WO2020016010A1 - Dispositif pour la production de connexions soudées sur des vitres et procédé correspondant - Google Patents

Dispositif pour la production de connexions soudées sur des vitres et procédé correspondant Download PDF

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Publication number
WO2020016010A1
WO2020016010A1 PCT/EP2019/067817 EP2019067817W WO2020016010A1 WO 2020016010 A1 WO2020016010 A1 WO 2020016010A1 EP 2019067817 W EP2019067817 W EP 2019067817W WO 2020016010 A1 WO2020016010 A1 WO 2020016010A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
soldered
contact electrode
conductive layer
areas
Prior art date
Application number
PCT/EP2019/067817
Other languages
German (de)
English (en)
Inventor
Hadi RASTEGAR
Katja Werner
Bernhard Reul
Mitja Rateiczak
Original Assignee
Saint-Gobain Glass France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint-Gobain Glass France filed Critical Saint-Gobain Glass France
Priority to CN201980001552.5A priority Critical patent/CN110945966A/zh
Publication of WO2020016010A1 publication Critical patent/WO2020016010A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0471—Heating appliances electric using resistance rod or bar, e.g. carbon silica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0214—Resistance welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Definitions

  • the invention relates to a device for producing soldered connections on glass panes and a method therefor.
  • These electrically conductive layers generally have to be connected to a control and / or power supply by means of cables.
  • contacts are applied at a suitable point.
  • the object is achieved by a device for producing soldered connections on glass panes.
  • the glass pane has an electrically conductive layer on the surface at the points to be soldered, a contact to be attached to the point to be soldered having at least two partial regions to be soldered, which are spaced apart but electrically connected to one another, at the points to be soldered between the conductive part Layer is introduced on the surface and the two contact areas of solder material.
  • the device has a first contact electrode for contacting the first partial area and a second contact electrode for contacting the second partial area, wherein for soldering by means of the first contact electrode and the second contact electrode via the electrical connection of the first partial area and the second partial area, the contact is provided by applying a voltage for resistance soldering, so that the solder material is located under the two contact areas is indirectly provided for melting, a nozzle being provided in the space between the first contact electrode and the second contact electrode, which nozzle is provided for the valve-controlled delivery of a cooling medium, so that the surface of the contact to be attached is directly cooled and the solder material between the partial regions and the conductive layer is cooled indirectly wherein the nozzle is at a distance relative to the plane of the ends of the two contact areas of its outflow opening.
  • the cooling medium is gaseous.
  • Gaseous cooling media are particularly easy to control and are often available at low cost.
  • the cooling medium is air.
  • Compressed air systems are available in many companies and are sometimes also used in previous manufacturing devices e.g. used to position contacts using pneumatically operated units.
  • a method for producing soldered connections on glass panes is provided by means of one of the above-mentioned devices.
  • the method comprises a step of obtaining a glass sheet with an electrically conductive layer and the step of obtaining electrical contact for electrical connection to the conductive layer.
  • a contact to be attached at the point to be soldered has at least two partial areas to be soldered, which are spaced apart but electrically connected to one another, at the points to be soldered between the conductive layer on the surface and the two contact areas, solder material (L) is introduced.
  • the electrical contact is arranged relative to the glass pane at the points to be soldered and then at least the point to be soldered of the arranged contact is applied by applying a voltage heated between a first contact electrode for contacting the first partial area and a second contact electrode for contacting the second partial area, so that the melting point of a solder material is reached at the point to be soldered under the two contact areas at least on the surface.
  • the points to be soldered are then actively cooled in a further step, a nozzle being arranged in the space between the first contact electrode and the second contact electrode, the nozzle having its outflow opening at a distance relative to the plane of the ends of the two contact regions, so that the surface of the contact to be attached can be cooled directly and the solder material between the partial areas and the conductive layer can be cooled indirectly.
  • the active cooling takes place by means of a gas stream.
  • Gaseous cooling media are particularly easy to control and are often available at low cost.
  • the melting point of the solder material is less than 200 ° C.
  • Low-melting solder materials can be heated with less energy. This makes it possible to reduce cycle times and energy consumption. As a result, the production speed can be increased and the costs reduced.
  • the active cooling step lasts 4 seconds or less. This means that the cycle times can be greatly reduced compared to the prior art.
  • the step of active cooling takes place by means of an air stream.
  • Compressed air systems are available in many companies and are sometimes also used in previous manufacturing devices e.g. used to position contacts using pneumatically operated units.
  • the solder material has indium.
  • Indium is a comparatively low-melting metal, so that energy consumption can be reduced.
  • the temperature at the solder joint is measured by measuring the resistance of the electrical contact between the two sub-areas.
  • the object is also achieved by a glass pane obtained by a method according to the invention or the use of such a glass pane in a vehicle.
  • Fig. 2 is a schematic representation of a contact for use with the invention
  • Fig. 3 is a schematic flow chart according to embodiments of the invention.
  • references to standards or specifications or norms are to be understood as references to standards or specifications or norms that apply / apply at the time of registration and / or - if priority is claimed - at the time of priority registration. However, this is not to be understood as a general exclusion of the applicability to subsequent or replacing standards or specifications or norms.
  • FIG. 1 elements of the invention are shown schematically in connection with a glass pane GS.
  • the glass pane GS has an electrically conductive layer AG on the surface at points to be soldered.
  • the surface can also be a recess.
  • the electrically conductive layer AG can have a wide variety of materials, e.g. Copper and / or silver.
  • the electrically conductive layer AG can be arranged on a base layer and / or a black print DS or the like, so that any number of (functional) intermediate layers can be arranged between the electrically conductive layer AG and the glass pane GS underneath.
  • the contact K to be attached has at least two partial areas KB1, KB2 to be soldered, which are shown in FIG. 2. 2 thus represents a (two-legged) contact K from FIG. 1.
  • first section KB1 and the second section KB2 e.g. can be integrally formed from a suitable material, they are also electrically connected. That A resistance can be measured between the two partial areas KB1, KB2. This resistance is usually temperature-dependent.
  • solder material L is introduced (in sections) between the conductive layer AG on the surface and the two contact areas KB1, KB2.
  • the solder material can also extend over a larger area, for example occupy the entire area under the contact K.
  • the solder material L preferably also provides an electrical connection of the corresponding subregions.
  • the device 1 for producing soldered connections on glass panes GS now has a first contact electrode KE1 for contacting the first partial area KB1 and a second contact electrode KE2 for contacting the second partial area KB2.
  • a voltage for resistance soldering can be applied via the electrical connection of the first partial area KB1 and the second partial area KB2, so that the solder material L under the two contact areas KB1, KB2 is caused indirectly by the self-heating due to of the current flow through the solder material L and / or through external heating due to the current flow through the partial areas KB1, KB2 of the contact K is provided for melting.
  • a nozzle D is attached, which is provided for the valve-controlled delivery of a cooling medium, so that the surface of the contact K to be attached is directly and the solder material L between the partial areas KB1, KB2 and the conductive layer AG can be cooled indirectly.
  • the outflow opening of the nozzle D is arranged at a distance d relative to the plane of the ends of the two contact areas KB1, KB2. That the cooling medium can flow past the surface of the contact K. Since the solder joint (s) lies between the contact K and the electrically conductive layer, no negative influence is to be expected, since no liquefied solder can be entrained by the flow of the cooling medium. That the flow of the cooling medium specifically cools the contact K and the immediate vicinity. That essentially only the heated areas are cooled.
  • the cooling medium is gaseous. Gaseous cooling media are particularly easy to control and are often available at low cost.
  • the cooling medium is air.
  • Compressed air systems are available in many companies and are sometimes also used in previous manufacturing devices e.g. used to position contacts using pneumatically operated units. That existing infrastructure can be used inexpensively.
  • the device can be used in a method according to the invention. The method will be explained in more detail with reference to FIG. 3.
  • the method has a step 100 in which a glass pane GS with an electrically conductive layer is obtained.
  • a step 200 downstream / upstream / simultaneous step 200 an electrical contact K for electrical connection to the conductive layer AG is obtained.
  • a contact K to be attached at the point to be soldered has at least two partial areas KB1, KB2 to be soldered, which are spaced but electrically connected to one another, at the points to be soldered between the conductive layer on the surface and the two contact areas KB1, KB2 solder material L. is introduced.
  • the electrical contact K thus obtained and the glass pane GS thus obtained are arranged with respect to one another in a step 300, so that the partial areas KB1, KB2 of the contact K are arranged at the points to be soldered.
  • the point of the arranged electrical contact K to be soldered is then heated in a step 400 by applying a voltage between a first contact electrode KE1 for contacting the first partial area KB1 and a second contact electrode KE2 for contacting the second partial area KB2, so that the melting point of a solder material L. the spot (s) to be soldered is reached at least on the surface under the two contact areas KB1, KB2.
  • the device 1 is in contact as described above brought with the sub-areas KB1, KB2 of the contact K and voltage applied to the contact (and, if applicable, to the solder material L).
  • the point (s) to be soldered is then actively cooled in step 500, a nozzle D being arranged in the space between the first contact electrode KE1 and the second contact electrode KE2, the nozzle D being at a distance d relative to
  • the plane of the ends of the two contact areas KB1, KB2 has its outflow opening so that the surface of the contact K to be attached can be cooled directly and the solder material L can be cooled indirectly between the partial areas KB1, KB2 and the conductive layer AG.
  • Steps 400, 500 can run in a time-controlled manner. Alternatively or additionally, it is possible to alternatively control the steps by measurement or to create an execution criterion.
  • the active cooling takes place by means of a gas stream.
  • Gaseous cooling media are particularly easy to control and are often available at low cost.
  • the melting point of the solder material is less than 200 ° C.
  • Low-melting solder materials can be heated with less energy. This makes it possible to reduce cycle times and energy consumption. As a result, the production speed can be increased and the costs reduced.
  • the active cooling step lasts 4 seconds or less. This means that the cycle times can be greatly reduced compared to the prior art.
  • the step of active cooling takes place by means of an air stream.
  • Compressed air systems are available in many companies and are sometimes also used in previous manufacturing devices e.g. used to position contacts using pneumatically operated units.
  • the solder material L has indium.
  • Indium is a comparatively low-melting metal, so that energy consumption can be reduced.
  • the temperature at the solder joint is measured by measuring the resistance of the electrical contact K between the two sub-areas.
  • the resistance of the contact K between the two partial areas KB1, KB2 can be measured before / after / during the arrangement of the contact K on the glass pane GS.
  • the resistance of the solder material L under the contact K is also determined. This can e.g. the resistance can be determined at a known “ambient temperature”.
  • the resistance during heating or cooling can also be determined in steps 450 and 550.
  • the temperature measured at the soldering point can be determined using the resistance now measured (under certain circumstances taking into account the measured resistance with a known “ambient temperature”). It can then be compared whether a specific target temperature for melting / solidifying the solder material L has been reached. If so, so can proceed according to the arrows "Yes”. If this is not the case, heating 400 or cooling 500 can be continued.
  • a glass pane obtained by a method according to the invention or the use of such a glass pane in a vehicle, in particular a land vehicle, such as, for example, cars, buses, trucks, work machines, trains, trams, sea vehicles, such as ships, ferries, Submersible boats, aircraft, such as planes, helicopters, space shuttles.
  • a land vehicle such as, for example, cars, buses, trucks, work machines, trains, trams, sea vehicles, such as ships, ferries, Submersible boats, aircraft, such as planes, helicopters, space shuttles.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Joining Of Glass To Other Materials (AREA)

Abstract

L'invention concerne un dispositif (1) pour la production de connexions soudées sur des vitres (GS), • la vitre (GS) comprenant, aux emplacements devant etre soudés, une couche électriquement conductrice (AG) sur la surface, le contact devant être posé à l'emplacement devant être soudé comprenant au moins deux zones partielles (KB1, KB2) devant être soudées, lesquelles sont espacées mais connectées électriquement l'une à l'autre, un matériau de brasage (L) étant introduit à l'emplacement devant être soudé entre la couche conductrice sur la surface et les deux zones de contact (KB1, KB2), • le dispositif comprenant une première électrode de contact (KE1) pour la mise en contact de la première zone partielle (KB1), et • le dispositif comprenant une deuxième électrode de contact (KE2) pour la mise en contact de la deuxième zone partielle (KB2), • le contact pour le soudage étant prévu par l'application d'une tension pour le brasage par résistance au moyen de la première électrode de contact (KE1) et de la deuxième électrode de contact (KE2) à travers la connexion électrique de la première zone partielle (KB1) et de la deuxième zone partielle (KB2), de sorte que la fusion de manière indirecte du matériau de brasage (L) en dessous des deux zones de contact (KB1, KB2) soit prévue, • une buse (D) étant montée dans l'espace entre la première électrode de contact (KE1) et la deuxième électrode de contact (KE2), laquelle est prévue pour l'émission contrôlée par soupape d'un liquide de refroidissement, de sorte que la surface du contact (K) à monter puisse être refroidie directement et le matériau de brasage (L) entre les zones partielles (KB1, KB2) et la couche conductrice (AG) puisse être refroidi indirectement, • la buse(D) comprenant son ouverture de décharge à une distance (d) par rapport au plan des extrémités des deux zones de contact (KB1, KB2). L'invention concerne en outre un procédé correspondant.
PCT/EP2019/067817 2018-07-20 2019-07-03 Dispositif pour la production de connexions soudées sur des vitres et procédé correspondant WO2020016010A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201980001552.5A CN110945966A (zh) 2018-07-20 2019-07-03 用于在玻璃板上制造焊接连接的设备以及对此的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP18184646 2018-07-20
EP18184646.0 2018-07-20

Publications (1)

Publication Number Publication Date
WO2020016010A1 true WO2020016010A1 (fr) 2020-01-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/067817 WO2020016010A1 (fr) 2018-07-20 2019-07-03 Dispositif pour la production de connexions soudées sur des vitres et procédé correspondant

Country Status (2)

Country Link
CN (1) CN110945966A (fr)
WO (1) WO2020016010A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5134248A (en) * 1990-08-15 1992-07-28 Advanced Temperature Devices, Inc. Thin film flexible electrical connector
US20090233119A1 (en) 2006-03-24 2009-09-17 Pikington Group Limited Electrical connector
CN103990882A (zh) 2014-05-08 2014-08-20 福耀玻璃工业集团股份有限公司 一种将天线接头焊接到汽车玻璃上的装置和方法
DE202014010271U1 (de) * 2013-10-29 2015-03-05 Saint-Gobain Glass France Scheibe mit mindestens zwei elektrischen Anschlusselementen und Verbindungsleiter
WO2017198073A1 (fr) * 2016-05-20 2017-11-23 Saint-Gobain Glass France Procédé de brasage résistif, ensemble antenne et verre, et système de brasage résistif
WO2017198703A1 (fr) 2016-05-17 2017-11-23 Carl Zeiss Vision International Gmbh Verre de lunettes et procédé de calcul et de fabrication d'un verre de lunettes
DE102016219224A1 (de) * 2016-10-05 2018-04-05 Bayerische Motoren Werke Aktiengesellschaft Verfahren und Widerstandslötvorrichtung zum Verlöten eines Stromanschlusselements auf einer Fahrzeugscheibe

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5134248A (en) * 1990-08-15 1992-07-28 Advanced Temperature Devices, Inc. Thin film flexible electrical connector
US20090233119A1 (en) 2006-03-24 2009-09-17 Pikington Group Limited Electrical connector
DE202014010271U1 (de) * 2013-10-29 2015-03-05 Saint-Gobain Glass France Scheibe mit mindestens zwei elektrischen Anschlusselementen und Verbindungsleiter
CN103990882A (zh) 2014-05-08 2014-08-20 福耀玻璃工业集团股份有限公司 一种将天线接头焊接到汽车玻璃上的装置和方法
CN103990882B (zh) * 2014-05-08 2016-01-20 福耀玻璃工业集团股份有限公司 一种将天线接头焊接到汽车玻璃上的装置和方法
WO2017198703A1 (fr) 2016-05-17 2017-11-23 Carl Zeiss Vision International Gmbh Verre de lunettes et procédé de calcul et de fabrication d'un verre de lunettes
WO2017198073A1 (fr) * 2016-05-20 2017-11-23 Saint-Gobain Glass France Procédé de brasage résistif, ensemble antenne et verre, et système de brasage résistif
DE102016219224A1 (de) * 2016-10-05 2018-04-05 Bayerische Motoren Werke Aktiengesellschaft Verfahren und Widerstandslötvorrichtung zum Verlöten eines Stromanschlusselements auf einer Fahrzeugscheibe

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Publication number Publication date
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