WO2020018153A1 - Adapter for image projection system installation in photolithography system - Google Patents

Adapter for image projection system installation in photolithography system Download PDF

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Publication number
WO2020018153A1
WO2020018153A1 PCT/US2019/024091 US2019024091W WO2020018153A1 WO 2020018153 A1 WO2020018153 A1 WO 2020018153A1 US 2019024091 W US2019024091 W US 2019024091W WO 2020018153 A1 WO2020018153 A1 WO 2020018153A1
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WO
WIPO (PCT)
Prior art keywords
gantry
brackets
adapter
plate
image projection
Prior art date
Application number
PCT/US2019/024091
Other languages
French (fr)
Inventor
Kavin Kumar CHINNASAMY
Stephanie SU
Tsu-hiu YANG
Vasuman Ghanapaati SRIRANGARAJAN
Original Assignee
Applied Materials, Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc filed Critical Applied Materials, Inc
Publication of WO2020018153A1 publication Critical patent/WO2020018153A1/en

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70275Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems

Definitions

  • Embodiments described herein generally relate to apparatuses and systems for processing one or more substrates, and more specifically to apparatuses and systems for performing photolithography processes.
  • Photolithography is widely used in the manufacturing of semiconductor devices and display devices, such as liquid crystal displays (LCDs).
  • LCDs liquid crystal displays
  • Large area substrates are often utilized in the manufacture of LCDs.
  • smaller substrates which are typically circular or at least partially circular, are used for manufacturing semiconductor devices or, in some cases, much smaller devices than typical LCDs.
  • These devices be it display devices or semiconductor devices, typically have small features that are precisely formed over the substrates.
  • Microlithography techniques have been employed to create features for forming features on substrates.
  • a light-sensitive photoresist is applied to at least one surface of the substrate.
  • a pattern generator exposes selected areas of the light-sensitive photoresist as part of a pattern with light to cause chemical changes to the photoresist in the selective areas to prepare these selective areas for subsequent material removal and/or material addition processes to create the electrical features.
  • new apparatuses and approaches are needed to precisely and cost-effectively create patterns on substrates.
  • Embodiments described herein generally provide an adapter that can permit installation of multiple image projection systems in a photolithography system.
  • the adapter can permit movement of the image projection systems for initialization and calibration, as well as accommodate a small size of a gantry of the photolithography system that may otherwise prohibit installation of multiple image projection systems therein.
  • an apparatus comprises a plate, first brackets, and sockets.
  • the first brackets extend perpendicularly from the plate in directions parallel to a first direction. Respective lateral spacings are between neighboring pairs of the first brackets.
  • the sockets are mechanically coupled to the plate and extend in directions parallel to a second direction opposite from the directions parallel to the first direction. Each of the sockets is vertically aligned with a corresponding one of the lateral spacings.
  • Each of the sockets has a depression configured to be engaged with a ball.
  • a system comprises a substrate stage, a gantry, an adapter, and image projection systems.
  • the substrate stage is moveable under the gantry.
  • the adapter is attached to the gantry.
  • the adapter comprises a plate attached to a side surface of the gantry, first brackets extending from the plate and being disposed on an upper surface of the gantry, and sockets mechanically coupled to the plate.
  • the image projection systems are operable to expose a substrate on the substrate stage to radiation.
  • Each of the image projection systems comprises an articulation system attached to the upper surface of the gantry, and a ball engaging a respective one of the sockets.
  • Another embodiment is a method.
  • An adapter is placed on a gantry of a photolithography system.
  • the photolithography system comprises a substrate stage moveable under the gantry.
  • a first lateral articulation system of a first image projection system is secured to the gantry.
  • a first ball of the first image projection system engages a first socket of the adapter.
  • the adapter is secured to the gantry.
  • a second lateral articulation system of a second image projection system is secured to the gantry.
  • a second ball of the second image projection system engages a second socket of the adapter.
  • Figure 1 is a perspective view of a photolithography system according to embodiments disclosed herein.
  • Figures 2 and 3 are perspective views of an adapter according to embodiments disclosed herein.
  • Figure 4 is a cross sectional view of the adapter on a gantry according to embodiments disclosed herein.
  • Figure 5 is a cross sectional view of an image projection system disposed on the adapter according to embodiments disclosed herein.
  • Figure 6 is a front view of the adapter mounted on the gantry, with a plurality of image projection systems mounted on the adapter, according to embodiments disclosed herein.
  • Figure 7 illustrates a method of installing the adapter on the gantry and with the image projection systems according to embodiments disclosed herein.
  • Embodiments described herein generally provide an adapter that can permit installation of multiple image projection systems in a photolithography system.
  • the adapter can be secured to a gantry with multiple image projection systems installed thereon.
  • the adapter includes multiple sockets, where each socket is configured to be engaged with a ball of a respective image projection system.
  • Each image projection system includes a lateral articulation system that can be secured to the gantry.
  • the lateral articulation system in conjunction with the ball engaging a socket of the adapter can permit the respective image projection system to articulate around the ball to enable initialization and calibration of the image projection system for subsequent processing (e.g., exposure of a photoresist on a substrate).
  • the adapter can accommodate a small size of a gantry of the photolithography system that may otherwise prohibit installation of multiple image projection systems therein.
  • FIG. 1 is a perspective view of a photolithography system 100 according to embodiments disclosed herein.
  • the photolithography system 100 includes a slab 102 and a processing apparatus 104.
  • the slab 102 is a monolithic piece of granite or multiple pieces of granite.
  • a stage 106 with tracks 108 is disposed on the slab 102.
  • One or more substrates, generically shown and referred to as substrate 1 10, are supported by the stage 106.
  • a plurality of holes are in the stage 106 for allowing a plurality of lift pins (not shown) to extend therethrough.
  • the lift pins rise to an extended position to receive the substrate 1 10, such as from one or more transfer robots (not shown), and the lift pins may thereafter gently lower the substrate 1 10 onto the stage 106.
  • the one or more transfer robots are used to load and unload a substrate 1 10 from the stage 106.
  • the substrate 1 10 may comprise any suitable material, for example, quartz, glass, or semiconductor material, which may be used as part of a flat panel display or semiconductor device. In other embodiments, the substrate 1 10 is made of other materials. In some embodiments, the substrate 1 10 has a photoresist layer formed thereon. A photoresist is sensitive to radiation. For a positive photoresist, portions of the positive photoresist exposed to radiation will be soluble to a photoresist developer applied to the photoresist after the exposure. For a negative photoresist, portions of the negative photoresist exposed to radiation will be insoluble to a photoresist developer applied to the photoresist after the exposure.
  • the chemical composition of the photoresist determines whether the photoresist will be a positive photoresist or negative photoresist.
  • photoresists include, but are not limited to, at least one of diazonaphthoquinone, a phenol formaldehyde resin, poly(methyl methacrylate), poly(methyl glutarimide), and SU-8. Processing using a patterned and developed photoresist can form at least part of the electronic circuitry on the substrate 1 10.
  • the tracks 108 are disposed on the slab 102 and support the stage 106.
  • the stage 106 moves along the tracks 108 in a direction 1 12.
  • the tracks 108 are a pair of parallel magnetic channels.
  • each track 108 is linear.
  • one or more tracks 108 can be non-linear.
  • An encoder 1 14 is coupled to the stage 106 in order to provide information regarding the location of the stage 106 to a controller 1 16.
  • the controller 1 16 is generally designed to facilitate the control and automation of processing techniques.
  • the controller 1 16 may be coupled to or in communication with the processing apparatus 104, the stage 106, and the encoder 1 14.
  • the processing apparatus 104 and the encoder 1 14 may provide information to the controller 1 16 regarding the substrate processing and the substrate aligning. For example, the processing apparatus 104 may provide information to the controller 1 16 to alert the controller 1 16 that substrate processing has been completed.
  • the processing apparatus 104 includes a gantry 120 and a processing unit 122.
  • the gantry 120 is disposed on and is supported by the slab 102.
  • the gantry 120 can include one or more pieces of granite.
  • the processing unit 122 is supported by the gantry 120.
  • An opening 124 is formed between the gantry 120 and the slab 102 for the stage 106 to pass under the processing unit 122 (e.g., by movement along direction 1 12).
  • the processing unit 122 is generally a pattern generator configured to expose a photoresist in a photolithography process.
  • the pattern generator is configured to perform a maskless lithography process.
  • the processing unit 122 includes a plurality of image projection systems 126.
  • the image projection systems 126 can be disposed on the gantry 120 and one or more adapters 128, which will be detailed further herein. In the illustration of Figure 1 , six image projection systems 126 are supported by the gantry 120, although in other examples, any number of image projection systems 126 may be implemented in the processing unit 122.
  • the processing apparatus 104 may be used to perform maskless direct patterning to photoresist or other electromagnetic radiation sensitive material.
  • the stage 106 moves in the direction 1 12 from a loading position (shown in Figure 1 ) to a processing position.
  • the processing position is one or more positions of the stage 106 as the stage 106 passes under the processing unit 122 and through the opening 124.
  • the stage 106 can also move in a direction perpendicular to the direction 1 12 by moving along another track for processing and/or indexing the substrate 1 10.
  • the stage 106 is capable of independent operation and can scan a substrate 1 10 in one direction and step in the other direction.
  • the following figures and description provide an example adapter 128 that can be implemented to install three image projection systems 126 on the gantry 120.
  • an adapter may be implemented to install any number of image projection systems 126 on the gantry 120.
  • a person having ordinary skill in the art will readily understand modifications to the example adapter 128 detailed below and in the figures to implement an adapter for other numbers of image projection systems 126 (e.g., by replicating parts in the pattern apparent to a person having ordinary skill in the art).
  • Figures 2 and 3 illustrate perspective views of the adapter 128 according to embodiments disclosed herein.
  • the perspective view of Figure 3 is partially exploded to illustrate aspects therein.
  • Figures 2 and 3 (and following figures) include X, Y, and Z axes as references between the figures.
  • the adapter 128 can be formed of a rigid material, such as a metal like stainless steel (e.g., ATSM A240 Type 440C).
  • the adapter 128 can be a single, integral component, or can include multiple mechanically attached, but separable, components. Additionally, reference to any bolt or screw in the following description may be understood to additionally reference any fastener, such as a bolt, screw, rivet, or the like.
  • the adapter 128 includes a plate 202.
  • Upper brackets 204 extend perpendicularly from the plate 202 (e.g., in a -X direction) at respective upper locations of the plate 202.
  • the upper brackets 204 are integral to the plate 202, although the upper brackets 204 may be separable from the plate 202 in other examples.
  • a spacing is between neighboring pairs of the upper brackets 204 (e.g., in a +/-Y direction) where an image projection system 126 will be disposed, as described subsequently.
  • Lower extensions 206 extend from and below the plate 202 in a substantially same plane as the plate 202.
  • the lower extensions 206 are integral to the plate 202, although the lower extensions 206 may be separable from the plate 202 in other examples.
  • Each of the lower extensions 206 generally vertically aligns with a corresponding spacing between a neighboring pair of the upper brackets 204.
  • individual lower extensions 206 are shown.
  • the lower extensions 206 may be omitted, and the plate 202 may extend further vertically in the place of the lower extensions 206. Other modifications may be implemented.
  • Sockets 208 are attached to the lower extensions 206. Each of the sockets 208 is generally vertically aligned with a corresponding spacing between a neighboring pair of the upper brackets 204.
  • the sockets 208 extend from the lower extensions 206 in an opposite direction of the extending of the upper brackets 204 from the plate 202. For example, the sockets 208 extend in a +X direction from the lower extensions 206, while the upper brackets 204 extend in a -X direction from the plate 202.
  • Each of the sockets 208 has a depression 210 in an upper portion of the respective socket 208 into which a ball of an image projection system 126 will be disposed, as described subsequently.
  • the depression 210 can be a partial-spherical surface that generally corresponds to the surface of the ball of the image projection system 126 that will engage the depression 210.
  • one or more bolts 212 can be inserted into holes through a respective lower extension 206 and screwed into a threaded hole in the socket 208 to attach the socket 208 to the lower extension 206.
  • the socket 208 can further include pins 214 that can be inserted into holes through the respective lower extension 206 to align holes for attaching the socket 208 with the bolts 212.
  • the sockets 208 are separable, although the sockets 208 may be integral to the lower extensions 206 in other examples. Further, a person having ordinary skill in the art will readily understand modifications to the illustrated example if lower extensions 206 are omitted.
  • Lower brackets 220 are attached to the lower extensions 206 and extend from the lower extensions 206 in a same direction that the upper brackets 204 extend from the plate 202 (e.g., in a -X direction).
  • Each of the lower brackets 220 includes a parallel member 222 (e.g., parallel to the upper brackets 204) and a supporting member 224.
  • a bolt 226 (or multiple bolts), with or without additional washers 230 and/or lock washers 228, can be inserted into a hole(s) through the parallel member 222 and screwed into a threaded hole in the supporting member 224 to attach the parallel member 222 to the supporting member 224.
  • the supporting member 224 can further include pins 232 that can be inserted into holes through the parallel member 222 to align holes for attaching the parallel member 222 with the bolt 226.
  • a bolt 236 (or multiple bolts), with or without additional washers 240 and/or lock washers 238, can be inserted into a hole(s) through the corresponding lower extension 206 and screwed into a threaded hole in the supporting member 224 to attach the supporting member 224 to the lower extension 206.
  • the supporting member 224 can further include pins 242 that can be inserted into holes through the lower extension 206 to align holes for attaching the supporting member 224 with the bolt 236.
  • the lower brackets 220 in the illustrated example have various separable parts and are separable from the lower extensions 206, the lower brackets 220 may be a single, integral component or may include more parts, and one or more components of the lower brackets 220 can be integral to the respective lower extension 206.
  • Ribs 250 are on a side of the plate 202 from which the upper brackets 204 extend, for example.
  • the adapter 128 is to be mounted on and attached to a gantry 120.
  • the ribs 250 are to contact the gantry 120 and can reduce the surface area where the adapter 128 contacts the gantry 120.
  • a rib 250 is along an upper portion of the plate 202 running laterally (e.g., in a +/-Y direction) across the plate 202, and a rib 250 is along a lower portion of the plate 202 running laterally across the plate 202.
  • Holes 252 are through the plate 202 and ribs 250 for inserting bolts therethrough to attach the adapter 128 to the gantry 120.
  • a pair of holes 252 is generally vertically aligned to each other and to a corresponding upper bracket 204.
  • FIG. 4 illustrates a cross sectional view of the adapter 128 on the gantry 120 according to embodiments disclosed herein.
  • the adapter 128 is attached to the gantry 120 with the ribs 250 contacting a side surface of the gantry 120 and the upper brackets 204 contacting an upper surface of the gantry 120.
  • the gantry 120 can be disposed between the upper brackets 204 and the lower brackets 220.
  • the upper brackets 204 can be load bearing.
  • a spacing is between a lower surface of the gantry 120 and the parallel member 222 of the lower bracket 220.
  • one or more shims 402 may be inserted between the parallel member 222 and the lower surface of the gantry 120 to further secure the adapter 128 to the gantry 120 and/or to reduce vibrations of the adapter 128 during subsequent processing.
  • Bolts (not illustrated) are inserted through the holes 252 (not shown in Figure 4) and are screwed into respective threaded holes in the side surface of the gantry 120.
  • Figure 5 illustrates a cross sectional view of an image projection system 126 disposed on the adapter 128 according to embodiments disclosed herein.
  • the image projection system 126 includes various light modulators and other optical components (such as a lens 502), as a person having ordinary skill in the art will readily understand.
  • the light modulators and/or other optical components in the image projection system 126 are configured to emit radiation through an emission port 504 to a substrate 1 10.
  • the image projection system 126 includes a ball 506 that engages the depression 210 of the socket 208.
  • the ball 506 can be a stainless steel ball.
  • the ball 506 being engaged with the depression 210 permits the image projection system 126 to be articulated around the ball 506 (e.g., tilted in +/-X and/or +/-Y directions).
  • the image projection system 126 includes a lateral articulation system 508 and a vertical lift system 510.
  • the lateral articulation system 508 is attached to the remainder of the image projection system 126 by a joint 512.
  • the lateral articulation system 508 can include any number of actuators, such as a screw actuator or the like, that can laterally move the joint 512 (e.g., in +/-X and/or +/-Y directions).
  • the joint 512 can be any hinged apparatus or the like. By laterally moving the joint 512, the image projection system 126 can articulate around the ball 506 to thereby rotate the direction of the radiation that is to be emitted from the emission port 504.
  • the vertical lift system 510 similarly can include any number of actuators, such as a screw actuator or the like, that can vertically move light modulators and other optical components (e.g., in a +/-Z direction). By moving the optical components vertically, pattern feature sizes to be formed in a photoresist on a substrate and/or a focus can be adjusted.
  • the articulation of the image projection system 126 around the ball 506 and/or the vertical movement of components of the image projection system 126 can enable initialization and calibration of the image projection system 126, once installed on the gantry as described in further detail below, for subsequent processing of a substrate (e.g., exposure of the substrate to radiation from the image projection system 126).
  • the lateral articulation system 508 can further include an adapter plate 514 that is to be attached to the gantry 120.
  • the adapter plate 514 can further include pins 516 that can be inserted into holes in the gantry 120 to align other holes in the adapter plate 514 and the gantry 120. Bolts can be inserted through the holes through the adapter plate 514 and screwed into a threaded hole in the gantry 120 to attach the adapter plate 514 to the gantry 120.
  • Figure 6 illustrates a front view of the adapter 128 mounted on the gantry 120, with a plurality of image projection systems 126 mounted on the adapter 128, according to embodiments disclosed herein.
  • Figure 7 illustrates a method 700 of installing the adapter 128 on the gantry 120 and with the image projection systems 126 according to embodiments disclosed herein.
  • Figure 6 will be described in the context of the method 700 of Figure 7. Although the method 700 is described in a particular order, other example methods can be performed in other orders, including serial or parallel performance of various operations, with additional operations and/or without various operations described herein.
  • the adapter 128 is placed on the gantry 120.
  • the adapter 128 can be placed on the gantry 120 without securing the adapter 128 to the gantry 120, such as without attaching the adapter 128 to the gantry 120 with bolts.
  • the adapter 128 can be generally placed on the gantry 120 in a location where the adapter 128 will subsequently be secured to the gantry 120.
  • the upper brackets 204 can be placed on the upper surface of the gantry 120, and the ribs 250 can contact the side surface of the gantry 120, as illustrated in and described with respect to Figure 4.
  • a lateral articulation system 508a of a first image projection system 126a is placed on the gantry 120.
  • any image projection system 126 that is to be installed on the adapter 128 can be selected as the first image projection system 126 to install.
  • an image projection system 126 to be installed in a lateral-most position (e.g., the furthest position in the +Y direction or in the -Y direction) on the adapter 128 is selected as the first image projection system 126.
  • the first image projection system 126a (shown in phantom in Figure 6 for clarity) is selected to be installed first.
  • the lateral articulation system 508a of the first image projection system 126a is placed on the upper surface of the gantry 120.
  • Pins 516 in the lateral articulation system 508a can be used to insert into holes in the upper surface of the gantry 120 for proper placement of the lateral articulation system 508a.
  • the lateral articulation system 508a of the first image projection system 126a is aligned with the adapter 128.
  • a first datum 602a can be inserted between a side surface of the lateral articulation system 508a and a nearest upper bracket 204.
  • the first datum 602a can be abutted to the side surface of the lateral articulation system 508a and abutted to the upper bracket 204.
  • the first image projection system 126a is secured to the gantry 120 and installed on the adapter 128.
  • Bolts can be used to secure the lateral articulation system 508a (e.g., the adapter plate 514) to the upper surface of the gantry 120.
  • a ball 506a of the first image projection system 126a is further inserted into the depression 210 of the corresponding socket 208 to engage the socket 208.
  • the first image projection system 126a is secured and installed.
  • the adapter 128 is secured to the gantry 120. With the adapter 128 aligned with the lateral articulation system 508a using the first datum 602a, the adapter 128 is secured to the gantry 120 using bolts through the holes 252 through the plate 202 of the adapter 128. Hence, the adapter 128 can be secured to the side surface of the gantry 120.
  • a lateral articulation system 508b of an additional image projection system 126b is placed on the gantry 120, similar to operation 704 described above. Pins 516 may be omitted in placing the lateral articulation system 508b for the additional image projection system 126b.
  • the lateral articulation system 508b of the additional image projection system 126b is aligned with the adapter 128, such as with an additional datum 602b, similar to operation 706.
  • the additional image projection system 126b (including a ball 506b) is secured to the gantry 120 and installed on the adapter 128, similar to operation 708.
  • Any further image projection system 126 can be secured to the gantry 120 and installed on the adapter 128 by repeating operations 712, 714, and 716.
  • another image projection system 126c (including a lateral articulation system 508c and ball 506c) can be placed, aligned (e.g., using a third datum 602c), and secured on the gantry 120 and installed on the adapter 128.
  • the datums 602a, 602b, and 602c can be removed after installation of the image projection systems 126.
  • a shim 402 is inserted between a lower bracket 220 of the adapter 128 and the lower surface of the gantry 120.
  • One or more shims 402 can be inserted between each lower bracket 220 of the adapter 128 and the lower surface of the gantry 120, such as illustrated in Figure 4.
  • the shim(s) 402 can reduce vibrations during subsequent processing.
  • the adapter permits the installation of multiple image projection systems on a gantry. For example, a reduction in size by the gantry may not permit sufficient space for appropriate screw holes in the gantry to mount the image projection systems; however, the adapter can accommodate different configurations of screw holes to permit mounting multiple image projection systems.
  • the adapter further permits movement of the image projection systems (e.g., articulation around the respective ball and/or vertical movement) for initial calibration of the photolithography system. Further, since the adapter is a separate component from the remainder of the photolithography system, ease of manufacturing can be improved.

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  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
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  • Environmental & Geological Engineering (AREA)
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Embodiments described herein generally provide an adapter that can permit installation of multiple image projection systems in a photolithography system. In an embodiment, an apparatus comprises a plate, brackets, and sockets. The brackets extend perpendicularly from the plate in directions parallel to a first direction. Respective lateral spacings are between neighboring pairs of the brackets. The sockets are mechanically coupled to the plate and extend in directions parallel to a second direction opposite from the directions parallel to the first direction. Each of the sockets is vertically aligned with a corresponding one of the lateral spacings. Each of the sockets has a depression configured to be engaged with a ball.

Description

ADAPTER FOR IMAGE PROJECTION SYSTEM INSTALLATION IN PHOTOLITHOGRAPHY SYSTEM
PRIORITY CLAIM
[0001] This application claims priority to Indian Patent Application 201841026438, entitled“Adapter for Image Projection System Installation in Photolithography system,” filed July 16, 2018, which is incorporated herein by reference in its entirety.
BACKGROUND
Field
[0002] Embodiments described herein generally relate to apparatuses and systems for processing one or more substrates, and more specifically to apparatuses and systems for performing photolithography processes.
Description of the Related Art
[0003] Photolithography is widely used in the manufacturing of semiconductor devices and display devices, such as liquid crystal displays (LCDs). Large area substrates are often utilized in the manufacture of LCDs. Conversely, smaller substrates, which are typically circular or at least partially circular, are used for manufacturing semiconductor devices or, in some cases, much smaller devices than typical LCDs. These devices, be it display devices or semiconductor devices, typically have small features that are precisely formed over the substrates.
[0004] Microlithography techniques have been employed to create features for forming features on substrates. According to these techniques, a light- sensitive photoresist is applied to at least one surface of the substrate. Then, a pattern generator exposes selected areas of the light-sensitive photoresist as part of a pattern with light to cause chemical changes to the photoresist in the selective areas to prepare these selective areas for subsequent material removal and/or material addition processes to create the electrical features. [0005] In order to continue to provide devices at the prices demanded by consumers, new apparatuses and approaches are needed to precisely and cost-effectively create patterns on substrates.
SUMMARY
[0006] Embodiments described herein generally provide an adapter that can permit installation of multiple image projection systems in a photolithography system. The adapter can permit movement of the image projection systems for initialization and calibration, as well as accommodate a small size of a gantry of the photolithography system that may otherwise prohibit installation of multiple image projection systems therein.
[0007] In an embodiment, an apparatus comprises a plate, first brackets, and sockets. The first brackets extend perpendicularly from the plate in directions parallel to a first direction. Respective lateral spacings are between neighboring pairs of the first brackets. The sockets are mechanically coupled to the plate and extend in directions parallel to a second direction opposite from the directions parallel to the first direction. Each of the sockets is vertically aligned with a corresponding one of the lateral spacings. Each of the sockets has a depression configured to be engaged with a ball.
[0008] In another embodiment, a system comprises a substrate stage, a gantry, an adapter, and image projection systems. The substrate stage is moveable under the gantry. The adapter is attached to the gantry. The adapter comprises a plate attached to a side surface of the gantry, first brackets extending from the plate and being disposed on an upper surface of the gantry, and sockets mechanically coupled to the plate. The image projection systems are operable to expose a substrate on the substrate stage to radiation. Each of the image projection systems comprises an articulation system attached to the upper surface of the gantry, and a ball engaging a respective one of the sockets.
[0009] Another embodiment is a method. An adapter is placed on a gantry of a photolithography system. The photolithography system comprises a substrate stage moveable under the gantry. A first lateral articulation system of a first image projection system is secured to the gantry. A first ball of the first image projection system engages a first socket of the adapter. After securing the first lateral articulation system, the adapter is secured to the gantry. A second lateral articulation system of a second image projection system is secured to the gantry. A second ball of the second image projection system engages a second socket of the adapter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.
[0011] Figure 1 is a perspective view of a photolithography system according to embodiments disclosed herein.
[0012] Figures 2 and 3 are perspective views of an adapter according to embodiments disclosed herein.
[0013] Figure 4 is a cross sectional view of the adapter on a gantry according to embodiments disclosed herein.
[0014] Figure 5 is a cross sectional view of an image projection system disposed on the adapter according to embodiments disclosed herein.
[0015] Figure 6 is a front view of the adapter mounted on the gantry, with a plurality of image projection systems mounted on the adapter, according to embodiments disclosed herein. [0016] Figure 7 illustrates a method of installing the adapter on the gantry and with the image projection systems according to embodiments disclosed herein.
[0017] To facilitate understanding, identical reference numerals have been used, wherever possible, to designate identical elements that are common to the Figures. Additionally, elements of one embodiment may be advantageously adapted for utilization in other embodiments described herein.
DETAILED DESCRIPTION
[0018] Embodiments described herein generally provide an adapter that can permit installation of multiple image projection systems in a photolithography system. The adapter can be secured to a gantry with multiple image projection systems installed thereon. The adapter includes multiple sockets, where each socket is configured to be engaged with a ball of a respective image projection system. Each image projection system includes a lateral articulation system that can be secured to the gantry. The lateral articulation system in conjunction with the ball engaging a socket of the adapter can permit the respective image projection system to articulate around the ball to enable initialization and calibration of the image projection system for subsequent processing (e.g., exposure of a photoresist on a substrate). The adapter can accommodate a small size of a gantry of the photolithography system that may otherwise prohibit installation of multiple image projection systems therein.
[0019] Figure 1 is a perspective view of a photolithography system 100 according to embodiments disclosed herein. The photolithography system 100 includes a slab 102 and a processing apparatus 104. In some embodiments, the slab 102 is a monolithic piece of granite or multiple pieces of granite. A stage 106 with tracks 108 is disposed on the slab 102. One or more substrates, generically shown and referred to as substrate 1 10, are supported by the stage 106. A plurality of holes (not shown) are in the stage 106 for allowing a plurality of lift pins (not shown) to extend therethrough. In some embodiments, the lift pins rise to an extended position to receive the substrate 1 10, such as from one or more transfer robots (not shown), and the lift pins may thereafter gently lower the substrate 1 10 onto the stage 106. The one or more transfer robots are used to load and unload a substrate 1 10 from the stage 106.
[0020] The substrate 1 10 may comprise any suitable material, for example, quartz, glass, or semiconductor material, which may be used as part of a flat panel display or semiconductor device. In other embodiments, the substrate 1 10 is made of other materials. In some embodiments, the substrate 1 10 has a photoresist layer formed thereon. A photoresist is sensitive to radiation. For a positive photoresist, portions of the positive photoresist exposed to radiation will be soluble to a photoresist developer applied to the photoresist after the exposure. For a negative photoresist, portions of the negative photoresist exposed to radiation will be insoluble to a photoresist developer applied to the photoresist after the exposure. The chemical composition of the photoresist determines whether the photoresist will be a positive photoresist or negative photoresist. Examples of photoresists include, but are not limited to, at least one of diazonaphthoquinone, a phenol formaldehyde resin, poly(methyl methacrylate), poly(methyl glutarimide), and SU-8. Processing using a patterned and developed photoresist can form at least part of the electronic circuitry on the substrate 1 10.
[0021] The tracks 108 are disposed on the slab 102 and support the stage 106. The stage 106 moves along the tracks 108 in a direction 1 12. In an embodiment, the tracks 108 are a pair of parallel magnetic channels. As shown, each track 108 is linear. In other embodiments, one or more tracks 108 can be non-linear. An encoder 1 14 is coupled to the stage 106 in order to provide information regarding the location of the stage 106 to a controller 1 16. The controller 1 16 is generally designed to facilitate the control and automation of processing techniques. The controller 1 16 may be coupled to or in communication with the processing apparatus 104, the stage 106, and the encoder 1 14. The processing apparatus 104 and the encoder 1 14 may provide information to the controller 1 16 regarding the substrate processing and the substrate aligning. For example, the processing apparatus 104 may provide information to the controller 1 16 to alert the controller 1 16 that substrate processing has been completed.
[0022] The processing apparatus 104 includes a gantry 120 and a processing unit 122. The gantry 120 is disposed on and is supported by the slab 102. The gantry 120 can include one or more pieces of granite. The processing unit 122 is supported by the gantry 120. An opening 124 is formed between the gantry 120 and the slab 102 for the stage 106 to pass under the processing unit 122 (e.g., by movement along direction 1 12). In an embodiment, the processing unit 122 is generally a pattern generator configured to expose a photoresist in a photolithography process. In some embodiments, the pattern generator is configured to perform a maskless lithography process. The processing unit 122 includes a plurality of image projection systems 126. The image projection systems 126 can be disposed on the gantry 120 and one or more adapters 128, which will be detailed further herein. In the illustration of Figure 1 , six image projection systems 126 are supported by the gantry 120, although in other examples, any number of image projection systems 126 may be implemented in the processing unit 122. The processing apparatus 104 may be used to perform maskless direct patterning to photoresist or other electromagnetic radiation sensitive material.
[0023] During operation, the stage 106 moves in the direction 1 12 from a loading position (shown in Figure 1 ) to a processing position. The processing position is one or more positions of the stage 106 as the stage 106 passes under the processing unit 122 and through the opening 124. The stage 106 can also move in a direction perpendicular to the direction 1 12 by moving along another track for processing and/or indexing the substrate 1 10. The stage 106 is capable of independent operation and can scan a substrate 1 10 in one direction and step in the other direction.
[0024] The following figures and description provide an example adapter 128 that can be implemented to install three image projection systems 126 on the gantry 120. In other examples, an adapter may be implemented to install any number of image projection systems 126 on the gantry 120. A person having ordinary skill in the art will readily understand modifications to the example adapter 128 detailed below and in the figures to implement an adapter for other numbers of image projection systems 126 (e.g., by replicating parts in the pattern apparent to a person having ordinary skill in the art).
[0025] Figures 2 and 3 illustrate perspective views of the adapter 128 according to embodiments disclosed herein. The perspective view of Figure 3 is partially exploded to illustrate aspects therein. Figures 2 and 3 (and following figures) include X, Y, and Z axes as references between the figures. The adapter 128 can be formed of a rigid material, such as a metal like stainless steel (e.g., ATSM A240 Type 440C). The adapter 128 can be a single, integral component, or can include multiple mechanically attached, but separable, components. Additionally, reference to any bolt or screw in the following description may be understood to additionally reference any fastener, such as a bolt, screw, rivet, or the like.
[0026] The adapter 128 includes a plate 202. Upper brackets 204 extend perpendicularly from the plate 202 (e.g., in a -X direction) at respective upper locations of the plate 202. In the illustrated example, the upper brackets 204 are integral to the plate 202, although the upper brackets 204 may be separable from the plate 202 in other examples. A spacing is between neighboring pairs of the upper brackets 204 (e.g., in a +/-Y direction) where an image projection system 126 will be disposed, as described subsequently.
[0027] Lower extensions 206 extend from and below the plate 202 in a substantially same plane as the plate 202. In the illustrated example, the lower extensions 206 are integral to the plate 202, although the lower extensions 206 may be separable from the plate 202 in other examples. Each of the lower extensions 206 generally vertically aligns with a corresponding spacing between a neighboring pair of the upper brackets 204. In the illustrated example, individual lower extensions 206 are shown. In other examples, the lower extensions 206 may be omitted, and the plate 202 may extend further vertically in the place of the lower extensions 206. Other modifications may be implemented.
[0028] Sockets 208 are attached to the lower extensions 206. Each of the sockets 208 is generally vertically aligned with a corresponding spacing between a neighboring pair of the upper brackets 204. The sockets 208 extend from the lower extensions 206 in an opposite direction of the extending of the upper brackets 204 from the plate 202. For example, the sockets 208 extend in a +X direction from the lower extensions 206, while the upper brackets 204 extend in a -X direction from the plate 202. Each of the sockets 208 has a depression 210 in an upper portion of the respective socket 208 into which a ball of an image projection system 126 will be disposed, as described subsequently. The depression 210 can be a partial-spherical surface that generally corresponds to the surface of the ball of the image projection system 126 that will engage the depression 210. For each socket 208, one or more bolts 212, with or without additional washers and/or lock washers, can be inserted into holes through a respective lower extension 206 and screwed into a threaded hole in the socket 208 to attach the socket 208 to the lower extension 206. The socket 208 can further include pins 214 that can be inserted into holes through the respective lower extension 206 to align holes for attaching the socket 208 with the bolts 212. In the illustrated example, the sockets 208 are separable, although the sockets 208 may be integral to the lower extensions 206 in other examples. Further, a person having ordinary skill in the art will readily understand modifications to the illustrated example if lower extensions 206 are omitted.
[0029] Lower brackets 220 are attached to the lower extensions 206 and extend from the lower extensions 206 in a same direction that the upper brackets 204 extend from the plate 202 (e.g., in a -X direction). Each of the lower brackets 220 includes a parallel member 222 (e.g., parallel to the upper brackets 204) and a supporting member 224. For each lower bracket 220, a bolt 226 (or multiple bolts), with or without additional washers 230 and/or lock washers 228, can be inserted into a hole(s) through the parallel member 222 and screwed into a threaded hole in the supporting member 224 to attach the parallel member 222 to the supporting member 224. The supporting member 224 can further include pins 232 that can be inserted into holes through the parallel member 222 to align holes for attaching the parallel member 222 with the bolt 226. Similarly, a bolt 236 (or multiple bolts), with or without additional washers 240 and/or lock washers 238, can be inserted into a hole(s) through the corresponding lower extension 206 and screwed into a threaded hole in the supporting member 224 to attach the supporting member 224 to the lower extension 206. The supporting member 224 can further include pins 242 that can be inserted into holes through the lower extension 206 to align holes for attaching the supporting member 224 with the bolt 236. Although the lower brackets 220 in the illustrated example have various separable parts and are separable from the lower extensions 206, the lower brackets 220 may be a single, integral component or may include more parts, and one or more components of the lower brackets 220 can be integral to the respective lower extension 206.
[0030] Ribs 250 are on a side of the plate 202 from which the upper brackets 204 extend, for example. As will become apparent subsequently, the adapter 128 is to be mounted on and attached to a gantry 120. The ribs 250 are to contact the gantry 120 and can reduce the surface area where the adapter 128 contacts the gantry 120. Generally, a rib 250 is along an upper portion of the plate 202 running laterally (e.g., in a +/-Y direction) across the plate 202, and a rib 250 is along a lower portion of the plate 202 running laterally across the plate 202. Holes 252 are through the plate 202 and ribs 250 for inserting bolts therethrough to attach the adapter 128 to the gantry 120. A pair of holes 252 is generally vertically aligned to each other and to a corresponding upper bracket 204.
[0031] Figure 4 illustrates a cross sectional view of the adapter 128 on the gantry 120 according to embodiments disclosed herein. The adapter 128 is attached to the gantry 120 with the ribs 250 contacting a side surface of the gantry 120 and the upper brackets 204 contacting an upper surface of the gantry 120. Hence, the gantry 120 can be disposed between the upper brackets 204 and the lower brackets 220. In some examples, the upper brackets 204 can be load bearing. In some examples, a spacing is between a lower surface of the gantry 120 and the parallel member 222 of the lower bracket 220. Further, in some examples, one or more shims 402 may be inserted between the parallel member 222 and the lower surface of the gantry 120 to further secure the adapter 128 to the gantry 120 and/or to reduce vibrations of the adapter 128 during subsequent processing. Bolts (not illustrated) are inserted through the holes 252 (not shown in Figure 4) and are screwed into respective threaded holes in the side surface of the gantry 120.
[0032] Figure 5 illustrates a cross sectional view of an image projection system 126 disposed on the adapter 128 according to embodiments disclosed herein. The image projection system 126 includes various light modulators and other optical components (such as a lens 502), as a person having ordinary skill in the art will readily understand. The light modulators and/or other optical components in the image projection system 126 are configured to emit radiation through an emission port 504 to a substrate 1 10.
[0033] The image projection system 126 includes a ball 506 that engages the depression 210 of the socket 208. The ball 506 can be a stainless steel ball. The ball 506 being engaged with the depression 210 permits the image projection system 126 to be articulated around the ball 506 (e.g., tilted in +/-X and/or +/-Y directions).
[0034] The image projection system 126 includes a lateral articulation system 508 and a vertical lift system 510. The lateral articulation system 508 is attached to the remainder of the image projection system 126 by a joint 512. The lateral articulation system 508 can include any number of actuators, such as a screw actuator or the like, that can laterally move the joint 512 (e.g., in +/-X and/or +/-Y directions). The joint 512 can be any hinged apparatus or the like. By laterally moving the joint 512, the image projection system 126 can articulate around the ball 506 to thereby rotate the direction of the radiation that is to be emitted from the emission port 504. [0035] The vertical lift system 510 similarly can include any number of actuators, such as a screw actuator or the like, that can vertically move light modulators and other optical components (e.g., in a +/-Z direction). By moving the optical components vertically, pattern feature sizes to be formed in a photoresist on a substrate and/or a focus can be adjusted. The articulation of the image projection system 126 around the ball 506 and/or the vertical movement of components of the image projection system 126 can enable initialization and calibration of the image projection system 126, once installed on the gantry as described in further detail below, for subsequent processing of a substrate (e.g., exposure of the substrate to radiation from the image projection system 126).
[0036] The lateral articulation system 508 can further include an adapter plate 514 that is to be attached to the gantry 120. The adapter plate 514 can further include pins 516 that can be inserted into holes in the gantry 120 to align other holes in the adapter plate 514 and the gantry 120. Bolts can be inserted through the holes through the adapter plate 514 and screwed into a threaded hole in the gantry 120 to attach the adapter plate 514 to the gantry 120.
[0037] Figure 6 illustrates a front view of the adapter 128 mounted on the gantry 120, with a plurality of image projection systems 126 mounted on the adapter 128, according to embodiments disclosed herein. Figure 7 illustrates a method 700 of installing the adapter 128 on the gantry 120 and with the image projection systems 126 according to embodiments disclosed herein. Figure 6 will be described in the context of the method 700 of Figure 7. Although the method 700 is described in a particular order, other example methods can be performed in other orders, including serial or parallel performance of various operations, with additional operations and/or without various operations described herein.
[0038] In operation 702, the adapter 128 is placed on the gantry 120. The adapter 128 can be placed on the gantry 120 without securing the adapter 128 to the gantry 120, such as without attaching the adapter 128 to the gantry 120 with bolts. The adapter 128 can be generally placed on the gantry 120 in a location where the adapter 128 will subsequently be secured to the gantry 120. The upper brackets 204 can be placed on the upper surface of the gantry 120, and the ribs 250 can contact the side surface of the gantry 120, as illustrated in and described with respect to Figure 4.
[0039] In operation 704, a lateral articulation system 508a of a first image projection system 126a is placed on the gantry 120. In some embodiments, any image projection system 126 that is to be installed on the adapter 128 can be selected as the first image projection system 126 to install. In some embodiments, an image projection system 126 to be installed in a lateral-most position (e.g., the furthest position in the +Y direction or in the -Y direction) on the adapter 128 is selected as the first image projection system 126. In the illustration of Figure 6, the first image projection system 126a (shown in phantom in Figure 6 for clarity) is selected to be installed first. Hence, the lateral articulation system 508a of the first image projection system 126a is placed on the upper surface of the gantry 120. Pins 516 in the lateral articulation system 508a can be used to insert into holes in the upper surface of the gantry 120 for proper placement of the lateral articulation system 508a.
[0040] In operation 706, the lateral articulation system 508a of the first image projection system 126a is aligned with the adapter 128. A first datum 602a can be inserted between a side surface of the lateral articulation system 508a and a nearest upper bracket 204. The first datum 602a can be abutted to the side surface of the lateral articulation system 508a and abutted to the upper bracket 204.
[0041] In operation 708, the first image projection system 126a is secured to the gantry 120 and installed on the adapter 128. Bolts can be used to secure the lateral articulation system 508a (e.g., the adapter plate 514) to the upper surface of the gantry 120. A ball 506a of the first image projection system 126a is further inserted into the depression 210 of the corresponding socket 208 to engage the socket 208. By engaging the ball 506a to the socket 208 and securing the lateral articulation system 508a to the upper surface of the gantry 120, the first image projection system 126a is secured and installed.
[0042] In operation 710, the adapter 128 is secured to the gantry 120. With the adapter 128 aligned with the lateral articulation system 508a using the first datum 602a, the adapter 128 is secured to the gantry 120 using bolts through the holes 252 through the plate 202 of the adapter 128. Hence, the adapter 128 can be secured to the side surface of the gantry 120.
[0043] In operation 712, a lateral articulation system 508b of an additional image projection system 126b is placed on the gantry 120, similar to operation 704 described above. Pins 516 may be omitted in placing the lateral articulation system 508b for the additional image projection system 126b. In operation 714, the lateral articulation system 508b of the additional image projection system 126b is aligned with the adapter 128, such as with an additional datum 602b, similar to operation 706. In operation 716, the additional image projection system 126b (including a ball 506b) is secured to the gantry 120 and installed on the adapter 128, similar to operation 708. Any further image projection system 126 can be secured to the gantry 120 and installed on the adapter 128 by repeating operations 712, 714, and 716. For example, another image projection system 126c (including a lateral articulation system 508c and ball 506c) can be placed, aligned (e.g., using a third datum 602c), and secured on the gantry 120 and installed on the adapter 128. The datums 602a, 602b, and 602c can be removed after installation of the image projection systems 126.
[0044] In operation 718, a shim 402 is inserted between a lower bracket 220 of the adapter 128 and the lower surface of the gantry 120. One or more shims 402 can be inserted between each lower bracket 220 of the adapter 128 and the lower surface of the gantry 120, such as illustrated in Figure 4. The shim(s) 402 can reduce vibrations during subsequent processing.
[0045] As illustrated by examples provided herein, the adapter permits the installation of multiple image projection systems on a gantry. For example, a reduction in size by the gantry may not permit sufficient space for appropriate screw holes in the gantry to mount the image projection systems; however, the adapter can accommodate different configurations of screw holes to permit mounting multiple image projection systems. The adapter further permits movement of the image projection systems (e.g., articulation around the respective ball and/or vertical movement) for initial calibration of the photolithography system. Further, since the adapter is a separate component from the remainder of the photolithography system, ease of manufacturing can be improved.
[0046] While the foregoing is directed to examples of the present disclosure, other and further examples of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

What is claimed is:
1. An apparatus for use in a lithography system, the apparatus comprising:
a plate;
first brackets extending perpendicularly from the plate in directions parallel to a first direction, respective lateral spacings being between neighboring pairs of the first brackets; and
sockets mechanically coupled to the plate and extending in directions parallel to a second direction opposite from the directions parallel to the first direction, each of the sockets being vertically aligned with a corresponding one of the lateral spacings, each of the sockets having a depression configured to be engaged with a ball.
2. The apparatus of claim 1 , further comprising extensions extending from the plate in a same plane of the plate, each of the sockets being mechanically attached to a respective one of the extensions.
3. The apparatus of claim 2, further comprising second brackets each extending perpendicularly from a respective one of the extensions in a direction parallel to the first direction, the plate being disposed between the first brackets and the second brackets.
4. The apparatus of claim 1 , further comprising second brackets each extending in a direction parallel to the first direction, the plate being disposed between the first brackets and the second brackets.
5. The apparatus of claim 1 , further comprising ribs laterally across the plate, the ribs being on a same side of the plate from which the first brackets extend.
6. The apparatus of claim 1 , wherein holes are through the plate.
7. The apparatus of claim 1 , further comprising: a gantry, wherein the plate is secured to a side surface of the gantry, and the first brackets are on an upper surface of the gantry; and
image projection systems each comprising:
a lateral articulation system attached to the gantry in a respective one of the lateral spacings; and
a ball engaging the depression of a respective one of the sockets.
8. A system, comprising:
a substrate stage;
a gantry, the substrate stage being moveable under the gantry;
an adapter attached to the gantry, the adapter comprising:
a plate attached to a side surface of the gantry;
first brackets extending from the plate and being disposed on an upper surface of the gantry; and
sockets mechanically coupled to the plate; and
image projection systems operable to expose a substrate on the substrate stage to radiation, each of the image projection systems comprising:
an articulation system attached to the upper surface of the gantry; and a ball engaging a respective one of the sockets.
9. The system of claim 8, wherein the adapter further comprises second brackets, the gantry being disposed between the first brackets and the second brackets.
10. The system of claim 9, further comprising a shim disposed between at least one of the second brackets and a lower surface of the gantry.
1 1 . The system of claim 8, wherein the adapter further comprises extensions extending from the plate in a same plane as the plate, each of the sockets being mechanically attached to a respective one of the extensions.
12. The system of claim 1 1 , wherein the adapter further comprises second brackets, each of the second brackets being mechanically attached to a respective one of the extensions, the gantry being disposed between the first brackets and the second brackets.
13. The system of claim 8, wherein the articulation system of each of the image projection systems is attached to the upper surface of the gantry between neighboring pairs of the first brackets.
14. The system of claim 8, wherein the adapter comprises at least three of the sockets mechanically coupled to the plate.
15. A method, comprising:
placing an adapter on a gantry of a photolithography system, the photolithography system comprising a substrate stage moveable under the gantry; securing a first lateral articulation system of a first image projection system to the gantry, a first ball of the first image projection system engaging a first socket of the adapter;
after securing the first lateral articulation system, securing the adapter to the gantry; and
securing a second lateral articulation system of a second image projection system to the gantry, a second ball of the second image projection system engaging a second socket of the adapter.
PCT/US2019/024091 2018-07-16 2019-03-26 Adapter for image projection system installation in photolithography system WO2020018153A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008298845A (en) * 2007-05-29 2008-12-11 Dainippon Screen Mfg Co Ltd Drawing device
US20090304916A1 (en) * 2006-04-21 2009-12-10 Sharp Kabushiki Kaisha Defect Repairing Apparatus, Defect Repairing Method, Program, and Computer-Readable Recording Medium
KR20120120670A (en) * 2011-04-25 2012-11-02 위아코퍼레이션 주식회사 Selective thin film removeing device using splitted laser beam
KR101688958B1 (en) * 2014-06-30 2017-01-03 세메스 주식회사 Head assembly and Apparatus for treating substrate with the assembly
US20180024441A1 (en) * 2016-07-22 2018-01-25 Applied Materials, Inc. Twisted kaleido

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090304916A1 (en) * 2006-04-21 2009-12-10 Sharp Kabushiki Kaisha Defect Repairing Apparatus, Defect Repairing Method, Program, and Computer-Readable Recording Medium
JP2008298845A (en) * 2007-05-29 2008-12-11 Dainippon Screen Mfg Co Ltd Drawing device
KR20120120670A (en) * 2011-04-25 2012-11-02 위아코퍼레이션 주식회사 Selective thin film removeing device using splitted laser beam
KR101688958B1 (en) * 2014-06-30 2017-01-03 세메스 주식회사 Head assembly and Apparatus for treating substrate with the assembly
US20180024441A1 (en) * 2016-07-22 2018-01-25 Applied Materials, Inc. Twisted kaleido

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