external terminal by applying heat of 500 ° C or higher.
- the composite device 100 implemented through the step (4) is the external terminal 140 when the external terminal 140 is mounted on the circuit board in a manner such as flow soldering, the external terminal 140 to further improve the ease of soldering, electrical connectivity ) May further perform a process of forming a plating layer on the outer surface.
- the plating layer may be formed using a conventional plating method, and may include metals or alloys such as nickel, tin, copper, and tin lead. In this case, when two or more types of metals are included, two or more types of metals may be mixed in one layer, or these metals may be included as an alloy. Alternatively, two or more kinds of metals may be formed of a plurality of plating layers by forming plating layers, respectively.
- the thickness of the plating layer may be 0.1 ⁇ 5 ⁇ m, but is not limited thereto.
- the varistor unit 110 "prepared in step (1) described above and the external terminal 140 formed in step (4)
- the pair of first external electrodes 142 may be further provided on both sides of the first body 110a where the varistor electrodes 112 and 114 are exposed.
- the capacitor unit 120 ' also has a pair of second external electrodes on both sides of the second body 120a where the capacitor electrodes 122 and 124 are exposed to improve the reliability of conduction between the external terminal 140 and the capacitor electrodes 122 and 124. It may be further provided with (144).
- a pair of first external electrodes 142 are provided on both sides of the first body 110a where the ends of the varistor electrodes 112 and 114 are exposed, and the second body 120a where the ends of the capacitor electrodes 122 and 124 are exposed.
- a pair of second external electrodes 144 may be provided on both sides.
- the external terminal 140 may be provided to cover at least a portion of the outer surfaces of each of the first external electrode 142 and the second external electrode 144.
- the external terminal 140 directly contacts the varistor electrode and the capacitor electrode to be electrically connected.
- the varistor electrodes 112, 114 or the capacitor electrodes 122,124 May be exposed on both sides of the first body 110a and the second body 120a, or the ends may protrude to a relatively small length, and in addition, the thickness of the varistor electrodes 112 and 114 or the capacitor electrodes 122 and 124. Because the and width is very small, the contact area between the electrode and the external terminal 140 is small and close to the line contact. Due to this, the contact resistance between the electrode and the external terminal 140 may be large, and electrical characteristics may not be smoothly expressed.
- the external terminal 140 is preferably implemented as a curable terminal to prevent damage and deformation due to heat of the junction 130, and the curable terminal uses the same conductive metal component.
- the electrical reliability is lower than that of a plastic-type terminal, and as a result, contact resistance may be further increased compared to a plastic-type terminal.
- Such an increase in contact resistance is due to the fact that the electrical characteristics of the composite device 100 are not properly expressed, or that ESD introduced into the composite device 100 does not flow into the device, and the external terminal 140 or the external terminal 140 may not be used. It may be a cause of problems such as arc generation in the varistor electrodes 112 and 114.
- the first external electrode 142 and / or the second external electrode 144 can solve this problem.
- the first external electrode 142 and the second external electrode 144 are implemented as plastic electrodes. When doing so, there is an advantage that the contact resistance between the varistor electrodes 112 and 114 and the capacitor electrodes 122 and 124 and the external electrodes 142 and 144 can be further reduced.
- the contact resistance can be lowered by increasing the contact area, thereby introducing the composite element 100 '.
- the ESD or leakage current is transferred to the varistor unit 110 ", and it may be advantageous to fully express desired electrical characteristics, and further improve product reliability.
- the first external electrode 142 and the second external electrode 144 are, for example, 10 to 30 ⁇ m thick, and the width is a body 110a in which the varistor electrodes 112 and 114 and the capacitor electrodes 122 and 124 are exposed or projected. 120a) It may be formed to be larger than the thickness of the external electrodes 142 and 144 formed than the width of the body, but is not limited thereto, and may be changed according to the size of the body, the width of the varistor electrodes 112 and 114, and the width of the capacitor electrodes 122 and 124. You can.
- the first external electrode 142 and the second external electrode 144 may be manufactured by treating the external electrode forming composition on the exposed surfaces of the first body 110a and the second body 120a, respectively, and then sintering them.
- the external electrode forming composition may include, for example, a conductive metal component and a glass component, and through the glass component, electrical connection reliability and durability are further secured by improving adhesion strength according to an increase in material compatibility with the body. You can.
- the external electrode forming composition may use the same composition as the sintered terminal forming composition for forming the external terminal described above, so that the detailed description of the present invention is omitted.
- a glass coating layer (not shown) may be further formed on outer surfaces of the first body 110a and the second body 120a that come into contact with the first outer electrode 142 and the second outer electrode 144. , Preferably it may be formed on the front surface of the body (110a, 110b) exposed to the outside.
- the glass coating layer prevents interlayer peeling in the first body 110a or the second body 120a, which may be formed by stacking a plurality of varistor layers or ceramic layers, thereby improving mechanical strength of the body and simultaneously with external electrodes.
- the adhesion between the bodies can be further improved.
- foreign substances are removed from the soldered area to prevent the surface corrosion of the composite device or the penetration of the solvent into the body due to a solvent (for example, flux) processed to improve lead wettability.
- the glass coating layer may have a thickness of 0.5 to 10 ⁇ m, and if the thickness is less than 0.5 ⁇ m, the effect of improving adhesion with a desired external electrode may be insignificant, and a plating solution, a foreign substance removing solvent such as Flux, etc. may penetrate into the body. It can be difficult to act as a barrier to prevent this from happening. In addition, if the thickness of the glass coating layer exceeds 10 ⁇ m, the electrical conduction reliability between the external electrode and the varistor electrode / capacitor electrode is deteriorated, so that the electrical characteristics of the device may not be fully exhibited.
- the capacitor portion 120 ′ having the varistor portion 110 ′′ on which the first external electrode 142 is formed or the second external electrode 144 is formed, as shown in FIG. 9, the capacitor portion ( 120 ')
- the temporary joining portion 130a may be formed to have an area according to the present invention on the upper portion, and the description thereof is the same as the description in step (2) described above, and will be omitted below.
- the bonding portion 130 or the external terminal 140 must be stabilized at a temperature of 300 ° C. or less when the curing process is completed, and through this, the bonding portion is also applied to heat applied in the SMT operation ( 130) or the external terminal 140 may be advantageous to fully express the original function without thermal deformation or damage.
- the bonding strength of the varistor parts 110 and 110 "and the capacitor parts 120 and 120 'in the composite device 100 and 100' may be greater than or equal to 1 kgf of shear strength, and the electrode strength of the outer terminal 140 may be greater than or equal to 0.8 kgf. have.
- the area of the junction part 130 in the composite device 100,100 'implemented by satisfying the area of the provisional junction part 130a according to the present invention is 55 of the area of the upper surface of the varistor part 110,100 "or the capacitor part 120,120'. It may be ⁇ 93%, preferably 65 ⁇ 78%.
- the length of the junction 130 is 55 to 99%, more preferably 75 to 99%, even more preferably 75 of the length of the upper surface of the varistor portion 110,100 "or the capacitor portion 120,120 ' It may be ⁇ 93%, more preferably 82 ⁇ 93%
- the width of the junction part 130 is 55 to 95% of the width of the upper surface of the varistor part (110,100 ") or the capacitor part (120,120 '), more preferably It may be 75 to 95%, more preferably 75 to 87%.
- the average thickness of the junction 130 may be 7 to 40 ⁇ m, more preferably 13 to 30 ⁇ m.
- the composite element 100, 100 'implemented to satisfy the area, preferably length, width, and / or thickness conditions of the above-described bonding portion 130 is formed by satisfying the appropriate conditions of the provisional bonding portion according to the present invention. It may be implemented such that the bonding reliability, electrical reliability, and appearance quality are superior to the composite device in which the bonding portion is formed to be out of range.
- the varistor parts 110, 110 ', 110 "and the capacitor parts 120, 120' made of dissimilar materials are independently sintered and implemented as a single chip, thereby improving the frequency characteristics due to electrostatic response characteristics and high-capacitance capacitance. Can be improved.
- the composite device 100, 100 'of the present invention has characteristics similar to the varistor type in terms of voltage-current characteristics and electrostatic (ESD) characteristics, and thus has superior characteristics compared to the suppressor type and frequency characteristics. It has characteristics similar to the suppressor type, which is easy to implement high-capacitance in, and has a wide-band characteristic compared to a varistor type.
- ESD electrostatic
- the composite devices 100 and 100 'of the present invention can provide both an electrostatic protection function, a leakage current blocking function, and a wireless communication function.
- the composite elements 100 and 100 ' may be arranged in a portable electronic device to electrically connect a conductor 12, such as an external metal case, and a circuit portion 14, as illustrated in FIG. 11.
- the composite elements 100 and 100 ' may be directly connected to the ground of the circuit unit 14 and bypass the static electricity introduced by the turn-on of the varistor units 110 and 110' to the circuit unit without transferring it to the circuit unit.
- the portable electronic device may discharge static electricity.
- a separate protection element for bypassing to ground may be provided.
- the protection element may be a suppressor or a varistor made of a single element.
- the composite elements 100 and 100 ' may pass static electricity by turning on the varistor parts 110 and 110'. That is, since the breakdown voltage Vbr of the composite elements 100 and 100 'is less than the instantaneous voltage of static electricity, it can be electrically conductive to pass static electricity. As a result, the composite elements 100 and 100 'have low electrical resistance when static electricity flows from the conductor 12, and thus can pass static electricity without breaking itself.
- the composite element 100,100 when the leakage current of external power flows into the conductor 12 through the circuit board of the circuit unit 14, for example, ground, the composite element 100,100 'has a breakdown voltage Vbr due to the leakage current. Because it is large compared to the overvoltage, it can be kept open. In other words, the composite elements 100 and 100 'have their breakdown voltage Vbr greater than the rated voltage of the external power of the portable electronic device, so they are not electrically conducting and remain open so that they can be in contact with a human body such as a metal case 12 ) To prevent the leakage current from being transmitted.
- the capacitor unit 120 provided in the composite elements 100 and 100 ' can block the DC component included in the leakage current, and also, because the AC component of the leakage current has a relatively low frequency compared to the wireless communication band, Leakage current can be blocked by acting as a large impedance for the frequency.
- the composite elements 100 and 100 ' can protect the user from electric shock by blocking the leakage current caused by external power flowing from the ground of the circuit unit 14.
- the composite elements 100 and 100 ' may pass a communication signal flowing through the conductor through the capacitor units 120 and 120' when the conductor is a part of the antenna.
- the varistor parts 110 and 110 are turned off so that the composite elements 100 and 100 'may function as capacitors.
- the portable electronic device may be in the form of a portable electronic device that is portable and easy to carry.
- the portable electronic device may be a portable terminal such as a smart phone or a cellular phone, and may be a smart watch, digital camera, DMB, e-book, netbook, tablet PC, or portable computer.
- These electronic devices can have any suitable electronic components, including antenna structures for communication with external devices.
- it may be a device using short-range network communication such as Wi-Fi and Bluetooth.
- the portable electronic device 10 is an outer housing made of conductive materials such as metal (aluminum, stainless steel, etc.), or carbon-fiber composite materials or other fiber-based composites, glass, ceramic, plastic, and combinations thereof. It may include.
- the housing of the portable electronic device 10 may be made of metal and include a conductor 12 exposed to the outside.
- the conductor 12 may include at least one of an antenna, a metal case, and conductive ornaments for communication between the electronic device and an external device.
- the metal case may be provided to partially or entirely surround the side of the housing of the portable electronic device 10.
- the metal case may be provided to surround a camera provided to be exposed to the outside on the front or rear of the housing of the electronic device.
- the composite elements 100 and 100 ′ may be appropriately provided according to the number of metal cases provided in the housing of the portable electronic device 10.
- each of the metal cases 12a, 12b, 12c, and 12d is a housing of the portable electronic device 10 so that the composite elements 100 and 100 'are individually connected. Can be built in.
- each of the parts 12a, 12b, 12c, and 12d is a composite device 100,100 ' By being connected to it can protect the circuit inside the portable electronic device 10 from leakage current and static electricity.
- the composite elements 100 and 100 ' may be provided in various ways according to the corresponding roles of the metal cases 12a, 12b, 12c, and 12d. have.
- the composite elements 100 and 100 ' when a camera exposed to the outside of the housing of the portable electronic device 10 is provided, when the composite elements 100 and 100 'are applied to the conductor 12d surrounding the camera, the composite elements 100 and 100' ) May be provided in a form of blocking the leakage current and protecting the internal circuit from static electricity.
- the composite elements 100 and 100 ' may be connected to the metal case 12b to block leakage current and protect internal circuits from static electricity. .
- the composite elements 100 and 100 ′ may connect between the metal case 12 ′ and the circuit board 14 ′.
- the circuit board 14' may include a separate protection element 16 for bypassing static electricity to ground.
- the protection element 16 may be a suppressor or a varistor.
- the composite elements 100 and 100 ' may be disposed through a matching circuit (for example, R and L components) between the metal case 12' and the front end module (FFM) 14a. have.
- the metal case 12 ' may be an antenna.
- the composite elements 100 and 100 ' pass communication signals without attenuation and pass static electricity from the metal case 12' and block leakage current flowing from the ground through the matching circuit.
- the composite elements 100 and 100 ′ may be disposed between a metal case 12 ′ equipped with an antenna and an IC 14c that implements a communication function through the corresponding antenna.
- the corresponding communication function may be NFC communication.
- a separate protective element 16 for bypassing static electricity to ground may be provided.
- the protection element 16 may be a suppressor or a varistor.
- the composite elements 100 and 100 ′ may be disposed between a short pin 22 and a matching circuit of a PIFA (Planar Inverted F Antenna) antenna 20.
- PIFA Planar Inverted F Antenna
- the conductor 12 may include a tip portion protruding outward from the conductive case.
- the conductor may include a side key.
- the tip portion may include an insertion port of a connector for connection with an external device, for example, one end of an insertion port of a connector into which an earphone, a charging cable, a data cable, and the like are inserted.
- the composite device 100,100 ' according to an embodiment of the present invention has a high response characteristic to electrostatic discharge (ESD) when connecting a circuit portion and a protruding portion or a pointed shape with a high possibility of inflow of static electricity.
- High capacity capacitance can be implemented at the same time.
- a capacitor portion having a structure as shown in FIG. 6B having a length, width, and height of 0.94 mm, 0.47 mm, and 0.23 mm, respectively, and a varistor portion having a structure as shown in FIG. 5C having 0.94 mm, 0.47 mm, and 0.25 mm were prepared.
- a temporary bonding portion was formed to cover the upper surface of the capacitor by 63.38% of the total area of the upper surface of the capacitor portion by screen-printing the bonding composition containing the main resin, an epoxy resin, and a curing agent, as shown in FIG.
- the length was 0.8 mm, 85.1% of the total length of the upper surface of the capacitor portion, and the width of the temporary junction was 0.35 mm, and 74.5% of the total width of the upper surface of the capacitor portion, and the thickness was 30 ⁇ m.
- the varistor portion is stacked so that the alignment tolerance is within 50 ⁇ m using a jig on the upper portion of the capacitor portion where the temporary junction portion is formed, and then heat is applied at 200 ° C. to harden the temporary junction, thereby bonding the junction. Formed.
- external terminals were respectively formed on both sides of the electrode exposed in the stacked capacitor portion and the varistor portion, and specifically, one side of the electrode exposed to the electrode paste containing Ag, which is a conductive metal at 76% by weight, was dipping. After that, a pair of external terminals having a thickness of 20 ⁇ m was formed by heat treatment at a temperature of 200 ° C. Through this, the composite device as shown in Table 1 was implemented, and the final implemented composite device had a volume of 0.25 mm with a length of 1.00 mm, a width of 0.5 mm, and a height of 0.5 mm.
- Example 2 It was carried out in the same manner as in Example 1, but as shown in Table 1, the composite device as shown in Table 1 was implemented by changing the area, the length, and / or the width of the temporary bonding portion covering the upper surface of the capacitor portion.
- Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Temporary junction Length (mm) 0.80 0.80 0.70 0.85 0.80 0.76 0.89 0.92 0.88 0.85 0.55 Width (mm) 0.35 0.3 0.4 0.37 0.38 0.34 0.42 0.42 0.44 0.25 0.38 Thickness ( ⁇ m) 30 32 25 30 30 30 0.37 30 30 30 30 30 30 Area (mm2) 0.28 0.24 0.28 0.31 0.30 0.26 0.3 0.39 0.39 0.21 0.21 % L 85.11 85.11 74.47 90.43 85.11 80.85 94.68 97.87 93.62 97.87 90.43 % W 74.47 63.83 85.11 78.70 80.85 72.34 89.36 89.36 93.62 53.19 80.85 % S 63.38 54.32 63.38 71.19 68.81 58.49 84.60 87.46
- Examples 1, 2, 5, and 6, in which the temporary joining area satisfies the preferred temporary joining area according to the present invention, are excellent in appearance quality, reliability, and adhesive strength in all properties simultaneously.
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Abstract
A method for producing a composite device is provided. A method for producing a composite device according to one embodiment of the present invention comprises the steps of: 1) preparing, respectively, a varistor unit having a first body and a varistor electrode disposed inside the first body, the varistor electrode having at least the ends exposed at both sides of the first body, and a capacitor unit having a second body and a capacitor electrode disposed inside the second body, the capacitator electrode having at least the ends exposed at both sides of the second body; 2) forming a provisional junction portion on the upper surface of the varistor unit or the capacitor unit to cover 50-85% of the total area of the upper surface; 3) laminating and joining the remaining varistor unit or the capacitor unit on the varistor unit or the capacitor unit on which the provisional junction portion is formed such that exposure directions of the electrodes are the same; and 4) forming a pair of external terminals such that the varistor electrode and the capacitor electrode are electrically connected at both sides where the electrodes are exposed at the joined varistor unit and capacitor unit. Due to this, despite the combination of the varistor and the capacitor into a single device, the response characteristics against static electricity are excellent, high capacitance can be realized, thereby improving product reliability, deterioration in external appearance quality that may occur in the combination process into a single device can be prevented, and a realized product can express excellent bonding strength.
Description
본 발명은 복합소자에 관한 것으로, 더욱 상세하게는 복합소자 제조방법 및 이로 구현된 복합소자에 관한 것이다. The present invention relates to a composite device, and more particularly, to a method for manufacturing a composite device and a composite device implemented therein.
최근의 휴대용 전자장치는 심미성과 견고함을 향상시키기 위해 메탈 재질의 외장 하우징의 채택이 증가하고 있는 추세이다. 2. Description of the Related Art In recent years, in order to improve aesthetics and robustness, portable electronic devices are increasingly adopting metal housings.
그러나, 이러한 메탈 하우징은 재질의 특성상 전기전도도가 높기 때문에, 특정 소자를 통하여 또는 기기의 내부 설계에 기인해 메탈 하우징과 내장 회로부 사이에 전기적 경로가 형성될 수 있다. 특히, 메탈 하우징과 내장 회로부가 루프를 형성함에 따라서 외부 노출면적이 큰 메탈 하우징을 통하여 순간적으로 높은 전압을 갖는 정전기가 유입되는 경우, IC 등의 회로부를 파손시킬 수 있다. 또한, AC 전원에 의해 발생되는 누설전류가 내장 회로부의 접지부를 따라 메탈 하우징으로 흘러 나갈 수 있는데, 이 경우 사용자에게 불쾌감을 주거나 심한 경우 사용자에게 상해를 입힐 수 있는 감전 사고를 초래하기 때문에 이에 대한 대책이 요구되고 있다. However, since the metal housing has high electrical conductivity due to the nature of the material, an electrical path may be formed between the metal housing and the internal circuit part through a specific element or due to an internal design of the device. In particular, as the metal housing and the internal circuit portion form a loop, when static electricity having a high voltage is instantaneously introduced through the metal housing having a large external exposure area, circuit portions such as an IC may be damaged. In addition, the leakage current generated by the AC power may flow into the metal housing along the ground portion of the built-in circuit part. In this case, a countermeasure against this is caused because it causes an electric shock that may cause discomfort to the user or, in severe cases, injury to the user. This is required.
더욱이, 정전기의 경우 그 특성상 평면보다는 뾰족한 형상의 첨단부로 더 잘 유입되기 때문에, 이러한 부분에 대해서는 정전기의 내성을 더 강화시킬 필요성이 있다. Moreover, in the case of static electricity, because of its characteristics, it is more likely to flow into the tip of the pointed shape than the flat surface, so there is a need to further strengthen the resistance of static electricity to these parts.
한편, 최근의 휴대용 전자장치는 무선통신 기능을 필수적으로 수반하기 때문에 통신신호를 감쇄 없이 안정적으로 처리하기 위해서는 고용량의 커패시턴스가 요구되며, 특히, 회로기판 상에서 배치되는 위치에 따라 다양한 커패시턴스가 요구되고 있다. On the other hand, in recent years, since portable electronic devices are essential for wireless communication functions, high-capacitance is required to stably process communication signals without attenuation, and in particular, various capacitances are required depending on the position on the circuit board. .
이러한 실정에서, 정전기 보호기능을 갖는 소자로서 바리스터(varistor) 유형을 이용하는 경우 정전기에 대한 내성을 강화할 수 있으나, 고용량의 커패시턴스를 달성하기 용이하지 않다. 더욱이, 바리스터 재료의 특성상 온도변화율이 높기 때문에 다른 재료 또는 부품과 조합하여 사용하는 경우 전체 온도특성의 열화를 초래한다. In this situation, when a varistor type is used as a device having an electrostatic protection function, resistance to static electricity may be enhanced, but it is not easy to achieve high-capacitance capacitance. Moreover, because of the high rate of temperature change due to the nature of the varistor material, when used in combination with other materials or parts, deterioration of the overall temperature characteristic occurs.
따라서, 휴대용 전자장치에서 누설전류를 차단하면서도 정전기 유입이 용이한 위치 별로 정전기 내성을 강화시키는 동시에 다양한 고용량 커패시턴스를 함께 구현하기 위한 대책이 시급한 실정이다. Therefore, it is urgent to take measures to implement various high-capacitance capacitances while simultaneously enhancing leakage resistance in locations where static electricity is easily introduced while blocking leakage current in portable electronic devices.
본 발명은 상기와 같은 점을 감안하여 안출한 것으로, 정전기 보호기능과 커패시터 기능을 단일 소자로 일체화함에도 신뢰성이 높은 정전기 응답특성, 누설전류 차단 및 무선 통신에 적합한 고용량 커패시턴스를 동시에 구현할 수 있는 복합소자 제조방법 및 이를 통해 구현된 복합소자를 제공하는데 목적이 있다.The present invention has been devised in view of the above points, and is a composite device capable of simultaneously realizing high-reliability electrostatic response characteristics, leakage current blocking, and high-capacitance capacitance suitable for wireless communication even when the electrostatic protection function and the capacitor function are integrated into a single device. It is an object to provide a manufacturing method and a composite device implemented through it.
또한, 본 발명은 단일 패키지 소자로 구현할 때 발생할 수 있는 접합신뢰성, 외관신뢰성을 담보할 수 있고, 특히 대량생산에도 이러한 신뢰성이 담보될 수 있는 복합소자 제조방법 및 이를 통해 구현된 복합소자를 제공하는데 다른 목적이 있다.In addition, the present invention can provide a composite device manufacturing method and a composite device implemented through the composite device manufacturing method that can secure the bonding reliability and the appearance reliability that can occur when implemented as a single package device, and especially in mass production. There are other purposes.
나아가, 본 발명은 복합화된 단일 소자를 생산하기 위한 제조공정이나 단일 소자를 회로부품에 장착하는 공정에서 가해지는 열이나, 단일 소자의 반복사용 시 소자에서 발생한 열에 의해서도 정전기 보호기능과 커패시터 기능이 변동 없이 지속 발현될 수 있는 복합소자 제조방법 및 이를 통해 구현된 복합소자를 제공하는데 또 다른 목적이 있다.Furthermore, in the present invention, the static electricity protection function and the capacitor function fluctuate due to heat applied in a manufacturing process for producing a complex single element or a process in which a single element is mounted on a circuit component, or heat generated in the element during repeated use of a single element. Another object is to provide a method for manufacturing a composite device that can be continuously expressed without and a composite device implemented through the same.
더불어 본 발명은 단일 소자로써 우수한 전기적 접속 신뢰성을 가지고 이종의 기능을 지속 발현할 수 있는 본 발명에 따른 복합소자를 통해 휴대용 전자장치를 비롯한 다양한 전자장치를 구현하는데 또 다른 목적이 있다.In addition, the present invention has another object to realize various electronic devices, including portable electronic devices, through the composite device according to the present invention, which can continuously express heterogeneous functions with excellent electrical connection reliability as a single device.
상술한 과제를 해결하기 위해 본 발명은, (1) 제1소체와 상기 제1소체의 내부에 배치되며 적어도 끝단이 제1소체의 양측에 노출된 바리스터 전극을 구비하는 바리스터부, 및 제2소체와 상기 제2소체의 내부에 배치되며, 적어도 끝단이 제2소체의 양측에 노출된 커패시터 전극을 구비하는 커패시터부를 각각 준비하는 단계, (2) 상기 바리스터부 또는 상기 커패시터부의 상부면에 상기 상부면 전체면적의 50 ~ 85%를 덮도록 가접합부를 형성시키는 단계, (3) 가접합부가 형성된 바리스터부 또는 커패시터부의 가접합부 상에 전극의 노출방향이 같도록 나머지 다른 하나를 적층시켜 접합시키는 단계, 및 (4) 접합된 바리스터부와 커패시터부에서 전극이 노출된 양측에 상기 바리스터 전극 및 커패시터 전극이 전기적 연결되도록 한 쌍의 외부단자를 형성시키는 단계를 포함하는 복합소자 제조방법을 제공한다.In order to solve the above problems, the present invention, (1) a first body and a varistor portion disposed inside the first body and having at least one end of which the varistor electrodes are exposed on both sides of the first body, and the second body. And a capacitor part disposed inside the second body and having capacitor electrodes at least at both ends of which are exposed on both sides of the second body, (2) the upper surface of the varistor part or the upper surface of the capacitor part. Forming a temporary junction to cover 50 to 85% of the total area, (3) laminating and bonding the other one on the temporary junction of the varistor portion or the capacitor portion where the temporary junction is formed so that the electrode has the same exposure direction; And (4) a step of forming a pair of external terminals such that the varistor electrode and the capacitor electrode are electrically connected to both sides where the electrodes are exposed at the bonded varistor portion and the capacitor portion. Composite element provides a method comprising a.
본 발명의 일 실시예에 의하면, 상기 (2) 단계의 가접합부는 에폭시 성분 및 경화제를 포함하여 형성된 것일 수 있다. According to an embodiment of the present invention, the temporary bonding portion of step (2) may be formed by including an epoxy component and a curing agent.
또한, 상기 (2) 단계의 가접합부는 두께가 15 ~ 60㎛일 수 있다.In addition, the temporary bonding portion of step (2) may have a thickness of 15 to 60㎛.
또한, 상기 (2) 단계의 가접합부는 상기 상부면 길이에 대하여 50 ~ 95%의 길이와, 상기 상부면 폭에 대하여 50 ~ 90%의 폭을 갖도록 형성될 수 있고, 보다 바람직하게는 상기 가접합부는 상기 상부면 길이에 대하여 70 ~ 95%의 길이와, 상기 상부면 폭에 대하여 70 ~ 90%의 폭을 갖도록 형성될 수 있다.In addition, the temporary joining part of step (2) may be formed to have a length of 50 to 95% with respect to the length of the upper surface, and a width of 50 to 90% with respect to the width of the upper surface, more preferably the The joint may be formed to have a length of 70 to 95% with respect to the upper surface length and a width of 70 to 90% with respect to the width of the upper surface.
또한, 상기 가접합부는 에폭시 성분, 경화제, 및 결합강도를 향상시키기 위한 글래스 필러를 포함하고, 상기 글래스 필러는 가접합부 전체 중량에 대하여 20 ~ 65중량%로 구비될 수 있다.In addition, the temporary bonding portion includes an epoxy component, a curing agent, and a glass filler for improving the bonding strength, and the glass filler may be provided at 20 to 65% by weight based on the total weight of the temporary bonding portion.
또한, 상기 외부단자는 도전성 에폭시 성분과 50 ~ 90중량%로 도전성 금속을 포함하는 전극 페이스트가 열경화 되어 형성되며, 상기 전극 페이스트의 열경화 온도는 상기 접합부의 5% 중량감소 온도보다 낮은 온도로 수행될 수 있다.In addition, the external terminal is formed by thermally curing an electrode paste containing a conductive epoxy component and a conductive metal in an amount of 50 to 90% by weight, and the heat curing temperature of the electrode paste is lower than a 5% weight loss temperature of the junction. Can be performed.
또한, 외부단자와 바리스터 전극 및 커패시터 전극 간에 도통 신뢰성을 향상시키기 위하여, 상기 (1) 단계의 바리스터부는 바리스터 전극이 노출된 제1소체 양측에 구비되는 한 쌍의 제1외부전극을 더 포함하고, 상기 커패시터부는 커패시터 전극이 노출된 제2소체 양측에 구비되는 한 쌍의 제2외부전극을 더 포함하며, 상기 (4) 단계의 외부단자는 상기 제1외부전극과 제2외부전극 각각의 외부면 적어도 일부를 덮도록 형성될 수 있다.In addition, in order to improve the conduction reliability between the external terminal and the varistor electrode and the capacitor electrode, the varistor portion of step (1) further includes a pair of first external electrodes provided on both sides of the first body to which the varistor electrode is exposed, The capacitor portion further includes a pair of second external electrodes provided on both sides of the second body to which the capacitor electrode is exposed, and the external terminals of step (4) are external surfaces of the first external electrode and the second external electrode, respectively. It may be formed to cover at least a portion.
또한, 상기 제1외부전극 및 제2외부전극은 도전성 금속과 유리질 성분을 포함하는 소결형 전극일 수 있다.Further, the first external electrode and the second external electrode may be sintered electrodes including a conductive metal and a glassy component.
또한, 상기 제1외부전극 및 제2외부전극은 두께가 15㎛ 이하이고, 폭은 200㎛ 이하로 형성될 수 있다.In addition, the first external electrode and the second external electrode may be formed to have a thickness of 15 μm or less and a width of 200 μm or less.
또한, 상기 제1소체는 Zr, Nb, Pr, Bi, Co. Si, Cr, 및 Mn으로 이루어진 군에서 선택된 적어도 1종의 산화물과 ZnO을 포함하는 바리스터층이 복수 개 적층되어 형성되며, 상기 제2소체는 Ti, Si, Sr, Bi, W, 및 Nd로 이루어진 군에서 선택된 적어도 1종의 산화물과 BaTiO3을 포함하는 세라믹층이 복수 개 적층되어 형성된 것일 수 있다.In addition, the first body is Zr, Nb, Pr, Bi, Co. A plurality of varistor layers including at least one oxide and ZnO selected from the group consisting of Si, Cr, and Mn are formed by lamination, and the second body is composed of Ti, Si, Sr, Bi, W, and Nd. A plurality of ceramic layers including at least one oxide and BaTiO 3 selected from the group may be stacked.
또한, 상기 가접합부는 상기 바리스터부 또는 상기 커패시터부의 상부면 전체면적의 58 ~ 70%를 덮도록 형성될 수 있다.In addition, the provisional joining portion may be formed to cover 58 to 70% of the total area of the upper surface of the varistor portion or the capacitor portion.
또한, 본 발명은 제1소체와 상기 제1소체의 내부에 배치되며 적어도 끝단이 제1소체의 양측에 노출된 바리스터 전극을 구비하는 바리스터부, 제2소체와 상기 제2소체의 내부에 배치되며 적어도 끝단이 제2소체의 양측에 노출된 커패시터 전극을 구비하고 상기 바리스터 전극과 상기 커패시터 전극의 노출방향이 같도록 상기 바리스터부 하부에 적층된 커패시터부, 상기 바리스터부 하부면 또는 상기 커패시터부 상부면 전체면적의 55 ~ 93%를 덮도록 상기 바리스터부와 상기 커패시터부 사이에 개재된 접합부, 및 적층된 바리스터부와 커패시터부의 양측에 구비되어 노출된 바리스터 전극 및 커패시터 전극과 전기적 연결되는 한 쌍의 외부단자를 포함하는 복합소자를 제공한다.In addition, the present invention is disposed inside the first body and the first body, the varistor portion having a varistor electrode at least at both ends of which is exposed on both sides of the first body, the second body and the second body, A capacitor portion, a lower surface of the varistor portion, or an upper surface of the capacitor portion having capacitor electrodes exposed at least at both ends of the second body and having the same exposure direction of the varistor electrode and the capacitor electrode. A pair of external parts that are electrically connected to the exposed varistor electrode and the capacitor electrode provided on both sides of the junction between the varistor portion and the capacitor portion to cover 55 to 93% of the total area, and the stacked varistor portion and the capacitor portion. It provides a composite device including a terminal.
본 발명의 일 실시예에 의하면, 상기 제1소체는 제1바리스터층과 제2바리스터층을 포함하는 복수의 바리스터층이 적층되어 일체로 형성되고, 상기 바리스터 전극은 상기 제1바리스터층 일면에 전극의 길이방향으로 일정간격 이격되어 구비된 복수의 제1바리스터 전극과, 바리스터층 적층방향으로 제1바리스터 전극과 이격되고, 이웃한 상기 제1바리스터 전극 사이의 이격부분에 대응되도록 제1바리스터층 타면 또는 제2바리스터층 일면에 형성된 적어도 하나의 제2바리스터 전극을 포함할 수 있다. According to an embodiment of the present invention, the first body is formed integrally by stacking a plurality of varistor layers including a first varistor layer and a second varistor layer, and the varistor electrode is an electrode on one surface of the first varistor layer. A plurality of first varistor electrodes provided at regular intervals in the longitudinal direction of the first varistor layer, and spaced apart from the first varistor electrode in the stacking direction of the varistor layer, and correspond to a space between the adjacent first varistor electrodes Alternatively, at least one second varistor electrode formed on one surface of the second varistor layer may be included.
또한, 상기 제2소체는 복수의 세라믹층이 적층되어 일체로 형성되고, 상기 커패시터 전극은 세라믹층 적층방향으로 이웃한 전극끼리 전극의 일부가 상호 대향하도록 적어도 2개의 세라믹층 상에 각각 형성될 수 있다.In addition, the second body may be formed integrally by stacking a plurality of ceramic layers, and the capacitor electrodes may be respectively formed on at least two ceramic layers such that a part of the electrodes between the electrodes adjacent to each other in the stacking direction of the ceramic layers face each other. have.
또한, 상기 접합부의 평균두께는 7 ~ 40㎛일 수 있다.In addition, the average thickness of the junction may be 7 ~ 40㎛.
또한, 상기 접합부의 길이는 상기 바리스터부 하부면 또는 상기 커패시터부 상부면 전체길이의 75 ~ 99%이고, 상기 접합부의 폭은 상기 바리스터부 하부면 또는 상기 커패시터부 상부면 전체 폭의 75 ~ 95%일 수 있다.In addition, the length of the junction portion is 75 to 99% of the total length of the lower surface of the varistor portion or the upper portion of the capacitor portion, and the width of the junction portion is 75 to 95% of the entire width of the lower surface of the varistor portion or the upper surface of the capacitor portion. Can be
또한, 상기 제1외부전극과, 상기 제1외부전극에 연결되지 않은 상기 바리스터 전극과의 최소 인접거리는 20㎛ 이상이고, 상기 제2외부전극과, 상기 제2외부전극에 연결되지 않은 상기 커패시터 전극과의 거리는 20㎛ 이상일 수 있다.Further, the minimum adjacent distance between the first external electrode and the varistor electrode not connected to the first external electrode is 20 μm or more, and the second external electrode and the capacitor electrode not connected to the second external electrode The distance may be 20 μm or more.
또한, 상기 바리스터 전극과 커패시터 전극은 두께가 10㎛ 이하일 수 있다.In addition, the varistor electrode and the capacitor electrode may have a thickness of 10 μm or less.
또한, 상기 제1소체의 높이는 제2소체 보다 클 수 있다.Also, the height of the first body may be greater than that of the second body.
또한, 이웃한 상기 커패시터 전극 사이의 수직거리는 10㎛ 이상일 수 있다.In addition, the vertical distance between the adjacent capacitor electrodes may be 10 μm or more.
또한, 상기 복합소자는 부피가 0.32㎣ 이하일 수 있다.In addition, the composite device may have a volume of 0.32 mm or less.
또한, 상기 접합부는 상기 바리스터부 하부면 또는 상기 커패시터부 상부면 전체면적의 65 ~ 78%를 덮도록 형성된 것일 수 있다. In addition, the junction may be formed to cover 65 to 78% of the total area of the lower surface of the varistor or the upper surface of the capacitor.
또한, 상기 복합소자는 안테나로 사용되는 영역을 포함하는 전자장치의 인체 접촉가능 전도체인 메탈 케이스와 내장 회로부 사이를 연결하는 소자로서, 상기 커패시터부는 상기 안테나로 사용되는 메탈 케이스로부터 유입되는 통신신호를 통과시키며, 통신주파수 대역에서 상기 통신신호가 감쇄없이 통과하는 동시에 상기 내장 회로부의 접지로부터 유입되는 상기 전자장치의 외부전원에 의한 누설전류 중 DC 성분의 차단능력을 향상시키고, 상기 전자장치의 외부전원의 정격전압보다 높은 절연파괴전압을 가지며, 상기 바리스터부는 상기 메탈 케이스로부터 유입되는 정전기를 통과시킴과 아울러 상기 누설전류를 상기 메탈 케이스로 전달되지 않도록 차단할 수 있다. In addition, the composite element is an element that connects between a metal case, which is a human body contactable conductor of an electronic device including an area used as an antenna, and a built-in circuit part, wherein the capacitor part receives communication signals flowing from the metal case used as the antenna. Passing, and at the same time, the communication signal in the communication frequency band passes without attenuation, and at the same time improves the blocking ability of DC components in the leakage current by the external power of the electronic device flowing from the ground of the internal circuit part, and the external power of the electronic device. It has an insulation breakdown voltage higher than the rated voltage of the, the varistor portion can pass through the static electricity flowing from the metal case and block the leakage current is not transmitted to the metal case.
또한, 본 발명은 도전성 케이스에서 외측으로 돌출 형성되는 첨단부를 포함하는 전도체, 회로부, 및 상기 전도체와 회로부를 전기적으로 연결하는 본 발명에 따른 복합소자를 포함하는 휴대용 전자장치를 제공한다.In addition, the present invention provides a portable electronic device including a conductor including a tip portion protruding outwardly from a conductive case, a circuit portion, and a composite element according to the present invention that electrically connects the conductor and the circuit portion.
본 발명의 일 실시예에 의하면, 상기 전도체는 사이드 키를 포함하거나, 상기 첨단부는 외부 기기와 연결을 위한 커넥터의 삽입구의 일단을 포함할 수 있다.According to an embodiment of the present invention, the conductor may include a side key, or the tip portion may include one end of an insertion port of a connector for connection with an external device.
이하, 본 발명에서 사용한 용어에 대해 설명한다.Hereinafter, terms used in the present invention will be described.
본 발명에서 사용한 유전율은 비유전율을 의미한다.The dielectric constant used in the present invention means a relative dielectric constant.
본 발명에 의하면, 바리스터와 커패시터를 단일 소자로 복합화 함에도 불구하고 정전기에 대한 응답특성이 뛰어나고, 고용량 커패시턴스를 구현할 수 있어서 제품의 신뢰성을 향상시킬 수 있다. 또한, 복합화 공정에서 발생할 수 있는 외관품질 저하를 방지하고, 구현된 제품이 우수한 결합강도를 발현할 수 있다. 나아가, 본 발명은 기존의 바리스터 및 커패시터 제조 공정을 이용하여 단일 소자로 복합화 함으로써, 제조공정을 단순화하고 다양한 용량에 따른 라인업이 용이하여 제조효율을 향상시키고 제조단가를 감소시킬 수 있다. 더불어 바리스터와 별도로 커패시터를 구현함으로써, 커패시터 구현 시 설계 자유도가 증가하므로, 다양한 용량의 라인업이 가능하여 별도의 공정 변경 없이도 고객사의 요구에 신속히 대응할 수 있다. According to the present invention, despite the combination of a varistor and a capacitor as a single element, it has excellent response characteristics to static electricity and can realize high-capacitance, thereby improving product reliability. In addition, it is possible to prevent the deterioration of the appearance quality that may occur in the complexing process, and to realize the excellent bonding strength of the implemented product. Furthermore, the present invention can be simplified into a single device using an existing varistor and capacitor manufacturing process, thereby simplifying the manufacturing process and facilitating lineup according to various capacities to improve manufacturing efficiency and reduce manufacturing cost. In addition, by implementing capacitors separately from varistors, design freedom increases when capacitors are implemented, so lineups of various capacities are possible, so customers can quickly respond to customer demands without changing processes.
또한, 본 발명은 독립하여 소결되어 구현된 바리스터와 커패시터를 단일 소자로 복합화 함에 따라서 이들 각각이 소결되기 전부터 단일 소자화되고 함께 소결됨에 따라서 발생하는 바리스터와 커패시터 사이의 물질이동이 원천 차단될 수 있어서 전기적 특성의 열화를 방지할 수 있다. 나아가 외부에서 가해지는 열이나 자체적으로 발열되는 열에 의해서도 내열성이 유지되어 서로 다른 두 소자 간 결합신뢰성이 매우 우수하다. 더불어 단일 소자화 되어 함께 소결공정을 거칠 때 바리스터 재료와 커패시터 재료 간 온도변화율의 차이에 따른 비틀림, 틀어짐 등의 결함을 억제할 수 있다. In addition, according to the present invention, as the composites of the varistors and capacitors implemented by sintering independently into a single element, the material transfer between the varistors and the capacitors, which occur as a single element and are sintered together before each of them can be sourced, can be blocked. Deterioration of properties can be prevented. Furthermore, the heat resistance is maintained even by heat applied from the outside or heat generated by itself, so the coupling reliability between two different devices is excellent. In addition, defects such as twisting and twisting due to a difference in the rate of temperature change between the varistor material and the capacitor material can be suppressed when a single element is sintered together.
도 1은 본 발명의 일 실시예에 따른 복합소자의 사시도, 1 is a perspective view of a composite device according to an embodiment of the present invention,
도 2는 도 1의 복합소자에 대한 X1-X1'경계선에 따른 단면 모식도,Figure 2 is a schematic cross-sectional view along the X 1 -X 1 'border line for the composite device of Figure 1,
도 3은 도 1의 복합소자에 대한 X2-X2'경계선에 따른 단면 모식도,3 is a schematic cross-sectional view along the X 2 -X 2 ′ boundary line for the composite device of FIG. 1;
도 4는 본 발명의 일 실시예에 따른 복합소자의 외부단자를 형성하는 공정에 대한 모식도,4 is a schematic diagram of a process for forming an external terminal of a composite device according to an embodiment of the present invention,
도 5a 내지 도 5c는 본 발명의 복합소자에 포함되는 여러 실시예의 바리스터부에 대한 Y-Y'경계선에 따른 단면도,5A to 5C are cross-sectional views along a Y-Y 'boundary line for varistor parts of various embodiments included in the composite device of the present invention,
도 6a 및 도 6b는 본 발명의 복합소자에 포함되는 여러 실시예의 커패시터부 에 대한 Y-Y'경계선에 따른 단면도,6A and 6B are cross-sectional views along Y-Y 'boundary lines for capacitor portions of various embodiments included in the composite device of the present invention;
도 7은 본 발명의 일 실시예에 포함되는 (2) 단계에서 형성된 가접합부를 나타낸 모식도, Figure 7 is a schematic diagram showing a temporary junction formed in step (2) included in an embodiment of the present invention,
도 8은 본 발명의 다른 실시예에 따른 복합소자의 단면도, 8 is a cross-sectional view of a composite device according to another embodiment of the present invention,
도 9는 본 발명의 다른 실시예에 포함되는 (2) 단계에서 형성된 가접합부를 나타낸 모식도, Figure 9 is a schematic diagram showing a temporary junction formed in step (2) included in another embodiment of the present invention,
도 10은 본 발명의 일 실시예에 따른 복합소자의 특성을 비교한 그래프, 그리고, 10 is a graph comparing the characteristics of a composite device according to an embodiment of the present invention, and
도 11 내지 도 16은 본 발명의 일 실시예에 따른 복합소자의 적용예를 나타낸 개념도이다.11 to 16 are conceptual views illustrating an application example of a composite device according to an embodiment of the present invention.
이하, 첨부한 도면을 참고로 하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다. 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 동일 또는 유사한 구성요소에 대해서는 동일한 참조부호를 부가한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains may easily practice. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. In the drawings, parts not related to the description are omitted in order to clearly describe the present invention, and the same reference numerals are added to the same or similar elements throughout the specification.
본 발명에 따른 복합소자의 제조방법을 설명하기 앞서서 도 1과 도 2를 참고하여 최종 구현된 복합소자를 살펴보면, 복합소자(100)는 바리스터부(110), 상기 바리스터부(110)의 하부에 배치된 커패시터부(120), 상기 바리스터부(110)와 상기 커패시터부(120) 사이에 개재된 접합부(130) 및 외부단자(140)를 포함한다.Prior to explaining the manufacturing method of the composite device according to the present invention, referring to FIGS. 1 and 2, the final implemented composite device will be described. The composite device 100 is provided at the bottom of the varistor unit 110 and the varistor unit 110. It includes a disposed capacitor unit 120, the varistor unit 110 and the junction between the capacitor unit 120, 130 and the external terminal 140.
상기 복합소자(100)는 바람직하게는 부피가 0.32㎣ 이하인 복합소자일 수 있고, 일예로 길이 1.00±0.05㎜, 폭 0.5±0.05㎜, 높이 0.5±0.05㎜일 수 있다. The composite device 100 may be a composite device having a volume of 0.32 mm or less, for example, 1.00 ± 0.05 mm in length, 0.5 ± 0.05 mm in width, and 0.5 ± 0.05 mm in height.
본 발명에 따른 복합소자(100)는 위와 같이 한정적이면서 매우 적은 부피 내에 이종의 기능을 수행하는 바리스터부(110)와 커패시터부(120)를 구비함에도 불구하고 정전기에 대한 방호, 누설전류 차단 및 높은 캐피시턴스를 동시에 발현하도록 구현된다.The composite device 100 according to the present invention has a protection against static electricity, leakage current blocking and high protection against static electricity despite having a varistor unit 110 and a capacitor unit 120 performing heterogeneous functions within a limited and very small volume as described above. It is implemented to simultaneously express capacitance.
상기 바리스터부(110)는 통상적인 바리스터 유형의 소자로써, 재질적으로 유전율이 낮다. 바리스터 특성을 구현하면서 동시에 유전율을 소정의 수치 이상으로 증가시키기는 어려운데, 바리스터 소자의 낮은 유전율 특성으로 인해서 통신신호가 바리스터 소자를 통과할 때 감쇄가 발생하고, 이로 인해 통신신호가 통과하는 회로에 바리스터 소자를 단독으로 사용하기는 곤란한 문제가 있다. 이를 해결하기 위해 바리스터 특성의 소자와 통신신호의 감쇄를 방지하기 위한 커패시터 소자를 함께 사용하는 것을 고려해볼 수 있으며, 커패시터 소자의 캐패시턴스를 고용량으로 구현하면 바리스터 소자로 인한 통신신호의 감쇄를 보완 방지할 수 있다. The varistor unit 110 is a conventional varistor type device, and has a low dielectric constant in material. While implementing the varistor characteristic, it is difficult to increase the dielectric constant to a predetermined value or more. Due to the low dielectric constant characteristic of the varistor element, attenuation occurs when the communication signal passes through the varistor element, thereby causing the varistor in the circuit through which the communication signal passes. It is difficult to use the device alone. In order to solve this, it is possible to consider using a device with varistor characteristics and a capacitor device to prevent attenuation of communication signals, and if the capacitance of the capacitor device is implemented at a high capacity, it is possible to compensate for the attenuation of the communication signal due to the varistor device. You can.
한편, 이종의 기능을 수행하는 바리스터 소자와 커패시터 소자를 결합시켜 단일 소자로 구현하는 것을 고려해 볼 수 있는데, 목적하는 수준으로 각각의 특성이 발현하도록 구현된 두 소자를 한정된 매우 적은 부피의 공간 내에 배치시켜 일체화하는 것은 용이하지 않다.On the other hand, it can be considered to combine the varistor element and the capacitor element that perform heterogeneous functions into a single element, and the two elements implemented to express each characteristic at a desired level are placed in a limited space of very small volume. It is not easy to integrate them.
구체적으로 한정된 부피 공간 내 두 소자가 배치되기 위한 일 방법으로써, 처음부터 하나의 소자에 이종의 기능 즉, 커패시터 특성과 바리스터 특성이 포함되도록 소자가 설계된 후 동시 소성을 통해 처음부터 목적하는 크기로 단일 소자를 제조하는 방법이 있다. 또는 커패시터 소자와 바리스터 소자를 각각 독립하여 제조한 후 이미 제조된 두 소자를 결합하여 일체화시키는 방법이 있을 수 있다. Specifically, as a method for placing two devices in a limited volume space, a device is designed to include heterogeneous functions, that is, a capacitor characteristic and a varistor characteristic, from the beginning, and then a single desired size from the beginning through simultaneous firing. There is a method of manufacturing the device. Alternatively, there may be a method in which a capacitor element and a varistor element are independently manufactured, and then two elements already manufactured are combined and integrated.
전자의 방법은 제조공정을 단순화시킬 수 있으나, 바리스터 소자의 소체 재질과 커패시터 소체 재질이 서로 달라 소성 조건이 상이함에 따라서 동시소성을 위한 조건을 찾기가 용이하지 않다. 또한, 동시소성 조건을 찾더라도 바리스터 기능과 커패시터 기능을 수행하는 각각의 영역 경계부분에서 이종 재질 상호간에 물질 이동이 발생하여 각각의 전기적 특성을 저하시키는 문제가 있다. 이에 물질의 상호 이동을 방지하고자 각각의 기능을 수행하는 영역의 경계부분에 별도의 시트층을 구비시킬 경우, 구비된 시트층이 한정된 부피 공간 내 상당부피를 차지하여 결국 바리스터 소자 및/또는 커패시터 소자의 부피가 감소해야 하고, 감소된 부피로 인해 목적하는 물성을 온전히 발현하기 어려울 수 있다. 또한, 이종의 소체 재질은 서로 상이한 열적특성을 가짐에 따라서 동시소성 시 비틀림, 휨, 틀어짐과 같은 외관이상을 유발시킬 수 있다. The former method can simplify the manufacturing process, but it is not easy to find the conditions for simultaneous firing because the firing conditions are different due to the different material of the varistor element and the capacitor material. In addition, even when the co-firing condition is found, there is a problem in that material movement occurs between dissimilar materials at each boundary portion of the region performing the varistor function and the capacitor function, thereby deteriorating the electrical characteristics of each. Accordingly, when a separate sheet layer is provided at the boundary of the region performing each function in order to prevent the mutual movement of materials, the provided sheet layer occupies a significant volume in a limited volume space, and eventually a varistor element and / or a capacitor element The volume of must be reduced, and due to the reduced volume, it may be difficult to fully express desired properties. In addition, heterogeneous body materials have different thermal characteristics and may cause appearance abnormalities such as twisting, bending, and twisting during simultaneous firing.
이에 따라서 본 발명에 따른 복합소자(100)는 후자의 방법을 이용하여 독립하여 소결된 바리스터부(110)와 커패시터부(120)를 결합하여 일체화 시킴으로써, 동시소성으로 발생하는 각각의 전기적 특성 저하문제, 외관이상 문제 등을 원천 봉쇄할 수 있다. 또한, 위와 같은 문제를 해결하기 위해서 추가되는 별도의 시트층 등의 설계변경에 기인한 바리스터부(110)와 커패시터부(120)의 부피감소에 따른 물성저하의 우려나 물성저하를 방지하기 위한 다른 추가적인 설계변경을 피할 수 있다. Accordingly, the composite device 100 according to the present invention combines the sintered varistor unit 110 and the capacitor unit 120 independently by using the latter method, thereby integrating and integrating the electrical characteristics of the electrical properties. , It can block the appearance problems. In addition, in order to solve the above-mentioned problems, other properties for preventing physical property deterioration or property deterioration due to volume reduction of the varistor part 110 and the capacitor part 120 due to design changes such as additional sheet layers are added. Additional design changes can be avoided.
한편, 독립하여 소결된 바리스터부(110)와 커패시터부(120)의 결합을 위해서 접착층을 개재시킬 수 있고, 구체적으로 접착층을 바리스터부나 커패시터부 중 어느 하나의 상부 면에 형성시킨 뒤 다른 하나를 그 상부에 적층시켜 결합시킬 수 있다. 그러나 결합 시 가해지는 압력의 정도나 접착층의 재질적 특성 등의 원인으로 접착층이 바리스터부나 커패시터부 측면까지 침범하여 형성됨으로써 외관품질이 불량해질 수 있다. 또한, 이를 방지하고자 접합층을 너무 적은 양으로 형성시킬 경우 결합강도의 저하를 유발할 수 있다. 또한, 적은 양으로 형성된 접합층은 도 3에 도시된 것과 같이 적층된 바리스터부의 제1소체(110a) 하부 모서리와 커패시터부의 제2소체(120a) 상부 모서리에 의해 형성된 홈의 깊이를 깊게 형성시키고, 이로 인해 외부단자 형성 시 외관신뢰성 및 전기적 신뢰성 저하의 원인이 될 수 있다. 구체적으로 도 4와 같이 바리스터부(110)의 바리스터 전극과 커패시터부(120)의 커패시터 전극을 상호 전기적 연결시키기 위한 외부단자(140)를 형성할 때, 외부단자 형성조성물(140a)은 적층체의 양 측단에 형성된 홈(C)에 의한 모세관 현상이 현저하게 발생할 수 있다. 이 경우 목적한 소정의 길이(s)를 초과하는 길이(t)로 홈을 따라 외부단자 형성조성물(140a)이 이동해 번지게 되고, 소성 또는 경화를 통해 소정의 길이(s)를 초과한 길이(t)를 갖는 외부단자로 구현될 수 있는데, 한 쌍의 외부단자(140)가 도통될 가능성이 증가하여 전기적 신뢰성이 저하의 원인이 되고, 외부단자가 소체에 번지게 됨에 따라서 외관품질이 저하될 수 있다. Meanwhile, an adhesive layer may be interposed to bond the sintered varistor portion 110 and the capacitor portion 120 independently, and specifically, an adhesive layer is formed on the upper surface of either the varistor portion or the capacitor portion, and then the other is It can be combined by stacking on top. However, due to the degree of pressure applied during bonding or the material properties of the adhesive layer, the adhesive layer is formed by invading the side of the varistor or capacitor to deteriorate the appearance quality. In addition, if the bonding layer is formed in an excessively small amount to prevent this, it may cause a decrease in bonding strength. In addition, the bonding layer formed in a small amount deeply forms the depth of the groove formed by the lower edge of the first body 110a of the varistor portion and the upper edge of the second body 120a of the capacitor portion, as shown in FIG. 3, Due to this, when external terminals are formed, external reliability and electrical reliability may be deteriorated. Specifically, when forming the external terminal 140 for electrically connecting the varistor electrode of the varistor unit 110 and the capacitor electrode of the capacitor unit 120, as shown in FIG. 4, the external terminal forming composition 140a is formed of a laminate. Capillary phenomenon due to the grooves C formed at both side ends may occur remarkably. In this case, the external terminal forming composition 140a moves along the groove to a length t exceeding the desired predetermined length s, and spreads, and the length exceeding the predetermined length s through firing or curing ( It may be implemented as an external terminal having a t), the possibility of conducting a pair of external terminals 140 increases, causing electrical reliability to deteriorate, and the appearance quality deteriorates as the external terminal spreads on the body. You can.
본 발명은 상술한 것과 같은 접합신뢰성, 외관품질, 전기적 신뢰성이 모두 담보되는 적층구조 갖는 복합소자 연구하던 중 후술하는 제조방법에 이르게 되었다. The present invention has reached the manufacturing method described below while studying a composite device having a laminated structure in which all of the bonding reliability, appearance quality, and electrical reliability as described above are secured.
본 발명의 일 실시예에 따르면, 복합소자(100)는 (1) 제1소체와 상기 제1소체의 내부에 배치되며 적어도 끝단이 제1소체의 양측에 노출된 바리스터 전극을 구비하는 바리스터부, 및 제2소체와 상기 제2소체의 내부에 배치되며, 적어도 끝단이 제2소체의 양측에 노출된 커패시터 전극을 구비하는 커패시터부를 각각 준비하는 단계, (2) 상기 바리스터부 또는 상기 커패시터부의 상부면에 상기 상부면 전체면적의 50 ~ 85%를 덮도록 가접합부를 형성시키는 단계, (3) 가접합부가 형성된 바리스터부 또는 커패시터부의 가접합부 상에 전극의 노출방향이 같도록 나머지 다른 하나를 적층시켜 접합시키는 단계, 및 (4) 접합된 바리스터부와 커패시터부에서 전극이 노출된 양측에 상기 바리스터 전극 및 커패시터 전극이 전기적 연결되도록 한 쌍의 외부단자를 형성시키는 단계를 포함하여 구현된다.According to an embodiment of the present invention, the composite device 100 is (1) a varistor portion having a first body and a varistor electrode disposed inside the first body and having at least one end exposed on both sides of the first body, And a capacitor portion disposed inside the second body and the second body and having capacitor electrodes at least at both ends of which are exposed on both sides of the second body, (2) the varistor portion or the upper surface of the capacitor portion. Forming a temporary junction to cover 50 to 85% of the total area of the upper surface, (3) stacking the other one on the temporary junction of the varistor portion or the capacitor portion where the temporary junction is formed so that the electrode has the same exposure direction. Bonding, and (4) forming a pair of external terminals such that the varistor electrode and the capacitor electrode are electrically connected to both sides of the bonded varistor part and the electrode part exposed at the capacitor part. Is implemented including steps.
먼저 본 발명의 (1) 단계로써, 바리스터부(110)와 커패시터부(120)를 각각 준비한다.First, as a step (1) of the present invention, the varistor unit 110 and the capacitor unit 120 are respectively prepared.
도 5a를 참조하여 설명하면, 상기 바리스터부(110)는 제1소체(110a) 및 바리스터 전극(112,114,116)을 포함하며, 누선전류 차단기능 및 정전기 보호기능을 갖는다. 특히, 복합소자(100)가 안테나로 사용되는 영역을 포함하는 전자장치의 인체 접촉가능 전도체인 메탈 케이스와 내장 회로부 사이를 연결하는 소자로 사용될 때 상기 메탈 케이스로부터 유입되는 정전기를 통과시킴과 아울러 상기 누설전류를 상기 메탈 케이스로 전달되지 않도록 차단할 수 있다.5A, the varistor unit 110 includes a first body 110a and varistor electrodes 112, 114, and 116, and has a leakage current blocking function and an electrostatic protection function. In particular, when the composite element 100 is used as an element connecting a metal case, which is a human body contactable conductor of an electronic device including an area used as an antenna, and an internal circuit part, the static electricity flowing from the metal case passes and Leakage current may be blocked from being transmitted to the metal case.
상기 제1소체(110a)는 바리스터 물질을 포함하며, 일례로 Zr, Nb, Pr, Bi, Co. Si, Cr, 및 Mn으로 이루어진 군에서 선택된 적어도 1종의 산화물과 ZnO을 포함할 수 있다. 여기서, 제1소체(110a)는 제1바리스터층과 제2바리스터층을 포함하는 복수의 바리스터층이 적층되어 일체로 형성될 수 있다. 즉, 서로 다른 바리스터층 상에 또는, 동일한 바리스터층의 양면에 제1바리스터 전극(112,114) 또는 제2바리스터 전극(116)이 구비될 수 있으므로, 제1바리스터 전극(112,114) 및 제2바리스터 전극(116)의 배치 구성에 따라 바리스터 층은 복수 개로 구성될 수 있다. 이때, 상기 제1바리스터층과 제2바리스터층은 동종 또는 이종의 바리스터 물질을 각각 포함할 수 있다.The first body 110a includes a varistor material, for example, Zr, Nb, Pr, Bi, Co. It may include at least one oxide and ZnO selected from the group consisting of Si, Cr, and Mn. Here, the first body 110a may be integrally formed by stacking a plurality of varistor layers including a first varistor layer and a second varistor layer. That is, since the first varistor electrodes 112 and 114 or the second varistor electrodes 116 may be provided on different varistor layers or on both sides of the same varistor layer, the first varistor electrodes 112 and 114 and the second varistor electrodes ( Depending on the arrangement of 116), the varistor layer may be composed of a plurality. In this case, the first varistor layer and the second varistor layer may include varistor materials of the same type or different types, respectively.
한편, 도 2 및 도 3에 도시된 것과 같이, 상기 제1소체(110a)는 삼중점과 모서리가 라운드 처리되어 곡면일 수 있다. 곡면인 삼중점과 모서리는 곡률이 형성된 지점에서의 후술하는 (4) 단계에서 형성되는 외부단자(140) 또는 도 5c에 도시된 것과 같이 바리스터부(110")에 더 구비될 수 있는 제1외부전극(142) 두께를 향상시킬 수 있다. 또한, 후술하는 것과 같이 외부단자(140)의 외부면에 형성될 수 있는 도금층의 번짐을 방지할 수 있으며, 외부단자(140) 손상에 따른 불량을 감소시킬 수 있다. 더불어, 곡면인 모서리는 소자에 가해지는 외력에 의해 소체가 부서지거나 손상되는 것을 완화시켜 줄 수 있다. Meanwhile, as illustrated in FIGS. 2 and 3, the first body 110a may have a curved surface by rounding the triple points and corners. The curved surface of the triple point and the edge is a first external electrode that can be further provided on the external terminal 140 or the varistor portion 110 "as shown in FIG. (142) It is possible to improve the thickness, it is also possible to prevent the spread of the plating layer that can be formed on the outer surface of the outer terminal 140, as described later, to reduce the defect due to damage to the outer terminal 140. In addition, the curved edge can relieve the body from being broken or damaged by an external force applied to the device.
상기 바리스터 전극(112,114,116)은 제1바리스터층 일면에 전극의 길이방향으로 일정간격 이격되어 구비된 복수의 제1바리스터 전극(112,114)과, 바리스터층 적층방향으로 제1바리스터 전극과 이격되고, 이웃한 상기 제1바리스터 전극(112,114) 사이의 이격부분에 대응되도록 제1바리스터층 타면 또는 제2바리스터층 일면에 형성된 적어도 하나의 제2바리스터 전극(116)을 포함할 수 있다. 구체적으로 도 5a와 같이 제1바리스터 전극(112,114)이 두 개인 경우, 제2바리스터 전극(116)은 복합소자(100)의 단면 상에서 제1바리스터 전극(112,114) 사이에 하나만 배치될 수 있다.The varistor electrodes 112, 114, and 116 are spaced apart from the first varistor electrode in a stacking direction of a plurality of first varistor electrodes 112, 114 provided at regular intervals in the longitudinal direction of the electrode on one surface of the first varistor layer, and adjacent to the first varistor electrode. The first varistor electrode 112, 114 may include at least one second varistor electrode 116 formed on the other surface of the first varistor layer or one surface of the second varistor layer so as to correspond to the spaced apart portion. Specifically, when there are two first varistor electrodes 112 and 114 as shown in FIG. 5A, only one of the second varistor electrodes 116 may be disposed between the first varistor electrodes 112 and 114 on the cross section of the composite device 100.
여기서, 제1바리스터 전극(112,114)과 제2바리스터 전극(116)은 서로 대향하여 일부가 중첩되는 것으로 도시되고 설명되었으나, 이에 한정되지 않고, 서로 중첩되지 않게 배치될 수도 있다. Here, although the first varistor electrodes 112 and 114 and the second varistor electrode 116 are shown and described as being partially overlapped with each other, the present invention is not limited thereto, and may be disposed so as not to overlap each other.
이때, 제1바리스터 전극(112,114) 사이의 거리는 제1바리스터 전극(112,114)과 제2바리스터 전극(116) 사이의 거리보다 넓게 형성될 수 있다. 이에 의해 정전기와 같은 유입되는 신호는 제1바리스터 전극(112), 제2바리스터 전극(116), 및 제1바리스터 전극(114) 순서의 경로로 전파될 수 있다.At this time, the distance between the first varistor electrodes 112 and 114 may be formed to be wider than the distance between the first varistor electrodes 112 and 114 and the second varistor electrodes 116. Accordingly, an incoming signal such as static electricity may be propagated in the order of the first varistor electrode 112, the second varistor electrode 116, and the first varistor electrode 114.
이때, 바리스터부(110)는 한 쌍의 제1바리스터 전극(112,114)과 제2바리스터 전극(116) 사이의 간격 및 바리스터 물질의 입경이 항복전압(Vbr)을 만족할 수 있도록 형성될 수 있다. 여기서, 바리스터부(110)의 항복전압(Vbr)은 제1바리스터 전극(112)과 제2바리스터 전극(116) 사이, 제2바리스터 전극(116)과 제1바리스터 전극(114) 사이 각각의 항복전압 총합이며, 외부전원에 의한 누설전류를 차단하도록 외부전원의 정격전압(Vin)보다 클 수 있다. At this time, the varistor unit 110 may be formed so that the gap between the pair of first varistor electrodes 112 and 114 and the second varistor electrode 116 and the particle diameter of the varistor material satisfy the breakdown voltage Vbr. Here, the breakdown voltage (Vbr) of the varistor unit 110 is the respective breakdown between the first varistor electrode 112 and the second varistor electrode 116, between the second varistor electrode 116 and the first varistor electrode 114 It is the sum of voltages and may be greater than the rated voltage (Vin) of the external power source to block leakage currents from the external power source.
이에 의해, 바리스터부(110)는 정전기가 유입되는 경우, 정전기의 전압이 항복전압(Vbr)보다 크기 때문에 턴 온 되어 정전기를 통과시킬 수 있고, 아울러, 외부전원에 의한 누설전류가 유입되는 경우, 외부전원의 정격전압보다 항복전압(Vbr)이 크기 때문에 턴 오프 되어 누설전류를 차단할 수 있다.Accordingly, when the static electricity is introduced, the varistor unit 110 may turn on and pass static electricity because the voltage of the static electricity is greater than the breakdown voltage Vbr. In addition, when a leakage current from an external power source is introduced, Since the breakdown voltage (Vbr) is greater than the rated voltage of the external power supply, it can be turned off to block leakage current.
아울러, 제1바리스터 전극(112,114)은 제2바리스터 전극(116)을 중심으로 상하에 배치될 수 있다. 즉, 제1바리스터 전극(112,114)이 구비된 제1바리스터층과 제2바리스터 전극(116)이 구비된 제2바리스터층이 반복적으로 교호 적층될 수 있다. 이에 의해 정전기의 경로가 병렬로 복수 개가 구비되므로 정전기에 대한 응답특성을 더욱 향상시킬 수 있다. In addition, the first varistor electrodes 112 and 114 may be disposed above and below the second varistor electrode 116. That is, the first varistor layer provided with the first varistor electrodes 112 and 114 and the second varistor layer provided with the second varistor electrode 116 may be alternately stacked alternately. Accordingly, since a plurality of paths of static electricity are provided in parallel, response characteristics to static electricity can be further improved.
또한, 상기 제1바리스터 전극(112,114) 및 제2바리스터 전극(116)은 Ag, Pd, Pt, Au, Ni, 및 Cu 중 적어도 1종 이상을 포함할 수 있다. 일례로, 제1바리스터 전극(112,114) 및 제2바리스터 전극(116)은 Ag 단독으로 사용되는 경우 정전기(ESD) 내성이 열화될 수 있기 때문에 Ag에 상기 열거된 성분 중 적어도 하나를 합금화 한 전극이 사용될 수 있다. 또한, 상기 바리스터 전극(112,114)은 두께가 1 ~ 10㎛이고, 폭은 50 ~ 400㎛이며, 길이는 50 ~ 800㎛일 수 있으나 이에 제한되는 것은 아니다.In addition, the first varistor electrodes 112 and 114 and the second varistor electrode 116 may include at least one of Ag, Pd, Pt, Au, Ni, and Cu. For example, since the first varistor electrodes 112 and 114 and the second varistor electrode 116 may deteriorate electrostatic (ESD) resistance when used alone with Ag, an electrode alloying at least one of the components listed above with Ag may be used. Can be used. In addition, the varistor electrodes 112 and 114 may have a thickness of 1 to 10 μm, a width of 50 to 400 μm, and a length of 50 to 800 μm, but are not limited thereto.
또한, 일부의 상기 바리스터 전극(112,114)은 제1소체(110a)의 길이방향 양측에 적어도 끝단이 노출되며, 노출된 바리스터 전극(112,114)의 끝단은 후술하는 한 쌍의 외부단자(140)에 각각 전기적으로 연결된다.In addition, at least some of the varistor electrodes 112 and 114 are exposed at both ends in the longitudinal direction of the first body 110a, and the ends of the exposed varistor electrodes 112 and 114 are respectively connected to a pair of external terminals 140 to be described later. It is electrically connected.
또한, 도 5b에 도시된 것과 같이 다른 실시예에 의한 바리스터부(110')는 수직 이격하여 상호 대향되도록 복수개의 제1바리스터 전극(112,114,118)이 전극 길이방향으로 소정의 간격 이격하여 정렬되고, 수직하여 이격된 제1바리스터 전극(112,114,118) 간 사이에 제2바리스터 전극(116)이 제1바리스터 전극(112,114,118) 간 수평으로 이격된 부분에 대응하도록 배치될 수 있다. 다만, 본 발명의 복합소자에 구비될 수 있는 바리스터부의 바리스터 전극개수와 배치구조는 도 5a 및 도 5b에 한정되는 것은 아니다. In addition, as shown in FIG. 5B, the plurality of first varistor electrodes 112, 114, and 118 are arranged at predetermined intervals in the longitudinal direction of the electrodes so that the varistor parts 110 'according to another embodiment are vertically spaced to face each other. Thus, the second varistor electrode 116 may be disposed between the spaced apart first varistor electrodes 112, 114, 118 to correspond to the horizontally spaced portion between the first varistor electrodes 112, 114, 118. However, the number of varistor electrodes and the arrangement structure of the varistor parts that may be provided in the composite device of the present invention are not limited to FIGS. 5A and 5B.
또한, 도 5c 및 도 8에 도시된 것과 같이 바리스터부(110")는 외부단자(140)와 바리스터 전극(112,114) 간 도통 신뢰성을 향상시키기 위하여, 바리스터 전극(112,114)이 노출된 제1소체(110a) 양측에 한 쌍의 제1외부전극(142)을 더 구비한 것일 수 있다.In addition, as illustrated in FIGS. 5C and 8, the varistor portion 110 ″ has a first body (varistor electrodes 112 and 114) exposed to improve the reliability of conduction between the external terminal 140 and the varistor electrodes 112 and 114 ( 110a) A pair of first external electrodes 142 may be further provided on both sides.
다음으로 상기 커패시터부(120)는 제2소체(120a) 및 커패시터 전극(122,124)을 포함한다. 또한, 도 6a에 도시된 것과 같이, 상기 커패시터 전극(122,124)은 제2소체(120a)의 길이방향 양측에 적어도 끝단이 노출되며, 노출된 커패시터 전극(122,124)의 끝단은 후술하는 한 쌍의 외부단자(140)에 각각 전기적으로 연결된다. Next, the capacitor unit 120 includes a second body 120a and capacitor electrodes 122 and 124. In addition, as illustrated in FIG. 6A, the capacitor electrodes 122 and 124 are exposed at least at both ends of the second body 120a in the lengthwise direction, and the ends of the exposed capacitor electrodes 122 and 124 are external to a pair described later. Each terminal 140 is electrically connected to each other.
상기 커패시터부(120)는 통신 목적에 대응하는 대역별 통신신호를 감쇄 없이 전달하는 기능을 수행한다. 특히, 복합소자(100)가 안테나로 사용되는 영역을 포함하는 전자장치의 인체 접촉가능 전도체인 메탈 케이스와 내장 회로부 사이를 연결하는 소자로 사용될 때, 상기 안테나로 사용되는 메탈 케이스로부터 유입되는 통신신호를 통과시키며, 통신주파수 대역에서 상기 통신신호가 감쇄 없이 통과하는 동시에 상기 내장 회로부의 접지로부터 유입되는 상기 전자장치의 외부전원에 의한 누설전류 중 DC 성분의 차단능력을 향상시킬 수 있다. The capacitor unit 120 performs a function of transmitting communication signals for each band corresponding to a communication purpose without attenuation. Particularly, when the composite element 100 is used as an element that connects between a metal case that is a human body contactable conductor of an electronic device including an area used as an antenna and an internal circuit, a communication signal flowing from the metal case used as the antenna Through, the communication signal in the communication frequency band passes without attenuation, and at the same time, it is possible to improve the blocking capability of the DC component in the leakage current by the external power supply of the electronic device flowing from the ground of the internal circuit.
또한, 상기 제2소체(120a)는 유전체를 포함하며, 일례로, Ti, Si, Sr, Bi, W, 및 Nd으로 이루어진 군에서 선택된 적어도 1종의 산화물과 티탄산바륨(BaTiO3)을 포함할 수 있다. 여기서, 제2소체(120a)는 복수의 세라믹층이 적층되어 일체로 형성되고, 상기 커패시터 전극(122,124)은 세라믹층 적층방향으로 이웃한 전극끼리 전극의 일부가 상호 대향하도록 적어도 2개의 세라믹층 상에 각각 형성된다. 즉, 하나의 세라믹층 상에 하나의 커패시터 전극이 구비되므로, 커패시터 전극의 개수와 배치 구조에 따라 세라믹층은 복수 개로 구성될 수 있다.In addition, the second body (120a) includes a dielectric, for example, at least one oxide selected from the group consisting of Ti, Si, Sr, Bi, W, and Nd and barium titanate (BaTiO 3 ) Can. Here, the second body 120a is formed integrally by stacking a plurality of ceramic layers, and the capacitor electrodes 122 and 124 are formed on at least two ceramic layers so that a part of the electrodes between the adjacent electrodes in the stacking direction of the ceramic layers face each other. Respectively. That is, since one capacitor electrode is provided on one ceramic layer, a plurality of ceramic layers may be formed according to the number and arrangement of capacitor electrodes.
이와 같이, 유전체를 이용하여 커패시터부(120)를 구현함으로써, 커패시턴스의 대용량 구현이 용이하지 않은 바리스터부(110)의 특성을 보완하여 대용량이면서 다양한 값으로 커패시턴스를 용이하게 구현할 수 있다.As described above, by implementing the capacitor unit 120 using a dielectric, the characteristics of the varistor unit 110, which is not easy to implement a large capacity of capacitance, can be supplemented to easily implement capacitance with various values while being large.
특히, 커패시터부(120)는 바리스터부(110)와의 영향이 배제되어 내부에 적층 형성되는 커패시터 전극(122,124)의 간격을 보다 조밀하게 형성시켜 커패시터 전극(122,124)의 적층 수를 증가시키거나, 제2소체(120a)를 고유전율인 재료로 제조해 고용량의 커패시턴스 구현이 용이할 수 있다. Particularly, the capacitor unit 120 excludes the influence with the varistor unit 110 to form a denser gap between the capacitor electrodes 122 and 124 that are stacked therein to increase the number of stacks of the capacitor electrodes 122 and 124. 2 The body 120a may be made of a material having a high dielectric constant, so that high-capacity capacitance can be easily implemented.
아울러, 바리스터부(110)와 별도로 커패시터부(120)를 구현함으로써, 커패시턴스에 대한 설계 자유도가 증가하므로, 별도의 공정 변경 없이도 다양한 용량의 라인업이 가능하여 고객사의 요구에 신속히 대응할 수 있다. 또한, 고용량의 커패시턴스의 구현을 통해 통신 목적에 대응하는 대역별 통신신호를 감쇄 없이 전달할 수 있다.In addition, by implementing the capacitor unit 120 separately from the varistor unit 110, the degree of freedom in design for capacitance increases, so that a lineup of various capacities is possible without a separate process change, so that it can quickly respond to customer needs. In addition, through the implementation of high-capacitance, communication signals for each band corresponding to a communication purpose can be transmitted without attenuation.
한편, 도 2 및 도 3에 도시된 것과 같이, 상기 제2소체(120a)는 삼중점과 모서리가 라운드 처리된 곡면일 수 있다. 곡면인 삼중점과 모서리는 곡률이 형성된 지점에서의 후술하는 (4) 단계에서 형성되는 외부단자(140) 또는 도 6b에 도시된 커패시터부(120')와 같이 소체(120a) 외부에 더 형성될 수 있는 제2외부전극(144) 두께를 향상시킬 수 있다. 또한, 후술하는 것과 같이 외부단자(140)의 외부면에 형성될 수 있는 도금층의 번짐을 방지할 수 있으며, 외부단자(140) 손상에 따른 불량을 감소시킬 수 있다. 더불어, 곡면인 모서리는 소자에 가해지는 외력에 의해 소체가 부서지거나 손상되는 것을 완화시켜 줄 수 있다. Meanwhile, as illustrated in FIGS. 2 and 3, the second body 120a may be a curved surface having a triple point and corners rounded. The triple points and corners that are curved surfaces may be further formed outside the body 120a, such as the external terminal 140 formed in step (4) described below at the point where the curvature is formed or the capacitor unit 120 'shown in FIG. 6B. The thickness of the second external electrode 144 can be improved. In addition, as described later, it is possible to prevent smearing of the plating layer that may be formed on the outer surface of the external terminal 140, and reduce defects due to damage to the external terminal 140. In addition, the curved edge can alleviate the body from being broken or damaged by an external force applied to the device.
또한, 상기 커패시터 전극(122,124) 각각은 서로 다른 세라믹층 상에 구비될 수 있다. 즉, 커패시터부(120)는 커패시터 전극(122,124)이 구비된 복수 개의 세라믹층이 순차적으로 적층된 후 소성되어 일체로 형성될 수 있다. 이때, 이웃한 전극끼리 전극의 일부가 상호 대향하도록 제1커패시터 전극(122)과 제2커패시터 전극(124)이 각각 구비된 서로 다른 세라믹층이 대칭되게 교호 적층될 수 있다.In addition, each of the capacitor electrodes 122 and 124 may be provided on different ceramic layers. That is, the capacitor unit 120 may be formed integrally by firing after sequentially stacking a plurality of ceramic layers provided with capacitor electrodes 122 and 124. At this time, different ceramic layers, each of which is provided with the first capacitor electrode 122 and the second capacitor electrode 124, may be alternately stacked symmetrically so that a part of the electrodes between the adjacent electrodes face each other.
이때, 커패시터부(120)는 외부전원의 정격전압(Vin)보다 큰 절연파괴 전압(Vcp)을 가질 수 있다. 이에 의해 커패시터부(120)는 외부전원에 의한 누설전류가 유입되는 경우, 누설전류를 차단하여 사용자의 감전을 방지할 수 있다.At this time, the capacitor unit 120 may have an insulation breakdown voltage Vcp greater than the rated voltage Vin of the external power supply. Accordingly, when the leakage current from the external power flows into the capacitor unit 120, the leakage current may be cut off to prevent electric shock of the user.
여기서, 커패시터 전극(122,124) 사이의 거리는 10㎛ 이상일 수 있다. 이와 같이, 커패시터 전극(122,124)은 사이의 간격을 충분히 확보함으로써, 무선 통신에 적합한 커패시턴스를 구현하는 동시에 누설전류 차단을 위한 절연파괴 전압(Vcp)을 증대시킬 수 있다. Here, the distance between the capacitor electrodes 122 and 124 may be 10 μm or more. As described above, the capacitor electrodes 122 and 124 sufficiently secure a gap therebetween, thereby realizing a capacitance suitable for wireless communication and increasing the breakdown voltage Vcp for blocking leakage current.
또한, 커패시터 전극(122,124)은 Ag, Pd, Pt, Au, Ni, 및 Cu 중 적어도 1종 이상을 포함할 수 있다. 일례로, 커패시터 전극(122,124)은 Ag 단독으로 사용되는 경우 정전기(ESD) 내성이 열화될 수 있기 때문에 Ag에 상기 열거된 성분 중 적어도 하나를 합금화한 합금전극을 사용할 수 있다. 또한, 상기 커패시터 전극(122,124)은 두께가 1 ~ 10㎛이고, 폭은 50 ~ 400㎛이며, 길이는 50 ~ 800㎛일 수 있으나 이에 제한되는 것은 아니다.Further, the capacitor electrodes 122 and 124 may include at least one of Ag, Pd, Pt, Au, Ni, and Cu. As an example, since the capacitor electrodes 122 and 124 may deteriorate electrostatic (ESD) resistance when Ag alone is used, an alloy electrode in which at least one of the components listed above is alloyed with Ag may be used. In addition, the capacitor electrodes 122 and 124 may have a thickness of 1 to 10 μm, a width of 50 to 400 μm, and a length of 50 to 800 μm, but are not limited thereto.
준비되는 바리스터부(110)와 커패시터부(120)는 대략 동일한 두께로 구비될 수 있지만, 이에 한정되지 않으며, 용도에 따라 두께는 서로 상이하게 구비될 수 있고, 일예로 바리스터부(110)가 커패시터부(120)보다 두께가 두꺼울 수 있다. 특히, 0.36㎣ 의 작은 부피를 갖는 복합소자(100)로 구현되는 경우에는 목적하는 성능의 정전기 방호, 누설전류의 차단을 위하여 바리스터부(110)의 높이가 커패시터부(120) 높이보다 크거나 같을 수 있다.The prepared varistor unit 110 and the capacitor unit 120 may be provided with approximately the same thickness, but are not limited thereto, and the thickness may be provided differently depending on the application. For example, the varistor unit 110 may be a capacitor. It may be thicker than the portion 120. In particular, when implemented as a composite device 100 having a small volume of 0.36 부피, the height of the varistor unit 110 is greater than or equal to the height of the capacitor unit 120 in order to protect the static electricity of the desired performance and to prevent leakage current. You can.
또한, 바리스터부(110)와 커패시터부(120)의 길이와 폭은 대략 동일할 수 있고 이를 통해 소자를 적층시킨 뒤 정렬이 용이하고 접착강도를 담보하기에 유리할 수 있으나, 이에 제한되는 것은 아니다.In addition, the length and width of the varistor unit 110 and the capacitor unit 120 may be approximately the same and may be advantageous in order to facilitate alignment and secure adhesive strength after stacking elements through this, but is not limited thereto.
다음으로 본 발명의 (2) 단계로써, 상기 바리스터부 또는 상기 커패시터부의 상부면에 상기 상부면 전체면적의 50 ~ 85%를 덮도록 가접합부를 형성시키는 단계를 수행한다. Next, as a step (2) of the present invention, a step of forming a provisional junction to cover 50 to 85% of the total area of the upper surface on the upper surface of the varistor portion or the capacitor portion is performed.
상기 바리스터부(110) 및 커패시터부(120)는 어느 하나가 다른 하나의 상부에 적층되어 복합화 될 수 있다. 이에 따라서 상기 가접합부는 상기 바리스터부(110) 또는 상기 커패시터부(120)의 상부면에 형성될 수 있고, 가접합부가 형성되지 않은 나머지 다른 하나가 가접합부 상부에 적층될 수 있다. 이때, 가접합부가 형성되는, 즉 적층구조에서 하부에 배치되는 소자는 제한이 없지만 바람직하게는 복합소자(100)가 회로기판에 솔더링 작업 시 신뢰성 측면을 고려하여 도 7 및 도 9와 같이 우수한 유전체로 이루어진 커패시터부(120,120')가 하부에 배치될 수 있으며, 이 경우 가접합부(130a)는 커패시터부(120,120')의 상부면에 형성될 수 있다. 다만, 바리스터부(110)와 커패시터부(120)가 적층 되었을 때 마주보는 두 면의 면적이 다를 경우 면적이 작은 소자의 상부면의 전체 면적을 기준으로 가접합부가 형성될 수 있다. 이하, 가접합부(130a)가 커패시터(120,120') 상부면에 형성되는 경우를 기준으로 설명하나, 이에 제한되지 않으며 바리스터부(110,110',110") 상부면에 형성될 수도 있음을 밝혀둔다.The varistor unit 110 and the capacitor unit 120 may be combined by stacking one on top of the other. Accordingly, the provisional bonding portion may be formed on the upper surface of the varistor portion 110 or the capacitor portion 120, and the other one of which the provisional bonding portion is not formed may be stacked on the upper portion of the provisional bonding portion. At this time, the temporary junction is formed, that is, the element disposed in the lower portion of the stacked structure is not limited, but preferably, the composite element 100 is excellent in dielectric properties as shown in FIGS. 7 and 9 in consideration of reliability when soldering the circuit board. The capacitor parts 120 and 120 'made of may be disposed at the bottom, and in this case, the temporary bonding part 130a may be formed on the upper surface of the capacitor parts 120 and 120'. However, when the area of the two surfaces facing each other when the varistor unit 110 and the capacitor unit 120 are stacked, a provisional junction may be formed based on the total area of the upper surface of the device having a small area. Hereinafter, it will be described based on the case where the temporary bonding portion 130a is formed on the upper surfaces of the capacitors 120 and 120 ', but it is not limited thereto, and it is revealed that the varistors 110, 110' and 110 "may be formed on the upper surface.
도 7 및 도 9를 참조하여 설명하면, 커패시터부(120,120')의 상부면에 형성된 가접합부(130a)는 상기 상부면 전체면적에 대해 50 ~ 85%의 면적으로 상부면을 덮을 수 있고, 보다 바람직하게는 58 ~ 70%의 면적으로 상부면을 덮을 수 있으며, 이를 통해 후술하는 (3) 단계를 통한 접합 과정에서 발생할 수 있는 접합신뢰성, 전기적 신뢰성 및 외관품질의 저하를 방지할 수 있다. Referring to FIGS. 7 and 9, the provisional bonding portion 130a formed on the upper surface of the capacitor units 120 and 120 'may cover the upper surface with an area of 50 to 85% of the total area of the upper surface, more Preferably, the upper surface may be covered with an area of 58 to 70%, thereby preventing degradation of bonding reliability, electrical reliability, and appearance quality that may occur in the bonding process through step (3) described later.
만일 가접합부(130a)가 형성된 면적이 커패시터부(120,120') 상부면 전체면적에 대해 50% 미만일 경우 접합력이 현저히 감소하고, 적층된 바리스터부(110,110',110")와 커패시터부(120,120') 측면에 형성된 홈의 깊이가 현저히 증가하여 후술하는 (4) 단계 수행 중 외부단자를 형성시키기 위한 외부 단자 형성조성물(140a)이 도 4와 같이 모세관 현상을 통해 홈을 타고 올라가 전극을 형성함에 따라서 한 쌍의 외부단자(140)가 도통될 가능성이 증가하여 전기적 신뢰성이 저하될 수 있다. 또한, 외부단자가 소체에 번지게 됨에 따른 외관품질이 저하될 수 있다. 나아가, 경우에 따라 길이/폭 중 어느 하나가 과도하게 형성될 경우 외관품질 저하도 유발할 수 있다. 또한, 만일 가접합부(130a)가 형성된 면적이 커패시터부(120,120') 상부면의 면적에 대해 90%를 초과할 경우 가접합부(130a)가 소체의 측면으로 흘러나와 외관품질을 저하시킬 우려가 있다. If the area where the temporary bonding portion 130a is formed is less than 50% of the total area of the upper surface of the capacitor portions 120 and 120 ', the bonding force is significantly reduced, and the stacked varistor portions 110, 110', 110 "and the capacitor portions 120, 120 ' As the depth of the groove formed on the side surface is significantly increased, the external terminal forming composition 140a for forming the external terminal during step (4) described later climbs the groove through the capillary phenomenon as shown in FIG. 4 to form an electrode. The electrical reliability may decrease due to an increase in the possibility that the pair of external terminals 140 conducts, and the appearance quality may deteriorate as the external terminals spread on the body. If any one is excessively formed, the appearance quality may also be deteriorated, and if the area where the provisional bonding part 130a is formed exceeds 90% of the area of the upper surface of the capacitor parts 120 and 120 ' The (130a) there is a possibility that flows to the side of the body decreases the appearance quality.
보다 바람직하게는 상기 가접합부(130a)는 상술한 면적조건을 만족하는 경우에도 길이와 폭이 소정의 범위를 갖도록 형성될 때 더욱 향상된 접합신뢰성, 전기적 신뢰성 및 외관품질을 달성할 수 있다. 구체적으로 상기 가접합부(130a)의 길이(ℓ')는 상기 상부면 길이(ℓ)에 대하여 50 ~ 95% 일 수 있고, 보다 바람직하게는 70 ~ 95%, 보다 더 바람직하게는 70 ~ 90%일 수 있으며, 더욱 바람직하게는 77 ~ 90%일 수 있다. 또한, 가접합부(130a)의 폭(w')은 상기 상부면 폭(w)에 대하여 50 ~ 90%일 수 있고, 보다 바람직하게는 70 ~ 90%, 보다 더 바람직하게는 70 ~ 81%일 수 있다. More preferably, the provisional joining portion 130a can achieve more improved joining reliability, electrical reliability, and appearance quality when the length and width are formed to have a predetermined range even when the above-described area conditions are satisfied. Specifically, the length (ℓ ') of the temporary joining portion 130a may be 50 to 95% with respect to the length of the upper surface (ℓ), more preferably 70 to 95%, even more preferably 70 to 90% It may be, more preferably 77 to 90%. In addition, the width (w ') of the temporary bonding portion (130a) may be 50 to 90% with respect to the upper surface width (w), more preferably 70 to 90%, even more preferably 70 to 81% You can.
만일, 가접합부(130a)의 길이(ℓ')가 상기 상부면 길이(ℓ)에 대하여 50% 미만일 경우 바리스터부와 커패시터부의 부착성 저하, 외부전극 번짐에 의한 외관 불량, 신뢰성 불량 등이 발생할 수 있으며, 접착력을 보유하기 위해서는 상대적으로 폭이 넓게 형성될 수 있어서 외관품질 저하의 우려가 있다. 또한, 만일 길이가 90%를 초과할 경우 바리스터 전극 및 커패시터 전극이 형성된 소체의 양측으로 가접합부가 흘러서 바리스터 전극 및/또는 커패시터 전극을 오염 또는 덮어버려서 전기적 신뢰성 저하, 외관품질 저하 등을 유발할 수 있다. 또한, 과도하게 형성된 길이로 인해 상대적으로 폭이 좁게 형성될 수 있어서 접착강도도 저하될 우려가 있다. 또한 도 5c 및 도 6b와 같이 바리스터부(110")와 커패시터부(120')의 양측에 제1외부전극(142), 제2외부전극(144)이 형성된 경우 역시 가접합부가 외부전극을 오염시키거나 덮음에 따라서 전기적 신뢰성 저하를 유발시킬 수 있다. If, if the length (ℓ ') of the temporary bonding portion (130a) is less than 50% relative to the length (ℓ) of the upper surface, the adhesion of the varistor and capacitor parts may be deteriorated, poor appearance due to smearing of external electrodes, poor reliability, etc. In order to retain the adhesive strength, it may be formed in a relatively wide width, there is a fear of lowering the appearance quality. In addition, if the length exceeds 90%, the temporary junctions may flow to both sides of the body where the varistor electrode and the capacitor electrode are formed, thereby contaminating or covering the varistor electrode and / or the capacitor electrode, thereby deteriorating electrical reliability and deteriorating appearance quality. . In addition, due to the excessively formed length, the width may be relatively narrow, so that the adhesive strength may be lowered. In addition, when the first external electrode 142 and the second external electrode 144 are formed on both sides of the varistor unit 110 "and the capacitor unit 120 'as shown in FIGS. 5C and 6B, the temporary junction also contaminates the external electrode. Electrical reliability may be deteriorated depending on the covering or covering.
또한, 만일 가접합부(130a)의 폭(w')이 상기 상부면 폭(w)에 대하여 50% 미만으로 형성될 경우 결합강도 저하, 적층된 바리스터부와 커패시터부 측면에 형성된 홈의 깊이가 현저히 증가함에 따른 외부단자 형성 시 모세관 현상의 과도한 발생으로 전기적 신뢰성이 저하될 우려가 있다. 또한, 과도하게 짧게 형성된 폭을 보완하여 일정수준의 접착력을 발현시키기 위해 상대적으로 길이가 길게 형성될 수 있는데, 이 경우 외관품질의 저하도 유발될 수 있다. In addition, if the width (w ') of the temporary joining portion (130a) is less than 50% of the upper surface width (w), the bonding strength is reduced, the depth of the groove formed on the side of the stacked varistor and capacitor portions is significantly When the external terminal is formed, the electrical reliability may be deteriorated due to excessive occurrence of the capillary phenomenon. In addition, a relatively long length may be formed to complement a width formed excessively short to express a certain level of adhesion, and in this case, a decrease in appearance quality may also be caused.
만일 가접합부(130a)의 폭(w')이 상기 상부면 폭(w)에 대하여 90%를 초과하여 형성될 경우 폭 방향으로 가접합부가 과도하게 흘러서 외관의 품질을 저하시킬 수 있다. 또한, 폭이 과도하게 넓게 형성될 경우 상대적으로 길이가 짧게 형성될 수 있고, 이 경우 접착강도도 저하될 우려가 있다.If the width (w ') of the temporary bonding portion (130a) is formed in excess of 90% with respect to the upper surface width (w), the temporary bonding portion may flow excessively in the width direction, thereby deteriorating the appearance quality. In addition, when the width is excessively wide, the length may be relatively short, and in this case, there is a fear that the adhesive strength is also lowered.
또한, 상기 가접합부(130a)의 두께는 15 ~ 60㎛로 형성될 수 있고, 보다 바람직하게는 15 ~ 40㎛로 형성될 수 있다. 만일 두께가 15㎛미만일 경우 결합강도 저하의 우려가 있고, 60㎛를 초과할 경우 가접합부 형성 및/또는 접합공정에서 소자의 측면으로 가접합부가 과도하게 흘러서 전기적 신뢰성 저하 및 외관품질 저하의 우려가 있다.In addition, the thickness of the temporary bonding portion 130a may be formed of 15 to 60 μm, and more preferably 15 to 40 μm. If the thickness is less than 15 µm, there is a fear of lowering the bonding strength, and if it exceeds 60 µm, there is a fear that the temporary joining portion excessively flows to the side of the device during the provisional joining and / or joining process, thereby lowering electrical reliability and deteriorating appearance quality. have.
상기 가접합부(130a)는 SMT 설비 또는 지그를 사용하여 정렬한 상태에서 커패시터(120) 상부면에 스크린 또는 디스펜싱 방식으로 접합조성물을 처리하여 가접합부(130a)를 형성시킬 수 있다. 또한, 가접합부(130a)를 형성시키는 과정에서 처리된 접합조성물에 포함된 용매에 대한 건조공정을 거칠 수 있고, 상기 건조공정은 실온에서 일정 시간 동안 방치하거나, 경화가 일어나지 않거나 또는 B-stage 상태 정도로 부분경화가 일어날 정도의 열을 가해 건조시킬 수 있다.The temporary bonding unit 130a may form a temporary bonding unit 130a by processing a bonding composition on the upper surface of the capacitor 120 by a screen or a dispensing method in an aligned state using an SMT facility or a jig. In addition, the drying process for the solvent contained in the bonding composition processed in the process of forming the provisional bonding part 130a may be performed, and the drying process may be left at room temperature for a certain period of time, or curing may not occur or the B-stage state It can be dried by applying heat to the extent that partial curing occurs.
상기 접합조성물은 최종 구현된 접합부(130)가 유기화합물이 경화되어 형성되는 고분자접합부 또는 유리성분이 소성된 유리질 접합부일 수 있도록 공지된 조성을 갖는 것일 수 있다. The bonding composition may have a known composition such that the final implemented bonding part 130 may be a polymer bonding part formed by curing an organic compound or a glassy bonding part having a glass component fired.
도 1을 참고하여 설명하면 최종 구현된 접합부(130)가 고분자접합부인 경우 한정된 부피공간의 복합소자(100)에서 접합부(130)가 차지하는 부피가 작도록 보다 얇은 두께로 구현되면서도 바리스터부(110)와 커패시터부(120) 간 우수한 접합강도를 발현할 수 있다. 또한, 250℃ 이하의 비교적 낮은 온도나 광을 통해 쉽게 경화시킬 수 있어서 형성이 용이하며, 접합을 위해 가해지는 열이 비교적 낮아서 바리스터부(110) 및/또는 커패시터부(120)의 손상이나 변형을 예방할 수 있다. 또한, 상기 고분자접합부는 바람직하게는 절연저항은 10㏁이상일 수 있고, 고전압의 ESD에 의해 절연파괴 되지 않도록 절연파괴강도는 20kV/㎜ 이상을 만족하도록 구현될 수 있다. Referring to FIG. 1, when the final implemented junction 130 is a polymer junction, the varistor 110 is implemented with a thinner thickness so that the volume occupied by the junction 130 in the composite device 100 in a limited volume space is small. And the capacitor unit 120 may exhibit excellent bonding strength. In addition, it can be easily cured through a relatively low temperature or light of 250 ° C. or less, so that it is easy to form, and the heat applied for bonding is relatively low, thereby preventing damage or deformation of the varistor 110 and / or capacitor 120. Can be prevented. In addition, the polymer junction may preferably have an insulation resistance of 10 kV or more, and an insulation breakdown strength of 20 kV / mm or more to prevent insulation breakdown by high voltage ESD.
상기 고분자접합부는 에폭시계, 우레탄계, 아크릴계, 에스테르계 등 공지된 유기화합물이 경화제를 통해 가교되어 형성될 수 있으며, 이에 대한 구체적 종류는 본 발명에서 특별히 한정하지 않는다. 일예로써, 에폭시계 성분을 사용하는 경우에 대해 설명하면, 에폭시 성분, 경화제, 글래스필러 및 용매를 포함하는 접합조성물이 경화되어 고분자접합부를 형성할 수 있다. The polymer bonding portion may be formed by crosslinking a known organic compound such as an epoxy-based, urethane-based, acrylic-based, or ester-based curing agent through a curing agent, and the specific type thereof is not particularly limited in the present invention. As an example, when using an epoxy-based component, a bonding composition including an epoxy component, a curing agent, a glass filler, and a solvent may be cured to form a polymer junction.
이때, 상기 에폭시 성분은 공지된 것을 사용할 수 있으나, 바람직하게는 상술한 것과 같이 바리스터부(110)와 커패시터부(120)를 전기적 및 열적으로 분리시키기 위하여 비도전성, 내열특성을 가지는 경화체를 형성할 수 있고, 도포 시 요변성이 크고 도포 후 요변성이 적어지며, 경시변화성이 적고, 보관 안정성이 우수하며, 경화시 수축특성이 적고, 적은 기체를 발생시킬 수 있는 성분일 수 있다. At this time, the epoxy component may be a known one, but preferably to form a cured body having a non-conductive, heat-resistant property to electrically and thermally separate the varistor portion 110 and the capacitor portion 120 as described above. It can be a component capable of generating a large amount of thixotropy during application, less thixotropy after application, less aging change, excellent storage stability, less shrinkage during curing, and less gas.
또한, 상기 경화제는 선택된 에폭시 성분과 함께 경화되어 접합부가 비도전성, 내열특성을 발현하도록 하는 공지된 것을 사용할 수 있으며, 구체적으로 선택된 에폭시 성분의 종류에 따라 구체적인 종류와 함량이 결정될 수 있음에 따라서 본 발명은 이에 대해 특별히 한정하지 않는다.In addition, the curing agent can be used with a known epoxy so that the joint is cured together with the selected epoxy component to exhibit non-conductive, heat-resistant properties, according to the specific type and content can be determined according to the type of the specifically selected epoxy component The invention is not particularly limited.
또한, 상기 글래스 필러는 바리스터부(110)와 커패시터부(120)의 결합강도를 향상시키고, 접합조성물의 흐름성을 향상시키기 위하여 구비되며, 바람직하게는 접합부(130) 전체 중량의 20 ~ 65중량%, 보다 바람직하게는 40 ~ 55중량%가 되도록 접합조성물에 구비됨이 좋다. 만일 글래스 필러가 최종 접합부(130) 전체 중량의 20중량% 미만으로 구비되는 경우 결합강도가 저하되고, 흐름성이 좋지 않아서 소정의 얇은 두께로 균일도막이 어려울 수 있는 문제가 있다. 또한, 만일 글래스 필러가 65중량%를 초과하여 구비되는 경우 에폭시 성분의 함량 감소로 목적하는 결합강도를 발현할 수 없고, 과도한 흐름성으로 인해 접합조성물의 도막을 제어하기 어려울 수 있는 등 목적하는 효과를 달성하기 어려울 수 있다.In addition, the glass filler is provided to improve the bonding strength of the varistor portion 110 and the capacitor portion 120, and to improve the flowability of the bonding composition, preferably 20 to 65 weight of the total weight of the bonding portion 130 %, More preferably 40 to 55% by weight, it is good to be provided in the bonding composition. If the glass filler is provided at less than 20% by weight of the total weight of the final joint 130, there is a problem that the bonding strength is lowered and the uniformity of the coating film may be difficult due to poor flowability. In addition, if the glass filler is provided in excess of 65% by weight, the desired effect, such as a decrease in the content of the epoxy component can not express the desired bonding strength, it may be difficult to control the coating film of the bonding composition due to excessive flowability It can be difficult to achieve.
상기 글래스 필러는 공지된 것을 사용할 수 있으며, 일예로 알루미늄, 규소, 게르마늄, 인듐, 주석, 납, 인, 붕소, 갈륨, 리튬, 나트륨, 칼륨, 루비듐, 세슘, 베릴륨, 마그네슘, 칼슘, 스트론튬, 바륨, 네오디뮴, 프라세오디뮴, 에르븀, 세륨, 티탄, 지르코늄, 탄탈, 아연, 텅스텐, 바나듐, 크롬, 망간, 철, 코발트, 니켈, 구리 및 몰리브덴 중 선택된 1종 이상의 원소, 또는 이들을 포함하는 화합물일 수 있고, 보다 바람직하게는 아연, 규소, 붕소 및 망간 또는 아연, 규소, 붕소 및 알루미늄 중 선택된 1종의 원소 또는 이들 1종 이상을 포함하는 화합물일 수 있으며, 일예로 이산화규소일 수 있다. The glass filler may be a known one, for example, aluminum, silicon, germanium, indium, tin, lead, phosphorus, boron, gallium, lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium , Neodymium, praseodymium, erbium, cerium, titanium, zirconium, tantalum, zinc, tungsten, vanadium, chromium, manganese, iron, cobalt, nickel, copper and molybdenum, or one or more elements, or a compound containing them, More preferably, it may be zinc, silicon, boron and manganese, or one or more elements selected from zinc, silicon, boron and aluminum, or a compound containing one or more of them, and may be, for example, silicon dioxide.
상기 글래스 필러는 입상으로 조성물에 포함될 수 있고, 이때, 글래스 필러의 평균입경은 0.1 ~ 10㎛일 수 있으며, 이를 통해 분산성을 향상시킬 수 있고, 제1소체(110a) 및 제2소체(120a)와 맞닿는 전 영역에서 향상된 접착력을 발현할 수 있다.The glass filler may be included in the composition in the form of granules, and in this case, the average particle diameter of the glass filler may be 0.1 to 10 μm, thereby improving dispersibility, and the first body 110a and the second body 120a. ) Can exhibit improved adhesion in all areas of contact with
한편, 상기 접합조성물에는 작업성을 향상시키기 위하여 안료가 더 포함될 수 있고, 일예로 MnFe2O4일 수 있으며, 접합부 전체 중량의 5 ~ 15중량%로 구비될 수 있는데, 이에 제한되는 것은 아니며, 포함되는 안료의 종류에 따라서 함량이 변경될 수 있다.Meanwhile, the bonding composition may further include a pigment to improve workability, and may be, for example, MnFe 2 O 4 , and may be provided at 5 to 15% by weight of the total weight of the bonding portion, but is not limited thereto. The content may be changed depending on the type of pigment included.
또한, 상기 접합조성물은 경화촉진제, 요변성제, 레벨링제, 분산제 등 공지된 첨가제가 더 포함될 수 있으며, 본 발명은 이에 대해 특별히 한정하지 않는다.In addition, the bonding composition may further include a known additive such as a curing accelerator, thixotropic agent, leveling agent, dispersant, and the present invention is not particularly limited.
한편, 최종 구현되는 접합부(130)가 유리질접합부인 경우 유리성분을 포함하는 접합조성물로 형성된 가접합부가 소성되면서 접합부를 형성하고 이 과정에서 제1소체(110a)와 제2소체(120a)가 접합될 수 있다. 상기 유리질접합부는 상술한 고분자접합부에 대비하여 상기 유리질접합부는 소성온도가 후술하는 외부단자(140)의 경화 또는 소성온도보다 높은 소성온도를 갖는 유리성분으로 구현됨이 바람직하다. 만일 유리질접합부의 소성온도가 외부단자(140)의 경화 또는 소성온도보다 낮을 경우 외부단자의 형성과정에서 가해지는 열에 의해 유리질접합부가 부분 또는 전부 용융되거나 연화되어 접합된 바리스터부(110)와 커패시터부(120)의 상하좌우 중 어느 하나 이상의 틀어짐이 발생할 수 있고, 제품신뢰성을 저하시킬 수 있는 등 목적하는 효과를 발현하기 어려울 수 있다. 상기 유리성분은 SiO2, B2O3, BaO, CaO, Na2O, ZnO, Al2O3 및 PbO로 이루어진 군에서 선택된 1종 이상을 포함할 수 있으며, 이에 한정되는 것은 아니다. 또한, 상기 유리성분은 외부단자의 경화 또는 소성온도를 고려하여 적절히 선택될 수 있다.On the other hand, when the final bonding part 130 is a glassy bonding part, a temporary bonding part formed of a bonding composition containing a glass component is fired to form a bonding part, and in this process, the first body 110a and the second body 120a are joined. Can be. It is preferable that the vitreous junction part is implemented with a glass component having a calcination temperature higher than the calcination temperature or the calcination temperature of the external terminal 140 having a calcination temperature, as compared to the above-described polymer junction part. If the firing temperature of the glassy junction is lower than the curing or firing temperature of the external terminal 140, the varistor 110 and the capacitor unit are fused by melting or softening the glassy junction part or all by heat applied during the formation of the external terminal. Any one or more distortions of the top, bottom, left, and right of (120) may occur, and it may be difficult to express desired effects, such as deteriorating product reliability. The glass component may include one or more selected from the group consisting of SiO 2 , B 2 O 3 , BaO, CaO, Na 2 O, ZnO, Al 2 O 3 and PbO, but is not limited thereto. In addition, the glass component may be appropriately selected in consideration of the curing or firing temperature of the external terminal.
다음으로 본 발명에 따른 (3) 단계로써, 상기 바리스터부 또는 상기 커패시터부의 상부면에 구비된 가접합부 상에 전극의 노출방향이 같도록 나머지 다른 하나를 적층시킨 뒤 접합부를 형성시키는 단계를 수행한다.Next, as a step (3) according to the present invention, a step of forming a junction after stacking the other one on the provisional junction provided on the upper surface of the varistor portion or the capacitor portion so that the electrode has the same exposure direction is formed. .
도 7에 도시된 것과 같이 커패시터부(120) 상부면에 가접합부(130a)가 형성된 경우로 설명하면, 가접합부(130a) 상부에 바리스터부(110)가 적층되며, 이때, 바리스터부(110)와 커패시터부(120)는 도 3에 도시된 것과 같이 바리스터 전극(112)과 커패시터 전극(122)의 노출방향이 같도록 적층된다. 이 경우 단일의 외부단자(140)를 통해 바리스터 전극(112)과 커패시터 전극(122)을 동시에 전기적 병렬 접속시킬 수 있고, 동시에 바리스터부(110)와 커패시터부(120)의 틀어짐 등의 결함을 방지할 수 있는 이점이 있다.If the temporary junction 130a is formed on the upper surface of the capacitor 120 as illustrated in FIG. 7, the varistor 110 is stacked on the temporary junction 130a, and at this time, the varistor 110 And the capacitor unit 120 are stacked such that the varistor electrode 112 and the capacitor electrode 122 have the same exposure direction as illustrated in FIG. 3. In this case, the varistor electrode 112 and the capacitor electrode 122 can be simultaneously and electrically connected in parallel through a single external terminal 140, and at the same time, defects such as distortion of the varistor unit 110 and the capacitor unit 120 are prevented. There is an advantage to do.
상기 바리스터부(110)는 SMT 설비 또는 지그를 사용하여 커패시터부(120)의 상부에 적층된 후 접합될 수 있다. 이때, 바리스터부(110)와 커패시터부(120)의 정렬 공차는 50㎛이하가 되도록 적층 및 접합될 수 있다.The varistor unit 110 may be laminated after being stacked on the upper portion of the capacitor unit 120 using an SMT facility or a jig. At this time, the alignment tolerance between the varistor unit 110 and the capacitor unit 120 may be laminated and bonded to be 50 μm or less.
또한, 가접합부(130a)가 접합부(130)로 경화되면서 내부에 기포나 공동이 발생하지 않도록 바리스터부(110)와 커패시터부(120)를 서로 충분히 밀착시켜 접합할 수 있다. 상기 가접합부(130a)는 접합조성물의 종류에 따라 열이나 광을 통해 경화되어 접합부(130)를 형성할 수 있고, 일예로 열경화형 접합조성물인 경우 70 ~ 250℃로 열을 가할 수 있으나 이에 제한되는 것은 아니다.In addition, the varistor unit 110 and the capacitor unit 120 may be sufficiently in close contact with each other so that no bubbles or cavities are generated therein while the temporary bonding unit 130a is cured into the bonding unit 130. The temporary bonding unit 130a may be cured through heat or light depending on the type of the bonding composition to form the bonding unit 130. For example, in the case of a thermosetting bonding composition, heat may be applied at 70 to 250 ° C. It does not work.
다음으로 본 발명에 따른 (4) 단계로써, 접합된 바리스터부(110)와 커패시터부(120)에서 전극(112,114,122,124)이 노출된 양측에 상기 바리스터 전극(112,114) 및 커패시터 전극(122,124)이 전기적 연결되도록 한 쌍의 외부단자(140)를 형성시키는 단계를 수행한다.Next, as a step (4) according to the present invention, the varistor electrode (112,114) and the capacitor electrode (122,124) is electrically connected to both sides where the electrodes (112, 114, 122, 124) are exposed from the bonded varistor unit (110) and the capacitor unit (120). Preferably, a step of forming a pair of external terminals 140 is performed.
상기 외부단자(140)는 바리스터부(110)와 커패시터부(120) 사이를 전기적으로 병렬 연결하는 동시에, 복합소자(100)를 회로기판에 솔더링 하기 위한 전극이다. 상기 외부단자(140)를 통해 정전기, 외부전원의 누설전류 및 통신신호에 대하여 바리스터부(110) 및 커패시터부(120)가 선별적으로 동작함으로써, 정전기 보호, 감전방지 및 통신신호 전달기능을 모두 수행할 수 있다.The external terminal 140 is an electrode for electrically connecting the varistor unit 110 and the capacitor unit 120 in parallel, and soldering the composite device 100 to the circuit board. The varistor unit 110 and the capacitor unit 120 are selectively operated with respect to static electricity, leakage current of external power, and communication signals through the external terminal 140, thereby protecting static electricity, preventing electric shock, and transmitting communication signals. Can be done.
상기 외부단자(140)는 제1소체(110a), 제2소체(120a)와의 결합력을 높이고, 회로 등의 외부와의 전기적 접속 및 결합력을 향상시키기 위하여 적층된 바리스터부(110)와 커패시터부(120)의 전단 및 후단과, 상기 전단 및 후단에 각각 이어지는 양 측단을 소정의 길이(도 1의 w)만큼 덮도록 구비될 수 있다. The external terminal 140 has a stacked varistor unit 110 and a capacitor unit (to increase the bonding force between the first body 110a and the second body 120a, and to improve the electrical connection and bonding strength with the outside of the circuit, etc.) 120) may be provided to cover the front end and the rear end of the 120, and both side ends respectively connected to the front end and the rear end by a predetermined length (w in FIG. 1).
한편, 상기 외부단자(140)는 공지된 도전성 금속을 포함하여 형성된 것일 수 있다. 이때, 상기 외부단자(140)는 도전성 금속이 바인더 성분과 혼합된 상태로 바리스터부(110)와 커패시터부(120)의 양측에 배치된 후 소성되어 형성된 소성형 단자이거나 도전성 금속이 바인더 성분과 혼합된 상태로 경화되어 형성된 경화형 단자일 수 있다. Meanwhile, the external terminal 140 may be formed of a known conductive metal. At this time, the external terminal 140 is a plastic-type terminal formed by firing after being disposed on both sides of the varistor unit 110 and the capacitor unit 120 in a state where the conductive metal is mixed with the binder component, or the conductive metal is mixed with the binder component It may be a cured terminal formed by curing in the state.
다만, 상기 외부단자(140)는 접합부(130)를 통해 접합된 바리스터부(110)와 커패시터부(120)의 물리, 화학적 특성을 고려하여 접합부(130)에 영향을 미치지 않는 조건에서 형성되는 것이 바람직하다. However, the external terminal 140 is formed in a condition that does not affect the junction 130 in consideration of the physical and chemical characteristics of the varistor 110 and the capacitor 120 bonded through the junction 130 desirable.
특히, 상기 접합부(130)는 상술한 것과 같은 여러 이점으로 인하여 고분자접합부일 수 있는데, 통상적으로 고분자접합부는 400℃ 이상 온도조건에서 온전히 견딜 수 있는 내열성을 발현하기 어려움에 따라서 접합부(130)를 고분자접합부로 구성할 경우 상기 외부단자(140)는 접합부(130)를 열적 변형이나 손상시키지 않을 수 있는 경화형 단자로 구성시키는 것이 매우 바람직하다. 만일 소성형 단자를 사용할 경우 500℃ 이상의 온도에서 진행되는 외부단자의 소성공정에서 고분자를 포함하는 접합부가 부분적으로 열분해되어 손상되거나 연화/용융됨에 따라서 소성공정 중 커패시터부와 바리스터부의 틀어짐이 발생하고, 접착강도가 저하될 수 있는 등 접합부의 물성저하를 초래할 수 있다. 이에 따라서 바람직하게는 상기 외부단자(140)는 도전성 에폭시 성분과 50 ~ 90중량%로 도전성 금속을 포함하는 전극 페이스트가 열경화 되어 형성되는 경화형 단자일 수 있고, 이때, 상기 전극 페이스트의 열경화는 상기 접합부(130)의 5% 중량감소 온도보다 낮은 온도로 수행될 수 있으며, 이를 통해 접합부의 물성저하를 방지할 수 있다. 만일 상기 전극 페이스트의 열경화 온도가 접합부의 5% 중량감소 온도를 초과하는 온도로 수행될 경우 접합부의 물성저하, 이로 인한 계면박리, 접합부 크랙 등이 발생할 우려가 있다.Particularly, the bonding unit 130 may be a polymer bonding unit due to various advantages as described above. Typically, the polymer bonding unit is a polymer bonding unit 130 according to difficulty in expressing heat resistance capable of fully withstanding at a temperature of 400 ° C. or higher. When configured as a bonding portion, the external terminal 140 is very preferably configured as a hardening-type terminal that may not thermally deform or damage the bonding portion 130. If a plastic-type terminal is used, the capacitor part and the varistor part are distorted during the firing process as the joint part containing the polymer is partially thermally decomposed or damaged or softened / melted in the firing process of the external terminal proceeding at a temperature of 500 ° C or higher, It may lead to deterioration of the physical properties of the joint, such as the adhesive strength may be lowered. Accordingly, preferably, the external terminal 140 may be a curing type terminal formed by thermally curing an electrode paste containing a conductive epoxy component and a conductive metal in an amount of 50 to 90% by weight, wherein the electrode paste is thermally cured. It can be performed at a temperature lower than the 5% weight loss temperature of the junction 130, thereby preventing the deterioration of the physical properties of the junction. If the heat curing temperature of the electrode paste is performed at a temperature exceeding the 5% weight loss temperature of the junction, there is a concern that physical properties of the junction, peeling of the interface, cracks in the junction, etc. may occur.
또한, 상기 접합부(130)가 유리질접합부의 경우 상기 유리질접합부의 소성온도보다 낮은 온도조건에서 경화 또는 소성될 수 있는 외부단자(140)라면 경화형 외부단자나 소성형 외부단자 어느 것이라도 무방하다. Further, in the case where the bonding part 130 is a glassy bonding part, if the external terminal 140 can be cured or fired at a temperature condition lower than the firing temperature of the glassy bonding part, either a hardening external terminal or a plasticizing external terminal may be used.
한편, 상기 외부단자(140)를 경화형 외부단자로 형성한 경우 바리스터부(110)와 커패시터부(120) 간 발생할 수 있는 접합결함의 보완이 가능하고, 디핑 방식으로 구현할 수 있어서 공정이 간단하며, 저비용으로 외부단자(140)를 형성시킬 수 있는 이점이 있다. 또는, 상기 외부단자(140)를 소성형 외부단자로 형성한 경우 바리스터 전극(112,114), 커패시터 전극(122,124) 각각과 외부단자(140) 간의 전기적 접속 신뢰성 향상에 유리한 이점이 있다.On the other hand, when the external terminal 140 is formed as a hardened external terminal, it is possible to compensate for bonding defects that may occur between the varistor unit 110 and the capacitor unit 120, and can be implemented in a dipping method, so the process is simple. There is an advantage that can form the external terminal 140 at a low cost. Alternatively, when the external terminal 140 is formed as a plastic external terminal, there is an advantage in improving electrical connection reliability between each of the varistor electrodes 112 and 114 and the capacitor electrodes 122 and 124 and the external terminal 140.
상기 외부단자(140)는 형성타입이 경화형이거나 소성형인 것에 관계없이 액상의 전극 페이스트를 통해 구현될 수 있다.The external terminal 140 may be implemented through a liquid electrode paste irrespective of whether the forming type is hardened or plasticized.
상기 외부단자(140)가 경화형 단자일 경우 경화타입으로 단자를 형성할 수 있는 공지된 경화형 단자 형성조성물로써, 단자를 형성하는 공정조건이 접합부의 손상이나 변형을 유발하지 않는 경화형 단자 형성조성물인 경우 제한 없이 사용할 수 있다. 일예로, 상기 경화형 단자 형성조성물은 도전성 금속성분, 경화성 바인더 성분, 경화제 및 용매를 포함할 수 있고, 기타 바인더 성분이나 첨가제를 더 포함할 수 있다. When the external terminal 140 is a hardening type terminal, it is a known hardening type terminal formation composition capable of forming a terminal in a hardening type. When the process conditions for forming the terminal are hardening type terminal formation compositions that do not cause damage or deformation of the joint. Can be used without restrictions. In one example, the curable terminal forming composition may include a conductive metal component, a curable binder component, a curing agent, and a solvent, and may further include other binder components or additives.
상기 도전성 금속성분은 Ag, Au, Cu, Pt, Sn, Ni, Al, W, Mo, Sb, Cr, Pb, Ti로 이루어진 군으로부터 선택된 1종의 금속 또는 2종 이상을 포함하는 혼합물 또는 이들의 합금일 수 있고, 일예로 은일 수 있다. 상기 도전성 금속성분은 경화형 단자 형성조성물 내 70 ~ 85중량% 이상 구비될 수 있다. The conductive metal component is Ag, Au, Cu, Pt, Sn, Ni, Al, W, Mo, Sb, Cr, Pb, a mixture containing two or more selected from the group consisting of Ti or a mixture of two or more thereof It may be an alloy, for example silver. The conductive metal component may be 70 to 85% by weight or more in the curable terminal forming composition.
또한, 상기 경화성 바인더 성분은 아크릴계, 에폭시계, 우레탄계 등 경화될 수 있는 관능기를 가진 공지된 모노머, 올리고머 및/또는 고분자수지일 수 있으며, 바람직하게는 경화된 후 도전성 금속성분의 도전성을 저해하지 않도록 도전성이 있거나 또는 낮은 저항을 구현하는 성분일 수 있다. 상기 경화성 바인더 성분의 일예로 글리시딜기를 갖는 에폭시계 성분일 수 있으며, 구체적으로 비스페놀A계 수지나 크레졸 노볼락계 수지일 수 있다. In addition, the curable binder component may be a known monomer, oligomer and / or polymer resin having a functional group that can be cured, such as acrylic, epoxy, or urethane, and preferably does not inhibit the conductivity of the conductive metal component after curing. It may be conductive or may be a component that realizes low resistance. An example of the curable binder component may be an epoxy-based component having a glycidyl group, specifically, a bisphenol A-based resin or a cresol novolac-based resin.
또한, 상기 경화제는 선택된 경화성 바인더 성분과 함께 경화되도록 하는 공지된 것을 사용할 수 있으며, 구체적으로 선택된 경화성 바인더 성분의 종류에 따라 구체적인 종류와 함량이 결정될 수 있음에 따라서 본 발명은 이에 대해 특별히 한정하지 않는다.In addition, the curing agent may use a known one to be cured together with the selected curable binder component, the present invention is not particularly limited as the specific type and content can be determined according to the type of the specifically selected curable binder component. .
또한, 상기 용매는 공지된 용매를 사용할 수 있고, 그 종류와 함량은 구체적인 경화성 바인더 성분이나 경화제의 종류, 함량에 따라서 달라짐에 따라서 본 발명은 이에 대해 특별히 한정하지 않으며, 일예로 디에틸렌 글리콜 모뉴뷰틸 에테르일 수 있다.In addition, the solvent may use a known solvent, the type and content of the present invention is not particularly limited as it depends on the specific curable binder component or the type and content of the curing agent, for example diethylene glycol monobutyl Ether.
또한, 상술한 경화형 단자 형성조성물은 열이나 광 등 공지된 경화방법을 통해 경화될 수 있으며, 일예로 열경화 방법을 통해 경화될 수 있다. In addition, the above-described curable terminal forming composition may be cured through a known curing method such as heat or light, and may be cured through, for example, a thermal curing method.
상기 경화형 단자 형성조성물로 형성된 외부단자(140)는 일예로 저항이 10Ω/㎜이하일 수 있다. The external terminal 140 formed of the curable terminal forming composition may have, for example, a resistance of 10 Ω / mm or less.
또한, 상기 외부단자(140)가 소성형 단자일 경우 소성타입으로 단자를 형성할 수 있는 공지된 소성형 단자 형성조성물을 사용할 수 있다. 일 예로써, 도전성 금속성분 및 유리성분을 포함할 수 있고, 상기 유리성분을 통해 소체와 재질적 상용성이 증가함에 따라서 접착강도가 향상되어 전기적 접속 신뢰성 및 내구성을 더욱 담보할 수 있다. In addition, when the external terminal 140 is a plastic-type terminal, a known plastic-type terminal-forming composition capable of forming a terminal in a plastic type may be used. As an example, a conductive metal component and a glass component may be included, and as the material compatibility with the body increases through the glass component, adhesion strength may be improved to further secure electrical connection reliability and durability.
상기 도전성 금속성분은 Ag, Au, Cu, Ni, Pd 및 Pt으로 이루어진 군에서 선택된 1종 이상을 포함할 수 있다. 상기 도전성 금속성분은 입상으로 조성물에 포함될 수 있고, 이때 도전성 금속성분의 평균입경은 0.1 ~ 10㎛일 수 있다. The conductive metal component may include one or more selected from the group consisting of Ag, Au, Cu, Ni, Pd and Pt. The conductive metal component may be included in the composition in a granular form, and the average particle diameter of the conductive metal component may be 0.1 to 10 μm.
또한, 상기 유리성분은 알루미늄, 규소, 게르마늄, 인듐, 주석, 납, 인, 붕소, 갈륨, 리튬, 나트륨, 칼륨, 루비듐, 세슘, 베릴륨, 마그네슘, 칼슘, 스트론튬, 바륨, 네오디뮴, 프라세오디뮴, 에르븀, 세륨, 티탄, 지르코늄, 탄탈, 아연, 텅스텐, 바나듐, 크롬, 망간, 철, 코발트, 니켈, 구리 및 몰리브덴 중 선택된 1종 이상의 원소를 포함할 수 있고, 보다 바람직하게는 아연, 규소, 붕소 및 망간 또는 아연, 규소, 붕소 및 알루미늄을 포함할 수 있다. 이때, 각각의 원소 함량은 산화물 기준으로 소성형 전극조성물 내에 5~20중량% 포함 될 수 있다. In addition, the glass component is aluminum, silicon, germanium, indium, tin, lead, phosphorus, boron, gallium, lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, neodymium, praseodymium, erbium, It may contain one or more elements selected from cerium, titanium, zirconium, tantalum, zinc, tungsten, vanadium, chromium, manganese, iron, cobalt, nickel, copper and molybdenum, more preferably zinc, silicon, boron and manganese. Or zinc, silicon, boron and aluminum. At this time, the content of each element may be included 5 to 20% by weight in the firing electrode composition based on the oxide.
상기 유리성분은 입상으로 조성물에 포함될 수 있고, 이때, 유리성분의 평균입경은 0.1 ~ 10㎛일 수 있고 이를 통해 분산성을 향상시킬 수 있고, 이를 통해 소체(110a,120a)와 접촉하는 전 영역에서의 외부단자(140)의 접착력을 향상시킬 수 있다.The glass component may be included in the composition in the form of granules, and in this case, the average particle diameter of the glass component may be 0.1 to 10 μm, thereby improving dispersibility, through which all regions in contact with the bodies 110a and 120a It is possible to improve the adhesion of the external terminal 140 at.
상기 소성형 단자 형성조성물은 상기 도전성 금속성분 및 유리성분 이외에 용매, 바인더 성분을 더 포함할 수 있다. The sintered terminal forming composition may further include a solvent and a binder component in addition to the conductive metal component and glass component.
상기 바인더 성분은 전극을 제조하기 위해 사용되는 통상의 바인더의 경우 제한 없이 사용될 수 있으며, 이에 대한 비제한적인 예로써, 폴리비닐부티랄(polyvinylbutyral) 수지, 폴리비닐아세테이트(polyvinylacetate) 수지, 에틸셀룰로오스, 니트로셀룰로오스 및 폴리아크릴계 수지 등에서 선택된 1 종 이상을 포함할 수 있다.The binder component may be used without limitation in the case of a conventional binder used to prepare an electrode, and as a non-limiting example, polyvinylbutyral resin, polyvinylacetate resin, ethyl cellulose, Nitrocellulose and polyacrylic resins, and the like.
또한, 상기 용매는 사용되는 상술한 도전성 금속성분 및 유리성분에 영향을 미치지 않으면서도 바인더 성분이나 기타 분산제 등의 첨가제 등의 용해에 문제가 없는 통상의 물, 유기용매인 경우 제한 없이 사용될 수 있다. 이에 대한 비제한적이 예로써, 부톡시에톡시에틸아세테이트(butoxyethoxyethyl acetate), 에틸렌글리콜, 디에틸렌글리콜, 트리에틸렌글리콜, 에틸렌글리콜 모노부틸이더 (ethylene glycol monobutyl ether), 프로필렌글리콜 모노에틸 이더(propylene glycol monomethyl ether), 디에틸렌 글리콜 메틸이더(diethylene glycol methyl ether), 글리세롤(glycerol), 디에틸렌글리콜에틸이더아세테이트(diethylene glycol ethyl ether acetate), 테르피네올(terpineol), 멘톨(menthol), MEDG(diethylene glycol methyl ethyl ether) 및 BDG (butyl diglycol) 등을 단독 또는 병용하여 사용할 수 있다.In addition, the solvent can be used without limitation in the case of a conventional water or organic solvent that does not have a problem in dissolving additives such as a binder component or other dispersant without affecting the above-mentioned conductive metal component and glass component. By way of non-limiting example, butoxyethoxyethyl acetate, ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monobutyl ether, propylene glycol monoethyl ether (propylene) glycol monomethyl ether), diethylene glycol methyl ether, glycerol, diethylene glycol ethyl ether acetate, terpineol, menthol, Diethylene glycol methyl ethyl ether (MEDG) and butyl diglycol (BDG) may be used alone or in combination.
이때, 소성형 단자 형성조성물 도전성성분 100 중량부에 대해 유리성분을 5 ~20 중량부, 바인더성분 1 ~ 10 중량부 및 용제를 5 ~ 20 중량부로 포함할 수 있다. 만일 유리성분이 도전성 금속성분에 대하여 5 중량부 미만으로 포함되는 경우 목적하는 외부단자와 소체 간의 접착강도를 발현할 수 없을 수 있고, 만일 유리성분이 도전성 금속성분에 대하여 20 중량부를 초과하여 포함되는 경우 외부단자와 바리스터 전극/커패시터 전극이 접촉 시 유리성분이 용해되어 접촉면에 방해물로 작용함에 따라서 전기적 접촉 불량의 우려가 있다. In this case, the plastic component may include 5 to 20 parts by weight of the glass component, 1 to 10 parts by weight of the binder component, and 5 to 20 parts by weight of the solvent relative to 100 parts by weight of the conductive component. If the glass component is contained in less than 5 parts by weight with respect to the conductive metal component, the adhesive strength between the desired external terminal and the body may not be expressed, and if the glass component is contained in excess of 20 parts by weight with respect to the conductive metal component When the external terminal and the varistor electrode / capacitor electrode are in contact, there is a fear of electrical contact failure as the glass component is dissolved and acts as an obstacle on the contact surface.
상기 소성형 단자 형성조성물의 점도는 Brook Field HBDV-1 SC4-14, 10RPM 기준으로 측정 시 10 ~ 60 Kcps일 수 있다. 만일 상기 점도 범위를 불만족할 경우 목적하는 두께로 외부단자를 형성하기에 용이하지 않을 수 있으며, 조성물 내 각 성분의 분산성이 약해 제조된 외부단자의 기계적 강도, 소체와의 접착력 등이 저하될 수 있는 문제가 있다.The viscosity of the plastic terminal forming composition may be 10 to 60 Kcps when measured based on Brook Field HBDV-1 SC4-14, 10 RPM. If the viscosity range is unsatisfactory, it may not be easy to form an external terminal with a desired thickness, and the dispersibility of each component in the composition may be weak, thereby reducing the mechanical strength of the manufactured external terminal, adhesion to the body, and the like. There is a problem.
또한, 상기 소성형 단자 형성조성물로 형성된 외부단자(140)는 일예로 저항이 1Ω/㎜이하일 수 있다. In addition, the external terminal 140 formed of the plastic terminal forming composition may have, for example, a resistance of 1 Ω / mm or less.
상기 외부단자(140)는 적층된 바리스터부(110)와 커패시터부(120)의 양측을 상술한 외부단자 형성조성물(140a)이 덮도록 처리되어 구현될 수 있다. 이를 위한 상기 경화형 단자 형성조성물(140a)의 처리방법은 공지된 여러 방법을 통할 수 있으나 공정 용이성, 제조비용 절감 측면에서 도 4와 같이 외부단자 형성조성물(140a)이 담긴 수조(180)에 소체를 부분적 담지시키는 디핑방식을 사용할 수 있다. 처리된 외부단자 형성조성물(140a)은 이후 열 및/또는 광을 통한 경화공정을 거쳐 외부단자로 구현될 수 있다. 또한, 소성형 외부단자의 경우 도전성 금속성분의 종류에 따라서 변경될 수 있으나 500℃ 이상의 열을 가해 외부단자로 구현될 수 있다.The external terminal 140 may be implemented by processing both sides of the stacked varistor unit 110 and the capacitor unit 120 to cover the external terminal forming composition 140a. The method for treating the curable terminal forming composition 140a for this may be through a variety of known methods, but the body is placed in the water tank 180 containing the external terminal forming composition 140a as shown in FIG. 4 in terms of process ease and manufacturing cost reduction. A dipping method to partially support can be used. The processed external terminal forming composition 140a may be realized as an external terminal after curing through heat and / or light. In addition, the plastic external terminal may be changed according to the type of the conductive metal component, but may be implemented as an external terminal by applying heat of 500 ° C or higher.
또한, (4) 단계를 통해 구현된 복합소자(100)는 외부단자(140)가 회로기판에 플로우 납땜 등의 방식으로 실장될 때 납땜의 용이성, 전기적 연결성을 더욱 향상시키기 위하여 상기 외부단자(140)의 외부면에 도금층을 형성시키는 공정을 더 수행할 수 있다. 상기 도금층은 통상의 도금방법을 사용하여 형성시킬 수 있고, 니켈, 주석, 구리, 주석납 등의 금속이나 합금을 포함할 수 있다. 이때, 2 종 이상의 금속을 포함하는 경우 하나의 층에 2종 이상의 금속이 혼합된 형태이거나 이들 금속이 합금의 형태로써 포함될 수 있다. 또는, 2종 이상의 금속이 각각 도금층을 형성해 복수개의 도금층으로 형성될 수도 있다. 상기 도금층의 두께는 0.1 ~ 5㎛일 수 있으나 이에 제한되는 것은 아니다.In addition, the composite device 100 implemented through the step (4) is the external terminal 140 when the external terminal 140 is mounted on the circuit board in a manner such as flow soldering, the external terminal 140 to further improve the ease of soldering, electrical connectivity ) May further perform a process of forming a plating layer on the outer surface. The plating layer may be formed using a conventional plating method, and may include metals or alloys such as nickel, tin, copper, and tin lead. In this case, when two or more types of metals are included, two or more types of metals may be mixed in one layer, or these metals may be included as an alloy. Alternatively, two or more kinds of metals may be formed of a plurality of plating layers by forming plating layers, respectively. The thickness of the plating layer may be 0.1 ~ 5㎛, but is not limited thereto.
한편, 본 발명의 다른 실시예에 의하면, 도 5c 및 도 6b에 도시된 것과 같이 상술한 (1) 단계에서 준비되는 바리스터부(110")는 (4) 단계에서 형성되는 외부단자(140)와 바리스터 전극(112,114) 간 전기적 도통 신뢰성을 향상시키기 위하여, 바리스터 전극(112,114)이 노출된 제1소체(110a) 양측에 한 쌍의 제1외부전극(142)을 더 구비한 것일 수 있다. 또한, 커패시터부(120') 역시, 외부단자(140)와 커패시터 전극(122,124) 간 도통 신뢰성을 향상시키기 위하여, 커패시터 전극(122,124)이 노출된 제2소체(120a) 양측에 한 쌍의 제2외부전극(144)을 더 구비한 것일 수 있다.On the other hand, according to another embodiment of the present invention, as shown in Figures 5c and 6b, the varistor unit 110 "prepared in step (1) described above and the external terminal 140 formed in step (4) In order to improve the reliability of electrical conduction between the varistor electrodes 112 and 114, the pair of first external electrodes 142 may be further provided on both sides of the first body 110a where the varistor electrodes 112 and 114 are exposed. The capacitor unit 120 'also has a pair of second external electrodes on both sides of the second body 120a where the capacitor electrodes 122 and 124 are exposed to improve the reliability of conduction between the external terminal 140 and the capacitor electrodes 122 and 124. It may be further provided with (144).
바리스터 전극(112, 114)의 끝단이 노출된 제1소체(110a) 양측에 한 쌍의 제1외부전극(142)이 구비되며, 커패시터 전극(122,124)의 끝단이 노출된 제2소체(120a) 양측에 한 쌍의 제2외부전극(144)이 구비될 수 있다. 이때, 외부단자(140)는 상기 제1외부전극(142)과 제2외부전극(144) 각각의 외부면 적어도 일부를 덮도록 구비될 수 있다. A pair of first external electrodes 142 are provided on both sides of the first body 110a where the ends of the varistor electrodes 112 and 114 are exposed, and the second body 120a where the ends of the capacitor electrodes 122 and 124 are exposed. A pair of second external electrodes 144 may be provided on both sides. In this case, the external terminal 140 may be provided to cover at least a portion of the outer surfaces of each of the first external electrode 142 and the second external electrode 144.
도 1에 도시된 복합소자(100)는 외부단자(140)가 직접 바리스터 전극과 커패시터 전극에 접촉하여 전기적 연결되는데, 도 5a, 도 5b 및 도 6a와 같이 바리스터 전극(112,114)이나 커패시터 전극(122,124)은 제1소체(110a), 제2소체(120a) 양 측면에 끝단이 노출되거나 비교적 적은 길이로 끝단이 돌출되어 노출될 수 있고, 이에 더해서 바리스터 전극(112,114)이나 커패시터 전극(122,124)의 두께와 폭은 매우 작기 때문에 전극과 외부단자(140)와의 접촉면적이 작고, 선접촉에 가깝다. 이로 인해 전극과 외부단자(140)와의 접촉저항이 클 수 있으며, 전기적 특성이 원활히 발현되지 못할 수 있다. 더욱이 만일 접합부(130)를 고분자접합부로 구현할 경우 외부단자(140)는 접합부(130)의 열로 인한 손상 및 변형을 방지하기 위해 경화형 단자로 구현하는 것이 바람직한데, 경화형 단자는 동일한 도전성 금속성분을 사용한 소성형 단자에 비해 전기적 신뢰성이 낮고 이로 인해 소성형 단자에 대비해서 접촉저항이 더욱 증가될 수 있다. 이러한 접촉저항의 증가는 복합소자(100)의 전기적 특성이 제대로 발현되지 않거나 복합소자(100)로 유입된 ESD가 소자 내부로 흘러 들어가지 못하고 외부단자(140) 부분이나 외부단자(140) 부분과 바리스터 전극(112,114) 부분에서 아크를 발생하는 등의 문제의 원인이 될 수 있다. In the composite device 100 shown in FIG. 1, the external terminal 140 directly contacts the varistor electrode and the capacitor electrode to be electrically connected. As shown in FIGS. 5A, 5B, and 6A, the varistor electrodes 112, 114 or the capacitor electrodes 122,124 ) May be exposed on both sides of the first body 110a and the second body 120a, or the ends may protrude to a relatively small length, and in addition, the thickness of the varistor electrodes 112 and 114 or the capacitor electrodes 122 and 124. Because the and width is very small, the contact area between the electrode and the external terminal 140 is small and close to the line contact. Due to this, the contact resistance between the electrode and the external terminal 140 may be large, and electrical characteristics may not be smoothly expressed. Moreover, if the junction 130 is implemented as a polymer junction, the external terminal 140 is preferably implemented as a curable terminal to prevent damage and deformation due to heat of the junction 130, and the curable terminal uses the same conductive metal component. The electrical reliability is lower than that of a plastic-type terminal, and as a result, contact resistance may be further increased compared to a plastic-type terminal. Such an increase in contact resistance is due to the fact that the electrical characteristics of the composite device 100 are not properly expressed, or that ESD introduced into the composite device 100 does not flow into the device, and the external terminal 140 or the external terminal 140 may not be used. It may be a cause of problems such as arc generation in the varistor electrodes 112 and 114.
그러나 상기 제1외부전극(142) 및/또는 제2외부전극(144)은 이러한 문제점을 해소할 수 있으며, 특히 제1외부전극(142)과 제2외부전극(144)을 소성형 전극으로 구현시킬 경우 바리스터 전극(112,114)과 커패시터 전극(122,124) 각각과 외부전극(142,144) 간의 접촉저항을 더욱 감소시킬 수 있는 이점까지 있다. 더불어 외부단자(140)와 제1외부전극(142)/제2외부전극(144)이 면접촉을 함에 따라서 접촉면적의 증가로 접촉저항을 낮출 수 있고, 이로 인해 복합소자(100')로 유입된 ESD나 누설전류가 바리스터부(110")로 온전히 전달되어 목적하는 전기적 특성을 온전히 발현하기에 유리할 수 있고, 제품 신뢰성을 더욱 향상시킬 수 있다. However, the first external electrode 142 and / or the second external electrode 144 can solve this problem. In particular, the first external electrode 142 and the second external electrode 144 are implemented as plastic electrodes. When doing so, there is an advantage that the contact resistance between the varistor electrodes 112 and 114 and the capacitor electrodes 122 and 124 and the external electrodes 142 and 144 can be further reduced. In addition, as the external terminal 140 and the first external electrode 142 / the second external electrode 144 make a surface contact, the contact resistance can be lowered by increasing the contact area, thereby introducing the composite element 100 '. The ESD or leakage current is transferred to the varistor unit 110 ", and it may be advantageous to fully express desired electrical characteristics, and further improve product reliability.
아울러, 바리스터부(110")와 커패시터부(120') 간 접합 공정 등의 복합공정에서 개별적인 전기적 특성을 용이하게 측정할 수 있으므로 결함발생유무, 전기적 특성의 관리 및 제어가 용이하고 따라서 제품의 신뢰성을 더욱 향상시킬 수 있다.In addition, since individual electrical properties can be easily measured in a complex process such as a bonding process between the varistor part 110 "and the capacitor part 120 ', it is easy to manage the defects and to manage and control the electrical properties, and thus the reliability of the product. Can be further improved.
상기 제1외부전극(142)과 제2외부전극(144)은 일예로, 두께가 10 ~ 30㎛이고, 폭은 바리스터 전극(112,114), 커패시터 전극(122,124)이 노출되거나 돌출되는 소체(110a,120a) 면의 소체 너비보다 형성되는 외부전극(142,144) 두께만큼 더 크게 형성될 수 있으나, 이에 제한되는 것은 아니며, 소체의 크기, 바리스터 전극(112,114), 커패시터 전극(122,124)의 폭 등에 따라 변경될 수 있다. The first external electrode 142 and the second external electrode 144 are, for example, 10 to 30 μm thick, and the width is a body 110a in which the varistor electrodes 112 and 114 and the capacitor electrodes 122 and 124 are exposed or projected. 120a) It may be formed to be larger than the thickness of the external electrodes 142 and 144 formed than the width of the body, but is not limited thereto, and may be changed according to the size of the body, the width of the varistor electrodes 112 and 114, and the width of the capacitor electrodes 122 and 124. You can.
상기 제1외부전극(142)과 제2외부전극(144)은 각각 제1소체(110a)와 제2소체(120a)의 전극 노출면에 외부전극 형성조성물을 처리 후 소결시켜 제조할 수 있다. 상기 외부전극 형성조성물은 일예로, 도전성 금속성분 및 유리성분을 포함할 수 있고, 상기 유리성분을 통해 소체와의 재질적 상용성 증가에 따른 접착강도의 향상으로 전기적 접속 신뢰성 및 내구성을 더욱 담보할 수 있다. 상기 외부전극 형성 조성물은 상술한 외부단자의 형성을 위한 소결형 단자 형성조성물과 동일한 조성물을 사용할 수 있으므로 본 발명은 이에 대한 구체적인 설명은 생략한다. The first external electrode 142 and the second external electrode 144 may be manufactured by treating the external electrode forming composition on the exposed surfaces of the first body 110a and the second body 120a, respectively, and then sintering them. The external electrode forming composition may include, for example, a conductive metal component and a glass component, and through the glass component, electrical connection reliability and durability are further secured by improving adhesion strength according to an increase in material compatibility with the body. You can. The external electrode forming composition may use the same composition as the sintered terminal forming composition for forming the external terminal described above, so that the detailed description of the present invention is omitted.
한편, 제1외부전극(142) 및 제2외부전극(144)과 접촉하게 되는 제1소체(110a) 및 제2소체(120a)의 외부면에는 유리코팅층(미도시)이 더 형성될 수 있고, 바람직하게는 외부로 노출되는 소체(110a,110b)의 전면에 형성될 수 있다.Meanwhile, a glass coating layer (not shown) may be further formed on outer surfaces of the first body 110a and the second body 120a that come into contact with the first outer electrode 142 and the second outer electrode 144. , Preferably it may be formed on the front surface of the body (110a, 110b) exposed to the outside.
상기 유리코팅층은 복수개의 바리스터층이나 세라믹층이 적층되어 형성될 수 있는 제1소체(110a)나 제2소체(120a)에서 층간 박리를 방지하여 소체의 기계적 강도를 향상시킬 수 있는 동시에 외부전극과 소체 간의 접착력을 더욱 향상시킬 수 있다. 더불어 복합소자를 기판에 실장 시 납땜 할 부위에 이물질을 제거하여 납 젖음성 향상을 위해 처리되는 용제(일예로 Flux)로 인해 복합소자의 표면부식이나 용제가 소체 내부로 침투되는 것을 방지할 수 있다. 상기 유리코팅층은 두께가 0.5 ~ 10㎛일 수 있고, 만일 두께가 0.5㎛미만일 경우 목적하는 외부전극과의 접착력 향상효과가 미미할 수 있고, 도금용액, Flux와 같은 이물질 제거 용제 등이 소체 내부로 침투되지 못하도록 방지하는 배리어 역할을 수행하기 어려울 수 있다. 또한, 만일 유리코팅층의 두께가 10㎛를 초과하는 경우 외부전극과 바리스터 전극/커패시터 전극 간의 전기적 도통 신뢰성이 저하되어 소자의 전기적 특성이 온전히 발휘되지 못할 수 있다.The glass coating layer prevents interlayer peeling in the first body 110a or the second body 120a, which may be formed by stacking a plurality of varistor layers or ceramic layers, thereby improving mechanical strength of the body and simultaneously with external electrodes. The adhesion between the bodies can be further improved. In addition, when the composite device is mounted on a substrate, foreign substances are removed from the soldered area to prevent the surface corrosion of the composite device or the penetration of the solvent into the body due to a solvent (for example, flux) processed to improve lead wettability. The glass coating layer may have a thickness of 0.5 to 10 µm, and if the thickness is less than 0.5 µm, the effect of improving adhesion with a desired external electrode may be insignificant, and a plating solution, a foreign substance removing solvent such as Flux, etc. may penetrate into the body. It can be difficult to act as a barrier to prevent this from happening. In addition, if the thickness of the glass coating layer exceeds 10 μm, the electrical conduction reliability between the external electrode and the varistor electrode / capacitor electrode is deteriorated, so that the electrical characteristics of the device may not be fully exhibited.
한편, 제1외부전극(142)이 형성된 바리스터부(110") 또는 제2외부전극(144)이 형성된 커패시터부(120')에 대해 (2) 단계를 수행할 경우 도 9와 같이 커패시터부(120') 상부에 본 발명에 따른 면적을 가지도록 가접합부(130a)를 형성시킬 수 있고, 이에 대한 설명은 상술한 (2) 단계에서의 설명과 동일하여 이하 생략한다.On the other hand, when the step (2) is performed on the capacitor portion 120 ′ having the varistor portion 110 ″ on which the first external electrode 142 is formed or the second external electrode 144 is formed, as shown in FIG. 9, the capacitor portion ( 120 ') The temporary joining portion 130a may be formed to have an area according to the present invention on the upper portion, and the description thereof is the same as the description in step (2) described above, and will be omitted below.
상술한 방법들로 구현된 복합소자(100,100')에서 접합부(130)나 외부단자(140)는 경화 공정이 완료되면 300℃ 이하의 온도에서 안정화되어야 하며 이를 통해 SMT 작업에서 가해지는 열에도 접합부(130)나 외부단자(140)가 열적 변형, 손상 없이 본래 기능을 온전히 발현하기 유리할 수 있다.In the composite device 100, 100 'implemented by the above-described methods, the bonding portion 130 or the external terminal 140 must be stabilized at a temperature of 300 ° C. or less when the curing process is completed, and through this, the bonding portion is also applied to heat applied in the SMT operation ( 130) or the external terminal 140 may be advantageous to fully express the original function without thermal deformation or damage.
또한, 상기 복합소자(100,100')에서 바리스터부(110,110")와 커패시터부(120,120')의 접합강도는 전단(shear)강도가 1kgf 이상이며, 외부단자(140)의 전극강도는 0.8kgf 이상일 수 있다. In addition, the bonding strength of the varistor parts 110 and 110 "and the capacitor parts 120 and 120 'in the composite device 100 and 100' may be greater than or equal to 1 kgf of shear strength, and the electrode strength of the outer terminal 140 may be greater than or equal to 0.8 kgf. have.
또한, 본 발명에 따른 가접합부(130a)의 면적을 만족하여 구현된 복합소자(100,100')에서 접합부(130)의 면적은 바리스터부(110,100") 또는 커패시터부(120,120') 상부면 면적의 55 ~ 93%일 수 있고, 바람직하게는 65 ~ 78%일 수 있다. In addition, the area of the junction part 130 in the composite device 100,100 'implemented by satisfying the area of the provisional junction part 130a according to the present invention is 55 of the area of the upper surface of the varistor part 110,100 "or the capacitor part 120,120'. It may be ~ 93%, preferably 65 ~ 78%.
또한, 보다 바람직하게는 접합부(130)의 길이는 바리스터부(110,100") 또는 커패시터부(120,120') 상부면 길이의 55 ~ 99%, 보다 바람직하게는 75 ~ 99%, 보다 더 바람직하게는 75 ~ 93%, 더욱 바람직하게는 82 ~ 93%일 수 있다. 또한, 상기 접합부(130)의 폭은 바리스터부(110,100") 또는 커패시터부(120,120') 상부면 폭의 55 ~ 95%, 보다 바람직하게는 75 ~ 95%, 더욱 바람직하게는 75 ~ 87%일 수 있다. 또한, 접합부(130) 평균두께는 7 ~ 40㎛, 보다 바람직하게는 13 ~ 30㎛일 수 있다. In addition, more preferably, the length of the junction 130 is 55 to 99%, more preferably 75 to 99%, even more preferably 75 of the length of the upper surface of the varistor portion 110,100 "or the capacitor portion 120,120 ' It may be ~ 93%, more preferably 82 ~ 93% In addition, the width of the junction part 130 is 55 to 95% of the width of the upper surface of the varistor part (110,100 ") or the capacitor part (120,120 '), more preferably It may be 75 to 95%, more preferably 75 to 87%. In addition, the average thickness of the junction 130 may be 7 to 40 μm, more preferably 13 to 30 μm.
위와 같은 접합부(130)의 면적, 바람직하게는 길이, 폭 및/또는 두께 조건을 만족하도록 구현된 복합소자(100,100')는 본 발명에 따른 가접합부의 적정 조건을 만족하여 형성된 것으로써, 위의 범위를 벗어나도록 접합부가 형성된 복합소자에 대비하여 접합신뢰도, 전기적 신뢰도, 외관품질이 더욱 뛰어나도록 구현된 것일 수 있다. The composite element 100, 100 'implemented to satisfy the area, preferably length, width, and / or thickness conditions of the above-described bonding portion 130 is formed by satisfying the appropriate conditions of the provisional bonding portion according to the present invention. It may be implemented such that the bonding reliability, electrical reliability, and appearance quality are superior to the composite device in which the bonding portion is formed to be out of range.
이상에서와 같이, 이종재료로 구현된 바리스터부(110,110',110")와 커패시터부(120,120')를 독립적으로 소결한 뒤 단일한 칩으로 구현함으로써, 정전기 응답특성 및 고용량 커패시턴스에 의한 주파수 특성을 향상시킬 수 있다. As described above, the varistor parts 110, 110 ', 110 "and the capacitor parts 120, 120' made of dissimilar materials are independently sintered and implemented as a single chip, thereby improving the frequency characteristics due to electrostatic response characteristics and high-capacitance capacitance. Can be improved.
도 10에 도시된 바와 같이, 본 발명의 복합소자(100,100')는 전압-전류 특성 및 정전기(ESD) 특성 측면에서 바리스터 타입과 유사한 특성을 가지므로 써프레서 타입에 비하여 우수한 특성을 가지며, 주파수 특성에서 고용량 커패시턴스 구현이 용이한 써프레서 타입과 유사한 특성을 가지므로 바리스터 타입에 비하여 광대역 특성을 갖는다. As shown in FIG. 10, the composite device 100, 100 'of the present invention has characteristics similar to the varistor type in terms of voltage-current characteristics and electrostatic (ESD) characteristics, and thus has superior characteristics compared to the suppressor type and frequency characteristics. It has characteristics similar to the suppressor type, which is easy to implement high-capacitance in, and has a wide-band characteristic compared to a varistor type.
따라서, 본 발명의 복합소자(100,100')는 정전기 방호기능, 누설전류 차단 기능 및 무선 통신 기능을 모두 제공할 수 있다.Accordingly, the composite devices 100 and 100 'of the present invention can provide both an electrostatic protection function, a leakage current blocking function, and a wireless communication function.
이와 같은 복합소자(100,100')는 휴대용 전자 장치에서, 도 11에 도시된 바와 같이, 외장 메탈케이스와 같은 전도체(12)와 회로부(14) 사이를 전기적으로 연결하도록 배치될 수 있다. 이때, 복합소자(100,100')는 회로부(14)의 접지에 직접 연결되어 바리스터부(110,110')의 턴 온에 의해 유입되는 정전기를 회로부로 전달하지 않고 접지로 바이 패스시킬 수 있다. The composite elements 100 and 100 'may be arranged in a portable electronic device to electrically connect a conductor 12, such as an external metal case, and a circuit portion 14, as illustrated in FIG. 11. In this case, the composite elements 100 and 100 'may be directly connected to the ground of the circuit unit 14 and bypass the static electricity introduced by the turn-on of the varistor units 110 and 110' to the circuit unit without transferring it to the circuit unit.
선택적으로, 복합소자(100,100')가 회로부의 접지에 직접 연결되지 않은 경우, 즉, 전도체(12)와 회로부(14)를 전기적으로 연결하여 정전기를 통과시키기만 하는 경우, 휴대용 전자장치는 정전기를 접지로 바이패스 하기 위한 별도의 보호소자를 구비할 수 있다. 이러한 보호소자는 단일 소자로 이루어진 써프레서 또는 바리스터일 수 있다. Optionally, when the composite elements 100 and 100 'are not directly connected to the ground of the circuit portion, that is, when the conductor 12 and the circuit portion 14 are electrically connected to pass static electricity, the portable electronic device may discharge static electricity. A separate protection element for bypassing to ground may be provided. The protection element may be a suppressor or a varistor made of a single element.
이와 같이, 복합소자(100,100')는 전도체(12)로부터 정전기가 유입되는 경우, 바리스터부(110,110')의 턴 온에 의해 정전기를 통과시킬 수 있다. 즉, 복합소자(100,100')는 그 항복전압(Vbr)이 정전기의 순간 전압보다 작기 때문에, 전기적으로 도통되어 정전기를 통과시킬 수 있다. 결과적으로, 복합소자(100,100')는 전도체(12)로부터 정전기 유입 시 전기적 저항이 낮아져 자체가 절연파괴 되지 않고 정전기를 통과시킬 수 있다.As described above, when static electricity is introduced from the conductor 12, the composite elements 100 and 100 'may pass static electricity by turning on the varistor parts 110 and 110'. That is, since the breakdown voltage Vbr of the composite elements 100 and 100 'is less than the instantaneous voltage of static electricity, it can be electrically conductive to pass static electricity. As a result, the composite elements 100 and 100 'have low electrical resistance when static electricity flows from the conductor 12, and thus can pass static electricity without breaking itself.
이때, 복합소자(100,100') 내에 구비된 커패시터부(120,120')는 그 절연파괴 전압(Vcp)이 바리스터부(110,110")의 항복전압(Vbr)보다 크기 때문에, 정전기는 커패시터부(120,120')로 유입되지 않고, 바리스터부(110,110")로만 통과될 수 있다.At this time, since the capacitor parts 120 and 120 'provided in the composite elements 100 and 100' have a higher dielectric breakdown voltage Vcp than the breakdown voltage Vbr of the varistor parts 110 and 110 ", static electricity is caused by the capacitor parts 120 and 120 '. It does not flow into the furnace, and can only be passed through the varistor parts 110 and 110 ".
또한, 복합소자(100,100')는 회로부(14)의 접지로부터 외부전원의 누설전류가 유입되는 경우, 바리스터부(110,110")의 턴 오프 및 커패시터부(120,120')에 의해 누설전류가 전도체로 전달되지 않도록 차단될 수 있다. In addition, when the leakage current of external power flows from the ground of the circuit unit 14, the composite elements 100 and 100 'turn off the varistor units 110 and 110 "and the leakage current is transmitted to the conductors by the capacitor units 120 and 120'. Can be blocked.
즉, 회로부(14)의 회로기판, 예를 들면, 접지를 통하여 외부전원의 누설전류가 전도체(12)로 유입되는 경우, 복합소자(100,100')는 그 항복전압(Vbr)이 누설전류에 의한 과전압에 비하여 크기 때문에, 오픈 상태로 유지될 수 있다. 환원하면, 복합소자(100,100')는 그의 항복전압(Vbr)이 휴대용 전자장치의 외부전원의 정격전압보다 크기 때문에, 전기적으로 도통되지 않고 오픈 상태를 유지하여 메탈 케이스 등과 같은 인체접촉 가능한 전도체(12)로 누설전류가 전달되는 것을 차단할 수 있다. That is, when the leakage current of external power flows into the conductor 12 through the circuit board of the circuit unit 14, for example, ground, the composite element 100,100 'has a breakdown voltage Vbr due to the leakage current. Because it is large compared to the overvoltage, it can be kept open. In other words, the composite elements 100 and 100 'have their breakdown voltage Vbr greater than the rated voltage of the external power of the portable electronic device, so they are not electrically conducting and remain open so that they can be in contact with a human body such as a metal case 12 ) To prevent the leakage current from being transmitted.
이때, 복합소자(100,100') 내에 구비된 커패시터부(120)는 누설전류에 포함된 DC 성분을 차단할 수 있고, 아울러, 누설 전류의 AC 성분이 무선통신 대역에 비하여 상대적으로 낮은 주파수를 갖기 때문에, 해당 주파수에 대하여 큰 임피던스로 작용함으로써 누설전류를 차단할 수 있다.At this time, the capacitor unit 120 provided in the composite elements 100 and 100 'can block the DC component included in the leakage current, and also, because the AC component of the leakage current has a relatively low frequency compared to the wireless communication band, Leakage current can be blocked by acting as a large impedance for the frequency.
결과적으로, 복합소자(100,100')는 회로부(14)의 접지로부터 유입되는 외부전원에 의한 누설전류를 차단하여 사용자를 감전으로부터 보호할 수 있다.As a result, the composite elements 100 and 100 'can protect the user from electric shock by blocking the leakage current caused by external power flowing from the ground of the circuit unit 14.
또한, 복합소자(100,100')는 전도체가 안테나의 일부로 구성되는 경우, 전도체를 통해 유입되는 통신신호를 커패시터부(120,120')를 통해 통과시킬 수 있다. 이때, 바리스터부(110,110")는 턴 오프되어 복합소자(100,100')는 커패시터로서 기능할 수 있다.Further, the composite elements 100 and 100 'may pass a communication signal flowing through the conductor through the capacitor units 120 and 120' when the conductor is a part of the antenna. At this time, the varistor parts 110 and 110 "are turned off so that the composite elements 100 and 100 'may function as capacitors.
즉, 복합소자(100,100')는 바리스터부(110,110")가 오픈 상태로 유지되어 전도체(12)와 회로부(14)를 차단하지만, 내부의 커패시터부(120,120')가 유입된 통신신호를 통과시킬 수 있다. 이와 같이, 복합소자(100,100')의 커패시터부(120,120')는 통신신호의 유입 경로를 제공할 수 있다. That is, the composite elements 100 and 100 'maintain the open varistor parts 110 and 110 "to block the conductor 12 and the circuit part 14, but allow the internal capacitor parts 120 and 120' to pass the incoming communication signal. In this way, the capacitor units 120 and 120 'of the composite elements 100 and 100' may provide an inflow path for communication signals.
여기서, 상기 휴대용 전자장치는 휴대가 가능하고 운반이 용이한 휴대용 전자기기의 형태일 수 있다. 일례로, 상기 휴대용 전자장치는 스마트폰, 셀룰러폰 등과 같은 휴대단말기일 수 있으며, 스마트 워치, 디지털 카메라, DMB, 전자책, 넷북, 태블릿 PC, 휴대용 컴퓨터 등일 수 있다. 이러한 전자장치들은 외부기기와의 통신을 위한 안테나 구조들을 포함하는 임의의 적절한 전자 컴포넌트들을 구비할 수 있다. 더불어, 와이파이(Wi-Fi) 및 블루투스와 같은 근거리 네트워크 통신을 사용하는 기기일 수 있다. Here, the portable electronic device may be in the form of a portable electronic device that is portable and easy to carry. For example, the portable electronic device may be a portable terminal such as a smart phone or a cellular phone, and may be a smart watch, digital camera, DMB, e-book, netbook, tablet PC, or portable computer. These electronic devices can have any suitable electronic components, including antenna structures for communication with external devices. In addition, it may be a device using short-range network communication such as Wi-Fi and Bluetooth.
이와 같은 휴대용 전자장치(10)는 금속(알루미늄, 스테인리스 스틸 등)과 같은 도전성 재료들, 또는 탄소-섬유 합성 재료 또는 기타 섬유 계열 합성물들, 유리, 세라믹, 플라스틱 및 이들을 조합한 재료로 이루어진 외부 하우징을 포함할 수 있다. The portable electronic device 10 is an outer housing made of conductive materials such as metal (aluminum, stainless steel, etc.), or carbon-fiber composite materials or other fiber-based composites, glass, ceramic, plastic, and combinations thereof. It may include.
이때, 휴대용 전자장치(10)의 하우징은 금속으로 이루어지고 외부로 노출되는 전도체(12)를 포함할 수 있다. 여기서, 상기 전도체(12)는 상기 전자장치와 외부기기의 통신을 위한 안테나, 메탈 케이스, 및 도전성 장신구 중 적어도 하나를 포함할 수 있다.At this time, the housing of the portable electronic device 10 may be made of metal and include a conductor 12 exposed to the outside. Here, the conductor 12 may include at least one of an antenna, a metal case, and conductive ornaments for communication between the electronic device and an external device.
특히, 상기 메탈 케이스는 상기 휴대용 전자장치(10)의 하우징의 측부를 부분적으로 둘러싸거나 전체적으로 둘러싸도록 구비될 수 있다. 또한, 상기 메탈 케이스는 상기 전자장치의 하우징의 전면 또는 후면에 외부로 노출되도록 구비되는 카메라를 둘러싸도록 구비될 수 있다.In particular, the metal case may be provided to partially or entirely surround the side of the housing of the portable electronic device 10. In addition, the metal case may be provided to surround a camera provided to be exposed to the outside on the front or rear of the housing of the electronic device.
여기서, 복합소자(100,100')는 상기 휴대용 전자장치(10)의 하우징에 구비되는 메탈 케이스의 개수에 맞춰 적절하게 구비될 수 있다. 다만, 도 12와 같이 상기 메탈 케이스가 복수 개로 구비되는 경우 각각의 메탈 케이스(12a,12b,12c,12d)는 모두 복합소자(100,100')가 개별적으로 연결되도록 상기 휴대용 전자장치(10)의 하우징에 내장될 수 있다.Here, the composite elements 100 and 100 ′ may be appropriately provided according to the number of metal cases provided in the housing of the portable electronic device 10. However, when the plurality of metal cases are provided as shown in FIG. 12, each of the metal cases 12a, 12b, 12c, and 12d is a housing of the portable electronic device 10 so that the composite elements 100 and 100 'are individually connected. Can be built in.
즉, 상기 휴대용 전자장치(10)의 하우징의 측부를 둘러싸는 메탈 케이스와 같은 전도체(12)가 네 부분으로 이루어지는 경우 각각의 부분(12a,12b,12c,12d)는 모두 복합소자(100,100')와 연결됨으로써 누설전류 및 정전기로부터 상기 휴대용 전자장치(10) 내부의 회로를 보호할 수 있다.That is, when the conductor 12 such as a metal case surrounding the side of the housing of the portable electronic device 10 is composed of four parts, each of the parts 12a, 12b, 12c, and 12d is a composite device 100,100 ' By being connected to it can protect the circuit inside the portable electronic device 10 from leakage current and static electricity.
이때, 상기 복합소자(100,100')는 복수 개의 메탈 케이스(12a,12b,12c,12d)가 구비되는 경우 상기 메탈 케이스(12a,12b,12c,12d)의 해당 역할에 맞게 다양한 방식으로 구비될 수 있다.In this case, when the plurality of metal cases 12a, 12b, 12c, and 12d are provided, the composite elements 100 and 100 'may be provided in various ways according to the corresponding roles of the metal cases 12a, 12b, 12c, and 12d. have.
일례로, 상기 휴대용 전자장치(10)의 하우징에 외부로 노출되는 카메라가 구비되는 경우 상기 카메라를 둘러싸는 전도체(12d)에 상기 복합소자(100,100')가 적용되는 경우, 상기 복합소자(100,100')는 누설전류를 차단하고 정전기로부터 내부회로를 방호하는 형태로 구비될 수 있다.For example, when a camera exposed to the outside of the housing of the portable electronic device 10 is provided, when the composite elements 100 and 100 'are applied to the conductor 12d surrounding the camera, the composite elements 100 and 100' ) May be provided in a form of blocking the leakage current and protecting the internal circuit from static electricity.
또한, 상기 메탈 케이스(12b)가 그라운드 역할을 수행하는 경우 상기 복합소자(100,100')는 상기 메탈 케이스(12b)와 연결되어 누설전류를 차단하고 정전기로부터 내부회로를 보호하는 형태로 구비될 수 있다.In addition, when the metal case 12b serves as a ground, the composite elements 100 and 100 'may be connected to the metal case 12b to block leakage current and protect internal circuits from static electricity. .
한편, 도 13에 도시된 바와 같이, 복합소자(100,100')는 메탈 케이스(12')와 회로기판(14') 사이를 연결할 수 있다. 이때, 복합소자(100,100')는 정전기를 자체 파손 없이 통과시키기 위한 것이기 때문에, 회로기판(14')은 정전기를 접지로 바이 패스하기 위한 별도의 보호소자(16)를 구비할 수 있다. 여기서, 보호소자(16)는 써프레서 또는 바리스터일 수 있다. Meanwhile, as illustrated in FIG. 13, the composite elements 100 and 100 ′ may connect between the metal case 12 ′ and the circuit board 14 ′. At this time, since the composite elements 100 and 100 'are for passing static electricity without damage, the circuit board 14' may include a separate protection element 16 for bypassing static electricity to ground. Here, the protection element 16 may be a suppressor or a varistor.
도 14에 도시된 바와 같이, 복합소자(100,100')는 메탈 케이스(12')와 FFM(front End Module)(14a) 사이에서 정합회로(예를 들면, R 및 L 성분)를 통하여 배치될 수 있다. 여기서 메탈 케이스(12')는 안테나일 수 있다. 이때, 복합소자(100,100')는 통신신호를 감쇄없이 통과시키는 동시에 메탈 케이스(12')로부터의 정전기를 통과시키고, 정합회로를 통하여 접지로부터 유입되는 누설전류를 차단시키기 위한 것이다. As shown in FIG. 14, the composite elements 100 and 100 'may be disposed through a matching circuit (for example, R and L components) between the metal case 12' and the front end module (FFM) 14a. have. Here, the metal case 12 'may be an antenna. At this time, the composite elements 100 and 100 'pass communication signals without attenuation and pass static electricity from the metal case 12' and block leakage current flowing from the ground through the matching circuit.
도 15에 도시된 바와 같이, 복합소자(100,100')는 안테나가 구비된 메탈 케이스(12')와 해당 안테나를 통한 통신 기능을 구현하는 IC(14c) 사이에 배치될 수 있다. 여기서, 해당 통신 기능은 NFC 통신일 수 있다. 이때, 복합소자(100,100')는 정전기를 자체 파손 없이 통과시키기 위한 것이기 때문에, 정전기를 접지로 바이 패스하기 위한 별도의 보호소자(16)를 구비할 수 있다. 여기서, 보호소자(16)는 써프레서 또는 바리스터일 수 있다. As shown in FIG. 15, the composite elements 100 and 100 ′ may be disposed between a metal case 12 ′ equipped with an antenna and an IC 14c that implements a communication function through the corresponding antenna. Here, the corresponding communication function may be NFC communication. At this time, since the composite elements 100 and 100 'are for passing static electricity without self-damage, a separate protective element 16 for bypassing static electricity to ground may be provided. Here, the protection element 16 may be a suppressor or a varistor.
도 16에 도시된 바와 같이, 복합소자(100,100')는 PIFA(Planar Inverted F Antenna) 안테나(20)의 쇼트 핀(short pin)(22)과 매칭회로 사이에 배치될 수 있다. 이때, 복합소자(100,100')는 통신신호를 감쇄 없이 통과시키는 동시에 메탈 케이스(12')로부터의 정전기를 통과시키고, 정합회로를 통하여 접지로부터 유입되는 누설전류를 차단시키기 위한 것이다.As shown in FIG. 16, the composite elements 100 and 100 ′ may be disposed between a short pin 22 and a matching circuit of a PIFA (Planar Inverted F Antenna) antenna 20. At this time, the composite elements 100 and 100 'pass communication signals without attenuation and pass static electricity from the metal case 12' and block leakage current flowing from the ground through the matching circuit.
또한, 상기 전도체(12)는 도전성 케이스에서 외측으로 돌출 형성되는 첨단부를 포함할 수 있다. 일례로, 상기 전도체는 사이드 키를 포함할 수 있다. 아울러, 상기 첨단부는 외부 기기와 연결을 위한 커넥터의 삽입구, 일례로, 이어폰, 충전 케이블, 데이터 케이블 등이 삽입되는 커넥터의 삽입구의 일단을 포함할 수 있다.In addition, the conductor 12 may include a tip portion protruding outward from the conductive case. In one example, the conductor may include a side key. In addition, the tip portion may include an insertion port of a connector for connection with an external device, for example, one end of an insertion port of a connector into which an earphone, a charging cable, a data cable, and the like are inserted.
즉, 본 발명의 실시예에 따른 복합소자(100,100')는 정전기의 유입 가능성이 높은 외부로 돌출된 부분이나 뾰족한 형상을 갖는 부분과 회로부를 연결하는 경우, 정전기(ESD)에 대한 높은 응답특성 및 고용량 커패시턴스를 동시에 구현할 수 있다.That is, the composite device 100,100 'according to an embodiment of the present invention has a high response characteristic to electrostatic discharge (ESD) when connecting a circuit portion and a protruding portion or a pointed shape with a high possibility of inflow of static electricity. High capacity capacitance can be implemented at the same time.
하기의 실시예를 통하여 본 발명을 더욱 구체적으로 설명하기로 하지만, 하기 실시예가 본 발명의 범위를 제한하는 것은 아니며, 이는 본 발명의 이해를 돕기 위한 것으로 해석되어야 할 것이다.The present invention will be described in more detail through the following examples, but the following examples are not intended to limit the scope of the present invention, which should be interpreted to help understand the present invention.
<실시예 1><Example 1>
길이, 폭, 높이가 각각 0.94㎜, 0.47㎜, 0.23㎜인 도 6b와 같은 구조의 커패시터부와 0.94㎜, 0.47㎜, 0.25㎜인 도 5c와 같은 구조의 바리스터부를 준비했다.A capacitor portion having a structure as shown in FIG. 6B having a length, width, and height of 0.94 mm, 0.47 mm, and 0.23 mm, respectively, and a varistor portion having a structure as shown in FIG. 5C having 0.94 mm, 0.47 mm, and 0.25 mm were prepared.
이후, 주제수지인 에폭시 수지와 경화제가 포함된 접합조성물을 커패시터부 상부에 도 9와 같이 스크린 인쇄하여 커패시터부 상부면 전체 면적의 63.38%만큼 커패시터 상부면을 덮도록 가접합부를 형성시켰고, 가접합부 길이는 0.8㎜로 커패시터부 상부면 전체길이의 85.1%, 가접합부 폭은 0.35㎜로 커패시터부 상부면 전체 폭의 74.5%로 형성되었으며, 두께는 30㎛이었다.Subsequently, a temporary bonding portion was formed to cover the upper surface of the capacitor by 63.38% of the total area of the upper surface of the capacitor portion by screen-printing the bonding composition containing the main resin, an epoxy resin, and a curing agent, as shown in FIG. The length was 0.8 mm, 85.1% of the total length of the upper surface of the capacitor portion, and the width of the temporary junction was 0.35 mm, and 74.5% of the total width of the upper surface of the capacitor portion, and the thickness was 30 µm.
이후, 도 8과 같은 복합소자로 구현시키기 위하여 가접합부가 형성된 커패시터부 상부에 지그를 이용해 바리스터부를 정렬공차가 50㎛ 이내가 되도록 적층시킨 뒤 가접합부를 경화시키기 위하여 200℃로 열을 가하여 접합부를 형성시켰다. 이후, 적층된 커패시터부와 바리스터부에서 전극이 노출된 양측에 외부단자를 각각 형성시켰으며, 구체적으로 에폭시 성분과 76중량%로 도전성 금속인 Ag를 포함하는 전극페이스트에 전극이 노출된 일측을 디핑시킨 뒤, 200℃의 온도로 열처리하여 두께가 20㎛인 외부단자를 한 쌍 형성시켰다. 이를 통해 하기 표 1과 같은 복합소자를 구현했고, 최종 구현된 복합소자는 길이 1.00㎜, 폭 0.5㎜, 높이 0.5㎜로 부피가 0.25㎣이었다.Subsequently, in order to implement the composite device as shown in FIG. 8, the varistor portion is stacked so that the alignment tolerance is within 50 μm using a jig on the upper portion of the capacitor portion where the temporary junction portion is formed, and then heat is applied at 200 ° C. to harden the temporary junction, thereby bonding the junction. Formed. Subsequently, external terminals were respectively formed on both sides of the electrode exposed in the stacked capacitor portion and the varistor portion, and specifically, one side of the electrode exposed to the electrode paste containing Ag, which is a conductive metal at 76% by weight, was dipping. After that, a pair of external terminals having a thickness of 20 µm was formed by heat treatment at a temperature of 200 ° C. Through this, the composite device as shown in Table 1 was implemented, and the final implemented composite device had a volume of 0.25 mm with a length of 1.00 mm, a width of 0.5 mm, and a height of 0.5 mm.
<실시예 2 ~ 6><Examples 2 to 6>
실시예 1과 동일하게 수행하여 실시하되, 하기 표 1과 같이 가접합부가 커패시터부 상부면을 덮는 면적, 가접합부의 길이, 및/또는 폭을 변경하여 하기 표 1과 같은 복합소자를 구현하였다.It was carried out in the same manner as in Example 1, but as shown in Table 1, the composite device as shown in Table 1 was implemented by changing the area, the length, and / or the width of the temporary bonding portion covering the upper surface of the capacitor portion.
<비교예 1 ~ 4><Comparative Examples 1 to 4>
실시예 1과 동일하게 수행하여 실시하되, 하기 표 1과 같이 가접합부가 커패시터부 상부면을 덮는 면적을 하기 표 1과 같이 변경하여 하기 표 1과 같은 복합소자를 구현하였다.It was carried out in the same manner as in Example 1, but the area where the provisional junction part covers the upper surface of the capacitor part as shown in Table 1 was changed as shown in Table 1 to implement the composite device shown in Table 1 below.
<실험예> <Experimental Example>
각각의 실시예 및 각각의 비교예별로 100개의 복합소자 제조한 후 실시예 및 비교예별 100개의 복합소자를 시편으로 하여 하기와 같은 물성평가를 실시하였고, 그 결과를 하기 표 1에 나타내었다.After manufacturing 100 composite devices for each Example and each Comparative Example, 100 composite devices for each Example and Comparative Example were used as specimens, and the following physical property evaluations were performed, and the results are shown in Table 1 below.
1. 외관품질 평가1. Appearance quality evaluation
접합부가 복합소자의 커패시터부 및/또는 바리스터부의 소체 측면까지 흘러 형성되었는지에 대해 육안 평가했으며, 접합부가 상기 소체 측면의 일부 또는 전부에 침범하여 형성된 시편의 개수를 카운팅하였다. It was visually evaluated whether the junction was formed to flow to the body side of the capacitor portion and / or the varistor portion of the composite element, and the number of specimens formed by invading the part or all of the body side portion was counted.
2. 외관품질인 양품인 시편의 접합부 평균길이, 평균 폭 및 평균 두께2. Average length, average width and average thickness of joints of good quality specimens
외관품질 평가 결과 양품인 시편들을 대상으로 구현된 접합부의 길이, 폭 및 두께를 측정하였고, 이를 평균하여 표에 나타내었다. As a result of appearance quality evaluation, the length, width, and thickness of the joints implemented for the specimens of good quality were measured, and averaged and shown in the table.
비교예1의 경우 양품인 것이 없어서 접합부의 길이, 폭을 측정하지 않았고, 두께만 측정하였다. In the case of Comparative Example 1, since there was no good product, the length and width of the joint were not measured, and only the thickness was measured.
3. 복합소자 신뢰성 평가3. Reliability evaluation of composite devices
복합소자 전단과 후단에 각각 형성된 외부단자가 도 4와 같이 형성된 외부단자의 길이(s)를 초과하여 소체 간 홈을 따라 번졌는지 여부에 대해 평가했고, 외부단자의 초과한 길이(t)가 외부단자의 길이(s) 대비 1% 미만의 경우 5, 1%이상 2% 미만일 경우 4, 2%이상 4%미만일 경우 3, 4%이상 6% 미만일 경우 2, 6%이상 10%미만일 경우 1, 10%를 초과한 경우 0으로 평가하였다. It was evaluated whether the external terminals formed at the front end and the rear end of the composite element spread along the grooves between the bodies in excess of the length s of the external terminals formed as shown in FIG. 4, and the excess length t of the external terminals was external. Terminal length (s) less than 1% 5, 1% or more 2% or less 4, 2% or more 4% or less 3, 4% or more 6% or less 2, 6% or more 10% or less 1, When it exceeded 10%, it was evaluated as 0.
4. 접착강도4. Adhesive strength
시편의 커패시터부가 PCB 기판 상에 실장되도록 SMT시킨 뒤, 시편의 길이방향에 수직한 측면방향으로 1.0kgf의 힘을 가한 뒤, 시편을 광학현미경으로 관찰하여 커패시터와 바리스터 사이의 접합부에 균열 및/또는 분리가 발생한 시편의 개수를 카운팅하여 하기 표 1에 나타내었다.
After SMT so that the capacitor portion of the specimen is mounted on the PCB substrate, after applying a force of 1.0 kgf in the lateral direction perpendicular to the longitudinal direction of the specimen, the specimen is observed with an optical microscope to crack and / or crack the joint between the capacitor and varistor. Table 1 shows the number of specimens where separation occurred.
| 실시예1Example 1 | 실시예2Example 2 | 실시예3Example 3 | 실시예4Example 4 | 실시예5Example 5 | 실시예6Example 6 | 실시예7Example 7 | 비교예1Comparative Example 1 | 비교예2Comparative Example 2 | 비교예3Comparative Example 3 | 비교예4Comparative Example 4 | ||
| 가접합부Temporary junction | 길이(㎜)Length (mm) | 0.800.80 | 0.800.80 | 0.700.70 | 0.850.85 | 0.800.80 | 0.760.76 | 0.890.89 | 0.920.92 | 0.880.88 | 0.850.85 | 0.550.55 |
| 폭(㎜)Width (mm) | 0.350.35 | 0.30.3 | 0.40.4 | 0.370.37 | 0.380.38 | 0.340.34 | 0.420.42 | 0.420.42 | 0.440.44 | 0.250.25 | 0.380.38 | |
| 두께(㎛)Thickness (㎛) | 3030 | 3232 | 2525 | 3030 | 3030 | 3030 | 0.370.37 | 3030 | 3030 | 3030 | 3030 | |
| 면적(㎟)Area (㎟) | 0.280.28 | 0.240.24 | 0.280.28 | 0.310.31 | 0.300.30 | 0.260.26 | 0.30.3 | 0.390.39 | 0.390.39 | 0.210.21 | 0.210.21 | |
| %L% L | 85.1185.11 | 85.1185.11 | 74.4774.47 | 90.4390.43 | 85.1185.11 | 80.8580.85 | 94.6894.68 | 97.8797.87 | 93.6293.62 | 97.8797.87 | 90.4390.43 | |
| %W% W | 74.4774.47 | 63.8363.83 | 85.1185.11 | 78.7078.70 | 80.8580.85 | 72.3472.34 | 89.3689.36 | 89.3689.36 | 93.6293.62 | 53.1953.19 | 80.8580.85 | |
| %S% S | 63.3863.38 | 54.3254.32 | 63.3863.38 | 71.1971.19 | 68.8168.81 | 58.4958.49 | 84.6084.60 | 87.4687.46 | 87.6487.64 | 48.1048.10 | 47.3147.31 | |
| 접합부copula | 평균 길이(㎜)Average length (mm) | 0.840.84 | 0.840.84 | 0.730.73 | 0.890.89 | 0.840.84 | 0.800.80 | 0.930.93 | -- | 0.920.92 | 0.890.89 | 0.580.58 |
| 평균폭(㎜)Average width (mm) | 0.370.37 | 0.310.31 | 0.420.42 | 0.390.39 | 0.400.40 | 0.360.36 | 0.440.44 | -- | 0.460.46 | 0.260.26 | 0.400.40 | |
| 평균두께(㎛)Average thickness (㎛) | 0.270.27 | 0.280.28 | 0.270.27 | 0.270.27 | 0.270.27 | 0.270.27 | 0.270.27 | 0.270.27 | 0.270.27 | 0.270.27 | 0.270.27 | |
| 평균면적(㎟)Average area (㎟) | 0.310.31 | 0.260.26 | 0.310.31 | 0.350.35 | 0.340.34 | 0.290.29 | 0.410.41 | -- | 0.420.42 | 0.230.23 | 0.230.23 | |
| %L% L | 89.3689.36 | 89.3689.36 | 77.6677.66 | 94.6894.68 | 89.3689.36 | 85.1185.11 | 98.9498.94 | -- | 97.8797.87 | 94.6894.68 | 61.7061.70 | |
| %W% W | 78.7278.72 | 65.9665.96 | 89.3689.36 | 82.9882.98 | 85.1185.11 | 76.6076.60 | 93.6293.62 | -- | 97.8797.87 | 55.3255.32 | 85.1185.11 | |
| %S% S | 70.1770.17 | 58.8558.85 | 70.1770.17 | 79.2279.22 | 76.9676.96 | 65.6465.64 | 92.8092.80 | -- | 95.0795.07 | 52.0652.06 | 52.0652.06 | |
| 물성Properties | 외관품질Appearance quality | 00 | 00 | 66 | 99 | 1One | 00 | 1313 | 100100 | 5151 | 2626 | 88 |
| 신뢰성responsibility | 55 | 33 | 55 | 55 | 55 | 55 | 55 | 55 | 55 | 00 | 00 | |
| 접착강도Adhesion strength | 1One | 1212 | 00 | 00 | 00 | 33 | 00 | 00 | 00 | 3030 | 2727 | |
| * %L: 커패시터 상부면 길이대비 가접합부(또는 접합부) 길이 백분율(%),* %W: 커패시터 상부면 폭 대비 가접합부(또는 접합부) 폭 백분율(%),* %S: 커패시터 상부면 면적대비 가접합부(또는 접합부) 면적 백분율(%)*% L: Percentage of the temporary junction (or junction) length compared to the length of the upper surface of the capacitor (%), *% W: Percentage of the temporary junction (or junction) width compared to the width of the upper surface of the capacitor (%), *% S: Area of the upper surface of the capacitor Contrast temporary junction (or junction) area percentage (%) | ||||||||||||
표 1에서 확인할 수 있듯이, 가접합부 면적이, 본 발명에 따른 가접합부 면적을 초과하여 형성된 비교예 1 및 비교예2의 경우 실시예에 대비하여 외관품질이 현저히 저하되었고, 본 발명에 따른 가접합부 면적 미만으로 형성된 비교예 3, 4의 경우 외관품질, 신뢰성 및 접착강도 모두 현저히 저하된 것을 확인할 수 있다. As can be seen in Table 1, in the case of Comparative Example 1 and Comparative Example 2, where the temporary joining area was formed in excess of the temporary joining area according to the present invention, the appearance quality was remarkably deteriorated compared to the Examples, and the temporary joining according to the present invention In the case of Comparative Examples 3 and 4 formed with less than the area, it can be seen that the appearance quality, reliability, and adhesive strength were all significantly reduced.
또한, 가접합부 면적이 본 발명에 따른 바람직한 가접합부 면적을 만족하는 실시예 1, 2, 5 및 6이 외관품질, 신뢰성 및 접착강도 모든 물성에 있어서 동시에 우수한 것을 확인할 수 있다.In addition, it can be seen that Examples 1, 2, 5, and 6, in which the temporary joining area satisfies the preferred temporary joining area according to the present invention, are excellent in appearance quality, reliability, and adhesive strength in all properties simultaneously.
이상에서 본 발명의 일 실시예에 대하여 설명하였으나, 본 발명의 사상은 본 명세서에 제시되는 실시 예에 제한되지 아니하며, 본 발명의 사상을 이해하는 당업자는 동일한 사상의 범위 내에서, 구성요소의 부가, 변경, 삭제, 추가 등에 의해서 다른 실시 예를 용이하게 제안할 수 있을 것이나, 이 또한 본 발명의 사상범위 내에 든다고 할 것이다.Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments presented herein, and those skilled in the art to understand the spirit of the present invention may add elements within the scope of the same spirit. However, other embodiments may be easily proposed by changing, deleting, adding, or the like, but this will also be considered to be within the scope of the present invention.
Claims (19)
- (1) 제1소체와 상기 제1소체의 내부에 배치되며 적어도 끝단이 제1소체의 양측에 노출된 바리스터 전극을 구비하는 바리스터부, 및 제2소체와 상기 제2소체의 내부에 배치되며, 적어도 끝단이 제2소체의 양측에 노출된 커패시터 전극을 구비하는 커패시터부를 각각 준비하는 단계;(1) a varistor portion disposed inside the first body and the first body and having varistor electrodes at least at both ends of which are exposed on both sides of the first body, and a second body and the second body, Preparing a capacitor part having capacitor electrodes at least at both ends of which are exposed on both sides of the second body;(2) 상기 바리스터부 또는 상기 커패시터부의 상부면에 상기 상부면 전체면적의 50 ~ 85%를 덮도록 가접합부를 형성시키는 단계; (2) forming a temporary junction on the upper surface of the varistor portion or the capacitor portion to cover 50 to 85% of the total area of the upper surface;(3) 가접합부가 형성된 바리스터부 또는 커패시터부의 가접합부 상에 전극의 노출방향이 같도록 나머지 다른 하나를 적층시켜 접합시키는 단계; 및 (3) stacking and bonding the other one on the provisional junction of the varistor portion or the capacitor portion where the provisional junction is formed so that the electrode has the same exposure direction; And(4) 접합된 바리스터부와 커패시터부에서 전극이 노출된 양측에 상기 바리스터 전극 및 커패시터 전극이 전기적 연결되도록 한 쌍의 외부단자를 형성시키는 단계;를 포함하는 복합소자 제조방법. (4) forming a pair of external terminals such that the varistor electrode and the capacitor electrode are electrically connected to both sides where the electrodes are exposed from the bonded varistor portion and the capacitor portion.
- 제1항에 있어서, According to claim 1,상기 (2) 단계의 가접합부는 에폭시 성분 및 경화제를 포함하여 형성된 복합소자 제조방법.The method of manufacturing a composite device formed by including the epoxy component and the curing agent in the temporary bonding part of step (2).
- 제1항에 있어서, According to claim 1,상기 (2) 단계의 가접합부는 두께가 15 ~ 60㎛인 복합소자 제조방법.The method of manufacturing a composite device having a temporary bonding portion of 15 to 60㎛ in the step (2).
- 제1항에 있어서, According to claim 1,상기 (2) 단계의 가접합부는 상기 상부면의 길이에 대하여 50 ~ 95%의 길이와, 상기 상부면의 폭에 대하여 50 ~ 90%의 폭을 갖도록 형성되는 복합소자 제조방법.The method of manufacturing a composite device in which the temporary joining part of step (2) is formed to have a length of 50 to 95% with respect to the length of the upper surface and a width of 50 to 90% with respect to the width of the upper surface.
- 제1항에 있어서,According to claim 1,상기 가접합부는 에폭시 성분, 경화제, 및 결합강도를 향상시키기 위한 글래스 필러를 포함하고, The temporary bonding portion includes an epoxy component, a curing agent, and a glass filler for improving the bonding strength,상기 글래스 필러는 가접합부 전체 중량에 대하여 20 ~ 65중량%로 구비되는 복합소자 제조방법. The glass filler is a composite device manufacturing method that is provided in 20 to 65% by weight relative to the total weight of the temporary junction.
- 제1항에 있어서,According to claim 1,상기 가접합부는 상기 바리스터부 또는 상기 커패시터부의 상부면 전체면적의 58 ~ 70%를 덮도록 형성되는 복합소자 제조방법. The provisional bonding method is formed to cover 58 to 70% of the total area of the upper surface of the varistor portion or the capacitor portion.
- 제1항에 있어서,According to claim 1,외부단자와 바리스터 전극 및 커패시터 전극 간에 도통 신뢰성을 향상시키기 위하여, 상기 (1) 단계의 바리스터부는 바리스터 전극이 노출된 제1소체 양측에 구비되는 한 쌍의 제1외부전극을 더 포함하고, 상기 커패시터부는 커패시터 전극이 노출된 제2소체 양측에 구비되는 한 쌍의 제2외부전극을 더 포함하며, In order to improve the conduction reliability between the external terminal and the varistor electrode and the capacitor electrode, the varistor portion of step (1) further includes a pair of first external electrodes provided on both sides of the first body to which the varistor electrode is exposed, and the capacitor The unit further includes a pair of second external electrodes provided on both sides of the second body to which the capacitor electrode is exposed,상기 (4) 단계의 외부단자는 상기 제1외부전극과 제2외부전극 각각의 외부면 적어도 일부를 덮도록 형성되는 복합소자 제조방법.The method of manufacturing a composite device in which the external terminal of step (4) is formed to cover at least a portion of the outer surfaces of each of the first external electrode and the second external electrode.
- 제7항에 있어서,The method of claim 7,상기 제1외부전극 및 제2외부전극은 도전성 금속과 유리질 성분을 포함하는 소결형 전극인 복합소자 제조방법.The first external electrode and the second external electrode is a sintered electrode manufacturing method comprising a conductive metal and a glass component.
- 제7항에 있어서,The method of claim 7,상기 제1외부전극 및 제2외부전극은 두께가 15㎛ 이하이고, 폭은 200㎛ 이하로 형성된 복합소자 제조방법.The first external electrode and the second external electrode has a thickness of 15㎛ or less, the width of the composite device manufacturing method is formed to 200㎛ or less.
- 제4항에 있어서, According to claim 4,상기 가접합부는 상기 상부면 길이에 대하여 70 ~ 95%의 길이와, 상기 상부면 폭에 대하여 70 ~ 90%의 폭을 갖도록 형성되는 복합소자 제조방법.The temporary joining portion is 70 to 95% of the length of the upper surface, and the composite device manufacturing method is formed to have a width of 70 to 90% of the width of the upper surface.
- 제1소체와 상기 제1소체의 내부에 배치되며, 적어도 끝단이 제1소체의 양측에 노출된 바리스터 전극을 구비하는 바리스터부;A varistor portion disposed inside the first body and the first body, the varistor electrode having at least one end of which is exposed on both sides of the first body;제2소체와 상기 제2소체의 내부에 배치되며, 적어도 끝단이 제2소체의 양측에 노출된 커패시터 전극을 구비하고, 상기 바리스터 전극과 상기 커패시터 전극의 노출방향이 같도록 상기 바리스터부 하부에 적층된 커패시터부;It is disposed inside the second body and the second body, and provided with capacitor electrodes at least at both ends of which are exposed on both sides of the second body, and stacked under the varistor portion so that the varistor electrode and the capacitor electrode have the same exposure direction. Capacitor part;상기 바리스터부의 하부면 또는 상기 커패시터부의 상부면 전체면적의 55 ~ 93%를 덮도록 상기 바리스터부와 상기 커패시터부 사이에 개재된 접합부; 및A junction interposed between the varistor portion and the capacitor portion to cover 55 to 93% of the total area of the lower surface of the varistor portion or the upper surface of the capacitor portion; And적층된 바리스터부와 커패시터부의 양측에 구비되어 노출된 바리스터 전극 및 커패시터 전극과 전기적 연결되는 한 쌍의 외부단자;를 포함하는 복합소자.And a pair of external terminals provided on both sides of the stacked varistor portion and the capacitor portion and electrically connected to the exposed varistor electrode and the capacitor electrode.
- 제11항에 있어서,The method of claim 11,상기 접합부의 평균두께는 7 ~ 40㎛인 복합소자.The average thickness of the junction is 7 to 40㎛ composite device.
- 제11항에 있어서,The method of claim 11,상기 접합부의 길이는 상기 바리스터부의 하부면 또는 상기 커패시터부의 상부면 전체길이의 75 ~ 99%이고, 상기 접합부의 폭은 상기 바리스터부의 하부면 또는 상기 커패시터부의 상부면 전체 폭의 75 ~ 95%인 복합소자.The length of the junction is 75 to 99% of the total length of the lower surface of the varistor or the upper surface of the capacitor, and the width of the junction is 75 to 95% of the total width of the lower surface of the varistor or the upper surface of the capacitor. device.
- 제11항에 있어서,The method of claim 11,상기 제1소체의 높이는 제2소체 보다 큰 복합소자.The height of the first body is a composite device larger than the second body.
- 제11항에 있어서,The method of claim 11,상기 복합소자는 부피가 0.32㎣ 이하인 복합소자.The composite element is a composite element having a volume of 0.32 mm or less.
- 제11항에 있어서, The method of claim 11,상기 복합소자는 안테나로 사용되는 영역을 포함하는 전자장치의 인체 접촉가능 전도체인 메탈 케이스와 내장 회로부 사이를 연결하는 소자로서,The composite device is a device that connects a metal case, which is a conductor that can be touched by a human body, of an electronic device including an area used as an antenna and an internal circuit part상기 커패시터부는 상기 안테나로 사용되는 메탈 케이스로부터 유입되는 통신신호를 통과시키며, 통신주파수 대역에서 상기 통신신호가 감쇄없이 통과하는 동시에 상기 내장 회로부의 접지로부터 유입되는 상기 전자장치의 외부전원에 의한 누설전류 중 DC 성분의 차단능력을 향상시키고, 상기 전자장치의 외부전원의 정격전압보다 높은 절연파괴전압을 가지며, The capacitor unit passes a communication signal flowing from a metal case used as the antenna, and at the same time, the communication signal passes without attenuation in a communication frequency band, and at the same time, a leakage current caused by external power of the electronic device flowing from the ground of the internal circuit unit. It improves the blocking ability of the DC component, and has an insulation breakdown voltage higher than the rated voltage of the external power supply of the electronic device,상기 바리스터부는 상기 메탈 케이스로부터 유입되는 정전기를 통과시킴과 아울러 상기 누설전류를 상기 메탈 케이스로 전달되지 않도록 차단하는 복합소자.The varistor part is a composite device that passes static electricity flowing from the metal case and blocks the leakage current from being transmitted to the metal case.
- 제11항에 있어서, The method of claim 11,상기 접합부는 상기 바리스터부 하부면 또는 상기 커패시터부 상부면 전체면적의 65 ~ 78%를 덮도록 형성된 것인 복합소자.The junction is a composite device formed to cover 65 to 78% of the total area of the lower surface of the varistor or the upper surface of the capacitor.
- 도전성 케이스에서 외측으로 돌출 형성되는 첨단부를 포함하는 전도체; A conductor including a tip portion protruding outward from the conductive case;회로부; 및 Circuit part; And상기 전도체와 회로부를 전기적으로 연결하는 청구항 11에 따른 복합소자를 포함하는 휴대용 전자장치.A portable electronic device including the composite element according to claim 11 that electrically connects the conductor and the circuit.
- 제18항에 있어서,The method of claim 18,상기 전도체는 사이드 키를 포함하거나,The conductor includes a side key,상기 첨단부는 외부 기기와 연결을 위한 커넥터의 삽입구의 일단을 포함하는 휴대용 전자장치.The tip portion is a portable electronic device including one end of the connector opening for connection with an external device.
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| US20160141106A1 (en) * | 2012-06-26 | 2016-05-19 | Kemet Electronics Corporation | Method for Stacking Electronic Components |
| KR20170063156A (en) * | 2015-11-30 | 2017-06-08 | 주식회사 아모텍 | Circuit protection device and mobile electronic device with the same |
| US20180137977A1 (en) * | 2016-11-14 | 2018-05-17 | Kemet Electronics Corporation | MLCC with ID Marker for Orientation |
| KR20180078124A (en) * | 2016-12-29 | 2018-07-09 | 주식회사 모다이노칩 | Complex component and electronic device having the same |
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| US20160141106A1 (en) * | 2012-06-26 | 2016-05-19 | Kemet Electronics Corporation | Method for Stacking Electronic Components |
| KR20150135909A (en) * | 2014-05-26 | 2015-12-04 | 삼성전기주식회사 | Composite electronic component, manufacturing method thereof, board for mounting the same and packing unit thereof |
| KR20170063156A (en) * | 2015-11-30 | 2017-06-08 | 주식회사 아모텍 | Circuit protection device and mobile electronic device with the same |
| US20180137977A1 (en) * | 2016-11-14 | 2018-05-17 | Kemet Electronics Corporation | MLCC with ID Marker for Orientation |
| KR20180078124A (en) * | 2016-12-29 | 2018-07-09 | 주식회사 모다이노칩 | Complex component and electronic device having the same |
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