WO2020028999A1 - Resistance paste for chip resistor and preparation method therefor - Google Patents

Resistance paste for chip resistor and preparation method therefor Download PDF

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Publication number
WO2020028999A1
WO2020028999A1 PCT/CN2018/098916 CN2018098916W WO2020028999A1 WO 2020028999 A1 WO2020028999 A1 WO 2020028999A1 CN 2018098916 W CN2018098916 W CN 2018098916W WO 2020028999 A1 WO2020028999 A1 WO 2020028999A1
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parts
paste
slurry
conductive filler
binder
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PCT/CN2018/098916
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French (fr)
Chinese (zh)
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周天毫
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苏州速腾电子科技有限公司
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Priority to PCT/CN2018/098916 priority Critical patent/WO2020028999A1/en
Publication of WO2020028999A1 publication Critical patent/WO2020028999A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Definitions

  • the invention relates to a resistance paste for chip resistors and a preparation method thereof, and belongs to the technical field of electronic component processing.
  • Resistors are a commonly used electrical component with a wide range of applications, such as used in integrated circuits and chips.
  • Electronic paste is the basic material for manufacturing thick film components. It is a paste that is made of solid powder and organic solvent by three-roll rolling and mixed uniformly.
  • the resistance paste As a main component of the resistance paste, it is usually composed of a glass composition, a conductive material, and an organic vehicle.
  • the glass composition is included to adjust the resistance value and increase the adhesiveness of the slurry.
  • ruthenium oxide and lead ruthenium oxide can be generally used as conductive materials, and oxidation can be used Lead-based glass is used as the glass.
  • the present invention provides a resistance paste for chip resistors and a preparation method thereof.
  • a resistive paste for chip resistors includes the following raw materials in parts by weight: 50-60 parts of alloy conductive filler, 10-15 parts of ruthenium dioxide, 5-10 parts of manganese dioxide, 5-10 parts of calcium oxide, nanometer 10-15 parts of silica, 2-6 parts of dimethyl silicone oil, 10-15 parts of polyethylene glycol and 3-8 parts of binder.
  • the binder includes the following raw materials in parts by weight: 20-30 parts of epoxy resin, 15-20 parts of hydroxypropyl- ⁇ -cyclodextrin, and Tween 3-8 parts and 2-6 parts of trimethylhexamethylene diamine.
  • the binder is obtained by the following steps: after stirring and mixing the epoxy resin and Tween, hydroxypropyl- ⁇ - Cyclodextrin and trimethylhexamethylenediamine are mixed to obtain a binder.
  • the alloy conductive filler includes the following raw materials in parts by weight: 15-20 parts of nickel, 10-15 parts of yttrium, 15-20 parts of silver, 1-5 parts of palladium, and 20-30 parts of graphene.
  • the alloy conductive filler is obtained by the following steps: smelting nickel, yttrium, silver, and palladium in an electric furnace, and smelting the alloy into pellets, The shaped alloy is placed in a ball mill together with graphene, and a metal alloy conductive filler is obtained after ball milling.
  • the method for preparing a resistance paste for chip resistors includes the following steps:
  • the resistive slurry of the present invention has simple raw material ratio, does not contain lead, and is environmentally friendly.
  • the conductive conductivity of the alloy is used to meet the resistance conductive performance, and the slurry has good stability through ruthenium dioxide, manganese dioxide, calcium oxide, and nano silica.
  • dimethyl silicone oil and polyethylene glycol With dimethyl silicone oil and polyethylene glycol, the slurry has good dispersibility and adhesion. With the binder, the slurry is more stable and has good adhesion.
  • the alloy conductive filler of the invention has simple raw materials, good conductivity and can meet the requirements of chip resistors.
  • the raw materials of the binder of the present invention synergistically improve the adhesion and stability.
  • the preparation method of the invention is simple and suitable for industrial production. Through ball milling, each raw material is more finely ground, and at the same time, it is uniformly mixed. At 50-60 ° C, slurry A and slurry B are mixed, and the mixing is more uniform, and the raw materials are reacted. More quickly.
  • a resistive paste for chip resistors includes the following raw materials in parts by weight: 50 parts of alloy conductive filler, 15 parts of ruthenium dioxide, 5 parts of manganese dioxide, 5 parts of calcium oxide, 15 parts of nano-silica, and 2 methyl 2 parts silicone oil, 10 parts polyethylene glycol and 8 parts binder.
  • the binder includes the following raw materials in parts by weight: 20 parts of epoxy resin, 20 parts of hydroxypropyl- ⁇ -cyclodextrin, 3 parts of Tween, and 6 parts of trimethylhexamethylenediamine.
  • the adhesive is obtained by the following steps: after the epoxy resin and Tween are stirred and mixed, hydroxypropyl- ⁇ -cyclodextrin and trimethylhexamethylenediamine are sequentially added under the condition of stirring. After mixing, a binder is obtained.
  • the alloy conductive filler includes the following raw materials in parts by weight: 15 parts of nickel, 10 parts of yttrium, 20 parts of silver, 1 part of palladium, and 30 parts of graphene.
  • the alloy conductive filler is obtained by the following steps: smelting nickel, yttrium, silver, and palladium in an electric furnace, and smelting the alloy into particles, placing the granular alloy and graphene in a ball mill, and ball milling After that, a metal alloy conductive filler is obtained.
  • the method for preparing a resistance paste for chip resistors includes the following steps:
  • a resistive slurry for chip resistors includes the following raw materials in parts by weight: 60 parts of alloy conductive filler, 10 parts of ruthenium dioxide, 10 parts of manganese dioxide, 10 parts of calcium oxide, 10 parts of nano-silica, and 2 parts of 6 parts of base silicone oil, 15 parts of polyethylene glycol and 3 parts of binder.
  • the binder includes the following raw materials in parts by weight: 30 parts of epoxy resin, 15 parts of hydroxypropyl- ⁇ -cyclodextrin, 8 parts of Tween, and 2 parts of trimethylhexamethylenediamine.
  • the adhesive is obtained by the following steps: after the epoxy resin and Tween are stirred and mixed, hydroxypropyl- ⁇ -cyclodextrin and trimethylhexamethylenediamine are sequentially added under the condition of stirring. After mixing, a binder is obtained.
  • the alloy conductive filler includes the following raw materials in parts by weight: 20 parts of nickel, 15 parts of yttrium, 15 parts of silver, 5 parts of palladium, and 20 parts of graphene.
  • the alloy conductive filler is obtained by the following steps: smelting nickel, yttrium, silver, and palladium in an electric furnace, and smelting the alloy into particles, placing the granular alloy and graphene in a ball mill, and ball milling After that, a metal alloy conductive filler is obtained.
  • the method for preparing a resistance paste for chip resistors includes the following steps:
  • a resistive paste for chip resistors includes the following raw materials in parts by weight: 56 parts of alloy conductive filler, 12 parts of ruthenium dioxide, 8 parts of manganese dioxide, 8 parts of calcium oxide, 12 parts of nano-silica, and 2 parts 4 parts of base silicone oil, 12 parts of polyethylene glycol and 5 parts of binder.
  • the binder includes the following raw materials in parts by weight: 26 parts of epoxy resin, 18 parts of hydroxypropyl- ⁇ -cyclodextrin, 5 parts of Tween, and 3 parts of trimethylhexamethylenediamine.
  • the adhesive is obtained by the following steps: after the epoxy resin and Tween are stirred and mixed, hydroxypropyl- ⁇ -cyclodextrin and trimethylhexamethylenediamine are sequentially added under the condition of stirring. After mixing, a binder is obtained.
  • the alloy conductive filler includes the following raw materials in parts by weight: 18 parts of nickel, 12 parts of yttrium, 12 parts of silver, 4 parts of palladium, and 25 parts of graphene.
  • the alloy conductive filler is obtained by the following steps: smelting nickel, yttrium, silver, and palladium in an electric furnace, and smelting the alloy into pellets; placing the particulate alloy and graphene in a ball mill together; After that, a metal alloy conductive filler is obtained.
  • the method for preparing a resistance paste for chip resistors includes the following steps:
  • a resistive paste for chip resistors includes the following raw materials in parts by weight: 56 parts of alloy conductive filler, 12 parts of ruthenium dioxide, 8 parts of manganese dioxide, 8 parts of calcium oxide, 12 parts of nano-silica, and 2 parts 4 parts of base silicone oil and 12 parts of polyethylene glycol.
  • the square resistance is determined by GB / T 17473.3-2008.
  • the resistance value change rate is measured according to the national standard SJ20634-97 of the electronics industry.
  • the resistance slurry is overloaded for a short time, 2.5 times the rated working voltage is applied, and 5s is restored for 30 minutes to test the resistance value change rate.
  • the resistive paste was coated on a ceramic substrate, dried at 250-280 ° C, sintered at 800 ° C, and then the leads were soldered, and the adhesion was tested by a tensile machine.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)

Abstract

Disclosed are a resistance paste for a chip resistor and a preparation method therefor. The resistance paste for a chip resistor comprises the following raw materials in parts by weight: 50-60 parts of alloy conductive filler, 10-15 parts of ruthenium dioxide, 5-10 parts of manganese dioxide, 5-10 parts of calcium oxide, 10-15 parts of nano-silica, 2-6 parts of dimethyl silicone oil, 10-15 parts of polyethylene glycol, and 3-8 parts of binder. The resistive paste of the present invention has a simple raw material formulation, does not contain lead, is environmentally friendly, and meets the resistance conductive performance requirement by using the alloy conductive filler. The paste achieves good stability by using ruthenium dioxide, manganese dioxide, calcium oxide, and nano-silica, and achieves good dispersibility and adhesion by using dimethyl silicone oil and polyethylene glycol. The use of the binder enables the paste to be more stable and have good adhesion.

Description

一种片式电阻用电阻浆料及其制备方法Resistive paste for chip resistor and preparation method thereof 技术领域Technical field
本发明涉及一种片式电阻用电阻浆料及其制备方法，属于电子元件加工技术领域。The invention relates to a resistance paste for chip resistors and a preparation method thereof, and belongs to the technical field of electronic component processing.
背景技术Background technique
电阻是一种常用的电气元件，应用领域广泛，例如使用在集成电路、芯片中。电子浆料是制造厚膜元件的基础材料，是一种由固体粉末和有机溶剂经过三辊轧制混合均匀的膏状物。Resistors are a commonly used electrical component with a wide range of applications, such as used in integrated circuits and chips. Electronic paste is the basic material for manufacturing thick film components. It is a paste that is made of solid powder and organic solvent by three-roll rolling and mixed uniformly.
作为电阻浆料的主要成分，通常由玻璃组合物、导电材料、有机载体来构成，包含玻璃组合物是为了调节电阻值和增加浆料的粘接性。在基板上印刷电阻浆料之后，通过烧结，形成厚度约5-20um的厚膜电阻，并且，在此种电阻浆料中，通常可使用氧化钌和铅钌氧化物作为导电材料，可使用氧化铅类玻璃等作为玻璃。As a main component of the resistance paste, it is usually composed of a glass composition, a conductive material, and an organic vehicle. The glass composition is included to adjust the resistance value and increase the adhesiveness of the slurry. After printing the resistive paste on the substrate, sintering to form a thick film resistor with a thickness of about 5-20um, and in this kind of resistive paste, ruthenium oxide and lead ruthenium oxide can be generally used as conductive materials, and oxidation can be used Lead-based glass is used as the glass.
现有的电阻浆料常常很难兼顾电阻性能和机械性能。因此，研制新型电阻浆料成为研究热点。It is often difficult for existing resistance pastes to balance resistance performance and mechanical performance. Therefore, the development of new resistance pastes has become a research hotspot.
发明内容Summary of the invention
为了克服现有技术的不足，本发明提供了一种片式电阻用电阻浆料及其制备方法。In order to overcome the shortcomings of the prior art, the present invention provides a resistance paste for chip resistors and a preparation method thereof.
本发明是通过以下技术方案来实现的：The present invention is achieved through the following technical solutions:
一种片式电阻用电阻浆料，包括以下重量份数的原料：合金导电填料50-60份、二氧化钌10-15份、二氧化锰5-10份、氧化钙5-10份、纳米二氧化硅10-15份、二甲基硅油2-6份、聚乙二醇10-15份和粘结剂3-8份。A resistive paste for chip resistors includes the following raw materials in parts by weight: 50-60 parts of alloy conductive filler, 10-15 parts of ruthenium dioxide, 5-10 parts of manganese dioxide, 5-10 parts of calcium oxide, nanometer 10-15 parts of silica, 2-6 parts of dimethyl silicone oil, 10-15 parts of polyethylene glycol and 3-8 parts of binder.
所述的一种片式电阻用电阻浆料，所述粘结剂包括以下重量份数的原料：环氧树脂20-30份、羟丙基-β-环糊精15-20份、吐温3-8份和三甲基六亚甲基二胺2-6份。In the resistive paste for chip resistors, the binder includes the following raw materials in parts by weight: 20-30 parts of epoxy resin, 15-20 parts of hydroxypropyl-β-cyclodextrin, and Tween 3-8 parts and 2-6 parts of trimethylhexamethylene diamine.
所述的一种片式电阻用电阻浆料，所述粘结剂是通过以下步骤获得的：将 环氧树脂和吐温经过搅拌混合后，在搅拌的条件下依次加入羟丙基-β-环糊精和三甲基六亚甲基二胺，混合后得到粘结剂。In the resistive paste for chip resistors, the binder is obtained by the following steps: after stirring and mixing the epoxy resin and Tween, hydroxypropyl-β- Cyclodextrin and trimethylhexamethylenediamine are mixed to obtain a binder.
所述的一种片式电阻用电阻浆料，所述合金导电填料包括以下重量份数的原料：镍15-20份、钇10-15份、银15-20份、钯1-5份和石墨烯20-30份。In the resistive paste for chip resistors, the alloy conductive filler includes the following raw materials in parts by weight: 15-20 parts of nickel, 10-15 parts of yttrium, 15-20 parts of silver, 1-5 parts of palladium, and 20-30 parts of graphene.
所述的一种片式电阻用电阻浆料，所述合金导电填料是通过以下步骤获得的：将镍、钇、银和钯置于电炉中熔炼，熔炼后将合金制成颗粒状，将颗粒状的合金和石墨烯一起置于球磨机中，球磨后得到金属合金导电填料。In the resistive slurry for chip resistors, the alloy conductive filler is obtained by the following steps: smelting nickel, yttrium, silver, and palladium in an electric furnace, and smelting the alloy into pellets, The shaped alloy is placed in a ball mill together with graphene, and a metal alloy conductive filler is obtained after ball milling.
所述的一种片式电阻用电阻浆料的制备方法，包括以下几个步骤：The method for preparing a resistance paste for chip resistors includes the following steps:
(1)将二氧化钌、二氧化锰、氧化钙、纳米二氧化硅、二甲基硅油和一部分的聚乙二醇置于球磨机中，过滤后得到浆料A；(1) Put ruthenium dioxide, manganese dioxide, calcium oxide, nano silica, dimethyl silicone oil and a part of polyethylene glycol in a ball mill, and obtain slurry A after filtration;
(2)将合金导电填料和剩余的聚乙二醇一起置于球磨机中，过滤后得到浆料B；(2) placing the alloy conductive filler and the remaining polyethylene glycol in a ball mill, and filtering to obtain slurry B;
(3)在温度为50-60℃条件下，搅拌将浆料A、浆料B和粘结剂混合得到厚膜电阻浆料。(3) At a temperature of 50-60 ° C., the slurry A, slurry B and the binder are mixed to obtain a thick film resistance slurry.
本发明所达到的有益效果：Beneficial effects achieved by the present invention:
本发明的电阻浆料原料配比简单，不含铅，绿色环保，通过合金导电填料满足电阻导电性能，通过二氧化钌、二氧化锰、氧化钙和纳米二氧化硅，浆料稳定性好，通过二甲基硅油和聚乙二醇，浆料分散性和附着性好，通过粘结剂，浆料更加稳定，且粘结性好。The resistive slurry of the present invention has simple raw material ratio, does not contain lead, and is environmentally friendly. The conductive conductivity of the alloy is used to meet the resistance conductive performance, and the slurry has good stability through ruthenium dioxide, manganese dioxide, calcium oxide, and nano silica. With dimethyl silicone oil and polyethylene glycol, the slurry has good dispersibility and adhesion. With the binder, the slurry is more stable and has good adhesion.
本发明的合金导电填料原料简单，导电性能好，能够适应片式电阻的需求。The alloy conductive filler of the invention has simple raw materials, good conductivity and can meet the requirements of chip resistors.
本发明的粘结剂各原料协同作用，提高了粘结性和稳定性。The raw materials of the binder of the present invention synergistically improve the adhesion and stability.
本发明的制备方法简单，适合工业生产；通过球磨，各原料被研磨的更加细腻，同时混合均匀，在50-60℃，将浆料A和浆料B混合，混合更加均匀，且各原料反应更加迅速。The preparation method of the invention is simple and suitable for industrial production. Through ball milling, each raw material is more finely ground, and at the same time, it is uniformly mixed. At 50-60 ° C, slurry A and slurry B are mixed, and the mixing is more uniform, and the raw materials are reacted. More quickly.
具体实施方式detailed description
以下实施例仅用于更加清楚地说明本发明的技术方案，而不能以此来限制本发明的保护范围。The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.
实施例1Example 1
一种片式电阻用电阻浆料，包括以下重量份数的原料：合金导电填料50份、二氧化钌15份、二氧化锰5份、氧化钙5份、纳米二氧化硅15份、二甲基硅油2份、聚乙二醇10份和粘结剂8份。A resistive paste for chip resistors includes the following raw materials in parts by weight: 50 parts of alloy conductive filler, 15 parts of ruthenium dioxide, 5 parts of manganese dioxide, 5 parts of calcium oxide, 15 parts of nano-silica, and 2 methyl 2 parts silicone oil, 10 parts polyethylene glycol and 8 parts binder.
所述粘结剂包括以下重量份数的原料：环氧树脂20份、羟丙基-β-环糊精20份、吐温3份和三甲基六亚甲基二胺6份。所述粘结剂是通过以下步骤获得的：将环氧树脂和吐温经过搅拌混合后，在搅拌的条件下依次加入羟丙基-β-环糊精和三甲基六亚甲基二胺，混合后得到粘结剂。The binder includes the following raw materials in parts by weight: 20 parts of epoxy resin, 20 parts of hydroxypropyl-β-cyclodextrin, 3 parts of Tween, and 6 parts of trimethylhexamethylenediamine. The adhesive is obtained by the following steps: after the epoxy resin and Tween are stirred and mixed, hydroxypropyl-β-cyclodextrin and trimethylhexamethylenediamine are sequentially added under the condition of stirring. After mixing, a binder is obtained.
所述合金导电填料包括以下重量份数的原料：镍15份、钇10份、银20份、钯1份和石墨烯30份。所述合金导电填料是通过以下步骤获得的：将镍、钇、银和钯置于电炉中熔炼，熔炼后将合金制成颗粒状，将颗粒状的合金和石墨烯一起置于球磨机中，球磨后得到金属合金导电填料。The alloy conductive filler includes the following raw materials in parts by weight: 15 parts of nickel, 10 parts of yttrium, 20 parts of silver, 1 part of palladium, and 30 parts of graphene. The alloy conductive filler is obtained by the following steps: smelting nickel, yttrium, silver, and palladium in an electric furnace, and smelting the alloy into particles, placing the granular alloy and graphene in a ball mill, and ball milling After that, a metal alloy conductive filler is obtained.
所述的一种片式电阻用电阻浆料的制备方法，包括以下几个步骤：The method for preparing a resistance paste for chip resistors includes the following steps:
(1)将二氧化钌、二氧化锰、氧化钙、纳米二氧化硅、二甲基硅油和一部分的聚乙二醇置于球磨机中，过滤后得到浆料A；(1) Put ruthenium dioxide, manganese dioxide, calcium oxide, nano silica, dimethyl silicone oil and a part of polyethylene glycol in a ball mill, and obtain slurry A after filtration;
(2)将合金导电填料和剩余的聚乙二醇一起置于球磨机中，过滤后得到浆料B；(2) placing the alloy conductive filler and the remaining polyethylene glycol in a ball mill, and filtering to obtain slurry B;
(3)在温度为50-60℃条件下，搅拌将浆料A、浆料B和粘结剂混合得到厚膜电阻浆料。(3) At a temperature of 50-60 ° C., the slurry A, slurry B and the binder are mixed to obtain a thick film resistance slurry.
实施例2Example 2
一种片式电阻用电阻浆料，包括以下重量份数的原料：合金导电填料60份、二氧化钌10份、二氧化锰10份、氧化钙10份、纳米二氧化硅10份、二甲基硅油6份、聚乙二醇15份和粘结剂3份。A resistive slurry for chip resistors includes the following raw materials in parts by weight: 60 parts of alloy conductive filler, 10 parts of ruthenium dioxide, 10 parts of manganese dioxide, 10 parts of calcium oxide, 10 parts of nano-silica, and 2 parts of 6 parts of base silicone oil, 15 parts of polyethylene glycol and 3 parts of binder.
所述粘结剂包括以下重量份数的原料：环氧树脂30份、羟丙基-β-环糊精15份、吐温8份和三甲基六亚甲基二胺2份。所述粘结剂是通过以下步骤获得的：将环氧树脂和吐温经过搅拌混合后，在搅拌的条件下依次加入羟丙基-β-环糊精和三甲基六亚甲基二胺，混合后得到粘结剂。The binder includes the following raw materials in parts by weight: 30 parts of epoxy resin, 15 parts of hydroxypropyl-β-cyclodextrin, 8 parts of Tween, and 2 parts of trimethylhexamethylenediamine. The adhesive is obtained by the following steps: after the epoxy resin and Tween are stirred and mixed, hydroxypropyl-β-cyclodextrin and trimethylhexamethylenediamine are sequentially added under the condition of stirring. After mixing, a binder is obtained.
所述合金导电填料包括以下重量份数的原料：镍20份、钇15份、银15份、钯5份和石墨烯20份。所述合金导电填料是通过以下步骤获得的：将镍、钇、 银和钯置于电炉中熔炼，熔炼后将合金制成颗粒状，将颗粒状的合金和石墨烯一起置于球磨机中，球磨后得到金属合金导电填料。The alloy conductive filler includes the following raw materials in parts by weight: 20 parts of nickel, 15 parts of yttrium, 15 parts of silver, 5 parts of palladium, and 20 parts of graphene. The alloy conductive filler is obtained by the following steps: smelting nickel, yttrium, silver, and palladium in an electric furnace, and smelting the alloy into particles, placing the granular alloy and graphene in a ball mill, and ball milling After that, a metal alloy conductive filler is obtained.
所述的一种片式电阻用电阻浆料的制备方法，包括以下几个步骤：The method for preparing a resistance paste for chip resistors includes the following steps:
(1)将二氧化钌、二氧化锰、氧化钙、纳米二氧化硅、二甲基硅油和一部分的聚乙二醇置于球磨机中，过滤后得到浆料A；(1) Put ruthenium dioxide, manganese dioxide, calcium oxide, nano silica, dimethyl silicone oil and a part of polyethylene glycol in a ball mill, and obtain slurry A after filtration;
(2)将合金导电填料和剩余的聚乙二醇一起置于球磨机中，过滤后得到浆料B；(2) placing the alloy conductive filler and the remaining polyethylene glycol in a ball mill, and filtering to obtain slurry B;
(3)在温度为50-60℃条件下，搅拌将浆料A、浆料B和粘结剂混合得到厚膜电阻浆料。(3) At a temperature of 50-60 ° C., the slurry A, slurry B and the binder are mixed to obtain a thick film resistance slurry.
实施例3Example 3
一种片式电阻用电阻浆料，包括以下重量份数的原料：合金导电填料56份、二氧化钌12份、二氧化锰8份、氧化钙8份、纳米二氧化硅12份、二甲基硅油4份、聚乙二醇12份和粘结剂5份。A resistive paste for chip resistors includes the following raw materials in parts by weight: 56 parts of alloy conductive filler, 12 parts of ruthenium dioxide, 8 parts of manganese dioxide, 8 parts of calcium oxide, 12 parts of nano-silica, and 2 parts 4 parts of base silicone oil, 12 parts of polyethylene glycol and 5 parts of binder.
所述粘结剂包括以下重量份数的原料：环氧树脂26份、羟丙基-β-环糊精18份、吐温5份和三甲基六亚甲基二胺3份。所述粘结剂是通过以下步骤获得的：将环氧树脂和吐温经过搅拌混合后，在搅拌的条件下依次加入羟丙基-β-环糊精和三甲基六亚甲基二胺，混合后得到粘结剂。The binder includes the following raw materials in parts by weight: 26 parts of epoxy resin, 18 parts of hydroxypropyl-β-cyclodextrin, 5 parts of Tween, and 3 parts of trimethylhexamethylenediamine. The adhesive is obtained by the following steps: after the epoxy resin and Tween are stirred and mixed, hydroxypropyl-β-cyclodextrin and trimethylhexamethylenediamine are sequentially added under the condition of stirring. After mixing, a binder is obtained.
所述合金导电填料包括以下重量份数的原料：镍18份、钇12份、银12份、钯4份和石墨烯25份。所述合金导电填料是通过以下步骤获得的：将镍、钇、银和钯置于电炉中熔炼，熔炼后将合金制成颗粒状，将颗粒状的合金和石墨烯一起置于球磨机中，球磨后得到金属合金导电填料。The alloy conductive filler includes the following raw materials in parts by weight: 18 parts of nickel, 12 parts of yttrium, 12 parts of silver, 4 parts of palladium, and 25 parts of graphene. The alloy conductive filler is obtained by the following steps: smelting nickel, yttrium, silver, and palladium in an electric furnace, and smelting the alloy into pellets; placing the particulate alloy and graphene in a ball mill together; After that, a metal alloy conductive filler is obtained.
所述的一种片式电阻用电阻浆料的制备方法，包括以下几个步骤：The method for preparing a resistance paste for chip resistors includes the following steps:
(1)将二氧化钌、二氧化锰、氧化钙、纳米二氧化硅、二甲基硅油和一部分的聚乙二醇置于球磨机中，过滤后得到浆料A；(1) Put ruthenium dioxide, manganese dioxide, calcium oxide, nano silica, dimethyl silicone oil and a part of polyethylene glycol in a ball mill, and obtain slurry A after filtration;
(2)将合金导电填料和剩余的聚乙二醇一起置于球磨机中，过滤后得到浆料B；(2) placing the alloy conductive filler and the remaining polyethylene glycol in a ball mill, and filtering to obtain slurry B;
(3)在温度为50-60℃条件下，搅拌将浆料A、浆料B和粘结剂混合得到厚膜电阻浆料。(3) At a temperature of 50-60 ° C., the slurry A, slurry B and the binder are mixed to obtain a thick film resistance slurry.
对比例Comparative example
一种片式电阻用电阻浆料，包括以下重量份数的原料：合金导电填料56份、二氧化钌12份、二氧化锰8份、氧化钙8份、纳米二氧化硅12份、二甲基硅油4份和聚乙二醇12份。A resistive paste for chip resistors includes the following raw materials in parts by weight: 56 parts of alloy conductive filler, 12 parts of ruthenium dioxide, 8 parts of manganese dioxide, 8 parts of calcium oxide, 12 parts of nano-silica, and 2 parts 4 parts of base silicone oil and 12 parts of polyethylene glycol.
各实施例和对比例的电阻浆料性能见表1：The performances of the resistance pastes of the respective examples and comparative examples are shown in Table 1:
方阻的测定采用GB/T 17473.3-2008测定。The square resistance is determined by GB / T 17473.3-2008.
短暂过负荷，阻值变化率按照电子行业国家标准SJ20634-97进行测定，电阻浆料短时间过载，施加2.5倍额定工作电压，5s，恢复30min，测试阻值变化率。For short-term overload, the resistance value change rate is measured according to the national standard SJ20634-97 of the electronics industry. The resistance slurry is overloaded for a short time, 2.5 times the rated working voltage is applied, and 5s is restored for 30 minutes to test the resistance value change rate.
将电阻浆料涂布到陶瓷基片上，在250～280℃下烘干，800℃烧结，再锡焊引线，用拉力机测试附着力。The resistive paste was coated on a ceramic substrate, dried at 250-280 ° C, sintered at 800 ° C, and then the leads were soldered, and the adhesion was tested by a tensile machine.
表1Table 1
Figure PCTCN2018098916-appb-000001
Figure PCTCN2018098916-appb-000001
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和变形，这些改进和变形也应视为本发明的保护范围。The above is only a preferred embodiment of the present invention. It should be noted that, for those of ordinary skill in the art, without departing from the technical principles of the present invention, several improvements and deformations can be made. These improvements and deformations It should also be regarded as the protection scope of the present invention.

Claims (6)

  1. 一种片式电阻用电阻浆料，其特征是，包括以下重量份数的原料：合金导电填料50-60份、二氧化钌10-15份、二氧化锰5-10份、氧化钙5-10份、纳米二氧化硅10-15份、二甲基硅油2-6份、聚乙二醇10-15份和粘结剂3-8份。A resistive paste for chip resistors, characterized in that it includes the following raw materials in parts by weight: 50-60 parts of alloy conductive fillers, 10-15 parts of ruthenium dioxide, 5-10 parts of manganese dioxide, and calcium oxide 5- 10 parts, nano silica 10-15 parts, dimethyl silicone oil 2-6 parts, polyethylene glycol 10-15 parts, and binder 3-8 parts.
  2. 根据权利要求1所述的一种片式电阻用电阻浆料，其特征是，所述粘结剂包括以下重量份数的原料：环氧树脂20-30份、羟丙基-β-环糊精15-20份、吐温3-8份和三甲基六亚甲基二胺2-6份。The resistive paste for chip resistors according to claim 1, wherein the binder comprises the following raw materials in parts by weight: 20-30 parts of epoxy resin, hydroxypropyl-β-cyclopaste 15-20 parts of refined, 3-8 parts of Tween and 2-6 parts of trimethylhexamethylene diamine.
  3. 根据权利要求2所述的一种片式电阻用电阻浆料，其特征是，所述粘结剂是通过以下步骤获得的：将环氧树脂和吐温经过搅拌混合后，在搅拌的条件下依次加入羟丙基-β-环糊精和三甲基六亚甲基二胺，混合后得到粘结剂。The resistive paste for chip resistors according to claim 2, wherein the adhesive is obtained by the following steps: after the epoxy resin and Tween are stirred and mixed, under the condition of stirring Hydroxypropyl-β-cyclodextrin and trimethylhexamethylenediamine were added in order, and a binder was obtained after mixing.
  4. 根据权利要求1所述的一种片式电阻用电阻浆料，其特征是，所述合金导电填料包括以下重量份数的原料：镍15-20份、钇10-15份、银15-20份、钯1-5份和石墨烯20-30份。The resistive paste for chip resistors according to claim 1, wherein the alloy conductive filler comprises the following raw materials in parts by weight: 15-20 parts of nickel, 10-15 parts of yttrium, and 15-20 parts of silver Parts, 1-5 parts palladium and 20-30 parts graphene.
  5. 根据权利要求4所述的一种片式电阻用电阻浆料，其特征是，所述合金导电填料是通过以下步骤获得的：将镍、钇、银和钯置于电炉中熔炼，熔炼后将合金制成颗粒状，将颗粒状的合金和石墨烯一起置于球磨机中，球磨后得到金属合金导电填料。The resistive paste for chip resistors according to claim 4, wherein the alloy conductive filler is obtained by the following steps: nickel, yttrium, silver, and palladium are smelted in an electric furnace, and after smelting, The alloy is made into a granular shape, and the granular alloy and graphene are placed together in a ball mill, and a metal alloy conductive filler is obtained after ball milling.
  6. 根据以上任一权利要求所述的一种片式电阻用电阻浆料的制备方法，其特征是，包括以下几个步骤：The method for preparing a resistor paste for chip resistors according to any one of the preceding claims, comprising the following steps:
    (1)将二氧化钌、二氧化锰、氧化钙、纳米二氧化硅、二甲基硅油和一部分的聚乙二醇置于球磨机中，过滤后得到浆料A；(1) Put ruthenium dioxide, manganese dioxide, calcium oxide, nano silica, dimethyl silicone oil and a part of polyethylene glycol in a ball mill, and obtain slurry A after filtration;
    (2)将合金导电填料和剩余的聚乙二醇一起置于球磨机中，过滤后得到浆料B；(2) placing the alloy conductive filler and the remaining polyethylene glycol in a ball mill, and filtering to obtain slurry B;
    (3)在温度为50-60℃条件下，搅拌将浆料A、浆料B和粘结剂混合得到厚膜电阻浆料。(3) At a temperature of 50-60 ° C., the slurry A, slurry B and the binder are mixed to obtain a thick film resistance slurry.
PCT/CN2018/098916 2018-08-06 2018-08-06 Resistance paste for chip resistor and preparation method therefor WO2020028999A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406646B1 (en) * 1999-12-17 2002-06-18 Daejoo Fine Chemical Co., Ltd. Resistive paste for the formation of electrically heat-generating thick film
JP2010129896A (en) * 2008-11-28 2010-06-10 Mitsuboshi Belting Ltd Resistor paste, resistor film and resistor
CN103928078A (en) * 2014-04-30 2014-07-16 刘金宁 Copper alloy electroconduction slurry and preparation method thereof
CN104992801A (en) * 2015-06-30 2015-10-21 苏州洋杰电子有限公司 Resistance paste and preparation method thereof
CN107946009A (en) * 2017-11-18 2018-04-20 四川启兴电子有限公司 A kind of resistance slurry and preparation method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6406646B1 (en) * 1999-12-17 2002-06-18 Daejoo Fine Chemical Co., Ltd. Resistive paste for the formation of electrically heat-generating thick film
JP2010129896A (en) * 2008-11-28 2010-06-10 Mitsuboshi Belting Ltd Resistor paste, resistor film and resistor
CN103928078A (en) * 2014-04-30 2014-07-16 刘金宁 Copper alloy electroconduction slurry and preparation method thereof
CN104992801A (en) * 2015-06-30 2015-10-21 苏州洋杰电子有限公司 Resistance paste and preparation method thereof
CN107946009A (en) * 2017-11-18 2018-04-20 四川启兴电子有限公司 A kind of resistance slurry and preparation method

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