WO2020032513A1 - Gabarit de support de masque, son procédé de fabrication et procédé de fabrication de masque à cadre intégré - Google Patents

Gabarit de support de masque, son procédé de fabrication et procédé de fabrication de masque à cadre intégré Download PDF

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Publication number
WO2020032513A1
WO2020032513A1 PCT/KR2019/009744 KR2019009744W WO2020032513A1 WO 2020032513 A1 WO2020032513 A1 WO 2020032513A1 KR 2019009744 W KR2019009744 W KR 2019009744W WO 2020032513 A1 WO2020032513 A1 WO 2020032513A1
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WIPO (PCT)
Prior art keywords
mask
frame
template
metal film
manufacturing
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PCT/KR2019/009744
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English (en)
Korean (ko)
Inventor
이병일
이유진
Original Assignee
주식회사 티지오테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020180122020A external-priority patent/KR101988498B1/ko
Application filed by 주식회사 티지오테크 filed Critical 주식회사 티지오테크
Priority to CN201980048804.XA priority Critical patent/CN112470302A/zh
Publication of WO2020032513A1 publication Critical patent/WO2020032513A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Definitions

  • the present invention relates to a mask support template, a method of manufacturing the same, and a method of manufacturing the frame-integrated mask. More specifically, it is possible to stably support and move without deformation of the mask, improve the adhesion between the mask and the frame when the mask is integrated with the frame, and align between the masks clearly.
  • a mask support template a method of manufacturing the same, and a method of manufacturing the frame-integrated mask.
  • a fine metal mask (FMM) method is used in which a thin metal mask is adhered to a substrate to deposit an organic material at a desired position.
  • the mask is manufactured in the form of a stick, a plate, and the like, and then the mask is welded and fixed to the OLED pixel deposition frame.
  • Each mask may include a plurality of cells corresponding to one display.
  • several masks may be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tension to make the entire part of the mask flat is a very difficult task.
  • QHD image quality is 500 ⁇ 600 pixel per inch (PPI), and the pixel size is about 30 ⁇ 50 ⁇ m, and 4K UHD, 8K UHD high definition is higher than 860 PPI, ⁇ 1600 PPI, etc. It has a resolution of.
  • the alignment error between the cells must be reduced to several micrometers, and the error beyond this can lead to product failure, resulting in very low yield. Therefore, there is a need for development of a technique for preventing deformation, such as knocking or twisting of a mask and making alignment clear, a technique for fixing a mask to a frame, and the like.
  • an object of the present invention is to provide a mask support template capable of stably supporting and moving a mask without deformation, and to provide a method of manufacturing the same.
  • an object of this invention is to provide the mask support template which can improve the adhesive force of a mask and a frame, and its manufacturing method when adhering a mask to a frame.
  • an object of this invention is to provide the manufacturing method of the frame-integrated mask which markedly reduced manufacturing time and raised the yield significantly.
  • the above object of the present invention is to provide a method of manufacturing a template for supporting an OLED pixel forming mask to correspond to a frame, comprising the steps of: (a) providing a mask metal film; (b) adhering a mask metal film on a template having a temporary adhesive portion formed on one surface thereof; And (c) forming a mask pattern on the mask metal film to produce a mask.
  • the method may further include reducing the thickness of the mask metal film adhered to the template.
  • the step (a) may include: (a1) forming a mask metal film on at least one surface of the conductive single crystal substrate; And (a2) separating the mask metal film from the conductive single crystal substrate.
  • the temporary adhesive part may be an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation.
  • Step (c) includes: (c1) forming a patterned insulating portion on the mask metal film; (c2) etching a portion of the mask metal film exposed between the insulating parts to form a mask pattern; And (c3) removing the insulation.
  • the temporary adhesive part may be formed on the entire surface of the template, and the mask metal film may be adhered to the entire surface of the temporary adhesive part.
  • the template may include a material of any one of a wafer, glass, silica, heat resistant glass, quartz, alumina (Al 2 O 3 ), borosilicate glass, and zirconia. have.
  • the above object of the present invention is a template for supporting an OLED pixel forming mask and corresponding to a frame, comprising: a template; A temporary adhesive portion formed on the template; And a mask adhered onto the template via the temporary adhesive portion, the mask including the mask pattern having a mask pattern formed thereon.
  • the temporary adhesive part may be an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation.
  • a laser through hole may be formed in the portion of the template corresponding to the welded portion of the mask.
  • the temporary adhesive part may be formed on the entire surface of the template, and the mask metal film may be adhered to the entire surface of the temporary adhesive part.
  • the template may include a material of any one of a wafer, glass, silica, heat resistant glass, quartz, alumina (Al 2 O 3 ), borosilicate glass, and zirconia. have.
  • the mask may include a mask cell in which a plurality of mask patterns are formed, and a dummy around the mask cell.
  • a method of manufacturing a frame-integrated mask integrally formed with at least one mask and a frame for supporting the mask comprising: (a) providing a mask metal film; (b) adhering a mask metal film on a template having a temporary adhesive portion formed on one surface thereof; (c) forming a mask pattern on the mask metal film to manufacture a mask; (d) providing a frame having at least one mask cell area; (e) loading the template onto the frame to correspond to the mask cell area of the frame; And (f) irradiating the welded portion of the mask with a laser to adhere the mask to the frame.
  • Step (d) may include: (d1) providing an edge frame portion including the hollow area; (d2) connecting the planar mask cell sheet portion to the edge frame portion; And (d3) forming a plurality of mask cell regions in the mask cell sheet part to manufacture a frame.
  • Step (d) may include: (d1) providing an edge frame portion including the hollow area; And (d2) manufacturing a frame by connecting a mask cell sheet part including a plurality of mask cell areas to an edge frame part.
  • the temporary adhesive part may be an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation.
  • the laser irradiated from the upper part of the template may pass through the laser through hole and may be irradiated to the welding part of the mask.
  • the method may further include separating the mask and the template by performing at least one of heat application, chemical treatment, ultrasonic application, and UV application to the temporary bonding unit.
  • the mask and frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.
  • the mask and the frame can form an integrated structure.
  • 1 is a schematic view showing a conventional mask for OLED pixel deposition.
  • FIG. 2 is a schematic diagram illustrating a process of adhering a conventional mask to a frame.
  • 3 is a schematic view showing that alignment errors between cells occur in the process of tensioning a conventional mask.
  • FIG. 4 is a front and side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
  • FIG. 5 is a front and side cross-sectional view showing a frame according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram illustrating a manufacturing process of a frame according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention.
  • FIG. 8 is a schematic diagram illustrating a mask for forming a conventional high resolution OLED.
  • FIG. 9 is a schematic diagram illustrating a mask according to an embodiment of the present invention.
  • FIG. 10 is a schematic diagram illustrating a process of manufacturing a mask metal film by a rolling method according to an embodiment of the present invention.
  • FIG. 11 is a schematic diagram illustrating a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.
  • FIG. 11 is a schematic diagram illustrating a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.
  • FIGS. 12 to 13 are schematic views illustrating a process of manufacturing a mask support template by adhering a mask metal film on a template and forming a mask according to an embodiment of the present invention.
  • FIG. 14 is an enlarged cross-sectional schematic view showing a temporary adhesive part according to an embodiment of the present invention.
  • 15 is a schematic diagram illustrating a process of loading a mask support template onto a frame according to an embodiment of the present invention.
  • 16 is a schematic diagram illustrating a state in which a template is loaded onto a frame and the mask corresponds to a cell area of the frame according to an embodiment of the present invention.
  • 17 is a schematic diagram illustrating a process of separating a mask and a template after attaching a mask to a frame according to an embodiment of the present invention.
  • FIG. 18 is a schematic diagram illustrating a state in which a mask is adhered to a frame according to an embodiment of the present invention.
  • 19 is a schematic view showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.
  • UV UV is applied
  • FIG. 1 is a schematic diagram showing a conventional mask for OLED pixel deposition 10.
  • the mask 10 may be manufactured in a stick type or a plate type.
  • the mask 10 shown in FIG. 1A is a stick type mask, and both sides of the stick may be welded and fixed to the OLED pixel deposition frame.
  • the mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel forming process.
  • a plurality of display cells C are provided in the body (or mask film 11) of the mask 10.
  • One cell C corresponds to one display such as a smartphone.
  • a pixel pattern P is formed to correspond to each pixel of the display.
  • the pixel pattern P is formed in the cell C to have a resolution of 70 ⁇ 140. That is, a large number of pixel patterns P may be clustered to form one cell C, and a plurality of cells C may be formed in the mask 10.
  • FIG. 2 is a schematic diagram illustrating a process of adhering the mask 10 to the frame 20.
  • 3 is a schematic view showing that alignment errors between cells occur in the process of tensioning the mask 10 (F1 to F2).
  • a stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.
  • the stick mask 10 should be flattened.
  • the stick mask 10 is unfolded as the tensile force F1 to F2 is applied in the major axis direction of the stick mask 10 and pulled.
  • the stick mask 10 is loaded onto the frame 20 having a rectangular frame shape.
  • the cells C1 to C6 of the stick mask 10 are positioned in the empty area of the frame 20 of the frame 20.
  • the frame 20 may be large enough so that the cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 10 are framed. It may also be large enough to fit inside the empty area.
  • the distances D1 to D1 ′′ and D2 to D2 ′′ may be different from each other or the patterns P may be skewed between the patterns P of the cells C1 to C3.
  • the stick mask 10 is a large area including a plurality of (eg, six) cells C1 to C6 and has a very thin thickness on the order of tens of micrometers, and thus is easily struck or warped by a load.
  • the minute error of the tensile force may cause an error in the extent that the cells (C1 ⁇ C3) of the stick mask 10 is extended or unfolded, and thus the distance (D1) between the mask pattern (P) ⁇ D1 ", D2-D2") cause a problem that becomes different.
  • the alignment error does not exceed 3 micrometers. It is preferable not to.
  • This alignment error between adjacent cells is referred to as pixel position accuracy (PPA).
  • the tensile force (F1 ⁇ F2) applied to the stick mask 10 may act inversely to the frame 20. That is, after the stick mask 10 is stretched by the tension force (F1 ⁇ F2) is connected to the frame 20 can be applied to the tension (tension) to the frame 20.
  • the tension may not be large and may not have a large influence on the frame 20.
  • the tension may slightly change the frame 20. Thus, a problem may arise in that the alignment state is changed between the plurality of cells C to C6.
  • the present invention proposes a frame 200 and a frame integrated mask that allow the mask 100 to form an integrated structure with the frame 200.
  • the mask 100 integrally formed in the frame 200 may be prevented from being deformed or warped, and may be clearly aligned with the frame 200. Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, the tension may not be applied to the frame 200 after the mask 100 is connected to the frame 200. .
  • the manufacturing time for integrally connecting the mask 100 to the frame 200 may be significantly reduced, and the yield may be significantly increased.
  • FIG. 4 is a front view (FIG. 4 (a)) and a side cross-sectional view (FIG. 4 (b)) showing a frame-integrated mask according to an embodiment of the present invention
  • Figure 5 is according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) which show a frame.
  • the frame integrated mask may include a plurality of masks 100 and one frame 200.
  • each of the plurality of masks 100 is bonded to the frame 200.
  • the rectangular mask 100 will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped at both sides before being bonded to the frame 200, and the frame 200. The protrusions can be removed after they have been glued to them.
  • a plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100.
  • One mask cell C may correspond to one display such as a smartphone.
  • the mask 100 may be an invar having a thermal expansion coefficient of about 1.0 ⁇ 10 ⁇ 6 / ° C. and a super invar material having about 1.0 ⁇ 10 ⁇ 7 / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, there is little possibility that the pattern shape of the mask is deformed by thermal energy, and thus, the mask 100 may be used as a fine metal mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, in consideration of the recent development of techniques for performing the pixel deposition process in a range where the temperature change is not large, the mask 100 has a slightly larger thermal expansion coefficient than that of nickel (Ni) and nickel-cobalt (Ni-Co). It may be a material such as). The mask 100 may use a metal sheet produced by a rolling process or electroforming. 9 and 10 will be described in detail later.
  • the frame 200 is formed to bond the plurality of masks 100.
  • the frame 200 may include various edges formed in a first direction (eg, a horizontal direction) and a second direction (eg, a vertical direction) including an outermost edge. These various corners may define the area to which the mask 100 is to be bonded on the frame 200.
  • the frame 200 may include an edge frame portion 210 having a substantially rectangular shape and a rectangular frame shape.
  • the inside of the frame frame 210 may be hollow. That is, the frame frame 210 may include a hollow region (R).
  • the frame 200 may be made of a metal material such as Invar, Super Invar, Aluminum, Titanium, etc., and may be made of Inbar, Super Invar, Nickel, or Nickel-Cobalt having the same thermal expansion coefficient as a mask in consideration of thermal deformation.
  • the materials may be applied to both the edge frame portion 210 and the mask cell sheet portion 220 which are components of the frame 200.
  • the frame 200 may include a plurality of mask cell regions CR and may include a mask cell sheet portion 220 connected to the edge frame portion 210.
  • the mask cell sheet part 220 may be formed by rolling, or may be formed using another film forming process such as electroplating.
  • the mask cell sheet part 220 may be connected to the edge frame part 210 after forming a plurality of mask cell areas CR through laser scribing, etching, etc. on a flat sheet.
  • the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, etc. after connecting the planar sheet to the edge frame unit 210.
  • a plurality of mask cell regions CR are first formed in the mask cell sheet 220 and then mainly connected to the edge frame portion 210.
  • the mask cell sheet unit 220 may include at least one of the edge sheet unit 221 and the first and second grid sheet units 223 and 225.
  • the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned from the same sheet, which are integrally formed with each other.
  • the edge sheet portion 221 may be substantially connected to the edge frame portion 210. Accordingly, the edge sheet part 221 may have a substantially rectangular shape and a rectangular frame shape corresponding to the edge frame part 210.
  • first grid sheet part 223 may extend in a first direction (horizontal direction).
  • the first grid sheet part 223 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221.
  • each of the first grid sheet portions 223 may be equally spaced apart.
  • the second grid sheet part 225 may be formed to extend in a second direction (vertical direction).
  • the second grid sheet part 225 may be formed in a straight line shape and both ends thereof may be connected to the edge sheet part 221.
  • the first grid sheet part 223 and the second grid sheet part 225 may vertically cross each other.
  • each of the second grid sheet portions 225 may be equally spaced apart.
  • the spacing between the first grid sheet portions 223 and the spacing between the second grid sheet portions 225 may be the same or different according to the size of the mask cell C.
  • the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction may be a rectangle, a square shape such as a parallelogram, a triangular shape, or the like. The edges, edges and corners may be partially rounded.
  • the cross-sectional shape is adjustable in the process of laser scribing, etching and the like.
  • the thickness of the edge frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220.
  • the edge frame part 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.
  • the mask cell sheet portion 220 In the case of the mask cell sheet portion 220, a process of manufacturing a substantially thick sheet is difficult, and if the thickness is too thick, a path through which the organic source 600 (see FIG. 19) passes through the mask 100 in the OLED pixel deposition process. This can cause problems. On the contrary, if the thickness is too thin, it may be difficult to secure rigidity enough to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the edge frame portion 210, but preferably thicker than the mask 100.
  • the mask cell sheet part 220 may have a thickness of about 0.1 mm to about 1 mm.
  • the widths of the first and second grid sheet parts 223 and 225 may be formed to about 1 to 5 mm.
  • a plurality of mask cell areas CR: CR11 to CR56 may be provided except for an area occupied by the edge sheet part 221 and the first and second grid sheet parts 223 and 225 in the planar sheet.
  • the mask cell region CR is a region occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the edge frame portion 210. Except for, it may mean an empty area.
  • the mask C may be used as a passage through which the pixels of the OLED are deposited through the mask pattern P.
  • FIG. As described above, one mask cell C corresponds to one display such as a smartphone.
  • Mask patterns P that form one cell C may be formed in one mask 100.
  • one mask 100 may include a plurality of cells C and each cell C may correspond to each cell region CR of the frame 200. It is necessary to avoid the large area mask 100, and the small area mask 100 provided with one cell C is preferable.
  • one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for the sake of clear alignment, it may be considered to correspond to the mask 100 having a few cells C of about 2-3.
  • the frame 200 may include a plurality of mask cell regions CR, and each mask 100 may be bonded such that one mask cell C corresponds to the mask cell region CR.
  • Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy (corresponding to a portion of the mask film 110 except for the cell C) around the mask cell C. have.
  • the dummy may include only the mask film 110 or the mask film 110 having a predetermined dummy pattern having a similar shape to the mask pattern P.
  • the mask cell C may correspond to the mask cell region CR of the frame 200, and part or all of the dummy may be adhered to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 may form an integrated structure.
  • the frame is not manufactured by adhering the mask cell sheet portion 220 to the edge frame portion 210, the frame frame portion 210 in the hollow region (R) portion of the edge frame portion 210 ), A frame in which a grid frame (corresponding to the grid sheet portions 223 and 225) which is integral with the frame) is formed immediately.
  • the frame of this type also includes at least one mask cell region CR, and the mask integrated region may be manufactured by corresponding the mask 100 to the mask cell region CR.
  • FIGS. 4 and 5 may be provided.
  • 6 is a schematic diagram illustrating a manufacturing process of the frame 200 according to an embodiment of the present invention.
  • an edge frame unit 210 is provided.
  • the edge frame portion 210 may have a rectangular frame shape including the hollow area R.
  • a mask cell sheet part 220 is manufactured.
  • the mask cell sheet part 220 is manufactured by manufacturing a flat sheet using a rolling, pre-plating or other film forming process, and then removing the mask cell region CR through laser scribing or etching. can do.
  • a description is given taking an example of forming a 6 ⁇ 5 mask cell region (CR: CR11 to CR56).
  • the mask cell sheet part 220 may correspond to the edge frame part 210.
  • all the sides of the mask cell sheet part 220 are stretched (F1 to F4), and the edge sheet part 221 is connected to the edge frame part 210 while the mask cell sheet part 220 is flattened. It can respond.
  • the mask cell sheet part 220 may be grasped and tensioned at various points (for example, 1 to 3 points in FIG. 6B).
  • the mask cell sheet portion 220 may be stretched (F1, F2) not in all sides but in some lateral direction.
  • the edge sheet part 221 of the mask cell sheet part 220 may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly adhered to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase the adhesion.
  • the welding (W) part may be generated in a line or spot shape, and may have the same material as the mask cell sheet part 220 and integrate the edge frame part 210 and the mask cell sheet part 220. It can be a medium to connect to.
  • FIG. 7 is a schematic diagram illustrating a manufacturing process of a frame according to another embodiment of the present invention.
  • the mask cell sheet part 220 having the mask cell area CR is first manufactured and adhered to the edge frame part 210.
  • the embodiment of FIG. After adhesion to 210, the mask cell region CR is formed.
  • the edge frame part 210 including the hollow area R is provided.
  • the edge frame portion 210 may correspond to a planar sheet (the plane mask cell sheet portion 220 ′).
  • the mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed.
  • all sides of the mask cell sheet part 220 ' may be stretched (F1 to F4) to correspond to the edge frame part 210 in a state where the mask cell sheet part 220' is flattened.
  • the mask cell sheet portion 220 ' may be grasped and tensioned at several points (for example, 1 to 3 points in FIG. 7A).
  • the mask cell sheet portion 220 ' may be stretched (F1, F2) not in all sides but in some lateral direction.
  • the edge portion of the mask cell sheet portion 220' may be welded (W) and bonded. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly adhered to the edge frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 as much as possible to reduce the excited space between the edge frame portion 210 and the mask cell sheet portion 220 'as much as possible to increase the adhesion.
  • the welded W portion may be formed in a line or spot shape, and may have the same material as that of the mask cell sheet portion 220 ′ and have an edge frame portion 210 and a mask cell sheet portion 220 ′. It can be a medium to connect the integrally.
  • a mask cell region CR is formed in a planar sheet (planar mask cell sheet portion 220 ′).
  • the mask cell region CR may be formed by removing the sheet of the mask cell region CR through laser scribing or etching.
  • a description is given taking an example of forming a 6 ⁇ 5 mask cell region (CR: CR11 to CR56).
  • a portion welded to the edge frame portion 210 becomes the edge sheet portion 221, and five first grid sheet portions 223 and four second grids are formed.
  • the mask cell sheet part 220 having the sheet part 225 may be configured.
  • FIG. 8 is a schematic diagram illustrating a mask for forming a conventional high resolution OLED.
  • the size of the pattern is decreasing, and the thickness of the mask metal film used for this needs to be thinned.
  • the pixel spacing, the pixel size, and the like must be reduced in the mask 10 '(PD-> PD').
  • the patterning 13 suitable for the minute pixel spacing PD' and pixel size is formed. Since it is difficult to do this, it becomes a cause of a bad yield in a machining process.
  • a thin mask 10' must be used.
  • fine patterning may be performed only by using a thin mask 10 'having a thickness T2 of about 20 ⁇ m or less.
  • the use of a thin mask 10 ′ having a thickness T2 of about 10 ⁇ m may be considered for ultra high resolution of UHD or higher.
  • FIG. 9 is a schematic diagram illustrating a mask 100 according to an embodiment of the present invention.
  • the mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C.
  • the mask 100 may be manufactured from a metal sheet generated by a rolling process, electroplating, or the like, and one cell C may be formed in the mask 100.
  • the dummy DM corresponds to a portion of the mask film 110 (mask metal film 110) except for the cell C, includes only the mask film 110, or a predetermined dummy in a form similar to the mask pattern P.
  • the patterned mask layer 110 may be included.
  • a part or all of the dummy DM may be attached to the frame 200 (the mask cell sheet 220) in correspondence with the edge of the mask 100.
  • the width of the mask pattern P may be smaller than 40 ⁇ m, and the thickness of the mask 100 may be about 5 to 20 ⁇ m. Since the frame 200 includes a plurality of mask cell regions CR11 to CR56, the mask 100 having mask cells C11 to C56 corresponding to the respective mask cell regions CR11 to CR56. ) Can also be provided in plurality.
  • one surface 101 of the mask 100 is a surface to be bonded to the frame 200 to be bonded, it is preferable to be flat.
  • One surface 101 may be mirrored while being flattened by a planarization process to be described later.
  • the other surface 102 of the mask 100 may face one surface of the template 50 to be described later.
  • the mask metal film 110 ′ is manufactured, the mask 50 is supported by the template 50, and the template 50 on which the mask 100 is supported is loaded on the frame 200.
  • a series of processes for manufacturing the frame-integrated mask as the mask 100 is adhered to the frame 200 will be described.
  • FIG. 10 is a schematic diagram illustrating a process of manufacturing a mask metal film by a rolling method according to an embodiment of the present invention.
  • FIG. 11 is a schematic diagram illustrating a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.
  • FIG. 10 is a schematic diagram illustrating a process of manufacturing a mask metal film by a rolling method according to an embodiment of the present invention.
  • FIG. 11 is a schematic diagram illustrating a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.
  • the mask metal film 110 may be prepared.
  • the mask metal film 110 may be prepared by a rolling method.
  • the metal sheet generated by the rolling process may be used as the mask metal film 110 ′.
  • the metal sheet manufactured by the rolling process may have a thickness of several tens to hundreds of micrometers in the manufacturing process. As described above in FIG. 8, fine patterning may be performed only by using a thin mask metal film 110 having a thickness of about 20 ⁇ m or less for UHD high resolution, and about 10 ⁇ m thick for ultra high resolution of UHD or more. A thin mask metal film 110 having a must be used. However, since the mask metal film 110 ′ produced by the rolling process has a thickness of about 25 ⁇ m to 500 ⁇ m, it is necessary to make the thickness thinner.
  • planarizing (PS) one surface of the mask metal film 110 ′ may be further performed.
  • the planarization PS means that the surface of the mask metal film 110 'is mirrored while the upper portion of the mask metal film 110' is partially removed to reduce the thickness of the mask metal film 110 '.
  • Planarization (PS) may be performed by a chemical mechanical polishing (CMP) method, and known CMP methods may be used without limitation.
  • CMP chemical mechanical polishing
  • the thickness of the mask metal layer 110 ′ may be reduced by chemical wet etching or dry etching.
  • a flattening process of thinning the thickness of the mask metal film 110 ′ may be used without limitation.
  • the surface roughness of the top surface (R a) can be controlled.
  • mirroring may proceed with further reduction in surface roughness.
  • another example may be after performing a chemical wet etch or dry etch planarization process (PS) advances to, in addition to the polishing process, such as a separate CMP process after reducing the surface roughness (R a).
  • PS chemical wet etch or dry etch planarization process
  • the thickness of the mask metal film 110 ′ may be reduced to about 50 ⁇ m or less. Accordingly, the thickness of the mask metal film 110 may be about 2 ⁇ m to about 50 ⁇ m, and more preferably about 5 ⁇ m to about 20 ⁇ m. However, it is not necessarily limited thereto.
  • the mask metal film 110 may be manufactured by reducing the thickness of the mask metal film 110 ′ manufactured by the rolling process.
  • the thickness of the mask metal film 110 ′ may be reduced by performing a planarization (PS) process in a state in which the mask metal film 110 ′ is bonded to the template 50 to be described later via the temporary adhesive part 55.
  • PS planarization
  • the mask metal film 110 may be prepared by electroplating.
  • the conductive substrate 21 is prepared.
  • the substrate 21 of the mother plate may be a conductive material.
  • the mother plate can be used as a cathode electrode in electroplating.
  • the conductive material in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, and in the case of the polycrystalline silicon substrate, inclusions or grain boundaries may exist, and the conductive polymer may be present.
  • a base material it is highly likely to contain an impurity, and strength. Acid resistance may be weak.
  • defects Elements that interfere with the uniform formation of an electric field on the surface of the substrate (or negative electrode body), such as metal oxides, impurities, inclusions, grain boundaries, etc., are referred to as "defects.” Due to a defect, a uniform electric field may not be applied to the cathode body of the above-described material, so that a part of the plating film 110 (or the mask metal film 110) may be unevenly formed.
  • Non-uniformity of the plating film and the plating film pattern may adversely affect the formation of the pixel in implementing a UHD-class or higher definition pixel.
  • QHD image quality is 500 ⁇ 600 pixel per inch (PPI), and the size of pixel is about 30 ⁇ 50 ⁇ m.
  • PPI pixel per inch
  • 4K UHD and 8K UHD high definition it is higher than 860 PPI and ⁇ 1600 PPI.
  • the micro display applied directly to the VR device, or the micro display used in the VR device aims at an ultra-high quality of about 2,000 PPI or more, and the size of the pixel reaches about 5 to 10 ⁇ m.
  • the pattern width of the FMM and shadow mask applied to this may be formed in a size of several to several tens of micrometers, preferably smaller than 30 micrometers. to be.
  • an additional process for removing metal oxides, impurities, and the like may be performed to remove the defects in the cathode material of the material described above, and another defect such as etching of the anode material may be caused in this process. have.
  • the present invention can use a mother plate (or a negative electrode body) of a single crystal material.
  • a mother plate or a negative electrode body of a single crystal material.
  • it is preferable that it is a single crystal silicon material.
  • a high concentration doping of 10 19 / cm 3 or more may be performed on the single crystal silicon base plate. Doping may be performed on the entirety of the mother plate, or only on the surface portion of the mother plate.
  • the single crystal material is a metal such as Ti, Cu, Ag, carbon-based materials such as semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, graphite, graphene , CH 3 NH 3 PbCl 3, CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures And the like can be used.
  • Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, a high concentration doping of 10 19 / cm 3 or more may be performed to have conductivity. In the case of other materials, the conductivity may be formed by performing doping or forming oxygen vacancies. Doping may be performed on the entirety of the mother plate, or only on the surface portion of the mother plate.
  • a uniform plating film 110 may be generated due to the formation of a uniform electric field on the entire surface during electroplating.
  • the frame-integrated masks 100 and 200 manufactured through the uniform plating layer may further improve the image quality level of the OLED pixel.
  • process costs are reduced and productivity is improved.
  • the conductive substrate 21 is used as a mother plate (cathode body), and the anode body (not shown) is spaced apart on the conductive substrate 21.
  • the plating film 110 (or the mask metal film 110) can be formed in the electroplating.
  • the plating film 110 may be formed on the exposed top and side surfaces of the conductive substrate 21 facing the anode and capable of acting on an electric field.
  • the plating film 110 may be formed even on a part of the lower surface of the conductive substrate 21.
  • the edge portion of the plating film 110 may be cut (D) with a laser, or a photoresist layer may be formed on the plating film 110, and only a portion of the exposed plating film 110 may be etched and removed (D). Can be. Accordingly, as shown in FIG. 10B, the plating film 110 can be separated from the conductive substrate 21.
  • heat treatment may be performed before the plating film 110 is separated from the conductive substrate 21, heat treatment (H) may be performed.
  • the plating film (or substrate) may be formed from the conductive substrate 21 (or the mother plate and the cathode body). 110 is characterized in that the heat treatment (H) is performed before separation. Heat treatment may be carried out at a temperature of 300 °C to 800 °C.
  • the Invar thin plate produced by electroplating has a higher coefficient of thermal expansion as compared to the Invar thin plate produced by rolling.
  • the thermal expansion coefficient can be lowered by performing a heat treatment on the Invar thin plate.
  • peeling, deformation, or the like may occur on the Invar thin plate.
  • This is a phenomenon that occurs because only the Inba thin plate heat treatment or the Inba thin plate temporarily bonded only to the upper surface of the conductive substrate 21.
  • the plating film 110 is formed not only on the upper surface of the conductive substrate 21 but also on part of the side surface and the lower surface, no peeling or deformation occurs even when the heat treatment (H) is performed.
  • the heat treatment is performed in a state in which the conductive substrate 21 and the plating film 110 are closely adhered to each other, there is an advantage in that the heat treatment can be stably prevented from being peeled and deformed due to the heat treatment.
  • the thickness of the mask metal film 110 generated by the electroplating process may be thinner than the rolling process. Accordingly, although the planarization (PS) process of reducing the thickness may be omitted, the etching characteristics may vary depending on the composition of the surface layer of the plating mask metal film 110 ′ and the crystal structure / fine structure. It is necessary to control the surface characteristics and thickness through.
  • PS planarization
  • FIGS. 12 to 13 are schematic views illustrating a process of manufacturing a mask support template by adhering a mask metal film 110 on a template 50 and forming a mask 100 according to an embodiment of the present invention.
  • a template 50 may be provided.
  • the template 50 is a medium capable of moving in a state in which the mask 100 is attached and supported on one surface.
  • One surface of the template 50 is preferably flat so as to support and move the flat mask 100.
  • the central portion 50a may correspond to the mask cell C of the mask metal film 110, and the edge portion 50b may correspond to the dummy DM of the mask metal film 110.
  • the size of the template 50 may be a flat plate shape having a larger area than the mask metal film 110 so that the mask metal film 110 may be entirely supported.
  • the template 50 is preferably made of a transparent material so that the vision is easily observed in the process of aligning and bonding the mask 100 to the frame 200.
  • the laser may penetrate the transparent material.
  • a transparent material materials such as glass, silica, heat-resistant glass, quartz, alumina (Al 2 O 3 ), borosilicate glass, and zirconia may be used.
  • the template 50 may use a BOROFLOAT ® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, and the like in borosilicate glass.
  • BOROFLOAT ® 33 has a thermal expansion coefficient of about 3.3, which is advantageous in controlling the mask metal film 110 because the difference between the Invar mask metal film 110 and the thermal expansion coefficient is small.
  • the template 50 is one surface which is in contact with the mask metal film 110 so as not to generate an air gap between the interface with the mask metal film 110 (or the mask 100).
  • the surface roughness Ra of one surface of the template 50 may be 100 nm or less.
  • the template 50 may use a wafer. Since a wafer has a surface roughness Ra of about 10 nm, many products on the market, and many surface treatment processes are known, the wafer can be used as the template 50. Since the surface roughness Ra of the template 50 is nm scale, there is no or almost no air gap, and thus it is easy to generate welding beads WB by laser welding, thereby affecting the alignment error of the mask pattern P. Can not give.
  • the template 50 has a laser passing hole 51 in the template 50 so that the laser L irradiated from the upper portion of the template 50 can reach the welding part (region to be welded) of the mask 100. Can be formed.
  • the laser through hole 51 may be formed in the template 50 so as to correspond to the position and the number of welds. Since a plurality of welding parts are disposed along a predetermined interval at the edge or dummy DM portion of the mask 100, a plurality of laser passing holes 51 may also be formed along the predetermined interval to correspond thereto.
  • the laser penetrating holes 51 also have the template 50 on both sides (left / right).
  • a plurality may be formed along a predetermined interval.
  • the laser through hole 51 does not necessarily correspond to the position and the number of welds. For example, welding may be performed by irradiating the laser L only to a part of the laser passing holes 51. In addition, some of the laser passing holes 51 that do not correspond to the welding part may be used in place of the alignment mark when the mask 100 and the template 50 are aligned. If the material of the template 50 is transparent to the laser light, the laser through hole 51 may not be formed.
  • the temporary adhesive part 55 may be formed on one surface of the template 50.
  • the temporary adhesive part 55 may be formed on the entire surface of the template 50.
  • the mask 100 (mask metal film 110) may be adhered to the entire surface of the temporary bonding portion 55.
  • the mask 100 or the mask metal film 110 is temporarily adhered to one surface of the template 50 until the mask 100 is adhered to the frame 200, thereby forming the temporary adhesive on the template 50. To be supported.
  • the temporary adhesive part 55 may use an adhesive or an adhesive sheet that can be separated by applying heat, an adhesive or an adhesive sheet that can be separated by UV irradiation.
  • the temporary adhesive part 55 may use liquid wax.
  • the liquid wax can use the same thing as the wax used in the polishing step of a semiconductor wafer, etc.,
  • the type is not specifically limited.
  • Liquid waxes may mainly include solvents and materials such as acrylic, vinyl acetate, nylon and various polymers as resin components for controlling adhesion, impact resistance, and the like regarding holding force.
  • the temporary adhesive part 55 may use acrylonitrile butadiene rubber (ABR) as a resin component and SKYLIQUID ABR-4016 including n-propyl alcohol as a solvent component.
  • ABR acrylonitrile butadiene rubber
  • SKYLIQUID ABR-4016 including n-propyl alcohol
  • the temporary adhesive portion 55 which is a liquid wax, has a low viscosity at temperatures higher than 85 ° C to 100 ° C, and may become viscous at a temperature lower than 85 ° C and partially harden as a solid, thereby forming the mask metal film 110 'and the template 50. ) Can be fixed and bonded.
  • the mask metal film 110 ′ may be adhered to the template 50. After the liquid wax is heated to 85 ° C. or higher and the mask metal film 110 ′ is brought into contact with the template 50, the mask metal film 110 ′ and the template 50 may be passed between the rollers to perform adhesion. .
  • the template 50 may be baked at about 120 ° C. for 60 seconds to vaporize the solvent of the temporary adhesive part 55, and immediately proceed to a mask metal film lamination process.
  • Lamination is performed by loading the mask metal film 110 ′ on the template 50 having the temporary adhesive portion 55 formed on one surface thereof, and passing it between an upper roll of about 100 ° C. and a lower roll of about 0 ° C. Can be. As a result, the mask metal film 110 ′ may be contacted on the template 50 via the temporary adhesive part 55.
  • the temporary adhesive part 55 may use a thermal release tape.
  • a core film 56 such as a PET film is disposed in the center, and thermal release adhesives 57a and 57b are arranged on both surfaces of the core film 56, and the adhesive layer 57a is disposed.
  • the release film / release film 58a and 58b may be disposed outside the 57b.
  • the pressure-sensitive adhesive layers 57a and 57b disposed on both surfaces of the core film 56 may have different temperatures.
  • the bottom surface of the heat release tape (second adhesive layer 57b) is adhered to the template 50 and the top of the heat release tape
  • the surface [first adhesive layer 57a] may be adhered to the mask metal film 110 '. Since the temperature at which the first adhesive layer 57a and the second adhesive layer 57b are separated from each other is different, when the template 50 is separated from the mask 100 in FIG. 17 to be described later, the first adhesive layer 57a is used.
  • the mask 100 may be separated from the template 50 and the temporary adhesive part 55 by applying the heat-peeled heat.
  • one surface of the mask metal film 110 ′ may be planarized (PS).
  • the mask metal film 110 ′ manufactured by the rolling process may reduce the thickness 110 ′-> 110 by a planarization (PS) process.
  • the mask metal film 110 manufactured by the electroplating process may be performed with a planarization (PS) process to control surface characteristics and thickness.
  • the mask metal film 110 may have a thickness of about 5 ⁇ m to 20 ⁇ m. Can be.
  • a patterned insulating portion 25 may be formed on the mask metal film 110.
  • the insulating portion 25 may be formed of a photoresist material using a printing method or the like.
  • the mask metal layer 110 may be etched. Methods such as dry etching and wet etching may be used without limitation, and a portion of the mask metal film 110 exposed to the empty space 26 between the insulating portions 25 may be etched as a result of the etching. An etched portion of the mask metal layer 110 may form a mask pattern P, and a mask 100 having a plurality of mask patterns P may be manufactured.
  • the manufacturing of the template 50 supporting the mask 100 may be completed by removing the insulating portion 25.
  • the frame 200 includes a plurality of mask cell regions CR11 to CR56, the mask 100 having mask cells C11 to C56 corresponding to the respective mask cell regions CR11 to CR56.
  • the mask 100 having mask cells C11 to C56 corresponding to the respective mask cell regions CR11 to CR56.
  • a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.
  • 15 is a schematic diagram illustrating a process of loading a mask support template onto a frame according to an embodiment of the present invention.
  • the template 50 may be conveyed by the vacuum chuck 90.
  • the vacuum chuck 90 may absorb and transfer the opposite surface of the template 50 to which the mask 100 is adhered.
  • the vacuum chuck 90 may be connected to a moving means (not shown) which is moved along the x, y, z and ⁇ axes.
  • the vacuum chuck 90 may be connected to flip means (not shown) capable of attracting and flipping the template 50. As shown in FIG. 15B, the vacuum chuck 90 sucks and flips the template 50, and then transfers the template 50 onto the frame 200. There is no effect on the adhesion state and the alignment state.
  • FIG. 16 is a schematic diagram illustrating a state in which a template is loaded onto a frame and the mask corresponds to a cell area of the frame according to an embodiment of the present invention.
  • one mask 100 is corresponded / adhered to the cell region CR.
  • the mask 100 may be frame 200 by simultaneously matching the plurality of masks 100 to all the cell regions CR. ) May be adhered to.
  • a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.
  • the mask 100 may correspond to one mask cell region CR of the frame 200.
  • the mask 100 may correspond to the mask cell region CR.
  • a microscope may be used to determine whether the mask 100 corresponds to the mask cell region CR. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 may closely contact each other.
  • the lower supporter 70 may be further disposed below the frame 200.
  • the lower supporter 70 may have a size enough to fit into the hollow region R of the frame rim 210 and may have a flat plate shape.
  • a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet part 220 may be formed on the upper surface of the lower supporter 70. In this case, the edge sheet part 221 and the first and second grid sheet parts 223 and 225 are fitted into the support groove, so that the mask cell sheet part 220 may be more securely fixed.
  • the lower supporter 70 may compress the opposite surface of the mask cell region CR that the mask 100 contacts. That is, the lower supporter 70 may support the mask cell sheet part 220 in the upper direction to prevent the mask cell sheet part 220 from sagging in the lower direction during the bonding process of the mask 100. At the same time, since the lower support 70 and the template 50 are pressed against each other in a direction opposite to each other, the edge and the frame 200 (or the mask cell sheet part 220) of the mask 100 are compressed, so that the mask 100 is pressed. The alignment state of the can be maintained without being disturbed.
  • the mask 100 may be attached to the mask cell region CR of the frame 200 by simply attaching the mask 100 to the template 50 and loading the template 50 onto the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 in this process.
  • the mask 100 may be irradiated with the laser L to bond the mask 100 to the frame 200 by laser welding.
  • a weld bead WB is generated in the welded portion of the laser welded mask, and the weld bead WB may be integrally connected with the same material as that of the mask 100 / frame 200.
  • 17 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.
  • the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (ET), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive part 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 may be lifted. For example, when heat (ET) at a temperature higher than 85 ° C to 100 ° C is applied (ET), the viscosity of the temporary adhesive part 55 is lowered, and the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 ) And the template 50 may be separated.
  • E heat application
  • CM chemical treatment
  • US ultrasonic application
  • UV UV
  • the mask 100 and the template 50 may be separated by dissolving and removing the temporary adhesive part 55 by dipping (CM) the temporary adhesive part 55 in chemical substances such as IPA, acetone, and ethanol. have.
  • CM dipping
  • chemical substances such as IPA, acetone, and ethanol.
  • the temporary bonding part 55 which mediates the adhesion between the mask 100 and the template 50 is a TBDB adhesive material (temporary bonding & debonding adhesive), various debonding methods can be used.
  • CM chemical treatment
  • debonding may be performed.
  • the solvent since the pattern P is formed in the mask 100, the solvent may penetrate through the mask pattern P and the interface between the mask 100 and the template 50.
  • Solvent debonding has the advantage of being relatively economical as compared to other debonding methods because it can be debonded at room temperature and does not require a separate, complex debonding facility designed.
  • a heat debonding method according to heat application ET may be used. Debonding may proceed in the vertical direction or the left and right directions when the decomposition of the temporary adhesive part 55 is induced using high temperature heat and the adhesive force between the mask 100 and the template 50 is reduced.
  • a peelable adhesive debonding method according to heat application (ET), UV application (UV), or the like may be used.
  • debonding may be performed by a peeling adhesive debonding method. This method does not require high temperature heat treatment and expensive heat treatment equipment as the thermal debonding method and the process of progressing. Has a relatively simple advantage.
  • a room temperature debonding method according to chemical treatment (CM), ultrasonic application (US), UV application (UV), or the like may be used. If a non-sticky treatment is applied to a portion (center portion) of the mask 100 or the template 50, only the edge portion may be adhered by the temporary adhesive portion 55. In addition, during debonding, a solvent penetrates into the edge portion and debonding is performed by dissolution of the entrance-adhesion part 55.
  • This method is advantageous in that the remaining portions of the mask 100 and the template 50 except for the edges of the mask 100 and the template 50 are not directly lost during bonding and debonding, or defects caused by adhesive residue during debonding are not generated. There is this.
  • unlike the thermal debonding method since the high temperature heat treatment process is not required when debonding, there is an advantage in that the process cost can be relatively reduced.
  • FIG. 18 is a schematic diagram illustrating a state in which the mask 100 is adhered to the frame 200 according to an embodiment of the present invention.
  • one mask 100 may be adhered to one cell region CR of the frame 200.
  • the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is bonded to the mask cell sheet portion 220 while the tensile force is applied to the mask 100, the tensile force remaining in the mask 100 is masked.
  • the cell sheet 220 and the mask cell region CR may act on the cell sheet 220 and may be modified. Therefore, the mask 100 should be adhered to the mask cell sheet part 220 without applying a tensile force to the mask 100.
  • the present invention corresponds to the mask cell region CR of the frame 200 by simply attaching the mask 100 to the template 50 and loading the template 50 onto the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 in this process. Thus, it is possible to prevent the tensile force applied to the mask 100 from acting as a tension on the frame 200 to deform the frame 200 (or the mask cell sheet part 220).
  • the mask 10 of FIG. 1 includes six cells C1 to C6, the mask 10 has a long length, whereas the mask 100 of the present invention has a short length including one cell C.
  • the degree of distortion of the pixel position accuracy (PPA) can be reduced.
  • the mask 100 of the present invention May reduce the above error range by 1 / n according to the reduction of the relative length (corresponding to the reduction of the number of cells C).
  • the length of the mask 100 of the present invention is 100mm, it has a length reduced to 1/10 at 1m of the conventional mask 10, the PPA error of 1 ⁇ m occurs in the entire 100mm length As a result, the alignment error is significantly reduced.
  • the mask 100 is provided with a plurality of cells (C), each cell (C) corresponding to each cell region (CR) of the frame 200 within the range that the alignment error is minimized,
  • the mask 100 may correspond to the plurality of mask cell regions CR of the frame 200.
  • the mask 100 having the plurality of cells C may correspond to one mask cell region CR.
  • the mask 100 preferably has as few cells C as possible.
  • the production time can be significantly reduced.
  • each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and checks the alignment state.
  • the time can be much shorter than the conventional method of simultaneously matching six cells C1 to C6 and confirming the alignment of all six cells C1 to C6 at the same time.
  • the product yield in 30 processes of matching and aligning 30 masks 100 with 30 cell areas CR: CR11 to CR56 respectively is 6 cells (C1).
  • 5 masks 10 (see FIG. 2A), each comprising ⁇ C6), may appear much higher than the conventional product yield in 5 steps of matching and aligning the frame 20. Since the conventional method of aligning six cells C1 to C6 in a region corresponding to six cells C at a time is a much more cumbersome and difficult task, product yield is low.
  • step (b) of FIG. 12 when the mask metal film 110 is adhered to the template 50 by the lamination process, a temperature of about 100 ° C. may be applied to the mask metal film 110. . As a result, the mask metal layer 110 may be adhered to the template 50 in a state in which some tensile tension is applied. Thereafter, when the mask 100 is adhered to the frame 200 and the template 50 is separated from the mask 100, the mask 100 may contract a predetermined amount.
  • the template 50 and the masks 100 are separated, and a plurality of masks 100 are applied in tension in opposite directions. Therefore, the force is canceled so that deformation does not occur in the mask cell sheet portion 220.
  • the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region may move in the right direction of the mask 100 attached to the CR11 cell region.
  • the tension acting and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be offset. Therefore, the deformation of the frame 200 (or the mask cell sheet part 220) due to the tension is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized.
  • 19 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.
  • the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. And a deposition source supply unit (500) for supplying ().
  • a target substrate 900 such as glass on which the organic source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500.
  • the frame integrated masks 100 and 200 (or FMMs) for allowing the organic source 600 to be deposited pixel by pixel may be disposed on the target substrate 900 to be in close contact with or very close to each other.
  • the magnet 310 may generate a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.
  • the deposition source supply unit 500 may supply the organic source 600 while reciprocating the left and right paths, and the organic source 600 supplied from the deposition source supply unit 500 may have patterns P formed in the frame integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may serve as the pixel 700 of the OLED.
  • the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined S (or formed into a tapered shape S). . Since the organic sources 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited in overall thickness.
  • the mask 100 is adhesively fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if the mask 100 is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected.
  • the PPA between the 100 and the neighboring mask 100 may be maintained not to exceed 3 ⁇ m.

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Abstract

La présente invention concerne un gabarit de support de masque, son procédé de fabrication et un procédé de fabrication d'un masque à cadre intégré. Le procédé de fabrication d'un gabarit de support de masque selon la présente invention est un procédé de pour la fabrication d'un gabarit (50) qui assure le support d'un masque (100) pour la formation de pixels à diodes électroluminescentes organiques et qui fait correspondre le masque (100) avec un cadre (200), comprend les étapes suivantes: (a) la fourniture d'un film métallique pour masque (110); (b) la fixation du film métallique pour masque (110) sur le gabarit (50) présentant partie adhésive temporaire (55) formée sur sa surface; (c) la formation d'un motif de masque (P) sur le film métallique pour masque (110); et la fabrication du masque (100).
PCT/KR2019/009744 2018-08-09 2019-08-05 Gabarit de support de masque, son procédé de fabrication et procédé de fabrication de masque à cadre intégré WO2020032513A1 (fr)

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KR1020180122020A KR101988498B1 (ko) 2018-10-12 2018-10-12 마스크 지지 템플릿과 그의 제조 방법 및 프레임 일체형 마스크의 제조 방법

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005105328A (ja) * 2003-09-30 2005-04-21 Canon Inc マスク構造体の製造方法およびマスク構造体ならびに蒸着装置
KR20130043635A (ko) * 2010-07-09 2013-04-30 미쓰이 가가쿠 가부시키가이샤 펠리클 및 그것에 이용하는 마스크 접착제
KR20160071578A (ko) * 2014-12-11 2016-06-22 삼성디스플레이 주식회사 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
KR20180062487A (ko) * 2016-11-30 2018-06-11 엘지디스플레이 주식회사 증착용 마스크 및 그 제조방법
KR20180087537A (ko) * 2017-01-24 2018-08-02 삼성디스플레이 주식회사 전기 도금 마스크, 이를 이용하여 제작된 유기발광 표시장치 및 이의 제작방법
KR101988498B1 (ko) * 2018-10-12 2019-06-12 주식회사 티지오테크 마스크 지지 템플릿과 그의 제조 방법 및 프레임 일체형 마스크의 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100534580B1 (ko) * 2003-03-27 2005-12-07 삼성에스디아이 주식회사 표시장치용 증착 마스크 및 그의 제조방법
JP2005042133A (ja) * 2003-07-22 2005-02-17 Seiko Epson Corp 蒸着マスク及びその製造方法、表示装置及びその製造方法、表示装置を備えた電子機器
KR102282216B1 (ko) * 2015-02-24 2021-07-27 삼성디스플레이 주식회사 마스크 제조방법
US20190252614A1 (en) * 2016-11-03 2019-08-15 Tgo Tech. Corporation Mother plate, method for manufacturing mother plate, method for manufacturing mask, and oled pixel deposition method
KR101889165B1 (ko) * 2016-11-14 2018-09-21 주식회사 포스코 증착용 마스크 제조방법, 이에 의해 제조된 증착용 마스크 및 이를 이용한 유기 발광 소자 제조방법
KR20180087824A (ko) * 2017-01-25 2018-08-02 주식회사 티지오테크 프레임 일체형 마스크 및 그 제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005105328A (ja) * 2003-09-30 2005-04-21 Canon Inc マスク構造体の製造方法およびマスク構造体ならびに蒸着装置
KR20130043635A (ko) * 2010-07-09 2013-04-30 미쓰이 가가쿠 가부시키가이샤 펠리클 및 그것에 이용하는 마스크 접착제
KR20160071578A (ko) * 2014-12-11 2016-06-22 삼성디스플레이 주식회사 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
KR20180062487A (ko) * 2016-11-30 2018-06-11 엘지디스플레이 주식회사 증착용 마스크 및 그 제조방법
KR20180087537A (ko) * 2017-01-24 2018-08-02 삼성디스플레이 주식회사 전기 도금 마스크, 이를 이용하여 제작된 유기발광 표시장치 및 이의 제작방법
KR101988498B1 (ko) * 2018-10-12 2019-06-12 주식회사 티지오테크 마스크 지지 템플릿과 그의 제조 방법 및 프레임 일체형 마스크의 제조 방법

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